THS6093CD


           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 D Remote Terminal ADSL Line Driver D D D D D High Speed − Ideal for Both Full Rate ADSL and G.Lite − Compatible With 1:2 Transformer Ratio Wide Supply Voltage Range +5 V to +14 V − Ideal for Single Supply +12-V Operation Low 2.1 pA/√Hz Noninverting Current Noise − Reduces Noise Feedback Through Hybrid Into Downstream Channel Wide Output Swing − 18.4 Vpp Differential Output Voltage, RL = 50 Ω, 12-V Single Supply High Output Current − 275 mA (typ) D D D D D THS6092 SOIC (D) AND SOIC PowerPAD (DDA) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− 1 8 2 7 3 6 4 5 − 100 MHz (−3 dB, G=1, 12-V Single Supply) − 600 V/µs Slew Rate (G = 4, 12-V Single Supply) Low Distortion, Single-Ended, G = 4 − −72 dBc (250 kHz, 2 Vpp, 25 Ω load) − −78 dBc (250 kHz, 2 Vpp, 100 Ω load) Low Power Shutdown (THS6093) − 300 µA Total Standby Current Thermal Shutdown and Short Circuit Protection Standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD Package Evaluation Module Available THS6093 SOIC (D) AND TSSOP PowerPAD (PWP) PACKAGE (TOP VIEW) D1 OUT D1 IN− D1 IN+ VCC− N/C GND N/C VCC+ D2 OUT D2 IN− D2 IN+ 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC+ D2 OUT D2 IN− D2 IN+ N/C SHUTDOWN N/C description The THS6092/3 is a high-speed line driver ideal for driving signals from the remote terminal to the central office in asymmetrical digital subscriber line (ADSL) applications. It can operate from a single +12-V supply voltage while drawing only 7.3 mA of supply current per channel. It offers low –72 dBc total harmonic distortion driving a 25-Ω load (2 Vpp). The THS6092/3 offers a high 18.4-Vpp differential output swing across a 50-Ω load from a single +12-V supply. The THS6093 features a low-power shutdown mode, consuming only 300 µA quiescent current per channel. The THS6092/3 is packaged in a standard SOIC, SOIC PowerPAD, and TSSOP PowerPAD package. +12 V THS6092 Driver 1 + _ VI+ 1:2 750 Ω 499 Ω VI− + _ RELATED PRODUCTS 12.5 Ω THS6092 Driver 2 12.5 Ω DEVICE 14.1 dBm Delivered to Telephone Line DESCRIPTION THS6042/3 350-mA, ±12 ADSL CPE line driver 100 Ω THS6052/3 175-mA, ±12 V ADSL CPE line driver OPA2677 380-mA, +12 V ADSL CPE line driver THS6062 Low noise ADSL receiver 0.33 µF GND 750 Ω Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright  2002, Texas Instruments Incorporated 
 
!" # $%&" !#  '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# 
&-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0  !)) '!!&"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 

           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 AVAILABLE OPTIONS TA SOIC-8† (D) 0°C to 70°C THS6092CD PACKAGED DEVICE SOIC-8† SOIC-14† PowerPAD (D) (DDA) THS6092CDDA THS6093CD TSSOP-14† PowerPAD (PWP) THS6093CPWP EVALUATION MODULES THS6092EVM THS6093EVM −40°C to 85°C THS6092ID THS6092IDDA THS6093ID THS6093IPWP † All packages are available taped and reeled. Add an R-suffix to the device type (i.e., THS6092IDR). — absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VCC+ to VCC − . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.7 V Input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC Output current (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 350 mA Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 3 V Maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Total power dissipation at (or below) 25°C free-air temperature . . . . . . . . . . . See Dissipation Ratings Table Operating free-air temperature, TA: Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature, Tstg : Commercial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6092 and THS6093 may incorporate a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. DISSIPATION RATING TABLE TA = 70°C§ POWER RATING TA = 85°C§ POWER RATING 1.1 W 0.63 W 0.47 W 9.2°C/W 26.9°C/W‡ 2.3 W 1.31 W 0.98 W 1.6 W 0.90 W 0.68 W 1.4°C/W 2.8 W 1.60 W PACKAGE θJA θJC D-8 95°C/W‡ 38.3°C/W‡ DDA D-14 45.8°C/W 66.6°C/W‡ PWP 37.5°C/W TA = 25°C§ POWER RATING 1.20 W ‡ This data was taken using the JEDEC proposed high-K test PCB. For the JEDEC low-K test PCB, the ΘJA is168°C/W for the D−8 package and 122.3°C/W for the D−14 package. § Power rating is determined with a junction temperature of 130°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance. recommended operating conditions MIN Dual supply Supply voltage, VCC+ to VCC− Single supply C-suffix Operating free-air temperature, TA 2 I-suffix POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 NOM MAX ± 2.5 ±7 +5 +14 0 70 −40 85 UNIT V °C 

           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC+ = 12 V, VCC− = GND, RFEEDBACK = 750 Ω, RL = 25 Ω (unless otherwise noted) dynamic performance PARAMETER BW Small-signal bandwidth (− 3 dB) G=1 SR Slew rate (see Note 2) TEST CONDITIONS MIN TYP VCC = 12 V 100 VCC = 5 V 90 VCC = 12 V VCC = 5 V 600 MAX UNIT MHz V/ s V/µs 400 NOTE 2: Slew rate is defined from the 25% to the 75% output levels. noise/distortion performance PARAMETER TEST CONDITIONS THD Total harmonic distortion (single-ended configuration) Vn Input voltage noise In Input current noise XT Crosstalk Gain = 4, VCC = 5 V, RL = 25 Ω, f = 250 kHz Gain = 4, VCC = 12 V, RL = 25 Ω, f = 250 kHz MIN VO(pp) = 2 V −70 VO(pp)= 2 V −72 VO(pp)= 7 V −68 VCC = 12 V, 5 V, f = 10 kHz +Input −Input VO = 2 Vpp RL= 25 Ω MAX nV/√Hz 2.1 pA/√Hz 10.9 VCC = 5 V −65 VCC = 12 V −63 UNIT dBc 2.1 VCC = 12 V, 5 V, f = 10 kHz f = 250 kHz , G = 4, TYP dBc dc performance PARAMETER TEST CONDITIONS Input offset voltage VOS Differential offset voltage VCC = 12 V, 5 V Offset drift − Input bias current IIB + Input bias current VCC = 12 V, 5 V Differential input bias current ZOL Open loop transimpedance RL = 1 kΩ POST OFFICE BOX 655303 TYP MAX TA = 25°C TA = full range 6 16 TA = 25°C TA = full range 1 TA = full range TA = 25°C 20 TA = full range TA = 25°C TA = full range TA = 25°C TA = full range VCC = 12 V, 5 V • DALLAS, TEXAS 75265 MIN 21 6 UNIT mV 8 3 µV/°C 10 12 1 6 7 3 µA 10 12 0.9 MΩ 3 

           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC+ = 12 V, VCC− = GND, RFEEDBACK = 750 Ω, RL = 25 Ω (unless otherwise noted) (continued) input characteristics PARAMETER VICR CMRR TEST CONDITIONS CI Input capacitance 1.1 to 3.9 TA = 25°C TA = full range 1.5 to 3.5 VCC = 12 V TA = 25°C TA = full range 2.3 to 9.7 VCC = 5 V TA = 25°C TA = full range 56 VCC = 12 V TA = 25°C TA = full range 50 Common-mode rejection ratio Input resistance TYP VCC = 5 V Input common-mode voltage range RI MIN MAX 1.6 to 3.4 UNIT V 1.8 to 10.2 2.4 to 9.6 63 54 dB 56 48 + Input 1 −Input 15 MΩ Ω 2 pF output characteristics PARAMETER VO Output voltage swing TEST CONDITIONS Single ended 100 mV overdrive RL = 25 Ω VCC = 5 V VCC = 12 V RL = 100 Ω VCC = 5 V VCC = 12 V RL = 3.6 Ω, IO Output current RL = 10 Ω, VCC = 5 V VCC = 12 V ISC Short-circuit current RL = 0 Ω, VCC = 12 V Output resistance Open loop MIN TYP 1.4 to 3.6 1.1 to 3.9 1.9 to 10.1 1.4 to 10.6 1.3 to 3.7 1.05 to 3.95 1.5 to 10.5 1.1 to 10.9 MAX UNIT V 240 240 mA 275 325 mA 15 Ω power supply PARAMETER TEST CONDITIONS Dual supply VCC ICC PSRR 4 Operating range Single supply MIN TYP ± 2.25 ±7 4.5 14 TA = 25°C TA = full range 6.7 VCC = 5 V TA = 25°C TA = full range 7.3 VCC = 12 V TA = 25°C TA = full range -54 −58 VCC = 5 V -46 − -58 −70 VCC = 12 V TA = 25°C TA = full range Quiescent current (each driver) Power supply rejection ratio POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX V 8.8 10 mA 9.5 10.5 -50 UNIT mA dB 

           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 electrical characteristics over recommended operating free-air temperature range, TA = 25°C, VCC+ = 12 V, VCC− = GND, RFEEDBACK = 750 Ω, RL = 25 Ω (unless otherwise noted) (continued) shutdown characteristics (THS6093 only) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIL(SHDN) Shutdown pin voltage for power up VCC = 12 V, GND = 6 V (GND Pin as Reference) VIH(SHDN) Shutdown pin voltage for power down VCC = 12 V, GND = 6 V (GND Pin as Reference) ICC(SHDN) Total quiescent current when in shutdown state VSHDN = 8 V, VCC = 12 V tDIS tEN Disable time (see Note 3) IIL(SHDN) Shutdown pin input bias current for power up VSHDN = 6 V, VCC = 12 V VGND = 6 V, 40 100 µA IIH(SHDN) Shutdown pin input bias current for power down VSHDN = 9.3 V, VCC = 12 V VGND = 6 V, 50 100 µA VGND = 6 V, VCC = 12 V VCC = 12 V Enable time (see Note 3) 0.8 2 V V 0.3 0.7 mA 0.2 µs 0.5 µs NOTE 3: Disable/enable time is defined as the time from when the shutdown signal is applied to the SHDN pin to when the supply current has reached half of its final value. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 

           SLOS345C − JANUARY 2001 − REVISED OCTOBER 2002 APPLICATION INFORMATION +12 V THS6092 Driver 1 VI+ 0.1 µF + 6.8 µF 12.5 Ω + _ 1:2 750 Ω 100 Ω Telephone Line 499 Ω 499 Ω +12 V 0.33 µF 1 kΩ THS6092 Driver 2 VI− 0.1 µF 12.5 Ω + _ 499 Ω − + 750 Ω THS6062 Receiver 1 VO+ VCC 2 499 Ω 1 kΩ 499 Ω − + VO− THS6062 Receiver 2 VCC 2 Figure 1. THS6092 ADSL Application With 1:2 Transformer Ratio 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) THS6092ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 6092I THS6093CPWPR ACTIVE HTSSOP PWP 14 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR 0 to 70 HS6093C THS6093IPWP ACTIVE HTSSOP PWP 14 90 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 HS6093I THS6093IPWPR ACTIVE HTSSOP PWP 14 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 HS6093I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of