THS7365
TH
S
736
5
www.ti.com.................................................................................................................................................................................................. SBOS467 – MARCH 2009
6-Channel Video Amplifier with 3-SD and 3-HD Sixth-Order Filters and 6-dB Gain
FEATURES
DESCRIPTION
1
• Three SDTV Video Amplifiers for CVBS,
S-Video, Y’/P’B/P’R, 480i/576i, Y’U’V’, or R’G’B’
• Three HDTV Video Amplifiers for Y’/P’B/P’R,
720p/1080i/1080p30, or G’B’R’ (R’G’B’)
• Bypassable Sixth-Order Low-Pass Filters:
– SD Channels: –3 dB at 9.5-MHz
– HD Channels: –3 dB at 36-MHz
• Versatile Input Biasing:
– DC-Coupled with 300-mV Output Shift
– AC-Coupled with Sync-Tip Clamp
– AC-Coupling with Biasing
• Built-in 6-dB Gain (2 V/V)
• +2.7-V to +5-V Single-Supply Operation
• Rail-to-Rail Output:
– Output Swings Within 100 mV from the
Rails: Allows AC or DC Output Coupling
– Supports Driving Two Video Lines/Channel
• Low Total Quiescent Current: 20.7 mA at 3.3 V
• Disabled Supply Current Function: 0.1 µA
• Low Differential Gain/Phase: 0.2%/0.3°
• RoHS-Compliant Package: TSSOP-20
234
APPLICATIONS
•
•
•
Fabricated using the revolutionary, complementary
Silicon-Germanium (SiGe) BiCom3X process, the
THS7365 is a low-power, single-supply, 2.7-V to 5-V,
six-channel integrated video buffer. It incorporates
three
standard-definition
(SDTV)
and
three
high-definition (HDTV) filter channels. All filters
feature bypassable sixth-order Butterworth filter
characteristics that are useful as digital-to-analog
converter (DAC) reconstruction filters or as
analog-to-digital converter (ADC) anti-aliasing filters.
The THS7365 has flexible input coupling capabilities
that can be configured for either ac- or dc-coupled
inputs. The 300-mV output level shift allows for a full
sync dynamic range at the output with 0-V input. The
ac-coupled modes include a transparent sync-tip
clamp for composite video (CVBS), Y', and R'G'B'
signals with sync. AC-coupled biasing for C'/P'B/P'R
channels can easily be achieved by adding an
external resistor to VS+.
The THS7365 is an ideal choice for all video buffer
applications. Its rail-to-rail output stage with 6-dB gain
allows for both ac and dc line driving. The ability to
drive two lines per channel, or 75-Ω loads, allows for
maximum flexibility as a video line driver. The
20.7-mA total quiescent current at 3.3 V and 0.1 µA
(disabled mode) makes it an excellent choice for
power-sensitive video applications.
The THS7365 is available in a TSSOP-20 package
that is lead-free and green (RoHS-compliant).
Set Top Box Output Video Buffering
PVR/DVDR/BluRay™ Output Buffering
Low-Power Video Buffering
THS7365
CVBS
75 W
CVBS
S-Video
Y’
SOC/DAC/Encoder
R
+2.7 V to
+5 V
R
SD1 IN
SD1 OUT 20
2
SD2 IN
SD2 OUT 19
3
SD3 IN
SD3 OUT 18
4
NC
S-Video Y' Out
R
S-Video
C’
1
Disable SD 17
5
VS+
GND 16
6
NC
Disable HD 15
7
HD1 IN
HD1 OUT 14
8
HD2 IN
HD2 OUT 13
9
HD3 IN
HD3 OUT 12
10
Bypass SD Bypass HD 11
75 W
75 W
S-Video C' Out
Disable SD
75 W
75 W
75 W
Disable HD
Y'/G' Out
75 W
Y'/G'
R
P'B/B'
P'R/R' Out
Bypass
SD LPF
Bypass
HD LPF
75 W
75 W
75 W
R
P'R/R'
P'B/B' Out
75 W
75 W
R
Figure 1. Single-Supply, DC-Input/DC-Output Coupled Video Line Driver
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
BluRay is a trademark of Blu-ray Disc Association (BDA).
Macrovision is a registered trademark of Macrovision Corporation.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
THS7365
SBOS467 – MARCH 2009.................................................................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1) (2)
PRODUCT
PACKAGE-LEAD
THS7365IPW
(2)
Rails, 70
TSSOP-20
THS7365IPWR
(1)
TRANSPORT MEDIA, QUANTITY
Tape and Reel, 2000
ECO STATUS (2)
Pb-Free, Green
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that
does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering
processes.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
THS7365
UNIT
5.5
V
Supply voltage, VS+ to GND
Input voltage, VI
–0.4 to VS+
V
±90
mA
Output current, IO
Continuous power dissipation
See the Dissipation Ratings Table
Maximum junction temperature, any condition (2), TJ
+150
°C
Maximum junction temperature, continuous operation, long-term
reliability (3), TJ
+125
°C
–60 to +150
°C
Storage temperature range, TSTG
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
ESD rating:
(1)
(2)
(3)
+300
°C
Human body model (HBM)
4000
V
Charge device model (CDM)
1000
V
Machine model (MM)
200
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
(1)
PACKAGE
θJC
(°C/W)
θJA
(°C/W)
AT TA ≤ +25°C
POWER RATING
AT TA = +85°C
POWER RATING
TSSOP-20 (PW)
36
88 (1)
1.13 W
0.45 W
These data were taken with the JEDEC High-K test printed circuit board (PCB). For the JEDEC low-K test PCB, the θJA is 130°C/W.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Supply voltage, VS+
2.7
5
V
Ambient temperature, TA
–40
+85
°C
2
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THS7365
www.ti.com.................................................................................................................................................................................................. SBOS467 – MARCH 2009
ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7365
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TEST
LEVEL (1)
AC PERFORMANCE (SD CHANNELS)
Passband bandwidth
–1 dB; VO = 0.2 VPP and 2 VPP
7
8.2
10.2
MHz
B
Small- and large-signal bandwidth
–3 dB; VO = 0.2 VPP and 2 VPP
7.8
9.5
11.4
MHz
B
–3 dB; VO = 0.2 VPP
85
130
MHz
B
V/µs
B
dB
B
Bypass mode bandwidth
Slew rate
Attenuation
Bypass mode; VO = 2 VPP
75
100
With respect to 500 kHz (2), f = 6.75 MHz
–0.9
0.2
With respect to 500 kHz (2), f = 27 MHz
42
54
dB
B
f = 100 kHz
72
ns
C
f = 5.1 MHz with respect to 100 kHz
10
ns
C
0.3
ns
C
NTSC/PAL
0.2/0.35
%
C
Group delay
Group delay variation
Channel-to-channel delay
Differential gain
Differential phase
NTSC/PAL
0.3/0.42
Degrees
C
f = 1 MHz, VO = 1.4 VPP
–70
dB
C
100 kHz to 6 MHz, non-weighted
70
dB
C
Total harmonic distortion
Signal-to-noise ratio
100 kHz to 6 MHz, unified weighting
Gain
78
All channels, TA = +25°C
5.7
All channels, TA = –40°C to +85°C
5.65
6
dB
C
6.3
dB
A
6.35
dB
B
f = 6.75 MHz, Filter mode
0.7
Ω
C
f = 6.75 MHz, Bypass mode
0.6
Ω
C
Disabled
20 || 3
kΩ || pF
C
f = 6.75 MHz, Filter mode
46
dB
C
f = 1 MHz, SD to SD channel and SD to HD
channel
–78
dB
C
Output impedance
Return loss
Crosstalk
1.1
AC PERFORMANCE (HD CHANNELS)
Passband bandwidth
–1 dB; VO = 0.2 VPP and 2 VPP
27.2
32
38.2
MHz
B
Small- and large-signal bandwidth
–3 dB; VO = 0.2 VPP and 2 VPP
30.3
36
43
MHz
B
–3 dB; VO = 0.2 VPP
170
250
MHz
B
Bypass mode; VO = 2 VPP
420
500
V/µs
B
dB
B
Bypass mode bandwidth
Slew rate
Attenuation
With respect to 500 kHz
, f = 27 MHz
–1
0
With respect to 500 kHz (2), f = 74 MHz
34
42
dB
B
f = 100 kHz
22
ns
C
f = 27 MHz with respect to 100 kHz
7.5
ns
C
0.3
ns
C
NTSC/PAL
0.1/0.1
%
C
Group delay
Group delay variation
(2)
Channel-to-channel delay
Differential gain
Differential phase
NTSC/PAL
0.2/0.25
Degrees
C
f = 10 MHz, VO = 1.4 VPP
–49
dB
C
100 kHz to 30 MHz, non-weighted
62
dB
C
100 kHz to 30 MHz, unified weighting
72
dB
C
6.3
dB
A
6.35
dB
B
Total harmonic distortion
Signal-to-noise ratio
Gain
(1)
(2)
1
All channels, TA = +25°C
5.7
All channels, TA = –40°C to +85°C
5.65
6
Test levels: (A) 100% tested at +25°C. Over temperature limits set by characterization and simulation. (B) Limits set by characterization
and simulation only. (C) Typical value only for information.
3.3-V supply filter specifications are ensured by 100% testing at 5-V supply along with design and characterization.
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THS7365
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ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7365
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TEST
LEVEL (1)
AC PERFORMANCE (HD CHANNELS) (continued)
Output impedance
Return loss
Crosstalk
f = 30 MHz, Filter mode
1.7
Ω
C
f = 30 MHz, Bypass mode
2
Ω
C
Disabled
1.8 || 3
kΩ || pF
C
f = 30 MHz, Filter mode
39
dB
C
f = 1 MHz, HD to SD channels
–74
dB
C
f = 1 MHz, SD to HD channels
–78
dB
C
f = 1 MHz, HD to HD channels
–70
dB
C
DC PERFORMANCE
Biased output voltage
Input voltage range
VIN = 0 V, SD channels
200
300
400
mV
A
VIN = 0 V, HD channels
200
295
400
mV
A
DC input, limited by output
Sync-tip clamp charge current
–0.1/1.46
V
C
VIN = –0.1 V, SD channels
140
200
µA
A
VIN = –0.1 V, HD channels
280
400
µA
A
800 || 2
kΩ || pF
C
3.15
V
C
3.1
V
A
3.1
V
C
Input impedance
OUTPUT CHARACTERISTICS
RL = 150 Ω to +1.65 V
RL = 150 Ω to GND
High output voltage swing
2.85
RL = 75 Ω to +1.65 V
RL = 75 Ω to GND
3
V
C
RL = 150 Ω to +1.65 V (VIN = –0.2 V)
0.04
V
C
RL = 150 Ω to GND (VIN = –0.2 V)
0.03
V
A
RL = 75 Ω to +1.65 V (VIN = –0.2 V)
0.1
V
C
RL = 75 Ω to GND (VIN = –0.2 V)
0.05
V
C
Output current (sourcing)
RL = 10 Ω to +1.65 V
80
mA
C
Output current (sinking)
RL = 10 Ω to +1.65 V
70
mA
C
Low output voltage swing
0.1
POWER SUPPLY
Operating voltage
Total quiescent current, no load
2.6
3.3
5.5
V
B
VIN = 0 V, all channels on
17
20.7
27
mA
A
VIN = 0 V, SD channels on, HD channels off
5.6
6.9
9
mA
A
VIN = 0 V, SD channels off, HD channels on
11.4
13.8
18
mA
A
VIN = 0 V, all channels off, VDISABLE = 3 V
0.1
10
µA
A
At dc
52
dB
C
V
A
Power-supply rejection ratio
(PSRR)
LOGIC CHARACTERISTICS (3)
VIH
Disabled or Bypass mode
VIL
Enabled or Filter mode
1.8
2
0.7
V
A
0.2
µA
C
IIL
0.2
µA
C
Disable time
100
ns
C
Enable time
140
ns
C
5
ns
C
IIH
Bypass/filter switch time
(3)
4
0.65
The logic input pins should not be left floating. They must be connected to logic low (or GND) or logic high (or VS+).
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THS7365
www.ti.com.................................................................................................................................................................................................. SBOS467 – MARCH 2009
ELECTRICAL CHARACTERISTICS: VS+ = +5 V
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7365
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TEST
LEVEL (1)
AC PERFORMANCE (SD CHANNELS)
Passband bandwidth
–1 dB; VO = 0.2 VPP and 2 VPP
7
8.2
10.2
MHz
B
Small- and large-signal bandwidth
–3 dB; VO = 0.2 VPP and 2 VPP
7.8
9.5
11.4
MHz
B
–3 dB; VO = 0.2 VPP
85
130
MHz
B
V/µs
B
dB
A
Bypass mode bandwidth
Slew rate
Attenuation
Bypass mode; VO = 2 VPP
75
100
With respect to 500 kHz, f = 6.75 MHz
–0.9
0.2
With respect to 500 kHz, f = 27 MHz
42
54
dB
A
f = 100 kHz
72
ns
C
f = 5.1 MHz with respect to 100 kHz
10
ns
C
0.3
ns
C
NTSC/PAL
0.2/0.35
%
C
Group delay
Group delay variation
Channel-to-channel delay
Differential gain
Differential phase
NTSC/PAL
0.35/0.45
Degrees
C
f = 1 MHz, VO = 1.4 VPP
–72
dB
C
100 kHz to 6 MHz, non-weighted
70
dB
C
Total harmonic distortion
Signal-to-noise ratio
100 kHz to 6 MHz, unified weighting
Gain
78
All channels, TA = +25°C
5.7
All channels, TA = –40°C to +85°C
5.65
6
dB
C
6.3
dB
A
6.35
dB
B
f = 6.75 MHz, Filter mode
0.7
Ω
C
f = 6.75 MHz, Bypass mode
0.6
Ω
C
Disabled
20 || 3
kΩ || pF
C
f = 6.75 MHz, Filter mode
46
dB
C
f = 1 MHz, SD to SD channel and SD to HD
channel
–78
dB
C
Output impedance
Return loss
Crosstalk
1.1
AC PERFORMANCE (HD CHANNELS)
Passband bandwidth
–1 dB; VO = 0.2 VPP and 2 VPP
27.2
32
38.2
MHz
B
Small- and large-signal bandwidth
–3 dB; VO = 0.2 VPP and 2 VPP
30.3
36
43
MHz
B
–3 dB; VO = 0.2 VPP
170
250
MHz
B
Bypass mode; VO = 2 VPP
420
500
V/µs
B
With respect to 500 kHz, f = 27 MHz
–1
0
dB
A
With respect to 500 kHz, f = 74 MHz
34
42
dB
A
f = 100 kHz
22
ns
C
f = 27MHz with respect to 100 kHz
7.5
ns
C
0.3
ns
C
NTSC/PAL
0.1/0.1
%
C
Bypass mode bandwidth
Slew rate
Attenuation
Group delay
Group delay variation
Channel-to-channel delay
Differential gain
Differential phase
NTSC/PAL
0.25/0.35
Degrees
C
f = 10 MHz, VO = 1.4 VPP
–52
dB
C
100 kHz to 30 MHz, non-weighted
62
dB
C
100 kHz to 30 MHz, unified weighting
72
dB
C
6.3
dB
A
6.35
dB
B
Ω
C
Total harmonic distortion
Signal-to-noise ratio
Gain
All channels, TA = +25°C
5.7
All channels, TA = –40°C to +85°C
5.65
f = 30 MHz, Filter mode
Output impedance
(1)
1
6
1.7
f = 30 MHz, Bypass mode
2
Ω
C
Disabled
1.8 || 3
kΩ || pF
C
Test levels: (A) 100% tested at +25°C. Over temperature limits set by characterization and simulation. (B) Limits set by characterization
and simulation only. (C) Typical value only for information.
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THS7365
SBOS467 – MARCH 2009.................................................................................................................................................................................................. www.ti.com
ELECTRICAL CHARACTERISTICS: VS+ = +5 V (continued)
At TA = +25°C, RL = 150 Ω to GND, Filter mode, and dc-coupled input/output, unless otherwise noted.
THS7365
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
TEST
LEVEL (1)
AC PERFORMANCE (HD CHANNELS) (continued)
Return loss
Crosstalk
f = 30 MHz, Filter mode
39
dB
C
f = 1 MHz, HD to SD channels
–74
dB
C
f = 1 MHz, SD to HD channels
–78
dB
C
f = 1 MHz, HD to HD channels
–70
dB
C
A
DC PERFORMANCE
Biased output voltage
Input voltage range
VIN = 0 V, SD channels
200
VIN = 0 V, HD channels
200
DC input, limited by output
Sync-tip clamp charge current
310
400
mV
305
400
mV
A
–0.1/2.3
V
C
VIN = –0.1 V, SD channels
140
200
µA
A
VIN = –0.1 V, HD channels
280
400
µA
A
800 || 2
kΩ || pF
C
4.85
V
C
Input impedance
OUTPUT CHARACTERISTICS
RL = 150 Ω to +2.5 V
RL = 150 Ω to GND
4.75
V
A
RL = 75 Ω to +2.5V
4.7
V
C
RL = 75 Ω to GND
4.5
V
C
RL = 150 Ω to +2.5 V (VIN = –0.2 V)
0.05
V
C
RL = 150 Ω to GND (VIN = –0.2 V)
0.03
RL = 75 Ω to +2.5 V (VIN = –0.2 V)
High output voltage swing
4.5
V
A
0.1
V
C
RL = 75 Ω to GND (VIN = –0.2 V)
0.05
V
C
Output current (sourcing)
RL = 10 Ω to +2.5 V
90
mA
C
Output current (sinking)
RL = 10 Ω to +2.5 V
85
mA
C
Low output voltage swing
0.1
POWER SUPPLY
Operating voltage
Total quiescent current, no load
2.6
5
5.5
V
B
VIN = 0 V, all channels on
18
21.6
28.5
mA
A
VIN = 0 V, SD channels on, HD channels off
6
7.2
9.5
mA
A
VIN = 0 V, SD channels off, HD channels on
12
14.4
19
mA
A
VIN = 0 V, all channels off, VDISABLE = 3 V
1
10
µA
A
At dc
52
dB
C
Power-supply rejection ratio
(PSRR)
LOGIC CHARACTERISTICS (2)
VIH
Disabled or Bypass engaged
VIL
Enabled or Bypass disengaged
V
A
0.8
V
A
IIH
0.2
µA
C
IIL
0.2
µA
C
Disable time
80
ns
C
Enable time
100
ns
C
5
ns
C
Bypass/filter switch time
(2)
6
2.1
0.8
2.2
The logic input pins should not be left floating. They must be connected to logic low (or GND) or logic high (or VS+).
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THS7365
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PIN CONFIGURATION
PW PACKAGE
TSSOP-20
(TOP VIEW)
SD1 IN
1
20
SD1 OUT
SD2 IN
2
19
SD2 OUT
SD3 IN
3
18
SD3 OUT
NC
4
17
Disable SD
VS+
5
16
GND
NC
6
15
Disable HD
HD1 IN
7
14
HD1 OUT
HD2 IN
8
13
HD2 OUT
HD3 IN
9
12
HD3 OUT
Bypass SD
10
11
Bypass HD
THS7365IPW
NOTE: NC = No connection.
TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
SD1 IN
1
I
Standard-definition video input, channel 1; LPF = 9.5 MHz
DESCRIPTION
SD2 IN
2
I
Standard-definition video input, channel 2; LPF = 9.5 MHz
Standard-definition video input, channel 3; LPF = 9.5 MHz
SD3 IN
3
I
NC
4, 6
—
VS+
5
I
Positive power-supply pin; connect to +2.7 V up to +5 V
HD1 IN
7
I
High-definition video input, channel 1; LPF = 36 MHz
HD2 IN
8
I
High-definition video input, channel 2; LPF = 36 MHz
HD3 IN
9
I
High-definition video input, channel 3; LPF = 36 MHz
Bypass SD
10
I
Bypass all SD channel filters. Logic high bypasses the internal filters and logic low engages the
internal filters. Do not leave floating.
Bypass HD
11
I
Bypass all HD channel filters. Logic high bypasses the internal filters and logic low engages the
internal filters. Do not leave floating.
HD3 OUT
12
O
High-definition video output, channel 3; LPF = 36 MHz
HD2 OUT
13
O
High-definition video output, channel 2; LPF = 36 MHz
HD1 OUT
14
O
High-definition video output, channel 1; LPF = 36 MHz
Disable HD
15
I
Disable high definition channels. Logic high disables the HD channels and logic low enables the
HD. Do not leave floating.
GND
16
I
Ground pin for all internal circuitry
Disable SD
17
I
Disable standard definition channels. Logic high disables the SD channels and logic low enables the
SD channels. Do not leave floating.
SD3 OUT
18
O
Standard-definition video output, channel 3; LPF = 9.5 MHz
SD2 OUT
19
O
Standard-definition video output, channel 2; LPF = 9.5 MHz
SD1 OUT
20
O
Standard-definition video output, channel 1; LPF = 9.5 MHz
No internal connection. It is recommended to connect NC to GND.
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FUNCTIONAL BLOCK DIAGRAM
+VS
gm
Level
Shift
SD Channel 1
Input
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
Bypass SD
6 dB
SD Channel 1
Output
6 dB
SD Channel 2
Output
6 dB
SD Channel 3
Output
6-Pole
9.5 MHz
+VS
gm
Level
Shift
SD Channel 2
Input
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
Bypass SD
6-Pole
9.5 MHz
+VS
gm
Level
Shift
SD Channel 3
Input
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
Bypass SD
6-Pole
9.5 MHz
Bypass SD
Disable SD
+VS
Bypass HD
Disable HD
gm
Level
Shift
HD Channel 1
Input
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
Bypass HD
6 dB
HD Channel 1
Output
6 dB
HD Channel 2
Output
6 dB
HD Channel 3
Output
6-Pole
36 MHz
+VS
gm
Level
Shift
HD Channel 2
Input
LPF
Sync-Tip Clamp
(DC Restore)
800 kW
Bypass HD
6-Pole
36 MHz
+VS
gm
Level
Shift
HD Channel 3
Input
800 kW
Sync-Tip Clamp
(DC Restore)
Bypass HD
LPF
6-Pole
36 MHz
+2.7 V to +5 V
8
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TYPICAL CHARACTERISTICS
Table of Graphs: +3.3 V and +5 V
TITLE
FIGURE
Maximum Output Voltage vs Temperature
Figure 2
Minimum Output Voltage vs Temperature
Figure 3
SD Channel Output Impedance vs Frequency
Figure 4
SD Channel S22 Output Reflection Ratio vs Frequency
Figure 5
HD Channel Output Impedance vs Frequency
Figure 6
HD Channel S22 Output Reflection Ratio vs Frequency
Figure 7
SD Channel Disabled Output Impedance vs Frequency
Figure 8
HD Channel Disabled Output Impedance vs Frequency
Figure 9
Input Resistance vs Temperature
Figure 10
Table of Graphs: 3.3 V, Standard-Definition (SD) Channels
TITLE
FIGURE
SD Channel Small-Signal Gain vs Frequency
Figure 11, Figure 12,
Figure 15, Figure 16,
Figure 17, Figure 18
SD Channel Large-Signal Gain vs Frequency
Figure 13, Figure 14
SD Channel Phase vs Frequency
Figure 19
SD Channel Group Delay vs Frequency
Figure 20, Figure 21
SD Channel PSRR vs Frequency
Figure 22
SD Channel Differential Gain
Figure 23, Figure 25
SD Channel Differential Phase
Figure 24, Figure 26
SD Channel Second-Order Harmonic Distortion vs Frequency
Figure 27, Figure 29
SD Channel Third-Order Harmonic Distortion vs Frequency
Figure 28, Figure 30
SD Channel Small-Signal Pulse Response vs Time
Figure 31, Figure 33
SD Channel Large-Signal Pulse Response vs Time
Figure 32, Figure 34
Crosstalk vs Frequency
Figure 35, Figure 36
SD Channel Slew Rate vs Output Voltage
Figure 37
Total Quiescent Current vs Temperature
Figure 38
Output Offset Voltage vs Temperature
Figure 39
Table of Graphs: 3.3 V, High-Definition (HD) Channels
TITLE
FIGURE
HD Channel Small-Signal Gain vs Frequency
Figure 40, Figure 41,
Figure 44, Figure 45,
Figure 46, Figure 47
HD Channel Large-Signal Gain vs Frequency
Figure 42, Figure 43
HD Channel Phase vs Frequency
Figure 48
HD Channel Group Delay vs Frequency
Figure 49, Figure 50
HD Channel PSRR vs Frequency
Figure 51
HD Channel Second-Order Harmonic Distortion vs Frequency
Figure 52, Figure 54
HD Channel Third-Order Harmonic Distortion vs Frequency
Figure 53, Figure 55
HD Channel Small-Signal Pulse Response vs Time
Figure 56, Figure 58
HD Channel Large-Signal Pulse Response vs Time
Figure 57, Figure 59
HD Channel Slew Rate vs Output Voltage
Figure 60
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Table of Graphs: 5 V, Standard-Definition (SD) Channels
TITLE
FIGURE
SD Channel Small-Signal Gain vs Frequency
Figure 61, Figure 62,
Figure 65, Figure 66,
Figure 67, Figure 68
SD Channel Large-Signal Gain vs Frequency
Figure 63, Figure 64
SD Channel Phase vs Frequency
Figure 69
SD Channel Group Delay vs Frequency
Figure 70, Figure 71
SD Channel PSRR vs Frequency
Figure 72
SD Channel Differential Gain
Figure 73, Figure 75
SD Channel Differential Phase
Figure 74, Figure 76
SD Channel Second-Order Harmonic Distortion vs Frequency
Figure 77, Figure 79
SD Channel Third-Order Harmonic Distortion vs Frequency
Figure 78, Figure 80
SD Channel Small-Signal Pulse Response vs Time
Figure 81, Figure 83
SD Channel Large-Signal Pulse Response vs Time
Figure 82, Figure 84
Crosstalk vs Frequency
Figure 85, Figure 86
SD Channel Slew Rate vs Output Voltage
Figure 87
Total Quiescent Current vs Temperature
Figure 88
SD Channel Attenuation at 6.75 MHz vs Temperature
Figure 89
SD Channel Attenuation at 27 MHz vs Temperature
Figure 90
Output Offset Voltage vs Temperature
Figure 91
Table of Graphs: 5 V, High-Definition (HD) Channels
TITLE
FIGURE
HD Channel Small-Signal Gain vs Frequency
Figure 92, Figure 93,
Figure 96, Figure 97,
Figure 98, Figure 99
HD Channel Large-Signal Gain vs Frequency
Figure 94, Figure 95
HD Channel Phase vs Frequency
Figure 100
HD Channel Group Delay vs Frequency
Figure 101, Figure 102
HD Channel PSRR vs Frequency
Figure 103
HD Channel Second-Order Harmonic Distortion vs Frequency
Figure 104, Figure 106
HD Channel Third-Order Harmonic Distortion vs Frequency
Figure 105, Figure 107
HD Channel Small-Signal Pulse Response vs Time
Figure 108, Figure 110
HD Channel Large-Signal Pulse Response vs Time
Figure 109, Figure 111
HD Channel Slew Rate vs Output Voltage
Figure 112
HD Channel Attenuation at 27 MHz vs Temperature
Figure 113
HD Channel Attenuation at 74 MHz vs Temperature
Figure 114
10
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TYPICAL CHARACTERISTICS: +3.3 V and +5 V
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
MAXIMUM OUTPUT VOLTAGE vs TEMPERATURE
5.0
4.6
4.4
Load = 150 W to GND
DC-Coupled
SD and HD Channels
4.2
4.0
3.8
3.6
3.4
VS = +3.3 V
3.2
Minimum Output Voltage (V)
4.8
Maximum Output Voltage (V)
MINIMUM OUTPUT VOLTAGE vs TEMPERATURE
0.07
VS = +5 V
0.06
Load = 150 W to GND
DC-Coupled
SD and HD Channels
0.05
0.04
VS = +3.3 V
0.03
VS = +5 V
0.02
0.01
0
3.0
-40
10
-15
35
60
85
-40
10
-15
Ambient Temperature (°C)
85
Figure 3.
SD CHANNEL OUTPUT IMPEDANCE vs FREQUENCY
SD CHANNEL S22 OUTPUT REFLECTION RATIO vs
FREQUENCY
0
S22, Output Reflection Ratio (dB)
VS = +3.3 V and +5 V
Output Impedance (W)
60
Figure 2.
100
10
1
Filter Mode
0.1
Bypass Mode
0.01
100 k
1M
10 M
100 M
VS = +3.3 V and +5 V
-10
-20
-30
-40
Filter Mode
-50
-60
Bypass Mode
-70
100 k
1G
1M
10 M
100 M
1G
Frequency (Hz)
Frequency (Hz)
Figure 4.
Figure 5.
HD CHANNEL OUTPUT IMPEDANCE vs FREQUENCY
HD CHANNEL S22 OUTPUT REFLECTION RATIO vs
FREQUENCY
0
VS = +3.3 V and +5 V
S22, Output Reflection Ratio (dB)
100
Output Impedance (W)
35
Ambient Temperature (°C)
10
1
Filter Mode
VS = +3.3 V and +5 V
-10
-20
-30
-40
-60
Bypass Mode
Bypass Mode
0.1
100 k
1M
10 M
100 M
1G
Filter Mode
-50
-70
100 k
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 6.
Figure 7.
100 M
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TYPICAL CHARACTERISTICS: +3.3 V and +5 V (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL DISABLED OUTPUT IMPEDANCE vs
FREQUENCY
10 k
VS = +3.3 V and +5 V
Disable Mode
Output Impedance (W)
Output Impedance (W)
100 k
HD CHANNEL DISABLED OUTPUT IMPEDANCE vs
FREQUENCY
10 k
1k
100
100 k
1M
1k
100
100 k
1G
100 M
10 M
VS = +3.3 V and +5 V
Disable Mode
1M
10 M
100 M
1G
Frequency (Hz)
Frequency (Hz)
Figure 8.
Figure 9.
INPUT RESISTANCE vs TEMPERATURE
815
Input Resistance (kW)
810
VS = +3.3 V and +5 V
SD and HD Channels
805
800
795
790
785
-40
-15
10
35
60
85
Ambient Temperature (°C)
Figure 10.
12
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
RL = 150 W
-10
RL = 75 W
Filter Mode
-20
-30
-50
RL = 75 W
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
VOUT = 200 mVPP
-60
100 k
6.0
Small-Signal Gain (dB)
Small-Signal Gain (dB)
0
-40
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
10 M
VO = 1 VPP
-20
VO = 0.2 VPP
-30
VO = 0.2 VPP
-40
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
VO = 2 VPP
10 M
100 M
10 M
VO = 1 VPP
5.0
VO = 0.2 VPP
VO = 0.2 VPP and 2 VPP
4.5
Bypass
Mode
4.0
3.5
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
2.5
100 k
1G
VO = 2 VPP
Filter Mode
5.5
1M
10 M
Figure 13.
Figure 14.
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
Filter Mode
-20
AC
AC- vs DC-Coupled Outputs
AC
-40
VS = +3.3 V
Load = 150 W || 10 pF
VOUT = 200 mVPP
10 M
100 M
5.5
1G
Bypass
Mode
Filter Mode
AC
DC
5.0
4.5
AC or DC
4.0
3.5
3.0
DC
AC- vs DC-Coupled Outputs
6.0
Small-Signal Gain (dB)
DC
-10
1G
100 M
Frequency (Hz)
0
1G
100 M
Frequency (Hz)
10
Small-Signal Gain (dB)
1M
6.0
3.0
1M
1M
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
VOUT = 200 mVPP
SD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
Large-Signal Gain (dB)
Large-Signal Gain (dB)
Filter Mode
-60
100 k
3.5
6.5
Bypass
Mode
VO = 2 VPP
Bypass
Mode
4.0
Figure 12.
-10
-50
RL = 75 W
Figure 11.
0
-30
RL = 75 W and 150 W
Frequency (Hz)
SD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
-60
100 k
RL = 150 W
Frequency (Hz)
10
-50
4.5
2.5
100 k
1G
100 M
Filter Mode
5.0
3.0
RL = 150 W
1M
5.5
VS = +3.3 V
Load = 150 W || 10 pF
VOUT = 200 mVPP
2.5
100 k
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 15.
Figure 16.
100 M
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
0
0
-10
CL = Stray (2 pF)
Filter Mode
-20
CL = 10 pF
-30
CL = 14 pF
-40
VS = +3.3 V
Load = 150 W || CL
VOUT = 200 mVPP
-50
Small-Signal Gain (dB)
Small-Signal Gain (dB)
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
Bypass Mode
-40
Figure 18.
SD CHANNEL GROUP DELAY vs FREQUENCY
120
100
Phase (°)
Group Delay (ns)
Filter Mode
Bypass
Mode
RL = 75 W and 150 W
-180
-315
110
RL = 75 W and 150 W
-90
-270
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
VOUT = 200 mVPP
-360
100 k
1M
VS = +3.3 V
DC-Coupled Output
CL = 10 pF
VOUT = 200 mVPP
Filter Mode
90
80
70
60
RL = 75 W and 150 W
50
10 M
40
100 k
1G
100 M
1M
Frequency (Hz)
Figure 20.
SD CHANNEL GROUP DELAY vs FREQUENCY
Group Delay (ns)
6.0
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 10 pF
VOUT = 200 mVPP
5.5
5.0
Bypass Mode
RL = 75 W
RL = 150 W
4.5
4.0
3.5
3.0
100 k
1M
SD CHANNEL PSRR vs FREQUENCY
60
10 M
100 M
1G
Power-Supply Rejection Ratio (dB)
6.5
VS = +3.3 V
50
40
Bypass Mode
30
Filter Mode
20
10
0
100 k
Frequency (Hz)
1M
10 M
100 M
Frequency (Hz)
Figure 21.
14
100 M
10 M
Frequency (Hz)
Figure 19.
7.0
1G
100 M
Figure 17.
0
-225
CL = 20 pF
Frequency (Hz)
SD CHANNEL PHASE vs FREQUENCY
-135
CL = 14 pF
Frequency (Hz)
45
-45
VS = +3.3 V
Load = 150 W || CL
VOUT = 200 mVPP
-60
10 M
1G
100 M
CL = 10 pF
-30
CL = 20 pF
10 M
CL = Stray (2 pF)
-20
-50
-60
1M
-10
Figure 22.
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL DIFFERENTIAL PHASE
0.50
-0.05
0.45
NTSC
VS = +3.3 V
Filter Mode
0.40
-0.10
Differential Phase (°)
Differential Gain (%)
SD CHANNEL DIFFERENTIAL GAIN
0
-0.15
PAL
-0.20
-0.25
-0.30
0.35
0.30
PAL
0.25
0.20
NTSC
0.15
0.10
VS = +3.3 V
Filter Mode
-0.35
0.05
-0.40
0
1st
2nd
3rd
4th
5th
1st
6th
2nd
Figure 23.
SD CHANNEL DIFFERENTIAL GAIN
6th
5th
0.05
VS = +3.3 V
Bypass Mode
VS = +3.3 V
Bypass Mode
0.04
Differential Phase (°)
0.04
Differential Gain (%)
4th
SD CHANNEL DIFFERENTIAL PHASE
0.05
0.03
0.02
NTSC
0.01
0.03
0.02
PAL
0.01
PAL
NTSC
0
0
1st
2nd
3rd
4th
5th
1st
6th
2nd
3rd
4th
6th
5th
Figure 25.
Figure 26.
SD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
SD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
-30
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
3rd
Figure 24.
VO = 2.5 VPP
-40
VO = 2 VPP
-50
VO = 1 VPP
-60
-70
VO = 0.5 VPP
-80
VS = +3.3 V
Filter Mode
DC-Coupled
-90
-100
-30
VS = +3.3 V
Filter Mode
DC-Coupled
-40
VO = 2.5 VPP
-50
-60
-70
VO = 2 VPP
VO = 1 VPP
-80
VO = 0.5 VPP
-90
-100
1
4
1
Frequency (MHz)
4
Frequency (MHz)
Figure 27.
Figure 28.
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
-30
VS = +3.3 V
Bypass Mode
DC-Coupled
-40
SD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
SD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VO = 2.5 VPP
VO = 2 VPP
-50
-60
-70
VO = 0.5 VPP
-80
-90
VO = 1 VPP
-100
-30
VS = +3.3 V
Bypass Mode
DC-Coupled
-40
VO = 2.5 VPP
VO = 2 VPP
-50
-60
-70
VO = 0.5 VPP
-80
-90
VO = 1 VPP
-100
1
1
30
10
Frequency (MHz)
Figure 29.
Figure 30.
SD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input tR/tF = 1 ns
Input Voltage
Waveforms
Input tR/tF = 120 ns
4.6
0.65
3.6
Input tR/tF = 1 ns
0.45
1.6
Output Voltage
Waveforms
Input tR/tF = 120 ns
-0.35
2.6
Input tR/tF = 1 ns
-1.35
1.6
-2.35
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Figure 31.
Figure 32.
SD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input Voltage
Waveform
0.65
3.6
0.55
1.7
0.45
1.6
Output Voltage
Waveform
1.5
10
20
30
40
50
60
70
80
90
100
0.65
-0.35
2.6
-1.35
1.6
Output Voltage
Waveform
0.35
0.6
0.25
-0.4
-2.35
VS = +3.3 V
Bypass Mode
-10
0
10
20
30
40
50
60
70
80
90
100
-3.35
Time (ns)
Time (ns)
Figure 33.
16
Input Voltage
Waveform
Input tR/tF = 1 ns
VS = +3.3 V
Bypass Mode
1.4
1.65
Input Voltage (V)
Input tR/tF = 1 ns
4.6
Input Voltage (V)
Output Voltage (V)
1.8
SD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
0
-3.35
Time (ns)
Time (ns)
-10
Output Voltage
Waveforms
Input tR/tF = 120 ns
-0.4
-100
0.25
0
0.65
VS = +3.3 V
Filter Mode
VS = +3.3 V
Filter Mode
1.4
-100
Input Voltage
Waveforms
Input tR/tF = 120 ns
0.6
0.35
1.5
1.65
Input tR/tF = 1 ns
Input Voltage (V)
0.55
1.7
Input Voltage (V)
Output Voltage (V)
1.8
SD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
30
10
Frequency (MHz)
Figure 34.
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TYPICAL CHARACTERISTICS: 3.3 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
CROSSTALK vs FREQUENCY
-20
Crosstalk (dB)
-30
CROSSTALK vs FREQUENCY
-10
VS = +3.3 V
Filter Modes
Input-Referred
-20
-30
HD In, HD Out
-40
Crosstalk (dB)
-10
HD In, SD Out
-50
-60
-70
SD In, SD Out
-90
100 k
-40
-50
SD In, SD Out
-60
HD In, SD Out
SD In, HD Out
1M
-80
SD In, HD Out
10 M
-90
100 k
1G
100 M
1M
10 M
100 M
Frequency (Hz)
Frequency (Hz)
Figure 35.
Figure 36.
SD CHANNEL SLEW RATE vs OUTPUT VOLTAGE
1G
TOTAL QUIESCENT CURRENT vs TEMPERATURE
120
25
Both SD and HD Channels On
Total Quiescent Current (mA)
100
Bypass Mode
Slew Rate (V/ms)
HD In, HD Out
-70
-80
80
60
VS = +3.3 V
Bypass Modes
Input-Referred
VS = +3.3 V
Positive and Negative Slew Rate
40
Filter Mode
20
20
15
SD Channels Off, HD Channels On
10
SD Channels On, HD Channels Off
5
VS = +3.3 V
No Load
0
0
0.5
1.0
1.5
2.5
2.0
-40
10
-15
35
Output Voltage (VPP)
Ambient Temperature (°C)
Figure 37.
Figure 38.
60
85
OUTPUT OFFSET VOLTAGE vs TEMPERATURE
Output Offset Voltage (mV)
315
310
VS = +3.3 V
Input = 0 V
305
SD Channels
300
295
HD Channels
290
285
-40
-15
10
35
60
85
Ambient Temperature (°C)
Figure 39.
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TYPICAL CHARACTERISTICS: 3.3 V, High-Definition (HD) Channels
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
RL = 150 W
Filter Mode
-10
RL = 75 W
-20
RL = 150 W
-40
-50
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 8 pF
VOUT = 200 mVPP
1M
10 M
Figure 41.
HD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
6.5
VO = 0.2 VPP
6.0
Large-Signal Gain (dB)
Large-Signal Gain (dB)
VO = 0.2 VPP
Filter Mode
VO = 1 VPP
-20
VO = 2 VPP
-30
VO = 0.2 VPP
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 8 pF
5.5
VO = 2 VPP
4.5
VO = 0.2 VPP and 2 VPP
Bypass
Mode
4.0
3.5
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 8 pF
2.5
1M
1G
100 M
VO = 1 VPP
Filter Mode
5.0
3.0
10 M
VO = 2 VPP
10 M
Frequency (Hz)
Figure 42.
Figure 43.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
7.5
Bypass
Mode
-10
AC
Filter Mode
-20
-30
AC
VS = +3.3 V
Load = 150 W || 8 pF
VOUT = 200 mVPP
6.5
6.0
5.5
4.5
100 M
3.0
1G
AC or DC
4.0
2.5
10 M
AC
Filter Mode
5.0
3.5
DC
Bypass
Mode
AC- vs DC-Coupled Outputs
7.0
Small-Signal Gain (dB)
DC
AC- vs DC-Coupled Outputs
1G
100 M
Frequency (Hz)
0
1G
100 M
Figure 40.
10
Small-Signal Gain (dB)
10 M
Frequency (Hz)
-50
18
RL = 75 W
VS = +3.3 V
DC-Coupled Output
Load = 150 W || 8 pF
VOUT = 200 mVPP
3.5
1M
Bypass
Mode
1M
4.0
Frequency (Hz)
-10
-50
RL = 75 W and 150 W
4.5
2.5
0
-40
RL = 150 W
Filter Mode
5.0
1G
100 M
HD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
1M
5.5
3.0
RL = 75 W
10
-40
Bypass
Mode
6.0
Small-Signal Gain (dB)
Small-Signal Gain (dB)
0
-30
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
DC
VS = +3.3 V
Load = 150 W || 8 pF
VOUT = 200 mVPP
1M
10 M
100 M
Frequency (Hz)
Frequency (Hz)
Figure 44.
Figure 45.
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TYPICAL CHARACTERISTICS: 3.3 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
20
0
10
CL = Stray (2 pF)
Filter Mode
-10
CL = 14 pF
-20
-30
-40
CL = 8 pF
CL = 20 pF
VS = +3.3 V
Load = 150 W || CL
VOUT = 200 mVPP
Small-Signal Gain (dB)
Small-Signal Gain (dB)
CL = 20 pF
-20
-30
VS = +3.3 V
Load = 150 W || CL
VOUT = 200 mVPP
Frequency (Hz)
Figure 46.
Figure 47.
HD CHANNEL GROUP DELAY vs FREQUENCY
40
0
Group Delay (ns)
Filter Mode
-90
-135
RL = 75 W and 150 W
Bypass
Mode
-180
-225
VS = +3.3 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
-270
-315
1M
VS = +3.3 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
35
RL = 75 W and 150 W
-45
30
Filter
Mode
25
20
RL = 75 W and 150 W
15
10
5
10 M
1G
100 M
1M
Frequency (Hz)
Figure 49.
HD CHANNEL GROUP DELAY vs FREQUENCY
HD CHANNEL PSRR vs FREQUENCY
Group Delay (ns)
60
VS = +3.3 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
Power-Supply Rejection Ratio (dB)
6.0
5.0
100 M
10 M
Frequency (Hz)
Figure 48.
5.5
1G
100 M
Frequency (Hz)
HD CHANNEL PHASE vs FREQUENCY
Phase (°)
CL = Stray (2 pF)
Bypass Mode
-10
-50
10 M
1G
100 M
45
-360
CL = 8 pF
0
-40
-50
10 M
CL = 14 pF
Bypass
Mode
4.5
4.0
3.5
RL = 75 W
3.0
2.5
RL = 150 W
2.0
1M
10 M
100 M
1G
VS = +3.3 V
50
40
Bypass Mode
30
Filter Mode
20
10
0
100 k
Frequency (Hz)
1M
10 M
100 M
Frequency (Hz)
Figure 50.
Figure 51.
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TYPICAL CHARACTERISTICS: 3.3 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
-30
VS = +3.3 V
Filter Mode
DC-Coupled
-40
HD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
HD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VO = 2.5 VPP
VO = 2 VPP
-50
-60
VO = 0.5 VPP
-70
VO = 1 VPP
-80
-90
-100
-30
VS = +3.3 V
Filter Mode
DC-Coupled
-40
VO = 2.5 VPP
-50
-60
-70
VO = 1 VPP
-80
VO = 2 VPP
-90
VO = 0.5 VPP
-100
1
1
16
10
Figure 53.
HD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
HD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
-30
VS = +3.3 V
Bypass Mode
DC-Coupled
-40
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
Frequency (MHz)
Figure 52.
VO = 2.5 VPP
-50
VO = 2 VPP
-60
-70
-80
VO = 0.5 VPP
VO = 1 VPP
-90
-100
-30
VS = +3.3 V
Bypass Mode
DC-Coupled
-40
-60
VO = 1 VPP
-70
-80
-90
VO = 0.5 VPP
1
60
10
Figure 55.
HD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
0.65
3.6
0.55
Input tR/tF = 1 ns
Output Voltage
Waveforms
1.6
0.45
Input tR/tF = 33.6 ns
1.5
0.35
Input Voltage
Waveforms
Input tR/tF = 33.6 ns
0.65
2.6
-0.35
Input tR/tF = 1 ns
Output Voltage
Waveforms
1.6
-1.35
Input tR/tF = 33.6 ns
0.6
VS = +3.3 V
Filter Mode
-2.35
VS = +3.3 V
Filter Mode
1.4
0.25
0
1.65
Input tR/tF = 1 ns
Input Voltage (V)
1.7
4.6
Input Voltage (V)
Output Voltage (V)
Input Voltage
Waveforms
Input tR/tF = 33.6 ns
HD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
Input tR/tF = 1 ns
1.8
60
10
Frequency (MHz)
Figure 54.
50
100
150
200
250
-0.4
-50
Time (ns)
0
50
100
150
200
250
-3.35
Time (ns)
Figure 56.
20
VO = 2 VPP
-50
Frequency (MHz)
-50
VO = 2.5 VPP
-100
1
1.9
16
10
Frequency (MHz)
Figure 57.
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TYPICAL CHARACTERISTICS: 3.3 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input Voltage
Waveform
Input tR/tF = 1 ns
4.6
0.65
3.6
0.45
1.6
Output Voltage
Waveform
1.5
1.65
-10
0
10
20
30
40
50
60
0.65
2.6
-0.35
1.6
-1.35
Output Voltage
Waveform
0.35
0.6
0.25
-0.4
-2.35
VS = +3.3 V
Bypass Mode
VS = +3.3 V
Bypass Mode
1.4
Input Voltage
Waveform
Input tR/tF = 1 ns
70
-10
0
10
Input Voltage (V)
0.55
1.7
Input Voltage (V)
Output Voltage (V)
1.8
HD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
20
30
40
50
60
70
-3.35
Time (ns)
Time (ns)
Figure 58.
Figure 59.
HD CHANNEL SLEW RATE vs OUTPUT VOLTAGE
600
Slew Rate (V/ms)
500
VS = +3.3 V
Positive and Negative Slew Rate
400
Bypass Mode
300
200
100
Filter Mode
0
0.5
1.0
1.5
2.0
2.5
Output Voltage (VPP)
Figure 60.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
RL = 75 W
-10
RL = 150 W
Filter Mode
-20
-30
-50
RL = 75 W
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
VOUT = 200 mVPP
-60
100 k
1M
100 M
10 M
VO = 1 VPP
-20
VO = 0.2 VPP
-30
VO = 0.2 VPP
-40
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
1M
5.5
VO = 1 VPP
4.5
3.5
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 63.
Figure 64.
Filter Mode
AC
-20
AC- vs DC-Coupled Outputs
-30
AC
-40
VS = +5 V
Load = 150 W || 10 pF
VOUT = 200 mVPP
10 M
100 M
1G
1G
Bypass
Mode
5.5
AC
Filter Mode
5.0
4.5
AC or DC
4.0
DC
3.5
3.0
DC
AC- vs DC-Coupled Outputs
6.0
Small-Signal Gain (ns)
DC
-10
100 M
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
0
VO = 2 VPP
VO = 0.2 VPP and 2 VPP
4.0
2.5
100 k
1G
VO = 0.2 VPP
Filter Mode
5.0
VO = 2 VPP
100 M
Bypass
Mode
6.0
3.0
10 M
1G
100 M
SD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
Small-Signal Gain (dB)
1M
6.5
Large-Signal Gain (dB)
Large-Signal Gain (dB)
VO = 2 VPP
Filter Mode
10
22
RL = 75 W
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
VOUT = 200 mVPP
Figure 62.
-10
1M
3.5
Figure 61.
Bypass
Mode
-60
100 k
4.0
Frequency (Hz)
0
-50
RL = 150 W
RL = 75 W and 150 W
4.5
2.5
100 k
1G
SD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
-60
100 k
Filter Mode
5.0
Frequency (Hz)
10
-50
5.5
3.0
RL = 150 W
10 M
Bypass
Mode
6.0
Small-Signal Gain (dB)
Small-Signal Gain (dB)
0
-40
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
VS = +5 V
Load = 150 W || 10 pF
VOUT = 200 mVPP
2.5
100 k
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 65.
Figure 66.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
SD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
10
0
CL = Stray (2 pF)
-10
Filter Mode
-20
CL = 10 pF
-30
CL = 14 pF
-40
VS = +5 V
Load = 150 W || CL
VOUT = 200 mVPP
-50
CL = 10 pF
-10
Bypass Mode
CL = 20 pF
10 M
-30
CL = 14 pF
-40
Figure 67.
Figure 68.
SD CHANNEL GROUP DELAY vs FREQUENCY
120
0
Bypass
Mode
RL = 75 W and 150 W
-180
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
VOUT = 200 mVPP
-360
100 k
1M
Group Delay (ns)
-135
Filter Mode
100
Filter Mode
-90
Phase (°)
110
RL = 75 W and 150 W
-45
-315
90
70
60
50
10 M
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
VOUT = 200 mVPP
40
100 k
1G
100 M
RL = 75 W and 150 W
80
1M
Frequency (Hz)
Figure 70.
SD CHANNEL GROUP DELAY vs FREQUENCY
SD CHANNEL PSRR vs FREQUENCY
Group Delay (ns)
6.0
60
Bypass Mode
5.5
5.0
RL = 150 W
RL = 75 W
4.5
4.0
3.5
3.0
100 k
1M
10 M
100 M
1G
Power-Supply Rejection Ratio (dB)
7.0
VS = +5 V
DC-Coupled Outputs
Load = 150 W || 10 pF
VOUT = 200 mVPP
100 M
10 M
Frequency (Hz)
Figure 69.
6.5
1G
100 M
Frequency (Hz)
SD CHANNEL PHASE vs FREQUENCY
-270
CL = 20 pF
Frequency (Hz)
45
-225
VS = +5 V
Load = 150 W || CL
VOUT = 200 mVPP
-60
10 M
1G
100 M
CL = Stray (2 pF)
-20
-50
-60
1M
Small-Signal Gain (dB)
Small-Signal Gain (dB)
0
VS = +5 V
50
Bypass Mode
40
30
Filter Mode
20
10
0
100 k
Frequency (Hz)
1M
10 M
100 M
Frequency (Hz)
Figure 71.
Figure 72.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
SD CHANNEL DIFFERENTIAL PHASE
0.50
-0.05
0.45
NTSC
VS = +5 V
Filter Mode
0.40
-0.10
Differential Phase (°)
Differential Gain (%)
SD CHANNEL DIFFERENTIAL GAIN
0
-0.15
PAL
-0.20
-0.25
-0.30
0.35
0.30
PAL
0.25
0.20
NTSC
0.15
0.10
VS = +5 V
Filter Mode
-0.35
0.05
-0.40
0
1st
2nd
3rd
4th
5th
1st
6th
2nd
3rd
Figure 73.
4th
5th
6th
Figure 74.
SD CHANNEL DIFFERENTIAL GAIN
SD CHANNEL DIFFERENTIAL PHASE
0.05
0.07
VS = +5 V
Bypass Mode
VS = +5 V
Bypass Mode
0.06
Differential Phase (°)
Differential Gain (%)
0.04
0.03
0.02
NTSC
0.04
PAL
0.03
0.02
NTSC
0.01
0.01
PAL
0
0
1st
2nd
3rd
4th
5th
1st
6th
3rd
4th
5th
6th
Figure 76.
SD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
SD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
-30
VS = +5 V
Filter Mode
DC-Coupled
-40
-50
VO = 3 VPP
VO = 2 VPP
-60
-70
VO = 0.5 VPP
-80
VO = 1 VPP
-90
-100
-30
VS = +5 V
Filter Mode
DC-Coupled
-40
-50
VO = 3 VPP
-60
VO = 2 VPP
-70
-80
VO = 1 VPP
-90
VO = 0.5 VPP
-100
1
4
1
Frequency (MHz)
4
Frequency (MHz)
Figure 77.
24
2nd
Figure 75.
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
0.05
Figure 78.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
-30
VS = +5 V
Bypass Mode
DC-Coupled
-40
SD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
-30
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
SD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VO = 3 VPP
-50
-60
VO = 2 VPP
-70
VO = 0.5 VPP
-80
-90
VO = 1 VPP
VO = 3 VPP
VS = +5 V
Bypass Mode
DC-Coupled
-40
-50
-60
VO = 2 VPP
-70
VO = 0.5 VPP
-80
-90
VO = 1 VPP
-100
-100
1
10
1
30
10
Frequency (MHz)
Figure 79.
Figure 80.
SD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input tR/tF = 1 ns
Input Voltage
Waveforms
Input tR/tF = 120 ns
4.6
0.65
3.6
Input tR/tF = 1 ns
0.45
1.6
Output Voltage
Waveforms
Input tR/tF = 120 ns
-0.35
2.6
Input tR/tF = 1 ns
-1.35
1.6
-2.35
100 200 300 400 500 600 700 800 900 1000
0
100 200 300 400 500 600 700 800 900 1000
Figure 81.
Figure 82.
SD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input Voltage
Waveform
0.65
3.6
0.55
1.7
0.45
1.6
Output Voltage
Waveform
0.35
VS = +5 V
Bypass Mode
0.25
10
Input Voltage
Waveform
Input tR/tF = 1 ns
0.65
-0.35
2.6
-1.35
1.6
Output Voltage
Waveform
-2.35
0.6
VS = +5 V
Bypass Mode
1.4
0
1.65
Input Voltage (V)
Input tR/tF = 1 ns
4.6
Input Voltage (V)
Output Voltage (V)
1.8
SD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
-10
-3.35
Time (ns)
Time (ns)
1.5
Output Voltage
Waveforms
Input tR/tF = 120 ns
-0.4
-100
0.25
0
0.65
VS = +5 V
Filter Mode
VS = +5 V
Filter Mode
1.4
-100
Input Voltage
Waveforms
Input tR/tF = 120 ns
0.6
0.35
1.5
1.65
Input tR/tF = 1 ns
Input Voltage (V)
0.55
1.7
Input Voltage (V)
Output Voltage (V)
1.8
SD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
30
Frequency (MHz)
20
30
40
50
60
70
80
90
100
-0.4
-10
0
10
20
30
40
50
60
70
80
90
100
-3.35
Time (ns)
Time (ns)
Figure 83.
Figure 84.
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
CROSSTALK vs FREQUENCY
-10
VS = +5 V
Filter Modes
Input-Referred
-20
-30
-20
-30
HD In, HD Out
-40
Crosstalk (dB)
Crosstalk (dB)
CROSSTALK vs FREQUENCY
-10
HD In, SD Out
-50
-60
-70
VS = +5 V
Bypass Modes
Input-Referred
-40
-50
SD In, HD Out
-60
HD In, SD Out
SD In, SD Out
-90
100 k
1M
-80
SD In, HD Out
10 M
-90
100 k
1G
100 M
1M
100 M
Frequency (Hz)
Figure 85.
Figure 86.
SD CHANNEL SLEW RATE vs OUTPUT VOLTAGE
1G
TOTAL QUIESCENT CURRENT vs TEMPERATURE
25
Bypass Mode
Total Quiescent Current (mA)
SD and HD Channels On
100
Slew Rate (V/ms)
10 M
Frequency (Hz)
120
80
VS = +5 V
Positive and Negative Slew Rate
60
40
Filter Mode
20
0
20
15
SD Channels Off, HD Channels On
10
SD Channels On, HD Channels Off
5
VS = +5 V
No Load
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-40
35
60
Ambient Temperature (°C)
Figure 87.
Figure 88.
SD CHANNEL ATTENUATION AT 6.75 MHz vs
TEMPERATURE
SD CHANNEL ATTENUATION AT 27 MHz vs
TEMPERATURE
85
57
VS = +5 V
Relative to 500 kHz
Attenuation at 27 MHz (dB)
0.8
10
-15
Output Voltage (VPP)
1.0
Attenuation at 6.75 MHz (dB)
SD In, SD Out
-70
-80
0.6
0.4
0.2
0
56
VS = +5 V
Relative to 500 kHz
55
54
53
52
51
-0.2
50
-0.4
-40
26
HD In, HD Out
-15
10
35
60
85
-40
-15
10
35
Ambient Temperature (°C)
Ambient Temperature (°C)
Figure 89.
Figure 90.
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85
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TYPICAL CHARACTERISTICS: 5 V, Standard-Definition (SD) Channels (continued)
With load = 150 Ω || 10 pF, dc-coupled input and output, unless otherwise noted.
OUTPUT OFFSET VOLTAGE vs TEMPERATURE
Output Offset Voltage (mV)
325
320
VS = +5 V
Input = 0 V
315
SD Channels
310
305
HD Channels
300
295
-40
-15
10
35
60
85
Ambient Temperature (°C)
Figure 91.
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TYPICAL CHARACTERISTICS: 5 V, High-Definition (HD) Channels
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
Small-Signal Gain (dB)
Small-Signal Gain (dB)
RL = 150 W
-10
RL = 75 W
Filter Mode
-20
-30
-40
-50
VS = +5 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
1M
RL = 150 W
RL = 75 W
RL = 75 W
10 M
Figure 93.
VO = 0.2 VPP
Filter Mode
-10
VO = 1 VPP
-20
VO = 2 VPP
-30
VO = 0.2 VPP
VS = +5 V
DC-Coupled Output
Load = 150 W || 8 pF
1G
100 M
Figure 92.
HD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
6.5
Bypass
Mode
6.0
Large-Signal Gain (dB)
Large-Signal Gain (dB)
VS = +5 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
1M
Bypass
Mode
5.5
VO = 0.2 VPP
Filter Mode
5.0
VO = 1 VPP
4.5
VO = 0.2 VPP and 2 VPP
4.0
3.5
3.0
VO = 2 VPP
VS = +5 V
DC-Coupled Output
Load = 150 W || 8 pF
VO = 2 VPP
2.5
1M
100 M
10 M
1M
1G
Frequency (Hz)
Figure 94.
Figure 95.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
0
-10
Filter Mode
AC
-20
-30
AC
VS = +5 V
Load = 150 W || 8 pF
VOUT = 200 mVPP
6.5
6.0
5.5
5.0
100 M
10 M
AC
Filter Mode
AC or DC
4.5
DC
4.0
3.5
3.0
DC
Bypass
Mode
AC- vs DC-Coupled Outputs
7.0
Small-Signal Gain (dB)
DC
AC- vs DC-Coupled Outputs
1G
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
7.5
Bypass
Mode
1M
100 M
10 M
Frequency (Hz)
10
Small-Signal Gain (dB)
3.5
Frequency (Hz)
-50
28
RL = 75 W and 150 W
4.0
Frequency (Hz)
0
-50
RL = 150 W
4.5
2.5
HD CHANNEL LARGE-SIGNAL GAIN vs FREQUENCY
-40
Filter Mode
5.0
1G
100 M
10
-40
5.5
3.0
10 M
Bypass
Mode
6.0
0
VS = +5 V
Load = 150 W || 8 pF
VOUT = 200 mVPP
2.5
1G
1M
100 M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 96.
Figure 97.
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TYPICAL CHARACTERISTICS: 5 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
HD CHANNEL SMALL-SIGNAL GAIN vs FREQUENCY
10
10
0
CL = Stray (2 pF)
Filter Mode
-10
-20
CL = 14 pF
CL = 8 pF
-30
-40
VS = +5 V
Load = 150 W || CL
VOUT = 200 mVPP
Small-Signal Gain (dB)
Small-Signal Gain (dB)
0
CL = 8 pF
-10
-30
-40
CL = 20 pF
-50
10 M
100 M
1G
Figure 99.
HD CHANNEL GROUP DELAY vs FREQUENCY
Filter Mode
Group Delay (ns)
Phase (°)
-315
-360
35
RL = 75 W and 150 W
-90
-270
RL = 75 W and 150 W
VS = +5 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
1M
Bypass
Mode
30
VS = +5 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
20
RL = 75 W and 150 W
15
10
5
10 M
1G
100 M
1M
Figure 101.
HD CHANNEL GROUP DELAY vs FREQUENCY
VS = +5 V
DC-Coupled Output
Load = RL || 8 pF
VOUT = 200 mVPP
4.5
Bypass
Mode
4.0
3.5
RL = 75 W
3.0
2.5
2.0
100 k
RL = 150 W
1M
HD CHANNEL PSRR vs FREQUENCY
60
Power-Supply Rejection Ratio (dB)
Group Delay (ns)
5.0
100 M
10 M
Frequency (Hz)
Figure 100.
5.5
Filter
Mode
25
Frequency (Hz)
6.0
1G
Figure 98.
0
-225
100 M
Frequency (Hz)
40
-180
CL = 20 pF
Frequency (Hz)
HD CHANNEL PHASE vs FREQUENCY
-135
CL = 14 pF
VS = +5 V
Load = 150 W || CL
VOUT = 200 mVPP
-50
10 M
45
-45
CL = Stray (2 pF)
Bypass Mode
-20
10 M
100 M
1G
VS = +5 V
50
40
Bypass Mode
30
Filter Mode
20
10
0
100 k
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 102.
Figure 103.
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TYPICAL CHARACTERISTICS: 5 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
-30
VS = +5 V
Filter Mode
DC-Coupled
-40
HD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
HD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VO = 3 VPP
-50
VO = 2 VPP
-60
VO = 1 VPP
-70
-80
VO = 0.5 VPP
-90
-100
-30
VS = +5 V
Filter Mode
DC-Coupled
-40
-50
VO = 2 VPP
VO = 1 VPP
-70
-80
-90
VO = 0.5 VPP
-100
1
10
1
16
10
Figure 104.
Figure 105.
HD CHANNEL SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
HD CHANNEL THIRD-ORDER HARMONIC DISTORTION vs
FREQUENCY
-30
VS = +5 V
Bypass Mode
DC-Coupled
-40
VO = 3 VPP
-50
-60
VO = 2 VPP
-70
-80
-90
VO = 1 VPP
VO = 0.5 VPP
-100
-30
VS = +5 V
Bypass Mode
DC-Coupled
-40
VO = 3 VPP
-50
VO = 2 VPP
-60
-70
VO = 1 VPP
VO = 0.5 VPP
-80
-90
-100
1
10
1
60
10
Frequency (MHz)
Figure 107.
HD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input tR/tF = 1 ns
1.8
Input Voltage
Waveforms
Input tR/tF = 33.6 ns
4.6
0.65
3.6
0.45
1.6
Input tR/tF = 33.6 ns
0.35
1.5
0.25
1.4
0
Input Voltage
Waveforms
Input tR/tF = 33.6 ns
0.65
-0.35
2.6
Output Voltage
Waveforms
Input tR/tF = 1 ns
-1.35
1.6
Input tR/tF = 33.6 ns
-2.35
0.6
VS = +5 V
Filter Mode
VS = +5 V
Filter Mode
-50
1.65
Input tR/tF = 1 ns
Input Voltage (V)
Output Voltage
Waveforms
Input tR/tF = 1 ns
Input Voltage (V)
0.55
1.7
HD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
60
Frequency (MHz)
Figure 106.
Output Voltage (V)
16
Frequency (MHz)
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
Frequency (MHz)
50
100
150
200
250
-0.4
-50
0
50
100
150
200
250
-3.35
Time (ns)
Time (ns)
Figure 108.
30
VO = 3 VPP
-60
Figure 109.
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TYPICAL CHARACTERISTICS: 5 V, High-Definition (HD) Channels (continued)
With load = 150 Ω || 8 pF, dc-coupled input and output, unless otherwise noted.
HD CHANNEL SMALL-SIGNAL PULSE RESPONSE vs TIME
Input Voltage
Waveform
Input tR/tF = 1 ns
4.6
0.65
3.6
0.45
1.6
Output Voltage
Waveform
-1.35
1.6
Output Voltage
Waveform
-0.4
0.25
10
-0.35
-2.35
VS = +5 V
Bypass Mode
1.4
0
20
30
40
50
60
70
80
90
100
0
-10
10
20
30
40
50
60
70
80
90
100
-3.35
Time (ns)
Time (ns)
Figure 110.
Figure 111.
HD CHANNEL SLEW RATE vs OUTPUT VOLTAGE
HD CHANNEL ATTENUATION AT 27 MHz vs
TEMPERATURE
600
0.8
Bypass Mode
Attenuation at 27 MHz (dB)
500
Slew Rate (V/ms)
0.65
2.6
VS = +5 V
Bypass Mode
-10
Input Voltage
Waveform
Input tR/tF = 1 ns
0.6
0.35
1.5
1.65
Input Voltage (V)
0.55
1.7
Input Voltage (V)
Output Voltage (V)
1.8
HD CHANNEL LARGE-SIGNAL PULSE RESPONSE vs TIME
0.75
Output Voltage (V)
1.9
VS = +5 V
Positive and Negative Slew Rate
400
300
200
Filter Mode
100
0.6
VS = +5 V
Relative to 500 kHz
0.4
0.2
0
-0.2
-0.4
0
-0.6
0.5
1.0
1.5
2.0
3.0
2.5
3.5
4.0
-40
10
-15
35
Output Voltage (VPP)
Ambient Temperature (°C)
Figure 112.
Figure 113.
60
85
HD CHANNEL ATTENUATION AT 74 MHz vs
TEMPERATURE
Attenuation at 74 MHz (dB)
45
44
VS = +5 V
Relative to 500 kHz
43
42
41
40
39
38
-40
-15
10
35
60
85
Ambient Temperature (°C)
Figure 114.
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APPLICATION INFORMATION
The THS7365 is targeted for six-channel video output
applications that require three standard-definition
(SD) video output buffers and three high-definition
(HD) output buffers. Although it can be used for
numerous other applications, the needs and
requirements of the video signal are the most
important design parameters of the THS7365. Built
on the revolutionary, complementary Silicon
Germanium (SiGe) BiCom3X process, the THS7365
incorporates many features not typically found in
integrated video parts while consuming very low
power. The THS7365 includes the following features:
• Single-supply 2.7-V to 5-V operation with low total
quiescent current of 20.7 mA at 3.3 V and 21.6
mA at 5 V
• Disable mode allows for shutting down individual
SD/HD blocks of amplifiers to save system power
in power-sensitive applications
• Input configuration accepting dc + level shift, ac
sync-tip clamp, or ac-bias
– AC-biasing is allowed with the use of external
pull-up resistors to the positive power supply
• Sixth-order, low-pass filter for DAC reconstruction
or ADC image rejection:
– 9.5 MHz for NTSC, PAL, SECAM, composite
video (CVBS), S-Video Y’/C’, 480i/576i,
Y’/P’B/P’R, and G’B’R’ (R’G’B’) signals
– 36 MHz for 720p, 1080i, or up to 1080p30
Y’/P’B/P’R or G’B’R’ signals; also allows up to
XGA (1024 × 768 at 60 Hz) R'G'B' video
• Individually-controlled Bypass mode bypasses the
low-pass filters for each SD/HD block of amplifiers
– SD bypass mode features 130-MHz and
100-V/µs performance
– HD bypass mode features 250-MHz and
500-V/µs performance
• Individually-controlled Disable mode shuts down
all amplifiers in each SD/HD block to reduce
quiescent current to less than 1 µA
• Internally-fixed gain of 2-V/V (+6-dB) buffer that
can drive two video lines with dc-coupling or
traditional ac-coupling
• Flow-through configuration using a TSSOP-20
package that complies with the latest lead-free
(RoHS-compatible) and green manufacturing
requirements
OPERATING VOLTAGE
The THS7365 is designed to operate from 2.7 V to
5 V over a –40°C to +85°C temperature range. The
impact on performance over the entire temperature
range is negligible as a result of the implementation
of thin film resistors and high-quality, low-temperature
coefficient capacitors. The design of the THS7365
32
allows operation down to 2.6 V, but it is
recommended to use at least a 3-V supply to ensure
that no issues arise with headroom or clipping with
100% color-saturated CVBS signals. If only 75% color
saturated CVBS is supported, then the output voltage
requirements are reduced to 2 VPP on the output,
allowing a 2.7-V supply to be utilized without issues.
A 0.1-µF to 0.01-µF capacitor should be placed as
close as possible to the power-supply pins. Failure to
do so may result in the THS7365 outputs ringing or
oscillating. Additionally, a large capacitor (such as
22 µF to 100 µF) should be placed on the
power-supply line to minimize interference with
50-/60-Hz line frequencies.
INPUT VOLTAGE
The THS7365 input range allows for an input signal
range from –0.2 V to approximately (VS+ – 1.5 V).
However, because of the internal fixed gain of 2 V/V
(+6 dB) and the internal input level shift of 150 mV
(typical), the output is generally the limiting factor for
the allowable linear input range. For example, with a
5-V supply, the linear input range is from –0.2 V to
3.5 V. However, because of the gain and level shift,
the linear output range limits the allowable linear
input range to approximately –0.1 V to 2.3 V.
INPUT OVERVOLTAGE PROTECTION
The THS7365 is built using a very high-speed,
complementary, bipolar, and CMOS process. The
internal junction breakdown voltages are relatively
low for these very small geometry devices. These
breakdowns are reflected in the Absolute Maximum
Ratings table. All input and output device pins are
protected with internal ESD protection diodes to the
power supplies, as shown in Figure 115.
+VS
External
Input/Output
Pin
Internal
Circuitry
Figure 115. Internal ESD Protection
These diodes provide moderate protection to input
overdrive voltages above and below the supplies as
well. The protection diodes can typically support
30 mA of continuous current when overdriven.
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TYPICAL CONFIGURATION AND VIDEO
TERMINOLOGY
the definition of luminance as stipulated by the
International Commission on Illumination (CIE). Video
departs from true luminance because a nonlinear
term, gamma, is added to the true RGB signals to
form R’G’B’ signals. These R’G’B’ signals are then
used to mathematically create luma (Y’). Thus,
luminance (Y) is not maintained, providing a
difference in terminology.
A typical application circuit using the THS7365 as a
video buffer is shown in Figure 116. It shows a DAC
or encoder driving the input channels of the
THS7365. One channel is a CVBS connection while
two other channels are for the S-Video Y’/C’ signals
of an SD video system. These signals can be NTSC,
PAL, or SECAM signals. The other three channels
are the component video Y’/P’B/P’R (sometimes
labeled Y’U’V’ or incorrectly labeled Y’/C’B/C’R)
signals. These signals are typically 720p, 1080i, or up
to 1080p30 signals. If the video DAC / SOC samples
at greater than 74.25 MHz, then 480i/576i or
480p/576p signals are also supported while
effectively minimizing DAC images. Because the
filters can be bypassed, other formats such as
1080p60 (also known as Full-HD or True-HD) and
R'G'B' video up to UWXGA can also be supported
with the THS7365.
This rationale is also used for the chroma (C’) term.
Chroma is derived from the nonlinear R’G’B’ terms
and, thus, it is nonlinear. Chominance (C) is derived
from linear RGB, giving the difference between
chroma (C’) and chrominance (C). The color
difference signals (P’B/P’R/U’/V’) are also referenced
in this manner to denote the nonlinear (gamma
corrected) signals.
Note that the Y’ term is used for the luma channels
throughout this document rather than the more
common luminance (Y) term. This usage accounts for
THS7365
CVBS
75 W
CVBS
R
SD1 IN
SD1 OUT 20
2
SD2 IN
SD2 OUT 19
3
SD3 IN
SD3 OUT 18
75 W
S-Video Y' Out
75 W
S-Video Y’
R
SOC/DAC/Encoder
1
+2.7 V to
+5 V
S-Video C’
R
Y'/G'
4
NC
Disable SD 17
5
VS+
GND 16
6
NC
Disable HD 15
7
HD1 IN
HD1 OUT 14
8
HD2 IN
HD2 OUT 13
9
HD3 IN
HD3 OUT 12
10
Bypass SD Bypass HD 11
Disable SD
75 W
Disable HD
S-Video C' Out
75 W
75 W
Y'/G' Out
75 W
R
75 W
Bypass
SD LPF
P'B/B'
Bypass
HD LPF
P'B/B' Out
75 W
R
75 W
P'R/R' Out
P'R/R'
75 W
R
75 W
Figure 116. Typical Six-Channel System Inputs from DC-Coupled Encoder/DAC with DC-Coupled Line
Driving
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R’G’B’ (commonly mislabeled RGB) is also called
G’B’R’ (again commonly mislabeled as GBR) in
professional video systems. The Society of Motion
Picture
and
Television
Engineers
(SMPTE)
component standard stipulates that the luma
information is placed on the first channel, the blue
color difference is placed on the second channel, and
the red color difference signal is placed on the third
channel. This practice is consistent with the Y'/P'B/P'R
nomenclature. Because the luma channel (Y') carries
the sync information and the green channel (G') also
carries the sync information, it makes logical sense
that G' be placed first in the system. Because the
blue color difference channel (P'B) is next and the red
color difference channel (P'R) is last, then it also
makes logical sense to place the B' signal on the
second channel and the R' signal on the third
channel, respectfully. Thus, hardware compatibility is
better achieved when using G'B'R' rather than R'G'B'.
Note that for many G'B'R' systems, sync is embedded
on all three channels, but this configuration may not
always be the case in all systems.
INPUT MODE OF OPERATION: DC
The inputs to the THS7365 allow for both ac- and
dc-coupled inputs. Many DACs or video encoders can
be dc-connected to the THS7365. One of the
drawbacks to dc-coupling is when 0 V is applied to
the input. Although the input of the THS7365 allows
for a 0-V input signal without issue, the output swing
of a traditional amplifier cannot yield a 0-V signal
resulting in possible clipping. This limitation is true for
any single-supply amplifier because of the
characteristics of the output transistors. Neither
CMOS nor bipolar transistors can achieve 0 V while
sinking current. This transistor characteristic is also
the same reason why the highest output voltage is
always less than the power-supply voltage when
sourcing current.
This output clipping can reduce the sync amplitudes
(both horizontal and vertical sync) on the video
signal. A problem occurs if the video signal receiver
uses an automatic gain control (AGC) loop to account
for losses in the transmission line. Some video AGC
circuits derive gain from the horizontal sync
amplitude. If clipping occurs on the sync amplitude,
then the AGC circuit can increase the gain too
much—resulting in too much luma and/or chroma
amplitude gain correction. This correction may result
in a picture with an overly bright display with too
much color saturation.
34
Other AGC circuits use the chroma burst amplitude
for amplitude control; reduction in the sync signals
does not alter the proper gain setting. However, it is
good engineering design practice to ensure that
saturation/clipping does not take place. Transistors
always take a finite amount of time to come out of
saturation. This saturation could possibly result in
timing delays or other aberrations on the signals.
To eliminate saturation or clipping problems, the
THS7365 has a 150-mV input level shift feature. This
feature takes the input voltage and adds an internal
+150-mV shift to the signal. Because the THS7365
also has a gain of 6 dB (2 V/V), the resulting output
with a 0-V applied input signal is approximately 300
mV. The THS7365 rail-to-rail output stage can create
this output level while connected to a typical video
load. This configuration ensures that no saturation or
clipping of the sync signals occur. This shift is
constant, regardless of the input signal. For example,
if a 1-V input is applied, the output is 2.3 V.
Because the internal gain is fixed at +6 dB, the gain
dictates what the allowable linear input voltage range
can be without clipping concerns. For example, if the
power supply is set to 3 V, the maximum output is
approximately 2.9 V while driving a significant amount
of current. Thus, to avoid clipping, the allowable input
is ([2.9 V/2] – 0.15 V) = 1.3 V. This range is valid for
up to the maximum recommended 5-V power supply
that allows approximately a ([4.9 V/2] – 0.15 V) = 2.3
V input range while avoiding clipping on the output.
The input impedance of the THS7365 in this mode of
operation is dictated by the internal, 800-kΩ
pull-down resistor, as shown in Figure 117. Note that
the internal voltage shift does not appear at the input
pin; it only shows at the output pin.
+VS
Internal
Circuitry
Input
Pin
800 kW
Level
Shift
Figure 117. Equivalent DC Input Mode Circuit
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INPUT MODE OF OPERATION: AC SYNC TIP
CLAMP
Some video DACs or encoders are not referenced to
ground but rather to the positive power supply. The
resulting video signals are generally at too great a
voltage for a dc-coupled video buffer to function
properly. To account for this scenario, the THS7365
incorporates a sync-tip clamp circuit. This function
requires a capacitor (nominally 0.1 µF) to be in series
with the input. Although the term sync-tip-clamp is
used throughout this document, it should be noted
that the THS7365 would probably be better termed as
a dc restoration circuit based on how this function is
performed. This circuit is an active clamp circuit and
not a passive diode clamp function.
The input to the THS7365 has an internal control loop
that sets the lowest input applied voltage to clamp at
ground (0 V). By setting the reference at 0 V, the
THS7365 allows a dc-coupled input to also function.
Therefore, the sync-tip-clamp (STC) is considered
transparent because it does not operate unless the
input signal goes below ground. The signal then goes
through the same 150-mV level shifter, resulting in an
output voltage low level of 300 mV. If the input signal
tries to go below 0 V, the THS7365 internal control
loop sources up to 6 mA of current to increase the
input voltage level on the THS7365 input side of the
coupling capacitor. As soon as the voltage goes
above the 0-V level, the loop stops sourcing current
and becomes very high impedance.
One of the concerns about the sync-tip-clamp level is
how the clamp reacts to a sync edge that has
overshoot—common in VCR signals, noise, DAC
overshoot, or reflections found in poor printed circuit
board (PCB) layouts. Ideally, the STC should not
react to the overshoot voltage of the input signal.
Otherwise, this response could result in clipping on
the rest of the video signal because it may raise the
bias voltage too much.
To help minimize this input signal overshoot problem,
the control loop in the THS7365 has an internal
low-pass filter, as shown in Figure 118. This filter
reduces the response time of the STC circuit. This
delay is a function of how far the voltage is below
ground, but in general it is approximately a 400-ns
delay for the 9.5-MHz filters and approximately a
150-ns delay for the 36-MHz filters. The effect of this
filter is to slow down the response of the control loop
so as not to clamp on the input overshoot voltage but
rather the flat portion of the sync signal.
As a result of this delay, sync may have an apparent
voltage shift. The amount of shift depends on the
amount of droop in the signal as dictated by the input
capacitor and the STC current flow. Because sync is
used primarily for timing purposes with syncing
occurring on the edge of the sync signal, this shift is
transparent in most systems.
+VS
Internal
Circuitry
STC LPF
+VS
gm
Input
0.1 mF Input
Pin
800 kW
Level
Shift
Figure 118. Equivalent AC Sync-Tip-Clamp Input
Circuit
While this feature may not fully eliminate overshoot
issues on the input signal, in cases of extreme
overshoot and/or ringing, the STC system should help
minimize improper clamping levels. As an additional
method to help minimize this issue, an external
capacitor (for example, 10 pF to 47 pF) to ground in
parallel with the external termination resistors can
help filter overshoot problems.
It should be noted that this STC system is dynamic
and does not rely upon timing in any way. It only
depends on the voltage that appears at the input pin
at any given point in time. The STC filtering helps
minimize level shift problems associated with
switching noises or very short spikes on the signal
line. This architecture helps ensure a very robust
STC system.
When the ac STC operation is used, there must also
be some finite amount of discharge bias current. As
previously described, if the input signal goes below
the 0-V clamp level, the internal loop of the THS7365
sources current to increase the voltage appearing at
the input pin. As the difference between the signal
level and the 0-V reference level increases, the
amount
of
source
current
increases
proportionally—supplying up to 6 mA of current.
Thus, the time to re-establish the proper STC voltage
can be very fast. If the difference is very small, then
the source current is also very small to account for
minor voltage droop.
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However, what happens if the input signal goes
above the 0-V input level? The problem is the video
signal is always above this level and must not be
altered in any way. Thus, if the sync level of the input
signal is above this 0-V level, then the internal
discharge (sink) current reduces the ac-coupled bias
signal to the proper 0-V level.
This discharge current must not be large enough to
alter the video signal appreciably or picture quality
issues may arise. This effect is often seen by looking
at the tilt (droop) of a constant luma signal being
applied and the resulting output level. The associated
change in luma level from the beginning and end of
the video line is the amount of line tilt (droop).
If the discharge current is very small, the amount of
tilt is very low, which is a generally a good thing.
However, the amount of time for the system to
capture the sync signal could be too long. This effect
is also termed hum rejection. Hum arises from the ac
line voltage frequency of 50 Hz or 60 Hz. The value
of the discharge current and the ac-coupling capacitor
combine to dictate the hum rejection and the amount
of line tilt.
To allow for both dc- and ac-coupling in the same
part, the THS7365 incorporates an 800-kΩ resistor to
ground. Although a true constant current sink is
preferred over a resistor, there can be issues when
the voltage is near ground. This configuration can
cause the current sink transistor to saturate and
cause potential problems with the signal. The 800-kΩ
resistor is large enough to not impact a dc-coupled
DAC termination. For discharging an ac-coupled
source, Ohm’s Law is used. If the video signal is 1 V,
then there is 1 V/800 kΩ = 1.25-µA of discharge
current. If more hum rejection is desired or there is a
loss of sync occurring, then simply decrease the
0.1-µF input coupling capacitor. A decrease from
0.1 µF to 0.047 µF increases the hum rejection by a
factor of 2.1. Alternatively, an external pull-down
resistor to ground may be added that decreases the
overall resistance and ultimately increases the
discharge current.
To ensure proper stability of the ac STC control loop,
the source impedance must be less than 1-kΩ with
the input capacitor in place. Otherwise, there is a
possibility of the control loop ringing, which may
appear on the output of the THS7365. Because most
DACs or encoders use resistors to establish the
voltage, which are typically less than 300-Ω, meeting
the less than 1-kΩ requirement is easily done.
However, if the source impedance looking from the
THS7365 input perspective is very high, then simply
adding a 1-kΩ resistor to GND ensures proper
operation of the THS7365.
36
INPUT MODE OF OPERATION: AC BIAS
Sync-tip clamps work very well for signals that have
horizontal and/or vertical syncs associated with them;
however, some video signals do not have a sync
embedded within the signal. If ac-coupling of these
signals is desired, then a dc bias is required to
properly set the dc operating point within the
THS7365. This function is easily accomplished with
the THS7365 by simply adding an external pull-up
resistor to the positive power supply, as shown in
Figure 119.
+3.3 V
+3.3 V
CIN
0.1 mF
Input
Internal
Circuitry
RPU
Input
Pin
800 kW
Level
Shift
Figure 119. AC-Bias Input Mode Circuit
Configuration
The dc voltage appearing at the input pin is equal to
Equation 1:
VDC = VS
800 kW
800 kW + RPU
(1)
The THS7365 allowable input range is approximately
0 V to (VS+ – 1.5 V), allowing for a very wide input
voltage range. As such, the input dc bias point is very
flexible, with the output dc bias point being the
primary factor. For example, if the output dc bias
point is desired to be 1.6 V on a 3.3-V supply, then
the input dc bias point should be (1.6 V – 300 mV)/2
= 0.65 V. Thus, the pull-up resistor calculates to
approximately 3.3 MΩ, resulting in 0.644 V. If the
output dc-bias point is desired to be 1.6 V with a 5-V
power supply, then the pull-up resistor calculates to
approximately 5.36 MΩ.
Keep in mind that the internal 800-kΩ resistor has
approximately a ±20% variance. As such, the
calculations should take this variance into account.
For the 0.644-V example above, using an ideal
3.3-MΩ resistor, the input dc bias voltage is
approximately 0.644 V ± 0.1 V.
The value of the output bias voltage is very flexible
and is left to each individual design. It is important to
ensure that the signal does not clip or saturate the
video signal. Thus, it is recommended to ensure the
output bias voltage is between 0.9 V and (VS+ – 1 V).
For 100% color saturated CVBS or signals with
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Macrovision®, the CVBS signal can reach up to
1.23 VPP at the input, or 2.46 VPP at the output of the
THS7365. In contrast, other signals are typically
1 VPP or 0.7 VPP at the input which translate to an
output voltage of 2 VPP or 1.4 VPP. The output bias
voltage must account for a worst-case situation,
depending on the signals involved.
One other issue that must be taken into account is
the dc-bias point is a function of the power supply. As
such, there is an impact on system PSRR. To help
reduce this impact, the input capacitor combines with
the pull-up resistance to function as a low-pass filter.
Additionally, the time to charge the capacitor to the
final dc bias point is a function of the pull-up resistor
and the input capacitor size. Lastly, the input
capacitor forms a high-pass filter with the parallel
impedance of the pull-up resistor and the 800-kΩ
resistor. In general, it is good to have this high-pass
filter at approximately 3 Hz to minimize any potential
droop on a P’B, P’R, or non-sync B’ or R’ signal. A
0.1-µF input capacitor with a 3.3-MΩ pull-up resistor
equates to approximately a 2.5-Hz high-pass corner
frequency.
This mode of operation is recommended for use with
chroma (C’), P’B, P’R, U’, V’, and non-sync R'G'B'
signals. This method can also be used with sync
signals if desired. The benefit of using the STC
function over the ac-bias configuration on embedded
sync signals is that the STC maintains a constant
back-porch voltage as opposed to a back-porch
voltage that fluctuates depending on the video
content. Because the high-pass corner frequency is a
very low 2.5 Hz, the impact on the video signal is
negligible relative to the STC configuration.
One question may arise over the P’B and P’R
channels. For 480i, 576i, 480p, and 576p signals, a
sync may or may not be present. If no sync exists
within the signal, then it is obvious that ac-bias is the
preferred method of ac-coupling the signal.
For 720p, 1080i, and 1080p signals, or for the the
480i, 576i, 480p, and 576p signals with sync present
on the P’B and P’R channels, the lowest voltage of the
sync is –300 mV below the midpoint reference
voltage of 0 V. The P’B and P’R signals allow a signal
to be as low as –350 mV below the midpoint
reference voltage of 0 V. This allowance corresponds
to 100% yellow for P’B signal or 100% cyan for P’R
signal . Because the P’B and P’R signal voltage can
be lower than the sync voltage, there exists a
potential for clipping of the signal for a short period of
time if the signals drop below the sync voltage.
The THS7365 does include a 150-mV input level
shift, or 300 mV at the output, that should mitigate
any clipping issues. For example, if a STC is used,
then the bottom of the sync is 300 mV at the output.
If the signal does go the lowest level, or 50 mV lower
than the sync at the input, then the instantaneous
output is (–50 mV + 150 mV) × 2 = 200 mV at the
output.
Another potential risk is that if this signal (100%
yellow for P’B or 100% cyan for P’R) exists for several
pixels, then the STC circuit engages to raise the
voltage back to 0 V at the input. This function can
cause a 50-mV level shift at the input midway through
the active video signal. This effect is undesirable and
can cause errors in the decoding of the signal.
It is therefore recommended to use ac bias mode for
component P’B and P’R signals when ac-coupling is
desired.
OUTPUT MODE OF OPERATION:
DC-COUPLED
The THS7365 incorporates a rail-to-rail output stage
that can be used to drive the line directly without the
need for large ac-coupling capacitors. This design
offers the best line tilt and field tilt (droop)
performance because no ac-coupling occurs. Keep in
mind that if the input is ac-coupled, then the resulting
tilt as a result of the input ac-coupling continues to be
seen on the output, regardless of the output coupling.
The 80-mA output current drive capability of the
THS7365 is designed to drive two video lines
simultaneously—essentially, a 75-Ω load—while
keeping the output dynamic range as wide as
possible. Figure 120 shows the THS7365 driving two
video lines while keeping the output dc-coupled.
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CVBS 1 Out
75 W
THS7365
CVBS
R
S-Video Y’
SOC/DAC/Encoder
R
S-Video C’
R
Y'/G'
+2.7 V to
+5 V
CVBS 1 Out
75 W
1
SD1 IN
SD1 OUT 20
2
SD2 IN
SD2 OUT 19
3
SD3 IN
SD3 OUT 18
4
NC
Disable SD 17
75 W
75 W
S-Video Y' 1 Out
75 W
Disable SD
S-Video Y' 1 Out
75 W
75 W
5
VS+
GND 16
6
NC
Disable HD 15
7
HD1 IN
HD1 OUT 14
8
HD2 IN
HD2 OUT 13
S-Video C' 1 Out
9
HD3 IN
HD3 OUT 12
75 W
10
Bypass SD Bypass HD 11
Disable HD
75 W
S-Video C' 1 Out
75 W
75 W
75 W
R
Y'/G' 1 Out
75 W
Bypass
SD LPF
P'B/B'
Y'/G' 1 Out
Bypass
HD LPF
75 W
75 W
R
75 W
P'B/B' 1 Out
75 W
P'R/R'
R
P’B/B' 1 Out
75 W
75 W
75 W
P’R/R' 1 Out
75 W
P'R/R' 1 Out
75 W
75 W
75 W
Figure 120. Typical Six-Channel System with DC-Coupled Line Driving and Two Outputs Per Channel
One concern of dc-coupling, however, arises if the
line is terminated to ground. If the ac-bias input
configuration is used, the output of the THS7365 has
a dc bias on the output, such as 1.6 V. With two lines
terminated to ground, this configuration allows a dc
current path to flow, such as 1.6 V/75-Ω = 21.3 mA.
The result of this configuration is a slightly decreased
high output voltage swing and an increase in power
dissipation of the THS7365. While the THS7365 was
designed to operate with a junction temperature of up
to +125°C, care must be taken to ensure that the
junction temperature does not exceed this level or
else long-term reliability could suffer. Using a 5-V
supply, this configuration can result in an additional
dc power dissipation of (5 V – 1.6 V) × 21.3 mA =
72.5 mW per channel. With a 3.3-V supply, this
dissipation reduces to 36.2 mW per channel. The
overall low quiescent current of the THS7365 design
minimizes potential thermal issues even when using
the TSSOP package at high ambient temperatures,
38
but power and thermal analysis should always be
examined in any system to ensure that no issues
arise. Be sure to utilize RMS power and not
instantaneous power when evaluating the thermal
performance.
Note that the THS7365 can drive the line with
dc-coupling regardless of the input mode of
operation. The only requirement is to make sure the
video line has proper termination in series with the
output (typically 75 Ω). This requirement helps isolate
capacitive loading effects from the THS7365 output.
Failure to isolate capacitive loads may result in
instabilities with the output buffer, potentially causing
ringing or oscillations to appear. The stray
capacitance appearing directly at the THS7365 output
pins should be kept below 220 pF for the 9.5-MHz
filter channels and below 15 pF for the 36-MHz filter
channels. One way to help ensure this condition is
satisfied is to make sure the 75-Ω source resistor is
placed next to each THS7365 output pin. If a large
ac-coupling capacitor is used, the capacitor should be
placed after this resistor.
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There are many reasons dc-coupling is desirable,
including reduced costs, PCB area, and no line tilt. A
common question is whether or not there are any
drawbacks to using dc-coupling. There are some
potential issues that must be examined, such as the
dc current bias as discussed above. Another potential
risk is whether this configuration meets industry
standards. EIA-770 stipulates that the back-porch
shall be 0 V ± 1 V as measured at the receiver. With
a double-terminated load system, this requirement
implies a 0 V ± 2 V level at the video amplifier output.
The THS7365 can easily meet this requirement
without issue. However, in Japan, the EIAJ CP-1203
specification stipulates a 0 V ± 0.1 V level with no
signal. This requirement can be met with the
THS7365 in shutdown mode, but while active it
cannot meet this specification without output
ac-coupling. AC-coupling the output essentially
ensures that the video signal works with any system
and any specification. For many modern systems,
however, dc-coupling can satisfy most needs.
OUTPUT MODE OF OPERATION:
AC-COUPLED
A very common method of coupling the video signal
to the line is with a large capacitor. This capacitor is
typically between 220 µF and 1000 µF, although 470
µF is very typical. The value of this capacitor must be
large enough to minimize the line tilt (droop) and/or
field tilt associated with ac-coupling as described
previously in this document. AC-coupling is
performed for several reasons, but the most common
is to ensure full interoperability with the receiving
video system. This approach ensures that regardless
of the reference dc voltage used on the transmitting
side, the receiving side re-establishes the dc
reference voltage to its own requirements.
In the same way as the dc output mode of operation
discussed previously, each line should have a 75-Ω
source termination resistor in series with the
ac-coupling capacitor. This 75-Ω resistor should be
placed next to the THS7365 output to minimize
capacitive loading effects. If two lines are to be
driven, it is best to have each line use its own
capacitor and resistor rather than sharing these
components. This configuration helps ensure
line-to-line dc isolation and eliminates the potential
problems as described previously. Using a single,
1000-µF capacitor for two lines is permissible, but
there is a chance for interference between the two
receivers.
Lastly, because of the edge rates and frequencies of
operation, it is recommended (but not required) to
place a 0.1-µF to 0.01-µF capacitor in parallel with
the large 220-µF to 1000-µF capacitor. These large
value capacitors are most commonly aluminum
electrolytic. It is well-known that these capacitors
have significantly large equivalent series resistance
(ESR), and the impedance at high frequencies is
rather large as a result of the associated inductances
involved with the leads and construction. The small
0.1-µF to 0.01-µF capacitors help pass these
high-frequency signals (greater than 1 MHz) with
much lower impedance than the large capacitors.
Although it is common to use the same capacitor
values for all the video lines, the frequency bandwidth
of the chroma signal in a S-Video system is not
required to go as low (or as high of a frequency) as
the luma channels. Thus, the capacitor values of the
chroma line(s) can be smaller, such as 0.1 µF.
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Figure 121 shows a typical configuration where the
input is ac-coupled and the output is also ac-coupled.
AC-coupled inputs are generally required when
current-sink DACs are used or the input is connected
to an unknown source, such as when the THS7365 is
used as an input device.
Group delay is defined as the change in phase
(radians/second) divided by a change in frequency.
An increase in group delay corresponds to a time
domain pulse response that has overshoot and some
possible ringing associated with the overshoot.
The use of other type of filters, such as elliptic or
chebyshev, are not recommended for video
applications because of the very large group delay
variations near the corner frequency resulting in
significant overshoot and ringing. While these filters
may help meet the video standard specifications with
respect to amplitude attenuation, the group delay is
well beyond the standard specifications. Considering
this delay with the fact that video can go from a white
pixel to a black pixel over and over again, it is easy to
see that ringing can occur. Ringing typically causes a
display to have ghosting or fuzziness appear on the
edges of a sharp transition. On the other hand, a
Bessel filter has ideal group delay response, but the
rate of attenuation is typically too low for acceptable
image rejection. Thus, the Butterworth filter is a
respectable compromise for both attenuation and
group delay.
LOW-PASS FILTER
Each channel of the THS7365 incorporates a
sixth-order,
low-pass
filter.
These
video
reconstruction filters minimize DAC images from
being passed onto the video receiver. Depending on
the receiver design, failure to eliminate these DAC
images can cause picture quality problems because
of aliasing of the ADC in the receiver. Another benefit
of the filter is to smooth out aberrations in the signal
that some DACs can have if the internal filtering is
not very good. This benefit helps with picture quality
and ensures that the signal meets video bandwidth
requirements.
Each filter has an associated Butterworth
characteristic. The benefit of the Butterworth
response is that the frequency response is flat with a
relatively steep initial attenuation at the corner
frequency. The problem with this characteristic is that
the group delay rises near the corner frequency.
THS7365
(1)
0.1 mF
(1)
0.1 mF
+2.7 V to
+5 V
R
(1)
0.1 mF
(1)
0.1 mF
+V
Y'/G'
2
SD2 IN
SD2 OUT 19
75 W
SD3 OUT 18
3
SD3 IN
4
NC
Disable SD 17
5
VS+
GND 16
6
NC
Disable HD 15
7
HD1 IN
HD1 OUT 14
8
HD2 IN
HD2 OUT 13
9
HD3 IN
HD3 OUT 12
10
Bypass SD Bypass HD 11
(2)
Y' Out
330 mF
75 W
Disable SD
To GPIO or
GND/VS+
75 W
Disable HD
(2)
330 mF
75 W
P’B Out
+
R
SD1 OUT 20
75 W
75 W
(2)
330 mF
Y' Out
+
SOC/DAC/Encoder
+V
S-Video C’
SD1 IN
+
RPU
S-Video Y’
1
+
R
+V
(2)
330 mF
75 W
CVBS
75 W
R
(1)
Bypass
HD LPF
75 W
(2)
330 mF
P'B Out
+
Bypass
SD LPF
0.1 mF
+V
P'B/B'
75 W
R
To GPIO or
GND/VS+
(1)
0.1 mF
R
RPU
75 W
(2)
330 mF
P'R Out
+
+V
P'R/R'
75 W
RPU
+V
+2.7 V to +5 V
(1) AC-coupled input is shown in this example. DC-coupling is also allowed as long as the DAC output voltage is within the allowable linear
input and output voltage range of the THS7365. To apply dc-coupling, remove the 0.1-µF input capacitors and the RPU pull-up resistors along
with connecting the DAC termination resistors (R) to ground.
(2) This example shows an ac-coupled output. DC-coupling is also allowed by simply removing these capacitors.
Figure 121. Typical AC Input System Driving AC-Coupled Video Lines
40
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The THS7365 SD filters have a nominal corner
(–3 dB) frequency at 9.5MHz and a –1-dB passband
typically at 8.2MHz. This 9.5-MHz filter is ideal for SD
NTSC, PAL, and SECAM composite video (CVBS)
signals. It is also useful for S-Video signals (Y’C’),
480i/576i Y’/P’B/P’R, Y’U’V’, broadcast G’B’R’ signals,
and computer R'G'B' video signals. The 9.5-MHz,
–3-dB corner frequency was designed to achieve 54
dB of attenuation at 27 MHz—a common sampling
frequency between the DAC/ADC second and third
Nyquist zones found in many video systems. This
consideration is important because any signal that
appears around this frequency can also appear in the
baseband as a result of aliasing effects of an ADC
found in a receiver.
The THS7365 HD filters have a nominal corner
(–3 dB) frequency at 36MHz and a –1-dB passband
typically at 32MHz. This 36-MHz filter is ideal for HD
720p, 1080i, up to 1080p30 Y’/P’B/P’R, broadcast
G’B’R’ signals, and computer R’G’B’ video signals up
to XGA. The 36-MHz, –3-dB corner frequency was
designed to achieve 42 dB of attenuation at 74.25
MHz—a common sampling frequency between the
DAC/ADC second and third Nyquist zones found in
many video systems.
Keep in mind that images do not stop at the DAC
sampling frequency, fS (for example, 27 MHz for
traditional SD DACs); they continue around the
sampling frequencies of 2x fS, 3x fS, 4x fS, and so on
(that is, 54-MHz, 81-MHz, 108-MHz, etc.). Because of
these multiple images, an ADC can fold down into the
baseband signal, meaning that the low-pass filter
must also eliminate these higher-order images. The
THS7365 filters are Butterworth filters and, as such,
do not bounce at higher frequencies, thus maintaining
good attenuation performance.
The filter frequencies were chosen to account for
process variations in the THS7365. To ensure the
required video frequencies are effectively passed, the
filter corner frequency must be high enough to allow
component variations. The other consideration is that
the attenuation must be large enough to ensure the
anti-aliasing/reconstruction filtering is sufficient to
meet the system demands. Thus, the selection of the
filter frequencies was not arbitrarily selected and is a
good compromise that should meet the demands of
most systems.
Bypassing the HD filters results in a amplifier
supporting 250-MHz bandwidth and 500-V/µs slew
rate. This configuration supports 1080p60 signals and
also computer R'G'B' signals up to UWXGA
resolution.
BENEFITS OVER PASSIVE FILTERING
Two key benefits of using an integrated filter system,
such as the THS7365, over a passive system are
PCB area and filter variations. The small TSSOP-20
package for six video channels is much smaller over
a passive RLC network, especially a six-pole passive
network. Additionally, consider that inductors have at
best ±10% tolerances (normally, ±15% to ±20% is
common) and capacitors typically have ±10%
tolerances. Using a Monte Carlo analysis shows that
the filter corner frequency (–3 dB), flatness (–1 dB), Q
factor (or peaking), and channel-to-channel delay
have wide variations. These variances can lead to
potential performance and quality issues in
mass-production environments. The THS7365 solves
most of these problems with the corner frequency
being essentially the only variable.
Another concern about passive filters is the use of
inductors. Inductors are magnetic components, and
are therefore susceptible to electromagnetic
coupling/interference (EMC/EMI). Some common
coupling can occur because of other video channels
nearby using inductors for filtering, or it can come
from nearby switched-mode power supplies. Some
other forms of coupling could be from outside sources
with strong EMI radiation and can cause failure in
EMC testing such as required for CE compliance.
One concern about an active filter in an integrated
circuit is the variation of the filter characteristics when
the ambient temperature and the subsequent die
temperature changes. To minimize temperature
effects, the THS7365 uses low-temperature
coefficient resistors and high-quality, low-temperature
coefficient capacitors found in the BiCom3X process.
These filters have been specified by design to
account for process variations and temperature
variations to maintain proper filter characteristics.
This approach maintains a low channel-to-channel
time delay that is required for proper video signal
performance.
One of the features of the THS7365 is that these
filters can be bypassed. Bypassing the SD filters
results in an amplifier with 130-MHz bandwidth and
100-V/µs slew rate. This configuration can be helpful
when diagnosing potential system issues or when
simply wishing to pass higher frequency signals
through the system.
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THS7365
SBOS467 – MARCH 2009.................................................................................................................................................................................................. www.ti.com
Another benefit of the THS7365 over a passive RLC
filter is the input and output impedance. The input
impedance presented to the DAC varies significantly,
from 35 Ω to over 1.5 kΩ with a passive network, and
may cause voltage variations over frequency. The
THS7365 input impedance is 800 kΩ, and only the
2-pF input capacitance plus the PCB trace
capacitance impact the input impedance. As such,
the voltage variation appearing at the DAC output is
better controlled with a fixed termination resistor and
the high input impedance buffer of the THS7365.
On the output side of the filter, a passive filter again
has a large impedance variation over frequency. The
EIA770 specifications require the return loss to be at
least 25 dB over the video frequency range of usage.
For a video system, this requirement implies the
source impedance (which includes the source, series
resistor, and the filter) must be better than 75 Ω,
+9/–8 Ω. The THS7365 is an operational amplifier
that approximates an ideal voltage source, which is
desirable because the output impedance is very low
and can source and sink current. To properly match
the transmission line characteristic impedance of a
video line, a 75-Ω series resistor is placed on the
output. To minimize reflections and to maintain a
good return loss meeting EIA specifications, this
output impedance must maintain a 75-Ω impedance.
A wide impedance variation of a passive filter cannot
ensure this level of performance. On the other hand,
the THS7365 has approximately 0.7 Ω of output
impedance, or a return loss of 46 dB, at 6.75 MHz for
42
the SD filters and approximately 1.7 Ω of output
impedance, or a return loss of 39 dB, at 30 MHz for
the HD filters. Thus, the system is matched
significantly better with a THS7365 compared to a
passive filter.
One final benefit of the THS7365 over a passive filter
is power dissipation. A DAC driving a video line must
be able to drive a 37.5-Ω load: the receiver 75-Ω
resistor and the 75-Ω impedance matching resistor
next to the DAC to maintain the source impedance
requirement. This requirement forces the DAC to
drive at least 1.25 VP (100% saturation CVBS)/37.5 Ω
= 33.3 mA. A DAC is a current-steering element, and
this amount of current flows internally to the DAC
even if the output is 0 V. Thus, power dissipation in
the DAC may be very high, especially when six
channels are being driven. Using the THS7365 with a
high input impedance and the capability to drive up to
two video lines per channel can reduce DAC power
dissipation significantly. This outcome is possible
because the resistance that the DAC drives can be
substantially increased. It is common to set this
resistance in a DAC by a current-setting resistor on
the DAC itself. Thus, the resistance can be 300 Ω or
more, substantially reducing the current drive
demands from the DAC and saving significant
amounts of power. For example, a 3.3-V, six-channel
DAC dissipates 660 mW alone for the steering
current capability (six channels × 33.3 mA × 3.3 V) if
it must drive a 37.5-Ω load. With a 300-Ω load, the
DAC power dissipation as a result of current steering
current would only be 82 mW (six channels × 4.16
mA × 3.3 V).
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EVALUATION MODULE
To evaluate the THS7365, an evaluation module
(EVM) is available. The EVM allows for testing the
THS7365 in many different configurations. Inputs and
outputs include BNC connectors commonly found in
video systems, along with 75-Ω input termination
resistors, 75-Ω series source termination resistors,
and 75-Ω characteristic impedance traces. Several
unpopulated component pads are found on the EVM
to allow for different input and output configurations
as dictated by the user. This EVM is designed to be
used with a single supply from 2.6 V up to 5 V.
The EVM default input configuration sets all channels
for dc input coupling. The input signal must be within
0 V to approximately 1.4 V for proper operation.
Failure to be within this range saturates and/or clips
the output signal. If the input range is beyond this, or
if the signal voltage is unknown, or coming from a
current sink DAC, then ac input configuration is
desired. This option is easily accomplished with the
EVM by simply replacing Z1 through Z6 0-Ω resistors
with 0.1-µF capacitors.
For ac-coupled input and sync-tip clamp (STC)
functionality commonly used for CVBS, s-video Y',
component Y' signals, and R'G'B' signals with
embedded sync, no other changes are needed.
However, if a bias voltage is needed after the input
capacitor which is commonly needed for s-video C',
component P'B and P'R, and non-sync embedded
R'G'B' signals, then a pull-up resistor should be
added to the signal on the EVM. This configuration is
easily achieved by simply adding a resistor to any of
the following resistor pads; RX7 to RX12. A common
value to use is 3.3 MΩ. Note that even signals with
embedded sync can also use bias mode if desired.
The EVM default output configuration sets all
channels for ac output coupling. The 470-µF and
0.1-µF capacitors work well for most ac-coupled
systems. However, if dc-coupled output is desired,
then replacing the 0.1-µF capacitors (C20, C22, C24,
C26, C28, and/or C30) with 0-Ω resistors works well.
Removing the 470-µF capacitors is optional, but
removing them from the EVM eliminates a few
picofarads of stray capacitance on each signal path
which may be desirable.
The THS7365 incorporates an easy method to
configure the bypass modes and the disable modes.
The use of JP4 controls the SD channels disable
feature; JP6 controls the HD Channels disable
feature; JP3 controls the SD channels filter/bypass
mode; and JP5 controls the HD channels filter/bypass
mode. While there is a space on the EVM for JP1
and JP2, these are not used for the THS7365.
Connection of JP4 and JP6 to GND applies 0 V to the
disable pins and the THS7365 operates normally.
Moving JP4 to +VS causes the THS7365 SD
channels to be in disable mode, while moving JP6 to
+VS causes the THS7365 HD channels to be in
disable mode .
Connection of JP3 to GND places the THS7365 SD
channels in filter mode while moving JP3 to +VS
places the THS7365 HD channels in bypass mode.
Connection of JP5 to GND places the THS7365 HD
channels in filter mode while moving JP5 to +VS
places the THS7365 HD channels in bypass mode.
Figure 122 shows the EVM schematic. Figure 123
and Figure 124 illustrate the two layers of the EVM
PCB, incorporating standard high-speed layout
practices. Table 1 lists the bill of materials as the
board comes supplied from Texas Instruments.
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THS7365
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+
+
+
+
+
+
+
Figure 122. THS7365 EVM Schematic
44
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THS7365
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Figure 123. THS7365 EVM PCB Top Layer
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THS7365
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Figure 124. THS7365 EVM PCB Bottom Layer
46
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THS7365EVM Bill of Materials
Table 1. THS7365 EVM
ITEM
REF DES
QTY
DESCRIPTION
1
FB1
1
Bead, Ferrite, 2.5 A, 330 Ω
SMD SIZE
0805
MANUFACTURER
PART NUMBER
DISTRIBUTOR
PART NUMBER
(TDK) MPZ2012S331A
(Digi-Key) 445-1569-1-ND
(AVX) TPSC107K010R0100
(Digi-Key) 478-1765-1-ND
2
C12
1
Capacitor, 100 µF, Tantalum, 10 V, 10%,
Low-ESR
3
C1-C6,
C13-C18,
C31-C36
18
Open
0805
4
C37
1
Capacitor, 0.01 µF, Ceramic, 100 V, X7R
0805
(AVX) 08051C103KAT2A
(Digi-Key) 478-1358-1-ND
5
C7-C11, C20,
C22, C24, C26,
C28, C30, C38
12
Capacitor, 0.1 µF, Ceramic, 50 V, X7R
0805
(AVX) 08055C104KAT2A
(Digi-Key) 478-1395-1-ND
6
C19, C21, C23,
C25, C27, C29
6
Capacitor, Aluminum, 470 µF, 10 V, 20%
(Cornell) AFK477M10F24B-F
(Newark) 66K0965
7
RX1-RX12
12
Open
0603
8
R10-R13
4
Open
0805
9
Z1-Z4
18
Resistor, 0 Ω
0805
(ROHM) MCR10EZHJ000
(Digi-Key) RHM0.0ACT-ND
10
R1-R6,
R29-R34
12
Resistor, 75 Ω, 1/8 W, 1%
0805
(ROHM) MCR10EZHF75.0
(Digi-Key)
RHM75.0CCT-ND
11
R14
1
Resistor, 100 Ω, 1/8 W, 1%
0805
(ROHM) MCR10EZHF1000
(Digi-Key)
RHM100CCT-ND
12
R15, R17, R24,
R25
4
Resistor, 1 kΩ, 1/8 W, 1%
0805
(ROHM) MCR10EZHF1001
(Digi-Key)
RHM1.00KCCT-ND
13
R16, R18, R22,
R23
4
Resistor, 100 kΩ, 1/8 W, 1%
0805
(ROHM) MCR10EZHF1003
(Digi-Key)
RHM100KCCT-ND
C
F
14
J10, J11
2
Jack, Banana Receptance, 0.25" dia. hole
(SPC) 813
(Newark) 39N867
15
J1-J6, J13-J18
12
Connector, BNC, Jack, 75 Ω
(Amphenol) 31-5329-72RFX
(Newark) 93F7554
16
J8, J20
2
Connector, Mini Circular DIN
(CUI) MD-40SM
(Digi-Key) CP-2240-ND
17
J7, J19
2
Connector, RCA Jack, Yellow
(CUI) RCJ-044
(Digi-Key) CP-1421-ND
18
J9, J12
2
Connector, RCA, Jack, R/A
(CUI) RCJ-32265
(Digi-Key) CP-1446-ND
19
TP1, TP2
2
Test Point, Black
(Keystone) 5001
(Digi-Key) 5001K-ND
20
JP1, JP2
2
Open
3 possible
21
JP3-JP6
4
Header, 0.1" CTRS, 0.025" sq. pins
3 possible
(Sullins) PBC36SAAN
(Digi-Key) S1011E-36-ND
22
JP3-JP6
4
Shunts
(Sullins) SSC02SYAN
(Digi-Key) S9002-ND
23
U1
1
IC, THS7365
24
4
Standoff, 4-40 HEX, 0.625" length
(Keystone) 1808
(Digi-Key) 1808K-ND
25
4
Screw, Phillips, 4-40, 0.250"
(BF) PMS 440 0031 PH
(Digi-Key) H343-ND
26
1
Printed Circuit Board
(TI) Edge# 6505338 Rev. A
PW
(TI) THS7365IPW
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THS7365
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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have
electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete
in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental
measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does
not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling
(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER
AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or
services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or
safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 2.6 V to 5.5 V single-supply and the output voltage range of 0 V to
5.5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than +85°C. The EVM is designed to operate
properly with certain components above +85°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
48
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
THS7365IPW
ACTIVE
TSSOP
PW
20
70
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
THS7365
THS7365IPWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
THS7365
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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