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TIBPAL16R8-15CN

TIBPAL16R8-15CN

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    PDIP-20_25.4X6.35MM

  • 描述:

    IC PLD 15NS 20DIP

  • 数据手册
  • 价格&库存
TIBPAL16R8-15CN 数据手册
TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 D D D DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORTS PAL16L8 10 2 0 6 4 PAL16R4 8 0 4 (3-state buffers) PAL16R6 8 0 6 (3-state buffers) 2 8 (3-state buffers) 0 PAL16R8 8 0 TIBPAL16L8’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) I I I I I I I I I GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O I/O I/O I/O I/O I/O I/O O I TIBPAL16L8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I I I 4 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I/O I/O I/O I/O I/O I GND I O I/O description 3 2 O D High-Performance Operation: Propagation Delay C Suffix . . . 15 ns Max M Suffix . . . 20 ns Max Functionally Equivalent, but Faster Than PAL16L8A, PAL16R4A, PAL16R6A, and PAL16R8A Power-Up Clear on Registered Devices (All Register Outputs Are Set High, but Voltage Levels at the Output Pins Go Low) Package Options Include Both Plastic and Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs Dependable Texas Instruments Quality and Reliability I I I VCC D These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space. The TIBPAL16’ C series is characterized from 0°C to 75°C. The TIBPAL16’ M series is characterized for operation over the full military temperature range of –55°C to 125°C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. These devices are covered by U.S. Patent 4,410,987. IMPACT is a trademark of Texas Instruments. PAL is a registered trademark of Advanced Micro Devices Inc. Copyright  2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 15 7 14 8 13 9 12 10 11 TIBPAL16R6’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) CLK I I I I I I I I GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC I/O Q Q Q Q Q Q I/O OE TIBPAL16R8’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) CLK I I I I I I I I GND 2 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC Q Q Q Q Q Q Q Q OE POST OFFICE BOX 655303 I/O 6 5 17 6 16 7 15 8 14 9 10 11 12 13 I/O Q Q Q Q TIBPAL16R6’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I I I 3 2 I/O 16 1 20 19 18 4 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 Q Q Q Q Q TIBPAL16R8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I I I I I 3 2 Q 5 3 2 OE I/O I/O 17 4 OE I/O Q 4 I I I I I 4 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 • DALLAS, TEXAS 75265 OE Q Q 18 I I CLK VCC 3 VCC I/O I/O Q Q Q Q I/O I/O OE I GND 19 I I CLK VCC 20 2 I GND 1 I I CLK VCC CLK I I I I I I I I GND TIBPAL16R4’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE (TOP VIEW) I GND TIBPAL16R4’ C SUFFIX . . . J OR N PACKAGE M SUFFIX . . . J OR W PACKAGE (TOP VIEW) Q Q Q Q Q TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C TIBPAL 16L8-20M, TIBPAL 16R4-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 functional block diagrams (positive logic) TIBPAL16L8’ & 32 × 64 16 × 10 I 16 6 16 EN ≥ 1 7 O 7 O 7 I/O 7 I/O 7 I/O 7 I/O 7 I/O 7 I/O 6 TIBPAL16R4’ OE CLK EN 2 C1 & 32 × 64 I 16 × 8 ≥1 8 I=1 2 Q 1D 8 Q 8 Q 8 Q 16 4 4 16 EN ≥ 1 7 I/O 7 I/O 7 I/O 7 I/O 4 4 denotes fused inputs POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16R6-15C, TIBPAL 16R8-15C TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 functional block diagrams (positive logic) TIBPAL16R6’ OE CLK EN 2 C1 & 32 × 64 I 16 × 8 ≥1 8 I=1 2 Q 1D 8 Q 8 Q 8 Q 8 Q 8 Q 16 6 2 16 EN ≥ 1 7 I/O I/O 7 2 6 TIBPAL16R8’ OE CLK EN 2 C1 & 32 × 64 16 × I 8 8 ≥1 I=1 2 8 Q 8 Q 8 Q 8 Q 8 Q 8 Q 8 Q 16 8 16 8 denotes fused inputs 4 Q 1D POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C TIBPAL 16L8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 logic diagram (positive logic) I 1 First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 Increment 0 4 8 12 16 20 24 28 0 32 64 96 128 160 192 224 31 19 256 288 320 352 384 416 448 480 18 512 544 576 608 640 672 704 736 17 768 800 832 864 896 928 960 992 16 1024 1056 1088 1120 1152 1184 1216 1248 15 1280 1312 1344 1376 1408 1440 1472 1504 14 1536 1568 1600 1632 1664 1696 1728 1760 13 1792 1824 1856 1888 1920 1952 1984 2016 12 11 O I/O I/O I/O I/O I/O I/O O I Fuse number = First fuse number + Increment POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16R4-15C TIBPAL 16R4-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 logic diagram (positive logic) CLK 1 First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 Increment 0 4 8 12 16 20 24 31 19 256 288 320 352 384 416 448 480 18 512 544 576 608 640 672 704 736 I=1 1D 768 800 832 864 896 928 960 992 I=1 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=1 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=1 1D 17 I/O I/O Q C1 16 Q C1 15 Q C1 14 Q C1 1536 1568 1600 1632 1664 1696 1728 1760 13 1792 1824 1856 1888 1920 1952 1984 2016 12 11 Fuse number = First fuse number + Increment 6 28 0 32 64 96 128 160 192 224 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 I/O I/O OE TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16R6-15C TIBPAL 16R6-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 logic diagram (positive logic) CLK 1 Increment First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 0 4 8 12 16 20 24 28 31 0 32 64 96 128 160 192 224 19 256 288 320 352 384 416 448 480 I=1 1D 512 544 576 608 640 672 704 736 I=1 1D 768 800 832 864 896 928 960 992 I=1 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=1 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=1 1D 1536 1568 1600 1632 1664 1696 1728 1760 I=1 1D 18 I/O Q C1 17 Q C1 16 Q C1 15 Q C1 14 Q C1 13 Q C1 1792 1824 1856 1888 1920 1952 1984 2016 12 11 I/O OE Fuse number = First fuse number + Increment POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16R8-15C TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 logic diagram (positive logic) CLK 1 First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 Increment 0 4 8 12 16 20 24 28 31 0 32 64 96 128 160 192 224 I=1 1D 256 288 320 352 384 416 448 480 I=1 1D 512 544 576 608 640 672 704 736 I=1 1D 768 800 832 864 896 928 960 992 I=1 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=1 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=1 1D 1536 1568 1600 1632 1664 1696 1728 1760 I=1 1D 1792 1824 1856 1888 1920 1952 1984 2016 I=1 1D 19 Q C1 18 Q C1 17 Q C1 16 Q C1 15 Q C1 14 Q C1 13 Q C1 12 Q C1 11 OE Fuse number = First fuse number + Increment 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Voltage applied to disabled output (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 75°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C NOTE 1: These ratings apply, except for programming pins, during a programming cycle. recommended operating conditions MIN NOM MAX UNIT 4.75 5 5.25 V 5.5 V 0.8 V VCC VIH Supply voltage VIL IOH Low-level input voltage High-level output current –3.2 mA IOL fclock Low-level output current 24 mA 50 MHz High-level input voltage 2 Clock frequency 0 tw duration clock (see Note 2) Pulse duration, tsu th Setup time, input or feedback before clock↑ Hold time, input or feedback after clock↑ High 8 Low 9 ns 15 ns 0 ns TA Operating free-air temperature 0 25 75 °C NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are for clock high or low only, but not for both simultaneously. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range PARAMETER TEST CONDITIONS VIK VOH VCC = 4.75 V, VCC = 4.75 V, II = –18 mA IOH = –3.2 mA VOL VCC = 4.75 V, IOL = 24 mA VCC = 5 5.25 25 V V, VO = 2 2.7 7V VCC = 5 5.25 25 V V, VO = 0 0.4 4V II IIH VCC = 5.25 V, VCC = 5.25 V, VI = 5.5 V VI = 2.7 V IIL IO‡ VCC = 5.25 V, VCC = 5.25 V, VI = 0.4 V VO = 2.25 V IOZH IOZL Outputs I/O ports Outputs I/O ports MIN 2.4 TYP† MAX UNIT –1.5 V 3.3 0.35 V 0.5 20 100 –20 –250 –30 V µA µA 0.1 mA 20 µA –0.2 mA –125 mA ICC VCC = 5.25 V, VI = 0, Outputs open 140 180 mA † All typical values are at VCC = 5 V, TA = 25°C. ‡ The output conditions have been chosen to produce a current that closely approximates one-half of the short-circuit output current, IOS. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) FROM (INPUT) TO (OUTPUT) I, I/O O, I/O tpd ten CLK↑ Q OE↓ Q tdis ten OE↑ Q I, I/O tdis I, I/O PARAMETER fmax tpd TYP† MAX 10 15 ns 8 12 ns 8 12 ns 7 10 ns O, I/O 10 15 ns O, I/O 10 15 ns TEST CONDITIONS 50 R1 = 500 Ω, R2 = 500 Ω, S Fi See Figure 3 † All typical values are at VCC = 5 V, TA = 25°C. 10 MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MHz TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Voltage applied to disabled output (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 125°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C NOTE 1: These ratings apply, except for programming pins, during a programming cycle. recommended operating conditions MIN NOM MAX UNIT 4.5 5 5.5 V 5.5 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current –2 mA IOL fclock Low-level output current 12 mA 41.6 MHz High-level input voltage 2 Clock frequency 0 tw duration clock (see Note 2) Pulse duration, tsu th Setup time, input or feedback before clock↑ Hold time, input or feedback after clock↑ High 10 Low 11 ns 20 ns 0 ns TA Operating free-air temperature –55 25 125 °C NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are for clock high or low only, but not for both simultaneously. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 electrical characteristics over recommended operating free-air temperature range PARAMETER TEST CONDITIONS VIK VOH VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –2 mA VOL VCC = 4.5 V, IOL = 12 mA VCC = 5 5.5 5 V, V VO = 2 2.7 7V VCC = 5 5.5 5 V, V VO = 0 0.4 4V VCC = 5 5.5 5 V, V VI = 5.5 55V VCC = 5.5 V, VI = 2.7 V IOZH IOZL Outputs I/O ports Outputs I/O ports Pin 1, 11 II All others MIN 2.4 TYP† I/O ports IIL All others IOS‡ ICC V V 0.4 20 100 –20 –250 0.2 0.1 V µA µA mA 50 100 All others I/O ports UNIT –1.5 3.2 0.25 Pin 1, 11 IIH MAX µA 20 VCC = 5 5.5 5 V, V VI = 0.4 04V VCC = 5.5 V, VCC = 5.5 V, VO = 0.5 V VI = 0, –0.25 –0.2 –30 Outputs open 140 mA –250 mA 190 mA † All typical values are at VCC = 5 V, TA = 25°C. ‡ Not more than one output should be shorted at a time and the duration of the short circuit should not exceed one second. Set VO at 0.5 V to avoid test-equipment degradation. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) FROM (INPUT) TO (OUTPUT) I, I/O tpd ten tdis ten tdis PARAMETER fmax tpd TYP† MAX O, I/O 10 20 ns CLK↑ Q 8 15 ns OE↓ Q 8 15 ns OE↑ Q 7 15 ns I, I/O O, I/O 10 20 ns I, I/O O, I/O 10 20 ns TEST CONDITIONS 41.6 R1 = 390 Ω, R2 = 750 Ω, S Fi See Figure 4 † All typical values are at VCC = 5 V, TA = 25°C. 12 MIN POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 UNIT MHz TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 programming information Texas Instruments programmable logic devices can be programmed using widely available software and inexpensive device programmers. Complete programming specifications, algorithms, and the latest information on hardware, software, and firmware are available upon request. Information on programmers capable of programming Texas Instruments programmable logic also is available, upon request, from the nearest TI field sales office or local authorized TI distributor, by calling Texas Instruments at +1 (972) 644–5580, or by visiting the TI Semiconductor Home Page at www.ti.com/sc. preload procedure for registered outputs (see Figure 1 and Note 3) The output registers can be preloaded to any desired state during device testing. This permits any state to be tested without having to step through the entire state-machine sequence. Each register is preloaded individually by following the steps given below. Step 1. Step 2. Step 3. Step 4. With VCC at 5 V and Pin 1 at VIL, raise Pin 11 to VIHH. Apply either VIL or VIH to the output corresponding to the register to be preloaded. Pulse Pin 1, clocking in preload data. Remove output voltage, then lower Pin 11 to VIL. Preload can be verified by observing the voltage level at the output pin. VIHH Pin 11 tsu td VIL td tw VIH Pin 1 VIL VIH Registered I/O Input VOH Output VIL VOL NOTE 3: td = tsu = th = 100 ns to 1000 ns VIHH = 10.25 V to 10.75 V Figure 1. Preload Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 13 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 power-up reset (see Figure 2) Following power up, all registers are set high. This feature provides extra flexibility to the system designer and is especially valuable in simplifying state-machine initialization. To ensure a valid power-up reset, it is important that the rise of VCC be monotonic. Following power-up reset, a low-to-high clock transition must not occur until all applicable input and feedback setup times are met. VCC 5V 4V tpd† (600 ns TYP, 1000 ns MAX) VOH Active-Low Registered Output 1.5 V VOL tsu‡ VIH CLK 1.5 V 1.5 V VIL tw † This is the power-up reset time and applies to registered outputs only. The values shown are from characterization data. ‡ This is the setup time for input or feedback. Figure 2. Power-Up Reset Waveforms 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-15C, TIBPAL 16R4-15C, TIBPAL 16R6-15C, TIBPAL 16R8-15C HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 PARAMETER MEASUREMENT INFORMATION 7V S1 R1 From Output Under Test Test Point CL (see Note A) R2 LOAD CIRCUIT FOR 3-STATE OUTPUTS 3.5 V Timing Input 0.3 V 1.3 V 3.5 V 1.3 V 0.3 V 3.5 V Low-Level Pulse 1.3 V 0.3 V 1.3 V VOLTAGE WAVEFORMS PULSE DURATIONS 3.5 V Output Control (low-level enabling) 3.5 V 1.3 V 1.3 V tdis 0.3 V tpd VOH In-Phase Output 1.3 V 1.3 V Out-of-Phase Output (see Note D) Waveform 1 S1 Closed (see Note B) 1.3 V tpd 1.3 V tdis ten VOH 1.3 V VOL Waveform 2 S1 Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ≈3.5 V VOL + 0.3 V VOL VOL tpd 1.3 V 0.3 V ten 1.3 V tpd 1.3 V 0.3 V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Input 1.3 V tw th tsu Data Input 3.5 V High-Level Pulse 1.3 V VOH 1.3 V VOH – 0.3 V ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses have the following characteristics: PRR ≤ 1 MHz, tr = tf ≤ 2 ns, duty cycle = 50% D. When measuring propagation delay times of 3-state outputs from low to high, switch S1 is closed. When measuring propagation delay times of 3-state outputs from high to low, switch S1 is open. E. Equivalent loads may be used for testing. Figure 3. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 15 TIBPAL16R6-20M and TIBPAL16R8-20M are Not Recommended for New Designs TIBPAL 16L8-20M, TIBPAL 16R4-20M, TIBPAL 16R6-20M, TIBPAL 16R8-20M HIGH-PERFORMANCE IMPACT  PAL CIRCUITS SRPS019A – FEBRUARY 1984 – REVISED APRIL 2000 PARAMETER MEASUREMENT INFORMATION 5V S1 R1 From Output Under Test Test Point CL (see Note A) R2 LOAD CIRCUIT FOR 3-STATE OUTPUTS 3V Timing Input 0 1.5 V 3V 1.5 V 0 3V Low-Level Pulse 1.5 V 0 1.5 V VOLTAGE WAVEFORMS PULSE DURATIONS 3V Output Control (low-level enabling) 3V 1.5 V 1.5 V tdis 0 tpd VOH In-Phase Output 1.5 V 1.5 V Out-of-Phase Output (see Note D) Waveform 1 S1 Closed (see Note B) 1.5 V tpd 1.5 V tdis ten VOH 1.5 V VOL Waveform 2 S1 Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES ≈3.3 V VOL + 0.5 V VOL VOL tpd 1.5 V 0 ten 1.5 V tpd 1.5 V 0 VOLTAGE WAVEFORMS SETUP AND HOLD TIMES Input 1.5 V tw th tsu Data Input 3V High-Level Pulse 1.5 V VOH 1.5 V VOH – 0.5 V ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses have the following characteristics: PRR ≤ 10 MHz, tr = tf ≤ 2 ns, duty cycle = 50% D. When measuring propagation delay times of 3-state outputs, switch S1 is closed. E. Equivalent loads may be used for testing. Figure 4. Load Circuit and Voltage Waveforms 16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-85155012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155012A TIBPAL16 L8-20MFKB 5962-8515501RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515501RA TIBPAL16L8-20M JB 5962-8515501SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515501SA TIBPAL16L8-20M WB 5962-85155022A NRND LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155022A TIBPAL16 R8-20MFKB 5962-8515502RA NRND CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515502RA TIBPAL16R8-20M JB 5962-8515502SA LIFEBUY CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515502SA TIBPAL16R8-20M WB 5962-85155032A NRND LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155032A TIBPAL16 R6-20MFKB 5962-8515503RA NRND CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515503RA TIBPAL16R6-20M JB 5962-8515503SA NRND CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515503SA TIBPAL16R6-20M WB 5962-85155042A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155042A TIBPAL16 R4-20MFKB 5962-8515504RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515504RA TIBPAL16R4-20M JB Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 12-Oct-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8515504SA ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515504SA TIBPAL16R4-20M WB JM38510/50601BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 50601BRA JM38510/50602BRA OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 JM38510/ 50602BRA JM38510/50603BRA OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 JM38510/ 50603BRA JM38510/50604BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 50604BRA M38510/50601BRA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 50601BRA M38510/50602BRA OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 M38510/50603BRA OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 M38510/50604BRA ACTIVE CDIP J 20 TBD A42 N / A for Pkg Type -55 to 125 TIBPAL16L8-15CFN OBSOLETE PLCC FN 20 TBD Call TI Call TI 0 to 75 16L8-15 TIBPAL16L8-15CN OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 75 TIBPAL16L8-15C N TIBPAL16L8-20MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155012A TIBPAL16 L8-20MFKB TIBPAL16L8-20MJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 TIBPAL16L8-20M J TIBPAL16L8-20MJB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515501RA TIBPAL16L8-20M JB TIBPAL16L8-20MWB ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515501SA TIBPAL16L8-20M WB TIBPAL16R4-15CFN OBSOLETE PLCC FN 20 TBD Call TI Call TI 0 to 75 16R4-15 TIBPAL16R4-15CJ OBSOLETE CDIP J 20 TBD Call TI Call TI TIBPAL16R4-15CN OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 75 TIBPAL16R4-15C N 1 Addendum-Page 2 JM38510/ 50604BRA Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 12-Oct-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TIBPAL16R4-20MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155042A TIBPAL16 R4-20MFKB TIBPAL16R4-20MJ LIFEBUY CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 TIBPAL16R4-20M J TIBPAL16R4-20MJB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515504RA TIBPAL16R4-20M JB TIBPAL16R4-20MWB ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515504SA TIBPAL16R4-20M WB TIBPAL16R6-15CFN OBSOLETE PLCC FN 20 TBD Call TI Call TI 0 to 75 16R6-15 TIBPAL16R6-15CN OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 75 TIBPAL16R6-15C N TIBPAL16R6-20MFKB NRND LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155032A TIBPAL16 R6-20MFKB TIBPAL16R6-20MJ LIFEBUY CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 TIBPAL16R6-20M J TIBPAL16R6-20MJB NRND CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515503RA TIBPAL16R6-20M JB TIBPAL16R6-20MWB NRND CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515503SA TIBPAL16R6-20M WB TIBPAL16R8-15CFN OBSOLETE PLCC FN 20 TBD Call TI Call TI 0 to 75 16R8-15 TIBPAL16R8-15CN OBSOLETE PDIP N 20 TBD Call TI Call TI 0 to 75 TIBPAL16R8-15C N TIBPAL16R8-20MFKB NRND LCCC FK 20 TBD POST-PLATE N / A for Pkg Type -55 to 125 596285155022A TIBPAL16 R8-20MFKB TIBPAL16R8-20MJ OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 TIBPAL16R8-20M J TIBPAL16R8-20MJB NRND CDIP J 20 TBD A42 N / A for Pkg Type -55 to 125 5962-8515502RA 1 1 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 12-Oct-2015 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TIBPAL16R8-20M JB TIBPAL16R8-20MWB LIFEBUY CFP W 20 1 TBD A42 N / A for Pkg Type -55 to 125 5962-8515502SA TIBPAL16R8-20M WB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 12-Oct-2015 Addendum-Page 5 MECHANICAL DATA MPLC004A – OCTOBER 1994 FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER 20 PIN SHOWN Seating Plane 0.004 (0,10) 0.180 (4,57) MAX 0.120 (3,05) 0.090 (2,29) D D1 0.020 (0,51) MIN 3 1 19 0.032 (0,81) 0.026 (0,66) 4 E 18 D2 / E2 E1 D2 / E2 8 14 0.021 (0,53) 0.013 (0,33) 0.007 (0,18) M 0.050 (1,27) 9 13 0.008 (0,20) NOM D/E D2 / E2 D1 / E1 NO. OF PINS ** MIN MAX MIN MAX MIN MAX 20 0.385 (9,78) 0.395 (10,03) 0.350 (8,89) 0.356 (9,04) 0.141 (3,58) 0.169 (4,29) 28 0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58) 0.191 (4,85) 0.219 (5,56) 44 0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66) 0.291 (7,39) 0.319 (8,10) 52 0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20) 0.341 (8,66) 0.369 (9,37) 68 0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91) 84 1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45) 4040005 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-018 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. 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