User's Guide
SCPU036 – October 2017
TIC12400 Evaluation Module
This user's guide describes the characteristics, operation, and use of the TIC12400 Evaluation Module
(EVM).
1
2
3
4
5
6
Contents
Introduction ................................................................................................................... 2
Hardware...................................................................................................................... 4
SWITCH BOARD Hardware Description ................................................................................. 8
GUI Software Installation .................................................................................................. 11
TIC12400 GUI Application ................................................................................................ 14
Board Files .................................................................................................................. 39
List of Figures
1
TIC12400 EVM Block Level Diagram ..................................................................................... 2
2
TIC12400 EVM, SWITCH BOARD, and USB to USB-Mini Cable..................................................... 4
3
EVM, SWITCH BOARD, USB Cable, PC, and Power Supply Setup ................................................. 4
4
EVM Hardware Top Description ........................................................................................... 5
5
EVM Hardware Bottom Description
6
Setup_TIC12400-0.4.0_EVM.exe ........................................................................................ 11
7
Installation Steps 1–6 ...................................................................................................... 12
8
Figure 3. Installation Steps 7–13 ......................................................................................... 13
9
Double Click on “App Center EVM GUI” Shortcut to Open ........................................................... 14
10
GUI Home Page ............................................................................................................ 14
11
Device Configuration Page
12
Channel Configuration Page .............................................................................................. 21
13
Page Connections.......................................................................................................... 39
14
Main Device ................................................................................................................. 40
......................................................................................
...............................................................................................
6
17
15
USB interface ............................................................................................................... 41
16
17
Input filters – IN10-IN23 use 10 Ω instead of 220 Ω................................................................... 41
18
SWITCH Board Schematic ................................................................................................ 42
...................................................................................................................
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1
Introduction
1
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Introduction
The TIC12400 is a multiple switch detection interface that is designed to detect the opening and closing of
up to 24 switch contacts. 10 out of the 24 inputs are configurable to detect switch states that are either
battery connected switches (BCS) or ground connected switches (GCS), which means it can either sink or
source current from the channel. The remaining 14 channels are design to support ground connected
switches only (source current). The wetting current can be preprogrammed to six available values, which
accommodates for different application scenarios. Communication to and from the device is done using a
24-bit SPI protocol.
The TIC124000 and TIC12400-Q1 provide the same functionality and the TIC12400 Evaluation Module is
used for both devices.
Battery or Power
Supply
5-V
Regulator
(U9)
D3
+
SPI
_
INT
External Micro
Connector
RST
Input Filter
Channel IN0 to IN23
Test Point
Test Point
INx
Connector
Channel
0í23
3.3-V
Regulator
(U4)
x4
IN0
IN1
IN2
.
.
.
IN23
DNP
x24
VS
VDD
SPI
INT
TIC12400
(U11)
SPI
TXB0106
(U10)
RST
USB
Connector
INT
RST
MSP430
(U1)
OE
I2C
ONBOARD EVM MONITORS:
x
x
x
x
VDD Current Monitor (INA226A, U12)
VS Current Monitor (INA226A, U13)
Ambient Air Temp Monitor (TMP102AQ, U5)
Case Temp Monitor (TMP102AQ, U2)
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Figure 1. TIC12400 EVM Block Level Diagram
The TIC12400 EVM is an evaluation module for the Texas Instruments TIC12400 and it provides basic
functionality evaluation for the device. When used together with the switch board, the EVM allows testing
of its functionality via SPI communication established to the PC using the USB adaptor.
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Introduction
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1.1
Warnings
Caution Hot surface.
Contact may cause burns.
Do not touch.
The DUT of the board can get hot when all channels are enabled at
the highest wetting current settings in continuous mode
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2
Hardware
2.1
Kit
Two boards, EVM (TIC12400EVM) and SWITCH BOARD (TIC12400_SWB), are provided with an USB to
USB-MINI cable within the KIT; see Figure 2.
Figure 2. TIC12400 EVM, SWITCH BOARD, and USB to USB-Mini Cable
2.2
Connection to the PC and Powering up the EVM
A mini-USB cable is used to connect the EVM board to the PC. The VDD of the EVM is powered by the
USB’s VBUS. The positive terminal of the Power Supply is connected to the “VBAT” terminal of both the
EVM and SWITCH BOARD. The negative terminal of the power supply is connected to the “GND” terminal
of the EVM. Turn ON the power supply and set it to a nominal supply of +12 V, see Figure 3.
Power
Supply
+12.0 V
SWITCH BOARD
EVM
PC
USB
Figure 3. EVM, SWITCH BOARD, USB Cable, PC, and Power Supply Setup
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2.3
EVM Hardware Description
The TIC12400 EVM is designed to allow the user to easily evaluate switch detection using the GUI. The
break down of all the features and design of the EVM follow.
Required Circuitry
Optional Circuitry or Functions
1
10
11
5
3
6
4
7
2
9
8
Figure 4. EVM Hardware Top Description
1. Connect the TIC12400EVM to a supply using VBAT (J9) as the positive terminal of the supply and
GND (J10) to the negative terminal of the supply using standard banana cables. The supply can range
from 4.5V to 35V, but is nominally at 12V.
2. Connect the TIC12400EVM to your computer via the mini-USB cable provided. The actual connector is
located on the bottom side of the board. This will allow your computer to interface with the EVM and
communicate to the device.
3. Connect the Switch Board or your own switches via a mating connector to J2, which connects the
switches to the INx pins of the device.
4. U11 is the TIC12400 devices.
5. The EVM has several LED use to help the user indicate the status of the EVM
6. The device has three post regulator decoupling caps: VCAP_D, VCAP_PRE, and VCAP_A. There are test points
at each output capacitor for each of these three regulators.
7. The EVM facilitates the use of an external microcontroller by interfacing with SPI, INT, and RESET
pins of the device.
8. There is an optional Translator/Level shifter (TXB0106) on the EVM to ensure the ability to interface
with the device's SPI, INT, and RESET functions at various voltages set by VDD pin. The MSP430 is a
3.3-V device and does not support 5-V logic level without the TXB0106.
9. The EVM has the ability to do relative temperature measurements of the air using the TI TMP0104AQ
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device.
10. There are place holders for a filter components on each channel of the EVM. There is a 100mil header
along the edge of the connector to measure signal at connector, and SMT test points to measure the
signal at the IC.
11. The filter capacitors at the pins of the device are not loaded by default and are there to allow the
design of filters if needed.
TPCONNECTOR
9
TPIC
1
21,6,7,11,12
8
7
6
3
5
4
Figure 5. EVM Hardware Bottom Description
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Hardware
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1. The EVM has a blocking diode and large bulk capacitor. The blocking diode (D3) protects the EVM in
case the terminals of the battery are switched accidentally. The bulk capacitor (C24) adds a delay
between a battery disconnect and the device shutting down.
a. 2.1 There EVM has several jumpers for configuring the EVM in a variety of ways. J1: This jumper
connects the input of the 5V regulator to VS if inserted. (Default: Not Loaded)
b. 2.6 J6: This jumper connects a GPIO from the EVM micro (MSP430) to the output enable (OE) of
the TXB0106 level shifter by placing the jumper between pins 1 and 2. Placing the jumper between
pins 2 and 3 forces the translator to be on. If there is no jump on J7 then the pull down resistor
turns it off (OE=LOW) and places the level shifter in high impedance mode, preventing bus
contention between two possible masters on the SPI bus.
c. 2.7 J7: This jumper connects VDD pin of the device to either the onboard +3.3V supply generated
from the USB bus or connects to the onboard +5V regulator that is supplied from the battery.
Connecting pin 1 and 2 with a jumper connects VDD to +3.3V and connecting 2 and 3 with a
jumper connects VDD to +5V (this assumes J1 is also loaded). (Default: jumper across pin 1 and
2)
d. 2.11 J11: This jumper connects VS pin of the device to the bulk capacitor after the protection
diode.
e. 2.12 J12: This jumper gives the option of having the pull up resistor come from either VDD or VS.
Connecting pin 1 and 2 with a jumper, references the INT pin to VS. Connecting pin 2 and 3 with a
jumper references the INT pin to VDD.
2. The EVM has the ability to do relative temperature measurements of the device's case temperature
using TI’s TMP0104AQ device.
3. The MSP430's support devices, such as JTAG interface, crystal, programming button, and so forth.
4. The MSP430 bridges the communication from the computer’s USB cable to the device's SPI, INT, and
RESET lines. The MSP430 also interfaces with several supports circuits for measuring temperature for
air and case, measuring current to VDD, and measuring current to VS. The MSP430 also has the
ability to control OE pin of TXB0106 to facilitate control of the device by an external microcontroller.
5. The TPS73533 receives power from the VBUS of the USB, which is 5 V. It then regulates that to the
+3.3V output on the TIC12400 EVM.
6. There are two INA226A Current Monitors for measuring current in VDD (U12) and for measuring th
current going into VS (U13). The MSP430 interfaces with these devices using I2C and relays the
information through the UBS cable to the GUI on the computer.
7. There are four status LED on the EVM that take up power when in use. The header (J4) facilitates
removing the LED’s in the circuit to do system level power measurements accurately.
8. The TPS7A6650Q is a high voltage regulator that is able to take high voltage and regulate it down to
5V for use with higher voltage micro controllers. When J1 is removed the regulator’s input voltage is
removed and therefore it is disabled.
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SWITCH BOARD Hardware Description
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SWITCH BOARD Hardware Description
9
2
1
8
7
3
6
5
4
1. The SWITCH BOARD (SWB) is designed such that ground offsets can be tested by removing J6,
which disconnects the Chassis Ground (CGND) from the EVM ground (GND). A supply can be placed
between GND and CGND to create the offset. If not testing this feature, then J6 is by default in place
and therefore CGND and GND are shorted together.
2. VBAT provides the power to the battery connected switches. Switch 0 to 9 are battery connected
switches.
3. J114 connects all the switches from the SWB to the inputs of the EVM.
4. J1, J2, and J3 are jumpers that connect SW0 to SW23 to IN0 to IN23 of the EVM. These jumpers
allow the user to disconnect the SW’s on the Switch Board to the EVM and provide a 0.1" head to
connect their own switch of their choosing to the EVM.
5. SW23A and SW23B are provided to test the device's ability to detect multi-resistor coded ground
referenced switch transitions. SW23A relate directly to the mapped thresholds for 3A, 3B, and 3C.
SW23B relate directly to thresholds 8 and 9 of the device. Switch 23-1-5 are designed to coincide with
one state for each instance of one switch being in the “CLOSED” position. Channel 23 of the device
has the ability to set up to 5 thresholds, which means there are 6 states. Each switch represents one
state and all switches in the “OPEN” position represents the 6th state.
SW23_B
SW23_A
23-1
8
23-2
23-3
TIC12400 Evaluation Module
23-4
IN23
23-5
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SWITCH BOARD Hardware Description
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6. SW18 – SW22 are used to test up to 4 state resistor coded ground referenced switches. Each of the
channels have three ground connected switches labeled X-1, X-2, and X-3, which coincides with a
mapped threshold for 3A, 3B, and 3C. Each individual switch represents one of the three states and
the fourth state is when all switches are “OPEN”.
SWX
X-1
X-2
IN_X
X-3
7. SW12 – SW17 are used when up to two thresholds (three states) is needed for the switch application.
Each of the channels have two ground connected switches labeled X-1 and X-2, which coincides with
a mapped threshold for 2A and 2B, and a switch position called “OPEN” to represent the third state.
SWX
X-2
X-2
X-2
OPEN
OPEN
OPEN
X-1
X-1
X-1
INX
OPEN
X-1
X-2
8. SW10 and SW11 are used when up to two thresholds (three states) is needed for the switch
application. Each channel from 0 to 11, has one unique threshold mapping for each channel and one
common threshold (THRES_COM) that is shared for all the channels (0-11). These switches are setup
to illustrate this feature.
SWX
X-2
X-2
X-2
OPEN
OPEN
OPEN
X-1
X-1
X-1
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INX
OPEN
X-1
X-2
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SWITCH BOARD Hardware Description
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9. SW0 to SW9 are designed to test the device ability to detect digital switches that are either referenced
to a battery connected switch or ground connected switch. There are two state, “OPEN” and either
chassis Ground Connected Switch (GCS) or Battery Connected Switch (BCS).
VBAT
X-1
X-1
X-1
OPEN
OPEN
OPEN
X-2
X-2
X-2
SWX
X-2
IN_X
OPEN
X-1
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GUI Software Installation
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4
GUI Software Installation
The GUI software is required to establish the communication between the EVM boards and the PC and it
also provides the GUI interface to read/write registers information on device. The following section
described the software installation procedure.
Step 1. Download the GUI software
The software can be downloaded on TI server at link goes here. Please inquiry with a TI representative
if you don’t have access to the files.
Step 2. Software installation
Go to location that the executable was downloaded to and either double-click the Setup_TIC124000.4.0_EVM.exe file to begin software installation or right click and select “Run as administrator”. The
software will install two applications, “App Center” software and the TIC12400 GUI App software. If the
“App Center” software isn’t already installed on the PC then additional steps will be needed. Those
steps are outlines in the following figures.
Figure 6. Setup_TIC12400-0.4.0_EVM.exe
Follow the on-screen instructions to complete the setup. The process may take up to 10 minutes
depending on your computer speed.
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This screen should show up shortly after step
5. This screen should appear on top, unless the
user clicks on another item. Sometimes the
screen may appear to be behind the other
setup screen. The TIC12400 EVM GUI will not
install until the App Center software is first
installed.
Figure 7. Installation Steps 1–6
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Figure 8. Figure 3. Installation Steps 7–13
The EVM GUI can either be opened before or after the EVM is setup and power is applied.
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5
TIC12400 GUI Application
5.1
Starting the GUI
After the EVM and SWITCH BOARD are connected and then the cables are connected the Power Supply
and PC via USB cable, the GUI can be run by double clicking the shortcut icon on the desktop, see
Figure 9.
Figure 9. Double Click on “App Center EVM GUI” Shortcut to Open
5.2
TIC12400 Info Page
The “Info” page (Home) of the TIC12400 GUI has a short summary of the features of the TIC12400. See
the following map of features of the “Info” page in Figure 10.
1
2
3
4
5
6
7
8
9
10
Figure 10. GUI Home Page
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TIC12400 GUI Application
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The Menu bar has several sub menus that are within “File”, “Tools” and “Help” drop down menus.
“File” drop down menu provides access to “Saving Registers”, “Save Registers As”, and “Load
Registers”. This means switch profiles can be saved and loaded as needed.
1.
“Tools” drop down menu provides access to the Logging feature of the GUI. This records both
SPI Reads and Writes.
“Help” drop down menu provides access to information pertaining to GUI version and MSP430
firmware revision.
The Menu bar can be clicked to show the minimized and maximized menu, default is minimized.
The buttons on the bar are from top to bottom as follows:
2.
• Intro (Home): Brings the user back to the Intro screen
• Channel Configuration: Page to configure the channels
of the device in a graphical format
• Configuration Wizard: Guided setup of MSDI based on
system level requirements
• Device Settings: Access device settings without manually
adjusting the register settings
• Real Time Status Tracker: Live visual monitoring of
channel inputs
• Matrix Configuration: Graphical configuration of the
Matrix mode settings
• Polling mode current calculator: Page to calculate the
current consumption of the devicewhile in polling mode
with multiple settings, and Register Map. These are also
available buttons on the right of the “Intro” page.
• Registers: Register access page
Quick Start. Opens up a sub menu with two options.
3.
4.
1.
2.
A configuration wizard that walks through the system level use case to setup the device
Load default configuration for the device
The settings button will open a sub menu for Channel Configurations, Device Settings and Matrix
configuration. These are the same pages accessed by the men bar on the left side of the GUI.
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5.
The tools button will open a sub menu to access the Polling Mode current Calculator and RealTime Status Tracker pages.
6.
Clicking on the register map button will direct the user to the Register map page via a sub menu.
7.
Reference materials button that pulls up links to the EVM User’s Guide, Datasheet and a
reference video.
8.
Benefits banner. Clicking on the links in this section will show greater details on the device
benefits and how they differ from today’s implementations.
The button toggles ON/OFF the Log page, which is also seen in the Tools->Log pane.
9.
10.
16
If the EVM is connected to the PC with the USB cable then the GUI will show that it is connected
by showing a green dot. If there is no communication with either the on board micro controller
(MSP430) or the device then the following image will be seen, indicated no communication.
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5.3
Device Settings Page
The Device Configuration page controls many of the features for TIC12400 that control device general
operation.
1
12
2
11
3
4
10
5
9
6
8
7
Figure 11. Device Configuration Page
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1.
2.
3.
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The device has a variety of setting and features that are accessed and controlled by doing read
and writes to the device. It is important to note that when selecting and changing setting within
the GUI it must be written to the device prior to initiating the activation of the device by clicking on
the “Trigger” button. Once the Trigger is turned ON all registers become read only (with the
exception of the CRC_T, RESET, and TRIGGER bits). Trigger initiates the wetting currents and
starts external switch monitoring.
The device has several features that help ensure robust communications to and from the device
to the micro controller on the SPI bus. Interrupts can be generated in the INT pin of the device to
communicate to the user that either “SPI_FAIL”, “PARITY_FAIL”, or “CRC_CALC_COMPLETE”
fault has occurred.
)
The device has the ability to alert the user when Switch State Change (SSC) has occurred. The
Channel Configuration sets the conditions that initiate a SSC. If this feature is not selected then
the SSC is recorded but the INT pin is not asserted. This is also true for the VS0 and VS1 voltage
state change. There are four different thresholds (VS0_THRES2A/B and VS1_THRES2A/B) that
can be set for VS measurements to establish state changes. If the VS0/VS1 Threshold Crossing
features are not selected then the INT pin is not asserted after a state change, but it will be
stored in the device and the user must read the device to determine that the a state change
occurred.
)
4.
If the "Wetting Current Diag" is selected then an INT assertion occurs if any of the "Wetting
Current Diag – IN0/1/2/3" fail. If the "ADC Diag" is selected then an INT is asserted if the ADC
Diag fails
)
The device has the ability to assert the INT pin when System Faults occur such as “Over
Voltage”, “Under Voltage”, “Temperature Warning”, and “Temperature Shutdown”.
5.
6.
18
)
This button sends a software reset to the device via SPI. This will reset all registers to their
default setting! The user must write back all the registers before selecting “Trigger” and to start
wetting current and start external switch monitoring.
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The TIC12400 GUI monitors the INT pin approximately at every second. There is an INTERUPT
led on the EVM lights up when the INT pin is asserted. This coincides with the INT icon. Once the
INT is asserted then selecting the READ button reads the INT_STAT register which clears the
INT assert
*
7.
If the Auto-Read interrupt register features is selected then the GUI will automatically read the
INT_STAT register every 5 seconds, which will clear the INT and record the INT_STATE register
information into GUI, but it does clear the INT_STAT register within the device.
The Wetting Current Auto-Scaling feature allows the user to enable or disable the auto scaling
feature in continuous mode.
8.
The Temperature warning and wetting current reduction feature provides the ability to enable or
disable the wetting current reduction feature when a Temperature warning event occurs.
9.
The TIC12400 has the ability to do an ADC diagnostics and also has the ability to test wetting
currents on IN0, IN1, IN2, and IN3 and diagnose if there are faults.
10.
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The TIC12400's advanced settings have several features that allow the user to optimize their
switch state change monitoring system. VS measurement can be enabled or disabled here. Once
enabled the advanced settings menu becomes accessible to the right of the checkbox.
Accessing the VS Measurement settings will allow the user to select the channel, resistor divider
ratio and select the thresholds. The thresholds can be shown in volts or ADC thresholds or volts.
The Operation mode and timing settings can also be configured between polling and continuous
mode.
11.
Clicking the Settings cog opens the timing settings menu to configure the polling mode.
The CCP or clean current polling settings can also be configured by clicking the configure CCP
option. This will allow the user to enable CCP by channel and select the current to be either 10
mA or 15 mA by group.
Additional the detection filter can be adjusted and the Interrupt assertion scheme can be
selected.
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CRC calculations can be initiated and results displayed within this window. Note, an INT can be
setup to indicate when the CRC calculation is completed by the device, which at that time it can
be read.
*
12.
*
Displayed results will look as follows:
5.4
Channel Configuration Page
The Channel Configuration page controls the Channel settings for how to indicate state change when
monitoring the Channels.
1
5
2
4
3
Figure 12. Channel Configuration Page
1.
The TIC12400 has a variety of setting and features that are accessed and controlled by doing
read and writes to the device. It is important to note that when selecting and changing setting
within the GUI it must be written to the device prior to initiating the activation of the device by
clicking on the “Trigger” button. Once the Trigger is turned ON all registers become read only
(with the exception of the CRC_T, RESET, and TRIGGER bits). Trigger initiates the wetting
currents and starts external switch monitoring.
*
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The TIC12400 has 24 channels that can be configured a variety of ways to detect all types of
switches. Within the “Simple View” the GUI breaks down each channel into manageable easy to
visualize channel settings. In order to change the setting the Channel must be Enabled, which is
done by clicking on the Enable/Disable button. The channel will no longer be greyed out and
channel information will be able to be changed.
*
Each Column describes the feature that can be changed and a simple single click will toggle
between settings or allow to select from a drop down menu.
2.
SOURCE
SINK
*
Wetting Current Direction
Wetting Current Direction
*
More advanced setting for each Channel can be accessed clicking on the settings icon.
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The GUI monitors the INT pin approximately at every second. There is an INTERUPT led on the
EVM lights up when the INT pin is asserted. This coincides with the INT icon. Once the INT is
asserted then selecting the READ button reads the INT_STAT register which clears the INT
assert
*
3.
If the Auto-Read interrupt register features is selected then the GUI will automatically read the
INT_STAT register every 5 seconds, which will clear the INT and record the INT_STATE register
information into GUI, but it does clear the INT_STAT register within the device.
All the Channels can be Enabled or Disabled all at once by clicking on these buttons.
4.
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*
The TIC12400 Channel Configurations can be controlled by one of three ways.
1) "Simple View" is the default mode of accessing the Channel Configurations if
2) "Detailed View" allows the user to see all the Channel Configurations at once and also to
design to show all the dependent variables.
5.
*
3) Register Map view allows the user to do individual bit control for configuration registers.
*
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5.5
Channel Configuration Wizard
1
3
2
1.
The TIC12400 GUI will walk through the system configuration with a series of question prompts
on the system configuration. Once a prompt is completed the GUI will move on the to the next
step. You can edit any prompt at any time regardless of your current step in the wizard.
2.
After completing the question prompts. The start button will move to the next area to be
configured.
3.
The red outline will show the current part of the system being addressed by the prompt. As more
questions are answered this area will show how the external system is being interpreted by the
GUI.
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1
2
3
The system configuration from the previous page is shown at the top of the section. Clicking the
Modify button will bring up a prompt to change these settings.
Here is it possible to change of the settings again as necessary for either adding a new switch to
the configuration or adjusting the overall system details. After the desired system configuration is
set, press the Update button to change the setting and click the X to return to the wizard.
1.
Each IWett setting will give a recommended threshold. If the Recommended threshold in N/A that
setting is not recommended.
2.
26
This displays the current global thresholds for the ADC.
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The wetting current setting can be selected either by using the drop down menu in this section or
clicking the setting in section 1.
Based on the number of switch states the GUI will recommend the appropriate channel that can
handle the switch type.
3.
The Recommended thresholds section will show which thresholds are available to use. It is
important to keep track of the global thresholds that are currently being used by other channels
as the TIC12400 is configured.
After the desired settings are correct, clicking the copy settings will configure the TIC12400
device. Clicking Do Nothing will exit the wizard. The wizard can be used multiple times to update
TIC12400 per each switch in the system.
1
2
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The current setting and threshold calculations will be different for different switch states. For 4
switch states 3 thresholds must be used. If any of the threshold boxes for a given wetting current
setting are populated with NA, that current setting cannot be used. If all of the current settings
cannot be used the resistance ranges for the switch are not supported. For more information on
the supported resistance values for multiple switch states see the datasheet.
In this example the only supported wetting current is 2 mA as all of the thresholds have values.
1.
In this example the only supported wetting current is 2 mA as all of the thresholds have non NA
values.
The recommended channels that are available all support the 4 switch configuration and the
channels that do not support 4 switch states are not recommended.
2.
Additionally the available threshold settings are Thres3A/B/C. These thresholds can be mapped
to any unmapped thresholds but must follow the rules that ThresC > ThresB > ThresA.
28
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5.6
Real Time Status Tracker
3
1
2
The channel list includes all the available channels for the device. Enabled channels display
green and disabled channels display gray. Clicking green channels will turn on the GUI tracker for
that channel. Clicking the same button again will disable the GUI tracker. Note this does not
enable/disable the channel in the device, it changes if the GUI displays any real time changes.
1.
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This will show each channel that the GUI tracker is enabled for. Each channel will show the
threshold on the left side of the graph. For multiple switch state channels all the thresholds are
shown. As the switch state changes the graph will update accordingly as shown below if the
Trigger has been enabled in section 3.
2.
Clicking the trigger button will enable the device to monitor the inputs and update the real time
status tracker.
3.
5.7
Matrix Configuration
4
1
3
2
30
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The Matrix configuration settings area changes the setup for Matrix mode according to the
system requirements Clicking the Matrix configuration will allow you to select between the
supported configurations.
The input source and sink currents are also selectable via a drop down menu. The sink current
must always be larger than the source current and the GUI will make unusable source and sink
combinations un-selectable.
1.
The detection edge control option lets you select between no detection, rising, falling, and rising
or falling edge detection schemes.
The Matrix polling active time controls how long the inputs are polled as described in the
datasheet.
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The Switch Status area shows the current status of the matrix of switches. The status can be
checked by clicking the Check switch status button. Mousing over a box will show which switch
that is.
2.
This is a visual depiction of the matrix mode operation. Selecting the different matrix settings
(4x4, 5x5, 6x6) will change the image to show which channels are being used.
3.
4.
32
After setting the desired matrix configuration click the Write to Device button to set the register
settings in the TIC12400 device. Use the Trigger button to monitor the TIC12400 enable
monitoring of the inputs.
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5.8
Polling Mode Current Calculator
1
4
2
3
Matrix mode calculations can be enabled by clicking the checkbox. This will open up a menu to
select the matrix configuration options.
The Polling_Act_Time and Polling time can be selected as well.
1.
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Each channel can be selected in this menu as well as the wetting current, input mode, and the
external switch state.
2.
Clicking calculate will prompt the results page which will deliver the measurement cycle time,
active duty cycle and the effective current for different temperatures.
3.
34
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The matrix channel configuration will not be interactive unless matrix mode is checked from
section 1.
4.
After matrix mode is checked the boxes become interactive. Clicking different switches will close
or open them and the current calculator will update accordingly.
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5.9
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Register Map
4
1
2
3
1.
36
The Register name is shown as it matches the datasheet. The address of the register and the
value of the register is shown in hexadecimal. The bit representation of the Value is also shown.
Registers that are read only will be shown as transparent red. Read and write registers are
shown as black.
One way to edit a register is to click the value field of that register. Registers of the device will not
change until the Write Register button is clicked. If Auto Read is enable, any register changes
that have not been sent to the device will be overwritten to the current value of the TIC12400.
The bit field representation will also update as the value field of the register is adjusted.
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For the selected register in the register field, a question mark help button will appear. Clicking this
will show the full description for that register field.
Clicking the red x will exit the help menu for that register and take the user back to the register
fields.
2.
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The field view area shows a bit by bit name and description for each setting available in that
register.
Clicking the ? Button will bring up that field’s bit number(s) in the register, whether it is read or
write and the description. Clicking the red x will exit the help description prompt.
3.
Auto read can be enabled on a polling timer that is adjustable in the GUI.
4.
38
The Immediate and deferred menu will adjust when the register are written after they are
changed in the GUI. Immediate will send the new register settings to the device immediately after
they are changed. The deferred setting will wait for the user to click the Write Register button
before sending the new register settings to the device.
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Board Files
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6
Board Files
This section contains the main board and SWITCH board schematics and BOMs.
6.1
Main Board Schematic
Figure 13 through Figure 17 illustrate the main board schematics.
+5V
10
8
6
4
2
GND
J3
9
7
5
3
1
DNP
Multiple Switch Detection Interface
HVL129A_MSDI_MC.SchDoc
J2
A1
TP4
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A2
B2
A3
IN2_SB
IN3_SB
IN4_SB
IN5_SB
IN6_SB
IN7_SB
IN8_SB
IN9_SB
IN10_SB
IN11_SB
IN12_SB
IN13_SB
IN14_SB
IN15_SB
IN16_SB
IN17_SB
IN18_SB
IN19_SB
IN20_SB
IN21_SB
IN22_SB
IN23_SB
IN0_SB
IN1_SB
A4
B4
A5
A6
B6
A7
A8
B8
A9
A10
B10
A11
A12
B12
A13
A14
B14
A15
PEC24SAAN
A16
B16
C1
B1
C2
IN0_SB
IN1_SB
IN23_SB
C3
B3
C4
IN21_SB
IN22_SB
IN20_SB
C5
B5
C6
IN18_SB
IN19_SB
IN17_SB
C7
B7
C8
IN15_SB
IN16_SB
IN14_SB
C9
B9
C10
IN13_SB
IN12_SB
IN11_SB
C11
B11
C12
IN10_SB
IN9_SB
IN8_SB
C13
B13
C14
IN7_SB
IN6_SB
IN5_SB
C15
B15
C16
IN4_SB
IN2_SB
IN3_SB
Micro Controller Board
HVL129A_Microcontroller
IN0
IN1
IN23
CS_MSDI
IN21
IN22
IN20
IN18
IN19
IN17
IN15
IN16
IN14
CS_MSDI
SCLK
SCLK
MOSI
MOSI
MISO
MISO
INT
INT
RST
RST
EXT_MICRO_CONTROL
IN13
IN12
IN11
IN10
IN9
IN8
EN_EXT_MICRO
EN_EXT_MICRO
SDA
SDA
SCL
SCL
MSP-LED
MSP-LED
IN7
IN6
IN5
IN4
IN2
IN3
Hardware
HVL129A_Hardware
5650478-5
Power Supplies
HVL129A_PowerSupply
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 13. Page Connections
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Board Files
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DPI/CE injection/measurement point
choose this one
DPI/CE injection/measurement point
0
HVL129A_INx.SchDoc
IN0
IN0_SB
SB_IN_
IN_
C37
DNP
0.01µF
I2C Cur ren t Shun t i s u sed to mea sure curren
GND
t for V s and Vdd
+3.3V
1
HVL129A_INx.SchDoc
IN1
IN1_SB
SB_IN_
IN_
C38
DNP
0.01µF
R11
R9
R16
DNPC11
DNP DNP
0.1µFDNP
4.99k
4.99k 4.99k
U13
8
6
VBUS
VS+
VIN+
SDA
SCL
4
5
ALERT
A0
A1
3
2
1
GND
10
2
HVL129A_INx.SchDoc
IN2
IN2_SB
SB_IN_
9
7
IN_
C39
DNP
0.01µF
DNP
VINGND
GND
SDA
SCL
INA226AIDGSR
+3.3V
GND
GND
R17
R18
DNPC36
DNP
0.1µFDNP
4.99k
4.99k
3
HVL129A_INx.SchDoc
IN3
IN3_SB
SB_IN_
U12
8
VS+
6
SDA
SCL
4
5
ALERT
A0
A1
3
2
1
VBUS
IN_
C40
DNP
0.01µF
10
VIN+
9
GND
DNP
VIN-
7
GND
GND
4.99k
R19
DNP
INA226AIDGSR
4
HVL129A_INx.SchDoc
IN4_SB
SB_IN_
GND
IN_
C41
DNP
0.01µF
VDD
0
VS
0
R15
0
VDD
R31
R10
C29
0.1µF
GND
C20
4.7µF
C30
0.1µF
19
5
HVL129A_INx.SchDoc
IN5
IN5_SB
SB_IN_
GND
GND
GND
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
IN9
IN10
IN11
IN12
IN13
IN14
IN15
IN16
IN17
IN18
IN19
IN20
IN21
IN22
IN23
GND
6
HVL129A_INx.SchDoc
IN6
IN6_SB
SB_IN_
IN_
C43
DNP
0.01µF
GND
7
HVL129A_INx.SchDoc
IN7
IN7_SB
SB_IN_
37
38
IN_
C42
DNP
0.01µF
16
HVL129A_INx.SchDoc
IN_
IN16
C44
DNP
0.01µF
SB_IN_
IN_
DNP
C45
0.01µF
R24
10k
U11
13
14
25
26
27
29
30
31
32
33
34
35
36
1
2
3
4
5
6
7
8
10
11
12
VDD
SCLK
SI
SO
CS
16
17
18
15
SCLK
SI
SO
/CS
RESET
21
RESET
VS
VS
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
IN9
IN10
IN11
IN12
IN13
IN14
IN15
IN16
IN17
IN18
IN19
IN20
IN21
IN22
IN23
SCLK
MOSI
MISO
VDD
CS_MSDI
R3
2.00k
RST
D8
24 /INT
INT
INT
R25
INT_LED
BAS 52-02V H6327
750
20
CAP_A
A
C31
0.1µF
23
CAP_D
D
C32
0.1µF
22
CAP_PRE
GND
TP3
28
DGND
GND
9
AGND
GND
PRE
C33
1µF
1
IN4
GND
39
EP
TIC12400DCPQ1
GND
GND
8
HVL129A_INx.SchDoc
IN8
IN8_SB
SB_IN_
GND
17
HVL129A_INx.SchDoc
IN_
IN17
C46
DNP
0.01µF
SB_IN_
IN_
C47
DNP
0.01µF
GND
GND
9
HVL129A_INx.SchDoc
IN9_SB
SB_IN_
Vssint
18
HVL129A_INx.SchDoc
IN_
C48
DNP
0.01µF
IN18
SB_IN_
R20
VDD
VS
4.32k
IN_
3
2
1
IN9
C49
DNP
0.01µF
GND
J12
GND
10
HVL129A_INx.SchDoc
IN10
SB_IN_
SH-J12
19
HVL129A_INx.SchDoc
IN_
C50
DNP
0.01µF
IN19
SB_IN_
IN_
C51
DNP
0.01µF
+3.3V
GND
VS
Vssint
+5V
IN_
1
J4
Red
1
3
5
7
9
DNP
C53
DNP
0.01µF
2
SB_IN_
D6
2
4
6
8
10
IN20
SH-INT
C52
DNP
0.01µF
Indicator LEDs
20
HVL129A_INx.SchDoc
IN_
SH-5V
SB_IN_
SH-3.3V
IN11
SH-EXT_MC
SH-MSP_LED
GND
11
HVL129A_INx.SchDoc
GND
INT_LED
GND
12
HVL129A_INx.SchDoc
22
HVL129A_INx.SchDoc
C56
DNP
0.01µF
IN22
SB_IN_
IN_
C57
DNP
0.01µF
CSD17313Q2
Q1
GND
GND
SB_IN_
D2
D7
1
Green
1
1
GND
R26
1.62k
D4
GND
GND
14
HVL129A_INx.SchDoc
IN14
D5
GND
R28
5.10k
2
D1
3
4,7
IN_
R13
750
1,2,
5,6,8
SB_IN_
R27
750
Green
1
13
HVL129A_INx.SchDoc
IN13
2
MSP-LED
GND
Green
C55
DNP
0.01µF
2
R2
750
IN_
2
SB_IN_
EN_EXT_MICRO
IN21
GND
1
C54
DNP
0.01µF
Green
21
HVL129A_INx.SchDoc
IN_
Green
SB_IN_
2
IN12
23
HVL129A_INx.SchDoc
IN_
C58
DNP
0.01µF
IN23
SB_IN_
IN_
C59
DNP
0.01µF
GND
GND
15
HVL129A_INx.SchDoc
IN15
SB_IN_
IN_
C60
DNP
0.01µF
Copyright © 2017, Texas Instruments Incorporated
Figure 14. Main Device
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Board Files
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C25
+3.3V
VDD
0.1µF
C26
0.1µF
GND
GND
+3.3V
U10
U4A
+VBUS
8
FB1
IO4
5
IO3
4
GND
TPS73533DRBR
2
GND
GND
1
3
4
5
6
7
8
+3.3V
GND
C9
10µF
1
2
4
3
TPD4E004DRYR
GND
C12
2.2µF
C15
0.01µF
GND
GND
1.5k
GPIO6
GPIO2
GPIO4
GPIO5
GPIO3
GPIO7
3
GPIO12
VCCA
VCCB
A1
A2
A3
A4
A5
A6
B1
B2
B3
B4
B5
B6
GND
OE
GND
15
0
0
0
0
0
0
16
14
13
12
11
10
R33
R34
R39
R40
R42
R41
CS_MSDI
SCLK
MOSI
MISO
RST
INT
9
U4B
VUSB
NC
NC
NC
S1
R22
1.07Meg
GND
TXB0106PWR
C10
220pF
2
6
7
R23
49.9k
J6
SH-J6
TPS73533DRBR
Q2
CSD17313Q2
5,6,8
1,2,
3
33k
VCC
IO2
NR
2
GND
C14
1µF
Z2
1SMB5922BT3G
7.5V
PUR
6
IO1
EN
1
3
2
1
2
R8
5
90 ohm
C13
22µF
DP
33
U3
1
MINI-USB
DM
R6
4
33
1
R4
1
2
3
4
5
OUT
9
VBUS
J5
IN
GND
3
EN_EXT_MICRO
EXT_MICRO_CONTROL
4,7
GND
GND
R5
49.9k
GND
Alternate Functions for GPIO pins:
-------------------------------------------------------------GPIO0 - I2C:SDA
GPIO1 - I2C:SCL
GPIO2 - SPI:SCLK, EasyScale:DOUT, uWire:SCLK
GPIO3 - PWM2, INT0
GPIO4 - SPI:MOSI, UART:TXD, uWIRE:MOSI
GPIO5 - SPI:MISO, UART:RXD,uWIRE:MISO
GPIO6 - PWM1, OW1, SPI:CS
GPIO7 - PWM0, OW2, INT2
GPIO8 - ADC3
GPIO9 - ADC2, EasyScale:AIN
GPIO10 - VEREFGPIO11 - VEREF+
GPIO12 - FEC, CLOCK, INT3
GPIO13 - PWM3
U1
1
2
24MHz
C34
30pF
C2
30pF
GND
MSP-LED
GPIO13
GND
9
10
69
70
12
13
55
56
P5.0/A8/VREF+/VEREF+
P5.1/A9/VREF-/VEREFP5.2/XT2IN
P5.3/XT2OUT
P5.4/XIN
P5.5/XOUT
P5.6/TB0.0
P5.7/TB0.1
5
6
7
8
57
58
59
60
P7.0/CB8/A12
P7.1/CB9/A13
P7.2/CB10/A14
P7.3/CB11/A15
P7.4/TB0.2
P7.5/TB0.3
P7.6/TB0.4
P7.7/TB0CLK/MCLK
77
78
79
80
1
2
3
4
P8.0
P8.1
P8.2
15
16
17
PJ.0/TDO
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
72
73
74
75
RST/NMI/SBWTDIO
TEST/SBWTCK
V18
C16
220pF
C7
0.47µF
67
20
VBUS
VUSB
65
66
+3.3V
GND
11
18
50
GND
C6
0.1µF
C5
0.1µF
GND
C4
0.1µF
V18
VCORE
PU.0/DP
PU.1/DM
PUR
VBUS
VUSB
VSSU
AVSS1
AVSS2
DVSS1
DVSS2
AVCC1
DVCC1
DVCC2
76
71
R32
+3.3V
GPIO2
45
46 SDABRD
47 SCLBRD
48
GPIO4
51
GPIO5
52
53
54
P6.0/CB0/A0
P6.1/CB1/A1
P6.2/CB2/A2
P6.3/CB3/A3
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
e
mally
GPIO0
GPIO1
4.99k
DNP
+3.3V
U5
JP1
DNP
C18
DNP
0.1µF
SH-J2
5
V+
SDABRD
6
SDA
SCLBRD
1
SCL
3
ALERT
+3.3V
DNP
ADD0
4
GND
2
GND
GND
GPIO9
GPIO8
TMP102AQDRLRQ1
GND
JTAG
P8.0
1
3
5
7
9
11
13
DNP
2
4
6
8
10
12
14
Place on bottom of board on opposing side of
so that thermal resistance is minimiz
ed
+3.3V
JTAG8
R12
33k
+3.3V
J8
GND
JTAG8
62
64
DP
DM
63
PUR
thermal pad
C3
2200pF
R37
Y1
Place on top of
board in secluded section of PCB then hav
internal pours kept out and machine out slots to ther
isolate from board
GPIO3
R35
GPIO11
GPIO10
TP1
P4.0/PM_UCB1STE/PM_UCA1CLK
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P4.3/PM_UCB1CLK/PM_UCA1STE
P4.4/PM_UCA1TXD/PM_UCA1SIMO
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P4.6/PM_NONE
P4.7/PM_NONE
GPIO6
R36
I2CPU
P3.0/UCB0SIMO/UCB0SDA
P3.1/UCB0SOMI/UCB0SCL
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
P3.4/UCA0RXD/UCA0SOMI
P3.5/TB0.5
P3.6/TB0.6
P3.7/TB0OUTH/SVMOUT
29
30
31
32
33
34
35
36
DNPDNPDNP
+3.3V
4.99k
39
40
41
42
43
44
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
4.99k
SDABRD 37
SCLBRD 38
SDA
SCL
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
4.99k
21
22
23
24
25
26
27
28
GPIO7
2
1
GPIO12
U2
5
GND
C8
DNP
0.1µF
61
14
68
19
49
V+
SDABRD 6
SDA
SCLBRD
1
SCL
3
ALERT
DNP
ADD0
4
GND
2
GND
MSP430F5529IPNR
TMP102AQDRLRQ1
GND
GND
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 15. USB interface
DNP
+VBUS
SH-J1
J1
R14
DNP
0
1
VIN
VOUT
TAB
C23
2.2µF
4
C22
0.1µF
+3.3V
VDD
3
3
2
1
1
2
TPS7A6550QKVURQ1
U9
+5V
J7
GND
L1
SPC15363
Vbat_c
TP2
D3
VS
VBAT_MSDI
2
1
J9
SH-J7
GND
GND
12V Battery Input
600 ohm
C28
0.1µF
J10
SS34
C24
47µF
GND_MSDI
J11
SPC15354
GND
GND
SH-J11
Copyright © 2017, Texas Instruments Incorporated
Figure 16.
IN_0
SB_IN_
R1_0
220
C1_0
0.015µF
IN_
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 17. Input filters – IN10-IN23 use 10 Ω instead of 220 Ω
SCPU036 – October 2017
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6.2
www.ti.com
Switch Board Schematic
Figure 18 shows the SWITCH board schematic.
R1
VBAT
1
0
SW0-2
R2
2
0
OPEN
SW0-1
3
4
S1
S1
S2
S2
SW0
R3
VBAT
CGND
CGND
1
R22
0
R4
100
1
SW1-2
2
SW10-1
OPEN
0
3
2
SW1-1
S1
S1
S2
OPEN
SW10-2
3
4
R21
470
R24
100
CGND
4
S2
S1
S1
SW1
CGND
R5
VBAT
SW11-1
OPEN
3
2
SW2-1
R23
S1
SH-1
S1
S2
OPEN
SW11-2
3
4
SH-0
CGND
1
SW2-2
2
0
CGND
470
4
S2
S1
S1
SW2
SH-2
VBAT
SH-3
R7 CGND 1
SW3-2
2
R26
100
SW12-1
SH-11
SH-12
IN1_SB
IN1
R9
VBAT
SH-7
SH-8
IN4_SB
IN5_SB
IN5
SW4-2
2
3
S1
R28
CGND
1
IN14_SB
IN14
SW5-2
2
0
OPEN
SW5-1
3
R27
16
14
12
10
8
6
4
2
S1
S1
S2
CGND
OPEN
SW13-2
4
S1
S1
CGND
1
SW14-1
2
OPEN
3
R29
IN16_SB
IN16
S2
IN8_SB
VBAT
CGND
470
SW14-2
4
S1
S1
CGND
CGND
S2
SW14
IN17_SB
IN17
S2
CGND
1
R32
0
100
CGND
1
SW6-2
IN9_SB
IN9
R13
S2
SW13
100
SW5
IN8
S2
CGND
R30
4
IN7_SB
IN7
CGND
470
IN15_SB
IN15
S2
1
3
SH-17
15
13
11
9
7
5
3
1
IN13_SB
S2
2
J2
S2
IN13
CGND
S1
SW13-1
SH-16
IN12_SB
IN12
S2
0
R12
CGND
100
SW4-1
S1
SW4
R11
IN11_SB
IN11
OPEN
VBAT
IN10_SB
IN10
4
20
18
16
14
12
10
8
6
4
2
4
SW12
SH-15
R10
IN6_SB
IN6
CGND
470
SH-14
1
SH-9
IN4
R25
SH-13
CGND
0
J1
19
17
15
13
11
9
7
5
3
1
S2
S1
CGND
0
IN3_SB
IN3
S2
SW3
IN2_SB
IN2
S1
SW12-2
3
4
S1
SH-6
OPEN
2
SW3-1
SH-5
IN0_SB
IN0
CGND
1
OPEN
3
S2
CGND
SH-10
R8
S2
SW11
CGND
0
0
SH-4
S2
CGND
0
R6
S2
SW10
CGND
1
R14
SW15-1
OPEN
2
0
2
SW6-1
3
OPEN
SW15-2
3
4
R31
S1
S1
S2
CGND
470
4
S2
S1
S1
SW6
VBAT
R15
CGND
S2
S2
SW15
CGND
CGND
1
R34
0
100
CGND
1
SW7-2
R16
2
0
SW16-1
OPEN
2
OPEN
SW7-1
3
SW16-2
3
4
R33
S1
S1
S2
CGND
470
4
S2
S1
S1
SW7
VBAT
R17 CGND 1
S2
S2
SW16
CGND
CGND
0
R36
100
CGND
1
SW8-2
R18
2
0
SW17-1
OPEN
SW8-1
3
S1
S2
R35
S2
CGND
470
R19
4
S1
SW8
VBAT
SW17-2
3
4
S1
OPEN
2
CGND
S1
CGND
S2
S2
SW17
1
CGND
0
CGND
SW9-2
R20
2
0
OPEN
SW9-1
3
4
S1
S1
S2
S2
SW9
CGND
CGND
J4
VBAT
1
J8
VBAT
J5
1
J9
CGND
SH-18
CGND
1
2
J6
SH-19
SH-J6
SH-20
IN18
GND
IN18_SB
SH-21
CGND
IN19
SH-22
IN19_SB
J7
A2
B1
A1
IN17_SB
IN16_SB
IN15_SB
IN22
C9
B8
C8
IN14_SB
IN12_SB
IN13_SB
IN23
C7
B6
C6
IN11_SB
IN9_SB
IN10_SB
C5
B4
C4
IN8_SB
IN6_SB
IN7_SB
C3
B2
C2
IN5_SB
IN2_SB
IN4_SB
C1
IN3_SB
12
10
8
6
4
2
IN21_SB
IN22_SB
R37
100
R38
294
R39
750
R40
100
R41
294
R42
750
R43
100
R44
294
R45
750
R46
100
R47
294
R48
750
R49
100
R50
294
R51
750
R52
100
R53
220
R54
402
R55
887
R56
1.65k
20-1 20-2 20-3
CGND
22-1 22-2 22-3
CGND
2
4
6
8
1
3
5
7
6
8
10
12
9
11
5
7
SW23_B
1
3
9
11
5
7
1
3
SW23_A
21-1 21-2 21-3
CGND
2
4
10
12
6
8
2
4
6
8
10
12
9
11
5
7
SW22
1
3
9
11
5
7
1
3
SW21
19-1 19-2 19-3
CGND
2
4
10
12
6
8
2
4
10
12
SW20
18-1 18-2 18-3
CGND
6
8
SW19
9
11
SW18
2
4
10
12
IN23_SB
5
7
A4
B3
A3
IN21
C11
B10
C10
J3
11
9
7
5
3
1
1
3
A6
B5
A5
IN20_SB
IN19_SB
IN18_SB
IN20_SB
6
8
A8
B7
A7
C13
B12
C12
SH-23
IN20
9
11
A10
B9
A9
IN23_SB
IN22_SB
IN21_SB
2
4
A12
B11
A11
C15
B14
C14
5
7
A14
B13
A13
IN1_SB
IN0_SB
1
3
A16
B15
A15
B16
C16
23-1 23-2 23-3
CGND
23-4 23-5
CGND
GND
Copyright © 2017, Texas Instruments Incorporated
Figure 18. SWITCH Board Schematic
42
TIC12400 Evaluation Module
SCPU036 – October 2017
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6.3
Main Board Bill of Materials
Table 1 lists the main board bill of materials (BOM).
Table 1. Main Board Bill of Materials
Designator
!PCB1
QTY
Value
1
!PCB2
1
C1_0, C1_1, C1_2,
C1_3, C1_4, C1_5,
C1_6, C1_7, C1_8,
C1_9, C1_10, C1_11,
C1_12, C1_13,
C1_14, C1_15,
C1_16, C1_17,
C1_18, C1_19,
C1_20, C1_21,
C1_22, C1_23
24
C2, C34
C3
Description
Package Reference
Printed Circuit Board
Part Number
HVL129
Daughter card load board. Set in separate ESD bag. Kiting item.
N/A
HVL149
0.015uF
CAP, CERM, 0.015 µF, 100 V, +/- 10%, X7R, 0603
0603
C0603C153K1RACTU
2
30pF
CAP, CERM, 30pF, 100V, +/-5%, C0G/NP0, 0603
0603
GRM1885C2A300JA01D
1
2200pF
CAP, CERM, 2200pF, 50V, +/-10%, X7R, 0603
0603
C0603X222K5RACTU
C4, C5, C6
3
0.1uF
CAP, CERM, 0.1uF, 16V, +/-5%, X7R, 0603
0603
0603YC104JAT2A
C7
1
0.47uF
CAP, CERM, 0.47uF, 10V, +/-10%, X7R, 0603
0603
C0603C474K8RACTU
C9
1
10uF
CAP, CERM, 10uF, 16V, +/-20%, X5R, 0805
0805
0805YD106MAT2A
C10, C16
2
220pF
CAP, CERM, 220pF, 50V, +/-1%, C0G/NP0, 0603
0603
06035A221FAT2A
C12
1
2.2uF
CAP, CERM, 2.2uF, 16V, +/-10%, X5R, 0805
0805
0805YD225KAT2A
C13
1
22uF
CAP ALUM 22UF 10V 20% SMD
E55
EEE-1AA220WR
C14
1
1uF
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0805
0805
C0805C105K3RACTU
C15
1
0.01uF
CAP, CERM, 0.01uF, 50V, +/-10%, X7R, 0603
0603
C1608X7R1H103K
C20
1
4.7uF
CAP, CERM, 4.7 µF, 50 V, +/- 20%, X7R, 1206_190
1206_190
C3216X7R1H475M160AC
C22, C31, C32
3
0.1uF
CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603
0603
C0603C104J3RAC
C23
1
2.2uF
CAP, CERM, 2.2 µF, 10 V, +/- 10%, X7R, 0805
0805
GRM21BR71A225KA01L
C24
1
47uF
CAP, AL, 47 µF, 63 V, +/- 20%, ohm, SMD
SMT Radial G
EEETG1J470P
C25, C26
2
0.1uF
CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603
0603
C0603C104J3RACTU
C28
1
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0805
0805
C0805C104K5RACTU
C29, C30
2
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603
0603
06035C104KAT2A
C33
1
1uF
CAP, CERM, 1 µF, 50 V, +/- 10%, X7R, 0603
0603
UMK107AB7105KA-T
D1, D2, D4, D5, D7
5
Green
LED, Green, SMD
1.6x0.8x0.8mm
LTST-C190KGKT
D3
1
40V
Diode, Schottky, 40 V, 3 A, SMC
SMC
SS34
D6
1
Red
LED, Red, SMD
LED_0603
LTST-C191KRKT
D8
1
45V
Diode, Schottky, 45 V, 0.75 A, SOD-523
SOD-523
BAS 52-02V H6327
FB1
1
90 ohm
Ferrite Bead, 90 ohm @ 100 MHz, 1.5 A, 1206
1206
MI1206K900R-10
H2, H5, H8, H11
4
Standoff, Hex, 1"L #4-40 Nylon
Standoff
1902E
H3, H6, H9, H12
4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead
Screw
NY PMS 440 0025 PH
SCPU036 – October 2017
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Table 1. Main Board Bill of Materials (continued)
Designator
QTY
IN_0, IN_1, IN_2,
IN_3, IN_4, IN_5,
IN_6, IN_7, IN_8,
IN_9, IN_10, IN_11,
IN_12, IN_13, IN_14,
IN_15, IN_16, IN_17,
IN_18, IN_19, IN_20,
IN_21, IN_22, IN_23
24
Test Lead clips and hooks, SMT
Test Point, Body 3.25x1.65mm S1751-46
J1, J11, JP1
3
Header, 100mil, 2x1, Gold with Tin Tail, SMT
2x1 Header
TSM-102-01-L-SV
J2
1
Header, 2.54mml, 16x3, Gold, TH
Header, 2.54mml, 16x3, TH
5650478-5
J4
1
Header, 2.54mm, 5x2, Gold, SMT
Header, 2.54mm, 5x2, SMT
TSM-105-01-L-DV-P
J5
1
Connector, Receptacle, Mini-USB Type B, R/A, Top Mount SMT
USB Mini Type B
1734035-2
J6, J7, J12
3
Header, 100mil, 3x1, Gold, SMT
Samtec_TSM-103-01-X-SV
TSM-103-01-L-SV
J9
1
BANANA JACK, SOLDER LUG, RED, TH
Red Insulated Banana Jack
SPC15363
J10
1
BANANA JACK, SOLDER LUG, BLACK, TH
Black Insulated Banana Jack
SPC15354
L1
1
0805
MPZ2012S601A
Q1, Q2
2
30V
MOSFET, N-CH, 30 V, 5 A, SON 2x2mm
SON 2x2mm
CSD17313Q2
R1_0, R1_1, R1_2,
R1_3, R1_4, R1_5,
R1_6, R1_7, R1_8,
R1_9
10
220
RES, 220, 1%, 0.5 W, AEC-Q200 Grade 0, 0805
0805
ERJ-P6WF2200V
R1_10, R1_11,
R1_12, R1_13,
R1_14, R1_15,
R1_16, R1_17,
R1_18, R1_19,
R1_20, R1_21,
R1_22, R1_23
14
10.0
RES, 10.0, 1%, 0.5 W, AEC-Q200 Grade 0, 0805
0805
ERJ-P6WF10R0V
R2, R13, R25, R27
4
750
RES, 750, 5%, 0.1 W, 0603
0603
CRCW0603750RJNEA
R3
1
2.00k
RES, 2.00 k, 1%, 0.1 W, 0603
0603
CRCW06032K00FKEA
R4, R6
2
33
RES, 33 ohm, 5%, 0.063W, 0402
0402
CRCW040233R0JNED
R5, R23
2
49.9k
RES, 49.9 k, 1%, 0.1 W, 0603
0603
CRCW060349K9FKEA
R7
1
1.5k
RES, 1.5k ohm, 5%, 0.063W, 0402
0402
CRCW04021K50JNED
R8, R12
2
33k
RES, 33k ohm, 5%, 0.063W, 0402
0402
CRCW040233K0JNED
R10, R15, R31, R33,
R34, R39, R40, R41,
R42
9
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
R20
1
RES, 4.32 k, 1%, 0.1 W, 0603
0603
RC0603FR-074K32L
R22
1
0603
CRCW06031M07FKEA
R24
1
10k
RES, 10 k, 5%, 0.1 W, 0603
0603
CRCW060310K0JNEA
R26
1
1.62k
RES, 1.62 k, 1%, 0.1 W, 0603
0603
CRCW06031K62FKEA
R28
1
5.10k
RES, 5.10 k, 1%, 0.1 W, 0603
0603
RC0603FR-075K1L
S1
1
Switch, Tactile, SPST-NO, SMT
Switch, 6.1x1.8x4.6 mm
EVQ-PSD02K
44
Value
Description
600 ohm Ferrite Bead, 600 ohm @ 100 MHz, 2 A, 0805
4.32k
1.07Meg RES, 1.07Meg ohm, 1%, 0.1W, 0603
TIC12400 Evaluation Module
Package Reference
Part Number
SCPU036 – October 2017
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Copyright © 2017, Texas Instruments Incorporated
Board Files
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Table 1. Main Board Bill of Materials (continued)
Designator
QTY
Value
SH-3.3V, SH-5V, SHEXT_MC, SH-J6, SHJ7, SH-J11, SH-J12,
SH-MSP_LED
8
1x2
TP1
TP2
Description
Package Reference
Part Number
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
1
Test Point, Multipurpose, Black, TH
Black Multipurpose Testpoint
5011
1
Test Point, Multipurpose, Red, TH
Red Multipurpose Testpoint
5010
TP3
1
Header, 100mil, 1pos, Gold, TH
Testpoint
TSW-101-07-G-S
TP4
1
Header, 2.54mm, 24x1, Gold, TH
Header, 2.54mm, 24x1, TH
PEC24SAAN
U1
1
25 MHz Mixed Signal Microcontroller with 128 KB Flash, 8192 B SRAM and 63 GPIOs, -40 to 85 PN0080A
degC, 80-pin QFP (PN), Green (RoHS & no Sb/Br)
U3
1
U4
1
U9
SON-6
TPD4E004DRYR
Single Output High PSRR LDO, 500 mA, Fixed 3.3 V Output, 2.7 to 6.5 V Input, with Low IQ, 8pin SON (DRB), -40 to 125 degC, Green (RoHS & no Sb/Br)
DRB0008A
TPS73533DRBR
1
Single Output Automotive LDO, 300 mA, Fixed 5 V Output, 4 to 40 V Input, 3-pin PFM (KVU),
-40 to 125 degC, Green (RoHS & no Sb/Br)
KVU0003A
TPS7A6550QKVURQ1
U10
1
6-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING
AND ±15-kV ESD PROTECTION, PW0016A
PW0016A
TXB0106PWR
U11
1
Multiple Switch Detection Interface (MSDI) device, DCP0038A
DCP0038A
TIC12400DCPQ1
Y1
1
Crystal, 24.000MHz, 20pF, SMD
Crystal, 11.4x4.3x3.8mm
ECS-240-20-5PX-TR
Z2
1
7.5V
Diode, Zener, 7.5V, 550mW, SMB
SMB
1SMB5922BT3G
C8, C18
0
0.1uF
CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603
0603
C0603C104J3RACTU
0
0.1uF
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, 0603
0603
06035C104KAT2A
0
0.01uF
CAP, CERM, 0.01 µF, 50 V, +/- 5%, X7R, 0603
0603
C0603C103J5RACTU
C11, C36
C37,
C41,
C45,
C49,
C53,
C57,
C38,
C42,
C46,
C50,
C54,
C58,
C39,
C43,
C47,
C51,
C55,
C59,
C40,
C44,
C48,
C52,
C56,
C60
TPD4E0 IC, 4-Chan ESD-Protection Array
04DRYR
MSP430F5529IPNR
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
J3
0
Header(Shrouded), 2.54mm, 5x2, Gold, TH
Header, 2.54mm, 5x2, TH
AWHW-10G-0202-T
J8
0
Header, 100mil, 7x2, SMT
Header, 100 mil, 7x2, SMT
0015912140
R9, R11, R16, R17,
R18, R19, R32, R35,
R36, R37
0
RES, 4.99 k, 1%, 0.1 W, 0603
0603
CR0603-FX-4991ELF
R14
0
0
RES, 0, 5%, 0.1 W, 0603
0603
CRCW06030000Z0EA
SH-INT, SH-J1, SHJ2
0
1x2
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
U2, U5
0
Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial Interface in SOT563,
DRL0006A
DRL0006A
TMP102AQDRLRQ1
U12, U13
0
High-or Low-Side Measurement, Bi-Directional CURRENT/POWER MONITOR with I2C(TM)
Interface, DGS0010A
DGS0010A
INA226AIDGSR
4.99k
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45
Board Files
6.4
www.ti.com
SWITCH Board Bill of Materials
Table 2 lists the SWITCH board BOM.
Table 2. SWITCH Board Bill of Materials
Designator
QT
Y
Value
Description
Package Reference
Part Number
!PCB1
1
Printed Circuit Board
H1, H2, H3, H4
4
Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead
Screw
NY PMS 440 0025 PH
H5, H6, H7, H8
4
Standoff, Hex, 1"L #4-40 Nylon
Standoff
1902E
J1
1
Header, 2.54mm, 10x2, Gold, SMT
1000x180x290mil
TSM-110-01-L-DV-P
J2
1
Header, 2.54mm, 8x2, Gold, SMT
Header, 2.54mm, 8x2, SMT
TSM-108-01-L-DV
J3
1
Header, 2.54mm, 6x2, Gold, SMT
Header, 2.54mm, 6x2, SMT
TSM-106-01-L-DV
J4, J5
2
Header, 100mil, 1pos, Gold, TH
Testpoint
TSW-101-07-G-S
J6
1
Header, 2.54 mm, 2x1, Gold, R/A, SMT
Header, 2.54 mm, 2x1, R/A,
SMT
0878980204
J7
1
Receptacle, 2.54mm, 16x3, Gold, R/A, TH
Receptacle, 2.54mm, 16x3, R/A,
TH
5650868-4
J8
1
BANANA JACK, SOLDER LUG, RED, TH
Red Insulated Banana Jack
SPC15363
J9
1
BANANA JACK, SOLDER LUG, BLACK, TH
Black Insulated Banana Jack
SPC15354
R1, R2, R3, R4, R5,
R6, R7, R8, R9, R10,
R11, R12, R13, R14,
R15, R16, R17, R18,
R19, R20
20
0
RES, 0, 5%, 0.25 W, 1206
1206
ERJ-8GEY0R00V
R21, R23, R25, R27,
R29, R31, R33, R35
8
470
RES, 470, 1%, 0.25 W, 1206
RC1206FR-07470RL
R22, R24, R26, R28,
R30, R32, R34, R36
8
100
RES, 100, 1%, 0.25 W, 1206
ERJ-8ENF1000V
R37, R40, R43, R46,
R49, R52
6
100
RES, 100, 1%, 0.25 W, 1206
1206
ERJ-8ENF1000V
R38, R41, R44, R47,
R50
5
294
RES, 294, 1%, 0.25 W, 1206
1206
RC1206FR-07294RL
R39, R42, R45, R48,
R51
5
750
RES, 750, 1%, 0.25 W, 1206
1206
CRCW1206750RFKEA
R53
1
220
RES, 220, 1%, 0.25 W, 1206
1206
RC1206FR-07220RL
R54
1
402
RES, 402, 1%, 0.25 W, 1206
1206
ERJ-8ENF4020V
R55
1
887
RES, 887, 1%, 0.25 W, 1206
1206
ERJ-8ENF8870V
R56
1
1.65k
RES, 1.65 k, 1%, 0.25 W, 1206
1206
ERJ-8ENF1651V
46
HVL149
TIC12400 Evaluation Module
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Board Files
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Table 2. SWITCH Board Bill of Materials (continued)
Designator
QT
Y
Value
Description
Package Reference
Part Number
SH-0, SH-1, SH-2,
SH-3, SH-4, SH-5,
SH-6, SH-7, SH-8,
SH-9, SH-10, SH-11,
SH-12, SH-13, SH14, SH-15, SH-16,
SH-17, SH-18, SH19, SH-20, SH-21,
SH-22, SH-23, SH-J6
25
1x2
Shunt, 100mil, Gold plated, Black
Shunt
SNT-100-BK-G
SW0, SW1, SW2,
SW3, SW4, SW5,
SW6, SW7, SW8,
SW9, SW10, SW11,
SW12, SW13, SW14,
SW15, SW16, SW17
18
Switch, Slide, SP3T, On-On-On, 3 Pos, 0.3A, 30 VDC, TH
12.6x4.3mm
SS-13D16-VG 4 PA
SW18, SW19, SW20,
SW21, SW22,
SW23_A
6
Switch, DPST, 3 Pos, 0.1 A, 50 VDC, SMD
17.67x9.78mm
204-213ST
SW23_B
1
Switch, DPST, 2 Pos, 0.1 A, 50 VDC, SMD
12.34x9.78mm
204-212ST
FID1, FID2, FID3
0
Fiducial mark. There is nothing to buy or mount.
N/A
N/A
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Copyright © 2017, Texas Instruments Incorporated
47
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
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TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
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enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
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(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
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RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
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