TL145406NE4


       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 D Meets or Exceeds the Requirements of D D D D D DW OR N PACKAGE (TOP VIEW) ANSI TIA/EIA-232-F and ITU V.28 Designed to Support Data Rates up to 120 kbit/s Over 3-m Cable ESD Protection Exceeds 5 kV on All Pins Flow-Through Design Wide-Driver Supply Voltage . . . ±7.5 V to ±15 V Functionally Interchangeable With Motorola MC145406 and Texas Instruments SN75C1406 VDD 1RA 1DY 2RA 2DY 3RA 3DY VSS 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 VCC 1RY 1DA 2RY 2DA 3RY 3DA GND description The TL145406 is a bipolar device containing three independent drivers and receivers that are used to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). The drivers and receivers of the TL145406 are similar to those of the SN75188 quadruple driver and SN75189A quadruple receiver, respectively. The pinout matches the flow-through design of the SN75C1406 to reduce the board space required and to allow easy interconnection. The bipolar circuits and processing of the TL145406 provide a rugged low-cost solution for this function at the expense of quiescent power and external passive components relative to the SN75C1406. The TL145406 complies with the requirements of TIA/EIA-232-F and ITU (formerly CCITT) V.28 standards. These standards are for data interchange between a host computer and peripheral at signaling rates up to 20 kbit/s. The switching speeds of the TL145406 are fast enough to support rates up to 120 kbit/s with lower capacitive loads (shorter cables). Interoperability at the higher signaling rates cannot be assured unless the designer has design control of the cable and of the interface circuits at both ends. For interoperability at signaling rates to 120 kbit/s, use of TIA/EIA-423-B (ITU V.10) and TIA/EIA-422-B (ITU V.11) standards is recommended. The TL145406 is characterized for operation from 0°C to 70°C. AVAILABLE OPTIONS PACKAGED DEVICES TA PLASTIC DIP (N) PLASTIC SMALL OUTLINE (DW) 0°C to 70°C TL145406N TL145406DW The DW package also is available taped and reeled. Add the suffix R to the device type (e.g., TL145406DWR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  2001, Texas Instruments Incorporated 
 
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       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 logic symbol† 1RA 2RA 3RA 1DY 2DY 3DY 2 15 4 13 6 11 3 14 5 12 7 10 1RY 2RY 3RY 1DA 2DA 3DA † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) Typical of Each Receiver RA 2, 4, 6 15, 13, 11 RY Typical of Each Driver 14, 12, 10 3, 5, 7 DA DY schematic (each driver) To Other Drivers VDD ESD 11.6 kΩ Input DAx 9.4 kΩ ESD 75.8 Ω 320 Ω 4.2 kΩ GND To Other Drivers 10.4 kΩ VSS 3.3 kΩ 68.5 Ω ESD To Other Drivers Resistor values shown are nominal. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ESD DYx Output 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 schematic (each receiver) To Other Receivers ESD 9 kΩ 5 kΩ VCC 1.66 kΩ ESD RYx Output 2 kΩ Input RAx ESD 3.8 kΩ 10 kΩ GND To Other Receivers Resistor values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage (see Note 1): VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V Input voltage range: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 7 V Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −30 V to 30 V Driver output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −15 V to 15 V Receiver low-level output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to the network ground terminal. 2. The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 recommended operating conditions MIN NOM MAX UNIT VDD VSS Supply voltage 7.5 9 15 V Supply voltage −7.5 −9 −15 V VCC VIH Supply voltage 4.5 5 5.5 V High-level input voltage (driver only) 1.9 VIL Low-level input voltage (driver only) IOH High-level output current IOL Low-level output current TA Operating free-air temperature V 0.8 Driver V −6 Receiver −0.5 Driver mA 6 Receiver 16 0 70 mA °C supply currents PARAMETER TEST CONDITIONS All inputs at 1.9 V, IDD Supply current from VDD All inputs at 0.8 V, All inputs at 1.9 V, ISS 4 No load No load Supply current from VSS All inputs at 0.8 V, ICC No load Supply current from VCC All inputs at 5 V, TYP MAX VSS = −9 V VSS = −12 V 15 VDD = 15 V, VDD = 9 V, VSS = −15 V VSS = −9 V 25 VDD = 12 V, VDD = 15 V, VSS = −12 V VSS = −15 V 5.5 VDD = 9 V, VDD = 12 V, VDD = 15 V, VSS = −9 V VSS = −12 V −15 VSS = −15 V VSS = −9 V −25 No load VDD = 9 V, VDD = 12 V, No load, VDD = 15 V, VCC = 5 V POST OFFICE BOX 655303 MIN VDD = 9 V, VDD = 12 V, • DALLAS, TEXAS 75265 UNIT 19 4.5 mA 9 −19 −3.2 VSS = −12 V VSS = −15 V mA −3.2 −3.2 13.2 20 mA 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 DRIVER SECTION electrical characteristics over recommended operating free-air temperture range, VDD = 9 V, VSS = −9 V, VCC = 5 V (unless otherwise noted) PARAMETER VOH VOL High-level output voltage IIH IIL High-level input current IOS(H) IOS(L) rO TEST CONDITIONS MIN MAX RL = 3 kΩ, See Figure 1 RL = 3 kΩ, See Figure 1 VI = 5 V, VI = 0, See Figure 2 10 µA Low-level input current See Figure 2 −1.6 mA High-level short-circuit output current (see Note 4) VIL = 0.8 V, VO = 0 or VSS, Low-level short-circuit output current Output resistance (see Note 5) 7.5 UNIT VIL = 0.8 V, VIH = 1.9 V, Low-level output voltage (see Note 3) 6 TYP −7.5 V −6 V See Figure 1 −4.5 −10 −19.5 mA VIH = 2 V, VO = 0 or VDD, See Figure 1 VCC = VDD = VSS = 0, VO = −2 V to 2 V 4.5 10 19.5 mA Ω 300 NOTES: 3. The algebraic convention, where the more positive (less negative) limit is designated as maximum, is used in this data sheet for logic levels only (e.g., if −10 V is maximum, the typical value is a more negative voltage). 4. Output short-circuit conditions must maintain the total power dissipation below absolute maximum ratings. 5. Test conditions are those specified by TIA/EIA-232-F and as listed above. switching characteristics, VCC = 5 V, VDD = 12 V, VSS = −12 V, TA = 25°C PARAMETER tPLH tPHL tTLH tTHL TYP MAX UNIT Propagation delay time, low- to high-level output RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 3 315 500 ns Propagation delay time, high- to low-level output RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 3 75 175 ns RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 3 60 100 ns RL = 3 kΩ to 7 kΩ, CL = 2500 pF, See Figure 3 and Note 6 1.7 2.5 µs RL = 3 kΩ to 7 kΩ, CL = 15 pF, See Figure 3 40 75 ns RL = 3 kΩ to 7 kΩ, CL = 2500 pF, See Figure 3 and Note 7 1.5 2.5 µs Transition time, low- to high-level output Transition time, high- to low-level output TEST CONDITIONS MIN NOTES: 6. Measured between −3-V and 3-V points of the output waveform (TIA/EIA-232-F conditions). All unused inputs are tied. 7. Measured between 3-V and −3-V points of the output waveform (TIA/EIA-232-F conditions). All unused inputs are tied. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 RECEIVER SECTION electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS See Figure 5 TA = 25°C TA = 0°C to 70°C MIN TYPĔ MAX 1.75 1.9 2.3 VIT+ Positive-going threshold voltage VIT− Vhys Negative-going threshold voltage VOH High-level output voltage IOH = −0.5 mA VIH = 0.75 V Inputs open VOL Low-level output voltage IOL = 10 mA, VI = 25 V, VI = 3 V See Figure 5 3.6 VI = 3 V, VI = −25 V, See Figure 5 0.43 See Figure 5 −3.6 VI = −3 V, See Figure 5 −0.43 0.75 Input hysteresis (VIT+ − VIT−) IIH High-level input current IIL Low-level input current 1.55 2.3 0.97 1.25 0.5 2.6 V V V 4 5 V 2.6 0.2 IOS Short-circuit output current † All typical values are at TA = 25°C, VCC = 5, VDD = 9 V, and VSS = −9 V. UNIT 0.45 V 8.3 mA −8.3 mA −3.4 −12 mA TYP MAX UNIT switching characteristics, VCC = 5 V, VDD = 12 V, VSS = −12 V, TA = 25°C PARAMETER TEST CONDITIONS MIN tPLH tPHL Propagation delay time, low- to high-level output CL = 50 pF, RL = 5 kΩ, See Figure 6 107 425 ns Propagation delay time, high- to low-level output CL = 50 pF, RL = 5 kΩ, See Figure 6 42 150 ns tTLH tTHL Transition time, low- to high-level output CL = 50 pF, RL = 5 kΩ, See Figure 6 175 400 ns Transition time, high- to low-level output CL = 50 pF, RL = 5 kΩ, See Figure 6 16 60 ns PARAMETER MEASUREMENT INFORMATION IOS(L) VDD VCC VDD or GND VDD VCC −IOS(H) IIH VSS or GND VI VI VO −IIL RL = 3 kΩ VI VSS Figure 1. Driver Test Circuit for VOH, VOL, IOS(H), and IOS(L) 6 POST OFFICE BOX 655303 VSS Figure 2. Driver Test Circuit for IIH and IIL • DALLAS, TEXAS 75265 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 PARAMETER MEASUREMENT INFORMATION 3V Input Input 1.5 V 1.5 V VDD VCC Pulse Generator (see Note B) 0 tPHL CL (see Note A) RL 90% tPLH 50% 10% Output VSS 90% 50% 10% VOL tTHL TEST CIRCUIT VOH tTLH VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 3. Driver Test Circuit and Voltage Waveforms VDD VCC VDD VCC VIT, VI −IOS −IOH VOH VOL VI IOL VSS VSS Figure 5. Receiver Test Circuit for VIT, VOH, and VOL Figure 4. Receiver Test Circuit for IOS 4V Input Input 50% 50% VDD VCC Pulse Generator (see Note B) 0 tPHL CL (see Note A) RL 90% 50% 10% Output VSS tPLH 50% 10% tTHL 90% VOH VOL tTLH VOLTAGE WAVEFORMS TEST CIRCUIT NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: tw = 25 µs, PRR = 20 kHz, ZO = 50 Ω, tr = tf < 50 ns. Figure 6. Receiver Propagation and Transition Times POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 TYPICAL CHARACTERISTICS DRIVER OUTPUT CURRENT vs OUTPUT VOLTAGE DRIVER VOLTAGE TRANSFER CHARACTERISTICS ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ 12 20 VDD = 12 V, VSS = −12 V 9 VDD = 9 V, VSS = −9 V 12 IO − Output Current − mA 6 VO − Output Voltage − V 16 VDD = 6 V, VSS = −6 V 3 0 −3 −6 −9 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 8 0 0.2 0.4 0.6 VDD = 9 V VSS = −9 V TA = 25°C 0 −8 1.2 1.4 1.6 1.8 VOH (VI = 0.8 V) −20 −16 2 −12 −8 −4 DRIVER SHORT-CIRCUIT OUTPUT CURRENT vs FREE-AIR TEMPERATURE 8 12 16 ÎÎÎÎÎÎ ÎÎÎÎÎÎ DRIVER SLEW RATE vs LOAD CAPACITANCE 1000 IOS(L) (VI = 1.9 V) 9 6 SR − Slew Rate − V/µs I OS − Short-Circuit Output Current − mA 4 Figure 8 Figure 7 ÎÎÎÎÎ ÎÎÎÎÎ 3 VDD = 9 V VSS = −9 V VO = 0 0 −3 ÎÎÎÎÎÎ ÎÎÎÎÎÎ −6 IOS(H) (VI = 0.8 V) −9 −12 0 10 20 30 40 50 60 70 TA − Free-Air Temperature − °C 100 10 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 1 10 VDD = 9 V VSS = −9 V RL = 3 kΩ TA = 25°C 100 Figure 10 POST OFFICE BOX 655303 1000 CL − Load Capacitance − pF Figure 9 8 0 VO − Output Voltage − V VI − Input Voltage − V 12 3-kΩ Load Line ÎÎÎÎÎ −16 1 ÎÎÎÎ ÎÎÎÎ −4 −12 0.8 VOL (VI = 1.9 V) 4 RL = 3 kΩ TA = 25°C −12 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ • DALLAS, TEXAS 75265 10000 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 TYPICAL CHARACTERISTICS RECEIVER INPUT THRESHOLD VOLTAGE vs SUPPLY VOLTAGE RECEIVER INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE 2.4 2 1.6 VIT+ V IT − Input Threshold Voltage − V V IT − Input Threshold Voltage − V VIT+ 1.8 2.2 1.8 1.6 1.4 1.2 1 VIT− 0.8 0.6 0.4 ÎÎÎ 2 1.4 ÎÎ ÎÎ 1.2 VIT− 1 0.8 0.6 0.4 0.2 0 0 10 20 30 40 50 60 2 70 3 TA − Free-Air Temperature − °C 4 Figure 11 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ Amplitude − V 4 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎ VCC = 5 V TA = 25°C See Note A 16 CC = 300 pF 14 CC = 500 pF 3 CC = 12 pF 2 CC = 100 pF 1 0 0 40 100 400 7 8 9 10 RECEIVER MAXIMUM SUPPLY VOLTAGE vs FREE-AIR TEMPERATURE 1000 4000 10000 tw − Pulse Duration − ns NOTE A: This figure shows the maximum amplitude of a positive-going pulse that, starting from 0, does not cause a change of the output level. VCC − Supply Voltage − V 5 6 Figure 12 RECEIVER NOISE REJECTION 6 5 VCC − Supply Voltage − V 12 10 8 6 4 ÎÎÎÎÎÎÎÎÎÎÎ 2 RL ≥ 3 kΩ (from each output to GND) 0 0 10 20 30 40 50 60 70 TA − Free-Air Temperature − °C Figure 13 Figure 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 

       SLLS185D − DECEMBER 1994 − REVISED JULY 2001 APPLICATION INFORMATION Diodes placed in series with the VDD and VSS leads protect the TL145406 during the fault condition in which the device outputs are shorted to ±15 V and the power supplies are at low. Diodes also provide low-impedance paths to ground (see Figure 15). VDD ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ TL145406 ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ ÏÏÏÏ VDD Output ±15 V TL145406 VSS VSS Figure 15. Power-Supply Protection to Meet Power-Off Fault Conditions of ANSI TIA/EIA-232-F 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 10-May-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL145406DW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406DWE4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406DWG4 ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406DWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406DWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL145406N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL145406NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TL145406DWR Package Package Pins Type Drawing SOIC DW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 10.75 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.7 2.7 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL145406DWR SOIC DW 16 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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