TL3116CDR


 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 D Ultra-Fast Operation . . . 10 ns (typ) D Low Positive Supply Current D AND PW PACKAGE (TOP VIEW) 12.7 mA (Typ) D Operates From a Single 5-V Supply or From D D D D D D a Split ± 5-V Supply Complementary Outputs Input Common-Mode Voltage Includes Negative Rail Low Offset Voltage No Minimum Slew Rate Requirement Output Latch Capability Functional Replacement to the LT1116 VCC+ IN + IN − VCC− 8 2 7 3 6 4 5 IN + Q OUT Q OUT IN − The TL3116 is a pin-for-pin functional replacement for the LT1116 comparator, offering high-speed operation but consuming much less power. AVAILABLE OPTIONS PACKAGED DEVICES TSSOP (PW) 0°C to 70°C TL3116CD TL3116CPWLE −40°C to 85°C TL3116ID TL3116IPWLE CHIP FORM‡ (Y) POSITIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE ÎÎÎÎÎ ÎÎÎÎÎ 15 14 I CC − Positive Supply Current − mA The TL3116 is an ultra-fast comparator designed to interface directly to TTL logic while operating from either a single 5-V power supply or dual ± 5-V supplies. The input common-mode voltage extends to the negative rail for ground sensing applications. It features extremely tight offset voltage and high gain for precision applications. It has complementary outputs that can be latched using the LATCH ENABLE terminal. Figure 1 shows the positive supply current of the comparator. The TL3116 only requires 12.7 mA (typical) to achieve a propagation delay of 10 ns. SMALL OUTLINE† (D) Q OUT Q OUT GND LATCH ENABLE symbol (each comparator) description TA 1 VCC = ± 5 V 13 12 11 10 9 8 7 6 5 −50 −25 0 25 50 75 100 125 TA − Free-Air Temperature − °C TL3116Y Figure 1 — † The PW packages are available left-ended taped and reeled only. ‡ Chip forms are tested at TA = 25°C only. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  1997, Texas Instruments Incorporated  
 
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  SLCS132C − MARCH 1997 − REVISED MAY 1997 TL3116Y chip information This chip, when properly assembled, displays characteristics similar to the TL3116C. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS VCC+ (1) (5) (1) (1) LATCH ENABLE (8) (1) IN+ (7) IN− (2) (2) + (3) − (8) Q OUT (7) Q OUT (4) (6) VCC − GND 55 (6) CHIP THICKNESS: 10 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM (3) (6) (5) (4) TJ max = 150°C TOLERANCES ARE ± 10%. (6) ALL DIMENSIONS ARE IN MILS. TERMINALS 1 AND 6 CAN BE CONNECTED TO MULTIPLE PADS. 63 COMPONENT COUNT 2 Bipolars 53 MOSFETs 49 Resistors 46 Capacitors 14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 7 V to 7 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage, VI (LATCH ENABLE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to network ground. 2. Differential voltages are at IN+ with respect to IN −. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING D 725 mW 5.8 mW/°C 464 mW PW 525 mW 4.2 mW/°C 336 mW DERATING FACTOR ABOVE TA = 25°C POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TA = 70°C POWER RATING 3 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 electrical characteristics at specified operating free-air temperature, VDD = ±5 V, VLE = 0 (unless otherwise noted) TEST CONDITIONS† PARAMETER TL3116C MIN TYP‡ MAX TA = 25°C TA = full range 0.5 MIN 3 TL3116I TYP‡ 0.5 MAX 3 VIO Input offset voltage αVIO Temperature coefficient of input offset voltage Input offset current TA = 25°C TA = full range 0.1 IIO Input bias current TA = 25°C TA = full range 0.7 IIB Common-mode input voltage range VDD = ± 5 V VDD = 5 V −5 2.5 −5 2.5 VICR 0 2.5 0 2.5 CMRR Common-mode rejection ratio − 5 ≤ VIC ≤ 2.5 V 75 100 75 100 Positive supply: 4.6 V ≤ +VDD ≤ 5.4 V, TA = 25°C 60 80 60 80 kSVR Supply-voltage rejection ratio Negative supply: − 7 V ≤ −VDD ≤ − 2 V, TA = 25°C 80 100 80 100 VOL VOH Low-level output voltage High-level output voltage 3.5 Negative supply current VIL Low-level input voltage (LATCH ENABLE) VIH High-level input voltage (LATCH ENABLE) IIL Low-level input current (LATCH ENABLE) 0.1 1.1 0.7 µA A µA A V dB dB V+ ≤ 4.6 V, I(sink) = 10 mA, TA = 25°C V+ ≤ 4.6 V, V+ ≤ 4.6 V, TA = 25°C IO = 1 mA, 3.6 3.9 3.6 3.9 V+ ≤ 4.6 V, TA = 25°C IO = 10 mA, 3.4 3.8 3.4 3.8 400 600 400 600 mV 750 750 V 12.7 14.7 −2.6 12.7 2 VLE = 0 mA 0.8 2 0 • DALLAS, TEXAS 75265 15 −3 0.8 POST OFFICE BOX 655303 1.1 1.5 I(sink) = 4 mA, TA = 25°C TA = full range 0.2 0.35 1.2 VLE = 2 V 24 † Full range for the TL3116C is TA = 0°C to 70°C. Full range for the TL3116I is TA = − 40°C to 85°C. ‡ All typical values are measures with TA = 25°C. 4 0.2 mV µV/°C −2.8 0.3 Positive supply current ICC 3.5 −2.5 UNIT V V 1 0 1 µA 39 24 45 µA 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 switching characteristics, VDD = ±5 V, VLE = 0 tpd1 tsk(p) Propagation delay time‡ Pulse skew (|tpd+ − tpd−|) TL3116C TEST CONDITIONS† PARAMETER MIN TL3116I TYP MAX MIN TYP MAX ∆VI = 100 mV, VOD = 5 mV TA = 25°C TA = full range 9.9 12 9.9 12 9.9 14 9.9 15 ∆VI = 100 mV, VOD = 20 mV TA = 25°C TA = full range 8.2 10.3 8.2 10.3 8.2 12.7 8.2 13.7 ∆VI = 100 mV, TA = 25°C VOD = 5 mV, 0.5 0.5 UNIT ns ns tsu Setup time, LATCH ENABLE 3.4 3.4 ns † Full range for the TL3116C is 0°C to 70°C. Full range for the TL3116I is − 40°C to 85°C. ‡ tpd1 cannot be measured in automatic handling equipment with low values of overdrive. The TL3116 is 100% tested with a 1-V step and 500-mV overdrive at TA = 25°C only. Correlation tests have shown that tpd1 limits given can be ensured with this test, if additional dc tests are performed to ensure that all internal bias conditions are correct. For low overdrive conditions, VOS is added to the overdrive. TYPICAL CHARACTERISTICS Table of Graphs FIGURE ICC ICC tpd Positive supply current Negative supply current Propagation delay time vs Input voltage 2 vs Frequency 3 vs Free-air temperature 4 vs Free-air temperature 5 vs Overdrive voltage 6 vs Supply voltage 7 vs Input impedance 8 vs Load capacitance 9 vs Free-air temperature 10 VIC VIT Common-mode input voltage vs Free-air temperature 11 Input threshold voltage (LATCH ENABLE) vs Free-air temperature 12 vs Output source current 13 VO Output voltage vs Output sink current 14 II Input current (LATCH ENABLE) vs Input voltage 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 TYPICAL CHARACTERISTICS POSITIVE SUPPLY CURRENT vs FREQUENCY POSITIVE SUPPLY CURRENT vs INPUT VOLTAGE I CC − Positive Supply Current − mA 18 16 ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ 24 VCC = ± 5 V TA = 25°C 22 I CC − Positive Supply Current − mA 20 14 TA = 85°C 12 TA = 25°C 10 TA = − 40°C 8 6 4 20 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V TA = 25°C TA = 85°C 18 TA = 25°C 16 14 TA = − 40°C 12 2 10 0 1 2 3 4 5 6 VI − Input Voltage − V 7 101 0 8 f − Frequency − MHz Figure 2 Figure 3 POSITIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE I CC − Positive Supply Current − mA 14 NEGATIVE SUPPLY CURRENT vs FREE-AIR TEMPERATURE ÎÎÎÎÎ 0 VCC = ± 5 V ÎÎÎÎ ÎÎÎÎ VCC = ± 5 V I CC − Negative Supply Current − mA 15 102 13 12 11 10 9 8 7 − 0.5 −1 − 1.5 −2 − 2.5 6 5 −50 −25 0 25 50 75 100 125 −3 −50 −25 TA − Free-Air Temperature − °C Figure 4 6 0 25 Figure 5 POST OFFICE BOX 655303 50 75 TA − Free-Air Temperature − °C • DALLAS, TEXAS 75265 100 125 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 TYPICAL CHARACTERISTICS PROPAGATION DELAY TIME vs OVERDRIVE VOLTAGE PROPAGATION DELAY TIME vs SUPPLY VOLTAGE ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ 12 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ 12 10 VCC = ± 5 V TA = 25°C t pd − Propagation Delay Time − ns t pd − Propagation Delay Time − ns VCC = ± 5 V TA = 25°C 8 6 4 2 0 0 10 20 40 30 10 8 6 4 2 0 4.4 50 4.6 4.8 Overdrive Voltage − mV Figure 6 ÎÎÎÎÎ ÎÎÎÎÎ t pd − Propagation Delay Time − ns t pd − Propagation Delay Time − ns 14 Stepsize = 100 mV VCC = ± 5 V TA = 25°C 14 12 5 mV 10 20 mV 8 6 4 12 tPDHL tPDLH 10 8 6 4 0 50 100 150 200 250 300 0 ÎÎÎÎÎ ÎÎÎÎÎ VCC = ± 5 V TA = 25°C 2 2 0 5.6 PROPAGATION DELAY TIME vs LOAD CAPACITANCE 20 16 5.4 Figure 7 PROPAGATION DELAY TIME vs INPUT IMPEDANCE 18 5.2 5 VCC − Supply Voltage − V 0 10 ZI − Input Impedance − Ω 20 30 40 50 CL − Load Capacitance − pF Figure 8 Figure 9 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 TYPICAL CHARACTERISTICS PROPAGATION DELAY TIME vs FREE-AIR TEMPERATURE COMMON-MODE INPUT VOLTAGE vs FREE-AIR TEMPERATURE ÎÎÎÎÎ 25 ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ 6 VCC = 5 V (Upper Limit) VCC = ± 5 V (Upper Limit) VIC − Common-Mode Input Voltage − V t pd − Propagation Delay Time − ns VCC = ± 5 V 20 15 Rising Edge 10 Falling Edge 5 4 2 ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ 0 VCC = 5 V (Lower Limit) −2 ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ −4 VCC = ± 5 V (Lower Limit) 0 − 50 − 25 0 25 50 75 100 TA − Free-Air Temperature − °C −6 − 50 125 − 25 75 100 0 25 50 TA − Free-Air Temperature − °C Figure 10 Figure 11 OUTPUT VOLTAGE vs OUTPUT SOURCE CURRENT ÎÎÎÎ ÎÎÎÎ 1.8 1.6 1.4 1.2 1 0.8 0.6 4.6 4.4 TA = − 40°C 3.8 3.6 3.2 3 150 0 5 10 Figure 13 POST OFFICE BOX 655303 15 IO(source) − Output Source Current − mA Figure 12 8 TA = 25°C 4 0.2 0 25 50 75 100 125 TA − Free-Air Temperature − °C TA = 85°C 4.2 3.4 −25 VCC = ± 5 V TA = 25°C 4.8 0.4 0 −50 ÎÎÎÎÎ ÎÎÎÎÎ 5 VCC = ± 5 V VO − Output Voltage − V VIT − Input Threshold Voltage (LATCH ENABLE) − V INPUT THRESHOLD VOLTAGE (LATCH ENABLE) vs FREE-AIR TEMPERATURE 2 125 • DALLAS, TEXAS 75265 20 

 

    
  SLCS132C − MARCH 1997 − REVISED MAY 1997 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs OUTPUT SINK CURRENT 1.8 VO − Output Voltage − V 1.6 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ 1.4 1.2 TA = 25°C 1 TA = − 40°C 0.8 0.6 TA = 85°C 0.4 0.2 0 0 15 10 IO(sink) − Output Sink Current − mA 5 ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ 30 VCC = ± 5 V TA = 25°C I I − Input Current (LATCH ENABLE) − µ A 2 INPUT CURRENT (LATCH ENABLE) vs INPUT VOLTAGE 20 25 VCC = ± 5 V TA = 25°C 20 15 10 5 0 −5 − 10 − 15 − 20 − 0.5 Figure 14 0 0.5 1 VI − Input Voltage − V 1.5 2 Figure 15 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 13-Aug-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TL3116CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3116C TL3116CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3116C TL3116CPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 T3116 TL3116CPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 T3116 TL3116ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 3116I TL3116IDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 3116I TL3116IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 3116I TL3116IPW ACTIVE TSSOP PW 8 150 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 Z3116 TL3116IPWR ACTIVE TSSOP PW 8 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 Z3116 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of