TL331IDBVR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 TL331 Single Differential Comparator 1 Features 3 Description • • • This device consists of a single voltage comparator that is designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V to 36 V and VCC is at least 1.5 V more positive than the input commonmode voltage. Current drain is independent of the supply voltage. The output can be connected to other open-collector outputs to achieve wired-AND relationships. 1 • • • • • • Single Supply or Dual Supplies Wide Range of Supply Voltage, 2 V to 36 V Low Supply-Current Drain Independent of Supply Voltage, 0.4 mA Typ Low Input Bias Current, 25 nA Typ Low Input Offset Voltage, 2 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage, ±36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS PART NUMBER TL331 PACKAGE (PIN) SOT (5) BODY SIZE (NOM) 2.90 mm × 1.60 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 2 Applications • • • • • Device Information(1) Hysteresis Comparators Oscillators Window Comparators Industrial Equipment Test and Measurement 4 Simplified Schematic IN+ OUT IN− 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 4 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 7 9 Application and Implementation .......................... 8 9.1 Application Information.............................................. 8 9.2 Typical Application ................................................... 8 10 Power Supply Recommendations ..................... 10 11 Layout................................................................... 10 11.1 Layout Guidelines ................................................. 10 11.2 Layout Example .................................................... 10 12 Device and Documentation Support ................. 11 12.1 Trademarks ........................................................... 11 12.2 Electrostatic Discharge Caution ............................ 11 12.3 Glossary ................................................................ 11 13 Mechanical, Packaging, and Orderable Information ........................................................... 11 5 Revision History Changes from Revision F (July 2008) to Revision G Page • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 • Deleted 25°C Specifications in Electrical Characteristics table.............................................................................................. 5 • Changed test condition VID for parameter IOL from 1 V to –1 V in Electrical Characteristics table. ....................................... 5 2 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 TL331 www.ti.com SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 6 Pin Configuration and Functions DBV PACKAGE (TOP VIEW) IN− VCC−/GND IN+ 1 5 VCC 4 OUT 2 3 Pin Functions PIN NAME NO. TYPE DESCRIPTION IN+ 3 I Positive Input IN– 1 I Negative Input OUT 4 O Open Collector/Drain Output VCC 5 I Power Supply Input GND 2 I Ground Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 3 TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX 0 36 V Supply voltage (2) VCC (3) VID Differential input voltage VI Input voltage range (either input) VO IO UNIT –36 36 V –0.3 36 V Output voltage 0 36 V Output current 0 20 mA Duration of output short-circuit to ground (4) Unlimited TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature range –65 150 °C (1) (2) (3) (4) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to the network ground. Differential voltages are at IN+ with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±1000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±750 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VCC Supply voltage TJ Junction Temperature MIN MAX 2 36 UNIT V -40 125 °C 7.4 Thermal Information TL331 THERMAL METRIC (1) DBV UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 218.3 RθJC(top) Junction-to-case (top) thermal resistance 87.3 RθJB Junction-to-board thermal resistance 44.9 ψJT Junction-to-top characterization parameter 4.3 ψJB Junction-to-board characterization parameter 44.1 (1) 4 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 TL331 www.ti.com SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 7.5 Electrical Characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V VICR Common-mode input voltage range (3) AVD Large-signal differential voltage amplification IOH High-level output current TA (2) TYP MAX 2 5 25°C Full range 9 25°C 5 Full range 25°C –25 25°C VOH = 5 V, VID = 1 V 25°C VOH = 30 V, VID = 1 V Full range 0 to VCC – 1.5 50 25°C Low-level output voltage IOL = 4 mA, VID = –1 V IOL Low-level output current VOL = 1.5 V, VID = –1 V 25°C ICC Supply current RL = ∞, VCC = 5 V 25°C –250 –400 Full range VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC 50 250 Full range VOL (1) (2) (3) MIN UNIT mV nA nA V 200 V/mV 0.1 50 nA 1 μA 150 400 Full range 700 6 mV mA 0.4 0.7 mA All characteristics are measured with zero common-mode input voltage, unless otherwise specified. Full range TA is –40°C to 85°C for I-suffix devices and –40°C to 105°C for K-suffix devices. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the commonmode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage. 7.6 Switching Characteristics VCC = 5 V, TA = 25°C PARAMETER Response time (1) (2) TEST CONDITIONS RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1) (2) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT μs CL includes probe and jig capacitance. The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 5 TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 7.7 Typical Characteristics 1.0 70 -40C 0C 25C 85C 125C 60 Input Bias Current (nA) Supply Current (mA) 0.8 0.6 0.4 0.2 -40C 0C 85C 125C 25C 50 40 30 20 10 0.0 0 0 10 20 30 40 Vcc (V) 0 8 16 24 32 Vcc (V) C001 Figure 1. Supply Current vs Supply Voltage 40 C002 Figure 2. Input Bias Current vs Supply Voltage Output Low Voltage, VOL(V) 10.000 1.000 0.100 0.010 0.001 0.01 -40C 0C 25C 85C 125C 0.1 1 10 Output Sink Current, Io(mA) 100 C005 Figure 3. Output Low Voltage vs Output Current (IOL) 6 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 TL331 www.ti.com SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 8 Detailed Description 8.1 Overview The TL331 is a single comparator with the ability to operate up to 36 V on the supply pin. This standard device has proven ubiquity and versatility across a wide range of applications. This is due to it's very wide supply voltages range (2 V to 36 V), low Iq and fast response. The open-drain output allows the user to configure the output's logic low voltage (VOL) and can be utilized to enable the comparator to be used in AND functionality. 8.2 Functional Block Diagram VCC 80-mA Current Regulator 10 mA 60 mA 10 mA 80 mA IN+ COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 1 20 IN− GND Current values shown are nominal. 8.3 Feature Description TL331 consists of a PNP darlington pair input, allowing the device to operate with very high gain and fast response with minimal input bias current. The input Darlington pair creates a limit on the input common mode voltage capability, allowing TL331 to accurately function from ground to VCC – 1.5 V differential input. This is enables much head room for modern day supplies of 3.3 V and 5.0 V. The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN will sink current when the positive input voltage is higher than the negative input voltage and the offset voltage. The VOL is resistive and will scale with the output current. Please see Figure 3 for VOL values with respect to the output current. 8.4 Device Functional Modes 8.4.1 Voltage Comparison The TL331 operates solely as a voltage comparator, comparing the differential voltage between the positive and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input differential polarity. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 7 TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information TL331 will typically be used to compare a single signal to a reference or two signals against each other. Many users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an MCU or logic device. The wide supply range and high voltage capability makes TL331 optimal for level shifting to a higher or lower voltage. 9.2 Typical Application 5V Vref 5V + TL331 Input 0 V to 30 V Figure 4. Typical Application Schematic 9.2.1 Design Requirements For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters DESIGN PARAMETER EXAMPLE VALUE Input Voltage Range 0 V to VCC – 1.5 V Supply Voltage 2 V to 36 V Logic Supply Voltage (RPULLUP Voltage) 2 V to 36 V Output Current (VLOGIC/RPULLUP) 1 µA to 20 mA Input Overdrive Voltage 100 mV Reference Voltage 2.5 V Load Capacitance (CL) 15 pF 9.2.2 Detailed Design Procedure When using TL331 in a general comparator application, determine the following: • Input voltage range • Minimum overdrive voltage • Output and drive current • Response time 8 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 TL331 www.ti.com SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 9.2.2.1 Input Voltage Range When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC – 1.5 V. This limits the input voltage range to as high as VCC – 1.5 V and as low as 0 V. Operation outside of this range can yield incorrect comparisons. Below is a list of input voltage situation and their outcomes: 1. When both IN- and IN+ are both within the common mode range: (a) If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current (b) If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not conducting 2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output transistor is sinking current 3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and the output transistor is not conducting 4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking current 9.2.2.2 Minimum Overdrive Voltage Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD) should be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the comparator, with the response time decreasing with increasing overdrive. Figure 5 and Figure 6 show positive and negative response times with respect to overdrive voltage. 9.2.2.3 Output and Drive Current Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use Figure 3 to determine VOL based on the output current. The output current can also effect the transient response. More will be explained in the next section. 9.2.2.4 Response Time The transient response can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and equivalent collector-emitter resistance (RCE). • • The positive response time (τp) is approximately τP ~ RPULLUP × CL The negative response time (τN) is approximately τN ~ RCE × CL – RCE can be determine by taking the slope of Figure 3 in it's linear region at the desired temperature, or by dividing the VOL by Iout Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 9 TL331 SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 www.ti.com 9.2.3 Application Curves 6 6 5 5 Output Voltage (Vo) Output Voltage, Vo(V) The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe. 4 3 2 5mV OD 1 20mV OD 0 4 3 2 5mV OD 1 20mV OD 0 100mV OD ±1 -0.25 0.25 0.75 1.25 1.75 100mV OD ±1 ±0.25 0.00 2.25 Time (usec) 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 Time (usec) C004 Figure 5. Response Time for Various Overdrives (Positive Transition) C006 Figure 6. Response Time for Various Overdrives (Negative Transition) 10 Power Supply Recommendations For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the comparator's input common mode range and create an inaccurate comparison. 11 Layout 11.1 Layout Guidelines For accurate comparator applications without hysteresis it is important maintain a stable power supply with minimized noise and glitches, which can affect the high level input common mode voltage range. In order to achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be implemented on the positive power supply and negative supply (if available). If a negative supply is not being used, do not put a capacitor between the IC's GND pin and system ground. 11.2 Layout Example Ground Bypass Capacitor 0.1 μF Negative Supply or Ground Only needed for dual power supplies IN– 1 GND IN+ 3 5 V CC 4 OUT Positive Supply 2 0.1 μF Ground Figure 7. TL331 Layout Example 10 Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 TL331 www.ti.com SLVS238G – AUGUST 1999 – REVISED JANUARY 2015 12 Device and Documentation Support 12.1 Trademarks All trademarks are the property of their respective owners. 12.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 1999–2015, Texas Instruments Incorporated Product Folder Links: TL331 11 PACKAGE OPTION ADDENDUM www.ti.com 25-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG ~ T1IL ~ T1IS) TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG ~ T1IL ~ T1IU) TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG TL331KDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) TL331KDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 105 (T1KG ~ T1KL) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 25-Oct-2016 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TL331 : • Automotive: TL331-Q1 • Enhanced Product: TL331-EP NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TL331IDBVR SOT-23 DBV 5 3000 178.0 9.0 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 TL331IDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3 TL331IDBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TL331IDBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TL331IDBVTG4 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 TL331KDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 3-Aug-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 TL331IDBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0 TL331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TL331IDBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0 TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/D 11/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. 4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/D 11/2018 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/D 11/2018 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. 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