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TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
TL331 Single Differential Comparator
1 Features
3 Description
•
•
•
This device consists of a single voltage comparator
that is designed to operate from a single power
supply over a wide range of voltages. Operation from
dual supplies also is possible if the difference
between the two supplies is 2 V to 36 V and VCC is at
least 1.5 V more positive than the input commonmode voltage. Current drain is independent of the
supply voltage. The output can be connected to other
open-collector outputs to achieve wired-AND
relationships.
1
•
•
•
•
•
•
Single Supply or Dual Supplies
Wide Range of Supply Voltage, 2 V to 36 V
Low Supply-Current Drain Independent of Supply
Voltage, 0.4 mA Typ
Low Input Bias Current, 25 nA Typ
Low Input Offset Voltage, 2 mV Typ
Common-Mode Input Voltage Range Includes
Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage, ±36 V
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and CMOS
PART NUMBER
TL331
PACKAGE (PIN)
SOT (5)
BODY SIZE (NOM)
2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
2 Applications
•
•
•
•
•
Device Information(1)
Hysteresis Comparators
Oscillators
Window Comparators
Industrial Equipment
Test and Measurement
4 Simplified Schematic
IN+
OUT
IN−
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TL331
SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
4
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 7
8.4 Device Functional Modes.......................................... 7
9
Application and Implementation .......................... 8
9.1 Application Information.............................................. 8
9.2 Typical Application ................................................... 8
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Example .................................................... 10
12 Device and Documentation Support ................. 11
12.1 Trademarks ........................................................... 11
12.2 Electrostatic Discharge Caution ............................ 11
12.3 Glossary ................................................................ 11
13 Mechanical, Packaging, and Orderable
Information ........................................................... 11
5 Revision History
Changes from Revision F (July 2008) to Revision G
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Deleted 25°C Specifications in Electrical Characteristics table.............................................................................................. 5
•
Changed test condition VID for parameter IOL from 1 V to –1 V in Electrical Characteristics table. ....................................... 5
2
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SLVS238G – AUGUST 1999 – REVISED JANUARY 2015
6 Pin Configuration and Functions
DBV PACKAGE
(TOP VIEW)
IN−
VCC−/GND
IN+
1
5
VCC
4
OUT
2
3
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
IN+
3
I
Positive Input
IN–
1
I
Negative Input
OUT
4
O
Open Collector/Drain Output
VCC
5
I
Power Supply Input
GND
2
I
Ground
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
0
36
V
Supply voltage (2)
VCC
(3)
VID
Differential input voltage
VI
Input voltage range (either input)
VO
IO
UNIT
–36
36
V
–0.3
36
V
Output voltage
0
36
V
Output current
0
20
mA
Duration of output short-circuit to ground (4)
Unlimited
TJ
Operating virtual junction temperature
–40
150
°C
Tstg
Storage temperature range
–65
150
°C
(1)
(2)
(3)
(4)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±1000
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
TJ
Junction Temperature
MIN
MAX
2
36
UNIT
V
-40
125
°C
7.4 Thermal Information
TL331
THERMAL METRIC
(1)
DBV
UNIT
5 PINS
RθJA
Junction-to-ambient thermal resistance
218.3
RθJC(top)
Junction-to-case (top) thermal resistance
87.3
RθJB
Junction-to-board thermal resistance
44.9
ψJT
Junction-to-top characterization parameter
4.3
ψJB
Junction-to-board characterization parameter
44.1
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
VIO
Input offset voltage
VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)
IIO
Input offset current
VO = 1.4 V
IIB
Input bias current
VO = 1.4 V
VICR
Common-mode input voltage
range (3)
AVD
Large-signal differential voltage
amplification
IOH
High-level output current
TA
(2)
TYP
MAX
2
5
25°C
Full range
9
25°C
5
Full range
25°C
–25
25°C
VOH = 5 V, VID = 1 V
25°C
VOH = 30 V, VID = 1 V
Full range
0 to
VCC – 1.5
50
25°C
Low-level output voltage
IOL = 4 mA, VID = –1 V
IOL
Low-level output current
VOL = 1.5 V, VID = –1 V
25°C
ICC
Supply current
RL = ∞, VCC = 5 V
25°C
–250
–400
Full range
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
50
250
Full range
VOL
(1)
(2)
(3)
MIN
UNIT
mV
nA
nA
V
200
V/mV
0.1
50
nA
1
μA
150
400
Full range
700
6
mV
mA
0.4
0.7
mA
All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
Full range TA is –40°C to 85°C for I-suffix devices and –40°C to 105°C for K-suffix devices.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the commonmode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
7.6 Switching Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Response time
(1)
(2)
TEST CONDITIONS
RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1)
(2)
TYP
100-mV input step with 5-mV overdrive
1.3
TTL-level input step
0.3
UNIT
μs
CL includes probe and jig capacitance.
The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
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7.7 Typical Characteristics
1.0
70
-40C
0C
25C
85C
125C
60
Input Bias Current (nA)
Supply Current (mA)
0.8
0.6
0.4
0.2
-40C
0C
85C
125C
25C
50
40
30
20
10
0.0
0
0
10
20
30
40
Vcc (V)
0
8
16
24
32
Vcc (V)
C001
Figure 1. Supply Current vs Supply Voltage
40
C002
Figure 2. Input Bias Current vs Supply Voltage
Output Low Voltage, VOL(V)
10.000
1.000
0.100
0.010
0.001
0.01
-40C
0C
25C
85C
125C
0.1
1
10
Output Sink Current, Io(mA)
100
C005
Figure 3. Output Low Voltage vs Output Current (IOL)
6
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8 Detailed Description
8.1 Overview
The TL331 is a single comparator with the ability to operate up to 36 V on the supply pin. This standard device
has proven ubiquity and versatility across a wide range of applications. This is due to it's very wide supply
voltages range (2 V to 36 V), low Iq and fast response.
The open-drain output allows the user to configure the output's logic low voltage (VOL) and can be utilized to
enable the comparator to be used in AND functionality.
8.2 Functional Block Diagram
VCC
80-mA
Current Regulator
10 mA
60 mA
10 mA
80 mA
IN+
COMPONENT COUNT
OUT
Epi-FET
Diodes
Resistors
Transistors
1
2
1
20
IN−
GND
Current values shown are nominal.
8.3 Feature Description
TL331 consists of a PNP darlington pair input, allowing the device to operate with very high gain and fast
response with minimal input bias current. The input Darlington pair creates a limit on the input common mode
voltage capability, allowing TL331 to accurately function from ground to VCC – 1.5 V differential input. This is
enables much head room for modern day supplies of 3.3 V and 5.0 V.
The output consists of an open drain NPN (pull-down or low side) transistor. The output NPN will sink current
when the positive input voltage is higher than the negative input voltage and the offset voltage. The VOL is
resistive and will scale with the output current. Please see Figure 3 for VOL values with respect to the output
current.
8.4 Device Functional Modes
8.4.1 Voltage Comparison
The TL331 operates solely as a voltage comparator, comparing the differential voltage between the positive and
negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input differential
polarity.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
TL331 will typically be used to compare a single signal to a reference or two signals against each other. Many
users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes TL331 optimal for level shifting to
a higher or lower voltage.
9.2 Typical Application
5V
Vref
5V
+
TL331
Input 0 V to 30 V
Figure 4. Typical Application Schematic
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as the input parameters.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
Input Voltage Range
0 V to VCC – 1.5 V
Supply Voltage
2 V to 36 V
Logic Supply Voltage (RPULLUP Voltage)
2 V to 36 V
Output Current (VLOGIC/RPULLUP)
1 µA to 20 mA
Input Overdrive Voltage
100 mV
Reference Voltage
2.5 V
Load Capacitance (CL)
15 pF
9.2.2 Detailed Design Procedure
When using TL331 in a general comparator application, determine the following:
• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time
8
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9.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to
account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC – 1.5 V. This limits
the input voltage range to as high as VCC – 1.5 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
(a) If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking
current
(b) If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is
not conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
9.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the comparator
over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD) should be
higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of the
comparator, with the response time decreasing with increasing overdrive. Figure 5 and Figure 6 show positive
and negative response times with respect to overdrive voltage.
9.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will
produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use
Figure 3 to determine VOL based on the output current.
The output current can also effect the transient response. More will be explained in the next section.
9.2.2.4 Response Time
The transient response can be determined by the load capacitance (CL), load/pull-up resistance (RPULLUP) and
equivalent collector-emitter resistance (RCE).
•
•
The positive response time (τp) is approximately τP ~ RPULLUP × CL
The negative response time (τN) is approximately τN ~ RCE × CL
– RCE can be determine by taking the slope of Figure 3 in it's linear region at the desired temperature, or by
dividing the VOL by Iout
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9.2.3 Application Curves
6
6
5
5
Output Voltage (Vo)
Output Voltage, Vo(V)
The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
4
3
2
5mV OD
1
20mV OD
0
4
3
2
5mV OD
1
20mV OD
0
100mV OD
±1
-0.25
0.25
0.75
1.25
1.75
100mV OD
±1
±0.25 0.00
2.25
Time (usec)
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
Time (usec)
C004
Figure 5. Response Time for Various Overdrives
(Positive Transition)
C006
Figure 6. Response Time for Various Overdrives
(Negative Transition)
10 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the
comparator's input common mode range and create an inaccurate comparison.
11 Layout
11.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches, which can affect the high level input common mode voltage range. In order to
achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be
implemented on the positive power supply and negative supply (if available). If a negative supply is not being
used, do not put a capacitor between the IC's GND pin and system ground.
11.2 Layout Example
Ground
Bypass
Capacitor
0.1 μF
Negative Supply or Ground
Only needed
for dual power
supplies
IN–
1
GND
IN+
3
5
V CC
4
OUT
Positive Supply
2
0.1 μF
Ground
Figure 7. TL331 Layout Example
10
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12 Device and Documentation Support
12.1 Trademarks
All trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TL331IDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(T1IG ~ T1IL ~
T1IS)
TL331IDBVRE4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
T1IG
TL331IDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
T1IG
TL331IDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
(T1IG ~ T1IL ~
T1IU)
TL331IDBVTG4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
T1IG
TL331KDBVR
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
(T1KG ~ T1KL)
TL331KDBVRG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
(T1KG ~ T1KL)
TL331KDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 105
(T1KG ~ T1KL)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
25-Oct-2016
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331 :
• Automotive: TL331-Q1
• Enhanced Product: TL331-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TL331IDBVR
SOT-23
DBV
5
3000
178.0
9.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
TL331IDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
TL331IDBVRG4
SOT-23
DBV
5
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
TL331IDBVT
SOT-23
DBV
5
250
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
TL331IDBVTG4
SOT-23
DBV
5
250
178.0
9.0
3.3
3.2
1.4
4.0
8.0
Q3
TL331KDBVR
SOT-23
DBV
5
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TL331IDBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
TL331IDBVR
SOT-23
DBV
5
3000
202.0
201.0
28.0
TL331IDBVRG4
SOT-23
DBV
5
3000
180.0
180.0
18.0
TL331IDBVT
SOT-23
DBV
5
250
180.0
180.0
18.0
TL331IDBVTG4
SOT-23
DBV
5
250
180.0
180.0
18.0
TL331KDBVR
SOT-23
DBV
5
3000
180.0
180.0
18.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
5
2X 0.95
1.9
1.45 MAX
3.05
2.75
1.9
2
4
0.5
5X
0.3
0.2
3
(1.1)
C A B
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214839/D 11/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
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EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214839/D 11/2018
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X(0.95)
4
3
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/D 11/2018
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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