TL331-EP
www.ti.com
SLVSBU6 – JUNE 2013
SINGLE DIFFERENTIAL COMPARATOR
Check for Samples: TL331-EP
FEATURES
1
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Single Supply or Dual Supplies
Wide Range of Supply Voltage: 2 V to 36 V
Low Supply-Current Drain Independent of
Supply Voltage: 0.4 mA Typ.
Low Input Bias Current: 25 nA Typ.
Low Input Offset Voltage: 2 mV Typ.
Common-Mode Input Voltage Range Includes
Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage: ±36 V
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and CMOS
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
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Controlled Baseline
One Assembly and Test Site
One Fabrication Site
Available in Military (–55°C to 125°C)
Temperature Range
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
DBV PACKAGE
(TOP VIEW)
IN−
VCC−/GND
IN+
1
5
VCC
4
OUT
2
3
DESCRIPTION/ORDERING INFORMATION
This device consists of a single voltage comparator designed to operate from a single power supply over a wide
range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V
to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. To achieve wired-AND relationships, one can connect the output to other
open-collector outputs.
ORDERING INFORMATION (1)
TA
VIO(MAX) at 25°C
–55°C to 125°C
5 mV
(1)
PACKAGE
SOT-23 (DBV)
Reel of 250
ORDERABLE PART
NUMBER
TOP-SIDE
MARKING
VID NUMBER
TL331MDBVTEP
TEPU
V62/13611-01XE
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
TL331-EP
SLVSBU6 – JUNE 2013
www.ti.com
LOGIC DIAGRAM
IN+
OUT
IN−
SCHEMATIC
VCC
80-µA
Current Regulator
10 µA
60 µA
10 µA
80 µA
IN+
COMPONENT COUNT
OUT
Epi-FET
Diodes
Resistors
Transistors
1
2
1
20
IN−
GND
Note:
Current values shown are nominal.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage (2)
36 V
VID
Differential input voltage (3)
±36 V
VI
Input voltage range (either input)
VO
Output voltage
36 V
IO
Output current
20 mA
–0.3 V to 36 V
Duration of output short-circuit to ground (4)
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
2
Unlimited
150°C
–65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the network ground.
Differential voltages are at IN+ with respect to IN–.
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
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TL331-EP
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SLVSBU6 – JUNE 2013
THERMAL INFORMATION
TL331-EP
THERMAL METRIC (1)
DBV
UNITS
5 PINS
Junction-to-ambient thermal resistance (2)
θJA
299
(3)
θJCtop
Junction-to-case (top) thermal resistance
θJB
Junction-to-board thermal resistance (4)
97.1
ψJT
Junction-to-top characterization parameter (5)
0.8
ψJB
Junction-to-board characterization parameter (6)
95.5
θJCbot
Junction-to-case (bottom) thermal resistance (7)
N/A
(1)
(2)
(3)
(4)
(5)
(6)
(7)
65.4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS (1)
VIO
Input offset voltage
VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)
IIO
Input offset current
VO = 1.4 V
IIB
Input bias current
VO = 1.4 V
VICR
Common-mode input voltage
range (2)
AVD
Large-signal differential-voltage
amplification
IOH
High-level output current
TA
TYP
MAX
2
5
–55°C to 125°C
9
25°C
5
–55°C to 125°C
25°C
–25
–55°C to 125°C
25°C
–400
25°C
VOH = 30 V, VID = 1 V
–55°C to 125°C
IOL = 4 mA, VID = –1 V
IOL
Low-level output current
VOL = 1.5 V, VID = –1 V
25°C
ICC
Supply current
RL = ∞, VCC = 5 V
25°C
200
0.1
25°C
UNIT
mV
nA
nA
V
0 to
VCC – 2
50
VOH = 5 V, VID = 1 V
Low-level output voltage
–250
0 to
VCC – 1.5
25°C
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
50
250
–55°C to 125°C
VOL
(1)
(2)
MIN
25°C
150
–55°C to 125°C
V/mV
50
nA
1
μA
400
700
6
mV
mA
0.4
0.7
mA
All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the commonmode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
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TL331-EP
SLVSBU6 – JUNE 2013
www.ti.com
SWITCHING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
Response time
(1)
(2)
4
TEST CONDITIONS
RL connected to 5 V through 5.1 kΩ, CL = 15 pF (1)
(2)
TYP
100-mV input step with 5-mV overdrive
1.3
TTL-level input step
0.3
UNIT
μs
CL includes probe and jig capacitance.
The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
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Product Folder Links: TL331-EP
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TL331MDBVTEP
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
TEPU
V62/13611-01XE
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 125
TEPU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
