TL3472-Q1
www.ti.com
SLOS573 – MARCH 2008
HIGH-SLEW-RATE SINGLE-SUPPLY OPERATIONAL AMPLIFIER
FEATURES
1
•
•
•
•
•
•
•
Qualified for Automotive Applications
Wide Gain-Bandwidth Product: 4 MHz
High Slew Rate: 13 V/µs
Fast Settling Time: 1.1 µs to 0.1%
Wide-Range Single-Supply Operation:
4 V to 36 V
Wide Input Common-Mode Range Includes
Ground (VCC–)
Low Total Harmonic Distortion: 0.02%
•
•
Large-Capacitance Drive Capability: 10,000 pF
Output Short-Circuit Protection
D PACKAGE
(TOP VIEW)
1OUT
1
8
VCC+
1IN–
2
7
2OUT
1IN+
3
6
2IN–
VCC–/GND
4
5
2IN+
DESCRIPTION/ORDERING INFORMATION
Quality, low-cost, bipolar fabrication with innovative design concepts is employed for the TL3472 operational
amplifier. This device offers 4 MHz of gain-bandwidth product, 13-V/µs slew rate, and fast settling time, without
the use of JFET device technology. Although the TL3472 can be operated from split supplies, it is particularly
suited for single-supply operation because the common-mode input voltage range includes ground potential
(VCC–). With a Darlington transistor input stage, this device exhibits high input resistance, low input offset voltage,
and high gain. The all-npn output stage, characterized by no dead-band crossover distortion and large output
voltage swing, provides high-capacitance drive capability, excellent phase and gain margins, low open-loop
high-frequency output impedance, and symmetrical source/sink ac frequency response. This low-cost amplifier is
an alternative to the MC33072 and the MC34072 operational amplifiers.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
SOIC – D
Reel of 2500
ORDERABLE PART NUMBER
TL3472QDRQ1
TOP-SIDE MARKING
T3472Q
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TL3472-Q1
www.ti.com
SLOS573 – MARCH 2008
SCHEMATIC (EACH AMPLIFIER)
VCC+
OUT
IN-
IN+
VCC- /GND
2
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Copyright © 2008, Texas Instruments Incorporated
TL3472-Q1
www.ti.com
SLOS573 – MARCH 2008
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC+
VCC–
18 V
Supply voltage (2)
–18 V
VID
Differential input voltage
±36 V
VI
Input voltage (any input)
VCC±
II
Input current (each input)
±1 mA
IO
Output current
±80 mA
Total current into VCC+
80 mA
Total current out of VCC–
80 mA
Duration of short-circuit current at (or below) 25°C (3)
θJA
Package thermal impedance (4) (5)
TJ
Operating virtual junction temperature
Unlimited
97°C/W
150°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds
Tstg
(1)
(2)
(3)
(4)
(5)
260°C
Storage temperature range
–65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.
The output can be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
VCC±
Supply voltage
VIC
Common-mode input voltage
TA
Operating free-air temperature
Copyright © 2008, Texas Instruments Incorporated
VCC = 5 V
VCC± = ±15 V
MAX
4
36
0
2.8
–15
12.8
–40
125
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UNIT
V
V
°C
3
TL3472-Q1
www.ti.com
SLOS573 – MARCH 2008
ELECTRICAL CHARACTERISTICS
at specified free-air temperature, VCC± = ±15 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC = 5 V
VIC = 0, VO = 0, RS = 50 Ω
VIO
Input offset voltage
αVIO
Temperature coefficient
of input offset voltage
VIC = 0, VO = 0, RS = 50 Ω
VCC = ±15 V
IIO
Input offset current
VIC = 0, VO = 0, RS = 50 Ω
VCC = ±15 V
IIB
Input bias current
VIC = 0, VO = 0, RS = 50 Ω
VCC = ±15 V
VICR
Common-mode input
voltage range
VCC = ±15 V
High-level output voltage RL = 10 kΩ
RL = 2 kΩ
VOL
Low-level output voltage
1.5
16
25°C
1
17
Full range
Full range
10
25°C
6
Full range
75
300
25°C
100
Full range
500
700
25°C
–15 to
12.8
Full range
–15 to
12.8
25°C
3.7
4
25°C
13.6
14
Full range
13.4
0.1
0.3
–14.3
RL = 2 kΩ
Full range
CMRR
Common-mode
rejection ratio
VIC = VICR(min), RS = 50 Ω
kSVR
Supply-voltage rejection
ratio (ΔVCC±/ΔVIO)
VCC± = ±13.5 V to ±16.5 V, RS = 100 Ω
ICC
Supply current
(per channel)
Source: VID = 1 V, VO = 0
Sink: VID = –1 V, VO = 0
VO = 0, No load
VCC+ = 5 V, VO = 2.5 V, VCC– = 0, No load
nA
V
–14.7
Short-circuit
output current
nA
V
25°C
IOS
mV
µV/°C
25°C
VO = ±10 V, RL = 2 kΩ
UNIT
22
RL = 10 kΩ
Large-signal differential
voltage amplification
4
MAX
25°C
VCC+ = 5 V, VCC– = 0, RL = 2 kΩ
AVD
(1)
(2)
MIN TYP (2)
RS = 50 Ω
VCC+ = 5 V, VCC– = 0, RL = 2 kΩ
VOH
TA (1)
V
–13.5
25°C
25
Full range
20
100
V/mV
–10
–34
20
27
25°C
65
97
dB
25°C
70
97
dB
25°C
mA
25°C
3.5
4.5
Full range
4.5
5.5
25°C
3.5
4.5
mA
Full range TA = –40°C to 125°C
All typical values are at TA = 25°C.
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Copyright © 2008, Texas Instruments Incorporated
TL3472-Q1
www.ti.com
SLOS573 – MARCH 2008
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
8
10
V/µs
AV = –1
13
V/µs
To 0.1%
1.1
To 0.01%
2.2
SR+
Positive slew rate
VI = –10 V to 10 V, RL = 2 kΩ,
CL = 300 pF
SR–
Negative slew rate
VI = –10 V to 10 V, RL = 2 kΩ,
CL = 300 pF
ts
Settling time
AVD = –1, 10-V step
Vn
Equivalent input noise voltage
f = 1 kHz, RS = 100 Ω
49
nV/√Hz
In
Equivalent input noise current
f = 1 kHz
0.22
pA/√Hz
THD
Total harmonic distortion
VO(PP) = 2 V to 20 V, RL = 2 kΩ, AVD = 10, f = 10 kHz
0.02
%
GBW
Gain-bandwidth product
f =100 kHz
BW
Power bandwidth
VO(PP) = 20 V, RL = 2 kΩ, AVD = 1, THD = 5.0%
φm
AV = 1
3
µs
4
MHz
160
kHz
CL = 0
70
CL = 300 pF
50
CL = 0
12
Phase margin
RL = 2 kΩ
Gain margin
RL = 2 kΩ
ri
Differential input resistance
VIC = 0
150
Ci
Input capacitance
VIC = 0
2.5
pF
Channel separation
f = 10 kHz
101
dB
Open-loop output impedance
f = 1 MHz, AV = 1
20
Ω
zo
Copyright © 2008, Texas Instruments Incorporated
CL = 300 pF
4
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deg
dB
MΩ
5
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
A
.004 [0.1] C
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.150
[3.81]
.189-.197
[4.81-5.00]
NOTE 3
4X (0 -15 )
4
5
B
8X .012-.020
[0.31-0.51]
.010 [0.25]
C A B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 -8
.016-.050
[0.41-1.27]
DETAIL A
(.041)
[1.04]
TYPICAL
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
.0028 MAX
[0.07]
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED
METAL
.0028 MIN
[0.07]
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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