TL5209DR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 TL5209 500-mA Low-Noise Low-Dropout Voltage Regulator With Shutdown 1 Features 3 Description • • • The TL5209 device is 500-mA low-dropout (LDO) regulator that is well suited for portable applications. It has a lower quiescent current than most traditional PNP regulators and allows for a shutdown current of 0.05 μA (typical). The TL5209 also has very good dropout voltage characteristics, requiring a maximum dropout of 10 mV at light loads and 500 mV at full load. In addition, the LDO also has a 1% output voltage accuracy and very tight line and load regulation that is comparable to its CMOS counterparts. 1 • • • • • • • • • Adjustable Output Voltage 1%/2% Accuracy (25°C/Full Range) 500-mV (Maximum) Dropout at Full Load of 500 mA Tight Regulation Overtemperature Range – 0.1%/V (Maximum) Line Regulation – 0.7% (Maximum) Load Regulation Ultra Low-Noise Capability (300 nV/√Hz Typical) Shutdown Current of 3 μA (Maximum) Low Temperature Coefficient Current Limiting and Thermal Protection Stable With Minimum Load of 1 mA Reverse-Battery Protection Applications – Portable Applications (PDAs, Laptops, Cell Phones) – Consumer Electronics – Post-Regulation for SMPS Available in Convenient SOIC-8 Surface-Mount Package For noise-sensitive applications, the TL5209 allows for low-noise capability through an external bypass capacitor connected to the BYP pin, which reduces the output noise of the regulator. Other features include current limiting, thermal shutdown, reversebattery protection, and low temperature coefficient. The TL5209 is available with adjustable output. Offered in an SOIC-8 surface-mount package, the TL5209 is characterized for operation over the virtual junction temperature ranges of –40°C to 125°C. Device Information(1) PART NUMBER TL5209 2 Applications • • • • PACKAGE SOIC (8) BODY SIZE (NOM) 4.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Set-Top Boxes PCs and Notebooks EPOS Building Automation 4 Typical Application Schematic VIN IN 1 µF OUT VOUT R1 EN GND ADJ/BYP 470 pF 2.2 µF R2 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Typical Application Schematic............................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 3 7.1 7.2 7.3 7.4 7.5 7.6 3 3 3 4 4 5 Absolute Maximum Ratings .................................... ESD Ratings.............................................................. Recommended Operating Conditions...................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description ............................................ 12 8.1 Overview ................................................................. 12 8.2 Functional Block Diagram ....................................... 12 8.3 Feature Description................................................. 12 8.4 Device Functional Modes........................................ 12 9 Application and Implementation ........................ 13 9.1 Application Information............................................ 13 9.2 Typical Application .................................................. 13 10 Power Supply Recommendations ..................... 16 11 Layout................................................................... 16 11.1 Layout Guidelines ................................................. 16 11.2 Layout Example .................................................... 16 12 Device and Documentation Support ................. 17 12.1 12.2 12.3 12.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 13 Mechanical, Packaging, and Orderable Information ........................................................... 17 5 Revision History Changes from Revision A (May 2007) to Revision B • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 TL5209 www.ti.com SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 6 Pin Configuration and Functions D Package 8-Pin SOIC Top View EN IN OUT ADJ/BYP 1 8 2 7 3 6 4 5 GND GND GND GND Pin Functions PIN NAME NO. I/O DESCRIPTION ADJ/BYP 4 I Adjust/Bypass pin, forces a constant voltage of 1.242 V to allow for adjusting the output voltage with external resistors. A bypass capacitance can be used on this pin to slow down the ramp up of the output voltage. EN 1 I Control input, active high GND 5-8 - Ground IN 2 I Input voltage OUT 3 O Output voltage 7 Specifications Absolute Maximum Ratings (1) 7.1 over operating free-air temperature range (unless otherwise noted) VI Continuous input voltage VO Output voltage Tstg Storage temperature (1) MIN MAX –20 20 UNIT 7.5 V –65 150 °C V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 V(ESD) (1) (2) 7.3 Electrostatic discharge (1) UNIT ±2500 Charged device model (CDM), per JEDEC specification JESD22C101 (2) V ±1000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Recommended Operating Conditions VI Input voltage VO Output voltage VEN Enable input voltage TJ Operating junction temperature MIN MAX 2.5 16 V 6.5 V 0 VI V –40 125 °C Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 UNIT 3 TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com 7.4 Thermal Information TL5209 THERMAL METRIC (1) D [SOIC] UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 116.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.6 °C/W RθJB Junction-to-board thermal resistance 56.3 °C/W ψJT Junction-to-top characterization parameter 14.9 °C/W ψJB Junction-to-board characterization parameter 55.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.5 Electrical Characteristics VIN = VOUT + 1 V, COUT = 4.7 μF, IOUT = 1 mA, full range TJ = –40°C to 125°C PARAMETER Output voltage accuracy αVOUT TEST CONDITIONS VOUT = 2.5 V for ADJ only Output voltage temperature coefficient Line regulation VIN = (VOUT + 1 V) to 16 V Load regulation IOUT = 1 mA to 500 mA (1) IOUT = 50 mA VIN – VOUT Dropout voltage (2) IOUT = 100 mA IOUT = 500 mA VEN ≥ 3 V, IOUT = 1 mA VEN ≥ 3 V, IOUT = 50 mA Quiescent current VEN ≥ 3 V, IOUT = 100 mA VEN ≥ 3 V, IOUT = 500 mA Imin Minimum load current (3) ISD Shutdown current MIN –1% 1% –40°C to 125°C –2% 2% –40°C to 125°C IOUT = 1 mA IQ TJ 25°C 25°C 25°C Ripple rejection ILIMIT (1) (2) (3) 4 Current limit 0.05% 25°C 60 115 175 80 250 150 350 140 650 2 8 20 3 –40°C to 125°C 25 –40°C to 125°C 1 25°C 0.05 25°C 0.1 –40°C to 125°C mA mA 3 μA 8 25°C 75 25°C 700 –40°C to 125°C μA 900 1.2 –40°C to 125°C 25°C 500 170 –40°C to 125°C 25°C mV 600 100 –40°C to 125°C 25°C 250 300 350 –40°C to 125°C 25°C %/V 0.5% 45 –40°C to 125°C 25°C 0.05 0.7% –40°C to 125°C 25°C UNIT ppm/°C 0.1 –40°C to 125°C f = 120 Hz VOUT = 0 V 0.009 –40°C to 125°C 25°C MAX 40 –40°C to 125°C VEN ≤ 0.4 V VEN ≤ 0.18 V TYP dB 900 1000 mA Low duty cycle testing is used to maintain the junction temperature as close to the ambient temperature as possible. Changes in output voltage due to thermal effects are covered separately by the thermal regulation specification. Dropout is defined as the input to output differential at which the output drops 2% below its nominal value measured at 1-V differential. For stability across the input voltage and temperature. For ADJ versions, the minimum current can be set by R1 and R2. Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 TL5209 www.ti.com SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 Electrical Characteristics (continued) VIN = VOUT + 1 V, COUT = 4.7 μF, IOUT = 1 mA, full range TJ = –40°C to 125°C PARAMETER ΔVOUT/ΔP TEST CONDITIONS Thermal regulation (4) D Vn VEN IEN Output noise Enable input current (5) TYP 25°C 0.05 VOUT = 2.5 V, IOUT = 50 mA, COUT = 2.2 μF, CBYP = 0 25°C 500 IOUT = 50 mA, COUT = 2.2 μF, CBYP = 470 pF (5) 25°C 300 MAX UNIT %/W nV/√Hz 25°C 0.4 –40°C to 125°C 0.18 VEN = logic HIGH (enabled) 25°C VEN ≤ 0.4 V (shutdown) 25°C 0.01 –1 VEN ≤ 0.18 V (shutdown) –40°C to 125°C 0.01 –2 5 20 VEN ≥ 2 V (enabled) (4) MIN VIN = 16 V, 500-mA load pulse for t = 10 ms VEN = logic LOW (shutdown) Enable logic voltage TJ V 2 25°C –40°C to 125°C μA 25 Thermal regulation is defined as the change in output voltage at a specified time after a change in power dissipation is applied, excluding line and load regulation effects. CBYP is optional and connected to the BYP/ADJ pin. 7.6 Typical Characteristics 0 0 VIN = 3.5 V -10 COUT = 2.2 µF -20 CBYP = 0 µF -30 IOUT = 1 mA -20 -30 -40 PSRR – dB PSRR – dB -10 -50 -60 -70 COUT = 2.2 µF CBYP = 0.01 µF IOUT = 1 mA -40 -50 -60 -70 -80 -80 -90 -90 -100 -110 10 1.E+01 VIN = 3.5 V 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 -100 1.E+01 10 1.E+02 100 1.E+03 1k 1.E+04 10k 1.E+05 100k 1.E+06 1M Frequency – Hz Frequency – Hz Figure 1. Power Supply Rejection Ratio Figure 2. Power Supply Rejection Ratio Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 5 TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com Typical Characteristics (continued) -10 0 VIN = 3.5 V -20 COUT = 2.2 µF -30 CBYP = 0.01 µF IOUT = 10 mA -30 -50 -40 PSRR – dB PSRR – dB COUT = 2.2 µF -20 CBYP = 0 µF IL = 10 mA -40 VIN = 3.5 V -10 -60 -70 -50 -60 -80 -70 -90 -80 -90 -100 -110 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 -100 1.E+01 10 1M 1.E+06 1.E+02 100 VIN = 3.5 V -10 1.E+06 1M CBYP = 0 µF COUT = 2.2 µF CBYP = 0.01 µF -20 IOUT = 100 mA -30 VIN = 3.5 V -10 COUT = 2.2 µF -20 IOUT = 100 mA -30 -40 PSRR – dB PSRR – dB 1.E+05 100k 0 0 -50 -60 -40 -50 -60 -70 -70 -80 -80 -90 -90 -100 1.E+01 10 1.E+02 100 1.E+03 1k 1.E+04 10k 1.E+05 100k -100 10 1.E+01 1.E+06 1M 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 Frequency – Hz Frequency – Hz Figure 6. Power Supply Rejection Ratio Figure 5. Power Supply Rejection Ratio 120 120 VOUT = 2.5 V 110 COUT = 2.2 µF 100 CBYP = 0 µF IL = 1 mA 110 IL = 10 mA VOUT = 2.5 V 100 90 90 80 80 IL = 100 mA 70 PSRR – dB PSRR – dB 1.E+04 10k Figure 4. Power Supply Rejection Ratio Figure 3. Power Supply Rejection Ratio 60 50 IL = 1 mA COUT = 2.2 µF CBYP = 0.01 µF IL = 10 mA 70 60 50 40 40 30 30 20 20 10 10 IL = 100 mA 0 0 0 6 1.E+03 1k Frequency – Hz – Hz f –Frequency Frequency – Hz 0.1 0.2 0.3 0.4 0 0.5 0.1 0.2 0.3 0.4 0.5 Voltage Drop – V Voltage Drop – V Figure 7. Power Supply Ripple Rejection vs Voltage Drop Figure 8. Power Supply Ripple Rejection vs Voltage Drop Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 TL5209 www.ti.com SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 Typical Characteristics (continued) 0.7 0.8 VIN = 3.5 V COUT = 2.2 µF 0.7 0.6 IL = 100 mA CBYP = 0 µF Noise – µV/√Hz Noise – µV/sqrt(Hz) Noise – µV/√Hz Noise – µV/sqrt(Hz) 0.6 IL = 100 mA 0.5 IL = 10 mA 0.4 IL = 1 mA 0.3 0.2 IL = 1 mA 0.5 0.4 IL = 10 mA 0.3 0.2 VIN = 3.5 V 0.1 0.1 COUT = 2.2 µF CBYP = 0.01 µF 0 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 0 10 1.E+01 100k 1.E+05 100 1.E+02 Figure 9. Noise Performance 2.55 VOUT = 2.5 V 450 2.54 COUT = 2.2 µF 2.53 CBYP = 0 400 VOUT – Output Voltage – V VDO – Dropout Voltage – mV 100k 1.E+05 Figure 10. Noise Performance 500 350 300 250 200 150 IL = 1 mA 2.51 2.50 2.49 2.48 2.47 50 2.46 0 VIN = 3.5 V COUT = 4.7 µF 2.52 100 0 2.45 -40 -25 -10 50 100 150 200 250 300 350 400 450 500 5 20 35 50 65 80 95 110 125 IL – Load Current – mA TA – Temperature – °C Figure 11. Dropout Voltage vs Load Current Figure 12. Output Voltage vs Temperature 2 20 VIN = 3.5 V 18 1.8 COUT = 4.7 µF 16 CIN = 1 µF IGND – GND Pin Current – mA IGND – GND Pin Current – mA 10k 1.E+04 1k 1.E+03 Frequency – Hz Frequency – Hz 14 12 10 8 6 4 2 1.6 IL = 100 mA 1.4 1.2 1 0.8 0.6 0.4 IL = 1 mA 0.2 0 0 0 50 100 150 200 250 300 350 400 450 500 0 1 2 3 4 5 6 7 8 IL – Load Current – mA VCC – Supply Voltage – V Figure 13. Ground Current vs Load Current Figure 14. Ground Current vs Supply Voltage Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 7 TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com Typical Characteristics (continued) 20 2.53 VIN = 3.5 V 18 IL = 500 mA VOUT – Output Voltage – V IGND – GND Pin Current – mA COUT = 4.7 µF 2.52 16 14 12 10 8 6 4 IL = 1 mA to 500 mA 2.51 TA = 25°C 2.50 TA = 125°C 2.49 2.48 TA = -40°C 2 2.47 0 0 1 2 3 4 5 6 7 0 8 50 100 150 200 250 300 350 400 450 500 VCC – Supply Voltage – V IL – Load Current – mA Figure 15. Ground Current vs Supply Voltage Figure 16. Output Voltage vs Load Current 10 10 VIN = 3.5 V VIN = 3.5 V COUT = 1 µF COUT = 2.2 µF VENB = 2 V Output Impedance – Ωℵ Output Impedance – Ω♦ VENB = 2 V IL = 1 mA 1 IL = 10 mA IL = 100 mA 0.1 0.01 10 1.E+01 100 1.E+02 1k 1.E+03 10k 1.E+04 100k 1.E+05 IL = 1 mA 1 IL = 10 mA IL = 100 mA 0.1 0.01 10 1.E+01 1M 1.E+06 100 1.E+02 1k 1.E+03 Frequency – Hz 100k 1.E+05 1M 1.E+06 Figure 17. Output Impedance vs Frequency Figure 18. Output Impedance vs Frequency 2.55 0.5 VIN = 3.5 V to 16 V 2.54 VIN = 3.5 V COUT = 4.7 µF 2.53 COUT = 4.7 µF 0.4 IL = 1 mA 2.52 Load Regulation – % VOUT – Output Voltage – V 10k 1.E+04 Frequency – Hz 2.51 2.50 TA = 25°C 2.49 TA = 125°C 2.48 TA = -40°C 2.47 IL = 1 mA to 500 mA 0.3 0.2 0.1 2.46 2.45 3 6 9 12 15 18 VIN – Input Voltage – V 5 20 35 50 65 80 95 110 125 TA – Temperature – °C Figure 19. Output Voltage vs Input Voltage 8 0 -40 -25 -10 Submit Documentation Feedback Figure 20. Load Regulation Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 TL5209 www.ti.com SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 Typical Characteristics (continued) COUT = 10 µF 0.01 VIN = 3.5 V VIN = 3.5 V to 16 V IL = 100 µA 0.006 0.004 0.002 0 -50 -25 0 25 50 75 100 125 VENB = 2 V 100 CIN = 1 µF 1 Change in Output Voltage (mV) Line Regulation – %/V 0.008 Load (mA) COUT = 4.7 µF 10 0 -10 TA – Temperature – °C Time (25 µs/div) Figure 21. Line Regulation COUT = 2.2 µF VIN = 3.5 V CIN = 1 µF COUT = 10 µF VIN = 3.5 V VENB = 2 V 500 100 CIN = 1 µF 1 Change in Output Voltage (mV) Change in Output Voltage (mV) Load (mA) VENB = 2 V Load (mA) Figure 22. Load Transient Response 1 10 0 -10 Time (25 µs/div) 20 0 -20 Time (25 µs/div) Figure 23. Load Transient Response Figure 24. Load Transient Response 500 CIN = 1 µF 100 Change in Output Voltage (mV) Change in Output Voltage (mV) Load (mA) VIN = 3.5 V VENB = 2 V Input Voltage (V) COUT = 10 µF 40 20 0 -20 COUT = 1 µF IL = 1 mA 4.5 3.5 20 10 0 -10 Time (500 µs/div) Time (25 µs/div) Figure 25. Load Transient Response Figure 26. Line Transient Response Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 9 TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com 3.5 Input Voltage (V) COUT = 2.2 µF IL = 1 mA 4.5 Change in Output Voltage (mV) Change in Output Voltage (mV) Input Voltage (V) Typical Characteristics (continued) 20 10 0 -10 Time (500 µs/div) 3.5 20 10 0 -10 Time (500 µs/div) Figure 28. Line Transient Response Change in Output Voltage (mV) Input Voltage (V) Change in Output Voltage (mV) Input Voltage (V) Figure 27. Line Transient Response COUT = 2.2 µF IL = 100 mA 4.5 3.5 20 10 0 -10 Time (500 µs/div) 3.5 20 10 0 -10 Time (500 µs/div) Enable Voltage (V) 3.5 Figure 30. Line Transient Response Output Voltage (mV) Change in Output Voltage (mV) Input Voltage (V) 4.5 20 10 0 -10 COUT = 1 µF IL = 500 mA 4.5 Figure 29. Line Transient Response COUT = 2.2 µF IL = 500 mA COUT = 1 µF IL = 100 mA 4.5 2 0 2 1 COUT = 1 µF VIN = 3.5 V 0 ILOAD = 10 mA CIN = 1 µF Time (500 µs/div) Time (50 µs/div) Figure 31. Line Transient Response 10 Submit Documentation Feedback Figure 32. Turnon Time Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 TL5209 www.ti.com SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 Enable Voltage (V) 2 0 2 1 COUT = 1 µF VIN = 3.5 V 0 ILOAD = 500 mA CIN = 1 µF Output Voltage (mV) Output Voltage (mV) Enable Voltage (V) Typical Characteristics (continued) 2 0 2 1 COUT = 2.2 µF VIN = 3.5 V 0 ILOAD = 10 mA CIN = 1 µF Time (50 µs/div) Time (50 µs/div) Figure 34. Turnon Time 1000 2 COUT = 2.2 µF ISC – Short-Circuit Current Limit – mA Output Voltage (mV) Enable Voltage (V) Figure 33. Turnon Time 0 2 1 COUT = 2.2 µF VIN = 3.5 V 0 ILOAD = 500 mA CIN = 1 µF 900 800 700 600 500 3 6 9 12 15 18 VCC – Supply Voltage – V Time (50 µs/div) Figure 36. Short-Circuit Current vs Supply Voltage 800 CIN = 1 µF VIN = 3.5 V CIN = 1 µF VIN = 16 V COUT = 4.7 µF VOUT = 0 V COUT = 4.7 µF VOUT = 0 V 1000 Short-Circuit Current – mA Short-Circuit Current – mA Figure 35. Turnon Time 600 400 200 0 900 800 600 400 200 0 Time – 25 ms/div Time – 10 ms/div Figure 37. Short-Circuit Current vs Time Figure 38. Short-Circuit Current vs Time Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: TL5209 11 TL5209 SLVS581B – SEPTEMBER 2006 – REVISED JUNE 2015 www.ti.com 8 Detailed Description 8.1 Overview The TL5209 device is a low-dropout (LDO) regulator with an input voltage range from 2.5 V to 16 V and a maximum output current of 500 mA. The output voltage can be adjusted using external resistors (R1 and R2) and has an accuracy of 1% to 2% depending on the ambient temperature. The maximum voltage drop across the device varies from 10 mV to 500 mV depending on the current load at the output. 8.2 Functional Block Diagram IN OUT VOUT VIN COUT R1 ADJ/BYP + − Bandgap Reference CBYP (optional) R2 EN Current Limiting and Thermal Shutdown GND Figure 39. Low-Noise Adjustable Regulator 8.3 Feature Description 8.3.1 Enable and Shutdown The EN pin is CMOS-logic compatible. When EN is held high (>2 V), the regulator is active. Likewise, applying a low signal (