TL7726CDR

TL7726 HEX CLAMPING CIRCUITS SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999 D D D D D D D OR P PACKAGE (TOP VIEW) Protects Against Latch-Up 25-mA Current Sink in Active State Less Than 1-mW Dissipation in Standby Condition Ideal for Applications in Environments Where Large Transient Spikes Occur Stable Operation for All Values of Capacitive Load No Output Overshoot GND CLAMP CLAMP CLAMP 1 8 2 7 3 6 4 5 REF CLAMP CLAMP CLAMP description The TL7726 consists of six identical clamping circuits that monitor an input voltage with respect to a reference value, REF. For an input voltage (VI) in the range of GND to < REF, the clamping circuits present a very high impedance to ground, drawing current of less than 10 µA. The clamping circuits are active for VI < GND or VI > REF when they have a very low impedance and can sink up to 25 mA. These characteristics make the TL7726 ideal as protection devices for CMOS semiconductor devices in environments where there are large positive or negative transients to protect analog-to-digital converters in automotive or industrial systems. The use of clamping circuits provides a safeguard against potential latch-up. The TL7726C is characterized for operation over the temperature range of 0°C to 70°C. The TL7726I is characterized for operation over the temperature range of – 40°C to 85°C. The TL7726Q is characterized for operation over the temperature range of – 40°C to 125°C. AVAILABLE OPTIONS SOIC (D) PLASTIC DIP (P) TA 0°C to 70°C TL7726CD TL7726CP – 40°C to 85°C TL7726ID TL7726IP – 40°C to 125°C TL7726QD TL7726QP The D package is available taped and reeled. Add the suffix R to the device type (i.e., TL7726CDR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright  1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TL7726 HEX CLAMPING CIRCUITS SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Reference voltage, Vref . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Clamping current, IIK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Package thermal impedance, θJA (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. 2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions MIN MAX 4.5 5.5 Reference voltage, Vref VI ≥ Vref VI ≤ GND Input clamping current current, IIK 25 – 25 TL7726C Operating free-air temperature range, TA 0 70 TL7726I – 40 85 TL7726Q – 40 125 UNIT V mA °C electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK + VIK – Positive clamp voltage IZ Reference current II TEST CONDITIONS II = 20 mA II = 20 mA Negative clamp voltage MIN TYP‡ Vref – 200 Vref = 5 V Vref – 50 mV ≤ VI ≤ Vref GND ≤ VI ≤ 50 mV Input current 50 mV ≤ VI ≤ Vref – 50 mV MAX UNIT Vref + 200 0 mV 60 µA 25 mV 10 µA – 10 –1 1 ‡ All typical values are at TA = 25°C. switching characteristics specified at TA = 25°C PARAMETER ts 2 Settling time TEST CONDITIONS VI(system) = ±13 V,, Measured at 10% to 90%, POST OFFICE BOX 655303 RI = 600 Ω,, See Figure 1 • DALLAS, TEXAS 75265 MIN tt < 1 µs, µ , MAX 30 UNIT µs TL7726 HEX CLAMPING CIRCUITS SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999 PARAMETER MEASUREMENT INFORMATION VCC = 5 V REF 600 Ω VI(system) CLAMP TL7726 GND TEST CIRCUIT 90% 13 V VIK 0V VI(system) VIK + 95% 5% VIK – 10% – 13 V ts tt tt INPUT WAVEFORM ts CLAMP WAVEFORM Figure 1. Switching Characteristics 100 mA 25 mA 10 mA 1 mA II 100 µA 10 µA 1 µA VIK– Vref – 50 mV – VI VI 50 mV VIK+ – 1 µA – 10 µA II – 100 µA – 1 mA – 10 mA – 25 mA – 100 mA GND Vref Figure 2. Tolerance Band for Clamping Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TL7726 HEX CLAMPING CIRCUITS SLAS078C – SEPTEMBER 1993 – REVISED JULY 1999 APPLICATION INFORMATION VCC = 5 V VI(system) (input signal) 10 kΩ II(system) VI II Device to Be Protected, e.g., A/D Converter, Microprocessor, etc. IZ 1/6 TL7726 Vref Example: If II >> II(system), i.e., VI(system) > Vref + 200 mV where: II(system) = Input current to the device being protected VI(system) = Input voltage to the device being protected then the maximum input voltage VI(system)max = Vref + IImax(10kΩ) = 5 V + 25 mA(10kΩ) = 5 V + 250 V = 255 V Figure 3. Typical Application 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TL7726CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7726C Samples TL7726CDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 7726C Samples TL7726CP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 TL7726CP Samples TL7726ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7726I Samples TL7726IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 7726I Samples TL7726IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 TL7726IP Samples TL7726IPE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 TL7726IP Samples TL7726QD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 7726Q Samples TL7726QDG4 ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 7726Q Samples TL7726QDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 7726Q Samples TL7726QDRG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 7726Q Samples -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of