TLC1550IFNR


 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 D Power Dissipation . . . 40 mW Max D Advanced LinEPIC Single-Poly Process D D D D D J† OR DW PACKAGE (TOP VIEW) Provides Close Capacitor Matching for Better Accuracy Fast Parallel Processing for DSP and µP Interface Either External or Internal Clock Can Be Used Conversion Time . . . 6 µs Total Unadjusted Error . . . ±1 LSB Max CMOS Technology REF+ REF − ANLG GND AIN ANLG VDD DGTL GND1 DGTL GND2 DGTL VDD1 DGTL VDD2 EOC D0 D1 description The TLC1550x and TLC1551 are data acquisition analog-to-digital converters (ADCs) using a 10-bit, switched-capacitor, successive-approximation network. A high-speed, 3-state parallel port directly interfaces to a digital signal processor (DSP) or microprocessor (µP) system data bus. D0 through D9 are the digital output terminals with D0 being the least significant bit (LSB). Separate power terminals for the analog and digital portions minimize noise pickup in the supply leads. Additionally, the digital power is divided into two parts to separate the lower current logic from the higher current bus drivers. An external clock can be applied to CLKIN to override the internal system clock if desired. 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 RD WR CLKIN CS D9 D8 D7 D6 D5 D4 D3 D2 † Refer to the mechanical data for the JW package. ANLG GND REF− REF+ NC RD WR CLKIN FK OR FN PACKAGE (TOP VIEW) AIN ANLG VDD DGTL GND1 NC DGTL GND2 DGTL VDD1 DGTL VDD2 4 3 2 1 28 27 26 25 6 24 7 23 8 22 9 21 10 20 11 19 12 13 14 15 16 17 18 CS D9 D8 NC D7 D6 D5 EOC D0 D1 NC D2 D3 D4 The TLC1550I and TLC1551I are characterized for operation from − 40°C to 85°C. The TLC1550M is characterized over the full military range of − 55°C to 125°C. 5 NC − No internal connection AVAILABLE OPTIONS PACKAGE TA CERAMIC CHIP CARRIER (FK) PLASTIC CHIP CARRIER (FN) CERAMIC DIP (J) SOIC (DW) −40°C to 85°C — TLC1550IFN TLC1551IFN — TLC1550IDW TLC1551IDW −55°C to 125°C TLC1550MFK — TLC1550MJ — This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C, Method 3015; however, it is advised that precautions be taken to avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriated logic voltage level, preferably either VCC or ground. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Advanced LinEPIC is a trademark of Texas Instruments. Copyright  2003, Texas Instruments Incorporated 
 
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*2&" "!#*!" "!&& ,&&!/- !% *""%. *" ! **""&%$/ %$* !*"!%. 0 &$$ &&#*!*"-  !" #$%&! !  ' ()( &$$ &&#*!*" &* !*"!* $*"" !+*,%"* !*-  &$$ !+* !" !% *""%. *" ! **""&%$/ %$* !*"!%. 0 &$$ &&#*!*"- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 functional block diagram EOC CS SuccessiveApproximation Register Control Logic WR RD 10 D0 −D9 10 Frequency Divided by 2 DGTL VDD1 Internal Clock Comp 10-Bit Capacitor DAC and S/H 100 kΩ NOM Clock Detector CLKIN REF + REF − AIN typical equivalent inputs INPUT CIRCUIT IMPEDANCE DURING SAMPLING MODE INPUT CIRCUIT IMPEDANCE DURING HOLD MODE 1 kΩ TYP AIN AIN Ci = 60 pF TYP (equivalent input capacitance) 2 POST OFFICE BOX 655303 5 MΩ TYP • DALLAS, TEXAS 75265 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 Terminal Functions TERMINAL NO.† NAME NO.‡ DESCRIPTION ANLG GND 4 3 Analog ground. The reference point for the voltage applied on terminals ANLG VDD, AIN, REF+, and REF−. AIN 5 4 Analog voltage input. The voltage applied to AIN is converted to the equivalent digital output. ANLG VDD 6 5 Analog positive power supply voltage. The voltage applied to this terminal is designated VDD3. CLKIN 26 22 Clock input. CLKIN is used for external clocking instead of using the internal system clock. It usually takes a few microseconds before the internal clock is disabled. To use the internal clock, CLKIN should be tied high or left unconnected. CS 25 21 Chip-select. CS must be low for RD or WR to be recognized by the A/D converter. D0 13 11 Data bus output. D0 is bit 1 (LSB). D1 14 12 Data bus output. D1 is bit 2. D2 16 13 Data bus output. D2 is bit 3. D3 17 14 Data bus output. D3 is bit 4. D4 18 15 Data bus output. D4 is bit 5. D5 19 16 Data bus output. D5 is bit 6. D6 20 17 Data bus output. D6 is bit 7. D7 21 18 Data bus output. D7 is bit 8. D8 23 19 Data bus output. D8 is bit 9. D9 24 20 Data bus output. D9 is bit 10 (MSB). 7 6 Digital ground 1. The ground for power supply DGTL VDD1 and is the substrate connection DGTL GND2 9 7 Digital ground 2. The ground for power supply DGTL VDD2 DGTL VDD1 10 8 Digital positive power-supply voltage 1. DGTL VDD1 supplies the logic. The voltage applied to DGTL VDD1 is designated VDD1. DGTL VDD2 11 9 Digital positive power-supply voltage 2. DGTL VDD2 supplies only the higher-current output buffers. The voltage applied to DGTL VDD2 is designated VDD2. EOC 12 10 End-of-conversion. EOC goes low indicating that conversion is complete and the results have been transferred to the output latch. EOC can be connected to the µP- or DSP-interrupt terminal or can be continuously polled. RD 28 24 REF+ 2 1 Read input. When CS is low and RD is taken low, the data is placed on the data bus from the output latch. The output latch stores the conversion results at the most recent negative edge of EOC. The falling edge of RD resets EOC to a high within the td(EOC) specifications. Positive voltage-reference input. Any analog input that is greater than or equal to the voltage on REF+ converts to 1111111111. Analog input voltages between REF + and REF − convert to the appropriate result in a ratiometric manner. REF − 3 2 Negative voltage reference input. Any analog input that is less than or equal to the voltage on REF − converts to 0000000000. 27 23 Write input. When CS is low, conversion is started on the rising edge of WR. On this rising edge, the ADC holds the analog input until conversion is completed. Before and after the conversion period, which is given by t conv, the ADC remains in the sampling mode. DGTL GND1 WR † Terminal numbers for FK and FN packages. ‡ Terminal numbers for J, DW, and NW packages. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD1, VDD2, and VDD3 (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5 V Input voltage range, VI (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Output voltage range, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Peak input current (any digital input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 10 mA Peak total input current (all inputs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 mA Operating free-air temperature range, TA: TLC1550I, TLC1551I . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C TLC1550M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Case temperature for 10 seconds: FK or FN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C Lead temperature 1,6 mm (1/16 inch) from the case for 10 seconds: J or NW package . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: VDD1 is the voltage measured at DGTL VDD1 with respect to DGND1. VDD2 is the voltage measured at DGTL VDD2 with respect to the DGND2. VDD3 is the voltage measured at ANLG VDD with respect to AGND. For these specifications, all ground terminals are tied together (and represent 0 V). When VDD1, VDD2, and VDD3 are equal, they are referred to simply as VDD. recommended operating conditions Supply voltage, VDD1, VDD2, VDD3 MIN NOM MAX 4.75 5 5.5 Positive reference voltage, VREF+ (see Note 2) VDD3 0 Negative reference voltage, VREF− (see Note 2) Differential reference voltage, VREF+ − VREF − (see Note 2) Analog input voltage range 0 High-level control input voltage, VIH 2 Low-level control input voltage, VIL Input clock frequency, f(CLKIN) 0.5 Setup time, CS low before WR or RD goes low, tsu(CS) Hold time, CS low after WR or RD goes high, th(CS) WR or RD pulse duration, tw(WR) Operating free-air temperature, TA V V V VDD3 VDD3 V V V 0.8 V 7.8 MHz 0 ns 0 ns 50 ns 40% of period 80% of period TLC155xI −40 85 TLC1550M −55 125 Input clock low pulse duration, tw(L−CLKIN) UNIT °C NOTE 2: Analog input voltages greater than that applied to REF+ convert to all 1s (1111111111), while input voltages less than that applied to REF − convert to all 0s (0000000000). The total unadjusted error may increase as this differential voltage falls below 4.75 V. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 electrical characteristics over recommended operating free-air temperature range, VDD = VREF+ = 4.75 V to 5.5 V and VREF − = 0 (unless otherwise noted) PARAMETER VOH TEST CONDITIONS High-level output voltage VDD = 4.75 V, VDD = 4.75 V, IOL = 2.4 mA VOL Low-level output voltage IOZ Off-state (high-impedance-state) output current IIH IIL High-level input current VO = VDD, VO = 0, VI = VDD Low-level input current (except CLKIN) VI = 0 IIL Low-level input current (CLKIN) IOS Short-circuit output current Input capacitance Analog inputs Digital inputs TYP† MAX 2.4 V 0.5 CS and RD at VDD −10 See typical equivalent inputs TLC1550/1I UNIT 0.4 TA = − 55°C to 125°C CS and RD at VDD VO = 5 V, TA = 25°C VO = 0, TA = 25°C CS low and RD high I(DD) Operating supply current Ci IOH = − 360 µA TA = 25°C MIN 10 0.005 2.5 V A µA µA −2.5 −0.005 µA −50 −50 µA 7 14 −12 −6 2 8 60 90* 5 15* mA mA pF * On products compliant to MIL-STD-883, Class B, this parameter is not production tested. † All typical values are at VDD = 5 V, TA = 25°C. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 operating characteristics over recommended operating free-air temperature range with internal clock and minimum sampling time of 4 µs, VDD = VREF + = 5 V and VREF − = 0 (unless otherwise noted) TLC1550I TA† Full range TLC1551I Full range PARAMETER EL TEST CONDITIONS Linearity error See Note 3 TLC1550M TLC1550I TLC1551I EZS Zero-scale error ±1 ± 0.5 25°C Full range ±1 Full range ± 0.5 ±1 ± 0.5 25°C ±1 TLC1550I Full range ± 0.5 TLC1551I Full range See Notes 2 and 4 TLC1550M TLC1550I TLC1551I See Note 5 TLC1550M tc Conversion time ta(D) tv(D) Data access time after RD goes low tdis(D) MAX Full range Full-scale error Total unadjusted error TYP‡ ±1 ± 0.5 25°C Full range ±1 Full range ± 0.5 Full range ±1 25°C ±1 fclock(external) = 4.2 MHz or internal clock Data valid time after RD goes high See Figure 3 LSB LSB LSB LSB 6 µs 35 ns 5 Disable time, delay time from RD high to high impedance UNIT ± 0.5 Full range See Notes 2 and 4 TLC1550M EFS MIN ns 30 ns td(EOC) Delay time, RD low to EOC high 0 15 ns † Full range is − 40°C to 85°C for the TL155xI devices and − 55°C to 125°C for the TLC1550M. ‡ All typical values are at VDD = 5 V, TA = 25°C. NOTES: 2. Analog input voltages greater than that applied to REF+ convert to all 1s (1111111111), while input voltages less than that applied to REF − convert to all 0s (0000000000). The total unadjusted error may increase as this differential voltage falls below 4.75 V. 3. Linearity error is the difference between the actual analog value at the transition between any two adjacent steps and its ideal value after zero-scale error and full-scale error have been removed. 4. Zero-scale error is the difference between the actual mid-step value and the nominal mid-step value at specified zero scale. Full-scale error is the difference between the actual mid-step value and the nominal mid-step value at specified full scale. 5. Total unadjusted error is the difference between the actual analog value at the transition between any two adjacent steps and its ideal value. It includes contributions from zero-scale error, full-scale error, and linearity error. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 PARAMETER MEASUREMENT INFORMATION Source Current = 6 mA Test Point Output Under Test See Note A Vcp = 1 V CL = 62 pF Sink Current = 6 mA Vcp = voltage commutation point for switching between source and sink currents NOTE A: Equivalent load circuit of the Teradyne A500 tester for timing parameter measurement Figure 1. Test Load Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 APPLICATION INFORMATION simplified analog input analysis Using the circuit in Figure 2, the time required to charge the analog input capacitance from 0 to VS within 1/2 LSB can be derived as follows: The capacitance charging voltage is given by V C +V ǒ1−e– tcńRtCiǓ (1) S Where: Rt = Rs + ri The final voltage to 1/2 LSB is given by VC (1/2 LSB) = VS − (VS /1024) (2) Equating equation 1 to equation 2 and solving for time t c gives ǒ ǒ Ǔ V * V ń512 + V 1– e S S S – t cńR tC Ǔ i (3) and t c (1/2 LSB) = Rt × Ci × ln(1024) (4) Therefore, with the values given, the time for the analog input signal to settle is t c (1/2 LSB) = (Rs + 1 kΩ) × 60 pF × ln(1024) (5) This time must be less than the converter sample time shown in the timing diagrams. Driving Source† TLC1550/1 Rs VS ri VI VC 1 kΩ MAX Ci 50 pF MAX VI = Input voltage at AIN VS = External driving source voltage Rs = Source resistance ri = Input resistance Ci = Input capacitance † Driving source requirements: • Noise and distortion for the source must be equivalent to the resolution of the converter. • Rs must be real at the input frequency. Figure 2. Input Circuit Including the Driving Source 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 

 
  
 
 
  
 
  

 SLAS043G − MAY 1991 − REVISED NOVEMBER 2003 PRINCIPLES OF OPERATION The operating sequence for complete data acquisition is shown in Figure 3. Processors can address the TLC1550 and TLC1551 as an external memory device by simply connecting the address lines to a decoder and the decoder output to CS. Like other peripheral devices, the write (WR) and read (RD) input signals are valid only when CS is low. Once CS is low, the onboard system clock permits the conversion to begin with a simple write command and the converted data to be presented to the data bus with a simple read command. The device remains in a sampling (track) mode from the rising edge of EOC until conversion begins with the rising edge of WR, which initiates the hold mode. After the hold mode begins, the clock controls the conversion automatically. When the conversion is complete, the end-of-conversion (EOC) signal goes low indicating that the digital data has been transferred to the output latch. Lowering CS and RD then resets EOC and transfers the data to the data bus for the processor read cycle. th(CS) tsu(CS) CS 0.8 V 1.4 V 0.8 V 0.8 V tc tw(WR) WR 0.8 V 0.8 V 2V 1.4 V th(CS) tsu(CS) 2V RD 0.8 V tv(D) ta(D) 2V Data Valid 0.8 V D0 −D9 tdis(D) 2V 0.8 V td(EOC) 2V EOC 0.8 V Figure 3. TLC1550 or TLC1551 Operating Sequence POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TLC1550IDW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1550I Samples TLC1550IDWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1550I Samples TLC1550IFN ACTIVE PLCC FN 28 37 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1550IFN Samples TLC1551IDW ACTIVE SOIC DW 24 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1551I Samples TLC1551IDWR ACTIVE SOIC DW 24 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1551I Samples TLC1551IFN ACTIVE PLCC FN 28 37 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 TLC1551IFN Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of