TLC2252TDA2

TLC2252-DIE www.ti.com SLOS819 – JANUARY 2013 ADVANCED LinCMOS™ RAIL-TO-RAIL VERY LOW-POWER OPERATIONAL AMPLIFIER FEATURES 1 • • • • 2 Output Swing Includes Both Supply Rails Low Noise Low Input Bias Current Fully Specified for Both Single-Supply and Split-Supply Operation • • • • Very Low Power Common-Mode Input Voltage Range Includes Negative Rail Low Input Offset Voltage Macromodel Included DESCRIPTION The TLC2252 is a dual and quadruple operational amplifier from Texas Instruments. The device exhibits rail-torail output performance for increased dynamic range in single- or split-supply applications. The micropower operation makes it a good choice for battery-powered applications. The noise performance has been dramatically improved over previous generations of CMOS amplifiers. The TLC2252 amplifier, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels, this device works well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this device a great choice when interfacing with analog-to-digital converters (ADCs). ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TLC2252 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY TLC2252TDA1 400 TLC2252TDA2 10 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinCMOS is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated TLC2252-DIE SLOS819 – JANUARY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 10.5 mils. Silicon with backgrind Floating AlCuTiW 1540 nm Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated TLC2252-DIE www.ti.com SLOS819 – JANUARY 2013 Table 1. Bond Pad Coordinates in Microns DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX 1OUT 1 74.65 54 159.65 139 1IN– 2 278.7 63.95 363.7 148.95 N/C 3 596.15 45 671.15 120 N/C 4 727.35 45 802.35 120 N/C 5 865.5 45 940.5 120 1IN+ 6 854.05 203 939.05 288 VDD–/GND 7 865.75 541.5 950.75 626.5 2IN+ 8 873 988.7 958 1073.7 2IN– 9 854.05 1311 939.05 1396 N/C 10 729.45 1315 804.45 1390 N/C 11 598.25 1315 673.25 1390 N/C 12 460.1 1315 535.1 1390 2OUT 13 308.7 1298.5 393.7 1383.5 VDD+ 14 46.8 1309.8 131.8 1394.8 Copyright © 2013, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TLC2252TDA1 ACTIVE 0 221 RoHS & Green Call TI N / A for Pkg Type 0 to 0 TLC2252TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type 0 to 0 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of