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TLC59108
SLDS156B – MARCH 2009 – REVISED JULY 2015
TLC59108 8-Bit Fm+ I2C-Bus Constant-Current LED Sink Driver
1
1 Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
25-MHz Internal Oscillator Requires No External
Components
1-MHz Fast Mode Plus Compatible I2C Bus
Interface With 30-mA High Drive Capability on
SDA Output for Driving High-Capacitive Buses
Internal Power-On Reset
Noise Filter on SCL/SDA Inputs
No Glitch on Power Up
Active-Low Reset
Supports Hot Insertion
3.3-V or 5-V Supply Voltage
2 Applications
•
•
•
Gaming
Small Signage
Industrial Equipment
3 Description
The TLC59108 is an I2C bus controlled 8-bit LED
driver that is optimized for red/green/blue/amber
(RGBA) color mixing and backlight applications.
Device Information
PART NUMBER
TLC59108
(1)
PACKAGE
BODY SIZE (NOM)
TSSOP (20)
6.50 mm × 4.40 mm
VQFN (20)
4.50 mm × 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
VLED
VCC
VCC
SDA
SDA
OUT0
SCL
SCL
OUT1
A0
A1
A2
A3
RESET
RESET
REXT
R
E
X
T
TLC59108
•
•
Eight LED Drivers (Each Output Programmable At
Off, On, Programmable LED Brightness,
Programmable Group Dimming/Blinking Mixed
With Individual LED Brightness
Eight Constant-Current Output Channels
256-Step (8-Bit) Linear Programmable Brightness
Per LED Output Varying From Fully Off (Default)
to Maximum Brightness Using a 97-kHz PWM
Signal
256-Step Group Brightness Control Allows
General Dimming (Using a 190-Hz PWM Signal
From Fully Off to Maximum Brightness (Default)
256-Step Group Blinking With Frequency
Programmable From 24 Hz to 10.73 s and Duty
Cycle From 0% to 99.6%
Four Hardware Address Pins Allow 14 TLC59108
Devices to be Connected to the Same I2C Bus
Four Software-Programmable I2C Bus Addresses
(One LED Group Call Address and Three LED
Sub Call Addresses) Allow Groups of Devices to
be Addressed at the Same Time in Any
Combination. For Example, One Register Used for
All Call, so That All the TLC59108 Devices on the
I2C Bus Can be Addressed at the Same Time,
and the Second Register Can be Used for Three
Different Addresses so That One-Third of All
Devices on the Bus Can be Addressed at the
Same Time in a Group.
Software Enable and Disable for I2C Bus Address
Software Reset Feature (SWRST Call) Allows
Device to be Reset Through I2C Bus
Up to 14 Possible Hardware-Adjustable Individual
I2C Bus Addresses Per Device, So That Each
Device Can Be Programmed
Open-Load/Overtemperature Detection Mode to
Detect Individual LED Errors
Output State Change Programmable on the
Acknowledge or the Stop Command to Update
Outputs Byte by Byte or All at the Same Time
(Default to Change on Stop)
Constant Output Current Adjusted Through an
External Resistor (10mA to 120mA)
Maximum Output Voltage: 17 V
System Controller
•
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
GND
Address: 00h
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLC59108
SLDS156B – MARCH 2009 – REVISED JULY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
5
5
5
6
6
8
9
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 9
Detailed Description ............................................ 11
9.1 Overview ................................................................. 11
9.2 Functional Block Diagram ....................................... 11
9.3
9.4
9.5
9.6
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Register Maps .........................................................
12
14
14
22
10 Application and Implementation........................ 29
10.1 Application Information.......................................... 29
10.2 Typical Application ................................................ 30
11 Power Supply Recommendations ..................... 33
12 Layout................................................................... 33
12.1 Layout Guidelines ................................................. 33
12.2 Layout Examples................................................... 33
13 Device and Documentation Support ................. 35
13.1
13.2
13.3
13.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
35
35
35
35
14 Mechanical, Packaging, and Orderable
Information ........................................................... 35
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (December 2011) to Revision B
•
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Original (November 2011) to Revision A
Page
•
Changed SLEEP Symbol to OSC and removed the "Low power mode" description to clarify functionality. ...................... 23
•
Changed ALLCALLADR register to IREF and changed register from 11h to 12h. .............................................................. 27
•
Added IOUT vs VOUT graph..................................................................................................................................................... 29
•
Added TLC59108 and TLC59108F Differences section....................................................................................................... 30
•
Added Typical Application Examples section. ...................................................................................................................... 30
2
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SLDS156B – MARCH 2009 – REVISED JULY 2015
5 Description (continued)
Each LED output has its own 8-bit resolution (256 steps) fixed-frequency individual PWM controller that operates
at 97 kHz, with a duty cycle that is adjustable from 0% to 99.6%. The individual PWM controller allows each LED
to be set to a specific brightness value. An additional 8-bit resolution (256 steps) group PWM controller has both
a fixed frequency of 190 Hz and an adjustable frequency between 24 Hz to once every 10.73 seconds, with a
duty cycle that is adjustable from 0% to 99.6%. The group PWM controller dims or blinks all LEDs with the same
value.
Each LED output can be off, on (no PWM control), or set at its individual PWM controller value at both individual
and group PWM controller values.
Software programmable LED group and three Sub Call I2C bus addresses allow all or defined groups of
TLC59108 devices to respond to a common I2C bus address, allowing for example, all red LEDs to be turned on
or off at the same time or marquee chasing effect, thus minimizing I2C bus commands. Four hardware address
pins allow up to 14 devices on the same bus.
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6 Pin Configuration and Functions
PW Package
20-Pin TSSOP
(Top View)
REXT
A0
A1
A2
A3
OUT0
OUT1
GND
OUT2
OUT3
RGY Package
20-Pin VQFN With Thermal Pad
(Top View)
REXT
VCC
SDA
SCL
RESET
GND
OUT7
OUT6
GND
OUT5
OUT4
20
19
18
17
16
15
14
13
12
11
1
2
3
4
5
6
7
8
9
10
1
A0
A1
A2
A3
OUT0
OUT1
GND
OUT2
VCC
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
OUT3
SDA
SCL
RESET
GND
OUT7
OUT6
GND
OUT5
11
OUT4
Pin Functions
PIN
NAME
NO.
I/O
(1)
DESCRIPTION
A0
2
I
Address input 0
A1
3
I
Address input 1
A2
4
I
Address input 2
A3
5
I
Address input 3
GND
8, 13, 16
–
Ground
OUT0
6
O
Constant current output 0, LED on at low
OUT1
7
O
Constant current output 1, LED on at low
OUT2
9
O
Constant current output 2, LED on at low
OUT3
10
O
Constant current output 3, LED on at low
OUT4
11
O
Constant current output 4, LED on at low
OUT5
12
O
Constant current output 5, LED on at low
OUT6
14
O
Constant current output 6, LED on at low
OUT7
15
O
Constant current output 7, LED on at low
RESET
17
I
Active-low reset input
REXT
1
–
Input terminal used to connect an external resistor for setting up all output currents
SCL
18
I
Serial clock input
SDA
19
I/O
VCC
20
–
(1)
4
Serial data input/output
Power supply
I = input, O = output
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SLDS156B – MARCH 2009 – REVISED JULY 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
VI
Input voltage
VO
Output voltage
IO
Output current
TJ
Junction temperature
Tstg
Storage temperature
(1)
(1)
MIN
MAX
UNIT
0
7
V
–0.4
7
V
–0.5
20
V
120
mA
–40
150
°C
–55
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
Electrostatic discharge
(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101
V
±1000
(2)
(1)
(2)
UNIT
±2000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
MIN
MAX
3
5.5
V
SCL, SDA, RESET, A0, A1, A2, A3
0.7 × VCC
VCC
V
Low-level input voltage
SCL, SDA, RESET, A0, A1, A2, A3
0
0.3 × VCC
V
Supply voltage to output pins
OUT0 to OUT7
17
V
VCC
Supply voltage
VIH
High-level input voltage
VIL
VO
IOL
Low-level output current sink
SDA
IO
Output current
OUT0 to OUT7
TA
Operating free-air temperature
(1)
VCC = 3 V
20
VCC = 3 V
30
UNIT
mA
5
120
mA
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation.
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7.4 Thermal Information
TLC59108
THERMAL METRIC
(1)
PW (TSSOP)
RGY (VQFN)
20 PINS
20 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
98.9
39.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
32.9
44.7
°C/W
RθJB
Junction-to-board thermal resistance
49.9
14.8
°C/W
ψJT
Junction-to-top characterization parameter
1.7
1.0
°C/W
ψJB
Junction-to-board characterization parameter
49.3
14.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
7.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
7.5 Electrical Characteristics
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
II
TEST CONDITIONS
Input/output leakage
current
SCL, SDA, A0,
A1, A2, A3,
RESET
VI = VCC or GND
Output leakage current
OUT0 to OUT7
VO = 17 V, TJ = 25°C
MIN
TYP
(1)
MAX
UNIT
±0.3
μA
0.5
μA
VPOR
Power-on reset voltage
IOL
Low-level output current
SDA
IO(1)
Output current 1
OUT0 to OUT7
VO = 0.6 V, Rext = 720 Ω, CG = 0.992
Output current error
OUT0 to OUT7
IO = 26 mA, VO = 0.6 V, Rext = 720 Ω,
TJ = 25°C
±8%
Output channel to
channel current error
OUT0 to OUT7
IO = 26 mA, VO = 0.6 V, Rext = 720 Ω,
TJ = 25°C
±3%
Output current 2
OUT0 to OUT7
VO = 0.8 V, Rext = 360 Ω, CG = 0.992
Output current error
OUT0 to OUT7
IO = 52 mA, VO = 0.8 V, Rext = 360 Ω,
TJ = 25°C
±8%
Output channel to
channel current error
OUT0 to OUT7
IO = 52 mA, VO = 0.8 V, Rext = 360 Ω,
TJ = 25°C
±3%
IOUT vs
VOUT
Output current vs output
voltage regulation
OUT0 to OUT7
IOUT,Th1
Threshold current 1 for
error detection
OUT0 to OUT7
IOUT,target = 26 mA
0.5% ×
ITARGET
IOUT,Th2
Threshold current 2 for
error detection
OUT0 to OUT7
IOUT,target = 52 mA
0.5% ×
ITARGET
IOUT,Th3
Threshold current 3 for
error detection
OUT0 to OUT7
IOUT,target = 104 mA
0.5% ×
ITARGET
IO(2)
(1)
6
2.5
VCC = 3 V, VOL = 0.4 V
20
VCC = 5 V, VOL = 0.4 V
30
VO = 1 V to 3 V, IO = 26 mA
mA
26
mA
52
±0.1
VO = 3 V to 5.5 V, IO = 26 mA to 120 mA
V
±1
mA
%/V
All typical values are at TA = 25°C.
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Electrical Characteristics (continued)
VCC = 3 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TSD
Overtemperature shutdown
THYS
Restart hysteresis
Ci
Input capacitance
Cio
Input/output capacitance
SDA
(2)
150
(1)
MAX
UNIT
175
200
°C
TYP
15
SCL, A0, A1,
A2, A3, RESET
ICC
MIN
(2)
Supply current
VI = VCC or GND
VI = VCC or GND
VCC = 5.5 V
°C
5
pF
5
pF
OUT0 to OUT7 = OFF,
Rext = Open
17
OUT0 to OUT7 = OFF,
Rext = 720 Ω
20
OUT0 to OUT7 = OFF,
Rext = 360 Ω
23
OUT0 to OUT7 = OFF,
Rext = 180 Ω
28
OUT0 to OUT7 = ON,
Rext = 720 Ω
21
OUT0 to OUT7 = ON,
Rext = 360 Ω
23
OUT0 to OUT7 = ON,
Rext = 180 Ω
28
mA
Specified by design
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7.6 Timing Requirements
TA = –40°C to 85°C
STANDARD MODE
I2C BUS
FAST MODE
I2C BUS
FAST MODE PLUS
I2C BUS
MIN
MAX
MIN
MAX
MIN
MAX
0
100
0
400
0
1000
UNIT
I2C Interface
fSCL
SCL clock frequency
kHz
2
tBUF
I C bus free time between stop and
start
4.7
1.3
0.5
μs
tHD;STA
Hold time (repeated) Start condition
4
0.6
0.26
μs
tSU;STA
Set-up time for a repeated Start
condition
4.7
0.6
0.26
μs
tSU;STO
Set-up time for Stop condition
4
0.6
0.26
μs
tHD;DAT
Data hold time
0
0
0
ns
(1)
0.3
3.45
0.1
0.9
0.05
0.45
μs
0.3
3.45
0.1
0.9
0.05
0.45
μs
tVD;ACK
Data valid acknowledge time
tVD;DAT
Data valid time
tSU;DAT
Data set-up time
250
100
tLOW
Low period of the SCL clock
4.7
tHIGH
High period of the SCL clock
4
(2)
Fall time of both SDA and SCL signals
tf
(3) (4)
tr
Rise time of both SDA and SCL
signals
tSP
Pulse width of spikes that must be
suppressed by the input filter (6)
50
ns
1.3
0.5
μs
0.6
0.26
μs
300 20+0.1Cb
(5)
300
120
ns
1000 20+0.1Cb
(5)
300
120
ns
50
50
ns
50
Reset
tW
Reset pulse width
tREC
Reset recovery time
tRESET
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
8
Time to reset
(7) (8)
10
10
10
ns
0
0
0
ns
400
400
400
ns
tVD;ACK = time for Acknowledgment signal from SCL low to SDA (out) low.
tVD;DAT = minimum time for SDA data out to be valid following SCL low.
A master device must internally provide a hold time of at least 300 ns for the SDA signal (refer to the VIL of the SCL signal) in order to
bridge the undefined region of the SCL falling edge.
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time (tf) for the SDA output stage is specified
at 250 ns. This allows series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines
without exceeding the maximum specified tf.
Cb = total capacitance of one bus line in pF.
Input filters on the SDA and SCL inputs suppress noise spikes less than 50 ns
Resetting the device while actively communicating on the bus may cause glitches or errant Stop conditions.
Upon reset, the full delay is the sum of tRESET and the RC time constant of the SDA bus.
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7.7 Typical Characteristics
140
120
120
110
Temperature = 25C, VCC = 3.0V
90
80
Output Current (mA)
LED Current (mA)
100
100
60
40
20
0
0
500
1000
1500
2000 2500
REXT (:)
3000
3500
4000
D001
80
70
60
50
40
30
20
IOUT = 26mA
IOUT = 52mA
IOUT = 100mA
10
0
0.0
0.5
1.0
1.5
2.0
Output Voltage (V)
2.5
3.0
G000
Figure 1. LED Current vs REXT Resistance
Figure 2. Output Current vs Output Voltage
8 Parameter Measurement Information
Start
SCL
ACK or Read Cycle
SDA
30%
tRESET
50%
RESET
tREC
tW
OUTn
50%
tRESET
Figure 3. Reset Timing
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Parameter Measurement Information (continued)
SDA
tBUF
tHD;STA
tr
tSP
tf
tLOW
SCL
tSU;DAT
tHD;STA
P
tHD;DAT
S
tSU;DAT
tHIGH
tSU;STO
Sr
P
Figure 4. Definition of Timing
Protocol
Bit 7
MSB
(A7)
Start
Condition
(S)
tSU;STA
tLOW
Bit 6
(A6)
tHIGH
Bit 7
(D1)
Bit 8
(D0)
Acknowledge
(A)
Stop
Condition
(P)
1/fSCL
SCL
tr
tf
tBUF
SDA
tHD;STA
tSU;DAT
tHD;DAT
tVD;DAT
tVD;ACK
tSU;STO
NOTE: Rise and fall times refer to VIL and VIH.
Figure 5. I2C Bus Timing
VCC
RL
Pulse
Generator
VI
DUT
RT
VCC
Open
GND
VO
CL
NOTE: RL = Load resistance for SDA and SCL; should be >1 kΩ at 3-mA or lower current.
CL = Load capacitance; includes jig and probe capacitance.
RT = Termination resistance; should be equal to the output impedance (ZO) of the pulse generator.
Figure 6. Test Circuit for Switching Characteristics
10
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9 Detailed Description
9.1 Overview
The TLC59108 is an I2C bus controlled 8-bit LED driver that is optimized for red/green/blue/amber (RGBA) color
mixing and backlight applications. Each LED output has its own 8-bit resolution (256 steps) fixed-frequency
individual PWM controller that operates at 97 kHz, with a duty cycle that is adjustable from 0% to 99.6%. The
individual PWM controller allows each LED to be set to a specific brightness value. An additional 8-bit resolution
(256 steps) group PWM controller has both a fixed frequency of 190 Hz and an adjustable frequency between 24
Hz to once every 10.73 seconds, with a duty cycle that is adjustable from 0% to 99.6%. The group PWM
controller dims or blinks all LEDs with the same value.
Each LED output can be off, on (no PWM control), or set at its individual PWM controller value at both individual
and group PWM controller values.
The TLC59108 is one of the first LED controller devices in a new Fast-mode Plus (Fm+) family. Fm+ devices
offer higher frequency (up to 1 MHz) and longer, more densely populated bus operation (up to 4000 pF).
Software programmable LED group and three Sub Call I2C bus addresses allow all or defined groups of
TLC59108 devices to respond to a common I2C bus address, allowing for example, all red LEDs to be turned on
or off at the same time or marquee chasing effect, thus minimizing I2C bus commands. Four hardware address
pins allow up to 14 devices on the same bus.
The Software Reset (SWRST) call allows the master to perform a reset of the TLC59108 through the I2C bus,
identical to the Power-On Reset (POR) that initializes the registers to their default state, causing the outputs to
be set high (LED off). This allows an easy and quick way to reconfigure all device registers to the same
condition.
9.2 Functional Block Diagram
A0 A1 A2 A3
SCL
SDA
Input Filter
REXT
OUT0
OUT1
OUT6
OUT7
I/O Regulator
2
I C Bus Control
Output Driver and Error Detection
RESET
Power-On
Reset Control
LED State
Select Register
PWM Register X
Brightness Control
97 kHz
24.3 kHz
25-MHz
Oscillator
VCC
GRPFRQ
Register
GRPPWM
Register
190 kHz
0 = Permanently off
1 = Permanently on
GND
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9.3 Feature Description
9.3.1 Open-Circuit Detection
The TLC59108 LED open-circuit detection compares the effective current level IOUT with the open load detection
threshold current IOUT, Th. If IOUT is below the threshold IOUT, Th the TLC59108 detects an open load condition. This
error status can be read out as an error flag through the EFLAG register.
For open-circuit error detection, a channel must be on.
Table 1. Open-Circuit Detection
STATE OF OUTPUT PORT
CONDITION OF OUTPUT
CURRENT
ERROR STATUS CODE
MEANING
IOUT = 0 mA
Off
On
(1)
0
Detection not possible
IOUT < IOUT,Th
(1)
0
Open circuit
IOUT ≥ IOUT,Th
(1)
Channel n error status bit 1
Normal
IOUT,Th = 0.5 × IOUT,target (typical)
9.3.2 Overtemperature Detection and Shutdown
The TLC59108 LED is equipped with a global overtemperature sensor and eight individual channel-selective
overtemperature sensors.
• When the global sensor reaches the trip temperature, all output channels are shutdown, and the error status
is stored in the internal Error Status register of every channel. After shutdown, the channels automatically
restart after cooling down, if the control signal (output latch) remains on. The stored error status is not reset
after cooling down and can be read out as the error status code in the EFLAG register.
• When one of the channel-specific sensors reaches trip temperature, only the affected output channel is shut
down, and the error status is stored only in the internal Error Status register of the affected channel. After
shutdown, the channel automatically restarts after cooling down, if the control signal (output latch) remains
on. The stored error status is not reset after cooling down and can be read out as error status code in the
EFLAG register.
For channel-specific overtemperature error detection, a channel must be on.
The error flags of open-circuit and overtemperature are ORed to set the EFLAG register.
The error status code due to overtemperature is reset when the host writes 1 to bit 7 of the MODE2 register. The
host must write 0 to bit 7 of the MODE2 register to enable the overtemperature error flag.
Table 2. Overtemperature Detection
(1)
(1)
STATE OF OUTPUT PORT
CONDITION
ERROR STATUS CODE
MEANING
On
On → all channels Off
TJ < TJ,trip global
1
Normal
TJ > TJ,trip global
All error status bits = 0
Global overtemperature
On
On → Off
TJ < TJ,trip channel n
1
Normal
TJ > TJ,trip channel n
Channel n error status bit = 0
Channel n overtemperature
The global shutdown threshold temperature is approximately 170°C.
9.3.3 Power-On Reset
When power is applied to VCC, an internal power-on reset holds the TLC59108 in a reset condition until VCC
reaches VPOR. At this point, the reset condition is released and the TLC59108 registers, and I2C bus state
machine are initialized to their default states (all zeroes), causing all the channels to be deselected. Thereafter,
VCC must be lowered below 0.2 V to reset the device.
9.3.4 External Reset
A reset can be accomplished by holding the RESET pin low for a minimum of tW. The TLC59108 registers and
I2C state machine are held in their default states until the RESET input is again high.
This input requires a pullup resistor to VCC if no active connection is used.
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9.3.5 Software Reset
The Software Reset Call (SWRST Call) allows all the devices in the I2C bus to be reset to the power-up state
value through a specific I2C bus command. To be performed correctly, the I2C bus must be functional and there
must be no device hanging the bus.
The SWRST Call function is defined as the following:
1. A Start command is sent by the I2C bus master.
2. The reserved SWRST I2C bus address 1001 011 with the R/W bit set to 0 (write) is sent by the I2C bus
master.
3. The TLC59108 device(s) acknowledge(s) after seeing the SWRST Call address 1001 0110 (96h) only. If the
R/W bit is set to 1 (read), no acknowledge is returned to the I2C bus master.
4. Once the SWRST Call address has been sent and acknowledged, the master sends two bytes with two
specific values (SWRST data byte 1 and byte 2):
(a) Byte1 = A5h: the TLC59108 acknowledges this value only. If byte 1 is not equal to A5h, the TLC59108
does not acknowledge it.
(b) Byte 2 = 5Ah: the TLC59108 acknowledges this value only. If byte 2 is not equal to 5Ah, the TLC59108
does not acknowledge it.
If more than two bytes of data are sent, the TLC59108 does not acknowledge any more.
5. Once the correct two bytes (SWRST data byte 1 and byte 2 only) have been sent and correctly
acknowledged, the master sends a Stop command to end the SWRST Call. The TLC59108 then resets to
the default value (power-up value) and is ready to be addressed again within the specified bus free time
(tBUF).
The I2C bus master may interpret a non-acknowledge from the TLC59108 (at any time) as a SWRST Call Abort.
The TLC59108 does not initiate a reset of its registers. This happens only when the format of the Start Call
sequence is not correct.
9.3.6 Individual Brightness Control With Group Dimming/Blinking
A 97-kHz fixed-frequency signal with programmable duty cycle (8 bits, 256 steps) is used to control the individual
brightness for each LED.
On top of this signal, one of the following signals can be superimposed (this signal can be applied to the four
LED outputs):
• A lower 190-Hz fixed-frequency signal with programmable duty cycle (8 bits, 256 steps) provides a global
brightness control.
• A programmable frequency signal from 24 Hz to 1/10.73 s (8 bits, 256 steps) provides a global blinking
control.
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6
7
8
6
7
8
9
5
5
10
3
4
3
4
1
2
1
2
512
510
511
509
507
508
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10
8
6
7
5
4
3
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N × 40 ns
with N = 0 to 255
(PWM register)
M × 256 × 2 × 40 ns
with M = 0 to 255
(GRPPWM register)
256 × 40 ns = 10.24 µs
(97.6 kHz)
Group Dimming Signal
256 × 2 × 256 × 40 ns = 5.24 ms (190.7 Hz)
Resulting Brightness + Group Dimming Signal
NOTE: Minimum pulse width for LEDn brightness control is 40 ns.
Minimum pulse width for group dimming is 20.48 μs.
When M = 1 (GRPPWM register value), the resulting LEDn Brightness Control + Group Dimming signal has two
pulses of the LED Brightness Control signal (pulse width = n × 40 ns, with n defined in the PWMx register).
This resulting Brightness + Group Dimming signal shows a resulting control signal with n = 4 (8 pulses).
Figure 7. Brightness and Group Dimming Signals
9.4 Device Functional Modes
Active
Active mode occurs when one or more of the output channels is enabled.
Standby
Standby mode occurs when all output channels are disabled. Standby mode may be entered via
I2C command or by pulling the RESET pin low.
9.5 Programming
9.5.1 Characteristics of the I2C Bus
The I2C bus is for two-way two-line communication between different devices or modules. The two lines are a
serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a
pullup resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus
is not busy.
9.5.1.1 Bit Transfer
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high
period of the clock pulse as changes in the data line at this time are interpreted as control signals (see Figure 8).
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Programming (continued)
SDA
SCL
Data Line
Stable;
Data Valid
Change
of Data
Allowed
Figure 8. Bit Transfer
9.5.1.2 Start and Stop Conditions
Both data and clock lines remain high when the bus is not busy. A high-to-low transition of the data line while the
clock is high is defined as the Start condition (S). A low-to-high transition of the data line while the clock is high is
defined as the Stop condition (P) (see Figure 9).
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 9. Start and Stop Conditions
9.5.2 System Configuration
A device generating a message is a transmitter; a device receiving is the receiver. The device that controls the
message is the master and the devices which are controlled by the master are the slaves (see Figure 10).
SDA
SCL
Master
Transmitter/
Receiver
Slave
Receiver
Slave
Transmitter/
Receiver
Master
Transmitter
Master
Transmitter/
Receiver
I2C Bus
Multiplexer
Slave
Figure 10. System Configuration
9.5.3 Acknowledge
The number of data bytes transferred between the Start and the Stop conditions from transmitter to receiver is
not limited. Each byte of eight bits is followed by one acknowledge bit. The acknowledge bit is a high level put on
the bus by the transmitter, whereas the master generates an extra acknowledge related clock pulse.
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Programming (continued)
A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a
master must generate an acknowledge after the reception of each byte that has been clocked out of the slave
transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so
that the SDA line is stable low during the high period of the acknowledge related clock pulse; set-up time and
hold time must be taken into account.
A master receiver must signal an end of data to the transmitter by not generating an acknowledge on the last
byte that has been clocked out of the slave. In this event, the transmitter must leave the data line high to enable
the master to generate a Stop condition.
Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
2
8
9
S
Start
Condition
Clock Pulse for
Acknowledgment
Figure 11. Acknowledge/Not Acknowledge on I2C Bus
Slave Address
Control Register
S A6 A5 A4 A3 A2 A1 A0 0
Start Condition
A
X X
X D4 D3 D2 D1 D0 A
R/W
A
ACK From Slave
ACK From Slave
P
Stop Condition
Auto-Increment Options
Auto-Increment Flag
ACK From Slave
Figure 12. Write to a Specific Register
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Programming (continued)
Slave Address
Control Register
S A6 A5 A4 A3 A2 A1 A0 0
Start Condition
A
0
1
0
0
0
0
MODE1 Register
0
0
R/W
MODE2 Register
A
A
A
ACK From Slave
ACK From Slave
MODE1 Register Selection
Auto-Increment On All Registers (see Note A)
Auto-Increment On
ACK From Slave
SUBADR3 Register
ALLCALLADR Register
A
A
ACK From Slave
A.
ACK From Slave
P
Stop Condition
See Table 4 for register definitions.
Figure 13. Write to All Registers Using Auto-Increment
Slave Address
Control Register
S A6 A5 A4 A3 A2 A1 A0 0
Start Condition
A
1
0
1
0
0
0
PWM0 Register
1
R/W
0
A
PWM1 Register
A
A
ACK From Slave
ACK From Slave
PWM0 Register Selection
Auto-Increment On Brightness Registers Only
Auto-Increment On
ACK From Slave
PWM4 Register
PWM5 Register
A
ACK From Slave
PWM0 Register
PWMx Register
A
A
A
ACK From Slave
ACK From Slave
ACK From Slave
P
Stop Condition
Figure 14. Multiple Writes to Individual Brightness Registers Using Auto-Increment
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Programming (continued)
Slave Address
Control Register
S A6 A5 A4 A3 A2 A1 A0 0
Start Condition
A
0
0
1
0
0
0
Data From MODE1 Register
Slave Address
0
R/W
A Sr A6 A5 A4 A3 A2 A1 A0 1
0
A
A
R/W ACK From Slave
ACK From Slave
ACK From Master
MODE1 Register Selection
Auto-Increment On All Registers
Auto-Increment On
ACK From Slave
Data From MODE2 Register
Data From PWM0 Register
A
Data From ALLCALLADR Register
A
ACK From Master
Data From MODE1 Register
A
ACK From Master
A
ACK From Master
ACK From Master
Data From Last Read Byte
A
P
ACK From Master
Stop Condition
Figure 15. Read All Registers Auto-Increment
2
Slave Address
Sequence A
New LED All Call I C Address
(see Note B)
Control Register
S A6 A5 A4 A3 A2 A1 A0 0
Start Condition
A
X X
X
1
1
0
1
1
A
1
0
0
1
ACK From Slave
R/W
0
1
1
X
A
ACK From Slave
P
Stop Condition
ALLCALLADR Register Selection
Auto-Increment Options
Auto-Increment Flag
ACK From Slave
2
LED All Call I C Address
Sequence B
S 1
0
0
1
1
Start Condition
0
1
The 16 LEDs are on at ACK (see Note C)
LEDOUT0 Register (LED3 to 0 Fully On)
Control Register
0
A
X X
X
1
0
1
0
R/W
0
A
0
1
0
1
ACK From the
Four Slaves
0
1
0
1
A
ACK From the
Four Slaves
P
Stop Condition
LEDOUT0 Register Selection
ACK From Slave
A.
In this example, several TLC59108 devices are used, and the same Sequence A is sent to each of them.
B.
The ALLCALL bit in the MODE1 register is equal to 1 for this example.
C.
The OCH bit in the MODE2 register is equal to 1 for this example.
Figure 16. LED All Call I2C Bus Address Programming and LED All Call Sequence
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Programming (continued)
9.5.4 Device Address
Following a Start condition, the bus master must output the address of the slave it is accessing.
9.5.5 Regular I2C Bus Slave Address
The I2C bus slave address of the TLC59108 is shown in Figure 17. To conserve power, no internal pullup
resistors are incorporated on the hardware-selectable address pins, and they must be pulled high or low. For
buffer management purpose, a set of sector information data should be stored.
Slave Address
1
0
Fixed
0
A3
A2
A1
A0 R/W
Hardware
Selectable
Figure 17. Slave Address
The last bit of the address byte defines the operation to be performed. When set to logic 1, a read operation is
selected. When set to logic 0, a write operation is selected.
9.5.6 LED All Call I2C Bus Address
• Default power-up value (ALLCALLADR register): 90h or 1001 000
• Programmable through I2C bus (volatile programming)
• At power-up, LED All Call I2C bus address is enabled. TLC59108 sends an ACK when 90h (R/W = 0) or 91h
(R/W = 1) is sent by the master.
See LED All Call I2C Bus Address Register (ALLCALLADR) for more detail.
NOTE
The default LED All Call I2C bus address (90h or 1001 000) must not be used as a regular
I2C bus slave address since this address is enabled at power-up. All the TLC59108
devices on the I2C bus acknowledge the address if sent by the I2C bus master.
9.5.7 LED Sub Call I2C Bus Address
• Three different I2C bus address can be used
• Default power-up values:
– SUBADR1 register: 92h or 1001 001
– SUBADR2 register: 94h or 1001 010
– SUBADR3 register: 98h or 1001 100
• Programmable through I2C bus (volatile programming)
• At power-up, Sub Call I2C bus address is disabled. TLC59108 does not send an ACK when 92h (R/W = 0) or
93h (R/W = 1) or 94h (R/W = 0) or 95h (R/W = 1) or 98h (R/W = 0) or 99h (R/W = 1) is sent by the master.
See I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3) for more detail.
NOTE
The default LED Sub Call I2C bus address may be used as a regular I2C bus slave
address as long as they are disabled.
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Programming (continued)
9.5.8 Software Reset I2C Bus Address
The address shown in Figure 18 is used when a reset of the TLC59108 needs to be performed by the master.
The software reset address (SWRST Call) must be used with R/W = 0. If R/W = 1, the TLC59108 does not
acknowledge the SWRST. See Software Reset for more detail.
1
0
0
1
0
1
1
R/W
Figure 18. Software Reset Address
NOTE
The Software Reset I2C bus address is reserved address and cannot be use as regular
I2C bus slave address or as an LED All Call or LED Sub Call address.
9.5.9 Control Register
Following the successful acknowledgment of the slave address, LED All Call address or LED Sub Call address,
the bus master sends a byte to the TLC59108, which is stored in the Control register. The lowest 5 bits are used
as a pointer to determine which register is accessed (D[4:0]). The highest 3 bits are used as Auto-Increment flag
and Auto-Increment options (AI[2:0]).
Auto-Increment
Flag
Register Address
AI2 AI1 AI0 D4
D3
D2
D1
D0
Auto-Increment
Options
Figure 19. Control Register
When the Auto-Increment flag is set (AI2 = logic 1), the five low order bits of the Control register are
automatically incremented after a read or write. This allows the user to program the registers sequentially. Four
different types of Auto-Increment are possible, depending on AI1 and AI0 values.
Table 3. Auto-Increment Options
AI2
AI1
AI0
DESCRIPTION
0
0
0
No auto-increment
1
0
0
Auto-increment for all registers. D[4:0] roll over to 0 0000 after the last register (1 0001) is
accessed.
1
0
1
Auto-increment for individual brightness registers only. D[4:0] roll over to 0 0010 after the last
register (0 1001) is accessed.
1
1
0
Auto-increment for global control registers only. D[4:0] roll over to 0 1010 after the last register (0
1011) is accessed.
1
1
1
Auto-increment for individual and global control registers only. D[4:0] roll over to 0 0010 after the
last register (0 1011) is accessed.
NOTE
Other combinations not shown in Table 3. (AI[2:0] = 001, 010 and 011) are reserved and
must not be used for proper device operation.
IREF and EFLAG not included in Auto-Increment
AI[2:0] = 000 is used when the same register must be accessed several times during a single I2C bus
communication, for example, changes the brightness of a single LED. Data is overwritten each time the register
is accessed during a write operation.
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AI[2:0] = 100 is used when all the registers must be sequentially accessed, for example, power-up programming.
AI[2:0] = 101 is used when the four LED drivers must be individually programmed with different values during the
same I2C bus communication, for example, changing color setting to another color setting.
AI[2:0] = 110 is used when the LED drivers must be globally programmed with different settings during the same
I2C bus communication, for example, global brightness or blinking change.
AI[2:0] = 111 is used when individually and global changes must be performed during the same I2C bus
communication, for example, changing color and global brightness at the same time.
Only the 5 least significant bits D[4:0] are affected by the AI[2:0] bits.
When the Control register is written, the register entry point determined by D[4:0] is the first register that is
addressed (read or write operation), and can be anywhere between 0 0000 and 1 0001 (as defined in Table 4).
When AI[2] = 1, the Auto-Increment flag is set and the rollover value at which the point where the register
increment stops and goes to the next one is determined by AI[2:0]. See Table 3 for rollover values. For example,
if the Control register = 1110 1100 (ECh), then the register addressing sequence is (in hex):
0C → ... → 11 → 00 → ... → 0B → 02 → ... → 0B → 02 → ... as long as the master keeps sending or reading
data.
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9.6 Register Maps
9.6.1 Register Descriptions
Table 4 describes the registers in the TLC59108.
Table 4. Register Descriptions
REGISTER
NUMBER
(HEX)
(1)
22
NAME
ACCESS
(1)
DESCRIPTION
00
MODE1
R/W
Mode 1
01
MODE2
R/W
Mode 2
02
PWM0
R/W
Brightness control LED0
03
PWM1
R/W
Brightness control LED1
04
PWM2
R/W
Brightness control LED2
05
PWM3
R/W
Brightness control LED3
06
PWM4
R/W
Brightness control LED4
07
PWM5
R/W
Brightness control LED5
08
PWM6
R/W
Brightness control LED6
09
PWM7
R/W
Brightness control LED7
0A
GRPPWM
R/W
Group duty cycle control
0B
GRPFREQ
R/W
Group frequency
0C
LEDOUT0
R/W
LED output state 0
0D
LEDOUT1
R/W
LED output state 1
0E
SUBADR1
R/W
I2C bus subaddress 1
0F
SUBADR2
R/W
I2C bus subaddress 2
10
SUBADR3
R/W
I2C bus subaddress 3
11
ALLCALLADR
R/W
LED All Call I2C bus address
12
IREF
R/W
IREF configuration
13
EFLAG
R
Error flag
R = read, W = write
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9.6.1.1 Mode Register 1 (MODE1)
Table 5 describes Mode Register 1.
Table 5. MODE1 – Mode Register 1 (Address 00h) Bit Description
BIT
7
6
(4)
AI2
AI1
ACCESS
R
4
OSC
R/W
SUB2
R/W
1
SUB3
R/W
0
ALLCALL
R/W
(2)
1
0
0
DESCRIPTION
Register Auto-Increment disabled
Register Auto-Increment enabled
(2)
1
R/W
2
VALUE
0
R
AI0
SUB1
(1)
R
5
3
(1)
(2)
(3)
SYMBOL
Auto-Increment bit 1 = 0
Auto-Increment bit 1 = 1
(2)
Auto-Increment bit 0 = 0
1
Auto-Increment bit 0 = 1
0
Normal mode
(3)
1
(2)
Oscillator off
0
(2)
Device does not respond to I2C bus subaddress 1.
(2)
1
Device does not respond to I2C bus subaddress 2.
Device responds to I2C bus subaddress 2.
1
0
.
Device responds to I2C bus subaddress 1.
1
0
(4)
(2)
Device does not respond to I2C bus subaddress 3.
1
Device responds to I2C bus subaddress 3.
0
Device does not respond to LED All Call I2C bus address.
(2)
Device responds to LED All Call I2C bus address.
R = read, W = write
Default value
Requires 500 μs maximum for the oscillator to be up and running once SLEEP bit has been set to logic 1. Timings on LED outputs are
not guaranteed if PWMx, GRPPWM, or GRPFREQ registers are accessed within the 100 μs window.
No blinking or dimming is possible when the oscillator is off.
9.6.1.2 Mode Register 2 (MODE2)
Table 6 describes Mode Register 2.
Table 6. MODE2 – Mode Register 2 (Address 01h) Bit Description
BIT
7
SYMBOL
EFCLR
6
5
2:0
(1)
(2)
(3)
(1)
R/W
R
DMBLNK
4
3
ACCESS
R/W
R
OCH
R/W
R
VALUE
0
(2)
1
DESCRIPTION
Enable error status flag
Clear error status flag
0
(2)
Reserved
0
(2)
Group control = dimming
1
Group control = blinking
0
(2)
Reserved
0
(2)
Outputs change on Stop command
1
000
(3)
Outputs change on ACK
(2)
Reserved
R = read, W = write
Default value
Change of the outputs at the Stop command allows synchronizing outputs of more than one TLC59108. Applicable to registers from 02h
(PWM0) to 0Dh (LEDOUT) only.
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9.6.1.3 Brightness Control Registers 0 to 7 (PWM0 to PWM7)
Table 7 describes Brightness Control Registers 0 to 7.
Table 7. PWM0 to PWM7 – PWM Registers 0 to 7 (Address 02h to 09h) Bit Description
REGISTER
BIT
SYMBOL
02h
PWM0
7:0
IDC0[7:0]
R/W
0000 0000
(2)
PWM0 individual duty cycle
03h
PWM1
7:0
IDC1[7:0]
R/W
0000 0000
(2)
PWM1 individual duty cycle
PWM2 individual duty cycle
(1)
(2)
ACCESS
(1)
ADDRESS
VALUE
DESCRIPTION
04h
PWM2
7:0
IDC2[7:0]
R/W
0000 0000
(2)
05h
PWM3
7:0
IDC3[7:0]
R/W
0000 0000
(2)
PWM3 individual duty cycle
06h
PWM4
7:0
IDC4[7:0]
R/W
0000 0000
(2)
PWM4 individual duty cycle
07h
PWM5
7:0
IDC5[7:0]
R/W
0000 0000
(2)
PWM5 individual duty cycle
PWM6 individual duty cycle
PWM7 individual duty cycle
08h
PWM6
7:0
IDC6[7:0]
R/W
0000 0000
(2)
09h
PWM7
7:0
IDC7[7:0]
R/W
0000 0000
(2)
R = read, W = write
Default value
A 97-kHz fixed frequency signal is used for each output. Duty cycle is controlled through 256 linear steps from
00h (0% duty cycle = LED output off) to FFh (99.6% duty cycle = LED output at maximum brightness). Applicable
to LED outputs programmed with LDRx = 10 or 11 (LEDOUT0 and LEDOUT1 registers).
Duty cycle = IDCn[7:0] / 256
9.6.1.4 Group Duty Cycle Control Register (GRPPWM)
Table 8 describes the Group Duty Cycle Control Register.
Table 8. GRPPWM – Group Brightness Control Register (Address 0Ah) Bit Description
ADDRESS
REGISTER
BIT
SYMBOL
0Ah
GRPPWM
7:0
GDC0[7:0]
(1)
(2)
ACCESS
R/W
(1)
VALUE
1111 1111
DESCRIPTION
(2)
GRPPWM register
R = read, W = write
Default value
When the DMBLNK bit (MODE2 register) is programmed with logic 0, a 190-Hz fixed-frequency signal is
superimposed with the 97-kHz individual brightness control signal. GRPPWM is then used as a global brightness
control, allowing the LED outputs to be dimmed with the same value. The value in GRPFREQ is then a Don't
care.
General brightness for the eight outputs is controlled through 256 linear steps from 00h (0% duty cycle = LED
output off) to FFh (99.6% duty cycle = maximum brightness). Applicable to LED outputs programmed with
LDRx = 11 (LEDOUT0 and LEDOUT1 registers).
When DMBLNK bit is programmed with logic 1, the GRPPWM and GRPFREQ registers define a global blinking
pattern, where GRPFREQ defines the blinking period (from 24 Hz to 10.73 s) and GRPPWM defines the duty
cycle (ON/OFF ratio in %).
Duty cycle = GDC0[7:0] / 256
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9.6.1.5 Group Frequency Register (GRPFREQ)
Table 9 describes the Group Frequency Register.
Table 9. GRPFREQ – Group Frequency Register (Address 0Bh) Bit Description
ADDRESS
REGISTER
BIT
SYMBOL
0Bh
GRPFREQ
7:0
GFRQ[7:0]
(1)
(2)
ACCESS
(1)
R/W
VALUE
0000 0000
DESCRIPTION
(2)
GRPFREQ register
R = read, W = write
Default value
GRPFREQ is used to program the global blinking period when the DMBLNK bit (MODE2 register) is equal to 1.
Value in this register is a Don't care when DMBLNK = 0. Applicable to LED output programmed with LDRx = 11
(LEDOUT0 and LEDOUT1 registers).
Blinking period is controlled through 256 linear steps from 00h (41 ms, frequency 24 Hz) to FFh (10.73 s).
Global blinking period (seconds) = (GFRQ[7:0] + 1) / 24
9.6.1.6 LED Driver Output State Registers (LEDOUT0, LEDOUT1)
Table 10 describes LED Driver Output State Registers 0 and 1.
Table 10. LEDOUT0 and LEDOUT1 – LED Driver Output State Registers (Address 0Ch and 0Dh) Bit
Description
ADDRESS
0Ch
0Dh
REGISTER
LEDOUT0
LEDOUT1
BIT
SYMBOL
7:6
LDR3[1:0]
R/W
(1)
VALUE
DESCRIPTION
00
(2)
LED3 output state control
LED2 output state control
5:4
LDR2[1:0]
R/W
00
(2)
3:2
LDR1[1:0]
R/W
00
(2)
LED1 output state control
1:0
LDR0[1:0]
R/W
00
(2)
LED0 output state control
LED7 output state control
7:6
LDR7[1:0]
R/W
00
(2)
5:4
LDR6[1:0]
R/W
00
(2)
LED6 output state control
3:2
LDR5[1:0]
R/W
00
(2)
LED5 output state control
00
(2)
LED4 output state control
1:0
(1)
(2)
ACCESS
LDR4[1:0]
R/W
R = read, W = write
Default value
LDRx = 00: LED driver x is off (default power-up state).
LDRx = 01: LED driver x is fully on (individual brightness and group dimming/blinking not controlled).
LDRx = 10: LED driver x is individual brightness can be controlled through its PWMx register.
LDRx = 11: LED driver x is individual brightness and group dimming/blinking can be controlled through its PWMx
register and the GRPPWM registers.
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9.6.1.7 I2C Bus Subaddress Registers 1 to 3 (SUBADR1 to SUBADR3)
Table 11 describes I2C Bus Subaddress Registers 1 to 3.
Table 11. SUBADR1 to SUBADR3 – I2C Bus Subaddress Registers 1 to 3 (Address 0Eh to 10h) Bit
Description
ADDRESS
0Eh
0Fh
10h
REGISTER
SUBADR1
SUBADR2
SUBADR3
BIT
SYMBOL
7:5
A1[7:5]
4:1
A1[4:1]
(1)
VALUE
R
100
R/W
A1[0]
R
0
A2[7:1]
R
100
A2[4:1]
R/W
A2[0]
R
0
A3[7:1]
R
100
A3[0]
R/W
0
Reserved
(2)
I2C bus subaddress 2
Reserved
(2)
1100
R
Reserved
(2)
0
A3[4:1]
I2C bus subaddress 1
(2)
1010
7:5
4:1
Reserved
(2)
(2)
0
4:1
DESCRIPTION
(2)
1001
7:5
0
(1)
(2)
ACCESS
Reserved
(2)
I2C bus subaddress 3
(2)
Reserved
R = read, W = write
Default value
Subaddresses are programmable through the I2C bus. Default power-up values are 92h, 94h, 98h. The
TLC59108 does not acknowledge these addresses immediately after power-up (the corresponding SUBx bit in
MODE1 register is equal to 0).
Once subaddresses have been programmed to valid values, the SUBx bits (MODE1 register) must be set to 1 to
allows the device to acknowledge these addresses.
Only the 7 MSBs representing the I2C bus subaddress are valid. The LSB in SUBADRx register is a read-only bit
(0).
When SUBx is set to 1, the corresponding I2C bus subaddress can be used during either an I2C bus read or write
sequence.
9.6.1.8 LED All Call I2C Bus Address Register (ALLCALLADR)
Table 12 describes the LED All Call I2C Bus Address Register.
Table 12. ALLCALLADR – LED All Call I2C Bus Address Register (Address 11h) Bit Description
ADDRESS
11h
REGISTER
ALLCALLADR
BIT
SYMBOL
7:5
AC[7:5]
4:1
0
(1)
(2)
AC[4:1]
AC[0]
ACCESS
R
R/W
R
(1)
VALUE
100
1000
0
(2)
(2)
(2)
DESCRIPTION
Reserved
All Call I2C bus address register
Reserved
R = read, W = write
Default value
The LED All Call I2C bus address allows all the TLC59108 devices in the bus to be programmed at the same
time (ALLCALL bit in register MODE1 must be equal to 1, which is the power-up default state). This address is
programmable through the I2C bus and can be used during either an I2C bus read or write sequence. The
register address can also be programmed as a Sub Call.
Only the 7 MSBs representing the All Call I2C bus address are valid. The LSB in ALLCALLADR register is a
read-only bit (0).
If ALLCALL bit = 0, the device does not acknowledge the address programmed in register ALLCALLADR.
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9.6.1.9 Output Gain Control Register (IREF)
Table 13 describes the Output Gain Control Register.
Table 13. IREF – Output Gain Control Register (Address 12h) Bit Description
ADDRESS
12h
REGISTER
IREF
SYMBOL
7
CM
R/W
1
(2)
6
HC
R/W
1
(2)
5:0
(1)
(2)
CC[5:0]
ACCESS
(1)
BIT
R/W
VALUE
11 1111
DESCRIPTION
High/low current multiplier
Subcurrent
(2)
Current multiplier
R = read, W = write
Default value
IREF determines the voltage gain (VG), which affects the voltage at the REXT terminal and indirectly the reference
current (IREF) flowing through the external resistor at terminal REXT. Bit 0 is the Current Multiplier (CM) bit, which
determines the ratio IOUT,target/Iref. Each combination of VG and CM sets a Current Gain (CG).
• VG: the relationship between {HC,CC[0:5]} and the voltage gain is calculated as shown below:
VG = (1 + HC) × (1 + D/64) / 4
D = CC0 × 25 + CC1 × 24 + CC2 × 23 + CC3 × 22 + CC4 × 21 + CC5 × 20
Where HC is 1 or 0, and D is the binary value of CC[0:5]. So, the VG could be regarded as a floating-point
number with 1-bit exponent HC and 6-bit mantissa CC[0:5]. {HC,CC[0:5]} divides the programmable voltage
gain VG into 128 steps and two sub-bands:
Low voltage sub-band (HC = 0): VG = 1/4 to 127/256, linearly divided into 64 steps
High voltage sub-band (HC = 1): VG = 1/2 to 127/128, linearly divided into 64 steps
• CM: In addition to determining the ratio IOUT,target/Iref, CM limits the output current range.
High Current Multiplier (CM = 1): IOUT,target/Iref = 15, suitable for output current range IOUT = 10 mA to 120 mA.
Low Current Multiplier (CM = 0): IOUT,target/Iref = 5, suitable for output current range IOUT = 5 mA to 40 mA
• CG: The total Current Gain is defined as the following.
VREXT = 1.26 V × VG
Iref = VREXT/Rext, if the external resistor, Rext, is connected to ground.
IOUT,target = Iref × 15 × 3CM – 1 = 1.26 V/Rext × VG × 15 × 3CM – 1 = (1.26 V/Rext × 15) × CG
CG = VG × 3CM – 1
Therefore, CG = (1/12) to (127/128), and it is divided into 256 steps. If CG = 127/128 = 0.992, the IOUT,targetRext.
Examples
• I REF Code {CM, HC, CC[0:5]} = {1,1,111111}
VG = 127/128 = 0.992 and CG = VG × 30 = VG = 0.992
• IREF Code {CM, HC, CC[0:5]} = {1,1,000000}
VG = (1 + 1) × (1 + 0/64)/4 = 1/2 = 0.5, and CG = 0.5
• IREF Code {CM, HC, CC[0:5]} = {0,0,000000}
VG = (1 + 0) × (1 + 0/64)/4 = 1/4, and CG = (1/4) × 3–1 = 1/12
After power on, the default value of the Configuration Code {CM, HC, CC[0:5]} is {1,1,111111}. Therefore,
VG = CG = 0.992. The relationship between the Configuration Code and the Current Gain is shown in Figure 20.
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1.00
CM = 0 (Low Current Multiplier)
Current Gain (CG)
0.75
HC = 1 (High
Voltage SubBand)
0.50
HC = 0 (Low
Voltage SubBand)
HC = 0 (Low
Voltage SubBand)
HC = 1 (High
Voltage SubBand)
0.25
CM = 1 (High Current Multiplier)
0.00
Configuration Code (CM, HC, CC[0:5]) in Binary Format
Figure 20. Current Gain vs Configuration Code
9.6.1.10 Error Flags Registers (EFLAG)
Table 14 describes the Error Flags Register.
Table 14. EFLAG – Error Flags Register (Address 13h) Bit Description
ADDRESS
REGISTER
BIT
SYMBOL
13h
EFLAG
7:0
EFLAG[7:0]
(1)
(2)
28
ACCESS
R
(1)
VALUE
1111 1111
DESCRIPTION
(2)
Error flag status by channel
R = read, W = write
Default value
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
10.1.1 Driver Output
10.1.1.1 Constant Current Output
In LED display applications, TLC59108 provides nearly no current variations from channel to channel and from
device to device. While IOUT ≤ 100 mA, the maximum current skew between channels is less than ±3% and less
than ±6% between devices.
10.1.1.2 Adjusting Output Current
TLC59108 scales up the reference current (Iref) set by the external resistor (Rext) to sink the output current (Iout) at
each output port. The following formulas can be used to calculate the target output current IOUT,target in the
saturation region:
VREXT = 1.26 V × VG
Iref = VREXT/Rext, if another end of the external resistor Rext is connected to ground
IOUT,target = Iref × 15 × 3CM – 1
(1)
(2)
(3)
Where Rext is the resistance of the external resistor connected to the REXT terminal, and VREXT is the voltage of
REXT, which is controlled by the programmable voltage gain (VG), which is defined by the Configuration Code.
The Current Multiplier (CM) determines that the ratio IOUT,target/Iref is 15 or 5. After power on, the default value of
VG is 127/128 = 0.992, and the default value of CM is 1, so that the ratio IOUT,target/Iref = 15. Based on the default
VG and CM.
VREXT = 1.26 V × 127/128 = 1.25 V
IOUT,target = (1.25 V/Rext) × 15
(4)
(5)
120
Temperature = 25C, VCC = 3.0V
110
100
Output Current (mA)
90
80
70
60
50
40
30
20
IOUT = 26mA
IOUT = 52mA
IOUT = 100mA
10
0
0.0
0.5
1.0
1.5
2.0
Output Voltage (V)
2.5
3.0
G000
Figure 21. IOUT vs VOUT
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Application Information (continued)
10.1.2 TLC59108 and TLC59108F Differences
The TLC59108 and TLC59108F are similar devices with the difference being the output structure. The TLC59108
has 8 constant-current outputs while the TLC59108F has 8 open drain outputs. The REXT is used to program
the current on the TLC59108 for all channels. The in-line resistors on the OUT pins are used in conjunction with
the VLED to set the currents on each TLC59108F channel. Since the resistors are unique for each output, the
currents can be set by output by changing the resistor value.
LEDs: 8 LEDs / TLC59108F * 1 TLC59108F = 8 LEDs
LEDs: 8 LEDs / TLC59108 * 1 TLC59108 = 8 LEDs
VLED
VLED
VCC
R0
R1
R2
R3
R4
R5
R6
R7
SDA
SDA
OUT0
SCL
SCL
OUT1
A2
A3
RESET
RESET
REXT
R
E
X
T
OUT2
VCC
OUT3
OUT4
SDA
SDA
OUT0
OUT5
SCL
SCL
OUT1
OUT6
OUT7
GND
Address: 00h
A0
A1
A2
A3
RESET
RESET
TLC59108F
A1
VCC
System Controller
A0
TLC59108
System Controller
VCC
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
GND
Address: 00h
REXT is used to set the current for the TLC59108.
All channels will have the same current based on REXT.
R0 through R7 are used to set the current for each channel.
.
Changing the values of R0-R7 allows the user to use different
colored (forward voltage) LEDs on a single TLC59108F.
Figure 22. TLC59108 One Driver
Figure 23. TLC59108F One Driver
10.2 Typical Application
10.2.1 Parallel Outputs
The TLC59108 outputs can be wired in parallel to increase the current per LED string.
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Typical Application (continued)
LEDs: 4 LEDs / TLC59108 * 1 TLC59108 = 4 LEDs
with Double the Current per LED
VLED
VCC
SDA
SDA
OUT0
SCL
SCL
OUT1
A0
A1
A2
A3
RESET
TLC59108
System Controller
VCC
OUT2
OUT3
OUT4
OUT5
OUT6
RESET
OUT7
REXT
GND
Address: 00h
Figure 24. Parallel Channels
10.2.1.1 Design Requirements
Set the LED current to 50 mA while the IREF register is at the default value (CG = 0.992).
10.2.1.2 Detailed Design Procedure
The goal of this design is to set the LED current to 50 mA. Because there are two outputs in parallel, the LED
current should actually be set to 25 mA. With the IREF register at the default value:
IOUT,target = ( 1.25 V / REXT ) × 15
(6)
Using this equation, the appropriate REXT is calculated to be 750 Ω.
10.2.1.3 Application Curve
140
LED Current (mA)
120
100
80
60
40
20
0
0
500
1000
1500
2000 2500
REXT (:)
3000
3500
4000
D001
Figure 25. LED Current vs REXTResistor
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Typical Application (continued)
10.2.2 Multiple Devices
This drawing is an example of using the TLC59108 in a system requiring up to 48 LED strings. The TLC59108
drivers share a single I2C bus. The address pins are set high or low to enable the drivers to be independently
accessed (all can be written in parallel through the ALLCALLADR function). The REXT pins are each tied to
ground through a programming resistor. Since the devices are independent the resistors on the REXT pins can
be of different values allowing multi-color displays.
LEDs: 8 LEDs / TLC59108 * 6 TLC59108s = 48 LEDs
VLED
VCC
Address: 00h
SDA
SCL
SCL
A0
A2
.
.
.
OUT7
RESET
A3
REXT
SDA
OUT0
RESET
SCL
A0
A1
A2
TLC59108
System Controller
A1
OUT0
TLC59108
SDA
A3
.
.
.
OUT7
RESET
REXT
Address: 01h
Address: 02h
OUT0
SCL
.
.
.
A0
A1
A2
TLC59108
SDA
A3
OUT7
RESET
REXT
Address: 03h
SCL
A0
A1
A2
OUT0
TLC59108
SDA
A3
.
.
.
OUT7
RESET
REXT
Address: 04h
SCL
A0
A1
A2
OUT0
TLC59108
SDA
A3
.
.
.
OUT7
RESET
REXT
Address: 05h
SCL
A0
A1
A2
A3
OUT0
TLC59108
SDA
.
.
.
OUT7
RESET
REXT
Figure 26. Six Drivers
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11 Power Supply Recommendations
TLC59108 is designed to operate from a VCC range of 3 V to 5.5 V. The system must also include the VLED
power supply. VLED must be greater than the forward voltage of the LED. However, VLED must be set such that
VO does not exceed 17 V.
12 Layout
12.1 Layout Guidelines
The I2C signals (SDA / SCL) should be kept away from potential noise sources.
The traces carrying power through the LEDs should be wide enough to handle the necessary current.
All LED current passes through the device and into the ground node. There must be a strong connection
between the device ground and the circuit board ground. For the RGY package, the thermal pad should be
connected to the ground to help dissipate heat.
12.2 Layout Examples
To power supply
REXT
VCC
A0
SDA
To µC
A1
SCL
To µC
A2
RESET
To µC
A3
GND
OUT0
OUT7
OUT1
OUT6
GND
GND
OUT2
OUT5
OUT3
OUT4
Via to GND
Figure 27. Layout Example for RGY Package
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Layout Examples (continued)
REXT
VCC
To power
supply
A0
SDA
To µC
A1
SCL
To µC
A2
RESET
To µC
A3
GND
OUT0
OUT7
OUT1
OUT6
GND
GND
OUT2
OUT5
OUT3
OUT4
Via to GND
Figure 28. Layout Example for PW Package
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13 Device and Documentation Support
13.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TLC59108IPWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y59108
TLC59108IRGYR
ACTIVE
VQFN
RGY
20
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
Y59108
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of