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TLC59211
SCLS712A – MARCH 2009 – REVISED JUNE 2015
TLC59211 8-Bit DMOS Sink Driver
1 Features
2 Applications
•
•
•
•
•
•
1
•
•
•
•
DMOS Process
High Voltage Output (Vds = 30 V)
Output Current on Each Channel
(Ids Max = 200 mA)
Latch-Up Performance Exceeds 250 mA Per
JEDEC Standard JESD-17
ESD Protection Exceeds JESD 22
– 2000-V Human Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged Device Model (C101)
LED Driver Application
Output Clamp Diode (Parasitic)
Lamps and Display (LED)
Hammers
Relay
3 Description
The TLC59211 is an 8-bit LED and solenoid driver
designed for 5-V VCC operation.
The TLC59211 is characterized for operation from
–40°C to 85°C.
Device Information(1)
PART NUMBER
TLC59211
PACKAGE
BODY SIZE (NOM)
PDIP (20)
24.33 mm × 6.35 mm
TSSOP (20)
6.50 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Diagram
VLED
8-Bit Sink Current Driver
TLC59211
Character
Generator Circuit
and
LED Power Circuit
SRCLR
RCLK
SRCLK
SER
8-Bit Shift Register
SN74LV595A
SN74LV164A
SN74LV165A
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLC59211
SCLS712A – MARCH 2009 – REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
7
8
1
1
1
2
3
4
Absolute Maximum Ratings ..................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Electrical Characteristics VCC = 3 V to 3.6 V ............ 5
Electrical Characteristics VCC = 4.5 V to 5.5 V ......... 5
Switching Characteristics VCC = 3 V to 3.6 V ........... 5
Switching Characteristics VCC = 4.5 V to 5.5 V ........ 6
Typical Characteristics .............................................. 6
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
8.1
8.2
8.3
8.4
9
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
8
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application ................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Example .................................................... 11
12 Device and Documentation Support ................. 12
12.1
12.2
12.3
12.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
13 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Original (April 2009) to Revision A
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Removed Ordering Information table ..................................................................................................................................... 1
2
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SCLS712A – MARCH 2009 – REVISED JUNE 2015
5 Pin Configuration and Functions
N or PW Package
20-Pin PDIP or TSSOP
(Top View)
N.C.
D1
D2
D3
D4
D5
D6
D7
D8
N.C.
1
20
VCC
2
19
3
18
Y1
Y2
Y3
Y4
Y5
Y6
Y7
Y8
GND
4
17
5
16
6
15
7
14
8
13
9
12
10
11
N.C. – Not internally connected
Pin Functions
PIN
NAME
N.C.
NO.
1
10
D1
2
D2
3
D3
4
D4
5
D5
6
D6
7
D7
8
I/O
—
DESCRIPTION
No Connection
I
Input control to the current sink driver
O
Output to load
Ground
D8
9
Y1
19
Y2
18
Y3
17
Y4
16
Y5
15
Y6
14
Y7
13
Y8
12
GND
11
—
VCC
20
I
Supply voltage
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Supply voltage
D
Input voltage
Vds
Output voltage
H output
Ids
Output current
1 bit for output low
IIK
Input clamp current
VI < 0 V
Tstg
(1)
MIN
MAX
UNIT
–0.5
7
V
–0.5
7
V
–0.5
32
V
200
mA
–20
mA
Operating free-air temperature
–40
85
°C
Storage temperature
–65
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±100
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
VCC = 3 V to 5.5 V
MIN
MAX
3
5.5
V
High-level input voltage
VCC × 0.7
VCC
V
VIL
Low-level input voltage
0
VCC × 0.3
V
Vds
Output voltage
30
V
VCC
Supply voltage
VIH
N package
Ids
Output current
PW package
TA
Duty cycle < 42%
200
Duty cycle < 100%
130
Duty cycle < 24%
200
Duty cycle < 100%
95
Operating free-air temperature
–40
85
UNIT
mA
°C
6.4 Thermal Information
TLC59211
THERMAL METRIC (1)
N (PDIP)
PW (TSSOP)
20 PINS
20 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
54.4
94.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
46.6
28.3
°C/W
RθJB
Junction-to-board thermal resistance
35.4
45.7
°C/W
ψJT
Junction-to-top characterization parameter
23.0
1.6
°C/W
ψJB
Junction-to-board characterization parameter
35.3
45.1
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
—
—
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics VCC = 3 V to 3.6 V
over recommended operating free-air temperature range, VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
Vt+
Positive-going input threshold
D
Vt–
Negative-going input threshold
D
0.9
Vt
Hysteresis
D
0.33
IIH
High-level input current
VCC = 3.6 V, VI = 3.6V
IIL
Low-level input current
VCC = 3.6 V, VI = 0 V
IOZ
Leakage current
Vds= 30 V
Ioff
Leakage current
VI = 0 to 3.6 V, VO = 0 to 30 V, VCC = 0
ICC
Supply current
VI = 0 to 3.6 V, VCC = 3.6 V
VOL
Low-level output voltage
rON
Ci
TYP
MAX
UNIT
2.52
V
V
1.32
V
0
1
μA
0
–1
μA
5
μA
0
5
μA
Output = all OFF
0
5
Output = all ON
0
5
VCC = 3 V, IOL = 100 mA
0.35
0.7
ON-state resistance
VCC = 3 V, IO = 100 mA
3.5
7
Input capacitance
VI = VCC or GND
5
μA
V
V
Ω
pF
6.6 Electrical Characteristics VCC = 4.5 V to 5.5 V
over recommended operating free-air temperature range, VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
3.5
UNIT
Vt+
Positive-going input threshold
D, CLR, CLK
Vt–
Negative-going input threshold
D, CLR, CLK
1.5
V
Vt
Hysteresis
D, CLR, CLK
0.5
2
V
IIH
High-level input current
VCC = 5.5 V, VI = 5.5 V
0
1
μA
IIL
Low-level input current
VCC = 5.5 V, VI = 0 V
0
–1
μA
IOZ
Leakage current
Vds= 30 V
5
μA
Ioff
Leakage current
VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0
μA
V
0
5
Output = all OFF
0
5
Output = all ON
0
5
VCC = 4.5 V, IO = 100 mA
0.2
0.35
VCC = 4.5 V, IO = 200 mA
0.5
0.7
V
3.5
Ω
ICC
Supply current
VI = 0 to 5 V, VO = 0 to 30 V, VCC = 0
VOL
Low-level output voltage
rON
ON-state resistance
VCC = 4.5 V, IO = 100 mA
2
Ci
Input capacitance
VI = VCC or GND
5
μA
V
pF
6.7 Switching Characteristics VCC = 3 V to 3.6 V
over operating free-air temperature range, VCC = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
LOAD
CAPACITANCE
TA = 25°C
MIN
TA = –40°C to 85°C
TYP
MAX
MIN
MAX
UNIT
tTLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
200
450
450
ns
tTHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
300
450
480
ns
tPLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
450
650
800
ns
tPHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
450
650
800
ns
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6.8 Switching Characteristics VCC = 4.5 V to 5.5 V
over operating free-air temperature range, VCC = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
LOAD
CAPACITANCE
TA = 25°C
MIN
TA = –40°C to 85°C
TYP
MAX
MIN
MAX
UNIT
tTLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
180
220
260
ns
tTHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
290
430
460
ns
tPLH
Output = low to high
CL = 30 pF, RL = 240 Ω,
24-V pullup
320
470
510
ns
tPHL
Output = high to low
CL = 30 pF, RL = 240 Ω,
24-V pullup
320
470
510
ns
6.9 Typical Characteristics
N = 1–3
200
Maximum Output Current, Ids (mA)
N=4
N=5
160
N=6
N=7
120
N=8
80
TA = 85°C
N = Number of outputs
conducting
simultaneously
40
0
0
10
20
30
40 50 60
Duty Cycle (%)
70
80
90
100
Figure 1. Maximum Output Currents vs Duty Cycle in PDIP (N) Package
6
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7 Parameter Measurement Information
24 V
RL = 240 Ω
Test
Y
CL= 30 pF
LOAD CIRCUIT
FOR O/D OUTPUT
5V
50%
D
50%
tPHL
GND
tPLH
90%
VCC
90%
50%
10%
tTHL
50%
10%
Y
GND
tTLH
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns,
and tf ≤ 3 ns.
C.
The outputs are measured one at a time with one transition per measurement.
D.
tPLH and tPHL are the same as tpd.
Figure 2. Test Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
The TLC59211 is an 8-bit parallel LED and solenoid driver designed for 5-V VCC operation. Each channel is
individually controlled by its input.
8.2 Functional Block Diagram
Y
D
GND
8.3 Feature Description
Each of the 8 channels is controlled by its input Dn. When Dn is logic high, the current sink is enabled, output is
low. When Dn is logic low, the current sink is disabled, output is pulled high.
Y1
Y2
19
2
3
D1
(1)
Y3
18
D2
Y4
17
4
Y5
16
5
D3
D4
Y6
15
6
D5
Y7
14
Y8
13
7
8
D6
D7
12
9
11
D8 GND
This symbol is in accordance with ANSI/IEEE Standard 91-1984 and IEC Publication 617-12.
Figure 3. Logic Symbol
8.4 Device Functional Modes
Table 1 lists the functional modes of the TLC59211.
Table 1. Function Table (Each Latch) (1)
INPUTS
(1)
8
OUTPUT
D
Y
L
H*
H
L
L: Low-level
H: High-level
H*: with pullup resistor
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
In LED display application, TLC59211 is used to drive the current sink for 8 LEDs in parallel. LED display pattern
can be created by providing different bit pattern. LED can be duty cycled by either duty cycling the LED supply or
the control bit.
9.2 Typical Application
VLED
8-Bit Sink Current Driver
TLC59211
Character
Generator Circuit
and
LED Power Circuit
SRCLR
RCLK
SRCLK
SER
8-Bit Shift Register
SN74LV595A
SN74LV164A
SN74LV165A
Figure 4. LED Display Implementation With TLC59211
9.2.1 Design Requirements
For LED display application, an 8-bit shift register is used to provide the input control for TLS59211. A character
generator circuit and LED power circuit is used to generate the bit pattern written into the shift register and
provide the power control for the entire LED array. The LED power circuit controls the total current into the array
and can also power cycle the LED array. For simple implementation, LED power circuit could be eliminated. The
VLED can be connected directly to the resistor and LED string.
9.2.2 Detailed Design Procedure
The combination of LED and resistor sets the current of the LED.
VR + VL = VLED, I = (VLED - VL)/R
(1)
The maximum current through each channel of TLC59211 is determined by the number of the LEDs that are on
and the duty cycle according to Figure 5 for TSSOP package.
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Typical Application (continued)
9.2.3 Application Curve
N=1
200
N=2
N=3
Maximum Output Current, Ids (mA)
N=4
160
N=8
120
N=7
N=6
N=5
80
TA = 85°C
N = Number of outputs
conducting
simultaneously
40
0
0
10
20
30
40 50 60
Duty Cycle (%)
70
80
90
100
Figure 5. Maximum Output Currents vs Duty Cycle in TSSOP (PW) Package
10 Power Supply Recommendations
The supply voltage to TLC59211 is from 3.3 V to 5.5 V. The voltage at output can be up to 30 V.
11 Layout
11.1 Layout Guidelines
The traces that carry current from the LED cathodes to the OUTx pins must be wide enough to support the
current (up to 200 mA).
10
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11.2 Layout Example
VCC
N.C.
D1
Y1
To register
D2
Y2
To register
D3
Y3
To register
D4
Y4
To register
D5
Y5
To register
D6
Y6
To register
D7
Y7
To register
D8
Y8
VLED
To register
VCC
N.C.
GND
VIA to GND
Figure 6. Layout Example Recommendation
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TLC59211IN
ACTIVE
PDIP
N
20
20
RoHS &
Non-Green
NIPDAU
N / A for Pkg Type
-40 to 85
TLC59211IN
TLC59211IPWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 85
Y59211
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
