TLC5951TDA2

TLC5951-DIE www.ti.com SBVS210 – OCTOBER 2012 24-CHANNEL, 12-BIT PWM LED DRIVER WITH 7-BIT DOT CORRECTION AND 3-GROUP, 8-BIT GLOBAL BRIGHTNESS CONTROL FEATURES 1 • • • • • • • • • • • 24-Channel Constant-Current Sink Output Current Capability Selectable Grayscale (GS) Control With PWM: 12-Bit (4096 Step), 10-Bit (1024 Step), 8-Bit (256 Step) Three Independent Grayscale Clocks for Three Color Groups Dot Correction (DC): 7-Bit (128 Step) Global Brightness Control (BC) for Each Color Group: 8-Bit (256 Step) Auto Display Repeat Function Independent Data Port for GS, BC and DC Data Communication Path Between Each Data Port LED Power-Supply Voltage VCC = 3.0 V to 5.5 V • • • • • • • • Constant-Current Accuracy: – Channel-to-Channel – Device-to-Device CMOS Logic Level I/O Data Transfer Rate Grayscale Control Clock Continuous Base LED Open Detection (LOD) Continuous Base LED Short Detection (LSD) Thermal Shutdown (TSD) With Auto Restart Grouped Delay to Prevent Inrush Current APPLICATIONS • • Full-Color LED Displays LED Signboards DESCRIPTION The TLC5951 is a 24-channel, constant-current sink driver. Each channel has an individually-adjustable, 4096step, pulse width modulation (PWM) grayscale (GS) brightness control and 128 step constant-current dot correction (DC). The dot correction adjusts brightness deviation between channels and other LED drivers. The output channels are grouped into three groups of eight channels. Each channel group has a 256-step global brightness control (BC) function and an individual grayscale clock input. GS, DC, and BC data are accessible via a serial interface port. DC and BC can be programmed via a dedicated serial interface port. The TLC5951 has three error detection circuits for LED open detection (LOD), LED short detection (LSD), and thermal error flag (TEF). LOD detects a broken or disconnected LED while LSD detects a shorted LED. TEF indicates an over-temperature condition. ORDERING INFORMATION (1) (1) (2) PRODUCT PACKAGE DESIGNATOR PACKAGE TLC5951 TD Bare die in waffle pack (2) ORDERABLE PART NUMBER PACKAGE QUANTITY TLC5951TDA2 10 TLC5951TDA3 96 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TLC5951-DIE SBVS210 – OCTOBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. BARE DIE INFORMATION 2 DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS 11 mils. Silicon with backgrind Floating TiW-AlCu (0.5%) 900 nm Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TLC5951-DIE www.ti.com SBVS210 – OCTOBER 2012 Table 1. Bond Pad Coordinates in Microns (1) (1) DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX GSSIN 1 550.35 3842.64 634.41 3926.7 GSSCK 2 396.99 3842.64 481.05 3926.7 GSLAT 3 243.63 3842.64 327.69 3926.7 GSCKG 4 105.3 3704.31 189.36 3788.37 GSCKR 5 105.3 3565.17 189.36 3649.23 GSCKB 6 105.3 3392.55 189.36 3476.61 OUTG0 7 54 2531.43 138.06 2615.49 OUTR0 8 54 2312.91 138.06 2396.97 OUTB0 9 54 2094.39 138.06 2178.45 OUTG1 10 54 1875.87 138.06 1959.93 OUTR1 11 54 1657.35 138.06 1741.41 OUTB1 12 54 1438.83 138.06 1522.89 OUTG2 13 54 1220.31 138.06 1304.37 OUTR2 14 54 1001.79 138.06 1085.85 OUTB2 15 96.03 783.27 180.09 867.33 OUTG3 16 138.06 564.75 222.12 648.81 OUTR3 17 180.09 346.23 264.15 430.29 OUTB3 18 264.15 127.71 348.21 211.77 GSSOUT 19 1016.46 51.3 1100.52 135.36 DCSOUT 20 1509.48 51.3 1593.54 135.36 OUTB4 21 2261.79 127.71 2345.85 211.77 OUTR4 22 2345.85 346.23 2429.91 430.29 OUTG4 23 2387.88 564.75 2471.94 648.81 OUTB5 24 2429.91 783.27 2513.97 867.33 OUTR5 25 2471.94 1001.79 2556 1085.85 OUTG5 26 2471.94 1220.31 2556 1304.37 OUTB6 27 2471.94 1438.83 2556 1522.89 OUTR6 28 2471.94 1657.35 2556 1741.41 OUTG6 29 2471.94 1875.87 2556 1959.93 OUTB7 30 2471.94 2094.39 2556 2178.45 OUTR7 31 2471.94 2312.91 2556 2396.97 OUTG7 32 2471.94 2531.43 2556 2615.49 GND 33 2474.64 3152.43 2558.7 3236.49 GND 34 2474.64 3314.34 2558.7 3398.4 GND 35 2474.64 3510 2558.7 3594.06 IREF 36 2258.37 3842.64 2342.43 3926.7 VCC 37 2055.42 3842.64 2139.48 3926.7 XBLNK 38 1692 3842.64 1776.06 3926.7 DCSCK 39 1499.31 3842.64 1583.37 3926.7 DCSIN 40 1326.69 3842.64 1410.75 3926.7 Substrate VDD. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 PACKAGE OPTION ADDENDUM www.ti.com 13-May-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) TLC5951TDA2 ACTIVE 0 10 RoHS & Green Call TI N / A for Pkg Type TLC5951TDA3 ACTIVE 0 96 RoHS & Green Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of