TLK4250IGPV

        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 D Hot Plug Protection D Quad 1.0 to 2.5 Gigabits Per Second (Gbps) Serializer/Deserializer D Independent Channel Operation D 2.5-V Power Supply for Low Power D D D D Operation Selectable Signal Preemphasis for Serial Output Interfaces to Backplane, Copper Cables, or Optical Converters Lock Indication and Sync Mode for Fast Initialization 18-Bit Parallel Buses for Flexible Interface Applications D On-Chip PLL Provides Clock Synthesis D D D D D D From Low-Speed Reference Receiver Differential Input Thresholds 200 mV Min Rated for Industrial Temperature Range Typical Power: 1700 mW at 2.5 Gbps Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link Internal Passive Receive Equalization Small Footprint 19 mm x 19 mm, 289-Ball PBGA Package description The TLK4250 device is a four-channel, multi-gigabit transceiver used in high-speed bidirectional point-to-point data transmission systems. The four channels in the transceiver are configured as four separate links. The transceiver supports an effective serial interface speed of 1.0 Gbps to 2.5 Gbps per channel, providing up to 2.25 Gbps of data bandwidth per channel. The primary application of the transceiver is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 Ω. The transmission media can be a printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer depend on the attenuation characteristics of the media and the noise coupling to the environment. The transceiver can also replace parallel data transmission architectures by providing a reduction in the number of traces, connector pins, and transmit/receive pins. Parallel data loaded into the transmitter is delivered to the receiver over a serial channel, which can be a coaxial copper cable, a controlled impedance backplane, or an optical link. The data is then reconstructed into its original parallel format. It offers significant power and cost savings over current solutions, as well as scalability for higher data rate in the future. The transceiver performs the data parallel-to-serial and serial-to-parallel conversions. The clock extraction functions as a physical layer interface device. The serial transceiver interface operates at a maximum data rate of 2.5 Gbps. Each transmitter latches 18-bit parallel data at a rate based on the supplied reference clock (GTx_CLK). The 18-bit parallel data is internally encoded into 20 bits by framing the 18-bit data with start and stop bits. The resulting 20-bit frame is then transmitted differentially at 20 times the reference clock (GTx_CLK) rate. The receiver section performs the serial-to-parallel conversion on the input data, synchronizing the resulting 20-bit wide parallel data to the recovered clock (Rx_CLK). It then extracts the 18 bits of data from the 20-bit wide data resulting in 18 bits of parallel data at the receive data terminals (RDx[0:17]). This results in an effective data payload of 0.9 Gbps to 2.25 Gbps (18 bits data x GTx_CLK frequency) per channel. The transceiver provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer, allowing the protocol device a functional self-check of the physical interface. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright  2004 − 2007, Texas Instruments Incorporated  
 
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  SWRS025C − APRIL 2004 − REVISED JULY 2007 The transceiver is designed to be hot plug capable. An on-chip power-on reset circuit holds the Rx_CLK low during power up. This circuit also places the parallel side output signal terminals, DOUTTxP and DOUTTxN, into a high-impedance state during power up. The transceiver uses a 2.5-V supply. The I/O section is 3-V compatible. With the 2.5-V supply, the transceiver is power efficient, consuming less than 1700 mW typically. The transceiver is characterized for operation from −40°C to 85°C. AVAILABLE OPTIONS PACKAGE TA −40°C to 85°C PLASTIC BALL GRID ARRAY (PBGA) SYMBOL TLK4250IGPV TLK4250IZPV ECAT NOTE: For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 2 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 17 A B TDB1 TDB0 C D E DOUTTB DOUTTB PREEMP P N HB F G H J K DINRBP DINRBN RDB0 GND TDC0 L M N DOUTTC DOUTTC PREEMP P N HC P R T U DINRCP DINRCN RDC0 RDC1 17 16 TDB4 TDB2 GNDA GNDA VDDAB GNDA GNDA RDB1 VDD TDC1 GNDA GNDA VDDAC GNDA GNDA RDC2 RDC4 16 15 TDB5 TDB3 GND RDB3 VDDAB RDB2 GND VDD GND VDD GND TDC2 VDDAC VDD GND RDC3 RDC5 15 14 TDB7 TDB6 VDD RB_CLK RDB7 RDB4 RDB5 RDB6 GND TDC5 TDC6 TDC7 TDC4 TDC3 GND RDC6 RDC7 14 13 TDB8 GND RDB17 RDB13 RDB10 RDB9 RDB8 VDD TDC9 TDC10 TDC11 TDC14 VDD RDC8 RC_CLK 13 TDC12 TDC13 TDC16 GND RDC10 RDC9 12 GND RDC13 RDC11 11 GTB_ GTC_ CLK CLK LOOPEN 12 TDB9 TDB10 VDD SYNCB RDB16 RDB14 RDB12 RDB11 VDD TDC8 C TESTEN 11 TDB11 TDB13 GND VDD LOCKBB RDB15 GND GND GND GND GND TDC15 VDD C 10 TDB12 GND LOOPEN ENABLE TESTEN B B B TDB17 GND VDD TDB15 GND GND GND GND GND GND GND GND GND GND TDC17 SYNCC RDC17 RDC14 GND RDC12 10 LOCKBC GND RDC16 RDC15 VDD 9 TDD5 TDD1 TDD0 8 GND GNDA ENABLE 9 TDB14 TDB16 GND C 8 GTD_ RDA0 RDA1 VDD RDA6 RDA8 RDA11 GND GND GND GND GND TDD8 VDD CLK DOUTTD 7 DINRAN GNDA GND RDA5 RDA9 RDA12 GND GND GND GND GND TDD12 TDD9 TDD6 7 P 6 DINRAP GNDA RDA2 RDA4 RDA10 RDA14 PREEMP VDDAA 5 VDDAA RDA7 RDA13 ENABLE A D DOUTTD TDD17 LOCKB ENABLE A A TDD15 GNDA RDA3 RA_CLK RDA17 SYNCA SYNCD VDD TDD2 GNDA 6 TDD16 TDD11 TDD4 VDDAD 5 VDDAD LOOPEN RDD17 LOCKBD TDD14 TDD3 VDD GNDA DINRDP 4 VDD GND GND GNDA DINRDN 3 D A DOUTTA 3 TDD7 HD TDA17 VDD N TDD10 N LOOPEN DOUTTA TDD13 PREEMP GND RDA16 HA 4 TESTEN RDA15 TESTEN GNDA GND VDD GND VDD GND TDA15 RDD16 RDD15 GND P D GTA_ 2 TDA0 TDA2 TDA3 TDA6 TDA10 TDA13 GND TDA16 RDD14 RDD13 RDD10 RDD8 RDD6 RDD3 RDD2 RDD0 2 1 CLK 1 TDA1 TDA4 TDA5 TDA7 TDA8 TDA9 TDA11 TDA12 TDA14 RDD12 RDD11 RDD9 RD_CLK RDD7 RDD5 RDD4 RDD1 A B C D E F G H J K L M N P R T U WWW.TI.COM 3 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 functional block diagram A detailed block diagram of each channel is shown below. Channels A, B, C, and D are identical and are configured as four separate links. LOOPENx DOUTTxP 18-Bit Register TDx[0:17] DOUTTxN 18 Start/Stop Encoder 20 Parallel to Serial Bit Clock PREEMPHx Multiplying Clock Synthesizer GTx_CLK Controls: PLL, Bias, Rx, Tx TESTENx ENABLEx Bit Clock Interpolator and Clock Recovery MUX Recovered Clock LOCKBx RDx[0:17] 18-Bit Register Rx_CLK 18 Start/Stop Decoder 20 Serial to Parallel MUX DINRxP DINRxN 4 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 Terminal Functions TERMINAL NAME NO. DINRAP DINRAN A6 A7 DINRBP DINRBN F17 G17 DINRCP DINRCN P17 R17 DINRDP DINRDN U4 U3 DOUTTAP DOUTTAN A3 A4 DOUTTBP DOUTTBN C17 D17 DOUTTCP DOUTTCN L17 M17 DOUTTDP DOUTTDN U7 U6 ENABLEA H5 ENABLEB E10 ENABLEC M9 ENABLED J6 GTA_CLK E2 GTB_CLK B13 GTC_CLK K13 GTD_CLK P8 SYNCA F4 SYNCB D12 SYNCC N10 SYNCD K5 LOOPENA H4 LOOPENB D10 LOOPENC P12 LOOPEND M4 LOCKBA G5 LOCKBB E11 LOCKBC N9 LOCKBD L4 PREEMPHA A5 PREEMPHB E17 PREEMPHC N17 PREEMPHD U5 TYPE Input DESCRIPTION Serial receive inputs. DINRxP and DINRxN together are the differential serial inputs that interface from a copper or an optical I/F module. Output (high-z power up) Serial transmit outputs. DOUTTxP and DOUTTxN are differential serial outputs that interface to copper or an optical I/F module. These terminals transmit NRZ data at a rate of 20 times the GTx_CLK value. DOUTTxP and DOUTTxN are put in a high-impedance state when LOOPENx is high and are active when LOOPENx is low. During power-on reset these terminals are high impedance. Input (w/pullup) Device enable. When this terminal is held low, the device is placed in power-down mode. When asserted high while the device is in power-down mode, the transceiver goes into power-on reset before beginning normal operation. Input Reference clock. GTx_CLK is a continuous external input clock that synchronizes the transmitter interface TDx. The frequency range of GTx_CLK is 50 MHz to 125 MHz. The transmitter uses the rising edge of this clock to register the 18-bit input data (TDx) for serialization. Input (w/pulldown) Fast synchronization. When asserted high, the transmitter substitutes the 18-bit pattern 111111111000000000 so that when the start/stop bits are framed around the data, the receiver can immediately detect the proper deserialization boundary. This is typically used during initialization of the serial link. Input (w/pulldown) Loop enable. When LOOPENx is active high, the internal loop-back path is activated. The transmitted serial data is directly routed internally to the inputs of the receiver. This provides a self-test capability with the protocol device. The DOUTTxP and DOUTTxN outputs are held in a high-impedance state during the loop-back test. LOOPENx is held low during standard operational state with external serial outputs and inputs active. Output Receiver lock. When this signal is asserted low, it indicates that the receiver has acquired bit synchronization on the data stream and has located the start/stop bits so that the deserialized data presented on the parallel receive bus is properly received. Input Preemphasis. When asserted, the serial transmit outputs have extra output swings on the first bit of any run length of save value bits. If the run length of output bits is one, then that bit has larger output swings. WWW.TI.COM 5 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 Terminal Functions (Continued) TERMINAL NAME NO. RDA[0:17] A8, B8, C6, C4, D6, D7, D8, D5, E8, E7, E6, F8, F7, E5, F6, G6, F5, E4 RDB[0:17] H17, H16, F15, D15, F14, G14, H14, E14, H13, G13, F13, H12, G12, E13, F12, F11, E12, D13 RDC[0:17] T17, U17, T16, T15, U16, U15, T14, U14, T13, U12, T12, U11, U10, T11, R10, T9, R9, P10 RDD[0:17] U2, U1, T2, R2, T1, R1, P2, P1, N2, M1, M2, L1, K1, L2, K2, K3, J3, K4 RA_CLK D4 RB_CLK D14 RC_CLK U13 RD_CLK N1 TDA[0:17] A2, A1, B2, C2, B1, C1, D2, D1, E1, F1, F2, G1, H1, G2, J1, H3, J2, J4 TDB[0:17] B17, A17, B16, B15, A16, A15, B14, A14, A13, A12, B12, A11, A10, B11, A9, C10, B9, D9 TDC[0:17] K17, K16, M15, P14, N14, K14, L14, M14, K12, L13, M13, N13, L12, M12, P13, M11, N12, M10 TDD[0:17] U8, T8, R6, P4, P5, R8, P7, P6, M8, N7, N6, N5, M7, M6, N4, L6, M5, K6 TESTENA H6 TESTENB F10 TESTENC P11 TESTEND M3 TYPE DESCRIPTION Output (hi-z on power up) Receive data bus. These outputs carry 18-bit parallel data output from the transceiver to the protocol device, synchronized to Rx_CLK. The data is valid on the rising edge of Rx_CLK as shown in Figure 7. These terminals are high-impedance during power-on reset. Output (low on power up) Recovered clock. Output clock that is synchronized to RDx. Rx_CLK is the recovered serial data rate clock divided by 20. Rx_CLK is held low during power-on reset. Input Transmit data bus. These inputs carry the 18-bit parallel data output from a protocol device to the transceiver for encoding, serialization, and transmission. This 18-bit parallel data is clocked into the transceiver on the rising edge of GTx_CLK as shown in Figure 6. Input (w/pulldown) Test mode enable. This terminal must be left unconnected or tied low. POWER VDD VDDAA 6 C8, C12, C14, D3, D11, F3, F9, G4, H15, J12, J13, J16, K15, L5, N3, N8, N11, P15, R4, R13, U9 Supply Digital logic power. Provides power for all digital circuitry and digital I/O buffers. Supply Analog power. VDDAx provides a supply reference for the high-speed receiver and transmitter analog circuits. B5, C5 VDDAB E15, E16 VDDAC N15, N16 VDDAD R5, T5 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 Terminal Functions (Continued) TERMINAL NAME TYPE NO. DESCRIPTION GROUND GNDA GND B3, B4, B6, B7, C16, D16, F16, G16, L16, M16, P16, R16, T3, T4, T6, T7 Ground Analog ground. GNDA provides a ground reference for the high-speed receiver and transmitter analog circuits. B10, C3, C7, C9, C11, C13, C15, E3, E9, G3, G7, G8, G9, G10, G11, G15, H2, H7, H8, H9, H10, H11, J5, J7, J8, J9, J10, J11, J14, J15, J17, K7, K8, K9, K10, K11, L3, L7, L8, L9, L10, L11, L15, P3, P9, R3, R7, R11, R12, R14, R15, T10 Ground Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers. transmit interface The transmitter portion registers valid incoming 18-bit-wide data (TDx[0:17]) on the rising edge of GTx_CLK. The data is then framed with start and stop bits, serialized, and transmitted sequentially over the differential high-speed I/O channel. The clock multiplier multiplies the reference clock (GTx_CLK) by a factor of 10, creating a bit clock. This internal bit clock is fed to the parallel-to-serial shift register, which transmits data on both the rising and falling edges of the bit clock providing a serial data rate that is 20 times the reference clock. Data is transmitted LSB (TDx0) first. transmit data bus The transmit bus interface accepts 18-bit-wide, single-ended, TTL parallel data at the TDx[0:17] terminals. Data is valid on the rising edge of GTx_CLK. The GTx_CLK is used as the word clock. The data and clock signals must be properly aligned as shown in Figure 1. Detailed timing information can be found in the TTL input electrical characteristics table. GTx_CLK TDXn tsu th Figure 1. Transmit Timing Waveform transmission latency The data transmission latency of the transceiver is defined as the delay from the initial 18-bit word on the parallel transmit interface to the serial transmission of the start bit of the 20-bit frame containing the 18-bit word. The transmit latency is fixed once the link is established. However, due to silicon process variations and implementation variables, such as supply voltage and temperature, the exact delay varies slightly. Figure 2 illustrates the timing relationship between the transmit data bus, GTx_CLK, and the serial transmit terminals. WWW.TI.COM 7 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 Transmitted 20-Bit Frame DOUTTxP, DOUTTxN td(Tx latency) TDx[0:17] 18-Bit Word to Transmit GTx_CLK Figure 2. Transmitter Latency start/stop framing logic All true serial interfaces require a method of encoding to ensure minimum transition density so that the receiving PLL has a minimal number of transitions in which to stay locked onto the data stream. The signal encoding also provides a mechanism for the receiver to identify the word boundary for correct deserialization. The TLK4250 transceiver wraps a start bit (1) and a stop bit (0) around the 18-bit data payload as shown in Figure 3. This is transparent to the user, as the transceiver internally adds the framing bits to the data such that the user reads and writes actual 18-bit data. 20-Bit Frame 18-Bit Word Stop Bit Start Bit TDx0 TDx1 ... TDx16 TDx17 Stop Bit Start Bit Figure 3. Serial Output Data Stream With Start and Stop Bit parallel-to-serial The parallel-to-serial shift register takes in the 20-bit-wide frame multiplexed from the framing logic and converts it to a serial stream. The shift register is clocked on both the rising and falling edges of the internally generated bit clock, which is 10 times the GTx_CLK input frequency. The LSB (TDx0) is first out after the start bit as shown in Figure 3. high-speed data output The high-speed data output driver consists of a PECL-compatible differential pair that can be optimized for a particular transmission line impedance and length. The line can be directly coupled or ac coupled. See Figure 10 and Figure 11 for termination details. No external pullup or pulldown resistors are required. The transceiver provides a selectable signal preemphasis option for driving lossy media. When signal preemphasis is enabled, the first bit of a run length of same-value bits (e.g., 111...) is driven to a larger output swing, which precompensates for signal inter-symbol interference (ISI) in lossy media, such as copper cables or printed circuit board traces. 8 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 receive interface The receiver portion of the TLK4250 accepts 20-bit framed differential serial data. The interpolator and clock recovery circuit locks to the data stream and extracts the bit rate clock. This recovered clock retimes the input data stream. The serial data is then aligned to the 20-bit frame by finding the start and stop bits and the 18-bit data is output on a 18-bit wide parallel bus synchronized to the extracted receive clock (Rx_CLK). receive data bus The receive bus interface drives 18-bit-wide, single-ended, TTL parallel data at the RDx[0:17] terminals. Data is valid on the rising edge of Rx_CLK. The Rx_CLK is used as the recovered word clock. The data and clock signals are aligned as shown in Figure 4. Detailed timing information can be found in the TTL output switching characteristics table. Rx_CLK RDx[0:17] tsu th Figure 4. Receive Timing Waveform data reception latency The serial-to-parallel data receive latency is the time from when the start bit arrives at the receiver until the output of the aligned parallel word. The receive latency is fixed once the link is established. However, due to silicon process variations and implementation variables, such as supply voltage and temperature, the exact delay varies slightly. Figure 5 illustrates the timing relationship between the serial receive terminals, the recovered word clock (Rx_CLK), and the receive data bus. 20-Bit Encoded Frame DINTxP, DINTxN R(latency) RDx[0:17] 18-Bit Decoded Word Rx_CLK Figure 5. Receiver Latency serial-to-parallel Serial data is received on the DINRxP and DINRxN terminals. The interpolator and clock recovery circuit locks to the data stream if the clock to be recovered is within ±100 PPM of the internally generated bit rate clock. The recovered clock retimes the input data stream. The serial data is then clocked into the serial-to-parallel shift registers. WWW.TI.COM 9 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 synchronization mode The deserializer must synchronize to the serializer in order to receive valid data. Synchronization can be accomplished in one of two ways. rapid synchronization The serializer has the capability to send specific SYNC patterns consisting of 9 ones and 9 zeros, switching at the input clock rate. The transmission of SYNC patterns enables the deserializer to lock to the serializer signal within a deterministic time frame. The transmission of SYNC patterns is selected via the SYNC input on the serializer. On receiving a valid SYNC pulse (wider than 6 clock cycles), 1026 cycles of SYNC pattern are sent. When the deserializer detects edge transitions at the serial input, it attempts to lock to the embedded clock information. The deserializer LOCKBx output remains inactive while its clock/data recovery (CDR) locks to the incoming data or SYNC patterns present on the serial input. When the deserializer locks to the serial data, the LOCKBx output goes active. When LOCKBx is active, the deserializer outputs represent incoming serial data. One approach is to tie the deserializer LOCKBx output directly to the SYNCx input of the transmitter. This ensures that enough SYNC patterns are sent to achieve deserializer lock. random lock synchronization The deserializer can attain lock to a data stream without requiring the serializer to send special SYNC patterns. This allows the transceiver to operate in open-loop applications. Equally important is the deserializer’s ability to support hot insertion into a running backplane. In the open-loop or hot-insertion case, it is assumed the data stream is essentially random. Therefore, because lock time varies due to data stream characteristics, the exact lock time cannot be predicted. The primary constraint on the random lock time is the initial phase relation between the incoming data and the GTx_CLK when the deserializer powers up. The data contained in the data stream can also affect lock time. If a specific pattern is repetitive, the deserializer could enter false lock—falsely recognizing the data pattern as the start/stop bits. This is referred to as repetitive multitransition (RMT). This occurs when more than one low-high transition takes place per clock cycle over multiple clock cycles. In the worst case, the deserializer could become locked to the data pattern rather than the clock. Circuitry within the deserializer can detect that the possibility of false lock exists. On detection, the circuitry prevents the LOCKBx from becoming active until the potential false-lock pattern changes. Notice that the RMT pattern only affects the deserializer lock time, and once the deserializer is in lock, the RMT pattern does not affect the deserializer state as long as the same data boundary happens each cycle. The deserializer does not go into lock until it finds a unique data boundary that consists of four consecutive cycles of data boundary (start/stop bits) at the same position. The deserializer stays in lock until it cannot detect the same data boundary (start/stop bits) for four consecutive cycles. Then the deserializer goes out of lock and hunts for the new data boundary (start/stop bits). In the event of loss of synchronization, the LOCKBx terminal output goes inactive and the outputs (including Rx_CLK) enter a high-impedance state. The user’s system must monitor the LOCKBx terminal in order to detect a loss of synchronization. On detection of loss of lock, sending SYNC patterns for resynchronization is desirable if reestablishing lock within a specific time is critical. However, the deserializer can lock to random data as previously noted. LOCKBx is held inactive for at least nine cycles after loss of lock is detected. recommended power-up sequence When powering up the device, it is recommended to first set the ENABLEx terminal low. Set the ENABLEx terminal to high once sufficient time has passed to allow the power supply to stabilize. power-down mode When the ENABLEx terminal is deasserted low, the transceiver goes into a power-down mode. In the power-down mode, the serial transmit terminals (DOUTTxP, DOUTTxN) and the receive data bus terminals (RDx[0:17]) go into a high-impedance state. 10 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 reference clock input The reference clock (GTx_CLK) is an external input clock that synchronizes the transmitter interface. The reference clock is then multiplied in frequency 10 times to produce the internal serialization bit clock. The internal serialization bit clock is frequency locked to the reference clock and clocks out the serial transmit data on both its rising and falling edges, providing a serial data rate that is 20 times the reference clock. The receiver tracking logic uses clock phases from the internal PLL as it aligns the recovered clock phase with the incoming serial data stream; therefore, the input reference clock (GTX_CLK) is needed even if the transmit function of the TLK4250 is not being used. The receiver function has the ability to track an incoming serial data stream that is within ±200 ppm of the data rate that is set by GTX_CLK. This allows the use of clock sources with ±100 ppm frequency tolerance. operating frequency range The transceiver may operate at a serial data rate between 1.0 Gbps to 2.5 Gbps. GTx_CLK must be within ±100 PPM of the desired parallel data rate clock. Each individual channel may operate at a different rate. testability The transceiver has a comprehensive suite of built-in self-tests. The loopback function provides for at-speed testing of the transmit/receive portions of the circuitry. The ENABLEx terminal allows for all circuitry to be disabled so that a quiescent current test can be performed. loop-back testing The transceiver can provide a self-test function by enabling (LOOPENx) the internal loop-back path. Enabling this terminal causes serial transmitted data to be routed internally to the receiver. The parallel data output can be compared to the parallel input data for functional verification. (The external differential output is held in a high-impedance state during the loop-back testing.) power-on reset On application of minimum valid power, the transceiver generates a power-on reset. During the power-on reset, the RDx terminals are 3-stated and Rx_CLK is held low. The length of the power-on reset cycle depends on the GTx_CLK frequency, but is less than 1 ms in duration. WWW.TI.COM 11 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V Voltage range at TDx, ENABLEx, GTx_CLK, LOOPENx, SYNCx, PREEMPHx . . . . . . . . . . . . . . . . −0.3 V to 4 V Voltage range at any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Package power dissipation, PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM: 2 kV Characterized free-air operating temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground. Air Flow 0 m/s 0.5 m/s 1 m/s 2.5 m/s TJA (C/W) 18.4 16.92 15.95 14.7 electrical characteristics over recommended operating conditions PARAMETER VDD TA ICC PD TEST CONDITION Supply voltage Operating free-air temperature Supply current MIN TYP MAX 2.3 2.5 2.7 V 85 °C −40 VDD = 2.5 V, Rate = 1 Gbps, PRBS pattern VDD = 2.5 V, Rate = 2.5 Gbps, PRBS pattern UNIT 285 mA 680 Power dissipation VDD = 2.5 V, Rate = 1 Gbps, PRBS pattern VDD = 2.5 V, Rate = 2.5 Gbps, PRBS pattern 715 Shutdown current VDD = 2.7 V, Rate = 2.5 Gbps, worst case pattern† ENABLEx = 0, VDDA, VDD terminals, VDD = maximum PLL start-up lock time VDD, VDDA = 2.3 V, EN ↑ to PLL acquire 1700 mW 2920 µA 520 0.1 Data acquisition time † Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver. 0.4 1024 ms bits reference clock (GTx_CLK) timing requirements over recommended operating conditions (unless otherwise noted) PARAMETER Rω Frequency TEST CONDITIONS TYP MAX TYP−0.01% 50 TYP+0.01% Maximum data rate TYP−0.01% 125 TYP+0.01% 50% 60% Frequency tolerance −100 Duty cycle 40% Jitter 12 MIN Minimum data rate Peak-to-peak WWW.TI.COM 100 40 UNIT MHz ppm ps 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 TTL input electrical characteristics over recommended operating conditions (unless otherwise noted) TTL Signals: TDx0 ... TDx17, GTx_CLK, LOOPENx, SYNCx, PREEMPHx PARAMETER TEST CONDITIONS MIN TYP MAX 2 UNIT VIH VIL High-level input voltage See Figure 6 Low-level input voltage See Figure 6 3.6 V 0.8 V IIH IIL High-level input current Low-level input current VDD = Max, VIN = 2 V VDD = Max, VIN = 0.4 V 40 µA CIN Input capacitance 0.8 V to 2 V tr tf GTx_CLK, TDx rise time 0.8 V to 2 V, C = 5 pF, see Figure 6 1 ns GTx_CLK, TDx fall time 2 V to 0.8 V, C = 5 pF, see Figure 6 1 ns tsu th TDx setup to ↑ GTx_CLK See Figure 6 1.5 ns TDx hold to ↑ GTx_CLK See Figure 6 0.4 ns µA −40 4 pF 3.6 V 2V GTx_CLK 0.8 V 0V tr tf 3.6 V 2V TDx[0:17] 0.8 V 0V tsu tf tr th Figure 6. TTL Data Input Valid Levels for AC Measurements WWW.TI.COM 13 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 TTL output switching characteristics over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP 2.1 2.3 GND 0.25 MAX UNIT VOH VOL High-level output voltage Low-level output voltage IOH= −1 mA, VDD = minimum IOL= 1 mA, VDD = minimum tr(slew) tf(slew) Magnitude of Rx_CLK, RDx slew rate (rising) 0.8 V to 2 V, C = 5 pF, see Figure 7 0.5 V/ns Magnitude of Rx_CLK, RDx slew rate (falling) 0.8 V to 2 V, C = 5 pF, see Figure 7 0.5 V/ns tsu th RDx setup to ↑ Rx_CLK RDx hold to ↑ Rx_CLK V 0.5 V 50% voltage swing, GTx_CLK = 50 MHz, see Figure 7 8 ns 50% voltage swing, GTx_CLK = 125 MHz, see Figure 7 3 ns 50% voltage swing, GTx_CLK = 50 MHz, see Figure 7 8 ns 50% voltage swing, GTx_CLK = 125 MHz, see Figure 7 3 ns 2V Rx_CLK 0.8 V 0V tr(slew) tf(slew) 2V RDx[0:17] 0.8 V 0V tr(slew) tsu tf(slew) th Figure 7. TTL Data Output Valid Levels for AC Measurements 14 WWW.TI.COM 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 transmitter/receiver characteristics PARAMETER TEST CONDITION MIN TYP MAX UNIT DC-coupled. Preemphasis = high, see Figure 8 750 1000 1375 DC-coupled. Preemphasis = low, see Figure 8 650 950 1300 DC-coupled. Preemphasis = high, see Figure 8 1500 2000 2750 DC-coupled. Preemphasis = low, see Figure 8 1000 1500 2600 DC-coupled. See Figure 8 500 750 1100 mV DC-coupled. See Figure 8 1000 1500 2200 mV 1000 1250 1400 mV VOD(p) VOD(p) = |VTXP − VTXN|, Preemphasis VOD VOD(pp−p) Differential, peakĆto-peak output voltage with preemphasis VOD(d) VD(d) = |VTXP − VTXN|, De-emphasis VOD VOD(pp−d) Differential, peak-to-peak output voltage with deemphasis V(cmt) Transmit termination voltage range, (VTXP + VTXN)/2 VID Receiver input voltage differential VID= |RXP – RXN| 200 Vcmr Receiver common-mode voltage range, (VRXP + VRXN)/2 1000 VDD−350 mV −10 10 µA 2 pF Iin Cin tr, tf Receiver input leakage RL = 50 Ω, CL = 5 pF, see Figure 9 Serial transmit data total jitter (peak-to-peak) Differential output jitter, random + deterministic, 223 − 1 PRBS pattern at 2.5 Gbps Receive jitter tolerance Total input jitter, PRBS pattern, permitted eye closure at zero crossing 100 150 ps 0.15 UI 0.5 UI At 1.0 Gbps Tlatency TX latency Rlatency RX latency mV mV Receiver input capacitance Differential output signal rise and fall time (20% to 80%) mV Bit times At 2.5 Gbps At 1.0 Gbps Bit times At 2.5 Gbps VOD(p) VOD(d) VOD(pp-d) V(cmt) VOD(pp-p) tf tr VOD(d) Bit Time Bit Time VOD(p) Figure 8. Differential and Common-Mode Output Voltage Definitions WWW.TI.COM 15 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 80% DOUTTxP 50% 20% tr tf 80% 50% 20% DOUTTxN tf tr +V 80% V(cmt) DOUTTxP−DOUTTxN 20% −V tr tf Figure 9. Rise and Fall Time Definitions TXP RXP VDD ZO ZO 5 kΩ ZO 7.5 kΩ ZO TXN Transmitter + _ GND RXN Media Receiver Figure 10. High-Speed I/O Directly Coupled Mode TXP RXP VDD ZO ZO 5 kΩ ZO 7.5 kΩ ZO TXN Transmitter GND RXN Media Receiver Figure 11. High-Speed I/O AC-Coupled Mode 16 WWW.TI.COM + _ 
        
  SWRS025C − APRIL 2004 − REVISED JULY 2007 AC-coupling is only recommended if the parallel TX data stream is encoded to achieve a dc-balanced data stream. Otherwise, the ac capacitors can induce common-mode voltage drift due to the dc-unbalanced data stream. WWW.TI.COM 17 PACKAGE OPTION ADDENDUM www.ti.com 5-Jun-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) TLK4250GPV PREVIEW BGA GPV 289 TBD Call TI Call TI TLK4250IGPV OBSOLETE BGA GPV 289 TBD Call TI Call TI TLK4250IZPV LIFEBUY BGA ZPV 289 TBD Call TI Call TI Op Temp (°C) Device Marking (4/5) -40 to 85 TLK4250I -40 to 85 TLK4250I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Jun-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPBG233 – FEBRUARY 2002 GPV (S–PBGA–N289) PLASTIC BALL GRID ARRAY 19,20 SQ 18,80 16,00 TYP 1,00 U T R P 1,00 N M L K J H G F E D A1 Corner C B A 3 1 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 Bottom View 2,00 MAX Seating Plane 0,60 0,40 0,10 0,50 0,30 0,15 4204203/A 02/2002 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. 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