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TLV2217
SLVS067M – MARCH 1992 – REVISED NOVEMBER 2016
TLV2217 Low-Dropout Fixed-Voltage Regulators
1 Features
3 Description
•
•
The TLV2217 family of low-dropout regulators offers
a variety of fixed-voltage options that offer a
maximum continuous input voltage of 16 V, making
them more versatile than CMOS regulators. Utilizing
a PNP pass element, these regulators are capable of
sourcing 500 mA of current, with a specified
maximum dropout of 500 mV (3.3-V and 2.5-V
options), making these regulators ideal for lowvoltage applications. Additionally, the TLV2217
regulators offer very tight output accuracy of ±2%
across operating load and temperature ranges. Other
convenient features the regulators provide are
internal
overcurrent
limiting,
thermal-overload
protection, and overvoltage protection. The TLV2217
family of regulators is available in fixed voltages of
1.8 V, 2.5 V, and 3.3 V.
1
•
•
•
•
•
Fixed 1.8-V, 2.5-V, and 3.3-V Outputs
±1% Maximum Output Voltage Tolerance at
TJ = 25°C
500-mV Maximum Dropout Voltage at 500 mA
(3.3-V Option)
±2% Output Voltage Variation Across Load and
Temperature
Internal Overcurrent Limiting
Internal Thermal-Overload Protection
Internal Overvoltage Protection
2 Applications
•
•
•
•
•
Electronic Points of Sale
Medical, Health, and Fitness Applications
Printers
Appliances and White Goods
TV Set-Top Boxes
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV2217-xxPW
TSSOP (20)
6.50 mm × 4.40 mm
TLV2217-xxKVU
TO-252 (2)
6.04 mm × 6.15 mm
TLV2217-xxKCS
TO-220 (3)
10.16 mm × 9.15 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
TLV2217-33
INPUT
OUTPUT
VO = 3.3 V
GND
3.8 V
0.1 µF
22 µF
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV2217
SLVS067M – MARCH 1992 – REVISED NOVEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
4
4
4
4
5
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics: TLV2217-33 .....................
Electrical Characteristics: TLV2217-25 .....................
Electrical Characteristics: TLV2217-18 .....................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 7
8
Application and Implementation .......................... 8
8.1 Application Information.............................................. 8
8.2 Typical Application ................................................... 8
9 Power Supply Recommendations...................... 10
10 Layout................................................................... 10
10.1 Layout Guidelines ................................................. 10
10.2 Layout Example .................................................... 10
11 Device and Documentation Support ................. 11
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
11
11
11
11
11
12 Mechanical, Packaging, and Orderable
Information ........................................................... 11
4 Revision History
Changes from Revision L (April 2005) to Revision M
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
•
Deleted Ordering Information table; see Package Ordering Addendum at the end of the data sheet ................................. 1
•
Changed Junction-to-ambient thermal resistance, RθJA, values in Thermal Information table From: 83°C/W To:
81.6°C/W (PW), From: 28°C/W To: 31°C/W (KVU), and From: 19°C/W To: 22.5°C/W (KCS).............................................. 4
•
Changed Junction-to-case (top) thermal resistance, RθJC(top), values in Thermal Information table From: 32°C/W To:
22.1°C/W (PW), From: 19°C/W To: 37.5°C/W (KVU), and From: 17°C/W To: 34.6°C/W (KCS)........................................... 4
•
Changed Junction-to-case (bottom) thermal resistance, RθJC(bot), values in Thermal Information table From: 1.4°C/W
To: 0.6°C/W (KVU) and From: 3°C/W To: 0.8°C/W (KCS)..................................................................................................... 4
2
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SLVS067M – MARCH 1992 – REVISED NOVEMBER 2016
5 Pin Configuration and Functions
PW Package
20-Pin TSSOP
Top View
1
HEAT
SINK
GND
INPUT
HEAT
SINK
KVU Package
3-Pin TO-252
Top View
OUTPUT
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
HEAT
SINK
GND
GND
INPUT
GND
OUTPUT
KCS Package
3-Pin TO-220
Top View
HEAT
SINK
OUTPUT
GND
INPUT
GND
Pin Functions
PIN
NAME
I/O
DESCRIPTION
PW
KVU
KCS
INPUT
6
1
1
I
Voltage input
OUTPUT
15
3
3
O
Voltage output
5, 16
2
2
—
Ground
1, 2, 3, 4,
7, 8, 9, 10,
11, 12, 13, 14
17, 18, 19, 20
—
—
—
Connection for improved thermal dissipation. These terminals
have an internal resistive connection to ground and must be
grounded or electrically isolated.
GND
HEAT SINK
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SLVS067M – MARCH 1992 – REVISED NOVEMBER 2016
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Continuous input voltage, VI
Operating virtual junction temperature, TJ
Storage temperature, Tstg
(1)
–65
MAX
UNIT
16
V
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VI
Input voltage
12
V
IO
Output current
0
500
mA
TJ
Operating virtual junction temperature
0
125
°C
(1)
3
(1)
Minimum VI is equal to 3.0 V or VO(max) + 0.5 V, whichever is greater.
6.4 Thermal Information
TLV2217
THERMAL METRIC (1) (2)
RθJA
Junction-to-ambient thermal resistance
RθJC(top) Junction-to-case (top) thermal resistance
PW (TSSOP)
KVU (TO-252)
KCS (TO-220)
20 PINS
3 PINS
3 PINS
UNIT
81.6
31
22.5
°C/W
22.1
37.5
34.6
°C/W
RθJB
Junction-to-board thermal resistance
32
11.3
8.8
°C/W
ψJT
Junction-to-top characterization parameter
0.9
1.9
3
°C/W
ψJB
Junction-to-board characterization parameter
31.5
11.2
7.8
°C/W
—
0.6
0.8
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
(1)
(2)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) − TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
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6.5 Electrical Characteristics: TLV2217-33
VI = 4.5 V, IO = 500 mA, TJ = 25°C, and over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP
MAX
TJ = 25°C
3.267
3.3
3.333
TJ = 0°C to 125°C
3.234
Output voltage
IO = 20 mA to 500 mA,
VI = 3.8 V to 5.5 V
Input voltage regulation
VI = 3.8 V to 5.5 V
Ripple rejection
f = 120 Hz, Vripple = 1 VPP VI = 4.5 V
Output voltage regulation
IO = 20 mA to 500 mA
Output noise voltage
f = 10 Hz to 100 kHz
Dropout voltage
5
15
–62
5
30
mV
mV
µV
IO = 250 mA
400
IO = 500 mA
500
IO = 500 mA
V
dB
500
IO = 0 mA
Bias current
(1)
3.336
UNIT
2
5
19
49
mV
mA
Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal
effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF
tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output.
6.6 Electrical Characteristics: TLV2217-25
VI = 3.3 V, IO = 500 mA, TJ = 25°C, over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
TJ = 25°C
Output voltage
IO = 20 mA to 500 mA,
VI = 3.8 V to 5.5 V
Input voltage regulation
VI = 3.8 V to 5.5 V
Ripple rejection
f = 120 Hz, Vripple = 1 VPP VI = 4.5 V
Output voltage regulation
IO = 20 mA to 500 mA
Output noise voltage
f = 10 Hz to 100 kHz
Dropout voltage
TYP
MAX
2.4
2.525
2.45
2.55
4
4
V
mV
23
mV
dB
500
µV
IO = 250 mA
400
IO = 500 mA
500
IO = 500 mA
UNIT
12
–62
IO = 0 mA
Bias current
(1)
TJ = 0°C to 125°C
MIN
2.475
2
5
19
49
mV
mA
Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal
effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF
tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output.
6.7 Electrical Characteristics: TLV2217-18
VI = 3.3 V, IO = 500 mA, TJ = 25°C, and over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS (1)
PARAMETER
MIN
TYP
MAX
TJ = 25°C
1.782
1.8
1.818
TJ = 0°C to 125°C
1.764
Output voltage
IO = 20 mA to 500 mA,
VI = 3.8 V to 5.5 V
Input voltage regulation
VI = 3.8 V to 5.5 V
Ripple rejection
f = 120 Hz, Vripple = 1 VPP VI = 4.5 V
Output voltage regulation
IO = 20 mA to 500 mA
Output noise voltage
f = 10 Hz to 100 kHz
Dropout voltage
Bias current
(1)
(2)
1.836
3
See (2)
IO = 500 mA
See (2)
IO = 0 mA
IO = 500 mA
mV
17
mV
dB
500
IO = 250 mA
V
9
–62
3
UNIT
µV
mV
2
5
19
49
mA
Pulse-testing techniques are used to maintain the virtual junction temperature as close to the ambient temperature as possible. Thermal
effects must be taken into account separately. All characteristics are measured with a 0.1-µF capacitor across the input and a 22-µF
tantalum capacitor, with equivalent series resistance of 1.5 Ω, on the output.
Dropout voltage is limited by the input voltage range, with minimum VI = 3 V.
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6.8 Typical Characteristics
3.5
Output Voltage [V]
3
2.5
2
1.5
1
0.5
0
0
1
2
3
4
5
6
7
8
Input Voltage [V]
9
10
11
12
D002
Figure 1. TLV2217-33 Output Voltage vs Input Voltage
6
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7 Detailed Description
7.1 Overview
The TLV2217 device is a positive low-dropout voltage regulator designed to provide up to 500 mA of output
current. The device is available in 1.8-V, 2.5-V, and 3.3-V options. All internal circuitry is designed to operate
down to 0.5-V input-to-output differential, with the minimum input voltage of 3 V for all voltage options.
The TLV2217 device is designed to be stable with tantalum and aluminum electrolytic output capacitors having
an ESR between 0.4 Ω and 2 Ω.
The TLV2217 device is characterized for operation over the virtual junction temperature range of 0°C to 125°C.
7.2 Functional Block Diagram
INPUT
OUTPUT
R1
+
Over Temp & Over
Current Protection
R2
1.25 V
GND
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Overload Block
Current limiting and overtemperature shutdown protects against overload by turning off the PNP pass element.
7.4 Device Functional Modes
7.4.1 Operation With Low Input Voltage
The TLV2217 device requires 0.5-V headroom (VI – VO) to operate in regulation. With less headroom, the device
may drop out and OUTPUT voltage is INPUT voltage minus dropout voltage.
7.4.2 Operation at Light Loads
The load or feedback must consume the minimum bias current defined in Electrical Characteristics: TLV2217-33
for regulation, or the output may be too high.
7.4.3 Operation in Self Protection
When an overload occurs, the device shuts down the output stage or reduce the output current to prevent device
damage. The device automatically resets from the overload. The output may be reduced or alternate between on
and off until the overload is removed.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLV2217 is a low-dropout linear regulator and can be used as a fixed output voltage supply for a wide
variety of applications up to 500 mA. The TLV2217 has multiple output voltage options including 1.8 V, 2.5 V,
and 3.3 V. The TLV2217 requires a minimum of 3 V or (VO(max) + 0.5 V) input to ensure regulation and is
characterized for operation over the virtual junction temperature range of 0°C to 125°C.
8.2 Typical Application
TLV2217-33
INPUT
OUTPUT
VO = 3.3 V
GND
3.8 V
0.1 µF
22 µF
Copyright © 2016, Texas Instruments Incorporated
Figure 2. Typical Application Schematic
8.2.1 Design Requirements
The input voltage must be high enough so that there is enough headroom for the output to regulate. This
specification is defined as the dropout voltage in the Electrical Characteristics: TLV2217-33.
A 0.1-µF capacitor must be place on the input to stabilize the input supply, especially if the TLV2217 is not
placed near the source of supply.
Output capacitor selection is critical for regulator stability. Larger COUT values benefit the regulator by improving
transient response and loop stability. This device is designed to be stable with tantalum and aluminum
electrolytic output capacitors having an ESR between 0.4 Ω and 2 Ω. See Compensation-Capacitor Selection
Information for additional details regarding capacitor selection.
8.2.2 Detailed Design Procedure
8.2.2.1 Compensation-Capacitor Selection Information
The TLV2217 is a low-dropout regulator. This means that the capacitance loading is important to the
performance of the regulator because it is a vital part of the control loop. The capacitor value and the equivalent
series resistance (ESR) both affect the control loop and must be defined for the load range and the temperature
range. Figure 3 and Figure 4 can be used to establish the capacitance value and ESR range for the best
regulator performance.
8
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Typical Application (continued)
0.04
CL = 22 µF
CI = 0.1 µF
TJ = 25°C
Not Recommended
Potential Instability
Not Recommended
Potential Instability
Recommended Minimum ESR
1000 µF
0.035
0.03
2.2
2
1.8
1.6
1.4
Region of
Best Stability
0.025
Maximum
ESR Boundary
CL
ESR − Equivalent Series Resistance − Ω
3
2.8
2.6
2.4
400 µF
0.02
1.2
0.015
1
0.8
Minimum
ESR Boundary
200 µF
100 mF
0.01
0.6
0.4
0.005
0.2
0
0
0.1
0.2
0.4
0.3
0.5
0
22 µF
10 µF
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
1/ESR
IL − Load Current − A
Figure 3. TLV2217 ESR of Output Capacitor
vs Load Current
Figure 4. TLV2217 Stability vs ESR
8.2.2.2 High Start-up Current
Due to the structure of the TLV2217, a high peak current is required on start-up. See Figure 5 for the input
current characteristic.
NOTE
When the TLV2217 is starting up, it has to overcome the peak current to start regulating at
the output. Due to the peak current required for the TLV2217, a resistor connected in
series with the input is not recommended, as the I*R drop across the resistor may cause
the input voltage to drop below the required headroom for the device.
8.2.3 Application Curves
200
180
Input Current [mA]
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
Input Voltage [V]
9
10
11
12
D001
Figure 5. Input Current vs Input Voltage
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9 Power Supply Recommendations
See Recommended Operating Conditions for the recommended supply voltage range.
10 Layout
10.1 Layout Guidelines
See Figure 6 for an example layout for the TLV2217 using the TO-220 package. Input and output bypass
capacitors must be placed as close to the device pins as possible. The output capacitor must have a specified
ESR in the range defined by Figure 4. Additionally, the ground pin and thermal tab must be well connected to a
ground plane to aid in thermal dissipation.
10.2 Layout Example
GND
INPUT
OUT
GND
Figure 6. TO-220 Package Example Layout
10
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TLV2217-18KCS
ACTIVE
TO-220
KCS
3
50
RoHS & Green
SN
N / A for Pkg Type
0 to 125
TLV2217-18
Samples
TLV2217-18KVURG3
ACTIVE
TO-252
KVU
3
2500
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
2217-18
Samples
TLV2217-25KCSE3
ACTIVE
TO-220
KCS
3
50
RoHS & Green
SN
N / A for Pkg Type
0 to 125
TLV2217-25
Samples
TLV2217-25KVURG3
ACTIVE
TO-252
KVU
3
2500
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
2217-25
Samples
TLV2217-25PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 125
2217-25
Samples
TLV2217-33KCSE3
ACTIVE
TO-220
KCS
3
50
RoHS & Green
SN
N / A for Pkg Type
0 to 125
TLV2217-33
Samples
TLV2217-33KVURG3
ACTIVE
TO-252
KVU
3
2500
RoHS & Green
SN
Level-3-260C-168 HR
0 to 125
2217-33
Samples
TLV2217-33PWR
ACTIVE
TSSOP
PW
20
2000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
0 to 125
2217-33
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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