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TLV3201, TLV3202
SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
TLV320x 40-ns, microPOWER, Push-Pull Output Comparators
1 Features
3 Description
•
•
The TLV3201 and TLV3202 are single- and dualchannel comparators that offer the ultimate
combination of high speed (40 ns) and low-power
consumption (40 µA), all in extremely small packages
with features such as rail-to-rail inputs, low offset
voltage (1 mV), and large output drive current. The
devices are also very easy to implement in a wide
variety of applications where response time is critical.
1
•
•
•
•
•
•
Low Propagation Delay: 40 ns
Low Quiescent Current:
40 µA per Channel
Input Common-Mode Range Extends 200 mV
Beyond Either Rail
Low Input Offset Voltage: 1 mV
Push-Pull Outputs
Supply Range: 2.7 V to 5.5 V
Industrial Temperature Range:
–40°C to 125°C
Small Packages:
5-Pin SC70, 5-Pin SOT-23, 8-Pin SOIC, 8-Pin
VSSOP
The TLV320x family is available in single (TLV3201)
and dual (TLV3202) channel versions, both with
push-pull outputs. The TLV3201 is available in 5-pin
SOT-23 and 5-pin SC70 packages. The TLV3202 is
available in 8-pin SOIC and 8-pin VSSOP packages.
All devices are specified for operation across the
expanded industrial temperature range of –40°C to
125°C.
2 Applications
•
•
•
•
•
Device Information(1)
Inspection Equipment
Test and Measurement
High-Speed Sampling Systems
Telecom
Portable Communications
PART NUMBER
TLV3201
TLV3202
PACKAGE
BODY SIZE (NOM)
SOT-23 (5)
2.90 mm × 1.60 mm
SC70 (5)
2.00 mm × 1.25 mm
VSSOP (8)
3.00 mm × 3.00 mm
SOIC (8)
4.90 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Threshold Detector
VIN
VCC
C1
R1
C2
VOUT
R2
VREF
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TLV3201, TLV3202
SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
4
4
4
4
5
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics: VCC = 5 V.........................
Electrical Characteristics: VCC = 2.7 V......................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Applications ................................................ 16
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Device Support ....................................................
Documentation Support .......................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
20
20
21
21
21
21
21
21
13 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2012) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1
Changes from Original (March 2012) to Revision A
Page
•
Changed product status from Production Data to Mixed Status ............................................................................................ 1
•
Added dual channel device .................................................................................................................................................... 1
2
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SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
5 Device Comparison Table
DEVICE
DESCRIPTION
TLV3011
5-µA (maximum) open-drain, 1.8-V to 5.5-V with integrated voltage reference in 1.5-mm × 1.5-mm micro-sized
packages
TLV3012
5-µA (maximum) push-pull, 1.8-V to 5.5-V with integrated voltage reference in micro-sized packages
TLV3501
4.5-ns, rail-to-rail, push-pull comparator in micro-sized packages
LMV7235
75-ns, 65-µA, 2.7-V to 5.5-V, rail-to-rail input comparator with open-drain output
REF3333
30-ppm/°C drift, 3.9-µA, SOT23-3, SC70-3 voltage reference
6 Pin Configuration and Functions
TLV3201 DCK and DBV Packages
5-Pin SC70-5 and SOT-23
Top View
OUT
1
GND
2
IN+
3
5
VCC
4
IN-
Pin Functions: TLV3201
PIN
NAME
NO.
I/O
DESCRIPTION
GND
2
—
Negative supply, ground
IN–
4
I
Negative input
IN+
3
I
Positive input
OUT
1
O
Output
VCC
5
—
Positive supply
TLV3202 D and DGK Packages
8-Pin SOIC and VSSOP
Top View
1OUT
1
8
VCC
1IN-
2
7
2OUT
1IN+
3
6
2IN-
GND
4
5
2IN+
Pin Functions: TLV3202
PIN
NAME
NO.
I/O
DESCRIPTION
1IN–
2
I
Negative input, comparator 1
1IN+
3
I
Positive input, comparator 1
1OUT
1
O
Output, comparator 1
2IN–
6
I
Negative input, comparator 2
2IN+
5
I
Positive input, comparator 2
2OUT
7
O
Output, comparator 2
GND
4
—
Negative supply, ground
VCC
8
—
Positive supply
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TLV3201, TLV3202
SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Voltage
Current
Signal input pins (2)
–0.5
Signal input pins (2)
–10
10
–55
mA
125
Junction, TJ
150
Storage, Tstg
(3)
V
(VCC) + 0.5
100
Operating
(2)
UNIT
7
Output short circuit (3)
Temperature
(1)
MAX
Supply voltage
–65
°C
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be
current limited to 10 mA or less.
Short-circuit to ground.
7.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
V(ESD)
(1)
(2)
Electrostatic discharge
Charged-device model (CDM),
per JEDEC specification JESD22-C101 (2)
UNIT
±2000
TLV3201
±2000
TLV3202
±1000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS
Supply voltage, VS = (VS+) – (VS–)
Specified temperature
MIN
MAX
2.7 (±1.35)
5.5 (±2.75)
UNIT
V
–40
125
°C
7.4 Thermal Information
TLV3201
THERMAL METRIC (1)
TLV3202
DBV
(SOT-23)
DCK
(SC70)
DGK
(VSSOP)
D
(SOIC)
UNIT
5 PINS
5 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
237.8
281.9
146.3
201.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
108.7
97.6
97.2
92.5
°C/W
RθJB
Junction-to-board thermal resistance
64.1
68.3
84.2
123.3
°C/W
ψJT
Junction-to-top characterization parameter
12.1
2.6
45.5
23
°C/W
ψJB
Junction-to-board characterization parameter
63.3
67.3
83.7
212.6
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
7.5 Electrical Characteristics: VCC = 5 V
at TA = 25°C and VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1
5
UNIT
OFFSET VOLTAGE
VCM = VCC / 2
VIO
Input offset voltage
dVOS/dT
Input offset voltage drift
TA = –40°C to 125°C
PSRR
Power-supply rejection ratio
VCM = VCC / 2, VCC = 2.5 V to 5.5 V
TA = –40°C to 125°C
mV
6
1
65
Input hysteresis
10
µV/°C
85
dB
1.2
mV
INPUT BIAS CURRENT
IIB
IIO
Input bias current
Input offset current
VCM = VCC / 2
1
TA = –40°C to 125°C
VCM = VCC / 2
1
TA = –40°C to 125°C
50
pA
5
nA
50
pA
2.5
nA
INPUT VOLTAGE RANGE
VCM
Common-mode voltage
TA = –40°C to 125°C
(VEE) – 0.2
CMRR
Common-mode rejection ratio
–0.2 V < VCM < 5.2 V
60
(VCC) + 0.2
V
70
dB
INPUT IMPEDANCE
Common mode
1013 || 2
Ω || pF
Differential
1013 || 4
Ω || pF
OUTPUT
VOL
Voltage output swing from lower rail
VOH
Voltage output swing from upper rail
ISINK = 4 mA
175
TA = –40°C to 125°C
ISC
Short-circuit current (per comparator)
225
ISOURCE = 4 mA
120
TA = –40°C to 125°C
ISC sinking
140
170
40
TA = –40°C to 125°C
ISC sourcing
190
TA = –40°C to 125°C
mV
48
See Figure 14
52
mV
mA
60
See Figure 14
POWER SUPPLY
VCC
IQ
Specified voltage
Quiescent current
2.7
TA = 25°C
5.5
40
TA = –40°C to 125°C
50
65
V
µA
7.6 Electrical Characteristics: VCC = 2.7 V
at TA = 25°C and VCC = 2.7 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1
5
UNIT
OFFSET VOLTAGE
VCM = VCC / 2
VIO
Input offset voltage
dVOS/dT
Input offset voltage drift
TA = –40°C to 125°C
PSRR
Power-supply rejection ratio
VCM = VCC / 2, VCC = 2.5 V to 5.5 V
TA = –40°C to 125°C
6
1
65
Input hysteresis
10
mV
µV/°C
85
dB
1.2
mV
INPUT BIAS CURRENT
IIB
IIO
Input bias current
Input offset current
VCM = VCC / 2
1
TA = –40°C to 125°C
VCM = VCC / 2
1
TA = –40°C to 125°C
50
pA
5
nA
50
pA
2.5
nA
INPUT VOLTAGE RANGE
VCM
Common-mode voltage
TA = –40°C to 125°C
(VEE) – 0.2
CMRR
Common-mode rejection ratio
–0.2 V < VCM < 2.9 V
56
(VCC) + 0.2
68
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dB
5
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SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
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Electrical Characteristics: VCC = 2.7 V (continued)
at TA = 25°C and VCC = 2.7 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT IMPEDANCE
1013 || 2
Common mode
13
Differential
10
Ω || pF
Ω || pF
|| 4
OUTPUT
VOL
Voltage output swing from lower rail
VOH
Voltage output swing from upper rail
ISINK = 4 mA
230
Short-circuit current (per comparator)
mV
325
ISOURCE = 4 mA
210
250
TA = –40°C to 125°C
mV
350
ISC sinking
ISC
260
TA = –40°C to 125°C
13
TA = –40°C to 125°C
19
See Figure 14
ISC sourcing
15
TA = –40°C to 125°C
mA
21
See Figure 14
POWER SUPPLY
VCC
IQ
Specified voltage
Quiescent current
2.7
5.5
TA = 25°C
36
V
46
TA = –40°C to 125°C
µA
60
7.7 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Low to high
tPD
TYP
MAX
Input overdrive = 20 mV, CL = 15 pF
MIN
47
50
Input overdrive = 100 mV, CL = 15 pF
42
50
TA = –40°C to 125°C
Propagation delay time
High to low
55
Input overdrive = 20 mV, CL = 15 pF
40
50
Input overdrive = 100 mV, CL = 15 pF
38
50
TA = –40°C to 125°C
UNIT
ns
55
Propagation delay skew
Input overdrive = 20 mV, CL = 15 pF
Propagation delay matching (TLV3202)
High to low or low to high, input overdrive = 20 mV, CL = 15 pF
tR
Rise time
10% to 90%
4.8
ns
tF
Fall time
10% to 90%
5.2
ns
6
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2
ns
5
ns
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SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
7.8 Typical Characteristics
26
24
22
20
18
16
14
12
10
8
6
4
2
0
30
Pecentage of Amplifiers (%)
27
24
21
18
15
12
9
6
3
Offset Voltage (mV)
Figure 1. Offset Voltage Distribution
5
VCC = 2.7 V
3
2.8
2.6
2.4
2
2.2
1.8
1.6
1.4
1
1.2
5 Typical Units Shown
4
Offset Voltage (mV)
Offset Voltage (mV)
0.8
Figure 2. Hysteresis Distribution
5 Typical Units Shown
2
1
0
−1
−2
3
2
1
0
−1
−3
−2
−4
−3
−5
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
−4
−0.5
110 125
0
0.5
1
1.5
2
Common−Mode Voltage (V)
G002
Figure 3. Offset Voltage vs Temperature
2.5
3
G003
Figure 4. Offset Voltage vs Common-Mode Voltage
6
5
VCC = 5.5 V
5 Typical Units Shown
Offset Voltage (mV)
3
3
2
1
0
−1
2
1
0
−1
−2
−2
−3
−3
−4
−4
−0.5 0
8 Typical Units Shown
4
4
Offset Voltage (mV)
G001
6
3
5
0.6
Hysteresis (mV)
G000
5
4
0.4
0
0.2
0
−5
−4.5
−4
−3.5
−3
−2.5
−2
−1.5
−1
−0.5
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Pecentage of Amplifiers (%)
at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted)
0.5
1
1.5 2 2.5 3 3.5 4 4.5
Common−Mode Voltage (V)
5
5.5
6
−5
2.5
3
G004
Figure 5. Offset Voltage vs Common-Mode Voltage
3.5
4
4.5
Supply Voltage (V)
5
5.5
G005
Figure 6. Offset Voltage vs Power Supply
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Typical Characteristics (continued)
at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted)
110
10000
Input Bias Current (pA)
CMRR and PSRR (dB)
100
90
80
70
CMRR at VCC = 2.7 V
CMRR at VCC = 5.0 V
PSRR
60
50
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
1
−25
0
25
50
Temperature (°C)
75
100
125
G002
20
+ IB
− IB
IOS
VS=2.7V
+ IB
− IB
IOS
VS= 5.5V
15
10
5
0
−5
−10
−15
0.0
0.5
1.0
1.5
2.0
Common−Mode Input Voltage (V)
−20
2.5
0
1
G006
2
3
4
Common−Mode Input Voltage (V)
5
G006
Figure 10. Input Bias Current and Input Offset Current
vs Common-Mode Input Voltage
65
35
30
Quiescent Current (µA)
Pecentage of Amplifiers (%)
10
Figure 8. Input Bias Current and Input Offset Current
vs Temperature
Figure 9. Input Bias Current and Input Offset Current
vs Common-Mode Input Voltage
25
20
15
10
55
−40°C
25°C
125°C
45
35
25
5
15
2.5
Supply Current (µA)
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
0
3
3.5
4
4.5
Supply Voltage (V)
5
5.5
G018
G000
Figure 11. Quiescent Current Distribution
8
100
G006
Input Bias Current (pA)
Input Bias Current (pA)
−20
−25
−30
1000
0.1
−50
110 125
Figure 7. Common-Mode Rejection Ratio and
Power-Supply Rejection Ratio vs Temperature
30
25
20
15
10
5
0
−5
−10
−15
− IB
+ IB
IOS
Figure 12. Quiescent Current vs Supply Voltage
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Typical Characteristics (continued)
at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted)
90
ISC, Source: VCC = 5 V
ISC, Sink: VCC = 5 V
ISC, Sink: VCC = 2.7 V
ISC, Source: VCC = 2.7 V
Short Circuit Current (mA)
80
70
60
50
40
30
20
10
−40
20
Sourcing Current
85
110 125
G014
Sourcing Current
4.9
3.7
−40°C
25°C
75°C
125°C
Output Voltage (V)
VCC = 2.7 V
2.5
1.3
−40°C
25°C
75°C
125°C
0.1
−1.1
VCC = 5.5 V
−2.3
−3.5
−4.7
Sinking Current
0
5
10
Output Current (mA)
15
−5.9
20
40
60
80
Sinking Current
0
10
G015
Figure 17. Propagation Delay Falling Edge
50
60
G017
Input Voltage (mV)
Figure 16. Output Voltage vs Output Current
Output Voltage (V)
3
Output: VOD = 20 mV
2.6
Input: VOD = 20 mV
2.1
Output: VOD = 100 mV 1.7
Input: VOD = 100 mV
1.3
0.9
0.4
0
−0.4
−0.9
−1.3
−1.7
−2.1
−2.6
−3
100 120 140 160 180 200 220
Time (ns)
20
30
40
Output Current (mA)
140
120
100
80
60
40
20
0
−20
−40
−60
−80
−100
−120
−140
20
40
60
G000
80
3
2.6
2.1
1.7
1.3
0.9
0.4
0
−0.4
−0.9
−1.3
Output: VOD = 20 mV
−1.7
Input: VOD = 20 mV
Output: VOD = 100 mV −2.1
Input: VOD = 100 mV
−2.6
−3
100 120 140 160 180 200 220 240
Time (ns)
Output Voltage (V)
Output Voltage (V)
Input Voltage (mV)
35
60
Temperature (°C)
5.9
Figure 15. Output Voltage vs Output Current
140
120
100
80
60
40
20
0
−20
−40
−60
−80
−100
−120
−140
10
Figure 14. Short-Circuit Current vs Temperature
Figure 13. Quiescent Current vs Switching Frequency
2.8
2.4
2
1.6
1.2
0.8
0.4
0
−0.4
−0.8
−1.2
−1.6
−2
−2.4
−2.8
−15
G019
Figure 18. Propagation Delay Rising Edge
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Typical Characteristics (continued)
at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted)
100
50
PDHL: 5 V
PDLH: 5 V
PDHL: 2.7 V
PDLH: 2.7 V
80
70
60
50
40
30
20
10
0
46
44
42
40
38
36
34
32
20
30
40
50
60
70
Input Overdrive (mV)
80
90
30
−40 −25 −10
100
Figure 19. Propagation Delay vs Input Overdrive
80
VCC= 2.7V
Falling Edge
Rising Edge
52
50
48
46
44
42
40
−0.2
Falling Edge
Rising Edge
56
54
52
50
48
46
44
42
0.2
0.6
1
1.4
1.8
2.2
Common−Mode Input Voltage (V)
2.6
40
−0.2
2.9
0.4
G017
Figure 21. Propagation Delay vs Common-Mode Voltage
1
1.6 2.2 2.8 3.4
4
4.6
Common−Mode Input Voltage (V)
5.2 5.7
G017
Figure 22. Propagation Delay vs Common-Mode Voltage
60
60
PDLH:Vod = 20 mV
PDHL:Vod = 20 mV
PDLH:Vod = 50 mV
PDHL:Vod = 50 mV
Falling Edge
Rising Edge
Propagation Delay (ns)
56
54
52
50
48
46
44
55
45
42
VCC= 5.5 V
3
3.5
4
4.5
Supply Voltage (V)
5
5.5
35
0
G005
Figure 23. Propagation Delay vs Supply Voltage
10
110 125
G017
VCC= 5.5V
58
54
40
2.5
95
Figure 20. Propagation Delay vs Temperature
56
58
20 35 50 65
Temperature (°C)
60
PROPAGATION DELAY (ns)
PROPAGATION DELAY (ns)
58
5
G003
60
Propagation Delay (ns)
Falling Edge
Rising Edge
48
Propagation Delay (ns)
Propagation Delay (ns)
90
25
50
Capacitive Load (pF)
75
100
G024
Figure 24. Propagation Delay vs Capacitive Load
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8 Detailed Description
8.1 Overview
The TLV3201 and TLV3202 devices feature 40-ns response time, and include 1.2 mV of internal hysteresis for
improved noise immunity with an input common-mode range that extends 0.2 V beyond the power-supply rails.
8.2 Functional Block Diagram
V+
+IN
+
OUT
-IN
-
VCopyright © 2016, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 Operating Voltage
The TLV3201 and TLV3202 comparators are specified for use on a single supply from 2.7 V to 5.5 V (or a dual
supply from ±1.35 V to ±2.75 V) over a temperature range of −40°C to 125°C. The device continues to function
below this range, but performance is not specified.
8.3.2
Input Overvoltage Protection
The device inputs are protected by electrostatic discharge (ESD) diodes that conduct if the input voltages exceed
the power supplies by more than approximately 300 mV. Momentary voltages greater than 300 mV beyond the
power supply can be tolerated if the input current is limited to 10 mA. This limiting is easily accomplished with a
small input resistor in series with the input to the comparator.
8.4 Device Functional Modes
The device is fully functional when powered by rail-to-rail supply voltage greater than 2.7 V. The device is off at
any voltages below 2.7 V.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TLV3201 and TLV3202 are single- and dual-supply (respectively), push-pull comparators featuring 40 ns of
propagation delay on only 40 µA of supply current. This combination of fast response time and minimal power
consumption make the TLV3201 and TLV3202 excellent comparators for portable, battery-powered applications
as well as fast-switching threshold detection such as pulse-width modulation (PWM) output monitors and zerocross detection.
9.1.1 Comparator Inputs
The TLV3201 and TLV3202 are rail-to-rail input comparators, with an input common-mode range that exceeds
the supply rails by 200 mV for both positive and negative supplies. The devices are specified from 2.7 V to 5.5 V,
with room temperature operation from 2.5 V to 5.5 V. The TLV3201 and TLV3202 are designed to prevent phase
inversion when the input pins exceed the supply voltage. Figure 25 shows the TLV320x response when input
voltages exceed the supply, resulting in no phase inversion.
5
Output Voltage
Input Voltage
4
3
Voltage (V)
2
1
0
−1
−2
−3
−4
−5
0
20
40
60
80 100 120 140 160 180 200
Time (ns)
G000
Figure 25. No Phase Inversion: Comparator Response to Input Voltage (Propagation Delay Included)
The electrostatic discharge (ESD) protection input structure of two back-to-back diodes and 1-kΩ series resistors
are used to limit the differential input voltage applied to the precision input of the comparator by clamping input
voltages that exceed VCC beyond the specified operating conditions. If potential overvoltage conditions that
exceed absolute maximum ratings are present, the addition of external bypass diodes and resistors is
recommended, as shown in Figure 26. Large differential voltages greater than the supply voltage must be
avoided to prevent damage to the input stage.
1 kW
+In
Clamp
Core
-In
1 kW
Copyright © 2016, Texas Instruments Incorporated
Figure 26. TLV3201 Equivalent Input structure
12
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Application Information (continued)
9.1.2 External Hysteresis
The TLV3201 and TLV3202 have a hysteresis transfer curve (shown in Figure 27) that is a function of three
components: VTH, VOS, and VHYST.
• VTH: the actual set voltage or threshold trip voltage
• VOS: the internal offset voltage between VIN+ and VIN–. This voltage is added to VTH to form the actual trip
point at which the comparator must respond to change output states.
• VHYST: internal hysteresis (or trip window) that is designed to reduce comparator sensitivity to noise.
VTH + VOS - VHYST
VTH + VOS
VTH + VOS + VHYST
Figure 27. TLV320x Hysteresis Transfer Curve
9.1.2.1 Inverting Comparator with Hysteresis
The inverting comparator with hysteresis requires a three-resistor network that is referenced to the comparator
supply voltage (VCC), as shown in Figure 28. When VIN at the inverting input is less than VA, the output voltage is
high (for simplicity, assume VO switches as high as VCC). The three network resistors can be represented as R1
|| R3 in series with R2. The lower input trip voltage (VA1) is defined by Equation 1.
R2
VA1 = VCC ´
(R1 || R3) + R2
(1)
When VIN is greater than [VA × (VIN > VA)], the output voltage is low, very close to ground. In this case, the three
network resistors can be presented as R2 || R3 in series with R1. The upper trip voltage (VA2) is defined by
Equation 2.
R2 || R3
VA2 = VCC ´
R1 + (R2 || R3)
(2)
The total hysteresis provided by the network is defined by Equation 3.
DVA = VA1 - VA2
(3)
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Application Information (continued)
+VCC
+5 V
R1
1 MW
VIN
5V
RLOAD
100 kW
VA
VO
VA2
VA1
0V
1.67 V
R3
1 MW
R2
1 MW
VO High
+VCC
R1
VIN
3.33 V
VO Low
+VCC
R3
R1
VA1
VA2
R2
R2
R3
Copyright © 2016, Texas Instruments Incorporated
Figure 28. TLV3201 in Inverting Configuration With Hysteresis
9.1.2.2 Noninverting Comparator With Hysteresis
A noninverting comparator with hysteresis requires a two-resistor network, as shown in Figure 29, and a voltage
reference (VREF) at the inverting input. When VIN is low, the output is also low. For the output to switch from low
to high, VIN must rise up to VIN1. VIN1 is calculated by Equation 4.
VREF
VIN1 = R1 ´
´ VREF
(4)
R2
When VIN is high, the output is also high. In order for the comparator to switch back to a low state, VIN must
equal VREF before VA is again equal to VREF. VIN can be calculated by Equation 5.
VREF (R1 + R2) - VCC ´ R1
VIN2 =
(5)
R2
The hysteresis of this circuit is the difference between VIN1 and VIN2, as defined by Equation 6.
R1
DVIN = VCC ´
R2
14
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Application Information (continued)
+VCC
+5 V
VREF
+2.5 V
VO
VA
VIN
RLOAD
R1
330 kW
R2
1 MW
VO High
+VCC
VO Low
VIN1
5V
R2
R1
VA = VREF
VA = VREF
R1
R2
VO
VIN2
VIN1
0V
1.675 V
3.325 V
VIN
VIN2
Copyright © 2016, Texas Instruments Incorporated
Figure 29. TLV3201 in Noninverting Configuration With Hysteresis
9.1.3 Capacitive Loads
The TLV3201 and TLV3202 feature a push-pull output. When the output switches, there is a direct path between
VCC and ground, causing increased output sinking or sourcing current during the transition. Following the
transition the output current decreases and supply current returns to 40 µA, thus maintaining low power
consumption. Under reasonable capacitive loads, the TLV3201 and TLV3202 maintain specified propagation
delay (see Typical Characteristics), but excessive capacitive loading under high switching frequencies may
increase supply current, propagation delay, or induce decreased slew rate.
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9.2 Typical Applications
9.2.1 TLV3201 Configured as an AC-Coupled Comparator
One of the benefits of AC coupling a single-supply comparator circuit is that it can block dc offsets induced by
ground-loop offsets that could potentially produce either a false trip or a common-mode input violation. Figure 30
shows the TLV3201 configured as an ac-coupled comparator.
R9
866 W
Cable
C1 1 mF
R3
1 kW
VIN+
R1
1 kW
VM1
VIN
R10
50 W
3.3 V
U2
TLV3201
R2
1 kW
C2 1 mF
VOUT
3.3 V
+
R4
1 kW
VINVCM 100 m
V2
3.3 V
+
Ground mismatch in signal source
vs conditioning circuit
Copyright © 2016, Texas Instruments Incorporated
Figure 30. TLV3201 Configured as an AC-Coupled Comparator (Schematic)
9.2.1.1 Design Requirements
Design requirements include:
• Ability to tolerate up to ±100 mV of common-mode signal.
• Trigger only on AC signals (such as zero-cross detection).
9.2.1.2 Detailed Design Procedure
Design analysis:
• AC-coupled, high-pass frequency
• Large capacitors require longer start-up time from device power on
• Use 1-µF capacitor to achieve high-pass frequency of approximately 159 Hz
• For high-pass equivalent, use CIN = 0.5 µF, RIN = 2 kΩ
1. Set up input dividers initially for one-half supply (to be in center of acceptable common-mode range).
2. Adjust either divider slightly upwards or downwards as desired to establish quiescent output condition.
3. Select coupling capacitors based on lowest expected frequency.
16
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Typical Applications (continued)
9.2.1.3 Application Curve
4
VIN
VCM
VOUT
Voltage (V)
3
2
1
0
-1
0
100m
Time (s)
200m
Figure 31. AC-Coupled Comparator Results
9.2.2 TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor
Figure 32 shows a single-supply current monitor configured as a difference amplifier with a gain of 50. The
OPA320 was chosen for this circuit because of its gain bandwidth (20 MHz), which allows higher speed triggering
and monitoring of the current across the shunt resistor followed by the fast response of the TLV3201.
+
R5
50 kW
V3 5
+
C3
100 pF
R4
1 kW
V2 5
VF1
R7
1 kW
U2
OPA320
VF2
VOUT
U4
TLV3201
C1
500 pF
RSHUNT
100 W
R6
1 kW
+
C2
100 pF
R2
1 kW
VT 2.6
V1 5
R1
50 kW
IG1
Copyright © 2016, Texas Instruments Incorporated
Figure 32. TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor
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Typical Applications (continued)
9.2.3 TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch
Figure 33 shows the TMP20 and TLV3201 designed as a high-speed temperature switch. The TMP20 is an
analog output temperature sensor where output voltage decreases with temperature. The comparator output is
tripped when the output reaches a critical trip threshold.
C2
100 nF
VCC
4
U2
TMP20
VIN
V+
1
VOUT
T(V)
VTEMP
GND
GND
2
5
VOUT
3
U1
TLV3201
+
VT 1.85
VCC
VCC
+
V3 5
Copyright © 2016, Texas Instruments Incorporated
Figure 33. TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch
10 Power Supply Recommendations
The TLV3201 and TLV3202 comparators are specified for use on a single supply from 2.7 V to 5.5 V (or a dual
supply from ±1.35 V to ±2.75 V) over a temperature range of −40°C to 125°C. The device continues to function
below this range, but performance is not specified. Place bypass capacitors close to the power-supply pins to
reduce noise coupling in from noisy or high-impedance power supplies. For more detailed information on bypass
capacitor placement, see Layout Guidelines.
18
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11 Layout
11.1 Layout Guidelines
The TLV3201 and TLV3202 are fast-switching, high-speed comparators and require high-speed layout
considerations. For best results, maintain the following layout guidelines.
• Use a printed-circuit board (PCB) with a good, unbroken low-inductance ground plane.
• Place a decoupling capacitor (0.1-µF ceramic, surface-mount capacitor) as close as possible to VCC.
• On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback
around the comparator. Keep inputs away from the output.
• Solder the device directly to the PCB rather than using a socket.
• For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less)
placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some
degradation to propagation delay when the impedance is low. The topside ground plane runs between the
output and inputs.
• The ground pin ground trace runs under the device up to the bypass capacitor, shielding the inputs from the
outputs.
11.2 Layout Example
Figure 34. TLV320x Board Layout Example
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
12.1.1.1 TINA-TI™ (Free Software Download)
TINA-TI™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI
is a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a
range of both passive and active models. TINA-TI provides all the conventional dc, transient, and frequency
domain analysis of SPICE, as well as additional design capabilities.
Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing
capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select
input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool.
NOTE
These files require that either the TINA software (from DesignSoft™) or TINA-TI software
be installed. Download the free TINA-TI software from the TINA-TI folder.
12.1.1.2 Universal Op Amp EVM
The Universal Op Amp EVM is a series of general-purpose, blank circuit boards that simplify prototyping circuits
for a variety of IC package types. The evaluation module board design allows many different circuits to be
constructed easily and quickly. Five models are offered, with each model intended for a specific package type.
PDIP, SOIC, MSOP, TSSOP and SOT23 packages are all supported.
NOTE
These boards are unpopulated, so users must provide their own ICs. TI recommends
requesting several op amp device samples when ordering the Universal Op Amp EVM.
12.1.1.3 TI Precision Designs
TI Precision Designs are analog solutions created by TI’s precision analog applications experts and offer the
theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and
measured performance of many useful circuits. TI Precision Designs are available online at
http://www.ti.com/ww/en/analog/precision-designs/.
12.1.1.4 WEBENCH® Filter Designer
WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH
Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive
components from TI's vendor partners.
Available as a web-based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to
design, optimize, and simulate complete multistage active filter solutions within minutes.
12.2 Documentation Support
12.2.1 Related Documentation
The following documents are relevant to using the TLV320x, and recommended for reference. All are available
for download at www.ti.com unless otherwise noted.
• Frequency Dithering With the UCC28950 and TLV3201 (SLUA646)
• Frequency Dithering with the UCC28180 and TLV3201 (SLUA704)
• Comparator with Hysteresis Reference Design (TIDU020)
20
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12.3 Related Links
Table 1 lists quick access links. Categories include technical documents, support and community resources,
tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TLV3201
Click here
Click here
Click here
Click here
Click here
TLV3202
Click here
Click here
Click here
Click here
Click here
12.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.5 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.6 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
DesignSoft is a trademark of DesignSoft, Inc.
TINA-TI is a trademark of Texas Insturments and DesignSoft, Inc..
All other trademarks are the property of their respective owners.
12.7 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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21
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TLV3201AIDBVR
ACTIVE
SOT-23
DBV
5
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
RAI
TLV3201AIDBVT
ACTIVE
SOT-23
DBV
5
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
RAI
TLV3201AIDCKR
ACTIVE
SC70
DCK
5
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
SDP
TLV3201AIDCKT
ACTIVE
SC70
DCK
5
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
SDP
TLV3202AID
ACTIVE
SOIC
D
8
50
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
TL3202
TLV3202AIDGK
ACTIVE
VSSOP
DGK
8
80
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
VUDC
TLV3202AIDGKR
ACTIVE
VSSOP
DGK
8
2500
RoHS & Green
NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
VUDC
TLV3202AIDR
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
TL3202
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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