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TLV3201AIDBVT

TLV3201AIDBVT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SOT23-5

  • 描述:

    IC COMPARATOR RRI SGL SOT23-5

  • 数据手册
  • 价格&库存
TLV3201AIDBVT 数据手册
Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 TLV320x 40-ns, microPOWER, Push-Pull Output Comparators 1 Features 3 Description • • The TLV3201 and TLV3202 are single- and dualchannel comparators that offer the ultimate combination of high speed (40 ns) and low-power consumption (40 µA), all in extremely small packages with features such as rail-to-rail inputs, low offset voltage (1 mV), and large output drive current. The devices are also very easy to implement in a wide variety of applications where response time is critical. 1 • • • • • • Low Propagation Delay: 40 ns Low Quiescent Current: 40 µA per Channel Input Common-Mode Range Extends 200 mV Beyond Either Rail Low Input Offset Voltage: 1 mV Push-Pull Outputs Supply Range: 2.7 V to 5.5 V Industrial Temperature Range: –40°C to 125°C Small Packages: 5-Pin SC70, 5-Pin SOT-23, 8-Pin SOIC, 8-Pin VSSOP The TLV320x family is available in single (TLV3201) and dual (TLV3202) channel versions, both with push-pull outputs. The TLV3201 is available in 5-pin SOT-23 and 5-pin SC70 packages. The TLV3202 is available in 8-pin SOIC and 8-pin VSSOP packages. All devices are specified for operation across the expanded industrial temperature range of –40°C to 125°C. 2 Applications • • • • • Device Information(1) Inspection Equipment Test and Measurement High-Speed Sampling Systems Telecom Portable Communications PART NUMBER TLV3201 TLV3202 PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm × 1.60 mm SC70 (5) 2.00 mm × 1.25 mm VSSOP (8) 3.00 mm × 3.00 mm SOIC (8) 4.90 mm × 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Threshold Detector VIN VCC C1 R1 C2 VOUT R2 VREF Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA. TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 4 4 4 4 5 5 6 7 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: VCC = 5 V......................... Electrical Characteristics: VCC = 2.7 V...................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description ............................................ 11 8.1 Overview ................................................................. 11 8.2 Functional Block Diagram ....................................... 11 8.3 Feature Description................................................. 11 8.4 Device Functional Modes........................................ 11 9 Application and Implementation ........................ 12 9.1 Application Information............................................ 12 9.2 Typical Applications ................................................ 16 10 Power Supply Recommendations ..................... 18 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 19 12 Device and Documentation Support ................. 20 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 Device Support .................................................... Documentation Support ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 21 21 21 21 21 21 13 Mechanical, Packaging, and Orderable Information ........................................................... 21 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (June 2012) to Revision B Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1 Changes from Original (March 2012) to Revision A Page • Changed product status from Production Data to Mixed Status ............................................................................................ 1 • Added dual channel device .................................................................................................................................................... 1 2 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 5 Device Comparison Table DEVICE DESCRIPTION TLV3011 5-µA (maximum) open-drain, 1.8-V to 5.5-V with integrated voltage reference in 1.5-mm × 1.5-mm micro-sized packages TLV3012 5-µA (maximum) push-pull, 1.8-V to 5.5-V with integrated voltage reference in micro-sized packages TLV3501 4.5-ns, rail-to-rail, push-pull comparator in micro-sized packages LMV7235 75-ns, 65-µA, 2.7-V to 5.5-V, rail-to-rail input comparator with open-drain output REF3333 30-ppm/°C drift, 3.9-µA, SOT23-3, SC70-3 voltage reference 6 Pin Configuration and Functions TLV3201 DCK and DBV Packages 5-Pin SC70-5 and SOT-23 Top View OUT 1 GND 2 IN+ 3 5 VCC 4 IN- Pin Functions: TLV3201 PIN NAME NO. I/O DESCRIPTION GND 2 — Negative supply, ground IN– 4 I Negative input IN+ 3 I Positive input OUT 1 O Output VCC 5 — Positive supply TLV3202 D and DGK Packages 8-Pin SOIC and VSSOP Top View 1OUT 1 8 VCC 1IN- 2 7 2OUT 1IN+ 3 6 2IN- GND 4 5 2IN+ Pin Functions: TLV3202 PIN NAME NO. I/O DESCRIPTION 1IN– 2 I Negative input, comparator 1 1IN+ 3 I Positive input, comparator 1 1OUT 1 O Output, comparator 1 2IN– 6 I Negative input, comparator 2 2IN+ 5 I Positive input, comparator 2 2OUT 7 O Output, comparator 2 GND 4 — Negative supply, ground VCC 8 — Positive supply Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 3 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Voltage Current Signal input pins (2) –0.5 Signal input pins (2) –10 10 –55 mA 125 Junction, TJ 150 Storage, Tstg (3) V (VCC) + 0.5 100 Operating (2) UNIT 7 Output short circuit (3) Temperature (1) MAX Supply voltage –65 °C 150 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. Short-circuit to ground. 7.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) V(ESD) (1) (2) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) UNIT ±2000 TLV3201 ±2000 TLV3202 ±1000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VS Supply voltage, VS = (VS+) – (VS–) Specified temperature MIN MAX 2.7 (±1.35) 5.5 (±2.75) UNIT V –40 125 °C 7.4 Thermal Information TLV3201 THERMAL METRIC (1) TLV3202 DBV (SOT-23) DCK (SC70) DGK (VSSOP) D (SOIC) UNIT 5 PINS 5 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 237.8 281.9 146.3 201.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 108.7 97.6 97.2 92.5 °C/W RθJB Junction-to-board thermal resistance 64.1 68.3 84.2 123.3 °C/W ψJT Junction-to-top characterization parameter 12.1 2.6 45.5 23 °C/W ψJB Junction-to-board characterization parameter 63.3 67.3 83.7 212.6 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 7.5 Electrical Characteristics: VCC = 5 V at TA = 25°C and VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 1 5 UNIT OFFSET VOLTAGE VCM = VCC / 2 VIO Input offset voltage dVOS/dT Input offset voltage drift TA = –40°C to 125°C PSRR Power-supply rejection ratio VCM = VCC / 2, VCC = 2.5 V to 5.5 V TA = –40°C to 125°C mV 6 1 65 Input hysteresis 10 µV/°C 85 dB 1.2 mV INPUT BIAS CURRENT IIB IIO Input bias current Input offset current VCM = VCC / 2 1 TA = –40°C to 125°C VCM = VCC / 2 1 TA = –40°C to 125°C 50 pA 5 nA 50 pA 2.5 nA INPUT VOLTAGE RANGE VCM Common-mode voltage TA = –40°C to 125°C (VEE) – 0.2 CMRR Common-mode rejection ratio –0.2 V < VCM < 5.2 V 60 (VCC) + 0.2 V 70 dB INPUT IMPEDANCE Common mode 1013 || 2 Ω || pF Differential 1013 || 4 Ω || pF OUTPUT VOL Voltage output swing from lower rail VOH Voltage output swing from upper rail ISINK = 4 mA 175 TA = –40°C to 125°C ISC Short-circuit current (per comparator) 225 ISOURCE = 4 mA 120 TA = –40°C to 125°C ISC sinking 140 170 40 TA = –40°C to 125°C ISC sourcing 190 TA = –40°C to 125°C mV 48 See Figure 14 52 mV mA 60 See Figure 14 POWER SUPPLY VCC IQ Specified voltage Quiescent current 2.7 TA = 25°C 5.5 40 TA = –40°C to 125°C 50 65 V µA 7.6 Electrical Characteristics: VCC = 2.7 V at TA = 25°C and VCC = 2.7 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 1 5 UNIT OFFSET VOLTAGE VCM = VCC / 2 VIO Input offset voltage dVOS/dT Input offset voltage drift TA = –40°C to 125°C PSRR Power-supply rejection ratio VCM = VCC / 2, VCC = 2.5 V to 5.5 V TA = –40°C to 125°C 6 1 65 Input hysteresis 10 mV µV/°C 85 dB 1.2 mV INPUT BIAS CURRENT IIB IIO Input bias current Input offset current VCM = VCC / 2 1 TA = –40°C to 125°C VCM = VCC / 2 1 TA = –40°C to 125°C 50 pA 5 nA 50 pA 2.5 nA INPUT VOLTAGE RANGE VCM Common-mode voltage TA = –40°C to 125°C (VEE) – 0.2 CMRR Common-mode rejection ratio –0.2 V < VCM < 2.9 V 56 (VCC) + 0.2 68 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 V dB 5 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Electrical Characteristics: VCC = 2.7 V (continued) at TA = 25°C and VCC = 2.7 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUT IMPEDANCE 1013 || 2 Common mode 13 Differential 10 Ω || pF Ω || pF || 4 OUTPUT VOL Voltage output swing from lower rail VOH Voltage output swing from upper rail ISINK = 4 mA 230 Short-circuit current (per comparator) mV 325 ISOURCE = 4 mA 210 250 TA = –40°C to 125°C mV 350 ISC sinking ISC 260 TA = –40°C to 125°C 13 TA = –40°C to 125°C 19 See Figure 14 ISC sourcing 15 TA = –40°C to 125°C mA 21 See Figure 14 POWER SUPPLY VCC IQ Specified voltage Quiescent current 2.7 5.5 TA = 25°C 36 V 46 TA = –40°C to 125°C µA 60 7.7 Switching Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS Low to high tPD TYP MAX Input overdrive = 20 mV, CL = 15 pF MIN 47 50 Input overdrive = 100 mV, CL = 15 pF 42 50 TA = –40°C to 125°C Propagation delay time High to low 55 Input overdrive = 20 mV, CL = 15 pF 40 50 Input overdrive = 100 mV, CL = 15 pF 38 50 TA = –40°C to 125°C UNIT ns 55 Propagation delay skew Input overdrive = 20 mV, CL = 15 pF Propagation delay matching (TLV3202) High to low or low to high, input overdrive = 20 mV, CL = 15 pF tR Rise time 10% to 90% 4.8 ns tF Fall time 10% to 90% 5.2 ns 6 Submit Documentation Feedback 2 ns 5 ns Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 7.8 Typical Characteristics 26 24 22 20 18 16 14 12 10 8 6 4 2 0 30 Pecentage of Amplifiers (%) 27 24 21 18 15 12 9 6 3 Offset Voltage (mV) Figure 1. Offset Voltage Distribution 5 VCC = 2.7 V 3 2.8 2.6 2.4 2 2.2 1.8 1.6 1.4 1 1.2 5 Typical Units Shown 4 Offset Voltage (mV) Offset Voltage (mV) 0.8 Figure 2. Hysteresis Distribution 5 Typical Units Shown 2 1 0 −1 −2 3 2 1 0 −1 −3 −2 −4 −3 −5 −40 −25 −10 5 20 35 50 65 Temperature (°C) 80 95 −4 −0.5 110 125 0 0.5 1 1.5 2 Common−Mode Voltage (V) G002 Figure 3. Offset Voltage vs Temperature 2.5 3 G003 Figure 4. Offset Voltage vs Common-Mode Voltage 6 5 VCC = 5.5 V 5 Typical Units Shown Offset Voltage (mV) 3 3 2 1 0 −1 2 1 0 −1 −2 −2 −3 −3 −4 −4 −0.5 0 8 Typical Units Shown 4 4 Offset Voltage (mV) G001 6 3 5 0.6 Hysteresis (mV) G000 5 4 0.4 0 0.2 0 −5 −4.5 −4 −3.5 −3 −2.5 −2 −1.5 −1 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Pecentage of Amplifiers (%) at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted) 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Common−Mode Voltage (V) 5 5.5 6 −5 2.5 3 G004 Figure 5. Offset Voltage vs Common-Mode Voltage 3.5 4 4.5 Supply Voltage (V) 5 5.5 G005 Figure 6. Offset Voltage vs Power Supply Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 7 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Typical Characteristics (continued) at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted) 110 10000 Input Bias Current (pA) CMRR and PSRR (dB) 100 90 80 70 CMRR at VCC = 2.7 V CMRR at VCC = 5.0 V PSRR 60 50 −40 −25 −10 5 20 35 50 65 Temperature (°C) 80 95 1 −25 0 25 50 Temperature (°C) 75 100 125 G002 20 + IB − IB IOS VS=2.7V + IB − IB IOS VS= 5.5V 15 10 5 0 −5 −10 −15 0.0 0.5 1.0 1.5 2.0 Common−Mode Input Voltage (V) −20 2.5 0 1 G006 2 3 4 Common−Mode Input Voltage (V) 5 G006 Figure 10. Input Bias Current and Input Offset Current vs Common-Mode Input Voltage 65 35 30 Quiescent Current (µA) Pecentage of Amplifiers (%) 10 Figure 8. Input Bias Current and Input Offset Current vs Temperature Figure 9. Input Bias Current and Input Offset Current vs Common-Mode Input Voltage 25 20 15 10 55 −40°C 25°C 125°C 45 35 25 5 15 2.5 Supply Current (µA) 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 0 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 G018 G000 Figure 11. Quiescent Current Distribution 8 100 G006 Input Bias Current (pA) Input Bias Current (pA) −20 −25 −30 1000 0.1 −50 110 125 Figure 7. Common-Mode Rejection Ratio and Power-Supply Rejection Ratio vs Temperature 30 25 20 15 10 5 0 −5 −10 −15 − IB + IB IOS Figure 12. Quiescent Current vs Supply Voltage Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 Typical Characteristics (continued) at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted) 90 ISC, Source: VCC = 5 V ISC, Sink: VCC = 5 V ISC, Sink: VCC = 2.7 V ISC, Source: VCC = 2.7 V Short Circuit Current (mA) 80 70 60 50 40 30 20 10 −40 20 Sourcing Current 85 110 125 G014 Sourcing Current 4.9 3.7 −40°C 25°C 75°C 125°C Output Voltage (V) VCC = 2.7 V 2.5 1.3 −40°C 25°C 75°C 125°C 0.1 −1.1 VCC = 5.5 V −2.3 −3.5 −4.7 Sinking Current 0 5 10 Output Current (mA) 15 −5.9 20 40 60 80 Sinking Current 0 10 G015 Figure 17. Propagation Delay Falling Edge 50 60 G017 Input Voltage (mV) Figure 16. Output Voltage vs Output Current Output Voltage (V) 3 Output: VOD = 20 mV 2.6 Input: VOD = 20 mV 2.1 Output: VOD = 100 mV 1.7 Input: VOD = 100 mV 1.3 0.9 0.4 0 −0.4 −0.9 −1.3 −1.7 −2.1 −2.6 −3 100 120 140 160 180 200 220 Time (ns) 20 30 40 Output Current (mA) 140 120 100 80 60 40 20 0 −20 −40 −60 −80 −100 −120 −140 20 40 60 G000 80 3 2.6 2.1 1.7 1.3 0.9 0.4 0 −0.4 −0.9 −1.3 Output: VOD = 20 mV −1.7 Input: VOD = 20 mV Output: VOD = 100 mV −2.1 Input: VOD = 100 mV −2.6 −3 100 120 140 160 180 200 220 240 Time (ns) Output Voltage (V) Output Voltage (V) Input Voltage (mV) 35 60 Temperature (°C) 5.9 Figure 15. Output Voltage vs Output Current 140 120 100 80 60 40 20 0 −20 −40 −60 −80 −100 −120 −140 10 Figure 14. Short-Circuit Current vs Temperature Figure 13. Quiescent Current vs Switching Frequency 2.8 2.4 2 1.6 1.2 0.8 0.4 0 −0.4 −0.8 −1.2 −1.6 −2 −2.4 −2.8 −15 G019 Figure 18. Propagation Delay Rising Edge Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 9 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Typical Characteristics (continued) at TA = 25°C, VCC = 5 V, and input overdrive (VOD) = 20 mV (unless otherwise noted) 100 50 PDHL: 5 V PDLH: 5 V PDHL: 2.7 V PDLH: 2.7 V 80 70 60 50 40 30 20 10 0 46 44 42 40 38 36 34 32 20 30 40 50 60 70 Input Overdrive (mV) 80 90 30 −40 −25 −10 100 Figure 19. Propagation Delay vs Input Overdrive 80 VCC= 2.7V Falling Edge Rising Edge 52 50 48 46 44 42 40 −0.2 Falling Edge Rising Edge 56 54 52 50 48 46 44 42 0.2 0.6 1 1.4 1.8 2.2 Common−Mode Input Voltage (V) 2.6 40 −0.2 2.9 0.4 G017 Figure 21. Propagation Delay vs Common-Mode Voltage 1 1.6 2.2 2.8 3.4 4 4.6 Common−Mode Input Voltage (V) 5.2 5.7 G017 Figure 22. Propagation Delay vs Common-Mode Voltage 60 60 PDLH:Vod = 20 mV PDHL:Vod = 20 mV PDLH:Vod = 50 mV PDHL:Vod = 50 mV Falling Edge Rising Edge Propagation Delay (ns) 56 54 52 50 48 46 44 55 45 42 VCC= 5.5 V 3 3.5 4 4.5 Supply Voltage (V) 5 5.5 35 0 G005 Figure 23. Propagation Delay vs Supply Voltage 10 110 125 G017 VCC= 5.5V 58 54 40 2.5 95 Figure 20. Propagation Delay vs Temperature 56 58 20 35 50 65 Temperature (°C) 60 PROPAGATION DELAY (ns) PROPAGATION DELAY (ns) 58 5 G003 60 Propagation Delay (ns) Falling Edge Rising Edge 48 Propagation Delay (ns) Propagation Delay (ns) 90 25 50 Capacitive Load (pF) 75 100 G024 Figure 24. Propagation Delay vs Capacitive Load Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 8 Detailed Description 8.1 Overview The TLV3201 and TLV3202 devices feature 40-ns response time, and include 1.2 mV of internal hysteresis for improved noise immunity with an input common-mode range that extends 0.2 V beyond the power-supply rails. 8.2 Functional Block Diagram V+ +IN + OUT -IN - VCopyright © 2016, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 Operating Voltage The TLV3201 and TLV3202 comparators are specified for use on a single supply from 2.7 V to 5.5 V (or a dual supply from ±1.35 V to ±2.75 V) over a temperature range of −40°C to 125°C. The device continues to function below this range, but performance is not specified. 8.3.2 Input Overvoltage Protection The device inputs are protected by electrostatic discharge (ESD) diodes that conduct if the input voltages exceed the power supplies by more than approximately 300 mV. Momentary voltages greater than 300 mV beyond the power supply can be tolerated if the input current is limited to 10 mA. This limiting is easily accomplished with a small input resistor in series with the input to the comparator. 8.4 Device Functional Modes The device is fully functional when powered by rail-to-rail supply voltage greater than 2.7 V. The device is off at any voltages below 2.7 V. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 11 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TLV3201 and TLV3202 are single- and dual-supply (respectively), push-pull comparators featuring 40 ns of propagation delay on only 40 µA of supply current. This combination of fast response time and minimal power consumption make the TLV3201 and TLV3202 excellent comparators for portable, battery-powered applications as well as fast-switching threshold detection such as pulse-width modulation (PWM) output monitors and zerocross detection. 9.1.1 Comparator Inputs The TLV3201 and TLV3202 are rail-to-rail input comparators, with an input common-mode range that exceeds the supply rails by 200 mV for both positive and negative supplies. The devices are specified from 2.7 V to 5.5 V, with room temperature operation from 2.5 V to 5.5 V. The TLV3201 and TLV3202 are designed to prevent phase inversion when the input pins exceed the supply voltage. Figure 25 shows the TLV320x response when input voltages exceed the supply, resulting in no phase inversion. 5 Output Voltage Input Voltage 4 3 Voltage (V) 2 1 0 −1 −2 −3 −4 −5 0 20 40 60 80 100 120 140 160 180 200 Time (ns) G000 Figure 25. No Phase Inversion: Comparator Response to Input Voltage (Propagation Delay Included) The electrostatic discharge (ESD) protection input structure of two back-to-back diodes and 1-kΩ series resistors are used to limit the differential input voltage applied to the precision input of the comparator by clamping input voltages that exceed VCC beyond the specified operating conditions. If potential overvoltage conditions that exceed absolute maximum ratings are present, the addition of external bypass diodes and resistors is recommended, as shown in Figure 26. Large differential voltages greater than the supply voltage must be avoided to prevent damage to the input stage. 1 kW +In Clamp Core -In 1 kW Copyright © 2016, Texas Instruments Incorporated Figure 26. TLV3201 Equivalent Input structure 12 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 Application Information (continued) 9.1.2 External Hysteresis The TLV3201 and TLV3202 have a hysteresis transfer curve (shown in Figure 27) that is a function of three components: VTH, VOS, and VHYST. • VTH: the actual set voltage or threshold trip voltage • VOS: the internal offset voltage between VIN+ and VIN–. This voltage is added to VTH to form the actual trip point at which the comparator must respond to change output states. • VHYST: internal hysteresis (or trip window) that is designed to reduce comparator sensitivity to noise. VTH + VOS - VHYST VTH + VOS VTH + VOS + VHYST Figure 27. TLV320x Hysteresis Transfer Curve 9.1.2.1 Inverting Comparator with Hysteresis The inverting comparator with hysteresis requires a three-resistor network that is referenced to the comparator supply voltage (VCC), as shown in Figure 28. When VIN at the inverting input is less than VA, the output voltage is high (for simplicity, assume VO switches as high as VCC). The three network resistors can be represented as R1 || R3 in series with R2. The lower input trip voltage (VA1) is defined by Equation 1. R2 VA1 = VCC ´ (R1 || R3) + R2 (1) When VIN is greater than [VA × (VIN > VA)], the output voltage is low, very close to ground. In this case, the three network resistors can be presented as R2 || R3 in series with R1. The upper trip voltage (VA2) is defined by Equation 2. R2 || R3 VA2 = VCC ´ R1 + (R2 || R3) (2) The total hysteresis provided by the network is defined by Equation 3. DVA = VA1 - VA2 (3) Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 13 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Application Information (continued) +VCC +5 V R1 1 MW VIN 5V RLOAD 100 kW VA VO VA2 VA1 0V 1.67 V R3 1 MW R2 1 MW VO High +VCC R1 VIN 3.33 V VO Low +VCC R3 R1 VA1 VA2 R2 R2 R3 Copyright © 2016, Texas Instruments Incorporated Figure 28. TLV3201 in Inverting Configuration With Hysteresis 9.1.2.2 Noninverting Comparator With Hysteresis A noninverting comparator with hysteresis requires a two-resistor network, as shown in Figure 29, and a voltage reference (VREF) at the inverting input. When VIN is low, the output is also low. For the output to switch from low to high, VIN must rise up to VIN1. VIN1 is calculated by Equation 4. VREF VIN1 = R1 ´ ´ VREF (4) R2 When VIN is high, the output is also high. In order for the comparator to switch back to a low state, VIN must equal VREF before VA is again equal to VREF. VIN can be calculated by Equation 5. VREF (R1 + R2) - VCC ´ R1 VIN2 = (5) R2 The hysteresis of this circuit is the difference between VIN1 and VIN2, as defined by Equation 6. R1 DVIN = VCC ´ R2 14 Submit Documentation Feedback (6) Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 Application Information (continued) +VCC +5 V VREF +2.5 V VO VA VIN RLOAD R1 330 kW R2 1 MW VO High +VCC VO Low VIN1 5V R2 R1 VA = VREF VA = VREF R1 R2 VO VIN2 VIN1 0V 1.675 V 3.325 V VIN VIN2 Copyright © 2016, Texas Instruments Incorporated Figure 29. TLV3201 in Noninverting Configuration With Hysteresis 9.1.3 Capacitive Loads The TLV3201 and TLV3202 feature a push-pull output. When the output switches, there is a direct path between VCC and ground, causing increased output sinking or sourcing current during the transition. Following the transition the output current decreases and supply current returns to 40 µA, thus maintaining low power consumption. Under reasonable capacitive loads, the TLV3201 and TLV3202 maintain specified propagation delay (see Typical Characteristics), but excessive capacitive loading under high switching frequencies may increase supply current, propagation delay, or induce decreased slew rate. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 15 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com 9.2 Typical Applications 9.2.1 TLV3201 Configured as an AC-Coupled Comparator One of the benefits of AC coupling a single-supply comparator circuit is that it can block dc offsets induced by ground-loop offsets that could potentially produce either a false trip or a common-mode input violation. Figure 30 shows the TLV3201 configured as an ac-coupled comparator. R9 866 W Cable C1 1 mF R3 1 kW VIN+ R1 1 kW VM1 VIN R10 50 W 3.3 V U2 TLV3201 R2 1 kW C2 1 mF VOUT 3.3 V + R4 1 kW VINVCM 100 m V2 3.3 V + Ground mismatch in signal source vs conditioning circuit Copyright © 2016, Texas Instruments Incorporated Figure 30. TLV3201 Configured as an AC-Coupled Comparator (Schematic) 9.2.1.1 Design Requirements Design requirements include: • Ability to tolerate up to ±100 mV of common-mode signal. • Trigger only on AC signals (such as zero-cross detection). 9.2.1.2 Detailed Design Procedure Design analysis: • AC-coupled, high-pass frequency • Large capacitors require longer start-up time from device power on • Use 1-µF capacitor to achieve high-pass frequency of approximately 159 Hz • For high-pass equivalent, use CIN = 0.5 µF, RIN = 2 kΩ 1. Set up input dividers initially for one-half supply (to be in center of acceptable common-mode range). 2. Adjust either divider slightly upwards or downwards as desired to establish quiescent output condition. 3. Select coupling capacitors based on lowest expected frequency. 16 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 Typical Applications (continued) 9.2.1.3 Application Curve 4 VIN VCM VOUT Voltage (V) 3 2 1 0 -1 0 100m Time (s) 200m Figure 31. AC-Coupled Comparator Results 9.2.2 TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor Figure 32 shows a single-supply current monitor configured as a difference amplifier with a gain of 50. The OPA320 was chosen for this circuit because of its gain bandwidth (20 MHz), which allows higher speed triggering and monitoring of the current across the shunt resistor followed by the fast response of the TLV3201. + R5 50 kW V3 5 + C3 100 pF R4 1 kW V2 5 VF1 R7 1 kW U2 OPA320 VF2 VOUT U4 TLV3201 C1 500 pF RSHUNT 100 W R6 1 kW + C2 100 pF R2 1 kW VT 2.6 V1 5 R1 50 kW IG1 Copyright © 2016, Texas Instruments Incorporated Figure 32. TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 17 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com Typical Applications (continued) 9.2.3 TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch Figure 33 shows the TMP20 and TLV3201 designed as a high-speed temperature switch. The TMP20 is an analog output temperature sensor where output voltage decreases with temperature. The comparator output is tripped when the output reaches a critical trip threshold. C2 100 nF VCC 4 U2 TMP20 VIN V+ 1 VOUT T(V) VTEMP GND GND 2 5 VOUT 3 U1 TLV3201 + VT 1.85 VCC VCC + V3 5 Copyright © 2016, Texas Instruments Incorporated Figure 33. TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch 10 Power Supply Recommendations The TLV3201 and TLV3202 comparators are specified for use on a single supply from 2.7 V to 5.5 V (or a dual supply from ±1.35 V to ±2.75 V) over a temperature range of −40°C to 125°C. The device continues to function below this range, but performance is not specified. Place bypass capacitors close to the power-supply pins to reduce noise coupling in from noisy or high-impedance power supplies. For more detailed information on bypass capacitor placement, see Layout Guidelines. 18 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 11 Layout 11.1 Layout Guidelines The TLV3201 and TLV3202 are fast-switching, high-speed comparators and require high-speed layout considerations. For best results, maintain the following layout guidelines. • Use a printed-circuit board (PCB) with a good, unbroken low-inductance ground plane. • Place a decoupling capacitor (0.1-µF ceramic, surface-mount capacitor) as close as possible to VCC. • On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback around the comparator. Keep inputs away from the output. • Solder the device directly to the PCB rather than using a socket. • For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less) placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some degradation to propagation delay when the impedance is low. The topside ground plane runs between the output and inputs. • The ground pin ground trace runs under the device up to the bypass capacitor, shielding the inputs from the outputs. 11.2 Layout Example Figure 34. TLV320x Board Layout Example Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 19 TLV3201, TLV3202 SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 TINA-TI™ (Free Software Download) TINA-TI™ is a simple, powerful, and easy-to-use circuit simulation program based on a SPICE engine. TINA-TI is a free, fully-functional version of the TINA software, preloaded with a library of macro models in addition to a range of both passive and active models. TINA-TI provides all the conventional dc, transient, and frequency domain analysis of SPICE, as well as additional design capabilities. Available as a free download from the Analog eLab Design Center, TINA-TI offers extensive post-processing capability that allows users to format results in a variety of ways. Virtual instruments offer the ability to select input waveforms and probe circuit nodes, voltages, and waveforms, creating a dynamic quick-start tool. NOTE These files require that either the TINA software (from DesignSoft™) or TINA-TI software be installed. Download the free TINA-TI software from the TINA-TI folder. 12.1.1.2 Universal Op Amp EVM The Universal Op Amp EVM is a series of general-purpose, blank circuit boards that simplify prototyping circuits for a variety of IC package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered, with each model intended for a specific package type. PDIP, SOIC, MSOP, TSSOP and SOT23 packages are all supported. NOTE These boards are unpopulated, so users must provide their own ICs. TI recommends requesting several op amp device samples when ordering the Universal Op Amp EVM. 12.1.1.3 TI Precision Designs TI Precision Designs are analog solutions created by TI’s precision analog applications experts and offer the theory of operation, component selection, simulation, complete PCB schematic and layout, bill of materials, and measured performance of many useful circuits. TI Precision Designs are available online at http://www.ti.com/ww/en/analog/precision-designs/. 12.1.1.4 WEBENCH® Filter Designer WEBENCH® Filter Designer is a simple, powerful, and easy-to-use active filter design program. The WEBENCH Filter Designer lets you create optimized filter designs using a selection of TI operational amplifiers and passive components from TI's vendor partners. Available as a web-based tool from the WEBENCH® Design Center, WEBENCH® Filter Designer allows you to design, optimize, and simulate complete multistage active filter solutions within minutes. 12.2 Documentation Support 12.2.1 Related Documentation The following documents are relevant to using the TLV320x, and recommended for reference. All are available for download at www.ti.com unless otherwise noted. • Frequency Dithering With the UCC28950 and TLV3201 (SLUA646) • Frequency Dithering with the UCC28180 and TLV3201 (SLUA704) • Comparator with Hysteresis Reference Design (TIDU020) 20 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 TLV3201, TLV3202 www.ti.com SBOS561B – MARCH 2012 – REVISED DECEMBER 2016 12.3 Related Links Table 1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TLV3201 Click here Click here Click here Click here Click here TLV3202 Click here Click here Click here Click here Click here 12.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.5 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.6 Trademarks E2E is a trademark of Texas Instruments. WEBENCH is a registered trademark of Texas Instruments. DesignSoft is a trademark of DesignSoft, Inc. TINA-TI is a trademark of Texas Insturments and DesignSoft, Inc.. All other trademarks are the property of their respective owners. 12.7 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 21 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TLV3201AIDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 RAI TLV3201AIDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 RAI TLV3201AIDCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SDP TLV3201AIDCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SDP TLV3202AID ACTIVE SOIC D 8 50 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 TL3202 TLV3202AIDGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VUDC TLV3202AIDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 VUDC TLV3202AIDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 TL3202 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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