0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TLV320AIC3105EVM

TLV320AIC3105EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    -

  • 描述:

    TLV320AIC3105EVM

  • 数据手册
  • 价格&库存
TLV320AIC3105EVM 数据手册
User's Guide SLAU217A – July 2007 – Revised January 2014 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK This User's Guide describes the characteristics, operation, and use of the TLV320AIC3105EVM, both by itself and as part of the TLV320AIC3105EVM-PDK. This evaluation module (EVM) is a complete stereo audio codec with several inputs and outputs, extensive audio routing, mixing, and effects capabilities. A complete circuit description, schematic diagram, and bill of materials are also included. The following related documents are available through the Texas Instruments website at www.ti.com. EVM-Compatible Device Data Sheets Device Literature Number TLV320AIC3105 SLAS513 TAS1020B SLES025 REG1117-3.3 SBVS001 TPS767D318 SLVS209 SN74LVC125A SCAS290 SN74LVC1G125 SCES223 SN74LVC1G07 SCES296 Contents 1 EVM Overview ............................................................................................................... 3 2 EVM Description and Basics .............................................................................................. 3 3 TLV320AIC3105EVM-PDK Setup and Installation ..................................................................... 8 4 TLV320AIC3105EVM Software .......................................................................................... 10 Appendix A EVM Connector Descriptions ................................................................................... 33 Appendix B TLV320AIC3105EVM Schematic ............................................................................... 37 Appendix C TLV320AIC3105EVM Layout Views ........................................................................... 38 Appendix D TLV320AIC3105EVM Bill of Materials ......................................................................... 41 Appendix E USB-MODEVM Schematic ...................................................................................... 42 Appendix F USB-MODEVM Layout Views .................................................................................. 44 Appendix G USB-MODEVM Bill of Materials ................................................................................ 46 Appendix H USB-MODEVM Protocol ......................................................................................... 48 List of Figures 1 2 3 4 5 6 7 8 9 ............................................................................. Default Software Screen .................................................................................................. Device Selection Window ................................................................................................ Preset Configuration Tab ................................................................................................. Audio Input/ADC Tab ..................................................................................................... Bypass Paths Tab ......................................................................................................... Audio Interface Tab ...................................................................................................... Clocks Tab ................................................................................................................. AGC Tab ................................................................................................................... TLV320AIC3105EVM-PDK Block Diagram 4 9 10 12 13 14 15 16 18 Microsoft, Windows are registered trademarks of Microsoft Corporation. SPI is a trademark of Motorola, Inc. VISA, LabVIEW are trademarks of National Instruments Corporation. All other trademarks are the property of their respective owners. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 1 www.ti.com 10 Left AGC Settings ......................................................................................................... 19 11 Advanced ................................................................................................................... 19 12 Filters Tab ................................................................................................................. ADC High-Pass Filters ................................................................................................... ADC High-Pass Filter Settings .......................................................................................... DAC Filters ................................................................................................................. De-emphasis Filters ....................................................................................................... Enabling Filters ........................................................................................................... Shelf Filters ................................................................................................................ EQ Filters .................................................................................................................. Analog Simulation Filters ................................................................................................ Preset Filters .............................................................................................................. User Filters ................................................................................................................ 3D Effect Settings ........................................................................................................ Output Stage Configuration Tab ........................................................................................ DAC/Line Outputs Tab ................................................................................................... High Power Outputs Tab ................................................................................................ Command Line Interface Tab ........................................................................................... File Menu .................................................................................................................. TLV320AIC3105EVM Assembly Layer ................................................................................. TLV320AIC3105EVM Top Layer ........................................................................................ TLV320AIC3105EVM Layer 3 ........................................................................................... TLV320AIC3105EVM Layer 4 ........................................................................................... TLV320AIC3105EVM Silk Screen ....................................................................................... TLV320AIC3105EVM Bottom Layer .................................................................................... USB-MODEVM Interface Board Schematic (1 of 2) .................................................................. USB-MODEVM Interface Board Schematic (2 of 2) .................................................................. USB-MODEVM Assembly Layer ........................................................................................ USB-MODEVM Top Layer ............................................................................................... USB-MODEVM Bottom Layer ........................................................................................... 20 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 21 21 22 22 23 23 24 24 25 25 26 27 28 30 31 32 38 38 39 39 40 40 42 43 44 44 45 List of Tables 1 USB-MODEVM SW2 Settings ............................................................................................. 5 2 USB-MODEVM Jumpers ................................................................................................... 5 3 List of Jumpers .............................................................................................................. 6 4 Analog Interface Pinout ................................................................................................... 33 5 Alternate Analog Connectors 6 7 8 9 10 11 12 2 ............................................................................................ Digital Interface Pinout .................................................................................................... Power Supply Pinout ...................................................................................................... TLV320AIC3105EVM Bill of Materials .................................................................................. USB-MODEVM Bill of Materials ......................................................................................... USB Control Endpoint HIDSETREPORT Request .................................................................... Data Packet Configuration ............................................................................................... GPIO Pin Assignments ................................................................................................... TLV320AIC3105EVM and TLV320AIC3105EVM-PDK 34 35 36 41 46 48 48 51 SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVM Overview www.ti.com 1 EVM Overview 1.1 Features • • • • • Full-featured evaluation board for the TLV320AIC3105 stereo audio codec. Modular design for use with a variety of digital signal processor (DSP) and microcontroller interface boards. USB connection to PC provides power, control, and streaming audio data for easy evaluation. Onboard microphone for ADC evaluation Connection points for external control and digital audio signals for quick connection to other circuits/input devices. The TLV320AIC3105EVM-PDK is a complete evaluation kit, which includes a universal serial bus (USB)based motherboard and evaluation software for use with a personal computer running the Microsoft® Windows® operating system (Windows 2000, Windows XP, or Windows 7). 1.2 Introduction The TLV320AIC3105EVM is in the Texas Instruments modular EVM form factor, which allows direct evaluation of the device performance and operating characteristics, and eases software development and system prototyping. This EVM is compatible with the 5-6K Interface Evaluation Module (SLAU104) and the HPA-MCUINTERFACE (SLAU106) from Texas Instruments and additional third-party boards which support TI's Modular EVM format. The TLV320AIC3105EVM-PDK is a complete evaluation/demonstration kit, which includes a USB-based motherboard called the USB-MODEVM interface board and evaluation software for use with a personal computer running the Microsoft Windows operating systems. The TLV320AIC3105EVM-PDK is operational with one USB cable connection to a personal computer. The USB connection provides power, control, and streaming audio data to the EVM for reduced setup and configuration. The EVM also allows external control signals, audio data, and power for advanced operation, which allows prototyping and connection to the rest of the development or system evaluation. 2 EVM Description and Basics This section provides information on the analog input and output, digital control, power and general connection of the TLV320AIC3105EVM. 2.1 TLV320AIC3105EVM-PDK Block Diagram The TLV320AIC3105EVM-PDK consists of two separate circuit boards, the USB-MODEVM and the TLV320AIC3105EVM. The USB-MODEVM is built around a TAS1020B streaming audio USB controller with an 8051-based core. The motherboard features two positions for modular EVMs, or one double-wide serial modular EVM may be installed. The TLV320AIC3105EVM is one of the double-wide modular EVMs that is designed to work with the USB-MODEVM. The simple diagram in Figure 1 shows how the TLV320AIC3105EVM is connected to the USB-MODEVM. The USB-MODEVM interface board is intended to be used in USB mode, where control of the installed EVM is accomplished using the onboard USB controller device. Provision is made, however, for driving all the data buses (I2C, SPI™, I2S/AC97) externally. The source of these signals is controlled by SW2 on the USB-MODEVM. See Table 1 for details on the switch settings. The USB-MODEVM has two EVM positions that allow for the connection of two small evaluation module or one larger evaluation module. The TLV320AIC3105EVM is designed to fit over both of the smaller evaluation module slots as shown in Section 2.2. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 3 EVM Description and Basics 2.1.1 www.ti.com USB-MODEVM Interface Board The simple diagram shown in Figure 1 shows only the basic features of the USB-MODEVM interface board. Because the TLV320AIC3105EVM is a double-wide modular EVM, it is installed with connections to both EVM positions, which connects the TLV320AIC3105 digital control interface to the I2C port realized using the TAS1020B, as well as the TAS1020B digital audio interface. In the factory configuration, the board is ready to use with the TLV320AIC3105EVM. To view all the functions and configuration options available on the USB-MODEVM board, see the USB-MODEVM interface board schematic in Appendix E. TLV320AIC310xEVM TLV320AIC310x USB-MODEVM EVM Position 1 Control Interface 2 SPI, I C TAS1020B USB 8051 Microcontroller EVM Position 2 USB 2 I S, AC97 Audio Interface Figure 1. TLV320AIC3105EVM-PDK Block Diagram 4 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVM Description and Basics www.ti.com 2.2 2.2.1 Default Configuration and Connections USB-MODEVM Table 1 provides a list of the SW2 settings on the USB=MODEVM. For use with the TLV320AIC3105EVM, SW-2 positions 1 through 7 should be set to ON, while SW-2.8 should be set to OFF. Table 1. USB-MODEVM SW2 Settings SW-2 Switch Number Label Switch Description 1 A0 USB-MODEVM EEPROM I2C Address A0 ON: A0 = 0 OFF: A0 = 1 2 A1 USB-MODEVM EEPROM I2C Address A1 ON: A1 = 0 OFF: A1 = 1 3 A2 USB-MODEVM EEPROM I2C Address A2 ON: A2 = 0 OFF: A2 = 1 4 USB I2S I2S Bus Source Selection ON: I2S Bus connects to TAS1020 OFF: I2S Bus connects to USB-MODEVM J14 5 USB MCK I2S Bus MCLK Source Selection ON: MCLK connects to TAS1020 OFF: MCLK connects to USB-MODEVM J14 6 USB SPI SPI Bus Source Selection ON: SPI Bus connects to TAS1020 OFF: SPI Bus connects to USB-MODEVM J15 7 USB RST RST Source Selection ON: EVM Reset Signal comes from TAS1020 OFF: EVM Reset Signal comes from USB-MODEVM J15 8 EXT MCK External MCLK Selection ON: MCLK Signal is provided from USB-MODEVM J10 OFF: MCLK Signal comes from either selection of SW2-5 Table 2 provides a list of USB-MODEVM jumpers found on the EVM. Table 2. USB-MODEVM Jumpers Jumper Default Position Jumper Description JMP1 Installed Connects analog and digital +5 V supplies JMP2 Open Connects analog and digital grounds JMP3 Open Connects I2C SDA pull-up to IOVDD JMP4 Open Connects I2C SCL pull-up to IOVDD JMP5 2-3 When connecting 2-3, /SS comes from FSX; when connecting 1-2, /SS comes from CNTL JMP6 1-2 When connecting 1-2, +5 VD comes from USB; when connecting 2-3, +5 VD comes from U2 JMP7 1-2 When connecting 1-2, MCLKI comes from USB; when connecting 2-3, MCLKI comes from AVSS/DVSS JMP8 Open Connects resistor across EXT MCLK Windows 7 Instructions For use of the MODEVM motherboard on Windows 7 machines, the most up-to-date version of National Instrument’s VISA™ drivers must be installed (ni.com). After this is installed, the USB-MODEVM Windows XP/Windows Vista/Windows 7 driver must also be installed (SLAC521). SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 5 EVM Description and Basics 2.2.2 www.ti.com TLV320AIC3105 Jumper Locations Table 3 provides a list of jumpers found on the EVM and their factory default conditions. Table 3. List of Jumpers 2.3 2.3.1 Jumper Default Position Jumper Description JMP1 Installed Connects analog and digital grounds JMP2 Open Selects onboard EEPROM as firmware source JMP3 Installed Connects onboard Mic to IN3L JMP4 Installed Connects onboard Mic to IN3R JMP5 Installed Provides a means of measuring IOVDD current JMP6 Installed Provides a means of measuring DVDD current JMP7 Installed Provides a means of measuring DRVDD current JMP8 Installed Provides a means of measuring AVDD_DAC current JMP9 Open When installed, allows the USB-MODEVM to hardware reset the device under user control JMP10 2-3 When connecting 2-3, mic bias comes from the MICBIAS pin on the device; when connecting 1-2, mic bias is supplied from the power supply through a resistor, which the user must install JMP11 Installed When installed, shorts across the output capacitor on HPLOUT; remove this jumper if using AC-coupled output drive JMP12 Installed When installed, shorts HPLCOM and HPRCOM. Use only if these signals are set to constant VCM. JMP13 Installed When installed, shorts across the output capacitor on HPLCOM; remove this jumper if using AC-coupled output drive JMP14 Installed When installed, shorts across the output capacitor on HPROUT; remove this jumper if using AC-coupled output drive JMP15 Installed When installed, shorts across the output capacitor on HPRCOM; remove this jumper if using AC-coupled output drive JMP16 2-3 When connecting 2-3, IOVDD is set to +3.3VD; when connecting 1-2, IOVDD and DVDD are shorted at +1.8 VD Analog Signal Connections Analog Inputs The analog inputs to the EVM can be connected through two different methods. The analog input sources can be applied directly to J1(top or bottom side) or through the analog headers (J6-8 and J14) around the edge of the board. The connection details of each header/connector can be found in Appendix A. 2.3.2 Analog Output The analog outputs to the EVM can be connected through two different methods. The analog outputs are available from the J1 and J2 (top or bottom) or they may be accessed through J9, J10, J11, J12, and J13 at the edges of the board. The connection details can be found in Appendix A. 6 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVM Description and Basics www.ti.com 2.4 2.4.1 Digital Signal Connections Digital Inputs and Outputs The digital inputs and outputs of the EVM can be monitored through J4 and J5. If external signals need to be connected to the EVM, digital inputs should be connected via J14 and J15 on the USB-MODEVM and the SW2 switch should be changed accordingly (see Section 2.2.1). The connector details are available in Appendix A.2. 2.4.2 Digital Controls The digital control signals can be applied directly to J4 and J5 (top or bottom side). The modular TLV320AIC3105EVM can also be connected directly to a DSP interface board, such as the 56KINTERFACE or HPA-MCUINTERFACE, or to the USB-MODEVM interface board if purchased as part of the TLV320AIC3105EVM-PDK. See the AIC3105 product folder for this EVM or the TLV320AIC3105 for a current list of compatible interface and/or accessory boards. 2.5 Power Connections The TLV320AIC3105EVM can be powered independently when being used in stand-alone operation or by the USB-MODEVM when it is plugged onto the motherboard. 2.5.1 Stand-Alone Operation When used as a stand-alone EVM, power is applied to J3 directly, making sure to reference the supplies to the appropriate grounds on that connector. CAUTION Verify that all power supplies are within the safe operating limits shown on the TLV320AIC3105 data sheet before applying power to the EVM. J3 provides connection to the common power bus for the TLV320AIC3105EVM. Power is supplied on the pins listed in Table 7. The TLV320AIC3105EVM-PDK motherboard (the USB-MODEVM interface board) supplies power to J3 of the TLV320AIC3105EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on that board. 2.5.2 USB-MODEVM Operation The USB-MODEVM interface board can be powered from several different sources: • USB • 6-Vdc to 10-Vdc AC/DC external wall supply (not included) • Lab power supply When powered from the USB connection, JMP6 should have a shunt from pins 1–2 (this is the default factory configuration). When powered from 6 V to 10 Vdc, either through the J8 terminal block or J9 barrel jack, JMP6 should have a shunt installed on pins 2–3. If power is applied in any of these ways, onboard regulators generate the required supply voltages and no further power supplies are necessary. If lab supplies are used to provide the individual voltages required by the USB-MODEVM interface, JMP6 should have no shunt installed. Voltages are then applied to J2 (+5VA), J3 (+5VD), J4 (+1.8VD), and J5 (+3.3VD). The +1.8VD and +3.3VD can also be generated on the board by the onboard regulators from the +5VD supply; to enable this configuration, the switches on SW1 need to be set to enable the regulators by placing them in the ON position (lower position, looking at the board with text reading rightside up). If +1.8VD and +3.3VD are supplied externally, disable the onboard regulators by placing SW1 switches in the OFF position. Each power supply voltage has an LED (D1-D7) that lights when the power supplies are active. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 7 TLV320AIC3105EVM-PDK Setup and Installation 3 www.ti.com TLV320AIC3105EVM-PDK Setup and Installation The following section provides information on using the TLV320AIC3105EVM-PDK, including set up, program installation, and program usage. NOTE: If using the EVM in stand-alone mode, the software should be installed per the following section, but the hardware configuration may be different. 3.1 Software Installation 1. Locate installation file on the CD-ROM include with the EVM or download the latest version of the software located on the AIC3105 product page. If downloading the software from the Ti Web site, an option is available to allow the user to be notified when the software is updated. 2. Unzip the installation file by clicking on the self-extracting zip file. 3. Install the EVM software by double-clicking the Setup executable and follow the directions. The user may be prompted to restart their computer. This should install all the TLV320AIC310x software and required drivers onto their PC. 3.2 EVM Connections 1. Ensure that the TLV320AIC3105EVM is installed on the USB-MODEVM interface board, aligning J1, J2, J3, J4, and J5 with the corresponding connectors on the USB-MODEVM. 2. Verify that the jumpers and switches are in their default conditions. 3. Attach a USB cable from the PC to the USB-MODEVM interface board. The default configuration will provide power, control signals, and streaming audio via the USB interface from the PC. On the USBMODEVM, LEDs D3-6 should light to indicate the power is being supplied from the USB. 4. For the first connection, the PC should recognize new hardware and begin an initialization process. The user may be prompted to identify the location of the drivers or allow the PC to automatically search for them. Allow the automatic detection option. 5. Once the PC confirms that the hardware is operational, D2 on the USB-MODEVM should light to indicate that the firmware has been loaded and the EVM is ready for use. If the LED is not lite, verify that the drivers were installed and trying to unplug and restart at Step 3. After the TLV320AIC310x software installation (described in Section 3.1) is complete, evaluation and development with the TLV320AIC3105 can begin. 8 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM-PDK Setup and Installation www.ti.com The TLV320AIC310xEVM software can now be launched. The user should see an initial screen that looks similar to Figure 2. Figure 2. Default Software Screen SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 9 TLV320AIC3105EVM Software 4 www.ti.com TLV320AIC3105EVM Software The following section discusses the details and operation of the EVM software. NOTE: For configuration of the codec, the TLV320AIC3105 block diagram located in the TLV320AIC3105 data sheet is a good reference to help determine the signal routing. 4.1 Device Selection for Operation With AIC3105EVM The software that is installed provides operation for several devices. An initial window should appear that looks like Figure 3. For operation with the TLV320AIC3105EVM, the user should select AIC3105 from the pulldown menu and click Accept. The software will take a few seconds to configure the software for operation before proceeding. A progress bar should appear and show the status of the configuration. Figure 3. Device Selection Window 10 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.2 Front Page Indicators and Functions Figure 2 illustrates the main screen of the EVM software. The indicators and buttons located above the tabbed section of the front page are visible regardless of which tab is currently being selected. At the top left of the screen is an Interface indicator. This indicator shows the I2C interface is selected for controlling the TLV320AIC3105. To the right of the interface indicator is a group box called Firmware. This box indicates where the firmware being used is operating from—in this release, the firmware is on the USB-MODEVM, so the user should see USB-MODEVM in the box labeled Located On:. The version of the firmware appears in the Version box below this. To the right, the next group box contains controls for resetting the TLV320AIC3105. A software reset can be done by writing to a register in the TLV320AIC3105, and this is accomplished by pushing the button labeled Software Reset. The TLV320AIC3105 also may be reset by toggling a pin on the TLV320AIC3105, which is done by pushing the Hardware Reset button. CAUTION In order to perform a hardware reset, the RESET jumper (JMP19) must be installed and SW2-7 on the USB-MODEVM must be turned OFF. Failure to do either of these steps results in not generating a hardware reset or causing unstable operation of the EVM, which may require cycling power to the USBMODEVM. Below the Firmware box, the Device Connected LED should be green when the EVM is connected. If the indicator is red, the EVM is not properly connected to the PC. Disconnect the EVM and verify that the drivers were correctly installed, then reconnect and try restarting the software. On the upper right portion of the screen, several indicators are located which provide the status of various portions of the TLV320AIC3105. These indicators are activated by pressing the Indicator Updates button below the Device Connected LED. These indicators, as well as the other indicators on this panel, are updated only when the software's front panel is inactive, once every 20ms. The ADC Overflow and DAC Overflow indicators light when the overflow flags are set in the TLV320AIC3105. Below these indicators are the AGC Noise Threshold Exceeded indicators that show when the AGC noise threshold is exceeded. To the far right of the screen, the Short Circuit Detect indicators show when a short-circuit condition is detected, if this feature has been enabled. Below the short-circuit indicators, the AGC Gain Applied indicators use a bar graph to show the amount of gain which has been applied by the AGC, and indicators that light when the AGC is saturated. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 11 TLV320AIC3105EVM Software 4.3 www.ti.com Preset Configuration Tab The Default Configuration tab Figure 4 provides several different preset configurations of the codec. The Preset Configurations buttons allow the user to choose from the provided defaults. When the selection is made, the Preset Configuration Description are shows a summary of the codec setup associated with the choice made. If the choice is acceptable, the Load button can be pressed and the preset configuration will be loaded into the codec. The user can change to the Command Line Interface tab (see Figure 27) to view the actual settings that were programmed into the codec. Figure 4. Preset Configuration Tab 12 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.4 Audio Input/ADC Tab Figure 5. Audio Input/ADC Tab The Audio Input/ADC tab allows control of the analog input mixer and the ADC. The controls are displayed to look similar to an audio mixing console (see Figure 5). Each analog input channel has a vertical strip that corresponds to that channel. By default, all inputs are muted when the TLV320AIC3105 is powered up. To route an analog input to the ADC: 1. Select the Input Mode button to correctly show if the input signal is single-ended (SE) or fullydifferential (Diff). Inputs that are single-ended should be made to the positive signal terminal. 2. Click on the button of the analog input channel that corresponds to the correct ADC. The caption of the button should change to Active. Note that the user can connect some channels to both ADCs, while others will only connect to one ADC. 3. Adjust the Level control to the desired attenuation for the connected channel. This level adjustment can be done independently for each connection. The TLV320AIC3105 offers a programmable microphone bias that can either be powered down or set to 2.0V, 2.5V, or the power supply voltage of the ADC (AVDD_ADC). Control of the microphone bias (mic bias) voltage is accomplished by using the Mic Bias pulldown menu button above the last two channel strips. To use the onboard microphone, JMP2 and JMP3 must be installed and nothing should be plugged into J6. In order for the mic bias settings in the software to take effect, JMP1 should be set to connect positions 2 and 3, so that mic bias is controlled by the TLV320AIC3105. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 13 TLV320AIC3105EVM Software www.ti.com In the upper right portion of this tab are controls for Weak Common Mode Bias. Enabling these controls will result in unselected inputs to the ADC channels to be weakly biased to the ADC common mode voltage. Below these controls are the controls for the ADC PGA, including the master volume controls for the ADC inputs. Each channel of the ADC can be powered up or down as needed using the Powered Up buttons. PGA soft-stepping for each channel is selected using the pulldown menu control. The two large knobs set the actual ADC PGA Gain and allow adjustment of the PGA gains from 0 dB to 59.5 dB in 0.5-dB steps (excluding Mute). At the extreme counterclockwise rotation, the channel is muted. Rotating the knob clockwise increases the PGA gain, which is displayed in the box directly above the volume control. 4.5 Bypass Paths Tab Figure 6. Bypass Paths Tab The Bypass Paths tab shows the active and passive bypass paths available for control. The passive analog bypass paths allow the inputs to be routed straight through the device to the outputs without turning on any of the internal circuitry. This provides a signal path through the device with minimal power consumption. The active bypass paths allow the inputs to bypass the ADC and DAC functional blocks and be routed to the analog output mixers to be summed into the output amplifiers. 14 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.6 Audio Interface Tab Figure 7. Audio Interface Tab The Audio Interface tab (Figure 7) allows configuration of the audio digital data interface to the TLV320AIC3105. The interface mode may be selected using the Transfer Mode control—selecting either I2S mode, DSP mode, or Right- or Left-Justified modes. Word length can be selected using the Word Length control, and the bit clock rate can also be selected using the Bit Clock rate control. The Data Word Offset, used in TDM mode (see the AIC3105 data sheet) can also be selected on this tab. Along the bottom of this tab are controls for choosing the BLCK and WCLK as being either inputs or outputs. With the codec configured in Slave mode, both the BCLK and WCLK are set to inputs. If the codec is in Master mode, then BCLK and WCLK are configured as outputs. Additionally, two buttons provide the options for placing the DOUT line in a 3-state mode when there is not valid data and transmitting BLCK and WCLK when the codec is powered down. Re-sync of the audio bus is enabled using the controls in the lower right corner of this screen. Re-sync is done if the group delay changes by more than ±FS/4 for the ADC or DAC sample rates (see the TLV320AIC3105 data sheet). The channels can be soft muted when doing the re-sync if the Soft Mute button is enabled. The default mode for the EVM is configured as 44.1 kHz, 16-bit, I2 words, and the codec is a slave (BCLK and WCLK are supplied to the codec externally). For use with the PC software and the USB-MODEVM, the default settings should be used; no change to the software are required. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 15 TLV320AIC3105EVM Software 4.7 www.ti.com Clocks Tab Figure 8. Clocks Tab The TLV320AIC3105 provides a phase-locked loop (PLL) that allows flexibility in the clock generation for the ADC and DAC sample rates. The Clocks tab contains the controls that can be used to configure the TLV320AIC3105 for operation with a wide range of master clocks. See the Audio Clock Generation Processing figure in the TLV320AIC3105 data sheet for further details of selecting the correct clock settings. For use with the PC software and the USB-MODEVM, the clock settings must be set a certain way. If the settings are changed from the default settings which allow operation from the USB-MODEVM clock reference, the EVM settings can be restored automatically by pushing the Load EVM Clock Settings button at the bottom of this tab. Note that changing any of the clock settings from the values loaded when this button is pushed may result in the EVM not working properly with the PC software or USB interface. If an external audio bus is used (audio not driven over the USB bus), then settings may be changed to any valid combination. See Figure 8. 4.7.1 Configuring the Codec Clocks and Fsref Calculation The codec clock source is chosen by the CODEC_CLK Source control. When this control is set to CLKDIV_OUT, the PLL is not used; when set to PLLDIV_OUT, the PLL is used to generate the clocks. NOTE: Per the TLV320AIC3105 data sheet, the codec should be configured to allow the value of Fsref to fall between the values of 39 kHz to 53 kHz. 16 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.7.1.1 Use Without PLL Setting up the TLV320AIC3105 for clocking without using the PLL permits the lowest power consumption by the codec. The CLKDIV_IN source can be selected as either MCLK or BCLK; the default is MCLK. The CLKDIV_IN frequency is then entered into the CLKDIV_IN box, in megahertz (MHz). The default value shown, 11.2896 MHz, is the frequency used on the USB-MODEVM board. This value is then divided by the value of Q, which can be set from 2 to 17; the resulting CLKDIV_OUT frequency is shown in the indicator next to the Q control. The result frequency is shown as the Actual Fsref. 4.7.1.2 Use With PLL When PLLDIV_OUT is selected as the codec clock source, the PLL is used. The PLL clock source is chosen using the PLLCLK_IN control, and may be set to either MCLK or BCLK. The PLLCLK_IN frequency is then entered into the PLLCLK_IN Source box. The PLL_OUT and PLLDIV_OUT indicators show the resulting PLL output frequencies with the values set for the P, K, and R parameters of the PLL. See the TLV320AIC3105 data sheet for an explanation of these parameters. The parameters can be set by clicking on the up/down arrows of the P, K, and R combo boxes, or they can be typed into these boxes. The values can also be calculated by the PC software. To use the PC software to find the ideal values of P, K, and R for a given PLL input frequency and desired Fsref: 1. Verify the correct reference frequency is entered into the PLLCLK_IN Source box in megahertz (MHz) 2. The desired Fsref should be set using the Fsref switch. 3. Push the Search for Ideal Settings button. The software will start searching for ideal combinations of P, K, and R which achieve the desired Fsref. The possible settings for these parameters are displayed in the spreadsheet-like table labeled Possible Settings. 4. Click on a row in this table to select the P, K, and R values located in that row. Notice that when this is done, the software updates the P, K, R, PLL_OUT and PLLDIV_OUT readings, as well as the Actual Fsref and Error displays. The values show the calculations based on the values that were selected. This process does not actually load the values into the TLV320AIC3105, however; it only updates the displays in the software. If more than one row exists, the user can choose the other rows to see which of the possible settings comes closest to the ideal settings. When a suitable combination of P, K, and R have been chosen, pressing the Load Settings into Device? button will download these values into the appropriate registers on the TLV320AIC3105. 4.7.1.3 Setting ADC and DAC Sampling Rates The Fsref frequency that determines either enabling or bypassing the PLL (see Section 4.7.1.1 or Section 4.7.1.2) is used to determine the actual ADC and DAC sampling rates. Using the NADC and NDAC factors the sampling rates are derived from the Fsref. If dual rate mode is desired, this option can be enabled for either the ADC or DAC by pressing the corresponding Dual Rate Mode button. The ADC and DAC sampling rates are shown in the box to the right of each control. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 17 TLV320AIC3105EVM Software 4.8 www.ti.com AGC Tab Figure 9. AGC Tab The AGC tab (see Figure 9) consists of two identical sets of controls, one for the left channel and the other for the right channel. The AGC function is described in the TLV320AIC3105 data sheet. The AGC can be enabled for each channel using the Enable AGC button. Target gain, Attack time in milliseconds, Decay time in milliseconds, and the Maximum PGA Gain Allowed can all be set, respectively, using the four corresponding knobs in each channel. 18 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com The TLV320AIC3105 allows for the Attack and Decay times of the AGC to be setup in two different modes, standard and advanced. The Left/Right AGC Settings button determines the mode selection. The Standardmode provides several preset times that can be selected by adjustments made to the Attackand Decayknobs. If finer control over the times is required, then the Advanced mode is selected to change to the settings. When the Advanced mode is enabled, two tabs should appear that allow separate, advanced control of the Attack and Delay times of the AGC (see Figure 10 and Figure 11). These options allow selection of the base time as well as a multiplier to achieve the actual times shown in the corresponding text box. The Use advanced settings? button should be enabled to program the registers with the correct values selected via the pulldown options for base time and multiplier. Figure 10. Left AGC Settings Figure 11. Advanced Noise gate functions, such as Hysteresis, Enable Clip stepping, Threshold (dB), Signal Detect Debounce (ms), and Noise Detect Debounce (ms) are set using the corresponding controls in the Noise Gate group box for each channel. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 19 TLV320AIC3105EVM Software 4.9 www.ti.com Filters Tab Figure 12. Filters Tab The TLV320AIC3105 has an advanced feature set for applying digital filtering to audio signals. This tab controls all of the filter features of the TLV320AIC3105. In order to use this tab and have plotting of filter responses correct, the DAC sample rate must be set correctly. Therefore, the clocks must be set up correctly in the software following the discussion in Section 4.7. See Figure 12. The AIC3105 digital filtering is available to both the ADC and DAC. The ADC has optional high-pass filtering and allows the digital output from the ADC through digital effects filtering before exiting the codec through the PCM interface. Likewise, the digital audio data can be routed through the digital effects filtering before passing through the optional de-emphasis filter before the DAC. The digital effects filtering can only be connected to either the ADC or DAC, not both at the same time. The Figure 12 is divided into several areas. The left side of the tab, is used to select between the DAC or ADC filters and assist in the selection and calculating the desired filter coefficients. The right hand side of the tab shows a frequency response plot of the digital effects filter selected and the coefficients that are programmed into the device. The plots show the magnitude and phase response of each biquad section, plus the combined responses of the two biquad filters. Note that the plot shows only the responses of the effect filters, not the combined response of those filter along with the de-emphasis and ADC high-pass filters. 20 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.9.1 ADC Filters 4.9.1.1 High-Pass Filter Figure 13. ADC High-Pass Filters The TLV320AIC3105 ADC provides the option of enabling a high-pass filter, which helps to reduce the effects of DC offsets in the system. The Figure 13 tab shows the options for programming various filter associated with the ADC. The high-pass filter has two modes: standard and programmable. The standard high-pass filter option (Figure 14) allows for the selection of the high-pass filter frequency from several preset options that can be chosen with the Left ADC HP Filter and Right ADC HP Filter controls. The four options for this setting are disabled, or three different corner frequencies which are based on the ADC sample rate. Figure 14. ADC High-Pass Filter Settings For custom filter requirements, the programmable function allows custom coefficients to achieve a different filter than provided by the preset filters. The controls for the programmable high-pass filter are located under the Programmable Filters heading. The process should following the following steps: 1. Enter The filter coefficients can be entered in the HP Filter controls near the bottom of the tab. 2. Press the Download Coefficients button to download the coefficients to the codec registers. 3. Enable the Programmable High-Pass Filters by selecting the Left ADC and Right ADC buttons. The programmable high-pass filter should now be correctly programmed and enabled. The ADC can now be enabled with the high-pass filter. 4.9.1.2 Digital Effects Filter - ADC The ADC digital outputs stream can be routed through the digital effects filter in the codec to allow custom audio performance. The digital effects filter cannot operate on both the ADC or DAC at the same time. The digital effects filter operation is discussed in Section 4.9.3 SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 21 TLV320AIC3105EVM Software 4.9.2 www.ti.com DAC Filters Figure 15. DAC Filters 4.9.2.1 De-emphasis Filters The de-emphasis filters used in the TLV320AIC3105 can be programmed as described in the TLV320AIC3105 data sheet, using this tab (Figure 16). Enter the coefficients for the de-emphasis filter response desired. While on this tab, the de-emphasis response is shown on the Effect Filter Response graph; however, note that this response is not included in graphs of other effect responses when on the other filter design tabs. Figure 16. De-emphasis Filters 4.9.2.2 DAC Digital Effects Filter The digital audio input stream can be routed through the digital effects filter in the codec before routing to the DAC to allow custom audio performance. The digital effects filter cannot operate on both the ADC or DAC at the same time. The digital effects filter operation is discussed in Section 4.9.3 22 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.9.3 Digital Effects Filters The digital effect filters (the biquad filters) of the TLV320AIC3105 are selected using the check boxes shown in Figure 17. The De-emphasis filters are described in the TLV320AIC3105 data sheet, and their coefficients may be changed (see Figure 15). Figure 17. Enabling Filters When designing filters for use with TLV320AIC3105, the software allows for several different filter types to be used. These options are shown on a tab control in the lower left corner of the screen. When a filter type is selected, and suitable input parameters defined, the response will be shown in the Effect Filter Response graph. Regardless of the setting for enabling the Effect Filter, the filter coefficients are not loaded into the TLV320AIC3105 until the Download Coefficients button is pressed. To avoid noise during the update of coefficients, it is recommended that the user uncheck the Effect Filter enable check boxes before downloading coefficients. Once the desired coefficients are in the TLV320AIC3105, enable the Effect Filters by checking the boxes again. 4.9.3.1 Shelf Filters A shelf filter is a simple filter that applies a gain (positive or negative) to frequencies above or below a certain corner frequency. As shown in Figure 18, in Bass mode a shelf filter applies a gain to frequencies below the corner frequency; in Treble mode the gain is applied to frequencies above the corner frequency. Figure 18. Shelf Filters To use these filters, enter the gain desired and the corner frequency. Choose the mode to use (Bass or Treble); the response will be plotted on the Effect Filter Response graph. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 23 TLV320AIC3105EVM Software 4.9.3.2 www.ti.com EQ Filters EQ, or parametric, filters can be designed on this tab (see Figure 19). Enter a gain, bandwidth, and a center frequency (Fc). Either bandpass (positive gain) or band-reject (negative gain) filters can be created Figure 19. EQ Filters 4.9.3.3 Analog Simulation Filters Biquads are good at simulating analog filter designs. For each biquad section on this tab, enter the desired analog filter type to simulate (Butterworth, Chebyshev, Inverse Chebyshev, Elliptic or Bessel). Parameter entry boxes appropriate to the filter type will be shown (ripple, for example, with Chebyshev filters, etc.). Enter the desired design parameters and the response is shown. (See Figure 20.) Figure 20. Analog Simulation Filters 24 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.9.3.4 Preset Filters Many applications are designed to provide preset filters common for certain types of program material. This tab (see Figure 21) allows selection of one of four preset filter responses - Rock, Jazz, Classical, or Pop. Figure 21. Preset Filters 4.9.3.5 User Filters If filter coefficients are known, they can be entered directly on this tab (see Figure 22) for both biquads for both left and right channels. The filter response are not shown on the Effect Filter Response graph for user filters. Figure 22. User Filters SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 25 TLV320AIC3105EVM Software 4.9.3.6 www.ti.com 3D Effect The 3D effect is described in the TLV320AIC3105 data sheet. It uses the two biquad sections differently than most other effect filter settings. To use this effect properly, ensure that the appropriate coefficients are already loaded into the two biquad sections. The User Filters tab can be used to load the coefficients. See Figure 23. Figure 23. 3D Effect Settings To enable the 3D effect, check the 3D Effect On box. The Depth knob controls the value of the 3D Attenuation Coefficient. 26 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.10 Output Stage Configuration Tab Figure 24. Output Stage Configuration Tab The Output Stage Configuration tab (Figure 24) allows for setting various features of the output drivers. The Configuration control can be set as either Fully-Differential or Pseudo-Differential. This control is used to determine if the output stage is being used to drive a fully differential output load or a output load where one of the outputs if referenced to a common-mode voltage (pseudo-differential). The output Coupling control can be chosen as either Capless or AC-coupled. This setting should correspond to the setting of the hardware switch (SW1) on the TLV320AIC3105EVM. The common mode voltage of the outputs may be set to 1.35 V, 1.5 V, 1.65 V, or 1.8 V using the Common Mode Voltage control. The TLV320AIC3105 offers several options to help reduce the turn-on/off pop of the output amplifiers. The Power-On Delay of the output drivers can be set using the corresponding control from 0 μs up to 4 s. Ramp-Up Step Timing can also be adjusted from 0 ms to 4 ms. The outputs can be set to soft-step their volume changes, using the Output Volume Soft Stepping control, and set to step once per Fs period, once per two Fs periods, or soft-stepping can be disabled altogether. The high power outputs of the TLV320AIC3105 can be configured to go to a weak common-mode voltage when powered down. The source of this weak common-mode voltage can be set on this tab with the Weak Output CM Voltage Source drop-down. Choices for the source are either a resistor divider off the AVDD_DAC supply, or a bandgap reference. See the data sheet for more details on this option. Output short-circuit protection can be enabled in the Short Circuit Protection group box. Short Circuit Protection can use a current-limit mode, where the drivers will limit current output if a short-circuit condition is detected, or in a mode where the drivers will power down when such a condition exists. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 27 TLV320AIC3105EVM Software www.ti.com The I2C Bus Error Detection button allows the user to enable circuitry which sets a register bit (Register 107, D0) if an I2C bus error is detected. 4.11 DAC/Line Outputs Tab Figure 25. DAC/Line Outputs Tab The DAC/Line Outputs tab controls the DAC power and volume, as well as routing of digital data to the DACs and the analog line output from the DACs. (See Figure 25.) 4.11.1 DAC Controls On the left side of this tab are controls for the left and right DACs. In similar fashion as the ADC, the DAC controls are set up to allow powering of each DAC individually, and setting the output level. Each channel's level can be set independently using the corresponding Volume knob. Alternately, by checking the Slave to Right box, the left channel Volume can be made to track the right channel Volume knob setting; checking the Slave to Left box causes the right channel Volume knob to track the left Volume knob setting. Data going to the DACs is selected using the drop-down boxes under the Left and Right DAC Datapath. Each DAC channel can be selected to be off, use left channel data, use right channel data, or use a mono mix of the left and right data. 28 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com Analog audio coming from the DACs is routed to outputs using the Output Path controls in each DAC control panel. The DAC output can be mixed with the analog inputs (LINE2L, LINE2R, PGA_L, PGA_R) and routed to the Line or High Power outputs using the mixer controls for these outputs on this tab (for the line outputs) or on the High Power Outputs tab (for the high power outputs). If the DAC is to be routed directly to either the Line or HP outputs, these can be selected as choices in the Output Path control. Note that if the Line or HP outputs are selected as the Output Path, the mixer controls on this tab and the High Power Output tabs have no effect. 4.11.2 Line Output Mixers On the right side of this tab are horizontal panels where the analog output mixing functions for the line outputs are located. Each line output master volume is controlled by the knob at the far right of these panels, below the line output labels. The output amplifier gain can be muted or set at a value between 0 and 9 dB in 1-dB steps. Power/Enabled status for the line output can also be controlled using the button below this master output knob (Powered Up). If the DAC Output Path control is set to Mix with Analog Inputs, the six knobs in each panel can be used to set the individual level of signals routed and mixed to the line output. LINE2L, LINE2R, PGA_L, PGA_R, and DAC_L and DAC_R levels can each be set to create a custom mix of signals presented to that particular line output. Note: if the DAC Output Path control is set to anything other than Mix with Analog Inputs, these controls have no effect. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 29 TLV320AIC3105EVM Software www.ti.com 4.12 High Power Outputs Tab Figure 26. High Power Outputs Tab This tab contains four horizontal groupings of controls, one for each of the high power outputs. Each output has a mixer to mix the LINE2L, LINE2R, PGA_L, PGA_R, DAC_L and DAC_R signals, assuming that the DACs are not routed directly to the high power outputs (see Section 4.11). At the left of each output strip is a Powered Up button that controls whether the corresponding output is powered up or not. The When powered down button allows the outputs to be tri-stated or driven weakly to a the output common mode voltage. The HPxCOM outputs (HPLCOM and HPRCOM) can be used as independent output channels or can be used as complementary signals to the HPLOUT and HPROUT outputs. In these complementary configurations, the HPxCOM outputs can be selected as Differential of HPxOUT signals to the corresponding outputs or may be set to be a common mode voltage (Constant VCM Out. When used in these configurations, the Powered Up button for the HPxCOM output is disabled, as the power mode for that output will track the power status of the HPL or HPR output that the COM output is tracking. The HPRCOM Config selector allows a couple additional options compared to the HPLCOM Config selector. Differential of HPLCOM allows the HPRCOM to be the complementary signal of HPLCOM for driving a differential load between the HPxCOM outputs. The selector also allows Ext. Feedback/HPLCOM constant VCM as an option. This option is used when the high power outputs are configured for Capless output drive, where HPLCOM is configured as Constant VCM Out. The feedback option provides feedback to the output and lowers the output impedance of HPLCOM. At the right side of the output strip is a master volume knob for that output, which allows the output amplifier gain to be muted or set from 0 to 9 dB in 1-dB steps. 30 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Software www.ti.com 4.13 Command Line Interface Tab A simple scripting language controls the TAS1020 on the USB-MODEVM from the LabVIEW™ based PC software. The main program controls, described previously, do nothing more than write a script which is then handed off to an interpreter that sends the appropriate data to the correct USB endpoint. Because this system is script-based, provision is made in this tab for the user to view the scripting commands created as the controls are manipulated, as well as load and execute other scripts that have been written and saved (see Figure 27). This design allows the software to be used as a quick test tool or to help provide troubleshooting information in the rare event that the user encounters problem with this EVM. Figure 27. Command Line Interface Tab A script is loaded into the command buffer, either by operating the controls on the other tabs or by loading a script file. When executed, the return packets of data which result from each command are displayed in the Read Data array control. When executing several commands, the Read Data control shows only the results of the last command. To see the results after every executed command, use the logging function described in the following paragraphs. The File menu (Figure 28) provides some options for working with scripts. The first option, Open Command File..., loads a command file script into the command buffer. This script can then be executed by pressing the Execute Command Buffer button. The second option is Log Script and Results..., which opens a file save dialog box. Choose a location for a log file to be written using this file save dialog. When the Execute Command Buffer button is pressed, the script runs and the script, along with resulting data read back during the script, is saved to the file specified. The log file is a standard text file that can be opened with any text editor, and looks much like the source script file, but with the additional information of the result of each script command executed. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM and TLV320AIC3105EVM-PDK Copyright © 2007–2014, Texas Instruments Incorporated 31 TLV320AIC3105EVM Software www.ti.com The third menu item is a submenu of Recently Opened Files. This is simply a list of script files that have previously been opened, allowing fast access to commonly-used script files. The final menu item is Exit, which terminates the TLV320AIC3105EVM software. Figure 28. File Menu Under the Help menu is an About... menu item which displays information about the TLV320AIC3105EVM software. The actual USB protocol used as well as instructions on writing scripts are detailed in the following subsections. While it is unnecessary to understand or use either the protocol or the scripts directly, understanding them may be helpful to some users. 32 TLV320AIC3105EVM and TLV320AIC3105EVM-PDK SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated www.ti.com Appendix A EVM Connector Descriptions This appendix contains the connection details for each of the main header connectors on the EVM. A.1 Analog Interface Connectors A.1.1 Analog Dual Row Header Details (J13 and J14) For maximum flexibility, the TLV320AIC3105EVM is designed for easy interfacing to multiple analog sources. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10pin, dual-row header/socket combination at J13 and J14. These headers/sockets provide access to the analog input and output pins of the device. Consult Samtec at www.samtec.com or call 1-800-SAMTEC-9 for a variety of mating connector options. Table 4 summarizes the analog interface pinout for the TLV320AIC3105EVM.. Table 4. Analog Interface Pinout PIN NUMBER SIGNAL DESCRIPTION J1.1 HPLCOM High Power Output Driver (Left Minus or Multifunctional) J1.2 HPLOUT High Power Output Driver (Left Plus) J1.3 HPRCOM High Power Output Driver (Right Minus or Multifunctional) J1.4 HPROUT High Power Output Driver (Right Plus) J1.5 LINE1LM MIC1 or LINE1 Analog Input (Left Minus or Multifunctional) J1.6 LINE1LP MIC1 or LINE1 Analog Input (Left Plus or Multifunctional) J1.7 LINE1RM MIC1 or LINE1 Analog Input (Right Minus or Multifunctional) J1.8 LINE1RP MIC1 or LINE1 Analog Input (Right Plus or Multifunctional) J1.9 AGND Analog Ground J1.10 MIC3L MIC3 Input (Left or Multifunctional) J1.11 AGND Analog Ground J1.12 MIC3R MIC3 Input (Right or Multifunctional) J1.13 AGND Analog Ground J1.14 MICBIAS Microphone Bias Voltage Output J1.15 NC Not Connected J1.16 MICDET Microphone Detect J1.17 AGND Analog Ground J1.18 NC Not Connected J1.19 AGND Analog Ground J1.20 NC Not Connected J2.1 LINE2RM MIC2 or LINE2 Analog Input (Right Minus or Multifunctional) J2.2 LINE2RP MIC2 or LINE2 Analog Input (Right Plus or Multifunctional) J2.3 LINE2LM MIC2 or LINE2 Analog Input (Left Minus or Multifunctional) J2.4 LINE2RP MIC2 or LINE2 Analog Input (Left Plus or Multifunctional) J2.5 NC Not Connected J2.6 NC Not Connected J2.7 LEFT_LOP Left Line Output (Plus) J2.8 LEFT_LOM Left Line Output (Minus) J2.9 AGND Analog Ground J2.10 RIGHT_LOP Right Line Output (Plus) J2.11 AGND Analog Ground J2.12 RIGHT_LOM Right Line Output (Minus) J2.13 AGND Analog Ground J2.14 NC Not Connected J2.15 NC Not Connected J2.16 NC Not Connected J2.17 AGND Analog Ground SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVM Connector Descriptions 33 Analog Interface Connectors www.ti.com Table 4. Analog Interface Pinout (continued) A.1.2 PIN NUMBER SIGNAL DESCRIPTION J2.18 NC Not Connected J2.19 AGND Analog Ground J2.20 NC Not Connected Analog Screw Terminal Details (J6-7 and J10-14) In addition to the analog headers, the analog inputs and outputs can also be accessed through alternate connectors, either screw terminals or audio jacks. The stereo microphone input is also tied to J8 and the stereo headphone output (the HP set of outputs) is available at J9. Table 5 summarizes the screw terminals available on the TLV320AIC3105EVM. Table 5. Alternate Analog Connectors 34 DESIGNATOR PIN 1 PIN 2 PIN3 J6 LINE1L LINE1R AGND J7 AGND MIC3 IN RIGHT MIC3 IN LEFT J10 LEFT OUT - LEFT OUT + J11 RIGHT OUT - RIGHT OUT + J12 (+) HPLOUT (-) HPLCOM J13 (+) HPROUT (-) HPRCOM J14 LINE2L LINE2R EVM Connector Descriptions AGND SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Digital Interface Connectors (J4 and J5) www.ti.com A.2 Digital Interface Connectors (J4 and J5) The TLV320AIC3105EVM is designed to easily interface with multiple control platforms. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin, dual-row header/socket combination at J4 and J5. These headers/sockets provide access to the digital control and serial data pins of the device. Consult Samtec at www.samtec.com or call 1-800- SAMTEC-9 for a variety of mating connector options. Table 6 summarizes the digital interface pinout for the TLV320AIC3105EVM. Table 6. Digital Interface Pinout PIN NUMBER SIGNAL DESCRIPTION J4.1 NC Not Connected J4.2 GPIO1 General Purpose Input/Output #1 J4.3 SCLK SPI Serial Clock J4.4 DGND Digital Ground J4.5 NC Not Connected J4.6 GPIO2 General Purpose Input/Output #2 J4.7 /SS SPI Chip Select J4.8 RESET INPUT Reset signal input to AIC33EVM J4.9 NC Not Connected J4.10 DGND Digital Ground J4.11 MOSI SPI MOSI Slave Serial Data Input J4.12 SPI SELECT Select Pin (SPI vs I2C Control Mode) J4.13 MISO SPI MISO Slave Serial Data Output J4.14 AIC33 RESET Reset J4.15 NC Not Connected J4.16 SCL I2C Serial Clock J4.17 NC Not Connected J4.18 DGND Digital Ground J4.19 NC Not Connected J4.20 SDA I2C Serial Data Input/Output J5.1 NC Not Connected J5.2 NC Not Connected J5.3 BCLK Audio Serial Data Bus Bit Clock (Input/Output) J5.4 DGND Digital Ground J5.5 NC Not Connected J5.6 NC Not Connected J5.7 WCLK Audio Serial Data Bus Word Clock (Input/Output) J5.8 NC Not Connected J5.9 NC Not Connected J5.10 DGND Digital Ground J5.11 DIN Audio Serial Data Bus Data Input (Input) J5.12 NC Not Connected J5.13 DOUT Audio Serial Data Bus Data Output (Output) J5.14 NC Not Connected J5.15 NC Not Connected J5.16 SCL I2C Serial Clock J5.17 MCLK Master Clock Input J5.18 DGND Digital Ground J5.19 NC Not Connected J5.20 SDA I2C Serial Data Input/Output SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVM Connector Descriptions 35 Power Supply Connector Pin Header, J3 www.ti.com Note that J5 comprises the signals needed for an I2S serial digital audio interface; the control interface (I2C and RESET) signals are routed to J16. I2C is actually routed to both connectors; however, the device is connected only to J16. A.3 Power Supply Connector Pin Header, J3 J3 provides connection to the common power bus for the TLV320AIC3105EVM. Power is supplied on the pins listed in Table 7. Table 7. Power Supply Pinout SIGNAL PIN NUMBER SIGNAL NC J3.1 J3.2 NC +5VA J3.3 J3.4 NC DGND J3.5 J3.6 AGND DVDD (1.8V) J3.7 J3.8 NC IOVDD (3.3V) J3.9 J3.10 NC The TLV320AIC3105EVM-PDK motherboard (the USB-MODEVM interface board) supplies power to J3 of the TLV320AIC3105EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on that board. 36 EVM Connector Descriptions SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated www.ti.com Appendix B TLV320AIC3105EVM Schematic The schematic diagram for the modular TLV320AIC3105EVM is provided as a reference. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Schematic 37 1 2 3 4 5 6 Revision History REV JMP5 1 TP10 DIN IOVDD TP19 HPROUT 2 DVDD J9 SW1 TP11 WCLK JMP6 C9 1 WCLK 0.1uF TP12 BCLK BCLK MCLK 3 IN1L IN1L C20 0.1uF 10uF C14 10uF TP13 MCLK 1 18 24 25 7 32 1 2 3 4 5 TP29 IN2R LEFT_LOP LEFT_LOM RIGHT_LOP RIGHT_LOM MICBIAS NI B R5 2.2K R6 2.2K IN3L IN3R 0 0.1uF C19 NI C17 0 0.1uF NI RESET TP17 SDA 2 JMP3 JMP4 C15, C16, and C17 are not installed, but can be used to filter noise. 26 MINUS 2 C30 TP31 47nF FLC 3 HPL OUT HPROUT C25 TP26 HPRCOM 19 20 23 22 C31 TP32 47nF FRP 47uF C26 1 J13 PLUS 1 MINUS 2 R13 100 47uF JMP15 27 28 29 30 HPROUT R12 100 2 HPRCOM C32 TP33 47nF FRC 3 HPR OUT HPRCOM LEFT+ LEFT_LOP J10 TP27 R14 PLUS 100 TLV320AIC3105IRHB TP21 C33 47nF TP22 LEFT- IOVDD MINUS 1 2 LEFT OUT R15 LEFT_LOM TP23 RIGHT+ SCL RIGHT_LOP J11 R16 100 R2 C35 47nF TP24 2.7K R3 PLUS 1 MINUS 2 RIGHT- 2.7K RIGHT OUT R17 RIGHT_LOM 100 SDA B C34 47nF C36 47nF ti MK1 A C 1 1 2 IN3R PLUS 1 2 100 RESET 47nF FLP JMP14 100K IN3L EXT MIC IN 2 HPLCOM 1 R9 TP16 SCL 1 U3 TP15 C16 R8 SJ1-3515-SMT TP8 C18 R7 J8 TP7 TP30 HPLCOM DRVSS AVSS 2 HPCOM AVSS_DAC DRVSS DVSS 6 21 TP14 31 C15 MIC/LINE 3 IN 1 2 3 RESET TP5 MICBIAS 3 SDA SCL IN3R MIC3L/LINE3L MIC3R/LINE3R MICBIAS 9 8 10uF 14 16 15 AVSS_ADC 2 IN3L HPLOUT HPLCOM HPROUT HPRCOM MIC2L/LINE2L MIC2R/LINE2R 17 1 C13 MIC BIAS SEL 12 13 J7 R4 NI JMP10 DVDD 0.1uF MIC/LINE 2 IN +3.3VA MIC1L/LINE1L MIC1R/LINE1R DRVDD DRVDD AVDD_DAC C28 IOVDD 10 11 MCLK BCLK WCLK DIN DOUT 0.1uF C29 J12 R11 100 47uF JMP13 JMP12 0.1uF C4 C27 1 C24 2 C12 J14 IN2R AVDD_DAC HPLOUT R10 100 47uF 1 10uF 2 HPLOUT C23 TP25 HPLCOM 0.1uF TP28 IN2L 2 IN2R JMP11 1 JMP8 TP4 IN1R 3 IN2L DRVDD 10uF MIC/LINE 1 IN SJ1-3515-SMT HEADSET OUTPUT 2 C3 1 IN2L 47uF 0.1uF 0.1uF C C22 C11 C7 IN1R TP20 HPLOUT ESW_EG4208 JMP7 C8 2 IN1R C10 1 J6 D C21 47uF 2 DIN TP3 IN1L Approved TP9 DOUT DOUT D ECN Number MD9745APZ-F DATA ACQUISITION PRODUCTS MICROPHONE HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS TLV320AIC3105EVM DRAWN BY BOB BENJAMIN DOCUMENT CONTROL NO. 6487974 SHEET 1 2 3 4 5 1 OF 2 SIZE A REV A DATE 30-Nov-2006 FILE 6 A 1 2 3 4 5 6 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D D J1 HPLCOM 1 3 5 7 9 11 13 15 17 19 HPRCOM IN1L IN2L A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND J4 HPLOUT 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 HPROUT IN1R IN2R IN3L IN3R MICBIAS CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 2 4 6 8 10 12 14 16 18 20 JMP9 1 2 RESET DAUGHTER-SERIAL DAUGHTER-ANALOG J4A (TOP) = SAM_TSM-110-01-L-DV-P J4B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K TP6 TP18 J1A (TOP) = SAM_TSM-110-01-L-DV-P J1B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K TP1 AGND C TP2 DGND C JMP1 1 +3.3VA +5VA 3 C5 0.1uF AVDD_DAC DRVDD 2 VOUT SCL C2 10uF SDA 1 C1 10uF VIN GND U1 REG1117-3.3 RESET 2 DOUT DIN WCLK BCLK J2 LEFT_LOM RIGHT_LOP RIGHT_LOM +5VA 6 J5A (TOP) = SAM_TSM-110-01-L-DV-P J5B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K U2 IOVDD 8 R1 2.7K DAUGHTER-POWER C6 0.1uF 4 VCC SCL 2 4 6 8 10 VSS J3A (TOP) = SAM_TSM-105-01-L-DV-P J3B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K 24AA64I/SN 1 2 3 IOVDD -VA -5VA AGND VD1 +5VD WP DVDD MCLK 7 J2A (TOP) = SAM_TSM-110-01-L-DV-P J2B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +VA +5VA DGND +1.8VD +3.3VD B DAUGHTER-SERIAL J3 1 3 5 7 9 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 5 DAUGHTER-ANALOG CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 4 6 8 10 12 14 16 18 20 SDA A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 A0 A1 A2 LEFT_LOP A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND J5 2 4 6 8 10 12 14 16 18 20 1 2 3 B 1 3 5 7 9 11 13 15 17 19 ti 2 JMP16 IOVDD JMP2 A 1 DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS DRAWN BY BOB BENJAMIN DOCUMENT CONTROL NO. 6487974 SHEET 1 2 3 4 5 2 OF 2 TLV320AIC3105EVM INTERFACE SIZE B REV A DATE 30-Nov-2006 FILE 6 A www.ti.com Appendix C TLV320AIC3105EVM Layout Views The board layouts for the modular TLV320AIC3105EVM are illustrated in Figure 29 through Figure 34. Figure 29. TLV320AIC3105EVM Assembly Layer Figure 30. TLV320AIC3105EVM Top Layer 38 TLV320AIC3105EVM Layout Views SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Appendix C www.ti.com Figure 31. TLV320AIC3105EVM Layer 3 Figure 32. TLV320AIC3105EVM Layer 4 SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated TLV320AIC3105EVM Layout Views 39 Appendix C www.ti.com Figure 33. TLV320AIC3105EVM Silk Screen Figure 34. TLV320AIC3105EVM Bottom Layer 40 TLV320AIC3105EVM Layout Views SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated www.ti.com Appendix D TLV320AIC3105EVM Bill of Materials The complete bill of materials for the modular TLV320AIC3105EVM is provided in Table 8. Table 8. TLV320AIC3105EVM Bill of Materials QTY Value Ref Des Description Mfr Mfr Part No. 2 0 R8, R9 1/4W 5% Chip Resistor Panasonic ERJ-8GEY0R00V 10 100 R14–R23 1/10W 1% Chip Resistor Panasonic ERJ-3EKF1000V 2 2.2k R6, R7 1/4W 5% Chip Resistor Panasonic ERJ-8GEYJ222V 3 2.7K R11–R13 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V 1 100K R10 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ104V 5 NI R1–R5 Chip Resistor Not Installed — 10 47 nF C35–C44 50V Ceramic chip capacitor, ±10%, X7R TDK C1608X7R1H473K 7 0.1 μF C12–C17, C34 16V Ceramic Chip Capacitor, ±10%, X7R TDK C1608X7R1E104K 10 0.1 μF C4–C11, C21, C22 100V Ceramic Chip Capacitor, ±10%, X7R TDK C3216X7R2E104K 8 10 μF C1–C3, C23–C27 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J106K 6 47 μF C28–C33 6.3V Ceramic Chip Capacitor, ±20%, X5R TDK C3225X5R0J476M 2 NI C19, C20 Ceramic Chip Capacitor Not Installed — 1 NI C18 Ceramic Chip Capacitor Not Installed — 1 U1 Audio Codec Texas Instruments TLV320AIC3105IZQE 1 U2 3.3V LDO Voltage Regulator Texas Instruments REG1117-3.3 1 U3 64K I2C EEPROM MicroChip 24AA64-I/SN 7 J1–J4, J8–J10 Screw Terminal Block, 2 Position On Shore Technology ED555/2DS 3 J5, J11, J12 Screw Terminal Block, 3 Position On Shore Technology ED555/3DS 2 J6, J7 3,5 mm Audio Jack, T-R-S, SMD CUI Inc. SJ1-3515-SMT or alternate KobiConn 161-3335-E 4 J1A, J14A, J16A, J17A 20 Pin SMT Plug Samtec TSM-110-01-L-DV-P 4 J1B, J14B, J16B, J17B 20 pin SMT Socket Samtec SSW-110-22-F-D-VS-K 1 J15A 10 Pin SMT Plug Samtec TSM-105-01-L-DV-P 1 J15B 10 pin SMT Socket Samtec SSW-105-22-F-D-VS-K 1 N/A TLV320AIC3105EVM PWB Texas Instruments 6487980 10 JMP2, JMP3, JMP9, JMP13–JMP19 2 Position Jumper, 0.1" spacing Samtec TSW-102-07-L-S 5 JMP4–JMP8 Bus Wire (18-22 Gauge) — — 2 JMP1, JMP20 3 Position Jumper, 0.1" spacing Samtec TSW-103-07-L-S 3 JMP10–JMP12 3 × 2 Position Header, 0.1" spacing Samtec TSW-103-07-L-D 1 MK1 Omnidirectional Microphone Cartridge Knowles Acoustics MD9745APZ-F 1 SW1 4PDT Right Angle Switch E-Switch EG4208 TP1–TP39, TP42–TP47 Miniature Test Point Terminal Keystone Electronics 5000 2 TP40, TP41 Multipurpose Test Point Terminal Keystone Electronics 5011 15 N/A Header Shorting Block Samtec SNT-100-BK-T 45 Not Installed ATTENTION: All components should be RoHS compliant. Some part numbers may be either leaded or RoHS. Verify purchased components are RoHS compliant. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback TLV320AIC3105EVM Bill of Materials Copyright © 2007–2014, Texas Instruments Incorporated 41 www.ti.com Appendix E USB-MODEVM Schematic The schematic diagrams for the USB-MODEVM interface board (included only in the TLV320AIC3105EVM-PDK) are illustrated in Figure 35 and Figure 36. 1 2 3 4 5 6 REVISION HISTORY REV +3.3VD EXTERNAL I2C 0.1uF U3 1 2 3 4 5 6 7 8 0.1uF USB I2S 16 15 14 13 12 11 10 9 VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND TP10 +3.3VD 4 SCL X1 C19 6.00 MHZ C C20 J7 USB SLAVE CONN 46 47 48 1 3 5 6 7 4 16 28 45 0.1uF U5 100pF GND D+ DVCC 4 3 2 1 C21 R9 1.5K R12 3.09K .001uF R10 27.4 897-30-004-90-000000 R11 C14 47pF 1 2 3 C13 47pF 27.4 1 3 5 7 9 11 1 3 2 VCCA A GND PWR_DWN 6 4 IOVDD 5 31 30 29 27 26 25 24 23 8 21 33 2 C VCCB B DIR 0.1uF MOSI +3.3VD SN74AVC1T45DBV C43 C27 U4 P1.1 16 15 14 13 12 11 10 9 P1.0 +3.3VD C11 0.1uF C12 0.1uF VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND J15 1 2 3 4 5 6 7 8 VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND 0.1uF 1 3 5 7 9 11 2 4 6 8 10 12 EXTERNAL SPI SN74AVC4T245PW INT USB SPI P3.5 D2 P3.4 SML-LX0603YW-TR YELLOW P3.1-P3.2 R17 +3.3VD 100K C36 IOVDD C44 1uF 0.1uF 1 2 3 EXT PWR IN JMP6 PWR SELECT 6VDC-10VDC IN CUI-STACK PJ102-BH 2.5 MM D3 5 6 4 GREEN VIN GND 3 C16 0.33uF 1IN 1IN 1EN 3 9 U2 REG1117-5 D1 C15 DL4001 0.1uF 1GND 2GND 2 VOUT R15 10K C6 10uF SW1 1 2 4 3 VCCA A GND 6 4 5 VCCB B DIR 10 11 12 R16 10K 2EN 2IN 2IN 1RESET 1OUT 1OUT 2RESET 2OUT 2OUT TPS767D318PWP 3.3VD ENABLE 1.8VD ENABLE 22 +3.3VD 18 17 R4 10 IOVDD SN74LVC1G06DBV IOVDD 10uF 0.1uF U16 D8 4 SML-LX0603GW-TR TP6 R25 R26 22.1k 137k R27 R28 25.5k 76.8k R29 R30 28k 56.2k R31 R32 32.4k 48.7k R33 R34 39.2k 36.5k R35 R36 46.4k 30.9k R37 R18 52.3k 30.1k 1 3 2 RED C37 0.1uF IN OUT EN GND FB TPS73201DBV R19 220 C8 10uF IOVDD R38 10M 5 SW3 4 1.2V 9 1.4V 10 1.6V 11 1.8V 12 2.0V 13 2.5V 14 3.0V 15 3.3V 16 8 7 6 5 4 3 2 1 A DATA ACQUISITION PRODUCTS HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP IOVDD SELECT 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA GREEN TITLE ENGINEER RICK DOWNS REGULATOR ENABLE USB-MODEVM INTERFACE DRAWN BY ROBERT BENJAMIN DOCUMENT CONTROL NO. 6463996 SHEET 1 2 3 B U14 D5 D4 SML-LX0603GW-TR C17 0.33uF R24 220 GREEN 10uF 24 23 +3.3VD C39 0.1uF SN74AVC1T45DBV C7 28 C38 2 C25 U9 1 J9 1 3 2 +1.8VD SML-LX0603IW-TR SML-LX0603GW-TR +5VD R14 390 +3.3VD U13 5 +3.3VD P3.3 3 649 ED555/2DS U17 SN74AUP1G125DBV 2 4 IOVDD 0.1uF USB ACTIVE R13 J8 0.1uF RESET P1.2 C10 0.1uF C40 IOVDD SS SCLK P1.3 C24 0.1uF USB RST MISO 1 3 2 VCCA A GND MRESET +3.3VD A SW DIP-8 IOVDD C26 U7 TP11 B 1 2 3 4 5 6 7 8 0.1uF 9 10 11 12 13 14 15 17 18 19 20 22 JMP7 JPR-1X3 16 15 14 13 12 11 10 9 2 4 6 8 10 12 EXTERNAL AUDIO DATA +3.3VD C42 U8 TAS1020BPFB P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 DVDD DVDD DVDD AVDD J14 I2SDOUT SN74AVC1T45DBV XTALO XTALI PLLFILI PLLFILO MCLKI PUR DP DM DVSS DVSS DVSS AVSS 75 BCLK 0.1uF 33pF MA-505 6.000M-C0 SW2 A0 A1 A2 USB I2S USB MCK USB SPI USB RST EXT MCK R20 LRCLK IOVDD 44 43 42 41 40 39 37 38 36 35 34 32 33pF SCL SDA VREN RESET MCLKO2 MCLKO1 CSCLK CDATO CDATI CSYNC CRESET CSCHNE C18 JMP8 JPR-2X1 I2SDIN C23 VCCB B DIR RA1 10K 2 MCLK C35 6 4 IOVDD 5 MRESET TEST EXTEN RSTO P3.0 P3.1 P3.2/XINT P3.3 P3.4 P3.5 NC NC SDA WP VSS 24LC64I/SN 7 C9 0.1uF 4 A0 A1 A2 VCC D IOVDD J10 EXT MCLK SN74LVC1G125DBV U1 8 +3.3VD SN74LVC1G126DBV U10 SN74AVC4T245PW +3.3VD SCL 4 3 USB MCK SN74AVC4T245PW PCA9306DCT 0.1uF U15 2 1 SDA1 SCL1 GND 0.1uF C28 +3.3VD 5 1 3 7 8 5 6 1 2 3 2 4 VREF2 EN SDA2 SCL2 5 VREF1 4 3 1 16 15 14 13 12 11 10 9 6 2 J6 R5 2.7K VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND C22 IOVDD 3 R3 2.7K TP9 C31 U11 VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND C34 2 EXT MCK R23 200k 0.1uF SDA +3.3VD 1 1 2 3 4 5 6 7 8 C30 0.1uF 1 0.1uF U12 +3.3VD 5 +3.3VD 3 IOVDD APPROVED C41 0.1uF 1 C33 +3.3VD 5 IOVDD C32 D ENGINEERING CHANGE NUMBER 4 5 1 OF 2 FILE SIZE B REV D DATE 3-Apr-2007 C:\Work\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\SCH\USB Interface 6 Figure 35. USB-MODEVM Interface Board Schematic (1 of 2) 42 USB-MODEVM Schematic SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Appendix E www.ti.com 1 2 3 4 5 6 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D 1 2 3 D J11 J12 A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA DAUGHTER-ANALOG 1 3 5 7 9 +5VD JMP1 1 -VA -5VA AGND VD1 +5VD SCLK TP2 J12A (TOP) = SAM_TSM-110-01-L-DV-P J12B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K IOVDD +5VD RESET IOVDD C3 TP3 PWR_DWN 2 +5VD C2 JMP3 IOVDD 10uF J1 -5VA J2 +5VA D7 SML-LX0603GW-TR GREEN GREEN J3 +5VD GATE B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 P3.3 P3.4 P3.5 P1.0 C P1.1 P1.2 P1.3 P3.1-P3.2 R7 200k INT +3.3VD R8 R1 2.7K 24 23 22 21 20 19 18 17 16 15 14 13 SN74TVC3010PW MOSI 1 +3.3VD R22 390 D6 SML-LX0603GW-TR GND A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 MISO 1 10uF R6 U6 1 2 3 4 5 6 7 8 9 10 11 12 JMP4 TP4 10uF R21 390 IOVDD SS 2 +5VA C1 0.1uF -5VA 2 4 6 8 10 DAUGHTER-POWER TP7 TP8 AGND DGND 1 -5VA C29 +3.3VD RA2 10k DAUGHTER-SERIAL JMP2 TP1 IOVDD 200k +VA +5VA DGND +1.8VD +3.3VD 2 JPR-2X1 C JMP5 2 4 6 8 10 12 14 16 18 20 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA J13 J11A (TOP) = SAM_TSM-110-01-L-DV-P J11B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +5VA J13A (TOP) = SAM_TSM-105-01-L-DV-P J13B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 1 3 5 7 9 11 13 15 17 19 SCL 200k R2 TP5 +1.8VD C4 C5 10uF 10uF 2.7K SDA MCLK I2SDOUT J4 +1.8VD J5 +3.3VD I2SDIN LRCLK BCLK J16 1 3 5 7 9 11 13 15 17 19 B A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND J17 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 2 4 6 8 10 12 14 16 18 20 B DAUGHTER-SERIAL DAUGHTER-ANALOG J18 J16A (TOP) = SAM_TSM-110-01-L-DV-P J16B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K 1 3 5 7 9 +1.8VD +VA +5VA DGND +1.8VD +3.3VD -VA -5VA AGND VD1 +5VD 2 4 6 8 10 -5VA J17A (TOP) = SAM_TSM-110-01-L-DV-P J17B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K DAUGHTER-POWER +3.3VD +5VD IOVDD J18A (TOP) = SAM_TSM-105-01-L-DV-P J18B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K A A DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA TITLE ENGINEER RICK DOWNS DRAWN BY ROBERT BENJAMIN USB-MODEVM INTERFACE DOCUMENT CONTROL NO. 6463996 SHEET 1 2 3 4 5 2 OF 2 FILE SIZE B DATE 3-Apr-2007 REV D C:\Work\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\SCH\Daughtercard Interface 6 Figure 36. USB-MODEVM Interface Board Schematic (2 of 2) SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback USB-MODEVM Schematic Copyright © 2007–2014, Texas Instruments Incorporated 43 www.ti.com Appendix F USB-MODEVM Layout Views The USB-MODEVM interface board layouts (included only in the TLV320AIC3105EVM-PDK) are illustrated in Figure 37 through Figure 39. Figure 37. USB-MODEVM Assembly Layer Figure 38. USB-MODEVM Top Layer 44 USB-MODEVM Layout Views SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Appendix F www.ti.com Figure 39. USB-MODEVM Bottom Layer SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Layout Views 45 www.ti.com Appendix G USB-MODEVM Bill of Materials The complete bill of materials for USB-MODEVM interface board (included only in the TLV320AIC3105EVM-PDK) is provided in Table 9. Table 9. USB-MODEVM Bill of Materials Designators Description Manufacturer Mfr Part Number R4 10Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ100V R10, R11 27.4Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF27R4V R20 75Ω 1/4W 1% Chip Resistor Panasonic ERJ-14NF75R0U R19 220Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ221V R14, R21, R22 390Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ391V R13 649Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF6490V R9 1.5KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1352V R1–R3, R5–R8 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V R12 3.09KΩ 1/16W 1% Chip Resistor Panasonic ERJ-3EKF3091V R15, R16 10KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1303V R17, R18 100kΩ 1/10W 5%Chip Resistor Panasonic ERJ-3GEYJ1304V RA1 10KΩ 1/8W Octal Isolated Resistor Array CTS Corporation 742C163103JTR C18, C19 33pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H330J C13, C14 47pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H470J C20 100pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H101J C21 1000pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H102J C15 0.1μF 16V Ceramic Chip Capacitor, ±10%, X7R TDK C1608X7R1C104K C16, C17 0.33μF 16V Ceramic Chip Capacitor, ±20%, Y5V TDK C1608X5R1C334K C9–C12, C22–C28 1μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C1608X5R0J1305K C1–C8 10μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J1306K D1 50V, 1A, Diode MELF SMD Micro Commercial Components DL4001 D2 Yellow Light Emitting Diode Lumex SML-LX0603YW-TR D3– D7 Green Light Emitting Diode Lumex SML-LX0603GW-TR D5 Red Light Emitting Diode Lumex SML-LX0603IW-TR Q1, Q2 N-Channel MOSFET Zetex ZXMN6A07F X1 6MHz Crystal SMD Epson MA-505 6.000M-C0 U8 USB Streaming Controller Texas Instruments TAS1020BPFB U2 5V LDO Regulator Texas Instruments REG1117-5 U9 3.3V/1.8V Dual Output LDO Regulator Texas Instruments TPS767D318PWP U3, U4 Quad, 3-State Buffers Texas Instruments SN74LVC125APW U5–U7 Single IC Buffer Driver with Open Drain o/p Texas Instruments SN74LVC1G07DBVR U10 Single 3-State Buffer Texas Instruments SN74LVC1G125DBVR U1 64K 2-Wire Serial EEPROM I2C Microchip 24LC64I/SN USB-MODEVM PCB Texas Instruments 6463995 TP1–TP6, TP9–TP11 Miniature test point terminal Keystone Electronics 5000 TP7, TP8 Multipurpose test point terminal Keystone Electronics 5011 J7 USB Type B Slave Connector Thru-Hole Mill-Max 897-30-004-90-000000 J13, J2–J5, J8 2-position terminal block On Shore Technology ED555/2DS J9 2.5mm power connector CUI Stack PJ-102B J130 BNC connector, female, PC mount AMP/Tyco 414305-1 J131A, J132A, J21A, J22A 20-pin SMT plug Samtec TSM-110-01-L-DV-P J131B, J132B, J21B, J22B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K J133A, J23A 10-pin SMT plug Samtec TSM-105-01-L-DV-P J133B, J23B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K J6 4-pin double row header (2x2) 0.1" Samtec TSW-102-07-L-D J134, J135 12-pin double row header (2x6) 0.1" Samtec TSW-106-07-L-D 46 USB-MODEVM Bill of Materials SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Appendix G www.ti.com Table 9. USB-MODEVM Bill of Materials (continued) Designators Description Manufacturer Mfr Part Number JMP1–JMP4 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP8–JMP14 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP5, JMP6 3-position jumper, 0.1" spacing Samtec TSW-103-07-L-S JMP7 3-position dual row jumper, 0.1" spacing Samtec TSW-103-07-L-D SW1 SMT, half-pitch 2-position switch C&K Division, ITT TDA02H0SK1 SW2 SMT, half-pitch 8-position switch C&K Division, ITT TDA08H0SK1 Jumper plug Samtec SNT-100-BK-T SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Bill of Materials 47 www.ti.com Appendix H USB-MODEVM Protocol H.1 USB-MODEVM Protocol The USB-MODEVM is defined to be a vendor-specific class and is identified on the PC system as an NIVISA device. Because the TAS1020 has several routines in its ROM which are designed for use with HIDclass devices, HID-like structures are used, even though the USB-MODEVM is not an HID-class device. Data is passed from the PC to the TAS1020 using the control endpoint. Data is sent in an HIDSETREPORT (see Table 10): Table 10. USB Control Endpoint HIDSETREPORT Request Part Value Description bmRequestType 0x21 00100001 bRequest 0x09 SET_REPORT wValue 0x00 don't care wIndex 0x03 HID interface is index 3 wLength calculated by host Data Data packet described as follows The data packet consists of the following bytes, shown in Table 11: Table 11. Data Packet Configuration BYTE NUMBER 0 TYPE DESCRIPTION Interface Specifies serial interface and operation. The two values are logically ORed. Operation: READ WRITE 0x00 0x10 GPIO SPI_16 I2C_FAST I2C_STD SPI_8 0x08 0x04 0x02 0x01 0x00 Interface: 1 I2C Slave Address Slave address of I2C device or MSB of 16-bit reg addr for SPI 2 Length Length of data to write/read (number of bytes) 3 Register address Address of register for I2C or 8-bit SPI; LSB of 16-bit address for SPI Data Up to 60 data bytes could be written at a time. EP0 maximum length is 64. The return packet is limited to 42 bytes; so, it is advised to send only 32 bytes at any one time. 4..64 Example usage: Write two bytes (AA, 55) to device starting at register 5 of an I2C device with address A0: [0] [1] [2] [3] [4] [5] 48 0x11 0xA0 0x02 0x05 0xAA 0x55 USB-MODEVM Protocol SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Protocol www.ti.com Do the same with a fast mode I2C device: [0] [1] [2] [3] [4] [5] 0x12 0xA0 0x02 0x05 0xAA 0x55 Now with an SPI device which uses an 8-bit register address: [0] [1] [2] [3] [4] [5] 0x10 0xA0 0x02 0x05 0xAA 0x55 Now, do a 16-bit register address, as found on parts like the TSC2101. Assume the register address (command word) is 0x10E0: [0] [1] [2] [3] [4] [5] 0x14 0x10 --> Note: the I2C address now serves as MSB of reg addr. 0x02 0xE0 0xAA 0x55 In each case, the TAS1020 will return, in an HID interrupt packet, the following: [0] interface byte | status status: REQ_ERROR 0x80 INTF_ERROR 0x40 REQ_DONE 0x20 [1] [2] [3] [4..60] for I2C interfaces, the I2C address as sent for SPI interfaces, the read back data from SPI line for transmission of the corresponding byte length as sent for I2C interfaces, the reg address as sent for SPI interfaces, the read back data from SPI line for transmission of the corresponding byte echo of data packet sent SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Protocol 49 USB-MODEVM Protocol www.ti.com If the command is sent with no problem, the returning byte [0] should be the same as the sent one logically ORed with 0x20. In the preceding first example, the returning packet should be: [0] [1] [2] [3] [4] [5] 0x31 0xA0 0x02 0x05 0xAA 0x55 If for some reason the interface fails (for example, the I2C device does not acknowledge), it would come back as: [0] [1] [2] [3] [4] [5] 0x51 --> interface | INTF_ERROR 0xA0 0x02 0x05 0xAA 0x55 If the request is malformed, that is, the interface byte (byte [0]) takes on a value which is not described above, the return packet would be: [0] [1] [2] [3] [4] [5] 0x93 --> the user sent 0x13, which is not valid, so 0x93 returned 0xA0 0x02 0x05 0xAA 0x55 The preceding examples used writes. Reading is similar: Read two bytes from device starting at register 5 of an I2C device with address A0: [0] [1] [2] [3] 50 0x01 0xA0 0x02 0x05 USB-MODEVM Protocol SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated GPIO Capability www.ti.com The return packet should be [0] [1] [2] [3] [4] [5] 0x21 0xA0 0x02 0x05 0xAA 0x55 assuming that the preceding written values starting at Register 5 were actually written to the device. H.2 GPIO Capability The USB-MODEVM has seven GPIO lines. Access them by specifying the interface to be 0x08, and then using the standard format for packets—but addresses are unnecessary. The GPIO lines are mapped into one byte (see Table 12): Table 12. GPIO Pin Assignments Bit 7 6 5 4 3 2 1 0 x P3.5 P3.4 P3.3 P1.3 P1.2 P1.1 P1.0 Example: write P3.5 to a 1, set all others to 0: [0] [1] [2] [3] [4] 0x18 0x00 0x01 0x00 0x40 --> --> --> --> --> write, GPIO this value is ignored length - ALWAYS a 1 this value is ignored 01000000 The user may also read back from the GPIO to see the state of the pins. Assume the previous example was just written to the port pins. Example: read the GPIO [0] [1] [2] [3] 0x08 0x00 0x01 0x00 --> --> --> --> read, GPIO this value is ignored length - ALWAYS a 1 this value is ignored The return packet should be: [0] [1] [2] [3] [4] H.3 0x28 0x00 0x01 0x00 0x40 Writing Scripts A script is simply a text file that contains data to send to the serial control buses. The scripting language is quite simple, as is the parser for the language. Therefore, the program is not forgiving about mistakes made in the source script file, but the formatting of the file is simple. Consequently, mistakes should be rare. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Protocol 51 Writing Scripts www.ti.com Each line in a script file is one command. No provision is made for extending lines beyond one line. A line is terminated by a carriage return. The first character of a line is the command. Commands are: I Set interface bus to use r Read from the serial control bus w Write to the serial control bus # Comment b Break d Delay The first command, I, sets the interface to use the commands that follow. This command must be followed by one of the following parameters: i2cstd i2cfast spi8 spi16 gpio Standard mode I2C bus Fast mode I2C bus SPI bus with 8-bit register addressing SPI bus with 16-bit register addressing Use the USB-MODEVM GPIO capability For example, if a fast mode I2C bus is used, the script begins with: I i2cfast No data follows the break command. Anything following a comment command is ignored by the parser, provided that it is on the same line. The delay command allows the user to specify a time, in milliseconds, that the script pauses before proceeding. NOTE: UNLIKE ALL OTHER NUMBERS USED IN THE SCRIPT COMMANDS, THE DELAY TIME IS ENTERED IN A DECIMAL FORMAT. Also, note that because of latency in the USB bus as well as the time it takes the processor on the USB-MODEVM to handle requests, the delay time may be imprecise. A series of byte values follows either a read or write command. Each byte value is expressed in hexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to the TAS1020 by the program using the protocol described in Section H.1. The first byte following a read or write command is the I2C slave address of the device (if I2C is used) or the first data byte to write (if SPI is used—note that SPI interfaces are not standardized on protocols, so the meaning of this byte varies with the device being addressed on the SPI bus). The second byte is the starting register address that data is to be written to (again, with I2C; SPI varies—see Section H.1 for additional information about which variations may be necessary for a particular SPI mode). Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes to read, (expressed in hexadecimal). For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x90, starting at a register address of 0x03, one would write: #example script I i2cfast w 90 03 AA 55 r 90 03 2 This script begins with a comment, specifies that a fast I2C bus will be used, and then writes 0xAA 0x55 to the I2C slave device at address 0x90, writing the values into registers 0x03 and 0x04. The script then reads back two bytes from the same device starting at register address 0x03. Note that the slave device value does not change. It is unnecessary to set the R/W bit for I2C devices in the script; the read or write commands does that. 52 USB-MODEVM Protocol SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated Writing Scripts www.ti.com The following example uses an SPI device that requires 16-bit register addresses: # setup TSC2101 for input and output # uses SPI16 interface # this script sets up DAC and ADC at full volume, input from onboard mic # # Page 2: Audio control registers w 10 00 00 00 80 00 00 00 45 31 44 FD 40 00 31 C4 w 13 60 11 20 00 00 00 80 7F 00 C5 FE 31 40 7C 00 02 00 C4 00 00 00 23 10 FE 00 FE 00 Note that blank lines are allowed. However, ensure that the script does not end with a blank line. Although ending with a blank line does not cause the script to fail, the program executes that line, and therefore, may prevent the user from seeing data that was written or read back on the previous command. In this example, the first two bytes of each command are the command word to send to the TSC2101 (0x1000, 0x1360); these are followed by data to write to the device starting at the address specified in the command word. The second line may wrap in the viewer being used to look like more than one line; careful examination shows, however, that only one carriage return is on that line, following the last 00. Any text editor can be used to write these scripts; Jedit is an editor that is highly recommended for general use. For more information, go to: http://www.jedit.org. Once the script is written, it can be used in the command window by running the program, and then selecting Open Command File... from the File menu. Locate the script and open it. The script then is displayed in the command buffer. The user can edit the script once it is in the buffer, but saving of the command buffer is not possible at this time (this feature may be added at a later date). Once the script is in the command buffer, it may be executed by pressing the Execute Command Buffer button. If the script contains breakpoints, the script executes to that point, and the user is presented with a dialog box with a button to press to continue executing the script. When ready to proceed, the user pushes that button, and the script continues. The following is an example of a (partial) script with breakpoints: # # I # setup AIC33 for input and output uses I2C interface i2cfast reg 07 - codec datapath w 30 07 8A r 30 07 1 d 1000 # regs 15/16 - ADC volume, unmute and set to 0dB w 30 0F 00 00 r 30 0F 2 b This script writes the value 8A at register 7, then reads it back to verify that the write was good. A delay of 1000 ms (one second) is placed after the read to pause the script operation. When the script continues, the values 00 00 are written starting at register 0F. This output is verified by reading two bytes and pausing the script again, this time with a break. The script does not continue until the user allows it to by pressing OK in the dialog box that is displayed due to the break. SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated USB-MODEVM Protocol 53 Revision History www.ti.com Revision History Changes from Original (August 2007) to A Revision ..................................................................................................... Page • • • • • Added table describing the USB-MODEVM jumpers. ............................................................................... 5 Added instructions concerning Windows 7 driver installation ....................................................................... 5 Changed contents of the List of Jumpers. ............................................................................................ 6 Changed USB-MODEVM schematics to revision D. ............................................................................... 42 Added USB-MODEVM revision D board layout views. ............................................................................ 44 NOTE: Page numbers for previous revisions may differ from page numbers in the current version. 54 Revision History SLAU217A – July 2007 – Revised January 2014 Submit Documentation Feedback Copyright © 2007–2014, Texas Instruments Incorporated EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM and/or accompanying hardware may or may not be subject to the Federal Communications Commission (FCC) and Industry Canada (IC) rules. For EVMs not subject to the above rules, this evaluation board/kit/module is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES-003 rules, which are designed to provide reasonable protection against radio frequency interference. Operation of the equipment may cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may be required to correct this interference. General Statement for EVMs including a radio User Power/Frequency Use Obligations: This radio is intended for development/professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability of this EVM and its development application(s) must comply with local laws governing radio spectrum allocation and power limits for this evaluation module. It is the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations. Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental/development licenses from local regulatory authorities, which is responsibility of user including its acceptable authorization. For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. For EVMs annotated as IC – INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES-003. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Concerning EVMs including radio transmitters This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concerning EVMs including detachable antennas Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada. Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER 【Important Notice for Users of EVMs for RF Products in Japan】 】 This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan, you are required by Radio Law of Japan to follow the instructions below with respect to this product: 1. 2. 3. Use this product in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product, or Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product. Also, please do not transfer this product, unless you give the same notice above to the transferee. Please note that if you could not follow the instructions above, you will be subject to penalties of Radio Law of Japan. Texas Instruments Japan Limited (address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan http://www.tij.co.jp 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。    上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. Since the EVM is not a completed product, it may not meet all applicable regulatory and safety compliance standards (such as UL, CSA, VDE, CE, RoHS and WEEE) which may normally be associated with similar items. You assume full responsibility to determine and/or assure compliance with any such standards and related certifications as may be applicable. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2014, Texas Instruments Incorporated
TLV320AIC3105EVM 价格&库存

很抱歉,暂时无法提供与“TLV320AIC3105EVM”相匹配的价格&库存,您可以联系我们找货

免费人工找货