TLV320AIC3109EVM-K

User's Guide SLAU738 – September 2017 TLV320AIC3109EVM-K This user's guide describes the characteristics, operation, and use of the TLV320AIC3109EVM, both by itself and as part of the TLV320AIC3109EVM-K. This evaluation module (EVM) is a complete mono audio codec with several inputs and outputs, extensive audio routing, mixing, and effects capabilities. A complete circuit description, schematic diagram, and bill of materials (BOM) are also included. The following related documents are available through the Texas Instruments Web site at www.ti.com. Table 1. EVM-Compatible Device Data Sheets Device Literature Number TLV320AIC3109-Q1 SLASE93 TPS73533-Q1 SBVS252 TAS1020B SLES025 Contents 1 EVM Overview ............................................................................................................... 3 2 EVM Description and Basics ............................................................................................... 6 3 TLV320AIC3109EVM-K Setup and Installation ........................................................................ 12 4 TLV320AIC3109EVM Software........................................................................................... 13 Appendix A EVM Connector Descriptions .................................................................................... 33 Appendix B TLV320AIC3109EVM Schematic................................................................................ 37 Appendix C TLV320AIC3109EVM Layout Views ............................................................................ 40 Appendix D TLV320AIC3109EVM Bill of Materials .......................................................................... 43 Appendix E USB-MODEVM Schematic ....................................................................................... 45 Appendix F USB-MODEVM Layout Views ................................................................................... 47 Appendix G USB-MODEVM Bill of Materials ................................................................................. 49 Appendix H TLV320AIC3109-Q1 Configuration Scripts .................................................................... 51 Appendix I USB-MODEVM Protocol ......................................................................................... 56 List of Figures .................................................................................... 3 ............................................................................................... 4 USB-MODEVM Board....................................................................................................... 5 Analog Section of the TLV320AIC3109EVM ............................................................................. 9 Digital Section of the TLV320AIC3109EVM ............................................................................ 10 Power Supplies for Stand-Alone Operation ............................................................................. 11 Device Selection Window ................................................................................................. 14 Default Software Screen .................................................................................................. 14 Audio Input and ADC Tab ................................................................................................ 16 Bypass Paths ............................................................................................................... 17 Audio Interface Tab ....................................................................................................... 18 Clocks Tab ................................................................................................................. 19 1 TLV320AIC3109EVM Block Diagram 2 TLV320AIC3109EVM Board 3 4 5 6 7 8 9 10 11 12 Microsoft, Windows are registered trademarks of Microsoft Corporation. SPI is a trademark of Motorola, Inc. VISA, LabVIEW are trademarks of National Instruments Corporation. All other trademarks are the property of their respective owners. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 1 www.ti.com 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 .................................................................................................................... Advanced AGC settings ................................................................................................... Filters Tab .................................................................................................................. ADC High Pass Filters .................................................................................................... DAC Filters .................................................................................................................. De-emphasis Filters ........................................................................................................ Shelf Filters ................................................................................................................. EQ Filters ................................................................................................................... Analog Simulation Filters ................................................................................................. Preset Filters ............................................................................................................... User Filters ................................................................................................................. 3D Effect Settings ......................................................................................................... Output Stage Configuration Tab ......................................................................................... DAC/Line Outputs Tab .................................................................................................... High-Power Outputs Tab ................................................................................................. Command Line Interface Tab ............................................................................................ File Menu ................................................................................................................... TLV320AIC3109-Q1 Main Schematics .................................................................................. Connector, Test Points, and Power Distribution Schematics......................................................... TLV320AIC3109EVM Hardware ......................................................................................... TLV320AIC3109EVM Assembly Layer .................................................................................. TLV320AIC3109EVM Top Layer ......................................................................................... TLV320AIC3109EVM Ground Layer..................................................................................... TLV320AIC3109EVM Power Layer ...................................................................................... TLV320AIC3109EVM Bottom Layer ..................................................................................... TLV320AIC3109EVM Bottom Assembly Layer ........................................................................ USB-MODEVM Interface Board Schematic (1 of 2) ................................................................... USB-MODEVM Interface Board Schematic (2 of 2) ................................................................... USB-MODEVM Assembly Layer ......................................................................................... USB-MODEVM Top Layer ................................................................................................ USB-MODEVM Bottom Layer ............................................................................................ AGC Tab 21 21 22 23 23 24 25 25 26 26 26 27 27 29 30 31 32 37 38 39 40 40 41 41 42 42 45 46 47 48 48 List of Tables 1 EVM-Compatible Device Data Sheets .................................................................................... 1 2 List of Jumpers ............................................................................................................... 6 3 USB-MODEVM SW2 Settings 4 USB-MODEVM Jumpers 5 6 7 8 9 10 11 12 13 14 2 ............................................................................................. 7 ................................................................................................... 7 TLV320AIC3109EVM and TLV320AIC3104 GUI Signal Name Relation .......................................... 13 Analog Interface Pinout.................................................................................................... 33 Alternate Analog Connectors ............................................................................................. 34 Digital Interface Pinout .................................................................................................... 35 Power Supply Pinout....................................................................................................... 36 TLV320AIC3109EVM Bill of Materials ................................................................................... 43 USB-MODEVM Bill of Materials .......................................................................................... 49 USB Control Endpoint HIDSETREPORT Request .................................................................... 56 Data Packet Configuration ................................................................................................ 56 GPIO Pin Assignments .................................................................................................... 59 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated EVM Overview www.ti.com 1 EVM Overview 1.1 Features This EVM supports the following features: • Complete development kit for the evaluation of the TLV320AIC3109-Q1 mono audio codec. • Connection points are available for line inputs and outputs, external microphone, and mono headphone. • Onboard microphone for ADC evaluation. • Direct access to digital audio signals and control interface is provided for simple system integration. • USB connection to PC provides power, control, and streaming audio data for easy evaluation. 1.2 Introduction The TLV320AIC3109EVM-K is a complete evaluation and demonstration kit, which includes the TLV320AIC3109EVM and a USB-based motherboard called the USB-MODEVM Interface board. The TLV320AIC3109EVM-K is operational with one USB cable connection to a personal computer. The USB connection provides power, control, and streaming audio data to the EVM kit for reduced setup and configuration. The EVM kit also provides connection points for control signals, audio data, and power for advanced operation, which allows prototyping and connection to the end-user system evaluation. The TLV320AIC3109EVM-K is controlled and configured with the TLV320AIC310xEVM-K Graphical User Interface (GUI) Software, compatible with Microsoft® Windows® operating systems. 1.2.1 TLV320AIC3109EVM-K Block Diagram The TLV320AIC3109EVM consists of two separate circuit boards, the USB-MODEVM and the TLV320AIC3109EVM. The USB-MODEVM is built around a TAS1020B streaming audio USB controller with an 8051-based core. The USB-MODEVM has two EVM positions that allow for the connection of two small evaluation modules or one larger evaluation module. The TLV320AIC3109EVM is designed to fit over both of the smaller evaluation module slots as shown in Figure 1. USB-MODEVM Motherboard External Power Supply Input TLV320AIC3109Q1EVM USB Input TAS1020B Controller I²C, SPI I²S External Control Input TLV320AIC3109-Q1 EVM Position 1 External Digital Audio Input EVM Position 2 Copyright © 2017, Texas Instruments Incorporated Figure 1. TLV320AIC3109EVM Block Diagram SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 3 EVM Overview 1.2.1.1 www.ti.com TLV320AIC3109EVM The TLV320AIC3109EVM showcases the latest Texas Instruments (TI) mono audio codec, the TLV320AIC3109-Q1 (U3). The TLV320AIC3109-Q1 device is a low-power mono audio codec with a mono headphone amplifier and multiple input and output channels that are programmable in single-ended or fully differential configurations. The EVM offers different test points, terminals and headers used to evaluate, test and configure the TLV320AIC3109 audio codec in the board. The layout of the board separates analog and digital sections all layers; the analog input and outputs, and analog power supply regulator are located in the left side of the board, while the right side of the board has all the digital signals, like the I²C lines, digital audio signals and onboard EEPROM. Ground planes for both analog and digital grounds are separated, but two common connection points are available through headers J28 and J29. The EVM was designed following the layout recommendations from TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec. Several connectors at the edge of the board provide access to the different inputs and outputs of the device. Options to evaluate special features, such as capless headphone configuration and internal mic bias generation are also available. Power, digital audio data, and digital connection for the configuration and control of the device is provided by the USB-MODEVM board. The Figure 2 shows the TLV320AIC3109EVM board. PREVIEW ONLY Figure 2. TLV320AIC3109EVM Board 4 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated EVM Overview www.ti.com 1.2.1.2 USB-MODEVM Interface Board The USB-MODEVM board is a motherboard used to configure, control, and provide an interface between a computer and evaluation modules with TI modular EVM form factor. The simple diagram shown in Figure 1 shows only the basic features of the USB-MODEVM Interface board. The USB-MODEVM Interface board is intended to be used in USB mode, where control of the installed EVM is accomplished using the onboard USB controller device, the TAS1020B. Provision is made, however, for driving all the data buses (I2C, SPI™, I2S/AC97) externally. The source of these signals is controlled by SW2 on the USB-MODEVM. Refer to Table 3 for details on the switch settings. Because the TLV320AIC3109EVM is a double-wide modular EVM, it is installed with connections to both EVM positions, which connects the TLV320AIC3109-Q1 digital interface to the I2C control port and audio interface of the TAS1020B. In the factory configuration, the board is ready to use with the TLV320AIC3109EVM. To view all the functions and configuration options available on the USB-MODEVM board, see the USB-MODEVM Interface Board schematic in Appendix E. Figure 3. USB-MODEVM Board SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 5 EVM Description and Basics 2 www.ti.com EVM Description and Basics This section provides information on the analog input and output, digital control, power and general connection of the TLV320AIC3109EVM-K. 2.1 2.1.1 Default Configuration and Connections TLV320AIC3109EVM Default Connections Table 2 provides a list of jumpers found on the EVM and their factory default conditions. Table 2. List of Jumpers 6 Jumper Default Position Jumper Description J7 2-3 Mic bias selection: when connecting 2-3, mic bias comes from the MICBIAS pin on the device; when connecting 1-2, mic bias is supplied from an external power source connected to J6 J8 Open Connects onboard Mic to IN1P J11 Open When installed, shorts across the input AC coupling capacitor on IN2M, for DC measuring purposes only J12 Open When installed, shorts across the input AC coupling capacitor on IN2P, for DC measuring purposes only J14 Open When installed, shorts across the input AC coupling capacitor on IN1M, for DC measuring purposes only J15 Open When installed, shorts across the input AC coupling capacitor on IN1P, for DC measuring purposes only J18 Open When installed, shorts across the output capacitor on HPCOM; remove this jumper if using AC-coupled output drive J19 Open When installed, shorts across the output capacitor on HPOUT; remove this jumper if using AC-coupled output drive J22 2-3 J23 Open J24 Installed Provides a measuring point for AVDD current J25 Installed Provides a measuring point for DRVDD current J26 Installed Provides a measuring point for DVDD current J27 Installed Provides a measuring point for IOVDD current J28 Installed Connects analog and digital grounds on the lower part the board J29 Installed Connects analog and digital grounds on the upper part the board J30 Open IOVDD selection: when connecting 2-3, IOVDD is set to +3.3 VD; when connecting 1-2, IOVDD and DVDD are shorted at +1.8 VD When installed, allows the USB-MODEVM to hardware reset the device under user control Selects onboard EEPROM as firmware source TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated EVM Description and Basics www.ti.com 2.1.2 USB-MODEVM Default Setting Table 3 provides a list of the SW2 settings on the USB=MODEVM. For use with the TLV320AIC3109EVM, set SW-2 positions 1 through 7 to ON, and set SW-2.8 to OFF. Table 3. USB-MODEVM SW2 Settings SW-2 Switch Number Label Switch Description 2 1 A0 USB-MODEVM EEPROM I C Address A0 ON: A0 = 0 OFF: A0 = 1 2 A1 USB-MODEVM EEPROM I2C Address A1 ON: A1 = 0 OFF: A1 = 1 3 A2 USB-MODEVM EEPROM I2C Address A2 ON: A2 = 0 OFF: A2 = 1 4 USB I2S I2S Bus Source Selection ON: I2S Bus connects to TAS1020 OFF: I2S Bus connects to USB-MODEVM J14 5 USB MCK I2S Bus MCLK Source Selection ON: MCLK connects to TAS1020 OFF: MCLK connects to USB-MODEVM J14 6 USB SPI SPI Bus Source Selection ON: SPI Bus connects to TAS1020 OFF: SPI Bus connects to USB-MODEVM J15 7 USB RST RST Source Selection ON: EVM Reset Signal comes from TAS1020 OFF: EVM Reset Signal comes from USB-MODEVM J15 8 EXT MCK External MCLK Selection ON: MCLK Signal is provided from USB-MODEVM J10 OFF: MCLK Signal comes from either selection of SW2-5 Table 4 provides a list of USB-MODEVM jumpers found on the EVM. Table 4. USB-MODEVM Jumpers Jumper Default Position Jumper Description JMP1 Installed JMP2 Open Connects analog and digital grounds JMP3 Open Connects I2C SDA pullup to IOVDD JMP4 Open Connects I2C SCL pullup to IOVDD JMP5 2-3 When connecting 2-3, SS comes from FSX; when connecting 1-2, SS comes from CNTL JMP6 1-2 When connecting 1-2, +5 VD comes from USB; when connecting 2-3, +5 VD comes from U2 JMP7 1-2 When connecting 1-2, MCLKI comes from USB; when connecting 2-3, MCLKI comes from AVSS and DVSS JMP8 Open Connects analog and digital +5-V supplies Connects resistor across EXT MCLK SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 7 EVM Description and Basics 2.2 2.2.1 www.ti.com Analog Signals Analog Inputs The analog inputs to the EVM can be connected through two different methods. The analog input sources can be applied directly to J1 (top or bottom side) or through the analog headers (J10, J13, and J9) around the edge of the board. The connection details of each header and connector are found in Appendix A. The TLV320AIC3109EVM provides a header in parallel with the input capacitors of each one of the IN1 and IN2 inputs; these headers are provided so end-user can configure the device for DC measurement. Refer to TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec for details on the line input specifications. In addition to the IN1 and IN2 line input connectors, the EVM features an onboard microphone and a mono jack for an external microphone, both connected to IN1P input. When the onboard microphone is used, header J8 must be shorted and J9 should not be connected. Similarly, when external mic is used, J8 should be disconnected. Both microphones are biased to the MICBIASIN bias signal, that can be selected with header J7 from either internal mic bias of the audio codec or an external source connected to J6. Details about the location of the analog inputs of the TLV320AIC3109EVM are shown in Figure 4. 2.2.2 Analog Output The analog outputs to the EVM can be connected through two different methods. The analog outputs are available from the J1 and J2 (top or bottom) or they may be accessed through J16, J17, J20, and J21 at the edges of the board. The connection details can be found in Appendix A. The line outputs of the TLV320AIC3109-Q1 include the recommended low pass filter to remove the out-ofband noise that can affect the performance of the receiver device. The headphone output of the EVM includes a low pas filter used for test equipment measurement, available in HPCOM_LPF and HPOUT_LPF test points. Headers J18 and J19 are used to bypass the AC-coupling capacitors of the headphone output so the headphone output terminal can be used in Capless mode. In addition to the headphone output terminal, a mono jack connector (J16) is included to connect a mono headphone with a typical 3.5mm connector. This jack can be configured to support either AC-Couple or Capless mode by changing the position of switch SW1. The selection on the headphone output mode should match with the configuration of the audio codec. Refer to section Section 4.9 for more details on the headphone output mode configuration. The analog output section of the EVM is shown in Figure 4. 8 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated EVM Description and Basics www.ti.com External Micbias Terminal Onboard Mic Header to IN1 External Microphone 3.5-mm Jack IN1 and IN2 Input Terminals Micbias Selection Header Headers to Bypass AC-Coupling caps for IN1 and IN2 Mono Headphone 3.5-mm Jack Onboard Microphone Switch to set CAPLESS or AC-Coupled Headphone Jack Output Low-Pass Filter for Measuring HP Output Mono Headphone Output Terminal Headers to set CAPLESS or AC-Coupled HP Output Terminal Out-of-Band Noise Low Pass Filter Left and Right Line Output Terminals Figure 4. Analog Section of the TLV320AIC3109EVM SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 9 EVM Description and Basics 2.3 2.3.1 www.ti.com Digital Signals Digital Inputs and Outputs The digital inputs and outputs of the EVM can be monitored through J4 and J5. If external signals need to be connected to the EVM, digital inputs should be connected via J14 and J15 on the USB-MODEVM and the SW2 in the motherboard switch should be changed accordingly (see Section 2.1.2). The connector details are available in Section A.2. The EVM features test points to directly measure the digital audio signals coming from the USB-MODEVM board. Additionally, test points are provided to monitor the I²C control signals. A header to connect the RESET pin of the codec with hardware reset signal from the motherboard is provided. This is useful so the user can perform a hardware reset for the audio codec from the GUI without any board modification. The digital section of the TLV320AIC3109EVM is shown in Figure 5. +HDGHU IRU *8,¶V Hardware Reset Test Points for I²C Signals Test Points for Digital Audio Signals Onboard EEPROM Figure 5. Digital Section of the TLV320AIC3109EVM 2.4 Power Connections The TLV320AIC3109EVM requires three power supplies to fully evaluate the audio codec: • +5-V power supply, required to generate +3.3-V supply from the integrated low-dropout voltage regulator (U1) to feed analog power supplies of the codec (AVDD and DRVDD). • +1.8-V power supply, required to feed the digital core voltage supply (DVDD) and digital input and output voltage supply (IOVDD) of the codec. The selection for the digital input and output voltage (IOVDD) is made via IOVDD SEL header (J22). • +3.3-V power supply, required for digital input and output voltage supply (IOVDD) of the codec. The EVM can be powered by external power supplies when being used in stand-alone operation or by the USB-MODEVM when it is plugged onto the motherboard. The following sections discuss each operation mode. 10 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated EVM Description and Basics www.ti.com 2.4.1 Stand-Alone Operation When used as a stand-alone EVM, power is applied to J3 directly, making sure to reference the supplies to the appropriate grounds on that connector. The diagram for the power supplies required for stand-alone operation mode are shown in Figure 6. CAUTION Verify that all power supplies are within the safe operating limits shown in TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec before applying power to the EVM. J3 provides connection to the common power bus for the TLV320AIC3109EVM. Power is supplied on the pins listed in Table 9. Analog Ground J3 +5-V Analog Supply +3.3-V Digital Supply Digital Ground +1.8-V Digital Supply Figure 6. Power Supplies for Stand-Alone Operation 2.4.2 USB-MODEVM Operation The USB-MODEVM Interface board can be powered from several different sources: • USB • 6-Vdc to 10-Vdc AC/DC external wall supply (not included) • Lab power supply When powered from the USB connection, JMP6 should have a shunt from pins 1–2 (this is the default factory configuration). When powered from 6-V to 10-Vdc, either through the J8 terminal block or J9 barrel jack, JMP6 should have a shunt installed on pins 2–3. If power is applied in any of these ways, onboard regulators generate the required supply voltages and no further power supplies are necessary. If laboratory supplies are used to provide the individual voltages required by the USB-MODEVM Interface, JMP6 should have no shunt installed. Voltages are then applied to J2 (+5 VA), J3 (+5 VD), J4 (+1.8 VD), and J5 (+3.3 VD). The +1.8 VD and +3.3 VD can also be generated on the board by the onboard regulators from the +5 VD supply; to enable this configuration, the switches on SW1 need to be set to enable the regulators by placing them in the ON position (lower position, looking at the board with text reading right-side up). If +1.8 VD and +3.3 VD are supplied externally, disable the onboard regulators by placing SW1 switches in the OFF position. Each power supply voltage has an LED (D1–D7) that lights when the power supplies are active. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 11 TLV320AIC3109EVM-K Setup and Installation 3 www.ti.com TLV320AIC3109EVM-K Setup and Installation The following section provides information on using the TLV320AIC3109EVM-K, including set up, program installation, and program usage. NOTE: If using the EVM in stand-alone mode, the software should be installed per Section 3.1, but the hardware configuration may be different. 3.1 Software Installation 1. Download the latest version of the TLV320AIC310xEVM-K GUI. 2. Unzip the installation file by clicking on the self-extracting zip file. 3. Install the EVM software by double-clicking the Setup executable and follow the directions. The user may be prompted to restart their computer. 4. Install the most up-to-date version of National Instrument’s VISA™ drivers. 5. For Windows 7 and above operating systems, download and install the USB-MODEVM Windows XP/Vista/7 Drivers. 3.2 EVM Connections 1. Ensure that the TLV320AIC3109EVM is installed on the USB-MODEVM Interface board, aligning J1, J2, J3, J4, and J5 with the corresponding connectors on the USB-MODEVM. 2. Verify that the jumpers and switches are in their default conditions. 3. Attach a USB cable from the PC to the USB-MODEVM Interface board. The default configuration will provide power, control signals, and streaming audio via the USB interface from the PC. On the USBMODEVM, LEDs D3–5 and D7 should light to indicate the power is being supplied from the USB. 4. For the first connection, the PC should recognize new hardware and begin an initialization process. The user may be prompted to identify the location of the drivers or allow the PC to automatically search for them. Allow the automatic detection option. 5. Once the PC confirms that the hardware is operational, D2 on the USB-MODEVM should light to indicate that the firmware has been loaded and the EVM is ready for use. If the LED is not lit, verify that the drivers were installed by trying to unplug and restart at Step 3. If further problems are found, please refer to the TLV320AIC3xEVM-PDK Series Troubleshooting Guide. After the TLV320AIC3109EVM software installation is complete, evaluation and development with the TLV320AIC3109EVM-K can begin. 12 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4 TLV320AIC3109EVM Software The TLV320AIC3109-Q1 audio codec is a mono version of the TLV320AIC3104 device, so the configuration and control of the TLV320AIC3109EVM is made using the TLV320AIC3104EVM software. Some features of the TLV320AIC3104EVM GUI will not be available for the TLV320AIC3109EVM, detailed information about these features are included in the following sections. As the GUI is adapted for the TLV320AIC3104 device, the names for the signal and internal channels are not the same in some cases for the TLV320AIC3109. In general, the single channel of the TLV320AIC3109-Q1 corresponds to the left channel of the TLV320AIC3104, being the only exception the single headphone output, that corresponds to the right headphone output of the TLV320AIC3104. Table 5 indicates the relationship between the GUI and TLV320AIC3109-Q1 signal and internal block names. Table 5. TLV320AIC3109EVM and TLV320AIC3104 GUI Signal Name Relation Name TLV320AIC3104 GUI TLV320AIC3109EVM Left ADC ADC Right ADC not used Left DAC DAC Right DAC not used Left AGC AGC Right AGC not used IN1L/LINE1L IN1/LINE1 IN1R/LINE1R IN2/LINE2 IN2L/LINE2L not used IN2R/LINE2R not used HPRCOM HPCOM HPROUT HPOUT HPLCOM not used HPLOUT not used TI recommends using only the features mentioned in this user's guide for the evaluation of the TLV320AIC3109-Q1 audio codec; otherwise, the device could present unexpected behavior. The following section discusses the details and operation of the EVM software. NOTE: For codec configuration, the TLV320AIC3109-Q1 block diagram located in TLV320AIC3109Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec is a good reference to help determine the signal routing. 4.1 Device Selection for Operation With TLV320AIC3109EVM The software that is installed provides operation for several devices of the TLV320AIC310X family of audio codecs. An initial window should appear that looks like Figure 7. For operation with the TLV320AIC3109EVM, the user should select AIC3104 from the pull-down menu and click Accept. The program will take a few seconds to configure the software for operation before proceeding. A progress bar should appear and show the status of the configuration. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 13 TLV320AIC3109EVM Software www.ti.com Figure 7. Device Selection Window Once the device is properly configured, the main window of the TV320AIC310x GUI appears. Figure 8 shows the default screen of the GUI. The sections that are shaded in the following captures of the TLV320AIC3104 GUI are not available for the TLV320AIC3109-Q1 evaluation. TI recommends not changing any of the parameters in these sections, otherwise, the performance and behavior of the device cannot be assured. Figure 8. Default Software Screen 14 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.2 Front Page Indicators and Functions Figure 8 illustrates the main screen of the EVM software. The indicators and buttons located above the tabbed section of the front page are visible regardless of which tab is currently being selected. NOTE: All the indicators corresponding to unused blocks of the TLV320AIC3109-Q1 should be ignored. Refer to Table 5 for more information about the unused sections. At the top left of the screen is an Interface indicator. This indicator shows which interface is selected for controlling the TLV320AIC3109-Q1, only I2C is available for this device. To the right of the Interface indicator is a group box called Firmware. This box indicates where the firmware being used is operating from – in this release, the firmware is on the USB-MODEVM, so the user should see USB-MODEVM in the box labeled Located On:. The version of the firmware appears in the Version box below the Located On: box. To the right, the next group box contains controls for resetting the TLV320AIC3109-Q1. A software reset can be done by writing to a register in the TLV320AIC3109-Q1, and this is accomplished by pushing the button labeled Software Reset. The TLV320AIC3109-Q1 also may be reset by toggling a pin on the TLV320AIC3109-Q1, which is done by pushing the Hardware Reset button. CAUTION In order to perform a hardware reset, the RESET jumper (JMP19) must be installed and SW2–7 on the USB-MODEVM must be turned OFF. Failure to do either of these steps results in not generating a hardware reset or causing unstable operation of the EVM, which may require cycling power to the USBMODEVM. Below the Firmware box, the Device Connected LED should be green when the EVM is connected. If the indicator is red, the EVM is not properly connected to the PC. Disconnect the EVM and verify that the drivers were correctly installed, then reconnect; if it does not work, try restarting the software. On the upper right portion of the screen, several indicators are located which provide the status of various portions of the TLV320AIC3109-Q1. These indicators are activated by pressing the Indicator Updates button below the Device Connected LED. These indicators, as well as the other indicators on this panel, are updated only when the front panel of the software is inactive, once every 20 ms. The ADC Overflow and DAC Overflow indicators light when the overflow flags are set in the TLV320AIC3109-Q1. Below these indicators are the AGC Noise Threshold Exceeded indicators that show when the AGC noise threshold is exceeded. To the far right of the screen, the Short Circuit Detect indicators show when a short-circuit condition is detected, if this feature has been enabled. Below the short-circuit indicators, the AGC Gain Applied indicators use a bar graph to show the amount of gain which has been applied by the AGC, and indicators that light when the AGC is saturated. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 15 TLV320AIC3109EVM Software 4.3 www.ti.com Audio Input/ADC Tab The Audio Input/ADC tab allows control of the analog input mixer and the ADC. The controls are displayed to look similar to an audio mixing console, as shown in Figure 9. Each analog input channel has a vertical strip that corresponds to that channel. By default, all inputs are muted when the TLV320AIC3109EVM is powered up. Figure 9. Audio Input and ADC Tab To route an analog input to the ADC: 1. Select the Input Mode button to correctly show if the input signal is single-ended (SE) or fullydifferential (Diff). Inputs that are single-ended should be made to the positive signal terminal. 2. Click on the button of the analog input channel that corresponds to the correct ADC. The caption of the button should change to Active. 3. Adjust the Level control to the desired attenuation for the connected channel. This level adjustment can be done independently for each connection. The TLV320AIC3109-Q1 offers a programmable microphone bias that can either be powered down or set to 2 V, 2.5 V, or the power supply voltage of the ADC (AVDD_ADC). Control of the microphone bias (mic bias) voltage is accomplished by using the Mic Bias pull-down menu button above the last two channel strips. To use the onboard microphone, J8 must be installed and nothing should be plugged into J9. In order for the mic bias settings in the software to take effect, J7 should be set to connect positions 2 and 3 (INT), so that mic bias is controlled by the TLV320AIC3109-Q1. In the upper right portion of this tab are controls for Weak Common Mode Bias. Enabling these controls will result in unselected inputs to the ADC to be weakly biased to the ADC common mode voltage. Below these controls are the controls for the ADC PGA, including the master volume controls for the ADC inputs. The ADC channel can be powered up or down as needed using the Powered Up button. PGA soft-stepping for the ADC channel is selected using the pull-down menu control. The large knob sets the actual ADC PGA Gain and allows adjustment of the PGA gains from 0 dB to 59.5 dB, in 0.5-dB steps (excluding Mute). At the extreme counterclockwise rotation, the channel is muted. Rotating the knob clockwise increases the PGA gain, which is displayed in the box directly above the volume control. 16 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.4 Bypass Paths The Bypass Paths tab shows the active and passive bypass paths available for control. The passive analog bypass paths allow the inputs to be routed straight through the device to the outputs without turning on any of the internal circuitry. This provides a signal path through the device with minimal power consumption. The active bypass paths allow the inputs to bypass the ADC and DAC functional blocks and be routed to the analog output mixers to be summed into the output amplifiers. The Bypass Paths tab is shown in Figure 10. Figure 10. Bypass Paths SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 17 TLV320AIC3109EVM Software 4.5 www.ti.com Audio Interface Tab The Audio Interface tab, shown in Figure 11, allows configuration of the audio digital data interface to the TLV320AIC3109-Q1. Figure 11. Audio Interface Tab The interface mode may be selected using the Transfer Mode control—selecting either I2S mode, DSP mode, or Right- or Left-Justified modes. Word length can be selected using the Word Length control, and the bit clock rate can also be selected using the Bit Clock rate control. The Data Word Offset, used in TDM mode (see TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec) can also be selected on this tab. Along the bottom of this tab are controls for choosing the BLCK and WCLK as being either inputs or outputs. With the codec configured in Slave mode, both the BCLK and WCLK are set to inputs. If the codec is in Master mode, then BCLK and WCLK are configured as outputs. Additionally, two buttons provide the option for placing the DOUT line in a 3-state mode when there is not valid data and transmitting BLCK and WCLK when the codec is powered down. Re-synchronization of the audio bus is enabled using the controls in the lower right corner of this screen. Re-synchronization is done if the group delay changes by more than ±FS / 4 for the ADC or DAC sample rates (see TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec). The channels can be soft muted when doing the re-sync if the Soft Mute button is enabled. The default mode for the EVM is configured as 44.1 kHz, 16-bit, I2S words, and the codec is a slave (BCLK and WCLK are supplied to the codec externally). For use with the PC software and the USBMODEVM, the default settings should be used; no change to the software is required. 18 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.6 Clocks Tab The TLV320AIC3109-Q1 provides a phase-locked loop (PLL) that allows flexibility in the clock generation for the ADC and DAC sample rates. The Clocks tab contains the controls used to configure the TLV320AIC3109-Q1 for operation with a wide range of master clocks. See the Audio Clock Generation Processing figure in TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec for further details of selecting the correct clock settings. For use with the PC software and the USB-MODEVM, the clock settings must be set a certain way. If the settings are changed from the default settings which allow operation from the USB-MODEVM clock reference, the EVM settings can be restored automatically by pushing the Load EVMS Clock Settings button at the bottom of this tab. Note that changing any of the clock settings from the values loaded when this button is pushed may result in the EVM not working properly with the PC software or USB interface. If an external audio bus is used (audio not driven over the USB bus), then settings may be changed to any valid combination. The Clocks tab is shown in Figure 12. Figure 12. Clocks Tab 4.6.1 Configuring the Codec Clocks and Fsref Calculation The codec clock source is chosen by the CODEC_CLK Source control. When this control is set to CLKDIV_OUT, the PLL is not used; when set to PLLDIV_OUT, the PLL is used to generate the clocks. NOTE: Per TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec, the codec should be configured to allow the value of Fsref to fall between the values of 39 kHz to 53 kHz. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 19 TLV320AIC3109EVM Software 4.6.1.1 www.ti.com Use Without PLL Setting up the TLV320AIC3109-Q1 for clocking without using the PLL permits the lowest power consumption by the codec. The CLKDIV_IN source can be selected as either MCLK, GPIO2, or BCLK, the default is MCLK. The CLKDIV_IN frequency is then entered into the CLKDIV_IN box, in megahertz (MHz). The default value shown, 11.2896 MHz, is the frequency used on the USB-MODEVM board. This value is then divided by the value of Q, which can be set from 2 to 17; the resulting CLKDIV_OUT frequency is shown in the indicator next to the Q control. The result frequency is shown as the Actual Fsref. 4.6.1.2 Use With The PLL When PLLDIV_OUT is selected as the codec clock source, the PLL is used. The PLL clock source is chosen using the PLLCLK_IN control, and may be set to either MCLK, GPIO2, or BCLK. The PLLCLK_IN frequency is then entered into the PLLCLK_IN Source box. The PLL_OUT and PLLDIV_OUT indicators show the resulting PLL output frequencies with the values set for the P, K, and R parameters of the PLL. See TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec for an explanation of these parameters. The parameters can be set by clicking on the up or down arrows of the P, K, and R combo boxes, or they can be typed into these boxes. The values can also be calculated by the PC software. To use the PC software to find the ideal values of P, K, and R for a given PLL input frequency and desired Fsref: 1. Verify the correct reference frequency is entered into the PLLCLK_IN Source box in megahertz (MHz). 2. The desired Fsref should be set using the Fsref switch. 3. Push the Search for Ideal Settings button. The software will start searching for ideal combinations of P, K, and R which achieve the desired Fsref. The possible settings for these parameters are displayed in the spreadsheet-like table illustrated in Figure 12, labeled Possible Settings. 4. Click on a row in this table to select the P, K, and R values located in that row. Notice that when this is done, the software updates the P, K, R, PLL_OUT, and PLLDIV_OUT readings, as well as the Actual Fsref and Error displays. The values show the calculations based on the values that were selected. This process does not actually load the values into the TLV320AIC3109-Q1; however, it only updates the displays in the software. If more than one row exists, the user can choose the other rows to see which of the possible settings comes closest to the ideal settings. When a suitable combination of P, K, and R have been chosen, pressing the Load Settings into Device? button will download these values into the appropriate registers on the TLV320AIC3109-Q1. 4.6.1.3 Setting the ADC and DAC Sampling Rates The Fsref frequency that is determined by either enabling or bypassing the PLL (see Section 4.6.1.1 or Section 4.6.1.2) is used to set the actual ADC and DAC sampling rates. Using the NADC and NDAC factors, the sampling rates are derived from the Fsref. If dual-rate mode is desired, this option can be enabled for either the ADC or DAC by pressing the corresponding Dual Rate Mode button. The ADC and DAC sampling rates are shown in the box to the right of each control. 20 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.7 AGC Tab The AGC tab consists a set of controls to configure the automatic Gain Control (AGC) of the TLV320AIC3109-Q1. The AGC function is described in TLV320AIC3109-Q1 Automotive, Low-Power, 96kHz, Mono Audio Codec. The default AGC tab configuration is shown in Figure 13. Figure 13. AGC Tab The AGC can be enabled using the Enable button. Target gain (dB), Attack time (milliseconds), Decay time (milliseconds), and the Maximum PGA Gain Allowed (dB) can all be set, respectively, using the four corresponding knobs. The TLV320AIC3109-Q1 allows for the Attack and Decay times of the AGC to be set up in two different modes, standard and advanced. The AGC Settings button determines the mode selection. The Standard mode provides several preset times that can be selected by adjustments made to the Attack and Decay knobs. If finer control over the times is required, then the Advanced mode should be selected. When the Advanced mode is enabled, two tabs should appear that allow separate, advanced control of the Attack and Delay times of the AGC (see Figure 14). These options allow selection of the base time as well as a multiplier to achieve the actual times shown in the corresponding text box. The Use advanced button should be enabled to program the registers with the correct values selected via the pull-down options for base time and multiplier. Figure 14. Advanced AGC settings SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 21 TLV320AIC3109EVM Software www.ti.com Noise gate functions, such as Hysteresis, Enable Clip stepping, Threshold (dB), Signal Detect Debounce (ms), and Noise Detect Debounce (ms) are set using the corresponding controls in the Noise Gate group box. 4.8 Filters Tab The TLV320AIC3109-Q1 has an advanced feature set for applying digital filtering to audio signals. This tab controls all of the filter features of the TLV320AIC3109-Q1. In order to use this tab and have plotting of filter responses correct, the DAC sample rate must be set correctly. Therefore, the clocks must be set up correctly in the software following the discussion in Section 4.6. The Filters tab is depicted in Figure 15. Figure 15. Filters Tab The AIC3104 digital filtering is available to both the ADC and DAC. The ADC has optional high pass filtering and allows the digital output from the ADC through digital effects filtering before exiting the codec through the PCM interface. Likewise, the digital audio data can be routed through the digital effects filtering before passing through the optional de-emphasis filter before the DAC. The digital effects filtering can only be connected to either the ADC or DAC, not both at the same time. The Filters tab is divided into several areas. The left side of the tab, is used to select between the DAC or ADC filters and assist in the selection and calculating the desired filter coefficients. The right hand side of the tab shows a frequency response plot of the digital effects filter selected and the coefficients that are programmed into the device. The plots show the magnitude and phase response of each biquad section, plus the combined responses of the two biquad filters. Note that the plot shows only the responses of the effect filters, not the combined response of those filter along with the de-emphasis and ADC high-pass filters. 22 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.8.1 ADC Filters 4.8.1.1 High Pass Filter The TLV320AIC3109-Q1 ADC provides the option of enabling a high-pass filter, which helps to reduce the effects of DC offsets in the system. The ADC high-pass filter tab is shown in Figure 16. This tab shows the options for programming various filter associated with the ADC. The high-pass filter has two modes: standard and programmable. The standard high-pass filter option allows the selection of the high-pass filter frequency from several preset options that can be chosen with the ADC HP Filter control. Four options are available for this filter setting, one for disable and other three different corner frequencies which are based on the ADC sample rate. For custom filter requirements, the programmable function allows custom coefficients to achieve a different filter than provided by the preset filters. The controls for the programmable high-pass filter are located under the Programmable Filters heading. The process should use the following steps: 1. The filter coefficients can be entered in the HP Filter controls near the bottom of the tab. 2. Press the Download Coefficients button to download the coefficients to the codec registers. 3. Enable the Programmable High-Pass Filters by selecting the ADC button. The programmable high-pass filter should now be correctly programmed and enabled. The ADC can now be enabled with the high-pass filter. Figure 16. ADC High Pass Filters 4.8.1.2 Digital Effects Filter - ADC The ADC digital outputs stream can be routed through the digital effects filter in the codec to allow custom audio performance. The digital effects filter cannot operate on both the ADC or DAC at the same time. The digital effects filter operation is discussed in Section 4.8.3. 4.8.2 DAC Filters The DAC Filters tab is shown in Figure 17. Detailed information about the different configuration options for the DAC filters is discussed in the following sections. Figure 17. DAC Filters SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 23 TLV320AIC3109EVM Software 4.8.2.1 www.ti.com De-emphasis Filters The de-emphasis filters used in the TLV320AIC3109-Q1 can be programmed as described in TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec, using this tab. Enter the coefficients for the de-emphasis filter response desired. While on this tab, the de-emphasis response is shown on the Effect Filter Response graph; however, note that this response is not included in graphs of other effect responses when on the other filter design tabs. Figure 18. De-emphasis Filters 4.8.2.2 DAC Digital Effects Filter The digital audio input stream can be routed through the digital effects filter in the codec before routing to the DAC to allow custom audio performance. The digital effects filter cannot operate on both the ADC or DAC at the same time. The digital effects filter operation is discussed in Section 4.8.3. 4.8.3 Digital Effects Filters The digital effect filters (or biquad filters) of the TLV320AIC3109-Q1 are selected using the check boxes shown in the Figure 17 tab. The De-emphasis filters are described in TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec, and their coefficients may be changed. When designing filters for use with TLV320AIC3109-Q1, the software allows for several different filter types to be used. These options are shown on a tab control in the lower left corner of the screen. When a filter type is selected, and suitable input parameters defined, the response is shown in the Effect Filter Response graph. Regardless of the setting for enabling the Effect Filter, the filter coefficients are not loaded into the TLV320AIC3109-Q1 until the Download Coefficients button is pressed. To avoid noise during the update of coefficients, it is recommended for the user to uncheck the Effect Filter check box before downloading coefficients. Once the desired coefficients are in the TLV320AIC3109-Q1, enable the filters by checking the Effect Filters box again. 4.8.3.1 Shelf Filters A shelf filter is a simple filter that applies a gain (positive or negative) to frequencies above or below a certain corner frequency. As shown in Figure 19, in Bass mode a shelf filter applies a gain to frequencies below the corner frequency; in Treble mode the gain is applied to frequencies above the corner frequency. 24 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com Figure 19. Shelf Filters To use these filters, enter the gain desired and the corner frequency. Choose the mode to use (Bass or Treble); the response is plotted on the Effect Filter Response graph. 4.8.3.2 EQ Filters EQ, or parametric filters can be designed on this tab, as shown in Figure 20). Enter a gain, bandwidth, and a center frequency (Fc). Either bandpass (positive gain) or band-reject (negative gain) filters can be created Figure 20. EQ Filters 4.8.3.3 Analog Simulation Filters Biquads are quite good at simulating analog filter designs. For each biquad section on this tab, enter the desired analog filter type to simulate (Butterworth, Chebyshev, Inverse Chebyshev, Elliptic, or Bessel). Parameter entry boxes appropriate to the filter type are shown (ripple, for example, with Chebyshev filters, and so forth). Enter the desired design parameters and the response is shown. The Analog Simulation Filters tab is shown in Figure 21. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 25 TLV320AIC3109EVM Software www.ti.com Figure 21. Analog Simulation Filters 4.8.3.4 Preset Filters Many applications are designed to provide preset filters common for certain types of program material. The Preset Filters tab, as shown in Figure 22, allows selection of one of four preset filter responses Rock, Jazz, Classical, or Pop. Figure 22. Preset Filters 4.8.3.5 User Filters If filter coefficients are known, they can be entered directly on this tab for both biquads. The filter response will not be shown on the Effect Filter Response graph for user filters. The User Filters tab is depicted in Figure 23. Figure 23. User Filters 26 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.8.3.6 3-D Effect The 3-D Effect is described in TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec. The 3-D effect uses the two biquad sections in a different way than most other effect filter settings. To use this effect properly, make sure the appropriate coefficients are already loaded into the two biquad sections. The User Filters tab may be used to load the coefficients. Figure 24 shows the 3-D Effect tab. Figure 24. 3D Effect Settings To enable the 3-D effect, check the 3-D Effect On box. The Depth knob controls the value of the 3-D Attenuation Coefficient. 4.9 Output Stage Configuration Tab The Output Stage Configuration tab (shown in Figure 25) allows the setting of different features of the output drivers. Figure 25. Output Stage Configuration Tab SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 27 TLV320AIC3109EVM Software www.ti.com The Configuration control may be set as either Fully-Differential or Pseudo-Differential. This control is used to determine if the output stage is being used to drive a fully differential output load or a output load where one of the outputs if referenced to a common-mode voltage (pseudo-differential). The output Coupling control can be chosen as either Capless or AC-coupled. This setting should correspond to the setting of the hardware switch (SW1) on the TLV320AIC3109EVM (CAPLESS or CAP). The common mode voltage of the outputs may be set to 1.35 V, 1.5 V, 1.65 V, or 1.8 V using the Common Mode Voltage control. The TLV320AIC3109-Q1 offers several options to help reduce the turnon and turnoff pop of the output amplifiers. The Power-On Delay of the output drivers can be set using the corresponding control from 0's up to 4 seconds. Ramp-Up Step Timing can also be adjusted from 0ms to 4ms. The outputs can be set to soft-step their volume changes, using the Output Volume Soft Stepping control, and set to step once per Fs period, once per two Fs periods, or soft-stepping can be disabled altogether. The high-power outputs of the TLV320AIC3109-Q1 can be configured to go to a weak common-mode voltage when powered down. The source of this weak common-mode voltage can be set on this tab with the Weak Output CM Voltage Source drop-down. Choices for the source are either a resistor divider off the AVDD_DAC supply, or a bandgap reference. Refer to TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec for more details on this option. Headset detection features are enabled using the Enable button in the Headset Detection group box. When enabled, the indicators in the HS/Button Detect group box will light when either a button press or headset is detected. When a headset is detected, the type of headset is displayed in the Detection Type indicator. Debounce times for detection are set using the Jack Detect Debounce and Button Press Debounce controls, which offer debounce times in different numbers of milliseconds. Refer to TLV320AIC3109-Q1 Automotive, Low-Power, 96-kHz, Mono Audio Codec for more information regarding headset detection. Output short-circuit protection can be enabled in the Short Circuit Protection group box. Short Circuit Protection can use a current-limit mode, where the drivers will limit current output if a short-circuit condition is detected, or in a mode where the drivers will power down when such a condition exists. The I2C Bus Error Detection button allows the user to enable circuitry which will set a register bit (Register 107, D0) if an I2C bus error is detected. 4.10 DAC/Line Outputs Tab The DAC/Line Outputs tab controls the DAC power and volume, as well as routing of digital data to the DAC and the analog line output from the DAC. The default configuration of the DAC/Line Outputs tab is shown in Figure 26. 28 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com Figure 26. DAC/Line Outputs Tab 4.10.1 DAC Controls On the left side of this tab are controls for the DAC. In similar fashion as the ADC, the DAC controls are set to allow control over the powering and volume setting of the DAC. The DAC volume level can be set by using the Volume knob. The data from the audio serial interface used by the DAC is selected using the drop-down boxes under the DAC Datapath. The DAC channel can be selected to be off, use left channel data, use right channel data, or use a mono mix of the left and right data. Analog audio coming from the DACs is routed to outputs using the Output Path controls in DAC control panel. The DAC output can be mixed with the analog inputs (PGA_L, PGA_R) and routed to the Line or High Power outputs using the mixer controls for these outputs on this tab (for the line outputs) or on the High Power Outputs tab (for the high power outputs). If the DAC is to be routed directly to either the Line or HP outputs, these can be selected as choices in the Output Path control. Note that if the Line or HP outputs are selected as the Output Path, the mixer controls on this tab and the High Power Output tabs have no effect. 4.10.2 Line Output Mixers On the right side of this tab are horizontal panels where the analog output mixing functions for the line outputs are located. Each line output master volume is controlled by the knob at the far right of these panels, below the line output labels. The output amplifier gain can be muted or set at a value between 0 and 9 dB in 1-dB steps. Power/Enabled status for the line output can also be controlled using the button below this master output knob (Powered Up). If the DAC Output Path control is set to Mix with Analog Inputs, the knobs in each panel can be used to set the individual level of signals routed and mixed to the line output. PGA_L, PGA_R, and DAC_L levels can each be set to create a custom mix of signals presented to that particular line output. NOTE: If the DAC Output Path control is set to anything other than Mix with Analog Inputs, these controls have no effect. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 29 TLV320AIC3109EVM Software www.ti.com 4.11 High-Power Outputs Tab Figure 27. High-Power Outputs Tab The High-Power Outputs tab contains horizontal groupings of controls, one for each one of the high power outputs. Each output has a mixer to mix the PGA_L, PGA_R, and DAC_L signals, assuming that the DACs are not routed directly to the high power outputs. The High-Power Outputs tab is shown in Section 4.10. At the left of each output strip is a Powered Up button that controls whether the corresponding output is powered up or not. The When powered down button allows the outputs to be tri-stated or driven weakly to the output common mode voltage. The HPCOM output can be used as an independent output channel or can be used as a complementary signal to the HPOUT output. In these complementary configurations, the HPCOM output can be selected as Differential of HPOUT signal to the HPOUT output or may be set to be a common mode voltage (Constant VCM Out). When used in these configurations, the Powered Up button for the HPCOM output is disabled, as the power mode for that output will track the power status of the HPOUT output. The selection of Differential of HPLCOM or Ext. Feedback/HPLCOM constant VCM should not be selected for the TLV320AIC3109EVM evaluation. At the right side of the output strip is a master volume knob for that output, which allows the output amplifier gain to be muted or set from 0 to 9 dB in 1-dB steps. 4.12 Preset Configurations Tab The Preset Configurations tab should be ignored for the evaluation of the TLV320AIC3109-Q1 as the configuration used in that tab is relevant for the TLV320AIC3104 device only. Scripts for the correct configuration of the TLV320AIC3109EVM are included in Appendix H. These scripts can be loaded into the EVM by using the Command Line Interface tab, shown in Figure 28. 30 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated TLV320AIC3109EVM Software www.ti.com 4.13 Command Line Interface Tab A simple scripting language controls the TAS1020 on the USB-MODEVM from the LabVIEW™ based PC software. The main program controls, described previously, do nothing more than write a script which is then handed off to an interpreter that sends the appropriate data to the correct USB endpoint. Because this system is script-based, provision is made in this tab for the user to view the scripting commands created as the controls are manipulated, as well as load and execute other scripts that have been written and saved. The Command Line Interface tab is shown in Figure 28. This design allows the software to be used as a quick test tool or to help provide troubleshooting information in the rare event that the user encounters problem with this EVM. Figure 28. Command Line Interface Tab A script is loaded into the command buffer, either by operating the controls on the other tabs or by loading a script file. When executed, the return packets of data which result from each command is displayed in the Read Data array control. When executing several commands, the Read Data control shows only the results of the last command. To see the results after every executed command, use the logging function described in the following paragraphs. The File menu depicted in Figure 29 provides some options for working with scripts. The first option, Open Command File..., loads a command file script into the command buffer. This script can then be executed by pressing the Execute Command Buffer button. The second option, Save Command File..., opens a save dialog box and then saves the text loaded in the Command Buffer into a text file defined by the user. The third option is Log Script and Results..., which opens a file save dialog box. Choose a location for a log file to be written using this file save dialog. When the Execute Command Buffer button is pressed, the script runs and the script, along with resulting data read back during the script, will be saved to the file specified. The log file is a standard text file that can be opened with any text editor, and looks much like the source script file, but with the additional information of the result of each script command executed. SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM-K Copyright © 2017, Texas Instruments Incorporated 31 TLV320AIC3109EVM Software www.ti.com Figure 29. File Menu Under the Help menu is an About... menu item which displays information about the TLV320AIC3109EVM software. The actual USB protocol used as well as instructions on writing scripts are detailed in the following subsections. While it is not necessary to understand or use either the protocol or the scripts directly, understanding them may be helpful to some users. 32 TLV320AIC3109EVM-K SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix A SLAU738 – September 2017 EVM Connector Descriptions A.1 Analog Interface Connectors This appendix contains the connection details for each of the main header connectors on the EVM. A.1.1 Analog Dual-Row Header Details (J13 and J14) For maximum flexibility, the TLV320AIC3109EVM is designed for easy interfacing to multiple analog sources. Table 6 summarizes the analog interface pinout for the TLV320AIC3109EVM. Table 6. Analog Interface Pinout Pin Number Signal J1.1 NC Not connected Description J1.2 NC Not connected J1.3 HPCOM High-power output driver (minus or multifunctional) J1.4 HPOUT High-power output driver (plus) J1.5 LINE1M MIC1 or LINE1 analog input (minus or multifunctional) J1.6 LINE1P MIC1 or LINE1 analog input (plus or multifunctional) J1.7 LINE2M MIC2 or LINE2 analog input (minus or multifunctional) J1.8 LINE2P MIC2 or LINE2 analog input (plus or multifunctional) J1.9 AGND Analog ground J1.10 NC Not connected J1.11 AGND Analog ground J1.12 NC Not connected J1.13 AGND Analog ground J1.14 MICBIAS J1.15 NC J1.16 MICDET J1.17 AGND Analog ground J1.18 NC Not connected J1.19 AGND Analog ground J1.20 NC Not connected J2.1 NC Not connected J2.2 NC Not connected J2.3 NC Not connected J2.4 NC Not connected J2.5 NC Not connected J2.6 NC Not connected J2.7 LEFT_LOP Left-line output (plus) J2.8 LEFT_LOM Left-line output (minus) J2.9 AGND J2.10 RIGHT_LOP J2.11 AGND J2.12 RIGHT_LOM J2.13 AGND Analog ground J2.14 NC Not connected Microphone bias voltage output Not connected Microphone Detect Analog ground Right-line output (plus) Analog ground Right-line output (minus) SLAU738 – September 2017 Submit Documentation Feedback EVM Connector Descriptions Copyright © 2017, Texas Instruments Incorporated 33 Analog Interface Connectors www.ti.com Table 6. Analog Interface Pinout (continued) A.1.2 Pin Number Signal J2.15 NC Not connected Description J2.16 NC Not connected J2.17 AGND Analog ground J2.18 NC Not connected J2.19 AGND Analog ground J2.20 NC Not connected Analog Screw Terminal Details (J1-5 and J8-12) In addition to the analog headers, the analog inputs and outputs can also be accessed through alternate connectors, either screw terminals or audio jacks. The mono microphone is also tied to J13 and the mono headphone output is available at J16. Table 7 summarizes the screw terminals available on the TLV320AIC3109EVM. Table 7. Alternate Analog Connectors 34 Designator Pin 1 Pin 2 J6 External mic bias source (+) External mic bias source (GND) J10 LINE2 (+) LINE2 (–) J13 LINE1 (+) LINE1 (–) AGND J17 AGND HPCOM (–) HPOUT (+) J20 LEFT OUT (+) LEFT OUT (–) J21 RIGHT OUT (+) RIGHT OUT (–) EVM Connector Descriptions Pin 3 AGND SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Digital Interface Connectors (J16 and J17) www.ti.com A.2 Digital Interface Connectors (J16 and J17) The TLV320AIC3109EVM is designed to easily interface with multiple control platforms. Table 8 summarizes the digital interface pinout for the TLV320AIC3109EVM. Table 8. Digital Interface Pinout Pin Number Signal J4.1 NC Not connected Description J4.2 NC Not connected J4.3 SCLK SPI serial clock J4.4 DGND Digital ground J4.5 NC Not connected J4.6 NC Not connected J4.7 NC Not connected J4.8 RESET INPUT J4.9 NC Not connected J4.10 DGND Digital ground J4.11 NC Not connected J4.12 NC Not connected J4.13 NC Not connected J4.14 RESET J4.15 NC Not connected J4.16 SCL I2C serial clock J4.17 NC Not connected J4.18 DGND Digital ground J4.19 NC Not connected J4.20 SDA J5.1 NC Not connected J5.2 NC Not connected Reset signal input to EVM Reset I2C serial data I/O J5.3 BCLK Audio serial data bus bit clock (I/O) J5.4 DGND Digital ground J5.5 NC Not connected J5.6 NC Not connected J5.7 WCLK J5.8 NC Not connected J5.9 NC Not connected J5.10 DGND Digital ground J5.11 DIN Audio serial data bus data input (input) J5.12 NC Not connected J5.13 DOUT J5.14 NC Not connected J5.15 NC Not connected J5.16 SCL I2C serial clock Audio serial data bus word clock (I/O) Audio serial data bus data output (output) J5.17 MCLK Master clock input J5.18 DGND Digital ground J5.19 NC Not connected J5.20 SDA I2C Serial Data I/O SLAU738 – September 2017 Submit Documentation Feedback EVM Connector Descriptions Copyright © 2017, Texas Instruments Incorporated 35 Power Supply Connector Pin Header, J3 www.ti.com Note that J5 comprises the signals needed for an I2S serial digital audio interface; the control interface (I2C and RESET) signals are routed to J4. I2C is actually routed to both connectors; however, the device is connected only to J4. A.3 Power Supply Connector Pin Header, J3 J3 provides connection to the common power bus for the TLV320AIC3109EVM. Power is supplied on the pins listed in Table 9. Table 9. Power Supply Pinout Signal Pin Number Signal NC J3.1 J3.2 NC +5VA J3.3 J3.4 NC DGND J3.5 J3.6 AGND +1.8VD J3.7 J3.8 NC +3.3VD J3.9 J3.10 NC The TLV320AIC3109EVM motherboard (the USB-MODEVM Interface board) supplies power to J3 of the TLV320AIC3109EVM. Power for the motherboard is supplied either through its USB connection or via terminal blocks on that board. 36 EVM Connector Descriptions SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix B SLAU738 – September 2017 TLV320AIC3109EVM Schematic B.1 Main Schematics Figure 30 illustrates the main TLV320AIC3109-Q1 schematics. TLV320AIC3109EVMDC006 Rev A TLV30AIC3109-Q1 CIRCUIT C21 AVDD TP11 TP12 AVDD DVDD DVDD C14 0.1µF C17 0.1µF C18 10µF 6 5 4 47µF C13 10µF SW1 2 3 1 J15 CAPLESS J16 HEADPHONE JACK DGND 3 DGND 2 AGND 1 AGND AC-COUPLED TP15 C7 DRVDD IN1P IN1P IN 1 TP13 TP14 DRVDD IOVDD IOVDD IOVDD_IN R2 0.1µF 1 2 3 IN1M J13 0.1µF AGND 100k C15 10µF C8 C19 0.1µF C16 0.1µF C20 10µF R3 J19 2.7k TP17 R4 IN1M AGND AGND AGND DGND DGND HPOUT TP16 HPOUT 2.7k U3 7 AVDD 24 18 10 11 TP20 C9 IN2P 0.1µF TP24 DRVDD DRVDD MCLK WCLK BCLK 1 3 2 MCLK WCLK BCLK MIC1P/LINE1P MIC1M/LINE1M DIN DOUT 4 5 DIN DOUT MICDET 14 16 MICDET NC TP23 15 MICBIAS TP22 C10 IN2M SCL SDA MICBIAS 17 26 IN2M AGND 21 6 NC NC 19 20 HPOUT HPCOM 23 22 LEFT_LOP AVSS AVSS LEFT_LOM DRVSS DVSS 3 2 1 C23 TP21 R6 AGND J6 C25 0.047µF R7 28 29 RIGHT_LOM TP25 1 2 LEFT OUT DGND R8 AGND TP27 TP28 AVSS DRVSS TP29 LEFT- 100 TP30 C27 0.047µF LEFT- C12 AGND AGND AGND R9 AGND MICBIASIN TP32 RIGHT+ 100 TP33 C28 0.047µF RIGHT_LOP J21 RIGHT+ 1 2 RIGHT OUT R10 2.2k R11 2 3 1 MICROPHONE JACK J20 LEFT+ AGND 1 2 3 J9 TP26 C26 0.047µF 33 TP31 MICBIAS SELECTION LEFT+ 100 LEFT_LOP AGND J7 AGND HPCOM LEFT_LOM MICBIAS 10µF J17 HPCOM_LPF J18 AGND C6 TP19 100 47µF HEADPHONE OUT AGND HPCOM TLV320AIC3109-Q1 2 1 EXTERNAL MICBIAS C24 0.047µF 47µF 27 30 PAD HPOUT_LPF AGND RIGHT_LOP J11 TP18 100 RESET 8 9 MIC2P/LINE2P MIC2M/LINE2M 0.1µF 1 2 3 J10 31 SCL SDA 12 13 IN2P IN 2 RESET DVDD 25 J12 C22 IOVDD 32 J14 R5 AGND C11 R12 0 J8 TP34 AGND RIGHT_LOM RIGHT- 100 TP35 C29 0.047µF RIGHT- AGND ON-BOARD MIC ENABLE 1 2 AGND MK1 Copyright © 2017, Texas Instruments Incorporated AGND Figure 30. TLV320AIC3109-Q1 Main Schematics SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM Schematic Copyright © 2017, Texas Instruments Incorporated 37 Secondary Schematics B.2 www.ti.com Secondary Schematics Figure 31 illustrates the secondary TLV320AIC3109-Q1 schematics. TLV320AIC3109EVMDC006 Rev A Secondary Circuits +5VA +3.3VA U1 C3 0.1µF C1 10µF 8 IN OUT 1 5 EN NR 3 2 6 7 NC NC NC GND PAD RST J1A C4 0.1µF C2 10µF HPCOM IN1P IN2P TPS73533-Q1 AGND AGND 1 3 5 7 9 11 13 J1-15 15 17 19 2 4 6 8 10 12 14 16 18 20 J1-1 C5 0.01µF 4 9 AGND AGND AGND AGND AGND J4A J1-2 J1-10 J1-12 J1-16 J1-18 J1-20 J4-1 J4-3 J4-5 J4-7 J4-9 J4-11 J4-13 J4-15 J4-17 J4-19 HPOUT IN1M IN2M MICBIAS 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 J4-2 J23 J4-6 RESET J4-12 SCL SDA +3.3V REGULATOR USB-MODEVM INTERFACE AGND IOVDD_IN 1 3 5 7 9 11 13 J1-15 15 17 19 2 4 6 8 10 12 14 16 18 20 J1-1 R1 2.7k U2 1 2 3 J30 4 DGND HPCOM IN1P IN2P C30 A0 A1 VCC 8 WP 7 A2 SCL VSS SDA 0.1µF 6 SCL 5 SDA J1-2 J1-10 J1-12 J1-16 J1-18 J1-20 DGND CONNECTORS IOVDD_IN J4-1 J4-3 J4-5 J4-7 J4-9 J4-11 J4-13 J4-15 J4-17 J4-19 HPOUT IN1M IN2M MICBIAS 1 3 5 7 9 11 13 15 17 19 J1B 2 4 6 8 10 12 14 16 18 20 J4-2 J4-6 RST J4-12 RESET SCL SDA J4B 24LC512-I/ST AGND DGND DGND DGND DGND EEPROM IOVDD_IN +1.8VD +3.3VD +5VA J2A J27 RESET +3.3VA AVDD IOVDD_IN IOVDD TP2 LEFT+ SCL SCL TP3 SDA J25 J26 1 3 5 7 9 11 13 J2-15 15 17 19 J3A 2 4 6 8 10 12 14 16 18 20 J2-1 J2-3 J2-5 RESET J3-1 J2-2 J2-4 J2-6 J2-14 J2-16 J2-18 J2-20 LEFTRIGHT+ RIGHT- DRVDD +1.8VD J5A 2 4 6 8 10 J3-2 J3-4 J3-8 J3-10 DGND AGND 1 3 5 7 9 J5-9 11 13 J5-15 15 17 J5-19 19 2 4 6 8 10 12 14 16 18 20 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 J5-1 BCLK WCLK DIN DOUT J22 MCLK J5-5 J5-2 J5-6 J5-8 J5-12 J5-14 SCL SDA SDA IOVDD SELECTION TP4 +3.3VA 1 3 5 7 9 1 2 3 TP1 J24 DVDD MCLK AGND MCLK DGND TP5 +1.8VD +3.3VD +5VA WCLK J28 TP6 TP9 TP10 AGND DGND BCLK BCLK TP7 DIN DIN AGND DGND 1 3 5 7 9 11 13 J2-15 15 17 19 2 4 6 8 10 12 14 16 18 20 J2-1 J2-3 J2-5 WCLK LEFT+ J2-2 J2-4 J2-6 J2-14 J2-16 J2-18 J2-20 J3-1 LEFTRIGHT+ RIGHT- 1 3 5 7 9 2 4 6 8 10 J3-2 J3-4 J3-8 J3-10 BCLK WCLK DIN DOUT J3B DGND J5-1 AGND MCLK J5-5 J5-9 J5-15 J5-19 J5-2 J5-6 J5-8 J5-12 J5-14 TP8 J2B DOUT SCL SDA J5B DOUT J29 AGND DGND TEST POINTS Copyright © 2017, Texas Instruments Incorporated Figure 31. Connector, Test Points, and Power Distribution Schematics 38 TLV320AIC3109EVM Schematic SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Hardware Schematics www.ti.com B.3 Hardware Schematics Figure 32 illustrates the TLV320AIC3109-Q1 hardware. TLV320AIC3109-Q1 Evaluation Module DC006 RevA HARDWARE PCB Number: DC006 PCB Rev: A FID1 FID2 FID3 SH1 SH2 SH3 SH4 SH5 SH6 SH7 SH8 SH10 SH11 SH12 SH9 FID4 FID5 SHUNTS FID6 Logo1 Logo2 PCB LOGO PCB LOGO Logo3 PCB LOGO Texas Instruments Pb-Free Symbol FCC disclaimer ZZ1 Assembly Note These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified. ZZ2 Assembly Note These assemblies are ESD sensitive, ESD precautions shall be observed . ZZ3 Assembly Note These assemblies must be clean and free from flux and all contaminants. use of no clean flux is not acceptable. Copyright © 2017, Texas Instruments Incorporated Figure 32. TLV320AIC3109EVM Hardware SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM Schematic Copyright © 2017, Texas Instruments Incorporated 39 Appendix C SLAU738 – September 2017 TLV320AIC3109EVM Layout Views The board layouts for the modular TLV320AIC3109EVM are illustrated in Figure 33 through Figure 38. Figure 33. TLV320AIC3109EVM Assembly Layer Figure 34. TLV320AIC3109EVM Top Layer 40 TLV320AIC3109EVM Layout Views SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix C www.ti.com Figure 35. TLV320AIC3109EVM Ground Layer Figure 36. TLV320AIC3109EVM Power Layer SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM Layout Views Copyright © 2017, Texas Instruments Incorporated 41 Appendix C www.ti.com Figure 37. TLV320AIC3109EVM Bottom Layer Figure 38. TLV320AIC3109EVM Bottom Assembly Layer 42 TLV320AIC3109EVM Layout Views SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix D SLAU738 – September 2017 TLV320AIC3109EVM Bill of Materials The complete bill of materials for the modular TLV320AIC3109EVM is provided in Table 10. Table 10. TLV320AIC3109EVM Bill of Materials # Designator Qty 1 !PCB101 1 2 C1, C2 2 3 C3, C4, C14, C16, C17, C19, C30 7 4 C5 1 5 C6, C13, C15, C18, C20 5 6 C7, C8, C9, C10 7 C21, C22, C23 8 Value Part Number Manufacturer Description Package Reference DC006 Any Printed Circuit Board 10uF C3216X5R1H106K160AB TDK CAP, CERM, 10 µF, 50 V, ±±10%, X5R, 1206 1206 0.1uF C1608X7R1H104K080AA TDK CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0603 0603 0.01uF GRM188R71C103KA01D Murata CAP, CERM, 0.01 µF, 16 V, ±10%, X7R, 0603 0603 10uF C2012X5R1E106K125AB TDK CAP, CERM, 10 µF, 25 V, ±10%, X5R, 0805 0805 4 0.1uF C2012X7R1H104K085AA TDK CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0805 0805 3 47uF C3216X5R1C476M160AB TDK CAP, CERM, 47 µF, 16 V, ±15%, X5R, 1206 1206 C24, C25, C26, C27, C28, C29 6 0.047uF C1608X7R1H473K080AA TDK CAP, CERM, 0.047 µF, 50 V, ±10%, X7R, 0603 0603 9 J1A, J2A, J4A, J5A 4 TSM-110-01-L-DV-P Samtec Header, 2.54mm, 10x2, Gold, SMT 1000x180x290mil 10 J1B, J2B, J4B, J5B 4 SSW-110-22-F-D-VS-K Samtec Connector, Receptacle, 100mil, 10x2, Gold plated, SMD 10x2 Receptacle 11 J3A 1 TSM-105-01-L-DV Samtec Header, 2.54mm, 5x2, Gold, SMT Header, 2.54mm, 5x2, SMT 12 J3B 1 SSW-105-22-F-D-VS-K Samtec Connector, Header, 10-Pos (5x2), Receptacle, 100x100-mil Pitch 5x2 Receptacle 13 J6, J20, J21 3 ED555/2DS On-Shore Technology Terminal Block, 3.5mm Pitch, 2x1, TH 7.0x8.2x6.5mm 14 J7, J22 2 TSW-103-07-G-S Samtec Header, 100mil, 3x1, Gold, TH 3x1 Header 15 J8, J11, J12, J14, J15, J18, J19, J23, J24, J25, J26, J27, J28, J29, J30 15 TSW-102-07-G-S Samtec Header, 100mil, 2x1, Gold, TH 2x1 Header 16 J9, J16 2 MJ1-3510-SMT-TR CUI Inc. Audio Jack, 3.5mm, Mono, R/A, Black, SMT Audio Jack, 3.5mm, Mono, R/A, Black, SMT 17 J10, J13, J17 3 ED555/3DS On-Shore Technology Terminal Block, 3.5mm Pitch, 3x1, TH 10.5x8.2x6.5mm 18 MK1 1 CMA-4544PF-W CUI Inc. Microphone, Electret Condenser, Omnidirectional, -44 dB, TH THD, 2-Leads, Dia 9.85mm, Pin Spacing 2.54mm 19 R1, R3, R4 3 2.7k CRCW06032K70JNEA Vishay-Dale RES, 2.7 k, 5%, 0.1 W, 0603 0603 20 R2 1 100k RC0603FR-07100KL Yageo America RES, 100 k, 1%, 0.1 W, 0603 0603 21 R5, R6, R7, R8, R9, R12 6 100 RC0603FR-07100RL Yageo America RES, 100, 1%, 0.1 W, 0603 0603 22 R10 1 2.2k CRCW08052K20JNEA Vishay-Dale RES, 2.2 k, 5%, 0.125 W, 0805 0805 23 R11 1 0 CRCW08050000Z0EA Vishay-Dale RES, 0, 5%, 0.125 W, 0805 0805 24 SH1, SH2, SH3, SH4, SH5, SH6, SH7, SH8, SH9, SH10, SH11, SH12 12 1x2 SNT-100-BK-G Samtec Shunt, 100mil, Gold plated, Black Shunt 25 SW1 1 SSB22 TE Connectivity Switch, Slide, DPDT, On-On, 0.1 A, 30 V, TH TH, 6-Leads, Body 9.25x5.65mm, Pitch 2mm 26 TP9, TP10 2 5011 Keystone Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 27 U1 1 TPS73533-Q1 Texas Instruments 500-mA, Low Quiescent Current, Low-Noise, High PSRR, Low-Dropout Linear Regulator for Automotive, DRB0008B (VSON-8) DRB0008B 28 U2 1 24LC512-I/ST Microchip EEPROM, 512KBIT, 400KHZ, 8TSSOP TSSOP-8 SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109EVM Bill of Materials Copyright © 2017, Texas Instruments Incorporated 43 Appendix D www.ti.com Table 10. TLV320AIC3109EVM Bill of Materials (continued) # Designator Qty 29 U3 1 30 C11, C12 0 31 FID1, FID2, FID3, FID4, FID5, FID6 0 32 TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP11, TP12, TP13, TP14, TP15, TP16, TP17, TP18, TP19, TP20, TP21, TP22, TP23, TP24, TP25, TP26, TP27, TP28, TP29, TP30, TP31, TP32, TP33, TP34, TP35 0 44 Value 0.1uF Part Number Manufacturer Description Package Reference TLV320AIC3109-Q1 Texas Instruments Low-Power Mono Audio Codec for Automotive Applications, RHB0032E (VQFN-32) RHB0032E C2012X7R1H104K085AA TDK CAP, CERM, 0.1 µF, 50 V, ±10%, X7R, 0805 0805 N/A N/A Fiducial mark. There is nothing to buy or mount. Fiducial 5000 Keystone Test Point, Miniature, Red, TH Red Miniature Testpoint TLV320AIC3109EVM Bill of Materials SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix E SLAU738 – September 2017 USB-MODEVM Schematic The schematic diagrams for the USB-MODEVM Interface Board (included only in the TLV320AIC3109EVM-K) are illustrated in Figure 39 and Figure 40. 1 2 3 4 5 6 REVISION HISTORY REV +3.3VD C31 U11 1 3 SDA1 SCL1 GND EXTERNAL I2C 7 8 5 6 0.1uF USB I2S SN74AVC4T245PW PCA9306DCT C28 +3.3VD 0.1uF 0.1uF U3 1 2 3 4 5 6 7 8 0.1uF TP10 16 15 14 13 12 11 10 9 VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND +3.3VD 6.00 MHZ C20 J7 USB SLAVE CONN 46 47 48 1 3 5 6 7 4 16 28 45 100pF 0.1uF U5 GND D+ DVCC 4 3 2 1 C21 R9 1.5K R12 3.09K .001uF R10 27.4 897-30-004-90-000000 R11 C14 47pF 1 2 3 C13 47pF 27.4 VCCA A GND 3 1 3 5 7 9 11 PWR_DWN IOVDD C26 C U7 31 30 29 27 26 25 24 23 8 21 33 2 VCCB B DIR 0.1uF VCCA A GND +3.3VD MOSI R13 U4 P1.1 16 15 14 13 12 11 10 9 P1.0 +3.3VD C11 0.1uF C12 0.1uF VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND J15 1 2 3 4 5 6 7 8 VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND 0.1uF 1 3 5 7 9 11 2 4 6 8 10 12 EXTERNAL SPI SN74AVC4T245PW INT USB SPI P3.5 D2 SML-LX0603YW-TR YELLOW P3.3 P3.1-P3.2 R17 +3.3VD 100K C36 IOVDD C44 1uF 1 2 3 JMP6 PWR SELECT 6VDC-10VDC IN VIN GND 3 C16 0.33uF U9 D3 5 6 4 GREEN 1IN 1IN 1EN 3 9 1GND 2GND 2 VOUT R15 10K C6 10uF SW1 1 2 4 3 10 11 12 R16 10K 2EN 2IN 2IN 1RESET 1OUT 1OUT 2RESET 2OUT 2OUT TPS767D318PWP 3.3VD ENABLE 1.8VD ENABLE 10uF 24 23 22 +3.3VD 18 17 VCCB B DIR R4 10 +3.3VD C39 IOVDD 2 SN74LVC1G06DBV IOVDD 10uF 0.1uF U16 R24 220 D8 4 SML-LX0603GW-TR TP6 R25 R26 22.1k 137k R27 R28 25.5k 76.8k R29 R30 28k 56.2k R31 R32 32.4k 48.7k R33 R34 39.2k 36.5k R35 R36 46.4k 30.9k R37 R18 52.3k 30.1k 1 3 2 RED C37 0.1uF IN OUT EN GND FB TPS73201DBV R19 220 C8 10uF IOVDD R38 10M 5 SW3 4 1.2V 9 1.4V 10 1.6V 11 1.8V 12 2.0V 13 2.5V 14 3.0V 15 3.3V 16 8 7 6 5 4 3 2 1 A DATA ACQUISITION PRODUCTS HIGH PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP IOVDD SELECT 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA GREEN TITLE ENGINEER RICK DOWNS REGULATOR ENABLE USB-MODEVM INTERFACE DRAWN BY ROBERT BENJAMIN DOCUMENT CONTROL NO. 6463996 SHEET 1 2 3 B U14 D5 D4 SML-LX0603GW-TR C17 0.33uF 0.1uF GREEN C7 28 C38 5 VCCA A GND C25 U2 REG1117-5 D1 C15 DL4001 0.1uF CUI-STACK PJ102-BH 2.5 MM +1.8VD 1 J9 1 3 2 SN74AVC1T45DBV SML-LX0603IW-TR SML-LX0603GW-TR +5VD R14 390 +3.3VD 6 4 5 U13 0.1uF 3 +3.3VD EXT PWR IN U17 SN74AUP1G125DBV 2 4 C27 P3.4 649 ED555/2DS 0.1uF RESET IOVDD 0.1uF C10 0.1uF C40 IOVDD SS SN74AVC1T45DBV C43 P1.2 C24 0.1uF USB RST MISO 1 3 2 SCLK P1.3 USB ACTIVE A SW DIP-8 MRESET +3.3VD J8 1 2 3 4 5 6 7 8 0.1uF 6 4 IOVDD 5 TP11 B 16 15 14 13 12 11 10 9 2 4 6 8 10 12 EXTERNAL AUDIO DATA +3.3VD C42 9 10 11 12 13 14 15 17 18 19 20 22 JMP7 JPR-1X3 J14 I2SDOUT U8 TAS1020BPFB P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 DVDD DVDD DVDD AVDD 75 1 3 2 SN74AVC1T45DBV XTALO XTALI PLLFILI PLLFILO MCLKI PUR DP DM DVSS DVSS DVSS AVSS SW2 A0 A1 A2 USB I2S USB MCK USB SPI USB RST EXT MCK R20 LRCLK IOVDD C23 33pF MA-505 6.000M-C0 C RA1 10K BCLK 44 43 42 41 40 39 37 38 36 35 34 32 33pF C19 SCL SDA VREN RESET MCLKO2 MCLKO1 CSCLK CDATO CDATI CSYNC CRESET CSCHNE SDA SCL X1 C18 D IOVDD JMP8 JPR-2X1 SN74LVC1G125DBV MCLK 0.1uF VCCB B DIR +3.3VD J10 EXT MCLK 2 I2SDIN C35 6 4 IOVDD 5 MRESET TEST EXTEN RSTO P3.0 P3.1 P3.2/XINT P3.3 P3.4 P3.5 NC NC 24LC64I/SN WP VSS 7 C9 0.1uF 4 A0 A1 A2 VCC 4 SN74LVC1G126DBV U10 4 U1 8 U15 2 SN74AVC4T245PW +3.3VD SCL 1 2 3 2 4 VREF2 EN SDA2 SCL2 5 VREF1 4 3 1 USB MCK 6 2 C22 IOVDD 1 TP9 SDA J6 R5 2.7K C34 5 R3 2.7K 16 15 14 13 12 11 10 9 3 EXT MCK R23 200k 0.1uF +3.3VD VCCB OE1 OE2 1B1 1B2 2B1 2B2 GND 2 C30 0.1uF VCCA DIR1 DIR2 1A1 1A2 2A1 2A2 GND 1 1 2 3 4 5 6 7 8 1 0.1uF U12 +3.3VD 5 +3.3VD 3 IOVDD APPROVED C41 0.1uF 1 C33 +3.3VD 5 IOVDD C32 D ENGINEERING CHANGE NUMBER 4 1 5 OF 2 FILE SIZE B REV D DATE 3-Apr-2007 C:\Work\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\SCH\USB Interface 6 Figure 39. USB-MODEVM Interface Board Schematic (1 of 2) SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Schematic Copyright © 2017, Texas Instruments Incorporated 45 Appendix E www.ti.com 1 2 3 4 5 6 REVISION HISTORY REV ENGINEERING CHANGE NUMBER APPROVED D 1 2 3 D J11 J12 A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA DAUGHTER-ANALOG 1 3 5 7 9 +5VD JMP1 1 -VA -5VA AGND VD1 +5VD TP2 IOVDD +5VD RESET IOVDD +5VD C2 C3 TP3 PWR_DWN 2 IOVDD JMP3 2.7K J2 +5VA D6 SML-LX0603GW-TR D7 SML-LX0603GW-TR GREEN GREEN J3 +5VD SN74TVC3010PW P3.3 P3.4 P3.5 P1.0 C P1.1 P1.2 P1.3 P3.1-P3.2 R7 200k +3.3VD R8 R1 R22 390 J1 -5VA 24 23 22 21 20 19 18 17 16 15 14 13 GATE B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 INT MOSI 1 +3.3VD R21 390 GND A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 MISO 10uF 1 10uF R6 U6 1 2 3 4 5 6 7 8 9 10 11 12 JMP4 TP4 10uF IOVDD J12A (TOP) = SAM_TSM-110-01-L-DV-P J12B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K 2 +5VA C1 0.1uF SCLK SS DAUGHTER-POWER TP7 TP8 AGND DGND 1 -5VA C29 +3.3VD RA2 10k -5VA 2 4 6 8 10 JMP2 TP1 IOVDD DAUGHTER-SERIAL 200k +VA +5VA DGND +1.8VD +3.3VD 2 JPR-2X1 C JMP5 2 4 6 8 10 12 14 16 18 20 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA J13 J11A (TOP) = SAM_TSM-110-01-L-DV-P J11B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +5VA J13A (TOP) = SAM_TSM-105-01-L-DV-P J13B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 2 1 3 5 7 9 11 13 15 17 19 SCL 200k R2 TP5 +1.8VD C4 C5 10uF 10uF 2.7K SDA MCLK I2SDOUT J4 +1.8VD J5 +3.3VD I2SDIN LRCLK BCLK J16 1 3 5 7 9 11 13 15 17 19 B J17 A0(-) A1(-) A2(-) A3(-) AGND AGND AGND VCOM AGND AGND 2 4 6 8 10 12 14 16 18 20 A0(+) A1(+) A2(+) A3(+) A4 A5 A6 A7 REFREF+ 1 3 5 7 9 11 13 15 17 19 +5VA CNTL CLKX CLKR FSX FSR DX DR INT TOUT GPIO5 GPIO0 DGND GPIO1 GPIO2 DGND GPIO3 GPIO4 SCL DGND SDA 2 4 6 8 10 12 14 16 18 20 B DAUGHTER-SERIAL DAUGHTER-ANALOG J18 J16A (TOP) = SAM_TSM-110-01-L-DV-P J16B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K +1.8VD 1 3 5 7 9 +VA +5VA DGND +1.8VD +3.3VD -VA -5VA AGND VD1 +5VD 2 4 6 8 10 -5VA J17A (TOP) = SAM_TSM-110-01-L-DV-P J17B (BOTTOM) = SAM_SSW-110-22-F-D-VS-K DAUGHTER-POWER +3.3VD +5VD IOVDD J18A (TOP) = SAM_TSM-105-01-L-DV-P J18B (BOTTOM) = SAM_SSW-105-22-F-D-VS-K A A DATA ACQUISITION PRODUCTS HIGH-PERFORMANCE ANALOG DIVISION SEMICONDUCTOR GROUP 6730 SOUTH TUCSON BLVD., TUCSON, AZ 85706 USA ENGINEER DRAWN BY TITLE RICK DOWNS SHEET 1 2 3 4 2 5 USB-MODEVM INTERFACE ROBERT BENJAMIN DOCUMENT CONTROL NO. 6463996 OF 2 FILE SIZE B DATE 3-Apr-2007 REV D C:\Work\USB-MODEVM\USB Motherboard - ModEvm.ddb - Documents\SCH\Daughtercard Interface 6 Figure 40. USB-MODEVM Interface Board Schematic (2 of 2) 46 USB-MODEVM Schematic SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix F SLAU738 – September 2017 USB-MODEVM Layout Views The USB-MODEVM interface board layouts (included only in the TLV320AIC3109EVM-K) are illustrated in Figure 41 through Figure 43. Figure 41. USB-MODEVM Assembly Layer SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Layout Views Copyright © 2017, Texas Instruments Incorporated 47 Appendix F www.ti.com Figure 42. USB-MODEVM Top Layer Figure 43. USB-MODEVM Bottom Layer 48 USB-MODEVM Layout Views SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix G SLAU738 – September 2017 USB-MODEVM Bill of Materials The complete bill of materials for the USB-MODEVM Interface Board (included only in the TLV320AIC3109EVM) is provided in Table 11. Table 11. USB-MODEVM Bill of Materials Designators Description Manufacturer Mfr Part Number R4 10Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1300V R10, R11 27.4Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF27R4V R20 75Ω 1/4W 1% Chip Resistor Panasonic ERJ-14NF75R0U R19 220Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ221V R14, R21, R22 390Ω 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ391V R13 649Ω 1/16W 1% Chip Resistor Panasonic ERJ-3EKF6490V R9 1.5KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1352V R1–R3, R5–R8 2.7KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ272V R12 3.09KΩ 1/16W 1% Chip Resistor Panasonic ERJ-3EKF3091V R15, R16 10KΩ 1/10W 5% Chip Resistor Panasonic ERJ-3GEYJ1303V R17, R18 100kΩ 1/10W 5%Chip Resistor Panasonic ERJ-3GEYJ1304V RA1 10KΩ 1/8W Octal Isolated Resistor Array CTS Corporation 742C163103JTR C18, C19 33pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H330J C13, C14 47pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H470J C20 100pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H101J C21 1000pF 50V Ceramic Chip Capacitor, ±5%, NPO TDK C1608C0G1H102J C15 0.1μF 16V Ceramic Chip Capacitor, ±10%, X7R TDK C1608X7R1C104K C16, C17 0.33μF 16V Ceramic Chip Capacitor, ±20%, Y5V TDK C1608X5R1C334K C9–C12, C22–C28 1μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C1608X5R0J1305K C1–C8 10μF 6.3V Ceramic Chip Capacitor, ±10%, X5R TDK C3216X5R0J1306K D1 50V, 1A, Diode MELF SMD Micro Commercial Components DL4001 D2 Yellow Light Emitting Diode Lumex SML-LX0603YW-TR D3– D7 Green Light Emitting Diode Lumex SML-LX0603GW-TR D5 Red Light Emitting Diode Lumex SML-LX0603IW-TR Q1, Q2 N-Channel MOSFET Zetex ZXMN6A07F X1 6MHz Crystal SMD Epson MA-505 6.000M-C0 U8 USB Streaming Controller Texas Instruments TAS1020BPFB U2 5V LDO Regulator Texas Instruments REG1117-5 U9 3.3V/1.8V Dual Output LDO Regulator Texas Instruments TPS767D318PWP U3, U4 Quad, 3-State Buffers Texas Instruments SN74LVC125APW U5–U7 Single IC Buffer Driver with Open Drain o/p Texas Instruments SN74LVC1G07DBVR U10 Single 3-State Buffer Texas Instruments SN74LVC1G125DBVR 64K 2-Wire Serial EEPROM I C Microchip 24LC64I/SN U1 2 USB-MODEVM PCB Texas Instruments 6463995 TP1–TP6, TP9–TP11 Miniature test point terminal Keystone Electronics 5000 TP7, TP8 Multipurpose test point terminal Keystone Electronics 5011 J7 USB Type B Slave Connector Thru-Hole Mill-Max 897-30-004-90-000000 J13, J2–J5, J8 2-position terminal block On Shore Technology ED555/2DS J9 2.5mm power connector CUI Stack PJ-102B SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Bill of Materials Copyright © 2017, Texas Instruments Incorporated 49 Appendix G www.ti.com Table 11. USB-MODEVM Bill of Materials (continued) Designators Description Manufacturer Mfr Part Number J130 BNC connector, female, PC mount AMP/Tyco 414305-1 J131A, J132A, J21A, J22A 20-pin SMT plug Samtec TSM-110-01-L-DV-P J131B, J132B, J21B, J22B 20-pin SMT socket Samtec SSW-110-22-F-D-VS-K J133A, J23A 10-pin SMT plug Samtec TSM-105-01-L-DV-P J133B, J23B 10-pin SMT socket Samtec SSW-105-22-F-D-VS-K J6 4-pin double row header (2x2) 0.1" Samtec TSW-102-07-L-D J134, J135 12-pin double row header (2x6) 0.1" Samtec TSW-106-07-L-D JMP1–JMP4 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP8–JMP14 2-position jumper, 0.1" spacing Samtec TSW-102-07-L-S JMP5, JMP6 3-position jumper, 0.1" spacing Samtec TSW-103-07-L-S JMP7 3-position dual row jumper, 0.1" spacing Samtec TSW-103-07-L-D SW1 SMT, half-pitch 2-position switch C&K Division, ITT TDA02H0SK1 SW2 SMT, half-pitch 8-position switch C&K Division, ITT TDA08H0SK1 Jumper plug Samtec SNT-100-BK-T 50 USB-MODEVM Bill of Materials SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Appendix H SLAU738 – September 2017 TLV320AIC3109-Q1 Configuration Scripts This appendix contains configuration scripts used for the TLV320AIC3109-Q1 device. H.1 DAC: Mono Playback to AC coupled Headphone output ####################################################### # Mono Playback to AC coupled Headphone output # # Switch SW1 on AC-COUPLED position # DAC connected to headphone output through mixer path # Mixer Gain = 0dB; Output amplifier gain = 0dB # AC coupled headphone configuration # I2S, 16-bits, fs = 44.1KHz # MCLK = 11.2896MHz; BCLK = 2.8224MHz; WCLK = 44.1KHz # ####################################################### # # Page 0 selected w 30 00 00 # # Software Reset w 30 01 80 # # fs(ref) setting and DAC data w 30 07 8A # # DAC unmuted, 0dB gain w 30 2B 00 # # AC-coupling output w 30 0E C0 # # DAC powered up w 30 25 80 # # HPCOM as independent single-ended output w 30 26 10 # # DAC routed to HPOUT output w 30 3D 80 # # HPOUT output powered up, 0dB w 30 41 0D # # DAC reference current 100% w 30 6D C0 SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109-Q1 Configuration Scripts Copyright © 2017, Texas Instruments Incorporated 51 DAC: Mono Playback to Capless Headphone output H.2 www.ti.com DAC: Mono Playback to Capless Headphone output ####################################################### # Mono Playback to Capless Headphone output # # Switch SW1 on CAPLESS position # DAC connected to headphone output through mixer path # Mixer Gain = 0dB; Output amplifier gain = 0dB # Capless headphone configuration # I2S, 16-bits, fs = 44.1KHz # MCLK = 11.2896MHz; BCLK = 2.8224MHz; WCLK = 44.1KHz # ####################################################### # # Page 0 selected w 30 00 00 # # Software Reset w 30 01 80 # # fs(ref) setting and DAC data w 30 07 8A # # DAC unmuted, 0dB gain w 30 2B 00 # # AC-coupling output w 30 0E C0 # # DAC powered up w 30 25 80 # # HPCOM VCM output voltage = 1.35V w 30 28 00 # # HPCOM as constant VCM output w 30 26 08 # # DAC routed to HPOUT output w 30 3D 80 # # HPOUT output powered up, 0dB w 30 41 0D # # DAC reference current 100% w 30 6D C0 52 TLV320AIC3109-Q1 Configuration Scripts Copyright © 2017, Texas Instruments Incorporated SLAU738 – September 2017 Submit Documentation Feedback DAC: Mono Playback to Line output www.ti.com H.3 DAC: Mono Playback to Line output ####################################################### # Mono Playback to Line output # # DAC connected to line output through mixer path # Mixer Gain = 0dB; Output amplifier gain = 0dB # I2S, 16-bits, fs = 44.1KHz # MCLK = 11.2896MHz; BCLK = 2.8224MHz; WCLK = 44.1KHz # ####################################################### # # Page 0 selected w 30 00 00 # # Software Reset w 30 01 80 # # fs(ref) setting and DAC data w 30 07 8A # # DAC unmuted, 0dB gain w 30 2B 00 # # DAC powered up w 30 25 80 # # DAC routed to LEFT_LOP output w 30 52 80 # # LEFT_LOP output powered up, 0dB w 30 56 0D # # DAC routed to RIGHT_LOP output w 30 59 80 # # RIGHT_LOP output powered up, 0dB w 30 5D 0D # # DAC reference current 100% w 30 6D C0 SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109-Q1 Configuration Scripts Copyright © 2017, Texas Instruments Incorporated 53 ADC: On-board microphone to digital audio output H.4 www.ti.com ADC: On-board microphone to digital audio output ####################################################### # On-board microphone to digital output # # Jumpers J7 and J8 in default position # On-board Microphone connected to the ADC block # PGA = 0dB; ADC volume = 0dB # MICBIAS level = 2.5V # I2S, 16-bits, fs = 44.1KHz # MCLK = 11.2896MHz; BCLK = 2.8224MHz; WCLK = 44.1KHz # ####################################################### # # Page 0 selected w 30 00 00 # # Software Reset w 30 01 80 # # fs(ref) setting w 30 07 80 # # High-pass filter selected, fc = 0x0045 * ADC_fs w 30 0C 40 # # MICBIAS = 2.5V w 30 19 80 # # IN1P routed to ADC (0dB); ADC powered up w 30 13 04 # # PGA unmuted, 0dB w 30 0f 00 54 TLV320AIC3109-Q1 Configuration Scripts Copyright © 2017, Texas Instruments Incorporated SLAU738 – September 2017 Submit Documentation Feedback ADC: Differential input to digital audio output www.ti.com H.5 ADC: Differential input to digital audio output ####################################################### # Differential input to digital output # # IN1P/IN1M input selected # On-board Microphone connected to the ADC block # PGA = 0dB; ADC volume = 0dB # I2S, 16-bits, fs = 44.1KHz # MCLK = 11.2896MHz; BCLK = 2.8224MHz; WCLK = 44.1KHz # ####################################################### # # Page 0 selected w 30 00 00 # # Software Reset w 30 01 80 # # fs(ref) setting w 30 07 80 # # High-pass filter selected, fc = 0x0045 * ADC_fs w 30 0C 40 # # IN1P routed to ADC (0dB); ADC powered up w 30 13 84 # # PGA unmuted, 0dB w 30 0f 00 SLAU738 – September 2017 Submit Documentation Feedback TLV320AIC3109-Q1 Configuration Scripts Copyright © 2017, Texas Instruments Incorporated 55 Appendix I SLAU738 – September 2017 USB-MODEVM Protocol I.1 USB-MODEVM Protocol The USB-MODEVM is defined to be a Vendor-Specific class, and is identified on the PC system as an NIVISA device. Because the TAS1020 has several routines in its ROM which are designed for use with HIDclass devices, HID-like structures are used, even though the USB-MODEVM is not an HID-class device. Data is passed from the PC to the TAS1020 using the control endpoint. Data is sent in an HIDSETREPORT (see Table 12): Table 12. USB Control Endpoint HIDSETREPORT Request Part Value bmRequestType 0x21 00100001 bRequest 0x09 SET_REPORT wValue 0x00 don't care wIndex 0x03 HID interface is index 3 wLength calculated by host Data Description Data packet as described in Table 13. The data packet consists of the following bytes, shown in Table 13 and the following paragraphs: Table 13. Data Packet Configuration Byte Number Type 0 Interface Description Specifies serial interface and operation. The two values are logically ORed. Operation: READ WRITE 0x00 0x10 GPIO SPI_16 I2C_FAST I2C_STD SPI_8 0x08 0x04 0x02 0x01 0x00 Interface: 1 56 I2C Slave Address Slave address of I2C device or MSB of 16-bit reg addr for SPI 2 Length 3 Register address 4..64 Data Length of data to write/read (number of bytes) Address of register for I2C or 8-bit SPI; LSB of 16-bit address for SPI Up to 60 data bytes could be written at a time. EP0 maximum length is 64. The return packet is limited to 42 bytes, so advise only sending 32 bytes at any one time. USB-MODEVM Protocol SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated USB-MODEVM Protocol www.ti.com Example usage: Write two bytes (AA, 55) to device starting at register 5 of an I2C device with address A0: [0] [1] [2] [3] [4] [5] 0x11 0xA0 0x02 0x05 0xAA 0x55 Do the same with a fast mode I2C device: [0] [1] [2] [3] [4] [5] 0x12 0xA0 0x02 0x05 0xAA 0x55 Now with an SPI device which uses an 8-bit register address: [0] [1] [2] [3] [4] [5] 0x10 0xA0 0x02 0x05 0xAA 0x55 A 16-bit register address, as found on parts like the TSC2101. Assume the register address (command word) is 0x10E0: [0] [1] [2] [3] [4] [5] 0x14 0x10 --> Note: the I2C address now serves as MSB of reg addr. 0x02 0xE0 0xAA 0x55 In each case, the TAS1020 will return, in an HID interrupt packet, the following: [0] interface byte | status status: REQ_ERROR 0x80 INTF_ERROR 0x40 REQ_DONE 0x20 [1] [2] [3] [4..60] for I2C interfaces, the I2C address as sent for SPI interfaces, the read back data from SPI line for transmission of the corresponding byte length as sent for I2C interfaces, the reg address as sent for SPI interfaces, the read back data from SPI line for transmission of the corresponding byte echo of data packet sent SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Protocol Copyright © 2017, Texas Instruments Incorporated 57 USB-MODEVM Protocol www.ti.com If the command is sent with no problem, the returning byte [0] should be the same as the sent one logically ORed with 0x20 - in the first example, the returning packet should be: [0] [1] [2] [3] [4] [5] 0x31 0xA0 0x02 0x05 0xAA 0x55 If for some reason the interface fails (for example, the I2C device does not acknowledge), it would come back as: [0] [1] [2] [3] [4] [5] 0x51 --> interface | INTF_ERROR 0xA0 0x02 0x05 0xAA 0x55 If the request is malformed, that is, the interface byte (byte [0]) takes on a value which is not previously described, the return packet would be: [0] [1] [2] [3] [4] [5] 0x93 --> the user sent 0x13, which is not valid, so 0x93 returned 0xA0 0x02 0x05 0xAA 0x55 The previous examples used writes. Reading is similar: Read two bytes from device starting at register 5 of an I2C device with address A0: [0] [1] [2] [3] 58 0x01 0xA0 0x02 0x05 USB-MODEVM Protocol SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated GPIO Capability www.ti.com The return packet should be [0] [1] [2] [3] [4] [5] 0x21 0xA0 0x02 0x05 0xAA 0x55 assuming that the values previously written starting at Register 5 were actually written to the device. I.2 GPIO Capability The USB-MODEVM has seven GPIO lines. Access them by specifying the interface to be 0x08, and then using the standard format for packets—but addresses are unnecessary. The GPIO lines are mapped into one byte (see Table 14): Table 14. GPIO Pin Assignments Bit 7 6 5 4 3 2 1 0 x P3.5 P3.4 P3.3 P1.3 P1.2 P1.1 P1.0 Example: write P3.5 to a 1, set all others to 0: [0] [1] [2] [3] [4] 0x18 0x00 0x01 0x00 0x40 --> --> --> --> --> write, GPIO this value is ignored length - ALWAYS a 1 this value is ignored 01000000 The user may also read back from the GPIO to see the state of the pins. Consider if the previous example was written to the port pins. Example: read the GPIO [0] [1] [2] [3] 0x08 0x00 0x01 0x00 --> --> --> --> read, GPIO this value is ignored length - ALWAYS a 1 this value is ignored The return packet should be: [0] [1] [2] [3] [4] I.3 0x28 0x00 0x01 0x00 0x40 Writing Scripts A script is simply a text file that contains data to send to the serial control buses. The scripting language is quite simple, as is the parser for the language. Therefore, the program is not very forgiving about mistakes made in the source script file, but the formatting of the file is simple. Consequently, mistakes should be rare. SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Protocol Copyright © 2017, Texas Instruments Incorporated 59 Writing Scripts www.ti.com Each line in a script file is one command. There is no provision for extending lines beyond one line. A line is terminated by a carriage return. The first character of a line is the command. Commands are: I Set interface bus to use r Read from the serial control bus w Write to the serial control bus # Comment b Break d Delay The first command, I, sets the interface to use for the commands to follow. This command must be followed by one of the following parameters: i2cstd i2cfast spi8 spi16 gpio Standard mode I2C Bus Fast mode I2C bus SPI bus with 8-bit register addressing SPI bus with 16-bit register addressing Use the USB-MODEVM GPIO capability For example, if a fast mode I2C bus is to be used, the script begins with: I i2cfast No data follows the break command. Anything following a comment command is ignored by the parser, provided that it is on the same line. The delay command allows the user to specify a time, in milliseconds, that the script will pause before proceeding. NOTE: Unlike all other numbers used in the script commands, the delay time is entered in a decimal format. Also, note that because of latency in the USB bus as well as the time it takes the processor on the USB-MODEVM to handle requests, the delay time may not be precise. A series of byte values follows either a read or write command. Each byte value is expressed in hexadecimal, and each byte must be separated by a space. Commands are interpreted and sent to the TAS1020 by the program using the protocol described in Section I.1. The first byte following a read or write command is the I2C slave address of the device (if I2C is used) or the first data byte to write (if SPI is used—note that SPI interfaces are not standardized on protocols, so the meaning of this byte will vary with the device being addressed on the SPI bus). The second byte is the starting register address that data will be written to (again, with I2C; SPI varies—see Section I.1 for additional information about what variations may be necessary for a particular SPI mode). Following these two bytes are data, if writing; if reading, the third byte value is the number of bytes to read, (expressed in hexadecimal). For example, to write the values 0xAA 0x55 to an I2C device with a slave address of 0x90, starting at a register address of 0x03, one would write: #example script I i2cfast w 90 03 AA 55 r 90 03 2 This script begins with a comment, specifies that a fast I2C bus will be used, then writes 0xAA 0x55 to the I2C slave device at address 0x90, writing the values into registers 0x03 and 0x04. The script then reads back two bytes from the same device starting at register address 0x03. Note that the slave device value does not change. It is not necessary to set the R/W bit for I2C devices in the script; the read or write commands will do that. 60 USB-MODEVM Protocol SLAU738 – September 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Writing Scripts www.ti.com Here is an example of using an SPI device that requires 16-bit register addresses: # setup TSC2101 for input and output # uses SPI16 interface # this script sets up DAC and ADC at full volume, input from onboard mic # # Page 2: Audio control registers w 10 00 00 00 80 00 00 00 45 31 44 FD 40 00 31 C4 w 13 60 11 20 00 00 00 80 7F 00 C5 FE 31 40 7C 00 02 00 C4 00 00 00 23 10 FE 00 FE 00 Note that blank lines are allowed. However, be sure that the script does not end with a blank line. While ending with a blank line will not cause the script to fail, the program will execute that line, and therefore, may prevent the user from seeing data that was written or read back on the previous command. In this example, the first two bytes of each command are the command word to send to the TSC2101 (0x1000, 0x1360); these are followed by data to write to the device starting at the address specified in the command word. The second line may wrap in the viewer being used to look like more than one line; careful examination will show; however, that there is only one carriage return on that line, following the last 00. Any text editor may be used to write these scripts; Jedit is an editor that is highly recommended for general usage. For more information, go to: http://www.jedit.org. Once the script is written, it can be used in the command window by running the program, and then selecting Open Command File... from the File menu. Locate the script and open it. The script will then be displayed in the command buffer. The user may also edit the script once it is in the buffer, but saving of the command buffer is not possible at this time (this feature may be added at a later date). Once the script is in the command buffer, it may be executed by pressing the Execute Command Buffer button. If there are breakpoints in the script, the script will execute to that point, and the user is presented with a dialog box with a button to press to continue executing the script. When ready to proceed, push that button and the script will continue. Here an example of a (partial) script with breakpoints: # # I # setup AIC33 for input and output uses I2C interface i2cfast reg 07 - codec datapath w 30 07 8A r 30 07 1 d 1000 # regs 15/16 - ADC volume, unmute and set to 0dB w 30 0F 00 00 r 30 0F 2 b This script writes the value 8A at register 7, then reads it back to verify that the write was good. A delay of 1000 ms (one second) is placed after the read to pause the script operation. When the script continues, the values 00 00 are written starting at register 0F. This output is verified by reading two bytes, and pausing the script again, this time with a break. The script does not continue until the user allows it to by pressing OK in the dialog box that is displayed due to the break. SLAU738 – September 2017 Submit Documentation Feedback USB-MODEVM Protocol Copyright © 2017, Texas Instruments Incorporated 61 STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. 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