TLV320AIC3212IYZFT

Product Folder Sample & Buy Technical Documents Support & Community Tools & Software TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 TLV320AIC3212 Ultra-Low Power Stereo Audio Codec With Receiver Driver, DirectPath Headphone, and Stereo Class-D Speaker Amplifier 1 Features 2 Applications • • • • • • • • • • • • 1 • • • • • • • • • • • • • Stereo Audio DAC With 101=dB SNR 2.7-mW Stereo 48-kHz DAC Playback Stereo Audio ADC With 93-dB SNR 5.6-mW Stereo 48-kHz ADC Record 8 kHz to 192 kHz Playback and Record 30-mW DirectPath™ Headphone Driver Eliminates Large Output DC-Blocking Capacitors 128-mW Differential Receiver Output Driver Stereo Class-D Speaker Drivers – 1.7 W (8 Ω, 5.5 V, 10% THDN) – 1.4 W (8 Ω, 5.5 V, 1% THDN) Stereo Line Outputs PowerTune™ - Adjusts Power vs SNR Extensive Signal Processing Options Eight Single-Ended or 4 Fully-Differential Analog Inputs Stereo Digital and Analog Microphone Inputs Low Power Analog Bypass Mode Programmable PLL, Plus Low-Frequency Clocking Programmable 12-Bit SAR ADC SPI and I2C Control Interfaces Three Independent Digital Audio Serial Interfaces 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP (YZF) Package Mobile Handsets Tablets and eBooks Portable Navigation Devices (PND) Portable Media Players (PMP) Portable Gaming Systems Portable Computing 3 Description The TLV320AIC3212 (also referred to as the AIC3212) device is a flexible, highly-integrated, lowpower, low-voltage stereo audio codec. The AIC3212 features digital microphone inputs and programmable outputs, PowerTune capabilities, selectable audioprocessing blocks, predefined and parameterizable signal processing blocks, integrated PLL, and flexible audio interfaces. Extensive register-based control of power, input and output channel configuration, gains, effects, pin-multiplexing and clocks are included, allowing the device to be precisely targeted to its application. Device Information(1) PART NUMBER TLV320AIC3212 PACKAGE DSBGA (81) BODY SIZE (NOM) 4.81 mm × 4.81 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Block Diagram 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. 1 Applications ........................................................... 1 Description ............................................................. 1 Revision History..................................................... 2 Description (continued)......................................... 3 Device Comparison Table..................................... 4 Pin Configuration and Functions ......................... 5 Specifications....................................................... 10 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 Absolute Maximum Ratings .................................... ESD Ratings............................................................ Recommended Operating Conditions..................... Thermal Information ................................................ Electrical Characteristics, SAR ADC....................... Electrical Characteristics, ADC ............................... Electrical Characteristics, Bypass Outputs ............. Electrical Characteristics, Microphone Interface..... Electrical Characteristics, Audio DAC Outputs ....... Electrical Characteristics, Class-D Outputs .......... Electrical Characteristics, Miscellaneous.............. Electrical Characteristics, Logic Levels................. Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Master Mode........................ 8.14 Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Slave Mode.......................... 8.15 Typical DSP Timing: DSP/Mono PCM Timing in Master Mode ............................................................ 8.16 Typical DSP Timing: DSP/Mono PCM Timing in 10 11 11 12 13 14 16 17 18 21 22 22 23 24 25 Slave Mode .............................................................. 8.17 I2C Interface Timing .............................................. 8.18 SPI Timing............................................................. 8.19 Typical Characteristics .......................................... 26 27 28 29 9 Parameter Measurement Information ................ 31 10 Detailed Description ........................................... 32 10.1 10.2 10.3 10.4 10.5 Overview ............................................................... Functional Block Diagram ..................................... Feature Description............................................... Device Functional Modes...................................... Register Maps ....................................................... 32 33 34 54 55 11 Application and Implementation........................ 63 11.1 Application Information.......................................... 63 11.2 Typical Application ................................................ 64 12 Power Supply Recommendations ..................... 68 13 Layout................................................................... 68 13.1 Layout Guidelines ................................................. 68 13.2 Layout Examples................................................... 69 14 Device and Documentation Support ................. 72 14.1 14.2 14.3 14.4 14.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 72 72 72 72 72 15 Mechanical, Packaging, and Orderable Information ........................................................... 72 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Original (March 2012) to Revision A • 2 Page Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 5 Description (continued) Combined with the advanced PowerTune technology, the device can execute operations from 8-kHz mono voice playback to stereo 192-kHz DAC playback, making it ideal for portable battery-powered audio and telephony applications. The record path of the TLV320AIC3212 covers operations from 8-kHz mono to 192-kHz stereo recording, and contains programmable input channel configurations which cover single-ended and differential setups, as well as floating or mixing input signals. It also provides a digitally-controlled stereo microphone preamplifier and integrated microphone bias. One application of the digital signal processing blocks is removable of audible noise that may be introduced by mechanical coupling, for example, optical zooming in a digital camera. The record path can also be configured as a stereo digital microphone Pulse Density Modulation (PDM) interface typically used at 64 Fs or 128 Fs. The playback path offers signal processing blocks for filtering and effects; headphone, line, receiver, and Class-D speaker outputs; flexible mixing of DAC; and analog input signals as well as programmable volume controls. The playback path contains two high-power DirectPath headphone output drivers which eliminate the need for ac coupling capacitors. A built in charge pump generates the negative supply for the ground centered headphone drivers. These headphone output drivers can be configured in multiple ways, including stereo, and mono BTL. In addition, playback audio can be routed to integrated stereo Class-D speaker drivers or a differential receiver amplifier. The integrated PowerTune technology allows the device to be tuned to just the right power-performance tradeoff. Mobile applications frequently have multiple use cases requiring very low-power operation while being used in a mobile environment. When used in a docked environment power consumption typically is less of a concern while lowest possible noise is important. With PowerTune the TLV320AIC3212 can address both cases. The required internal clock of the TLV320AIC3212 can be derived from multiple sources, including the MCLK1 pin, the MCLK2 pin, the BCLK1 pin, the BCLK2 pin, several general purpose I/O pins or the output of the internal PLL, where the input to the PLL again can be derived from similar pins. Although using the internal fractional PLL ensures the availability of a suitable clock signal, TI does not recommend this for the lowest power settings. The PLL is highly programmable and can accept available input clocks in the range of 512 kHz to 50 MHz. To enable even lower clock frequencies, an integrated low-frequency clock multiplier can also be used as an input to the PLL. The TLV320AIC3212 has a 12-bit SAR ADC converter that supports system voltage measurements. These system voltage measurements can be sourced from three dedicated analog inputs (IN1L/AUX1, IN1R/AUX2, or VBAT pins), or, alternatively, an on-chip temperature sensor that can be read by the SAR ADC. The TLV320AIC3212 also features three full Digital Audio Serial Interfaces, each supporting I2S, DSP/TDM, RJF, LJF, and mono PCM formats. This enables the digital playback (DAC) and record (ADC) paths to select from three independent digital audio buses or chips. The device is available in the 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP (YZF) package. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 3 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 6 Device Comparison Table 4 PARAMETRICS TLV320AIC3212 TLV320AIC3262 TLV320AIC3268 TLV320AIC3204 TLV320AIC3254 DACs (number) 2 2 2 2 2 ADCs (number) 2 2 2 2 2 Number of Inputs / Number of Outputs 8/7 8/7 8/7 6/4 6/4 Resolution (Bits) 16, 20, 24, 32 16, 20, 24, 32 16, 20, 24, 32 16, 20, 24, 32 16, 20, 24, 32 Control Interface I2C, SPI I2C, SPI I2C, SPI I2C, SPI I2C, SPI Digital Audio Interface I2S, TDM, DSP, L&R, PCM I2S, TDM, DSP, L&R, PCM I2S, TDM, DSP, L&R, PCM I2S, TDM, DSP, L&R I2S, TDM, DSP, L&R Number of of Digital Audio Interfaces 3 3 3 1 1 Speaker Amplifier Type Class-D Class-D Class-D — — Configurable miniDSP No Yes Yes No Yes Headphone Driver Yes Yes Yes Yes Yes Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 7 Pin Configuration and Functions YZF Package 81-Pin DSBGA Top View J DVDD GPIO1 DOUT3 DOUT2 GPI1 IOVSS DVDD WCLK1 DIN1 H IOVDD GPIO2 BCLK3 GPO1 SDA SCL IOVDD DOUT1 BCLK1 G MCLK2 RESET SPI_SELECT DIN3 WCLK3 WCLK2 DIN2 BCLK2 MCLK1 F VBAT IOVSS GPI4 GPI2 GPI3 DVSS AVDD_18 IN2R IN2L E SPKRP SPK_V DVSS AVSS2 AVSS3 AVSS1 AVSS IN3L IN3R D SRVDD SRVSS LOR HPVSS _SENSE IN4R IN1R/AUX2 IN1L/AUX1 VREF_SAR VREF _AUDIO C SPKRM SPKLM AVDD4_18 LOL AVDD2_18 MICBIAS MICBIAS _EXT AVDD1_18 IN4L B SLVSS SLVDD CPFCP CPVSS HPL HVDD_18 RECM RECP MICDET A SPKLP AVSS4 CPVDD_18 CPFCM VNEG HPR RECVDD_33 RECVSS AVDD3_33 9 8 7 6 4 3 2 1 5 P0044-07 Pin Functions PIN TYPE DESCRIPTION NO. NAME A1 AVDD3_33 P 3.3-V Power Supply for Micbias A2 RECVSS P Receiver Driver Ground A3 RECVDD_33 P 3.3-V Power Supply for Receiver Driver A4 HPR O Right Headphone Output A5 VNEG I/O Charge Pump Negative Supply A6 CPFCM I/O Charge Pump Flying Capacitor M terminal A7 CPVDD_18 P Power Supply Input for Charge Pump Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 5 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Pin Functions (continued) PIN TYPE DESCRIPTION NO. NAME A8 AVSS4 P Analog Ground for Class-D A9 SPKLP O Left Channel P side Class-D Output B1 MICDET I/O Headset Detection Pin B2 RECP O Receiver Driver P side Output B3 RECM O Receiver Driver M side Output B4 HVDD_18 P Headphone Amp Power Supply B5 HPL O Left Headphone Output B6 CPVSS P Charge Pump Ground B7 CPFCP I/O B8 SLVDD P Left Channel Class-D Output Stage Power Supply B9 SLVSS P Left Channel Class-D Output Stage Ground C1 IN4L I Analog Input 4 Left C2 AVDD1_18 P 1.8-V Analog Power Supply C3 MICBIAS_EXT O Output Bias Voltage for Headset Microphone. C4 MICBIAS O Output Bias Voltage for Microphone to be used for on-board Microphones C5 AVDD2_18 P 1.8-V Analog Power Supply C6 LOL O Left Line Output C7 AVDD4_18 P 1.8-V Analog Power Supply for Class-D C8 SPKLM O Left Channel M side Class-D Output C9 SPKRM O Right Channel M side Class-D Output D1 VREF_AUDIO O Analog Reference Filter Output D2 VREF_SAR I/O SAR ADC Voltage Reference Input or Internal SAR ADC Voltage Reference Bypass Capacitor Pin D3 IN1L/AUX1 I Analog Input 1 Left, Auxiliary 1 Input to SAR ADC (Special Function: Left Channel High Impedance Input for Capacitive Sensor Measurement) D4 IN1R/AUX2 I Analog Input 1 Right, Auxiliary 2 Input to SAR ADC (Special Function: Right Channel High Impedance Input for Capacitive Sensor Measurement) D5 IN4R I Analog Input 4 Right D6 HPVSS_SENSE I Headphone Ground Sense Terminal D7 LOR O Right Line Output D8 SRVSS P Right Channel Class-D Output Stage Ground D9 SRVDD P Right Channel Class-D Output Stage Power Supply E1 IN3R I Analog Input 3 Right E2 IN3L I Analog Input 3 Left E3 AVSS P Analog Ground E4 AVSS1 P Analog Ground E5 AVSS3 P Analog Ground E6 AVSS2 P Analog Ground E7 DVSS P Digital Ground E8 SPK_V P Class-D Output Stage Power Supply (Connect to SRVDD through a Resistor) E9 SPKRP O Right Channel P side Class-D Output F1 IN2L I Analog Input 2 Left F2 IN2R I Analog Input 2 Right F3 AVDD_18 P 1.8-V Analog Power Supply F4 DVSS P Digital Ground 6 Charge Pump Flying Capacitor P Terminal Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Pin Functions (continued) PIN NO. NAME TYPE DESCRIPTION Multi Function Digital Input 3 Primary: (SPI_SELECT = 1) F5 GPI3 ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) I Secondary: (SPI_SELECT = 0) I2C Address Bit 1 (I2C_ADDR0, LSB) Multi Function Digital Input 2 Primary: General Purpose Input Secondary: F6 GPI2 I Audio Serial Data Bus 1 Data Input Digital Microphone Data Input General Clock Input Low-Frequency Clock Input ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) Multi Function Digital Input 4 Primary: (SPI_SELECT = 1) F7 GPI4 ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) I Secondary: (SPI_SELECT = 0) I2C Address Bit 2 (I2C_ADDR1, MSB) F8 IOVSS P Digital I/O Buffer Ground F9 VBAT I Battery Monitor Voltage Input G1 MCLK1 I Master Clock Input 1 Primary: Audio Serial Data Bus 2 Bit Clock Secondary: G2 BCLK2 General Purpose Input General Purpose Output General CLKOUT Output ADC MOD Clock Output SAR ADC Interrupt INT1 Output INT2 Output General Clock Input Low-Frequency Clock Input I/O Primary: Audio Serial Data Bus 2 Data Input G3 DIN2 I Secondary: Digital Microphone Data Input General Purpose Input Low-Frequency Clock Input Primary: Audio Serial Data Bus 2 Word Clock Secondary: G4 WCLK2 I/O General Purpose Input General Purpose Output CLKOUT Output ADC MOD Clock Output SAR ADC Interrupt INT1 Output INT2 Output Low-Frequency Clock Input Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 7 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Pin Functions (continued) PIN NO. NAME TYPE DESCRIPTION Primary: Audio Serial Data Bus 3 Word Clock G5 WCLK3 I/O Secondary: General Purpose Output General Purpose Input Low-Frequency Clock Input G6 DIN3 I Audio Serial Data Bus 3 Data Input G7 SPI_SELECT I Control Interface Select SPI_SELECT = 1: SPI Interface selected SPI_SELECT = 0: I2C Interface selected G8 RESET I Active Low Reset Master Clock 2 Primary: G9 MCLK2 Clock Input I Secondary: Digital Microphone Data Input Low-Frequency Clock Input Primary: H1 BCLK1 I/O Audio Serial Data Bus 1 Bit Clock Secondary: General Clock Input Primary: Audio Serial Data Bus 1 Data Output Secondary: H2 DOUT1 O H3 IOVDD P H4 SCL I/O I2C Interface Serial Clock (SPI_SELECT = 0) SPI interface mode chip-select signal (SPI_SELECT = 1) H5 SDA I/O I2C interface mode serial data input (SPI_SELECT = 0) SPI interface mode serial data input (SPI_SELECT = 1) General Purpose Output CLKOUT Output SAR ADC Interrupt INT1 Output INT2 Output Digital I/O Buffer Supply Multifunction Digital Output 1 Primary: (SPI_SELECT = 1) Serial Data Output Secondary: (SPI_SELECT = 0) H6 GPO1 O General Purpose Output CLKOUT Output ADC MOD Clock Output SAR ADC Interrupt INT1 Output INT2 Output Primary: Audio Serial Data Bus 3 Bit Clock H7 BCLK3 I/O Secondary: General Purpose Input General Purpose Output Low-Frequency Clock Input 8 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Pin Functions (continued) PIN NO. NAME TYPE DESCRIPTION Multi Function Digital IO 2 Outputs: H8 GPIO2 General Purpose Output ADC MOD Clock Output For Digital Microphone CLKOUT Output SAR ADC Interrupt INT1 Output INT2 Output Audio Serial Data Bus 1 Bit Clock Output ADC Word Clock Output for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Output for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) I/O Inputs: General Purpose Input Digital Microphone Data Input Audio Serial Data Bus 1 Bit Clock Input General Clock Input Low-Frequency Clock Input ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) H9 IOVDD P Digital I/O Buffer Supply Primary: Audio Serial Data Bus 1 Data Input J1 DIN1 I Secondary: General Clock Input Digital Microphone Data Input Primary: Audio Serial Data Bus 1 Word Clock J2 WCLK1 I/O Secondary: Low-Frequency Clock Input General CLKOUT Output J3 DVDD P 1.8V Digital Power Supply J4 IOVSS P Digital I/O Buffer Ground Multifunction Digital Input 1 Primary: (SPI_SELECT = 1) SPI Serial Clock Secondary: (SPI_SELECT = 0) J5 GPI1 I Digital Microphone Data Input General Clock Input Low-Frequency Clock Input General Purpose Input ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) Primary: Audio Serial Data Bus 2 Data Output Secondary: J6 DOUT2 O General Purpose Output ADC MOD Clock Output SAR ADC Interrupt INT1 Output INT2 Output Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 9 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Pin Functions (continued) PIN NO. NAME TYPE DESCRIPTION Primary: Audio Serial Data Bus 3 Data Output J7 DOUT3 O Secondary: General Purpose Output Audio Serial Data Bus 1 Word Clock Output Multi Function Digital IO 1 Outputs: J8 GPIO1 General Purpose Output ADC MOD Clock Output CLKOUT Output SAR ADC Interrupt INT1 Output INT2 Output Audio Serial Data Bus 1 Word Clock Output ADC Word Clock Output for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Output for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) I/O Inputs: General Purpose Input Digital Microphone Data Input Audio Serial Data Bus 1 Word Clock Input General Clock Input Low-Frequency Clock Input ADC Word Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) ADC Bit Clock Input for Audio Serial Data Bus 1, 2, or 3 (Six-Wire Audio Interface) J9 DVDD P 1.8V Digital Power Supply 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AVDD1_18, AVDD2_18, AVDD4_18, AVDD_18 to AVSS1, AVSS2, AVSS4, AVSS respectively (2) –0.3 2.2 V AVDD3_33 to AVSS3 and RECVDD_33 to RECVSS –0.3 3.9 V DVDD to DVSS –0.3 2.2 V IOVDD to IOVSS –0.3 3.9 V HVDD_18 to AVSS –0.3 2.2 V CPVDD_18 to CPVSS –0.3 2.2 V SLVDD to SLVSS, SRVDD to SRVSS, SPK_V to SRVSS (3) –0.3 6 V Digital input voltage to ground IOVSS – 0.3 IOVDD + 0.3 V Analog input voltage to ground V AVSS – 0.3 AVDDx_18 + 0.3 VBAT –0.3 6 V Operating temperature –40 85 °C 105 °C 125 °C Junction temperature (TJ Max) Storage temperature (1) (2) (3) 10 –55 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TI recommends to keep all AVDDx_18 supplies within ± 50 mV of each other. TI recommends to keep SLVDD, SRVDD, and SPK_V supplies within ± 50 mV of each other. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2400 Charged-device model (CDM), per JEDEC specification JESD22C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions AVDD1_18, AVDD2_18, AVDD4_18, AVDD_18 AVDD3_33 , RECVDD_33 Referenced to AVSS1, AVSS2, AVSS4, AVSS respectively (1) TI recommends connecting each of these supplies to a single supply rail. Power supply voltage range Referenced to IOVSS (1) IOVDD DVDD Referenced to AVSS3 and RECVSS respectively (3) NOM MAX 1.5 1.8 1.95 1.65 (2) 3.3 3.6 1.8 1.95 1.26 1.8 1.95 1.5 (2) 1.8 1.95 1.1 Referenced to DVSS (1) CPVDD_18 HVDD_18 MIN Referenced to CPVSS Power supply voltage range Referenced to AVSS (1) (1) Ground-centered configuration Unipolar configuration UNIT V 3.6 1.65 (2) 3.6 V SLVDD (1) Power supply voltage range Referenced to SLVSS (1) 2.7 5.5 V (1) Power supply voltage range Referenced to SRVSS (1) 2.7 5.5 V SPK_V (1) Power supply voltage range Referenced to SRVSS (1) 2.7 5.5 V VREF_SAR External voltage reference for SAR Referenced to AVSS AVDDx_18 V SRVDD PLL input frequency (4) Clock divider uses fractional divide (D > 0), P=1, PLL_CLKIN_DIV=1, DVDD ≥ 1.65V (Refer to table in SLAU360, Maximum TLV320AIC3212 Clock Frequencies) 10 20 MHz Clock divider uses integer divide (D = 0), P=1, PLL_CLKIN_DIV=1, DVDD ≥ 1.65V (Refer to table in SLAU360, Maximum TLV320AIC3212 Clock Frequencies) 0.512 20 MHz MCLK; Master Clock Frequency; IOVDD ≥ 1.65V 50 MCLK; Master Clock Frequency; IOVDD ≥ 1.1V 33 MCLK Master clock frequency SCL SCL clock frequency HPL, HPR Stereo headphone output load Single-ended configuration resistance SPKLPSPKLM, SPKRPSPKRM Speaker output load resistance RECP-RECM Receiver output resistance 1.8 400 MHz kHz 14.4 16 Ω Differential 7.2 8 Ω Differential 24.4 32 Ω CIN Charge pump input capacitor (CPVDD to CPVSS terminals) 10 µF CO Charge pump output capacitor Type X7R (VNEG terminal) 2.2 µF (1) (2) (3) (4) All grounds on board are tied together, so they should not differ in voltage by more than 0.1 V max, for any combination of ground signals. AVDDx_18 are within ±0.05 V of each other. SLVDD, SRVDD, and SPK_V are within ±0.05 V of each other. Minimum voltage for HVDD_18 and RECVDD_33 should be greater than or equal to AVDD2_18. Minimum voltage for AVDD3_33 should be greater than or equal to AVDD1_18 and AVDD2_18. At DVDD values lower than 1.65 V, the PLL does not function. Please see table in SLAU360, Maximum TLV320AIC3212 Clock Frequencies for details on maximum clock frequencies. The PLL Input Frequency refers to clock frequency after PLL_CLKIN_DIV divider. Frequencies higher than 20 MHz can be sent as an input to this PLL_CLKIN_DIV and reduced in frequency prior to input to the PLL. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 11 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Recommended Operating Conditions (continued) MIN CF Charge pump flying capacitor (CPFCP to CPFCM terminals) TOPR Operating temperature range Type X7R NOM MAX UNIT 2.2 –40 µF 85 °C 8.4 Thermal Information TLV320AIC3212 THERMAL METRIC (1) YZF (DSBGA) UNIT 81 PINS RθJA Junction-to-ambient thermal resistance 39.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.1 °C/W RθJB Junction-to-board thermal resistance 12 °C/W ψJT Junction-to-top characterization parameter 0.7 °C/W ψJB Junction-to-board characterization parameter 11.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W (1) 12 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.5 Electrical Characteristics, SAR ADC TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; fS (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SAR ADC INPUTS Analog Input Input voltage range Input impedance 0 Input leakage current VBAT Input voltage range VBAT Input impedance V 1 ÷ (f×CSAR_IN) (1) IN1L/AUX1 or IN1R/AUX2 Selected Input capacitance, CSAR_IN Battery Input VREF_SAR kΩ 25 pF 1 µA 2.2 5.5 V 5 VBAT (Battery measurement) selected VBAT Input capacitance VBAT Input leakage current kΩ 25 pF 1 µA SAR ADC CONVERSION IN1L/ AUX1 Resolution Programmable: 8-bit, 10-bit, 12-bit No missing codes 12-bit resolution 11 Bits 12-bit resolution, SAR ADC clock = Internal Oscillator Clock, Conversion clock = Internal Oscillator / 4, External Reference = 1.8V (2) ±1 LSB ±1 LSB Integral linearity Offset error Gain error Noise VBAT Accuracy Offset error Gain error Noise 8 12 Bits 0.07% DC voltage applied to IN1L/AUX1 = 1 V, SAR ADC clock = Internal Oscillator Clock, Conversion clock = Internal Oscillator / 4, External Reference = 1.8V (3) (2) ±1 12-bit resolution, SAR ADC clock = Internal Oscillator Clock, Conversion clock = Internal Oscillator / 4, Internal Reference = 1.25V LSB 2% ±2 LSB 1.5% DC voltage applied to VBAT = 3.6 V, 12bit resolution, SAR ADC clock = Internal Oscillator Clock, Conversion clock = Internal Oscillator / 4, Internal Reference = 1.25V ±0.5 LSB CONVERSION RATE Normal conversion operation High-speed conversion operation 12-bit resolution, SAR ADC clock = 12 MHz External Clock, Conversion clock = External Clock / 4, External Reference = 1.8V (2). With Fast SPI reading of data. 119 kHz 8-bit resolution,SAR ADC clock = 12 MHz External Clock, Internal Conversion clock = External Clock (Conversion accuracy is reduced.), External Reference = 1.8V (2). With Fast SPI reading of data. 250 kHz VOLTAGE REFERENCE - VREF_SAR Voltage range Internal VREF_SAR External VREF_SAR Reference Noise 1.25±0.05 1.25 CM=0.9V, Cref = 1μF Decoupling Capacitor (1) (2) (3) V AVDDx_18 V 32 μVRMS 1 μF SAR input impedance is dependent on the sampling frequency (f designated in Hz), and the sampling capacitor is CSAR_IN = 25 pF. When using External SAR reference, this external reference must be restricted VEXT_SAR_REF≤AVDD_18 and AVDD2_18. Noise from external reference voltage is excluded from this measurement. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 13 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.6 Electrical Characteristics, ADC TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; fS (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER AUDIO ADC (CM = 0.9 V) TEST CONDITIONS MIN Input signal level (0dB) Single-ended, CM = 0.9 V MAX 0.5 Device Setup 1-kHz sine wave input, Single-ended Configuration IN2R to Right ADC and IN2L to Left ADC, Rin = 20 kΩ, fs = 48 kHz, AOSR = 128, MCLK = 256*fs, PLL Disabled; AGC = OFF, Channel Gain = 0 dB, Processing Block = PRB_R1, Power Tune = PTM_R4 Inputs AC-shorted to ground UNIT 85 VRMS 93 IN1R, IN3R, IN4R each exclusively routed in separate tests to Right ADC and AC-shorted to ground IN1L, IN3L, IN4L each exclusively routed in separate tests to Left ADC and AC-shorted to ground 93 –60dB full-scale, 1-kHz input signal 93 –3 dB full-scale, 1-kHz input signal –87 IN1R,IN3R, IN4R each exclusively routed in separate tests to Right ADC IN1L, IN3L, IN4L each exclusively routed in separate tests to Left ADC –3-dB full-scale, 1-kHz input signal –87 Gain Error 1kHz sine wave input at -3dBFS, Single-ended configuration Rin = 20 K fs = 48 kHz, AOSR=128, MCLK = 256* fs, PLL Disabled AGC = OFF, Channel Gain=0 dB, Processing Block = PRB_R1, Power Tune = PTM_R4, CM=0.9 V 0.1 dB Input Channel Separation 1kHz sine wave input at –3 dBFS, Single-ended configuration IN1L routed to Left ADC, IN1R routed to Right ADC, Rin = 20 K AGC = OFF, AOSR = 128, Channel Gain=0 dB, CM=0.9 V 110 dB Input Pin Crosstalk 1-kHz sine wave input at –3 dBFS on IN2L, IN2L internally not routed. IN1L routed to Left ADC, AC-coupled to ground 116 dB 59 dB SNR Signal-to-noise ratio, Aweighted (1) (2) DR Dynamic range Aweighted (1) (2) THD+N TYP (1) (2) Total Harmonic Distortion plus Noise dB dB –70 dB 1-kHz sine wave input at –3 dBFS on IN2R, IN2R internally not routed. IN1R routed to Right ADC, AC-coupled to ground Single-ended configuration Rin = 20 kΩ, AOSR=128 Channel Gain=0 dB, CM=0.9 V PSRR 217Hz, 100mVpp signal on AVDD_18, AVDDx_18 Single-ended configuration, Rin=20 kΩ, Channel Gain=0 dB; CM=0.9 V AUDIO ADC (CM = 0.75 V) (1) (2) 14 Input signal level (0dB) Single-ended, CM=0.75 V, AVDD_18, AVDDx_18 = 1.5 V Device Setup 1-kHz sine wave input, Single-ended Configuration IN2R to Right ADC and IN2L to Left ADC, Rin = 20 K, fs = 48 kHz, AOSR = 128, MCLK = 256*fs, PLL Disabled; AGC = OFF, Channel Gain = 0 dB, Processing Block = PRB_R1, Power Tune = PTM_R4 0.375 VRMS Ratio of output level with 1-kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a 20-Hz to 20-kHz bandwidth using an audio analyzer. All performance measurements done with pre-analyzer 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Electrical Characteristics, ADC (continued) TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; fS (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Inputs AC-shorted to ground 91 dB IN1R, IN3R, IN4R each exclusively routed in separate tests to Right ADC and AC-shorted to ground IN1L, IN3L, IN4L each exclusively routed in separate tests to Left ADC and AC-shorted to ground 91 dB SNR Signal-to-noise ratio, Aweighted (1) (2) DR Dynamic range Aweighted (1) (2) –60-dB full-scale, 1-kHz input signal 91 dB THD+N Total Harmonic Distortion plus Noise –3-dB full-scale, 1-kHz input signal –85 dB AUDIO ADC (Differential Input, CM = 0.9 V) Input signal level (0dB) Differential, CM=0.9 V, AVDD_18, AVDDx_18 = 1.8 V Device Setup 1-kHz sine wave input, Differential Configuration IN1L, IN1R Routed to Right ADC, IN2L, IN2R Routed to Left ADC Rin = 20 kΩ, fs = 48 kHz, AOSR=128, MCLK = 256* fs, PLL Disabled, AGC = OFF, Channel Gain = 0 dB, Processing Block = PRB_R1, Power Tune = PTM_R4 1 VRMS SNR Signal-to-noise ratio, Aweighted (1) (2) Inputs AC-shorted to ground 94 dB DR Dynamic range Aweighted (1) (2) –60-dB full-scale, 1-kHz input signal 94 dB THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –88 dB Gain Error 1-kHz sine wave input at –3 dBFS, Differential configuration Rin = 20 kΩ, fs = 48 kHz, AOSR=128, MCLK = 256* fs, PLL Disabled AGC = OFF, Channel Gain=0 dB, Processing Block = PRB_R1, Power Tune = PTM_R4, CM=0.9 V 0.1 dB Input Channel Separation 1kHz sine wave input at –3 dBFS, Differential configuration IN1L/IN1R differential signal routed to Right ADC, IN2L/IN2R differential signal routed to Left ADC, Rin = 20 kΩ AGC = OFF, AOSR = 128, Channel Gain=0 dB, CM=0.9 V 107 dB Input Pin Crosstalk 1-kHz sine wave input at –3 dBFS on IN2L/IN2R, IN2L/IN2R internally not routed. IN1L/IN1R differentially routed to Right ADC, AC-coupled to ground 109 dB 59 dB 1-kHz sine wave input at –3 dBFS on IN2L/IN2R, IN2L/IN2R internally not routed. IN3L/IN3R differentially routed to Left ADC, AC-coupled to ground Differential configuration Rin = 20 kΩ, AOSR=128 Channel Gain=0 dB, CM=0.9 V PSRR 217 Hz, 100 mVpp signal on AVDD_18, AVDDx_18 Differential configuration, Rin=20 K, Channel Gain=0 dB; CM=0.9 V AUDIO ADC IN1 - IN3, Single-Ended, Rin = 10 K, PGA gain set to 0 dB IN1 - IN3, Single-Ended, Rin = 10 K, PGA gain set to 47.5 dB IN1 - IN3, Single-Ended, Rin = 20 K, PGA gain set to 0 dB 0 dB 47.5 dB –6 dB ADC programmable gain IN1 - IN3, Single-Ended, Rin = 20 K, PGA gain set to 47.5 dB amplifier gain IN1 - IN3, Single-Ended, Rin = 40 K, PGA gain set to 0 dB 41.5 dB –12 dB IN1 - IN3, Single-Ended, Rin = 40 K, PGA gain set to 47.5 dB 35.5 dB –6 dB 41.5 dB 0.5 dB IN4, Single-Ended, Rin = 20 K, PGA gain set to 0 dB IN4, Single-Ended, Rin = 20 K, PGA gain set to 47.5 dB ADC programmable gain 1-kHz tone amplifier step size Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 15 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.7 Electrical Characteristics, Bypass Outputs TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG BYPASS TO RECEIVER AMPLIFIER, DIRECT MODE Device Setup Load = 32Ω (differential), 56pF; Input CM=0.9V; Output CM=1.65V; IN1L routed to RECP and IN1R routed to RECM; Channel Gain=0dB Full scale differential input voltage (0dB) THD+N 1 VRMS Gain Error 707mVrms (-3dBFS), 1-kHz input signal 0.5 dB Noise, A-weighted (1) Idle Channel, IN1L and IN1R ac-shorted to ground 13 μVRMS Total Harmonic Distortion plus Noise 707mVrms (-3dBFS), 1-kHz input signal –88 dB 0.5 VRMS –1.2 dB ANALOG BYPASS TO HEADPHONE AMPLIFIER, PGA MODE Device Setup Load = 16 Ω (single-ended), 56 pF; HVDD_18 = 3.3 V Input CM=0.9 V; Output CM=1.65 V IN1L routed to ADCPGA_L, ADCPGA_L routed through MAL to HPL; and IN1R routed to ADCPGA_R, ADCPGA_R routed through MAR to HPR; Rin = 20 K; Channel Gain = 0 dB Full scale input voltage (0 dB) THD+N Gain Error 446 mVrms (–1dBFS), 1-kHz input signal Noise, A-weighted (1) Idle Channel, IN1L and IN1R AC-shorted to ground Total Harmonic Distortion plus Noise 446 mVrms (–1dBFS), 1-kHz input signal 6 –81 μVRMS dB ANALOG BYPASS TO HEADPHONE AMPLIFIER (GROUND-CENTERED CIRCUIT CONFIGURATION), PGA MODE Device Setup Load = 16 Ω (single-ended), 56 pF; Input CM=0.9 V; IN1L routed to ADCPGA_L, ADCPGA_L routed through MAL to HPL; and IN1R routed to ADCPGA_R, ADCPGA_R routed through MAR to HPR; Rin = 20 K; Channel Gain = 0 dB Full scale input voltage (0dB) THD+N 0.5 VRMS Gain Error 446 mVrms (-1dBFS), 1-kHz input signal –1 dB Noise, A-weighted (1) Idle Channel, IN1L and IN1R ac-shorted to ground 11 μVRMS Total Harmonic Distortion plus Noise 446mVrms (-1dBFS), 1-kHz input signal –67 dB 0.5 VRMS –0.7 dB ANALOG BYPASS TO LINE-OUT AMPLIFIER, PGA MODE Device Setup Load = 10KOhm (single-ended), 56pF; Input and Output CM=0.9V; IN1L routed to ADCPGA_L and IN1R routed to ADCPGA_R; Rin = 20k ADCPGA_L routed through MAL to LOL and ADCPGA_R routed through MAR to LOR; Channel Gain = 0dB Full scale input voltage (0dB) Gain Error (1) 16 446mVrms (-1dBFS), 1-kHz input signal All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Electrical Characteristics, Bypass Outputs (continued) TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS Noise, A-weighted (1) MIN TYP MAX UNIT Idle Channel, IN1L and IN1R ac-shorted to ground 6 μVRMS Channel Gain=40dB, Inputs ac-shorted to ground, Input Referred 3 μVRMS 0.5 VRMS –0.3 dB ANALOG BYPASS TO LINE-OUT AMPLIFIER, DIRECT MODE Load = 10 kΩ (single-ended), 56 pF; Input and Output CM=0.9 V; IN1L routed to LOL and IN1R routed to LOR; Channel Gain = 0 dB Device Setup Full scale input voltage (0dB) Gain Error 446mVrms (-1dBFS), 1-kHz input signal Noise, A-weighted (1) Idle Channel, IN1L and IN1R AC-shorted to ground μVRMS 3 8.8 Electrical Characteristics, Microphone Interface TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT MICROPHONE BIAS (MICBIAS or MICBIAS_EXT) CM=0.9V, AVDD3_33 = 1.8 V Bias voltage Micbias Mode 0 1.63 V Micbias Mode 3 AVDD3_33 V Micbias Mode 0 1.36 V Micbias Mode 3 AVDD3_33 V Micbias Mode 0 1.63 V Micbias Mode 1 2.36 V Micbias Mode 2 2.91 V Micbias Mode 3 AVDD3_33 V Micbias Mode 0 1.36 V Micbias Mode 1 1.97 V Micbias Mode 2 2.42 V Micbias Mode 3 AVDD3_33 CM=0.75V, AVDD3_33 = 1.8 V MICROPHONE BIAS (MICBIAS or MICBIAS_EXT) CM=0.9 V, AVDD3_33 = 3.3 V Bias voltage Output Noise CM=0.75 V, AVDD3_33 = 3.3 V CM=0.9V, Micbias Mode 2, A-weighted, 20-Hz to 20-kHz bandwidth, Current load = 0 mA. Micbias Mode 0 (CM=0.9V) (1) (2) (1) Current Sourcing Micbias Mode 1 or Micbias Mode 2 (CM=0.9 V) (2) Inline Resistance Micbias Mode 3 V 26 μVRMS 184 nV/√Hz 3 mA 7 mA 63.6 Ω To provide 3 mA, Micbias Mode 0 voltage yields typical voltage of 1.60 V for Common Mode of 0.9 V. To provide 7 mA, Micbias Mode 1 voltage yields typical voltage of 2.31 V, and Micbias Mode 2 voltage yields typical voltage of 2.86 V for Common Mode of 0.9 V. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 17 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.9 Electrical Characteristics, Audio DAC Outputs TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AUDIO DAC – STEREO SINGLE-ENDED LINE OUTPUT Load = 10 kΩ (single-ended), 56 pF Input & Output CM=0.9 V DOSR = 128, MCLK=256* fs, Channel Gain = 0 dB, Processing Block = PRB_P1, Power Tune = PTM_P4 Device Setup Full scale output voltage (0dB) SNR Signal-to-noise ratio A-weighted (1) (2) (1) (2) All zeros fed to DAC input 85 0.5 VRMS 101 dB –60-dB 1-kHz input full-scale signal, Word length=20 bits 101 dB –88 dB DR Dynamic range, A-weighted THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal DAC Gain Error –3dB full-scale, 1-kHz input signal 0.1 dB DAC Mute Attenuation Mute 119 dB DAC channel separation –1 dB, 1kHz signal, between left and right Line out 108 dB 100mVpp, 1kHz signal applied to AVDD_18, AVDDx_18 71 dB 100mVpp, 217Hz signal applied to AVDD_18, AVDDx_18 71 dB DAC PSRR AUDIO DAC – STEREO SINGLE-ENDED LINE OUTPUT Load = 10 kΩ (single-ended), 56pF Input & Output CM=0.75V; AVDD_18, AVDDx_18, HVDD_18=1.5V DOSR = 128 MCLK=256* fs Channel Gain = 0dB Processing Block = PRB_P1 Power Tune = PTM_P4 Device Setup Full scale output voltage (0dB) SNR 0.375 Signal-to-noise ratio, A-weighted (1) (2) (1) (2) DR Dynamic range, A-weighted THD+N Total Harmonic Distortion plus Noise 99 All zeros fed to DAC input –60dB 1 kHz input full-scale signal, Word length=20 bits –3 dB full-scale, 1-kHz input signal 99 –88 VRMS dB dB dB AUDIO DAC – MONO DIFFERENTIAL LINE OUTPUT Load = 10 kΩ (differential), 56pF Input & Output CM=0.9V, LOL signal routed to LOR amplifier DOSR = 128, MCLK=256* fs, Channel Gain = 0dB, Processing Block = PRB_P1, Power Tune = PTM_P4 Device Setup Full scale output voltage (0dB) SNR Signal-to-noise ratio A-weighted DR Dynamic range, A-weighted THD+N (1) (2) 18 1 (1) (2) VRMS All zeros fed to DAC input 101 dB –60dB 1kHz input full-scale signal, 101 dB Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –86 dB DAC Gain Error –3dB full-scale, 1-kHz input signal 0.1 dB (1) (2) Ratio of output level with 1kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a 20Hz to 20kHz bandwidth using an audio analyzer. All performance measurements done with 20kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Electrical Characteristics, Audio DAC Outputs (continued) TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS DAC Mute Attenuation DAC PSRR MIN TYP Mute 97 100mVpp, 1kHz signal applied to AVDD_18, AVDDx_18 62 100mVpp, 217Hz signal applied to AVDD_18, AVDDx_18 63 MAX UNIT dB dB dB AUDIO DAC – STEREO SINGLE-ENDED HEADPHONE OUTPUT (GROUND-CENTERED CIRCUIT CONFIGURATION) Load = 16Ω (single-ended), 56pF, Input CM=0.9V; DOSR = 128, MCLK=256* fs, Channel Gain = 0dB, Processing Block = PRB_P1, Power Tune = PTM_P3, Headphone Output Strength=100% Device Setup Output 1 SNR Output voltage Signal-to-noise ratio, A-weighted 0.5 VRMS 94 dB (3) All zeros fed to DAC input (4) (3) (4) 80 DR Dynamic range, A-weighted –60dB 1 kHz input full-scale signal 93 THD+N Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –71 DAC Gain Error –3dB, 1kHz input full scale signal –0.2 dB DAC Mute Attenuation Mute 92 dB DAC channel separation –3dB, 1kHz signal, between left and right HP out 83 dB 100mVpp, 1kHz signal applied to AVDD_18, AVDD1x_18 55 dB 100mVpp, 217Hz signal applied to AVDD_18, AVDD1x_18 55 dB DAC PSRR dB –55 dB Power Delivered THDN ≤ -40dB, Load = 16Ω 15 mW Output 2 Output voltage Load = 16Ω (single-ended), Channel Gain = 5dB 0.8 VRMS SNR Signal-to-noise ratio, A-weighted (3) All zeros fed to DAC input, Load = 16Ω 96 dB (4) Power Delivered THDN ≤ -40dB, Load = 16Ω 24 mW Output 3 Output voltage Load = 32Ω (single-ended), Channel Gain = 5dB 0.9 VRMS SNR Signal-to-noise ratio, A-weighted (3) All zeros fed to DAC input, Load = 32Ω 97 dB THDN ≤ -40dB, Load = 32Ω 22 mW (4) Power Delivered AUDIO DAC – STEREO SINGLE-ENDED HEADPHONE OUTPUT (UNIPOLAR CIRCUIT CONFIGURATION) Load = 16Ω (single-ended), 56pF Input & Output CM=0.9V, DOSR = 128, MCLK=256* fs, Channel Gain=0dB Processing Block = PRB_P1 Power Tune = PTM_P4 Headphone Output Control = 100% Device Setup Full scale output voltage (0dB) SNR Dynamic range, A-weighted DR THD+N (3) (4) Signal-to-noise ratio, A-weighted (3) (4) (3) (4) 0.5 VRMS All zeros fed to DAC input 100 dB –60dB 1kHz input full-scale signal, Power Tune = PTM_P4 100 dB Total Harmonic Distortion plus Noise –3dB full-scale, 1-kHz input signal –79 dB DAC Gain Error –3dB, 1kHz input full scale signal –0.2 dB Ratio of output level with 1kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a 20Hz to 20kHz bandwidth using an audio analyzer. All performance measurements done with 20kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 19 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Electrical Characteristics, Audio DAC Outputs (continued) TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS DAC Mute Attenuation Mute DAC channel separation DAC PSRR Power Delivered MIN TYP MAX UNIT 119 dB –1dB, 1kHz signal, between left and right HP out 88 dB 100mVpp, 1kHz signal applied to AVDD_18, AVDD1x_18 64 dB 100mVpp, 217Hz signal applied to AVDD_18, AVDD1x_18 70 dB RL=16Ω THDN ≤ -40dB, Input CM=0.9V, Output CM=0.9V 15 mW 0.375 VRMS AUDIO DAC – STEREO SINGLE-ENDED HEADPHONE OUTPUT (UNIPOLAR CIRCUIT CONFIGURATION) Load = 16Ω (single-ended), 56pF, Input & Output CM=0.75V; AVDD_18, AVDDx_18, HVDD_18=1.5V, DOSR = 128, MCLK=256* fs, Channel Gain = 0dB, Processing Block = PRB_P1, Power Tune = PTM_P4 Headphone Output Control = 100% Device Setup Full scale output voltage (0dB) SNR Signal-to-noise ratio, A-weighted (3) (4) (3) (4) DR Dynamic range, A-weighted THD+N Total Harmonic Distortion plus Noise All zeros fed to DAC input 99 dB -60dB 1 kHz input full-scale signal 99 dB –3dB full-scale, 1-kHz input signal –77 dB AUDIO DAC – MONO DIFFERENTIAL RECEIVER OUTPUT Load = 32 Ω (differential), 56pF, Output CM=1.65V, AVDDx_18=1.8V, DOSR = 128 MCLK=256* fs, Left DAC routed to LOL to RECP, LOL signal routed to LOR to RECM, Channel (Receiver Driver) Gain = 6dB for full scale output signal, Processing Block = PRB_P4, Power Tune = PTM_P4 Device Setup Full scale output voltage (0dB) (3) (4) SNR Signal-to-noise ratio, A-weighted DR Dynamic range, A-weighted THD+N Total Harmonic Distortion plus Noise (3) (4) DAC PSRR Power Delivered 20 All zeros fed to DAC input 90 2 VRMS 99 dB –60dB 1kHz input full-scale signal 97 dB –3dB full-scale, 1-kHz input signal –81 dB 100mVpp, 1kHz signal applied to AVDD_18, AVDD1x_18 56 100mVpp, 217Hz signal applied to AVDD_18, AVDD1x_18 58 RL=32Ω THDN ≤ -40dB, Input CM=0.9V, Output CM=1.65V Submit Documentation Feedback dB dB 117 mW Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.10 Electrical Characteristics, Class-D Outputs TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DAC OUTPUT to CLASS-D SPEAKER OUTPUT; Load = 8Ω (Differential), 56pF+33µH Output voltage SLVDD=SRVDD=3.6, BTL measurement, DAC input = 0dBFS, class-D gain = 12dB, THD+N ≤ –20dB, CM=0.9V 2.67 SNR Signal-to-noise ratio SLVDD=SRVDD=3.6V, BTL measurement, class-D gain = 6dB, measured as idle-channel noise, Aweighted (with respect to full-scale output value of 2 Vrms) (1) (2), CM=0.9V 91 dB THD Total harmonic distortion SLVDD=SRVDD=3.6V, BTL measurement, DAC input = 0dBFS, class-D gain = 6dB, CM=0.9V –66 dB THD+N Total harmonic distortion + noise SLVDD=SRVDD=3.6V, BTL measurement, DAC input = 0dBFS, class-D gain = 6dB, CM=0.9V –66 dB SLVDD=SRVDD=3.6V, BTL measurement, ripple on SPKVDD = 200 mVp-p at 1 kHz, CM=0.9V 67 dB PSRR Power-supply rejection ratio SLVDD=SRVDD=3.6V, BTL measurement, ripple on SPKVDD = 200 mVp-p at 217 Hz, CM=0.9V 67 dB 102 dB Mute attenuation Analog Mute Only THD+N = 10%, f = 1 kHz, Class-D Gain = 12 dB, CM = 0.9 V, RL = 8 Ω PO Maximum output power THD+N = 1%, f = 1 kHz, Class-D Gain = 12 dB, CM = 0.9 V, RL = 8 Ω SLVDD = SRVDD = 3.6 V 0.72 SLVDD = SRVDD = 4.2 V 1.00 SLVDD = SRVDD = 5.5 V 1.70 SLVDD = SRVDD = 3.6 V 0.58 SLVDD = SRVDD = 4.2 V 0.80 SLVDD = SRVDD = 5.5 V 1.37 VRMS W DAC OUTPUT to CLASS-D SPEAKER OUTPUT; Load = 8 Ω (Differential), 56pF+33µH Output voltage SLVDD=SRVDD=5.0V, BTL measurement, DAC input = 0dBFS, class-D gain = 12dB, THD+N ≤ –20dB, CM=0.9V SNR Signal-to-noise ratio SLVDD=SRVDD=5.0V, BTL measurement, class-D gain = 6dB, measured as idle-channel noise, Aweighted (with respect to full-scale output value of 2 Vrms) (1) (2) , CM=0.9V THD Total harmonic distortion SLVDD=SRVDD=5.0V, BTL measurement, DAC input = 0dBFS, class-D gain = 6dB, CM=0.9V –70 THD+N Total harmonic distortion + noise SLVDD=SRVDD=5.0V, BTL measurement, DAC input = 0dBFS, class-D gain = 6dB, CM=0.9V –70 PSRR Power-supply rejection ratio PO (1) (2) 3.46 91 SLVDD=SRVDD=5.0V, BTL measurement, ripple on SPKVDD = 200mVp-p at 1kHz, CM=0.9V 67 SLVDD=SRVDD=5.0V, BTL measurement, ripple on SPKVDD = 200 mVp-p at 217 Hz, CM=0.9V 67 Mute attenuation Analog Mute Only Maximum output power THD+N = 10%, f = 1 kHz, Class-D Gain = 12 dB, CM = 0.9 V, RL = 8 Ω SLVDD = SRVDD = 5.0 V VRMS 102 dB 1.41 W Ratio of output level with 1kHz full-scale sine wave input, to the output level with the inputs short circuited, measured A-weighted over a 20Hz to 20kHz bandwidth using an audio analyzer. All performance measurements done with 20kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 21 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.11 Electrical Characteristics, Miscellaneous TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT REFERENCE - VREF_AUDIO Reference Voltage Settings CMMode = 0 (0.9V) 0.9 CMMode = 1 (0.75V) 0.75 CM=0.9V, A-weighted, 20Hz to 20kHz bandwidth, Cref = 1μF Reference Noise V μVRMS 1.2 1 μF 99 μA 9.8 μW I(DVDD) 2.6 μA I(IOVDD) 0.15 μA I(AVDD1_18, AVDD2_18, AVDD4_18, AVDD_18, HVDD_18, CPVDD_18) 1.15 μA I(RECVDD_33, AVDD3_33) 0.15 μA I(SLVDD, SRVDD, SPK_V) 0.5 μA Decoupling Capacitor Bias Current SHUTDOWN POWER (1) Device Setup Coarse AVdd supply turned off, All External analog supplies powered and set available, No external digital input is toggled, register values are retained. P(total) (1) Sum of all supply currents, all supplies at 1.8 V except for SLVDD = SRVDD = SPK_V = 3.6 V and RECVDD_33 = AVDD3_33 = 3.3 V For further details on playback and recording power consumption, refer to Powertune section in SLAU360. 8.12 Electrical Characteristics, Logic Levels TA = 25°C; AVDD_18, AVDDx_18, HVDD_18, CPVDD_18, DVDD, IOVDD = 1.8 V; AVDD3_33, RECVDD_33 = 3.3 V; SLVDD, SRVDD, SPK_V = 3.6 V; f S (Audio) = 48 kHz; Audio Word Length = 16 bits; Cext = 1 μF on VREF_SAR and VREF_AUDIO pins; PLL disabled unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT LOGIC FAMILY (CMOS) VIH Logic Level IIH = 5 μA, IOVDD > 1.65 V 0.7 × IOVDD V IIH = 5 μA, 1.2 V ≤ IOVDD 1.65 V VIL V –0.3 IIL = 5 μA, 1.2 V ≤ IOVDD 1.65 V 0.8 × IOVDD IOH = 1-mA load, IOVDD < 1.65 V 0.8 × IOVDD 0 V V 0.1 × IOVDD 10 Submit Documentation Feedback V 0.1 × IOVDD IOL = 1-mA load, IOVDD < 1.65 V 22 V 0.1 × IOVDD V IOL = 3-mA load, IOVDD > 1.65 V Capacitive Load 0.3 × IOVDD V V pF Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.13 Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Master Mode Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. WCLK represents WCLK1 pin for Audio Serial Interface number 1, WCLK2 pin for Audio Serial Interface number 2, and WCLK3 pin for Audio Serial Interface number 3. BCLK represents BCLK1 pin for Audio Serial Interface number 1, BCLK2 pin for Audio Serial Interface number 2, and BCLK3 pin for Audio Serial Interface number 3. DOUT represents DOUT1 pin for Audio Serial Interface number 1, DOUT2 pin for Audio Serial Interface number 2, and DOUT3 pin for Audio Serial Interface number 3. DIN represents DIN1 pin for Audio Serial Interface number 1, DIN2 pin for Audio Serial Interface number 2, and DIN3 pin for Audio Serial Interface number 3. Specifications are at 25° C with DVDD = 1.8 V and IOVDD = 1.8 V. (See Figure 1) IOVDD=1.8 V PARAMETER MIN IOVDD=3.3 V MAX MIN MAX UNIT td(WS) WCLK delay 22 20 ns td (DO-WS) WCLK to DOUT delay (For LJF Mode only) 22 20 ns td (DO-BCLK) BCLK to DOUT delay 22 20 ns ts(DI) DIN setup 4 th(DI) DIN hold 4 tr BCLK Rise time 10 8 ns tf BCLK Fall time 10 8 ns 4 ns 4 ns WCLK td(WS) BCLK td(DO-WS) td(DO-BCLK) DOUT th(DI) tS(DI) DIN Figure 1. I2S/LJF/RJF Timing in Master Mode Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 23 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.14 Audio Data Serial Interface Timing (I2S): I2S/LJF/RJF Timing in Slave Mode Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. WCLK represents WCLK1 pin for Audio Serial Interface number 1, WCLK2 pin for Audio Serial Interface number 2, and WCLK3 pin for Audio Serial Interface number 3. BCLK represents BCLK1 pin for Audio Serial Interface number 1, BCLK2 pin for Audio Serial Interface number 2, and BCLK3 pin for Audio Serial Interface number 3. DOUT represents DOUT1 pin for Audio Serial Interface number 1, DOUT2 pin for Audio Serial Interface number 2, and DOUT3 pin for Audio Serial Interface number 3. DIN represents DIN1 pin for Audio Serial Interface number 1, DIN2 pin for Audio Serial Interface number 2, and DIN3 pin for Audio Serial Interface number 3. Specifications are at 25° C with DVDD = 1.8 V and IOVDD = 1.8 V. (See Figure 2) IOVDD=1.8 V PARAMETER MIN IOVDD=3.3 V MAX MIN MAX UNIT tH (BCLK) BCLK high period 30 30 ns tL (BCLK) BCLK low period 30 30 ns ts (WS) WCLK setup 4 4 ns th (WS) WCLK hold 4 4 ns td (DO-WS) WCLK to DOUT delay (For LJF mode only) 22 20 ns td (DO-BCLK) BCLK to DOUT delay 22 20 ns ts(DI) DIN setup 4 th(DI) DIN hold 4 tr BCLK Rise time 5 4 ns tf BCLK Fall time 5 4 ns 4 ns 4 ns WCLK th(WS) BCLK tL(BCLK) tH(BCLK) ts(WS) td(DO-WS) td(DO-BCLK) DOUT ts(DI) th(DI) DIN Figure 2. I2S/LJF/RJF Timing in Slave Mode 24 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.15 Typical DSP Timing: DSP/Mono PCM Timing in Master Mode Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. Specifications are at 25° C with DVDD = 1.8 V. (See Figure 3) IOVDD=1.8 V PARAMETER MIN MAX IOVDD=3.3 V MIN MAX UNIT td (WS) WCLK delay 22 20 ns td (DO-BCLK) BCLK to DOUT delay 22 20 ns ts(DI) DIN setup 4 4 th(DI) DIN hold 4 4 tr BCLK Rise time 10 8 ns tf BCLK Fall time 10 8 ns ns ns WCLK td(WS) td(WS) BCLK td(DO-BCLK) DOUT th(DI) ts(DI) DIN Figure 3. DSP/Mono PCM Timing in Master Mode Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 25 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.16 Typical DSP Timing: DSP/Mono PCM Timing in Slave Mode Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. Specifications are at 25° C with DVDD = 1.8 V. (See Figure 4) IOVDD=1.8 V PARAMETER MIN IOVDD=3.3 V MAX MIN MAX UNIT tH (BCLK) BCLK high period 30 30 ns tL (BCLK) BCLK low period 30 30 ns ts(WS) WCLK setup 4 4 ns th(WS) WCLK hold 4 4 td (DO-BCLK) BCLK to DOUT delay ts(DI) DIN setup 5 th(DI) DIN hold 5 tr BCLK Rise time 5 4 ns tf BCLK Fall time 5 4 ns 22 ns 20 5 ns ns 5 ns WCLK th(ws) BCLK ts(ws) th(ws) th(ws) tL(BCLK) tH(BCLK) td(DO-BCLK) DOUT ts(DI) th(DI) DIN Figure 4. DSP/Mono PCM Timing in Slave Mode 26 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.17 I2C Interface Timing Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. (See Figure 5) STANDARD-MODE PARAMETER MIN 0 TYP FAST-MODE MAX MIN 100 0 TYP MAX fSCL SCL clock frequency tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. 4.0 0.8 μs tLOW LOW period of the SCL clock 4.7 1.3 μs tHIGH HIGH period of the SCL clock 4.0 0.6 μs tSU;STA Setup time for a repeated START condition 4.7 0.8 μs tHD;DAT Data hold time: For I2C bus devices tSU;DAT Data set-up time tr SDA and SCL Rise Time 1000 20+0.1Cb 300 ns tf SDA and SCL Fall Time 300 20+0.1Cb 300 ns tSU;STO Set-up time for STOP condition 4.0 0.8 μs tBUF Bus free time between a STOP and START condition 4.7 1.3 μs Cb Capacitive load for each bus line 0 3.45 0 250 400 UNIT 0.9 100 400 kHz μs ns 400 pF Figure 5. I2C Interface Timing Diagram Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 27 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 8.18 SPI Timing Note: All timing specifications are measured at characterization but not tested at final test. The audio serial interface timing specifications are applied to Audio Serial Interface number 1, Audio Serial Interface number 2 and Audio Serial Interface number 3. SS = SCL pin, SCLK = GPI1 pin, MISO = GPO1 pin, and MOSI = SDA pin. Specifications are at 25° C with DVDD = 1.8 V. (See Figure 6) IOVDD=1.8 V PARAMETER MIN TYP IOVDD=3.3 V MAX MIN TYP MAX UNIT tsck SCLK Period (1) 50 40 ns tsckh SCLK Pulse width High 25 20 ns tsckl SCLK Pulse width Low 25 20 ns tlead Enable Lead Time 25 20 ns ttrail Enable Trail Time 25 20 ns td;seqxfr Sequential Transfer Delay 25 20 ns ta Slave DOUT (MISO) access time 25 20 ns tdis Slave DOUT (MISO) disable time 25 20 ns tsu DIN (MOSI) data setup time 8 8 ns th;DIN DIN (MOSI) data hold time 8 8 ns tv;DOUT DOUT (MISO) data valid time 20 14 ns tr SCLK Rise Time 4 4 ns tf SCLK Fall Time 4 4 ns (1) These parameters are based on characterization and are not tested in production. SS S t t Lead t Lag t td sck SCLK tf t sckl tr t sckh t v(DOUT) t dis MISO MSB OUT ta MOSI t su BIT 6 . . . 1 LSB OUT t h(DIN) MSB IN BIT 6 . . . 1 LSB IN Figure 6. SPI Timing Diagram 28 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 8.19 Typical Characteristics 8.19.1 Audio ADC Performance 0 Rin = 10k, DE 110 Rin = 20k, DE Amplitude (dBFS) SNR (dB) −20 Rin = 40k, DE 105 100 Rin = 10k, SE 95 Rin = 20k, SE 90 Rin = 40k, SE −40 −60 −80 −100 −120 85 −10 0 10 20 30 Channel Gain (dB) 40 −140 0.02 50 0.1 1 Frequency (kHz) G001 Figure 7. ADC SNR vs Channel Gain Input-Referred 10 20 G002 Figure 8. ADC Single Ended Input to ADC Fft at -3 DBR vs Frequency 0 Amplitude (dBFS) −20 −40 −60 −80 −100 −120 −140 0.02 0.1 1 Frequency (kHz) 10 20 G003 Figure 9. ADC Differential Input to ADC FFT at -3 DBR vs Frequency 0 0 −20 −20 −40 −40 Amplitude (dBr) Amplitude (dBr) 8.19.2 Audio DAC Performance −60 −80 −60 −80 −100 −100 −120 −120 −140 0.02 0.1 1 Frequency (kHz) 10 20 −140 0.02 G004 Figure 10. DAC to Line Output FFT Amplitude at -3 dBFS vs Frequency 10-kΩ Load 0.1 1 Frequency (kHz) 10 20 G005 Figure 11. DAC to Headphone Output (GCHP) FFT Amplitude at -3 dBFS vs Frequency 16-Ω Load Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 29 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 0 0 −20 −20 −40 −40 Amplitude (dBr) −60 −80 −80 −100 −100 −120 −120 −140 0.02 0.1 1 Frequency (kHz) 10 −140 0.02 20 CM=0.75v,32Ohm, HVDD=CPVDD=1.5V −20 −30 CM=0.75v,16Ohm, HVDD=CPVDD=1.5V −40 −50 CM=0.9v,32Ohm, HVDD=CPVDD=1.8V −60 CM=0.9v,16Ohm, HVDD=CPVDD=1.8V −70 −80 0 10 20 30 40 50 Output Power (mW) 60 70 CM=0.75V, RECVDD=1.65V 20 G006 CM=0.9V, RECVDD=1.8V −20 −30 −40 −50 CM=1.25V, RECVDD=2.5V −60 CM=1.5V, RECVDD=3V −70 −80 CM=1.65V, RECVDD=3.3V −90 −100 0 20 40 60 80 100 120 Output Power (mW) 140 160 180 G008 Figure 15. Total Harmonic Distortion+Noise vs Differential Receiver Output Power 32-Ω Load 150 120 125 110 SNR 100 100 90 75 Output Power 80 50 25 70 60 10 0 −10 G007 Figure 14. Total Harmonic Distortion+Noise vs Headphone (GCHP) Output Power 9-dB Gain SNR − Signal To Noise Ratioi (dB) 1 Frequency (kHz) Figure 13. DAC to Differential Receiver Output FFT Amplitude at -3 dBFS vs Frequency 32Ω Load THDN−Total Harmonic Distortion+Noise (dB) 0 −10 0.1 G013 Figure 12. DAC to Headphone Output (GCHP) FFT Amplitude at -3 dBFS vs Frequency 32-Ω Load THDN−Total Harmonic Distortion+Noise (dB) −60 Power delivered (mW) Amplitude (dBr) Audio DAC Performance (continued) 0.8 1.0 1.2 1.4 Output Common Mode Setting (V) 1.6 0 G009 Figure 16. Differential Receiver SNR and Output Power vs Output Common Mode Setting 32-Ω Load 30 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 0 −10 −20 −30 −40 12dB 24dB −50 18dB 30 −60 −70 −80 6dB 0 200 400 600 800 Output Power (mW) 1000 1200 THDN−Total Harmonic Distortion+Noise (dB) THDN−Total Harmonic Distortion+Noise (dB) 8.19.3 Class-D Driver Performance 0 2.7V 4.2V 5.0V 5.5v −20 −30 −40 −50 −60 −70 −80 0 200 400 G010 Figure 17. Total Harmonic Distortion + Noise vs Output Power with Different Gain Settings, 8-Ω Load, SLVDD=SRVDD=SPK_V=3.6V 3.6V −10 600 800 1000 1200 1400 1600 1800 Output Power (mW) G011 Figure 18. Total Harmonic Distortion + Noise vs Output Power with Different SLVDD/SRVDD/SPK_V Supplies, 8Ω Load, 12dB Gain 8.19.4 MICBIAS Performance Micbias Voltage (V) 3 2.95 2.9 2.85 2.8 0 1 2 3 4 Micbias Load (mA) 5 6 7 G012 Figure 19. MICBIAS Mode 2, CM = 0.9V, AVDD3_33 OP STAGE vs MICBIAS Load Current 9 Parameter Measurement Information All parameters are measured according to the conditions described in Specifications. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 31 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 10 Detailed Description 10.1 Overview The TLV320AIC3212 device is a flexible, highly-integrated, low-power, low-voltage stereo audio codec with digital microphone inputs and programmable outputs, PowerTune capabilities, selectable audio-processing blocks, fixed predefined and parameterizable signal processing blocks, integrated PLL, and flexible digital audio interfaces. The device is intended for applications in mobile handsets, tablets, eBooks, portable navigation devices, portable media player, portable gaming systems, and portable computing. Available in a 4.81mm × 4.81mm 81-ball WCSP (YZF) Package, the device includes an extensive register-based control of power, input/output channel configuration, gains, effects, pin-multiplexing and clocks, allowing the codec to be precisely targeted to its application. The TLV320AIC3212 consists of the following blocks: • 5.6-mW Stereo Audio ADC with 93dB SNR • 2.7-mW Stereo 48kHz DAC Playback • 30-mW DirectPath Headphone Driver • 128-mW Differential Receiver Output Driver • Stereo Class-D Speaker Drivers • Programmable 12-Bit SAR ADC • SPI and I2C Control Interfaces • Three Independent Digital Audio Serial Interfaces • Programmable PLL Generator The TLV320AIC3212 features PowerTune to trade power dissipation versus performance. This mechanism has many modes that can be selected at the time of device configuration. 32 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 10.2 Functional Block Diagram LOL Int. Ref. VREF_SAR VBAT TEMP SENSOR VBAT IN1L/AUX1 IN1R/AUX2 TEMP $6...29dB (1$dB Steps) $78...0dB IN1L RECP $78...0dB SAR ADC RECM LOR $78...0dB 6...30dB (6$dB Steps) IN1R $78...0dB SPKLP $6dB SPKLM $12, $6, 0dB IN1L/AUX1 IN2L IN3L IN4L LOL SPR_IN $78...0dB –12, –6, 0dB –12, –6, 0dB AGC DRC ADC Signal Proc. DAC Signal Proc. $6...14dB (1$dB Steps) Vol. Ctrl. –12, –6, 0dB Left ADC –6 dB 0>47.5dB (0.5$dB Steps) tPL HPL Left + DAC – $78...0dB Gain Adj. –36...0dB (0.5$dB Steps) MAL LOL Data Interfaces –36...0dB (0.5$dB Steps) HPVSS_SENSE MAR 0>47.5dB (0.5$dB Steps) IN4R IN3R IN2R IN1R/AUX2 Gain Adj. Right ADC –6 dB LOR tPR –12, –6, 0dB –12, –6, 0dB $78...0dB ADC Signal Proc. DAC Signal Proc. AGC Right – DAC + HPR Vol. Ctrl. DRC $78...0dB $12, $6, 0dB –12, –6, 0dB $6...14dB (1$dB Steps) LOR SPR_IN $6dB Low Freq Clocking PLL Digital Mic. Interrupt Ctrl Tertiary Audio IF Secondary Audio IF Primary Audio Interface DOUT1 SPI / I2C Control Block RESET Detection Supplies BCLK1 DIN1 WCLK1 BCLK2 WCLK2 BCLK3 DOUT2 DIN3 WCLK3 DOUT3 GPIO1 GPIO2 MCLK2 Pin Muxing / Clock Routing GPI2 Ref MCLK1 VREF_AUDIO Charge Pump GPI3 GPI4 SCL SDA GPO1 GPI1 Mic Bias VNEG CPFCM CPFCP CPVSS CPVDD_18 MICBIAS MICBIAS_EXT SLVDD SRVDD SPK_V AVDD3_33 RECVDD_33 IOVDD AVDD1_18 AVDD2_18 AVDD4_18 AVDD_18 HVDD_18 DVDD SLVSS SRVSS RECVSS IOVSS AVSS AVSS1 AVSS2 AVSS3 AVSS4 DVSS MICDET SPKRM 6...30dB (6$dB Steps) DIN2 SPI_SELECT SPKRP aic3212_bl_diag Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 33 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 10.3 Feature Description 10.3.1 Device Connections 10.3.1.1 Digital Pins Only a small number of digital pins are dedicated to a single function; whenever possible, the digital pins have a default function, and also can be reprogrammed to cover alternative functions for various applications. The fixed-function pins are hardware-control pins RESET and SPI_SELECT pin. Depending on the state of SPI_SELECT, four pins SCL, SDA, GPO1, and GPI1 are configured for either I2C or SPI protocol. Only in I2C mode, GPI3 and GPI4 provide four possible I2C addresses for the TLV320AIC3212. Other digital IO pins can be configured for various functions via register control. 10.3.1.2 Analog Pins Analog functions can also be configured to a large degree. For minimum power consumption, analog blocks are powered down by default. The blocks can be powered up with fine granularity according to the application needs. The possible analog routings of analog input pins to ADCs and output amplifiers as well as the routing from DACs to output amplifiers can be seen in the Analog Routing Diagram. 10.3.1.3 Multifunction Pins Table 1 show the possible allocation of pins for specific functions. Table 1. Multifunction Pin Assignments for Pins MCLK1, MCLK2, WCLK1, BCLK1, DIN1, DOUT1, WCLK2, BCLK2, DIN2, and DOUT2 1 PIN FUNCTION 2 MCLK1 MCLK2 3 4 5 6 7 8 9 10 WCLK1 BCLK1 DIN1 DOUT1 WCLK2 BCLK2 DIN2 DOUT2 A INT1 Output E E E E B INT2 Output E E E E C SAR ADC Interrupt E E E E D CLOCKOUT Output E E E E ADC_MOD_CLOCK Output E E F Single DOUT for ASI1 F Single DOUT for ASI2 F Single DOUT for ASI3 I General Purpose Output (via Reg) F Single DIN for ASI1 F Single DIN for ASI2 F Single DIN for ASI3 J Digital Mic Data (1) (2) 34 E E E, D E, D E (1) E E E E, D (2) E, D E E E E: The pin is exclusively used for this function, no other function can be implemented with the same pin (for example, if DOUT1 has been allocated for General Purpose Output, it cannot be used as the INT1 output at the same time) D: Default Function Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Feature Description (continued) Table 1. Multifunction Pin Assignments for Pins MCLK1, MCLK2, WCLK1, BCLK1, DIN1, DOUT1, WCLK2, BCLK2, DIN2, and DOUT2 (continued) 1 2 3 4 5 6 7 8 9 10 WCLK1 BCLK1 DIN1 DOUT1 WCLK2 BCLK2 DIN2 DOUT2 S S (4) S PIN FUNCTION MCLK1 MCLK2 K Input to PLL_CLKIN S (3), D L Input to ADC_CLKIN S (3), D M Input to DAC_CLKIN S S (4) S (4) S (3) S (4) S (4) (3) ,D N Input to CDIV_CLKIN S ,D S O Input to LFR_CLKIN S (3), D S Input to HF_CLK S Q Input to REF_1MHz_CLK S (3) R General Purpose Input (via Reg) T WCLK Output for ASI1 U WCLK Input for ASI1 V BCLK Output for ASI1 W BCLK Input for ASI1 X WCLK Output for ASI2 Y WCLK Input for ASI2 Z BCLK Output for ASI2 AA BCLK Input for ASI2 BB WCLK Output for ASI3 CC WCLK Input for ASI3 DD BCLK Output for ASI3 EE BCLK Input for ASI3 (4) S S S S S S S S E E E (3) P (3) S (4) E E S, D E S (4), D E S, D E S (4), D S(3): The MCLK1 pin could be chosen to drive the PLL, ADC Clock, DAC Clock, CDIV Clock, LFR Clock, HF Clock, and REF_1MHz_CLK inputs simultaneously S(4): The BCLK1 or BCLK2 pins could be chosen to drive the PLL, ADC Clock, DAC Clock, and audio interface bit clock inputs simultaneously Table 2. Multifunction Pin Assignments for Pins WCLK3, BCLK3, DIN3, DOUT3, GPIO1, GPIO2, GPO1, GPI1, GPI2, GPI3, and GPI4 11 PIN FUNCTION 12 WCLK3 BCLK3 13 14 15 16 17 18 19 20 21 DIN3 DOUT3 GPIO1 GPIO2 GPO1/ MISO (1) GPI1/ SCLK (1) GPI2 GPI3 (2) GPI4 (2) A INT1 Output E E E B INT2 Output E E E C SAR ADC Interrupt E E E D CLOCKOUT Output E E E E ADC_MOD_CLOCK Output E E E F Single DOUT for ASI1 F Single DOUT for ASI2 F Single DOUT for ASI3 I General Purpose Output (via Reg) (1) (2) (3) E E, D E (3) E E E E E GPO1 and GPI1 can only be utilized for functions defined in this table when part utilizes I2C for control. In SPI mode, these pins serve as the MISO and SCLK, respectively. GPI3 and GPI4 can only be utilized for functions defined in this table when part utilizes SPI for control. In I2C mode, these pins serve as I2C address pins. E: The pin is exclusively used for this function, no other function can be implemented with the same pin (for example, if WCLK3 has been allocated for General Purpose Output, it cannot be used as the ASI3 WCLK output at the same time) Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 35 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table 2. Multifunction Pin Assignments for Pins WCLK3, BCLK3, DIN3, DOUT3, GPIO1, GPIO2, GPO1, GPI1, GPI2, GPI3, and GPI4 (continued) 11 PIN FUNCTION 12 WCLK3 BCLK3 13 14 15 16 17 18 19 20 21 DIN3 DOUT3 GPIO1 GPIO2 GPO1/ MISO (1) GPI1/ SCLK (1) GPI2 GPI3 (2) GPI4 (2) F Single DIN for ASI1 F Single DIN for ASI2 F Single DIN for ASI3 J Digital Mic Data E E E E K Input to PLL_CLKIN S (4) S (4) S (4) S (4) L Input to ADC_CLKIN S (4) S (4) S (4) S (4) M Input to DAC_CLKIN S (4) S (4) S (4) S (4) N Input to CDIV_CLKIN S S O Input to LFR_CLKIN S S S S P Input to HF_CLK Q Input to REF_1MHz_CLK R General Purpose Input (via Reg) E E E E T WCLK Output for ASI1 U WCLK Input for ASI1 V BCLK Output for ASI1 E W BCLK Input for ASI1 E X WCLK Output for ASI2 Y WCLK Input for ASI2 Z BCLK Output for ASI2 AA BCLK Input for ASI2 BB WCLK Output for ASI3 CC WCLK Input for ASI3 DD BCLK Output for ASI3 EE BCLK Input for ASI3 FF ADC BCLK Input for ASI1 E E E E E E GG ADC WCLK Input for ASI1 E E E E E E HH ADC BCLK Output for ASI1 E E II ADC WCLK Output for ASI1 E E JJ ADC BCLK Input for ASI2 E E E E E E KK ADC WCLK Input for ASI2 E E E E E E LL ADC BCLK Output for ASI2 E E MM ADC WCLK Output for ASI2 E E NN ADC BCLK Input for ASI3 E E E E E E OO ADC WCLK Input for ASI3 E E E E E E (4) (5) 36 E E, D S S E E E E E E E S, D (5) E S, D S(4): The GPIO1, GPIO2, GPI1, or GPI2 pins could be chosen to drive the PLL, ADC Clock, and DAC Clock inputs simultaneously D: Default Function Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Table 2. Multifunction Pin Assignments for Pins WCLK3, BCLK3, DIN3, DOUT3, GPIO1, GPIO2, GPO1, GPI1, GPI2, GPI3, and GPI4 (continued) 11 13 14 15 16 17 18 19 20 21 DIN3 DOUT3 GPIO1 GPIO2 GPO1/ MISO (1) GPI1/ SCLK (1) GPI2 GPI3 (2) GPI4 (2) ADC BCLK Output for ASI3 E E QQ ADC WCLK Output for ASI3 E E PIN FUNCTION PP 12 WCLK3 BCLK3 10.3.2 Analog Audio I/O + + + + - . 9 !# + = 9 + = = 9 = = '+ ; 9 + ) + - '+ ) + 0+ -) . !: + - . !# #23 '0 + '+ - . + / + = 9 + ) + - = = 9 + ) + -) . 9 9 = + + ! + !# #" / . + + + ) + -' . ! 9 + ) + - %# %# %# %# %# %# "! "! "! = = 9 9 9 + )'+ - > # 31 7 31 ; 31 ; & 31 ; 31 ; 31 ; 31 ; ! $ %# 31 < * ; 9 ; 9 31 < * 31 < * ; 9 ; 9 31 < * 31 < * ; 9 ; 9 31 < * '0 + + ) + 9 + )'+ - = 9 + )'+ -) . 9 9 = + ' #" + + ) / . + ))+ - + ))+ - / . . * * # " ! $ %# * #" ! + + = 9 + ))+ -) . = = 9 + ))+ -' . / #"! ; < / '+ ; #23 + + + + . + + + + - . + 0+ - . + ,+ - . + '+ - . + -) .;% + '; < " + + '+ - !# + + -) .;% + ; < "! "! "! . + ; < / #23 * + + - " " $ 5 #23 6 & , + . '0 + < + - 1 + ,+ -) . + + . '0 + & '() + ! . = ,+ - ! + ) + ) 9 + ! + = #"! 0+ - '0 + = + . + )'+ -' . = . + ' + - '0 + . = = . 1 ! = + !# + "! = 4 4 3* #23 '+ ) 0+ - ! . "! = '+ ; < + -) .;% '+ ' + ) + 9 = 9 ! 0 #" # " ! = 9 #23 )+ '0 + 0+ = " 77 3 8 & '() + ), . ! $ %# + ) + - + )+ ; < 0+ - .;% . 0+ -) . ! = + + '+ - + + ) + ) 9 ! )+ + . = = . #23 0 '0 + !# 9 " 77 3 8 < + ) + -) . + + + 9 + ) + -' . )+ ' + / = )+ ; < 0+ - .;% ,+ - . ,+ -) . !: '+ !# #23 * + + / #"! #" !# 9 + + - + ,+ + '+ + '+ + '+ '+ ; < + -) .;% . 4 3* #23 & 4 * . Figure 20. Analog Routing Diagram 10.3.2.1 Analog Low Power Bypass The TLV320AIC3212 offers two analog-bypass modes. In either of the modes, an analog input signal can be routed from an analog input terminal to an amplifier driving an analog output terminal. Neither the ADC nor the DAC resources are required for such operation; this supports low-power operation during analog-bypass mode. In analog low-power bypass mode, line-level signals can be routed directly from the analog inputs IN1L to the left lineout amplifier (LOL) and IN1R to LOR. Additionally, line-level signals can be routed directly from these analog inputs to the differential receiver amplifier, which outputs on RECP and RECM. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 37 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 10.3.2.2 Headphone Outputs The stereo headphone drivers on terminals HPL and HPR can drive loads with impedances down to 16 Ω in single-ended DC-coupled headphone configurations. An integral charge pump generates the negative supply required to operate the headphone drivers in dc-coupled mode, where the common mode of the output signal is made equal to the ground of the headphone load using a ground-sense circuit. Operation of headphone drivers in dc-coupled (ground centered mode) eliminates the need for large DC-blocking capacitors. HPL HPR HPVSS_SENSE Figure 21. TLV320AIC3212 Ground-Centered Headphone Output Alternatively the headphone amplifier can also be operated in a unipolar circuit configuration using DC blocking capacitors. 10.3.2.2.1 Using the Headphone Amplifier The headphone drivers are capable of driving a mixed combination of DAC signal, left and right ADC PGA signal, and LOL and LOR output signals by configuring B0_P1_R27-R29. The ADC PGA signals can be attenuated up to 36 dB before routing to headphone drivers by configuring B0_P1_R18 and B0_P1_R19. The line-output signals can be attenuated up to 78 dB before routing to headphone drivers by configuring B0_P1_R28 and B0_P1_R29. The level of the DAC signal can be controlled using the digital volume control of the DAC by configuring B0_P0_R64-R66. To control the output-voltage swing of headphone drivers, the headphone driver volume control provides a range of –6.0 dB to +14.0 dB (1) in steps of 1 dB. These can be configured by programming B0_P1_R27, B0_P1_R31, and B0_P1_R32. In addition, finer volume controls are also available when routing LOL or LOR to the headphone drivers by controlling B0_P1_R27-R28. These level controls are not meant to be used as dynamic volume control, but more to set output levels during initial device configuration. Register B0_P1_R9_D[6:5] allows the headphone output stage to be scaled to tradeoff power delivered vs quiescent power consumption. (1) 10.3.2.2.2 Ground-Centered Headphone Amplifier Configuration Among the other advantages of the ground-centered connection is inherent freedom from turnon transients that can cause audible pops, sometimes at uncomfortable volumes. (1) 38 If the device must be placed into 'mute' from the –6.0 dB setting, set the device at a gain of –5.0 dB first, then place the device into mute. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 10.3.2.2.2.1 Circuit Topology The power supply hook up scheme for the ground centered configuration is shown in HVDD_18 terminal supplies the positive side of the headphone amplifier. CPVDD_18 terminal supplies the charge pump which in turn supplies the negative side of the headphone amplifier. Two capacitors are required for the charge pump circuit to work. These capacitors should be X7R rated. !! !! !! # $# " " %% &' %% &' Figure 22. Ground-Centered Headphone Connections 10.3.2.2.2.2 Charge Pump Setup and Operation The built in charge pump draws charge from the CPVDD_18 supply, and by switching the external capacitor between CPFCP and CPFCM, generates the negative voltage on VNEG terminal. The charge-pump circuit uses the principles of switched-capacitor charge conservation to generate the VNEG supply in a very efficient fashion. To turn on the charge pump circuit when headphone drivers are powered, program B0_P1_R35_D[1:0] to 00. When the charge pump circuit is disabled, VNEG acts as a ground terminal, allowing unipolar configuration of the headphone amps. By default, the charge pump is disabled. The switching rate of the charge pump can be controlled by B0_P1_R33. Because the charge pump can demand significant inrush currents from the supply, it is important to have a capacitor connected in close proximity to the CPVDD_18 and CPVSS terminals of the device. At 500-kHz clock rate this requires approximately a 10-μF capacitor. The ESR and ESL of the capacitor must be low to allow fast switching currents. The ground-centered mode of operation is enabled by configuring B0_P1_R31_D7 to 1. Note that the HPL and HPR gain settings are ganged in Ground-Cetered Mode of operation (B0_P1_R32_D7 = 1). The HPL and HPR gain settings cannot be ganged if using the Stereo Unipolar Configuration. 10.3.2.2.2.3 Output Power Optimization The device can be optimized for a specific output-power range. The charge pump and the headphone driver circuitry can be reduced in power so less overall power is consumed. The headphone driver power can be programmed in B0_P1_R9. The control of charge pump switching current is programmed in B0_P1_R34_D[4:2]. 10.3.2.2.2.4 Offset Correction and Start-Up The TLV320AIC3212 offers an offset-correction scheme that is based on calibration during power up. This scheme minimizes the differences in DC voltage between HPVSS_SENSE and HPL/HPR outputs. The offset calibration happens after the headphones are powered up in ground-centered configuration. All other headphone configurations like signal routings, gain settings, and mute removal must be configured before headphone power-up. Any change in these settings while the headphones are powered up may result in additional offsets and are best avoided. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 39 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com The offset-calibration block has a few programmable parameters that the user must control. The user can either choose to calibrate the offset only for the selected input routing or all input configurations. The calibration data is stored in internal memory until the next hardware reset or until AVDDx power is removed. Programming B0_P1_R34_D[1:0] as 10 causes the offset to be calibrated for the selected input mode. Programming B0_P1_R34_D[1:0] as “11” causes the offset to be calibrated for all possible configurations. All related blocks must be powered while doing offset correction. Programming B0_P1_R34_D[1:0] as 00 (default) disables the offset correction block. While the offset is being calibrated, no signal should be applied to the headphone amplifier, that is the DAC should be kept muted and analog bypass routing should be kept at the highest attenuation. 10.3.2.2.2.5 Ground-Centered Headphone Setup There are four practical device setups for ground-centered operation , shown in Table 3: Table 3. Ground-Centered Headphone Setup Performance Options AUDIO OUTPUT POWER High HIGH PERFORMANCE 16Ω LOW POWER CONSUMPTION 32Ω 600Ω 32Ω 600Ω SNR 94 dB 97 dB 98 dB 91 dB 94 dB 95 dB Output Power 25 mW 22 mW 1.4mW 24 mW 23 mW 1.5mW Idle Power Consumption 23 mW 21 mW 19mW 20 mW 15 mW 12 mW SNR 92.5 dB 93 dB 93.5 dB 80.5 dB 85.5 dB 85.5 dB Output Power 16 mW 8.5 mW 0.5 mW 0.9 mW 1.5mW 0.1 mW Idle Power Consumption 14 mW 12 mW 9.7 mW 8.0 mW 6.6mW 5.1 mW High-Output, High-Performance Setup Medium 16Ω Medium-Output, High-Performance Setup High-Output, Low-Power Setup Medium-Output, Low-Power Setup 10.3.2.2.2.5.1 High Audio Output Power, High Performance Setup This setup describes the register programming necessary to configure the device for a combination of high audio output power and high performance. To achieve this combination the parameters must be programmed to the values in Table 4. For the full setup script, see . Table 4. Setup A - High Audio Output Power, High Performance PARAMETER VALUE CM 0.9 PTM PTM_P3 Processing Block 1 to 6,22,23,24 PROGRAMMING B0_P1_R8_D2 = "0" B0_P1_R3_D[4:2] = "000", B0_P1_R4_D[4:2] = "000" B0_P0_R60_D[4:0] DAC OSR 128 B0_P0_R13 = 0x00, B0_P0_R14 = 0x80 HP sizing 100 B0_P1_R9_D[6:5] = "00" Gain 5dB B0_P1_R31 = 0x85, B0_P1_R32 = 0x85 DVDD 1.8 Apply 1.26 to 1.95V AVDDx_18, HVDD_18, CPVDD_18 1.8 Apply 1.8 to 1.95V 10.3.2.2.2.5.2 High Audio Output Power, Low Power Consumption Setup This setup describes the register programming necessary to configure the device for a combination of high audio output power and low power consumption. To achieve this combination the parameters must be programmed to the values in Table 5. For the full setup script, see . 40 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Table 5. Setup B - High Audio Output Power, Low Power Consumption PARAMETER VALUE CM 0.75 PTM PTM_P2 Processing Block 7 to 16 PROGRAMMING B0_P1_R8_D2 = "1" B0_P1_R3_D[4:2] = "001", B0_P1_R4_D[4:2] = "001" B0_P0_R60_D[4:0] DAC OSR 64 B0_P0_R13 = 0x00, B0_P0_R14 = 0x40 HP sizing 100 B0_P1_R9_D[6:5] = "00" Gain 12dB B0_P1_R31 = 0x8c, B0_P1_R32 = 0x8c DVDD 1.26 Apply 1.26 to 1.95V AVDDx_18, HVDD_18, CPVDD_18 1.8 Apply 1.5 to 1.95V 10.3.2.2.2.5.3 Medium Audio Output Power, High Performance Setup This setup describes the register programming necessary to configure the device for a combination of medium audio output power and high performance. To achieve this combination the parameters must be programmed to the values in Table 6. For the full setup script, see . Table 6. Setup C - Medium Audio Output Power, High Performance PARAMETER VALUE CM 0.75 PTM PTM_P2 Processing Block 7 to 16 PROGRAMMING B0_P1_R8_D2 = "1" B0_P1_R3_D[4:2] = "001", B0_P1_R4_D[4:2] = "001" B0_P0_R60_D[4:0] DAC OSR 64 B0_P0_R13 = 0x00, B0_P0_R14 = 0x40 HP sizing 100 B0_P1_R9_D[6:5] = "00" Gain 7dB B0_P1_R31 = 0x87, B0_P1_R32 = 0x87 DVDD 1.26 Apply 1.26 to 1.95V AVDDx_18, HVDD_18, CPVDD_18 1.5 Apply 1.8 to 1.95V 10.3.2.2.2.5.4 Lowest Power Consumption, Medium Audio Output Power Setup This setup describes the register programming necessary to configure the device for a combination of medium audio output power and lowest power consumption. To achieve this combination the parameters must be programmed to the values in Table 7. For the full setup script, see . Table 7. Setup D - Lowest Power Consumption, Medium Audio Output Power PARAMETER VALUE CM 0.75 PTM PTM_P1 PROGRAMMING B0_P1_R8_D2 = "1" B0_P1_R3_D[4:2] = "010", B0_P1_R4_D[4:2] = "010" Processing Block 26 B0_P0_R60_D[4:0] = "1 1010" DAC OSR 64 B0_P0_R13 = 0x00, B0_P0_R14 = 0x40 HP sizing 25 B0_P1_R9_D[6:5] = "11" Gain 10dB B0_P1_R31 = 0x8a , B0_P1_R32 = 0x8a DVdd 1.26 Apply 1.26 to 1.95V AVDDx_18, HVDD_18, CPVDD_18 1.5 Apply 1.5 to 1.95V Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 41 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 10.3.2.2.3 Stereo Unipolar Configuration 10.3.2.2.3.1 Circuit Topology The power supply hook up scheme for the unipolar configuration is shown in Figure 23. HVDD_18 terminal supplies the positive side of the headphone amplifier. The negative side is connected to ground potential (VNEG). It is recommended to connect the CPVDD_18 terminal to DVdd, although the charge pump must not be enabled while the device is connected in unipolar configuration. DVdd 1.5...3.6V DVDD DVDD_18 HVDD_18 -6...+14dB HPL 1dB steps -6...+14dB HPR 1dB steps HPVSS_Sense VNEG Charge Pump (disabled) CPFCP CPFCM CPVSS Figure 23. Unipolar Stereo Headphone Circuit The left and right DAC channels are routed to the corresponding left and right headphone amplifier. This configuration is also used to drive line-level loads. To enable cap-coupled mode, B0_P1_R31_D7 should be set to 0. Note that the recommended range for the HVDD_18 supply in cap-coupled mode (1.65 V - 3.6 V) is different than the recommended range for the default ground-centered configuration (1.5 V - 1.95 V). In capcoupled mode only, the Headphone output common mode can be controlled by changing B0_P1_R8_D[4:3]. 10.3.2.2.3.2 Unipolar Turn-On Transient (Pop) Reduction The TLV320AIC3212 headphone drivers also support pop-free operation in unipolar, ac-coupled configuration. Because the HPL and HPR are high-power drivers, pop can result due to sudden transient changes in the output drivers if care is not taken. The most critical care is required while using the drivers as stereo single-ended capacitively-coupled drivers as shown in Figure 23. The output drivers achieve pop-free power-up by using slow power-up modes. Conceptually, the circuit during power-up can be visualized as Cc Output Driver Rpop PAD Rload Figure 24. Conceptual Circuit for Pop-Free Power-up The value of Rpop can be chosen by setting register B0_P1_R11_D[1:0]. 42 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Table 8. Rpop Values (External Cc = 47uF) B0_P1_R11_D[1:0] Rpop VALUE 10 2 kΩ 01 6 kΩ 00 25 kΩ To minimize audible artifacts, two parameters can be adjusted to match application requirements. The voltage Vload across Rload at the beginning of slow charging should not be more than a few mV. At that time the voltage across Rload can be determined as: V load = R load R load + R pop ´ V cm (1) For a typical Rload of 32 Ω, Rpop of 6 kΩ or 25 kΩ will deliver good results (see Table 8 for register settings). According to the conceptual circuit in Figure 24, the voltage on PAD will exponentially settle to the output common-mode voltage based on the value of Rpop and Cc. Thus, the output drivers must be in slow power-up mode for time T, such that at the end of the slow power-on period, the voltage on Vpad is very close to the common-mode voltage. The TLV320AIC3212 allows the time T to be adjusted to allow for a wide range of Rload and Cc by programming B0_P1_R11_D[5:2]. For the time adjustments, the value of Cc is assumed to be 47μF. N=5 is expected to yield good results. Table 9. N Values (External Cc = 47 µF) B0_P1_R11_D[5:2] Slow Charging Time = N * RC_Time_Constant (for Rpop and Cc = 47μF) 0000 N=0 0001 N=0.5 0010 N=0.625 0011 N=0.75 0100 N=0.875 0101 N=1.0 0110 N=2.0 0111 N=3.0 1000 N=4.0 1001 N=5.0 (Typical Value) 1010 N=6.0 1011 N=7.0 1100 N=8.0 1101 N=16 (Not valid for Rpop=25kΩ) 1110 N=24 (Not valid for Rpop=25kΩ) 1111 N=32 (Not valid for Rpop=25kΩ) Again, for example, for Rload=32 Ω, Cc=47 μF and common mode of 0.9 V, the number of time constants required for pop-free operation is 5 or 6. A higher or lower Cc value will require higher or lower value for N. During the slow-charging period, no signal is routed to the output driver. Therefore, choosing a larger than necessary value of N results in a delay from power-up to signal at output. At the same time, choosing N to be smaller than the optimal value results in poor pop performance at power-up. The signals being routed to headphone drivers (for example, DAC and IN) often have DC offsets due to lessthan-ideal processing. As a result, when these signals are routed to output drivers, the offset voltage causes a pop. To improve the pop-performance in such situations, a feature is provided to soft-step the DC-offset. At the beginning of the signal routing, a high-value attenuation can be applied which can be progressively reduced in steps until the desired gain in the channel is reached. The time interval between each of these gain changes can be controlled by programming B0_P1_R11_D[7:6]. This gain soft-stepping is applied only during the initial routing of the signal to the output driver and not during subsequent gain changes. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 43 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table 10. Soft-Stepping Step Time B0_P1_R11_D[7:6] SOFT-STEPPING STEP TIME DURING INITIAL SIGNAL ROUTING 00 0 ms (soft-stepping disabled) 01 50ms 10 100ms 11 200ms It is recommended to use the following sequence for achieving optimal pop performance at power-up: 1. Choose the value of Rpop, N (time constants) and soft-stepping step time for slow power-up. 2. Choose the configuration for output drivers, including common modes and output stage power connections 3. Select the signals to be routed to headphones. 4. Power-up the blocks driving signals into HPL and HPR, but keep it muted 5. Unmute HPL and HPR and set the desired gain setting. 6. Power-on the HPL and HPR drivers. 7. Unmute the block driving signals to HPL and HPR after the Driver PGA flags are set to indicate completion of soft-stepping after power-up. These flags can be read from B0_P1_R63_D[7:6]. It is important to configure the Headphone Output driver depop control registers before powering up the headphone; these register contents should not be changed when the headphone drivers are powered up. Before powering down the HPL and HPR drivers, it is recommended that user read back the flags in B0_P1_R63. For example. before powering down the HPL driver, ensure that bit B0_P1_R63_D7 = 1 and bit B0_P1_R64_D7 = 1 if LOL is routed to HPL and bit B0_P1_R65_D5 = 1 if the Left Mixer is routed to HPL. The output driver should be powered down only after a steady-state power-up condition has been achieved. This steady state power-up condition also must be satisfied for changing the HPL/R driver mute control (setting both B0_P1_R31_D[5:0] and B0_P1_R32_D[5:0] to "11 1001"), that is, muting and unmuting should be done after the gain and volume controls associated with routing to HPL/R finished soft-stepping. In the differential configuration of HPL and HPR, when no coupling capacitor is used, the slow charging method for pop-free performance need not be used. In the differential load configuration for HPL and HPR, it is recommended to not use the output driver MUTE feature, because a pop may result. During the power-down state, the headphone outputs are weakly pulled to ground using an approximately 50kΩ resistor to ground, to maintain the output voltage on HPL and HPR terminals. 10.3.2.2.4 Mono Differential DAC to Mono Differential Headphone Output LEFT_DACP LEFT DAC HPL LEFT_DACM HPR Figure 25. Low Power Mono DAC to Differential Headphone This configuration, available in unipolar configuration of the HP amplifier supplies, supports the routing of the two differential outputs of the mono, left channel DAC to the headphone amplifiers in differential mode (B0_P1_R27_D5 = 1 and B0_P1_R27_D2 = 1). 44 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 10.3.2.3 Stereo Line Outputs The stereo line level drivers on LOL and LOR terminals can drive a wide range of line level resistive impedances in the range of 600Ω to 10 kΩ. The output common mode of line level drivers can be configured to equal the analog input common-mode setting, either 0.75V or 0.9V. The line-level drivers can drive out a mixed combination of DAC signal and attenuated ADC PGA signal, and signal mixing is register-programmable. 10.3.2.3.1 Line Out Amplifier Configurations Signal mixing can be configured by programming B0_P1_R22 and B0_P1_R23. To route the output of Left DAC and Right DAC for stereo single-ended output, as shown in Figure 26, LDACM can be routed to LOL driver by setting B0_P1_R22_D7 = 1, and RDACM can be routed to LOR driver by setting B0_P1_R22_D6 = 1. Alternatively, stereo single-ended signals can also be routed through the mixer amplifiers by configuring B0_P1_R23_D[7:6]. For lowest-power operation, stereo single-ended signals can also be routed in direct terminal bypass with possible gains of 0dB, -6dB, or -12dB by configuring B0_P1_R23_D[4:3] and B0_P1_R23_D[1:0]. While each of these two bypass cases could be used in a stereo single-ended configuration, a mono differential input signal could also be used. The output of the stereo line out drivers can also be routed to the stereo headphone drivers, with 0 dB to –72 dB gain controls in steps of 0.5 dB on each headphone channel. This enables the DAC output or bypass signals to be simultaneously played back to the stereo headphone drivers as well as stereo line-level drivers. This routing and volume control is achieved in B0_P1_R28 and B0_P1_R29. Figure 26. Stereo Single-Ended Line-out Additionally, the two line-level drivers can be configured to act as a mono differential line level driver by routing the output of LOL to LOR (B0_P1_R22_D2 = 1). This differential signal takes either LDACM, MAL, or IN1L-B as a single-ended mono signal and creates a differential mono output signal on LOL and LOR. Figure 27. Single Channel Input to Differential Line-out Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 45 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com For digital outputs from the DAC, the two line-level drivers can be fed the differential output signal from the Right DAC by configuring B0_P1_R22_D5 = 1. Figure 28. Mono DAC Output to Differential Line-out 10.3.2.4 Differential Receiver Output The differential receiver amplifier output spans the RECP and RECM terminals and can drive a 32-Ω receiver driver. With output common-mode setting of 1.65 V and RECVDD_33 supply at 3.3 V, the receiver driver can drive up to a 1-Vrms output signal. With the RECVDD_33 supply at 3.3 V, the receiver driver can deliver greater than 128 mW into a 32-Ω BTL load. If desired, the RECVDD_33 supply can be set to 1.8 V, at which the driver can deliver about 40mW into the 32Ω BTL load. 10.3.2.5 Stereo Class-D Speaker Outputs The integrated Class-D stereo speaker drivers (SPKLP/SPKLN and SPKRP/SPKRN) are capable of driving two 8Ω differential loads. The speaker drivers can be powered directly from the power supply (2.7V to 5.5V) on the SLVDD and SRVDD terminals, however the voltage (including spike voltage) must be limited below the Absolute Maximum Voltage of 6.0 V. The speaker drivers are capable of supplying 750 mW per channel at 10% THD+N with a 3.6-V power supply and 1.46 W per channel at 10% THD+N with a 5.0-V power supply. Separate left and right channels can be sent to each Class-D driver through the Lineout signal path, or from the mixer amplifiers in the ADC bypass. If only one speaker is being utilized for playback, the analog mixer before the Left Speaker amplifier can sum the left and right audio signals for monophonic playback. 10.3.3 ADC / Digital Microphone Interface The TLV320AIC3212 includes a stereo audio ADC, which uses a delta-sigma modulator with a programmable oversampling ratio, followed by a digital decimation filter. The ADC supports sampling rates from 8kHz to 192kHz. In order to provide optimal system power management, the stereo recording path can be powered up one channel at a time, to support the case where only mono record capability is required. The ADC path of the TLV320AIC3212 features a large set of options for signal conditioning as well as signal routing: • 2 ADCs • 8 analog inputs which can be mixed and/or multiplexed in single-ended and/or differential configuration • 2 programmable gain amplifiers (PGA) with a range of 0 to +47.5dB • 2 mixer amplifiers for analog bypass • 2 low power analog bypass channels • Fine gain adjust of digital channels with 0.1 dB step size • Digital volume control with a range of -12 to +20dB • Mute function • Automatic gain control (AGC) In addition to the standard set of ADC features the TLV320AIC3212 also offers the following special functions: • Built in microphone biases • Stereo digital microphone interface – Allows 2 total microphones 46 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com • • • • SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 – Up to 2 digital microphones – Up to 2 analog microphones Channel-to-channel phase adjustment Fast charge of ac-coupling capacitors Anti thump Adaptive coefficient update mode 10.3.3.1 ADC Processing Blocks — Overview The TLV320AIC3212 ADC channel includes a built-in digital decimation filter to process the oversampled data from the to generate digital data at Nyquist sampling rate with high dynamic range. The decimation filter can be chosen from three different types, depending on the required frequency response, group delay and sampling rate. 10.3.3.1.1 ADC Processing Blocks The TLV320AIC3212 offers a range of processing blocks which implement various signal processing capabilities along with decimation filtering. These processing blocks give users the choice of how much and what type of signal processing they may use and which decimation filter is applied. The choice between these processing blocks is part of the PowerTune strategy to balance power conservation and signal-processing flexibility. Decreasing the use of signal-processing capabilities reduces the power consumed by the device. Table 11 gives an overview of the available processing blocks of the ADC channel and their properties. The Resource Class Column (RC) gives an approximate indication of power consumption. The signal processing blocks available are: • First-order IIR • Scalable number of biquad filters • Variable-tap FIR filter • AGC The processing blocks are tuned for common cases and can achieve high anti-alias filtering or low-group delay in combination with various signal processing effects such as audio effects and frequency shaping. The available first order IIR, BiQuad and FIR filters have fully user programmable coefficients. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 47 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table 11. ADC Processing Blocks PROCESSING BLOCKS CHANNEL DECIMATION FILTER 1ST ORDER IIR AVAILABLE NUMBER BIQUADS FIR REQUIRED AOSR VALUE RESOURCE CLASS PRB_R1 (1) Stereo A Yes 0 No 128,64,32,16,8,4 7 PRB_R2 Stereo A Yes 5 No 128,64,32,16,8,4 8 PRB_R3 Stereo A Yes 0 25-Tap 128,64,32,16,8,4 8 PRB_R4 Left A Yes 0 No 128,64,32,16,8,4 4 PRB_R5 Left A Yes 5 No 128,64,32,16,8,4 4 PRB_R6 Left A Yes 0 25-Tap 128,64,32,16,8,4 4 PRB_R7 Stereo B Yes 0 No 64,32,16,8,4,2 3 PRB_R8 Stereo B Yes 3 No 64,32,16,8,4,2 4 PRB_R9 Stereo B Yes 0 17-Tap 64,32,16,8,4,2 4 PRB_R10 Left B Yes 0 No 64,32,16,8,4,2 2 PRB_R11 Left B Yes 3 No 64,32,16,8,4,2 2 PRB_R12 Left B Yes 0 17-Tap 64,32,16,8,4,2 2 PRB_R13 Stereo C Yes 0 No 32,16,8,4,2,1 3 PRB_R14 Stereo C Yes 5 No 32,16,8,4,2,1 4 PRB_R15 Stereo C Yes 0 25-Tap 32,16,8,4,2,1 4 PRB_R16 Left C Yes 0 No 32,16,8,4,2,1 2 PRB_R17 Left C Yes 5 No 32,16,8,4,2,1 2 PRB_R18 Left C Yes 0 25-Tap 32,16,8,4,2,1 2 (1) Default For more detailed information see the Application Reference Guide, SLAU360. 10.3.4 DAC The TLV320AIC3212 includes a stereo audio DAC supporting data rates from 8kHz to 192kHz. Each channel of the stereo audio DAC consists of a signal-processing engine with fixed processing blocks, a digital interpolation filter, multi-bit digital delta-sigma modulator, and an analog reconstruction filter. The DAC is designed to provide enhanced performance at low sampling rates through increased oversampling and image filtering, thereby keeping quantization noise generated within the delta-sigma modulator and signal images strongly suppressed within the audio band to beyond 20kHz. To handle multiple input rates and optimize power dissipation and performance, the TLV320AIC3212 allows the system designer to program the oversampling rates over a wide range from 1 to 1024. The system designer can choose higher oversampling ratios for lower input data rates and lower oversampling ratios for higher input data rates. The TLV320AIC3212 DAC channel includes a built-in digital interpolation filter to generate oversampled data for the sigma-delta modulator. The interpolation filter can be chosen from three different types depending on required frequency response, group delay and sampling rate. The DAC path of the TLV320AIC3212 features many options for signal conditioning and signal routing: • 2 headphone amplifiers – Usable in single-ended stereo or differential mono mode – Analog volume setting with a range of -6 to +14 dB • 2 line-out amplifiers – Usable in single-ended stereo or differential mono mode • 2 Class-D speaker amplifiers – Usable in stereo differential mode – Analog volume control with a settings of +6, +12, +18, +24, and +30 dB • 1 Receiver amplifier – Usable in mono differential mode – Analog volume setting with a range of -6 to +29 dB • Digital volume control with a range of -63.5 to +24dB • Mute function • Dynamic range compression (DRC) 48 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 In addition to the standard set of DAC features the TLV320AIC3212 also offers the following special features: • Built in sine wave generation (beep generator) • Digital auto mute • Adaptive coefficient update mode 10.3.4.1 DAC Processing Blocks — Overview 10.3.4.1.1 DAC Processing Blocks The TLV320AIC3212 implements signal processing capabilities and interpolation filtering via processing blocks. These fixed processing blocks give users the choice of how much and what type of signal processing they may use and which interpolation filter is applied. The choice between these processing blocks is part of the PowerTune strategy balancing power conservation and signal processing flexibility. Less signal processing capability will result in less power consumed by the device. Table 12 gives an overview over all available processing blocks of the DAC channel and their properties. The Resource Class Column (RC) gives an approximate indication of power consumption. The signal processing blocks available are: • First-order IIR • Scalable number of biquad filters • 3D – Effect • Beep Generator The processing blocks are tuned for common cases and can achieve high image rejection or low group delay in combination with various signal processing effects such as audio effects and frequency shaping. The available first-order IIR and biquad filters have fully user-programmable coefficients. Table 12. Overview – DAC Predefined Processing Blocks (1) PROCESSING BLOCK NO. INTERPOLATION FILTER CHANNEL 1ST ORDER IIR AVAILABLE NUM. OF BIQUADS DRC 3D BEEP GENERATOR PRB_P1 (1) A PRB_P2 A Stereo No Stereo Yes PRB_P3 PRB_P4 A Stereo A Left PRB_P5 A PRB_P6 RC CLASS 3 No No No 8 6 Yes No No 12 Yes 6 No No No 10 No 3 No No No 4 Left Yes 6 Yes No No 6 A Left Yes 6 No No No 5 PRB_P7 B Stereo Yes 0 No No No 5 PRB_P8 B Stereo No 4 Yes No No 9 PRB_P9 B Stereo No 4 No No No 7 PRB_P10 B Stereo Yes 6 Yes No No 9 PRB_P11 B Stereo Yes 6 No No No 7 PRB_P12 B Left Yes 0 No No No 3 PRB_P13 B Left No 4 Yes No No 4 PRB_P14 B Left No 4 No No No 4 PRB_P15 B Left Yes 6 Yes No No 5 PRB_P16 B Left Yes 6 No No No 4 PRB_P17 C Stereo Yes 0 No No No 3 PRB_P18 C Stereo Yes 4 Yes No No 6 PRB_P19 C Stereo Yes 4 No No No 4 PRB_P20 C Left Yes 0 No No No 2 PRB_P21 C Left Yes 4 Yes No No 3 PRB_P22 C Left Yes 4 No No No 2 PRB_P23 A Stereo No 2 No Yes No 8 PRB_P24 A Stereo Yes 5 Yes Yes No 12 PRB_P25 A Stereo Yes 5 Yes Yes Yes 13 Default Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 49 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table 12. Overview – DAC Predefined Processing Blocks (continued) PROCESSING BLOCK NO. INTERPOLATION FILTER CHANNEL 1ST ORDER IIR AVAILABLE NUM. OF BIQUADS DRC 3D BEEP GENERATOR RC CLASS PRB_P26 D Stereo No 0 No No No 1 For more detailed information see the Application Reference Guide, SLAU360. 10.3.5 Device Power Consumption Device power consumption largely depends on PowerTune configuration. For information on device power consumption, see the TLV320AIC3212 Application Reference Guide, SLAU360. 10.3.6 Powertune The TLV320AIC3212 features PowerTune, a mechanism to balance power-versus-performance trade-offs at the time of device configuration. The device can be tuned to minimize power dissipation, to maximize performance, or to an operating point between the two extremes to best fit the application. For more detailed information see the Application Reference Guide, SLAU360. 10.3.7 Clock Generation and PLL To minimize power consumption, the system ideally provides a master clock that is a suitable integer multiple of the desired sampling frequencies. In such cases, internal dividers can be programmed to set up the required internal clock signals at very low power consumption. For cases where such master clocks are not available, the built-in PLL can be used to generate a clock signal that serves as an internal master clock. In fact, this master clock can also be routed to an output terminal and may be used elsewhere in the system. The clock system is flexible enough that it even allows the internal clocks to be derived directly from an external clock source, while the PLL is used to generate some other clock that is only used outside the TLV320AIC3212. The ADC_CLKIN and DAC_CLKIN can then be routed through highly-flexible clock dividers to generate the various clocks required for ADC, DAC and the selectable processing block sections. For more detailed information see the Application Reference Guide, SLAU360. 50 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 10.3.8 Interfaces 10.3.8.1 Control Interfaces To minimize power consumption, the system ideally provides a master clock that is a suitable integer multiple of the desired sampling frequencies. In such cases, internal dividers can be programmed to set up the required internal clock signals at very low power consumption. For cases where such master clocks are not available, the built-in PLL can be used to generate a clock signal that serves as an internal master clock. In fact, this master clock can also be routed to an output terminal and may be used elsewhere in the system. The clock system is flexible enough that it even allows the internal clocks to be derived directly from an external clock source, while the PLL is used to generate some other clock that is only used outside the TLV320AIC3212. The ADC_CLKIN and DAC_CLKIN can then be routed through highly-flexible clock dividers to generate the various clocks required for ADC, DAC and the selectable processing block sections. 10.3.8.1.1 I2C Control The TLV320AIC3212 supports the I2C control protocol, and will respond by default (GPI3 and GPI4 grounded) to the 7-bit I2C address of 0011000. With the two I2C address terminals, GPI3 and GPI4, the device can be configured to respond to one of four 7-bit I2C addresses, 0011000, 0011001, 0011010, or 0011011. The full 8-bit I2C address can be calculated as: 8-Bit I2C Address = "00110" + GPI4 + GPI3 + R/W Example: to write to the TLV320AIC3212 with GPI4 = 1 and GPI3 = 0 the 8-Bit I2C Address is "00110" + GPI4 + GPI3 + R/W = "00110100" = 0x34 I2C is a two-wire, open-drain interface supporting multiple devices and masters on a single bus. Devices on the I2C bus only drive the bus lines LOW by connecting them to ground; they never drive the bus lines HIGH. Instead, the bus wires are pulled HIGH by pullup resistors, so the bus wires are HIGH when no device is driving them LOW. This way, two devices cannot conflict; if two devices drive the bus simultaneously, there is no driver contention. 10.3.8.1.2 SPI Control In the SPI control mode, the TLV320AIC3212 uses the terminals SCL as SS, GPI1 as SCLK, GPO1 as MISO, SDA as MOSI; a standard SPI port with clock polarity setting of 0 (typical microprocessor SPI control bit CPOL = 0) and clock phase setting of 1 (typical microprocessor SPI control bit CPHA = 1). The SPI port allows fullduplex, synchronous, serial communication between a host processor (the master) and peripheral devices (slaves). The SPI master (in this case, the host processor) generates the synchronizing clock (driven onto SCLK) and initiates transmissions. The SPI slave devices (such as the TLV320AIC3212) depend on a master to start and synchronize transmissions. A transmission begins when initiated by an SPI master. The byte from the SPI master begins shifting in on the slave MOSI terminal under the control of the master serial clock (driven onto SCLK). As the byte shifts in on the MOSI terminal, a byte shifts out on the MISO terminal to the master shift register. The TLV320AIC3212 interface is designed so that with a clock-phase bit setting of 1 (typical microprocessor SPI control bit CPHA = 1), the master begins driving its MOSI terminal and the slave begins driving its MISO terminal on the first serial clock edge. The SSZ terminal can remain low between transmissions; however, the TLV320AIC3212 only interprets the first 8 bits transmitted after the falling edge of SSZ as a command byte, and the next 8 bits as a data byte only if writing to a register. Reserved register bits should be written to their default values. The TLV320AIC3212 is entirely controlled by registers. Reading and writing these registers is accomplished by an 8-bit command sent to the MOSI terminal of the part prior to the data for that register. The command is structured as shown in Figure 29. The first 7 bits specify the address of the register which is being written or read, from 0 to 127 (decimal). The command word ends with an R/W bit, which specifies the direction of data flow on the serial bus. In the case of a register write, the R/W bit should be set to 0. A second byte of data is sent to the MOSI terminal and contains the data to be written to the register. Reading of registers is accomplished in a similar fashion. The 8-bit command word sends the 7-bit register address, followed by the R/W bit = 1 to signify a register read is occurring. The 8-bit register data is then clocked out of the part on the MISO terminal during the second 8 SCLK clocks in the frame. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 51 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Figure 29. Command Word Bit 7 ADDR(6) Bit 6 ADDR(5) Bit 5 ADDR(4) Bit 4 ADDR(3) Bit 3 ADDR(2) Bit 2 ADDR(1) Bit 1 ADDR(0) Bit 0 R/WZ SS SCLK MOSI Hi-Z RA(6) RA(5) RA(0) 7-bit Register Address MISO D(7) D(6) Write D(0) Hi-Z 8-bit Register Data Hi-Z Hi-Z Figure 30. SPI Timing Diagram for Register Write SS SCLK MOSI Hi-Z RA(6) RA(5) RA(0) 7-bit Register Address MISO Hi-Z Hi-Z Don’t Care Read 8-bit Register Data D(7) D(6) D(0) Hi-Z Figure 31. SPI Timing Diagram for Register Read For more detailed information see the Application Reference Guide, SLAU360. 10.3.8.2 Digital Audio Interfaces The TLV320AIC3212 features three digital audio data serial interfaces, or audio buses. Any of these digital audio interfaces can be selected for playback and recording through the stereo DACs and stereo ADCs respectively. This enables this audio codec to handle digital audio from different devices on a mobile platform. A common example of this would be individual connections to an application processor, a communication baseband processor, or a Bluetooth chipset. By utilizing the TLV320AIC3212 as the center of the audio processing in a portable audio system, hardware design of the audio system is greatly simplified. In addition to these three individual digital audio interfaces, a fourth set of digital audio pins can be muxed into Audio Serial Interface 1. In other words, four separate 4-wire digital audio buses can be connected to the TLV320AIC3212. However, it should be noted that only one of the three audio serial interfaces can be routed to/from the DACs/ADCs at a time. 52 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Figure 32. Typical Multiple Connections to Three Audio Serial Interfaces Each audio bus on the TLV320AIC3212 is very flexible, including left or right-justified data options, support for I2S or PCM protocols, programmable data length options, a TDM mode for multichannel operation, very flexible master or slave configurability for each bus clock line, and the ability to communicate with multiple devices within a system directly. Each of the three audio buses of the TLV320AIC3212 can be configured for left or right-justified, I2S, DSP, or TDM modes of operation, where communication with PCM interfaces is supported within the TDM mode. These modes are all MSB-first, with data width programmable as 16, 20, 24, or 32 bits. In addition, the word clock and bit clock can be independently configured in either Master or Slave mode, for flexible connectivity to a wide variety of processors. The word clock is used to define the beginning of a frame, and may be programmed as either a pulse or a square-wave signal. The frequency of this clock corresponds to the maximum of the selected ADC and DAC sampling frequencies. When configuring an audio interface for six-wire mode, the ADC and DAC paths can operate based on separate word clocks. The bit clock is used to clock in and clock out the digital audio data across the serial bus. When in Master mode, this signal can be programmed to generate variable clock pulses by controlling the bit-clock divider. The number of bit-clock pulses in a frame may need adjustment to accommodate various word-lengths as well as to support the case when multiple TLV320AIC3212s may share the same audio bus. When configuring an audio interface for six-wire mode, the ADC and DAC paths can operate based on separate bit clocks. The TLV320AIC3212 also includes a feature to offset the position of start of data transfer with respect to the word-clock. This offset can be controlled in terms of number of bit-clocks. The TLV320AIC3212 also has the feature of inverting the polarity of the bit-clock used for transferring the audio data as compared to the default clock polarity used. This feature can be used independently of the mode of audio interface chosen. The TLV320AIC3212 further includes programmability to 3-state the DOUT line during all bit clocks when valid data is not being sent. By combining this capability with the ability to program at what bit clock in a frame the audio data begins, time-division multiplexing (TDM) can be accomplished, enabling the use of multiple codecs on a single audio serial data bus. When the audio serial data bus is powered down while configured in master mode, the terminals associated with the interface are put into a 3-state output condition. By default, when the word-clocks and bit-clocks are generated by the TLV320AIC3212, these clocks are active only when the codec (ADC, DAC or both) are powered up within the device. This is done to save power. However, it also supports a feature when both the word clocks and bit-clocks can be active even when the codec is powered down. This is useful when using the TDM mode with multiple codecs on the same bus, or when wordclock or bit-clocks are used in the system as general-purpose clocks. For more detailed information see the TLV320AIC3212 Application Reference Guide, SLAU360. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 53 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 10.3.9 Device Special Functions The following special functions are available to support advanced system requirements: • SAR ADC • Headset detection • Interrupt generation • Flexible pin multiplexing For more detailed information see the Application Reference Guide, SLAU360. 10.4 Device Functional Modes 10.4.1 Recording Mode The recording mode is activated once the ADC side is enabled. The record path operates from 8 kHz mono to 192 kHz stereo recording, and contains programmable input channel configurations supporting single-ended and differential setups, as well as floating or mixing input signals. In order to provide optimal system power management, the stereo recording path can be powered up one channel at a time, to support the case where only mono record capability is required. Digital signal processing blocks can remove audible noise that may be introduced by mechanical coupling. The record path can also be configured as a stereo digital microphone PDM interface typically used at 64 Fs or 128 Fs. The TLV320AIC3212 includes Automatic Gain Control (AGC) for ADC recording. 10.4.2 Playback Mode Once the DAC side is enabled, the playback mode is activated. The playback path offers signal processing blocks for filtering and effects; headphone, line, receiver, and Class-D speaker outputs; flexible mixing of DAC; and analog input signals as well as programmable volume controls. The playback path contains two high-power headphone output drivers which eliminate the need for ac coupling capacitors. These headphone output drivers can be configured in multiple ways, including stereo and mono BTL. In addition, playback audio can be routed to integrated stereo Class-D speaker drivers or a differential receiver amplifier. 10.4.3 Analog Low Power Bypass Modes The TLV320AIC3212 is a versatile device designed for ultra low-power applications. In some cases, only a few features of the device are required. For these applications, the unused stages of the device must be powered down to save power and an alternate route should be used. This is called analog low power bypass path. The bypass path modes let the device to save power by turning off unused stages, like ADC, DAC and PGA. The TLV320AIC3212 offers two analog-bypass modes. In either of the modes, an analog input signal can be routed form an analog input pin to an amplifier driving an analog output pin. Neither the ADC nor the DAC resources are required for such operation; this supports low-power operation during analog-bypass mode. In analog low-power bypass mode, line level signals can be routed directly form the analog inputs IN1L to the left lineout amplifier (LOL) and IN1R to LOR. Additionally, line-level signals can be routed directly from these analog inputs to the differential receiver amplifier, which outputs on RECP and RECM. In analog low-power bypass mode, line-level signals can be routed directly from the analog inputs IN1L to the positive input on differential receiver amplifier (RECP) and IN1R to RECM, with gain control of –78 dB to 0 dB. This is configured on B0_P1_R38_D[6:0] for the channel and B0_P1_R38_D[6:0] for the left channel and B0_P1_R39_D[6:0] for the right channel. To use the mixer amplifiers, power them on through B0_P1_R17_D[3:2]. 54 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 10.5 Register Maps Table 13. Summary of Register Map DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 0 0 0x00 0x00 0x00 Page Select Register 0 0 1 0x00 0x00 0x01 Software Reset Register 0 0 2-3 0x00 0x00 0x020x03 Reserved Registers 0 0 4 0x00 0x00 0x04 Clock Control Register 1, Clock Input Multiplexers 0 0 5 0x00 0x00 0x05 Clock Control Register 2, PLL Input Multiplexer 0 0 6 0x00 0x00 0x06 Clock Control Register 3, PLL P and R Values 0 0 7 0x00 0x00 0x07 Clock Control Register 4, PLL J Value 0 0 8 0x00 0x00 0x08 Clock Control Register 5, PLL D Values (MSB) 0 0 9 0x00 0x00 0x09 Clock Control Register 6, PLL D Values (LSB) 0 0 10 0x00 0x00 0x0A Clock Control Register 7, PLL_CLKIN Divider 0 0 11 0x00 0x00 0x0B Clock Control Register 8, NDAC Divider Values 0 0 12 0x00 0x00 0x0C Clock Control Register 9, MDAC Divider Values 0 0 13 0x00 0x00 0x0D DAC OSR Control Register 1, MSB Value 0 0 14 0x00 0x00 0x0E DAC OSR Control Register 2, LSB Value 0 0 15-17 0x00 0x00 0x0F0x11 Reserved Registers 0 0 18 0x00 0x00 0x12 Clock Control Register 10, NADC Values 0 0 19 0x00 0x00 0x13 Clock Control Register 11, MADC Values 0 0 20 0x00 0x00 0x14 ADC Oversampling (AOSR) Register 0 0 21 0x00 0x00 0x15 CLKOUT MUX 0 0 22 0x00 0x00 0x16 Clock Control Register 12, CLKOUT M Divider Value 0 0 23 0x00 0x00 0x17 Timer clock 0 0 24 0x00 0x00 0x18 Low Frequency Clock Generation Control 0 0 25 0x00 0x00 0x19 High Frequency Clock Generation Control 1 0 0 26 0x00 0x00 0x1A High Frequency Clock Generation Control 2 0 0 27 0x00 0x00 0x1B High Frequency Clock Generation Control 3 0 0 28 0x00 0x00 0x1C High Frequency Clock Generation Control 4 0 0 29 0x00 0x00 0x1D High Frequency Clock Trim Control 1 0 0 30 0x00 0x00 0x1E High Frequency Clock Trim Control 2 0 0 31 0x00 0x00 0x1F High Frequency Clock Trim Control 3 0 0 32 0x00 0x00 0x20 High Frequency Clock Trim Control 4 0 0 33-35 0x00 0x00 0x210x23 Reserved Registers 0 0 36 0x00 0x00 0x24 ADC Flag Register 0 0 37 0x00 0x00 0x25 DAC Flag Register 0 0 38 0x00 0x00 0x26 DAC Flag Register 0 0 39-41 0x00 0x00 0x270x29 Reserved Registers 0 0 42 0x00 0x00 0x2A Sticky Flag Register 1 0 0 43 0x00 0x00 0x2B Interrupt Flag Register 1 0 0 44 0x00 0x00 0x2C Sticky Flag Register 2 0 0 45 0x00 0x00 0x2D Sticky Flag Register 3 0 0 46 0x00 0x00 0x2E Interrupt Flag Register 2 0 0 47 0x00 0x00 0x2F Interrupt Flag Register 3 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 55 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 0 48 0x00 0x00 0x30 INT1 Interrupt Control 0 0 49 0x00 0x00 0x31 INT2 Interrupt Control 0 0 50 0x00 0x00 0x32 SAR Control 1 0 0 51 0x00 0x00 0x33 Interrupt Format Control Register 0 0 52-59 0x00 0x00 0x340x3B Reserved Registers 0 0 60 0x00 0x00 0x3C DAC Processing Block Control 0 0 61 0x00 0x00 0x3D ADC Processing Block Control 0 0 62 0x00 0x00 0x3E Reserved Register 0 0 63 0x00 0x00 0x3F Primary DAC Power and Soft-Stepping Control 0 0 64 0x00 0x00 0x40 Primary DAC Master Volume Configuration 0 0 65 0x00 0x00 0x41 Primary DAC Left Volume Control Setting 0 0 66 0x00 0x00 0x42 Primary DAC Right Volume Control Setting 0 0 67 0x00 0x00 0x43 Headset Detection 0 0 68 0x00 0x00 0x44 DRC Control Register 1 0 0 69 0x00 0x00 0x45 DRC Control Register 2 0 0 70 0x00 0x00 0x46 DRC Control Register 3 0 0 71 0x00 0x00 0x47 Beep Generator Register 1 0 0 72 0x00 0x00 0x48 Beep Generator Register 2 0 0 73 0x00 0x00 0x49 Beep Generator Register 3 0 0 74 0x00 0x00 0x4A Beep Generator Register 4 0 0 75 0x00 0x00 0x4B Beep Generator Register 5 0 0 76 0x00 0x00 0x4C Beep Sin(x) MSB 0 0 77 0x00 0x00 0x4D Beep Sin(x) LSB 0 0 78 0x00 0x00 0x4E Beep Cos(x) MSB 0 0 79 0x00 0x00 0x4F Beep Cos(x) LSB 0 0 80 0x00 0x00 0x50 Reserved Register 0 0 81 0x00 0x00 0x51 ADC Channel Power Control 0 0 82 0x00 0x00 0x52 ADC Fine Gain Volume Control 0 0 83 0x00 0x00 0x53 Left ADC Volume Control 0 0 84 0x00 0x00 0x54 Right ADC Volume Control 0 0 85 0x00 0x00 0x55 ADC Phase Control 0 0 86 0x00 0x00 0x56 Left AGC Control 1 0 0 87 0x00 0x00 0x57 Left AGC Control 2 0 0 88 0x00 0x00 0x58 Left AGC Control 3 0 0 89 0x00 0x00 0x59 Left AGC Attack Time 0 0 90 0x00 0x00 0x5A Left AGC Decay Time 0 0 91 0x00 0x00 0x5B Left AGC Noise Debounce 0 0 92 0x00 0x00 0x5C Left AGC Signal Debounce 0 0 93 0x00 0x00 0x5D Left AGC Gain 0 0 94 0x00 0x00 0x5E Right AGC Control 1 0 0 95 0x00 0x00 0x5F Right AGC Control 2 0 0 96 0x00 0x00 0x60 Right AGC Control 3 0 0 97 0x00 0x00 0x61 Right AGC Attack Time 56 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 0 98 0x00 0x00 0x62 Right AGC Decay Time 0 0 99 0x00 0x00 0x63 Right AGC Noise Debounce 0 0 100 0x00 0x00 0x64 Right AGC Signal Debounce 0 0 101 0x00 0x00 0x65 Right AGC Gain 0 0 102 0x00 0x00 0x66 ADC DC Measurement Control Register 1 0 0 103 0x00 0x00 0x67 ADC DC Measurement Control Register 2 0 0 104 0x00 0x00 0x68 Left Channel DC Measurement Output Register 1 (MSB Byte) 0 0 105 0x00 0x00 0x69 Left Channel DC Measurement Output Register 2 (Middle Byte) 0 0 106 0x00 0x00 0x6A Left Channel DC Measurement Output Register 3 (LSB Byte) 0 0 107 0x00 0x00 0x6B Right Channel DC Measurement Output Register 1 (MSB Byte) 0 0 108 0x00 0x00 0x6C Right Channel DC Measurement Output Register 2 (Middle Byte) 0 0 109 0x00 0x00 0x6D Right Channel DC Measurement Output Register 3 (LSB Byte) 0 0 110-114 0x00 0x00 0x6E0x72 Reserved Registers 0 0 115 0x00 0x00 0x73 I2C Interface Miscellaneous Control 0 0 116-126 0x00 0x00 0x740x7E Reserved Registers 0 0 127 0x00 0x00 0x7F Book Selection Register 0 1 0 0x00 0x01 0x00 Page Select Register 0 1 1 0x00 0x01 0x01 Power Configuration Register 0 1 2 0x00 0x01 0x02 Reserved Register 0 1 3 0x00 0x01 0x03 Left DAC PowerTune Configuration Register 0 1 4 0x00 0x01 0x04 Right DAC PowerTune Configuration Register 0 1 5-7 0x00 0x01 0x050x07 Reserved Registers 0 1 8 0x00 0x01 0x08 Common Mode Register 0 1 9 0x00 0x01 0x09 Headphone Output Driver Control 0 1 10 0x00 0x01 0x0A Receiver Output Driver Control 0 1 11 0x00 0x01 0x0B Headphone Output Driver De-pop Control 0 1 12 0x00 0x01 0x0C Receiver Output Driver De-Pop Control 0 1 13-16 0x00 0x01 0x0D0x10 Reserved Registers 0 1 17 0x00 0x01 0x11 Mixer Amplifier Control 0 1 18 0x00 0x01 0x12 Left ADC PGA to Left Mixer Amplifier (MAL) Volume Control 0 1 19 0x00 0x01 0x13 Right ADC PGA to Right Mixer Amplifier (MAR) Volume Control 0 1 20-21 0x00 0x01 0x140x15 Reserved Registers 0 1 22 0x00 0x01 0x16 Lineout Amplifier Control 1 0 1 23 0x00 0x01 0x17 Lineout Amplifier Control 2 0 1 24-26 0x00 0x01 0x180x1A Reserved 0 1 27 0x00 0x01 0x1B Headphone Amplifier Control 1 0 1 28 0x00 0x01 0x1C Headphone Amplifier Control 2 0 1 29 0x00 0x01 0x1D Headphone Amplifier Control 3 0 1 30 0x00 0x01 0x1E Reserved Register 0 1 31 0x00 0x01 0x1F HPL Driver Volume Control Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 57 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 1 32 0x00 0x01 0x20 HPR Driver Volume Control 0 1 33 0x00 0x01 0x21 Charge Pump Control 1 0 1 34 0x00 0x01 0x22 Charge Pump Control 2 0 1 35 0x00 0x01 0x23 Charge Pump Control 3 0 1 36 0x00 0x01 0x24 Receiver Amplifier Control 1 0 1 37 0x00 0x01 0x25 Receiver Amplifier Control 2 0 1 38 0x00 0x01 0x26 Receiver Amplifier Control 3 0 1 39 0x00 0x01 0x27 Receiver Amplifier Control 4 0 1 40 0x00 0x01 0x28 Receiver Amplifier Control 5 0 1 41 0x00 0x01 0x29 Receiver Amplifier Control 6 0 1 42 0x00 0x01 0x2A Receiver Amplifier Control 7 0 1 43-44 0x00 0x01 0x2B0x2C Reserved Registers 0 1 45 0x00 0x01 0x2D Speaker Amplifier Control 1 0 1 46 0x00 0x01 0x2E Speaker Amplifier Control 2 0 1 47 0x00 0x01 0x2F Speaker Amplifier Control 3 0 1 48 0x00 0x01 0x30 Speaker Amplifier Volume Controls 0 1 49-50 0x00 0x01 0x310x32 Reserved Registers 0 1 51 0x00 0x01 0x33 Microphone Bias Control 0 1 52 0x00 0x01 0x34 Input Select 1 for Left Microphone PGA P-Terminal 0 1 53 0x00 0x01 0x35 Input Select 2 for Left Microphone PGA P-Terminal 0 1 54 0x00 0x01 0x36 Input Select for Left Microphone PGA M-Terminal 0 1 55 0x00 0x01 0x37 Input Select 1 for Right Microphone PGA P-Terminal 0 1 56 0x00 0x01 0x38 Input Select 2 for Right Microphone PGA P-Terminal 0 1 57 0x00 0x01 0x39 Input Select for Right Microphone PGA M-Terminal 0 1 58 0x00 0x01 0x3A Input Common Mode Control 0 1 59 0x00 0x01 0x3B Left Microphone PGA Control 0 1 60 0x00 0x01 0x3C Right Microphone PGA Control 0 1 61 0x00 0x01 0x3D ADC PowerTune Configuration Register 0 1 62 0x00 0x01 0x3E ADC Analog PGA Gain Flag Register 0 1 63 0x00 0x01 0x3F DAC Analog Gain Flags Register 1 0 1 64 0x00 0x01 0x40 DAC Analog Gain Flags Register 2 0 1 65 0x00 0x01 0x41 Analog Bypass Gain Flags Register 0 1 66 0x00 0x01 0x42 Driver Power-Up Flags Register 0 1 67-118 0x00 0x01 0x430x76 Reserved Registers 0 1 119 0x00 0x01 0x77 Headset Detection Tuning Register 1 0 1 120 0x00 0x01 0x78 Headset Detection Tuning Register 2 0 1 121 0x00 0x01 0x79 Microphone PGA Power-Up Control Register 0 1 122 0x00 0x01 0x7A Reference Powerup Delay Register 0 1 123-127 0x00 0x01 0x7B0x7F Reserved Registers 0 3 0 0x00 0x03 0x00 Page Select Register 0 3 1 0x00 0x03 0x01 Reserved Register 58 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 3 2 0x00 0x03 0x02 Primary SAR ADC Control 0 3 3 0x00 0x03 0x03 Primary SAR ADC Conversion Mode 0 3 4-5 0x00 0x03 0x040x05 Reserved Registers 0 3 6 0x00 0x03 0x06 SAR Reference Control 0 3 7-8 0x00 0x03 0x070x08 Reserved Registers 0 3 9 0x00 0x03 0x09 SAR ADC Flags Register 1 0 3 10 0x00 0x03 0x0A SAR ADC Flags Register 2 0 3 11-12 0x00 0x03 0x0B0x0C Reserved Registers 0 3 13 0x00 0x03 0x0D SAR ADC Buffer Mode Control 0 3 14 0x00 0x03 0x0E Reserved Register 0 3 15 0x00 0x03 0x0F Scan Mode Timer Control 0 3 16 0x00 0x03 0x10 Reserved Register 0 3 17 0x00 0x03 0x11 SAR ADC Clock Control 0 3 18 0x00 0x03 0x12 SAR ADC Buffer Mode Data Read Control 0 3 19 0x00 0x03 0x13 SAR ADC Measurement Control 0 3 20 0x00 0x03 0x14 Reserved Register 0 3 21 0x00 0x03 0x15 SAR ADC Measurement Threshold Flags 0 3 22 0x00 0x03 0x16 IN1L Max Threshold Check Control 1 0 3 23 0x00 0x03 0x17 IN1L Max Threshold Check Control 2 0 3 24 0x00 0x03 0x18 IN1L Min Threshold Check Control 1 0 3 25 0x00 0x03 0x19 IN1L Min Threshold Check Control 2 0 3 26 0x00 0x03 0x1A IN1R Max Threshold Check Control 1 0 3 27 0x00 0x03 0x1B IN1R Max Threshold Check Control 2 0 3 28 0x00 0x03 0x1C IN1R Min Threshold Check Control 1 0 3 29 0x00 0x03 0x1D IN1R Min Threshold Check Control 2 0 3 30 0x00 0x03 0x1E TEMP Max Threshold Check Control 1 0 3 31 0x00 0x03 0x1F TEMP Max Threshold Check Control 2 0 3 32 0x00 0x03 0x20 TEMP Min Threshold Check Control 1 0 3 33 0x00 0x03 0x21 TEMP Min Threshold Check Control 2 0 3 34-53 0x00 0x03 0x220x35 Reserved Registers 0 3 54 0x00 0x03 0x36 IN1L Measurement Data (MSB) 0 3 55 0x00 0x03 0x37 IN1L Measurement Data (LSB) 0 3 56 0x00 0x03 0x38 IN1R Measurement Data (MSB) 0 3 57 0x00 0x03 0x39 IN1R Measurement Data (LSB) 0 3 58 0x00 0x03 0x3A VBAT Measurement Data (MSB) 0 3 59 0x00 0x03 0x3B VBAT Measurement Data (LSB) 0 3 60-65 0x00 0x03 0x3C0x41 Reserved Registers 0 3 66 0x00 0x03 0x42 TEMP1 Measurement Data (MSB) 0 3 67 0x00 0x03 0x43 TEMP1 Measurement Data (LSB) 0 3 68 0x00 0x03 0x44 TEMP2 Measurement Data (MSB) 0 3 69 0x00 0x03 0x45 TEMP2 Measurement Data (LSB) Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 59 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 3 70-127 0x00 0x03 0x460x7F Reserved Registers 0 4 0 0x00 0x04 0x00 Page Select Register 0 4 1 0x00 0x04 0x01 Audio Serial Interface 1, Audio Bus Format Control Register 0 4 2 0x00 0x04 0x02 Audio Serial Interface 1, Left Ch_Offset_1 Control Register 0 4 3 0x00 0x04 0x03 Audio Serial Interface 1, Right Ch_Offset_2 Control Register 0 4 4 0x00 0x04 0x04 Audio Serial Interface 1, Channel Setup Register 0 4 5-6 0x00 0x04 0x050x06 Reserved Registers 0 4 7 0x00 0x04 0x07 Audio Serial Interface 1, ADC Input Control 0 4 8 0x00 0x04 0x08 Audio Serial Interface 1, DAC Output Control 0 4 9 0x00 0x04 0x09 Audio Serial Interface 1, Control Register 9, ADC Slot Tristate Control 0 4 10 0x00 0x04 0x0A Audio Serial Interface 1, WCLK and BCLK Control Register 0 4 11 0x00 0x04 0x0B Audio Serial Interface 1, Bit Clock N Divider Input Control 0 4 12 0x00 0x04 0x0C Audio Serial Interface 1, Bit Clock N Divider 0 4 13 0x00 0x04 0x0D Audio Serial Interface 1, Word Clock N Divider 0 4 14 0x00 0x04 0x0E Audio Serial Interface 1, BCLK and WCLK Output 0 4 15 0x00 0x04 0x0F Audio Serial Interface 1, Data Output 0 4 16 0x00 0x04 0x10 Audio Serial Interface 1, ADC WCLK and BCLK Control 0 4 17 0x00 0x04 0x11 Audio Serial Interface 2, Audio Bus Format Control Register 0 4 18 0x00 0x04 0x12 Audio Serial Interface 2, Data Offset Control Register 0 4 19-22 0x00 0x04 0x130x16 Reserved Registers 0 4 23 0x00 0x04 0x17 Audio Serial Interface 2, ADC Input Control 0 4 24 0x00 0x04 0x18 Audio Serial Interface 2, DAC Output Control 0 4 25 0x00 0x04 0x19 Reserved Register 0 4 26 0x00 0x04 0x1A Audio Serial Interface 2, WCLK and BCLK Control Register 0 4 27 0x00 0x04 0x1B Audio Serial Interface 2, Bit Clock N Divider Input Control 0 4 28 0x00 0x04 0x1C Audio Serial Interface 2, Bit Clock N Divider 0 4 29 0x00 0x04 0x1D Audio Serial Interface 2, Word Clock N Divider 0 4 30 0x00 0x04 0x1E Audio Serial Interface 2, BCLK and WCLK Output 0 4 31 0x00 0x04 0x1F Audio Serial Interface 2, Data Output 0 4 32 0x00 0x04 0x20 Audio Serial Interface 2, ADC WCLK and BCLK Control 0 4 33 0x00 0x04 0x21 Audio Serial Interface 3, Audio Bus Format Control Register 0 4 34 0x00 0x04 0x22 Audio Serial Interface 3, Data Offset Control Register 0 4 35-38 0x00 0x04 0x230x26 Reserved Registers 0 4 39 0x00 0x04 0x27 Audio Serial Interface 3, ADC Input Control 0 4 40 0x00 0x04 0x28 Audio Serial Interface 3, DAC Output Control 0 4 41 0x00 0x04 0x29 Reserved Register 0 4 42 0x00 0x04 0x2A Audio Serial Interface 3, WCLK and BCLK Control Register 0 4 43 0x00 0x04 0x2B Audio Serial Interface 3, Bit Clock N Divider Input Control 0 4 44 0x00 0x04 0x2C Audio Serial Interface 3, Bit Clock N Divider 0 4 45 0x00 0x04 0x2D Audio Serial Interface 3, Word Clock N Divider 0 4 46 0x00 0x04 0x2E Audio Serial Interface 3, BCLK and WCLK Output 60 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 0 4 47 0x00 0x04 0x2F Audio Serial Interface 3, Data Output 0 4 48 0x00 0x04 0x30 Audio Serial Interface 3, ADC WCLK and BCLK Control 0 4 49-64 0x00 0x04 0x310x40 Reserved Registers 0 4 65 0x00 0x04 0x41 WCLK1 (Input/Output) Pin Control 0 4 66 0x00 0x04 0x42 Reserved Register 0 4 67 0x00 0x04 0x43 DOUT1 (Output) Pin Control 0 4 68 0x00 0x04 0x44 DIN1 (Input) Pin Control 0 4 69 0x00 0x04 0x45 WCLK2 (Input/Output) Pin Control 0 4 70 0x00 0x04 0x46 BCLK2 (Input/Output) Pin Control 0 4 71 0x00 0x04 0x47 DOUT2 (Output) Pin Control 0 4 72 0x00 0x04 0x48 DIN2 (Input) Pin Control 0 4 73 0x00 0x04 0x49 WCLK3 (Input/Output) Pin Control 0 4 74 0x00 0x04 0x4A BCLK3 (Input/Output) Pin Control 0 4 75 0x00 0x04 0x4B DOUT3 (Output) Pin Control 0 4 76 0x00 0x04 0x4C DIN3 (Input) Pin Control 0 4 77-81 0x00 0x04 0x4D0x51 Reserved Registers 0 4 82 0x00 0x04 0x52 MCLK2 (Input) Pin Control 0 4 83-85 0x00 0x04 0x530x55 Reserved Registers 0 4 86 0x00 0x04 0x56 GPIO1 (Input/Output) Pin Control 0 4 87 0x00 0x04 0x57 GPIO2 (Input/Output) Pin Control 0 4 88-90 0x00 0x04 0x580x5A Reserved Registers 0 4 91 0x00 0x04 0x5B GPI1 (Input) Pin Control 0 4 92 0x00 0x04 0x5C GPI2 (Input) Pin Control 0 4 93-95 0x00 0x04 0x5D0x5F Reserved Registers 0 4 96 0x00 0x04 0x60 GPO1 (Output) Pin Control 0 4 97-100 0x00 0x04 0x610x64 Reserved Registers 0 4 101 0x00 0x04 0x65 Digital Microphone Input Pin Control 0 4 102-117 0x00 0x04 0x660x75 Reserved Registers 0 4 118 0x00 0x04 0x76 ADC/DAC Data Port Control 0 4 119 0x00 0x04 0x77 Digital Audio Engine Synchronization Control 0 4 120-127 0x00 0x04 0x780x7F Reserved Registers 0 252 0 0x00 0xFC 0x00 Page Select Register 0 252 1 0x00 0xFC 0x01 SAR Buffer Mode Data (MSB) and Buffer Flags 0 252 2 0x00 0xFC 0x02 SAR Buffer Mode Data (LSB) 0 252 3-127 0x00 0xFC 0x030x7F Reserved Registers 40 0 0 0x28 0x00 0x00 Page Select Register 40 0 1 0x28 0x00 0x01 ADC Adaptive CRAM Configuration Register Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 61 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Register Maps (continued) Table 13. Summary of Register Map (continued) DECIMAL HEX DESCRIPTION BOOK NO. PAGE NO. REG. NO. BOOK NO. PAGE NO. REG. NO. 40 0 2-126 0x28 0x00 0x020x7E Reserved Registers 40 0 127 0x28 0x00 0x7F Book Selection Register 40 1-17 0 0x28 0x010x11 0x00 Page Select Register 40 1-17 1-7 0x28 0x010x11 0x010x07 Reserved Registers 40 1-17 8-127 0x28 0x010x11 0x080x7F ADC Adaptive Coefficients C(0:509) 40 18 0 0x28 0x12 0x00 Page Select Register 40 18 1-7 0x28 0x12 0x010x07 Reserved Registers 40 18 8-15 0x28 0x12 0x080x0F ADC Adaptive Coefficients C(510:511) 40 18 16-127 0x28 0x12 0x100x7F Reserved Registers 80 0 0 0x50 0x00 0x00 Page Select Register 80 0 1 0x50 0x00 0x01 DAC Adaptive Coefficient Bank Configuration Register 80 0 2-126 0x50 0x00 0x020x7E Reserved Registers 80 0 127 0x50 0x00 0x7F Book Selection Register 80 1-17 0 0x50 0x010x11 0x00 Page Select Register 80 1-17 1-7 0x50 0x010x11 0x010x07 Reserved Registers 80 1-17 8-127 0x50 0x010x11 0x080x7F DAC Adaptive Coefficient Bank C(0:509) 80 18 0 0x50 0x12 0x00 Page Select Register 80 18 1-7 0x50 0x12 0x010x07 Reserved Registers 80 18 8-15 0x50 0x12 0x080x0F DAC Adaptive Coefficient Bank C(510:511) 80 18 16-127 0x50 0x12 0x100x7F Reserved Registers 62 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 11 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 11.1 Application Information These typical connection diagrams highlight the required external components and system level connections for proper operation of the device in several popular use cases. Each of these configurations can be realized using the Evaluation Modules (EVMs) for the device. These flexible modules allow full evaluation of the device in all available modes of operation. Additionally, some of the application circuits are available as reference designs and can be found on the TI website. Also see the TLV320AIC3212 product page for information on ordering the EVM. Not all configurations are available as reference designs; however, any design variation can be supported by TI through schematic and layout reviews. Visit support.ti.com for additional design assistance. Also, join the audio converters discussion forum at http://e2e.ti.com. Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 63 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 11.2 Typical Application Figure 33 shows a typical circuit configuration for a system utilizing TLV320AIC3212. Note that while this circuit configuration shows all three Audio Serial Interfaces connected to a single Host Processor, it is also quite common for these Audio Serial Interfaces to connect to separate devices (for example, Host Processor on Audio Serial Interface number 1, and modems and/or Bluetooth devices on the other audio serial interfaces). ,)$5 1( 4($' 6,3 2,+)&-$ 7$&(43$7$*) "()$7 &))$3" 4'1, *)$36&0$ : 4'1, *)$36&0$ : 4'1, *)$36&0$ : 1*$,4) % *&+,- * *&+,- * ! "#$ *&+,- * ! *&+,- * *&+,- *. "#$ $0$12$3 *&+,- */ 9 *&+,- *! , *)$3*&+ 10 $&'($) % &) ,**$0),3 % % % 8 % Figure 33. Typical Circuit Configuration 64 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Typical Application (continued) 11.2.1 Design Requirements This section gives the power-consumption values for various PowerTune modes. All measurements were taken with the PLL turned off and the ADC configured for single-ended input. Table 14. ADC, Stereo, 48 kHz, Highest Performance, DVDD = IOVDD = 1.8 V, AVDDx_18 = 1.8 V (1) DEVICE COMMON MODE SETTING = 0.75 V DEVICE COMMON MODE SETTING = 0.9 V UNIT PTM_R1 PTM_R2 PTM_R3 PTM_R4 PTM_R1 PTM_R2 PTM_R3 PTM_R4 0 dB full scale X 375 375 375 X 500 500 500 mVRMS Maximum allowed input level w.r.t. 0 dB full scale X –12 0 0 X –12 0 0 dB full scale Effective SNR w.r.t. maximum allowed input level X 78.2 91.2 91 X 79.5 93.1 93 dB Power consumption X 12.3 14.6 18.8 X 12.3 14.6 18.8 mW (1) AOSR = 128, Processing Block = PRB_R1 (Decimation Filter A) Table 15. Alternative Processing Blocks PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW) PRB_R2 A +1.2 PRB_R3 A +0.8 Table 16. ADC, Stereo, 48 kHz, Lowest Power Consumption (1) PTM_R1 CM = 0.75 V AVdd = 1.5 V PTM_R3 CM = 0.9 V AVdd = 1.8 V 0 dB full scale 375 500 mVRMS Maximum allowed input level w.r.t. 0 dB full scale –2 0 dB full scale Effective SNR w.r.t. maximum allowed input level 85.9 90.8 dB Power consumption 5.6 9.5 mW (1) UNIT AOSR = 64, Processing Block = PRB_R7 (Decimation Filter B), DVdd = 1.26 V Table 17. Alternative Processing Blocks PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW) PRB_R8 B +0.4 PRB_R9 B +0.2 PRB_R1 A +1.2 PRB_R2 A +1.8 PRB_R3 A +1.6 Table 18. DAC, Stereo, 48 kHz, Highest Performance, DVDD = IOVDD = 1.8 V, AVDDx_18 = 1.8 V (1) DEVICE COMMON MODE SETTING = 0.75 V (1) UNIT PTM_P2 PTM_P3 PTM_P4 PTM_P1 PTM_P2 PTM_P3 PTM_P4 75 225 375 375 100 300 500 500 mVRMS Effective SNR w.r.t. 0 dB full scale 89.5 96.3 99.3 99.2 91.7 98.4 101.2 101.2 dB Power consumption 11.3 11.9 12.4 12.4 11.5 12.2 12.9 12.9 mW 0 dB full scale Line out DEVICE COMMON MODE SETTING = 0.9 V PTM_P1 DOSR = 128, Processing Block = PRB_P8 (Interpolation Filter B) Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 65 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Table 19. Alternative Processing Blocks PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW) PRB_P1 A –0.1 PRB_P2 A +2.6 PRB_P3 A +1.1 PRB_P7 B –2.8 PRB_P9 B –1.7 PRB_P10 B +0.6 PRB_P11 B –1.2 PRB_P23 A –0.1 PRB_P24 A +2.8 PRB_P25 A +3.6 Table 20. DAC, Stereo, 48 kHz, Lowest Power Consumption (1) CM = 0.75 V AVdd = 1.5 V PRB_P26 PTM_P1 CM = 0.9 V AVdd = 1.8 V PRB_P26 PTM_P1 CM = 0.75 V AVdd = 1.5 V PRB_P7 PTM_P4 UNIT 75 100 375 mVRMS Effective SNR w.r.t. 0 dB full scale 88.6 90.7 99.2 dB Power consumption 2.7 3.3 5.2 mW 0 dB full scale Line out (1) DOSR = 64, Interpolation Filter D, DVdd = 1.26 V Table 21. Alternative Processing Blocks (1) PROCESSING BLOCK FILTER ESTIMATED POWER CHANGE (mW) (1) PRB_P1 A +3.1 PRB_P2 A +4.4 PRB_P3 A +3.6 PRB_P7 B +1.7 PRB_P9 B +2.3 PRB_P10 B +3.4 PRB_P11 B +2.5 PRB_P23 A +3.1 PRB_P24 A +4.5 PRB_P25 A +4.8 Estimated power change is w.r.t. PRB_P26. For more possible configurations and measurements, please consult the TLV320AIC3212 Application Reference Guide. 11.2.2 Detailed Design Procedure For more detailed information see the TLV320AIC3212 Application Reference Guide, SLAU360. 11.2.2.1 Charge Pump Flying and Holding Capacitor The TLV320AIC3212 features a built in charge-pump to generate a negative supply rail, VNEG from CPVDD_18. The negative voltage is used by the headphone amplifier to enable driving the output signal biased around ground potential. For proper operation of the charge pump and headphone amplifier, it is recommended that the flying capacitor connected between CPFCP and CPFCM terminals and the holding capacitor connected between VNEG and ground be of X7R type. It is recommended to use 2.2μF as capacitor value. Failure to use X7R type capacitor can result in degraded performance of charge pump and headphone amplifier. 66 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 11.2.2.2 Reference Filtering Capacitor The TLV320AIC3212 has a built-in bandgap used to generate reference voltages and currents for the device. To achieve high SNR, the reference voltage on VREF_AUDIO should be filtered using a 10μF capacitor from VREF_AUDIO terminal to ground. 11.2.2.3 MICBIAS TLV320AIC3212 has a built-in bias voltage output for biasing of microphones. No intentional capacitors should be connected directly to the MICBIAS output for filtering. THDN−Total Harmonic Distortion+Noise (dB) 11.2.3 Application Curves Rin = 10k, DE 110 SNR (dB) 105 Rin = 20k, DE Rin = 40k, DE 100 Rin = 10k, SE 95 Rin = 20k, SE 90 Rin = 40k, SE 85 −10 0 10 20 30 Channel Gain (dB) 40 50 0 CM=0.75V, RECVDD=1.65V −10 −20 −30 −40 −50 CM=1.25V, RECVDD=2.5V −60 CM=1.5V, RECVDD=3V −70 −80 CM=1.65V, RECVDD=3.3V −90 −100 0 20 G001 Figure 34. ADC SNR vs Channel Gain Input-Referred CM=0.9V, RECVDD=1.8V 40 60 80 100 120 Output Power (mW) 140 160 180 G008 Figure 35. Total Harmonic Distortion+Noise vs Differential Receiver Output Power 32-Ω Load Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 67 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 12 Power Supply Recommendations The TLV320AIC3212 integrates a large amount of digital and analog functionality, and each of these blocks can be powered separately to enable the system to select appropriate power supplies for desired performance and power consumption. The device has separate power domains for digital IO, digital core, analog core, analog input, receiver driver, charge-pump input, headphone driver, and speaker drivers. If desired, all of the supplies (except for the supplies for speaker drivers, which can directly connect to the battery) can be connected together and be supplied from one source in the range of 1.65 V to 1.95 V. Individually, the IOVDD voltage can be supplied in the range of 1.1 V to 3.6 V. For improved power efficiency, the digital core power supply can range from 1.26 V to 1.95 V. The analog core voltages (AVDD1_18, AVDD2_18, AVDD4_18, and AVDD_18) can range from 1.5 V to 1.95 V. The microphone bias (AVDD3_33) and receiver driver supply (RECVDD_33) voltages can range from 1.65 V to 3.6 V. The charge-pump input voltage (CPVDD_18) can range from 1.26 V to 1.95 V, and the headphone driver supply (HVDD_18) voltage can range from 1.5 V to 1.95 V. The speaker driver voltages (SLVDD, SRVDD, and SPK_V) can range from 2.7 V to 5.5 V. For more detailed information see the Application Reference Guide, SLAU360. 13 Layout 13.1 Layout Guidelines Each system design and PCB layout is unique. The layout should be carefully reviewed in the context of a specific PCB design. However, the following guidelines can optimize TLV320AIC3212 performance: • The decoupling capacitors for the power supplies should be placed close to the device terminals. Figure 33 shows the recommended decoupling capacitors for the TLV320AIC3212. • Place the flying capacitor between CPFCP and CPFCM near the device terminals, with minimal VIAS in the trace between the device terminals and the capacitor. Similarly, keep the decoupling capacitor on VNEG near the device terminal with minimal VIAS in the trace between the device terminal, capacitor, and PCB ground. • TLV320AIC3212 internal voltage references must be filtered using external capacitors. Place the filter capacitors on VREF_SAR and VREF_AUDIO near the device terminals for optimal performance. • For analog differential audio signals, the signals should be routed differentially on the PCB for better noise immunity. Avoid crossing of digital and analog signals to avoid undesirable crosstalk. • Analog, speaker and digital grounds should be separated to prevent possible digital noise from affecting the analog performance of the board. 68 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 13.2 Layout Examples Figure 36, Figure 37, and Figure 38 show some recommendations that must be followed to ensure the best performance of the device. See the TLV320AIC3212EVM (SLAU435) for details. Analog, speaker and digital grounds should be separated in order to prevent possible digital noise from affecting the analog performance of the board. SGND Speaker Ground TLV320AIC3212 DGND Digital Ground Analog, speaker and digital grounds must be connected in a common point. AGND Analogic Ground Ground Plane Ground Separation Lines Figure 36. Ground Layer Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 69 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com Layout Examples (continued) SGND SPKRP 0.0047µF 1kQ 0.0047µF 1kQ 0.0047µF 1kQ 0.0047µF 1kQ SPKRM Speaker lines must be enlarged to ensure the power dissipation. SPKLM SPKLP I2S_3 LOR 1µF I2C LOL HPVSS_SENSE HPL HPR RECP I2S_2 TLV320AIC3212 I2S_1 47µF 10kQ RECM MCLK 47µF 10kQ DGND System Processor SPI_SELECT 1µF If possible, route differential audio signals differentially. IN2R IN2L IN3R IN3L IN1R IN1L IN4R IN4L AGND Ground Plane Pad to ground plane Signal Traces Ground Separation Lines Figure 37. I/O Layer 70 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 TLV320AIC3212 www.ti.com SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 Layout Examples (continued) SGND 10.1µF 47.1µF SRVDD Decoupling capacitors for power supplies should be placed close to the device terminals. IOVDD 47.1µF 10µF SLVDD 10.1µF 10.1µF 10.1µF 2.2µF 10.1µF Minimal VIAS between the device terminals and capacitor is recommended. DVDD (1) (2) (3) TLV320AIC3212 (4) (5) DVDD (6) 10µF 10.1µF 10.1µF IOVDD 0.1µF 1µF 221Q 10.1µF 10.1µF (7) Place the filter capacitors on VREF_SAR, VREF_AUDIO and VNEG near the device for optimal performance. 10.1µF (1) (2) (3) AVDD_18 VREF_AUDIO VREF_SAR AVDD1_18 AGND DGND (4) (5) (6) (7) Ground Plane Pad to ground plane Signal Traces Ground Separation Lines CPVDD_18 AVDD4_18 AVDD2_18 VNEG HVDD_18 RECVDD_33 AVDD3_33 Figure 38. Power Layer Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 71 TLV320AIC3212 SLAS784A – MARCH 2012 – REVISED SEPTEMBER 2015 www.ti.com 14 Device and Documentation Support 14.1 Documentation Support 14.1.1 Related Documentation For related documentation, see the following: • Application Reference Guide, SLAU360 • TLV320AIC3212EVM-U Evaluation Module , SLAU435 14.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 14.3 Trademarks DirectPath, PowerTune, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 14.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 14.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 15 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 72 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TLV320AIC3212 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TLV320AIC3212IYZFR ACTIVE DSBGA YZF 81 2500 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 AIC3212 TLV320AIC3212IYZFT ACTIVE DSBGA YZF 81 250 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 AIC3212 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of