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TLV3702CDGKR

TLV3702CDGKR

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    TSSOP8

  • 描述:

    TLV3702 DUAL LOW POWER, HIGH-VOL

  • 详情介绍
  • 数据手册
  • 价格&库存
TLV3702CDGKR 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 TLV370x Family of Nanopower, Push-Pull Output Comparators 1 Features 3 Description • • The TLV370x is Texas Instruments’ first family of nanopower comparators with only 560 nA per channel supply current, which make this device ideal for battery power and wireless handset applications. 1 • • • • • • Low Supply Current ... 560 nA/Per Channel Input Common-Mode Range Exceeds the Rails ... –0.1 V to VCC + 5 V Supply Voltage Range ... 2.5 V to 16 V Reverse Battery Protection Up to 18 V Push-Pull CMOS Output Stage Specified Temperature Range – 0°C to 70°C – Commercial Grade – –40°C to 125°C – Industrial Grade Ultra-Small Packaging – 5-Pin SOT-23 (TLV3701) – 8-Pin MSOP (TLV3702) Universal Op-Amp EVM (Reference SLOU060 for More Information) 2 Applications • • • • • Portable Battery Monitoring Consumer Medical Electronics Security Detection Systems Handheld Instruments Ultra-Low Power Systems The TLV370x has a minimum operating supply voltage of 2.7 V over the extended industrial temperature range (TA = –40°C to 125°C), while having an input common-mode range of –0.1 to VCC + 5 V. The low supply current makes it an ideal choice for battery-powered portable applications where quiescent current is the primary concern. Reverse battery protection guards the amplifier from an overcurrent condition due to improper battery installation. For harsh environments, the inputs can be taken 5 V above the positive supply rail without damage to the device. All members are available in PDIP and SOIC with the singles in the small SOT-23 package, duals in the MSOP, and quads in the TSSOP package. Device Information(1) PART NUMBER TLV3701 TLV3702 TLV3704 PACKAGE BODY SIZE (NOM) SOT-23 (5) 2.90 mm × 1.60 mm SOIC (8) 4.90 mm × 3.91 mm SOIC (8) 4.90 mm × 3.91 mm VSSOP (8) 3.00 mm × 3.00 mm PDIP (8) 9.81 mm × 6.35 mm SOIC (14) 8.65 mm × 3.91 mm PDIP (14) 19.30 mm × 6.35 mm TSSOP (14) 5.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Supply Current vs Supply Voltage 800 High-Side Voltage Sense Circuit TA = 125 °C R1 1 MΩ I CC – Supply Current/Ch – nA 700 TA = 70 °C 600 R3 100 kΩ VCC + TA = 25 °C TLV370X R2 1 MΩ 500 Vref µP TA = 0 °C 400 TA = –40 °C 0 D1 300 200 0 VID = –1 V 100 0 2 4 6 8 10 12 14 16 Copyright © 2016, Texas Instruments Incorporated VCC – Supply Voltage – V 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Tables................................... Pin Configuration and Functions ......................... Specifications......................................................... 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 8 1 1 1 2 3 4 6 Absolute Maximum Ratings ...................................... 6 Recommended Operating Conditions....................... 6 Thermal Information – TLV3701 ............................... 7 Thermal Information – TLV3702 ............................... 7 Thermal Information – TLV3704 ............................... 7 Electrical Characteristics........................................... 8 Switching Characteristics .......................................... 9 Dissipation Ratings ................................................... 9 Typical Characteristics ............................................ 10 Detailed Description ............................................ 13 8.1 Overview ................................................................. 13 8.2 Functional Block Diagram ....................................... 13 8.3 Feature Description................................................. 13 8.4 Device Functional Modes........................................ 13 9 Application and Implementation ........................ 14 9.1 Application Information............................................ 14 9.2 Typical Application ................................................. 14 10 Power Supply Recommendations ..................... 16 11 Layout................................................................... 16 11.1 Layout Guidelines ................................................. 16 11.2 Layout Example .................................................... 16 12 Device and Documentation Support ................. 17 12.1 12.2 12.3 12.4 12.5 12.6 12.7 12.8 Device Support...................................................... Documentation Support ....................................... Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 18 18 18 18 13 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History Changes from Revision C (March 2017) to Revision D • Page Changed Wording of Start-up time table note ....................................................................................................................... 9 Changes from Revision B (August 2001) to Revision C Page • Added Device Information table, Device Comparison table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1 • Changed VOH typical value from 0.08 to 80 to reflect proper units....................................................................................... 8 • Changed Dissapation Ratings Table to reflect new package thermals.................................................................................. 9 • Deleted extraneous "Open Collector Leakage" graph.......................................................................................................... 10 2 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 5 Device Comparison Tables Table 1. Selection of Comparators (1) OUTP UT STAG E tr (μs) RAILTORAIL 22 8 I PP 5 — I OD DEVICE VCC (V) VIO (µV) ICC/Ch (µA) IIB (pA ) tPLH (µs) tPHL (μs) tf (μs) TLV370x 2.5 – 16 250 0.56 80 56 83 TLV340x 2.5 – 16 250 0.47 80 55 30 TLC3702/4 3 – 16 1200 9 5 1.1 0.65 0.5 0.125 — PP TLC393/339 3 – 16 1400 11 5 1.1 0.55 0.22 — — OD TLC372/4 3 – 16 1000 75 5 0.65 0.65 — — — OD (1) All specifications are typical values measured at 5 V. Table 2. TLV3701 Available Options TA 0°C to 70°C –40°C to 125°C (1) (2) PACKAGED DEVICES VIOmax AT 25°C SMALL OUTLINE (D) (1) SOT-23 (DBV) (2) SYMBOL TLV3701CD TLV3701CDBV VBCC — TLV3701ID TLV3701IDBV VBCI TLV3701IP 5000 µV PLASTIC DIP (P) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example, TLV3701CDR). This package is only available taped and reeled. For standard quantities (3000 pieces per reel), add an R suffix (that is, TLV3701 CDBVR). For small quantities (250 pieces per mini-reel), add a T suffix to the part number (for example, TLV3701CDBVT). Table 3. TLV3702 Available Options TA 0°C to 70°C –40°C to 125°C (1) PACKAGED DEVICES VIOmax AT 25°C SMALL OUTLINE (D) (1) MSOP (DGK) SYMBOL TLV3702CD TLV3702CDGK xxTIAKC — TLV3702ID TLV3702IDGK xxTIAKD TLV3702IP 5000 µV PLASTIC DIP (P) This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example, TLV3702CDR). Table 4. TLV3704 Available Options TA 0°C to 70°C –40°C to 125°C (1) VIOmax AT 25°C 5000 µV PACKAGED DEVICES SMALL OUTLINE (D) (1) PLASTIC DIP (N) TSSOP (PW) TLV3704CD — TLV3704CPW TLV3704ID TLV3704IN TLV3704IPW This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (for example, TLV3704CDR). Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 3 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 6 Pin Configuration and Functions TLV3701 DBV Package 5-Pin SOT-23 Top View OUT GND IN+ 1 5 TLV3701 D or P Package 8-Pin SOIC or PDIP Top View VCC 2 3 4 NC 1 8 NC IN- 2 7 VCC IN+ 3 6 OUT GND 4 5 NC IN- TLV3701 Pin Functions PIN NAME I/O DESCRIPTION SOT-23 SOIC, PDIP GND 2 4 — IN– 4 2 I Negative (inverting) input IN+ 3 3 I Positive (noninverting) input NC — 1, 5, 8 — No internal connection (can be left floating) OUT 1 6 O Output VCC 5 7 — Positive power supply Ground TLV3702 D, DGK, or P Package 8-Pin SOIC, VSSOP, or PDIP Top View 1OUT 1 8 VCC 1IN- 2 7 2OUT 1IN+ 3 6 2IN- GND 4 5 2IN+ TLV3702 Pin Functions PIN NAME NO. I/O DESCRIPTION GND 4 — 1IN– 2 I Inverting input, channel 1 2IN– 6 I Inverting input, channel 2 1IN+ 3 I Noninverting input, channel 1 2IN+ 5 I Noninverting input, channel 2 1OUT 1 O Output, channel 1 2OUT 7 O Output, channel 2 VCC 8 — Positive power supply 4 Submit Documentation Feedback Ground Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 TLV3704 D, N, or PW Package 14-Pin SOIC, PDIP, or TSSOP Top View 1OUT 1 14 4OUT 1IN- 2 13 4IN- 1IN+ 3 12 4IN+ VCC 4 11 GND 2IN+ 5 10 3IN+ 2IN- 6 9 3IN- 2OUT 7 8 3OUT TLV3704 Pin Functions PIN NAME NO. I/O DESCRIPTION GND 11 — 1IN– 2 I Ground Inverting input, channel 1 2IN– 6 I Inverting input, channel 2 3IN– 9 I Inverting input, channel 3 4IN– 13 I Inverting input, channel 4 1IN+ 3 I Noninverting input, channel 1 2IN+ 5 I Noninverting input, channel 2 3IN+ 10 I Noninverting input, channel 3 4IN+ 12 I Noninverting input, channel 4 1OUT 1 O Output, channel 1 2OUT 7 O Output, channel 2 3OUT 8 O Output, channel 3 4OUT 14 O Output, channel 4 VCC 4 — Positive power supply Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 5 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Supply voltage, VCC (2) Differential input voltage, VID Input voltage, VI (2) (3) 0 ±20 V V mA ±10 mA See Dissipation Ratings Maximum junction temperature, TJ Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds Storage temperature, Tstg (2) (3) V ±10 Output current, IO (1) UNIT 17 VCC + 5 Input current, II Continuous total power dissipation MAX –65 150 °C 260 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to GND. Input voltage range is limited to 20 V maximum or VCC + 5 V, whichever is smaller. 7.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) Single supply Supply voltage, VCC Split supply MIN MAX C-suffix 2.5 16 I-suffix 2.7 16 C-suffix ±1.25 ±8 I-suffix ±1.35 ±8 –0.1 VCC + 5 Common-mode input voltage, VICR Operating free-air temperature, TA 6 Submit Documentation Feedback C-suffix I-suffix 0 70 –40 125 UNIT V V °C Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 7.3 Thermal Information – TLV3701 TLV3701 THERMAL METRIC (1) DBV (SOT-23) D (SOIC) 5 PINS P (PDIP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 193.6 124.8 82.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 102.4 69.1 84.8 °C/W RθJB Junction-to-board thermal resistance 54.3 67.9 59.7 °C/W ψJT Junction-to-top characterization parameter 16.9 22.3 45.3 °C/W ψJB Junction-to-board characterization parameter 53.6 67.2 59.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information – TLV3702 TLV3702 THERMAL METRIC (1) D (SOIC) DGK (VSSOP) P (PDIP) UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 116.7 163.9 77.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 59.4 65.7 79 °C/W RθJB Junction-to-board thermal resistance 60.2 85.3 54 °C/W ψJT Junction-to-top characterization parameter 14.6 9 39.5 °C/W ψJB Junction-to-board characterization parameter 59.5 83.9 53.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information – TLV3704 TLV3704 THERMAL METRIC (1) D (SOIC) N (PDIP) PW (TSSOP) UNIT 14 PINS RθJA Junction-to-ambient thermal resistance 81.4 58.1 105.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 38.1 50.9 33.9 °C/W RθJB Junction-to-board thermal resistance 37.8 38 49.5 °C/W ψJT Junction-to-top characterization parameter 7.5 23.6 2.5 °C/W ψJB Junction-to-board characterization parameter 37.4 37.7 48.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 7 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 7.6 Electrical Characteristics At specified operating free-air temperature range, VCC = 2.7 V, 5 V, 15 V (unless otherwise noted). PARAMETER TA (1) TEST CONDITIONS MIN TYP MAX 250 5000 UNIT DC PERFORMANCE VIO Input offset voltage VIC = VCC/2, RS = 50 Ω αVIO Offset voltage drift VIC = VCC/2, RS = 50 Ω VIC = 0 to 2.7 V, RS = 50 Ω CMRR Common-mode rejection ratio VIC = 0 to 5 V, RS = 50 Ω VIC = 0 to 15 V, RS = 50 Ω 25°C Full range 25°C 3 25°C 55 Full range 50 25°C 60 Full range 55 25°C 65 Full range 60 Large-signal differential voltage amplification AVD 7000 µV µV/°C 72 76 dB 88 25°C 1000 25°C 20 V/mV INPUT/OUTPUT CHARACTERISTICS IIO Input offset current VIC = VCC/2, RS = 50 Ω IIB Input bias current VIC = VCC/2, RS = 50 Ω ri(d) Differential input resistance Full range VOH 25°C 300 25°C VCC – 80 VCC – 320 Full range VCC – 450 VIC = VCC/2, IOH = 2 μA, VID = – 1 V VIC = VCC/2, IOH = 50 μA, VID = – 1 V 250 1500 25°C VIC = VCC/2, IOH = – 50 μA, VID = 1 V Low-level output voltage 80 25°C High-level output voltage VOL 1000 Full range VIC = VCC/2, IOH = 2 μA, VID = 1 V 100 pA pA MΩ mV 25°C 8 25°C 80 Full range 200 mV 300 POWER SUPPLY ICC Supply current (per channel) 25°C Output state high VCC = 2.7 V to 5 V PSRR Power supply rejection ratio VIC = VCC/2 V, No load VCC = 5 V to 15 V (1) 8 560 Full range 800 1000 25°C 75 Full range 70 25°C 85 Full range 80 nA 100 105 dB Full range is 0°C to 70°C for C suffix and –40°C to 125°C for I suffix. If not specified, full range is –40°C to 125°C. Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 7.7 Switching Characteristics At specified operating free-air temperature range, VCC = 2.7 V, 5 V, 15 V (unless otherwise noted). PARAMETER t(PLH) t(PHL) TEST CONDITIONS f = 10 kHz, VSTEP = 100 mV, CL = 10 pF, VCC = 2.7 V Propagation response time, low-to-high-level output (1) f = 10 kHz, VSTEP = 100 mV, CL = 10 pF, VCC = 2.7 V Propagation response time, high-to-low-level output (1) tr Rise time CL = 10 pF, VCC = 2.7 V tf Fall time CL = 10 pF, VCC = 2.7 V tsu (1) (2) Start-up time (TLV3701 Only) VCC = 2.7 to 15V (2) MIN TYP Overdrive = 2 mV 240 Overdrive = 10 mV 64 Overdrive = 50 mV 36 Overdrive = 2 mV 167 Overdrive = 10 mV 67 Overdrive = 50 mV 37 MAX UNIT µs µs 7 µs 9 µs 25°C 7 15 Full range 14 30 ms The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Propagation responses are longer at higher supply voltages, refer to Figures 12 – 17 for further details. The definition of start-up time is the time period between the supply voltage reaching minimum supply (VCCmin) and the device IQ activating (ICCmin) with a valid device output voltage. Single device only. 7.8 Dissipation Ratings PACKAGE θJC (°C/W) θJA (°C/W) TA ≤ 25°C POWER RATING TA = 125°C POWER RATING D (8) 69.1 124.8 1001 mW 200 mW D (14) 38.1 81.4 1536 mW 307 mW DBV (5) 102.4 193.6 646 mW 129 mW DGK (8) 65.7 163.9 763 mW 153 mW N (14) 50.9 58.1 2151 mW 430 mW P (8) 84.8 82.8 1510 mW 302 mW PW (14) 33.9 105.7 1183 mW 237 mW Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 9 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 7.9 Typical Characteristics At specified operating conditions (unless otherwise noted). Table 5. Table of Graphs FIGURE Input bias/offset current vs Free-air temperature VOL Low-level output voltage vs Low-level output current Figure 6, Figure 8, Figure 4 VOH High-level output voltage vs High-level output current Figure 3, Figure 5, Figure 7 ICC vs Supply voltage Supply current Output fall time/rise time Free-air temperature Figure 9 vs Supply voltage Figure 10 Figure 11, Figure 13, Figure 15 High-to-low level output response for various input overdrives Figure 12, Figure 14, Figure 16 1200 IIB / IIO – Input Bias/Offset Current – pA TA = 125 °C TA = 70 °C 600 TA = 25 °C 500 TA = 0 °C 400 TA = –40 °C 300 200 VID = –1 V 0 2 4 6 8 10 12 14 16 VCC – Supply Voltage – V Figure 1. Supply Current vs Supply Voltage 2.7 800 400 200 IIO 0 –200 –40 –25 –10 5 20 35 50 65 80 95 110 125 TA – Free-Air Temperature – °C Figure 2. Input Bias/Offset Current vs Free-Air Temperature 2.7 TA = –40 °C TA = 0 °C 1.8 1.5 TA = 25 °C 1.2 0.9 TA = 70 °C 0.6 0.3 TA = 125 °C 0.0 VCC = 2.7 V VID = –1 V 2.4 – 2.1 IIB 600 VCC = 2.7 V VID = –1 V 2.4 VOH – High-Level Output Voltage – V VCC = 15 V 1000 VOL – Low-Level Output Voltage V I CC – Supply Current/Ch – nA 700 TA = 125 °C 2.1 TA = 70 °C 1.8 TA = 25 °C 1.5 1.2 TA = 0 °C 0.9 0.6 TA = –40 °C 0.3 0.0 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 I OH – High-Level Output Current – mA Figure 3. High-Level Output Voltage vs High-Level Output Current 10 Figure 1 Low-to-high level output response for various input overdrives 800 100 Figure 2 Submit Documentation Feedback 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 IOL – Low-Level Output Current – mA Figure 4. Low-Level Output Voltage vs Low-Level Output Current Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 5 5 VCC = 5 V VID = –1 V 4 TA = –40 °C 3.5 TA = 0 °C 3 TA = 25 °C 2.5 2 TA = 70 °C 1.5 1 TA = 125 °C 0.5 VCC = 5 V VID = –1 V 4.5 VOL– Low-Level Output Voltage – V VOH – High-Level Output Voltage - V 4.5 4 TA = 125 °C 3.5 TA = 70 °C 3 2.5 2 TA = 25 °C 1.5 TA = 0 °C 1 TA = –40 °C 0.5 0 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 IOH – High-Level Output Current – mA Figure 5. High-Level Output Voltage vs High-Level Output Current 12 VOL – Low-Level Output Voltage - V VOH – High-Level Output Voltage – V 1.6 2.0 2.4 2.8 TA = –40 °C 10.5 9 TA = 25 °C 7.5 6 TA = 70 °C 4.5 3 TA = 125 °C VCC = 15 V VID = –1 V 1.5 0 1 2 3 4 5 6 7 VCC = 15 V VID = –1 V 13.5 8 12 TA = 70 °C 9 TA = 25 °C 7.5 6 4.5 TA = 0 °C 3 TA = –40 °C 1.5 0 9 TA = 125 °C 10.5 0 I OH – High-Level Output Current – mA Figure 7. High-Level Output Voltage vs High-Level Output Current 1 2 3 4 5 6 7 8 9 IOL – Low-Level Output Current – mA Figure 8. Low-Level Output Voltage vs Low-Level Output Current 120 700 µs VCC = 2.7 V, 5 V, 15 V VID = –1 V t r(f) – Output Rise/Fall Time – I CC – Supply Current /Ch –nA 1.2 15 TA = 0 °C 13.5 600 0.8 Figure 6. Low-Level Output Voltage vs Low-Level Output Current 15 0 0.4 IOL – Low-Level Output Current – mA 500 400 300 200 100 VID = 1 V to –1 V Input Rise/Fall Time = 4 µs CL = 10 pF TA = 25 °C 100 80 60 Fall Time 40 20 Rise Time 0 –40–25–10 5 0 20 35 50 65 80 95 110 125 0 2.5 TA – Free-Air Temperature – °C Figure 9. Supply Current vs Free-Air Temperature 5 7.5 10 12.5 VCC – Supply Voltage – V 15 Figure 10. Output Rise/Fall Time vs Supply Voltage Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 11 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com VO – Output Voltage – V VO – Output Voltage – V 6 3 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 50 mV 2 mV 10 mV 5 4 50 mV 3 2 mV 10 mV 2 1 0 VCC = 2.7 V CL = 10 pF TA = 25 °C –0.15 0 50 75 100 125 150 175 200 225 250 275 300 25 –0.15 t – Time – µs VO – Output Voltage – V Figure 12. High-to-Low Level Output Response for Various Input Overdrives 2 mV 10 mV 4 2 0 VCC = 15 V CL = 10 pF TA = 25 °C 3 2.7 2.4 2.1 1.8 1.5 1.2 0.9 0.6 0.3 0 –0.3 50 mV 2 mV 10 mV 0.15 0.04 0 –0.04 –0.08 –0.12 VID – Differential Input Voltage – V VO – Output Voltage – V 50 mV 0 VCC = 2.7 V CL = 10 pF TA = 25 °C 25 50 75 100 125 150 175 200 225 250 275 300 t – Time – µs Figure 14. High-to-Low Level Output Response for Various Input Overdrives Figure 13. Low-to-High Level Output Response for Various Input Overdrives VO – Output Voltage – V 5 50 mV 10 mV 2 mV 1 0 VCC = 5 V CL = 10 pF TA = 25 °C 0.10 0.05 0 0 25 50 –0.05 75 100 125 150 175 200 225 250 275 300 VID – Differential Input Voltage – V VO – Output Voltage – V 6 2 16 14 12 10 8 6 4 2 0 50 mV 10 mV 2 mV 0.12 0.08 0.04 0 –0.04 100 150 200 250 300 350 400 VCC = 15 V CL = 10 pF TA = 25 °C 0 50 t – Time – µs t – Time – µs Figure 15. Low-to-High Level Output Response for Various Input Overdrives 12 0.05 –0.05 0 t – Time – µs 3 0.10 0 25 50 75 100 125 150 175 200 225 250 275 300 4 –0.10 50 75 100 125 150 175 200 225 250 275 300 t – Time – µs Figure 11. Low-to-High Output Response for Various Input Overdrives 16 14 12 10 8 6 –0.05 VID – Differential Input Voltage – V 25 –0.10 0 VCC = 5 V CL = 10 pF TA = 25 °C Submit Documentation Feedback VID – Differential Input Voltage – V 0 –0.05 0.05 VID – Differential Input Voltage – V 0 VID – Differential Input Voltage – V 0.05 Figure 16. High-to-Low Level Output Response for Various Input Overdrives Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 8 Detailed Description 8.1 Overview The TLV370x is a family of nanopower comparators drawing only 560 nA per channel supply current. Having a minimum operating supply voltage of 2.7 V over the extended industrial temperature range (TA = –40°C to +125°C), while having an input common-mode range of –0.1 to VCC + 5 V makes this device ideal for batterypowered and wireless handset applications. 8.2 Functional Block Diagram VCC IN+ OUT IN± GND Copyright © 2016, Texas Instruments Incorporated 8.3 Feature Description 8.3.1 Operating Voltage The TLV340x comparators are specified for use on a single supply from 2.5 V to 16 V (or a dual supply from ±1.25 V to ±16 V) over a temperature range of −40°C to +125°C. 8.3.2 Setting the Threshold Using a low-power, stable reference is important when setting the transition point for the TLV340x devices. The REF3312, as shown in Figure 17, provides a 1.25-V reference voltage with low drift and only 3.9 µA of quiescent current. VS Input voltage IN+ VCC Output voltage OUT VS REF3312 IN± GND 1.25 V threshold voltage Copyright © 2016, Texas Instruments Incorporated Figure 17. Setting the Threshold 8.4 Device Functional Modes The TLV370x has a single functional mode and is operational when the power supply voltage applied ranges from 2.5 V (±1.25 V) to 16 V (±8 V). Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 13 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information Many applications require the detection of a signal (voltage or current) that exceeds a particular threshold voltage or current. Using a comparator to make that threshold detection is the easiest, lowest power and highest speed way to make a threshold detection. 9.2 Typical Application 5V Input voltage IN+ VCC Output voltage OUT 5V REF3312 IN± GND 1.25 V threshold voltage Copyright © 2016, Texas Instruments Incorporated Figure 18. 1.25-V Threshold Detector 9.2.1 Design Requirements • Detect when a signal is above or below 1.25 V • Operate from a single 5-V power supply • Rail-to-rail input voltage range from 0 to 5 V • Rail-to-rail output voltage range from 0 to 5 V 9.2.2 Detailed Design Procedure The input voltage range in the circuit illustrated in Figure 18 is limited only by the power supply applied to the TV3701. In this example with the selection of a 5-V, single-supply power supply, the input voltage range is limited to 0 to VS + 5 V, or 0 to 10 V. The threshold voltage of 1.25 V can de derived in a variety of ways. As the TLV3701 is a very low-power device, it is desirable to also use very low power to create the threshold voltage. The REF3312 series voltage reference is selected for its stable output voltage of 1.25 V and its low power consumption of only 3.9 µA. The TLV3701 is an push-pull output comparator, and does not require a pullup resistor to save power. 14 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 Typical Application (continued) 9.2.3 Application Curve 6 Output Voltage (V) 5 4 3 2 1 0 0 1 2 3 Voltage at IN pin (V) 4 5 Figure 19. Transfer Function for the Threshold Detector Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 15 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 10 Power Supply Recommendations The TLV340x device is specified for operation from 2.5 V to 16 V (±1.25 to ±8 V); many specifications apply from –40°C to +125°C. Parameters that can exhibit significant variance with regard to operating voltage or temperature are presented in Typical Characteristics. 11 Layout 11.1 Layout Guidelines Figure 20 shows the typical connections for the TLV340x. To minimize supply noise, power supplies must be capacitively decoupled by a 0.01-µF ceramic capacitor in parallel with a 10-µF electrolytic capacitor. Comparators are very sensitive to input noise. Proper grounding (the use of a ground plane) helps to maintain the specified performance of the TLV340x family. For best results, maintain the following layout guidelines: 1. Use a printed-circuit board (PCB) with a good, unbroken low-inductance ground plane. 2. Place a decoupling capacitor (0.1-µF ceramic, surface-mount capacitor) as close as possible to VCC. 3. On the inputs and the output, keep lead lengths as short as possible to avoid unwanted parasitic feedback around the comparator. Keep inputs away from the output. 4. Solder the device directly to the PCB rather than using a socket. 5. For slow-moving input signals, take care to prevent parasitic feedback. A small capacitor (1000 pF or less) placed between the inputs can help eliminate oscillations in the transition region. This capacitor causes some degradation to propagation delay when the impedance is low. The top-side ground plane runs between the output and inputs. 6. The ground pin ground trace runs under the device up to the bypass capacitor, shielding the inputs from the outputs. 11.2 Layout Example Power supply 0.01 µF 10 F V+ +IN OUT ± IN OUT Power supply 1 5 0.01 µF 10 F 2 ± + 3 4 Not to scale +IN ±IN Copyright © 2016, Texas Instruments Incorporated Figure 20. TLV3701 SOT-23 Layout Example 16 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 TLV3701, TLV3702, TLV3704 www.ti.com SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 DIP Adapter EVM The DIP Adapter EVM tool provides an easy, low-cost way to prototype small surface mount ICs. The evaluation tool these TI packages: D or U (8-pin SOIC), PW (8-pin TSSOP), DGK (8-pin MSOP), DBV (6-pin SOT-23, 5-pin SOT23, and 3-pin SOT-23), DCK (6-pin SC-70 and 5-pin SC-70), and DRL (6-pin SOT-563). The DIP Adapter EVM may also be used with terminal strips or may be wired directly to existing circuits. 12.1.1.2 Universal Op Amp EVM The Universal Op Amp EVM is a series of general-purpose, blank circuit boards that simplify prototyping circuits for a variety of IC package types. The evaluation module board design allows many different circuits to be constructed easily and quickly. Five models are offered, with each model intended for a specific package type. PDIP, SOIC, MSOP, TSSOP, and SOT-23 packages are all supported. NOTE These boards are unpopulated, so users must provide their own ICs. TI recommends requesting several op amp device samples when ordering the Universal Op Amp EVM. 12.2 Documentation Support 12.2.1 Related Documentation The following documents are relevant for using the TLV340x devices and are recommended for reference. All are available for download at www.ti.com (unless otherwise noted): • Universal Op Amp EVM User Guide (SLOU060) • Hardware Pace Using Slope Detection (SLAU511) • Bipolar High-voltage Differential Interface for Low-Voltage Comparators (TIDU039) • AC-Coupled Single Supply Comparator (SLAU505) • ECG Implementation on the TMS320VC5505 DSP Medical Development Kit (SPRAB36) • REF33xx 3.9-μA, SC70-3, SOT-23-3, and UQFN-8, 30-ppm/°C Drift Voltage Reference (SBOS392) 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 6. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TLV3701 Click here Click here Click here Click here Click here TLV3702 Click here Click here Click here Click here Click here TLV3704 Click here Click here Click here Click here Click here 12.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 Submit Documentation Feedback 17 TLV3701, TLV3702, TLV3704 SLCS137D – NOVEMBER 2000 – REVISED MAY 2017 www.ti.com 12.5 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.6 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.7 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.8 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright © 2000–2017, Texas Instruments Incorporated Product Folder Links: TLV3701 TLV3702 TLV3704 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TLV3701CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3701C Samples TLV3701CDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 VBCC Samples TLV3701CDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 VBCC Samples TLV3701CDBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 VBCC Samples TLV3701ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3701I Samples TLV3701IDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 VBCI Samples TLV3701IDBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 VBCI Samples TLV3701IDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 VBCI Samples TLV3701IDBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 VBCI Samples TLV3701IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3701I Samples TLV3701IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 TLV3701I Samples TLV3702CD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3702C Samples TLV3702CDGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 AKC Samples TLV3702CDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 AKC Samples TLV3702ID ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3702I Samples TLV3702IDGK ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AKD Samples TLV3702IDGKG4 ACTIVE VSSOP DGK 8 80 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AKD Samples TLV3702IDGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AKD Samples TLV3702IDGKRG4 ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 AKD Samples TLV3702IDR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3702I Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2022 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TLV3702IP ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 TLV3702I Samples TLV3704CD ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3704C Samples TLV3704CPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 3704C Samples TLV3704ID ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3704I Samples TLV3704IDR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3704I Samples TLV3704IN ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 125 TLV3704I Samples TLV3704IPW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3704I Samples TLV3704IPWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 3704I Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
TLV3702CDGKR
物料型号: - TLV3701: 5引脚SOT-23封装,8引脚SOIC和PDIP封装 - TLV3702: 8引脚SOIC、VSSOP和PDIP封装 - TLV3704: 14引脚SOIC、PDIP和TSSOP封装

器件简介: TLV370x系列是德州仪器推出的超低功耗比较器,每个通道的供电电流仅为560纳安,非常适合电池供电和无线手持设备应用。这些比较器在扩展的工业温度范围内(-40°C至125°C)具有2.7V的最低工作电源电压,同时输入共模范围为-0.1V至VCC+5V。

引脚分配: - TLV3701: 5引脚SOT-23封装的引脚包括VCC、OUT、GND、IN+、IN- - TLV3702: 8引脚SOIC封装的引脚包括VCC、2OUT、2IN+、2IN-、1OUT、1IN+、GND、1IN- - TLV3704: 14引脚SOIC封装的引脚包括VCC、4OUT、3OUT、2OUT、1OUT、4IN+、3IN+、2IN+、1IN+、GND、4IN-、3IN-、2IN-、1IN-

参数特性: - 供电电流:每通道560纳安 - 供电电压范围:2.5V至16V - 工作温度范围:商业级0°C至70°C,工业级-40°C至125°C - 输入共模范围:-0.1V至VCC+5V - 输出阶段:推挽CMOS输出阶段

功能详解: TLV370x系列比较器具有超低功耗的特性,适用于电池供电的便携式应用。它们还具有反向电池保护功能,可以在电池安装不当导致过流情况下保护放大器。此外,这些比较器能够在恶劣环境下工作,输入可以超过正电源轨5V而不会损坏设备。

应用信息: - 便携式电池监测 - 消费类医疗电子 - 安全检测系统 - 手持仪器 - 超低功耗系统

封装信息: TLV370x系列比较器提供多种封装选项,包括SOT-23、SOIC、VSSOP、PDIP和TSSOP,以满足不同应用的需求。
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