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TLV61220
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
TLV61220 Low-Input Voltage Step-Up Converter in Thin SOT-23 Package
1 Features
3 Description
•
The TLV61220 device provides a power-supply
solution for products powered by either a single-cell,
two-cell, or three-cell alkaline, NiCd or NiMH, or onecell Li-Ion or Li-polymer battery. Possible output
currents depend on the input-to-output voltage ratio.
The boost converter is based on a hysteretic
controller topology using synchronous rectification to
obtain maximum efficiency at minimal quiescent
currents. The output voltage of the adjustable version
can be programmed by an external resistor divider, or
is set internally to a fixed output voltage. The
converter can be switched off by a featured enable
pin. While being switched off, battery drain is
minimized. The device is packaged in a 6-pin thin
SOT-23 package (DBV).
1
•
•
•
•
•
•
•
•
Up to 95% Efficiency at Typical Operating
Conditions
5.5-μA Quiescent Current
Startup Into Load at 0.7-V Input Voltage
Operating Input Voltage from 0.7 V to 5.5 V
Pass-Through Function during Shutdown
Minimum Switching Current 200 mA
Protections:
– Output Overvoltage
– Overtemperature
– Input Undervoltage Lockout
Adjustable Output Voltage from 1.8 V to 5.5 V
Small 6-pin Thin SOT-23 Package
spacer
Device Information(1)
2 Applications
•
•
•
•
•
•
PART NUMBER
Battery Powered Applications
– 1 to 3 Cell Alkaline, NiCd or NiMH
– 1 Cell Li-Ion or Li-Primary
Solar or Fuel Cell Powered Applications
Consumer and Portable Medical Products
Personal Care Products
White or Status LEDs
Smartphones
TLV61220
PACKAGE
SOT (6)
BODY SIZE (NOM)
2.90 mm x 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Typical Application Schematic
L1 4.7:H
TLV61220
SW
VOUT
VOUT
1.8V to 5.5V
R1
VBAT
VIN
0.7V to VOUT
C1
10:F
EN
C2
FB
R2
10:F
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV61220
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Typical Application Schematic.............................
Revision History.....................................................
Device Options.......................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
3
4
8.1
8.2
8.3
8.4
8.5
8.6
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
9 Parameter Measurement Information .................. 9
10 Detailed Description ........................................... 10
10.1 Overview ............................................................... 10
10.2 Functional Block Diagram ..................................... 10
10.3 Feature Description............................................... 10
10.4 Device Functional Modes...................................... 11
11 Application and Implementation........................ 12
11.1 Application Information.......................................... 12
11.2 Typical Application ............................................... 12
12 Power Supply Recommendations ..................... 16
13 Layout................................................................... 16
13.1 Layout Guidelines ................................................. 16
13.2 Layout Example .................................................... 16
13.3 Thermal Considerations ........................................ 16
14 Device and Documentation Support ................. 17
14.1
14.2
14.3
14.4
14.5
Device Support......................................................
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
15 Mechanical, Packaging, and Orderable
Information ........................................................... 17
5 Revision History
Changes from Original (May 2012) to Revision A
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
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6 Device Options
TA
OUTPUT VOLTAGE
DC/DC
PACKAGE
PART NUMBER
–40°C to 85°C
Adjustable
6-Pin SOT-23
TLV61220DBV
7 Pin Configuration and Functions
DBV Package
6 Pins
Top View
VBAT VOUT
6
FB
5
4
ABC
1
2
3
SW
GND
EN
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
EN
3
I
Enable input (VBAT enabled, GND disabled)
FB
4
I
Voltage feedback for programming the output voltage
GND
2
—
SW
1
I
Boost and rectifying switch input
VBAT
6
I
Supply voltage
VOUT
5
O
Boost converter output
IC ground connection for logic and power
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TLV61220
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
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8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN
Input voltage on VBAT, SW, VOUT, EN, FB
–0.3
7.5
V
TJ
Operating junction temperature
–40
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
MIN
VIN
Supply voltage at VIN
0.7
TA
Operating free air temperature range
TJ
Operating virtual junction temperature range
NOM
MAX
UNIT
5.5
V
–40
85
°C
–40
125
°C
8.4 Thermal Information
TLV61220
THERMAL METRIC (1)
DBV
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
185.7
RθJC(top)
Junction-to-case (top) thermal resistance
124.3
RθJB
Junction-to-board thermal resistance
31.3
ψJT
Junction-to-top characterization parameter
22.9
ψJB
Junction-to-board characterization parameter
30.8
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
(1)
4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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8.5 Electrical Characteristics
over recommended free-air temperature range and over recommended input voltage range (typical at an ambient temperature
range of 25°C) (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC/DC STAGE
VIN
Input voltage range
VIN
Minimum input voltage at startup
RLoad ≥ 150 Ω
VOUT
TLV61220 output voltage range
VIN < VOUT
VFB
TLV61220 feedback voltage
ILH
Inductor current ripple
ISW
switch current limit
1.8
483
500
V
0.7
V
5.5
V
513
mV
200
mA
VOUT = 3.3 V, VIN = 1.2 V, TA = 25 °C
220
400
mA
VOUT = 3.3 V, TA = -40°C to 85 °C
180
400
mA
VOUT = 3.3 V, TA = 0°C to 85 °C
200
400
mA
mΩ
VOUT = 5 V
700
mΩ
VOUT = 3.3 V
600
mΩ
VOUT = 5 V
550
mΩ
Line regulation
VIN < VOUT
0.5%
Load regulation
VIN < VOUT
0.5%
Main switch on resistance, LSD
IQ
Quiescent
current
ISD
Shutdown
current
VIN
VOUT
VIN
VOUT = 3.3 V
IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 3.3 V
VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN
0.5
0.9
μA
5
7.5
μA
0.2
0.5
μA
Leakage current into VOUT
VEN = 0 V, VIN = 1.2 V, VOUT = 3.3 V
Leakage current into SW
VEN = 0 V, VIN = 1.2 V, VSW = 1.2 V, VOUT ≥ VIN
0.01
IFB
TLV61220 Feedback input
current
VFB = 0.5 V
0.01
IEN
EN input current
Clamped on GND or VIN (VIN < 1.5 V)
ILKG
5.5
1000
Rectifying switch on resistance,
HSD
RDS(on)
0.7
μA
1
0.005
0.2
μA
μA
0.1
μA
0.2 ×
VIN
V
CONTROL STAGE
VIL
EN input low voltage
VIN ≤ 1.5 V
VIH
EN input high voltage
VIN ≤ 1.5 V
VIL
EN input low voltage
5 V > VIN > 1.5 V
VIH
EN input high voltage
5 V > VIN > 1.5 V
VUVLO
Undervoltage lockout threshold
for turn off
VIN decreasing
Overvoltage protection threshold
0.8 ×
VIN
V
0.4
1.2
V
V
0.5
5.5
0.7
7.5
V
V
Overtemperature protection
140
°C
Overtemperature hysteresis
20
°C
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8.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
Output Current
Efficiency
Efficiency
Figure 1
Input Voltage, ISW = 400 mA, Minimum ISW = 200 mA, VO = 3.3V
Figure 2
Input Voltage, ISW = 380 mA, Minimum ISW = 200 mA, VO = 5V
Figure 3
vs Output Current, VO = 1.8 V, VI = [0.7 V; 1.2 V; 1.5 V]
Figure 4
vs Output Current, VO = 3.3 V, VI = [0.7 V; 1.2 V; 2.4V; 3V]
Figure 5
vs Output Current, VO = 5 V, VI = [0.7 V; 1.2 V; 3.6V; 4.2V]
Figure 6
vs Input Voltage, VO = 1.8 V, IO = [100µA; 1mA ; 10mA; 50mA]
Figure 7
vs Input Voltage, VO = 3.3 V, IO = [100µA; 1mA ; 10mA; 50mA]
Figure 8
vs Input Voltage, VO = 5 V, IO = [100µA; 1mA ; 10mA; 50mA]
Figure 9
vs Output Current, VO = 1.8 V, VI = [0.7 V; 1.2 V]
Figure 10
vs Output Current, VO = 3.3 V, VI = [0.7 V; 1.2 V; 2.4 V]
Figure 11
0.16
0.27
0.14
0.24
Output Current - A
Output Current - A
Output Voltage
Input Voltage, ISW = 330 mA, Minimum ISW= 200 mA, VO = 1.8V
0.12
0.1
ISW=330mA
0.08
0.06
0.21
0.18
0.15
ISW=400mA
0.12
0.09
0.04
0.06
Minimum ISW
0.02
Minimum ISW
0.03
0
0.9
1.0
1.1
1.2
1.3
0
0.7
1.4
1.2
1.7
2.2
2.7
3
Input Voltage - V
Input Voltage - V
VO = 3.3 V
VO = 1.8 V
Figure 1. Maximum Output Current vs Input Voltage
Figure 2. Maximum Output Current vs Input Voltage
0.27
100
0.24
90
Vo=1.8V
80
70
0.18
Efficiency- %
Output Current - A
0.21
0.15
0.12
ISW=380mA
0.09
60
50
VI=1.2V
VI=1.5V
VI=0.7V
40
30
0.06
20
0.03
10
Minimum ISW
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.01
Input Voltage - V
0.1
1
10
Output Current - mA
100
G000
VO = 5 V
Figure 3. Maximum Output Current vs Input Voltage
6
Figure 4. Efficiency vs Output Current and Input Voltage
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100
100
Vo=5V
Vo=3.3V
90
90
80
80
70
VI=3V
VI=2.4V
60
Efficiency - %
Efficiency- %
70
VI=0.7V
50
VI=1.2V
40
60
VI=3.6V
=0.7V
30
20
20
10
10
0.1
1
10
0
0.01
100
Output Current - mA
0.1
1
10
100
Output Current - mA
G000
Figure 5. Efficiency vs Output Current and Input Voltage
VI=1.2V
=0.7V
VI=0.7V
40
30
0
0.01
VI=4.2V
=0.7V
50
G000
Figure 6. Efficiency vs Input Voltage and Output Current
100
100
Vo=1.8V
90
Io=10mA
Vo=3.3V
90
Io=10mA
80
80
Io=1mA
70
Io=1mA
Efficiency - %
Efficiency - %
70
Io=50mA
60
50
Io=100:A
40
Io=50mA
60
50
30
30
20
20
10
10
0
0.7
0.9
1.1
1.3
1.5
1.7
Io=100:A
40
0
0.7
1.9
1.2
1.7
2.2
2.7
3.2
3.7
Input Voltage - V
Input Voltage - V
Figure 7. Efficiency vs Input Voltage and Output Current
Figure 8. Efficiency vs Input Voltage and Output Current
100
1.9
Vo=5V
Io=1mA
VoI=0.7V
=1.8V
90
80
Io=1mA
1.9
Output Voltage - V
Efficiency - %
70
Io=100:A
60
Io=50mA
50
40
30
VI=1.2V
=0.7V
1.8
VI=0.7V
1.8
20
10
0
0.7
1.7
2.7
3.7
4.7
5.7
1.7
0.01
Input Voltage - V
0.1
1
10
100
Output Current - mA
Figure 9. Efficiency vs Input Voltage and Output Current
Figure 10. Output Voltage vs Output Current and Input
Voltage
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3.5
Vo=3.3V
Output Voltage - V
3.4
VI=2.4V
3.3
VI=1.2V
3.2
VI=0.7V
3.1
0.01
0.1
1
10
100
Output Current - mA
Figure 11. Output Voltage vs Output Current and Input Voltage
8
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9 Parameter Measurement Information
L1 4.7:H
TLV61220
SW
VOUT
VOUT
1.8V to 5.5V
R1
VBAT
VIN
0.7V to VOUT
C1
10:F
EN
C2
FB
R2
10:F
GND
Figure 12. Parameter Measurement Schematic
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10 Detailed Description
10.1 Overview
The TLV61220 is a high performance, highly efficient boost converter. To achieve high efficiency the power stage
is realized as a synchronous boost topology. For the power switching two actively controlled low RDS(on) power
MOSFETs are implemented.
10.2 Functional Block Diagram
SW
VOUT
VOUT
VIN
Gate
Driver
VBAT
Start Up
EN
Device
Control
Current
Sensor
FB
GND
VREF
10.3 Feature Description
10.3.1
Controller Circuit
The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by
keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor
current depending on the output load. In case the required average input current is lower than the average
inductor current defined by this constant ripple the inductor current gets discontinuous to keep the efficiency high
at low load conditions.
IL
Continuous Current Operation
Discontinuous Current Operation
200 mA
(typ.)
200 mA
(typ.)
t
Figure 13. Hysteretic Current Operation
The output voltage VOUT is monitored via the feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly. An external resistor divider needs to
be connected.
The self oscillating hysteretic current mode architecture is inherently stable and allows fast response to load
variations. It also allows using inductors and capacitors over a wide value range.
10
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Feature Description (continued)
10.3.1.1 Startup
After the EN pin is tied high, the device starts to operate. In case the input voltage is not high enough to supply
the control circuit properly a startup oscillator starts to operate the switches. During this phase the switching
frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has
built up the output voltage to about 1.8 V, high enough for supplying the control circuit, the device switches to its
normal hysteretic current mode operation. The startup time depends on input voltage and load current.
10.3.1.2 Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main
switch is turned off to stop further increase of the input current.
In this case the output voltage will decrease since the device can not provide sufficient power to maintain the set
output voltage.
If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased
and current starts flow through it. This diode cannot be turned off, so the current finally is only limited by the
remaining DC resistances. As soon as the overload condition is removed, the converter resumes providing the
set output voltage.
10.3.1.3 Undervoltage Lockout
An implemented undervoltage lockout function stops the operation of the converter if the input voltage drops
below the typical undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning
of the converter.
10.3.1.4 Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore an overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the
TLV61220 output voltage is also monitored internally. In case it reaches the internally programmed threshold of
6.5 V typically the voltage amplifier regulates the output voltage to this value.
If the TLV61220 is used to drive LEDs, this feature protects the circuit if the LED fails.
10.3.1.5 Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the
temperature exceeds the programmed threshold (see electrical characteristics table), the device stops operating.
As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To
prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented.
10.4 Device Functional Modes
10.4.1 Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops
switching and all internal control circuitry is turned off. In this case the input voltage is connected to the output
through the back-gate diode of the rectifying MOSFET. This means that there always will be voltage at the output
which can be as high as the input voltage or lower depending on the load.
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11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Application Information
The TLV61220 is intended for systems powered by a single cell battery to up to three Alkaline, NiCd or NiMH
cells with a typical terminal voltage between 0.7 V and 5.5 V. It can also be used in systems powered by one-cell
Li-Ion or Li-Polymer batteries with a typical voltage between 2.5 V and 4.2 V. Additionally, any other voltage
source with a typical output voltage between 0.7 V and 5.5 V can be used with the TLV61220.
11.2 Typical Application
L1 4.7:H
TLV61220
SW
VOUT
VOUT
3.3V/20mA
R1
VBAT
VIN
1V to 3V
FB
EN
C1
10:F
1MS
C2
R2
10:F
180kS
GND
Figure 14. Typical Application Circuit for Adjustable Output Voltage Option
11.2.1 Design Requirements
In this example, TLV61220 is used to design a 3.3-V power supply with up to 50-mA output current capability.
The TLV61220 can be powered by a single-cell battery to up to three Alkaline, NiCd or NiMH cells with a typical
terminal voltage between 0.7 V and 5.5 V. It can also be used in systems powered by one-cell Li-Ion or LiPolymer batteries with a typical voltage between 2.5 V and 4.2 V. In this example, the input voltage range is from
2 V to 3 V for one-cell coin cell battery input design.
Table 2. TLV61220 3.3 V Output Design Requirements
PARAMETERS
VALUES
Input Voltage
2 V to 3 V
Output Voltage
3.3 V
Output Current
50 mA
11.2.2 Detailed Design Procedure
Table 3. List of Components
COMPONENT
REFERENCE
PART NUMBER
MANUFACTURER
VALUE
C1
GRM188R60J106ME84D
Murata
10 μF, 6.3V. X5R Ceramic
C2
GRM188R60J106ME84D
Murata
10 μF, 6.3V. X5R Ceramic
L1
1269AS-H-4ZR7N
Toko
4.7 μH
R1= 1MΩ, R2= Values depending on the programmed
output voltage
R1, R2
12
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11.2.2.1 Adjustable Output Voltage Version
An external resistor divider is used to adjust the output voltage. The resistor divider needs to be connected
between VOUT, FB and GND as shown in Figure 14. When the output voltage is regulated properly, the typical
voltage value at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V. The
current through the resistive divider should be about 100 times greater than the current into the FB pin. The
typical current into the FB pin is 0.01 μA, and the voltage across the resistor between FB and GND, R2, is
typically 500 mV. Based on those two values, the recommended value for R2 should be lower than 500 kΩ, in
order to set the divider current to 1 μA or higher. The value of the resistor connected between VOUT and FB, R1,
depending on the needed output voltage (VOUT), can be calculated using Equation 1:
æV
ö
R1 = R 2 x ç OUT - 1÷
V
è FB
ø
(1)
As an example, if an output voltage of 3.3 V is needed, a 1-MΩ resistor is calculated for R1 when for R2 a 180-kΩ
has been selected.
11.2.2.2 Inductor Selection
To make sure that the TLV61220 can operate, a suitable inductor must be connected between pin VBAT and pin
SW. Inductor values of 4.7 μH show good performance over the whole input and output voltage range .
Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 2.
L=
V ´ (VOUT - VIN )
1
´ IN
f ´ 200 mA
VOUT
(2)
Choosing inductor values higher than 4.7 μH can improve efficiency due to reduced switching frequency and,
therefore, with reduced switching losses. Using inductor values below 2.2 μH is not recommended.
Having selected an inductance value, the peak current for the inductor in steady state operation can be
calculated. Equation 3 gives the peak current estimate.
IL,MAX
ì VOUT ´ IOUT
+ 100 mA; continous current operation
ï
= í 0.8 ´ VIN
ï200 mA;
discontinuous current operation
î
(3)
For selecting the inductor this would be the suitable value for the current rating. It also needs to be taken into
account that load transients and error conditions may cause higher inductor currents.
Equation 4 helps to estimate whether the device will work in continuous or discontinuous operation depending on
the operating points. As long as the inequation is true, continuous operation is typically established. If the
inequation becomes false, discontinous operation is typically established.
VOUT ´ IOUT
> 0.8 ´ 100 mA
VIN
(4)
The following inductor series from different suppliers have been used with TLV61220 converters:
Table 4. List of Inductors
VENDOR
INDUCTOR SERIES
Toko
DFE252010C
Coilcraft
EPL3015
EPL2010
Murata
LQH3NP
Taiyo Yuden
NR3015
Wurth Elektronik
WE-TPC Typ S
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Product Folder Links: TLV61220
13
TLV61220
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
www.ti.com
11.2.2.3 Capacitor Selection
11.2.2.3.1
Input Capacitor
At least a 10-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VBAT and GND pins of
the IC is recommended.
11.2.2.3.2
Output Capacitor
For the output capacitor C2 , it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the IC, the use of a small ceramic capacitor with an capacitance value of around
2.2μF in parallel to the large one is recommended. This small capacitor should be placed as close as possible to
the VOUT and GND pins of the IC.
A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. If the inductor value exceeds
4.7 μH, the value of the output capacitance value needs to be half the inductance value or higher for stability
reasons, see Equation 5.
C2 ³
L
´
2
(5)
The TLV61220 is not sensitive to the ESR in terms of stability. Using low ESR capacitors, such as ceramic
capacitors, is recommended anyway to minimize output voltage ripple. If heavy load changes are expected, the
output capacitor value should be increased to avoid output voltage drops during fast load transients.
11.2.3 Application Curves
FIGURE
Load transient, VI = 1.2 V, VO = 3.3 V, IO = 5mA to 20 mA
Figure 15
Line transient, VI = 1.8 V to 2.4V, VO = 3.3 V, IO = 30 mA
Figure 16
Startup after Enable, VI = 1.2 V, VO = 3.3 V, RLOAD = 50 Ω
Figure 17
spacing
Input Voltage
500mV/div, DC
Output Voltage
20mV/div, AC
Output Voltage
100mV/div, AC
Output Current
10mA/div, DC
VIN = 1.2V, VOUT=3.3V, IOUT= 5mA to 20mA
Figure 15. Load Transient Response
14
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VIN = 1.8V to 2.4V, VOUT=3.3V, IOUT= 30mA
Figure 16. Line Transient Response
Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: TLV61220
TLV61220
www.ti.com
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
Enable Voltage
2V/div, DC
Output Voltage
1V/div, DC
Load Current
20mA/div, DC
Inductor Current
200mA/div, DC
VIN = 1.2V, VOUT=3.3V, RLOAD= 50S
Figure 17. Start Up After Enable
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15
TLV61220
SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
www.ti.com
12 Power Supply Recommendations
The power supply can be single-cell, two-cell, or three-cell alkaline, NiCd or NiMH, or one-cell Li-Ion or Lipolymer battery.
The input supply should be well regulated with the rating of TLV61220. If the input supply is located more than a
few inches from the device, additional bulk capacitance may be required in addition to the ceramic bypass
capacitors. An electrolytic or tantalum capacitor with a value of 47 µF is a typical choice.
13 Layout
13.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current. Assure that the ground traces are connected close to the device GND pin.
13.2 Layout Example
Top
Bottom
R2
VBAT
R1
FB
VOUT
VBAT
CIN
L
COUT
EN
GND
SW
VOUT
GND
Figure 18. PCB Layout Recommendation
13.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
• Improving the power-dissipation capability of the PCB design
• Improving the thermal coupling of the component to the PCB
• Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
16
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Product Folder Links: TLV61220
TLV61220
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SLVSB53A – MAY 2012 – REVISED DECEMBER 2014
14 Device and Documentation Support
14.1 Device Support
14.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
14.2 Documentation Support
14.2.1 Related Documentation
For related documentation see the following:
• Thermal Characteristics Application Note, SZZA017
• IC Package Thermal Metrics Application Note, SPRA953
14.3 Trademarks
All trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: TLV61220
17
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLV61220DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VUAI
TLV61220DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VUAI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Aug-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
TLV61220DBVR
SOT-23
DBV
6
3000
178.0
9.0
TLV61220DBVT
SOT-23
DBV
6
250
178.0
9.0
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.23
3.17
1.37
4.0
8.0
Q3
3.23
3.17
1.37
4.0
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV61220DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
TLV61220DBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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