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TLV62080, TLV62084, TLV62084A
SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
TLV6208x 1.2-A and 2-A High-Efficiency Step-Down Converter in 2-mm × 2-mm WSON
Package
1 Features
3 Description
•
The TLV6208x family devices are small buck
converters with few external components, enabling
cost effective solutions. They are synchronous stepdown converters with an input voltage range of 2.5
and 2.7 (2.5 V for TLV62080, 2.7 V for TLV62084x)
to 6 V. The TLV6208x devices focus on highefficiency step-down conversion over a wide output
current range. At medium to heavy loads, the
TLV6208x converters operate in PWM mode and
automatically enter power save mode operation at
light-load currents to maintain high efficiency over the
entire load current range.
1
•
•
•
•
•
•
•
•
•
•
DCS-Control™ Architecture for Fast Transient
Regulation
2.5 to 6-V Input Voltage Range (TLV62080)
2.7 to 6-V Input Voltage Range (TLV62084,
TLV62084A)
100% Duty Cycle for Lowest Dropout
Power Save Mode for Light Load Efficiency
Output Discharge Function
Power Good Output
Thermal Shutdown
Available in 2 mm × 2 mm 8-Terminal WSON
Package
For Improved Features Set, see the TPS62080
Create a Custom Design Using the TLV6208x
With the WEBENCH® Power Designer
To address the requirements of system power rails,
the internal compensation circuit allows a wide range
of external output capacitor values. With the DCSControl™ (Direct Control with Seamless transition
into Power save mode) architecture excellent load
transient performance and output voltage regulation
accuracy are achieved. The devices are available in
2-mm × 2-mm WSON package with Thermal Pad.
2 Applications
•
•
•
•
•
Battery-Powered Portable Devices
Point-of-Load Regulators
PC, Notebook, Server
Set Top Box
Solid State Drive (SSD), Memory Supply
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
WSON (8)
2.00 mm × 2.00 mm
TLV62080
TLV62084,
TLV62084A
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
space
Typical Application Schematic
Efficiency vs Output Current, VOUT = 1.2V
space
space
POWER GOOD
100
90
2.7 V to 6 V
PG
VIN
80
180 kΩ
1 µH
70
SW
EN
VOUT
TLV62084
10 µF
GND
VOS
GND
FB
R1
22 µF
Efficiency (%)
VIN
60
50
40
30
R2
20
VIN = 2.8 V
VIN = 3.6 V
VIN = 4.2 V
10
Copyright © 2016, Texas Instruments Incorporated
0
1E-5
0.0001
0.001
0.01
Output Current (A)
0.1
1
2
D002
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TLV62080, TLV62084, TLV62084A
SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
4
4
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
5
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1
8.2
8.3
8.4
Overview ................................................................... 9
Functional Block Diagram ......................................... 9
Feature Description................................................... 9
Device Functional Modes........................................ 11
9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application .................................................. 12
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 18
11.3 Thermal Considerations ........................................ 19
12 Device and Documentation Support ................. 20
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Device Support......................................................
Documentation Support ........................................
Related Links ........................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Receiving Notification of Documentation Updates
Community Resources..........................................
Glossary ................................................................
20
20
20
20
20
21
21
21
13 Mechanical, Packaging, and Orderable
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision G (September 2016) to Revision H
Page
•
Added WEBENCH® information to Features, Detailed Design Procedure, and Device Support sections............................. 1
•
Added SW (AC, less than 10 ns) to the Absolute Maximum Rating table ............................................................................. 5
Changes from Revision F (January 2015) to Revision G
Page
•
Added TLV62084A device and Applications ......................................................................................................................... 1
•
Added Power Good Pin Logic Table (TLV62080/84) and Power Good Pin Logic Table (TLV62084A) ............................. 10
•
Added scale factors in Figure 14 ......................................................................................................................................... 16
•
Changed PCB Layout Image ............................................................................................................................................... 18
•
Added Receiving Notification of Documentation Updates and Community Resources sections. ........................................ 21
Changes from Revision E (February 2014) to Revision F
Page
•
Changed Device Information table. ....................................................................................................................................... 1
•
Renamed the Configuration and Functions section .............................................................................................................. 4
•
Added new TI-Legal note to Application and Implementation section. ................................................................................ 12
•
Renamed "Thermal Information" to Thermal Considerations ............................................................................................... 19
Changes from Revision D (June 2013) to Revision E
Page
•
Added the Device Information table, Power Supply Recommendations, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sections ................................................................................................ 1
•
Clarified the input voltage ranges of 2.5 V to 5.5 V for the TLV62080 device and 2.7 V to 5.5 V for the TLV62084 device 1
•
Changed the Ordering Information table to the Device Comparison table and removed the Package Marking, TA,
and Package columns from the table .................................................................................................................................... 4
2
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Copyright © 2011–2017, Texas Instruments Incorporated
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SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
•
Changed the word pin to terminal in most cases throughout the document ......................................................................... 4
•
Added the Handling Ratings table which now contains the storage temperature range and ESD ratings ........................... 5
•
Added ILIM range for TLV62084 in Electrical Characteristics table......................................................................................... 6
•
Added the higher output voltage graphs "Output Voltage vs Load Current", Figure 6, Figure 7 in the Typical
Characteristics section............................................................................................................................................................ 7
•
Replaced the "Switching Frequency vs Load Current" graph to the new "Switching Frequency vs Output Current"
graph in the Typical Characteristics section........................................................................................................................... 7
•
Replaced the TLV62080 typical application circuit with the circuit for the TLV62084.......................................................... 12
•
Deleted the Parameter Measurement Information Section and moved image and list of components to Typical
Application section................................................................................................................................................................ 12
•
Added Table 4 to the Design Requirements section ........................................................................................................... 12
•
Added Moved Waveforms from the Typical Characteristics section into the Application Curves section. Changed
LCOIL (coil inductance) to ICOIL (coil current) in the Typical Application (PWM Mode and PFM Mode), Load Transient,
Line Transient, and Startup waveforms................................................................................................................................ 15
•
Added the output capacitance and inductance conditions to the first (original) Load Transient graph................................ 16
•
Added the second Load Transient graph (Figure 14) .......................................................................................................... 16
Changes from Revision C (May 2013) to Revision D
•
Page
Deleted TLV62084 device number from datasheet.............................................................................................................. 19
Changes from Revision B (July 2012) to Revision C
•
Page
Changed the Thermal Information table values ..................................................................................................................... 5
Changes from Revision A (November 2011) to Revision B
Page
•
Changed QFN to SON in ORDERING INFORMATION ......................................................................................................... 4
•
Changed QFN to SON in DEVICE INFORMATION ............................................................................................................... 4
•
Changed Thermal Pad description in Pin Functions .............................................................................................................. 4
•
Changed TJ in the Absolute Maximum Ratings (1) From: –40 to 125°C To: -40 to 150°C ...................................................... 5
•
Changed several instances of DSC to DCS in DEVICE OPERATION section...................................................................... 9
•
Changed DSC to DCS in Functional Block Diagram.............................................................................................................. 9
Changes from Original (October 2011) to Revision A
Page
•
Changed pin VSNS to VOS in Figure 9 ............................................................................................................................... 12
•
Changed pin VSNS to VOS in Figure 10 ............................................................................................................................. 15
Copyright © 2011–2017, Texas Instruments Incorporated
Product Folder Links: TLV62080 TLV62084 TLV62084A
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SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
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Device Comparison Table
PART NUMBER (1)
INPUT VOLTAGE
OUTPUT CURRENT
Power Good Logic Level (EN=Low)
TLV62080
2.5 V to 6 V
1.2 A
High Impedance
TLV62084
2.7 V to 6 V
2A
High Impedance
TLV62084A
2.7 V to 6 V
2A
Low
(1)
For detailed ordering information please check the Mechanical, Packaging, and Orderable Information section at the end of this
datasheet.
6 Pin Configuration and Functions
space
8-Pin WSON With Thermal Pad
DSG Package
(Top View)
EN
1
GND
2
GND
3
FB
4
Exposed
Thermal
Pad
8
VIN
7
SW
6
PG
5
VOS
space
space
Pin Functions
PIN
NO.
1
2, 3
NAME
EN
GND
IN
PWR
DESCRIPTION
Device enable logic input. Do not leave floating.
Logic HIGH enables the device, logic LOW disables the device and turns it into shutdown.
Power and signal ground.
4
FB
IN
Feedback terminal for the internal control loop.
Connect this terminal to the external feedback divider to program the output voltage.
5
VOS
IN
Output voltage sense terminal for the internal control loop. Must be connected to output.
6
PG
OUT
Power Good open drain output.
This terminal is pulled to low if the output voltage is below regulation limits. This terminal can be left floating if not
used.
7
SW
PWR
Switch terminal connected to the internal MOSFET switches and inductor terminal.
Connect the inductor of the output filter here.
8
VIN
PWR
Power supply voltage input.
Exposed
Thermal Pad
4
I/O
—
Must be connected to GND. Must be soldered to achieve appropriate power dissipation and mechanical
reliability.
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SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
7 Specifications
7.1 Absolute Maximum Ratings (1)
Voltage range (2)
Power Good Sink Current
MIN
MAX
VIN, PG, VOS
– 0.3
7
V
SW
– 0.3
VIN + 0.3
V
SW (AC, less than 10 ns) (3)
– 3.0
10
V
FB
– 0.3
3.6
V
EN
– 0.3
VIN + 0.3
PG
UNIT
V
1
mA
Operating junction temperature range, TJ
– 40
150
°C
Storage temperature range, Tstg
– 65
150
°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
While switching.
7.2 ESD Ratings
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM) ESD stress voltage (1)
Charged device model (CDM) ESD stress voltage
VALUE
UNIT
±2000
V
±500
V
(2)
Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe
manufacturing with a standard ESD control process.
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions (1)
MIN
TYP
MAX
UNIT
VIN
Input voltage range, TLV62080
2.5
6
V
VIN
Input voltage range, TLV62084, TLV62084A
2.7
6
V
TJ
Operating junction temperature
–40
125
°C
(1)
Refer to the Application Information section for further information.
7.4 Thermal Information
THERMAL METRIC (1)
TLV6208x
DSG
(8 PINS)
UNITS
θJA
Junction-to-ambient thermal resistance
59.7
°C/W
θJCtop
Junction-to-case (top) thermal resistance
70.1
°C/W
θJB
Junction-to-board thermal resistance
30.9
°C/W
ψJT
Junction-to-top characterization parameter
1.4
°C/W
ψJB
Junction-to-board characterization parameter
31.5
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
8.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2011–2017, Texas Instruments Incorporated
Product Folder Links: TLV62080 TLV62084 TLV62084A
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7.5 Electrical Characteristics
Over recommended free-air temperature range, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted),
VIN= 3.6 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range,TLV62080
2.5
6
VIN
Input voltage range,TLV62084, TLV62084A
2.7
6
IQ
Quiescent current into VIN
IOUT = 0 mA, Device not switching
ISD
Shutdown current into VIN
EN = LOW
Under voltage lock out
Input voltage falling
1.8
Under voltage lock out hysteresis
Rising above VUVLO
120
mV
Thermal shutdown
Temperature rising
150
°C
Thermal shutdown hysteresis
Temperature falling below TJSD
20
°C
VUVLO
TJSD
30
V
V
uA
1
2
µA
V
LOGIC INTERFACE (EN)
VIH
High level input voltage
2.5 V ≤ VIN ≤ 6 V
VIL
Low level input voltage
2.5 V ≤ VIN ≤ 6 V
ILKG
Input leakage current
1
V
0.4
V
0.01
0.5
µA
–10
–5
%
POWER GOOD
VPG
Power good threshold
VOUT falling referenced to VOUT nominal
–15
Power good hysteresis
5
VOL
Low level voltage
Isink = 500 µA
IPG,LKG
PG Leakage current
VPG = 5.0 V
%
0.3
V
0.01
0.1
µA
4
V
0.45
0.462
V
10
100
OUTPUT
VOUT
Output voltage range
VFB
Feedback regulation voltage
VIN ≥ 2.5 V and VIN ≥ VOUT + 1 V
IFB
Feedback input bias current
VFB = 0.45 V
RDIS
Output discharge resistor
EN = LOW, VOUT = 1.8 V
High side FET on-resistance
Low side FET on-resistance
ILIM
High side FET switch current-limit,
TLV62080
Rising inductor current
1.6
2.8
4
A
ILIM
High side FET switch current-limit,
TLV62084, TLV62084A
Rising inductor current
2.3
2.8
4
A
RDS(on)
6
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0.5
0.438
nA
1
kΩ
ISW = 500 mA
120
mΩ
ISW = 500 mA
90
mΩ
Copyright © 2011–2017, Texas Instruments Incorporated
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SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
7.6 Typical Characteristics
See Typical Application for characterization setup.
space
Table 1. Table of Graphs
FIGURE
Load current, VOUT = 0.9 V
Figure 1
Load current, VOUT = 1.2 V
Figure 2
Load current, VOUT = 2.5 V
Figure 3
Input Voltage, VOUT = 0.9 V
Figure 4
Input Voltage, VOUT = 2.5 V
Figure 5
Load current, VOUT = 0.9 V
Figure 6
Load current, VOUT = 2.5 V
Figure 7
Switching Frequency Load current, VOUT = 2.5 V
Figure 8
Efficiency
100
100
90
90
80
80
70
70
Efficiency (%)
Efficiency (%)
Output Voltage
Accuracy
60
50
40
60
50
40
30
30
20
20
VIN = 2.8 V
VIN = 3.6 V
VIN = 4.2 V
10
0
1E-5
0.0001
0.001
0.01
Output Current (A)
0.1
1
VIN = 2.8 V
VIN = 3.6 V
VIN = 4.2 V
10
0
1E-5
2
0.0001
D001
VOUT = 0.9 V
0.001
0.01
Output Current (A)
0.1
1
2
D002
VOUT = 1.2 V
Figure 1. Efficiency vs Load Current
Figure 2. Efficiency vs Load Current
100
0.91
90
0.905
80
Output Voltage (V)
Efficiency (%)
70
60
50
40
30
20
VIN = 3.6 V
VIN = 4.2 V
VIN = 5 V
10
0
1E-5
0.0001
0.001
0.01
Output Current (A)
0.1
VOUT = 2.5 V
1
0.9
0.895
IOUT = 10 mA, TA = 25qC
IOUT = 1 A, TA = 25qC
IOUT = 2 A, TA = 25qC
IOUT = 10 mA, TA = 40qC
IOUT = 1 A, TA = 40qC
IOUT = 2 A, TA = 40qC
IOUT = 10 mA, TA = 85qC
IOUT = 1 A, TA = 85qC
IOUT = 2 A, TA = 85qC
0.89
0.885
2
0.88
2.5
3
3.5
D003
4
4.5
Input Voltage (V)
5
5.5
6
D004
VOUT = 0.9 V
Figure 3. Efficiency vs Load Current
Figure 4. Output Voltage vs Input Voltage
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2.54
0.92
2.52
0.912
Output Voltage (V)
Output Voltage (V)
SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
2.5
2.48
IOUT = 10 mA, TA = 25qC
IOUT = 1 A, TA = 25qC
IOUT = 2 A, TA = 25qC
IOUT = 10 mA, TA = 40qC
IOUT = 1 A, TA = 40qC
IOUT = 2 A, TA = 40qC
IOUT = 10 mA, TA = 85qC
IOUT = 1 A, TA = 85qC
IOUT = 2 A, TA = 85qC
2.46
2.44
2.42
2.5
3
3.5
4
4.5
Input Voltage (V)
5
5.5
0.904
0.896
0.888
TA = 40qC
TA = 25qC
TA = 85qC
0.88
1E-5
6
D005
0.0001
1
2
D006
Figure 6. Output Voltage vs Load Current
Figure 5. Output Voltage vs Input Voltage
2.54
Switching Frequency (MHz)
5
2.52
Output Voltage (V)
0.1
VIN = 3.6 V
VOUT = 2.5 V
2.5
2.48
TA = 40qC
TA = 25qC
TA = 85qC
2.46
1E-5
0.0001
0.001
0.01
Output Current (A)
0.1
VIN = 3.6 V
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1
2
VIN = 3.3 V
VIN = 4.2 V
VIN = 5 V
4
3
2
1
0
0.2
0.4
0.6
D007
0.8
1
1.2
1.4
Output Current (A)
1.6
1.8
2
D008
VOUT = 2.5 V
Figure 7. Output Voltage vs Load Current
8
0.001
0.01
Output Current (A)
Figure 8. Switching Frequency vs Output Current
Copyright © 2011–2017, Texas Instruments Incorporated
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SLVSAK9H – OCTOBER 2011 – REVISED JANUARY 2017
8 Detailed Description
8.1 Overview
The TLV62080 and TLV62084x synchronous switched-mode converters are based on DCS-Control™. DCSControl™ is an advanced regulation topology that combines the advantages of hysteretic and voltage mode
control.
The DCS-Control™ topology operates in PWM (pulse width modulation) mode for medium to heavy load
conditions and in power save mode at light load currents. In PWM mode, the TLV6208x converter operates with
the nominal switching frequency of 2 MHz, having a controlled frequency variation over the input voltage range.
As the load current decreases, the converter enters power save mode, reducing the switching frequency and
minimizing the IC quiescent current to achieve high efficiency over the entire load current range. DCS-Control™
supports both operation modes (PWM and PFM) using a single building block with a seamless transition from
PWM to power save mode without effects on the output voltage. The TLV62080 and TLV62084x devices offer
both excellent DC voltage and superior load transient regulation, combined with very low output voltage ripple,
minimizing interference with RF circuits.
8.2 Functional Block Diagram
space
PG
VIN
High Side
N-MOS
Power
Good
50
Gate
Driver
Control
Logic
SW
Low Side
N-MOS
Active
Output
Discharge
Thermal
Shutdown
GND
EN
ramp
Softstart
comparator
Under
Voltage
Shutdown
error
amplifier
minimum
on-timer
DCS-CONTROL
direct control
&
compensation
TM
VOS
FB
REF
Copyright © 2016, Texas Instruments Incorporated
space
8.3 Feature Description
8.3.1 100% Duty-Cycle Low-Dropout Operation
The devices offer low input-to-output voltage difference by entering the 100% duty-cycle mode. In this mode the
high-side MOSFET switch is constantly turned on and the low-side MOSFET is switched off. This mode is
particularly useful in battery powered applications to achieve the longest operation time by taking full advantage
of the whole battery voltage range. Equation 1 calculates the minimum input voltage to maintain regulation based
on the load current and output voltage.
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Feature Description (continued)
space
VIN,MIN = VOUT + IOUT,MAX ´ (RDS(on) + RL )
With:
•
•
•
•
VIN,MIN = Minimum input voltage
IOUT,MAX = Maximum output current
RDS(on) = High-side FET on-resistance
RL = Inductor ohmic resistance
(1)
space
8.3.2 Enabling and Disabling the Device
The device is enabled by setting the EN input to a logic HIGH. Accordingly, a logic LOW disables the device. If
the device is enabled, the internal power stage starts switching and regulates the output voltage to the
programmed threshold. The EN input must be terminated and not left floating.
8.3.3 Output Discharge
The output gets discharged through the SW terminal with a typical discharge resistor of RDIS whenever the
device shuts down (by disable, thermal shutdown or UVLO).
8.3.4 Soft Start
When EN is set to start device operation, the device starts switching after a delay of about 40 μs and VOUT rises
with a slope of about 10mV/μs (See Figure 16 and Figure 17 for typical startup operation). Soft start avoids
excessive inrush current and creates a smooth output voltage rise slope. Soft start also prevents excessive
voltage drops of primary cells and rechargeable batteries with high internal impedance.
If the output voltage is not reached within the soft start time, such as in the case of heavy load, the converter
enters standard operation. Consequently, the inductor current limit operates as described in Inductor CurrentLimit. The TLV62080 and TLV62084x devices are able to start into a pre-biased output capacitor. The converter
starts with the applied bias voltage and ramps the output voltage to the nominal value.
8.3.5 Power Good
The TLV62080 and TLV62084x devices have a power-good output going low when the output voltage is below
the nominal value. The power good maintains high impedance once the output is above 95% of the regulated
voltage, and is driven to low once the output voltage falls below typically 90% of the regulated voltage. The PG
terminal is an open drain output and is specified to sink typically up to 0.5 mA. The power good output requires a
pull-up resistor which is recommended connecting to the device output. When the device is off because of
disable, UVLO, or thermal shutdown, the PG terminal is at high impedance. TLV62084A features PG=Low in
these cases. Table 2 and Table 3 show the different PG operation for the TLV6208x and TLV62084A. The PG
output can be left floating if unused.
space
Table 2. Power Good Pin Logic Table (TLV62080/84)
PG Logic Status
Device Information
Enable (EN=High)
High Z
VFB ≥ VPG
VFB ≤ VPG
√
√
Shutdown (EN=Low)
UVLO
0.7V < VIN < VUVLO
√
Thermal Shutdown
TJ > TJSD
√
Power Supply Removal
VIN < 0.7V
√
10
Low
√
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space
Table 3. Power Good Pin Logic Table (TLV62084A)
PG Logic Status
Device Information
Enable (EN=High)
High Z
VFB ≥ VPG
Low
√
VFB ≤ VPG
√
√
Shutdown (EN=Low)
UVLO
0.7V < VIN < VUVLO
√
Thermal Shutdown
TJ > TJSD
√
Power Supply Removal
VIN < 0.7V
√
space
The PG signal can be used for sequencing of multiple rails by connecting to the EN terminal of other converters.
Leave the PG terminal unconnected when not in use.
8.3.6 Undervoltage Lockout
To avoid misoperation of the device at low input voltages, an undervoltage lockout is implemented which shuts
down the device at voltages lower than VUVLO with a VHYS_UVLO hysteresis.
8.3.7 Thermal Shutdown
The device goes into thermal shutdown once the junction temperature exceeds typically TJSD. Once the device
temperature falls below the threshold, the device returns to normal operation automatically.
8.3.8 Inductor Current-Limit
The Inductor current-limit prevents the device from high inductor current and drawing excessive current from the
battery or input voltage rail. Excessive current can occur with a shorted or saturated inductor, a heavy load, or
shorted output circuit condition.
The incorporated inductor peak-current limit measures the current during the high-side and low-side power
MOSFET on-phase. Once the high-side switch current-limit is tripped, the high-side MOSFET is turned off and
the low-side MOSFET is turned on to reduce the inductor current. When the inductor current drops down to the
low-side switch current-limit, the low-side MOSFET is turned off and the high-side switch is turned on again. This
operation repeats until the inductor current does not reach the high-side switch current-limit. Because of an
internal propagation delay, the real current-limit value exceeds the static-current limit in the Electrical
Characteristics table.
8.4 Device Functional Modes
8.4.1 Power Save Mode
As the load current decreases, the TLV62080 and TLV62084x devices enter power save mode operation. During
power save mode, the converter operates with a reduced switching frequency in PFM mode and with a minimum
quiescent current maintaining high efficiency. Power save mode occurs when the inductor current becomes
discontinuous. Operation in power save mode is based on a fixed on time architecture. The typical on time is
given by ton = 400 ns × (VOUT / VIN). The switching frequency over the whole load current range is shown in
Figure 8.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The devices are designed to operate from an input voltage supply range between 2.5 V (2.7 V for the TLV62084x
devices) and 6 V with a maximum output current of 2 A (1.2 A for the TLV62080 device). The TLV6208x devices
operate in PWM mode for medium to heavy load conditions and in power save mode at light load currents.
In PWM mode the TLV6208x converters operate with the nominal switching frequency of 2 MHz which provides a
controlled frequency variation over the input voltage range. As the load current decreases, the converter enters
power save mode, reducing the switching frequency and minimizing the IC quiescent current to achieve high
efficiency over the entire load current range.
The WEBENCH software uses an iterative design procedure and accesses a comprehensive database of
components when generating a design. See the Documentation Support section for additional documentation.
9.2 Typical Application
POWER GOOD
2.7 V to 6 V
PG
VIN
VIN
R3
L1
SW
EN
+
C3
VOUT
TLV62084
C1
GND
VOS
GND
FB
R1
C2
R2
Copyright © 2016, Texas Instruments Incorporated
Figure 9. Typical Application Schematic
9.2.1 Design Requirements
Use the following typical application design procedure to select external components values for the TLV62084
device.
Table 4. Design Parameters
12
DESIGN PARAMETERS
EXAMPLE VALUES
Input Voltage Range
2.8 V to 4.2 V
Output Voltage
1.2 V
Transient Response
±5% VOUT
Input Voltage Ripple
400 mV
Output Voltage Ripple
30 mV
Output Current Rating
2A
Operating frequency
2 MHz
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9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TLV62080 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
Table 5. List of Components
REFERENCE
(1)
MANUFACTURER (1)
DESCRIPTION
C1
10 μF, Ceramic Capacitor, 6.3 V, X5R, size 0603
Std
C2
22 μF, Ceramic Capacitor, 6.3 V, X5R, size 0805,
GRM21BR60J226ME39L
Murata
C3
47 μF, Tantalum Capacitor, 8 V, 35 mΩ, size 3528,
T520B476M008ATE035
Kemet
L1
1 μH, Power Inductor, 2.2 A, size 3 mm × 3 mm × 1.2 mm,
XFL3012-102MEB
R1
65.3 kΩ, Chip Resistor, 1/16 W, 1%, size 0603
Std
R2
39.2 kΩ, Chip Resistor, 1/16 W, 1%, size 0603
Std
R3
178 kΩ, Chip Resistor, 1/16 W, 1%, size 0603
Std
Coilcraft
See Third-party Products Disclaimer
9.2.2.2 Output Filter Design
The inductor and the output capacitor together provide a low pass frequency filter. To simplify this process
Table 6 outlines possible inductor and capacitor value combinations for the most application.
Table 6. Matrix of Output Capacitor and Inductor Combinations
L [µH] (1)
COUT [µF] (1)
10
22
47
100
1
+
+ (2) (3)
+
+
2.2
+
+
+
+
150
0.47
4.7
(1)
(2)
(3)
Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by
+20% and –50%. Inductor tolerance and current de-rating is anticipated. The effective inductance can
vary by +20% and –30%.
Plus signs (+) indicates recommended filter combinations.
Filter combination in typical application.
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9.2.2.3 Inductor Selection
The main parameter for the inductor selection is the inductor value and then the saturation current of the
inductor. To calculate the maximum inductor current under static load conditions, Equation 2 is given.
DI
IL,MAX = IOUT,MAX + L
2
VOUT
VIN
DIL = VOUT ´
L ´ fSW
1-
Where
•
•
•
•
IOUT,MAX = Maximum output current
ΔIL = Inductor current ripple
fSW = Switching frequency
L = Inductor value
(2)
space
TI recommends choosing the saturation current for the inductor 20% to approximately 30% higher than the IL,MAX,
out of Equation 2. A higher inductor value is also useful to lower ripple current, but increases the transient
response time as well. The following inductors are recommended to be used in designs (see Table 7).
Table 7. List of Recommended Inductors
INDUCTANCE
[µH]
CURRENT RATING
[mA]
DIMENSIONS
L x W x H [mm3]
DC RESISTANCE
[mΩ typ]
1
2500
3 × 3 × 1.2
1
1650 (2)
3 × 3 × 1.2
2.2
2500
2.2
(1)
(2)
1600
(2)
TYPE
MANUFACTURER (1)
35
XFL3012-102ME
Coilcraft
40
LQH3NPN1R0NJ0
Murata
4 × 3.7 × 1.65
49
LQH44PN2R2MP0
Murata
3 × 3 × 1.2
81
XFL3012-222ME
Coilcraft
See Third-party Procucts Disclaimer
Recommended for TLV62080 only due to limited current rating
9.2.2.4 Capacitor Selection
The input capacitor is the low impedance energy source for the converter which helps to provide stable
operation. A low ESR multilayer ceramic capacitor is recommended for best filtering and must be placed between
VIN and GND as close as possible to those terminals. For most applications 10 μF is sufficient though a larger
value reduces input current ripple.
The architecture of the TLV6208x device allows use of tiny ceramic-type output capacitors with low equivalentseries resistance (ESR). These capacitors provide low output voltage ripple and are recommended. To keep the
resistance up to high frequencies and to get narrow capacitance variation with temperature, TI recommends use
of the X7R or X5R dielectric. The TLV62080 and TLV62084x devices are designed to operate with an output
capacitance of 10 to 100 µF and beyond, as listed in Table 6. Load transient testing and measuring the bode plot
are good ways to verify stability with larger capacitor values.
Table 8. List of Recommended Capacitors
CAPACITANCE
[µF]
TYPE
DIMENSIONS
L x W x H [mm3]
MANUFACTURER (1)
10
GRM188R60J106M
0603: 1.6 × 0.8 × 0.8
Murata
22
GRM188R60G226M
0603: 1.6 × 0.8 × 0.8
Murata
22
GRM21BR60J226M
0805: 2 × 1.2 × 1.25
Murata
(1)
See Third-party Products Disclaimer
14
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9.2.2.5 Setting the Output Voltage
By selecting R1 and R2, the output voltage is programmed to the desired value. Use Equation 3 to calculate R1
and R2.
POWER GOOD
2.7 V to 6 V
VIN
PG
VIN
180 kΩ
1 µH
SW
EN
VOUT
TLV62084
10 µF
GND
VOS
GND
FB
R1
22 µF
R2
Copyright © 2016, Texas Instruments Incorporated
Figure 10. Typical Application Circuit
space
R1 ö
R1 ö
æ
æ
VOUT = VFB ´ ç1 +
÷ = 0.45 V ´ ç1 +
÷
è R2 ø
è R2 ø
(3)
For best accuracy, R2 must be kept smaller than 40 kΩ to ensure that the current flowing through R2 is at least
100-times larger than IFB. Changing the sum towards a lower value increases the robustness against noise
injection. Changing the sum towards higher values reduces the current consumption.
9.2.3 Application Curves
SW
(2 V/div)
SW
(2 V/div)
VOUT
(20 mV/div)
VOUT
(20 mV/div)
I COIL
(0.5 A/div)
I COIL
(0.2 A/div)
Time (2 µs/div)
Time (200 ns/div)
VIN = 3.3 V
VOUT = 1.2 V
ILOAD = 500 mA
Figure 11. Typical Application (PWM Mode)
VIN = 3.3 V
VOUT = 1.2 V
ILOAD = 10 mA
Figure 12. Typical Application (PFM Mode)
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1A
LOAD
(1 A/div)
50 mA
LOAD
(1A/div)
VOUT
(20 mV/div)
VOUT
(50mV/div)
I COIL
(1 A/div)
I COIL
(2A/div)
Time (20 µs/div)
Time (50 µs/div)
L = 1 µH
VOUT = 1.2 V
COUT = 22 µF
ILOAD = 50 mA to 1 A
VIN = 3.3 V
L = 1 µH
VOUT = 1.2 V
VIN = 3.3 V
Figure 14. Load Transient
Figure 13. Load Transient
4.2 V
VIN
(1 V/div)
COUT = 22 µF
ILOAD = 200 mA to 1.8 A
EN
(5 V/div)
3.3 V
PG
(1 V/div)
VOUT
(1 V/div)
VOUT
(50 mV/div)
ICOIL
(0.5 A/div)
Time (20 µs/div)
Time (100 µs/div)
VIN = 3.3 to 4.2 V
VOUT = 1.2 V
ILOAD = 2.2 Ω
VIN = 3.3 V
Figure 15. Line Transient
16
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VOUT = 1.2 V
ILOAD = 2.2 Ω
Figure 16. Startup
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EN
(5 V/div)
PG
(1 V/div)
VOUT
(1 V/div)
ICOIL
(0.2 A/div)
Time (20 µs/div)
VIN = 3.3 V
VOUT = 1.2 V
Figure 17. Startup (No Load)
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10 Power Supply Recommendations
The input power supply's output current needs to be rated according to the supply voltage, output voltage and
output current of the TLV6208x.
11 Layout
11.1 Layout Guidelines
The PCB layout is an important step to maintain the high performance of the TLV62080 and TLV62084x devices.
• Place input and output capacitors, along with the inductor, as close as possible to the IC which keeps the
traces short. Routing these traces direct and wide results in low trace resistance and low parasitic inductance.
• Use a common-power GND.
• Properly connect the low side of the input and output capacitors to the power GND to avoid a GND potential
shift.
• The sense traces connected to FB and VOS terminals are signal traces. Keep these traces away from SW
nodes.
• Use care to avoid noise induction. By a direct routing, parasitic inductance can be kept small.
• Use GND layers for shielding if needed.
11.2 Layout Example
space
space
space
L1
VOUT
PG
VOS
SW
C1
VIN
VIN
GND
FB
GND
EN
GND
C2
GND
R1
R2
Figure 18. PCB Layout Suggestion
18
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11.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
• Improving the power dissipation capability of the PCB design.
• Improving the thermal coupling of the component to the PCB by soldering the Thermal Pad.
• Introducing airflow in the system.
For more details on how to use the thermal parameters, see the Thermal Characteristics application notes
SZZA017 and SPRA953.
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.1.2 Development Support
12.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TLV62080 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
For related documentation see the following:
• TLV62080EVM-756 User's Guide, TLV62080, 1.2-A, High-Efficiency, Step-Down Converter in 2-mm × 2-mm
SON Package, SLVU640
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 9. Related Links
PARTS
PRODUCT FOLDER
BUY NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
TLV62080
Click here
Click here
Click here
Click here
Click here
TLV62084
Click here
Click here
Click here
Click here
Click here
TLV62084A
Click here
Click here
Click here
Click here
Click here
12.4 Trademarks
DCS-Control, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
20
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12.6 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.7 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2017, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Apr-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TLV62080DSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
RAU
TLV62080DSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green NIPDAU | NIPDAUAG
Level-2-260C-1 YEAR
-40 to 125
RAU
TLV62084ADSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
14M
TLV62084ADSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
14M
TLV62084DSGR
ACTIVE
WSON
DSG
8
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
SLO
TLV62084DSGT
ACTIVE
WSON
DSG
8
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
SLO
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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