TLV70012QDDCRQ1

Order Now Product Folder Tools & Software Technical Documents Support & Community Reference Design TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 TLV700xx-Q1 300mA、 、低 IQ、低压差稳压器 1 特性 • • 1 • • • • • • (1) 3 说明 符合汽车应用 要求 具有符合 AEC-Q100 标准的下列结果： – 器件温度 1 级：-40°C 至 125°C 的环境运行温 度范围 – 器件人体放电模式 (HBM) 静电放电 (ESD) 分类 等级 H2 – 器件组件充电模式 (CDM) ESD 分类等级 C3B 精度 2% 低 IQ：35μA 固定输出电压：1.2V 和 1.8V 高电源抑制比 (PSRR)：频率 1kHz 时为 68dB 可在采用 0.1 μF(1) 的有效电容时保持稳定 热关断保护和过流保护 TLV70018-Q1 和 TLV70012-Q1 低压差 (LDO) 线性稳 压器为低静态电流器件，具有出色的线路和负载瞬态性 能。高精度带隙与误差放大器支持 2% 的总精度。本 系列器件具有低输出噪声、高电源抑制比 (PSRR) 和 低压差电压等特性，非常适合为功率敏感型负载供电。 所有器件版本均具有热关断保护和电流限制，以便检测 故障状况。 此外，这些器件在有效输出电容只有 0.1μF 时保持稳 定。这一特性允许使用具有较高偏置电压和温度降额的 成本效益型电容器。这些器件在不产生输出负载的情况 下可调节至特定的精度。 器件信息(1) 器件型号 请参阅 输入和输出电容器要求。 TLV70018-Q1 2 应用 • • • • TLV70012-Q1 汽车音响主机 摄像头传感器和模块 抬头显示 (HUD) 远程信息处理控制单元 封装 小外形尺寸晶体管 (SOT) (5) 封装尺寸（标称值） 2.90mm x 1.60mm (1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附 录。 空白 空白 空白 空白 空白 空白 典型应用 VIN IN OUT CIN COUT VOUT 1 mF Ceramic TLV700xx On Off EN GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. English Data Sheet: SLVSB67 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn 目录 1 2 3 4 5 6 7 特性 .......................................................................... 应用 .......................................................................... 说明 .......................................................................... 修订历史记录 ........................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 4 5 6.1 6.2 6.3 6.4 6.5 6.6 5 5 5 5 6 7 Detailed Description ............................................ 11 7.1 7.2 7.3 7.4 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Overview ................................................................. Functional Block Diagrams ..................................... Feature Description................................................. Device Functional Modes........................................ 11 11 11 12 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application .................................................. 13 9 Power Supply Recommendations...................... 14 10 Layout................................................................... 15 10.1 10.2 10.3 10.4 Layout Guidelines ................................................. Layout Example .................................................... Thermal Considerations ........................................ Power Dissipation ................................................. 15 15 15 15 11 器件和文档支持 ..................................................... 17 11.1 11.2 11.3 11.4 11.5 11.6 11.7 11.8 器件支持................................................................ 文档支持................................................................ 相关链接................................................................ 接收文档更新通知 ................................................. 社区资源................................................................ 商标 ....................................................................... 静电放电警告......................................................... Glossary ................................................................ 17 17 17 17 17 17 17 17 12 机械、封装和可订购信息 ....................................... 17 4 修订历史记录 注：之前版本的页码可能与当前版本有所不同。 Changes from Revision B (January 2016) to Revision C Page • 已更改 固定输出电压 特性 由固定输出电压组合（可能为 1.2V 至 4.8V）更改为固定输出电压（1.2V 和 1.8V） ................. 1 • 已更改 应用部分...................................................................................................................................................................... 1 • 已更改 说明部分的第一段：将 TLV700xx-Q1 系列更改为 TLV70018-Q1 和 TLV70012-Q1、删除了第二句、将多种电 池供电型手持设备更改为为功率敏感型负载供电，并将安全更改为检测故障状况 .................................................................. 1 • 已删除 典型应用标题中的固定电压版本.................................................................................................................................. 1 • Changed Input voltage parameter: changed symbol from VI to VIN, moved EN and OUT rows to standalone parameters ............................................................................................................................................................................. 5 • Changed maximum specification of Output voltage parameter from 5.5 V to 1.8 V ............................................................. 5 • Added IOUT symbol to Current output parameter ................................................................................................................... 5 • Deleted TLV70018-Q1 column from Thermal Information table ............................................................................................ 5 • Added TLV70018-Q1 to TLV70012-Q1 column in Thermal Information table; all thermal values for TLV70018-Q1 changed to the TLV70012-Q1 thermal values........................................................................................................................ 5 • Changed VOUT(TYP) to VOUT(NOM) in conditions statement of Electrical Characteristics table .................................................. 6 • Changed symbols for Line regulation, Load regulation, and Output noise voltage parameters from ΔVO/ΔVIN to ΔVOUT/ΔVIN, ΔVO/ΔIOUT to ΔVOUT/ΔIOUT, and VN to Vn (respectively) in Electrical Characteristics table.................................. 6 • Changed VOUT(TYP) to VOUT(NOM) in Typical Characteristics conditions statement .................................................................. 7 • Deleted Dropout Voltage vs Input Voltage and Dropout Voltage vs Output Current curves ................................................. 7 • Changed TLV700xx-Q1 to TLV70018-Q1 and TLV70012-Q1 in Overview section ............................................................. 11 • Added TLV70012-Q1 to sub-sections of Feature Description and Device Functional Modes sections .............................. 11 • Changed 160°C to 165°C, 140°C to 145°C, and 35°C to 40°C in Thermal Shutdown section .......................................... 12 • Changed Application Information section: changed first two sentences, deleted second paragraph ................................. 13 • Changed Example Value column values for 2nd and 3rd rows in Design Parameters table............................................... 13 • Added TLV70012-Q1 to Input and Output Capacitor Requirements section ....................................................................... 14 • Deleted first and last paragraphs from Thermal Considerations section ............................................................................ 15 • Deleted second sentence from second paragraph of Power Dissipation section ............................................................... 15 • Added TLV70012-Q1 to Power Dissipation section ............................................................................................................ 15 2 版权 © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 修订历史记录 (接 接下页) Changes from Revision A (March 2012) to Revision B Page • 已添加 ESD 额定值表、建议运行条件表、热性能信息表、详细 说明部分、应用和实施部分、应用和实施部分、布局 部分、器件和文档支持部分以及机械、封装和可订购信息部分............................................................................................... 1 • Deleted the Dissipation Ratings table..................................................................................................................................... 5 Copyright © 2011–2017, Texas Instruments Incorporated 3 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn 5 Pin Configuration and Functions DDC Package 5-Pin SOT Top View IN 1 GND 2 EN 3 5 OUT 4 NC Pin Functions PIN NO. DESCRIPTION NAME Input pin. A small 1-μF ceramic capacitor is recommended from this pin to ground to assure stability and good transient performance. (1) 1 IN 2 GND 3 EN Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode and reduces operating current to 1 μA, nominal. 4 NC No connection. This pin can be tied to ground to improve thermal dissipation. 5 OUT (1) 4 Ground pin Regulated output voltage pin. A small 1-μF ceramic capacitor is needed from this pin to ground to assure stability. (1) See Input and Output Capacitor Requirements section for more details. Copyright © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range, unless otherwise noted. (1) Voltage (2) Current (source) MIN MAX UNIT IN –0.3 6.0 V EN –0.3 6.0 V OUT –0.3 6.0 V OUT Internally Limited Output short-circuit duration Indefinite Operating virtual junction, TJ –55 150 °C Storage temperature, Tstg –55 150 °C (1) (2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network ground terminal. 6.2 ESD Ratings VALUE V(ESD) (1) Human-body model (HBM), per AEC Q100-002 Electrostatic discharge (1) 2000 Charged-device model (CDM), per AEC Q100-011 UNIT V 750 AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions over operating free-air temperature range, unless otherwise noted. MIN MAX VIN Input voltage IN 2 5.5 UNIT V VEN Enable voltage EN 0 5.5 V VOUT Output voltage OUT 0 1.8 V IOUT Current output 0 300 mA TJ Operating junction temperature –40 150 °C 6.4 Thermal Information THERMAL METRIC (1) TLV70018-Q1, TLV70012-Q1 DDC (SOT) UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 262.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 68.2 °C/W RθJB Junction-to-board thermal resistance 81.6 °C/W ψJT Junction-to-top characterization parameter 1.1 °C/W ψJB Junction-to-board characterization parameter 80.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Copyright © 2011–2017, Texas Instruments Incorporated 5 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn 6.5 Electrical Characteristics At VIN = VOUT(NOM) + 0.5 V or 2 V (whichever is greater); IOUT = 10 mA, VEN = 0.9 V, COUT = 1.0 μF, and TA = –40°C to 125°C, unless otherwise noted. Typical values are at TA = 25°C, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP VOUT DC output accuracy –40°C ≤ TA ≤ 125°C ΔVOUT/ΔVIN Line regulation VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA 1 5 0 mA ≤ IOUT ≤ 300 mA, TLV70018-Q1 1 15 0 mA ≤ IOUT ≤ 300 mA, TLV70012-Q1 1 20 500 860 mA 35 55 μA Load regulation ICL Output current limit IGND Ground pin current ISHDN Ground pin current (shutdown) PSRR –2% VOUT = 0.9 × VOUT(NOM) 320 IOUT = 0 mA 5.5 UNIT Input voltage range ΔVOUT/ΔIOUT 2 MAX VIN 0.5% IOUT = 300 mA, VIN = VOUT + 0.5 V 370 VEN ≤ 0.4 V, VIN = 2.0 V 400 V 2% mV mV μA nA VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V, TA = –40°C to 85°C 1 2 μA VEN ≤ 0.4 V, 2.0 V ≤ VIN ≤ 4.5 V, TA = 85°C to 125°C 1 2.5 μA Power-supply rejection ratio VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA, f = 1 kHz 68 dB Vn Output noise voltage BW = 100 Hz to 100 kHz, VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA 48 μVRMS tSTR Startup time (1) COUT = 1.0 μF, IOUT = 300 mA 100 μs VEN(HI) Enable pin high (enabled) 0.9 VIN VEN(LO) Enable pin low (disabled) 0 0.4 IEN Enable pin current VIN = VEN = 5.5 V UVLO Undervoltage lockout VIN rising 1.9 V Shutdown, temperature increasing 165 °C Reset, temperature decreasing 145 °C TSD Thermal shutdown temperature TA Operating temperature (1) 6 0.04 –40 V V μA 125 °C Startup time = time from EN assertion to 0.98 × VOUT(NOM). Copyright © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 6.6 Typical Characteristics Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. 1.90 1.90 VOUT = 1.8 V IOUT = 10 mA 1.88 1.86 1.84 1.84 1.82 1.82 VOUT (V) VOUT (V) 1.86 1.80 1.78 1.76 1.72 1.80 1.78 1.76 +125°C +85°C +25°C -40°C 1.74 VOUT = 1.8 V IOUT = 300 mA 1.88 +125°C +85°C +25°C -40°C 1.74 1.72 1.70 1.70 2.1 2.6 3.1 3.6 4.1 VIN (V) 4.6 5.1 2.3 5.6 Figure 1. Line Regulation 10 mA 3.5 3.9 VIN (V) 4.3 4.7 5.1 5.5 1.90 VOUT = 1.8 V 1.88 1.84 1.82 1.82 VOUT (V) 1.86 1.84 1.80 1.78 1.72 1.80 1.78 1.76 +125°C +85°C +25°C -40°C 1.74 VOUT = 1.8 V 1.88 1.86 1.76 10mA 150mA 200mA 1.74 1.72 1.70 1.70 0 50 100 150 200 300 250 -40 -25 -10 IOUT (mA) 5 20 35 50 65 Temperature (°C) 80 95 110 125 Figure 4. Output Voltage vs Temperature Figure 3. Load Regulation 450 50 VOUT = 1.8 V 45 VOUT = 1.8 V 400 40 350 35 300 30 IGND (mA) IGND (mA) 3.1 Figure 2. Line Regulation 300 mA 1.90 VOUT (V) 2.7 25 20 15 5 200 150 +125°C +85°C +25°C -40°C 10 250 +125°C +85°C +25°C -40°C 100 50 0 0 2.1 2.6 3.1 3.6 4.1 VIN (V) 4.6 5.1 5.6 Figure 5. Ground Pin Current vs Input Voltage Copyright © 2011–2017, Texas Instruments Incorporated 0 50 100 150 IOUT (mA) 200 250 300 Figure 6. Ground Pin Current vs Load 7 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn Typical Characteristics (continued) Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. 50 2.5 VOUT = 1.8 V 45 VOUT = 1.8 V 2 40 ISHDN (mA) IGND (mA) 35 30 25 20 1.5 1 15 +125°C +85°C +25°C -40°C 0.5 10 5 0 0 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 2.1 110 125 Figure 7. Ground Pin Current vs Temperature 2.6 3.1 3.6 4.1 VIN (V) VOUT = 1.8 V IOUT = 10 mA 90 80 500 IOUT = 150 mA 70 PSRR (dB) ILIM (mA) 5.6 Figure 8. Shutdown Current vs Input Voltage 600 400 300 200 0 2.3 2.7 3.1 3.5 3.9 VIN (V) 4.3 4.7 5.1 10 Output Spectral Noise Density (mV/ÖHz) VOUT = 1.8 V 50 100 kHz 30 20 10 0 2.2 2.3 2.4 2.5 100 1k 10 k 100 k 1M 10 M Figure 10. Power-Supply Ripple Rejection vs Frequency 10 kHz 2.1 VIN - VOUT = 0.5 V 0 Frequency (Hz) 1 kHz 40 40 10 Figure 9. Current Limit vs Input Voltage 60 50 20 5.5 80 70 60 30 +125°C +85°C +25°C -40°C 100 PSRR (dB) 5.1 100 700 2.6 2.7 2.8 Input Voltage (V) Figure 11. Power-Supply Ripple Rejection vs Input Voltage 8 4.6 10 VOUT = 1.8 V IOUT = 10 mA CIN = COUT = 1 mF 1 0.1 0.01 0.001 10 100 1k 10 k 100 k 1M 10 M Frequency (Hz) Figure 12. Output Spectral Noise Density vs Frequency Copyright © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 Typical Characteristics (continued) Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. tR = tF = 1 ms IOUT 0 mA VOUT 20 mA/div 200 mA 5 mV/div 50 mV/div 100 mA/div tR = tF = 1 ms 10 mA 0 mA IOUT VOUT VOUT = 1.8 V VOUT = 1.8 V 10 ms/div 10 ms/div Figure 13. Load Transient Response Figure 14. Load Transient Response tR = tF = 1 ms 200 mA/div 300 mA IOUT 50 mA 0 mA 100 mV/div 20 mV/div 50 mA/div tR = tF = 1 ms VOUT IOUT 0 mA VOUT VOUT = 1.8 V VOUT = 1.8 V 10 ms/div 10 ms/div Figure 16. Load Transient Response Figure 15. Load Transient Response 1 V/div 2.9 V VIN Slew Rate = 1 V/ms 2.9 V 2.3 V VIN VOUT VOUT = 1.8 V IOUT = 300 mA 1 ms/div Figure 17. Line Transient Response Copyright © 2011–2017, Texas Instruments Incorporated 5 mV/div 2.3 V 5 mV/div 1 V/div Slew Rate = 1 V/ms VOUT VOUT = 1.8 V IOUT = 1 mA 1 ms/div Figure 18. Line Transient Response 9 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn Typical Characteristics (continued) Slew Rate = 1 V/ms VOUT = 1.8 V IOUT = 300 mA 5.5 V VIN 10 mV/div 2.1 V VOUT = 1.8 V IOUT = 1 mA VIN 1 V/div 1 V/div Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(NOM) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = 25°C. VOUT VOUT 1 ms/div Figure 19. Line Transient Response 10 200 ms/div Figure 20. VIN Ramp Up, Ramp Down Response Copyright © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 7 Detailed Description 7.1 Overview The TLV70018-Q1 and TLV70012-Q1 low-dropout (LDO) linear regulators are low-quiescent-current devices with excellent line and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides overall 2% accuracy together with low output noise, very high power-supply rejection ratio (PSRR), and low dropout voltage. 7.2 Functional Block Diagrams IN OUT Current Limit Thermal Shutdown UVLO EN Bandgap LOGIC TLV700xx Series GND 7.3 Feature Description 7.3.1 Internal Current Limit The TLV70018-Q1 and TLV70012-Q1 internal current limit helps to protect the regulator during fault conditions. During current limit, the output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the output voltage is not regulated, and is VOUT = ILIMIT × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) × ILIMIT until thermal shutdown is triggered and the device turns off. As the device cools, it is turned on by the internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and thermal shutdown. See the Thermal Considerations section for more details. The PMOS pass element in the TLV70018-Q1 and TLV70012-Q1 has a built-in body diode that conducts current when the voltage at OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated, external limiting to 5% of the rated output current is recommended. 7.3.2 Dropout Voltage The TLV70018-Q1 and TLV70012-Q1 use a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-tooutput resistance is the RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device behaves as a resistor in dropout. As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout. Figure 11 illustrates this effect. Copyright © 2011–2017, Texas Instruments Incorporated 11 TLV70018-Q1, TLV70012-Q1 ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 www.ti.com.cn Feature Description (continued) 7.3.3 Undervoltage Lockout (UVLO) The TLV70018-Q1 and TLV70012-Q1 use an undervoltage lockout circuit to keep the output shut off until internal circuitry is operating properly. 7.3.4 Thermal Shutdown Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a result of overheating. Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least 40°C above the maximum expected ambient condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the TLV70018-Q1 and TLV70012-Q1 has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TLV70018-Q1 or TLV70012-Q1 into thermal shutdown degrades device reliability. 7.4 Device Functional Modes 7.4.1 Shutdown The enable pin (EN) is active high. The device is enabled when voltage at EN pin goes above 0.9 V. This relatively lower value of voltage required to turn the LDO on can be exploited to power the LDO with a GPIO of recent processors whose GPIO Logic 1 voltage level is lower than traditional microcontrollers. The device is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be connected to the IN pin. 7.4.2 Operation with VIN Less than 2 V The TLV70018-Q1 and TLV70012-Q1 devices operate with input voltages above 2 V. The typical UVLO voltage is 1.9 V and the device operates at an input voltage above 2 V. When input voltage falls below UVLO voltage, the device will shutdown. 7.4.3 Operation with VIN Greater than 2 V When VIN is greater than 2 V, if input voltage is higher than desired output voltage plus dropout voltage, the output voltage is equal to the desired value. Otherwise, output voltage will be VIN minus dropout voltage. 12 Copyright © 2011–2017, Texas Instruments Incorporated TLV70018-Q1, TLV70012-Q1 www.ti.com.cn ZHCS844C – NOVEMBER 2011 – REVISED JUNE 2017 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The TLV70018-Q1 and TLV70012-Q1 consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise and very good PSRR with little (VIN – VOUT) headroom, make this family of devices ideal for portable RF applications. This family of regulators offers current limit and thermal protection, and is specified from –40°C to 125°C. 8.2 Typical Application VOUT VIN IN EN OUT TLV700xx-Q1 1 uF 1 uF GND Figure 21. Simplified Schematic 8.2.1 Design Requirements For this design example use, the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters PARAMETER EXAMPLE VALUE Input voltage range 2 V to 5.5 V Output voltage 1.2 V, 1.8 V Output current rating 300 mA Effective output capacitor range >0.1 µF Maximum output capacitor ESR range