TLV803SDBZR

Sample & Buy Product Folder Support & Community Tools & Software Technical Documents TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 TLV8x3 3-Pin Voltage Supervisors with Active-Low, Open-Drain Reset 1 Features 3 Description • • • The TLV8x3 family of supervisory circuits provides circuit initialization and timing supervision, primarily for DSPs and processor-based systems. 1 • • • • 3-Pin SOT23 Package Supply Current: 9 µA (Typical) Precision Supply Voltage Monitor: 2.5 V, 3 V, 3.3 V, 5 V Power-On Reset Generator with Fixed Delay Time of 200 ms Pin-for-Pin Compatible with MAX803 Temperature Range: –40°C to +125°C Open-Drain, RESET Output The TLV803, TLV853, and TLV863 are functionally equivalent. The TLV853 and TLV863 provide an alternate pinout of the TLV803. During power on, RESET asserts when the supply voltage (VDD) exceeds 1.1 V. Thereafter, the supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset. The delay time (td(typ) = 200 ms) starts after VDD exceeds the threshold voltage, VIT. When the supply voltage drops below the VIT threshold voltage, the output is active (low) again. All the devices in this family have a fixed sense-threshold voltage (VIT) set by an internal voltage divider. 2 Applications • • • • • • • • • DSPs, Microcontrollers, and Microprocessors Portable and Battery-Powered Equipment Set-Top Boxes Servers Appliances Programmable Controls Intelligent Instruments Industrial Equipment Automotive Systems The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. These devices are available in a 3-pin SOT-23 package. The TLV803 devices are characterized for operation over a temperature range of –40°C to +125°C. Device Information(1) PART NUMBER TLV8x3 PACKAGE SOT-23 (3) BODY SIZE (NOM) 2.92 mm × 1.30 mm (1) For all available packages, see the package option addendum at the end of the data sheet. Typical Application 3.3-V LDO 3.3 V 5V OUT IN GND VDD VDD DSP/FPGA/ASIC TLV803S RESET RESET GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison ............................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 4 4 4 4 5 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Thermal Information .................................................. Recommended Operating Conditions....................... Electrical Characteristics........................................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application ................................................. 10 10 Power Supply Recommendations ..................... 11 11 Layout................................................................... 11 11.1 Layout Guidelines ................................................. 11 11.2 Layout Example .................................................... 11 12 Device and Documentation Support ................. 12 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Device Support .................................................... Documentation Support ....................................... Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 13 13 13 13 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (August 2011) to Revision C Page • Added TLV853 device to data sheet ..................................................................................................................................... 1 • Changed device part numbers shown on page header to show single TLV803 device instead of lettered-device versions 1 • Added Device Information and ESD Ratings tables............................................................................................................... 1 • Added Detailed Description, Application and Implementation, Power-Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections ................................................. 1 • Changed Applications section bullets .................................................................................................................................... 1 • Deleted pinouts from front page and moved to Pin Configurations and Functions section ................................................... 1 • Deleted Package/Ordering Information table; for package and ordering information, see the package option addendum at the end of the data sheet. ................................................................................................................................ 3 • Changed all "free-air" to "junction" and all "TA" to "TJ" for all temperature ranges throughout data sheet ............................ 4 • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4 • Deleted Soldering temperature from Absolute Maximum Ratings table ............................................................................... 4 • Changed Thermal Information table; updated thermal resistance values for all parameters ................................................ 4 • Changed "free-air temperature" to "junction temperature" in Electrical Characteristics condition statement ....................... 5 • Changed temperature noted in Switching Characteristics condition statement .................................................................... 5 Changes from Revision A (June 2011) to Revision B Page • Added new paragraph regarding TLV863 to Description section........................................................................................... 1 • Added TLV863 pinout to front page ....................................................................................................................................... 1 • Added TLV863M to Package/Ordering Information................................................................................................................ 3 • Added TLV863 to Thermal Information .................................................................................................................................. 4 • Added TLV863M to Negative-Going Input Threshold Voltage parameter.............................................................................. 5 • Added TLV863M to Hysteresis parameter ............................................................................................................................. 5 • Added TLV863 to Functional Block Diagram ......................................................................................................................... 7 2 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 5 Device Comparison Table 1. Device Threshold Options DEVICE THRESHOLD VOLTAGE TLV803Z 2.25 V TLV803R 2.64 V TLV803S 2.93 V TLV803M 4.38 V TLV853M 4.38 V TLV863M 4.38 V Table 2. Device Family Comparison DEVICE FUNCTION TLV803 Open-Drain, RESET Output TLV809 Push-Pull, RESET Output TLV810 Push-Pull, RESET Output 6 Pin Configuration and Functions TLV803: DBZ Package 3-Pin SOT-23 Top View GND 1 RESET 3 RESET TLV853: DBZ Package 3-Pin SOT-23 Top View 1 VDD 3 2 GND VDD 2 TLV863: DBZ Package 3-Pin SOT-23 Top View RESET 1 3 VDD GND 2 Pin Functions PIN NAME I/O DESCRIPTION TLV803 TLV853 TLV863 GND 1 2 3 — Ground pin. RESET 2 1 1 O RESET is an open-drain output that is driven to a low impedance state when RESET is asserted. RESET remains low (asserted) for the delay time (td) after VDD exceeds VIT–. Use a 10-kΩ to 1-MΩ pullup resistor on this pin. The pullup voltage is not limited by VDD. VDD 3 3 2 I Supply voltage pin. It is good analog design practice to place a 0.1-µF ceramic capacitor close to this pin. Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 3 TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) over operating junction temperature range (unless otherwise noted) VDD (2) Voltage All other pins (2) Current MIN MAX 0 7 –0.3 +7 Maximum low output current, IOL 5 Maximum high output current, IOH –5 Input clamp current, IIK (VI < 0 or VI > VDD) ±20 Output clamp current, IOK (VO < 0 or VO > VDD) Temperature (1) (2) UNIT V mA ±20 Operating junction temperature range, TJ –40 125 Storage temperature range, Tstg –65 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h continuously 7.2 ESD Ratings VALUE Electrostatic discharge V(ESD) (1) (2) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Thermal Information TLV8x3 THERMAL METRIC (1) DBZ (SOT-23) UNITS 3 PINS RθJA Junction-to-ambient thermal resistance 328.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 135.4 °C/W RθJB Junction-to-board thermal resistance 58.3 °C/W ψJT Junction-to-top characterization parameter 5.2 °C/W ψJB Junction-to-board characterization parameter 59.6 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Recommended Operating Conditions at specified temperature range (unless otherwise noted) MIN MAX VDD Supply voltage 1.1 6 V TJ Operating junction temperature –40 125 °C 4 Submit Documentation Feedback UNIT Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 7.5 Electrical Characteristics over recommended operating junction temperature range (unless otherwise noted) PARAMETER VOL TEST CONDITIONS Low-level output voltage Power-up reset voltage (1) VIT– 0.2 0.4 VDD = 6 V, IOL = 4 mA 0.4 1.1 2.20 2.25 2.30 TLV803R 2.58 2.64 2.70 2.87 2.93 2.99 4.28 4.38 4.48 TJ = – 40°C to +125°C TLV803Z TLV803R TLV803S Supply current IOH Output leakage current (1) (2) V V 30 35 TJ = 25°C, IOL = 50 µA mV 40 TLV8x3M IDD UNIT V TLV803Z TLV803S Hysteresis MAX VDD = 3.3 V, IOL = 2 mA TLV8x3M Vhys TYP VDD = 2 V to 6 V, IOL = 500 µA IOL = 50 µA, VOL < 0.2 V Negative-going input threshold voltage (2) MIN 60 VDD = 2 V, output unconnected 9 15 VDD = 6 V, output unconnected 20 30 VDD = 6 V 100 µA nA The lowest supply voltage at which RESET becomes valid. tr,VDD ≤ 66.7 V/ms. To ensure best stability of the threshold voltage, place a bypass capacitor (0.1-µF ceramic) near the supply terminals. 7.6 Switching Characteristics over operating temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS tw Pulse duration at VDD VDD = 1.08 VIT– to 0.92 VIT– td Delay time VDD ≥ VIT– + 0.2 V; see Timing Diagram MIN TYP MAX UNIT 280 ms 1 120 200 µs VDD VIT- 1.1 V t RESET 1 0 td td t For VDD < 1.1 V Undefined Behavior of RESET Output Figure 1. Timing Diagram Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 5 TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com 7.7 Typical Characteristics at TJ = 25°C, VIT– = 4.38 V, and VDD = 5.0 V (unless otherwise noted) 1.2 25 +125°C +85°C +25°C 0°C -40°C 1 20 IDD (mA) VOL (V) 0.8 +125°C +85°C +25°C 0°C -40°C 0.6 15 10 0.4 5 0.2 VDD = 2.5 V 0 0 0 1 2 3 4 5 0 1 2 3 VDD (V) IOL (mA) Figure 2. Low-Level Output Voltage vs Low-Level Output Current 6 Minimum Pulse Duration at VDD (ms) 1.6 1 0.999 0.998 0.997 0.996 0.995 0.994 1.4 1.2 1 0.8 0.6 +125°C +85°C +25°C 0°C -40°C 0.4 0.2 0 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 110 125 0 Figure 4. Normalized to 25°C Negative-Going Input Threshold Voltage vs Temperature 0.5 1 1.5 (VIT-) - VDD (V) 2 2.5 Figure 5. Minimum Pulse Duration At VDD vs Overdrive Voltage 0.8 220 RESET Pulled Up to VDD with 22.1-kW Resistor TLV803M 0.7 TLV803Z 210 +125°C +85°C +25°C 0°C -40°C 0.6 200 0.5 VOL (V) td (ms) 5 Figure 3. Supply Current vs Supply Voltage 1.001 Normalized VIT- (V) 4 190 0.4 0.3 180 0.2 170 0.1 0 160 -40 -25 -10 5 20 35 50 65 Temperature (°C) 80 95 Figure 6. Delay Time vs Temperature 6 Submit Documentation Feedback 110 125 0 0.25 0.5 0.75 VDD (V) 1 1.25 1.5 Figure 7. Power-Up Low-Level Output Voltage vs Supply Voltage Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 8 Detailed Description 8.1 Overview The TLV803 family of supervisory circuits provides circuit initialization and timing supervision. The TLV853 and TLV863 are both functionally equivalent to the TLV803. These devices output a logic low whenever VDD drops below the negative-going threshold voltage (VIT–). The output, RESET, remains low for approximately 200 ms after the VDD voltage exceeds the positive-going threshold voltage (VIT– + Vhys). These devices are designed to ignore fast transients on the VDD pin. 8.2 Functional Block Diagram TLV8x3 R1 _ VDD Reset Logic + Timer + R2 RESET GND Oscillator Reference Voltage of 1.137 V 8.3 Feature Description 8.3.1 VDD Transient Rejection The TLV803 has built-in rejection of fast transients on the VDD pin. The rejection of transients depends on both the duration and the amplitude of the transient. The amplitude of the transient is measured from the bottom of the transient to the negative threshold voltage of the TLV803, as shown in Figure 8. VDD VITTransient Amplitude tw Duration Figure 8. Voltage Transient Measurement The TLV803 does not respond to transients that are fast duration/low amplitude or long duration/small amplitude. Figure 5 shows the relationship between the transient amplitude and duration needed to trigger a reset. Any combination of duration and amplitude above the curve generates a reset signal. Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 7 TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com Feature Description (continued) 8.3.2 Reset During Power Up and Power Down The TLV803 output is valid when VDD is greater than 1.1 V. When VDD is less than 1.1 V, the output transistor turns off and becomes high impedance. The voltage on the RESET pin rises to the voltage level connected to the pull-up resistor. Figure 9 shows a typical waveform for power-up, assuming the RESET pin has a pull-up resistor connected to the VDD pin. VIT- + VHYS VDD 1.1 V td RESET Valid Output Figure 9. Power-Up Response 8.3.3 Bidirectional Reset Pins Some microcontrollers have bidirectional reset pins that act as both inputs and outputs. In a situation where the TLV803 is pulling the RESET line low while the microcontroller is trying the force the RESET line high, a series resistor should be placed between the output of the TLV803 and the RESET pin of the microcontroller to protect against excessive current flow. Figure 10 shows the connection of the TLV803 to a microcontroller using a series resistor to drive a bidirectional RESET line. 3.3 V VCC VDD TLV803S 100 kW RESET Microprocessor 47 kW RST GND Figure 10. Connection To Bidirectional Reset Pin 8.4 Device Functional Modes 8.4.1 Normal Operation (VDD > Power-Up Reset Voltage) When the voltage on VDD is greater than 1.1 V, the RESET signal asserts when VDD is less than VIT– and deasserts when VDD is greater thanVIT–. 8.4.2 Power On Reset (VDD < Power-Up Reset Voltage) When the voltage on VDD is lower than the required voltage to internally pull the asserted output to GND (powerup reset voltage), both outputs are in a high-impedance state. 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Monitoring Multiple Supplies Because the TLV803 has an open-drain output, multiple TLV803 outputs can be directly tied together to form a logical OR-ing function for the RESET line. Only one pull-up resistor is required for this configuration. Figure 11 shows two TLV803s connected together to provide monitoring of a 3.3-V power rail and a 5.0-V power rail. A reset is generated if either power rail falls below the threshold voltage of its corresponding TLV803. 5.0 V 3.3 V 0.1 mF VDD TLV803M RESET 100 kW VIO VCORE Microprocessor RST GND 3.3 V 0.1 mF VDD TLV803S RESET GND Figure 11. Multiple Voltage Rail Monitoring 9.1.2 Output Level Shifting The RESET output of the TLV803 can be pulled to a maximum voltage of 6 V and can be pulled higher in voltage than VDD. It is useful to provide level shifting of the output for cases where the monitored voltage is less than the useful logic levels of the load. Figure 12 shows the TLV803Z used to monitor a 2.5-V power rail, with a logic RESET input to a microprocessor that is connected to 5.0 V and has 5.0-V logic levels. Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 9 TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com Application Information (continued) 2.5 V 5.0 V 0.1 mF VDD 10 kW TLV803Z RESET Microprocessor RST GND Figure 12. Output Voltage Level Shifting 9.2 Typical Application Figure 13 shows TLV803S being used to monitor the supply rail for a DSP, FPGA, or ASIC. 3.3-V LDO 3.3 V 5V OUT IN GND VDD VDD DSP/FPGA/ASIC TLV803S RESET RESET GND GND Figure 13. Typical Application 9.2.1 Design Requirements This design calls for a 3.3-V rail to be monitored. The design resets if the supply rail falls below 2.93 V. The output must satisfy 3.3-V CMOS logic. 9.2.2 Detailed Design Procedure Select the TLV803S to satisfy the voltage threshold requirement. Place a pullup resistor on RESET to VDD in order to satisfy the output logic requirement. 10 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 Typical Application (continued) 9.2.3 Application Curves Minimum Pulse Duration at VDD (ms) 1.6 1.4 1.2 1 0.8 0.6 +125°C +85°C +25°C 0°C -40°C 0.4 0.2 0 0 0.5 1 1.5 (VIT-) - VDD (V) 2 2.5 Figure 14. Minimum Pulse Duration At VDD vs Overdrive Threshold Voltage vs Temperature Voltage 10 Power Supply Recommendations These devices are designed to operate from an input voltage supply range between 1.1 V and 6 V. 11 Layout 11.1 Layout Guidelines Place the CIN decoupling capacitor close to the device. 11.2 Layout Example RPU VDD CIN RESET TLV803 GND Plane Figure 15. Layout Example (DBZ Package) Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 11 TLV803, TLV853, TLV863 SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 Evaluation Modules An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TLV803. The TLV803SEVM-019 evaluation module (and related user guide) can be requested at the Texas Instruments website through the product folders or purchased directly from the TI eStore. 12.1.1.2 Spice Models Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. SPICE models for the TLV803, TLV853, and TLV863 are available through the respective device product folders under Tools & Software. 12.2 Documentation Support 12.2.1 Related Documentation • TLV803SEVM-019 User's Guide. Literature number SLVU461. 12.3 Related Links Table 3 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 3. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TLV803 Click here Click here Click here Click here Click here TLV853 Click here Click here Click here Click here Click here TLV863 Click here Click here Click here Click here Click here 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 TLV803, TLV853, TLV863 www.ti.com SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: TLV803 TLV853 TLV863 Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2019 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TLV803MDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOUQ TLV803MDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOUQ TLV803RDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOSQ TLV803RDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOSQ TLV803SDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOTQ TLV803SDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VOTQ TLV803ZDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VORQ TLV803ZDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VORQ TLV853MDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZGM4 TLV853MDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 ZGM4 TLV863MDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VTWM TLV863MDBZT ACTIVE SOT-23 DBZ 3 250 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 VTWM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2019 Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of