TMAG5273
SLYS045A – JUNE 2021 – REVISED SEPTEMBER 2021
TMAG5273 Low-Power Linear 3D Hall-Effect Sensor With I2C Interface
1 Features
3 Description
•
The TMAG5273 is a low-power linear 3D Hall-effect
sensor designed for a wide range of industrial
and personal electronics applications. This device
integrates three independent Hall-effect sensors in
the X, Y, and Z axes. A precision analog signalchain along with an integrated 12-bit ADC digitizes
the measured analog magnetic field values. The
I2C interface, while supporting multiple operating
VCC ranges, ensures seamless data communication
with low-voltage microcontrollers. The device has an
integrated temperature sensor available for multiple
system functions, such as thermal budget check or
temperature compensation calculation for a given
magnetic field.
•
•
•
•
•
•
•
•
•
•
•
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Configurable power modes including:
– 2.3-mA active mode current
– 1-µA wake-up and sleep mode current
– 5-nA sleep mode current
Selectable linear magnetic range at X, Y, or Z axis:
– TMAG5273x1: ±40 mT, ±80 mT
– TMAG5273x2: ±133 mT, ±266 mT
Interrupt signal from user-defined magnetic and
temperature threshold cross
5% (typical) sensitivity drift
Integrated angle CORDIC calculation with gain
and offset adjustment
20-kSPS single axis conversion rate
Configurable averaging up to 32x for noise
reduction
Conversion trigger by I2C or dedicated INT pin
Optimized I2C interface with cyclic redundancy
check (CRC):
– Maximum 1-MHz I2C clock speed
– Special I2C frame reads for improved
throughput
– Factory-programmed and user-configurable I2C
addresses
Integrated temperature compensation for multiple
magnet types
Built-in temperature sensor
1.7-V to 3.6-V supply voltage VCC range
Operating temperature range: –40℃ to +125℃
2 Applications
•
•
•
•
•
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•
•
•
Electricity meters
Electronic smart lock
Smart thermostat
Joystick & gaming controllers
Drone payload control
Door & window sensor
Magnetic proximity sensor
Mobile robot motor control
E-bike
The TMAG5273 can be configured through the I2C
interface to enable any combination of magnetic
axes and temperature measurements. Additionally,
the device can be configured to various power
options (including wake-up and sleep mode) allowing
designers to optimize system power consumption
based on their system-level needs. Multiple sensor
conversion schemes and I2C read frames help
optimize throughput and accuracy. A dedicated INT
pin can act as a system interrupt during low power
wake-up and sleep mode, and can also be used by a
microcontroller to trigger a new sensor conversion.
An integrated angle calculation engine (CORDIC)
provides full 360° angular position information for both
on-axis and off-axis angle measurement topologies.
The angle calculation is performed using two
user-selected magnetic axes. The device features
magnetic gain and offset correction to mitigate the
impact of system mechanical error sources.
The TMAG5273 is offered in four different factoryprogrammed I2C addresses. The device also supports
additional I2C addresses through the modification
of a user-configurable I2C address register. Each
orderable part can be configured to select one of two
magnetic field ranges that suits the magnet strength
and component placement during system calibration.
The device performs consistently across a wide
ambient temperature range of –40°C to +125°C.
Device Information(1)
PART NUMBER
TMAG5273
Application Block Diagram
(1)
PACKAGE
DBV (6)
BODY SIZE (NOM)
2.90 mm × 1.60 mm
For all available packages, see the package option
addendum at the end of the data sheet.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5273
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SLYS045A – JUNE 2021 – REVISED SEPTEMBER 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings ....................................... 4
6.2 ESD Ratings .............................................................. 4
6.3 Recommended Operating Conditions ........................4
6.4 Thermal Information ...................................................4
6.5 Electrical Characteristics ............................................5
6.6 Temperature Sensor .................................................. 6
6.7 Magnetic Characteristics For A1 ................................6
6.8 Magnetic Characteristics For A2 ................................7
6.9 Magnetic Temp Compensation Characteristics ..........8
6.10 I2C Interface Timing .................................................8
6.11 Power up & Conversion Time ...................................8
6.12 Typical Characteristics.............................................. 9
7 Detailed Description......................................................10
7.1 Overview................................................................... 10
7.2 Functional Block Diagram......................................... 10
7.3 Feature Description...................................................10
7.4 Device Functional Modes..........................................15
7.5 Programming............................................................ 17
7.6 Register Map.............................................................25
8 Application and Implementation.................................. 36
8.1 Application Information............................................. 36
8.2 Typical Application.................................................... 40
8.3 What to Do and What Not to Do............................... 47
9 Power Supply Recommendations................................48
10 Layout...........................................................................48
10.1 Layout Guidelines................................................... 48
10.2 Layout Example...................................................... 48
11 Device and Documentation Support..........................49
11.1 Documentation Support.......................................... 49
11.2 Receiving Notification of Documentation Updates.. 49
11.3 Support Resources................................................. 49
11.4 Trademarks............................................................. 49
11.5 Electrostatic Discharge Caution.............................. 49
11.6 Glossary.................................................................. 49
12 Mechanical, Packaging, and Orderable
Information.................................................................... 49
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (June 2021) to Revision A (September 2021)
Page
• Changed data sheet status from Advanced Information to Production Data......................................................1
2
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5 Pin Configuration and Functions
SCL
1
6
SDA
GND
2
5
INT
GND (TEST)
3
4
VCC
Not to scale
Figure 5-1. DBV Package, 6-Pin SOT-23 (Top View)
Table 5-1. Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
SCL
1
IO
Serial clock.
GND
2
Ground
GND (TEST)
3
Input
VCC
4
Power supply
INT
5
IO
Interrupt input/ output. If not used and connected to ground, set
MASK_INTB = 1b.
SDA
6
IO
Serial data.
Ground reference.
TI Test Pin. Connect to ground in application.
Power supply.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
VCC
Main supply voltage
–0.3
4
V
IOUT
Output current, SDA, INT
0
10
mA
VOUT
Output voltage, SDA, INT
–0.3
7
V
VIN
Input voltage, SCL, SDA, INT
–0.3
7
V
BMAX
Magnetic flux density
Unlimited
T
TJ
Junction temperature
–40
150
°C
Tstg
Storage temperature
–65
170
°C
(1)
Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated
under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
Charged device model (CDM), per JEDEC
specification JS-002, all pins(2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
MIN
VCC
Main supply voltage
VOUT
Output voltage, SDA, INT
IOUT
Output current, SDA, INT
VIH
Input HIGH voltage, SCL, SDA, INT
VIL
Input LOW voltage, SCL, SDA, INT
ΔVCC/Δt(1)
Supply voltage ramp rate
TA
Operating free air temperature
(1)
NOM
MAX
UNIT
1.7
3.6
V
0
5.5
V
2
0.7
mA
VCC
0.3
3
VCC
V/ms
–40
125
℃
If the VCC ramp rate is slower than the recommended supply voltage ramp rate, run a wake-up and sleep cycle after power-up or
power-up reset to avoid I2C address glitch during sleep mode. This action is not required while operating in stand-by or continuous
modes.
6.4 Thermal Information
TMAG5273
THERMAL
METRIC(1)
DBV (SOT-23)
UNIT
6 PINS
4
RθJA
Junction-to-ambient thermal resistance
162
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
81.6
°C/W
RθJB
Junction-to-board thermal resistance
50.1
°C/W
ΨJT
Junction-to-top characterization parameter
30.7
°C/W
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TMAG5273
THERMAL METRIC(1)
UNIT
DBV (SOT-23)
6 PINS
ΨJB
(1)
Junction-to-board characterization parameter
49.8
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SDA, INT
VOL
Output LOW voltage, SDA, INT pin
IOUT = 2mA
IOZ
Output leakage current, SDA, INT pin
Output disabled, VOZ = 5.5V
tFALL_INT
INT output fall time
RPU =10KΩ, CL =20pF, VPU =1.65V to
5.5V
tINT (INT)
INT Interrupt time duration during
pulse mode
tINT (SCL)
SCL Interrupt time duration
0
0.4
V
±100
nA
6
ns
INT_MODE =001b or 010b
10
µs
INT_MODE =011b or 100b
10
µs
DC POWER SECTION
VCCUV (1)
Under voltage threshold at VCC
VCC = 2.3V to 3.6V
IACTIVE
Active mode current
X, Y, Z, or thermal sensor active
conversion, LP_LN =0b
2.3
mA
IACTIVE
Active mode current
X, Y, Z, or thermal sensor active
conversion, LP_LN =1b
3.0
mA
ISTANDBY
Stand-by mode current
Device in trigger mode, no conversion
started
0.45
mA
ISLEEP
Sleep mode current
5
nA
1.9
2.0
2.2
V
AVERAGE POWER DURING WAKE-UP AND SLEEP (W&S) MODE
ICC_DCM_1000_1
W&S mode current consumption
Wake-up interval 1-ms, magnetic 1-ch
conversion, LP_LN =0b, VCC =3.3V
160
µA
ICC_DCM_1000_1
W&S mode current consumption
Wake-up interval 1-ms, magnetic 1-ch
conversion, LP_LN =0b, VCC =1.8V
156
µA
ICC_DCM_1000_4
W&S mode current consumption
Wake-up interval 1-ms, 4-ch
conversion, LP_LN =0b, VCC =3.3V
240
µA
ICC_DCM_1000_4
W&S mode current consumption
Wake-up interval 1-ms, 4-ch
conversion, LP_LN =0b, VCC =1.8V
233
µA
ICC_DCM_0p2_1
W&S mode current consumption
Wake-up interval 5000-ms,
magnetic 1-ch conversion, LP_LN =0b,
VCC =3.3V
1.21
µA
ICC_DCM_0p2_1
W&S mode current consumption
Wake-up interval 5000-ms,
magnetic 1-ch conversion, LP_LN =0b,
VCC =1.8V
1.00
µA
ICC_DCM_0p2_4
W&S mode current consumption
Wake-up interval 5000-ms, 4-ch
conversion, LP_LN =0b, VCC =3.3V
1.22
µA
ICC_DCM_0p2_4
W&S mode current consumption
Wake-up interval 5000-ms, 4-ch
conversion, LP_LN =0b, VCC =1.8V
1.02
µA
(1)
The DIAG_STATUS and VCC_UV_ER bits are not valid for VCC < 2.3V
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6.6 Temperature Sensor
over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
TSENS_RANGE
Temperature sensing range
TADC_T0
Temperature result in decimal value
(from 16-bit format) for TSENS_T0
17508
TSENS_T0
Reference temperature for TADC_T0
25
TADC_RES
Temp sensing resolution (in 16-bit
format)
NRMS_T
RMS (1 Sigma) temperature noise
NRMS_T
RMS (1 Sigma) temperature noise
(1)
–40
MAX
UNIT
170(1)
℃
℃
60.1
LSB/℃
CONV_AVG = 000b
0.4
℃
CONV_AVG = 101b
0.2
℃
TI recommends not to exceed the specified operating free air temperature per the Recommended Operating Conditions table
6.7 Magnetic Characteristics For A1
over operating free-air temperature range (unless otherwise noted)
PARAMETER
6
TEST CONDITIONS
MIN
TYP
MAX
UNIT
BIN_A1_X_Y
Linear magnetic range
X_Y_RANGE =0b
±40
mT
BIN_A1_X_Y
Linear magnetic range
X_Y_RANGE =1b
±80
mT
BIN_A1_Z
Linear magnetic range
Z_RANGE =0b
±40
mT
BIN_A1_Z
Linear magnetic range
Z_RANGE =1b
±80
mT
SENS40_A1
Sensitivity, X, Y, or Z axis
±40 mT range
820
LSB/mT
SENS80_A1
Sensitivity, X, Y, or Z axis
±80 mT range
410
LSB/mT
SENSER_PC_25C_A1
Sensitivity error, X, Y, Z axis
TA =25C
SENSER_PC_TEMP_A1
Sensitivity drift from 25C, X, Y, Z axis
SENSLER_XY_A1
Sensitivity Linearity Error, X, Y-axis
TA =25C
±0.10%
SENSLER_Z_A1
Sensitivity Linearity Error, Z axis
TA =25C
±0.10%
SENSMS_XY_A1
Sensitivity mismatch among X-Y axes
TA =25C
±0.50%
SENSMS_Z_A1
Sensitivity mismatch among Y-Z, or XTA =25C
Z axes
±1.0%
SENSMS_DR_XY_A1
Sensitivity mismatch drift X-Y axes
SENSMS_DR_Z_A1
Sensitivity mismatch drift Y-Z, or X-Z
axes
Boff_A1
Offset
Boff_TC_A1
Offset drift
NRMS_XY_00_000_A1
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
125
µT
NRMS_XY_01_000_A1
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
110
µT
NRMS_XY_00_101_A1
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
22
µT
NRMS_XY_01_101_A1
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
22
µT
NRMS_Z_00_000_A1
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
68
µT
NRMS_Z_01_000_A1
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
66
µT
NRMS_Z_00_101_A1
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
11
µT
NRMS_Z_01_101_A1
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
9
µT
±5.0%
±20.0%
±5.0%
±5%
±15%
TA =25C
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±300
±1000
µT
±3.0
±10.0
µT/°C
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AERR_Y_Z_101_A1_25
Y-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
±1.0
Degree
AERR_X_Z_101_A1_25
X-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
±1.0
Degree
AERR_X_Y_101_A1_25
X-Y Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
±0.5
Degree
6.8 Magnetic Characteristics For A2
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
BIN_A2_X_Y
Linear magnetic range
X_Y_RANGE =0b
±133
mT
BIN_A2_X_Y
Linear magnetic range
X_Y_RANGE =1b
±266
mT
BIN_A2_Z
Linear magnetic range
Z_RANGE =0b
±133
mT
BIN_A2_Z
Linear magnetic range
Z_RANGE =1b
±266
mT
SENS133_A2
Sensitivity, X, Y, or Z axis
±133 mT range
250
LSB/mT
SENS266_A2
Sensitivity, X, Y, or Z axis
±266 mT range
125
LSB/mT
SENSER_PC_25C_A2
Sensitivity error, X, Y, Z axis
TA = 25C
SENSER_PC_TEMP_A2
Sensitivity drift from 25C, X, Y, Z axis
SENSLER_XY_A2
Sensitivity Linearity Error, X, Y-axis
TA =25C
±0.10%
SENSLER_Z_A2
Sensitivity Linearity Error, Z axis
TA =25C
±0.10%
SENSMS_XY_A2
Sensitivity mismatch among X-Y axes
TA =25C
±0.50%
SENSMS_Z_A2
Sensitivity mismatch among Y-Z, or XTA =25C
Z axes
±1.0%
SENSMS_DR_XY_A2
Sensitivity mismatch drift X-Y axes
SENSMS_DR_Z_A2
Sensitivity mismatch drift Y-Z, or X-Z
axes
Boff_A2
Offset
Boff_TC_A2
Offset drift
NRMS_XY_00_000_A2
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
147
µT
NRMS_XY_01_000_A2
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
145
µT
NRMS_XY_01_101_A2
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
24
µT
NRMS_XY_10_101_A2
RMS (1 Sigma) magnetic noise (X or
Y-axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
24
µT
NRMS_Z_00_000_A2
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
000, TA =25C
89
µT
NRMS_Z_10_000_A2
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
000, TA =25C
88
µT
NRMS_Z_00_101_A2
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =0b, CONV_AVG =
101, TA =25C
15
µT
NRMS_Z_10_101_A2
RMS (1 Sigma) magnetic noise (Z
axis)
LP_LN =1b, CONV_AVG =
101, TA =25C
15
µT
AERR_Y_Z_101_A2
Y-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
±1.0
Degree
AERR_X_Z_101_A2
X-Z Angle error in full 360 degree
rotation
CONV_AVG = 101, TA =25C
±1.0
Degree
±5.0%
±20.0%
±5.0%
±5%
±15%
TA =25C
±300
±1000
±3.0
±10
µT
µT/°C
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
AERR_X_Y_101_A2
TEST CONDITIONS
X-Y Angle error in full 360 degree
rotation
MIN
TYP
CONV_AVG = 101, TA =25C
MAX
±0.50
UNIT
Degree
6.9 Magnetic Temp Compensation Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TC_00
Temperature compensation (X, Y, Z-axes)
MAG_TEMPCO =00b
0
%/°C
TC_12
Temperature compensation (X, Y, Z-axes)
MAG_TEMPCO =01b
0.12
%/°C
TC_20
Temperature compensation (X, Y, Z-axes)
MAG_TEMPCO =11b
0.2
%/°C
6.10 I2C Interface Timing
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
I2C Interface Fast Mode Plus (VCC =2.3V to 3.6V)
LOAD = 50 pF, VCC
=2.3V to 3.6V
fI2C_fmp
I2C clock (SCL) frequency
1000
KHz
twhigh_fmp
High time: SCL logic high time duration
350
ns
twlo_wfmp
Low time: SCL logic low time duration
500
ns
tsu_cs_fmp
SDA data setup time
50
ns
th_cs_fmp
SDA data hold time
120
ticr_fmp
SDA, SCL input rise time
ticf_fmp
SDA, SCL input fall time
th_ST_fmp
Start condition hold time
0.1
µs
tsu_SR_fmp
Repeated start condition setup time
0.1
µs
tsu_SP_fmp
Stop condition setup time
0.1
µs
tw_SP_SR_fmp
Bus free time between stop and start condition
0.2
µs
ns
120
55
ns
ns
I2C Interface Fast Mode (VCC =1.7V to 3.6V)
LOAD = 50 pF, VCC
=1.7V to 3.6V
fI2C
I2C clock (SCL) frequency
400
KHz
twhigh
High time: SCL logic high time duration
twlow
Low time: SCL logic low time duration
tsu_cs
SDA data setup time
th_cs
SDA data hold time
ticr
SDA, SCL input rise time
300
ns
ticf
SDA, SCL input fall time
300
ns
th_ST
Start condition hold time
0.3
µs
tsu_SR
Repeated start condition setup time
0.3
µs
tsu_SP
Stop condition setup time
0.3
µs
tw_SP_SR
Bus free time between stop and start condition
0.6
µs
600
ns
1300
ns
100
ns
0
ns
6.11 Power up & Conversion Time
over operating free-air temperature range (unless otherwise noted)
PARAMETER
8
TEST CONDITIONS
tstart_power_up
Time to go to stand-by mode after VCC supply voltage
crossing VCC_MIN
tstart_sleep
Time to go to stand-by mode from sleep mode(1)
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MIN
TYP
MAX UNIT
270
µs
50
µs
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over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tstart_measure
Time to go into continuous measure mode from stand-by
mode
tmeasure
Conversion time(2)
tmeasure
Conversion time(3)
tgo_sleep
Time to go into sleep mode after SCL goes high
(1)
MIN
TYP
MAX UNIT
70
µs
CONV_AVG = 000b,
OPERATING_MODE =10b,
only one channel enabled
50
µs
CONV_AVG = 101b,
OPERATING_MODE =10b,
only one channel enabled
825
µs
20
µs
The device will recognize the I2C communication from a primary only during stand-by or continuous measure modes. While the device
is in sleep mode, a valid secondary address will wake up the device but no acknowledge will be sent to the primary. Start up time must
be considered before addressing the device after wake up.
Add 25µs for each additional magnetic channel enabled for conversion with CONV_AVG = 000b. When CONV_AVG = 000b, the
conversion time doesn't change with the T_CH_EN bit setting.
For conversion with CONV_AVG =101b, each channel data is collected 32 times. If an additional channel is enabled with CONV_AVG
=101b, add 32×25µs = 800µs to the tmeasure to calculate the conversion time for two channels.
(2)
(3)
6.12 Typical Characteristics
0.6
3
0.5
2.5
0.4
2
Current (mA)
Current (mA)
at TA = 25°C typical (unless otherwise noted)
0.3
0.2
0.1
0
-40
0
20
40
60
Temperature (C)
80
100
0
-40
120
Figure 6-1. Standby Mode ICC vs. Temperature
Vcc = 1.8 V
Vcc = 3.3 V
-20
0
20
40
60
Temperature (C)
80
100
120
Figure 6-2. Active Mode ICC vs. Temperature
16
25
VCC = 1.8 V
VCC = 3.3 V
TXYZ Selected, VCC = 1.8 V
TX Selected, VCC = 1.8 V
TXYZ Selected, VCC = 3.3 V
TX Selected, VCC = 3.3 V
14
20
12
ICC Current (A)
ICC Current (nA)
1
0.5
Vcc = 1.8 V
Vcc = 3.3 V
-20
1.5
15
10
10
8
6
4
5
0
-40
2
-20
0
20
40
60
80
Temperature (C)
100
120
140
Figure 6-3. Sleep Mode ICC vs. Temperature
0
20
1020
2020
3020
Sleep-time (ms)
4020
5020
Figure 6-4. Average ICC vs. W&S Mode Sleep Time
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7 Detailed Description
7.1 Overview
The TMAG5273 IC is based on the Hall-effect technology and precision mixed signal circuitry from Texas
Instruments. The output signals (raw X, Y, Z magnetic data and temperature data) are accessible through the I2C
interface.
The IC consists of the following functional and building blocks:
• The Power Management & Oscillator block contains a low-power oscillator, biasing circuitry, undervoltage
detection circuitry, and a fast oscillator.
• The sensing and temperature measurement block contains the Hall biasing, Hall sensors with multiplexers,
noise filters, integrator circuit, temperature sensor, and the ADC. The Hall-effect sensor data and temperature
data are multiplexed through the same ADC.
• The Interface block contains the I2C control circuitry, ESD protection circuits, and all the I/O circuits. The
TMAG5273 supports multiple I2C read frames along with integrated cyclic redundancy check (CRC).
7.2 Functional Block Diagram
VCC
SCL
Power Management and Oscillator
Result Registers
Z
X
+
MUX
TEST
Gain and
Filtering
ADC
Interface
SDA
Y
–
Config Registers
Temperature sensor
INT
Digital Core
GND
7.3 Feature Description
7.3.1 Magnetic Flux Direction
As shown in Figure 7-1, the TMAG5273 will generate positive ADC codes in response to a magnetic north pole
in the proximity. Similarly, the TMAG5273 will generate negative ADC codes if magnetic south poles approach
from the same directions.
10
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S
S
XA
xis
Z Axis
N
N
Y Ax
is
1
2
N
S
3
Figure 7-1. Direction of Sensitivity
7.3.2 Sensor Location
Figure 7-2 shows the location of X, Y, Z hall elements inside the TMAG5273.
1.85-mm
Y
X
Z
0.73-mm
0.68-mm
Figure 7-2. Location of X, Y, Z Hall Elements
7.3.3 Interrupt Function
The TMAG5273 supports flexible and configurable interrupt functions through either the INT or the SCL pin.
Table 7-1 shows different conversion completion events where result registers and SET_COUNT bits update,
and where they do not.
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Table 7-1. Result Register & SET_COUNT Update After Conversion Completion
INT_MODE
MODE
DESCRIPTION
000b
001b
I2C BUS BUSY, NOT TALKING
TO DEVICE
I2C BUS BUSY & TALKING TO
DEVICE
I2C BUS NOT BUSY
RESULT
UPDATE?
RESULT
UPDATE?
RESULT
UPDATE?
SET_COUNT
UPDATE?
SET_COUNT
UPDATE?
SET_COUNT
UPDATE?
No interrupt
Yes
Yes
No
No
Yes
Yes
Interrupt
through INT
Yes
Yes
No
No
Yes
Yes
010b
Interrupt
through INT
except when
I2C busy
Yes
Yes
No
No
Yes
Yes
011b
Interrupt
through SCL
Yes
Yes
No
No
Yes
Yes
100b
Interrupt
through SCL
except when
I2C busy
No
No
No
No
Yes
Yes
Note
I2C
TI does not recommend sharing the same
bus with multiple secondary devices when using
the SCL pin for interrupt function. The SCL interrupt may corrupt transactions with other secondary
devices if present in the same I2C bus.
Interrupt Through SCL
Figure 7-3 shows an example for interrupt function through the SCL pin with the device programmed to wake
up and sleep mode for threshold cross at a predefined intervals. The wake-up intervals can be set through the
SLEEPTIME bits. Once the magnetic threshold cross is detected, the device asserts a fixed width interrupt signal
through the SCL pin, and goes back to stand-by mode.
Wake-up & Sleep
Mode
Standby Mode
Operating Mode
X Ch Threshold
X Magnetic
Field
Interrupt through
SCL
Time
Figure 7-3. Interrupt Through SCL
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Fixed Width Interrupt Through INT
Figure 7-4 shows an example for fixed-width interrupt function through the INT pin. The device is programmed to
be in wake-up and sleep mode to detect a magnetic threshold. The INT_STATE register bit is set 1b. Once the
magnetic threshold cross is detected, the device asserts a fixed width interrupt signal through the INT pin, and
goes back to stand-by mode.
Wake-up & Sleep
Mode
Standby Mode
Operating Mode
X Ch Threshold
X Magnetic
Field
Interrupt through INT
(Fixed Width)
SCL Line
Time
Figure 7-4. Fixed Width Interrupt Through INT
Latched Interrupt Through INT
Figure 7-5 shows an example for latched interrupt function through the INT pin. The device is programmed to
be in wake-up and sleep mode to detect a magnetic threshold. The INT_STATE register bit is set 0b. Once the
magnetic threshold cross is detected, the device asserts a latched interrupt signal through the INT pin, and goes
back to stand-by mode. The interrupt latch is cleared only after the device receives a valid address through the
SCL line.
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Wake-up & Sleep
Mode
Standby Mode
Operating Mode
X Ch Threshold
X Magnetic
Field
Interrupt through INT
(Latched)
SCL Line
Time
Figure 7-5. Latched Interrupt Through INT
7.3.4 Device I2C Address
Table 7-2 shows the default factory programmed I2C addresses of the TMAG5273. The device needs to be
addressed with the factory default I2C address after power up. If required, a primary can assign a new I2C
address through the I2C_ADDRESS register bits after power up.
Table 7-2. I2C Default Address
DEVICE VERSION
MAGNETIC
RANGE
I2C READ ADDRESS (8BIT)
TMAG5273A1
35h
6Ah
6Bh
TMAG5273B1
22h
44h
45h
TMAG5273C1
±40 mT, ±80 mT
78h
F0h
F1h
TMAG5273D1
44h
88h
89h
TMAG5273A2
35h
6Ah
6Bh
TMAG5273B2
22h
44h
45h
78h
F0h
F1h
44h
88h
89h
TMAG5273C2
±133 mT, ±266 mT
TMAG5273D2
14
I2C ADDRESS (7 MSB BITS) I2C WRITE ADDRESS (8-BIT)
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7.3.5 Magnetic Range Selection
Table 7-3 shows the magnetic range selection for the TMAG5273 device. The X, Y, and Z axes range can be
selected with the X_Y_RANGE and Z_RANGE register bits.
Table 7-3. Magnetic Range Selection
RANGE REGISTER SETTING
TMAG5273A1
TMAG5273A2
X_Y_RANGE = 0b
±40-mT
±133-mT
X_Y_RANGE = 1b
±80-mT
±266-mT
Z_RANGE = 0b
±40-mT
±133-mT
Z_RANGE = 1b
±80-mT
±266-mT
X, Y Axis Field
Z Axis Field
COMMENT
Better SNR performance
Better SNR performance
7.3.6 Update Rate Settings
The TMAG5273 offers multiple update rates to offer design flexibility to system designers. The different update
rates can be selected with the CONV_AVG register bits. Table 7-4 shows different update rate settings for the
TMAG5273.
Table 7-4. Update Rate Settings
OPERATING
MODE
REGISTER SETTING
X, Y, Z Axis
UPDATE RATE
SINGLE AXIS
TWO AXES
THREE AXES
CONV_AVG = 000b
20.0-kSPS
13.3-kSPS
10.0-kSPS
X, Y, Z Axis
CONV_AVG = 001b
13.3-kSPS
8.0-kSPS
5.7-kSPS
X, Y, Z Axis
CONV_AVG = 010b
8.0-kSPS
4.4-kSPS
3.1-kSPS
X, Y, Z Axis
CONV_AVG = 011b
4.4-kSPS
2.4-kSPS
1.6-kSPS
X, Y, Z Axis
CONV_AVG = 100b
2.4-kSPS
1.2-kSPS
0.8-kSPS
X, Y, Z Axis
CONV_AVG = 101b
1.2-kSPS
0.6-kSPS
0.4-kSPS
COMMENT
Fastest update rate
Best SNR case
7.4 Device Functional Modes
The TMAG5273 supports multiple functional modes for wide array of applications as explained in Figure 7-6.
A specific functional mode is selected by setting the corresponding value in the OPERATING_MODE register
bits. The device starts powering up after VCC supply crosses the minimum threshold as specified in the
Recommended Operating Condition (ROC) table.
7.4.1 Stand-by (Trigger) Mode
The TMAG5273 goes to stand-by mode after first time powering up. At this mode the digital circuitry and
oscillators are on, and the device is ready to accept commands from the primary device. Based off the
commands the device can start a sensor data conversion, go to power saving mode, or start data transfer
through I2C interface. A new conversion can be triggered through I2C command or through INT pin. In this mode
the device retains the immediate past conversion result data in the corresponding result registers. The time it
takes for the device to go to stand-by mode from power up is denoted by Tstart_power_up.
7.4.2 Sleep Mode
The TMAG5273 supports an ultra-low power sleep mode where it retains the critical user configuration settings.
In this mode the device doesn't retain the conversion result data. A primary can wake up the device from sleep
mode through I2C communications or the INT pin. The time it takes for the device to go to stand-by mode from
sleep mode is denoted by Tstart_sleep.
7.4.3 Wake-up and Sleep (W&S) Mode
In this mode the TMAG5273 can be configured to go to sleep and wake up at a certain interval, and measure
sensor data based off the SLEEPTIME register bits setting. The device can be set to generate an interrupt
through the INT_CONFIG_1 register. Once the conversion is complete and the interrupt condition is met, the
TMAG5273 will exit the W&S mode and go to the stand-by mode. The last measured data will be stored in the
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corresponding result registers before the device goes to the stand-by mode. If the interrupt condition isn't met,
the device will continue to be in the W&S mode to wake up and measure data at the specified interval. A primary
can wake up the TMAG5273 anytime during the W&S mode through I2C bus or INT pin. The time it takes for the
device to go to stand-by mode from W&S mode is denoted by Tstart_sleep.
7.4.4 Continuous Measure Mode
In this mode the TMAG5273 continuously measures the sensor data per SENSOR_CONFIG &
DEVICE_CONFIG register settings. In this mode the result registers can be accessed through the I2C lines. The
time it takes for the device to go from stand-by mode to continuous measure mode is denoted by Tstart_measure.
Device Startup: (VCC crossing MIN threshold specified in the ROC
table)
Sleep Mode
Wake-up & Sleep Mode
Tstart_power_up
Tstart_sleep
Tgo_sleep
Stand-by (Trigger) Mode
Tstart_measure
Continuous Measure Mode
Figure 7-6. TMAG5273 Power-Up Sequence
Table 7-5 shows different device operational modes of the TMAG5273.
Table 7-5. Operating Modes
OPERATING
MODE
DEVICE FUNCTION
ACCESS
TO USER
REGISTERS
RETAIN USER
CONFIGURATION
COMMENT
Continuous
Measure Mode
Continuously measuring x, y, z
axis, or temperature data
Yes
Yes
Stand-by Mode
Device is ready to accept I2C
commands and start active
conversion
Yes
Yes
Wake-up and
Sleep Mode
Wakes up at a certain interval
to measure the x, y, z axis, or
temperature data
No
Yes
1, 5, 10, 15, 20, 30, 50, 100, 500,
1000, 2000, 5000, & 20000-ms intervals
supported.
Sleep Mode
Device retains key configuration
settings, but doesn't retain the
measurement data
Yes
Sleep mode can be utilized by a primary
device to implement other power saving
intervals not supported by wake-up and
sleep mode.
16
No
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7.5 Programming
7.5.1 I2C Interface
The TMAG5273 offers I2C interface, a two-wire interface to connect low-speed devices like microcontrollers, A/D
and D/A converters, I/O interfaces and other similar peripherals in embedded systems.
7.5.1.1 SCL
SCL is the clock line. It is used to synchronize all data transfers over the I2C bus.
7.5.1.2 SDA
SDA is the bidirectional data line for the I2C interface.
7.5.1.3 I2C Read/Write
The TMAG5273 supports multiple I2C read and write frames targeting different applications. I2C_RD and
CRC_EN bits offers multiple read frames to optimize the read time, data resolution and data integrity for a
select application.
7.5.1.3.1 Standard I2C Write
Figure 7-7 shows an example of standard I2C two byte write command supported by TMAG5273. The starting
byte contains 7-bit secondary device address and a '0' at the R/W command bit. The MSB of the second byte
contains the conversion trigger bit. Writing '1' at this trigger bit will start a new conversion after the register
address decoding is completed. The 7 LSB bits of the second byte contains the starting register address for
the write command. After the two command bytes, the primary device starts to send the data to be written at
the corresponding register address. Each successive write byte will send the data for the successive register
address in the secondary device.
Primary Data
Secondary Data
ACK from Secondary
No ACK from Primary
ACK from Primary
Start/ Stop from Primary
Conversion Trigger
Data[Reg_Add]
Register address
Data[Reg_Add+1]
Data[Reg_Add+n]
Stop
R/W
Start
0
Secondary address
Figure 7-7. Standard I2C Write
7.5.1.3.2 General Call Write
Figure 7-8 shows an example of the general call I2C write command supported by the TMAG5273. This
command is useful to configure multiple I2C devices in a I2C bus simultaneously. The starting byte contains
8-bit '0's. The MSB of the second byte contains the conversion trigger bit. Writing '1' at this trigger bit will start a
new conversion after the register address decoding is completed. The 7 LSB bits of the second byte contains the
starting register address for the write command. After the two command bytes, the primary device starts to send
the data to be written at the corresponding register address of all the secondary devices in the I2C bus. Each
successive write byte will send the data for the successive register address in the secondary devices.
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Conversion Trigger
Register address
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+N]
Stop
General call address
R/W
Start
0 0 0 0 0 0 0 0
Figure 7-8. General Call I2C Write
7.5.1.3.3 Standard 3-Byte I2C Read
Figure 7-9 and Figure 7-10 show examples of standard I2C three byte read command supported by the
TMAG5273. The starting byte contains 7-bit secondary device address and the R/W command bit '0'. The
MSB of the second byte contains the conversion trigger command bit. Writing '1' at this trigger bit will start a
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new conversion after the register address decoding is completed. The 7 LSB bits of the second byte contains
the starting register address for the write command. After receiving ACK signal from secondary, the primary send
the secondary address once again with R/W command bit as '1'. The secondary starts to send the corresponding
register data. It will send successive register data with each successive ACK from primary. If CRC is enabled,
the secondary will send the fifth CRC byte based off the CRC calculation of immediate past 4 register bytes.
Note
In the standard 3-byte read command the TMAG5273 doesn't support CRC if the data length is more
than 4 byte. Initiate successive read commands for larger data stream requiring CRC.
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+n]
Stop
Secondary address
R/W
ReStart
1
Register address
R/W
Start
0
Secondary address
Conversion Trigger
Figure 7-9. Standard 3-Byte I2C Read With CRC Disabled, CRC_EN = 0b
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
Conversion Trigger
ACK from Primary
CRC
Secondary address
R/W
ReStart
1
Register address
Data[Reg_Add]
Data[Reg_Add+1]
Data[Reg_Add+2]
Stop
Data[Reg_Add+3]
R/W
Start
0
Secondary address
Start/ Stop from Primary
Figure 7-10. Standard 3-Byte I2C Read With CRC Enabled, CRC_EN = 1b
7.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
Figure 7-11 and Figure 7-12 show examples of 1-byte I2C read command supported by the TMAG5273. Select
I2C_RD =01b to enable this mode. The command byte contains 7-bit secondary device address and a '1' at
the R/W bit. In this mode, per MAG_CH_EN and T_CH_EN bits setting, the device will send 16-bit data of
the enabled channels and the CONV_STATUS register data byte. If CRC is enabled, the device will send an
additional CRC byte based off the CRC calculation of the command byte and the data sent in the current packet.
When multiple channels are enabled, the sent data follows the T, X, Y, and Z sequence in the successive data
bytes.
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Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[CONV_STATUS]
Stop
R/W
Start
1
Secondary address
Single Axis Measurement Example,. X or Y or Z
Data[Axis1_LSB]
Data[Axis2_MSB]
Data[Axis2_LSB]
Data[CONV_STATUS]
Data[Y_MSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Data[X_MSB]
Data[X_LSB]
Data[Y_MSB]
Data[Y_LSB]
Stop
Data[Axis1_MSB]
R/W
Start
1
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
Data[X_MSB]
R/W
Start
1
Secondary address
Stop
Data[CONV_STATUS]
Data[X_LSB]
Three Axes Measurement Example, XYZ
Data[Z_MSB]
Data[T_LSB]
Data[Z_LSB]
Data[CONV_STATUS]
Stop
Data[T_MSB]
R/W
Start
1
Secondary address
All Sensors Measurement Example, TXYZ
Figure 7-11. 1-Byte I2C Read Command for 16-Bit Data With CRC Disabled, CRC_EN = 0b
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Data[Axis1_MSB]
Data[Axis1_LSB]
Data[CONV_STATUS]
CRC
Data[Axis2_MSB]
Data[Axis2_LSB]
Data[CONV_STATUS]
CRC
Data[Y_MSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Data[Y_MSB]
Data[Y_LSB]
Data[Z_MSB]
Data[Z_LSB]
Stop
R/W
Start
1
Secondary address
Single Axis Measurement Example,. X or Y or Z
Data[Axis1_MSB]
Data[Axis1_LSB]
Stop
R/W
Start
1
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
Data[CONV_STATUS]
Data[X_MSB]
CRC
Data[X_LSB]
Stop
R/W
Start
1
Secondary address
Three Axes Measurement Example, XYZ
Data[T_MSB]
CRC
Data[T_LSB]
Stop
Data[CONV_STATUS]
R/W
Start
1
Secondary address
Three Axes Measurement Example, TYZ
Figure 7-12. 1-Byte I2C Read Command for 16-Bit Data With CRC Enabled, CRC_EN = 1b
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Note
In the 1-byte read command for 16-bit data only up to 3 channels data can be sent when CRC is
enabled. This restriction doesn't apply if CRC is disabled.
7.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
Figure 7-13 and Figure 7-14 show examples of 1-byte I2C read command supported by the TMAG5273. Select
I2C_RD =10b to enable this mode. The command byte contains 7-bit secondary device address and a '1' at
the R/W bit. In this mode, per MAG_CH_EN and T_CH_EN bits setting, the device will send 8-bit data of
the enabled channels and the CONV_STATUS register data byte. If CRC is enabled, the device will send an
additional CRC byte based off the CRC calculation of the command byte and the data sent in the current packet.
When multiple channels are enabled, the sent data follows the T, X, Y, and Z sequence in the successive data
bytes.
Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Data[Axis1_MSB]
Data[CONV_STATUS]
Stop
R/W
Start
1
Secondary address
Single Axis Measurement Example,. X or Y or Z
Data[Axis1_MSB]
Data[Axis2_MSB]
Data[CONV_STATUS]
Stop
Secondary address
R/W
Start
1
Two Axes Measurement Example, XY or YZ or XZ
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
Stop
R/W
Start
1
Secondary address
Three Axes Measurement Example, XYZ
Data[T_MSB]
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
Stop
Secondary address
R/W
Start
1
All Sensors Measurement Example, TXYZ
Figure 7-13. 1-Byte I2C Read Command for 8-Bit Data With CRC Disabled, CRC_EN = 0b
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Primary Data
ACK from Secondary
No ACK from Primary
Secondary Data
ACK from Primary
Start/ Stop from Primary
Data[Axis1_MSB]
Data[CONV_STATUS]
CRC
Stop
R/W
Start
1
Secondary address
Single Axis Measurement Example, X or Y or Z
Data[Axis1_MSB]
Data[Axis2_MSB]
Data[CONV_STATUS]
CRC
Stop
R/W
Start
1
Secondary address
Two Axes Measurement Example, XY or YZ or XZ
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
CRC
Stop
R/W
Start
1
Secondary address
Three Axes Measurement Example, XYZ
Data[T_MSB]
Data[X_MSB]
Data[Y_MSB]
Data[Z_MSB]
Data[CONV_STATUS]
CRC
Stop
R/W
Start
1
Secondary address
Three Axes & Temperature Measurement Example, TXYZ
Figure 7-14. 1-Byte I2C Read Command for 8-Bit Data With CRC Enabled, CRC_EN = 1b
Note
In the 1-byte read command for 8-bit data any combinations of channels can be sent without
restrictions.
7.5.1.3.6 I2C Read CRC
The TMAG5273 supports optional CRC during I2C read. The CRC can be enabled through the CRC_EN register
bit. The CRC is performed on a data string that is determined by the I2C read type. The CRC information is sent
as a single byte after the data bytes. The code is generated by the polynomial x8 + x2 + x + 1. Initial CRC bits are
FFh.
The following equations can be employed to calculate CRC:
d = Data Input, c = Initial CRC (FFh)
(1)
newcrc[0] = d[7] ^ d[6] ^ d[0] ^ c[0] ^ c[6] ^ c[7]
(2)
newcrc[1] = d[6] ^ d[1] ^ d[0] ^ c[0] ^ c[1] ^ c[6]
(3)
newcrc[2] = d[6] ^ d[2] ^ d[1] ^ d[0] ^ c[0] ^ c[1] ^ c[2] ^ c[6]
(4)
newcrc[3] = d[7] ^ d[3] ^ d[2] ^ d[1] ^ c[1] ^ c[2] ^ c[3] ^ c[7]
(5)
newcrc[4] = d[4] ^ d[3] ^ d[2] ^ c[2] ^ c[3] ^ c[4]
(6)
newcrc[5] = d[5] ^ d[4] ^ d[3] ^ c[3] ^ c[4] ^ c[5]
(7)
newcrc[6] = d[6] ^ d[5] ^ d[4] ^ c[4] ^ c[5] ^ c[6]
(8)
newcrc[7] = d[7] ^ d[6] ^ d[5] ^ c[5] ^ c[6] ^ c[7]
(9)
The following examples show calculated CRC byte based off various input data:
I2C Data 00h : CRC = F3h
I2C Data FFh : CRC = 00h
I2C Data 80h : CRC = 7Ah
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I2C Data 4Ch : CRC = 10h
I2C Data E0h : CRC = 5Dh
I2C Data 00000000h : CRC = D1h
I2C Data FFFFFFFFh : CRC = 0Fh
7.5.2 Data Definition
7.5.2.1 Magnetic Sensor Data
The X, Y, and Z magnetic sensor data are stored in x_MSB_RESULT and x_LSB_RESULT registers. Figure 7-15
shows that each sensor output stored in a 16-bit 2's complement format in two 8-bit registers. The data can be
retrieved as 16-bit format combining both MSB and LSB registers, or as 8-bit format through the MSB register.
x_MSB_RESULT
D03
D02
D01
D00
D04
D07
D06
D05
D11
D10
D09
D08
D12
D15
D14
D13
x_LSB_RESULT
Figure 7-15. Magnetic Sensor Data Definition
The measured magnetic field can be calculated using Equation 10 for 16-bit data, and using Equation 11 for 8-bit
data.
where
•
•
•
B=
i
− D15 × 215 + ∑14
i = 0 Di × 2
× 2 BR
216
(10)
B is magnetic field in mT.
Di is the data bit shown in Figure 7-15.
BR is the magnetic range in mT for the corresponding channel.
B=
6
− D15 × 27 + ∑i = 0 Di + 8 × 2i
× 2 BR
28
(11)
7.5.2.2 Temperature Sensor Data
The TMAG5273 will measure temperature from –40 °C to 170 °C. The temperature sensor data are stored in
T_MSB_RESULT and T_LSB_RESULT registers. Figure 7-16 shows the sensor output stored in a 16-bit 2's
complement format in two 8-bit registers. The data can be retrieved as 16-bit format combining both MSB and
LSB registers, or as 8-bit format through the MSB register.
22
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T_MSB_RESULT
D03
D02
D01
D00
D04
D07
D06
D05
D11
D10
D09
D08
D12
D15
D14
D13
T_LSB_RESULT
Figure 7-16. Temperature Sensor Data Definition
The measured temperature in degree Celsius can be calculated using Equation 12 for 16-bit data, and using
Equation 13 for 8-bit data.
where
•
•
•
•
•
T
− TADC_T0
T = TSENS_T0 + ADC_T
T
(12)
ADC_RES
T is the measured temperature in degree Celsius.
TSENS_T0 as listed in the Electrical Characteristics table.
TADC_RES is the change in ADC code per degree Celsius.
TADC_T0 as listed in the Electrical Characteristics table.
TADC_T is the measured ADC code for temperature T.
T
256 × TADC_T − ADC_T0
256
T = TSENS_T0 +
TADC_RES
(13)
7.5.2.3 Angle and Magnitude Data Definition
The TMAG5273 calculates the angle from a pair of magnetic axes based off the ANGLE_EN register bits setting.
Figure 7-17 shows the angle information stored in the ANGLE_RESULT_MSB and ANGLE_RESULT_LSB
registers. Bits D04-D12 store angle integer value from 0 to 360 degree. Bits D00-D03 store fractional angle
value. The 3-MSB bits are always populated as b000. The angle can be calculated using Equation 14.
3
where
•
•
i − 4 ∑i = 0 Di × 2
A = ∑12
+
i = 4 Di × 2
16
i
(14)
A is the angle measured in degree.
Di is the data bit as shown in Figure 7-17.
For example: a 354.50 degree is populated as 0001 0110 0010 1000b and a 17.25 degree is populated as 000
0001 0001 0100b.
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Reserved bits
9-bit Angle integer value
4-bit Angle fraction value
D03
D02
D01
D00
D04
D07
D06
D05
D11
D10
D09
D08
D12
D15
D14
D13
0 0 0
Figure 7-17. Angle Data Definition
During the angle calculation, use Equation 15 to calculate the resultant vector magnitude.
where
•
M = MADCCℎ12 + MADCCℎ22
(15)
MADCCh1, MADCCh2 are the ADC codes of the two magnetic channels selected for the angle calculation.
Figure 7-18 shows the magnitude value stored in the MAGNITUDE_RESULT register. For on-axis angular
measurement the magnitude value should remain constant across the full 360° measurement.
D03
D02
D01
D00
D04
D07
D06
D05
MAGNITUDE_RESULT
Figure 7-18. Magnitude Result Data Definition
7.5.2.4 Magnetic Sensor Offset Correction
The TMAG5273 enables offset correction for a pair of magnetic axes (see Figure 7-19). The
MAG_OFFSET_CONFIG_1 and MAG_OFFSET_CONFIG_2 registers store the offset values to be corrected
in 2's complement data format. As an example, if the uncorrected waveform for a particular axis has a value that
is +2 mT too high, the offset correction value of -2 mT should be entered in the corresponding offset correction
register. The selection and order of the sensors are defined in the ANGLE_EN register bits setting. The default
value of these offset correction registers are set as zero.
24
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ΔOffset
0-mT Reference Axis
Figure 7-19. Magnetic Sensor Data Offset Correction
The amount of offset for each axis can be calculated using Equation 16. As an example, with a ±40mT range,
MAG_OFFSET_CONFIG_1 set at 1000 0000b, and MAG_OFFSET_CONFIG_2 set at 0001 0000b, the offset
correction for the first axis is −2.5mT and second axis is 0.312mT.
where
•
•
•
∆Offset =
6
− D7 × 27 + ∑i = 0 Di × 2i
× 2 BR
12
2
(16)
ΔOffset is the amount of offset correction to be applied in mT.
Di is the data bit in the MAG_OFFSET_CONFIG_1 or MAG_OFFSET_CONFIG_2 register.
BR is the magnetic range in mT for the corresponding channel.
Alternately values for MAG_OFFSET_CONFIG_1 or MAG_OFFSET_CONFIG_2 can be calculated for a target
offset correction using Equation 17.
where
•
•
•
MAG_OFFSET =
212 × ∆ Offset
2 BR
(17)
MAG_OFFSET is the decimal value to be entered in the MAG_OFFSET_CONFIG_1 or
MAG_OFFSET_CONFIG_2 register.
ΔOffset is the amount of offset correction to be applied in mT.
BR is the magnetic range in mT for the corresponding channel.
7.6 Register Map
7.6.1 TMAG5273 Registers
Table 7-6 lists the TMAG5273 registers. All register offset addresses not listed in Table 7-6 should be considered
as reserved locations and the register contents should not be modified.
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User Configuration Registers
Table 7-6. TMAG5273 Registers
Offset
Acronym
Register Name
0h
DEVICE_CONFIG_1
Configure Device Operation Modes
Section
Go
1h
DEVICE_CONFIG_2
Configure Device Operation Modes
Go
2h
SENSOR_CONFIG_1
Sensor Device Operation Modes
Go
3h
SENSOR_CONFIG_2
Sensor Device Operation Modes
Go
4h
X_THR_CONFIG
X Threshold Configuration
Go
5h
Y_THR_CONFIG
Y Threshold Configuration
Go
6h
Z_THR_CONFIG
Z Threshold Configuration
Go
7h
T_CONFIG
Temp Sensor Configuration
Go
8h
INT_CONFIG_1
Configure Device Operation Modes
Go
9h
MAG_GAIN_CONFIG
Configure Device Operation Modes
Go
Ah
MAG_OFFSET_CONFIG_1
Configure Device Operation Modes
Go
Bh
MAG_OFFSET_CONFIG_2
Configure Device Operation Modes
Go
Ch
I2C_ADDRESS
I2C Address Register
Go
Dh
DEVICE_ID
ID for the device die
Go
Eh
MANUFACTURER_ID_LSB
Manufacturer ID lower byte
Go
Fh
MANUFACTURER_ID_MSB
Manufacturer ID upper byte
Go
10h
T_MSB_RESULT
Conversion Result Register
Go
11h
T_LSB_RESULT
Conversion Result Register
Go
12h
X_MSB_RESULT
Conversion Result Register
Go
13h
X_LSB_RESULT
Conversion Result Register
Go
14h
Y_MSB_RESULT
Conversion Result Register
Go
15h
Y_LSB_RESULT
Conversion Result Register
Go
16h
Z_MSB_RESULT
Conversion Result Register
Go
17h
Z_LSB_RESULT
Conversion Result Register
Go
18h
CONV_STATUS
Conversion Status Register
Go
19h
ANGLE_RESULT_MSB
Conversion Result Register
Go
1Ah
ANGLE_RESULT_LSB
Conversion Result Register
Go
1Bh
MAGNITUDE_RESULT
Conversion Result Register
Go
1Ch
DEVICE_STATUS
Device_Diag Status Register
Go
Complex bit access types are encoded to fit into small table cells. Table 7-7 shows the codes that are used for
access types in this section.
Table 7-7. TMAG5273 Access Type Codes
Access Type
Code
Description
R
Read
W
W
Write
W1CP
W
1C
P
Write
1 to clear
Requires privileged access
Read Type
R
Write Type
Reset or Default Value
-n
26
Value after reset or the default value
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7.6.1.1 DEVICE_CONFIG_1 Register (Offset = 0h) [Reset = 0h]
DEVICE_CONFIG_1 is shown in Table 7-8.
Return to the Summary Table.
Table 7-8. DEVICE_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
CRC_EN
R/W
0h
Enables I2C CRC byte to be sent
0h = CRC disabled
1h = CRC enabled
6-5
MAG_TEMPCO
R/W
0h
Temperature coefficient of the magnet
0h = 0% (No temperature compensation)
1h = 0.12%/ deg C (NdBFe)
2h = Reserved
3h = 0.2%/deg C (Ceramic)
4-2
CONV_AVG
R/W
0h
Enables additional sampling of the sensor data to reduce the noise
effect (or to increase resolution)
0h = 1x average, 10.0-kSPS (3-axes) or 20-kSPS (1 axis)
1h = 2x average, 5.7-kSPS (3-axes) or 13.3-kSPS (1 axis)
2h = 4x average, 3.1-kSPS (3-axes) or 8.0-kSPS (1 axis)
3h = 8x average, 1.6-kSPS (3-axes) or 4.4-kSPS (1 axis)
4h = 16x average, 0.8-kSPS (3-axes) or 2.4-kSPS (1 axis)
5h = 32x average, 0.4-kSPS (3-axes) or 1.2-kSPS (1 axis)
1-0
I2C_RD
R/W
0h
Defines the I2C read mode
0h = Standard I2C 3-byte read command
1h = 1-byte I2C read command for 16bit sensor data and conversion
status
2h = 1-byte I2C read command for 8 bit sensor MSB data and
conversion status
3h = Reserved
7
7.6.1.2 DEVICE_CONFIG_2 Register (Offset = 1h) [Reset = 0h]
DEVICE_CONFIG_2 is shown in Table 7-9.
Return to the Summary Table.
Table 7-9. DEVICE_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
THR_HYST
R/W
0h
Select thresholds for the interrupt function
0h = Takes the 2's complement value of each x_THR_CONFIG
register to create a magnetic threshold of the corresponding axis
1h = Takes the 7 LSB bits of the x_THR_CONFIG register to create
two opposite magnetic thresholds (one north, and another south) of
equal magnitude.
2h = Reserved
3h = Reserved
4h = Reserved
5h = Reserved
6h = Reserved
7h = Reserved
4
LP_LN
R/W
0h
Selects the modes between low active current or low-noise modes
0h = Low active current mode
1h = Low noise mode
3
I2C_GLITCH_FILTER
R/W
0h
I2C glitch filter
0h = Glitch filter on
1h = Glitch filter off
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Table 7-9. DEVICE_CONFIG_2 Register Field Descriptions (continued)
Bit
2
1-0
Field
Type
Reset
Description
TRIGGER_MODE
R/W
0h
Selects a condition which initiates a single conversion based
off already configured registers. A running conversion completes
before executing a trigger. Redundant triggers are ignored.
TRIGGER_MODE is available only during the mode explicitly
mentioned in OPERATING_MODE.
0h = Conversion Start at I2C Command Bits, DEFAULT
1h = Conversion starts through trigger signal at INT pin
OPERATING_MODE
R/W
0h
Selects Operating Mode and updates value based on operating
mode if device transitions from Wake-up and sleep mode to Standby
mode.
0h = Stand-by mode (starts new conversion at trigger event)
1h = Sleep mode
2h = Continuous measure mode
3h = Wake-up and sleep mode (W&S mode)
7.6.1.3 SENSOR_CONFIG_1 Register (Offset = 2h) [Reset = 0h]
SENSOR_CONFIG_1 is shown in Table 7-10.
Return to the Summary Table.
Table 7-10. SENSOR_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
MAG_CH_EN
R/W
0h
Enables data acquisition of the magnetic axis channel(s)
0h = All magnetic channels of off, DEFAULT
1h = X channel enabled
2h = Y channel enabled
3h = X, Y channel enabled
4h = Z channel enabled
5h = Z, X channel enabled
6h = Y, Z channel enabled
7h = X, Y, Z channel enabled
8h = XYX channel enabled
9h = YXY channel enabled
Ah = YZY channel enabled
Bh = XZX channel enabled
Ch = Reserved
Dh = Reserved
Eh = Reserved
Fh = Reserved
3-0
SLEEPTIME
R/W
0h
Selects the time spent in low power mode between conversions
when OPERATING_MODE =11b
0h = 1ms
1h = 5ms
2h = 10ms
3h = 15ms
4h = 20ms
5h = 30ms
6h = 50ms
7h = 100ms
8h = 500ms
9h = 1000ms
Ah = 2000ms
Bh = 5000ms
Ch = 20000ms
7.6.1.4 SENSOR_CONFIG_2 Register (Offset = 3h) [Reset = 0h]
SENSOR_CONFIG_2 is shown in Table 7-11.
28
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Return to the Summary Table.
Table 7-11. SENSOR_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0h
Reserved
6
THRX_COUNT
R/W
0h
Number of threshold crossings before the interrupt is asserted
0h = 1 threshold crossing
1h = 4 threshold crossing
5
MAG_THR_DIR
R/W
0h
Selects the direction of threshold check. This bit is ignored when
THR_HYST > 001b
0h = sets interrupt for field above the threshold
1h = sets interrupt for field below the threshold
4
MAG_GAIN_CH
R/W
0h
Selects the axis for magnitude gain correction value entered in
MAG_GAIN_CONFIG register
0h = 1st channel is selected for gain adjustment
1h = 2nd channel is selected for gain adjustment
ANGLE_EN
R/W
0h
Enables angle calculation, magnetic gain, and offset corrections
between two selected magnetic channels
0h = No angle calculation, magnitude gain, and offset correction
enabled
1h = X 1st, Y 2nd
2h = Y 1st, Z 2nd
3h = X 1st, Z 2nd
1
X_Y_RANGE
R/W
0h
Select the X and Y axes magnetic range from 2 different options.
0h = ±40mT (TMAG5273A1) or ±133mT (TMAG5273A2), DEFAULT
1h = ±80mT (TMAG5273A1) or ±266mT (TMAG5273A2)
0
Z_RANGE
R/W
0h
Select the Z axis magnetic range from 2 different options.
0h = ±40mT (TMAG5273A1) or ±133mT (TMAG5273A2), DEFAULT
1h = ±80mT (TMAG5273A1) or ±266mT (TMAG5273A2)
3-2
7.6.1.5 X_THR_CONFIG Register (Offset = 4h) [Reset = 0h]
X_THR_CONFIG is shown in Table 7-12.
Return to the Summary Table.
Table 7-12. X_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_THR_CONFIG
R/W
0h
8-bit, 2's complement X axis threshold code for limit
check. The range of possible threshold entrees can be
+/-128. The threshold value in mT is calculated for
A1 as (40(1+X_Y_RANGE)/128)*X_THR_CONFIG, for A2 as
(133(1+X_Y_RANGE)/128)*X_THR_CONFIG. Default 0h means no
threshold comparison.
7.6.1.6 Y_THR_CONFIG Register (Offset = 5h) [Reset = 0h]
Y_THR_CONFIG is shown in Table 7-13.
Return to the Summary Table.
Table 7-13. Y_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_THR_CONFIG
R/W
0h
8-bit, 2's complement Y axis threshold code for limit
check. The range of possible threshold entrees can be
+/-128. The threshold value in mT is calculated for
A1 as (40(1+X_Y_RANGE)/128)*X_THR_CONFIG, for A2 as
(133(1+X_Y_RANGE)/128)*X_THR_CONFIG. Default 0h means no
threshold comparison.
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7.6.1.7 Z_THR_CONFIG Register (Offset = 6h) [Reset = 0h]
Z_THR_CONFIG is shown in Table 7-14.
Return to the Summary Table.
Table 7-14. Z_THR_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_THR_CONFIG
R/W
0h
8-bit, 2's complement Z axis threshold code for limit
check. The range of possible threshold entrees can be
+/-128. The threshold value in mT is calculated for
A1 as (40(1+Z_RANGE)/128)*Z_THR_CONFIG, for A2 as
(133(1+Z_RANGE)/128)*Z_THR_CONFIG. Default 0h means no
threshold comparison.
7.6.1.8 T_CONFIG Register (Offset = 7h) [Reset = 0h]
T_CONFIG is shown in Table 7-15.
Return to the Summary Table.
Table 7-15. T_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
T_THR_CONFIG
R/W
0h
Temperature threshold code entered by user. The valid temperature
threshold ranges are -41C to 170C with the threshold codes for -41C
= 1Ah, and 170C = 34h. Resolution is 8 degree C/ LSB. Default 0h
means no threshold comparison.
T_CH_EN
R/W
0h
Enables data acquisition of the temperature channel
0h = Temp channel disabled
1h = Temp channel enabled
0
7.6.1.9 INT_CONFIG_1 Register (Offset = 8h) [Reset = 0h]
INT_CONFIG_1 is shown in Table 7-16.
Return to the Summary Table.
Table 7-16. INT_CONFIG_1 Register Field Descriptions
Bit
30
Field
Type
Reset
Description
7
RSLT_INT
R/W
0h
Enable interrupt response on conversion complete.
0h = Interrupt is not asserted when the configured set of conversions
are complete
1h = Interrupt is asserted when the configured set of conversions are
complete
6
THRSLD_INT
R/W
0h
Enable interrupt response on a predefined threshold cross.
0h = Interrupt is not asserted when a threshold is crossed
1h = Interrupt is asserted when a threshold is crossed
5
INT_STATE
R/W
0h
INT interrupt latched or pulsed.
0h = INT interrupt latched until clear by a primary addressing the
device
1h = INT interrupt pulse for 10us
4-2
INT_MODE
R/W
0h
Interrupt mode select.
0h = No interrupt
1h = Interrupt through INT
2h = Interrupt through INT except when I2C bus is busy.
3h = Interrupt through SCL
4h = Interrupt through SCL except when I2C bus is busy.
5h = Reserved
6h = Reserved
7h = Reserved
1
RESERVED
R
0h
Reserved
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Table 7-16. INT_CONFIG_1 Register Field Descriptions (continued)
Bit
0
Field
Type
Reset
Description
MASK_INTB
R/W
0h
Mask INT pin when INT connected to GND
0h = INT pin is enabled
1h = INT pin is disabled (for wake-up and trigger functions)
7.6.1.10 MAG_GAIN_CONFIG Register (Offset = 9h) [Reset = 0h]
MAG_GAIN_CONFIG is shown in Table 7-17.
Return to the Summary Table.
Table 7-17. MAG_GAIN_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
GAIN_VALUE
R/W
0h
8-bit gain value determined by a primary to adjust a Hall axis
gain. The particular axis is selected based off the settings of
MAG_GAIN_CH and ANGLE_EN register bits. The binary 8-bit input
is interpreted as a fractional value in between 0 and 1 based off
the formula, 'user entered value in decimal/256'. Gain value of 0 is
interpreted by the device as 1.
7.6.1.11 MAG_OFFSET_CONFIG_1 Register (Offset = Ah) [Reset = 0h]
MAG_OFFSET_CONFIG_1 is shown in Table 7-18.
Return to the Summary Table.
Table 7-18. MAG_OFFSET_CONFIG_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OFFSET_VALUE_1ST
R/W
0h
8-bit, 2's complement offset value determined by a primary to adjust
first axis offset value. The range of possible offset valid entrees can
be +/-128. The offset value is calculated by multiplying bit resolution
with the entered value.
7.6.1.12 MAG_OFFSET_CONFIG_2 Register (Offset = Bh) [Reset = 0h]
MAG_OFFSET_CONFIG_2 is shown in Table 7-19.
Return to the Summary Table.
Table 7-19. MAG_OFFSET_CONFIG_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
OFFSET_VALUE_2ND
R/W
0h
8-bit, 2's complement offset value determined by a primary to adjust
second axis offset value. The range of possible offset valid entrees
can be +/-128. The offset value is calculated by multiplying bit
resolution with the entered value.
7.6.1.13 I2C_ADDRESS Register (Offset = Ch) [Reset = 6Ah]
I2C_ADDRESS is shown in Table 7-20.
Return to the Summary Table.
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Table 7-20. I2C_ADDRESS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
I2C_ADDRESS
R/W
35h
7-bit default factory I2C address is loaded from OTP during first
power up. Change these bits to a new setting if a new I2C address
is required (at each power cycle these bits must be written again to
avoid going back to default factory address).
0h
Enable a new user defined I2C address.
0h = Disable update of I2C address
1h = Enable update of I2C address with bits (7:1)
0
I2C_ADDRESS_UPDATE R/W
_EN
7.6.1.14 DEVICE_ID Register (Offset = Dh) [Reset = 1h]
DEVICE_ID is shown in Table 7-21.
Return to the Summary Table.
Table 7-21. DEVICE_ID Register Field Descriptions
Bit
Field
Type
Reset
Description
7-2
RESERVED
R
0h
Reserved
1-0
VER
R
1h
Device version indicator. Reset value of DEVICE_ID depends on the
orderable part number.
0h = Reserved
1h = ±40-mT and ±80-mT range
2h = ±133-mT and ±266-mT range
3h = Reserved
7.6.1.15 MANUFACTURER_ID_LSB Register (Offset = Eh) [Reset = 49h]
MANUFACTURER_ID_LSB is shown in Table 7-22.
Return to the Summary Table.
Table 7-22. MANUFACTURER_ID_LSB Register Field Descriptions
Bit
Field
7-0
MANUFACTURER_ID_[7: R
0]
Type
Reset
Description
49h
8-bit unique manufacturer ID
7.6.1.16 MANUFACTURER_ID_MSB Register (Offset = Fh) [Reset = 54h]
MANUFACTURER_ID_MSB is shown in Table 7-23.
Return to the Summary Table.
Table 7-23. MANUFACTURER_ID_MSB Register Field Descriptions
Bit
Field
7-0
MANUFACTURER_ID_[15 R
:8]
Type
Reset
Description
54h
8-bit unique manufacturer ID
7.6.1.17 T_MSB_RESULT Register (Offset = 10h) [Reset = 0h]
T_MSB_RESULT is shown in Table 7-24.
Return to the Summary Table.
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Table 7-24. T_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
T_CH_RESULT [15:8]
R
0h
T-channel data conversion results, MSB 8 bits.
7.6.1.18 T_LSB_RESULT Register (Offset = 11h) [Reset = 0h]
T_LSB_RESULT is shown in Table 7-25.
Return to the Summary Table.
Table 7-25. T_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
T_CH_RESULT [7:0]
R
0h
T-channel data conversion results, LSB 8 bits.
7.6.1.19 X_MSB_RESULT Register (Offset = 12h) [Reset = 0h]
X_MSB_RESULT is shown in Table 7-26.
Return to the Summary Table.
Table 7-26. X_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_CH_RESULT [15:8]
R
0h
X-channel data conversion results, MSB 8 bits.
7.6.1.20 X_LSB_RESULT Register (Offset = 13h) [Reset = 0h]
X_LSB_RESULT is shown in Table 7-27.
Return to the Summary Table.
Table 7-27. X_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
X_CH_RESULT [7:0]
R
0h
X-channel data conversion results, LSB 8 bits.
7.6.1.21 Y_MSB_RESULT Register (Offset = 14h) [Reset = 0h]
Y_MSB_RESULT is shown in Table 7-28.
Return to the Summary Table.
Table 7-28. Y_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_CH_RESULT [15:8]
R
0h
Y-channel data conversion results, MSB 8 bits.
7.6.1.22 Y_LSB_RESULT Register (Offset = 15h) [Reset = 0h]
Y_LSB_RESULT is shown in Table 7-29.
Return to the Summary Table.
Table 7-29. Y_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Y_CH_RESULT [7:0]
R
0h
Y-channel data conversion results, LSB 8 bits.
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7.6.1.23 Z_MSB_RESULT Register (Offset = 16h) [Reset = 0h]
Z_MSB_RESULT is shown in Table 7-30.
Return to the Summary Table.
Table 7-30. Z_MSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_CH_RESULT [15:8]
R
0h
Z-channel data conversion results, MSB 8 bits.
7.6.1.24 Z_LSB_RESULT Register (Offset = 17h) [Reset = 0h]
Z_LSB_RESULT is shown in Table 7-31.
Return to the Summary Table.
Table 7-31. Z_LSB_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Z_CH_RESULT [7:0]
R
0h
Z-channel data conversion results, LSB 8 bits.
7.6.1.25 CONV_STATUS Register (Offset = 18h) [Reset = 10h]
CONV_STATUS is shown in Table 7-32.
Return to the Summary Table.
Table 7-32. CONV_STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
SET_COUNT
R
0h
Rolling Count of Conversion Data Sets
POR
R/W1CP
1h
Device powered up, or experienced power-on-reset. Bit is clear when
host writes back '1'.
0h = No POR
1h = POR occurred
RESERVED
R
0h
Reserved
1
DIAG_STATUS
R
0h
Detect any internal diagnostics fail which include VCC UV, internal
memory CRC error, INT pin error and internal clock error. Ignore this
bit status if VCC < 2.3V.
0h = No diag fail
1h = Diag fail detected
0
RESULT_STATUS
R
0h
Conversion data buffer is ready to be read.
0h = Conversion data not complete
1h = Conversion data complete
4
3-2
7.6.1.26 ANGLE_RESULT_MSB Register (Offset = 19h) [Reset = 0h]
ANGLE_RESULT_MSB is shown in Table 7-33.
Return to the Summary Table.
Table 7-33. ANGLE_RESULT_MSB Register Field Descriptions
34
Bit
Field
Type
Reset
Description
7-0
ANGLE_RESULT_MSB
R
0h
Angle measurement result in degree. The data is displayed
from 0 to 360 degree in 13 LSB bits after combining the
ANGLE_RESULT_MSB and _LSB bits. The 4 LSB bits allocated for
fraction of an angle in the format (xxxx/16).
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7.6.1.27 ANGLE_RESULT_LSB Register (Offset = 1Ah) [Reset = 0h]
ANGLE_RESULT_LSB is shown in Table 7-34.
Return to the Summary Table.
Table 7-34. ANGLE_RESULT_LSB Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
ANGLE_RESULT_LSB
R
0h
Angle measurement result in degree. The data is displayed
from 0 to 360 degree in 13 LSB bits after combining the
ANGLE_RESULT_MSB and _LSB bits. The 4 LSB bits allocated for
fraction of an angle in the format (xxxx/16).
7.6.1.28 MAGNITUDE_RESULT Register (Offset = 1Bh) [Reset = 0h]
MAGNITUDE_RESULT is shown in Table 7-35.
Return to the Summary Table.
Table 7-35. MAGNITUDE_RESULT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MAGNITUDE_RESULT
R
0h
Resultant vector magnitude (during angle measurement) result. This
value should be constant during 360 degree measurements
7.6.1.29 DEVICE_STATUS Register (Offset = 1Ch) [Reset = 10h]
DEVICE_STATUS is shown in Table 7-36.
Return to the Summary Table.
Table 7-36. DEVICE_STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
RESERVED
R
0h
Reserved
4
INTB_RB
R
1h
Indicates the level that the device is reading back from INT pin. The
reset value of DEVICE_STATUS depends on the status of the INT
pin at power-up.
0h = INT pin driven low
1h = INT pin status high
3
OSC_ER
R/W1CP
0h
Indicates if Oscillator error is detected. Bit is clear when host writes
back '1'.
0h = No Oscillator error detected
1h = Oscillator error detected
2
INT_ER
R/W1CP
0h
Indicates if INT pin error is detected. Bit is clear when host writes
back '1'.
0h = No INT error detected
1h = INT error detected
1
OTP_CRC_ER
R/W1CP
0h
Indicates if OTP CRC error is detected. Bit is clear when host writes
back '1'.
0h = No OTP CRC error detected
1h = OTP CRC error detected
0
VCC_UV_ER
R/W1CP
0h
Indicates if VCC undervoltage was detected. Bit is clear when host
writes back '1'. Ignore this bit status if VCC < 2.3V.
0h = No VCC UV detected
1h = VCC UV detected
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
8.1.1 Select the Sensitivity Option
Select the highest TMAG5273 sensitivity option that can measure the required range of magnetic flux density so
that the ADC input range is maximized.
Larger-sized magnets and farther sensing distances can generally enable better positional accuracy than very
small magnets at close distances, because magnetic flux density increases exponentially with the proximity to a
magnet. TI created an online tool to help with simple magnet calculations under the TMAG5273 product folder
on ti.com.
8.1.2 Temperature Compensation for Magnets
The TMAG5273 temperature compensation is designed to directly compensate the average temperature drift
of several magnets as specified in the MAG_TEMPCO register bits. The residual induction (Br) of a magnet
typically reduces by 0.12%/°C for NdFeB, and 0.20%/°C for ferrite magnets as the temperature increases. Set
the MAG_TEMPCO bit to default 00b if the device temperature compensation is not needed.
8.1.3 Sensor Conversion
Multiple conversion schemes can be adopted based off the MAG_CH_EN and CONV_AVG register bits settings.
8.1.3.1 Continuous Conversion
The TMAG5273 can be set in continuous conversion mode when OPERATING_MODE is set to 10b. Figure 8-1
shows few examples of continuous conversion. The input magnetic field is processed in two steps. In the first
step the device spins the hall sensor elements, and integrates the sampled data. In the second step the ADC
block converts the analog signal into digital bits and stores in the corresponding result register. While the ADC
starts processing the first magnetic sample, the spin block can start processing another magnetic sample. In this
mode the temperature data is taken at the beginning of each new conversion. This temperature data is used to
compensate for the magnetic thermal drift.
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tstart_measure
HALL Spin &
Integraon
X-Axis
X-Axis
Temp
ADC
Iniate
Start
X-Axis
Conv me
X-Axis
Temp
Start next
Time
OPERATING_MODE = 10b, MAG_CH_EN = 0001b, CONV_AVG = 000b
tstart_measure
HALL Spin &
Integraon
X-Axis
Temp
ADC
Iniate
X-Axis
X-Axis
X-Axis
X-Axis
Conv me
Start
Temp
X-Axis
X-Axis
X-Axis
Start next
Time
OPERATING_MODE = 10b, MAG_CH_EN = 0001b, CONV_AVG = 001b
tstart_measure
HALL Spin &
Integraon
X-Axis
Temp
ADC
Iniate
Y-Axis
X-Axis
Y-Axis
Conversion me
Start
X-Axis
Z-Axis
Z-Axis
Temp
Y-Axis
X-Axis
Z-Axis
Y-Axis
Z-Axis
Start next
Time
OPERATING_MODE = 10b, MAG_CH_EN = 0111b, CONV_AVG = 000b
Figure 8-1. Continuous Conversion Examples
8.1.3.2 Trigger Conversion
The TMAG5273 supports trigger conversion with OPERATING_MODE set to 00b. The trigger event can
be initiated through I2C command or INT signal. Figure 8-2 shows an example of trigger conversion with
temperature, X, Y, and Z sensors activated.
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tstart_measure
HALL Spin &
Integraon
X-Axis
Temp
ADC
Trigger
Y-Axis
Z-Axis
Y-Axis
X-Axis
Z-Axis
Conversion me
Start
Time
Figure 8-2. Trigger Conversion for Temperature, X, Y, & Z Sensors
8.1.3.3 Pseudo-Simultaneous Sampling
In absolute angle measurement, application sensor data from multiple axes are required to calculate an accurate
angle. The magnetic field data collected at different times through the same signal chain introduces error in
angle calculation. The TMAG5273 offers pseudo-simultaneous sampling data collection modes to eliminate this
error. Figure 8-3 shows an example where MAG_CH_EN is set at 1011b to collect XZX data. Equation 18 shows
that the time stamps for the X and Z sensor data are the same.
P< =
P:1 + P:2
2
(18)
where
•
tX1, tZ, tX2 are time stamps for X, Z, X sensor data completion as defined in Figure 8-3.
HALL Spin &
Integraon
ADC
X-Axis
Temp
Z-Axis
X-Axis
Z-Axis
X-Axis
tX1
X-Axis
tZ
tX2
Time
Figure 8-3. XZX Magnetic Field Conversion
The vertical X, Y sensors of the TMAG5273 exhibit more noise than the horizontal Z sensor. The pseudosimultaneous sampling can be used to equalize the noise floor when two set of vertical sensor data are collected
against one set of horizontal sensor data, as in examples of XZX or YZY modes.
8.1.4 Magnetic Limit Check
The TMAG5273 enables magnetic limit checks for single or multiple axes at the same time. Figure 8-4
to Figure 8-7 show examples of magnetic limit cross detection events while the field going above, below,
exiting a magnetic band, and entering a magnetic band. The device will keep generating interrupt with each
new conversion if the magnetic fields remain in the shaded regions in the figures. The MAG_THR_DIR and
THR_HYST register bits help select different limit cross modes.
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X Ch Threshold
X Ch Threshold
0 mT
0 mT
X Magnec Field
X Magnec Field
Interrupt
Interrupt
Time
Time
Figure 8-4. Magnetic Upper Limit Cross Check
With MAG_THR_DIR =0b, THR_HYST = 000b
Figure 8-5. Magnetic Lower Limit Cross Check
With MAG_THR_DIR =1b, THR_HYST = 000b
X Ch Threshold
X Ch Threshold
0 mT
0 mT
X Magnec Field
X Magnec Field
- X Ch Threshold
- X Ch Threshold
Interrupt
Interrupt
Time
Figure 8-6. Magnetic Field Going Out of Band
Check With MAG_THR_DIR =0b, THR_HYST = 001b
Time
Figure 8-7. Magnetic Field Entering a Band Check
With MAG_THR_DIR =1b, THR_HYST = 001b
8.1.5 Error Calculation During Linear Measurement
The TMAG5273 offers independent configurations to perform linear position measurements in X, Y, and Z
axes. To calculate the expected error during linear measurement, the contributions from each of the individual
error sources must be understood. The relevant error sources include sensitivity error, offset, noise, cross axis
sensitivity, hysteresis, nonlinearity, drift across temperature, drift across life time, and so forth. For a 3-axis
Hall solution like the TMAG5273, the cross-axis sensitivity and hysteresis error sources are insignificant. Use
Equation 19 to estimate the linear measurement error calculation at room temperature.
where
•
•
•
•
•
ErrorLM_25C =
B × SENSER
2
2
2
+ Boff + NRMS_25
× 100%
B
(19)
ErrorLM_25C is total error in % during linear measurement at 25°C.
B is input magnetic field.
SENSER is sensitivity error in decimal number at 25°C. As an example, enter 0.05 for sensitivity error of 5%.
Boff is offset error at 25°C.
NRMS_25 is RMS noise at 25°C.
In many applications, system level calibration at room temperature can nullify the offset and sensitivity errors
at 25°C. The noise errors can be reduced by internally averaging by up to 32x on the device in addition to the
averaging that could be done in the microcontroller. Use Equation 20 to estimate the linear measurement error
across temperature after calibration at room temperature.
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where
•
•
•
•
•
ErrorLM_Temp =
B × SENSDR
2
2
2
+ Boff_DR + NRMS_Temp
× 100%
B
(20)
ErrorLM_Temp is total error in % during linear measurement across temperature after room temperature
calibration.
B is input magnetic field.
SENSDR is sensitivity drift in decimal number from value at 25°C. As an example, enter 0.05 for sensitivity
drift of 5%.
Boff_DR is offset drift from value at 25°C.
NRMS_Temp is RMS noise across temperature.
If room temperature calibration is not performed, sensitivity and offset errors at room temperature must also
account for total error calculation across temperature (see Equation 21).
where
•
ErrorLM_Temp_NCal =
B × SENSER
2
+ B × SENSDR
2
2
2
+ Boff + Boff_DR + NRMS_Temp
× 100%
B
2
(21)
ErrorLM_Temp_NCal is total error in % during linear measurement across temperature without room temperature
calibration.
Note
In this section, error sources such as system mechanical vibration, magnet temperature gradient,
earth magnetic field, nonlinearity, lifetime drift, and so forth, are not considered. The user must take
these additional error sources into account while calculating overall system error budgets.
8.1.6 Error Calculation During Angular Measurement
The TMAG5273 offers on-chip CORDIC to measure angle data from any of the two magnetic axes. The
linear magnetic axis data can be used to calculate the angle using an external CORDIC as well. To calculate
the expected error during angular measurement, the contributions from each individual error source must be
understood. The relevant error sources include sensitivity error, offset, noise, axis-axis mismatch, nonlinearity,
drift across temperature, drift across life time, and so forth. Use the Angle Error Calculation Tool to estimate the
total error during angular measurement.
8.2 Typical Application
Magnetic 3D sensors are very popular due to contactless and reliable measurements, especially in applications
requiring long-term measurements in rugged environments. The TMAG5273 offers design flexibility in wide
range of industrial and personal electronics applications. In this section three common application examples are
discussed in details.
8.2.1 Magnetic Tamper Detection
Given their susceptibility to magnetic tampering, electricity meters often include magnetic sensors designed to
detect external magnetic fields and take appropriate actions, such as disconnecting services to the electricity
meter or applying a penalty fee for tampering. Figure 8-8 shows that magnetic tampering can result from a
permanent magnet in any of the three orientations. Another form of magnetic tampering can be generated
through an external coil powered from AC supply mains. The TMAG5273 offers flexible operating modes and
configuration of three independent Hall-sensors to detect tampering.
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AC Mains
Figure 8-8. TMAG5273 Magnetic Tamper Detection
AC-DC
Converter
Main Supply
OUT
Power Mux
Main Supply
Status
Back-up Power
VCC
TEST
TMAG5273
VCC
INT
SCL
SDA
GND
µController
Back-up
Battery
GND
Figure 8-9. TMAG5273 Application Diagram for Tamper Detection
8.2.1.1 Design Requirements
Use the parameters listed in Table 8-3 for this design example.
Table 8-1. Design Parameters
DESIGN PARAMETERS
OPERATING ON AC SUPPLY
OPERATING ON BACK-UP BATTERY
Device
TMAG5273-A2
TMAG5273-A2
VCC
3.3 V
3.6 V to 1.7V
Operating Mode
Continuous measure mode
Wake-up and sleep mode
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Table 8-1. Design Parameters (continued)
DESIGN PARAMETERS
OPERATING ON AC SUPPLY
OPERATING ON BACK-UP BATTERY
Design Objective
Read the raw magnetic data and determine
the magnitude and type of tampering (AC or
DC magnetic field)
Wake up the microcontroller if magnetic
tampering occurs
Timing Budget to Detect Tampering