TMAG5328
SLYS044A – DECEMBER 2021 – REVISED JUNE 2022
TMAG5328 Resistor and Voltage Adjustable, Low-Power Hall-Effect Switch
1 Features
3 Description
•
•
The TMAG5328 device is a high precision, low-power,
resistor adjustable Hall effect switch sensor operating
at low voltage.
•
•
•
•
•
Supply Range of 1.65 V to 5.5 V
Adjustable BOP from 2 mT to 15 mT
– Using 2-kΩ to 15-kΩ resistors
– or 160-mV to 1200-mV voltage source
Omnipolar Hall switch
Push-Pull output
Low power consumption
– 20-Hz sampling rate: 1.4 µA at 3.3 V
Industry-standard package and pinout
– SOT-23 package
–40°C to 125°C operating temperature range
2 Applications
Battery-critical position sensing
Electricity meter tamper detection
Cell phone, laptop, or tablet case sensing
E-locks, smoke detectors, appliances
Medical devices, IoT systems
Valve or solenoid position detection
Contactless diagnostics or activation
With this adjustable threshold feature, the TMAG5328
allows for easy and quick prototyping, fast design to
market, reuse across different platforms and easy last
minute modifications in case of unexpected changes.
When the applied magnetic flux density exceeds the
BOP threshold, the device outputs a low voltage. The
output stays low until the flux density decreases to
less than BRP, and then the output drives a high
voltage. By incorporating an internal oscillator, the
device samples the magnetic field and updates the
output at a rate of 20 Hz for the lowest current
consumption. The TMAG5328 features an omnipolar
magnetic response.
The device operates from a VCC range of 1.65 V
to 5.5 V, and is packaged in a standard SOT-23-6
package.
Device Information
PART NUMBER
TMAG5328
(1)
PACKAGE(1)
SOT-23 (6)
BODY SIZE (NOM)
2.92 mm × 1.30 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
VCC
VCC
LDO
Low-Power
Oscillator
OUT
Device
control
ADJ
Thresholds
RADJ
•
•
•
•
•
•
•
The external resistor sets the BOP value the device
will operate from. By following a simple formula, it
is easy to calculate what resistor value is needed to
set up the right BOP value. The Hysteresis value is
fixed and therefore the BRP value is defined as BOPHysteresis.
Z
Amp
Output
control
+
GND
–
GND
Typical Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................5
6.5 Electrical Characteristics.............................................5
6.6 Magnetic Characteristics.............................................6
6.7 Typical Characteristics................................................ 7
7 Detailed Description........................................................9
7.1 Overview..................................................................... 9
7.2 Functional Block Diagram........................................... 9
7.3 Feature Description...................................................10
7.4 Device Functional Modes..........................................13
8 Application and Implementation.................................. 14
8.1 Application Information............................................. 14
8.2 Typical Applications.................................................. 19
9 Power Supply Recommendations................................21
10 Layout...........................................................................21
10.1 Layout Guidelines................................................... 21
10.2 Layout Examples.................................................... 21
11 Device and Documentation Support..........................22
11.1 Receiving Notification of Documentation Updates.. 22
11.2 Support Resources................................................. 22
11.3 Trademarks............................................................. 22
11.4 Electrostatic Discharge Caution.............................. 22
11.5 Glossary.................................................................. 22
12 Mechanical, Packaging, and Orderable
Information.................................................................... 22
4 Revision History
Changes from Revision * (December 2021) to Revision A (June 2022)
Page
• Changed data sheet status from: Advanced Information to: Production Data ...................................................1
• Added the FA and FD device versions............................................................................................................... 1
2
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5 Pin Configuration and Functions
TEST1
1
6
OUT
GND
2
5
TEST2
ADJ
3
4
VCC
Not to scale
Figure 5-1. DBV Package 6-Pin SOT-23 Top View
Table 5-1. Pin Functions
PIN
NAME
SOT-23
I/O
DESCRIPTION
GND
2
—
Ground reference
OUT
6
O
Omnipolar output that responds to north and south magnetic poles
VCC
4
—
1.65-V to 5.5-V power supply. TI recommends connecting this pin
to a ceramic capacitor to ground with a value of at least 0.1 µF
ADJ
3
I
This pin is used to set the thresholds up. Can either be connected
to a resistor or voltage source.
TEST1
1
—
TI recommends to leave this pin floating
TEST2
5
—
TI recommends connecting this pin to GND
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
Power Supply Voltage
Pin Voltage
Pin current
VCC
–0.3
5.5
OUT, TEST1
–0.3
VCC + 0.3
TEST2
–0.3
0.3
ADJ
–0.3
5.5
-5
5
OUT, TEST1
Magnetic Flux Density,BMAX
Junction temperature, TJ
UNIT
V
V
mA
Unlimited
T
Junction temperature, TJ
Storage temperature, Tstg
(1)
MAX
–65
150
°C
150
°C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
Charged device model (CDM), per ANSI/ESDA/
JEDEC JS-002, all pins(2)
± 500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VCC
VIO
4
Power supply voltage
MAX
1.65
5.5
Pin Voltage. OUT, TEST1
0
VCC
Pin Voltage. TEST2
0
0
Pin Voltage, ADJ
0
5
Io
Pin current. OUT, TEST1
TA
Ambient temperature
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UNIT
V
V
–5
5
mA
–40
125
°C
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6.4 Thermal Information
TMAG5328
THERMAL
METRIC(1)
UNIT
SOT-23 (DBV)
6 PINS
RθJA
Junction-to-ambient thermal resistance
167.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
84.1
°C/W
RθJB
Junction-to-board thermal resistance
52.2
°C/W
ΨJT
Junction-to-top characterization parameter
32
°C/W
ΨJB
Junction-to-board characterization parameter
51.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ADJ pin
ADJ_ICC
Current output source
ADJ_C
Maximum external capacitance
80
µA
50
pF
PUSH-PULL OUTPUT DRIVER
VOH
High-level output voltage
IOUT = –0.5 mA
VOL
Low-level output voltage
IOUT = 0.5 mA
Vcc –
Vcc – 0.1
0.35
0.1
V
0.3
V
TMAG5328A1D
fs
Frequency of magnetic sampling
20
Hz
ts
Period of magnetic sampling
50
ms
ICC(AVG)
Average current consumption
VCC = 3.3 V
TA = 25°C
1.4
VCC = 1.65 V to 5.5 V
1.6
µA
2.3
ALL VERSIONS
ICC(PK)
Peak current consumption
1.8
3
mA
ICC(SLP)
Sleep current consumption
300
600
nA
tON
Power-on time
125
POS
Power-on state without external magnetic
VCC > VCCMIN
field
tACTIVE
Active time period
µs
High
65
µs
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6.6 Magnetic Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TMAG5328A1D
BOP(Range A)
Adjustable Operate Point
±2
±15
mT
BRP(Range A)
Adjustable Release Point
±1
±14
mT
VADJ (Range A)
Voltage range
160
1200
mV
2
15
RADJ (Range A)
6
Resistor range
mT/
kOhm
BOP(RADJ)
BOP/R
±1
BOP_ACC(RADJ)
BOP Accuracy
BOPSET ± BOP(MAX/MIN))/BOPSET
2 mT ≤ BOPSET < 6 mT
–0.85
0.85
6 mT ≤ BOPSET ≤15 mT
–1.75
1.75
BRP_ACC(RADJ)
BRP Accuracy
BRPSET ± BRP(MAX/MIN)
2 mT ≤ BOPSET < 6 mT
–1
1
6 mT ≤ BOPSET ≤15 mT
-2.1
BHYSA(RADJ)
Magnetic hysteresis
|BOP - BRP|
0.25
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kOhm
mT
2.1
1
1.6
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6.7 Typical Characteristics
4
4
BOPS
BOPN
BRPS
BOPS
BRPN
Magnetic Threshold (mT)
Magnetic Threshold (mT)
2
1
0
-1
-2
-15
10
35
60
85
Temperature (C)
110
1
0
-1
-2
-4
1.65
135 150
2.65
3.65
Supply Voltage (V)
12
BOPS
BOPN
BRPS
BOPS
BRPN
BOPN
BRPS
BRPN
8
Magnetic Threshold (mT)
8
Magnetic Threshold (mT)
5.5
Figure 6-2. 2-mT Magnetic Threshold vs Supply
12
4
0
-4
4
0
-4
-8
-8
-15
10
35
60
85
Temperature (C)
110
-12
1.65
135 150
2.65
3.65
Supply Voltage (V)
4.65
5.5
TA = 25°C
VCC = 3.3 V
Figure 6-3. 7.5-mT Magnetic Threshold vs
Temperature
Figure 6-4. 7.5-mT Magnetic Threshold vs Supply
25
25
BOPS
20
BOPN
BRPS
BRPN
15
20
Magnetic Threshold (mT)
Magnetic Threshold (mT)
4.65
TA = 25°C
Figure 6-1. 2-mT Magnetic Threshold vs
Temperature
10
5
0
-5
-10
-15
BOPS
BOPN
BRPS
BRPN
15
10
5
0
-5
-10
-15
-20
-20
-25
-40
BRPN
2
VCC = 3.3 V
-12
-40
BRPS
-3
-3
-4
-40
BOPN
3
3
-15
10
35
60
85
Temperature (C)
110
135 150
-25
1.65
2.65
3.65
Supply Voltage (V)
4.65
5.5
TA = 25°C
VCC = 3.3 V
Figure 6-5. 15-mT Magnetic Threshold vs
Temperature
Figure 6-6. 15-mT Magnetic Threshold vs Supply
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2
1.75
1.65 V
3.3 V
5.5 V
Current (A)
1.5
1.25
1
0.75
0.5
0.25
0
-40
-15
10
35
60
85
Temperature (C)
110
135 150
Sampling Rate = 20 Hz
Figure 6-7. Average ICC vs Temperature
8
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7 Detailed Description
7.1 Overview
The TMAG5328 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a
low-frequency oscillator that enables ultra-low average power consumption.
While most of the Hall effect sensor have fixed threshold, the TMAG5328 offers an extra pin that allows the user
to set up a specific threshold of operation. This pin can either be connected to a resistor or a voltage source.
While the value can be set at production, it is also possible to allow dynamic change of either the resistor value
or the voltage value to dynamically change the threshold value.
Operating from a 1.65-V to 5.5-V supply, the device periodically measures magnetic flux density, updates the
output, and enters into a low-power sleep state.
7.2 Functional Block Diagram
VCC
VCC
LDO
Low-Power
Oscillator
OUT
Device
control
ADJ
RADJ
Thresholds
Z
Amp
Output
control
+
GND
–
GND
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7.3 Feature Description
7.3.1 Magnetic Flux Direction
Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This
condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the
top to the bottom of the package results in negative millitesla values.
positive B
negative B
N
S
S
N
PCB
PCB
Figure 7-1. Flux Direction Polarity
7.3.2 Magnetic Response
The TMAG5328A1D has omnipolar functionality, so the device responds to both positive and negative magnetic
flux densities, as shown in Figure 7-2.
OUT
BHYS
BHYS
VCC
0V
north
BOP BRP
0 mT
B
BRP BOP
south
Figure 7-2. Omnipolar Functionality
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7.3.3 Output Type
. The TMAG5328A1D also has a push-pull CMOS output.
VCC
Output
Control
Output
Figure 7-3. Push-Pull Output (Simplified)
7.3.4 Sampling Rate
When the TMAG5328 device powers up, the device measures the first magnetic sample and sets the output
within the tON time. The output is latched, and the device enters an ultra-low-power sleep state. After each tActive
time has passed, the device measures a new sample and updates the output if necessary. If the magnetic field
does not change between periods, the output also does not change.
While in active mode, the part will go through different steps. The content of the OTP (One-Time-Programmable
Memory) is loaded first, and this steps takes about 35 µs and consumes around 350 µA. For the next 5 µs, the
current source will be started and settled. The part now consumes around 650 µA in this step. Finally, the part
conducts the Hall sensor conversion for about 25 µs and consumes the peak current of around 2 mA.
Supply (V)
VCC
VCC(min)
0V
ICC(mA)
t (s)
tON
tACTIVE
tACTIVE
ICC(PK)
ICC(SLP)
t (s)
Output (V)
High
Invalid
1st sample
2nd sample
Low
t (s)
Figure 7-4. Timing Diagram
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7.3.5 Adjustable Threshold
While most Hall Effect switch sensors have fixed magnetic characteristics, the TMAG5328 offers a wide range of
adjustable thresholds. The user can use the "ADJ" pin to set the value of BOP threshold. This pin can be used
in two different ways. A resistor or a voltage source can be applied on "ADJ". In both scenarios, the resistor or
voltage value will define the position of the BOP. While the B OP can be adjusted, the hysteresis has a fixed value.
BRP is therefore defined as BOP-Hysteresis.
An 80-µA current is generated on pin "ADJ" when the part goes into active mode. The device then reads the
"ADJ" pin and defines the value of BOP. The TMAG5328 supports adjusting the BOP dynamically. If the "ADJ" pin
value is adjusted while the sensor is in sleep mode, the BOP will update at the next active period of the device.
Consequently, the maximum time it could take for the BOP to update is equal to the period of magnetic sampling,
ts.
7.3.5.1 Adjustable Resistor
One way to setup the BOP is to connect a resistor to the "ADJ" pin. The device generates a fixed current that
is injected in the external resistor. This will generate a voltage that represents the BOP value. The relationship
between BOP and resistance is defined as BOP(mT) = RADJ(kΩ). Please note that the generated current on the
"ADJ" pin is only present when the device is in active mode and it is turned OFF when in sleep mode. As a
result, the voltage on the "ADJ" pin is only present when the device is in active mode, which is a small duration
compared to the time the device is in sleep mode.
The device BOP must be set to any value between 2 mT and 15 mT. This means RADJ must be set between 2 kΩ
and 15 kΩ. Operating above and beyond those limits is not recommended and could result in either getting the
wrong threshold set or locking up the device into a specific state without the possibility of exiting.
Figure 7-5 shows the relationship between BOP and RADJ.
BOP
15mT
8.5mT
2mT
RADJ
Short pin
2kOhm
8.5kOhm
15kOhm
Open pin
Figure 7-5. BOP vs RADJ
12
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7.3.5.2 Adjustable Voltage
One other way to setup the BOP is to apply a voltage to the "ADJ" pin. This voltage is directly proportional to the
BOP value. The relationship between BOP and voltage is defined as BOP(mT)= VADJ(mV) × 0.0125. To apply a
voltage on the "ADJ" pin, the voltage source must be able to settle within 4 us after being exposed to a 80 uA
current on the ADJ pin.
The device BOP must be set to any value between 2 mT and 15 mT. This means VADJ must be set between
160 mV and 1200 mV. Operating above and beyond those limits is not recommended and could result in either
getting the wrong threshold set or locking up the device into a specific state without the possibility of exiting.
Figure 7-6 shows the relationship between BOP and VADJ.
BOP
15mT
8.5mT
2mT
VADJ
Short pin
680mV
160mV
1200mV
Open pin
Figure 7-6. BOP vs RADJ
7.3.6 Hall Element Location
Figure 7-7 shows the sensing element location inside the device.
6
5
4
Sensor location:
X1: 1.468 mm
X2: 1.458
Y1
X2
X1
Y1: 0.9925 mm
Y2: 0.6335 mm
Y2
Z1: 0.665 mm
Z2: 0.475 mm
1
2
3
Z1
Z2
Figure 7-7. Hall Element Location
7.4 Device Functional Modes
The TMAG5328 device has one mode of operation that applies when the Recommended Operating Conditions
are met.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TMAG5328 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
8.1.1 Output Type Tradeoffs
The push-pull output allows for the lowest system power consumption, because there is no current leakage path
when the output drives high or low. The open-drain output involves a leakage path when the output drives low,
through the external pullup resistor.
The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor
drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of
sensors.
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8.1.2 Valid TMAG5328 Configurations
The TMAG5328 BOP is set by connecting a resistor or a voltage source to the “ADJ” pin. Figure 8-1 shows how
to use resistor R1 to set the BOP. Figure 8-2 shows hows to use a DAC as a voltage source for setting the BOP.
Using the DAC allows the user to dynamically change the BOP with software. To use a DAC, the output of the
DAC must settle within 4 µs after the 80-µA current source of the “ADJ” pin is turned ON.
V+
V+
C1
VCC
C2
VCC
GND
GND
ADJ
TMAG5328
GPIO
OUT
Microcontroller
TEST1
R1
TEST2
GND
GND
GND
GND
Figure 8-1. Setting BOP of One TMAG5328 Device Using a Resistor
V+
V+
C1
VDD
VCC
C3
GND
R1
GND
SCL
SCL
R2
CAP
DAC43701
Microcontroller
SDA
SDA
V+
GPI
C2
GPIO1
R3
GND
FB
VCC
OUT
GND
GND
AGND
ADJ
TMAG5328
OUT
TEST1
TEST2
GND
GND
GND
GND
Figure 8-2. Setting BOP of One TMAG5328 Device Using a DAC
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As a DAC alternative, Figure 8-3 shows how a voltage divider may be used as a voltage source. In Figure 8-3,
an operational amplifier is placed between the voltage divider and the “ADJ” pin so that the voltage fed to the
“ADJ” pin is not impacted by the internal current source of the TMAG5328 when the current source is turned ON.
To use an op amp, the output of the op amp must settle within 4 µs after the 80-µA current source of the “ADJ”
pin is turned ON.
V+
V+
V+
C1
VCC
VCC
C2
V+
C3
GND
–
GND
GND
R1
ADJ
TLV9001
TMAG5328
Microcontroller
GPIO
OUT
+
TEST1
GND
TEST2
R2
GND
GND
GND
GND
GND
Figure 8-3. Setting BOP of One TMAG5328 Device Using a Voltage Divider
A potentiometer or rheostat may be integrated into a voltage divider, and the user can adjust this potentiometer
to dynamically update the BOP. Figure 8-4 shows how to use a potentiometer in a voltage divider to set the
BOP of the TMAG5328. The maximum output voltage, which determines the maximum BOP, is set based on the
values of resistors R1 and R3. The minimum output voltage, which determines the minimum BOP, is set based
on the values of the maximum potentiometer resistance, R1’s resistance, and R3’s resistance. The user should
select a minimum output voltage greater than 0.16 V and a maximum output voltage less than 1.2 V.
V+
V+
V+
C1
VCC
VCC
C2
C3
V+
GND
–
R1
TLV9001
ADJ
TMAG5328
OUT
R2
GPIO
Microcontroller
+
R3
GND
TEST1
TEST2
GND
GND
GND
GND
GND
Figure 8-4. Setting BOP of One TMAG5328 Device Using a Voltage Divider and Potentiometer
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Figure 8-5 shows how the TMAG5328’s internal current source can drive a apotentiometer or rheostat instead of
a voltage divider. In this implementation, resistor R2 should be at least 2 kΩ to ensure that the “ADJ” resistance
is always above its minimum 2 kΩ. The sum of the maximum potentiometer resistance and the resistance of R1
must also be less than 15 kΩ.
V+
V+
VCC
VCC
C1
C2
GND
GND
ADJ
TMAG5328
OUT
GPIO
Microcontroller
R1
TEST1
R2
TEST2
GND
GND
GND
GND
Figure 8-5. Setting BOP of One TMAG5328 Device Using a Potentiometer and the TMAG5328’s Internal
Current Source
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Multiple TMAG5328 devices may be used in the same system. When setting the BOP using a resistor, TI
recommends that each TMAG5328 has its own “ADJ” resistor, even if multiple TMAG5328 devices have the
same “ADJ” resistor value. Figure 8-6 shows an example implementation that has three TMAG5328 devices. If
each device is set to the same BOP, then the resistances of R1, R2, and R3 are equal.
V+
VCC
V+
C1
C5
GPIO1
GND
GND
GPIO2
VCC
GPIO3
R1
ADJ
Microcontroller
TMAG5328
OUT
GND
TEST1
TEST2
GND
GND
GND
V+
C2
GND
GND
VCC
R2
ADJ
TMAG5328
OUT
GND
TEST1
TEST2
GND
GND
V+
C3
GND
VCC
R3
ADJ
TMAG5328
OUT
GND
TEST1
TEST2
GND
GND
Figure 8-6. Setting BOP of Three TMAG5328 Devices Using Three Resistors
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When setting the BOP using a DAC, one DAC can be used to set the “ADJ” pin voltage of multiple devices only
if the DAC’s output could sink the current from all of the TMAG5328 devices. Figure 8-7 shows an example of
a DAC driving the “ADJ” pin of three TMAG5328 devices. A DAC can only work reliably in this specific scenario
if the DAC’s output can settle within 4 µs after being exposed to the three “ADJ” current sources. Each current
source is 80 µA, therefore the DAC can only reliably work if the DAC's output can settle within 4 µs after being
exposed to 80 x 3 = 240 µA of current.
V+
V+
C1
VDD
VCC
C5
GND
R1
GND
SCL
SCL
R2
CAP
DAC43701
SDA
SDA
Microcontroller
V+
GPI
C2
GPIO1
R3
GND
FB
VCC
OUT
GND
GND
AGND
ADJ
TMAG5328
OUT
GND
TEST1
TEST2
GND
GND
GND
V+
C3
GND
VCC
ADJ
TMAG5328
OUT
TEST1
TEST2
GND
GND
V+
C4
GND
VCC
ADJ
TMAG5328
OUT
TEST1
TEST2
GND
GND
Figure 8-7. Setting BOP of Three TMAG5328 Devices Using a DAC
8.2 Typical Applications
The TMAG5328 can be used in a large variety of industrial applications. For almost all these applications, the
sensor is fixed and the magnet is attached to a movable component in the system.
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8.2.1 Refrigerator Door Open/Close Detection
This application section describes how to use the same device for two identical applications with different
mechanical characteristic.
2°
2°
Refrigerator door 1
D1
D2
Refrigerator door 2
F1
F2
Figure 8-8. Refrigerator 1 and Refrigerator 2 Principal Diagram
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 8-1.
Table 8-1. Design Parameters for Fridge 1
DESIGN PARAMETER
EXAMPLE VALUE
Hall effect device
TMAG5328A1D
VCC
5V
Magnet
10 mm cubic N35
D1
7.025 mm
F1
500 mm
Door opening angle
2°
Calculated threshold needed (BOP)
7.87 mT
RADJ
7.87 kΩ
Table 8-2. Design Parameters for Fridge 2
DESIGN PARAMETER
EXAMPLE VALUE
Hall effect device
TMAG5328A1D
VCC
5V
Magnet
10 mm cubic N35
D2
16.08 mm
F2
500 mm
Door opening angle
2°
Calculated threshold needed (BOP)
3.49 mT
RADJ
3.48 kΩ
8.2.1.2 Detailed Design Procedure
For both applications, the Hall sensor is used to detect if the refrigerator door is open or closed. Both refrigerator
doors are different from each other and therefore have different mechanical design. This means the Hall sensor
and the magnet are positioned differently from each other. In other terms, if the user wants to detect a specific
distance for both refrigerator doors, they must use either a different magnet or a different sensor. For the
purpose of this application, there is no flexibility in the choice of magnet. The electronic board will also be reused
across platforms and therefore will use the same sensor.
The TMAG5328 is a resistor adjustable Hall effect switch that allows the user to set up whatever threshold is
needed between 2 mT and 15 mT.
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For this application, the refrigerator door manufacturer can use the same printed circuit board (PCB) with the
same semiconductor content and only has to change the resistor value depending on which refrigerator version
is manufactured.
For both refrigerator doors, the opening angle is the same. Now refrigerator door 1 is a thinner model than
refrigerator door 2. This means the PCB is located further away for refrigerator door 2 and therefore the
sensitivity required to detect the position of the door will be impacted.
Knowing the door dimensions, the door opening angle required, and the distance from the magnet to the PCB, it
is possible to use a simulation tool that will calculate the magnet strength at the desired position. For refrigerator
door 1, the sensitivity calculated is 7.87 mT at a distance of 7.025 mm. For Refrigerator 2, the sensitivity is 3.49
mT at a distance of 16.08 mm. Based on those values, a resistor value can be selected from the E48 series. A
resistor of 7.87 kΩ can be used for refrigerator door 1 and resistor of 3.48 kΩ can be used for refrigerator door 2.
9 Power Supply Recommendations
The TMAG5328 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
10 Layout
10.1 Layout Guidelines
Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards, which makes placing the magnet on the
opposite side possible.
10.2 Layout Examples
TEST1
OUT
GND
GND
TEST2
RADJ
GND
ADJ
VCC
VCC
SOT-23
Figure 10-1. Layout Examples
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
11.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TMAG5328A1DQDBVR
ACTIVE
SOT-23
DBV
6
3000
RoHS & Green
SN
Level-1-260C-UNLIM
-40 to 125
A1D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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