TMAG5328A1DQDBVR

TMAG5328 SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 TMAG5328 Resistor and Voltage Adjustable, Low-Power Hall-Effect Switch 1 Features 3 Description • • The TMAG5328 device is a high precision, low-power, resistor adjustable Hall effect switch sensor operating at low voltage. • • • • • Supply Range of 1.65 V to 5.5 V Adjustable BOP from 2 mT to 15 mT – Using 2-kΩ to 15-kΩ resistors – or 160-mV to 1200-mV voltage source Omnipolar Hall switch Push-Pull output Low power consumption – 20-Hz sampling rate: 1.4 µA at 3.3 V Industry-standard package and pinout – SOT-23 package –40°C to 125°C operating temperature range 2 Applications Battery-critical position sensing Electricity meter tamper detection Cell phone, laptop, or tablet case sensing E-locks, smoke detectors, appliances Medical devices, IoT systems Valve or solenoid position detection Contactless diagnostics or activation With this adjustable threshold feature, the TMAG5328 allows for easy and quick prototyping, fast design to market, reuse across different platforms and easy last minute modifications in case of unexpected changes. When the applied magnetic flux density exceeds the BOP threshold, the device outputs a low voltage. The output stays low until the flux density decreases to less than BRP, and then the output drives a high voltage. By incorporating an internal oscillator, the device samples the magnetic field and updates the output at a rate of 20 Hz for the lowest current consumption. The TMAG5328 features an omnipolar magnetic response. The device operates from a VCC range of 1.65 V to 5.5 V, and is packaged in a standard SOT-23-6 package. Device Information PART NUMBER TMAG5328 (1) PACKAGE(1) SOT-23 (6) BODY SIZE (NOM) 2.92 mm × 1.30 mm For all available packages, see the orderable addendum at the end of the data sheet. VCC VCC LDO Low-Power Oscillator OUT Device control ADJ Thresholds RADJ • • • • • • • The external resistor sets the BOP value the device will operate from. By following a simple formula, it is easy to calculate what resistor value is needed to set up the right BOP value. The Hysteresis value is fixed and therefore the BRP value is defined as BOPHysteresis. Z Amp Output control + GND – GND Typical Schematic An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 Table of Contents 1 Features............................................................................1 2 Applications..................................................................... 1 3 Description.......................................................................1 4 Revision History.............................................................. 2 5 Pin Configuration and Functions...................................3 6 Specifications.................................................................. 4 6.1 Absolute Maximum Ratings........................................ 4 6.2 ESD Ratings............................................................... 4 6.3 Recommended Operating Conditions.........................4 6.4 Thermal Information....................................................5 6.5 Electrical Characteristics.............................................5 6.6 Magnetic Characteristics.............................................6 6.7 Typical Characteristics................................................ 7 7 Detailed Description........................................................9 7.1 Overview..................................................................... 9 7.2 Functional Block Diagram........................................... 9 7.3 Feature Description...................................................10 7.4 Device Functional Modes..........................................13 8 Application and Implementation.................................. 14 8.1 Application Information............................................. 14 8.2 Typical Applications.................................................. 19 9 Power Supply Recommendations................................21 10 Layout...........................................................................21 10.1 Layout Guidelines................................................... 21 10.2 Layout Examples.................................................... 21 11 Device and Documentation Support..........................22 11.1 Receiving Notification of Documentation Updates.. 22 11.2 Support Resources................................................. 22 11.3 Trademarks............................................................. 22 11.4 Electrostatic Discharge Caution.............................. 22 11.5 Glossary.................................................................. 22 12 Mechanical, Packaging, and Orderable Information.................................................................... 22 4 Revision History Changes from Revision * (December 2021) to Revision A (June 2022) Page • Changed data sheet status from: Advanced Information to: Production Data ...................................................1 • Added the FA and FD device versions............................................................................................................... 1 2 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 5 Pin Configuration and Functions TEST1 1 6 OUT GND 2 5 TEST2 ADJ 3 4 VCC Not to scale Figure 5-1. DBV Package 6-Pin SOT-23 Top View Table 5-1. Pin Functions PIN NAME SOT-23 I/O DESCRIPTION GND 2 — Ground reference OUT 6 O Omnipolar output that responds to north and south magnetic poles VCC 4 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground with a value of at least 0.1 µF ADJ 3 I This pin is used to set the thresholds up. Can either be connected to a resistor or voltage source. TEST1 1 — TI recommends to leave this pin floating TEST2 5 — TI recommends connecting this pin to GND Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 3 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN Power Supply Voltage Pin Voltage Pin current VCC –0.3 5.5 OUT, TEST1 –0.3 VCC + 0.3 TEST2 –0.3 0.3 ADJ –0.3 5.5 -5 5 OUT, TEST1 Magnetic Flux Density,BMAX Junction temperature, TJ UNIT V V mA Unlimited T Junction temperature, TJ Storage temperature, Tstg (1) MAX –65 150 °C 150 °C Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±2000 Charged device model (CDM), per ANSI/ESDA/ JEDEC JS-002, all pins(2) ± 500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VCC VIO 4 Power supply voltage MAX 1.65 5.5 Pin Voltage. OUT, TEST1 0 VCC Pin Voltage. TEST2 0 0 Pin Voltage, ADJ 0 5 Io Pin current. OUT, TEST1 TA Ambient temperature Submit Document Feedback UNIT V V –5 5 mA –40 125 °C Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 6.4 Thermal Information TMAG5328 THERMAL METRIC(1) UNIT SOT-23 (DBV) 6 PINS RθJA Junction-to-ambient thermal resistance 167.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84.1 °C/W RθJB Junction-to-board thermal resistance 52.2 °C/W ΨJT Junction-to-top characterization parameter 32 °C/W ΨJB Junction-to-board characterization parameter 51.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ADJ pin ADJ_ICC Current output source ADJ_C Maximum external capacitance 80 µA 50 pF PUSH-PULL OUTPUT DRIVER VOH High-level output voltage IOUT = –0.5 mA VOL Low-level output voltage IOUT = 0.5 mA Vcc – Vcc – 0.1 0.35 0.1 V 0.3 V TMAG5328A1D fs Frequency of magnetic sampling 20 Hz ts Period of magnetic sampling 50 ms ICC(AVG) Average current consumption VCC = 3.3 V TA = 25°C 1.4 VCC = 1.65 V to 5.5 V 1.6 µA 2.3 ALL VERSIONS ICC(PK) Peak current consumption 1.8 3 mA ICC(SLP) Sleep current consumption 300 600 nA tON Power-on time 125 POS Power-on state without external magnetic VCC > VCCMIN field tACTIVE Active time period µs High 65 µs Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 5 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 6.6 Magnetic Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TMAG5328A1D BOP(Range A) Adjustable Operate Point ±2 ±15 mT BRP(Range A) Adjustable Release Point ±1 ±14 mT VADJ (Range A) Voltage range 160 1200 mV 2 15 RADJ (Range A) 6 Resistor range mT/ kOhm BOP(RADJ) BOP/R ±1 BOP_ACC(RADJ) BOP Accuracy BOPSET ± BOP(MAX/MIN))/BOPSET 2 mT ≤ BOPSET < 6 mT –0.85 0.85 6 mT ≤ BOPSET ≤15 mT –1.75 1.75 BRP_ACC(RADJ) BRP Accuracy BRPSET ± BRP(MAX/MIN) 2 mT ≤ BOPSET < 6 mT –1 1 6 mT ≤ BOPSET ≤15 mT -2.1 BHYSA(RADJ) Magnetic hysteresis |BOP - BRP| 0.25 Submit Document Feedback kOhm mT 2.1 1 1.6 Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 6.7 Typical Characteristics 4 4 BOPS BOPN BRPS BOPS BRPN Magnetic Threshold (mT) Magnetic Threshold (mT) 2 1 0 -1 -2 -15 10 35 60 85 Temperature (C) 110 1 0 -1 -2 -4 1.65 135 150 2.65 3.65 Supply Voltage (V) 12 BOPS BOPN BRPS BOPS BRPN BOPN BRPS BRPN 8 Magnetic Threshold (mT) 8 Magnetic Threshold (mT) 5.5 Figure 6-2. 2-mT Magnetic Threshold vs Supply 12 4 0 -4 4 0 -4 -8 -8 -15 10 35 60 85 Temperature (C) 110 -12 1.65 135 150 2.65 3.65 Supply Voltage (V) 4.65 5.5 TA = 25°C VCC = 3.3 V Figure 6-3. 7.5-mT Magnetic Threshold vs Temperature Figure 6-4. 7.5-mT Magnetic Threshold vs Supply 25 25 BOPS 20 BOPN BRPS BRPN 15 20 Magnetic Threshold (mT) Magnetic Threshold (mT) 4.65 TA = 25°C Figure 6-1. 2-mT Magnetic Threshold vs Temperature 10 5 0 -5 -10 -15 BOPS BOPN BRPS BRPN 15 10 5 0 -5 -10 -15 -20 -20 -25 -40 BRPN 2 VCC = 3.3 V -12 -40 BRPS -3 -3 -4 -40 BOPN 3 3 -15 10 35 60 85 Temperature (C) 110 135 150 -25 1.65 2.65 3.65 Supply Voltage (V) 4.65 5.5 TA = 25°C VCC = 3.3 V Figure 6-5. 15-mT Magnetic Threshold vs Temperature Figure 6-6. 15-mT Magnetic Threshold vs Supply Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 7 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 2 1.75 1.65 V 3.3 V 5.5 V Current (A) 1.5 1.25 1 0.75 0.5 0.25 0 -40 -15 10 35 60 85 Temperature (C) 110 135 150 Sampling Rate = 20 Hz Figure 6-7. Average ICC vs Temperature 8 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 7 Detailed Description 7.1 Overview The TMAG5328 device is a magnetic sensor with a digital output that indicates when the magnetic flux density threshold has been crossed. The device integrates a Hall effect element, analog signal conditioning, and a low-frequency oscillator that enables ultra-low average power consumption. While most of the Hall effect sensor have fixed threshold, the TMAG5328 offers an extra pin that allows the user to set up a specific threshold of operation. This pin can either be connected to a resistor or a voltage source. While the value can be set at production, it is also possible to allow dynamic change of either the resistor value or the voltage value to dynamically change the threshold value. Operating from a 1.65-V to 5.5-V supply, the device periodically measures magnetic flux density, updates the output, and enters into a low-power sleep state. 7.2 Functional Block Diagram VCC VCC LDO Low-Power Oscillator OUT Device control ADJ RADJ Thresholds Z Amp Output control + GND – GND Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 9 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 7.3 Feature Description 7.3.1 Magnetic Flux Direction Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the top to the bottom of the package results in negative millitesla values. positive B negative B N S S N PCB PCB Figure 7-1. Flux Direction Polarity 7.3.2 Magnetic Response The TMAG5328A1D has omnipolar functionality, so the device responds to both positive and negative magnetic flux densities, as shown in Figure 7-2. OUT BHYS BHYS VCC 0V north BOP BRP 0 mT B BRP BOP south Figure 7-2. Omnipolar Functionality 10 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 7.3.3 Output Type . The TMAG5328A1D also has a push-pull CMOS output. VCC Output Control Output Figure 7-3. Push-Pull Output (Simplified) 7.3.4 Sampling Rate When the TMAG5328 device powers up, the device measures the first magnetic sample and sets the output within the tON time. The output is latched, and the device enters an ultra-low-power sleep state. After each tActive time has passed, the device measures a new sample and updates the output if necessary. If the magnetic field does not change between periods, the output also does not change. While in active mode, the part will go through different steps. The content of the OTP (One-Time-Programmable Memory) is loaded first, and this steps takes about 35 µs and consumes around 350 µA. For the next 5 µs, the current source will be started and settled. The part now consumes around 650 µA in this step. Finally, the part conducts the Hall sensor conversion for about 25 µs and consumes the peak current of around 2 mA. Supply (V) VCC VCC(min) 0V ICC(mA) t (s) tON tACTIVE tACTIVE ICC(PK) ICC(SLP) t (s) Output (V) High Invalid 1st sample 2nd sample Low t (s) Figure 7-4. Timing Diagram Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 11 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 7.3.5 Adjustable Threshold While most Hall Effect switch sensors have fixed magnetic characteristics, the TMAG5328 offers a wide range of adjustable thresholds. The user can use the "ADJ" pin to set the value of BOP threshold. This pin can be used in two different ways. A resistor or a voltage source can be applied on "ADJ". In both scenarios, the resistor or voltage value will define the position of the BOP. While the B OP can be adjusted, the hysteresis has a fixed value. BRP is therefore defined as BOP-Hysteresis. An 80-µA current is generated on pin "ADJ" when the part goes into active mode. The device then reads the "ADJ" pin and defines the value of BOP. The TMAG5328 supports adjusting the BOP dynamically. If the "ADJ" pin value is adjusted while the sensor is in sleep mode, the BOP will update at the next active period of the device. Consequently, the maximum time it could take for the BOP to update is equal to the period of magnetic sampling, ts. 7.3.5.1 Adjustable Resistor One way to setup the BOP is to connect a resistor to the "ADJ" pin. The device generates a fixed current that is injected in the external resistor. This will generate a voltage that represents the BOP value. The relationship between BOP and resistance is defined as BOP(mT) = RADJ(kΩ). Please note that the generated current on the "ADJ" pin is only present when the device is in active mode and it is turned OFF when in sleep mode. As a result, the voltage on the "ADJ" pin is only present when the device is in active mode, which is a small duration compared to the time the device is in sleep mode. The device BOP must be set to any value between 2 mT and 15 mT. This means RADJ must be set between 2 kΩ and 15 kΩ. Operating above and beyond those limits is not recommended and could result in either getting the wrong threshold set or locking up the device into a specific state without the possibility of exiting. Figure 7-5 shows the relationship between BOP and RADJ. BOP 15mT 8.5mT 2mT RADJ Short pin 2kOhm 8.5kOhm 15kOhm Open pin Figure 7-5. BOP vs RADJ 12 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 7.3.5.2 Adjustable Voltage One other way to setup the BOP is to apply a voltage to the "ADJ" pin. This voltage is directly proportional to the BOP value. The relationship between BOP and voltage is defined as BOP(mT)= VADJ(mV) × 0.0125. To apply a voltage on the "ADJ" pin, the voltage source must be able to settle within 4 us after being exposed to a 80 uA current on the ADJ pin. The device BOP must be set to any value between 2 mT and 15 mT. This means VADJ must be set between 160 mV and 1200 mV. Operating above and beyond those limits is not recommended and could result in either getting the wrong threshold set or locking up the device into a specific state without the possibility of exiting. Figure 7-6 shows the relationship between BOP and VADJ. BOP 15mT 8.5mT 2mT VADJ Short pin 680mV 160mV 1200mV Open pin Figure 7-6. BOP vs RADJ 7.3.6 Hall Element Location Figure 7-7 shows the sensing element location inside the device. 6 5 4 Sensor location: X1: 1.468 mm X2: 1.458 Y1 X2 X1 Y1: 0.9925 mm Y2: 0.6335 mm Y2 Z1: 0.665 mm Z2: 0.475 mm 1 2 3 Z1 Z2 Figure 7-7. Hall Element Location 7.4 Device Functional Modes The TMAG5328 device has one mode of operation that applies when the Recommended Operating Conditions are met. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 13 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 8 Application and Implementation Note Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality. 8.1 Application Information The TMAG5328 device is typically used to detect the proximity of a magnet. The magnet is often attached to a movable component in the system. 8.1.1 Output Type Tradeoffs The push-pull output allows for the lowest system power consumption, because there is no current leakage path when the output drives high or low. The open-drain output involves a leakage path when the output drives low, through the external pullup resistor. The open-drain outputs of multiple devices can be tied together to form a logical AND. In this setup, if any sensor drives low, the voltage on the shared node becomes low. This can allow a single GPIO to measure an array of sensors. 14 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 8.1.2 Valid TMAG5328 Configurations The TMAG5328 BOP is set by connecting a resistor or a voltage source to the “ADJ” pin. Figure 8-1 shows how to use resistor R1 to set the BOP. Figure 8-2 shows hows to use a DAC as a voltage source for setting the BOP. Using the DAC allows the user to dynamically change the BOP with software. To use a DAC, the output of the DAC must settle within 4 µs after the 80-µA current source of the “ADJ” pin is turned ON. V+ V+ C1 VCC C2 VCC GND GND ADJ TMAG5328 GPIO OUT Microcontroller TEST1 R1 TEST2 GND GND GND GND Figure 8-1. Setting BOP of One TMAG5328 Device Using a Resistor V+ V+ C1 VDD VCC C3 GND R1 GND SCL SCL R2 CAP DAC43701 Microcontroller SDA SDA V+ GPI C2 GPIO1 R3 GND FB VCC OUT GND GND AGND ADJ TMAG5328 OUT TEST1 TEST2 GND GND GND GND Figure 8-2. Setting BOP of One TMAG5328 Device Using a DAC Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 15 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 As a DAC alternative, Figure 8-3 shows how a voltage divider may be used as a voltage source. In Figure 8-3, an operational amplifier is placed between the voltage divider and the “ADJ” pin so that the voltage fed to the “ADJ” pin is not impacted by the internal current source of the TMAG5328 when the current source is turned ON. To use an op amp, the output of the op amp must settle within 4 µs after the 80-µA current source of the “ADJ” pin is turned ON. V+ V+ V+ C1 VCC VCC C2 V+ C3 GND – GND GND R1 ADJ TLV9001 TMAG5328 Microcontroller GPIO OUT + TEST1 GND TEST2 R2 GND GND GND GND GND Figure 8-3. Setting BOP of One TMAG5328 Device Using a Voltage Divider A potentiometer or rheostat may be integrated into a voltage divider, and the user can adjust this potentiometer to dynamically update the BOP. Figure 8-4 shows how to use a potentiometer in a voltage divider to set the BOP of the TMAG5328. The maximum output voltage, which determines the maximum BOP, is set based on the values of resistors R1 and R3. The minimum output voltage, which determines the minimum BOP, is set based on the values of the maximum potentiometer resistance, R1’s resistance, and R3’s resistance. The user should select a minimum output voltage greater than 0.16 V and a maximum output voltage less than 1.2 V. V+ V+ V+ C1 VCC VCC C2 C3 V+ GND – R1 TLV9001 ADJ TMAG5328 OUT R2 GPIO Microcontroller + R3 GND TEST1 TEST2 GND GND GND GND GND Figure 8-4. Setting BOP of One TMAG5328 Device Using a Voltage Divider and Potentiometer 16 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 Figure 8-5 shows how the TMAG5328’s internal current source can drive a apotentiometer or rheostat instead of a voltage divider. In this implementation, resistor R2 should be at least 2 kΩ to ensure that the “ADJ” resistance is always above its minimum 2 kΩ. The sum of the maximum potentiometer resistance and the resistance of R1 must also be less than 15 kΩ. V+ V+ VCC VCC C1 C2 GND GND ADJ TMAG5328 OUT GPIO Microcontroller R1 TEST1 R2 TEST2 GND GND GND GND Figure 8-5. Setting BOP of One TMAG5328 Device Using a Potentiometer and the TMAG5328’s Internal Current Source Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 17 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 Multiple TMAG5328 devices may be used in the same system. When setting the BOP using a resistor, TI recommends that each TMAG5328 has its own “ADJ” resistor, even if multiple TMAG5328 devices have the same “ADJ” resistor value. Figure 8-6 shows an example implementation that has three TMAG5328 devices. If each device is set to the same BOP, then the resistances of R1, R2, and R3 are equal. V+ VCC V+ C1 C5 GPIO1 GND GND GPIO2 VCC GPIO3 R1 ADJ Microcontroller TMAG5328 OUT GND TEST1 TEST2 GND GND GND V+ C2 GND GND VCC R2 ADJ TMAG5328 OUT GND TEST1 TEST2 GND GND V+ C3 GND VCC R3 ADJ TMAG5328 OUT GND TEST1 TEST2 GND GND Figure 8-6. Setting BOP of Three TMAG5328 Devices Using Three Resistors 18 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 When setting the BOP using a DAC, one DAC can be used to set the “ADJ” pin voltage of multiple devices only if the DAC’s output could sink the current from all of the TMAG5328 devices. Figure 8-7 shows an example of a DAC driving the “ADJ” pin of three TMAG5328 devices. A DAC can only work reliably in this specific scenario if the DAC’s output can settle within 4 µs after being exposed to the three “ADJ” current sources. Each current source is 80 µA, therefore the DAC can only reliably work if the DAC's output can settle within 4 µs after being exposed to 80 x 3 = 240 µA of current. V+ V+ C1 VDD VCC C5 GND R1 GND SCL SCL R2 CAP DAC43701 SDA SDA Microcontroller V+ GPI C2 GPIO1 R3 GND FB VCC OUT GND GND AGND ADJ TMAG5328 OUT GND TEST1 TEST2 GND GND GND V+ C3 GND VCC ADJ TMAG5328 OUT TEST1 TEST2 GND GND V+ C4 GND VCC ADJ TMAG5328 OUT TEST1 TEST2 GND GND Figure 8-7. Setting BOP of Three TMAG5328 Devices Using a DAC 8.2 Typical Applications The TMAG5328 can be used in a large variety of industrial applications. For almost all these applications, the sensor is fixed and the magnet is attached to a movable component in the system. Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 19 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 8.2.1 Refrigerator Door Open/Close Detection This application section describes how to use the same device for two identical applications with different mechanical characteristic. 2° 2° Refrigerator door 1 D1 D2 Refrigerator door 2 F1 F2 Figure 8-8. Refrigerator 1 and Refrigerator 2 Principal Diagram 8.2.1.1 Design Requirements For this design example, use the parameters listed in Table 8-1. Table 8-1. Design Parameters for Fridge 1 DESIGN PARAMETER EXAMPLE VALUE Hall effect device TMAG5328A1D VCC 5V Magnet 10 mm cubic N35 D1 7.025 mm F1 500 mm Door opening angle 2° Calculated threshold needed (BOP) 7.87 mT RADJ 7.87 kΩ Table 8-2. Design Parameters for Fridge 2 DESIGN PARAMETER EXAMPLE VALUE Hall effect device TMAG5328A1D VCC 5V Magnet 10 mm cubic N35 D2 16.08 mm F2 500 mm Door opening angle 2° Calculated threshold needed (BOP) 3.49 mT RADJ 3.48 kΩ 8.2.1.2 Detailed Design Procedure For both applications, the Hall sensor is used to detect if the refrigerator door is open or closed. Both refrigerator doors are different from each other and therefore have different mechanical design. This means the Hall sensor and the magnet are positioned differently from each other. In other terms, if the user wants to detect a specific distance for both refrigerator doors, they must use either a different magnet or a different sensor. For the purpose of this application, there is no flexibility in the choice of magnet. The electronic board will also be reused across platforms and therefore will use the same sensor. The TMAG5328 is a resistor adjustable Hall effect switch that allows the user to set up whatever threshold is needed between 2 mT and 15 mT. 20 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 For this application, the refrigerator door manufacturer can use the same printed circuit board (PCB) with the same semiconductor content and only has to change the resistor value depending on which refrigerator version is manufactured. For both refrigerator doors, the opening angle is the same. Now refrigerator door 1 is a thinner model than refrigerator door 2. This means the PCB is located further away for refrigerator door 2 and therefore the sensitivity required to detect the position of the door will be impacted. Knowing the door dimensions, the door opening angle required, and the distance from the magnet to the PCB, it is possible to use a simulation tool that will calculate the magnet strength at the desired position. For refrigerator door 1, the sensitivity calculated is 7.87 mT at a distance of 7.025 mm. For Refrigerator 2, the sensitivity is 3.49 mT at a distance of 16.08 mm. Based on those values, a resistor value can be selected from the E48 series. A resistor of 7.87 kΩ can be used for refrigerator door 1 and resistor of 3.48 kΩ can be used for refrigerator door 2. 9 Power Supply Recommendations The TMAG5328 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor with a value of at least 0.1 µF. 10 Layout 10.1 Layout Guidelines Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice. Magnetic fields also easily pass through most printed circuit boards, which makes placing the magnet on the opposite side possible. 10.2 Layout Examples TEST1 OUT GND GND TEST2 RADJ GND ADJ VCC VCC SOT-23 Figure 10-1. Layout Examples Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 21 TMAG5328 www.ti.com SLYS044A – DECEMBER 2021 – REVISED JUNE 2022 11 Device and Documentation Support 11.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.2 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.3 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.5 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 22 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TMAG5328 PACKAGE OPTION ADDENDUM www.ti.com 7-Dec-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) Samples (4/5) (6) TMAG5328A1DQDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 A1D (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of