TMDS341A
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SLLS702B – MAY 2006 – REVISED MARCH 2007
3-TO-1 DVI/HDMI SWITCH
FEATURES
•
•
•
•
•
•
•
•
•
•
•
Compatible with HDMI 1.3a
Supports 2.25 Gbps Signaling Rate for 480i/p,
720i/p, and 1080i/p Resolutions up to 12-Bit
Color Depth
Each Port Supports HDMI or DVI Inputs
Isolated Digital Display Control (DDC) Bus for
Unused Ports
5-V Tolerance to all DDC and HPD_SINK
Inputs
Integrated Receiver Termination
Inter-Pair Output Skew < 100 ps
Intra-Pair Skew < 50 ps
8-dB Receiver Equalization to Compensate for
5-m DVI Cable Losses
High Impedance Outputs When Disabled
TMDS Inputs HBM ESD Protection
•
•
•
Exceeds 5 kV
3.3-V Supply Operation
80-Pin TQFP Package
ROHS Compatible and 260°C Reflow Rated
APPLICATIONS
•
•
•
•
Switching From Three Digital-Video (DVI) or
Digital-Audio Visual (HDMI) Sources
Digital TV
Digital Projector
Audio Video Receiver
DESCRIPTION
The TMDS341A is a 3-port digital video interface (DVI) or high-definition multimedia interface (HDMI) switch that
allows up to 3 DVI or HDMI ports to be switched to a single display terminal. Four TMDS channels, one hot plug
detector, and an I2C interface are supported on each port. Each TMDS channel allows signaling rates up to 2.25
Gbps.
The active source is selected by configuring source selectors, S1, S2, and S3. The selected TMDS inputs from
each port are switched through a 3-to-1 multiplexer. The I2C interface of the selected input port is linked to the
I2C interface of the output port, and the hot plug detector (HPD) of the selected input port is output to
HPD_SINK. For the unused ports, the I2C interfaces are isolated, and the HPD pins are kept low.
Termination resistors (50-Ω), pulled up to VCC, are integrated at each receiver input pin. External terminations
are not required. A precision resistor is connected externally from the VSADJ pin to ground for setting the
differential output voltage to be compliant with the TMDS standard. When the output is connected to a standard
TMDS termination and OE is high, the output is high impedance.
The TMDS341A provides fixed 8-dB input equalization and selectable 3-dB output de-emphasis to optimize
system performance through 5-meter or longer DVI compliant cables. The device is characterized for operation
from 0°C to 70°C.
Typical Application
DVD Player
Digital TV
PC
or
Game
Machine
TMDS
341A
STB
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
TMDS341A
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SLLS702B – MAY 2006 – REVISED MARCH 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTIONAL BLOCK DIAGRAM
A14
B14
A13
B13
A12
B12
A11
B11
VCC (3.3 V)
RINT
Rx w/
EQ
RINT
Rx w/
EQ
RINT
Rx w/
EQ
RINT
Rx w/
EQ
PRE
VSADJ
VCC (3.3 V)
RINT
A24
B24
Y4
Rx w/
EQ
VCC
RINT
3−to−1 MUX
TMDS
Drive
Z4
A23
B23
Rx w/
EQ
Y3
VCC
TMDS
Drive
RINT
A22
B22
Z3
Rx w/
EQ
VCC
RINT
Y2
A21
TMDS
Drive
Rx w/
EQ
B21
Z2
VCC (3.3 V)
RINT
Y1
TMDS
Drive
A34
B34
Rx w/
EQ
Z1
VCC
RINT
OE
A33
B33
Rx w/
EQ
VCC
S1
RINT
S2
A32
B32
Rx w/
EQ
S3
VCC
RINT
A31
B31
Rx w/
EQ
HPD1
HPD2
Control Logic
HPD_SINK
HPD3
SCL1
SCL_SINK
SDA1
SDA_SINK
SCL2
SDA2
SCL3
SDA3
2
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SLLS702B – MAY 2006 – REVISED MARCH 2007
NC
V CC
HP D3
SD A 3
S C L3
GN D
B 31
A 31
B 32
VCC
A 32
GN D
B 33
A 33
B 34
OE
60 59 58
VCC
A 34
GN D
NC
PFC PACKAGE
(TOP VIEW)
57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42
41
GND
GND
65
36
GND
GND
66
35
Z1
B21
67
34
Y1
A21
68
33
V CC
VCC
69
32
Z2
B22
70
31
Y2
A22
71
30
GND
GND
72
29
Z3
B23
73
28
Y3
A23
74
27
V CC
VCC
75
26
Z4
B24
76
25
Y4
A24
77
24
GND
GND
78
23
S3
VCC
79
22
S2
HPD1
80
21
S1
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NC
14 15 16 17 18 19
PR E
10 11 12 13
VSADJ
9
VC C
8
GND
7
A14
6
B1 4
5
VC C
4
A1 3
3
B1 3
2
C
1
GND
37
B1 2
64
A1 2
SCL_SINK
SCL2
A1 1
38
VC
63
B1 1
SDA_SINK
SDA2
GND
HPD_SINK
39
SC L 1
40
62
NC
61
HPD2
SD A 1
VCC
3
TMDS341A
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SLLS702B – MAY 2006 – REVISED MARCH 2007
TERMINAL FUNCTIONS
TERMINAL
NAME
I/O
DESCRIPTION
A11, A12, A13, A14
6, 9, 12, 15
I
Port 1 TMDS positive inputs
A21, A22, A23, A24
68, 71, 74, 77
I
Port 2 TMDS positive inputs
A31, A32, A33, A34
49, 52, 55, 58
I
Port 3 TMDS positive inputs
B11, B12, B13, B14
5, 8, 11, 14
I
Port 1 TMDS negative inputs
B21, B22, B23, B24
67, 70, 73, 76
I
Port 2 TMDS negative inputs
B31, B32, B33, B34
48, 51, 54, 57
I
Port 3 TMDS negative inputs
GND
4, 10, 16 24, 30,
36, 37, 47, 53,
59, 65, 66, 72, 78
HPD1
80
O
Port 1 hot plug detector output
HPD2
62
O
Port 2 hot plug detector output
HPD3
44
O
Port 3 hot plug detector output
HPD_SINK
40
I
Sink side hot plug detector input
High: 5-V power signal asserted from source to sink and EDID is ready
Low: No 5-V power signal asserted from source to sink, or EDID is not ready
Ground
NC
1, 20, 41,60
OE
42
I
Output enable, active low
PRE
19
I
Output de-emphasis adjustment
High: 3 dB
Low: 0 dB
SCL1
3
I/O
Port 1 DDC bus clock line
SCL2
64
I/O
Port 2 DDC bus clock line
SCL3
46
I/O
Port 3 DDC bus clock line
SCL_SINK
38
I/O
Sink side DDC bus clock line
SDA1
2
I/O
Port 1 DDC bus data line
SDA2
63
I/O
Port 2 DDC bus data line
SDA3
45
I/O
Port 3 DDC bus data line
SDA_SINK
39
I/O
Sink side DDC bus data line
S1, S2, S3
21, 22, 23
I
VCC
VSADJ
4
NO.
No connect
7, 13, 17 27, 33,
43, 50, 56 61, 69,
75, 79
Source selector input
Power supply
18
I
TMDS compliant voltage swing control
Y1, Y2, Y3, Y4
34, 31, 28, 25
O
TMDS positive outputs
Z1, Z2, Z3, Z4
35, 32, 29, 26
O
TMDS negative outputs
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Table 1. Source Selection Lookup
CONTROL PINS
(1)
(1)
I/O SELECTED
HOT PLUG DETECT STATUS
S1
S2
S3
Y/Z
SCL_SINK
SDA_SINK
HPD1
HPD2
HPD3
H
x
x
A1/B1
SCL1
SDA1
HPD_SINK
L
L
L
H
x
A2/B2
SCL2
SDA2
L
HPD_SINK
L
L
L
H
A3/B3
SCL3
SDA3
L
L
HPD_SINK
L
L
L
None (Z)
None (Z)
L
L
L
H: Logic high; L: Logic low; X: Don't care; Z: High impedance
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EQUIVALENT INPUT AND OUTPUT SCHEMATIC DIAGRAMS
TMDS Input Stage
TMDS Output Stage
Vcc
25 Ω
25 Ω
50Ω
Y
Z
50Ω
A
B
10 mA
Control Input Stage
HPD output stage
Vcc
OE
HPD_SINK
PRE
S1, S2, S3
Vcc
HPD1
HPD2
HPD3
400Ω
DDC pass gate
Vcc
SCL/SCA
Source
SCL/SCA
Sink
8V
8V
ORDERING INFORMATION (1)
(1)
6
PART NUMBER
PART MARKING
PACKAGE
TMDS341APFC
TMDS341A
80-PIN TQFP
TMDS341APFCR
TMDS341A
80-PIN TQFP Tape/Reel
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
UNIT
Supply voltage range, VCC (2)
–0.5 V to 4 V
Anm (3), Bnm
Voltage range
2.5 V to 4 V
Ym, Zm, VSADJ, PRE, Sn, OE, HPDn
–0.5V to 4 V
SCLn, SCL_SINK, SDAn, SDA_SINK, HPD_SINK
–0.5 V to 6 V
Anm, Bnm
Human body model (4)
Electrostatic
discharge
5 kV
All pins
4 kV
Charged-device model (5) (all pins)
1000 V
(6)
250 V
Machine model
(all pins)
See Dissipation Rating
Table
Continuous power dissipation
(1)
(2)
(3)
(4)
(5)
(6)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
n = 1, 2, 3; m = 1, 2, 3, 4
Tested in accordance with JEDEC Standard 22, Test Method A114-B
Tested in accordance with JEDEC Standard 22, Test Method C101-A
Tested in accordance with JEDEC Standard 22, Test Method A115-A
DISSIPATION RATINGS
(1)
PACKAGE
TA ≤ 25°C
80-TQFP
1342 mW
DERATING FACTOR
ABOVE TA = 25°C
(1)
TA = 70°C
POWER RATING
13.42 mW/°C
738 mW
This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
VCC
Supply voltage
3
3.3
3.6
UNIT
V
TA
Operating free-air temperature
0
70
°C
TMDS DIFFERENTIAL PINS (A/B)
VID
Receiver peak-to-peak differential input voltage
VIC
Input common mode voltage
RVSADJ
Resistor for TMDS compliant voltage swing range
AVCC
TMDS output termination voltage, see Figure 1
RT
Termination resistance, see Figure 1
Signaling rate
150
1560
VCC–0.4
VCC+0.01
mVp-p
V
4.6
4.64
4.68
kΩ
3
3.3
3.6
V
45
50
55
Ω
0
2.25
Gbps
CONTROL PINS (PRE; S, OE)
VIH
LVTTL High-level input voltage
2
VCC
V
VIL
LVTTL Low-level input voltage
GND
0.8
V
GND
5.5
V
DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK)
VI(DDC)
Input voltage
STATUS PINS (HPD_SINK)
VIH
LVTTL High-level input voltage
2
5.3
V
VIL
LVTTL Low-level input voltage
GND
0.8
V
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ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
ICC
Supply current
VIH = VCC, VIL = VCC – 0.4 V, RVSADJ = 4.64 kΩ,
RT = 50 Ω, AVCC = 3.3 V
Am/Bm = 1.65 Gbps HDMI data pattern, m = 2, 3, 4
A1/B1 = 165 MHz clock
PD
Power dissipation
VIH = VCC, VIL = VCC – 0.4 V, RVSADJ = 4.64 kΩ,
RT = 50 Ω, AVCC = 3.3 V
Am/Bm = 1.65 Gbps HDMI data pattern, m = 2, 3, 4
A1/B1 = 165 MHz clock
MIN
TYP (1)
MAX
UNIT
190
230
mA
394
657
mW
TMDS DIFFERENTIAL PINS (A/B; Y/Z)
VOH
Single-ended high-level output voltage
AVCC–10
AVCC+10
mV
VOL
Single-ended low-level output voltage
AVCC–600
AVCC–400
mV
Vswing
Single-ended output swing voltage
400
600
mV
VOD(O)
Overshoot of output differential voltage
VOD(U)
Undershoot of output differential voltage
∆VOC(SS)
Change in steady-state common-mode
output voltage between logic states
I(O)OFF
Single-ended standby output current
0 V ≤ VCC ≤ 1.5 V,
AVCC = 3.3 V, RT = 50 Ω
|I(OS)|
Short circuit output current
See Figure 3
VODE(SS)
Steady state output differential voltage with
de-emphasis
VODE(pp)
Peak-to-peak output differential voltage
See Figure 4, PRE = VCC,
Am/Bm = 250 Mbps HDMI data pattern, m = 2, 3, 4
A1/B1 = 25 MHz clock
VI(open)
Single-ended input voltage under high
impedance input or open input
II = 10 µA
RINT
Input termination resistance
VIN = 2.9 V
See Figure 2, AVCC = 3.3 V,
RT = 50 Ω, PRE = 0 V
6%
15% 2× Vswing
12%
25% 2× Vswing
0.5
5
mV
10
µA
12
mA
560
840
mVp-p
800
1200
mVp-p
VCC–10
VCC+10
–10
45
mV
50
55
Ω
2
µA
DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK)
|Ilkg|
Input leakage current
VI = 0.1 VCC to 0.9 VCC to isolated DDC ports
0.1
CIO
Input/output capacitance
VI = 0 V
7.5
RON
Switch resistance
IO = 3 mA, VO = 0.4 V
VPASS
Switch output voltage
VI = 3.3 V, IO = 100 µA
1.5 (2)
pF
25
50
Ω
2.0
2.5 (3)
V
STATUS PINS (HPD)
VOH(TTL)
TTL High-level output voltage
IOH = –8 mA
VOL(TTL)
TTL Low-level output voltage
IOL = 8 mA
2.4
V
0.4
V
CONTROL PINS (PRE, S, OE)
|IIH|
High-level digital input current
VIH = 2 V or VCC
0.1
2
µA
|IIL|
Low-level digital input current
VIL = GND or 0.8 V
0.1
2
µA
VIH = 5.3 V
23
100
VIH = 2 V or VCC
0.1
2
VIL = GND or 0.8 V
0.1
2
STATUS PINS (HPD_SINK)
|IIH|
High-level digital input current
|IIL|
Low-level digital input current
(1)
(2)
(3)
8
All typical values are at 25°C and with a 3.3-V supply.
The value is tested in full temperature range at 3.0 V.
The value is tested in full temperature range at 3.6 V.
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SLLS702B – MAY 2006 – REVISED MARCH 2007
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
TMDS DIFFERENTIAL PINS (Y/Z)
tPLH
Propagation delay time, low-to-high-level output
250
800
ps
tPHL
Propagation delay time, high-to-low-level output
250
800
ps
tr
Differential output signal rise time (20% - 80%)
75
240
ps
tf
Differential output signal fall time (20% - 80%)
75
240
ps
tsk(p)
Pulse skew (|tPHL– tPLH|)
7
50
ps
tsk(D)
Intra-pair differential skew, see Figure 5
23
50
ps
tsk(o)
Inter-pair channel-to-channel output skew (2)
100
ps
tsk(pp)
Part-to-part skew (3)
200
ps
tjit(pp)
Peak-to-peak output jitter from Y/Z(1) residual jitter
tjit(pp)
Peak-to-peak output jitter from Y/Z(2:4) residual jitter
tjit(pp)
Peak-to-peak output jitter from Y/Z(1) residual jitter
tjit(pp)
Peak-to-peak output jitter from Y/Z(2:4) residual jitter
tPRE
De-emphasis duration
tSX
Select to switch output
ten
Enable time
tdis
Disable time
See Figure 2, AVCC = 3.3 V,
RT = 50 Ω, PRE = 0 V
See Figure 8, PRE = 0 V
Am/Bm = 1.65 Gbps HDMI data pattern,
m = 2, 3, 4
A1/B1 = 165 MHz clock
15
30
ps
18
50
ps
See Figure 8, PRE = 0 V
Am/Bm = 2.25 Gbps HDMI data pattern,
m = 2, 3, 4
A1/B1 = 225 MHz clock
20
22
ps
38
78
ps
See Figure 4, PRE = VCC
Am/Bm = 250 Mbps HDMI data pattern,
m = 2, 3, 4
A1/B1 = 25 MHz clock
See Figure 6
240 (4)
ps
6
10
ns
6
10
ns
6
10
ns
0.4
2.5
ns
2
6.0
ns
3
6.5
ns
DDC I/O PINS (SCL, SCL_SINK, SDA, SDA_SINK)
tpd(DDC)
Propagation delay from SCLn to SCL_SINK or SDAn to
SDA_SINK or SDA_SINK to SDAn
See Figure 7, CL = 10 pF
CONTROL AND STATUS PINS (S, HPD_SINK, HPD)
tpd(HPD)
Propagation delay (from HPD_SINK to the active port of HPD)
tsx(HPD)
Switch time (from port select to the latest valid status of HPD)
(1)
(2)
(3)
(4)
See Figure 7, CL = 10 pF
All typical values are at 25°C and with a 3.3-V supply.
tsk(o) is the magnitude of the difference in propagation delay times between any specified terminals of channel 2 to 4 of a device when
inputs are tied together.
tsk(pp) is the magnitude of the difference in propagation delay times between any specified terminals of channel 2 to 4 of two devices, or
between channel 1 of two devices, when both devices operate with the same source, the same supply voltages, at the same
temperature, and have identical packages and test circuits.
The typical value is ensured by simulation.
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SLLS702B – MAY 2006 – REVISED MARCH 2007
PARAMETER MEASUREMENT INFORMATION
AVcc
RT
RT
ZO = RT
TMDS
Driver
TMDS
Receiver
ZO = RT
Figure 1. Termination for TMDS Output Driver
Vcc
R
R
INT
INT
RT
Y
A
VA
TMDS
Receiver
VID
TMDS
Driver
CL
0.5 pF
B
VB
V
ID
VY
AVcc
RT
Z
=
VA −
VB
Vswing =
VY −
VZ
VZ
VA
VB
DC Coupled
Vcc
AC Coupled
Vcc+0.2 V
Vcc−0.4 V
Vcc−0.2 V
0.4 V
VID
V
VID(pp)
ID
0V
−0.4 V
t PHL
t
PLH
100%
80%
V OD(O)
0V Differential
VOD(pp)
20%
0%
tf
tr
VOD(U)
V OC
nVOC(SS)
NOTE: All input pulses are supplied by a generator having the following characteristics: tr or tf < 100 ps, 100 MHz from
Agilent 81250. CL includes instrumentation and fixture capacitance within 0.06 m of the D.U.T. Measurement
equipment provides a bandwidth of 20 GHz minimum.
Figure 2. Timing Test Circuit and Definitions
10
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PARAMETER MEASUREMENT INFORMATION (continued)
50 W
IOS
TMDS
Driver
50 W
+
_
0 V or 3.6 V
Figure 3. Short Circuit Output Current Test Circuit
1 bit
1 to N bit
VODE(SS)
VOD(pp)
80%
20%
t PRE
Figure 4. De-Emphasis Output Voltage Waveforms and Duration Measurement Definitions
VOH
VY
50%
VZ
tsk(D)
VOL
Figure 5. Definition of Intra-Pair Differential Skew
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PARAMETER MEASUREMENT INFORMATION (continued)
Input−1
Kept
High
A
B
Input−2/Input−3 A
Kept Low
B
3.3 V
VCC
2
0V
S1 Clocking
S2 or S3
Kept High
tsx
Output
tsx
Y
75 mV
Z
−75 mV
Hi−Z
75 mV
−75 mV
3.3 V
VCC
2
0V
OE
tdis
ten
Figure 6. TMDS Outputs Control Timing Definitions
VCC
2
HPD_SINK
VCC
2
0.4 V
HPD1
tsx(HPD)
tpd(HPD)
tpd(HPD)
2.4 V
HPD2
HPD3
0V
S1
VCC
2
S2
S3
0V
SDA_SINK
VCC
2
tpd(DDC)
tpd(DDC)
VCC
2
SDA1
SDA2
SDA3
Figure 7. HPD Timing Definitions
12
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SLLS702B – MAY 2006 – REVISED MARCH 2007
PARAMETER MEASUREMENT INFORMATION (continued)
AVcc
RT
Data +
Data −
Video Patterm
Generator
Coax
Coax
SMA
RX
SMA
EQ
5m 28AWG
HDMI Cable
1000 mVpp
Differential
M
U
X
+
OUT
0dB