TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
TMS320F2833x, TMS320F2823x Real-Time Microcontrollers
1 Features
•
•
•
•
•
•
•
•
•
•
•
•
High-performance static CMOS technology
– Up to 150 MHz (6.67-ns cycle time)
– 1.9-V/1.8-V core, 3.3-V I/O design
High-performance 32-bit CPU (TMS320C28x)
– IEEE 754 single-precision Floating-Point Unit
(FPU) (F2833x only)
– 16 × 16 and 32 × 32 MAC operations
– 16 × 16 dual MAC
– Harvard bus architecture
– Fast interrupt response and processing
– Unified memory programming model
– Code-efficient (in C/C++ and Assembly)
Six-channel DMA controller (for ADC, McBSP,
ePWM, XINTF, and SARAM)
16-bit or 32-bit External Interface (XINTF)
– More than 2M × 16 address reach
On-chip memory
– F28335, F28333, F28235:
256K × 16 flash, 34K × 16 SARAM
– F28334, F28234:
128K × 16 flash, 34K × 16 SARAM
– F28332, F28232:
64K × 16 flash, 26K × 16 SARAM
– 1K × 16 OTP ROM
Boot ROM (8K × 16)
– With software boot modes (through SCI, SPI,
CAN, I2C, McBSP, XINTF, and parallel I/O)
– Standard math tables
Clock and system control
– On-chip oscillator
– Watchdog timer module
GPIO0 to GPIO63 pins can be connected to one of
the eight external core interrupts
Peripheral Interrupt Expansion (PIE) block that
supports all 58 peripheral interrupts
128-bit security key/lock
– Protects flash/OTP/RAM blocks
– Prevents firmware reverse-engineering
Enhanced control peripherals
– Up to 18 PWM outputs
– Up to 6 HRPWM outputs with 150-ps MEP
resolution
– Up to 6 event capture inputs
– Up to 2 Quadrature Encoder interfaces
– Up to 8 32-bit timers
(6 for eCAPs and 2 for eQEPs)
– Up to 9 16-bit timers
(6 for ePWMs and 3 XINTCTRs)
Three 32-bit CPU timers
•
•
•
•
•
•
•
•
•
•
Serial port peripherals
– Up to 2 CAN modules
– Up to 3 SCI (UART) modules
– Up to 2 McBSP modules (configurable as SPI)
– One SPI module
– One Inter-Integrated Circuit (I2C) bus
12-bit ADC, 16 channels
– 80-ns conversion rate
– 2 × 8 channel input multiplexer
– Two sample-and-hold
– Single/simultaneous conversions
– Internal or external reference
Up to 88 individually programmable, multiplexed
GPIO pins with input filtering
JTAG boundary scan support
– IEEE Standard 1149.1-1990 Standard Test
Access Port and Boundary Scan Architecture
Advanced debug features
– Analysis and breakpoint functions
– Real-time debug using hardware
Development support includes
– ANSI C/C++ compiler/assembler/linker
– Code Composer Studio™ IDE
– DSP/BIOS™ and SYS/BIOS
– Digital motor control and digital power software
libraries
Low-power modes and power savings
– IDLE, STANDBY, HALT modes supported
– Disable individual peripheral clocks
Endianness: Little endian
Package options:
– Lead-free, green packaging
– 176-ball plastic Ball Grid Array (BGA) [ZJZ]
– 179-ball MicroStar BGA™ [ZHH]
– 179-ball New Fine Pitch Ball Grid Array
(nFBGA) [ZAY]
– 176-pin Low-Profile Quad Flatpack (LQFP)
[PGF]
– 176-pin Thermally Enhanced Low-Profile Quad
Flatpack (HLQFP) [PTP]
Temperature options:
– A: –40°C to 85°C (PGF, ZHH, ZAY, ZJZ)
– S: –40°C to 125°C (PTP, ZJZ)
– Q: –40°C to 125°C (PTP, ZJZ)
(AEC Q100 qualification for automotive
applications)
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
•
2 Applications
•
•
•
Advanced driver assistance systems (ADAS)
– Medium/short range radar
Building automation
– HVAC motor control
– Traction inverter motor control
Factory automation & control
– Automated sorting equipment
– CNC control
•
•
•
Grid infrastructure
– Central inverter
– String inverter
Hybrid, electric & powertrain systems
– Inverter & motor control
– On-board (OBC) & wireless charger
Motor drives
– AC-input BLDC motor drive
– Servo drive control module
Power delivery
– Industrial AC-DC
3 Description
C2000™ real-time microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop
performance in real-time control applications such as industrial motor drives; solar inverters and digital power;
electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes
the Premium performance MCUs and the Entry performance MCUs.
The TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332, TMS320F28235, TMS320F28234,
and TMS320F28232 devices are highly integrated, high-performance solutions for demanding control
applications.
Throughout this document, the devices are abbreviated as F28335, F28334, F28333, F28332, F28235, F28234,
and F28232, respectively. F2833x Device Comparison and F2823x Device Comparison provide a summary of
features for each device.
The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all
aspects of development with C2000 devices from hardware to support resources. In addition to key reference
documents, each section provides relevant links and resources to further expand on the information covered.
To learn more about the C2000 MCUs, visit the C2000™ real-time control MCUs page.
Package Information
PART NUMBER(1)
2
PACKAGE
BODY SIZE
TMS320F28335ZAY
nFBGA (179)
12.0 mm × 12.0 mm
TMS320F28334ZAY
nFBGA (179)
12.0 mm × 12.0 mm
TMS320F28234ZAY
nFBGA (179)
12.0 mm × 12.0 mm
TMS320F28232ZAY
nFBGA (179)
12.0 mm × 12.0 mm
TMS320F28335ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28334ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28332ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28235ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28234ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28232ZHH
BGA MicroStar (179)
12.0 mm × 12.0 mm
TMS320F28335ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28334ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28332ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28235ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28234ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28232ZJZ
BGA (176)
15.0 mm × 15.0 mm
TMS320F28335PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28334PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28333PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28332PGF
LQFP (176)
24.0 mm × 24.0 mm
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Package Information (continued)
PART NUMBER(1)
PACKAGE
BODY SIZE
TMS320F28235PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28234PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28232PGF
LQFP (176)
24.0 mm × 24.0 mm
TMS320F28335PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28334PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28332PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28235PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28234PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28232PTP
HLQFP (176)
24.0 mm × 24.0 mm
(1)
For more information on these devices, see Mechanical, Packaging, and Orderable Information.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
3
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
3.1 Functional Block Diagram
M0 SARAM 1Kx16
(0-Wait)
L0 SARAM 4K x 16
(0-Wait, Dual Map)
M1 SARAM 1Kx16
(0-Wait)
L1 SARAM 4K x 16
(0-Wait, Dual Map)
OTP 1K x 16
Memory Bus
L2 SARAM 4K x 16
(0-Wait, Dual Map)
Flash
256K x 16
8 Sectors
Code
Security
Module
L3 SARAM 4K x 16
(0-Wait, Dual Map)
TEST2
L4 SARAM 4K x 16
(0-W Data, 1-W Prog)
Pump
TEST1
PSWD
L5 SARAM 4K x 16
(0-W Data, 1-W Prog)
Boot ROM
8K x 16
Flash
Wrapper
L6 SARAM 4K x 16
(0-W Data, 1-W Prog)
L7 SARAM 4K x 16
(0-W Data, 1-W Prog)
Memory Bus
XD31:0
FPU
TCK
XHOLDA
TDI
XHOLD
TMS
XREADY
88 GPIOs
32-bit CPU
(150 MHZ @ 1.9 V)
(100 MHz @ 1.8 V)
XINTF
XR/W
GPIO
MUX
XZCS0
TDO
TRST
EMU0
XZCS7
EMU1
XWE0
XA0/XWE1
XA19:1
DMA Bus
Memory Bus
XZCS6
XCLKIN
CPU Timer 0
DMA
6 Ch
CPU Timer 1
X1
X2
XRS
CPU Timer 2
XCLKOUT
PIE
(Interrupts)
XRD
88 GPIOs
OSC,
PLL,
LPM,
WD
8 External Interrupts
GPIO
MUX
A7:0
XINTF
Memory Bus
12-Bit
ADC
2-S/H
B7:0
DMA Bus
REFIN
32-bit peripheral bus
(DMA accessible)
16-bit peripheral bus
FIFO
(16 Levels)
ePWM-1/../6
McBSP-A/B
eCAP-1/../6
eQEP-1/2
CAN-A/B
(32-mbox)
CANTXx
CANRXx
EQEPxI
EQEPxS
EQEPxB
ESYNCI
ESYNCO
EPWMxB
TZx
EPWMxA
MFSRx
MFSXx
MCLKRx
MRXx
MCLKXx
HRPWM-1/../6
MDXx
SCLx
SDAx
I2C
SPISTEx
SPICLKx
SPISOMIx
SPI-A
SPISIMOx
SCIRXDx
SCITXDx
SCI-A/B/C
EQEPxA
FIFO
(16 Levels)
ECAPx
FIFO
(16 Levels)
32-bit peripheral bus
GPIO MUX
Secure zone
88 GPIOs
Figure 3-1. Functional Block Diagram
4
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 2
3 Description.......................................................................2
3.1 Functional Block Diagram........................................... 4
4 Revision History.............................................................. 6
5 Device Comparison......................................................... 8
5.1 Related Products.......................................................11
6 Terminal Configuration and Functions........................12
6.1 Pin Diagrams............................................................ 12
6.2 Signal Descriptions................................................... 22
7 Specifications................................................................ 32
7.1 Absolute Maximum Ratings...................................... 32
7.2 ESD Ratings – Automotive....................................... 33
7.3 ESD Ratings – Commercial...................................... 33
7.4 Recommended Operating Conditions.......................34
7.5 Power Consumption Summary................................. 35
7.6 Electrical Characteristics...........................................40
7.7 Thermal Resistance Characteristics......................... 41
7.8 Thermal Design Considerations................................45
7.9 Timing and Switching Characteristics....................... 46
7.10 On-Chip Analog-to-Digital Converter.................... 100
7.11 Migrating Between F2833x Devices and
F2823x Devices.........................................................106
8 Detailed Description....................................................107
Copyright © 2022 Texas Instruments Incorporated
8.1 Brief Descriptions....................................................107
8.2 Peripherals.............................................................. 115
8.3 Memory Maps......................................................... 159
8.4 Register Map...........................................................166
8.5 Interrupts.................................................................169
8.6 System Control....................................................... 174
8.7 Low-Power Modes Block........................................ 180
9 Applications, Implementation, and Layout............... 181
9.1 TI Reference Design............................................... 181
10 Device and Documentation Support........................182
10.1 Getting Started and Next Steps............................ 182
10.2 Device and Development Support Tool
Nomenclature............................................................ 182
10.3 Tools and Software............................................... 184
10.4 Documentation Support........................................ 186
10.5 Support Resources............................................... 187
10.6 Trademarks........................................................... 187
10.7 Electrostatic Discharge Caution............................188
10.8 Glossary................................................................188
11 Mechanical, Packaging, and Orderable
Information.................................................................. 189
11.1 Package Redesign Details.................................... 189
11.2 Packaging Information.......................................... 189
Submit Document Feedback
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
5
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
4 Revision History
Changes from February 2, 2021 to August 8, 2022 (from Revision P (February 2021) to
Revision Q (August 2022))
Page
• Global: Changed document title from TMS320F2833x, TMS320F2823x Digital Signal Controllers (DSCs) to
TMS320F2833x, TMS320F2823x Real-Time Microcontrollers. .........................................................................1
• Global: Changed "digital signal controller" to "real-time microcontroller". Changed "DSC" to "MCU". ............. 1
• Global: Due to an equipment End-of_Life notice from our substrate supplier, we are phasing out certain
MicroStar BGA™ packaging devices. These devices have now been converted to a New Fine Pitch Ball Grid
Array (nFBGA) package. For more information, see the Package Redesign Details section.............................1
• Global: Added 179-ball ZAY New Fine Pitch Ball Grid Array (nFBGA)..............................................................1
• Global: Changed title of errata from TMS320F2833x, TMS320F2823x DSCs Silicon Errata to
TMS320F2833x, TMS320F2823x Real-Time MCUs Silicon Errata....................................................................1
• Global: Replaced references to peripheral reference guides with references to the TMS320x2833x,
TMS320x2823x Real-Time Microcontrollers Technical Reference Manual........................................................ 1
• Global: Replaced "emulator" with "JTAG debug probe".....................................................................................1
• Section 1 (Features): Changed "Advanced emulation features" to "Advanced debug features"........................ 1
• Section 1: Added "179-ball New Fine Pitch Ball Grid Array (nFBGA) [ZAY]" to "Package options"................... 1
• Section 1: Added "ZAY" to Temperature option "A"............................................................................................ 1
• Section 2 (Applications): Updated section.......................................................................................................... 2
• Section 3 (Description): Updated section. Changed Device Information table to Package Information table.
Added ZAY nFBGA to Package Information table.............................................................................................. 2
• Table 5-1 (F2833x Device Comparison): Appended "(UART-compatible)" to "Serial Communications Interface
(SCI)".................................................................................................................................................................. 8
• Table 5-1: Added "179-Ball ZAY" to Packaging section. Added ZAY to "A" Temperature option........................8
• Table 5-2 (F2823x Device Comparison): Appended "(UART-compatible)" to "Serial Communications Interface
(SCI)".................................................................................................................................................................. 8
• Table 5-2: Added "179-Ball ZAY" to Packaging section. Added ZAY to "A" Temperature option........................8
• Section 5.1 (Related Products): Updated section. ........................................................................................... 11
• Section 6.1 (Pin Diagrams): Added 179-ball ZAY new fine pitch ball grid array (nFBGA)................................ 12
• Table 6-1 (Signal Descriptions): Added ZAY package...................................................................................... 22
• Table 6-1: Updated DESCRIPTION of EMU0, EMU1, and XRS...................................................................... 22
• Section 7.3 (ESD Ratings – Commercial): Add data for ZAY package.............................................................33
• Section 7.5.3 (Reducing Current Consumption): Updated list of methods to reduce power consumption....... 38
• Section 7.7.4 (ZAY Package): Added table.......................................................................................................44
• Section 7.9.2 (Power Sequencing): Updated "No requirements are placed on the power-up and power-down
sequences ..." paragraph..................................................................................................................................48
• Section 7.9.5: Changed section title from "Emulator Connection Without Signal Buffering for the DSP" to
"JTAG Debug Probe Connection Without Signal Buffering for the MCU"......................................................... 79
• Figure 7-27: Changed figure title from "Emulator Connection Without Signal Buffering for the DSP" to "JTAG
Debug Probe Connection Without Signal Buffering for the MCU".................................................................... 79
• Figure 7-27 (Emulator Connection Without Signal Buffering for the MCU): Changed "DSC" to "MCU"........... 79
• Section 7.9.6.8.2 (Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)): Restored
footnote.............................................................................................................................................................92
• Table 8-14 (SCI-C Registers): Restored footnotes......................................................................................... 141
• Figure 8-15 (Serial Communications Interface (SCI) Module Block Diagram): Updated figure......................141
• Figure 8-34 (Watchdog Module): Updated figure............................................................................................179
• Section 9.1: Changed title from "TI Design or Reference Design" to "TI Reference Design"......................... 181
• Section 9.1 (TI Reference Design): Updated section..................................................................................... 181
• Section 10 (Device and Documentation Support): Updated section...............................................................182
• Section 10.1: Changed title from "Getting Started" to "Getting Started and Next Steps". Updated section... 182
• Figure 10-1 (Example of F2833x, F2823x Device Nomenclature): Added 179-ball ZAY package under
PACKAGE TYPE............................................................................................................................................ 182
6
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Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
•
•
•
•
•
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Section 10.3 (Tools and Software): Updated section. Updated Design Kits and Evaluation Modules section.
Updated Models section. Added Training section...........................................................................................184
Section 10.4 (Documentation Support): Added nFBGA Packaging Application Report................................. 186
Section 10.4: Added Technical Reference Manual section. ........................................................................186
Section 10.4: Updated Peripheral Guides section. Removed most peripheral reference guides as they are
now replaced by the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference
Manual............................................................................................................................................................ 186
Section 11.1 (Package Redesign Details): Added section..............................................................................189
Copyright © 2022 Texas Instruments Incorporated
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Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
7
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
5 Device Comparison
Table 5-1. F2833x Device Comparison
TYPE(1)
F28335
F28335-Q1
(150 MHz)
F28334
(150 MHz)
F28333
(100 MHz)
F28332
(100 MHz)
Instruction cycle
–
6.67 ns
6.67 ns
10 ns
10 ns
Floating-point unit
–
Yes
Yes
Yes
Yes
3.3-V on-chip flash (16-bit word)
–
256K
128K
256K
64K
Single-access RAM (SARAM)
(16-bit word)
–
34K
34K
34K
26K
One-time programmable (OTP) ROM
(16-bit word)
–
1K
1K
1K
1K
Code security for on-chip flash/
SARAM/OTP blocks
–
Yes
Yes
Yes
Yes
Boot ROM (8K × 16)
–
Yes
Yes
Yes
Yes
16/32-bit External Interface (XINTF)
1
Yes
Yes
Yes
Yes
6-channel Direct Memory Access (DMA)
0
Yes
Yes
Yes
Yes
PWM channels
0
ePWM1/2/3/4/5/6
ePWM1/2/3/4/5/6
ePWM1/2/3/4/5/6
ePWM1/2/3/4/5/6
FEATURE
HRPWM channels
0
32-bit capture inputs or auxiliary PWM
outputs
0
eCAP1/2/3/4/5/6
eCAP1/2/3/4
eCAP1/2/3/4/5/6
eCAP1/2/3/4
32-bit QEP channels (four inputs/
channel)
0
eQEP1/2
eQEP1/2
eQEP1/2
eQEP1/2
Watchdog timer
–
Yes
Yes
Yes
Yes
16
16
16
16
No. of channels
12-bit ADC
MSPS
2
Conversion time
12.5
12.5
12.5
12.5
80 ns
80 ns
80 ns
80 ns
32-bit CPU timers
–
3
3
3
3
Multichannel Buffered Serial Port
(McBSP)/SPI
1
2 (A/B)
2 (A/B)
2 (A/B)
1 (A)
Serial Peripheral Interface (SPI)
0
1
1
1
1
Serial Communications Interface (SCI)
(UART-compatible)
0
3 (A/B/C)
3 (A/B/C)
3 (A/B/C)
2 (A/B)
Enhanced Controller Area Network
(eCAN)
0
2 (A/B)
2 (A/B)
2 (A/B)
2 (A/B)
Inter-Integrated Circuit (I2C)
0
1
1
1
1
General-purpose I/O pins (shared)
–
88
88
88
88
External interrupts
–
8
8
8
8
176-Pin PGF
–
Yes
Yes
Yes
Yes
176-Pin PTP
–
Yes
Yes
–
Yes
179-Ball ZHH
–
Yes
Yes
–
Yes
179-Ball ZAY
–
Yes
Yes
–
–
176-Ball ZJZ
–
Yes
Yes
–
Yes
Packaging
8
ePWM1A/2A/3A/4A/ ePWM1A/2A/3A/4A/ ePWM1A/2A/3A/4A/
ePWM1A/2A/3A/4A
5A/6A
5A/6A
5A/6A
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 5-1. F2833x Device Comparison (continued)
FEATURE
Temperature
options
(1)
TYPE(1)
F28335
F28335-Q1
(150 MHz)
F28334
(150 MHz)
PGF, ZHH, ZAY, ZJZ PGF, ZHH, ZAY, ZJZ
F28333
(100 MHz)
F28332
(100 MHz)
PGF
PGF, ZHH, ZJZ
A: –40°C to 85°C
–
S: –40°C to 125°C
–
PTP, ZJZ
PTP, ZJZ
–
PTP, ZJZ
Q: –40°C to 125°C
(AEC Q100
Qualification)
–
PTP, ZJZ
PTP, ZJZ
–
PTP, ZJZ
A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor
differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in
the C2000 Real-Time Control MCU Peripherals Reference Guide and the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers
Technical Reference Manual.
Copyright © 2022 Texas Instruments Incorporated
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
9
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 5-2. F2823x Device Comparison
TYPE(1)
F28235
F28235-Q1
(150 MHz)
F28234
F28234-Q1
(150 MHz)
F28232
F28232-Q1
(100 MHz)
Instruction cycle
–
6.67 ns
6.67 ns
10 ns
Floating-point unit
–
No
No
No
3.3-V on-chip flash (16-bit word)
–
256K
128K
64K
Single-access RAM (SARAM)
(16-bit word)
–
34K
34K
26K
One-time programmable (OTP) ROM
(16-bit word)
–
1K
1K
1K
Code security for on-chip flash/
SARAM/OTP blocks
–
Yes
Yes
Yes
Boot ROM (8K × 16)
–
Yes
Yes
Yes
16/32-bit External Interface (XINTF)
1
Yes
Yes
Yes
6-channel Direct Memory Access (DMA)
0
Yes
Yes
Yes
PWM channels
0
ePWM1/2/3/4/5/6
ePWM1/2/3/4/5/6
HRPWM channels
0
32-bit capture inputs or auxiliary PWM
outputs
0
eCAP1/2/3/4/5/6
eCAP1/2/3/4
eCAP1/2/3/4
32-bit QEP channels (four inputs/channel)
0
eQEP1/2
eQEP1/2
eQEP1/2
Watchdog timer
–
Yes
Yes
Yes
16
16
16
2
12.5
12.5
12.5
FEATURE
No. of channels
12-bit ADC
MSPS
Conversion time
ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A
ePWM1/2/3/4/5/6
ePWM1A/2A/3A/4A
80 ns
80 ns
80 ns
32-bit CPU timers
–
3
3
3
Multichannel Buffered Serial Port
(McBSP)/SPI
1
2 (A/B)
2 (A/B)
1 (A)
Serial Peripheral Interface (SPI)
0
1
1
1
Serial Communications Interface (SCI)
(UART-compatible)
0
3 (A/B/C)
3 (A/B/C)
2 (A/B)
Enhanced Controller Area Network (eCAN)
0
2 (A/B)
2 (A/B)
2 (A/B)
Inter-Integrated Circuit (I2C)
0
1
1
1
General-purpose I/O pins (shared)
–
88
88
88
External interrupts
–
8
8
8
176-Pin PGF
–
Yes
Yes
Yes
176-Pin PTP
–
Yes
Yes
Yes
179-Ball ZHH
–
Yes
Yes
Yes
179-Ball ZAY
–
–
Yes
Yes
176-Ball ZJZ
–
Yes
Yes
Yes
A: –40°C to 85°C
–
PGF, ZHH, ZJZ
PGF, ZHH, ZAY, ZJZ
PGF, ZHH, ZAY, ZJZ
S: –40°C to 125°C
–
PTP, ZJZ
PTP, ZJZ
PTP, ZJZ
Q: –40°C to 125°C
(AEC Q100
Qualification)
–
PTP, ZJZ
PTP, ZJZ
PTP, ZJZ
Packaging
Temperature options
(1)
10
A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor
differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in
the C2000 Real-Time Control MCU Peripherals Reference Guide and the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers
Technical Reference Manual.
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
5.1 Related Products
For information about similar products, see the following links:
TMS320F2833x Real-Time Microcontrollers
The F2833x series is the first C2000™ MCU that is offered with a floating-point unit (FPU). It has the firstgeneration ePWM timers. The 12.5-MSPS, 12-bit ADC is still class-leading for an integrated analog-to-digital
converter. The F2833x has a 150-MHz CPU and up to 512KB of on-chip Flash. It is available in a 176-pin QFP
or 179-ball BGA package.
TMS320C2834x Real-Time Microcontrollers
The C2834x series removes the on-chip Flash memory and integrated ADC to enable the fastest available clock
speeds of up to 300 MHz. It is available in a 179-ball nFBGA or 256-ball BGA package.
TMS320F2837xD Real-Time Microcontrollers
The F2837xD series sets a new standard for performance with dual subsystems. Each subsystem consists of
a C28x CPU and a parallel control law accelerator (CLA), each running at 200 MHz. Enhancing performance
are TMU and VCU accelerators. New capabilities include multiple 16-bit/12-bit mode ADCs, DAC, Sigma-Delta
filters, USB, configurable logic block (CLB), on-chip oscillators, and enhanced versions of all peripherals. The
F2837xD is available with up to 1MB of Flash. It is available in a 176-pin QFP or 337-pin BGA package.
TMS320F2837xS Real-Time Microcontrollers
The F2837xS series is a pin-to-pin compatible version of F2837xD but with only one C28x-CPU-and-CLA
subsystem enabled. It is also available in a 100-pin QFP to enable compatibility with the TMS320F2807x series.
Copyright © 2022 Texas Instruments Incorporated
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
11
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
6 Terminal Configuration and Functions
6.1 Pin Diagrams
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
GPIO75/XD4
GPIO74/XD5
GPIO73/XD6
GPIO72/XD7
GPIO71/XD8
GPIO70/XD9
VDD
VSS
GPIO69/XD10
GPIO68/XD11
GPIO67/XD12
VDDIO
VSS
GPIO66/XD13
VSS
VDD
GPIO65/XD14
GPIO64/XD15
GPIO63/SCITXDC/XD16
GPIO62/SCIRXDC/XD17
GPIO61/MFSRB/XD18
GPIO60/MCLKRB/XD19
GPIO59/MFSRA/XD20
VDD
VSS
VDDIO
VSS
XCLKIN
X1
VSS
X2
VDD
GPIO58/MCLKRA/XD21
GPIO57/SPISTEA/XD22
GPIO56/SPICLKA/XD23
GPIO55/SPISOMIA/XD24
GPIO54/SPISIMOA/XD25
GPIO53/EQEP1I/XD26
GPIO52/EQEP1S/XD27
VDDIO
VSS
GPIO51/EQEP1B/XD28
GPIO50/EQEP1A/XD29
GPIO49/ECAP6/XD30
The 176-pin PGF/PTP low-profile quad flatpack (LQFP) pin assignments are shown in Figure 6-1. The 179-ball
ZHH ball grid array (BGA) and the 179-ball ZAY new fine pitch ball grid array (nFBGA) terminal assignments are
shown in Figure 6-2 through Figure 6-5. The 176-ball ZJZ plastic BGA terminal assignments are shown in Figure
6-6 through Figure 6-9. Table 6-1 describes the function(s) of each pin.
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
GPIO48/ECAP5/XD31
TCK
EMU1
EMU0
VDD3VFL
VSS
TEST2
TEST1
XRS
TMS
TRST
TDO
TDI
GPIO33/SCLA/EPWMSYNCO/ADCSOCBO
GPIO32/SDAA/EPWMSYNCI/ADCSOCAO
GPIO27/ECAP4/EQEP2S/MFSXB
GPIO26/ECAP3/EQEP2I/MCLKXB
VDDIO
VSS
GPIO25/ECAP2/EQEP2B/MDRB
GPIO24/ECAP1/EQEP2A/MDXB
GPIO23/EQEP1I/MFSXA/SCIRXDB
GPIO22/EQEP1S/MCLKXA/SCITXDB
GPIO21/EQEP1B/MDRA/CANRXB
GPIO20/EQEP1A/MDXA/CANTXB
GPIO19/SPISTEA/SCIRXDB/CANTXA
GPIO18/SPICLKA/SCITXDB/CANRXA
VDD
VSS
VDD2A18
VSS2AGND
ADCRESEXT
ADCREFP
ADCREFM
ADCREFIN
ADCINB7
ADCINB6
ADCINB5
ADCINB4
ADCINB3
ADCINB2
ADCINB1
ADCINB0
VDDAIO
GPIO30/CANRXA/XA18
GPIO29/SCITXDA/XA19
VSS
VDD
GPIO0/EPWM1A
GPIO1/EPWM1B/ECAP6/MFSRB
GPIO2/EPWM2A
VSS
VDDIO
GPIO3/EPWM2B/ECAP5/MCLKRB
GPIO4/EPWM3A
GPIO5/EPWM3B/MFSRA/ECAP1
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO
VSS
VDD
GPIO7/EPWM4B/MCLKRA/ECAP2
GPIO8/EPWM5A/CANTXB/ADCSOCAO
GPIO9/EPWM5B/SCITXDB/ECAP3
GPIO10/EPWM6A/CANRXB/ADCSOCBO
GPIO11/EPWM6B/SCIRXDB/ECAP4
GPIO12/TZ1/CANTXB/MDXB
VSS
VDD
GPIO13/TZ2/CANRXB/MDRB
GPIO14/TZ3/XHOLD/SCITXDB/MCLKXB
GPIO15/TZ4/XHOLDA/SCIRXDB/MFSXB
GPIO16/SPISIMOA/CANTXB/TZ5
GPIO17/SPISOMIA/CANRXB/TZ6
VDD
VSS
VDD1A18
VSS1AGND
VSSA2
VDDA2
ADCINA7
ADCINA6
ADCINA5
ADCINA4
ADCINA3
ADCINA2
ADCINA1
ADCINA0
ADCLO
VSSAIO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
GPIO76/XD3
GPIO77/XD2
GPIO78/XD1
GPIO79/XD0
GPIO38/XWE0
XCLKOUT
VDD
GPIO28/SCIRXDA/XZCS6
VSS
GPIO28/SCIRXDA/XZCS6
GPIO34/ECAP1/XREADY
VDDIO
VSS
GPIO36/SCIRXDA/XZCS0
VDD
VSS
GPIO35/SCITXDA/XR/W
XRD
GPIO37/ECAP2/XZCS7
GPIO40/XA0/XWE1
GPIO41/XA1
GPIO42/XA2
VDD
VSS
GPIO43/XA3
GPIO44/XA4
GPIO45/XA5
VDDIO
VSS
GPIO46/XA6
GPIO47/XA7
GPIO80/XA8
GPIO81/XA9
GPIO82/XA10
VSS
VDD
GPIO83/XA11
GPIO84/XA12
VDDIO
VSS
GPIO85/XA13
GPIO86/XA14
GPIO87/XA15
GPIO39/XA16
GPIO31/CANTXA/XA17
Figure 6-1. F2833x, F2823x 176-Pin PGF/PTP LQFP (Top View)
12
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Note
The thermal pad should be soldered to the ground (GND) plane of the PCB because this will provide
the best thermal conduction path. For this device, the thermal pad is not electrically shorted to the
internal die VSS; therefore, the thermal pad does not provide an electrical connection to the PCB
ground. To make optimum use of the thermal efficiencies designed into the PowerPAD™ package, the
PCB must be designed with this technology in mind. A thermal land is required on the surface of the
PCB directly underneath the thermal pad. The thermal land should be soldered to the thermal pad;
the thermal land should be as large as needed to dissipate the required heat. An array of thermal vias
should be used to connect the thermal pad to the internal GND plane of the board. See PowerPAD™
Thermally Enhanced Package for more details on using the PowerPAD package.
Copyright © 2022 Texas Instruments Incorporated
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
13
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
1
2
3
4
5
6
7
P
VSSAIO
ADCINB0
ADCINB2
ADCINB6
ADCREFP
VSS
GPIO21/
EQEP1B/
MDRA/
CANRXB
P
N
ADCINA1
VDDAIO
ADCINB1
ADCINB5
ADCREFM
VDD
GPIO22/
EQEP1S/
MCLKXA/
SCITXDB
N
M
ADCINA2
ADCLO
ADCINA0
ADCINB4
ADCRESEXT
VDD2A18
GPIO23/
EQEP1I/
MFSXA/
SCIRXDB
M
ADCREFIN
GPIO18/
SPICLKA/
SCITXDB/
CANRXA
GPIO20/
EQEP1A/
MDXA/
CANTXB
L
VSS2AGND
GPIO19/
SPISTEA/
SCIRXDB/
CANTXA
K
6
7
L
ADCINA5
ADCINA4
ADCINA3
ADCINB3
K
VSS1AGND
J
GPIO17/
SPISOMIA/
CANRXB/
TZ6
VDD
VSS
VDD1A18
ADCINA6
J
VDD
GPIO14/
TZ3/XHOLD/
SCITXDB/
MCLKXB
GPIO13/
TZ2/
CANRXB/
MDRB
GPIO15/
TZ4/XHOLDA/
SCIRXDB/
MFSXB
GPIO16/
SPISIMOA/
CANTXB/
TZ5
H
1
2
3
4
5
H
VDDA2
VSSA2
ADCINA7
ADCINB7
Figure 6-2. F2833x, F2823x 179-Ball ZHH MicroStar BGA and 179-Ball ZAY nFBGA (Upper-Left Quadrant)
(Bottom View)
14
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
10
13
8
9
P
VSS
GPIO33/
SCLA/
EPWMSYNCO/
ADCSOCBO
TMS
TEST2
EMU1
GPIO48/
ECAP5/
XD31
GPIO50/
EQEP1A/
XD29
P
N
GPIO25/
ECAP2/
EQEP2B/
MDRB
GPIO32/
SDAA/
EPWMSYNCI/
ADCSOCAO
VSS
VSS
TCK
GPIO49/
ECAP6/
XD30
VDDIO
N
M
GPIO24/
ECAP1/
EQEP2A/
MDXB
TDI
TRST
VDD3VFL
VSS
GPIO51/
EQEP1B/
XD28
GPIO52/
EQEP1S/
XD27
M
L
VDDIO
GPIO27/
ECAP4/
EQEP2S/
MFSXB
XRS
EMU0
GPIO53/
EQEP1I/
XD26
GPIO54/
SPISIMOA/
XD25
GPIO55/
SPISOMIA/
XD24
L
K
GPIO26/
ECAP3/
EQEP2I/
MCLKXB
TDO
TEST1
GPIO56/
SPICLKA/
XD23
GPIO58/
MCLKRA/
XD21
GPIO57/
SPISTEA/
XD22
VDD
K
8
9
J
VSS
X2
VSS
X1
XCLKIN
J
H
VSS
VDDIO
VDD
VSS
GPIO59/
MFSRA/
XD20
H
10
11
12
13
14
11
12
14
Figure 6-3. F2833x, F2823x 179-Ball ZHH MicroStar BGA and 179-Ball ZAY nFBGA (Upper-Right
Quadrant) (Bottom View)
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
15
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
1
2
3
4
5
G
VSS
GPIO11/
EPWM6B/
SCIRXDB/
ECAP4
GPIO12/
TZ1/
CANTXB/
MDXB
GPIO10/
EPWM6A/
CANRXB/
ADCSOCBO
GPIO9/
EPWM5B/
SCITXDB/
ECAP3
G
F
GPIO8/
EPWM5A/
CANTXB/
ADCSOCAO
GPIO7/
EPWM4B/
MCLKRA/
ECAP2
VDD
VSS
VDDIO
F
E
GPIO6/
EPWM4A/
EPWMSYNCI/
EPWMSYNCO
GPIO4/
EPWM3A
GPIO5/
EPWM3B/
MFSRA/
ECAP1
GPIO3/
EPWM2B/
ECAP5/
MCLKRB
D
VSS
GPIO2/
EPWM2A
GPIO1/
EPWM1B/
ECAP6/
MFSRB
C
GPIO0/
EPWM1A
GPIO29/
SCITXDA/
XA19
B
VDD
A
6
7
GPIO84/
XA12
GPIO81/
XA9
VDDIO
E
GPIO86/
XA14
GPIO83/
XA11
VSS
GPIO45/
XA5
D
VSS
GPIO85/
XA13
GPIO82/
XA10
GPIO80/
XA8
VSS
C
GPIO30/
CANRXA/
XA18
GPIO39/
XA16
VSS
VDD
GPIO46/
XA6
GPIO43/
XA3
B
GPIO31/
CANTXA/
XA17
GPIO87/
XA15
VDDIO
VSS
GPIO47/
XA7
GPIO44/
XA4
A
2
3
4
5
6
7
1
Figure 6-4. F2833x, F2823x 179-Ball ZHH MicroStar BGA and 179-Ball ZAY nFBGA (Lower-Left Quadrant)
(Bottom View)
16
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Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
10
11
12
13
14
G
GPIO64/
XD15
GPIO63/
SCITXDC/
XD16
GPIO61/
MFSRB/
XD18
GPIO62/
SCIRXDC
XD17
GPIO60/
MCLKRB/
XD19
G
F
GPIO69/
XD10
GPIO66/
XD13
VSS
VDD
GPIO65/
XD14
F
8
9
E
VSS
VDD
GPIO28/
SCIRXDA/
XZCS6
GPIO68/
XD11
VDDIO
GPIO67/
XD12
VSS
E
D
GPIO40/
XA0/
XWE1
GPIO37/
ECAP2/
XZCS7
GPIO34/
ECAP1/
XREADY
GPIO38/
XWE0
GPIO70/
XD9
VDD
VSS
D
C
VDD
VSS
GPIO36/
SCIRXDA/
XZCS0
XCLKOUT
GPIO73/
XD6
GPIO74/
XD5
GPIO71/
XD8
C
B
GPIO42/
XA2
XRD
VDDIO
VDD
GPIO78/
XD1
GPIO76/
XD3
GPIO72/
XD7
B
A
GPIO41/
XA1
GPIO35/
SCITXDA/
XR/W
VSS
VSS
GPIO79/
XD0
GPIO77/
XD2
GPIO75/
XD4
A
8
9
10
11
12
13
14
Figure 6-5. F2833x, F2823x 179-Ball ZHH MicroStar BGA and 179-Ball ZAY nFBGA (Lower-Right
Quadrant) (Bottom View)
Copyright © 2022 Texas Instruments Incorporated
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17
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
1
2
3
4
5
6
7
P
VSSA2
VSS2AGND
ADCINB0
ADCREFM
ADCREFP
ADCRESEXT
ADCREFIN
N
VSSAIO
ADCLO
ADCINB1
ADCINB3
ADCINB5
ADCINB7
EMU0
M
ADCINA2
ADCINA1
ADCINA0
ADCINB2
ADCINB4
ADCINB6
TEST1
L
ADCINA5
ADCINA4
ADCINA3
VSS1AGND
VDDAIO
VDD2A18
TEST2
K
ADCINA7
ADCINA6
VDD1A18
VDDA2
J
GPIO15/
TZ4/XHOLDA/
SCIRXDB/
MFSXB
GPIO16/
SPISIMOA/
CANTXB/
TZ5
GPIO17/
SPISOMIA/
CANRXB/
TZ6
VDD
VSS
VSS
H
GPIO12/
TZ1/
CANTXB/
MDXB
GPIO13/
TZ2/
CANRXB/
MDRB
GPIO14/
TZ3/XHOLD/
SCITXDB/
MCLKXB
VDD
VSS
VSS
Figure 6-6. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper-Left Quadrant) (Bottom View)
18
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
8
9
10
11
12
13
14
EMU1
GPIO20/
EQEP1A/
MDXA/
CANTXB
GPIO23/
EQEP1I/
MFSXA/
SCIRXDB
GPIO26/
ECAP3/
EQEP2I/
MCLKXB
GPIO33/
SCLA/
EPWMSYNCO/
ADCSOCBO
VSS
VSS
P
GPIO18/
SPICLKA/
SCITXDB/
CANRXA
GPIO21/
EQEP1B/
MDRA/
CANRXB
GPIO24/
ECAP1/
EQEP2A/
MDXB
GPIO27/
ECAP4/
EQEP2S/
MFSXB
TDI
TDO
VDDIO
N
GPIO19/
SPISTEA/
SCIRXDB/
CANTXA
GPIO22/
EQEP1S/
MCLKXA/
SCITXDB
GPIO25/
ECAP2/
EQEP2B/
MDRB
GPIO32/
SDAA/
EPWMSYNCI/
ADSOCAO
TMS
XRS
TCK
M
VDD
VDD3VFL
VDDIO
TRST
GPIO50/
EQEP1A/
XD29
GPIO49/
ECAP6/
XD30
GPIO48/
ECAP5/
XD31
L
VDD
GPIO53
EQEP1I/
XD26
GPIO52/
EQEP1S/
XD27
GPIO51/
EQEP1B/
XD28
K
VSS
VSS
VDD
GPIO56/
SPICLKA/
XD23
GPIO55/
SPISOMIA/
XD24
GPIO54/
SPISIMOA/
XD25
J
VSS
VSS
GPIO59/
MFSRA/
XD20
GPIO58/
MCLKRA/
XD21
GPIO57/
SPISTEA/
XD22
X2
H
Figure 6-7. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Upper-Right Quadrant) (Bottom View)
Copyright © 2022 Texas Instruments Incorporated
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
19
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
G
GPIO9/
EPWM5B/
SCITXDB/
ECAP3
GPIO10/
EPWM6A/
CANRXB/
ADCSOCBO
GPIO11/
EPWM6B/
SCIRXDB/
ECAP4
VDDIO
VSS
VSS
F
GPIO6/
EPWM4A/
EPWMSYNCI/
EPWMSYNCO
GPIO7/
EPWM4B/
MCLKRA/
ECAP2
GPIO8/
EPWM5A/
CANTXB/
ADCSOCAO
VDD
VSS
VSS
E
GPIO3/
EPWM2B/
ECAP5/
MCLKRB
GPIO4/
EPWM3A
GPIO5/
EPWM3B/
MFSRA/
ECAP1
VDDIO
D
GPIO0/
EPWM1A
GPIO1/
EPWM1B/
ECAP6/
MFSRB
GPIO2/
EPWM2A
VDD
VDD
GPIO47/
XA7
VDDIO
C
GPIO29/
SCITXDA/
XA19
GPIO30/
CANRXA/
XA18
GPIO39/
XA16
GPIO85/
XA13
GPIO82/
XA10
GPIO46/
XA6
GPIO43/
XA3
B
VDDIO
GPIO31/
CANTXA/
XA17
GPIO87/
XA15
GPIO84/
XA12
GPIO81/
XA9
GPIO45/
XA5
GPIO42/
XA2
A
VSS
VSS
GPIO86/
XA14
GPIO83/
XA11
GPIO80/
XA8
GPIO44/
XA4
GPIO41/
XA1
1
2
3
4
5
6
7
Figure 6-8. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower-Left Quadrant) (Bottom View)
20
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Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
VSS
VSS
VDDIO
GPIO60/
MCLKRB/
XD19
XCLKIN
X1
G
VSS
VSS
VDD
GPIO63/
SCITXDC/
XD16
GPIO62/
SCIRXDC/
XD17
GPIO61/
MFSRB/
XD18
F
VDD
GPIO66/
XD13
GPIO65/
XD14
GPIO64/
XD15
E
VDD
VDD
GPIO28/
SCIRXDA/
XZCS6
VDDIO
GPIO69/
XD10
GPIO68/
XD11
GPIO67/
XD12
D
GPIO40/
XA0/XWE1
GPIO36/
SCIRXDA/
XZCS0
GPIO38/
XWE0
GPIO78/
XD1
GPIO75/
XD4
GPIO71/
XD8
GPIO70/
XD9
C
GPIO37/
ECAP2/
XZCS7
GPIO35/
SCITXDA/
XR/W
GPIO79/
XD0
GPIO77/
XD2
GPIO74/
XD5
GPIO72
XD7
VSS
B
XRD
GPIO34/
ECAP1/
XREADY
XCLKOUT
GPIO76/
XD3
GPIO73/
XD6
VDDIO
VSS
A
8
9
10
11
12
13
14
Figure 6-9. F2833x, F2823x 176-Ball ZJZ Plastic BGA (Lower-Right Quadrant) (Bottom View)
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
21
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
6.2 Signal Descriptions
Table 6-1 describes the signals. The GPIO function (shown in Italics) is the default at reset. The peripheral
signals that are listed under them are alternate functions. Some peripheral functions may not be available in
all devices. See Table 5-1 and Table 5-2 for details. Inputs are not 5-V tolerant. All pins capable of producing
an XINTF output function have a drive strength of 8 mA (typical). This is true even if the pin is not configured
for XINTF functionality. All other pins have a drive strength of 4-mA drive typical (unless otherwise indicated).
All GPIO pins are I/O/Z and have an internal pullup, which can be selectively enabled or disabled on a per-pin
basis. This feature only applies to the GPIO pins. The pullups on GPIO0–GPIO11 pins are not enabled at reset.
The pullups on GPIO12–GPIO87 are enabled upon reset.
Table 6-1. Signal Descriptions
PIN NO.
NAME
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
DESCRIPTION (1)
ZJZ
BALL #
JTAG
TRST
78
M10
L11
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system
control of the operations of the device. If this signal is not connected or driven low, the
device operates in its functional mode, and the test reset signals are ignored.
NOTE: TRST is an active high test pin and must be maintained low at all times during
normal device operation. An external pulldown resistor is required on this pin. The value
of this resistor should be based on drive strength of the debugger pods applicable to the
design. A 2.2-kΩ resistor generally offers adequate protection. Because this is applicationspecific, TI recommends validating each target board for proper operation of the debugger
and the application. (I, ↓)
TCK
87
N12
M14
JTAG test clock with internal pullup (I, ↑)
TMS
79
P10
M12
JTAG test-mode select (TMS) with internal pullup. This serial control input is clocked into
the TAP controller on the rising edge of TCK. (I, ↑)
TDI
76
M9
N12
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected register
(instruction or data) on a rising edge of TCK. (I, ↑)
TDO
77
K9
N13
JTAG scan out, test data output (TDO). The contents of the selected register (instruction or
data) are shifted out of TDO on the falling edge of TCK. (O/Z 8 mA drive)
N7
Emulator pin 0. When TRST is driven high, this pin is used as an interrupt to or from the
JTAG debug probe system and is defined as input/output through the JTAG scan. This pin
is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high
state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the
device into boundary-scan mode. (I/O/Z, 8 mA drive ↑)
NOTE: An external pullup resistor is required on this pin. The value of this resistor should
be based on the drive strength of the debugger pods applicable to the design. A 2.2-kΩ to
4.7-kΩ resistor is generally adequate. Because this is application-specific, TI recommends
validating each target board for proper operation of the debugger and the application.
P8
Emulator pin 1. When TRST is driven high, this pin is used as an interrupt to or from the
JTAG debug probe system and is defined as input/output through the JTAG scan. This pin
is also used to put the device into boundary-scan mode. With the EMU0 pin at a logic-high
state and the EMU1 pin at a logic-low state, a rising edge on the TRST pin would latch the
device into boundary-scan mode. (I/O/Z, 8 mA drive ↑)
NOTE: An external pullup resistor is required on this pin. The value of this resistor should
be based on the drive strength of the debugger pods applicable to the design. A 2.2-kΩ to
4.7-kΩ resistor is generally adequate. Because this is application-specific, TI recommends
validating each target board for proper operation of the debugger and the application.
EMU0
EMU1
85
86
L11
P12
FLASH
VDD3VFL
84
M11
L9
3.3-V Flash Core Power Pin. This pin should be connected to 3.3 V at all times.
TEST1
81
K10
M7
Test Pin. Reserved for TI. Must be left unconnected. (I/O)
TEST2
82
P11
L7
Test Pin. Reserved for TI. Must be left unconnected. (I/O)
22
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
NAME
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
DESCRIPTION (1)
ZJZ
BALL #
CLOCK
XCLKOUT
138
C11
A10
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency, one-half
the frequency, or one-fourth the frequency of SYSCLKOUT. This is controlled by bits
18:16 (XTIMCLK) and bit 2 (CLKMODE) in the XINTCNF2 register. At reset, XCLKOUT =
SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XINTCNF2[CLKOFF]
to 1. Unlike other GPIO pins, the XCLKOUT pin is not placed in high-impedance state
during a reset. (O/Z, 8 mA drive).
XCLKIN
105
J14
G13
External Oscillator Input. This pin is to feed a clock from an external 3.3-V oscillator. In this
case, the X1 pin must be tied to GND. If a crystal/resonator is used (or if an external 1.9-V
oscillator is used to feed clock to X1 pin), this pin must be tied to GND. (I)
X1
104
J13
G14
Internal/External Oscillator Input. To use the internal oscillator, a quartz crystal or a
ceramic resonator may be connected across X1 and X2. The X1 pin is referenced to the
1.9-V/1.8-V core digital power supply. A 1.9-V/1.8-V external oscillator may be connected
to the X1 pin. In this case, the XCLKIN pin must be connected to ground. If a 3.3-V
external oscillator is used with the XCLKIN pin, X1 must be tied to GND. (I)
X2
102
J11
H14
Internal Oscillator Output. A quartz crystal or a ceramic resonator may be connected
across X1 and X2. If X2 is not used, it must be left unconnected. (O)
M13
Device Reset (in) and Watchdog Reset (out).
Device reset. XRS causes the device to terminate execution. The PC will point to the
address contained at the location 0x3FFFC0. When XRS is brought to a high level,
execution begins at the location pointed to by the PC. This pin is driven low by the MCU
when a watchdog reset occurs. During watchdog reset, the XRS pin is driven low for the
watchdog reset duration of 512 OSCCLK cycles. (I/OD, ↑)
The output buffer of this pin is an open drain with an internal pullup. If this pin is driven by
an external device, it should be done using an open-drain device.
An external R-C circuit may be used on the pin, taking care that the timing requirements
during power down are still met.
RESET
XRS
80
L10
ADC SIGNALS
ADCINA7
35
K4
K1
ADC Group A, Channel 7 input (I)
ADCINA6
36
J5
K2
ADC Group A, Channel 6 input (I)
ADCINA5
37
L1
L1
ADC Group A, Channel 5 input (I)
ADCINA4
38
L2
L2
ADC Group A, Channel 4 input (I)
ADCINA3
39
L3
L3
ADC Group A, Channel 3 input (I)
ADCINA2
40
M1
M1
ADC Group A, Channel 2 input (I)
ADCINA1
41
N1
M2
ADC Group A, Channel 1 input (I)
ADCINA0
42
M3
M3
ADC Group A, Channel 0 input (I)
ADCINB7
53
K5
N6
ADC Group B, Channel 7 input (I)
ADCINB6
52
P4
M6
ADC Group B, Channel 6 input (I)
ADCINB5
51
N4
N5
ADC Group B, Channel 5 input (I)
ADCINB4
50
M4
M5
ADC Group B, Channel 4 input (I)
ADCINB3
49
L4
N4
ADC Group B, Channel 3 input (I)
ADCINB2
48
P3
M4
ADC Group B, Channel 2 input (I)
ADCINB1
47
N3
N3
ADC Group B, Channel 1 input (I)
ADCINB0
46
P2
P3
ADC Group B, Channel 0 input (I)
ADCLO
43
M2
N2
Low Reference (connect to analog ground) (I)
ADCRESEXT
57
M5
P6
ADC External Current Bias Resistor. Connect a 22-kΩ resistor to analog ground.
ADCREFIN
54
L5
P7
External reference input (I)
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23
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
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TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
NAME
ADCREFP
ADCREFM
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
56
P5
P5
Internal Reference Positive Output. Requires a low ESR (under 1.5 Ω) ceramic bypass
capacitor of 2.2 μF to analog ground. (O)
NOTE: Use the ADC Clock rate to derive the ESR specification from the capacitor data
sheet that is used in the system.
P4
Internal Reference Medium Output. Requires a low ESR (under 1.5 Ω) ceramic bypass
capacitor of 2.2 μF to analog ground. (O)
NOTE: Use the ADC Clock rate to derive the ESR specification from the capacitor data
sheet that is used in the system.
55
N5
DESCRIPTION (1)
CPU AND I/O POWER PINS
VDDA2
34
K2
K4
ADC Analog Power Pin
VSSA2
33
K3
P1
ADC Analog Ground Pin
VDDAIO
45
N2
L5
ADC Analog I/O Power Pin
VSSAIO
44
P1
N1
ADC Analog I/O Ground Pin
VDD1A18
31
J4
K3
ADC Analog Power Pin
VSS1AGND
32
K1
L4
ADC Analog Ground Pin
VDD2A18
59
M6
L6
ADC Analog Power Pin
VSS2AGND
58
K6
P2
ADC Analog Ground Pin
VDD
4
B1
D4
VDD
15
B5
D5
VDD
23
B11
D8
VDD
29
C8
D9
VDD
61
D13
E11
VDD
101
E9
F4
VDD
109
F3
F11
VDD
117
F13
H4
VDD
126
H1
J4
VDD
139
H12
J11
VDD
146
J2
K11
VDD
154
K14
L8
VDD
167
N6
VDDIO
9
A4
A13
VDDIO
71
B10
B1
VDDIO
93
E7
D7
VDDIO
107
E12
D11
VDDIO
121
F5
E4
VDDIO
143
L8
G4
VDDIO
159
H11
G11
VDDIO
170
N14
L10
VDDIO
24
CPU and Logic Digital Power Pins
Digital I/O Power Pin
N14
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
NAME
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
VSS
3
A5
A1
VSS
8
A10
A2
VSS
14
A11
A14
VSS
22
B4
B14
VSS
30
C3
F6
VSS
60
C7
F7
VSS
70
C9
F8
VSS
83
D1
F9
VSS
92
D6
G6
VSS
103
D14
G7
VSS
106
E8
G8
VSS
108
E14
G9
VSS
118
F4
H6
VSS
120
F12
H7
VSS
125
G1
H8
VSS
140
H10
H9
VSS
144
H13
J6
VSS
147
J3
J7
VSS
155
J10
J8
VSS
160
J12
J9
VSS
166
M12
P13
VSS
171
N10
P14
VSS
N11
VSS
P6
VSS
P8
DESCRIPTION (1)
Digital Ground Pins
GPIO AND PERIPHERAL SIGNALS
GPIO0
EPWM1A
-
5
C1
D1
General-purpose input/output 0 (I/O/Z)
Enhanced PWM1 Output A and HRPWM channel (O)
-
GPIO1
EPWM1B
ECAP6
MFSRB
6
D3
D2
General-purpose input/output 1 (I/O/Z)
Enhanced PWM1 Output B (O)
Enhanced Capture 6 input/output (I/O)
McBSP-B receive frame synch (I/O)
GPIO2
EPWM2A
-
7
D2
D3
General-purpose input/output 2 (I/O/Z)
Enhanced PWM2 Output A and HRPWM channel (O)
-
E1
General-purpose input/output 3 (I/O/Z)
Enhanced PWM2 Output B (O)
Enhanced Capture 5 input/output (I/O)
McBSP-B receive clock (I/O)
E2
General-purpose input/output 4 (I/O/Z)
Enhanced PWM3 output A and HRPWM channel (O)
-
GPIO3
EPWM2B
ECAP5
MCLKRB
GPIO4
EPWM3A
-
10
11
E4
E2
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25
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
NAME
GPIO5
EPWM3B
MFSRA
ECAP1
GPIO6
EPWM4A
EPWMSYNCI
EPWMSYNCO
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
12
E3
E3
General-purpose input/output 5 (I/O/Z)
Enhanced PWM3 output B (O)
McBSP-A receive frame synch (I/O)
Enhanced Capture input/output 1 (I/O)
F1
General-purpose input/output 6 (I/O/Z)
Enhanced PWM4 output A and HRPWM channel (O)
External ePWM sync pulse input (I)
External ePWM sync pulse output (O)
13
E1
DESCRIPTION (1)
GPIO7
EPWM4B
MCLKRA
ECAP2
16
F2
F2
General-purpose input/output 7 (I/O/Z)
Enhanced PWM4 output B (O)
McBSP-A receive clock (I/O)
Enhanced capture input/output 2 (I/O)
GPIO8
EPWM5A
CANTXB
ADCSOCAO
17
F1
F3
General-purpose Input/Output 8 (I/O/Z)
Enhanced PWM5 output A and HRPWM channel (O)
Enhanced CAN-B transmit (O)
ADC start-of-conversion A (O)
G1
General-purpose input/output 9 (I/O/Z)
Enhanced PWM5 output B (O)
SCI-B transmit data(O)
Enhanced capture input/output 3 (I/O)
GPIO9
EPWM5B
SCITXDB
ECAP3
18
G5
GPIO10
EPWM6A
CANRXB
ADCSOCBO
19
G4
G2
General-purpose input/output 10 (I/O/Z)
Enhanced PWM6 output A and HRPWM channel (O)
Enhanced CAN-B receive (I)
ADC start-of-conversion B (O)
GPIO11
EPWM6B
SCIRXDB
ECAP4
20
G2
G3
General-purpose input/output 11 (I/O/Z)
Enhanced PWM6 output B (O)
SCI-B receive data (I)
Enhanced CAP Input/Output 4 (I/O)
H1
General-purpose input/output 12 (I/O/Z)
Trip Zone input 1 (I)
Enhanced CAN-B transmit (O)
McBSP-B transmit serial data (O)
H2
General-purpose input/output 13 (I/O/Z)
Trip Zone input 2 (I)
Enhanced CAN-B receive (I)
McBSP-B receive serial data (I)
GPIO12
TZ1
CANTXB
MDXB
GPIO13
TZ2
CANRXB
MDRB
21
24
G3
H3
GPIO14
General-purpose input/output 14 (I/O/Z)
TZ3/ XHOLD
Trip Zone input 3/External Hold Request. XHOLD, when active (low), requests the external
interface (XINTF) to release the external bus and place all buses and strobes into a highimpedance state. To prevent this from happening when TZ3 signal goes active, disable this
function by writing XINTCNF2[HOLD] = 1. If this is not done, the XINTF bus will go into
high impedance anytime TZ3 goes low. On the ePWM side, TZn signals are ignored by
default, unless they are enabled by the code. The XINTF will release the bus when any
current access is complete and there are no pending accesses on the XINTF. (I)
25
H2
H3
SCITXDB
SCI-B Transmit (O)
MCLKXB
McBSP-B transmit clock (I/O)
26
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
PGF,
PTP
PIN #
NAME
ZHH,
ZAY
BALL #
DESCRIPTION (1)
ZJZ
BALL #
GPIO15
General-purpose input/output 15 (I/O/Z)
TZ4/ XHOLDA
Trip Zone input 4/External Hold Acknowledge. The pin function for this option is based on
the direction chosen in the GPADIR register. If the pin is configured as an input, then TZ4
function is chosen. If the pin is configured as an output, then XHOLDA function is chosen.
XHOLDA is driven active (low) when the XINTF has granted an XHOLD request. All XINTF
buses and strobe signals will be in a high-impedance state. XHOLDA is released when
the XHOLD signal is released. External devices should only drive the external bus when
XHOLDA is active (low). (I/O)
26
H4
J1
SCIRXDB
SCI-B receive (I)
MFSXB
McBSP-B transmit frame synch (I/O)
GPIO16
SPISIMOA
CANTXB
TZ5
GPIO17
SPISOMIA
CANRXB
TZ6
27
28
H5
J1
J2
General-purpose input/output 16 (I/O/Z)
SPI slave in, master out (I/O)
Enhanced CAN-B transmit (O)
Trip Zone input 5 (I)
J3
General-purpose input/output 17 (I/O/Z)
SPI-A slave out, master in (I/O)
Enhanced CAN-B receive (I)
Trip zone input 6 (I)
GPIO18
SPICLKA
SCITXDB
CANRXA
62
L6
N8
General-purpose input/output 18 (I/O/Z)
SPI-A clock input/output (I/O)
SCI-B transmit (O)
Enhanced CAN-A receive (I)
GPIO19
SPISTEA
SCIRXDB
CANTXA
63
K7
M8
General-purpose input/output 19 (I/O/Z)
SPI-A slave transmit enable input/output (I/O)
SCI-B receive (I)
Enhanced CAN-A transmit (O)
P9
General-purpose input/output 20 (I/O/Z)
Enhanced QEP1 input A (I)
McBSP-A transmit serial data (O)
Enhanced CAN-B transmit (O)
GPIO20
EQEP1A
MDXA
CANTXB
64
L7
GPIO21
EQEP1B
MDRA
CANRXB
65
P7
N9
General-purpose input/output 21 (I/O/Z)
Enhanced QEP1 input B (I)
McBSP-A receive serial data (I)
Enhanced CAN-B receive (I)
GPIO22
EQEP1S
MCLKXA
SCITXDB
66
N7
M9
General-purpose input/output 22 (I/O/Z)
Enhanced QEP1 strobe (I/O)
McBSP-A transmit clock (I/O)
SCI-B transmit (O)
GPIO23
EQEP1I
MFSXA
SCIRXDB
67
M7
P10
General-purpose input/output 23 (I/O/Z)
Enhanced QEP1 index (I/O)
McBSP-A transmit frame synch (I/O)
SCI-B receive (I)
N10
General-purpose input/output 24 (I/O/Z)
Enhanced capture 1 (I/O)
Enhanced QEP2 input A (I)
McBSP-B transmit serial data (O)
GPIO24
ECAP1
EQEP2A
MDXB
68
M8
GPIO25
ECAP2
EQEP2B
MDRB
69
N8
M10
General-purpose input/output 25 (I/O/Z)
Enhanced capture 2 (I/O)
Enhanced QEP2 input B (I)
McBSP-B receive serial data (I)
GPIO26
ECAP3
EQEP2I
MCLKXB
72
K8
P11
General-purpose input/output 26 (I/O/Z)
Enhanced capture 3 (I/O)
Enhanced QEP2 index (I/O)
McBSP-B transmit clock (I/O)
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27
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
GPIO27
ECAP4
EQEP2S
MFSXB
73
L9
N11
General-purpose input/output 27 (I/O/Z)
Enhanced capture 4 (I/O)
Enhanced QEP2 strobe (I/O)
McBSP-B transmit frame synch (I/O)
GPIO28
SCIRXDA
XZCS6
141
E10
D10
General-purpose input/output 28 (I/O/Z)
SCI receive data (I)
External Interface zone 6 chip select (O)
GPIO29
SCITXDA
XA19
2
C2
C1
General-purpose input/output 29. (I/O/Z)
SCI transmit data (O)
External Interface Address Line 19 (O)
GPIO30
CANRXA
XA18
1
B2
C2
General-purpose input/output 30 (I/O/Z)
Enhanced CAN-A receive (I)
External Interface Address Line 18 (O)
GPIO31
CANTXA
XA17
176
A2
B2
General-purpose input/output 31 (I/O/Z)
Enhanced CAN-A transmit (O)
External Interface Address Line 17 (O)
NAME
GPIO32
SDAA
EPWMSYNCI
ADCSOCAO
74
GPIO33
SCLA
EPWMSYNCO
ADCSOCBO
75
N9
P9
DESCRIPTION (1)
M11
General-purpose input/output 32 (I/O/Z)
I2C data open-drain bidirectional port (I/OD)
Enhanced PWM external sync pulse input (I)
ADC start-of-conversion A (O)
P12
General-purpose Input/Output 33 (I/O/Z)
I2C clock open-drain bidirectional port (I/OD)
Enhanced PWM external synch pulse output (O)
ADC start-of-conversion B (O)
GPIO34
ECAP1
XREADY
142
D10
A9
General-purpose Input/Output 34 (I/O/Z)
Enhanced Capture input/output 1 (I/O)
External Interface Ready signal. Note that this pin is always (directly) connected to the
XINTF. If an application uses this pin as a GPIO while also using the XINTF, it should
configure the XINTF to ignore READY.
GPIO35
SCITXDA
XR/ W
148
A9
B9
General-purpose Input/Output 35 (I/O/Z)
SCI-A transmit data (O)
External Interface read, not write strobe
GPIO36
SCIRXDA
XZCS0
145
C10
C9
General-purpose Input/Output 36 (I/O/Z)
SCI receive data (I)
External Interface zone 0 chip select (O)
GPIO37
ECAP2
XZCS7
150
D9
B8
General-purpose Input/Output 37 (I/O/Z)
Enhanced Capture input/output 2 (I/O)
External Interface zone 7 chip select (O)
GPIO38
XWE0
137
D11
C10
General-purpose Input/Output 38 (I/O/Z)
External Interface Write Enable 0 (O)
GPIO39
XA16
175
B3
C3
General-purpose Input/Output 39 (I/O/Z)
External Interface Address Line 16 (O)
GPIO40
XA0/ XWE1
151
D8
C8
General-purpose Input/Output 40 (I/O/Z)
External Interface Address Line 0/External Interface Write Enable 1 (O)
GPIO41
XA1
152
A8
A7
General-purpose Input/Output 41 (I/O/Z)
External Interface Address Line 1 (O)
GPIO42
XA2
153
B8
B7
General-purpose Input/Output 42 (I/O/Z)
External Interface Address Line 2 (O)
28
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
GPIO43
XA3
156
B7
C7
General-purpose Input/Output 43 (I/O/Z)
External Interface Address Line 3 (O)
GPIO44
XA4
157
A7
A6
General-purpose Input/Output 44 (I/O/Z)
External Interface Address Line 4 (O)
GPIO45
XA5
158
D7
B6
General-purpose Input/Output 45 (I/O/Z)
External Interface Address Line 5 (O)
GPIO46
XA6
161
B6
C6
General-purpose Input/Output 46 (I/O/Z)
External Interface Address Line 6 (O)
GPIO47
XA7
162
A6
D6
General-purpose Input/Output 47 (I/O/Z)
External Interface Address Line 7 (O)
GPIO48
ECAP5
XD31
88
P13
L14
General-purpose Input/Output 48 (I/O/Z)
Enhanced Capture input/output 5 (I/O)
External Interface Data Line 31 (I/O/Z)
GPIO49
ECAP6
XD30
89
N13
L13
General-purpose Input/Output 49 (I/O/Z)
Enhanced Capture input/output 6 (I/O)
External Interface Data Line 30 (I/O/Z)
GPIO50
EQEP1A
XD29
90
P14
L12
General-purpose Input/Output 50 (I/O/Z)
Enhanced QEP1 input A (I)
External Interface Data Line 29 (I/O/Z)
GPIO51
EQEP1B
XD28
91
M13
K14
General-purpose Input/Output 51 (I/O/Z)
Enhanced QEP1 input B (I)
External Interface Data Line 28 (I/O/Z)
GPIO52
EQEP1S
XD27
94
M14
K13
General-purpose Input/Output 52 (I/O/Z)
Enhanced QEP1 Strobe (I/O)
External Interface Data Line 27 (I/O/Z)
GPIO53
EQEP1I
XD26
95
L12
K12
General-purpose Input/Output 53 (I/O/Z)
Enhanced QEP1 lndex (I/O)
External Interface Data Line 26 (I/O/Z)
GPIO54
SPISIMOA
XD25
96
L13
J14
General-purpose Input/Output 54 (I/O/Z)
SPI-A slave in, master out (I/O)
External Interface Data Line 25 (I/O/Z)
GPIO55
SPISOMIA
XD24
97
L14
J13
General-purpose Input/Output 55 (I/O/Z)
SPI-A slave out, master in (I/O)
External Interface Data Line 24 (I/O/Z)
GPIO56
SPICLKA
XD23
98
K11
J12
General-purpose Input/Output 56 (I/O/Z)
SPI-A clock (I/O)
External Interface Data Line 23 (I/O/Z)
GPIO57
SPISTEA
XD22
99
K13
H13
General-purpose Input/Output 57 (I/O/Z)
SPI-A slave transmit enable (I/O)
External Interface Data Line 22 (I/O/Z)
GPIO58
MCLKRA
XD21
100
K12
H12
General-purpose Input/Output 58 (I/O/Z)
McBSP-A receive clock (I/O)
External Interface Data Line 21 (I/O/Z)
GPIO59
MFSRA
XD20
110
H14
H11
General-purpose Input/Output 59 (I/O/Z)
McBSP-A receive frame synch (I/O)
External Interface Data Line 20 (I/O/Z)
GPIO60
MCLKRB
XD19
111
G14
G12
General-purpose Input/Output 60 (I/O/Z)
McBSP-B receive clock (I/O)
External Interface Data Line 19 (I/O/Z)
NAME
Copyright © 2022 Texas Instruments Incorporated
DESCRIPTION (1)
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
29
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
GPIO61
MFSRB
XD18
112
G12
F14
General-purpose Input/Output 61 (I/O/Z)
McBSP-B receive frame synch (I/O)
External Interface Data Line 18 (I/O/Z)
GPIO62
SCIRXDC
XD17
113
G13
F13
General-purpose Input/Output 62 (I/O/Z)
SCI-C receive data (I)
External Interface Data Line 17 (I/O/Z)
GPIO63
SCITXDC
XD16
114
G11
F12
General-purpose Input/Output 63 (I/O/Z)
SCI-C transmit data (O)
External Interface Data Line 16 (I/O/Z)
GPIO64
XD15
115
G10
E14
General-purpose Input/Output 64 (I/O/Z)
External Interface Data Line 15 (I/O/Z)
GPIO65
XD14
116
F14
E13
General-purpose Input/Output 65 (I/O/Z)
External Interface Data Line 14 (I/O/Z)
GPIO66
XD13
119
F11
E12
General-purpose Input/Output 66 (I/O/Z)
External Interface Data Line 13 (I/O/Z)
GPIO67
XD12
122
E13
D14
General-purpose Input/Output 67 (I/O/Z)
External Interface Data Line 12 (I/O/Z)
GPIO68
XD11
123
E11
D13
General-purpose Input/Output 68 (I/O/Z)
External Interface Data Line 11 (I/O/Z)
GPIO69
XD10
124
F10
D12
General-purpose Input/Output 69 (I/O/Z)
External Interface Data Line 10 (I/O/Z)
GPIO70
XD9
127
D12
C14
General-purpose Input/Output 70 (I/O/Z)
External Interface Data Line 9 (I/O/Z)
GPIO71
XD8
128
C14
C13
General-purpose Input/Output 71 (I/O/Z)
External Interface Data Line 8 (I/O/Z)
GPIO72
XD7
129
B14
B13
General-purpose Input/Output 72 (I/O/Z)
External Interface Data Line 7 (I/O/Z)
GPIO73
XD6
130
C12
A12
General-purpose Input/Output 73 (I/O/Z)
External Interface Data Line 6 (I/O/Z)
GPIO74
XD5
131
C13
B12
General-purpose Input/Output 74 (I/O/Z)
External Interface Data Line 5 (I/O/Z)
GPIO75
XD4
132
A14
C12
General-purpose Input/Output 75 (I/O/Z)
External Interface Data Line 4 (I/O/Z)
GPIO76
XD3
133
B13
A11
General-purpose Input/Output 76 (I/O/Z)
External Interface Data Line 3 (I/O/Z)
GPIO77
XD2
134
A13
B11
General-purpose Input/Output 77 (I/O/Z)
External Interface Data Line 2 (I/O/Z)
GPIO78
XD1
135
B12
C11
General-purpose Input/Output 78 (I/O/Z)
External Interface Data Line 1 (I/O/Z)
NAME
30
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DESCRIPTION (1)
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 6-1. Signal Descriptions (continued)
PIN NO.
PGF,
PTP
PIN #
ZHH,
ZAY
BALL #
ZJZ
BALL #
GPIO79
XD0
136
A12
B10
General-purpose Input/Output 79 (I/O/Z)
External Interface Data Line 0 (I/O/Z)
GPIO80
XA8
163
C6
A5
General-purpose Input/Output 80 (I/O/Z)
External Interface Address Line 8 (O)
GPIO81
XA9
164
E6
B5
General-purpose Input/Output 81 (I/O/Z)
External Interface Address Line 9 (O)
GPIO82
XA10
165
C5
C5
General-purpose Input/Output 82 (I/O/Z)
External Interface Address Line 10 (O)
GPIO83
XA11
168
D5
A4
General-purpose Input/Output 83 (I/O/Z)
External Interface Address Line 11 (O)
GPIO84
XA12
169
E5
B4
General-purpose Input/Output 84 (I/O/Z)
External Interface Address Line 12 (O)
GPIO85
XA13
172
C4
C4
General-purpose Input/Output 85 (I/O/Z)
External Interface Address Line 13 (O)
GPIO86
XA14
173
D4
A3
General-purpose Input/Output 86 (I/O/Z)
External Interface Address Line 14 (O)
GPIO87
XA15
174
A3
B3
General-purpose Input/Output 87 (I/O/Z)
External Interface Address Line 15 (O)
XRD
149
B9
A8
External Interface Read Enable
NAME
(1)
DESCRIPTION (1)
I = Input, O = Output, Z = High impedance, OD = Open drain, ↑ = Pullup, ↓ = Pulldown
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31
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7 Specifications
This section provides the absolute maximum ratings and the recommended operating conditions.
7.1 Absolute Maximum Ratings
Unless otherwise noted, the list of absolute maximum ratings are specified over operating temperature ranges. (1) (2)
MIN
MAX
VDDIO, VDD3VFL with respect to VSS
–0.3
4.6
VDDA2, VDDAIO with respect to VSSA
–0.3
4.6
VDD with respect to VSS
–0.3
2.5
VDD1A18, VDD2A18 with respect to VSSA
–0.3
2.5
VSSA2, VSSAIO, VSS1AGND, VSS2AGND
with respect to VSS
–0.3
0.3
Input voltage
VIN
–0.3
4.6
Output voltage
VO
–0.3
4.6
V
Input clamp current
IIK (VIN < 0 or VIN > VDDIO)(3)
–20
20
mA
Output clamp current
IOK (VO < 0 or VO > VDDIO)
–20
20
mA
A version(4)
–40
85
S version
–40
125
Q version
–40
125
Junction temperature
TJ (4)
–40
150
°C
Storage temperature
Tstg (4)
–65
150
°C
Supply voltage
Operating ambient temperature, TA
(1)
(2)
(3)
(4)
UNIT
V
V
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 7.4 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
Continuous clamp current per pin is ±2 mA. This includes the analog inputs which have an internal clamping circuit that clamps the
voltage to a diode drop above VDDA2 or below VSSA2.
One or both of the following conditions may result in a reduction of overall device life:
•
•
long-term high-temperature storage
extended use at maximum temperature
For additional information, see Semiconductor and IC Package Thermal Metrics.
32
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7.2 ESD Ratings – Automotive
VALUE
UNIT
TMS320F2833x, TMS320F2823x in PTP Package
Human body model (HBM), per AEC Q100-002(1)
±2000
All pins
V(ESD)
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
±500
V
Corner pins on 176-pin
PTP: 1, 44, 45, 88, 89,
132, 133, 176
±750
TMS320F2833x, TMS320F2823x in ZJZ Package
Human body model (HBM), per AEC Q100-002(1)
V(ESD)
(1)
Electrostatic discharge
Charged-device model (CDM), per AEC Q100-011
±2000
All pins
±500
Corner pins on 176-ball
ZJZ: A1, A14, P1, P14
±750
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 ESD Ratings – Commercial
VALUE
UNIT
TMS320F2833x, TMS320F2823x in PGF Package
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101(2)
±500
V
TMS320F2833x, TMS320F2823x in ZHH Package
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101(2)
±500
V
TMS320F2833x, TMS320F2823x in ZAY Package
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101(2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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33
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
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7.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Device supply voltage, I/O, VDDIO
Device supply voltage CPU, VDD
MIN
NOM
MAX
UNIT
V
3.135
3.3
3.465
Device operation @ 150 MHz
1.805
1.9
1.995
Device operation @ 100 MHz
1.71
1.8
1.89
Supply ground, VSS, VSSIO, VSSAIO,
VSSA2, VSS1AGND, VSS2AGND
0
ADC supply voltage (3.3 V),
VDDA2, VDDAIO
ADC supply voltage,
VDD1A18, VDD2A18
3.3
3.465
Device operation @ 150 MHz
1.805
1.9
1.995
Device operation @ 100 MHz
1.71
1.8
1.89
3.135
3.3
3.465
Device clock frequency (system clock), F28335/F28334/F28235/F28234
fSYSCLKOUT
F28333/F28332/F28232
High-level input voltage, VIH
Low-level input voltage, VIL
All inputs except X1
X1
2
150
2
100
2
VDDIO
0.7 * VDD – 0.05
VDD
All inputs except X1
0.8
X1
0.3 * VDD + 0.05
High-level output source current,
VOH = 2.4 V, IOH
All I/Os except Group 2
Low-level output sink current,
VOL = VOL MAX, IOL
All I/Os except Group 2
Ambient temperature, TA
V
3.135
Flash supply voltage, VDD3VFL
Group
Group
–4
2(1)
–8
4
2(1)
8
A version
–40
85
S version
–40
125
Q version
–40
125
Junction temperature, TJ
(1)
34
V
125
V
V
V
MHz
V
V
mA
mA
°C
°C
Group 2 pins are as follows: GPIO28, GPIO29, GPIO30, GPIO31, TDO, XCLKOUT, EMU0, EMU1, XINTF pins, GPIO35-87, XRD.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7.5 Power Consumption Summary
7.5.1 TMS320F28335/F28235 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
MODE
TEST CONDITIONS
IDDIO (1)
IDD
TYP(4)
IDD3VFL (9)
MAX
TYP(4)
MAX
TYP
290 mA
315 mA
30 mA
50 mA
100 mA
120 mA
60 μA
15 mA
IDDA18 (2)
MAX
TYP(4)
35 mA
40 mA
120 μA
2 μA
60 μA
120 μA
60 μA
120 μA
IDDA33 (3)
MAX
TYP(4)
MAX
30 mA
35 mA
1.5 mA
2 mA
10 μA
5 μA
60 μA
15 μA
20 μA
2 μA
10 μA
5 μA
60 μA
15 μA
20 μA
2 μA
10 μA
5 μA
60 μA
15 μA
20 μA
The following peripheral clocks
are enabled:
•
ePWM1, ePWM2,
ePWM3, ePWM4,
ePWM5, ePWM6
•
eCAP1, eCAP2, eCAP3,
eCAP4, eCAP5, eCAP6
Operational
(Flash)(6)
•
eQEP1, eQEP2
•
eCAN-A
•
SCI-A, SCI-B
(FIFO mode)
•
SPI-A (FIFO mode)
•
ADC
•
I2C
•
CPU-Timer 0,
CPU-Timer 1,
CPU-Timer 2
All PWM pins are toggled at
150 kHz.
All I/O pins are left
unconnected.(5)
Flash is powered down.
XCLKOUT is turned off.
The following peripheral clocks
are enabled:
IDLE
•
eCAN-A
•
SCI-A
•
SPI-A
•
I2C
STANDBY
Flash is powered down.
Peripheral clocks are off.
8 mA
HALT(8)
Flash is powered down.
Peripheral clocks are off.
Input clock is disabled.(7)
150 μA
(1)
(2)
(3)
(4)
(5)
IDDIO current is dependent on the electrical loading on the I/O pins.
IDDA18 includes current into VDD1A18 and VDD2A18 pins. To realize the IDDA18 currents shown for IDLE, STANDBY, and HALT, clock to the
ADC module must be turned off explicitly by writing to the PCLKCR0 register.
IDDA33 includes current into VDDA2 and VDDAIO pins.
The TYP numbers are applicable over room temperature and nominal voltage. MAX numbers are at 125°C, and MAX voltage (VDD =
2.0 V; VDDIO, VDD3VFL, VDDA = 3.6 V).
The following is done in a loop:
•
•
•
(6)
(7)
(8)
(9)
Data is continuously transmitted out of the SCI-A, SCI-B, SPI-A, McBSP-A, and eCAN-A ports.
Multiplication/addition operations are performed.
Watchdog is reset.
• ADC is performing continuous conversion. Data from ADC is transferred to SARAM through the DMA.
• 32-bit read/write of the XINTF is performed.
• GPIO19 is toggled.
When the identical code is run off SARAM, IDD would increase as the code operates with zero wait states.
If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the internal oscillator.
HALT mode IDD currents will increase with temperature in a nonlinear fashion.
The IDD3VFL current indicated in this table is the flash read-current and does not include additional current for erase/write operations.
During flash programming, extra current is drawn from the VDD and VDD3VFL rails, as indicated in Section 7.9.7.3. If the user application
involves on-board flash programming, this extra current must be taken into account while architecting the power-supply stage.
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Note
The peripheral - I/O multiplexing implemented in the device prevents all available peripherals from
being used at the same time. This is because more than one peripheral function may share an I/O
pin. It is, however, possible to turn on the clocks to all the peripherals at the same time, although such
a configuration is not useful. If this is done, the current drawn by the device will be more than the
numbers specified in the current consumption tables.
7.5.2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
MODE
TEST CONDITIONS
IDDIO (1)
IDD
IDD3VFL (9)
IDDA18 (2)
IDDA33 (3)
TYP(4)
MAX
TYP(4)
MAX
TYP
MAX
TYP(4)
MAX
TYP(4)
MAX
290 mA
315 mA
30 mA
50 mA
35 mA
40 mA
30 mA
35 mA
1.5 mA
2 mA
The following peripheral
clocks are enabled:
•
ePWM1, ePWM2,
ePWM3, ePWM4,
ePWM5, ePWM6
•
eCAP1, eCAP2,
eCAP3, eCAP4,
eCAP5, eCAP6
Operational
(Flash)(6)
•
eQEP1, eQEP2
•
eCAN-A
•
SCI-A, SCI-B
(FIFO mode)
•
SPI-A (FIFO mode)
•
ADC
•
I2C
•
CPU-Timer 0,
CPU-Timer 1,
CPU-Timer 2
All PWM pins are toggled at
150 kHz.
All I/O pins are left
unconnected. (5)
36
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7.5.2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
(continued)
MODE
TEST CONDITIONS
IDDIO (1)
IDD
IDD3VFL (9)
IDDA18 (2)
IDDA33 (3)
TYP(4)
MAX
TYP(4)
MAX
TYP
MAX
TYP(4)
MAX
TYP(4)
MAX
100 mA
120 mA
60 μA
120 mA
2 μA
10 μA
5 μA
60 μA
15 μA
20 μA
15 mA
60 μA
120 μA
2 μA
10 μA
5 μA
60 μA
15 μA
20 μA
60 μA
120 μA
2 μA
10 μA
5 μA
60 μA
15 μA
20 μA
Flash is powered down.
XCLKOUT is turned off.
The following peripheral
clocks are enabled:
IDLE
•
eCAN-A
•
SCI-A
•
SPI-A
•
I2C
STANDBY
Flash is powered down.
Peripheral clocks are off.
8 mA
HALT(8)
Flash is powered down.
Peripheral clocks are off.
Input clock is disabled.(7)
150 μA
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
IDDIO current is dependent on the electrical loading on the I/O pins.
IDDA18 includes current into VDD1A18 and VDD2A18 pins. To realize the IDDA18 currents shown for IDLE, STANDBY, and HALT, clock to the
ADC module must be turned off explicitly by writing to the PCLKCR0 register.
IDDA33 includes current into VDDA2 and VDDAIO pins.
The TYP numbers are applicable over room temperature and nominal voltage. MAX numbers are at 125°C, and MAX voltage (VDD =
2.0 V; VDDIO, VDD3VFL, VDDA = 3.6 V).
The following is done in a loop:
• Data is continuously transmitted out of the SCI-A, SCI-B, SPI-A, McBSP-A, and eCAN-A ports.
• Multiplication/addition operations are performed.
• Watchdog is reset.
• ADC is performing continuous conversion. Data from ADC is transferred to SARAM through the DMA.
• 32-bit read/write of the XINTF is performed.
• GPIO19 is toggled.
When the identical code is run off SARAM, IDD would increase as the code operates with zero wait states.
If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the internal oscillator.
HALT mode IDD currents will increase with temperature in a nonlinear fashion.
The IDD3VFL current indicated in this table is the flash read-current and does not include additional current for erase/write operations.
During flash programming, extra current is drawn from the VDD and VDD3VFL rails, as indicated in Section 7.9.7.3. If the user application
involves on-board flash programming, this extra current must be taken into account while architecting the power-supply stage.
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37
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7.5.3 Reducing Current Consumption
The 2833x and 2823x MCUs incorporate a method to reduce the device current consumption. Because each
peripheral unit has an individual clock-enable bit, reduction in current consumption can be achieved by turning
off the clock to any peripheral module that is not used in a given application. Furthermore, any one of the
three low-power modes could be taken advantage of to reduce the current consumption even further. Table 7-1
indicates the typical reduction in current consumption achieved by turning off the clocks.
Table 7-1. Typical Current Consumption by Various
Peripherals (at 150 MHz)
(1)
(2)
(3)
(4)
PERIPHERAL
MODULE(1)
IDD CURRENT
REDUCTION/MODULE (mA)(2)
ADC
8(3)
I2C
2.5
eQEP
5
ePWM
5
eCAP
2
SCI
5
SPI
4
eCAN
8
McBSP
7
CPU-Timer
2
XINTF
10(4)
DMA
10
FPU
15
All peripheral clocks are disabled upon reset. Writing to or
reading from peripheral registers is possible only after the
peripheral clocks are turned on.
For peripherals with multiple instances, the current quoted is per
module. For example, the 5 mA number quoted for ePWM is for
one ePWM module.
This number represents the current drawn by the digital portion
of the ADC module. Turning off the clock to the ADC module
results in the elimination of the current drawn by the analog
portion of the ADC (IDDA18) as well.
Operating the XINTF bus has a significant effect on IDDIO
current. It will increase considerably based on the following:
•
•
•
•
How many address/data pins toggle from one cycle to
another
How fast they toggle
Whether 16-bit or 32-bit interface is used and
The load on these pins.
Following are other methods to reduce power consumption further:
• The Flash module may be powered down if code is run off SARAM. This results in a current reduction of 35
mA (typical) in the VDD3VFL rail.
• IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.
• Significant savings in IDDIO may be realized by disabling the pullups on pins that assume an output function
and on XINTF pins. A savings of 35 mW (typical) can be achieved by this.
• To realize the lowest VDDA current consumption in a low-power mode (LPM), refer to the respective analog
chapter in the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual to
ensure each module is powered down as well.
The baseline IDD current (current when the core is executing a dummy loop with no peripherals enabled) is 165
mA, (typical). To arrive at the IDD current for a given application, the current-drawn by the peripherals (enabled
by that application) must be added to the baseline IDD current.
38
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.5.4 Current Consumption Graphs
Current Vs Frequency
350.00
300.00
Current (mA)
250.00
200.00
150.00
100.00
50.00
0.00
10
20
30
40
50
60
70
80
90
100 110 120
130 140 150
SYSCLKOUT (MHz)
IDD
IDDIO
IDDA18
IDD3VFL
1.8-V Current
3.3-V Current
Figure 7-1. Typical Operational Current Versus Frequency (F28335, F28235, F28334, F28234)
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39
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Device Power Vs SYSCLKOUT
1000.0
900.0
Device Power (mW)
800.0
700.0
600.0
500.0
400.0
300.0
200.0
100.0
0
0
15
0
14
0
0
0
13
12
11
10
90
80
70
60
50
40
30
20
10
0.0
SYSCLKOUT (MHz)
Figure 7-2. Typical Operational Power Versus Frequency (F28335, F28235, F28334, F28234)
Note
Typical operational current for 100-MHz devices (28x32) can be estimated from Figure 7-1. Compared
to 150-MHz devices, the analog and flash module currents remain unchanged. While a marginal
decrease in IDDIO current can be expected due to the reduced external activity of peripheral pins,
current reduction is primarily in IDD.
7.6 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
IIL
Input current
(low level)
IIH
Input current
(high level)
TEST CONDITIONS
TYP
MAX
2.4
IOH = 50 μA
0.4
Pin with pullup
enabled
VDDIO = 3.3 V, VIN = 0 V
Pin with pulldown
enabled
VDDIO = 3.3 V, VIN = 0 V
±2
Pin with pullup
enabled
VDDIO = 3.3 V, VIN = VDDIO
±2
Pin with pulldown
enabled
VDDIO = 3.3 V, VIN = VDDIO
–80
–140
V
–190
μA
μA
Output current, pullup or pulldown
VO = VDDIO or 0 V
disabled
CI
Input capacitance
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All I/Os (including XRS)
UNIT
V
VDDIO – 0.2
IOL = IOL MAX
IOZ
40
MIN
IOH = IOH MAX
28
50
80
±2
2
μA
pF
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.7 Thermal Resistance Characteristics
7.7.1 PGF Package
°C/W(1) (2)
AIR FLOW (lfm)(3)
RΘJC
Junction-to-case
8.2
0
RΘJB
Junction-to-board
28.1
0
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
(3)
Junction-to-free air
Junction-to-package top
Junction-to-board
44
0
34.5
150
33
250
31
500
0.12
0
0.48
150
0.57
250
0.74
500
28.1
0
26.3
150
25.9
250
25.2
500
°C/W = degrees Celsius per watt
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
Copyright © 2022 Texas Instruments Incorporated
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41
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.7.2 PTP Package
°C/W(1) (2)
AIR FLOW (lfm)(3)
RΘJC
Junction-to-case
12.1
0
RΘJB
Junction-to-board
5.1
0
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
(3)
42
Junction-to-free air
Junction-to-package top
Junction-to-board
17.4
0
11.7
150
10.1
250
8.8
500
0.2
0
0.3
150
0.4
250
0.5
500
5.0
0
4.7
150
4.7
250
4.6
500
°C/W = degrees Celsius per watt
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.7.3 ZHH Package
°C/W(1) (2)
AIR FLOW (lfm)(3)
RΘJC
Junction-to-case
8.8
0
RΘJB
Junction-to-board
12.5
0
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
(3)
Junction-to-free air
Junction-to-package top
Junction-to-board
32.8
0
24.1
150
22.9
250
20.9
500
0.09
0
0.3
150
0.36
250
0.48
500
12.4
0
11.8
150
11.7
250
11.5
500
°C/W = degrees Celsius per watt
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
Copyright © 2022 Texas Instruments Incorporated
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43
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.7.4 ZAY Package
°C/W(1) (2)
AIR FLOW (m/s)(3)
RΘJC
Junction-to-case
9.4
0
RΘJB
Junction-to-board
13.5
0
28.5
0
22.8
1
21.6
2
20.8
3
0.27
0
0.5
1
0.7
2
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
(3)
44
Junction-to-free air
Junction-to-package top
Junction-to-board
0.8
3
13.3
0
13.2
1
13
2
12.9
3
°C/W = degrees Celsius per watt
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
m/s = meter per second
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TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.7.5 ZJZ Package
°C/W(1) (2)
AIR FLOW (lfm)(3)
RΘJC
Junction-to-case
11.4
0
RΘJB
Junction-to-board
12
0
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
(3)
Junction-to-free air
Junction-to-package top
Junction-to-board
29.6
0
20.9
150
19.7
250
18
500
0.2
0
0.78
150
0.91
250
1.11
500
12.2
0
11.6
150
11.5
250
11.3
500
°C/W = degrees Celsius per watt
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on
a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
7.8 Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems
with more than 1 Watt power dissipation may require a product level thermal design. Care should be taken
to keep Tj within specified limits. In the end applications, Tcase should be measured to estimate the operating
junction temperature Tj. Tcase is normally measured at the center of the package top side surface. The thermal
application note Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and
definitions.
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45
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9 Timing and Switching Characteristics
7.9.1 Timing Parameter Symbology
Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the symbols,
some of the pin names and other related terminology have been abbreviated as follows:
Lowercase subscripts and their
meanings:
Letters and symbols and their
meanings:
a
access time
H
High
c
cycle time (period)
L
Low
d
delay time
V
Valid
f
fall time
X
Unknown, changing, or don't care level
h
hold time
Z
High impedance
r
rise time
su
setup time
t
transition time
v
valid time
w
pulse duration (width)
7.9.1.1 General Notes on Timing Parameters
All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that all
output transitions for a given half-cycle occur with a minimum of skewing relative to each other.
The signal combinations shown in the following timing diagrams may not necessarily represent actual cycles. For
actual cycle examples, see the appropriate cycle description section of this document.
7.9.1.2 Test Load Circuit
This test load circuit is used to measure all switching characteristics provided in this document.
Tester Pin Electronics
42 Ω
3.5 nH
Transmission Line
Data Sheet Timing Reference Point
Output
Under
Test
Z0 = 50 Ω(Α)
Device Pin(B)
4.0 pF
A.
B.
1.85 pF
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line
effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer)
from the data sheet timing.
Figure 7-3. 3.3-V Test Load Circuit
46
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.1.3 Device Clock Table
This section provides the timing requirements and switching characteristics for the various clock options
available. Section 7.9.1.3.1 and Section 7.9.1.3.2 list the cycle times of various clocks.
7.9.1.3.1 Clocking and Nomenclature (150-MHz Devices)
MIN
On-chip oscillator clock
Frequency
tc(CI), Cycle time
XCLKIN(1)
Frequency
tc(SCO), Cycle time
SYSCLKOUT
Frequency
tc(XCO), Cycle time
XCLKOUT
Frequency
tc(HCO), Cycle time
HSPCLK(2)
tc(LCO), Cycle time
ADC clock
MAX
UNIT
50
ns
20
35
MHz
6.67
250
ns
4
150
MHz
6.67
500
ns
2
150
MHz
6.67
2000
ns
150
MHz
0.5
6.67
13.3(3)
75(3)
13.3
ns
150
26.7(3)
37.5(3)
Frequency
tc(ADCCLK), Cycle time
NOM
28.6
Frequency
LSPCLK(2)
(1)
(2)
(3)
(4)
tc(OSC), Cycle time
MHz
ns
75(4)
40
MHz
ns
Frequency
25
MHz
This also applies to the X1 pin if a 1.9-V oscillator is used.
Lower LSPCLK and HSPCLK will reduce device power consumption.
This is the default value if SYSCLKOUT = 150 MHz.
Although LSPCLK is capable of reaching 100 MHz, it is specified at 75 MHz because the smallest valid "Low-speed peripheral clock
prescaler register" value is "1" for 150-MHz devices.
7.9.1.3.2 Clocking and Nomenclature (100-MHz Devices)
MIN
On-chip oscillator clock
XCLKIN(1)
SYSCLKOUT
XCLKOUT
HSPCLK(2)
LSPCLK(2)
ADC clock
(1)
(2)
(3)
tc(OSC), Cycle time
NOM
MAX
UNIT
28.6
50
ns
Frequency
20
35
MHz
tc(CI), Cycle time
10
250
ns
4
100
MHz
10
500
ns
Frequency
tc(SCO), Cycle time
Frequency
2
100
MHz
tc(XCO), Cycle time
10
2000
ns
Frequency
0.5
100
MHz
tc(HCO), Cycle time
10
50(3)
Frequency
tc(LCO), Cycle time
10
ns
100
40(3)
25(3)
Frequency
tc(ADCCLK), Cycle time
20(3)
MHz
ns
100
40
MHz
ns
Frequency
25
MHz
This also applies to the X1 pin if a 1.8-V oscillator is used.
Lower LSPCLK and HSPCLK will reduce device power consumption.
This is the default value if SYSCLKOUT = 100 MHz.
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47
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
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7.9.2 Power Sequencing
No requirements are placed on the power-up and power-down sequences of the various power pins to ensure
the correct reset state for all the modules. However, if the 3.3-V transistors in the level shifting output buffers
of the I/O pins are powered prior to the 1.9-V/1.8-V transistors, it is possible for the output buffers to turn on,
causing a glitch to occur on the pin during power up. To avoid this behavior, power the VDD (core voltage) pins
prior to or simultaneously with the VDDIO (input/output voltage) pins, ensuring that the VDD pins have reached
0.7 V before or at the same time as the VDDIO pins reach 0.7 V.
There are some requirements on the XRS pin:
1. During power up, the XRS pin must be held low for tw(RSL1) after the input clock is stable (see Section
7.9.2.2). This is to enable the entire device to start from a known condition.
2. During power down, the XRS pin must be pulled low at least 8 μs prior to VDD reaching 1.5 V. Meeting this
requirement is important to help prevent unintended flash program or erase.
No voltage larger than a diode drop (0.7 V) above VDDIO should be applied to any digital pin (for analog pins,
this value is 0.7 V above VDDA) before powering up the device. Furthermore, VDDIO and VDDA should always be
within 0.3 V of each other. Voltages applied to pins on an unpowered device can bias internal P-N junctions in
unintended ways and produce unpredictable results.
7.9.2.1 Power Management and Supervisory Circuit Solutions
LDO selection depends on the total power consumed in the end application. Go to the Power Management
page for a list of TI power management ICs. Click the Reference designs tab for specific power management
reference designs.
48
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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VDDIO, VDD3VFL
VDDA2, VDDAIO
(3.3 V)
VDD, VDD1A18,
VDD2A18
(1.9 V/1.8 V)
XCLKIN
X1/X2
OSCCLK/16(A)
XCLKOUT
tOSCST
OSCCLK/8
User-Code Dependent
tw(RSL1)
XRS
Address/Data Valid. Internal Boot-ROM Code Execution Phase
Address/Data/
Control
(Internal)
td(EX)
th(boot-mode)(B)
Boot-Mode
Pins
User-Code Execution Phase
User-Code Dependent
GPIO Pins as Input
Peripheral/GPIO Function
Based on Boot Code
Boot-ROM Execution Starts
I/O Pins(C)
GPIO Pins as Input (State Depends on Internal PU/PD)
User-Code Dependent
A.
B.
C.
Upon power up, SYSCLKOUT is OSCCLK/4. Because both the XTIMCLK and CLKMODE bits in the XINTCNF2 register come up with a
reset state of 1, SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. This explains why XCLKOUT = OSCCLK/16 during
this phase. Subsequently, boot ROM changes SYSCLKOUT to OSCCLK/2. Because the XTIMCLK register is unchanged by the boot
ROM, XCLKOUT is OSCCLK/8 during this phase.
After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code branches to
destination memory or boot code function. If boot ROM code executes after power-on conditions (in debugger environment), the boot
code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be
with or without PLL enabled.
See Section 7.9.2 for requirements to ensure a high-impedance state for GPIO pins during power up.
Figure 7-4. Power-on Reset
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49
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.2.2 Reset (XRS) Timing Requirements
MIN
tw(RSL1)
(1)
Pulse duration, stable input clock to XRS high
tw(RSL2)
Pulse duration, XRS low
tw(WDRS)
Pulse duration, reset pulse generated by
watchdog
td(EX)
Delay time, address/data valid after XRS high
tOSCST
(2)
UNIT
cycles
32tc(OSCCLK)
cycles
512tc(OSCCLK)
cycles
32tc(OSCCLK)
cycles
1
Hold time for boot-mode pins
MAX
32tc(OSCCLK)
Oscillator start-up time
th(boot-mode)
(1)
(2)
Warm reset
NOM
10
200tc(OSCCLK)
ms
cycles
In addition to the tw(RSL1) requirement, XRS must be low at least for 1 ms after VDD reaches 1.5 V.
Dependent on crystal/resonator and board design.
XCLKIN
X1/X2
OSCCLK/8
XCLKOUT
User-Code Dependent
OSCCLK * 5
tw(RSL2)
XRS
Address/Data/
Control
(Internal)
td(EX)
User-Code Execution
(Don’t Care)
Boot-ROM Execution Starts
Boot-Mode
Pins
Peripheral/GPIO Function
User-Code Execution Phase
GPIO Pins as Input
th(boot-mode)(A)
Peripheral/GPIO Function
User-Code Execution Starts
I/O Pins
User-Code Dependent
GPIO Pins as Input (State Depends on Internal PU/PD)
User-Code Dependent
A.
After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code branches to
destination memory or boot code function. If Boot ROM code executes after power-on conditions (in debugger environment), the Boot
code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT will be based on user environment and could be
with or without PLL enabled.
Figure 7-5. Warm Reset
50
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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Figure 7-6 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR = 0x0004
and SYSCLKOUT = OSCCLK × 2. The PLLCR is then written with 0x0008. Right after the PLLCR register
is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the PLL lockup is complete (which takes 131072 OSCCLK cycles), SYSCLKOUT reflects the new operating frequency,
OSCCLK × 4.
OSCCLK
Write to PLLCR
SYSCLKOUT
OSCCLK * 2
OSCCLK/2
OSCCLK * 4
(Current CPU
Frequency)
(CPU Frequency While PLL is Stabilizing
With the Desired Frequency. This Period
(PLL Lock-up Time, tp) is
131072 OSCCLK Cycles Long.)
(Changed CPU Frequency)
Figure 7-6. Example of Effect of Writing Into PLLCR Register
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51
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7.9.3 Clock Requirements and Characteristics
7.9.3.1 Input Clock Frequency
PARAMETER
MIN
Resonator (X1/X2)
Crystal (X1/X2)
fx
Input clock frequency
fl
Limp mode SYSCLKOUT frequency range (with /2 enabled)
TYP
MAX UNIT
20
External oscillator/clock
source (XCLKIN or X1 pin)
35
20
35
150-MHz device
4
150
100-MHz device
4
MHz
100
1-5
MHz
7.9.3.2 XCLKIN Timing Requirements – PLL Enabled
NO.
MIN
C8
tc(CI)
Cycle time, XCLKIN
C9
tf(CI)
Fall time, XCLKIN(1)
MAX UNIT
33.3
200
ns
6
ns
6
ns
XCLKIN(1)
C10
tr(CI)
Rise time,
C11
tw(CIL)
Pulse duration, XCLKIN low as a percentage of tc(CI) (1)
45%
55%
C12
tw(CIH)
Pulse duration, XCLKIN high as a percentage of tc(CI) (1)
45%
55%
MIN
MAX UNIT
(1)
jj
This applies to the X1 pin also.
7.9.3.3 XCLKIN Timing Requirements – PLL Disabled
NO.
C8
tc(CI)
Cycle time, XCLKIN
C9
tf(CI)
Fall time, XCLKIN(1)
C10
tr(CI)
Rise time, XCLKIN(1)
C11
tw(CIL)
Pulse duration, XCLKIN low as a percentage of tc(CI) (1)
C12
(1)
tw(CIH)
Pulse duration, XCLKIN high as a percentage of tc(CI)
150-MHz device
6.67
250
100-MHz device
10
250
Up to 30 MHz
6
30 MHz to 150 MHz
2
Up to 30 MHz
6
30 MHz to 150 MHz
2
(1)
45%
55%
45%
55%
ns
ns
ns
This applies to the X1 pin also.
The possible configuration modes are shown in Table 8-38.
7.9.3.4 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
PARAMETER(1) (2)
NO.
150-MHz device
6.67
100-MHz device
10
TYP
MAX
UNIT
C1
tc(XCO)
Cycle time, XCLKOUT
C3
tf(XCO)
Fall time, XCLKOUT
2
ns
C4
tr(XCO)
Rise time, XCLKOUT
2
ns
C5
tw(XCOL)
Pulse duration, XCLKOUT low
H–2
H+2
ns
C6
tw(XCOH)
Pulse duration, XCLKOUT high
H–2
H+2
ns
tp
(1)
(2)
(3)
52
MIN
PLL lock time
ns
131072tc(OSCCLK)
(3)
cycles
A load of 40 pF is assumed for these parameters.
H = 0.5tc(XCO)
OSCCLK is either the output of the on-chip oscillator or the output from an external oscillator.
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7.9.3.5 Timing Diagram
C10
C9
C8
XCLKIN(A)
C1
C6
C3
C4
C5
XCLKOUT(B)
A.
B.
The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is intended to
illustrate the timing parameters only and may differ based on actual configuration.
XCLKOUT configured to reflect SYSCLKOUT.
Figure 7-7. Clock Timing
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7.9.4 Peripherals
7.9.4.1 General-Purpose Input/Output (GPIO)
7.9.4.1.1 GPIO - Output Timing
7.9.4.1.1.1 General-Purpose Output Switching Characteristics
PARAMETER
MIN
tr(GPO)
Rise time, GPIO switching low to high
All GPIOs
tf(GPO)
Fall time, GPIO switching high to low
All GPIOs
tfGPO
Toggling frequency, GPO pins
MAX
8
UNIT
ns
8
ns
25
MHz
GPIO
tf(GPO)
tr(GPO)
Figure 7-8. General-Purpose Output Timing
54
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7.9.4.1.2 GPIO - Input Timing
7.9.4.1.2.1 General-Purpose Input Timing Requirements
MIN
tw(SP)
Sampling period
tw(IQSW)
Input qualifier sampling window
tw(GPI) (2)
(1)
(2)
QUALPRD = 0
1tc(SCO)
QUALPRD ≠ 0
2tc(SCO) * QUALPRD
MAX
UNIT
cycles
tw(SP) * (n(1) – 1)
Synchronous mode
Pulse duration, GPIO low/high
cycles
2tc(SCO)
With input qualifier
cycles
tw(IQSW) + tw(SP) + 1tc(SCO)
"n" represents the number of qualification samples as defined by GPxQSELn register.
For tw(GPI), pulse width is measured from VIL to VIL for an active low signal and VIH to VIH for an active high signal.
(A)
GPIO Signal
GPxQSELn = 1,0 (6 samples)
1
1
0
0
0
0
0
0
0
1
tw(SP)
0
0
0
1
1
1
1
1
1
1
1
1
Sampling Period determined
by GPxCTRL[QUALPRD](B)
tw(IQSW)
(SYSCLKOUT cycle * 2 * QUALPRD) * 5(C))
Sampling Window
SYSCLKOUT
QUALPRD = 1
(SYSCLKOUT/2)
(D)
Output From
Qualifier
A.
B.
C.
D.
This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period. It can vary from 00 to
0xFF. If QUALPRD = 00, then the sampling period is 1 SYSCLKOUT cycle. For any other value "n", the qualification sampling period in
2n SYSCLKOUT cycles (that is, at every 2n SYSCLKOUT cycles, the GPIO pin will be sampled).
The qualification period selected through the GPxCTRL register applies to groups of 8 GPIO pins.
The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is used.
In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLKOUT cycles or greater. In other
words, the inputs should be stable for (5 × QUALPRD × 2) SYSCLKOUT cycles. This would ensure 5 sampling periods for detection to
occur. Because external signals are driven asynchronously, an 13-SYSCLKOUT-wide pulse ensures reliable recognition.
Figure 7-9. Sampling Mode
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7.9.4.1.3 Sampling Window Width for Input Signals
The following section summarizes the sampling window width for input signals for various input qualifier
configurations.
Sampling frequency denotes how often a signal is sampled with respect to SYSCLKOUT.
Sampling frequency = SYSCLKOUT/(2 * QUALPRD), if QUALPRD ≠ 0
Sampling frequency = SYSCLKOUT, if QUALPRD = 0
Sampling period = SYSCLKOUT cycle × 2 × QUALPRD, if QUALPRD ≠ 0
In the above equations, SYSCLKOUT cycle indicates the time period of SYSCLKOUT.
Sampling period = SYSCLKOUT cycle, if QUALPRD = 0
In a given sampling window, either 3 or 6 samples of the input signal are taken to determine the validity of the
signal. This is determined by the value written to GPxQSELn register.
Case 1:
Qualification using three samples
Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 2, if QUALPRD ≠ 0
Sampling window width = (SYSCLKOUT cycle) × 2, if QUALPRD = 0
Case 2:
Qualification using six samples
Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 5, if QUALPRD ≠ 0
Sampling window width = (SYSCLKOUT cycle) × 5, if QUALPRD = 0
SYSCLK
GPIOxn
tw(GPI)
Figure 7-10. General-Purpose Input Timing
56
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7.9.4.1.4 Low-Power Mode Wakeup Timing
Section 7.9.4.1.4.1 shows the timing requirements, Section 7.9.4.1.4.2 shows the switching characteristics, and
Figure 7-11 shows the timing diagram for IDLE mode.
7.9.4.1.4.1 IDLE Mode Timing Requirements
MIN
tw(WAKE-INT)
(1)
Pulse duration, external wake-up signal
Without input
qualifier(1)
MAX
2tc(SCO)
With input qualifier(1)
UNIT
cycles
5tc(SCO) + tw(IQSW)
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.1.4.2 IDLE Mode Switching Characteristics
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
Delay time, external wake signal to
program execution resume (2)
Without input qualifier(1)
Wake-up from flash
•
td(WAKE-IDLE)
Flash module in active state
Wake-up from flash
Without input qualifier(1)
•
With input qualifier(1)
Flash module in sleep state
Without input qualifier(1)
Wake-up from SARAM
(1)
(2)
With input
qualifier(1)
With input
qualifier(1)
20tc(SCO)
20tc(SCO) + tw(IQSW)
1050tc(SCO)
1050tc(SCO) + tw(IQSW)
20tc(SCO)
20tc(SCO) + tw(IQSW)
cycles
cycles
cycles
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered
by the wake up) signal involves additional latency.
7.9.4.1.4.3 IDLE Mode Timing Diagram
td(WAKE−IDLE)
Address/Data
(internal)
XCLKOUT
tw(WAKE−INT)
WAKE
A.
B.
INT(A)(B)
WAKE INT can be any enabled interrupt, WDINT, XNMI, or XRS.
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at
least 4 OSCCLK cycles have elapsed.
Figure 7-11. IDLE Entry and Exit Timing
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7.9.4.1.4.4 STANDBY Mode Timing Requirements
MIN
tw(WAKE-INT)
(1)
Pulse duration, external
wake-up signal
Without input qualification
With input qualification(1)
MAX
3tc(OSCCLK)
UNIT
cycles
(2 + QUALSTDBY) * tc(OSCCLK)
QUALSTDBY is a 6-bit field in the LPMCR0 register.
7.9.4.1.4.5 STANDBY Mode Switching Characteristics
PARAMETER
td(IDLE-XCOL)
TEST CONDITIONS
Delay time, IDLE instruction
executed to XCLKOUT low
MIN
MAX
UNIT
32tc(SCO)
45tc(SCO)
cycles
Delay time, external wake signal to
program execution resume(1)
•
Wake up from flash
–
td(WAKE-STBY)
•
Wake up from flash
–
•
Flash module in active
state
Flash module in sleep
state
Wake up from SARAM
Without input qualifier
With input qualifier
Without input qualifier
With input qualifier
Without input qualifier
With input qualifier
(1)
58
100tc(SCO)
100tc(SCO) + tw(WAKE-INT)
cycles
1125tc(SCO)
1125tc(SCO) + tw(WAKE-INT)
100tc(SCO)
100tc(SCO) + tw(WAKE-INT)
cycles
cycles
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. execution of an ISR (triggered
by the wake up signal) involves additional latency.
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7.9.4.1.4.6 STANDBY Mode Timing Diagram
(A)
(C)
(B)
Device
Status
STANDBY
(E)
(D)
(F)
STANDBY
Normal Execution
Flushing Pipeline
Wake-up
Signal(G)
tw(WAKE-INT)
td(WAKE-STBY)
X1/X2 or
X1 or
XCLKIN
XCLKOUT
td(IDLE−XCOL)
A.
B.
IDLE instruction is executed to put the device into STANDBY mode.
The PLL block responds to the STANDBY signal. SYSCLKOUT is held for the number of cycles indicated below before being turned off:
•
•
•
16 cycles, when DIVSEL = 00 or 01
32 cycles, when DIVSEL = 10
64 cycles, when DIVSEL = 11
This delay enables the CPU pipeline and any other pending operations to flush properly. If an access to
XINTF is in progress and its access time is longer than this number then it will fail. It is recommended to
enter STANDBY mode from SARAM without an XINTF access in progress.
C.
D.
E.
F.
G.
Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in STANDBY mode.
The external wake-up signal is driven active.
After a latency period, the STANDBY mode is exited.
Normal execution resumes. The device will respond to the interrupt (if enabled).
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at
least 4 OSCCLK cycles have elapsed.
Figure 7-12. STANDBY Entry and Exit Timing Diagram
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7.9.4.1.4.7 HALT Mode Timing Requirements
MIN
tw(WAKE-GPIO)
Pulse duration, GPIO wake-up signal
tw(WAKE-XRS)
Pulse duration, XRS wake-up signal
(1)
MAX
UNIT
toscst + 2tc(OSCCLK) (1)
cycles
toscst + 8tc(OSCCLK)
cycles
See Section 7.9.2.2 for an explanation of toscst.
7.9.4.1.4.8 HALT Mode Switching Characteristics
PARAMETER
td(IDLE-XCOL)
Delay time, IDLE instruction executed to XCLKOUT low
tp
PLL lock-up time
MIN
MAX
UNIT
32tc(SCO)
45tc(SCO)
cycles
131072tc(OSCCLK)
cycles
1125tc(SCO)
cycles
35tc(SCO)
cycles
Delay time, PLL lock to program execution resume
•
td(WAKE-HALT)
–
•
60
Wake up from flash
Flash module in sleep state
Wake up from SARAM
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7.9.4.1.4.9 HALT Mode Timing Diagram
(A)
(C)
Device
Status
(D)
HALT
Flushing Pipeline
(G)
(E)
(B)
(F)
HALT
PLL Lock-up Time
Wake-up Latency
Normal
Execution
GPIOn(H)
td(WAKE−HALT)
tw(WAKE-GPIO)
tp
X1/X2
or XCLKIN
Oscillator Start-up Time
XCLKOUT
td(IDLE−XCOL)
A.
B.
IDLE instruction is executed to put the device into HALT mode.
The PLL block responds to the HALT signal. SYSCLKOUT is held for the number of cycles indicated below before oscillator is turned off
and the CLKIN to the core is stopped:
•
•
•
C.
D.
E.
F.
G.
H.
16 cycles, when DIVSEL = 00 or 01
32 cycles, when DIVSEL = 10
64 cycles, when DIVSEL = 11
This delay enables the CPU pipeline and any other pending operations to flush properly. If an access to XINTF is in progress and its
access time is longer than this number then it will fail. It is recommended to enter HALT mode from SARAM without an XINTF access in
progress.
Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as the clock source,
the internal oscillator is shut down as well. The device is now in HALT mode and consumes absolute minimum power.
When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator wake-up
sequence is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This enables the provision of a clean
clock signal during the PLL lock sequence. Because the falling edge of the GPIO pin asynchronously begins the wake-up process, care
should be taken to maintain a low noise environment prior to entering and during HALT mode.
Once the oscillator has stabilized, the PLL lock sequence is initiated, which takes 131,072 OSCCLK (X1/X2 or X1 or XCLKIN) cycles.
Note that these 131,072 clock cycles are applicable even when the PLL is disabled (that is, code execution will be delayed by this
duration even when the PLL is disabled).
Clocks to the core and peripherals are enabled. The HALT mode is now exited. The device will respond to the interrupt (if enabled),
after a latency.
Normal operation resumes.
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be initiated until at
least 4 OSCCLK cycles have elapsed.
Figure 7-13. HALT Wakeup Using GPIOn
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7.9.4.2 Enhanced Control Peripherals
7.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
PWM refers to PWM outputs on ePWM1–6. Section 7.9.4.2.1.1 shows the ePWM timing requirements and
Section 7.9.4.2.1.2, ePWM switching characteristics.
7.9.4.2.1.1 ePWM Timing Requirements
MIN
tw(SYCIN)
Sync input pulse width
Asynchronous
2tc(SCO)
Synchronous
2tc(SCO)
With input
(1)
qualifier(1)
MAX
UNIT
cycles
1tc(SCO) + tw(IQSW)
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.2.1.2 ePWM Switching Characteristics
PARAMETER
TEST CONDITIONS
tw(PWM)
Pulse duration, PWMx output high/low
tw(SYNCOUT)
Sync output pulse width
td(PWM)tza
Delay time, trip input active to PWM forced high
Delay time, trip input active to PWM forced low
td(TZ-PWM)HZ
Delay time, trip input active to PWM Hi-Z
MIN
MAX
UNIT
20
ns
8tc(SCO)
no pin load
cycles
25
ns
20
ns
7.9.4.2.2 Trip-Zone Input Timing
SYSCLK
tw(TZ)
(A)
TZ
td(TZ-PWM)HZ
(B)
PWM
A.
B.
TZ - TZ1, TZ2, TZ3, TZ4, TZ5, TZ6
PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM recovery
software.
Figure 7-14. PWM Hi-Z Characteristics
7.9.4.2.2.1 Trip-Zone Input Timing Requirements
MIN
Asynchronous
tw(TZ)
Pulse duration, TZx input low
Synchronous
With input qualifier(1)
(1)
62
MAX
UNIT
1tc(SCO)
2tc(SCO)
cycles
1tc(SCO) + tw(IQSW)
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.4.2.3 High-Resolution PWM Timing
Section 7.9.4.2.3.1 shows the high-resolution PWM switching characteristics.
7.9.4.2.3.1 High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)
MIN
Micro Edge Positioning (MEP) step
(1)
TYP
size(1)
MAX UNIT
150
310
ps
The MEP step size will be largest at high temperature and minimum voltage on VDD. MEP step size will increase with higher
temperature and lower voltage and decrease with lower temperature and higher voltage.
Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI
software libraries for details of using SFO function in end applications. SFO functions help to estimate the number of MEP steps per
SYSCLKOUT period dynamically while the HRPWM is in operation.
7.9.4.2.4 Enhanced Capture (eCAP) Timing
Section 7.9.4.2.4.1 shows the eCAP timing requirement and Section 7.9.4.2.4.2 shows the eCAP switching
characteristics.
7.9.4.2.4.1 Enhanced Capture (eCAP) Timing Requirements
MIN
tw(CAP)
Capture input pulse width
Asynchronous
2tc(SCO)
Synchronous
2tc(SCO)
With input
(1)
qualifier(1)
MAX
UNIT
cycles
1tc(SCO) + tw(IQSW)
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.2.4.2 eCAP Switching Characteristics
PARAMETER
tw(APWM)
Pulse duration, APWMx output high/low
Copyright © 2022 Texas Instruments Incorporated
TEST CONDITIONS
MIN
MAX
20
UNIT
ns
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7.9.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
Section 7.9.4.2.5.1 shows the eQEP timing requirement and Section 7.9.4.2.5.2 shows the eQEP switching
characteristics.
7.9.4.2.5.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
MIN
tw(QEPP)
QEP input period
tw(INDEXH)
QEP Index Input High time
tw(INDEXL)
QEP Index Input Low time
tw(STROBH)
QEP Strobe High time
tw(STROBL)
QEP Strobe Input Low time
(1)
(2)
Asynchronous(1)/synchronous
With input qualifier(2)
2tc(SCO)
With input qualifier(2)
2tc(SCO)
cycles
2tc(SCO) + tw(IQSW)
Asynchronous(1)/synchronous
With input qualifier(2)
2tc(SCO)
cycles
2tc(SCO) + tw(IQSW)
Asynchronous(1)/synchronous
With input qualifier(2)
2tc(SCO)
cycles
2tc(SCO) + tw(IQSW)
Asynchronous(1)/synchronous
UNIT
cycles
2[1tc(SCO) + tw(IQSW)]
Asynchronous(1)/synchronous
With input qualifier(2)
MAX
2tc(SCO)
cycles
2tc(SCO) + tw(IQSW)
Refer to the TMS320F2833x, TMS320F2823x Real-Time MCUs Silicon Errata for limitations in the asynchronous mode.
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.2.5.2 eQEP Switching Characteristics
MAX
UNIT
td(CNTR)xin
Delay time, external clock to counter increment
PARAMETER
4tc(SCO)
cycles
td(PCS-OUT)QEP
Delay time, QEP input edge to position compare sync
output
6tc(SCO)
cycles
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TEST CONDITIONS
MIN
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7.9.4.2.6 ADC Start-of-Conversion Timing
7.9.4.2.6.1 External ADC Start-of-Conversion Switching Characteristics
PARAMETER
tw(ADCSOCL)
MIN
Pulse duration, ADCSOCxO low
MAX
32tc(HCO )
UNIT
cycles
7.9.4.2.6.2 ADCSOCAO or ADCSOCBO Timing
tw(ADCSOCL)
ADCSOCAO
or
ADCSOCBO
Figure 7-15. ADCSOCAO or ADCSOCBO Timing
7.9.4.3 External Interrupt Timing
7.9.4.3.1 External Interrupt Timing Requirements
MIN
tw(INT) (1)
(1)
(2)
Pulse duration, INT input low/high
Synchronous
With qualifier(2)
MAX
1tc(SCO)
UNIT
cycles
1tc(SCO) + tw(IQSW)
This timing is applicable to any GPIO pin configured for ADCSOC functionality.
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.3.2 External Interrupt Switching Characteristics
PARAMETER(1)
td(INT)
(1)
Delay time, INT low/high to interrupt-vector fetch
MIN
MAX
UNIT
tw(IQSW) + 12tc(SCO)
cycles
For an explanation of the input qualifier parameters, see Section 7.9.4.1.2.1.
7.9.4.3.3 External Interrupt Timing Diagram
tw(INT)
XNMI, XINT1, XINT2
td(INT)
Address bus
(internal)
Interrupt Vector
Figure 7-16. External Interrupt Timing
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.4.4 I2C Electrical Specification and Timing
7.9.4.4.1 I2C Timing
TEST CONDITIONS
MIN
I2C clock module frequency is between
7 MHz and 12 MHz and I2C prescaler
and clock divider registers are configured
appropriately
MAX
UNIT
400
kHz
fSCL
SCL clock frequency
vil
Low level input voltage
Vih
High level input voltage
Vhys
Input hysteresis
Vol
Low level output voltage
3-mA sink current
tLOW
Low period of SCL clock
I2C clock module frequency is between
7 MHz and 12 MHz and I2C prescaler
and clock divider registers are configured
appropriately
1.3
μs
tHIGH
High period of SCL clock
I2C clock module frequency is between
7 MHz and 12 MHz and I2C prescaler
and clock divider registers are configured
appropriately
0.6
μs
lI
Input current with an input voltage
between 0.1 VDDIO and 0.9 VDDIO MAX
66
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0.3 VDDIO
0.7 VDDIO
V
0.05 VDDIO
0
–10
V
V
0.4
10
V
μA
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.4.5 Serial Peripheral Interface (SPI) Timing
This section contains both Master Mode and Slave Mode timing data.
7.9.4.5.1 Master Mode Timing
Section 7.9.4.5.1.1 lists the master mode timing (clock phase = 0) and Section 7.9.4.5.1.2 lists the master mode
timing (clock phase = 1). Figure 7-17 and Figure 7-18 show the timing waveforms.
7.9.4.5.1.1 SPI Master Mode External Timing (Clock Phase = 0)
PARAMETER(1) (2) (3) (4) (5)
NO.
1
(1)
(2)
(3)
(4)
(5)
tc(SPC)M
Cycle time, SPICLK
2
tw(SPC1)M
Pulse duration, SPICLK first
pulse
3
tw(SPC2)M
Pulse duration, SPICLK second
pulse
4
td(SIMO)M
Delay time, SPICLK to
SPISIMO valid
5
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
8
tsu(SOMI)M
Setup time, SPISOMI before
SPICLK
9
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
23
td(SPC)M
24
td(STE)M
BRR EVEN
BRR ODD
MIN
MAX
MIN
MAX
4tc(LSPCLK)
128tc(LSPCLK)
UNIT
5tc(LSPCLK)
127tc(LSPCLK)
ns
0.5tc(SPC)M – 10
0.5tc(SPC)M + 0.5tc(LSPCLK)
0.5tc(SPC)M + 10
– 10
0.5tc(SPC)M +
0.5tc(LSPCLK) + 10
ns
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M – 0.5tc(LSPCLK)
– 10
0.5tc(SPC)M –
0.5tc(LSPCLK) + 10
ns
10
ns
10
0.5tc(SPC)M – 10
0.5tc(SPC)M – 0.5tc(LSPCLK)
– 10
ns
35
35
ns
0
0
ns
Delay time, SPISTE active to
SPICLK
1.5tc(SPC)M –
3tc(SYSCLK) – 10
1.5tc(SPC)M –
3tc(SYSCLK) – 10
ns
Delay time, SPICLK to SPISTE
inactive
0.5tc(SPC)M – 10
0.5tc(SPC)M – 0.5tc(LSPCLK)
– 10
ns
The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1)
tc(LCO) = LSPCLK cycle time
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MAX, slave mode receive 12.5-MHz MAX.
The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6).
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1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISIMO
Master Out Data Is Valid
8
9
Master In Data
Must Be Valid
SPISOMI
23
24
SPISTE
Figure 7-17. SPI Master Mode External Timing (Clock Phase = 0)
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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7.9.4.5.1.2 SPI Master Mode External Timing (Clock Phase = 1)
1
(1)
(2)
(3)
(4)
(5)
BRR EVEN
PARAMETER(1) (2) (3) (4) (5)
NO.
BRR ODD
MIN
MAX
4tc(LSPCLK)
UNIT
MIN
MAX
128tc(LSPCLK)
5tc(LSPCLK)
127tc(LSPCLK)
ns
0.5tc(SPC)M –
0.5tc(LSPCLK) + 10
ns
0.5tc(SPC)M +
0.5tc(LSPCLK) + 10
ns
tc(SPC)M
Cycle time, SPICLK
2
tw(SPC1)M
Pulse duration, SPICLK first
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
3
tw(SPC2)M
Pulse duration, SPICLK second
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M +
0.5tc(LSPCLK) – 10
6
td(SIMO)M
Delay time, SPISIMO valid to
SPICLK
0.5tc(SPC)M – 10
0.5tc(SPC)M +
0.5tc(LSPCLK) – 10
ns
7
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
0.5tc(SPC)M – 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
ns
10
tsu(SOMI)M
Setup time, SPISOMI before
SPICLK
35
35
ns
11
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
0
0
ns
23
td(SPC)M
Delay time, SPISTE active to
SPICLK
2tc(SPC)M –
3tc(SYSCLK) – 10
2tc(SPC)M –
3tc(SYSCLK) – 10
ns
24
td(STE)M
Delay time, SPICLK to SPISTE
inactive
0.5tc(SPC) – 10
0.5tc(SPC) –
0.5tc(LSPCLK) – 10
ns
The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25 MHz MAX, master mode receive 12.5 MHz MAX
Slave mode transmit 12.5 MHz MAX, slave mode receive 12.5 MHz MAX.
tc(LCO) = LSPCLK cycle time
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
6
7
Master Out Data Is Valid
SPISIMO
10
11
Master In Data Must
Be Valid
SPISOMI
24
23
SPISTE
Figure 7-18. SPI Master Mode External Timing (Clock Phase = 1)
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7.9.4.5.2 Slave Mode Timing
Section 7.9.4.5.2.1 lists the slave mode timing (clock phase = 0) and Section 7.9.4.5.2.2 lists the slave mode
timing (clock phase = 1). Figure 7-19 and Figure 7-20 show the timing waveforms.
7.9.4.5.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
PARAMETER(1) (2) (3) (4) (5)
NO.
MIN
MAX
UNIT
12
tc(SPC)S
Cycle time, SPICLK
4tc(SYSCLK)
ns
13
tw(SPC1)S
Pulse duration, SPICLK first pulse
2tc(SYSCLK) – 1
ns
14
tw(SPC2)S
Pulse duration, SPICLK second pulse
2tc(SYSCLK) – 1
15
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
16
tv(SOMI)S
Valid time, SPISOMI data valid after SPICLK
0
ns
19
tsu(SIMO)S
Setup time, SPISIMO valid before SPICLK
1.5tc(SYSCLK)
ns
20
th(SIMO)S
Hold time, SPISIMO data valid after SPICLK
1.5tc(SYSCLK)
ns
25
tsu(STE)S
Setup time, SPISTE active before SPICLK
1.5tc(SYSCLK)
ns
26
th(STE)S
Hold time, SPISTE inactive after SPICLK
1.5tc(SYSCLK)
ns
(1)
(2)
(3)
(4)
(5)
ns
35
ns
The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
tc(LCO) = LSPCLK cycle time
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
15
SPISOMI
16
SPISOMI Data Is Valid
19
20
SPISIMO Data
Must Be Valid
SPISIMO
25
26
SPISTE
Figure 7-19. SPI Slave Mode External Timing (Clock Phase = 0)
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7.9.4.5.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
PARAMETER(1) (2) (3) (4)
NO.
MIN
12
tc(SPC)S
Cycle time, SPICLK
13
tw(SPC1)S
14
tw(SPC2)S
17
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
18
tv(SOMI)S
Valid time, SPISOMI data valid after SPICLK
21
tsu(SIMO)S
22
th(SIMO)S
25
26
(1)
(2)
(3)
(4)
MAX
UNIT
4tc(SYSCLK)
ns
Pulse duration, SPICLK first pulse
2tc(SYSCLK) – 1
ns
Pulse duration, SPICLK second pulse
2tc(SYSCLK) – 1
ns
35
ns
0
ns
Setup time, SPISIMO valid before SPICLK
1.5tc(SYSCLK)
ns
Hold time, SPISIMO data valid after SPICLK
1.5tc(SYSCLK)
ns
tsu(STE)S
Setup time, SPISTE active before SPICLK
1.5tc(SYSCLK)
ns
th(STE)S
Hold time, SPISTE inactive after SPICLK
1.5tc(SYSCLK)
ns
The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
17
SPISOMI
Data Valid
SPISOMI Data Is Valid
Data Valid
18
21
22
SPISIMO Data
Must Be Valid
SPISIMO
26
25
SPISTE
Figure 7-20. SPI Slave Mode External Timing (Clock Phase = 1)
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7.9.4.6 Multichannel Buffered Serial Port (McBSP) Timing
7.9.4.6.1 McBSP Transmit and Receive Timing
7.9.4.6.1.1 McBSP Timing Requirements
NO.
MIN
McBSP module clock (CLKG, CLKX, CLKR) range(1)
Cycle time, CLKR/X(1)
M12
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X
M13
tr(CKRX)
Rise time, CLKR/X(1)
M14
tf(CKRX)
Fall time,
low(1)
CLKR/X(1)
M15
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low(1)
M16
th(CKRL-FRH)
Hold time, external FSR high after CLKR low(1)
M17
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low(1)
M18
th(CKRL-DRV)
Hold time, DR valid after CLKR low(1)
M19
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low(1)
M20
th(CKXL-FXH)
Hold time, external FSX high after CLKX low(1)
(1)
(2)
(3)
72
tc(CKRX)
(3)
40
2P(2)
CLKR/X ext
P–7
CLKR/X ext
CLKR/X ext
CLKR int
18
CLKR ext
2
CLKR int
0
CLKR ext
6
CLKR int
18
CLKR ext
2
CLKR int
0
CLKR ext
6
CLKX int
18
CLKX ext
2
CLKX int
0
CLKX ext
6
MHz
ns
1
CLKR/X ext
UNIT
kHz
25
McBSP module cycle time (CLKG, CLKX, CLKR) range(1)
M11
MAX
1
ms
ns
ns
7
ns
7
ns
ns
ns
ns
ns
ns
ns
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that
signal are also inverted.
CLKSRG
2P = 1/CLKG in ns. CLKG is the output of sample rate generator mux. CLKG = (1 ) CLKGDV) CLKSRG can be LSPCLK, CLKX,
CLKR as source. CLKSRG ≤ (SYSCLKOUT/2). McBSP performance is limited by I/O buffer switching speed.
Internal clock prescalers must be adjusted such that the McBSP clock (CLKG, CLKX, CLKR) speeds are not greater than the I/O buffer
speed limit (25 MHz).
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7.9.4.6.1.2 McBSP Switching Characteristics
PARAMETER(1)
NO.
M1
tc(CKRX)
MIN
Cycle time, CLKR/X
(3)
MAX
ns
ns
C + 5 (3)
ns
tw(CKRXH)
Pulse duration, CLKR/X high
CLKR/X int
D–5
tw(CKRXL)
Pulse duration, CLKR/X low
CLKR/X int
C – 5 (3)
M4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
M5
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
M6
tdis(CKXH-DXHZ)
Disable time, CLKX high to DX high impedance
following last data bit
CLKX int
8
CLKX ext
14
Delay time, CLKX high to DX valid.
CLKX int
9
This applies to all bits except the first bit transmitted.
CLKX ext
28
td(CKXH-DXV)
Delay time, CLKX high to DX valid
DXENA = 0
Enable time, CLKX high to DX driven
M8
ten(CKXH-DX)
Only applies to first bit transmitted when
in Data Delay 1 or 2 (XDATDLY=01b or DXENA = 1
10b) modes
Delay time, FSX high to DX valid
M9
td(FXH-DXV)
ten(FXH-DX)
DXENA = 0
Only applies to first bit transmitted when
DXENA = 1
in Data Delay 0 (XDATDLY=00b) mode.
Enable time, FSX high to DX driven
M10
DXENA = 0
DXENA = 0
Only applies to first bit transmitted when
DXENA = 1
in Data Delay 0 (XDATDLY=00b) mode
D+5
CLKR int
0
4
CLKR ext
3
27
CLKX int
0
4
CLKX ext
3
27
CLKX int
8
CLKX ext
14
CLKX int
P+8
CLKX ext
P + 14
CLKX int
0
CLKX ext
6
CLKX int
P
CLKX ext
P+6
UNIT
(3)
M3
Only applies to first bit transmitted when
in Data Delay 1 or 2 (XDATDLY=01b or DXENA = 1
10b) modes
(2)
(3)
2P(2)
M2
M7
(1)
CLKR/X int
ns
ns
ns
ns
ns
FSX int
8
FSX ext
14
FSX int
P+8
FSX ext
ns
P + 14
FSX int
0
FSX ext
6
FSX int
P
FSX ext
P+6
ns
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that
signal are also inverted.
2P = 1/CLKG in ns.
C = CLKRX low pulse width = P
D = CLKRX high pulse width = P
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M1, M11
M2, M12
M13
M3, M12
CLKR
M4
M4
M14
FSR (int)
M15
M16
FSR (ext)
M18
M17
DR
(RDATDLY=00b)
Bit (n−1)
(n−2)
(n−3)
M17
(n−4)
M18
DR
(RDATDLY=01b)
Bit (n−1)
(n−2)
(n−3)
M17
M18
DR
(RDATDLY=10b)
Bit (n−1)
(n−2)
Figure 7-21. McBSP Receive Timing
M1, M11
M2, M12
M13
M3, M12
CLKX
M5
M5
FSX (int)
M19
M20
FSX (ext)
M9
M7
M10
DX
(XDATDLY=00b)
Bit 0
Bit (n−1)
(n−2)
(n−3)
M7
M8
DX
(XDATDLY=01b)
Bit 0
Bit (n−1)
M7
M6
DX
(XDATDLY=10b)
(n−2)
M8
Bit 0
Bit (n−1)
Figure 7-22. McBSP Transmit Timing
74
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.4.6.2 McBSP as SPI Master or Slave Timing
7.9.4.6.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
NO.
M30
tsu(DRV-CKXL)
th(CKXL-DRV)
Hold time, DR valid after CLKX
tsu(BFXL-CKXH)
Setup time, FSX low before CLKX high(1)
(1)
(2)
MIN
MIN
Cycle time,
MAX
30
low(1)
M32
tc(CKX)
SLAVE
Setup time, DR valid before CLKX low(1)
M31
M33
MASTER
1
CLKX(1)
MAX
UNIT
8P – 10
ns
8P – 10
ns
8P + 10
ns
16P
ns
2P(2)
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =
CLKGDV = 1.
2P = 1/CLKG
7.9.4.6.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
NO.
(1)
MASTER
PARAMETER
MIN
SLAVE
MAX
MIN
MAX
UNIT
M24
th(CKXL-FXL)
Hold time, FSX low after CLKX low
2P(1)
ns
M25
td(FXL-CKXH)
Delay time, FSX low to CLKX high
P
ns
M28
tdis(FXH-DXHZ)
Disable time, DX high impedance following
last data bit from FSX high
6
6P + 6
ns
M29
td(FXL-DXV)
Delay time, FSX low to DX valid
6
4P + 6
ns
2P = 1/CLKG
M32
LSB
M33
MSB
CLKX
M25
M24
FSX
M28
DX
M29
Bit 0
Bit(n-1)
M30
DR
Bit 0
(n-2)
(n-3)
(n-4)
M31
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-23. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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7.9.4.6.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
MASTER
NO.
MIN
M39
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high(1)
M40
th(CKXH-DRV)
Hold time, DR valid after CLKX high(1)
M41
tsu(FXL-CKXH)
Setup time, FSX low before CLKX
M42
tc(CKX)
Cycle time, CLKX(1)
(1)
(2)
SLAVE
MAX
MIN
MAX
UNIT
30
8P – 10
ns
1
8P – 10
ns
16P + 10
ns
16P
ns
high(1)
2P(2)
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =
CLKGDV = 1.
2P = 1/CLKG
7.9.4.6.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
NO.
MASTER
PARAMETER
MIN
SLAVE
MAX
MIN
MAX
UNIT
M34
th(CKXL-FXL)
Hold time, FSX low after CLKX low
P
ns
M35
td(FXL-CKXH)
Delay time, FSX low to CLKX high
2P(1)
ns
M37
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit
from CLKX low
P+6
7P + 6
ns
M38
td(FXL-DXV)
Delay time, FSX low to DX valid
6
4P + 6
ns
(1)
2P = 1/CLKG
LSB
M42
MSB
M41
CLKX
M34
M35
FSX
M37
DX
M38
Bit 0
Bit(n-1)
M39
DR
Bit 0
(n-2)
(n-3)
(n-4)
M40
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-24. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
76
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7.9.4.6.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
NO.
M49
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high(1)
M50
th(CKXH-DRV)
Hold time, DR valid after CLKX high(1)
M51
tsu(FXL-CKXL)
Setup time, FSX low before CLKX
M52
tc(CKX)
Cycle time, CLKX(1)
(1)
(2)
MASTER
SLAVE
MIN
MIN
MAX
MAX
UNIT
30
8P – 10
ns
1
8P – 10
ns
8P + 10
ns
16P
ns
low(1)
2P(2)
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =
CLKGDV = 1.
2P = 1/CLKG
7.9.4.6.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
NO.
PARAMETER
SLAVE
MIN
MIN
MAX
MAX
UNIT
2P(1)
ns
Delay time, FSX low to CLKX low
P
ns
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
6
6P + 6
ns
td(FXL-DXV)
Delay time, FSX low to DX valid
6
4P + 6
ns
M43
th(CKXH-FXL)
Hold time, FSX low after CLKX high
M44
td(FXL-CKXL)
M47
M48
(1)
MASTER
2P = 1/CLKG
M51
LSB
M52
MSB
CLKX
M43
M44
FSX
M47
DX
M48
Bit 0
Bit(n-1)
M49
DR
Bit 0
(n-2)
(n-3)
(n-4)
M50
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-25. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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7.9.4.6.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
MASTER
NO.
MIN
M58
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low(1)
M59
th(CKXL-DRV)
Hold time, DR valid after CLKX low(1)
M60
tsu(FXL-CKXL)
Setup time, FSX low before CLKX
M61
tc(CKX)
Cycle time, CLKX(1)
(1)
(2)
SLAVE
MAX
MIN
MAX
UNIT
30
8P – 10
ns
1
8P – 10
ns
16P + 10
ns
16P
ns
low(1)
2P(2)
For all SPI slave modes, CLKX must be a minimum of 8 CLKG cycles. Furthermore, CLKG should be LSPCLK/2 by setting CLKSM =
CLKGDV = 1.
2P = 1/CLKG
7.9.4.6.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
NO.
MASTER
PARAMETER
MIN
M53
th(CKXH-FXL)
Hold time, FSX low after CLKX high
M54
td(FXL-CKXL)
Delay time, FSX low to CLKX low
M55
td(CLKXH-DXV)
Delay time, CLKX high to DX valid
M56
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data
bit from CLKX high
M57
td(FXL-DXV)
Delay time, FSX low to DX valid
(1)
SLAVE
MAX
MIN
MAX
UNIT
P
ns
2P(1)
ns
–2
0
3P + 6
5P + 20
ns
P+6
7P + 6
ns
6
4P + 6
ns
2P = 1/CLKG
M60
LSB
M61
MSB
CLKX
M53
M54
FSX
M56
DX
M55
M57
Bit 0
Bit(n-1)
M58
DR
Bit 0
(n-2)
(n-3)
(n-4)
M59
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-26. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
78
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7.9.5 JTAG Debug Probe Connection Without Signal Buffering for the MCU
Figure 7-27 shows the connection between the DSP and JTAG header for a single-processor configuration. If
the distance between the JTAG header and the DSP is greater than 6 inches, the emulation signals must be
buffered. If the distance is less than 6 inches, buffering is typically not needed. Figure 7-27 shows the simpler,
no-buffering situation. For the pullup/pulldown resistor values, see the Signal Descriptions section. For details on
buffering JTAG signals and multiple processor connections, see the TMS320F/C24x DSP Controllers Reference
Guide: CPU and Instruction Set.
6 inches or less
VDDIO
VDDIO
5
13
EMU0
EMU0
PD
14
EMU1
EMU1
4
2
TRST
TRST
GND
TMS
GND
TDI
GND
TDO
GND
TCK
GND
6
1
TMS
8
3
TDI
10
7
TDO
12
11
TCK
9
TCK_RET
MCU
JTAG Header
Figure 7-27. JTAG Debug Probe Connection Without Signal Buffering for the MCU
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.6 External Interface (XINTF) Timing
Each XINTF access consists of three parts: Lead, Active, and Trail. The user configures the Lead/Active/Trail
wait states in the XTIMING registers. There is one XTIMING register for each XINTF zone. Table 7-2 shows the
relationship between the parameters configured in the XTIMING register and the duration of the pulse in terms of
XTIMCLK cycles.
Table 7-2. Relationship Between Parameters Configured in XTIMING and Duration of Pulse
DURATION (ns)(1) (2)
DESCRIPTION
X2TIMING = 0
X2TIMING = 1
LR
Lead period, read access
XRDLEAD × tc(XTIM)
(XRDLEAD × 2) × tc(XTIM)
AR
Active period, read access
(XRDACTIVE + WS + 1) × tc(XTIM)
(XRDACTIVE × 2 + WS + 1) × tc(XTIM)
TR
Trail period, read access
XRDTRAIL × tc(XTIM)
(XRDTRAIL × 2) × tc(XTIM)
LW
Lead period, write access
XWRLEAD × tc(XTIM)
(XWRLEAD × 2) × tc(XTIM)
AW
Active period, write access
(XWRACTIVE + WS + 1) × tc(XTIM)
(XWRACTIVE × 2 + WS + 1) × tc(XTIM)
TW
Trail period, write access
XWRTRAIL × tc(XTIM)
(XWRTRAIL × 2) × tc(XTIM)
(1)
(2)
tc(XTIM) − Cycle time, XTIMCLK
WS refers to the number of wait states inserted by hardware when using XREADY. If the zone is configured to ignore XREADY
(USEREADY = 0), then WS = 0.
Minimum wait-state requirements must be met when configuring each zone’s XTIMING register. These
requirements are in addition to any timing requirements as specified by that device’s data sheet. No internal
device hardware is included to detect illegal settings.
7.9.6.1 USEREADY = 0
If the XREADY signal is ignored (USEREADY = 0), then:
Lead:
LR ≥ tc(XTIM)
LW ≥ tc(XTIM)
These requirements result in the following XTIMING register configuration restrictions:
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
≥1
≥0
≥0
≥1
≥0
≥0
0, 1
Examples of valid and invalid timing when not sampling XREADY:
(1)
80
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
Invalid(1)
0
0
0
0
0
0
0, 1
Valid
1
0
0
1
0
0
0, 1
No hardware to detect illegal XTIMING configurations
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7.9.6.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
If the XREADY signal is sampled in the synchronous mode (USEREADY = 1, READYMODE = 0), then:
1
Lead:
LR ≥ tc(XTIM)
LW ≥ tc(XTIM)
2
Active:
AR ≥ 2 × tc(XTIM)
AW ≥ 2 × tc(XTIM)
Note
Restriction does not include external hardware wait states.
These requirements result in the following XTIMING register configuration restrictions :
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
≥1
≥2
≥0
≥1
≥2
≥0
0, 1
Examples of valid and invalid timing when using synchronous XREADY:
(1)
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
Invalid(1)
0
0
0
0
0
0
0, 1
Invalid(1)
1
0
0
1
0
0
0, 1
Valid
1
2
0
1
2
0
0, 1
No hardware to detect illegal XTIMING configurations
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TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
7.9.6.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
If the XREADY signal is sampled in the asynchronous mode (USEREADY = 1, READYMODE = 1), then:
1
Lead:
LR ≥ tc(XTIM)
LW ≥ tc(XTIM)
2
Active:
AR ≥ 2 × tc(XTIM)
AW ≥ 2 × tc(XTIM)
3
Lead + Active:
LR + AR ≥ 4 × tc(XTIM)
LW + AW ≥ 4 × tc(XTIM)
Note
Restrictions do not include external hardware wait states.
These requirements result in the following XTIMING register configuration restrictions :
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
≥1
≥2
0
≥1
≥2
0
0, 1
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
≥2
≥1
0
≥2
≥1
0
0, 1
or
Examples of valid and invalid timing when using asynchronous XREADY:
(1)
82
XRDLEAD
XRDACTIVE
XRDTRAIL
XWRLEAD
XWRACTIVE
XWRTRAIL
X2TIMING
Invalid(1)
0
0
0
0
0
0
0, 1
Invalid(1)
1
0
0
1
0
0
0, 1
Invalid(1)
1
1
0
1
1
0
0
Valid
1
2
0
1
2
0
1
Valid
1
2
0
1
2
0
0, 1
Valid
2
1
0
2
1
0
0, 1
No hardware to detect illegal XTIMING configurations
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Unless otherwise specified, all XINTF timing is applicable for the clock configurations listed in Table 7-3.
Table 7-3. XINTF Clock Configurations
MODE
SYSCLKOUT
1
Example:
XTIMCLK
XCLKOUT
SYSCLKOUT
SYSCLKOUT
150 MHz
150 MHz
SYSCLKOUT
1/2 SYSCLKOUT
150 MHz
75 MHz
1/2 SYSCLKOUT
1/2 SYSCLKOUT
75 MHz
75 MHz
1/2 SYSCLKOUT
1/4 SYSCLKOUT
75 MHz
37.5 MHz
150 MHz
2
Example:
150 MHz
3
Example:
150 MHz
4
Example:
150 MHz
The relationship between SYSCLKOUT and XTIMCLK is shown in Figure 7-28.
PCLKR3[XINTFENCLK]
XTIMING0
0
XTIMING6
0
1
LEAD/ACTIVE/TRAIL
XTIMING7
XBANK
C28x
CPU
SYSCLKOUT
/2
1
0
XTIMCLK
XINTCNF2 (XTIMCLK)
/2
XCLKOUT
1
0
XINTCNF2
(CLKMODE)
XINTCNF2
(CLKOFF)
Figure 7-28. Relationship Between SYSCLKOUT and XTIMCLK
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7.9.6.4 XINTF Signal Alignment to XCLKOUT
For each XINTF access, the number of lead, active, and trail cycles is based on the internal clock XTIMCLK.
Strobes such as XRD, XWE0, XWE1, and zone chip-select ( XZCS) change state in relationship to the rising
edge of XTIMCLK. The external clock, XCLKOUT, can be configured to be either equal to or one-half the
frequency of XTIMCLK.
For the case where XCLKOUT = XTIMCLK, all of the XINTF strobes will change state with respect to the rising
edge of XCLKOUT. For the case where XCLKOUT = one-half XTIMCLK, some strobes will change state either
on the rising edge of XCLKOUT or the falling edge of XCLKOUT. In the XINTF timing tables, the notation
XCOHL is used to indicate that the parameter is with respect to either case; XCLKOUT rising edge (high) or
XCLKOUT falling edge (low). If the parameter is always with respect to the rising edge of XCLKOUT, the notation
XCOH is used.
For the case where XCLKOUT = one-half XTIMCLK, the XCLKOUT edge with which the change will be aligned
can be determined based on the number of XTIMCLK cycles from the start of the access to the point at
which the signal changes. If this number of XTIMCLK cycles is even, the alignment will be with respect to the
rising edge of XCLKOUT. If this number is odd, then the signal will change with respect to the falling edge of
XCLKOUT. Examples include the following:
• Strobes that change at the beginning of an access always align to the rising edge of XCLKOUT. This is
because all XINTF accesses begin with respect to the rising edge of XCLKOUT.
Examples:
XZCSL
Zone chip-select active low
XRNWL
•
Strobes that change at the beginning of the active period will align to the rising edge of XCLKOUT if the total
number of lead XTIMCLK cycles for the access is even. If the number of lead XTIMCLK cycles is odd, then
the alignment will be with respect to the falling edge of XCLKOUT.
Examples:
XRDL
XRD active low
XWEL
•
XWE1 or XWE0 inactive high
Strobes that change at the end of the access will align to the rising edge of XCLKOUT if the total number of
lead + active + trail XTIMCLK cycles (including hardware wait states) is even. If the number of lead + active
+ trail XTIMCLK cycles (including hardware wait states) is odd, then the alignment will be with respect to the
falling edge of XCLKOUT.
Examples:
XZCSH
Zone chip-select inactive high
XRNWH
84
XWE1 or XWE0 active low
Strobes that change at the beginning of the trail period will align to the rising edge of XCLKOUT if the total
number of lead + active XTIMCLK cycles (including hardware wait states) for the access is even. If the
number of lead + active XTIMCLK cycles (including hardware wait states) is odd, then the alignment will be
with respect to the falling edge of XCLKOUT.
Examples:
XRDH
XRD inactive high
XWEH
•
XR/ W active low
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7.9.6.5 External Interface Read Timing
7.9.6.5.1 External Interface Read Timing Requirements
MIN
ta(A)
Access time, read data from address valid
ta(XRD)
Access time, read data valid from XRD active low
tsu(XD)XRD
Setup time, read data valid before XRD strobe inactive high
th(XD)XRD
Hold time, read data valid after XRD inactive high
(1)
MAX
UNIT
(LR + AR) – 16 (1)
ns
AR – 14 (1)
ns
14
ns
0
ns
LR = Lead period, read access. AR = Active period, read access. See Table 7-2.
7.9.6.5.2 External Interface Read Switching Characteristics
PARAMETER
MIN
MAX
UNIT
1
ns
–1
0.5
ns
td(XCOH-XZCSL)
Delay time, XCLKOUT high to zone chip-select active low
td(XCOHL-XZCSH)
Delay time, XCLKOUT high/low to zone chip-select inactive high
td(XCOH-XA)
Delay time, XCLKOUT high to address valid
1.5
ns
td(XCOHL-XRDL)
Delay time, XCLKOUT high/low to XRD active low
0.5
ns
td(XCOHL-XRDH)
Delay time, XCLKOUT high/low to XRD inactive high
0.5
ns
th(XA)XZCSH
Hold time, address valid after zone chip-select inactive high
(1)
ns
Hold time, address valid after XRD inactive high
(1)
ns
th(XA)XRD
(1)
–1.5
During inactive cycles, the XINTF address bus always holds the last address put out on the bus except XA0, which remains high. This
includes alignment cycles.
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(A)(B)
Trail
Active
Lead
(C)
XCLKOUT = XTIMCLK
XCLKOUT = 1/2 XTIMCLK
td(XCOH-XZCSL)
td(XCOHL-XZCSH)
XZCS0, XZCS6, XZCS7
td(XCOH-XA)
XA[0:19]
td(XCOHL-XRDH)
td(XCOHL-XRDL)
XRD
tsu(XD)XRD
(D)
XWE0, XWE1
XR/W
ta(A)
th(XD)XRD
ta(XRD)
XD[0:31], XD[0:15]
XREADY
A.
B.
C.
D.
E.
DIN
(E)
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device inserts an alignment cycle before
an access to meet this requirement.
During alignment cycles, all signals transition to their inactive state.
XA[0:19] holds the last address put on the bus during inactive cycles, including alignment cycles except XA0, which remains high.
XWE1 is used in 32-bit data bus mode. In 16-bit mode, this signal is XA0.
For USEREADY = 0, the external XREADY input signal is ignored.
Figure 7-29. Example Read Access
XTIMING register parameters used for this example :
(1)
86
XRDLEAD
XRDACTIVE
XRDTRAIL
USEREADY
X2TIMING
XWRLEAD
XWRACTIVE
XWRTRAIL
READYMODE
≥1
≥0
≥0
0
0
N/A(1)
N/A(1)
N/A(1)
N/A(1)
N/A = Not applicable (or "Don’t care") for this example
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7.9.6.6 External Interface Write Timing
7.9.6.6.1 External Interface Write Switching Characteristics
PARAMETER
MIN
td(XCOH-XZCSL)
Delay time, XCLKOUT high to zone chip-select active low
td(XCOHL-XZCSH)
Delay time, XCLKOUT high or low to zone chip-select inactive high
td(XCOH-XA)
Delay time, XCLKOUT high to address valid
td(XCOHL-XWEL)
Delay time, XCLKOUT high/low to XWE0, XWE1 (3) low
td(XCOHL-XWEH)
td(XCOH-XRNWL)
td(XCOHL-XRNWH)
Delay time, XCLKOUT high/low to XR/ W high
ten(XD)XWEL
Enable time, data bus driven from XWE0, XWE1 low
td(XWEL-XD)
Delay time, data valid after XWE0, XWE1 active low
th(XA)XZCSH
Hold time, address valid after zone chip-select inactive high
(1)
th(XD)XWE
Hold time, write data valid after XWE0, XWE1 inactive high
(2)
tdis(XD)XRNW
Maximum time for DSP to release the data bus after XR/ W inactive high
(1)
(2)
(3)
MAX
UNIT
1
ns
0.5
ns
1.5
ns
2
ns
Delay time, XCLKOUT high/low to XWE0, XWE1 high
2
ns
Delay time, XCLKOUT high to XR/ W low
1
ns
0.5
ns
–1
–1
0
ns
1
TW – 2
ns
ns
ns
4
ns
During inactive cycles, the XINTF address bus will always hold the last address put out on the bus except XA0, which remains high.
This includes alignment cycles.
TW = Trail period, write access. See Table 7-2.
XWE1 is used in 32-bit data bus mode only. In 16-bit mode, this signal is XA0.
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(A) (B)
Active
Lead
(C)
Trail
XCLKOUT = XTIMCLK
XCLKOUT = 1/2 XTIMCLK
td(XCOHL-XZCSH)
td(XCOH-XZCSL)
XZCS0, XZCS6, XZCS7
td(XCOH-XA)
XA[0:19]
XRD
td(XCOHL-XWEH)
td(XCOHL-XWEL)
(D)
XWE0, XWE1
A.
B.
C.
D.
E.
tdis(XD)XRNW
th(XD)XWEH
td(XWEL-XD)
ten(XD)XWEL
XD[0:31], XD[0:15]
XREADY
td(XCOHL-XRNWH)
td(XCOH-XRNWL)
XR/W
DOUT
(E)
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device inserts an alignment cycle before
an access to meet this requirement.
During alignment cycles, all signals transition to their inactive state.
XA[0:19] holds the last address put on the bus during inactive cycles, including alignment cycles except XA0, which remains high.
XWE1 is used in 32-bit data bus mode. In 16-bit mode, this signal is XA0.
For USEREADY = 0, the external XREADY input signal is ignored.
Figure 7-30. Example Write Access
XTIMING register parameters used for this example :
XRDLEAD
N/A(1)
(1)
88
XRDACTIVE
XRDTRAIL
N/A(1)
N/A(1)
USEREADY
0
X2TIMING
0
XWRLEAD
≥1
XWRACTIVE
≥0
XWRTRAIL
READYMODE
≥0
N/A(1)
N/A = Not applicable (or “Don’t care”) for this example
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7.9.6.7 External Interface Ready-on-Read Timing With One External Wait State
7.9.6.7.1 External Interface Read Switching Characteristics (Ready-on-Read, One Wait State)
PARAMETER
MIN
MAX
UNIT
td(XCOH-XZCSL)
Delay time, XCLKOUT high to zone chip-select active low
td(XCOHL-XZCSH)
Delay time, XCLKOUT high/low to zone chip-select inactive high
td(XCOH-XA)
td(XCOHL-XRDL)
td(XCOHL-XRDH)
Delay time, XCLKOUT high/low to XRD inactive high
th(XA)XZCSH
Hold time, address valid after zone chip-select inactive high
(1)
ns
Hold time, address valid after XRD inactive high
(1)
ns
th(XA)XRD
(1)
1
ns
0.5
ns
Delay time, XCLKOUT high to address valid
1.5
ns
Delay time, XCLKOUT high/low to XRD active low
0.5
ns
0.5
ns
–1
– 1.5
During inactive cycles, the XINTF address bus always holds the last address put out on the bus, except XA0, which remains high. This
includes alignment cycles.
7.9.6.7.2 External Interface Read Timing Requirements (Ready-on-Read, One Wait State)
MIN
ta(A)
Access time, read data from address valid
ta(XRD)
Access time, read data valid from XRD active low
tsu(XD)XRD
Setup time, read data valid before XRD strobe inactive high
th(XD)XRD
Hold time, read data valid after XRD inactive high
(1)
MAX
UNIT
(1)
ns
AR – 14 (1)
ns
(LR + AR) – 16
14
ns
0
ns
LR = Lead period, read access. AR = Active period, read access. See Table 7-2.
7.9.6.7.3 Synchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
MIN
tsu(XRDYsynchL)XCOHL
Setup time, XREADY (synchronous) low before XCLKOUT high/low(1)
low(1)
th(XRDYsynchL)
Hold time, XREADY (synchronous)
te(XRDYsynchH)
Earliest time XREADY (synchronous) can go high before the sampling
XCLKOUT edge(1)
tsu(XRDYsynchH)XCOHL
Setup time, XREADY (synchronous) high before XCLKOUT high/low(1)
th(XRDYsynchH)XZCSH
(1)
Hold time, XREADY (synchronous) held high after zone chip select
high(1)
MAX
UNIT
12
ns
6
ns
3
ns
12
ns
0
ns
The first XREADY (synchronous) sample occurs with respect to E in Figure 7-31:
E = (XRDLEAD + XRDACTIVE) tc(XTIM)
When first sampled, if XREADY (synchronous) is found to be high, then the access will finish. If XREADY (synchronous) is found to be
low, it is sampled again each tc(XTIM) until it is found to be high.
For each sample (n) the setup time (F) with respect to the beginning of the access can be calculated as:
F = (XRDLEAD + XRDACTIVE +n − 1) tc(XTIM) − tsu(XRDYsynchL)XCOHL
where n is the sample number: n = 1, 2, 3, and so forth.
7.9.6.7.4 Asynchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
MIN
tsu(XRDYAsynchL)XCOHL
Setup time, XREADY (asynchronous) low before XCLKOUT high/low
th(XRDYAsynchL)
Hold time, XREADY (asynchronous) low
te(XRDYAsynchH)
Earliest time XREADY (asynchronous) can go high before the sampling
XCLKOUT edge
tsu(XRDYAsynchH)XCOHL
Setup time, XREADY (asynchronous) high before XCLKOUT high/low
th(XRDYasynchH)XZCSH
Hold time, XREADY (asynchronous) held high after zone chip select high
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MAX
UNIT
11
ns
6
ns
3
ns
11
ns
0
ns
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WS (Synch)
(A) (B)
Active
Lead
(C)
Trail
XCLKOUT = XTIMCLK
XCLKOUT = 1/2 XTIMCLK
td(XCOHL-XZCSH)
td(XCOH-XZCSL)
XZCS0 XZCS6, XZCS7
td(XCOH-XA)
XA[0:19]
td(XCOHL-XRDH)
td(XCOHL-XRDL)
XRD
tsu(XD)XRD
XWE0, XWE1 (D)
ta(XRD)
XR/W
ta(A)
th(XD)XRD
XD[0:31], XD[0:15]
DIN
tsu(XRDYsynchL)XCOHL
te(XRDYsynchH)
th(XRDYsynchL)
th(XRDYsynchH)XZCSH
tsu(XRDHsynchH)XCOHL
XREADY(Synch)
(E)
(F)
Legend:
= Don’t care. Signal can be high or low during this time.
A.
B.
C.
D.
E.
F.
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device inserts an alignment cycle before
an access to meet this requirement.
During alignment cycles, all signals transition to their inactive state.
During inactive cycles, the XINTF address bus always holds the last address put out on the bus except XA0, which remains high. This
includes alignment cycles.
XWE1 is valid only in 32-bit data bus mode. In 16-bit mode, this signal is XA0.
For each sample, setup time from the beginning of the access (E) can be calculated as: D = (XRDLEAD + XRDACTIVE +n - 1) tc(XTIM) –
tsu(XRDYsynchL)XCOHL
Reference for the first sample is with respect to this point: F = (XRDLEAD + XRDACTIVE) tc(XTIM) where n is the sample number: n = 1,
2, 3, and so forth.
Figure 7-31. Example Read With Synchronous XREADY Access
XTIMING register parameters used for this example :
XRDLEAD
≥1
(1)
90
XRDACTIVE
XRDTRAIL
3
≥1
USEREADY
1
X2TIMING
0
XWRLEAD
N/A(1)
XWRACTIVE
N/A(1)
XWRTRAIL
READYMODE
N/A(1)
0 = XREADY
(Synch)
N/A = “Don’t care” for this example
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WS (Async)
(A) (B)
Active
Lead
Trail
(C)
XCLKOUT = XTIMCLK
XCLKOUT = 1/2 XTIMCLK
td(XCOH-XZCSL)
XZCS0, XZCS6, XZCS7
td(XCOHL-XZCSH)
td(XCOH-XA)
XA[0:19]
td(XCOHL-XRDH)
td(XCOHL-XRDL)
XRD
tsu(XD)XRD
XWE0, XWE1(D)
ta(XRD)
XR/W
ta(A)
th(XD)XRD
DIN
XD[0:31], XD[0:15]
tsu(XRDYasynchL)XCOHL
te(XRDYasynchH)
th(XRDYasynchH)XZCSH
th(XRDYasynchL)
tsu(XRDYasynchH)XCOHL
XREADY(Asynch)
(E)
(F)
Legend:
= Don’t care. Signal can be high or low during this time.
A.
B.
C.
D.
E.
F.
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device will insert an alignment cycle
before an access to meet this requirement.
During alignment cycles, all signals will transition to their inactive state.
During inactive cycles, the XINTF address bus will always hold the last address put out on the bus except XA0, which remains high.
This includes alignment cycles.
XWE1 is valid only in 32-bit data bus mode. In 16-bit mode, this signal is XA0.
For each sample, setup time from the beginning of the access can be calculated as: E = (XRDLEAD + XRDACTIVE -3 +n) tc(XTIM) –
tsu(XRDYasynchL)XCOHL where n is the sample number: n = 1, 2, 3, and so forth.
Reference for the first sample is with respect to this point: F = (XRDLEAD + XRDACTIVE –2) tc(XTIM)
Figure 7-32. Example Read With Asynchronous XREADY Access
XTIMING register parameters used for this example :
XRDLEAD
≥1
(1)
XRDACTIVE
3
XRDTRAIL
≥1
USEREADY
1
X2TIMING
0
XWRLEAD
N/A(1)
XWRACTIVE
N/A(1)
XWRTRAIL
N/A(1)
READYMODE
1 = XREADY
(Async)
N/A = “Don’t care” for this example
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7.9.6.8 External Interface Ready-on-Write Timing With One External Wait State
7.9.6.8.1 External Interface Write Switching Characteristics (Ready-on-Write, One Wait State)
PARAMETER
MIN
td(XCOH-XZCSL)
Delay time, XCLKOUT high to zone chip-select active low
td(XCOHL-XZCSH)
Delay time, XCLKOUT high or low to zone chip-select inactive high
td(XCOH-XA)
Delay time, XCLKOUT high to address valid
td(XCOHL-XWEL)
Delay time, XCLKOUT high/low to XWE0, XWE1 low(3)
–1
high(3)
td(XCOHL-XWEH)
Delay time, XCLKOUT high/low to XWE0, XWE1
td(XCOH-XRNWL)
Delay time, XCLKOUT high to XR/ W low
td(XCOHL-XRNWH)
Delay time, XCLKOUT high/low to XR/ W high
ten(XD)XWEL
Enable time, data bus driven from XWE0, XWE1 low(3)
td(XWEL-XD)
Delay time, data valid after XWE0, XWE1 active
low(3)
th(XA)XZCSH
Hold time, address valid after zone chip-select inactive high
–1
ns
0.5
ns
1.5
ns
2
ns
2
ns
1
ns
0.5
ns
ns
1
ns
(1)
high(3)
Hold time, write data valid after XWE0, XWE1 inactive
tdis(XD)XRNW
Maximum time for DSP to release the data bus after XR/ W inactive high
(2)
(3)
UNIT
1
0
th(XD)XWE
(1)
MAX
TW – 2
ns
(2)
ns
4
ns
During inactive cycles, the XINTF address bus always holds the last address put out on the bus except XA0, which remains high. This
includes alignment cycles.
TW = trail period, write access (see Table 7-2)
XWE1 is used in 32-bit data bus mode only. In 16-bit, this signal is XA0.
7.9.6.8.2 Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
MIN
high/low(1)
tsu(XRDYsynchL)XCOHL
Setup time, XREADY (synchronous) low before XCLKOUT
th(XRDYsynchL)
Hold time, XREADY (synchronous) low(1)
te(XRDYsynchH)
Earliest time XREADY (synchronous) can go high before the sampling
XCLKOUT edge(1)
tsu(XRDYsynchH)XCOHL
Setup time, XREADY (synchronous) high before XCLKOUT high/low(1)
th(XRDYsynchH)XZCSH
Hold time, XREADY (synchronous) held high after zone chip select
high(1)
(1)
MAX
UNIT
12
ns
6
ns
3
ns
12
ns
0
ns
The first XREADY (synchronous) sample occurs with respect to E in Figure 7-33:
E =(XWRLEAD + XWRACTIVE) tc(XTIM)
When first sampled, if XREADY (synchronous) is high, then the access will complete. If XREADY (synchronous) is low, it is sampled
again each tc(XTIM) until it is high.
For each sample, setup time from the beginning of the access can be calculated as:
F = (XWRLEAD + XWRACTIVE +n –1) tc(XTIM) – tsu(XRDYsynchL)XCOHL
where n is the sample number: n = 1, 2, 3, and so forth.
7.9.6.8.3 Asynchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
MIN
tsu(XRDYasynchL)XCOHL
Setup time, XREADY (asynchronous) low before XCLKOUT high/low(1)
low(1)
th(XRDYasynchL)
Hold time, XREADY (asynchronous)
te(XRDYasynchH)
Earliest time XREADY (asynchronous) can go high before the sampling
XCLKOUT edge(1)
tsu(XRDYasynchH)XCOHL
Setup time, XREADY (asynchronous) high before XCLKOUT high/low(1)
th(XRDYasynchH)XZCSH
(1)
92
Hold time, XREADY (asynchronous) held high after zone chip select
MAX
ns
6
ns
3
high(1)
UNIT
11
ns
11
ns
0
ns
The first XREADY (synchronous) sample occurs with respect to E in Figure 7-33:
E = (XWRLEAD + XWRACTIVE –2) tc(XTIM). When first sampled, if XREADY (asynchronous) is high, then the access will complete. If
XREADY (asynchronous) is low, it is sampled again each tc(XTIM) until it is high.
For each sample, setup time from the beginning of the access can be calculated as:
F = (XWRLEAD + XWRACTIVE –3 + n) tc(XTIM) – tsu(XRDYasynchL)XCOHL
where n is the sample number: n = 1, 2, 3, and so forth.
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WS (Synch)
(A) (B)
(C)
Trail
Active
Lead 1
(D)
XCLKOUT = XTIMCLK
td(XCOHL-XZCSH)
td(XCOH-XZCSL)
XZCS0AND1, XZCS2,
XZCS6AND7
th(XRDYsynchH)XZCSH
td(XCOH-XA)
XA[0:18]
XRD
td(XCOHL-XWEH)
td(XCOHL-XWEL)
XWE
td(XCOHL-XRNWH)
td(XCOH-XRNWL)
XR/W
tdis(XD)XRNW
td(XWEL-XD
th(XD)XWEH
)
ten(XD)XWEL
XD[0:15]
DOUT
tsu(XRDYsynchL)XCOHL
th(XRDYsynchL)
tsu(XRDHsynchH)XCOHL
XREADY (Synch)
(E)
(F)
Legend:
= Don’t care. Signal can be high or low during this time.
A.
B.
C.
D.
E.
F.
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device inserts an alignment cycle before
an access to meet this requirement.
During alignment cycles, all signals will transition to their inactive state.
During inactive cycles, the XINTF address bus always holds the last address put out on the bus except XA0, which remains high. This
includes alignment cycles.
XWE1 is used in 32-bit data bus mode only. In 16-bit, this signal is XA0.
For each sample, setup time from the beginning of the access can be calculated as E = (XWRLEAD + XWRACTIVE + n –1) tc(XTIM) –
tsu(XRDYsynchL)XCOH where n is the sample number: n = 1, 2, 3, and so forth.
Reference for the first sample is with respect to this point: F = (XWRLEAD + XWRACTIVE) tc(XTIM)
Figure 7-33. Write With Synchronous XREADY Access
XTIMING register parameters used for this example :
XRDLEAD
N/A(1)
(1)
XRDACTIVE
N/A(1)
XRDTRAIL
N/A(1)
USEREADY
1
X2TIMING
0
XWRLEAD
≥1
XWRACTIVE
3
XWRTRAIL
≥1
READYMODE
0 = XREADY
(Synch)
N/A = "Don't care" for this example.
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WS (Async)
(A) (B)
(C)
Trail
Active
Lead 1
XCLKOUT = XTIMCLK
XCLKOUT = 1/2 XTIMCLK
td(XCOH-XZCSL)
td(XCOHL-XZCSH)
td(XCOH-XA)
th(XRDYasynchH)XZCSH
XZCS0, XZCS6, XZCS7
XA[0:19]
XRD
td(XCOHL-XWEH)
td(XCOHL-XWEL)
XWE0,
XWE1(D)
td(XCOH-XRNWL)
td(XCOHL-XRNWH)
XR/W
tdis(XD)XRNW
td(XWEL-XD
ten(XD)XWEL
th(XD)XWEH
)
XD[31:0], XD[15:0]
DOUT
tsu(XRDYasynchL)XCOHL
th(XRDYasynchL)
te(XRDYasynchH)
tsu(XRDYasynchH)XCOHL
XREADY(Asynch)
(D)
(E)
Legend:
= Don’t care. Signal can be high or low during this time.
A.
B.
C.
D.
E.
F.
All XINTF accesses (lead period) begin on the rising edge of XCLKOUT. When necessary, the device inserts an alignment cycle before
an access to meet this requirement.
During alignment cycles, all signals transition to their inactive state.
During inactive cycles, the XINTF address bus always holds the last address put out on the bus except XA0, which remains high. This
includes alignment cycles.
XWE1 is used in 32-bit data bus mode only. In 16-bit, this signal is XA0.
For each sample, set up time from the beginning of the access can be calculated as: E = (XWRLEAD + XWRACTIVE -3 + n) tc(XTIM) –
tsu(XRDYasynchL)XCOHL where n is the sample number: n = 1, 2, 3, and so forth.
Reference for the first sample is with respect to this point: F = (XWRLEAD + XWRACTIVE – 2) tc(XTIM)
Figure 7-34. Write With Asynchronous XREADY Access
XTIMING register parameters used for this example :
XRDLEAD
N/A(1)
(1)
94
XRDACTIVE
XRDTRAIL
N/A(1)
N/A(1)
USEREADY
1
X2TIMING
0
XWRLEAD
≥1
XWRACTIVE
3
XWRTRAIL
≥1
READYMODE
1 = XREADY
(Async)
N/A = “Don’t care” for this example
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7.9.6.9 XHOLD and XHOLDA Timing
If the HOLD mode bit is set while XHOLD and XHOLDA are both low (external bus accesses granted), the
XHOLDA signal is forced high (at the end of the current cycle) and the external interface is taken out of
high-impedance mode.
On a reset ( XRS), the HOLD mode bit is set to 0. If the XHOLD signal is active low on a system reset, the bus
and all signal strobes must be in high-impedance mode, and the XHOLDA signal is also driven active low.
When HOLD mode is enabled and XHOLDA is active low (external bus grant active), the CPU can still execute
code from internal memory. If an access is made to the external interface, the CPU is stalled until the XHOLD
signal is removed.
An external DMA request, when granted, places the following signals in a high-impedance mode:
XA[19:0]
XZCS0
XD[31:0], XD[15:0]
XZCS6
XWE0, XWE1, XRD
XZCS7
XR/ W
All other signals not listed in this group remain in their default or functional operational modes during these signal
events.
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7.9.6.9.1 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = XTIMCLK)
MIN
td(HL-HiZ)
td(HL-HAL)
Delay time, XHOLD high to bus valid(1) (2)
(2)
5tc(XTIM) + 30
ns
3tc(XTIM) + 30
ns
4tc(XTIM) + 30
ns
4tc(XTIM) + 2tc(XCO) + 30
ns
high(1) (2)
Delay time, XHOLD high to XHOLDA
(1)
ns
Delay time, XHOLD low to XHOLDA low(1) (2)
td(HH-BV)
Delay time, XHOLD low to XHOLDA
low(1) (2)
UNIT
4tc(XTIM) + 30
(2)
td(HH-HAH)
td(HL-HAL)
MAX
Delay time, XHOLD low to Hi-Z on all address, data, and control(1)
When a low signal is detected on XHOLD, all pending XINTF accesses will be completed before the bus is placed in a high-impedance
state.
The state of XHOLD is latched on the rising edge of XTIMCLK.
XCLKOUT
(/1 Mode)
td(HL-Hiz)
XHOLD
td(HH-HAH)
XHOLDA
td(HL-HAL)
td(HH-BV)
XR/W
High-Impedance
XZCS0, XZCS6, XZCS7
XA[19:0]
Valid
XD[31:0], XD[15:0]
Valid
(A)
A.
B.
Valid
High-Impedance
(B)
All pending XINTF accesses are completed.
Normal XINTF operation resumes.
Figure 7-35. External Interface Hold Waveform
96
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7.9.6.9.2 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
MIN
td(HL-HiZ)
Delay time, XHOLD low to Hi-Z on all address, data, and
control(1) (2) (3)
td(HL-HAL)
Delay time, XHOLD low to XHOLDA low(1) (2) (3)
Delay time, XHOLD high to XHOLDA
td(HH-BV)
Delay time, XHOLD high to bus valid(1) (2) (3)
(2)
(3)
UNIT
4tc(XTIM) + tc(XCO) + 30
ns
4tc(XTIM) + 2tc(XCO) + 30
ns
4tc(XTIM) + 30
ns
6tc(XTIM) + 30
ns
high(1) (2) (3)
td(HH-HAH)
(1)
MAX
When a low signal is detected on XHOLD, all pending XINTF accesses will be completed before the bus is placed in a high-impedance
state.
The state of XHOLD is latched on the rising edge of XTIMCLK.
After the XHOLD is detected low or high, all bus transitions and XHOLDA transitions occur with respect to the rising edge of
XCLKOUT. Thus, for this mode where XCLKOUT = 1/2 XTIMCLK, the transitions can occur up to 1 XTIMCLK cycle earlier than the
maximum value specified.
XCLKOUT
(1/2 XTIMCLK)
td(HL-HAL)
XHOLD
td(HH-HAH)
XHOLDA
td(HL-HiZ)
td(HH-BV)
XR/W,
XZCS0,
XZCS6,
XZCS7
XA[19:0]
High-Impedance
XD[0:31]XD[15:0]
Valid
(A)
A.
B.
High-Impedance
Valid
Valid
High-Impedance
(B)
All pending XINTF accesses are completed.
Normal XINTF operation resumes.
Figure 7-36. XHOLD/ XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
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7.9.7 Flash Timing
7.9.7.1 Flash Endurance for A and S Temperature Material
ERASE/PROGRAM
TEMPERATURE
Nf
Flash endurance for the array (write/erase cycles)(1)
0°C to 85°C (ambient)
NOTP
OTP endurance for the array (write cycles)(1)
0°C to 85°C (ambient)
(1)
MIN
TYP
20000
50000
MAX
UNIT
cycles
1
write
Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.
7.9.7.2 Flash Endurance for Q Temperature Material
ERASE/PROGRAM
TEMPERATURE
Flash endurance for the array (write/erase cycles)(1)
Nf
NOTP
(1)
OTP endurance for the array (write
cycles)(1)
–40°C to 125°C (ambient)
MIN
TYP
20000
50000
MAX
UNIT
cycles
–40°C to 125°C (ambient)
1
write
Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.
7.9.7.3 Flash Parameters at 150-MHz SYSCLKOUT
PARAMETER
TEST
CONDITIONS
16-Bit Word
Program
Time(3)
Erase Time(1)
Erase Time(1)
50
(4)
98
μs
ms
16K Sector
500
2000(2)
ms
32K Sector
2
12(2)
2
12(2)
2
15(2)
2
15(2)
16K Sector
32K Sector
16K Sector
Q grade
A, S grade
VDD current consumption during Erase/Program cycle
(2)
(3)
UNIT
2000(2)
IDDP (4)
(1)
MAX
1000
VDD3VFL current consumption during the Erase/Program Erase
cycle
Program
IDDIOP
TYP
32K Sector
IDD3VFLP (4)
(4)
MIN
VDDIO current consumption during Erase/Program cycle
s
s
75
mA
35
mA
180
mA
20
mA
The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required
prior to programming, when programming the device for the first time. However, the erase operation is needed on all subsequent
programming operations.
Maximum flash parameter mentioned are for the first 100 program and erase cycles.
Program time is at the maximum device frequency. The programming time indicated in this table is applicable only when all the
required code/data is available in the device RAM, ready for programming. Program time includes overhead of the flash state machine
but does not include the time to transfer the following into RAM:
• the code that uses flash API to program the flash
• the Flash API itself
• Flash data to be programmed
Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain
a stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash
programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at
all times, as specified in the Recommended Operating Conditions of the data sheet. Any brown-out or interruption to power during
erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board
(during flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands
placed during the programming process.
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7.9.7.4 Flash/OTP Access Timing
PARAMETER
MIN
MAX
UNIT
ta(fp)
Paged Flash access time
37
ns
ta(fr)
Random Flash access time
37
ns
ta(OTP)
OTP access time
60
ns
7.9.7.5 Flash Data Retention Duration
PARAMETER
tretention
TEST CONDITIONS
Data retention duration
MIN
TJ = 55°C
MAX
15
UNIT
years
Table 7-4. Minimum Required Flash/OTP Wait-States at Different Frequencies
SYSCLKOUT (MHz)
SYSCLKOUT (ns)
PAGE WAIT-STATE
RANDOM WAIT-STATE(1)
OTP WAIT-STATE
150
6.67
5
5
8
120
8.33
4
4
7
100
10
3
3
5
75
13.33
2
2
4
50
20
1
1
2
30
33.33
1
1
1
25
40
1
1
1
15
66.67
1
1
1
4
250
1
1
1
(1)
Page and random wait-state must be ≥ 1.
The equations to compute the Flash page wait-state and random wait-state in Table 7-4 are as follows:
Flash Page Wait State +
ƪǒ Ǔ ƫ
round up to the next highest integer or 1, whichever is larger
Flash Random Wait State +
ƪǒ Ǔ ƫ
round up to the next highest integer or 1, whichever is larger
t a(f@p)
*1
t c(SCO)
t a(f@r)
*1
t c(SCO)
The equation to compute the OTP wait-state in Table 7-4 is as follows:
OTP Wait State +
ƪǒ Ǔ ƫ
t a(OTP)
*1
t c(SCO)
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round up to the next highest integer or 1, whichever is larger
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7.10 On-Chip Analog-to-Digital Converter
7.10.1 ADC Electrical Characteristics (over recommended operating conditions)
PARAMETER(1) (2)
DC SPECIFICATIONS
MIN
TYP
MAX
UNIT
(3)
Resolution
12
ADC clock
0.001
Bits
25
MHz
±1.5
LSB
±2
LSB
ACCURACY
1-12.5 MHz ADC clock (6.25 MSPS)
INL (Integral nonlinearity)
12.5-25 MHz ADC clock
(12.5 MSPS)
DNL (Differential nonlinearity)(4)
Offset error(5) (3)
Overall gain error with internal
reference(6) (3)
Overall gain error with external reference(3)
±1
LSB
–15
15
LSB
–30
30
LSB
–30
30
LSB
Channel-to-channel offset variation
±4
LSB
Channel-to-channel gain variation
±4
LSB
ANALOG INPUT
Analog input voltage (ADCINx to ADCLO)(7)
0
ADCLO
–5
Input capacitance
0
3
V
5
mV
10
Input leakage current
pF
±5
μA
INTERNAL VOLTAGE REFERENCE (6)
VADCREFP - ADCREFP output voltage at the pin based on
internal reference
1.275
V
VADCREFM - ADCREFM output voltage at the pin based on
internal reference
0.525
V
Voltage difference, ADCREFP - ADCREFM
0.75
Temperature coefficient
50
V
PPM/°C
EXTERNAL VOLTAGE REFERENCE (6) (8)
VADCREFIN - External reference voltage input on ADCREFIN
pin 0.2% or better accurate reference recommended
ADCREFSEL[15:14] = 11b
1.024
V
ADCREFSEL[15:14] = 10b
1.500
V
ADCREFSEL[15:14] = 01b
2.048
V
67.5
dB
68
dB
AC SPECIFICATIONS
SINAD (100 kHz) Signal-to-noise ratio + distortion
SNR (100 kHz) Signal-to-noise ratio
THD (100 kHz) Total harmonic distortion
–79
dB
ENOB (100 kHz) Effective number of bits
10.9
Bits
83
dB
SFDR (100 kHz) Spurious free dynamic range
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
100
Tested at 25 MHz ADCCLK.
All voltages listed in this table are with respect to VSSA2.
ADC parameters for gain error and offset error are only specified if the ADC calibration routine is executed from the Boot ROM. See
Section 8.2.7.3 for more information.
TI specifies that the ADC will have no missing codes.
1 LSB has the weighted value of 3.0/4096 = 0.732 mV.
A single internal/external band gap reference sources both ADCREFP and ADCREFM signals, and hence, these voltages track
together. The ADC converter uses the difference between these two as its reference. The total gain error listed for the internal
reference is inclusive of the movement of the internal band gap over temperature. Gain error over temperature for the external
reference option will depend on the temperature profile of the source used.
Voltages above VDDA + 0.3 V or below VSS - 0.3 V applied to an analog input pin may temporarily affect the conversion of another pin.
To avoid this, the analog inputs should be kept within these limits.
TI recommends using high precision external reference TI part REF3020/3120 or equivalent for 2.048-V reference.
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7.10.2 ADC Power-Up Control Bit Timing
ADC Power Up Delay
ADC Ready for Conversions
PWDNBG
PWDNREF
td(BGR)
PWDNADC
td(PWD)
Request for
ADC
Conversion
Figure 7-37. ADC Power-Up Control Bit Timing
7.10.2.1 ADC Power-Up Delays
PARAMETER(1)
MIN
td(BGR)
Delay time for band gap reference to be stable. Bits 7 and 6 of the ADCTRL3 register
(ADCBGRFDN1/0) must be set to 1 before the PWDNADC bit is enabled.
td(PWD)
Delay time for power-down control to be stable. Bit delay time for band-gap reference
to be stable. Bits 7 and 6 of the ADCTRL3 register (ADCBGRFDN1/0) must be set to
1 before the PWDNADC bit is enabled. Bit 5 of the ADCTRL3 register (PWDNADC)
must be set to 1 before any ADC conversions are initiated.
(1)
TYP
MAX
5
20
50
UNIT
ms
μs
1
ms
Timings maintain compatibility to the 281x ADC module. The 2833x/2823x ADC also supports driving all 3 bits at the same time and
waiting td(BGR) ms before first conversion.
7.10.2.2 Typical Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
CONDITIONS(1) (2)
ADC OPERATING MODE
VDDA18
VDDA3.3
UNIT
Mode A (Operational Mode):
•
•
BG and REF enabled
PWD disabled
30
2
mA
Mode B:
•
•
•
ADC clock enabled
BG and REF enabled
PWD enabled
9
0.5
mA
Mode C:
•
•
•
ADC clock enabled
BG and REF disabled
PWD enabled
5
20
μA
Mode D:
•
•
•
ADC clock disabled
BG and REF disabled
PWD enabled
5
15
μA
(1)
(2)
Test Conditions:
SYSCLKOUT = 150 MHz
ADC module clock = 25 MHz
ADC performing a continuous conversion of all 16 channels in Mode A
VDDA18 includes current into VDD1A18 and VDD2A18. VDDA3.3 includes current into VDDA2 and VDDAIO.
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Rs
Source
Signal
ADCIN0
Ron
1 kΩ
Switch
Cp
10 pF
ac
Ch
1.64 pF
28x DSP
Typical Values of the Input Circuit Components:
Switch Resistance (Ron):
Sampling Capacitor (Ch):
Parasitic Capacitance (Cp):
Source Resistance (Rs):
1 kΩ
1.64 pF
10 pF
50 Ω
Figure 7-38. ADC Analog Input Impedance Model
7.10.3 Definitions
Reference Voltage
The on-chip ADC has a built-in reference, which provides the reference voltages for the ADC.
Analog Inputs
The on-chip ADC consists of 16 analog inputs, which are sampled either one at a time or two channels at a time.
These inputs are software-selectable.
Converter
The on-chip ADC uses a 12-bit four-stage pipeline architecture, which achieves a high sample rate with low
power consumption.
Conversion Modes
The conversion can be performed in two different conversion modes:
• Sequential sampling mode (SMODE = 0)
• Simultaneous sampling mode (SMODE = 1)
102
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7.10.4 Sequential Sampling Mode (Single-Channel) (SMODE = 0)
In sequential sampling mode, the ADC can continuously convert input signals on any of the channels (Ax to Bx).
The ADC can start conversions on event triggers from the ePWM, software trigger, or from an external ADCSOC
signal. If the SMODE bit is 0, the ADC will do conversions on the selected channel on every Sample/Hold pulse.
The conversion time and latency of the Result register update are explained below. The ADC interrupt flags are
set a few SYSCLKOUT cycles after the Result register update. The selected channels will be sampled at every
falling edge of the Sample/Hold pulse. The Sample/Hold pulse width can be programmed to be 1 ADC clock
wide (minimum) or 16 ADC clocks wide (maximum).
Sample n+2
Sample n+1
Analog Input on
Channel Ax or Bx
Sample n
ADC Clock
Sample and Hold
SH Pulse
SMODE Bit
td(SH)
tdschx_n+1
tdschx_n
ADC Event Trigger from
ePWM or Other Sources
tSH
Figure 7-39. Sequential Sampling Mode (Single-Channel) Timing
7.10.4.1 Sequential Sampling Mode Timing
SAMPLE n
SAMPLE n + 1
AT 25-MHz
ADC CLOCK,
tc(ADCCLK) = 40 ns
td(SH)
Delay time from event trigger to
sampling
2.5tc(ADCCLK)
tSH
Sample/Hold width/Acquisition
Width
(1 + Acqps) *
tc(ADCCLK)
40 ns with Acqps = 0
td(schx_n)
Delay time for first result to appear
in Result register
4tc(ADCCLK)
160 ns
td(schx_n+1)
Delay time for successive results to
appear in Result register
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(2 + Acqps) *
tc(ADCCLK)
REMARKS
Acqps value = 0-15
ADCTRL1[8:11]
80 ns
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7.10.5 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
In simultaneous mode, the ADC can continuously convert input signals on any one pair of channels (A0/B0 to
A7/B7). The ADC can start conversions on event triggers from the ePWM, software trigger, or from an external
ADCSOC signal. If the SMODE bit is 1, the ADC will do conversions on two selected channels on every Sample/
Hold pulse. The conversion time and latency of the result register update are explained below. The ADC interrupt
flags are set a few SYSCLKOUT cycles after the Result register update. The selected channels will be sampled
simultaneously at the falling edge of the Sample/Hold pulse. The Sample/Hold pulse width can be programmed
to be 1 ADC clock wide (minimum) or 16 ADC clocks wide (maximum).
Note
In simultaneous mode, the ADCIN channel pair select must be A0/B0, A1/B1, ..., A7/B7, and not in
other combinations (such as A1/B3, and so on).
Sample n
Sample n+1
Analog Input on
Channel Ax
Analog Input on
Channel Bx
Sample n+2
ADC Clock
Sample and Hold
SH Pulse
SMODE Bit
td(SH)
tdschA0_n+1
tSH
ADC Event Trigger from
ePWM or Other Sources
tdschA0_n
tdschB0_n+1
tdschB0_n
Figure 7-40. Simultaneous Sampling Mode Timing
7.10.5.1 Simultaneous Sampling Mode Timing
SAMPLE n
SAMPLE n + 1
AT 25-MHz
ADC CLOCK,
tc(ADCCLK) = 40 ns
td(SH)
Delay time from event trigger to
sampling
2.5tc(ADCCLK)
tSH
Sample/Hold width/Acquisition
Width
(1 + Acqps) *
tc(ADCCLK)
40 ns with Acqps = 0
td(schA0_n)
Delay time for first result to
appear in Result register
4tc(ADCCLK)
160 ns
td(schB0_n )
Delay time for first result to
appear in Result register
5tc(ADCCLK)
200 ns
td(schA0_n+1)
Delay time for successive results
to appear in Result register
(3 + Acqps) * tc(ADCCLK)
120 ns
td(schB0_n+1 )
Delay time for successive results
to appear in Result register
(3 + Acqps) * tc(ADCCLK)
120 ns
104
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REMARKS
Acqps value = 0-15
ADCTRL1[8:11]
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7.10.6 Detailed Descriptions
Integral Nonlinearity
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale.
The point used as zero occurs one-half LSB before the first code transition. The full-scale point is defined as
level one-half LSB beyond the last code transition. The deviation is measured from the center of each particular
code to the true straight line between these two points.
Differential Nonlinearity
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. A
differential nonlinearity error of less than ±1 LSB ensures no missing codes.
Zero Offset
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the
deviation of the actual transition from that point.
Gain Error
The first code transition should occur at an analog value one-half LSB above negative full scale. The last
transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is the
deviation of the actual difference between first and last code transitions and the ideal difference between first
and last code transitions.
Signal-to-Noise Ratio + Distortion (SINAD)
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components
below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in
decibels.
Effective Number of Bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
(SINAD * 1.76)
N+
6.02
it is possible to get a measure of performance expressed as N, the effective number of
bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be calculated
directly from its measured SINAD.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured input
signal and is expressed as a percentage or in decibels.
Spurious Free Dynamic Range (SFDR)
SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.
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7.11 Migrating Between F2833x Devices and F2823x Devices
The principal difference between these two devices is the absence of the floating-point unit (FPU) in the F2823x
devices. This section describes how to build an application for each:
• For F2833x devices:
– Code Composer Studio 3.3 with Service Release 9 or later is required for debug support of C28x +
floating-point devices.
– Use -v28 --float_support = fpu32 compiler options. The --float_support option is available in compiler
v5.0.2 or later. In Code Composer Studio, the --float_support option is located on the advanced tab of the
compiler options (Project → Build_Options → Compiler → Advanced tab).
– Include the compiler’s run-time support library for native 32-bit floating-point. For example, use
rts2800_fpu32.lib for C code or rts2800_fpu32_eh.lib for C++ code.
– Consider using the C28x FPU Fast RTS Library (part of C2000Ware for C2000 MCUs) for highperformance floating-point math functions such as sin, cos, div, sqrt, and atan. The Fast RTS library
should be linked in before the normal run-time support library.
• For F2823x devices:
– Either leave off the --float_support switch or use -v28 --float_support=none
– Include the appropriate run-time support library for fixed point code. For example, use rts2800_ml.lib for C
code or rts2800_ml_eh.lib for C++ code.
– Consider using the C28x IQMath Library - A Virtual Floating Point Engine to achieve a performance boost
from math functions such as sin, cos, div, sqrt, and atan.
Code built in this manner will also run on F2833x devices, but it will not make use of the on-chip
floating-point unit.
In either case, to allow for quick portability between native floating-point and fixed-point devices, TI suggests
writing your code using the IQmath macro language described in C28x IQMath Library.
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8 Detailed Description
8.1 Brief Descriptions
8.1.1 C28x CPU
The F2833x (C28x+FPU)/F2823x (C28x) family is a member of the TMS320C2000™ real-time microcontroller
(MCU) platform. The C28x+FPU based controllers have the same 32-bit fixed-point architecture as TI's existing
C28x MCUs, but also include a single-precision (32-bit) IEEE 754 floating-point unit (FPU). It is a very efficient
C/C++ engine, enabling users to develop their system control software in a high-level language. It also enables
math algorithms to be developed using C/C++. The device is as efficient at DSP math tasks as it is at system
control tasks that typically are handled by microcontroller devices. This efficiency removes the need for a
second processor in many systems. The 32 × 32-bit MAC 64-bit processing capabilities enable the controller
to handle higher numerical resolution problems efficiently. Add to this the fast interrupt response with automatic
context save of critical registers, resulting in a device that is capable of servicing many asynchronous events
with minimal latency. The device has an 8-level-deep protected pipeline with pipelined memory accesses. This
pipelining enables it to execute at high speeds without resorting to expensive high-speed memories. Special
branch-look-ahead hardware minimizes the latency for conditional discontinuities. Special store conditional
operations further improve performance.
The F2823x family is also a member of the TMS320C2000™ real-time microcontroller (MCU) platform but it
does not include a floating-point unit (FPU).
8.1.2 Memory Bus (Harvard Bus Architecture)
As with many MCU type devices, multiple buses are used to move data between the memories and peripherals
and the CPU. The C28x memory bus architecture contains a program read bus, data read bus and data
write bus. The program read bus consists of 22 address lines and 32 data lines. The data read and write
buses consist of 32 address lines and 32 data lines each. The 32-bit-wide data buses enable single cycle
32-bit operations. The multiple bus architecture, commonly termed Harvard Bus, enables the C28x to fetch an
instruction, read a data value and write a data value in a single cycle. All peripherals and memories attached
to the memory bus will prioritize memory accesses. Generally, the priority of memory bus accesses can be
summarized as follows:
Highest:
Data Writes
(Simultaneous data and program writes cannot occur on the memory bus.)
Program Writes
(Simultaneous data and program writes cannot occur on the memory bus.)
Data Reads
Program Reads (Simultaneous program reads and fetches cannot occur on the memory bus.)
Lowest:
Fetches
(Simultaneous program reads and fetches cannot occur on the memory bus.)
8.1.3 Peripheral Bus
To enable migration of peripherals between various TI MCU family of devices, the 2833x/2823x devices adopt a
peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes the various buses that
make up the processor Memory Bus into a single bus consisting of 16 address lines and 16 or 32 data lines and
associated control signals. Three versions of the peripheral bus are supported. One version supports only 16-bit
accesses (called peripheral frame 2). Another version supports both 16- and 32-bit accesses (called peripheral
frame 1). The third version supports DMA access and both 16- and 32-bit accesses (called peripheral frame 3).
8.1.4 Real-Time JTAG and Analysis
The 2833x/2823x devices implement the standard IEEE 1149.1 JTAG interface. Additionally, the devices support
real-time mode of operation whereby the contents of memory, peripheral and register locations can be modified
while the processor is running and executing code and servicing interrupts. The user can also single step
through non-time-critical code while enabling time-critical interrupts to be serviced without interference. The
device implements the real-time mode in hardware within the CPU. This is a feature unique to the 2833x/2823x
device, requiring no software monitor. Additionally, special analysis hardware is provided that allows setting of
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hardware breakpoint or data/address watch-points and generate various user-selectable break events when a
match occurs.
8.1.5 External Interface (XINTF)
This asynchronous interface consists of 20 address lines, 32 data lines, and three chip-select lines. The chipselect lines are mapped to three external zones, Zones 0, 6, and 7. Each of the three zones can be programmed
with a different number of wait states, strobe signal setup and hold timing and each zone can be programmed
for extending wait states externally or not. The programmable wait state, chip-select and programmable strobe
timing enables glueless interface to external memories and peripherals.
8.1.6 Flash
The F28335/F28333/F28235 devices contain 256K × 16 of embedded flash memory, segregated into eight 32K
× 16 sectors. The F28334/F28234 devices contain 128K × 16 of embedded flash memory, segregated into
eight 16K × 16 sectors. The F28332/F28232 devices contain 64K × 16 of embedded flash, segregated into four
16K × 16 sectors. All the devices also contain a single 1K × 16 of OTP memory at address range 0x380400–
0x3807FF. The user can individually erase, program, and validate a flash sector while leaving other sectors
untouched. However, it is not possible to use one sector of the flash or the OTP to execute flash algorithms that
erase/program other sectors. Special memory pipelining is provided to enable the flash module to achieve higher
performance. The flash/OTP is mapped to both program and data space; therefore, it can be used to execute
code or store data information. Note that addresses 0x33FFF0–0x33FFF5 are reserved for data variables and
should not contain program code.
Note
The Flash and OTP wait-states can be configured by the application. This allows applications running
at slower frequencies to configure the flash to use fewer wait-states.
Flash effective performance can be improved by enabling the flash pipeline mode in the Flash options
register. With this mode enabled, effective performance of linear code execution will be much faster
than the raw performance indicated by the wait-state configuration alone. The exact performance gain
when using the Flash pipeline mode is application-dependent.
For more information on the Flash options, Flash wait-state, and OTP wait-state registers, see
the System Control and Interrupts chapter of the TMS320x2833x, TMS320x2823x Real-Time
Microcontrollers Technical Reference Manual.
8.1.7 M0, M1 SARAMs
All 2833x/2823x devices contain these two blocks of single access memory, each 1K × 16 in size. The stack
pointer points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on
C28x devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to execute
code or for data variables. The partitioning is performed within the linker. The C28x device presents a unified
memory map to the programmer. This makes for easier programming in high-level languages.
8.1.8 L0, L1, L2, L3, L4, L5, L6, L7 SARAMs
The F28335/F28333/F28235 and F28334/F28234 each contain 32K × 16 of single-access RAM, divided into
8 blocks (L0–L7 with 4K each). The F28332/F28232 contain 24K × 16 of single-access RAM, divided into
6 blocks (L0–L5 with 4K each). Each block can be independently accessed to minimize CPU pipeline stalls.
Each block is mapped to both program and data space. L4, L5, L6, and L7 are DMA-accessible.
108
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8.1.9 Boot ROM
The Boot ROM is factory-programmed with boot-loading software. Boot-mode signals are provided to tell the
bootloader software what boot mode to use on power up. The user can select to boot normally or to download
new software from an external connection or to select boot software that is programmed in the internal Flash/
ROM. The Boot ROM also contains standard tables, such as SIN/COS waveforms, for use in math related
algorithms.
Table 8-1. Boot Mode Selection
(1)
MODE
GPIO87/XA15
GPIO86/XA14
GPIO85/XA13
GPIO84/XA12
MODE(1)
F
1
1
1
1
Jump to Flash
E
1
1
1
0
SCI-A boot
D
1
1
0
1
SPI-A boot
C
1
1
0
0
I2C-A boot
B
1
0
1
1
eCAN-A boot
A
1
0
1
0
McBSP-A boot
9
1
0
0
1
Jump to XINTF x16
8
1
0
0
0
Jump to XINTF x32
7
0
1
1
1
Jump to OTP
6
0
1
1
0
Parallel GPIO I/O boot
5
0
1
0
1
Parallel XINTF boot
4
0
1
0
0
Jump to SARAM
3
0
0
1
1
Branch to check boot mode
2
0
0
1
0
Branch to Flash, skip ADC calibration
1
0
0
0
1
Branch to SARAM, skip ADC
calibration
0
0
0
0
0
Branch to SCI, skip ADC calibration
All four GPIO pins have an internal pullup.
Note
Modes 0, 1, and 2 in Table 8-1 are for TI debug only. Skipping the ADC calibration function in an
application will cause the ADC to operate outside of the stated specifications
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8.1.9.1 Peripheral Pins Used by the Bootloader
Table 8-2 shows which GPIO pins are used by each peripheral bootloader. Refer to the GPIO mux table to see if
these conflict with any of the peripherals you would like to use in your application.
Table 8-2. Peripheral Bootload Pins
BOOTLOADER
PERIPHERAL LOADER PINS
SCI-A
SCIRXDA (GPIO28)
SCITXDA (GPIO29)
SPI-A
SPISIMOA (GPIO16)
SPISOMIA (GPIO17)
SPICLKA (GPIO18)
SPISTEA (GPIO19)
I2C
SDAA (GPIO32)
SCLA (GPIO33)
CAN
CANRXA (GPIO30)
CANTXA (GPIO31)
McBSP
MDXA (GPIO20)
MDRA (GPIO21)
MCLKXA (GPIO22)
MFSXA (GPIO23)
MCLKRA (GPIO7)
MFSRA (GPIO5)
8.1.10 Security
The devices support high levels of security to protect the user firmware from being reverse engineered. The
security features a 128-bit password (hardcoded for 16 wait-states), which the user programs into the flash. One
code security module (CSM) is used to protect the flash/OTP and the L0/L1/L2/L3 SARAM blocks. The security
feature prevents unauthorized users from examining the memory contents via the JTAG port, executing code
from external memory or trying to boot-load some undesirable software that would export the secure memory
contents. To enable access to the secure blocks, the user must write the correct 128-bit KEY value, which
matches the value stored in the password locations within the Flash.
In addition to the CSM, the emulation code security logic (ECSL) has been implemented to prevent unauthorized
users from stepping through secure code. Any code or data access to flash, user OTP, L0, L1, L2, or L3 memory
while the JTAG debug probe is connected will trip the ECSL and break the emulation connection. To allow
emulation of secure code, while maintaining the CSM protection against secure memory reads, the user must
write the correct value into the lower 64 bits of the KEY register, which matches the value stored in the lower
64 bits of the password locations within the flash. Note that dummy reads of all 128 bits of the password in the
flash must still be performed. If the lower 64 bits of the password locations are all ones (unprogrammed), then
the KEY value does not need to match.
When initially debugging a device with the password locations in flash programmed (that is, secured), the JTAG
debug probe takes some time to take control of the CPU. During this time, the CPU will start running and may
execute an instruction that performs an access to a protected ECSL area. If this happens, the ECSL will trip and
cause the JTAG debug probe connection to be cut. Two solutions to this problem exist:
1. The first is to use the Wait-In-Reset emulation mode, which will hold the device in reset until the JTAG debug
probe takes control. The JTAG debug probe must support this mode for this option.
2. The second option is to use the “Branch to check boot mode” boot option. This will sit in a loop and
continuously poll the boot mode select pins. The user can select this boot mode and then exit this mode
once the JTAG debug probe is connected by re-mapping the PC to another address or by changing the boot
mode selection pin to the desired boot mode.
110
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Note
When the code-security passwords are programmed, all addresses from 0x33FF80 to 0x33FFF5
cannot be used as program code or data. These locations must be programmed to 0x0000.
If the code security feature is not used, addresses 0x33FF80 to 0x33FFEF may be used for code
or data. Addresses 0x33FFF0 to 0x33FFF5 are reserved for data and should not contain program
code.
The 128-bit password (at 0x33FFF8 to 0x33FFFF) must not be programmed to zeros. Doing so would
permanently lock the device.
Code Security Module Disclaimer
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO
PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY (EITHER ROM
OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS
STANDARD TERMS AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS
FOR THE WARRANTY PERIOD APPLICABLE FOR THIS DEVICE.
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY
CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT AS SET FORTH
ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR
OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE.
IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT,
INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF
YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR
OTHER ECONOMIC LOSS.
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8.1.11 Peripheral Interrupt Expansion (PIE) Block
The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The PIE block
can support up to 96 peripheral interrupts. On the 2833x/2823x, 58 of the possible 96 interrupts are used by
peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of 12 CPU interrupt lines
(INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a dedicated RAM block that
can be overwritten by the user. The vector is automatically fetched by the CPU on servicing the interrupt. It takes
eight CPU clock cycles to fetch the vector and save critical CPU registers. Hence the CPU can quickly respond
to interrupt events. Prioritization of interrupts is controlled in hardware and software. Each individual interrupt can
be enabled or disabled within the PIE block.
8.1.12 External Interrupts (XINT1–XINT7, XNMI)
The devices support eight masked external interrupts (XINT1–XINT7, XNMI). XNMI can be connected to the
INT13 or NMI interrupt of the CPU. Each of the interrupts can be selected for negative, positive, or both negative
and positive edge triggering and can also be enabled or disabled (including the XNMI). XINT1, XINT2, and XNMI
also contain a 16-bit free-running up counter, which is reset to zero when a valid interrupt edge is detected. This
counter can be used to accurately time-stamp the interrupt. Unlike the 281x devices, there are no dedicated
pins for the external interrupts. XINT1 XINT2, and XNMI interrupts can accept inputs from GPIO0–GPIO31 pins.
XINT3–XINT7 interrupts can accept inputs from GPIO32–GPIO63 pins.
8.1.13 Oscillator and PLL
The device can be clocked by an external oscillator or by a crystal attached to the on-chip oscillator circuit.
A PLL is provided supporting up to 10 input-clock-scaling ratios. The PLL ratios can be changed on-the-fly in
software, enabling the user to scale back on operating frequency if lower power operation is desired. Refer to
Section 7.9.4.4 for timing details. The PLL block can be set in bypass mode.
8.1.14 Watchdog
The devices contain a watchdog timer. The user software must regularly reset the watchdog counter within
a certain time frame; otherwise, the watchdog will generate a reset to the processor. The watchdog can be
disabled if necessary.
8.1.15 Peripheral Clocking
The clocks to each individual peripheral can be enabled or disabled so as to reduce power consumption when
a peripheral is not in use. Additionally, the system clock to the serial ports (except I2C and eCAN) and the ADC
blocks can be scaled relative to the CPU clock. This enables the timing of peripherals to be decoupled from
increasing CPU clock speeds.
8.1.16 Low-Power Modes
The devices are full static CMOS devices. Three low-power modes are provided:
112
IDLE:
Place CPU into low-power mode. Peripheral clocks may be turned off selectively and only
those peripherals that need to function during IDLE are left operating. An enabled interrupt
from an active peripheral or the watchdog timer will wake the processor from IDLE mode.
STANDBY:
Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL functional.
An external interrupt event will wake the processor and the peripherals. Execution begins
on the next valid cycle after detection of the interrupt event
HALT:
Turns off the internal oscillator. This mode basically shuts down the device and places it
in the lowest possible power consumption mode. A reset or external signal can wake the
device from this mode.
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8.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
The device segregates peripherals into four sections. The mapping of peripherals is as follows:
PF0:
PF1:
PF2:
PF3:
PIE:
PIE Interrupt Enable and Control Registers Plus PIE Vector Table
Flash:
Flash Wait State Registers
XINTF:
External Interface Registers
DMA
DMA Registers
Timers:
CPU-Timers 0, 1, 2 Registers
CSM:
Code Security Module KEY Registers
ADC:
ADC Result Registers (dual-mapped)
eCAN:
eCAN Mailbox and Control Registers
GPIO:
GPIO MUX Configuration and Control Registers
ePWM:
Enhanced Pulse Width Modulator Module and Registers (dual mapped)
eCAP:
Enhanced Capture Module and Registers
eQEP:
Enhanced Quadrature Encoder Pulse Module and Registers
SYS:
System Control Registers
SCI:
Serial Communications Interface (SCI) Control and RX/TX Registers
SPI:
Serial Port Interface (SPI) Control and RX/TX Registers
ADC:
ADC Status, Control, and Result Register
I2C:
Inter-Integrated Circuit Module and Registers
XINT
External Interrupt Registers
McBSP
Multichannel Buffered Serial Port Registers
ePWM:
Enhanced Pulse Width Modulator Module and Registers (dual mapped)
8.1.18 General-Purpose Input/Output (GPIO) Multiplexer
Most of the peripheral signals are multiplexed with GPIO signals. This enables the user to use a pin as GPIO
if the peripheral signal or function is not used. On reset, GPIO pins are configured as inputs. The user can
individually program each pin for GPIO mode or peripheral signal mode. For specific inputs, the user can also
select the number of input qualification cycles. This is to filter unwanted noise glitches. The GPIO signals can
also be used to bring the device out of specific low-power modes.
8.1.19 32-Bit CPU-Timers (0, 1, 2)
CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling.
The timers have a 32-bit count down register, which generates an interrupt when the counter reaches zero.
The counter is decremented at the CPU clock speed divided by the prescale value setting. When the counter
reaches zero, it is automatically reloaded with a 32-bit period value. CPU-Timer 2 is reserved for Real-Time OS
(RTOS)/BIOS applications. It is connected to INT14 of the CPU. If DSP/BIOS or SYS/BIOS is not being used,
CPU-Timer 2 is available for general use. CPU-Timer 1 is for general use and can be connected to INT13 of the
CPU. CPU-Timer 0 is also for general use and is connected to the PIE block.
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8.1.20 Control Peripherals
The 2833x/2823x devices support the following peripherals which are used for embedded control and
communication:
ePWM:
The enhanced PWM peripheral supports independent and complementary PWM
generation, adjustable dead-band generation for leading and trailing edges, latched and
cycle-by-cycle trip mechanism. Some of the PWM pins support HRPWM features. The
ePWM registers are supported by the DMA to reduce the overhead for servicing this
peripheral.
eCAP:
The enhanced capture peripheral uses a 32-bit time base and registers up to four
programmable events in continuous/one-shot capture modes.
This peripheral can also be configured to generate an auxiliary PWM signal.
eQEP:
The enhanced QEP peripheral uses a 32-bit position counter, supports low-speed
measurement using capture unit and high-speed measurement using a 32-bit unit timer.
This peripheral has a watchdog timer to detect motor stall and input error detection logic
to identify simultaneous edge transition in QEP signals.
ADC:
The ADC block is a 12-bit converter, single ended, 16-channels. It contains two sampleand-hold units for simultaneous sampling. The ADC registers are supported by the DMA
to reduce the overhead for servicing this peripheral.
8.1.21 Serial Port Peripherals
The devices support the following serial communication peripherals:
114
eCAN:
This is the enhanced version of the CAN peripheral. It supports 32 mailboxes, timestamping of messages, and is compliant with ISO 11898-1 (CAN 2.0B).
McBSP:
The multichannel buffered serial port (McBSP) connects to E1/T1 lines, phone-quality
CODECs for modem applications or high-quality stereo audio DAC devices. The McBSP
receive and transmit registers are supported by the DMA to significantly reduce the
overhead for servicing this peripheral. Each McBSP module can be configured as an SPI
as required.
SPI:
The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream
of programmed length (1 to 16 bits) to be shifted into and out of the device at a
programmable bit-transfer rate. Normally, the SPI is used for communications between the
MCU and external peripherals or another processor. Typical applications include external
I/O or peripheral expansion through devices such as shift registers, display drivers, and
ADCs. Multidevice communications are supported by the master/slave operation of the
SPI. On the 2833x/2823x, the SPI contains a 16-level receive and transmit FIFO for
reducing interrupt servicing overhead.
SCI:
The serial communications interface is a 2-wire asynchronous serial port, commonly
known as UART. The SCI contains a 16-level receive and transmit FIFO for reducing
interrupt servicing overhead.
I2C:
The inter-integrated circuit (I2C) module provides an interface between an MCU and
other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus) specification
version 2.1 and connected by way of an I2C-bus. External components attached to this
2-wire serial bus can transmit/receive up to 8-bit data to/from the MCU through the I2C
module. On the 2833x/2823x, the I2C contains a 16-level receive and transmit FIFO for
reducing interrupt servicing overhead.
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8.2 Peripherals
The integrated peripherals of the 2833x and 2823x devices are described in the following subsections:
• 6-channel Direct Memory Access (DMA)
• Three 32-bit CPU-Timers
• Up to six enhanced PWM modules (ePWM1, ePWM2, ePWM3, ePWM4, ePWM5, ePWM6)
• Up to six enhanced capture modules (eCAP1, eCAP2, eCAP3, eCAP4, eCAP5, eCAP6)
• Up to two enhanced QEP modules (eQEP1, eQEP2)
• Enhanced analog-to-digital converter (ADC) module
• Up to two enhanced controller area network (eCAN) modules (eCAN-A, eCAN-B)
• Up to three serial communications interface modules (SCI-A, SCI-B, SCI-C)
• One serial peripheral interface (SPI) module (SPI-A)
• Inter-integrated circuit (I2C) module
• Up to two multichannel buffered serial port (McBSP-A, McBSP-B) modules
• Digital I/O and shared pin functions
• External Interface (XINTF)
8.2.1 DMA Overview
Features:
• 6 channels with independent PIE interrupts
• Trigger sources:
– ePWM SOCA/SOCB
– ADC Sequencer 1 and Sequencer 2
– McBSP-A and McBSP-B transmit and receive logic
– XINT1–7 and XINT13
– CPU timers
– Software
• Data sources and destinations:
– L4–L7 16K × 16 SARAM
– All XINTF zones
– ADC Memory Bus mapped RESULT registers
– McBSP-A and McBSP-B transmit and receive buffers
– ePWM registers
• Word Size: 16-bit or 32-bit (McBSPs limited to 16-bit)
• Throughput: 4 cycles/word (5 cycles/word for McBSP reads)
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ADC
CPU
ADC
PF0
ADC
control
I/F
RESULT
and
ADC registers RESULT
DMA
registers
PF0
I/F
L4
I/F
L4
SARAM
(4Kx16)
L5
I/F
L5
SARAM
(4Kx16)
L6
I/F
L6
SARAM
(4Kx16)
L7
I/F
L7
SARAM
(4Kx16)
INT7
ADC
PF2
I/F
External
interrupts
CPU
timers
PIE
DINT[CH1:CH6]
XINTF zones interface
XINTF memory zones
CPU bus
CPU
McBSP A
PF3
I/F
Event
triggers
McBSP B
ePWM/
(A)
HRPWM
registers
DMA
6-ch
DMA bus
A.
The ePWM and HRPWM registers must be remapped to PF3 (through bit 0 of the MAPCNF register) before they can be accessed by
the DMA. The ePWM or HRPWM connection to DMA is not present in silicon revision 0.
Figure 8-1. DMA Functional Block Diagram
116
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8.2.2 32-Bit CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
There are three 32-bit CPU-timers on the devices (CPU-Timer 0, CPU-Timer 1, CPU-Timer 2).
CPU-Timer 2 is reserved for DSP/BIOS or SYS/BIOS. CPU-Timer 0 and CPU-Timer 1 can be used in user
applications. These timers are different from the timers that are present in the ePWM modules.
Note
If the application is not using DSP/BIOS or SYS/BIOS, then CPU-Timer 2 can be used in the
application.
Reset
Timer Reload
16-Bit Timer Divide-Down
TDDRH:TDDR
32-Bit Timer Period
PRDH:PRD
16-Bit Prescale Counter
PSCH:PSC
SYSCLKOUT
TCR.4
(Timer Start Status)
32-Bit Counter
TIMH:TIM
Borrow
Borrow
TINT
Figure 8-2. CPU-Timers
The timer interrupt signals ( TINT0, TINT1, TINT2) are connected as shown in Figure 8-3.
INT1
to
INT12
PIE
TINT0
CPU-TIMER 0
28x
CPU
TINT1
CPU-TIMER 1
INT13
XINT13
INT14
A.
B.
TINT2
CPU-TIMER 2
(Reserved for
DSP/BIOS or SYS/BIOS)
The timer registers are connected to the memory bus of the C28x processor.
The timing of the timers is synchronized to SYSCLKOUT of the processor clock.
Figure 8-3. CPU-Timer Interrupt Signals and Output Signal
The general operation of the timer is as follows: The 32-bit counter register "TIMH:TIM" is loaded with the value
in the period register "PRDH:PRD". The counter register decrements at the SYSCLKOUT rate of the C28x.
When the counter reaches 0, a timer interrupt output signal generates an interrupt pulse. The registers listed in
Table 8-3 are used to configure the timers. For more information, see the System Control and Interrupts chapter
of the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual.
Copyright © 2022 Texas Instruments Incorporated
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Table 8-3. CPU-Timers 0, 1, 2 Configuration and Control Registers
NAME
ADDRESS
SIZE (x16)
TIMER0TIM
0x0C00
1
CPU-Timer 0, Counter Register
TIMER0TIMH
0x0C01
1
CPU-Timer 0, Counter Register High
TIMER0PRD
0x0C02
1
CPU-Timer 0, Period Register
TIMER0PRDH
0x0C03
1
CPU-Timer 0, Period Register High
TIMER0TCR
0x0C04
1
CPU-Timer 0, Control Register
Reserved
0x0C05
1
TIMER0TPR
0x0C06
1
CPU-Timer 0, Prescale Register
TIMER0TPRH
0x0C07
1
CPU-Timer 0, Prescale Register High
TIMER1TIM
0x0C08
1
CPU-Timer 1, Counter Register
TIMER1TIMH
0x0C09
1
CPU-Timer 1, Counter Register High
TIMER1PRD
0x0C0A
1
CPU-Timer 1, Period Register
TIMER1PRDH
0x0C0B
1
CPU-Timer 1, Period Register High
TIMER1TCR
0x0C0C
1
CPU-Timer 1, Control Register
Reserved
0x0C0D
1
TIMER1TPR
0x0C0E
1
CPU-Timer 1, Prescale Register
TIMER1TPRH
0x0C0F
1
CPU-Timer 1, Prescale Register High
TIMER2TIM
0x0C10
1
CPU-Timer 2, Counter Register
TIMER2TIMH
0x0C11
1
CPU-Timer 2, Counter Register High
TIMER2PRD
0x0C12
1
CPU-Timer 2, Period Register
TIMER2PRDH
0x0C13
1
CPU-Timer 2, Period Register High
TIMER2TCR
0x0C14
1
CPU-Timer 2, Control Register
Reserved
0x0C15
1
TIMER2TPR
0x0C16
1
CPU-Timer 2, Prescale Register
0x0C17
1
CPU-Timer 2, Prescale Register High
0x0C18 – 0x0C3F
40
TIMER2TPRH
Reserved
118
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DESCRIPTION
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
8.2.3 Enhanced PWM Modules
The 2833x/2823x devices contain up to six enhanced PWM (ePWM) modules (ePWM1 to ePWM6). Figure 8-4
shows the time-base counter synchronization scheme 3. Figure 8-5 shows the signal interconnections with the
ePWM.
Table 8-4 shows the complete ePWM register set per module and Table 8-5 shows the remapped register
configuration.
eCAP4
EPWM1SYNCI
GPIO
MUX
ePWM1
EPWM1SYNCO
SYNCI
eCAP1
EPWM4SYNCI
EPWM2SYNCI
ePWM4
ePWM2
EPWM4SYNCO
EPWM2SYNCO
EPWM5SYNCI
EPWM3SYNCI
ePWM5
ePWM3
EPWM5SYNCO
EPWM3SYNCO
EPWM6SYNCI
ePWM6
A.
By default, ePWM and HRPWM registers are mapped to Peripheral Frame 1 (PF1). Table 8-4 shows this configuration. To re-map the
registers to Peripheral Frame 3 (PF3) to enable DMA access, bit 0 (MAPEPWM) of MAPCNF register (address 0x702E) must be set
to 1. Table 8-5 shows the remapped configuration.
Figure 8-4. Time-Base Counter Synchronization Scheme 3
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 8-4. ePWM Control and Status Registers (Default Configuration in PF1)
ePWM1
ePWM2
ePWM3
ePWM4
ePWM5
ePWM6
SIZE (x16) /
#SHADOW
TBCTL
0x6800
0x6840
0x6880
0x68C0
0x6900
0x6940
1/0
Time Base Control Register
TBSTS
0x6801
0x6841
0x6881
0x68C1
0x6901
0x6941
1/0
Time Base Status Register
TBPHSHR
0x6802
0x6842
0x6882
0x68C2
0x6902
0x6942
1/0
Time Base Phase HRPWM Register
TBPHS
0x6803
0x6843
0x6883
0x68C3
0x6903
0x6943
1/0
Time Base Phase Register
TBCTR
0x6804
0x6844
0x6884
0x68C4
0x6904
0x6944
1/0
Time Base Counter Register
TBPRD
0x6805
0x6845
0x6885
0x68C5
0x6905
0x6945
1/1
Time Base Period Register Set
CMPCTL
0x6807
0x6847
0x6887
0x68C7
0x6907
0x6947
1/0
Counter Compare Control Register
CMPAHR
0x6808
0x6848
0x6888
0x68C8
0x6908
0x6948
1/1
Time Base Compare A HRPWM
Register
CMPA
0x6809
0x6849
0x6889
0x68C9
0x6909
0x6949
1/1
Counter Compare A Register Set
CMPB
0x680A
0x684A
0x688A
0x68CA
0x690A
0x694A
1/1
Counter Compare B Register Set
AQCTLA
0x680B
0x684B
0x688B
0x68CB
0x690B
0x694B
1/0
Action Qualifier Control Register For
Output A
AQCTLB
0x680C
0x684C
0x688C
0x68CC
0x690C
0x694C
1/0
Action Qualifier Control Register For
Output B
AQSFRC
0x680D
0x684D
0x688D
0x68CD
0x690D
0x694D
1/0
Action Qualifier Software Force
Register
AQCSFRC
0x680E
0x684E
0x688E
0x68CE
0x690E
0x694E
1/1
Action Qualifier Continuous S/W
Force Register Set
DBCTL
0x680F
0x684F
0x688F
0x68CF
0x690F
0x694F
1/1
Dead-Band Generator Control
Register
DBRED
0x6810
0x6850
0x6890
0x68D0
0x6910
0x6950
1/0
Dead-Band Generator Rising Edge
Delay Count Register
DBFED
0x6811
0x6851
0x6891
0x68D1
0x6911
0x6951
1/0
Dead-Band Generator Falling Edge
Delay Count Register
TZSEL
0x6812
0x6852
0x6892
0x68D2
0x6912
0x6952
1/0
Trip Zone Select Register(1)
TZCTL
0x6814
0x6854
0x6894
0x68D4
0x6914
0x6954
1/0
Trip Zone Control Register(1)
TZEINT
0x6815
0x6855
0x6895
0x68D5
0x6915
0x6955
1/0
Trip Zone Enable Interrupt Register(1)
TZFLG
0x6816
0x6856
0x6896
0x68D6
0x6916
0x6956
1/0
Trip Zone Flag Register
TZCLR
0x6817
0x6857
0x6897
0x68D7
0x6917
0x6957
1/0
Trip Zone Clear Register(1)
TZFRC
0x6818
0x6858
0x6898
0x68D8
0x6918
0x6958
1/0
Trip Zone Force Register(1)
ETSEL
0x6819
0x6859
0x6899
0x68D9
0x6919
0x6959
1/0
Event Trigger Selection Register
ETPS
0x681A
0x685A
0x689A
0x68DA
0x691A
0x695A
1/0
Event Trigger Prescale Register
ETFLG
0x681B
0x685B
0x689B
0x68DB
0x691B
0x695B
1/0
Event Trigger Flag Register
ETCLR
0x681C
0x685C
0x689C
0x68DC
0x691C
0x695C
1/0
Event Trigger Clear Register
ETFRC
0x681D
0x685D
0x689D
0x68DD
0x691D
0x695D
1/0
Event Trigger Force Register
PCCTL
0x681E
0x685E
0x689E
0x68DE
0x691E
0x695E
1/0
PWM Chopper Control Register
HRCNFG
0x6820
0x6860
0x68A0
0x68E0
0x6920
0x6960
1/0
HRPWM Configuration Register(1)
NAME
(1)
120
DESCRIPTION
Registers that are EALLOW protected.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 8-5. ePWM Control and Status Registers (Remapped Configuration in PF3 - DMA-Accessible)
ePWM1
ePWM2
ePWM3
ePWM4
ePWM5
ePWM6
SIZE (x16) /
#SHADOW
TBCTL
0x5800
0x5840
0x5880
0x58C0
0x5900
0x5940
1/0
Time Base Control Register
TBSTS
0x5801
0x5841
0x5881
0x58C1
0x5901
0x5941
1/0
Time Base Status Register
TBPHSHR
0x5802
0x5842
0x5882
0x58C2
0x5902
0x5942
1/0
Time Base Phase HRPWM Register
TBPHS
0x5803
0x5843
0x5883
0x58C3
0x5903
0x5943
1/0
Time Base Phase Register
TBCTR
0x5804
0x5844
0x5884
0x58C4
0x5904
0x5944
1/0
Time Base Counter Register
TBPRD
0x5805
0x5845
0x5885
0x58C5
0x5905
0x5945
1/1
Time Base Period Register Set
CMPCTL
0x5807
0x5847
0x5887
0x58C7
0x5907
0x5947
1/0
Counter Compare Control Register
CMPAHR
0x5808
0x5848
0x5888
0x58C8
0x5908
0x5948
1/1
Time Base Compare A HRPWM
Register
CMPA
0x5809
0x5849
0x5889
0x58C9
0x5909
0x5949
1/1
Counter Compare A Register Set
CMPB
0x580A
0x584A
0x588A
0x58CA
0x590A
0x594A
1/1
Counter Compare B Register Set
AQCTLA
0x580B
0x584B
0x588B
0x58CB
0x590B
0x594B
1/0
Action Qualifier Control Register For
Output A
AQCTLB
0x580C
0x584C
0x588C
0x58CC
0x590C
0x594C
1/0
Action Qualifier Control Register For
Output B
AQSFRC
0x580D
0x584D
0x588D
0x58CD
0x590D
0x594D
1/0
Action Qualifier Software Force
Register
AQCSFRC
0x580E
0x584E
0x588E
0x58CE
0x590E
0x594E
1/1
Action Qualifier Continuous S/W
Force Register Set
DBCTL
0x580F
0x584F
0x588F
0x58CF
0x590F
0x594F
1/1
Dead-Band Generator Control
Register
DBRED
0x5810
0x5850
0x5890
0x58D0
0x5910
0x5950
1/0
Dead-Band Generator Rising Edge
Delay Count Register
DBFED
0x5811
0x5851
0x5891
0x58D1
0x5911
0x5951
1/0
Dead-Band Generator Falling Edge
Delay Count Register
TZSEL
0x5812
0x5852
0x5892
0x58D2
0x5912
0x5952
1/0
Trip Zone Select Register(1)
TZCTL
0x5814
0x5854
0x5894
0x58D4
0x5914
0x5954
1/0
Trip Zone Control Register(1)
TZEINT
0x5815
0x5855
0x5895
0x58D5
0x5915
0x5955
1/0
Trip Zone Enable Interrupt Register(1)
TZFLG
0x5816
0x5856
0x5896
0x58D6
0x5916
0x5956
1/0
Trip Zone Flag Register
TZCLR
0x5817
0x5857
0x5897
0x58D7
0x5917
0x5957
1/0
Trip Zone Clear Register(1)
TZFRC
0x5818
0x5858
0x5898
0x58D8
0x5918
0x5958
1/0
Trip Zone Force Register(1)
ETSEL
0x5819
0x5859
0x5899
0x58D9
0x5919
0x5959
1/0
Event Trigger Selection Register
ETPS
0x581A
0x585A
0x589A
0x58DA
0x591A
0x595A
1/0
Event Trigger Prescale Register
ETFLG
0x581B
0x585B
0x589B
0x58DB
0x591B
0x595B
1/0
Event Trigger Flag Register
ETCLR
0x581C
0x585C
0x589C
0x58DC
0x591C
0x595C
1/0
Event Trigger Clear Register
ETFRC
0x581D
0x585D
0x589D
0x58DD
0x591D
0x595D
1/0
Event Trigger Force Register
PCCTL
0x581E
0x585E
0x589E
0x58DE
0x591E
0x595E
1/0
PWM Chopper Control Register
HRCNFG
0x5820
0x5860
0x58A0
058E0
0x5920
0x5960
1/0
HRPWM Configuration Register(1)
NAME
(1)
DESCRIPTION
Registers that are EALLOW protected.
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121
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Time−base (TB)
Sync
in/out
select
Mux
CTR=ZERO
CTR=CMPB
Disabled
TBPRD shadow (16)
TBPRD active (16)
CTR=PRD
EPWMxSYNCO
TBCTL[SYNCOSEL]
TBCTL[PHSEN]
EPWMxSYNCI
Counter
up/down
(16 bit)
CTR=ZERO
CTR_Dir
TBCTR
active (16)
TBPHSHR (8)
16
8
TBPHS active (24)
Phase
control
Counter compare (CC)
CTR=CMPA
CMPAHR (8)
16
TBCTL[SWFSYNC]
(software forced sync)
Action
qualifier
(AQ)
CTR = PRD
CTR = ZERO
CTR = CMPA
CTR = CMPB
CTR_Dir
8
Event
trigger
and
interrupt
(ET)
EPWMxINT
EPWMxSOCA
EPWMxSOCB
HRPWM
CMPA active (24)
EPWMxAO
EPWMA
CMPA shadow (24)
CTR=CMPB
Dead
band
(DB)
16
PWM
chopper
(PC)
EPWMxBO
EPWMB
CMPB active (16)
CMPB shadow (16)
Trip
zone
(TZ)
EPWMxTZINT
CTR = ZERO
TZ1 to TZ6
Figure 8-5. ePWM Submodules Showing Critical Internal Signal Interconnections
8.2.4 High-Resolution PWM (HRPWM)
The HRPWM module offers PWM resolution (time granularity) which is significantly better than what can be
achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are:
• Significantly extends the time resolution capabilities of conventionally derived digital PWM
• Typically used when effective PWM resolution falls below approximately 9 or 10 bits. This occurs at PWM
frequencies greater than approximately 200 kHz when using a CPU/System clock of 100 MHz.
• This capability can be used in both duty cycle and phase-shift control methods.
• Finer time granularity control or edge positioning is controlled through extensions to the Compare A and
Phase registers of the ePWM module.
• HRPWM capabilities are offered only on the A signal path of an ePWM module (that is, on the EPWMxA
output). EPWMxB output has conventional PWM capabilities.
122
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
8.2.5 Enhanced CAP Modules
The 2833x/2823x device contains up to six enhanced capture (eCAP) modules (eCAP1 to eCAP6). Figure 8-6
shows a functional block diagram of a module.
SYNC
CTRPHS
(Phase Register - 32-bit)
SYNCIn
SYNCOut
TSCTR
(Counter - 32-bit)
APWM Mode
CTR_OVF
OVF
RST
Delta Mode
CTR [0-31]
PRD [0-31]
PWM
Compare
Logic
CMP [0-31]
32
CTR=PRD
CTR [0-31]
CTR=CMP
32
CAP1
(APRD Active)
APRD
Shadow
32
32
32
LD1
Polarity
Select
CMP [0-31]
CAP2
(ACMP Active)
32
LD
MODE SELECT
32
PRD [0-31]
LD
32
CAP3
(APRD Shadow)
LD
32
CAP4
(ACMP Shadow)
LD
Polarity
Select
LD2
Event
Qualifier
ACMP
Shadow
eCAPx
Event
Prescale
LD3
Polarity
Select
LD4
Polarity
Select
4
Capture Events
4
CEVT[1:4]
to PIE
Interrupt
Trigger
and
Flag
Control
CTR_OVF
Continuous/
One-Shot
Capture Control
CTR=PRD
CTR=CMP
Figure 8-6. eCAP Functional Block Diagram
Copyright © 2022 Texas Instruments Incorporated
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123
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
The eCAP modules are clocked at the SYSCLKOUT rate.
The clock enable bits (ECAP1ENCLK, ECAP2ENCLK, ECAP3ENCLK, ECAP4ENCLK, ECAP5ENCLK,
ECAP6ENCLK) in the PCLKCR1 register are used to turn off the eCAP modules individually (for low power
operation). Upon reset, ECAP1ENCLK, ECAP2ENCLK, ECAP3ENCLK, ECAP4ENCLK, ECAP5ENCLK, and
ECAP6ENCLK are set to low, indicating that the peripheral clock is off.
Table 8-6. eCAP Control and Status Registers
eCAP1
eCAP2
eCAP3
eCAP4
eCAP5
eCAP6
SIZE
(x16)
TSCTR
0x6A00
0x6A20
0x6A40
0x6A60
0x6A80
0x6AA0
2
Timestamp Counter
CTRPHS
0x6A02
0x6A22
0x6A42
0x6A62
0x6A82
0x6AA2
2
Counter Phase Offset Value Register
CAP1
0x6A04
0x6A24
0x6A44
0x6A64
0x6A84
0x6AA4
2
Capture 1 Register
CAP2
0x6A06
0x6A26
0x6A46
0x6A66
0x6A86
0x6AA6
2
Capture 2 Register
NAME
DESCRIPTION
CAP3
0x6A08
0x6A28
0x6A48
0x6A68
0x6A88
0x6AA8
2
Capture 3 Register
CAP4
0x6A0A
0x6A2A
0x6A4A
0x6A6A
0x6A8A
0x6AAA
2
Capture 4 Register
Reserved
0x6A0C0x6A12
0x6A2C-0x6
A32
0x6A4C0x6A52
0x6A6C0x6A72
0x6A8C-0
x6A92
0x6AAC0x6AB2
8
Reserved
ECCTL1
0x6A14
0x6A34
0x6A54
0x6A74
0x6A94
0x6AB4
1
Capture Control Register 1
ECCTL2
0x6A15
0x6A35
0x6A55
0x6A75
0x6A95
0x6AB5
1
Capture Control Register 2
ECEINT
0x6A16
0x6A36
0x6A56
0x6A76
0x6A96
0x6AB6
1
Capture Interrupt Enable Register
ECFLG
0x6A17
0x6A37
0x6A57
0x6A77
0x6A97
0x6AB7
1
Capture Interrupt Flag Register
ECCLR
0x6A18
0x6A38
0x6A58
0x6A78
0x6A98
0x6AB8
1
Capture Interrupt Clear Register
ECFRC
0x6A19
0x6A39
0x6A59
0x6A79
0x6A99
0x6AB9
1
Capture Interrupt Force Register
Reserved
0x6A1A0x6A1F
0x6A3A0x6A3F
0x6A5A0x6A5F
0x6A7A0x6A7F
0x6A9A-0x 0x6ABA6A9F
0x6ABF
6
Reserved
124
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8.2.6 Enhanced QEP Modules
The device contains up to two enhanced quadrature encoder (eQEP) modules (eQEP1, eQEP2). Figure 8-7
shows the block diagram of the eQEP module.
System Control
Registers
To CPU
EQEPxENCLK
Data Bus
SYSCLKOUT
QCPRD
QCAPCTL
QCTMR
16
16
16
Quadrature
Capture
Unit
(QCAP)
QCTMRLAT
QCPRDLAT
Registers
Used by
Multiple Units
QUTMR
QWDTMR
QUPRD
QWDPRD
32
16
QEPCTL
QEPSTS
UTOUT
UTIME
QFLG
QWDOG
QDECCTL
16
WDTOUT
PIE
QCLK
EQEPxINT
QDIR
16
QI
Position Counter/
Control Unit
(PCCU)
QPOSLAT
QS Quadrature
Decoder
PHE
(QDU)
PCSOUT
QPOSSLAT
QPOSILAT
EQEPxAIN
EQEPxA/XCLK
EQEPxBIN
EQEPxIIN
EQEPxB/XDIR
EQEPxIOUT
EQEPxIOE
GPIO
MUX
EQEPxSIN
EQEPxSOUT
EQEPxSOE
32
32
QPOSCNT
QPOSCMP
EQEPxI
EQEPxS
16
QEINT
QFRC
QPOSINIT
QPOSMAX
QCLR
QPOSCTL
Enhanced QEP (eQEP) Peripheral
Figure 8-7. eQEP Functional Block Diagram
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Table 8-7 provides a summary of the eQEP registers.
Table 8-7. eQEP Control and Status Registers
eQEP1
ADDRESS
eQEP2
ADDRESS
eQEP1
SIZE(x16)/
#SHADOW
QPOSCNT
0x6B00
0x6B40
2/0
eQEP Position Counter
QPOSINIT
0x6B02
0x6B42
2/0
eQEP Initialization Position Count
QPOSMAX
0x6B04
0x6B44
2/0
eQEP Maximum Position Count
QPOSCMP
0x6B06
0x6B46
2/1
eQEP Position-compare
NAME
REGISTER DESCRIPTION
QPOSILAT
0x6B08
0x6B48
2/0
eQEP Index Position Latch
QPOSSLAT
0x6B0A
0x6B4A
2/0
eQEP Strobe Position Latch
QPOSLAT
0x6B0C
0x6B4C
2/0
eQEP Position Latch
QUTMR
0x6B0E
0x6B4E
2/0
eQEP Unit Timer
QUPRD
0x6B10
0x6B50
2/0
eQEP Unit Period Register
QWDTMR
0x6B12
0x6B52
1/0
eQEP Watchdog Timer
QWDPRD
0x6B13
0x6B53
1/0
eQEP Watchdog Period Register
QDECCTL
0x6B14
0x6B54
1/0
eQEP Decoder Control Register
QEPCTL
0x6B15
0x6B55
1/0
eQEP Control Register
QCAPCTL
0x6B16
0x6B56
1/0
eQEP Capture Control Register
QPOSCTL
0x6B17
0x6B57
1/0
eQEP Position-compare Control Register
QEINT
0x6B18
0x6B58
1/0
eQEP Interrupt Enable Register
QFLG
0x6B19
0x6B59
1/0
eQEP Interrupt Flag Register
QCLR
0x6B1A
0x6B5A
1/0
eQEP Interrupt Clear Register
QFRC
0x6B1B
0x6B5B
1/0
eQEP Interrupt Force Register
QEPSTS
0x6B1C
0x6B5C
1/0
eQEP Status Register
QCTMR
0x6B1D
0x6B5D
1/0
eQEP Capture Timer
QCPRD
0x6B1E
0x6B5E
1/0
eQEP Capture Period Register
QCTMRLAT
0x6B1F
0x6B5F
1/0
eQEP Capture Timer Latch
0x6B20
0x6B60
1/0
eQEP Capture Period Latch
0x6B21 –
0x6B3F
0x6B61 –
0x6B7F
31/0
QCPRDLAT
Reserved
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8.2.7 Analog-to-Digital Converter (ADC) Module
A simplified functional block diagram of the ADC module is shown in Figure 8-8. The ADC module consists of a
12-bit ADC with a built-in sample-and-hold (S/H) circuit. Functions of the ADC module include:
•
•
•
•
•
•
•
12-bit ADC core with built-in S/H
Analog input: 0.0 V to 3.0 V (Voltages above 3.0 V produce full-scale conversion results.)
Fast conversion rate: Up to 80 ns at 25-MHz ADC clock, 12.5 MSPS
16 dedicated ADC channels. 8 channels multiplexed per Sample/Hold
Autosequencing capability provides up to 16 "autoconversions" in a single session. Each conversion can be
programmed to select any 1 of 16 input channels
Sequencer can be operated as two independent 8-state sequencers or as one large 16-state sequencer (that
is, two cascaded 8-state sequencers)
Sixteen result registers (individually addressable) to store conversion values
– The digital value of the input analog voltage is derived by:
, when ADCIN £ ADCLO
Digital Value = 0
(
Digital Value = floor 4096 ´
•
•
•
•
•
ADCIN - ADCLO
3
(
, when ADCLO < ADCIN < 3 V
, when ADCIN ³ 3 V
Digital Value = 4095
Multiple triggers as sources for the start-of-conversion (SOC) sequence
– S/W - software immediate start
– ePWM start of conversion
– XINT2 ADC start of conversion
Flexible interrupt control allows interrupt request on every end-of-sequence (EOS) or every other EOS.
Sequencer can operate in "start/stop" mode, allowing multiple "time-sequenced triggers" to synchronize
conversions.
SOCA and SOCB triggers can operate independently in dual-sequencer mode.
Sample-and-hold (S/H) acquisition time window has separate prescale control.
The ADC module in the 2833x/2823x devices has been enhanced to provide flexible interface to ePWM
peripherals. The ADC interface is built around a fast, 12-bit ADC module with a fast conversion rate of up
to 80 ns at 25-MHz ADC clock. The ADC module has 16 channels, configurable as two independent 8-channel
modules. The two independent 8-channel modules can be cascaded to form a 16-channel module. Although
there are multiple input channels and two sequencers, there is only one converter in the ADC module. Figure 8-8
shows the block diagram of the ADC module.
The two 8-channel modules have the capability to autosequence a series of conversions, each module has the
choice of selecting any one of the respective eight channels available through an analog MUX. In the cascaded
mode, the autosequencer functions as a single 16-channel sequencer. On each sequencer, once the conversion
is complete, the selected channel value is stored in its respective RESULT register. Autosequencing allows the
system to convert the same channel multiple times, allowing the user to perform oversampling algorithms. This
gives increased resolution over traditional single-sampled conversion results.
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System
Control Block
ADCENCLK
SYSCLKOUT
High-Speed
Prescaler
HALT
DSP
HSPCLK
Analog
MUX
Result Registers
Result Reg 0
ADCINA0
70A8h
Result Reg 1
S/H
ADCINA7
12-Bit
ADC
Module
Result Reg 7
70AFh
Result Reg 8
70B0h
Result Reg 15
70B7h
ADCINB0
S/H
ADCINB7
ADC Control Registers
S/W
EPWMSOCA
GPIO/
XINT2_ADCSOC
SOC
Sequencer 1
Sequencer 2
S/W
SOC
EPWMSOCB
Figure 8-8. Block Diagram of the ADC Module
To obtain the specified accuracy of the ADC, proper board layout is very critical. To the best extent possible,
traces leading to the ADCIN pins should not run in close proximity to the digital signal paths. This is to minimize
switching noise on the digital lines from getting coupled to the ADC inputs. Furthermore, proper isolation
techniques must be used to isolate the ADC module power pins ( VDD1A18, VDD2A18 , VDDA2, VDDAIO) from the
digital supply.Figure 8-9 shows the ADC pin connections for the devices.
Note
1. The ADC registers are accessed at the SYSCLKOUT rate. The internal timing of the ADC module
is controlled by the high-speed peripheral clock (HSPCLK).
2. The behavior of the ADC module based on the state of the ADCENCLK and HALT signals is as
follows:
• ADCENCLK: On reset, this signal will be low. While reset is active-low ( XRS) the clock to the
register will still function. This is necessary to make sure all registers and modes go into their
default reset state. The analog module, however, will be in a low-power inactive state. As soon
as reset goes high, then the clock to the registers will be disabled. When the user sets the
ADCENCLK signal high, then the clocks to the registers will be enabled and the analog module
will be enabled. There will be a certain time delay (ms range) before the ADC is stable and can
be used.
• HALT: This mode only affects the analog module. It does not affect the registers. In this mode,
the ADC module goes into low-power mode. This mode also will stop the clock to the CPU,
which will stop the HSPCLK; therefore, the ADC register logic will be turned off indirectly.
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Figure 8-9 shows the ADC pin-biasing for internal reference and Figure 8-10 shows the ADC pin-biasing for
external reference.
ADC 16-Channel Analog Inputs
ADCINA[7:0]
ADCINB[7:0]
ADCLO
ADCREFIN
Analog input 0−3 V with respect to ADCLO
Connect to analog ground
Connect to analog ground if internal reference is used
22 k
ADC External Current Bias Resistor ADCRESEXT
(A)
ADC Reference Positive Output
ADC Reference Medium Output
ADCREFP
ADCREFM
VDD1A18
VDD2A18
VSS1AGND
VSS2AGND
Reference I/O Power
A.
B.
C.
2.2 μF
(A)
2.2 μF
ADCREFP and ADCREFM should not
be loaded by external circuitry
ADC Analog Power Pin (1.9 V/1.8 V)
ADC Analog Power Pin (1.9 V/1.8 V)
ADC Analog Ground Pin
ADC Analog Ground Pin
VDDA2
VSSA2
ADC Analog Power Pin (3.3 V)
VDDAIO
VSSAIO
ADC Analog Power Pin (3.3 V)
ADC Analog I/O Ground Pin
ADC Analog Ground Pin
TAIYO YUDEN LMK212BJ225MG-T or equivalent
External decoupling capacitors are recommended on all power pins.
Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
Figure 8-9. ADC Pin Connections With Internal Reference
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ADC 16-Channel Analog Inputs
ADCINA[7:0]
ADCINB[7:0]
ADCLO
ADCREFIN
ADC External Current Bias Resistor
ADCRESEXT
ADC Reference Positive Output
ADCREFP
ADC Reference Medium Output
ADCREFM
Analog input 0-3 V with respect to ADCLO
Connect to Analog Ground
(D)
Connect to 1.500, 1.024, or 2.048-V precision source
22 k
(A)
2.2 μF
(A)
2.2 μF
VDD1A18
VDD2A18
ADC Analog Power Pin (1.9 V/1.8 V)
ADC Analog Power Pin (1.9 V/1.8 V)
ADC Analog Ground Pin
ADC Analog Ground Pin
VSS1AGND
VSS2AGND
Reference I/O Power
A.
B.
C.
D.
ADCREFP and ADCREFM should not
be loaded by external circuitry
VDDA2
VSSA2
ADC Analog Power Pin (3.3 V)
ADC Analog Ground Pin
VDDAIO
VSSAIO
ADC Analog Power Pin (3.3 V)
ADC Analog I/O Ground Pin
TAIYO YUDEN LMK212BJ225MG-T or equivalent
External decoupling capacitors are recommended on all power pins.
Analog inputs must be driven from an operational amplifier that does not degrade the ADC performance.
External voltage on ADCREFIN is enabled by changing bits 15:14 in the ADC Reference Select register depending on the voltage used
on this pin. TI recommends TI part REF3020 or equivalent for 2.048-V generation. Overall gain accuracy will be determined by accuracy
of this voltage source.
Figure 8-10. ADC Pin Connections With External Reference
Note
The temperature rating of any recommended component must match the rating of the end product.
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8.2.7.1 ADC Connections if the ADC Is Not Used
It is recommended to keep the connections for the analog power pins, even if the ADC is not used. Following is a
summary of how the ADC pins should be connected, if the ADC is not used in an application:
• VDD1A18/VDD2A18 – Connect to VDD
• VDDA2, VDDAIO – Connect to VDDIO
• VSS1AGND/VSS2AGND, VSSA2, VSSAIO – Connect to VSS
• ADCLO – Connect to VSS
• ADCREFIN – Connect to VSS
• ADCREFP/ADCREFM – Connect a 100-nF cap to VSS
• ADCRESEXT – Connect a 20-kΩ resistor (very loose tolerance) to VSS.
• ADCINAn, ADCINBn – Connect to VSS
When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power savings.
When the ADC module is used in an application, unused ADC input pins should be connected to analog ground
(VSS1AGND/VSS2AGND)
Note
ADC parameters for gain error and offset error are specified only if the ADC calibration routine is
executed from the Boot ROM. See Section 8.2.7.3 for more information.
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8.2.7.2 ADC Registers
The ADC operation is configured, controlled, and monitored by the registers listed in Table 8-8.
Table 8-8. ADC Registers
NAME
ADDRESS(1)
ADDRESS(2)
ADCTRL1
0x7100
1
ADC Control Register 1
SIZE (x16)
DESCRIPTION
ADCTRL2
0x7101
1
ADC Control Register 2
ADCMAXCONV
0x7102
1
ADC Maximum Conversion Channels Register
ADCCHSELSEQ1
0x7103
1
ADC Channel Select Sequencing Control Register 1
ADCCHSELSEQ2
0x7104
1
ADC Channel Select Sequencing Control Register 2
ADCCHSELSEQ3
0x7105
1
ADC Channel Select Sequencing Control Register 3
ADCCHSELSEQ4
0x7106
1
ADC Channel Select Sequencing Control Register 4
ADCASEQSR
0x7107
1
ADC Auto-Sequence Status Register
ADCRESULT0
0x7108
0x0B00
1
ADC Conversion Result Buffer Register 0
ADCRESULT1
0x7109
0x0B01
1
ADC Conversion Result Buffer Register 1
ADCRESULT2
0x710A
0x0B02
1
ADC Conversion Result Buffer Register 2
ADCRESULT3
0x710B
0x0B03
1
ADC Conversion Result Buffer Register 3
ADCRESULT4
0x710C
0x0B04
1
ADC Conversion Result Buffer Register 4
ADCRESULT5
0x710D
0x0B05
1
ADC Conversion Result Buffer Register 5
ADCRESULT6
0x710E
0x0B06
1
ADC Conversion Result Buffer Register 6
ADCRESULT7
0x710F
0x0B07
1
ADC Conversion Result Buffer Register 7
ADCRESULT8
0x7110
0x0B08
1
ADC Conversion Result Buffer Register 8
ADCRESULT9
0x7111
0x0B09
1
ADC Conversion Result Buffer Register 9
ADCRESULT10
0x7112
0x0B0A
1
ADC Conversion Result Buffer Register 10
ADCRESULT11
0x7113
0x0B0B
1
ADC Conversion Result Buffer Register 11
ADCRESULT12
0x7114
0x0B0C
1
ADC Conversion Result Buffer Register 12
ADCRESULT13
0x7115
0x0B0D
1
ADC Conversion Result Buffer Register 13
ADCRESULT14
0x7116
0x0B0E
1
ADC Conversion Result Buffer Register 14
ADCRESULT15
0x7117
0x0B0F
1
ADC Conversion Result Buffer Register 15
ADCTRL3
0x7118
1
ADC Control Register 3
ADCST
0x7119
1
ADC Status Register
Reserved
0x711A –
0x711B
2
(1)
(2)
132
ADCREFSEL
0x711C
1
ADC Reference Select Register
ADCOFFTRIM
0x711D
1
ADC Offset Trim Register
Reserved
0x711E –
0x711F
2
The registers in this column are Peripheral Frame 2 Registers.
The ADC result registers are dual mapped. Locations in Peripheral Frame 2 (0x7108–0x7117) are 2 wait-states and left justified.
Locations in Peripheral frame 0 space (0x0B00–0x0B0F) are 1 wait-state for CPU accesses and 0 wait state for DMA accesses and
right justified. During high speed/continuous conversion use of the ADC, use the 0 wait-state locations for fast transfer of ADC results
to user memory.
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8.2.7.3 ADC Calibration
The ADC_cal() routine is programmed into TI reserved OTP memory by the factory. The boot ROM automatically
calls the ADC_cal() routine to initialize the ADCREFSEL and ADCOFFTRIM registers with device specific
calibration data. During normal operation, this process occurs automatically and no action is required by the
user.
If the boot ROM is bypassed by Code Composer Studio during the development process, then ADCREFSEL
and ADCOFFTRIM must be initialized by the application. Methods for calling the ADC_cal() routine from
an application are described in the Analog-to-Digital Converter (ADC) chapter of the TMS320x2833x,
TMS320x2823x Real-Time Microcontrollers Technical Reference Manual.
CAUTION
FAILURE TO INITIALIZE THESE REGISTERS WILL CAUSE THE ADC TO FUNCTION OUT OF
SPECIFICATION.
If the system is reset or the ADC module is reset using Bit 14 (RESET) from the ADC Control
Register 1, the routine must be repeated.
8.2.8 Multichannel Buffered Serial Port (McBSP) Module
The McBSP module has the following features:
•
•
•
•
•
•
•
•
•
•
•
•
•
Compatible to McBSP in TMS320C54x/TMS320C55x DSP devices
Full-duplex communication
Double-buffered data registers that allow a continuous data stream
Independent framing and clocking for receive and transmit
External shift clock generation or an internal programmable frequency shift clock
A wide selection of data sizes including 8, 12, 16, 20, 24, or 32 bits
8-bit data transfers with LSB or MSB first
Programmable polarity for both frame synchronization and data clocks
Highly programmable internal clock and frame generation
Direct interface to industry-standard CODECs, Analog Interface Chips (AICs), and other serially connected
A/D and D/A devices
Works with SPI-compatible devices
The following application interfaces can be supported on the McBSP:
– T1/E1 framers
– IOM-2 compliant devices
– AC97-compliant devices (the necessary multiphase frame synchronization capability is provided.)
– IIS-compliant devices
– SPI
McBSP clock rate,
CLKG =
CLKSRG
(1 + CLKGDV )
where CLKSRG source could be LSPCLK, CLKX, or CLKR. Serial port performance is limited by I/O buffer
switching speed. Internal prescalers must be adjusted such that the peripheral speed is less than the I/O
buffer speed limit.
Note
See Section 7 for maximum I/O pin toggling speed.
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TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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Figure 8-11 shows the block diagram of the McBSP module.
TX
Interrupt
MXINT
To CPU
Peripheral Write Bus
CPU
TX Interrupt Logic
16
McBSP Transmit
Interrupt Select Logic
16
DXR2 Transmit Buffer
LSPCLK
DXR1 Transmit Buffer
MFSXx
16
16
MCLKXx
DMA Bus
Peripheral Bus
CPU
Bridge
Compand Logic
XSR2
XSR1
MDXx
RSR2
RSR1
MDRx
16
MCLKRx
16
Expand Logic
MFSRx
RBR2 Register
McBSP Receive
Interrupt Select Logic
MRINT
RX Interrupt Logic
RBR1 Register
16
16
DRR2 Receive Buffer
DRR1 Receive Buffer
16
RX
Interrupt
16
Peripheral Read Bus
CPU
To CPU
Figure 8-11. McBSP Module
134
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 8-9 provides a summary of the McBSP registers.
Table 8-9. McBSP Register Summary
NAME
McBSP-A
ADDRESS
McBSP-B
ADDRESS
TYPE
RESET VALUE
DESCRIPTION
Data Registers, Receive, Transmit
DRR2
0x5000
0x5040
R
0x0000
McBSP Data Receive Register 2
DRR1
0x5001
0x5041
R
0x0000
McBSP Data Receive Register 1
DXR2
0x5002
0x5042
W
0x0000
McBSP Data Transmit Register 2
DXR1
0x5003
0x5043
W
0x0000
McBSP Data Transmit Register 1
SPCR2
0x5004
0x5044
R/W
0x0000
McBSP Serial Port Control Register 2
SPCR1
0x5005
0x5045
R/W
0x0000
McBSP Serial Port Control Register 1
RCR2
0x5006
0x5046
R/W
0x0000
McBSP Receive Control Register 2
RCR1
0x5007
0x5047
R/W
0x0000
McBSP Receive Control Register 1
XCR2
0x5008
0x5048
R/W
0x0000
McBSP Transmit Control Register 2
McBSP Control Registers
XCR1
0x5009
0x5049
R/W
0x0000
McBSP Transmit Control Register 1
SRGR2
0x500A
0x504A
R/W
0x0000
McBSP Sample Rate Generator Register 2
SRGR1
0x500B
0x504B
R/W
0x0000
McBSP Sample Rate Generator Register 1
Multichannel Control Registers
MCR2
0x500C
0x504C
R/W
0x0000
McBSP Multichannel Register 2
MCR1
0x500D
0x504D
R/W
0x0000
McBSP Multichannel Register 1
RCERA
0x500E
0x504E
R/W
0x0000
McBSP Receive Channel Enable Register Partition A
RCERB
0x500F
0x504F
R/W
0x0000
McBSP Receive Channel Enable Register Partition B
XCERA
0x5010
0x5050
R/W
0x0000
McBSP Transmit Channel Enable Register Partition A
XCERB
0x5011
0x5051
R/W
0x0000
McBSP Transmit Channel Enable Register Partition B
PCR
0x5012
0x5052
R/W
0x0000
McBSP Pin Control Register
RCERC
0x5013
0x5053
R/W
0x0000
McBSP Receive Channel Enable Register Partition C
RCERD
0x5014
0x5054
R/W
0x0000
McBSP Receive Channel Enable Register Partition D
XCERC
0x5015
0x5055
R/W
0x0000
McBSP Transmit Channel Enable Register Partition C
XCERD
0x5016
0x5056
R/W
0x0000
McBSP Transmit Channel Enable Register Partition D
RCERE
0x5017
0x5057
R/W
0x0000
McBSP Receive Channel Enable Register Partition E
RCERF
0x5018
0x5058
R/W
0x0000
McBSP Receive Channel Enable Register Partition F
XCERE
0x5019
0x5059
R/W
0x0000
McBSP Transmit Channel Enable Register Partition E
XCERF
0x501A
0x505A
R/W
0x0000
McBSP Transmit Channel Enable Register Partition F
RCERG
0x501B
0x505B
R/W
0x0000
McBSP Receive Channel Enable Register Partition G
RCERH
0x501C
0x505C
R/W
0x0000
McBSP Receive Channel Enable Register Partition H
XCERG
0x501D
0x505D
R/W
0x0000
McBSP Transmit Channel Enable Register Partition G
XCERH
0x501E
0x505E
R/W
0x0000
McBSP Transmit Channel Enable Register Partition H
MFFINT
0x5023
0x5063
R/W
0x0000
McBSP Interrupt Enable Register
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8.2.9 Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
The CAN module has the following features:
• Fully compliant with ISO 11898-1 (CAN 2.0B)
• Supports data rates up to 1 Mbps
• Thirty-two mailboxes, each with the following properties:
– Configurable as receive or transmit
– Configurable with standard or extended identifier
– Has a programmable receive mask
– Supports data and remote frame
– Composed of 0 to 8 bytes of data
– Uses a 32-bit timestamp on receive and transmit message
– Protects against reception of new message
– Holds the dynamically programmable priority of transmit message
– Employs a programmable interrupt scheme with two interrupt levels
– Employs a programmable alarm on transmission or reception time-out
• Low-power mode
• Programmable wake-up on bus activity
• Automatic reply to a remote request message
• Automatic retransmission of a frame in case of loss of arbitration or error
• 32-bit local network time counter synchronized by a specific message (communication in conjunction with
mailbox 16)
• Self-test mode
– Operates in a loopback mode receiving its own message. A "dummy" acknowledge is provided, thereby
eliminating the need for another node to provide the acknowledge bit.
Note
For a SYSCLKOUT of 100 MHz, the smallest bit rate possible is 7.812 kbps.
For a SYSCLKOUT of 150 MHz, the smallest bit rate possible is 11.719 kbps.
The F2833x/F2823x CAN has passed the conformance test per ISO/DIS 16845. Contact TI for test report and
exceptions.
136
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
eCAN0INT
eCAN1INT
Controls Address
Data
Enhanced CAN Controller
32
Message Controller
Mailbox RAM
(512 Bytes)
32-Message Mailbox
of 4 x 32-Bit Words
Memory Management
Unit
32
CPU Interface,
Receive Control Unit,
Timer Management Unit
32
eCAN Memory
(512 Bytes)
Registers and
Message Objects Control
32
eCAN Protocol Kernel
Receive Buffer
Transmit Buffer
Control Buffer
Status Buffer
SN65HVD23x
3.3-V CAN Transceiver
CAN Bus
Figure 8-12. eCAN Block Diagram and Interface Circuit
Table 8-10. 3.3-V eCAN Transceivers
PART NUMBER
SUPPLY
VOLTAGE
LOW-POWER
MODE
SLOPE
CONTROL
VREF
OTHER
TA
SN65HVD230
3.3 V
Standby
Adjustable
Yes
–
–40°C to 85°C
SN65HVD230Q
3.3 V
Standby
Adjustable
Yes
–
–40°C to 125°C
SN65HVD231
3.3 V
Sleep
Adjustable
Yes
–
–40°C to 85°C
SN65HVD231Q
3.3 V
Sleep
Adjustable
Yes
–
–40°C to 125°C
SN65HVD232
3.3 V
None
None
None
–
–40°C to 85°C
SN65HVD232Q
3.3 V
None
None
None
–
–40°C to 125°C
SN65HVD233
3.3 V
Standby
Adjustable
None
Diagnostic
Loopback
–40°C to 125°C
SN65HVD234
3.3 V
Standby and Sleep
Adjustable
None
–
–40°C to 125°C
SN65HVD235
3.3 V
Standby
Adjustable
None
Autobaud
Loopback
–40°C to 125°C
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137
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
eCAN-A Control and Status Registers
Mailbox Enable - CANME
Mailbox Direction - CANMD
Transmission Request Set - CANTRS
Transmission Request Reset - CANTRR
Transmission Acknowledge - CANTA
Abort Acknowledge - CANAA
eCAN-A Memory (512 Bytes)
6000h
Received Message Pending - CANRMP
Control and Status Registers
603Fh
6040h
607Fh
6080h
60BFh
60C0h
60FFh
Received Message Lost - CANRML
Remote Frame Pending - CANRFP
Local Acceptance Masks (LAM)
(32 x 32-Bit RAM)
Global Acceptance Mask - CANGAM
Message Object Timestamps (MOTS)
(32 x 32-Bit RAM)
Bit-Timing Configuration - CANBTC
Master Control - CANMC
Error and Status - CANES
Message Object Time-Out (MOTO)
(32 x 32-Bit RAM)
Transmit Error Counter - CANTEC
Receive Error Counter - CANREC
Global Interrupt Flag 0 - CANGIF0
Global Interrupt Mask - CANGIM
Global Interrupt Flag 1 - CANGIF1
eCAN-A Memory RAM (512 Bytes)
6100h-6107h
Mailbox 0
6108h-610Fh
Mailbox 1
6110h-6117h
Mailbox 2
6118h-611Fh
Mailbox 3
6120h-6127h
Mailbox 4
Mailbox Interrupt Mask - CANMIM
Mailbox Interrupt Level - CANMIL
Overwrite Protection Control - CANOPC
TX I/O Control - CANTIOC
RX I/O Control - CANRIOC
Timestamp Counter - CANTSC
Time-Out Control - CANTOC
Time-Out Status - CANTOS
61E0h-61E7h
Mailbox 28
61E8h-61EFh
Mailbox 29
61F0h-61F7h
Mailbox 30
61F8h-61FFh
Mailbox 31
Reserved
Message Mailbox (16 Bytes)
61E8h-61E9h
Message Identifier - MSGID
61EAh-61EBh
Message Control - MSGCTRL
61ECh-61EDh
Message Data Low - MDL
61EEh-61EFh
Message Data High - MDH
Figure 8-13. eCAN-A Memory Map
Note
If the eCAN module is not used in an application, the RAM available (LAM, MOTS, MOTO, and
mailbox RAM) can be used as general-purpose RAM. The CAN module clock should be enabled for
this.
138
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TMS320F28332, TMS320F28235, TMS320F28235-Q1
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eCAN-B Control and Status Registers
Mailbox Enable - CANME
Mailbox Direction - CANMD
Transmission Request Set - CANTRS
Transmission Request Reset - CANTRR
Transmission Acknowledge - CANTA
Abort Acknowledge - CANAA
eCAN-B Memory (512 Bytes)
6200h
Received Message Pending - CANRMP
Control and Status Registers
623Fh
6240h
627Fh
6280h
62BFh
62C0h
62FFh
Received Message Lost - CANRML
Remote Frame Pending - CANRFP
Local Acceptance Masks (LAM)
(32 x 32-Bit RAM)
Global Acceptance Mask - CANGAM
Message Object Timestamps (MOTS)
(32 x 32-Bit RAM)
Bit-Timing Configuration - CANBTC
Master Control - CANMC
Error and Status - CANES
Message Object Time-Out (MOTO)
(32 x 32-Bit RAM)
Transmit Error Counter - CANTEC
Receive Error Counter - CANREC
Global Interrupt Flag 0 - CANGIF0
Global Interrupt Mask - CANGIM
Global Interrupt Flag 1 - CANGIF1
eCAN-B Memory RAM (512 Bytes)
6300h-6307h
Mailbox 0
6308h-630Fh
Mailbox 1
6310h-6317h
Mailbox 2
6318h-631Fh
Mailbox 3
6320h-6327h
Mailbox 4
Mailbox Interrupt Mask - CANMIM
Mailbox Interrupt Level - CANMIL
Overwrite Protection Control - CANOPC
TX I/O Control - CANTIOC
RX I/O Control - CANRIOC
Timestamp Counter - CANTSC
Time-Out Control - CANTOC
Time-Out Status - CANTOS
63E0h-63E7h
Mailbox 28
63E8h-63EFh
Mailbox 29
63F0h-63F7h
Mailbox 30
63F8h-63FFh
Mailbox 31
Reserved
Message Mailbox (16 Bytes)
63E8h-63E9h
Message Identifier - MSGID
63EAh-63EBh
Message Control - MSGCTRL
63ECh-63EDh
Message Data Low - MDL
63EEh-63EFh
Message Data High - MDH
Figure 8-14. eCAN-B Memory Map
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The CAN registers listed in Table 8-11 are used by the CPU to configure and control the CAN controller and
the message objects. eCAN control registers only support 32-bit read/write operations. Mailbox RAM can be
accessed as 16 bits or 32 bits. Thirty-two-bit accesses are aligned to an even boundary.
Table 8-11. CAN Register Map
REGISTER
NAME(1)
eCAN-A
ADDRESS
eCAN-B
ADDRESS
SIZE
(x32)
CANME
0x6000
0x6200
1
Mailbox enable
CANMD
0x6002
0x6202
1
Mailbox direction
CANTRS
0x6004
0x6204
1
Transmit request set
CANTRR
0x6006
0x6206
1
Transmit request reset
CANTA
0x6008
0x6208
1
Transmission acknowledge
DESCRIPTION
CANAA
0x600A
0x620A
1
Abort acknowledge
CANRMP
0x600C
0x620C
1
Receive message pending
CANRML
0x600E
0x620E
1
Receive message lost
CANRFP
0x6010
0x6210
1
Remote frame pending
CANGAM
0x6012
0x6212
1
Global acceptance mask
CANMC
0x6014
0x6214
1
Master control
CANBTC
0x6016
0x6216
1
Bit-timing configuration
CANES
0x6018
0x6218
1
Error and status
CANTEC
0x601A
0x621A
1
Transmit error counter
CANREC
0x601C
0x621C
1
Receive error counter
CANGIF0
0x601E
0x621E
1
Global interrupt flag 0
CANGIM
0x6020
0x6220
1
Global interrupt mask
CANGIF1
0x6022
0x6222
1
Global interrupt flag 1
CANMIM
0x6024
0x6224
1
Mailbox interrupt mask
CANMIL
0x6026
0x6226
1
Mailbox interrupt level
CANOPC
0x6028
0x6228
1
Overwrite protection control
CANTIOC
0x602A
0x622A
1
TX I/O control
CANRIOC
0x602C
0x622C
1
RX I/O control
CANTSC
0x602E
0x622E
1
Timestamp counter (Reserved in SCC mode)
CANTOC
0x6030
0x6230
1
Time-out control (Reserved in SCC mode)
CANTOS
0x6032
0x6232
1
Time-out status (Reserved in SCC mode)
(1)
140
These registers are mapped to Peripheral Frame 1.
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8.2.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
The devices include three serial communications interface (SCI) modules. The SCI modules support digital
communications between the CPU and other asynchronous peripherals that use the standard nonreturn-to-zero
(NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its own separate enable and
interrupt bits. Both can be operated independently or simultaneously in the full-duplex mode. To ensure data
integrity, the SCI checks received data for break detection, parity, overrun, and framing errors. The bit rate is
programmable to more than 65000 different speeds through a 16-bit baud-select register.
Features of each SCI module include:
•
Two external pins:
– SCITXD: SCI transmit-output pin
– SCIRXD: SCI receive-input pin
Note
Both pins can be used as GPIO if not used for SCI.
– Baud rate programmable to 64K different rates:
Baud rate =
LSPCLK
(BRR + 1) * 8
when BRR ¹ 0
Baud rate =
LSPCLK
16
when BRR = 0
Note
See Section 7 for maximum I/O pin toggling speed.
•
•
•
•
•
•
•
•
Data-word format
– One start bit
– Data-word length programmable from one to eight bits
– Optional even/odd/no parity bit
– One or two stop bits
Four error-detection flags: parity, overrun, framing, and break detection
Two wake-up multiprocessor modes: idle-line and address bit
Half- or full-duplex operation
Double-buffered receive and transmit functions
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with
status flags.
– Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY
flag (transmitter-shift register is empty)
– Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break
condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
Separate enable bits for transmitter and receiver interrupts (except BRKDT)
NRZ (nonreturn-to-zero) format
Note
All registers in this module are 8-bit registers that are connected to Peripheral Frame 2. When a
register is accessed, the register data is in the lower byte (7-0), and the upper byte (15-8) is read as
zeros. Writing to the upper byte has no effect.
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Enhanced features:
• Auto baud-detect hardware logic
• 16-level transmit/receive FIFO
The SCI port operation is configured and controlled by the registers listed in Table 8-12, Table 8-13, and Table
8-14.
Table 8-12. SCI-A Registers
NAME(1)
ADDRESS
SIZE (x16)
SCICCRA
0x7050
1
SCI-A Communications Control Register
SCICTL1A
0x7051
1
SCI-A Control Register 1
SCIHBAUDA
0x7052
1
SCI-A Baud Register, High Bits
SCILBAUDA
0x7053
1
SCI-A Baud Register, Low Bits
SCICTL2A
0x7054
1
SCI-A Control Register 2
SCIRXSTA
0x7055
1
SCI-A Receive Status Register
SCIRXEMUA
0x7056
1
SCI-A Receive Emulation Data Buffer Register
SCIRXBUFA
0x7057
1
SCI-A Receive Data Buffer Register
SCITXBUFA
0x7059
1
SCI-A Transmit Data Buffer Register
SCIFFTXA(2)
0x705A
1
SCI-A FIFO Transmit Register
SCIFFRXA(2)
0x705B
1
SCI-A FIFO Receive Register
SCIFFCTA(2)
0x705C
1
SCI-A FIFO Control Register
SCIPRIA
0x705F
1
SCI-A Priority Control Register
(1)
(2)
DESCRIPTION
Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.
These registers are new registers for the FIFO mode.
Table 8-13. SCI-B Registers
NAME(1)
ADDRESS
SIZE (x16)
SCICCRB
0x7750
1
SCI-B Communications Control Register
SCICTL1B
0x7751
1
SCI-B Control Register 1
SCIHBAUDB
0x7752
1
SCI-B Baud Register, High Bits
SCILBAUDB
0x7753
1
SCI-B Baud Register, Low Bits
SCICTL2B
0x7754
1
SCI-B Control Register 2
SCIRXSTB
0x7755
1
SCI-B Receive Status Register
SCIRXEMUB
0x7756
1
SCI-B Receive Emulation Data Buffer Register
SCIRXBUFB
0x7757
1
SCI-B Receive Data Buffer Register
SCITXBUFB
0x7759
1
SCI-B Transmit Data Buffer Register
SCIFFTXB(2)
0x775A
1
SCI-B FIFO Transmit Register
SCIFFRXB(2)
0x775B
1
SCI-B FIFO Receive Register
SCIFFCTB(2)
0x775C
1
SCI-B FIFO Control Register
SCIPRIB
0x775F
1
SCI-B Priority Control Register
(1)
(2)
142
DESCRIPTION
Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.
These registers are new registers for the FIFO mode.
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Table 8-14. SCI-C Registers
NAME(1)
ADDRESS
SIZE (x16)
SCICCRC
0x7770
1
SCI-C Communications Control Register
SCICTL1C
0x7771
1
SCI-C Control Register 1
SCIHBAUDC
0x7772
1
SCI-C Baud Register, High Bits
SCILBAUDC
0x7773
1
SCI-C Baud Register, Low Bits
SCICTL2C
0x7774
1
SCI-C Control Register 2
SCIRXSTC
0x7775
1
SCI-C Receive Status Register
SCIRXEMUC
0x7776
1
SCI-C Receive Emulation Data Buffer Register
SCIRXBUFC
0x7777
1
SCI-C Receive Data Buffer Register
SCITXBUFC
0x7779
1
SCI-C Transmit Data Buffer Register
SCIFFTXC(2)
0x777A
1
SCI-C FIFO Transmit Register
SCIFFRXC(2)
0x777B
1
SCI-C FIFO Receive Register
SCIFFCTC(2)
0x777C
1
SCI-C FIFO Control Register
SCIPRC
0x777F
1
SCI-C Priority Control Register
(1)
(2)
DESCRIPTION
Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.
These registers are new registers for the FIFO mode.
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Figure 8-15 shows the SCI module block diagram.
TXENA
SCICTL1.1
TXSHF
Register
Frame
Format and Mode
SCITXD
8
Parity
Even/Odd
0
TXEMPTY
1
SCICCR.6
SCICTL2.6
8
Enable
TX FIFO_0
SCICCR.5
88
TX FIFO_1
TX Interrupt
Logic
TX FIFO Interrupts
TXINT
To CPU
TX FIFO_N
TXINTENA
8
0
TXWAKE
SCICTL2.0
TXRDY
1
SCICTL2.7
SCICTL1.3
SCI TX Interrupt Select Logic
8
WUT
Transmit Data
Buffer Register
SCITXBUF.7-0
Auto Baud Detect Logic
RXENA
LSPCLK
Baud Rate
MSB/LSB
Registers
SCICTL1.0
RXSHF
Register
SCIHBAUD.15-8
SCIRXD
RXWAKE
8
SCILBAUD.7-0
SCIRXST.1
0
1
8
SCIFFENA
RX FIFO_0
SCIFFTX.14
8
RX FIFO_1
RX FIFO Interrupts
RX Interrupt
Logic
RXINT
To CPU
RX FIFO_N
RXFFOVF
8
0
SCIFFRX.15
1
RXBKINTENA
SCICTL2.1
RXRDY
SCIRXST.6
RXENA
BRKDT
SCICTL1.0
RXERRINTENA
SCIRXST.5
8
SCICTL1.6
SCI RX Interrupt Select Logic
SCIRXST.5-2
Receive Data
Buffer Register
SCIRXBUF.7-0
BRKDT
FE OE PE
RXERROR
SCIRXST.7
Figure 8-15. Serial Communications Interface (SCI) Module Block Diagram
144
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
8.2.11 Serial Peripheral Interface (SPI) Module (SPI-A)
The device includes the four-pin serial peripheral interface (SPI) module. One SPI module (SPI-A) is available.
The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of programmed length (1 to
16 bits) to be shifted into and out of the device at a programmable bit-transfer rate. Normally, the SPI is used for
communications between the MCU controller and external peripherals or another processor. Typical applications
include external I/O or peripheral expansion through devices such as shift registers, display drivers, and ADCs.
Multidevice communications are supported by the master/slave operation of the SPI.
The SPI module features include:
• Four external pins:
– SPISOMI: SPI slave-output/master-input pin
– SPISIMO: SPI slave-input/master-output pin
– SPISTE: SPI slave transmit-enable pin
– SPICLK: SPI serial-clock pin
Note
All four pins can be used as GPIO if the SPI module is not used.
•
Two operational modes: master and slave
Baud rate: 125 different programmable rates.
Baud rate =
LSPCLK
(SPIBRR + 1)
when SPIBRR = 3 to 127
Baud rate =
LSPCLK
4
when SPIBRR = 0, 1, 2
Note
See Section 7 for maximum I/O pin toggling speed.
•
•
•
•
•
Data word length: 1 to 16 data bits
Four clocking schemes (controlled by clock polarity and clock phase bits) include:
– Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling
edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the rising
edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
Simultaneous receive and transmit operation (transmit function can be disabled in software)
Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
Nine SPI module control registers: Located in control register frame beginning at address 7040h.
Note
All registers in this module are 16-bit registers that are connected to Peripheral Frame 2. When a
register is accessed, the register data is in the lower byte (7–0), and the upper byte (15–8) is read
as zeros. Writing to the upper byte has no effect.
Enhanced features:
• 16-level transmit/receive FIFO
• Delayed transmit control
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
The SPI port operation is configured and controlled by the registers listed in Table 8-15 .
Table 8-15. SPI-A Registers
NAME
DESCRIPTION(1)
ADDRESS
SIZE (x16)
SPICCR
0x7040
1
SPI-A Configuration Control Register
SPICTL
0x7041
1
SPI-A Operation Control Register
SPISTS
0x7042
1
SPI-A Status Register
SPIBRR
0x7044
1
SPI-A Baud Rate Register
SPIRXEMU
0x7046
1
SPI-A Receive Emulation Buffer Register
SPIRXBUF
0x7047
1
SPI-A Serial Input Buffer Register
SPITXBUF
0x7048
1
SPI-A Serial Output Buffer Register
SPIDAT
0x7049
1
SPI-A Serial Data Register
SPIFFTX
0x704A
1
SPI-A FIFO Transmit Register
SPIFFRX
0x704B
1
SPI-A FIFO Receive Register
SPIFFCT
0x704C
1
SPI-A FIFO Control Register
SPIPRI
0x704F
1
SPI-A Priority Control Register
(1)
146
Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined
results.
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Figure 8-16 is a block diagram of the SPI in slave mode.
SPIFFENA
Overrun
INT ENA
Receiver
Overrun Flag
SPIFFTX.14
RX FIFO registers
SPISTS.7
SPICTL.4
SPIRXBUF
RX FIFO _0
RX FIFO _1
SPIINT/SPIRXINT
RX FIFO Interrupt
−−−−−
RX Interrupt
Logic
RX FIFO _15
16
SPIRXBUF
Buffer Register
SPIFFOVF FLAG
SPIFFRX.15
To CPU
TX FIFO registers
SPITXBUF
TX FIFO _15
TX Interrupt
Logic
TX FIFO Interrupt
−−−−−
TX FIFO _1
TX FIFO _0
SPITXINT
16
SPI INT FLAG
SPITXBUF
Buffer Register
16
SPI INT
ENA
SPISTS.6
SPICTL.0
16
M
M
SPIDAT
Data Register
S
S
SW1
SPISIMO
M
M
SPIDAT.15 − 0
S
S
SW2
SPISOMI
Talk
SPICTL.1
(A)
SPISTE
State Control
Master/Slave
SPI Char
SPICCR.3 − 0
3
2
1
0
SW3
M
SPI Bit Rate
LSPCLK
SPIBRR.6 − 0
6
A.
5
4
3
SPICTL.2
S
2
1
0
S
Clock
Polarity
Clock
Phase
SPICCR.6
SPICTL.3
SPICLK
M
SPISTE is driven low by the master for a slave device.
Figure 8-16. SPI Module Block Diagram (Slave Mode)
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8.2.12 Inter-Integrated Circuit (I2C)
The device contains one I2C Serial Port. Figure 8-17 shows how the I2C peripheral module interfaces within the
device.
System Control Block
C28x CPU
I2CAENCLK
SYSRS
Control
Data[16]
SDAA
GPIO
MUX
Peripheral Bus
SYSCLKOUT
Data[16]
I2C-A
Addr[16]
SCLA
I2CINT1A
I2CINT2A
A.
B.
PIE
Block
The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are also at the
SYSCLKOUT rate.
The clock enable bit (I2CAENCLK) in the PCLKCR0 register turns off the clock to the I2C port for low power operation. Upon reset,
I2CAENCLK is clear, which indicates the peripheral internal clocks are off.
Figure 8-17. I2C Peripheral Module Interfaces
148
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The I2C module has the following features:
• Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):
– Support for 1-bit to 8-bit format transfers
– 7-bit and 10-bit addressing modes
– General call
– START byte mode
– Support for multiple master-transmitters and slave-receivers
– Support for multiple slave-transmitters and master-receivers
– Combined master transmit/receive and receive/transmit mode
– Data transfer rate from 10 kbps up to 400 kbps (I2C Fast-mode rate)
• One 16-word receive FIFO and one 16-word transmit FIFO
• One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the following
conditions:
– Transmit-data ready
– Receive-data ready
– Register-access ready
– No-acknowledgment received
– Arbitration lost
– Stop condition detected
– Addressed as slave
• An additional interrupt that can be used by the CPU when in FIFO mode
• Module-enable and module-disable capability
• Free data format mode
The registers in Table 8-16 configure and control the I2C port operation.
Table 8-16. I2C-A Registers
NAME
ADDRESS
DESCRIPTION
I2COAR
0x7900
I2C own address register
I2CIER
0x7901
I2C interrupt enable register
I2CSTR
0x7902
I2C status register
I2CCLKL
0x7903
I2C clock low-time divider register
I2CCLKH
0x7904
I2C clock high-time divider register
I2CCNT
0x7905
I2C data count register
I2CDRR
0x7906
I2C data receive register
I2CSAR
0x7907
I2C slave address register
I2CDXR
0x7908
I2C data transmit register
I2CMDR
0x7909
I2C mode register
I2CISRC
0x790A
I2C interrupt source register
I2CPSC
0x790C
I2C prescaler register
I2CFFTX
0x7920
I2C FIFO transmit register
I2CFFRX
0x7921
I2C FIFO receive register
I2CRSR
–
I2C receive shift register (not accessible to the CPU)
I2CXSR
–
I2C transmit shift register (not accessible to the CPU)
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8.2.13 GPIO MUX
On the 2833x/2823x devices, the GPIO MUX can multiplex up to three independent peripheral signals on a
single GPIO pin in addition to providing individual pin bit-banging I/O capability. The GPIO MUX block diagram
per pin is shown in Figure 8-18. Because of the open-drain capabilities of the I2C pins, the GPIO MUX
block diagram for these pins differ. See the System Control and Interrupts chapter of the TMS320x2833x,
TMS320x2823x Real-Time Microcontrollers Technical Reference Manual for details.
Note
There is a 2-SYSCLKOUT cycle delay from when the write to the GPxMUXn and GPxQSELn registers
occurs to when the action is valid.
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GPIOXINT1SEL
GPIOXINT2SEL
GPIOXINT3SEL
GPIOLMPSEL
GPIOXINT7SEL
LPMCR0
GPIOXNMISEL
Low-Power
Modes Block
External Interrupt
MUX
PIE
GPxDAT (read)
Asynchronous
path
GPxQSEL1/2
GPxCTRL
GPxPUD
Input
Qualification
Internal
Pullup
00
N/C
01
Peripheral 1 Input
10
Peripheral 2 Input
11
Peripheral 3 Input
Asynchronous path
GPxTOGGLE
GPxCLEAR
GPxSET
GPIOx pin
00
GPxDAT (latch)
01
Peripheral 1 Output
10
Peripheral 2 Output
11
Peripheral 3 Output
High-Impedance
Output Control
00
0 = Input, 1 = Output
XRS
= Default at Reset
A.
B.
C.
GPxDIR (latch)
01
Peripheral 1 Output Enable
10
Peripheral 2 Output Enable
11
Peripheral 3 Output Enable
GPxMUX1/2
x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register depending on the particular
GPIO pin selected.
GPxDAT latch/read are accessed at the same memory location.
This is a generic GPIO MUX block diagram. Not all options may be applicable for all GPIO pins. See the System Control and Interrupts
chapter of the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual for pin-specific variations.
Figure 8-18. GPIO MUX Block Diagram
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The device supports 88 GPIO pins. The GPIO control and data registers are mapped to Peripheral Frame 1
to enable 32-bit operations on the registers (along with 16-bit operations). Table 8-17 shows the GPIO register
mapping.
Table 8-17. GPIO Registers
NAME
ADDRESS
SIZE (x16)
DESCRIPTION
GPIO CONTROL REGISTERS (EALLOW PROTECTED)
GPACTRL
0x6F80
2
GPIO A Control Register (GPIO0 to 31)
GPAQSEL1
0x6F82
2
GPIO A Qualifier Select 1 Register (GPIO0 to 15)
GPAQSEL2
0x6F84
2
GPIO A Qualifier Select 2 Register (GPIO16 to 31)
GPAMUX1
0x6F86
2
GPIO A MUX 1 Register (GPIO0 to 15)
GPAMUX2
0x6F88
2
GPIO A MUX 2 Register (GPIO16 to 31)
GPADIR
0x6F8A
2
GPIO A Direction Register (GPIO0 to 31)
GPAPUD
0x6F8C
2
GPIO A Pullup Disable Register (GPIO0 to 31)
Reserved
0x6F8E – 0x6F8F
2
GPBCTRL
0x6F90
2
GPIO B Control Register (GPIO32 to 63)
GPBQSEL1
0x6F92
2
GPIO B Qualifier Select 1 Register (GPIO32 to 47)
GPBQSEL2
0x6F94
2
GPIOB Qualifier Select 2 Register (GPIO48 to 63)
GPBMUX1
0x6F96
2
GPIO B MUX 1 Register (GPIO32 to 47)
GPBMUX2
0x6F98
2
GPIO B MUX 2 Register (GPIO48 to 63)
GPBDIR
0x6F9A
2
GPIO B Direction Register (GPIO32 to 63)
GPBPUD
0x6F9C
2
GPIO B Pullup Disable Register (GPIO32 to 63)
Reserved
0x6F9E – 0x6FA5
8
0x6FA6
2
GPIO C MUX1 Register (GPIO64 to 79)
GPCMUX2
0x6FA8
2
GPIO C MUX2 Register (GPIO80 to 87)
GPCDIR
0x6FAA
2
GPIO C Direction Register (GPIO64 to 87)
GPIO C Pullup Disable Register (GPIO64 to 87)
GPCMUX1
GPCPUD
0x6FAC
2
Reserved
0x6FAE – 0x6FBF
18
GPADAT
0x6FC0
2
GPIO A Data Register (GPIO0 to 31)
GPASET
0x6FC2
2
GPIO A Data Set Register (GPIO0 to 31)
GPACLEAR
0x6FC4
2
GPIO A Data Clear Register (GPIO0 to 31)
GPATOGGLE
0x6FC6
2
GPIO A Data Toggle Register (GPIO0 to 31)
GPBDAT
0x6FC8
2
GPIO B Data Register (GPIO32 to 63)
GPBSET
0x6FCA
2
GPIO B Data Set Register (GPIO32 to 63)
GPBCLEAR
0x6FCC
2
GPIO B Data Clear Register (GPIO32 to 63)
GPBTOGGLE
0x6FCE
2
GPIOB Data Toggle Register (GPIO32 to 63)
GPCDAT
0x6FD0
2
GPIO C Data Register (GPIO64 to 87)
GPCSET
0x6FD2
2
GPIO C Data Set Register (GPIO64 to 87)
GPCCLEAR
0x6FD4
2
GPIO C Data Clear Register (GPIO64 to 87)
GPCTOGGLE
0x6FD6
2
GPIO C Data Toggle Register (GPIO64 to 87)
0x6FD8 – 0x6FDF
8
GPIO DATA REGISTERS (NOT EALLOW PROTECTED)
Reserved
GPIO INTERRUPT AND LOW-POWER MODES SELECT REGISTERS (EALLOW PROTECTED)
GPIOXINT1SEL
0x6FE0
1
XINT1 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT2SEL
0x6FE1
1
XINT2 GPIO Input Select Register (GPIO0 to 31)
GPIOXNMISEL
0x6FE2
1
XNMI GPIO Input Select Register (GPIO0 to 31)
GPIOXINT3SEL
0x6FE3
1
XINT3 GPIO Input Select Register (GPIO32 to 63)
GPIOXINT4SEL
0x6FE4
1
XINT4 GPIO Input Select Register (GPIO32 to 63)
152
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Table 8-17. GPIO Registers (continued)
NAME
ADDRESS
SIZE (x16)
GPIOXINT5SEL
0x6FE5
1
XINT5 GPIO Input Select Register (GPIO32 to 63)
GPIOXINT6SEL
0x6FE6
1
XINT6 GPIO Input Select Register (GPIO32 to 63)
GPIOINT7SEL
0x6FE7
1
XINT7 GPIO Input Select Register (GPIO32 to 63)
0x6FE8
2
LPM GPIO Select Register (GPIO0 to 31)
0x6FEA – 0x6FFF
22
GPIOLPMSEL
Reserved
DESCRIPTION
Table 8-18. GPIO-A Mux Peripheral Selection Matrix
REGISTER BITS
GPADIR
GPADAT
GPASET
GPACLR
GPATOGGLE
QUALPRD0
QUALPRD1
QUALPRD2
QUALPRD3
PERIPHERAL SELECTION
GPAMUX1
GPAQSEL1
GPIOx
GPAMUX1 = 0,0
PER1
GPAMUX1 = 0, 1
0
1, 0
GPIO0 (I/O)
EPWM1A (O)
Reserved
Reserved
1
3, 2
GPIO1 (I/O)
EPWM1B (O)
ECAP6 (I/O)
MFSRB (I/O)
2
5, 4
GPIO2 (I/O)
EPWM2A (O)
Reserved
Reserved
3
7, 6
GPIO3 (I/O)
EPWM2B (O)
ECAP5 (I/O)
MCLKRB (I/O)
4
9, 8
GPIO4 (I/O)
EPWM3A (O)
Reserved
Reserved
5
11, 10
GPIO5 (I/O)
EPWM3B (O)
MFSRA (I/O)
ECAP1 (I/O)
6
13, 12
GPIO6 (I/O)
EPWM4A (O)
EPWMSYNCI (I)
EPWMSYNCO (O)
7
15, 14
GPIO7 (I/O)
EPWM4B (O)
MCLKRA (I/O)
ECAP2 (I/O)
8
17, 16
GPIO8 (I/O)
EPWM5A (O)
CANTXB (O)
ADCSOCAO (O)
9
19, 18
GPIO9 (I/O)
EPWM5B (O)
SCITXDB (O)
ECAP3 (I/O)
10
21, 20
GPIO10 (I/O)
EPWM6A (O)
CANRXB (I)
ADCSOCBO (O)
11
23, 22
GPIO11 (I/O)
EPWM6B (O)
SCIRXDB (I)
ECAP4 (I/O)
12
25, 24
GPIO12 (I/O)
TZ1 (I)
CANTXB (O)
MDXB (O)
13
27, 26
GPIO13 (I/O)
TZ2 (I)
CANRXB (I)
MDRB (I)
14
29, 28
GPIO14 (I/O)
TZ3 (I)/ XHOLD (I)
SCITXDB (O)
MCLKXB (I/O)
15
31, 30
GPIO15 (I/O)
TZ4 (I)/ XHOLDA (O)
SCIRXDB (I)
MFSXB (I/O)
GPAMUX2
GPAQSEL2
GPAMUX2 = 0, 0
GPAMUX2 = 0, 1
GPAMUX2 = 1, 0
GPAMUX2 = 1, 1
16
1, 0
GPIO16 (I/O)
SPISIMOA (I/O)
CANTXB (O)
TZ5 (I)
17
3, 2
GPIO17 (I/O)
SPISOMIA (I/O)
CANRXB (I)
TZ6 (I)
18
5, 4
GPIO18 (I/O)
SPICLKA (I/O)
SCITXDB (O)
CANRXA (I)
19
7, 6
GPIO19 (I/O)
SPISTEA (I/O)
SCIRXDB (I)
CANTXA (O)
20
9, 8
GPIO20 (I/O)
EQEP1A (I)
MDXA (O)
CANTXB (O)
21
11, 10
GPIO21 (I/O)
EQEP1B (I)
MDRA (I)
CANRXB (I)
22
13, 12
GPIO22 (I/O)
EQEP1S (I/O)
MCLKXA (I/O)
SCITXDB (O)
23
15, 14
GPIO23 (I/O)
EQEP1I (I/O)
MFSXA (I/O)
SCIRXDB (I)
24
17, 16
GPIO24 (I/O)
ECAP1 (I/O)
EQEP2A (I)
MDXB (O)
25
19, 18
GPIO25 (I/O)
ECAP2 (I/O)
EQEP2B (I)
MDRB (I)
26
21, 20
GPIO26 (I/O)
ECAP3 (I/O)
EQEP2I (I/O)
MCLKXB (I/O)
27
23, 22
GPIO27 (I/O)
ECAP4 (I/O)
EQEP2S (I/O)
28
25, 24
GPIO28 (I/O)
SCIRXDA (I)
XZCS6 (O)
29
27, 26
GPIO29 (I/O)
SCITXDA (O)
XA19 (O)
30
29, 28
GPIO30 (I/O)
CANRXA (I)
XA18 (O)
31
31, 30
GPIO31 (I/O)
CANTXA (O)
XA17 (O)
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PER2
GPAMUX1 = 1, 0
PER3
GPAMUX1 = 1, 1
MFSXB (I/O)
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Table 8-19. GPIO-B Mux Peripheral Selection Matrix
REGISTER BITS
GPBDIR
GPBDAT
GPBSET
GPBCLR
GPBTOGGLE
0
QUALPRD0
QUALPRD1
QUALPRD3
(1)
154
GPBMUX1
GPBQSEL1
GPIOx
GPBMUX1 = 0, 0
PER1
GPBMUX1 = 0, 1
PER2
GPBMUX1 = 1, 0
PER3
GPBMUX1 = 1, 1
1, 0
GPIO32 (I/O)
SDAA (I/OC)(1)
EPWMSYNCI (I)
ADCSOCAO (O)
(I/OC)(1)
EPWMSYNCO (O)
ADCSOCBO (O)
1
3, 2
GPIO33 (I/O)
2
5, 4
GPIO34 (I/O)
ECAP1 (I/O)
3
7, 6
GPIO35 (I/O)
SCITXDA (O)
XR/ W (O)
4
9, 8
GPIO36 (I/O)
SCIRXDA (I)
XZCS0 (O)
5
11, 10
GPIO37 (I/O)
ECAP2 (I/O)
XZCS7 (O)
6
13, 12
GPIO38 (I/O)
7
15, 14
GPIO39 (I/O)
XA16 (O)
8
17, 16
GPIO40 (I/O)
XA0/ XWE1 (O)
XA1 (O)
9
19, 18
GPIO41 (I/O)
10
21, 20
GPIO42 (I/O)
SCLA
XREADY (I)
XWE0 (O)
Reserved
XA2 (O)
11
23, 22
GPIO43 (I/O)
12
25, 24
GPIO44 (I/O)
XA4 (O)
13
27, 26
GPIO45 (I/O)
XA5 (O)
14
29, 28
GPIO46 (I/O)
XA6 (O)
XA7 (O)
15
QUALPRD2
PERIPHERAL SELECTION
XA3 (O)
31, 30
GPIO47 (I/O)
GPBMUX2
GPBQSEL2
GPBMUX2 = 0, 0
GPBMUX2 = 0, 1
16
1, 0
GPIO48 (I/O)
ECAP5 (I/O)
XD31 (I/O)
17
3, 2
GPIO49 (I/O)
ECAP6 (I/O)
XD30 (I/O)
18
5, 4
GPIO50 (I/O)
EQEP1A (I)
XD29 (I/O)
19
7, 6
GPIO51 (I/O)
EQEP1B (I)
XD28 (I/O)
20
9, 8
GPIO52 (I/O)
EQEP1S (I/O)
XD27 (I/O)
21
11, 10
GPIO53 (I/O)
EQEP1I (I/O)
XD26 (I/O)
22
13, 12
GPIO54 (I/O)
SPISIMOA (I/O)
XD25 (I/O)
23
15, 14
GPIO55 (I/O)
SPISOMIA (I/O)
XD24 (I/O)
24
17, 16
GPIO56 (I/O)
SPICLKA (I/O)
XD23 (I/O)
25
19, 18
GPIO57 (I/O)
SPISTEA (I/O)
XD22 (I/O)
26
21, 20
GPIO58 (I/O)
MCLKRA (I/O)
XD21 (I/O)
27
23, 22
GPIO59 (I/O)
MFSRA (I/O)
XD20 (I/O)
28
25, 24
GPIO60 (I/O)
MCLKRB (I/O)
XD19 (I/O)
29
27, 26
GPIO61 (I/O)
MFSRB (I/O)
XD18 (I/O)
30
29, 28
GPIO62 (I/O)
SCIRXDC (I)
XD17 (I/O)
31
31, 30
GPIO63 (I/O)
SCITXDC (O)
XD16 (I/O)
GPBMUX2 = 1, 0
GPBMUX2 = 1, 1
Open drain
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SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
Table 8-20. GPIO-C Mux Peripheral Selection Matrix
REGISTER BITS
GPCDIR
GPCDAT
GPCSET
GPCCLR
GPCTOGGLE
no qual
no qual
GPCMUX1
GPIOx or PER1
GPCMUX1 = 0, 0 or 0, 1
PER2 or PER3
GPCMUX1 = 1, 0 or 1, 1
0
1, 0
GPIO64 (I/O)
XD15 (I/O)
1
3, 2
GPIO65 (I/O)
XD14 (I/O)
2
5, 4
GPIO66 (I/O)
XD13 (I/O)
3
7, 6
GPIO67 (I/O)
XD12 (I/O)
4
9, 8
GPIO68 (I/O)
XD11 (I/O)
5
11, 10
GPIO69 (I/O)
XD10 (I/O)
6
13, 12
GPIO70 (I/O)
XD9 (I/O)
7
15, 14
GPIO71 (I/O)
XD8 (I/O)
8
17, 16
GPIO72 (I/O)
XD7 (I/O)
9
19, 18
GPIO73 (I/O)
XD6 (I/O)
10
21, 20
GPIO74 (I/O)
XD5 (I/O)
11
23, 22
GPIO75 (I/O)
XD4 (I/O)
12
25, 24
GPIO76 (I/O)
XD3 (I/O)
13
27, 26
GPIO77 (I/O)
XD2 (I/O)
14
29, 28
GPIO78 (I/O)
XD1 (I/O)
15
no qual
PERIPHERAL SELECTION
31, 30
GPIO79 (I/O)
XD0 (I/O)
GPCMUX2
GPCMUX2 = 0, 0 or 0, 1
GPCMUX2 = 1, 0 or 1, 1
16
1, 0
GPIO80 (I/O)
XA8 (O)
17
3, 2
GPIO81 (I/O)
XA9 (O)
18
5, 4
GPIO82 (I/O)
XA10 (O)
19
7, 6
GPIO83 (I/O)
XA11 (O)
20
9, 8
GPIO84 (I/O)
XA12 (O)
21
11, 10
GPIO85 (I/O)
XA13 (O)
22
13, 12
GPIO86 (I/O)
XA14 (O)
23
15, 14
GPIO87 (I/O)
XA15 (O)
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The user can select the type of input qualification for each GPIO pin through the GPxQSEL1/2 registers from
four choices:
•
•
Synchronization To SYSCLKOUT Only (GPxQSEL1/2 = 0, 0): This is the default mode of all GPIO pins at
reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT).
Qualification Using Sampling Window (GPxQSEL1/2 = 0, 1 and 1, 0): In this mode the input signal, after
synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles before the
input is allowed to change.
Time Between Samples
GPyCTRL Reg
GPIOx
SYNC
Input Signal
Qualified by
3 or 6 Samples
Qualification
GPxQSEL
SYSCLKOUT
Number of Samples
•
•
Figure 8-19. Qualification Using Sampling Window
The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in
groups of 8 signals. It specifies a multiple of SYSCLKOUT cycles for sampling the input signal. The sampling
window is either 3-samples or 6-samples wide and the output is only changed when all samples are the same
(all 0s or all 1s) as shown in Figure 8-19 (for 6-sample mode).
No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is not
required (synchronization is performed within the peripheral).
Due to the multilevel multiplexing that is required on the device, there may be cases where a peripheral input
signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the input signal will
default to either a 0 or 1 state, depending on the peripheral.
156
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TMS320F28332, TMS320F28235, TMS320F28235-Q1
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8.2.14 External Interface (XINTF)
This section gives a top-level view of the external interface (XINTF) that is implemented on the 2833x/2823x
devices.
The XINTF is a nonmultiplexed asynchronous bus, similar to the 2812 XINTF. The XINTF is mapped into three
fixed zones shown in Figure 8-20.
Data Space
Prog Space
0x0000-0000
XD[31:0]
XA[19:0]
0x0000-4000
XINTF Zone 0
(8K x 16)
XZCS0
XINTF Zone 6
(1M x 16)
XZCS6
XINTF Zone 7
(1M x 16)
XZCS7
0x0000-5000
0x0010-0000
0x0020-0000
XA0/XWE1
0x0030-0000
XWE0
XRD
XR/W
XREADY
XHOLD
XHOLDA
XCLKOUT
A.
B.
C.
Each zone can be programmed with different wait states, setup and hold timings, and is supported by zone chip selects that toggle
when an access to a particular zone is performed. These features enable glueless connection to many external memories and
peripherals.
Zones 1 – 5 are reserved for future expansion.
Zones 0, 6, and 7 are always enabled.
Figure 8-20. External Interface Block Diagram
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Figure 8-21 and Figure 8-22 show typical 16-bit and 32-bit data bus XINTF connections, illustrating how the
functionality of the XA0 and XWE1 signals change, depending on the configuration. Table 8-21 defines XINTF
configuration and control registers.
XINTF
External
wait-state
generator
16-bits
XREADY
XCLKOUT
XZCS0, XZCS6, XZCS7
CS
A(19:1)
XA(19:1)
A(0)
XA0/XWE1
OE
XRD
WE
XWE0
D(15:0)
XD(15:0)
Figure 8-21. Typical 16-Bit Data Bus XINTF Connections
XINTF
External
wait-state
generator
Low 16-bits
XREADY
XCLKOUT
CS
A(18:0)
XA(19:1)
OE
XRD
WE
XWE0
D(15:0)
XD(15:0)
High 16-bits
A(18:0)
XZCS0, XZCS6, XZCS7
CS
OE
XA0/XWE1
(select XWE1)
WE
D(31:16)
XD(31:16)
Figure 8-22. Typical 32-Bit Data Bus XINTF Connections
Table 8-21. XINTF Configuration and Control Register Mapping
NAME
ADDRESS
SIZE (x16)
XTIMING0
0x00−0B20
2
XINTF Timing Register, Zone 0
XTIMING6(1)
0x00−0B2C
2
XINTF Timing Register, Zone 6
XTIMING7
0x00−0B2E
2
XINTF Timing Register, Zone 7
XINTCNF2(2)
0x00−0B34
2
XINTF Configuration Register
XBANK
0x00−0B38
1
XINTF Bank Control Register
XREVISION
0x00−0B3A
1
XINTF Revision Register
XRESET
0x00−0B3D
1
XINTF Reset Register
(1)
(2)
158
DESCRIPTION
XTIMING1 - XTIMING5 are reserved for future expansion and are not currently used.
XINTCNF1 is reserved and not currently used.
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8.3 Memory Maps
In Figure 8-23 to Figure 8-25, the following apply:
• Memory blocks are not to scale.
• Peripheral Frame 0, Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 memory maps are
restricted to data memory only. A user program cannot access these memory maps in program space.
• Protected means the order of "Write followed by Read" operations is preserved rather than the pipeline
order. See the System Control and Interrupts chapter of the TMS320x2833x, TMS320x2823x Real-Time
Microcontrollers Technical Reference Manual for more details.
• Certain memory ranges are EALLOW protected against spurious writes after configuration.
• Locations 0x38 0080–0x38 008F contain the ADC calibration routine. It is not programmable by the user.
• If the eCAN module is not used in an application, the RAM available (LAM, MOTS, MOTO, and mailbox RAM)
can be used as general-purpose RAM. The CAN module clock should be enabled for this.
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Block
Start Address
On-Chip Memory
Prog Space
Data Space
0x00 0000
Prog Space
Data Space
M0 Vector - RAM (32 x 32)
(Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K x 16)
0x00 0400
M1 SARAM (1K x 16)
0x00 0800
Peripheral Frame 0
Reserved
0x00 0D00
Low 64K
(24x/240x Equivalent Data Space)
External Memory XINTF
PIE Vector - RAM
(256 x 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
0x00 0E00
Reserved
Peripheral Frame 0
0x00 2000
XINTF Zone 0 (4K x 16, XZCS0)
(Protected) DMA-Accessible
Reserved
0x00 5000
0x00 4000
0x00 5000
Peripheral Frame 3
(Protected) DMA-Accessible
0x00 6000
Peripheral Frame 1
(Protected)
Reserved
0x00 7000
Peripheral Frame 2
(Protected)
0x00 8000
0x00 9000
0x00 A000
0x00 B000
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
0x00 C000
L4 SARAM (4K x 16, DMA-Accessible)
0x00 D000
L5 SARAM (4K x 16, DMA-Accessible)
0x00 E000
L6 SARAM (4K x 16, DMA-Accessible)
0x00 F000
L7 SARAM (4K x 16, DMA-Accessible)
0x01 0000
Reserved
XINTF Zone 6 (1M x 16, XZCS6) (DMA-Accessible)
XINTF Zone 7 (1M x 16, XZCS7) (DMA-Accessible)
0x30 0000
0x20 0000
0x30 0000
FLASH (256K x 16, Secure Zone)
0x33 FFF8
0x34 0000
0x38 0080
0x38 0091
0x10 0000
128-bit Password
Reserved
ADC Calibration Data and PARTID (Secure Zone)
Reserved
0x38 0400
User OTP (1K x 16, Secure Zone)
0x38 0800
Reserved
High 64K
(24x/240x Equivalent
Program Space)
0x3F 8000
0x3F 9000
0x3F A000
0x3F B000
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
0x3F C000
Reserved
0x3F E000
Boot ROM (8K x 16)
0x3F FFC0
BROM Vector - ROM (32 x 32)
(Enabled if VMAP = 1, ENPIE = 0)
LEGEND:
Only one of these vector maps-M0 vector, PIE vector, BROM vector- should be enabled at a time.
Figure 8-23. F28335, F28333, F28235 Memory Map
160
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Block
Start Address
On-Chip Memory
External Memory XINTF
Prog Space
Data Space
Prog Space
Data Space
0x00 0000
M0 Vector - RAM (32 x 32)
(Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K x 16)
0x00 0400
M1 SARAM (1K x 16)
0x00 0800
Peripheral Frame 0
Reserved
Low 64K
(24x/240x Equivalent Data Space)
0x00 0D00
0x00 0E00
PIE Vector - RAM
(256 x 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
Reserved
Peripheral Frame 0
0x00 2000
Reserved
XINTF Zone 0 (4K x 16, XZCS0)
(Protected) DMA-Accessible
0x00 5000
0x00 6000
0x00 7000
0x00 8000
0x00 9000
0x00 A000
0x00 B000
0x00 C000
0x00 D000
0x00 E000
0x00 F000
Peripheral Frame 1
(Protected)
Reserved
Peripheral Frame 2
(Protected)
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L4 SARAM (4K x 16, DMA-Accessible)
L5 SARAM (4K x 16, DMA-Accessible)
L6 SARAM (4K x 16, DMA-Accessible)
L7 SARAM (4K x 16, DMA-Accessible)
XINTF Zone 6 (1M x 16, XZCS6) (DMA-Accessible)
Reserved
Reserved
ADC Calibration Data and PARTID (Secure Zone)
0x38 0091
Reserved
User OTP (1K x 16, Secure Zone)
0x38 0800
High 64K
(24x/240x Equivalent
Program Space)
0x3F 8000
0x3F 9000
0x3F A000
0x3F B000
0x10 0000
0x20 0000
0x30 0000
128-bit Password
0x34 0000
0x38 0400
XINTF Zone 7 (1M x 16, XZCS7) (DMA-Accessible)
FLASH (128K x 16, Secure Zone)
0x33 FFF8
0x38 0080
0x00 5000
Peripheral Frame 3
(Protected)
DMA-Accessible
0x01 0000
0x32 0000
0x00 4000
Reserved
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
0x3F C000
Reserved
0x3F E000
Boot ROM (8K x 16)
0x3F FFC0
BROM Vector - ROM (32 x 32)
(Enabled if VMAP = 1, ENPIE = 0)
LEGEND:
Only one of these vector maps-M0 vector, PIE vector, BROM vector-should be enabled at a time.
Figure 8-24. F28334, F28234 Memory Map
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Block
Start Address
On-Chip Memory
Prog Space
Data Space
0x00 0000
Prog Space
Data Space
M0 Vector - RAM (32 x 32)
(Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K x 16)
0x00 0400
M1 SARAM (1K x 16)
0x00 0800
Peripheral Frame 0
Reserved
0x00 0D00
Low 64K
(24x/240x Equivalent Data Space)
External Memory XINTF
PIE Vector - RAM
(256 x 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
0x00 0E00
Reserved
Peripheral Frame 0
0x00 2000
XINTF Zone 0 (4K x 16, XZCS0)
(Protected) DMA-Accessible
Reserved
0x00 5000
0x00 4000
0x00 5000
Peripheral Frame 3
(Protected) DMA-Accessible
0x00 6000
Peripheral Frame 1
(Protected)
Reserved
0x00 7000
Peripheral Frame 2
(Protected)
0x00 8000
0x00 9000
0x00 A000
0x00 B000
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
0x00 C000
L4 SARAM (4K x 16, DMA-Accessible)
0x00 D000
L5 SARAM (4K x 16, DMA-Accessible)
0x00 E000
XINTF Zone 6 (1M x 16, XZCS6) (DMA-Accessible)
Reserved
0x10 0000
0x20 0000
XINTF Zone 7 (1M x 16, XZCS7) (DMA-Accessible)
0x30 0000
0x33 0000
FLASH (64K x 16, Secure Zone)
0x33 FFF8
128-bit Password
0x34 0000
Reserved
0x38 0080
ADC Calibration Data and PARTID (Secure Zone)
0x38 0091
Reserved
0x38 0400
User OTP (1K x 16, Secure Zone)
0x38 0800
High 64K
(24x/240x Equivalent
Program Space)
0x3F 8000
0x3F 9000
0x3F A000
0x3F B000
0x3F C000
Reserved
L0 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L1 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
L2 SARAM (4K x 16, Secure Zone, Dual-Mapped)
L3 SARAM (4K x 16, Secure Zone, Dual-Mapped)
Reserved
0x3F E000
Boot ROM (8K x 16)
0x3F FFC0
BROM Vector - ROM (32 x 32)
(Enabled if VMAP = 1, ENPIE = 0)
LEGEND:
Only one of these vector maps-M0 vector, PIE vector, BROM vector-should be enabled at a time.
Figure 8-25. F28332, F28232 Memory Map
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Table 8-22. Addresses of Flash Sectors in F28335, F28333, F28235
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x30 0000 - 0x30 7FFF
Sector H (32K × 16)
0x30 8000 - 0x30 FFFF
Sector G (32K × 16)
0x31 0000 - 0x31 7FFF
Sector F (32K × 16)
0x31 8000 - 0x31 FFFF
Sector E (32K × 16)
0x32 0000 - 0x32 7FFF
Sector D (32K × 16)
0x32 8000 - 0x32 FFFF
Sector C (32K × 16)
0x33 0000 - 0x33 7FFF
Sector B (32K × 16)
0x33 8000 - 0x33 FF7F
Sector A (32K × 16)
0x33 FF80 - 0x33 FFF5
Program to 0x0000 when using the
Code Security Module
0x33 FFF6 - 0x33 FFF7
Boot-to-Flash Entry Point
(program branch instruction here)
0x33 FFF8 - 0x33 FFFF
Security Password
(128-Bit) (Do Not Program to all zeros)
Table 8-23. Addresses of Flash Sectors in F28334, F28234
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x32 0000 - 0x32 3FFF
Sector H (16K × 16)
0x32 4000 - 0x32 7FFF
Sector G (16K × 16)
0x32 8000 - 0x32 BFFF
Sector F (16K × 16)
0x32 C000 - 0x32 FFFF
Sector E (16K × 16)
0x33 0000 - 0x33 3FFF
Sector D (16K × 16)
0x33 4000 - 0x33 7FFFF
Sector C (16K × 16)
0x33 8000 - 0x33 BFFF
Sector B (16K × 16)
0x33 C000 - 0x33 FF7F
Sector A (16K × 16)
0x33 FF80 - 0x33 FFF5
Program to 0x0000 when using the
Code Security Module
0x33 FFF6 - 0x33 FFF7
Boot-to-Flash Entry Point
(program branch instruction here)
0x33 FFF8 - 0x33 FFFF
Security Password (128-Bit)
(Do Not Program to all zeros)
Table 8-24. Addresses of Flash Sectors in F28332, F28232
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x33 0000 - 0x33 3FFF
Sector D (16K × 16)
0x33 4000 - 0x33 7FFFF
Sector C (16K × 16)
0x33 8000 - 0x33 BFFF
Sector B (16K × 16)
0x33 C000 - 0x33 FF7F
Sector A (16K × 16)
0x33 FF80 - 0x33 FFF5
Program to 0x0000 when using the Code Security Module
0x33 FFF6 - 0x33 FFF7
Boot-to-Flash Entry Point (program branch instruction here)
0x33 FFF8 - 0x33 FFFF
Security Password (128-Bit) (Do Not Program to all zeros)
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•
•
Note
When the code-security passwords are programmed, all addresses from 0x33FF80 to 0x33FFF5
cannot be used as program code or data. These locations must be programmed to 0x0000.
If the code security feature is not used, addresses 0x33FF80 to 0x33FFEF may be used for code
or data. Addresses 0x33FFF0 to 0x33FFF5 are reserved for data and should not contain program
code.
Table 8-25 shows how to handle these memory locations.
Table 8-25. Handling Security Code Locations
ADDRESS
0x33FF80 – 0x33FFEF
0x33FFF0 – 0x33FFF5
FLASH
CODE SECURITY ENABLED
Fill with 0x0000
CODE SECURITY DISABLED
Application code and data
Reserved for data only
Peripheral Frame 1, Peripheral Frame 2, and Peripheral Frame 3 are grouped together to enable these blocks to
be write/read peripheral block protected. The protected mode ensures that all accesses to these blocks happen
as written. Because of the C28x pipeline, a write immediately followed by a read, to different memory locations,
will appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral
applications where the user expected the write to occur first (as written). The C28x CPU supports a block
protection mode where a region of memory can be protected so as to make sure that operations occur as written
(the penalty is extra cycles are added to align the operations). This mode is programmable and by default, it will
protect the selected zones.
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The wait states for the various spaces in the memory map area are listed in the following Wait States table.
Table 8-26. Wait States
AREA
WAIT STATES
(CPU)
M0 and M1 SARAMs
0-wait
Peripheral Frame 0
0-wait (writes)
0-wait (reads)
1-wait (reads)
No access (writes)
0-wait (writes)
0-wait (writes)
2-wait (reads)
1-wait (reads)
0-wait (writes)
No access
Peripheral Frame 3
Peripheral Frame 1
WAIT STATES
(DMA)(1)
Fixed
2-wait (reads)
Peripheral Frame 2
0-wait (writes)
COMMENTS
Assumes no conflicts between CPU and DMA.
Cycles can be extended by peripheral generated ready.
Consecutive (back-to-back) writes to Peripheral Frame 1
registers will experience a 1-cycle pipeline hit (1-cycle delay)
No access
Fixed. Cycles cannot be extended by the peripheral.
0-wait
No access
Assumes no CPU conflicts
L4 SARAM
0-wait data (reads)
0-wait
L5 SARAM
0-wait data (writes)
2-wait (reads)
L0 SARAM
L1 SARAM
L2 SARAM
L3 SARAM
L6 SARAM
1-wait program (reads)
L7 SARAM
1-wait program (writes)
XINTF
Programmable
Programmable
Assumes no conflicts between CPU and DMA.
Programmed through the XTIMING registers or extendable
through external XREADY signal to meet system timing
requirements.
1-wait is minimum wait states allowed on external waveforms
for both reads and writes on XINTF.
0-wait minimum writes 0-wait minimum writes 0-wait minimum for writes assumes write buffer enabled and
with write buffer
with write buffer enabled not full.
enabled
Assumes no conflicts between CPU and DMA. When DMA and
CPU try simultaneously (conflict), a 1-cycle delay is added for
arbitration.
OTP
Programmable
No access
1-wait minimum
FLASH
Programmable
Programmed via the Flash registers.
1-wait is minimum number of wait states allowed. 1-wait-state
operation is possible at a reduced CPU frequency.
No access
1-wait Paged min
Programmed via the Flash registers.
0-wait minimum for paged access is not allowed
1-wait Random min
Random ≥ Paged
(1)
FLASH Password
16-wait fixed
No access
Wait states of password locations are fixed.
Boot-ROM
1-wait
No access
0-wait speed is not possible.
The DMA has a base of four cycles/word.
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8.4 Register Map
The devices contain four peripheral register spaces. The spaces are categorized as follows:
Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus. See
Table 8-27.
Peripheral Frame 1
These are peripherals that are mapped to the 32-bit peripheral bus.
See Table 8-28.
Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus.
See Table 8-29.
Peripheral Frame 3: These are peripherals that are mapped to the 32-bit DMA-accessible peripheral
bus. See Table 8-30.
Table 8-27. Peripheral Frame 0 Registers
NAME(1)
ACCESS TYPE(2)
ADDRESS RANGE
SIZE (x16)
Device Emulation Registers
0x00 0880 – 0x00 09FF
384
EALLOW protected
FLASH Registers(3)
0x00 0A80 – 0x00 0ADF
96
EALLOW protected
Code Security Module Registers
0x00 0AE0 – 0x00 0AEF
16
EALLOW protected
ADC registers (dual-mapped)
0 wait (DMA), 1 wait (CPU), read only
0x00 0B00 – 0x00 0B0F
16
Not EALLOW protected
XINTF Registers
0x00 0B20 – 0x00 0B3F
32
EALLOW protected
CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
Registers
0x00 0C00 – 0x00 0C3F
64
Not EALLOW protected
PIE Registers
0x00 0CE0 – 0x00 0CFF
32
Not EALLOW protected
PIE Vector Table
0x00 0D00 – 0x00 0DFF
256
EALLOW protected
DMA Registers
0x00 1000 – 0x00 11FF
512
EALLOW protected
(1)
(2)
(3)
Registers in Frame 0 support 16-bit and 32-bit accesses.
If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction
disables writes to prevent stray code or pointers from corrupting register contents.
The Flash Registers are also protected by the Code Security Module (CSM).
Table 8-28. Peripheral Frame 1 Registers
NAME
ADDRESS RANGE
SIZE (x16)
eCAN-A Registers
0x00 6000 – 0x00 61FF
512
eCAN-B Registers
0x00 6200 – 0x00 63FF
512
ePWM1 + HRPWM1 Registers
0x00 6800 – 0x00 683F
64
ePWM2 + HRPWM2 Registers
0x00 6840 – 0x00 687F
64
ePWM3 + HRPWM3 Registers
0x00 6880 – 0x00 68BF
64
ePWM4 + HRPWM4 Registers
0x00 68C0 – 0x00 68FF
64
ePWM5 + HRPWM5 Registers
0x00 6900 – 0x00 693F
64
ePWM6 + HRPWM6 Registers
0x00 6940 – 0x00 697F
64
eCAP1 Registers
0x00 6A00 – 0x00 6A1F
32
eCAP2 Registers
0x00 6A20 – 0x00 6A3F
32
eCAP3 Registers
0x00 6A40 – 0x00 6A5F
32
eCAP4 Registers
0x00 6A60 – 0x00 6A7F
32
eCAP5 Registers
0x00 6A80 – 0x00 6A9F
32
eCAP6 Registers
0x00 6AA0 – 0x00 6ABF
32
eQEP1 Registers
0x00 6B00 – 0x00 6B3F
64
eQEP2 Registers
0x00 6B40 – 0x00 6B7F
64
GPIO Registers
0x00 6F80 – 0x00 6FFF
128
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Table 8-29. Peripheral Frame 2 Registers
NAME
ADDRESS RANGE
SIZE (x16)
System Control Registers
0x00 7010 – 0x00 702F
32
SPI-A Registers
0x00 7040 – 0x00 704F
16
SCI-A Registers
0x00 7050 – 0x00 705F
16
External Interrupt Registers
0x00 7070 – 0x00 707F
16
ADC Registers
0x00 7100 – 0x00 711F
32
SCI-B Registers
0x00 7750 – 0x00 775F
16
SCI-C Registers
0x00 7770 – 0x00 777F
16
I2C-A Registers
0x00 7900 – 0x00 793F
64
Table 8-30. Peripheral Frame 3 Registers
NAME
ADDRESS RANGE
SIZE (x16)
McBSP-A Registers (DMA)
0x5000 – 0x503F
64
McBSP-B Registers (DMA)
0x5040 – 0x507F
64
0x5800 – 0x583F
64
0x5840 – 0x587F
64
ePWM3 + HRPWM3 (DMA)
0x5880 – 0x58BF
64
ePWM4 + HRPWM4 (DMA)
0x58C0 – 0x58FF
64
ePWM5 + HRPWM5 (DMA)
0x5900 – 0x593F
64
ePWM6 + HRPWM6 (DMA)
0x5940 – 0x597F
64
ePWM1 + HRPWM1
(DMA)(1)
ePWM2 + HRPWM2 (DMA)
(1)
The ePWM and HRPWM modules can be re-mapped to Peripheral Frame 3 where they can be accessed by the DMA module. To
achieve this, bit 0 (MAPEPWM) of MAPCNF register (address 0x702E) must be set to 1. This register is EALLOW protected. When
this bit is 0, the ePWM and HRPWM modules are mapped to Peripheral Frame 1.
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8.4.1 Device Emulation Registers
These registers are used to control the protection mode of the C28x CPU and to monitor some critical device
signals. The registers are defined in Table 8-31.
Table 8-31. Device Emulation Registers
NAME
DEVICECNF
PARTID
CLASSID
ADDRESS
RANGE
SIZE (x16)
0x0880
0x0881
2
Device Configuration Register
0x380090
1
Part ID Register
0x0882
1
DESCRIPTION
TMS320F2833x Floating-Point Class Device
TMS320F2823x Fixed-Point Class Device
REVID
0x0883
1
Revision ID Register
PROTSTART
0x0884
1
Block Protection Start Address Register
PROTRANGE
0x0885
1
Block Protection Range Address Register
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TMS320F28335
0x00EF
TMS320F28334
0x00EE
TMS320F28333
0x00E0
TMS320F28332
0x00ED
TMS320F28235
0x00E8
TMS320F28234
0x00E7
TMS320F28232
0x00E6
TMS320F28335
0x00EF
TMS320F28334
0x00EF
TMS320F28333
0x00EF
TMS320F28332
0x00EF
TMS320F28235
0x00E8
TMS320F28234
0x00E8
TMS320F28232
0x00E8
0x0001 – Silicon Rev. A – TMS
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
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8.5 Interrupts
Figure 8-26 shows how the various interrupt sources are multiplexed.
WAKEINT
DMA
WDINT
Sync
LPMINT
Watchdog
Low-Power Models
SYSCLKOUT
Interrupt Control
XINT1
Latch
XINT1CR(15:0)
XINT1CTR(15:0)
GPIOXINT1SEL(4:0)
DMA
XINT2
ADC
XINT2
XINT2SOC
Latch
Interrupt Control
MUX
PIE
INT1
to
INT12
96 Interrupts
XINT1
Clear
MUX
DMA
Peripherals
(A)
(SPI, SCI, I2C, CAN, McBSP ,
(A)
(A)
ePWM , eCAP, eQEP, ADC )
XINT2CR(15:0)
C28
Core
XINT2CTR(15:0)
GPIOXINT2SEL(4:0)
DMA
TINT0
CPU Timer 0
DMA
TINT2
CPU Timer 2
NMI
CPU Timer 1
Interrupt Control
MUX
INT13
MUX
TINT1
XNMI_
XINT13
GPIO0.int
Latch
MUX
INT14
XNMICR(15:0)
1
GPIO
Mux
GPIO31.int
XNMICTR(15:0)
GPIOXNMISEL(4:0)
DMA
A.
DMA-accessible
Figure 8-26. External and PIE Interrupt Sources
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XINT3
Interrupt Control
Latch
Mux
DMA
XINT3CR(15:0)
GPIOXINT3SEL(4:0)
XINT4
Interrupt Control
Latch
Mux
DMA
XINT4CR(15:0)
PIE
C28
Core
XINT5
Interrupt Control
Latch
Mux
INT1
to
INT12
96 Interrupts
GPIOXINT4SEL(4:0)
DMA
XINT5CR(15:0)
GPIOXINT5SEL(4:0)
XINT6
Interrupt Control
Latch
Mux
DMA
XINT6CR(15:0)
GPIOXINT6SEL(4:0)
DMA
Interrupt Control
Latch
Mux
GPIO32.int
XINT7
XINT7CR(15:0)
GPIO63.int
GPIO
Mux
GPIOXINT7SEL(4:0)
Figure 8-27. External Interrupts
Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with 8 interrupts
per group equals 96 possible interrupts. On the 2833x/2823x devices, 58 of these are used by peripherals as
shown in Table 8-32.
The TRAP #VectorNumber instruction transfers program control to the interrupt service routine corresponding to
the vector specified. TRAP #0 tries to transfer program control to the address pointed to by the reset vector. The
PIE vector table does not, however, include a reset vector. Therefore, TRAP #0 should not be used when the
PIE is enabled. Doing so will result in undefined behavior.
When the PIE is enabled, TRAP #1 to TRAP #12 will transfer program control to the interrupt service routine
corresponding to the first vector within the PIE group. For example: TRAP #1 fetches the vector from INT1.1,
TRAP #2 fetches the vector from INT2.1, and so forth.
170
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IFR(12:1)
INTM
IER(12:1)
INT1
INT2
1
CPU
MUX
0
INT11
INT12
(Flag)
Global
Enable
(Enable)
INTx.1
INTx.2
INTx
INTx.3
INTx.4
MUX
From
Peripherals
or
External
Interrupts
INTx.5
INTx.6
INTx.7
PIEACKx
INTx.8
(Enable)
(Flag)
PIEIERx(8:1)
PIEIFRx(8:1)
(Enable/Flag)
Figure 8-28. Multiplexing of Interrupts Using the PIE Block
Table 8-32. PIE Peripheral Interrupts
CPU
INTERRUPTS
INT1
(1)
(2)
PIE INTERRUPTS(1)
INTx.8
INTx.7
INTx.6
WAKEINT
(LPM/WD)
TINT0
(TIMER 0)
ADCINT(2)
(ADC)
INTx.5
XINT2
EPWM5_TZINT
(ePWM5)
INTx.4
INTx.3
INTx.2
INTx.1
XINT1
Reserved
SEQ2INT
(ADC)
SEQ1INT
(ADC)
EPWM4_TZINT
(ePWM4)
EPWM3_TZINT
(ePWM3)
EPWM2_TZINT
(ePWM2)
EPWM1_TZINT
(ePWM1)
INT2
Reserved
Reserved
EPWM6_TZINT
(ePWM6)
INT3
Reserved
Reserved
EPWM6_INT
(ePWM6)
EPWM5_INT
(ePWM5)
EPWM4_INT
(ePWM4)
EPWM3_INT
(ePWM3)
EPWM2_INT
(ePWM2)
EPWM1_INT
(ePWM1)
INT4
Reserved
Reserved
ECAP6_INT
(eCAP6)
ECAP5_INT
(eCAP5)
ECAP4_INT
(eCAP4)
ECAP3_INT
(eCAP3)
ECAP2_INT
(eCAP2)
ECAP1_INT
(eCAP1)
INT5
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
EQEP2_INT
(eQEP2)
EQEP1_INT
(eQEP1)
INT6
Reserved
Reserved
MXINTA
(McBSP-A)
MRINTA
(McBSP-A)
MXINTB
(McBSP-B)
MRINTB
(McBSP-B)
SPITXINTA
(SPI-A)
SPIRXINTA
(SPI-A)
INT7
Reserved
Reserved
DINTCH6
(DMA)
DINTCH5
(DMA)
DINTCH4
(DMA)
DINTCH3
(DMA)
DINTCH2
(DMA)
DINTCH1
(DMA)
INT8
Reserved
Reserved
SCITXINTC
(SCI-C)
SCIRXINTC
(SCI-C)
Reserved
Reserved
I2CINT2A
(I2C-A)
I2CINT1A
(I2C-A)
INT9
ECAN1_INTB
(CAN-B)
ECAN0_INTB
(CAN-B)
ECAN1_INTA
(CAN-A)
ECAN0_INTA
(CAN-A)
SCITXINTB
(SCI-B)
SCIRXINTB
(SCI-B)
SCITXINTA
(SCI-A)
SCIRXINTA
(SCI-A)
INT10
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
INT11
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
INT12
LUF
(FPU)
LVF
(FPU)
Reserved
XINT7
XINT6
XINT5
XINT4
XINT3
Out of the 96 possible interrupts, 58 interrupts are currently used. The remaining interrupts are reserved for future devices. These
interrupts can be used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group
is being used by a peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while
modifying the PIEIFR. To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts:
1) No peripheral within the group is asserting interrupts.
2) No peripheral interrupts are assigned to the group (example PIE group 11).
ADCINT is sourced as a logical "OR" of both the SEQ1INT and SEQ2INT signals. This is to support backward compatibility with the
implementation found on the TMS320F281x series of devices, where SEQ1INT and SEQ2INT did not exist, only ADCINT. For new
implementations, TI recommends using SEQ1INT and SEQ2INT and not enabling ADCINT in the PIEIER register.
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Table 8-33. PIE Configuration and Control Registers
NAME
SIZE (x16)
PIECTRL
0x0CE0
1
PIE, Control Register
PIEACK
0x0CE1
1
PIE, Acknowledge Register
PIEIER1
0x0CE2
1
PIE, INT1 Group Enable Register
PIEIFR1
0x0CE3
1
PIE, INT1 Group Flag Register
PIEIER2
0x0CE4
1
PIE, INT2 Group Enable Register
PIEIFR2
0x0CE5
1
PIE, INT2 Group Flag Register
PIEIER3
0x0CE6
1
PIE, INT3 Group Enable Register
PIEIFR3
0x0CE7
1
PIE, INT3 Group Flag Register
PIEIER4
0x0CE8
1
PIE, INT4 Group Enable Register
PIEIFR4
0x0CE9
1
PIE, INT4 Group Flag Register
PIEIER5
0x0CEA
1
PIE, INT5 Group Enable Register
PIEIFR5
0x0CEB
1
PIE, INT5 Group Flag Register
PIEIER6
0x0CEC
1
PIE, INT6 Group Enable Register
PIEIFR6
0x0CED
1
PIE, INT6 Group Flag Register
PIEIER7
0x0CEE
1
PIE, INT7 Group Enable Register
PIEIFR7
0x0CEF
1
PIE, INT7 Group Flag Register
PIEIER8
0x0CF0
1
PIE, INT8 Group Enable Register
PIEIFR8
0x0CF1
1
PIE, INT8 Group Flag Register
PIEIER9
0x0CF2
1
PIE, INT9 Group Enable Register
PIEIFR9
0x0CF3
1
PIE, INT9 Group Flag Register
PIEIER10
0x0CF4
1
PIE, INT10 Group Enable Register
PIEIFR10
0x0CF5
1
PIE, INT10 Group Flag Register
PIEIER11
0x0CF6
1
PIE, INT11 Group Enable Register
PIEIFR11
0x0CF7
1
PIE, INT11 Group Flag Register
PIEIER12
0x0CF8
1
PIE, INT12 Group Enable Register
PIEIFR12
0x0CF9
1
PIE, INT12 Group Flag Register
Reserved
0x0CFA – 0x0CFF
6
Reserved
(1)
172
DESCRIPTION(1)
ADDRESS
The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector
table is protected.
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8.5.1 External Interrupts
Table 8-34. External Interrupt Registers
NAME
ADDRESS
SIZE (x16)
DESCRIPTION
XINT1CR
0x00 7070
1
XINT1 configuration register
XINT2CR
0x00 7071
1
XINT2 configuration register
XINT3CR
0x00 7072
1
XINT3 configuration register
XINT4CR
0x00 7073
1
XINT4 configuration register
XINT5CR
0x00 7074
1
XINT5 configuration register
XINT6CR
0x00 7075
1
XINT6 configuration register
XINT7CR
0x00 7076
1
XINT7 configuration register
XNMICR
0x00 7077
1
XNMI configuration register
XINT1CTR
0x00 7078
1
XINT1 counter register
XINT2CTR
0x00 7079
1
XINT2 counter register
Reserved
0x707A – 0x707E
5
XNMICTR
0x00 707F
1
XNMI counter register
Each external interrupt can be enabled or disabled or qualified using positive, negative, or both positive and
negative edge. For more information, see the System Control and Interrupts chapter of the TMS320x2833x,
TMS320x2823x Real-Time Microcontrollers Technical Reference Manual.
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8.6 System Control
This section describes the oscillator, PLL and clocking mechanisms, the watchdog function and the low-power
modes. Figure 8-29 shows the various clock and reset domains that will be discussed.
C28x Core
CLKIN
SYSCLKOUT
I/O
SPI-A, SCI-A/B/C
LOSPCP
Peripheral
Registers
Clock Enables
I2C-A
Clock Enables
Bridge
Memory Bus
LSPCLK
Peripheral Bus
Clock Enables
System
Control
Register
/2
Bridge
I/O
eCAN-A/B
GPIO
Mux
Peripheral
Registers
Clock Enables
I/O
ePWM1/../6, HRPWM1/../6, Peripheral
Registers
eCAP1/../6, eQEP1/2
Clock Enables
LSPCLK
I/O
McBSP-A/B
Bridge
LOSPCP
Peripheral
Registers
Clock Enables
HSPCLK
HISPCP
Bridge
12-Bit ADC
ADC
Registers
Result
Registers
Clock Enables
A.
DMA
Bus
16 Channels
DMA
CLKIN is the clock into the CPU. It is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same frequency as SYSCLKOUT).
See Figure 8-30 for an illustration of how CLKIN is derived.
Figure 8-29. Clock and Reset Domains
174
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Note
There is a 2-SYSCLKOUT cycle delay from when the write to the PCLKCR0, PCLKCR1, and
PCLKCR2 registers (enables peripheral clocks) occurs to when the action is valid. This delay must be
considered before trying to access the peripheral configuration registers.
The PLL, clocking, watchdog and low-power modes, are controlled by the registers listed in Table 8-35.
Table 8-35. PLL, Clocking, Watchdog, and Low-Power Mode Registers
NAME
ADDRESS
SIZE (x16)
PLLSTS
0x00 7011
1
PLL Status Register
Reserved
0x00 7012 – 0x00 7018
7
Reserved
Reserved
0x00 7019
1
Reserved
HISPCP
0x00 701A
1
High-Speed Peripheral Clock Prescaler Register
LOSPCP
0x00 701B
1
Low-Speed Peripheral Clock Prescaler Register
PCLKCR0
0x00 701C
1
Peripheral Clock Control Register 0
PCLKCR1
0x00 701D
1
Peripheral Clock Control Register 1
LPMCR0
0x00 701E
1
Low-Power Mode Control Register 0
Reserved
0x00 701F
1
Reserved
PCLKCR3
0x00 7020
1
Peripheral Clock Control Register 3
PLLCR
0x00 7021
1
PLL Control Register
SCSR
0x00 7022
1
System Control and Status Register
WDCNTR
0x00 7023
1
Watchdog Counter Register
Reserved
0x00 7024
1
Reserved
WDKEY
Reserved
WDCR
DESCRIPTION
0x00 7025
1
Watchdog Reset Key Register
0x00 7026 – 0x00 7028
3
Reserved
0x00 7029
1
Watchdog Control Register
Reserved
0x00 702A – 0x00 702D
4
Reserved
MAPCNF
0x00 702E
1
ePWM/HRPWM Re-map Register
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8.6.1 OSC and PLL Block
Figure 8-30 shows the OSC and PLL block.
OSCCLK
XCLKIN
(3.3-V clock input
from external
oscillator)
OSCCLK
0
PLLSTS[OSCOFF]
PLL
OSCCLK or
VCOCLK
VCOCLK
n
/1
/2
CLKIN
To
CPU
/4
n≠ 0
PLLSTS[PLLOFF]
External
Crystal or
Resonator
PLLSTS[DIVSEL]
X1
On-chip
oscillator
4-bit Multiplier PLLCR[DIV]
X2
Figure 8-30. OSC and PLL Block Diagram
The on-chip oscillator circuit enables a crystal/resonator to be attached to the 2833x/2823x devices using the X1
and X2 pins. If the on-chip oscillator is not used, an external oscillator can be used in either one of the following
configurations:
• A 3.3-V external oscillator can be directly connected to the XCLKIN pin. The X2 pin should be left
unconnected and the X1 pin tied low. The logic-high level in this case should not exceed VDDIO.
• A 1.9-V (1.8-V for 100 MHz devices) external oscillator can be directly connected to the X1 pin. The X2 pin
should be left unconnected and the XCLKIN pin tied low. The logic-high level in this case should not exceed
VDD.
The three possible input-clock configurations are shown in Figure 8-31 to Figure 8-33.
XCLKIN
X1
X2
NC
External Clock Signal
(Toggling 0-VDDIO)
Figure 8-31. Using a 3.3-V External Oscillator
XCLKIN
X1
X2
External Clock Signal
(Toggling 0-VDD)
NC
Figure 8-32. Using a 1.9-V External Oscillator
X1
XCLKIN
X2
CL2
CL1
Crystal
Figure 8-33. Using the Internal Oscillator
176
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8.6.1.1 External Reference Oscillator Clock Option
The typical specifications for the external quartz crystal for a frequency of 30 MHz follow:
•
•
•
•
•
Fundamental mode, parallel resonant
CL (load capacitance) = 12 pF
CL1 = CL2 = 24 pF
Cshunt = 6 pF
ESR range = 25 to 40 Ω
TI recommends that customers have the resonator/crystal vendor characterize the operation of their device with
the MCU chip. The resonator/crystal vendor has the equipment and expertise to tune the tank circuit. The vendor
can also advise the customer regarding the proper tank component values that will produce proper start-up and
stability over the entire operating range.
8.6.1.2 PLL-Based Clock Module
The devices have an on-chip, PLL-based clock module. This module provides all the necessary clocking signals
for the device, as well as control for low-power mode entry. The PLL has a 4-bit ratio control PLLCR[DIV] to
select different CPU clock rates. The watchdog module should be disabled before writing to the PLLCR register.
It can be re-enabled (if need be) after the PLL module has stabilized, which takes 131072 OSCCLK cycles.
The input clock and PLLCR[DIV] bits should be chosen in such a way that the output frequency of the PLL
(VCOCLK) does not exceed 300 MHz.
Table 8-36. PLL Settings
(1)
(2)
(3)
(4)
PLLCR[DIV] VALUE(2) (3)
PLLSTS[DIVSEL] = 0 or 1(1)
0000 (PLL bypass)
0001
SYSCLKOUT (CLKIN)
PLLSTS[DIVSEL] = 2(1)
PLLSTS[DIVSEL] = 3(1) (4)
OSCCLK/4 (Default)
OSCCLK/2
OSCCLK
(OSCCLK * 1)/4
(OSCCLK * 1)/2
–
0010
(OSCCLK * 2)/4
(OSCCLK * 2)/2
–
0011
(OSCCLK * 3)/4
(OSCCLK * 3)/2
–
0100
(OSCCLK * 4)/4
(OSCCLK * 4)/2
–
0101
(OSCCLK * 5)/4
(OSCCLK * 5)/2
–
0110
(OSCCLK * 6)/4
(OSCCLK * 6)/2
–
0111
(OSCCLK * 7)/4
(OSCCLK * 7)/2
–
1000
(OSCCLK * 8)/4
(OSCCLK * 8)/2
–
1001
(OSCCLK * 9)/4
(OSCCLK * 9)/2
–
1010
(OSCCLK * 10)/4
(OSCCLK * 10)/2
–
1011 – 1111
Reserved
Reserved
Reserved
By default, PLLSTS[DIVSEL] is configured for /4. (The boot ROM changes this to /2.) PLLSTS[DIVSEL] must be 0 before writing to the
PLLCR and should be changed only after PLLSTS[PLLLOCKS] = 1.
The PLL control register (PLLCR) and PLL Status Register (PLLSTS) are reset to their default state by the XRS signal or a watchdog
reset only. A reset issued by the debugger or the missing clock detect logic have no effect.
This register is EALLOW protected. See the System Control and Interrupts chapter of the TMS320x2833x, TMS320x2823x Real-Time
Microcontrollers Technical Reference Manual for more information.
A divider at the output of the PLL is necessary to ensure correct duty cycle of the clock fed to the core. For this reason, a DIVSEL
value of 3 is not allowed when the PLL is active.
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Table 8-37. CLKIN Divide Options
(1)
PLLSTS [DIVSEL]
CLKIN DIVIDE
0
/4
1
/4
2
/2
3
/1(1)
This mode can be used only when the PLL is bypassed or off.
The PLL-based clock module provides two modes of operation:
•
Crystal-operation - This mode allows the use of an external crystal/resonator to provide the time base to the
device.
External clock source operation - This mode allows the internal oscillator to be bypassed. The device clocks
are generated from an external clock source input on the X1 or the XCLKIN pin.
•
Table 8-38. Possible PLL Configuration Modes
REMARKS
PLLSTS[DIVSEL]
CLKIN AND
SYSCLKOUT
PLL Off
Invoked by the user setting the PLLOFF bit in the PLLSTS register. The PLL block
is disabled in this mode. This can be useful to reduce system noise and for low
power operation. The PLLCR register must first be set to 0x0000 (PLL Bypass)
before entering this mode. The CPU clock (CLKIN) is derived directly from the
input clock on either X1/X2, X1 or XCLKIN.
0, 1
2
3
OSCCLK/4
OSCCLK/2
OSCCLK/1
PLL Bypass
PLL Bypass is the default PLL configuration upon power up or after an external
reset ( XRS). This mode is selected when the PLLCR register is set to 0x0000
or while the PLL locks to a new frequency after the PLLCR register has been
modified. In this mode, the PLL itself is bypassed but the PLL is not turned off.
0, 1
2
3
OSCCLK/4
OSCCLK/2
OSCCLK/1
PLL Enable
Achieved by writing a nonzero value n into the PLLCR register. Upon writing to the
PLLCR the device will switch to PLL Bypass mode until the PLL locks.
0, 1
2
OSCCLK*n/4
OSCCLK*n/2
PLL MODE
8.6.1.3 Loss of Input Clock
In PLL-enabled and PLL-bypass mode, if the input clock OSCCLK is removed or absent, the PLL will still issue
a limp-mode clock. The limp-mode clock continues to clock the CPU and peripherals at a typical frequency of
1–5 MHz. Limp mode is not specified to work from power up, only after input clocks have been present initially.
In PLL bypass mode, the limp mode clock from the PLL is automatically routed to the CPU if the input clock is
removed or absent.
Normally, when the input clocks are present, the watchdog counter decrements to initiate a watchdog reset or
WDINT interrupt. However, when the external input clock fails, the watchdog counter stops decrementing (that
is, the watchdog counter does not change with the limp-mode clock). In addition to this, the device will be reset
and the “Missing Clock Status” (MCLKSTS) bit will be set. These conditions could be used by the application
firmware to detect the input clock failure and initiate necessary shut-down procedure for the system.
Note
Applications in which the correct CPU operating frequency is absolutely critical should implement a
mechanism by which the MCU will be held in reset, should the input clocks ever fail. For example,
an R-C circuit may be used to trigger the XRS pin of the MCU, should the capacitor ever get fully
charged. An I/O pin may be used to discharge the capacitor on a periodic basis to prevent it from
getting fully charged. Such a circuit would also help detect failure of the flash memory and the VDD3VFL
rail.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
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8.6.2 Watchdog Block
The watchdog block on the 2833x/2823x device is similar to the one used on the 240x and 281x devices.
The watchdog module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit
watchdog up counter has reached its maximum value. To prevent this, the user disables the counter or the
software must periodically write a 0x55 + 0xAA sequence into the watchdog key register which will reset the
watchdog counter. Figure 8-34 shows the various functional blocks within the watchdog module.
WDCR (WDPS[2:0])
WDCR (WDDIS)
WDCNTR(7:0)
OSCCLK
Watchdog
Prescaler
/512
WDCLK
8-Bit
Watchdog
Counter
CLR
SCSR(WDOVERRIDE)
Clear Counter
Internal
Pullup
WDKEY(7:0)
Watchdog
55 + AA
Key Detector
WDRST
Generate
Output Pulse
WDINT
(512 OSCCLKs)
Good K ey
XRS
Core-reset
WDCR (WDCHK[2:0])
WDRST(A)
A.
1
0
Bad
WDCHK
Key
SCSR (WDENINT)
1
The WDRST signal is driven low for 512 OSCCLK cycles.
Figure 8-34. Watchdog Module
The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.
In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains functional is
the watchdog. The WATCHDOG module will run off OSCCLK. The WDINT signal is fed to the LPM block so that
it can wake the device from STANDBY (if enabled). See Section 8.7, Low-Power Modes Block, for more details.
In IDLE mode, the WDINT signal can generate an interrupt to the CPU, through the PIE, to take the CPU out of
IDLE mode.
In HALT mode, this feature cannot be used because the oscillator (and PLL) are turned off and hence so is the
WATCHDOG.
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8.7 Low-Power Modes Block
The low-power modes on the 2833x/2823x devices are similar to the 240x devices. Table 8-39 summarizes the
various modes.
Table 8-39. Low-Power Modes
EXIT(1)
MODE
LPMCR0(1:0)
OSCCLK
CLKIN
SYSCLKOUT
IDLE
00
On
On
On(2)
XRS, watchdog interrupt, any enabled
interrupt, XNMI
STANDBY
01
On
(watchdog still running)
Off
Off
XRS, watchdog interrupt, GPIO Port A
signal, debugger(3), XNMI
HALT
1X
Off
(oscillator and PLL turned off,
watchdog not functional)
Off
Off
XRS, GPIO port A signal, XNMI,
debugger(3)
(1)
(2)
(3)
The EXIT column lists which signals or under what conditions the low-power mode will be exited. A low signal, on any of the signals,
will exit the low power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise,
the IDLE mode will not be exited and the device will go back into the indicated low-power mode.
The IDLE mode on the C28x behaves differently than on the 24x/240x. On the C28x, the clock output from the CPU (SYSCLKOUT) is
still functional while on the 24x/240x the clock is turned off.
On the C28x, the JTAG port can still function even if the CPU clock (CLKIN) is turned off.
The various low-power modes operate as follows:
IDLE mode:
This mode is exited by any enabled interrupt or an XNMI that is recognized by
the processor. The LPM block performs no tasks during this mode as long as the
LPMCR0(LPM) bits are set to 0,0.
STANDBY mode:
Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY mode.
The user must select which signal(s) will wake the device in the GPIOLPMSEL
register. The selected signal(s) are also qualified by the OSCCLK before waking
the device. The number of OSCCLKs is specified in the LPMCR0 register.
HALT mode:
Only the XRS and any GPIO port A signal (GPIO[31:0]) can wake the device from
HALT mode. The user selects the signal in the GPIOLPMSEL register.
Note
The low-power modes do not affect the state of the output pins (PWM pins included). They will be in
whatever state the code left them in when the IDLE instruction was executed. See the System Control
and Interrupts chapter of the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical
Reference Manual for more details.
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9 Applications, Implementation, and Layout
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 TI Reference Design
The TI Reference Design Library is a robust reference design library spanning analog, embedded processor,
and connectivity. Created by TI experts to help you jump start your system design, all reference designs include
schematic or block diagrams, BOMs, and design files to speed your time to market.
Search and download other TI reference designs at Select TI reference designs.
EtherCAT Interface for High Performance MCU Reference Design
This reference design demonstrates how to connect a C2000 Delfino MCU to an EtherCAT® ET1100 slave
controller. The interface supports both de-multiplexed address/data buses for maximum bandwidth and minimum
latency and a SPI mode for low pin-count EtherCAT communication. The slave controller offloads the processing
of 100Mbps Ethernet-based fieldbus communication, thereby eliminating CPU overhead for these tasks.
C2000 Resolver to Digital Conversion Kit
This is a motherboard-style Resolver to Digital conversion kit used to experiment with various C2000
microcontrollers for software-based resolver to digital conversion using on-chip ADCs. The Resolver Kit also
allows interface to resolvers and inverter control processor.
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10 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
10.1 Getting Started and Next Steps
This section gives a brief overview of the steps to take when first developing for a C28x device. For more detail
on each of these steps, see the following:
•
•
•
Start development with our C2000™ real-time microcontrollers
C2000 real-time microcontrollers – Motor control
C2000 real-time microcontrollers – Solar & digital power
The Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) Getting Started Guide covers all
aspects of development with C2000 devices from hardware to support resources. In addition to key reference
documents, each section provides relevant links and resources to further expand on the information covered.
10.2 Device and Development Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320™ MCU devices and support tools. Each TMS320™ commercial family member has one of three
prefixes: TMX, TMP, or TMS (for example, TMS320F28335). Texas Instruments recommends two of three
possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages
of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/
tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device's electrical specifications and
may not use production assembly flow.
TMP Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical
specifications.
TMS Production version of the silicon die that is fully qualified.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully-qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
Production devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package
type (for example, ZJZ) and temperature range (for example, A). Figure 10-1 provides a legend for reading the
complete device name for any family member.
For device part numbers and further ordering information, see the Package Option Addendum at the end of this
document, the TI website (www.ti.com), or contact your TI sales representative.
For additional description of the device nomenclature markings on the die, see the TMS320F2833x,
TMS320F2823x Real-Time MCUs Silicon Errata.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
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Generic Part Number:
TMS
320
F
28335
Orderable Part Number:
TMS
320
F
28335
-Q1
ZJZ
A
R
PREFIX
SHIPPING OPTIONS
TMX = experimental device
TMP = prototype device
TMS = qualified device
Blank = Tray
R = Tape and Reel
QUALIFICATION (in Generic Part Number)
DEVICE FAMILY
Blank = Non-Automotive
-Q1 = Q1 refers to Automotive AEC-Q100 Grade 1 qualification
320 = TMS320 DSP Family
TEMPERATURE RANGE (in Orderable Part Number)
A = –40°C to 85°C
S = –40°C to 125°C
Q = –40°C to 85°C
TECHNOLOGY
F = Flash EEPROM
(1.9-V or 1.8-V core, 3.3-V I/O)
PACKAGE TYPE(A)
PGF = 176-pin LQFP
PTP = 176-pin HLQFP
ZJZ = 176-ball plastic BGA (Lead-free)
ZHH = 179-ball MicroStar BGA™ (Lead-free)
ZAY = 179-ball nFBGA (Lead-free)
DEVICE
28335
28334
28333
28332
28235
28234
28232
A.
LQFP = Low-Profile Quad Flatpack
HLQFP = Thermally Enhanced Low Profile Quad Flat Package
BGA = Ball Grid Array
nFBGA = New Fine Pitch Ball Grid Array
Figure 10-1. Example of F2833x, F2823x Device Nomenclature
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10.3 Tools and Software
TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of
the device, generate code, and develop solutions are listed below. To view all available tools and software for
C2000™ real-time control MCUs, visit the Start development with our C2000™ real-time microcontrollers page.
Design Kits and Evaluation Modules
C2000 DesignDRIVE Development Kit for Industrial Motor Control
DesignDRIVE is a single hardware and software platform that makes it easy to develop and evaluate solutions
for many industrial drive, motor control, and servo topologies. DesignDRIVE offers support for a wide variety
of motor types, sensing technologies, encoder standards and communications networks, as well as easy
expansion to develop with industrial communications and functional safety topologies, thus enabling more
comprehensive, integrated drive system solutions. Based on the real-time control architecture of TI’s C2000
microcontrollers (MCUs), DesignDRIVE is ideal for the development of industrial inverter and servo drives used
in robotics, computer numerical control machinery (CNC), elevators, materials conveyance and other industrial
manufacturing applications.
C2000 Delfino MCU F28379D LaunchPad™ development kit
LAUNCHXL-F28379D is a low-cost evaluation and development tool for the TMS320F2837xD,
TMS320F2837xS, and TMS320F2807x products in the TI MCU LaunchPad™ development kit ecosystem which
is compatible with various plug-on BoosterPacks (suggested under the recommended BoosterPack™ Plug-in
Modules in the features section below). This extended version of the LaunchPad development kit supports the
connection of two BoosterPacks. The LaunchPad development kit provides a standardized and easy to use
platform to use while developing your next application.
TMS320F28335 Experimenter Kit
C2000™ MCU Experimenter Kits provide a robust hardware prototyping platform for real-time, closed loop
control development with C2000 microcontrollers. This platform is a great tool to customize and prove-out
solutions for many common power electronics applications, including motor control, digital power supplies, solar
inverters, digital LED lighting, precision sensing, and more.
Software
C2000 DesignDRIVE Software for Industrial Drives and Motor Control
The DesignDRIVE platform combines software solutions with DesignDRIVE Development Kits to make it easy to
develop and evaluate solutions for many industrial drive and servo topologies. DesignDRIVE offers support
for a wide variety of motor types, sensing technologies, position sensors and communications networks,
including specific examples for vector control of motors, incorporating current, speed and position loops, to
help developers jump-start their evaluation and development. Based on the real-time control architecture of TI’s
C2000™ microcontrollers (MCUs), DesignDRIVE is ideal for the development of industrial inverter and servo
drives used in robotics, computer numerical control machinery (CNC), elevators, materials conveyance and
other industrial manufacturing applications.
C2000 SafeTI™ 60730 SW Packages
The C2000 MCU SafeTI-60730 Software package includes UL-certified, as recognized components, SafeTI™
software packages that help make designing for functional safety consumer applications with TI C2000™
real-time control microcontrollers (MCUs) easier and faster. The software in these SafeTI software packages
is UL-certified, as recognized components, to the UL 1998:2008 Class 1 standard, and is compliant with
IEC 60730-1:2010 Class B, both of which include home appliances, arc detectors, power converters, power
tools, e-bikes, and many others. SafeTI software packages are available for select TI C2000 MCUs and
can be embedded in applications using these MCUs to help customers simplify certification for functional
safety-compliant consumer devices. Because of the similarity of the two standards, the IEC 60730 software
libraries can also help assist customers developing consumer applications compliant with the IEC 60335-1:2010
standard.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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powerSUITE Digital Power Supply Software Frequency Response Analyzer Tool for C2000™ MCUs
The Software Frequency Response Analyzer (SFRA) is one of several tools included in the powerSUITE Digital
Power Supply Design Software Tools for C2000™ Microcontrollers. The SFRA includes a software library that
enables developers to quickly measure the frequency response of their digital power converter. The SFRA library
contains software functions that inject a frequency into the control loop and measure the response of the system
using the C2000 MCUs’ on-chip analog to digital converter (ADC). This process provides the plant frequency
response characteristics and the open loop gain frequency response of the closed loop system. The user can
then view the plant and open loop gain frequency response on a PC-based GUI. All of the frequency response
data is exported into a CSV file, or optionally an Excel spreadsheet, which can then be used to design the
compensation loop using the Compensation Designer.
C2000Ware for C2000 MCUs
C2000Ware for C2000™ microcontrollers is a cohesive set of development software and documentation
designed to minimize software development time. From device-specific drivers and libraries to device peripheral
examples, C2000Ware provides a solid foundation to begin development and evaluation of your product.
Development Tools
C2000 Gang Programmer
The C2000 Gang Programmer is a C2000 device programmer that can program up to eight identical C2000
devices at the same time. The C2000 Gang Programmer connects to a host PC using a standard RS-232 or
USB connection and provides flexible programming options that allow the user to fully customize the process.
Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 Microcontrollers
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller
and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and
debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build
environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface
taking the user through each step of the application development flow. Familiar tools and interfaces allow
users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse
software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich
development environment for embedded developers.
Uniflash Standalone Flash Tool
CCS Uniflash is a standalone tool used to program on-chip flash memory on TI MCUs.
C2000 Third-party search tool TI has partnered with multiple companies to offer a wide range of solutions and
services for TI C2000 devices. These companies can accelerate your path to production using C2000 devices.
Download this search tool to quickly browse third-party details and find the right third-party to meet your needs.
Models
Various models are available for download from the product Design & development pages. These models
include I/O Buffer Information Specification (IBIS) Models and Boundary-Scan Description Language (BSDL)
Models. To view all available models, visit the Design tools & simulation section of the Design & development
page for each device.
Training
To help assist design engineers in taking full advantage of the C2000 microcontroller features and performance,
TI has developed a variety of training resources. Utilizing the online training materials and downloadable
hands-on workshops provides an easy means for gaining a complete working knowledge of the C2000
microcontroller family. These training resources have been designed to decrease the learning curve, while
reducing development time, and accelerating product time to market. For more information on the various
training resources, visit the C2000™ real-time control MCUs – Support & training site.
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10.4 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
The current documentation that describes the processor, related peripherals, and other technical collateral is
listed below.
Errata
TMS320F2833x, TMS320F2823x Real-Time MCUs Silicon Errata describes the advisories and usage notes for
different versions of silicon.
Technical Reference Manual
TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual details the integration,
the environment, the functional description, and the programming models for each peripheral and subsystem in
the TMS320x2833x and TMS320x2823x devices.
CPU User's Guides
TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and
the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). It also
describes emulation features available on these DSPs.
TMS320C28x Extended Instruction Sets Technical Reference Manual describes the architecture, pipeline, and
instruction set of the TMU, VCU-II, and FPU accelerators.
Peripheral Guides
C2000 Real-Time Control MCU Peripherals Reference Guide describes the peripheral reference guides of the
28x digital signal processors (DSPs).
Tools Guides
TMS320C28x Assembly Language Tools v22.6.0.LTS User’s Guide describes the assembly language tools
(assembler and other tools used to develop assembly language code), assembler directives, macros, common
object file format, and symbolic debugging directives for the TMS320C28x device.
TMS320C28x Optimizing C/C++ Compiler v22.6.0.LTS User’s Guide describes the TMS320C28x C/C++
compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly
language source code for the TMS320C28x device.
TMS320C28x DSP/BIOS 5.x Application Programming Interface (API) Reference Guide describes development
using DSP/BIOS.
Application Reports
The SMT & packaging application notes website lists documentation on TI’s surface mount technology (SMT)
and application notes on a variety of packaging-related topics.
TMS320x281x to TMS320x2833x or 2823x Migration Overview describes how to migrate from the 281x device
design to 2833x or 2823x designs.
TMS320x280x to TMS320x2833x or 2823x Migration Overview describes how to migrate from a 280x device
design to 2833x or 2823x designs.
TMS320C28x FPU Primer provides an overview of the floating-point unit (FPU) in the C2000™ Delfino
microcontroller devices.
Running an Application from Internal Flash Memory on the TMS320F28xxx DSP covers the requirements
needed to properly configure application software for execution from on-chip flash memory. Requirements for
both DSP/BIOS and non-DSP/BIOS projects are presented. Example code projects are included.
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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
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Programming TMS320x28xx and TMS320x28xxx Peripherals in C/C++ explores a hardware abstraction layer
implementation to make C/C++ coding easier on 28x DSPs. This method is compared to traditional #define
macros and topics of code efficiency and special case registers are also addressed.
Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x Microcontroller presents a method
for using the on-chip pulse width modulated (PWM) signal generators on the TMS320F280x family of
microcontrollers as a digital-to-analog converter (DAC).
TMS320F280x Microcontroller USB Connectivity using the TUSB3410 USB-to-UART Bridge Chip presents
hardware connections as well as software preparation and operation of the development system using a simple
communication echo program.
Using the Enhanced Quadrature Encoder Pulse (eQEP) Module in TMS320x280x, 28xxx as a Dedicated
Capture provides a guide for the use of the eQEP module as a dedicated capture unit and is applicable to
the TMS320x280x, 28xxx family of processors.
Using the ePWM Module for 0% - 100% Duty Cycle Control provides a guide for the use of the ePWM module to
provide 0% to 100% duty cycle control and is applicable to the TMS320x280x family of processors.
TMS320x280x and TMS320F2801x ADC Calibration describes a method for improving the absolute accuracy of
the 12-bit ADC found on the TMS320x280x and TMS320F2801x devices. Inherent gain and offset errors affect
the absolute accuracy of the ADC. The methods described in this report can improve the absolute accuracy of
the ADC to levels better than 0.5%. This application report has an option to download an example program that
executes from RAM on the F2808 EzDSP.
Online Stack Overflow Detection on the TMS320C28x DSP presents the methodology for online stack overflow
detection on the TMS320C28x DSP. C-source code is provided that contains functions for implementing the
overflow detection on both DSP/BIOS and non-DSP/BIOS applications.
PowerPAD™ Thermally Enhanced Package focuses on the specifics of integrating a PowerPAD™ package into
the PCB design.
Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor
devices for shipment to end users.
Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime
of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general
engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.
Semiconductor and IC Package Thermal Metrics describes traditional and new thermal metrics and puts their
application in perspective with respect to system-level junction temperature estimation.
An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS
including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/
output structures and future trends.
Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders for
serial programming a device.
nFBGA Packaging provides technical background on nFBGA packages and explains how to use them to build
advanced board layouts.
10.5 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.6 Trademarks
Code Composer Studio™, DSP/BIOS™, MicroStar BGA™, C2000™, PowerPAD™, TI E2E™, and MicroStar
Junior™ are trademarks of Texas Instruments.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
187
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
EtherCAT® is a registered trademark of Beckhoff Automation GmbH, Germany.
All trademarks are the property of their respective owners.
10.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.8 Glossary
TI Glossary
188
This glossary lists and explains terms, acronyms, and definitions.
Submit Document Feedback
Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333
TMS320F28332, TMS320F28235, TMS320F28235-Q1
TMS320F28234, TMS320F28234-Q1, TMS320F28232, TMS320F28232-Q1
www.ti.com
SPRS439Q – JUNE 2007 – REVISED AUGUST 2022
11 Mechanical, Packaging, and Orderable Information
11.1 Package Redesign Details
Explanation
The devices in the MicroStar BGA™ packaging were redesigned using a laminate nFBGA package. This nFBGA
package offers data-sheet-equivalent electrical performance. It is also footprint-equivalent to the MicroStar BGA.
For more details, refer to the nFBGA Packaging Application Report.
Use the new package designator in place of the discontinued package designator throughout the document (see
Table 11-1).
The PACKAGE OPTION ADDENDUM at the end of this data sheet will reflect the new package designator.
See the updated nFBGA package drawings at the end of this data sheet.
Table 11-1. Package Designator
OLD PACKAGE DESIGNATOR
NEW PACKAGE DESIGNATOR
ZHH
ZAY
Reason for Discontinuance
Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA
and MicroStar Junior™ BGA packaging devices and offering a Last Time Buy.
These devices have now been converted to an nFBGA package.
Devices Affected
Table 11-2 describes the devices affected, the old package designator, and the new package designator.
Table 11-2. Devices and Nomenclature
DEVICE
DISCONTINUED MicroStar BGA DEVICE
REDESIGNED LAMINATE nFBGA DEVICE
TMS320F2823x
TMS320F28232ZHHA
TMS320F28234ZHHA
TMS320F28232ZAYA
TMS320F28234ZAYA
TMS320F2833x
TMS320F28334ZHHA
TMS320F28335ZHHA
TMS320F28334ZAYA
TMS320F28335ZAYA
11.2 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
To learn more about TI packaging, visit the Packaging website.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
Product Folder Links: TMS320F28335 TMS320F28335-Q1 TMS320F28334 TMS320F28333 TMS320F28332
TMS320F28235 TMS320F28235-Q1 TMS320F28234 TMS320F28234-Q1 TMS320F28232 TMS320F28232-Q1
189
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
(4/5)
(6)
TMS320F28232PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28232PGFA
TMS320
TMS320F28232PTPQ
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28232PTPQ
TMS320F28232PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28232PTPS
TMS320F28232ZAYA
ACTIVE
NFBGA
ZAY
179
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TMS320
F28232ZAYA
TMS320F28234PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28234PGFA
TMS320
TMS320F28234PTPQ
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28234PTPQ
TMS320F28234PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28234PTPS
TMS320F28234ZAYA
ACTIVE
NFBGA
ZAY
179
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TMS320
F28234ZAYA
TMS320F28234ZJZA
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
320F28234ZJZA
TMS
TMS320F28234ZJZQ
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28234ZJZQ
TMS
TMS320F28234ZJZS
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28234ZJZS
TMS
TMS320F28235PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28235PGFA
TMS320
TMS320F28235PTPQ
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28235PTPQ
TMS320F28235PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28235PTPS
TMS320F28235ZJZA
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
320F28235ZJZA
TMS
TMS320F28235ZJZQ
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28235ZJZQ
TMS
TMS320F28235ZJZQR
ACTIVE
BGA
ZJZ
176
1000
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28235ZJZQ
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
26-May-2021
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMS
TMS320F28235ZJZS
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28235ZJZS
TMS
TMS320F28332PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28332PGFA
TMS320
TMS320F28332PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28332PTPS
TMS320F28333PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28333PGFA
TMS320
TMS320F28334PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28334PGFA
TMS320
TMS320F28334PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
TMS320F28334ZAYA
ACTIVE
NFBGA
ZAY
179
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TMS320
F28334ZAYA
TMS320F28334ZJZA
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
320F28334ZJZA
TMS
TMS320F28334ZJZS
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28334ZJZS
TMS
TMS320F28335PGFA
ACTIVE
LQFP
PGF
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 85
F28335PGFA
TMS320
TMS320F28335PTPQ
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28335PTPQ
TMS320F28335PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-4-260C-72 HR
-40 to 125
TMS320
F28335PTPS
TMS320F28335ZAYA
ACTIVE
NFBGA
ZAY
179
160
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TMS320
F28335ZAYA
TMS320F28335ZAYAR
ACTIVE
NFBGA
ZAY
179
1000
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
TMS320
F28335ZAYA
TMS320F28335ZJZA
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 85
320F28335ZJZA
TMS
TMS320F28335ZJZQ
ACTIVE
BGA
ZJZ
176
126
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28335ZJZQ
TMS
TMS320F28335ZJZQR
ACTIVE
BGA
ZJZ
176
1000
RoHS & Green
SNAGCU
Level-3-260C-168 HR
-40 to 125
320F28335ZJZQ
TMS
Addendum-Page 2
TMS320
F28334PTPS
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
26-May-2021
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
RoHS & Green
SNAGCU
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMS320F28335ZJZS
ACTIVE
BGA
ZJZ
176
126
Level-3-260C-168 HR
-40 to 125
320F28335ZJZS
TMS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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