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TMDSEVM5517

TMDSEVM5517

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    Module

  • 描述:

    EVAL MODULE FOR TMS320C5517

  • 数据手册
  • 价格&库存
TMDSEVM5517 数据手册
User's Guide SPRUHW2 – June 2019 C5517 Evaluation Module (EVM) This user's guide describes the hardware architecture of the C5517 Evaluation Module (TMDSEVM5517). 1 2 3 4 5 6 7 8 9 Contents About C5517 ................................................................................................................. 2 EVM Support Page .......................................................................................................... 2 Hardware Configuration ..................................................................................................... 2 I/O Mux Configuration ....................................................................................................... 5 Software and IDE Configuration ........................................................................................... 6 C5517 Boot-Image Programmer ........................................................................................... 9 Common Mistakes in Boot Image User Code .......................................................................... 12 C5517 Jumpers and Switches ............................................................................................ 13 References .................................................................................................................. 16 List of Tables 1 2 3 4 5 6 7 8 9 10 ........................................................................................................................... 2 Clock Selection Options .................................................................................................... 3 Boot Mode Configuration Options ......................................................................................... 3 SW 5........................................................................................................................... 4 SW 6........................................................................................................................... 4 CPU VCC Core Configuration ............................................................................................. 4 SW4 ........................................................................................................................... 5 MMC1/McSPI Mux Options................................................................................................. 5 SW11 .......................................................................................................................... 6 C5517 Jumpers and Switches ............................................................................................ 13 SW3 Trademarks All trademarks are the property of their respective owners. SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 1 About C5517 1 www.ti.com About C5517 C5517 device is a member of TI's C5000 fixed-point Digital Signal Processor (DSP) product family and is designed for low active and standby power consumption. For more information on this device and to view data sheet and technical reference manual, visit the product folder page: http://www.ti.com/product/TMS320C5517. 2 EVM Support Page Spectrum Digital 5517 EVM Support Page (includes schematics, technical reference, BOM, BSL, and so forth). 3 Hardware Configuration 3.1 Quick Start Guide For quick configuration and out of the box experience, see the Quick Start Guide that ships with the EVM [2]. 3.2 Boot Mode Configuration C5517 general purpose EVM is a robust, configurable platform that can be used with different boot modes. Switch #3 (SW3) is responsible for configuring the boot mode using 8 options. Table 1. SW3 Name Description BOOTMODE0 BOOTMODE[3:0] combine to select the boot source - see table, shared with GP[21]/EMIF_A[15] OFF ON = 1 (high), OFF = 0 (low) - see Table 2 BOOTMODE1 BOOTMODE[3:0] combine to select the boot source - see table, shared with GP[22]/EMIF_A[16] OFF ON = 1 (high), OFF = 0 (low) - see Table 2 BOOTMODE2 BOOTMODE[3:0] combine to select the boot source - see table, shared with GP[23]/EMIF_A[17] OFF ON = 1 (high), OFF = 0 (low) - see Table 2 BOOTMODE3 BOOTMODE[3:0] combine to select the boot source - see table, shared with GP[24]/EMIF_A[18] OFF ON = 1 (high), OFF = 0 (low) - see Table 2 BOOTMODE4 BOOTMODE[5:4] combine to define CLK source for bootloader timings - see table, shared with GP[25]/EMIF_A[19] ON ON = 1 (high), OFF = 0 (low) - see Table 2 BOOTMODE5 BOOTMODE[5:4] combine to define CLK source for bootloader timings - see table, shared with GP[26]/EMIF_A[20] OFF ON = 1 (high), OFF = 0 (low) - see Table 2 NOT USED Not used OFF BOOTM_PULSE_SOURCE ON: BOOTMODE pins asserted for ~200 µS delay after RESET, OFF: MSP430 asserts BOOTMODE pins ON 2 Default C5517 Evaluation Module (EVM) Default Explained/Useful Info BOOTMODE pins asserted only during boot, then Hi-Z so pins can be used as EMIF or GPIO. BOOTMODE pins driven when U13 OEn = LOW, BOOTM_PULSE_SOURCE selects OEn source. MSP430 held in reset by default, use delayed reset. SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Hardware Configuration www.ti.com Pins 3:0 define the actual boot mode and pins 5:4 define the clocking. Table 2. Clock Selection Options SW3 Pins Value BootMode [5:4] 00 Description CLK_SEL = 0: 12 MHz via the on-chip USB oscillator CLK_SEL = 1: 11.2896 MHz via the CLK_IN pin 01 CLK_SEL = 0: 12 MHz via the on-chip USB oscillator CLK_SEL = 1: 12.00 MHz or 12.288 MHz via the CLK_IN pin 10 CLK_SEL = 0: 12 MHz via the on-chip USB oscillator CLK_SEL = 1: 16.8 MHz via the CLK_IN pin 11 CLK_SEL = 0: 12 MHz via the on-chip USB oscillator CLK_SEL = 1: 19.2 MHz via the CLK_IN pin Table 3. Boot Mode Configuration Options SW3 Pins Value Description 0000 Boot mode: 16-bit NOR flash data boot, system clock generator is in bypass mode. 0001 Boot mode: 16-bit or 8-bit NAND flash data boot, system clock generator is in bypass mode. 0010 Boot mode: UART 9600 baud boot, system clock generator output = input clock x 3 0011 Boot mode: UART 57600 baud boot, system clock generator output = input clock x 3 0100 Boot mode: UART 115200 baud boot, system clock generator output = input clock x 3 0101 Boot mode: SPI 16-bit or 24-bit address Boot (SPI_CLK < 1 MHz), system clock generator output = input clock x 3 0110 Boot mode: SPI 16-bit or 24-bit address Boot (SPI_CLK < 10 MHz), system clock generator output = input clock x 3 0111 Polling Mode 2: Check for valid boot image from peripherals in the following order: NOR, NAND, SPI, I2C, SD/SDHC/MMC/eMMC Controller 0, McSPI, and UART/USB (infinite retry).(2) 1000 Boot mode: I2C 16-bit address Boot, 400 kHz, system clock generator is in bypass mode. 1001 Boot mode: SD or SDHC, MMC, or eMMC Controller 0 card boot, system clock generator is in bypass mode 1010 Boot mode: SD or SDHC, MMC, or eMMC Controller 1 card boot, system clock generator is in bypass mode 1011 Polling Mode 1: Check for valid boot image from peripherals in the following order: NOR, NAND, SPI, I2C, SD/SDHC/MMC/eMMC Controller 0, SD/SDHC/MMC/eMMC Controller 1, and UART/USB (infinite retry).(2) 1100 Boot mode: UHPI 16-bit multiplexed mode boot, system clock generator output = input clock x 3 1101 Boot mode: McSPI 24-bit address serial flash at 10-MHz mode 1110 Boot mode: McSPI 24-bit address serial flash at 40-MHz mode 1111 Boot mode: USB boot, system clock generator output = input clock x 3 BootMode [3:0] SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 3 Hardware Configuration 3.3 www.ti.com Power Configuration Similar to boot modes, the power is very configurable on the EVM. The configuration is primarily driven by SW 5 and 6 described in Table 4 and Table 5. 3.4 SW5 Table 4. SW 5 Number Description 1 EN LDO_1V3/IO1 TPS65023 LDO_EN - ON = HIGH = LDOs enabled, LDO1 supplies V1.3, LDO2 supplies VDD_IO1 ON Connected to MSP430 P5.7/TB0.1 (software override) 2 EN VCC_3V3 TPS65023 DCDC3_EN - ON = HIGH = DCDC3 enabled, supplies V3.3 ON Connected to MSP430 P5.6/TB0.0 (software override) 3 EN VCC_1V8 TTPS65023 DCDC2_EN - ON = HIGH = DCDC2 enabled, supplies V1.8 & VDD_IO2 (EMIF) ON Connected to MSP430 P4.7/PM_NONE (software override) 4 EN CPU_CORE TPS65023 DCDC1_EN - ON = HIGH = DCDC1 enabled, supplies CPU_VCC_CORE (1.05V, 1.3V, 1.4V) ON Connected to MSP430 P4.6/PM_NONE (software override) 3.5 Default Default Explained/Useful Info Name SW6 Table 5. SW 6 Number Default Default Explained/Useful Info Name Description 1 CPU_VCC_CORE_0 CPU_VCC_CORE_1 and CPU_VCC_CORE_0 combine to define CPU_VCC_CORE voltage (1.05 V, 1.3 V, or 1.4 V) ON Default to 1.4 V to support 200 MHz SYSCLK, also disable DSP_LDO by default 2 CPU_VCC_CORE_1 CPU_VCC_CORE_1 and CPU_VCC_CORE_0 combine to define CPU_VCC_CORE voltage (1.0 5V, 1.3 V, or 1.4 V) ON See Table 6 3 LDO_1V3 (DEFLD01) ON: LDO_1V3 (DEFLD01) = LOW: V1.3 = 1.3 V OFF: LDO_1V3 (DEFLD01) = HIGH: INVALID ON V1.3 = 1.3 V for all use cases. User MUST not set LDO_1V3 to OFF - will supply V1.3 rail with 1.8 V or 2.8 V 4 VDD_IO1 (DEFLDO2) ON: VDD_IO1 (DEFLDO2) = LOW: VDD_IO1 = 3.3 V OFF: VDD_IO1 (DEFLDO2) = HIGH: VDD_IO1 = 1.8 V ON V1.3 = 1.3 V for all use cases. User MUST not set LDO_1V3 to OFF - will supply V1.3 rail with 1.8 V or 2.8 V Table 6. CPU VCC Core Configuration 4 CPU_VCC_CORE_0 CPU_VCC_CORE_1 OFF OFF CPU_VCC_CORE = 1.05V OFF ON CPU_VCC_CORE = 1.3V ON OFF RESERVED / INVALID ON ON CPU_VCC_CORE = 1.4V (default ??) C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated I/O Mux Configuration www.ti.com 4 I/O Mux Configuration I/O muxing is handled by switch #4 and #11 (see Table 7 and . 4.1 SW4 Table 7. SW4 Number Name Description Default Default Explained/Useful Info 1 HPI_ON OFF: HPI_ON = HIGH: HPI/SPI/I2S/EMIF signals routed to J24, J25, J26 & MSP430 - used as HPI (U7, U33, U15, U16 outputs enabled) ON: HPI_ON = LOW: HPI/SPI/I2S/EMIF signals routed to Codec #2, UART, SPI, EMIF, GPIOs (U65, U23, U29, U21, U10 outputs enabled) ON HPI_ON is in ON position by default supports UART, EMIF boot. MSP430 can drive HPI_ON other way for HPI boot (from MSP430). HPI signals are internally pin muxed with SPI, I2S2, I2S3, EMIF. When pinmux set for HPI, HPI_ON should be OFF: enables switches connecting HPI signals to J24, J25, J26 and MSP430 if J24, J25, J26 are completely populated with jumpers. When pinmux not set for HPI, HPI_ON should be ON: enables switches connecting signals to Codec #2, UART, SPI, EMIF, GPIOs. HPI_ON also connected to MSP430 and IO Expander (U44) pin P04 for software override / input (default as input) 2 SEL_MMC0_I2S OFF = MMC0/I2S0/McBSP mux to I2S (CODEC) ON = MMC0/I2S0/McBSP mux to MMC/SD (MMC/SD boot) ON Supports MMC/SD0 boot 3 SEL1_MMC1_MCSPI OFF = HIGH ON = LOW - SEL1_MMC1_MCSPI and SEL0_MMC1_MCSPI combine to select MMC1/McSPI mux connection OFF Default mux to JP46 header, also connected to IO Expander (U44) for software override / input 4 SEL0_MMC1_MCSPI OFF = HIGH ON = LOW - SEL1_MMC1_MCSPI and SEL0_MMC1_MCSPI combine to select MMC1/McSPI mux connection OFF See Table 8 Table 8. MMC1/McSPI Mux Options SEL1_MMC1_MCSPI SEL0_MMC1_MCSPI OFF OFF MMC1/McSPI mux to header (JP46) OFF ON MMC1/McSPI mux to SPI Flash (U68) - required for McSPI boot from SPI Flash (U68) ON OFF MMC1/McSPI mux to microSD card (J21) & RF Header required for MMC/SD1 boot (microSD) ON ON "MMC1/McSPI mux to MSP430 (U54) through U45 switch required for McSPI boot via MSP430 SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 5 I/O Mux Configuration 4.2 www.ti.com SW11 Table 9. SW11 Number Name Description 1 MSP430_SWOPT0 OFF: MSP430 (U54)P7.7 = Pull-up, ON: MSP430 (U54) P7.7 = GND OFF 2 MSP430_SWOPT1 OFF: MSP430 (U54) P7.6 = Pull-up, ON: MSP430 (U54) P7.6 = GND OFF 3 MSP430_SWOPT2 OFF: MSP430 (U54) P7.5 = Pull-up, ON: MSP430 (U54) P7.5 = GND OFF 4 MSP430_SWOPT3 OFF: MSP430 (U54) P7.4 = Pull-up, ON: MSP430 (U54) P7.4 = GND OFF 5 MSP430_SPI_OEN "OFF: MSP430_SPI_OEn = HIGH: MSP430 SPI signals (after U45 mux) connected to OLED (U82 & U83 outputs enabled) 6 4.3 MSP430_SPI_DIR Default ON: MSP430_SPI_OEn = LOW: MSP430 SPI signals (after U45 mux) connected to C5517 MMC1/McSPI/GPIO mux (U34 & U35 outputs enabled) Default setting supports C5517 writing to OLED by setting MSP430_SPI_OEn = LOW MSP430_SPI_OEN also connected to MSP430 P3.5/TB0.5 (for software override) ON OFF: MSP430_SPI_DIR = HIGH: MSP430 SPI master (SPI_CLK, SPI_CS, SPI_MOSI outputs from MSP430), ON: MSP430_SPI_DIR = LOW: MSP430 SPI slave (SPI_CLK, SPI_CS, SPI_MOSI inputs to MSP430) ON Default Explained/Useful Info C5517 muxed SPI signals (from U23, U29) shorted to MSP430 muxed SPI signals (from U82, U83) at OLED display - for C5517 writing to OLED, MUST avoid contention and never allow SPI_I2S2_S1 = HIGH, SPI_I2S2_S0 = LOW (U23, U29 muxes) whenever MSP430_SPI_OEn = HIGH and MSP430_SPI_DIR = HIGH List of Jumpers and Switches For a full list of jumpers and switches, see Table 10. 4.4 On Board Supplemental MSP430 This is a MSP430F5529 for factory testing and for optional developments. In order to connect an MSP430 JTAG emulator, the MSP430 JTAG emulator needs to be powered after the C5517 EVM is powered on. When a MSP-FET430UIF emulator is used, the pink-edged side of the connector is to align with pins 1-2 of the on-board connector. 5 Software and IDE Configuration The supported IDE recommended for use with C5517 EVM is Category: Code Composer Studio_v6 available for download here [3]. Software development platform is the Low Power Chip Support Library available for download here [4]. Download both packages before getting starting below. 6 C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Software and IDE Configuration www.ti.com 5.1 Chip Support Library Overview The CSL is a collection of functions, macros, and symbols used to configure and control on-chip peripherals. It is fully scalable and it does not require the use of DSP/BIOS components to operate. The benefits of CSL include peripheral ease of use, shortened development time, portability, hardware abstraction, and a level of standardization and compatibility among devices. CSL can be viewed as offering two fundamental levels of peripheral interface to users, a more abstract function-level layer 1 offering a fairly high level of interfaces and protocols, and a lower hardware-detailed register-level layer 2 offering direct symbolic access to all hardware control registers. These two layers are described below: • Function Level CSL -- Higher level interfaces and protocols – Standard Protocol to Program Peripherals: CSL provides developers with a standard protocol to program on-chip peripherals. This protocol includes data types and macros to define peripheral configurations, and functions to implement various operations of each peripheral. – Basic Resource Management: Basic resource management is provided through the use of open and close functions for many of the peripherals. This is especially helpful for peripherals that support multiple channels. • Register Level CSL -- Lower level register-manipulation interface – Symbolic Peripheral Descriptions: A complete symbolic detailed description of all peripheral registers and register fields has been created. It is suggested that developers use the higher level protocols (of CSL layers b. and c.), as these are less device-specific, thus making it easier to migrate code to newer versions of DSPs. 5.2 Configure Code Composer Studio for C5517 EVM 1. Make sure that #define CHIP_C5517 near the top of file \c55_csl_3.07\inc\csl_general.h. is NOT commented out (for example, with a beginning “//”). The only platform available is the C5517_EVM, and that should be enabled in csl_general.h. 2. Open CCSv6. 3. Open Target Configuration for desired target board. • If using the "Spectrum Digital DSK-EVM-eZdsp onboard USB Emulator (J3 mini-USB port on the C5517 EVM), the CCXML file can be imported from • \c55_csl_3.07\ccs_v6.x_examples\Gel_ccxml_Files\C5517EVM_Onboard_E mulator.ccxml • Alternately, create a new target configuration: a. Click on File--> New--> Target Configuration File and enter a file name like "C5517 EVM Onboard Emulator". b. For Connection, choose "Spectrum Digital DSK-EVM-eZdsp onboard USB Emulator". c. For Board or Device, choose EVM5517 then click Save. 4. (IMPORTANT) Click on the Advanced tab at the bottom of the Target Configuration window 5. Click on C55xx under the All Connections window 6. Under CPU Properties click Browse for the initialization script. 7. Select the gel file from the CSL: • \c55_csl_3.07\ccs_v6.x_examples\Gel_ccxml_Files\C5517.gel 8. Save updated configuration. SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 7 Software and IDE Configuration 5.3 www.ti.com Building and Running the CCS v6 Projects NOTE: You cannot have work spaces for older CCS versions in the same folder. If you want to use the main folder as a workspace after using it with an older CCS version, first delete the .metadata folder. 1. For running CCS v6 example projects connect to your Target in CCS (via a suitable emulator such as the “XDS510”, “XDS100” or the EVM’s "Spectrum Digital DSK-EVM-eZdsp onboard USB Emulator"). To use the Onboard emulator, connect a USB A/B cable from your host PC’s USB port to port 'EMU USB'(J3) on the EVM. 2. Start the CCS6 IDE and select the c55_csl_3.07 folder as the CCS work space. 3. Select the menu Project->Import Existing CCS/CCE Eclipse Project…. Browse for the c55_csl_3.07\ccs_v6.x_examples folder and click ok. All the CCS v6 projects will be displayed in the list of projects. Click on “Select All” to select all the projects or manually select the required projects by checking the checkboxes. Leave the “Copy projects into workspace” box unchecked. Click on “Finish”. Projects will be loaded to the CCS. NOTE: To keep the dependency among projects, we highly recommend importing all the projects in one time (by default). 4. Click on the project that you want to test and it will become the active project. 5. Right click on your active project and set the Active Build Configuration as either Debug or Release from Build Configurations -> Set Active. (CCS supports building programs in two distinct modes. Debug mode is used for building programs with little/no compiler optimization enabled. Resulting executables still retain full symbolic debugging information on variables and also linkage information between most points in the executable and the line(s) of source code from which each came. This information generally makes the code easier to debug but also makes it bigger and slower. Release mode, on the other hand, is used for building programs with high degrees of compiler optimization enabled. This eliminates much of the debugsupportive information described above from the executable but makes it smaller and faster.) 6. Select the menu Run --> Debug. The project will be built (if needed) and debugger will be opened. The project will be (re)built here only if needed, as when a piece of involved source code has changed. If a (re)build does occur, you can monitor its progress in a special console sub-window that will open during the build. Any build errors will be reported there for your information. If the build completes without any issues, the program will be loaded to the target with the Debug view opened and the debugger ready to use. NOTE: The menu Run --> Debug recommended above includes an automatic project pre/re-build if needed before debug can commence. If you prefer, you can instead build the project in a separate step first by using menu Project/Build Project. 7. For C5517 -> Select Scripts -> C5517EVM_Configuration to set the PLL to the desired frequency. NOTE: You are only able to see the Scripts menu if using the gel file included with the CSL (see Section 5.2). 8. Select menu Run/Resume to run the project. 8 C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Software and IDE Configuration www.ti.com 5.4 Building and Running Examples Using MSP430 Some of the McSPI and uHPI example code requires external Host / Master /Slave and for this purpose MSP430 will be used. Below information illustrates on how to run McSPI code which involves MSP430. Let’s take an example of - CSL_McSPI_MasterFullDuplex_Example: 1. To run the above example code needs 2 emulators – For C5517 one can use On board emulator and for MSP430 side use MSP430 supported emulator (eg MSP-FET430UIF). 2. Respective CCXML and gel file exists in “ Gel_ccxml_Files” folder. The Path for this folder is: \c55_csl_3.07\ccs_v6.x_examples\Gel_ccxml_Files. Use the respective ccxml and gel files. 3. The programs need to be loaded using 2 different CCS sessions. 4. The project to load from C5517 will be – “CSL_McSPI_MasterFullDuplex_Example” and from MSP430 side – “CSL_McSPIMaster_MSP430Slave_FullDuplex” (Projects to be loaded from MSP430 will have MSP430 mentioned in it. 5. Then follow the read me that exists in each of these projects. Generally the slave code needs to be run first followed by Master code. In the above example MSP430 is run first and then C5517 code. NOTE: While installing CCS, MSP430 device needs to be selected; otherwise the MSP430 related projects will fail to load. 6 C5517 Boot-Image Programmer 6.1 Bootloader Features The bootloader is a program that runs from ROM at power-on and loads a boot-image from a peripheral to the internal RAM of the C5517 DSP. It is always invoked after power-on-reset. Once the transfer is completed, the bootloader switches control to the user code. C5517 added the following boot capabilities. As a result, C5517 can boot from EMIF, UART, SPI, I2C, eMMC, MMC, SD, SDHC, UHPI or USB interface. • Boot an unencrypted image from MMC/SD, USB, McSPI and UHPI • Programmable boot mode at power on reset from input pins, BOOTMODE[3:0]. The following features are similar to what C5515 family offers: • Boot an unencrypted image from NAND, NOR, 16-bit SPI EEPROM, and I2C EEPROM • Two fixed order polling mode in which it checks for a valid boot-image on each supported boot device – Polling mode 1 order is NOR, NAND, SPI, I2C, MMC/SD controller 0, MMC/SD controller 1, UART/USB. – Polling mode 2 order is NOR, NAND, SPI, I2C, MMC/SD controller 0, McSPI, UART/USB. In the polling mode, the first device with valid boot-image is used to load and execute the user code. If none of these devices has a valid boot-image, the bootloader goes into an endless loop checking for data on the UART/USB. If a valid boot image is received, it is used to load and execute user code. If no valid boot-image is received, the bootloader continues to monitor the devices. For details description on how the bootloader works and curtain restrictions, see the C5517 Data Manual Boot Sequence section. If MMCx_CMD is low, the bootloader continues to check for a valid boot image in that card controller (0 or 1). MMCx_CMD must be high or toggle in order to move from card controller to the next peripheral in the polling order. SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 9 C5517 Boot-Image Programmer 6.2 www.ti.com Creating a Un-Encrypted Boot Image A boot image can be created using the hex conversion utility (hex55.exe) versions 4.3.5 or later. Earlier versions may not support the boot table features correctly. The "hex55.exe" can be found in the directory path "\ccsv5\tools\compiler\c5500_4.4.1\bin”. C55x Code Generation Tools can be downloaded from http://software-dl.ti.com/codegen/nonesd/downloads/download.htm#C5500. NOTE: It is very important to make a copy of the "hex55.exe" file in the folder of the file to be converted, otherwise the DOS command will not work. The most common DOS command for generating a non-encrypted boot image: hex55 -i filename.out -o boot_image_file_name.bin -boot -v5505 -b -serial8 NOTE: • • 6.3 The option -v5505 works for all C5517/15/14/05/04/35/34/33/32 family products. V5505 is the first device of this family. The option -serial8 is to specify the boot table is an 8-bit serial interface table. How to Program a Boot Image Onto C5517 EVM Once a boot image (*.bin) is generated, customers can burn the boot image into the NOR Flash, NAND Flash, 16-bit SPI Flash, I2C EEPROM, SPI Flash, McSPI Flash and MMC/SD card, on the C5517 EVM through a utility called programmer that runs on C5517 using an emulator with Code Composer Studio [5] software. NOTE: The instructions stated below applies to the version of programmer in CSL 3.04 only. Choose the device... 1x - NAND Flash [CSx: 2,3,4,5] 2x - NOR Flash [CSx: 2,3,4,5] 4 - IIC EEPROM 5 - MMC 6 - SD 7x - SPI Serial Flash (24 bit address) [PinMap x: 1=MODE5,2=MODE6] 8 - MCSPI Serial Flash 141C:\C5517\filename.bin NAND Flash... Writing data to NAND... Writing Sector 0... Writing Sector 1 (MBR)... Flushing Data... Writing Boot Record... Flushing Data... Opening C:\C5517\filename.bin... Input file opened Writing Boot-image to NAND... Programming... [TotalSize=256 (0x100)] Programming... [TotalSize=512 (0x200)] Programming... [TotalSize=768 (0x300)] . . . Programming... [TotalSize=24832 (0x6100)] Programming... [TotalSize=25088 (0x6200)] Programming... [TotalSize=25200 (0x6270)] Flushing Data... done 10 C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated C5517 Boot-Image Programmer www.ti.com NOTE: NOR Flash must support the Flash reset command (0x00F0 on data) and return to the read array mode afterwards, NOR Flash should support the common flash memory interface (CFI). 221C:\C5517\filename.bin NOR Flash... The Flash ID is Manufacturer Id: 0x1, Spansion S29GLxxxS specific Device Id word: 0x227e, Size Indicator: 0x2221, Spansion S29GLxxxS specific Device Id word: 0x2201 Erasing chip (NOR)... Writing data to device... Opening C:\C5517\filename.bin... Input file opened Programming Complete 41C:\C5517\filename.bin IIC EEPROM... Writing data to device... Opening C:\C5517\filename.bin... Input file opened Programming Complete NOTE: In order to program SPI, requires C5517 EVM SW4/HPI_ON set towards “ON”. 711C:\C5517\filename.bin SPI Serial Flash... SPI Flash ID is: 0x0, 0x0, 0x0, 0x0 Erasing chip, this may take a while... Chip erase done. Writing data to device... Opening C:\C5517\filename.bin... Input file opened Programming Complete 81C:\C5517\filename.bin MCSPI Serial Flash... Erasing chip, this may take a while... Chip erase done. Writing data to device... Opening C:\C5517\filename.bin... Input file opened Programming Complete NOTE: There cannot be any white spaces in the file directory path or the program will not run correctly. Programmer will not be able to find the input file as it considers the white space the end of the input. Please remember that the bootloader runs in a fix order of peripherals for boot image in polling mode; that means all the previous Flash and EEPROM peripherals have to be properly cleaned. 6.4 How to Clear a Boot Image From Flash (cleaner.bin) The bootloader reads the first two bytes from a boot source and checks if it is a valid boot image signature. For unencrypted boot images, this signature is 0x09AA. Without that signature the boot image will not boot. So, to prevent the bootloader from booting, just the first two bytes need to be written/cleared A bootimg.bin file can be edited with a hex editor program to clear the first two bytes. This invalidated bootimage can be written to flash using the same programmer sequence shown in Section 6.3. Any boot image can become a cleaner.bin binary by clearing out the first two bytes. SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 11 Common Mistakes in Boot Image User Code 7 Common Mistakes in Boot Image User Code 7.1 Relying on GEL File for initialization www.ti.com A frequent issue is that the user code works fine in CCS environment but fails to work after converted to boot image. This is most likely because the user code relies on a GEL file in the CCS environment to initialize and setup PLL. This is easily corrected by not using GEL in CCS environment, but instead including all the necessary initialization steps in the user code. It is a good practice to re-initialize everything you need from within your bootloaded user code. Example code to program PLL in user code: // Bypass the PLL as the system clock source asm(" *port(#0x1C1F) = #0x0 "); //Clock Configuration MSW reg // program PLL to 50MHz asm(" *port(#0x1c20) = #0x2055 "); //PLL Control 1 reg asm(" *port(#0x1c21) = #0x0001 "); //PLL Control 2 reg asm(" *port(#0x1c22) = #0x0010 "); //PLL Control 3 reg asm(" *port(#0x1C23) = #0x0001 "); //PLL Control 4 reg // wait at least 4 milli sec for PLL to lock asm(" repeat(0xC350) "); asm(" nop "); // wait 1ms @ 50Mhz: 0x001s * 50 Mhz = 50000 7.2 Loading Code Into SARAM31 Another common mistake is allocating program code to SARAM31 memory. The bootloader writes to SARAM31 (CPU byte address 0x4E000 – 0x4FFFF) thus any user code residing in SARAM31 will be corrupted. Do not use SARAM31 if you intend to convert this code to a boot image. Once the bootloader has finished loading the program into RAM, SARAM31 can be used. How to tell whether SARAM31 is used? Refer to the .cmd file in CCS project folder. The usable SARAM location is defined in the memory section. SARAM is resided in CPU byte address 0x010000 to 0x04FFFF, refer to memory block in data manual, and is partitioned into 32 blocks. This is an example of SARAM31 is used. SARAM is defined as starting from 0x010000 with a length of 0x040000 which ignores all the way to 0x050000 which includes SARAM31 (CPU byte address 0x4E000 – 0x4FFFF). MEMORY { PAGE 0: VEC(RX) : origin = 0000100h length = 000100h SARAM(RW) : origin = 0010000h length = 040000h } 7.3 Ports Idled by Bootloader By the time the bootloader releases control to the user code, all peripheral clocks will be off and all domains in the ICR, except the CPU domain, will be idled. This means that DMA and USB CDMA will not work until the MPORT is enabled. The HWAFFT will not work until HWA port is enabled. EMIF clock is turned off before jumping to bootloaded code. Thus, boot-loading directly to external peripherals on the EMIF is not supported. After the boot process is complete, the user is responsible for enabling and programming the required clock configuration for the DSP. This is the example code to enable the MPORT and disable the FFT HWA. // enable the MPORT and disable HWA *(volatile ioport Uint16 *)0x0001 = 0x020E; asm(" idle"); 12 C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated Common Mistakes in Boot Image User Code www.ti.com 7.4 Software Tools Checklist These are the required tools to test boot from flash or EEPROM: • "hex55.exe" to convert .out COFF file to binary • "programmer.out" to download to flash and EEPROM • CCS to run programmer.out • "5517evm.gel" to set the PLL frequency • "cleaner.bin" file to erase previous boot images from peripherals (see Section 6.4) 8 C5517 Jumpers and Switches Table 10. C5517 Jumpers and Switches Reference Default Description Default Explained/Useful Info J1 pop CLKOUT J2 pop DB9 Serial Port J3 pop Embedded EMU JTAG mini-USB J5 pop Codec 1 Digital Mic / SPI interface J6 no-pop I2C J7 pop Codec 2 Digital Mic / SPI interface J8 pop C5517 DSP JTAG J10 pop Analog Front End interface - power: 1.8V, 3.3V J11 pop CLKIN J13 pop USB to C5517 USB peripheral J14 pop Analog Front End interface - digital signals (I2C, I2S0/2, INT) J15 pop Analog Front End interface - analog signals, GPIOs, I2C mux selects J16 pop eMMC/ SD0 card slot (top) J17 pop MSP430 JTAG J18 pop 5VDC, 4A power jack J19 pop MSP430 mini-USB J20 hidden, no-pop JTAG for Embedded EMU JTAG IC J21 pop eMMC/ SD1 micro-SD card slot (bottom) J22 pop Battery Holder - 2 AAA batteries J23 pop OLED interface (SPI) J24 pop hdr HPI to MSP430 1/3 J25 pop hdr HPI to MSP430 2/3 J26 pop hdr HPI to MSP430 3/3 J27 pop hdr I2S0 BCLK/FS to CODEC 2: 1-3: I2S0_CLK connected to AIC3204 #2 BCLK, 2-4: I2S0_FS connected to AIC3204 #2 WCLK AIC3204 #2 disconnected from I2S0 J28 pop hdr I2S0 TX/RX to CODEC 2: 1-3: I2S0_DX connected to AIC3204 #2 DIN, 2-4: I2S0_RX connected to AIC3204 #2 DOUT AIC3204 #2 disconnected from I2S0 J29 pop & jumper 1-3, 2-4 I2S2 BCLK/FS to CODEC 2: 1-3: I2S2_CLK connected to AIC3204 #2 BCLK, 2-4: I2S2_FS connected to AIC3204 #2 WCLK AIC3204 #2 connects only to I2S2 J30 pop & jumper 1-3, 2-4 I2S2 TX/RX to CODEC 2: I2S2_DX connected to AIC3204 #2 DIN, 2-4: I2S2_RX connected to AIC3204 #2 DOUT AIC3204 #2 connects only to I2S2 Part of embedded emu - not included in schematics (SDI proprietary) J31 pop hdr UART/ I2S3 header JP1 no-pop hdr Shorts around U5 INA219 1k resistor for CVDD / VDDC, parallel to R1 INA219 only works if R1 (1k) not shorted - measures volt drop JP2 pop & jumper 2-3 CVDD from DSP_LDO or external TPS65023 DSP_LDO cannot supply 1.4 V, 1.4 V required for > 200 MHz SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 13 C5517 Jumpers and Switches www.ti.com Table 10. C5517 Jumpers and Switches (continued) Reference Default 14 Description Default Explained/Useful Info JP3 pop & jumper 1-2 RESET source sel -1-2: TPS65023 RESPWRONn pin or 23: SW1 push button In default position 1-2: SW1 push button triggers RESPWRONn pulse low for 95 ms, reset held low 90 ms after power on - important for latching boot mode pins (latched 10 clks after reset released) JP4 pop & jumper 1-2 MAX3222 enable for J2 RS323 DB9 connector disabled by default JP5 no-pop hdr CVDDRTC source sel - 1-2: V1.3 TPS65023 1.3 V VLDO1 2-3: TPS65023 VDCDC1 [1.05 - 1.4 V for CVDD] 0-Ω R140 equivalent to 1-2, V1.3 TPS65023 1.3 V VLDO1 JP6 pop & jumper 2-3 Wakeup pin 1-2: 10k pull-up, 2-3: 10k pull-down Wakeup is active high when an input, pull-down JP7 pop hdr INA219A power meas I2C SDA connector - 1-3: MSP430 3.3 V I2C bus, 2-4: C5517 I2C bus through PCA9306 I2C level shifter jumper in bag, printf instruction during test JP8 no-pop hdr Shorts V3.3A to AIC3204 #1 HPVDD, parallel to 0-Ω R166 0-Ω R166 equivalent to pop, V3.3A to AIC3204 #1 HPVDD JP9 no-pop hdr Shorts V1.8 to AIC3204 #1 AVDD & DVDD supplies, parallel to 0-Ω R165 0- R165 equivalent to pop, V1.8 to AIC3204 #1 AVDD & DVDD JP10 pop & jumper 1-2 CLK_SEL - pop'd: CLK_SEL = 1, CLKIN from OSC1/J11 SMA, not-pop'd: 12 MHz via the on-chip USB oscillator Not-pop'd: bootm[5:4] ignored, can be wrong, but USB voltage must be supplied / Pop'd bootm[5:4] MUST be set correct frequency of OSC1 JP11 pop hdr INA219A power meas I2C SCL connector - 1-3: MSP430 3.3V I2C bus, 2-4: C5517 I2C bus through PCA9306 I2C level shifter Jumper in bag, printf instruction during test JP12 pop & jumper 1-2 AUDIO_MCLK source sel for AIC3204 #1 and #2 1-2: OSC1/J11 SMA, 2-3: C5517 CLKOUT pin C5517 has more CLKOUT sources and divider options that C5515, also less jitter in PLL JP14 pop & jumper 2-3 LDOI source sel: 1-2: V1.8, 2-3: V3.3 no-pop R229 & R238, LDOI has no margin below 1.8V, 1.8V has some tolerance (for example, 1.8 5% = 1.7 V), 1.7 V violates LDOI minimum! JP15 pop & jumper 2-3 AIC3204 #1 (M1,M2, Mic In) MIC_BIAS source sel: 1-2: 10 µF cap to GND-A (V3.3A disconnected) , 2-3: AIC3204 #1 MICBIAS pin" R248 is no-pop, so JP15:1 disconnected from V3.3A, use only 2-3: MICBIAS pin JP16 no-pop hdr Shorts VDD_IO1 to C5517 VDDIO4 (DVDDRTC), parallel to 0-Ω R237 0-Ω R237 equivalent to pop, VDD_IO1 to DVDDRTC JP17 no-pop hdr Shorts VDD_IO1 to AIC3204 #1 IOVDD, parallel to 0-Ω R236 0-Ω R236 equivalent to pop, VDD_IO1 to AIC3204 #1 IOVDD JP18 no-pop hdr Shorts around U36 INA219 1k resistor for USB_VDD_IN (1.3 V), parallel to R37 INA219 only works if R37 (1k) not shorted measures volt drop JP19 no-pop hdr USB_VDD_IN (1.3V) source sel: 1-2: C5517 USB_LDO, 2-3: V1.3 from TPS65023 1.3V VLDO1 0-Ω R263 equivalent to 1-2, C5517 USB_LDO, USB_VDD_IN supplies USB_VDDA1P3 & USB_VDD1P3, also disconnects V3.3 from USB_VDDA3P3 when low (USB power sequencing) JP20 no-pop hdr VDD_SAR source sel: 1-2: C5517 ANA_LDO, 2-3: V1.3 from TPS65023 1.3V VLDO1 0-Ω R262 equivalent to 1-2, C5517 ANA_LDO, VDD_SAR supplies VDDA_ANA, GPAIN switch network (SW8, SW9, SW10, SW13, SW14, SW15, SW16, SW17, SW18, SW19) JP21 no-pop hdr Shorts V1.3 to C5517 VDDA_PLL, parallel to 0-Ω R257 0-Ω R257 equivalent to pop, V1.3 to DVDDRTC to C5517 VDDA_PLL, must be externally powered with 1.3V (MUST NOT connect to C5517 ANA_LDO output) JP22 no-pop hdr Shorts around U38 INA219 1k resistor for DC_VDD_IO2/ DVDDEMIF (1.8 V), parallel to R279 INA219 only works if R279 (1k) not shorted measures volt drop, DC_VDD_IO2 only measures C5517 power consumption JP23 no-pop hdr Shorts around U39 INA219 1k resistor for DC_VDD_IO1 (1.8 V), parallel to R278 INA219 only works if R278 (1k) not shorted measures volt drop, DC_VDD_IO1 only measures C5517 power consumption JP24 pop hdr DSP_LDO_EN: pop'd: DSP_LDO_EN = 0 DSP_LDO enabled, not-pop'd: DSP_LDO_EN = 1 DSP_LDO disabled Jumper in bag, DSP_LDO disabled by default, not used (cannot supply 1.4 V, needed for >200 MHz) JP25 no-pop hdr Shorts V3.3 to C5517 USB_VDDA3P3, USB_VDDPLL, & USBVDD_OSC, parallel to 0-Ω R292 0-Ω R292 equivalent to pop, V3.3 to C5517 USB_VDDA3P3, USB_VDDPLL, & USBVDD_OSC, also disconnects 5 V from USB_VBUS when low (USB power sequencing) JP26 no-pop hdr Shorts around U40 INA219 1k resistor for V1.8, parallel to R294 INA219 only works if R294 (1k) not shorted measures volt drop, V1.8 supplies J10, AIC3204s (U19, U72), U13, U16, & optionally C5517 LDOI JP27 no-pop hdr Shorts TPS65023_LDO_1V3 to V1.3, parallel to 0-Ω R318 0-Ω R318 equivalent to pop, TPS65023_LDO_1V3 to V1.3 C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated C5517 Jumpers and Switches www.ti.com Table 10. C5517 Jumpers and Switches (continued) Reference Default Description Default Explained/Useful Info JP28 pop & jumper 1-2 Shorts around U42 INA219 1k resistor for VIN_EVM, parallel to R331 INA219 only works if R331 (1k high power) not shorted - measures volt drop, but current causes voltage drop so short until needed… VIN_EVM either from J18 power jack or J22 battery holder (JP31 selects) JP29 no-pop hdr Shorts TPS65023_VCC_1V8 to VDD_IO2, parallel to R327 0-Ω R327 equivalent to pop, TPS65023_VCC_1V8 to VDD_IO2 JP30 no-pop hdr Shorts TPS65023_LDO_VLDO2 to VDD_IO1, parallel to R332 0-Ω R332 equivalent to pop, TPS65023_LDO_VLDO2 to VDD_IO1 JP31 pop & jumper 2-3 VIN_EVM source sel: 1-2: J18 Power Jack, 2-3: J22 battery holder through U53 TPS61030 (5V) batteries not included, default to J18 power jack JP32 no-pop hdr Shorts around U55 INA219 1k resistor for V3.3, parallel to R385 INA219 only works if R385 (1k) not shorted measures volt drop, V3.3 supplies J10, P2, AIC3204s (U19, U72), OLED & backlight, OSC1, U1, U2, U18, U65, C5517: CPU_3V3_USB & optionally C5517 LDOI JP33 no-pop hdr Shorts TPS65023_VCC_CORE to CPU_VCC_CORE, parallel to R384 0-Ω R384 equivalent to pop, TPS65023_VCC_CORE to CPU_VCC_CORE, optionally supplies C5517:CVDDRTC (JP5 selects), optionally supplies C5517:CVDD (JP2 selects) JP34 pop & jumper 2-3 VIO_CBTLV source sel: 1-2: V3.3, 2-3: ALT_CBT_V (3.3 V when DVDDIO1 = 3.3 V, 2.5 V when DVDDIO1 = 1.8V) VIO_CBTLV is set to 2.5 V for SN74CB3QXXXX & TS3A27518 switches and level shifters - solves problem of interfacing MSP430 3.3 V signals when C5517 DVDDIO = 1.8 V --> 2.5 V supports VIH thresholds for 1.8V and 3.3V JP45 pop & jumper 1-2 Boot mode assert sel: 1-2 Boot mode asserted by delayed reset pulse or MSP430 (SW3:8 selects), 2-3: Boot mode always asserted Bootmode pins are latched on the 10th clock edge after RESET pin goes high, BOOTM pins muxed with EM_A[20:15]/GP[26:21] signals, must not be externally asserted to be used as outputs JP46 pop hdr "MMC1/McSPI signals present when muxes U69, U70, & U71 route to JP46: [SEL1_MMC1_MCSPI, SEL0_MMC1_MCSPI] = [1, 1] (SW3:3 OFF, SW3:4 OFF U44 I2C IO Expander can override DIP switch settings for SEL1_MMC1_MCSPI & SEL0_MMC1_MCSPI JP47 pop & jumper 1-2 MSP430 power enable: 1-2: 3V3_MSP430 ON, 2-3: 3V3_MSP430 OFF Default: MSP430 powered, held in RESET (JP52) JP48 no-pop hdr Shorts V1.8 to AIC3204 #2 AVDD & DVDD supplies, parallel to 0-Ω R438 0-Ω R438 equivalent to pop, V1.8 to AIC3204 #2 AVDD & DVDD JP49 no-pop hdr Shorts VDD_IO1 to AIC3204 #2 IOVDD, parallel to 0-Ω R439 0-Ω R439 equivalent to pop, VDD_IO1 to AIC3204 #2 IOVDD JP50 pop & jumper 2-3 AIC3204 #2 (Mic In) MIC_BIAS source sel: 1-2: 10 µF cap to GND-A (V3.3A disconnected) , 2-3: AIC3204 #1 MICBIAS pin R441 is no-pop, so JP50:1 disconnected from V3.3A, use only 2-3: MICBIAS pin JP51 no-pop hdr Shorts V3.3A to AIC3204 #2 HPVDD, parallel to 0-Ω R440 0-Ω R440 equivalent to pop, V3.3A to AIC3204 #1 HPVDD JP52 pop & jumper 2-3 MSP430 RESET: 1-2: MSP430 out of RESET, SW12 asserts RESET, 2-3: MSP430 held in RESET always Default: MSP430 powered, held in RESET (JP52) JP53 pop & jumper 2-3 TPA2012 #1 (U74) G0 gain sel: 1-2: G0 = 1, 2-3: G0 = 0 TPA2012 #1 (U74) is speaker driver for CODEC #1, Gain defined by [G1, G0]: [0,0] = 6dB, [0,1] = 12dB, [1,0] = 18dB, [1,1] = 24dB JP54 pop & jumper 2-3 TPA2012 #1 (U74) G1 gain sel: 1-2: G1 = 1, 2-3: G1 = 0 TPA2012 #1 (U74) is speaker driver for CODEC #1, Gain defined by [G1, G0]: [0,0] = 6dB, [0,1] = 12dB, [1,0] = 18dB, [1,1] = 24dB JP55 pop & jumper 1-2 TPA2012 #1 (U74) SDL, left channel shutdown 1-2: left channel active, 2-3: left channel shutdown TPA2012 #1 (U74) is speaker driver for CODEC #1, When SDL/SDR pulled low, channel is shutdown JP56 pop & jumper 1-2 TPA2012 #1 (U74) SDR, right channel shutdown 1-2: right channel active, 2-3: right channel shutdown TPA2012 #1 (U74) is speaker driver for CODEC #1, When SDL/SDR pulled low, channel is shutdown JP57 pop & jumper 2-3 TPA2012 #2 (U75) G0 gain sel: 1-2: G0 = 1, 2-3: G0 = 0 TPA2012 #2 (U75) is speaker driver for CODEC #2, Gain defined by [G1, G0]: [0,0] = 6dB, [0,1] = 12dB, [1,0] = 18dB, [1,1] = 24dB JP58 pop & jumper 2-3 TPA2012 #2 (U75) G1 gain sel: 1-2: G1 = 1, 2-3: G1 = 0 TPA2012 #2 (U75) is speaker driver for CODEC #2, Gain defined by [G1, G0]: [0,0] = 6dB, [0,1] = 12dB, [1,0] = 18dB, [1,1] = 24dB JP59 pop & jumper 1-2 TPA2012 #2 (U75) SDL, left channel shutdown 1-2: left channel active, 2-3: left channel shutdown TPA2012 #2 (U75) is speaker driver for CODEC #2, When SDL/SDR pulled low, channel is shutdown JP60 pop & jumper 1-2 TPA2012 #2 (U75) SDR, right channel shutdown 1-2: right channel active, 2-3: right channel shutdown TPA2012 #2 (U75) is speaker driver for CODEC #2, When SDL/SDR pulled low, channel is shutdown SPRUHW2 – June 2019 Submit Documentation Feedback C5517 Evaluation Module (EVM) Copyright © 2019, Texas Instruments Incorporated 15 References www.ti.com Table 10. C5517 Jumpers and Switches (continued) Reference Default 9 Default Explained/Useful Info pop hdr Pull-up for MMC0_CMD/I2S0_FS/McBSP_FSX - pop'd: 10k Pull-up on MMC0_CMD/I2S0_FS/McBSP_FSX pull-up, not-pop'd: no pull-up required if 1) using polling boot mode, 2)booting past MMC/SD0, and 3) SEL_MMC0_I2S = OFF @ SW4 (MMC/SD0/I2S0 signals don’t go to MMC/SD0 card slot (J16) which has pull-ups) JP62 pop hdr Pull-up for MMC1_CMD/McSPI_CS0/GP[7] - pop'd: 10k pull-up, not-pop'd: no pull-up SW1 pop SYSTEM RESET push button - tied to HOT_RESETn of TPS65023, which triggers RESPWRONn of TPS65023, optionally connected to nRESET (JP3 selects) SW2 pop C5517 RTC-only wakeup push button SW3 See DIP SW tab below Boot mode SW4 See DIP SW tab below Mux selects SW5 See DIP SW tab below Power enables SW6 See DIP SW tab below Power selects SW7 OFF Power switch SW8 pop GPAIN1 SAR push-button network (resistor dividers) SW9 pop GPAIN1 SAR push-button network (resistor dividers) SW10 pop GPAIN1 SAR push-button network (resistor dividers) SW11 See DIP SW defaults MSP430 mux selects/dir, MSP430 SW mode inputs SW12 pop MSP430 RESET push button SW13 pop GPAIN1 SAR push-button network (resistor dividers) SW14 pop GPAIN1 SAR push-button network (resistor dividers) SW15 pop GPAIN1 SAR push-button network (resistor dividers) SW16 pop GPAIN1 SAR push-button network (resistor dividers) SW17 pop GPAIN1 SAR push-button network (resistor dividers) SW18 pop GPAIN1 SAR push-button network (resistor dividers) SW19 pop GPAIN1 SAR push-button network (resistor dividers) TP15 pop hdr GP[5]/McBSP_CLKR_CLKS Pull-up on MMC1_CMD/McSPI_CS0/GP[7] required if 1) using polling boot mode, 2)booting past MMC/SD1, and 3) [SEL1_MMC1_MCSPI, SEL0_MMC1_MCSPI] is NOT [ON, OFF] @ SW4 (MMC/SD1 signals don’t go to microSD card slot (J21) which has pull-ups) Single post header required for McBSP CSL examples References 1. 2. 3. 4. 5. 16 Description JP61 http://support.spectrumdigital.com/boards/evm5517/revf/ Texas Instruments: C5517 EVM Quick Start Guide Code Composer Studio Version 6 Downloads TMS320C55x Chip Support Libraries (CSL) – Standard and Low-Power Code Composer Studio (CCS) Integrated Development Environment (IDE) C5517 Evaluation Module (EVM) SPRUHW2 – June 2019 Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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