0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TMDSIDK574

TMDSIDK574

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    DEV KIT FOR AM574X ARM FAMILY

  • 数据手册
  • 价格&库存
TMDSIDK574 数据手册
AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware User's Guide Literature Number: SPRUIJ9 April 2018 Contents Preface ........................................................................................................................................ 5 1 Introduction ......................................................................................................................... 6 2 3 4 1.1 Description ................................................................................................................ 6 1.2 REACH Compliance ..................................................................................................... 6 1.3 System View .............................................................................................................. 7 Functional Description ........................................................................................................ 11 2.1 Processor ................................................................................................................ 12 2.2 Clocks .................................................................................................................... 12 2.3 Reset Signals 6 7 8 9 10 2 12 3.1 Power Source ........................................................................................................... 13 3.2 TPS6590379 PMIC ..................................................................................................... 13 3.3 AVS Control ............................................................................................................. 13 3.4 Other Power Supplies .................................................................................................. 13 Configuration/Setup ............................................................................................................ 15 4.1 Boot Configuration ...................................................................................................... 15 4.2 I2C Address Assignments ............................................................................................. 15 4.3 SEEPROM Header ..................................................................................................... 16 ........................................................................................................ Memories Supported........................................................................................................... 5.1 DDR3L SDRAM ......................................................................................................... 5.2 SPI NOR Flash .......................................................................................................... 5.3 Board Identity Memory ................................................................................................. 5.4 SD/MMC ................................................................................................................. 5.5 eMMC NAND Flash .................................................................................................... Ethernet Ports .................................................................................................................... 6.1 100Mb Ethernet Ports on PRU-ICSS ................................................................................ 6.2 Gigabit (1000Mb) Ethernet Ports ..................................................................................... USB Ports.......................................................................................................................... 7.1 Processor USB Port 1 .................................................................................................. 7.2 Processor USB Port 2 .................................................................................................. 7.3 FTDI USB Port .......................................................................................................... PCIe .................................................................................................................................. Video Input and Output ....................................................................................................... 9.1 Camera................................................................................................................... 9.2 HDMI ..................................................................................................................... 9.3 LCD ....................................................................................................................... Industrial Interfaces ............................................................................................................ 10.1 Profibus .................................................................................................................. 10.2 DCAN..................................................................................................................... 10.3 RS-485 ................................................................................................................... 4.4 5 ........................................................................................................... Power Supplies .................................................................................................................. 13 JTAG Emulation Table of Contents 16 17 17 17 17 17 17 18 18 18 19 19 19 19 19 20 20 20 20 20 20 20 20 SPRUIJ9 – April 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated www.ti.com 11 12 User Interfaces ................................................................................................................... 21 11.1 Tri-color LEDs ........................................................................................................... 21 11.2 Industrial Inputs ......................................................................................................... 21 11.3 Industrial Outputs / LEDs .............................................................................................. 21 Pin Use Description ............................................................................................................ 21 12.1 Functional Interface Mapping ......................................................................................... 21 12.2 GPIO Pin Mapping...................................................................................................... 21 13 Board Connectors .............................................................................................................. 23 14 EVM Important Notice ......................................................................................................... 36 Appendix A Known Deficiencies in AM574x IDK EVM ..................................................................... 37 A.1 Power solution not sufficient for full PCIe plug-in card compliance ............................................. 37 A.2 AM574x IDK EVM does not support eMMC HS200 mode....................................................... 37 A.3 PCIe PERSTn line not in proper state at start-up ................................................................. 37 A.4 EDIO connectors J4 and J7 should support real-time debugging for both PRU1 and PRU2 ............... 37 A.5 HDQ implementation not correct .................................................................................... 37 A.6 Removing the power plug and inserting it again while the power supply is energized may cause damage .................................................................................................................. 37 A.7 A.8 A.9 A.10 A.11 A.12 A.13 A.14 A.15 A.16 ...................................................................... PMIC implementation does not support required SOC shut-down sequence ................................. USB port providing UART console and XDS100 emulation not isolated from EVM board supplies ....... Need 47-µf capacitor at camera header............................................................................ Decoupling capacitors do not reflect AM574x PDN recommendations ........................................ CCS System Reset fails ............................................................................................. AM574x IDK EVM design contains 2 clamp circuits that may not be necessary ............................. Crystal connected to osc0 needs to have 50 ppm or better long term accuracy ............................. Software must program the CDCE913 for 0-pf load capacitance ............................................... PHY address LSB for U9 and U15 can be latched incorrectly .................................................. Software shutdown of PMIC not operational SPRUIJ9 – April 2018 Submit Documentation Feedback Contents Copyright © 2018, Texas Instruments Incorporated 38 38 38 38 38 38 39 39 39 39 3 www.ti.com List of Figures 1 AM574x IDK EVM - Top View.............................................................................................. 7 2 AM574x IDK EVM - Bottom View .......................................................................................... 8 3 AM574x IDK EVM with LCD Display Assembly Attached - Top View ................................................ 9 4 AM574x IDK EVM with LCD Display Assembly Attached - Bottom View ........................................... 10 5 AM574x IDK EVM Block Diagram 6 ....................................................................................... Connections from the TPS6590379 PMIC to the AM574x Processor ............................................... 11 14 List of Tables 1 I2C1/IND_I2C ............................................................................................................... 15 2 I2C2/AM574X_HDMI_DDC ............................................................................................... 15 3 SEEPROM Header ......................................................................................................... 16 4 PRU-ICSS Ethernet Ports ................................................................................................. 18 5 GPIO Pin Mapping ......................................................................................................... 22 6 Expansion Connector - J21 ............................................................................................... 23 7 I/O Expansion Header Connector - J37 ................................................................................. 25 8 MicroSD Connector - J15 ................................................................................................. 26 9 Power Jack Connector - J1 ............................................................................................... 26 10 Power Terminal Block Connector - J2 ................................................................................... 26 11 PRU1ETH0 RJ45 Connector - J3 ........................................................................................ 27 12 PRU1ETH1 RJ45 Connector - J5 ........................................................................................ 27 13 PRU2ETH0 RJ45 Connector - J6 ........................................................................................ 28 14 PRU2ETH1 RJ45 Connector - J8 ........................................................................................ 28 15 PRU2ETH0 Test Header Connector - J7 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 4 ............................................................................... PRU2ETH1 Test Header Connector - J4 ............................................................................... Camera Connector - J9.................................................................................................... GigE RJ45 Connector - J10............................................................................................... GigE RJ45 Connector - J12............................................................................................... LCD Module FFC Connector - J16....................................................................................... Touchscreen Controller FFC Connector - J17 ......................................................................... HDMI Standard A-type Connector - J24 ................................................................................ MIPI-60 JTAG Connector - J18 .......................................................................................... JTAG USB Micro-AB Connector - J19 .................................................................................. USB Port 1 USB3.0 Standard A-type Connector - J23................................................................ USB Port 2 USB2.1 Micro-AB Connector - J45 ........................................................................ CAN Header Connector - J38 ............................................................................................ Profibus DB9F Connector - J14 .......................................................................................... RS-485 Header Connector - J39 ......................................................................................... PCIe Connector – J22 ..................................................................................................... List of Figures 29 29 29 30 30 31 31 32 32 34 34 34 35 35 35 36 SPRUIJ9 – April 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated Preface SPRUIJ9 – April 2018 Read This First About This Manual This document describes the hardware architecture of the AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) (Part# TMDSIDK574IDK) that supports the Texas Instruments Sitara™ ARM® Cortex®-A15 AM574x processor family. Glossary TI Glossary — This glossary lists and explains terms, acronyms, and definitions. Related Documentation From Texas Instruments For product information, visit the Texas Instruments website at http://www.ti.com. SPRAC76— Sitara Processor Power Distribution Networks: Implementation and Analysis SPRS982— AM574x Sitara Processors Silicon Revision 1.0 Data Manual SPRZ447— AM574x Sitara Processors Silicon Errata. Describes the known exceptions to the functional specifications for the device. SPRUIH8— AM574x Technical Reference Manual. Details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the device. Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community— TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki— Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. Trademarks Sitara, E2E, Code Composer Studio, SmartReflex are trademarks of Texas Instruments. ARM, Cortex are registered trademarks of ARM Limited. Windows is a registered trademark of Microsoft Corporation. SPRUIJ9 – April 2018 Submit Documentation Feedback Preface Copyright © 2018, Texas Instruments Incorporated 5 User's Guide SPRUIJ9 – April 2018 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware 1 Introduction This document describes the hardware architecture of the AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) (Part# TMDSIDK574IDK) that supports the Texas Instruments Sitara™ ARM® Cortex®-A15 AM574x processor family. 1.1 Description The AM574x IDK is a standalone test, development, and evaluation module that enables developers to write software and develop hardware for industrial control and industrial communications applications. It has been equipped with a TI AM5748 processor and a defined set of features to allow you to experience industrial communication solutions using various serial or Ethernet based interfaces. Using standard interfaces, the AM574x IDK may interface to other processors or systems and act as a communication gateway or controller. In addition, it can directly operate as a standard remote I/O system or a sensor connected to an industrial communication network. The AM574x IDK contains embedded emulation circuitry to quickly enable developers to begin using this IDK. The embedded emulation logic allows emulation and debug using standard development tools such as the Texas Instruments Code Composer Studio™ integrated development environment (IDE) by simply connecting a USB cable to a Windows®-based computer. The standard configuration for the AM574x IDK EVM provides the following Ethernet connectivity: • Two Gigabit (1000Mb) metallic ports connected via PHY/RGMII to the on-chip Ethernet switch • Two 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems Reconfiguration through resistor removal and installation can provide an alternate Ethernet connectivity: • Four 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems Software support for the AM574x IDK EVM is provided within the Processor Software Development Kit (SDK) package. This includes both Linux and RTOS support. 1.2 REACH Compliance In compliance with the Article 33 provision of the EU REACH regulation, we are notifying you that this module includes crystals (ABM3-25.000MHz-B2-T, ABM3-12.000MHz-D2Y-T) from Abracon LLC that contains two Substance of Very High Concern (SVHC) above 0.1%. These uses from Texas Instruments do not exceed 1 ton per year. The SVHC’s are Diboron trioxide CAS# 1303-86-2 and Lead Oxide CAS# 1317-36-8. 6 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Introduction www.ti.com 1.3 System View The system view of the AM574x IDK EVM consists of the main board and the camera board. There is also an optional LCD panel and touch screen assembly that can be attached to the AM574x IDK EVM. The top and the bottom views of the AM574x IDK EVM are provided in Figure 1 and Figure 2, respectively. The top and the bottom views of the AM574x IDK EVM with the optional LCD display assembly attached are provided in Figure 3 and Figure 4, respectively. Figure 1. AM574x IDK EVM - Top View SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 7 Introduction www.ti.com Figure 2. AM574x IDK EVM - Bottom View 8 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Introduction www.ti.com Figure 3. AM574x IDK EVM with LCD Display Assembly Attached - Top View SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 9 Introduction www.ti.com Figure 4. AM574x IDK EVM with LCD Display Assembly Attached - Bottom View 10 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Functional Description www.ti.com 2 Functional Description The AM574x IDK EVM is implemented on a single board with interface circuitry, memory ICs, and connectors around the AM5748 processor. The board also contains power conversion circuitry to efficiently create the needed power supply voltages from a single +5V input. As stated previously, this EVM ships with a separate camera module that plugs in to the main board. An optional LCD panel and touch screen assembly can be purchased separately and mounted on to the main board. Figure 5 shows the functional block diagram of the AM574x IDK EVM. Figure 5. AM574x IDK EVM Block Diagram JTAG (60-pin) TI ICs DDR3 1GB w/ECC DDR3 1GB ICs QSPI 32MB eMMC 16GB uSD EEPROM FTDI USB Connectors TPD6E001 Warm RESET DDR2 DDR1 QSPI MMC1 MMC2 I2C JTAG I2C INT TPD12S016 HDMI UART TPS6590379 PMIC USB3.0 Std A USB1 HDMI / I2C2 TPD2EUSB30 & TPD4E05U06 USB2 PCIe x1 PCIe / I2C1 USB2.0 MicroAB TPD4S012 Camera Header KSZ9031 GbE KSZ9031 GbE PRU UART ISO1176T Profibus DB9 SN65HVD78D RS485 Header VIN4B / I2C1 AM574x UART2 RGMII0 DCAN1 ISO1050 DCAN Header RGMII1 SPI3 / I2C1 Industrial Inputs & Outputs/LEDs GPIO RGY LED ENET Status GPIO VOUT1/I2C1 PR1_MII0 (muxed with RGMII0) PR1_MII1 (muxed with RGMII1) PR2_MII0 PR2_MII1 TLK105L TLK105L TLK105L TLK105L ICSS1 RJ45 ICSS1 RJ45 ICSS0 RJ45 ICSS0 RJ45 ICSS Header prx_mii0/1_txen/rxdv, MIPI Serializer LCD & Touch Panel prx_edio_data_out + sync SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 11 Functional Description 2.1 www.ti.com Processor The AM5748 processor is the central processing unit for this IDK EVM. The interface circuitry, memory ICs, and connectors implemented on the board around the AM5748 processor provide development support for the many industrial communication interfaces available on this platform. See the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982) and the AM574x Technical Reference Manual (SPRUIH8) for details about the processor. The AM574x IDK EVM contains system configuration for the boot mode control inputs SYSBOOT[15..0]. These can be strapped using resistors. The default configuration will meet the needs of most developers. Resistor reconfiguration is supported so that you can explore other boot configurations of the AM574x processor. See Section 4 for more details. 2.2 Clocks The main clock for the processor is derived from a 20-MHz crystal. An on-board oscillator in the AM574x processor generates the base clock and the subsequent module clocks as needed within the AM574x processor. The board design supports a crystal attached to the RTC block, but this is not needed since RTC-only mode is not supported in this device. 2.3 Reset Signals The AM574x processor contains 3 reset inputs and an output indicating a reset is in progress. The reset pins are: • PORz: PORz is a hard reset that resets everything including emulation logic. It also tri-states most outputs. • RESETn: RESETn is a device reset commonly driven by control logic or emulation. • RTC_PORz: Separate PORz for the RTC module that must be driven at the same time as PORz. (Note that PORz and RTC_PORz can only be directly connected as long as VDDSHV3 and VDDSHV5 are driven at the same voltage.) • RSTOUTn: Output signal from SOC indicating that the device has entered reset. This is used to reset other circuits that must be reset at the same time as the processor. More details about the behavior of these reset pins within the AM574x processor can be found in the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982). There are push buttons on the IDK that can initiate either a RESETn or PORz input. SW1 can drive PORz active (low) and SW2 can drive RESETn active (low). There is a device erratum in all of the AM574x devices that prevents use of RESETn independent from PORz. The workaround is to generate PORz whenever a device reset occurs even if it is from an internal initiator. This is accomplished through cooperation with the PMIC paired with the AM574x device on the IDK EVM. The RSTOUTn output from the AM574x device is connected to the NRESWARM input of the PMIC. This initiates a re-start that drives RESET_OUT low and resets all voltages to their initial values. Since RESET_OUT from the PMIC is connected to PORz in the AM574x device, a hard reset is forced on the SOC that meets the needs of the erratum workaround. The AM574x IDK EVM is started by pressing the start-up push button, SW3. The POWERHOLD input can be connected to VRTC_OUT in customer designs to cause the board to power-on as soon as the main supply is stable. The configuration of the PMIC to provide RESET_OUT from the NRESWARM input creates an always-on implementation. This always-on mode of operation prevents software shut-down of the IDK. Customer designs should have power-good monitoring circuitry such as a TPS3808 connected to the main supply to the PMIC that is connected to the PMIC RESET_IN. The TPS3808 can detect the main supply voltage dropping and then trigger the PMIC to execute a controlled shut-down that meets the requirements in the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982). 12 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Power Supplies www.ti.com 3 Power Supplies This section describes how the power supplies required for the design are generated. 3.1 Power Source The AM574x IDK EVM uses an external 5V power supply. The 5V power input is converted into different voltage levels to provide power inputs to the AM574x processor and other circuitry. Early versions of the AM574x IDK EVM shipped with the GlobTek, Inc. external power supply with the part number TR9CA6500LCP-N, model number GT-43008-3306-1.0-T3. This external power supply is rated for an output voltage of +5VDC with an output current up to 6.5A. This external power supply contains applicable regional product regulatory/safety certification requirements for most worldwide locations. If you cannot use this supply, one with equivalent ratings that is approved for your location must be obtained. The AM574x IDK EVM contains a right angle mounted power connector that accepts the +5VDC supply input on the center pin with the outer shell as the common return. The power connector accepts a mating plug with a 2.5mm ID and a 5.5mm OD. Removing the power plug and inserting it again while the power supply is energized may damage the AM574x IDK EVM and/or other devices attached to the board such as emulators that provide an alternate path to ground. Removal of AC power from the external power supply is a safer method, if required. It is recommended that the external power supply have the common return bonded to earth ground. If this is not possible, a separate connection from the board ground to earth ground may need to be provided. 3.2 TPS6590379 PMIC The power requirements of the processor are met by the TPS6590379 Power Management IC (PMIC). The power sequencing requirements of the AM574x processor are also handled by the TPS6590379 PMIC. Figure 6 shows the supply connections from the TPS6590379 PMIC to the AM574x processor. Refer to the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982) for more information about the required supply voltages and supply sequencing. Also refer to the TPS659037 Power Management Unit (PMU) for Processor Data Manual (SLIS165) and the TPS659037 User's Guide to Power AM572x and AM571x User’s Guide (SLIU011) for details about its operation. 3.3 AVS Control The AM574x processor consumes most of its power in its core logic. Therefore, minimizing the voltage supplied to this core logic can minimize power consumption. SmartReflex™ technology is used to provide this optimized solution. This core logic is separated into multiple segments that can each be controlled separately. In this way, applications that need more performance in some processing blocks can operate at higher performance levels by increasing the supply voltage, while other processing blocks that do not require the same level of performance can operate at lower voltage thus further optimizing system power consumption. The TPS6590379 PMIC is connected to the I2C1 on the AM5748 processor. This allows the application software to individually control the AVS supply outputs. It also allows the application to control the voltage generated by LDO1 that is used for the SDIO interface that operates at either 1.8V or 3.3V depending on the operating mode. 3.4 Other Power Supplies The AM574x IDK EVM contains 8 other power conversion devices that support the interface and memory circuitry: • TPS63010 Buck-Boost Converter: This converter generates 5.0V from the main supply input. It supplies this voltage to the industrial interface circuits, the HDMI interface and to the USB master ports. • TPS61085 Boost Converter: This converter generates 12.0V from the main supply input. It supplies voltage to the industrial interface circuits and the PCIe card connector. • TPS51200 DDR Termination Voltage LDO (2 each): This LDO provides the push/pull termination SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 13 Power Supplies • • • • • www.ti.com current required for the DDR3 memory interfaces. There is one implemented for each DDR3 EMIF. LP38693ADJ Low-Dropout Regulator: This LDO generates the 3.7V LCD bias voltage. TPS61081DRC LCD Backlight Generator: This Boost converter generates the LCD backlight supply. TPS71712 Low-Dropout Regulator: This LDO generates the 1.2V supply needed for the LCD driver logic. TPS76650 Low-Dropout Regulator: This LDO generates the 5.0V supply needed for the Profibus interface. R1Z-3.305HP Isolated DC-DC Supply: This converter generates 5.0V isolated from the primary 3.3V DC supply on board for the DCAN interface. Figure 6. Connections from the TPS6590379 PMIC to the AM574x Processor 1.06 V SMPS6 AVS (3 A max) 1.15 V VDD_CORE VDD_RTC SMPS7 AVS (2 A max) 1.8 V LDO9 (50 mA max) 1.8 V 1.8 V LDO2 (300 mA max) 1.8 V 1.8 V LDOLN (100 mA max) 3.3V Input Power VDD_IVAHD 1.05 V SMPS8 AVS (1 A max) 5V VDD_GPU LDO3 (200 mA max) 3.3 V 3.3 V LDO4 (200 mA max) 1.35 V or 1.5 V LDOVRTC (25 mA max) 3.3 V LDO1 (300 mA max) 3.3 V LDOUSB (100 mA max) VDD_1V8 VDDA_1V8 (PLLs) 1V8_PHY (USB/SATA) 1V8_PHY (HDMI/PCIe) VDDA_RTC Processor 5-V Input Power 1.06 V SMPS4, SMPS5 AVS (4 A max) 1.8-V Domains OSC16MOUT SMPS1, SMPS2 AVS (6 A max) VDD_MPU VDD_DSPEVE VDDSHV8 (SDIO) VDDA_USB3V3 VDD_DDR Dual-Voltage Rails (set to 3.3 V) Other Domains OSC16MIN 1.06 V Core Domains 1.15 V PMIC TPS659037 VDDSHV5 (RTC I/O) DDR_REF SMPS3 (3 A max) 1.8 V SMPS9 (1 A max) 1V8 1.35 V or 1.5 V REGEN1 TPS51200 TPS22965 (Power Switch) 0.675 V or 0.75 V VREF VTT Peripherals EMIF2 0.675 V or 0.75 V DDR EMIF1 1.35 V or 1.5 V 3V3 5V0 14 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Configuration/Setup www.ti.com 4 Configuration/Setup This section discusses the board configuration. 4.1 Boot Configuration Various boot configurations can be set using the pull-up/pull-down resistor combinations provided on the SYSBOOT[15..0] pins. Boot configuration pins are latched upon de-assertion of the PORz pin. Refer to the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982) for more details. The AM574x IDK EVM is configured by default to 0x8106 to enable UBOOT/Linux boot from the SDCARD. The secondary boot device selected by this boot mode is QSPI1. 4.2 I2C Address Assignments The AM574x IDK EVM contains multiple I2C buses connected to a master port on the processor. Each bus contains one or more I2C slave devices that must have unique addresses to prevent contention. Table 1 and Table 2 list the addresses of the I2C slave devices attached to buses I2C1 and I2C2, respectively. Table 1. I2C1/IND_I2C I2C Slave Device Address(es) TPS590377 PMIC, U3 0x58, 0x59, 0x5A, 0x5B, 0x12 Camera Header, J9 Undefined CDCE913 Ethernet Clock Generator A, U23 0x65 TPIC2810 Industrial Output Driver, U89 0x60 LCD Panel Driver TC358778, U73 0x0E Touchscreen FPC Connector, J17 — ID Memory SEEPROM, U33 0x50 PCIe Card Connector, J22 Undefined Expansion Connector, J21 Undefined Table 2. I2C2/AM574X_HDMI_DDC I2C Slave Device Address(es) HDMI Bridge, U46 — CDCE913 Ethernet Clock Generator B, U25 0x65 NOTE: SCL/SDA names are swapped between the HDMI DDC port and I2C2 port on AM57xx devices – I2C2 schematic connections to U25 must be reversed. SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 15 Configuration/Setup 4.3 www.ti.com SEEPROM Header Each of the AM574x IDK EVMs has a unique serial number. This serial number is printed on a sticker attached to the IDK and it is programmed into a SEEPROM memory device connected to the AM5748 processor over the I2C bus. The SEEPROM also contains board details such as board type, version, configuration, and so on. This information is stored in a structure at the beginning of the SEEPROM in a known format that can be read by the application software. These values are all stored with the first character or MSB stored at the lowest addressable location in each field. Table 3 lists all of the fields in this header definition. Table 3. SEEPROM Header Name Size (bytes) Header 4 MSB 0xEE3355AA LSB Board Name 8 Name for board in ASCII “AM574” = AM574x Industrial Development Kit EVM. Version 4 Hardware version code for board in ASCII “1.3A” = revision 01.3A Serial Number 12 Serial number of the board. This is a 12-character string that is: WWYY4P47nnnn, where WW = 2 digit week of the year of production, YY = 2 digit year of production, nnnn = incrementing board number. Configuration Option 32 Codes to show the configuration setup on this board. Reserved. Ethernet MAC Address #0 6 Ethernet MAC Address #0 assigned to the AM574x IDK EVM. This is the first of a block of addresses available for the Industrial Interface ports. Ethernet MAC Address #5 6 Ethernet MAC Address #5 assigned to the AM574x IDK EVM. This is the last of a block of 6 contiguous addresses available for the industrial interface ports. Available 4.4 32696 Contents Available user space for other non-volatile codes/data. JTAG Emulation The AM574x IDK EVM supports embedded XDS100V2 USB Emulation through the USB Micro-AB connector, J19, and the FTDI controller. This controller is not powered from the USB, thus the emulation resets whenever the IDK is power cycled. The AM574x IDK EVM also has a 60-pin MIPI connector to support high-performance external emulators and, optionally, emulation trace. This emulation trace capability is not enabled by default. 16 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Memories Supported www.ti.com 5 Memories Supported The AM574x IDK EVM supports on-board memories including DDR3L SDRAM, SPI NOR Flash, eMMC NAND Flash, and I2C SEEPROM. It also supports a MicroSD card socket that can add memory storage. 5.1 DDR3L SDRAM The AM574x IDK EVM design supports two banks of DDR3L SDRAM where each is attached to a separate EMIF on the AM5748 processor. Each EMIF can support up to 2GB at speeds up to 1066MT/s. Each EMIF on the IDK EVM contains two 4Gbit (256M × 16) SDRAMs for a total of 1GB of DDR3L SDRAM memory on each EMIF. The part number for the DDR3L SDRAM memory used is MT41K256M16HA-125 that contains timing for 1600MT/s operation. The package used is the 96-ball TFBGA package. See the AM574x Technical Reference Manual (SPRUIH8) for memory locations for this memory. The first EMIF also contains an SDRAM attached to the ECC byte lane. 5.2 SPI NOR Flash The AM574x IDK EVM supports a 256Mbit (32MB) SPI Flash Memory from Spansion (S25FL256S) in a 16-pin SOIC package. It is connected to the QSPI port of the AM5748 device. 5.3 Board Identity Memory Each of the AM574x IDK EVM boards contains a 256Kb (32KB) Serial EEPROM that contains boardspecific data. This data allows the application software to automatically detect the type of board that it is running on and also to determine its version and, potentially, optional features. Other hardware specific data can be stored on this memory device as well. The part number of the memory device is CAT24C256WI-G in a SOIC-8 package. Refer to Section 4 for details on the data stored in this memory. 5.4 SD/MMC The SD/MMC connector on the AM574x IDK EVM is a MicroSD connector (part number SCHA5B0200). This is a standard SD/MMC card type of connector. It is connected to the MMC1 port of the AM574x processor that is optimized for this use. Refer to the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982) and the AM574x Technical Reference Manual (SPRUIH8) for supported card types and densities. The SDWP input pin to the MMC1 port is connected to a 2-pin header, J44. The default state has the pin pulled high. Shorting the header pulls the pin low. The polarity of this input is programmable; thus, the hardware does not define whether a high or low level indicates Write Protest is active or not. The transient protection implemented at the SDCARD connector is the TPD6E001. 5.5 eMMC NAND Flash The MMC2 port on the AM574x processor supports eMMC memory devices, since it has 8 data lines. The eMMC footprint is compliant with the JEDEC/MMC standard. Boards have been assembled and successfully tested with the Kingston EMMC16G-S100 and the Micron MTFC16GAKAECN-2M WT. These are 16GB eMMC NAND Flash memories that are standard version 5.0 compliant. SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 17 Ethernet Ports 6 www.ti.com Ethernet Ports The AM574x IDK EVM supports up to four 100Mb Industrial Ethernet ports attached to the PRU-ICSS subsystems and up to two Gigabit (1000Mb) Ethernet ports connected to the integrated Ethernet switch. The final number of available ports depends on the configuration options. The default configuration provides two 100Mb Industrial Ethernet ports and two Gigabit (1000Mb) Ethernet ports. 6.1 100Mb Ethernet Ports on PRU-ICSS The AM574x IDK EVM contains four 100Mb Ethernet ports that each connect to an industrial PHY/Transceiver (TLK105L), which then connect to RJ45 metallic connectors, with integrated magnetics, J3, J5, J6, and J8. These Ethernet transceivers are connected to the PRU1 and PRU2 subsystems within the AM5748 processor. Table 4 shows the mapping from the PRU-ICSS ports to the RJ45 connectors. The COL functionality on the MII interface is not used. The TLK105L contains a feature that must be enabled via software that provides rapid link status on the COL pin. Therefore, this pin is connected to the RXLINK input to the PRU-ICSS ports for this purpose. Test headers J4 and J7 are available to support real-time code development. The signals contained are available for simplified probing. The reset for the transceivers is driven low coincident with the PORz reset to the AM5748 processor. The reset for each transceiver can also be driven low individually by separate GPIO signals from the processor. A 25-MHz clock is provided into each of the TLK105L industrial transceivers. Table 4. PRU-ICSS Ethernet Ports 6.2 Connector PRU-ICSS Port MDIO Address J3 PRU1ETH0 0x0 on PRU1 Notes Not available in default configuration. MII pins multiplexed with RGMII0. J5 PRU1ETH1 0x1 on PRU1 Not available in default configuration. MII pins multiplexed with RGMII1. J6 PRU2ETH0 0x0 on PRU2 J8 PRU2ETH1 0x1 on PRU2 Gigabit (1000Mb) Ethernet Ports The AM574x IDK EVM contains two Gigabit (1000Mb) Ethernet PHY/Transceivers (KSZ9031RN) interfaced to connectors J10 (RGMII0) and J12 (RGMII1). These Gigabit Ethernet transceivers are connected over RGMII0 and RGMII1 to the Ethernet switch block within the AM5748 processor. The resets for the transceivers are driven low coincident with the PORz reset to the AM5748 processor. A 25-MHz clock is provided into each of the KSZ9031RN Gigabit transceivers. 18 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback USB Ports www.ti.com 7 USB Ports The AM574x IDK EVM contains three USB ports. Two ports are attached to the USB peripherals USB1 and USB2 on the AM574x processor. The third port provides both XDS100V2 JTAG emulation and UART Console over the USB. This port simplifies the development environment for programmers using computers that support this capability such as Windows®-based computers. 7.1 Processor USB Port 1 Processor port USB1 is implemented only as a USB host (master). It supports both USB2.1 (high speed) and USB3.0 (super speed) data rates. The connector on the board, J23, is a USB3.0 Standard A-type connector. The ESD devices implemented on this USB port are the TPD2EUSB30 for the DP and DM lines and the TPD4E05U06 for the super-speed pairs. Since processor USB port 1 supports host mode, it has the capability to drive 5.0V power on the VBUS pin. The TPS2065D load switch is controlled by the USB1_DRVVBUS pin for this purpose. 7.2 Processor USB Port 2 Processor port USB2 is implemented as either USB host (master) or USB device (slave). It supports only the USB2.1 (high speed and lower) data rates. The connector on the board, J45, is a USB2.1 Micro-AB connector. The ESD device implemented on this USB port is the TPD4S012. Since processor USB port 2 supports host mode, it has the capability to drive 5.0V power on the VBUS pin. The TPS2051 load switch is controlled by the USB2_DRVVBUS pin for this purpose. The USB2.1 standard defines different ranges of capacitance for the VBUS pin depending on whether it is host or device. Since this port can do either, the AM574x IDK EVM provides the capability to meet either requirement. The VBUS pin from the connector contains a 4.7µF capacitor that is appropriate for device mode operation. When operating in host mode, 2-pin header J50 can be shorted to add 150µF of additional capacitance to the VBUS pin. The shunt for this header is shown on the schematic as M2. It is not installed on units when shipped as we expect this port to primarily be used in device mode. 7.3 FTDI USB Port The FTDI bridge device provides both XDS100V2 JTAG emulation and UART Console over the USB. Its USB connector is J19 and it is also a USB Micro-AB connector but it only operates in device (slave) mode with the FTDI bridge device. The ESD device implemented on this USB port to the FTDI bridge is the TPD2E001. Refer to Section 4.4 for more details on this functionality. 8 PCIe The AM574x processors contain two lanes of peripheral component interconnect express (PCIe). These can be implemented either as a single, dual-lane port or as two single-lane ports. The PCIe peripheral can be configured to either be a Root Complex (master) or an Endpoint (slave). The AM574x IDK EVM only implements one single-lane port as a Root Complex. The IDK EVM terminates this lane in a single-lane PCIe female connector that accepts standard PCIe Endpoint cards. A 2-pin header, J49, is available to provide the 3V3_AUX power separate from the primary 3V3 supply. This is needed for some cards and PCIe driver configurations. The shunt, shown on the schematic as M1, should be installed when the board is received since 3V3_AUX will be needed in most cases. Please refer to the documentation for the card being installed to determine whether this shunt should remain installed. The PERSTn reset for the connector is driven low coincident with the PORz reset to the AM5748 processor. The PERSTn reset to the connector can also be driven low by a GPIO signal from the processor. This reset can also be blocked by a GPIO signal from the processor. A 100-MHz clock is provided separately to both the PCIe peripheral and to the PCIe connector. These clocks are buffered outputs from the same low-jitter source. The AM574x IDK EVM is compatible with standard PCIe plug-in cards but not fully compliant with the PCIe CEM standard. It does not support hot-plug and also does not provide sufficient current on the 3.3V and 12V pins for all plug-in cards. It is currently limited to about 0.5A on each supply. SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 19 Video Input and Output 9 www.ti.com Video Input and Output The AM574x processor family supports industrial video capture and display in addition to its industrial communications capabilities. The AM574x IDK EVM contains a camera header for attaching a module containing a camera sensor as well as support for an LCD panel display and HDMI video output. 9.1 Camera The AM574x IDK EVM supports a camera daughterboard that attaches to a 24-pin (2 × 24) header, J9. The custom-designed camera module from TI, previously designed for the AM437x IDK EVM, mounts on this header. This header is connected to VIN4B on the AM5748 processor. The 2Mp camera board contains the Darling Industrial camera module (part number DC-OVBD420AH). The camera module contains the OmniVision OV2659 camera sensor. Please contact Omnivision for the latest documentation on this sensor. 9.2 HDMI The AM574x IDK EVM supports an HDMI connector driven from the HDMI port on the AM5748 processor. The connector on the board, J24, is an HDMI Standard A-type connector. It is implemented with the TPD12S016 HDMI companion chip. This companion chip provides I2C level shifting buffers, 5V load switch, and multi-channel ESD protection. 9.3 LCD The AM574x IDK EVM is available with an optional LCD panel that also has a capacitive touch overlay. The video output driven for the LCD panel from the AM5748 processor is on VOUT1. A MIPI bridge device from Toshiba, TC358778, is implemented to convert from the 24-bit RGB presented on the VOUT1 pins to serial MIPI RGB streams. The LCD panel is shipped with FPC cables that plug into J16 for the MIPI video and into J17 for the touchscreen controller. Both the MIPI bridge device and the touchscreen controller are connected to the IND_I2C chain from processor port I2C1. 10 Industrial Interfaces There are additional industrial interfaces implemented on the AM574x IDK EVM to help showcase the flexibility of the AM57xx line of processors. 10.1 Profibus A compliant Profibus interface is implemented using the ISO1176T isolation device, transformer and TPS76650 LDO regulator. This circuit terminates to a DB9F connector, J14. This Profibus interface is driven by UART0 from the first PRU-ICSS block, PR1. 10.2 DCAN The AM5748 processor contains two Controller Area Network (DCAN) interfaces. DCAN port 1 is routed out to the ISO1050 isolation device and then to the 5-pin header, J38. The R1Z-3.305HP isolated DC-DC supply provides an isolated 3.3V supply for this DCAN interface. 10.3 RS-485 The AM574x IDK EVM contains an RS-485 interface on 3-pin header, J39. This is enabled by the SN65HVD78D Half-Duplex RS-485 Transceiver. The transceiver controls the half-duplex communication and also provides high-voltage transient protection. This interface is attached to the SOC-level UART2 port for RX and TX data. The UART TX data line is monitored by PR2_PRU1, so that PRU code can monitor TX activity and then control the DE and REn lines into the transceiver. 20 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback User Interfaces www.ti.com 11 User Interfaces The AM574x IDK EVM contains GPIO expanders that provide industrial inputs and outputs to support development. The outputs contain LEDs for immediate feedback. There are also tri-color LEDs connected to GPIOs to support development. 11.1 Tri-color LEDs There are 6 tri-color LEDs connected to SOC GPIO pins that can be used to support development. There is a separate GPIO assigned for each color: red, green, and yellow. Color mixing by turning on more than one GPIO at a time will not provide the expected result since the separate colors have different intensities due to the physics of the LED composition. Tri-color LEDs D16, D17, D18, and D19 are designated Industrial LEDs. Tri-color LEDs D22 and D23 are designated Status LEDs. 11.2 Industrial Inputs For industrial 24v digital inputs, an SN65HVS882 Digital-input Serializer for industrial digital inputs is used to accept standard signals from the 30-pin (15 × 2) I/O Expansion Header, J37. The input values are clocked into the SPI3 port of the AM5748 processor. 11.3 Industrial Outputs / LEDs I2C to 8-bit LED driver TPIC2810 is used to drive the eight Industrial output LEDs D5 to D12. The I2C interface is connected to the I2C1 port of the AM5748 processor along with the other devices on the IND_I2C bus. The eight LED driver outputs are also driven to the I/O Expansion Header, J37. All the LEDs are green in color. 12 Pin Use Description 12.1 Functional Interface Mapping Some signals of the AM5748 device are connected to a fixed device on the EVM where it cannot be changed. However, some of the signals of the AM5748 device are connected to devices on the AM574x IDK EVM based on the profile setting. 12.2 GPIO Pin Mapping The developer can enable GPIO pins individually, as needed, as output, input, or both. Most of the LVCMOS pins not currently allocated for other peripheral use can be defined as GPIO pins. Table 5 is a compliment to the schematic and the recommended settings in the pinmux tool. Each of the defined GPIO pins are listed along with the associated pin name and ball number and mode. The last column lists the available physical pull-up (PU) or pull-down (PD) resistor attached or the recommended internal pull-up or pull-down resistor defined in the pinmux file provided for the AM574x IDK EVM. SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 21 Pin Use Description www.ti.com Table 5. GPIO Pin Mapping Pin Name GPIO # Pin # IDK Net Name / Function Direction Pull Up / Pull Down MCASP2_AXR4 GPIO1_4 D15 AM57XX_INDETHER_LED0_YEL Output EXT PD MCASP2_AXR7 GPIO1_5 A17 AM57XX_INDETHER_LED1_YEL Output EXT PD MCASP2_AXR6 GPIO2_29 B17 AM57XX_INDETHER_LED1_GRN Output EXT PD VIN1A_D6 GPIO3_10 AG6 AM57XX_STATUSLED1_RED Output EXT PD VIN1A_D7 GPIO3_11 AH4 AM57XX_STATUSLED0_GRN Output EXT PD VIN1A_D8 GPIO3_12 AG4 AM57XX_STATUSLED0_YEL Output EXT PD VIN1A_D10 GPIO3_14 AG3 TOUCH_INT Input INT PU VIN1A_D12 GPIO3_16 AF2 GPIO_AM572X_USB2_ID Input/Output EXT PU VIN1A_D13 GPIO3_17 AF6 AM57XX_INDETHER_LED3_GRN Output EXT PD VIN1A_D14 GPIO3_18 AF3 AM57XX_INDETHER_LED3_YEL Output EXT PD VIN1A_D15 GPIO3_19 AF4 AM57XX_GPIO_IND_LDn Output EXT PU VIN1A_D17 GPIO3_21 AE3 GPIO_VPP_PWR_EN Output EXT PD VIN1A_D18 GPIO3_22 AE5 GPIO_PCIE_RSTDRVn Output INT PD VIN1A_D19 GPIO3_23 AE1 GPIO_PCIE_SWRSTn Output INT PU VIN1A_D22 GPIO3_26 AD2 GPIO_USB2_VBUS_DET Input EXT PU VIN2A_CLK0 GPIO3_28 E1 PRU1ETH0_INTn Input INT PU VIN2A_DE0 GPIO3_29 G2 PRU1ETH1_INTn Input INT PU VIN2A_FLD0 GPIO3_30 H7 PRU2ETH0_INTn Input INT PU VIN2A_HSYNC0 GPIO3_31 G1 PRU2ETH1_INTn Input INT PU VIN1A_D5 GPIO3_9 AH5 AM57XX_INDETHER_LED0_GRN Output EXT PD VIN2A_VSYNC0 GPIO4_0 G6 AM57XX_STATUSLED0_RED Output EXT PD VOUT1_FLD GPIO4_21 B11 eMMC_RSTn Output EXT PU MCASP1_ACLKR GPIO5_0 B14 GB_ETH0_INTn Input EXT PU MCASP1_FSR GPIO5_1 J14 GB_ETH1_INTn Input EXT PU MCASP1_AXR2 GPIO5_4 G13 PCIE_CRDPRESENT Input EXT PU MCASP1_AXR3 GPIO5_5 J11 PCIE_WAKEn Input EXT PU MCASP1_AXR4 GPIO5_6 E12 GPIO_PRU1_ETH0_RESETn Output EXT PU MCASP1_AXR5 GPIO5_7 F13 GPIO_PRU1_ETH1_RESETn Output EXT PU MCASP1_AXR6 GPIO5_8 C12 GPIO_PRU2_ETH0_RESETn Output EXT PU MCASP1_AXR7 GPIO5_9 D12 GPIO_PRU2_ETH1_RESETn Output EXT PU GPIO6_14 GPIO6_14 E21 CAM_ENn Output PU/PD on camera board GPIO6_15 GPIO6_15 F20 GPIO_TOUCH_RESETn Output EXT PU GPIO6_16 GPIO6_16 F21 PMIC_INT Input INT PU 22 XREF_CLK2 GPIO6_19 B26 AM57XX_INDETHER_LED0_RED Output EXT PD MCASP2_AXR5 GPIO6_7 B16 AM57XX_INDETHER_LED1_RED Output EXT PD SPI1_CS0 GPIO7_10 A24 AM57XX_INDETHER_LED2_YEL Output EXT PD SPI1_CS1 GPIO7_11 A22 AM57XX_INDETHER_LED3_RED Output EXT PD UART1_RXD GPIO7_22 B27 AM57XX_STATUSLED1_YEL Output EXT PD UART1_TXD GPIO7_23 C26 AM57XX_STATUSLED1_GRN Output EXT PD SPI1_SCLK GPIO7_7 A25 AM572X_HAPTICS_TRIG Output EXT PD SPI1_D1 GPIO7_8 F16 AM57XX_INDETHER_LED2_GRN Output EXT PD SPI1_D0 GPIO7_9 B25 AM57XX_INDETHER_LED2_RED Output EXT PD AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com 13 Board Connectors This section shows the pin-outs for the connectors on the AM574x IDK EVM. Table 6. Expansion Connector - J21 Pin Signal Name Secondary Signal Name 1 V3_3D — 2 V5_0D — 3 PR1_EDC_LATCH0 — 4 GPMC_CS0 — 5 PR1_EDC_SYNC0 — 6 GPMC_CS3 — 7 No Connect — 8 GPMC_ADVN_ALE — AM57XX_PRU1ETH1_TXCLK 9 No Connect 10 GPMC_OEN_REN — 11 No Connect AM57XX_PRU1ETH1_TXD3 12 GPMC_WEN — 13 PR2_EDC_LATCH0 AM57XX_PRU1ETH_MDCLK 14 GPMC_BEN0 — 15 PR2_EDC_LATCH1 PRU1ETH1_TXD1 16 GPMC_BEN1 — 17 PR2_EDC_SYNC0 PRU1ETH1_RXCLK 18 No Connect — 19 PR2_EDC_SYNC1 PRU1ETH1_RXD3 20 No Connect — 21 No Connect PRU1ETH1_RXD1 22 DGND — 23 No Connect PRU1ETH1_RXERR 24 SPI2_SCLK — 25 SYS_RESETn — 26 SPI2_DIN — 27 IND_I2C_SCL — 28 SPI2_DOUT — 29 IND_I2C_SDA — 30 SPI2_CS0n — 31 AM57XX_GPMC_AD0 — 32 AM57XX_GPMC_AD8 — 33 AM57XX_GPMC_AD1 — 34 AM57XX_GPMC_AD9 — 35 AM57XX_GPMC_AD2 — 36 AM57XX_GPMC_AD10 — 37 AM57XX_GPMC_AD3 — 38 AM57XX_GPMC_AD11 — 39 DGND — 40 DGND — 41 CAN1_RXDF — 42 AM57XX_GPMC_AD12 — 43 CAN1_TXDF — 44 AM57XX_GPMC_AD13 — SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 23 Board Connectors www.ti.com Table 6. Expansion Connector - J21 (continued) 24 Pin Signal Name Secondary Signal Name 45 AM57XX_PR1_UART0_TXD — 46 AM57XX_GPMC_AD14 — 47 AM57XX_PR1_UART0_RXD — 48 AM57XX_GPMC_AD15 — 49 AM57XX_PR2_PROFI_TXEN — 50 HDQ — 51 AM57XX_GPMC_AD4 — 52 GPMC_WAIT0 — 53 AM57XX_GPMC_AD5 — 54 PR2_UART0_RXD — 55 AM57XX_GPMC_AD6 — 56 PR2_UART0_TXD — 57 AM57XX_GPMC_AD7 — 58 GPMC_CLK — 59 DGND — 60 DGND — AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 7. I/O Expansion Header Connector - J37 SPRUIJ9 – April 2018 Submit Documentation Feedback Pin Signal Name 1 INDUS_INPUT0 2 V12_0D 3 INDUS_INPUT1 4 V12_0D 5 INDUS_INPUT2 6 V12_0D 7 INDUS_INPUT3 8 V12_0D 9 INDUS_INPUT4 10 V12_0D 11 INDUS_INPUT5 12 V12_0D 13 INDUS_INPUT6 14 V12_0D 15 INDUS_INPUT7 16 V12_0D 17 DGND 18 No Connect 19 DRAIN0 20 DRAIN1 21 DRAIN2 22 DRAIN3 23 DRAIN4 24 DRAIN5 25 DRAIN6 26 DRAIN7 27 V5_0D 28 V5_0D 29 DGND 30 DGND AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 25 Board Connectors www.ti.com Table 8. MicroSD Connector - J15 Pin Pin Name Signal Name 1 DAT2 MMC_D2 2 DAT3 MMC_D3 3 CMD MMC_CMD 4 VDD V3_3D 5 CLOCK MMC_CLK 6 DGND VSS 7 DAT0 MMC_D0 8 DAT1 MMC_D1 9 GND DGND 10 CD MMC1_SDCD 11 GND3 DGND 12 GND4 DGND 13 GND5 DGND 14 GND6 DGND 15 GND7 DGND 16 GND8 DGND Table 9. Power Jack Connector - J1 Pin Signal Name 1 VPWRIN_JCK 2 DGND 3 DGND Table 10. Power Terminal Block Connector - J2 26 Pin Signal Name 1 VPWRIN_JCK 2 DGND AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 11. PRU1ETH0 RJ45 Connector - J3 Pin Pin Name Signal Name 1 RD+ PRU1ETHER0_RDP 2 RD- PRU1ETHER0_RDN 3 RCT V3_3D 4 TCT V3_3D 5 TD+ PRU1ETHER0_TDP 6 TD- PRU1ETHER0_TDN 7 N/C No connect 8 AC GND DGND 9 YEL LED Anode V3_3D 10 YEL LED Cathode RXLINK 11 GRN LED Anode V3_3D 12 GRN LED Cathode PRU1ETH0_LINKLED SHLD1 Shield AGNDFRAME_PRU1ETH0 SHLD2 Shield AGNDFRAME_PRU1ETH0 Table 12. PRU1ETH1 RJ45 Connector - J5 Pin Pin Name Signal Name 1 RD+ PRU1ETHER1_RDP 2 RD- PRU1ETHER1_RDN 3 RCT V3_3D 4 TCT V3_3D 5 TD+ PRU1ETHER1_TDP 6 TD- PRU1ETHER1_TDN 7 N/C No connect 8 AC GND DGND 9 YEL LED Anode V3_3D 10 YEL LED Cathode RXLINK 11 GRN LED Anode V3_3D 12 GRN LED Cathode PRU1ETH1_LINKLED SHLD1 Shield AGNDFRAME_PRU1ETH1 SHLD2 Shield AGNDFRAME_PRU1ETH1 SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 27 Board Connectors www.ti.com Table 13. PRU2ETH0 RJ45 Connector - J6 Pin Pin Name Signal Name 1 RD+ PRU2ETHER0_RDP 2 RD- PRU2ETHER0_RDN 3 RCT V3_3D 4 TCT V3_3D 5 TD+ PRU2ETHER0_TDP 6 TD- PRU2ETHER0_TDN 7 N/C No connect 8 AC GND DGND 9 YEL LED Anode V3_3D 10 YEL LED Cathode RXLINK 11 GRN LED Anode V3_3D 12 GRN LED Cathode PRU2ETH0_LINKLED SHLD1 Shield AGNDFRAME_PRU2ETH0 SHLD2 Shield AGNDFRAME_PRU2ETH0 Table 14. PRU2ETH1 RJ45 Connector - J8 28 Pin Pin Name Signal Name 1 RD+ PRU2ETHER1_RDP 2 RD- PRU2ETHER1_RDN 3 RCT V3_3D 4 TCT V3_3D 5 TD+ PRU2ETHER1_TDP 6 TD- PRU2ETHER1_TDN 7 N/C No connect 8 AC GND DGND 9 YEL LED Anode V3_3D 10 YEL LED Cathode RXLINK 11 GRN LED Anode V3_3D 12 GRN LED Cathode PRU2ETH1_LINKLED SHLD1 Shield AGNDFRAME_PRU2ETH1 SHLD2 Shield AGNDFRAME_PRU2ETH1 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 15. PRU2ETH0 Test Header Connector - J7 Pin Signal Name Net Name 1 RT2_MII0_TXEN AM57XX_PRU2ETH0_TXEN 2 RT2_MII0_RXDV AM57XX_PRU2ETH0_RXDV 3 RT2_MII0_EDIO_DATA0 AM57XX_VIN2A_VSYNC0 4 RT2_MII0_EDIO_DATA1 AM57XX_PR1_UART0_TXD 5 DGND — Table 16. PRU2ETH1 Test Header Connector - J4 Pin Signal Name Net Name 1 RT2_MII1_TXEN PRU2ETH1_TXEN 2 RT2_MII1_RXDV PRU2ETH1_RXDV 3 RT2_MII1_EDIO_DATA0 AM57XX_VIN2A_HSYNC0 4 RT2_MII1_EDIO_DATA1 AM57XX_VIN2A_DE0 5 DGND DGND Table 17. Camera Connector - J9 Pin Pin Name Signal Name 1 Power VMAIN 2 CAM1_VSYNC DGND 3 CAM1_DATA0 AM572X_VIN4B_DATA0 4 CAM1_HSYNC AM572X_VIN4B_HSYNC 5 CAM1_DATA1 AM572X_VIN4B_DATA1 6 CAM1_DATA6 AM572X_VIN4B_DATA6 7 CAM1_DATA2 AM572X_VIN4B_DATA2 8 CAM1_DATA7 AM572X_VIN4B_DATA7 9 CAM1_PCLK AM572X_VIN4B_PCLK 10 No Connect — 11 GND DGND 12 GND DGND 13 CAM1_DATA3 AM572X_VIN4B_DATA3 14 No Connect — 15 CAM1_DATA4 AM572X_VIN4B_DATA4 16 CAM1_GIO0 PU to V3_3D 17 CAM1_WEN AM572X_VIN4B_DATA5 18 CAM1_GIO1 CAM_ENn 19 CAM1_DATA5 AM572X_VIN4B_DE 20 CAM1_FIELD AM572X_VIN4B_FLD 21 GND DGND 22 I2C_SCL IND_I2C_SCL 23 Clock 20.000 MHz Osc Out 24 I2C_SDA IND_I2C_SDA SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 29 Board Connectors www.ti.com Table 18. GigE RJ45 Connector - J10 Pin Pin Name 1 CH-GND Signal Name DGND 2 VCC No connect 3 MX3+ ETHER0_D3P 4 MX3- ETHER0_D3N 5 MX2+ ETHER0_D2P 6 MX2- ETHER0_D2N 7 MX1+ ETHER0_D1P 8 MX1- ETHER0_D1N 9 MX0+ ETHER0_D0P 10 MX0- ETHER0_D0N 11 RT GRN Anode PU to PHY0_LED_ACTn 12 RT YEL Anode DGND 13 LEFT GRN Anode DGND 14 LEFT YEL Anode PU to PHY0_LED_LINKn SHLD1 Shield AGND_GBETH0 SHLD2 Shield AGND_GBETH0 Table 19. GigE RJ45 Connector - J12 30 Pin Pin Name Signal Name 1 CH-GND DGND 2 VCC No connect 3 MX3+ ETHER1_D3P 4 MX3- ETHER1_D3N 5 MX2+ ETHER1_D2P 6 MX2- ETHER1_D2N 7 MX1+ ETHER1_D1P 8 MX1- ETHER1_D1N 9 MX0+ ETHER1_D0P 10 MX0- ETHER1_D0N 11 RT GRN Anode PU to PHY1_LED_ACTn 12 RT YEL Anode DGND 13 LEFT GRN Anode DGND 14 LEFT YEL Anode PU to PHY1_LED_LINKn SHLD1 Shield AGND_GBETH1 SHLD2 Shield AGND_GBETH1 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 20. LCD Module FFC Connector - J16 Pin Pin Name Signal Name 1 — No Connect 2 — No Connect 3 VCC V3_7LCD 4 VCC V3_7LCD 5 VCC V3_7LCD 6 — No Connect 7 GND DGND 8 MIPI_LN3_N LCD_MIPI3N LCD_MIPI3P 9 MIPI_LN3_P 10 GND DGND 11 MIPI_LN2_N LCD_MIPI2N 12 MIPI_LN2_P LCD_MIPI2P 13 GND DGND 14 MIPI_LN1_N LCD_MIPI1N 15 MIPI_LN1_P LCD_MIPI1P 16 GND DGND 17 MIPI_LN0_N LCD_MIPI0N 18 MIPI_LN0_P LCD_MIPI0P 19 GND DGND 20 MIPI_CLK_N LCD_CLKN 21 MIPI_CLK_P LCD_CLKP 22 GND DGND 23 LED_CATHODE VLED- 24 LED_CATHODE VLED- 25 LED_CATHODE VLED- 26 LED_CATHODE VLED- 27 LED_CATHODE VLED- 28 LED_CATHODE VLED- 29 LED Anode Supply VLED+ 30 LED Anode Supply VLED+ 31 — No Connect 32 — No Connect Table 21. Touchscreen Controller FFC Connector - J17 Pin Pin Name Signal Name 1 SDA IND_I2C_SDA 2 SCL IND_I2C_SCL 3 TSC_RESETn GPIO_TOUCH_RESETn 4 TSC_INT TOUCH_INT 5 V+ V3_3D 6 GND DGND SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 31 Board Connectors www.ti.com Table 22. HDMI Standard A-type Connector - J24 Pin Pin Name Signal Name 1 DAT2+ HDMI_TX2+ 2 DAT2_S DGND 3 DAT2- HDMI_TX2- 4 DAT1+ HDMI_TX1+ 5 DAT1_S DGND 6 DAT1- HDMI_TX1- 7 DAT0+ HDMI_TX0+ 8 DAT0_S DGND 9 DAT0- HDMI_TX0- 10 CLK+ HDMI_CLK+ 11 CLK_S DGND 12 CLK- HDMI_CLK- 13 CEC HDMICONN_CEC 14 NC No Connect 15 SCL HDMICONN_I2CSCL 16 SDA HDMICONN_I2CSDA 17 DDC/CEC GND DGND 18 +5V V5_0HDMICONN 19 HPLG HDMICONN_HPLG MTG1 Sheild DGND MTG2 Sheild DGND MTG3 Sheild DGND MTG4 Sheild DGND Table 23. MIPI-60 JTAG Connector - J18 32 Pin Pin Name Signal Name 1 VREF_DBG PU to V3_3D 2 TMS JTAG_TMS 3 TCK JTAG_TCK 4 TDO JTAG_TDO 5 TDI JTAG_TDI 6 RESETn EMU_RSTn 7 RTCK AM57XX_RTCK 8 TRSTPD JTAG_TRSTn 9 TRSTn No Connect 10 EXTE No Connect 11 EXTF No Connect 12 VREF_TR PU to V3_3D 13 TR_CLK0 EMU2 14 TR_CLK1 No Connect 15 TGT_DETECT DGND 16 GND DGND 17 TRD0.0 EMU3 18 TRD1.0 No Connect AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 23. MIPI-60 JTAG Connector - J18 (continued) Pin Pin Name Signal Name 19 TRD0.1 JTAG_EMU0 20 TRD1.1 No Connect 21 TRD0.2 JTAG_EMU1 22 TRD1.2 No Connect 23 TRD0.3 EMU4 24 TRD1.3 No Connect 25 TRD0.4 EMU5 26 TRD1.4 No Connect 27 TRD0.5 EMU6 28 TRD1.5 No Connect 29 TRD0.6 EMU7 30 TRD1.6 No Connect 31 TRD0.7 EMU8 32 TRD1.7 No Connect 33 TRD0.8 EMU9 34 TRD1.8 No Connect 35 TRD0.9 EMU10 36 TRD1.9 No Connect 37 TRD3.0 EMU11 38 TRD2.0 No Connect 39 TRD3.1 EMU12 40 TRD2.1 No Connect 41 TRD3.2 EMU13 42 TRD2.2 No Connect 43 TRD3.3 EMU14 44 TRD2.3 No Connect 45 TRD3.4 EMU15 46 TRD2.4 No Connect 47 TRD3.5 EMU16 48 TRD2.5 No Connect 49 TRD3.6 EMU17 50 TRD2.6 No Connect 51 TRD3.7 EMU18 52 TRD2.7 No Connect 53 TRD3.8 EMU19 54 TRD2.8 No Connect 55 TRD3.9 No Connect 56 TRD2.9 No Connect 57 GND DGND 58 GND DGND 59 TR_CLK3 No Connect 60 TR_CLK2 No Connect 61 GND DGND 62 GND DGND 63 GND DGND 64 GND DGND SPRUIJ9 – April 2018 Submit Documentation Feedback AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 33 Board Connectors www.ti.com Table 24. JTAG USB Micro-AB Connector - J19 Pin Pin Name 1 VBUS Signal Name VUSB_JTAG 2 DM EMU_USB_DM 3 DP EMU_USB_DP 4 ID No Connect 5 GND DGND S1 S1 GNDUSBJ S2 S2 GNDUSBJ S3 S3 GNDUSBJ S4 S4 GNDUSBJ Table 25. USB Port 1 USB3.0 Standard A-type Connector - J23 Pin Pin Name Signal Name 1 VBUS VUSB_VBUS1 2 DM USB1_CONN_DM 3 DP USB1_CONN_DP 4 GND DGND 5 STDA_SSRX- USB1_3_0_STDA_SSRX- 6 STDA_SSRX+ USB1_3_0_STDA_SSRX+ 7 GND_DRAIN DGND 8 STDA_SSTX- USB1_3_0_STDA_SSTX- 9 STDA_SSTX+ USB1_3_0_STDA_SSTX+ S1 S1 GNDUSB1 S2 S2 GNDUSB1 Table 26. USB Port 2 USB2.1 Micro-AB Connector - J45 34 Pin Pin Name Signal Name 1 VBUS VUSB_VBUS2 2 DM USB2_CONN_DM 3 DP USB2_CONN_DP 4 ID USB2_ID 5 GND DGND S1 S1 GNDUSB2 S2 S2 GNDUSB2 S3 S3 GNDUSB2 S4 S4 GNDUSB2 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Board Connectors www.ti.com Table 27. CAN Header Connector - J38 Pin Signal Name 1 VCAN1 2 CAN1_H 3 CAN1_L 4 GND_CAN1 5 No Connect Table 28. Profibus DB9F Connector - J14 Pin Signal Name 1 No Connect 2 No Connect 3 PROFIBUS_A 4 No Connect 5 GND_PROFI 6 VPROFI 7 No Connect 8 PROFIBUS_B 9 No Connect Table 29. RS-485 Header Connector - J39 SPRUIJ9 – April 2018 Submit Documentation Feedback Pin Signal Name 1 RS485_A 2 RS485_B 3 DGND AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated 35 EVM Important Notice www.ti.com Table 30. PCIe Connector – J22 14 Pin Pin Nmae Signal Name B1 +12 V V12_0D B2 +12 V V12_0D B3 +12 V V12_0D B4 Ground DGND B5 SMCLK PCIE_SMB_CLK B6 SMDAT PCIE_SMB_DATA B7 Ground DGND B8 +3.3V V3_3D B9 TRST# PCIE_TRSTn B10 +3.3V AUX V3_3AUX_PCIE B11 WAKE# PCIE_WAKEn B12 CLKREQ# No Connect B13 Ground DGND B14 HSOp(0) PCIECONN_PETp0 B15 HSOn(0) PCIECONN_PETn0 B16 Ground DGND B17 PRSNT2# DGND B18 Ground DGND A1 PRSNT1# PCIE_CRDPRESENT A2 +12 V V12_0D A3 +12 V V12_0D A4 Ground DGND A5 TCK PD to DGND A6 TDI PU to V3_3D A7 TDO TP20 A8 TMS PU to V3_3D A9 +3.3V V3_3D A10 +3.3V V3_3D A11 PERST# PCIE_PERSTn A12 Ground DGND A13 REFCLK+ PCIE_REFCLKP A14 REFCLK- PCIE_REFCLKN A15 Ground DGND A16 HSIp(0) PCIE_PERp0 A17 HSIn(0) PCIE_PERn0 A18 Ground DGND EVM Important Notice Refer to the STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES (SSZZ027). 36 AM574x Industrial Development Kit (IDK) Evaluation Module (EVM) Hardware Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback Appendix A SPRUIJ9 – April 2018 Known Deficiencies in AM574x IDK EVM A.1 Power solution not sufficient for full PCIe plug-in card compliance The AM574x IDK EVM supports compatibility to PCIe x1 plug-in cards. It is not compliant with the PCIe Card Electro-Mechanical (CEM) specification. Specifically, the board does not provide the recommended power per the CEM. It provides up to 0.5A of current on the 3.3V/3.3V_AUX input pins and up to 0.5A on the 12V input pins. Also, the root complex design implemented does not support hot plug-in of cards. A.2 AM574x IDK EVM does not support eMMC HS200 mode The interface voltage for the eMMC is fixed at 3.3V in all modes of operation. This prevents support of HS200 which requires a transition to 1.8V. The AM574x IDK EVM does support this voltage shift for the SDCARD attached to the MMC1 port. The MMC1 port is on VDDSHV8 supply that is attached to the LDO1 PMIC output that supports this voltage shift for higher speed modes. The eMMC is attached to the VDDSHV11 supply fixed at 3.3V. Board designs that require HS200 support for eMMC would need a solution to transition from 3.3V to 1.8V under software control. A.3 PCIe PERSTn line not in proper state at start-up The board does not contain pull-up or pull-down resistors to allow this line to be pulled-high at start-up. This can cause PCIe link training to fail. Future software releases need to properly control the GPIO output pins to enable this correctly at start-up. A.4 EDIO connectors J4 and J7 should support real-time debugging for both PRU1 and PRU2 The pins chosen provide visibility to the PRU2 MII0 and MII1 ports and PRU1 EDIO ports. A.5 HDQ implementation not correct HDQ was intended to be attached to the Expansion Connector. Since this pin is multiplexed with XREF_CLK3/CLKOUT3 used with the Camera connector, the clock options implemented for the camera connector prevent use of HDQ without addition of a wire. This can be enabled by adding a wire between the open pads of R905 and R300. A.6 Removing the power plug and inserting it again while the power supply is energized may cause damage Removing the power plug and inserting it again while the power supply is energized may damage the AM574x IDK EVM and/or other devices attached to the board such as emulators that provide an alternate path to ground. Removal of AC power from the external power supply is a safer method, if required. It is also recommended that the external power supply have the common return bonded to earth ground. If this is not possible, a separate connection from the board ground to earth ground may need to be provided. Test fixtures that repeatedly cycle main power on and off should have the board ground bonded to earth ground at all times during this testing. SPRUIJ9 – April 2018 Submit Documentation Feedback Known Deficiencies in AM574x IDK EVM Copyright © 2018, Texas Instruments Incorporated 37 Software shutdown of PMIC not operational A.7 www.ti.com Software shutdown of PMIC not operational The PMIC is implemented to support PORz generation whenever any reset is initiated within the AM5748 SOC. This is enabled by pulling PMIC BOOT1 to VRTC. This has the side effect of requiring that PMIC GPIO7/POWERHOLD also be pulled high. This results in an “always on” design that cannot be shut-off by software. An external PORz pulse generator like that implemented on the X15 GP EVM would need to be used to enable this feature. Please refer to i862 in the errata document for more information. A.8 PMIC implementation does not support required SOC shut-down sequence The AM5748 SOC requires that its supplies are sequenced on and off in the correct sequence to maintain the reliability as stated in the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982). The PMIC can enforce this start-up and also the shut-down sequence if the PMIC RESET_IN is driven low at least 1.1ms before the main supply to the PMIC collapses. However, the AM574x IDK EVM design does not contain a circuit for this. Please refer to the AM571 IDK EVM design (v1.3 or later) for an example of the required circuitry. A.9 USB port providing UART console and XDS100 emulation not isolated from EVM board supplies Whenever the EVM power supplies are cycled, the USB connection supporting the UART console and XDS100 emulation also drops. Since this port takes time to enumerate after power is restored, initial console output can be lost. Also, this results in power leakage from the USB VBUS back into the EVM when it is not powered. Please refer to the AM571 IDK EVM design (v1.3 or later) for an example of the required circuitry that will allow the USB bridge to remain properly powered and isolated from the EVM to prevent these negative affects. A.10 Need 47-µf capacitor at camera header Some camera video input instability has been seen. The solution for this is addition of a 47µF capacitor at the supply pin for the camera header. This has been implemented on the AM571x IDK EVM v1.3 and later. A.11 Decoupling capacitors do not reflect AM574x PDN recommendations Decoupling capacitors do not reflect AM574x PDN recommendations per Sitara Processor Power Distribution Networks: Implementation and Analysis (SPRAC76) These were corrected in the latest version of the AM571x IDK EVM. Please refer to the AM571 IDK EVM design (v1.3 or later) for an example of the required circuitry. A.12 CCS System Reset fails Warm reset and emulation reset events configured for warm reset cause the Texas Instruments Code Composer Studio™ (CCS) integrated development environment (IDE) to issue an error message. This is due to the reset erratum that requires all resets to trigger a PORz low event. Since this is not expected by CCS when it initiates a warm reset, it loses its context and issues an error. Newer versions of CCS handle this event better but an error message will always be generated. 38 Known Deficiencies in AM574x IDK EVM Copyright © 2018, Texas Instruments Incorporated SPRUIJ9 – April 2018 Submit Documentation Feedback www.ti.com A.13 AM574x IDK EVM design contains 2 clamp circuits that may not be necessary AM574x IDK EVM design contains 2 clamp circuits that may not be necessary During early investigation of power shut-down sequencing, it was determined that clamps were required on every 3.3V supply to the dual-voltage I/O cell supplies (VDDSHVx). This would enforce the requirement shown in Figure 5-3 of the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982) that states that the 3.3V supply inputs must never be more than 2.0V above the VDDS18V supply, even during ramping up or ramping down. The AM574x IDK EVM design contains these clamp circuits on both V3_3D, that powers almost all VDDSHVx supplies, and VSDMMC, that powers VDDSHV8 used with the SDCARD on MMC1. Later it was determined that the only method to maintain device reliability was to fully enforce the supply sequence requirements shown in Figures 5-1 and 5-2 of the AM574x Sitara Processors Silicon Revision 1.0 Data Manual (SPRS982). The companion PMIC, TPS6590379, was enhanced to provide a shortened shut-down sequence that enforces the DM requirements in a time period (~1ms) that the PMIC input can hold up the supplies. The PMIC also has supply discharge resistors to pull down the supplies quickly when they are turning off. These 2 capabilities in the companion PMIC make the clamp circuits superfluous. However, designs that use REGEN1 to power the VDDSHVx supplies through a power switch will still need the clamp circuit. The power switches available do not discharge the supplies quick enough. A.14 Crystal connected to osc0 needs to have 50 ppm or better long term accuracy The crystal connected to osc0 needs to have 50ppm or better long term accuracy since it generates clocks used for Ethernet interfaces. The current crystal has 30ppm accuracy and 50ppm temperature variation for a combined tolerance of 80ppm. It also has aging of 2ppm per year. A.15 Software must program the CDCE913 for 0-pf load capacitance Software must program the CDCE913 for 0pf load capacitance to allow crystals to operate at their target frequency. Crystal load capacitors can be added to the oscillator circuit to allow the generated clock to output at the required nominal frequency so that this programming is not required. The default capacitance within the CDCE913 is 10pF so the capacitors C172, C173, C193, and C194 should be 8pF. Please refer to the CDCE(L)913: Flexible Low Power LVCMOS Clock Generator With SSC Support for EMI Reduction Data Manual (SCAS849) for more information. Also note that these clock generators are used to drive the Ethernet circuitry, so the same crystal accuracy requirement from Section A.14 applies to these crystals as well. A.16 PHY address LSB for U9 and U15 can be latched incorrectly The PHY address LSB for U9 and U15 gets determined by the signal level at the PHY's COL pin during reset release. The PHY has a pull-down resistor connected to this pin to enable latching the value of 0. Unfortunately, this pin is also connected to one of the RJ-45 connector LEDs that pulls the signal to an undefined voltage of about 1.4V during the reset time. Therefore, the PHY address can incorrectly latch a value of 1. The LED circuit should be configured for active-high indication and the connections to the LED reversed with the cathode connected to ground. This allows the LSB of the address to be properly latched. Please refer to Section 6 of the TLK1XX Design and Layout Guide Application Report (SLVA531) for more information. The current software workaround programs the RXLINK pin with a pull-down resistor and then pulses the PHY reset from a GPIO, to cause it to latch the PHY address correctly. SPRUIJ9 – April 2018 Submit Documentation Feedback Known Deficiencies in AM574x IDK EVM Copyright © 2018, Texas Instruments Incorporated 39 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated
TMDSIDK574 价格&库存

很抱歉,暂时无法提供与“TMDSIDK574”相匹配的价格&库存,您可以联系我们找货

免费人工找货