User's Guide
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TMP117EVM User Guide
The TMP117 is part of the ultra high-precision temperature sensor family that is pin-compatible with the
TMP116 and has an offset register to compensate and improve the system error. The TMP117 is ready to
use out of the box and does not require any additional calibration. It provides up to ±0.1°C accuracy over
the range of body temperature 30°C to +42°C, and ±0.2°C accuracy over the −55°C to +150°C range with
16-bit resolution, giving a temperature resolution of 0.0078125°C. The TMP117’s accuracy in the human
body temperature range makes it ideal for medical applications. The Texas Instruments TMP117EVM
(Evaluation Module) provides the user a simple way to get started with TMP117. The module and GUI are
designed to provide the user a quick setup to evaluate the system and register map with simply a few click
powered by GUI Composer. The EVM features a perforation that allows the temperature sensor to be
placed away from the MSP430 for remote temperature measurements and a header to connect multiple
TMP117's to the controller. This document provides detailed information about the hardware design and
software installation.
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1
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1
2
3
4
5
6
7
8
9
Contents
Overview ...................................................................................................................... 3
EVM Kit Contents ............................................................................................................ 3
Board Connectors and Components ...................................................................................... 4
System Setup ................................................................................................................ 6
Software Installation ......................................................................................................... 6
Upgrading the Firmware ................................................................................................... 15
TMP117EVM Setup and Operation ...................................................................................... 18
Board Layout ................................................................................................................ 25
Schematic and Bill of Materials ........................................................................................... 27
List of Figures
1
TMP117 Evaluation Board Top Side ...................................................................................... 4
2
TMP117 Evaluation Board Bottom Side .................................................................................. 4
3
TMP117EVM Hardware Setup ............................................................................................. 6
4
Gallery Home Page.......................................................................................................... 7
5
Cookies Agreement
6
Browser Extension and TI Cloud Installation............................................................................. 8
7
TMP117EVM GUI Download Platform .................................................................................... 9
8
GUI Composer Runtime Wizard.......................................................................................... 10
9
GUI Composer Installation Directory .................................................................................... 11
10
Installing GUI Composer Runtime
11
Driver Signature ............................................................................................................ 12
12
TMP117EVM Installation Finish .......................................................................................... 12
13
TMP117EVM GUI License Agreement .................................................................................. 13
14
Installing TMP117EVM GUI............................................................................................... 13
15
TMP117EVM Installation Finish .......................................................................................... 14
16
TMP117EVM Connection Diagram ...................................................................................... 15
17
Wiring Connection.......................................................................................................... 16
18
UniFlash GUI
17
19
Confirmation of USB-to-I2C Converter Driver Installation
18
20
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24
25
26
27
28
29
30
31
32
.........................................................................................................
.......................................................................................
...............................................................................................................
............................................................
TMP117EVM Default Tab .................................................................................................
Data Capture Tab ..........................................................................................................
TMP117 Setup Tab ........................................................................................................
Configuration Tab ..........................................................................................................
Registers Tab ...............................................................................................................
Collateral Tab ...............................................................................................................
Top Assembly Layer .......................................................................................................
Top Layer Routing .........................................................................................................
Power Layer Routing ......................................................................................................
Ground Layer Routing .....................................................................................................
Bottom Layer Routing .....................................................................................................
Bottom Assembly Layer ...................................................................................................
TMP117EVM Schematic ..................................................................................................
7
11
19
20
21
22
23
24
25
25
25
26
26
26
27
List of Tables
2
1
EVM Kit Contents ............................................................................................................ 3
2
Device and Package Configurations ...................................................................................... 4
3
I2C Slave Addresses ........................................................................................................ 5
TMP117EVM User Guide
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Overview
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TMP117EVM Bill of Materials............................................................................................. 28
Trademarks
Microsoft Windows is a registered trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.
1
Overview
The TMP117EVM allows users to evaluate the performance of the best digital temperature sensor
available in very small QFN package. The EVM comes in a USB stick form factor with an onboard
MSP430F5528 microcontroller that interfaces with both the host computer and up to four TMP117 devices
using I2C interface. The TMP117EVM, however, can only be configured with two devices under addresses
0x48 and 0x49. The module is designed to provide user flexibility separating the TMP117 and MSP430 at
the perforation location on the EVM board. The perforation allows the user to connect wires, cable, or
header to both ends for remote temperature measurements or connects to desired system as well as
connecting additional TMP117s.
2
EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the Texas Instruments Product Information Center
nearest you if any component is missing. TI highly recommends that users check the TI website at
http://www.ti.com to verify if they have the latest versions of the related software.
Table 1. EVM Kit Contents
ITEM
QUANTITY
PCB test board: TMP117EVM
1
USB cable extender
1
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Board Connectors and Components
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Board Connectors and Components
The jumpers and connectors on the EVM and how to properly connect, set up, and use the TMP117
Bench Board are described here.
3.1
Input/Output Connector Description and Components
USB Connector (J2)
Breakouts
TMP117
Figure 1. TMP117 Evaluation Board Top Side
Figure 2. TMP117 Evaluation Board Bottom Side
Table 2. Device and Package Configurations
3.1.1
DEVICE
IC
PACKAGE
U4
TMP117AIDRVR
WSON (6)
EVM Power Supply Input – J1
TMP117EVM uses the +5-V input power supply of the USB connector to power the EVM. The EVM does
not require an external power supply. The board is powered by the USB port and provides switched +5 V.
It can be powered by shorting the J1 pin 1-2 jumper with a regulated desired voltage based on the
Equation 1. The EVM power supply input can be changed to any input power supply range of the TMP117
1.8 V to 5.5 V by removing the shunt and the resistor R3, and applied to the external power supply
through the J1 pin 2 (V+) and pin 3 (ground). Note that MSP430, however, can only support power supply
range 2.3 V to 3.6 V with recommends V_OH and V_OL conditions per TMP117 datasheet specifications.
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Board Connectors and Components
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The resistor adjust R_ADJ can be calculated as given by the Equation 1 where V_REF=1.23 V and
desired voltage of V_OUT.
ª
§ R
·º
VOUT VREF « VREF u ¨ ADJ ¸ »
© 51.1k: ¹ ¼
¬
R ADJ
3.1.2
ª§ V
· º
51.1k: u «¨ OUT ¸ 1»
¬«© VREF ¹ »¼
(1)
(2)
Interface Connector – J2
J2 is the USB connector and is used to connect the PC. The interface is used to access the device’s
registers and read the conversion data from the TMP117 through I2C communication protocol.
3.1.3
Debug Jumper – J4
J4 is the connector that allows debugging the firmware using three wires instead of the standard 14 pins
header. This connector is not populated.
3.1.4
Pushbutton Switch – SW1
Basically, the SW1 reference designator is to bring the MSP430 into a BSL mode for upgrading the
firmware with combination of the USB connector manually referring to the picture in Figure 1 BSL button
(SW1 switch). Press and hold the switch SW1 next to the USB connector while plugging the USB cable
from the board to the PC. This will allow bringing the MSP430 into BSL mode.
3.1.5
Header Connector – J3
The purpose of the header connector is to isolate the heat source from coming directly to the TMP117,
and the perforation allows user to snap at the break tab. When the TMP117 is separated from the
MSP430, it can be connected through wires or header to both ends for remote temperature
measurements.
3.1.6
LED – (D4, D6, D7)
There are a total of three LEDs on the board: green (D4), red (D6), and orange (D7). The green LED is
the power supply indicator, and it should be turn ON. The orange LED should not blink when the EVM is
initially plugged into the PC. The orange LED will blink if the power on reset tests on the MSP430
microcontroller fails on start-up. The red LED is the Alert pin indicator when the Alert pin is pulling LOW.
3.1.7
I2C Slave Addresses – (R15, R16)
TMP117 is capable of supporting four I2C 7-bit addresses. The TMP117 is connected to the bus by a
unique slave address to operate data transfer from the master-transmitter to the slave-receiver or slavetransmitter to the master-receiver. The TMP117 can be configured desired four serial bus addresses
depending on the state of the ADD0 as Table 3. At default, the resistor R16 is soldered, and configured for
0x48h address. For this TMP117EVM, you can only connect two I2C addresses: 0x48 and 0x49. For more
details information, refer to the Address Pin and Slave Addresses for the TMP117 table in the TMP117x
High-Accuracy, Low-Power, Digital Temperature Sensor With SMBus- and I2C-Compatible Interface data
sheet (SNOSD82).
Table 3. I2C Slave Addresses
CORRESPONDING EVM
RESISTOR
ADD0 PIN CONNECTION
R16
R15
SLAVE ADDRESS
BINARY
HEX
GND
1001000
0x48
V+
1001001
0x49
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System Setup
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System Setup
The TMP117EVM hardware consists of the USB2ANY Platform and the TMP117 altogether in one single
board. The unit is easily connected through USB connector into the computer as shown in Figure 3.
Figure 3. TMP117EVM Hardware Setup
5
Software Installation
5.1
Graphical User Interface (GUI)
The EVM software is tested on the Microsoft Windows 7 and 10 operating system (OS). The software also
functions on other Windows operating systems. The EVM software is available through the EVM product
folder on the TI website through the hyperlink. The hyperlink will bring to TI Cloud where a common
repository of all published applications using GUI Composer framework. The applications can be ran
directly from Gallery with minimal install or download the applications from Gallery with runtime to run on
desktop local machine. The applications is supported to use on many platforms (web, Windows, Linux,
OSX); however, Linux and OSX might require driver. To download the software to your system, simply
follows the instructions below.
5.1.1
Run Applications Through Online
1. Go to the TMP117EVM web page on the TI website: http://www.ti.com/tool/TMP117EVM. Scroll down
to the “Software” section and click on the hyperlink to download the latest evaluation software or an
alternate way is to connect directly to the gallery by clicking on this link http://dev.ti.com/gallery/. It
might require to login user account privileges to use the online version as well as installation of the
applications.
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2. On the top middle of the gallery main page, navigating to search box and type TMP117EVM GUI as
shown in the Figure 4.
Figure 4. Gallery Home Page
3. Click on the TMP117EVM GUI icon. Users may be prompted to download and install the browser
extension for the Firefox or Chrome and TI Cloud Agent Application for the first time. Click on Agree
and Proceed.
Figure 5. Cookies Agreement
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Software Installation
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4. Follow the steps to install the browser extension and TI Cloud Agent Applications in Figure 6.
Figure 6. Browser Extension and TI Cloud Installation
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5.1.2
Run Applications on Desktop
1. In TMP117EVM GUI icon, click on the download icon to download the
TMP117EVM_GUI_installer_win.zip. A pop-up screen shows appear, and select the desired platform to
install into your local machine.
2. Unzip the downloaded file into a known directory, and run the “TMP117EVM_GUI-1.0.16.setupwin_6.0.0.exe” file located in [Unzip location]. The EVM software installer then begins the installation
process.
Figure 7. TMP117EVM GUI Download Platform
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Software Installation
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3. Follow the on-screen instructions by clicking the “Next” button to install the GUI Composer runtime
engine. If it is the first time installation, TMP117EVM GUI is required GUI Composer runtime engine
v6.0 in order proper operation.
Figure 8. GUI Composer Runtime Wizard
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Figure 9. GUI Composer Installation Directory
4. Click on the "Next" button to accept the default installation directory. It takes sometimes to complete
the setup GUI Composer Runtime installation.
Figure 10. Installing GUI Composer Runtime
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5. If the GUI Composer Runtime reports an error installing drivers that are missing signatures, click on
Install this driver software anyway to clear the unsigned signature driver issues.
Figure 11. Driver Signature
6. After the GUI Composer installation, it continues to install TMP117EVM GUI as shown in Figure 12.
Follow the on-screen instructions by clicking the Next button to install the software. Accept the license
agreements presented in Figure 13 to continue.
Figure 12. TMP117EVM Installation Finish
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Figure 13. TMP117EVM GUI License Agreement
7. Wait for the EVM software installer to start the installation process as shown in Figure 14.
Figure 14. Installing TMP117EVM GUI
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8. Uncheck the View readme file checkbox and click Finish when the installation process is complete.
Figure 15. TMP117EVM Installation Finish
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Upgrading the Firmware
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6
Upgrading the Firmware
There are two ways to upgrade or program the firmware of the TMP117EVM board. However, this
document will only show one method because the resonator is unable to bring the MSP430 into BSL
mode.
CAUTION
TMP117EVM software must be installed before performing any tasks.
Figure 16. TMP117EVM Connection Diagram
To update the firmware of the TMP117EVM, complete the procedure below:
1. Short the J1 header connector pin 1-2 with a shunt. Plug the USB cable to the PC to power the
TMP117EVM.
2. Connect another USB cable to MSP-EXP430F5529LP board
3. Remove the SBW RST and SBW TST jumpers on MSP-EXP430F5529LP board
4. Create wiring harness shown by connecting jumper wires to SBW RST, SBW TST and GND as shown
in Figure 17.
5. Connect the header to the TMP117EVM on J4 connector by tilting header to make contact to the
TMP117EVM J4 connector. Connect the wires according to this label SBW RST = TDIO, SBW TST =
TCK, and GND = GND. Refer to Figure 2 for more detailed information.
6. Install offline UniFlash from http://www.ti.com/tool/UNIFLASH or navigate to http://dev.ti.com/gallery/
running off online version.
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Upgrading the Firmware
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Figure 17. Wiring Connection
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7. Connect your MSP Debugger to the PC.
8. Select MSP430FR5528 as the target and click Start
Figure 18. UniFlash GUI
9. Browse to the firmware file name is USB2ANY_F5528.txt version v2.7.16. The firmware image is
programmed, and the TMP117EVM restarts automatically. The new firmware is now ready to use as
shown in Figure 19.
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TMP117EVM Setup and Operation
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TMP117EVM Setup and Operation
CAUTION
Do not exceed the power supply rating of the MSP430.
7.1
Launching and Running the Software
The TMP117EVM is recognized by the host as a generic human interface device (HID), so there is no
proprietary driver is required to install on your PC. It shows the typical response to connecting the USB-toI2C converter board to a PC USB port for the first time. Typically, the computer responds with a Found
New Hardware, USB device pop-up dialog. The pop-up window then typically changes to Found New
Hardware, USB Human Interface Device. This pop-up indicates that the device is ready to be used. The
USB-to-I2C Converter uses the human interface device drivers that are part of the Microsoft Windows®
operating system.
Figure 19. Confirmation of USB-to-I2C Converter Driver Installation
The TMP117EVM GUI can be run from TI Cloud repository http://dev.ti.com/gallery/ via Firefox or Chrome
browser or from Windows desktop offline.
1. Connect the TMP117EVM to a USB port on a PC as shown in Figure 19.
2. Launch the TMP117EVM software by clicking on the TMP117EVM GUI icon in gallery. The TMP117
EVM GUI should automatically initialize and connect to the HID port. A successful connection will show
“HARDWARE CONNECTED” on the bottom of the GUI status indicator. If there is a connection
problem, verify if the TMP117EVM has an established connection with the PC. A fail connection if the
status indicator shows as “HARDWARE NOT CONNECTED”.
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7.2
Tab Pages Selection
The tab pages selection consists of six tabs, Home, Data Capture (Temperature Graph), EVM Setup,
Device Configuration, Registers, and Collateral. Launching the software will take you to the Home window
GUI display. By clicking on the page tab allows switching between pages of the tab control as shown in
Figure 20.
Figure 20. TMP117EVM Default Tab
7.3
Home Tab
When the TMP117EVM GUI launched, the HOME page will be appeared as shown in Figure 20. There
are two ways that each tab can be navigated. On the bottom half of the HOME page contains icons where
it links to the five other GUI pages. The icons are identical features to those locked in the left-most border
of the TMP117EVM GUI. If TMP117EVM is powered and connected to the PC that has the correct
firmware loaded, the Hardware Connected will appear at the left corner of the status bar as well as the
connected icon shows solid.
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Data Capture Tab
The Data Capture tab provides graphing the temperature result as well as other features as shown in
Figure 21. The temperature result will be fetched automatically according to the conversion cycle setting
bits in the configuration register. It displays and processes the register value into a converted human
readable format for the GUI. The two modes of graphing can be displayed Celsius or Fahrenheit.
Figure 21. Data Capture Tab
Clear Chart erases the contents of the Temperature Chart box
Save Chart prompts for a file name, and then saves the contents of the current Temperature graph box to
*.csv file.
Current Value shows the current temperature of the TMP117 on the top right.
Celsius or Fahrenheit is to toggle the temperature conversion Celsius to Fahrenheit.
One Shot is available on the Temperature Chart tab. The One Shot button writes to the TMP117
configuration register with the one-shot in conversion mode. This setting initiates a temperature
conversion within the TMP117 device that updates the temperature result registers when the radio button
is selected. After the one-shot conversion finishes, the device goes into shutdown, and wait for the time
based on the averaging bits setting written in the configuration register.
Continuous performs the temperature conversion continuously when the MOD[1:0] bits are configured in
the configuration register to 00. Each temperature conversion consists of an active conversion period
followed by a standby period based on the time of the conversion cycle and conversion averaging
configuration.
Alert High and Low Limit Register can be set by entering the value in °C or °F based on °C/°F control
on Main tab that stores the high and low limit for comparison with the temperature result.
Offset Temperature is allowed to program the offset temperature to compensate and improve the system
error. This register will be cleared when power down unless the LOCK is set.
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7.5
EVM Setup Tab
It is necessary to configure the TMP117 slave address as 0x48 for communication with the EVM-GUI. This
is the default slave address.
Figure 22. TMP117 Setup Tab
Firmware Read is allowed to check the firmware revision on the MSP430F5528 microcontroller.
I2C Configuration is to change the bus frequency and slave address.
Device ID is automatically read device identification.
Software Reset performs software reset on the TMP117 device by issuing a general call. After software
reset, the values displayed in the EVM software may be out of sync with the device register contents. To
sync register contents after TMP117 reset, click Read All in the Registers tab page.
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7.6
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Configuration Tab
The Device Configuration allows user to configure the device's setting.
Figure 23. Configuration Tab
Configuration register can be set to desired value by selecting the drop-down menu.
Non-volatile memory can be programmed by entering the value at the location 1 to 3 then use the
EEPROM dropdown menu to lock the value. This LOCK bit will also lock the value of the offset
temperature register.
Alert High and Low Limit register can be set by entering the value in °C/°F. In Fahrenheit mode, it
converts Fahrenheit to Celsius before it sends to the TMP117.
Status indicator displays the outputs based on the status bits.
Temperature displays the current temperature of the TMP117.
Offset Temperature is allowed to program the offset temperature to compensate and improve the system
error. This register will be cleared when power down unless the LOCK is set.
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7.7
Register Tab
The Register Map page shown in Figure 24 allows low-level access to all I2C registers of the TMP117
device. Clicking on the question mark to the right of the Register Name will bring up an extraction short
version from the datasheet describing that register. Clicking on a specific Register Name will populate the
Field View to on the right side of the screen. The Field View describes each bit field within that register.
The “Registers” tab provides access to the registers raw data of the TMP117, performing read and writes
commands. Changes to the configuration page are mirrored here, and vice versa.
Figure 24. Registers Tab
Read Registers is performed one single for the selected register.
Read All Registers performs a read for all registers contents.
Auto Read is allowed user to set desired time frame fetching each data.
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TMP117EVM Setup and Operation
7.8
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Collateral Tab
The last page of the GUI is the Collateral page in Figure 25 which contains links to web documents
pertinent to the TMP117 and its EVM. The page is divided into four sections: (1) User Guide, (2)
Datasheet, (3) Application Notes, (4) Video.
Figure 25. Collateral Tab
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Board Layout
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Board Layout
Figure 26. Top Assembly Layer
Figure 27. Top Layer Routing
Figure 28. Power Layer Routing
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Board Layout
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Figure 29. Ground Layer Routing
Figure 30. Bottom Layer Routing
Figure 31. Bottom Assembly Layer
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Schematic and Bill of Materials
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Schematic and Bill of Materials
Figure 32. TMP117EVM Schematic
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Schematic and Bill of Materials
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Table 4. TMP117EVM Bill of Materials
Package
Reference
Part Number
Manufacturer
CAP, CERM, 6.8 pF, 25 V, +/- 5%,
C0G/NP0, 0402
0402
GRM1555C1E6R8CA01D
MuRata
2.2uF
CAP, CERM, 2.2 uF, 16 V, +/- 10%, X5R,
0402
0402
GRM155R61C225KE11D
MuRata
1
10uF
CAP, CERM, 10 uF, 10 V, +/- 20%, X5R,
0603
0603
C1608X5R1A106M080AC
TDK
C4
1
220pF
CAP, CERM, 220 pF, 50 V, +/- 10%, X7R,
0402
0402
GRM155R71H221KA01D
MuRata
C5
1
22uF
CAP, CERM, 22 uF, 10 V, +/- 20%, X5R,
0603
0603
C1608X5R1A226M080AC
TDK
C6, C7
2
0.1uF
CAP, CERM, 0.1 uF, 16 V, +/- 5%, X7R,
0402
0402
GRM155R71C104JA88D
MuRata
C8
1
2200pF
CAP, CERM, 2200 pF, 100 V, +/- 10%, X7S, 0402
AEC-Q200 Grade 1, 0402
CGA2B3X7S2A222K050B
B
TDK
C9, C11
2
0.22uF
CAP, CERM, 0.22 uF, 16 V, +/- 10%, X5R,
0402
0402
C1005X5R1C224K050BB
TDK
C10
1
0.47uF
CAP, CERM, 0.47 uF, 10 V, +/- 10%, X5R,
0402
0402
GRM155R61A474KE15D
MuRata
C12, C13,
C14
3
0.1uF
CAP, CERM, 0.1 uF, 10 V, +/- 10%, X5R,
0402
0402
C1005X5R1A104K050BA
TDK
D1
1
4.3V
Diode, Zener, 4.3 V, 300 mW, SOD-523
SOD-523
BZT52C4V3T-7
Diodes Inc.
D2, D3
2
1-Channel ESD Protection Diode With Low
Dynamic Resistance for HDMI 2.0 and USB
3.0, DPL0002A (X2SON-2)
DPL0002A
TPD1E04U04DPLR
Texas Instruments
D4
1
Green
LED, Green, SMD
LED_0603
LTST-C191TGKT
Lite-On
D5
1
6.2V
Diode, Zener, 6.2 V, 300 mW, SOD-523
SOD-523
BZT52C6V2T-7
Diodes Inc.
D6
1
Red
LED, Red, SMD
LED_0603
LTST-C191KRKT
Lite-On
D7
1
Orange
LED, Orange, SMD
LED_0603
LTST-C191KFKT
Lite-On
J1
1
Header, 2.54 mm, 3x1, Gold, TH
Header,
2.54 mm,
3x1, TH
GBC03SAAN
Sullins Connector
Solutions
J2
1
Connector, Plug, USB Type A, R/A, Top
Mount SMT
Edge
48037-2200
mount USB
A CONN
Molex
L1
1
120 ohm
Ferrite Bead, 120 ohm at 100 MHz, 0.55 A,
0402
0402
BLM15AG121SN1D
MuRata
R1, R2, R7
3
33
RES, 33, 5%, 0.063 W, AEC-Q200 Grade 0,
0402
0402
CRCW040233R0JNED
Vishay-Dale
Designator Quantity
Value
Description
C1
1
6.8pF
C2
1
C3
28
TMP117EVM User Guide
Alternate Part
Number
Alternate
Manufacturer
TPD1E04U04DPLT Texas Instruments
SNOU161 – June 2018
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Schematic and Bill of Materials
www.ti.com
Table 4. TMP117EVM Bill of Materials (continued)
Package
Reference
Part Number
Manufacturer
RES, 0, 5%, 0.063 W, AEC-Q200 Grade 0,
0402
0402
CRCW04020000Z0ED
Vishay-Dale
1.5k
RES, 1.5 k, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW04021K50JNED
Vishay-Dale
1
10k
RES, 10 k, 5%, 0.1 W, AEC-Q200 Grade 0,
0402
0402
ERJ-2GEJ103X
Panasonic
R6
1
86.6k
RES, 86.6 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW040286K6FKED
Vishay-Dale
R8
1
51.1k
RES, 51.1 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW040251K1FKED
Vishay-Dale
R9
1
1.2Meg
RES, 1.2 M, 5%, 0.063 W, AEC-Q200
Grade 0, 0402
0402
CRCW04021M20JNED
Vishay-Dale
R11, R12,
R13, R14
4
5.1k
RES, 5.1 k, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW04025K10JNED
Vishay-Dale
R17
1
33k
RES, 33 k, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW040233K0JNED
Vishay-Dale
R18
1
1.0k
RES, 1.0 k, 5%, 0.063 W, AEC-Q200 Grade
0, 0402
0402
CRCW04021K00JNED
Vishay-Dale
R19
1
0
RES, 0, 5%, 0.1 W, AEC-Q200 Grade 0,
0603
0603
CRCW06030000Z0EA
Vishay-Dale
SH-J1
1
Shunt, 100mil, Tin plated, Black
Shunt
SNT-100-BK-T-H
Connector
Black Open
Top, 2x1
Samtec
SW1
1
Switch, SPST-NO, Off-Mom, 0.05A, 12VDC,
SMD
3.9x2.9mm
PTS820 J20M SMTR LFS
C and K
Components
TP1
1
Test Point, Miniature, Black, TH
Black
Miniature
Testpoint
5001
Keystone
U1
1
Micropower 50 mA Ultra Low-Dropout
Adjustable Voltage Regulator in SOT-23,
DBV0005A (SOT-23-5)
DBV0005A
LP2980IM5X-ADJ/NOPB
Texas Instruments
U2
1
25 MHz Mixed Signal Microcontroller with
RGC0064B MSP430F5528IRGCR
128 KB Flash, 8192 B SRAM and 47 GPIOs,
-40 to 85 degC, 64-pin QFN (RGC), Green
(RoHS and no Sb/Br)
Texas Instruments
U3
1
Low-Power Single Inverter Gate,
DSF0006A, LARGE T and R
SN74AUP1G04DSFR
Texas Instruments
U4
1
High-Accuracy, Low-Power, Digital
DRV0006B
Temperature Sensor With SMBus- and I2CCompatible Interface, DRV0006B (WSON-6)
TMP117-DRV0006B
Texas Instruments
Designator Quantity
Value
Description
R3, R10,
R16
3
0
R4
1
R5
DSF0006A
SNOU161 – June 2018
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Alternate Part
Number
Alternate
Manufacturer
LP2980IM5ADJ/NOPB
Texas Instruments
TMP117EVM User Guide
Copyright © 2018, Texas Instruments Incorporated
29
Schematic and Bill of Materials
www.ti.com
Table 4. TMP117EVM Bill of Materials (continued)
Package
Reference
Part Number
Manufacturer
Resonator, 4 MHz, 5000 ppm, AEC-Q200
Grade 1, SMD
4.5x2mm
PBRV4.00MR50Y000
AVX
FID1, FID2, 0
FID3
Fiducial mark. There is nothing to buy or
mount.
N/A
N/A
N/A
J3
0
Header, 100mil, 5x2, Tin, TH
Header,
5x2,
100mil, Tin
PEC05DAAN
Sullins Connector
Solutions
J4
0
Header, 2.54 mm, 3x1, Gold, TH
Header,
2.54 mm,
3x1, TH
GBC03SAAN
Sullins Connector
Solutions
R15
0
RES, 0, 5%, 0.063 W, AEC-Q200 Grade 0,
0402
0402
CRCW04020000Z0ED
Vishay-Dale
Designator Quantity
Y1
30
Value
1
0
Description
TMP117EVM User Guide
Alternate Part
Number
Alternate
Manufacturer
SNOU161 – June 2018
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Copyright © 2018, Texas Instruments Incorporated
SNOU161 – June 2018
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TMP117EVM User Guide
31
Schematic and Bill of Materials
www.ti.com
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
32
TMP117EVM User Guide
SNOU161 – June 2018
Submit Documentation Feedback
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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