TMP127-Q1
SBOSA50A – DECEMBER 2021 – REVISED MARCH 2022
TMP127-Q1 Automotive Grade, 0.8 °C SPI Temperature Sensor With 175 °C Operation
1 Features
3 Description
•
The TMP127-Q1 is a high accuracy 0.8 °C
digital temperature sensor that supports an ambient
temperature range of -55 °C to 175 °C. The TMP127Q1 features a 14-bit signed temperature resolution
(0.03125 °C per LSB) while operating over a supply
range of 1.62 V to 5.5 V. The device has excellent
PSR, able to maintain accuracy over the entire supply
range. With a fast conversion rate, low supply current,
simple SPI compatible interface, and an enhanced
operational temperature range it is ideal for a wide
range of applications.
•
•
•
•
•
•
•
The TMP127-Q1 SPI interface features a simplified
no register map protocol, with a read-only 3-Wire
configuration and an optional read-write 4-Wire
configuration. The TMP127-Q1 is a drop-in, software
compatible replacement to the LM71 and is available
in a small SOT package for close placement to heat
sources and quick response times.
Device Information
2 Applications
•
•
•
•
•
•
•
•
•
•
PACKAGE(1)
PART NUMBER
TMP127-Q1
Transmission control units
On-board chargers (OBC)
Brake systems
Field transmitters
Building and factory automation
Avionics
Ultrasonic level sensing
Vehicle control units (VCU)
Powertrain exhaust sensor
Electric power steering (EPS)
(1)
SOT-23 (6)
BODY SIZE (NOM)
2.90 mm x 1.60 mm
For all available packages, see the orderable addendum at
the end of the data sheet.
1.2
1.62 V to 5.5 V
Average Accuracy
0.9
VDD
MCU
GPIO
CS
POCI
SIO TMP127-Q1
CLK
SCLK
GND
Simplified Application
0.1 µF
Temperature Error (C)
•
AEC-Q100 qualified for automotive applications:
– Device temperature grade-0: –55 °C to 175 °C
ambient operating temperature
– Device HBM classification level 2
– Device CDM classification level C2b
Functional Safety Capable
– Documentation available to aid functional safety
system design
High accuracy
– ±0.8 °C (maximum) from –55 °C to 150 °C
– ±1 °C (maximum) from 150 °C to 175 °C
Supply range of 1.62 V to 5.5 V
Automated continuous conversion mode
Shutdown mode
Low power consumption
– Typical standby current of 0.5 µA
– Typical shutdown current of 0.35 µA
Factory calibrated
3-wire SPI interface
0.6
0.3
0
-0.3
-0.6
-0.9
-1.2
-55
-30
-5
20
45
70
95
Temperature (C)
120
145
170
Temperature Accuracy
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP127-Q1
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison......................................................... 3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings........................................ 4
7.2 ESD Ratings............................................................... 4
7.3 Recommended Operating Conditions.........................4
7.4 Thermal Information....................................................4
7.5 Electrical Characteristics.............................................5
7.6 SPI Interface Timing....................................................7
7.7 Timing Diagrams......................................................... 7
7.8 Typical Characteristics................................................ 7
8 Detailed Description........................................................9
8.1 Overview..................................................................... 9
8.2 Functional Block Diagram........................................... 9
8.3 Feature Description...................................................10
8.4 Device Functional Modes..........................................10
8.5 Programming.............................................................11
9 Application and Implementation.................................. 14
9.1 Application Information............................................. 14
9.2 Typical Applications.................................................. 14
10 Power Supply Recommendations..............................16
11 Layout........................................................................... 16
11.1 Layout Guidelines................................................... 16
11.2 Layout Example...................................................... 16
12 Device and Documentation Support..........................17
12.1 Receiving Notification of Documentation Updates..17
12.2 Support Resources................................................. 17
12.3 Trademarks............................................................. 17
12.4 Electrostatic Discharge Caution..............................17
12.5 Glossary..................................................................17
13 Mechanical, Packaging, and Orderable
Information.................................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (December 2021) to Revision A (March 2022)
Page
• Changed data sheet status from: Advanced Information to: Production Data....................................................1
2
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5 Device Comparison
Table 5-1. Device Comparison
Feature
TMP127-Q1
TMP127-Q1
Accuracy
0.25 °C
0.8 °C
Packages
DBV, DCK
DBV
Continuous and shutdown mode
●
●
175 °C operation
●
●
Grade-0
●
●
NIST Traceable
●
Alert pin functionality
●
Slew rate warning
●
CRC option
●
6 Pin Configuration and Functions
CS
1
6
VDD
GND
2
5
NC
SIO
3
4
SCLK
Not to scale
Figure 6-1. DBV 6-Pin SOT-23 (Top View)
Table 6-1. Pin Functions
PIN
NAME
NO.
CS
1
GND
SIO
I/O
DESCRIPTION
I
Active low chip select signal to activate SPI interface
2
–
Ground
3
I/O
Peripheral input/output
SCLK
4
I
Peripheral clock input
NC
5
NC
VDD
6
–
No Connect. Must be left floating or grounded.
Supply voltage
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7 Specifications
7.1 Absolute Maximum Ratings
Over free-air temperature range unless otherwise noted(1)
MIN
MAX
UNIT
Supply voltage
VDD
–0.3
6
V
I/O voltage
SIO
–0.3 VDD + 0.2 V
V
I/O voltage
CS, SCLK
–0.3
6
V
Operating junction temperature, TJ
–65
180
°C
Storage temperature, Tstg
–65
180
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
V(ESD)
Electrostatic discharge
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002
HBM classification level 2
±2000
V
Charged-device model (CDM), per AEC Q100-011
CDM classification level C2b
±750
V
7.3 Recommended Operating Conditions
VDD
Supply voltage
VI/O
SIO
VI/O
CS, SCLK
TA
Operating ambient temperature(1)
(1)
MIN
NOM
MAX
1.62
3.3
5.5
V
VDD
V
0
UNIT
0
5.5
V
-55
175
°C
HTOL was performed at 175 °C for 1410 hours
7.4 Thermal Information
TMP127-Q1
THERMAL METRIC(1)
DBV (SOT-23)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
168.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
85.5
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
–
°C/W
RθJB
Junction-to-board thermal resistance
48.1
°C/W
ψJT
Junction-to-top characterization parameter
27.5
°C/W
ψJB
Junction-to-board characterization parameter
47.9
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
Over free-air temperature range and VDD = 1.62 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25 °C
and VDD = 3.3 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE SENSOR
TERR
PSR
Temperature accuracy
-55 ℃ to 150 ℃
-0.8
0.8
°C
Temperature accuracy
150 ℃ to 175 ℃
-1
1
°C
DC power supply rejection
12.7
Including sign bit
TRES
Temperature resolution
TREPEAT
Repeatability(1)
VDD = 3.3 V
TLTD
Long-term stability and drift(2)
1000 hours at 175 °C
LSB
Temperature cycling and
hysteresis(3)
tCONV_PERIOD Conversion Period
tCONV
Active conversion time
4.5
m°C/V
14
Bits
31.25
m°C
±1
LSB
0.07
°C
±0.5
LSB
200
270
ms
6
7.5
ms
20
pF
DIGITAL INPUT/OUTPUT
CIN
Input capacitance
f = 1 MHz
VIH
Input logic high level
SCLK, SIO, CS
0.7 * VDD
VDD
V
VIL
Input logic low level
SCLK, SIO, CS
0
0.3 * VDD
V
IIN
Input leakage current
SCLK, SIO, CS
-0.5
0.5
μA
VOH
SIO output high level
IOH = 3 mA
VDD - 0.4
VDD
V
VOL
SIO output low level
IOL = -3 mA
0
0.4
V
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Over free-air temperature range and VDD = 1.62 V to 5.5 V (unless otherwise noted); Typical specifications are at TA = 25 °C
and VDD = 3.3 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
77
87
UNIT
POWER SUPPLY
IDD_ACTIVE
Supply current during active
conversion
TA = 25 °C
CS = VDD
TA = -55 °C to 150 °C
135
TA = 175 °C
160
TA = 25 °C
IDD
Average current consumption
CS = VDD
2.65
TA = -55 °C to 150 °C
TA = 25 °C
Standby current(4)
ISB
CS = VDD
0.75
15
TA = -55 °C to 175 °C
34
0.35
μA
0.5
ISD
Shutdown current
VPOR
Power-on reset threshold voltage Supply rising
1.3
Brownout detect
Supply falling
1.1
V
Reset Time
Time required by device to reset
0.5
ms
TA = -55 °C to 150 °C
15
TA = -55 °C to 175 °C
tRESET
(1)
(2)
(3)
(4)
6
μA
38
0.5
TA = -55 °C to 150 °C
TA = 25 °C
CS = VDD
4
19
TA = 175 °C
μA
μA
34
V
Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
Long term stability is determined using accelerated operational life testing at a junction temperature of 150 °C.
Hysteresis is defined as the ability to reproduce a temperature reading as the temperature varies from room → hot
→room→cold→room. The temperatures used for this test are -40 °C, 25 °C, and 150 °C.
Quiescent current between conversions
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7.6 SPI Interface Timing
Over free-air temperature range and VDD = 1.62 V to 5.5 V (unless otherwise noted)
SPI BUS
MIN
UNIT
MAX
fCLK
SCLK frequency
tCLK
SCLK Period
100
10
MHz
ns
tLEAD
Falling edge of CS to rising edge of SCLK setup time
100
ns
tLAG
Rising edge of SCLK to rising edge of CS setup time
20
ns
tSU
SIO to SCLK rising edge setup time
10
ns
tHOLD
SIO hold time after rising edge of SCLK
20
tVALID
Time from falling edge of SLCK to valid SIO data
tSIO(DIS)
Time from rising edge of CS to SIO high-impedance
tSIO(EN)
Time from falling edge of CS to SIO low impedance
tRISE
SIO, SCLK, CS rise time
tFALL
SIO, SCLK, CS fall time
100
ns
tINTERFRAME
Delay between two SPI communication sequences (CS high)
100
ns
tINITIATION
Delay between valid VDD volage and initial SPI communication
0.5
ms
ns
35
ns
200
ns
70
ns
100
ns
7.7 Timing Diagrams
VDD
1.62 V
ttINTERFRAMEt
tINITIATION
CS
50 %
50 %
ttLEADt
SCLK
ttCLKt
tSIO(EN)
SIO
50 %
50 %
50 %
50 %
30 %
tHOLD
tSU
ttLAGt
70 %
50 %
tVALID
tSIO(DIS)
70 %
70 %
70 %
30 %
30 %
30 %
Figure 7-1. SPI Interface Timing Diagram
Current (A)
7.8 Typical Characteristics
Figure 7-2. Temperature Accuracy
120
115
110
105
100
95
90
85
80
75
70
65
60
55
-75
1.62 V
3.3 V
5.5 V
-50
-25
0
25
50
75 100
Temperature (C)
125
150
175
Figure 7-3. Active Conversion Current vs.
Temperature
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11
1.62 V
3.3 V
5.5 V
10
9
Current (A)
8
7
6
5
4
3
2
1
0
-75
-50
-25
0
25
50
75 100
Temperature (C)
125
150
175
80
80
70
70
60
50
40
60
50
40
30
30
20
20
0
2.5
5
7.5
Time (s)
10
12.5
15
Figure 7-6. Stirred Liquid Single Layer Response
Time (DBV)
8
Figure 7-5. Shutdown Current vs. Temperature
Temperature (C)
Temperature (C)
Figure 7-4. Standby Current vs. Temperature
0
2.5
5
7.5
10
12.5 15
Time (s)
17.5
20
22.5
25
Figure 7-7. Stirred Liquid 2-Layer Response Time
(DBV)
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8 Detailed Description
8.1 Overview
The TMP127-Q1 is a factory-calibrated digital output temperature sensor designed for thermal management
and thermal protection applications. The TMP127-Q1 has a 3-wire SPI-compatible interface with continuous
conversion and shutdown modes. The shutdown mode can be used to optimize current consumption for low
power applications.
8.2 Functional Block Diagram
VDD
CS
SCLK
Oscillator
I/O
Buffer
Register
Bank
Digital Core
Internal
thermal
BJT
SIO
ADC
Temperature
sensor
circuitry
GND
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8.3 Feature Description
8.3.1 Low Power Consumption
The TMP127-Q1 features a power optimized conversion period with minimized conversion time to reduce
system power consumption. By minimizing the conversion time, the TMP127-Q1 operates mainly in the lowpower, standby portion of the conversion period. This feature is designed for low-power or battery applications
that operate in continuous conversion mode. The device also features a further power reduced shutdown mode
for greater power savings.
8.4 Device Functional Modes
The TMP127-Q1 has two operation modes: continuous conversion mode and shutdown mode.
8.4.1 Continuous Conversion Mode
The TMP127-Q1 always powers up in the continuous conversion mode. Immediately after power up, the
TMP127-Q1 temperature register will contain an erroneous code until the first temperature conversion has
completed. In the continuous conversion mode, the TMP127-Q1 will run a temperature conversion every
200 ms. To enter continuous conversion mode from the shutdown mode, the user must write XX00h to the
configuration register. If user writes XX00h to the configuration register, the continous conversion mode will
repeatedly run and the device will continue the conversion period uninterrupted. Repeatedly reading and writing
to the TMP127-Q1 will not cause adverse behavior. The temperature register output will update to the latest
conversion results when CS is pulled low to start a temperature read.
Start of conversion
tStandby timet
Active conversion time
Temperature Conversion
Conversion Period
Conversion Period
Figure 8-1. Conversion Period Timing Diagram
8.4.2 Shutdown Mode
If the user writes XXFFh to the configuration register, the device will enter shutdown mode. In shutdown mode,
the serial bus is still active and the TMP127-Q1 will always output the device ID, 900Fh. If the TMP127-Q1 is
performing a temperature conversion, the device will stop the temperature conversion and discard the data to
enter shutdown mode immediately.
10
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8.5 Programming
8.5.1 Temperature Data Format
Temperature data is represented by a 14-bit, two's complement word with an LSB (Least Significant Bit) equal to
0.03125 °C. The last two bits of the register are always 11b.
Table 8-1. 14-Bit Temperature Data Format
Temperature
Digital Output
Binary
Hex
175 °C
0101 0111 1000 0011
5783
150 °C
0100 1011 0000 0011
4B03
125 °C
0011 1110 1000 0011
3E83
25 °C
0000 1100 1000 0011
0C83
0.03125 °C
0000 0000 0000 0111
0007
0°C
0000 0000 0000 0011
0003
−0.03125 °C
1111 1111 1111 1111
FFFF
−25 °C
1111 0011 1000 0011
F383
−40 °C
1110 1100 0000 0011
EC03
−55 °C
1110 0001 0000 0011
E483
The first data byte is the Most Significant Byte (MSB) with most significant bit first, permitting only as much
data as necessary that must be read to determine temperature condition. For example, if the first four bits of
the temperature data indicate an overtemperature condition, the host controller could immediately take action to
remedy the excessive temperatures.
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8.5.2 Serial Bus Interface
The TMP127-Q1 operates as a peripheral and is compatible with SPI or MICROWIRE bus specifications. Data is
clocked out on the falling edge of the serial clock (SCLK), while data is clocked in on the rising edge of SCLK.
A complete transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the
transmit phase of communication from the Device ID or Temperature Register, while the second 16 clocks are
the receive phase to the Configuration Register. There is no issue using 8-bit SPI with the 16-bit interface as
long as the CS remains low during the transaction. Mode transitions through writes to the configuration register
will occur on the 16th rising clock edge during the 16-bit write.
Two modes of SPI communication are supported:
• Mode 0:
– CPOL = 0
– CPHA = 0
• Mode 3:
– CPOL = 1
– CPHA = 1
When CS is high, SIO will be in low-impedance tri-state. The user should take the chip select (CS) low to initiate
communication. This should not be done when SCLK is changing from a low to high state. When CS is low, the
serial I/O pin (SIO) will transmit the first bit of data. The controller can then read this bit with the rising edge of
SCLK. The remainder of the data will be clocked out by the falling edge of SCLK. CS can be taken high at any
time during the transmit phase. If CS is brought low in the middle of a conversion, the TMP127-Q1 will complete
the conversion and the output shift register will be updated after CS is brought back high.
The receive phase of a communication starts after 16 SCLK periods. CS can remain low as long as required.
After 32 SCLK rising edges, the TMP127-Q1 will take control of the SIO pin and be ready for another read write
cycle. The TMP127-Q1 will read the data available on the SIO line on the rising edge of the serial clock. The
last 8 bits of the configuration register are the Mode[7:0] bits and place the device into shutdown or continuous
conversion mode. The receive phase can last up to 16 SCLK periods. Only the following operation codes will
affect the TMP127-Q1 and any other codes placed into the Mode[7:0] field will be ignored
•
•
00 hex for continuous conversion
FF hex for shutdown
Figure 8-2 shows an overview of the communication protocol.
Controller controls SIO line
Peripheral controls SIO line
CS
16-bit
Temperature/Device ID register
16-bit
Conguraon register
Controller Read
Controller Write
SIO
SCLK
Figure 8-2. TMP127-Q1 Communication overview
After start-up or upon entering continuous mode, 200 ms must pass for a conversion to complete before the
TMP127-Q1 transmits accurate temperature data.
12
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The following communication can be used to determine the Manufacturer's/Device ID and then immediately
place the part into continuous conversion mode. With CS continuously low:
•
•
•
•
•
Read 16 bits of temperature data
Write 16 bits of data commanding Shutdown Mode(00FFh)
Read 16 bits of Manufacture's/Device ID data
Write 16 bits of data commanding Continuous Conversion Mode (0000h)
Take CS HIGH.
8.5.2.1 Communication in Shutdown Mode
Shutdown mode is enabled by writing XXFFh to the Mode byte in the configuration register. While in shutdown
mode, the TMP127-Q1 will output the device ID information on the SIO pin for the first 16 clock cycles. After the
16th rising SCLK edge, the TMP127-Q1 will tri-state the SIO pin and be ready for the controller to write to the
configuration register.
Figure 8-3 shows a diagram of the communication in shutdown mode.
Controller controls SIO line
Peripheral controls SIO line
Device ID
1
0
0
1
0
0
0
0
0
Mode Select [7:0]
0
0
0
1
1
1
1
X
X
X
X
X
X
X
X
M7 M6 M5 M4 M3 M2 M1 M0
Don’t Care
Figure 8-3. Shutdown Mode SPI Communication
8.5.2.2 Communication in Continuous Conversion Mode
Continuous Conversion mode is enabled by writing XX00h to the Mode byte in the configuration register. While
in continuous conversion mode, the TMP127-Q1 will output the latest Temperature information on the SIO pin for
the first 16 clock cycles. After the 16th falling SCLK edge, the TMP127-Q1 will tri-state the SIO pin and be ready
for the Controller to drive the SIO pin to write to the configuration register.
Figure 8-3 shows a diagram of the communication in continuous conversion mode.
Controller controls SIO line
Peripheral controls SIO line
Temperature data T[13:0]
T13 T12 T11 T10 T9
T8
T7
T6
T5
T4
Mode Select [7:0]
T3
T2
T1
T0
1
1
Always 11b
X
X
X
X
X
X
X
X
M7 M6 M5 M4 M3 M2 M1 M0
Don’t Care
Figure 8-4. Continuous Conversion Mode SPI Communication
8.5.2.3 Internal Register Structure
The TMP127-Q1 has three registers that can be accessed depending on the operating mode of the device. The
temperature register is accessible in the continuous conversion mode and is read-only. The device ID register is
accessible in the shutdown mode and is read-only. The configuration register is accessible in either shutdown or
continuous mode and is write-only.
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The TMP127-Q1 operate in 2 different configurations to fit the system requirements: a standard read/write
configuration or a read-only configuration.
9.2 Typical Applications
9.2.1 Read-Only Configuration
The TMP127-Q1 can operate in a read-only configuration when the host only needs to read the temperature
data without changing the mode of device operation. In this configuration, the host does not need to connect the
PICO pin to the SIO pin of the TMP127-Q1. Only the POCI pin is connected to SIO for read only operations.
1.62 V to 5.5 V
VDD
MCU
GPIO
CS
POCI
SIO TMP127-Q1
0.1 µF
SCLK
CLK
GND
Peripheral controls SIO line
CS
16-bit
Temperature register
SIO
Controller Read
SCLK
Figure 9-1. Read-Only Configuration
9.2.1.1 Design Requirements
For this design example, use the parameters listed below.
PARAMETER
Value
Supply (VDD)
1.62 V to 5.5 V
9.2.1.2 Detailed Design Procedure
The TMP127-Q1 will convert temperature at a 200-ms interval with a maximum conversion period of 270 ms per
the Electrical Characteristics table. Reading from the TMP127-Q1 faster than the conversion period can result in
data being retrieved twice before new data is available. Therefore TI recommends to read from the TMP127-Q1
in intervals greater than the maximum conversion period (like every 300 ms, for example). Reading faster than
the conversion period will not disrupt device operation and can safely be done if desired.
14
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In the read-only configuration, the TMP127-Q1 is not connected to a controller PICO pin. Due to this if the SCLK
pin were to continue to be clocked for the write portion of the transaction, the SIO pin would be floating and
the write value undetermined. It is for this reason that TI recommends to only perform the first 16 clock cycles
to read the TMP127-Q1 temperature date and pull CS high after, as shown in Figure 9-1. This will ensure the
TMP127-Q1 is never written to with a floating input.
9.2.2 Read/Write Configuration
The TMP127-Q1 can operate in a read/write configuration when the controller must both read and write to the
TMP127-Q1.
1.62 V to 5.5 V
0.1 µF
VDD
GPIO
CS
PICO
10 k
MCU
POCI
SIO TMP127-Q1
SCLK
GND
CLK
Controller controls SIO line
Peripheral controls SIO line
CS
16-bit
Temperature/Device ID register
16-bit
Con guraon register
Controller Read
Controller Write
SIO
SCLK
Figure 9-2. 4-Wire Configuration
9.2.2.1 Design Requirements
For this design example, use the parameters listed below.
PARAMETER
Value
Supply (VDD)
1.62 V to 5.5 V
Isolation Resistor
10 kΩ
9.2.2.2 Detailed Design Procedure
In this configuration, an isolation resistor is used between the PICO pin of the controller and the SIO pin of the
TMP127-Q1 to prevent bus contention. Being able to write to the TMP127-Q1 will allow the system to use the
shutdown mode and read the device ID.
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TMP127-Q1
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10 Power Supply Recommendations
The TMP127-Q1 operates from a single supply VDD. This pin operates with a wide range of 1.62 V to 5.5 V and
maintains accuracy across the entire supply range. A decoupling capacitor of 0.1 µF is recommended for the
VDD pin. Place the capacitor as close to the pin as possible.
11 Layout
11.1 Layout Guidelines
Place the power-supply decoupling capacitor as close to the supply and ground pins as possible. The
recommended value of this decoupling capacitor is 0.1 µF. Separation between the SCLK trace and the SI/O
traces is recommended to reduce coupling of the clock onto the data line.
11.2 Layout Example
Via to Power Plane
Via to Ground Plane
Top/Bottom Layer Trace
CS
Controller CS
VDD
1
6
2
5
GND
NC
DBV
SIO
Controller Data In
SCLK
3
4
SPI Clock
Figure 11-1. Read-Only Configuration Layout Example
Via to Power Plane
Via to Ground Plane
Top/Bottom Layer Trace
CS
Controller CS
VDD
1
6
GND
NC
2
Controller Data In
DBV
5
SIO
Controller Data Out 10 kΩ
SCLK
3
4
SPI Clock
Figure 11-2. Read/Write Configuration Layout Example
16
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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5-May-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TMP127EDBVRQ1
ACTIVE
SOT-23
DBV
6
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 175
2NGA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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