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TMP1827EVM

TMP1827EVM

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

  • 描述:

    - 温度 评估板 - 传感器

  • 数据手册
  • 价格&库存
TMP1827EVM 数据手册
www.ti.com Table of Contents User’s Guide TMP1827EVM ABSTRACT This user's guide describes the characteristics, operation, and use of the TMP1827EVM evaluation board. This user's guide discusses how to set up and configure the software, lists the hardware, and reviews various aspects of the software operation. Throughout this document, the terms evaluation board, evaluation module, and EVM are synonymous with the TMP1827EVM. This user's guide also provides information on the operating procedure, input and output connections, an electrical schematic, printed circuit board (PCB) layout drawings, and a parts list for the EVM. Table of Contents 1 Introduction.............................................................................................................................................................................2 1.1 EVM Kit Contents...............................................................................................................................................................2 2 EVM Hardware.........................................................................................................................................................................3 2.1 Perforations........................................................................................................................................................................3 2.2 Subregulator.......................................................................................................................................................................3 2.3 Logic Level Translator........................................................................................................................................................ 3 2.4 Programming Header.........................................................................................................................................................3 2.5 BSL Button......................................................................................................................................................................... 3 2.6 Status LED......................................................................................................................................................................... 3 3 Software Download.................................................................................................................................................................4 3.1 Live Software on dev.ti.com............................................................................................................................................... 4 3.2 Download from dev.ti.com.................................................................................................................................................. 4 4 Software...................................................................................................................................................................................5 4.1 Home Tab...........................................................................................................................................................................5 4.2 Data Capture Tab............................................................................................................................................................... 5 4.3 Registers Tab..................................................................................................................................................................... 6 4.4 EEPROM Tab.....................................................................................................................................................................7 5 Schematic, Board Layout and Bill of Materials....................................................................................................................9 5.1 Schematic.......................................................................................................................................................................... 9 5.2 Printed Circuit Board (PCB)............................................................................................................................................. 10 5.3 Bill of Materials................................................................................................................................................................. 11 Trademarks All trademarks are the property of their respective owners. SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 1 Introduction www.ti.com 1 Introduction The TMP1827EVM allows users to evaluate the performance of the TMP1827 digital temperature sensor. The EVM comes in a USB stick form factor, with an onboard MSP430F5528 microcontroller that interfaces with both the host computer and the TMP1827 device using a Single Wire interface. The module is designed with perforations between the sensor and host controller on the EVM board. The perforation allows the user flexibility in their evaluation: • • • • The user can connect the TMP1827 to the user's system/host. The user can connect the EVM host and software to the user's system with TMP1827 devices. Small individual boards allow the user to place sensors in the user's system. Hole spacing is compatible with common 0.1" prototyping breadboards 1.1 EVM Kit Contents Table 1-1 lists the contents of the EVM kit. Contact the Texas Instruments Product Information Center nearest you if any components are missing. TI highly recommends that users check the TI website at https://www.ti.com to verify that they have the latest versions of the related software. Table 1-1. Kit Contents 2 Item Quantity TMP1827EVM 1 TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com EVM Hardware 2 EVM Hardware 2.1 Perforations The perforation between the USB controller board and TMP1827 sensor board is designed to allow separation of the sensor and controller. The holes support standard 0.1" pitch headers. The pins are labeled with their functions on both sides. The small sensor board can be placed in-system, or the controller can be used to test a sensor which is part of another system. 2.2 Subregulator The switch S1 enables and disables the onboard 3.3-V regulator: U8. When the subregulator is enabled, the green LED D3 illuminates. The subregulator must be enabled for normal operation of TMP1827EVM. It is possible to supply other voltages at the 3P3V pin when the subregulator is disabled. 2.3 Logic Level Translator The translators U3 and U6 separates the MSP430 UART host from the TMP1827 device. This is not required for end applications, but the translator is provided on the EVM as a courtesy. When the subregulator is disabled, a voltage between 1.7 V and 5.5 V can be applied at the 3P3V net, which is the 3.3-V pin on the perforation. This external voltage will illuminate the green LED D3 and power the TMP1827 device. 2.4 Programming Header The TMP1827EVM comes pre-loaded with firmware that is necessary for the correct operation of the USB interface and PC GUI software. The unpopulated header, J2, is provided for Spy-Bi-Wire access to the MSP430F5528. TI does not recommend that users access this header or reprogram the device. 2.5 BSL Button The TMP1827EVM features push-button SW1 for entering USB BSL mode. This can be used for firmware updates. The button must be held down while the user plugs in the USB and can be released afterwards. 2.6 Status LED The red LED (D4) indicates status in the USB2ANY firmware. A blinking LED indicates the MSP430F5528 is waiting for USB connection from the GUI application. At initial power on, or when connected to the GUI, the LED turns off. SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 3 Software Download www.ti.com 3 Software Download The PC GUI Software for TMP1827EVM runs on TI's GUI Composer framework. The software is available as a live version which runs in your browser, and it is available as a download for offline use. The software is compatible with Windows, Mac, and Linux operating systems. 3.1 Live Software on dev.ti.com The live software currently works on Chrome, Firefox, and Safari browsers. Internet Explorer is not supported. Users can access the live version through one of the following actions: • Follow this link. • Go to the EVM tool page and click the View button. • Go to dev.ti.com/gallery, login with your myTI account credentials, and search for TMP1827. Click the application icon within the gallery to launch the software. You must agree to the prompts to install or update the TI Cloud Agent Bridge browser plugin. The plugin is necessary for connection to the USB hardware. 3.2 Download from dev.ti.com Users can access the latest version of the offline software by navigating to the live version as noted above. Look for the download icon Figure 3-1. and download both the application and runtime for the operating system as shown in Figure 3-1. Download Pop-Up 4 TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Software 4 Software 4.1 Home Tab The Home tab is shown at software launch. The icons on the bottom of this tab are shortcuts to the other functional tabs of the GUI, and correspond to the icons on the left-hand-side of the GUI. Figure 4-1. Home 4.2 Data Capture Tab The Data Capture tab reports the temperature from the TMP1827 device included on the TMP1827EVM. • • Temperature data will be polled and displayed by default. To disable polling or change the polling rate, use the Polling Rate drop-down menu under the Chart Controls tile on the right. The CONVERT TEMP command (0x44) is sent automatically while polling. The polling rate setting on the Data Capture tab is synchronized with the polling rate setting on the Registers tab. Temperature data can be saved to file as it is received using the Save Start and Save Stop buttons. Note that when the online version of the GUI is used, a download will begin in your browser. This download will be lost if the GUI is closed. When the offline version of the GUI is used, the file will be appended as data is received. In this case, appended data will not be lost if the GUI is closed. SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 5 Software • www.ti.com The Offset and Alert settings are synchronized to the Registers tab. A temperature in Celsius may be entered and view the corresponding hex value or vice versa. Figure 4-2. Data Capture 4.3 Registers Tab The Registers tab interacts with the ScratchPad-1 registers within the TMP1827 device. The Auto Read drop-down menu configures polling of register contents. When Auto Read is off, it is necessary to click Read Register to fetch the contents of the current register. The Read All Registers button can be used to fetch the contents of all registers at once. The Write Register button is greyed and disabled when the drop-down menu next to the button is set to Immediate. Immediate mode triggers a write operation each time a register is modified. When Deferred mode is selected, the Write Register button is enabled, and write operations will not be performed unless the Write Register button is clicked. These settings give the user total control over bus activity, 6 TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Software and enable individual transactions to be easily observed with an oscilloscope, logic analyzer, or bus-sniffing device. Figure 4-3. Registers 4.4 EEPROM Tab The EEPROM tab interacts with the user EEPROM through the ScratchPad-2 register within the TMP1827 device. • • • Read Blocks: To query the contents of EEPROM, enter an address range and click Read EEPROM. The data is displayed at the right in the preview area as it is retrieved. Note that ScratchPad-2 is a buffer for data being committed to EEPROM, so only the last write to ScratchPad-2 can be read back. Other addresses will respond with 0xFF when the Read ScratchPad-2 command is used. Write Blocks: A single block of 8 bytes can be written to ScratchPad-2, or written and immediately committed to EEPROM. File Operations: – Read File loads a CSV file into the preview area at the right. TI recommends to verify read back of edited files before clicking the Write EEPROM From File button. – Save File saves the current preview, shown at the right, to a CSV file. TI recommends to save a preview and edit the resulting file. SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 7 Software www.ti.com – Write EEPROM From File loads a CSV file into preview as it performs the necessary Write ScratchPad-2 and EEPROM Copy (Commit) commands. Figure 4-4. EEPROM 8 TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic, Board Layout and Bill of Materials 5 Schematic, Board Layout and Bill of Materials 5 5.1 Schematic J1 R1 R2 22 GND 5 C5 0.1uF 10V D1+ D1- D2+ D2- VCC GND 3 4 C4 10pF 16V D+ 4 GND 1 R3 100k C2 10uF GND IN 3P3V OUT 5 NC 4 EN C1 2.2uF R4 1.0k D1 BZT52C6V2T-7 6.2V GND GND GND PUR D3 GND S1 GND GND 3 2 R5 R6 1.00M 1.50k TLV70033DCKR U8 VBUS 3 2 C3 10pF 16V U2 1 6 D- 6 D2 BZT52C6V2T-7 6.2V VBUS 2 22 DP 1 2 1 220 ohm DM 1 L1 VBUS GND R7 47 2 Green GND GND TPD4S009DRYR GND BSL GND GND GND 1 R8 2 VCC 110 MP1SW1 MP2 MP3 MP4 3P3V VCC U3 MCU_RX VCORE 1 VUSB J2 C9 0.47uF 6.3V SBWTCK SBWTDIO C10 0.47uF 6.3V C7 10uF 1 2 DNP 3 Header_3x1 GND GND IN OUT 5 NC 4 GND 3 A 5 DIR EN C6 2.2uF VCCB 6 B 4 GND 2 SN74LVC1T45DCKR GND 2 C8 0.47uF 6.3V 3 VCCA VCC U4 VBUS V18 1 GND TLV70033DCKR GND GND GND 3P3V GND 3P3V VCC R9 390 U6 U5 18 19 20 21 22 23 24 25 P1.0/TA0CLK/ACLK P1.1/TA0.0 P1.2/TA0.1 P1.3/TA0.2 P1.4/TA0.3 P1.5/TA0.4 P1.6/TA1CLK/CBOUT P1.7/TA1.0 34 35 36 37 38 P3.0/UCB0SIMO/UCB0SDA P3.1/UCB0SOMI/UCB0SCL P3.2/UCB0CLK/UCA0STE P3.3/UCA0TXD/UCA0SIMO P3.4/UCA0RXD/UCA0SOMI 9 10 2 4 XT2IN 57 XT2OUT 58 1 3 NC NC 12 13 Y1 DP DM VCC C15 0.1uF 10V GND PU.0/DP PU.1/DM PUR 51 PUR V18 VCORE 55 17 V18 VCORE VBUS VUSB 53 54 VBUS VUSB 11 15 40 AVCC1 DVCC1 DVCC2 C16 0.1uF 10V GND 50 52 P5.0/A8/VREF+/VEREF+ P5.1/A9/VREF-/VEREFP5.2/XT2IN P5.3/XT2OUT P5.4/XIN P5.5/XOUT C17 0.1uF 10V GND P2.0/TA1.1 P2.1/TA1.2 P2.2/TA2CLK/SMCLK P2.3/TA2.0 P2.4/TA2.1 P2.5/TA2.2 P2.6/RTCCLK/DMAE0 P2.7/UCB0STE/UCA0CLK 26 27 28 29 30 31 32 33 P4.0/PM_UCB1STE/PM_UCA1CLK P4.1/PM_UCB1SIMO/PM_UCB1SDA P4.2/PM_UCB1SOMI/PM_UCB1SCL P4.3/PM_UCB1CLK/PM_UCA1STE P4.4/PM_UCA1TXD/PM_UCA1SIMO P4.5/PM_UCA1RXD/PM_UCA1SOMI P4.6/PM_NONE P4.7/PM_NONE 41 42 43 44 45 46 47 48 P6.0/CB0/A0 P6.1/CB1/A1 P6.2/CB2/A2 P6.3/CB3/A3 P6.4/CB4/A4 P6.5/CB5/A5 P6.6/CB6/A6 P6.7/CB7/A7 MCU_TX 60 61 62 63 RST/NMI/SBWTDIO TEST/SBWTCK 64 59 QFN PAD VSSU AVSS1 AVSS2 DVSS1 DVSS2 65 49 14 56 16 39 VCCA 3 A 5 DIR VCC VCCB 6 B 4 GND 2 340ohm min U7A 2 SDQ 4 SN74LVC1G07DCKT SN74LVC1T45DCKR C18 0.1uF 10V C19 0.1uF 10V D4 GND GND GND Super Red MCU_TX MCU_RX connect vdd to gnd for parasitic mode R13 1.0k 3P3V U7B 1 2 3 4 5 6 7 8 PJ.0/TDO PJ.1/TDI/TCLK PJ.2/TMS PJ.3/TCK 1 1 3P3V NC 5 VCC GND VCC U1 3 1 SN74LVC1G07DCKT SDQ C20 0.1uF 10V GND R14 33.0k 3 GND C13 0.1uF 10V GND SBWTDIO SBWTCK 2 VDD SDQ IO0 IO1 IO2 IO3 ADDR Thermal_Pad GND R10 DNP 0 6 7 8 5 9 4 TMP1827NGR GND GND GND GND C14 2200pF 50V GND MSP430F5528IRGCR VBUS = 5V INPUT VUSB = 3.3V OUT VUSB 12mA Max GND Figure 5-1. Schematic SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 9 Schematic, Board Layout and Bill of Materials www.ti.com 5.2 Printed Circuit Board (PCB) Figure 5-2. PCB Top Figure 5-3. PCB Bottom 10 TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic, Board Layout and Bill of Materials 5.3 Bill of Materials Table 5-1. Bill of Materials Description Designator PartNumber Quantity Manufacturer Printed Circuit Board !PCB1 SENS091 1 Any PackageReference Value CAP, CERM, 2.2 uF, 16 V, C1, C6 +/- 10%, X5R, 0402 GRM155R61C225KE11D 2 MuRata 0402 2.2uF CAP, CERM, 2200 pF, 50 C14 V, +/- 5%, X7R, 0402 CL05B222JB5NNNC 1 Samsung ElectroMechanics 0402 2200pF CAP, CERM, 10 uF, 10 V, C2, C7 +/- 20%, X5R, 0603 C1608X5R1A106M080A C 2 TDK 0603 10uF CAP, CERM, 10 pF, 16 V,+/- 10%, C0G, 0402 C3, C4 C0402C100K4GACTU 2 Kemet 0402 10pF CAP, CERM, 0.1 uF, 10 V,+/- 10%, X5R, 0402 C5, C13, C15, C16, C17, C18, C19, C20 LMK105BJ104KV-F 8 Taiyo Yuden 0402 0.1uF CAP, CERM, 0.47 uF, 6.3 C8, C9, C10 V, +/- 10%, X7R, 0402 JMK105B7474KVHF 3 Taiyo Yuden 0402 0.47uF Diode, Zener, 6.2 V, 300 mW, SOD-523 D1, D2 BZT52C6V2T-7 2 Diodes Inc. SOD-523 6.2V LED, Green, SMD D3 SML-LX0603GW-TR 1 Lumex LED, GREEN, 0603 Green LED, Super Red, SMD D4 150060SS75000 1 Wurth Elektronik LED_0603 Super Red Connector, Plug, USB Type A, R/A, Top Mount SMT J1 48037-1000 1 Molex USB Type A right angle Header, 2.54 mm, 3x1, Gold, TH J2 GBC03SAAN 0 Sullins Connector Solutions Header, 2.54 mm, 3x1, TH Ferrite Bead, 220 ohm @ L1 100 MHz, 0.45 A, 0402 BLM15AG221SN1D 1 MuRata 0402 220 ohm RES, 22, 5%, 0.1 W, R1, R2 AEC-Q200 Grade 0, 0402 ERJ-2GEJ220X 2 Panasonic 0402 22 RES, 0, 5%, 0.063 W, R10 AEC-Q200 Grade 0, 0402 CRCW04020000Z0ED 0 Vishay-Dale 0402 0 RES, 33.0 k, 1%, 0.063 W, 0402 RC0402FR-0733KL 1 Yageo America 0402 33.0k R14 SBOU294 – SEPTEMBER 2022 Submit Document Feedback TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 11 Schematic, Board Layout and Bill of Materials www.ti.com Table 5-1. Bill of Materials (continued) Description PartNumber Quantity Manufacturer PackageReference Value RES, 100 k, 5%, 0.1 W, R3 AEC-Q200 Grade 0, 0402 ERJ-2GEJ104X 1 Panasonic 0402 100k RES, 1.0 k, 5%, 0.1 W, R4, R13 AEC-Q200 Grade 0, 0402 ERJ-2GEJ102X 2 Panasonic 0402 1.0k RES, 1.00 M, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 R5 RMCF0402FT1M00 1 Stackpole Electronics Inc 0402 1.00Meg RES, 1.50 k, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 R6 RMCF0402FT1K50 1 Stackpole Electronics Inc 0402 1.50k RES, 47, 5%, 0.1 W, R7 AEC-Q200 Grade 0, 0402 ERJ-2GEJ470X 1 Panasonic 0402 47 RES, 110, 1%, 0.1 W, R8 AEC-Q200 Grade 0, 0402 ERJ-2RKF1100X 1 Panasonic 0402 110 RES, 390, 5%, 0.063 W, R9 AEC-Q200 Grade 0, 0402 CRCW0402390RJNED 1 Vishay-Dale 0402 390 Switch, Slide, SPST, Top Slide, SMT S1 CHS-01TB 1 Copal Electronics Switch, Single Top Slide, 2.5x8x2.5mm Switch, SPST-NO, OffMom, 0.05A, 12VDC, SMD SW1 PTS820 J20M SMTR LFS 1 C&K Components 3.9x2.9mm Single Wire, ±0.3 °C Accurate Digital Temperature Sensor With Integrated 2-Kbit EEPROM, VSSOP8 U1 TMP1827NGR 1 Texas Instruments VSSOP8 4-Channel ESD Solution for High-Speed Differential Interface, DRY0006A (USON-6) U2 TPD4S009DRYR 1 Texas Instruments DRY0006A 12 Designator TMP1827EVM SBOU294 – SEPTEMBER 2022 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated www.ti.com Schematic, Board Layout and Bill of Materials Table 5-1. Bill of Materials (continued) Description Designator PartNumber Quantity Manufacturer PackageReference Single-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation and 3-State Outputs, DCK0006A, LARGE T&R U3, U6 SN74LVC1T45DCKR 2 Texas Instruments DCK0006A Single Output LDO, 200 U4, U8 mA, Fixed 3.3 V Output, 2 to 5.5 V Input, with Low IQ, 5-pin SC70 (DCK), -40 to 125 degC, Green (RoHS & no Sb/Br) TLV70033DCKR 2 Texas Instruments DCK0005A 16-Bit Ultra-Low-Power Microcontroller, 128KB Flash, 8KB RAM, USB, 12Bit ADC, 2 USCIs, 32Bit HW MPY, RGC0064B (VQFN-64) U5 MSP430F5528IRGCR 1 Texas Instruments RGC0064B Single Buffer/Driver With Open-Drain Output, DCK0005A, SMALL T&R U7 SN74LVC1G07DCKT 1 Texas Instruments DCK0005A Crystal, 24 MHz, SMD Y1 XRCGB24M000F2P00R0 1 MuRata 2x1.6mm SBOU294 – SEPTEMBER 2022 Submit Document Feedback Value TMP1827EVM Copyright © 2022 Texas Instruments Incorporated 13 STANDARD TERMS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms. 1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms that accompany such Software 1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned, or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production system. 2 Limited Warranty and Related Remedies/Disclaimers: 2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License Agreement. 2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM. User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10) business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected. 2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day warranty period. WARNING Evaluation Kits are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User shall operate the Evaluation Kit within TI’s recommended guidelines and any applicable legal or environmental requirements as well as reasonable and customary safeguards. Failure to set up and/or operate the Evaluation Kit within TI’s recommended guidelines may result in personal injury or death or property damage. Proper set up entails following TI’s instructions for electrical ratings of interface circuits such as input, output and electrical loads. NOTE: EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG. www.ti.com 3 Regulatory Notices: 3.1 United States 3.1.1 Notice applicable to EVMs not FCC-Approved: FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter. 3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant: CAUTION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. FCC Interference Statement for Class A EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense. FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 3.2 Canada 3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247 Concerning EVMs Including Radio Transmitters: This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Concernant les EVMs avec appareils radio: Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Concerning EVMs Including Detachable Antennas: Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. 2 www.ti.com Concernant les EVMs avec antennes détachables Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur 3.3 Japan 3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に 輸入される評価用キット、ボードについては、次のところをご覧ください。 http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan. If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs (which for the avoidance of doubt are stated strictly for convenience and should be verified by User): 1. 2. 3. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of Japan, Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan. 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 実験局の免許を取得後ご使用いただく。 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. 3 www.ti.com 4 EVM Use Restrictions and Warnings: 4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS. 4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information related to, for example, temperatures and voltages. 4.3 Safety-Related Warnings and Restrictions: 4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or property damage. If there are questions concerning performance ratings and specifications, User should contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit components may have elevated case temperatures. These components include but are not limited to linear regulators, switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the information in the associated documentation. When working with the EVM, please be aware that the EVM may become very warm. 4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems, and subsystems. User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees, affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or designees. 4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal, state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local requirements. 5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as accurate, complete, reliable, current, or error-free. 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED. 7. 4 USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES, EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED. www.ti.com 8. Limitations on Damages and Liability: 8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS OCCURRED. 8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT. 9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s) will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s), excluding any postage or packaging costs. 10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas, without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas. Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated 5 IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, regulatory or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2022, Texas Instruments Incorporated
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