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TMP235A2DCKT

TMP235A2DCKT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SC70-5

  • 描述:

    温度传感器 模拟,本地 -40°C ~ 150°C 10mV/°C SC-70-5

  • 数据手册
  • 价格&库存
TMP235A2DCKT 数据手册
Order Now Product Folder Support & Community Tools & Software Technical Documents TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 TMP23x Low-Power, High-Accuracy Analog Output Temperature Sensors 1 Features 3 Description • • The TMP23x devices are a family of precision CMOS integrated-circuit linear analog temperature sensors with an output voltage proportional to temperature engineers can use in multiple analog temperaturesensing applications. These temperature sensors are more accurate than similar pin-compatible devices on the market, featuring typical accuracy from 0°C to +70°C of ±0.5°C. The increased accuracy of the series is designed for many analog temperaturesensing applications.The TMP235 device provides a positive slope output of 10 mV/°C over the full –40°C to +150°C temperature range and a supply range from 2.3 V to 5.5 V. The higher gain TMP236 sensor provides a positive slope output of 19.5 mV/°C from –10°C to +125°C and a supply range from 3.1 V to 5.5 V. 1 • • • • • • • Cost-effective alternative to thermistors Tight accuracy across a wide temperature range: – ±2.5°C (maximum): –40°C to +150°C (TMP235) – ±2.5°C (maximum): –10°C to +125°C (TMP236) Available in two accuracy level variants: – A2 level: ±0.5°C (typical) – A4 level: ±1°C (typical) Positive slope sensor gain, offset (typical): – 10 mV/°C, 500 mV at 0°C (TMP235) – 19.5 mV/°C, 400 mV at 0°C (TMP236) Wide operating supply voltage range: – 2.3 V to 5.5 V (TMP235) – 3.1 V to 5.5 V (TMP236) Short-circuit protected output Low power: 9 μA (typical) Strong output for driving loads up to 1000 pF Available package options: – 5-pin SC70 (DCK) surface mount – 3-pin SOT-23 (DBZ) surface mount – Footprint compatible with industry-standard LMT8x-Q1 and LM20 temperature sensors Device Information(1) PART NUMBER 2 Applications • • • • • The 9-µA typical quiescent current and 800-µs typical power-on time enable effective power-cycling architectures to minimize power consumption for battery-powered devices. A class-AB output driver provides a strong 500-µA maximum output to drive capacitive loads up to 1000 pF and is designed to directly interface to analog-to-digital converter sample and hold inputs. With excellent accuracy and a strong linear output driver, the TMP23x analog output temperature sensors are cost-effective alternatives to passive thermistors. Grid infrastructure Wireless and telecom infrastructure Automotive infotainment Factory automation and control Test and measurement TMP235, TMP236 PACKAGE BODY SIZE (NOM) SC70 (5) 2.00 mm × 1.25 mm SOT-23 (3) 2.92 mm × 1.30 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Functional Block Diagram Output Voltage vs Ambient 3 VDD 2.5 Thermal Diodes VOUT VOUT (V) 2 1.5 1 0.5 GND 0 -50 TMP235 TMP236 -25 0 25 50 TA (qC) 75 100 125 150 D003 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes........................................ 10 8 Application and Implementation ........................ 11 8.1 Application Information............................................ 11 8.2 Typical Application .................................................. 11 9 Power Supply Recommendations...................... 12 10 Layout................................................................... 12 10.1 Layout Guidelines ................................................. 12 10.2 Layout Examples................................................... 12 11 Device and Documentation Support ................. 13 11.1 11.2 11.3 11.4 11.5 11.6 Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 13 13 13 13 13 13 12 Mechanical, Packaging, and Orderable Information ........................................................... 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (August 2018) to Revision E Page • Changed recommended operating temperature range from: –50°C to 150°C to: –40°C to 150°C ....................................... 4 • Changed power supply bypassing recommendations on how to avoid noise effect on the device output .......................... 12 Changes from Revision C (August 2018) to Revision D • Page Changed DBZ (SOT-23) package status from preview to production data............................................................................ 1 Changes from Revision B (February 2018) to Revision C Page • Added DBZ (SOT-23) preview package ................................................................................................................................ 1 • Added TMP236 test conditions to the operating current parameters..................................................................................... 5 • Added SOT-23 and SC70 package test conditions to the Accuracy Level 2 (A2) limits in the 0℃ to 70℃ range ................ 5 Changes from Revision A (December 2017) to Revision B Page • Changed reference to typical accuracy specifications from: ±1°C and ±2°C to: ±0.5°C and ±1°C........................................ 1 • Deleted erroneous AOQL footnote ......................................................................................................................................... 5 • Changed specification limits indicated in Figure 1 ................................................................................................................. 6 • Added Device Functional Modes section ............................................................................................................................ 10 Changes from Original (September 2017) to Revision A • 2 Page Changed document status from Advance Information to Production Data ............................................................................ 1 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 5 Pin Configuration and Functions DBZ Package 3-Pin SOT-23 Top View VDD DCK Package 5-Pin SC70 Top View 1 GND 3 VOUT 2 NC 1 GND 2 VOUT 3 5 NC 4 VDD Not to scale Not to scale NC- no internal connection Pin Functions NAME PIN TYPE DESCRIPTION SOT-23 SC70 GND 3 2 Ground NC — 5 — No internal connection. This pin may be left floating or connected to GND. NC — 1 — No internal connection. This pin may be left floating or connected to GND. VOUT 2 3 O Outputs voltage proportional to temperature VDD 1 4 I Positive supply input Power supply ground. Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 3 TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX Supply voltage, VDD Output voltage, VOUT –0.3 Output current Latch-up current, each pin V (VDD + 0.3) –30 +30 –200 +200 Junction temperature (TJ) mA +150 Storage temperature (Tstg) (1) UNIT +6 –65 °C +150 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under Recommended OperatingConditions. Exposure to absolute-maximum-rated conditions for extended periods mayaffect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM) per JESD22-A114 (1) UNIT ±4000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) V ±1000 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN VDD TA NOM MAX Input voltage (TMP235) 2.3 5.5 Input voltage (TMP236) 3.1 5.5 Operating free-air temperature –40 150 UNIT V °C 6.4 Thermal Information TMP235 THERMAL METRIC (1) (2) DCK (SC70) DBZ (SOT-23) PINS PINS UNIT 167 °C/W RθJA Junction-to-ambient thermal resistance (3) (4) 275 RθJC(top) Junction-to-case (top) thermal resistance 84 90 °C/W RθJB Junction-to-board thermal resistance 56 146 °C/W ΨJT Junction-to-top characterization parameter 1.2 35 °C/W ΨJB Junction-to-board characterization parameter 55 146 °C/W (1) (2) (3) (4) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. For information on self-heating and thermal response time see Layout Guidelines section. The junction to ambient thermal resistance (RθJA ) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5. Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 6.5 Electrical Characteristics TMP235: VDD = 2.3 V to 5.5 V, GND = Ground, TA = –40°C to +125°C and no load (unless otherwise noted) TMP236: VDD = 3.1 V to 5.5 V, GND = Ground, TA = –10°C to +125°C and no load (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = –40℃ to +125℃, TMP235 14.5 µA TA = –10℃ to +125℃, TMP236 15 TA = 150℃, TMP235 17 POWER SUPPLY IDD Operating current Δ℃/ ΔVDD TA = 25℃, VDD = 2.3 V, TMP235 9 TA = 25℃, VDD = 3.1 V, TMP236 10 Line regulation –0.1 0.02 0.1 ℃/V SENSOR ACCURACY TA = 25°C TA = 0°C to 70°C (SC70 Package) TA = 0°C to +70°C (SOT-23 Package) TACY Temperature accuracy (1) ±0.5 –1 ±0.5 +1 –1.2 ±0.5 +1.2 TA = –40°C to +125°C (TMP235A2) –2 ±0.5 +2 TA = –10°C to +125°C (TMP236A2) –2 ±0.5 +2 TA = –40°C to +150°C (TMP235A2) –2 ±0.5 +2 TA = 25°C Accuracy Level 4 (A4) ℃ ±1 TA = 0°C to 70°C –2 ±1 +2 TA = –40°C to +125°C (TMP235A4) –4 ±1 +4 TA = –10°C to +125°C (TMP236A4) –4 ±1 +4 TA = –40°C to +150°C (TMP235A4) –5 ±1 +5 SENSOR OUTPUT V0℃ Output voltage offset at 0 °C TC Temperature coefficient (sensor gain) VONL Output nonlinearity (1) IOUT Output current ZOUT Output impedance TMP235 500 TMP236 400 TMP235 10 TMP236 19.5 TA = 0 °C to 70 °C, no load ±0.5 mV/℃ ℃ 500 IOUT = 100 μA, f = 100 Hz 20 IOUT = 100 μA, f = 500 Hz 50 Output load regulation TA = 0°C to 70°C, IOUT = 100 μA, ΔVOUT / ΔIOUT tON Turn on time Time to reach accuracy within ±0.5°C CLOAD Typical load capacitance tRES Thermal response to 63% (1) mV Ω Ω 1 800 μs 1000 SC70 30°C (Air) to +125°C (Fluid Bath) μA 1.3 pF s Accuracy is defined as the error between the measured and reference output voltages, tabulated in the TMP235 Transfer Tableand TMP236 Transfer Table at the specified conditions of supply voltage and temperature (expressed in °C). Accuracy limits include line regulation within the specified conditions. Accuracy limits do not include load regulation; they assume no DC load. Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 5 TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com 6.6 Typical Characteristics at TA = 25°C, (unless otherwise noted) 6 6 Average Avg r3V Limits 4 2 Accuracy (qC) Accuracy (qC) 4 Average Avg r3V Limits 0 -2 2 0 -2 -4 -4 -6 -50 -25 0 25 50 75 100 125 -6 -50 150 TA (qC) -25 0 25 50 75 100 125 TA (qC) D001 150 D002 TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF Figure 1. Accuracy vs. TA Temperature (A2 Accuracy Level) Figure 2. Accuracy vs. TA Temperature (A4 Accuracy Level) 0.1 3 ' Accuracy Due to Load (qC) 2.5 VOUT (V) 2 1.5 1 0.5 0.05 0 -0.05 TMP235 TMP236 0 -50 -25 0 25 50 75 100 125 VDD = 2.3 V VDD = 5.5 V -0.1 -50 150 TA (qC) -25 0 25 50 D003 IOUT = 0 µA, CLOAD = 1000 pF 100 125 150 D004 TMP235: IOUT = from 0 µA to 100 µA, CLOAD = 1000 pF Figure 3. Output Voltage vs. Ambient Temperature Figure 4. Changes in Accuracy vs. Ambient Temperature (Due to Load) 14 3.5 IOUT = 500 PA IOUT = 400 uA IOUT = 300 uA IOUT = 200 uA IOUT = 100 uA Load Regulation 'V/'I (:) 3 12 IDD (PA) 75 TA (qC) 10 8 2.5 2 1.5 1 0.5 VDD = 2.3 V 6 -50 -25 0 25 50 75 100 125 TA (qC) 0 -50 -25 D005 TMP235: IOUT = 0 µA, CLOAD = 1000 pF Figure 5. Supply Current vs. Temperature 6 150 0 25 50 TA (qC) 75 100 125 150 D006 TMP235: VDD = 2.3 V, CLOAD = 1000 pF Figure 6. Load Regulation vs. Ambient Temperature Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 Typical Characteristics (continued) at TA = 25°C, (unless otherwise noted) 0.1 1 Normalized Line Regulation ('qC/'VDD) TMP235 0.8 VOUT (V) 0.05 0 0.6 0.4 -0.05 0.2 -0.1 -50 0 -25 0 25 50 TA (qC) 75 100 125 150 0 0.5 1 1.5 2 D007 TMP235: VDD = 2.3 to 5.5 V, IOUT = 0 µA, CLOAD = 1000 pF 2.5 3 VDD (V) 3.5 4 4.5 5 5.5 D008 TMP235: TA = 25°C Figure 7. Line Regulation (Δ°C / ΔVDD) vs. Ambient Temperature Figure 8. Output Voltage vs. Power Supply 3 2 2.5 1.5 VOUT (V) VOUT (V) 2 1.5 1 0.5 1 0.5 0 -0.5 -0.25 0 0.25 0.5 0.75 Time (ms) 1 1.25 0 -0.25 1.5 0 0.25 D009 TMP235: TA = 25°C 0.5 0.75 1 Time (ms) 1.25 1.5 1.75 2 D010 TMP235: TA = 25°C, VDD Ramp Rate = 5 V/ms Figure 9. Output vs. Settling Time to Step VDD Figure 10. Output vs. Settling Time to Ramp VDD 150 1000 Output Impedance (: Temperature (qC) 125 100 75 50 100 10 25 SC70 Package 0 -2 1 0 2 4 6 8 Time (ms) 10 12 14 16 1 10 D011 TMP235: 1 × 1 (inches) PCB, Air 26°C to Fluid Bath 123°C Figure 11. Thermal Response (Air-to-Fluid Bath) 100 1000 Frequency (Hz) 10000 100000 D012 TMP235: TA = 25°C, VDD = 5 V, IOUT = 100 µA Figure 12. Output Impedance vs. Frequency Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 7 TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com 7 Detailed Description 7.1 Overview The TMP23x devices are a family of linear analog temperature sensors with an output voltage proportional to temperature. These temperature sensors have an accuracy from 0°C to 70°C of ±1.25°C (TMP23xA2) and ±2°C (TMP23xA4). The TMP235 device provides a positive slope output of 10 mV/°C over the full –40°C to +150°C temperature range and a supply range from 2.3 V to 5.5 V. The higher gain TMP236 sensor provides a positive slope output of 19.5 mV/°C from –10°C to +125°C and a supply range from 3.1 V to 5.5 V. A class-AB output driver provides a maximum output of 500 µA to drive capacitive loads up to 1000 pF. 7.2 Functional Block Diagram VDD Thermal Diodes VOUT GND 7.3 Feature Description As shown in Figure 3, the TMP23x devices are linear. A small VOUT gain shift, however, is present at temperatures above 100°C. When small shifts are expected, a piecewise linear function provides the best accuracy and is used for the device accuracy specifications (see Specifications). Typical output voltages of the TMP23x devices across the full operating temperature range are listed in Table 3 and Table 4. The ideal linear columns represent the ideal linear VOUT output response with respect to temperature, while the piecewise linear columns indicate the small voltage shift at elevated temperatures. The piecewise linear function uses three temperature ranges listed in Table 1 and Table 2. In equation form, the voltage output VOUT of the TMP23x is calculated by Equation 1: VOUT = (TA – TINFL) × TC + VOFFS where • • • • • VOUT is the TMP23x voltage output for a given temperature TA is the ambient temperature in °C TINFL is the temperature inflection point for a piecewise segment in °C TC is the TMP23x temperature coefficient or gain VOFFS is the TMP23x voltage offset (1) Therefore, the TA temperature for a given VOUT voltage output within a piecewise voltage range (VRANGE) is calculated in Equation 2. For applications where the accuracy enhancement above 100°C is not required, use the first row of Table 1 and Table 2 for all voltages. TA = (VOUT – VOFFS ) / TC + TINFL (2) Table 1. TMP235 Piecewise Linear Function Summary TA RANGE (°C) 8 VRANGE (mV) TINFL (°C) TC (mV/°C) VOFFS (mV) –40 to +100 < 1500 0 10 500 100 to 125 1500 to 1752.5 100 10.1 1500 125 to 150 > 1752.5 125 10.6 1752.5 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 Table 2. TMP236 Piecewise Linear Function Summary TA RANGE (°C) VRANGE (mV) TINFL (°C) TC (mV/°C) VOFFS (mV) –40 to +100 ≤ 2350 0 19.5 400 100 to 125 > 2350 100 19.7 2350 125 to 150 — — — — Table 3. TMP235 Transfer Table TEMPERATURE (°C) VOUT (mV) IDEAL LINEAR VALUES VOUT (mV) PIECEWISE LINEAR VALUES –40 100 100 –35 150 150 –30 200 200 –25 250 250 –20 300 300 –15 350 350 –10 400 400 –5 450 450 0 500 500 5 550 550 10 600 600 15 650 650 20 700 700 25 750 750 30 800 800 35 850 850 40 900 900 45 950 950 50 1000 1000 55 1050 1050 60 1100 1100 65 1150 1150 70 1200 1200 75 1250 1250 80 1300 1300 85 1350 1350 90 1400 1400 95 1450 1450 100 1500 1500 105 1550 1550.5 110 1600 1601 115 1650 1651.5 120 1700 1702 125 1750 1752.5 130 1800 1805.5 135 1850 1858.5 140 1900 1911.5 145 1950 1964.5 150 2000 2017.5 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 9 TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com Table 4. TMP236 Transfer Table TEMPERATURE (°C) VOUT (mV) IDEAL LINEAR VALUES VOUT (mV) PIECEWISE LINEAR VALUES –40 — — –35 — — –30 — — –25 — — –20 — — –15 — — –10 205 205 –5 303 303 0 400 400 5 498 498 10 595 595 15 693 693 20 790 790 25 888 888 30 985 985 35 1083 1083 40 1180 1180 45 1278 1278 50 1375 1375 55 1473 1473 60 1570 1570 65 1668 1668 70 1765 1765 75 1863 1863 80 1960 1960 85 2058 2058 90 2155 2155 2253 95 2253 100 2350 2350 105 2448 2448.5 110 2545 2547 115 2643 2645.4 120 2740 2743.9 125 2838 2842.4 130 — — 135 — — 140 — — 145 — — 150 — — 7.4 Device Functional Modes The singular functional mode of the TMP23x is an analog output directly proportional to temperature. 10 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The features of the TMP235 make the series of devices designed for various general temperature-sensing applications. The TMP235 and TMP236 devices can operate down to a 2.3-V and a 3.1-V supply with 9-µA power consumption, respectively. As a result, the series is designed for battery-powered applications. The TMP23x series is mounted in two surface mount technology packages (SC70 and SOT-23.) 8.2 Typical Application 8.2.1 Connection to an ADC Simplified Input Circuit of SAR Analog-to-Digital Converter Reset 2.3 V to 5.5 V TI Device VDD GND CBP Input Pin RFILTER RMUX RSS Sample OUT CFILTER CMUX CSAMPLE Figure 13. Suggested Connections to an ADC Input Stage 8.2.1.1 Design Requirements See Figure 13 for suggested connections to an ADC input stage. Most CMOS-based ADCs have a sampled data comparator input structure. When the ADC charges the sampling capacitor (CSAMPLE), the capacitor requires instantaneous charge from the output of the analog source temperature sensor, such as the TMP23x. Therefore, the output impedance of the temperature sensor can affect ADC performance. In most cases, adding an external capacitor (CFILTER) mitigates design challenges. The TMP23x is specified and characterized with a 1000-pF maximum capacitive load (CLOAD). Figure 13 shows CLOAD as the sum of CFILTER + CMUX + CSAMPLE. TI recommends maximizing the CFILTER value while allowing for the maximum specified ADC input capacitance (CMUX + CSAMPLE) to limit the total CLOAD at 1000 pF. In most cases, a 680-pF CFILTER provides a reasonable allowance for ADC input capacitance to minimize ADC sampling error and reduce noise coupling. An optional series resistor (RFILTER) and CFILTER provides additional low-pass filtering to reject system level noise. TI recommends placing RFILTER and CFILTER as close as possible to the ADC input for optimal performance. 8.2.1.2 Detailed Design Procedure Depending on the input characteristics of the ADC, an external CFILTER may be required. The value of CFILTER depends on the size of the sampling capacitor (CSAMPLE) and the sampling frequency while observing a maximum CLOAD of 1000 pF. The capacitor requirements can vary because the input stages of all ADCs are not identical. Figure 13 shows a general ADC application as an example only. Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 11 TMP235, TMP236 SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 www.ti.com Typical Application (continued) 8.2.1.3 Application Curve 3 2.5 VOUT (V) 2 1.5 1 0.5 TMP235 TMP236 0 -50 -25 0 25 50 75 100 125 TA (qC) 150 D003 Figure 14. Output Voltage vs. Ambient 9 Power Supply Recommendations The low supply current and supply range of the TMP23x allow the device to be easily powered from many sources. Power supply bypassing is strongly recommended. In noisy environments, TI recommends to add a filter with 0.1-μF capacitor and 100-Ω resistor between external supply and VDD to limit the power supply noise. Larger capacitances may be required and are dependent on the noise of the power supply. 10 Layout 10.1 Layout Guidelines The layout of the TMP23x series is simple. If a power supply bypass capacitor is used, the capacitor must be connected as Layout Examples shows. 10.2 Layout Examples VIA to ground plane VIA to power plane GND GND GND OUT 0.1 µF VDD Figure 15. Recommended Layout: SC70 Package 12 Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 TMP235, TMP236 www.ti.com SBOS857E – SEPTEMBER 2017 – REVISED MAY 2019 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now. Table 5. Related Links PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TMP235 Click here Click here Click here Click here Click here TMP236 Click here Click here Click here Click here Click here 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated Product Folder Links: TMP235 TMP236 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TMP235A2DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 150 2352 TMP235A2DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 150 2352 TMP235A2DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19L TMP235A2DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19L TMP235A4DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 150 2354 TMP235A4DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -40 to 150 2354 TMP235A4DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19M TMP235A4DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 150 19M TMP236A2DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -10 to 125 2362 TMP236A2DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -10 to 125 2362 TMP236A2DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BS TMP236A2DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BS TMP236A4DBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -10 to 125 2364 TMP236A4DBZT ACTIVE SOT-23 DBZ 3 250 RoHS & Green NIPDAUAG | SN Level-1-260C-UNLIM -10 to 125 2364 TMP236A4DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BT TMP236A4DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -10 to 125 1BT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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