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Order Now Product Folder Support & Community Tools & Software Technical Documents TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 TMP302-Q1 Automotive Grade, Easy-to-Use, Low-Power, Temperature Switch in MicroPackage 1 Features 3 Description • • The TMP302-Q1 family of devices is a temperature switch in a micropackage (SOT563). The TMP302-Q1 family of devices offers low power (15 μA maximum) and ease-of-use through pin-selectable trip points and hysteresis. 1 • • • • • • • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 1: –40ºC to 125ºC Ambient Operating Temperature Range – Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C6 Low Power: 15 μA (Maximum) SOT563 Package: 1.6 mm × 1.6 mm × 0.6 mm Trip-Point Accuracy: ±0.2°C (Typical) From 40°C to 125°C Pin-Selectable Trip Points Open-Drain Output, Active Low Selectable Hysteresis: 5°C or 10°C Low Supply Voltage Range: 1.4 to 3.6 V The TMP302-Q1 family of devices is available in several different versions with trip points from 50ºC to 125ºC in increments of 5ºC (see the Device Comparison Table). Device Information PART NUMBER TMP302-Q1 PACKAGE SOT563 (6) 1.60 mm × 1.20 mm 1. For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications • • • • • • • • These devices require no additional components for operation; they can function independent of microprocessors or microcontrollers. Infotainment Climate Control Engine Control Unit Automotive Black Box Central Body Control Module Airbag Control Unit Thermal Monitoring Electronic Protection Systems Trip Threshold Accuracy 40 35 Population 30 25 20 15 10 5 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 Accuracy (°C) 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 8 9 Application and Implementation .......................... 9 9.1 Application Information.............................................. 9 9.2 Typical Application ................................................... 9 10 Power Supply Recommendations ..................... 11 11 Layout................................................................... 11 11.1 Layout Guidelines ................................................. 11 11.2 Layout Example .................................................... 11 12 Device and Documentation Support ................. 12 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resource............................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 12 13 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History Changes from Revision B (July 2015) to Revision C Page • Changed the supply voltage maximum value from: 3.6 V to: 4 V .......................................................................................... 4 • Changed the input pin supply voltage maximum value from: VS + 0.5 V to: VS + 0.3 and ≤ 4 V........................................... 4 • Changed the output pin voltage maximum value from: 3.6 V to: 4 V..................................................................................... 4 • Added the specified temperature to the Recommended Operating Conditions table ........................................................... 4 • Updated junction-to-ambient thermal resistance from 200 to 210.3 ..................................................................................... 4 • Updated junction-to-case (top) thermal resistance from 73.7 to 105.0 ................................................................................. 4 • Updated junction-to-board thermal resistance from 34.4 to 87.5 .......................................................................................... 4 • Updated junction-to-top characterization parameter from 3.1 to 6.1 ..................................................................................... 4 • Updated junction-to-board characterization parameter from 34.2 to 87.0 ............................................................................. 4 • Changed the Design Requirements section ........................................................................................................................ 10 • Added the Receiving Notification of Documentation Updates section ................................................................................. 12 Changes from Revision A (November 2014) to Revision B • Changed the Handling Ratings table to ESD Ratings and moved storage temperature to the Absolute Maximum Ratings table .......................................................................................................................................................................... 4 Changes from Original (October 2014) to Revision A • 2 Page Page Changed device status From: Product Preview To: Production............................................................................................. 1 Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 TMP302-Q1 www.ti.com SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 5 Device Comparison Table (1) DEVICE SELECTABLE TRIP POINTS (°C) (1) TMP302A-Q1 50, 55, 60, 65 TMP302B-Q1 70, 75, 80, 85 TMP302C-Q1 90, 95, 100, 105 TMP302D-Q1 110, 115, 120, 125 For other available trip points, please contact a TI representative. 6 Pin Configuration and Functions DRL Package 6-Pin SOT563 Top View TRIPSET0 1 6 TRIPSET1 GND 2 5 VS OUT 3 4 HYSTSET Pin Functions PIN NO. NAME TYPE 1 TRIPSET0 Digital Input 2 GND Ground 3 OUT 4 HYSTSET Digital Input 5 VS Power Supply 6 TRIPSET1 Digital Input DESCRIPTION Used in combination with TRIPSET1 to select the temperature at which the device trips Ground Digital Output Open drain, active-low output Used to set amount of thermal hysteresis Power supply Used in combination with TRIPSET0 to select the temperature at which the device trips Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 3 TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX Supply Voltage Input pin (TRIPSET0, TRIPSET1, HYSTSET) Output pin (OUT) Current VS + 0.3 and ≤ 4 –0.5 4 –55 130 V 10 Operating Junction mA 150 Storage (1) –0.5 Output pin (OUT) Temperature UNIT 4 –60 °C 150 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) Human body model (HBM), per AEC Q100-002 Electrostatic discharge (1) UNIT ±2000 Charged device model (CDM), per AEC Q100-011 V ±1000 AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX VS Power supply voltage 1.4 3.3 3.6 UNIT V Rpullup Pullup resistor connected fromOUT to VS 10 100 kΩ TA Specified temperature –40 125 °C 7.4 Thermal Information TMP302-Q1 THERMAL METRIC (1) DRL (SOT563) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 210.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 105.0 °C/W RθJB Junction-to-board thermal resistance 87.5 °C/W ψJT Junction-to-top characterization parameter 6.1 °C/W ψJB Junction-to-board characterization parameter 87.0 °C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953). Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 TMP302-Q1 www.ti.com SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 7.5 Electrical Characteristics At TA = –40°C to +125°C, and VS = 1.4 to 3.6 V (unless otherwise noted). 100% of all units are production tested at TA = 25°C; overtemperature specifications are specified by design. PARAMETER TEST CONDITIONS MIN TYP MAX Trip point accuracy ±0.2 ±2 Trip point accuracy versus supply ±0.2 ±0.5 UNIT TEMPERATURE MEASUREMENT Trip point hysteresis HYSTSET = GND °C °C/V 5 °C 10 °C Default °C TRIPSET1 = GND, TRIPSET0 = VS Default + 5 °C TRIPSET1 = VS, TRIPSET0 = GND Default + 10 °C TRIPSET1 = VS, TRIPSET0 = VS Default + 15 °C HYSTSET = VS TEMPERATURE TRIP POINT SET TRIPSET1 = GND, TRIPSET0 = GND Temperature trip point set HYSTERESIS SET INPUT VIH Input logic level high VIL Input logic level low II Input current 0.7 × VS VS V –0.5 0.3 × VS V 1 µA 0 < VI < 3.6 V DIGITAL OUTPUT VOL Output logic level low VS > 2 V, IOL = 3 mA 0 0.4 V VS < 2 V, IOL = 3 mA 0 0.2 × VS V POWER SUPPLY Operating Supply Range IQ 1.4 Quiescent Current TA = –40°C to +125°C 8 VS = 3.3 V, TA = 50°C 7 3.6 V 15 µA µA 7.6 Typical Characteristics At TA = 25°C and VS = 3.3 V, unless otherwise noted. 2.0 16 1.5 14 Quiescent Current (µA) Trip Accuracy (°C) VS = 3.6 V 1.0 0.5 0 -0.5 -1.0 VS = 3.3 V 12 VS = 1.4 V 10 8 6 4 2 -1.5 0 -2.0 40 50 60 70 80 90 100 110 120 130 -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Temperature (°C) 30 typical units Figure 1. Trip Accuracy Error vs Temperature Figure 2. Quiescent Current vs Temperature Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 5 TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com Typical Characteristics (continued) At TA = 25°C and VS = 3.3 V, unless otherwise noted. 120 100 90 80 70 Temperature (°C) Temperature (°C) 100 80 60 40 60 50 40 30 20 20 10 0 0 5 0 10 15 20 25 0 30 20 40 60 80 Time (s) Figure 3. Temperature Step Response in Perfluorinated Fluid at 100°C vs Time 400 35 350 Output Logic Level Low (mV) Population Figure 4. Thermal Step Response in Air at 100°C vs Time 40 30 25 20 15 10 5 300 250 200 150 100 50 0 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 -75 -50 -25 0 25 50 75 100 125 150 Temperature (°C) Accuracy (°C) VS = 1.4 V Figure 5. Trip Threshold Accuracy IOL = 2 mA Figure 6. Output Logic-Level Low VOL vs Temperature OUT VS VS Voltage (2 V/div) Voltage (2 V/div) OUT Time (10 ms/div) Time (8 µs/div) TMP302A-Q1, TA = 55°C Figure 7. Power-Up and Power-Down Response 6 100 120 140 160 180 200 Time (s) TRIPSET1 = TRIPSET0 = GND Figure 8. Power-Up, Trip, and Power-Down Response Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 TMP302-Q1 www.ti.com SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 8 Detailed Description 8.1 Overview The TMP302-Q1 temperature switch is optimal for ultra low-power applications that require accurate trip thresholds. A temperature switch is a device that issues an alert response when a temperature threshold is reached or exceeded. The trip thresholds are programmable to four different settings using the TRIPSET1 and TRIPSET0 pins. Table 1 lists the pin settings versus trip points. Table 1. Trip Point versus TRIPSET1 and TRIPSET0 TRIPSET1 TRIPSET0 TMP302A-Q1 TMP302B-Q1 TMP302C-Q1 TMP302D-Q1 GND GND 50°C 70°C 90°C 110°C GND VS 55°C 75°C 95°C 115°C VS GND 60°C 80°C 100°C 120°C VS VS 65°C 85°C 105°C 125°C 8.2 Functional Block Diagram VS Bias TRIPSET0 TRIPSET1 Temperature Threshold and Hysteresis HYSTSET Comparator Alert OUT Temperature Sensor GROUND Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 7 TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com 8.3 Feature Description 8.3.1 HYSTSET If the temperature trip threshold is crossed, the open-drain, active low output (OUT) goes low and does not return to the original high state (that is, VS) until the temperature returns to a value within a hysteresis window set by the HYSTSET pin. The HYSTSET pin allows the user to choose between a 5°C and a 10°C hysteresis window. Table 2 lists the hysteresis window that corresponds to the HYSTSET setting. Table 2. HYSTSET Window HYSTSET THRESHOLD HYSTERESIS GND 5°C VS 10°C For the specific case of the device, if the HYSTSET pin is set to 10°C (that is, connected to VS) and the device is configured with a 60°C trip point (TRIPSET1 = VS, TRIPSET0 = GND), when this threshold is exceeded the output does not return to the original high state until it reaches 50°C. This case is more clearly shown in Figure 9. OUT VS 50°C 60°C T(TRIP) Figure 9. TMP302A-Q1: HYSTSET = VS, TRIPSET1 = VS, TRIPSET0 = GND 8.4 Device Functional Modes The TMP302-Q1 family of devices has a single functional mode. Normal operation for the TMP302-Q1 family of devices occurs when the power-supply voltage applied between the VS pin and GND is within the specified operating range of 1.4 to 3.6 V. The temperature threshold is selected by connecting the TRIPSET0 and TRIPSET1 pins to either the GND or VS pins (see Table 1). Hysteresis is selected by connecting the HYSTSET pin to either the GND or VS pins (see Table 2). The output pin, OUT, remains high when the temperature is below the selected temperature threshold. The OUT pin remains low when the temperature is at or above the selected temperature threshold. The OUT pin returns from a low state back to the high state based upon the amount of selected hysteresis (see the HYSTSET section). 8 Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 TMP302-Q1 www.ti.com SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information 9.1.1 Configuring the TMP302-Q1 The TMP302-Q1 family of devices is simple to configure. The only external components that the device requires are a bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF capacitor placed as close as possible to the supply pin. To minimize the internal power dissipation of the TMP302-Q1 family of devices, use a pullup resistor value greater than 10 kΩ from the OUT pin to the VS pin. Refer to Table 1 for trip-point temperature configuration. The TRIPSET pins can be toggled dynamically; however, the voltage of these pins must not exceed VS. To ensure a proper logic high, the voltage must not drop below 0.7 V × VS. 9.2 Typical Application Figure 10 shows the typical circuit configuration for the TMP302-Q1 family of devices. The TMP302-Q1 family of devices is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins directly to ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a 10-kΩ pullup resistor between the OUT and VS pins. Place a 0.1-µF bypass capacitor between the VS pin and ground, close to the TMP302-Q1 device. TMP302-Q1 TRIPSET0 TRIPSET1 10 k OUTPUT GND VS OUT HYSTSET 0.1 µF VS 1.4 V to 3.6 V Figure 10. TMP302-Q1 Typical Application Schematic Figure 11 shows the most generic implementation of the TMP302-Q1 family of devices. Switches are shown connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VS or ground. The use of switches is not strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice, connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VS pin is sufficient and minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and HYSTSET pins can be made through 0-Ω resistors which can be either populated or not populated depending upon the desired connection. Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 9 TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com Typical Application (continued) TMP302-Q1 10 k TRIPSET0 OUTPUT TRIPSET1 GND VS OUT HYSTSET 0.1 µF VS 1.4 V to 3.6 V Figure 11. TMP302-Q1 Generic Application Schematic 9.2.1 Design Requirements Designing with the TMP302-Q1 family of devices is simple. The TMP302-Q1 family of devices is a temperature switch commonly used to signal a microprocessor in the event of an over temperature condition. The temperature at which the TMP302-Q1 family of devices issues an active low alert is determined by the configuration of the TRIPSET0 and TRIPSET1 pins. These two pins are digital inputs and must be tied either high or low, according to Table 1. The TMP302-Q1 family of devices issues an active low alert when the temperature threshold is exceeded. The device has built-in hysteresis to avoid the device from signaling the microprocessor as soon as the temperature drops below the temperature threshold. The amount of hysteresis is determined by the HYSTSET pin. This pin is a digital input and must be tied either high or low, according to Table 2. See Figure 10 and Figure 11 for typical circuit configurations. 9.2.2 Detailed Design Procedure Determine the threshold temperature and hysteresis required for the application. Connect the TMPSET0, TMPSET1, and HYSTSET pins according to the design requirements. Refer to Table 1 and Table 2. Use a 10-kΩ pullup resistor from the OUT pin to the VS pin. To minimize power, a larger-value pullup resistor can be used but must not exceed 100 kΩ. Place a 0.1-µF bypass capacitor close to the TMP302-Q1 device to reduce noise coupled from the power supply. 9.2.3 Application Curves Figure 12 and Figure 13 show the TMP302A-Q1 power-on response with the ambient temperature less than 50°C and greater than 50°C respectively. The TMP302A-Q1 was configured with trip point set to 50°C. The TMP302B-Q1, TMP302C-Q1, and TMP302D-Q1 devices behave similarly with regards to power on response with TA below or above the trip point. Note that the OUT signal typically requires 35 ms following power on to become valid. 10 Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 TMP302-Q1 www.ti.com SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 Typical Application (continued) Voltage (2 V/div) OUT VS Voltage (2 V/div) OUT VS Time (5 µs/div) Time (10 ms/div) Figure 12. TMP302A-Q1 Power-On Response, TA Less than 50°C Figure 13. TMP302A-Q1 Power-On Response, TA Greater than 50°C 10 Power Supply Recommendations The TMP302-Q1 family of devices is designed to operate from a single power supply within the range 1.4 V and 3.6 V. No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302-Q1 family of devices is fully functional within 35 ms of the voltage at the VS pin reaching or exceeding 1.4 V. 11 Layout 11.1 Layout Guidelines Place the power supply bypass capacitor as close as possible to the VS and GND pins. The recommended value for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or highimpedance power supplies. Place a 10-kΩ pullup resistor from the open drain OUT pin to the power supply pin VS. 11.2 Layout Example VIA to Power Ground Plane 0.1 µF TRIPSET0 TRIPSET1 GND VS Supply Voltage HYSTSET OUT 10 k Ground Plane for Thermal Coupling to Heat Source Output Heat Source Figure 14. Layout Example Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 11 TMP302-Q1 SLOS889C – OCTOBER 2014 – REVISED SEPTEMBER 2018 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resource The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 2014–2018, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TMP302AQDRLRQ1 ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHQ TMP302BQDRLRQ1 ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHR TMP302CQDRLRQ1 ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHS TMP302DQDRLRQ1 ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SHT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of