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TMP302
SBOS488E – JUNE 2009 – REVISED DECEMBER 2018
TMP302 Easy-to-Use, Low-Power, Low-Supply Temperature Switch in Micropackage
1 Features
3 Description
•
•
•
The TMP302 device is a temperature switch in a
micropackage (SOT563). The TMP302 offers low
power (15-μA maximum) and ease-of-use through
pin-selectable trip points and hysteresis.
1
•
•
•
•
Low Power: 15 μA (Maximum)
SOT563 Package: 1.6-mm × 1.6-mm × 0.6 mm
Trip-Point Accuracy: ±0.2°C (Typical) From +40°C
to +125°C
Pin-Selectable Trip Points
Open-Drain Output
Pin-Selectable Hysteresis: 5°C and 10°C
Low Supply Voltage Range: 1.4 V to 3.6 V
These devices require no additional components for
operation; they can function independent of
microprocessors or microcontrollers.
The TMP302 is available in several different versions.
For additional trip points, contact a TI representative.
Device Information(1)
2 Applications
•
•
•
•
•
•
•
•
Cell Phone Handsets
Portable Media Players
Consumer Electronics
Servers
Power-Supply Systems
DC-DC Modules
Thermal Monitoring
Electronic Protection Systems
PART NUMBER
PACKAGE
SELECTABLE TRIP
POINTS (ºC)(2)
TMP302A
SOT (6)
50, 55, 60, 65
TMP302B
SOT (6)
70, 75, 80, 85
TMP302C
SOT (6)
90, 95, 100, 105
TMP302D
SOT (6)
110, 115, 120, 125
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) For other available trip points, contact a TI representative.
Trip Threshold Accuracy
40
35
Population
30
25
20
15
10
5
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
Accuracy (°C)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP302
SBOS488E – JUNE 2009 – REVISED DECEMBER 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
2
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
5
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
7.4 Device Functional Modes.......................................... 8
8
Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support ................. 12
11.1
11.2
11.3
11.4
11.5
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 8
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
12
12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2018) to Revision E
•
Page
Changed the input pin supply voltage maximum value from: : VS + 0.5 and ≤ 4 V to: : VS + 0.3 and ≤ 4 V ......................... 4
Changes from Revision B (December 2014) to Revision C
Page
•
Changed device names by simplifying from TMP302A, TMP302B, TMP302C, and TMP302D to TMP302 ......................... 1
•
Added plus-minus symbol to Machine Model value in ESD Ratings table............................................................................. 4
•
Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended
Operating Conditions table ..................................................................................................................................................... 4
•
Added Community Resources section ................................................................................................................................. 12
Changes from Revision A (September 2009) to Revision B
•
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
5 Pin Configuration and Functions
DRL Package
6-Pin SOT
Top View
2
TRIPSET0
1
6
TRIPSET1
GND
2
5
VS
OUT
3
4
HYSTSET
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SBOS488E – JUNE 2009 – REVISED DECEMBER 2018
Pin Functions
PIN
NO.
NAME
TYPE
1
TRIPSET0
Digital Input
2
GND
Ground
3
OUT
4
HYSTSET
Digital Input
5
VS
Power
Supply
6
TRIPSET1
Digital Input
DESCRIPTION
Used in combination with TRIPSET1 to select the temperature at which the device trips
Ground
Digital Output Open drain, active-low output
Used to set amount of thermal hysteresis
Power supply
Used in combination with TRIPSET0 to select the temperature at which the device trips
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SBOS488E – JUNE 2009 – REVISED DECEMBER 2018
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
Supply
Voltage
Input pin (TRIPSET0, TRIPSET1, HYSTSET)
Output pin (OUT)
Current
VS + 0.3
and ≤ 4
–0.5
4
–55
130
V
10
Operating
Junction
mA
150
Storage
(1)
–0.5
Output pin (OUT)
Temperature
UNIT
4
–60
°C
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
Machine model (MM)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS
Power supply voltage
Rpullup
Pullup resistor connected fromOUT to VS
TA
Specified temperature
MIN
NOM
MAX
1.4
3.3
3.6
UNIT
V
10
100
kΩ
–40
125
°C
6.4 Thermal Information
TMP302
THERMAL METRIC (1)
DRL (SOT)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
210.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
105.0
°C/W
RθJB
Junction-to-board thermal resistance
87.5
°C/W
ψJT
Junction-to-top characterization parameter
6.1
°C/W
ψJB
Junction-to-board characterization parameter
87.0
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
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6.5 Electrical Characteristics
At TA = –40°C to +125°C, and VS = 1.4 to 3.6 V (unless otherwise noted). 100% of all units are production tested at TA =
25°C; overtemperature specifications are specified by design.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Trip point accuracy
±0.2
±2
Trip point accuracy versus
supply
±0.2
±0.5
UNIT
TEMPERATURE MEASUREMENT
Trip point hysteresis
HYSTSET = GND
°C
°C/V
5
°C
10
°C
Default
°C
TRIPSET1 = GND, TRIPSET0 = VS
Default + 5
°C
TRIPSET1 = VS, TRIPSET0 = GND
Default + 10
°C
TRIPSET1 = VS, TRIPSET0 = VS
Default + 15
°C
HYSTSET = VS
TEMPERATURE TRIP POINT SET
TRIPSET1 = GND, TRIPSET0 =
GND
Temperature trip point set
HYSTERESIS SET INPUT
VIH
Input logic level high
VIL
Input logic level low
II
Input current
0.7 × VS
VS
V
–0.5
0.3 × VS
V
1
µA
0 < VI < 3.6 V
DIGITAL OUTPUT
VOL
Output logic level low
VS > 2 V, IOL = 3 mA
0
0.4
V
VS < 2 V, IOL = 3 mA
0
0.2 × VS
V
POWER SUPPLY
Operating Supply Range
IQ
1.4
Quiescent Current
TA = –40°C to +125°C
8
VS = 3.3 V, TA = 50°C
7
3.6
V
15
µA
µA
6.6 Typical Characteristics
At TA = 25°C and VS = 3.3 V, unless otherwise noted.
2.0
16
1.5
14
Quiescent Current (µA)
Trip Accuracy (°C)
VS = 3.6 V
1.0
0.5
0
-0.5
-1.0
VS = 3.3 V
12
VS = 1.4 V
10
8
6
4
2
-1.5
0
-2.0
40
50
60
70
80
90
100
110
120
130
-75
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Temperature (°C)
30 typical units
Figure 1. Trip Accuracy Error vs Temperature
Figure 2. Quiescent Current vs Temperature
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Typical Characteristics (continued)
At TA = 25°C and VS = 3.3 V, unless otherwise noted.
120
100
90
80
70
Temperature (°C)
Temperature (°C)
100
80
60
40
60
50
40
30
20
20
10
0
0
5
0
10
15
20
25
0
30
20
40
60
80
Time (s)
Figure 3. Temperature Step Response in Perfluorinated
Fluid at 100°C vs Time
400
35
350
Output Logic Level Low (mV)
Population
Figure 4. Thermal Step Response in Air at 100°C vs Time
40
30
25
20
15
10
5
300
250
200
150
100
50
0
-1.0
-0.9
-0.8
-0.7
-0.6
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
-75
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Accuracy (°C)
VS = 1.4 V
Figure 5. Trip Threshold Accuracy
IOL = 2 mA
Figure 6. Output Logic-Level Low VOL vs Temperature
OUT
VS
VS
Voltage (2 V/div)
Voltage (2 V/div)
OUT
Time (10 ms/div)
Time (8 µs/div)
TMP302A, TA = 55°C
Figure 7. Power-Up and Power-Down Response
6
100 120 140 160 180 200
Time (s)
TRIPSET1 = TRIPSET0 = GND
Figure 8. Power-Up, Trip, and Power-Down Response
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7 Detailed Description
7.1 Overview
The TMP302 temperature switch is optimal for ultra low-power applications that require accurate trip thresholds.
A temperature switch is a device that issues an alert response when a temperature threshold is reached or
exceeded. The trip thresholds are programmable to four different settings using the TRIPSET1 and TRIPSET0
pins. Table 1 lists the pin settings versus trip points.
Table 1. Trip Point versus TRIPSET1 and TRIPSET0
TRIPSET1
TRIPSET0
TMP302A
TMP302B
TMP302C
TMP302D
GND
GND
50°C
70°C
90°C
110°C
GND
VS
55°C
75°C
95°C
115°C
VS
GND
60°C
80°C
100°C
120°C
VS
VS
65°C
85°C
105°C
125°C
7.2 Functional Block Diagram
VS
Bias
TRIPSET0
TRIPSET1
Temperature
Threshold and
Hysteresis
HYSTSET
Comparator
Alert
OUT
Temperature
Sensor
GROUND
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7.3 Feature Description
7.3.1 HYSTSET
If the temperature trip threshold is crossed, the open-drain, active low output (OUT) goes low and does not return
to the original high state (that is, VS) until the temperature returns to a value within a hysteresis window set by
the HYSTSET pin. The HYSTSET pin allows the user to choose between a 5°C and a 10°C hysteresis window.
Table 2 lists the hysteresis window that corresponds to the HYSTSET setting.
Table 2. HYSTSET Window
HYSTSET
THRESHOLD HYSTERESIS
GND
5°C
VS
10°C
For the specific case of the device, if the HYSTSET pin is set to 10°C (that is, connected to VS) and the device is
configured with a 60°C trip point (TRIPSET1 = VS, TRIPSET0 = GND), when this threshold is exceeded the
output does not return to the original high state until it reaches 50°C. This case is more clearly shown in Figure 9.
OUT
VS
50°C
60°C
T(TRIP)
Figure 9. TMP302A: HYSTSET = VS, TRIPSET1 = VS, TRIPSET0 = GND
7.4 Device Functional Modes
The TMP302 family of devices has a single functional mode. Normal operation for the TMP302 family of devices
occurs when the power-supply voltage applied between the VS pin and GND is within the specified operating
range of 1.4 to 3.6 V. The temperature threshold is selected by connecting the TRIPSET0 and TRIPSET1 pins to
either the GND or VS pins (see Table 1). Hysteresis is selected by connecting the HYSTSET pin to either the
GND or VS pins (see Table 2). The output pin, OUT, remains high when the temperature is below the selected
temperature threshold. The OUT pin remains low when the temperature is at or above the selected temperature
threshold. The OUT pin returns from a low state back to the high state based upon the amount of selected
hysteresis (see the HYSTSET section).
8
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Configuring the TMP302
The TMP302 family of devices is simple to configure. The only external components that the device requires are
a bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF
capacitor placed as close as possible to the supply pin. To minimize the internal power dissipation of the
TMP302 family of devices, use a pullup resistor value greater than 10 kΩ from the OUT pin to the VS pin. Refer
to Table 1 for trip-point temperature configuration. The TRIPSET pins can be toggled dynamically; however, the
voltage of these pins must not exceed VS. To ensure a proper logic high, the voltage must not drop below 0.7 V
× VS.
8.2 Typical Application
Figure 10 shows the typical circuit configuration for the TMP302 family of devices. The TMP302 family of devices
is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins directly to
ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a 10-kΩ
pullup resistor between the OUT and VS pins. Place a 0.1-µF bypass capacitor between the VS pin and ground,
close to the TMP302 device.
TMP302
TRIPSET0
TRIPSET1
10 k
OUTPUT
GND
VS
OUT
HYSTSET
0.1 µF
VS
1.4 V to 3.6 V
Figure 10. TMP302 Typical Application Schematic
Figure 11 shows the most generic implementation of the TMP302 family of devices. Switches are shown
connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VS or ground. The use of switches is not
strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice,
connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VS pin is sufficient and
minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and
HYSTSET pins can be made through 0-Ω resistors which can be either populated or not populated depending
upon the desired connection.
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Typical Application (continued)
TMP302
10 k
TRIPSET0
OUTPUT
TRIPSET1
GND
VS
OUT
HYSTSET
0.1 µF
VS
1.4 V to 3.6 V
Figure 11. TMP302 Generic Application Schematic
8.2.1 Design Requirements
Designing with the TMP302 family of devices is simple. The TMP302 family of devices is a temperature switch
commonly used to signal a microprocessor in the event of an over temperature condition. The temperature at
which the TMP302 family of devices issues an active low alert is determined by the configuration of the
TRIPSET0 and TRIPSET1 pins. These two pins are digital inputs and must be tied either high or low, according
to Table 1. The TMP302 family of devices issues an active low alert when the temperature threshold is
exceeded. The device has built-in hysteresis to avoid the device from signaling the microprocessor as soon as
the temperature drops below the temperature threshold. The amount of hysteresis is determined by the
HYSTSET pin. This pin is a digital input and must be tied either high or low, according to Table 2.
See Figure 10 and Figure 11 for typical circuit configurations.
8.2.2 Detailed Design Procedure
Determine the threshold temperature and hysteresis required for the application. Connect the TMPSET0,
TMPSET1, and HYSTSET pins according to the design requirements. Refer to Table 1 and Table 2. Use a 10-kΩ
pullup resistor from the OUT pin to the VS pin. To minimize power, a larger-value pullup resistor can be used but
must not exceed 100 kΩ. Place a 0.1-µF bypass capacitor close to the TMP302 device to reduce noise coupled
from the power supply.
8.2.3 Application Curves
Figure 12 and Figure 13 show the TMP302A power-on response with the ambient temperature less than 50°C
and greater than 50°C respectively. The TMP302A was configured with trip point set to 50°C. The TMP302B,
TMP302C, and TMP302D devices behave similarly with regards to power on response with TA below or above
the trip point. Note that the OUT signal typically requires 35 ms following power on to become valid.
10
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Typical Application (continued)
Voltage (2 V/div)
OUT
VS
Voltage (2 V/div)
OUT
VS
Time (5 µs/div)
Time (10 ms/div)
Figure 12. TMP302A Power-On Response,
TA Less than 50°C
Figure 13. TMP302A Power-On Response,
TA Greater than 50°C
9 Power Supply Recommendations
The TMP302 family of devices is designed to operate from a single power supply within the range 1.4 V and 3.6
V. No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302
family of devices is fully functional within 35 ms of the voltage at the VS pin reaching or exceeding 1.4 V.
10 Layout
10.1 Layout Guidelines
Place the power supply bypass capacitor as close as possible to the VS and GND pins. The recommended value
for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or highimpedance power supplies. Place a 10-kΩ pullup resistor from the open drain OUT pin to the power supply pin
VS.
10.2 Layout Example
VIA to Power Ground Plane
0.1 µF
TRIPSET0
TRIPSET1
GND
VS
Supply Voltage
HYSTSET
OUT
10 k
Ground Plane for
Thermal
Coupling to Heat
Source
Output
Heat Source
Figure 14. Layout Example
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMP302ADRLR
ACTIVE
SOT-5X3
DRL
6
4000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCP
TMP302ADRLT
ACTIVE
SOT-5X3
DRL
6
250
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCP
TMP302BDRLR
ACTIVE
SOT-5X3
DRL
6
4000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCT
TMP302BDRLT
ACTIVE
SOT-5X3
DRL
6
250
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCT
TMP302CDRLR
ACTIVE
SOT-5X3
DRL
6
4000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCR
TMP302CDRLT
ACTIVE
SOT-5X3
DRL
6
250
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCR
TMP302DDRLR
ACTIVE
SOT-5X3
DRL
6
4000
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCS
TMP302DDRLT
ACTIVE
SOT-5X3
DRL
6
250
RoHS & Green NIPDAU | NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
OCS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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