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TMP400AIDBQT

TMP400AIDBQT

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    SSOP16_150MIL

  • 描述:

    SENSOR TEMPERATURE SMBUS 16QSOP

  • 数据手册
  • 价格&库存
TMP400AIDBQT 数据手册
          TMP400 TM P4 00 SBOS404 – DECEMBER 2007 ±1°C Remote and Local TEMPERATURE SENSOR with N-Factor and Series Resistance Correction FEATURES 1 • • • • 234 • • • • • • • • ±1°C REMOTE DIODE SENSOR ±1°C LOCAL TEMPERATURE SENSOR PROGRAMMABLE NON-IDEALITY FACTOR PROGRAMMABLE SERIES RESISTANCE CANCELLATION ALERT FUNCTION PROGRAMMABLE RESOLUTION: 9 to 12 Bits PROGRAMMABLE THRESHOLD LIMITS TWO-WIRE/SMBus™ SERIAL INTERFACE MINIMUM AND MAXIMUM TEMPERATURE MONITORS MULTIPLE INTERFACE ADDRESSES ALERT PIN CONFIGURATION DIODE FAULT DETECTION APPLICATIONS • • • • • • • • LCD/DLP®/LCOS PROJECTORS SERVERS INDUSTRIAL CONTROLLERS CENTRAL OFFICE TELECOM EQUIPMENT DESKTOP AND NOTEBOOK COMPUTERS STORAGE AREA NETWORKS (SAN) INDUSTRIAL AND MEDICAL EQUIPMENT PROCESSOR/FPGA TEMPERATURE MONITORING DESCRIPTION The TMP400 is a remote temperature sensor monitor with a built-in local temperature sensor. The remote temperature sensor diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs. Remote accuracy is ±1°C for multiple IC manufacturers, with no calibration needed. The Two-Wire serial interface accepts SMBus write byte, read byte, send byte, and receive byte commands to program the alarm thresholds and to read temperature data. The TMP400 is customizable with programmable: series resistance cancellation, non-ideality factor, resolution, and threshold limits. Other features are: minimum and maximum temperature monitors, wide remote temperature measurement range (up to +127.9375°C), diode fault detection, and temperature alert function. The TMP400 is available in a QSSOP-16 package. STBY 15 V+ 11 2 V+ GND 7, 8 TMP400 Interrupt Configuration ALERT Consecutive Alert Configuration Register Status Register N-Factor Correction Local Temperature Register TL Remote Temp High Limit Remote Temp Low Limit Temperature Comparators Conversion Rate Register Local Temp Low Limit Local Temperature Min/Max Register D+ 3 4 Local Temp High Limit TR Remote Temperature Register Remote Temperature Min/Max Register Manufacturer ID Register D- Device ID Register Configuration Register Resolution Register SCL SDA 14 Bus Interface 12 6 Pointer Register 10 A1 A0 1 2 3 4 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. DLP is a registered trademark of Texas Instruments. SMBus is a trademark of Intel Corp. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TMP400 www.ti.com SBOS404 – DECEMBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING TMP400 QSSOP-16 DBQ TMP400 For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Power Supply, VS Input Voltage, pins 3, 4, 6, 10, and 15 only Input Voltage, pins 11, 12, and 14 only TMP400 UNIT 7 V –0.5 to VS + 0.5 V –0.5 to +7 V 10 mA Operating Temperature Range –55 to +127 °C Storage Temperature Range –60 to +130 °C +150 °C Human Body Model (HBM) 3000 V Charged Device Model (CDM) 1000 V Machine Model (MM) 200 V Input Current Junction Temperature (TJ max) ESD Rating (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. TERMINAL FUNCTIONS PIN CONFIGURATION PIN QSSOP-16 Top View NC No internal connection NC 1 16 NC 2 V+ Positive supply (2.7V to 5.5V) V+ 2 15 STBY 3 D+ Positive connection to remote temperature sensor D+ 3 14 SCL 4 D– D- 4 Negative connection to remote temperature sensor 6 A1 Address pin 13 NC TMP400 2 NAME DESCRIPTION 1, 5, 9, 13, 16 NC 5 12 SDA 7, 8 GND A1 6 11 ALERT 10 A0 GND 7 10 A0 11 ALERT GND 8 9 12 SDA Serial data line for SMBus, open-drain; requires pull-up resistor to V+ 14 SCL Serial clock line for SMBus, open-drain; requires pull-up resistor to V+ 15 STBY NC Submit Documentation Feedback Ground Address pin Alert, active low, open-drain; requires pull-up resistor to V+ Standby pin Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 TMP400 www.ti.com SBOS404 – DECEMBER 2007 ELECTRICAL CHARACTERISTICS At TA = –40°C to +125°C and VS = 2.7V to 5.5V, unless otherwise noted. TMP400 PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR Local Temperature Sensor Remote Temperature Sensor (1) (2) TELOCAL TEREMOTE TA = –40°C to +125°C ±1.25 ±2.5 °C VS = 3.3V, TA = +15°C to +85°C ±0.0625 ±1 °C VS = 3.3V, TA = +15°C to +75°C, TD = –40°C to +125°C (3) ±0.0625 ±1 °C VS = 3.3V, TA = –40°C to +100°C, TD = –40°C to +125°C (3) ±1 ±3 °C TA = –40°C to +125°C, TD = –40°C to +125°C (3) ±3 ±10 °C VS = 2.7V to 5.5V ±0.2 ±0.5 °C/V 115 125 ms 12 Bits vs Supply Local/Remote TEMPERATURE MEASUREMENT Conversion Time (per channel) (4) 105 Resolution Local Temperature Sensor (programmable) 9 Remote Temperature Sensor 12 Bits Remote Sensor Source Currents 120 µA Medium High 60 µA Medium Low 12 µA 6 µA High Series Resistance 3kΩ Maximum Low Remote Transistor Ideality Factor η TMP400 Optimized Ideality Factor 1.008 SMBus INTERFACE Logic Input High Voltage (SCL, SDA) VIH Logic Input Low Voltage (SCL, SDA) VIL 2.1 V 0.8 Hysteresis 500 SMBus Output Low Sink Current 6 Logic Input Current –1 SMBus Input Capacitance (SCL, SDA) mA +1 µA 3.4 MHz 35 ms 1 µs 3 SMBus Clock Frequency SMBus Timeout 25 V mV 30 SCL Falling Edge to SDA Valid Time pF DIGITAL OUTPUTS Output Low Voltage VOL IOUT = 6mA 0.15 0.4 V High-Level Output Leakage Current IOH VOUT = VS 0.1 1 µA ALERT Output Low Sink Current ALERT Forced to 0.4V 6 mA POWER SUPPLY Specified Voltage Range VS Quiescent Current IQ 5.5 V 0.0625 Conversions per Second 2.7 30 38 µA Eight Conversions per Second 420 525 µA 10 µA Serial Bus Inactive, Shutdown Mode 3 Serial Bus Active, fS = 400kHz, Shutdown Mode 90 Serial Bus Active, fS = 3.4MHz, Shutdown Mode 350 Undervoltage Lock Out Power-On Reset Threshold 2.3 POR µA µA 2.4 2.6 V 1.6 2.3 V °C TEMPERATURE RANGE Specified Range –40 +125 Storage Range –60 +130 Thermal Resistance, QSSOP (1) (2) (3) (4) 70 °C °C/W Tested with less than 5Ω effective series resistance and 100pF differential input capacitance. RC = '1'. TD is the remote temperature measured at the diode. RES1 = '1' and RES0 = '1' for 12-bit resolution. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 3 TMP400 www.ti.com SBOS404 – DECEMBER 2007 TYPICAL CHARACTERISTICS At TA = +25°C and VS = 5.0V, unless otherwise noted. REMOTE TEMPERATURE ERROR vs TEMPERATURE 3.0 VS = 3.3V TREMOTE = +25°C 2 30 Typical Units Shown h = 1.008 RC = 1 1 0 -1 -2 2.0 1.0 0 -1.0 -2.0 -3 -3.0 -50 0 -25 25 50 75 100 125 -50 25 50 75 100 125 Figure 1. Figure 2. REMOTE TEMPERATURE ERROR vs LEAKAGE RESISTANCE REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (Diode-Connected Transistor, 2N3906 PNP) 2.0 RC = 1 Remote Temperature Error (°C) Remote Temperature Error (°C) 0 Ambient Temperature, TA (°C) 40 20 R - GND 0 R - VS -20 -40 1.5 VS = 2.7V 1.0 0.5 0 VS = 5.5V -0.5 -1.0 -1.5 -2.0 -60 0 5 10 15 20 25 0 500 1000 1500 2000 2500 Leakage Resistance (MW ) RS ( W ) Figure 3. Figure 4. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (GND Collector-Connected Transistor, 2N3906 PNP) REMOTE TEMPERATURE ERROR vs DIFFERENTIAL CAPACITANCE 2.0 3000 3 1.5 VS = 2.7V 1.0 0.5 VS = 5.5V 0 -0.5 -1.0 -1.5 -2.0 Remote Temperature Error (°C) RC = 1 Remote Temperature Error (°C) -25 Ambient Temperature, TA (°C) 60 2 1 0 -1 -2 -3 0 4 50 Units Shown VS = 3.3V Local Temperature Error (°C) Remote Temperature Error (°C) 3 LOCAL TEMPERATURE ERROR vs TEMPERATURE 500 1000 1500 2000 2500 3000 0 0.5 1.0 1.5 2.0 RS (W) Capacitance (nF) Figure 5. Figure 6. Submit Documentation Feedback 2.5 3.0 Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 TMP400 www.ti.com SBOS404 – DECEMBER 2007 TYPICAL CHARACTERISTICS (continued) At TA = +25°C and VS = 5.0V, unless otherwise noted. TEMPERATURE ERROR vs POWER-SUPPLY NOISE FREQUENCY 25 500 Local 100mVPP Noise Remote 100mVPP Noise Local 250mVPP Noise Remote 250mVPP Noise 20 15 10 450 400 350 5 IQ (mA) Temperature Error (°C) QUIESCENT CURRENT vs CONVERSION RATE 0 300 -5 200 -10 150 -15 100 -20 50 0 0.0625 -25 0 5 10 15 VS = 2.7V 0.125 0.25 0.5 1 2 4 Frequency (MHz) Conversion Rate (conversions/sec) Figure 7. Figure 8. SHUTDOWN QUIESCENT CURRENT vs SCL CLOCK FREQUENCY SHUTDOWN QUIESCENT CURRENT vs SUPPLY VOLTAGE 500 8 450 7 400 8 6 350 5 300 250 IQ (mA) IQ (mA) VS = 5.5V 250 VS = 5.5V 200 4 3 150 2 100 1 50 VS = 3.3V 0 1k 10k 100k 1M 10M 0 2.5 SCL Clock Frequency (Hz) 3.0 3.5 4.0 4.5 5.0 5.5 VS (V) Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 5 TMP400 www.ti.com SBOS404 – DECEMBER 2007 APPLICATION INFORMATION other devices if desired for a wired-OR implementation. A 0.1µF power-supply bypass capacitor is recommended for good local bypassing. Figure 11 shows a typical configuration for the TMP400. The TMP400 is a dual-channel digital temperature sensor that combines a local die temperature measurement channel and a remote junction temperature measurement channel in a QSSOP-16 package. The TMP400 is Two-Wire and SMBus interface-compatible, and is specified over a temperature range of –40°C to +125°C. The TMP400 contains multiple registers for holding configuration information, temperature measurement results, temperature comparator maximum/minimum limits, and status information. SERIES RESISTANCE CANCELLATION Series resistance in an application circuit that typically results from printed circuit board (PCB) trace resistance and remote line length (see Figure 11) can be automatically programmed to be cancelled by the TMP400 by setting the RC bit to '1' in the Resolution Register, preventing what would otherwise result in a temperature offset. User-programmed high and low temperature limits stored in the TMP400 can be used to monitor local and remote temperatures to trigger an over/under temperature alarm (ALERT). A total of up to 3kΩ of series line resistance is cancelled by the TMP400 if the RC bit is enabled, eliminating the need for additional characterization and temperature offset correction. Upon power-up, the RC bit is disabled (RC = 0). The TMP400 requires only a transistor connected between D+ and D– for proper remote temperature sensing operation. The SCL and SDA interface pins require pull-up resistors as part of the communication bus, while ALERT is an open-drain output that also needs a pull−up resistor. ALERT may be shared with See the two Remote Temperature Error vs Series Resistance typical characteristics curves (Figure 4 and Figure 5) for details on the effect of series resistance and power-supply voltage on sensed remote temperature error. +5V 0.1mF (1) Transistor-connected configuration : Series Resistance RS RS (2) 3 15 2 STBY V+ 10kW (typ) SCL D+ 10kW (typ) 10kW (typ) 14 (3) (2) CDIFF 4 DTMP400 10 6 SDA 12 Two-Wire Bus/ SMBus Controller A0 A1 ALERT 11 GND (1) 7, 8 Diode-connected configuration : RS RS (2) (2) (3) CDIFF (1) Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance cancellation. (2) RS should be less than 1.5kΩ in most applications. (3) CDIFF should be less than 1000pF in most applications. Figure 11. Basic Connections 6 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 TMP400 www.ti.com SBOS404 – DECEMBER 2007 DIFFERENTIAL INPUT CAPACITANCE The TMP400 tolerates differential input capacitance of up to 1000pF if RC = 1 (if RC = 0, input capacitance can be as high as 2200pF) with minimal change in temperature error. The effect of capacitance on sensed remote temperature error is illustrated in the typical characteristic curve, Remote Temperature Error vs Differential Capacitance (Figure 6). byte stores the decimal fraction value of the temperature and allows a higher measurement resolution. The measurement resolution for the remote channel is 0.0625°C, and is not adjustable. The measurement resolution for the local channel is adjustable; it can be set for 0.5°C, 0.25°C, 0.125°C, or 0.0625°C by setting the RES1 and RES0 bits of the Resolution Register; see the Resolution Register section (Table 5). REGISTER INFORMATION TEMPERATURE MEASUREMENT DATA Temperature measurement data are taken over a default range of –55°C to +127.9375°C for both local and remote locations. Temperature data resulting from conversions within the default measurement range are represented in binary form, as shown in Table 1, Binary column. Note that any temperature above +127.9375°C results in a value of 127.9375 (7Fh/F0h). Temperatures below –65°C results in a value of –65 (BF/00h). The TMP400 is specified only for ambient temperatures ranging from –40°C to +125°C. Parameters in the Absolute Maximum Ratings table must be observed. Table 1. Temperature Data Format REMOTE TEMPERATURE REGISTER DIGITAL OUTPUT (BINARY) The TMP400 contains multiple registers for holding configuration information, temperature measurement results, temperature comparator maximum/minimum, limits, and status information. These registers are described in Figure 12 and Table 2. POINTER REGISTER Figure 12 shows the internal register structure of the TMP400. The 8-bit Pointer Register is used to address a given data register. The Pointer Register identifies which of the data registers should respond to a read or write command on the Two-Wire bus. This register is set with every write command. A write command must be issued to set the proper value in the Pointer Register before executing a read command. Table 2 describes the pointer address of the registers available in the TMP400. The power-on reset (POR) value of the Pointer Register is 00h (0000 0000b). TEMPERATURE (°C) HIGH BYTE LOW BYTE HEX 128 0111 1111 1111 0000 7F/F0 Pointer Register 127.9375 0111 1111 1111 0000 7F/F0 Local and Remote Temperature Registers 100 0110 0100 0000 0000 64/00 80 0101 0000 0000 0000 50/00 75 0100 1011 0000 0000 4B/00 Status Register 50 0011 0010 0000 0000 32/00 Configuration Register Resolution Register Local and Remote Limit Registers SDA 25 0001 1001 0000 0000 19/00 0.25 0000 0000 0100 0000 00/40 0 0000 0000 0000 0000 00/00 –0.25 1111 1111 1100 0000 FF/C0 –25 1110 0111 0000 0000 E7/00 Identification Registers –55 1100 1001 0000 0000 C9/00 Local Temperature Min/Max –65 1011 1111 0000 0000 BF/00 Remote Temperature Min/Max Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature with 1°C resolution. The second (or low) Conversion Rate Register I/O Control Interface SCL Consecutive Alert Register Figure 12. Internal Register Structure Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 7 TMP400 www.ti.com SBOS404 – DECEMBER 2007 Table 2. Register Map POINTER ADDRESS (HEX) READ 00 (1) (2) 8 WRITE NA (1) BIT DESCRIPTIONS POWER-ON RESET (HEX) D7 D6 D5 D4 D3 D2 D1 D0 REGISTER DESCRIPTIONS 00 LT11 LT10 LT9 LT8 LT7 LT6 LT5 LT4 Local Temperature (High Byte) RT11 RT10 RT9 RT8 RT7 RT6 RT5 RT4 Remote Temperature (High Byte) 01 NA 00 02 NA 00 BUSY LHIGH LLOW RHIGH RLOW OPEN 0 0 Status Register 03 09 00 MASK1 SD 0 0 0 0 0 0 Configuration Register 04 0A 02 0 0 0 0 R3 R2 R1 R0 Conversion Rate Register 05 0B 7F LTH11 LTH10 LTH9 LTH8 LTH7 LTH6 LTH5 LTH4 Local Temperature High Limit (High Byte) 06 0C C9 LTL11 LTL10 LTL9 LTL8 LTL7 LTL6 LTL5 LTL4 Local Temperature Low Limit (High Byte) 07 0D 7F RTH11 RTH10 RTH9 RTH8 RTH7 RTH6 RTH5 RTH4 Remote Temperature High Limit (High Byte) 08 0E C9 RTL11 RTL10 RTL9 RTL8 RTL7 RTL6 RTL5 RTL4 Remote Temperature Low Limit (High Byte) NA 0F XX X (2) X X X X X X X One-Shot Start 10 NA 00 RT3 RT2 RT1 RT0 0 0 0 0 Remote Temperature (Low Byte) 13 13 00 RTH3 RTH2 RTH1 RTH0 0 0 0 0 Remote Temperature High Limit (Low Byte) 14 14 00 RTL3 RTL2 RTL1 RTL0 0 0 0 0 Remote Temperature Low Limit (Low Byte) 15 NA 00 LT3 LT2 LT1 LT0 0 0 0 0 Local Temperature (Low Byte) 16 16 00 LTH3 LTH2 LTH1 LTH0 0 0 0 0 Local Temperature High Limit (Low Byte) 17 17 00 LTL3 LTL2 LTL1 LTL0 0 0 0 0 Local Temperature Low Limit (Low Byte) 18 18 00 NC7 NC6 NC5 NC4 NC3 NC2 NC1 NC0 N-factor Correction 1A 1A 18 0 0 0 1 1 RC RES1 RES0 Resolution Register 22 22 01 TO_EN 0 0 0 C2 C1 C0 0 Consecutive Alert Register 30 30 7F LMT11 LMT10 LMT9 LMT8 LMT7 LMT6 LMT5 LMT4 Local Temperature Minimum (High Byte) 31 31 F0 LMT3 LMT2 LMT1 LMT0 0 0 0 0 Local Temperature Minimum (Low Byte) 32 32 80 LXT11 LXT10 LXT9 LXT8 LXT7 LXT6 LXT5 LXT4 Local Temperature Maximum (High Byte) 33 33 00 LXT3 LXT2 LXT1 LXT0 0 0 0 0 Local Temperature Maximum (Low Byte) 34 34 7F RMT11 RMT10 RMT9 RMT8 RMT7 RMT6 RMT5 RMT4 Remote Temperature Minimum (High Byte) 35 35 F0 RMT3 RMT2 RMT1 RMT0 0 0 0 0 Remote Temperature Minimum (Low Byte) 36 36 80 RXT11 RXT10 RXT9 RXT8 RXT7 RXT6 RXT5 RXT4 Remote Temperature Maximum (High Byte) 37 37 00 RXT3 RXT2 RXT1 RXT0 0 0 0 0 Remote Temperature Maximum (Low Byte) NA FC FF X (2) X X X X X X X Software Reset FE NA 55 0 1 0 1 0 1 0 1 Manufacturer ID FF NA 01 0 0 0 0 0 0 0 1 Device ID NA = not applicable; register is write- or read-only. X = indeterminate state. Writing any value to this register indicates a software reset; see the Software Reset section. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 TMP400 www.ti.com SBOS404 – DECEMBER 2007 TEMPERATURE REGISTERS The TMP400 has four 8-bit registers that hold temperature measurement results. Both the local channel and the remote channel have a high byte register that contains the most significant bits (MSBs) of the temperature analog-to-digital converter (ADC) result, and a low byte register that contains the least significant bits (LSBs) of the temperature ADC result. The local channel high byte address is 00h; the local channel low byte address is 15h. The remote channel high byte is at address 01h; the remote channel low byte address is 10h. These read-only registers are updated by the ADC each time a temperature measurement is completed. The TMP400 contains circuitry to assure that a low byte register read command returns data from the same ADC conversion as the immediately preceding high byte read command. This assurance remains valid only until another register is read. For proper operation, the high byte of a temperature register should be read first. The low byte register should be read in the next read command. The low byte register may be left unread if the LSBs are not needed. Alternatively, the temperature registers may be read as a 16-bit register by using a single two-byte read command from address 00h for the local channel result or from address 01h for the remote channel result. The high byte is output first, followed by the low byte. Both bytes of this read operation are from the same ADC conversion. The power-on reset value of both temperature registers is 00h. LIMIT REGISTERS The TMP400 has eight registers for setting comparator limits for both the local and remote measurement channels. These registers have read and write capability. The High and Low Limit Registers for both channels span two registers, as do the temperature registers. The local temperature high limit is set by writing the high byte to pointer address 0Bh and writing the low byte to pointer address 16h, or by using a single two-byte write command (high byte first) to pointer address 0Bh. The local temperature high limit is obtained by reading the high byte from pointer address 05h and the low byte from pointer address 16h. The power-on reset value of the local temperature high limit is 7Fh/00h (+127°C). Similarly, the local temperature low limit is set by writing the high byte to pointer address 0Ch and writing the low byte to pointer address 17h, or by using a single two-byte write command to pointer address 0Ch. The local temperature low limit is read by reading the high byte from pointer address 06h and the low byte from pointer address 17h, or by using a two-byte read from pointer address 06h. The power-on reset value of the local temperature low limit register is C9h/00h (–55°C). The remote temperature high limit is set by writing the high byte to pointer address 0Dh and writing the low byte to pointer address 13h, or by using a two-byte write command to pointer address 0Dh. The remote temperature high limit is obtained by reading the high byte from pointer address 07h and the low byte from pointer address 13h, or by using a two-byte read command from pointer address 07h. The power-on reset value of the Remote Temperature High Limit Register is 7Fh/00h (+127°C). The remote temperature low limit is set by writing the high byte to pointer address 0Eh and writing the low byte to pointer address 14h, or by using a two-byte write to pointer address 0Eh. The remote temperature low limit is read by reading the high byte from pointer address 08h and the low byte from pointer address 14h, or by using a two-byte read from pointer address 08h. The power-on reset value of the Remote Temperature Low Limit Register is C9h/00h (–55°C). STATUS REGISTER The TMP400 has a Status Register to report the state of the temperature comparators. Table 3 shows the Status Register bits. The Status Register is read-only and is read by reading from pointer address 02h. Table 3. Status Register Format STATUS REGISTER (Read = 02h, Write = NA) BIT # BIT NAME POR VALUE (1) D7 D6 D5 D4 D3 D2 D1 D0 BUSY LHIGH LLOW RHIGH RLOW OPEN — — 0 (1) 0 0 0 0 0 0 0 The BUSY bit will change to ‘1’ almost immediately ( 0.25V at 6µA, at the highest sensed temperature. 2. Base-emitter voltage < 0.95V at 120µA, at the lowest sensed temperature. 3. Base resistance < 100Ω. 4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150). Based on these criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP). MEASUREMENT ACCURACY AND THERMAL CONSIDERATIONS The temperature measurement accuracy of the TMP400 depends on the remote and/or local temperature sensor being at the same temperature as the system point being monitored. Clearly, if the temperature sensor is not in good thermal contact with the part of the system being monitored, then there will be a delay in the response of the sensor to a temperature change in the system. For remote temperature sensing applications using a substrate transistor (or a small, SOT23 transistor) placed close to the device being monitored, this delay is usually not a concern. The local temperature sensor inside the TMP400 monitors the ambient air around the device. The thermal time constant for the TMP400 is approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, it would take the TMP400 about 10 seconds (that is, five thermal time constants) to settle to within 1°C of the final value. In most applications, the TMP400 package is in electrical (and therefore, thermal) contact with the printed circuit board (PCB), as well as subjected to forced airflow. The accuracy of the measured temperature directly depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP400 is measuring. Additionally, the internal power dissipation of the TMP400 can cause the temperature to rise above the ambient or PCB temperature. The internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used. For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP400 dissipates 1.82mW (PDIQ = 5.5V × 420µA). If the ALERT pin is sinking 1mA, an additional power of 0.4mW is dissipated (PDOUT = 1mA × 0.4V = 0.4mW). Total power dissipation is then 2.22mW (PDIQ + PDOUT) and, with an θJA of 150°C/W, causes the junction temperature to rise approximately 0.333°C above the ambient. Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 19 TMP400 www.ti.com SBOS404 – DECEMBER 2007 LAYOUT CONSIDERATIONS Remote temperature sensing on the TMP400 measures very small voltages using very low currents; therefore, noise at the IC inputs must be minimized. Most applications using the TMP400 will have high digital content, with several clocks and logic level transitions creating a noisy environment. Layout should adhere to the following guidelines: 1. Place the TMP400 as close to the remote junction sensor as possible. 2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of ground guard traces, as shown in Figure 19. If a multilayer PCB is used, bury these traces between ground or VDD planes to shield them from extrinsic noise sources. 5 mil (0.127mm) PCB traces are recommended. 3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the D+ and D– connections to cancel any thermocouple effects. 4. Use a 0.1µF local bypass capacitor directly between the V+ and GND of the TMP400, as shown in Figure 20. Minimize filter capacitance between D+ and D– to 1000pF or less for optimum measurement performance. This capacitance includes any cable capacitance between the remote temperature sensor and TMP400. 5. If the connection between the remote temperature sensor and the TMP400 is less than 8 inches (203.2mm), use a twisted-wire pair connection. Beyond 8 inches, use a twisted, shielded pair with the shield grounded as close to the TMP400 as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60Hz pickup. 20 GND(1) D+ (1) Ground or V+ layer on bottom and/or top, if possible. D-(1) GND (1) (1) 5mil traces with 5mil spacing. Figure 19. Example Signal Traces 0.1mF Capacitor V+ PCB Via GND 1 16 2 15 3 14 4 PCB Via 13 TMP400 5 12 6 11 7 10 8 9 Figure 20. Suggested Bypass Capacitor Placement Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TMP400 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TMP400AIDBQR ACTIVE SSOP DBQ 16 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 TMP400 TMP400AIDBQT ACTIVE SSOP DBQ 16 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 TMP400 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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