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TMP461
SBOS722B – JUNE 2015 – REVISED AUGUST 2016
TMP461 High-Accuracy Remote and Local Temperature Sensor with
Pin-Programmable Bus Address
1 Features
3 Description
•
The TMP461 device is a high-accuracy, low-power
remote temperature sensor monitor with a built-in
local temperature sensor. The remote temperature
sensors are typically low-cost discrete NPN or PNP
transistors, or substrate thermal transistors or diodes
that are integral parts of microprocessors,
microcontrollers, or field-programmable gate arrays
(FPGAs). Temperature is represented as a 12-bit
digital code for both local and remote sensors, giving
a resolution of 0.0625°C. The two-wire serial interface
accepts the SMBus communication protocol with up
to nine different pin-programmable addresses.
1
•
•
•
•
•
•
•
•
•
•
Remote Diode Temperature Sensor Accuracy:
±0.75°C
Local Temperature Sensor Accuracy: ±1°C
Resolution for Local and Remote Channels:
0.0625°C
Supply and Logic Voltage Range: 1.7 V to 3.6 V
35-µA Operating Current (1 SPS),
3-µA Shutdown Current
Series Resistance Cancellation
η-Factor and Offset Correction
Programmable Digital Filter
Diode Fault Detection
Two-Wire and SMBus™ Serial Interface
Compatible with Pin-Programmable Address
10-Lead WQFN Package
Advanced features [such as series resistance
cancellation, programmable nonideality factor (ηfactor),
programmable
offset,
programmable
temperature limits, and a programmable digital filter]
are combined to provide a robust thermal monitoring
solution with improved accuracy and noise immunity.
The TMP461 is ideal for multi-location, high-accuracy
temperature measurements in a variety of
communication, computing, instrumentation, and
industrial applications. The device is specified for
operation over a supply voltage range of 1.7 V to
3.6 V, and a temperature range of –40°C to 125°C.
2 Applications
•
•
•
•
•
•
•
•
Processor Temperature Monitoring
Telecommunication Equipment
Servers and Personal Computers
Precision Instruments
Test Equipment
Smart Batteries
Embedded Applications
LED Lighting Thermal Control
Device Information(1)
PART NUMBER
TMP461
PACKAGE
WQFN (10)
BODY SIZE (NOM)
2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Block Diagram
1.7 V to 3.6 V
1.7 V to 3.6 V
10
A1
Processor or ASIC
1
9
SCL
V+
2
Built-In Thermal
Transistor, Diode
3
8
D+
TMP461
D-
ALERT/THERM2
4
SDA
GND
THERM
7
SMBus
Controller
6
A0
5
Overtemperature Shutdown
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP461
SBOS722B – JUNE 2015 – REVISED AUGUST 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Block Diagram .....................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
4
4
4
4
5
6
7
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Two-Wire Timing Requirements ...............................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 13
8.5 Programming........................................................... 14
8.6 Register Map........................................................... 17
9
Application and Implementation ........................ 23
9.1 Application Information............................................ 23
9.2 Typical Application .................................................. 23
10 Power Supply Recommendations ..................... 26
11 Layout................................................................... 27
11.1 Layout Guidelines ................................................. 27
11.2 Layout Example .................................................... 28
12 Device and Documentation Support ................. 29
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
29
29
29
29
29
13 Mechanical, Packaging, and Orderable
Information ........................................................... 29
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2015) to Revision B
Page
•
Added formating of limits - moved negative limits from max column to min column for all temperature accuracy limits. ..... 5
•
Added minimum and maximum over temperature limits for all Remote sensor source current specifications. .................... 5
Changes from Original (June 2015) to Revision A
•
2
Page
Released to production .......................................................................................................................................................... 1
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SBOS722B – JUNE 2015 – REVISED AUGUST 2016
6 Pin Configuration and Functions
RUN Package
10-Pin WQFN
Top View
A1
V+
1
D+
10
9
SCL
2
8
SDA
D-
3
7
ALERT/THERM2
THERM
4
6
GND
5
A0
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
A0
5
Digital input
Address select. Connect to GND, V+, or leave floating.
A1
10
Digital input
Address select. Connect to GND, V+, or leave floating.
ALERT/THERM2
7
Digital output
Interrupt or SMBus alert output. Can be configured as a second THERM output.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
D–
3
Analog input
Negative connection to remote temperature sensor
D+
2
Analog input
Positive connection to remote temperature sensor
GND
6
Ground
SCL
9
Digital input
SDA
8
THERM
4
Digital output
Thermal shutdown or fan-control pin.
Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
V+
1
Power supply
Positive supply voltage, 1.7 V to 3.6 V
Supply ground connection
Serial clock line for SMBus.
Input; requires a pullup resistor to a voltage between 1.7 V and 3.6 V if driven by an open-drain output.
Bidirectional digital
Serial data line for SMBus. Open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V.
input-output
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Power supply
Input voltage
MIN
MAX
UNIT
V+
–0.3
6
V
THERM, ALERT/THERM2, SDA and SCL only
–0.3
6
D+, A0, A1
–0.3
(V+) + 0.3
D– only
–0.3
0.3
10
mA
–55
150
°C
150
°C
150
°C
Input current
Operating temperature
Junction temperature (TJ max)
Storage temperature, Tstg
(1)
–60
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Charged device model (CDM), JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
V+
Supply voltage
1.7
3.3
3.6
UNIT
V
TA
Operating free-air temperature
–40
125
°C
7.4 Thermal Information
TMP461
THERMAL METRIC
(1)
RUN (WQFN)
UNIT
10 PINS
RθJA
Junction-to-ambient thermal resistance
123.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
60.1
°C/W
RθJB
Junction-to-board thermal resistance
78.1
°C/W
ψJT
Junction-to-top characterization parameter
4.6
°C/W
ψJB
Junction-to-board characterization parameter
78.1
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
At TA = –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
TA = –10°C to 100°C, V+ = 1.7 V to 3.6 V
-1
±0.125
+1
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V
-1.25
±0.5
+1.25
TA = 0°C to 100°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V
-0.75
±0.125
+ 0.75
-1.5
±0.5
+1.5
-0.25
±0.1
+0.25
UNIT
TEMPERATURE MEASUREMENT
TALOCAL
TAREMOTE
Local temperature sensor accuracy
Remote temperature sensor accuracy
Temperature sensor error versus supply
(local or remote)
TA = –40°C to 125°C, TD = –55°C to 150°C,
V+ = 1.7 V to 3.6 V
V+ = 1.7 V to 3.6 V
°C
Temperature resolution
(local and remote)
ADC conversion time
0.0625
One-shot mode, per channel (local or remote)
15
ADC resolution
Medium
88
Series resistance 1 kΩ (max)
Low
η
Remote transistor ideality factor
120
17
ms
Bits
152
33
45
57
5.5
7.5
9.5
TMP461 optimized ideality factor
°C/V
°C
12
High
Remote sensor
source current
°C
µA
1.008
SERIAL INTERFACE
VIH
High-level input voltage
VIL
Low-level input voltage
1.4
Hysteresis
200
SDA output-low sink current
VOL
IO = –6 mA
Serial bus input leakage current
0 V ≤ VIN ≤ 3.6 V
mA
0.15
–1
0.4
V
1
μA
pF
SCL
3
6
SDA
4.6
9
Serial bus clock frequency
0.001
Serial bus timeout
20
V
mV
6
Low-level output voltage
Serial bus input capacitance
V
0.45
2.17
25
30
pF
MHz
ms
DIGITAL INPUTS (A0, A1)
VIH
High-level input voltage
0.9(V+)
(V+) + 0.3
VIL
Low-level input voltage
–0.3
0.1(V+)
V
–1
1
μA
2.5
5
pF
0.15
0.4
V
1
μA
3.6
V
Input leakage current
0 V ≤ VIN ≤ 3.6 V
Input capacitance
V
DIGITAL OUTPUTS (THERM, ALERT/THERM2)
Output-low sink current
6
VOL
Low-level output voltage
IO = –6 mA
IOH
High-level output leakage current
VO = V+
mA
POWER SUPPLY
V+
IQ
Specified supply voltage range
Quiescent current
1.7
Active conversion, local sensor
240
375
Active conversion, remote sensor
400
600
15
35
3
8
Standby mode (between conversions)
Shutdown mode, serial bus inactive
Shutdown mode, serial bus active, fS = 400 kHz
POR
Power-on reset threshold
90
Shutdown mode, serial bus active, fS = 2.17 MHz
350
Rising edge
1.2
1.55
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V
5
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SBOS722B – JUNE 2015 – REVISED AUGUST 2016
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7.6 Two-Wire Timing Requirements
At –40°C to 125°C and V+ = 1.7 V to 3.6 V, unless otherwise noted.
FAST MODE
HIGH-SPEED MODE
MIN
MAX
MIN
MAX
UNIT
0.4
0.001
2.17
MHz
f(SCL)
SCL operating frequency
0.001
t(BUF)
Bus free time between stop and start condition
1300
160
ns
t(HDSTA)
Hold time after repeated start condition.
After this period, the first clock is generated.
600
160
ns
t(SUSTA)
Repeated start condition setup time
600
160
ns
t(SUSTO)
Stop condition setup time
600
160
t(HDDAT)
Data hold time
t(SUDAT)
Data setup time
t(LOW)
0
900
ns
0
150
ns
100
40
ns
SCL clock low period
1300
320
ns
t(HIGH)
SCL clock high period
600
60
ns
tF – SDA
Data fall time
300
130
ns
tF, tR – SCL
Clock fall and rise time
300
40
ns
tR
Rise time for SCL ≤ 100 kHz
t(LOW)
1000
tF
tR
ns
t(HDSTA)
SCL
t(HDSTA)
t(HIGH)
t(HDDAT)
t(SUSTO)
t(SUSTA)
t(SUDAT)
SDA
t(BUF)
P
S
S
P
Figure 1. Two-Wire Timing Diagram
6
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7.7 Typical Characteristics
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
1
Mean 6V
Mean + 6 V
0.7
0.8
Remote Temperature Error (qC)
Local Temperature Error (qC)
0.9
0.5
0.3
0.1
-0.1
-0.3
-0.5
-0.7
-0.9
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
Mean 6V
Mean + 6V
-0.8
-1.1
-40
-25
-10
5
20 35 50 65 80
Ambient Temperature (qC)
95
-1
-40
110 125
Typical behavior of 25 devices over temperature
-10
5
20 35 50 65 80
Ambient Temperature (qC)
95
110 125
Typical behavior of 25 devices over temperature
Figure 2. Local Temperature Error vs
Ambient Temperature
Figure 3. Remote Temperature Error vs
Ambient Temperature
20
1
D+ to GND
D+ to V+
0
-20
-40
0.8
Remote Temperature Error (qC)
Remote Temperature Error (qC)
-25
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-60
-1
1
2
3
4 5 6 7 8 10
20 30 40 50 70 100
Leakage Resistance (M:)
0
500
1000
1500
2000
Series Resistance (:)
2500
3000
D004
No physical capacitance during measurement
Figure 4. Remote Temperature Error vs
Leakage Resistance
Figure 5. Remote Temperature Error vs
Series Resistance
400
350
-5
Quiescent Current (PA)
Remote Temperature Error (qC)
0
-10
-15
-20
-25
300
250
200
150
100
50
-30
0
5
10
15
Differential Capacitance (nF)
20
25
0
0.01
D005
0.1
1
Conversion Rate (Hz)
10
100
D007
No physical series resistance on D+, D– pins during measurement
Figure 6. Remote Temperature Error vs
Differential Capacitance
Figure 7. Quiescent Current vs Conversion Rate
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Typical Characteristics (continued)
At TA = 25°C and V+ = 3.6 V, unless otherwise noted.
180
175
200
Quiescent Current (PA)
Shutdown Quiescent Current (PA)
250
150
100
50
0
1k
170
165
160
155
10k
100k
Clock Frequency (Hz)
1M
10M
150
1.5
2
2.5
3
Supply Voltage (V)
D008
3.5
4
D009
16 samples per second (default mode)
Figure 8. Shutdown Quiescent Current
vs SCL Clock Frequency
Figure 9. Quiescent Current vs Supply Voltage
(At Default Conversion Rate of 16 Conversions per Second)
Shutdown Quiescent Current (PA)
3
2.5
2
1.5
1
0.5
1.5
2
2.5
3
Supply Voltage (V)
3.5
4
D010
Figure 10. Shutdown Quiescent Current
vs Supply Voltage
8
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8 Detailed Description
8.1 Overview
The TMP461 device is a digital temperature sensor that combines a local temperature measurement channel
and a remote-junction temperature measurement channel in a single WQFN-10 package. The device is two-wireand SMBus-interface-compatible with nine pin-programmable bus address options, and is specified over a
temperature range of –40°C to 125°C. The TMP461 device also contains multiple registers for programming and
holding configuration settings, temperature limits, and temperature measurement results.
8.2 Functional Block Diagram
V+
TMP461
A0
Register Bank
Oscillator
A1
SCL
Serial Interface
Control Logic
SDA
16 x I
6xI
D+
I
ALERT/THERM2
ADC
DTHERM
Internal
BJT
GND
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8.3 Feature Description
8.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 12 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of Table 1. Any temperatures above 127°C result in a value that rails to 127.9375
(7FFh). The device can be set to measure over an extended temperature range by changing bit 2 (RANGE) of
the configuration register from low to high. The change in measurement range and data format from standard
binary to extended binary occurs at the next temperature conversion. For data captured in the extended
temperature range configuration, an offset of 64 (40h) is added to the standard binary value, as shown in the
Extended Binary column of Table 1. This configuration allows measurement of temperatures as low as –64°C,
and as high as 191°C; however, most temperature-sensing diodes only operate within the range of –55°C to
150°C. Additionally, the TMP461 is specified only for ambient temperatures ranging from –40°C to 125°C;
parameters in the Absolute Maximum Ratings table must be observed.
Table 1. Temperature Data Format (Local and Remote Temperature High Bytes)
LOCAL AND REMOTE TEMPERATURE REGISTER HIGH BYTE VALUE
(1°C Resolution)
STANDARD BINARY (1)
EXTENDED BINARY (2)
TEMPERATURE
(°C)
BINARY
HEX
BINARY
–64
1100 0000
C0
0000 0000
00
–50
1100 1110
CE
0000 1110
0E
–25
1110 0111
E7
0010 0111
27
0
0000 0000
00
0100 0000
40
1
0000 0001
01
0100 0001
41
5
0000 0101
05
0100 0101
45
10
0000 1010
0A
0100 1010
4A
25
0001 1001
19
0101 1001
59
50
0011 0010
32
0111 0010
72
75
0100 1011
4B
1000 1011
8B
100
0110 0100
64
1010 0100
A4
125
0111 1101
7D
1011 1101
BD
127
0111 1111
7F
1011 1111
BF
150
0111 1111
7F
1101 0110
D6
175
0111 1111
7F
1110 1111
EF
191
0111 1111
7F
1111 1111
FF
(1)
(2)
10
HEX
Resolution is 1°C per count. Negative numbers are represented in twos complement format.
Resolution is 1°C per count. All values are unsigned with a –64°C offset.
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Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature
with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a
higher measurement resolution, as shown in Table 2. The measurement resolution for both the local and the
remote channels is 0.0625°C.
Table 2. Decimal Fraction Temperature Data Format (Local and Remote Temperature Low Bytes)
(1)
TEMPERATURE REGISTER LOW BYTE VALUE
(0.0625°C Resolution) (1)
TEMPERATURE
(°C)
STANDARD AND EXTENDED BINARY
HEX
0
0000 0000
00
0.0625
0001 0000
10
0.1250
0010 0000
20
0.1875
0011 0000
30
0.2500
0100 0000
40
0.3125
0101 0000
50
0.3750
0110 0000
60
0.4375
0111 0000
70
0.5000
1000 0000
80
0.5625
1001 0000
90
0.6250
1010 0000
A0
0.6875
1011 0000
B0
0.7500
1100 0000
C0
0.8125
1101 0000
D0
0.8750
1110 0000
E0
0.9375
1111 0000
F0
Resolution is 0.0625°C per count. All possible values are shown.
8.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
High-byte conversion (for example, 0111 0011):
Convert the right-justified binary high byte to hexadecimal.
From hexadecimal, multiply the first number by 160 = 1 and the second number by 161 = 16.
The sum equals the decimal equivalent.
0111 0011b → 73h → (3 × 160) + (7 × 161) = 115.
Low-byte conversion (for example, 0111 0000):
To convert the left-justified binary low-byte to decimal, use bits 7 through 4 and ignore bits 3 through 0
because they do not affect the value of the number.
0111b → (0 × 1 / 2)1 + (1 × 1 / 2)2 + (1 × 1 / 2)3 + (1 × 1 / 2)4 = 0.4375.
8.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
For positive temperatures (for example, 20°C):
(20°C) / (1°C per count) = 20 → 14h → 0001 0100.
Convert the number to binary code with 8-bit, right-justified format, and MSB = 0 to denote a positive sign.
20°C is stored as 0001 0100 → 14h.
For negative temperatures (for example, –20°C):
(|–20|) / (1°C per count) = 20 → 14h → 0001 0100.
Generate the twos complement of a negative number by complementing the absolute value binary number
and adding 1.
–20°C is stored as 1110 1100 → ECh.
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8.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total of up to 1 kΩ of
series resistance can be cancelled by the TMP461 device, thus eliminating the need for additional
characterization and temperature offset correction. See Figure 5 (Remote Temperature Error vs Series
Resistance) for details on the effects of series resistance on sensed remote temperature error.
8.3.3 Differential Input Capacitance
The TMP461 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature
error. The effect of capacitance on the sensed remote temperature error is illustrated in Figure 6 (Remote
Temperature Error vs Differential Capacitance).
8.3.4 Filtering
Remote junction temperature sensors are usually implemented in a noisy environment. Noise is most often
created by fast digital signals that can corrupt measurements. The TMP461 device has a built-in, 65-kHz filter on
the D+ and D– inputs to minimize the effects of noise. However, a bypass capacitor placed differentially across
the inputs of the remote temperature sensor is recommended to make the application more robust against
unwanted coupled signals. For this capacitor, select a value between 100 pF differential and 1 nF. Some
applications attain better overall accuracy with additional series resistance. However, this increased accuracy is
application-specific. When series resistance is added, the total value must not be greater than 1 kΩ. If filtering is
required, suggested component values are 100 pF differential and 50 Ω on each input; exact values are
application-specific.
100
100
90
90
80
80
70
Temperature (°C)
Temperature (°C)
Additionally, a digital filter is available for the remote temperature measurements to further reduce the effect of
noise. This filter is programmable and has two levels when enabled. Level 1 performs a moving average of four
consecutive samples. Level 1 filtering can be achieved by setting the digital filter control register (read address
24h, write address 24h) to 01h. Level 2 performs a moving average of eight consecutive samples. Level 2
filtering can be achieved by setting the digital filter control register (read address 24h, write address 24h) to 02h.
The value stored in the remote temperature result register is the output of the digital filter, and is the value that
the ALERT and THERM limits are compared to. The digital filter provides additional immunity to noise and spikes
on the ALERT and THERM outputs. The filter responses to impulse and step inputs are shown in Figure 11 and
Figure 12, respectively. The filter can be enabled or disabled by programming the desired levels in the digital
filter register; see Table 4. The digital filter is disabled by default and on POR.
Disabled
60
50
40
Level1
Level 2
30
70
Disabled
60
Level 1
Level 2
50
40
30
20
20
10
10
0
0
0
1
2
3
4
5
6
7 8
9
Samples
10
11 12
13
14
15
0
1
Figure 11. Filter Response to Impulse Inputs
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2
3
4
5
6
7 8
9
Samples
10
11 12
13
14
15
Figure 12. Filter Response to Step Inputs
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8.3.5 Sensor Fault
The TMP461 device can sense a fault at the D+ input resulting from an incorrect diode connection. The TMP461
device can also sense an open circuit. Short-circuit conditions return a value of –64°C. The detection circuitry
consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The
comparator output is continuously checked during a conversion. If a fault is detected, then OPEN (bit 2) in the
status register is set to 1.
When not using the remote sensor with the TMP461 device, the D+ and D– inputs must be connected together
to prevent meaningless fault warnings.
8.3.6
ALERT and THERM Functions
Operation of the ALERT (pin 7) and THERM (pin 4) interrupts is shown in Figure 13. Operation of the THERM
(pin 4) and THERM2 (pin 7) interrupts is shown in Figure 14. The ALERT and THERM pin setting is determined
by bit 5 of the configuration register.
The hysteresis value is stored in the THERM hysteresis register and applies to both the THERM and THERM2
interrupts. The value of the CONAL[2:0] bits in the consecutive ALERT register (see Table 4) determines the
number of limit violations before the ALERT pin is tripped. The default value is 000b and corresponds to one
violation, 001b programs two consecutive violations, 011b programs three consecutive violations, and 111b
programs four consecutive violations. The CONAL[2:0] bits provide additional filtering for the ALERT pin state.
Temperature Conversion Complete
Temperature Conversion Complete
150
150
140
140
130
130
Temperature (°C)
110
THERM Limit
100
THERM Limit - Hysteresis
90
High Temperature Limit
Temperature (°C)
120
120
110
THERM Limit
100
THERM Limit - Hysteresis
90
THERM2 Limit
80
80
70
70
THERM2 Limit - Hysteresis
Measured
Temperature
60
Measured
Temperature
60
50
50
Time
Time
ALERT output
serviced by master
THERM2
ALERT
THERM
THERM
Figure 13. ALERT and THERM Interrupt Operation
Figure 14. THERM and THERM2 Interrupt Operation
8.4 Device Functional Modes
8.4.1 Shutdown Mode (SD)
The TMP461 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 3 μA; see Figure 10
(Shutdown Quiescent Current vs Supply Voltage). Shutdown mode is enabled when the SD bit (bit 6) of the
configuration register is high; the device shuts down after the current conversion is finished. When the SD bit is
low, the device maintains a continuous-conversion state.
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8.5 Programming
8.5.1 Serial Interface
The TMP461 device operates only as a slave device on either the two-wire bus or the SMBus. Connections to
either bus are made using the open-drain I/O lines, SDA and SCL. The SDA and SCL pins feature integrated
spike suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP461
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.17 MHz)
modes. All data bytes are transmitted MSB first.
8.5.1.1 Bus Overview
The TMP461 device is SMBus-interface-compatible. In SMBus protocol, the device that initiates the transfer is
called a master, and the devices controlled by the master are slaves. The bus must be controlled by a master
device that generates the serial clock (SCL), controls the bus access, and generates the start and stop
conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the slave being
addressed responds to the master by generating an acknowledge bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit. During data
transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
8.5.1.2 Bus Definitions
The TMP461 device is two-wire- and SMBus-compatible. Figure 15 and Figure 16 illustrate the timing for various
operations on the TMP461 device. The bus definitions are as follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
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Programming (continued)
1
9
9
1
SCL
¼
SDA
0
1
0
1
1
0(1)
0
R/W
Start By
Master
P7
P6
P5
P4
P3
P2
P1
P0
ACK By
Device
¼
ACK By
Device
Frame 2 Pointer Register Byte
Frame 1 Two-Wire Slave Address Byte
9
1
SCL
(Continued)
SDA
(Continued)
D7
D6
D5
D4
D3
D2
D1
D0
ACK By
Device
Stop By
Master
Frame 3 Data Byte 1
(1)
Slave address 1001100 is shown.
Figure 15. Two-Wire Timing Diagram for Write Word Format
1
9
1
9
SCL
¼
SDA
1
0
0
1
1
0
0(1)
P7
R/W
Start By
Master
P6
P5
P4
P3
P2
P1
P0
ACK By
Device
ACK By
Device
Frame 1 Two-Wire Slave Address Byte
1
¼
Frame 2 Pointer Register Byte
9
1
9
SCL
(Continued)
¼
SDA
(Continued)
1
0
0
1
1
0
0(1)
R/W
Start By
Master
D7
D6
ACK By
Device
Frame 3 Two-Wire Slave Address Byte
(1)
Slave address 1001100 is shown.
(2)
The master must leave SDA high to terminate a single-byte read operation.
D5
D4
D3
D2
D1
D0
From
Device
¼
NACK By
Master(2)
Frame 4 Data Byte 1 Read Register
Figure 16. Two-Wire Timing Diagram for Single-Byte Read Format
8.5.1.3 Serial Bus Address
To communicate with the TMP461 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP461 allows up to nine devices to be connected to the SMBus, depending on the
A0, A1 pin connections as described in Table 3. The A0 and A1 address pins must be isolated from noisy or
high-frequency signals traces in order to avoid false address settings when these pins are set to a float state.
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Programming (continued)
Table 3. TMP461 Slave Address Options
SLAVE ADDRESS
A1 CONNECTION
A0 CONNECTION
BINARY
HEX
GND
GND
1001 000
48
GND
Float
1001 001
49
GND
V+
1001 010
4A
Float
GND
1001 011
4B
Float
Float
1001 100
4C
Float
V+
1001 101
4D
V+
GND
1001 110
4E
V+
Float
1001 111
4F
V+
V+
1010 000
50
8.5.1.4 Read and Write Operations
Accessing a particular register on the TMP461 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP461 device requires a value for the pointer register (see Figure 15).
When reading from the TMP461 device, the last value stored in the pointer register by a write operation is used
to determine which register is read by a read operation. To change which register is read for a read operation, a
new value must be written to the pointer register. This transaction is accomplished by issuing a slave address
byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can
then generate a start condition and send the slave address byte with the R/W bit high to initiate the read
command; see Figure 16 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP461 retains the pointer register value until it is changed by the next write operation.
The register bytes are sent MSB first, followed by the LSB.
Terminate read operations by issuing a not-acknowledge command at the end of the last byte to be read. For a
single-byte operation, the master must leave the SDA line high during the acknowledge time of the first byte that
is read from the slave.
8.5.1.5 Timeout Function
The TMP461 device resets the serial interface if either SCL or SDA are held low for 25 ms (typical) between a
start and stop condition. If the TMP461 device is holding the bus low, the device releases the bus and waits for a
start condition. To avoid activating the timeout function, maintaining a communication speed of at least 1 kHz for
the SCL operating frequency is necessary.
8.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP461 device does not acknowledge this byte, but switches the input filters on SDA and SCL
and the output filter on SDA to operate in HS-mode, thus allowing transfers at up to 2.17 MHz. After the HSmode master code is issued, the master transmits a two-wire slave address to initiate a data transfer operation.
The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the stop
condition, the TMP461 device switches the input and output filters back to fast mode operation.
8.5.2 General-Call Reset
The TMP461 device supports reset using the two-wire general-call address 00h (0000 0000b). The TMP461
device acknowledges the general-call address and responds to the second byte. If the second byte is 06h (0000
0110b), the TMP461 device executes a software reset. This software reset restores the power-on reset state to
all TMP461 registers and aborts any conversion in progress. The TMP461 device takes no action in response to
other values in the second byte.
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8.6 Register Map
Table 4. Register Map
BIT DESCRIPTION
POINTER READ
(HEX)
POINTER WRITE
(HEX)
POR (HEX)
7
6
5
4
3
2
1
0
00
N/A
00
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
Local Temperature Register (high byte)
01
N/A
00
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
Remote Temperature Register (high byte)
02
N/A
N/A
BUSY
LHIGH
LLOW
RHIGH
RLOW
OPEN
RTHRM
LTHRM
03
09
00
MASK1
SD
ALERT/THERM2
0
0
RANGE
0
0
04
0A
08
0
0
0
0
CR3
CR2
CR1
CR0
05
0B
7F
LTHL11
LTHL10
LTHL9
LTHL8
LTHL7
LTHL6
LTHL5
LTHL4
Local Temperature High Limit Register
06
0C
80
LTLL11
LTLL10
LTLL9
LTLL8
LTLL7
LTLL6
LTLL5
LTLL4
Local Temperature Low Limit Register
07
0D
7F
RTHL11
RTHL10
RTHL9
RTHL8
RTHL7
RTHL6
RTHL5
RTHL4
Remote Temperature High Limit Register (high byte)
08
0E
80
RTLL11
RTLL10
RTLL9
RTLL8
RTLL7
RTLL6
RTLL5
RTLL4
Remote Temperature Low Limit Register (high byte)
N/A
0F
N/A
X
X
X
X
X
X
X
X
One-Shot Start Register (1)
10
N/A
00
RT3
RT2
RT1
RT0
0
0
0
0
Remote Temperature Register (low byte)
11
11
00
RTOS11
RTOS10
RTOS9
RTOS8
RTOS7
RTOS6
RTOS5
RTOS4
Remote Temperature Offset Register (high byte)
12
12
00
RTOS3
RTOS2
RTOS1
RTOS0
0
0
0
0
Remote Temperature Offset Register (low byte)
13
13
F0
RTHL3
RTHL2
RTHL1
RTHL0
0
0
0
0
Remote Temperature High Limit Register (low byte)
14
14
00
RTLL3
RTLL2
RTLL1
RTLL0
0
0
0
0
Remote Temperature Low Limit Register (low byte)
15
N/A
00
LT3
LT2
LT1
LT0
0
0
0
0
Local Temperature Register (low byte)
16
16
03
0
0
0
0
0
0
REN
LEN
19
19
7F
RTH11
RTH10
RTH9
RTH8
RTH7
RTH6
RTH5
RTH4
Remote Temperature THERM Limit Register
20
20
7F
LTH11
LTH10
LTH9
LTH8
LTH7
LTH6
LTH5
LTH4
Local Temperature THERM Limit Register
21
21
0A
HYS11
HYS10
HYS9
HYS8
HYS7
HYS6
HYS5
HYS4
THERM Hysteresis Register
22
22
01
0
0
0
0
CONAL2
CONAL1
CONAL0
1
Consecutive ALERT Register
23
23
00
NC7
NC6
NC5
NC4
NC3
NC2
NC1
NC0
η-Factor Correction Register
24
24
00
0
0
0
0
0
0
DF1
DF0
Digital Filter Control Register
FE
N/A
55
0
1
0
1
0
1
0
1
(1)
REGISTER DESCRIPTION
Status Register
Configuration Register
Conversion Rate Register
Channel Enable Register
Manufacturer Identification Register
X = undefined. Writing any value to this register initiates a one-shot start; see the One-Shot Conversion section.
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8.6.1 Register Information
The TMP461 device contains multiple registers for holding configuration information, temperature measurement
results, and status information. These registers are described in Figure 17 and Table 4.
8.6.1.1 Pointer Register
Figure 17 shows the internal register structure of the TMP461 device. The 8-bit pointer register is used to
address a given data register. The pointer register identifies which of the data registers must respond to a read
or write command on the two-wire bus. This register is set with every write command. A write command must be
issued to set the proper value in the pointer register before executing a read command. Table 4 describes the
pointer register and the internal structure of the TMP461 registers. The power-on reset (POR) value of the
pointer register is 00h (0000 0000b).
Pointer Register
Local and Remote Temperature Registers
Status Register
Configuration Register
SDA
Conversion Rate Register
Local and Remote Temperature Limit Registers
One-Shot Start Register
Remote Temperature Offset Registers
I/O
Control
Interface
Local and Remote THERM Limit Registers
THERM Hysteresis Register
Consecutive ALERT Register
N-factor Correction Register
SCL
Digital Filter Register
Manufacturer ID Register
Figure 17. Internal Register Structure
8.6.1.2 Local and Remote Temperature Registers
The TMP461 device has multiple 8-bit registers that hold temperature measurement results. The eight most
significant bits (MSBs) of the local temperature sensor result are stored in register 00h, and the four least
significant bits (LSBs) are stored in register 15h (the four MSBs of register 15h). The eight MSBs of the remote
temperature sensor result are stored in register 01h, and the four LSBs are stored in register 10h (the four MSBs
of register 10h). The four LSBs of both the local and remote sensor indicate the temperature value after the
decimal point (for example, if the temperature result is 10.0625°C, then the high byte is 0000 1010 and the low
byte is 0001 0000). These registers are read-only and are updated by the ADC each time a temperature
measurement is completed.
When the full temperature value is needed, reading the MSB value first causes the LSB value to be locked (the
ADC does not write to it) until the LSB value is read. The same thing happens upon reading the LSB value first
(the MSB value is locked until it is read). This mechanism assures that both bytes of the read operation are from
the same ADC conversion. This assurance remains valid only until another register is read. For proper operation,
read the high byte of the temperature result first. Read the low byte register in the next read command; if the
LSBs are not needed, the register can be left unread. The power-on reset value of all temperature registers is
00h.
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8.6.1.3 Status Register
The status register reports the state of the temperature ADC, the temperature limit comparators, and the
connection to the remote sensor. Table 5 lists the status register bits. The status register is read-only and is read
by accessing pointer address 02h.
Table 5. Status Register Format
STATUS REGISTER (Read = 02h, Write = N/A)
BIT NUMBER
(1)
BIT NAME
FUNCTION
7
BUSY
6
LHIGH (1)
= 1 when the ADC is converting
= 1 when the local high temperature limit is tripped
5
LLOW (1)
= 1 when the local low temperature limit is tripped
4
RHIGH
(1)
3
RLOW (1)
= 1 when the remote low temperature limit is tripped
2
OPEN (1)
= 1 when the remote sensor is an open circuit
1
RTHRM
= 1 when the remote THERM limit is tripped
0
LTHRM
= 1 when the local THERM limit is tripped
= 1 when the remote high temperature limit is tripped
These flags stay high until the status register is read or are reset by a POR when pin 7 is configured as ALERT. Only bit 2 (OPEN) stays
high until the status register is read or is reset by a POR when pin 7 is configured as THERM2.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
The LHIGH and LLOW bits indicate a local sensor overtemperature or undertemperature event, respectively. The
RHIGH and RLOW bits indicate a remote sensor overtemperature or undertemperature event, respectively. The
HIGH bit is set when the temperature exceeds the high limit in alert mode and therm mode and the low bit is set
when the temperature goes below the low limit in alert mode. The OPEN bit indicates an open-circuit condition
on the remote sensor. When pin 7 is configured as the ALERT output, the five flags are NORed together. If any
of the five flags are high, the ALERT interrupt latch is set and the ALERT output goes low. Reading the status
register clears the five flags, provided that the condition that caused the setting of the flags is not present
anymore (that is, the value of the corresponding result register is within the limits, or the remote sensor is
connected properly and functional). The ALERT interrupt latch (and the ALERT pin correspondingly) is not reset
by reading the status register. The reset is done by the master reading the temperature sensor device address to
service the interrupt, and only if the flags are reset and the condition that caused them to be set is no longer
present.
The RTHRM and LTHRM flags are set when the corresponding temperature exceeds the programmed THERM
limit. These flags are reset automatically when the temperature returns to within the limits. The THERM output
goes low in the case of overtemperature on either the local or remote channel, and goes high as soon as the
measurements are within the limits again. The THERM hysteresis register (21h) allows hysteresis to be added so
that the flag resets and the output goes high when the temperature returns to or goes below the limit value minus
the hysteresis value.
When pin 7 is configured as THERM2, only the high limits matter. The LHIGH and RHIGH flags are set if the
respective temperatures exceed the limit values, and the pin goes low to indicate the event. The LLOW and
RLOW flags have no effect on THERM2 and the output behaves the same way when configured as THERM.
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8.6.1.4 Configuration Register
The configuration register sets the temperature range, the ALERT/THERM modes, and controls the shutdown
mode. The configuration register is set by writing to pointer address 09h, and is read by reading from pointer
address 03h. Table 6 summarizes the bits of the configuration register.
Table 6. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (Read = 03h, Write = 09h, POR = 00h)
BIT NUMBER
NAME
7
MASK1
6
SD
5
ALERT/THERM2
4:3
Reserved
2
RANGE
1:0
Reserved
FUNCTION
POWER-ON RESET VALUE
0 = ALERT enabled
1 = ALERT masked
0
0 = Run
1 = Shut down
0
0 = ALERT
1 = THERM2
0
—
0
0 = –40°C to +127°C
1 = –64°C to +191°C
0
—
0
MASK1 (bit 7) of the configuration register masks the ALERT output. If MASK1 is 0 (default), the ALERT output
is enabled. If MASK1 is set to 1, the ALERT output is disabled. This configuration applies only if the value of
ALERT/THERM2 (bit 5) is 0 (that is, pin 7 is configured as the ALERT output). If pin 7 is configured as the
THERM2 output, the value of the MASK1 bit has no effect.
The shutdown bit (SD, bit 6) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP461 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP461 device stops converting when the current conversion sequence is complete and enters a shutdown
mode. When SD is set to 0 again, the TMP461 resumes continuous conversions. When SD = 1, a single
conversion can be started by writing to the one-shot start register; see the One-Shot Start Register section for
more information.
ALERT/THERM2 (bit 5) sets the configuration of pin 7. If the ALERT/THERM2 bit is 0 (default), then pin 7 is
configured as the ALERT output; if this bit is set to 1, then pin 7 is configured as the THERM2 output.
The temperature range is set by configuring RANGE (bit 2) of the configuration register. Setting this bit low
(default) configures the TMP461 device for the standard measurement range (–40°C to +127°C); temperature
conversions are stored in the standard binary format. Setting bit 2 high configures the TMP461 device for the
extended measurement range (–64°C to +191°C); temperature conversions are stored in the extended binary
format (see Table 1).
The remaining bits of the configuration register are reserved and must always be set to 0. The power-on reset
value for this register is 00h.
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8.6.1.5 Conversion Rate Register
The conversion rate register (read address 04h, write address 0Ah) controls the rate at which temperature
conversions are performed. This register adjusts the idle time between conversions but not the conversion time
itself, thereby allowing the TMP461 power dissipation to be balanced with the temperature register update rate.
Table 7 lists the conversion rate options and corresponding time between conversions. The default value of the
register is 08h, which gives a default rate of 16 conversions per second.
Table 7. Conversion Rate
VALUE
CONVERSIONS PER SECOND
TIME (Seconds)
00h
0.0625
16
01h
0.125
8
02h
0.25
4
03h
0.5
2
04h
1
1
05h
2
0.5
06h
4
0.25
07h
8
0.125
08h
16 (default)
0.0625 (default)
09h
32
0.03125
8.6.1.6 One-Shot Start Register
When the TMP461 device is in shutdown mode (SD = 1 in the configuration register), a single conversion is
started by writing any value to the one-shot start register, pointer address 0Fh. This write operation starts one
conversion and comparison cycle on either both the local and remote sensors or on only one or the other sensor,
depending on the LEN and REN values configured in the channel enable register (read address 16h, write
address 16h). The TMP461 device returns to shutdown mode when the cycle completes. The value of the data
sent in the write command is irrelevant and is not stored by the TMP461 device.
8.6.1.7 Channel Enable Register
The channel enable register (read address 16h, write address 16h) enables or disables the temperature
conversion of remote and local temperature sensors. LEN (bit 0) of the channel enable register enables/disables
the conversion of local temperature. REN (bit 1) of the channel enable register enables/disables the conversion
of remote temperature. Both LEN and REN are set to 1 (default), this enables the ADC to convert both local and
remote temperatures. If LEN is set to 0, the local temperature conversion is disabled and similarly if REN is set
to 0, the remote temperature conversion is disabled.
Both local and remote temperatures are converted by the internal ADC as a default mode. Channel Enable
register can be configured to achieve power savings by reducing the total ADC conversion time to half for
applications that do not require both remote and local temperature information.
8.6.1.8 Consecutive ALERT Register
The Consecutive ALERT register (read address 22h, write address 22h) controls the number of out-of-limit
temperature measurements required for ALERT to be asserted. Table 8 summarizes the values of the
consecutive ALERT register. The number programmed in the consecutive ALERT applies to both the remote and
local temperature results. When the number of times that the temperature result consecutively exceeds the high
limit register value is equal to the value programmed in the consecutive ALERT register, ALERT is asserted.
Similarly, the consecutive ALERT register setting is also applicable to the low-limit register.
Table 8. Consecutive ALERT
REGISTER VALUE
NUMBER OF OUT-OF-LIMIT MEASUREMENTS REQUIRED TO ASSERT ALERT
01h
1 (default)
03h
2
07h
3
0Fh
4
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8.6.1.9 η-Factor Correction Register
The TMP461 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature. The remote channel uses sequential current excitation to extract a differential VBE voltage
measurement to determine the temperature of the remote transistor. Equation 1 shows this voltage and
temperature.
VBE2 - VBE1 =
hkT
I
ln 2
q
I1
(1)
The value η in Equation 1 is a characteristic of the particular transistor used for the remote channel. The poweron reset value for the TMP461 device is η = 1.008. The value in the η-factor correction register can be used to
adjust the effective η-factor according to Equation 2 and Equation 3.
eff
§ 1.008 u 2088 ·
¨
¸
© 2088 NADJUST ¹
NADJUST
§ 1.008 u 2088 ·
¨
¸
eff
©
¹
(2)
2088
(3)
The η-factor correction value must be stored in twos complement format, yielding an effective data range from
–128 to 127. The η-factor correction value is written to and read from pointer address 23h. The register power-on
reset value is 00h, thus having no effect unless a different value is written to it. The resolution of the η-factor
register is 0.000483.
Table 9. η-Factor Range
NADJUST
BINARY
HEX
DECIMAL
η
0111 1111
7F
127
0.950205
0000 1010
0A
10
1.003195
0000 1000
08
8
1.004153
0000 0110
06
6
1.005112
0000 0100
04
4
1.006073
0000 0010
02
2
1.007035
0000 0001
01
1
1.007517
0000 0000
00
0
1.008
1111 1111
FF
–1
1.008483
1111 1110
FE
–2
1.008966
1111 1100
FC
–4
1.009935
1111 1010
FA
–6
1.010905
1111 1000
F8
–8
1.011877
1111 0110
F6
–10
1.012851
1000 0000
80
–128
1.073829
8.6.1.10 Remote Temperature Offset Register
The offset register allows the TMP461 device to store any system offset compensation value that may result from
precision calibration. The value in the register is stored in the same format as the temperature result, and is
added to the remote temperature result upon every conversion. Combined with the η-factor correction, this
function allows for very accurate system calibration over the entire temperature range.
8.6.1.11 Manufacturer Identification Register
The TMP461 device allows for the two-wire bus controller to query the device for manufacturer and device IDs to
enable software identification of the device at the particular two-wire bus address. The manufacturer ID is
obtained by reading from pointer address FEh. The TMP461 device reads 55h for the manufacturer code.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TMP461 device requires only a transistor connected between the D+ and D– pins for remote temperature
measurement. Tie the D+ pin to GND if the remote channel is not used and only the local temperature is
measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup
resistors as part of the communication bus. A 0.1-µF power-supply decoupling capacitor is recommended for
local bypassing. Figure 18 and Figure 19 illustrate the typical configurations for the TMP461 device.
9.2 Typical Application
1.7V to 3.6V
RS(2)
10k
(typ)
0.1µF
CDIFF(3)
RS(2)
10k
(typ)
10k
(typ)
10k
(typ)
10
A1
Diode-connected configuration(1)
1
9
V+
SCL
D+
SDA
Series Resistance
RS(2)
RS(2)
2
8
CDIFF(3)
SMBus
Controller
TMP461
3
ALERT /
THERM2
D4
Transistor-connected configuration(1)
7
6
GND
THERM
A0
5
Over-Temperature Shutdown
(1)
The diode-connected configuration provides better settling time. The transistor-connected configuration provides
better series resistance cancellation.
(2)
RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, Dpins. RS selection depends on the application; see the Filtering section.
(3)
CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see the Filtering
section and Figure 6 (Remote Temperature Error vs Differential Capacitance).
Figure 18. TMP461 Basic Connections Using a Discrete Remote Transistor
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Typical Application (continued)
1.7 V to 3.6 V
1.7 V to 3.6 V
10
A1
Processor or ASIC
1
9
SCL
V+
2
Built-In Thermal
Transistor, Diode
3
8
D+
TMP461
D-
ALERT/THERM2
4
SDA
GND
THERM
7
SMBus
Controller
6
A0
5
Overtemperature Shutdown
Figure 19. TMP461 Basic Connections Using a Processor Built-In Remote Transistor
9.2.1 Design Requirements
The TMP461 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips and application-specific integrated circuits (ASICs). Either NPN or PNP transistors can be used,
as long as the base-emitter junction is used as the remote temperature sense. NPN transistors must be diodeconnected. PNP transistors can either be transistor- or diode-connected (see Figure 18).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor and current
excitation used by the TMP461 device versus the manufacturer-specified operating current for a given transistor.
Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate transistors.
The TMP461 device uses 7.5 μA for ILOW and 120 μA for IHIGH.
The ideality factor (η) is a measured characteristic of a remote temperature sensor diode as compared to an
ideal diode. The TMP461 allows for different η-factor values; see the η-Factor Correction Register section.
The ideality factor for the TMP461 device is trimmed to be 1.008. For transistors that have an ideality factor that
does not match the TMP461, Equation 4 can be used to calculate the temperature error.
NOTE
For Equation 4 to be used correctly, the actual temperature (°C) must be converted to
Kelvin (K).
TERR =
h - 1.008
´ (273.15 + T(°C))
1.008
where
•
•
•
TERR = error in the TMP461 device because η ≠ 1.008,
η = ideality factor of the remote temperature sensor,
T(°C) = actual temperature, and
(4)
In Equation 4, the degree of delta is the same for °C and K.
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Typical Application (continued)
For η = 1.004 and T(°C) = 100°C:
§ 1.004 1.008 ·
TERR = ¨
¸ u 273.15
1.008
©
¹
TERR
1.48qC
100qC
(5)
If a discrete transistor is used as the remote temperature sensor with the TMP461, the best accuracy can be
achieved by selecting the transistor according to the following criteria:
1. Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
2. Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
3. Base resistance is < 100 Ω.
4. Tight control of VBE characteristics indicated by small variations in hFE (that is, 50 to 150).
Based on this criteria, two recommended small-signal transistors are the 2N3904 (NPN) or 2N3906 (PNP).
9.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP461 device monitors the ambient air around the device. The thermal
time constant for the TMP461 device is approximately two seconds. This constant implies that if the ambient air
changes quickly by 100°C, then the TMP461 device takes approximately 10 seconds (that is, five thermal time
constants) to settle to within 1°C of the final value. In most applications, the TMP461 package is in electrical, and
therefore thermal, contact with the printed circuit board (PCB), as well as subjected to forced airflow. The
accuracy of the measured temperature directly depends on how accurately the PCB and forced airflow
temperatures represent the temperature that the TMP461 is measuring. Additionally, the internal power
dissipation of the TMP461 can cause the temperature to rise above the ambient or PCB temperature. The
internal power dissipated as a result of exciting the remote temperature sensor is negligible because of the small
currents used. Equation 6 can be used to calculate the average conversion current for power dissipation and
self-heating based on the number of conversions per second and temperature sensor channel enabled.
Equation 7 shows an example with local and remote sensor channels enabled and 16 conversions per second;
see the Electrical Characteristics table for typical values required for these calculations. For a 3.3-V supply and a
conversion rate of 16 conversions per second, the TMP461 device dissipates 0.531 mW (PDIQ = 3.3 V × 161 μA)
when both the remote and local channels are enabled.
Average Conversion Current
Local ADC Conversion Time ˜ Conversions per Second ˜ Local Active IQ
Remote ADC Conversion Time ˜ Conversions per Second ˜ Remote Active IQ
Standby Mode IQ ˜ ª¬1
Local ADC Conversion Time
Remote ADC Conversion Time ˜ Conversions per Second º¼
(6)
Average Conversion Current
§ 16 ·
15 ms ¨ ¸ ˜ 240 $
© s ¹
§ 16 ·
15 ms ˜ ¨ ¸ ˜ 400 $
© s ¹
ª
§ 16 · º
15 $ ˜ «
PV
PV ˜ ¨ ¸ »
© s ¹¼
¬
161 $
(7)
The temperature measurement accuracy of the TMP461 device depends on the remote and local temperature
sensor being at the same temperature as the system point being monitored. If the temperature sensor is not in
good thermal contact with the part of the system being monitored, then there is a delay between the sensor
response and the system changing temperature. This delay is usually not a concern for remote temperaturesensing applications that use a substrate transistor (or a small, SOT23 transistor) placed close to the device
being monitored.
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Typical Application (continued)
9.2.3 Application Curve
Figure 20 shows the typical step response to submerging a sensor in an oil bath with a temperature of 100°C.
100
Temperature (qC)
85
70
55
40
25
-1
1
3
5
7
9
11
Time (s)
13
15
17
19
Figure 20. Temperature Step Response
10 Power Supply Recommendations
The TMP461 device operates with a power-supply range of 1.7 V to 3.6 V. The device is optimized for operation
at a 3.3-V supply but can measure temperature accurately in the full supply range.
A power-supply bypass capacitor is recommended. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
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11 Layout
11.1 Layout Guidelines
Remote temperature sensing on the TMP461 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP461 have high digital
content, with several clocks and logic-level transitions that create a noisy environment. Layout must adhere to
the following guidelines:
1. Place the TMP461 device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in Figure 21. If a multilayer PCB is used, bury these traces between the
ground or V+ planes to shield them from extrinsic noise sources. 5-mil (0.127 mm) PCB traces are
recommended.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP461 device. For optimum
measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP461
device.
5. If the connection between the remote temperature sensor and the TMP461 device is less than 8-in
(20.32 cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded
pair with the shield grounded as close to the TMP461 device as possible. Leave the remote sensor
connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP461 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
Figure 21. Suggested PCB Layer Cross-Section
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11.2 Layout Example
VIA to Power or Ground Plane
VIA to Internal Layer
Pullup Resistors
Ground Plane
Supply Voltage
Supply Bypass
Capacitor
RS
1
V+
2
3
10
A1
SCL
9
D+
SDA
8
D-
ALERT /
THERM2
7
CDIFF
RS
A0
4 THERM 5
Thermal
Shutdown
GND 6
Serial Bus Traces
Figure 22. TMP461 Layout Example
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMP461AIRUNR-S
ACTIVE
QFN
RUN
10
3000
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
ZDW1
TMP461AIRUNT-S
ACTIVE
QFN
RUN
10
250
RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
ZDW1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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