Order
Now
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
TMP468 9-Channel (8-Remote and 1-Local), High-Accuracy Temperature Sensor
1 Features
3 Description
•
The TMP468 device is a multi-zone, high-accuracy,
low-power temperature sensor using a two-wire,
SMBus or I2C compatible interface. Up to eight
remote diode-connected temperature zones can be
monitored simultaneously in addition to the local
temperature.
Aggregating
the
temperature
measurements across a system allows improved
performance through tighter guard bands and can
reduce board complexity. A typical use case is for
monitoring the temperature across different
processors, such as MCUs, GPUs, and FPGAs in
complex
systems
such
as
servers
and
telecommunications equipment. Advanced features
such as series resistance cancellation, programmable
non-ideality factor, programmable offset, and
programmable temperature limits are included to
provide a robust thermal monitoring solution with
improved accuracy and noise immunity.
1
•
•
•
•
•
•
•
•
•
•
8-Channel Remote Diode Temperature Sensor
Accuracy: ±0.75°C (Maximum)
Local and Remote Diode Accuracy: ±0.75°C
(Maximum)
Local Temperature Sensor Accuracy for the
DSBGA Package: ±0.35°C (Maximum)
Temperature Resolution: 0.0625°C
Supply and Logic Voltage Range: 1.7 V to 3.6 V
67-µA Operating Current (1 SPS, All Channels
Active)
0.3-µA Shutdown Current
Remote Diode: Series Resistance Cancellation,
η-Factor Correction, Offset Correction, and Diode
Fault Detection
Register Lock Function Secures Key Registers
I2C or SMBus™ Compatible Two-Wire Interface
With Pin-Programmable Address
16-Bump DSBGA and 16-Pin VQFN Packages
Each of the eight remote channels (and the local
channel) can be programmed independently with two
thresholds that are triggered when the corresponding
temperature is exceeded at the measured location. In
addition, there is a programmable hysteresis setting
to avoid constant toggling around the threshold.
2 Applications
•
•
•
•
•
•
•
•
MCU, GPU, ASIC, FPGA, DSP, and CPU
Temperature Monitoring
Telecommunication Equipment
Servers and Personal Computers
Cloud Ethernet Switches
Secure Data Centers
Highly Integrated Medical Systems
Precision Instruments and Test Equipment
LED Lighting Thermal Control
The TMP468 device provides high accuracy (0.75°C)
and high resolution (0.0625°C) measurement
capabilities. The device supports low voltage rails
(1.7 V to 3.6 V), common two-wire interfaces, and is
available in a small, space efficient package (3 mm ×
3 mm or 1.6 mm × 1.6 mm) for easy integration into
computing systems. The remote junction supports a
temperature range from –55°C to +150°C.
Device Information(1)
PART NUMBER
TMP468
PACKAGE
BODY SIZE (NOM)
DSBGA (16)
1.60 mm × 1.60 mm
VQFN (16)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
Remote
Remote
Remote
Zone 4
Zone 3
Zone 2
Remote
1.7 V to 3.6 V
Zone 1
CBYPASS
RS1 RS2
CDIFF
RS1
RS2
CDIFF
RS1
RS2
CDIFF
RS1
RS2
D3
V+
CDIFF
A1
B1
C1
D1
A3
A2
B2
C2
D2
CDIFF
1
CDIFF
CDIFF
CDIFF
RS1 RS2
RS1 RS2
RS1 RS2
RS1 RS2
Remote
Remote
Remote
Remote
Zone 5
Zone 6
Zone 7
Zone 8
RSCL RSDA RT2 RT
2-Wire Interface
SMBus / I2C
Compatible
Controller
D1+ TMP468 SCL D4
D2+
C4
D3+
SDA
D4+
C3
DTHERM2
D5+
B3
D6+
THERM
D7+
Local
ADD B4
D8+
Overtemperature
Shutdown
Zone 9
GND
A4
Copyright © 2016, Texas Instruments Incorporated
See the Design Requirements section for remote diode recommendations.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
5
6
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Two-Wire Timing Requirements ...............................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
7.5 Programming........................................................... 13
7.6 Register Maps ......................................................... 19
8
Application and Implementation ........................ 29
8.1 Application Information............................................ 29
8.2 Typical Application .................................................. 30
9 Power Supply Recommendations...................... 33
10 Layout................................................................... 34
10.1 Layout Guidelines ................................................. 34
10.2 Layout Example .................................................... 35
11 Device and Documentation Support ................. 37
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
37
37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (March 2017) to Revision B
•
Page
Updated packaging information ........................................................................................................................................... 37
Changes from Original (November 2016) to Revision A
Page
•
Added 16-pin VQFN package version throughout data sheet................................................................................................ 1
•
Deleted Description (cont.) section and moved text to Description section .......................................................................... 1
•
Added VQFN package and body size information to Device Information table .................................................................... 1
•
Added copyright statement to Typical Application Schematic................................................................................................ 1
•
Added RGT (VQFN) pinout diagram in the Pin Configuration and Functions section .......................................................... 4
•
Added remote junction temperature parameter and values to Recommended Operating Conditions table ......................... 5
•
Changed formatting of Thermal Information table note ......................................................................................................... 5
•
Changed TMP468 Thermal Information table package from "RGT (QFN)" to "RGT (VQFN)" .............................................. 5
•
Updated formatting of Two-Wire Timing Requirements table ............................................................................................... 7
•
Changed Timing Requirements table note parameter from tVD;DATA to tVD;DAT ........................................................................ 7
•
Added 2017 copyright to Functional Block Diagram ........................................................................................................... 10
•
Changed table headers in Continuous Conversion Times table ......................................................................................... 26
•
Added 2017 copyright to Typical Application schematic in Application Information section ................................................ 30
•
Changed η-factor setting from 1.003674 to 1.0067 in Figure 23 table note in Typical Application section ......................... 30
•
Changed conversion rate from 16 conversions/second to 1 conversion/second in the Detailed Design Procedure
section .................................................................................................................................................................................. 32
•
Changed units of Equation 7 from "µs" to "µA" .................................................................................................................... 32
2
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
5 Pin Configuration and Functions
TMP468 YFF Package
16-Pin DSBGA
Bottom View
D4+
(D1)
D8+
(D2)
V+
(D3)
SCL
(D4)
D3+
(C1)
D7+
(C2)
THERM2
(C3)
SDA
(C4)
D2+
(B1)
D6+
(B2)
THERM
(B3)
ADD
(B4)
D1+
(A1)
D5+
(A2)
D(A3)
GND
(A4)
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
ADD
B4
Digital input
Address select. Connect to GND, V+, SDA, or SCL.
D1+
A1
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D2+
B1
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D3+
C1
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D4+
D1
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D5+
A2
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D6+
B2
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D7+
C2
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D8+
D2
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are supported. An
unused channel must be connected to D–.
D–
A3
Analog input
Negative connection to remote temperature sensors. Common for 8 remote channels.
GND
A4
Ground
SCL
D4
Digital input
SDA
C4
THERM
B3
Digital output
Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily
V+. If this pin is not used it may be left open or grounded.
THERM2
C3
Digital output
Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not necessarily
V+. If this pin is not used it may be left open or grounded.
V+
D3
Power supply
Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
Supply ground connection
Serial clock line for I2C- or SMBus compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven by an
open-drain output.
Bidirectional digital Serial data line for I2C or SMBus compatible two-wire interface. Open-drain; requires a pullup resistor
input/output
to a voltage between 1.7 V and 3.6 V, not necessarily V+.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
3
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
12
SDA
11
THERM2
10
THERM
D7+
D8+
V+
SCL
15
14
13
9
8
4
GND
D3+
Pad
7
3
D±
D4+
Thermal
6
2
D1+
D5+
5
1
D2+
D6+
16
TMP468 RGT Package
16-Pin VQFN
Top View
ADD
Not to scale
NC - No internal connection
Pin Functions
PIN
NAME
I/O
NO.
DESCRIPTION
ADD
9
Digital input
Address select. Connect to GND, V+, SDA, or SCL.
D1+
6
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D2+
5
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D3+
4
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D4+
3
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D5+
2
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D6+
1
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D7+
16
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D8+
15
Analog input
Positive connection to remote temperature sensors. A total of 8 remote channels are
supported. An unused channel must be connected to D–.
D–
7
Analog input
Negative connection to remote temperature sensors. Common for 8 remote channels.
GND
8
Ground
SCL
13
Digital input
SDA
12
THERM
10
Digital output
Thermal shutdown or fan-control pin.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
THERM2
11
Digital output
Second THERM output.
Active low; open-drain; requires a pullup resistor to a voltage between 1.7 V and 3.6 V, not
necessarily V+. If this pin is not used it may be left open or grounded.
V+
14
Power supply
Positive supply voltage, 1.7 V to 3.6 V; requires 0.1-µF bypass capacitor to ground.
4
Supply ground connection
Serial clock line for I2C or SMBus-compatible two-wire interface.
Requires a pullup resistor to a voltage between 1.7 V and 3.6 V (not necessarily V+) if driven
by an open-drain output.
Bidirectional digital Serial data line for I2C- or SMBus-compatible two-wire interface. Open-drain; requires a pullup
input/output
resistor to a voltage between 1.7 V and 3.6 V, not necessarily V+.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Power supply
Input voltage
Input current
MIN
MAX
UNIT
V+
–0.3
6
V
THERM, THERM2, SDA, SCL, and ADD only
–0.3
6
D1+ through D8+
–0.3
((V+) + 0.3)
and ≤ 6
D– only
–0.3
0.3
SDA sink
–25
All other pins
–10
10
–55
150
°C
150
°C
150
°C
Operating temperature
Junction temperature (TJ, maximum)
Storage temperature, Tstg
(1)
–60
V
mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged device model (CDM), JEDEC specification JESD22-C101 (2)
±750
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V+
Supply voltage
1.7
3.6
V
TA
Operating free-air temperature
–40
125
°C
TD
Remote junction temperature
–55
150
°C
6.4 Thermal Information
TMP468
THERMAL METRIC
(1)
RGT (VQFN)
YFF (DSBGA)
16 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
46
76
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
43
0.7
°C/W
RθJB
Junction-to-board thermal resistance
17
13
°C/W
ψJT
Junction-to-top characterization parameter
0.8
0.4
°C/W
ψJB
Junction-to-board characterization parameter
5
13
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
5
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
6.5 Electrical Characteristics
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
–0.35
±0.125
0.35
°C
–0.75
±0.125
0.75
°C
–1
±0.5
1
°C
–0.75
±0.125
0.75
TEMPERATURE MEASUREMENT
TA = 20°C to 30°C, V+ = 1.7 V to 2 V (DSBGA)
TLOCAL
Local temperature sensor accuracy
TA = –40°C to 125°C, V+ = 1.7 V to 2 V (DSBGA)
TA = –40°C to 100°C, V+ = 1.7 V to 3.6 V (VQFN)
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V
(DSBGA):
TA = –10°C to 50°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
TREMOTE
Remote temperature sensor accuracy
(VQFN):
TA = –10°C to 85°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
°C
TA = –40°C to 125°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V
–1
±0.5
1
Local temperature error supply sensitivity
V+ = 1.7 V to 3.6 V
–0.15
±0.05
0.15
°C/V
Remote temperature error supply sensitivity
V+ = 1.7 V to 3.6 V
–0.25
±0.1
0.25
°C/V
Temperature resolution
(local and remote)
ADC conversion time
0.0625
One-shot mode, per channel (local or remote)
16
ADC resolution
Medium
ms
Bits
120
Series resistance 1 kΩ (maximum)
45
Low
η
17
13
High
Remote sensor
source current
°C
µA
7.5
Remote transistor ideality factor
1.008
SERIAL INTERFACE (SCL, SDA)
VIH
High-level input voltage
VIL
Low-level input voltage
0.7 × (V+)
Hysteresis
200
SDA output-low sink current
VOL
Low-level output voltage
Serial bus input leakage current
V
0.3 × (V+)
20
IO = –20 mA, V+ ≥ 2 V
mA
0.15
IO = –15 mA, V+ < 2 V
0 V ≤ VIN ≤ 3.6 V
–1
Serial bus input capacitance
V
mV
0.4
V
0.2 × V+
V
1
μA
4
pF
DIGITAL INPUTS (ADD)
VIH
High-level input voltage
0.7 × (V+)
VIL
Low-level input voltage
–0.3
0.3 × (V+)
V
–1
1
μA
Input leakage current
0 V ≤ VIN ≤ 3.6 V
Input capacitance
V
4
pF
DIGITAL OUTPUTS (THERM, THERM2)
Output-low sink current
VOL = 0.4 V
VOL
Low-level output voltage
IO = –6 mA
IOH
High-level output leakage current
VO = V+
6
mA
0.15
0.4
V
1
μA
3.6
V
POWER SUPPLY
V+
IQ
Specified supply voltage range
Quiescent current
POR
Power-on-reset threshold
POH
Power-on-reset hysteresis
6
1.7
Active conversion, local sensor
240
375
Active conversion, remote sensors
400
600
15
21
Shutdown mode, serial bus inactive
0.3
4
Shutdown mode, serial bus active, fS = 400 kHz
120
Shutdown mode, serial bus active, fS = 2.56 MHz
300
Rising edge
1.5
1.65
1.2
1.35
Standby mode (between conversions)
Falling edge
1
0.2
Submit Documentation Feedback
µA
µA
µA
V
V
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
6.6 Two-Wire Timing Requirements
at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
The master and the slave have the same V+ value. Values are based on statistical analysis of samples tested during initial
release.
MIN
MAX
UNIT
Fast mode
0.001
0.4
High-speed mode
0.001
2.56
Bus free time between stop and start
condition
Fast mode
1300
High-speed mode
160
tHD;STA
Hold time after repeated start condition.
After this period, the first clock is generated.
Fast mode
600
High-speed mode
160
tSU;STA
Repeated start condition setup time
Fast mode
600
High-speed mode
160
tSU;STO
Stop condition setup time
Fast mode
600
High-speed mode
160
tHD;DAT
Data hold time when SDA
tVD;DAT
Data valid time (2)
tSU;DAT
Data setup time
tLOW
SCL clock low period
tHIGH
SCL clock high period
tF – SDA
Data fall time
tF, tR – SCL
Clock fall and rise time
tR
Rise time for SCL ≤ 100 kHz
fSCL
SCL operating frequency
tBUF
ns
ns
ns
0
High-speed mode
0
130
0
900
—
—
High-speed mode
Fast mode
(1)
100
High-speed mode
1300
High-speed mode
250
Fast mode
600
High-speed mode
Fast mode
ns
ns
ns
20
Fast mode
ns
ns
60
20 × (V+ / 5.5)
300
High-speed mode
100
Fast mode
300
High-speed mode
40
Fast mode
1000
High-speed mode
Serial bus timeout
(1)
(2)
ns
Fast mode
Fast mode
MHz
Fast mode
15
20
High-speed mode
15
20
ns
ns
ns
ms
The maximum tHD;DAT can be 0.9 µs for fast mode, and is less than the maximum tVD;DAT by a transition time.
tVD;DAT = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse).
tr
t(LOW)
tf
VIH
SCL
VIL
t(BUF)
t(SU:STA)
t(HIGH)
t(HD:STA)
t(SU:STO)
t(SU:DAT)
t(HD:DAT)
VIH
SDA
VIL
P
S
S
P
Figure 1. Two-Wire Timing Diagram
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
7
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
6.7 Typical Characteristics
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
1.5
1.5
Max Limit
Max Limit
Local Temperature Error (qC)
1
Local Temperature Error (qC)
Average + 3V
0.5
Typical Units
0
-0.5
-1
Average - 3V
Min Limit
-1.5
-40
-20
0
20
40
60
80
Ambient Temperature (qC)
100
-0.5
-1
Average - 3V
-20
0
20
40
60
80
Ambient Temperature (qC)
100
120
Typical behavior of 75 VQFN devices over temperature at V+ =
1.8 V
Figure 3. Local Temperature Error vs Ambient Temperature
1.5
Average + 3V
Max Limit
Remote Temperature Error (qC)
Max Limit
Remote Temperature Error (°C)
Typical Units
D001
1.5
1
0.5
Typical Units
0
-0.5
-1
Min Limit
-25
0
25
50
75
Device Junction Temperature (°C)
100
0.5
Typical Units
0
-0.5
-1
Min Limit
-1.5
-50
125
D003
Average + 3V
1
Average - 3V
Typical behavior of 30 DSBGA devices over temperature at V+ =
1.8 V with the remote diode junction at 150°C.
-25
Average - 3V
0
25
50
75
Device Junction Temperature (qC)
100
125
Typical behavior of 75 VQFN devices over temperature at V+ =
1.8 V with the remote diode junction at 150°C.
Figure 5. Remote Temperature Error vs Device Junction
Temperature
Figure 4. Remote Temperature Error vs Device Junction
Temperature
1
40
0.8
0.6
Max Limit
Average + 3V
0.4
0.2
0
Typical Units
-0.2
-0.4
Min Limit
-0.6
Average - 3V
-0.8
Remote Temperature Error (qC)
Remote Error Power Supply Sensitivity (°C/V)
0
-1.5
-40
120
Figure 2. Local Temperature Error vs Ambient Temperature
-1
-40
0.5
Min Limit
Typical behavior of 95 DSBGA devices over temperature at V+ =
1.8 V
-1.5
-50
Average + 3V
1
D+ to V+
D+ to GND
30
20
10
0
-10
-20
-30
-40
-20
40
60
80
0
20
Device Junction Temperature (°C)
100
120
1
10
Leakage Resistance (M:)
100
Typical behavior of 30 devices over temperature with V+ from 1.8
V to 3.6 V
Figure 6. Remote Temperature Error Power Supply
Sensitivity vs Device Junction Temperature
8
Figure 7. Remote Temperature Error vs Leakage Resistance
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Typical Characteristics (continued)
at TA = 25°C and V+ = 3.6 V (unless otherwise noted)
0.5
0
Remote Temperature Error (qC)
Remote Temperature Error (qC)
V+ = 1.8 V
V+ = 3.6 V
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
-5
-10
-15
-20
-25
-30
-35
-40
0
500
1000 1500 2000 2500 3000 3500 4000 4500
Series Resistance (:)
No physical capacitance during measurement
0
4
6
8
10
12
14
Differential Capacitance (nF)
16
18
20
No physical series resistance on D+, D– pins during measurement
Figure 8. Remote Temperature Error vs Series Resistance
Figure 9. Remote Temperature Error vs
Differential Capacitance
400
360
2
800
V+ = 1.8 V
V+ = 3.6 V
700
V+ = 1.8 V
V+ = 3.6 V
600
280
V+ Current (PA)
Supply Current (PA)
320
240
200
160
120
500
400
300
200
80
100
40
0
0.05 0.1
1
10
Conversion Rate (Hz)
0
1k
100
10k
100k
Frequency (Hz)
1M
10M
16 samples per second (default mode)
Figure 10. Quiescent Current vs Conversion Rate °
1
390
0.9
Shutdown Supply Current (PA)
400
380
V+ Current (PA)
Figure 11. Shutdown Quiescent Current
vs SCL Clock Frequency
370
360
350
340
330
320
310
300
1.5
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2
2.5
3
V+ Voltage (V)
3.5
4
Figure 12. Quiescent Current vs Supply Voltage
(at Default Conversion Rate of 16 Conversions Per Second)
0
1.5
2
2.5
3
V+ Voltage (V)
3.5
4
Figure 13. Shutdown Quiescent Current vs Supply Voltage
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
9
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
7 Detailed Description
7.1 Overview
The TMP468 device is a digital temperature sensor that combines a local temperature measurement channel
and eight remote-junction temperature measurement channels in VQFN-16 or DSBGA-16 packages. The device
has a two-wire-interface that is compatible with I2C or SMBus interfaces and includes four pin-programmable bus
address options. The TMP468 is specified over a local device temperature range from –40°C to +125°C. The
TMP468 device also contains multiple registers for programming and holding configuration settings, temperature
limits, and temperature measurement results. The TMP468 pinout includes THERM and THERM2 outputs that
signal overtemperature events based on the settings of temperature limit registers.
7.2 Functional Block Diagram
V+
ADD
SCL
Serial
Interface
SDA
Register
Bank
THERM
Oscillator
Local
Thermal
BJT
Control
Logic
16 × I
D1+
D2+
6×I
MUX
D3+
D4+
V+
I
THERM2
Voltage
Reference
MUX
D5+
D6+
ADC
D7+
D8+
D-
GND
10
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
7.3 Feature Description
7.3.1 Temperature Measurement Data
The local and remote temperature sensors have a resolution of 13 bits (0.0625°C). Temperature data that result
from conversions within the default measurement range are represented in binary form, as shown in the
Standard Binary column of Table 1. Negative numbers are represented in two's-complement format. The
resolution of the temperature registers extends to 255.9375°C and down to –256°C, but the actual device is
limited to ranges as specified in the Electrical Characteristics table to meet the accuracy specifications. The
TMP468 device is specified for ambient temperatures ranging from –40°C to +125°C; parameters in the Absolute
Maximum Ratings table must be observed to prevent damage to the device.
Table 1. Temperature Data Format (Local and Remote Temperature)
TEMPERATURE
(°C)
(1)
LOCAL OR REMOTE TEMPERATURE REGISTER VALUE
(0.0625°C RESOLUTION)
STANDARD BINARY (1)
BINARY
HEX
–64
1110 0000 0000 0000
E0 00
–50
1110 0111 0000 0000
E7 00
–25
1111 0011 1000 0000
F3 80
–0.1250
1111 1111 1111 0000
FF F0
–0.0625
1111 1111 1111 1000
FF F8
0
0000 0000 0000 0000
00 00
0.0625
0000 0000 0000 1000
00 08
0.1250
0000 0000 0001 0000
00 10
0.1875
0000 0000 0001 1000
00 18
0.2500
0000 0000 0010 0000
00 20
0.3125
0000 0000 0010 1000
00 28
0.3750
0000 0000 0011 0000
00 30
0.4375
0000 0000 0011 1000
00 38
0.5000
0000 0000 0100 0000
00 40
0.5625
0000 0000 0100 1000
00 48
0.6250
0000 0000 0101 0000
00 50
0.6875
0000 0000 0101 1000
00 58
0.7500
0000 0000 0110 0000
00 60
0.8125
0000 0000 0110 1000
00 68
0.8750
0000 0000 0111 0000
00 70
0.9375
0000 0000 0111 1000
00 78
1
0000 0000 1000 0000
00 80
5
0000 0010 1000 0000
02 80
10
0000 0101 0000 0000
05 00
25
0000 1100 1000 0000
0C 80
50
0001 1001 0000 0000
19 00
75
0010 0101 1000 0000
25 80
100
0011 0010 0000 0000
32 00
125
0011 1110 1000 0000
3E 80
127
0011 1111 1000 0000
3F 80
150
0100 1011 0000 0000
4B 00
175
0101 0111 1000 0000
57 80
191
0101 1111 1000 0000
5F 80
Resolution is 0.0625°C per count. Negative numbers are represented in two's-complement format.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
11
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Both local and remote temperature data use two bytes for data storage with a two's-complement format for
negative numbers. The high byte stores the temperature with 2°C resolution. The second or low byte stores the
decimal fraction value of the temperature and allows a higher measurement resolution, as shown in Table 1. The
measurement resolution for both the local and the remote channels is 0.0625°C.
7.3.2 Series Resistance Cancellation
Series resistance cancellation automatically eliminates the temperature error caused by the resistance of the
routing to the remote transistor or by the resistors of the optional external low-pass filter. A total up to 1-kΩ series
resistance can be cancelled by the TMP468 device, which eliminates the need for additional characterization and
temperature offset correction. See Figure 8 for details on the effects of series resistance on sensed remote
temperature error.
7.3.3 Differential Input Capacitance
The TMP468 device tolerates differential input capacitance of up to 1000 pF with minimal change in temperature
error. The effect of capacitance on the sensed remote temperature error is illustrated in Figure 9.
7.3.4 Sensor Fault
The TMP468 device can sense a fault at the D+ resulting from an incorrect diode connection. The TMP468
device can also sense an open circuit. Short-circuit conditions return a value of –256°C. The detection circuitry
consists of a voltage comparator that trips when the voltage at D+ exceeds (V+) – 0.3 V (typical). The
comparator output is continuously checked during a conversion. If a fault is detected, then the RxOP bit in the
Remote Channel Status register is set to 1.
When not using the remote sensor with the TMP468 device, the corresponding D+ and D– inputs must be
connected together to prevent meaningless fault warnings.
7.3.5
THERM Functions
Operation of the THERM (pin B3) and THERM2 (pin C3) interrupt pins are shown in Figure 14.
The hysteresis value is stored in the THERM Hysteresis register and applies to both the THERM and THERM2
interrupts.
Temperature Conversion Complete
150
140
130
Temperature (°C)
120
110
THERM Limit
100
THERM Limit - Hysteresis
90
THERM2 Limit
80
THERM2 Limit - Hysteresis
70
Measured
Temperature
60
50
Time
THERM2
THERM
Figure 14. THERM and THERM2 Interrupt Operation
12
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
7.4 Device Functional Modes
7.4.1 Shutdown Mode (SD)
The TMP468 shutdown mode enables the user to save maximum power by shutting down all device circuitry
other than the serial interface, and reducing current consumption to typically less than 0.3 μA; see Figure 13.
Shutdown mode is enabled when the shutdown bit (SD, bit 5) of the Configuration Register is HIGH; the device
shuts down immediately once the current conversion is complete. When the SD bit is LOW, the device maintains
a continuous-conversion state.
7.5 Programming
7.5.1 Serial Interface
The TMP468 device operates only as a slave device on the two-wire bus (I2C or SMBus). Connections to either
bus are made using the open-drain I/O lines, SDA, and SCL. The SDA and SCL pins feature integrated spike
suppression filters and Schmitt triggers to minimize the effects of input spikes and bus noise. The TMP468
device supports the transmission protocol for fast (1 kHz to 400 kHz) and high-speed (1 kHz to 2.56 MHz)
modes. All data bytes are transmitted MSB first.
While the TMP468 device is unpowered bus traffic on SDA and SCL may continue without any adverse effects to
the communication or to the TMP468 device itself. As the TMP468 device is powering up, the device does not
load the bus, and as a result the bus traffic may continue undisturbed.
7.5.1.1 Bus Overview
The TMP468 device is compatible with the I2C or SMBus interface. In I2C or SMBus protocol, the device that
initiates the transfer is called a master, and the devices controlled by the master are slaves. The bus must be
controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the
start and stop conditions.
To address a specific device, a start condition is initiated. A start condition is indicated by pulling the data line
(SDA) from a high-to-low logic level when SCL is high. All slaves on the bus shift in the slave address byte, with
the last bit indicating whether a read or write operation is intended. During the ninth clock pulse, the addressed
slave responds to the master by generating an acknowledge (ACK) bit and pulling SDA low.
Data transfer is then initiated and sent over eight clock pulses followed by an acknowledge bit (ACK). During
data transfer, SDA must remain stable when SCL is high. A change in SDA when SCL is high is interpreted as a
control signal. The TMP468 device has a word register structure (16-bit wide), with data writes always requiring
two bytes. Data transfer occurs during the ACK at the end of the second byte.
After all data are transferred, the master generates a stop condition. A stop condition is indicated by pulling SDA
from low to high when SCL is high.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
13
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Programming (continued)
7.5.1.2 Bus Definitions
The TMP468 device has a two-wire interface that is compatible with the I2C or SMBus interface. Figure 15
through Figure 20 illustrate the timing for various operations on the TMP468 device. The bus definitions are as
follows:
Bus Idle:
Both SDA and SCL lines remain high.
Start Data Transfer: A change in the state of the SDA line (from high to low) when the SCL line is high defines
a start condition. Each data transfer initiates with a start condition.
Stop Data Transfer: A change in the state of the SDA line (from low to high) when the SCL line is high defines
a stop condition. Each data transfer terminates with a repeated start or stop condition.
Data Transfer: The number of data bytes transferred between a start and stop condition is not limited and is
determined by the master device. The receiver acknowledges the data transfer.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge bit. A device
that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of the acknowledge clock pulse. Take setup
and hold times into account. On a master receive, data transfer termination can be signaled by the
master generating a not-acknowledge on the last byte that is transmitted by the slave.
1
1
9
9
SCL
SDA
1
Start by
Master
0
0
1
0
A1 A0 R/W
P7 P6 P5 P4 P3 P2 P1 P0
ACK
ACK Stop
by
by
by
Frame 2
Device
Device Master
Pointer Byte
from Master
Frame 1
Serial Bus Address
Byte from Master
Figure 15. Two-Wire Timing Diagram for Write Pointer Byte
1
9
1
9
SCL
SDA
1
0
0
1
0
A1
A0
R/W
Frame 1
Serial Bus Address Byte
from Master
SCL
(continued)
SDA
(continued)
1
P7
9
D15 D14 D13 D12 D11 D10
D9
Frame 3
Word MSB from Master
P6
P5
ACK
by
Device
Start by
Master
D8
P3
P2
P1
P0
ACK
by
Device
Frame 2
Pointer Byte from Master
1
D7
ACK
by
Device
P4
9
D6
D5
D4
D3
D2
D1
Frame 4
Word LSB from Master
D0
ACK
by
Device
Stop
by
Master
Figure 16. Two-Wire Timing Diagram for Write Pointer Byte and Value Word
14
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Programming (continued)
1
9
1
9
SCL
SDA
1
Start by
Master
(1)
0
A1 A0 R/W
0
1
Frame 1
Serial Bus Address
Byte from Master
P7 P6 P5 P4 P3 P2 P1 P0
ACK
ACK
by
by
Frame 2
Device
Device
Pointer Byte
from Master
1
SCL
(continued)
SDA
(continued)
0
1
Repeat
Start by
Master
9
0
0
0
1
1
9
D15 D14 D13 D12 D11 D10 D9 D8
NACK Stop
ACK
by
by
by
Frame 4
Master Master
Device
Data Byte 1 from
Device
A1 A0 R/W
Frame 3
Serial Bus Address
Byte from Master
The master must leave SDA high to terminate a single-byte read operation.
Figure 17. Two-Wire Timing Diagram for Pointer Set Followed by a Repeat Start and Single-Byte Read
Format
1
9
1
9
SCL
SDA
SCL
(continued)
SDA
(continued)
1
Start by
Master
0
0
1
0
A1 A0 R/W
Frame 1
Serial Bus Address
Byte from Master
P7 P6 P5 P4 P3 P2 P1 P0
ACK
ACK
by
by
Frame 2
Device
Device
Pointer Byte
from Master
1
1
Repeat
Start by
Master
9
0
0
1
0
1
9
1
9
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
NACK Stop
ACK
ACK
by
by
by
by
Frame 4
Frame 5
Master Master
Device
Master
Data Byte 1 from
Data Byte 2 from
Device
Device
A1 A0 R/W
Frame 3
Serial Bus Address
Byte from Master
Figure 18. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Word (TwoByte) Read
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
15
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Programming (continued)
1
9
1
9
SCL
SDA
1
Start by
Master
SCL
(continued)
SDA
(continued)
0
1
0
A1 A0 R/W
1
Repeat
Start by
Master
80h Block
ReadP4
AutoP3
Increment
Pointer
P7
P6 P5
P2 P1
P0
ACK
by
Device
Frame 1
Serial Bus Address
Byte from Master
1
SCL
(continued)
SDA
(continued)
0
9
0
0
1
0
ACK
by
Device
Frame 2
Pointer Byte from
Master
1
9
1
9
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
ACK
ACK
by
by
by
Frame 4
Frame 5
Device
Master
Master
Word 1 MSB from
Word 1 LSB from
Device
Device
A1 A0 R/W
Frame 3
Serial Bus Address
Byte from Master
1
9
1
9
D15 D14 D13 D12 D11 D10 D9 D8
Frame (2N + 2)
Word N MSB from
Device
D7 D6 D5 D4 D3 D2 D1 D0
ACK
NACK Stop
by
by
by
Frame (2N + 3)
Master
Master Master
Word N LSB from
Device
Figure 19. Two-Wire Timing Diagram for Pointer Byte Set Followed by a Repeat Start and Multiple-Word
(N-Word) Read
1
9
1
9
1
9
SCL
1
SDA
Start by
Master
SCL
(continued)
SDA
(continued)
0
0
1
0
D15 D14 D13 D12 D11 D10 D9 D8
D7 D6 D5 D4 D3 D2 D1 D0
ACK
ACK
ACK
by
by
by
Frame 4
Frame 5
Device
Master
Master
Word 1 MSB from
Word 1 LSB from
Device
Device
A1 A0 R/W
Frame 3
Serial Bus Address
Byte from Master
1
9
1
9
D15 D14 D13 D12 D11 D10 D9 D8
Frame (2N + 2)
Word N MSB from
Device
D7 D6 D5 D4 D3 D2 D1 D0
ACK
NACK Stop
by
by
by
Frame (2N + 3)
Master
Master Master
Word N LSB from
Device
Figure 20. Two-Wire Timing Diagram for Multiple-Word (N-Word) Read Without a Pointer Byte Set
16
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Programming (continued)
7.5.1.3 Serial Bus Address
To communicate with the TMP468 device, the master must first address slave devices using a slave address
byte. The slave address byte consists of seven address bits and a direction bit indicating the intent of executing a
read or write operation. The TMP468 device allows up to four devices to be addressed on a single bus. The
assigned device address depends on the ADD pin connection as described in Table 2.
Table 2. TMP468 Slave Address Options
ADD PIN CONNECTION
SLAVE ADDRESS
BINARY
HEX
GND
1001000
48
V+
1001001
49
SDA
1001010
4A
SCL
1001011
4B
7.5.1.4 Read and Write Operations
Accessing a particular register on the TMP468 device is accomplished by writing the appropriate value to the
pointer register. The value for the pointer register is the first byte transferred after the slave address byte with the
R/W bit low. Every write operation to the TMP468 device requires a value for the pointer register (see Figure 16).
The TMP468 registers can be accessed with block or single register reads. Block reads are only supported for
pointer values 80h to 88h. Registers at 80h through 88h mirror the Remote and Local Temperature registers (00h
to 08h). Pointer values 00h to 08h are for single register reads.
7.5.1.4.1 Single Register Reads
When reading from the TMP468 device, the last value stored in the pointer register by a write operation is used
to determine which register is read by a read operation. To change which register is read for a read operation, a
new value must be written to the pointer register. This transaction is accomplished by issuing a slave address
byte with the R/W bit low, followed by the pointer register byte; no additional data are required. The master can
then generate a start condition and send the slave address byte with the R/W bit high to initiate the read
command; see Figure 17 through Figure 19 for details of this sequence.
If repeated reads from the same register are desired, continually sending the pointer register bytes is not
necessary because the TMP468 device retains the pointer register value until the value is changed by the next
write operation. The register bytes are sent by the MSB first, followed by the LSB. If only one byte is read (MSB),
a consecutive read of TMP468 device results in the MSB being transmitted first. The LSB can only be accessed
through two-byte reads.
The master terminates a read operation by issuing a not-acknowledge (NACK) command at the end of the last
byte to be read or transmitting a stop condition. For a single-byte operation, the master must leave the SDA line
high during the acknowledge time of the first byte that is read from the slave.
The TMP468 register structure has a word (two-byte) length, so every write transaction must have an even
number of bytes (MSB and LSB) following the pointer register value (see Figure 16). Data transfers occur during
the ACK at the end of the second byte or LSB. If the transaction does not finish, signaled by the ACK at the end
of the second byte, then the data is ignored and not loaded into the TMP468 register. Read transactions do not
have the same restrictions and may be terminated at the end of the last MSB.
7.5.1.4.2 Block Register Reads
The TMP468 supports block mode reads at address 80h through 88h for temperature results alone. Setting the
pointer register to 80h signals to the TMP468 device that a block of more than two bytes must be transmitted
before a stop is issued. In this mode, the TMP468 device auto increments the internal pointer. After the 18 bytes
of temperature data are transmitted, the internal pointer resets to 80h. If the transmission is terminated before
register 88h is read, the pointer increments so a consecutive read (without a pointer set) can access the next
register.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
17
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
7.5.1.5 Timeout Function
The TMP468 device resets the serial interface if either SCL or SDA are held low for 17.5 ms (typical) between a
start and stop condition. If the TMP468 device is holding the bus low, the device releases the bus and waits for a
start condition. To avoid activating the timeout function, maintain a communication speed of at least 1 kHz for the
SCL operating frequency.
7.5.1.6 High-Speed Mode
For the two-wire bus to operate at frequencies above 1 MHz, the master device must issue a high-speed mode
(HS-mode) master code (0000 1xxx) as the first byte after a start condition to switch the bus to high-speed
operation. The TMP468 device does not acknowledge the master code byte, but switches the input filters on
SDA and SCL and the output filter on SDA to operate in HS-mode, allowing transfers up to 2.56 MHz. After the
HS-mode master code is issued, the master transmits a two-wire slave address to initiate a data transfer
operation. The bus continues to operate in HS-mode until a stop condition occurs on the bus. Upon receiving the
stop condition, the TMP468 device switches the input and output filters back to fast mode.
7.5.2 TMP468 Register Reset
The TMP468 registers can be software reset by setting bit 15 of the Software Reset register (20h) to 1. This
software reset restores the power-on-reset state to all TMP468 registers and aborts any conversion in progress.
7.5.3 Lock Register
All of the configuration and limit registers may be locked for writes (making the registers write-protected), which
decreases the chance of software runaway from issuing false changes to these registers. The Lock column in
Table 3 identifies which registers may be locked. Lock mode does not effect read operations. To activate the lock
mode, Lock Register C4h must be set to 0x5CA6. The lock only remains active while the TMP468 device is
powered up. Because the TMP468 device does not contain nonvolatile memory, the settings of the configuration
and limit registers are lost once a power cycle occurs regardless if the registers are locked or unlocked.
In lock mode, the TMP468 device ignores a write operation to configuration and limit registers except for Lock
Register C4h. The TMP468 device does not acknowledge the data bytes during a write operation to a locked
register. To unlock the TMP468 registers, write 0xEB19 to register C4h. The TMP468 device powers up in locked
mode, so the registers must be unlocked before the registers accept writes of new data.
18
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
7.6 Register Maps
Table 3. TMP468 Register Map
PTR
POR
LOCK
(HEX)
(HEX)
(Y/N)
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
00
0000
N/A
LT12
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
LT3
LT2
01
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
02
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
03
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
04
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
05
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
06
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
07
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
08
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
20
0000
N/A
RST
0
0
0
0
0
21
N/A
N/A
R8TH
R7TH
R6TH
R5TH
R4TH
R3TH
R2TH
22
N/A
N/A
R8TH2
R7TH2
R6TH2
R5TH2
R4TH2
R3TH2
R2TH2
23
N/A
N/A
R8OPN
R7OPN
R6OPN
R5OPN
R4OPN
R3OPN
R2OPN
R1OPN
REGISTER DESCRIPTION
30
15
REN8
14
REN7
13
REN6
12
REN5
11
REN4
10
REN3
9
3
2
1
0
LT1
LT0
0 (1)
0
0
Local Temperature
RT1
RT0
0
0
0
Remote Temperature 1
RT1
RT0
0
0
0
Remote Temperature 2
RT1
RT0
0
0
0
Remote Temperature 3
RT2
RT1
RT0
0
0
0
Remote Temperature 4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 8
0
0
0
0
0
0
0
0
0
0
Software Reset Register
R1TH
LTH
0
0
0
0
0
0
0
THERM Status
R1TH2
LTH2
0
0
0
0
0
0
0
THERM2 Status
0
0
0
0
0
0
0
0
Remote Channel OPEN Status
Configuration Register (Enables,
OneShot, ShutDown, ConvRate,
BUSY)
REN2
8
REN1
7
LEN
6
5
0F9C
Y
38
0080
Y
0
HYS11
HYS10
HYS9
HYS8
HYS7
HYS6
HYS5
39
7FC0
Y
LTH1_12
LTH1_11
LTH1_10
LTH1_09
LTH1_08
LTH1_07
LTH1_06
LTH1_05
3A
7FC0
Y
LTH2_12
LTH2_11
LTH2_10
LTH2_09
LTH2_08
LTH2_07
LTH2_06
LTH2_05
LTH2_04
LTH2_03
0
40
0000
Y
ROS12
ROS12 (2)
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
4
OS
SD
CR2
CR1
CR0
BUSY
0
HYS4
0
0
0
0
0
0
0
THERM Hysteresis
LTH1_04
LTH1_03
0
0
0
0
0
0
Local Temperature THERM Limit
0
0
0
0
0
Local Temperature THERM2 Limit
ROS1
ROS0
0
0
0
Remote Temperature 1 Offset
Remote Temperature 1 η-Factor
Correction
41
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
42
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 1 THERM Limit
43
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 1 THERM2 Limit
48
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 2 Offset
Remote Temperature 2 η-Factor
Correction
49
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
4A
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 2 THERM Limit
4B
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 2 THERM2 Limit
50
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 3 Offset
Remote Temperature 3 η-Factor
Correction
51
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
52
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 3 THERM Limit
53
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 3 THERM2 limit
58
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote temperature 4 Offset
0
Remote Temperature 4 η-Factor
Correction
59
(1)
(2)
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
Register bits highlighted in purple are reserved for future use and always report 0; writes to these bits are ignored.
Register bits highlighted in green show sign extended values.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
19
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Register Maps (continued)
Table 3. TMP468 Register Map (continued)
PTR
POR
LOCK
(HEX)
(HEX)
(Y/N)
15
14
13
12
11
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
10
9
8
7
6
5
4
3
2
1
0
5A
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 4 THERM Limit
5B
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 4 THERM2 Limit
60
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 5 Offset
Remote Temperature 5 η-Factor
Correction
REGISTER DESCRIPTION
20
61
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
62
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 5 THERM Limit
63
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 5 THERM2 Limit
68
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 6 Offset
Remote Temperature 6 η-Factor
Correction
69
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
6A
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 6 THERM Limit
6B
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 6 THERM2 Limit
70
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 7 Offset
71
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
Remote Temperature 7 η-Factor
Correction
72
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 7 THERM Limit
73
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 7 THERM2 Limit
78
0000
Y
ROS12
ROS12
ROS10
ROS9
ROS8
ROS7
ROS6
ROS5
ROS4
ROS3
ROS2
ROS1
ROS0
0
0
0
Remote Temperature 8 Offset
79
0000
Y
RNC7
RNC6
RNC5
RNC4
RNC3
RNC2
RNC1
RNC0
0
0
0
0
0
0
0
0
Remote Temperature 8 η-Factor
Correction
7A
7FC0
Y
RTH1_12
RTH1_11
RTH1_10
RTH1_09
RTH1_08
RTH1_07
RTH1_06
RTH1_05
RTH1_04
RTH1_03
0
0
0
0
0
0
Remote Temperature 8 THERM Limit
7B
7FC0
Y
RTH2_12
RTH2_11
RTH2_10
RTH2_09
RTH2_08
RTH2_07
RTH2_06
RTH2_05
RTH2_04
RTH2_03
0
0
0
0
0
0
Remote Temperature 8 THERM2 Limit
80
0000
N/A
LT12
LT11
LT10
LT9
LT8
LT7
LT6
LT5
LT4
LT3
LT2
LT1
LT0
0
0
0
Local Temperature (Block Read
Range - Auto Increment Pointer
Register)
81
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 1 (Block Read
Range - Auto Increment Pointer
Register)
82
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 2 (Block Read
Range - Auto Increment Pointer
Register)
83
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 3 (Block Read
Range - Auto Increment Pointer
Register)
84
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 4 (Block Read
Range - Auto Increment Pointer
Register)
85
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 5 (Block Read
Range - Auto Increment Pointer
Register)
86
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 6 (Block Read
Range - Auto Increment Pointer
Register)
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Register Maps (continued)
Table 3. TMP468 Register Map (continued)
PTR
POR
LOCK
(HEX)
(HEX)
(Y/N)
15
14
13
12
11
TMP468 FUNCTIONAL REGISTER - BIT DESCRIPTION
10
9
8
7
6
5
4
3
2
1
0
87
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 7 (Block Read
Range - Auto Increment Pointer
Register)
88
0000
N/A
RT12
RT11
RT10
RT9
RT8
RT7
RT6
RT5
RT4
RT3
RT2
RT1
RT0
0
0
0
Remote Temperature 8 (Block Read
Range - Auto Increment Pointer
Register)
C4
8000
N/A
REGISTER DESCRIPTION
Write 0x5CA6 to lock registers and 0xEB19 to unlock registers
Lock Register. This locks the registers
after initialization.
Read back: locked 0x8000; unlocked 0x0000
FE
5449
N/A
0
1
0
1
0
1
0
0
0
1
0
0
1
0
0
1
Manufacturers Identification Register
FF
0468
N/A
0
0
0
0
0
1
0
0
0
1
1
0
1
0
0
0
Device Identification/Revision Register
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
21
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
7.6.1 Register Information
The TMP468 device contains multiple registers for holding configuration information, temperature measurement
results, and status information. These registers are described in Figure 21 and Table 3.
7.6.1.1 Pointer Register
shows the internal register structure of the TMP468 device. The 8-bit pointer register addresses a given data
register. The pointer register identifies which of the data registers must respond to a read or write command on
the two-wire bus. This register is set with every write command. A write command must be issued to set the
proper value in the pointer register before executing a read command. Table 3 describes the pointer register and
the internal structure of the TMP468 registers. The power-on-reset (POR) value of the pointer register is 00h
(0000 0000b). Table 3 lists a summary of the pointer values for the different registers. Writing data to unassigned
pointer values are ignored and does not affect the operation of the device. Reading an unassigned register
returns undefined data and is ACKed.
Pointer Register
SDA
SCL
Serial
Interface
Local Temp
2
Remote Temp 1
2
Remote Temp 2
2
Remote Temp 3
2
Remote Temp 4
2
Remote Temp 5
2
Remote Temp 6
2
Remote Temp 7
2
Remote Temp 8
2
THERM Status
THERM2 Status
Remote Open Status
Manufacturer ID
Device ID
Local THERM Limit
Local THERM2 Limit
Remote 5 Offset
Remote 5 K -factor
Remote 5 THERM
Remote 5 THERM2
Remote 1 Offset
Remote 1 K -factor
Remote 1 THERM
Remote 1 THERM2
Remote 6 Offset
Remote 6 K -factor
Remote 6 THERM
Remote 6 THERM2
Remote 2 Offset
Remote 2 K -factor
Remote 2 THERM
Remote 2 THERM2
Remote 7 Offset
Remote 7 K -factor
Remote 7 THERM
Remote 7 THERM2
Remote 3 Offset
Remote 3 K -factor
Remote 3 THERM
Remote 3 THERM2
Remote 8 Offset
Remote 8 K -factor
Remote 8 THERM
Remote 8 THERM2
Configuration
Software Reset
Lock Initialization
THERM Hysterisis
Remote 4 Offset
Remote 4 K -factor
Remote 4 THERM
Remote 4 THERM2
Figure 21. TMP468 Internal Register Structure
7.6.1.2 Local and Remote Temperature Value Registers
The TMP468 device has multiple 16-bit registers that hold 13-bit temperature measurement results. The 13 bits
of the local temperature sensor result are stored in register 00h. The 13 bits of the eight remote temperature
sensor results are stored in registers 01h through 08h. The four assigned LSBs of both the local (LT3:LT0) and
remote (RT3:RT0) sensors indicate the temperature value after the decimal point (for example, if the temperature
result is 10.0625°C, then the high byte is 0000 0101 and the low byte is 0000 1000). These registers are readonly and are updated by the ADC each time a temperature measurement is complete. Asynchronous reads are
supported, so a read operation can occur at any time and results in valid conversion results being transmitted
once the first conversion is complete after power up for the channel being accessed. If after power up a read is
initiated before a conversion is complete, the read operation results in all zeros (0x0000).
7.6.1.3 Software Reset Register
The Software Reset Register allows the user to reset the TMP468 registers through software by setting the reset
bit (RST, bit 15) to 1. The power-on-reset value for this register is 0x0000. Resets are ignored when the device is
in lock mode, so writing a 1 to the RST bit does not reset any registers.
22
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Table 4. Software Reset Register Format
STATUS REGISTER (READ = 20h, WRITE = 20h, POR = 0x0000)
BIT NUMBER
BIT NAME
15
RST
14-0
0
FUNCTION
1 software reset device; writing a value of 0 is ignored
Reserved for future use; always reports 0
7.6.1.4 THERM Status Register
The THERM Status register reports the state of the THERM limit comparators for local and eight remote
temperatures. Table 5 lists the status register bits. The THERM Status register is read-only and is read by
accessing pointer address 21h.
Table 5. THERM Status Register Format
THERM STATUS REGISTER (READ = 21h, WRITE = N/A)
BIT NUMBER
BIT NAME
15
R8TH
1 when Remote 8 exceeds the THERM limit
FUNCTION
14
R7TH
1 when Remote 7 exceeds the THERM limit
13
R6TH
1 when Remote 6 exceeds the THERM limit
12
R5TH
1 when Remote 5 exceeds the THERM limit
11
R4TH
1 when Remote 4 exceeds the THERM limit
10
R3TH
1 when Remote 3 exceeds the THERM limit
9
R2TH
1 when Remote 2 exceeds the THERM limit
8
R1TH
1 when Remote 1 exceeds the THERM limit
7
LTH
6:0
0
1 when Local sensor exceeds the THERM limit
Reserved for future use; always reports 0.
The R8TH:R1TH and LTH flags are set when the corresponding temperature exceeds the respective
programmed THERM limit (39h, 42h, 4Ah, 52h, 5Ah, 62h, 6Ah, 72h, 7Ah). These flags are reset automatically
when the temperature returns below the THERM limit minus the value set in the THERM Hysteresis register
(38h). The THERM output goes low in the case of overtemperature on either the local or remote channels, and
goes high as soon as the measurements are less than the THERM limit minus the value set in the THERM
Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets
and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis
value.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
23
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
7.6.1.5 THERM2 Status Register
The THERM2 Status register reports the state of the THERM2 limit comparators for local and remote 1-8
temperatures. Table 6 lists the status register bits. The THERM2 Status register is read-only and is read by
accessing pointer address 22h.
Table 6. THERM2 Status Register Format
THERM2 STATUS REGISTER (READ = 22h, WRITE = N/A)
BIT NUMBER
BIT NAME
FUNCTION
15
R8TH2
1 when Remote 8 exceeds the THERM2 limit
14
R7TH2
1 when Remote 7 exceeds the THERM2 limit
13
R6TH2
1 when Remote 6 exceeds the THERM2 limit
12
R5TH2
1 when Remote 5 exceeds the THERM2 limit
11
R4TH2
1 when Remote 4 exceeds the THERM2 limit
10
R3TH2
1 when Remote 3 exceeds the THERM2 limit
9
R2TH2
1 when Remote 2 exceeds the THERM2 limit
8
R1TH2
1 when Remote 1 exceeds the THERM2 limit
7
LTH2
6:0
0
1 when Local Sensor exceeds the THERM2 limit
Reserved for future use; always reports 0.
The R8TH2:R1TH2 and LTH2 flags are set when the corresponding temperature exceeds the respective
programmed THERM2 limit (3Ah, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, 7Bh). These flags are reset automatically
when the temperature returns below the THERM2 limit minus the value set in the THERM Hysteresis register
(38h). The THERM2 output goes low in the case of overtemperature on either the local or remote channels, and
goes high as soon as the measurements are less than the THERM2 limit minus the value set in the THERM
Hysteresis register. The THERM Hysteresis register (38h) allows hysteresis to be added so that the flag resets
and the output goes high when the temperature returns to or goes below the limit value minus the hysteresis
value.
7.6.1.6 Remote Channel Open Status Register
The Remote Channel Open Status register reports the state of the connection of remote channels one through
eight. Table 7 lists the status register bits. The Remote Channel Open Status register is read-only and is read by
accessing pointer address 23h.
Table 7. Remote Channel Open Status Register Format
REMOTE CHANNEL OPEN STATUS REGISTER (READ = 23h, WRITE = N/A)
BIT NUMBER
BIT NAME
15
R8OPEN
1 when Remote 8 channel is an open circuit
FUNCTION
14
R7OPEN
1 when Remote 7 channel is an open circuit
13
R6OPEN
1 when Remote 6 channel is an open circuit
12
R5OPEN
1 when Remote 5 channel is an open circuit
11
R4OPEN
1 when Remote 4 channel is an open circuit
10
R3OPEN
1 when Remote 3 channel is an open circuit
9
R2OPEN
1 when Remote 2 channel is an open circuit
8
R1OPEN
1 when Remote 1 channel is an open circuit
7:0
0
Reserved for future use; always reports 0.
The R8OPEN:R1OPEN bits indicate an open-circuit condition on remote sensors eight through one, respectively.
The setting of these flags does not directly affect the state of the THERM or THERM2 output pins. Indirectly, the
temperature reading(s) may be erroneous and exceed the respective THERM and THERM2 limits, activating the
THERM or THERM2 output pins.
24
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
7.6.1.7 Configuration Register
The Configuration Register sets the conversion rate, starts one-shot conversion of all enabled channels, enables
conversion the temperature channels, controls the shutdown mode and reports when a conversion is in process.
The Configuration Register is set by writing to pointer address 30h, and is read from pointer address 30h.
Table 8 summarizes the bits of the Configuration Register.
Table 8. Configuration Register Bit Descriptions
CONFIGURATION REGISTER (READ = 30h, WRITE = 30h, POR = 0x0F9C)
BIT NUMBER
NAME
FUNCTION
POWER-ON-RESET VALUE
15:8
REN8:REN1
1 = enable respective remote
channel 8 through 1 conversions
1111 1111
7
LEN
1 = enable local channel
conversion
1
6
OS
1 = start one-shot conversion on
enabled channels
0
5
SD
1 = enables device shutdown
0
4:2
CR2:CR0
Conversion rate control bits;
control conversion rates for all
enabled channels from 16
seconds to continuous
conversion
111
1
BUSY
1 when the ADC is converting
(read-only bit ignores writes)
0
0
Reserved
—
0
The Remote Enable eight through one (REN8:REN1, bits 15:8) bits enable conversions on the respective remote
channels. The Local Enable (LEN, bit 7) bit enables conversions of the local temperature channel. If all LEN and
REN are set to 1 (default), this enables the ADC to convert the local and all remote temperatures. If the LEN is
set to 0, the local temperature conversion is skipped. Similarly if a REN is set to 0, that remote temperature
conversion channel is skipped. The TMP468 device steps through each enabled channel in a round-robin fashion
in the following order: LOC, REM1, REM2, REM8, LOC, REM1, and so on. All local and remote temperatures are
converted by the internal ADC by default after power up. The configuration register LEN and REN bits can be
configured to save power by reducing the total ADC conversion time for applications that do not require all of the
eight remote and local temperature information. Note writing all zeros to REN8:REN1 and LEN has the same
effect as SD = 1 and OS = 0.
The shutdown bit (SD, bit 5) enables or disables the temperature-measurement circuitry. If SD = 0 (default), the
TMP468 device converts continuously at the rate set in the conversion rate register. When SD is set to 1, the
TMP468 device immediately stops the conversion in progress and instantly enters shutdown mode. When SD is
set to 0 again, the TMP468 device resumes continuous conversions starting with the local temperature.
The BUSY bit = 1 if the ADC is making a conversion. This bit is set to 0 if the ADC is not converting.
After the TMP468 device is in shutdown mode, writing a 1 to the one-shot (OS, bit 6) bit starts a single ADC
conversion of all the enabled temperature channels. This write operation starts one conversion and comparison
cycle on either the eight remote and one local sensor or any combination of sensors, depending on the LEN and
REN values in the Configuration Register (read address 30h). The TMP468 device returns to shutdown mode
when the cycle is complete. Table 9 details the interaction of the SD, OS, LEN, and REN bits.
Table 9. Conversion Modes
WRITE
READ
REN[8:1], LEN
OS
SD
REN[8:1], LEN
OS
SD
FUNCTION
All 0
—
—
All 0
0
1
Shutdown
At least 1 enabled
—
0
Written value
0
0
Continuous conversion
At least 1 enabled
0
1
Written value
0
1
Shutdown
At least 1 enabled
1
1
Written value
1
1
One-shot conversion
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
25
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
The conversion rate bits control the rate that the conversions occur (CR2:CR0, bits 4:2). The value of CR2:CR0
bits controls the idle time between conversions but not the conversion time itself, which allows the TMP468
device power dissipation to be balanced with the update rate of the temperature register. Table 10 describes the
mapping for CR2:CR0 to the conversion rate or temperature register update rate.
Table 10. Conversion Rate
CR2:CR0
DECIMAL VALUE
FREQUENCY (Hz)
TIME (s)
000
0
0.0625
16
001
1
0.125
8
010
2
0.25
4
011
3
0.5
2
100
4
1
1
101
5
2
0.5
110
6
4
0.25
111
7
Continuous conversion; depends on number of enabled channels; see
Table 11 (default).
Table 11. Continuous Conversion Times
NUMBER OF REMOTE CHANNELS ENABLED
CONVERSION TIME (ms)
LOCAL DISABLED
LOCAL ENABLED
0
0
15.5
1
15.8
31.3
2
31.6
47.1
3
47.4
62.9
4
63.2
78.7
5
79
94.5
6
94.8
110.3
7
110.6
126.1
8
126.4
141.9
The remaining bits of the configuration register are reserved and must always be set to 0. The POR value for this
register is 0x0F9C.
7.6.1.8 η-Factor Correction Register
The TMP468 device allows for a different η-factor value to be used for converting remote channel measurements
to temperature for each temperature channel. There are eight η-Factor Correction registers assigned: one to
each of the remote input channels (addresses 41h, 49h, 51h, 59h, 61h, 69h, 71h and 79h). Each remote channel
uses sequential current excitation to extract a differential VBE voltage measurement to determine the temperature
of the remote transistor. Equation 1 shows this voltage and temperature.
VBE2 VBE1
KkT § I 2 ·
In ¨ ¸
q
© I1 ¹
(1)
The value η in Equation 1 is a characteristic of the particular transistor used for the remote channel. The POR
value for the TMP468 device is η = 1.008. The value in the η-Factor Correction register can be used to adjust the
effective η-factor, according to Equation 2 and Equation 3.
eff
§ 1.008 u 2088 ·
¨
¸
© 2088 NADJUST ¹
NADJUST
26
§ 1.008 u 2088 ·
¨
¸
eff
©
¹
(2)
2088
(3)
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
The η-factor correction value must be stored in a two's-complement format, which yields an effective data range
from –128 to +127. The POR value for each register is 0000h, which does not affect register values unless a
different value is written to the register. The resolution of the η-factor register changes linearly as the code
changes and has a range from 0.0004292 to 0.0005476, with an average of 0.0004848.
Table 12. η-Factor Range
NADJUST ONLY BITS 15 TO 8 IN THE REGISTER ARE SHOWN
η
BINARY
HEX
DECIMAL
0111 1111
7F
127
0.950205
0000 1010
0A
10
1.003195
0000 1000
08
8
1.004153
0000 0110
06
6
1.005112
0000 0100
04
4
1.006073
0000 0010
02
2
1.007035
0000 0001
01
1
1.007517
0000 0000
00
0
1.008
1111 1111
FF
–1
1.008483
1111 1110
FE
–2
1.008966
1111 1100
FC
–4
1.009935
1111 1010
FA
–6
1.010905
1111 1000
F8
–8
1.011877
1111 0110
F6
–10
1.012851
1000 0000
80
–128
1.073829
7.6.1.9 Remote Temperature Offset Register
The offset registers allow the TMP468 device to store any system offset compensation value that may result from
precision calibration. The value in these registers is added to the remote temperature results upon every
conversion. Each of the eight temperature channels have an independent assigned offset register (addresses
40h, 48h, 50h, 58h, 60h, 68h, 70h, and 78h). Combined with the independent η-factor corrections, this function
allows for very accurate system calibration over the entire temperature range for each remote channel. The
format of these registers is the same as the temperature value registers with a range from +127.9375 to –128.
Take care to program this register with sign extension, as values above +127.9375 and below –128 are not
supported.
7.6.1.10 THERM Hysteresis Register
The THERM Hysteresis register (address 38h) sets the value of the hysteresis used by the temperature
comparison logic. All temperature reading comparisons have a common hysteresis. Hysteresis prevents
oscillations from occurring on the THERM and THERM2 outputs as the measured temperature approaches the
comparator threshold (see the THERM Functions section). The resolution of the THERM Hysteresis register is
1°C and ranges from 0°C to 255°C.
7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
Each of the eight remote and the local temperature channels has associated independent THERM and THERM2
Limit registers. There are nine THERM registers (addresses 39h, 42h, 4Ah, 52h, 5Ah, 62h, 6Ah, 72h, and 7Ah)
and nine THERM2 registers (addresses 39h, 43h, 4Bh, 53h, 5Bh, 63h, 6Bh, 73h, and 7Bh), 18 registers in total.
The resolution of these registers is 0.5°C and ranges from +255.5°C to –255°C. See the THERM Functions
section for more information.
Setting a THERM limit to 255.5°C disables the THERM limit comparison for that particular channel and disables
the limit flag from being set in the THERM Status register. This prevents the associated channel from activating
the THERM output. THERM2 limits, status, and outputs function similarly.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
27
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
7.6.1.12 Block Read - Auto Increment Pointer
Block reads can be initiated by setting the pointer register to 80h to 87h. The temperature results are mirrored at
pointer addresses 80h to 88h; temperature results for all the channels can be read with one read transaction.
Setting the pointer register to any address from 80h to 88h signals to the TMP468 device that a block of more
than two bytes must be transmitted before a design stop is issued. In block read mode, the TMP468 device auto
increments the pointer address. After 88h, the pointer resets to 80h. The master must NACK the last byte read
so the TMP468 device can discontinue driving the bus, which allows the master to initiate a stop. In this mode,
the pointer continuously loops in the address range from 80h to 88h, so the register may be easily read multiple
times. Block read does not disrupt the conversion process.
7.6.1.13 Lock Register
Register C4h allows the device configuration and limit registers to lock, as shown by the Lock column in Table 3.
To lock the registers, write 0x5CA6. To unlock the registers, write 0xEB19. When the lock function is enabled,
reading the register yields 0x8000; when unlocked, 0x0000 is transmitted.
7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
The TMP468 device allows the two-wire bus controller to query the device for manufacturer and device
identifications (IDs) to enable software identification of the device at the particular two-wire bus address. The
manufacturer ID is obtained by reading from pointer address FEh; the device ID is obtained from register FFh.
Note that the most significant byte of the Device ID register identifies the TMP468 device revision level. The
TMP468 device reads 0x5449 for the manufacturer code and 0x0468 for the device ID code for the first release.
28
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP468 device requires a transistor connected between the D+ and D– pins for remote temperature
measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is
measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup
resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local
bypassing. Figure 22 and Figure 23 illustrate the typical configurations for the TMP468 device.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
29
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
8.2 Typical Application
RS1
CDIFF
RS1
RS2
1.7 V to 3.6 V
1.7 V to 3.6 V
CDIFF
CBYPASS
RSCL
RSDA
RT1
RT2
RS2
RS1
B1
D2+
CDIFF
C1
RS2
D1
D3
A1
D1+
V+
B4
ADD
D3+
SCL
D4+
SDA
D4
Two-Wire Interface
SMBus / I2C Compatible
Controller
C4
TMP468
RS1
A2
B2
CDIFF
RS2
D5+
THERM2
B3
D6+
Overtemperature
Shutdown
THERM
D7+
RS1
C3
C2
D8+
D2
D-
GND
A3
A4
CDIFF
RS2
RS1
RS1
CDIFF
RS2
CDIFF
RS2
Copyright © 2017, Texas Instruments Incorporated
(1)
The diode-connected configuration provides better settling time. The transistor-connected configuration provides
better series resistance cancellation. TI recommends a MMBT3904 or MMBT3906 transistor with an η-factor of 1.008.
(2)
RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, D–
pins. RS selection depends on the application.
(3)
CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see Figure 9.
(4)
Unused diode channels must be tied to D– .as shown for D5+.
Figure 22. TMP468 Basic Connections Using a Discrete Remote Transistor
30
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Typical Application (continued)
RS(2) Series Resistance
RS(2)
NPN Diode-Connected Configuration(1)
RS(2) Series Resistance
RS(2)
D+
PNP Diode-Connected Configuration
RS(2)
CDIFF(3)
(1)
TMP468
D-
Series Resistance
RS(2)
PNP Transistor-Connected Configuration(1)
RS(2)
RS(2)
RS(2)
RS(2)
Internal and PCB
Series Resistance
Processor, FPGA, or ASIC
Integrated PNP Transistor-Connected Configuration(1)
Copyright © 2017, Texas Instruments Incorporated
Figure 23. TMP468 Remote Transistor Configuration Options
8.2.1 Design Requirements
The TMP468 device is designed to be used with either discrete transistors or substrate transistors built into
processor chips, field programmable gate arrays (FPGAs), and application-specific integrated circuits (ASICs) ;
see Figure 23. Either NPN or PNP transistors can be used, as long as the base-emitter junction is used as the
remote temperature sensor. NPN transistors must be diode-connected. PNP transistors can either be transistoror diode-connected (see Figure 23).
Errors in remote temperature sensor readings are typically the consequence of the ideality factor (η-factor) and
current excitation used by the TMP468 device versus the manufacturer-specified operating current for a given
transistor. Some manufacturers specify a high-level and low-level current for the temperature-sensing substrate
transistors. The TMP468 uses 7.5 μA (typical) for ILOW and 120 μA (typical) for IHIGH.
The ideality factor (η-factor) is a measured characteristic of a remote temperature sensor diode as compared to
an ideal diode. The TMP468 allows for different η-factor values; see the η-Factor Correction Register section.
The η-factor for the TMP468 device is trimmed to 1.008. For transistors that have an ideality factor that does not
match the TMP468 device, Equation 4 can be used to calculate the temperature error.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
31
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Typical Application (continued)
NOTE
For Equation 4 to be used correctly, the actual temperature (°C) must be converted to
Kelvin (K).
§ K 1.008 ·
¨ 1.008 ¸ u 273.15 T C
©
¹
O
TERR
where
•
•
•
TERR = error in the TMP468 device because η ≠ 1.008
η = ideality factor of the remote temperature sensor
T(°C) = actual temperature, and
(4)
In Equation 4, the degree of delta is the same for °C and K.
For η = 1.004 and T(°C) = 100°C:
§ 1.004 1.008 ·
TERR = ¨
¸ u 273.15
1.008
©
¹
TERR
1.48qC
100qC
(5)
If a discrete transistor is used as the remote temperature sensor with the TMP468 device, then select the
transistor according to the following criteria for best accuracy:
• Base-emitter voltage is > 0.25 V at 7.5 μA, at the highest-sensed temperature.
• Base-emitter voltage is < 0.95 V at 120 μA, at the lowest-sensed temperature.
• Base resistance is < 100 Ω.
• Tight control of VBE characteristics indicated by small variations in hFE (50 to 150).
Based on these criteria, TI recommends using a MMBT3904 (NPN) or a MMBT3906 (PNP) transistor.
8.2.2 Detailed Design Procedure
The local temperature sensor inside the TMP468 is influenced by the ambient air around the device but mainly
monitors the PCB temperature that it is mounted to. The thermal time constant for the TMP468 device is
approximately two seconds. This constant implies that if the ambient air changes quickly by 100°C, then the
TMP468 device takes approximately 10 seconds (that is, five thermal time constants) to settle to within 1°C of
the final value. In most applications, the TMP468 package is in electrical (and therefore thermal) contact with the
printed-circuit board (PCB), and subjected to forced airflow. The accuracy of the measured temperature directly
depends on how accurately the PCB and forced airflow temperatures represent the temperature that the TMP468
device is measuring. Additionally, the internal power dissipation of the TMP468 device can cause the
temperature to rise above the ambient or PCB temperature. The internal power is negligible because of the small
current drawn by the TMP468 device. Equation 6 can be used to calculate the average conversion current for
power dissipation and self-heating based on the number of conversions per second and temperature sensor
channel enabled. Equation 7 shows an example with local and all remote sensor channels enabled and
conversion rate of 1 conversion per second; see the Electrical Characteristics table for typical values required for
these calculations. For a 3.3-V supply and a conversion rate of 1 conversion per second, the TMP468 device
dissipates 0.224 mW (PDIQ = 3.3 V × 68 μA) when both the remote and local channels are enabled.
Average Conversion Current = (Local Conversion Time) × (Conversions Per Second) × (Local Active IQ ) +
(Remote Conversion Time) × (Conversions Per Second) × (Remote Active IQ) × (Number of Active Channels +
(Standby Mode) × [1 ± ((Local Conversion Time) + (Remote Conversion Time) × (Number of Active
Channels)) × (Conversions Per Second)]
(6)
32
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
Typical Application (continued)
1
) u (240 PA)
sec
1
(16 ms) u (
) u (400 PA) u (8)
sec
1 º
ª
(15 PA) u «1 ((16 ms ) (16 ms) u (8)) u (
)
sec »¼
¬
68 PA
Average Conversion Current (16 ms) u (
(7)
(8)
The temperature measurement accuracy of the TMP468 device depends on the remote and local temperature
sensor being at the same temperature as the monitored system point. If the temperature sensor is not in good
thermal contact with the part of the monitored system, then there is a delay between the sensor response and
the system changing temperature. This delay is usually not a concern for remote temperature-sensing
applications that use a substrate transistor (or a small, SOT-23 transistor) placed close to the monitored device.
8.2.3 Application Curve
110%
110%
100%
100%
90%
90%
Percent of Final Value
Percent of Final Value
Figure 24 and Figure 25 show the typical step response to submerging a TMP468 device (initially at 25°C) in an
oil bath with a temperature of 100°C and logging the local temperature readings.
80%
70%
60%
50%
40%
30%
80%
70%
60%
50%
40%
30%
20%
20%
10%
10%
0
-2
0
2
4
6
8
10
Time (s)
12
14
16
18
0
-2
D014
Figure 24. TMP468DSBGA Temperature Step
Response of Local Sensor
0
2
4
6
8
10
Time (s)
12
14
16
18
Figure 25. TMP468VQFN Temperature Step
Response of Local Sensor
9 Power Supply Recommendations
The TMP468 device operates with a power-supply range from 1.7 V to 3.6 V. The device is optimized for
operation at a 1.8-V supply, but can measure temperature accurately in the full supply range.
TI recommends a power-supply bypass capacitor. Place this capacitor as close as possible to the supply and
ground pins of the device. A typical value for this supply bypass capacitor is 0.1 μF. Applications with noisy or
high-impedance power supplies may require additional decoupling capacitors to reject power-supply noise.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
33
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
10 Layout
10.1 Layout Guidelines
Remote temperature sensing on the TMP468 device measures very small voltages using very low currents;
therefore, noise at the device inputs must be minimized. Most applications using the TMP468 device have high
digital content, with several clocks and a multitude of logic-level transitions that create a noisy environment.
Layout must adhere to the following guidelines:
1. Place the TMP468 device as close to the remote junction sensor as possible.
2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of
ground guard traces, as shown in Figure 26. If a multilayer PCB is used, bury these traces between the
ground or V+ planes to shield them from extrinsic noise sources. TI recommends 5-mil (0.127 mm) PCB
traces.
3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are
used, make the same number and approximate locations of copper-to-solder connections in both the D+ and
D– connections to cancel any thermocouple effects.
4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP468. For optimum
measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This
capacitance includes any cable capacitance between the remote temperature sensor and the TMP468.
5. If the connection between the remote temperature sensor and the TMP468 is wired and is less than eight
inches (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than eight inches, use a
twisted, shielded pair with the shield grounded as close to the TMP468 device as possible. Leave the remote
sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
6. Thoroughly clean and remove all flux residue in and around the pins of the TMP468 device to avoid
temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
V+
D+
Ground or V+ layer
on bottom and top,
if possible.
D-
GND
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
Figure 26. Suggested PCB Layer Cross-Section
34
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
10.2 Layout Example
VIA to Power or Ground Plane
VIA to Internal Layer
1 nF
1 nF
D1+
A1
D5+
A2
DA3
GND
A4
D2+
B1
D6+
B2
THR
B3
ADD
B4
D3+
C1
D7+
C2
TH2
C3
SDA
C4
D4+
D1
D8+
D2
V+
D3
SCL
D4
1 nF
1 nF
1 nF
1 nF
1 nF
1 nF
0.1 F
Figure 27. TMP468 YFF Package Layout Example
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
35
TMP468
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
www.ti.com
Layout Example (continued)
VIA to Power or Ground Plane
VIA to Internal Layer
0.1 F
1 nF
1 nF
D7+ D8+ V+ SCL
16 15 14 13
1 nF
D6+
1
12
D5+
1 nF
2
D4+
3
1 nF
D3+
Exposed
Thermal Pad
11
SDA
THERM2
THERM
10
9 ADD
4
5
6
7
8
D2+ D1+ D- GND
1 nF
1 nF
1 nF
Figure 28. TMP468 RGT Package Layout Example
36
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
TMP468
www.ti.com
SBOS762B – NOVEMBER 2016 – REVISED JUNE 2017
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
SMBus is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Product Folder Links: TMP468
37
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
TMP468AIRGTR
ACTIVE
VQFN
RGT
16
3000
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
T468
TMP468AIRGTT
ACTIVE
VQFN
RGT
16
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
T468
TMP468AIYFFR
ACTIVE
DSBGA
YFF
16
3000
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TMP468
TMP468AIYFFT
ACTIVE
DSBGA
YFF
16
250
RoHS & Green
SNAGCU
Level-1-260C-UNLIM
-40 to 125
TMP468
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
工商网监
湘ICP备2023018690号
