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TMP814
SLDS151A – MAY 2009 – REVISED JUNE 2015
TMP814 Variable Speed Single-phase Full-wave Fan Motor Predriver
1
1 Features
•
•
•
•
•
•
•
Predriver for Single-Phase Full-Wave Drive
– PNP-NMOS is Used as an External Power TR,
Enabling High-Efficiency Low-Consumption
Drive by Means of the Low-Saturation Output
and Single-Phase Full-Wave Drive (PMOSNMOS Also Applicable)
External PWM Input Enabling Variable Speed
Control
– Separately-Excited Upper Direct PWM (f = 25
kHz) Control Method, Enabling Highly Silent
Speed Control
Compatible with 12-V, 24-V, and 48-V Power
Supplies
Current Limiter Circuit Incorporated
– Chopper Type Current Limit at Start
Reactive Current Cut Circuit Incorporated
– Reactive Current Before Phase Change is Cut
to Enable Silent and Low-Consumption Drive
Minimum Speed Setting Pin
– Minimum Speed Can Be Set With External
Resistor. Start Assistance Circuit Enables Start
at Extremely Low Speed.
Constant-Voltage Output Pin for Hall Bias
•
•
Lock Protection and Automatic Reset Functions
Incorporated
FG (Rotation Speed Detection) and RD (Lock
Detection) Output
2 Applications
•
•
Server Fans (Up to 48 V)
Appliance Fans (Up to 48 V)
3 Description
The TMP814 is a single-phase bipolar variable speed
fan motor predriver that works with an external PWM
signal. A highly efficient, quiet and low-power
consumption motor driver circuit, with a large variable
speed, can be implemented by adding a small
number of external components.
This device is optimal for driving large scale fan
motors (with large air volume and large current) such
as those used in servers and consumer products.
Device Information(1)
PART NUMBER
TMP814
PACKAGE
TSSOP (PW)
BODY SIZE (NOM)
4.40 mm x 6.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
Vm
(Optional)
Limit Vcc
Vover
H+
Speed Setting
H-
Lock Detection
Frequency Set
TMP814
Current Limit
Speed Output
RF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP814
SLDS151A – MAY 2009 – REVISED JUNE 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
4
4
4
4
5
7
Absolute Maximum Ratings .....................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Applications ............................................... 12
9 Power Supply Recommendations...................... 15
10 Layout................................................................... 15
10.1 Layout Guidelines ................................................. 15
10.2 Layout Example .................................................... 15
11 Device and Documentation Support ................. 16
11.1
11.2
11.3
11.4
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
16
16
16
16
12 Mechanical, Packaging, and Orderable
Information ........................................................... 16
4 Revision History
Changes from Original (May 2009) to Revision A
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
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5 Pin Configuration and Functions
PW Package
20-Pin TSSOP
Top View
OUT2P
OUT2N
VCC
VLIM
SENSE
RMI
VTH
CPWM
FG
RD
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OUT1P
OUT1N
VOVER
SGND
6VREG
ROFF
CT
IN+
HB
IN–
Pin Functions
PIN
NO.
NAME
I/O
DESCRIPTION
1
OUT2P
O
Upper-side driver output
2
OUT2N
O
Lower-side driver output
Power supply. For the CM capacitor that is a power stabilization capacitor for PWM drive and for
absorption of kickback, the capacitance of 0.1 μF to 1 μF is used. In this device, the lower TR
performs current regeneration by switching the upper TR. Connect CM between VCC and GND,
with the thick pattern and along the shortest route. Use a zener diode if kickback causes
excessive increase of the supply voltage, because such increase may damage the device.
3
VCC
4
VLIM
I
Activates the current limiter when SENSE voltage is greater than VLIM voltage. Connect to
6VREG when not used.
5
SENSE
I
Sense input. Connect to GND when not used.
6
RMI
I
Minimum speed setting. Connect to 6VREG when not used. If device power can be removed
before power is removed from RMI, insert a current limiting resistor to prevent inflow of large
current.
7
VTH
I
VTH : Connect to GND if not used (Full Speed).
8
CPWM
O
Connect to capacitor CP to set the PWM oscillation frequency. With CP = 100 pF, oscillation
occurs at 25 kHz and provides the basic frequency of PWM.
9
FG
O
Open collector output, which can detect the rotation speed using the FG output according to the
phase shift. Leave open when not used.
10
RD
O
Open collector output. Outputs low during rotation and high at stop. Leave open when not used.
11
IN–
I
Hall input
12
HB
O
This is a Hall element bias, that is, the 1.5-V constant-voltage output.
13
IN+
I
Hall input. Make connecting traces as short as possible to prevent carrying of noise. To futher
limit noise, insert a capacitor between IN+ and IN–. The Hall input circuit is a comparator having
a hysteresis of 20 mV. The application should ensure that the Hall input level more than three
times (60 mVp-p) this hysteresis.
14
CT
O
Lock detection time setting. Capacitor CT is connected.
15
ROFF
I
Sets the soft switching time to cut the reactive current before phase change. Connect to 6VREG
when not used.
16
6VREG
O
6-V regulator output
17
SGND
18
VOVER
O
Constant-voltage bias and should be used for application of 24 V and 48 V (see Figure 7). A
current limiting resistor should be used. Leave open when not used.
19
OUT1N
O
Lower-side driver output
20
OUT1P
O
Upper-side driver output
Connected to the control circuit power supply system.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
18
V
VCC
Supply voltage
VOUT
Output voltage
OUT1P, OUT1N, OUT2P, OUT2N
18
V
IOUT
Continuous output current
OUT1P, OUT1N, OUT2P, OUT2N
50
mA
IHB
Continuous output current
HB
10
mA
VTH
Input voltage
VTH
8
V
VRD
VFG
Output voltage
RD, FG
18
V
IRD
IFG
Continuous output current
RD, FG
10
mA
Tstg
Storage temperature
150
°C
(1)
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2500
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
TA = 25°C
MIN
MAX
6
16
UNIT
V
0
7
V
VCC
Supply voltage
VTH
VTH input voltage
VICM
Hall input common phase input voltage
0.2
3
V
TA
Operating free-air temperature
–30
95
°C
Full-speed mode
6.4 Thermal Information
TMP814
THERMAL METRIC (1)
PW (TSSOP)
UNIT
20 PINS
RθJA
Junction-to-ambient thermal resistance
83
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
90.6
°C/W
RθJB
Junction-to-board thermal resistance
42.1
°C/W
ψJT
Junction-to-top characterization parameter
24.3
°C/W
ψJB
Junction-to-board characterization parameter
0.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
41.5
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
VCC = 12 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IHB = 5 mA
MIN
TYP
MAX
UNIT
5.8
6
6.15
V
12
12.8
13.6
V
4.35
4.55
4.75
V
1.45
1.65
1.85
V
V6VREG
Output voltage
6VREG
VVOVER
Output voltage
VOVER
VCRH
High-level output voltage
VCRL
Low-level output voltage
fPWM
Oscillation frequency
18
25
32
kHz
VCTH
High-level output voltage
3.4
3.6
3.8
V
VCTL
Low-level output voltage
1.4
1.6
1.8
V
ICT1
Charge current
ICT2
Discharge current
RCT
Charge/discharge current ratio
VON
Output voltage
OUT_N
IOP
Sink current
OUT_P
VHN
Hall input sensitivity
H+, H-
VRD
VFG
Low-level output voltage
IRDL
IFGL
Output leakage current
ICC
Supply current
CPWM
CP = 100 pF
CT
IO = 20 mA
1.6
2
2.5
μA
0.16
0.2
0.28
μA
8
10
12
4
10
V
15
20
mA
Zero peak value
(including offset and hysteresis)
IRD = 5 mA or IFG = 5 mA
10
20
mV
0.15
0.3
V
30
μA
RD, FG
VRD = 16 V or VFG = 16 V
During drive
4
10
14
During lock protection
4
10
14
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5
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f = 25 kHz (CP = 100 pF)
ON duty large
VTH voltage
4.55 V
RMI voltage
CPWM
1.65 V
ON duty small
PWM-IN disconnected
0V
Rotation set to
minimum speed
(stop mode)
PWM control
variable speed
Low speed
Full speed
High speed
12 V
VCC
0V
FG
A.
Minimum
speed
setting
(stop)
mode
PWM-IN input is filtered to generate the VTH voltage. At low speed, the fan rotates with the minimum speed set with
RMI during low speed. If the minimum speed is not set (RMI = 6VREG), the fan stops.
B.
Low
↔
high
speed
mode
PWM control is made through comparison of oscillation and VTH voltages with CPWM changing between 1.6 V ↔ 4.6
V.
Upper and lower TRs are turned ON when the VTH voltage is greater. The upper output TR is turned OFF when the
VTH voltage is lower, and the coil current is regenerated in the lower TR. Therefore, as the VTH voltage lowers, the
output ON duty increases, increasing the coil current and raising the motor speed. The rotation speed is fed back by
the FG output.
C.
Full
speed
mode
The full-speed mode becomes effective with the VTH voltage of 1.65 V or less. (VTH must be equal to GND when the
speed control is not used.)
D.
PWM-IN
input
disconnection
mode
When the PWM-IN input pin is disconnected, VTH becomes 1.65 V or less and the output enables full drive at 100%.
The fan runs at full speed (see Figure 3).
Figure 1. Control Timing
6
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6.6 Typical Characteristics
6.5
6VREGOUT (V)
6
5.5
5
4.5
6VREG Output-9V
6VREG Output-12V
6VREG Output-15V
4
0
5
10
15
20
Output Current (mA)
25
30
D001
Figure 2. 6VREGOUT Load Regulation
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7 Detailed Description
7.1 Overview
The TMP814 device is a single phase bipolar predriver which uses the hall sensor & speed control inputs for
driving the single phase motor connected through H Bridge. The predriver outputs are designed for driving top
side P-type devices and bottom side N-channel FETs in the bridge. Multiple protections like overcurrent, softstart, speed control, lock detect, speed feedback and minimum speed are incorporated in the device. The circuit
can be used for driving the 24-V or 48-V system using a VOVER pin, which protects the VCC to be less than the
limit of 18 V.
7.2 Functional Block Diagram
CT
Discharge Circuit
0.47 µF
to 1 µF
FG
RD
Discharge
Pulse
VCC
6VREG
6VREG
OUT1N
OUT1P
ROFF
HB
Hall
Hall Bias
Controller
Hysteresis
Amplifier
IN+
IN–
OUT2N
OUT2P
Thermal Shutdown
Oscillator
RMI VTH
CPWM
VLIM SENSE
SGND
7.3 Feature Description
7.3.1 Speed Control
The speed control functionality is obtained by VTH pin of the device. For pulsed inputs user can supply a 20 kHz100 kHz frequency input (20 kHz to 50 kHz recommended on the pin with a current limiting resistor in between. If
not used, this pin needs to be connected to ground for full speed.
8
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Feature Description (continued)
7.3.2 Constant Voltage Bias
Constant Voltage Bias is provided through VOVER Pin. This must be used for applications of 24 V and 48 V.
See Figure 3. This drive limits the VCC under permissible values even when Vm > 18 V. Leave this pin open
when not in use.
7.3.3 Soft-Start
Soft-Start Time can be using the ROFF pin. Connect 6 to 6VREG is not used.
7.3.4 Lock Detection
When the rotor is locked by external means or load conditions, The lock detection feature helps to protect the
circuit by not allowing the current to rise beyond control. A hiccup mechanism is also provided. The lock
detection is enabled by a connection to the lock detection capacitor. When the pin voltage rises to 1.2 V, the
constant current charge and discharge circuits cause the drive to and enables it back when voltage reaches 0. If
lock detection feature is not desired in the application, then this pin must be connected to ground.
7.3.5 Current Limit
Current limit resistor is connected in a return path of H Bridge connection. This input is connected to the SENSE
pin where the Current is limited when the voltage across this resistor crosses the voltage at VLIM Pin. If not
used, this pin needs to be connected to ground.
7.3.6 Minimum Speed Setting
Minimum speed setting feature is used with the RMI pin in the device. Connect to 6VREG with a pullup resistor if
not used.
7.3.7 Speed Output
The speed of the motor while running can be observed at the FG pin which is an open collector output and
needs to be pulled high for using it.
7.3.8 Drive Frequency Selection
The P channel switches in the device are switched with higher frequency whose duty cycle is decided by the
speed control input. The frequency of the operation can be decided by the capacitor connected at the CPWM
pin. As this is used also for the current limiting canceling signal, be sure to connect the capacitor even when
speed control is not used.
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7.4 Device Functional Modes
Table 1. Truth Table (1)
(1)
IN–
IN+
CT
OUT1P
OUT1N
OUT2P
OUT2N
FG
RD
MODE
H
L
L
L
–
–
H
L
L
OUT1 → 2 drive
–
H
L
–
OFF
H
OFF
–
–
H
L
–
H
OFF
–
OFF
L
H
H
L
L
H
Lock protection
During full-speed rotation
VTH
10
OUT2 → 1 drive
OFF
CPWM
L
H
H
L
IN–
IN+
OUT1P
OUT1N
OUT2P
OUT2N
MODE
H
L
L
–
–
H
OUT1 → 2 Drive
L
H
–
H
L
–
OUT2 → 1 Drive
H
L
OFF
–
–
H
L
H
–
H
OFF
–
During rotation,
regeneration in lower TR
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TMP814 device requires few external components for the features described in Feature Description. The
device needs a 1-uF or more capacitor connected at VCC. The device generates 6-V regulated output which can
be used for pullups in the circuit as well as the Hall sensor.
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8.2 Typical Applications
8.2.1 12-V Sample Application Circuit
CB = ~ 0.022 µF
RB = 10 kW
ROUT = 100 W
SOP8901
RF
RFG, RRD = 10 kW to 100 W
VCC
6VREG
H
VOVER
RD
HB
FG
IN–
SENSE
IN+
VLIM
RMI
6VREG
ROFF
R = 0 to 5 kW
OUT1P
VTH
OUT1N
PWM-IN
CPWM
CP = 100 pF
25 kHz
OUT2P
CT
OUT2N
SGND
CT = 0.47 µF
Figure 3. 12-V Sample Application Circuit
8.2.1.1 Design Requirements
Input Voltage: 6 to 16 V
VCC capacitor: 1 uF or more
H Bridge top side: P-channel FETs
H Bridge bottom side: N-channel FETs
8.2.1.2 Detailed Design Procedure
Pins:
• CPWM Capacitor: 100 pF for 25 kHz switching or appropriate.
12
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Typical Applications (continued)
•
•
•
•
•
•
•
•
•
VTH Pin connected to Ground for Full speed or supplied with pulsed input.
RMI Pin Pulled high to 6VREG output or external connection if required.
ROFF pulled to 6VREG.
6VREG connected to Hall Sensor. Hall sensor differential inputs connected to IN+ and IN-.
SENSE pin or GND.
CT connected to Lock Detection capacitor (0.47uF or calculated values)or to GND.
Drive outputs connected to the Gates of the H bridge switches.
Pullup on FG.
VLIM and VOVER kept open.
Power Supply:
• Make sure the power supply has set with sufficient current limit at the decided at the motor voltage.
Build the circuit with previously recommended connections at the pins.
Test the motor circuit with hardware connected to it.
8.2.1.3 Application Curves
Figure 4. Start-up at 12 V
Figure 5. Motor Outputs and Phase Current at 100% Duty
Cycle
Figure 6. Lock Detection Waveform
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Typical Applications (continued)
8.2.2 24-V/48-V Sample Application Circuit
The device can be used for Vm >Vcc (that is, 24/48 V). The VOVER pin and associated circuit help keep VCC of
the device below the VCC limits of the device, allowing Vm to go at 24/48V.
RF
VCC
6VREG
H
VOVER
RD
HB
FG
IN–
SENSE
IN+
VLIM
RMI
6VREG
ROFF
VTH
OUT1P
OUT1N
PWM-IN
CP = 100 pF
CPWM
OUT2P
CT
OUT2N
SGND
CT = 0.47 µF
Figure 7. 24-V/48-V Sample Application Circuit
14
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9 Power Supply Recommendations
For testing purposes, a current limited source can be connected with voltage from 6 V to 16 V on printed-circuitboard. Use a 1-µF capacitor (minimum) to take care of load transient requirements.
10 Layout
10.1 Layout Guidelines
Connect a minimum of 1-µF or greater capacitor close to the power supply pins. Connect other capacitors and
resistors according to the calculations (for example, the pullup resistors should be connected at various pins, the
c capacitors should be connected at lock detect, and so forth.)
10.2 Layout Example
>1uF
OUT2P
OUT1P
OUT2N
OUT1N
VCC
VOVER
SGND
VLIM
TMP814
SENSE
6VREG
6VREG
RMI
ROFF
VTH
CT
CPWM
IN+
FG
HB
IN±
GND
Figure 8. Recommended Layout
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11 Device and Documentation Support
11.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
16
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PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
B0 W
Reel
Diameter
Cavity
A0
B0
K0
W
P1
A0
Dimension designed to accommodate the component width
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1
Q2
Q1
Q2
Q3
Q4
Q3
Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
TMP814PWR
Package Package Pins
Type Drawing
TSSOP
PW
20
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
16.4
Pack Materials-Page 1
6.95
B0
(mm)
K0
(mm)
P1
(mm)
7.1
1.6
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TMP814PWR
TSSOP
PW
20
2000
356.0
356.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0020A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
A
SEATING
PLANE
C
6.6
TYP
6.2
0.1 C
PIN 1 INDEX AREA
18X 0.65
20
1
2X
5.85
6.6
6.4
NOTE 3
10
11
B
20X
4.5
4.3
NOTE 4
0.30
0.19
0.1
1.2 MAX
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
A 20
TYPICAL
4220206/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
20X (1.5)
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
11
10
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220206/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0020A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
20X (1.5)
SYMM
(R0.05) TYP
1
20
20X (0.45)
SYMM
18X (0.65)
10
11
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220206/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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