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TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
TMS320F2802x Piccolo™ Microcontrollers
1 Device Overview
1.1
Features
1
• High-Efficiency 32-Bit CPU (TMS320C28x)
– 60 MHz (16.67-ns Cycle Time)
– 50 MHz (20-ns Cycle Time)
– 40 MHz (25-ns Cycle Time)
– 16 × 16 and 32 × 32 MAC Operations
– 16 × 16 Dual MAC
– Harvard Bus Architecture
– Atomic Operations
– Fast Interrupt Response and Processing
– Unified Memory Programming Model
– Code-Efficient (in C/C++ and Assembly)
• Endianness: Little Endian
• Low Cost for Both Device and System:
– Single 3.3-V Supply
– No Power Sequencing Requirement
– Integrated Power-on and Brown-out Resets
– Small Packaging, as Low as 38-Pin Available
– Low Power
– No Analog Support Pins
• Clocking:
– Two Internal Zero-Pin Oscillators
– On-Chip Crystal Oscillator and External Clock
Input
– Watchdog Timer Module
– Missing Clock Detection Circuitry
• Up to 22 Individually Programmable, Multiplexed
GPIO Pins With Input Filtering
• Peripheral Interrupt Expansion (PIE) Block That
Supports All Peripheral Interrupts
• Three 32-Bit CPU Timers
• Independent 16-Bit Timer in Each Enhanced Pulse
Width Modulator (ePWM)
1.2
•
•
•
•
• On-Chip Memory
– Flash, SARAM, OTP, Boot ROM Available
• Code-Security Module
• 128-Bit Security Key and Lock
– Protects Secure Memory Blocks
– Prevents Firmware Reverse Engineering
• Serial Port Peripherals
– One Serial Communications Interface (SCI)
Universal Asynchronous Receiver/Transmitter
(UART) Module
– One Serial Peripheral Interface (SPI) Module
– One Inter-Integrated-Circuit (I2C) Module
• Enhanced Control Peripherals
– ePWM
– High-Resolution PWM (HRPWM)
– Enhanced Capture (eCAP) Module
– Analog-to-Digital Converter (ADC)
– On-Chip Temperature Sensor
– Comparator
• Advanced Emulation Features
– Analysis and Breakpoint Functions
– Real-Time Debug Through Hardware
• Package Options
– 38-Pin DA Thin Shrink Small-Outline Package
(TSSOP)
– 48-Pin PT Low-Profile Quad Flatpack (LQFP)
• Temperature Options
– T: –40°C to 105°C
– S: –40°C to 125°C
– Q: –40°C to 125°C
(AEC Q100 Qualification for Automotive
Applications)
Applications
Appliances
Building Automation
Electric Vehicle/Hybrid Electric Vehicle (EV/HEV)
Powertrain
Factory Automation
•
•
•
•
•
Grid Infrastructure
Medical, Healthcare and Fitness
Motor Drives
Power Delivery
Telecom Infrastructure
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
1.3
www.ti.com
Description
C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closedloop performance in real-time control applications such as industrial motor drives; solar inverters and
digital power; electrical vehicles and transportation; motor control; and sensing and signal processing. The
C2000 line includes the Delfino™ Premium Performance family and the Piccolo™ Entry Performance
family.
The F2802x Piccolo™ family of microcontrollers provides the power of the C28x core coupled with highly
integrated control peripherals in low pin-count devices. This family is code-compatible with previous C28xbased code, and also provides a high level of analog integration.
An internal voltage regulator allows for single-rail operation. Enhancements have been made to the
HRPWM to allow for dual-edge control (frequency modulation). Analog comparators with internal 10-bit
references have been added and can be routed directly to control the PWM outputs. The ADC converts
from 0 to 3.3-V fixed full-scale range and supports ratio-metric VREFHI/VREFLO references. The ADC
interface has been optimized for low overhead and latency.
To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.
Device Information (1)
PACKAGE
BODY SIZE
TMS320F28027PT
PART NUMBER
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28026PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28023PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28022PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28021PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28020PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F280200PT
LQFP (48)
7.0 mm × 7.0 mm
TMS320F28027DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F28026DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F28023DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F28022DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F28021DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F28020DA
TSSOP (38)
12.5 mm × 6.2 mm
TMS320F280200DA
TSSOP (38)
12.5 mm × 6.2 mm
(1)
2
For more information on these devices, see Mechanical, Packaging, and Orderable Information.
Device Overview
Copyright © 2008–2019, Texas Instruments Incorporated
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Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021
TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
1.4
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Functional Block Diagram
Memory Bus
Functional Block Diagram shows the functional block diagram for the device.
M0
SARAM 1K × 16
(0-wait)
OTP 1K × 16
Secure
SARAM
1K/3K/4K × 16
(0-wait)
Secure
M1
SARAM 1K × 16
(0-wait)
Code
Security
Module
FLASH
8K/16K/32K × 16
Secure
Boot-ROM
8K × 16
(0-wait)
OTP/Flash
Wrapper
PSWD
Memory Bus
TRST
TCK
TDI
TMS
TDO
GPIO
32-Bit Peripheral Bus
COMP1OUT
COMP2OUT
MUX
COMP1A
COMP1B
COMP2A
COMP2B
COMP
C28x
32-Bit CPU
3 External Interrupts
PIE
CPU Timer 0
AIO
CPU Timer 1
MUX
CPU Timer 2
OSC1,
OSC2,
Ext,
PLL,
LPM,
WD
XCLKIN
X1
X2
LPM Wakeup
XRS
ADC
A7:0
Memory Bus
POR/
BOR
B7:0
ePWM
eCAP
From
COMP1OUT,
COMP2OUT
ECA Px
EPWMSYNCO
EPWMxB
EPWMxA
HRPWM
TZx
SCLx
SDAx
I2C
(4L FIFO)
SPISTEx
SPICLKx
SPISOMIx
SPISIMOx
SCITXDx
SCIRXDx
SPI
(4L FIFO)
VREG
32-Bit Peripheral Bus
32-Bit Peripheral Bus
EPWMSYNCI
16-Bit Peripheral Bus
SCI
(4L FIFO)
GPIO
Mux
GPIO MUX
Copyright © 2017, Texas Instruments Incorporated
A.
Not all peripheral pins are available at the same time due to multiplexing.
Figure 1-1. Functional Block Diagram
Device Overview
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TMS320F28020 TMS320F280200
Copyright © 2008–2019, Texas Instruments Incorporated
3
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
www.ti.com
Table of Contents
1
Device Overview ......................................... 1
1.1
Features .............................................. 1
1.2
Applications ........................................... 1
1.3
Description ............................................ 2
1.4
Functional Block Diagram
Memory Maps
17
............................................ 37
...................................... 45
6.3
Register Maps ....................................... 53
6.4
Device Emulation Registers ......................... 54
6.5
VREG/BOR/POR .................................... 55
6.6
System Control ...................................... 57
6.7
Low-power Modes Block ............................ 65
6.8
Interrupts ............................................ 66
6.9
Peripherals .......................................... 71
Applications, Implementation, and Layout ...... 122
7.1
TI Design or Reference Design .................... 122
Device and Documentation Support .............. 123
8.1
Getting Started ..................................... 123
17
8.2
Device and Development Support Tool
Nomenclature ...................................... 123
23
8.3
Tools and Software ................................ 124
24
8.4
Documentation Support ............................ 126
25
Emulator Connection Without Signal Buffering for
the MCU ............................................. 25
8.5
Related Links
8.6
Community Resources............................. 127
8.7
Trademarks ........................................ 127
..............................
Test Load Circuit ...................................
Power Sequencing ..................................
Clock Specifications .................................
26
8.8
Electrostatic Discharge Caution
26
8.9
Glossary............................................ 127
...........................
3
Terminal Configuration and Functions .............. 9
Related Products ..................................... 8
4.1
Pin Diagrams ......................................... 9
4.2
Signal Descriptions .................................. 11
Specifications ........................................... 16
........................
ESD Ratings – Automotive ..........................
ESD Ratings – Commercial .........................
Recommended Operating Conditions ...............
Power Consumption Summary ......................
Electrical Characteristics ............................
Thermal Resistance Characteristics ................
Thermal Design Considerations ....................
Absolute Maximum Ratings
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
Parameter Information
7
16
16
8
18
27
30
9
Table of Contents
......................................
...................
127
127
Mechanical, Packaging, and Orderable
Information ............................................. 128
9.1
4
34
Overview
4
5.1
........................................
6.2
Revision History ......................................... 5
Device Comparison ..................................... 6
3.1
Flash Timing
Detailed Description ................................... 37
6.1
2
3
5
5.14
6
Packaging Information ............................. 128
Copyright © 2008–2019, Texas Instruments Incorporated
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Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021
TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
2 Revision History
Changes from December 15, 2017 to January 8, 2019 (from L Revision (December 2017) to M Revision)
•
•
•
•
•
•
•
•
•
Page
Global: Replaced individual peripheral guides with the TMS320F2802x,TMS320F2802xx Piccolo Technical
Reference Manual. ................................................................................................................... 1
Section 1.3 (Description): Updated section. ...................................................................................... 2
Section 3.1 (Related Products): Updated section. ............................................................................... 8
Table 4-1 (Signal Descriptions): Updated DESCRIPTION of XRS. .......................................................... 11
Table 5-11 (Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics): Updated "Oscillator frequency
will vary over temperature ..." footnote: Replaced the controlSUITE example with C2000Ware. ........................ 32
Section 6.1.8 (Boot ROM): Updated "The Boot ROM is factory-programmed ..." paragraph. ............................ 39
Figure 6-13 (External and PIE Interrupt Sources): Updated figure. .......................................................... 66
Section 8.3 (Tools and Software): Added "C2000Ware for C2000 MCUs" and "UniFlash Standalone Flash Tool" .. 124
Section 8.4 (Documentation Support): Replaced individual peripheral guides with the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual. Updated section. ............................ 126
Revision History
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Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021
TMS320F28020 TMS320F280200
Copyright © 2008–2019, Texas Instruments Incorporated
5
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
www.ti.com
3 Device Comparison
Table 3-1 lists the features of the TMS320F2802x devices.
Table 3-1. Device Comparison
FEATURE
28027
28027F (2)
(60 MHz)
TYPE (1)
38-Pin DA
TSSOP
Package Type
28026
28026F (2)
(60 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
28023
(50 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
28022
(50 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
28021
(40 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
28020
(40 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
280200
(40 MHz)
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
Instruction cycle
–
16.67 ns
16.67 ns
20 ns
20 ns
25 ns
25 ns
25 ns
On-chip flash (16-bit word)
–
32K
16K
32K
16K
32K
16K
8K
On-chip SARAM (16-bit word)
–
6K
6K
6K
6K
5K
3K
3K
Code security for on-chip
flash/SARAM/OTP blocks
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Boot ROM (8K x 16)
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
One-time programmable (OTP) ROM (16bit word)
–
1K
1K
1K
1K
1K
1K
1K
ePWM channels
1
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
8 (ePWM1/2/3/4)
eCAP inputs
0
1
1
1
1
1
1
–
Watchdog timer
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
MSPS
Conversion Time
12-Bit ADC
Channels
3
4.6
4.6
3
3
2
2
2
216.67 ns
216.67 ns
260 ns
260 ns
500 ns
500 ns
500 ns
7
Temperature Sensor
Dual Sample-and-Hold
13
7
13
7
13
7
13
7
13
7
13
7
13
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
32-Bit CPU timers
–
3
3
3
3
3
3
3
High-resolution ePWM Channels
1
4 (ePWM1A/2A/3A/4A)
4 (ePWM1A/2A/3A/4A)
4 (ePWM1A/2A/3A/4A)
4 (ePWM1A/2A/3A/4A)
–
–
Comparators w/ Integrated DACs
0
Inter-integrated circuit (I2C)
0
1
1
1
1
1
1
1
Serial Peripheral Interface (SPI)
1
1
1
1
1
1
1
1
Serial Communications Interface (SCI)
0
1
1
1
1
1
1
Digital (GPIO)
–
Analog (AIO)
–
1
2
20
22
1
2
20
22
1
2
20
22
1
2
20
22
1
2
20
22
1
–
2
20
1
2
1
22
20
22
I/O pins (shared)
6
6
6
6
6
6
6
External interrupts
–
3
3
3
3
3
3
3
Supply voltage (nominal)
–
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
(1)
(2)
6
A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the
basic functionality of the module. These device-specific differences are listed in the C2000 Real-Time Control Peripherals Reference Guide and in the TMS320F2802x,TMS320F2802xx
Piccolo Technical Reference Manual.
TMS320F28027F and TMS320F28026F are InstaSPIN-FOC™-enabled MCUs. For more information, see Section 8.4 for a list of InstaSPIN Technical Reference Manuals.
Device Comparison
Copyright © 2008–2019, Texas Instruments Incorporated
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TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 3-1. Device Comparison (continued)
FEATURE
TYPE (1)
Package Type
Temperature
options
(3)
28027
28027F (2)
(60 MHz)
28026
28026F (2)
(60 MHz)
28023
(50 MHz)
28022
(50 MHz)
28021
(40 MHz)
28020
(40 MHz)
280200
(40 MHz)
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
38-Pin DA
TSSOP
48-Pin PT
LQFP
T: –40°C to 105°C
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
S: –40°C to 125°C
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Q: –40°C to 125°C (3)
–
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
–
–
–
–
–
–
The letter Q refers to AEC Q100 qualification for automotive applications.
Copyright © 2008–2019, Texas Instruments Incorporated
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TMS320F28020 TMS320F280200
Device Comparison
7
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
3.1
www.ti.com
Related Products
For information about other devices in the Piccolo family of products, see the following links:
Original Piccolo™ series:
TMS320F2802x Piccolo™ Microcontrollers
The F2802x series is the original Piccolo and offers the lowest pin-count and Flash memory size options.
InstaSPIN-FOC™ versions are available.
TMS320F2803x Piccolo™ Microcontrollers
The F2803x series increases the pin-count and memory size options. The F2803x series also introduces
the parallel control law accelerator (CLA) option.
TMS320F2805x Piccolo™ Microcontrollers
The F2805x series is similar to the F2803x series but adds on-chip programmable gain amplifiers (PGAs).
InstaSPIN-FOC and InstaSPIN-MOTION™ versions are available.
TMS320F2806x Piccolo™ Microcontrollers
The F2806x series is the first to include a floating-point unit (FPU). The F2806x series also increases the
pin-count, memory size options, and the quantity of peripherals. InstaSPIN-FOC™ and InstaSPINMOTION™ versions are available.
Newest Piccolo™ series:
TMS320F2807x Piccolo™ Microcontrollers
The F2807x series is the highest-end Piccolo with the most performance, largest pin counts, flash memory
sizes, and peripheral options. The F2807x series includes the latest generation of accelerators, ePWM
peripherals, and analog technology.
TMS320F28004x Piccolo™ Microcontrollers
The F28004x series is a reduced version of the F2807x series with the latest generational enhancements.
The F28004x series is the best roadmap option for those using the F2806x series. InstaSPIN-FOC and
configurable logic block (CLB) versions are available.
8
Device Comparison
Copyright © 2008–2019, Texas Instruments Incorporated
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Product Folder Links: TMS320F28027 TMS320F28026 TMS320F28023 TMS320F28022 TMS320F28021
TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
4 Terminal Configuration and Functions
4.1
Pin Diagrams
36
35
34
33
32
31
30
29
28
27
26
25
GPIO33/SCLA/EPWMSYNCO/ADCSOCBO
VDDIO
VREGENZ
VSS
VDD
GPIO32/SDAA/EPWMSYNCI/ADCSOCAO
TEST
GPIO0/EPWM1A
GPIO1/EPWM1B/COMP1OUT
GPIO16/SPISIMOA/TZ2
GPIO17/SPISOMIA/TZ3
GPIO19/XCLKIN/SPISTEA/SCIRXDA/ECAP1
Figure 4-1 shows the 48-pin PT low-profile quad flatpack (LQFP) pin assignments. Figure 4-2 shows the
38-pin DA thin shrink small-outline package (TSSOP) pin assignments.
GPIO2/EPWM2A
GPIO3/EPWM2B/COMP2OUT
GPIO4/EPWM3A
GPIO5/EPWM3B/ECAP1
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO
GPIO7/EPWM4B/SCIRXDA
VDD
VSS
24
23
22
21
20
19
18
17
16
15
14
13
GPIO18/SPICLKA/SCITXDA/XCLKOUT
GPIO38/XCLKIN (TCK)
GPIO37 (TDO)
GPIO36 (TMS)
GPIO35 (TDI)
GPIO34/COMP2OUT
ADCINB7
ADCINB6/AIO14
ADCINB4/COMP2B/AIO12
ADCINB3
ADCINB2/COMP1B/AIO10
ADCINB1
TRST
XRS
ADCINA6/AIO6
ADCINA4/COMP2A/AIO4
ADCINA7
ADCINA3
ADCINA1
ADCINA2/COMP1A/AIO2
ADCINA0/VREFHI
VDDA
VSSA/VREFLO
GPIO29/SCITXDA/SCLA/TZ3
1
2
3
4
5
6
7
8
9
10
11
12
X1
X2
GPIO12/TZ1/SCITXDA
GPIO28/SCIRXDA/SDAA/TZ2
37
38
39
40
41
42
43
44
45
46
47
48
Figure 4-1. 2802x 48-Pin PT LQFP (Top View)
Terminal Configuration and Functions
Submit Documentation Feedback
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TMS320F28020 TMS320F280200
Copyright © 2008–2019, Texas Instruments Incorporated
9
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
VDD
VSS
VREGENZ
VDDIO
GPIO2/EPWM2A
GPIO3/EPWM2B
GPIO4/EPWM3A
GPIO5/EPWM3B/ECAP1
GPIO6/EPWM4A/EPWMSYNCI/EPWMSYNCO
GPIO7/EPWM4B/SCIRXDA
VDD
VSS
GPIO12/TZ1/SCITXDA
GPIO28/SCIRXDA/SDAA/TZ2
GPIO29/SCITXDA/SCLA/TZ3
TRST
XRS
ADCINA6/AIO6
ADCINA4/AIO4
www.ti.com
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
TEST
GPIO0/EPWM1A
GPIO1/EPWM1B/COMP1OUT
GPIO16/SPISIMOA/TZ2
GPIO17/SPISOMIA/TZ3
GPIO19/XCLKIN/SPISTEA/SCIRXDA/ECAP1
GPIO18/SPICLKA/SCITXDA/XCLKOUT
GPIO38/XCLKIN (TCK)
GPIO37 (TDO)
GPIO36 (TMS)
GPIO35 (TDI)
GPIO34
ADCINB6/AIO14
ADCINB4/AIO12
ADCINB2/COMP1B/AIO10
VSSA/VREFLO
VDDA
ADCINA0/VREFHI
ADCINA2/COMP1A/AIO2
Figure 4-2. 2802x 38-Pin DA TSSOP (Top View)
10
Terminal Configuration and Functions
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TMS320F28021, TMS320F28020, TMS320F280200
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4.2
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Signal Descriptions
Table 4-1 describes the signals. With the exception of the JTAG pins, the GPIO function is the default at
reset, unless otherwise mentioned. The peripheral signals that are listed under them are alternate
functions. Some peripheral functions may not be available in all devices. See Table 3-1 for details. Inputs
are not 5-V tolerant. All GPIO pins are I/O/Z and have an internal pullup, which can be selectively
enabled/disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups on the PWM
pins are not enabled at reset. The pullups on other GPIO pins are enabled upon reset. The AIO pins do
not have an internal pullup.
NOTE
When the on-chip VREG is used, the GPIO19, GPIO34, GPIO35, GPIO36, GPIO37, and
GPIO38 pins could glitch during power up. This potential glitch will finish before the boot
mode pins are read and will not affect boot behavior. If glitching is unacceptable in an
application, 1.8 V could be supplied externally. Alternatively, adding a current-limiting resistor
(for example, 470 Ω) in series with these pins and any external driver could be considered to
limit the potential for degradation to the pin and/or external circuitry. There is no powersequencing requirement when using an external 1.8-V supply. However, if the 3.3-V
transistors in the level-shifting output buffers of the I/O pins are powered before the 1.8-V
transistors, it is possible for the output buffers to turn on, causing a glitch to occur on the pin
during power up. To avoid this behavior, power the VDD pins before or with the VDDIO pins,
ensuring that the VDD pins have reached 0.7 V before the VDDIO pins reach 0.7 V.
Table 4-1. Signal Descriptions (1)
TERMINAL
NAME
PT
PIN NO.
DA
PIN NO.
I/O/Z
DESCRIPTION
JTAG
TRST
2
16
I
JTAG test reset with internal pulldown. TRST, when driven high, gives the scan
system control of the operations of the device. If this signal is not connected or
driven low, the device operates in its functional mode, and the test reset signals
are ignored.
NOTE: TRST is an active high test pin and must be maintained low at all times
during normal device operation. An external pulldown resistor is required on this
pin. The value of this resistor should be based on drive strength of the debugger
pods applicable to the design. A 2.2-kΩ resistor generally offers adequate
protection. Because this is application-specific, TI recommends validating each
target board for proper operation of the debugger and the application. (↓)
TCK
See GPIO38
I
See GPIO38. JTAG test clock with internal pullup (↑)
TMS
See GPIO36
I
See GPIO36. JTAG test-mode select (TMS) with internal pullup. This serial control
input is clocked into the TAP controller on the rising edge of TCK. (↑)
TDI
See GPIO35
I
See GPIO35. JTAG test data input (TDI) with internal pullup. TDI is clocked into
the selected register (instruction or data) on a rising edge of TCK. (↑)
TDO
See GPIO37
O/Z
See GPIO37. JTAG scan out, test data output (TDO). The contents of the
selected register (instruction or data) are shifted out of TDO on the falling edge of
TCK.
(8-mA drive)
I/O
Test Pin. Reserved for TI. Must be left unconnected.
FLASH
TEST
(1)
30
38
I = Input, O = Output, Z = High Impedance, OD = Open Drain, ↑ = Pullup, ↓ = Pulldown
Terminal Configuration and Functions
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11
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
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Table 4-1. Signal Descriptions(1) (continued)
TERMINAL
NAME
PT
PIN NO.
DA
PIN NO.
I/O/Z
DESCRIPTION
O/Z
See GPIO18. Output clock derived from SYSCLKOUT. XCLKOUT is either the
same frequency, one-half the frequency, or one-fourth the frequency of
SYSCLKOUT. This is controlled by bits 1:0 (XCLKOUTDIV) in the XCLK register.
At reset, XCLKOUT = SYSCLKOUT/4. The XCLKOUT signal can be turned off by
setting XCLKOUTDIV to 3. The mux control for GPIO18 must also be set to
XCLKOUT for this signal to propogate to the pin.
I
See GPIO19 and GPIO38. External oscillator input. Pin source for the clock is
controlled by the XCLKINSEL bit in the XCLK register, GPIO38 is the default
selection. This pin feeds a clock from an external 3.3-V oscillator. In this case, the
X1 pin, if available, must be tied to GND and the on-chip crystal oscillator must be
disabled through bit 14 in the CLKCTL register. If a crystal/resonator is used, the
XCLKIN path must be disabled by bit 13 in the CLKCTL register.
NOTE: Designs that use the GPIO38/TCK/XCLKIN pin to supply an external clock
for normal device operation may need to incorporate some hooks to disable this
path during debug using the JTAG connector. This is to prevent contention with
the TCK signal, which is active during JTAG debug sessions. The zero-pin internal
oscillators may be used during this time to clock the device.
CLOCK
XCLKOUT
XCLKIN
See GPIO18
See GPIO19 and GPIO38
X1
45
–
I
On-chip 1.8-V crystal-oscillator input. To use this oscillator, a quartz crystal or a
ceramic resonator must be connected across X1 and X2. In this case, the XCLKIN
path must be disabled by bit 13 in the CLKCTL register. If this pin is not used, it
must be tied to GND. (I)
X2
46
–
O
On-chip crystal-oscillator output. A quartz crystal or a ceramic resonator must be
connected across X1 and X2. If X2 is not used, it must be left unconnected. (O)
RESET
Device Reset (in) and Watchdog Reset (out). Piccolo devices have a built-in
power-on reset (POR) and brown-out reset (BOR) circuitry. During a power-on or
brown-out condition, this pin is driven low by the device. An external circuit may
also drive this pin to assert a device reset. This pin is also driven low by the MCU
when a watchdog reset occurs. During watchdog reset, the XRS pin is driven low
for the watchdog reset duration of 512 OSCCLK cycles. A resistor with a value
from 2.2 kΩ to 10 kΩ should be placed between XRS and VDDIO. If a capacitor is
placed between XRS and VSS for noise filtering, it should be 100 nF or smaller.
These values will allow the watchdog to properly drive the XRS pin to VOL within
512 OSCCLK cycles when the watchdog reset is asserted. Regardless of the
source, a device reset causes the device to terminate execution. The program
counter points to the address contained at the location 0x3F FFC0. When reset is
deactivated, execution begins at the location designated by the program counter.
The output buffer of this pin is an open-drain device with an internal pullup. (↑) If
this pin is driven by an external device, it should be done using an open-drain
device.
XRS
3
17
I/OD
ADCINA7
6
–
I
ADC Group A, Channel 7 input
I
ADC Group A, Channel 6 input
ADC, COMPARATOR, ANALOG I/O
ADCINA6
AIO6
4
18
5
19
ADCINA4
COMP2A
AIO4
I/O
I
ADC Group A, Channel 4 input
I
Comparator Input 2A (available in 48-pin device only)
I/O
ADCINA3
7
–
ADCINA2
COMP1A
9
20
8
–
AIO2
ADCINA0
Digital AIO 4
I
ADC Group A, Channel 3 input
I
ADC Group A, Channel 2 input
I
Comparator Input 1A
I/O
ADCINA1
Digital AIO 6
Digital AIO 2
I
ADC Group A, Channel 1 input
I
ADC Group A, Channel 0 input
VREFHI
10
21
I
ADC External Reference High – only used when in ADC external reference mode.
See Section 6.9.1.1, ADC.
ADCINB7
18
–
I
ADC Group B, Channel 7 input
12
Terminal Configuration and Functions
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 4-1. Signal Descriptions(1) (continued)
TERMINAL
NAME
ADCINB6
AIO14
PT
PIN NO.
DA
PIN NO.
17
26
16
25
I/O/Z
I
I/O
ADCINB4
COMP2B
AIO12
ADCINB3
–
14
24
ADCINB2
COMP1B
AIO10
13
–
VDDA
11
22
12
23
32
1
43
11
35
4
Digital AIO 14
ADC Group B, Channel 4 input
I
Comparator Input 2B (available in 48-pin device only)
Digital AIO12
I
ADC Group B, Channel 3 input
I
ADC Group B, Channel 2 input
I
Comparator Input 1B
I/O
ADCINB1
ADC Group B, Channel 6 input
I
I/O
15
DESCRIPTION
I
Digital AIO 10
ADC Group B, Channel 1 input
CPU AND I/O POWER
VSSA
VREFLO
VDD
VDDIO
VSS
33
2
44
12
Analog Power Pin. Tie with a 2.2-µF capacitor (typical) close to the pin.
Analog Ground Pin
I
ADC External Reference Low (always tied to ground)
CPU and Logic Digital Power Pins. When using internal VREG, place one 1.2-µF
capacitor between each VDD pin and ground. Higher value capacitors may be
used.
Digital I/O Buffers and Flash Memory Power Pin. Single supply source when
VREG is enabled. Place a decoupling capacitor on this pin. The exact value
should be determined by the system voltage regulation solution.
Digital Ground Pins
VOLTAGE REGULATOR CONTROL SIGNAL
VREGENZ
34
3
I
Internal VREG Enable/Disable. Pull low to enable the internal voltage regulator
(VREG), pull high to disable VREG.
GPIO AND PERIPHERAL SIGNALS (2)
GPIO0
EPWM1A
–
I/O/Z
29
37
–
GPIO1
EPWM1B
–
36
–
I/O/Z
37
O
5
Enhanced PWM1 Output B
Direct output of Comparator 1
General-purpose input/output 2
Enhanced PWM2 Output A and HRPWM channel
–
–
–
GPIO3
EPWM2B
–
I/O/Z
38
6
COMP2OUT
(2)
General-purpose input/output 1
–
O
GPIO2
–
–
–
O
COMP1OUT
EPWM2A
Enhanced PWM1 Output A and HRPWM channel
–
I/O/Z
28
General-purpose input/output 0
O
O
General-purpose input/output 3
Enhanced PWM2 Output B
–
O
Direct output of Comparator 2 (available in 48-pin device only)
The GPIO function (shown in bold italics) is the default at reset. The peripheral signals that are listed under them are alternate functions.
For JTAG pins that have the GPIO functionality multiplexed, the input path to the GPIO block is always valid. The output path from the
GPIO block and the path to the JTAG block from a pin is enabled/disabled based on the condition of the TRST signal. See the System
Control chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual for details.
Terminal Configuration and Functions
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Table 4-1. Signal Descriptions(1) (continued)
TERMINAL
NAME
PT
PIN NO.
DA
PIN NO.
GPIO4
I/O/Z
I/O/Z
EPWM3A
–
39
7
O
DESCRIPTION
General-purpose input/output 4
Enhanced PWM3 output A and HRPWM channel
–
–
–
GPIO5
I/O/Z
EPWM3B
–
40
8
O
I/O
GPIO6
I/O/Z
EPWMSYNCI
41
9
EPWMSYNCO
GPIO7
SCIRXDA
42
10
Enhanced Capture input/output 1
General-purpose input/output 6
O
Enhanced PWM4 output A and HRPWM channel
I
External ePWM sync pulse input
O
External ePWM sync pulse output
I/O/Z
EPWM4B
Enhanced PWM3 output B
–
ECAP1
EPWM4A
General-purpose input/output 5
General-purpose input/output 7
O
Enhanced PWM4 output B
I
SCI-A receive data
–
–
GPIO12
TZ1
SCITXDA
I/O/Z
47
13
General-purpose input/output 12
I
Trip Zone input 1
O
SCI-A transmit data
–
–
GPIO16
SPISIMOA
–
I/O/Z
27
35
TZ2
I/O
SPISOMIA
–
I/O/Z
26
34
TZ3
I/O
Trip Zone input 2
General-purpose input/output 17
SPI-A slave out, master in
–
I
GPIO18
SPI slave in, master out
–
I
GPIO17
General-purpose input/output 16
I/O/Z
Trip zone input 3
General-purpose input/output 18
SPICLKA
I/O
SPI-A clock input/output
SCITXDA
O
SCI-A transmit
XCLKOUT
O/Z
Output clock derived from SYSCLKOUT. XCLKOUT is either the same frequency,
one-half the frequency, or one-fourth the frequency of SYSCLKOUT. This is
controlled by bits 1:0 (XCLKOUTDIV) in the XCLK register. At reset, XCLKOUT =
SYSCLKOUT/4. The XCLKOUT signal can be turned off by setting XCLKOUTDIV
to 3. The mux control for GPIO18 must also be set to XCLKOUT for this signal to
propogate to the pin.
GPIO19
I/O/Z
General-purpose input/output 19
XCLKIN
I
24
25
32
33
SPISTEA
I/O
SCIRXDA
I
External Oscillator Input. The path from this pin to the clock block is not gated by
the mux function of this pin. Care must be taken not to enable this path for
clocking if it is being used for the other periperhal functions
SPI-A slave transmit enable input/output
SCI-A receive
ECAP1
I/O
Enhanced Capture input/output 1
GPIO28
I/O/Z
General-purpose input/output 28
SCIRXDA
SDAA
48
14
TZ2
14
I
I/OD
I
Terminal Configuration and Functions
SCI receive data
I2C data open-drain bidirectional port
Trip zone input 2
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TMS320F28021, TMS320F28020, TMS320F280200
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 4-1. Signal Descriptions(1) (continued)
TERMINAL
NAME
PT
PIN NO.
DA
PIN NO.
GPIO29
SCITXDA
SCLA
I/O/Z
I/O/Z
1
15
O
I/OD
TZ3
I
DESCRIPTION
General-purpose input/output 29.
SCI transmit data
I2C clock open-drain bidirectional port
Trip zone input 3
GPIO32
I/O/Z
General-purpose input/output 32
SDAA
I/OD
I2C data open-drain bidirectional port
EPWMSYNCI
31
–
ADCSOCAO
GPIO33
SCLA
EPWMSYNCO
36
–
COMP2OUT
Enhanced PWM external sync pulse input
ADC start-of-conversion A
I/O/Z
General-Purpose Input/Output 33
I/OD
I2C clock open-drain bidirectional port
ADCSOCBO
GPIO34
I
O
O
Enhanced PWM external synch pulse output
O
ADC start-of-conversion B
I/O/Z
19
O
27
–
–
GPIO35
I/O/Z
20
28
21
29
22
30
GPIO36
TMS
I
I/O/Z
GPIO37
TDO
GPIO38
I
23
General-Purpose Input/Output 35
JTAG test data input (TDI) with internal pullup. TDI is clocked into the selected
register (instruction or data) on a rising edge of TCK
General-Purpose Input/Output 36
JTAG test-mode select (TMS) with internal pullup. This serial control input is
clocked into the TAP controller on the rising edge of TCK.
I/O/Z
General-Purpose Input/Output 37
O/Z
JTAG scan out, test data output (TDO). The contents of the selected register
(instruction or data) are shifted out of TDO on the falling edge of TCK (8 mA drive)
I/O/Z
General-Purpose Input/Output 38
TCK
XCLKIN
Direct output of Comparator 2. COMP2OUT signal is not available in the DA
package.
–
–
TDI
General-Purpose Input/Output 34
31
I
JTAG test clock with internal pullup
I
External Oscillator Input. The path from this pin to the clock block is not gated by
the mux function of this pin. Care must be taken to not enable this path for
clocking if it is being used for the other functions.
Terminal Configuration and Functions
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5 Specifications
Absolute Maximum Ratings (1) (2)
5.1
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Analog voltage
Input voltage
Output voltage
Input clamp current
Output clamp current
Junction temperature
(4)
Storage temperature (4)
(1)
(2)
(3)
(4)
MIN
MAX
VDDIO (I/O and Flash) with respect to VSS
–0.3
4.6
UNIT
VDD with respect to VSS
–0.3
2.5
VDDA with respect to VSSA
–0.3
4.6
VIN (3.3 V)
–0.3
4.6
VIN (X1)
–0.3
2.5
VO
–0.3
4.6
Digital input (per pin), IIK (VIN < VSS or VIN > VDDIO) (3)
–20
20
Analog input (per pin), IIKANALOG
(VIN < VSSA or VIN > VDDA)
–20
20
Total for all inputs, IIKTOTAL
(VIN < VSS/VSSA or VIN > VDDIO/VDDA)
–20
20
IOK (VO < 0 or VO > VDDIO)
–20
20
mA
TJ
–40
150
°C
Tstg
–65
150
°C
V
V
V
V
mA
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 5.4 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
Continuous clamp current per pin is ±2 mA.
Long-term high-temperature storage or extended use at maximum temperature conditions may result in a reduction of overall device life.
For additional information, see Semiconductor and IC Package Thermal Metrics.
5.2
ESD Ratings – Automotive
VALUE
UNIT
TMS320F28027, TMS320F28027F, TMS320F28026, TMS320F28026F, TMS320F28023, TMS320F28022 in 48-pin PT package
Human body model (HBM), per AEC Q100-002 (1)
V(ESD)
Electrostatic
discharge
Charged device model (CDM), per AEC Q100-011
All pins
±2000
All pins except corner
pins
±500
Corner pins on 48-pin PT:
1, 12, 13, 24, 25, 36, 37,
48
±750
V
TMS320F28027, TMS320F28027F, TMS320F28026, TMS320F28026F, TMS320F28023, TMS320F28022 in 38-pin DA package
Human body model (HBM), per AEC Q100-002 (1)
V(ESD)
(1)
16
Electrostatic
discharge
Charged device model (CDM), per AEC Q100-011
All pins
±2000
All pins except corner
pins
±500
Corner pins on 38-pin DA:
1, 19, 20, 38
±750
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
Specifications
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TMS320F28021, TMS320F28020, TMS320F280200
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5.3
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
ESD Ratings – Commercial
VALUE
UNIT
TMS320F28021, TMS320F28020, TMS320F280200 in 48-pin PT package
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
V
TMS320F28021, TMS320F28020, TMS320F280200 in 38-pin DA package
V(ESD)
(1)
(2)
5.4
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
MIN
NOM
MAX
UNIT
Device supply voltage, I/O, VDDIO (1)
2.97
3.3
3.63
V
Device supply voltage CPU, VDD (When internal VREG is
disabled and 1.8 V is supplied externally)
1.71
1.8
1.995
V
2.97
3.3
Supply ground, VSS
0
Analog supply voltage, VDDA
Analog ground, VSSA
2
40
28022, 28023
2
50
28026, 28027
2
60
2
VDDIO + 0.3
V
VSS – 0.3
0.8
V
All GPIO/AIO pins
–4
mA
Group 2 (2)
–8
mA
All GPIO/AIO pins
4
mA
Group 2 (2)
8
mA
Low-level input voltage, VIL (3.3 V)
High-level output source current, VOH = VOH(MIN), IOH
Low-level output sink current, VOL = VOL(MAX), IOL
(2)
(3)
(3)
V
28020, 28021, 280200
High-level input voltage, VIH (3.3 V)
(1)
V
0
Device clock frequency (system clock)
Junction temperature, TJ
V
3.63
T version
–40
105
S version
–40
125
Q version
(AEC Q100
Qualification)
MHz
°C
–40
125
A tolerance of ±10% may be used for VDDIO if the BOR is not used. See the TMS320F2802x, TMS320F2802xx Piccolo™ MCUs Silicon
Errata for more information. VDDIO tolerance is ±5% if the BOR is enabled.
Group 2 pins are as follows: GPIO16, GPIO17, GPIO18, GPIO19, GPIO28, GPIO29, GPIO36, GPIO37
TA (Ambient temperature) is product- and application-dependent and can go up to the specified TJ max of the device. See Section 5.8,
Thermal Design Considerations.
Specifications
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5.5
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Power Consumption Summary
Table 5-1. TMS320F2802x/F280200 (1) Current Consumption at 40-MHz SYSCLKOUT
VREG ENABLED
MODE
TEST CONDITIONS
IDDIO (2)
VREG DISABLED
IDDA (3)
IDD
IDDIO
(2)
IDDA
(3)
TYP (4)
MAX
TYP (4)
MAX
TYP (4)
MAX
TYP (4)
MAX
TYP (4)
MAX
Operational
(Flash)
The following peripheral clocks are
enabled:
•
ePWM1/2/3/4
•
eCAP1
•
SCI-A
•
SPI-A
•
ADC
•
I2C
•
COMP1/2
•
CPU Timer0/1/2
All PWM pins are toggled at 40 kHz.
All I/O pins are left unconnected. (5)
Code is running out of flash with 1 waitstate.
XCLKOUT is turned off.
70 mA
80 mA
13 mA
18 mA
62 mA
70 mA
15 mA
18 mA
13 mA
18 mA
IDLE
Flash is powered down.
XCLKOUT is turned off.
All peripheral clocks are off.
13 mA
16 mA
53 μA
58 μA
15 mA
17 mA
120 μA
400 μA
53 μA
58 μA
STANDBY
Flash is powered down.
Peripheral clocks are off.
3 mA
6 mA
10 μA
15 μA
3 mA
6 mA
120 μA
400 μA
10 μA
15 μA
HALT
Flash is powered down.
Peripheral clocks are off.
Input clock is disabled. (6)
50 μA
10 μA
15 μA
15 μA
10 μA
15 μA
(1)
(2)
(3)
(4)
(5)
(6)
18
25 μA
For the TMS320F280200 device, subtract the IDD current number for eCAP (see Table 5-4) from IDD (VREG disabled)/IDDIO (VREG
enabled) current numbers shown in Table 5-1 for operational mode.
IDDIO current is dependent on the electrical loading on the I/O pins.
To realize the IDDA currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by writing to
the PCLKCR0 register.
The TYP numbers are applicable over room temperature and nominal voltage.
The following is done in a loop:
• Data is continuously transmitted out of SPI-A and SCI-A ports.
• The hardware multiplier is exercised.
• Watchdog is reset.
• ADC is performing continuous conversion.
• COMP1/2 are continuously switching voltages.
• GPIO17 is toggled.
If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator.
Specifications
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TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 5-2. TMS320F2802x Current Consumption at 50-MHz SYSCLKOUT
VREG ENABLED
MODE
TEST CONDITIONS
TYP
VREG DISABLED
IDDIO (1)
IDDA (2)
(3)
(3)
MAX
TYP
MAX
IDDIO (1)
IDD
TYP
(3)
MAX
TYP
(3)
IDDA (2)
MAX
TYP
(3)
MAX
Operational
(Flash)
The following peripheral clocks are
enabled:
•
ePWM1/2/3/4
•
eCAP1
•
SCI-A
•
SPI-A
•
ADC
•
I2C
•
COMP1/2
•
CPU Timer0/1/2
All PWM pins are toggled at 40 kHz.
All I/O pins are left unconnected. (4)
Code is running out of flash with 1 waitstate.
XCLKOUT is turned off.
80 mA
90 mA
13 mA
18 mA
71 mA
80 mA
15 mA
18 mA
13 mA
18 mA
IDLE
Flash is powered down.
XCLKOUT is turned off.
All peripheral clocks are off.
16 mA
19 mA
64 μA
69 μA
17 mA
20 mA
120 μA
400 μA
64 μA
69 μA
STANDBY
Flash is powered down.
Peripheral clocks are off.
4 mA
7 mA
10 μA
15 μA
4 mA
7 mA
120 μA
400 μA
10 μA
15 μA
HALT
Flash is powered down.
Peripheral clocks are off.
Input clock is disabled. (5)
50 μA
10 μA
15 μA
15 μA
10 μA
15 μA
(1)
(2)
(3)
(4)
(5)
25 μA
IDDIO current is dependent on the electrical loading on the I/O pins.
To realize the IDDA currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by writing to
the PCLKCR0 register.
The TYP numbers are applicable over room temperature and nominal voltage.
The following is done in a loop:
• Data is continuously transmitted out of SPI-A and SCI-A ports.
• The hardware multiplier is exercised.
• Watchdog is reset.
• ADC is performing continuous conversion.
• COMP1/2 are continuously switching voltages.
• GPIO17 is toggled.
If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator.
Specifications
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TMS320F28020 TMS320F280200
Copyright © 2008–2019, Texas Instruments Incorporated
19
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
www.ti.com
Table 5-3. TMS320F2802x Current Consumption at 60-MHz SYSCLKOUT
VREG ENABLED
MODE
IDDIO (1)
TEST CONDITIONS
TYP
(3)
VREG DISABLED
IDDA (2)
MAX
TYP
(3)
MAX
IDDIO (1)
IDD
TYP
(3)
MAX
TYP
(3)
MAX
IDDA (2)
TYP
(3)
MAX
Operational
(Flash)
The following peripheral clocks
are enabled:
•
ePWM1/2/3/4
•
eCAP1
•
SCI-A
•
SPI-A
•
ADC
•
I2C
•
COMP1/2
•
CPU-TIMER0/1/2
All PWM pins are toggled at
60 kHz.
All I/O pins are left
unconnected. (4)
Code is running out of flash
with 2 wait states.
XCLKOUT is turned off.
90 mA
100 mA
13 mA
18 mA
80 mA
90 mA
15 mA
18 mA
13 mA
18 mA
IDLE
Flash is powered down.
XCLKOUT is turned off.
All peripheral clocks are turned
off.
18 mA
23 mA
75 μA
80 μA
19 mA
24 mA
120 μA
400 μA
75 μA
80 μA
STANDBY
Flash is powered down.
Peripheral clocks are off.
4 mA
7 mA
10 μA
15 μA
4 mA
7 mA
120 μA
400 μA
10 μA
15 μA
HALT
Flash is powered down.
Peripheral clocks are off.
Input clock is disabled. (5)
50 μA
10 μA
15 μA
15 μA
10 μA
15 μA
(1)
(2)
(3)
(4)
(5)
25 μA
IDDIO current is dependent on the electrical loading on the I/O pins.
To realize the IDDA currents shown for IDLE, STANDBY, and HALT, clock to the ADC module must be turned off explicitly by writing to
the PCLKCR0 register.
The TYP numbers are applicable over room temperature and nominal voltage.
The following is done in a loop:
• Data is continuously transmitted out of SPI-A and SCI-A ports.
• The hardware multiplier is exercised.
• Watchdog is reset.
• ADC is performing continuous conversion.
• COMP1/2 are continuously switching voltages.
• GPIO17 is toggled.
If a quartz crystal or ceramic resonator is used as the clock source, the HALT mode shuts down the on-chip crystal oscillator.
NOTE
The peripheral - I/O multiplexing implemented in the device prevents all available peripherals
from being used at the same time. This is because more than one peripheral function may
share an I/O pin. It is, however, possible to turn on the clocks to all the peripherals at the
same time, although such a configuration is not useful. If this is done, the current drawn by
the device will be more than the numbers specified in the current consumption tables.
20
Specifications
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TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
5.5.1
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Reducing Current Consumption
The 2802x/280200 devices incorporate a method to reduce the device current consumption. Because
each peripheral unit has an individual clock-enable bit, significant reduction in current consumption can be
achieved by turning off the clock to any peripheral module that is not used in a given application.
Furthermore, any one of the three low-power modes could be taken advantage of to reduce the current
consumption even further. Table 5-4 indicates the typical reduction in current consumption achieved by
turning off the clocks.
Table 5-4. Typical Current Consumption by Various
Peripherals (at 60 MHz) (1)
(1)
(2)
(3)
PERIPHERAL
MODULE (2)
IDD CURRENT
REDUCTION (mA)
ADC
2 (3)
I2C
3
ePWM
2
eCAP
2
SCI
2
SPI
2
COMP/DAC
1
HRPWM
3
CPU-TIMER
1
Internal zero-pin oscillator
0.5
All peripheral clocks (except CPU Timer clocks) are disabled upon
reset. Writing to/reading from peripheral registers is possible only
after the peripheral clocks are turned on.
For peripherals with multiple instances, the current quoted is per
module. For example, the 2 mA value quoted for ePWM is for one
ePWM module.
This number represents the current drawn by the digital portion of
the ADC module. Turning off the clock to the ADC module results in
the elimination of the current drawn by the analog portion of the ADC
(IDDA) as well.
NOTE
IDDIO current consumption is reduced by 15 mA (typical) when XCLKOUT is turned off.
NOTE
The baseline IDD current (current when the core is executing a dummy loop with no
peripherals enabled) is 45 mA, typical. To arrive at the IDD current for a given application, the
current-drawn by the peripherals (enabled by that application) must be added to the baseline
IDD current.
Following are other methods to reduce power consumption further:
• The flash module may be powered down if code is run off SARAM. This results in a current reduction
of 18 mA (typical) in the VDD rail and 13 mA (typical) in the VDDIO rail.
• Savings in IDDIO may be realized by disabling the pullups on pins that assume an output function.
Specifications
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21
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
5.5.2
www.ti.com
Current Consumption Graphs (VREG Enabled)
Operational Current vs Frequency
100
Operational Current (mA)
90
80
70
60
50
40
30
20
10
0
10
15
20
25
30
35
40
45
50
55
60
SYSCLKOUT (MHz)
IDDIO (m A)
IDDA
Figure 5-1. Typical Operational Current Versus Frequency (F2802x/F280200)
Operational Pow er vs Frequency
Operational Power (mW)
450
400
350
300
250
200
10
15
20
25
30
35
40
45
50
55
60
SYSCLKOUT (MHz)
Figure 5-2. Typical Operational Power Versus Frequency (F2802x/F280200)
22
Specifications
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TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
5.6
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Electrical Characteristics (1)
over recommended operating conditions (unless otherwise noted)
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
IIL
IIH
Input current
(low level)
Input current
(high level)
TEST CONDITIONS
IOH = IOH MAX
MIN
MAX UNIT
2.4
IOH = 50 μA
V
VDDIO – 0.2
IOL = IOL MAX
0.4
All GPIO
–80
–140
–205
XRS pin
–225
–290
–360
Pin with pullup
enabled
VDDIO = 3.3 V, VIN = 0 V
Pin with pulldown
enabled
VDDIO = 3.3 V, VIN = 0 V
±2
Pin with pullup
enabled
VDDIO = 3.3 V, VIN = VDDIO
±2
Pin with pulldown
enabled
VDDIO = 3.3 V, VIN = VDDIO
IOZ
Output current, pullup or
pulldown disabled
CI
Input capacitance
VDDIO BOR trip point
V
μA
μA
28
50
VO = VDDIO or 0 V
80
±2
2
Falling VDDIO
2.42
VDDIO BOR hysteresis
(1)
TYP
2.65
pF
3.135
35
Supervisor reset release delay
time
Time after BOR/POR/OVR event is removed to XRS
release
VREG VDD output
Internal VREG on
400
μA
V
mV
800
μs
1.9
V
When the on-chip VREG is used, its output is monitored by the POR/BOR circuit, which will reset the device should the core voltage
(VDD) go out of range.
Specifications
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23
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
5.7
www.ti.com
Thermal Resistance Characteristics
5.7.1
PT Package
°C/W (1)
AIR FLOW (lfm) (2)
RΘJC
Junction-to-case thermal resistance
13.6
N/A
RΘJB
Junction-to-board thermal resistance
30.6
N/A
RΘJA
(High k PCB)
PsiJT
Junction-to-package top
PsiJB
(1)
(2)
Junction-to-free air thermal resistance
Junction-to-board
64
0
50.4
150
48.2
250
45
500
0.56
0
0.94
150
1.1
250
1.38
500
30.1
0
28.7
150
28.4
250
28
500
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
5.7.2
DA Package
°C/W (1)
AIR FLOW (lfm) (2)
RΘJC
Junction-to-case thermal resistance
12.8
N/A
RΘJB
Junction-to-board thermal resistance
33
N/A
RΘJA
(High k PCB)
PsiJT
PsiJB
(1)
(2)
24
Junction-to-free air thermal resistance
Junction-to-package top
Junction-to-board
70.1
0
56.4
150
53.9
250
50.2
500
0.34
0
0.61
150
0.74
250
0.98
500
32.5
0
32.1
150
31.7
250
31.1
500
These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
Specifications
Copyright © 2008–2019, Texas Instruments Incorporated
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TMS320F28020 TMS320F280200
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
5.8
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary.
Systems that exceed the recommended maximum power dissipation in the end product may require
additional thermal enhancements. Ambient temperature (TA) varies with the end application and product
design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the
ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be
measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of
the package top-side surface. The thermal application report Semiconductor and IC Package Thermal
Metrics helps to understand the thermal metrics and definitions.
5.9
Emulator Connection Without Signal Buffering for the MCU
Figure 5-3 shows the connection between the MCU and JTAG header for a single-processor configuration.
If the distance between the JTAG header and the MCU is greater than 6 inches, the emulation signals
must be buffered. If the distance is less than 6 inches, buffering is typically not needed. Figure 5-3 shows
the simpler, no-buffering situation. For the pullup/pulldown resistor values, see Section 4.2, Signal
Descriptions.
6 inches or less
VDDIO
VDDIO
13
14
2
TRST
1
TMS
3
TDI
TDO
TCK
7
11
9
EMU0
PD
EMU1
TRST
GND
TMS
GND
TDI
GND
TDO
GND
TCK
GND
5
4
6
8
10
12
TCK_RET
MCU
JTAG Header
A.
See Figure 6-39 for JTAG/GPIO multiplexing.
Figure 5-3. Emulator Connection Without Signal Buffering for the MCU
NOTE
The 2802x devices do not have EMU0/EMU1 pins. For designs that have a JTAG Header
onboard, the EMU0/EMU1 pins on the header must be tied to VDDIO through a 4.7-kΩ
(typical) resistor.
Specifications
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Copyright © 2008–2019, Texas Instruments Incorporated
25
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
www.ti.com
5.10 Parameter Information
5.10.1 Timing Parameter Symbology
Timing parameter symbols used are created in accordance with JEDEC Standard 100. To shorten the
symbols, some of the pin names and other related terminology have been abbreviated as follows:
Lowercase subscripts and their
meanings:
Letters and symbols and their
meanings:
a
access time
H
High
c
cycle time (period)
L
Low
d
delay time
V
Valid
f
fall time
X
Unknown, changing, or don't care
level
h
hold time
Z
High impedance
r
rise time
su
setup time
t
transition time
v
valid time
w
pulse duration (width)
5.10.2 General Notes on Timing Parameters
All output signals from the 28x devices (including XCLKOUT) are derived from an internal clock such that
all output transitions for a given half-cycle occur with a minimum of skewing relative to each other.
The signal combinations shown in the following timing diagrams may not necessarily represent actual
cycles. For actual cycle examples, see the appropriate cycle description section of this document.
5.11 Test Load Circuit
This test load circuit is used to measure all switching characteristics provided in this document.
Tester Pin Electronics
42 W
Data Sheet Timing Reference Point
3.5 nH
Output
Under
Test
Transmission Line
(A)
Z0 = 50 W
4.0 pF
A.
B.
Device Pin
1.85 pF
(B)
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the
device pin.
The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its
transmission line effects must be taken into account. A transmission line with a delay of 2 ns or longer can be used to
produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to
add or subtract the transmission line delay (2 ns or longer) from the data sheet timing.
Figure 5-4. 3.3-V Test Load Circuit
26
Specifications
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TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
www.ti.com
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
5.12 Power Sequencing
There is no power sequencing requirement needed to ensure the device is in the proper state after reset
or to prevent the I/Os from glitching during power up/down (GPIO19, GPIO34–38 do not have glitch-free
I/Os). No voltage larger than a diode drop (0.7 V) above VDDIO should be applied to any digital pin (for
analog pins, this value is 0.7 V above VDDA) before powering up the device. Voltages applied to pins on an
unpowered device can bias internal p-n junctions in unintended ways and produce unpredictable results.
VDDIO, VDDA
(3.3 V)
VDD (1.8 V)
INTOSC1
tINTOSCST
X1/X2
tOSCST
(B)
(A)
XCLKOUT
User-code dependent
tw(RSL1)
XRS
(D)
Address/data valid, internal boot-ROM code execution phase
Address/Data/
Control
(Internal)
td(EX)
th(boot-mode)(C)
Boot-Mode
Pins
User-code execution phase
User-code dependent
GPIO pins as input
Peripheral/GPIO function
Based on boot code
Boot-ROM execution starts
(E)
I/O Pins
GPIO pins as input (state depends on internal PU/PD)
User-code dependent
A.
B.
C.
D.
E.
Upon power up, SYSCLKOUT is OSCCLK/4. Because the XCLKOUTDIV bits in the XCLK register come up with a
reset state of 0, SYSCLKOUT is further divided by 4 before it appears at XCLKOUT. XCLKOUT = OSCCLK/16 during
this phase.
Boot ROM configures the DIVSEL bits for /1 operation. XCLKOUT = OSCCLK/4 during this phase. XCLKOUT will not
be visible at the pin until explicitly configured by user code.
After reset, the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode pin, the boot code
branches to destination memory or boot code function. If boot ROM code executes after power-on conditions (in
debugger environment), the boot code execution time is based on the current SYSCLKOUT speed. The SYSCLKOUT
will be based on user environment and could be with or without PLL enabled.
Using the XRS pin is optional due to the on-chip power-on reset (POR) circuitry.
The internal pullup/pulldown will take effect when BOR is driven high.
Figure 5-5. Power-on Reset
Specifications
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27
TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
TMS320F28021, TMS320F28020, TMS320F280200
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
www.ti.com
Table 5-5. Reset (XRS) Timing Requirements
MIN
th(boot-mode)
Hold time for boot-mode pins
tw(RSL2)
Pulse duration, XRS low on warm reset
MAX
UNIT
1000tc(SCO)
cycles
32tc(OSCCLK)
cycles
Table 5-6. Reset (XRS) Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tw(RSL1)
Pulse duration, XRS driven by device
tw(WDRS)
Pulse duration, reset pulse generated by
watchdog
td(EX)
Delay time, address/data valid after XRS high
tINTOSCST
Start-up time, internal zero-pin oscillator
tOSCST
(1)
(1)
MIN
TYP
MAX
UNIT
600
On-chip crystal-oscillator start-up time
μs
512tc(OSCCLK)
cycles
32tc(OSCCLK)
cycles
1
3
μs
10
ms
Dependent on crystal/resonator and board design.
INTOSC1
X1/X2
XCLKOUT
User-Code Dependent
tw(RSL2)
XRS
Address/Data/
Control
(Internal)
td(EX)
User-Code Execution
Boot-ROM Execution Starts
Boot-Mode
Pins
User-Code Execution Phase
Peripheral/GPIO Function
GPIO Pins as Input
th(boot-mode)(A)
Peripheral/GPIO Function
User-Code Execution Starts
I/O Pins
User-Code Dependent
GPIO Pins as Input (State Depends on Internal PU/PD)
User-Code Dependent
A.
After reset, the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode pin, the boot code
branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in
debugger environment), the Boot code execution time is based on the current SYSCLKOUT speed. The
SYSCLKOUT will be based on user environment and could be with or without PLL enabled.
Figure 5-6. Warm Reset
28
Specifications
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Figure 5-7 shows an example for the effect of writing into PLLCR register. In the first phase, PLLCR =
0x0004 and SYSCLKOUT = OSCCLK x 2. The PLLCR is then written with 0x0008. Right after the PLLCR
register is written, the PLL lock-up phase begins. During this phase, SYSCLKOUT = OSCCLK/2. After the
PLL lock-up is complete, SYSCLKOUT reflects the new operating frequency, OSCCLK x 4.
OSCCLK
Write to PLLCR
SYSCLKOUT
OSCCLK * 2
(Current CPU
Frequency)
OSCCLK/2
(CPU frequency while PLL is stabilizing
with the desired frequency. This period
(PLL lock-up time tp) is 1 ms long.)
OSCCLK * 4
(Changed CPU frequency)
Figure 5-7. Example of Effect of Writing Into PLLCR Register
Specifications
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5.13 Clock Specifications
5.13.1 Device Clock Table
This section provides the timing requirements and switching characteristics for the various clock options
available on the 2802x MCUs. Table 5-7, Table 5-8, and Table 5-9 list the cycle times of various clocks.
Table 5-7. 2802x Clock Table and Nomenclature (40-MHz Devices)
MIN
tc(SCO), Cycle time
SYSCLKOUT
Frequency
tc(LCO), Cycle time
LSPCLK (1)
tc(ADCCLK), Cycle time
(1)
(2)
MAX
UNIT
500
ns
2
40
MHz
40
MHz
25
100 (2)
10 (2)
Frequency
ADC clock
NOM
25
ns
25
ns
Frequency
40
MHz
MAX
UNIT
500
ns
50
MHz
50
MHz
Lower LSPCLK will reduce device power consumption.
This is the default reset value if SYSCLKOUT = 40 MHz.
Table 5-8. 2802x Clock Table and Nomenclature (50-MHz Devices)
MIN
tc(SCO), Cycle time
SYSCLKOUT
Frequency
tc(LCO), Cycle time
LSPCLK (1)
(1)
(2)
2
20
tc(ADCCLK), Cycle time
80 (2)
12.5 (2)
Frequency
ADC clock
NOM
20
ns
20
ns
Frequency
50
MHz
MAX
UNIT
500
ns
60
MHz
60
MHz
60
MHz
Lower LSPCLK will reduce device power consumption.
This is the default reset value if SYSCLKOUT = 50 MHz.
Table 5-9. 2802x Clock Table and Nomenclature (60-MHz Devices)
MIN
tc(SCO), Cycle time
SYSCLKOUT
Frequency
tc(LCO), Cycle time
LSPCLK (1)
(1)
(2)
30
2
16.67
tc(ADCCLK), Cycle time
66.67 (2)
15 (2)
Frequency
ADC clock
NOM
16.67
ns
16.67
Frequency
ns
Lower LSPCLK will reduce device power consumption.
This is the default reset value if SYSCLKOUT = 60 MHz.
Specifications
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Table 5-10. Device Clocking Requirements/Characteristics
MIN
On-chip oscillator (X1/X2 pins)
(Crystal/Resonator)
tc(OSC), Cycle time
External oscillator/clock source
(XCLKIN pin) — PLL Enabled
tc(CI), Cycle time (C8)
External oscillator/clock source
(XCLKIN pin) — PLL Disabled
tc(CI), Cycle time (C8)
Limp mode SYSCLKOUT
(with /2 enabled)
XCLKOUT
PLL lock time (1)
(1)
Frequency
Frequency
Frequency
Frequency
tp
MAX
UNIT
200
ns
MHz
5
20
33.3
200
ns
5
30
MHz
33.33
250
ns
4
30
MHz
Frequency range
tc(XCO), Cycle time (C1)
NOM
50
1 to 5
MHz
66.67
2000
0.5
15
MHz
ns
1
ms
The PLLLOCKPRD register must be updated based on the number of OSCCLK cycles. If the zero-pin internal oscillators (10 MHz) are
used as the clock source, then the PLLLOCKPRD register must be written with a value of 10,000 (minimum).
Specifications
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Table 5-11. Internal Zero-Pin Oscillator (INTOSC1/INTOSC2) Characteristics
PARAMETER
MIN
TYP
MAX
UNIT
Internal zero-pin oscillator 1 (INTOSC1) (1) (2)
Frequency
10
MHz
(1) (2)
Frequency
Internal zero-pin oscillator 2 (INTOSC2)
10
MHz
Step size (coarse trim)
55
kHz
Step size (fine trim)
14
Temperature drift (3)
3.03
Voltage (VDD) drift (3)
175
(1)
(2)
(3)
kHz
4.85
kHz/°C
Hz/mV
Oscillator frequency will vary over temperature, see Figure 5-8. To compensate for oscillator temperature drift, see the Oscillator
Compensation Guide and C2000Ware.
Frequency range ensured only when VREG is enabled, VREGENZ = VSS.
Output frequency of the internal oscillators follows the direction of both the temperature gradient and voltage (VDD) gradient. For
example:
• Increase in temperature will cause the output frequency to increase per the temperature coefficient.
• Decrease in voltage (VDD) will cause the output frequency to decrease per the voltage coefficient.
Zero-Pin Oscillator Frequency Movement With Temperature
10.6
10.5
Output Frequency (MHz)
10.4
10.3
10.2
10.1
10
9.9
9.8
9.7
9.6
–40
–30
–20
–10
Typical
0
10
20
30
40
50
60
70
80
90
100
110
120
Temperature (°C)
Max
Figure 5-8. Zero-Pin Oscillator Frequency Movement With Temperature
32
Specifications
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5.13.2 Clock Requirements and Characteristics
Table 5-12. XCLKIN Timing Requirements – PLL Enabled
NO.
MIN
MAX
UNIT
C9
tf(CI)
Fall time, XCLKIN
6
ns
C10
tr(CI)
Rise time, XCLKIN
6
ns
C11
tw(CIL)
Pulse duration, XCLKIN low as a percentage of tc(OSCCLK)
45%
55%
C12
tw(CIH)
Pulse duration, XCLKIN high as a percentage of tc(OSCCLK)
45%
55%
MIN
MAX
Table 5-13. XCLKIN Timing Requirements – PLL Disabled
NO.
Up to 20 MHz
6
20 MHz to 30 MHz
2
Up to 20 MHz
6
20 MHz to 30 MHz
2
C9
tf(Cl)
Fall time, XCLKIN
C10
tr(CI)
Rise time, XCLKIN
C11
tw(CIL)
Pulse duration, XCLKIN low as a percentage of
tc(OSCCLK)
45%
55%
C12
tw(CIH)
Pulse duration, XCLKIN high as a percentage of
tc(OSCCLK)
45%
55%
UNIT
ns
ns
The possible configuration modes are shown in Table 6-16.
Table 5-14. XCLKOUT Switching Characteristics (PLL Bypassed or Enabled) (1)
(2)
over recommended operating conditions (unless otherwise noted)
NO.
(1)
(2)
PARAMETER
MIN
MAX
UNIT
C3
tf(XCO)
Fall time, XCLKOUT
11
ns
C4
tr(XCO)
Rise time, XCLKOUT
11
ns
C5
tw(XCOL)
Pulse duration, XCLKOUT low
H–2
H+2
ns
C6
tw(XCOH)
Pulse duration, XCLKOUT high
H–2
H+2
ns
A load of 40 pF is assumed for these parameters.
H = 0.5tc(XCO)
C10
C9
C8
XCLKIN(A)
C1
C6
C3
C4
C5
XCLKOUT(B)
A.
B.
The relationship of XCLKIN to XCLKOUT depends on the divide factor chosen. The waveform relationship shown is
intended to illustrate the timing parameters only and may differ based on actual configuration.
XCLKOUT configured to reflect SYSCLKOUT.
Figure 5-9. Clock Timing
Specifications
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5.14 Flash Timing
Table 5-15. Flash/OTP Endurance for T Temperature Material (1)
ERASE/PROGRAM
TEMPERATURE
Nf
Flash endurance for the array (write/erase cycles)
0°C to 105°C (ambient)
NOTP
OTP endurance for the array (write cycles)
0°C to 30°C (ambient)
(1)
MIN
TYP
20000
50000
MAX
UNIT
cycles
1
write
Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.
Table 5-16. Flash/OTP Endurance for S Temperature Material (1)
ERASE/PROGRAM
TEMPERATURE
Nf
Flash endurance for the array (write/erase cycles)
0°C to 125°C (ambient)
NOTP
OTP endurance for the array (write cycles)
0°C to 30°C (ambient)
(1)
MIN
TYP
20000
50000
MAX
UNIT
cycles
1
write
Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.
Table 5-17. Flash/OTP Endurance for Q Temperature Material (1)
ERASE/PROGRAM
TEMPERATURE
Nf
Flash endurance for the array (write/erase cycles)
–40°C to 125°C (ambient)
NOTP
OTP endurance for the array (write cycles)
–40°C to 30°C (ambient)
(1)
MIN
TYP
20000
50000
MAX
UNIT
cycles
1
write
Write/erase operations outside of the temperature ranges indicated are not specified and may affect the endurance numbers.
Table 5-18. Flash Parameters at 60-MHz SYSCLKOUT
PARAMETER
IDDP (1)
VDD current consumption during Erase/Program cycle
IDDIOP (1)
VDDIO current consumption during Erase/Program cycle
IDDIOP (1)
VDDIO current consumption during Erase/Program cycle
(1)
TEST
CONDITIONS
MIN
VREG disabled
TYP
MAX
80
mA
60
VREG enabled
UNIT
120
mA
Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain a
stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash
programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at all
times, as specified in the Recommended Operating Conditions of the data sheet. Any brown-out or interruption to power during
erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during
flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed
during the programming process.
Table 5-19. Flash Parameters at 50-MHz SYSCLKOUT
PARAMETER
IDDP (1)
VDD current consumption during Erase/Program cycle
IDDIOP (1)
VDDIO current consumption during Erase/Program cycle
IDDIOP (1)
VDDIO current consumption during Erase/Program cycle
(1)
34
TEST
CONDITIONS
VREG disabled
MIN
TYP
70
60
VREG enabled
110
MAX
UNIT
mA
mA
Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain a
stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash
programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at all
times, as specified in the Recommended Operating Conditions of the data sheet. Any brown-out or interruption to power during
erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during
flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed
during the programming process.
Specifications
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Table 5-20. Flash Parameters at 40-MHz SYSCLKOUT
PARAMETER
IDDP (1)
VDD current consumption during Erase/Program cycle
(1)
VDDIO current consumption during Erase/Program cycle
IDDIOP (1)
VDDIO current consumption during Erase/Program cycle
IDDIOP
(1)
TEST
CONDITIONS
MIN
VREG disabled
TYP
MAX
60
mA
60
VREG enabled
UNIT
100
mA
Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain a
stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash
programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at all
times, as specified in the Recommended Operating Conditions of the data sheet. Any brown-out or interruption to power during
erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during
flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed
during the programming process.
Table 5-21. Flash Program/Erase Time
PARAMETER
Program Time
TEST
CONDITIONS
MIN
(1)
MAX
UNIT
8K Sector
250
ms
4K Sector
125
ms
16-Bit Word
Erase Time (1)
TYP
50
μs
8K Sector
2
s
4K Sector
2
s
The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required
prior to programming, when programming the device for the first time. However, the erase operation is needed on all subsequent
programming operations.
Table 5-22. Flash/OTP Access Timing
PARAMETER
MIN
MAX
UNIT
ta(fp)
Paged Flash access time
40
ns
ta(fr)
Random Flash access time
40
ns
ta(OTP)
OTP access time
60
ns
Table 5-23. Flash Data Retention Duration
PARAMETER
tretention
Data retention duration
TEST CONDITIONS
TJ = 55°C
MIN
MAX
15
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UNIT
years
35
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Table 5-24. Minimum Required Flash/OTP Wait States at Different Frequencies
(1)
SYSCLKOUT
(MHz)
SYSCLKOUT
(ns)
PAGE
WAIT STATE (1)
RANDOM
WAIT STATE (1)
OTP
WAIT STATE
60
16.67
2
2
3
55
18.18
2
2
3
50
20
1
1
2
45
22.22
1
1
2
40
25
1
1
2
35
28.57
1
1
2
30
33.33
1
1
1
25
40
0
1
1
Random wait state must be ≥ 1.
The equations to compute the Flash page wait state and random wait state in Table 5-24 are as follows:
ù
éæ t a( f · p ) ö
÷ - 1ú round up to the next highest integer
Flash Page Wait State = êç
úû
êëçè t c (SCO ) ÷ø
éæ t a(f ×r) ö ù
÷ - 1ú round up to the next highest integer, or 1, whichever is larger
Flash Random Wait State = êç
ç
÷
ëêè t c(SCO) ø ûú
The equation to compute the OTP wait state in Table 5-24 is as follows:
éæ t a(OTP) ö ù
÷ - 1ú round up to the next highest integer, or 1, whichever is larger
OTP Wait State = êç
êëçè t c(SCO) ÷ø úû
36
Specifications
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6 Detailed Description
6.1
6.1.1
Overview
CPU
The 2802x (C28x) family is a member of the TMS320C2000™ microcontroller (MCU) platform. The C28xbased controllers have the same 32-bit fixed-point architecture as existing C28x MCUs. It is a very
efficient C/C++ engine, enabling users to develop not only their system control software in a high-level
language, but also enabling development of math algorithms using C/C++. The device is as efficient at
MCU math tasks as it is at system control tasks that typically are handled by microcontroller devices. This
efficiency removes the need for a second processor in many systems. The 32 × 32-bit MAC 64-bit
processing capabilities enable the controller to handle higher numerical resolution problems efficiently.
Add to this the fast interrupt response with automatic context save of critical registers, resulting in a device
that is capable of servicing many asynchronous events with minimal latency. The device has an 8-leveldeep protected pipeline with pipelined memory accesses. This pipelining enables it to execute at high
speeds without resorting to expensive high-speed memories. Special branch-look-ahead hardware
minimizes the latency for conditional discontinuities. Special store conditional operations further improve
performance.
6.1.2
Memory Bus (Harvard Bus Architecture)
As with many MCU-type devices, multiple buses are used to move data between the memories and
peripherals and the CPU. The memory bus architecture contains a program read bus, data read bus, and
data write bus. The program read bus consists of 22 address lines and 32 data lines. The data read and
write buses consist of 32 address lines and 32 data lines each. The 32-bit-wide data buses enable single
cycle 32-bit operations. The multiple bus architecture, commonly termed Harvard Bus, enables the C28x
to fetch an instruction, read a data value and write a data value in a single cycle. All peripherals and
memories attached to the memory bus prioritize memory accesses. Generally, the priority of memory bus
accesses can be summarized as follows:
Highest:
Data Writes
(Simultaneous data and program writes cannot occur on the
memory bus.)
Program Writes
(Simultaneous data and program writes cannot occur on the
memory bus.)
Data Reads
Lowest:
6.1.3
Program Reads
(Simultaneous program reads and fetches cannot occur on the
memory bus.)
Fetches
(Simultaneous program reads and fetches cannot occur on the
memory bus.)
Peripheral Bus
To enable migration of peripherals between various Texas Instruments (TI) MCU family of devices, the
devices adopt a peripheral bus standard for peripheral interconnect. The peripheral bus bridge multiplexes
the various buses that make up the processor Memory Bus into a single bus consisting of 16 address
lines and 16 or 32 data lines and associated control signals. Three versions of the peripheral bus are
supported. One version supports only 16-bit accesses (called peripheral frame 2). Another version
supports both 16- and 32-bit accesses (called peripheral frame 1).
Detailed Description
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6.1.4
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Real-Time JTAG and Analysis
The devices implement the standard IEEE 1149.1 JTAG (1) interface for in-circuit based debug.
Additionally, the devices support real-time mode of operation allowing modification of the contents of
memory, peripheral, and register locations while the processor is running and executing code and
servicing interrupts. The user can also single step through non-time-critical code while enabling timecritical interrupts to be serviced without interference. The device implements the real-time mode in
hardware within the CPU. This is a feature unique to the 28x family of devices, requiring no software
monitor. Additionally, special analysis hardware is provided that allows setting of hardware breakpoint or
data/address watch-points and generating various user-selectable break events when a match occurs.
These devices do not support boundary scan; however, IDCODE and BYPASS features are available if
the following considerations are taken into account. The IDCODE does not come by default. The user
must go through a sequence of SHIFT IR and SHIFT DR state of JTAG to get the IDCODE. For BYPASS
instruction, the first shifted DR value would be 1.
6.1.5
Flash
The F280200 device contains 8K × 16 of embedded flash memory, segregated into two 4K × 16 sectors.
The F28021/23/27 devices contain 32K × 16 of embedded flash memory, segregated into four 8K × 16
sectors. The F28020/22/26 devices contain 16K × 16 of embedded flash memory, segregated into four
4K × 16 sectors. All devices also contain a single 1K × 16 of OTP memory at address range 0x3D 7800 to
0x3D 7BFF. The user can individually erase, program, and validate a flash sector while leaving other
sectors untouched. However, it is not possible to use one sector of the flash or the OTP to execute flash
algorithms that erase/program other sectors. Special memory pipelining is provided to enable the flash
module to achieve higher performance. The flash/OTP is mapped to both program and data space;
therefore, it can be used to execute code or store data information. Addresses 0x3F 7FF0 to 0x3F 7FF5
are reserved for data variables and should not contain program code.
NOTE
The Flash and OTP wait states can be configured by the application. This allows applications
running at slower frequencies to configure the flash to use fewer wait states.
Flash effective performance can be improved by enabling the flash pipeline mode in the
Flash options register. With this mode enabled, effective performance of linear code
execution will be much faster than the raw performance indicated by the wait-state
configuration alone. The exact performance gain when using the Flash pipeline mode is
application-dependent.
For more information on the Flash options, Flash wait state, and OTP wait-state registers,
see the System Control chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical
Reference Manual.
6.1.6
M0, M1 SARAMs
All devices contain these two blocks of single access memory, each 1K × 16 in size. The stack pointer
points to the beginning of block M1 on reset. The M0 and M1 blocks, like all other memory blocks on C28x
devices, are mapped to both program and data space. Hence, the user can use M0 and M1 to execute
code or for data variables. The partitioning is performed within the linker. The C28x device presents a
unified memory map to the programmer. This makes for easier programming in high-level languages.
6.1.7
L0 SARAM
The device contains up to 4K × 16 of single-access RAM. Refer to the device-specific memory map
figures in Section 6.2 to ascertain the exact size for a given device. This block is mapped to both program
and data space.
(1)
38
IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
Detailed Description
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6.1.8
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Boot ROM
The Boot ROM is factory-programmed with bootloader software. The Boot ROM uses the boot-modeselect GPIO pins to determine what boot mode to use upon power up. The user can select to boot
normally to application code, to download new software from an external connection, or to select boot
software that is programmed in the internal Flash/ROM. The Boot ROM also contains standard tables,
such as SIN/COS waveforms, for use in math-related algorithms. The boot-ROM content, and hence the
checksum value, may vary for different silicon revisions. For details, see the Boot ROM chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
Table 6-1. Boot Mode Selection
MODE
GPIO37/TDO
GPIO34/COMP2OUT
TRST
3
1
1
0
GetMode
2
1
0
0
Wait (see Section 6.1.9 for description)
1
0
1
0
SCI
0
0
0
0
Parallel IO
EMU
x
x
1
Emulation Boot
6.1.8.1
MODE
Emulation Boot
When the emulator is connected, the GPIO37/TDO pin cannot be used for boot mode selection. In this
case, the boot ROM detects that an emulator is connected and uses the contents of two reserved SARAM
locations in the PIE vector table to determine the boot mode. If the content of either location is invalid,
then the Wait boot option is used. All boot mode options can be accessed in emulation boot.
6.1.8.2
GetMode
The default behavior of the GetMode option is to boot to flash. This behavior can be changed to another
boot option by programming two locations in the OTP. If the content of either OTP location is invalid, then
boot to flash is used. One of the following loaders can be specified: SCI, SPI, I2C, or OTP.
6.1.8.3
Peripheral Pins Used by the Bootloader
Table 6-2 shows which GPIO pins are used by each peripheral bootloader. Refer to the GPIO mux table
to see if these conflict with any of the peripherals you would like to use in your application.
Table 6-2. Peripheral Bootload Pins
BOOTLOADER
PERIPHERAL LOADER PINS
SCI
SCIRXDA (GPIO28)
SCITXDA (GPIO29)
Parallel Boot
Data (GPIO[7:0])
28x Control (GPIO16)
Host Control (GPIO12)
SPI
SPISIMOA (GPIO16)
SPISOMIA (GPIO17)
SPICLKA (GPIO18)
SPISTEA (GPIO19)
I2C
SDAA (GPIO32) (1)
SCLA (GPIO33) (1)
(1)
GPIO pins 32 and 33 may not be available on your device package. On these devices, this bootload
option is unavailable.
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6.1.9
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Security
The devices support high levels of security to protect the user firmware from being reverse engineered.
The security features a 128-bit password (hardcoded for 16 wait states), which the user programs into the
flash. One code security module (CSM) is used to protect the flash/OTP and the L0/L1 SARAM blocks.
The security feature prevents unauthorized users from examining the memory contents through the JTAG
port, executing code from external memory or trying to boot-load some undesirable software that would
export the secure memory contents. To enable access to the secure blocks, the user must write the
correct 128-bit KEY value that matches the value stored in the password locations within the Flash.
In addition to the CSM, the emulation code security logic (ECSL) has been implemented to prevent
unauthorized users from stepping through secure code. Any code or data access to flash, user OTP, or L0
memory while the emulator is connected will trip the ECSL and break the emulation connection. To allow
emulation of secure code, while maintaining the CSM protection against secure memory reads, the user
must write the correct value into the lower 64 bits of the KEY register, which matches the value stored in
the lower 64 bits of the password locations within the flash. Dummy reads of all 128 bits of the password
in the flash must still be performed. If the lower 64 bits of the password locations are all ones
(unprogrammed), then the KEY value does not need to match.
When initially debugging a device with the password locations in flash programmed (that is, secured), the
CPU will start running and may execute an instruction that performs an access to a protected ECSL area.
If this happens, the ECSL will trip and cause the emulator connection to be cut.
The solution is to use the Wait boot option. This will sit in a loop around a software breakpoint to allow an
emulator to be connected without tripping security. The user can then exit this mode once the emulator is
connected by using one of the emulation boot options as described in the Boot ROM chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual. Piccolo devices do not support a
hardware wait-in-reset mode.
NOTE
•
When the code-security passwords are programmed, all addresses from 0x3F7F80 to
0x3F7FF5 cannot be used as program code or data. These locations must be
programmed to 0x0000.
• If the code security feature is not used, addresses 0x3F7F80 to 0x3F7FEF may be used
for code or data. Addresses 0x3F7FF0 to 0x3F7FF5 are reserved for data and should not
contain program code.
The 128-bit password (at 0x3F 7FF8 to 0x3F 7FFF) must not be programmed to zeros.
Doing so would permanently lock the device.
40
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Disclaimer
Code Security Module Disclaimer
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED
TO PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY
(EITHER ROM OR FLASH) AND IS WARRANTED BY TEXAS INSTRUMENTS (TI), IN
ACCORDANCE WITH ITS STANDARD TERMS AND CONDITIONS, TO CONFORM TO
TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY PERIOD APPLICABLE FOR
THIS DEVICE.
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED
MEMORY CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT
AS SET FORTH ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS
CONCERNING THE CSM OR OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT,
INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY
OUT OF YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE,
BUT ARE NOT LIMITED TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR
INTERRUPTION OF BUSINESS OR OTHER ECONOMIC LOSS.
6.1.10 Peripheral Interrupt Expansion (PIE) Block
The PIE block serves to multiplex numerous interrupt sources into a smaller set of interrupt inputs. The
PIE block can support up to 96 peripheral interrupts. On the F2802x, 33 of the possible 96 interrupts are
used by peripherals. The 96 interrupts are grouped into blocks of 8 and each group is fed into 1 of
12 CPU interrupt lines (INT1 to INT12). Each of the 96 interrupts is supported by its own vector stored in a
dedicated RAM block that can be overwritten by the user. The vector is automatically fetched by the CPU
on servicing the interrupt. It takes 8 CPU clock cycles to fetch the vector and save critical CPU registers.
Hence the CPU can quickly respond to interrupt events. Prioritization of interrupts is controlled in
hardware and software. Each individual interrupt can be enabled/disabled within the PIE block.
6.1.11 External Interrupts (XINT1–XINT3)
The devices support three masked external interrupts (XINT1–XINT3). Each of the interrupts can be
selected for negative, positive, or both negative and positive edge triggering and can also be
enabled/disabled. These interrupts also contain a 16-bit free running up counter, which is reset to zero
when a valid interrupt edge is detected. This counter can be used to accurately time stamp the interrupt.
There are no dedicated pins for the external interrupts. XINT1, XINT2, and XINT3 interrupts can accept
inputs from GPIO0–GPIO31 pins.
6.1.12 Internal Zero Pin Oscillators, Oscillator, and PLL
The device can be clocked by either of the two internal zero-pin oscillators, an external oscillator, or by a
crystal attached to the on-chip oscillator circuit (48-pin devices only). A PLL is provided supporting up to
12 input-clock-scaling ratios. The PLL ratios can be changed on-the-fly in software, enabling the user to
scale back on operating frequency if lower power operation is desired. Refer to Section 5, Electrical
Specifications, for timing details. The PLL block can be set in bypass mode.
6.1.13 Watchdog
Each device contains two watchdogs: CPU-Watchdog that monitors the core and NMI-Watchdog that is a
missing clock-detect circuit. The user software must regularly reset the CPU-watchdog counter within a
certain time frame; otherwise, the CPU-watchdog generates a reset to the processor. The CPU-watchdog
can be disabled if necessary. The NMI-Watchdog engages only in case of a clock failure and can either
generate an interrupt or a device reset.
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6.1.14 Peripheral Clocking
The clocks to each individual peripheral can be enabled/disabled to reduce power consumption when a
peripheral is not in use. Additionally, the system clock to the serial ports (except I2C) can be scaled
relative to the CPU clock.
6.1.15 Low-power Modes
The devices are full static CMOS devices. Three low-power modes are provided:
IDLE:
Place CPU in low-power mode. Peripheral clocks may be turned off selectively and
only those peripherals that must function during IDLE are left operating. An enabled
interrupt from an active peripheral or the watchdog timer will wake the processor from
IDLE mode.
STANDBY: Turns off clock to CPU and peripherals. This mode leaves the oscillator and PLL
functional. An external interrupt event will wake the processor and the peripherals.
Execution begins on the next valid cycle after detection of the interrupt event
HALT:
This mode basically shuts down the device and places it in the lowest possible power
consumption mode. If the internal zero-pin oscillators are used as the clock source,
the HALT mode turns them off, by default. To keep these oscillators from shutting
down, the INTOSCnHALTI bits in CLKCTL register may be used. The zero-pin
oscillators may thus be used to clock the CPU-watchdog in this mode. If the on-chip
crystal oscillator is used as the clock source, it is shut down in this mode. A reset or
an external signal (through a GPIO pin) or the CPU-watchdog can wake the device
from this mode.
The CPU clock (OSCCLK) and WDCLK should be from the same clock source before attempting to put
the device into HALT or STANDBY.
42
Detailed Description
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6.1.16 Peripheral Frames 0, 1, 2 (PFn)
The device segregates peripherals into three sections. The mapping of peripherals is as follows:
PF0:
PF1:
PF2:
PIE:
PIE Interrupt Enable and Control Registers Plus PIE Vector Table
Flash:
Flash Waitstate Registers
Timers:
CPU-Timers 0, 1, 2 Registers
CSM:
Code Security Module KEY Registers
ADC:
ADC Result Registers
GPIO:
GPIO MUX Configuration and Control Registers
ePWM:
Enhanced Pulse Width Modulator Module and Registers
eCAP:
Enhanced Capture Module and Registers
Comparators:
Comparator Modules
SYS:
System Control Registers
SCI:
Serial Communications Interface (SCI) Control and RX/TX Registers
SPI:
Serial Port Interface (SPI) Control and RX/TX Registers
ADC:
ADC Status, Control, and Configuration Registers
I2C:
Inter-Integrated Circuit Module and Registers
XINT:
External Interrupt Registers
6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
Most of the peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. This
enables the user to use a pin as GPIO if the peripheral signal or function is not used. On reset, GPIO pins
are configured as inputs. The user can individually program each pin for GPIO mode or peripheral signal
mode. For specific inputs, the user can also select the number of input qualification cycles. This is to filter
unwanted noise glitches. The GPIO signals can also be used to bring the device out of specific low-power
modes.
6.1.18 32-Bit CPU-Timers (0, 1, 2)
CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock
prescaling. The timers have a 32-bit count-down register, which generates an interrupt when the counter
reaches zero. The counter is decremented at the CPU clock speed divided by the prescale value setting.
When the counter reaches zero, it is automatically reloaded with a 32-bit period value.
CPU-Timer 0 is for general use and is connected to the PIE block. CPU-Timer 1 is also for general use
and can be connected to INT13 of the CPU. CPU-Timer 2 is reserved for DSP/BIOS. It is connected to
INT14 of the CPU. If DSP/BIOS is not being used, CPU-Timer 2 is available for general use.
CPU-Timer 2 can be clocked by any one of the following:
• SYSCLKOUT (default)
• Internal zero-pin oscillator 1 (INTOSC1)
• Internal zero-pin oscillator 2 (INTOSC2)
• External clock source
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6.1.19 Control Peripherals
The devices support the following peripherals that are used for embedded control and communication:
ePWM:
The enhanced PWM peripheral supports independent/complementary PWM
generation, adjustable dead-band generation for leading/trailing edges,
latched/cycle-by-cycle trip mechanism. Some of the PWM pins support the
HRPWM high resolution duty and period features. The type 1 module found on
2802x devices also supports increased dead-band resolution, enhanced SOC and
interrupt generation, and advanced triggering including trip functions based on
comparator outputs.
eCAP:
The enhanced capture peripheral uses a 32-bit time base and registers up to four
programmable events in continuous/one-shot capture modes.
This peripheral can also be configured to generate an auxiliary PWM signal.
ADC:
The ADC block is a 12-bit converter. It has up to 13 single-ended channels pinned
out, depending on the device. It contains two sample-and-hold units for
simultaneous sampling.
Comparator:
Each comparator block consists of one analog comparator along with an internal
10-bit reference for supplying one input of the comparator.
6.1.20 Serial Port Peripherals
The devices support the following serial communication peripherals:
44
SPI:
The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream
of programmed length (1 to 16 bits) to be shifted into and out of the device at a
programmable bit-transfer rate. Normally, the SPI is used for communications
between the MCU and external peripherals or another processor. Typical
applications include external I/O or peripheral expansion through devices such as
shift registers, display drivers, and ADCs. Multidevice communications are
supported by the master/slave operation of the SPI. The SPI contains a 4-level
receive and transmit FIFO for reducing interrupt servicing overhead.
SCI:
The serial communications interface is a two-wire asynchronous serial port,
commonly known as UART. The SCI contains a 4-level receive and transmit FIFO
for reducing interrupt servicing overhead.
I2C:
The inter-integrated circuit (I2C) module provides an interface between an MCU
and other devices compliant with Philips Semiconductors Inter-IC bus ( I2C-bus®)
specification version 2.1 and connected by way of an I2C-bus. External
components attached to this 2-wire serial bus can transmit/receive up to 8-bit data
to/from the MCU through the I2C module. The I2C contains a 4-level receive and
transmit FIFO for reducing interrupt servicing overhead.
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6.2
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Memory Maps
In Figure 6-1, Figure 6-2, Figure 6-3, Figure 6-4, and Figure 6-5, the following apply:
• Memory blocks are not to scale.
• Peripheral Frame 0, Peripheral Frame 1 and Peripheral Frame 2 memory maps are restricted to data
memory only. A user program cannot access these memory maps in program space.
• Protected means the order of Write-followed-by-Read operations is preserved rather than the pipeline
order.
• Certain memory ranges are EALLOW protected against spurious writes after configuration.
• Locations 0x3D7C80 to 0x3D7CC0 contain the internal oscillator and ADC calibration routines. These
locations are not programmable by the user.
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Prog Space
Data Space
0x00 0000
M0 Vector RAM (Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K ´ 16, 0-Wait)
0x00 0400
0x00 0800
0x00 0D00
0x00 0E00
M1 SARAM (1K ´ 16, 0-Wait)
Peripheral Frame 0
PIE Vector - RAM
(256 ´ 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
Reserved
Peripheral Frame 0
0x00 2000
Reserved
0x00 6000
Peripheral Frame 1
(4K ´ 16, Protected)
0x00 7000
0x00 8000
Reserved
Peripheral Frame 2
(4K ´ 16, Protected)
L0 SARAM (4K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x00 9000
Reserved
0x3D 7800
User OTP (1K ´ 16, Secure Zone + ECSL)
0x3D 7C00
0x3D 7C80
0x3D 7CC0
0x3D 7CE0
0x3D 7E80
0x3D 7EB0
0x3D 7FFF
0x3D 8000
Reserved
Calibration Data
Get_mode function
Reserved
Calibration Data
Reserved
PARTID
Reserved
0x3F 0000
FLASH
(32K ´ 16, 4 Sectors, Secure Zone + ECSL)
0x3F 7FF8
0x3F 8000
0x3F 9000
A.
128-Bit Password
L0 SARAM (4K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
Reserved
0x3F E000
Boot ROM (8K ´ 16, 0-Wait)
0x3F FFC0
Vector (32 Vectors, Enabled if VMAP = 1)
Memory locations 0x3D 7E80–0x3D 7EAF are reserved in TMX/TMP silicon.
Figure 6-1. 28023/28027 Memory Map
46
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Prog Space
Data Space
0x00 0000
M0 Vector RAM (Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K ´ 16, 0-Wait)
0x00 0400
M1 SARAM (1K ´ 16, 0-Wait)
0x00 0800
Peripheral Frame 0
0x00 0D00
PIE Vector - RAM
(256 ´ 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
0x00 0E00
Reserved
Peripheral Frame 0
0x00 2000
Reserved
0x00 6000
Peripheral Frame 1
(4K ´ 16, Protected)
Reserved
0x00 7000
Peripheral Frame 2
(4K ´ 16, Protected)
0x00 8000
L0 SARAM (4K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x00 9000
Reserved
0x3D 7800
User OTP (1K ´ 16, Secure Zone + ECSL)
0x3D 7C00
Reserved
0x3D 7C80
Calibration Data
0x3D 7CC0
Get_mode function
0x3D 7CE0
Reserved
0x3D 7E80
Calibration Data
0x3D 7EB0
Reserved
0x3D 7FFF
PARTID
0x3D 8000
Reserved
0x3F 4000
FLASH
(16K ´ 16, 4 Sectors, Secure Zone + ECSL)
0x3F 7FF8
128-Bit Password
0x3F 8000
L0 SARAM (4K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x3F 9000
A.
Reserved
0x3F E000
Boot ROM (8K ´ 16, 0-Wait)
0x3F FFC0
Vector (32 Vectors, Enabled if VMAP = 1)
Memory locations 0x3D 7E80–0x3D 7EAF are reserved in TMX/TMP silicon.
Figure 6-2. 28022/28026 Memory Map
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Prog Space
Data Space
0x00 0000
M0 Vector RAM (Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K ´ 16, 0-Wait)
0x00 0400
0x00 0800
0x00 0D00
0x00 0E00
M1 SARAM (1K ´ 16, 0-Wait)
Peripheral Frame 0
PIE Vector - RAM
(256 ´ 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
Reserved
Peripheral Frame 0
0x00 2000
Reserved
0x00 6000
Peripheral Frame 1
(4K ´ 16, Protected)
0x00 7000
0x00 8000
Reserved
Peripheral Frame 2
(4K ´ 16, Protected)
L0 SARAM (3K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x00 8C00
Reserved
0x3D 7800
User OTP (1K ´ 16, Secure Zone + ECSL)
0x3D 7C00
0x3D 7C80
0x3D 7CC0
0x3D 7CE0
0x3D 7E80
0x3D 7EB0
0x3D 7FFF
0x3D 8000
Reserved
Calibration Data
Get_mode function
Reserved
Calibration Data
Reserved
PARTID
Reserved
0x3F 0000
FLASH
(32K ´ 16, 4 Sectors, Secure Zone + ECSL)
0x3F 7FF8
0x3F 8000
A.
128-Bit Password
L0 SARAM (3K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x3F 8C00
Reserved
0x3F E000
Boot ROM (8K ´ 16, 0-Wait)
0x3F FFC0
Vector (32 Vectors, Enabled if VMAP = 1)
Memory locations 0x3D 7E80–0x3D 7EAF are reserved in TMX/TMP silicon.
Figure 6-3. 28021 Memory Map
48
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Prog Space
Data Space
0x00 0000
M0 Vector RAM (Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K ´ 16, 0-Wait)
0x00 0400
0x00 0800
0x00 0D00
0x00 0E00
M1 SARAM (1K ´ 16, 0-Wait)
Peripheral Frame 0
PIE Vector - RAM
(256 ´ 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
Reserved
Peripheral Frame 0
0x00 2000
Reserved
0x00 6000
Peripheral Frame 1
(4K ´ 16, Protected)
0x00 7000
0x00 8000
Reserved
Peripheral Frame 2
(4K ´ 16, Protected)
L0 SARAM (1K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x00 8400
Reserved
0x3D 7800
User OTP (1K ´ 16, Secure Zone + ECSL)
0x3D 7C00
0x3D 7C80
0x3D 7CC0
0x3D 7CE0
0x3D 7E80
0x3D 7EB0
0x3D 7FFF
0x3D 8000
Reserved
Calibration Data
Get_mode function
Reserved
Calibration Data
Reserved
PARTID
Reserved
0x3F 4000
FLASH
(16K ´ 16, 4 Sectors, Secure Zone + ECSL)
0x3F 7FF8
0x3F 8000
0x3F 8400
A.
128-Bit Password
L0 SARAM (1K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
Reserved
0x3F E000
Boot ROM (8K ´ 16, 0-Wait)
0x3F FFC0
Vector (32 Vectors, Enabled if VMAP = 1)
Memory locations 0x3D 7E80–0x3D 7EAF are reserved in TMX/TMP silicon.
Figure 6-4. 28020 Memory Map
Detailed Description
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Prog Space
Data Space
0x00 0000
M0 Vector RAM (Enabled if VMAP = 0)
0x00 0040
M0 SARAM (1K ´ 16, 0-Wait)
0x00 0400
0x00 0800
0x00 0D00
0x00 0E00
M1 SARAM (1K ´ 16, 0-Wait)
Peripheral Frame 0
PIE Vector - RAM
(256 ´ 16)
(Enabled if
VMAP = 1,
ENPIE = 1)
Reserved
Peripheral Frame 0
0x00 2000
Reserved
0x00 6000
Peripheral Frame 1
(4K ´ 16, Protected)
0x00 7000
0x00 8000
Reserved
Peripheral Frame 2
(4K ´ 16, Protected)
L0 SARAM (1K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x00 8400
Reserved
0x3D 7800
User OTP (1K ´ 16, Secure Zone + ECSL)
0x3D 7C00
Reserved
0x3D 7C80
0x3D 7CC0
0x3D 7CE0
0x3D 7E80
0x3D 7EB0
0x3D 7FFF
0x3D 8000
Calibration Data
Get_mode function
Reserved
Calibration Data
Reserved
PARTID
Reserved
0x3F 6000
FLASH
(8K ´ 16, 2 Sectors, Secure Zone + ECSL)
0x3F 7FF8
0x3F 8000
L0 SARAM (1K ´ 16)
(0-Wait, Secure Zone + ECSL, Dual Mapped)
0x3F 8400
Reserved
0x3F E000
Boot ROM (8K ´ 16, 0-Wait)
0x3F FFC0
A.
128-Bit Password
Vector (32 Vectors, Enabled if VMAP = 1)
Memory locations 0x3D 7E80–0x3D 7EAF are reserved in TMX/TMP silicon.
Figure 6-5. 280200 Memory Map
50
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-3. Addresses of Flash Sectors in F28021/28023/28027
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x3F 0000 to 0x3F 1FFF
Sector D (8K × 16)
0x3F 2000 to 0x3F 3FFF
Sector C (8K × 16)
0x3F 4000 to 0x3F 5FFF
Sector B (8K × 16)
0x3F 6000 to 0x3F 7F7F
Sector A (8K × 16)
0x3F 7F80 to 0x3F 7FF5
Program to 0x0000 when using the
Code Security Module
0x3F 7FF6 to 0x3F 7FF7
Boot-to-Flash Entry Point
(program branch instruction here)
0x3F 7FF8 to 0x3F 7FFF
Security Password (128-Bit)
(Do not program to all zeros)
Table 6-4. Addresses of Flash Sectors in F28020/28022/28026
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x3F 4000 to 0x3F 4FFF
Sector D (4K × 16)
0x3F 5000 to 0x3F 5FFF
Sector C (4K × 16)
0x3F 6000 to 0x3F 6FFF
Sector B (4K × 16)
0x3F 7000 to 0x3F 7F7F
Sector A (4K × 16)
0x3F 7F80 to 0x3F 7FF5
Program to 0x0000 when using the
Code Security Module
0x3F 7FF6 to 0x3F 7FF7
Boot-to-Flash Entry Point
(program branch instruction here)
0x3F 7FF8 to 0x3F 7FFF
Security Password (128-Bit)
(Do not program to all zeros)
Table 6-5. Addresses of Flash Sectors in F280200
ADDRESS RANGE
PROGRAM AND DATA SPACE
0x3F 6000 to 0x3F 6FFF
Sector B (4K × 16)
0x3F 7000 to 0x3F 7F7F
Sector A (4K × 16)
0x3F 7F80 to 0x3F 7FF5
Program to 0x0000 when using the
Code Security Module
0x3F 7FF6 to 0x3F 7FF7
Boot-to-Flash Entry Point
(program branch instruction here)
0x3F 7FF8 to 0x3F 7FFF
Security Password (128-Bit)
(Do not program to all zeros)
NOTE
•
When the code-security passwords are programmed, all addresses from 0x3F 7F80 to
0x3F 7FF5 cannot be used as program code or data. These locations must be
programmed to 0x0000.
• If the code security feature is not used, addresses 0x3F 7F80 to 0x3F 7FEF may be
used for code or data. Addresses 0x3F 7FF0 to 0x3F 7FF5 are reserved for data and
should not contain program code.
Table 6-6 shows how to handle these memory locations.
Detailed Description
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Table 6-6. Impact of Using the Code Security Module
FLASH
ADDRESS
CODE SECURITY ENABLED
0x3F 7F80 to 0x3F 7FEF
CODE SECURITY DISABLED
Application code and data
Fill with 0x0000
0x3F 7FF0 to 0x3F 7FF5
Reserved for data only
Peripheral Frame 1 and Peripheral Frame 2 are grouped together to enable these blocks to be write/read
peripheral block protected. The protected mode makes sure that all accesses to these blocks happen as
written. Because of the pipeline, a write immediately followed by a read to different memory locations, will
appear in reverse order on the memory bus of the CPU. This can cause problems in certain peripheral
applications where the user expected the write to occur first (as written). The CPU supports a block
protection mode where a region of memory can be protected so that operations occur as written (the
penalty is extra cycles are added to align the operations). This mode is programmable and by default, it
protects the selected zones.
The wait states for the various spaces in the memory map area are listed in Table 6-7.
Table 6-7. Wait States
AREA
WAIT STATES (CPU)
COMMENTS
M0 and M1 SARAMs
0-wait
Peripheral Frame 0
0-wait
Peripheral Frame 1
0-wait (writes)
Cycles can be extended by peripheral generated ready.
2-wait (reads)
Back-to-back write operations to Peripheral Frame 1 registers will incur
a 1-cycle stall (1-cycle delay).
0-wait (writes)
Fixed. Cycles cannot be extended by the peripheral.
Peripheral Frame 2
Fixed
2-wait (reads)
L0 SARAM
0-wait data and program
OTP
FLASH
Assumes no CPU conflicts
Programmable
Programmed through the Flash registers.
1-wait minimum
1-wait is minimum number of wait states allowed.
Programmable
Programmed through the Flash registers.
0-wait Paged min
1-wait Random min
Random ≥ Paged
FLASH Password
Boot-ROM
52
16-wait fixed
Wait states of password locations are fixed.
0-wait
Detailed Description
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6.3
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Register Maps
The devices contain three peripheral register spaces. The spaces are categorized as follows:
Peripheral Frame 0: These are peripherals that are mapped directly to the CPU memory bus.
See Table 6-8.
Peripheral Frame 1: These are peripherals that are mapped to the 32-bit peripheral bus. See
Table 6-9.
Peripheral Frame 2: These are peripherals that are mapped to the 16-bit peripheral bus. See
Table 6-10.
Table 6-8. Peripheral Frame 0 Registers (1)
ADDRESS RANGE
SIZE (×16)
EALLOW PROTECTED (2)
Device Emulation Registers
0x00 0880 to 0x00 0984
261
Yes
System Power Control Registers
0x00 0985 to 0x00 0987
3
Yes
NAME
FLASH Registers
(3)
0x00 0A80 to 0x00 0ADF
96
Yes
Code Security Module Registers
0x00 0AE0 to 0x00 0AEF
16
Yes
ADC registers (0 wait read only)
0x00 0B00 to 0x00 0B0F
16
No
CPU–TIMER0/1/2 Registers
0x00 0C00 to 0x00 0C3F
64
No
PIE Registers
0x00 0CE0 to 0x00 0CFF
32
No
PIE Vector Table
0x00 0D00 to 0x00 0DFF
256
No
(1)
(2)
(3)
Registers in Frame 0 support 16-bit and 32-bit accesses.
If registers are EALLOW protected, then writes cannot be performed until the EALLOW instruction is executed. The EDIS instruction
disables writes to prevent stray code or pointers from corrupting register contents.
The Flash Registers are also protected by the Code Security Module (CSM).
Table 6-9. Peripheral Frame 1 Registers
ADDRESS RANGE
SIZE (×16)
Comparator 1 registers
NAME
0x00 6400 to 0x00 641F
32
(1)
Comparator 2 registers
0x00 6420 to 0x00 643F
32
(1)
ePWM1 + HRPWM1 registers
0x00 6800 to 0x00 683F
64
(1)
ePWM2 + HRPWM2 registers
0x00 6840 to 0x00 687F
64
(1)
ePWM3 + HRPWM3 registers
0x00 6880 to 0x00 68BF
64
(1)
ePWM4 + HRPWM4 registers
0x00 68C0 to 0x00 68FF
64
(1)
eCAP1 registers
0x00 6A00 to 0x00 6A1F
32
No
GPIO registers
0x00 6F80 to 0x00 6FFF
128
(1)
EALLOW PROTECTED
(1)
Some registers are EALLOW protected. For more information, see the TMS320F2802x,TMS320F2802xx Piccolo Technical Reference
Manual.
Table 6-10. Peripheral Frame 2 Registers
ADDRESS RANGE
SIZE (×16)
EALLOW PROTECTED
System Control Registers
NAME
0x00 7010 to 0x00 702F
32
Yes
SPI-A Registers
0x00 7040 to 0x00 704F
16
No
SCI-A Registers
0x00 7050 to 0x00 705F
16
No
NMI Watchdog Interrupt Registers
0x00 7060 to 0x00 706F
16
Yes
External Interrupt Registers
0x00 7070 to 0x00 707F
16
Yes
ADC Registers
0x00 7100 to 0x00 717F
128
(1)
I2C-A Registers
0x00 7900 to 0x00 793F
64
(1)
(1)
Some registers are EALLOW protected. For more information, see the TMS320F2802x,TMS320F2802xx Piccolo Technical Reference
Manual.
Detailed Description
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TMS320F28027, TMS320F28026, TMS320F28023, TMS320F28022
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6.4
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Device Emulation Registers
These registers are used to control the protection mode of the C28x CPU and to monitor some critical
device signals. The registers are defined in Table 6-11 .
Table 6-11. Device Emulation Registers
NAME
DEVICECNF
PARTID
CLASSID
REVID
ADDRESS
RANGE
SIZE (x16)
0x0880
0x0881
2
Device Configuration Register
0x3D 7FFF
1
Part ID Register
0x0882
0x0883
1
1
EALLOW
PROTECTED
DESCRIPTION
Class ID Register
Revision ID
Register
Yes
TMS320F280200PT
0x00C1
TMS320F280200DA
0x00C0
TMS320F28027PT
0x00CF
TMS320F28027DA
0x00CE
TMS320F28027FPT
0x00CF
TMS320F28027FDA
0x00CE
TMS320F28026PT
0x00C7
TMS320F28026DA
0x00C6
TMS320F28026FPT
0x00C7
TMS320F28026FDA
0x00C6
TMS320F28023PT
0x00CD
TMS320F28023DA
0x00CC
TMS320F28022PT
0x00C5
TMS320F28022DA
0x00C4
TMS320F28021PT
0x00CB
TMS320F28021DA
0x00CA
TMS320F28020PT
0x00C3
TMS320F28020DA
0x00C2
TMS320F280200PT/DA
0x00C7
TMS320F28027PT/DA
0x00CF
TMS320F28027FPT/DA
0x00CF
TMS320F28026PT/DA
0x00C7
TMS320F28026FPT/DA
0x00C7
TMS320F28023PT/DA
0x00CF
TMS320F28022PT/DA
0x00C7
TMS320F28021PT/DA
0x00CF
TMS320F28020PT/DA
0x00C7
No
No
0x0000 - Silicon Rev. 0 - TMS
0x0001 - Silicon Rev. A - TMS
No
0x0002 - Silicon Rev. B - TMS
54
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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6.5
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
VREG/BOR/POR
Although the core and I/O circuitry operate on two different voltages, these devices have an on-chip
voltage regulator (VREG) to generate the VDD voltage from the VDDIO supply. This eliminates the cost and
space of a second external regulator on an application board. Additionally, internal power-on reset (POR)
and brown-out reset (BOR) circuits monitor both the VDD and VDDIO rails during power-up and run mode.
6.5.1
On-chip Voltage Regulator (VREG)
A linear regulator generates the core voltage (VDD) from the VDDIO supply. Therefore, although capacitors
are required on each VDD pin to stabilize the generated voltage, power need not be supplied to these pins
to operate the device. Conversely, the VREG can be disabled, should power or redundancy be the
primary concern of the application.
6.5.1.1
Using the On-chip VREG
To use the on-chip VREG, the VREGENZ pin should be tied low and the appropriate recommended
operating voltage should be supplied to the VDDIO and VDDA pins. In this case, the VDD voltage needed by
the core logic will be generated by the VREG. Each VDD pin requires on the order of 1.2 μF (minimum)
capacitance for proper regulation of the VREG. These capacitors should be located as close as possible
to the VDD pins. Driving an external load with the internal VREG is not supported.
6.5.1.2
Disabling the On-chip VREG
To conserve power, it is also possible to disable the on-chip VREG and supply the core logic voltage to
the VDD pins with a more efficient external regulator. To enable this option, the VREGENZ pin must be tied
high.
Detailed Description
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6.5.2
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On-chip Power-On Reset (POR) and Brown-Out Reset (BOR) Circuit
Two on-chip supervisory circuits, the power-on reset (POR) and the brown-out reset (BOR) remove the
burden of monitoring the VDD and VDDIO supply rails from the application board. The purpose of the POR is
to create a clean reset throughout the device during the entire power-up procedure. The trip point is a
looser, lower trip point than the BOR, which watches for dips in the VDD or VDDIO rail during device
operation. The POR function is present on both VDD and VDDIO rails at all times. After initial device powerup, the BOR function is present on VDDIO at all times, and on VDD when the internal VREG is enabled
(VREGENZ pin is tied low). Both functions tie the XRS pin low when one of the voltages is below their
respective trip point. VDD BOR and overvoltage trip points are outside of the recommended operating
voltages. Proper device operation cannot be ensured. If overvoltage or undervoltage conditions affecting
the system is a concern for an application, an external voltage supervisor should be added. Figure 6-6
shows the VREG, POR, and BOR. To disable both the VDD and VDDIO BOR functions, a bit is provided in
the
BORCFG
register.
For
details,
see
the
System
Control
chapter
in
the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
In
I/O Pin
Out
(Force Hi-Z When High)
DIR (0 = Input, 1 = Output)
Internal
Weak PU
SYSRS
SYSCLKOUT
Deglitch
Filter
Sync RS
WDRST
MCLKRS
PLL
+
Clocking
Logic
XRS
Pin
C28
Core
JTAG
TCK
Detect
Logic
VREGHALT
(A)
WDRST
(B)
PBRS
A.
B.
POR/BOR
Generating
Module
On-Chip
Voltage
Regulator
(VREG)
VREGENZ
WDRST is the reset signal from the CPU-watchdog.
PBRS is the reset signal from the POR/BOR module.
Figure 6-6. VREG + POR + BOR + Reset Signal Connectivity
56
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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6.6
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
System Control
This section describes the oscillator and clocking mechanisms, the watchdog function and the low-power
modes.
Table 6-12. PLL, Clocking, Watchdog, and Low-Power Mode Registers
NAME
DESCRIPTION (1)
ADDRESS
SIZE (x16)
BORCFG
0x00 0985
1
BOR Configuration Register
XCLK
0x00 7010
1
XCLKOUT Control
PLLSTS
0x00 7011
1
PLL Status Register
CLKCTL
0x00 7012
1
Clock Control Register
PLLLOCKPRD
0x00 7013
1
PLL Lock Period
INTOSC1TRIM
0x00 7014
1
Internal Oscillator 1 Trim Register
INTOSC2TRIM
0x00 7016
1
Internal Oscillator 2 Trim Register
LOSPCP
0x00 701B
1
Low-Speed Peripheral Clock Prescaler Register
PCLKCR0
0x00 701C
1
Peripheral Clock Control Register 0
PCLKCR1
0x00 701D
1
Peripheral Clock Control Register 1
LPMCR0
0x00 701E
1
Low-Power Mode Control Register 0
PCLKCR3
0x00 7020
1
Peripheral Clock Control Register 3
PLLCR
0x00 7021
1
PLL Control Register
SCSR
0x00 7022
1
System Control and Status Register
WDCNTR
0x00 7023
1
Watchdog Counter Register
WDKEY
0x00 7025
1
Watchdog Reset Key Register
WDCR
0x00 7029
1
Watchdog Control Register
(1)
All registers in this table are EALLOW protected.
Detailed Description
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Figure 6-7 shows the various clock domains that are discussed. Figure 6-8 shows the various clock
sources (both internal and external) that can provide a clock for device operation.
SYSCLKOUT
LOSPCP
(System Ctrl Regs)
PCLKCR0/1/3
(System Ctrl Regs)
Clock Enables
I/O
SPI-A, SCI-A
C28x Core
CLKIN
LSPCLK
Peripheral
Registers
PF2
Peripheral
Registers
PF1
Peripheral
Registers
PF1
Peripheral
Registers
PF2
Clock Enables
I/O
GPIO
Mux
eCAP1
Clock Enables
I/O
ePWM1/.../4
Clock Enables
I/O
I2C-A
Clock Enables
16 Ch
PF2
ADC
Registers
PF0
Analog
GPIO
Mux
Clock Enables
6
A.
12-Bit ADC
COMP1/2
COMP
Registers
PF1
CLKIN is the clock into the CPU. It is passed out of the CPU as SYSCLKOUT (that is, CLKIN is the same frequency
as SYSCLKOUT).
Figure 6-7. Clock and Reset Domains
58
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
CLKCTL[WDCLKSRCSEL]
Internal
OSC 1
(10 MHz)
(A)
INTOSC1TRIM Reg
0
OSC1CLK
OSCCLKSRC1
WDCLK
CPU-watchdog
(OSC1CLK on XRS reset)
OSCE
1
CLKCTL[INTOSC1OFF]
1 = Turn OSC Off
CLKCTL[OSCCLKSRCSEL]
CLKCTL[INTOSC1HALT]
WAKEOSC
1 = Ignore HALT
0
Internal OSC2CLK
OSC 2
(10 MHz)
(A)
INTOSC2TRIM Reg
OSCCLK
PLL
Missing-Clock-Detect Circuit
(OSC1CLK on XRS reset)
(B)
1
OSCE
CLKCTL[TRM2CLKPRESCALE]
CLKCTL[TMR2CLKSRCSEL]
1 = Turn OSC Off
10
CLKCTL[INTOSC2OFF]
11
1 = Ignore HALT
Prescale
/1, /2, /4,
/8, /16
01, 10, 11
CPUTMR2CLK
01
1
00
CLKCTL[INTOSC2HALT]
SYSCLKOUT
OSCCLKSRC2
0
0 = GPIO38
1 = GPIO19
XCLK[XCLKINSEL]
SYNC
Edge
Detect
CLKCTL[OSCCLKSRC2SEL]
CLKCTL[XCLKINOFF]
0
XCLKIN
GPIO19
or
GPIO38
1
0
XCLKIN
X1
EXTCLK
(Crystal)
OSC
XTAL
WAKEOSC
(Oscillators enabled when this signal is high)
X2
CLKCTL[XTALOSCOFF]
A.
B.
0 = OSC on (default on reset)
1 = Turn OSC off
Register loaded from TI OTP-based calibration function.
See Section 6.6.4 for details on missing clock detection.
Figure 6-8. Clock Tree
Detailed Description
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6.6.1
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Internal Zero Pin Oscillators
The F2802x devices contain two independent internal zero pin oscillators. By default both oscillators are
turned on at power up, and internal oscillator 1 is the default clock source at this time. For power savings,
unused oscillators may be powered down by the user. The center frequency of these oscillators is
determined by their respective oscillator trim registers, written to in the calibration routine as part of the
boot ROM execution. See Section 5, Electrical Specifications, for more information on these oscillators.
6.6.2
Crystal Oscillator Option
The on-chip crystal oscillator X1 and X2 pins are 1.8-V level signals and must never have 3.3-V level
signals applied to them. If a system 3.3-V external oscillator is to be used as a clock source, it should be
connected to the XCLKIN pin only. The X1 pin is not intended to be used as a single-ended clock input, it
should be used with X2 and a crystal.
The typical specifications for the external quartz crystal (fundamental mode, parallel resonant) are listed in
Table 6-13. Furthermore, ESR range = 30 to 150 Ω.
Table 6-13. Typical Specifications for External Quartz Crystal (1)
(1)
FREQUENCY (MHz)
Rd (Ω)
CL1 (pF)
CL2 (pF)
5
2200
18
18
10
470
15
15
15
0
15
15
20
0
12
12
Cshunt should be less than or equal to 5 pF.
XCLKIN/GPIO19/38
Turn off
XCLKIN path
in CLKCTL
register
A.
X1
X2
Rd
CL1
Crystal
CL2
X1/X2 pins are available in 48-pin package only.
Figure 6-9. Using the On-chip Crystal Oscillator
NOTE
1. CL1 and CL2 are the total capacitance of the circuit board and components excluding the
IC and crystal. The value is usually approximately twice the value of the crystal's load
capacitance.
2. The load capacitance of the crystal is described in the crystal specifications of the
manufacturers.
3. TI recommends that customers have the resonator/crystal vendor characterize the
operation of their device with the MCU chip. The resonator/crystal vendor has the
equipment and expertise to tune the tank circuit. The vendor can also advise the
customer regarding the proper tank component values that will produce proper start-up
and stability over the entire operating range.
60
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XCLKIN/GPIO19/38
X1
X2
NC
External Clock Signal
(Toggling 0−VDDIO)
Figure 6-10. Using a 3.3-V External Oscillator
6.6.3
PLL-Based Clock Module
The devices have an on-chip, PLL-based clock module. This module provides all the necessary clocking
signals for the device, as well as control for low-power mode entry. The PLL has a 4-bit ratio control
PLLCR[DIV] to select different CPU clock rates. The watchdog module should be disabled before writing
to the PLLCR register. It can be re-enabled (if need be) after the PLL module has stabilized, which takes
1 ms. The input clock and PLLCR[DIV] bits should be chosen in such a way that the output frequency of
the PLL (VCOCLK) is at least 50 MHz.
Table 6-14. PLL Settings
PLLCR[DIV] VALUE (1)
(1)
(2)
(3)
SYSCLKOUT (CLKIN)
(2)
PLLSTS[DIVSEL] = 0 or 1
(3)
PLLSTS[DIVSEL] = 2
PLLSTS[DIVSEL] = 3
0000 (PLL bypass)
OSCCLK/4 (Default) (1)
OSCCLK/2
OSCCLK
0001
(OSCCLK * 1)/4
(OSCCLK * 1)/2
(OSCCLK * 1)/1
0010
(OSCCLK * 2)/4
(OSCCLK * 2)/2
(OSCCLK * 2)/1
0011
(OSCCLK * 3)/4
(OSCCLK * 3)/2
(OSCCLK * 3)/1
0100
(OSCCLK * 4)/4
(OSCCLK * 4)/2
(OSCCLK * 4)/1
0101
(OSCCLK * 5)/4
(OSCCLK * 5)/2
(OSCCLK * 5)/1
0110
(OSCCLK * 6)/4
(OSCCLK * 6)/2
(OSCCLK * 6)/1
0111
(OSCCLK * 7)/4
(OSCCLK * 7)/2
(OSCCLK * 7)/1
1000
(OSCCLK * 8)/4
(OSCCLK * 8)/2
(OSCCLK * 8)/1
1001
(OSCCLK * 9)/4
(OSCCLK * 9)/2
(OSCCLK * 9)/1
1010
(OSCCLK * 10)/4
(OSCCLK * 10)/2
(OSCCLK * 10)/1
1011
(OSCCLK * 11)/4
(OSCCLK * 11)/2
(OSCCLK * 11)/1
1100
(OSCCLK * 12)/4
(OSCCLK * 12)/2
(OSCCLK * 12)/1
The PLL control register (PLLCR) and PLL Status Register (PLLSTS) are reset to their default state by the XRS signal or a watchdog
reset only. A reset issued by the debugger or the missing clock detect logic has no effect.
This register is EALLOW protected. See the System Control chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical
Reference Manual for more information.
By default, PLLSTS[DIVSEL] is configured for /4. (The boot ROM changes this to /1.) PLLSTS[DIVSEL] must be 0 before writing to the
PLLCR and should be changed only after PLLSTS[PLLLOCKS] = 1.
Table 6-15. CLKIN Divide Options
PLLSTS [DIVSEL]
CLKIN DIVIDE
0
/4
1
/4
2
/2
3
/1
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The PLL-based clock module provides four modes of operation:
• INTOSC1 (Internal Zero-pin Oscillator 1): This is the on-chip internal oscillator 1. This can provide
the clock for the Watchdog block, core and CPU-Timer 2
• INTOSC2 (Internal Zero-pin Oscillator 2): This is the on-chip internal oscillator 2. This can provide
the clock for the Watchdog block, core and CPU-Timer 2. Both INTOSC1 and INTOSC2 can be
independently chosen for the Watchdog block, core and CPU-Timer 2.
• Crystal/Resonator Operation: The on-chip (crystal) oscillator enables the use of an external
crystal/resonator attached to the device to provide the time base. The crystal/resonator is connected to
the X1/X2 pins. Some devices may not have the X1/X2 pins. See Table 4-1 for details.
• External Clock Source Operation: If the on-chip (crystal) oscillator is not used, this mode allows it to
be bypassed. The device clocks are generated from an external clock source input on the XCLKIN pin.
The XCLKIN is multiplexed with GPIO19 or GPIO38 pin. The XCLKIN input can be selected as
GPIO19 or GPIO38 through the XCLKINSEL bit in XCLK register. The CLKCTL[XCLKINOFF] bit
disables this clock input (forced low). If the clock source is not used or the respective pins are used as
GPIOs, the user should disable at boot time.
Before changing clock sources, ensure that the target clock is present. If a clock is not present, then that
clock source must be disabled (using the CLKCTL register) before switching clocks.
Table 6-16. Possible PLL Configuration Modes
REMARKS
PLLSTS[DIVSEL]
CLKIN AND
SYSCLKOUT
Invoked by the user setting the PLLOFF bit in the PLLSTS register. The PLL block
is disabled in this mode. This can be useful to reduce system noise and for lowpower operation. The PLLCR register must first be set to 0x0000 (PLL Bypass)
before entering this mode. The CPU clock (CLKIN) is derived directly from the
input clock on either X1/X2, X1 or XCLKIN.
0, 1
2
3
OSCCLK/4
OSCCLK/2
OSCCLK/1
0, 1
2
3
OSCCLK/4
OSCCLK/2
OSCCLK/1
0, 1
2
3
OSCCLK * n/4
OSCCLK * n/2
OSCCLK * n/1
PLL MODE
PLL Off
PLL Bypass is the default PLL configuration upon power-up or after an external
reset (XRS). This mode is selected when the PLLCR register is set to 0x0000 or
PLL Bypass
while the PLL locks to a new frequency after the PLLCR register has been
modified. In this mode, the PLL is bypassed but the PLL is not turned off.
PLL Enable
6.6.4
Achieved by writing a nonzero value n into the PLLCR register. Upon writing to the
PLLCR the device will switch to PLL Bypass mode until the PLL locks.
Loss of Input Clock (NMI Watchdog Function)
The 2802x devices may be clocked from either one of the internal zero-pin oscillators
(INTOSC1/INTOSC2), the on-chip crystal oscillator, or from an external clock input. Regardless of the
clock source, in PLL-enabled and PLL-bypass mode, if the input clock to the PLL vanishes, the PLL will
issue a limp-mode clock at its output. This limp-mode clock continues to clock the CPU and peripherals at
a typical frequency of 1–5 MHz.
When the limp mode is activated, a CLOCKFAIL signal is generated that is latched as an NMI interrupt.
Depending on how the NMIRESETSEL bit has been configured, a reset to the device can be fired
immediately or the NMI watchdog counter can issue a reset when it overflows. In addition to this, the
Missing Clock Status (MCLKSTS) bit is set. The NMI interrupt could be used by the application to detect
the input clock failure and initiate necessary corrective action such as switching over to an alternative
clock source (if available) or initiate a shut-down procedure for the system.
If the software does not respond to the clock-fail condition, the NMI watchdog triggers a reset after a
preprogrammed time interval. Figure 6-11 shows the interrupt mechanisms involved.
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NMIFLG[NMINT]
NMIFLGCLR[NMINT]
Clear
Latch
Set Clear
XRS
NMINT
Generate
Interrupt
Pulse
When
Input = 1
1
0
NMIFLG[CLOCKFAIL]
Clear
Latch
Clear Set
0
NMIFLGCLR[CLOCKFAIL]
CLOCKFAIL
SYNC?
SYSCLKOUT
NMICFG[CLOCKFAIL]
XRS
NMIFLGFRC[CLOCKFAIL]
SYSCLKOUT
SYSRS
NMIWDPRD[15:0]
NMIWDCNT[15:0]
NMI-watchdog
NMIRS
See System
Control Section
Figure 6-11. NMI-watchdog
6.6.5
CPU-Watchdog Module
The CPU-watchdog module on the 2802x device is similar to the one used on the 281x/280x/283xx
devices. This module generates an output pulse, 512 oscillator clocks wide (OSCCLK), whenever the 8-bit
watchdog up counter has reached its maximum value. To prevent this, the user must disable the counter
or the software must periodically write a 0x55 + 0xAA sequence into the watchdog key register that resets
the watchdog counter. Figure 6-12 shows the various functional blocks within the watchdog module.
Normally, when the input clocks are present, the CPU-watchdog counter decrements to initiate a CPUwatchdog reset or WDINT interrupt. However, when the external input clock fails, the CPU-watchdog
counter stops decrementing (that is, the watchdog counter does not change with the limp-mode clock).
NOTE
The CPU-watchdog is different from the NMI watchdog. It is the legacy watchdog that is
present in all 28x devices.
NOTE
Applications in which the correct CPU operating frequency is absolutely critical should
implement a mechanism by which the MCU will be held in reset, should the input clocks ever
fail. For example, an R-C circuit may be used to trigger the XRS pin of the MCU, should the
capacitor ever get fully charged. An I/O pin may be used to discharge the capacitor on a
periodic basis to prevent it from getting fully charged. Such a circuit would also help in
detecting failure of the flash memory.
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WDCR (WDPS[2:0])
WDCR (WDDIS)
WDCNTR(7:0)
WDCLK
Watchdog
Prescaler
/512
WDCLK
8-Bit
Watchdog
Counter
CLR
Clear Counter
Internal
Pullup
WDKEY(7:0)
Watchdog
55 + AA
Key Detector
WDRST
Generate
Output Pulse
WDINT
(512 OSCCLKs)
Good K ey
XRS
Core-reset
WDCR (WDCHK[2:0])
WDRST(A)
A.
1
0
Bad
WDCHK
Key
SCSR (WDENINT)
1
The WDRST signal is driven low for 512 OSCCLK cycles.
Figure 6-12. CPU-watchdog Module
The WDINT signal enables the watchdog to be used as a wakeup from IDLE/STANDBY mode.
In STANDBY mode, all peripherals are turned off on the device. The only peripheral that remains
functional is the CPU-watchdog. This module will run off OSCCLK. The WDINT signal is fed to the LPM
block so that it can wake the device from STANDBY (if enabled). See Section 6.7, Low-power Modes
Block, for more details.
In IDLE mode, the WDINT signal can generate an interrupt to the CPU, through the PIE, to take the CPU
out of IDLE mode.
In HALT mode, the CPU-watchdog can be used to wake up the device through a device reset.
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6.7
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Low-power Modes Block
Table 6-17 summarizes the various modes.
Table 6-17. Low-power Modes
EXIT (1)
MODE
LPMCR0(1:0)
OSCCLK
CLKIN
SYSCLKOUT
IDLE
00
On
On
On
XRS, CPU-watchdog interrupt, any
enabled interrupt
STANDBY
01
On
(CPU-watchdog still running)
Off
Off
XRS, CPU-watchdog interrupt, GPIO
Port A signal, debugger (2)
1X
Off
(on-chip crystal oscillator and
PLL turned off, zero-pin oscillator
and CPU-watchdog state
dependent on user code.)
Off
Off
XRS, GPIO Port A signal, debugger (2),
CPU-watchdog
HALT (3)
(1)
(2)
(3)
The EXIT column lists which signals or under what conditions the low-power mode is exited. A low signal, on any of the signals, exits
the low-power condition. This signal must be kept low long enough for an interrupt to be recognized by the device. Otherwise, the lowpower mode will not be exited and the device will go back into the indicated low-power mode.
The JTAG port can still function even if the CPU clock (CLKIN) is turned off.
The WDCLK must be active for the device to go into HALT mode.
The various low-power modes operate as follows:
IDLE Mode:
This mode is exited by any enabled interrupt that is recognized by the
processor. The LPM block performs no tasks during this mode as long as
the LPMCR0(LPM) bits are set to 0,0.
STANDBY Mode:
Any GPIO port A signal (GPIO[31:0]) can wake the device from STANDBY
mode. The user must select which signal(s) will wake the device in the
GPIOLPMSEL register. The selected signal(s) are also qualified by the
OSCCLK before waking the device. The number of OSCCLKs is specified in
the LPMCR0 register.
HALT Mode:
CPU-watchdog, XRS, and any GPIO port A signal (GPIO[31:0]) can wake
the device from HALT mode. The user selects the signal in the
GPIOLPMSEL register.
NOTE
The low-power modes do not affect the state of the output pins (PWM pins included). They
will be in whatever state the code left them in when the IDLE instruction was executed. See
the System Control chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical
Reference Manual for more details.
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6.8
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Interrupts
Figure 6-13 shows how the various interrupt sources are multiplexed.
Peripherals
2
(SPI, SCI, ePWM, I C, HRPWM, eCAP, ADC)
WDINT
WAKEINT
LPMINT
Watchdog
Low-Power Modes
SYSCLKOUT
XINT1
Interrupt Control
MUX
XINT1
Sync
C28
Core
GPIOXINT1SEL(4:0)
ADC
XINT2
XINT2SOC
XINT2
Interrupt Control
MUX
PIE
INT1
to
INT12
Up to 96 Interrupts
XINT1CR(15:0)
XINT1CTR(15:0)
XINT2CR(15:0)
XINT2CTR(15:0)
GPIOXINT2SEL(4:0)
XINT3
Interrupt Control
MUX
GPIO0.int
XINT3
XINT3CR(15:0)
GPIO
MUX
GPIO31.int
XINT3CTR(15:0)
GPIOXINT3SEL(4:0)
TINT0
INT13
TINT1
INT14
TINT2
NMI
CPU TIMER 0
CPU TIMER 1
CPU TIMER 2
NMI interrupt with watchdog function
(See the NMI Watchdog section.)
CPUTMR2CLK
CLOCKFAIL
NMIRS
System Control
(See the System
Control section.)
Figure 6-13. External and PIE Interrupt Sources
66
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Eight PIE block interrupts are grouped into one CPU interrupt. In total, 12 CPU interrupt groups, with
8 interrupts per group equals 96 possible interrupts. Table 6-18 shows the interrupts used by 2802x
devices.
The TRAP #VectorNumber instruction transfers program control to the interrupt service routine
corresponding to the vector specified. The TRAP #0 instruction attempts to transfer program control to the
address pointed to by the reset vector. The PIE vector table does not, however, include a reset vector.
Therefore, the TRAP #0 instruction should not be used when the PIE is enabled. Doing so will result in
undefined behavior.
When the PIE is enabled, the TRAP #1 to TRAP #12 instructions will transfer program control to the
interrupt service routine corresponding to the first vector within the PIE group. For example: the TRAP #1
instruction fetches the vector from INT1.1, the TRAP #2 instruction fetches the vector from INT2.1, and so
forth.
IFR[12:1]
IER[12:1]
INTM
INT1
INT2
1
CPU
MUX
0
INT11
INT12
(Flag)
INTx
INTx.1
INTx.2
INTx.3
INTx.4
INTx.5
INTx.6
INTx.7
INTx.8
MUX
PIEACKx
(Enable/Flag)
Global
Enable
(Enable)
(Enable)
(Flag)
PIEIERx[8:1]
PIEIFRx[8:1]
From
Peripherals
or
External
Interrupts
Figure 6-14. Multiplexing of Interrupts Using the PIE Block
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Table 6-18. PIE MUXed Peripheral Interrupt Vector Table (1)
INT1.y
INT2.y
INT3.y
INT4.y
INT5.y
INT6.y
INT7.y
INT8.y
INT9.y
INT10.y
INT11.y
INT12.y
(1)
68
INTx.8
INTx.7
INTx.6
INTx.5
INTx.4
INTx.3
INTx.2
INTx.1
WAKEINT
TINT0
ADCINT9
XINT2
XINT1
Reserved
ADCINT2
ADCINT1
(LPM/WD)
(TIMER 0)
(ADC)
Ext. int. 2
Ext. int. 1
–
(ADC)
(ADC)
0xD4E
0xD4C
0xD4A
0xD48
0xD46
0xD44
0xD42
0xD40
Reserved
Reserved
Reserved
Reserved
EPWM4_TZINT
EPWM3_TZINT
EPWM2_TZINT
EPWM1_TZINT
–
–
–
–
(ePWM4)
(ePWM3)
(ePWM2)
(ePWM1)
0xD5E
0xD5C
0xD5A
0xD58
0xD56
0xD54
0xD52
0xD50
Reserved
Reserved
Reserved
Reserved
EPWM4_INT
EPWM3_INT
EPWM2_INT
EPWM1_INT
(ePWM1)
–
–
–
–
(ePWM4)
(ePWM3)
(ePWM2)
0xD6E
0xD6C
0xD6A
0xD68
0xD66
0xD64
0xD62
0xD60
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
ECAP1_INT
(eCAP1)
–
–
–
–
–
–
–
0xD7E
0xD7C
0xD7A
0xD78
0xD76
0xD74
0xD72
0xD70
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
–
–
–
–
–
–
–
–
0xD8E
0xD8C
0xD8A
0xD88
0xD86
0xD84
0xD82
0xD80
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SPITXINTA
SPIRXINTA
–
–
–
–
–
–
(SPI-A)
(SPI-A)
0xD9E
0xD9C
0xD9A
0xD98
0xD96
0xD94
0xD92
0xD90
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
–
–
–
–
–
–
–
–
0xDAE
0xDAC
0xDAA
0xDA8
0xDA6
0xDA4
0xDA2
0xDA0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
I2CINT2A
I2CINT1A
–
–
–
–
–
–
(I2C-A)
(I2C-A)
0xDBE
0xDBC
0xDBA
0xDB8
0xDB6
0xDB4
0xDB2
0xDB0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SCITXINTA
SCIRXINTA
(SCI-A)
–
–
–
–
–
–
(SCI-A)
0xDCE
0xDCC
0xDCA
0xDC8
0xDC6
0xDC4
0xDC2
0xDC0
ADCINT8
ADCINT7
ADCINT6
ADCINT5
ADCINT4
ADCINT3
ADCINT2
ADCINT1
(ADC)
(ADC)
(ADC)
(ADC)
(ADC)
(ADC)
(ADC)
(ADC)
0xDDE
0xDDC
0xDDA
0xDD8
0xDD6
0xDD4
0xDD2
0xDD0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
–
–
–
–
–
–
–
–
0xDEE
0xDEC
0xDEA
0xDE8
0xDE6
0xDE4
0xDE2
0xDE0
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
XINT3
–
–
–
–
–
–
–
Ext. Int. 3
0xDFE
0xDFC
0xDFA
0xDF8
0xDF6
0xDF4
0xDF2
0xDF0
Out of 96 possible interrupts, some interrupts are not used. These interrupts are reserved for future devices. These interrupts can be
used as software interrupts if they are enabled at the PIEIFRx level, provided none of the interrupts within the group is being used by a
peripheral. Otherwise, interrupts coming in from peripherals may be lost by accidentally clearing their flag while modifying the PIEIFR.
To summarize, there are two safe cases when the reserved interrupts could be used as software interrupts:
• No peripheral within the group is asserting interrupts.
• No peripheral interrupts are assigned to the group (for example, PIE groups 5, 7, or 11) .
Detailed Description
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Table 6-19. PIE Configuration and Control Registers
NAME
DESCRIPTION (1)
ADDRESS
SIZE (x16)
PIECTRL
0x0CE0
1
PIE, Control Register
PIEACK
0x0CE1
1
PIE, Acknowledge Register
PIEIER1
0x0CE2
1
PIE, INT1 Group Enable Register
PIEIFR1
0x0CE3
1
PIE, INT1 Group Flag Register
PIEIER2
0x0CE4
1
PIE, INT2 Group Enable Register
PIEIFR2
0x0CE5
1
PIE, INT2 Group Flag Register
PIEIER3
0x0CE6
1
PIE, INT3 Group Enable Register
PIEIFR3
0x0CE7
1
PIE, INT3 Group Flag Register
PIEIER4
0x0CE8
1
PIE, INT4 Group Enable Register
PIEIFR4
0x0CE9
1
PIE, INT4 Group Flag Register
PIEIER5
0x0CEA
1
PIE, INT5 Group Enable Register
PIEIFR5
0x0CEB
1
PIE, INT5 Group Flag Register
PIEIER6
0x0CEC
1
PIE, INT6 Group Enable Register
PIEIFR6
0x0CED
1
PIE, INT6 Group Flag Register
PIEIER7
0x0CEE
1
PIE, INT7 Group Enable Register
PIEIFR7
0x0CEF
1
PIE, INT7 Group Flag Register
PIEIER8
0x0CF0
1
PIE, INT8 Group Enable Register
PIEIFR8
0x0CF1
1
PIE, INT8 Group Flag Register
PIEIER9
0x0CF2
1
PIE, INT9 Group Enable Register
PIEIFR9
0x0CF3
1
PIE, INT9 Group Flag Register
PIEIER10
0x0CF4
1
PIE, INT10 Group Enable Register
PIEIFR10
0x0CF5
1
PIE, INT10 Group Flag Register
PIEIER11
0x0CF6
1
PIE, INT11 Group Enable Register
PIEIFR11
0x0CF7
1
PIE, INT11 Group Flag Register
PIEIER12
0x0CF8
1
PIE, INT12 Group Enable Register
PIEIFR12
0x0CF9
1
PIE, INT12 Group Flag Register
Reserved
0x0CFA –
0x0CFF
6
Reserved
(1)
The PIE configuration and control registers are not protected by EALLOW mode. The PIE vector table
is protected.
Detailed Description
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6.8.1
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External Interrupts
Table 6-20. External Interrupt Registers
ADDRESS
SIZE (x16)
XINT1CR
NAME
0x00 7070
1
XINT1 configuration register
DESCRIPTION
XINT2CR
0x00 7071
1
XINT2 configuration register
XINT3CR
0x00 7072
1
XINT3 configuration register
XINT1CTR
0x00 7078
1
XINT1 counter register
XINT2CTR
0x00 7079
1
XINT2 counter register
XINT3CTR
0x00 707A
1
XINT3 counter register
Each external interrupt can be enabled/disabled or qualified using positive, negative, or both positive and
negative
edge.
For
more
information,
see
the
System
Control
chapter
in
the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
6.8.1.1
External Interrupt Electrical Data/Timing
Table 6-21. External Interrupt Timing Requirements (1)
MIN
tw(INT)
(1)
(2)
(2)
Pulse duration, INT input low/high
MAX
UNIT
Synchronous
1tc(SCO)
cycles
With qualifier
1tc(SCO) + tw(IQSW)
cycles
For an explanation of the input qualifier parameters, see Table 6-55.
This timing is applicable to any GPIO pin configured for ADCSOC functionality.
Table 6-22. External Interrupt Switching Characteristics (1)
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(INT)
(1)
MIN
Delay time, INT low/high to interrupt-vector fetch
MAX
UNIT
tw(IQSW) + 12tc(SCO)
cycles
For an explanation of the input qualifier parameters, see Table 6-55.
tw(INT)
XINT1, XINT2, XINT3
td(INT)
Address bus
(internal)
Interrupt Vector
Figure 6-15. External Interrupt Timing
70
Detailed Description
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6.9
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Peripherals
6.9.1
Analog Block
A 12-bit ADC core is implemented that has different timings than the 12-bit ADC used on F280x/F2833x.
The ADC wrapper is modified to incorporate the new timings and also other enhancements to improve the
timing control of start of conversions. Figure 6-16 shows the interaction of the analog module with the rest
of the F2802x system.
For more information on the ADC, see the Analog-to-Digital Converter and Comparator chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
38-Pin
48-Pin
VDDA
VDDA
(3.3 V) VDDA
(Agnd) VSSA
VREFLO
VREFLO VREFLO
Tied To Tied To
VSSA
VSSA
Interface Reference
Diff
VREFHI VREFHI
Tied To Tied To
A0
A0
VREFHI
A0
B0
A1
A2
A1
B1
A2
A3
A4
A6
A6
A7
B1
B2
B2
B3
B4
B4
B6
B6
B7
Signal Pinout
A2
Simultaneous Sampling Channels
A4
B2
COMP1OUT
AIO2
AIO10
10-Bit
DAC
Comp1
A3
B3
A4
B4
ADC
COMP2OUT
AIO4
AIO12
10-Bit
DAC
Comp2
(See Note A)
B5
Temperature Sensor
A5
A6
B6
AIO6
AIO14
A7
B7
A.
Comparator 2 is available only on the 48-pin PT package.
Figure 6-16. Analog Pin Configurations
Detailed Description
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6.9.1.1
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Analog-to-Digital Converter (ADC)
6.9.1.1.1 Features
The core of the ADC contains a single 12-bit converter fed by two sample-and-hold circuits. The sampleand-hold circuits can be sampled simultaneously or sequentially. These, in turn, are fed by a total of up to
13 analog input channels. The converter can be configured to run with an internal band-gap reference to
create true-voltage based conversions or with a pair of external voltage references (VREFHI/VREFLO) to
create ratiometric-based conversions.
Contrary to previous ADC types, this ADC is not sequencer-based. It is easy for the user to create a
series of conversions from a single trigger. However, the basic principle of operation is centered around
the configurations of individual conversions, called SOCs, or Start-Of-Conversions.
Functions of the ADC module include:
• 12-bit ADC core with built-in dual sample-and-hold (S/H)
• Simultaneous sampling or sequential sampling modes
• Full range analog input: 0 V to 3.3 V fixed, or VREFHI/VREFLO ratiometric. The digital value of the input
analog voltage is derived by:
– Internal Reference (VREFLO = VSSA. VREFHI must not exceed VDDA when using either internal or
external reference modes.)
Digital Value = 0,
when input £ 0 V
Digital Value = 4096 ´
Input Analog Voltage - VREFLO
3.3
Digital Value = 4095,
when 0 V < input < 3.3 V
when input ³ 3.3 V
– External Reference (VREFHI/VREFLO connected to external references. VREFHI must not exceed VDDA
when using either internal or external reference modes.)
when input £ 0 V
Digital Value = 0,
Digital Value = 4096 ´
Digital Value = 4095,
•
•
•
•
•
72
Input Analog Voltage - VREFLO
VREFHI - VREFLO
when 0 V < input < VREFHI
when input ³ VREFHI
Up to 16-channel, multiplexed inputs
16 SOCs, configurable for trigger, sample window, and channel
16 result registers (individually addressable) to store conversion values
Multiple trigger sources
– S/W – software immediate start
– ePWM 1–4
– GPIO XINT2
– CPU Timers 0/1/2
– ADCINT1/2
9 flexible PIE interrupts, can configure interrupt request after any conversion
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-23. ADC Configuration and Control Registers
ADDRESS
SIZE
(x16)
EALLOW
PROTECTED
ADCCTL1
0x7100
1
Yes
Control 1 Register
ADCCTL2
0x7101
1
Yes
Control 2 Register
ADCINTFLG
0x7104
1
No
Interrupt Flag Register
ADCINTFLGCLR
0x7105
1
No
Interrupt Flag Clear Register
ADCINTOVF
0x7106
1
No
Interrupt Overflow Register
ADCINTOVFCLR
0x7107
1
No
Interrupt Overflow Clear Register
INTSEL1N2
0x7108
1
Yes
Interrupt 1 and 2 Selection Register
INTSEL3N4
0x7109
1
Yes
Interrupt 3 and 4 Selection Register
INTSEL5N6
0x710A
1
Yes
Interrupt 5 and 6 Selection Register
INTSEL7N8
0x710B
1
Yes
Interrupt 7 and 8 Selection Register
INTSEL9N10
0x710C
1
Yes
Interrupt 9 Selection Register (reserved Interrupt 10 Selection)
SOCPRICTL
0x7110
1
Yes
SOC Priority Control Register
ADCSAMPLEMODE
0x7112
1
Yes
Sampling Mode Register
ADCINTSOCSEL1
0x7114
1
Yes
Interrupt SOC Selection 1 Register (for 8 channels)
ADCINTSOCSEL2
0x7115
1
Yes
Interrupt SOC Selection 2 Register (for 8 channels)
ADCSOCFLG1
0x7118
1
No
SOC Flag 1 Register (for 16 channels)
ADCSOCFRC1
0x711A
1
No
SOC Force 1 Register (for 16 channels)
ADCSOCOVF1
0x711C
1
No
SOC Overflow 1 Register (for 16 channels)
ADCSOCOVFCLR1
0x711E
1
No
SOC Overflow Clear 1 Register (for 16 channels)
0x7120 –
0x712F
1
Yes
SOC0 Control Register to SOC15 Control Register
0x7140
1
Yes
Reference Trim Register
ADCOFFTRIM
0x7141
1
Yes
Offset Trim Register
COMPHYSTCTL
0x714C
1
Yes
Comparator Hysteresis Control Register
ADCREV
0x714F
1
No
Revision Register
REGISTER NAME
ADCSOC0CTL to
ADCSOC15CTL
ADCREFTRIM
DESCRIPTION
Table 6-24. ADC Result Registers (Mapped to PF0)
REGISTER NAME
ADCRESULT0 to ADCRESULT15
ADDRESS
SIZE
(x16)
EALLOW
PROTECTED
0xB00 to 0xB0F
1
No
DESCRIPTION
ADC Result 0 Register to ADC Result 15
Register
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0-Wait
Result
Registers
PF0 (CPU)
PF2 (CPU)
SYSCLKOUT
ADCENCLK
ADCINT 1
PIE
ADCINT 9
AIO
MUX
ADC
Channels
ADC
Core
12-Bit
TINT 0
ADCTRIG 1
TINT 1
ADCTRIG 2
TINT 2
ADCTRIG 3
XINT 2SOC
ADCTRIG 4
ADCTRIG 5
ADCTRIG 6
ADCTRIG 7
ADCTRIG 8
ADCTRIG 9
ADCTRIG 10
ADCTRIG 11
ADCTRIG 12
CPUTIMER 0
CPUTIMER 1
CPUTIMER 2
XINT 2
SOCA 1
SOCB 1
ePWM 1
SOCA 2
SOCB 2
ePWM 2
SOCA 3
SOCB 3
ePWM 3
SOCA 4
SOCB 4
ePWM 4
Figure 6-17. ADC Connections
ADC Connections if the ADC is Not Used
TI recommends keeping the connections for the analog power pins, even if the ADC is not used. Following
is a summary of how the ADC pins should be connected, if the ADC is not used in an application:
• VDDA – Connect to VDDIO
• VSSA – Connect to VSS
• VREFLO – Connect to VSS
• ADCINAn, ADCINBn, VREFHI – Connect to VSSA
When the ADC module is used in an application, unused ADC input pins should be connected to analog
ground (VSSA).
NOTE
Unused ADCIN pins that are multiplexed with AIO function should not be directly connected
to analog ground. They should be grounded through a 1-kΩ resistor. This is to prevent an
errant code from configuring these pins as AIO outputs and driving grounded pins to a logichigh state.
When the ADC is not used, be sure that the clock to the ADC module is not turned on to realize power
savings.
74
Detailed Description
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6.9.1.1.2 ADC Start-of-Conversion Electrical Data/Timing
Table 6-25. External ADC Start-of-Conversion Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(ADCSOCL)
MIN
Pulse duration, ADCSOCxO low
32tc(HCO)
MAX
UNIT
cycles
tw(ADCSOCL)
ADCSOCAO
or
ADCSOCBO
Figure 6-18. ADCSOCAO or ADCSOCBO Timing
Detailed Description
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6.9.1.1.3 On-Chip Analog-to-Digital Converter (ADC) Electrical Data/Timing
Table 6-26. ADC Electrical Characteristics
PARAMETER
MIN
TYP
MAX
UNIT
0.001
60
MHz
DC SPECIFICATIONS
Resolution
12
ADC clock
60-MHz device
Sample Window
28027/26/23/22
Bits
7
64
14
64
ADC
Clocks
INL (Integral nonlinearity) at ADC Clock ≤ 30 MHz (1)
–4
4
LSB
DNL (Differential nonlinearity) at ADC Clock ≤ 30 MHz,
no missing codes
–1
1
LSB
28021/20/200
ACCURACY
Offset error
(2)
Executing Device_Cal
function
–20
0
20
Executing periodic selfrecalibration (3)
–4
0
4
LSB
Overall gain error with internal reference
–60
60
LSB
Overall gain error with external reference
–40
40
LSB
Channel-to-channel offset variation
–4
4
LSB
Channel-to-channel gain variation
–4
4
LSB
ADC temperature coefficient with internal reference
–50
ppm/°C
ADC temperature coefficient with external reference
–20
ppm/°C
VREFLO
–100
µA
VREFHI
100
µA
ANALOG INPUT
Analog input voltage with internal reference
0
3.3
V
Analog input voltage with external reference
VREFLO
VREFHI
V
VSSA
VSSA
V
1.98
VDDA
VREFLO input voltage
(4)
VREFHI input voltage (5)
Input capacitance
Input leakage current
(1)
(2)
(3)
(4)
(5)
76
with VREFLO = VSSA
V
5
pF
±5
μA
INL will degrade when the ADC input voltage goes above VDDA.
1 LSB has the weighted value of full-scale range (FSR)/4096. FSR is 3.3 V with internal reference and VREFHI - VREFLO for external
reference.
Periodic self-recalibration will remove system-level and temperature dependencies on the ADC zero offset error. This can be performed
as needed in the application without sacrificing an ADC channel by using the procedure listed in the "ADC Zero Offset Calibration"
section of the Analog-to-Digital Converter and Comparator chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical Reference
Manual.
VREFLO is always connected to VSSA.
VREFHI must not exceed VDDA when using either internal or external reference modes. Because VREFHI is tied to ADCINA0, the input
signal on ADCINA0 must not exceed VDDA.
Detailed Description
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Table 6-27. ADC Power Modes
ADC OPERATING MODE
IDDA
UNITS
Mode A – Operating Mode
ADC Clock Enabled
Band gap On (ADCBGPWD = 1)
Reference On (ADCREFPWD = 1)
ADC Powered Up (ADCPWDN = 1)
CONDITIONS
13
mA
Mode B – Quick Wake Mode
ADC Clock Enabled
Band gap On (ADCBGPWD = 1)
Reference On (ADCREFPWD = 1)
ADC Powered Up (ADCPWDN = 0)
4
mA
Mode C – Comparator-Only Mode
ADC Clock Enabled
Band gap On (ADCBGPWD = 1)
Reference On (ADCREFPWD = 0)
ADC Powered Up (ADCPWDN = 0)
1.5
mA
Mode D – Off Mode
ADC Clock Enabled
Band gap On (ADCBGPWD = 0)
Reference On (ADCREFPWD = 0)
ADC Powered Up (ADCPWDN = 0)
0.075
mA
6.9.1.1.3.1 Internal Temperature Sensor
Table 6-28. Temperature Sensor Coefficient
PARAMETER (1)
MIN
TSLOPE
Degrees C of temperature movement per measured ADC LSB change
of the temperature sensor
TOFFSET
ADC output at 0°C of the temperature sensor
(1)
(2)
(3)
TYP
MAX
UNIT
(2) (3)
°C/LSB
1750
LSB
0.18
The temperature sensor slope and offset are given in terms of ADC LSBs using the internal reference of the ADC. Values must be
adjusted accordingly in external reference mode to the external reference voltage.
ADC temperature coeffieicient is accounted for in this specification
Output of the temperature sensor (in terms of LSBs) is sign-consistent with the direction of the temperature movement. Increasing
temperatures will give increasing ADC values relative to an initial value; decreasing temperatures will give decreasing ADC values
relative to an initial value.
6.9.1.1.3.2 ADC Power-Up Control Bit Timing
Table 6-29. ADC Power-Up Delays
PARAMETER (1)
td(PWD)
(1)
Delay time for the ADC to be stable after power up
MIN
MAX
UNIT
1
ms
Timings maintain compatibility to the ADC module. The 2802x ADC supports driving all 3 bits at the same time td(PWD) ms before first
conversion.
ADCPWDN/
ADCBGPWD/
ADCREFPWD/
ADCENABLE
td(PWD)
Request for ADC
Conversion
Figure 6-19. ADC Conversion Timing
Detailed Description
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Rs
Source
Signal
ADCIN
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Ron
3.4 kW
Switch
Cp
5 pF
ac
Ch
1.6 pF
28x DSP
Typical Values of the Input Circuit Components:
Switch Resistance (Ron): 3.4 k W
Sampling Capacitor (Ch): 1.6 pF
Parasitic Capacitance (Cp): 5 pF
Source Resistance (Rs): 50 W
Figure 6-20. ADC Input Impedance Model
78
Detailed Description
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6.9.1.1.3.3 ADC Sequential and Simultaneous Timings
Analog Input
SOC0 Sample
Window
0
2
SOC1 Sample
Window
9
15
SOC2 Sample
Window
22
24
37
ADCCLK
ADCCTL 1.INTPULSEPOS
ADCSOCFLG 1.SOC0
ADCSOCFLG 1.SOC1
ADCSOCFLG 1.SOC2
S/H Window Pulse to Core
SOC0
ADCRESULT 0
SOC1
2 ADCCLKs
SOC2
Result 0 Latched
ADCRESULT 1
EOC0 Pulse
EOC1 Pulse
ADCINTFLG .ADCINTx
Minimum
7 ADCCLKs
Conversion 0
13 ADC Clocks
6
ADCCLKs
Minimum
7 ADCCLKs
1 ADCCLK
Conversion 1
13 ADC Clocks
Figure 6-21. Timing Example for Sequential Mode / Late Interrupt Pulse
Detailed Description
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Analog Input
SOC0 Sample
Window
0
2
SOC1 Sample
Window
9
15
SOC2 Sample
Window
22
24
37
ADCCLK
ADCCTL1.INTPULSEPOS
ADCSOCFLG 1.SOC0
ADCSOCFLG 1.SOC1
ADCSOCFLG 1.SOC2
S/H Window Pulse to Core
SOC0
SOC1
SOC2
Result 0 Latched
ADCRESULT 0
ADCRESULT 1
EOC0 Pulse
EOC1 Pulse
EOC2 Pulse
ADCINTFLG .ADCINTx
Minimum
7 ADCCLKs
Conversion 0
13 ADC Clocks
6
ADCCLKs
Minimum
7 ADCCLKs
2 ADCCLKs
Conversion 1
13 ADC Clocks
Figure 6-22. Timing Example for Sequential Mode / Early Interrupt Pulse
80
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Analog Input A
SOC0 Sample
A Window
SOC2 Sample
A Window
SOC0 Sample
B Window
SOC2 Sample
B Window
Analog Input B
0
2
9
22
24
37
50
ADCCLK
ADCCTL1.INTPULSEPOS
ADCSOCFLG 1.SOC0
ADCSOCFLG 1.SOC1
ADCSOCFLG 1.SOC2
S/H Window Pulse to Core
SOC0 (A/B)
ADCRESULT 0
SOC2 (A/B)
2 ADCCLKs
Result 0 (A) Latched
ADCRESULT 1
Result 0 (B) Latched
ADCRESULT 2
EOC0 Pulse
1 ADCCLK
EOC1 Pulse
EOC2 Pulse
ADCINTFLG .ADCINTx
Minimum
7 ADCCLKs
Conversion 0 (A)
13 ADC Clocks
19
ADCCLKs
Conversion 0 (B)
13 ADC Clocks
Minimum
7 ADCCLKs
2 ADCCLKs
Conversion 1 (A)
13 ADC Clocks
Figure 6-23. Timing Example for Simultaneous Mode / Late Interrupt Pulse
Detailed Description
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Analog Input A
SOC0 Sample
A Window
SOC2 Sample
A Window
SOC0 Sample
B Window
SOC2 Sample
B Window
Analog Input B
0
9
2
22 24
37
50
ADCCLK
ADCCTL1.INTPULSEPOS
ADCSOCFLG1.SOC0
ADCSOCFLG1.SOC1
ADCSOCFLG1.SOC2
S/H Window Pulse to Core
SOC0 (A/B)
SOC2 (A/B)
2 ADCCLKs
ADCRESULT 0
Result 0 (A) Latched
Result 0 (B) Latched
ADCRESULT 1
ADCRESULT 2
EOC0 Pulse
EOC1 Pulse
EOC2 Pulse
ADCINTFLG.ADCINTx
Minimum
7 ADCCLKs
Conversion 0 (A)
13 ADC Clocks
19
ADCCLKs
Conversion 0 (B)
13 ADC Clocks
Minimum
7 ADCCLKs
2 ADCCLKs
Conversion 1 (A)
13 ADC Clocks
Figure 6-24. Timing Example for Simultaneous Mode / Early Interrupt Pulse
82
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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6.9.1.2
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
ADC MUX
To COMPy A or B input
To ADC Channel X
Logic implemented in GPIO MUX block
AIOx Pin
SYSCLK
AIOxIN
1
AIOxINE
AIODAT Reg
(Read)
SYNC
0
AIODAT Reg
(Latch)
AIOxDIR
(1 = Input,
0 = Output)
AIOMUX 1 Reg
AIOSET,
AIOCLEAR,
AIOTOGGLE
Regs
AIODIR Reg
(Latch)
1
(0 = Input, 1 = Output)
0
0
Figure 6-25. AIOx Pin Multiplexing
The ADC channel and Comparator functions are always available. The digital I/O function is available only
when the respective bit in the AIOMUX1 register is 0. In this mode, reading the AIODAT register reflects
the actual pin state.
The digital I/O function is disabled when the respective bit in the AIOMUX1 register is 1. In this mode,
reading the AIODAT register reflects the output latch of the AIODAT register and the input digital I/O buffer
is disabled to prevent analog signals from generating noise.
On reset, the digital function is disabled. If the pin is used as an analog input, users should keep the AIO
function disabled for that pin.
Detailed Description
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6.9.1.3
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Comparator Block
Figure 6-26 shows the interaction of the Comparator modules with the rest of the system.
COMP x A
COMP x B
+
COMP
-
GPIO
MUX
TZ1/2/3
COMP x
+
DAC x
Wrapper
AIO
MUX
ePWM
COMPxOUT
DAC
Core
10-Bit
Figure 6-26. Comparator Block Diagram
Table 6-30. Comparator Control Registers
COMP1
ADDRESS
COMP2
ADDRESS (1)
SIZE
(x16)
EALLOW
PROTECTED
COMPCTL
0x6400
0x6420
1
Yes
Comparator Control Register
COMPSTS
0x6402
0x6422
1
No
Comparator Status Register
DACCTL
0x6404
0x6424
1
Yes
DAC Control Register
DACVAL
0x6406
0x6426
1
No
DAC Value Register
0x6408
0x6428
1
No
Ramp Generator Maximum
Reference (Active) Register
0x640A
0x642A
1
No
Ramp Generator Maximum
Reference (Shadow) Register
0x640C
0x642C
1
No
Ramp Generator Decrement Value
(Active) Register
0x640E
0x642E
1
No
Ramp Generator Decrement Value
(Shadow) Register
0x6410
0x6430
1
No
Ramp Generator Status Register
REGISTER NAME
RAMPMAXREF_ACTIVE
RAMPMAXREF_SHDW
RAMPDECVAL_ACTIVE
RAMPDECVAL_SHDW
RAMPSTS
(1)
84
DESCRIPTION
Comparator 2 is available only on the 48-pin PT package.
Detailed Description
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TMS320F28021, TMS320F28020, TMS320F280200
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
6.9.1.3.1 On-Chip Comparator/DAC Electrical Data/Timing
Table 6-31. Electrical Characteristics of the Comparator/DAC
PARAMETER
MIN
TYP
MAX
UNITS
Comparator
Comparator Input Range
VSSA – VDDA
V
Comparator response time to PWM Trip Zone (Async)
30
ns
Input Offset
±5
mV
Input Hysteresis (1)
35
mV
DAC
DAC Output Range
VSSA – VDDA
DAC resolution
10
DAC settling time
bits
See Figure 6-27
DAC Gain
–1.5%
DAC Offset
10
Monotonic
mV
Yes
INL
(1)
V
±3
LSB
Hysteresis on the comparator inputs is achieved with a Schmidt trigger configuration. This results in an effective 100-kΩ feedback
resistance between the output of the comparator and the noninverting input of the comparator. There is an option to disable the
hysteresis and, with it, the feedback resistance; see the Analog-to-Digital Converter and Comparator chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual for more information on this option if needed in your system.
1100
1000
900
800
Settling Time (ns)
700
600
500
400
300
200
100
0
0
50
100
150
200
250
300
350
400
450
500
DAC Step Size (Codes)
DAC Accuracy
15 Codes
7 Codes
3 Codes
1 Code
Figure 6-27. DAC Settling Time
Detailed Description
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6.9.2
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Detailed Descriptions
Integral Nonlinearity
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero to full
scale. The point used as zero occurs one-half LSB before the first code transition. The full-scale point is
defined as level one-half LSB beyond the last code transition. The deviation is measured from the center
of each particular code to the true straight line between these two points.
Differential Nonlinearity
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal
value. A differential nonlinearity error of less than ±1 LSB ensures no missing codes.
Zero Offset
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the
deviation of the actual transition from that point.
Gain Error
The first code transition should occur at an analog value one-half LSB above negative full scale. The last
transition should occur at an analog value one and one-half LSB below the nominal full scale. Gain error is
the deviation of the actual difference between first and last code transitions and the ideal difference
between first and last code transitions.
Signal-to-Noise Ratio + Distortion (SINAD)
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral
components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is
expressed in decibels.
Effective Number of Bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
(SINAD - 1.76)
N=
6.02
it is possible to get a measure of performance expressed as N, the effective number of
bits. Thus, effective number of bits for a device for sine wave inputs at a given input frequency can be
calculated directly from its measured SINAD.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first nine harmonic components to the rms value of the measured
input signal and is expressed as a percentage or in decibels.
Spurious Free Dynamic Range (SFDR)
SFDR is the difference in dB between the rms amplitude of the input signal and the peak spurious signal.
86
Detailed Description
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6.9.3
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Serial Peripheral Interface (SPI) Module
The device includes the four-pin serial peripheral interface (SPI) module. One SPI module (SPI-A) is
available. The SPI is a high-speed, synchronous serial I/O port that allows a serial bit stream of
programmed length (1 to 16 bits) to be shifted into and out of the device at a programmable bit-transfer
rate. Normally, the SPI is used for communications between the MCU and external peripherals or another
processor. Typical applications include external I/O or peripheral expansion through devices such as shift
registers, display drivers, and ADCs. Multidevice communications are supported by the master/slave
operation of the SPI.
The SPI module features include:
• Four external pins:
– SPISOMI: SPI slave-output/master-input pin
– SPISIMO: SPI slave-input/master-output pin
– SPISTE: SPI slave transmit-enable pin
– SPICLK: SPI serial-clock pin
NOTE
All four pins can be used as GPIO if the SPI module is not used.
•
•
•
•
•
•
Two operational modes: master and slave
Baud rate: 125 different programmable rates.
Baud rate =
LSPCLK
(SPIBRR + 1)
when SPIBRR = 3 to 127
Baud rate =
LSPCLK
4
when SPIBRR = 0, 1, 2
Data word length: 1 to 16 data bits
Four clocking schemes (controlled by clock polarity and clock phase bits) include:
– Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the
falling edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the
rising edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
Simultaneous receive and transmit operation (transmit function can be disabled in software)
Transmitter and receiver operations are accomplished through either interrupt-driven or polled
algorithms.
Nine SPI module control registers: In control register frame beginning at address 7040h.
NOTE
All registers in this module are 16-bit registers that are connected to Peripheral Frame 2.
When a register is accessed, the register data is in the lower byte (7–0), and the upper byte
(15–8) is read as zeros. Writing to the upper byte has no effect.
Detailed Description
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Enhanced feature:
• 4-level transmit/receive FIFO
• Delayed transmit control
• Bidirectional 3 wire SPI mode support
The SPI port operation is configured and controlled by the registers listed in Table 6-32.
Table 6-32. SPI-A Registers
NAME
DESCRIPTION (1)
ADDRESS
SIZE (x16)
EALLOW PROTECTED
SPICCR
0x7040
1
No
SPI-A Configuration Control Register
SPICTL
0x7041
1
No
SPI-A Operation Control Register
SPISTS
0x7042
1
No
SPI-A Status Register
SPIBRR
0x7044
1
No
SPI-A Baud Rate Register
SPIRXEMU
0x7046
1
No
SPI-A Receive Emulation Buffer Register
SPIRXBUF
0x7047
1
No
SPI-A Serial Input Buffer Register
SPITXBUF
0x7048
1
No
SPI-A Serial Output Buffer Register
SPIDAT
0x7049
1
No
SPI-A Serial Data Register
SPIFFTX
0x704A
1
No
SPI-A FIFO Transmit Register
SPIFFRX
0x704B
1
No
SPI-A FIFO Receive Register
SPIFFCT
0x704C
1
No
SPI-A FIFO Control Register
SPIPRI
0x704F
1
No
SPI-A Priority Control Register
(1)
Registers in this table are mapped to Peripheral Frame 2. This space only allows 16-bit accesses. 32-bit accesses produce undefined
results.
For more information on the SPI, see the Serial Peripheral Interface (SPI) chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
88
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Figure 6-28 is a block diagram of the SPI in slave mode.
SPIFFENA
SPIFFTX.14
Receiver
Overrun Flag
RX FIFO Registers
SPISTS.7
Overrun
INT ENA
SPICTL.4
SPIRXBUF
RX FIFO _0
RX FIFO _1
-----
SPIINT
RX FIFO Interrupt
RX FIFO _3
RX Interrupt
Logic
16
SPIRXBUF
Buffer Register
SPIFFOVF
FLAG
SPIFFRX.15
To CPU
TX FIFO Registers
SPITXBUF
TX FIFO _3
SPITX
16
16
TX Interrupt
Logic
TX FIFO Interrupt
----TX FIFO _1
TX FIFO _0
SPI INT
ENA
SPI INT FLAG
SPITXBUF
Buffer Register
SPISTS.6
SPICTL.0
TRIWIRE
SPIPRI.0
16
M
M
SPIDAT
Data Register
TW
S
S
SPIDAT.15 - 0
SW1
SPISIMO
M TW
M
TW
S
S
SPISOMI
SW2
Talk
SPICTL.1
SPISTE
State Control
Master/Slave
SPICCR.3 - 0
SPI Char
3
2
M
SPI Bit Rate
SW3
S
SPIBRR.6 - 0
LSPCLK
6
A.
SPICTL.2
S
0
1
5
4
3
2
1
0
Clock
Polarity
Clock
Phase
SPICCR.6
SPICTL.3
SPICLK
M
SPISTE is driven low by the master for a slave device.
Figure 6-28. SPI Module Block Diagram (Slave Mode)
Detailed Description
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6.9.3.1
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SPI Master Mode Electrical Data/Timing
Table 6-33 lists the master mode timing (clock phase = 0) and Table 6-34 lists the master mode timing
(clock phase = 1). Figure 6-29 and Figure 6-30 show the timing waveforms.
Table 6-33. SPI Master Mode External Timing (Clock Phase = 0) (1) (2) (3) (4) (5)
NO.
1
(1)
(2)
(3)
(4)
(5)
BRR EVEN
PARAMETER
BRR ODD
MIN
MAX
4tc(LSPCLK)
UNIT
MIN
MAX
128tc(LSPCLK)
5tc(LSPCLK)
127tc(LSPCLK)
ns
0.5tc(SPC)M +
0.5tc(LSPCLK) + 10
ns
0.5tc(SPC)M –
0.5tc(LSPCLK) + 10
ns
10
ns
tc(SPC)M
Cycle time, SPICLK
2
tw(SPC1)M
Pulse duration, SPICLK first
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M +
0.5tc(LSPCLK) – 10
3
tw(SPC2)M
Pulse duration, SPICLK second
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
4
td(SIMO)M
Delay time, SPICLK to
SPISIMO valid
5
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
8
tsu(SOMI)M
Setup time, SPISOMI before
SPICLK
9
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
23
td(SPC)M
Delay time, SPISTE active to
SPICLK
24
td(STE)M
Delay time, SPICLK to SPISTE
inactive
10
0.5tc(SPC)M – 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
ns
26
26
ns
0
0
ns
tc(SPC)M – 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
ns
0.5tc(SPC)M – 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
ns
The MASTER / SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR +1)
tc(LCO) = LSPCLK cycle time
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MAX, slave mode receive 12.5-MHz MAX.
The active edge of the SPICLK signal referenced is controlled by the clock polarity bit (SPICCR.6).
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISIMO
Master Out Data Is Valid
8
9
Master In Data
Must Be Valid
SPISOMI
23
24
SPISTE
Figure 6-29. SPI Master Mode External Timing (Clock Phase = 0)
90
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-34. SPI Master Mode External Timing (Clock Phase = 1) (1) (2) (3) (4) (5)
NO.
1
(1)
(2)
(3)
(4)
(5)
BRR EVEN
PARAMETER
BRR ODD
MIN
MAX
4tc(LSPCLK)
UNIT
MIN
MAX
128tc(LSPCLK)
5tc(LSPCLK)
127tc(LSPCLK)
ns
0.5tc(SPC)M –
0.5tc(LSPCLK) + 10
ns
0.5tc(SPC)M +
0.5tc(LSPCLK) + 10
ns
tc(SPC)M
Cycle time, SPICLK
2
tw(SPC1)M
Pulse duration, SPICLK first
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
3
tw(SPC2)M
Pulse duration, SPICLK second
pulse
0.5tc(SPC)M – 10
0.5tc(SPC)M + 10
0.5tc(SPC)M +
0.5tc(LSPCLK) – 10
6
td(SIMO)M
Delay time, SPISIMO valid to
SPICLK
0.5tc(SPC)M – 10
0.5tc(SPC)M +
0.5tc(LSPCLK) – 10
ns
7
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
0.5tc(SPC)M – 10
0.5tc(SPC)M –
0.5tc(LSPCLK) – 10
ns
10
tsu(SOMI)M
Setup time, SPISOMI before
SPICLK
26
26
ns
11
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
0
0
ns
23
td(SPC)M
Delay time, SPISTE active to
SPICLK
tc(SPC) – 10
tc(SPC) – 10
ns
24
td(STE)M
Delay time, SPICLK to SPISTE
inactive
0.5tc(SPC) – 10
0.5tc(SPC) –
0.5tc(LSPCLK) – 10
ns
The MASTER/SLAVE bit (SPICTL.2) is set and the CLOCK PHASE bit (SPICTL.3) is set.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25 MHz MAX, master mode receive 12.5 MHz MAX
Slave mode transmit 12.5 MHz MAX, slave mode receive 12.5 MHz MAX.
tc(LCO) = LSPCLK cycle time
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
6
7
Master Out Data Is Valid
SPISIMO
10
11
Master In Data Must
Be Valid
SPISOMI
23
24
SPISTE
Figure 6-30. SPI Master Mode External Timing (Clock Phase = 1)
Detailed Description
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6.9.3.2
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SPI Slave Mode Electrical Data/Timing
Table 6-35 lists the slave mode timing (clock phase = 0) and Table 6-36 lists the slave mode timing (clock
phase = 1). Figure 6-31 and Figure 6-32 show the timing waveforms.
Table 6-35. SPI Slave Mode External Timing (Clock Phase = 0) (1) (2) (3) (4) (5)
NO.
PARAMETER
MIN
12
tc(SPC)S
Cycle time, SPICLK
13
tw(SPC1)S
14
tw(SPC2)S
15
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
16
tv(SOMI)S
Valid time, SPISOMI data valid after SPICLK
19
tsu(SIMO)S
20
th(SIMO)S
25
26
(1)
(2)
(3)
(4)
(5)
MAX
UNIT
4tc(SYSCLK)
ns
Pulse duration, SPICLK first pulse
2tc(SYSCLK) – 1
ns
Pulse duration, SPICLK second pulse
2tc(SYSCLK) – 1
ns
21
ns
0
ns
Setup time, SPISIMO valid before SPICLK
1.5tc(SYSCLK)
ns
Hold time, SPISIMO data valid after SPICLK
1.5tc(SYSCLK)
ns
tsu(STE)S
Setup time, SPISTE active before SPICLK
1.5tc(SYSCLK)
ns
th(STE)S
Hold time, SPISTE inactive after SPICLK
1.5tc(SYSCLK)
ns
The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.
tc(LCO) = LSPCLK cycle time
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
15
SPISOMI
16
SPISOMI Data Is Valid
19
20
SPISIMO Data
Must Be Valid
SPISIMO
25
26
SPISTE
Figure 6-31. SPI Slave Mode External Timing (Clock Phase = 0)
92
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-36. SPI Slave Mode External Timing (Clock Phase = 1) (1) (2) (3) (4)
NO.
PARAMETER
MIN
12
tc(SPC)S
Cycle time, SPICLK
13
tw(SPC1)S
14
tw(SPC2)S
17
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
18
tv(SOMI)S
Valid time, SPISOMI data valid after SPICLK
21
tsu(SIMO)S
22
th(SIMO)S
25
26
(1)
(2)
(3)
(4)
MAX
UNIT
4tc(SYSCLK)
ns
Pulse duration, SPICLK first pulse
2tc(SYSCLK) – 1
ns
Pulse duration, SPICLK second pulse
2tc(SYSCLK) – 1
ns
21
ns
0
ns
Setup time, SPISIMO valid before SPICLK
1.5tc(SYSCLK)
ns
Hold time, SPISIMO data valid after SPICLK
1.5tc(SYSCLK)
ns
tsu(STE)S
Setup time, SPISTE active before SPICLK
1.5tc(SYSCLK)
ns
th(STE)S
Hold time, SPISTE inactive after SPICLK
1.5tc(SYSCLK)
ns
The MASTER / SLAVE bit (SPICTL.2) is cleared and the CLOCK PHASE bit (SPICTL.3) is cleared.
tc(SPC) = SPI clock cycle time = LSPCLK/4 or LSPCLK/(SPIBRR + 1)
Internal clock prescalers must be adjusted such that the SPI clock speed is limited to the following SPI clock rate:
Master mode transmit 25-MHz MAX, master mode receive 12.5-MHz MAX
Slave mode transmit 12.5-MHz MAX, slave mode receive 12.5-MHz MAX.
The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPICCR.6).
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
17
SPISOMI
Data Valid
SPISOMI Data Is Valid
Data Valid
18
21
22
SPISIMO Data
Must Be Valid
SPISIMO
25
26
SPISTE
Figure 6-32. SPI Slave Mode External Timing (Clock Phase = 1)
Detailed Description
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6.9.4
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Serial Communications Interface (SCI) Module
The devices include one serial communications interface (SCI) module (SCI-A). The SCI module supports
digital communications between the CPU and other asynchronous peripherals that use the standard
nonreturn-to-zero (NRZ) format. The SCI receiver and transmitter are double-buffered, and each has its
own separate enable and interrupt bits. Both can be operated independently or simultaneously in the fullduplex mode. To ensure data integrity, the SCI checks received data for break detection, parity, overrun,
and framing errors. The bit rate is programmable to over 65000 different speeds through a 16-bit baudselect register.
Features of each SCI module include:
• Two external pins:
– SCITXD: SCI transmit-output pin
– SCIRXD: SCI receive-input pin
NOTE
Both pins can be used as GPIO if not used for SCI.
– Baud rate programmable to 64K different rates:
•
•
•
•
•
•
•
•
Baud rate =
LSPCLK
(BRR + 1) * 8
when BRR ¹ 0
Baud rate =
LSPCLK
16
when BRR = 0
Data-word format
– One start bit
– Data-word length programmable from 1 to 8 bits
– Optional even/odd/no parity bit
– One or 2 stop bits
Four error-detection flags: parity, overrun, framing, and break detection
Two wake-up multiprocessor modes: idle-line and address bit
Half- or full-duplex operation
Double-buffered receive and transmit functions
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms
with status flags.
– Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX
EMPTY flag (transmitter-shift register is empty)
– Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag
(break condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
Separate enable bits for transmitter and receiver interrupts (except BRKDT)
NRZ (nonreturn-to-zero) format
NOTE
All registers in this module are 8-bit registers that are connected to Peripheral Frame 2.
When a register is accessed, the register data is in the lower byte (7–0), and the upper byte
(15–8) is read as zeros. Writing to the upper byte has no effect.
Enhanced features:
• Auto baud-detect hardware logic
• 4-level transmit/receive FIFO
94
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
The SCI port operation is configured and controlled by the registers listed in Table 6-37.
Table 6-37. SCI-A Registers (1)
ADDRESS
SIZE (x16)
EALLOW
PROTECTED
SCICCRA
0x7050
1
No
SCI-A Communications Control Register
SCICTL1A
0x7051
1
No
SCI-A Control Register 1
SCIHBAUDA
0x7052
1
No
SCI-A Baud Register, High Bits
SCILBAUDA
0x7053
1
No
SCI-A Baud Register, Low Bits
SCICTL2A
0x7054
1
No
SCI-A Control Register 2
SCIRXSTA
0x7055
1
No
SCI-A Receive Status Register
SCIRXEMUA
0x7056
1
No
SCI-A Receive Emulation Data Buffer Register
SCIRXBUFA
0x7057
1
No
SCI-A Receive Data Buffer Register
SCITXBUFA
0x7059
1
No
SCI-A Transmit Data Buffer Register
(2)
0x705A
1
No
SCI-A FIFO Transmit Register
SCIFFRXA (2)
0x705B
1
No
SCI-A FIFO Receive Register
SCIFFCTA (2)
0x705C
1
No
SCI-A FIFO Control Register
SCIPRIA
0x705F
1
No
SCI-A Priority Control Register
NAME
SCIFFTXA
(1)
(2)
DESCRIPTION
Registers in this table are mapped to Peripheral Frame 2 space. This space only allows 16-bit accesses. 32-bit accesses produce
undefined results.
These registers are new registers for the FIFO mode.
Detailed Description
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For more information on the SCI, see the Serial Communications Interface (SCI) chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
Figure 6-33 shows the SCI module block diagram.
SCICTL1.1
SCITXD
Frame Format and Mode
Parity
Even/Odd Enable
TXSHF
Register
TXENA
8
SCICCR.6 SCICCR.5
TX EMPTY
SCICTL2.6
TXRDY
TXWAKE
SCICTL1.3
1
Transmitter-Data
Buffer Register
8
TX INT ENA
SCICTL2.7
SCICTL2.0
TX FIFO
Interrupts
TX FIFO _0
TX FIFO _1
TXINT
TX Interrupt
Logic
To CPU
-----
TX FIFO _3
WUT
SCITXD
SCI TX Interrupt select logic
SCITXBUF.7-0
TX FIFO registers
SCIFFENA
AutoBaud Detect logic
SCIFFTX.14
SCIHBAUD. 15 - 8
Baud Rate
MSbyte
Register
SCIRXD
RXSHF
Register
SCIRXD
RXWAKE
LSPCLK
SCIRXST.1
SCILBAUD. 7 - 0
Baud Rate
LSbyte
Register
RXENA
8
SCICTL1.0
SCICTL2.1
Receive Data
Buffer register
SCIRXBUF.7-0
RXRDY
SCIRXST.6
8
BRKDT
RX FIFO _3
-----
RX FIFO_1
RX FIFO _0
SCIRXBUF.7-0
RX/BK INT ENA
RX FIFO
Interrupts
SCIRXST.5
RX Interrupt
Logic
RX FIFO registers
SCIRXST.7
SCIRXST.4 - 2
RX Error
FE OE PE
RXINT
To CPU
RXFFOVF
SCIFFRX.15
RX Error
RX ERR INT ENA
SCICTL1.6
SCI RX Interrupt select logic
Figure 6-33. Serial Communications Interface (SCI) Module Block Diagram
96
Detailed Description
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6.9.5
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Inter-Integrated Circuit (I2C)
The device contains one I2C Serial Port. Figure 6-34 shows how the I2C peripheral module interfaces
within the device.
The I2C module has the following features:
• Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):
– Support for 1-bit to 8-bit format transfers
– 7-bit and 10-bit addressing modes
– General call
– START byte mode
– Support for multiple master-transmitters and slave-receivers
– Support for multiple slave-transmitters and master-receivers
– Combined master transmit/receive and receive/transmit mode
– Data transfer rate of from 10 kbps up to 400 kbps (I2C Fast-mode rate)
• One 4-word receive FIFO and one 4-word transmit FIFO
• One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the
following conditions:
– Transmit-data ready
– Receive-data ready
– Register-access ready
– No-acknowledgment received
– Arbitration lost
– Stop condition detected
– Addressed as slave
• An additional interrupt that can be used by the CPU when in FIFO mode
• Module enable/disable capability
• Free data format mode
For more information on the I2C, see the Inter-Integrated Circuit Module (I2C) chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
Detailed Description
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I2C Module
I2CXSR
I2CDXR
TX FIFO
FIFO Interrupt to
CPU/PIE
SDA
RX FIFO
Peripheral Bus
I2CRSR
SCL
I2CDRR
Clock
Synchronizer
Control/Status
Registers
CPU
Prescaler
Noise Filters
Interrupt to
CPU/PIE
I2C INT
Arbitrator
A.
B.
The I2C registers are accessed at the SYSCLKOUT rate. The internal timing and signal waveforms of the I2C port are
also at the SYSCLKOUT rate.
The clock enable bit (I2CAENCLK) in the PCLKCRO register turns off the clock to the I2C port for low-power
operation. Upon reset, I2CAENCLK is clear, which indicates the peripheral internal clocks are off.
Figure 6-34. I2C Peripheral Module Interfaces
The registers in Table 6-38 configure and control the I2C port operation.
Table 6-38. I2C-A Registers
ADDRESS
EALLOW
PROTECTED
I2COAR
0x7900
No
I2C own address register
I2CIER
0x7901
No
I2C interrupt enable register
I2CSTR
0x7902
No
I2C status register
I2CCLKL
0x7903
No
I2C clock low-time divider register
I2CCLKH
0x7904
No
I2C clock high-time divider register
I2CCNT
0x7905
No
I2C data count register
I2CDRR
0x7906
No
I2C data receive register
I2CSAR
0x7907
No
I2C slave address register
I2CDXR
0x7908
No
I2C data transmit register
I2CMDR
0x7909
No
I2C mode register
I2CISRC
0x790A
No
I2C interrupt source register
I2CPSC
0x790C
No
I2C prescaler register
I2CFFTX
0x7920
No
I2C FIFO transmit register
I2CFFRX
0x7921
No
I2C FIFO receive register
I2CRSR
–
No
I2C receive shift register (not accessible to the CPU)
I2CXSR
–
No
I2C transmit shift register (not accessible to the CPU)
NAME
98
Detailed Description
DESCRIPTION
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6.9.5.1
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
I2C Electrical Data/Timing
Table 6-39 shows the I2C timing requirements. Table 6-40 shows the I2C switching characteristics.
Table 6-39. I2C Timing Requirements
MIN
MAX
UNIT
th(SDA-SCL)START
Hold time, START condition, SCL fall delay
after SDA fall
0.6
µs
tsu(SCL-SDA)START
Setup time, Repeated START, SCL rise before
SDA fall delay
0.6
µs
th(SCL-DAT)
Hold time, data after SCL fall
0
µs
tsu(DAT-SCL)
Setup time, data before SCL rise
tr(SDA)
Rise time, SDA
Input tolerance
20
300
ns
tr(SCL)
Rise time, SCL
Input tolerance
20
300
ns
tf(SDA)
Fall time, SDA
Input tolerance
11.4
300
ns
tf(SCL)
Fall time, SCL
Input tolerance
11.4
300
ns
tsu(SCL-SDA)STOP
Setup time, STOP condition, SCL rise before
SDA rise delay
100
ns
0.6
µs
Table 6-40. I2C Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
I2C clock module frequency is from 7 MHz to
12 MHz and I2C prescaler and clock divider
registers are configured appropriately.
MAX
UNIT
400
kHz
fSCL
SCL clock frequency
Vil
Low level input voltage
Vih
High level input voltage
Vhys
Input hysteresis
Vol
Low level output voltage
3-mA sink current
tLOW
Low period of SCL clock
I2C clock module frequency is from 7 MHz to
12 MHz and I2C prescaler and clock divider
registers are configured appropriately.
1.3
μs
tHIGH
High period of SCL clock
I2C clock module frequency is from 7 MHz to
12 MHz and I2C prescaler and clock divider
registers are configured appropriately.
0.6
μs
lI
Input current with an input voltage from
0.1 VDDIO to 0.9 VDDIO MAX
0.3 VDDIO
V
0.05 VDDIO
V
0
–10
0.4
10
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V
0.7 VDDIO
V
μA
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6.9.6
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Enhanced PWM Modules (ePWM1/2/3/4)
The devices contain up to four enhanced PWM Modules (ePWM). Figure 6-35 shows a block diagram of
multiple ePWM modules. Figure 6-36 shows the signal interconnections with the ePWM. For more details,
see the Enhanced Pulse Width Modulator (ePWM) chapter in the TMS320F2802x,TMS320F2802xx
Piccolo Technical Reference Manual.
Table 6-41 shows the complete ePWM register set per module.
100
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
EPWMSYNCI
EPWM1SYNCI
EPWM1B
EPWM1TZINT
ePWM1
Module
EPWM1INT
TZ1 to TZ3
EPWM2TZINT
PIE
EPWM2INT
TZ5
EPWMxTZINT
TZ6
EPWMxINT
CLOCKFAIL
EMUSTOP
EPWM1ENCLK
TBCLKSYNC
eCAPI
EPWM1SYNCO
EPWM1SYNCO
EPWM2SYNCI
COMPOUT1
COMPOUT2
TZ1 to TZ3
EPWM2B
ePWM2
Module
COMP
TZ5
TZ6
CLOCKFAIL
EMUSTOP
EPWM2ENCLK
TBCLKSYNC
EPWM1A
H
R
P
W
M
EPWM2A
EPWMxA
G
P
I
O
ADC
Peripheral Bus
EPWM2SYNCO
SOCA1
SOCB1
SOCA2
M
U
X
EPWMxB
EPWMxSYNCI
SOCB2
SOCAx
TZ1 to TZ3
ePWMx
Module
SOCBx
TZ5
TZ6
CLOCKFAIL
EMUSTOP
EPWMxENCLK
TBCLKSYNC
System Control
C28x CPU
SOCA1
SOCA2
SPCAx
ADCSOCAO
Pulse Stretch
(32 SYSCLKOUT Cycles, Active-Low Output)
SOCB1
SOCB2
SPCBx
ADCSOCBO
Pulse Stretch
(32 SYSCLKOUT Cycles, Active-Low Output)
Copyright © 2017, Texas Instruments Incorporated
Figure 6-35. ePWM
Detailed Description
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Table 6-41. ePWM Control and Status Registers
ePWM1
ePWM2
ePWM3
ePWM4
SIZE (x16) /
#SHADOW
TBCTL
0x6800
0x6840
0x6880
0x68C0
1/0
Time Base Control Register
TBSTS
0x6801
0x6841
0x6881
0x68C1
1/0
Time Base Status Register
TBPHSHR
0x6802
0x6842
0x6882
0x68C2
1/0
Time Base Phase HRPWM Register
TBPHS
0x6803
0x6843
0x6883
0x68C3
1/0
Time Base Phase Register
TBCTR
0x6804
0x6844
0x6884
0x68C4
1/0
Time Base Counter Register
TBPRD
0x6805
0x6845
0x6885
0x68C5
1/1
Time Base Period Register Set
TBPRDHR
0x6806
0x6846
0x6886
0x68C6
1/1
Time Base Period High Resolution Register (1)
CMPCTL
0x6807
0x6847
0x6887
0x68C7
1/0
Counter Compare Control Register
CMPAHR
0x6808
0x6848
0x6888
0x68C8
1/1
Time Base Compare A HRPWM Register
CMPA
0x6809
0x6849
0x6889
0x68C9
1/1
Counter Compare A Register Set
CMPB
0x680A
0x684A
0x688A
0x68CA
1/1
Counter Compare B Register Set
NAME
DESCRIPTION
AQCTLA
0x680B
0x684B
0x688B
0x68CB
1/0
Action Qualifier Control Register For Output A
AQCTLB
0x680C
0x684C
0x688C
0x68CC
1/0
Action Qualifier Control Register For Output B
AQSFRC
0x680D
0x684D
0x688D
0x68CD
1/0
Action Qualifier Software Force Register
AQCSFRC
0x680E
0x684E
0x688E
0x68CE
1/1
Action Qualifier Continuous S/W Force Register Set
DBCTL
0x680F
0x684F
0x688F
0x68CF
1/1
Dead-Band Generator Control Register
DBRED
0x6810
0x6850
0x6890
0x68D0
1/0
Dead-Band Generator Rising Edge Delay Count Register
DBFED
0x6811
0x6851
0x6891
0x68D1
1/0
Dead-Band Generator Falling Edge Delay Count Register
TZSEL
0x6812
0x6852
0x6892
0x68D2
1/0
Trip Zone Select Register (1)
TZDCSEL
0x6813
0x6853
0x6893
0x98D3
1/0
Trip Zone Digital Compare Register
TZCTL
0x6814
0x6854
0x6894
0x68D4
1/0
Trip Zone Control Register (1)
TZEINT
0x6815
0x6855
0x6895
0x68D5
1/0
Trip Zone Enable Interrupt Register (1)
TZFLG
0x6816
0x6856
0x6896
0x68D6
1/0
Trip Zone Flag Register
TZCLR
0x6817
0x6857
0x6897
0x68D7
1/0
Trip Zone Clear Register (1)
TZFRC
0x6818
0x6858
0x6898
0x68D8
1/0
Trip Zone Force Register (1)
(1)
ETSEL
0x6819
0x6859
0x6899
0x68D9
1/0
Event Trigger Selection Register
ETPS
0x681A
0x685A
0x689A
0x68DA
1/0
Event Trigger Prescale Register
ETFLG
0x681B
0x685B
0x689B
0x68DB
1/0
Event Trigger Flag Register
ETCLR
0x681C
0x685C
0x689C
0x68DC
1/0
Event Trigger Clear Register
ETFRC
0x681D
0x685D
0x689D
0x68DD
1/0
Event Trigger Force Register
PCCTL
0x681E
0x685E
0x689E
0x68DE
1/0
PWM Chopper Control Register
HRCNFG
0x6820
0x6860
0x68A0
0x68E0
1/0
HRPWM Configuration Register (1)
(1)
102
Registers that are EALLOW protected.
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-41. ePWM Control and Status Registers (continued)
ePWM1
ePWM2
ePWM3
ePWM4
SIZE (x16) /
#SHADOW
HRPWR
0x6821
-
-
-
1/0
HRPWM Power Register
HRMSTEP
0x6826
-
-
-
1/0
HRPWM MEP Step Register
HRPCTL
0x6828
0x6868
0x68A8
0x68E8
1/0
High resolution Period Control Register (1)
NAME
(2)
DESCRIPTION
TBPRDHRM
0x682A
0x686A
0x68AA
0x68EA
1/W
TBPRDM
0x682B
0x686B
0x68AB
0x68EB
1 / W (2)
Time Base Period Register Mirror
CMPAHRM
0x682C
0x686C
0x68AC
0x68EC
1 / W (2)
Compare A HRPWM Register Mirror
(2)
CMPAM
0x682D
0x686D
0x68AD
0x68ED
DCTRIPSEL
0x6830
0x6870
0x68B0
0x68F0
1/0
Digital Compare Trip Select Register
DCACTL
0x6831
0x6871
0x68B1
0x68F1
1/0
Digital Compare A Control Register (1)
DCBCTL
0x6832
0x6872
0x68B2
0x68F2
1/0
Digital Compare B Control Register (1)
DCFCTL
0x6833
0x6873
0x68B3
0x68F3
1/0
Digital Compare Filter Control Register (1)
DCCAPCT
0x6834
0x6874
0x68B4
0x68F4
1/0
Digital Compare Capture Control Register (1)
DCFOFFSET
0x6835
0x6875
0x68B5
0x68F5
1/1
Digital Compare Filter Offset Register
DCFOFFSETCNT
0x6836
0x6876
0x68B6
0x68F6
1/0
Digital Compare Filter Offset Counter Register
DCFWINDOW
0x6837
0x6877
0x68B7
0x68F7
1/0
Digital Compare Filter Window Register
DCFWINDOWCNT
0x6838
0x6878
0x68B8
0x68F8
1/0
Digital Compare Filter Window Counter Register
DCCAP
0x6839
0x6879
0x68B9
0x68F9
1/1
Digital Compare Counter Capture Register
(2)
1/W
Time Base Period HRPWM Register Mirror
Compare A Register Mirror
(1)
W = Write to shadow register
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Time-Base (TB)
CTR=ZERO
TBPRD Shadow (24)
TBPRD Active (24)
Sync
In/Out
Select
Mux
CTR=CMPB
TBPRDHR (8)
Disabled
EPWMxSYNCO
8
CTR=PRD
TBCTL[SYNCOSEL]
TBCTL[PHSEN]
Counter
Up/Down
(16 Bit)
TBCTL[SWFSYNC]
(Software Forced
Sync)
CTR=ZERO
TCBNT
Active (16)
CTR_Dir
CTR=PRD
CTR=ZERO
CTR=PRD or ZERO
CTR=CMPA
TBPHSHR (8)
16
8
TBPHS Active (24)
Phase
Control
CTR=CMPB
CTR_Dir
DCAEVT1.soc
DCBEVT1.soc
CTR=CMPA
EPWMxSYNCI
DCAEVT1.sync
DCBEVT1.sync
(A)
EPWMxINT
Event
Trigger
and
Interrupt
(ET)
EPWMxSOCA
EPWMxSOCB
EPWMxSOCA
(A)
ADC
EPWMxSOCB
Action
Qualifier
(AQ)
CMPAHR (8)
16
High-resolution PWM (HRPWM)
CMPA Active (24)
CMPA Shadow (24)
EPWMxA
EPWMA
Dead
Band
(DB)
CTR=CMPB
PWM
Chopper
(PC)
Trip
Zone
(TZ)
16
CMPB Active (16)
EPWMxB
EPWMB
EPWMxTZINT
CMPB Shadow (16)
TZ1 to TZ3
CTR=ZERO
DCAEVT1.inter
DCBEVT1.inter
DCAEVT2.inter
DCBEVT2.inter
EMUSTOP
CLOCKFAIL
DCAEVT1.force
DCAEVT2.force
DCBEVT1.force
DCBEVT2.force
A.
(A)
(A)
(A)
(A)
These events are generated by the Type 1 ePWM digital compare (DC) submodule based on the levels of
the COMPxOUT and TZ signals.
Figure 6-36. ePWM Submodules Showing Critical Internal Signal Interconnections
104
Detailed Description
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6.9.6.1
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
ePWM Electrical Data/Timing
PWM refers to PWM outputs on ePWM1–4. Table 6-42 shows the PWM timing requirements and Table 643, switching characteristics.
Table 6-42. ePWM Timing Requirements (1)
MIN
Asynchronous
tw(SYCIN)
Sync input pulse width
(1)
UNIT
cycles
2tc(SCO)
cycles
1tc(SCO) + tw(IQSW)
cycles
Synchronous
With input qualifier
MAX
2tc(SCO)
For an explanation of the input qualifier parameters, see Table 6-55.
Table 6-43. ePWM Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(PWM)
Pulse duration, PWMx output high/low
tw(SYNCOUT)
Sync output pulse width
td(PWM)tza
Delay time, trip input active to PWM forced high
Delay time, trip input active to PWM forced low
td(TZ-PWM)HZ
Delay time, trip input active to PWM Hi-Z
6.9.6.2
TEST CONDITIONS
MIN
MAX
UNIT
33.33
ns
8tc(SCO)
cycles
no pin load
25
ns
20
ns
Trip-Zone Input Timing
Table 6-44. Trip-Zone Input Timing Requirements (1)
MIN
Asynchronous
tw(TZ)
Pulse duration, TZx input low
(1)
UNIT
cycles
2tc(TBCLK)
cycles
2tc(TBCLK) + tw(IQSW)
cycles
Synchronous
With input qualifier
MAX
2tc(TBCLK)
For an explanation of the input qualifier parameters, see Table 6-55.
SYSCLK
tw(TZ)
(A)
TZ
td(TZ-PWM)HZ
(B)
PWM
A.
B.
TZ - TZ1, TZ2, TZ3
PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM
recovery software.
Figure 6-37. PWM Hi-Z Characteristics
Detailed Description
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6.9.7
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High-Resolution PWM (HRPWM)
This module combines multiple delay lines in a single module and a simplified calibration system by using
a dedicated calibration delay line. For each ePWM module there is one HR delay line.
The HRPWM module offers PWM resolution (time granularity) that is significantly better than what can be
achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are:
• Significantly extends the time resolution capabilities of conventionally derived digital PWM
• This capability can be used in both single edge (duty cycle and phase-shift control) as well as dual
edge control for frequency/period modulation.
• Finer time granularity control or edge positioning is controlled through extensions to the Compare A
and Phase registers of the ePWM module.
• HRPWM capabilities, when available on a particular device, are offered only on the A signal path of an
ePWM module (that is, on the EPWMxA output). EPWMxB output has conventional PWM capabilities.
NOTE
The minimum SYSCLKOUT frequency allowed for HRPWM is 50 MHz.
NOTE
When dual-edge high-resolution is enabled (high-resolution period mode), the PWMxB output
is not available for use.
6.9.7.1
HRPWM Electrical Data/Timing
Table 6-45 shows the high-resolution PWM switching characteristics.
Table 6-45. High-Resolution PWM Characteristics at SYSCLKOUT = 50 MHz (1)–60 MHz
PARAMETER
Micro Edge Positioning (MEP) step size
(1)
(2)
106
(2)
MIN
TYP
MAX
UNIT
150
310
ps
The HRPWM operates at a minimum SYSCLKOUT frequency of 50 MHz. Below 50 MHz, with device process variation, the MEP step
size may decrease under cold temperature and high core voltage conditions to such a point that 255 MEP steps will not span an entire
SYSCLKOUT cycle.
The MEP step size will be largest at high temperature and minimum voltage on VDD. MEP step size will increase with higher
temperature and lower voltage and decrease with lower temperature and higher voltage.
Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI
software libraries for details of using SFO function in end applications. SFO functions help to estimate the number of MEP steps per
SYSCLKOUT period dynamically while the HRPWM is in operation.
Detailed Description
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6.9.8
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Enhanced Capture Module (eCAP1)
SYNC
The device contains an enhanced capture (eCAP) module. Figure 6-38 shows a functional block diagram
of a module.
SYNCIn
CTRPHS
(phase register−32 bit)
SYNCOut
TSCTR
(counter−32 bit)
APWM mode
OVF
RST
CTR_OVF
CTR [0−31]
PWM
compare
logic
PRD [0−31]
Delta−mode
CMP [0−31]
32
CTR=PRD
CTR [0−31]
CTR=CMP
32
32
CAP1
(APRD active)
APRD
shadow
32
LD
LD1
MODE SELECT
PRD [0−31]
Polarity
select
32
CMP [0−31]
32
CAP2
(ACMP active)
32
LD
LD2
Polarity
select
Event
qualifier
ACMP
shadow
32
CAP3
(APRD shadow)
LD
32
CAP4
(ACMP shadow)
LD
eCAPx
Event
Prescale
Polarity
select
LD3
LD4
Polarity
select
4
Capture events
4
CEVT[1:4]
to PIE
Interrupt
Trigger
and
Flag
control
CTR_OVF
Continuous /
Oneshot
Capture Control
CTR=PRD
CTR=CMP
Copyright © 2017, Texas Instruments Incorporated
Figure 6-38. eCAP Functional Block Diagram
The eCAP module is clocked at the SYSCLKOUT rate.
The clock enable bits (ECAP1 ENCLK) in the PCLKCR1 register turn off the eCAP module individually (for
low-power operation). Upon reset, ECAP1ENCLK is set to low, indicating that the peripheral clock is off.
Detailed Description
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Table 6-46. eCAP Control and Status Registers
eCAP1
SIZE (x16)
TSCTR
NAME
0x6A00
2
Time-Stamp Counter
CTRPHS
0x6A02
2
Counter Phase Offset Value Register
CAP1
0x6A04
2
Capture 1 Register
CAP2
0x6A06
2
Capture 2 Register
CAP3
0x6A08
2
Capture 3 Register
CAP4
0x6A0A
2
Capture 4 Register
Reserved
0x6A0C to 0x6A12
8
Reserved
ECCTL1
0x6A14
1
Capture Control Register 1
ECCTL2
0x6A15
1
Capture Control Register 2
ECEINT
0x6A16
1
Capture Interrupt Enable Register
ECFLG
0x6A17
1
Capture Interrupt Flag Register
ECCLR
0x6A18
1
Capture Interrupt Clear Register
ECFRC
0x6A19
1
Capture Interrupt Force Register
0x6A1A to 0x6A1F
6
Reserved
Reserved
EALLOW PROTECTED
DESCRIPTION
For more information on the eCAP, see the Enhanced Capture (eCAP) Module chapter in the
TMS320F2802x,TMS320F2802xx Piccolo Technical Reference Manual.
6.9.8.1
eCAP Electrical Data/Timing
Table 6-47 shows the eCAP timing requirement and Table 6-48 shows the eCAP switching characteristics.
Table 6-47. Enhanced Capture (eCAP) Timing Requirement (1)
MIN
Asynchronous
tw(CAP)
Capture input pulse width
(1)
UNIT
cycles
2tc(SCO)
cycles
1tc(SCO) + tw(IQSW)
cycles
Synchronous
With input qualifier
MAX
2tc(SCO)
For an explanation of the input qualifier parameters, see Table 6-55.
Table 6-48. eCAP Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(APWM)
108
Pulse duration, APWMx output high/low
Detailed Description
TEST CONDITIONS
MIN
MAX
20
UNIT
ns
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6.9.9
SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
JTAG Port
On the 2802x device, the JTAG port is reduced to 5 pins (TRST, TCK, TDI, TMS, TDO). TCK, TDI, TMS
and TDO pins are also GPIO pins. The TRST signal selects either JTAG or GPIO operating mode for the
pins in Figure 6-39. During emulation/debug, the GPIO function of these pins are not available. If the
GPIO38/TCK/XCLKIN pin is used to provide an external clock, an alternate clock source should be used
to clock the device during emulation/debug because this pin will be needed for the TCK function.
NOTE
In 2802x devices, the JTAG pins may also be used as GPIO pins. Care should be taken in
the board design to ensure that the circuitry connected to these pins do not affect the
emulation capabilities of the JTAG pin function. Any circuitry connected to these pins should
not prevent the emulator from driving (or being driven by) the JTAG pins for successful
debug.
TRST = 0: JTAG Disabled (GPIO Mode)
TRST = 1: JTAG Mode
TRST
TRST
XCLKIN
GPIO38_in
TCK
TCK/GPIO38
GPIO38_out
C28x
Core
GPIO37_in
TDO/GPIO37
1
0
TDO
GPIO37_out
GPIO36_in
1
TMS/GPIO36
GPIO36_out
1
TMS
0
GPIO35_in
1
TDI/GPIO35
GPIO35_out
1
TDI
0
Figure 6-39. JTAG/GPIO Multiplexing
Detailed Description
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6.9.10 General-Purpose Input/Output (GPIO) MUX
The GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition
to providing individual pin bit-banging I/O capability.
The device supports 22 GPIO pins. The GPIO control and data registers are mapped to Peripheral
Frame 1 to enable 32-bit operations on the registers (along with 16-bit operations). Table 6-49 shows the
GPIO register mapping.
Table 6-49. GPIO Registers
NAME
ADDRESS
SIZE (x16)
DESCRIPTION
GPIO CONTROL REGISTERS (EALLOW PROTECTED)
GPACTRL
0x6F80
2
GPIO A Control Register (GPIO0 to 31)
GPAQSEL1
0x6F82
2
GPIO A Qualifier Select 1 Register (GPIO0 to 15)
GPAQSEL2
0x6F84
2
GPIO A Qualifier Select 2 Register (GPIO16 to 31)
GPAMUX1
0x6F86
2
GPIO A MUX 1 Register (GPIO0 to 15)
GPAMUX2
0x6F88
2
GPIO A MUX 2 Register (GPIO16 to 31)
GPADIR
0x6F8A
2
GPIO A Direction Register (GPIO0 to 31)
GPAPUD
0x6F8C
2
GPIO A Pullup Disable Register (GPIO0 to 31)
GPBCTRL
0x6F90
2
GPIO B Control Register (GPIO32 to 38)
GPBQSEL1
0x6F92
2
GPIO B Qualifier Select 1 Register (GPIO32 to 38)
GPBMUX1
0x6F96
2
GPIO B MUX 1 Register (GPIO32 to 38)
GPBDIR
0x6F9A
2
GPIO B Direction Register (GPIO32 to 38)
GPBPUD
0x6F9C
2
GPIO B Pullup Disable Register (GPIO32 to 38)
AIOMUX1
0x6FB6
2
Analog, I/O mux 1 register (AIO0 to AIO15)
AIODIR
0x6FBA
2
Analog, I/O Direction Register (AIO0 to AIO15)
GPIO DATA REGISTERS (NOT EALLOW PROTECTED)
GPADAT
0x6FC0
2
GPIO A Data Register (GPIO0 to 31)
GPASET
0x6FC2
2
GPIO A Data Set Register (GPIO0 to 31)
GPACLEAR
0x6FC4
2
GPIO A Data Clear Register (GPIO0 to 31)
GPATOGGLE
0x6FC6
2
GPIO A Data Toggle Register (GPIO0 to 31)
GPBDAT
0x6FC8
2
GPIO B Data Register (GPIO32 to 38)
GPBSET
0x6FCA
2
GPIO B Data Set Register (GPIO32 to 38)
GPBCLEAR
0x6FCC
2
GPIO B Data Clear Register (GPIO32 to 38)
GPBTOGGLE
0x6FCE
2
GPIO B Data Toggle Register (GPIO32 to 38)
AIODAT
0x6FD8
2
Analog I/O Data Register (AIO0 to AIO15)
AIOSET
0x6FDA
2
Analog I/O Data Set Register (AIO0 to AIO15)
AIOCLEAR
0x6FDC
2
Analog I/O Data Clear Register (AIO0 to AIO15)
0x6FDE
2
Analog I/O Data Toggle Register (AIO0 to AIO15)
AIOTOGGLE
GPIO INTERRUPT AND LOW-POWER MODES SELECT REGISTERS (EALLOW PROTECTED)
GPIOXINT1SEL
0x6FE0
1
XINT1 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT2SEL
0x6FE1
1
XINT2 GPIO Input Select Register (GPIO0 to 31)
GPIOXINT3SEL
0x6FE2
1
XINT3 GPIO Input Select Register (GPIO0 to 31)
GPIOLPMSEL
0x6FE8
2
LPM GPIO Select Register (GPIO0 to 31)
NOTE
There is a two-SYSCLKOUT cycle delay from when the write to the GPxMUXn/AIOMUXn
and GPxQSELn registers occurs to when the action is valid.
110
Detailed Description
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SPRS523M – NOVEMBER 2008 – REVISED JANUARY 2019
Table 6-50. GPIOA MUX (1) (2)
DEFAULT AT RESET
PRIMARY I/O
FUNCTION
PERIPHERAL
SELECTION 1
PERIPHERAL
SELECTION 2
PERIPHERAL
SELECTION 3
GPAMUX1 REGISTER
BITS
(GPAMUX1 BITS = 00)
(GPAMUX1 BITS = 01)
(GPAMUX1 BITS = 10)
(GPAMUX1 BITS = 11)
1-0
GPIO0
EPWM1A (O)
Reserved
Reserved
3-2
GPIO1
EPWM1B (O)
Reserved
COMP1OUT (O)
5-4
GPIO2
EPWM2A (O)
Reserved
Reserved
7-6
GPIO3
EPWM2B (O)
Reserved
COMP2OUT (3) (O)
9-8
GPIO4
EPWM3A (O)
Reserved
Reserved
11-10
GPIO5
EPWM3B (O)
Reserved
ECAP1 (I/O)
13-12
GPIO6
EPWM4A (O)
EPWMSYNCI (I)
EPWMSYNCO (O)
15-14
GPIO7
EPWM4B (O)
SCIRXDA (I)
Reserved
17-16
Reserved
Reserved
Reserved
Reserved
19-18
Reserved
Reserved
Reserved
Reserved
21-20
Reserved
Reserved
Reserved
Reserved
23-22
Reserved
Reserved
Reserved
Reserved
25-24
GPIO12
TZ1 (I)
SCITXDA (O)
Reserved
27-26
Reserved
Reserved
Reserved
Reserved
29-28
Reserved
Reserved
Reserved
Reserved
31-30
Reserved
Reserved
Reserved
Reserved
GPAMUX2 REGISTER
BITS
(GPAMUX2 BITS = 00)
(GPAMUX2 BITS = 01)
(GPAMUX2 BITS = 10)
(GPAMUX2 BITS = 11)
1-0
GPIO16
SPISIMOA (I/O)
Reserved
TZ2 (I)
3-2
GPIO17
SPISOMIA (I/O)
Reserved
TZ3 (I)
5-4
GPIO18
SPICLKA (I/O)
SCITXDA (O)
XCLKOUT (O)
7-6
GPIO19/XCLKIN
SPISTEA (I/O)
SCIRXDA (I)
ECAP1 (I/O)
9-8
Reserved
Reserved
Reserved
Reserved
11-10
Reserved
Reserved
Reserved
Reserved
13-12
Reserved
Reserved
Reserved
Reserved
15-14
Reserved
Reserved
Reserved
Reserved
17-16
Reserved
Reserved
Reserved
Reserved
19-18
Reserved
Reserved
Reserved
Reserved
21-20
Reserved
Reserved
Reserved
Reserved
23-22
Reserved
Reserved
Reserved
Reserved
25-24
GPIO28
SCIRXDA (I)
SDAA (I/OD)
TZ2 (I)
27-26
GPIO29
SCITXDA (O)
SCLA (I/OD)
TZ3 (I)
29-28
Reserved
Reserved
Reserved
Reserved
31-30
Reserved
Reserved
Reserved
Reserved
(1)
(2)
(3)
The word reserved means that there is no peripheral assigned to this GPxMUX1/2 register setting. Should it be selected, the state of the
pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.
I = Input, O = Output, OD = Open Drain
These functions are not available in the 38-pin package.
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Table 6-51. GPIOB MUX (1)
DEFAULT AT RESET
PRIMARY I/O FUNCTION
PERIPHERAL
SELECTION 1
PERIPHERAL
SELECTION 2
PERIPHERAL
SELECTION 3
GPBMUX1 REGISTER
BITS
(GPBMUX1 BITS = 00)
(GPBMUX1 BITS = 01)
(GPBMUX1 BITS = 10)
(GPBMUX1 BITS = 11)
1-0
GPIO32 (2)
SDAA (2) (I/OD)
EPWMSYNCI (2) (I)
3-2
(2)
GPIO33
5-4
(1)
(2)
SCLA
(2)
(I/OD)
EPWMSYNCO
(2)
(O)
ADCSOCAO
(2)
(O)
ADCSOCBO
(2)
(O)
GPIO34
COMP2OUT (O)
Reserved
Reserved
7-6
GPIO35 (TDI)
Reserved
Reserved
Reserved
9-8
GPIO36 (TMS)
Reserved
Reserved
Reserved
11-10
GPIO37 (TDO)
Reserved
Reserved
Reserved
13-12
GPIO38/XCLKIN (TCK)
Reserved
Reserved
Reserved
15-14
Reserved
Reserved
Reserved
Reserved
17-16
Reserved
Reserved
Reserved
Reserved
19-18
Reserved
Reserved
Reserved
Reserved
21-20
Reserved
Reserved
Reserved
Reserved
23-22
Reserved
Reserved
Reserved
Reserved
25-24
Reserved
Reserved
Reserved
Reserved
27-26
Reserved
Reserved
Reserved
Reserved
29-28
Reserved
Reserved
Reserved
Reserved
31-30
Reserved
Reserved
Reserved
Reserved
I = Input, O = Output, OD = Open Drain
These pins are not available in the 38-pin package.
Table 6-52. Analog MUX for 48-Pin PT Package (1)
DEFAULT AT RESET
AIOx AND PERIPHERAL SELECTION 1
(1)
112
PERIPHERAL SELECTION 2 AND
PERIPHERAL SELECTION 3
AIOMUX1 REGISTER BITS
AIOMUX1 BITS = 0,x
AIOMUX1 BITS = 1,x
1-0
ADCINA0 (I), VREFHI (I)
ADCINA0 (I), VREFHI (I)
3-2
ADCINA1 (I)
ADCINA1 (I)
5-4
AIO2 (I/O)
ADCINA2 (I), COMP1A (I)
7-6
ADCINA3 (I)
ADCINA3 (I)
9-8
AIO4 (I/O)
ADCINA4 (I), COMP2A (I)
11-10
–
–
13-12
AIO6 (I/O)
ADCINA6 (I)
15-14
ADCINA7 (I)
ADCINA7 (I)
17-16
–
–
19-18
ADCINB1 (I)
ADCINB1 (I)
21-20
AIO10 (I/O)
ADCINB2 (I), COMP1B (I)
23-22
ADCINB3 (I)
ADCINB3 (I)
25-24
AIO12 (I/O)
ADCINB4 (I), COMP2B (I)
27-26
–
–
29-28
AIO14 (I/O)
ADCINB6 (I)
31-30
ADCINB7 (I)
ADCINB7 (I)
I = Input, O = Output
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Table 6-53. Analog MUX for 38-Pin DA Package (1)
DEFAULT AT RESET
(1)
AIOx AND PERIPHERAL SELECTION 1
PERIPHERAL SELECTION 2 AND
PERIPHERAL SELECTION 3
AIOMUX1 REGISTER BITS
AIOMUX1 BITS = 0,x
AIOMUX1 BITS = 1,x
1-0
ADCINA0 (I), VREFHI (I)
ADCINA0 (I), VREFHI (I)
3-2
–
–
5-4
AIO2 (I/O)
ADCINA2 (I), COMP1A (I)
7-6
–
–
9-8
AIO4 (I/O)
ADCINA4 (I)
11-10
–
–
13-12
AIO6 (I/O)
ADCINA6 (I)
15-14
–
–
17-16
–
–
19-18
–
–
21-20
AIO10 (I/O)
ADCINB2 (I), COMP1B (I)
23-22
–
–
25-24
AIO12 (I/O)
ADCINB4 (I)
27-26
–
–
29-28
AIO14 (I/O)
ADCINB6 (I)
31-30
–
–
I = Input, O = Output
The user can select the type of input qualification for each GPIO pin through the GPxQSEL1/2 registers
from four choices:
• Synchronization To SYSCLKOUT Only (GPxQSEL1/2 = 0, 0): This is the default mode of all GPIO pins
at reset and it simply synchronizes the input signal to the system clock (SYSCLKOUT).
• Qualification Using Sampling Window (GPxQSEL1/2 = 0, 1 and 1, 0): In this mode the input signal,
after synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles
before the input is allowed to change.
• The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in
groups of 8 signals. It specifies a multiple of SYSCLKOUT cycles for sampling the input signal. The
sampling window is either 3-samples or 6-samples wide and the output is only changed when ALL
samples are the same (all 0s or all 1s) as shown in Figure 6-42 (for 6 sample mode).
• No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is
not required (synchronization is performed within the peripheral).
Due to the multilevel multiplexing that is required on the device, there may be cases where a peripheral
input signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the
input signal will default to either a 0 or 1 state, depending on the peripheral.
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GPIOXINT1SEL
GPIOLMPSEL
GPIOXINT2SEL
LPMCR0
GPIOXINT3SEL
External Interrupt
MUX
Low-Power
Modes Block
Asynchronous
path
PIE
GPxDAT (read)
GPxQSEL1/2
GPxCTRL
GPxPUD
Input
Qualification
Internal
Pullup
00
N/C
01
Peripheral 1 Input
10
Peripheral 2 Input
11
Peripheral 3 Input
GPxTOGGLE
Asynchronous path
GPIOx pin
GPxCLEAR
GPxSET
00
01
GPxDAT (latch)
Peripheral 1 Output
10
Peripheral 2 Output
11
Peripheral 3 Output
High Impedance
Output Control
00
0 = Input, 1 = Output
XRS
= Default at Reset
A.
B.
C.
GPxDIR (latch)
01
Peripheral 1 Output Enable
10
Peripheral 2 Output Enable
11
Peripheral 3 Output Enable
GPxMUX1/2
x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register
depending on the particular GPIO pin selected.
GPxDAT latch/read are accessed at the same memory location.
This is a generic GPIO MUX block diagram. Not all options may be applicable for all GPIO pins. For pin-specific
variations, see the System Control chapter in the TMS320F2802x,TMS320F2802xx Piccolo Technical Reference
Manual.
Figure 6-40. GPIO Multiplexing
114
Detailed Description
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6.9.10.1 GPIO Electrical Data/Timing
6.9.10.1.1
GPIO - Output Timing
Table 6-54. General-Purpose Output Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tr(GPO)
Rise time, GPIO switching low to high
tf(GPO)
Fall time, GPIO switching high to low
tfGPO
Toggling frequency
(1)
MAX
UNIT
All GPIOs
MIN
13 (1)
ns
All GPIOs
(1)
ns
15
MHz
13
Rise time and fall time vary with electrical loading on I/O pins. Values given in Table 6-54 are applicable for a 40-pF load on I/O pins.
GPIO
t f(GPO)
t r(GPO)
Figure 6-41. General-Purpose Output Timing
Detailed Description
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6.9.10.1.2
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GPIO - Input Timing
Table 6-55. General-Purpose Input Timing Requirements
MIN
tw(SP)
Sampling period
tw(IQSW)
Input qualifier sampling window
tw(GPI)
(1)
(2)
(2)
UNIT
QUALPRD = 0
1tc(SCO)
cycles
QUALPRD ≠ 0
2tc(SCO) * QUALPRD
cycles
tw(SP) * (n (1) – 1)
cycles
2tc(SCO)
cycles
tw(IQSW) + tw(SP) + 1tc(SCO)
cycles
Synchronous mode
Pulse duration, GPIO low/high
MAX
With input qualifier
"n" represents the number of qualification samples as defined by GPxQSELn register.
For tw(GPI), pulse width is measured from VIL to VIL for an active low signal and VIH to VIH for an active high signal.
(A)
GPIO Signal
GPxQSELn = 1,0 (6 samples)
1
1
0
0
0
0
0
0
0
1
tw(SP)
0
0
0
1
1
1
1
1
Sampling Window
1
1
1
Sampling Period determined
by GPxCTRL[QUALPRD]
tw(IQSW)
1
[(SYSCLKOUT cycle * 2 * QUALPRD) * 5
(B)
(C)
]
SYSCLKOUT
QUALPRD = 1
(SYSCLKOUT/2)
(D)
Output From
Qualifier
A.
B.
C.
D.
This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period. It
can vary from 00 to 0xFF. If QUALPRD = 00, then the sampling period is 1 SYSCLKOUT cycle. For any other value
"n", the qualification sampling period in 2n SYSCLKOUT cycles (that is, at every 2n SYSCLKOUT cycles, the GPIO
pin will be sampled).
The qualification period selected through the GPxCTRL register applies to groups of 8 GPIO pins.
The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is
used.
In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLKOUT cycles or
greater. In other words, the inputs should be stable for (5 x QUALPRD x 2) SYSCLKOUT cycles. This would ensure
5 sampling periods for detection to occur. Because external signals are driven asynchronously, an 13-SYSCLKOUTwide pulse ensures reliable recognition.
Figure 6-42. Sampling Mode
116
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6.9.10.1.3 Sampling Window Width for Input Signals
The following section summarizes the sampling window width for input signals for various input qualifier
configurations.
Sampling frequency denotes how often a signal is sampled with respect to SYSCLKOUT.
Sampling frequency = SYSCLKOUT/(2 × QUALPRD), if QUALPRD ≠ 0
Sampling frequency = SYSCLKOUT, if QUALPRD = 0
Sampling period = SYSCLKOUT cycle × 2 × QUALPRD, if QUALPRD ≠ 0
In the above equations, SYSCLKOUT cycle indicates the time period of SYSCLKOUT.
Sampling period = SYSCLKOUT cycle, if QUALPRD = 0
In a given sampling window, either 3 or 6 samples of the input signal are taken to determine the validity of
the signal. This is determined by the value written to GPxQSELn register.
Case 1:
Qualification using 3 samples
Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 2, if QUALPRD ≠ 0
Sampling window width = (SYSCLKOUT cycle) × 2, if QUALPRD = 0
Case 2:
Qualification using 6 samples
Sampling window width = (SYSCLKOUT cycle × 2 × QUALPRD) × 5, if QUALPRD ≠ 0
Sampling window width = (SYSCLKOUT cycle) × 5, if QUALPRD = 0
SYSCLK
GPIOxn
tw(GPI)
Figure 6-43. General-Purpose Input Timing
VDDIO
> 1 MS
2 pF
VSS
VSS
Figure 6-44. Input Resistance Model for a GPIO Pin With an Internal Pullup
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6.9.10.1.4 Low-Power Mode Wakeup Timing
Table 6-56 shows the timing requirements, Table 6-57 shows the switching characteristics, and Figure 645 shows the timing diagram for IDLE mode.
Table 6-56. IDLE Mode Timing Requirements (1)
MIN
tw(WAKE-INT)
(1)
Pulse duration, external wake-up signal
Without input qualifier
MAX
2tc(SCO)
With input qualifier
UNIT
cycles
5tc(SCO) + tw(IQSW)
For an explanation of the input qualifier parameters, see Table 6-55.
Table 6-57. IDLE Mode Switching Characteristics (1)
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Delay time, external wake signal to program execution resume
•
td(WAKE-IDLE)
•
MIN
Wake up from Flash
– Flash module in active state
Without input qualifier
Wake up from Flash
– Flash module in sleep state
Without input qualifier
(1)
(2)
Wake up from SARAM
UNIT
cycles
20tc(SCO)
With input qualifier
20tc(SCO) + tw(IQSW)
1050tc(SCO)
With input qualifier
1050tc(SCO) + tw(IQSW)
Without input qualifier
•
MAX
(2)
20tc(SCO)
With input qualifier
20tc(SCO) + tw(IQSW)
cycles
cycles
cycles
For an explanation of the input qualifier parameters, see Table 6-55.
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered
by the wake-up signal) involves additional latency.
td(WAKE−IDLE)
Address/Data
(internal)
XCLKOUT
tw(WAKE−INT)
WAKE INT
A.
B.
(A)(B)
WAKE INT can be any enabled interrupt, WDINT or XRS.
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be
initiated until at least 4 OSCCLK cycles have elapsed.
Figure 6-45. IDLE Entry and Exit Timing
118
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Table 6-58. STANDBY Mode Timing Requirements
MIN
tw(WAKE-INT)
(1)
Pulse duration, external
wake-up signal
Without input qualification
With input qualification (1)
MAX
3tc(OSCCLK)
UNIT
cycles
(2 + QUALSTDBY) * tc(OSCCLK)
QUALSTDBY is a 6-bit field in the LPMCR0 register.
Table 6-59. STANDBY Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(IDLE-XCOL)
TEST CONDITIONS
Delay time, IDLE instruction
executed to XCLKOUT low
MIN
MAX
UNIT
32tc(SCO)
45tc(SCO)
cycles
Delay time, external wake signal to program execution
resume (1)
•
td(WAKE-STBY)
•
Without input qualifier
Wake up from flash
– Flash module in active state With input qualifier
Wake up from flash
– Flash module in sleep state
Without input qualifier
With input qualifier
Without input qualifier
•
(1)
Wake up from SARAM
With input qualifier
cycles
100tc(SCO)
100tc(SCO) + tw(WAKE-INT)
1125tc(SCO)
1125tc(SCO) + tw(WAKE-INT)
100tc(SCO)
100tc(SCO) + tw(WAKE-INT)
cycles
cycles
cycles
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered
by the wake-up signal) involves additional latency.
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(C)
(A)
(B)
Device
Status
(F)
(D)(E)
STANDBY
(G)
STANDBY
Normal Execution
Flushing Pipeline
Wake-up
(H)
Signal
tw(WAKE-INT)
td(WAKE-STBY)
X1/X2 or
XCLKIN
XCLKOUT
td(IDLE−XCOL)
A.
B.
C.
D.
E.
F.
G.
H.
IDLE instruction is executed to put the device into STANDBY mode.
The PLL block responds to the STANDBY signal. SYSCLKOUT is held for the number of cycles indicated below
before being turned off:
•
16 cycles, when DIVSEL = 00 or 01
•
32 cycles, when DIVSEL = 10
•
64 cycles, when DIVSEL = 11
This delay enables the CPU pipeline and any other pending operations to flush properly.
Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in
STANDBY mode.
The external wake-up signal is driven active.
The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement.
Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the
device will not be deterministic and the device may not exit low-power mode for subsequent wake-up pulses.
After a latency period, the STANDBY mode is exited.
Normal execution resumes. The device will respond to the interrupt (if enabled).
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be
initiated until at least 4 OSCCLK cycles have elapsed.
Figure 6-46. STANDBY Entry and Exit Timing Diagram
Table 6-60. HALT Mode Timing Requirements
MIN
MAX
UNIT
tw(WAKE-GPIO)
Pulse duration, GPIO wake-up signal
toscst + 2tc(OSCCLK)
cycles
tw(WAKE-XRS)
Pulse duration, XRS wake-up signal
toscst + 8tc(OSCCLK)
cycles
Table 6-61. HALT Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(IDLE-XCOL)
Delay time, IDLE instruction executed to XCLKOUT low
tp
PLL lock-up time
td(WAKE-HALT)
Delay time, PLL lock to program execution resume
•
Wake up from flash
– Flash module in sleep state
•
120
Wake up from SARAM
Detailed Description
MIN
MAX
UNIT
32tc(SCO)
45tc(SCO)
cycles
1
ms
1125tc(SCO)
cycles
35tc(SCO)
cycles
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(C)
(A)
(F)
(B)
Device
Status
HALT
Flushing Pipeline
(H)
(G)
(D)(E)
HALT
PLL Lock-up Time
Wake-up Latency
Normal
Execution
(I)
GPIOn
td(WAKE−HALT )
tw(WAKE-GPIO)
tp
X1/X2 or
XCLKIN
Oscillator Start-up Time
XCLKOUT
td(IDLE−XCOL)
A.
B.
C.
D.
E.
F.
G.
H.
I.
IDLE instruction is executed to put the device into HALT mode.
The PLL block responds to the HALT signal. SYSCLKOUT is held for the number of cycles indicated below before
oscillator is turned off and the CLKIN to the core is stopped:
•
16 cycles, when DIVSEL = 00 or 01
•
32 cycles, when DIVSEL = 10
•
64 cycles, when DIVSEL = 11
This delay enables the CPU pipeline and any other pending operations to flush properly.
Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as
the clock source, the internal oscillator is shut down as well. The device is now in HALT mode and consumes
absolute minimum power. It is possible to keep the zero-pin internal oscillators (INTOSC1 and INTOSC2) and the
watchdog alive in HALT mode. This is done by writing to the appropriate bits in the CLKCTL register.
When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator
wake-up sequence is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This
enables the provision of a clean clock signal during the PLL lock sequence. Because the falling edge of the GPIO pin
asynchronously begins the wake-up procedure, care should be taken to maintain a low noise environment prior to
entering and during HALT mode.
The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement.
Furthermore, this signal must be free of glitches. If a noisy signal is fed to a GPIO pin, the wake-up behavior of the
device will not be deterministic and the device may not exit low-power mode for subsequent wake-up pulses.
Once the oscillator has stabilized, the PLL lock sequence is initiated, which takes 1 ms.
When CLKIN to the core is enabled, the device will respond to the interrupt (if enabled), after a latency. The HALT
mode is now exited.
Normal operation resumes.
From the time the IDLE instruction is executed to place the device into low-power mode (LPM), wakeup should not be
initiated until at least 4 OSCCLK cycles have elapsed.
Figure 6-47. HALT Mode Wakeup Using GPIOn
Detailed Description
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7 Applications, Implementation, and Layout
NOTE
Information in the following sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
7.1
TI Design or Reference Design
The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded
processor, and connectivity. Created by TI experts to help you jump start your system design, all TI
Designs include schematic or block diagrams, BOMs, and design files to speed your time to market.
Search and download designs at ti.com/tidesigns.
36V/1kW Brushless DC Motor Drive with Stall Current Limit of
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