TMS320F28076, TMS320F28075
TMS320F28076,
TMS320F28075
SPRS902J – OCTOBER
2014 – REVISED
FEBRUARY 2021
SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
www.ti.com
TMS320F2807x Microcontrollers
1 Features
•
•
•
•
•
•
•
TMS320C28x 32-bit CPU
– 120 MHz
– IEEE 754 single-precision Floating-Point Unit
(FPU)
– Trigonometric Math Unit (TMU)
Programmable Control Law Accelerator (CLA)
– 120 MHz
– IEEE 754 single-precision floating-point
instructions
– Executes code independently of main CPU
On-chip memory
– 512KB (256KW) of flash (ECC-protected)
– 100KB (50KW) of RAM (ECC-protected or
parity-protected)
– Dual-zone security supporting third-party
development
– Unique identification number
Clock and system control
– Two internal zero-pin 10-MHz oscillators
– On-chip crystal oscillator
– Windowed watchdog timer module
– Missing clock detection circuitry
3.3-V I/O with available internal voltage regulator
for 1.2-V core supply
System peripherals
– External Memory Interface (EMIF) with ASRAM
and SDRAM support
– 6-channel Direct Memory Access (DMA)
controller
– Up to 97 individually programmable,
multiplexed General-Purpose Input/Output
(GPIO) pins with input filtering
– Expanded Peripheral Interrupt controller (ePIE)
– Multiple Low-Power Mode (LPM) support with
external wakeup
Communications peripherals
– USB 2.0 (MAC + PHY)
– Two Controller Area Network (CAN) modules
(pin-bootable)
– Three high-speed (up to 30-MHz) SPI ports
(pin-bootable)
– Two Multichannel Buffered Serial Ports
(McBSPs)
– Four Serial Communications Interfaces (SCI/
UART) (pin-bootable)
•
•
•
•
•
– Two I2C interfaces (pin-bootable)
Analog subsystem
– Up to three Analog-to-Digital Converters
(ADCs)
• 12-bit mode
– 3.1 MSPS each (up to 9.3-MSPS system
throughput)
– Single-ended inputs
– Up to 17 external channels
• Single Sample-and-Hold (S/H) on each ADC
• Hardware-integrated post-processing of
ADC conversions
– Saturating offset calibration
– Error from setpoint calculation
– High, low, and zero-crossing compare,
with interrupt capability
– Trigger-to-sample delay capture
– Eight windowed comparators with 12-bit Digitalto-Analog Converter (DAC) references
– Three 12-bit buffered DAC outputs
Enhanced control peripherals
– 24 PWM channels with enhanced features
– 16 High-Resolution Pulse Width Modulator
(HRPWM) channels
• High resolution on both A and B channels of
8 PWM modules
• Dead-band support (on both standard and
high resolution)
– Six Enhanced Capture (eCAP) modules
– Three Enhanced Quadrature Encoder Pulse
(eQEP) modules
– Up to eight Sigma-Delta Filter Module (SDFM)
input channels, 2 parallel filters per channel
• Standard SDFM data filtering
• Comparator filter for fast action for out of
range
Configurable Logic Block (CLB)
– Augments existing peripheral capability
– Supports position manager solutions
Functional Safety-Compliant
– Developed for functional safety applications
– Documentation available to aid ISO 26262
system design up to ASIL D; IEC 61508 up to
SIL 3; IEC 60730 up to Class C; and UL 1998
up to Class 2
– Hardware integrity up to ASIL B, SIL 2
Safety-related certification
An©IMPORTANT
NOTICEIncorporated
at the end of this data sheet addresses availability, warranty, changes, use in
safety-critical
applications,
Copyright
2021 Texas Instruments
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intellectual property matters and other important disclaimers. PRODUCTION DATA.
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•
•
– ISO 26262 certified up to ASIL B and IEC
61508 certified up to SIL 2 by TUV SUD
Package options:
– 176-pin PowerPAD™ Thermally Enhanced LowProfile Quad Flatpack (HLQFP) [PTP suffix]
– 100-pin PowerPAD Thermally Enhanced Thin
Quad Flatpack (HTQFP) [PZP suffix]
Temperature options:
– T: –40°C to 105°C junction
– S: –40°C to 125°C junction
– Q: –40°C to 125°C free-air
(AEC Q100 qualification for automotive
applications)
2 Applications
•
•
•
•
•
•
•
Medium/short range radar
Traction inverter motor control
HVAC large commercial motor control
Automated sorting equipment
CNC control
AC charging (pile) station
DC charging (pile) station
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
EV charging station power module
Energy storage power conversion system (PCS)
Central inverter
Solar power optimizer
String inverter
Inverter & motor control
On-board (OBC) & wireless charger
AC drive control module
AC drive power stage module
Linear motor power stage
Servo drive control module
AC-input BLDC motor drive
DC-input BLDC motor drive
Industrial AC-DC
Three phase UPS
3 Description
C2000™ 32-bit microcontrollers are optimized for processing, sensing, and actuation to improve closed-loop
performance in real-time control applications such as industrial motor drives; solar inverters and digital power;
electrical vehicles and transportation; motor control; and sensing and signal processing. The C2000 line includes
the Premium performance MCUs and the Entry performance MCUs.
The TMS320F2807x microcontroller family is suited for advanced closed-loop control applications such as
industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; and sensing and
signal processing. To accelerate application development, the DigitalPower software development kit (SDK) for
C2000 MCUs and the MotorControl software development kit (SDK) for C2000™ MCUs are available.
The F2807x is a 32-bit floating-point microcontroller based on TI’s industry-leading C28x core. This core is
boosted by the trigonometric hardware accelerator which improves performance of trigonometric-based
algorithms with CPU instructions such as sine, cosine, and arctangent functions, which are common in torqueloop and position calculations.
The F2807x microcontroller family features a CLA real-time control coprocessor. The CLA is an independent 32bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral
triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can
effectively double the computational performance of a real-time control system. By using the CLA to service
time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and
diagnostics.
The F2807x device supports up to 512KB (256KW) of ECC-protected onboard flash memory and up to 100KB
(50KW) of SRAM with parity. Two independent security zones are also available for 128-bit code protection of
the main C28x.
The analog subsystem boasts up to three 12-bit ADCs, which enable simultaneous management of three
independent power phases, and up to eight windowed comparator subsystems (CMPSSs), allowing very fast,
direct trip of the PWMs in overvoltage or overcurrent conditions. In addition, the device has three 12-bit DACs,
and precision control peripherals such as enhanced pulse width modulators (ePWMs) with fault protection,
eQEP peripherals, and eCAP units.
2
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Connectivity peripherals such as dual Controller Area Network (CAN) modules (ISO 11898-1/CAN 2.0Bcompliant) and a USB 2.0 port with MAC and full-speed PHY let users add universal serial bus (USB)
connectivity to their application.
To learn more about the C2000 MCUs, visit the C2000 Overview at www.ti.com/c2000.
Device Information
PART NUMBER(1)
PACKAGE
BODY SIZE
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28075PTP
HLQFP (176)
24.0 mm × 24.0 mm
TMS320F28076PZP
HTQFP (100)
14.0 mm × 14.0 mm
TMS320F28075PZP
HTQFP (100)
14.0 mm × 14.0 mm
TMS320F28076PTP
(1)
For more information, see Mechanical, Packaging, and Orderable Information.
Functional Block Diagram
Figure 4-1 shows the CPU system and associated peripherals.
MEMCPU1
C28 CPU-1
CPU1.CLA1 to CPU1
128x16 MSG RAM
CPU1 to CPU1.CLA1
128x16 MSG RAM
CPU1.CLA1
FPU
TMU
Dual
Code
Security
Module
+
Emulation
Code
Security
Logic
(ECSL)
CPU1 Local Shared
6x 2Kx16
LS0-LS5 RAMs
Secure Memories
shown in Red
User
Configurable
DCSM
PSWD
OTP
1K x 16
CPU1.D0 RAM 2Kx16
CPU1.D1 RAM 2Kx16
CPU1.M1 RAM 1Kx16
ADC
Result
Regs
D
Config
ADCIN14
ADCIN15
(up to 192
interrupts)
Secure-ROM 32Kx16
Secure
Data Bus
Bridge
TCK
JTAG
TDI
CPU1.CLA1 Data ROM
(4Kx16)
TDO
CPU1.DMA
CPU1 Buses
MFSXx
MFSRx
MCLKXx
MCLKRx
MDXx
MDRx
SPISTEx
SPICLKx
SPISIMOx
McBSP-A/B
EMIF1
GPIO
GPIOn
SPIA/B/C
(16L FIFO)
Data Bus
Bridge
EM1CTLx
CANA/B
(32-MBOX)
Data Bus
Bridge
EM1Dx
USB
Ctrl /
PHY
Peripheral Frame 2
EM1Ax
Data Bus
Bridge
USBDP
SCITXDx
SCIRXDx
SDx_Cy
SDx_Dy
EQEPxI
EQEPxS
EQEPxB
I2C-A/B
(16L FIFO)
SCLx
SCIA/B/C/D
(16L FIFO)
SDAx
SDFM-1/2
Data Bus
Bridge
USBDM
Data Bus Bridge
eQEP-1/2/3
EQEPxA
ECAPx
eCAP1/../6
EXTSYNCOUT
EPWMxB
EXTSYNCIN
EPWMxA
TZ1-TZ6
TRST
TMS
Peripheral Frame 1
ePWM-1/../12
Aux PLL
Boot-ROM 32Kx16
Nonsecure
Comparator
DAC
Subsystem
x3
(CMPSS)
HRPWM-1/../8
INTOSC2
Global Shared
8x 4Kx16
GS0-GS7 RAMs
SPISOMIx
Analog
MUX
Main PLL
PUMP
AUXCLKIN
ePIE
CANTXx
D4:0
12-bit ADC
x3
B
CPU1.CLA1 Bus
B3:0
A
INTOSC1
External Crystal or
Oscillator
CANRXx
A5:0
Watchdog
256K x 16
Secure
CPU Timer 0
CPU Timer 1
CPU Timer 2
CPU1.M0 RAM 1Kx16
GPIO MUX
FLASH
OTP/Flash
Wrapper
WD Timer
NMI-WDT
Low-Power
Mode Control
GPIO MUX, Input X-BAR, Output X-BAR
Figure 4-1. Functional Block Diagram
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 2
3 Description.......................................................................2
4 Revision History.............................................................. 4
5 Device Comparison......................................................... 5
5.1 Related Products........................................................ 6
6 Terminal Configuration and Functions..........................7
6.1 Pin Diagrams.............................................................. 7
6.2 Signal Descriptions................................................... 10
6.3 Pins With Internal Pullup and Pulldown.................... 25
6.4 Pin Multiplexing.........................................................26
6.5 Connections for Unused Pins................................... 32
7 Specifications................................................................ 33
7.1 Absolute Maximum Ratings...................................... 33
7.2 ESD Ratings – Commercial...................................... 34
7.3 ESD Ratings – Automotive....................................... 34
7.4 Recommended Operating Conditions.......................35
7.5 Power Consumption Summary................................. 36
7.6 Electrical Characteristics...........................................41
7.7 Thermal Resistance Characteristics......................... 42
7.8 Thermal Design Considerations................................43
7.9 System...................................................................... 44
7.10 Analog Peripherals..................................................79
7.11 Control Peripherals............................................... 104
7.12 Communications Peripherals................................ 123
8 Detailed Description....................................................151
8.1 Overview................................................................. 151
8.2 Functional Block Diagram....................................... 151
8.3 Memory................................................................... 153
8.4 Identification............................................................160
8.5 Bus Architecture – Peripheral Connectivity.............161
8.6 C28x Processor...................................................... 161
8.7 Control Law Accelerator..........................................163
8.8 Direct Memory Access............................................ 164
8.9 Boot ROM and Peripheral Booting..........................166
8.10 Dual Code Security Module.................................. 169
8.11 Timers................................................................... 170
8.12 Nonmaskable Interrupt With Watchdog Timer
(NMIWD)................................................................... 170
8.13 Watchdog.............................................................. 171
8.14 Configurable Logic Block (CLB)............................172
8.15 Functional Safety.................................................. 174
9 Applications, Implementation, and Layout............... 176
9.1 TI Reference Design............................................... 176
10 Device and Documentation Support........................177
10.1 Device and Development Support Tool
Nomenclature............................................................ 177
10.2 Markings............................................................... 178
10.3 Tools and Software............................................... 179
10.4 Documentation Support........................................ 181
10.5 Support Resources............................................... 181
10.6 Trademarks........................................................... 182
10.7 Electrostatic Discharge Caution............................182
10.8 Glossary................................................................182
11 Mechanical, Packaging, and Orderable
Information.................................................................. 183
11.1 Packaging Information.......................................... 183
4 Revision History
Changes from June 25, 2020 to January 15, 2021 (from Revision I (June 2020) to Revision J
(January 2021))
Page
• Device Comparison: Updated part numbers.......................................................................................................5
• ESD Ratings – Commercial: Updated part numbers........................................................................................ 34
• ESD Ratings – Automotive: Updated part numbers......................................................................................... 34
4
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5 Device Comparison
Table 5-1 lists the features of each 2807x device.
Table 5-1. Device Comparison
28076
28076-Q1
FEATURE(1)
Package Type (PTP is an HLQFP package. PZP is an HTQFP package.)
176-Pin PTP
28075
28075-Q1
100-Pin PZP
176-Pin PTP
100-Pin PZP
Processor and Accelerators
Number
C28x
CLA – Type 1
1
Frequency (MHz)
120
Floating-Point Unit (FPU)
Yes
TMU – Type 0
Yes
Number
1
Frequency (MHz)
120
6-Channel Direct Memory Access (DMA) – Type 0
1
Memory
Flash (16-bit words)
RAM (16-bit words)
512KB (256KW)
Dedicated and Local Shared RAM
36KB (18KW)
Global Shared RAM
64KB (32KW)
Total RAM
100KB (50KW)
Code security for on-chip flash, RAM, and OTP blocks
Yes
Boot ROM
Yes
System
Configurable Logic Block (CLB)
4 tiles
No
32-bit CPU timers
3
Watchdog timers
1
Nonmaskable Interrupt Watchdog (NMIWD) timers
1
Crystal oscillator/External clock input
1
0-pin internal oscillator
I/O pins
2
GPIO
97
41
EMIF1 (16-bit or 32-bit)
1
–
External interrupts
EMIF
97
41
1
–
17
14
3
2
8
4
5
Analog Peripherals
MSPS
ADC 12-bit mode
3.1
Conversion Time
(ns)(2)
Input pins
Number of 12-bit ADCs
325
17
14
3
2
Temperature sensor
1
CMPSS (each CMPSS has two comparators and two internal DACs)
8
Buffered DAC
4
3
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Table 5-1. Device Comparison (continued)
28076
28076-Q1
FEATURE(1)
Package Type (PTP is an HLQFP package. PZP is an HTQFP package.)
176-Pin PTP
28075
28075-Q1
100-Pin PZP
176-Pin PTP
100-Pin PZP
24
15
Control Peripherals (3)
eCAP inputs – Type 0
6
ePWM channels – Type 4
24
15
eQEP modules – Type 0
3
2
3
2
High-resolution ePWM channels – Type 4
16
9
16
9
8
6
8
6
4
3
Sigma-Delta Filter Module (SDFM) channels
Communication Peripherals (3)
Controller Area Network (CAN) – Type 0(4)
2
Inter-Integrated Circuit (I2C) – Type 0
2
Multichannel Buffered Serial Port (McBSP) – Type 1
2
SCI – Type 0
4
3
Serial Peripheral Interface (SPI) – Type 2
3
Universal Serial Bus (USB) – Type 0
1
Temperature and Qualification
T: –40°C to 105°C
Junction Temperature (TJ)
Free-Air Temperature (TA)
(1)
(2)
(3)
(4)
(5)
No
S: –40°C to 125°C
Yes
Yes
Q: –40°C to 150°C(5)
No
Yes
125°C(5)
No
Yes
Q: –40°C to
A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor
differences between devices that do not affect the basic functionality of the module. For more information, see the C2000 Real-Time
Control Peripherals Reference Guide.
Time between start of sample-and-hold window to start of sample-and-hold window of the next conversion.
For devices that are available in more than one package, the peripheral count listed in the smaller package is reduced because the
smaller package has less device pins available. The number of peripherals internally present on the device is not reduced compared to
the largest package offered within a part number. See Section 6 to identify which peripheral instances are accessible on pins in the
smaller package.
The CAN module uses the IP known as D_CAN. This document uses the names CAN and D_CAN interchangeably to reference this
peripheral.
The letter Q refers to AEC Q100 qualification for automotive applications.
5.1 Related Products
For information about similar products, see the following links:
TMS320F2807x Microcontrollers
The F2807x series offers the most performance, largest pin counts, flash memory sizes, and peripheral options.
The F2807x series includes the latest generation of accelerators, ePWM peripherals, and analog technology.
TMS320F28004x Microcontrollers
The F28004x series is a reduced version of the F2807x series with the latest generational enhancements. The
F28004x series is the best roadmap option for those using the F2806x series. InstaSPIN-FOC and configurable
logic block (CLB) versions are available.
6
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6 Terminal Configuration and Functions
6.1 Pin Diagrams
132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
98
97
96
95
94
93
92
91
90
89
GPIO67
GPIO43
GPIO42
GPIO47
GPIO46
VDDIO
VDD
VDDOSC
XRS
X1
VSSOSC
X2
VDDOSC
VREGENZ
GPIO133
VDD
VDDIO
GPIO45
VDDIO
GPIO44
GPIO66
GPIO65
GPIO64
GPIO63
GPIO62
GPIO61
VDDIO
GPIO60
GPIO59
GPIO58
GPIO57
GPIO56
GPIO55
VDDIO
GPIO54
GPIO53
GPIO52
GPIO51
GPIO50
GPIO49
ERRORSTS
VDDIO
GPIO48
GPIO41
Figure 6-1 shows the pin assignments on the 176-pin PTP PowerPAD Thermally Enhanced Low-Profile Quad
Flatpack. Figure 6-2 shows the pin assignments on the 100-pin PZP PowerPAD Thermally Enhanced Thin Quad
Flatpack.
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
VDDIO
GPIO40
GPIO39
GPIO38
GPIO37
GPIO36
VDDIO
TCK
TMS
TRST
TDO
TDI
VDD
VDDIO
FLT2
FLT1
VDD3VFL
GPIO35
GPIO34
GPIO33
VDDIO
GPIO32
GPIO31
GPIO29
GPIO28
GPIO30
VDDIO
VDD
ADCIND4
ADCIND3
ADCIND2
ADCIND1
ADCIND0
VREFHID
VDDA
VREFHIB
VSSA
VREFLOD
VREFLOB
ADCINB3
ADCINB2
ADCINB1
ADCINB0
ADCIN15
GPIO10
GPIO11
VDDIO
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO18
VDDIO
GPIO19
GPIO20
GPIO21
VDDIO
VDD
GPIO99
GPIO8
GPIO9
VDDIO
VDD
GPIO22
GPIO23
GPIO24
GPIO25
VDDIO
GPIO26
GPIO27
CMPIN5P
CMPIN6N
CMPIN6P
VSSA
VREFLOA
VSSA
VDDA
VDDA
VREFHIA
ADCINA5
ADCINA4
ADCINA3
ADCINA2
ADCINA1
ADCINA0
ADCIN14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
GPIO68
GPIO69
GPIO70
GPIO71
VDD
VDDIO
GPIO72
GPIO73
GPIO74
GPIO75
GPIO76
GPIO77
GPIO78
GPIO79
VDDIO
GPIO80
GPIO81
GPIO82
GPIO83
VDDIO
VDD
GPIO84
GPIO85
GPIO86
GPIO87
VDD
VDDIO
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
VDDIO
VDD
GPIO88
GPIO89
GPIO90
GPIO91
GPIO92
GPIO93
GPIO94
A. Only the GPIO function is shown on GPIO pins. See Section 6.2.1 for the complete, muxed signal name.
Figure 6-1. 176-Pin PTP PowerPAD Thermally Enhanced Low-Profile Quad Flatpack (Top View)
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GPIO60
GPIO59
GPIO58
GPIO41
54
53
52
51
56
55
GPIO62
GPIO61
VDDIO
57
GPIO64
GPIO63
59
58
GPIO66
GPIO65
60
VDDIO
62
61
VREGENZ
VDD
64
63
X2
VDDOSC
66
X1
VSSOSC
65
XRS
69
68
67
VDD
VDDOSC
71
72
70
GPIO43
GPIO42
VDDIO
73
GPIO69
74
75
SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
GPIO70
76
50
TCK
GPIO71
VDD
77
49
TMS
78
48
TRST
VDDIO
79
47
TDO
GPIO72
80
46
GPIO73
81
45
TDI
VDD
GPIO78
VDDIO
82
44
VDDIO
83
43
FLT2
VDD
84
42
GPIO84
85
41
FLT1
VDD3VFL
GPIO85
86
40
VDDIO
GPIO86
87
39
VDD
GPIO87
VDD
88
38
VDDA
89
37
VREFHIB
21
22
23
24
25
ADCINA4
ADCINA3
ADCINA2
ADCINA1
ADCINA0
19
20
VREFHIA
ADCINA5
17
3
GPIO12
18
2
GPIO11
VDDIO
VDDA
ADCIN14
VSSA/VREFLOA
26
16
100
VDD
ADCIN15
GPIO10
15
27
14
99
GPIO99
VDDIO
ADCINB0
GPIO92
12
28
13
98
GPIO21
ADCINB1
GPIO91
GPIO20
29
11
97
10
ADCINB2
GPIO90
GPIO19
ADCINB3
30
9
31
GPIO89
95
96
GPIO18
VDDIO
ADCINB4
VDD
7
32
8
ADCINB5
94
GPIO16
VREFLOB
33
GPIO17
34
93
6
92
GPIO4
VDDIO
GPIO15
GPIO3
4
VSSA
5
VSSA
35
GPIO14
36
91
GPIO13
90
1
VDDIO
GPIO2
A. Only the GPIO function is shown on GPIO pins. See Section 6.2.1 for the complete, muxed signal name.
Figure 6-2. 100-Pin PZP PowerPAD HTQFP (Top View)
Note
The exposed lead frame die pad of the PowerPAD™ package serves two functions: to remove heat
from the die and to provide ground path for the digital ground (analog ground is provided through
dedicated pins). Thus, the PowerPAD should be soldered to the ground (GND) plane of the PCB
because this will provide both the digital ground path and good thermal conduction path. To make
optimum use of the thermal efficiencies designed into the PowerPAD package, the PCB must be
designed with this technology in mind. A thermal land is required on the surface of the PCB directly
underneath the body of the PowerPAD. The thermal land should be soldered to the exposed lead
frame die pad of the PowerPAD package; the thermal land should be as large as needed to dissipate
the required heat. An array of thermal vias should be used to connect the thermal pad to the internal
GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more details on using
the PowerPAD package.
8
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Note
PCB footprints and schematic symbols are available for download in a vendor-neutral format, which
can be exported to the leading EDA CAD/CAE design tools. See the CAD/CAE Symbols section in the
product folder for each device, under the Packaging section. These footprints and symbols can also
be searched for at http://webench.ti.com/cad/.
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6.2 Signal Descriptions
Section 6.2.1 describes the signals. The GPIO function is the default at reset, unless otherwise mentioned. The
peripheral signals that are listed under them are alternate functions. Some peripheral functions may not be
available in all devices. See Table 5-1 for details. All GPIO pins are I/O/Z and have an internal pullup, which can
be selectively enabled or disabled on a per-pin basis. This feature only applies to the GPIO pins. The pullups are
not enabled at reset.
6.2.1 Signal Descriptions
TERMINAL
NAME
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
ADC, DAC, AND COMPARATOR SIGNALS
VREFHIA
VREFHIB
37
53
19
37
I
ADC-A high reference. This voltage must be driven into the
pin from external circuitry. Place at least a 1-µF capacitor on
this pin. This capacitor should be placed as close to the
device as possible between the VREFHIA and VREFLOA pins.
NOTE: Do not load this pin externally.
I
ADC-B high reference. This voltage must be driven into the
pin from external circuitry. Place at least a 1-µF capacitor on
this pin. This capacitor should be placed as close to the
device as possible between the VREFHIB and VREFLOB pins.
NOTE: Do not load this pin externally.
VREFHID
55
–
I
ADC-D high reference. This voltage must be driven into the
pin from external circuitry. Place at least a 1-µF capacitor on
this pin. This capacitor should be placed as close to the
device as possible between the VREFHID and VREFLOD pins.
NOTE: Do not load this pin externally.
VREFLOA
33
17
I
ADC-A low reference.
On the PZP package, pin 17 is double-bonded to VSSA and
VREFLOA. On the PZP package, pin 17 must be connected to
VSSA on the system board.
VREFLOB
50
34
I
ADC-B low reference
VREFLOD
51
–
I
ADC-D low reference
I
Input 14 to all ADCs. This pin can be used as a generalpurpose ADCIN pin or it can be used to calibrate all ADCs
together from an external reference.
CMPIN4P
I
Comparator 4 positive input
ADCIN15
I
Input 15 to all ADCs. This pin can be used as a generalpurpose ADCIN pin or it can be used to calibrate all ADCs
together from an external reference.
CMPIN4N
I
Comparator 4 negative input
ADCINA0
I
ADC-A input 0. There is a 50-kΩ internal pulldown on this pin
in both an ADC input or DAC output mode which cannot be
disabled.
DACOUTA
O
DAC-A output
ADCINA1
I
ADC-A input 1. There is a 50-kΩ internal pulldown on this pin
in both an ADC input or DAC output mode which cannot be
disabled.
DACOUTB
O
DAC-B output
ADCINA2
I
ADC-A input 2
I
Comparator 1 positive input
I
ADC-A input 3
I
Comparator 1 negative input
ADCIN14
44
45
43
42
CMPIN1P
ADCINA3
CMPIN1N
ADCINA4
CMPIN2P
10
41
40
39
26
27
25
24
23
22
21
I
ADC-A input 4
I
Comparator 2 positive input
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TERMINAL
NAME
MUX
POSITION
ADCINA5
CMPIN2N
PTP
PIN
NO.
PZP
PIN
NO.
38
20
ADCINB0
46
VDAC
28
ADCINB1
47
DESCRIPTION
I
ADC-A input 5
I
Comparator 2 negative input
I
ADC-B input 0. There is a 100-pF capacitor to VSSA on this pin
in both ADC input or DAC reference mode which cannot be
disabled. If this pin is being used as a reference for the onchip DACs, place at least a 1-µF capacitor on this pin.
I
Optional external reference voltage for on-chip DACs. There is
a 100-pF capacitor to VSSA on this pin in both ADC input or
DAC reference mode which cannot be disabled. If this pin is
being used as a reference for the on-chip DACs, place at least
a 1-µF capacitor on this pin.
I
ADC-B input 1. There is a 50-kΩ internal pulldown on this pin
in both an ADC input or DAC output mode which cannot be
disabled.
O
DAC-C output
I
ADC-B input 2
I
Comparator 3 positive input
I
ADC-B input 3
I
Comparator 3 negative input
29
DACOUTC
ADCINB2
(1)
I/O/Z
48
30
49
31
ADCINB4
–
32
I
ADC-B input 4
ADCINB5
–
33
I
ADC-B input 5
CMPIN3P
ADCINB3
CMPIN3N
CMPIN6P
31
–
I
Comparator 6 positive input
CMPIN6N
30
–
I
Comparator 6 negative input
CMPIN5P
29
–
I
Comparator 5 positive input
I
ADC-D input 0
I
Comparator 7 positive input
I
ADC-D input 1
I
Comparator 7 negative input
I
ADC-D input 2
I
Comparator 8 positive input
I
ADC-D input 3
I
Comparator 8 negative input
I
ADC-D input 4
ADCIND0
CMPIN7P
ADCIND1
CMPIN7N
ADCIND2
CMPIN8P
ADCIND3
CMPIN8N
ADCIND4
56
–
57
–
58
–
59
–
60
–
GPIO AND PERIPHERAL SIGNALS
GPIO0
0, 4, 8, 12
I/O
General-purpose input/output 0
O
Enhanced PWM1 output A (HRPWM-capable)
EPWM1A
1
SDAA
6
I/OD
GPIO1
160
–
I2C-A data open-drain bidirectional port
0, 4, 8, 12
I/O
General-purpose input/output 1
EPWM1B
1
O
Enhanced PWM1 output B (HRPWM-capable)
MFSRB
3
I/O
McBSP-B receive frame synch
SCLA
6
I/OD
GPIO2
161
–
I2C-A clock open-drain bidirectional port
0, 4, 8, 12
I/O
General-purpose input/output 2
EPWM2A
1
O
Enhanced PWM2 output A (HRPWM-capable)
OUTPUTXBAR1
5
O
Output 1 of the output XBAR
SDAB
6
162
91
I/OD
I2C-B data open-drain bidirectional port
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TERMINAL
NAME
GPIO3
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 3
EPWM2B
1
O
Enhanced PWM2 output B (HRPWM-capable)
OUTPUTXBAR2
2
O
Output 2 of the output XBAR
MCLKRB
3
I/O
McBSP-B receive clock
OUTPUTXBAR2
5
O
Output 2 of the output XBAR
SCLB
6
I/OD
GPIO4
0, 4, 8, 12
I/O
General-purpose input/output 4
EPWM3A
1
O
Enhanced PWM3 output A (HRPWM-capable)
OUTPUTXBAR3
5
O
Output 3 of the output XBAR
CANTXA
6
O
CAN-A transmit
GPIO5
163
164
92
93
I2C-B clock open-drain bidirectional port
0, 4, 8, 12
I/O
General-purpose input/output 5
EPWM3B
1
O
Enhanced PWM3 output B (HRPWM-capable)
MFSRA
2
I/O
McBSP-A receive frame synch
OUTPUTXBAR3
3
O
Output 3 of the output XBAR
CANRXA
6
I
CAN-A receive
GPIO6
165
–
0, 4, 8, 12
I/O
General-purpose input/output 6
EPWM4A
1
O
Enhanced PWM4 output A (HRPWM-capable)
OUTPUTXBAR4
2
O
Output 4 of the output XBAR
EXTSYNCOUT
3
O
External ePWM synch pulse output
EQEP3A
5
I
Enhanced QEP3 input A
6
O
CAN-B transmit
0, 4, 8, 12
I/O
General-purpose input/output 7
CANTXB
GPIO7
166
–
EPWM4B
1
O
Enhanced PWM4 output B (HRPWM-capable)
MCLKRA
2
I/O
McBSP-A receive clock
OUTPUTXBAR5
3
O
Output 5 of the output XBAR
EQEP3B
5
I
Enhanced QEP3 input B
CANRXB
6
I
CAN-B receive
GPIO8
167
–
0, 4, 8, 12
I/O
General-purpose input/output 8
EPWM5A
1
O
Enhanced PWM5 output A (HRPWM-capable)
CANTXB
2
O
CAN-B transmit
ADCSOCAO
3
O
ADC start-of-conversion A output for external ADC
EQEP3S
5
I/O
Enhanced QEP3 strobe
SCITXDA
18
–
6
O
SCI-A transmit data
0, 4, 8, 12
I/O
General-purpose input/output 9
EPWM5B
1
O
Enhanced PWM5 output B (HRPWM-capable)
SCITXDB
2
O
SCI-B transmit data
OUTPUTXBAR6
3
O
Output 6 of the output XBAR
EQEP3I
5
I/O
Enhanced QEP3 index
SCIRXDA
6
I
GPIO9
GPIO10
19
–
SCI-A receive data
0, 4, 8, 12
I/O
General-purpose input/output 10
EPWM6A
1
O
Enhanced PWM6 output A (HRPWM-capable)
CANRXB
2
ADCSOCBO
3
EQEP1A
SCITXDB
12
I
CAN-B receive
O
ADC start-of-conversion B output for external ADC
5
I
Enhanced QEP1 input A
6
O
SCI-B transmit data
1
100
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
GPIO11
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 11
EPWM6B
1
O
Enhanced PWM6 output B (HRPWM-capable)
SCIRXDB
2, 6
I
SCI-B receive data
2
1
OUTPUTXBAR7
3
O
Output 7 of the output XBAR
EQEP1B
5
I
Enhanced QEP1 input B
GPIO12
0, 4, 8, 12
I/O
EPWM7A
1
O
Enhanced PWM7 output A (HRPWM-capable)
CANTXB
2
O
CAN-B transmit
MDXB
3
EQEP1S
5
SCITXDC
4
3
General-purpose input/output 12
O
McBSP-B transmit serial data
I/O
Enhanced QEP1 strobe
6
O
SCI-C transmit data
0, 4, 8, 12
I/O
General-purpose input/output 13
EPWM7B
1
O
Enhanced PWM7 output B (HRPWM-capable)
CANRXB
2
I
CAN-B receive
MDRB
3
I
McBSP-B receive serial data
EQEP1I
5
I/O
SCIRXDC
6
I
GPIO13
GPIO14
5
4
Enhanced QEP1 index
SCI-C receive data
0, 4, 8, 12
I/O
General-purpose input/output 14
EPWM8A
1
O
Enhanced PWM8 output A (HRPWM-capable)
SCITXDB
2
O
SCI-B transmit data
MCLKXB
3
I/O
McBSP-B transmit clock
OUTPUTXBAR3
6
O
Output 3 of the output XBAR
GPIO15
6
5
0, 4, 8, 12
I/O
General-purpose input/output 15
EPWM8B
1
O
Enhanced PWM8 output B (HRPWM-capable)
SCIRXDB
2
I
SCI-B receive data
MFSXB
3
I/O
McBSP-B transmit frame synch
OUTPUTXBAR4
6
O
Output 4 of the output XBAR
GPIO16
7
6
0, 4, 8, 12
I/O
General-purpose input/output 16
SPISIMOA
1
I/O
SPI-A slave in, master out
CANTXB
2
O
CAN-B transmit
OUTPUTXBAR7
3
O
Output 7 of the output XBAR
EPWM9A
5
O
Enhanced PWM9 output A
Sigma-Delta 1 channel 1 data input
8
7
SD1_D1
7
I
GPIO17
0, 4, 8, 12
I/O
SPISOMIA
1
I/O
CANRXB
2
I
CAN-B receive
OUTPUTXBAR8
3
O
Output 8 of the output XBAR
EPWM9B
5
O
Enhanced PWM9 output B
SD1_C1
7
I
Sigma-Delta 1 channel 1 clock input
GPIO18
0, 4, 8, 12
I/O
General-purpose input/output 18
1
I/O
SPI-A clock
O
SCI-B transmit data
I
CAN-A receive
SPICLKA
9
8
General-purpose input/output 17
SPI-A slave out, master in
SCITXDB
2
CANRXA
3
EPWM10A
5
O
Enhanced PWM10 output A
SD1_D2
7
I
Sigma-Delta 1 channel 2 data input
10
9
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
GPIO19
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 19
SPISTEA
1
I/O
SPI-A slave transmit enable
SCIRXDB
2
I
SCI-B receive data
CANTXA
3
O
CAN-A transmit
EPWM10B
5
O
Enhanced PWM10 output B
Sigma-Delta 1 channel 2 clock input
12
11
SD1_C2
7
I
GPIO20
0, 4, 8, 12
I/O
EQEP1A
1
I
Enhanced QEP1 input A
MDXA
2
O
McBSP-A transmit serial data
CANTXB
3
O
CAN-B transmit
13
12
General-purpose input/output 20
EPWM11A
5
O
Enhanced PWM11 output A
SD1_D3
7
I
Sigma-Delta 1 channel 3 data input
GPIO21
0, 4, 8, 12
I/O
EQEP1B
1
I
Enhanced QEP1 input B
MDRA
2
I
McBSP-A receive serial data
CANRXB
3
EPWM11B
5
14
13
General-purpose input/output 21
I
CAN-B receive
O
Enhanced PWM11 output B
Sigma-Delta 1 channel 3 clock input
SD1_C3
7
I
GPIO22
0, 4, 8, 12
I/O
General-purpose input/output 22
EQEP1S
1
I/O
Enhanced QEP1 strobe
MCLKXA
2
SCITXDB
3
EPWM12A
SPICLKB
I/O
McBSP-A transmit clock
O
SCI-B transmit data
5
O
Enhanced PWM12 output A
6
I/O
SPI-B clock
SD1_D4
7
I
GPIO23
0, 4, 8, 12
I/O
General-purpose input/output 23
EQEP1I
1
I/O
Enhanced QEP1 index
MFSXA
2
SCIRXDB
3
EPWM12B
SPISTEB
22
–
I/O
SCI-B receive data
5
O
Enhanced PWM12 output B
6
I/O
SPI-B slave transmit enable
SD1_C4
7
I
GPIO24
0, 4, 8, 12
I/O
General-purpose input/output 24
1
O
Output 1 of the output XBAR
EQEP2A
2
MDXB
3
SPISIMOB
6
24
–
McBSP-A transmit frame synch
I
OUTPUTXBAR1
23
Sigma-Delta 1 channel 4 data input
–
Sigma-Delta 1 channel 4 clock input
I
Enhanced QEP2 input A
O
McBSP-B transmit serial data
I/O
SPI-B slave in, master out
SD2_D1
7
I
GPIO25
0, 4, 8, 12
I/O
General-purpose input/output 25
OUTPUTXBAR2
1
O
Output 2 of the output XBAR
EQEP2B
2
I
Enhanced QEP2 input B
MDRB
3
I
McBSP-B receive serial data
SPISOMIB
6
I/O
SD2_C1
7
I
14
25
–
Sigma-Delta 2 channel 1 data input
SPI-B slave out, master in
Sigma-Delta 2 channel 1 clock input
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TERMINAL
NAME
GPIO26
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 26
OUTPUTXBAR3
1
O
Output 3 of the output XBAR
EQEP2I
2
I/O
Enhanced QEP2 index
MCLKXB
3
I/O
McBSP-B transmit clock
OUTPUTXBAR3
5
O
Output 3 of the output XBAR
SPICLKB
6
I/O
SPI-B clock
SD2_D2
7
I
GPIO27
0, 4, 8, 12
I/O
General-purpose input/output 27
27
–
Sigma-Delta 2 channel 2 data input
OUTPUTXBAR4
1
O
Output 4 of the output XBAR
EQEP2S
2
I/O
Enhanced QEP2 strobe
MFSXB
3
I/O
McBSP-B transmit frame synch
OUTPUTXBAR4
5
O
Output 4 of the output XBAR
SPISTEB
6
I/O
SPI-B slave transmit enable
28
–
SD2_C2
7
I
GPIO28
0, 4, 8, 12
I/O
Sigma-Delta 2 channel 2 clock input
General-purpose input/output 28
SCIRXDA
1
I
SCI-A receive data
EM1CS4
2
O
External memory interface 1 chip select 4
OUTPUTXBAR5
5
O
Output 5 of the output XBAR
EQEP3A
6
I
Enhanced QEP3 input A
SD2_D3
7
I
Sigma-Delta 2 channel 3 data input
GPIO29
0, 4, 8, 12
I/O
General-purpose input/output 29
1
O
SCI-A transmit data
SCITXDA
EM1SDCKE
2
OUTPUTXBAR6
5
EQEP3B
6
64
65
–
–
O
External memory interface 1 SDRAM clock enable
O
Output 6 of the output XBAR
I
Enhanced QEP3 input B
SD2_C3
7
I
GPIO30
0, 4, 8, 12
I/O
Sigma-Delta 2 channel 3 clock input
General-purpose input/output 30
CANRXA
1
I
CAN-A receive
EM1CLK
2
O
External memory interface 1 clock
OUTPUTXBAR7
5
O
Output 7 of the output XBAR
EQEP3S
6
I/O
Enhanced QEP3 strobe
SD2_D4
7
I
GPIO31
0, 4, 8, 12
I/O
General-purpose input/output 31
CANTXA
1
O
CAN-A transmit
EM1WE
2
O
External memory interface 1 write enable
OUTPUTXBAR8
5
O
Output 8 of the output XBAR
EQEP3I
6
I/O
Enhanced QEP3 index
63
66
–
–
SD2_C4
7
I
GPIO32
0, 4, 8, 12
I/O
SDAA
1
EM1CS0
2
GPIO33
0, 4, 8, 12
SCLA
1
EM1RNW
2
67
69
–
–
I/OD
Sigma-Delta 2 channel 4 data input
Sigma-Delta 2 channel 4 clock input
General-purpose input/output 32
I2C-A data open-drain bidirectional port
O
External memory interface 1 chip select 0
I/O
General-purpose input/output 33
I/OD
O
I2C-A clock open-drain bidirectional port
External memory interface 1 read not write
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
GPIO34
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 34
OUTPUTXBAR1
1
O
Output 1 of the output XBAR
EM1CS2
2
O
External memory interface 1 chip select 2
SDAB
GPIO35
–
6
I/OD
0, 4, 8, 12
I/O
SCIRXDA
1
EM1CS3
2
SCLB
GPIO36
70
I2C-B data open-drain bidirectional port
General-purpose input/output 35
I
SCI-A receive data
O
External memory interface 1 chip select 3
6
I/OD
I2C-B clock open-drain bidirectional port
71
–
0, 4, 8, 12
I/O
General-purpose input/output 36
SCITXDA
1
O
SCI-A transmit data
EM1WAIT
2
I
External memory interface 1 Asynchronous SRAM WAIT
CANRXA
6
I
CAN-A receive
GPIO37
83
–
0, 4, 8, 12
I/O
General-purpose input/output 37
OUTPUTXBAR2
1
O
Output 2 of the output XBAR
EM1OE
2
O
External memory interface 1 output enable
84
–
CANTXA
6
O
CAN-A transmit
GPIO38
0, 4, 8, 12
I/O
General-purpose input/output 38
EM1A0
2
O
External memory interface 1 address line 0
SCITXDC
5
O
SCI-C transmit data
85
–
CANTXB
6
O
CAN-B transmit
GPIO39
0, 4, 8, 12
I/O
General-purpose input/output 39
EM1A1
2
O
External memory interface 1 address line 1
SCIRXDC
5
I
SCI-C receive data
CANRXB
6
I
CAN-B receive
GPIO40
0, 4, 8, 12
EM1A2
2
SDAB
GPIO41
86
87
–
–
I/O
General-purpose input/output 40
O
External memory interface 1 address line 2
6
I/OD
0, 4, 8, 12
I/O
General-purpose input/output 41. For applications using the
Hibernate low-power mode, this pin serves as the
GPIOHIBWAKE signal. For details, see the Low Power Modes
section of the System Control chapter in the TMS320F2807x
Microcontrollers Technical Reference Manual.
External memory interface 1 address line 3
89
51
EM1A3
2
O
SCLB
6
I/OD
GPIO42
0, 4, 8, 12
I/O
6
I/OD
SDAA
SCITXDA
15
USB0DM
Analog
GPIO43
130
73
General-purpose input/output 42
I2C-A data open-drain bidirectional port
O
SCI-A transmit data
USB PHY differential data
General-purpose input/output 43
0, 4, 8, 12
I/O
6
I/OD
SCIRXDA
15
74
I2C-B clock open-drain bidirectional port
I/O
SCLA
131
I2C-B data open-drain bidirectional port
I
I2C-A clock open-drain bidirectional port
SCI-A receive data
USB0DP
Analog
I/O
USB PHY differential data
GPIO44
0, 4, 8, 12
I/O
General-purpose input/output 44
EM1A4
2
GPIO45
0, 4, 8, 12
EM1A5
2
16
113
115
–
–
O
External memory interface 1 address line 4
I/O
General-purpose input/output 45
O
External memory interface 1 address line 5
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
MUX
POSITION
GPIO46
0, 4, 8, 12
EM1A6
2
SCIRXDD
6
GPIO47
0, 4, 8, 12
EM1A7
2
SCITXDD
GPIO48
PTP
PIN
NO.
PZP
PIN
NO.
128
–
(1)
I/O/Z
DESCRIPTION
I/O
General-purpose input/output 46
O
External memory interface 1 address line 6
I
SCI-D receive data
I/O
General-purpose input/output 47
O
External memory interface 1 address line 7
6
O
SCI-D transmit data
0, 4, 8, 12
I/O
General-purpose input/output 48
O
Output 3 of the output XBAR
O
External memory interface 1 address line 8
O
SCI-A transmit data
Sigma-Delta 1 channel 1 data input
OUTPUTXBAR3
1
EM1A8
2
SCITXDA
6
129
90
–
–
SD1_D1
7
I
GPIO49
0, 4, 8, 12
I/O
General-purpose input/output 49
O
Output 4 of the output XBAR
O
External memory interface 1 address line 9
I
SCI-A receive data
Sigma-Delta 1 channel 1 clock input
OUTPUTXBAR4
1
EM1A9
2
SCIRXDA
6
93
–
SD1_C1
7
I
GPIO50
0, 4, 8, 12
I/O
EQEP1A
1
EM1A10
2
SPISIMOC
6
I/O
SD1_D2
7
I
GPIO51
0, 4, 8, 12
I/O
EQEP1B
1
EM1A11
2
SPISOMIC
SD1_C2
94
–
General-purpose input/output 50
I
Enhanced QEP1 input A
O
External memory interface 1 address line 10
SPI-C slave in, master out
Sigma-Delta 1 channel 2 data input
General-purpose input/output 51
I
Enhanced QEP1 input B
O
External memory interface 1 address line 11
6
I/O
SPI-C slave out, master in
7
I
GPIO52
0, 4, 8, 12
I/O
General-purpose input/output 52
EQEP1S
1
I/O
Enhanced QEP1 strobe
EM1A12
2
O
External memory interface 1 address line 12
SPICLKC
6
I/O
SPI-C clock
SD1_D3
7
I
GPIO53
0, 4, 8, 12
I/O
General-purpose input/output 53
EQEP1I
1
I/O
Enhanced QEP1 index
EM1D31
2
I/O
External memory interface 1 data line 31
SPISTEC
6
I/O
SPI-C slave transmit enable
SD1_C3
7
I
GPIO54
95
96
97
–
–
–
Sigma-Delta 1 channel 2 clock input
Sigma-Delta 1 channel 3 data input
Sigma-Delta 1 channel 3 clock input
0, 4, 8, 12
I/O
General-purpose input/output 54
SPISIMOA
1
I/O
SPI-A slave in, master out
EM1D30
2
I/O
External memory interface 1 data line 30
98
–
EQEP2A
5
I
Enhanced QEP2 input A
SCITXDB
6
O
SCI-B transmit data
SD1_D4
7
I
Sigma-Delta 1 channel 4 data input
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
GPIO55
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
0, 4, 8, 12
I/O
General-purpose input/output 55
SPISOMIA
1
I/O
SPI-A slave out, master in
EM1D29
2
I/O
External memory interface 1 data line 29
EQEP2B
5
SCIRXDB
6
100
–
I
Enhanced QEP2 input B
I
SCI-B receive data
SD1_C4
7
I
GPIO56
0, 4, 8, 12
I/O
General-purpose input/output 56
1
I/O
SPI-A clock
SPICLKA
EM1D28
2
EQEP2S
5
SCITXDC
SD2_D1
GPIO57
Sigma-Delta 1 channel 4 clock input
I/O
External memory interface 1 data line 28
I/O
Enhanced QEP2 strobe
6
O
SCI-C transmit data
7
I
Sigma-Delta 2 channel 1 data input
101
–
0, 4, 8, 12
I/O
General-purpose input/output 57
SPISTEA
1
I/O
SPI-A slave transmit enable
EM1D27
2
I/O
External memory interface 1 data line 27
EQEP2I
5
I/O
Enhanced QEP2 index
SCIRXDC
6
102
–
I
SCI-C receive data
Sigma-Delta 2 channel 1 clock input
SD2_C1
7
I
GPIO58
0, 4, 8, 12
I/O
General-purpose input/output 58
MCLKRA
1
I/O
McBSP-A receive clock
EM1D26
2
I/O
External memory interface 1 data line 26
OUTPUTXBAR1
5
O
Output 1 of the output XBAR
SPICLKB
6
I/O
SPI-B clock
SD2_D2
7
I
SPISIMOA
15
I/O
SPI-A slave in, master out
GPIO59
0, 4, 8, 12
I/O
General-purpose input/output 59
MFSRA
1
I/O
McBSP-A receive frame synch
EM1D25
2
I/O
External memory interface 1 data line 25
OUTPUTXBAR2
5
O
Output 2 of the output XBAR
SPISTEB
6
I/O
SPI-B slave transmit enable
SD2_C2
7
I
SPISOMIA
15
I/O
SPI-A slave out, master in
GPIO60
0, 4, 8, 12
I/O
General-purpose input/output 60
MCLKRB
1
I/O
McBSP-B receive clock
EM1D24
2
I/O
External memory interface 1 data line 24
OUTPUTXBAR3
5
O
Output 3 of the output XBAR
SPISIMOB
6
I/O
SPI-B slave in, master out
103
104
105
52
53
54
SD2_D3
7
I
SPICLKA
15
I/O
18
Sigma-Delta 2 channel 2 data input
(2)
(3)
Sigma-Delta 2 channel 2 clock input
(2)
Sigma-Delta 2 channel 3 data input
(2)
SPI-A clock
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
(3)
GPIO61
0, 4, 8, 12
I/O
General-purpose input/output 61
MFSRB
1
I/O
McBSP-B receive frame synch
EM1D23
2
I/O
External memory interface 1 data line 23
OUTPUTXBAR4
5
O
Output 4 of the output XBAR
SPISOMIB
6
I/O
SPI-B slave out, master in
107
56
SD2_C3
7
I
SPISTEA
15
I/O
SPI-A slave transmit enable
0, 4, 8, 12
I/O
General-purpose input/output 62
GPIO62
SCIRXDC
1
I
EM1D22
2
I/O
108
57
Sigma-Delta 2 channel 3 clock input
(2)
SCI-C receive data
External memory interface 1 data line 22
EQEP3A
5
I
Enhanced QEP3 input A
CANRXA
6
I
CAN-A receive
SD2_D4
7
I
Sigma-Delta 2 channel 4 data input
GPIO63
0, 4, 8, 12
I/O
General-purpose input/output 63
1
O
SCI-C transmit data
SCITXDC
EM1D21
2
EQEP3B
5
CANTXA
SD2_C4
SPISIMOB
I/O
External memory interface 1 data line 21
I
Enhanced QEP3 input B
6
O
CAN-A transmit
7
I
15
I/O
SPI-B slave in, master out
GPIO64
0, 4, 8, 12
I/O
General-purpose input/output 64
EM1D20
2
I/O
External memory interface 1 data line 20
EQEP3S
5
I/O
Enhanced QEP3 strobe
SCIRXDA
6
I
SPISOMIB
15
I/O
SPI-B slave out, master in
GPIO65
0, 4, 8, 12
I/O
General-purpose input/output 65
EM1D19
2
I/O
External memory interface 1 data line 19
EQEP3I
5
I/O
Enhanced QEP3 index
SCITXDA
6
O
SCI-A transmit data
SPICLKB
15
I/O
SPI-B clock
GPIO66
0, 4, 8, 12
I/O
General-purpose input/output 66
EM1D18
2
I/O
External memory interface 1 data line 18
I/OD
I2C-B data open-drain bidirectional port
SDAB
6
SPISTEB
15
GPIO67
0, 4, 8, 12
EM1D17
2
GPIO68
0, 4, 8, 12
EM1D16
2
GPIO69
0, 4, 8, 12
EM1D15
2
SCLB
6
SPISIMOC
15
109
110
111
112
58
59
60
61
132
–
133
–
134
75
Sigma-Delta 2 channel 4 clock input
(2)
(3)
SCI-A receive data
(2)
(2)
(3)
(2)
I/O
SPI-B slave transmit enable
I/O
General-purpose input/output 67
I/O
External memory interface 1 data line 17
I/O
General-purpose input/output 68
I/O
External memory interface 1 data line 16
I/O
General-purpose input/output 69
I/O
External memory interface 1 data line 15
I/OD
I2C-B clock open-drain bidirectional port
I/O
(2)
SPI-C slave in, master out
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
MUX
POSITION
GPIO70
0, 4, 8, 12
EM1D14
2
CANRXA
5
PTP
PIN
NO.
135
PZP
PIN
NO.
76
(1)
I/O/Z
DESCRIPTION
(3)
I/O
General-purpose input/output 70
I/O
External memory interface 1 data line 14
I
CAN-A receive
SCITXDB
6
O
SCI-B transmit data
SPISOMIC
15
I/O
SPI-C slave out, master in
GPIO71
0, 4, 8, 12
I/O
General-purpose input/output 71
EM1D13
2
I/O
External memory interface 1 data line 13
CANTXA
5
O
CAN-A transmit
SCI-B receive data
136
77
(2)
SCIRXDB
6
I
SPICLKC
15
I/O
SPI-C clock
0, 4, 8, 12
I/O
General-purpose input/output 72. This is the factory default
boot mode select pin 1.
I/O
External memory interface 1 data line 12
O
CAN-B transmit
GPIO72
(2)
(3)
EM1D12
2
CANTXB
5
SCITXDC
6
O
SCI-C transmit data
SPISTEC
15
I/O
SPI-C slave transmit enable
GPIO73
0, 4, 8, 12
I/O
General-purpose input/output 73
EM1D11
2
I/O
External memory interface 1 data line 11
XCLKOUT
3
O/Z
External clock output. This pin outputs a divided-down version
of a chosen clock signal from within the device. The clock
signal is chosen using the CLKSRCCTL3.XCLKOUTSEL bit
field while the divide ratio is chosen using the
XCLKOUTDIVSEL.XCLKOUTDIV bit field.
139
140
80
81
CANRXB
5
I
CAN-B receive
SCIRXDC
6
I
SCI-C receive
GPIO74
0, 4, 8, 12
EM1D10
2
GPIO75
0, 4, 8, 12
EM1D9
2
GPIO76
0, 4, 8, 12
EM1D8
2
SCITXDD
141
–
142
–
143
–
(2)
I/O
General-purpose input/output 74
I/O
External memory interface 1 data line 10
I/O
General-purpose input/output 75
I/O
External memory interface 1 data line 9
I/O
General-purpose input/output 76
I/O
External memory interface 1 data line 8
6
O
SCI-D transmit data
GPIO77
0, 4, 8, 12
I/O
General-purpose input/output 77
EM1D7
2
I/O
External memory interface 1 data line 7
SCIRXDD
144
–
6
I
GPIO78
0, 4, 8, 12
I/O
General-purpose input/output 78
EM1D6
2
I/O
External memory interface 1 data line 6
EQEP2A
6
GPIO79
0, 4, 8, 12
EM1D5
2
EQEP2B
6
GPIO80
0, 4, 8, 12
EM1D4
2
EQEP2S
6
20
145
82
I
146
–
–
Enhanced QEP2 input A
I/O
General-purpose input/output 79
I/O
External memory interface 1 data line 5
I
148
SCI-D receive data
Enhanced QEP2 input B
I/O
General-purpose input/output 80
I/O
External memory interface 1 data line 4
I/O
Enhanced QEP2 strobe
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
MUX
POSITION
GPIO81
0, 4, 8, 12
EM1D3
2
EQEP2I
6
GPIO82
0, 4, 8, 12
EM1D2
2
GPIO83
0, 4, 8, 12
EM1D1
2
GPIO84
0, 4, 8, 12
SCITXDA
5
PTP
PIN
NO.
PZP
PIN
NO.
149
–
150
–
151
–
154
85
(1)
I/O/Z
DESCRIPTION
I/O
General-purpose input/output 81
I/O
External memory interface 1 data line 3
I/O
Enhanced QEP2 index
I/O
General-purpose input/output 82
I/O
External memory interface 1 data line 2
I/O
General-purpose input/output 83
I/O
External memory interface 1 data line 1
I/O
General-purpose input/output 84. This is the factory default
boot mode select pin 0.
O
SCI-A transmit data
MDXB
6
O
McBSP-B transmit serial data
MDXA
15
O
McBSP-A transmit serial data
GPIO85
0, 4, 8, 12
I/O
General-purpose input/output 85
EM1D0
2
I/O
External memory interface 1 data line 0
SCIRXDA
5
I
SCI-A receive data
MDRB
6
I
McBSP-B receive serial data
MDRA
15
I
McBSP-A receive serial data
GPIO86
0, 4, 8, 12
I/O
General-purpose input/output 86
EM1A13
2
O
External memory interface 1 address line 13
EM1CAS
3
O
External memory interface 1 column address strobe
SCITXDB
5
O
SCI-B transmit data
MCLKXB
6
I/O
McBSP-B transmit clock
MCLKXA
15
I/O
McBSP-A transmit clock
GPIO87
0, 4, 8, 12
I/O
General-purpose input/output 87
EM1A14
2
O
External memory interface 1 address line 14
EM1RAS
3
O
External memory interface 1 row address strobe
SCIRXDB
5
I
SCI-B receive data
MFSXB
6
I/O
McBSP-B transmit frame synch
MFSXA
15
I/O
McBSP-A transmit frame synch
GPIO88
0, 4, 8, 12
I/O
General-purpose input/output 88
EM1A15
2
O
External memory interface 1 address line 15
EM1DQM0
155
156
157
170
86
87
88
–
3
O
External memory interface 1 Input/output mask for byte 0
GPIO89
0, 4, 8, 12
I/O
General-purpose input/output 89
EM1A16
2
O
External memory interface 1 address line 16
EM1DQM1
3
O
External memory interface 1 Input/output mask for byte 1
SCITXDC
6
O
SCI-C transmit data
GPIO90
0, 4, 8, 12
I/O
General-purpose input/output 90
EM1A17
2
O
External memory interface 1 address line 17
EM1DQM2
3
O
External memory interface 1 Input/output mask for byte 2
SCIRXDC
6
I
SCI-C receive data
GPIO91
0, 4, 8, 12
I/O
General-purpose input/output 91
EM1A18
2
O
External memory interface 1 address line 18
EM1DQM3
3
O
External memory interface 1 Input/output mask for byte 3
SDAA
6
171
172
173
96
97
98
I/OD
I2C-A data open-drain bidirectional port
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
NAME
MUX
POSITION
PTP
PIN
NO.
PZP
PIN
NO.
(1)
I/O/Z
DESCRIPTION
GPIO92
0, 4, 8, 12
I/O
General-purpose input/output 92
EM1A19
2
O
External memory interface 1 address line 19
EM1BA1
3
O
External memory interface 1 bank address 1
SCLA
174
99
6
I/OD
GPIO93
0, 4, 8, 12
I/O
General-purpose input/output 93
EM1BA0
3
O
External memory interface 1 bank address 0
SCITXDD
6
O
SCI-D transmit data
I/O
General-purpose input/output 94
GPIO94
0, 4, 8, 12
SCIRXDD
GPIO99
6
0, 4, 8, 12
EQEP1I
GPIO133/AUXCLKIN
5
175
176
17
–
–
14
0, 4, 8, 12
118
SD2_C2
I
SCI-D receive data
I/O
General-purpose input/output 99
I/O
Enhanced QEP1 index
I/O
General-purpose input/output 133. The AUXCLKIN function of
this GPIO pin could be used to provide a single-ended 3.3-V
level clock signal to the Auxiliary Phase-Locked Loop
(AUXPLL), whose output is used for the USB module. The
AUXCLKIN clock may also be used for the CAN module.
–
7
I2C-A clock open-drain bidirectional port
I
Sigma-Delta 2 channel 2 clock input
RESET
XRS
124
69
I/OD
Device Reset (in) and Watchdog Reset (out). The devices
have a built-in power-on reset (POR) circuit. During a poweron condition, this pin is driven low by the device. An external
circuit may also drive this pin to assert a device reset. This pin
is also driven low by the MCU when a watchdog reset or NMI
watchdog reset occurs. During watchdog reset, the XRS pin is
driven low for the watchdog reset duration of 512 OSCCLK
cycles. A resistor with a value from 2.2 kΩ to 10 kΩ should be
placed between XRS and VDDIO. If a capacitor is placed
between XRS and VSS for noise filtering, it should be 100 nF
or smaller. These values will allow the watchdog to properly
drive the XRS pin to VOL within 512 OSCCLK cycles when the
watchdog reset is asserted. The output buffer of this pin is an
open drain with an internal pullup. If this pin is driven by an
external device, it should be done using an open-drain device.
CLOCKS
X1
123
68
I
On-chip crystal-oscillator input. To use this oscillator, a quartz
crystal must be connected across X1 and X2. If this pin is not
used, it must be tied to GND.
This pin can also be used to feed a single-ended 3.3-V level
clock. In this case, X2 is a No Connect (NC).
X2
121
66
O
On-chip crystal-oscillator output. A quartz crystal may be
connected across X1 and X2. If X2 is not used, it must be left
unconnected.
22
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
TERMINAL
PTP
PIN
NO.
PZP
PIN
NO.
TCK
81
50
I
JTAG test clock with internal pullup (see Section 7.6)
TDI
77
46
I
JTAG test data input (TDI) with internal pullup. TDI is clocked
into the selected register (instruction or data) on a rising edge
of TCK.
TDO
78
47
O/Z
JTAG scan out, test data output (TDO). The contents of the
selected register (instruction or data) are shifted out of TDO
(3)
on the falling edge of TCK.
TMS
80
49
I
JTAG test-mode select (TMS) with internal pullup. This serial
control input is clocked into the TAP controller on the rising
edge of TCK.
I
JTAG test reset with internal pulldown. TRST, when driven
high, gives the scan system control of the operations of the
device. If this signal is driven low, the device operates in its
functional mode, and the test reset signals are ignored.
NOTE: TRST must be maintained low at all times during
normal device operation. An external pulldown resistor is
required on this pin. The value of this resistor should be based
on drive strength of the debugger pods applicable to the
design. A 2.2-kΩ or smaller resistor generally offers adequate
protection. The value of the resistor is application-specific. TI
recommends that each target board be validated for proper
operation of the debugger and the application. This pin has an
internal 50-ns (nominal) glitch filter.
NAME
MUX
POSITION
(1)
I/O/Z
DESCRIPTION
JTAG
TRST
79
48
INTERNAL VOLTAGE REGULATOR CONTROL
VREGENZ
119
64
I
Internal voltage regulator enable with internal pulldown. To
enable the 1.2-V VREG, pull low to VSS. To disable, pull high
to VDDIO.
ANALOG, DIGITAL, AND I/O POWER
16
16
21
39
61
45
76
63
117
71
126
78
137
84
153
89
158
95
169
–
VDD3VFL
72
41
35
18
VDDA
36
38
54
–
VDD
1.2-V digital logic power pins. If the internal 1.2-V VREG is
used, place a decoupling capacitor near each VDD pin and
distribute 12 µF to 26 µF evenly across all VDD pins. If an
external supply is used, TI recommends a minimum total
capacitance of 20 µF. The exact value of the decoupling
capacitance should be determined by your system voltage
regulation solution.
3.3-V Flash power pin. Place a minimum 0.1-µF decoupling
capacitor on each pin.
3.3-V analog power pins. Place a minimum 2.2-µF decoupling
capacitor to VSSA on each pin.
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TERMINAL
NAME
MUX
POSITION
VDDIO
VDDOSC
VSS
PTP
PIN
NO.
PZP
PIN
NO.
3
2
11
10
15
15
20
40
26
44
62
55
68
62
75
72
82
79
88
83
91
90
(1)
I/O/Z
DESCRIPTION
3.3-V digital I/O power pins. Place a minimum 0.1-µF
decoupling capacitor on each pin. The exact value of the
decoupling capacitance should be determined by your system
voltage regulation solution.
99
94
106
–
114
–
116
–
127
–
138
–
147
–
152
–
159
–
168
–
120
65
125
70
PWR
PAD
PWR
PAD
Device ground. For Quad Flatpacks (QFPs), the PowerPAD
on the bottom of the package must be soldered to the ground
plane of the PCB.
67
Crystal oscillator (X1 and X2) ground pin. When using an
external crystal, do not connect this pin to the board ground.
Instead, connect it to the ground reference of the external
crystal oscillator circuit.
If an external crystal is not used, this pin may be connected to
the board ground.
VSSOSC
122
32
17
VSSA
34
35
52
36
Power pins for the 3.3-V on-chip crystal oscillator (X1 and X2)
and the two zero-pin internal oscillators (INTOSC). Place a
0.1-μF (minimum) decoupling capacitor on each pin.
Analog ground.
On the PZP package, pin 17 is double-bonded to VSSA and
VREFLOA. This pin must be connect to VSSA.
SPECIAL FUNCTIONS
ERRORSTS
92
–
O
Error status output. This pin has an internal pulldown.
TEST PINS
FLT1
73
42
I/O
Flash test pin 1. Reserved for TI. Must be left unconnected.
FLT2
74
43
I/O
Flash test pin 2. Reserved for TI. Must be left unconnected.
(1)
(2)
(3)
24
I = Input, O = Output, OD = Open Drain, Z = High Impedance
High-Speed SPI-enabled GPIO mux option. This pin mux option is required when using the SPI in High-Speed Mode (HS_MODE = 1
in SPICCR). This mux option is still available when not using the SPI in High-Speed Mode (HS_MODE = 0 in SPICCR).
This pin has output impedance that can be as low as 22 Ω. This output could have fast edges and ringing depending on the system
PCB characteristics. If this is a concern, the user should take precautions such as adding a 39Ω (10% tolerance) series termination
resistor or implement some other termination scheme. It is also recommended that a system-level signal integrity analysis be
performed with the provided IBIS models. The termination is not required if this pin is used for input function.
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6.3 Pins With Internal Pullup and Pulldown
Some pins on the device have internal pullups or pulldowns. Table 6-1 lists the pull direction and when it is
active. The pullups on GPIO pins are disabled by default and can be enabled through software. In order to avoid
any floating unbonded inputs, the Boot ROM will enable internal pullups on GPIO pins that are not bonded out in
a particular package. Other pins noted in Table 6-1 with pullups and pulldowns are always on and cannot be
disabled.
Table 6-1. Pins With Internal Pullup and Pulldown
PIN
GPIOx
TRST
RESET
( XRS = 0)
DEVICE BOOT
APPLICATION SOFTWARE
Pullup disabled
Pullup disabled(1)
Pullup enable is applicationdefined
Pulldown active
TCK
Pullup active
TMS
Pullup active
TDI
Pullup active
XRS
Pullup active
VREGENZ
ERRORSTS
Other pins
(1)
Pulldown active
Pulldown active
No pullup or pulldown present
Pins not bonded out in a given package will have the internal pullups enabled by the Boot ROM.
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6.4 Pin Multiplexing
6.4.1 GPIO Muxed Pins
Table 6-2 shows the GPIO muxed pins. The default for each pin is the GPIO function, secondary functions can
be selected by setting both the GPyGMUXn.GPIOz and GPyMUXn.GPIOz register bits. The GPyGMUXn
register should be configured prior to the GPyMUXn to avoid transient pulses on GPIO's from alternate mux
selections. Columns not shown and blank cells are reserved GPIO Mux settings.
Table 6-2. GPIO Muxed Pins
GPIO Mux Selection(1) (2)
GPIO Index
0, 4, 8, 12
GPyGMUXn.
GPIOz =
00b, 01b,
10b, 11b
GPyMUXn.
GPIOz =
00b
1
2
3
5
6
00b
01b
10b
01b
11b
01b
10b
EPWM1A (O)
GPIO1
EPWM1B (O)
GPIO2
EPWM2A (O)
GPIO3
EPWM2B (O)
GPIO4
EPWM3A (O)
GPIO5
EPWM3B (O)
MFSRA (I/O)
OUTPUTXBAR3 (O)
GPIO6
EPWM4A (O)
OUTPUTXBAR4 (O)
EXTSYNCOUT (O)
GPIO7
EPWM4B (O)
MCLKRA (I/O)
OUTPUTXBAR5 (O)
EQEP3B (I)
CANRXB (I)
GPIO8
EPWM5A (O)
CANTXB (O)
ADCSOCAO (O)
EQEP3S (I/O)
SCITXDA (O)
GPIO9
EPWM5B (O)
SCITXDB (O)
OUTPUTXBAR6 (O)
EQEP3I (I/O)
SCIRXDA (I)
GPIO10
EPWM6A (O)
CANRXB (I)
ADCSOCBO (O)
EQEP1A (I)
SCITXDB (O)
GPIO11
EPWM6B (O)
SCIRXDB (I)
OUTPUTXBAR7 (O)
EQEP1B (I)
SCIRXDB (I)
GPIO12
EPWM7A (O)
CANTXB (O)
MDXB (O)
EQEP1S (I/O)
SCITXDC (O)
GPIO13
EPWM7B (O)
CANRXB (I)
MDRB (I)
EQEP1I (I/O)
GPIO14
EPWM8A (O)
SCITXDB (O)
MCLKXB (I/O)
15
11b
11b
GPIO0
11b
SDAA (I/OD)
MFSRB (I/O)
SCLA (I/OD)
OUTPUTXBAR1 (O)
OUTPUTXBAR2 (O)
MCLKRB (I/O)
SDAB (I/OD)
OUTPUTXBAR2 (O)
SCLB (I/OD)
OUTPUTXBAR3 (O)
CANTXA (O)
EQEP3A (I)
CANTXB (O)
CANRXA (I)
SCIRXDC (I)
OUTPUTXBAR3 (O)
GPIO15
EPWM8B (O)
SCIRXDB (I)
MFSXB (I/O)
GPIO16
SPISIMOA (I/O)
CANTXB (O)
OUTPUTXBAR7 (O)
EPWM9A (O)
OUTPUTXBAR4 (O)
SD1_D1 (I)
GPIO17
SPISOMIA (I/O)
CANRXB (I)
OUTPUTXBAR8 (O)
EPWM9B (O)
SD1_C1 (I)
GPIO18
SPICLKA (I/O)
SCITXDB (O)
CANRXA (I)
EPWM10A (O)
SD1_D2 (I)
GPIO19
SPISTEA (I/O)
SCIRXDB (I)
CANTXA (O)
EPWM10B (O)
SD1_C2 (I)
GPIO20
EQEP1A (I)
MDXA (O)
CANTXB (O)
EPWM11A (O)
SD1_D3 (I)
GPIO21
EQEP1B (I)
MDRA (I)
CANRXB (I)
EPWM11B (O)
GPIO22
EQEP1S (I/O)
MCLKXA (I/O)
SCITXDB (O)
EPWM12A (O)
SPICLKB (I/O)
SD1_D4 (I)
GPIO23
EQEP1I (I/O)
MFSXA (I/O)
SCIRXDB (I)
EPWM12B (O)
SPISTEB (I/O)
SD1_C4 (I)
GPIO24
OUTPUTXBAR1 (O)
EQEP2A (I)
MDXB (O)
SPISIMOB (I/O)
SD2_D1 (I)
GPIO25
OUTPUTXBAR2 (O)
EQEP2B (I)
MDRB (I)
SPISOMIB (I/O)
SD2_C1 (I)
GPIO26
OUTPUTXBAR3 (O)
EQEP2I (I/O)
MCLKXB (I/O)
OUTPUTXBAR3 (O)
SPICLKB (I/O)
SD2_D2 (I)
GPIO27
OUTPUTXBAR4 (O)
EQEP2S (I/O)
MFSXB (I/O)
OUTPUTXBAR4 (O)
SPISTEB (I/O)
SD2_C2 (I)
SD1_C3 (I)
GPIO28
SCIRXDA (I)
EM1CS4 (O)
OUTPUTXBAR5 (O)
EQEP3A (I)
SD2_D3 (I)
GPIO29
SCITXDA (O)
EM1SDCKE (O)
OUTPUTXBAR6 (O)
EQEP3B (I)
SD2_C3 (I)
GPIO30
CANRXA (I)
EM1CLK (O)
OUTPUTXBAR7 (O)
EQEP3S (I/O)
SD2_D4 (I)
GPIO31
CANTXA (O)
EM1WE (O)
OUTPUTXBAR8 (O)
EQEP3I (I/O)
SD2_C4 (I)
GPIO32
SDAA (I/OD)
EM1CS0 (O)
GPIO33
SCLA (I/OD)
EM1RNW (O)
GPIO34
OUTPUTXBAR1 (O)
EM1CS2 (O)
SDAB (I/OD)
GPIO35
SCIRXDA (I)
EM1CS3 (O)
SCLB (I/OD)
GPIO36
SCITXDA (O)
EM1WAIT (I)
CANRXA (I)
GPIO37
OUTPUTXBAR2 (O)
EM1OE (O)
CANTXA (O)
GPIO38
EM1A0 (O)
SCITXDC (O)
GPIO39
EM1A1 (O)
SCIRXDC (I)
GPIO40
EM1A2 (O)
GPIO41
EM1A3 (O)
GPIO42
26
7
CANTXB (O)
CANRXB (I)
SDAB (I/OD)
SCLB (I/OD)
SDAA (I/OD)
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Table 6-2. GPIO Muxed Pins (continued)
GPIO Mux Selection(1) (2)
GPIO Index
0, 4, 8, 12
GPyGMUXn.
GPIOz =
00b, 01b,
10b, 11b
GPyMUXn.
GPIOz =
00b
1
2
3
5
6
7
00b
01b
10b
01b
11b
01b
11b
10b
GPIO43
15
11b
SCLA (I/OD)
GPIO44
EM1A4 (O)
GPIO45
EM1A5 (O)
GPIO46
EM1A6 (O)
SCIRXDD (I)
GPIO47
EM1A7 (O)
SCITXDD (O)
11b
SCIRXDA (I)
GPIO48
OUTPUTXBAR3 (O)
EM1A8 (O)
SCITXDA (O)
SD1_D1 (I)
GPIO49
OUTPUTXBAR4 (O)
EM1A9 (O)
SCIRXDA (I)
SD1_C1 (I)
GPIO50
EQEP1A (I)
EM1A10 (O)
SPISIMOC (I/O)
SD1_D2 (I)
GPIO51
EQEP1B (I)
EM1A11 (O)
SPISOMIC (I/O)
SD1_C2 (I)
GPIO52
EQEP1S (I/O)
EM1A12 (O)
SPICLKC (I/O)
SD1_D3 (I)
GPIO53
EQEP1I (I/O)
EM1D31 (I/O)
SPISTEC (I/O)
SD1_C3 (I)
GPIO54
SPISIMOA (I/O)
EM1D30 (I/O)
EQEP2A (I)
SCITXDB (O)
SD1_D4 (I)
GPIO55
SPISOMIA (I/O)
EM1D29 (I/O)
EQEP2B (I)
SCIRXDB (I)
SD1_C4 (I)
GPIO56
SPICLKA (I/O)
EM1D28 (I/O)
EQEP2S (I/O)
SCITXDC (O)
SD2_D1 (I)
GPIO57
SPISTEA (I/O)
EM1D27 (I/O)
EQEP2I (I/O)
SCIRXDC (I)
SD2_C1 (I)
GPIO58
MCLKRA (I/O)
EM1D26 (I/O)
OUTPUTXBAR1 (O)
SPICLKB (I/O)
SD2_D2 (I)
SPISIMOA(3) (I/O)
GPIO59
MFSRA (I/O)
EM1D25 (I/O)
OUTPUTXBAR2 (O)
SPISTEB (I/O)
SD2_C2 (I)
SPISOMIA(3) (I/O)
GPIO60
MCLKRB (I/O)
EM1D24 (I/O)
OUTPUTXBAR3 (O)
SPISIMOB (I/O)
SD2_D3 (I)
SPICLKA(3) (I/O)
GPIO61
MFSRB (I/O)
EM1D23 (I/O)
OUTPUTXBAR4 (O)
SPISOMIB (I/O)
SD2_C3 (I)
SPISTEA (3) (I/O)
GPIO62
SCIRXDC (I)
EM1D22 (I/O)
EQEP3A (I)
CANRXA (I)
SD2_D4 (I)
GPIO63
SCITXDC (O)
SD2_C4 (I)
SPISIMOB(3) (I/O)
EM1D21 (I/O)
EQEP3B (I)
CANTXA (O)
GPIO64
EM1D20 (I/O)
EQEP3S (I/O)
SCIRXDA (I)
GPIO65
EM1D19 (I/O)
EQEP3I (I/O)
SCITXDA (O)
SPICLKB(3) (I/O)
GPIO66
EM1D18 (I/O)
SDAB (I/OD)
SPISTEB (3) (I/O)
GPIO67
EM1D17 (I/O)
GPIO68
EM1D16 (I/O)
GPIO69
EM1D15 (I/O)
SCLB (I/OD)
SPISIMOC(3) (I/O)
GPIO70
EM1D14 (I/O)
CANRXA (I)
SCITXDB (O)
SPISOMIC(3) (I/O)
GPIO71
EM1D13 (I/O)
CANTXA (O)
SCIRXDB (I)
SPICLKC(3) (I/O)
GPIO72
EM1D12 (I/O)
CANTXB (O)
SCITXDC (O)
SPISTEC (3) (I/O)
CANRXB (I)
SCIRXDC (I)
GPIO73
EM1D11 (I/O)
GPIO74
EM1D10 (I/O)
XCLKOUT (O)
GPIO75
EM1D9 (I/O)
GPIO76
EM1D8 (I/O)
SCITXDD (O)
GPIO77
EM1D7 (I/O)
SCIRXDD (I)
GPIO78
EM1D6 (I/O)
EQEP2A (I)
GPIO79
EM1D5 (I/O)
EQEP2B (I)
GPIO80
EM1D4 (I/O)
EQEP2S (I/O)
GPIO81
EM1D3 (I/O)
EQEP2I (I/O)
GPIO82
EM1D2 (I/O)
GPIO83
EM1D1 (I/O)
GPIO84
SPISOMIB(3) (I/O)
SCITXDA (O)
MDXB (O)
SCIRXDA (I)
MDRB (I)
MDRA (I)
EM1CAS (O)
SCITXDB (O)
MCLKXB (I/O)
MCLKXA (I/O)
EM1A14 (O)
EM1RAS (O)
SCIRXDB (I)
MFSXB (I/O)
MFSXA (I/O)
EM1A15 (O)
EM1DQM0 (O)
GPIO89
EM1A16 (O)
EM1DQM1 (O)
GPIO90
EM1A17 (O)
EM1DQM2 (O)
SCIRXDC (I)
GPIO91
EM1A18 (O)
EM1DQM3 (O)
SDAA (I/OD)
GPIO92
EM1A19 (O)
EM1BA1 (O)
SCLA (I/OD)
EM1BA0 (O)
SCITXDD (O)
GPIO85
EM1D0 (I/O)
GPIO86
EM1A13 (O)
GPIO87
GPIO88
GPIO93
MDXA (O)
SCITXDC (O)
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Table 6-2. GPIO Muxed Pins (continued)
GPIO Mux Selection(1) (2)
GPIO Index
0, 4, 8, 12
GPyGMUXn.
GPIOz =
00b, 01b,
10b, 11b
GPyMUXn.
GPIOz =
00b
1
2
3
5
6
00b
01b
10b
01b
11b
01b
10b
GPIO94
GPIO99
28
15
11b
11b
11b
SCIRXDD (I)
EQEP1I (I/O)
GPIO133/
AUXCLKIN
(1)
(2)
(3)
7
SD2_C2 (I)
I = Input, O = Output, OD = Open Drain
GPIO Index settings of 9, 10, 11, 13, and 14 are reserved.
High-Speed SPI-enabled GPIO mux option. This pin mux option is required when using the SPI in High-Speed Mode (HS_MODE = 1
in SPICCR). This mux option is still available when not using the SPI in High-Speed Mode (HS_MODE = 0 in SPICCR).
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6.4.2 Input X-BAR
The Input X-BAR is used to route any GPIO input to the ADC, eCAP, and ePWM peripherals as well as to
external interrupts (XINT) (see Figure 6-3). Table 6-3 shows the input X-BAR destinations. For details on
configuring the Input X-BAR, see the Crossbar (X-BAR) chapter of the TMS320F2807x Microcontrollers
Technical Reference Manual .
Asynchronous
Synchronous
Sync. + Qual.
Input X-BAR
INPUT14
INPUT13
GPIOx
INPUT7
INPUT8
INPUT9
INPUT10
INPUT11
INPUT12
eCAP1
eCAP2
eCAP3
eCAP4
eCAP5
eCAP6
INPUT6
INPUT5
INPUT4
INPUT3
INPUT2
INPUT1
GPIO0
TZ1,TRIP1
TZ2,TRIP2
TZ3,TRIP3
XINT5
XINT4
XINT3
XINT2
XINT1
CPU PIE
CLA
TRIP4
TRIP5
ePWM
X-BAR
ePWM
Modules
TRIP7
TRIP8
TRIP9
TRIP10
TRIP11
TRIP12
TRIP6
ADCEXTSOC
ADC
EXTSYNCIN1
EXTSYNCIN2
ePWM and eCAP
Sync Chain
Output X-BAR
Figure 6-3. Input X-BAR
Table 6-3. Input X-BAR Destinations
INPUT
DESTINATIONS
INPUT1
EPWM[TZ1,TRIP1], EPWM X-BAR, Output X-BAR
INPUT2
EPWM[TZ2,TRIP2], EPWM X-BAR, Output X-BAR
INPUT3
EPWM[TZ3,TRIP3], EPWM X-BAR, Output X-BAR
INPUT4
XINT1, EPWM X-BAR, Output X-BAR
INPUT5
XINT2, ADCEXTSOC, EXTSYNCIN1, EPWM X-BAR, Output X-BAR
INPUT6
XINT3, EPWM[TRIP6], EXTSYNCIN2, EPWM X-BAR, Output X-BAR
INPUT7
ECAP1
INPUT8
ECAP2
INPUT9
ECAP3
INPUT10
ECAP4
INPUT11
ECAP5
INPUT12
ECAP6
INPUT13
XINT4
INPUT14
XINT5
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6.4.3 Output X-BAR and ePWM X-BAR
The Output X-BAR has eight outputs which can be selected on the GPIO mux as OUTPUTXBARx. The ePWM
X-BAR has eight outputs which are connected to the TRIPx inputs of the ePWM. The sources for both the
Output X-BAR and ePWM X-BAR are shown in Figure 6-4. For details on the Output X-BAR and ePWM X-BAR,
see the Crossbar (X-BAR) chapter of the TMS320F2807x Microcontrollers Technical Reference Manual .
CTRIPOUTH
CTRIPOUTL
(Output X-BAR only)
CMPSSx
CTRIPH
CTRIPL
ePWM and eCAP
Sync
EXTSYNCOUT
ADCSOCAO
Select Ckt
ADCSOCAO
ADCSOCBO
Select Ckt
ADCSOCBO
eCAPx
ECAPxOUT
ADCx
OUTPUT1
OUTPUT2
OUTPUT3
OUTPUT4
OUTPUT5
OUTPUT6
OUTPUT7
OUTPUT8
Output
X-BAR
EVT1
EVT2
EVT3
EVT4
INPUT1
INPUT2
INPUT3
Input X-Bar
(ePWM X-BAR only)
GPIO
Mux
TRIP4
TRIP5
TRIP7
TRIP8
TRIP9
TRIP10
TRIP11
TRIP12
ePWM
X-BAR
INPUT4
INPUT5
INPUT6
All
ePWM
Modules
OTHER DESTINATIONS
(see Input X-BAR)
FLT1.COMPH
X-BAR Flags
(shared)
FLT1.COMPL
SDFMx
FLT4.COMPH
FLT4.COMPL
Figure 6-4. Output X-BAR and ePWM X-BAR
30
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6.4.4 USB Pin Muxing
Table 6-4 shows assignment of the alternate USB function mapping. These can be configured with the
GPBAMSEL register.
Table 6-4. Alternate USB Function
GPIO
GPBAMSEL SETTING
USB FUNCTION
GPIO42
GPBAMSEL[10] = 1b
USB0DM
GPIO43
GPBAMSEL[11] = 1b
USB0DP
6.4.5 High-Speed SPI Pin Muxing
The SPI module on this device has a high-speed mode. To achieve the highest possible speed, a special GPIO
configuration is used on a single GPIO mux option for each SPI. These GPIOs may also be used by the SPI
when not in high-speed mode (HS_MODE = 0).
To select the mux options that enable the SPI high-speed mode, configure the GPyGMUX and GPyMUX
registers as shown in Table 6-5.
Table 6-5. GPIO Configuration for High-Speed SPI
GPIO
SPI SIGNAL
MUX CONFIGURATION
SPIA
GPIO58
SPISIMOA
GPBGMUX2[21:20]=11b
GPBMUX2[21:20]=11b
GPIO59
SPISOMIA
GPBGMUX2[23:22]=11b
GPBMUX2[23:22]=11b
GPIO60
SPICLKA
GPBGMUX2[25:24]=11b
GPBMUX2[25:24]=11b
GPIO61
SPISTEA
GPBGMUX2[27:26]=11b
GPBMUX2[27:26]=11b
GPIO63
SPISIMOB
GPBGMUX2[31:30]=11b
GPBMUX2[31:30]=11b
SPIB
GPIO64
SPISOMIB
GPCGMUX1[1:0]=11b
GPCMUX1[1:0]=11b
GPIO65
SPICLKB
GPCGMUX1[3:2]=11b
GPCMUX1[3:2]=11b
GPIO66
SPISTEB
GPCGMUX1[5:4]=11b
GPCMUX1[5:4]=11b
GPIO69
SPISIMOC
GPCGMUX1[11:10]=11b
GPCMUX1[11:10]=11b
SPIC
GPIO70
SPISOMIC
GPCGMUX1[13:12]=11b
GPCMUX1[13:12]=11b
GPIO71
SPICLKC
GPCGMUX1[15:14]=11b
GPCMUX1[15:14]=11b
GPIO72
SPISTEC
GPCGMUX1[17:16]=11b
GPCMUX1[17:16]=11b
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6.5 Connections for Unused Pins
For applications that do not need to use all functions of the device, Table 6-6 lists acceptable conditioning for any
unused pins. When multiple options are listed in Table 6-6, any are acceptable. Pins not listed in Table 6-6 must
be connected according to Section 6.2.1.
Table 6-6. Connections for Unused Pins
SIGNAL NAME
ACCEPTABLE PRACTICE
Analog
VREFHIx
Tie to VDDA
VREFLOx
Tie to VSSA
ADCINx
•
•
No Connect
Tie to VSSA
Digital
GPIOx
•
•
•
No connection (input mode with internal pullup enabled)
No connection (output mode with internal pullup disabled)
Pullup or pulldown resistor (any value resistor, input mode, and with internal pullup disabled)
X1
Tie to VSS
X2
No Connect
TCK
•
•
No Connect
Pullup resistor
TDI
•
•
No Connect
Pullup resistor
TDO
No Connect
TMS
No Connect
TRST
Pulldown resistor (2.2 kΩ or smaller)
VREGENZ
Tie to VDDIO
ERRORSTS
No Connect
FLT1
No Connect
FLT2
No Connect
VDD
All VDD pins must be connected per Section 6.2.1.
Power and Ground
VDDA
If a dedicated analog supply is not used, tie to VDDIO.
VDDIO
All VDDIO pins must be connected per Section 6.2.1.
VDD3VFL
Must be tied to VDDIO
VDDOSC
Must be tied to VDDIO
VSS
All VSS pins must be connected to board ground.
VSSA
If a dedicated analog ground is not used, tie to VSS.
VSSOSC
If an external crystal is not used, this pin may be connected to the board ground.
32
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage
MIN
MAX(1) (2)
VDDIO with respect to VSS
–0.3
4.6
VDD3VFL with respect to VSS
–0.3
4.6
VDDOSC with respect to VSS
–0.3
4.6
UNIT
V
VDD with respect to VSS
–0.3
1.5
Analog voltage
VDDA with respect to VSSA
–0.3
4.6
Input voltage
VIN (3.3 V)
–0.3
4.6
V
Output voltage
VO
–0.3
4.6
V
Digital/analog input (per pin), IIK
(VIN < VSS/VSSA or VIN > VDDIO/VDDA)(3)
–20
20
Total for all inputs, IIKTOTAL
(VIN < VSS/VSSA or VIN > VDDIO/VDDA)
–20
20
Output current
Digital output (per pin), IOUT
–20
20
mA
Free-Air temperature
TA
–40
125
°C
Operating junction temperature
TJ
–40
150
°C
Tstg
–65
150
°C
Input clamp current
Storage
(1)
(2)
(3)
(4)
temperature(4)
V
mA
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Section 7.4 is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS, unless otherwise noted.
Continuous clamp current per pin is ±2 mA. Do not operate in this condition continuously as VDDIO/VDDA voltage may internally rise and
impact other electrical specifications.
Long-term high-temperature storage or extended use at maximum temperature conditions may result in a reduction of overall device
life. For additional information, see Semiconductor and IC Package Thermal Metrics.
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7.2 ESD Ratings – Commercial
VALUE
UNIT
TMS320F28076-Q1 in 176-pin PTP package
V(ESD)
Electrostatic discharge (ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 or ANSI/ESDA/JEDEC JS-002(2)
±500
V
TMS320F28076-Q1 in 100-pin PZP package
V(ESD)
(1)
(2)
Electrostatic discharge (ESD)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22C101 or ANSI/ESDA/JEDEC JS-002(2)
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 ESD Ratings – Automotive
VALUE
UNIT
TMS320F28075-Q1 in 176-pin PTP package
V(ESD)
Electrostatic discharge
Human body model (HBM), per
AEC Q100-002(1)
All pins
±2000
Charged device model (CDM),
per AEC Q100-011
All pins
±500
Corner pins on 176-pin PTP:
1, 44, 45, 88, 89, 132, 133, 176
±750
Human body model (HBM), per
AEC Q100-002(1)
All pins
±2000
Charged device model (CDM),
per AEC Q100-011
All pins
±500
Corner pins on 100-pin PZP:
1, 25, 26, 50, 51, 75, 76, 100
±750
V
TMS320F28075-Q1 in 100-pin PZP package
V(ESD)
(1)
34
Electrostatic discharge
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
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7.4 Recommended Operating Conditions
MIN
Device supply voltage, I/O, VDDIO
(1)
Device supply voltage, VDD
(1)
(2)
UNIT
3.14
3.3
3.47
V
1.2
1.26
V
3.14
3.3
3.47
V
0
Analog ground, VSSA
Free-Air temperature, TA
MAX
1.14
Supply ground, VSS
Analog supply voltage, VDDA
Junction temperature, TJ
NOM
V
0
V
T version
–40
105
S version(2)
–40
125
Q version (AEC Q100 qualification)(2)
–40
150
Q version (AEC Q100 qualification)
–40
125
°C
°C
VDDIO, VDD3VFL, and VDDOSC should be maintained within 0.3 V of each other.
Operation above TJ = 105°C for extended duration will reduce the lifetime of the device. See Calculating Useful Lifetimes of Embedded
Processors for more information.
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7.5 Power Consumption Summary
Current values listed in this section are representative for the test conditions given and not the absolute
maximum possible. The actual device currents in an application will vary with application code and pin
configurations. Section 7.5.1 shows the device current consumption at 120-MHz SYSCLK. Section 7.5.2 shows
the device current consumption at 120-MHz SYSCLK with the internal VREG enabled.
7.5.1 Device Current Consumption at 120-MHz SYSCLK
MODE
TEST CONDITIONS
MAX(2)
TYP(3)
140 mA
295 mA
25 mA
IDDA
MAX(2)
IDD3VFL
TYP(3)
MAX(2)
TYP(3)
MAX(2)
13 mA
20 mA
33 mA
40 mA
RAM.(4)
•
•
Code is running out of
All I/O pins are left unconnected.
Peripherals not active have their
clocks disabled.
FLASH is read and in active state.
XCLKOUT is enabled at SYSCLK/4.
IDLE
•
•
•
CPU1 is in IDLE mode.
Flash is powered down.
XCLKOUT is turned off.
50 mA
185 mA
3 mA
10 mA
10 µA
150 µA
10 µA
150 µA
STANDBY
•
•
•
CPU1 is in STANDBY mode.
Flash is powered down.
XCLKOUT is turned off.
25 mA
170 mA
3 mA
10 mA
5 µA
150 µA
10 µA
150 µA
HALT
•
•
•
CPU1 watchdog is running.
Flash is powered down.
XCLKOUT is turned off.
1.5 mA
120 mA
750 µA
2 mA
5 µA
150 µA
10 µA
150 µA
•
CPU1.M0 and CPU1.M1 RAMs are
in low-power data retention mode.
300 µA
5 mA
750 µA
2 mA
5 µA
75 µA
1 µA
50 µA
•
•
•
•
CPU1 is running from RAM.
All I/O pins are left unconnected.
Peripheral clocks are disabled.
CPU1 is performing Flash Erase and
Programming.
XCLKOUT is turned off.
97 mA
145 mA
3 mA
10 mA
10 µA
150 µA
45 mA
55 mA
Operational
HIBERNATE
Flash
Erase/Program(5)
•
•
•
IDDIO (1)
IDD
TYP(3)
•
(1)
(2)
(3)
(4)
(5)
36
IDDIO current is dependent on the electrical loading on the I/O pins.
MAX: Vmax, 125°C
TYP: Vnom, 30°C
The following is executed in a loop on CPU1:
• All of the communication peripherals are exercised in loop-back mode: CAN-A to CAN-B; SPI-A to SPI-C; SCI-A to SCI-D; I2C-A to
I2C-B; McBSP-A to McBSP-B; USB
• ePWM1 to ePWM12 generate 400-kHz PWM output on 24 pins
• CPU TIMERs active
• DMA does 32-bit burst transfers
• CLA1 does multiply-accumulate tasks
• All ADCs perform continuous conversion
• All DACs ramp voltage up/down at 150 kHz
• CMPSS1 to CMPSS8 active
• TMU calculates a cosine
• FPU does multiply/accumulate with parallel load
Brownout events during flash programming can corrupt flash data. Programming environments using alternate power sources (such as
a USB programmer) must be capable of supplying the rated current for the device and other system components with sufficient margin
to avoid supply brownout conditions.
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7.5.2 Device Current Consumption at 120-MHz SYSCLK With the Internal VREG Enabled
MODE(1)
TEST CONDITIONS
IDDIO (2)
IDDA
IDD3VFL
TYP(4)
MAX(3)
TYP(4)
MAX(3)
TYP(4)
MAX(3)
165 mA
375 mA
13 mA
25 mA
33 mA
40 mA
•
•
Code is running out of RAM.(5)
All I/O pins are left unconnected.
Peripherals not active have their clocks
disabled.
FLASH is read and in active state.
XCLKOUT is enabled at SYSCLK/4.
IDLE
•
•
•
CPU1 is in IDLE mode.
Flash is powered down.
XCLKOUT is turned off.
53 mA
200 mA
10 µA
150 µA
10 µA
150 µA
STANDBY
•
•
•
CPU1 is in STANDBY mode.
Flash is powered down.
XCLKOUT is turned off.
28 mA
185 mA
5 µA
150 µA
10 µA
150 µA
HALT
•
•
•
CPU1 watchdog is running.
Flash is powered down.
XCLKOUT is turned off.
2.25 mA
125 mA
5 µA
150 µA
10 µA
150 µA
•
CPU1.M0 and CPU1.M1 RAMs are in lowpower data retention mode.
1.2 mA
8 mA
5 µA
75 µA
1 µA
50 µA
Operational
(RAM)
HIBERNATE
(1)
(2)
(3)
(4)
(5)
•
•
•
The internal voltage regulator is described in Section 7.9.1.1.
IDDIO current is dependent on the electrical loading on the I/O pins.
MAX: Vmax, 125°C
TYP: Vnom, 30°C
The following is executed in a loop on CPU1:
• All of the communication peripherals are exercised in loop-back mode: CAN-A to CAN-B; SPI-A to SPI-C; SCI-A to SCI-D; I2C-A to
I2C-B; McBSP-A to McBSP-B; USB
• ePWM1 to ePWM12 generate 400-kHz PWM output on 24 pins
• CPU TIMERs active
• DMA does 32-bit burst transfers
• CLA1 does multiply-accumulate tasks
• All ADCs perform continuous conversion
• All DACs ramp voltage up/down at 150 kHz
• CMPSS1 to CMPSS8 active
• TMU calculates a cosine
• FPU does multiply/accumulate with parallel load
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7.5.3 Current Consumption Graphs
Figure 7-1 and Figure 7-2 are a typical representation of the relationship between frequency and current
consumption/power on the device. The operational test from Section 7.5.1 was run across frequency at Vmax and
high temperature. Actual results will vary based on the system implementation and conditions.
0.5
0.45
0.4
0.35
0.3
Current (A)
0.25
0.2
0.15
0.1
0.05
0
10
20
30
40
50
60
70
80
90
100
110
120
SYSCLK (MHz)
VDD
VDDIO
VDDA
VDD3VFL
Figure 7-1. Operational Current Versus Frequency
Power vs. Frequency
1
0.9
0.8
Power (W)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
20
30
40
50
60
70
80
90
100
110
120
SYSCLK (MHz)
Power
Figure 7-2. Power Versus Frequency
38
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Leakage current will increase with operating temperature in a nonlinear manner. The difference in VDD current
between TYP and MAX conditions can be seen in Figure 7-3. The current consumption in HALT mode is
primarily leakage current as there is no active switching if the internal oscillator has been powered down.
Figure 7-3 shows the typical leakage current across temperature. The device was placed into HALT mode under
nominal voltage conditions.
Figure 7-3. IDD Leakage Current Versus Temperature
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7.5.4 Reducing Current Consumption
The F2807x devices provide some methods to reduce the device current consumption:
• Any one of the four low-power modes—IDLE, STANDBY, HALT, and HIBERNATE—could be entered during
idle periods in the application.
• The flash module may be powered down if the code is run from RAM.
• Disable the pullups on pins that assume an output function.
• Each peripheral has an individual clock-enable bit (PCLKCRx). Reduced current consumption may be
achieved by turning off the clock to any peripheral that is not used in a given application. Table 7-1 indicates
the typical current reduction that may be achieved by disabling the clocks using the PCLKCRx register.
• To realize the lowest VDDA current consumption in a low-power mode, see the respective analog chapter of
the TMS320F2807x Microcontrollers Technical Reference Manual to ensure each module is powered down
as well.
Table 7-1. Current on VDD Supply by Various
Peripherals (at 120 MHz)
PERIPHERAL
MODULE(1) (2)
IDD CURRENT
REDUCTION (mA)
ADC(3)
2.1
CAN
2.1
CLA
0.9
CMPSS(3)
0.9
CPUTIMER
0.2
DAC(3)
0.4
DMA
1.8
eCAP
0.4
EMIF1
1.8
ePWM4(4)
2.8
ePWM5 to ePWM12(4)
1.1
HRPWM(4)
1.1
I2C
0.9
ePWM1 to
(1)
(2)
(3)
(4)
40
McBSP
1
SCI
0.6
SDFM
1.3
SPI
0.4
USB and AUXPLL at 60 MHz
14.8
At Vmax and 125°C.
All peripherals are disabled upon reset. Use the PCLKCRx
register to individually enable peripherals. For peripherals with
multiple instances, the current quoted is for a single module.
This number represents the current drawn by the digital portion
of the ADC, CMPSS, and DAC modules.
The ePWM is at /2 of SYSCLK.
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7.6 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
VOH
High-level output voltage
VOL
Low-level output voltage
IOH
High-level output source current for all output pins
IOL
Low-level output sink current for all output pins
VIH
High-level input voltage
(3.3 V)
MIN
IOH = IOH MIN
VDDIO * 0.8
IOH = –100 μA
VDDIO – 0.2
Low-level input voltage (3.3 V)
Input hysteresis
Ipulldown
Input current
Digital inputs with
pulldown(1)
Ipullup
Input current
0.4
0.2
–4
Pin leakage
mA
4
VDDIO * 0.7
VDDIO + 0.3
2.0
VDDIO + 0.3
VSS – 0.3
0.8
mA
V
V
mV
VDDIO = 3.3 V
VIN = VDDIO
120
µA
Digital inputs with pullup VDDIO = 3.3 V
enabled(1)
VIN = 0 V
150
µA
Pullups disabled
0 V ≤ VIN ≤ VDDIO
2
Analog (except
ADCINB0 or DACOUTx)
ADCINB0
2
0 V ≤ VIN ≤ VDDA
DACOUTx
CI
Input capacitance
VDDIO-POR
VDDIO power-on reset voltage
(1)
(2)
V
150
Digital
ILEAK
UNIT
V
IOL = 100 µA
All other pins
VHYSTERESIS
MAX
IOL = IOL MAX
GPIO0–GPIO7,
GPIO42–GPIO43,
GPIO46–GPIO47
VIL
TYP
2
µA
11(2)
66
2
pF
2.3
V
See Table 6-1 for a list of pins with a pullup or pulldown.
The MAX input leakage shown on ADCINB0 is at high temperature.
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7.7 Thermal Resistance Characteristics
7.7.1 PTP Package
°C/W(1)
AIR FLOW (lfm)(2)
RΘJC
Junction-to-case thermal resistance
6.97
N/A
RΘJB
Junction-to-board thermal resistance
6.05
N/A
RΘJA (High k PCB)
Junction-to-free air thermal resistance
17.8
0
12.8
150
11.4
250
10.1
500
RΘJMA
PsiJT
Junction-to-package top
PsiJB
(1)
(2)
Junction-to-moving air thermal resistance
Junction-to-board
0.11
0
0.24
150
0.33
250
0.42
500
6.1
0
5.5
150
5.4
250
5.3
500
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
lfm = linear feet per minute
7.7.2 PZP Package
°C/W(1)
AIR FLOW (lfm)(2)
RΘJC
Junction-to-case thermal resistance
4.3
N/A
RΘJB
Junction-to-board thermal resistance
5.9
N/A
RΘJA (High k PCB)
Junction-to-free air thermal resistance
19.1
0
14.3
150
12.8
250
11.4
500
RΘJMA
PsiJT
PsiJB
(1)
42
Junction-to-moving air thermal resistance
Junction-to-package top
Junction-to-board
0.03
0
0.09
150
0.12
250
0.20
500
6.0
0
5.5
150
5.5
250
5.3
500
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
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lfm = linear feet per minute
7.8 Thermal Design Considerations
Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems that
exceed the recommended maximum power dissipation in the end product may require additional thermal
enhancements. Ambient temperature (TA) varies with the end application and product design. The critical factor
that affects reliability and functionality is TJ, the junction temperature, not the ambient temperature. Hence, care
should be taken to keep TJ within the specified limits. Tcase should be measured to estimate the operating
junction temperature TJ. Tcase is normally measured at the center of the package top-side surface. The thermal
application report Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and
definitions.
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7.9 System
7.9.1 Power Management
7.9.1.1 Internal 1.2-V VREG
The internal VREG is supplied by VDDIO and generates the 1.2 V required to power the VDD pins. Enable this
functionality by pulling the VREGENZ pin low to VSS. Although the internal VREG eliminates the need to use an
external power supply for VDD, decoupling capacitors are required on each VDD pin for VREG stability (see the
description of VDD in Section 6.2.1). Driving an external load with the internal VREG is not supported.
7.9.1.2 Power Sequencing
7.9.1.2.1 Signal Pin Requirements
Before powering the device, no voltage larger than 0.3 V above VDDIO can be applied to any digital pin, and no
voltage larger than 0.3 V above VDDA can be applied to any analog pin (including VREFHI).
7.9.1.2.2 VDDIO, VDDA, VDD3VFL, and VDDOSC Requirements
The 3.3-V supplies should be powered up together and kept within 0.3 V of each other during functional
operation.
7.9.1.2.3 VDD Requirements
When VREGENZ is tied to VSS, the VDD sequencing requirements are handled by the device.
When using an external source for VDD (VREGENZ tied to VDDIO), VDDOSC and VDD must be powered on and off
at the same time. VDDOSC should not be powered on when VDD is off. During the ramp, VDD should be kept no
more than 0.3 V above VDDIO.
For applications not powering VDDOSC and VDD at the same time, see the "INTOSC: VDDOSC Powered Without
VDD Can Cause INTOSC Frequency Drift" advisory in the TMS320F2807x MCUs Silicon Errata.
There is an internal 12.8-mA current source from VDD3VFL to VDD when the flash is active. When the flash is
active and the device is in a low-activity state (for example, a low-power mode), this internal current source can
cause VDD to rise to approximately 1.3 V . There will be zero current load to the external system VDD regulator
while in this condition. This is not an issue for most regulators; however, if the system voltage regulator requires
a minimum load for proper operation, then an external 82Ω resistor can be added to the board to ensure a
minimal current load on VDD. See the "Low-Power Modes: Power Down Flash or Maintain Minimum Device
Activity" advisory in the TMS320F2807x MCUs Silicon Errata.
7.9.1.2.4 Supply Ramp Rate
The supplies should ramp to full rail within 10 ms. Section 7.9.1.2.4.1 shows the supply ramp rate.
7.9.1.2.4.1 Supply Ramp Rate
Supply ramp rate
VDDIO, VDD, VDDA, VDD3VFL, VDDOSC with respect to VSS
MIN
MAX
330
105
UNIT
V/s
7.9.1.2.5 Supply Supervision
An internal power-on-reset (POR) circuit keeps the I/Os in a high-impedance state during power up. External
supply voltage supervisors (SVS) can be used to monitor the voltage on the 3.3-V and 1.2-V rails and drive XRS
low when supplies are outside operational specifications.
Note
If the supply voltage is held near the POR threshold, then the device may drive periodic resets onto
the XRS pin.
44
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7.9.2 Reset Timing
XRS is the device reset pin. It functions as an input and open-drain output. The device has a built-in power-on
reset (POR). During power up, the POR circuit drives the XRS pin low. A watchdog or NMI watchdog reset also
drives the pin low. An external circuit may drive the pin to assert a device reset.
A resistor with a value from 2.2 kΩ to 10 kΩ should be placed between XRS and VDDIO. A capacitor should be
placed between XRS and VSS for noise filtering; the capacitance should be 100 nF or smaller. These values will
allow the watchdog to properly drive the XRS pin to VOL within 512 OSCCLK cycles when the watchdog reset is
asserted. Figure 7-4 shows the recommended reset circuit.
VDDIO
2.2 kW – 10 kW
XRS
£100 nF
Figure 7-4. Reset Circuit
7.9.2.1 Reset Sources
The following reset sources exist on this device: XRS, WDRS, NMIWDRS, SYSRS, SCCRESET, and
HIBRESET. See the Reset Signals table in the System Control chapter of the TMS320F2807x Microcontrollers
Technical Reference Manual .
The parameter th(boot-mode) must account for a reset initiated from any of these sources.
CAUTION
Some reset sources are internally driven by the device. Some of these sources will drive XRS low.
Use this to disable any other devices driving the boot pins. The SCCRESET and debugger reset
sources do not drive XRS; therefore, the pins used for boot mode should not be actively driven by
other devices in the system. The boot configuration has a provision for changing the boot pins in
OTP; for more details, see the TMS320F2807x Microcontrollers Technical Reference Manual .
7.9.2.2 Reset Electrical Data and Timing
Section 7.9.2.2.1 shows the reset ( XRS) timing requirements. Section 7.9.2.2.2 shows the reset ( XRS)
switching characteristics. Figure 7-5 shows the power-on reset. Figure 7-6 shows the warm reset.
7.9.2.2.1 Reset ( XRS) Timing Requirements
MIN
th(boot-mode)
Hold time for boot-mode pins
tw(RSL2)
Pulse duration, XRS low on
warm reset
1.5
All cases
Low-power modes used in
application and SYSCLKDIV > 16
MAX
UNIT
ms
3.2
3.2 * (SYSCLKDIV/16)
µs
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7.9.2.2.2 Reset ( XRS) Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
tw(RSL1)
Pulse duration, XRS driven low by device after supplies are
stable
tw(WDRS)
Pulse duration, reset pulse generated by watchdog
TYP
MAX
100
UNIT
µs
512tc(OSCCLK)
cycles
VDDIO, VDDA
(3.3 V)
VDD (1.2 V)
tw(RSL1)
XRS
(A)
Boot ROM
CPU
Execution
Phase
User-code
th(boot-mode)(B)
Boot-Mode
Pins
User-code dependent
GPIO pins as input
Peripheral/GPIO function
Based on boot code
Boot-ROM execution starts
GPIO pins as input (pullups are disabled)
I/O Pins
User-code dependent
A. The XRS pin can be driven externally by a supervisor or an external pullup resistor, see Section 6.2.1.
B. After reset from any source (see Section 7.9.2.1), the boot ROM code samples Boot Mode pins. Based on the status of the Boot Mode
pin, the boot code branches to destination memory or boot code function. If boot ROM code executes after power-on conditions (in
debugger environment), the boot code execution time is based on the current SYSCLK speed. The SYSCLK will be based on user
environment and could be with or without PLL enabled.
Figure 7-5. Power-on Reset
tw(RSL2)
XRS
User Code
CPU
Execution
Phase
User Code
Boot ROM
Boot-ROM execution starts
(initiated by any reset source)
Boot-Mode
Pins
Peripheral/GPIO Function
th(boot-mode)(A)
GPIO Pins as Input
Peripheral/GPIO Function
User-Code Execution Starts
I/O Pins
User-Code Dependent
GPIO Pins as Input (Pullups are Disabled)
User-Code Dependent
A. After reset from any source (see Section 7.9.2.1), the Boot ROM code samples BOOT Mode pins. Based on the status of the Boot Mode
pin, the boot code branches to destination memory or boot code function. If Boot ROM code executes after power-on conditions (in
debugger environment), the Boot code execution time is based on the current SYSCLK speed. The SYSCLK will be based on user
environment and could be with or without PLL enabled.
Figure 7-6. Warm Reset
46
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7.9.3 Clock Specifications
7.9.3.1 Clock Sources
Table 7-2 lists four possible clock sources. Figure 7-7 provides an overview of the device's clocking system.
Table 7-2. Possible Reference Clock Sources
CLOCK SOURCE
MODULES CLOCKED
COMMENTS
INTOSC1
Can be used to provide clock for:
• Watchdog block
• CPU-Timer 2
Internal oscillator 1.
Zero-pin overhead 10-MHz internal oscillator.
INTOSC2(1)
Can be used to provide clock for:
• Main PLL
• Auxiliary PLL
• CPU-Timer 2
Internal oscillator 2.
Zero-pin overhead 10-MHz internal oscillator.
XTAL
Can be used to provide clock for:
• Main PLL
• Auxiliary PLL
• CPU-Timer 2
External crystal or resonator connected between the X1 and X2 pins
or single-ended clock connected to the X1 pin.
AUXCLKIN
Can be used to provide clock for:
• Auxiliary PLL
• CPU-Timer 2
Single-ended 3.3-V level clock source. GPIO133/AUXCLKIN pin
should be used to provide the input clock.
(1)
On reset, internal oscillator 2 (INTOSC2) is the default clock source for both system PLL (OSCCLK) and auxiliary PLL (AUXOSCCLK).
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INTOSC1
INTOSC2
WDCLK
CLKSRCCTL1
SYSPLLCTL1
SYSCLKDIVSEL
SYSCLK
Divider
OSCCLK
X1(XTAL)
System PLL
To watchdog timer
PLLRAWCLK
SYSCLK
CPU
PLLSYSCLK
To GS RAMs, GPIOs,
and NMIWDs
CPU1.CPUCLK
To local memories
CPU1.SYSCLK
To ePIEs, LS RAMs,
CLA message RAMs,
and DCSMs
One per SYSCLK peripheral
PCLKCRx
PERx.SYSCLK
To peripherals
PERx.LSPCLK
To SCIs, SPIs, and
McBSPs
EPWMCLK
To ePWMs
One per LSPCLK peripheral
LOSPCP
PCLKCRx
LSP
Divider
LSPCLK
One per ePWM
EPWMCLKDIV
PLLSYSCLK
PCLKCRx
/1
/2
HRPWM
PCLKCRx
HRPWMCLK
To HRPWMs
CAN Bit Clock
To CANs
AUXPLLCLK
To USB bit clock
One per CAN module
CLKSRCCTL2
AUXCLKIN
CLKSRCCTL2
AUXPLLCTL1
AUXOSCCLK
Auxiliary PLL
AUXPLLRAWCLK
AUXCLKDIVSEL
AUXCLK
Divider
Figure 7-7. Clocking System
48
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7.9.3.2 Clock Frequencies, Requirements, and Characteristics
This section provides the frequencies and timing requirements of the input clocks, PLL lock times, frequencies of
the internal clocks, and the frequency and switching characteristics of the output clock.
7.9.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
Section 7.9.3.2.1.1 shows the frequency requirements for the input clocks. Table 7-3 shows the crystal
equivalent series resistance requirements. Section 7.9.3.2.1.2 shows the X1 input level characteristics when
using an external clock source. Section 7.9.3.2.1.3 and Section 7.9.3.2.1.4 show the timing requirements for the
input clocks. Section 7.9.3.2.1.5 shows the PLL lock times for the Main PLL and the USB PLL.
7.9.3.2.1.1 Input Clock Frequency
MIN
MAX
UNIT
f(XTAL)
Frequency, X1/X2, from external crystal or resonator
10
20
MHz
f(X1)
Frequency, X1, from external oscillator
2
25
MHz
f(AUXI)
Frequency, AUXCLKIN, from external oscillator
2
60
MHz
7.9.3.2.1.2 X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)
over recommended operating conditions (unless otherwise noted)
PARAMETER
X1 VIL
Valid low-level input voltage
X1 VIH
Valid high-level input voltage
MIN
MAX
UNIT
–0.3
0.3 * VDDIO
V
0.7 * VDDIO
VDDIO + 0.3
V
7.9.3.2.1.3 X1 Timing Requirements
MIN
MAX
UNIT
tf(X1)
Fall time, X1
6
ns
tr(X1)
Rise time, X1
6
ns
tw(X1L)
Pulse duration, X1 low as a percentage of tc(X1)
45%
55%
tw(X1H)
Pulse duration, X1 high as a percentage of tc(X1)
45%
55%
MIN
MAX
7.9.3.2.1.4 AUXCLKIN Timing Requirements
tf(AUXI)
Fall time, AUXCLKIN
UNIT
6
ns
6
ns
tr(AUXI)
Rise time, AUXCLKIN
tw(AUXL)
Pulse duration, AUXCLKIN low as a percentage of tc(XCI)
45%
55%
tw(AUXH)
Pulse duration, AUXCLKIN high as a percentage of tc(XCI)
45%
55%
7.9.3.2.1.5 PLL Lock Times
MIN
NOM
UNIT
µs
µs
t(PLL)
Lock time, Main PLL (X1, from external oscillator)
50 µs + 2500 * tc(OSCCLK)
t(USB)
Lock time, USB PLL (AUXCLKIN, from external oscillator)
50 µs + 2500 * tc(OSCCLK) (1)
(1)
MAX
(1)
The PLL lock time here defines the typical time of execution for the PLL workaround as defined in the TMS320F2807x MCUs Silicon
Errata . Cycle count includes code execution of the PLL initialization routine, which could vary depending on compiler optimizations
and flash wait states. TI recommends using the latest example software from C2000Ware for initializing the PLLs. For the system PLL,
see InitSysPll() or SysCtl_setClock(). For the auxillary PLL, see InitAuxPll() or SysCtl_setAuxClock().
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7.9.3.2.2 Internal Clock Frequencies
Section 7.9.3.2.2.1 provides the clock frequencies for the internal clocks.
7.9.3.2.2.1 Internal Clock Frequencies
MIN
NOM
MAX
UNIT
f(SYSCLK)
Frequency, device (system) clock
2
120
MHz
tc(SYSCLK)
Period, device (system) clock
8.33
500
ns
f(PLLRAWCLK)
Frequency, system PLL output (before SYSCLK
divider)
120
400
MHz
f(AUXPLLRAWCLK)
Frequency, auxiliary PLL output (before AUXCLK
divider)
120
400
MHz
f(AUXPLL)
Frequency, AUXPLLCLK
2
f(PLL)
Frequency, PLLSYSCLK
2
f(LSP)
Frequency, LSPCLK
tc(LSPCLK)
Period, LSPCLK
f(OSCCLK)
Frequency, OSCCLK (INTOSC1 or INTOSC2 or
XTAL or X1)
f(EPWM)
Frequency, EPWMCLK(1)
f(HRPWM)
Frequency, HRPWMCLK
(1)
60
60
MHz
120
MHz
2
120
MHz
8.33
500
ns
See respective clock
MHz
60
100
MHz
100
MHz
For SYSCLK above 100 MHz, the EPWMCLK must be half of SYSCLK.
7.9.3.2.3 Output Clock Frequency and Switching Characteristics
Section 7.9.3.2.3.1 provides the frequency of the output clock. Section 7.9.3.2.3.2 shows the switching
characteristics of the output clock, XCLKOUT.
7.9.3.2.3.1 Output Clock Frequency
MIN
f(XCO)
MAX
UNIT
50
MHz
Frequency, XCLKOUT
7.9.3.2.3.2 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
over recommended operating conditions (unless otherwise noted)
PARAMETER(1) (2)
tf(XCO)
Fall time, XCLKOUT
MIN
MAX
UNIT
5
ns
tr(XCO)
Rise time, XCLKOUT
5
ns
tw(XCOL)
Pulse duration, XCLKOUT low
H–2
H+2
ns
tw(XCOH)
Pulse duration, XCLKOUT high
H–2
H+2
ns
(1)
(2)
50
A load of 40 pF is assumed for these parameters.
H = 0.5tc(XCO)
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7.9.3.3 Input Clocks and PLLs
In addition to the internal 0-pin oscillators, multiple external clock source options are available. Figure 7-8 shows
the recommended methods of connecting crystals, resonators, and oscillators to pins X1/X2 (also referred to as
XTAL) and AUXCLKIN.
X1
vssosc
X2
X1
vssosc
X2
RESONATOR
CRYSTAL
RD
C L2
C L1
X1
vssosc
X2
GPIO133/AUXCLKIN
NC
3.3V
CLK
VDD
OUT
3.3V
CLK
VDD
OUT
GND
GND
3.3V OSCILLATOR
3.3V OSCILLATOR
Figure 7-8. Connecting Input Clocks to a 2807x Device
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7.9.3.4 Crystal Oscillator
When using a quartz crystal, it may be necessary to include a damping resistor (RD) in the crystal circuit to
prevent over-driving the crystal (drive level can be found in the crystal data sheet). In higher-frequency
applications (10 MHz or greater), RD is generally not required. If a damping resistor is required, RD should be as
small as possible because the size of the resistance affects start-up time (smaller RD = faster start-up time). TI
recommends that the crystal manufacturer characterize the crystal with the application board. Section 7.9.3.4.1
shows the crystal oscillator parameters. Table 7-3 shows the crystal equivalent series resistance (ESR)
requirements. Section 7.9.3.4.2 shows the crystal oscillator electrical characteristics.
7.9.3.4.1 Crystal Oscillator Parameters
CL1, CL2
Load capacitance
C0
Crystal shunt capacitance
MIN
MAX
12
24
UNIT
pF
7
pF
Table 7-3. Crystal Equivalent Series Resistance (ESR) Requirements
CRYSTAL FREQUENCY (MHz)
(1) (2)
MAXIMUM ESR (Ω)
(CL1 = CL2 = 12 pF)
MAXIMUM ESR (Ω)
(CL1 = CL2 = 24 pF)
(1)
(2)
10
55
110
12
50
95
14
50
90
16
45
75
18
45
65
20
45
50
Crystal shunt capacitance (C0) should be less than or equal to 7 pF.
ESR = Negative Resistance/3
7.9.3.4.2 Crystal Oscillator Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
Start-up time(1)
TEST CONDITIONS
MIN
f = 20 MHz
ESR MAX = 50 Ω
CL1 = CL2 = 24 pF
C0 = 7 pF
Crystal drive level (DL)
(1)
52
TYP
MAX
UNIT
2
ms
1
mW
Start-up time is dependent on the crystal and tank circuit components. TI recommends that the crystal vendor characterize the
application with the chosen crystal.
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7.9.3.5 Internal Oscillators
To reduce production board costs and application development time, all F2807x devices contain two
independent internal oscillators, referred to as INTOSC1 and INTOSC2. By default, both oscillators are enabled
at power up. INTOSC2 is set as the source for the system reference clock (OSCCLK) and INTOSC1 is set as the
backup clock source. INTOSC1 can also be manually configured as the system reference clock (OSCCLK).
Section 7.9.3.5.1 provides the electrical characteristics of the internal oscillators to determine if this module
meets the clocking requirements of the application.
Section 7.9.3.5.1 provides the electrical characteristics of the two internal oscillators.
7.9.3.5.1 Internal Oscillator Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
f(INTOSC)
TEST CONDITIONS
Frequency, INTOSC1 and INTOSC2
MIN
9.7
TYP
MAX
UNIT
10.0
10.3
MHz
Frequency stability at room temperature
30°C, Nominal VDD
±0.1%
f(INTOSC-STABILITY)
Frequency stability over VDD
30°C
±0.2%
f(INTOSC-ST)
Start-up and settling time
Frequency stability
–3.0%
3.0%
20
µs
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7.9.4 Flash Parameters
The on-chip flash memory is tightly integrated to the CPU, allowing code execution directly from flash through
128-bit-wide prefetch reads and a pipeline buffer. Flash performance for sequential code is equal to execution
from RAM. Factoring in discontinuities, most applications will run with an efficiency of approximately 80% relative
to code executing from RAM.
This device also has an OTP (One-Time-Programmable) sector used for the dual code security module (DCSM),
which cannot be erased after it is programmed.
Table 7-4 shows the minimum required flash wait states at different frequencies. Section 7.9.4.1 shows the flash
parameters.
Table 7-4. Flash Wait States
CPUCLK (MHz)
MINIMUM WAIT STATES (1)
EXTERNAL OSCILLATOR OR CRYSTAL
INTOSC1 OR INTOSC2
100 < CPUCLK ≤ 120
97 < CPUCLK ≤ 120
2
50 < CPUCLK ≤ 100
48 < CPUCLK ≤ 97
1
CPUCLK ≤ 50
CPUCLK ≤ 48
0
(1)
Minimum required FRDCNTL[RWAIT].
7.9.4.1 Flash Parameters
PARAMETER
MIN
128 data bits + 16 ECC bits
Program Time(1)
Erase Time(2) at < 25 cycles
Erase Time(2) at 20k cycles
Nwec
Write/erase cycles
tretention
Data retention duration at TJ = 85°C
(1)
(2)
TYP
MAX
UNIT
40
300
µs
8KW sector
100
200
ms
32KW sector
400
800
ms
8KW sector
35
60
32KW sector
40
65
8KW sector
110
4000
32KW sector
120
4000
20000
20
ms
ms
cycles
years
Program time is at the maximum device frequency. Program time includes overhead of the flash state machine but does not include
the time to transfer the following into RAM:
• Code that uses flash API to program the flash
• Flash API itself
• Flash data to be programmed
In other words, the time indicated in this table is applicable after all the required code/data is available in the device RAM, ready for
programming. The transfer time will significantly vary depending on the speed of the JTAG debug probe used.
Program time calculation is based on programming 144 bits at a time at the specified operating frequency. Program time includes
Program verify by the CPU. The program time does not degrade with write/erase (W/E) cycling, but the erase time does.
Erase time includes Erase verify by the CPU and does not involve any data transfer.
Erase time includes Erase verify by the CPU.
Note
The Main Array flash programming must be aligned to 64-bit address boundaries and each 64-bit
word may only be programmed once per write/erase cycle. For more details, see the "Flash: Minimum
Programming Word Size" advisory in the TMS320F2807x MCUs Silicon Errata .
54
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7.9.5 Emulation/JTAG
The JTAG port has five dedicated pins: TRST, TMS, TDI, TDO, and TCK. The TRST signal should always be
pulled down through a 2.2-kΩ pulldown resistor on the board. This MCU does not support the EMU0 and EMU1
signals that are present on 14-pin and 20-pin emulation headers. These signals should always be pulled up at
the emulation header through a pair of board pullup resistors ranging from 2.2 kΩ to 4.7 kΩ (depending on the
drive strength of the debugger ports). Typically, a 2.2-kΩ value is used.
See Figure 7-9 to see how the 14-pin JTAG header connects to the MCU’s JTAG port signals. Figure 7-10 shows
how to connect to the 20-pin header. The 20-pin JTAG header terminals EMU2, EMU3, and EMU4 are not used
and should be grounded.
The PD (Power Detect) terminal of the JTAG debug probe header should be connected to the board 3.3-V
supply. Header GND terminals should be connected to board ground. TDIS (Cable Disconnect Sense) should
also be connected to board ground. The JTAG clock should be looped from the header TCK output terminal back
to the RTCK input terminal of the header (to sense clock continuity by the JTAG debug probe). Header terminal
RESET is an open-drain output from the JTAG debug probe header that enables board components to be reset
through JTAG debug probe commands (available only through the 20-pin header).
Typically, no buffers are needed on the JTAG signals when the distance between the MCU target and the JTAG
header is smaller than 6 inches (15.24 cm), and no other devices are present on the JTAG chain. Otherwise,
each signal should be buffered. Additionally, for most JTAG debug probe operations at 10 MHz, no series
resistors are needed on the JTAG signals. However, if high emulation speeds are expected (35 MHz or so), 22-Ω
resistors should be placed in series on each JTAG signal.
For more information about hardware breakpoints and watchpoints, see Hardware Breakpoints and Watchpoints
for C28x in CCS.
For more information about JTAG emulation, see the XDS Target Connection Guide.
Distance between the header and the target
should be less than 6 inches (15.24 cm).
2.2 kW
TRST
GND
1
TMS
3
TDI
100 W
MCU
3.3 V
5
7
TDO
9
11
TCK
4.7 kW
3.3 V
13
TMS
TRST
TDI
TDIS
PD
KEY
2
4
6
TDO
GND
8
RTCK
GND
10
TCK
GND
12
EMU1
14
EMU0
GND
4.7 kW
3.3 V
Figure 7-9. Connecting to the 14-Pin JTAG Header
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Distance between the header and the target
should be less than 6 inches (15.24 cm).
2.2 kW
TRST
GND
1
TMS
3
TDI
100 W
MCU
3.3V
5
7
TDO
9
11
TCK
2
TMS
TRST
TDI
TDIS
PD
KEY
6
TDO
GND
8
RTCK
GND
10
TCK
GND
12
EMU0
EMU1
14
RESET
GND
EMU2
EMU3
EMU4
GND
4
GND
4.7 kW
3.3 V
4.7 kW
13
15
open
drain
17
19
A low pulse from the JTAG debug probe
can be tied with other reset sources
to reset the board.
GND
3.3 V
16
18
20
GND
Figure 7-10. Connecting to the 20-Pin JTAG Header
56
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7.9.5.1 JTAG Electrical Data and Timing
Section 7.9.5.1.1 lists the JTAG timing requirements. Section 7.9.5.1.2 lists the JTAG switching characteristics.
Figure 7-11 shows the JTAG timing.
7.9.5.1.1 JTAG Timing Requirements
NO.
MIN
1a
tw(TCKH)
Pulse duration, TCK high (40% of tc)
26.66
ns
1b
tw(TCKL)
Pulse duration, TCK low (40% of tc)
26.66
ns
tsu(TDI-TCKH)
Input setup time, TDI valid to TCK high
13
ns
tsu(TMS-TCKH)
Input setup time, TMS valid to TCK high
13
ns
th(TCKH-TDI)
Input hold time, TDI valid from TCK high
7
ns
th(TCKH-TMS)
Input hold time, TMS valid from TCK high
7
ns
4
66.66
UNIT
tc(TCK)
3
Cycle time, TCK
MAX
1
ns
7.9.5.1.2 JTAG Switching Characteristics
over recommended operating conditions (unless otherwise noted)
NO.
2
PARAMETER
td(TCKL-TDO)
Delay time, TCK low to TDO valid
MIN
MAX
6
25
UNIT
ns
1
1a
1b
TCK
2
TDO
3
4
TDI/TMS
Figure 7-11. JTAG Timing
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7.9.6 GPIO Electrical Data and Timing
The peripheral signals are multiplexed with general-purpose input/output (GPIO) signals. On reset, GPIO pins
are configured as inputs. For specific inputs, the user can also select the number of input qualification cycles to
filter unwanted noise glitches.
The GPIO module contains an Output X-BAR which allows an assortment of internal signals to be routed to a
GPIO in the GPIO mux positions denoted as OUTPUTXBARx. The GPIO module also contains an Input X-BAR
which is used to route signals from any GPIO input to different IP blocks such as the ADC(s), eCAP(s),
ePWM(s), and external interrupts. For more details, see the X-BAR chapter in the TMS320F2807x
Microcontrollers Technical Reference Manual .
7.9.6.1 GPIO - Output Timing
Section 7.9.6.1.1 shows the general-purpose output switching characteristics. Figure 7-12 shows the generalpurpose output timing.
7.9.6.1.1 General-Purpose Output Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
MAX
UNIT
tr(GPO)
Rise time, GPIO switching low to high
All GPIOs
8(1)
tf(GPO)
Fall time, GPIO switching high to low
All GPIOs
8(1)
ns
tfGPO
Toggling frequency, GPO pins
25
MHz
(1)
ns
Rise time and fall time vary with load. These values assume a 40-pF load.
GPIO
tr(GPO)
tf(GPO)
Figure 7-12. General-Purpose Output Timing
58
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7.9.6.2 GPIO - Input Timing
Section 7.9.6.2.1 shows the general-purpose input timing requirements. Figure 7-13 shows the sampling mode.
7.9.6.2.1 General-Purpose Input Timing Requirements
MIN
tw(SP)
Sampling period
tw(IQSW)
Input qualifier sampling window
tw(GPI) (2)
Pulse duration, GPIO low/high
(1)
(2)
MAX
UNIT
QUALPRD = 0
1tc(SYSCLK)
cycles
QUALPRD ≠ 0
2tc(SYSCLK) * QUALPRD
cycles
tw(SP) * (n(1) – 1)
cycles
2tc(SYSCLK)
cycles
tw(IQSW) + tw(SP) + 1tc(SYSCLK)
cycles
Synchronous mode
With input qualifier
"n" represents the number of qualification samples as defined by GPxQSELn register.
For tw(GPI), pulse width is measured from VIL to VIL for an active low signal and VIH to VIH for an active high signal.
(A)
GPIO Signal
GPxQSELn = 1,0 (6 samples)
1
1
0
0
0
0
0
0
0
1
tw(SP)
0
0
0
1
1
1
1
Sampling Window
1
1
1
1
Sampling Period determined
by GPxCTRL[QUALPRD]
tw(IQSW)
1
(SYSCLK cycle * 2 * QUALPRD) * 5
(B)
(C)
SYSCLK
QUALPRD = 1
(SYSCLK/2)
(D)
Output From
Qualifier
A. This glitch will be ignored by the input qualifier. The QUALPRD bit field specifies the qualification sampling period. It can vary from 00 to
0xFF. If QUALPRD = 00, then the sampling period is 1 SYSCLK cycle. For any other value "n", the qualification sampling period in 2n
SYSCLK cycles (that is, at every 2n SYSCLK cycles, the GPIO pin will be sampled).
B. The qualification period selected through the GPxCTRL register applies to groups of 8 GPIO pins.
C. The qualification block can take either three or six samples. The GPxQSELn Register selects which sample mode is used.
D. In the example shown, for the qualifier to detect the change, the input should be stable for 10 SYSCLK cycles or greater. In other words,
the inputs should be stable for (5 x QUALPRD x 2) SYSCLK cycles. This would ensure 5 sampling periods for detection to occur.
Because external signals are driven asynchronously, an 13-SYSCLK-wide pulse ensures reliable recognition.
Figure 7-13. Sampling Mode
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7.9.6.3 Sampling Window Width for Input Signals
The following section summarizes the sampling window width for input signals for various input qualifier
configurations.
Sampling frequency denotes how often a signal is sampled with respect to SYSCLK.
Sampling frequency = SYSCLK/(2 ´ QUALPRD), if QUALPRD ¹ 0
(1)
Sampling frequency = SYSCLK, if QUALPRD = 0
(2)
Sampling period = SYSCLK cycle ´ 2 ´ QUALPRD, if QUALPRD ¹ 0
(3)
In Equation 1, Equation 2, and Equation 3, SYSCLK cycle indicates the time period of SYSCLK.
Sampling period = SYSCLK cycle, if QUALPRD = 0
In a given sampling window, either 3 or 6 samples of the input signal are taken to determine the validity of the
signal. This is determined by the value written to GPxQSELn register.
Case 1:
Qualification using 3 samples
Sampling window width = (SYSCLK cycle × 2 × QUALPRD) × 2, if QUALPRD ≠ 0
Sampling window width = (SYSCLK cycle) × 2, if QUALPRD = 0
Case 2:
Qualification using 6 samples
Sampling window width = (SYSCLK cycle × 2 × QUALPRD) × 5, if QUALPRD ≠ 0
Sampling window width = (SYSCLK cycle) × 5, if QUALPRD = 0
Figure 7-14 shows the general-purpose input timing.
SYSCLK
GPIOxn
tw(GPI)
Figure 7-14. General-Purpose Input Timing
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7.9.7 Interrupts
Figure 7-15 provides a high-level view of the interrupt architecture.
As shown in Figure 7-15, the devices support five external interrupts (XINT1 to XINT5) that can be mapped onto
any of the GPIO pins.
In this device, 16 ePIE block interrupts are grouped into 1 CPU interrupt. In total, there are 12 CPU interrupt
groups, with 16 interrupts per group.
CPU1.TIMER0
LPM Logic
CPU1.WD
CPU1.LPMINT
CPU1.TINT0
CPU1.W AKEINT
NMI
CPU1.NMIWD
CPU1.W DINT
CPU1
GPIO0
GPIO1
...
...
GPIOx
INPUTXBAR4
Input
X-BAR
INPUTXBAR5
INPUTXBAR6
INPUTXBAR13
INPUTXBAR14
CPU1.XINT1 Control
CPU1.XINT2 Control
CPU1.XINT3 Control
CPU1.XINT4 Control
CPU1.XINT5 Control
INT1
to
INT12
CPU1.
ePIE
CPU1.TIMER1
CPU1.TIMER2
CPU1.TINT1
CPU1.TINT2
INT13
INT14
Peripherals
Figure 7-15. External and ePIE Interrupt Sources
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7.9.7.1 External Interrupt (XINT) Electrical Data and Timing
Section 7.9.7.1.1 lists the external interrupt timing requirements. Section 7.9.7.1.2 lists the external interrupt
switching characteristics. Figure 7-16 shows the external interrupt timing.
7.9.7.1.1 External Interrupt Timing Requirements
MIN
tw(INT)
(1)
Pulse duration, INT input low/high
MAX
UNIT(1)
Synchronous
2tc(SYSCLK)
cycles
With qualifier
tw(IQSW) + tw(SP) + 1tc(SYSCLK)
cycles
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
7.9.7.1.2 External Interrupt Switching Characteristics
over recommended operating conditions (unless otherwise noted)(1)
PARAMETER
td(INT) Delay time, INT low/high to interrupt-vector fetch(2)
(1)
(2)
MIN
MAX
UNIT
tw(IQSW) + 14tc(SYSCLK)
tw(IQSW) + tw(SP) + 14tc(SYSCLK)
cycles
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
This assumes that the ISR is in a single-cycle memory.
tw(INT)
XINT1, XINT2, XINT3,
XINT4, XINT5
td(INT)
Address bus
(internal)
Interrupt Vector
Figure 7-16. External Interrupt Timing
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7.9.8 Low-Power Modes
This device has three clock-gating low-power modes and a special power-gating mode.
Further details, as well as the entry and exit procedure, for all of the low-power modes can be found in the Low
Power Modes section of the TMS320F2807x Microcontrollers Technical Reference Manual .
7.9.8.1 Clock-Gating Low-Power Modes
IDLE, STANDBY, and HALT modes on this device are similar to those on other C28x devices. Table 7-5
describes the effect on the system when any of the clock-gating low-power modes are entered.
Table 7-5. Effect of Clock-Gating Low-Power Modes on the Device
MODULES/
CLOCK DOMAIN
CPU1 IDLE
CPU1 STANDBY
HALT
CPU1.CLKIN
Active
Gated
Gated
CPU1.SYSCLK
Active
Gated
Gated
CPU1.CPUCLK
Gated
Gated
Gated
Clock to modules Connected to
PERx.SYSCLK
Active
Gated
Gated
CPU1.WDCLK
Active
Active
Gated if CLKSRCCTL1.WDHALTI = 0
AUXPLLCLK
Active
Active
Gated
PLL
Powered
Powered
Software must power down PLL before entering
HALT
INTOSC1
Powered
Powered
Powered down if CLKSRCCTL1.WDHALTI = 0
INTOSC2
Powered
Powered
Powered down if CLKSRCCTL1.WDHALTI = 0
Flash
Powered
Powered
Software-Controlled
X1/X2 Crystal Oscillator
Powered
Powered
Powered-Down
7.9.8.2 Power-Gating Low-Power Modes
HIBERNATE mode is the lowest power mode on this device. It is a global low-power mode that gates the supply
voltages to most of the system. HIBERNATE is essentially a controlled power-down with remote wakeup
capability, and can be used to save power during long periods of inactivity. Table 7-6 describes the effects on the
system when the HIBERNATE mode is entered.
Table 7-6. Effect of Power-Gating Low-Power Mode on the Device
MODULES/POWER DOMAINS
HIBERNATE
M0 and M1 memories
●
●
Remain on with memory retention if LPMCR.M0M1MODE = 0x00
Are off when LPMCR.M0M1MODE = 0x01
CPU1 digital peripherals
Powered down
Dx, LSx, GSx memories
Power down, memory contents are lost
I/Os
On with output state preserved
Oscillators, PLL, analog
peripherals, Flash
Enters Low-Power Mode
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7.9.8.3 Low-Power Mode Wakeup Timing
Section 7.9.8.3.1 shows the IDLE mode timing requirements, Section 7.9.8.3.2 shows the switching
characteristics, and Figure 7-17 shows the timing diagram for IDLE mode.
7.9.8.3.1 IDLE Mode Timing Requirements
MIN
tw(WAKE)
(1)
Pulse duration, external wake-up signal
Without input qualifier
With input qualifier
MAX
2tc(SYSCLK)
UNIT(1)
cycles
2tc(SYSCLK) + tw(IQSW)
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
7.9.8.3.2 IDLE Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
Delay time, external wake signal to program execution resume (2)
•
td(WAKE-IDLE)
•
•
Wakeup from Flash
– Flash module in active state
Without input qualifier
Wakeup from Flash
– Flash module in sleep state
Without input qualifier
Wakeup from RAM
40tc(SYSCLK)
With input qualifier
With input qualifier
40tc(SYSCLK) + tw(WAKE)
6700tc(SYSCLK) (3)
6700tc(SYSCLK)
Without input qualifier
(3)
cycles
+ tw(WAKE)
25tc(SYSCLK)
With input qualifier
(1)
(2)
(3)
25tc(SYSCLK) + tw(WAKE)
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered
by the wake-up signal) involves additional latency.
This value is based on the flash power-up time, which is a function of the SYSCLK frequency, flash wait states (RWAIT), and
FPAC1[PSLEEP]. For more information, see the Flash and OTP Power-Down Modes and Wakeup section of the TMS320F2807x
Microcontrollers Technical Reference Manual . This value can be realized when SYSCLK is 120 MHz, RWAIT is 2, and
FPAC1[PSLEEP] is 0x860.
td(WAKE-IDLE)
Address/Data
(internal)
XCLKOUT
tw(WAKE)
WAKE
(A)
A. WAKE can be any enabled interrupt, WDINT or XRS. After the IDLE instruction is executed, a delay of five OSCCLK cycles (minimum) is
needed before the wake-up signal could be asserted.
Figure 7-17. IDLE Entry and Exit Timing Diagram
64
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Section 7.9.8.3.3 shows the STANDBY mode timing requirements, Section 7.9.8.3.4 shows the switching
characteristics, and Figure 7-18 shows the timing diagram for STANDBY mode.
7.9.8.3.3 STANDBY Mode Timing Requirements
MIN
tw(WAKE-INT)
(1)
Pulse duration, external
wake-up signal
QUALSTDBY = 0 | 2tc(OSCCLK)
QUALSTDBY > 0 |
(2 + QUALSTDBY)tc(OSCCLK) (1)
MAX
UNIT
3tc(OSCCLK)
cycles
(2 + QUALSTDBY) * tc(OSCCLK)
QUALSTDBY is a 6-bit field in the LPMCR register.
7.9.8.3.4 STANDBY Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(IDLE-XCOS)
TEST CONDITIONS
MIN
Delay time, IDLE instruction executed to
XCLKOUT stop
MAX
UNIT
16tc(INTOSC1)
cycles
Delay time, external wake signal to
program execution resume(1)
td(WAKE-STBY)
•
Wakeup from flash
– Flash module in active state
175tc(SYSCLK) + tw(WAKE-INT)
•
Wakeup from flash
– Flash module in sleep state
6700tc(SYSCLK) (2) + tw(WAKE-
•
(1)
(2)
cycles
INT)
3tc(OSC) + 15tc(SYSCLK) +
tw(WAKE-INT)
Wakeup from RAM
This is the time taken to begin execution of the instruction that immediately follows the IDLE instruction. Execution of an ISR (triggered
by the wake-up signal) involves additional latency.
This value is based on the flash power-up time, which is a function of the SYSCLK frequency, flash wait states (RWAIT), and
FPAC1[PSLEEP]. For more information, see the Flash and OTP Power-Down Modes and Wakeup section of the TMS320F2807x
Microcontrollers Technical Reference Manual . This value can be realized when SYSCLK is 120 MHz, RWAIT is 2, and
FPAC1[PSLEEP] is 0x860.
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(C)
(A)
(B)
Device
Status
(F)
(D)(E)
STANDBY
(G)
STANDBY
Normal Execution
Flushing Pipeline
Wake-up
Signal
tw(WAKE-INT)
td(WAKE-STBY)
OSCCLK
XCLKOUT
td(IDLE-XCOS)
A. IDLE instruction is executed to put the device into STANDBY mode.
B. The LPM block responds to the STANDBY signal, SYSCLK is held for a maximum 16 INTOSC1 clock cycles before being turned off.
This delay enables the CPU pipeline and any other pending operations to flush properly.
C. Clock to the peripherals are turned off. However, the PLL and watchdog are not shut down. The device is now in STANDBY mode. After
the IDLE instruction is executed, a delay of five OSCCLK cycles (minimum) is needed before the wake-up signal could be asserted.
D. The external wake-up signal is driven active.
E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal
must be free of glitches. If a noisy signal is fed to a GPIO pin, the wakeup behavior of the device will not be deterministic and the device
may not exit low-power mode for subsequent wakeup pulses.
F. After a latency period, the STANDBY mode is exited.
G. Normal execution resumes. The device will respond to the interrupt (if enabled).
Figure 7-18. STANDBY Entry and Exit Timing Diagram
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Section 7.9.8.3.5 shows the HALT mode timing requirements, Section 7.9.8.3.6 shows the switching
characteristics, and Figure 7-19 shows the timing diagram for HALT mode.
7.9.8.3.5 HALT Mode Timing Requirements
MIN
MAX
UNIT
tw(WAKE-GPIO)
Pulse duration, GPIO wake-up signal(1)
toscst + 2tc(OSCCLK)
cycles
tw(WAKE-XRS)
Pulse duration, XRS wake-up signal(1)
toscst + 8tc(OSCCLK)
cycles
(1)
For applications using X1/X2 for OSCCLK, the user must characterize their specific oscillator start-up time as it is dependent on circuit/
layout external to the device. See Section 7.9.3.4.2 for more information. For applications using INTOSC1 or INTOSC2 for OSCCLK,
see Section 7.9.3.5 for toscst. Oscillator start-up time does not apply to applications using a single-ended crystal on the X1 pin, as it is
powered externally to the device.
7.9.8.3.6 HALT Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(IDLE-XCOS)
MIN
Delay time, IDLE instruction executed to XCLKOUT stop
MAX
UNIT
16tc(INTOSC1)
cycles
Delay time, external wake signal end to CPU1 program
execution resume
td(WAKE-HALT)
(1)
•
Wakeup from flash
– Flash module in active state
75tc(OSCCLK)
•
Wakeup from flash
– Flash module in sleep state
17500tc(OSCCLK) (1)
•
Wakeup from RAM
cycles
75tc(OSCCLK)
This value is based on the flash power-up time, which is a function of the SYSCLK frequency, flash wait states (RWAIT), and
FPAC1[PSLEEP]. For more information, see the Flash and OTP Power-Down Modes and Wakeup section of the TMS320F2807x
Microcontrollers Technical Reference Manual . This value can be realized when SYSCLK is 120 MHz, RWAIT is 2, and
FPAC1[PSLEEP] is 0x860.
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(C)
(A)
(B)
Device
Status
(F)
(D)(E)
HALT
(G)
HALT
Flushing Pipeline
Normal
Execution
GPIOn
td(WAKE-HALT)
tw(WAKE-GPIO)
OSCCLK
Oscillator Start-up Time
XCLKOUT
td(IDLE-XCOS)
A. IDLE instruction is executed to put the device into HALT mode.
B. The LPM block responds to the HALT signal, SYSCLK is held for a maximum 16 INTOSC1 clock cycles before being turned off. This
delay enables the CPU pipeline and any other pending operations to flush properly.
C. Clocks to the peripherals are turned off and the PLL is shut down. If a quartz crystal or ceramic resonator is used as the clock source,
the internal oscillator is shut down as well. The device is now in HALT mode and consumes very little power. It is possible to keep the
zero-pin internal oscillators (INTOSC1 and INTOSC2) and the watchdog alive in HALT MODE. This is done by writing a 1 to
CLKSRCCTL1.WDHALTI. After the IDLE instruction is executed, a delay of five OSCCLK cycles (minimum) is needed before the wakeup signal could be asserted.
D. When the GPIOn pin (used to bring the device out of HALT) is driven low, the oscillator is turned on and the oscillator wakeup sequence
is initiated. The GPIO pin should be driven high only after the oscillator has stabilized. This enables the provision of a clean clock signal
during the PLL lock sequence. Because the falling edge of the GPIO pin asynchronously begins the wakeup procedure, care should be
taken to maintain a low noise environment prior to entering and during HALT mode.
E. The wake-up signal fed to a GPIO pin to wake up the device must meet the minimum pulse width requirement. Furthermore, this signal
must be free of glitches. If a noisy signal is fed to a GPIO pin, the wakeup behavior of the device will not be deterministic and the device
may not exit low-power mode for subsequent wakeup pulses.
F. When CLKIN to the core is enabled, the device will respond to the interrupt (if enabled), after some latency. The HALT mode is now
exited.
G. Normal operation resumes.
H. The user must relock the PLL upon HALT wakeup to ensure a stable PLL lock.
Figure 7-19. HALT Entry and Exit Timing Diagram
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Section 7.9.8.3.7 shows the HIBERNATE mode timing requirements, Section 7.9.8.3.8 shows the switching
characteristics, and Figure 7-20 shows the timing diagram for HIBERNATE mode.
7.9.8.3.7 HIBERNATE Mode Timing Requirements
MIN
MAX
UNIT
tw(HIBWAKE)
Pulse duration, HIBWAKE signal
40
µs
tw(WAKEXRS)
Pulse duration, XRS wake-up signal
40
µs
7.9.8.3.8 HIBERNATE Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
td(IDLE-XCOS)
Delay time, IDLE instruction executed to XCLKOUT stop
td(WAKE-HIB)
Delay time, external wake signal to lORestore function start
MIN
MAX
UNIT
30tc(SYSCLK)
cycles
1.5
ms
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(A)
(B)
(C)
(D)
(F)
(G)(H)
(I)(J)
(E)
Device Status Device Active
CPU1 IDLE
Instruction
CPU1 HIB
config
CPU1 Boot ROM
HIBERNATE
IoRestore() or Application Specific Operation
Td(WAKE-HIB)
GPIOHIBWAKEn,
XRSn
tw(HIBWAKEn),
tw(XRSn)
I/O Isolation
PLLs
Bypassed &
Powered -Down
Enabled
INTOSC1,INTOSC2,
X1/X2
Powered Down
On
XCLKCOUT
Application SpecificOperation
Powering up
On
Inactive
Application Specific Operation
td(IDLE-XCOS)
A. CPU1 does necessary application-specific context save to M0/M1 memories if required. This includes GPIO state if using I/O Isolation.
Configures the LPMCR register of CPU1 for HIBERNATE mode. Powers down Flash Pump/Bank, USB-PHY, CMPSS, DAC, and ADC
using their register configurations. The application should also power down the PLL and peripheral clocks before entering HIBERNATE.
B. IDLE instruction is executed to put the device into HIBERNATE mode.
C. The device is now in HIBERNATE mode. If configured, I/O isolation is turned on, M0 and M1 memories are retained. CPU1 is powered
down. Digital peripherals are powered down. The oscillators, PLLs, analog peripherals, and Flash are in their software-controlled LowPower modes. Dx, LSx, and GSx memories are also powered down, and their memory contents lost.
D. A falling edge on the GPIOHIBWAKEn pin will drive the wakeup of the devices clock sources INTOSC1, INTOSC2, and X1/X2 OSC. The
wakeup source must keep the GPIOHIBWAKEn pin low long enough to ensure full power-up of these clock sources.
E. After the clock sources are powered up, the GPIOHIBWAKEn must be driven high to trigger the wakeup sequence of the remainder of
the device.
F. The BootROM will then begin to execute. The BootROM can distinguish a HIBERNATE wakeup by reading the CPU1.REC.HIBRESETn
bit. After the TI OTP trims are loaded, the BootROM code will branch to the user-defined IoRestore function if it has been configured.
G. At this point, the device is out of HIBERNATE mode, and the application may continue.
H. The IoRestore function is a user-defined function where the application may reconfigure GPIO states, disable I/O isolation, reconfigure
the PLL, restore peripheral configurations, or branch to application code. This is up to the application requirements.
I. If the application has not branched to application code, the BootROM will continue after completing IoRestore. It will disable I/O isolation
automatically if it was not taken care of inside of IoRestore.
J. BootROM will then boot as determined by the HIBBOOTMODE register. Refer to the ROM Code and Peripheral Booting chapter of the
TMS320F2807x Microcontrollers Technical Reference Manual for more information.
Figure 7-20. HIBERNATE Entry and Exit Timing Diagram
Note
1. If the IORESTOREADDR is configured as the default value, the BootROM will continue its
execution to boot as determined by the HIBBOOTMODE register. Refer to the ROM Code and
Peripheral Booting chapter of the TMS320F2807x Microcontrollers Technical Reference Manual for
more information.
2. The user may choose to disable I/O Isolation at any point in the IoRestore function. Regardless if
the user has disabled Isolation in the IoRestore function or if IoRestore is not defined, the
BootROM will automatically disable isolation before booting as determined by the HIBBOOTMODE
register.
7.9.9 External Memory Interface (EMIF)
The EMIF provides a means of connecting the CPU to various external storage devices like asynchronous
memories (SRAM, NOR flash) or synchronous memory (SDRAM).
70
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7.9.9.1 Asynchronous Memory Support
The EMIF supports asynchronous memories:
• SRAMs
• NOR Flash memories
There is an external wait input that allows slower asynchronous memories to extend the memory access. The
EMIF module supports up to three chip selects ( EMIF_CS[4:2]). Each chip select has the following individually
programmable attributes:
• Data bus width
• Read cycle timings: setup, hold, strobe
• Write cycle timings: setup, hold, strobe
• Bus turnaround time
• Extended wait option with programmable time-out
• Select strobe option
7.9.9.2 Synchronous DRAM Support
The EMIF memory controller is compliant with the JESD21-C SDR SDRAMs that use a 32-bit or 16-bit data bus.
The EMIF has a single SDRAM chip select ( EMIF_CS[0]).
The address space of the EMIF, for the synchronous memory (SDRAM), lies beyond the 22-bit range of the
program address bus and can only be accessed through the data bus, which places a restriction on the C
compiler being able to work effectively on data in this space. Therefore, when using SDRAM, the user is advised
to copy data (using the DMA) from external memory to RAM before working on it. See the examples in
C2000Ware (C2000Ware for C2000 MCUs ) and the TMS320F2807x Microcontrollers Technical Reference
Manual .
SDRAM configurations supported are:
• One-bank, two-bank, and four-bank SDRAM devices
• Devices with 8-, 9-, 10-, and 11-column addresses
• CAS latency of two or three clock cycles
• 16-bit/32-bit data bus width
• 3.3-V LVCMOS interface
Additionally, the EMIF supports placing the SDRAM in self-refresh and power-down modes. Self-refresh mode
allows the SDRAM to be put in a low-power state while still retaining memory contents because the SDRAM will
continue to refresh itself even without clocks from the microcontroller. Power-down mode achieves even lower
power, except the microcontroller must periodically wake up and issue refreshes if data retention is required. The
EMIF module does not support mobile SDRAM devices.
On this device, the EMIF does not support burst access for SDRAM configurations. This means every access to
an external SDRAM device will have CAS latency.
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7.9.9.3 EMIF Electrical Data and Timing
Note
This device has one EMIF interface. In this section, EMx denotes EM1.
7.9.9.3.1 Asynchronous RAM
Section 7.9.9.3.1.1 shows the EMIF asynchronous memory timing requirements. Section 7.9.9.3.1.2 shows the
EMIF asynchronous memory switching characteristics. Figure 7-21 through Figure 7-24 show the EMIF
asynchronous memory timing diagrams.
7.9.9.3.1.1 EMIF Asynchronous Memory Timing Requirements
NO.(1)
MIN
MAX
UNIT
Reads and Writes
E
EMIF clock period
2
tw(EM_WAIT)
Pulse duration, EMxWAIT assertion and
deassertion
12
tsu(EMDV-EMOEH)
Setup time, EMxD[y:0] valid before EMxOE high
13
th(EMOEH-EMDIV)
Hold time, EMxD[y:0] valid after EMxOE high
tsu(EMOEL-EMWAIT)
Setup Time, EMxWAIT asserted before end of
Strobe Phase(2)
tc(SYSCLK)
ns
2E
ns
15
ns
0
ns
4E+20
ns
4E+20
ns
Reads
14
Writes
28
(1)
(2)
Setup Time, EMxWAIT asserted before end of
Strobe Phase(2)
tsu(EMWEL-EMWAIT)
E = EMxCLK period in ns.
Setup before end of STROBE phase (if no extended wait states are inserted) by which EMxWAIT must be asserted to add extended
wait states. Figure 7-22 and Figure 7-24 describe EMIF transactions that include extended wait states inserted during the STROBE
phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where
the HOLD phase would begin if there were no extended wait cycles.
7.9.9.3.1.2 EMIF Asynchronous Memory Switching Characteristics
NO.(1)
PARAMETER
(2) (3)
MIN
MAX
UNIT
(TA)*E–3
(TA)*E+2
ns
EMIF read cycle time (EW = 0)
(RS+RST+RH)*E–3
(RS+RST+RH)*E+2
ns
EMIF read cycle time (EW = 1)
(RS+RST+RH+
(EWC*16))*E–3
(RS+RST+RH+
(EWC*16))*E+2
ns
Output setup time, EMxCS[y:2] low
to EMxOE low (SS = 0)
(RS)*E–3
(RS)*E+2
ns
Output setup time, EMxCS[y:2] low
to EMxOE low (SS = 1)
–3
2
ns
Output hold time, EMxOE high to
EMxCS[y:2] high (SS = 0)
(RH)*E–3
(RH)*E
ns
Output hold time, EMxOE high to
EMxCS[y:2] high (SS = 1)
–3
0
ns
Reads and Writes
1
td(TURNAROUND)
Turn around time
Reads
3
4
5
72
tc(EMRCYCLE)
tsu(EMCEL-EMOEL)
th(EMOEH-EMCEH)
6
tsu(EMBAV-EMOEL)
Output setup time, EMxBA[y:0]
valid to EMxOE low
(RS)*E–3
(RS)*E+2
ns
7
th(EMOEH-EMBAIV)
Output hold time, EMxOE high to
EMxBA[y:0] invalid
(RH)*E–3
(RH)*E
ns
8
tsu(EMAV-EMOEL)
Output setup time, EMxA[y:0] valid
to EMxOE low
(RS)*E–3
(RS)*E+2
ns
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NO.(1)
SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
PARAMETER
(2) (3)
Output hold time, EMxOE high to
EMxA[y:0] invalid
9
th(EMOEH-EMAIV)
10
tw(EMOEL)
11
td(EMWAITH-EMOEH)
Delay time from EMxWAIT
deasserted to EMxOE high
29
tsu(EMDQMV-EMOEL)
30
th(EMOEH-EMDQMIV)
MIN
MAX
(RH)*E–3
(RH)*E
UNIT
ns
EMxOE active low width (EW = 0)
(RST)*E–1
(RST)*E+1
ns
EMxOE active low width (EW = 1)
(RST+(EWC*16))*E–1
(RST+(EWC*16))*E+1
ns
4E+10
5E+15
ns
Output setup time, EMxDQM[y:0]
valid to EMxOE low
(RS)*E–3
(RS)*E+2
ns
Output hold time, EMxOE high to
EMxDQM[y:0] invalid
(RH)*E–3
(RH)*E
ns
EMIF write cycle time (EW = 0)
(WS+WST+WH)*E–3
(WS+WST+WH)*E+1
ns
EMIF write cycle time (EW = 1)
(WS+WST+WH+
(EWC*16))*E–3
(WS+WST+WH+
(EWC*16))*E+1
ns
Output setup time, EMxCS[y:2] low
to EMxWE low (SS = 0)
(WS)*E–3
(WS)*E+1
ns
Output setup time, EMxCS[y:2] low
to EMxWE low (SS = 1)
–3
1
ns
Output hold time, EMxWE high to
EMxCS[y:2] high (SS = 0)
(WH)*E–3
(WH)*E
ns
Output hold time, EMxWE high to
EMxCS[y:2] high (SS = 1)
–3
0
ns
Writes
15
16
17
(2)
(3)
tsu(EMCEL-EMWEL)
th(EMWEH-EMCEH)
18
tsu(EMDQMV-EMWEL)
Output setup time, EMxDQM[y:0]
valid to EMxWE low
(WS)*E–3
(WS)*E+1
ns
19
th(EMWEH-EMDQMIV)
Output hold time, EMxWE high to
EMxDQM[y:0] invalid
(WH)*E–3
(WH)*E
ns
20
tsu(EMBAV-EMWEL)
Output setup time, EMxBA[y:0]
valid to EMxWE low
(WS)*E–3
(WS)*E+1
ns
21
th(EMWEH-EMBAIV)
Output hold time, EMxWE high to
EMxBA[y:0] invalid
(WH)*E–3
(WH)*E
ns
22
tsu(EMAV-EMWEL)
Output setup time, EMxA[y:0] valid
to EMxWE low
(WS)*E–3
(WS)*E+1
ns
23
th(EMWEH-EMAIV)
Output hold time, EMxWE high to
EMxA[y:0] invalid
(WH)*E–3
(WH)*E
ns
EMxWE active low width
(EW = 0)
(WST)*E–1
(WST)*E+1
ns
EMxWE active low width
(EW = 1)
(WST+(EWC*16))*E–1
(WST+(EWC*16))*E+1
ns
4E+10
5E+15
ns
24
(1)
tc(EMWCYCLE)
tw(EMWEL)
25
td(EMWAITH-EMWEH)
Delay time from EMxWAIT
deasserted to EMxWE high
26
tsu(EMDV-EMWEL)
Output setup time, EMxD[y:0] valid
to EMxWE low
(WS)*E–3
(WS)*E+1
ns
27
th(EMWEH-EMDIV)
Output hold time, EMxWE high to
EMxD[y:0] invalid
(WH)*E–3
(WH)*E
ns
TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold,
MEWC = Maximum external wait cycles. These parameters are programmed through the Asynchronous Bank and Asynchronous Wait
Cycle Configuration Registers. These support the following ranges of values: TA[4–1], RS[16–1], RST[64–4], RH[8–1], WS[16–1],
WST[64–1], WH[8–1], and MEWC[1–256]. See the TMS320F2807x Microcontrollers Technical Reference Manual for more information.
E = EMxCLK period in ns.
EWC = external wait cycles determined by EMxWAIT input signal. EWC supports the following range of values. EWC[256–1]. The
maximum wait time before time-out is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register. See the
TMS320F2807x Microcontrollers Technical Reference Manual for more information.
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3
1
EMxCS[y:2]
EMxBA[y:0]
EMxA[y:0]
EMxDQM[y:0]
4
8
5
9
6
29
7
30
10
EMxOE
13
12
EMxD[y:0]
EMxWE
Figure 7-21. Asynchronous Memory Read Timing
SETUP
Extended Due to EMxWAIT
STROBE
STROBE HOLD
EMxCS[y:2]
EMxBA[y:0]
EMxA[y:0]
EMxD[y:0]
14
11
EMxOE
2
EMxWAIT
Asserted
2
Deasserted
Figure 7-22. EMxWAIT Read Timing Requirements
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15
1
EMxCS[y:2]
EMxBA[y:0]
EMxA[y:0]
EMxDQM[y:0]
16
17
18
19
20
21
24
22
23
EMxWE
27
26
EMxD[y:0]
EMxOE
Figure 7-23. Asynchronous Memory Write Timing
SETUP
Extended Due to EMxWAIT
STROBE
STROBE HOLD
EMxCS[y:2]
EMxBA[y:0]
EMxA[y:0]
EMxD[y:0]
28
25
EMxWE
2
Asserted
EMxWAIT
2
Deasserted
Figure 7-24. EMxWAIT Write Timing Requirements
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7.9.9.3.2 Synchronous RAM
Section 7.9.9.3.2.1 shows the EMIF synchronous memory timing requirements. Section 7.9.9.3.2.2 shows the
EMIF synchronous memory switching characteristics. Figure 7-25 and Figure 7-26 show the synchronous
memory timing diagrams.
7.9.9.3.2.1 EMIF Synchronous Memory Timing Requirements
NO.
MIN
19
tsu(EMIFDV-EM_CLKH)
Input setup time, read data valid on EMxD[y:0] before EMxCLK rising
20
th(CLKH-DIV)
Input hold time, read data valid on EMxD[y:0] after EMxCLK rising
MAX
UNIT
2
ns
1.5
ns
7.9.9.3.2.2 EMIF Synchronous Memory Switching Characteristics
NO.
76
PARAMETER
MIN
10
ns
3
ns
1
tc(CLK)
Cycle time, EMIF clock EMxCLK
2
tw(CLK)
Pulse width, EMIF clock EMxCLK high or low
3
td(CLKH-CSV)
Delay time, EMxCLK rising to EMxCS[y:2] valid
4
toh(CLKH-CSIV)
Output hold time, EMxCLK rising to EMxCS[y:2] invalid
5
td(CLKH-DQMV)
Delay time, EMxCLK rising to EMxDQM[y:0] valid
6
toh(CLKH-DQMIV)
Output hold time, EMxCLK rising to EMxDQM[y:0] invalid
8
1
8
7
td(CLKH-AV)
Delay time, EMxCLK rising to EMxA[y:0] and EMxBA[y:0] valid
toh(CLKH-AIV)
Output hold time, EMxCLK rising to EMxA[y:0] and EMxBA[y:0] invalid
9
td(CLKH-DV)
Delay time, EMxCLK rising to EMxD[y:0] valid
toh(CLKH-DIV)
Output hold time, EMxCLK rising to EMxD[y:0] invalid
11
td(CLKH-RASV)
Delay time, EMxCLK rising to EMxRAS valid
12
toh(CLKH-RASIV)
Output hold time, EMxCLK rising to EMxRAS invalid
13
td(CLKH-CASV)
Delay time, EMxCLK rising to EMxCAS valid
14
toh(CLKH-CASIV)
Output hold time, EMxCLK rising to EMxCAS invalid
15
td(CLKH-WEV)
Delay time, EMxCLK rising to EMxWE valid
16
toh(CLKH-WEIV)
Output hold time, EMxCLK rising to EMxWE invalid
17
td(CLKH-DHZ)
Delay time, EMxCLK rising to EMxD[y:0] tri-stated
18
toh(CLKH-DLZ)
Output hold time, EMxCLK rising to EMxD[y:0] driving
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ns
ns
ns
8
1
ns
ns
8
ns
8
ns
1
ns
1
ns
8
1
ns
ns
8
1
ns
ns
8
1
UNIT
ns
1
8
10
MAX
ns
ns
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BASIC SDRAM
READ OPERATION
1
2
2
EMxCLK
4
3
EMxCS[y:2]
6
5
EMxDQM[y:0]
7
8
7
8
EMxBA[y:0]
EMxA[y:0]
19
2 EM_CLK Delay
17
20
18
EMxD[y:0]
11
12
EMxRAS
13
14
EMxCAS
EMxWE
Figure 7-25. Basic SDRAM Read Operation
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BASIC SDRAM
WRITE OPERATION
1
2
2
EMxCLK
4
3
EMxCS[y:2]
6
5
EMxDQM[y:0]
7
8
7
8
EMxBA[y:0]
EMxA[y:0]
9
10
EMxD[y:0]
11
12
EMxRAS
13
EMxCAS
15
16
EMxWE
Figure 7-26. Basic SDRAM Write Operation
78
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7.10 Analog Peripherals
The analog subsystem module is described in this section.
The analog modules on this device include the ADC, temperature sensor, buffered DAC, and CMPSS.
The analog subsystem has the following features:
• Flexible voltage references
– The ADCs are referenced to VREFHIx and VREFLOx pins.
• VREFHIx pin voltage must be driven in externally.
• The buffered DACs are referenced to VREFHIx and VSSA.
– Alternately, these DACs can be referenced to the VDAC pin and VSSA.
• The comparator DACs are referenced to VDDA and VSSA.
– Alternately, these DACs can be referenced to the VDAC pin and VSSA.
• Flexible pin usage
– Buffered DAC and comparator subsystem functions multiplexed with ADC inputs
• Internal connection to VREFLO on all ADCs for offset self-calibration
Figure 7-27 shows the Analog Subsystem Block Diagram for the 176-pin PTP package. Figure 7-28 shows the
Analog Subsystem Block Diagram for the 100-pin PZP package.
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VREFLOA
VREFLOA
TEMP SENSOR
CMPIN4P/ADCIN14
CMPIN4N/ADCIN15
REFHI
VREFHIA
VDAC
DACREFSEL
CMPIN1P
DAC12
CMPIN1N
12-bits
CTRIP1H
CTRIPOUT1H
Digital
Filter
CTRIP1L
CTRIPOUT1L
VSSA
VREFHIA
VDAC
DACREFSEL
VREFLOA
Digital
Filter
DAC12
ADC-A
REFLO
Comparator Subsystem 1
VDDA or VDAC
12-bit
Buffered
DAC
DACOUTB
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DACOUTA
VREFHIA
DACOUTA/ADCINA0
DACOUTB/ADCINA1
CMPIN1P/ADCINA2
CMPIN1N/ADCINA3
CMPIN2P/ADCINA4
CMPIN2N/ADCINA5
12-bit
Buffered
DAC
VREFHIB
CMPIN2P
Comparator Subsystem 2
VDDA or VDAC
Digital
Filter
CTRIP2H
CTRIPOUT2H
Digital
Filter
CTRIP2L
CTRIPOUT2L
DAC12
DAC12
CMPIN2N
VSSA
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VREFLOB
VREFLOB
REFHI
CMPIN3P
VREFHIB
DACOUTC
VDAC/ADCINB0
DACOUTC/ADCINB1
CMPIN3P/ADCINB2
CMPIN3N/ADCINB3
VDAC
DACREFSEL
ADC-B
12-bits
Comparator Subsystem 3
VDDA or VDAC
CMPIN3N
VSSA
CMPIN4P
Digital
Filter
CTRIP3L
CTRIPOUT3L
Comparator Subsystem 4
VDDA or VDAC
Digital
Filter
CTRIP4H
CTRIPOUT4H
Digital
Filter
CTRIP4L
CTRIPOUT4L
DAC12
REFLO
DAC12
VREFLOB
CTRIP3H
CTRIPOUT3H
DAC12
DAC12
12-bit
Buffered
DAC
Digital
Filter
CMPIN4N
CMPIN5P
Comparator Subsystem 5
VDDA or VDAC
CMPIN6P
CMPIN6N
CMPIN5P
Digital
Filter
CTRIP5H
CTRIPOUT5H
Digital
Filter
CTRIP5L
CTRIPOUT5L
DAC12
DAC12
CMPIN6P
Comparator Subsystem 6
VDDA or VDAC
Digital
Filter
CTRIP6H
CTRIPOUT6H
Digital
Filter
CTRIP6L
CTRIPOUT6L
DAC12
DAC12
CMPIN6N
VREFHID
CMPIN7P/ADCIND0
CMPIN7N/ADCIND1
CMPIN8P/ADCIND2
CMPIN8N/ADCIND3
ADCIND4
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
VREFLOD
VREFLOD
REFHI
CMPIN7P
Comparator Subsystem 7
VDDA or VDAC
CTRIP7H
CTRIPOUT7H
Digital
Filter
CTRIP7L
CTRIPOUT7L
DAC12
DAC12
ADC-D
12-bits
CMPIN7N
CMPIN8P
Comparator Subsystem 8
VDDA or VDAC
Digital
Filter
CTRIP8H
CTRIPOUT8H
Digital
Filter
CTRIP8L
CTRIPOUT8L
DAC12
REFLO
DAC12
VREFLOD
Digital
Filter
CMPIN8N
Figure 7-27. Analog Subsystem Block Diagram (176-Pin PTP)
80
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VREFHIA
VDAC
DACREFSEL
Digital
Filter
CTRIP1H
CTRIPOUT1H
DAC12
Digital
Filter
CTRIP1L
CTRIPOUT1L
VSSA
VREFHIA
VDAC
DACREFSEL
CMPIN2P
Comparator Subsystem 2
VDDA or VDAC
Digital
Filter
CTRIP2H
CTRIPOUT2H
Digital
Filter
CTRIP2L
CTRIPOUT2L
DAC12
12-bit
Buffered
DAC
VREFHIB
VREFLOB
VREFLOB
VDDA or VDAC
CMPIN1N
12-bits
REFLO
Comparator Subsystem 1
DAC12
ADC-A
VREFLOA
VDAC/ADCINB0
DACOUTC/ADCINB1
CMPIN3P/ADCINB2
CMPIN3N/ADCINB3
ADCINB4
ADCINB5
CMPIN1P
12-bit
Buffered
DAC
DACOUTB
TEMP SENSOR
CMPIN4P/ADCIN14
CMPIN4N/ADCIN15
REFHI
DAC12
CMPIN2N
VSSA
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
REFHI
VREFHIB
VDAC
DACREFSEL
ADC-B
12-bits
12-bit
Buffered
DAC
DACOUTC
VREFLOA
VREFLOA
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
DACOUTA
VREFHIA
DACOUTA/ADCINA0
DACOUTB/ADCINA1
CMPIN1P/ADCINA2
CMPIN1N/ADCINA3
CMPIN2P/ADCINA4
CMPIN2N/ADCINA5
CMPIN3P
Comparator Subsystem 3
VDDA or VDAC
CTRIP3H
CTRIPOUT3H
Digital
Filter
CTRIP3L
CTRIPOUT3L
DAC12
DAC12
CMPIN3N
VSSA
CMPIN4P
Comparator Subsystem 4
VDDA or VDAC
Digital
Filter
CTRIP4H
CTRIPOUT4H
Digital
Filter
CTRIP4L
CTRIPOUT4L
DAC12
REFLO
DAC12
VREFLOB
Digital
Filter
CMPIN4N
Figure 7-28. Analog Subsystem Block Diagram (100-Pin PZP)
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7.10.1 Analog-to-Digital Converter (ADC)
The ADCs on this device are successive approximation (SAR) style ADCs with 12-bit resolution. There are
multiple ADC modules which allow simultaneous sampling. The ADC wrapper is start-of-conversion (SOC)
based [see the SOC Principle of Operation section of the TMS320F2807x Microcontrollers Technical Reference
Manual .
Each ADC has the following features:
• 12-bit resolution
• Ratiometric external reference set by VREFHI and VREFLO
• Single-ended signal conversions
• Input multiplexer with up to 16 channels
• 16 configurable SOCs
• 16 individually addressable result registers
• Multiple trigger sources
– Software immediate start
– All ePWMs
– GPIO XINT2
– CPU timers
– ADCINT1 or 2
• Four flexible PIE interrupts
• Burst mode
• Four post-processing blocks, each with:
– Saturating offset calibration
– Error from setpoint calculation
– High, low, and zero-crossing compare, with interrupt and ePWM trip capability
– Trigger-to-sample delay capture
82
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Figure 7-29 shows the ADC module block diagram.
Analog to Digital Core
Analog to Digital Wrapper Logic
SIGNALMODE
RESOLUTION
CHSEL
ADCIN0
ADCIN1
ADCIN2
ADCIN3
ADCIN4
ADCIN5
ADCIN6
ADCIN7
ADCIN8
ADCIN9
ADCIN10
ADCIN11
ADCIN12
ADCIN13
ADCIN14
ADCIN15
[15:0]
ADCSOC
0
1
SOC
Arbitration
& Control
SOCx (0-15)
[15:0]
ACQPS
[15:0]
CHSEL
u
DOUT1
8
xV
2 IN-
9
EOCx[15:0]
xV1IN+
7
10
11
12
S/H Circuit
13
14
...
5
6
...
4
SOCxSTART[15:0]
2
3
ADCCOUNTER
TRIGGER[15:0]
SOC Delay
Timestamp
Converter
RESULT
+
ADCRESULT
0–15 Regs
15
TRIGSEL
Triggers
Input Circuit
SIGNALMODE
RESOLUTION
-
S
ADCPPBxOFFCAL
saturate
ADCPPBxOFFREF
-
+
S
VREFHI
ADCPPBxRESULT
Event
Logic
CONFIG
VREFLO
Reference Voltage Levels
Trigger
Timestamp
ADCEVT
ADCEVTINT
Post Processing Block (1-4)
Interrupt Block (1-4)
ADCINT1-4
Figure 7-29. ADC Module Block Diagram
7.10.1.1 ADC Configurability
Some ADC configurations are individually controlled by the SOCs, while others are controlled by each ADC
module. Table 7-7 summarizes the basic ADC options and their level of configurability.
Table 7-7. ADC Options and Configuration Levels
OPTIONS
CONFIGURABILITY
module(1)
Clock
By the
Resolution
Not configurable (12-bit resolution only)
Signal mode
Not configurable (single-ended signal mode only)
Reference voltage source
Not configurable (external reference only)
Trigger source
By the SOC(1)
Converted channel
By the SOC
Acquisition window duration
By the SOC(1)
EOC location
By the module
Burst mode
By the module(1)
(1)
Writing these values differently to different ADC modules could cause the ADCs to operate
asynchronously. For guidance on when the ADCs are operating synchronously or asynchronously,
see the Ensuring Synchronous Operation section of the Analog-to-Digital Converter (ADC) chapter
in the TMS320F2807x Microcontrollers Technical Reference Manual.
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7.10.1.1.1 Signal Mode
The ADC supports single-ended signaling. In single-ended mode, the input voltage to the converter is sampled
through a single pin (ADCINx), referenced to VREFLO. Figure 7-30 shows the single-ended signaling mode.
VREFHI
Pin Voltage
VREFHI
ADCINx
ADCINx
ADC
VREFHI/2
VREFLO
VREFLO
(VSSA)
2n - 1
Digital Output
ADC Vin
0
Figure 7-30. Single-ended Signaling Mode
84
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7.10.1.2 ADC Electrical Data and Timing
Section 7.10.1.2.1 shows the ADC operating conditions. Section 7.10.1.2.2 shows the ADC characteristics.
Section 7.10.1.2.3 shows the ADCEXTSOC timing requirements.
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7.10.1.2.1 ADC Operating Conditions
over recommended operating conditions (unless otherwise noted)
MIN
ADCCLK (derived from PERx.SYSCLK)
TYP
5
Sample window duration (set by ACQPS and PERx.SYSCLK)(1)
MAX
UNIT
50
MHz
100
ns
VREFHI
2.4
2.5 or 3.0
VDDA
V
VREFLO
VSSA
0
VSSA
V
2.4
VDDA
V
VREFLO
VREFHI
V
VREFHI – VREFLO
ADC input conversion range
(1)
The sample window must also be at least as long as 1 ADCCLK cycle for correct ADC operation.
Note
The ADC inputs should be kept below VDDA + 0.3 V during operation. If an ADC input exceeds this
level, the VREF internal to the device may be disturbed, which can impact results for other ADC or
DAC inputs using the same VREF.
Note
The VREFHI pin must be kept below VDDA + 0.3 V to ensure proper functional operation. If the VREFHI
pin exceeds this level, a blocking circuit may activate, and the internal value of VREFHI may float to 0 V
internally, giving improper ADC conversion or DAC output.
86
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7.10.1.2.2 ADC Characteristics
over recommended operating conditions (unless otherwise noted)(5)
PARAMETER
TEST CONDITIONS
ADC conversion cycles(1)
MIN
TYP
10.1
MAX
11
Power-up time
500
UNIT
ADCCLKs
µs
Gain error
–5
±3
5
LSBs
Offset error
–4
±2
4
LSBs
Channel-to-channel gain error
±4
LSBs
Channel-to-channel offset error
±2
LSBs
ADC-to-ADC gain error
Identical VREFHI and VREFLO for all ADCs
±4
LSBs
ADC-to-ADC offset error
Identical VREFHI and VREFLO for all ADCs
±2
LSBs
DNL(2)
INL
> –1
±0.5
1
LSBs
–2
±1.0
2
LSBs
SNR(3) (10)
VREFHI = 2.5 V, fin = 100 kHz
68.8
dB
THD(3) (10)
VREFHI = 2.5 V, fin = 100 kHz
–78.4
dB
SFDR(3) (10)
VREFHI = 2.5 V, fin = 100 kHz
79.2
dB
SINAD(3) (10)
VREFHI = 2.5 V, fin = 100 kHz
68.4
dB
VREFHI = 2.5 V, fin = 100 kHz,
single ADC(6), all packages
11.1
VREFHI = 2.5 V, fin = 100 kHz,
synchronous ADCs(7), all packages
11.1
VREFHI = 2.5 V, fin = 100 kHz,
asynchronous ADCs(8),
100-pin PZP package
Not
supported
VREFHI = 2.5 V, fin = 100 kHz,
asynchronous ADCs(8),
176-pin PTP package
9.7
PSRR
VDDA = 3.3-V DC + 200 mV
DC up to Sine at 1 kHz
60
dB
PSRR
VDDA = 3.3-V DC + 200 mV
Sine at 800 kHz
57
dB
ENOB(3) (10)
VREFHI = 2.5 V, synchronous ADCs(7), all
packages
ADC-to-ADC isolation(10) (4) (9)
–1
VREFHI = 2.5 V, asynchronous ADCs(8),
100-pin PZP package
VREFHI = 2.5 V, asynchronous ADCs(8),
176-pin PTP package
bits
1
Not
supported
–9
VREFHI input current
LSBs
9
130
µA
(1)
(2)
(3)
See Section 7.10.1.2.5.
No missing codes.
AC parameters will be impacted by clock source accuracy and jitter, this should be taken into account when selecting the clock source
for the system. The clock source used for these parameters was a high-accuracy external clock fed through the PLL. The on-chip
Internal Oscillator has higher jitter than an external crystal and these parameters will degrade if it is used as a clock source.
(4) Maximum DC code deviation due to operation of multiple ADCs simultaneously.
(5) Typical values are measured with VREFHI = 2.5 V and VREFLO = 0 V. Minimum and Maximum values are tested or characterized with
VREFHI = 2.5 V and VREFLO = 0 V.
(6) One ADC operating while all other ADCs are idle.
(7) All ADCs operating with identical ADCCLK, S+H durations, triggers, and resolution.
(8) Any ADCs operating with heterogeneous ADCCLK, S+H durations, triggers, or resolution.
(9) Value based on characterization.
(10) I/O activity is minimized on pins adjacent to ADC input and VREFHI pins as part of best practices to reduce capacitive coupling and
crosstalk.
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7.10.1.2.3 ADCEXTSOC Timing Requirements
MIN(1)
tw(INT)
(1)
Pulse duration, INT input low/high
MAX
UNIT
Synchronous
2tc(SYSCLK)
cycles
With qualifier
tw(IQSW) + tw(SP) + 1tc(SYSCLK)
cycles
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
7.10.1.2.4 ADC Input Model
Note
ADC channels ADCINA0, ADCINA1, and ADCINB1 have a 50-kΩ pulldown resistor to VSSA.
7.10.1.2.4.1 Single-Ended Input Model Parameters
DESCRIPTION
Cp
VALUE
Parasitic input capacitance
See Table 7-8
Ron
Sampling switch resistance
Ch
Sampling capacitor
Rs
Nominal source impedance
600 Ω
16.5 pF
50 Ω
ADC
Rs
ADCINx
Switch
AC
Ron
Cp
Ch
VREFLO
Figure 7-31. Single-Ended Input Model
88
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Table 7-8 shows the parasitic capacitance on each channel. Also, enabling a comparator adds approximately
1.4 pF of capacitance on positive comparator inputs and 2.5 pF of capacitance on negative comparator inputs.
Table 7-8. Per-Channel Parasitic Capacitance
ADC CHANNEL
(1)
Cp (pF)
COMPARATOR DISABLED
COMPARATOR ENABLED
ADCINA0
12.9
N/A
ADCINA1
10.3
N/A
ADCINA2
5.9
7.3
ADCINA3
6.3
8.8
ADCINA4
5.9
7.3
ADCINA5
6.3
8.8
ADCINB0(1)
117.0
N/A
ADCINB1
10.6
N/A
ADCINB2
5.9
7.3
ADCINB3
6.2
8.7
ADCINB4
5.2
N/A
ADCINB5
5.1
N/A
ADCIND0
5.3
6.7
ADCIND1
5.7
8.2
ADCIND2
5.3
6.7
ADCIND3
5.6
8.1
ADCIND4
4.3
N/A
ADCIN14
8.6
10.0
ADCIN15
9.0
11.5
The increased capacitance is due to VDAC functionality.
This input model should be used along with actual signal source impedance to determine the acquisition window
duration. See the Choosing an Acquisition Window Duration section of the TMS320F2807x Microcontrollers
Technical Reference Manual for more information.
The user should analyze the ADC input setting assuming worst-case initial conditions on Ch. This will require
assuming that Ch could start the S+H window completely charged to VREFHI or completely discharged to VREFLO.
When the ADC transitions from an odd-numbered channel to an even-numbered channel, or vice-versa, the
actual initial voltage on Ch will be close to being completely discharged to VREFLO. For even-to-even or odd-toodd channel transitions, the initial voltage on Ch will be close to the voltage of the previously converted channel.
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7.10.1.2.5 ADC Timing Diagrams
Section 7.10.1.2.5.1 lists the ADC timings in 12-bit mode (SYSCLK cycles). Figure 7-32 shows the ADC
conversion timings for two SOCs given the following assumptions:
• SOC0 and SOC1 are configured to use the same trigger.
• No other SOCs are converting or pending when the trigger occurs.
• The round robin pointer is in a state that causes SOC0 to convert first.
• ADCINTSEL is configured to set an ADCINT flag upon end of conversion for SOC0 (whether this flag
propagates through to the CPU to cause an interrupt is determined by the configurations in the PIE module).
Table 7-9 lists the descriptions of the ADC timing parameters that are in Figure 7-32 .
Table 7-9. ADC Timing Parameters
PARAMETER
DESCRIPTION
The duration of the S+H window.
tSH
At the end of this window, the value on the S+H capacitor becomes the voltage to be converted into a digital
value. The duration is given by (ACQPS + 1) SYSCLK cycles. ACQPS can be configured individually for each
SOC, so tSH will not necessarily be the same for different SOCs.
Note: The value on the S+H capacitor will be captured approximately 5 ns before the end of the S+H window
regardless of device clock settings.
The time from the end of the S+H window until the ADC conversion results latch in the ADCRESULTx register.
tLAT
tEOC
If the ADCRESULTx register is read before this time, the previous conversion results will be returned.
The time from the end of the S+H window until the next ADC conversion S+H window can begin. The
subsequent sample can start before the conversion results are latched.
The time from the end of the S+H window until an ADCINT flag is set (if configured).
tINT
If the INTPULSEPOS bit in the ADCCTL1 register is set, tINT will coincide with the conversion results being
latched into the result register.
If the INTPULSEPOS bit is 0, tINT will coincide with the end of the S+H window. If tINT triggers a read of the
ADC result register (directly through DMA or indirectly by triggering an ISR that reads the result), care must be
taken to ensure the read occurs after the results latch (otherwise, the previous results will be read).
90
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7.10.1.2.5.1 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
ADCCLK PRESCALE
ADCCTL2
[PRESCALE]
(1)
ADCCLK
CYCLES
SYSCLK CYCLES
RATIO
ADCCLK:SYSCLK
tEOC
tLAT (1)
0
1
11
13
1
1.5
tINT(EARLY)
tINT(LATE)
tEOC
1
11
11.0
Invalid
2
2
21
23
1
21
10.5
3
2.5
26
28
1
26
10.4
4
3
31
34
1
31
10.3
5
3.5
36
39
1
36
10.3
6
4
41
44
1
41
10.3
7
4.5
46
49
1
46
10.2
8
5
51
55
1
51
10.2
9
5.5
56
60
1
56
10.2
10
6
61
65
1
61
10.2
11
6.5
66
70
1
66
10.2
12
7
71
76
1
71
10.1
13
7.5
76
81
1
76
10.1
14
8
81
86
1
81
10.1
15
8.5
86
91
1
86
10.1
Refer to the "ADC: DMA Read of Stale Result" advisory in the TMS320F2807x MCUs Silicon Errata .
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Sample n
Input on SOC0.CHSEL
Input on SOC1.CHSEL
Sample n+1
ADC S+H
SOC0
SOC1
SYSCLK
ADCCLK
ADCTRIG
ADCSOCFLG.SOC0
ADCSOCFLG.SOC1
ADCRESULT0
(old data)
ADCRESULT1
(old data)
Sample n
Sample n+1
ADCINTFLG.ADCINTx
tSH
tLAT
tEOC
tINT
Figure 7-32. ADC Timings for 12-Bit Mode
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7.10.1.3 Temperature Sensor Electrical Data and Timing
The temperature sensor can be used to measure the device junction temperature. The temperature sensor is
sampled through an internal connection to the ADC and translated into a temperature through TI-provided
software. When sampling the temperature sensor, the ADC must meet the acquisition time in Section 7.10.1.3.1.
7.10.1.3.1 Temperature Sensor Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
Temperature accuracy
±15
°C
Start-up time (TSNSCTL[ENABLE] to sampling temperature sensor)
500
µs
ADC acquisition time
700
ns
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7.10.2 Comparator Subsystem (CMPSS)
Each CMPSS module includes two comparators, two internal voltage reference DACs (CMPSS DACs), two
digital glitch filters, and one ramp generator. There are two inputs, CMPINxP and CMPINxN. Each of these
inputs will be internally connected to an ADCIN pin. The CMPINxP pin is always connected to the positive input
of the CMPSS comparators. CMPINxN can be used instead of the DAC output to drive the negative comparator
inputs. There are two comparators, and therefore two outputs from the CMPSS module, which are connected to
the input of a digital filter module before being passed on to the Comparator TRIP crossbar and either PWM
modules or directly to a GPIO pin. Figure 7-33 shows CMPSS connectivity on the 176-pin PTP package. Figure
7-34 shows CMPSS connectivity on the 100-pin PZP package.
Comparator Subsystem 1
CMPIN1P Pin
VDDA or VDAC
Digital
Filter
CTRIP1H
CTRIPOUT1H
DAC12
DAC12
CMPIN1N Pin
Digital
Filter
CTRIP1L
CTRIPOUT1L
Comparator Subsystem 2
CMPIN2P Pin
VDDA or VDAC
Digital
Filter
CTRIP2H
CTRIPOUT2H
Digital
Filter
CTRIP2L
CTRIPOUT2L
CTRIP1H
CTRIP1L
CTRIP2H
CTRIP2L
ePWM X-BAR
ePWMs
Output X-BAR
GPIO Mux
CTRIP8H
CTRIP8L
DAC12
DAC12
CMPIN2N Pin
Comparator Subsystem 8
CMPIN8P Pin
VDDA or VDAC
Digital
Filter
CTRIP8H
CTRIPOUT8H
CTRIPOUT8H
CTRIPOUT8L
DAC12
DAC12
CMPIN8N Pin
CTRIPOUT1H
CTRIPOUT1L
CTRIPOUT2H
CTRIPOUT2L
Digital
Filter
CTRIP8L
CTRIPOUT8L
Figure 7-33. CMPSS Connectivity (176-Pin PTP)
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CMPIN1P Pin
SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
Comparator Subsystem 1
Digital
Filter
VDDA or VDAC
CTRIP1H
CTRIPOUT1H
DAC12
DAC12
Digital
Filter
CMPIN1N Pin
CMPIN2P Pin
CTRIP1L
CTRIPOUT1L
Comparator Subsystem 2
VDDA or VDAC
Digital
Filter
CTRIP2H
CTRIPOUT2H
Digital
Filter
CTRIP2L
CTRIPOUT2L
CTRIP1H
CTRIP1L
CTRIP2H
CTRIP2L
CTRIP3H
CTRIP3L
CTRIP4H
CTRIP4L
ePWM X-BAR
ePWMs
CTRIPOUT1H
CTRIPOUT1L
CTRIPOUT2H
CTRIPOUT2L
CTRIPOUT3H
CTRIPOUT3L
CTRIPOUT4H
CTRIPOUT4L
Output X-BAR
GPIO Mux
DAC12
DAC12
CMPIN2N Pin
CMPIN3P Pin
Comparator Subsystem 3
VDDA or VDAC
Digital
Filter
CTRIP3H
CTRIPOUT3H
Digital
Filter
CTRIP3L
CTRIPOUT3L
DAC12
DAC12
CMPIN3N Pin
CMPIN4P Pin
Comparator Subsystem 4
VDDA or VDAC
Digital
Filter
CTRIP4H
CTRIPOUT4H
Digital
Filter
CTRIP4L
CTRIPOUT4L
DAC12
DAC12
CMPIN4N Pin
Figure 7-34. CMPSS Connectivity (100-Pin PZP)
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7.10.2.1 CMPSS Electrical Data and Timing
Section 7.10.2.1.1 shows the comparator electrical characteristics. Figure 7-35 shows the CMPSS comparator
input referred offset. Figure 7-36 shows the CMPSS comparator hysteresis.
7.10.2.1.1 Comparator Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
500(2)
µs
0
VDDA
V
–20
20
Power-up time
Comparator input (CMPINxx) range
Low common mode, inverting input set
to 50 mV
Input referred offset error
Hysteresis(1)
Response time (delay from CMPINx input change
to output on ePWM X-BAR or Output X-BAR)
1x
12
2x
24
3x
36
4x
48
Step response
21
Ramp response (1.65 V/µs)
26
Ramp response (8.25 mV/µs)
(2)
CMPSS
DAC LSB
60
ns
30
Common Mode Rejection Ratio (CMRR)
(1)
mV
40
dB
The CMPSS DAC is used as the reference to determine how much hysteresis to apply. Therefore, hysteresis will scale with the
CMPSS DAC reference voltage. Hysteresis is available for all comparator input source configurations.
See the "Analog Bandgap References" advisory of the TMS320F2807x MCUs Silicon Errata .
Note
The CMPSS inputs must be kept below VDDA + 0.3 V to ensure proper functional operation. If a
CMPSS input exceeds this level, an internal blocking circuit will isolate the internal comparator from
the external pin until the external pin voltage returns below VDDA + 0.3 V. During this time, the internal
comparator input will be floating and can decay below VDDA within approximately 0.5 µs. After this
time, the comparator could begin to output an incorrect result depending on the value of the other
comparator input.
Input Referred Offset
CTRIPx
Logic Level
CTRIPx = 1
CTRIPx = 0
0
CMPINxN or
DACxVAL
COMPINxP
Voltage
Figure 7-35. CMPSS Comparator Input Referred Offset
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Hysteresis
CTRIPx
Logic Level
CTRIPx = 1
CTRIPx = 0
0
CMPINxN or
DACxVAL
COMPINxP
Voltage
Figure 7-36. CMPSS Comparator Hysteresis
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Section 7.10.2.1.2 shows the CMPSS DAC static electrical characteristics. Figure 7-37 shows the CMPSS DAC
static offset. Figure 7-38 shows the CMPSS DAC static gain. Figure 7-39 shows the CMPSS DAC static linearity.
7.10.2.1.2 CMPSS DAC Static Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Internal reference
0
External reference
0
VDAC
Static offset error(2)
–25
25
mV
Static gain error(2)
–2
2
% of FSR
CMPSS DAC output range
VDDA
UNIT
(1)
V
Static DNL
Endpoint corrected
>–1
4
LSB
Static INL
Endpoint corrected
–16
16
LSB
Settling time
Settling to 1 LSB after full-scale output
change
1
µs
Resolution
12
CMPSS DAC output disturbance(3)
Error induced by comparator trip or
CMPSS DAC code change within the
same CMPSS module
–100
CMPSS DAC disturbance time(3)
100
200
VDAC reference voltage
When VDAC is reference
VDAC load(4)
When VDAC is reference
(1)
(2)
(3)
(4)
bits
2.4
2.5 or 3.0
6
LSB
ns
VDDA
V
kΩ
The maximum output voltage is VDDA when VDAC > VDDA.
Includes comparator input referred errors.
Disturbance error may be present on the CMPSS DAC output for a certain amount of time after a comparator trip.
Per active CMPSS module.
Offset Error
Figure 7-37. CMPSS DAC Static Offset
98
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Ideal Gain
Actual Gain
Actual Linear Range
Figure 7-38. CMPSS DAC Static Gain
Linearity Error
Figure 7-39. CMPSS DAC Static Linearity
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7.10.3 Buffered Digital-to-Analog Converter (DAC)
The buffered DAC module consists of an internal 12-bit DAC and an analog output buffer that is capable of
driving an external load. An integrated pulldown resistor on the DAC output helps to provide a known pin voltage
when the output buffer is disabled. This pulldown resistor cannot be disabled and remains as a passive
component on the pin, even for other shared pin mux functions. Software writes to the DAC value register can
take effect immediately or can be synchronized with EPWMSYNCPER events.
Each buffered DAC has the following features:
• 12-bit programmable internal DAC
• Selectable reference voltage
• Pulldown resistor on output
• Ability to synchronize with EPWMSYNCPER
The block diagram for the buffered DAC is shown in Figure 7-40.
DACCTL[DACREFSEL]
VDAC
0
DACREF
VREFHI 1
VDDA
SYSCLK
>
DACVALS
D Q
DACCTL[LOADMODE]
0
DACVALA
D Q
EPWM1SYNCPER 0
EPWM2SYNCPER 1
EPWM3SYNCPER 2
...
Y
EPWMnSYNCPER n-1
1
12-bit
DAC
Buffer
DACOUT
RPD
EN
VSSA
VSSA
DACCTL[SYNCSEL]
Figure 7-40. DAC Module Block Diagram
100
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7.10.3.1 Buffered DAC Electrical Data and Timing
Section 7.10.3.1.1 shows the buffered DAC electrical characteristics. Figure 7-41 shows the buffered DAC offset.
Figure 7-42 shows the buffered DAC gain. Figure 7-43 shows the buffered DAC linearity.
7.10.3.1.1 Buffered DAC Electrical Characteristics
over recommended operating conditions (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
Power-up time
Offset error
Midpoint
–10
Gain error(2)
–2.5
MAX
UNIT
500(8)
µs
10
mV
2.5
% of FSR
DNL(3)
Endpoint corrected
> –1
±0.4
1
LSB
INL
Endpoint corrected
–5
±2
5
LSB
DACOUTx settling time
Settling to 2 LSBs after 0.3V-to-3V
transition
Resolution
Voltage output
range(4)
Output drive capability
Resistive load
Output drive capability
Reference input resistance(6)
Output noise
12
bits
VDDA – 0.3
V
100
pF
5
RPD pulldown resistor
Reference
µs
0.3
Capacitive load
voltage(5)
2
kΩ
50
VDAC or VREFHI
2.4
2.5 or 3.0
kΩ
VDDA
V
VDAC or VREFHI
170
Integrated noise from 100 Hz to 100 kHz
500
µVrms
Noise density at 10 kHz
711
nVrms/√Hz
1.5
V-ns
Glitch energy
kΩ
DC up to 1 kHz
70
100 kHz
30
SNR
1020 Hz
67
dB
THD
1020 Hz
–63
dB
PSRR(7)
SFDR
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
1020 Hz, including harmonics and spurs
1020 Hz, including only spurs
66
104
dB
dBc
Typical values are measured with VREFHI = 3.3 V unless otherwise noted. Minimum and Maximum values are tested or characterized
with VREFHI = 2.5 V.
Gain error is calculated for linear output range.
The DAC output is monotonic.
This is the linear output range of the DAC. The DAC can generate voltages outside this range, but the output voltage will not be linear
due to the buffer.
For best PSRR performance, VDAC or VREFHI should be less than VDDA.
Per active Buffered DAC module.
VREFHI = 3.2 V, VDDA = 3.3 V DC + 100 mV Sine.
See the "Analog Bandgap References" advisory of the TMS320F2807x MCUs Silicon Errata .
Note
The VDAC pin must be kept below VDDA + 0.3 V to ensure proper functional operation. If the VDAC
pin exceeds this level, a blocking circuit may activate, and the internal value of VDAC may float to 0 V
internally, giving improper DAC output.
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Note
The VREFHI pin must be kept below VDDA + 0.3 V to ensure proper functional operation. If the VREFHI
pin exceeds this level, a blocking circuit may activate, and the internal value of VREFHI may float to 0 V
internally, giving improper ADC conversion or DAC output.
Offset Error
Code 2048
Figure 7-41. Buffered DAC Offset
Actual Gain
Ideal Gain
Code 3722
Code 373
Linear Range
(3.3-V Reference)
Figure 7-42. Buffered DAC Gain
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Linearity Error
Code 3722
Code 373
Linear Range
(3.3-V Reference)
Figure 7-43. Buffered DAC Linearity
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7.11 Control Peripherals
Note
For the actual number of each peripheral on a specific device, see Table 5-1.
7.11.1 Enhanced Capture (eCAP)
The eCAP module can be used in systems where accurate timing of external events is important.
Applications for eCAP include:
• Speed measurements of rotating machinery (for example, toothed sprockets sensed through Hall sensors)
• Elapsed time measurements between position sensor pulses
• Period and duty cycle measurements of pulse train signals
• Decoding current or voltage amplitude derived from duty cycle encoded current/voltage sensors
The eCAP module includes the following features:
• 4-event time-stamp registers (each 32 bits)
• Edge-polarity selection for up to four sequenced time-stamp capture events
• Interrupt on either of the four events
• Single shot capture of up to four event timestamps
• Continuous mode capture of timestamps in a four-deep circular buffer
• Absolute time-stamp capture
• Difference (Delta) mode time-stamp capture
• All of the above resources dedicated to a single input pin
• When not used in capture mode, the eCAP module can be configured as a single-channel PWM output
(APWM).
The eCAP inputs connect to any GPIO input through the Input X-BAR. The APWM outputs connect to GPIO pins
through the Output X-BAR to OUTPUTx positions in the GPIO mux. See Section 6.4.2 and Section 6.4.3.
Figure 7-44 shows the block diagram of an eCAP module.
104
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SYNC
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SYNCIn
CTRPHS
(phase register−32 bit)
SYNCOut
TSCTR
(counter−32 bit)
APWM mode
OVF
RST
CTR_OVF
Delta−mode
CTR [0−31]
PRD [0−31]
CMP [0−31]
PWM
compare
logic
32
CTR=PRD
CTR [0−31]
CTR=CMP
32
32
CAP1
(APRD active)
APRD
shadow
32
LD
LD1
MODE SELECT
PRD [0−31]
Polarity
select
32
CMP [0−31]
32
CAP2
(ACMP active)
32
LD
LD2
Polarity
select
Event
qualifier
ACMP
shadow
32
CAP3
(APRD shadow)
LD
32
CAP4
(ACMP shadow)
LD
eCAPx
Event
Prescale
Polarity
select
LD3
LD4
Polarity
select
4
Capture events
4
CEVT[1:4]
to PIE
Interrupt
Trigger
and
Flag
control
CTR_OVF
Continuous /
Oneshot
Capture Control
CTR=PRD
CTR=CMP
Figure 7-44. eCAP Block Diagram
The eCAP module is clocked by PERx.SYSCLK.
The clock enable bits (ECAP1–ECAP6) in the PCLKCR3 register turn off the eCAP module individually (for lowpower operation). Upon reset, ECAP1ENCLK is set to low, indicating that the peripheral clock is off.
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7.11.1.1 eCAP Electrical Data and Timing
Section 7.11.1.1.1 shows the eCAP timing requirement and Section 7.11.1.1.2 shows the eCAP switching
characteristics.
7.11.1.1.1 eCAP Timing Requirement
MIN(1)
Asynchronous
tw(CAP)
Capture input pulse width
Synchronous
With input qualifier
(1)
MAX
2tc(SYSCLK)
UNIT
cycles
2tc(SYSCLK)
cycles
1tc(SYSCLK) + tw(IQSW)
cycles
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
7.11.1.1.2 eCAP Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(APWM)
106
Pulse duration, APWMx output high/low
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MIN
20
MAX
UNIT
ns
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7.11.2 Enhanced Pulse Width Modulator (ePWM)
The ePWM peripheral is a key element in controlling many of the power electronic systems found in both
commercial and industrial equipment. The ePWM type-4 module is able to generate complex pulse width
waveforms with minimal CPU overhead by building the peripheral up from smaller modules with separate
resources that can operate together to form a system. Some of the highlights of the ePWM type-4 module
include complex waveform generation, dead-band generation, a flexible synchronization scheme, advanced tripzone functionality, and global register reload capabilities.
Figure 7-45 shows the signal interconnections with the ePWM. Figure 7-46 shows the ePWM trip input
connectivity.
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TBCTL2[SYNCOSELX]
Time-Base (TB)
Disable
CTR=CMPC
CTR=CMPD
Rsvd
TBPRD Shadow (24)
TBPRDHR (8)
TBPRD Active (24)
8
CTR=PRD
00
01
10
11
CTR=ZERO
CTR=CMPB
TBCTL[SWFSYNC]
Sync
Out
Select
EPWMxSYNCO
EPWMxSYNCI
TBCTL[PHSEN]
TBCTL[SYNCOSEL]
Counter
Up/Down
(16 Bit)
(A)
DCAEVT1.sync
(A)
DCBEVT1.sync
CTR=ZERO
TBCTR
Active (16)
CTR_Dir
CTR=PRD
TBPHSHR (8)
16
8
TBPHS Active (24)
EPWMx_INT
CTR=ZERO
CTR=PRD or ZERO
Phase
Control
CTR=CMPA
CTR=CMPB
CTR=CMPC
CTR=CMPD
Counter Compare (CC)
CTR=CMPA
Event
Trigger
and
Interrupt
(ET)
EPWMxSOCA
EPWMxSOCB
ADCSOCOUTSELECT
CTR_Dir
Action
Qualifier
(AQ)
DCAEVT1.soc
DCBEVT1.soc
CMPAHR (8)
Select and pulse stretch
for external ADC
(A)
(A)
ADCSOCAO
ADCSOCBO
16
CMPA Active (24)
CMPA Shadow (24)
ePWMxA
EPWMA
Dead
Band
(DB)
CMPBHR (8)
16
HiRes PWM (HRPWM)
CMPAHR (8)
CTR=CMPB
On-chip
ADC
PWM
Chopper
(PC)
Trip
Zone
(TZ)
ePWMxB
EPWMB
CMPB Active (24)
CMPB Shadow (24)
CMPBHR (8)
EPWMx_TZ_INT
TBCNT(16)
CTR=CMPC
CMPC[15-0]
16
CMPC Active (16)
TZ1 to TZ3
EMUSTOP
CTR=ZERO
DCAEVT1.inter
DCBEVT1.inter
DCAEVT2.inter
DCBEVT2.inter
CLOCKFAIL
EQEPxERR
DCAEVT1.force
CMPC Shadow (16)
DCAEVT2.force
DCBEVT1.force
DCBEVT2.force
TBCNT(16)
(A)
(A)
(A)
(A)
CTR=CMPD
CMPD[15-0]
16
CMPD Active (16)
CMPD Shadow (16)
Copyright © 2017, Texas Instruments Incorporated
A. These events are generated by the ePWM digital compare (DC) submodule based on the levels of the TRIPIN inputs.
Figure 7-45. ePWM Submodules and Critical Internal Signal Interconnects
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INPUT14
INPUT13
Input X-Bar
INPUT1
INPUT2
INPUT3
INPUT4
INPUT5
INPUT6
GPIOx
Async/
Sync/
Sync+Filter
PIE(s),
CLA(s)
XINT5
XINT4
INPUT7
INPUT8
INPUT9
INPUT10
INPUT11
INPUT12
GPIO0
eCAP6
eCAP5
PIE(s),
CLA(s)
XINT1
eCAP4
XINT2
eCAP3
XINT3
eCAP2
eCAP1
ADC
EXTSYNCIN1
Wrapper(s)
ePWM and eCAP
Sync Chain
EXTSYNCIN2
TZ1
TZ2
TZ3
TRIP1
TRIP2
TRIP3
TRIP6
ePWM
X-Bar
Reserved
ECCERR
CPU1.PIEVECTERROR
EQEPERR
CLKFAIL
CPU1.EMUSTOP
TRIP4
TRIP5
TRIP7
TRIP8
TRIP9
TRIP10
TRIP11
TRIP12
TRIP13
TRIP14
TRIP15
TZ4
TZ5
TZ6
EPWMINT
TZINT
PIE(s),
CLA(s)
EPWMx.EPWMCLK
EPWMENCLK
TBCLKSYNC
ADCSOCAO Select Ckt
ADCSOCBO Select Ckt
All
ePWM
Modules
SOCA
ADC
Wrapper(s)
SOCB
PWM11.CMPC
PWM11.CMPD
EPWMn.EMUSTOP
Filter-Reset
SD1
FLT1
FLT1
FLT1
FLT1
Filter-Reset
Filter-Reset
FLT1
FLT1
FLT1
FLT1
PWM12.CMPC
PWM12.CMPD Filter-Reset
SD2
EPWMSYNCPER
CMPSS
DAC
Figure 7-46. ePWM Trip Input Connectivity
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7.11.2.1 Control Peripherals Synchronization
The ePWM and eCAP synchronization chain allows synchronization between multiple modules for the system.
Figure 7-47 shows the synchronization chain architecture.
EXTSYNCIN1
EXTSYNCIN2
EPWM1
EPWM1SYNCOUT
EPWM2
EPWM4
EPWM3
EPWM4SYNCOUT
EPWM5
SYNCSEL.EPWM4SYNCIN
EPWM6
EPWM7
EXTSYNCOUT
EPWM7SYNCOUT
Pulse-Stretched
(8 PLLSYSCLK
Cycles)
EPWM8
SYNCSEL.EPWM7SYNCIN
EPWM9
EPWM10
EPWM10SYNCOUT
EPWM11
SYNCSEL.EPWM10SYNCIN
EPWM12
ECAP1
ECAP1SYNCOUT
SYNCSEL.ECAP1SYNCIN
ECAP2
ECAP3
SYNCSEL.ECAP4SYNCIN
ECAP4
SYNCSEL.SYNCOUT
ECAP5
ECAP6
Figure 7-47. Synchronization Chain Architecture
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7.11.2.2 ePWM Electrical Data and Timing
Section 7.11.2.2.1 shows the PWM timing requirements and Section 7.11.2.2.2 shows the PWM switching
characteristics.
7.11.2.2.1 ePWM Timing Requirements
MIN(1)
f(EPWM)
Frequency, EPWMCLK(2)
tw(SYNCIN)
Sync input pulse width
UNIT
100
MHz
Asynchronous
2tc(EPWMCLK)
cycles
Synchronous
2tc(EPWMCLK)
cycles
1tc(EPWMCLK) + tw(IQSW)
cycles
With input qualifier
(1)
(2)
MAX
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
For SYSCLK above 100 MHz, the EPWMCLK must be half of SYSCLK.
7.11.2.2.2 ePWM Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(PWM)
Pulse duration, PWMx output high/low
tw(SYNCOUT)
Sync output pulse width
td(TZ-PWM)
Delay time, trip input active to PWM forced high
Delay time, trip input active to PWM forced low
Delay time, trip input active to PWM Hi-Z
MIN
MAX
20
UNIT
ns
8tc(SYSCLK)
cycles
25
ns
7.11.2.2.3 Trip-Zone Input Timing
Section 7.11.2.2.3.1 shows the trip-zone input timing requirements. Figure 7-48 shows the PWM Hi-Z
characteristics.
7.11.2.2.3.1 Trip-Zone Input Timing Requirements
MIN(1)
tw(TZ)
Pulse duration, TZx input low
UNIT
Asynchronous
1tc(EPWMCLK)
cycles
Synchronous
2tc(EPWMCLK)
cycles
1tc(EPWMCLK) + tw(IQSW)
cycles
With input qualifier
(1)
MAX
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
EPWMCLK
tw(TZ)
(A)
TZ
td(TZ-PWM)
(B)
PWM
A. TZ: TZ1, TZ2, TZ3, TRIP1–TRIP12
B. PWM refers to all the PWM pins in the device. The state of the PWM pins after TZ is taken high depends on the PWM recovery software.
Figure 7-48. PWM Hi-Z Characteristics
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7.11.2.3 External ADC Start-of-Conversion Electrical Data and Timing
Section 7.11.2.3.1 shows the external ADC start-of-conversion switching characteristics. Figure 7-49 shows the
ADCSOCAO or ADCSOCBO timing.
7.11.2.3.1 External ADC Start-of-Conversion Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
tw(ADCSOCL)
MIN
Pulse duration, ADCSOCxO low
32tc(SYSCLK)
MAX
UNIT
cycles
tw(ADCSOCL)
ADCSOCAO
or
ADCSOCBO
Figure 7-49. ADCSOCAO or ADCSOCBO Timing
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7.11.3 Enhanced Quadrature Encoder Pulse (eQEP)
The eQEP module interfaces directly with linear or rotary incremental encoders to obtain position, direction, and
speed information from rotating machines used in high-performance motion and position-control systems.
Each eQEP peripheral comprises five major functional blocks:
• Quadrature Capture Unit (QCAP)
• Position Counter/Control Unit (PCCU)
• Quadrature Decoder Unit (QDU)
• Unit Time Base for speed and frequency measurement (UTIME)
• Watchdog timer for detecting stalls (QWDOG)
The eQEP peripherals are clocked by PERx.SYSCLK. Figure 7-50 shows the eQEP block diagram.
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System Control
Registers
To CPU
EQEPxENCLK
Data Bus
SYSCLK
QCPRD
QCAPCTL
QCTMR
16
16
16
Quadrature
Capture
Unit
(QCAP)
QCTMRLAT
QCPRDLAT
Registers
Used by
Multiple Units
QUTMR
QWDTMR
QUPRD
QWDPRD
32
16
QEPCTL
QEPSTS
UTIME
QFLG
UTOUT
QWDOG
QDECCTL
16
WDTOUT
PIE
QCLK
EQEPxINT
QDIR
16
QI
Position Counter/
Control Unit
(PCCU)
QPOSLAT
QS Quadrature
Decoder
PHE
(QDU)
PCSOUT
QPOSSLAT
QPOSILAT
EQEPxAIN
EQEPxIIN
QPOSCNT
32
QPOSCMP
EQEPxB/XDIR
EQEPxIOUT
EQEPxIOE
EQEPxSIN
EQEPxSOUT
EQEPxSOE
32
EQEPxA/XCLK
EQEPxBIN
GPIO
MUX
EQEPxI
EQEPxS
16
QEINT
QPOSINIT
QFRC
QPOSMAX
QCLR
QPOSCTL
eQEP Peripheral
Figure 7-50. eQEP Block Diagram
114
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7.11.3.1 eQEP Electrical Data and Timing
Section 7.11.3.1.1 lists the eQEP timing requirement and Section 7.11.3.1.2 lists the eQEP switching
characteristics.
7.11.3.1.1 eQEP Timing Requirements
MIN(1)
tw(QEPP)
tw(INDEXH)
tw(INDEXL)
tw(STROBH)
tw(STROBL)
(1)
(2)
Asynchronous(2)/Synchronous
QEP input period
With input qualifier
QEP Index Input High time
QEP Index Input Low time
cycles
2tc(SYSCLK)
cycles
2tc(SYSCLK) + tw(IQSW)
cycles
2tc(SYSCLK)
cycles
2tc(SYSCLK) + tw(IQSW)
cycles
2tc(SYSCLK)
cycles
2tc(SYSCLK) + tw(IQSW)
cycles
2tc(SYSCLK)
cycles
2tc(SYSCLK) + tw(IQSW)
cycles
Asynchronous(2)/Synchronous
With input qualifier
Asynchronous(2)/Synchronous
QEP Strobe High time
With input qualifier
QEP Strobe Input Low time
Asynchronous(2)/Synchronous
With input qualifier
UNIT
cycles
2[1tc(SYSCLK) + tw(IQSW)]
Asynchronous(2)/Synchronous
With input qualifier
MAX
2tc(SYSCLK)
For an explanation of the input qualifier parameters, see Section 7.9.6.2.1.
See the TMS320F2807x MCUs Silicon Errata for limitations in the asynchronous mode.
7.11.3.1.2 eQEP Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
MIN
MAX
UNIT
td(CNTR)xin
Delay time, external clock to counter increment
4tc(SYSCLK)
cycles
td(PCS-OUT)QEP
Delay time, QEP input edge to position compare sync output
6tc(SYSCLK)
cycles
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7.11.4 High-Resolution Pulse Width Modulator (HRPWM)
The HRPWM combines multiple delay lines in a single module and a simplified calibration system by using a
dedicated calibration delay line. For each ePWM module, there are two HR outputs:
• HR Duty and Deadband control on Channel A
• HR Duty and Deadband control on Channel B
The HRPWM module offers PWM resolution (time granularity) that is significantly better than what can be
achieved using conventionally derived digital PWM methods. The key points for the HRPWM module are:
• Significantly extends the time resolution capabilities of conventionally derived digital PWM
• This capability can be used in both single edge (duty cycle and phase-shift control) as well as dual edge
control for frequency/period modulation.
• Finer time granularity control or edge positioning is controlled through extensions to the Compare A, B,
phase, period and deadband registers of the ePWM module.
Note
The minimum HRPWMCLK frequency allowed for HRPWM is 60 MHz.
7.11.4.1 HRPWM Electrical Data and Timing
Section 7.11.4.1.1 lists the high-resolution PWM timing requirements. Section 7.11.4.1.2 lists the high-resolution
PWM switching characteristics.
7.11.4.1.1 High-Resolution PWM Timing Requirements
MIN
f(EPWM)
Frequency, EPWMCLK(1)
f(HRPWM)
Frequency, HRPWMCLK
(1)
60
MAX
UNIT
100
MHz
100
MHz
For SYSCLK above 100 MHz, the EPWMCLK must be half of SYSCLK.
7.11.4.1.2 High-Resolution PWM Characteristics
PARAMETER
Micro Edge Positioning (MEP) step size(1)
(1)
116
MIN
TYP
150
MAX UNIT
310
ps
The MEP step size will be largest at high temperature and minimum voltage on VDD. MEP step size will increase with higher
temperature and lower voltage and decrease with lower temperature and higher voltage.
Applications that use the HRPWM feature should use MEP Scale Factor Optimizer (SFO) estimation software functions. See the TI
software libraries for details of using SFO functions in end applications. SFO functions help to estimate the number of MEP steps per
SYSCLK period dynamically while the HRPWM is in operation.
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7.11.5 Sigma-Delta Filter Module (SDFM)
The SDFM is a four-channel digital filter designed specifically for current measurement and resolver position
decoding in motor control applications. Each channel can receive an independent sigma-delta (ΣΔ) modulated
bit stream. The bit streams are processed by four individually programmable digital decimation filters. The filter
set includes a fast comparator for immediate digital threshold comparisons for overcurrent and undercurrent
monitoring. Figure 7-51 shows a block diagram of the SDFMs.
SDFM features include:
• Eight external pins per SDFM module:
– Four sigma-delta data input pins per SDFM module (SDx_Dy, where x = 1 to 2 and y = 1 to 4)
– Four sigma-delta clock input pins per SDFM module (SDx_Cy, where x = 1 to 2 and y = 1 to 4)
• Four different configurable modulator clock modes:
– Modulator clock rate equals modulator data rate
– Modulator clock rate running at half the modulator data rate
– Modulator data is Manchester encoded. Modulator clock not required.
– Modulator clock rate is double that of modulator data rate
• Four independent configurable comparator units:
– Four different filter type selection (Sinc1/Sinc2/Sincfast/Sinc3) options available
– Ability to detect over-value and under-value conditions
– Comparator Over-Sampling Ratio (COSR) value for comparator programmable from 1 to 32
• Four independent configurable data filter units:
– Four different filter type selection (Sinc1/Sinc2/Sincfast/Sinc3) options available
– Data filter Over-Sampling Ratio (DOSR) value for data filter unit programmable from 1 to 256
– Ability to enable or disable individual filter module
– Ability to synchronize all four independent filters of a SDFM module using the Master Filter Enable (MFE)
bit or the PWM signals.
• Filter data can be 16-bit or 32-bit representation
• PWMs can be used to generate modulator clock for sigma-delta modulators
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SDFM- Sigma Delta Filter Module
G4
Streams
Filter Channel 1
R
Comparator filter
SD1_D1
Input
Ctrl
SD1_C1
Data filter
SD1INT
IEL
IEH
Interrupt
Unit
SD2INT
PIE
R
FILRES
PWM11.CMPC
Filter Channel 2
SD1_D2
SD1_C2
FILRES
SD1_D3
Filter Channel 3
Register
Map
Data bus
SD1_C3
FILRES
PWM11.CMPD
SD1_D4
SD1_C4
Filter Channel 4
SD1FLT1.IEH
SD1FLT1.IEL
SD1FLT2.IEH
SD1FLT2.IEL
FILRES
GPIO
MUX
SDFM- Sigma Delta Filter Module
G4
Streams
Output
XBar
Filter Channel 1
R
Comparator filter
SD2_D1
SD2_C1
SD1FLT3.IEH
SD1FLT3.IEL
SD1FLT4.IEH
SD1FLT4.IEL
Input
Ctrl
Data filter
Data filter
IEL
IEH
SD2FLT1.IEH
SD2FLT1.IEL
SD2FLT2.IEH
SD2FLT2.IEL
Interrupt
Unit
R
FILRES
SD2FLT3.IEH
SD2FLT3.IEL
SD2FLT4.IEH
SD2FLT4.IEL
PWM12.CMPC
SD2_D2
SD2_C2
Filter Channel 2
FILRES
SD2_D3
SD2_C3
Filter Channel 3
PWM12.CMPD
Register
Map
Data bus
FILRES
SD2_D4
SD2_C4
Filter Channel 4
FILRES
Figure 7-51. SDFM Block Diagram
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7.11.5.1 SDFM Electrical Data and Timing (Using ASYNC)
SDFM operation with asynchronous GPIO is defined by setting GPyQSELn = 0b11. Section 7.11.5.1.1 lists the
SDFM timing requirements when using the asynchronous GPIO (ASYNC) option. Figure 7-52 through Figure
7-55 show the SDFM timing diagrams.
7.11.5.1.1 SDFM Timing Requirements When Using Asynchronous GPIO (ASYNC) Option
MIN
MAX
UNIT
Mode 0
tc(SDC)M0
Cycle time, SDx_Cy
40
256 * SYSCLK period
ns
tw(SDCH)M0
Pulse duration, SDx_Cy high
10
tc(SDC)M0 – 10
ns
tsu(SDDV-SDCH)M0
Setup time, SDx_Dy valid before SDx_Cy goes
high
5
ns
th(SDCH-SDD)M0
Hold time, SDx_Dy wait after SDx_Cy goes high
5
ns
Mode 1
tc(SDC)M1
Cycle time, SDx_Cy
80
256 * SYSCLK period
ns
tw(SDCH)M1
Pulse duration, SDx_Cy high
10
tc(SDC)M1 – 10
ns
tsu(SDDV-SDCL)M1
Setup time, SDx_Dy valid before SDx_Cy goes
low
5
ns
tsu(SDDV-SDCH)M1
Setup time, SDx_Dy valid before SDx_Cy goes
high
5
ns
th(SDCL-SDD)M1
Hold time, SDx_Dy wait after SDx_Cy goes low
5
ns
th(SDCH-SDD)M1
Hold time, SDx_Dy wait after SDx_Cy goes high
5
ns
Mode 2
tc(SDD)M2
Cycle time, SDx_Dy
tw(SDDH)M2
Pulse duration, SDx_Dy high
8 * tc(SYSCLK)
20 * tc(SYSCLK)
tw(SDD_LONG_KEEPOUT)M2
SDx_Dy long pulse duration keepout, where the
long pulse must not fall within the MIN or MAX
values listed.
Long pulse is defined as the high or low pulse
which is the full width of the Manchester bit-clock
period.
This requirement must be satisfied for any integer
between 8 and 20.
(N * tc(SYSCLK)) – 0.5
(N * tc(SYSCLK)) + 0.5
ns
tw(SDD_SHORT)M2
SDx_Dy Short pulse duration for a high or low
pulse (SDD_SHORT_H or SDD_SHORT_L).
Short pulse is defined as the high or low pulse
which is half the width of the Manchester bit-clock
period.
tw(SDD_LONG) / 2 –
tc(SYSCLK)
tw(SDD_LONG) / 2 +
tc(SYSCLK)
ns
tw(SDD_LONG_DUTY)M2
SDx_Dy Long pulse variation (SDD_LONG_H –
SDD_LONG_L)
– tc(SYSCLK)
tc(SYSCLK)
ns
tw(SDD_SHORT_DUTY)M2
SDx_Dy Short pulse variation (SDD_SHORT_H –
SDD_SHORT_L)
– tc(SYSCLK)
tc(SYSCLK)
ns
tc(SDC)M3
Cycle time, SDx_Cy
40
256 * SYSCLK period
ns
tw(SDCH)M3
Pulse duration, SDx_Cy high
10
tc(SDC)M3 – 5
ns
tsu(SDDV-SDCH)M3
Setup time, SDx_Dy valid before SDx_Cy goes
high
5
ns
th(SDCH-SDD)M3
Hold time, SDx_Dy wait after SDx_Cy goes high
5
ns
10
ns
ns
Mode 3
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WARNING
The SDFM clock inputs (SDx_Cy pins) directly clock the SDFM module when there is no GPIO input
synchronization. Any glitches or ringing noise on these inputs can corrupt the SDFM module
operation. Special precautions should be taken on these signals to ensure a clean and noise-free
signal that meets SDFM timing requirements. Precautions such as series termination for ringing due
to any impedance mismatch of the clock driver and spacing of traces from other noisy signals are
recommended.
WARNING
Mode 2 (Manchester Mode) is not recommended for new applications. See the "SDFM: Manchester
Mode (Mode 2) Does Not Produce Correct Filter Results Under Several Conditions" advisory in the
TMS320F2807x MCUs Silicon Errata .
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Mode 0
tw(SDCH)M0
tc(SDC)M0
SDx_Cy
tsu(SDDV-SDCH)M0
th(SDCH-SDD)M0
SDx_Dy
Figure 7-52. SDFM Timing Diagram – Mode 0
Mode 1
tw(SDCH)M1
tc(SDC)M1
SDx_Cy
tsu(SDDV-SDCL)M1
tsu(SDDV-SDCH)M1
SDx_Dy
th(SDCL-SDD)M1
th(SDCH-SDD)M1
Figure 7-53. SDFM Timing Diagram – Mode 1
Mode 2
(Manchester-encoded-bit stream)
tc(SDD)M2
Modulator
Internal clock
tw(SDDH)M2
Modulator
Internal data
1
1
0
1
1
0
0
1
1
tw(SDD_LONG_KEEPOUT)
SDx-Dy
N x SYSCLK
tw(SDD_LONG_L)
tw(SDD_LONG_H)
tw(SDD_SHORT_H)
tw(SDD_SHORT_L)
N x tc(SYSCLK) + 0.5
N x tc(SYSCLK) ±0.5
±
SYSCLK
Figure 7-54. SDFM Timing Diagram – Mode 2
Mode 3
(CLKx is driven externally)
tc(SDC)M3
tw(SDCH)M3
SDx_Cy
tsu(SDDV-SDCH)M3
th(SDCH-SDD)M3
SDx_Dy
Figure 7-55. SDFM Timing Diagram – Mode 3
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7.11.5.2 SDFM Electrical Data and Timing (Using 3-Sample GPIO Input Qualification)
SDFM operation with qualified GPIO (3-sample window) is defined by setting GPyQSELn = 0b01. When using
this qualified GPIO (3-sample window) mode, the timing requirement for the tw(GPI) pulse duration of 2tc(SYSCLK)
must be met. It is important for both SD-Cx and SD-Dx pairs to be configured with the same GPIO qualification
option. Section 7.11.5.2.1 lists the SDFM timing requirements when using the GPIO input qualification (3-sample
window) option. Figure 7-52 through Figure 7-55 show the SDFM timing diagrams.
7.11.5.2.1 SDFM Timing Requirements When Using GPIO Input Qualification (3-Sample Window) Option
MIN(1)
MAX
UNIT
Mode 0
tc(SDC)M0
Cycle time, SDx_Cy
10 * SYSCLK period
256 * SYSCLK period
ns
tw(SDCHL)M0
Pulse duration, SDx_Cy high/low
4 * SYSCLK period
6 * SYSCLK period
ns
tw(SDDHL)M0
Pulse duration, SDx_Dy high/low
4 * SYSCLK period
ns
tsu(SDDV-SDCH)M0
Setup time, SDx_Dy valid before SDx_Cy goes
high
2 * SYSCLK period
ns
th(SDCH-SDD)M0
Hold time, SDx_Dy wait after SDx_Cy goes high
2 * SYSCLK period
ns
tc(SDC)M1
Cycle time, SDx_Cy
Mode 1
20 * SYSCLK period
256 * SYSCLK period
ns
6 * SYSCLK period
ns
tw(SDCH)M1
Pulse duration, SDx_Cy high
4 * SYSCLK period
tw(SDDHL)M1
Pulse duration, SDx_Dy high/low
4 * SYSCLK period
ns
tsu(SDDV-SDCL)M1
Setup time, SDx_Dy valid before SDx_Cy goes
low
2 * SYSCLK period
ns
tsu(SDDV-SDCH)M1
Setup time, SDx_Dy valid before SDx_Cy goes
high
2 * SYSCLK period
ns
th(SDCL-SDD)M1
Hold time, SDx_Dy wait after SDx_Cy goes low
2 * SYSCLK period
ns
th(SDCH-SDD)M1
Hold time, SDx_Dy wait after SDx_Cy goes high
2 * SYSCLK period
ns
Mode 2
tc(SDD)M2
Cycle time, SDx_Dy
tw(SDDH)M2
Pulse duration, SDx_Dy high
tc(SDC)M3
Cycle time, SDx_Cy
Option unavailable
Mode 3
10 * SYSCLK period
256 * SYSCLK period
6 * SYSCLK period
ns
tw(SDCHL)M3
Pulse duration, SDx_Cy high
4 * SYSCLK period
tw(SDDHL)M3
Pulse duration, SDx_Dy high/low
4 * SYSCLK period
ns
tsu(SDDV-SDCH)M3
Setup time, SDx_Dy valid before SDx_Cy goes
high
2 * SYSCLK period
ns
th(SDCH-SDD)M3
Hold time, SDx_Dy wait after SDx_Cy goes high
2 * SYSCLK period
ns
(1)
ns
SDFM timing requirements apply only when the GPIO input qualification type is the 3-sample window (GPyQSELx = 1; QUALPRD = 0)
option. It is important that both the SD-Cx and SD-Dx pairs be configured with the 3-sample window option.
Note
The SDFM Qualified GPIO (3-sample) mode provides protection against SDFM module corruption due
to occasional random noise glitches on the SDx_Cy pin that may result in a false comparator trip and
filter output. For more details, refer to the "SDFM: Use Caution While Using SDFM Under Noisy
Conditions" usage note in the TMS320F2807x MCUs Silicon Errata .
The SDFM Qualified GPIO (3-sample) mode does not provide protection against persistent violations
of the above timing requirements. Timing violations will result in data corruption proportional to the
number of bits which violate the requirements.
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7.12 Communications Peripherals
Note
For the actual number of each peripheral on a specific device, see Table 5-1.
7.12.1 Controller Area Network (CAN)
The CAN module performs CAN protocol communication according to ISO 11898-1 (identical to Bosch® CAN
protocol specification 2.0 A, B). The bit rate can be programmed to values up to 1 Mbps. A CAN transceiver chip
is required for the connection to the physical layer (CAN bus).
For communication on a CAN network, individual message objects can be configured. The message objects and
identifier masks are stored in the Message RAM.
All functions concerning the handling of messages are implemented in the message handler. These functions
are: acceptance filtering; the transfer of messages between the CAN Core and the Message RAM; and the
handling of transmission requests.
The register set of the CAN may be accessed directly by the CPU through the module interface. These registers
are used to control and configure the CAN core and the message handler, and to access the message RAM.
The CAN module implements the following features:
• Complies with ISO11898-1 (Bosch® CAN protocol specification 2.0 A and B)
• Bit rates up to 1 Mbps
• Multiple clock sources
• 32 message objects (“message objects” are also referred to as “mailboxes” in this document; the two terms
are used interchangeably), each with the following properties:
– Configurable as receive or transmit
– Configurable with standard (11-bit) or extended (29-bit) identifier
– Supports programmable identifier receive mask
– Supports data and remote frames
– Holds 0 to 8 bytes of data
– Parity-checked configuration and data RAM
• Individual identifier mask for each message object
• Programmable FIFO mode for message objects
• Programmable loop-back modes for self-test operation
• Suspend mode for debug support
• Software module reset
• Automatic bus-on, after bus-off state by a programmable 32-bit timer
• Message-RAM parity-check mechanism
• Two interrupt lines
Note
For a CAN bit clock of 200 MHz, the smallest bit rate possible is 7.8125 kbps.
Note
Depending on the timing settings used, the accuracy of the on-chip zero-pin oscillator (specified in the
data manual) may not meet the requirements of the CAN protocol. In this situation, an external clock
source must be used.
Figure 7-56 shows the CAN block diagram.
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CAN_H
CAN Bus
CAN_L
External connections
Device
3.3V CAN Transceiver
CANx RX pin
CANx TX pin
CAN
CAN Core
Message RAM
Message Handler
Message
RAM
Interface
32
Message
Objects
(Mailboxes)
Register and Message
Object Access (IFx)
Test Modes
Only
Module Interface
CANINT0 CANINT1
(to ePIE)
CPU Bus
Figure 7-56. CAN Block Diagram
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7.12.2 Inter-Integrated Circuit (I2C)
The I2C module has the following features:
• Compliance with the Philips Semiconductors I2C-bus specification (version 2.1):
– Support for 1-bit to 8-bit format transfers
– 7-bit and 10-bit addressing modes
– General call
– START byte mode
– Support for multiple master-transmitters and slave-receivers
– Support for multiple slave-transmitters and master-receivers
– Combined master transmit/receive and receive/transmit mode
– Data transfer rate of from 10 kbps up to 400 kbps (I2C Fast-mode rate)
• One 16-byte receive FIFO and one 16-byte transmit FIFO
• One interrupt that can be used by the CPU. This interrupt can be generated as a result of one of the following
conditions:
– Transmit-data ready
– Receive-data ready
– Register-access ready
– No-acknowledgment received
– Arbitration lost
– Stop condition detected
– Addressed as slave
• An additional interrupt that can be used by the CPU when in FIFO mode
• Module enable/disable capability
• Free data format mode
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Figure 7-57 shows how the I2C peripheral module interfaces within the device.
2
I C Module
I2CXSR
I2CDXR
TX FIFO
FIFO Interrupt to
CPU/PIE
SDA
RX FIFO
Peripheral Bus
I2CRSR
SCL
Clock
Synchronizer
I2CDRR
Control/Status
Registers
CPU
Prescaler
Noise Filters
Interrupt to
CPU/PIE
I2C INT
Arbitrator
Figure 7-57. I2C Peripheral Module Interfaces
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7.12.2.1 I2C Electrical Data and Timing
Section 7.12.2.1.1 lists the I2C timing requirements. Section 7.12.2.1.2 lists the I2C switching characteristics.
Figure 7-58 shows the I2C timing diagram.
7.12.2.1.1 I2C Timing Requirements
NO.
MIN
MAX
UNIT
7
12
MHz
Standard mode
T0
fmod
I2C module frequency
T1
th(SDA-SCL)START
Hold time, START condition, SCL fall delay after
SDA fall
4.0
µs
T2
tsu(SCL-SDA)START
Setup time, Repeated START, SCL rise before SDA
fall delay
4.7
µs
0
µs
250
ns
T3
th(SCL-DAT)
Hold time, data after SCL fall
T4
tsu(DAT-SCL)
Setup time, data before SCL rise
T5
tr(SDA)
Rise time, SDA
1000
ns
T6
tr(SCL)
Rise time, SCL
1000
ns
T7
tf(SDA)
Fall time, SDA
300
ns
T8
tf(SCL)
Fall time, SCL
300
ns
T9
tsu(SCL-SDA)STOP
Setup time, STOP condition, SCL rise before SDA
rise delay
4.0
T10
tw(SP)
Pulse duration of spikes that will be suppressed by
filter
0
T11
Cb
capacitance load on each bus line
fmod
I2C module frequency
T1
th(SDA-SCL)START
Hold time, START condition, SCL fall delay after
SDA fall
0.6
µs
T2
tsu(SCL-SDA)START
Setup time, Repeated START, SCL rise before SDA
fall delay
0.6
µs
0
µs
100
ns
µs
50
ns
400
pF
12
MHz
Fast mode
T0
7
T3
th(SCL-DAT)
Hold time, data after SCL fall
T4
tsu(DAT-SCL)
Setup time, data before SCL rise
T5
tr(SDA)
Rise time, SDA
20
300
ns
T6
tr(SCL)
Rise time, SCL
20
300
ns
T7
tf(SDA)
Fall time, SDA
11.4
300
ns
T8
tf(SCL)
Fall time, SCL
11.4
300
ns
T9
tsu(SCL-SDA)STOP
Setup time, STOP condition, SCL rise before SDA
rise delay
0.6
T10
tw(SP)
Pulse duration of spikes that will be suppressed by
filter
0
T11
Cb
capacitance load on each bus line
µs
50
ns
400
pF
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7.12.2.1.2 I2C Switching Characteristics
over recommended operating conditions (unless otherwise noted)
NO.
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
0
100
kHz
Standard mode
S1
fSCL
SCL clock frequency
S2
TSCL
SCL clock period
10
µs
S3
tw(SCLL)
Pulse duration, SCL clock low
4.7
µs
S4
tw(SCLH)
Pulse duration, SCL clock high
4.0
µs
S5
tBUF
Bus free time between STOP and START
conditions
4.7
µs
S6
tv(SCL-DAT)
Valid time, data after SCL fall
S7
tv(SCL-ACK)
Valid time, Acknowledge after SCL fall
S8
II
Input current on pins
3.45
0.1 Vbus < Vi < 0.9 Vbus
µs
3.45
µs
–10
10
µA
0
400
kHz
Fast mode
S1
fSCL
SCL clock frequency
S2
TSCL
SCL clock period
2.5
µs
S3
tw(SCLL)
Pulse duration, SCL clock low
1.3
µs
S4
tw(SCLH)
Pulse duration, SCL clock high
0.6
µs
S5
tBUF
Bus free time between STOP and START
conditions
1.3
µs
S6
tv(SCL-DAT)
Valid time, data after SCL fall
S7
tv(SCL-ACK)
Valid time, Acknowledge after SCL fall
S8
II
Input current on pins
0.9
0.1 Vbus < Vi < 0.9 Vbus
–10
µs
0.9
µs
10
µA
7.12.2.1.3
Note
To meet all of the I2C protocol timing specifications, the I2C module clock (Fmod) must be configured
from 7 MHz to 12 MHz.
128
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STOP
START
SDA
ACK
T5
S6
T7
Contd...
S7
T10
S3
Contd...
S4
SCL
T6
Repeated
START
9th
clock
T8
S2
SDA
STOP
S5
ACK
T2
T9
T1
SCL
9th
clock
Figure 7-58. I2C Timing Diagram
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7.12.3 Multichannel Buffered Serial Port (McBSP)
The McBSP module has the following features:
• Compatible with McBSP in TMS320C28x and TMS320F28x DSP devices
• Full-duplex communication
• Double-buffered data registers that allow a continuous data stream
• Independent framing and clocking for receive and transmit
• External shift clock generation or an internal programmable frequency shift clock
• 8-bit data transfer mode can be configured to transmit with LSB or MSB first
• Programmable polarity for both frame synchronization and data clocks
• Highly programmable internal clock and frame generation
• Direct interface to industry-standard CODECs, Analog Interface Chips (AICs), and other serially connected
A/D and D/A devices
• Supports AC97, I2S, and SPI protocols
• McBSP clock rate,
CLKG =
CLKSRG
(1 + CLKGDV )
where CLKSRG source could be LSPCLK, CLKX, or CLKR.
130
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Figure 7-59 shows the block diagram of the McBSP module.
TX
Interrupt
MXINT
To CPU
16
16
DXR2 Transmit Buffer
DXR1 Transmit Buffer
McBSP Transmit
Interrupt Select Logic
PERx.LSPCLK
Bridge
DMA Bus
Peripheral Bus
16
CPU
CPU
Peripheral Write Bus
TX Interrupt Logic
16
MFSXx
Compand Logic
MCLKXx
XSR2
XSR1
RSR2
RSR1
16
16
Expand Logic
RBR2 Register
RBR1 Register
16
16
MDXx
MDRx
MCLKRx
MFSRx
McBSP Receive
Interrupt Select Logic
MRINT
RX Interrupt Logic
To CPU
RX
Interrupt
DRR2 Receive Buffer
DRR1 Receive Buffer
16
16
Peripheral Read Bus
CPU
Figure 7-59. McBSP Block Diagram
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7.12.3.1 McBSP Electrical Data and Timing
7.12.3.1.1 McBSP Transmit and Receive Timing
Section 7.12.3.1.1.1 shows the McBSP timing requirements. Section 7.12.3.1.1.2 shows the McBSP switching
characteristics. Figure 7-60 and Figure 7-61 show the McBSP timing diagrams.
7.12.3.1.1.1 McBSP Timing Requirements
NO.(1)
MIN
(2)
1
McBSP module clock (CLKG, CLKX, CLKR) range
40
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
2P
P–7
M12
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
M13
tr(CKRX)
Rise time, CLKR/X
CLKR/X ext
M14
tf(CKRX)
Fall time, CLKR/X
CLKR/X ext
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
M16
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
M17
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
M18
th(CKRL-DRV)
Hold time, DR valid after CLKR low
M19
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
M20
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
(1)
(2)
132
CLKR int
18
CLKR ext
2
CLKR int
0
CLKR ext
6
CLKR int
18
CLKR ext
5
CLKR int
0
CLKR ext
3
CLKX int
18
CLKX ext
2
CLKX int
0
CLKX ext
6
MHz
ns
1
M11
UNIT
kHz
25
McBSP module cycle time (CLKG, CLKX, CLKR) range
M15
MAX
ms
ns
ns
7
ns
7
ns
ns
ns
ns
ns
ns
ns
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that
signal are also inverted.
2P = 1/CLKG in ns. CLKG is the output of sample rate generator mux. CLKG = CLKSRG / (1 + CLKGDV). CLKSRG can be LSPCLK,
CLKX, CLKR as source. CLKSRG ≤ (SYSCLK/2).
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7.12.3.1.1.2 McBSP Switching Characteristics
over recommended operating conditions (unless otherwise noted)
NO.(1)
PARAMETER
(2)
M1
tc(CKRX)
CLKR/X int
2P
(3)
ns
ns
Pulse duration, CLKR/X high
CLKR/X int
D–5
Pulse duration, CLKR/X low
CLKR/X int
C – 5 (3)
C + 5 (3)
M4
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
-7
7.5
CLKR ext
3
27
M5
td(CKXH-FXV)
Delay time, CLKX high to internal FSX valid
CLKX int
-5
6
CLKX ext
3
27
M6
tdis(CKXH-DXHZ)
Disable time, CLKX high to DX high impedance
following last data bit
CLKX int
–8
8
CLKX ext
3
15
Delay time, CLKX high to DX valid.
CLKX int
–3
9
This applies to all bits except the first bit
transmitted.
CLKX ext
5
25
Delay time, CLKX high to DX
DXENA = 0
valid
CLKX int
–3
8
CLKX ext
5
20
Only applies to first bit
transmitted when in Data
Delay 1 or 2 (XDATDLY=01b
or 10b) modes
CLKX int
P–3
P+8
DXENA = 1
CLKX ext
P+5
P + 20
Enable time, CLKX high to
DX driven
DXENA = 0
Only applies to first bit
transmitted when in Data
Delay 1 or 2 (XDATDLY=01b
or 10b) modes
DXENA = 1
Delay time, FSX high to DX
valid
DXENA = 0
ten(CKXH-DX)
M9
td(FXH-DXV)
M10
ten(FXH-DX)
Only applies to first bit
transmitted when in Data
Delay 0 (XDATDLY=00b)
mode.
DXENA = 1
Enable time, FSX high to DX
driven
DXENA = 0
Only applies to first bit
transmitted when in Data
Delay 0 (XDATDLY=00b)
mode
DXENA = 1
CLKX int
-6
CLKX ext
4
CLKX int
P-6
CLKX ext
P+4
FSX int
D+5
ns
tw(CKRXH)
tw(CKRXL)
td(CKXH-DXV)
UNIT
(3)
M3
M8
(2)
(3)
Cycle time, CLKR/X
MAX
M2
M7
(1)
MIN
ns
ns
ns
ns
ns
8
FSX ext
17
FSX int
P+8
FSX ext
P + 17
FSX int
-3
FSX ext
6
FSX int
P-3
FSX ext
P+6
ns
ns
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that
signal are also inverted.
2P = 1/CLKG in ns.
C = CLKRX low pulse width = P
D = CLKRX high pulse width = P
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M1, M11
M2, M12
M13
M3, M12
CLKR
M4
M4
M14
FSR (int)
M15
M16
FSR (ext)
M18
M17
DR
(RDATDLY=00b)
Bit (n−1)
(n−2)
(n−3)
M17
(n−4)
M18
DR
(RDATDLY=01b)
Bit (n−1)
(n−2)
(n−3)
M17
M18
DR
(RDATDLY=10b)
Bit (n−1)
(n−2)
Figure 7-60. McBSP Receive Timing
M1, M11
M2, M12
M13
M3, M12
CLKX
M5
M5
FSX (int)
M19
M20
FSX (ext)
M9
M7
M10
DX
(XDATDLY=00b)
Bit 0
Bit (n−1)
(n−2)
(n−3)
M7
M8
DX
(XDATDLY=01b)
Bit 0
Bit (n−1)
M7
M6
DX
(XDATDLY=10b)
(n−2)
M8
Bit 0
Bit (n−1)
Figure 7-61. McBSP Transmit Timing
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7.12.3.1.2 McBSP as SPI Master or Slave Timing
Section 7.12.3.1.2.1 lists the McBSP as SPI master timing requirements. Section 7.12.3.1.2.2 lists the McBSP as
SPI master switching characteristics. Section 7.12.3.1.2.3 lists the McBSP as SPI slave timing requirements.
Section 7.12.3.1.2.4 lists the McBSP as SPI slave switching characteristics.
Figure 7-62 through Figure 7-65 show the McBSP as SPI master or slave timing diagrams.
7.12.3.1.2.1 McBSP as SPI Master Timing Requirements
NO.
MIN
MAX
UNIT
CLOCK
M33,
M42,
M52,
M61
tc(CLKG)
Cycle time, CLKG(1)
P
Cycle time, LSPCLK(1)
tc(CKX)
2 * tc(LSPCLK)
ns
tc(LSPCLK)
ns
Cycle time, CLKX
2P
ns
30
ns
1
ns
30
ns
1
ns
30
ns
1
ns
30
ns
1
ns
CLKSTP = 10b, CLKXP = 0
M30
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
M31
th(CKXL-DRV)
Hold time, DR valid after CLKX low
CLKSTP = 11b, CLKXP = 0
M39
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
M40
th(CKXH-DRV)
Hold time, DR valid after CLKX high
CLKSTP = 10b, CLKXP = 1
M49
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
M50
th(CKXH-DRV)
Hold time, DR valid after CLKX high
CLKSTP = 11b, CLKXP = 1
M58
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
M59
th(CKXL-DRV)
Hold time, DR valid after CLKX low
(1)
CLKG should be configured to LSPCLK/2 by setting CLKSM = 1 and CLKGDV = 1
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7.12.3.1.2.2 McBSP as SPI Master Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
CLOCK
M33
Cycle time, CLKG(1) (n * tc(LSPCLK))
40
ns
P
Half CLKG cycle; 0.5 * tc(CLKG)
20
ns
n
LSPCLK to CLKG divider
2
ns
2P – 6
ns
tc(CLKG)
CLKSTP = 10b, CLKXP = 0
M24
th(CKXL-FXL)
Hold time, FSX high after CLKX low
M25
td(FXL-CKXH)
Delay time, FSX low to CLKX high
P–6
M26
td(CLKXH-DXV)
Delay time, CLKX high to DX valid
–4
M28
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
P–8
M29
td(FXL-DXV)
Delay time, FSX low to DX valid
P–3
ns
6
ns
ns
P+6
ns
CLKSTP = 11b, CLKXP = 0
M34
th(CKXL-FXH)
Hold time, FSX high after CLKX low
P–6
ns
M35
td(FXL-CKXH)
Delay time, FSX low to CLKX high
P–6
ns
M36
td(CLKXL-DXV)
Delay time, CLKX low to DX valid
M37
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
M38
td(FXL-DXV)
Delay time, FSX low to DX valid
–4
6
P–6
ns
ns
–2
1
ns
CLKSTP = 10b, CLKXP = 1
M43
th(CKXH-FXH)
Hold time, FSX high after CLKX high
2P – 6
M44
td(FXL-CKXL)
Delay time, FSX low to CLKX low
P–6
M45
td(CLKXL-DXV)
Delay time, CLKX low to DX valid
–4
M47
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
M48
td(FXL-DXV)
Delay time, FSX low to DX valid
ns
ns
6
P–6
ns
ns
–2
1
ns
CLKSTP = 11b, CLKXP = 1
M53
th(CKXH-FXH)
Hold time, FSX high after CLKX high
M54
td(FXL-CKXL)
Delay time, FSX low to CLKX low
M55
td(CLKXH-DXV)
Delay time, CLKX high to DX valid
M56
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
M57
td(FXL-DXV)
Delay time, FSX low to DX valid
(1)
P–6
ns
2P – 6
ns
–4
6
P–8
ns
ns
–2
1
ns
CLKG should be configured to LSPCLK/2 by setting CLKSM = 1 and CLKGDV = 1.
7.12.3.1.2.3 McBSP as SPI Slave Timing Requirements
NO.
MIN
MAX
UNIT
CLOCK
M33,
M42,
M52,
M61
tc(CLKG)
Cycle time, CLKG(1)
P
Cycle time, LSPCLK(1)
tc(CKX)
Cycle time, CLKX(2)
2 * tc(LSPCLK)
ns
tc(LSPCLK)
ns
16P
ns
CLKSTP = 10b, CLKXP = 0
M30
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
8P – 10
ns
M31
th(CKXL-DRV)
Hold time, DR valid after CLKX low
8P – 10
ns
136
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NO.
M32
MIN
tsu(BFXL-CKXH)
MAX
UNIT
Setup time, FSX low before CLKX high
8P+10
ns
Setup time, DR valid before CLKX high
8P – 10
ns
CLKSTP = 11b, CLKXP = 0
M39
tsu(DRV-CKXH)
M40
th(CKXH-DRV)
Hold time, DR valid after CLKX high
8P – 10
ns
M41
tsu(FXL-CKXH)
Setup time, FSX low before CLKX high
16P+10
ns
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
8P – 10
ns
M50
th(CKXH-DRV)
Hold time, DR valid after CLKX high
8P – 10
ns
M51
tsu(FXL-CKXL)
Setup time, FSX low before CLKX low
8P+10
ns
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
8P – 10
ns
M59
th(CKXL-DRV)
Hold time, DR valid after CLKX low
8P – 10
ns
M60
tsu(FXL-CKXL)
Setup time, FSX low before CLKX low
16P+10
ns
CLKSTP = 10b, CLKXP = 1
M49
CLKSTP = 11b, CLKXP = 1
M58
(1)
(2)
CLKG should be configured to LSPCLK/2 by setting CLKSM = 1 and CLKGDV = 1
For SPI slave modes CLKX must be a minimum of 8 CLKG cycles
7.12.3.1.2.4 McBSP as SPI Slave Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
CLOCK
2P
Cycle time, CLKG
ns
CLKSTP = 10b, CLKXP = 0
M26
td(CLKXH-DXV)
Delay time, CLKX high to DX valid
3P + 6
M28
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
5P + 20
ns
6P + 6
ns
M29
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 6
ns
CLKSTP = 11b, CLKXP = 0
M36
td(CLKXL-DXV)
Delay time, CLKX low to DX valid
3P + 6
5P + 20
ns
M37
tdis(CKXL-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX low
7P + 6
ns
M38
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 6
ns
td(CLKXL-DXV)
Delay time, CLKX low to DX valid
3P + 6
M47
tdis(FXH-DXHZ)
Disable time, DX high impedance following last data bit from
FSX high
6P + 6
ns
M48
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 6
ns
td(CLKXH-DXV)
Delay time, CLKX high to DX valid
3P + 6
M56
tdis(CKXH-DXHZ)
Disable time, DX high impedance following last data bit from
CLKX high
7P + 6
ns
M57
td(FXL-DXV)
Delay time, FSX low to DX valid
4P + 6
ns
CLKSTP = 10b, CLKXP = 1
M45
5P + 20
ns
CLKSTP = 11b, CLKXP = 1
M55
5P + 20
ns
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M32
LSB
M33
MSB
CLKX
M25
M24
FSX
DX
M26
M29
M28
Bit 0
Bit(n-1)
(n-2)
M30
DR
(n-3)
(n-4)
M31
Bit 0
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-62. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
LSB
M42
MSB
M41
CLKX
M35
M34
FSX
M37
DX
M36
M38
Bit 0
Bit(n-1)
M39
DR
Bit 0
(n-2)
(n-3)
(n-4)
M40
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-63. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
M51
LSB
M52
MSB
CLKX
M43
M44
FSX
M48
M47
DX
M45
Bit 0
Bit(n-1)
M49
DR
Bit 0
(n-2)
(n-3)
(n-4)
M50
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-64. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
M60
LSB
M61
MSB
CLKX
M53
M54
FSX
M56
DX
M55
M57
Bit 0
Bit(n-1)
M58
DR
Bit 0
(n-2)
(n-3)
(n-4)
M59
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 7-65. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
138
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7.12.4 Serial Communications Interface (SCI)
The SCI is a 2-wire asynchronous serial port, commonly known as a UART. The SCI module supports digital
communications between the CPU and other asynchronous peripherals that use the standard non-return-to-zero
(NRZ) format
The SCI receiver and transmitter each have a 16-level-deep FIFO for reducing servicing overhead, and each has
its own separate enable and interrupt bits. Both can be operated independently for half-duplex communication,
or simultaneously for full-duplex communication. To specify data integrity, the SCI checks received data for break
detection, parity, overrun, and framing errors. The bit rate is programmable to different speeds through a 16-bit
baud-select register. Figure 7-66 shows the SCI block diagram.
Features of the SCI module include:
• Two external pins:
– SCITXD: SCI transmit-output pin
– SCIRXD: SCI receive-input pin
•
•
•
•
•
•
•
•
•
•
Note
NOTE: Both pins can be used as GPIO if not used for SCI.
– Baud rate programmable to 64K different rates
Data-word format
– One start bit
– Data-word length programmable from 1 to 8 bits
– Optional even/odd/no parity bit
– 1 or 2 stop bits
Four error-detection flags: parity, overrun, framing, and break detection
Two wakeup multiprocessor modes: idle-line and address bit
Half- or full-duplex operation
Double-buffered receive and transmit functions
Transmitter and receiver operations can be accomplished through interrupt-driven or polled algorithms with
status flags.
– Transmitter: TXRDY flag (transmitter-buffer register is ready to receive another character) and TX EMPTY
flag (transmitter-shift register is empty)
– Receiver: RXRDY flag (receiver-buffer register is ready to receive another character), BRKDT flag (break
condition occurred), and RX ERROR flag (monitoring four interrupt conditions)
Separate enable bits for transmitter and receiver interrupts (except BRKDT)
NRZ format
Auto baud-detect hardware logic
16-level transmit and receive FIFO
Note
All registers in this module are 8-bit registers. When a register is accessed, the register data is in the
lower byte (bits 7–0), and the upper byte (bits 15–8) is read as zeros. Writing to the upper byte has no
effect.
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TXENA
SCICTL1.1
TXSHF
Register
Frame
Format and Mode
SCITXD
8
Parity
Even/Odd
0
TXEMPTY
1
SCICCR.6
SCICTL2.6
8
Enable
TX FIFO_0
SCICCR.5
88
TX FIFO_1
TX Interrupt
Logic
TX FIFO Interrupts
TXINT
To CPU
TX FIFO_N
TXINTENA
8
0
TXWAKE
SCICTL2.0
TXRDY
1
SCICTL2.7
SCICTL1.3
SCI TX Interrupt Select Logic
8
WUT
Transmit Data
Buffer Register
SCITXBUF.7-0
Auto Baud Detect Logic
RXENA
LSPCLK
Baud Rate
MSB/LSB
Registers
SCICTL1.0
RXSHF
Register
SCIHBAUD.15-8
SCIRXD
RXWAKE
8
SCILBAUD.7-0
SCIRXST.1
0
1
8
SCIFFENA
RX FIFO_0
SCIFFTX.14
8
RX FIFO_1
RX FIFO Interrupts
RX Interrupt
Logic
RXINT
To CPU
RX FIFO_N
RXFFOVF
8
0
SCIFFRX.15
1
RXBKINTENA
SCICTL2.1
RXRDY
SCIRXST.6
RXENA
BRKDT
SCICTL1.0
RXERRINTENA
SCIRXST.5
8
SCICTL1.6
SCI RX Interrupt Select Logic
SCIRXST.5-2
Receive Data
Buffer Register
SCIRXBUF.7-0
BRKDT
FE OE PE
RXERROR
SCIRXST.7
Figure 7-66. SCI Block Diagram
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The major elements used in full-duplex operation include:
• A transmitter (TX) and its major registers:
– SCITXBUF register – Transmitter Data Buffer register. Contains data (loaded by the CPU) to be
transmitted
– TXSHF register – Transmitter Shift register. Accepts data from the SCITXBUF register and shifts data onto
the SCITXD pin, 1 bit at a time
• A receiver (RX) and its major registers:
– RXSHF register – Receiver Shift register. Shifts data in from the SCIRXD pin, 1 bit at a time
– SCIRXBUF register – Receiver Data Buffer register. Contains data to be read by the CPU. Data from a
remote processor is loaded into the RXSHF register and then into the SCIRXBUF and SCIRXEMU
registers
• A programmable baud generator
• Data-memory-mapped control and status registers enable the CPU to access the I2C module registers and
FIFOs.
The SCI receiver and transmitter operate independently.
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7.12.5 Serial Peripheral Interface (SPI)
The SPI is a high-speed synchronous serial input/output (I/O) port that allows a serial bit stream of programmed
length (1 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is
normally used for communications between the microcontroller and external peripherals or another controller.
Typical applications include external I/O or peripheral expansion through devices such as shift registers, display
drivers, and ADCs. Multidevice communications are supported by the master/slave operation of the SPI. The
port supports 16-level receive and transmit FIFOs for reducing CPU servicing overhead.
The SPI module features include:
• SPISOMI: SPI slave-output/master-input pin
• SPISIMO: SPI slave-input/master-output pin
• SPISTE: SPI slave transmit-enable pin
• SPICLK: SPI serial-clock pin
• Two operational modes: master and slave
• Baud rate: 125 different programmable rates
• Data word length: 1 to 16 data bits
• Four clocking schemes (controlled by clock polarity and clock phase bits) include:
– Falling edge without phase delay: SPICLK active-high. SPI transmits data on the falling edge of the
SPICLK signal and receives data on the rising edge of the SPICLK signal.
– Falling edge with phase delay: SPICLK active-high. SPI transmits data one half-cycle ahead of the falling
edge of the SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge without phase delay: SPICLK inactive-low. SPI transmits data on the rising edge of the
SPICLK signal and receives data on the falling edge of the SPICLK signal.
– Rising edge with phase delay: SPICLK inactive-low. SPI transmits data one half-cycle ahead of the rising
edge of the SPICLK signal and receives data on the rising edge of the SPICLK signal.
• Simultaneous receive-and-transmit operation (transmit function can be disabled in software)
• Transmitter and receiver operations are accomplished through either interrupt-driven or polled algorithms.
• 16-level transmit and receive FIFO
• Delayed transmit control
• 3-wire SPI mode
• SPISTE inversion for digital audio interface receive mode on devices with two SPI modules
• DMA support
• High-speed mode for up to 30-MHz full-duplex communication
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The SPI operates in master or slave mode. The master initiates data transfer by sending the SPICLK signal. For
both the slave and the master, data is shifted out of the shift registers on one edge of the SPICLK and latched
into the shift register on the opposite SPICLK clock edge. If the CLOCK PHASE bit (SPICTL.3) is high, data is
transmitted and received a half-cycle before the SPICLK transition. As a result, both controllers send and receive
data simultaneously. The application software determines whether the data is meaningful or dummy data. There
are three possible methods for data transmission:
• Master sends data; slave sends dummy data
• Master sends data; slave sends data
• Master sends dummy data; slave sends data
The master can initiate a data transfer at any time because it controls the SPICLK signal. The software,
however, determines how the master detects when the slave is ready to broadcast data.
Figure 7-67 shows the SPI CPU Interface.
PCLKCR8
Low-Speed
Prescaler
SYSCLK
Bit
Clock
CPU
Peripheral Bus
LSPCLK
SYSRS
SPISIMO
GPIO
MUX
SPISOMI
SPICLK
SPI
SPIINT
SPITXINT
PIE
SPIRXDMA
SPITXDMA
DMA
SPISTE
Figure 7-67. SPI CPU Interface
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7.12.5.1 SPI Electrical Data and Timing
Note
All timing parameters for SPI High-Speed Mode assume a load capacitance of 5 pF on SPICLK,
SPISIMO, and SPISOMI.
For more information about the SPI in High-Speed mode, see the Serial Peripheral Interface (SPI) chapter of the
TMS320F2807x Microcontrollers Technical Reference Manual .
To use the SPI in High-Speed mode, the application must use the high-speed enabled GPIOs (see Section
6.4.5).
7.12.5.1.1 SPI Master Mode Timings
Section 7.12.5.1.1.1 lists the SPI master mode timing requirements. Section 7.12.5.1.1.2 lists the SPI master
mode switching characteristics (clock phase = 0). Section 7.12.5.1.1.3 lists the SPI master mode switching
characteristics (clock phase = 1). Figure 7-68 shows the SPI master mode external timing where the clock phase
= 0. Figure 7-69 shows the SPI master mode external timing where the clock phase = 1.
7.12.5.1.1.1 SPI Master Mode Timing Requirements
(BRR + 1)
CONDITION(1)
NO.
MIN
MAX UNIT
High Speed Mode
8
tsu(SOMI)M
Setup time, SPISOMI valid before
SPICLK
9
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
8
tsu(SOMI)M
Setup time, SPISOMI valid before
SPICLK
Even, Odd
20
ns
9
th(SOMI)M
Hold time, SPISOMI valid after
SPICLK
Even, Odd
0
ns
Even, Odd
1
ns
Even, Odd
5
ns
Normal Mode
(1)
The (BRR + 1) condition is Even when (SPIBRR + 1) is even or SPIBRR is 0 or 2. It is Odd when (SPIBRR + 1) is odd and SPIBRR is
greater than 3.
7.12.5.1.1.2 SPI Master Mode Switching Characteristics (Clock Phase = 0)
over recommended operating conditions (unless otherwise noted)
NO.
(BRR + 1)
CONDITION(1)
PARAMETER
MIN
MAX UNIT
General
1
tc(SPC)M
Cycle time, SPICLK
2
tw(SPC1)M
Pulse duration, SPICLK, first pulse
3
tw(SPC2)M
Pulse duration, SPICLK, second
pulse
Even
4tc(LSPCLK)
128tc(LSPCLK)
Odd
5tc(LSPCLK)
127tc(LSPCLK)
0.5tc(SPC)M – 1
0.5tc(SPC)M + 1
0.5tc(SPC)M +0.5tc(LSPCLK)
–1
0.5tc(SPC)M +0.5tc(LSPCLK)
+1
Even
23
24
144
td(SPC)M
tv(STE)M
Odd
Even
0.5tc(SPC)M – 1
0.5tc(SPC)M + 1
0.5tc(SPC)M –0.5tc(LSPCLK) –
1
0.5tc(SPC)M –0.5tc(LSPCLK)
+1
Even
1.5tc(SPC)M - 3tc(SYSCLK) –
7
1.5tc(SPC)M - 3tc(SYSCLK) +
5
Odd
1.5tc(SPC)M - 4tc(SYSCLK) –
7
1.5tc(SPC)M - 4tc(SYSCLK) +
5
Odd
Delay time, SPISTE active to SPICLK
Valid time, SPICLK to SPISTE
inactive
Even
Odd
0.5tc(SPC)M – 7
0.5tc(SPC)M + 5
0.5tc(SPC)M –0.5tc(LSPCLK) –
7
0.5tc(SPC)M –0.5tc(LSPCLK)
+5
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ns
ns
ns
ns
ns
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over recommended operating conditions (unless otherwise noted)
NO.
(BRR + 1)
CONDITION(1)
PARAMETER
MIN
MAX UNIT
High Speed Mode
4
td(SIMO)M
Delay time, SPICLK to SPISIMO valid Even, Odd
1
Even
ns
0.5tc(SPC)M – 2
5
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
4
td(SIMO)M
Delay time, SPICLK to SPISIMO valid Even, Odd
5
tv(SIMO)M
Valid time, SPISIMO valid after
SPICLK
ns
0.5tc(SPC)M –0.5tc(LSPCLK) –
2
Odd
Normal Mode
(1)
6
Even
ns
0.5tc(SPC)M – 5
ns
0.5tc(SPC)M –0.5tc(LSPCLK) –
5
Odd
The (BRR + 1) condition is Even when (SPIBRR + 1) is even or SPIBRR is 0 or 2. It is Odd when (SPIBRR + 1) is odd and SPIBRR is
greater than 3.
7.12.5.1.1.3 SPI Master Mode Switching Characteristics (Clock Phase = 1)
over recommended operating conditions (unless otherwise noted)
NO.
(BRR + 1)
CONDITION(1)
PARAMETER
MIN
MAX UNIT
General
Even
4tc(LSPCLK)
128tc(LSPCLK)
Odd
5tc(LSPCLK)
127tc(LSPCLK)
0.5tc(SPC)M – 1
0.5tc(SPC)M + 1
0.5tc(SPC)M – 0.5tc(LSPCLK) – 1
0.5tc(SPC)M –
0.5tc(LSPCLK) + 1
0.5tc(SPC)M – 1
0.5tc(SPC)M + 1
0.5tc(SPC)M + 0.5tc(LSPCLK) – 1
0.5tc(SPC)M +
0.5tc(LSPCLK) + 1
2tc(SPC)M – 3tc(SYSCLK) – 7
2tc(SPC)M –
3tc(SYSCLK) + 5
1
tc(SPC)M
Cycle time, SPICLK
2
tw(SPCH)M
Pulse duration, SPICLK, first
pulse
3
tw(SPC2)M
Pulse duration, SPICLK,
second pulse
23
td(SPC)M
Delay time, SPISTE valid to
SPICLK
24
tv(STE)M
Valid time, SPICLK to SPISTE
invalid
Even
–7
+5
Odd
–7
+5
Even
Even
Odd
Even
Odd
Even, Odd
ns
ns
ns
ns
ns
High Speed Mode
4
td(SIMO)M
Delay time, SPISIMO valid to
SPICLK
5
tv(SIMO)M
Valid time, SPISIMO valid after Even
SPICLK
Odd
0.5tc(SPC)M – 1
Odd
0.5tc(SPC)M + 0.5tc(LSPCLK) – 1
0.5tc(SPC)M – 2
0.5tc(SPC)M – 0.5tc(LSPCLK) – 2
ns
ns
Normal Mode
Even
4
td(SIMO)M
Delay time, SPISIMO valid to
SPICLK
5
tv(SIMO)M
Valid time, SPISIMO valid after Even
SPICLK
Odd
(1)
Odd
0.5tc(SPC)M – 5
0.5tc(SPC)M + 0.5tc(LSPCLK) – 5
0.5tc(SPC)M – 5
0.5tc(SPC)M – 0.5tc(LSPCLK) – 5
ns
ns
The (BRR + 1) condition is Even when (SPIBRR + 1) is even or SPIBRR is 0 or 2. It is Odd when (SPIBRR + 1) is odd and SPIBRR is
greater than 3.
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1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
SPISIMO
Master Out Data Is Valid
8
9
Master In Data
Must Be Valid
SPISOMI
24
23
(A)
SPISTE
A. On the trailing end of the word, SPISTE will go inactive except between back-to-back transmit words in both FIFO and non-FIFO modes.
Figure 7-68. SPI Master Mode External Timing (Clock Phase = 0)
1
SPICLK
(clock polarity = 0)
2
3
SPICLK
(clock polarity = 1)
4
5
Master Out Data Is Valid
SPISIMO
8
9
Master In Data Must
Be Valid
SPISOMI
24
23
(A)
SPISTE
A. On the trailing end of the word, SPISTE will go inactive except between back-to-back transmit words in both FIFO and non-FIFO modes.
Figure 7-69. SPI Master Mode External Timing (Clock Phase = 1)
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7.12.5.1.2 SPI Slave Mode Timings
Section 7.12.5.1.2.1 lists the SPI slave mode timing requirements. Section 7.12.5.1.2.2 lists the SPI slave mode
switching characteristics. Figure 7-70 shows the SPI slave mode external timing where the clock phase = 0.
Figure 7-71 shows the SPI slave mode external timing where the clock phase = 1.
7.12.5.1.2.1 SPI Slave Mode Timing Requirements
NO.
MIN
MAX
UNIT
12
tc(SPC)S
Cycle time, SPICLK
4tc(SYSCLK)
ns
13
tw(SPC1)S
Pulse duration, SPICLK, first pulse
2tc(SYSCLK) – 1
ns
14
tw(SPC2)S
Pulse duration, SPICLK, second pulse
2tc(SYSCLK) – 1
ns
19
tsu(SIMO)S
Setup time, SPISIMO valid before SPICLK
1.5tc(SYSCLK)
ns
20
th(SIMO)S
Hold time, SPISIMO valid after SPICLK
25
26
tsu(STE)S
th(STE)S
1.5tc(SYSCLK)
ns
Setup time, SPISTE valid before
SPICLK (Clock Phase = 0)
2tc(SYSCLK) + 4
ns
Setup time, SPISTE valid before
SPICLK (Clock Phase = 1)
2tc(SYSCLK) + 14
ns
1.5tc(SYSCLK)
ns
Hold time, SPISTE invalid after SPICLK
7.12.5.1.2.2 SPI Slave Mode Switching Characteristics
over recommended operating conditions (unless otherwise noted)
NO.
PARAMETER
MIN
MAX
UNIT
High Speed Mode
15
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
16
tv(SOMI)S
Valid time, SPISOMI valid after SPICLK
9
15
td(SOMI)S
Delay time, SPICLK to SPISOMI valid
16
tv(SOMI)S
Valid time, SPISOMI valid after SPICLK
0
ns
ns
Normal Mode
20
0
ns
ns
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12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
15
SPISOMI
16
SPISOMI Data Is Valid
19
20
SPISIMO Data
Must Be Valid
SPISIMO
25
26
SPISTE
Figure 7-70. SPI Slave Mode External Timing (Clock Phase = 0)
12
SPICLK
(clock polarity = 0)
13
14
SPICLK
(clock polarity = 1)
15
SPISOMI
Data Valid
SPISOMI Data Is Valid
Data Valid
16
19
20
SPISIMO Data
Must Be Valid
SPISIMO
26
25
SPISTE
Figure 7-71. SPI Slave Mode External Timing (Clock Phase = 1)
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7.12.6 Universal Serial Bus (USB) Controller
The USB controller operates as a full-speed or low-speed function controller during point-to-point
communications with USB host or device functions.
The USB module has the following features:
• USB 2.0 full-speed and low-speed operation
• Integrated PHY
• Three transfer types: control, interrupt, and bulk
• 32 endpoints
– One dedicated control IN endpoint and one dedicated control OUT endpoint
– 15 configurable IN endpoints and 15 configurable OUT endpoints
• 4KB of dedicated endpoint memory
Figure 7-72 shows the USB block diagram.
Endpoint Control
Transmit
EP0 –31
Control
Receive
CPU Interface
Combine
Endpoints
Host
Transaction
Scheduler
Interrupt
Control
Interrupts
EP Reg.
Decoder
USB FS/LS
PHY
UTM
Synchronization
Packet
Encode/Decode
Data Sync
Packet Encode
HNP/SRP
Packet Decode
Timers
CRC Gen/Check
FIFO RAM
Controller
Rx
Rx
Buff
Buff
Tx
Buff
Common
Regs
CPU Bus
Cycle
Control
Tx
Buff
Cycle Control
FIFO
Decoder
USB DataLines
D+ andD-
Figure 7-72. USB Block Diagram
Note
The accuracy of the on-chip zero-pin oscillator (Section 7.9.3.5.1, Internal Oscillator Electrical
Characteristics) will not meet the accuracy requirements of the USB protocol. An external clock source
must be used for applications using USB. For applications using the USB boot mode, see Section 8.9
(Boot ROM and Peripheral Booting) for clock frequency requirements.
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7.12.6.1 USB Electrical Data and Timing
Section 7.12.6.1.1 shows the USB input ports DP and DM timing requirements. Section 7.12.6.1.2 shows the
USB output ports DP and DM switching characteristics.
7.12.6.1.1 USB Input Ports DP and DM Timing Requirements
MIN
MAX
V(CM)
Differential input common mode range
0.8
2.5
UNIT
Z(IN)
Input impedance
300
VCRS
Crossover voltage
1.3
VIL
Static SE input logic-low level
0.8
VIH
Static SE input logic-high level
2.0
V
VDI
Differential input voltage
0.2
V
V
kΩ
2.0
V
V
7.12.6.1.2 USB Output Ports DP and DM Switching Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VOH
D+, D– single-ended
USB 2.0 load conditions
2.8
3.6
V
VOL
D+, D– single-ended
USB 2.0 load conditions
0
0.3
V
Z(DRV)
D+, D– impedance
tr
Rise time
Full speed, differential, CL = 50 pF, 10%/90%,
Rpu on D+
tf
Fall time
Full speed, differential, CL = 50 pF, 10%/90%,
Rpu on D+
150
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28
44
Ω
4
20
ns
4
20
ns
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8 Detailed Description
8.1 Overview
The TMS320F2807x microcontroller family is suited for advanced closed-loop control applications such as
industrial motor drives; solar inverters and digital power; electrical vehicles and transportation; and sensing and
signal processing. Complete development packages for digital power and industrial drives are available as part
of the powerSUITE and DesignDRIVE initiatives.
The F2807x is a 32-bit floating-point microcontroller based on TI’s industry-leading C28x core. This core is
boosted by the trigonometric hardware accelerator which improves performance of trigonometric-based
algorithms with CPU instructions such as sine, cosine, and arctangent functions, which are common in torqueloop and position calculations.
The F2807x microcontroller family features a CLA real-time control coprocessor. The CLA is an independent 32bit floating-point processor that runs at the same speed as the main CPU. The CLA responds to peripheral
triggers and executes code concurrently with the main C28x CPU. This parallel processing capability can
effectively double the computational performance of a real-time control system. By using the CLA to service
time-critical functions, the main C28x CPU is free to perform other tasks, such as communications and
diagnostics.
The F2807x device supports up to 512KB (256KW) of ECC-protected onboard flash memory and up to 100KB
(50KW) of SRAM with parity. Two independent security zones are also available for 128-bit code protection of
the main C28x.
The analog subsystem boasts up to three 12-bit ADCs, which enable simultaneous management of three
independent power phases, and up to eight windowed comparator subsystems (CMPSSs), allowing very fast,
direct trip of the PWMs in overvoltage or overcurrent conditions. In addition, the device has three 12-bit DACs,
and precision control peripherals such as enhanced pulse width modulators (ePWMs) with fault protection,
eQEP peripherals, and eCAP units.
Connectivity peripherals such as dual Controller Area Network (CAN) modules (ISO 11898-1/CAN 2.0Bcompliant) and a USB 2.0 port with MAC and full-speed PHY let users add universal serial bus (USB)
connectivity to their application.
8.2 Functional Block Diagram
Figure 8-1 shows the CPU system and associated peripherals.
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MEMCPU1
C28 CPU-1
CPU1.CLA1 to CPU1
128x16 MSG RAM
CPU1 to CPU1.CLA1
128x16 MSG RAM
CPU1.CLA1
FPU
TMU
Dual
Code
Security
Module
+
Emulation
Code
Security
Logic
(ECSL)
CPU1 Local Shared
6x 2Kx16
LS0-LS5 RAMs
Secure Memories
shown in Red
User
Configurable
DCSM
PSWD
OTP
1K x 16
CPU1.D0 RAM 2Kx16
CPU1.D1 RAM 2Kx16
CPU1.M1 RAM 1Kx16
B
D
Config
ADCIN14
ADCIN15
(up to 192
interrupts)
Secure-ROM 32Kx16
Secure
Data Bus
Bridge
TCK
JTAG
TDI
CPU1.CLA1 Data ROM
(4Kx16)
TDO
CPU1.DMA
CPU1 Buses
MFSXx
MFSRx
MCLKXx
MCLKRx
MDXx
MDRx
SPISTEx
SPICLKx
SPISIMOx
McBSP-A/B
EMIF1
GPIO
GPIOn
SPIA/B/C
(16L FIFO)
Data Bus
Bridge
EM1CTLx
CANA/B
(32-MBOX)
Data Bus
Bridge
EM1Dx
USB
Ctrl /
PHY
Peripheral Frame 2
EM1Ax
Data Bus
Bridge
USBDP
SCITXDx
SCIRXDx
SDx_Cy
SDx_Dy
EQEPxI
EQEPxS
EQEPxB
I2C-A/B
(16L FIFO)
SCLx
SCIA/B/C/D
(16L FIFO)
SDAx
SDFM-1/2
Data Bus
Bridge
USBDM
Data Bus Bridge
eQEP-1/2/3
EQEPxA
ECAPx
eCAP1/../6
EXTSYNCOUT
EPWMxB
EXTSYNCIN
EPWMxA
TZ1-TZ6
TRST
TMS
Peripheral Frame 1
ePWM-1/../12
Aux PLL
Boot-ROM 32Kx16
Nonsecure
Comparator
DAC
Subsystem
x3
(CMPSS)
HRPWM-1/../8
INTOSC2
Global Shared
8x 4Kx16
GS0-GS7 RAMs
SPISOMIx
Analog
MUX
ADC
Result
Regs
Main PLL
PUMP
AUXCLKIN
ePIE
CANTXx
D4:0
12-bit ADC
x3
CPU1.CLA1 Bus
B3:0
A
INTOSC1
External Crystal or
Oscillator
CANRXx
A5:0
Watchdog
256K x 16
Secure
CPU Timer 0
CPU Timer 1
CPU Timer 2
CPU1.M0 RAM 1Kx16
GPIO MUX
FLASH
OTP/Flash
Wrapper
WD Timer
NMI-WDT
Low-Power
Mode Control
GPIO MUX, Input X-BAR, Output X-BAR
Figure 8-1. Functional Block Diagram
152
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8.3 Memory
8.3.1 C28x Memory Map
The C28x memory map is described in Table 8-1. Memories accessible by the CLA or DMA (direct memory
access) are noted as well.
Table 8-1. C28x Memory Map
MEMORY
SIZE
START ADDRESS
END ADDRESS
M0 RAM
1K × 16
0x0000 0000
0x0000 03FF
M1 RAM
1K × 16
0x0000 0400
0x0000 07FF
PieVectTable
512 × 16
0x0000 0D00
0x0000 0EFF
CLA to CPU MSGRAM
128 × 16
0x0000 1480
0x0000 14FF
Yes
CPU to CLA MSGRAM
128 × 16
0x0000 1500
0x0000 157F
Yes
LS0 RAM
2K × 16
0x0000 8000
0x0000 87FF
Yes
LS1 RAM
2K × 16
0x0000 8800
0x0000 8FFF
Yes
LS2 RAM
2K × 16
0x0000 9000
0x0000 97FF
Yes
LS3 RAM
2K × 16
0x0000 9800
0x0000 9FFF
Yes
LS4 RAM
2K × 16
0x0000 A000
0x0000 A7FF
Yes
LS5 RAM
2K × 16
0x0000 A800
0x0000 AFFF
Yes
D0 RAM
2K × 16
0x0000 B000
0x0000 B7FF
D1 RAM
2K × 16
0x0000 B800
0x0000 BFFF
GS0 RAM
4K × 16
0x0000 C000
0x0000 CFFF
Yes
GS1 RAM
4K × 16
0x0000 D000
0x0000 DFFF
Yes
GS2 RAM
4K × 16
0x0000 E000
0x0000 EFFF
Yes
GS3 RAM
4K × 16
0x0000 F000
0x0000 FFFF
Yes
GS4 RAM
4K × 16
0x0001 0000
0x0001 0FFF
Yes
GS5 RAM
4K × 16
0x0001 1000
0x0001 1FFF
Yes
GS6 RAM
4K × 16
0x0001 2000
0x0001 2FFF
Yes
GS7 RAM
4K × 16
0x0001 3000
0x0001 3FFF
Yes
CAN A Message RAM
2K × 16
0x0004 9000
0x0004 97FF
CAN B Message RAM
2K × 16
0x0004 B000
0x0004 B7FF
0x000B FFFF
Flash Bank 0
256K × 16
0x0008 0000
Secure ROM
32K × 16
0x003F 0000
0x003F 7FFF
Boot ROM
32K × 16
0x003F 8000
0x003F FFBF
64 × 16
0x003F FFC0
0x003F FFFF
Vectors
CLA ACCESS
DMA ACCESS
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8.3.2 Flash Memory Map
The F28076 and F28075 devices have one flash bank of 512KB (256KW). See Section 7.9.4 for details on flash
wait-states. Table 1-1 shows the addresses of flash sectors on F28076 and F28075.
Table 8-2. Addresses of Flash Sectors on F28076 and F28075
SECTOR
SIZE
START ADDRESS
END ADDRESS
OTP Sectors
TI OTP Bank 0
1K x 16
0x0007 0000
0x0007 03FF
User configurable DCSM OTP
Bank 0
1K x 16
0x0007 8000
0x0007 83FF
Sector 0
8K x 16
0x0008 0000
0x0008 1FFF
Sector 1
8K x 16
0x0008 2000
0x0008 3FFF
Sector 2
8K x 16
0x0008 4000
0x0008 5FFF
Sector 3
8K x 16
0x0008 6000
0x0008 7FFF
Sector 4
32K x 16
0x0008 8000
0x0008 FFFF
Sector 5
32K x 16
0x0009 0000
0x0009 7FFF
Sector 6
32K x 16
0x0009 8000
0x0009 FFFF
Sector 7
32K x 16
0x000A 0000
0x000A 7FFF
Sector 8
32K x 16
0x000A 8000
0x000A FFFF
Sector 9
32K x 16
0x000B 0000
0x000B 7FFF
Sector 10
8K x 16
0x000B 8000
0x000B 9FFF
Sector 11
8K x 16
0x000B A000
0x000B BFFF
Sector 12
8K x 16
0x000B C000
0x000B DFFF
Sector 13
8K x 16
0x000B E000
0x000B FFFF
Sectors
Flash ECC Locations
TI OTP ECC Bank 0
128 x 16
0x0107 0000
0x0107 007F
User-configurable DCSM OTP
ECC Bank 0
128 x 16
0x0107 1000
0x0107 107F
Flash ECC (Sector 0)
1K x 16
0x0108 0000
0x0108 03FF
Flash ECC (Sector 1)
1K x 16
0x0108 0400
0x0108 07FF
Flash ECC (Sector 2)
1K x 16
0x0108 0800
0x0108 0BFF
Flash ECC (Sector 3)
1K x 16
0x0108 0C00
0x0108 0FFF
Flash ECC (Sector 4)
4K x 16
0x0108 1000
0x0108 1FFF
Flash ECC (Sector 5)
4K x 16
0x0108 2000
0x0108 2FFF
Flash ECC (Sector 6)
4K x 16
0x0108 3000
0x0108 3FFF
Flash ECC (Sector 7)
4K x 16
0x0108 4000
0x0108 4FFF
Flash ECC (Sector 8)
4K x 16
0x0108 5000
0x0108 5FFF
Flash ECC (Sector 9)
4K x 16
0x0108 6000
0x0108 6FFF
Flash ECC (Sector 10)
1K x 16
0x0108 7000
0x0108 73FF
Flash ECC (Sector 11)
1K x 16
0x0108 7400
0x0108 77FF
Flash ECC (Sector 12)
1K x 16
0x0108 7800
0x0108 7BFF
Flash ECC (Sector 13)
1K x 16
0x0108 7C00
0x0108 7FFF
154
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8.3.3 EMIF Chip Select Memory Map
The EMIF memory map is shown in Table 8-3.
Table 8-3. EMIF Chip Select Memory Map
EMIF CHIP SELECT
EMIF1_CS0n - Data
EMIF1_CS2n - Program +
Data(2)
SIZE(1)
START ADDRESS
END ADDRESS
256M × 16
0x8000 0000
0x8FFF FFFF
Yes
CLA ACCESS
DMA ACCESS
2M × 16
0x0010 0000
0x002F FFFF
Yes
EMIF1_CS3n - Program + Data
512K × 16
0x0030 0000
0x0037 FFFF
Yes
EMIF1_CS4n - Program + Data
393K × 16
0x0038 0000
0x003D FFFF
Yes
(1)
(2)
Available memory size listed in this table is the maximum possible size assuming 32-bit memory. This may not apply to other memory
sizes because of pin mux setting. See Section 6.4.1 to find the available address lines for your use case.
The 2M × 16 size is for a 32-bit interface with the assumption that 16-bit accesses are not performed; hence, byte enables are not
used (tied to active value on board). If byte enables are used, then the maximum size is smaller because byte enables are muxed with
address pins (see Section 6.4.1) . If 16-bit memory is used, then the maximum size is 1M × 16.
8.3.4 Peripheral Registers Memory Map
The peripheral registers memory map can be found in Table 8-4. Registers in the peripheral frames share a
secondary master (CLA or DMA) selection with all other registers within the same peripheral frame. See the
TMS320F2807x Microcontrollers Technical Reference Manual for details on the CPU subsystem and secondary
master selection.
Table 8-4. Peripheral Registers Memory Map
REGISTERS
STRUCTURE NAME
START
ADDRESS
END
ADDRESS
CLA
ACCESS
DMA
ACCESS
AdcaResultRegs
ADC_RESULT_REGS
0x0000 0B00
AdcbResultRegs
ADC_RESULT_REGS
0x0000 0B20
0x0000 0B1F
Yes
Yes
0x0000 0B3F
Yes
AdcdResultRegs
ADC_RESULT_REGS
Yes
0x0000 0B60
0x0000 0B7F
Yes
CpuTimer0Regs
Yes
CPUTIMER_REGS
0x0000 0C00
0x0000 0C07
CpuTimer1Regs
CPUTIMER_REGS
0x0000 0C08
0x0000 0C0F
CpuTimer2Regs
CPUTIMER_REGS
0x0000 0C10
0x0000 0C17
PIE_CTRL_REGS
0x0000 0CE0
0x0000 0CFF
CLA_SOFTINT_REGS
0x0000 0CE0
0x0000 0CFF
DmaRegs
DMA_REGS
0x0000 1000
0x0000 11FF
Cla1Regs
CLA_REGS
0x0000 1400
0x0000 147F
PieCtrlRegs
(2)
Cla1SoftIntRegs
(2)
(1)
PROTECTED
Yes – CLA
only, no
CPU
access
Peripheral Frame 1
EPwm1Regs
EPWM_REGS
0x0000 4000
0x0000 40FF
Yes
Yes
Yes
EPwm2Regs
EPWM_REGS
0x0000 4100
0x0000 41FF
Yes
Yes
Yes
EPwm3Regs
EPWM_REGS
0x0000 4200
0x0000 42FF
Yes
Yes
Yes
EPwm4Regs
EPWM_REGS
0x0000 4300
0x0000 43FF
Yes
Yes
Yes
EPwm5Regs
EPWM_REGS
0x0000 4400
0x0000 44FF
Yes
Yes
Yes
EPwm6Regs
EPWM_REGS
0x0000 4500
0x0000 45FF
Yes
Yes
Yes
EPwm7Regs
EPWM_REGS
0x0000 4600
0x0000 46FF
Yes
Yes
Yes
EPwm8Regs
EPWM_REGS
0x0000 4700
0x0000 47FF
Yes
Yes
Yes
EPwm9Regs
EPWM_REGS
0x0000 4800
0x0000 48FF
Yes
Yes
Yes
EPwm10Regs
EPWM_REGS
0x0000 4900
0x0000 49FF
Yes
Yes
Yes
EPwm11Regs
EPWM_REGS
0x0000 4A00
0x0000 4AFF
Yes
Yes
Yes
EPwm12Regs
EPWM_REGS
0x0000 4B00
0x0000 4BFF
Yes
Yes
Yes
ECap1Regs
ECAP_REGS
0x0000 5000
0x0000 501F
Yes
Yes
Yes
ECap2Regs
ECAP_REGS
0x0000 5020
0x0000 503F
Yes
Yes
Yes
ECap3Regs
ECAP_REGS
0x0000 5040
0x0000 505F
Yes
Yes
Yes
ECap4Regs
ECAP_REGS
0x0000 5060
0x0000 507F
Yes
Yes
Yes
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Table 8-4. Peripheral Registers Memory Map (continued)
START
ADDRESS
END
ADDRESS
CLA
ACCESS
DMA
ACCESS
Yes
Yes
Yes
Yes
Yes
Yes
0x0000 513F
Yes
Yes
Yes
0x0000 517F
Yes
Yes
Yes
0x0000 5180
0x0000 51BF
Yes
Yes
Yes
0x0000 5C00
0x0000 5C0F
Yes
Yes
Yes
0x0000 5C10
0x0000 5C1F
Yes
Yes
Yes
DAC_REGS
0x0000 5C20
0x0000 5C2F
Yes
Yes
Yes
Cmpss1Regs
CMPSS_REGS
0x0000 5C80
0x0000 5C9F
Yes
Yes
Yes
Cmpss2Regs
CMPSS_REGS
0x0000 5CA0
0x0000 5CBF
Yes
Yes
Yes
Cmpss3Regs
CMPSS_REGS
0x0000 5CC0
0x0000 5CDF
Yes
Yes
Yes
Cmpss4Regs
CMPSS_REGS
0x0000 5CE0
0x0000 5CFF
Yes
Yes
Yes
Cmpss5Regs
CMPSS_REGS
0x0000 5D00
0x0000 5D1F
Yes
Yes
Yes
Cmpss6Regs
CMPSS_REGS
0x0000 5D20
0x0000 5D3F
Yes
Yes
Yes
Cmpss7Regs
CMPSS_REGS
0x0000 5D40
0x0000 5D5F
Yes
Yes
Yes
Cmpss8Regs
CMPSS_REGS
0x0000 5D60
0x0000 5D7F
Yes
Yes
Yes
Sdfm1Regs
SDFM_REGS
0x0000 5E00
0x0000 5E7F
Yes
Yes
Yes
Sdfm2Regs
SDFM_REGS
0x0000 5E80
0x0000 5EFF
Yes
Yes
Yes
REGISTERS
STRUCTURE NAME
PROTECTED
ECap5Regs
ECAP_REGS
0x0000 5080
0x0000 509F
ECap6Regs
ECAP_REGS
0x0000 50A0
0x0000 50BF
EQep1Regs
EQEP_REGS
0x0000 5100
EQep2Regs
EQEP_REGS
0x0000 5140
EQep3Regs
EQEP_REGS
DacaRegs
DAC_REGS
DacbRegs
DAC_REGS
DaccRegs
(1)
Peripheral Frame 2
156
McbspaRegs
MCBSP_REGS
0x0000 6000
0x0000 603F
Yes
Yes
Yes
McbspbRegs
MCBSP_REGS
0x0000 6040
0x0000 607F
Yes
Yes
Yes
SpiaRegs
SPI_REGS
0x0000 6100
0x0000 610F
Yes
Yes
Yes
SpibRegs
SPI_REGS
0x0000 6110
0x0000 611F
Yes
Yes
Yes
SpicRegs
SPI_REGS
0x0000 6120
0x0000 612F
Yes
Yes
Yes
WdRegs
WD_REGS
0x0000 7000
0x0000 703F
Yes
NmiIntruptRegs
NMI_INTRUPT_REGS
0x0000 7060
0x0000 706F
Yes
XintRegs
XINT_REGS
0x0000 7070
0x0000 707F
Yes
SciaRegs
SCI_REGS
0x0000 7200
0x0000 720F
Yes
ScibRegs
SCI_REGS
0x0000 7210
0x0000 721F
Yes
ScicRegs
SCI_REGS
0x0000 7220
0x0000 722F
Yes
ScidRegs
SCI_REGS
0x0000 7230
0x0000 723F
Yes
I2caRegs
I2C_REGS
0x0000 7300
0x0000 733F
Yes
I2cbRegs
I2C_REGS
0x0000 7340
0x0000 737F
Yes
AdcaRegs
ADC_REGS
0x0000 7400
0x0000 747F
Yes
Yes
AdcbRegs
ADC_REGS
0x0000 7480
0x0000 74FF
Yes
Yes
Yes
AdcdRegs
ADC_REGS
0x0000 7580
0x0000 75FF
Yes
InputXbarRegs
INPUT_XBAR_REGS
0x0000 7900
0x0000 791F
Yes
XbarRegs
XBAR_REGS
0x0000 7920
0x0000 793F
Yes
TrigRegs
TRIG_REGS
0x0000 7940
0x0000 794F
Yes
DmaClaSrcSelRegs
DMA_CLA_SRC_SEL_REGS
0x0000 7980
0x0000 798F
Yes
EPwmXbarRegs
EPWM_XBAR_REGS
0x0000 7A00
0x0000 7A3F
Yes
OutputXbarRegs
OUTPUT_XBAR_REGS
0x0000 7A80
0x0000 7ABF
Yes
GpioCtrlRegs
GPIO_CTRL_REGS
0x0000 7C00
0x0000 7D7F
Yes
GpioDataRegs
GPIO_DATA_REGS
0x0000 7F00
0x0000 7F2F
Yes
UsbaRegs
USB_REGS
0x0004 0000
0x0004 0FFF
Yes
Emif1Regs
EMIF_REGS
0x0004 7000
0x0004 77FF
Yes
CanaRegs
CAN_REGS
0x0004 8000
0x0004 87FF
Yes
CanbRegs
CAN_REGS
0x0004 A000
0x0004 A7FF
Yes
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Table 8-4. Peripheral Registers Memory Map (continued)
(1)
(2)
START
ADDRESS
END
ADDRESS
REGISTERS
STRUCTURE NAME
PROTECTED
FlashPumpSemaphoreRegs
FLASH_PUMP_SEMAPHORE_REGS
0x0005 0024
0x0005 0025
Yes
DevCfgRegs
DEV_CFG_REGS
0x0005 D000
0x0005 D17F
Yes
AnalogSubsysRegs
ANALOG_SUBSYS_REGS
0x0005 D180
0x0005 D1FF
Yes
ClkCfgRegs
CLK_CFG_REGS
0x0005 D200
0x0005 D2FF
Yes
CpuSysRegs
CPU_SYS_REGS
0x0005 D300
0x0005 D3FF
Yes
RomPrefetchRegs
ROM_PREFETCH_REGS
0x0005 E608
0x0005 E60B
Yes
DcsmZ1Regs
DCSM_Z1_REGS
0x0005 F000
0x0005 F02F
Yes
DcsmZ2Regs
DCSM_Z2_REGS
0x0005 F040
0x0005 F05F
Yes
DcsmCommonRegs
DCSM_COMMON_REGS
0x0005 F070
0x0005 F07F
Yes
MemCfgRegs
MEM_CFG_REGS
0x0005 F400
0x0005 F47F
Yes
Emif1ConfigRegs
EMIF1_CONFIG_REGS
0x0005 F480
0x0005 F49F
Yes
AccessProtectionRegs
ACCESS_PROTECTION_REGS
0x0005 F4C0
0x0005 F4FF
Yes
MemoryErrorRegs
MEMORY_ERROR_REGS
0x0005 F500
0x0005 F53F
Yes
RomWaitStateRegs
ROM_WAIT_STATE_REGS
0x0005 F540
0x0005 F541
Yes
Flash0CtrlRegs
FLASH_CTRL_REGS
0x0005 F800
0x0005 FAFF
Yes
Flash0EccRegs
FLASH_ECC_REGS
0x0005 FB00
0x0005 FB3F
Yes
(1)
CLA
ACCESS
DMA
ACCESS
The CPU (not applicable for CLA or DMA) contains a write followed by read protection mode to ensure that any read operation that
follows a write operation within a protected address range is executed as written by delaying the read operation until the write is
initiated.
The address overlap of PieCtrlRegs and Cla1SoftIntRegs is correct. Each CPU, C28x and CLA, only has access to one of the register
sets.
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8.3.5 Memory Types
Table 8-5 provides more information about each memory type.
Table 8-5. Memory Types
MEMORY TYPE
ECC-CAPABLE
PARITY
SECURITY
HIBERNATE
RETENTION
ACCESS
PROTECTION
M0, M1
Yes
–
–
Yes
–
D0, D1
Yes
–
Yes
–
Yes
–
Yes
Yes
–
Yes
LSx
GSx
–
Yes
–
–
Yes
CPU/CLA MSGRAM
–
Yes
Yes
–
Yes
Boot ROM
–
–
–
N/A
–
Secure ROM
–
–
Yes
N/A
–
Flash
Yes
–
Yes
N/A
N/A
User-configurable DCSM OTP
Yes
–
Yes
N/A
N/A
8.3.5.1 Dedicated RAM (Mx and Dx RAM)
The CPU subsystem has four dedicated ECC-capable RAM blocks: M0, M1, D0, and D1. M0/M1 memories are
small nonsecure blocks that are tightly coupled with the CPU (that is, only the CPU has access to them). D0/D1
memories are secure blocks and also have the access-protection feature (CPU write/CPU fetch protection).
8.3.5.2 Local Shared RAM (LSx RAM)
RAM blocks which are dedicated to each subsystem and are accessible to its CPU and CLA only, are called
local shared RAMs (LSx RAMs).
All LSx RAM blocks have parity. These memories are secure and have the access protection (CPU write/CPU
fetch) feature.
By default, these memories are dedicated to the CPU only, and the user could choose to share these memories
with the CLA by configuring the MSEL_LSx bit field in the LSxMSEL registers appropriately.
Table 8-6 shows the master access for the LSx RAM.
Table 8-6. Master Access for LSx RAM
(With Assumption That all Other Access Protections are Disabled)
158
MSEL_LSx
CLAPGM_LSx
CPU ALLOWED ACCESS CLA ALLOWED ACCESS
00
X
All
–
LSx memory is configured
as CPU dedicated RAM.
01
0
All
Data Read
Data Write
LSx memory is shared
between CPU and CLA1.
01
1
Emulation Read
Emulation Write
Fetch Only
LSx memory is CLA1
program memory.
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8.3.5.3 Global Shared RAM (GSx RAM)
RAM blocks which are accessible from both the CPU and DMA are called global shared RAMs (GSx RAMs).
Both the CPU and DMA have full read and write access to these memories.
All GSx RAM blocks have parity.
The GSx RAMs have access protection (CPU write/CPU fetch/DMA write).
8.3.5.4 CLA Message RAM (CLA MSGRAM)
These RAM blocks can be used to share data between the CPU and CLA. The CLA has read and write access
to the "CLA to CPU MSGRAM." The CPU has read and write access to the "CPU to CLA MSGRAM." The CPU
and CLA both have read access to both MSGRAMs.
This RAM has parity.
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8.4 Identification
Table 8-7 shows the Device Identification Registers.
Table 8-7. Device Identification Registers
NAME
ADDRESS
SIZE (x16)
DESCRIPTION
Device part identification number(1)
PARTIDH
0x0005 D00A
2
TMS320F28076
0x**FC 0500
TMS320F28075
0x**FF 0500
Silicon revision number
REVID
UID_UNIQUE
0x0005 D00C
0x0007 03CC
2
N/A
N/A
JTAG ID
(1)
160
2
Revision B
0x0000 0002
Revision C
0x0000 0003
Unique identification number. This number is different on each
individual device with the same PARTIDH. This can be used as
a serial number in the application. This number is present only
on TMS Revision C devices.
JTAG Device ID
0x0B99 C02F
PARTIDH may have one of two values for each part number, with the eight most significant bits identified with '**' above being 0x00 or
0x02.
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8.5 Bus Architecture – Peripheral Connectivity
Table 8-8 shows a broad view of the peripheral and configuration register accessibility from each bus master.
Peripherals within peripheral frames 1 or 2 will all be mapped to the respective secondary master as a group (if
SPI is assigned to CPU1.DMA, then McBSP is also assigned to CPU1.DMA).
Table 8-8. Bus Master Peripheral Access
PERIPHERALS
(BY BUS ACCESS TYPE)
CPU1.DMA
CPU1.CLA1
CPU1
Peripheral Frame 1:
• ePWM/HRPWM
• SDFM
• eCAP(1)
• eQEP(1)
• CMPSS(1)
• DAC(1)
Y
Y
Y
Peripheral Frame 2:
• SPI
• McBSP
Y
Y
Y
SCI
Y
I2C
Y
CAN
Y
ADC Configuration
Y
EMIF1
Y
Y
Y
USB
Y
Device Capability, Peripheral Reset, Peripheral CPU Select
Y
GPIO Pin Mapping and Configuration
Y
Analog System Control
Y
Reset Configuration
Y
Clock and PLL Configuration
Y
System Configuration
(WD, NMIWD, LPM, Peripheral Clock Gating)
Y
Flash Configuration
Y
CPU Timers
Y
DMA and CLA Trigger Source Select
Y
GPIO
Data(2)
ADC Results
(1)
(2)
Y
Y
Y
Y
Y
These modules are on a Peripheral Frame with DMA access; however, they cannot trigger a DMA transfer.
The GPIO Data Registers are unique for each CPU1 and CPU1.CLAx. When the GPIO Pin Mapping Register is configured to assign a
GPIO to a particular master, the respective GPIO Data Register will control the GPIO. See the General-Purpose Input/Output (GPIO)
chapter of the TMS320F2807x Microcontrollers Technical Reference Manual for more details.
8.6 C28x Processor
The CPU is a 32-bit fixed-point processor. This device draws from the best features of digital signal processing;
reduced instruction set computing (RISC); and microcontroller architectures, firmware, and tool sets.
The CPU features include a modified Harvard architecture and circular addressing. The RISC features are
single-cycle instruction execution, register-to-register operations, and modified Harvard architecture. The
microcontroller features include ease of use through an intuitive instruction set, byte packing and unpacking, and
bit manipulation. The modified Harvard architecture of the CPU enables instruction and data fetches to be
performed in parallel. The CPU can read instructions and data while it writes data simultaneously to maintain the
single-cycle instruction operation across the pipeline. The CPU does this over six separate address/data buses.
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For more information on CPU architecture and instruction set, see the TMS320C28x CPU and Instruction Set
Reference Guide.
8.6.1 Floating-Point Unit
The C28x plus floating-point (C28x+FPU) processor extends the capabilities of the C28x fixed-point CPU by
adding registers and instructions to support IEEE single-precision floating-point operations.
Devices with the C28x+FPU include the standard C28x register set plus an additional set of floating-point unit
registers. The additional floating-point unit registers are the following:
• Eight floating-point result registers, RnH (where n = 0–7)
• Floating-point Status Register (STF)
• Repeat Block Register (RB)
All of the floating-point registers, except the repeat block register, are shadowed. This shadowing can be used in
high-priority interrupts for fast context save and restore of the floating-point registers.
For more information, see the TMS320C28x Extended Instruction Sets Technical Reference Manual.
8.6.2 Trigonometric Math Unit
The TMU extends the capabilities of a C28x+FPU by adding instructions and leveraging existing FPU
instructions to speed up the execution of common trigonometric and arithmetic operations listed in Table 8-9.
Table 8-9. TMU Supported Instructions
INSTRUCTIONS
C EQUIVALENT OPERATION
PIPELINE CYCLES
MPY2PIF32 RaH,RbH
a = b * 2pi
2/3
DIV2PIF32 RaH,RbH
a = b / 2pi
2/3
DIVF32 RaH,RbH,RcH
a = b/c
5
SQRTF32 RaH,RbH
a = sqrt(b)
5
SINPUF32 RaH,RbH
a = sin(b*2pi)
4
COSPUF32 RaH,RbH
a = cos(b*2pi)
4
ATANPUF32 RaH,RbH
a = atan(b)/2pi
4
QUADF32 RaH,RbH,RcH,RdH
Operation to assist in calculating ATANPU2
5
No changes have been made to existing instructions, pipeline or memory bus architecture. All TMU instructions
use the existing FPU register set (R0H to R7H) to carry out their operations. A detailed explanation of the
workings of the FPU can be found in the TMS320C28x Extended Instruction Sets Technical Reference Manual.
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8.7 Control Law Accelerator
The CLA is an independent single-precision (32-bit) FPU processor with its own bus structure, fetch mechanism,
and pipeline. Eight individual CLA tasks can be specified. Each task is started by software or a peripheral such
as the ADC, ePWM, eCAP, eQEP, or CPU Timer 0. The CLA executes one task at a time to completion. When a
task completes, the main CPU is notified by an interrupt to the PIE and the CLA automatically begins the next
highest-priority pending task. The CLA can directly access the ADC Result registers, ePWM, eCAP, eQEP,
Comparator and DAC registers. Dedicated message RAMs provide a method to pass additional data between
the main CPU and the CLA.
Figure 8-2 shows the CLA block diagram.
CLA Control
Register Set
From
Shared
Peripherals
MIFR(16)
MIOVF(16)
MICLR(16)
MICLROVF(16)
MIFRC(16)
MIER(16)
MIRUN(16)
MPERINT1
to
MPERINT8
MVECT1(16)
MVECT2(16)
MVECT3(16)
MVECT4(16)
MVECT5(16)
MVECT6(16)
MVECT7(16)
MVECT8(16)
SYSCLK
CLA Clock Enable
SYSRSn
CLA_INT1
to
CLA_INT8
INT11
INT12
PIE
C28x
CPU
LVF
LUF
CPU Read/Write Data Bus
CLA Program Bus
CLA Program
Memory (LSx)
MCTL(16)
MPC(16)
MSTF(32)
MR0(32)
MR1(32)
MR2(32)
MR3(32)
MAR0(16)
MAR1(16)
CLA Data Bus
CLA Execution
Register Set
CLA Data
Memory (LSx)
CPU Data Bus
LSxMSEL[MSEL_LSx]
LSxCLAPGM[CLAPGM_LSx]
CLA Message
RAMs
Shared
Peripherals
MEALLOW
CPU Read Data Bus
Figure 8-2. CLA Block Diagram
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8.8 Direct Memory Access
The CPU has its own 6-channel DMA module. The DMA module provides a hardware method of transferring
data between peripherals and/or memory without intervention from the CPU, thereby freeing up bandwidth for
other system functions. Additionally, the DMA has the capability to orthogonally rearrange the data as it is
transferred as well as “ping-pong” data between buffers. These features are useful for structuring data into
blocks for optimal CPU processing.
The DMA module is an event-based machine, meaning it requires a peripheral or software trigger to start a DMA
transfer. Although it can be made into a periodic time-driven machine by configuring a timer as the interrupt
trigger source, there is no mechanism within the module itself to start memory transfers periodically. The
interrupt trigger source for each of the six DMA channels can be configured separately and each channel
contains its own independent PIE interrupt to let the CPU know when a DMA transfer has either started or
completed. Five of the six channels are exactly the same, while Channel 1 has the ability to be configured at a
higher priority than the others.
DMA features include:
• Six channels with independent PIE interrupts
• Peripheral interrupt trigger sources
– ADC interrupts and EVT signals
– Multichannel buffered serial port transmit and receive
– External interrupts
– CPU timers
– EPWMxSOC signals
– SPIx transmit and receive
– SDFM
– Software trigger
• Data sources and destinations:
– GSx RAM
– ADC result registers
– ePWMx
– SPI
– McBSP
– EMIF
• Word Size: 16-bit or 32-bit (SPI and McBSP limited to 16-bit)
• Throughput: four cycles/word (without arbitration)
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Figure 8-3 shows a device-level block diagram of the DMA.
ADC
RESULTS
(3)
XINT
(5)
TIMER
(3)
Global Shared
8x 4Kx16
GS0-7 RAMs
C28x Bus
DMA Bus
TINT (0-2)
XINT (1-5)
ADC INT (A,B,D) (1-4), EVT (A,B,D)
SDxFLTy (x = 1 to 2, y = 1 to 4)
SOCA (1-12), SOCB (1-12)
MXEVT (A-B), MREVT (A-B)
SPITX (A-C), SPIRX (A-C)
DMA Trigger
Source Selection
DMACHSRCSEL1.CHx
DMACHSRCSEL2.CHx
CHx.MODE.PERINTSEL
(x = 1 to 6)
DMA
DMA_CHx (1-6)
ADC
WRAPPER
(3)
C28x
PIE
DMA Trigger Source
eCAP
eQEP
DAC
CMPSS
CPU and DMA Data Path
SDFM
(8)
EPWM
(12)
McBSP
(2)
SPI
(3)
EMIF1
Figure 8-3. DMA Block Diagram
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8.9 Boot ROM and Peripheral Booting
The device boot ROM contains bootloading software. The device boot ROM is executed each time the device
comes out of reset. Users can configure the device to boot to flash (using GET mode) or choose to boot the
device through one of the bootable peripherals by configuring the boot mode GPIO pins.
Table 8-10 shows the possible boot modes supported on the device. The default boot mode pins are GPIO72
(boot mode pin 1) and GPIO 84 (boot mode pin 0). Users may choose to have weak pullups for boot mode pins if
they use a peripheral on these pins as well, so the pullups can be overdriven. On this device, customers can
change the factory default boot mode pins by programming OTP locations. This is recommended only for cases
in which the factory default boot mode pins do not fit into the customer design. More details on the locations to
be programmed is available in the TMS320F2807x Microcontrollers Technical Reference Manual .
Table 8-10. Device Boot Mode
MODE NO.
CPU1 BOOT MODE
TRST
GPIO72
(BOOT
MODE
PIN 1)
GPIO84
(BOOT
MODE
PIN 0)
0
Parallel I/O
0
0
0
1
SCI Mode
0
0
1
2
Wait Boot Mode
0
1
0
3
Get Mode
0
1
1
EMU Boot Mode (JTAG debug probe connected)
1
X
X
4-7
Note
The default behavior of Get mode is boot-to-flash. On unprogrammed devices, using Get mode will
result in repeated watchdog resets, which may prevent proper JTAG connection and device
initialization. Use Wait mode or another boot mode for unprogrammed devices.
CAUTION
Some reset sources are internally driven by the device. The user must ensure the pins used for boot
mode are not actively driven by other devices in the system for these cases. The boot configuration
has a provision for changing the boot pins in OTP. For more details, see the TMS320F2807x
Microcontrollers Technical Reference Manual .
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8.9.1 EMU Boot or Emulation Boot
The CPU enters this boot when it detects that TRST is HIGH (that is, when a JTAG debug probe/debugger is
connected). In this mode, the user can program the EMU_BOOTCTRL control-word (at location 0xD00) to
instruct the device on how to boot. If the contents of the EMU_BOOTCTRL location are invalid, then the device
would default to WAIT Boot mode. The emulation boot allows users to verify the device boot before
programming the boot mode into OTP. Note that EMU_BOOTCTRL is not actually a register, but refers to a
location in RAM (PIE RAM). PIE RAM starts at 0xD00, but the first few locations are reserved (when initializing
the PIE vector table in application code) for these boot ROM variables.
8.9.2 WAIT Boot Mode
The device in this boot mode loops in the boot ROM. This mode is useful if users want to connect a debugger on
a secure device or if users do not want the device to execute an application in flash yet.
8.9.3 Get Mode
The default behavior of Get mode is boot-to-flash. This behavior can be changed by programming the ZxOTPBOOTCTRL locations in user configurable DCSM OTP. The user configurable DCSM OTP on this device is
divided in to two secure zones: Z1 and Z2. The Get mode function in boot ROM first checks if a valid
OTPBOOTCTRL value is programmed in Z1. If the answer is yes, then the device boots as per the Z1OTPBOOTCTRL location. The Z2-OTPBOOTCTRL location is read and decodes only if Z1-OTPBOOTCTRL is
invalid or not programmed. If either Zx-OTPBOOTCTRL location is not programmed, then the device defaults to
factory default operation, which is to use factory default boot mode pins to boot to flash if the boot mode pins are
set to GET MODE. Users can choose the device through which to boot—SPI, I2C, CAN, and USB—by
programming proper values into the user configurable DCSM OTP. More details on this can be found in the
TMS320F2807x Microcontrollers Technical Reference Manual .
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8.9.4 Peripheral Pins Used by Bootloaders
Table 8-11 shows the GPIO pins used by each peripheral bootloader. This device supports two sets of GPIOs for
each mode, as shown in Table 8-11.
Table 8-11. GPIO Pins Used by Each Peripheral Bootloader
BOOTLOADER
GPIO PINS
NOTES
SCI-Boot0
SCITXDA: GPIO84
SCIRXDA: GPIO85
SCIA Boot I/O option 1 (default SCI option
when chosen through Boot Mode GPIOs)
SCI-Boot1
SCIRXDA: GPIO28
SCITXDA: GPIO29
SCIA Boot option 2 – with alternate I/Os.
Parallel Boot
D0 – GPIO65
D1 – GPIO64
D2 – GPIO58
D3 – GPIO59
D4 – GPIO60
D5 – GPIO61
D6 – GPIO62
D7 – GPIO63
HOST_CTRL – GPIO70
DSP_CTRL – GPIO69
CAN-Boot0
CANRXA: GPIO70
CANTXA: GPIO71
CAN-A Boot – I/O option 1
CAN-Boot1
CANRXA: GPIO62
CANTXA: GPIO63
CAN-A Boot – I/O option 2
I2C-Boot0
SDAA: GPIO91
SCLA: GPIO92
I2CA Boot – I/O option 1
I2C-Boot1
SDAA: GPIO32
SCLA: GPIO33
I2CA Boot – I/O option 2
SPI-Boot0
SPISIMOA - GPIO58
SPISOMIA - GPIO59
SPICLKA - GPIO60
SPISTEA - GPIO61
SPIA Boot – I/O option 1
SPI-Boot1
SPISIMOA – GPIO16
SPISOMIA – GPIO17
SPICLKA – GPIO18
SPISTEA – GPIO19
SPIA Boot – I/O option 2
USB Boot
USB0DM - GPIO42
USB0DP - GPIO43
The USB Bootloader will switch the clock
source to the external crystal oscillator (X1
and X2 pins). A 20-MHz crystal should be
present on the board if this boot mode is
selected.
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8.10 Dual Code Security Module
The dual code security module (DCSM) prevents access to on-chip secure memories. The term “secure” means
access to secure memories and resources is blocked. The term “unsecure” means access is allowed; for
example, through a debugging tool such as Code Composer Studio™ (CSS).
The code security mechanism offers protection for two zones, Zone 1 (Z1) and Zone 2 (Z2). The security
implementation for both the zones is identical. Each zone has its own dedicated secure resource (OTP memory
and secure ROM) and allocated secure resource (CLA, LSx RAM, and flash sectors).
The security of each zone is ensured by its own 128-bit password (CSM password). The password for each zone
is stored in an OTP memory location based on a zone-specific link pointer. The link pointer value can be
changed to program a different set of security settings (including passwords) in OTP.
Note
THE CODE SECURITY MODULE (CSM) INCLUDED ON THIS DEVICE WAS DESIGNED TO
PASSWORD PROTECT THE DATA STORED IN THE ASSOCIATED MEMORY AND IS
WARRANTED BY TEXAS INSTRUMENTS (TI), IN ACCORDANCE WITH ITS STANDARD TERMS
AND CONDITIONS, TO CONFORM TO TI'S PUBLISHED SPECIFICATIONS FOR THE WARRANTY
PERIOD APPLICABLE FOR THIS DEVICE.
TI DOES NOT, HOWEVER, WARRANT OR REPRESENT THAT THE CSM CANNOT BE
COMPROMISED OR BREACHED OR THAT THE DATA STORED IN THE ASSOCIATED MEMORY
CANNOT BE ACCESSED THROUGH OTHER MEANS. MOREOVER, EXCEPT AS SET FORTH
ABOVE, TI MAKES NO WARRANTIES OR REPRESENTATIONS CONCERNING THE CSM OR
OPERATION OF THIS DEVICE, INCLUDING ANY IMPLIED WARRANTIES OF MERCHANTABILITY
OR FITNESS FOR A PARTICULAR PURPOSE.
IN NO EVENT SHALL TI BE LIABLE FOR ANY CONSEQUENTIAL, SPECIAL, INDIRECT,
INCIDENTAL, OR PUNITIVE DAMAGES, HOWEVER CAUSED, ARISING IN ANY WAY OUT OF
YOUR USE OF THE CSM OR THIS DEVICE, WHETHER OR NOT TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO LOSS OF DATA, LOSS OF GOODWILL, LOSS OF USE OR INTERRUPTION OF BUSINESS OR
OTHER ECONOMIC LOSS.
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8.11 Timers
CPU-Timers 0, 1, and 2 are identical 32-bit timers with presettable periods and with 16-bit clock prescaling. The
timers have a 32-bit count-down register that generates an interrupt when the counter reaches zero. The counter
is decremented at the CPU clock speed divided by the prescale value setting. When the counter reaches zero, it
is automatically reloaded with a 32-bit period value.
CPU-Timer 0 is for general use and is connected to the PIE block. CPU-Timer 1 is also for general use and is
connected to INT13 of the CPU. CPU-Timer 2 is reserved for TI-RTOS. It is connected to INT14 of the CPU. If
TI-RTOS is not being used, CPU-Timer 2 is available for general use.
CPU-Timer 2 can be clocked by any one of the following:
• SYSCLK (default)
• Internal zero-pin oscillator 1 (INTOSC1)
• Internal zero-pin oscillator 2 (INTOSC2)
• X1 (XTAL)
• AUXPLLCLK
8.12 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
The NMIWD module is used to handle system-level errors. The conditions monitored are:
• Missing system clock due to oscillator failure
• Uncorrectable ECC error on CPU access to flash memory
• Uncorrectable ECC error on CPU, CLA, or DMA access to RAM
If the CPU does not respond to the latched error condition, then the NMI watchdog will trigger a reset after a
programmable time interval. The default time is 65536 SYSCLK cycles.
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8.13 Watchdog
The watchdog module is the same as the one on previous TMS320C2000™ MCUs, but with an optional lower
limit on the time between software resets of the counter. This windowed countdown is disabled by default, so the
watchdog is fully backwards-compatible.
The watchdog generates either a reset or an interrupt. It is clocked from the internal oscillator with a selectable
frequency divider.
Figure 8-4 shows the various functional blocks within the watchdog module.
WDCR(WDPS(2:0))
WDCR(WDDIS)
WDCNTR(7:0)
WDCLK
(INTOSC1)
Watchdog
Prescaler
/512
SYSRSn
8-bit
Watchdog
Counter
Overflow
1-count
delay
Clear
Count
WDWCR(MIN(7:0))
WDKEY(7:0)
Watchdog
Key Detector
55 + AA
WDRSTn
WDINTn
Good Key
Out of Window
Watchdog
Window
Detector
Bad Key
Generate
512-WDCLK
Output Pulse
Watchdog Time-out
SCSR(WDENINT)
Figure 8-4. Windowed Watchdog
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8.14 Configurable Logic Block (CLB)
The C2000 configurable logic block (CLB) is a collection of blocks that can be interconnected using software to
implement custom digital logic functions or enhance existing on-chip peripherals. The CLB is able to enhance
existing peripherals through a set of crossbar interconnections, which provide a high level of connectivity to
existing control peripherals such as enhanced pulse width modulators (ePWM), enhanced capture modules
(eCAP), and enhanced quadrature encoder pulse modules (eQEP). The crossbars also allow the CLB to be
connected to external GPIO pins. In this way, the CLB can be configured to interact with device peripherals to
perform small logical functions such as comparators, or to implement custom serial data exchange protocols.
Through the CLB, functions that would otherwise be accomplished using external logic devices can now be
implemented inside the MCU.
The CLB peripheral is configured through the CLB tool. For more information on the CLB tool, available
examples, application reports and users guide, please refer to the following location in your C2000Ware package
(C2000Ware_2_00_00_03 and higher):
C2000WARE_INSTALL_LOCATION\utilities\clb_tool\clb_syscfg\doc
CLB Tool User Guide
How to Design with the C2000™ CLB Application Report
How to Migrate Custom Logic From an FPGA/CPLD to C2000™ CLB Application Report
The CLB module and its interconnects are shown in Figure 8-5.
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Figure 8-5. CLB Overview
Absolute encoder protocol interfaces are now provided as Position Manager solutions in the C2000Ware
MotorControl SDK. Configuration files, application programmer interface (API), and use examples for such
solutions are provided with C2000Ware MotorControl SDK. In some solutions, the TI-configured CLB is used
with other on-chip resources, such as the SPI port or the C28x CPU, to perform more complex functionality. See
Table 5-1 for the devices that support the CLB feature.
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8.15 Functional Safety
TMS320C2000™ MCUs are equipped with a TI release validation-based C28x and CLA Compiler Qualification
Kit (CQ-Kit), which is available for free and may be requested at the Compiler Qualification Kit web page.
Additionally, C2000™ MCUs are supported by the TI C2000 Support from Embedded Coder from MathWorks® to
generate C2000-optimized code from a Simulink® model. Simulink® enables Model-Based Design to ease the
systematic compliance process with certified tools, including Embedded Coder®, Simulink® model verification
tools, Polyspace® code verification tools, and the IEC Certification Kit for ISO 26262 and IEC 61508 compliance.
For more information, see the How to Use Simulink for ISO 26262 Projects article.
The Error Detection in SRAM Application Report provides technical information about the nature of the SRAM bit
cell and bit array, as well as the sources of SRAM failures. It then presents methods for managing memory
failures in electronic systems. This discussion is intended for electronic system developers or integrators who
are interested in improving the robustness of the embedded SRAM.
Functional Safety-Compliant products are developed using an ISO 26262/IEC 61508-compliant hardware
development process that is independently assessed and certified to meet ASIL D/SIL 3 systematic capability
(see certificate). The TMS320F2837D, TMS320F2837xS, and TMS320F2807x MCUs have been certified to
meet a component-level random hardware capability of ASIL B/SIL 2 (see certificate).
The Functional Safety-Compliant enablers include:
• A Functional Safety Manual
• A detailed, tunable, quantitative Failure Modes, Effects, and Diagnostics Analysis (FMEDA)
• A software diagnostic library that will help shorten the time to implement various software safety mechanisms
• A collection of application reports to help in the development of functionally safe systems.
A functional safety manual that describes all of the hardware and software functional safety mechanisms is
available. See the Safety Manual for TMS320F2837xD, TMS320F2837xS, and TMS320F2807x.
A detailed, tunable, fault-injected, quantitative FMEDA that enables the calculation of random hardware metrics
—as outlined in the International Organization for Standardization ISO 26262 and the International
Electrotechnical Commission IEC 61508 for automotive and industrial applications, respectively—is also
available. This tunable FMEDA must be requested; see the C2000™ Package for Automotive and Industrial
MCUs User's Guide.
• A white paper outlining the value (or benefit) of a tunable FMEDA is available. See the Functional Safety: A
tunable FMEDA for C2000™ MCUs publication.
• Parts 1 and 2 of a five-part FMEDA tuning training are available. See the C2000™ Tunable FMEDA Training
page.
Parts 3, 4, and 5 are packaged with the tunable FMEDA, and must be requested.
The C2000 Diagnostic Software Library is a collection of different safety mechanisms designed to detect faults.
These safety mechanisms target different device components, including the C28x core, the control law
accelerator (CLA), system control, static random access memory (SRAM), flash, and communications and
control peripherals. The software safety mechanisms leverage available hardware safety features such as the
C28x hardware built-in self-test (HWBIST); error detection and correction functionality on memories; parallel
signature analysis circuitry; missing clock detection logic; watchdog counters; and hardware redundancy.
Also included are software functional safety manual, user guides, example projects, and source code to help
users shorten system integration time. The library package includes a compliance support package (CSP), a
series of documents that TI used to develop and test the diagnostic software library. The CSP provides the
necessary documentation and reports to assist users with compliance to functional safety standards: software
safety requirements specifications; a software architecture document; software module design documents;
software module unit test plans; software module unit test documents; static analysis reports; unit test reports;
dynamic analysis reports; functional test reports; and traceability documents. Users can use these documents to
comply with route 1s (as described in IEC 61508-3, section 7.4.2.12) to reuse a preexisting software element to
implement all or part of a safety function. The contents of the CSP could also help users make important
decisions for overall system safety compliance.
174
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Two application reports offer details about how to develop functionally safe systems with C2000 real-time control
devices:
• C2000™ Hardware Built-In Self-Test discusses the HWBIST safety mechanism, along with its functions and
features, in the F2807x/F2837xS/F2837xD series of C2000 devices. The report also addresses some
system-level considerations when using the HWBIST feature and explains how customers can use the
diagnostic library on their system.
• C2000™ CPU Memory Built-In Self-Test describes embedded memory validation using the C28x central
processing unit (CPU) during an active control loop. It discusses system challenges to memory validation as
well as the different solutions provided by C2000 devices and software. Finally, it presents the Diagnostic
Library implementations for memory testing.
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9 Applications, Implementation, and Layout
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 TI Reference Design
The TI Reference Design Library is a robust reference design library spanning analog, embedded processor,
and connectivity. Created by TI experts to help you jump start your system design, all reference designs include
schematic or block diagrams, BOMs, and design files to speed your time to market. Search and download
designs at the Select TI reference designs page.
Industrial Servo Drive and AC Inverter Drive Reference Design
The DesignDRIVE Development Kit is a reference design for a complete industrial drive directly connecting to a
three-phase ACI or PMSM motor. Many drive topologies can be created from the combined control, power, and
communications technologies included on this single platform. This platform includes multiple position sensor
interfaces, diverse current sensing techniques, hot-side partitioning options, and expansion for safety and
industrial Ethernet.
Differential Signal Conditioning Circuit for Current and Voltage Measurement Using Fluxgate Sensors
This design provides a 4-channel signal conditioning solution for differential ADCs integrated into a
microcontroller measuring motor current using fluxgate sensors. Also provided is an alternative measurement
circuit with external differential SAR ADCs as well as circuits for high-speed overcurrent and earth fault
detection. Proper differential signal conditioning improves noise immunity on critical current measurements in
motor drives. This reference design can help increase the effective resolution of the analog-to-digital conversion,
improving motor drive efficiency.
176
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10 Device and Documentation Support
10.1 Device and Development Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
TMS320™ MCU devices and support tools. Each TMS320 MCU commercial family member has one of three
prefixes: TMX, TMP, or TMS (for example, TMS320F28075). Texas Instruments recommends two of three
possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages
of product development from engineering prototypes (with TMX for devices and TMDX for tools) through fully
qualified production devices and tools (with TMS for devices and TMDS for tools).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device's electrical specifications
TMP
Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability
verification
TMS
Fully qualified production device
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal qualification testing
TMDS
Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability
of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PTP) and temperature range (for example, T). Figure 10-1 provides a legend for reading the
complete device name for any family member.
For device part numbers and further ordering information, see the TI website (www.ti.com) or contact your TI
sales representative.
For additional description of the device nomenclature markings on the die, see the TMS320F2807x MCUs
Silicon Errata .
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Figure 10-1. Device Nomenclature
10.2 Markings
Figure 10-2 provides an example of the 2807x device markings and defines each of the markings. The device
revision can be determined by the symbols marked on the top of the package as shown in Figure 10-2. Some
prototype devices may have markings different from those illustrated.
YMLLLLS = Lot Trace Code
TMS320
F28075PTPT
$$#-YMLLLLS
G4
YM
LLLL
S
$$
#
=
=
=
=
=
2-Digit Year/Month Code
Assembly Lot
Assembly Site Code
Wafer Fab Code as applicable
Silicon Revision Code
G4 = Green (Low Halogen and RoHS-compliant)
Package
Pin 1
Figure 10-2. Example of Device Markings
Table 10-1. Determining Silicon Revision From Lot Trace Code
SILICON REVISION CODE
SILICON REVISION
REVID(1)
Address: 0x5D00C
B
B
0x0002
This silicon revision is available as TMX.
C
C
0x0003
This silicon revision is available as TMS.
(1)
178
COMMENTS
Silicon Revision ID
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10.3 Tools and Software
TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of
the device, generate code, and develop solutions are listed below. To view all available tools and software for
C2000™ real-time control MCUs, visit the C2000 real-time control MCUs – Design & development page.
Development Tools
F28379D controlCARD for C2000 Real time control development kits
The F28379D controlCARD from Texas Instruments is Position Manager-ready and an ideal product for initial
software development and short run builds for system prototypes, test stands, and many other projects that
require easy access to high-performance controllers. All C2000 controlCARDs are complete board-level modules
that utilize a HSEC180 or DIMM100 form factor to provide a low-profile single-board controller solution. The host
system needs to provide only a single 5V power rail to the controlCARD for it to be fully functional.
F28379D Experimenter Kit
C2000™ MCU Experimenter Kits provide a robust hardware prototyping platform for real-time, closed loop
control development with Texas Instruments C2000 32-bit microcontroller family. This platform is a great tool to
customize and prove-out solutions for many common power electronics applications, including motor control,
digital power supplies, solar inverters, digital LED lighting, precision sensing, and more.
Software Tools
C2000Ware for C2000 MCUs
C2000Ware for C2000 microcontrollers is a cohesive set of development software and documentation designed
to minimize software development time. From device-specific drivers and libraries to device peripheral examples,
C2000Ware provides a solid foundation to begin development and evaluation. C2000Ware is now the
recommended content delivery tool versus controlSUITE™.
Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 Microcontrollers
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and
Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug
embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment,
debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking the user
through each step of the application development flow. Familiar tools and interfaces allow users to get started
faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework
with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development
environment for embedded developers.
Pin Mux Tool
The Pin Mux Utility is a software tool which provides a Graphical User Interface for configuring pin multiplexing
settings, resolving conflicts and specifying I/O cell characteristics for TI MPUs.
F021 Flash Application Programming Interface (API)
The F021 Flash Application Programming Interface (API) provides a software library of functions to program,
erase, and verify F021 on-chip Flash memory.
UniFlash Standalone Flash Tool
UniFlash is a standalone tool used to program on-chip flash memory through a GUI, command line, or scripting
interface.
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www.ti.com
Models
Various models are available for download from the product Tools & Software pages. These include I/O Buffer
Information Specification (IBIS) Models and Boundary-Scan Description Language (BSDL) Models. To view all
available models, visit the Models section of the Tools & Software page for each device.
Training
To help assist design engineers in taking full advantage of the C2000 microcontroller features and performance,
TI has developed a variety of training resources. Utilizing the online training materials and downloadable handson workshops provides an easy means for gaining a complete working knowledge of the C2000 microcontroller
family. These training resources have been designed to decrease the learning curve, while reducing
development time, and accelerating product time to market. For more information on the various training
resources, visit the C2000™ real-time control MCUs – Support & training site.
Specific F2837xD/F2837xS/F2807x hands-on training resources can be found at C2000™ MCU Device
Workshops.
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10.4 Documentation Support
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
The current documentation that describes the processor, related peripherals, and other technical collateral is
listed below.
Errata
TMS320F2807x MCUs Silicon Errata describes known advisories on silicon and provides workarounds.
Technical Reference Manual
TMS320F2807x Microcontrollers Technical Reference Manual details the integration, the environment, the
functional description, and the programming models for each peripheral and subsystem in the 2807x
microcontrollers.
CPU User's Guides
TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the
assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). This Reference
Guide also describes emulation features available on these DSPs.
TMS320C28x Extended Instruction Sets Technical Reference Manual describes the architecture, pipeline, and
instruction set of the TMU, VCU-II, and FPU accelerators.
Peripheral Guides
C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x
DSPs.
Tools Guides
TMS320C28x Assembly Language Tools v20.2.0.LTS User's Guide describes the assembly language tools
(assembler and other tools used to develop assembly language code), assembler directives, macros, common
object file format, and symbolic debugging directives for the TMS320C28x device.
TMS320C28x Optimizing C/C++ Compiler v20.2.0.LTS User's Guide describes the TMS320C28x C/C++
compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly
language source code for the TMS320C28x device.
Application Reports
Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor
devices for shipment to end users.
Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime
of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general
engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.
An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS
including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/
output structures and future trends.
Serial Flash Programming of C2000™ Microcontrollers discusses using a flash kernel and ROM loaders for
serial programming a device.
10.5 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
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10.6 Trademarks
PowerPAD™, Code Composer Studio™, TMS320C2000™, C2000™, TMS320™, controlSUITE™, TI E2E™ are
trademarks of Texas Instruments.
Bosch® is a registered trademark of Robert Bosch GmbH Corporation.
MathWorks®, Simulink®, Embedded Coder®, Polyspace® are registered trademarks of The MathWorks, Inc.
All trademarks are the property of their respective owners.
10.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.8 Glossary
TI Glossary
182
This glossary lists and explains terms, acronyms, and definitions.
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11 Mechanical, Packaging, and Orderable Information
11.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OUTLINE
PZP0100N
PowerPAD TM TQFP - 1.2 mm max height
SCALE 1.000
PLASTIC QUAD FLATPACK
PIN 1 ID
100
14.2
13.8
NOTE 3
B
76
75
1
14.2
13.8
NOTE 3
16.2
TYP
15.8
25
51
26
A
50
0.27
0.17
0.08
100X
96X 0.5
4X 12
C A B
C
SEATING PLANE
SEE DETAIL A
(0.127)
TYP
1.2 MAX
50
26
25
51
0.25
GAGE PLANE
8.64
7.45
101
(1)
0.08 C
0 -7
0.75
0.45
0.15
0.05
DETAIL A
TYPICAL
4X (0.3)
NOTE 4
1
100
75
4X (0.3)
NOTE 4
76
4223383/A 04/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
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DETAIL A
SCALE: 14
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EXAMPLE BOARD LAYOUT
PZP0100N
PowerPAD TM TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
( 12)
NOTE 10
( 8.64)
SYMM
100
SOLDER MASK
DEFINED PAD
76
100X (1.5)
1
75
100X (0.3)
96X (0.5)
101
SYMM
(1) TYP
(15.4)
(R0.05) TYP
51
25
( 0.2) TYP
VIA
26
50
SEE DETAILS
(1) TYP
METAL COVERED
BY SOLDER MASK
(15.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:5X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
4223383/A 04/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
EXAMPLE STENCIL DESIGN
PZP0100N
PowerPAD TM TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
( 8.64)
BASED ON
0.125 THICK STENCIL
SYMM
100
76
100X (1.5)
1
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
75
100X (0.3)
96X (0.5)
SYMM
101
(15.4)
(R0.05) TYP
25
51
METAL COVERED
BY SOLDER MASK
50
26
(15.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.150
0.175
9.66 X 9.66
8.64 X 8.64 (SHOWN)
7.89 X 7.89
7.3 X 7.3
4223383/A 04/2017
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
186
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
PACKAGE OUTLINE
TM
PTP0176F
PowerPAD
HLQFP - 1.6 mm max height
SCALE 0.550
PLASTIC QUAD FLATPACK
24.2
NOTE 3
23.8
PIN 1 ID
B
133
176
1
132
24.2
23.8
NOTE 3
26.2
TYP
25.8
44
89
45
88
A
176X
172X 0.5
4X 21.5
0.27
0.17
0.08
C A B
C
SEATING PLANE
SEE DETAIL A
(0.13)
TYP
1.6 MAX
88
45
89
44
0.25
GAGE PLANE
4X 0.78 MAX
NOTE 4
7.33
6.78
177
4X
0.54 MAX
NOTE 4
(1.4)
0.08 C
0 -7
0.75
0.45
4X
0.2 MAX
NOTE 4
1
0.15
0.05
DETAIL A
TYPICAL
EXPOSED
THERMAL PAD
132
176
8.07
7.53
133
4223382/A 03/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features my not present.
5. Reference JEDEC registration MS-026.
www.ti.com
DETAIL A
SCALE: 12
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EXAMPLE BOARD LAYOUT
PTP0176F
PowerPAD
TM
HLQFP - 1.6 mm max height
PLASTIC QUAD FLATPACK
(8.07)
SYMM
176
SOLDER MASK
DEFINED PAD
133
176X (1.45)
1
132
176X (0.3)
172X (0.5)
177
SYMM
(1.5 TYP)
(25.5)
(7.33)
( 22)
NOTE 10
(R0.05) TYP
( 0.2) TYP
VIA
89
44
SEE DETAILS
88
45
(1.5 TYP)
METAL COVERED
BY SOLDER MASK
(25.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:4X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
4223382/A 03/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
188
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SPRS902J – OCTOBER 2014 – REVISED FEBRUARY 2021
EXAMPLE STENCIL DESIGN
PTP0176F
PowerPAD
TM
HLQFP - 1.6 mm max height
PLASTIC QUAD FLATPACK
SYMM
(8.07)
BASED ON
0.125 THICK STENCIL
176
133
176X (1.45)
1
132
176X (0.3)
172X (0.5)
(25.5)
SYMM
(7.33)
BASED ON
0.125 THICK
STENCIL
177
(R0.05) TYP
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
44
METAL COVERED
BY SOLDER MASK
89
88
45
(25.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:4X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.150
0.175
9.02 X 8.2
8.07 X 7.33 (SHOWN)
7.37 X 6.69
6.82 X 6.2
4223382/A 03/2017
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2022
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
(3)
Device Marking
Samples
(4/5)
(6)
TMS320F28075PTPQ
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28075PTPQ
Samples
TMS320F28075PTPQR
ACTIVE
HLQFP
PTP
176
200
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28075PTPQ
Samples
TMS320F28075PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28075PTPS
Samples
TMS320F28075PTPT
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 105
TMS320
F28075PTPT
Samples
TMS320F28075PZPQ
ACTIVE
HTQFP
PZP
100
90
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28075PZPQ
Samples
TMS320F28075PZPS
ACTIVE
HTQFP
PZP
100
90
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28075PZPS
Samples
TMS320F28075PZPT
ACTIVE
HTQFP
PZP
100
90
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 105
TMS320
F28075PZPT
Samples
TMS320F28076PTPS
ACTIVE
HLQFP
PTP
176
40
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28076PTPS
Samples
TMS320F28076PZPS
ACTIVE
HTQFP
PZP
100
90
RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TMS320
F28076PZPS
Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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