TMS320VC5505ZCH

TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 TMS320VC5505 Fixed-Point Digital Signal Processor Check for Samples: TMS320VC5505 1 Fixed-Point Digital Signal Processor 1.1 TMS320VC5505 Features 1 • High-Performance, Low-Power, TMS320C55x™ Fixed-Point Digital Signal Processor – 16.67-, 10-ns Instruction Cycle Time – 60-, 100-MHz Clock Rate – One/Two Instruction(s) Executed per Cycle – Dual Multipliers [Up to 200 Million Multiply-Accumulates per Second (MMACS)] – Two Arithmetic/Logic Units (ALUs) – Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses – Fully Software-Compatible With C55x Devices – Industrial Temperature Devices Available • 320 K Bytes Zero-Wait State On-Chip RAM, Composed of: – 64K Bytes of Dual-Access RAM (DARAM), 8 Blocks of 4K x 16-Bit – 256K Bytes of Single-Access RAM (SARAM), 32 Blocks of 4K x 16-Bit • 128K Bytes of Zero Wait-State On-Chip ROM (4 Blocks of 16K x 16-Bit) • 16-/8-Bit External Memory Interface (EMIF) with Glueless Interface to: – 8-/16-Bit NAND Flash, 1- and 4-Bit ECC – 8-/16-Bit NOR Flash – Asynchronous Static RAM (SRAM) • Direct Memory Access (DMA) Controller – Four DMA With 4 Channels Each (16-Channels Total) • Three 32-Bit General-Purpose Timers – One Selectable as a Watchdog and/or GP • Two MultiMedia Card/Secure Digital (MMC/SD) Interfaces • Universal Asynchronous Receiver/Transmitter (UART) • Serial-Port Interface (SPI) With Four Chip-Selects • Master/Slave Inter-Integrated Circuit (I2C Bus™) • Four Inter-IC Sound (I2S Bus™) for Data Transport • Device USB Port With Integrated 2.0 High-Speed PHY that Supports: – USB 2.0 Full- and High-Speed Device • LCD Bridge With Asynchronous Interface • Tightly-Coupled FFT Hardware Accelerator • 10-Bit 4-Input Successive Approximation (SAR) ADC • Real-Time Clock (RTC) With Crystal Input, With Separate Clock Domain, Separate Power Supply • Four Core Isolated Power Supply Domains: Analog, RTC, CPU and Peripherals, and USB • Four I/O Isolated Power Supply Domains: RTC I/O, EMIF I/O, USB PHY, and DVDDIO • Low-Power S/W Programmable Phase-Locked Loop (PLL) Clock Generator • On-Chip ROM Bootloader (RBL) to Boot From NAND Flash, NOR Flash, SPI EEPROM, or I2C EEPROM • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible • Up to 26 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions) • 196-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZCH Suffix) • 1.05-V Core (60 MHz), 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/Os • 1.3-V Core (100 MHz), 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/Os • Applications: – Wireless Audio Devices (e.g., Headsets, Microphones, Speakerphones, etc.) – Echo Cancellation Headphones – Portable Medical Devices – Voice Applications – Industrial Controls – Fingerprint Biometrics – Software Defined Radio • Community Resources – TI E2E Community – TI Embedded Processors Wiki 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2010, Texas Instruments Incorporated TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 1.2 www.ti.com Description The TMS320VC5505 is a member of TI's TMS320C5000™ fixed-point Digital Signal Processor (DSP) product family and is designed for low-power applications. The TMS320VC5505 fixed-point DSP is based on the TMS320C55x™ DSP generation CPU processor core. The C55x™ DSP architecture achieves high performance and low power through increased parallelism and total focus on power savings. The CPU supports an internal bus structure that is composed of one program bus, one 32-bit data read bus and two 16-bit data read buses, two 16-bit data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to four 16-bit data reads and two 16-bit data writes in a single cycle. The TMS320VC5505 also includes four DMA controllers, each with 4 channels, providing data movements for 16-independent channel contexts without CPU intervention. Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and independent of the CPU activity. The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication and a 32-bit add in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU. The C55x CPU supports a variable byte width instruction set for improved code density. The Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to the Address Unit (AU) and Data Unit (DU) resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions. The general-purpose input and output functions along with the 10-bit SAR ADC provide sufficient pins for status, interrupts, and bit I/O for LCD displays, keyboards, and media interfaces. Serial media is supported through two MultiMedia Card/Secure Digital (MMC/SD) peripherals, four Inter-IC Sound (I2S Bus™) modules, one Serial-Port Interface (SPI) with up to 4 chip selects, one I2C multi-master and slave interface, and a Universal Asynchronous Receiver/Transmitter (UART) interface. The VC5505 peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM, NOR, NAND, and SRAM. Additional peripherals include: a high-speed Universal Serial Bus (USB2.0) device mode only, and a real-time clock (RTC). This device also includes three general-purpose timers with one configurable as a watchdog timer, and a analog phase-locked loop (APLL) clock generator. In addition, the VC5505 includes a tightly-coupled FFT Hardware Accelerator. The tightly-coupled FFT Hardware Accelerator supports 8 to 1024-point (in power of 2) real and complex-valued FFTs. The VC5505 is supported by the industry’s award-winning eXpressDSP™, Code Composer Studio™ Integrated Development Environment (IDE), DSP/BIOS™, Texas Instruments’ algorithm standard, and the industry’s largest third-party network. Code Composer Studio IDE features code generation tools including a C Compiler and Linker, RTDX™, XDS100™, XDS510™, XDS560™ emulation device drivers, and evaluation modules. The VC5505 is also supported by the C55x DSP Library which features more than 50 foundational software kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip support libraries. 2 Fixed-Point Digital Signal Processor Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 1.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Functional Block Diagram Figure 1-1 shows the functional block diagram of the VC5505 device. DSP System Input Clock(s) JTAG Interface C55x™ DSP CPU PLL/Clock Generator FFT Hardware Accelerator Power Management 64 KB DARAM Pin Multiplexing 256 KB SARAM 128 KB ROM Switched Central Resource (SCR) Peripherals Interconnect DMA (x4) Serial Interfaces I2S (x4) I2C SPI App-Spec Display Connectivity 10-Bit SAR ADC LCD Bridge USB 2.0 PHY (HS) [DEVICE] System UART GP Timer (x2) RTC GP Timer and/or WD Program/Data Storage NAND, NOR, SRAM MMC/SD (x2) Figure 1-1. TMS320VC5505 Functional Block Diagram Fixed-Point Digital Signal Processor Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 3 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 1 2 3 4 5 ............... 1 1.1 TMS320VC5505 Features ........................... 1 1.2 Description ........................................... 2 1.3 Functional Block Diagram ............................ 3 Revision History ......................................... 5 Device Overview ........................................ 6 3.1 Device Characteristics ............................... 6 3.2 C55x CPU ............................................ 7 3.3 Memory Map Summary ............................. 12 3.4 Pin Assignments .................................... 12 3.5 Terminal Functions ................................. 14 3.6 Device Support ..................................... 36 Device Configuration ................................. 38 4.1 System Registers ................................... 38 4.2 Power Considerations .............................. 39 4.3 Clock Considerations ............................... 39 4.4 Boot Sequence ..................................... 41 4.5 Configurations at Reset ............................ 44 4.6 Configurations After Reset ......................... 44 4.7 Multiplexed Pin Configurations ..................... 48 4.8 Debugging Considerations ......................... 51 Device Operating Conditions ....................... 53 Fixed-Point Digital Signal Processor 5.1 5.2 5.3 4 www.ti.com Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise Noted) .... 53 Recommended Operating Conditions .............. 54 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted) ............ 55 6 Peripheral Information and Electrical Specifications .......................................... 57 6.1 6.2 Parameter Information .............................. 57 Recommended Clock and Control Signal Transition Behavior ............................................ 57 6.3 6.4 Power Supplies ..................................... 58 External Clock Input From RTC_XI, CLKIN, and USB_MXI Pins ...................................... 59 6.5 ......................................... ........... Reset ............................................... Wake-up Events, Interrupts, and XF ............... External Memory Interface (EMIF) ................. Multimedia Card/Secure Digital (MMC/SD) ........ Real-Time Clock (RTC) ............................. Inter-Integrated Circuit (I2C) ........................ 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 6.14 6.15 6.16 6.17 6.18 6.19 6.20 7 Clock PLLs 63 Direct Memory Access (DMA) Controller 66 67 71 72 83 88 90 Universal Asynchronous Receiver/Transmitter (UART) .............................................. 95 ................................ 97 Liquid Crystal Display Controller (LCDC) ......... 104 Serial Port Interface (SPI) ......................... 114 Universal Serial Bus (USB) 2.0 Controller ........ 117 General-Purpose Timers .......................... 124 General-Purpose Input/Output .................... 126 IEEE 1149.1 JTAG ................................ 130 Inter-IC Sound (I2S) Mechanical Packaging and Orderable Information ............................................ 132 7.1 Thermal Data for ZCH 7.2 Packaging Information Contents ............................. ............................ 132 132 Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 2 Revision History This data manual revision history highlights the technical changes made to the SPRS503A device-specific data manual to make it an SPRS503B revision. Scope: Applicable updates to the TMS320C5000 device family, specifically relating to the TMS320VC5505 device (Silicon Revisions 1.4) which is now in the production data (PD) stage of development have been incorporated. Note: As TMS320VC550x related documentation is released, the ulink references will operate properly. If the related docs are as yet not released, the ulink will appear to be broken. SEE ADDITIONS/MODIFICATIONS/DELETIONS Section 5 Device Operating Conditions Section 5.2 Recommended Operating Conditions • Updated/Changed USB_VDDPLL, USB_VDDOSC, and USB_VDDA3P3 MIN value from "3.14" to "2.97" V • Updated/Changed USB_VDDPLL, USB_VDDOSC, and USB_VDDA3P3 MAX value from "3.46" to "3.63" V Section 6.8.2 Wake-Up From IDLE Electrical Data/Timing Table 6-9 Switching Characteristics Over Recommended Operating Conditions For Wake-Up From IDLE • Added footnote that references LDO. Revision History Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 5 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 3 Device Overview 3.1 Device Characteristics Table 3-1, provides an overview of the TMS320VC5505 DSP. The tables show significant features of the VC5505 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count. Table 3-1. Characteristics of the VC5505 Processor HARDWARE FEATURES Peripherals VC5505 External Memory Interface (EMIF) Asynchronous (8/16-bit bus width) SRAM, Flash (NOR, NAND) Not all peripheral pins are Flash Cards available at the same time (for more detail, see the DMA Device Configurations section). 2 MMC/SD Four DMA controllers each with four channels, for a total of 16 channels Timers 2 32-Bit General-Purpose (GP) Timers 1 Additional Configurable as a 32-Bit GP Timer and/or a Watchdog UART 1 (with RTS/CTS flow control) SPI 1 with 4 chip selects 2 I C 1 (Master/Slave) I2S 4 (Two Channel, Full Duplex Communication) USB 2.0 (Device only) High- and Full-Speed Device 256 byte read/write buffer, max 50-MHz clock for SD cards, and signaling for DMA transfers MMC/SD LCD Bridge 1 (8-bit or 16-bit asynchronous parallel bus) ADC (Successive Approximation [SAR]) 1 (10-bit, 4-input, 16-ms conversion time) Real-Time Clock (RTC) 1 (Crystal Input, Separate Clock Domain and Power Supply) FFT Hardware Accelerator 1 (Supports 8 to 1024-point 16-bit real and complex FFT) Up to 26 pins (with 1 Additional General-Purpose Output (XF) and 4 Special-Purpose Outputs for Use With SAR) General-Purpose Input/Output Port (GPIO) Size (Bytes) On-Chip Memory 320 KB RAM, 128KB ROM • • • Organization JTAG BSDL_ID JTAG ID Register (Value is: 0009_702F) CPU Frequency MHz Cycle Time Voltage ns 64KB On-Chip Dual-Access RAM (DARAM) 256 KB On-Chip Single-Access RAM (SARAM) 128KB On-Chip Single-Access ROM (SAROM) see Figure 6-40 1.05-V Core 60 MHz 1.3-V Core 100 MHz 1.05-V Core 16.67 ns 1.3-V Core Core (V) 1.3 V (100 MHz) I/O (V) Power Characterization 6 10 ns 1.05 V (60 MHz) 1.8 V, 2.5 V, 2.8 V, 3.3 V Active @ Room Temp 25°C, 75% DMAC + 25% ADD (Typical Sine Wave Data Switching) 0.15 mW/MHz @ 1.05 V, 60 MHz 0.22 mW/MHz @ 1.3 V, 100 MHz Active @ Room Temp 25°C, 75% DMAC + 25% NOP (Typical Sine Wave Data Switching) 0.14 mW/MHz @ 1.05 V, 60 MHz 0.22 mW/MHz @ 1.3 V, 100 MHz Active @ Room Temp 25°C, Hardware FFT Accelerator 1024-pt FFT, ROM Execution 0.25 mW/MHz @ 1.05 V, 60 MHz 0.31 mW/MHz @ 1.3 V, 100 MHz Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-1. Characteristics of the VC5505 Processor (continued) HARDWARE FEATURES Standby (Master Clock Disabled) @ Room Temp 25°C (DARAM and SARAM in Active Mode) 0.26 mW @ 1.05 V 0.44 mW @ 1.3 V Standby (Master Clock Disabled) @ Room Temp 25°C (DARAM in Retention and SARAM in Active Mode) 0.23 mW @ 1.05 V 0.40 mW @ 1.3 V Standby (Master Clock Disabled) @ Room Temp 25°C (DARAM in Active Mode and SARAM in Retention) 0.15 mW @ 1.05 V 0.28 mW @ 1.3 V PLL Options Software Programmable Multiplier BGA Package 10 x 10 mm Process Technology mm Product Status (1) 3.2 (1) VC5505 x4 to x4099 multiplier 196-Pin BGA (ZCH) 0.09 mm Product Preview (PP), Advance Information (AI), or Production Data (PD) PD PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. C55x CPU The TMS320VC5505 fixed-point digital signal processor (DSP) is based on the C55x CPU 3.3 generation processor core. The C55x DSP architecture achieves high performance and low power through increased parallelism and total focus on power savings. The CPU supports an internal bus structure that is composed of one program bus, three data read buses (one 32-bit data read bus and two 16-bit data read buses), two 16-bit data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to four data reads and two data writes in a single cycle. Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and independent of the CPU activity. The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU. The C55x DSP generation supports a variable byte width instruction set for improved code density. The Instruction Unit (IU) performs 32-bit program fetches from internal or external memory, stores them in a 128-byte Instruction Buffer Queue, and queues instructions for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to AU and DU resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions calls. For more detailed information on the CPU, see the TMS320C55x CPU 3.0 CPU Reference Guide (literature number SWPU073). The C55x core of the VC5505 can address 16M bytes of unified data and program space. It also addresses 64K words of I/O space. The VC5505 includes three types of on-chip memory: 128 KB read-only memory (ROM), 256 KB single-access random access memory (SARAM), 64 KB dual-access random access memory (DARAM). The memory map is shown in Figure 3-1. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 7 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3.2.1 www.ti.com On-Chip Dual-Access RAM (DARAM) The DARAM is located in the byte address range 000000h − 00FFFFh and is composed of eight blocks of 4K words each (see Table 3-2). Each DARAM block can perform two accesses per cycle (two reads, two writes, or a read and a write). The DARAM can be accessed by the internal program, data, or DMA buses. Table 3-2. DARAM Blocks (1) 3.2.2 CPU BYTE ADDRESS RANGE DMA CONTROLLER BYTE ADDRESS RANGE MEMORY BLOCK 000000h – 001FFFh 0001 0000h – 0001 1FFFh DARAM 0 (1) 002000h – 003FFFh 0001 2000h – 0001 3FFFh DARAM 1 004000h – 005FFFh 0001 4000h – 0001 5FFFh DARAM 2 006000h – 007FFFh 0001 6000h – 0001 7FFFh DARAM 3 008000h – 009FFFh 0001 8000h – 0001 9FFFh DARAM 4 00A000h – 00BFFFh 0001 A000h – 0001 BFFFh DARAM 5 00C000h – 00DFFFh 0001 C000h – 0001 DFFFh DARAM 6 00E000h – 00FFFFh 0001 E000h – 0001 FFFFh DARAM 7 The first 192 bytes are reserved for memory-mapped registers (MMRs). See Figure 3-1 , TMS320VC5505 Memory Map Summary. On-Chip Single-Access RAM (SARAM) The SARAM is located at the byte address range 010000h – 04FFFF h and is composed of 32 blocks of 4K words each (see Table 3-3). Each SARAM block can perform one access per cycle (one read or one write). SARAM can be accessed by the internal program, data, or DMA buses. SARAM is also accessed by the USB and LCD DMA buses. Table 3-3. SARAM Blocks 8 CPU BYTE ADDRESS RANGE DMA/USB CONTROLLER BYTE ADDRESS RANGE MEMORY BLOCK 010000h − 011FFFh 0009 0000h – 0009 1FFFh SARAM 0 012000h − 013FFFh 0009 2000h – 0009 3FFFh SARAM 1 014000h − 015FFFh 0009 4000h – 0009 5FFFh SARAM 2 016000h − 017FFFh 0009 6000h – 0009 7FFFh SARAM 3 018000h − 019FFFh 0009 8000h – 0009 9FFFh SARAM 4 01A000h − 01BFFFh 0009 A000h – 0009 BFFFh SARAM 5 01C000h − 01DFFFh 0009 C000h – 0009 DFFFh SARAM 6 01E000h − 01FFFFh 0009 E000h – 0009 FFFFh SARAM 7 020000h − 021FFFh 000A 0000h – 000A 1FFFh SARAM 8 022000h − 023FFFh 000A 2000h – 000A 3FFFh SARAM 9 024000h − 025FFFh 000A 4000h – 000A 5FFFh SARAM 10 026000h − 027FFFh 000A 6000h – 000A 7FFFh SARAM 11 028000h − 029FFFh 000A 8000h – 000A 9FFFh SARAM 12 02A000h − 02BFFFh 000A A000h – 000A BFFFh SARAM 13 02C000h − 02DFFFh 000A C000h – 000A DFFFh SARAM 14 02E000h − 02FFFFh 000A E000h – 000A FFFFh SARAM 15 Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-3. SARAM Blocks (continued) (1) 3.2.3 CPU BYTE ADDRESS RANGE DMA/USB CONTROLLER BYTE ADDRESS RANGE MEMORY BLOCK 030000h − 031FFFh 000B 0000h – 000B 1FFFh SARAM 16 032000h − 033FFFh 000B 2000h – 000B 3FFFh SARAM 17 034000h − 035FFFh 000B 4000h – 000B 5FFFh SARAM 18 036000h − 037FFFh 000B 6000h – 000B 7FFFh SARAM 19 038000h − 039FFFh 000B 8000h – 000B 9FFFh SARAM 20 03A000h − 03BFFFh 000B A000h – 000B BFFFh SARAM 21 03C000h − 03DFFFh 000B C000h – 000B DFFFh SARAM 22 03E000h − 03FFFFh 000B E000h – 000B FFFFh SARAM 23 040000h – 041FFFh 000C 0000h – 000C 1FFFh SARAM 24 042000h – 043FFFh 000C 2000h – 000C 3FFFh SARAM 25 044000h – 045FFFh 000C 4000h – 000C 5FFFh SARAM 26 046000h – 047FFFh 000C 6000h – 000C 7FFFh SARAM 27 048000h – 049FFFh 000C 8000h – 000C 9FFFh SARAM 28 04A000h – 04BFFFh 000C A000h – 000C BFFFh SARAM 29 04C000h – 04DFFFh 000C C000h – 000C DFFFh SARAM 30 04E000h – 04FFFFh 000C E000h – 000C FFFFh SARAM 31 (1) SARAM31 (byte address range: 0x4E000 – 0x4EFFF) is reserved for the bootloader. After the boot process is complete, this memory space can be used. On-Chip Read-Only Memory (ROM) The zero-wait-state ROM is located at the byte address range FE0000h – FFFFFFh. The ROM is composed of four 16K-word blocks, for a total of 128K bytes of ROM. The ROM address space can be mapped by software to the external memory or to the internal ROM. The standard VC5505 device includes a Bootloader program resident in the ROM. When the MPNMC bit field of the ST3 status register is cleared (by default), the byte address range FE0000h – FFFFFFh is reserved for the on-chip ROM. When the MPNMC bit field of the ST3 status register is set through software, the on-chip ROM is disabled and not present in the memory map, and byte address range FE0000h – FFFFFFh is directed to external memory space. A hardware reset always clears the MPNMC bit, so it is not possible to disable the ROM at reset. However, the software reset instruction does not affect the MPNMC bit. The ROM can be accessed by the program and data buses. Each on-chip ROM block is a one cycle per word access memory. 3.2.4 External Memory The external memory space of the device is located at the byte address range 050000h – FFFFFFh. The external memory space is divided into four chip select spaces: EMIF CS2 through CS5 space dedicated to asynchronous devices including flash. Each chip select space has a corresponding chip select pin (called EMIF_CSx) that is activated during an access to the chip select space. The external memory interface (EMIF) provides the means for the DSP to access external memories and other devices including: NOR Flash, NAND Flash, and SRAM. Before accessing external memory, you must configure the EMIF through its memory-mapped registers. The EMIF provides a configurable 16- or 8-bit data bus, an address bus width of up to 21-bits, and 4 dedicated chip selects, along with memory control signals. To maximize power savings, the I/O pin of the EMIF can be operated at an independent voltage from the rest of other I/O pins on the device. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 9 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3.2.5 www.ti.com I/O Memory The VC5505 DSP includes a 64K byte I/O space for the memory-mapped registers of the DSP peripherals and system registers used for idle control, status monitoring and system configuration. I/O space is separate from program/memory space and is accessed with separate instruction opcodes or via the DMA's. Table 3-4 lists the memory-mapped registers of the device. Note that not all addresses in the 64K byte I/O space are used; these addresses should be treated as RESERVED and not accessed by the CPU nor DMA.. For the expanded tables of each peripheral, see Section 6, Peripheral Information and Electrical Specifications of this document. Some DMA controllers have access to the I/O-Space memory-mapped registers of the following peripherals registers: I2C, UART, I2S, MMC/SD, EMIF, USB, and SAR ADC . Before accessing any peripheral memory-mapped register, make sure the peripheral being accessed is not held in reset via the Peripheral Reset Control Register (PRCR) and its internal clock is enabled via the Peripheral Clock Gating Control Registers (PCGCR1 and PCGCR2). Table 3-4. Peripheral I/O-Space Control Registers 10 WORD ADDRESS PERIPHERAL 0x0000 – 0x0004 Idle Control 0x0005 – 0x000D through 0x0803 – 0x0BFF Reserved 0x0C00 – 0x0C7F DMA0 0x0C80 – 0x0CFF Reserved 0x0D00 – 0x0D7F DMA1 0x0D80 – 0x0DFF Reserved 0x0E00 – 0x0E7F DMA2 0x0E80 – 0x0EFF Reserved 0x0F00 – 0x0F7F DMA3 0x0F80 – 0x0FFF Reserved 0x1000 – 0x10DD EMIF 0x10EE – 0x10FF through 0x1300 – 0x17FF Reserved 0x1800 – 0x181F Timer0 0x1820 – 0x183F Reserved 0x1840 – 0x185F Timer1 0x1860 – 0x187F Reserved 0x1880 – 0x189F Timer2 0x1900 – 0x197F RTC 0x1980 – 0x19FF Reserved 0x1A00 – 0x1A6C I2C 0x1A6D – 0x1AFF Reserved 0x1B00 – 0x1B1F UART 0x1B80 – 0x1BFF Reserved 0x1C00 – 0x1CFF System Control 0x1D00 – 0x1FFF through 0x2600 – 0x27FF Reserved 0x2800 – 0x2840 I2S0 0x2900 – 0x2940 I2S1 0x2A00 – 0x2A40 I2S2 0x2B00 – 0x2B40 I2S3 0x2C41 – 0x2DFF Reserved 0x2E00 – 0x2E40 LCD Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-4. Peripheral I/O-Space Control Registers (continued) WORD ADDRESS PERIPHERAL 0x2E41 – 0x2FFF Reserved 0x3000 – 0x300F SPI 0x3010 – 0x39FF Reserved 0x3A00 – 0x3A1F MMC/SD0 0x3A20 – 0x3AFF Reserved 0x3B00 – 0x3B1F MMC/SD1 0x3B2F – 0x6FFF Reserved 0x7000 – 0x70FF SAR and Analog Control Registers 0x7100 – 0x7FFF Reserved 0x8000 – 0xFFFF USB Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 11 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3.3 www.ti.com Memory Map Summary The VC5505 provides 16M bytes of total memory space composed of on-chip RAM, on-chip ROM, and external memory space supporting a variety of memory types. The on-chip, dual-access RAM allows two accesses to a given block during the same cycle. The VC5505 supports 8 blocks of 4K words of dual-access RAM. The on-chip, single-access RAM allows one access to a given block per cycle. The VC5505 supports 32 blocks of 4K words of single-access RAM. The remainder of the memory map is divided into reserved areas, four external spaces, and on-chip ROM. Each external space has a chip select decode signal (called CS[2:5]) that indicates an access to the selected space. The external memory interface (EMIF) supports access to asynchronous memories such as SRAM, NAND, or NOR. The DSP memory is accessible by different master modules within the DSP, including the C55x CPU, the four DMA controllers, LCD, and USB (see Figure 3-1). CPU BYTE DMA/USB/LCD ADDRESS(A) BYTE ADDRESS(A) 000000h 0001 0000h 0000C0h 0001 00C0h MEMORY BLOCKS MMR (Reserved) DARAM 010000h BLOCK SIZE (B) (D) 64K Minus 192 Bytes 0009 0000h 256K Bytes SARAM 050000h 0100 0000h 8M Minus 320K Bytes Reserved 800000h C00000h E00000h F00000h FE0000h 0200 0000h External-CS2 Space (C) External-CS3 Space (C) 2M Bytes Asynchronous External-CS4 Space (C) 1M Bytes Asynchronous External-CS5 Space (C) 1M Minus 128K Bytes Asynchronous 0300 0000h 0400 0000h 0500 0000h 050E 0000h ROM (if MPNMC=0) FFFFFFh A. B. C. D. 4M Bytes Asynchronous External-CS5 Space (if MPNMC=1) (C) 128K Bytes Asynchronous (if MPNMC=1) 128K Bytes ROM (if MPNMC=0) 050F FFFFh Address shown represents the first byte address in each block. The first 192 bytes are reserved for memory-mapped registers (MMRs). Out of the four DMA controllers, only DMA controller 3 has access to the external memory space. The USB and LCD controllers do not have access to DARAM. Figure 3-1. TMS320VC5505 Memory Map Summary 3.4 Pin Assignments Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in the smallest possible package. Pin multiplexing is controlled using software programmable register settings. For more information on pin muxing, see Section 4.7, Multiplexed Pin Configurations of this document. 12 Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 3.4.1 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Pin Map (Bottom View) Figure 3-2 shows the bottom view of the package pin assignments. P EM_DQM1 DVDDEMIF DVDDIO LCD_ CS0_E0/ SPI_CS0 LCD_ RW_WRB/ SPI_CS2 LCD_D[0]/ SPI_RX LCD_D[2]/ GP[12] DVDDIO LCD_D[5]/ GP[15] LCD_D[7]/ GP[17] LCD_D[9]/ I2S2_FS/ GP[19]/ SPI_CS0 LCD_D[11]/ I2S2_DX/ GP[27]/ SPI_TX LCD_D[13]/ UART_CTS/ GP[29]/ I2S3_FS LCD_D[15]/ UART_TXD/ GP[31]/ I2S3_DX N EM_A[15]/ GP[21] RSV13 LCD_ EN_RDB/ SPI_CLK LCD_ CS1_EN1/ SPI_CS1 LCD_RS/ SPI_CS3 LCD_D[1]/ SPI_TX LCD_D[3]/ GP[13] LCD_D[4]/ GP[14] LCD_D[6]/ GP[16] LCD_D[8]/ I2S2_CLK/ GP[18]/ SPI_CLK LCD_D[10]/ I2S2_RX/ GP[20]/ SPI_RX LCD_D[12]/ UART_RTS/ GP[28]/ I2S3_CLK LCD_D[14]/ UART_RXD/ GP[30]/ I2S3_RX DVDDIO M EM_A[14] EM_D[5] RSV12 EM_CS3 EMU1 TCK TDO XF TRST MMC0_D1/ I2S0_RX/ GP[3] MMC0_CMD/ I2S0_FS/ GP[1] MMC1_D1/ I2S1_RX/ GP[9] MMC1_CLK/ I2S1_CLK/ GP[6] MMC1_D0/ I2S1_DX/ GP[8] L EM_A[13] EM_A[10] EM_D[12] EM_D[4] CVDD EMU0 TDI TMS MMC0_D0/ I2S0_DX/ GP[2] MMC0_CLK/ I2S0_CLK/ GP[0] MMC0_D3/ GP[5] MMC0_D2/ GP[4] MMC1_D3/ GP[11] MMC1_CMD/ I2S1_FS/ GP[7] K EM_A[12]/ (CLE) EM_A[11]/ (ALE) EM_D[14] EM_D[13] EM_D[6] EM_WAIT3 DVDDIO VSS VSS CVDD VSS DVDDIO VSS MMC1_D2/ GP[10] J EM_A[8] EM_A[9] EM_A[20]/ GP[26] EM_D[15] DVDDEMIF CVDD VSS VSS VSS RSV1 RSV2 USB_VBUS USB_VDD1P3 USB_DM H EM_WE EM_A[7] EM_D[7] EM_WAIT5 DVDDEMIF VSS DVDDEMIF CVDD USB_ VSSA1P3 USB_ VDDA1P3 USB_ VSSA3P3 USB_ VDDA3P3 USB_VSS1P3 USB_DP G EM_WAIT4 EM_A[18]/ GP[24] EM_D[0] EM_A[19]/ GP[25] DVDDEMIF VSS VSS USB_VDDPLL USB_R1 F EM_A[6] EM_A[17]/ GP[23] EM_D[2] EM_D[9] DVDDEMIF CVDD DVDDIO DVDDRTC VSS VSS USB_VSSOSC USB_LDOO USB_LDOI DSP_LDOI E EM_A[2] EM_A[16]/ GP[22] EM_D[8] EM_OE EM_D[1] DVDDEMIF INT1 WAKEUP VSS DSP_LDOO VSS VSS VSS VSS D EM_A[5] EM_A[3] EM_D[10] EM_D[3] EM_WAIT2 RESET VSS RTC_ CLKOUT VSSA_PLL GPAIN0 VSS DSP_ LDO_EN DSP_LDO_V RSV3 C EM_A[4] EM_A[1] EM_CS4 EM_D[11] EM_CS2 INT0 CLK_SEL CVDDRTC VSSRTC VDDA_PLL GPAIN3 RSV0 RSV5 RSV4 B EM_BA[1] EM_A[0] RSV10 RSV15 EM_DQM0 EM_R/W SCL SDA RTC_XI VSSA_ANA GPAIN2 ANA_LDOI BG_CAP VSSA_ANA A EM_BA[0] DVDDEMIF EM_CS5 RSV11 DVDDEMIF RSV14 CLKOUT CLKIN RTC_XO VDDA_ANA GPAIN1 ANA_LDOO VSS VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A. USB_VSSREF USB_VSSPLL USB_VDDOSC USB_M12XI USB_M12XO Shading denotes pins not supported on this device. To ensure proper device operation, these pins must be hooked up properly, see Table 3-19, Regulators and Power Management Terminal Functions. Figure 3-2. VC5505 Pin Map (A) Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 13 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3.5 www.ti.com Terminal Functions The terminal functions tables (Table 3-5 through Table 3-22) identify the external signal names, the associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin has any internal pullup or pulldown resistors, and a functional pin description. For more detailed information on device configuration, peripheral selection, multiplexed/shared pins, and debugging considerations, see the Device Configuration section of this data manual. For proper device operation, external pullup/pulldown resistors may be required on some pins. Section 4.8.1, Pullup/Pulldown Resistors discusses situations where external pullup/pulldown resistors are required. 14 Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-5. Oscillator/PLL Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION DSP clock output signal. For debug purposes, the CLKOUT pin can be used to tap different clocks within the DSP clock generator. The SRC bits in the CLKOUT Control Source Register (CCSSR) can be used to specify the CLKOUT pin source. Additionally, the slew rate of the CLKOUT pin can be controlled by the Output Slew Rate Control Register (OSRCR) [0x1C16]. CLKOUT A7 O/Z – DVDDIO The CLKOUT pin is enabled/disabled through the CLKOFF bit in the CPU ST3_55 register. When disabled, the CLKOUT pin is placed in high-impedance (Hi-Z). At reset the CLKOUT pin is enabled until the beginning of the boot sequence, when the on-chip Bootloader sets CLKOFF = 1 and the CLKOUT pin is disabled (Hi-Z). For more information on the ST3_55 register, see the TMS320C55x 3.0 CPU Reference Guide (literature number: SWPU073). Input clock. This signal is used to input an external clock when the 32-KHz on-chip oscillator is not used as the DSP clock (pin CLK_SEL = 1). For boot purposes, the CLKIN frequency is assumed to be either 11.2896, 12, or 12.288 MHz. The CLK_SEL pin (C7) selects between the 32-KHz crystal clock or CLKIN. CLKIN A8 I – DVDDIO When the CLK_SEL pin is low, this pin should be tied to ground (VSS). When CLK_SEL is high, this pin should be driven by an external clock source. If CLK_SEL is high, this pin is used as the reference clock for the clock generator and during bootup the bootloader bypasses the PLL and assumes the CLKIN frequency is one of the following frequencies: 11.2896-, 12-, or 12.288-MHz. With these frequencies in mind, the bootloader sets the SPI clock rates at 500 KHz, the I2C clock rate at 400 KHz, and UART at 57600 baud. CLK_SEL C7 I – DVDDIO Clock input select. This pin selects between the 32-KHz crystal clock or CLKIN. 0 = 32-KHz on-chip oscillator drives the RTC timer and the DSP clock generator while CLKIN is ignored. 1 = CLKIN drives the DSP clock generator and the 32-KHz on-chip oscillator drives only the RTC timer. This pin is not allowed to change during device operation; it must be tied high or low at the board. (1) (2) (3) VDDA_PLL C10 PWR see Section 5.2, 1.3-V Analog PLL power supply for the system clock generator. ROC VSSA_PLL D9 GND see Section 5.2, Analog PLL ground for the system clock generator. ROC I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 15 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-6. Real-Time Clock (RTC) Terminal Functions SIGNAL NAME RTC_XO NO. A9 TYPE (1) I OTHER (2) (3) – CVDDRTC DESCRIPTION Real-time clock oscillator output. This pin operates at the RTC core voltage, CVDDRTC, and supports a 32.768-kHz crystal. If the RTC oscillator is not used, it can be disabled by connecting RTC_XI to CVDDRTC and RTC_XO to ground (VSS). A voltage must still be applied to CVDDRTC (see Section 5.2, Recommended Operating Conditions). Note: When RTC oscillator is disabled, the RTC registers (I/O address range 1900h – 197Fh) are not accessible. RTC_XI B9 I – CVDDRTC Real-time clock oscillator input. If the RTC oscillator is not used, it can be disabled by connecting RTC_XI to CVDDRTC and RTC_XO to ground (VSS). A voltage must still be applied to CVDDRTC (see Section 5.2, Recommended Operating Conditions). Note: When RTC oscillator is disabled, the RTC registers (I/O address range 1900h – 197Fh) are not accessible. RTC_CLKOUT D8 O/Z WAKEUP E8 I/O/Z (1) (2) (3) 16 – DVDDRTC – DVDDRTC Real-time clock output pin. This pin operates at DVDDRTC voltage. The RTC_CLKOUT pin is enabled/disabled through the RTCCLKOUTEN bit in the RTC Power Management Register (RTCPMGT). At reset, the RTC_CLKOUT pin is disabled (high-impedance [Hi-Z]). The pin is used to WAKEUP the core from idle condition. This pin defaults to an input at CVDDRTC powerup, but can also be configured as an active-low open-drain output signal to wakeup an external device from an RTC alarm. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-7. RESET, Interrupts, and JTAG Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION RESET External Flag Output. XF is used for signaling other processors in multiprocessor configurations or XF can be used as a fast general-purpose output pin. XF RESET M8 D6 O/Z I – DVDDIO IPU DVDDIO XF is set high by the BSET XF instruction and XF is set low by the BCLR XF instruction or by writing to bit 13 of the ST1_55 register. At reset, the XF pin will be high. For more information on the ST1_55 register, see the TMS320C55x 3.0 CPU Reference Guide (literature number: SWPU073). Device reset. RESET causes the DSP to terminate execution and loads the program counter with the contents of the reset vector. When RESET is brought to a high level, the reset vector in ROM at FFFF00h forces the program execution to branch to the location of the on-chip ROM bootloader. RESET affects the various registers and status bits. The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register but will be forced ON when RESET is asserted. JTAG [For more detailed information on emulation header design guidelines, see the XDS560 Emulator Technical Reference (literature number: SPRU589).] TMS TDO TDI (1) (2) (3) L8 M7 L7 I O/Z I IPU DVDDIO IEEE standard 1149.1 test mode select. This serial control input is clocked into the TAP controller on the rising edge of TCK. If the emulation header is located greater than 6 inches from the device, TMS must be buffered. In this case, the input buffer for TMS needs pullup resistors connected to DVDDIO to hold these signals at a known value when the emulator is not connected. A resistor value of 4.7 kΩ or greater is suggested. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register. – DVDDIO IEEE standard 1149.1 test data output. The contents of the selected register (instruction or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance (Hi-Z) state except when the scanning of data is in progress. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). If the emulation header is located greater than 6 inches from the device, TDO must be buffered. IPU DVDDIO IEEE standard 1149.1 test data input. TDI is clocked into the selected register (instruction or data) on a rising edge of TCK. If the emulation header is located greater than 6 inches from the device, TDI must be buffered. In this case, the input buffer for TDI need pull-up resistors connected to DVDDIO to hold these signals at a known value when the emulator is not connected. A resistor value of 4.7 kΩ or greater is suggested. The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 17 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-7. RESET, Interrupts, and JTAG Terminal Functions (continued) SIGNAL NAME TCK TRST EMU1 EMU0 NO. M6 M9 M5 L6 TYPE (1) I I I/O/Z I/O/Z OTHER (2) (3) DESCRIPTION IPU DVDDIO IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50% duty cycle. The changes on test access port (TAP) of input signals TMS and TDI are clocked into the TAP controller, instruction register, or selected test data register on the rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling edge of TCK. If the emulation header is located greater than 6 inches from the device, TCK must be buffered. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register. IPD DVDDIO IEEE standard 1149.1 reset signal for test and emulation logic. TRST, when high, gives the IEEE standard 1149.1 scan system control of the operations of the device. If TRST is not connected or driven low, the device operates in its functional mode, and the IEEE standard 1149.1 signals are ignored. The VC5505 will not operate properly if this reset pin is never asserted low. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). It is recommended that an external pulldown resistor be used in addition to the IPD -- especially if there is a long trace to an emulation header. IPU DVDDIO Emulator 1 pin. EMU1 is used as an interrupt to or from the emulator system and is defined as input/output by way of the emulation logic. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). An external pullup to DVDDIO is required to provide a signal rise time of less than 10 msec. A 4.7-kΩ resistor is suggested for most applications. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register. IPU DVDDIO Emulator 0 pin. When TRST is driven low and then high, the state of the EMU0 pin is latched and used to connect the JTAG pins (TCK, TMS, TDI, TDO) to either the IEEE1149.1 Boundary-Scan TAP (when the latched value of EMU0 = 0) or to the DSP Emulation TAP (when the latched value of EMU0 = 1). Once TRST is high, EMU0 is used as an interrupt to or from the emulator system and is defined as input/output by way of the emulation logic. An external pullup to DVDDIO is required to provide a signal rise time of less than 10 msec. A 4.7-kΩ resistor is suggested for most applications. For board design guidelines related to the emulation header, see the XDS560 Emulator Technical Reference (literature number: SPRU589). The IPU resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EXTERNAL INTERRRUPTS 18 INT1 E7 I IPU DVDDIO INT0 C6 I IPU DVDDIO External interrupt inputs (INT1 and INT0). These pins are maskable via their specific Interrupt Mask Register (IMR1, IMR0) and the interrupt mode bit. The pins can be polled and reset by their specific Interrupt Flag Register (IFR1, IFR0). The IPU resistor on these pins can be enabled or disabled via the PDINHIBR2 register. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-8. External Memory Interface (EMIF) Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION EMIF FUNCTIONAL PINS: ASYNC (NOR, SRAM, and NAND) Note: When accessing 8-bit Asynchronous memory, pins EM_A[20:0] should be connected to memory address pins [22:2] and EM_BA[1:0] should be connected to memory addresss pins [1:0]. For 16-bit Asynchronous memory, pins EM_A[20:0] should be connected to memory address pins [20:1] and EM_BA[1] should be connected to memory addresss pin [0]. EM_A[20]/GP[26] J3 I/O/Z IPD DVDDEMIF This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 20. Mux control via the A20_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 19. Mux control via the A19_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[19]/GP[25] G4 I/O/Z IPD DVDDEMIF EM_A[18]/GP[24] G2 I/O/Z IPD DVDDEMIF This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 18. Mux control via the A18_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[17]/GP[23] F2 I/O/Z IPD DVDDEMIF This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 17. Mux control via the A17_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[16]/GP[22] E2 I/O/Z IPD DVDDEMIF This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 16. Mux control via the A16_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[15]/GP[21] N1 I/O/Z IPD DVDDEMIF This pin is multiplexed between EMIF and GPIO. For EMIF, this pin is the EMIF external address pin 15. Mux control via the A15_MODE bit in the EBSR (see Figure 4-2). The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[14] M1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 14. EM_A[13] L1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 13. EM_A[12]/(CLE) K1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 12. When interfacing with NAND Flash, this pin also acts as Command Latch Enable (CLE). EM_A[11]/(ALE) K2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 11. When interfacing with NAND Flash, this pin also acts as Address Latch Enable (ALE). EM_A[10] L2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 10. EM_A[9] J2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 9. EM_A[8] J1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 8. EM_A[7] H2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 7. EM_A[6] F1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 6. EM_A[5] D1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 5. EM_A[4] C1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 4. EM_A[3] D2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 3. EM_A[2] E1 I/O/Z DVDDEMIF This pin is the EMIF external address pin 2. EM_A[1] C2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 1. EM_A[0] B2 I/O/Z DVDDEMIF This pin is the EMIF external address pin 0. (1) (2) (3) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 19 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-8. External Memory Interface (EMIF) Terminal Functions (continued) SIGNAL NAME 20 NO. EM_D[15] J4 EM_D[14] K3 EM_D[13] K4 EM_D[12] L3 EM_D[11] C4 EM_D[10] D3 EM_D[9] F4 EM_D[8] E3 EM_D[7] H3 EM_D[6] K5 EM_D[5] M2 EM_D[4] L4 EM_D[3] D4 TYPE (1) OTHER (2) (3) DESCRIPTION I/O/Z DVDDEMIF EMIF 16-bit bi-directional bus. EM_D[2] F3 EM_D[1] E5 EM_D[0] G3 EM_CS5 A3 O/Z DVDDEMIF EMIF chip select 5 output for use with asynchronous memories (i.e., NOR flash, NAND flash, or SRAM). EM_CS4 C3 O/Z DVDDEMIF EMIF chip select 4 output for use with asynchronous memories (i.e., NOR flash, NAND flash, or SRAM). EM_CS3 M4 O/Z DVDDEMIF EMIF NAND chip select 3 output for use with asynchronous memories (i.e., NOR flash, NAND flash, or SRAM). EM_CS2 C5 O/Z DVDDEMIF EMIF NAND chip select 2 output for use with asynchronous memories (i.e., NOR flash, NAND flash, or SRAM). EM_WE H1 O/Z DVDDEMIF EMIF asynchronous memory write enable output EM_OE E4 O/Z DVDDEMIF EMIF asynchronous memory read enable output EMIF asynchronous read/write output EM_R/W B6 O/Z DVDDEMIF EM_DQM1 P1 O/Z DVDDEMIF EM_DQM0 B5 O/Z DVDDEMIF EM_BA[1] B1 O/Z DVDDEMIF EM_BA[0] A1 O/Z DVDDEMIF EM_WAIT5 H4 I DVDDEMIF EMIF wait state extension input 5 for EM_CS5 EM_WAIT4 G1 I DVDDEMIF EMIF wait state extension input 4 for EM_CS4 EM_WAIT3 K6 I DVDDEMIF EMIF wait state extension input 3 for EM_CS3 EM_WAIT2 D5 I DVDDEMIF EMIF wait state extension input 2 for EM_CS2 EMIF asynchronous data write strobes and byte enables. EMIF asynchronous bank address 16-bit wide memory: EM_BA[1] forms the device address[0] and BA[0] forms device address [23]. 8-bit wide memory: EM_BA[1] forms the device address[1] and BA[0] forms device address [0]. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-9. Inter-Integrated Circuit (I2C) Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION I2C (1) (2) (3) SCL B7 I/O/Z DVDDIO This pin is the I2C clock output. Per the I2C standard, an external pullup is required on this pin. SDA B8 I/O/Z DVDDIO This pin is the I2C bidirectional data signal. Per the I2C standard, an external pullup is required on this pin. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Table 3-10. Inter-IC Sound (I2S0 – I2S3) Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION Interface 0 (I2S0) MMC0_D0/ I2S0_DX/ GP[2] L9 I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For I2S, it is I2S0 transmit data output I2S0_DX. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC0_CLK/ I2S0_CLK/ GP[0] L10 I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For I2S, it is I2S0 clock input/output I2S0_CLK. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC0_D1/ I2S0_RX/ GP[3] M10 I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For I2S, it is I2S0 receive data input I2S0_RX. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC0_CMD/ I2S0_FS/ GP[1] M11 I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For I2S, it is I2S0 frame synchronization input/output I2S0_FS. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For I2S, it is I2S1 transmit data output I2S1_DX. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For I2S, it is I2S1 clock input/output I2S1_CLK. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For I2S, it is I2S1 receive data input I2S1_RX. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed betweenn MMC1, I2S2, and GPIO. For I2S, it is I2S1 frame synchronization input/output I2S1_FS. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. Interface 1 (I2S1) MMC1_D0/ I2S1_DX/ GP[8] MMC1_CLK/ I2S1_CLK/ GP[6] MMC1_D1/ I2S1_RX/ GP[9] MMC1_CMD/ I2S1_FS/ GP[7] (1) (2) (3) M14 M13 M12 L14 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 21 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-10. Inter-IC Sound (I2S0 – I2S3) Terminal Functions (continued) SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION Interface 2 (I2S2) LCD_D[11]/ I2S2_DX/ GP[27]/ SPI_TX LCD_D8]/ I2S2_CLK/ GP[18]/ SPI_CLK P12 N10 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For I2S, it is I2S2 transmit data output I2S2_DX. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For I2S, it is I2S2 clock input/output I2S2_CLK. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For I2S, it is I2S2 receive data input I2S2_RX. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[10]/ I2S2_RX/ GP[20]/ SPI_RX N11 I/O/Z IPD DVDDIO LCD_D[9]/ I2S2_FS/ GP[19]/ SPI_CS0 P11 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, and GPIO. For I2S, it is I2S2 frame synchronization input/output I2S2_FS. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. Interface 3 (I2S3) 22 LCD_D[15]/ UART_TXD/ GP[31]/ I2S3_DX P14 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For I2S, it is I2S3 transmit data output I2S3_DX. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[12]/ UART_RTS/ GP[28]/ I2S3_CLK N12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For I2S, it is I2S3 clock input/output I2S3_CLK. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[14]/ UART_RXD/ GP[30]/ I2S3_RX N13 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For I2S, it is I2S3 receive data input I2S3_RX. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[13]/ UART_CTS/ GP[29]/ I2S3_FS P13 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For I2S, it is I2S3 frame synchronization input/output I2S3_FS. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-11. Serial Peripheral Interface (SPI) Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION Serial Port Interface (SPI) LCD_CS0_E0/ SPI_CS0 P4 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI chip select SPI_CS0. LCD_D[9]/ I2S2_FS/ GP[19]/ SPI_CS0 P11 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI chip select SPI_CS0. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_CS1_E1/ SPI_CS1 N4 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI chip select SPI_CS1. LCD_RW_WRB/ SPI_CS2 P5 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI chip select SPI_CS2. LCD_RS/ SPI_CS3 N5 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI chip select SPI_CS3. LCD_EN_RDB/ SPI_CLK N3 O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is clock output SPI_CLK. IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is clock output SPI_CLK. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. (1) (2) (3) LCD_D8]/ I2S2_CLK/ GP[18]/ SPI_CLK N10 LCD_D[1]/ SPI_TX N6 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI transmit data output. LCD_D[11]/ I2S2_DX/ GP[27]/ SPI_TX P12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. Mux control via the PPMODE bits in the EBSR. For SPI, this pin is SPI transmit data output. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[0]/ SPI_RX P6 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. Mux control via the PPMODE bits in the EBSR. For SPI this pin is SPI receive data input. LCD_D[10]/ I2S2_RX/ GP[20]/ SPI_RX N11 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. Mux control via the PPMODE bits in the EBSR. For SPI this pin is SPI receive data input. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 23 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-12. UART Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION UART LCD_D[14]/ UART_RXD/ GP[30]/ I2S3_RX LCD_D[15]/ UART_TXD/ GP[31]/ I2S3_DX LCD_D[13]/ UART_CTS/ GP[29]/ I2S3_FS LCD_D[12]/ UART_RTS/ GP[28]/ I2S3_CLK (1) (2) (3) N13 P14 P13 N12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. When used by UART, it is the receive data input UART_RXD. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. In UART mode, it is the transmit data output UART_TXD. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. In UART mode, it is the clear to send input UART_CTS. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. In UART mode, it is the ready to send output UART_RTS. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Table 3-13. USB2.0 Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION USB 2.0 12-MHz crystal oscillator input. USB_MXI G13 I USB_VDDOSC USB_MXO G14 O USB_VDDOSC When the USB peripheral is not used, USB_MXI should be connected to ground (VSS). 12-MHz crystal oscillator output. When the USB peripheral is not used, USB_MXO should be left unconnected. 3.3-V power supply for USB oscillator. USB_VDDOSC G12 S see Section 5.2, ROC USB_VSSOSC F11 S see Section 5.2, ROC Ground for USB oscillator. USB_VBUS J12 A I/O see Section 5.2, ROC USB power detect. 5-V input that signifies that VBUS is connected. When the USB peripheral is not used, the USB_VBUS signal should be connected to ground (VSS). USB_DP H14 A I/O USB_VDDA3P3 USB bi-directional Data Differential signal pair [positive/negative]. USB_DM J14 A I/O USB_VDDA3P3 When the USB peripheral is not used, the USB_DP and USB_DM signals should both be tied to ground (VSS). USB_R1 G9 A I/O USB_VDDA3P3 When the USB peripheral is not used, USB_VDDOSC should be connected to ground (VSS). External resistor connect. Reference current output. This must be connected via a 10-kΩ ±1% resistor to USB_VSSREF and be placed as close to the device as possible. When the USB peripheral is not used, the USB_R1 signal should be connected via a 10-kΩ resistor to USB_VSSREF. (1) (2) (3) 24 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-13. USB2.0 Terminal Functions (continued) SIGNAL TYPE (1) OTHER (2) (3) DESCRIPTION NAME NO. USB_VSSREF G10 GND see Section 5.2, ROC USB_VDDA3P3 H12 S see Section 5.2, ROC USB_VSSA3P3 H11 GND see Section 5.2, ROC USB_VDDA1P3 H10 S see Section 5.2, ROC USB_VSSA1P3 H9 GND see Section 5.2, ROC USB_VDD1P3 J13 S see Section 5.2, ROC USB_VSS1P3 H13 GND see Section 5.2, ROC Digital core ground for USB phy. USB_VDDPLL G8 S see Section 5.2, ROC 3.3 V USB Analog PLL power supply. When the USB peripheral is not used, the USB_VDDPLL signal should be connected to ground (VSS). USB_VSSPLL G11 GND see Section 5.2, ROC USB Analog PLL ground. Ground for reference current. This must be connected via a 10-kΩ ±1% resistor to USB_R1. When the USB peripheral is not used, the USB_VSSREF signal should be connected directly to ground (Vss). Analog 3.3 V power supply for USB PHY. When the USB peripheral is not used, the USB_VDDA3P3 signal should be connected to ground (VSS). Analog ground for USB PHY. Analog 1.3 V power supply for USB PHY. [For high-speed sensitive analog circuits] When the USB peripheral is not used, the USB_VDDA1P3 signal should be connected to ground (VSS). Analog ground for USB PHY [For high speed sensitive analog circuits]. 1.3-V digital core power supply for USB PHY. When the USB peripheral is not used, the USB_VDD1P3 signal should be connected to ground (VSS). Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 25 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-14. LCD Bridge Terminal Functions SIGNAL TYPE (1) OTHER (2) (3) DESCRIPTION NAME NO. LCD_EN_RDB/ SPI_CLK N3 O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD Bridge, this pin is either LCD Bridge read/write enable (MPU68 mode) or read strobe (MPU80 mode). Mux control via the PPMODE bits in the EBSR. LCD_CS0_E0/ SPI_CS0 P4 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD Bridge, this pin is either LCD Bridge chip select 0 (MPU68 and MPU80 modes) or enable 0 (HD44780 mode). Mux control via the PPMODE bits in the EBSR. LCD_CS1_E1/ SPI_CS1 N4 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD Bridge, this pin is either LCD Bridge chip select 1 (MPU68 and MPU80 modes) or enable 1 (HD44780 mode). Mux control via the PPMODE bits in the EBSR. LCD_RW_WRB/ SPI_CS2 P5 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD, this pin is either LCD Bridge read/write select (HD44780 and MPU68 modes) or write strobe (MPU80 mode). Mux control via the PPMODE bits in the EBSR,. LCD_RS/ SPI_CS3 N5 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD, this pin is the LCD Bridge address set-up. Mux control via the PPMODE bits in the EBSR. LCD_D[15]/ UART_TXD/ GP[31]/ I2S3_DX P14 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For LCD Bridge, it is LCD data pin 15. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[14]/ UART_RXD/ GP[30]/ I2S3_RX N13 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For LCD Bridge, it is LCD data pin 14. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[13]/ UART_CTS/ GP[29]/ I2S3_FS P13 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For LCD Bridge, it is LCD data pin 13. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[12]/ UART_RTS/ GP[28]/ I2S3_CLK N12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, and GPIO. For LCD Bridge, it is LCD data pin 12. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[11]/ I2S2_DX/ GP[27]/ SPI_TX P12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For LCD Bridge, it is LCD data pin 11. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[10]/ I2S2_RX/ GP[20]/ SPI_RX N11 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For LCD Bridge, it is LCD data pin 10. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[9]/ I2S2_FS/ GP[19]/ SPI_CS0 P11 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For LCD Bridge, it is LCD data pin 9. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For LCD Bridge, it is LCD data pin 8. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 7. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[8]/ I2S2_CLK GP[18]/ SPI_CLK LCD_D[7]/ GP[17] (1) (2) (3) 26 N10 P10 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-14. LCD Bridge Terminal Functions (continued) SIGNAL TYPE (1) OTHER (2) (3) DESCRIPTION NAME NO. LCD_D[6]/ GP[16] N9 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 6. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[5]/ GP[15] P9 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 5. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 4. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 3. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. This pin is multiplexed between LCD Bridge and GPIO. For LCD Bridge, it is LCD data pin 2. Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[4]/ GP[14] LCD_D[3]/ GP[13] N8 N7 LCD_D[2]/ GP[12] P7 I/O/Z IPD DVDDIO LCD_D[1]/ SPI_TX N6 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD Bridge, it is LCD data pin 1. Mux control via the PPMODE bits in the EBSR. LCD_D[0]/ SPI_RX P6 I/O/Z DVDDIO This pin is multiplexed between LCD Bridge and SPI. For LCD Bridge, it is LCD data pin 0. Mux control via the PPMODE bits in the EBSR. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 27 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-15. MMC1/SD Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION MMC/SD MMC1_CLK/ I2S1_CLK/ GP[6] (1) (2) (3) M13 O IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For MMC/SD, this is the MMC1 data clock output MMC1_CLK. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. This pin is multiplexed between MMC1, I2S1, and GPIO. For MMC/SD, this is the MMC1 command I/O output MMC1_CMD. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC1_CMD/ I2S1_FS/ GP[7] L14 O IPD DVDDIO MMC1_D3/ GP[11] L13 I/O/Z IPD DVDDIO MMC1_D2/ GP[10] K14 I/O/Z IPD DVDDIO MMC1_D1/ I2S1_RX/ GP[9] M12 I/O/Z IPD DVDDIO MMC1_D0/ I2S1_DX/ GP[8] M14 I/O/Z IPD DVDDIO The MMC1_D3 and MMC1_D2 pins are multiplexed between MMC1 and GPIO. The MMC1_D1 and MMC1_D0 pins are multiplexed between MMC1, I2S1, and GPIO. In MMC/SD mode, all these pins are the MMC1 nibble wide bi-directional data bus. Mux control via the SP1MODE bits in the EBSR. The IPD resistor on these pins can be enabled or disabled via the PDINHIBR1 register. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Table 3-16. MMC0/SD Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION MMC/SD MMC0_CLK/ I2S0_CLK/ GP[0] (1) (2) (3) 28 L10 O IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For MMC/SD, this is the MMC0 data clock output MMC0_CLK. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. This pin is multiplexed between MMC0, I2S0, and GPIO. For MMC/SD, this is the MMC0 command I/O output MMC0_CMD. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC0_CMD/ I2S0_FS/ GP[1] M11 O IPD DVDDIO MMC0_D3/ GP[5] L11 I/O/Z IPD DVDDIO MMC0_D2/ GP[4] L12 I/O/Z IPD DVDDIO MMC0_D1/ I2S0_RX/ GP[3] M10 I/O/Z IPD DVDDIO MMC0_D0/ I2S0_DX/ GP[2] L9 I/O/Z IPD DVDDIO The MMC0_D3 and MMC0_D2 pins are multiplexed between MMC0 and GPIO. The MMC0_D1 and MMC0_D0 pins are multiplexed between MMC0, I2S0, and GPIO. In MMC/SD mode, these pins are the MMC0 nibble wide bi-directional data bus. Mux control via the SP0MODE bits in the EBSR. The IPD resistor on these pins can be enabled or disabled via the PDINHIBR1 register. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-17. 10-Bit SAR ADC Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION SAR ADC GPAIN0 GPAIN1 GPAIN2 GPAIN3 (1) (2) (3) D10 A11 B11 C11 I/O I/O I/O I/O VDDA_ANA GPAIN0: General -Purpose Output and Analog Input pin 0. This pin is demuxed internally into ADC Channels 0, 1, & 2. GPAIN0 can also be used as a general-purpose open-drain output. This pin is unique among the GPAIN pins in that it is the only pin that is 3.6 V-tolerant to support measuring a battery voltage. GPAIN0 can accommodate input voltages from 0 V to 3.6 V; although, the ADC is unable to accept signals greater than VDDA_ANA without clamping. ADC Channel 1 is capable of switching in an internal resistor divider that has a divide ratio of approximately 1/8. VDDA_ANA GPAIN1: General -Purpose Output and Analog Input pin 1. This pin is connected to ADC Channel 3. GPAIN1 can be used as a general-purpose output if certain requirements are met (see Note: below). GPAIN1 can accommodate input voltages from 0 V to VDDA_ANA. Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be used as a general-purpose output (driving high) since the max current capability (see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be exceeded. Doing so may result in the on-chip power-on reset (POR) resetting the chip. VDDA_ANA GPAIN2: General -Purpose Output and Analog Input pin 2. This pin is connected to ADC Channel 4. GPAIN2 can be used as a general-purpose output if certain requirements are met (see Note: below). GPAIN2 can accommodate input voltages from 0 V to VDDA_ANA. Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be used as a general-purpose output (driving high) since the max current capability (see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be exceeded. Doing so may result in the on-chip POR resetting the chip. VDDA_ANA GPAIN3: General -Purpose Output and Analog Input pin 3. This pin is connected to ADC Channel 5. GPAIN3 can be used as a general-purpose output if certain requirements are met (see Note: below). GPAIN3 can accommodate input voltages from 0 V to VDDA_ANA. Note: If the ANA_LDO is used to supply power to VDDA_ANA, this pin must not be used as a general-purpose output (driving high) since the max current capability (see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature) of the ANA_LDO can be exceeded. Doing so may result in the on-chip POR resetting the chip. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 29 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-18. GPIO Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION General-Purpose Input/Output External Flag Output. XF is used for signalling other processors in multiprocessor configurations or XF can be used as a fast general-purpose output pin. XF MMC0_CLK/ I2S0_CLK/ GP[0] MMC0_CMD/ I2S0_FS/ GP[1] MMC0_D0/ I2S0_DX/ GP[2] MMC0_D1/ I2S0_RX/ GP[3] MMC0_D2/ GP[4] L9 M10 L12 I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For GPIO, it is general-purpose input/output pin 0 (GP[0]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For GPIO, it is general-purpose input/output pin 1 (GP[1]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For GPIO, it is general-purpose input/output pin 2 (GP[2]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC0, I2S0, and GPIO. For GPIO, it is general-purpose input/output pin 3 (GP[3]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC0 and GPIO. For GPIO, it is general-purpose input/output pin 4 (GP[4]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. This pin is multiplexed between MMC0 and GPIO. For GPIO, it is general-purpose input/output pin 5 (GP[5]). Mux control via the SP0MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. XF is set high by the BSET XF instruction and XF is set low by the BCLR XF instruction or by writing to bit 13 of the ST1_55 register. At reset, the XF pin will be high. For more information on the ST1_55 register, see the TMS320C55x 3.0 CPU Reference Guide (literature number: SWPU073). L11 I/O/Z MMC1_CLK/ I2S1_CLK/ GP[6] M13 I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For GPIO, it is general-purpose input/output pin 6 (GP[6]). Mux control via the SP1MODE bits in the EBSR. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For GPIO, it is general-purpose input/output pin 7 (GP[7]). Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For GPIO, it is general-purpose input/output pin 8 (GP[8]). Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1, I2S1, and GPIO. For GPIO, it is general-purpose input/output pin 9 (GP[9]). Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1 and GPIO. For GPIO, it is general-purpose input/output pin 10 (GP[10]). Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. I/O/Z IPD DVDDIO This pin is multiplexed between MMC1 and GPIO. For GPIO, it is general-purpose input/output pin 11 (GP[11]). Mux control via the SP1MODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR1 register. MMC1_D1/ I2S1_RX/ GP[9] MMC1_D2/ GP[10] MMC1_D3/ GP[11] 30 M11 – DVDDIO IPD DVDDIO MMC1_D0/ I2S1_DX/ GP[8] (3) L10 O/Z MMC0_D3/ GP[5] MMC1_CMD/ I2S1_FS/ GP[7] (1) (2) M8 L14 M14 M12 K14 L13 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-18. GPIO Terminal Functions (continued) SIGNAL TYPE (1) OTHER (2) (3) DESCRIPTION NAME NO. LCD_D[2]/ GP[12] P7 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 12 (GP[12]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[3]/ GP[13] N7 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 13 (GP[13]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 14 (GP[14]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 15 (GP[15]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 16 (GP[16]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 17 (GP[17]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge and GPIO. For GPIO, it is general-purpose input/output pin 18 (GP[18]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, and GPIO. For GPIO, it is general-purpose input/output pin 19 (GP[19]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. This pin is multiplexed between LCD Bridge, I2S2, GPIOand SPI. For GPIO, it is general-purpose input/output pin 20 (GP[20]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[4]/ GP[14] LCD_D[5]/ GP[15] LCD_D[6]/ GP[16] LCD_D[7]/ GP[17] LCD_D8]/ I2S2_CLK/ GP[18]/ SPI_CLK LCD_D[9]/ I2S2_FS/ GP[19]/ SPI_CS0 N8 P9 N9 P10 N10 P11 LCD_D[10]/ I2S2_RX/ GP[20]/ SPI_RX N11 I/O/Z IPD DVDDIO EM_A[15]/GP[21] N1 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 21 (GP[21]). Mux control via the A15_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[16]/GP[22] E2 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 22 (GP[22]). Mux control via the A16_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[17]/GP[23] F2 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 23 (GP[23]). Mux control via the A17_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[18]/GP[24] G2 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 24 (GP[24]). Mux control via the A18_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[19]/GP[25] G4 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 25 (GP[25]). Mux control via the A19_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. EM_A[20]/GP[26] J3 I/O/Z IPD DVDDIO This pin is multiplexed between EMIF and GPIO. For GPIO, it is general-purpose input/output pin 26 (GP[26]). Mux control via the A20_MODE bit in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR2 register. Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 31 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-18. GPIO Terminal Functions (continued) SIGNAL OTHER (2) (3) DESCRIPTION NO. LCD_D[11]/ I2S2_DX/ GP[27]/ SPI_TX P12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, I2S2, GPIO, and SPI. For GPIO, it is general-purpose input/output pin 27 (GP[27]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[12]/ UART_RTS/ GP[28]/ I2S3_CLK N12 I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For GPIO, it is general-purpose input/output pin 28 (GP[28]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For GPIO, it is general-purpose input/output pin 29 (GP[29]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For GPIO, it is general-purpose input/output pin 30 (GP[30]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. I/O/Z IPD DVDDIO This pin is multiplexed between LCD Bridge, UART, GPIO, and I2S3. For GPIO, it is general-purpose input/output pin 31 (GP[31]). Mux control via the PPMODE bits in the EBSR. The IPD resistor on this pin can be enabled or disabled via the PDINHIBR3 register. LCD_D[13]/ UART_CTS/ GP[29]/ I2S3_FS LCD_D[14]/ UART_RXD/ GP[30]/ I2S3_RX LCD_D[15]/ UART_TXD/ GP[31]/ I2S3_DX 32 TYPE (1) NAME P13 N13 P14 Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-19. Regulators and Power Management Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION Regulators DSP_LDOO E10 S [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to an ~ 1.0 mF decoupling capacitor to VSS. For more detailed information, see Section 6.3.3, Power-Supply Decoupling. DSP_LDOI F14 S [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to the same supply as the ANA_LDOI pin (B12). DSP_LDO_EN (3) I [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be tied to ground (VSS). For future device family pin compatibility, board designs should have this pin layout with a zero-Ω resistor to ANA_LDOI and a zero-Ω resistor to ground. For VC5505 , only the zero-Ω resistor to ground should be populated. – ANA_LDOI [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to the same supply as the ANA_LDOI pin (B12). For future device family pin compatibility, board designs should have this pin layout with a zero-Ω resistor to ANA_LDOI and a zero-Ω resistor to ground. For VC5505 , only the zero-Ω resistor to ANA_LDOI should be populated. DSP_LDO_V D13 I USB_LDOO F12 S [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be left unconnected. USB_LDOI F13 S [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to the same supply as the ANA_LDOI pin (B12). ANA_LDOO A12 S Analog LDO output. This output provides up to 3 mA of current regulated to 1.3 V (see the ISD parameter in Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature). For proper device operation, this pin must be connected to an ~ 1.0 mF decoupling capacitor to VSS. For more detailed information, see Section 6.3.3, Power-Supply Decoupling. ANA_LDOI B12 S Analog LDO input. This input pin must be connected to a power supply with a voltage range of 1.8 V to 3.6 V. It supplies power for the ANA_LDO, the bandgap reference generator circuits, and is the I/O supply for some input pins. O Bandgap reference filter signal. For proper device operation, this pin needs to be bypassed with a 0.1 mF capacitor to analog ground (VSSA_ANA). This external capacitor provides filtering for stable reference voltages & currents generated by the bandgap circuit. The bandgap produces the references for use by the System PLL, SAR, and POR circuits. BG_CAP (1) (2) D12 – ANA_LDOI B13 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 33 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 3-20. Reserved and No Connects Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION Reserved (1) (2) (3) RSV0 C12 I RSV1 J10 PWR RSV2 J11 PWR – ANA_LDOI Reserved. For proper device operation, this pin must be tied directly to VSS. Reserved. For proper device operation, this pin must be tied directly to CVDD. Reserved. For proper device operation, this pin must be tied directly to CVDD. RSV3 D14 I – ANA_LDOI RSV4 C14 I – ANA_LDOI Reserved. For proper device operation, this pin must be tied directly to VSS. RSV5 C13 I – ANA_LDOI Reserved. For proper device operation, this pin must be tied directly to VSS. RSV10 B3 O/Z DVDDEMIF Reserved. (Leave unconnected, do not connect to power or ground). RSV11 A4 O/Z DVDDEMIF Reserved. (Leave unconnected, do not connect to power or ground). RSV12 M3 O/Z DVDDEMIF Reserved. (Leave unconnected, do not connect to power or ground). RSV13 N2 O/Z DVDDEMIF Reseverd. (Leave unconnected, do not connect to power or ground). RSV14 A6 O/Z DVDDEMIF Reserved. (Leave unconnected, do not connect to power or ground). RSV15 B4 O/Z DVDDEMIF Reseverd. (Leave unconnected, do not connect to power or ground). Reserved. For proper device operation, this pin must be tied directly to VSS. I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Table 3-21. Supply Voltage Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION SUPPLY VOLTAGES F6 H8 CVDD J6 PWR 1.05-V Digital Core supply voltage (60 MHz) 1.3-V Digital Core supply voltage (100 MHz) PWR 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/O power supply for non-EMIF and non-RTC I/Os K10 L5 F7 K7 DVDDIO K12 N14 P3 P8 (1) (2) (3) 34 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 3-21. Supply Voltage Terminal Functions (continued) SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION A2 A5 E6 F5 DVDDEMIF G5 PWR 1.8-V, 2.5-V, 2.8-V, or 3.3-V EMIF I/O power supply H5 H7 J5 P2 CVDDRTC C8 PWR 1.05-V thru 1.3-V RTC digital core and RTC oscillator power supply. DVDDRTC F8 PWR 1.8-V, 2.5-V, 2.8-V, or 3.3-V I/O power supply for RTC_CLOCKOUT and WAKEUP pins. VDDA_ANA A10 PWR 1.3-V supply for power management and 10-bit SAR ADC Table 3-22. Ground Terminal Functions SIGNAL NAME NO. TYPE (1) OTHER (2) (3) DESCRIPTION A13 A14 D7 D11 E9 E11 E12 E13 E14 F9 VSS F10 GND Ground pins GND Ground pin for RTC digital core and RTC oscillator power supply. GND Ground pins for power management (POR & Bandgap circuits) and 10-bit SAR ADC G6 G7 H6 J7 J8 J9 K8 K9 K11 K13 (1) (2) (3) VSS_RTC C9 VSSA_ANA B10 VSSA_ANA B14 I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 4.8.1 , Pullup/Pulldown Resistors. Specifies the operating I/O supply voltage for each signal Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 35 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3.6 3.6.1 www.ti.com Device Support Development Support TI offers an extensive line of development tools for the TMS320C55x DSP platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE). The following products support development of TMS320C55x fixed-point DSP-based applications: Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): Version 3.3 or later C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™ Version 5.32.03 or later), which provides the basic run-time target software needed to support any DSP application. Hardware Development Tools: Extended Development System (XDS™) Emulator For a complete listing of development-support tools for the TMS320C55x DSP platform, visit the Texas Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. 36 Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 3.6.2 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Device and Development-Support Tool Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (e.g.,TMX320VC5505ZCH ). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS). Device development evolutionary flow: TMX Experimental device that is not necessarily representative of the final device's electrical specifications. TMP Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification. TMS Fully-qualified production device. Support tool development evolutionary flow: TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing. TMDS Fully qualified development-support product. TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer: "Developmental product is intended for internal evaluation purposes." TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies. Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used. TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZCH), and the temperature range (for example, "Blank" is the commercial temperature range). Figure 3-3 provides a legend for reading the complete device name for any DSP platform member. TMX 320 VC 5505 ( ) ZCH A PREFIX TMX = Experimental device TMS = Qualified device TEMPERATURE RANGE Blank = 0 ° C to 70° C, Commercial Temperature A = –40° C to 85° C, Industrial Temperature DEVICE FAMILY 320 = TMS320™ DSP family PACKAGE TYPE ZCH = 196-pin plastic BGA, with Pb-Free soldered balls [Green] TECHNOLOGY VC = Dual-supply CMOS SILICON REVISION Revision 1.4 DEVICE C55x™ DSP: 5505 5504 Figure 3-3. TMS320VC5505 Device Nomenclature Device Overview Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 37 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 4 Device Configuration 4.1 System Registers The system registers are used to configure the device and monitor its status. Brief descriptions of the various system registers are shown in Table 4-1. Table 4-1. Idle Control, Status, and System Registers 38 CPU WORD ADDRESS ACRONYM 0001h ICR Idle Control Register Idle Status Register Register Description 0002h ISTR 1C00h EBSR 1C02h PCGCR1 Peripheral Clock Gating Control Register 1 1C03h PCGCR2 Peripheral Clock Gating Control Register 2 1C04h PSRCR Peripheral Software Reset Counter Register 1C05h PRCR Peripheral Reset Control Register 1C14h TIAFR Timer Interrupt Aggregation Flag Register 1C16h ODSCR 1C17h PDINHIBR1 Pull-Down Inhibit Register 1 1C18h PDINHIBR2 Pull-Down Inhibit Register 2 1C19h PDINHIBR3 Pull-Down Inhibit Register 3 1C1Ah DMA0CESR1 DMA0 Channel Event Source Register 1 Output Drive Strength Control Register 1C1Bh DMA0CESR2 DMA0 Channel Event Source Register 2 DMA1CESR1 DMA1 Channel Event Source Register 1 1C1Dh DMA1CESR2 DMA1 Channel Event Source Register 2 1C26h ECDR EMIF Clock Divider Register 1C28h RAMSLPMDCNTLR1 RAM Sleep Mode Control Register 1 1C2Eh RAMSLPMDCNTLR2 RAM Sleep Mode Control Register 2 1C30h DMAIFR DMA Interrupt Flag Register 1C31h DMAIER DMA Interrupt Enable Register 1C32h USBSCR USB System Control Register 1C33h ESCR EMIF System Control Register 1C36h DMA2CESR1 DMA2 Channel Event Source Register 1 1C37h DMA2CESR2 DMA2 Channel Event Source Register 2 1C38h DMA3CESR1 DMA3 Channel Event Source Register 1 1C39h DMA3CESR2 DMA3 Channel Event Source Register 2 CLKSTOP 7004h USBLDOCNTL see Section 4.6.1 of this document. External Bus Selection Register 1C1Ch 1C3Ah COMMENTS Peripheral Clock Stop Request/Acknowledge Register USB LDO Control Register Device Configuration [Not Supported] Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 4.2 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Power Considerations The VC5505 provides several means of managing power consumption. To • • • • • • • • • 4.2.1 minimize power consumption, the VC5505 divides its circuits into eight main isolated supply domains: ANA_LDOI (LDO and Bandgap Power Supply) Analog POR and PLL (VDDA_ANA and VDDA_PLL) RTC (CVDD_RTC) Digital Core (CVDD) USB Core (USB_ VDD1P3 and USB_VDDA1P3) USB PHY and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) EMIF I/O (DVDDEMIF) RTC I/O (DVDDRTC) Rest of the I/O (DVDDIO) LDO Configuration The VC5505 includes one Low-Dropout Regulator (LDO) which can be used to regulate the supplies of the analog PLL and SAR ADC. 4.2.1.1 Analog LDO The ANA_LDOI pin (B12) provides the power to the Analog LDO, the bandgap reference generator, and some I/O input pins and can range from 1.8 V to 3.6 V. The Bandgap provides accurate voltage and current references to the POR, LDO, PLL, and SAR; therefore, for proper device operation, power must always be applied to the ANA_LDOI pin. ANA_LDOO is regulated to 1.3 V and can optionally be used to provide up to 3 mA to the VDDA_ANA (Power Management Voltage Supervisor and SAR VDD power inputs) and VDDA_PLL (System PLL power input). 4.3 Clock Considerations The system clock, which is used by the CPU and most of the DSP peripherals, is controlled by the system clock generator. The system clock generator features a software-programmable PLL multiplier and several dividers. The clock generator accepts an input reference clock from the CLKIN pin or the output clock of the 32.768-KHz real-time clock (RTC) oscillator. The selection of the input reference clock is based on the state of the CLK_SEL pin. The CLK_SEL pins is required to be statically tied high or low and cannot change dynamically after reset. In addition, the DSP requires a reference clock for USB applications. The USB reference clock is generated using a dedicated on-chip oscillator with a 12-MHz external crystal connected to the USB_MXI and USB_MXO pins. The USB reference clock is not required if the USB peripheral is not being used. To completely disable the USB oscillator, connect the USB_MXI pin to ground (VSS) and leave the USB_MXO pin unconnected. The USB oscillator power pins (USB_VDDOSC and USB_VSSOSC) should also be connected to ground. The RTC oscillator generates a clock when a 32.768-KHz crystal is connected to the RTC_XI and RTC_XO pins. The 32.768-KHz crystal can be disabled if CLKIN is used as the clock source for the DSP. However, when the RTC oscillator is disabled, the RTC peripheral will not operate and the RTC registers (I/O address range 1900h – 197Fh) will not be accessible. This includes the RTC power management register (RTCPMGT) which controls the RTCLKOUT and WAKEUP pins. To disable the RTC oscillator, connect the RTC_XI pin to CVDDRTC and the RTC_XO pin to ground. For more information on crystal specifications for the RTC oscillator and the USB oscillator, see Section 6.4, External Clock Input From RTC_XI, CLKIN, and USB_MXI Pins. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 39 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 4.3.1 www.ti.com Clock Configurations After Device Reset After reset, the on-chip Bootloader programs the system clock generator based on the input clock selected via the CLK_SEL pin. If CLK_SEL = 0, the Bootloader programs the system clock generator and sets the system clock to 12.288 MHz (multiply the 32.768-kHz RTC oscillator clock by 375). If CLK_SEL = 1, the Bootloader bypasses the system clock generator altogether and the system clock is driven by the CLKIN pin. In this case, the CLKIN frequency is expected to be 11.2896 MHz, 12.0 MHz, or 12.288 MHz. While the bootloader tries to boot from the USB (currently not supported), the clock generator will be programmed to output approximately 36 MHz. 4.3.1.1 Device Clock Frequency After the boot process is complete, the user is allowed to re-program the system clock generator to bring the device up to the desired clock frequency and the desired peripheral clock state (clock gating or not). The user must adhere to various clock requirements when programming the system clock generator. For more information, see Section 6.5, Clock PLLs. Note: The on-chip Bootloader allows for DSP registers to be configured during the boot process. However, this feature must not be used to change the output frequency of the system clock generator during the boot process. Timer0 is also used by the bootloader to allow for 200 ms of BG_CAP settling time. The bootloader register modification feature must not modify the Timer0 registers. 4.3.1.2 Peripheral Clock State The clock and reset state of each of peripheral is controlled through a set of system registers. The peripheral clock gating control registers (PCGCR1 and PCGCR2) are used to enable and disable peripheral clocks. The peripheral software reset counter register (PSRCR) and the peripheral reset control register (PRCR) are used to assert and deassert peripheral reset signals. At hardware reset, all of the peripheral clocks are off to conserve power. After hardware reset, the DSP boots via the bootloader code in ROM. During the boot process, the bootloader queries each peripheral to determine if it can boot from that peripheral. At that time, the individual peripheral clocks will be enabled for the query and then disabled again when the bootloader is finished with the peripheral. By the time the bootloader releases control to the user code, all peripheral clocks will be off and all domains in the ICR, except the CPU domain, will be idled. 4.3.1.3 USB Oscillator Control The USB oscillator is controlled through the USB system control register (USBSCR). To enable the oscillator, the USBOSCDIS and USBOSCBIASDIS bits must be cleared to 0. The user must wait until the USB oscillator stabilizes before proceeding with the USB configuration. The USB oscillator stabilization time is 100 ms, typically with a 10 ms maximum (Note: the startup time is highly dependent on the ESR and capacitive load on the crystal). 40 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 4.4 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Boot Sequence The boot sequence is a process by which the device's memory is loaded with program and data sections from external flash memory, and by which some of the device's internal registers are programmed with predetermined values. The boot sequence is started automatically after each device reset. For more details on device reset, see Section 6.7, Reset. There are several methods by which the memory and register initialization can take place. Each of these methods is referred to as a boot mode. At reset, the device cycles through different boot modes until a valid boot signature is found (see Figure 4-1 ). For more information on the boot modes supported, see Section 4.4.1, Boot Modes. The VC5505 Bootloader follows the following steps as shown in Figure 4-1 1. Immediately after reset, the CPU fetches the reset vector from 0xFFFF00. MP/MC is 0 by default, so 0xFFFF00 is mapped to internal ROM. The PLL is in bypass mode. 2. Set CLKOUT slew rate control to slow slew rate. 3. Idle all peripherals, MPORT and HWA. 4. If CLK_SEL = 0, the Bootloader powers up the PLL and sets its output frequency to 12.288 MHz (with a 375x multiplier using VP = 749, VS = 0, input divider disabled, output divide-by-2 enabled, and output divider enabled with VO = 0). If CLK_SEL = 1, the Bootloader keeps the PLL bypassed. 5. Apply manufacturing trim to the bandgap references. 6. Disable CLKOUT. 7. Set Register Configuration, if present in boot image. 8. Test for NOR boot on all asynchronous CS spaces (EM_CS[2:5]) with 16-bit access: (a) Check the first 2 bytes read from boot signature. (b) If the boot signature is not valid, go to step 9. (c) Attempt NOR boot, go to step 17. 9. Test for NAND boot on all asynchronous CS spaces (EM_CS[2:5]) with 8-bit access: (a) Check the first 2 bytes read from boot table for a boot signature match. (b) If the boot signature is not valid, go to step 10. (c) Attempt NAND boot, go to step 17. 10. Test for SPI EEPROM boot on SPI_CS[0] with 500-KHz clock rate and for Parallel Port Mode on External bus Selection Register set to 5, then set to 6: (a) Check the first 2 bytes read from boot table for a boot signature match. (b) If the boot signature is not valid, go to step 11. (c) Attempt SPI EEPROM boot, go to step 17. 11. Test for I2C EEPROM boot with a 7-bit slave address 0x50 and 400-kHz clock rate. (a) Check the first 2 bytes read from boot table for a boot signature match. (b) If the boot signature is not valid, go to step 12. (c) Attempt I2C EEPROM boot, go to step 17. 12. Test for MMC/SD boot --- MMC/SD boot is not supported. 13. Set the PLL output to approximately 36 MHz. If CLK_SEL = 1, CLKIN multiplied by 3x, ; if CLK_SEL = 0, CLKIN is multiplied by 1125x. 14. Test for UART boot --- UART boot is not supported. 15. Test for USB boot --- USB boot is not supported. 16. If the boot signature is not valid, then go back to step 14 and repeat. 17. Enable TIMER0 to start counting 200 ms. 18. Ensure a minimum of 200 ms has elapsed since step 17 before proceeding to execute the bootloaded code. 19. Jump to the entry point specified in the boot image. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 41 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com CLK SEL = 1 ? No Setup PLL to x375 Yes Internal Configuration NOR Boot ? Yes No NAND Boot ? Yes No 16-bit SPI EEPROM Boot ? No Yes Set Register Configuration I2C Boot ? No MMC/SD0 Boot (Not Supported) ? Yes Copy Boot Image Sections to System Memory Start Timer0 to Count 200 ms UART Boot (Not Supported) ? USB Boot (Not Supported) ? Has Timer0 Counter Expired ? No Yes Jump to Stored Execution Point Figure 4-1. Bootloader Software Architecture 4.4.1 Boot Modes The VC5505 DSP supports the following boot modes in the following device order: NOR Flash, NAND Flash, 16-bit SPI EEPROM, and I2C EEPROM. The boot mode is determined by checking for a valid boot signature on each supported boot device. The first boot device with a valid boot signature will be used to load and execute the user code. If none of the supported boot devices have a valid boot signature, the Bootloader goes into an endless loop checking the unsupported UART and USB boot modes and the device must be reset to look for another valid boot image in the supported boot modes. 4.4.2 Boot Configuration After reset, the on-chip Bootloader programs the system clock generator based on the input clock selected via the CLK_SEL pin. If CLK_SEL = 0, the Bootloader programs the system clock generator and sets the system clock to 12.288 MHz (multiply the 32.768-KHz RTC oscillator clock by 375). If CLK_SEL = 1, the Bootloader bypasses the system clock generator altogether and the system clock is driven by the CLKIN pin. 42 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Note: • When CLK_SEL =1, the CLKIN frequency is expected to be 11.2896 MHz, 12.0 MHz, or 12.288 MHz. • The on-chip Bootloader allows for DSP registers to be configured during the boot process. However, this feature must not be used to change the output frequency of the system clock generator during the boot process. Timer0 is also used by the bootloader to allow for 200 ms of BG_CAP settling time. The bootloader register modification feature must not modify the Timer0 registers. At hardware reset, all of the peripheral clocks are "off" to conserve power. After hardware reset, the DSP boots via the bootloader code in ROM. During the boot process, the bootloader queries each peripheral to determine if it can boot from that peripheral. At that time, the individual peripheral clocks will be enabled for the query and then disabled again when the bootloader is finished with the peripheral. By the time the bootloader releases control to the user code, all peripheral clocks will be "off" and all domains in the ICR, except the CPU domain, will be idled. 4.4.3 DSP Resources Used By the Bootloader The Bootloader uses SARAM block 31 for the storing of temporary data. This block of memory is reserved during the boot process. However, after the boot process is complete, it can be used by the user application. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 43 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 4.5 www.ti.com Configurations at Reset Some device configurations are determined at reset. The following subsections give more details. 4.5.1 Device and Peripheral Configurations at Device Reset Table 4-2 summarizes the device boot and configuration pins that are required to be statically tied high, tied low, or left unconnected during device operation. For proper device operation, a device reset should be initiated after changing any of these pin functions. Table 4-2. Default Functions Affected by Device Configuration Pins CONFIGURATION PINS SIGNAL NO. IPU/IPD FUNCTIONAL DESCRIPTION DSP_LDO_EN D12 – [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to ground (VSS). For future device family pin compatibility, board designs should have this pin layout with a zero-Ω resistor to ANA_LDOI and a zero-Ω resistor to ground. For VC5505 , only the zero-Ω resistor to ground should be populated. DSP_LDO_V D13 – [Not supported on this device. Reserved for compatibility with future devices]. For proper device operation, this pin must be connected to the same supply as the ANA_LDOI pin (B12). For future device family pin compatibility, board designs should have this pin layout with a zero-Ω resistor to ANA_LDOI and a zero-Ω resistor to ground. For VC5505 , only the zero-Ω resistor to ANA_LDOI should be populated. CLK_SEL C7 – Clock input select. 0 = 32-KHz on-chip oscillator drives the RTC timer and the DSP clock generator while CLKIN is ignored. 1 = CLKIN drives the DSP clock generator and the 32-KHz on-chip oscillator drives only the RTC timer. This pin is not allowed to change during device operation; it must be tied high or low at the board. For proper device operation, external pullup/pulldown resistors may be required on these device configuration pins. For discussion situations where external pullup/pulldown resistors are required, see Section 4.8.1, Pullup/Pulldown Resistors. This device also has RESERVED pins that need to be configured correctly for proper device operation (statically tied high, tied low, or left unconnected at all times). For more details on these pins, see Table 3-20, Reserved and No Connects Terminal Functions. 4.6 Configurations After Reset The following sections provide details on configuring the device after reset. Multiplexed pin functions are selected by software after reset. For more details on multiplexed pin function control, see Section 4.7, Multiplexed Pin Configurations. 4.6.1 External Bus Selection Register (EBSR) The External Bus Selection Register (EBSR) determines the mapping of the LCD controller, I2S2, I2S3, UART, SPI, and GPIO signals to 21 signals of the external parallel port pins. It also determines the mapping of the I2S or MMC/SD ports to serial port 1 pins and serial port 2 pins. The EBSR register is located at port address 0x1C00. Once the bit fields of this register are changed, the routing of the signals takes place on the next CPU clock cycle. 44 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Additionally, the EBSR controls the function of the upper bits of the EMIF address bus. Pins EM_A[20:15] can be individually configured as GPIO pins through the Axx_MODE bits. When Axx_MODE = 1, the EM_A[xx] pin functions as a GPIO pin. When Axx_MODE = 0, the EM_A[xx] pin retains its EMIF functionality. Before modifying the values of the external bus selection register, you must clock gate all affected peripherals through the Peripheral Clock Gating Control Register . After the external bus selection register has been modified, you must reset the peripherals before using them through the Peripheral Software Reset Counter Register. After the boot process is complete, the external bus selection register must be modified only once, during device configuration. Continuously switching the EBSR configuration is not supported. 15 14 12 Reserved 11 R-0 6 Reserved R-0 R-0 4 A20_MODE R/W-0 A19_MODE R/W-0 3 R/W-00 2 A18_MODE R/W-0 8 SP0MODE R/W-00 5 Reserved 9 SP1MODE R/W-000 7 10 PPMODE 1 A17_MODE A16_MODE R/W-0 R/W-0 0 A15_MODE R/W-0 LEGEND: R/W = Read/Write; R = Read only; -n = value after reset Figure 4-2. External Bus Selection Register (EBSR) [1C00h] Table 4-3. EBSR Register Bit Descriptions BIT NAME 15 RESERVED 14:12 11:10 DESCRIPTION Reserved. Read-only, writes have no effect. PPMODE Parallel Port Mode Control Bits. These bits control the pin multiplexing of the LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] pins on the parallel port. For more details, see Table 4-4, LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin Multiplexing. 000 = Mode 0 (16-bit LCD Controller). All 21 signals of the LCD Bridge module are routed to the 21 external signals of the parallel port. 001 = Mode 1 (SPI, GPIO, UART, and I2S2). 7 signals of the SPI module, 6 GPIO signals, 4 signals of the UART module and 4 signals of the I2S2 module are routed to the 21 external signals of the parallel port. 010 = Mode 2 (8-bit LCD Controller and GPIO). 8-bits of pixel data of the LCD Controller module and 8 GPIO are routed to the 21 external signals of the parallel port. 011 = Mode 3 (8-bit LCD Controller, SPI, and I2S3). 8-bits of pixel data of the LCD Controller module, 4 signals of the SPI module, and 4 signals of the I2S3 module are routed to the 21 external signals of the parallel port. 100 = Mode 4 (8-bit LCD Controller, I2S2, and UART). 8-bits of pixel data of the LCD Controller module, 4 siignals of the I2S2 module, and 4 signals of the UART module are routed to the 21 external signals of the parallel port. 101 = Mode 5 (8-bit LCD Controller, SPI, and UART). 8-bits of pixel data of the LCD Controller module, 4 signals of the SPI module, and 4 signals of the UART module are routed to the 21 external signals of the parallel port. 110 = Mode 6 (SPI, I2S2, I2S3, and GPIO). 7 signals of the SPI module, 4 signals of the I2S2 module, 4 signals of the I2S3 module, and 6 GPIO are routed to the 21 external signals of the parallel port. 111 = Reserved. SP1MODE Serial Port 1 Mode Control Bits. The bits control the pin multiplexing of the MMC1, I2S1, and GPIO pins on serial port 1. For more details, see Table 4-5, MMC1, I2S1 , and GP[11:6] Pin Multiplexing. 00 = Mode 0 (MMC/SD1 ). All 6 signals of the MMC/SD1 module are routed to the 6 external signals of the serial port 1 . 01 = Mode 1 (I2S1 and GP[11:10]). 4 signals of the I2S1 module and 2 GP[11:10] signals are routed to the 6 external signals of the serial port 1. 10 = Mode 2 (GP[11:6]). 6 GPIO signals (GP[11:6]) are routed to the 6 external signals of the serial port 1. 11 = Reserved. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 45 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 4-3. EBSR Register Bit Descriptions (continued) BIT NAME DESCRIPTION 9:8 SP0MODE Serial Port 0 Mode Control Bits. The bits control the pin multiplexing of the MMC0, I2S0, and GPIO pins on serial port 0. For more details, see Section 4.7.1.3, MMC0, I2S0, and GP[5:0] Pin Multiplexing. 00 = Mode 0 (MMC/SD0). All 6 signals of the MMC/SD0 module are routed to the 6 external signals of the serial port 0. 01 = Mode 1 (I2S0 and GP[5:0]). 4 signals of the I2S0 module and 2 GP[5:4] signals are routed to the 6 external signals of the serial port 0. 10 = Mode 2 (GP[5:0]). 6 GPIO signals (GP[5:0]) are routed to the 6 external signals of the serial port 0. 11 = Reserved. 7 RESERVED Reserved. Read-only, writes have no effect. 6 RESERVED Reserved. Read-only, writes have no effect. 5 A20_MODE A20 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 20 (EM_A[20]) and general-purpose input/output pin 26 (GP[26]) pin functions. 0 = Pin function is EMIF address pin 20 (EM_A[20]). 1 = Pin function is general-purpose input/output pin 26 (GP[26]). 4 A19_MODE A19 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 19 (EM_A[19]) and general-purpose input/output pin 25 (GP[25]) pin functions. 0 = Pin function is EMIF address pin 19 (EM_A[19]). 1 = Pin function is general-purpose input/output pin 25 (GP[25]). 3 A18_MODE A18 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 18 (EM_A[18]) and general-purpose input/output pin 24 (GP[24]) pin functions. 0 = Pin function is EMIF address pin 18 (EM_A[18]). 1 = Pin function is general-purpose input/output pin 24 (GP[24]). A17_MODE A17 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 17 (EM_A[17]) and general-purpose input/output pin 23 (GP[23]) pin functions. For more details, see Table 4-6, EM_A[20:16] and GP[26:21] Pin Multiplexing. 0 = Pin function is EMIF address pin 17 (EM_A[17]). 1 = Pin function is general-purpose input/output pin 23 (GP[23]). A16_MODE A16 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 16 (EM_A[16]) and general-purpose input/output pin 22 (GP[22]) pin functions. For more details, see Table 4-6, EM_A[20:16] and GP[26:21] Pin Multiplexing. 0 = Pin function is EMIF address pin 16 (EM_A[16]). 1 = Pin function is general-purpose input/output pin 22 (GP[22]). A15_MODE A15 Pin Mode Bit. This bit controls the pin mulitplexing of the EMIF address 15 (EM_A[15]) and general-purpose input/output pin 21 (GP[21]) pin functions. For more details, see Table 4-6, EM_A[20:16] and GP[26:21] Pin Multiplexing. 0 = Pin function is EMIF address pin 15 (EM_A[15]). 1 = Pin function is general-purpose input/output pin 21 (GP[21]). 2 1 0 4.6.2 EMIF and USB System Control Registers (ESCR and USBSCR) [1C33h and 1C32h] After reset, by default, the CPU performs 16-bit accesses to the EMIF and USB registers and data space. To perform 8-bit accesses to the EMIF data space, the user must set the BYTEMODE bits to 01b for the "high byte" or 10b for the "low byte" in the EMIF System Control Register (ESCR). Similarly, the BYTEMODE bits in the USB System Control Register (USBSCR) must also be configured for byte access. 4.6.3 Peripheral Clock Gating Control Registers (PCGCR1 and PCGCR2) [1C02h and 1C03h] After hardware reset, all of the peripheral clocks are "off" to conserve power. Then, the DSP executes the on-chip bootloader from ROM. As the bootloader executes, it selectively enables the clock of the peripheral being queried for a valid boot. If a valid boot source is not found, the bootloader disables the clock to that peripheral and moves on to the next peripheral in the boot order. After the boot process is complete, the peripheral clocks will be off and all domains in the ICR, except the CPU domain, will be idled (this includes the MPORT and HWA). The user must enable the clocks to the peripherals and CPU ports that are going to be used. The peripheral clock gating control registers (PCGCR1 and PCGCR2) are used to enable and disable the peripheral clocks. 46 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 4.6.4 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Pull-up/Pull-down Inhibit Registers (PDINHIBR1/2/3) [1C17h, 1C18h, and 1C19h, respectively] Each internal pullup and pulldown (IPU/IPD) resistor on the VC5505 DSP, except for the IPD on TRST, can be individually controlled through the IPU/IPD registers (PDINHIBR1 [1C17h] , PDINHIBR2 [1C18h], and PDINHIBR3 [1C19h]). To minimize power consumption, internal pullup or pulldown resistors should be disabled in the presence of an external pullup or pulldown resistor or external driver. Section 4.8.1, Pullup/Pulldown Resistors, describes other situations in which an pullup and pulldown resistors are required. 4.6.5 Output Slew Rate Control Register (OSRCR) [1C16h] To provide the lowest power consumption setting, the DSP has configurable slew rate control on the EMIF and CLKOUT output pins. The output slew rate control register (OSRCR) is used to set a subset of the device I/O pins to either fast or slow slew rate. The slew rate feature is implemented by staging/delaying turn-on times of the parallel p-channel drive transistors and parallel n-channel drive transistors of the output buffer. In the slow slew rate configuration, the delay is longer, but ultimately the same number of parallel transistors are used to drive the output high or low. Thus, the drive strength is ultimately the same strength. The slower slew rate control can be used for power savings and has the greatest effect at lower VDD_IO voltages. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 47 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 4.7 www.ti.com Multiplexed Pin Configurations The VC5505 DSP uses pin multiplexing to accommodate a larger number of peripheral functions in the smallest possible package, providing the ultimate flexibility for end applications. The external bus selection register (EBSR) controls all the pin multiplexing functions on the device. 4.7.1 Pin Multiplexing Details This section discusses how to program the external bus selection register (EBSR) to select the desired peripheral functions and pin muxing. See the individual pin mux sections for pin muxing details for a specific muxed pin. After changing any of the pin mux control registers, it will be necessary to reset the peripherals that are affected. 4.7.1.1 LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin Multiplexing [EBSR.PPMODE Bits] The LCD Controller, SPI, UART, I2S2, I2S3, and GPIO signal muxing is determined by the value of the PPMODE bit fields in the External Bus Selection Register (EBSR) register. For more details on the actual pin functions, see Table 4-4 . 48 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 4-4. LCD Controller, SPI, UART, I2S2, I2S3, and GP[31:27, 20:18] Pin Multiplexing PDINHIBR3 REGISTER BIT FIELDS (1) EBSR PPMODE BITS PIN MUX SIGNAL NAME LCD_EN_RDB/SPI_CLK MODE 1 MODE 2 MODE 3 MODE 4 MODE 5 MODE 6 000 001 010 011 100 101 110 LCD_EN_RDB SPI_CLK LCD_EN_RDB LCD_EN_RDB LCD_EN_RDB LCD_EN_RDB SPI_CLK LCD_D[0]/SPI_RX LCD_D[0] SPI_RX LCD_D[0] LCD_D[0] LCD_D[0] LCD_D[0] SPI_RX LCD_D[1]/SPI_TX LCD_D[1] SPI_TX LCD_D[1] LCD_D[1] LCD_D[1] LCD_D[1] SPI_TX P2PD LCD_D[2]/GP[12] LCD_D[2] GP[12] LCD_D[2] LCD_D[2] LCD_D[2] LCD_D[2] GP[12] P3PD LCD_D[3]/GP[13] LCD_D[3] GP[13] LCD_D[3] LCD_D[3] LCD_D[3] LCD_D[3] GP[13] P4PD LCD_D[4]/GP[14] LCD_D[4] GP[14] LCD_D[4] LCD_D[4] LCD_D[4] LCD_D[4] GP[14] P5PD LCD_D[5]/GP[15] LCD_D[5] GP[15] LCD_D[5] LCD_D[5] LCD_D[5] LCD_D[5] GP[15] P6PD LCD_D[6]/GP[16] LCD_D[6] GP[16] LCD_D[6] LCD_D[6] LCD_D[6] LCD_D[6] GP[16] P7PD LCD_D[7]/GP[17] LCD_D[7] GP[17] LCD_D[7] LCD_D[7] LCD_D[7] LCD_D[7] GP[17] P8PD LCD_D[8]/I2S2_CLK/GP[18]/SPI_CLK LCD_D[8] I2S2_CLK GP[18] SPI_CLK I2S2_CLK SPI_CLK I2S2_CLK P9PD LCD_D[9]/I2S2_FS/GP[19]/SPI_CS0 LCD_D[9] I2S2_FS GP[19] SPI_CS0 I2S2_FS SPI_CS0 I2S2_FS P10PD LCD_D[10]/I2S2_RX/GP[20]/SPI_RX LCD_D[10] I2S2_RX GP[20] SPI_RX I2S2_RX SPI_RX I2S2_RX P11PD LCD_D[11]/I2S2_DX/GP[27]/SPI_TX LCD_D[11] I2S2_DX GP[27] SPI_TX I2S2_DX SPI_TX I2S2_DX P12PD LCD_D[12]/UART_RTS/GP[28]/I2S3_CLK LCD_D[12] UART_RTS GP[28] I2S3_CLK UART_RTS UART_RTS I2S3_CLK P13PD LCD_D[13]/UART_CTS/GP[29]/I2S3_FS LCD_D[13] UART_CTS GP[29] I2S3_FS UART_CTS UART_CTS I2S3_FS P14PD LCD_D[14]/UART_RXD/GP[30]/I2S3_RX LCD_D[14] UART_RXD GP[30] I2S3_RX UART_RXD UART_RXD I2S3_RX P15PD LCD_D[15]/UART_TXD/GP[31]/I2S3_DX LCD_D[15] UART_TXD GP[31] I2S3_DX UART_TXD UART_TXD I2S3_DX LCD_CS0_E0/SPI_CS0 LCD_CS0_E0 SPI_CS0 LCD_CS0_E0 LCD_CS0_E0 LCD_CS0_E0 LCD_CS0_E0 SPI_CS0 LCD_CS1_E1/SPI_CS1 LCD_CS1_E1 SPI_CS1 LCD_CS1_E1 LCD_CS1_E1 LCD_CS1_E1 LCD_CS1_E1 SPI_CS1 LCD_RW_WRB SPI_CS2 LCD_RW_WRB LCD_RW_WRB LCD_RW_WRB LCD_RW_WRB SPI_CS2 LCD_RS SPI_CS3 LCD_RS LCD_RS LCD_RS LCD_RS SPI_CS3 LCD_RW_WRB/SPI_CS2 LCD_RS/SPI_CS3 (1) MODE 0 The pin mux signals names with PDINHIBR3 register bit field references can have the pulldown resister enabled or disabled via this register. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 49 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 4.7.1.2 www.ti.com MMC1, I2S1, and GP[11:6] Pin Multiplexing [EBSR.SP1MODE Bits] The MMC1, I2S1, and GPIO signal muxing is determined by the value of the SP1MODE bit fields in the External Bus Selection Register (EBSR) register. For more details on the actual pin functions, see Table 4-5. Table 4-5. MMC1, I2S1, and GP[11:6] Pin Multiplexing EBSR SP1MODE BITS PDINHIBR1 REGISTER BIT FIELDS (1) (1) 50 PIN MUX SIGNAL NAME MODE 0 MODE 1 MODE 2 00 01 10 S10PD MMC1_CLK/I2S1_CLK/GP[6] MMC1_CLK I2S1_CLK GP[6] S11PD MMC1_CMD/I2S1_FS/GP[7] MMC1_CMD I2S1_FS GP[7] S12PD MMC1_D0/I2S1_DX/GP[8] MMC1_D0 I2S1_DX GP[8] S13PD MMC1_D1/I2S1_RX/GP[9] MMC1_D1 I2S1_RX GP[9] S14PD MMC1_D2/GP[10] MMC1_D2 GP[10] GP[10] S15PD MMC1_D3/GP[11] MMC1_D3 GP[11] GP[11] The pin mux signals names with PDINHIBR1 register bit field references can have the pulldown register enabled or disabled via this register. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 4.7.1.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 MMC0, I2S0, and GP[5:0] Pin Multiplexing [EBSR.SP0MODE Bits] The MMC0, I2S0, and GPIO signal muxing is determined by the value of the SP0MODE bit fields in the External Bus Selection Register (EBSR) register. For more details on the actual pin functions, see Table 4-6. Table 4-6. MMC0, I2S0, and GP[5:0] Pin Multiplexing PDINHIBR1 REGISTER BIT FIELDS (1) (1) EBSR SP0MODE BITS PIN MUX SIGNAL NAME MODE 0 MODE 1 MODE 2 00 01 10 S00PD MMC0_CLK/I2S0_CLK/GP[0] MMC0_CLK I2S0_CLK GP[0] S01PD MMC0_CMD/I2S0_FS/GP[1] MMC0_CMD I2S0_FS GP[1] S02PD MMC0_D0/I2S0_DX/GP[2] MMC0_D0 I2S0_DX GP[2] S03PD MMC0_D1/I2S0_RX/GP[3] MMC0_D1 I2S0_RX GP[3] S04PD MMC0_D2/GP[4] MMC0_D2 GP[4] GP[4] S05PD MMC0_D3/GP[5] MMC0_D3 GP[5] GP[5] The pin mux signals names with PDINHIBR1 register bit field references can have the pulldown register enabled or disabled via this register. 4.7.1.4 EMIF EM_A[20:15] and GP[26:21] Pin Multiplexing [EBSR.Axx_MODE bits] The EMIF Address and GPIO signal muxing is determined by the value of the A20_MODE, A19_MODE, A18_MODE, A17_MODE, A16_MODE, and A15_MODE bit fields in the External Bus Selection Register (EBSR) register. For more details on the actual pin functions, see Table 4-7. Table 4-7. EM_A[20:16] and GP[26:21] Pin Multiplexing PIN MUX SIGNAL NAME Axx_MODE BIT 0 1 EM_A[15]/GP[21] EM_A[15] GP[21] EM_A[16]/GP[22] EM_A[16] GP[22] EM_A[17]/GP[23] EM_A[17] GP[23] EM_A[18]/GP[24] EM_A[18] GP[24] EM_A[19]/GP[25] EM_A[19] GP[25] EM_A[20]/GP[26] EM_A[20] GP[26] 4.8 4.8.1 Debugging Considerations Pullup/Pulldown Resistors Proper board design should ensure that input pins to the VC5505 DSP always be at a valid logic level and not floating. This may be achieved via pullup/pulldown resistors. The DSP features internal pullup (IPU) and internal pulldown (IPD) resistors on many (all GPIO) pins to eliminate the need, unless otherwise noted, for external pullup/pulldown resistors. An external pullup/pulldown resistor needs to be used in the following situations: • Configuration Pins: An external pullup/pulldown resistor is recommended to set the desired value/state (see the configuration pins listed in Table 4-2, Default Functions Affected by Device Configuration Pins). Note that some configuration pins must connected directly to ground or to a specific supply voltage. • Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external pullup/pulldown resistor to pull the signal to the opposite rail. Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 51 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com For the configuration pins (listed in Table 4-2, Default Functions Affected by Device Configuration Pins), if they are both routed out and 3-stated (not driven), it is strongly recommended that an external pullup/pulldown resistor be implemented. In addition, applying external pullup/pulldown resistors on the configuration pins adds convenience to the user in debugging and flexibility in switching operating modes. When an external pullup or pulldown resistor is used on a pin, the pin’s internal pullup or pulldown resistor should be disabled through the Pull-up/Pull-down Inhibit Registers (PDINHIBR1/2/3) [1C17h, 1C18h, and 1C19h, respectively] to minimize power consumption. Tips for choosing an external pullup/pulldown resistor: • Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure to include the leakage currents of all the devices connected to the net, as well as any internal pullup or pulldown (IPU/IPD) resistors. • Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of the limiting device; which, by definition, have margin to the VIL and VIH levels. • Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net will reach the target pulled value when maximum current from all devices on the net is flowing through the resistor. The current to be considered includes leakage current plus, any other internal and external pullup/pulldown resistors on the net. • For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance value of the external resistor. Verify that the resistance is small enough that the weakest output buffer can drive the net to the opposite logic level (including margin). • Remember to include tolerances when selecting the resistor value. • For pullup resistors, also remember to include tolerances on the DVDD rail. For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria. Users should confirm this resistor value is correct for their specific application. For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the configuration pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific application. For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for the VC5505 DSP, see Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature. For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal functions table in this document. 4.8.2 CLKOUT Pin For debug purposes, the DSP includes a CLKOUT pin which can be used to tap different clocks within the clock generator. The SRC bits of the CLKOUT Control Source Register (CCSSR) can be used to specify the source for the CLKOUT pin. Note: the bootloader disables the CLKOUT pin via CLKOFF bit in the ST3_55 CPU register. For more information on the ST3_55 CPU register, see the TMS320C55x 3.0 CPU Reference Guide (literature number: SWPU073). 52 Device Configuration Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 5 Device Operating Conditions 5.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless Otherwise Noted) (1) Supply voltage ranges: Input and Output voltage ranges: Operating case temperature ranges, Tc: Digital Core (CVDD, CVDDRTC, USB_VDD1P3) (2) –0.5 V to 1.7 V I/O, 1.8 V, 2.5 V, 2.8 V, 3.3 V (DVDDIO, DVDDEMIF, DVDDRTC) 3.3V USB supplies USB PHY (USB_VDDOSC, USB_VDDPLL, USB_VDDA3P3) (2) –0.5 V to 4.2 V ANA_LDOI –0.5 V to 4.2 V Analog, 1.3 V (VDDA_PLL, USB_VDDA1P3, VDDA_ANA) (2) –0.5 V to 1.7 V VI I/O, All pins with DVDDIO or DVDDEMIF or USB_VDDOSC or USB_VDDPLLor USB_VDDA3P3 as supply source –0.5 V to 4.2 V VO I/O, All pins with DVDDIO or DVDDEMIF or USB_VDDOSCor USB_VDDPLLor USB_VDDA3P3 as supply source –0.5 V to 4.2 V RTC_XI and RTC_XO –0.5 V to 1.7 V VI and VO, GPAIN[0] –0.5 V to 4.2 V VI and VO, GPAIN[3:1] –0.5 V to 1.7 V VO, BG_CAP –0.5 V to 1.7 V ANA_LDOO –0.5 V to 1.7 V Commercial Temperature (default) Industrial Temperature 0°C to 70°C -40°C to 85°C Storage temperature range, Tstg (default) Device Operating Life Power-On Hours (POH) Commercial Temperature (3) 100, 000 POH Industrial Temperature (3) 100, 000 POH (1) (2) (3) –65°C to 150°C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS. For devices running with CVDD = 1.3 V @ 100 MHz for commercial temperature, the Device Operating Life Power-On Hours are 70, 000 POH of the total POH . For devices running with CVDD = 1.3 V @ 100 MHz for industrial temperature, the Device Operating Life Power-On Hours are 17, 000 POH of the total POH. Device Operating Conditions Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 53 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 5.2 www.ti.com Recommended Operating Conditions CVDD NOM MAX UNIT 0.998 1.05 1.15 V 100 MHz 1.24 1.3 1.43 V 1.43 V CVDD Supply voltage, Digital Core CVDDRTC Supply voltage, RTC and RTC OSC USB_VDD1P3 Supply voltage, Digital USB 1.24 1.3 1.43 V USB_VDDA1P3 Supply voltage, 1.3 V Analog USB 1.24 1.3 1.43 V VDDA_ANA Supply voltage, 1.3 V SAR and Pwr Mgmt 1.24 1.3 1.43 V VDDA_PLL Supply voltage, 1.3 V System PLL 1.24 1.3 1.43 V USB_VDDPLL Supply voltage, 3.3 V USB PLL 2.97 3.3 3.63 V Supply voltage, I/O, 3.3 V 2.97 3.3 3.63 V Supply voltage, I/O, 2.8 V 2.52 2.8 3.08 V Supply voltage, I/O, 2.5 V 2.25 2.5 2.75 V Supply voltage, I/O, 1.8 V 1.65 1.8 1.98 V USB_VDDOSC Supply voltage, I/O, 3.3 V USB OSC 2.97 3.3 3.63 V USB_VDDA3P3 Supply voltage, I/O, 3.3 V Analog USB PHY 2.97 3.3 3.63 V ANA_LDOI Supply voltage, Analog Pwr Mgmt and LDO Input 3.6 V VSS Supply ground, Digital I/O VSSRTC Supply ground, RTC USB_VSSOSC Supply ground, USB OSC USB_VSSPLL Supply ground, USB PLL USB_VSSA3P3 Supply ground, 3.3 V Analog USB PHY USB_VSSA1P3 Supply ground, USB 1.3 V Analog USB PHY 0 V USB_VSSREF Supply ground, USB Reference Current VSSA_PLL Supply ground, System PLL USB_VSS1P3 Supply ground, 1.3 V Digital USB PHY VSSA_ANA Supply ground, SAR and Pwr Mgmt DVDDIO DVDDEMIF DVDDRTC DVDD VSS MIN 60 MHz 32.768 KHz 0.998 1.8 0 0 VIH (1) High-level input voltage, 3.3, 2.8, 2.5, 1.8 V I/O (except GPAIN[3:0] pins) (2) 0.7 * DVDD DVDD + 0.3 V VIL (1) Low-level input voltage, 3.3, 2.8, 2.5, 1.8 V I/O (except GPAIN[3:0] pins) (2) -0.3 0.3 * DVDD V (3) -0.3 3.6 V -0.3 VDDA_ANA + 0.3 V 0 70 °C Input voltage, GPAIN0 pin VIN Input voltage, GPAIN[3:1] pins Tc Operating case temperature Default (Commercial) (Industrial) FSYSCLK1 (1) (2) (3) 54 DSP Operating Frequency (SYSCLK1) -40 85 °C 1.05 V 0 60 MHz 1.3 V 0 100 MHz DVDD refers to the pin I/O supply voltage. To determine the I/O supply voltage for each pin, see Section 3.5 , Terminal Functions. The I2C pin SDA and SCL do not feature fail-safe I/O buffers. These pin could polentially draw current when the device is powered down. Dues to the fact that different voltage devices can be connected to I2C bus, the level of logic 0 (low) and logic 1 (high) are not fixed and depends on the associated DVDD. The GNDON bit in the SARPINCTRL register should be set to "1" before SAR channels 0, 1, or 2 are enabled via the CHSEL bit in the SARCTRL register, when VIN greater than VDDA_ANA. Device Operating Conditions Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 5.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted) PARAMETER VOH VOL VHYS TEST CONDITIONS (1) High speed: USB_DN and USB_DP (2) 360 440 V High-level output voltage, GPAIN[3:1] pins IO = IOH 0.8 * VDDA_ANA V Full speed: USB_DN and USB_DP (2) 0.0 0.3 V High speed: USB_DN and USB_DP (2) –10 10 mV Low-level output voltage, 3.3, 2.8, 2.5, 1.8V I/O (except I2C and GPAIN[3:0] pins) IO = IOL Low-level output voltage, I2C pins (3) VDD > 2 V, IO L = 3 mA Low-level output voltage, GPAIN[3:0] pins IO = IOL (4) IILPU Input current [DC] (except WAKEUP, I2C, and GPAIN[3:0] pins) 0 Input current [DC], ALL pins V 0.2 * VDDA_ANA V DVDD = 2.5 V 141 mV DVDD = 1.8 V 122 1.24 ANA_LDOI = VMIN 1.3 mV 1.43 3 V mA -5 +5 mA DVDD = 3.3 V with internal pullup enabled (7) -59 to -161 mA DVDD = 2.5 V with internal pullup enabled (7) -31 to -93 mA DVDD = 1.8 V with internal pullup enabled (7) -14 to -44 -5 mA +5 mA DVDD = 3.3 V with internal pulldown enabled (7) 52 to 158 mA DVDD = 2.5 V with internal pulldown enabled (7) 27 to 83 mA DVDD = 1.8 V with internal pulldown enabled (7) 11 to 35 mA VI = VSS to DVDD with internal pullups and pulldowns disabled. -5 All Pins (except USB, EMIF, CLKOUT, and GPAIN[3:0] pins) -4 mA DVDD = 3.3 V -6 mA DVDD = 1.8 V -5 mA DVDD = 3.3 V -6 mA DVDD = 1.8 V -4 mA DVDD = VDDA_ANA = 1.3 V, External Regulator (8) -4 mA DVDD = VDDA_ANA = 1.3 V, Internal Regulator (8) -100 mA CLKOUT pin GPAIN[3:1] pins (GPAIN0 is open-drain and cannot drive high) (7) (8) 0.4 mV EMIF pins High-level output current [DC] V 162 Input only pin, internal pulldown or pullup disabled Input current [DC] (except WAKEUP, I2C, and GPAIN[3:0] pins 0.2 * DVDD DVDD = 3.3 V Input only pin, internal pulldown or pullup disabled (1) (2) (3) (4) (5) (6) mV 0.8 * DVDD ANA_LDO shutdown current (5) IOH V IO = IOH ISD IIH/ IIL UNIT High-level output voltage, 3.3, 2.8, 2.5, 1.8 V I/O (except GPAIN[3:0] pins) ANA_LDOO voltage (6) MAX USB_VDDA3P3 VLDO IIHPD TYP 2.8 Input hysteresis (6) MIN Full speed: USB_DN and USB_DP (2) +5 mA For test conditions shown as MIN, MAX, or TYP, use the appropriate value specified in the recommended operating conditions table. The USB I/Os adhere to the Universal Bus Specification Revision 2.0 (USB2.0 spec). VDD is the voltage to which the I2C bus pullup resistors are connected. Applies to all input pins except WAKEUP, I2C pins, GPAIN[3:0], RTC_XI, and USB_MXI. ISD is the amount of current the LDO is ensured to deliver before shutting down to protect itself. II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II indicates the input leakage current and off-state (Hi-Z) output leakage current. Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor. When the ANA_LDO supplies VDDA_ANA, it is not recommended to use the GPAIN[3:1] signals for general-purpose outputs (driving high). The ISD parameter of the ANA_LDO is too low to drive any realistic load on the GPAIN[3:1] pins while also supplying the PLL through VDDA_PLL and the SAR through VDDA_ANA. Device Operating Conditions Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 55 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted) (continued) PARAMETER TEST CONDITIONS (1) MIN TYP All Pins (except USB, EMIF, CLKOUT, and GPAIN[3:0] pins) EMIF pins IOL Low-level output current [DC] CLKOUT pin GPAIN[3:0] IOZ (9) I/O Off-state output current MAX UNIT +4 mA DVDD = 3.3 V +6 mA DVDD = 1.8 V +5 mA DVDD = 3.3 V +6 mA DVDD = 1.8 V +4 mA DVDD = VDDA_ANA = 1.3 V, external regulator +4 mA DVDD = VDDA_ANA = 1.3 V, internal regulator (8) +4 mA All Pins (except USB and GPAIN[3:0]) -10 +10 mA GPAIN[3:0] pins -10 +10 mA Active, CVDD = 1.3 V, DSP clock = 100 MHz Room Temp (25 °C), 75% DMAC + 25% ADD (typical sine wave data switching) 0.22 mW/MHz Active, CVDD = 1.05 V, DSP clock = 60 MHz Room Temp (25 °C), 75% DMAC + 25% ADD (typical data switching) 0.15 mW/MHz Active, CVDD = 1.3 V, DSP clock = 100 MHz Room Temp (25 °C), 75% DMAC + 25% NOP (typical sine wave data switching) 0.22 mW/MHz Active, CVDD = 1.05 V, DSP clock = 60 MHz Room Temp (25 °C), 75% DMAC + 25% NOP (typical data switching) 0.14 mW/MHz Active, CVDD = 1.3 V, DSP clock = 100 MHz Room Temp (25 °C), Hardware FFT Accelerator 1024-pt FFT, ROM execution 0.31 mW/MHz Active, CVDD = 1.05 V, DSP clock = 60 MHz Room Temp (25 °C), Hardware FFT Accelerator 1024-pt FFT, ROM execution 0.25 mW/MHz Standby, CVDD = 1.3 V, Master clock disabled, Room Temp (25 °C), DARAM and SARAM in active mode 0.44 mW Standby, CVDD = 1.05 V, Master clock disabled, Room Temp (25 °C), DARAM and SARAM in active mode 0.26 mW Standby, CVDD = 1.3 V, Master clock disabled, Room Temp (25 °C), DARAM in retention and SARAM in active mode 0.40 mW Standby, CVDD = 1.05 V, Master clock disabled, Room Temp (25 °C), DARAM in retention and SARAM in active mode 0.23 mW Standby, CVDD = 1.3 V, Master clock disabled, Room Temp (25 °C), DARAM in active mode and SARAM in retention 0.28 mW Standby, CVDD = 1.05 V, Master clock disabled, Room Temp (25 °C), DARAM in active mode and SARAM in retention 0.15 mW Analog PLL (VDDA_PLL) supply current VDDA_PLL = 1.37 V Room Temp (25 °C), Phase detector = 170 kHz, VCO = 120 MHz 0.7 SAR Analog (VDDA_ANA) supply current VDDA_ANA = 1.37 V, SAR clock = 2 MHz, Temp (70 °C) Core (CVDD) supply current ICDD 1.2 mA 1 mA CI Input capacitance 4 pF Co Output capacitance 4 pF (9) 56 IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current. Device Operating Conditions Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6 Peripheral Information and Electrical Specifications 6.1 Parameter Information Tester Pin Electronics 42 Ω Data Sheet Timing Reference Point 3.5 nH Output Under Test Transmission Line Z0 = 50 Ω (see Note) 4.0 pF Device Pin (see Note) 1.85 pF NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings. Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin. Figure 6-1. 3.3-V Test Load Circuit for AC Timing Measurements The load capacitance value stated is only for characterization and measurement of AC timing signals. This load capacitance value does not indicate the maximum load the device is capable of driving. 6.1.1 1.8-V, 2.5-V, 2.8-V, and 3.3-V Signal Transition Levels All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks, VOL MAX and VOH MIN for output clocks. Vref = VIH MIN (or VOH MIN) Vref = VIL MAX (or VOL MAX) Figure 6-2. Rise and Fall Transition Time Voltage Reference Levels 6.1.2 3.3-V Signal Transition Rates All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns). 6.1.3 Timing Parameters and Board Routing Analysis The timing parameter values specified in this data manual do not include delays by board routings. As a good board design practice, such delays must always be taken into account. Timing values may be adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing Analysis application report (literature number SPRA839). If needed, external logic hardware such as buffers may be used to compensate any timing differences. 6.2 Recommended Clock and Control Signal Transition Behavior All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic manner. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 57 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.3 www.ti.com Power Supplies The VC5505 includes four core voltag-level supplies (CVDD, CVDDRTC, USB_VDD1P3, USB_VDDA1P3), and several I/O supplies (DVDDIO, DVDDEMIF, DVDDRTC, USB_VDDOSC, and USB_VDDA3P3), as well as several analog supplies (ANA_LDOI, VDDA_PLL, VDDA_ANA, and USB_VDDPLL). To ensure proper device operation, a specific power-up sequence must be followed. Some TI power-supply devices include features that facilitate power sequencing—for example, Auto-Track and Slow-Start/Enable features. For more information regarding TI's power management products and suggested devices to power TI DSPs, visit www.ti.com/processorpower. 6.3.1 Power-Supply Sequencing The VC5505 includes four core voltage-level supplies (CVDD, CVDDRTC, USB_VDD1P3, USB_VDDA1P3), and several I/O supplies including—DVDDIO, DVDDEMIF, DVDDRTC, USB_VDDOSC, and USB_VDDA3P3 For proper device operation, the general power-up sequence requirements can be summarized as ANA_LDOI and all core-level supplies must come up first, followed by the I/O level supplies. Specifically, the power-up sequence requirement is: 1. Apply power to the ANA_LDOI, CVDDRTC, CVDD, USB_VDD1P3, USB_VDDA1P3, VDDA_ANA, and VDDA_PLL. Note: the Analog LDO output (ANA_LDOO) can be used to power the VDDA_ANA, and VDDA_PLL supplies. 2. Apply power to I/Os: DVDDIO, DVDDEMIF, DVDDRTC, USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL. Core supplies must be powered before I/O supplies. If the I/O supplies are powered before the core supply, the core signals controlling bi-directional I/Os are in an "undetermined state" and can set some of the bi-directional I/Os to drive against an external device, causing bus contention. Therefore, the I/O Supplies (DVDDIO, DVDDEMIF, DVDDRTC, USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) should not ramp above 1.65 V before core supplies (CVDDRTC, CVDD, USB_VDD1P3, USB_VDDA1P3) reach 0.9 V. If the USB subsystem is not used, the USB Core (USB_VDD1P3, USB_VDDA1P3) and USB PHY and I/O level supplies (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) can be powered on and off anytime after this sequence. When powering on these supplies, the USB PHY, USB oscillator, and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) should not ramp above 1.65 V before the USB Core (USB_VDD1P3, USB_VDDA1P3) reaches 0.9 V. When powering off these supplies, the USB Core (USB_VDD1P3, USB_VDDA1P3) should not drop below 0.9 V before the USB PHY, USB oscillator, and USB PLL (USB_VDDOSC, USB_VDDA3P3, and USB_VDDPLL) drop below 1.65 V. 6.3.2 Power-Supply Design Considerations Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize inductance and resistance in the power delivery path. Additionally, when designing for high-performance applications utilizing the VC5505 device, the PC board should include separate power planes for core, I/O, VDDA_ANA and VDDA_PLL (which can share the same PCB power plane), and ground; all bypassed with high-quality low-ESL/ESR capacitors. 6.3.3 Power-Supply Decoupling In order to properly decouple the supply planes from system noise, place capacitors (caps) as close as possible to the VC5505 . These caps need to be no more than 1.25 cm maximum distance from the VC5505 power pins to be effective. Physically smaller caps, such as 0402, are better but need to be evaluated from a yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling capacitors, therefore physically smaller capacitors should be used while maintaining the largest available capacitance value. Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order of 10 mF) should be furthest away, but still as close as possible. Large caps for each supply should be placed outside of the BGA footprint. 58 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 As with the selection of any component, verification of capacitor availability over the product's production lifetime should be considered. On the VC5505 the recommended decoupling capacitance for the DSP core supplies should be 1 mF in parallel with 0.01-mF capacitor per supply pin. 6.3.4 LDO Input Decoupling The LDO inputs should follow the same decoupling guidelines as other power-supply pins above. 6.3.5 LDO Output Decoupling The LDO circuits implement a voltage feedback control system which has been designed to optimize gain and stability tradeoffs. As such, there are design assumptions for the amount of capacitance on the LDO outputs. For proper device operation, the following external decoupling capacitors should be used: • ANA_LDOO– 1mF • DSP_LDOO – 1mF • USB_LDOO – none required 6.4 External Clock Input From RTC_XI, CLKIN, and USB_MXI Pins The VC5505 DSP includes two options to provide an external clock input to the system clock generator: • Use the on-chip real-time clock (RTC) oscillator with an external 32.768-kHz crystal connected to the RTC_XI and RTC_XO pins. • Use an external 11.2896-, 12.0-, or 12.288-MHz LVCMOS clock input fed into the CLKIN pin that operates at the same voltage as the DVDDIO supply (1.8-, 2.5-, 2.8-, or 3.3-V). The CLK_SEL pin determines which input is used as the clock source for the system clock generator, For more details, see Section 4.5.1, Device and Peripheral Configurations at Device Reset. The crystal for the RTC oscillator is not required if CLKIN is used as the system reference clock; however, the RTC must still be powered. The RTC registers starting at I/O address 1900h will not be accessible without an RTC clock. This includes the RTC Power Management Register which provides control to the on-chip LDOs and WAKEUP and RTC_CLKOUT pins. Section 6.4.1, Real-Time Clock (RTC) On-Chip Oscillator With External Crystal provides more details on using the RTC on-chip oscillator with an external crystal. Section 6.4.2, CLKIN Pin With LVCMOS-Compatible Clock Input provides details on using an external LVCMOS-compatible clock input fed into the CLKIN pin. Additionally, the USB requires a reference clock generated using a dedicated on-chip oscillator with a 12-MHz external crystal connected to the USB_MXI and USB_MXO pins. The USB reference clock is not required if the USB peripheral is not being used. Section 6.4.3, USB On-Chip Oscillator With External Crystal provides details on using the USB on-chip oscillator with an external crystal. 6.4.1 Real-Time Clock (RTC) On-Chip Oscillator With External Crystal The on-chip oscillator requires an external 32.768-kHz crystal connected across the RTC_XI and RTC_XO pins, along with two load capacitors, as shown in Figure 6-3. The external crystal load capacitors must be connected only to the RTC oscillator ground pin (VSSRTC). Do not connect to board ground (VSS). Position the VSS lead on the board between RTC_XI and RTC_XO as a shield to reduce direct capacitance between RTC_XI and RTC_XO leads on the board. The CVDDRTC pin can be connected to the same power supply as CVDD , or may be connected to a different supply that meets the recommended operating conditions (see Section 5.2), if desired. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 59 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 RTC_XI www.ti.com RTC_XO VSSRTC VSS CVDDRTC CVDD Crystal 32.768 kHz C1 C2 0.998-1.43 V 1.05/1.3 V Figure 6-3. 32.768-kHz RTC Oscillator The crystal should be in fundamental-mode function, and parallel resonant, with a maximum effective series resistance (ESR) specified in Table 6-1. The load capacitors, C1 and C2, are the total capacitance of the circuit board and components, excluding the IC and crystal. The load capacitors values are usually approximately twice the value of the crystal's load capacitance, CL, which is specified in the crystal manufacturer's datasheet and should be chosen such that the equation is satisfied. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator pins (RTC_XI and RTC_XO) and to the VSSRTC pin. CL = C1 C2 (C1 + C2 ) Table 6-1. Input Requirements for Crystal on the 32.768-kHz RTC Oscillator PARAMETER Start-up time (from power up until oscillating at stable frequency of 32.768-kHz) MIN (1) NOM 0.2 Oscillation frequency MAX 2 32.768 UNIT sec kHz ESR 100 Maximum shunt capacitance 1.6 pF Maximum crystal drive 1.0 mW (1) kΩ The startup time is highly dependent on the ESR and the capacitive load of the crystal. 6.4.2 CLKIN Pin With LVCMOS-Compatible Clock Input (Optional) Note: If CLKIN is not used, the pin must be tied low. A LVCMOS-compatible clock input of a frequency less than 24 MHz can be fed into the CLKIN pin for use by the DSP system clock generator. The external connections are shown in Figure 6-4 and Figure 6-5. The bootloader assumes that the CLKIN pin is connected to the LVCMOS-compatible clock source with a frequency of 11.2896-, 12.0-, or 12.288-MHz. These frequencies were selected to support boot mode peripheral speeds of 500 KHz for SPI, 400 KHz for I2C, and 57600 baud for UART (UART is currently not supported on this device). These clock frequencies are achieved by dividing the CLKIN value by 25 for SPI, by 32 for I2C, and by 208 for UART. If a faster external clock is input, then these boot modes will run at faster clock speeds. If the system design utilizes faster peripherals or these boot modes are not used, CLKIN values higher than 12.288 MHz can be used. Note: the CLKIN pin operates at the same voltage as the DVDDIO supply (1.8-, 2.5-, 2.8-, or 3.3-V). 60 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 In this configuration the RTC oscillator can be optionally disabled by connecting RTC_XI to CVDDRTC and RTC_XO to ground (VSS). However, when the RTC oscillator is disabled the RTC registers starting at I/O address 1900h will not be accessible. This includes the RTC Power Management Register which provides control to the on-chip LDOs and WAKEUP and RTC_CLKOUT pins. Note: the RTC must still be powered even if the RTC oscillator is disabled. For more details on the RTC on-chip oscillator, see Section 6.4.1, Real-Time Clock (RTC) On-Chip Oscillator With External Crystal. CLKIN RTC_XI RTC_XO VSSRTC CVDDRTC VSS CVDD Crystal 32.768 kHz C1 C2 0.998-1.43 V 1.05/1.3 V Figure 6-4. LVCMOS-Compatible Clock Input With RTC Oscillator Enabled CLKIN RTC_XI CVDDRTC RTC_XO VSS VSSRTC 0.998-1.43 V CVDD 1.05/1.3 V Figure 6-5. LVCMOS-Compatible Clock Input With RTC Oscillator Disabled 6.4.3 USB On-Chip Oscillator With External Crystal (Optional) When using the USB, the USB on-chip oscillator requires an external 12-MHz crystal connected across the USB_MXI and USB_MXO pins, along with two load capacitors, as shown in Figure 6-6. The external crystal load capacitors must be connected only to the USB oscillator ground pin (USB_VSSOSC). Do not connect to board ground (VSS). The USB_VDDOSC pin can be connected to the same power supply as USB_VDDA3P3. The USB on-chip oscillator can be permanently disabled, via tie-offs, if the USB peripheral is not being used. To permanently disable the USB oscillator, connect the USB_MXI pin to ground (VSS) and leave the USB_MXO pin unconnected. The USB oscillator power pins (USB_VDDOSC and USB_VSSOSC) should also be connected to ground. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 61 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 USB_MXI www.ti.com USB_MXO USB_VSSOSC USB_VDDOSC VSS USB_VDDA3P3 Crystal 12 MHz C1 C2 3.3 V 3.3 V Figure 6-6. 12-MHz USB Oscillator 62 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 The crystal should be in fundamental-mode operation, and parallel resonant, with a maximum effective series resistance (ESR) specified in Table 6-2. The load capacitors, C1 and C2 are the total capacitance of the circuit board and components, excluding the IC and crystal. The load capacitor value is usually approximately twice the value of the crystal's load capacitance, CL, which is specified in the crystal manufacturer's datasheet and should be chosen such that the equation below is satisfied. All discrete components used to implement the oscillator circuit should be placed as close as possible to the associated oscillator pins (USB_MXI and USB_MXO) and to the USB_VSSOSC pin. CL = C1 C2 (C1 + C2 ) Table 6-2. Input Requirements for Crystal on the 12-MHz USB Oscillator PARAMETER MIN Start-up time (from power up until oscillating at stable frequency of 12 MHz) (1) Oscillation frequency NOM MAX 0.100 10 12 (2) Maximum shunt capacitance Maximum crystal drive (1) (2) ms MHz ESR Frequency stability UNIT 100 Ω ±100 ppm 5 pF 330 mW The startup time is highly dependent on the ESR and the capacitive load of the crystal. If the USB is used, a 12-MHz, ±100-ppm crystal is recommended. 6.5 Clock PLLs The VC5505 DSP uses a software-programmable PLL to generate frequencies required by the CPU, DMA, and peripherals. The reference clock for the PLL is taken from either the CLKIN pin or the RTC on-chip oscillator (as specified through the CLK_SEL pin). 6.5.1 PLL Device-Specific Information There is a minimum and maximum operating frequency for CLKIN, PLLOUT, and the system clock (SYSCLK). The system clock generator must be configured not to exceed any of these constraints documented in this section (certain combinations of external clock inputs, internal dividers, and PLL multiply ratios might not be supported). Table 6-3. PLLC1 Clock Frequency Ranges CLOCK SIGNAL NAME CVDD = 1.05 V MIN RTC Clock 32.768 UNIT 11.2896 12 12.288 MHz 32.768 KHz 170 KHz 120 60 120 MHz 60 0.032768 100 MHz 170 PLLOUT 60 SYSCLK 0.032768 (1) MAX 32.768 32.768 PLL_LOCKTIME CVDD = 1.3 V MIN 11.2896 12 12.288 CLKIN (1) PLLIN MAX 4 4 ms These CLKIN values are used when the CLK_SEL pin = 1. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 63 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com The PLL has a lock time requirements that must be followed. The PLL lock time is the amount of time needed for the PLL to complete its phase-locking sequence. 6.5.2 Clock PLL Considerations With External Clock Sources If the CLKIN pin is used to provide the reference clock to the PLL, to minimize the clock jitter a single clean power supply should power both the VC5505 device and the external clock oscillator circuit. The minimum CLKIN rise and fall times should also be observed. For the input clock timing requirements, see Section 6.5.3, Clock PLL Electrical Data/Timing (Input and Output Clocks). Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock source must meet the device requirements in this data manual (see Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature, and Section 6.5.3, Clock PLL Electrical Data/Timing (Input and Output Clocks). 6.5.3 Clock PLL Electrical Data/Timing (Input and Output Clocks) Table 6-4. Timing Requirements for CLKIN (1) (2) (see Figure 6-7) CVDD = 1.05 V NO. MIN CVDD = 1.3 V NOM MAX 88.577, 83.333, or 81.380 MIN NOM MAX 88.577, 83.333, or 81.380 10 UNIT 1 tc(CLKIN) Cycle time, external clock driven on CLKIN 2 tw(CLKINH) Pulse width, CLKIN high 0.466 * tc(CLKIN) 0.466 * tc(CLKIN) ns 3 tw(CLKINL) Pulse width, CLKIN low 0.466 * tc(CLKIN) 0.466 * tc(CLKIN) ns 4 tt(CLKIN) Transition time, CLKIN (1) (2) 16.67 0.34 * tc(CLKIN) 0.34 * tc(CLKIN) ns ns The CLKIN frequency and PLL multiply factor should be chosen such that the resulting clock frequency is within the specific range for CPU operating frequency. The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN. 1 4 1 2 CLKIN 3 4 Figure 6-7. CLKIN Timing 64 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-5. Switching Characteristics Over Recommended Operating Conditions for CLKOUT (1) (see Figure 6-8) NO. CVDD = 1.3 V UNIT MIN MAX MIN MAX P 16.67 P 10 ns 1 tc(CLKOUT) Cycle time, CLKOUT 2 tw(CLKOUTH) Pulse duration, CLKOUT high 7.497 9.163 4.5 5.5 ns 3 tw(CLKOUTL) Pulse duration, CLKOUT low 7.497 9.163 4.5 5.5 ns 4 tt(CLKOUTR) Transition time (rise), CLKOUT (3) 5 5 ns 5 5 ns 5 (1) (2) (3) CVDD = 1.05 V PARAMETER (2) tt(CLKOUTF) Transition time (fall), CLKOUT (3) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN. P = 1/SYSCLK clock frequency in nanoseconds (ns). For example, when SYSCLK frequency is 100 MHz, use P = 10 ns. Transition time is measured with the slew rate set to FAST and DVDDIO = 1.65 V. (For more detailed information, see the Section 4.6.5 , Output Slew Rate Control Register (OSRCR) [1C16h].). 2 5 1 CLKOUT 3 4 Figure 6-8. CLKOUT Timing Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 65 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.6 www.ti.com Direct Memory Access (DMA) Controller The DMA controller is used to move data among internal memory, external memory, and peripherals without intervention from the CPU and in the background of CPU operation. The DSP includes a total of four DMA controllers. Aside from the DSP resources they can access, all four DMA controllers are identical. The DMA controller has the following features: • Operation that is independent of the CPU. • Four channels, which allow the DMA controller to keep track of the context of four independent block transfers. • Event synchronization. DMA transfers in each channel can be made dependent on the occurrence of selected events. • An interrupt for each channel. Each channel can send an interrupt to the CPU on completion of the programmed transfer. • A dedicated clock idle domain. The four device DMA controllers can be put into a low-power state by independently turning off their input clocks. 6.6.1 DMA Channel Synchronization Events The DMA controllers allow activity in their channels to be synchronized to selected events. The DSP supports 20 separate synchronization events and each channel can be tied to separate sync events independent of the other channels. Synchronization events are selected by programming the CHnEVT field in the DMAn channel event source registers (DMAnCESR1 and DMAnCESR2). 66 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.7 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Reset Supports only one type of reset, device reset. The VC5505 has two main types of reset: hardware reset and software reset. Hardware reset is responsible for initializing all key states of the device. It occurs whenever the RESET pin is asserted or when the internal power-on-reset (POR) circuit deasserts an internal signal called POWERGOOD. VC5505 device's internal POR is a voltage comparator that monitors the DSP_LDOO pin voltage and generates the internal POWERGOOD signal. POWERGOOD is asserted when the DSP_LDOO voltage is above a minimum threshold voltage provided by the bandgap. On VC5505 , the voltage comparator circuit is present and active in the POR circuit even though the DSP_LDO is not currently supported. The RESET pin and the POWERGOOD signal are internally combined with a logical AND gate to produce an (active low) hardware reset (see Figure 6-9, Power-On Reset Timing Requirements and Figure 6-10, Reset Timing Requirements). There are two types of software reset: the CPU's software reset instruction and the software control of the peripheral reset signals. For more information on the CPU's software reset instruction, see the TMS320C55x CPU 3.0 CPU Reference Guide (literature number: SWPU073). In all VC5505 documentation, all references to "reset" refer to hardware reset. Any references to software reset will explicitly state software reset. The VC5505 RTC has one additional type of reset, a power-on-reset (POR) for the registers in the RTC core. This POR monitors the voltage of CVDD_RTC and resets the RTC registers when power is first applied to the RTC core. 6.7.1 Power-On Reset (POR) Circuits The VC5505 device includes two power-on reset (POR) circuits, one for the RTC (RTC POR) and another for the rest of the chip (MAIN POR). 6.7.1.1 RTC Power-On Reset (POR) The RTC POR ensures that the flip-flops in the CVDD_RTC power domain have an initial state upon powerup. In particular, the RTCNOPWR register is reset by this POR and is used to indicate that the RTC time registers need to be initialized with the current time and date when power is first applied. 6.7.1.2 Main Power-On Reset (POR) The VC5505 device includes an analog power-on reset (POR) circuit that keeps the DSP in reset until specific voltages have reached predetermined levels. The output of the POR circuit, POWERGOOD, is held low until the following conditions are satisfied: • ANA_LDOI is powered and the bandgap is active for at least approximately 8 ms • VDD_ANA is powered for at least approximately 4 ms • DSP_LDOO is powered and above a threshold of approximately 900 mV (see Note:) Once these conditions are met, the internal POWERGOOD signal is set high. The POWERGOOD signal is internally combined with the RESET pin signal, via an AND-gate, to produce the DSP subsystem's global reset. This global reset is the hardware reset for the whole chip, except the RTC. When the global reset is deasserted (high), the boot sequence starts. For more detailed information on the boot sequence, see Section 4.4, Boot Sequence. Note: The DSP_LDO is not supported on VC5505 device, but it's output voltage is still monitored by the MAIN POR and must reach, and remain, higher than the POR's threshold for the POWERGOOD signal to be high. The DSP_LDOO pin must be left floating and be properly bypassed as specified in the DSP_LDOO entry in Table 3-19, Regulators and Power Management Terminal Functions. By leaving this pin floating, the VC5505 's internal circuits provide the necessary voltage above the POR's threshold for POWERGOOD. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 67 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.7.1.3 www.ti.com Reset Pin (RESET) The VC5505 can receive an external reset signal on the RESET pin. As specified above in Section 6.7.1.2, Main Power-On Reset, the RESET pin is combined with the internal POWERGOOD signal, that is generated by the MAIN POR, via an AND-gate. The output of the AND gate provides the hardware reset to the chip. The RESET pin may be tied high and the MAIN POR will provide the hardware reset, or the RESET pin may be externally generated. Once the internal hardware reset, from the MAIN POR and the RESET pin, goes high, the DSP clock generator is enabled and the DSP starts the boot sequence. For more information on the boot sequence, see Section 4.4, Boot Sequence. 6.7.2 Pin Behaviors at Reset During normal operation, pins are controlled by the respective peripheral selected in the External Bus Selection Register (EBSR) register. During power-on reset and reset, the behavior of the output pins changes and is categorized as follows: 68 • High Group: EM_CS4, EM_CS5, EM_CS2, EM_CS3, EM_DQM0, EM_DQM1, EM_OE, EM_WE, LCD_RS/SPI_CS3, RSV15, RSV14, XF • Low Group: LCD_EN_RDB/SPI_CLK, EM_R/W, MMC0_CLK/I2S0_CLK/GP[0], MMC1_CLK/I2S1_CLK/GP[6], RSV12 • Z Group: EM_D[15:0], EMU[1:0], SCL, SDA, LCD_D[0]/SPI_RX, LCD_D[1]/SPI_TX, LCD_D[10]/I2S2_RX/GP[20]/SPI_RX, LCD_D[11]/I2S2_DX/GP[27]/SPI_TX, LCD_D[12]/I2S2_RTS/GP[28]/I2S3_CLK, LCD_D[13]/I2S2_CTS/GP[29]/I2S3_RS, LCD_D[14]/I2S2_RXD/GP[30]/I2S3_RX, LCD_D[15]/I2S2_TXD/GP[31]/I2S3_DX, LCD_D[2]/GP[12], LCD_D[3]/GP[13], LCD_D[4]/GP[14], LCD_D[5]/GP[15], LCD_D[6]/GP[16], LCD_D[7]/GP[17], LCD_D[8]/I2S2_CLK/GP[18]/SPI_CLK,LCD_D[9]/I2S2_FS/GP[19]/SPI_CS0, RTC_CLKOUT, MMC0_CMD/I2S0_FS/GP[1], MMC0_D0/I2S0_DX/GP[2], MMC0_D1/I2S0_RX/GP[3], MMC0_D2/GP[4], MMC0_D3/GP[5], MMC1_CMD/I2S1_FS/GP[7], MMC1_D0/I2S1_DX/GP[8], MMC1_D1/I2S1_RX/GP[9], MMC1_D2/GP[10], MMC1_D3/GP[11], TDO, WAKEUP • CLKOUT Group: CLKOUT, LCD_CS1_E1/SPI_CS1 • SYNCH 0→1 Group: LCD_CS0_E0/SPI_CS0, LCD_RW_WRB/SPI_CS2, RSV13 • SYNCH 1→0 Group: RSV10, RSV11 • SYNCH X→1 Group: EM_BA[1:0] • SYNCH X→0 Group: EM_A[20:0] Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.7.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Reset Electrical Data/Timing Table 6-6. Timing Requirements for Reset (1) (see Figure 6-9 and Figure 6-10) CVDD = 1.05 V NO. 1 (1) MIN tw(RSTL) Pulse duration, RESET low CVDD = 1.3 V MAX 3P MIN MAX 3P UNIT ns (1)P = 1/SYSCLK clock frequency in ns. For example, if SYSCLK = 12 MHz, use P = 83.3 ns. In IDLE3 mode the system clock generator is bypassed and the SYSCLK frequency is equal to either CLKIN or the RTC clock frequency depending on CLK_SEL. POWERGOOD (Internal) RESET POWERGOOD and RESET (Internal) LOW Group HIGH Group Z Group SYNCH X→ 0 Group SYNCH X→ 1 Group SYNCH 0→ 1 Group SYNCH 1→ 0 Group CLKOUT 64k + 8 clocks if CLK_SEL = 1, 32 + 8 clocks if CLK_SEL = 0 Figure 6-9. Power-On Reset Timing Requirements Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 69 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com POWERGOOD (Internal) RESET POWERGOOD and RESET (Internal) LOW Group HIGH Group Z Group SYNCH X → 0 Group SYNCH X → 1 Group SYNCH 0 → 1 Group SYNCH 1 → 0 Group CLKOUT 64k + 8 clocks if CLK_SEL = 1, 32 + 8 clocks if CLK_SEL = 0 Figure 6-10. Reset Timing Requirements 70 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.8 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Wake-up Events, Interrupts, and XF The VC5505 device has a number of interrupts to service the needs of its peripherals. The interrupts can be selectively enabled or disabled. 6.8.1 Interrupts Electrical Data/Timing Table 6-7. Timing Requirements for Interrupts (1) (see Figure 6-11) CVDD = 1.05 V CVDD = 1.3 V NO. MIN (1) UNIT MAX 1 tw(INTH) Pulse duration, interrupt high CPU active 2P ns 2 tw(INTL) Pulse duration, interrupt low CPU active 2P ns P = 1/SYSCLK clock frequency in ns. For example, when running parts at 100 MHz, use P = 10 ns. 1 INTx 2 Figure 6-11. External Interrupt Timings 6.8.2 Wake-Up From IDLE Electrical Data/Timing Table 6-8. Timing Requirements for Wake-Up From IDLE (see Figure 6-12) CVDD = 1.05 V CVDD = 1.3 V NO. MIN 1 tw(WKPL) Pulse duration, WAKEUP or INTx low, SYSCLKDIS = 1 UNIT MAX 10 ns Table 6-9. Switching Characteristics Over Recommended Operating Conditions For Wake-Up From IDLE (1) (2) (3) (see Figure 6-12) NO. CVDD = 1.05 V CVDD = 1.3 V PARAMETER MIN 2 td(WKEVTH-C KLGEN) Delay time, Wake-Up event high to CPU active UNIT MAX IDLE3 Mode with SYSCLKDIS = 1, WAKEUP or INTx event, CLK_SEL = 1 P ns IDLE3 Mode with SYSCLKDIS = 1, WAKEUP or INTx event, CLK_SEL = 0 C ns 3P ns IDLE2 Mode; INTx event (1) (2) (3) TYP P = 1/SYSCLK clock frequency in ns. For example, when running parts at 100 MHz, P = 10 ns. C = 1/RTCCLK= 30.5 ms. RTCCLK is the clock output of the 32.768-kHz RTC oscillator. Assumes the internal LDOs are used with a 0.1uF bandgap capacitor. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 71 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 2 CLKOUT 1 WAKEUP INTx A. B. C. D. INT[1:0] can only be used as a wake-up event for IDLE3 and IDLE2 modes. RTC interrupt (internal signal) can be used as wake-up event for IDLE3 and IDLE2 modes. Any unmasked interrupt can be used to exit the IDLE2 mode. CLKOUT reflects either the CPU clock, SAR, USB PHY, or PLL clock dependent on the setting of the CLOCKOUT Clock Source Register. For this diagram, CLKOUT refers to the CPU clock. Figure 6-12. Wake-Up From IDLE Timings 6.8.3 XF Electrical Data/Timing Table 6-10. Switching Characteristics Over Recommended Operating Conditions For XF (1) (see Figure 6-13) NO. (1) (2) CVDD = 1.05 V CVDD = 1.3 V PARAMETER 1 td(XF) (2) Delay time, CLKOUT high to XF high MIN MAX 0 10.2 UNIT ns P = 1/SYSCLK clock frequency in ns. For example, when running parts at 100 MHz, P = 10 ns. C = 1/RTCCLK= 30.5 ms. RTCCLK is the clock output of the 32.768-kHz RTC oscillator. (A) CLKOUT 1 XF A. CLKOUT reflects either the CPU clock, SAR, USB PHY, or PLL clock dependent on the setting of the CLOCKOUT Clock Source Register. For this diagram, CLKOUT refers to the CPU clock. Figure 6-13. XF Timings 6.9 External Memory Interface (EMIF) VC5505 supports several memory and external device interfaces, including: NOR Flash, NAND Flash, and SRAM. The EMIF provides an 8-bit or 16-bit data bus, an address bus width up to 21 bits, and 4 chip selects, along with memory control signals. The EM_A[20:15] address signals are multiplexed with the GPIO peripheral and controlled by the External Bus Selection Register (EBSR). For more detail on the pin muxing, see the Section 4.6.1, External Bus Selection Register (EBSR). 6.9.1 EMIF Asynchronous Memory Support The EMIF supports asynchronous: • SRAM memories 72 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com • • SPRS503B – JUNE 2009 – REVISED JANUARY 2010 NAND Flash memories NOR Flash memories The EMIF data bus can be configured for both 8- or 16-bit width. The device supports up to 21 address lines and four external wait/interrupt inputs. Up to four asynchronous chip selects are supported by EMIF (EM_CS[5:2]). Each chip select has the following individually programmable attributes: • Data bus width • Read cycle timings: setup, hold, strobe • Write cycle timings: setup, hold, strobe • Bus turn around time • Extended Wait Option With Programmable Timeout • Select Strobe Option • NAND flash controller supports 1-bit and 4-bit ECC calculation on blocks of 512 bytes 6.9.2 EMIF Peripheral Register Description(s) Table 6-11 shows the EMIF registers. Table 6-11. External Memory Interface (EMIF) Peripheral Registers (1) HEX ADDRESS RANGE ACRONYM 1000h REV (1) REGISTER NAME Revision Register 1001h STATUS Status Register 1004h AWCCR1 Asynchronous Wait Cycle Configuration Register 1 1005h AWCCR2 Asynchronous Wait Cycle Configuration Register 2 1010h ACS2CR1 Asynchronous CS2 Configuration Register 1 1011h ACS2CR2 Asynchronous CS2 Configuration Register 2 1014h ACS3CR1 Asynchronous CS3 Configuration Register 1 1015h ACS3CR2 Asynchronous CS3 Configuration Register 2 1018h ACS4CR1 Asynchronous CS4 Configuration Register 1 1019h ACS4CR2 Asynchronous CS4 Configuration Register 2 101Ch ACS5CR1 Asynchronous CS5 Configuration Register 1 101Dh ACS5CR2 Asynchronous CS5 Configuration Register 2 1040h EIRR EMIF Interrupt Raw Register 1044h EIMR EMIF Interrupt Mask Register 1048h EIMSR EMIF Interrupt Mask Set Register 104Ch EIMCR EMIF Interrupt Mask Clear Register 1060h NANDFCR NAND Flash Control Register 1064h NANDFSR1 NAND Flash Status Register 1 1065h NANDFSR2 NAND Flash Status Register 2 1068h PGMODECTRL1 Page Mode Control Register 1 1069h PGMODECTRL2 Page Mode Control Register 2 1070h NCS2ECC1 NAND Flash CS2 1-Bit ECC Register 1 1071h NCS2ECC2 NAND Flash CS2 1-Bit ECC Register 2 1074h NCS3ECC1 NAND Flash CS3 1-Bit ECC Register 1 1075h NCS3ECC2 NAND Flash CS3 1-Bit ECC Register 2 1078h NCS4ECC1 NAND Flash CS4 1-Bit ECC Register 1 Before reading or writing to the EMIF registers, be sure to set the BYTEMODE bits to 00b in the EMIF system control register to enable word accesses to the EMIF registers. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 73 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-11. External Memory Interface (EMIF) Peripheral Registers HEX ADDRESS RANGE ACRONYM 1079h NCS4ECC2 NAND Flash CS4 1-Bit ECC Register 2 107Ch NCS5ECC1 NAND Flash CS5 1-Bit ECC Register 1 74 (1) (continued) REGISTER NAME 107Dh NCS5ECC2 NAND Flash CS5 1-Bit ECC Register 2 10BCh NAND4BITECCLOAD NAND Flash 4-Bit ECC Load Register 10C0h NAND4BITECC1 NAND Flash 4-Bit ECC Register 1 10C1h NAND4BITECC2 NAND Flash 4-Bit ECC Register 2 10C4h NAND4BITECC3 NAND Flash 4-Bit ECC Register 3 10C5h NAND4BITECC4 NAND Flash 4-Bit ECC Register 4 10C8h NAND4BITECC5 NAND Flash 4-Bit ECC Register 5 10C9h NAND4BITECC6 NAND Flash 4-Bit ECC Register 6 10CCh NAND4BITECC7 NAND Flash 4-Bit ECC Register 7 10CDh NAND4BITECC8 NAND Flash 4-Bit ECC Register 8 10D0h NANDERRADD1 NAND Flash 4-Bit ECC Error Address Register 1 10D1h NANDERRADD2 NAND Flash 4-Bit ECC Error Address Register 2 10D4h NANDERRADD3 NAND Flash 4-Bit ECC Error Address Register 3 10D5h NANDERRADD4 NAND Flash 4-Bit ECC Error Address Register 4 10D8h NANDERRVAL1 NAND Flash 4-Bit ECC Error Value Register 1 10D9h NANDERRVAL2 NAND Flash 4-Bit ECC Error Value Register 2 10DCh NANDERRVAL3 NAND Flash 4-Bit ECC Error Value Register 3 10DDh NANDERRVAL4 NAND Flash 4-Bit ECC Error Value Register 4 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.9.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 EMIF Electrical Data/Timing CVDD = 1.05 V, DVDDEMIF = 3.3/2.8/2.5/1.8 V Table 6-12. Timing Requirements for EMIF Asynchronous Memory (1) (see Figure 6-14, Figure 6-16, and Figure 6-17) CVDD = 1.05 V DVDDEMIF = 3.3/2.8/2.5/1.8 V NO. MIN NOM UNIT MAX READS and WRITES 2 tw(EM_WAIT) Pulse duration, EM_WAITx assertion and deassertion 2E ns 14.5 ns 0 ns 4E + 9 ns 4E + 9 ns READS 12 tsu(EMDV-EMOEH) Setup time, EM_D[15:0] valid before EM_OE high 13 th(EMOEH-EMDIV) Hold time, EM_D[15:0] valid after EM_OE high 14 tsu (EMOEL-EMWAIT) Setup Time, EM_WAITx asserted before end of Strobe Phase (2) 26 tsu (EMWEL-EMWAIT) Setup Time, EM_WAITx asserted before end of Strobe Phase (2) WRITES (1) (2) E = SYSCLK period in ns, if EMIF is set for "full rate" or E = SYSCLK/2 period in ns, if EMIF is set for "half rate" as defined by bit 14 of the EMIF Status register (0x1001h). For example, when EMIF is set to full rate and SYSCLK is selected and set to 100 MHz, E = 10 ns. Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAITx must be asserted to add extended wait states. Figure 6-16 and Figure 6-17 describe EMIF transactions that include extended wait states inserted during the STROBE phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where the HOLD phase would begin if there were no extended wait cycles. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 75 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-13. Switching Characteristics Over Recommended Operating Conditions for EMIF Asynchronous Memory (1) Figure 6-17) (3) NO. (2) (see Figure 6-15 and CVDD = 1.05 V DVDDEMIF = 3.3/2.8/2.5/1.8 V PARAMETER MIN UNIT NOM MAX READS and WRITES 1 td(TURNAROUND) Turn around time (TA)*E - 9 (TA)*E (TA)*E + 9 ns (RS+RST+RH)*E (RS+RST+RH)*E + 9 ns (RS+RST+RH+(EWC*16))*E (RS+RST+RH+(EWC*16))*E + 9 ns READS 3 tc(EMRCYCLE) EMIF read cycle time (EW = 0) (RS+RST+RH)*E - 9 EMIF read cycle time (EW = 1) (RS+RST+RH+(EWC*16))*E - 9 Output setup time, EM_CS[5:2] low to EM_OE low (SS = 0) (RS)*E-9 (RS)*E (RS)*E+9 ns Output setup time, EM_CS[5:2] low to EM_OE low (SS = 1) -9 0 +9 ns Output hold time, EM_OE high to EM_CS[5:2] high (SS = 0) (RH)*E - 9 (RH)*E (RH)*E + 9 ns Output hold time, EM_OE high to EM_CS[5:2] high (SS = 1) -9 0 +9 ns 4 tsu(EMCEL-EMOEL) 5 th(EMOEH-EMCEH) 6 tsu(EMBAV-EMOEL) Output setup time, EM_BA[1:0] valid to EM_OE low (RS)*E-9 (RS)*E (RS)*E+9 ns 7 th(EMOEH-EMBAIV) Output hold time, EM_OE high to EM_BA[1:0] invalid (RH)*E-9 (RH)*E (RH)*E+9 ns 8 tsu(EMBAV-EMOEL) Output setup time, EM_A[20:0] valid to EM_OE low (RS)*E-9 (RS)*E (RS)*E+9 ns 9 th(EMOEH-EMAIV) Output hold time, EM_OE high to EM_A[20:0] invalid (RH)*E-9 (RH)*E (RH)*E+9 ns EM_OE active low width (EW = 0) (RST)*E-9 (RST)*E (RST)*E+9 ns EM_OE active low width (EW = 1) (RST+(EWC*16))*E-9 (RST+(EWC*16))*E (RST+(EWC*16))*E+9 ns 4E-9 4E 4E+9 ns EMIF write cycle time (EW = 0) (WS+WST+WH)*E-9 (WS+WST+WH)*E (WS+WST+WH)*E+9 ns EMIF write cycle time (EW = 1) (WS+WST+WH+(EWC*16))*E 9 (WS+WST+WH+(EWC*16))*E (WS+WST+WH+(EWC*16))*E + 9 ns Output setup time, EM_CS[5:2] low to EM_WE low (SS = 0) (WS)*E - 9 (WS)*E (WS)*E + 9 ns Output setup time, EM_CS[5:2] low to EM_WE low (SS = 1) -9 0 +9 ns Output hold time, EM_WE high to EM_CS[5:2] high (SS = 0) (WH)*E-9 (WH)*E (WH)*E+9 ns Output hold time, EM_WE high to EM_CS[5:2] high (SS = 1) -9 0 +9 ns 10 tw(EMOEL) 11 td(EMWAITH-EMOEH) Delay time from EM_WAITx deasserted to EM_OE high WRITES 15 tc(EMWCYCLE) 16 tsu(EMCSL-EMWEL) 17 th(EMWEH-EMCSH) 18 tsu(EMBAV-EMWEL) Output setup time, EM_BA[1:0] valid to EM_WE low (WS)*E-9 (WS)*E (WS)*E+9 ns 19 th(EMWEH-EMBAIV) Output hold time, EM_WE high to EM_BA[1:0] invalid (WH)*E-9 (WH)*E (WH)*E+9 ns 20 tsu(EMAV-EMWEL) Output setup time, EM_A[20:0] valid to EM_WE low (WS)*E-9 (WS)*E (WS)*E+9 ns 21 th(EMWEH-EMAIV) Output hold time, EM_WE high to EM_A[20:0] invalid (WH)*E-9 (WH)*E (WH)*E+9 ns (1) (2) (3) 76 TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold, MEWC = Maximum external wait cycles. These parameters are programmed via the Asynchronous Configuration and Asynchronous Wait Cycle Configuration Registers. E = SYSCLK period in ns, if EMIF is set for "full rate" or E = SYSCLK/2 period in ns, if EMIF is set for "half rate" as defined by bit 14 of the EMIF Status register (0x1001h). For example, when EMIF is set to full rate and SYSCLK is selected and set to 100 MHz, E = 10 ns. EWC = external wait cycles determined by EM_WAITx input signal. EWC supports the following range of values EWC[256-1]. Note that the maximum wait time before timeout is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register. Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-13. Switching Characteristics Over Recommended Operating Conditions for EMIF Asynchronous Memory Figure 6-17 ) (3) (continued) NO. (see Figure 6-15 and CVDD = 1.05 V DVDDEMIF = 3.3/2.8/2.5/1.8 V PARAMETER MIN NOM UNIT MAX EM_WE active low width (EW = 0) (WST)*E-9 (WST)*E (WST)*E+9 ns EM_WE active low width (EW = 1) (WST+(EWC*16))*E-9 (WST+(EWC*16))*E (WST+(EWC*16))*E+9 ns 3E-9 4E 4E+9 ns Output setup time, EM_D[15:0] valid to EM_WE low (WS)*E-9 (WS)*E (WS)*E+9 ns Output hold time, EM_WE high to EM_D[15:0] invalid (WH)*E-9 (WH)*E (WH)*E+9 ns 22 tw(EMWEL) 23 td(EMWAITH-EMWEH) Delay time from EM_WAITx deasserted to EM_WE high 24 tsu(EMDV-EMWEL) 25 th(EMWEH-EMDIV) 6.9.4 (1) (2) EMIF Electrical Data/Timing CVDD = 1.3 V, DVDDEMIF = 3.3/2.8/2.5/1.8 V Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 77 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-14. Timing Requirements for EMIF Asynchronous Memory (1) (see Figure 6-14, Figure 6-16, and Figure 6-17) CVDD = 1.3 V DVDDEMIF = 3.3/2.8/2.5/1.8 V NO. MIN NOM UNIT MAX READS and WRITES 2 tw(EM_WAIT) Pulse duration, EM_WAITx assertion and deassertion 2E ns 11 ns READS 12 tsu(EMDV-EMOEH) Setup time, EM_D[15:0] valid before EM_OE high 13 th(EMOEH-EMDIV) Hold time, EM_D[15:0] valid after EM_OE high 14 tsu (EMOEL-EMWAIT) Setup Time, EM_WAITx asserted before end of Strobe Phase (2) 0 ns 4E + 5 ns 4E + 5 ns WRITES 26 (1) (2) 78 tsu (EMWEL-EMWAIT) Setup Time, EM_WAITx asserted before end of Strobe Phase (2) E = SYSCLK period in ns, if EMIF is set for "full rate" or E = SYSCLK/2 period in ns, if EMIF is set for "half rate" as defined by bit 14 of the EMIF Status register (0x1001h). For example, when EMIF is set to full rate and SYSCLK is selected and set to 100 MHz, E = 10 ns. Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAITx must be asserted to add extended wait states. Figure 6-16 and Figure 6-17 describe EMIF transactions that include extended wait states inserted during the STROBE phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where the HOLD phase would begin if there were no extended wait cycles. Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-15. Switching Characteristics Over Recommended Operating Conditions for EMIF Asynchronous Memory (1) Figure 6-16, and Figure 6-17) NO. (2) (3) (see Figure 6-14, CVDD = 1.3 V DVDDEMIF = 3.3/2.8/2.5/1.8 V PARAMETER MIN UNIT NOM MAX READS and WRITES 1 td(TURNAROUND) Turn around time (TA)*E - 5 (TA)*E (TA)*E + 5 ns (RS+RST+RH)*E (RS+RST+RH)*E + 5 ns (RS+RST+RH+(EWC*16))*E (RS+RST+RH+(EWC*16))*E + 5 ns READS 3 tc(EMRCYCLE) EMIF read cycle time (EW = 0) (RS+RST+RH)*E - 5 EMIF read cycle time (EW = 1) (RS+RST+RH+(EWC*16))*E - 5 Output setup time, EM_CS[5:2] low to EM_OE low (SS = 0) (RS)*E-5 (RS)*E (RS)*E+5 ns Output setup time, EM_CS[5:2] low to EM_OE low (SS = 1) -5 0 +5 ns Output hold time, EM_OE high to EM_CS[5:2] high (SS = 0) (RH)*E - 5 (RH)*E (RH)*E + 5 ns Output hold time, EM_OE high to EM_CE[5:2] high (SS = 1) -5 0 +5 ns 4 tsu(EMCSL-EMOEL) 5 th(EMOEH-EMCSH) 6 tsu(EMBAV-EMOEL) Output setup time, EM_BA[1:0] valid to EM_OE low (RS)*E-5 (RS)*E (RS)*E+5 ns 7 th(EMOEH-EMBAIV) Output hold time, EM_OE high to EM_BA[1:0] invalid (RH)*E-5 (RH)*E (RH)*E+5 ns 8 tsu(EMAV-EMOEL) Output setup time, EM_A[20:0] valid to EM_OE low (RS)*E-5 (RS)*E (RS)*E+5 ns 9 th(EMOEH-EMAIV) Output hold time, EM_OE high to EM_A[20:0] invalid (RH)*E-5 (RH)*E (RH)*E+5 ns EM_OE active low width (EW = 0) (RST)*E-5 (RST)*E (RST)*E+5 ns EM_OE active low width (EW = 1) (RST+(EWC*16))*E-5 (RST+(EWC*16))*E (RST+(EWC*16))*E+5 ns 4E-5 4E 4E+5 ns EMIF write cycle time (EW = 0) (WS+WST+WH)*E-5 (WS+WST+WH)*E (WS+WST+WH)*E+5 ns EMIF write cycle time (EW = 1) (WS+WST+WH+(EWC*16))*E 5 (WS+WST+WH+(EWC*16))*E (WS+WST+WH+(EWC*16))*E + 5 ns Output setup time, EM_CS[5:2] low to EM_WE low (SS = 0) (WS)*E - 5 (WS)*E (WS)*E + 5 ns Output setup time, EM_CS[5:2] low to EM_WE low (SS = 1) -5 0 +5 ns Output hold time, EM_WE high to EM_CS[5:2] high (SS = 0) (WH)*E-5 (WH)*E (WH)*E+5 ns Output hold time, EM_WE high to EM_CS[5:2] high (SS = 1) -5 0 +5 ns 10 tw(EMOEL) 11 td(EMWAITH-EMOEH) Delay time from EM_WAITx deasserted to EM_OE high WRITES 15 tc(EMWCYCLE) 16 tsu(EMCSL-EMWEL) 17 th(EMWEH-EMCSH) 18 tsu(EMBAV-EMWEL) Output setup time, EM_BA[1:0] valid to EM_WE low (WS)*E-5 (WS)*E (WS)*E+5 ns 19 th(EMWEH-EMBAIV) Output hold time, EM_WE high to EM_BA[1:0] invalid (WH)*E-5 (WH)*E (WH)*E+5 ns 20 tsu(EMAV-EMWEL) Output setup time, EM_A[20:0] valid to EM_WE low (WS)*E-5 (WS)*E (WS)*E+5 ns 21 th(EMWEH-EMAIV) Output hold time, EM_WE high to EM_A[20:0] invalid (WH)*E-5 (WH)*E (WH)*E+5 ns (1) (2) (3) TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold, MEWC = Maximum external wait cycles. These parameters are programmed via the Asynchronous Configuration and Asynchronous Wait Cycle Configuration Registers. E = SYSCLK period in ns, if EMIF is set for "full rate" or E = SYSCLK/2 period in ns, if EMIF is set for "half rate" as defined by bit 14 of the EMIF Status register (0x1001h). For example, when EMIF is set to full rate and SYSCLK is selected and set to 100 MHz, E = 10 ns. EWC = external wait cycles determined by EM_WAITx input signal. EWC supports the following range of values EWC[256-1]. Note that the maximum wait time before timeout is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register. Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 79 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-15. Switching Characteristics Over Recommended Operating Conditions for EMIF Asynchronous Memory Figure 6-16 , and Figure 6-17 ) (continued) NO. (see Figure 6-14 , CVDD = 1.3 V DVDDEMIF = 3.3/2.8/2.5/1.8 V PARAMETER MIN 80 (1) (2) (3) NOM UNIT MAX EM_WE active low width (EW = 0) (WST)*E-5 (WST)*E (WST)*E+5 ns EM_WE active low width (EW = 1) (WST+(EWC*16))*E-5 (WST+(EWC*16))*E (WST+(EWC*16))*E+5 ns 3E-5 4E 4E+5 ns Output setup time, EM_D[15:0] valid to EM_WE low (WS)*E-5 (WS)*E (WS)*E+5 ns Output hold time, EM_WE high to EM_D[15:0] invalid (WH)*E-5 (WH)*E (WH)*E+5 ns 22 tw(EMWEL) 23 td(EMWAITH-EMWEH) Delay time from EM_WAITx deasserted to EM_WE high 24 tsu(EMDV-EMWEL) 25 th(EMWEH-EMDIV) Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 3 1 EM_CS[5:2] EM_BA[1:0] EM_A[20:0] 4 8 5 9 6 7 10 EM_OE 13 12 EM_D[15:0] EM_WE Figure 6-14. Asynchronous Memory Read Timing for EMIF 15 1 EM_CS[5:2] EM_BA[1:0] EM_A[20:0] 16 17 18 19 20 22 21 EM_WE 25 24 EM_D[15:0] EM_OE Figure 6-15. Asynchronous Memory Write Timing for EMIF Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 81 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 EM_CS[5:2] SETUP www.ti.com STROBE Extended Due to EM_WAITx STROBE HOLD EM_BA[1:0] EM_A[20:0] EM_D[15:0] 14 11 EM_OE 2 EM_WAITx Asserted 2 Deasserted Figure 6-16. EM_WAITx Read Timing Requirements EM_CS[5:2] SETUP STROBE Extended Due to EM_WAITx STROBE HOLD EM_BA[1:0] EM_A[20:0] EM_D[15:0] 28 25 EM_WE 2 EM_WAITx Asserted 2 Deasserted Figure 6-17. EM_WAITx Write Timing Requirements 82 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.10 Multimedia Card/Secure Digital (MMC/SD) The VC5505 includes two MMC/SD controllers which are compliant with MMC V3.31, Secure Digital Part 1 Physical Layer Specification V2.0, and Secure Digital Input Output (SDIO) V3.3 specifications. The MMC/SD card controller supports these industry standards and assumes the reader is familiar with these standards. Each VC5505 MMC/SD Controller has the following features: • Multimedia Card/Secure Digital (MMC/SD) protocol support • Programmable clock frequency • 512 bit Read/Write FIFO to lower system overhead • Slave DMA transfer capability The MMC/SD card controller transfers data between the CPU and DMA controller on one side and MMC/SD card on the other side. The CPU and DMA controller can read/write the data in the card by accessing the registers in the MMC/SD controller. The MMC/SD controller on this device, does not support the SPI mode of operation. 6.10.1 MMC/SD Peripheral Register Description(s) Table 6-16 and Table 6-17 shows the MMC/SD registers. The MMC/SD0 registers start at address 0x3A00 and the MMC/SD1 registers start at address 0x3B00. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 83 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-16. MMC/SD0 Registers HEX ADDRESS RANGE ACRONYM 3A00h MMCCTL MMC Control Register 3A04h MMCCLK MMC Memory Clock Control Register 3A08h MMCST0 MMC Status Register 0 3A0Ch MMCST1 MMC Status Register 1 84 REGISTER NAME 3A10h MMCIM 3A14h MMCTOR MMC Interrupt Mask Register MMC Response Time-Out Register 3A18h MMCTOD MMC Data Read Time-Out Register 3A1Ch MMCBLEN MMC Block Length Register 3A20h MMCNBLK MMC Number of Blocks Register 3A24h MMCNBLC MMC Number of Blocks Counter Register 3A28h MMCDRR1 MMC Data Receive 1 Register 3A29h MMCDRR2 MMC Data Receive 2 Register 3A2Ch MMCDXR1 MMC Data Transmit 1 Register 3A2Dh MMCDXR2 MMC Data Transmit 2 Register 3A30h MMCCMD MMC Command Register 3A34h MMCARGHL MMC Argument Register 3A38h MMCRSP0 MMC Response Register 0 3A39h MMCRSP1 MMC Response Register 1 3A3Ch MMCRSP2 MMC Response Register 2 3A3Dh MMCRSP3 MMC Response Register 3 3A40h MMCRSP4 MMC Response Register 4 3A41h MMCRSP5 MMC Response Register 5 3A44h MMCRSP6 MMC Response Register 6 3A45h MMCRSP7 MMC Response Register 7 3A48h MMCDRSP MMC Data Response Register 3A50h MMCCIDX MMC Command Index Register 3A64h – 3A70h – 3A74h MMCFIFOCTL Reserved MMC FIFO Control Register Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-17. MMC/SD1 Registers HEX ADDRESS RANGE ACRONYM 3B00h MMCCTL MMC Control Register 3B04h MMCCLK MMC Memory Clock Control Register 3B08h MMCST0 MMC Status Register 0 3B0Ch MMCST1 MMC Status Register 1 REGISTER NAME 3B10h MMCIM 3B14h MMCTOR MMC Interrupt Mask Register MMC Response Time-Out Register 3B18h MMCTOD MMC Data Read Time-Out Register 3B1Ch MMCBLEN MMC Block Length Register 3B20h MMCNBLK MMC Number of Blocks Register 3B24h MMCNBLC MMC Number of Blocks Counter Register 3B28h MMCDRR1 MMC Data Receive 1 Register 3B29h MMCDRR2 MMC Data Receive 2 Register 3B2Ch MMCDXR1 MMC Data Transmit 1 Register 3B2Dh MMCDXR2 MMC Data Transmit 2 Register 3B30h MMCCMD MMC Command Register 3B34h MMCARGHL MMC Argument Register 3B38h MMCRSP0 MMC Response Register 0 3B39h MMCRSP1 MMC Response Register 1 3B3Ch MMCRSP2 MMC Response Register 2 3B3Dh MMCRSP3 MMC Response Register 3 3B40h MMCRSP4 MMC Response Register 4 3B41h MMCRSP5 MMC Response Register 5 3B44h MMCRSP6 MMC Response Register 6 3B45h MMCRSP7 MMC Response Register 7 3B48h MMCDRSP MMC Data Response Register 3B50h MMCCIDX MMC Command Index Register 3B74h MMCFIFOCTL Copyright © 2009–2010, Texas Instruments Incorporated MMC FIFO Control Register Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 85 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.10.2 MMC/SD Electrical Data/Timing Table 6-18. Timing Requirements for MMC/SD (see Figure 6-18 and Figure 6-21) NO. CVDD = 1.3 V CVDD = 1.05 V FAST MODE STD MODE MIN MAX MIN UNIT MAX 1 tsu(CMDV-CLKH) Setup time, MMCx_CMD data input valid before MMCx_CLK high 3 3 ns 2 th(CLKH-CMDV) Hold time, MMCx_CMD data input valid after MMCx_CLK high 3 3 ns 3 tsu(DATV-CLKH) Setup time, MMC_Dx data input valid before MMCx_CLK high 3 3 ns 4 th(CLKH-DATV) Hold time, MMC_Dx data input valid after MMCx_CLK high 3 3 ns Table 6-19. Switching Characteristics Over Recommended Operating Conditions for MMC Output (1) (see Figure 6-18 and Figure 6-21) NO. PARAMETER CVDD = 1.3 V CVDD = 1.05 V FAST MODE STD MODE UNIT MIN MAX MIN MAX 7 f(CLK) Operating frequency, MMCx_CLK 0 50 (2) 0 25 (2) MHz 8 f(CLK_ID) Identfication mode frequency, MMCx_CLK 0 400 0 400 kHz 9 tw(CLKL) Pulse width, MMCx_CLK low 7 10 10 tw(CLKH) Pulse width, MMCx_CLK high 7 10 11 tr(CLK) Rise time, MMCx_CLK 3 10 ns 12 tf(CLK) Fall time, MMCx_CLK 3 10 ns 13 td(MDCLKL-CMDIV) Delay time, MMCx_CLK low to MMC_CMD data output invalid 14 td(MDCLKL-CMDV) Delay time, MMCx_CLK low to MMC_CMD data output valid 15 td(MDCLKL-DATIV) Delay time, MMCx_CLK low to MMC_Dx data output invalid td(MDCLKL-DATV) Delay time, MMCx_CLK low to MMC_Dx data output valid 16 (1) (2) -4 ns ns -4 ns 4 5 -4 -4 ns ns 4 5 ns For MMC/SD, the parametric values are measured at DVDDIO = 3.3 V or 2.75 V. Use this value or SYS_CLK/2 whichever is smaller. 7 9 10 MMCx_CLK 13 14 VALID MMCx_CMD Figure 6-18. MMC/SD Host Command Write Timing 9 10 7 MMCx_CLK 4 4 3 MMCx_Dx Start 3 D0 D1 Dx End Figure 6-19. MMC/SD Card Response Timing 86 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 9 7 10 MMCx_CLK 1 2 MMCx_CMD START XMIT Valid Valid Valid END Figure 6-20. MMC/SD Host Write Timing 7 9 10 MMCx_CLK 15 16 VALID MMCx_DAT Figure 6-21. MMC/SD Data Write Timing Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 87 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.11 Real-Time Clock (RTC) The VC5505 includes a Real-Time Clock (RTC) with its own separated power supply and isolation circuits. The separate supply and isolation circuits allow the RTC to run while the rest of the VC5505 device (Core and I/O) is powered off. All RTC registers are preserved (except for RTC Control and RTC Update Registers) and the counter continues to operate when the device is powered off. The RTC also has the capability to wakeup the device from idle states via alarms, periodic interrupts, or an external WAKEUP input. Additionally, the RTC is able to output an alarm or periodic interrupt on the WAKEUP pin to cause external power management to re-enable power to the DSP Core and I/O. The VC5505 RTC provides the following features: • 100-year calendar up to year 2099. • Counts seconds, minutes, hours, day of the week, date, month, and year with leap year compensation • Millisecond time correction • Binary-coded-decimal (BCD) representation of time, calendar, and alarm • 24-hour clock mode • Second, minute, hour, day, or week alarm interrupt • Periodic interrupt: every millisecond, second, minute, hour, or day • Alarm interrupt: precise time of day • Single interrupt to the DSP CPU • 32.768-kHz crystal oscillator with frequency calibration Control of the RTC is maintained through a set of I/O memory mapped registers (see Table 6-20). Note that any write to these registers will be synchronized to the RTC 32.768-KHz clock; thus, the CPU must run at least 3X faster than the RTC. Writes to these registers will not be evident until the next two 32.768-KHz clock cycles later. Furthermore, if the RTC Oscillator is disabled, no RTC register can be written to. The RTC has its own power-on-reset (POR) circuit which resets the registers in the RTC core domain when power is first applied to the CVDD_RTC power pin. The RTC flops are not reset by the device's RESET pin nor the digital core's POR (powergood signal) which monitors the DSP_LDOO voltage. The scratch registers in the RTC can be used to take advantage of this unique reset domain to keep track of when the DSP boots and whether the RTC time registers have already been initialized to the current clock time or whether the software needs to go into a routine to prompt the user to set the time/date. 88 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.11.1 RTC Peripheral Register Description(s) Table 6-20 shows the RTC registers. Table 6-20. Real-Time Clock (RTC) Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 1900h RTCINTEN 1901h RTCUPDATE RTC Interrupt Enable Register RTC Update Register 1904h RTCMIL Milliseconds Register 1905h RTCMILA Milliseconds Alarm Register 1908h RTCSEC Seconds Register 1909h RTCSECA 190Ch RTCMIN Seconds Alarm Register Minutes Register 190Dh RTCMINA Minutes Alarm Register 1910h RTCHOUR Hours Register 1911h RTCHOURA 1914h RTCDAY 1915h RTCDAYA 1918h RTCMONTH Hours Alarm Register Days Register Days Alarm Register Months Register 1919h RTCMONTHA 191Ch RTCYEAR Months Alarm Register 191Dh RTCYEARA 1920h RTCINTFL 1921h RTCNOPWR RTC Lost Power Status Register 1924h RTCINTREG RTC Interrupt Register 1928h RTCDRIFT Years Register Years Alarm Register RTC Interrupt Flag Register RTC Compensation Register 192Ch RTCOSC 1930h RTCPMGT RTC Oscillator Register RTC Power Management Register 1960h RTCSCR1 RTC LSW Scratch Register 1 1961h RTCSCR2 RTC MSW Scratch Register 2 1964h RTCSCR3 RTC LSW Scratch Register 3 1965h RTCSCR4 RTC MSW Scratch Register 4 6.11.1.1 RTC Electrical Data/Timing For more detailed information on RTC electrical timings, specifically WAKEUP, see the Section 6.7.3, Reset Electrical Data/Timing. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 89 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.12 Inter-Integrated Circuit (I2C) The inter-integrated circuit (I2C) module provides an interface between VC5505 and other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1. External components attached to this 2-wire serial bus can transmit/receive 2 to 8-bit data to/from the DSP through the I2C module. The I2C port does not support CBUS compatible devices. The I2C port supports the following features: • Compatible with Philips I2C Specification Revision 2.1 (January 2000) • Data Transfer Rate from 10 kbps to 400 kbps (Philips Fast-Mode Rate) • Noise Filter to Remove Noise 50 ns or Less • Seven- and Ten-Bit Device Addressing Modes • Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality • One Read DMA Event and One Write DMA Event, which can be used by the DMA Controller • One Interrupt that can be used by the CPU • Slew-Rate Limited Open-Drain Output Buffers The I2C module clock must be in the range from 6.7 MHz to 13.3 MHz. This is necessary for proper operation of the I2C module. With the I2C module clock in this range, the noise filters on the SDA and SCL pins suppress noise that has a duration of 50 ns or shorter. The I2C module clock is derived from the DSP clock divided by a programmable prescaler. 90 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.12.1 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 I2C Peripheral Register Description(s) Table 6-21 shows the Inter-Integrated Circuit (I2C) registers. Table 6-21. Inter-Integrated Circuit (I2C) Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 1A00h ICOAR I2C Own Address Register 1A04h ICIMR I2C Interrupt Mask Register 1A08h ICSTR I2C Interrupt Status Register 1A0Ch ICCLKL I2C Clock Low-Time Divider Register 1A10h ICCLKH I2C Clock High-Time Divider Register 1A14h ICCNT I2C Data Count Register 1A18h ICDRR I2C Data Receive Register 1A1Ch ICSAR I2C Slave Address Register 1A20h ICDXR I2C Data Transmit Register 1A24h ICMDR I2C Mode Register 1A28h ICIVR I2C Interrupt Vector Register 1A2Ch ICEMDR I2C Extended Mode Register 1A30h ICPSC I2C Prescaler Register 1A34h ICPID1 I2C Peripheral Identification Register 1 1A38h ICPID2 I2C Peripheral Identification Register 2 Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 91 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.12.2 www.ti.com I2C Electrical Data/Timing Table 6-22. Timing Requirements for I2C Timings (1) (see Figure 6-22) CVDD = 1.05 V CVDD = 1.3 V NO. STANDARD MODE MIN (2) (3) (4) (5) (6) 92 MIN MAX 1 tc(SCL) Cycle time, SCL 10 2.5 µs 2 tsu(SCLH-SDAL) Setup time, SCL high before SDA low (for a repeated START condition) 4.7 0.6 µs 3 th(SCLL-SDAL) Hold time, SCL low after SDA low (for a START and a repeated START condition) 4 0.6 µs 4 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs 5 tw(SCLH) Pulse duration, SCL high 4 0.6 µs 6 tsu(SDAV-SCLH) Setup time, SDA valid before SCL high 250 100 (2) (3) (3) 7 (1) MAX UNIT FAST MODE th(SDA-SCLL) Hold time, SDA valid after SCL low 0 8 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 9 tr(SDA) Rise time, SDA (5) 1000 20 + 0.1Cb 300 ns 10 tr(SCL) Rise time, SCL (5) 1000 20 + 0.1Cb 300 ns 11 tf(SDA) Fall time, SDA (5) 300 20 + 0.1Cb 300 ns 12 tf(SCL) Fall time, SCL (5) 300 20 + 0.1Cb 300 ns 13 tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) 14 tw(SP) Pulse duration, spike (must be suppressed) 15 Cb (6) Capacitive load for each bus line 0 ns 0.9 (4) 1.3 4 (6) (6) (6) (6) µs 0.6 0 400 µs µs 50 ns 400 pF The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down. Also these pins are not 3.6 V-tolerant (their VIH cannot go above DVDDIO + 0.3 V). A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH)= 1000 + 250 = 1250 ns (according to the Standard-mode I2C-Bus Specification) before the SCL line is released. A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined region of the falling edge of SCL. The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal. The rise/fall times are measured at 30% and 70% of DVDDIO. The fall time is only slightly influenced by the external bus load (Cb) and external pullup resistor. However, the rise time (tr) is mainly determined by the bus load capacitance and the value of the pullup resistor. The pullup resistor must be selected to meet the I2C rise and fall time values specified. Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 11 9 SDA 6 8 14 4 13 5 10 SCL 1 12 3 2 7 3 Stop Start Repeated Start Stop Figure 6-22. I2C Receive Timings Table 6-23. Switching Characteristics for I2C Timings (1) (see Figure 6-23) CVDD = 1.05 V CVDD = 1.3 V NO. PARAMETER STANDARD MODE MIN 16 (1) (2) MAX UNIT FAST MODE MIN MAX tc(SCL) Cycle time, SCL 10 2.5 µs 17 td(SCLH-SDAL) Delay time, SCL high to SDA low (for a repeated START condition) 4.7 0.6 µs 18 td(SDAL-SCLL) Delay time, SDA low to SCL low (for a START and a repeated START condition) 4 0.6 µs 19 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs 20 tw(SCLH) Pulse duration, SCL high 4 0.6 µs 21 td(SDAV-SCLH) Delay time, SDA valid to SCL high 250 100 22 tv(SCLL-SDAV) Valid time, SDA valid after SCL low 0 0 23 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 24 tr(SDA) Rise time, SDA (2) 1000 20 + 0.1Cb 300 ns 25 tr(SCL) Rise time, SCL (2) 1000 20 + 0.1Cb 300 ns 26 tf(SDA) Fall time, SDA (2) 300 20 + 0.1Cb 300 ns 27 tf(SCL) Fall time, SCL (2) 300 20 + 0.1Cb 300 ns 28 td(SCLH-SDAH) Delay time, SCL high to SDA high (for STOP condition) 29 Cp Capacitance for each I2C pin 10 pF 4 (1) (1) (1) (1) ns 0.9 µs 0.6 10 µs µs Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed. The rise/fall times are measured at 30% and 70% of DVDDIO. The fall time is only slightly influenced by the external bus load (Cb) and external pullup resistor. However, the rise time (tr) is mainly determined by the bus load capacitance and the value of the pullup resistor. The pullup resistor must be selected to meet the I2C rise and fall time values specified. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 93 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 26 24 SDA 21 23 19 28 20 25 SCL 16 27 18 17 22 18 Stop Start Repeated Start Stop Figure 6-23. I2C Transmit Timings 94 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.13 Universal Asynchronous Receiver/Transmitter (UART) The UART performs serial-to-parallel conversions on data received from an external peripheral device and parallel-to-serial conversions on data transmitted to an external peripheral device via a serial bus. The VC5505 has one UART peripheral with the following features: • Programmable baud rates (frequency pre-scale values from 1 to 65535) • Fully programmable serial interface characteristics: – 5, 6, 7, or 8-bit characters – Even, odd, or no PARITY bit generation and detection – 1, 1.5, or 2 STOP bit generation • 16-byte depth transmitter and receiver FIFOs: – The UART can be operated with or without the FIFOs – 1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA • DMA signaling capability for both received and transmitted data • CPU interrupt capability for both received and transmitted data • False START bit detection • Line break generation and detection • Internal diagnostic capabilities: – Loopback controls for communications link fault isolation – Break, parity, overrun, and framing error simulation • Programmable autoflow control using CTS and RTS signals 6.13.1 UART Peripheral Register Description(s) Table 6-24 shows the UART registers. Table 6-24. UART Registers HEX ADDRESS RANGE ACRONYM 1B00h RBR Receiver Buffer Register (read only) 1B00h THR Transmitter Holding Register (write only) 1B02h IER Interrupt Enable Register 1B04h IIR Interrupt Identification Register (read only) 1B04h FCR FIFO Control Register (write only) 1B06h LCR Line Control Register REGISTER NAME 1B08h MCR Modem Control Register 1B0Ah LSR Line Status Register 1B0Ch MSR Modem Status Register 1B0Eh SCR Scratch Register 1B10h DLL Divisor LSB Latch 1B12h DLH Divisor MSB Latch 1B18h PWREMU_MGMT Copyright © 2009–2010, Texas Instruments Incorporated Power and Emulation Management Register Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 95 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.13.2 UART Electrical Data/Timing [Receive/Transmit] Table 6-25. Timing Requirements for UART Receive (1) (see Figure 6-24) CVDD = 1.05 V NO. CVDD = 1.3 V MIN MAX MIN MAX UNIT 4 tw(URXDB) Pulse duration, receive data bit (UART_RXD) [15/30/100 pF] U-3 U+3 U-3 U+3 ns 5 tw(URXSB) Pulse duration, receive start bit [15/30/100 pF] U-3 U+3 U-3 U+3 ns (1) U = UART baud time = 1/programmed baud rate. Table 6-26. Switching Characteristics Over Recommended Operating Conditions for UART Transmit (1) (see Figure 6-24) NO. 1 (1) CVDD = 1.05 V PARAMETER MIN CVDD = 1.3 V MAX f(baud) Maximum programmable bit rate 2 tw(UTXDB) Pulse duration, transmit data bit (UART_TXD) [15/30/100 pF] U-3 U+3 3 tw(UTXSB) Pulse duration, transmit start bit [15/30/100 pF] U-3 U+3 MIN 3.75 MAX UNIT 6.25 MHz U-3 U+3 ns U-3 U+3 ns U = UART baud time = 1/programmed baud rate. 3 2 UART_TXD Start Bit Data Bits 5 4 UART_RXD Start Bit Data Bits Figure 6-24. UART Transmit/Receive Timing 96 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.14 Inter-IC Sound (I2S) The VC5505 I2S peripherals allow serial transfer of full-duplex streaming data, usually audio data, between the device and an external I2S peripheral device such as an audio codec. The VC5505 supports 4 independent dual-channel I2S peripherals, each with the following features: • Full-duplex (transmit and receive) dual-channel communication • Double buffered data registers that allow for continuous data streaming • I2S/Left-justified and DSP data format with a data delay of 1 or 2 bits • Data word-lengths of 8, 10, 12, 14, 16, 18, 20, 24, or 32 bits • Ability to sign-extend received data samples for easy use in signal processing algorithms • Programmable polarity for both frame synchronization and bit clocks • Stereo (in I2S/Left-justified or DSP data formats) or mono (in DSP data format) mode • Detection of over-run, under-run, and frame-sync error conditions 6.14.1 I2S Peripheral Register Description(s) Table 6-27 through Table 6-30 show the I2S0 through I2S3 registers. Table 6-27. I2S0 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 2800h I2S0SCTRL I2S0 Serializer Control Register 2804h I2S0SRATE I2S0 Sample Rate Generator Register 2808h I2S0TXLT0 I2S0 Transmit Left Data 0 Register 2809h I2S0TXLT1 I2S0 Transmit Left Data 1 Register 280Ch I2S0TXRT0 I2S0 Transmit Right Data 0 Register 280Dh I2S0TXRT1 I2S0 Transmit Right Data 1 Register 2810h I2S0INTFL I2S0 Interrupt Flag Register 2814h I2S0INTMASK I2S0 Interrupt Mask Register 2828h I2S0RXLT0 I2S0 Receive Left Data 0 Register 2829h I2S0RXLT1 I2S0 Receive Left Data 1 Register 282Ch I2S0RXRT0 I2S0 Receive Right Data 0 Register 282Dh I2S0RXRT1 I2S0 Receive Right Data 1 Register Table 6-28. I2S1 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 2900h I2S1SCTRL I2S1 Serializer Control Register 2904h I2S1SRATE I2S1 Sample Rate Generator Register 2908h I2S1TXLT0 I2S1 Transmit Left Data 0 Register 2909h I2S1TXLT1 I2S1 Transmit Left Data 1 Register 290Ch I2S1TXRT0 I2S1 Transmit Right Data 0 Register 290Dh I2S1TXRT1 I2S1 Transmit Right Data 1 Register 2910h I2S1INTFL I2S1 Interrupt Flag Register 2914h I2S1INTMASK I2S1 Interrupt Mask Register 2928h I2S1RXLT0 I2S1 Receive Left Data 0 Register 2929h I2S1RXLT1 I2S1 Receive Left Data 1 Register 292Ch I2S1RXRT0 I2S1 Receive Right Data 0 Register 292Dh I2S1RXRT1 I2S1 Receive Right Data 1 Register Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 97 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-29. I2S2 Registers HEX ADDRESS RANGE ACRONYM REGISTER NAME 2A00h I2S2SCTRL I2S2 Serializer Control Register 2A04h I2S2SRATE I2S2 Sample Rate Generator Register 2A08h I2S2TXLT0 I2S2 Transmit Left Data 0 Register 2A09h I2S2TXLT1 I2S2 Transmit Left Data 1 Register 2A0Ch I2S2TXRT0 I2S2 Transmit Right Data 0 Register 2A0Dh I2S2TXRT1 I2S2 Transmit Right Data 1 Register 2A10h I2S2INTFL I2S2 Interrupt Flag Register 2A14h I2S2INTMASK I2S2 Interrupt Mask Register 2A28h I2S2RXLT0 I2S2 Receive Left Data 0 Register 2A29h I2S2RXLT1 I2S2 Receive Left Data 1 Register 2A2Ch I2S2RXRT0 I2S2 Receive Right Data 0 Register 2A2Dh I2S2RXRT1 I2S2 Receive Right Data 1 Register Table 6-30. I2S3 Registers HEX ADDRESS RANGE 98 ACRONYM REGISTER NAME 2B00h I2S3SCTRL I2S3 Serializer Control Register 2B04h I2S3SRATE I2S3 Sample Rate Generator Register 2B08h I2S3TXLT0 I2S3 Transmit Left Data 0 Register 2B09h I2S3TXLT1 I2S3 Transmit Left Data 1 Register 2B0Ch I2S3TXRT0 I2S3 Transmit Right Data 0 Register 2B0Dh I2S3TXRT1 I2S3 Transmit Right Data 1 Register 2B10h I2S3INTFL I2S3 Interrupt Flag Register 2B14h I2S3INTMASK I2S3 Interrupt Mask Register 2B28h I2S3RXLT0 I2S3 Receive Left Data 0 Register 2B29h I2S3RXLT1 I2S3 Receive Left Data 1 Register 2B2Ch I2S3RXRT0 I2S3 Receive Right Data 0 Register 2B2Dh I2S3RXRT1 I2S3 Receive Right Data 1 Register Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.14.2 I2S Electrical Data/Timing Table 6-31. Timing Requirements for I2S [I/O = 3.3 V, 2.8 V, and 2.5 V] (1) (see Figure 6-25) MASTER NO. CVDD = 1.05 V MIN RXV) tsu(FSV9 CLKH) tsu(FSVCLKL) th(CLKH10 FSV) th(CLKL-FSV) (1) (2) (3) MIN UNIT MAX 20 20 20 20 ns 20 20 20 20 ns Setup time, I2S_RX valid before I2S CLK high (CLKPOL = 0) 5 5 5 5 ns Setup time, I2S_RX valid before I2S_CLK low (CLKPOL = 1) 5 5 5 5 ns Hold time, I2S_RX valid after I2S_CLK high (CLKPOL = 0) 7 7 2 2 ns Hold time, I2S_RX valid after I2S_CLK low (CLKPOL = 1) 7 7 2 2 ns Setup time, I2S_FS valid before I2S_CLK high (CLKPOL = 0) – – 15 15 ns Setup time, I2S_FS valid before I2S_CLK low (CLKPOL = 1) – – 15 15 ns Hold time, I2S_FS valid after I2S_CLK high (CLKPOL = 0) – – tw(CLKH) + 0.6 (3) tw(CLKH) + 0.6 (3) ns Hold time, I2S_FS valid after I2S_CLK low (CLKPOL = 1) – – tw(CLKL) + 0.6 (3) tw(CLKL) + 0.6 (3) ns tsu(RXV- th(CLKL- CVDD = 1.3 V Pulse duration, I2S_CLK low tw(CLKL) 8 MAX Pulse duration, I2S_CLK high tw(CLKH) RXV) MIN ns 3 th(CLKH- CVDD = 1.05 V 40 or 2P (1) (2) 2 CLKL) MAX 40 or 2P (1) (2) Cycle time, I2S_CLK tsu(RXV- MIN 40 or 2P (1) (2) tc(CLK) CLKH) CVDD = 1.3 V 40 or 2P (1) (2) 1 7 MAX SLAVE P = SYSCLK period in ns. For example, when running parts at 100 MHz, use P = 10 ns. Use whichever value is greater. In Slave Mode, I2S_FS is required to be latched on both edges of I2S input clock (I2S_CLK). Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 99 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-32. Timing Requirements for I2S [I/O = 1.8 V] (1) (see Figure 6-25) MASTER NO. CVDD = 1.05 V MIN RXV) tsu(FSV9 CLKH) tsu(FSVCLKL) th(CLKH10 FSV) th(CLKL-FSV) (1) (2) (3) 100 MIN UNIT MAX 25 20 25 20 ns 25 20 25 20 ns Setup time, I2S_RX valid before I2S CLK high (CLKPOL = 0) 5 5 5 5 ns Setup time, I2S_RX valid before I2S_CLK low (CLKPOL = 1) 5 5 5 5 ns Hold time, I2S_RX valid after I2S_CLK high (CLKPOL = 0) 7 7 2 2 ns Hold time, I2S_RX valid after I2S_CLK low (CLKPOL = 1) 7 7 2 2 ns Setup time, I2S_FS valid before I2S_CLK high (CLKPOL = 0) – – 15 15 ns Setup time, I2S_FS valid before I2S_CLK low (CLKPOL = 1) – – 15 15 ns Hold time, I2S_FS valid after I2S_CLK high (CLKPOL = 0) – – tw(CLKH) + 0.6 (3) tw(CLKH) + 0.6 (3) ns Hold time, I2S_FS valid after I2S_CLK low (CLKPOL = 1) – – tw(CLKL) + 0.6 (3) tw(CLKL) + 0.6 (3) ns tsu(RXV- th(CLKL- CVDD = 1.3 V Pulse duration, I2S_CLK low tw(CLKL) 8 MAX Pulse duration, I2S_CLK high tw(CLKH) RXV) MIN ns 3 th(CLKH- CVDD = 1.05 V 40 or 2P (1) (2) 2 CLKL) MAX 50 or 2P (1) (2) Cycle time, I2S_CLK tsu(RXV- MIN 40 or 2P (1) (2) tc(CLK) CLKH) CVDD = 1.3 V 50 or 2P (1) (2) 1 7 MAX SLAVE P = SYSCLK period in ns. For example, when running parts at 100 MHz, use P = 10 ns. Use whichever value is greater. In Slave Mode, I2S_FS is required to be latched on both edges of I2S input clock (I2S_CLK). Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-33. Switching Characteristics Over Recommended Operating Conditions for I2S Output [I/O = 3.3 V, 2.8 V, or 2.5 V] (see Figure 6-25) MASTER NO. PARAMETER MIN 1 2 3 4 MAX 40 or 2P (1) MIN MAX MIN MAX 40 or 2P (1) ns 20 20 ns 20 20 20 ns 20 20 20 ns 20 20 20 ns 40 or 2P (1) (2) 20 20 Pulse duration, I2S_CLK low (CLKPOL = 1) 20 Pulse duration, I2S_CLK low (CLKPOL = 0) 20 tw(CLKH) Pulse duration, I2S_CLK high (CLKPOL = 1) 20 tdmax(CLKL- Output Delay time, I2S_CLK low to I2S_DX valid (CLKPOL = 0) 15 14 12 12 ns Output Delay time, I2S_CLK high to I2S_DX valid (CLKPOL = 1) 15 14 12 12 ns tw(CLKH) Pulse duration, I2S_CLK high (CLKPOL = 0) tw(CLKL) tw(CLKL) DXV) tdmax(CLKH- (2) toh(DXV-CLKH) Output Hold time, I2S_CLK high to I2S_DX invalid (CLKPOL = 0) 0 0 0 0 ns toh(DXV- Output Hold time, I2S_CLK low to I2S_DX invalid (CLKPOL = 1) 0 0 0 0 ns tdmax(CLKLFSV) tdmax(CLKHFSV) (1) (2) MIN (2) Cycle time, I2S_CLK CLKL) 6 MAX 40 or 2P (1) (2) tc(CLK) DXV) 5 SLAVE CVDD = 1.05 V CVDD = 1.3 V CVDD = 1.05 V CVDD = 1.3 V UNIT Delay time, I2S_CLK low to I2S_FS valid (CLKPOL = 0) 14 14 – – ns Delay time, I2S_CLK high to I2S_FS valid (CLKPOL = 1) 14 14 – – ns P = SYSCLK period in ns. For example, when running parts at 100 MHz, use P = 10 ns. Use whichever value is greater. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 101 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-34. Switching Characteristics Over Recommended Operating Conditions for I2S Output [I/O = 1.8 V] (see Figure 6-25) MASTER NO. PARAMETER MIN 1 2 3 4 40 or 2P (1) MAX MIN MAX 40 or 2P (1) ns 25 20 ns 20 25 20 ns 20 25 20 ns 20 25 20 ns Pulse duration, I2S_CLK low (CLKPOL = 1) 25 Pulse duration, I2S_CLK low (CLKPOL = 0) 25 tw(CLKH) Pulse duration, I2S_CLK high (CLKPOL = 1) 25 tdmax(CLKL- Output Delay time, I2S_CLK low to I2S_DX valid (CLKPOL = 0) 19 14 15 12 ns Output Delay time, I2S_CLK high to I2S_DX valid (CLKPOL = 1) 19 14 15 12 ns tw(CLKL) tw(CLKL) DXV) tdmax(CLKH- 50 or 2P (1) (2) MIN 20 Pulse duration, I2S_CLK high (CLKPOL = 0) (2) toh(DXV-CLKH) Output Hold time, I2S_CLK high to I2S_DX invalid (CLKPOL = 0) 0 0 0 0 ns toh(DXV- Output Hold time, I2S_CLK low to I2S_DX invalid (CLKPOL = 1) 0 0 0 0 ns FSV) tdmax(CLKHFSV) 102 MAX 25 tw(CLKH) tdmax(CLKL- (1) (2) MIN 50 or 2P (1) (2) Cycle time, I2S_CLK CLKL) 6 MAX (2) tc(CLK) DXV) 5 SLAVE CVDD = 1.05 V CVDD = 1.3 V CVDD = 1.05 V CVDD = 1.3 V UNIT Delay time, I2S_CLK low to I2S_FS valid (CLKPOL = 0) 14 14 – – ns Delay time, I2S_CLK high to I2S_FS valid (CLKPOL = 1) 14 14 – – ns P = SYSCLK period in ns. For example, when running parts at 100 MHz, use P = 10 ns. Use whichever value is greater. Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 1 2 3 I2S_CLK (CLKPOL = 0) I2S_CLK (CLKPOL = 1) 6 I2S_FS (Output, MODE = 1) 9 10 I2S_FS (Input, MODE = 0) 5 4 I2S_DX 7 8 I2S_RX Figure 6-25. I2S Input and Output Timings Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 103 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.15 Liquid Crystal Display Controller (LCDC) The VC5505 includes a LCD Interface Display Driver (LIDD) controller. The LIDD Controller supports the asynchronous LCD interface and has the following features: • Provides full-timing programmability of control signals and output data Note: Raster mode is not supported on this device. The LCD controller is responsible for generating the correct external timing. The DMA engine provides a constant flow of data from the frame buffer(s) to the external LCD panel via the LIDD controller. In addition, CPU access is provided to read and write registers. 6.15.1 LCDC Peripheral Register Description(s) Table 6-35 shows the LCDC peripheral registers. Table 6-35. LCD Controller Registers CPU WORD ADDRESS ACRONYM REGISTER DESCRIPTION 2E00h LCDREVMIN LCD Minor Revision Register 2E01h LCDREVMAJ LCD Major Revision Register 2E04h LCDCR LCD Control Register 2E08h LCDSR LCD Status Register 2E0Ch LCDLIDDCR 2E10h LCDLIDDCS0CONFIG0 LCD LIDD CS0 Configuration Register 0 2E11h LCDLIDDCS0CONFIG1 LCD LIDD CS0 Configuration Register 1 2E14h LCDLIDDCS0ADDR LCD LIDD CS0 Address Read/Write Register 2E18h LCDLIDDCS0DATA LCD LIDD CS0 Data Read/Write Register 2E1Ch LCDLIDDCS1CONFIG0 LCD LIDD CS1 Configuration Register 0 2E1Dh LCDLIDDCS1CONFIG1 LCD LIDD CS1 Configuration Register 1 2E20h LCDLIDDCS1ADDR LCD LIDD CS1 Address Read/Write Register LCD LIDD CS1 Data Read/Write Register LCD LIDD Control Register 2E24h LCDLIDDCS1DATA 2E28h – 2E3Ah — 2E40h LCDDMACR 2E44h LCDDMAFB0BAR0 LCD DMA Frame Buffer 0 Base Address Register 0 2E45h LCDDMAFB0BAR1 LCD DMA Frame Buffer 0 Base Address Register 1 2E48h LCDDMAFB0CAR0 LCD DMA Frame Buffer 0 Ceiling Address Register 0 2E49h LCDDMAFB0CAR1 LCD DMA Frame Buffer 0 Ceiling Address Register 1 2E4Ch LCDDMAFB1BAR0 LCD DMA Frame Buffer 1 Base Address Register 0 2E4Dh LCDDMAFB1BAR1 LCD DMA Frame Buffer 1 Base Address Register 1 2E50h LCDDMAFB1CAR0 LCD DMA Frame Buffer 1 Ceiling Address Register 0 2E51h LCDDMAFB1CAR1 LCD DMA Frame Buffer 1 Ceiling Address Register 1 104 Reserved LCD DMA Control Register Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.15.2 LCDC Electrical Data/Timing Table 6-36. Timing Requirements for LCD LIDD Mode (1) (see Figure 6-26 through Figure 6-33) CVDD = 1.05 V NO. MIN CVDD = 1.3 V MAX MIN MAX UNIT 16 tsu(LCD_D-CLK) Setup time, LCD_D[15:0] valid before LCD_CLK rising edge 25 40 ns 17 th(CLK-LCD_D) Hold time, LCD_D[15:0] valid after LCD_CLK rising edge 0 0 ns (1) Over operating free-air temperature range (unless otherwise noted) Table 6-37. Switching Characteristics Over Recommended Operating Conditions for LCD LIDD Mode (see Figure 6-26 through Figure 6-33) NO. CVDD = 1.05 V PARAMETER MIN 4 td(LCD_D_V) Delay time, LCD_CLK rising edge to LCD_D[15:0] valid (write) 5 td(LCD_D_I) Delay time, LCD_CLK rising edge to LCD_D[15:0] invalid (write) 6 td(LCD_E_A) Delay time, LCD_CLK rising edge to LCD_CSx_Ex low 7 td(LCD_E_I) Delay time, LCD_CLKrising edge to LCD_CSx_Ex high 8 td(LCD_A_A) Delay time, LCD_CLKrising edge to LCD_RS low 9 td(LCD_A_I) Delay time, LCD_CLK rising edge to LCD_RS high 10 td(LCD_W_A) Delay time, LCD_CLK rising edge to LCD_RW_WRB low 11 td(LCD_W_I) Delay time, LCD_CLK rising edge to LCD_RW_WRB high 12 td(LCD_STRB_A) Delay time, LCD_CLK rising edge to LCD_EN_RDB high 13 td(LCD_STRB_I) Delay time, LCD_CLK rising edge to LCD_EN_RDB low 14 td(LCD_D_Z) Delay time, LCD_CLK rising edge to LCD_D[15:0] in 3-state 15 td(Z_LCD_D) Delay time, LCD_CLK rising edge to LCD_D[15:0] valid from 3-state Copyright © 2009–2010, Texas Instruments Incorporated CVDD = 1.3 V MAX MIN 10 -6 15 -6 10 -6 -6 -6 -6 -6 -6 -6 ns ns ns 15 -6 10 ns ns 15 10 ns ns 15 10 UNIT ns 15 10 -6 MAX ns ns 15 -6 Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 ns ns 105 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 W_SU (0 to 31) LCD_CLK [Internal] www.ti.com CS_DELAY (0 to 3) W_STROBE (1 to 63) R_SU (0 to 31) R_HOLD (1 to 15) W_HOLD (1 to 15) 4 CS_DELAY (0 to 3) R_STROBE (1 to 63) 5 14 17 16 LCD_D[15:0] 15 Write Data Data[7:0] Read Status 8 9 LCD_RS RS 10 11 LCD_RW_WRB R/W 12 12 13 13 E0 E1 LCD_CSx_Ex Figure 6-26. Character Display HD44780 Write W_HOLD (1–15) R_SU (0–31) R_STROBE R_HOLD CS_DELAY (1–63) (1–5) (0-3) (0–31) W_SU 17 15 4 W_STROBE CS_DELAY (1–63) (0 - 3) LCD_CLK [Internal] 14 16 LCD_D[7:0] 5 Data[7:0] Write Instruction Read Data 8 9 RS LCD_RS 10 11 LCD_RW_WRB R/W 12 13 LCD_CSx_Ex 12 13 E0 E1 Figure 6-27. Character Display HD44780 Read 106 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 W_HOLD (1-15) W_HOLD (1-15) W_SU (0-31) W_STROBE (1-63) CS_DELAY W_SU (0-3) (0-31) W_STROBE CS_DELAY (0-3) (1-63) LCD_CLK [Internal] 4 LCD_D[15:0] LCD_CSx_Ex (async mode) 5 5 4 Write Address Write Data 7 6 Data[15:0] 6 7 CS0 CS1 9 8 RS LCD_RS 10 11 11 10 R/W LCD_RW_WRB 12 13 12 13 EN LCD_EN_RDB Figure 6-28. Micro-Interface Graphic Display 6800 Write Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 107 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com W_HOLD (1-15) W_SU (0-31) W_STROBE R_SU (0-31) CS_DELAY (1-63) R_STROBE (1-63 (0-3) R_HOLD CS_DELAY (1-15) (0-3) 17 15 LCD_CLK [Internal] 5 4 LCD_D[15:0] 14 16 Write Address Data[15:0] 6 7 Read Data 6 LCD_CSx_Ex (Async Mode) 7 CS0 CS1 9 8 LCD_RS RS 10 11 LCD_RW_WRB R/W 12 13 12 13 LCD_EN_RDB EN Figure 6-29. Micro-Interface Graphic Display 6800 Read 108 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 R_SU (0-31) R_SU (0-31) R_STROBE R_HOLD CS_DELAY (1-63) (1-15) (0-3) 16 17 15 R_STROBE R_HOLD CS_DELAY (1-63) (1-15) (0-3) 17 15 LCD_CLK [Internal] 14 16 14 LCD_D[15:0] LCD_CSx_Ex (Async Mode) Data[15:0] Read Data 6 7 Read Status 6 7 CS0 CS1 8 9 LCD_RS RS LCD_RW_WRB R/W 12 13 12 13 EN LCD_EN_RDB Figure 6-30. Micro-Interface Graphic Display 6800 Status Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 109 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com W_HOLD (1-15) W_HOLD (1-15) W_SU W_STROBE CS_DELAY W_SU (0-31) (1-63) (0-3) (0-31) W_STROBE CS_DELAY (1-63) (0 - 3) LCD_CLK [Internal] 4 LCD_D[15:0] LCD_CSx_Ex (Async Mode) 5 4 Write Address 5 DATA[15:0] Write Data 7 6 6 7 CS0 CS1 8 9 LCD_RS RS 10 11 10 11 LCD_RW_WRB WRB LCD_EN_RDB RDB Figure 6-31. Micro-Interface Graphic Display 8080 Write 110 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 W_HOLD (1-15) W_SU (0-31) W_STROBE R_SU (0-31) CS_DELAY (1-63) R_STROBE (0-3) R_HOLD CS_DELAY (1-63) (1-15) (0-3) 16 17 15 LCD_CLK [Internal] 4 LCD_D[15:0] 5 14 Data[15:0] Write Address 6 7 LCD_CSx_Ex (async mode) 6 Read Data 7 CS0 CS1 9 8 LCD_RS RS 10 11 WRB LCD_RW_WRB 12 13 RDB LCD_EN_RDB Figure 6-32. Micro-Interface Graphic Display 8080 Read Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 111 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com R_SU (0-31) R_SU (0-31) R_STROBE (1-63) R_HOLD (1-15) CS_DELAY R_STROBE R_HOLD (0-3) (1-63) (1-15) 16 17 CS_DELAY (0-3) LCD_CLK [Internal] 14 16 17 15 14 15 Data[15:0] LCD_D[15:0] Read Data Read Status 7 6 6 7 LCD_CSx_Ex CS0 CS1 8 9 LCD_RS RS LCD_RW_WRB WRB 12 13 12 13 RDB LCD_PCLK Figure 6-33. Micro-Interface Graphic Display 8080 Status 112 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.15.2.1 10-Bit SAR ADC The VC5505 includes a 10-bit SAR ADC using a switched capacitor architecture which converts an analog input signal to a digital value at a maximum rate of 62.5-k samples per second (ksps) for use by the DSP. This SAR module supports six channels that are connected to four general purpose analog pins (GPAIN [3:0]) which can be used as general purpose outputs. The VC5505 SAR supports the following features: • Up to 62.5 ksps (2-MHz clock with 32 cycles per conversion) • Single conversion and continuous back-to-back conversion modes • Interrupt driven or polling conversion or DMA event generation • Internal configurable bandgap reference voltages of 1 V or 0.8 V; or external Vref of VDDA_ANA • One 3.6-V Tolerant analog input (GPAIN0) with internal voltage division for conversion of battery voltage • Software controlled power down • Individually configurable general-purpose digital outputs 6.15.2.1.1 SAR ADC Peripheral Register Description(s) Table 6-38 shows the SAR ADC peripheral registers. Table 6-38. SAR Analog Control Registers CPU WORD ADDRESS ACRONYM REGISTER DESCRIPTION 7012h SARCTRL SAR A/D Control Register 7014h SARDATA SAR A/D Data Register 7016h SARCLKCTRL SAR A/D Clock Control Register 7018h SARPINCTRL SAR A/D Reference and Pin Control Register 701Ah SARGPOCTRL SAR A/D GPO Control Register 6.15.2.1.2 SAR ADC Electrical Data/Timing Table 6-39. Switching Characteristics Over Recommended Operating Conditions for ADC Characteristics NO. PARAMETER CVDD = 1.3 V CVDD = 1.05 V MIN TYP UNIT MAX 1 tC(SCLC) Cycle time, ADC internal conversion clock 3 td(CONV) Delay time, ADC conversion time 4 SDNL Static differential non-linearity error (DNL measured for 9 bits) 5 SINL Static integral non-linearity error 6 Zset Zero-scale offset error 2 LSB 7 Fset Full-scale offset error 2 LSB 8 Analog input impedance 9 Signal-to-noise ratio Copyright © 2009–2010, Texas Instruments Incorporated 2 32tC(SCLC) MHz ns ±0.6 LSB ±1 LSB 1 MΩ 54 Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 dB 113 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.16 Serial Port Interface (SPI) The VC5505 serial port interface (SPI) is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed length (1 to 32 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI supports multi-chip operation of up to four SPI slave devices. The SPI can operate as a master device only, slave mode is not supported. The SPI is normally used for communication between the DSP and external peripherals. Typical applications include an interface to external I/O or peripheral expansion via devices such as shift registers, display drivers, SPI EEPROMs, and analog-to-digital converters. The SPI has the following features: • Programmable divider for serial data clock generation • Four pin interface (SPI_CLK, SPI_CSn, SPI_RX, and SPI_TX) • Programmable data length (1 to 32 bits) • 4 external chip select signals • Programmable transfer or frame size (1 to 4096 characters) • Optional interrupt generation on character completion • Programmable SPI_CSn to SPI_TX delay from 0 to 3 SPI_CLK cycles • Programmable signal polarities • Programmable active clock edge • Internal loopback mode for testing 6.16.1 SPI Peripheral Register Description(s) Table 6-40 shows the SPI registers. Table 6-40. SPI Module Registers 114 CPU WORD ADDRESS ACRONYM 3000h SPICDR Clock Divider Register 3001h SPICCR Clock Control Register 3002h SPIDCR1 Device Configuration Register 1 3003h SPIDCR2 Device Configuration Register 2 3004h SPICMD1 Command Register 1 3005h SPICMD2 Command Register 2 3006h SPISTAT1 Status Register 1 3007h SPISTAT2 Status Register 2 3008h SPIDAT1 Data Register 1 3009h SPIDAT2 Data Register 2 REGISTER NAME Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.16.2 SPI Electrical Data/Timing Table 6-41. Timing Requirements for SPI input (see Figure 6-34 through Figure 6-37) CVDD = 1.05 V NO. MIN Pulse duration, SPI_CLK high 30 19 ns Pulse duration, SPI_CLK low 30 19 ns Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 0 15 13 ns Setup time, SPI_RX valid before SPI_CLK low, SPI Mode 1 15 13 ns Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 2 15 13 ns Setup time, SPI_RX valid before SPI_CLK high, SPI Mode 3 15 13 ns Hold time, SPI_RX vaild after SPI_CLK high, SPI Mode 0 0 0 ns Hold time, SPI_RX vaild after SPI_CLK low, SPI Mode 1 0 0 ns Hold time, SPI_RX vaild after SPI_CLK low, SPI Mode 2 0 0 ns Hold time, SPI_RX vaild after SPI_CLK high, SPI Mode 3 0 0 ns 6 tw(SCLKH) 7 tw(SCLKL) (1) (2) th(SCLK-SRXV) UNIT MAX ns Cycle time, SPI_CLK 9 MIN 40 or 4P (1) (2) tC(SCLK) tsu(SRXV-SCLK) MAX 66.4 or 4P (1) (2) 5 8 CVDD = 1.3 V P = SYSCLK period in ns. For example, when running parts at 100 MHz, use P = 10 ns. Use whichever value is greater. Table 6-42. Switching Characteristics Over Recommended Operating Conditions for SPI Outputs (see Figure 6-34 through Figure 6-37) NO. 1 2 3 4 (1) CVDD = 1.05 V PARAMETER td(SCLK-STXV) toh(SCLK-STXIV) MIN CVDD = 1.3 V MAX MIN MAX UNIT Delay time, SPI_CLK low to SPI_TX vaild, SPI Mode 0 8 5 ns Delay time, SPI_CLK high to SPI_TX vaild, SPI Mode 1 8 5 ns Delay time, SPI_CLK high to SPI_TX vaild, SPI Mode 2 8 5 ns Delay time, SPI_CLK low to SPI_TX vaild, SPI Mode 3 8 5 ns Output hold time, SPI_CLK high to SPI_TX invaild, SPI Mode 0 tw(SCLKH) - 4 tw(SCLKH) 4.5 ns Output hold time, SPI_CLK low to SPI_TX invaild, SPI Mode 1 tw(SCLKL) - 4 tw(SCLKL) 4.5 ns Output hold time, SPI_CLK low to SPI_TX invaild, SPI Mode 2 tw(SCLKL) - 4 tw(SCLKL) 4.5 ns Output hold time, SPI_CLK high to SPI_TX invaild, SPI Mode 3 tw(SCLKH) - 4 tw(SCLKH) 4.5 td(SPICS-SCLK) Delay time, SPI_CS active to SPI_CLK active toh(SCLKI-SPICSI) Output hold time, SPI_CS inactive to SPI_CLK inactive tC - 8 + D 0.5tC - 2 (1) ns tC - 8 + D (1) 0.5tC - 2 ns ns D is the programable data delay in ns. Data delay can be programmed to 0, 1, 2, or 3 SPICLK clock cycles. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 115 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 5 7 6 SPI_CLK 1 SPI_TX B0 SPI_RX B0 2 B1 B1 8 3 Bn-2 Bn-1 Bn-2 Bn-1 9 4 SPI_CS A. B. Character length is programmable between 1 and 32 bits; 8-bit character length shown. Polarity of SPI_CSn is configurable, active-low polarity is shown. Figure 6-34. SPI Mode 0 Transfer (CKPn = 0, CKPHn = 0) 5 7 6 SPI_CLK 2 1 B0 SPI_TX B1 SPI_RX 8 3 B1 Bn-2 Bn-1 B1 Bn-2 Bn-1 9 4 SPI_CS A. B. Character length is programmable between 1 and 32 bits; 8-bit character length shown. Polarity of SPI_CSn is configurable, active-low polarity is shown. Figure 6-35. SPI Mode 1 Transfer (CKPn = 0, CKPHn = 1) 5 6 7 SPI_CLK 1 SPI_TX SPI_RX B0 B1 B0 B1 2 Bn-2 Bn-1 Bn-2 8 3 Bn-1 4 9 SPI_CS A. B. Character length is programmable between 1 and 32 bits; 8-bit character length shown. Polarity of SPI_CSn is configurable, active-low polarity is shown. Figure 6-36. SPI Mode 2 Transfer (CKPn = 1, CKPHn = 0) 5 6 7 SPI_CLK 2 1 B0 SPI_TX B0 SPI_RX SPI_CS A. B. 3 8 B1 Bn-2 Bn-1 B1 Bn-2 Bn-1 9 4 Character length is programmable between 1 and 32 bits; 8-bit character length shown. Polarity of SPI_CSn is configurable, active-low polarity is shown. Figure 6-37. SPI Mode 3 Transfer (CKPn = 1, CKPHn = 1) 116 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.17 Universal Serial Bus (USB) 2.0 Controller The VC5505 USB2.0 peripheral supports the following features: • USB 2.0 peripheral at speeds high-speed (480 Mb/s) and full-speed (12 Mb/s) • All transfer modes (control, bulk, interrupt, and isochronous asynchronous mode) • 4 Transmit (TX) and 4 Receive (RX) Endpoints in addition to Control Endpoint 0 • FIFO RAM – 4K endpoint – Programmable size • Integrated USB 2.0 High Speed PHY • RNDIS mode for accelerating RNDIS type protocols using short packet termination over USB The USB2.0 peripheral on this device, does not support: • Host Mode (Peripheral/Device Modes supported only) • On-Chip Charge Pump • On-the-Go (OTG) Mode 6.17.1 USB2.0 Peripheral Register Description(s) Table 6-43 lists of the USB2.0 peripheral registers. Table 6-43. Universal Serial Bus (USB) Registers (1) (1) CPU WORD ADDRESS ACRONYM 8000h REVID1 Revision Identification Register 1 8001h REVID2 Revision Identification Register 2 8004h CTRLR Control Register 8008h STATR Status Register 800Ch EMUR Emulation Register 8010h MODER1 Mode Register 1 8011h MODER2 Mode Register 2 8014h AUTOREQ 8018h SRPFIXTIME1 SRP Fix Time Register 1 8019h SRPFIXTIME2 SRP Fix Time Register 2 801Ch TEARDOWN1 Teardown Register 1 801Dh TEARDOWN2 Teardown Register 2 8020h INTSRCR1 USB Interrupt Source Register 1 8021h INTSRCR2 USB Interrupt Source Register 2 8024h INTSETR1 USB Interrupt Source Set Register 1 8025h INTSETR2 USB Interrupt Source Set Register 2 8028h INTCLRR1 USB Interrupt Source Clear Register 1 8029h INTCLRR2 USB Interrupt Source Clear Register 2 802Ch INTMSKR1 USB Interrupt Mask Register 1 802Dh INTMSKR2 USB Interrupt Mask Register 2 8030h INTMSKSETR1 USB Interrupt Mask Set Register 1 8031h INTMSKSETR2 USB Interrupt Mask Set Register 2 8034h INTMSKCLRR1 USB Interrupt Mask Clear Register 1 8035h INTMSKCLRR2 USB Interrupt Mask Clear Register 2 8038h INTMASKEDR1 USB Interrupt Source Masked Register 1 REGISTER DESCRIPTION Auto Request Register Before reading or writing to the USB registers, be sure to set the BYTEMODE bits to "00b" in the USB system control register to enable word accesses to the USB registers . Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 117 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-43. Universal Serial Bus (USB) Registers CPU WORD ADDRESS ACRONYM (1) (continued) REGISTER DESCRIPTION 8039h INTMASKEDR2 803Ch EOIR USB Interrupt Source Masked Register 2 8040h INTVECTR1 USB Interrupt Vector Register 1 8041h INTVECTR2 USB Interrupt Vector Register 2 8050h GREP1SZR1 Generic RNDIS EP1Size Register 1 8051h GREP1SZR2 Generic RNDIS EP1Size Register 2 8054h GREP2SZR1 Generic RNDIS EP2 Size Register 1 8055h GREP2SZR2 Generic RNDIS EP2 Size Register 2 8058h GREP3SZR1 Generic RNDIS EP3 Size Register 1 USB End of Interrupt Register 8059h GREP3SZR2 Generic RNDIS EP3 Size Register 2 805Ch GREP4SZR1 Generic RNDIS EP4 Size Register 1 805Dh GREP4SZR2 Generic RNDIS EP4 Size Register 2 8400h FADDR_POWER 8401h INTRTX Interrupt Register for Endpoint 0 plus Transmit Endpoints 1 to 4 8404h INTRRX Interrupt Register for Receive Endpoints 1 to 4 8405h INTRTXE Interrupt enable register for INTRTX 8408h INTRRXE Interrupt Enable Register for INTRRX 8409h INTRUSB_INTRUSBE 840Ch FRAME Common USB Registers 840Dh Function Address Register, Power Management Register Interrupt Register for Common USB Interrupts, Interrupt Enable Register Frame Number Register INDEX_TESTMODE Index Register for Selecting the Endpoint Status and Control Registers, Register to Enable the USB 2.0 Test Modes TXMAXP_INDX Maximum Packet Size for Peripheral/Host Transmit Endpoint. (Index register set to select Endpoints 1-4) USB Indexed Registers 8410h 8411h PERI_CSR0_INDX PERI_TXCSR_INDX 8414h 8415h 8418h RXMAXP_INDX Control Status Register for Endpoint 0 in Peripheral Mode. (Index register set to select Endpoint 0) Control Status Register for Peripheral Transmit Endpoint. (Index register set to select Endpoints 1-4) Maximum Packet Size for Peripheral/Host Receive Endpoint. (Index register set to select Endpoints 1-4) PERI_RXCSR_INDX Control Status Register for Peripheral Receive Endpoint. (Index register set to select Endpoints 1-4) COUNT0_INDX Number of Received Bytes in Endpoint 0 FIFO. (Index register set to select Endpoint 0) RXCOUNT_INDX Number of Bytes in Host Receive Endpoint FIFO. (Index register set to select Endpoints 1- 4) 8419h - Reserved 841Ch - Reserved 841Dh CONFIGDATA_INDC (Upper byte of 841Dh) 8420h FIFO0R1 Transmit and Receive FIFO Register 1 for Endpoint 0 8421h FIFO0R2 Transmit and Receive FIFO Register 2 for Endpoint 0 8424h FIFO1R1 Transmit and Receive FIFO Register 1 for Endpoint 1 8425h FIFO1R2 Transmit and Receive FIFO Register 2 for Endpoint 1 8428h FIFO2R1 Transmit and Receive FIFO Register 1 for Endpoint 2 8429h FIFO2R2 Transmit and Receive FIFO Register 2 for Endpoint 2 842Ch FIFO3R1 Transmit and Receive FIFO Register 1 for Endpoint 3 Returns details of core configuration. (index register set to select Endpoint 0) USB FIFO Registers 118 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-43. Universal Serial Bus (USB) Registers (1) (continued) CPU WORD ADDRESS ACRONYM 842Dh FIFO3R2 Transmit and Receive FIFO Register 2 for Endpoint 3 8430h FIFO4R1 Transmit and Receive FIFO Register 1 for Endpoint 4 8431h FIFO4R2 REGISTER DESCRIPTION Transmit and Receive FIFO Register 2 for Endpoint 4 Dynamic FIFO Control Registers 8460h 8461h - Reserved TXFIFOSZ_RXFIFOSZ Transmit Endpoint FIFO Size, Receive Endpoint FIFO Size (Index register set to select Endpoints 1-4) 8464h TXFIFOADDR Transmit Endpoint FIFO Address (Index register set to select Endpoints 1-4) 8465h RXFIFOADDR Receive Endpoint FIFO Address (Index register set to select Endpoints 1-4) 846Ch - Reserved Control and Status Register for Endpoint 0 8500h - Reserved 8501h PERI_CSR0 8504h - Reserved 8505h - Reserved 8508h COUNT0 Control Status Register for Peripheral Endpoint 0 Number of Received Bytes in Endpoint 0 FIFO 8509h - Reserved 850Ch - Reserved 850Dh CONFIGDATA (Upper byte of 850Dh) 8510h TXMAXP 8511h PERI_TXCSR 8514h RXMAXP 8515h PERI_RXCSR 8518h RXCOUNT Returns details of core configuration. Control and Status Register for Endpoint 1 Maximum Packet Size for Peripheral/Host Transmit Endpoint Control Status Register for Peripheral Transmit Endpoint (peripheral mode) Maximum Packet Size for Peripheral/Host Receive Endpoint Control Status Register for Peripheral Receive Endpoint (peripheral mode) Number of Bytes in the Receiving Endpoint's FIFO 8519h - Reserved 851Ch - Reserved 851Dh - Reserved 8520h TXMAXP 8521h PERI_TXCSR Control and Status Register for Endpoint 2 Maximum Packet Size for Peripheral/Host Transmit Endpoint Control Status Register for Peripheral Transmit Endpoint (peripheral mode) 8524h RXMAXP 8525h PERI_RXCSR Maximum Packet Size for Peripheral/Host Receive Endpoint 8528h RXCOUNT 8529h - Reserved 852Ch - Reserved 852Dh - Control Status Register for Peripheral Receive Endpoint (peripheral mode) Number of Bytes in Host Receive endpoint FIFO Reserved Control and Status Register for Endpoint 3 8530h TXMAXP 8531h PERI_TXCSR 8534h RXMAXP 8535h PERI_RXCSR 8538h RXCOUNT 8539h - Reserved 853Ch - Reserved 853Dh - Reserved Copyright © 2009–2010, Texas Instruments Incorporated Maximum Packet Size for Peripheral/Host Transmit Endpoint Control Status Register for Peripheral Transmit Endpoint (peripheral mode) Maximum Packet Size for Peripheral/Host Receive Endpoint Control Status Register for Peripheral Receive Endpoint (peripheral mode) Number of Bytes in Host Receive endpoint FIFO Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 119 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-43. Universal Serial Bus (USB) Registers CPU WORD ADDRESS ACRONYM 8540h TXMAXP 8541h PERI_TXCSR 8544h RXMAXP 8545h PERI_RXCSR 8548h RXCOUNT 8549h - Reserved 854Ch - Reserved 854Dh - Reserved 9000h - Reserved 9001h - Reserved (1) (continued) REGISTER DESCRIPTION Control and Status Register for Endpoint 4 Maximum Packet Size for Peripheral/Host Transmit Endpoint Control Status Register for Peripheral Transmit Endpoint (peripheral mode) Maximum Packet Size for Peripheral/Host Receive Endpoint Control Status Register for Peripheral Receive Endpoint (peripheral mode) Number of Bytes in Host Receive endpoint FIFO CPPI DMA (CMDA) Registers 120 9004h TDFDQ 9008h DMAEMU CDMA Teardown Free Descriptor Queue Control Register 9800h TXGCR1[0] Transmit Channel 0 Global Configuration Register 1 9801h TXGCR2[0] Transmit Channel 0 Global Configuration Register 2 9808h RXGCR1[0] Receive Channel 0 Global Configuration Register 1 9809h RXGCR2[0] Receive Channel 0 Global Configuration Register 2 980Ch RXHPCR1A[0] Receive Channel 0 Host Packet Configuration Register 1 A 980Dh RXHPCR2A[0] Receive Channel 0 Host Packet Configuration Register 2 A 9810h RXHPCR1B[0] Receive Channel 0 Host Packet Configuration Register 1 B 9811h RXHPCR2B[0] Receive Channel 0 Host Packet Configuration Register 2 B 9820h TXGCR1[1] Transmit Channel 1 Global Configuration Register 1 9821h TXGCR2[1] Transmit Channel 1 Global Configuration Register 2 9828h RXGCR1[1] Receive Channel 1 Global Configuration Register 1 Receive Channel 1 Global Configuration Register 2 CDMA Emulation Control Register 9829h RXGCR2[1] 982Ch RXHPCR1A[1] Receive Channel 1 Host Packet Configuration Register 1 A 982Dh RXHPCR2A[1] Receive Channel 1 Host Packet Configuration Register 2 A 9830h RXHPCR1B[1] Receive Channel 1 Host Packet Configuration Register 1 B 9831h RXHPCR2B[1] Receive Channel 1 Host Packet Configuration Register 2 B 9840h TXGCR1[2] Transmit Channel 2 Global Configuration Register 1 9841h TXGCR2[2] Transmit Channel 2 Global Configuration Register 2 9848h RXGCR1[2] Receive Channel 2 Global Configuration Register 1 9849h RXGCR2[2] Receive Channel 2 Global Configuration Register 2 984Ch RXHPCR1A[2] Receive Channel 2 Host Packet Configuration Register 1 A 984Dh RXHPCR2A[2] Receive Channel 2 Host Packet Configuration Register 2 A 9850h RXHPCR1B[2] Receive Channel 2 Host Packet Configuration Register 1 B 9851h RXHPCR2B[2] Receive Channel 2 Host Packet Configuration Register 2 B 9860h TXGCR1[3] Transmit Channel 3 Global Configuration Register 1 9861h TXGCR2[3] Transmit Channel 3 Global Configuration Register 2 9868h RXGCR1[3] Receive Channel 3 Global Configuration Register 1 9869h RXGCR2[3] Receive Channel 3 Global Configuration Register 2 986Ch RXHPCR1A[3] Receive Channel 3 Host Packet Configuration Register 1 A 986Dh RXHPCR2A[3] Receive Channel 3 Host Packet Configuration Register 2 A 9870h RXHPCR1B[3] Receive Channel 3 Host Packet Configuration Register 1 B 9871h RXHPCR2B[3] Receive Channel 3 Host Packet Configuration Register 2 B Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-43. Universal Serial Bus (USB) Registers CPU WORD ADDRESS ACRONYM A000h DMA_SCHED_CTRL1 CDMA Scheduler Control Register 1 A001h DMA_SCHED_CTRL2 CDMA Scheduler Control Register 1 A800h + 4 × N ENTRYLSW[N] A801h + 4 × N ENTRYMSW[N] (1) (continued) REGISTER DESCRIPTION CDMA Scheduler Table Word N Registers LSW (N = 0 to 63) CDMA Scheduler Table Word N Registers MSW (N = 0 to 63) Queue Manager (QMGR) Registers C000h - Reserved C001h - Reserved C008h DIVERSION1 Queue Manager Queue Diversion Register 1 C009h DIVERSION2 Queue Manager Queue Diversion Register 2 C020h FDBSC0 Queue Manager Free Descriptor/Buffer Starvation Count Register 0 C021h FDBSC1 Queue Manager Free Descriptor/Buffer Starvation Count Register 1 C024h FDBSC2 Queue Manager Free Descriptor/Buffer Starvation Count Register 2 C025h FDBSC3 Queue Manager Free Descriptor/Buffer Starvation Count Register 3 C028h FDBSC4 Queue Manager Free Descriptor/Buffer Starvation Count Register 4 C029h FDBSC5 Queue Manager Free Descriptor/Buffer Starvation Count Register 5 C02Ch FDBSC6 Queue Manager Free Descriptor/Buffer Starvation Count Register 6 C02Dh FDBSC7 Queue Manager Free Descriptor/Buffer Starvation Count Register 7 C080h LRAM0BASE1 Queue Manager Linking RAM Region 0 Base Address Register 1 C081h LRAM0BASE2 Queue Manager Linking RAM Region 0 Base Address Register 2 C084h LRAM0SIZE C085h - C088h LRAM1BASE1 Queue Manager Linking RAM Region 1 Base Address Register 1 C089h LRAM1BASE2 Queue Manager Linking RAM Region 1 Base Address Register 2 C090h PEND0 Queue Manager Queue Pending 0 C091h PEND1 Queue Manager Queue Pending 1 C094h PEND2 Queue Manager Queue Pending 2 C095h PEND3 Queue Manager Queue Pending 3 C098h PEND4 Queue Manager Queue Pending 4 C099h PEND5 Queue Manager Queue Pending 5 D000h + 16 × R QMEMRBASE1[R] Queue Manager Memory Region R Base Address Register 1 (R = 0 to 15) D001h + 16 × R QMEMRBASE2[R] Queue Manager Memory Region R Base Address Register 2 (R = 0 to 15) D004h + 16 × R QMEMRCTRL1[R] Queue Manager Memory Region R Control Register (R = 0 to 15) D005h + 16 × R QMEMRCTRL2[R] Queue Manager Memory Region R Control Register (R = 0 to 15) E000h + 16 × N CTRL1A Queue Manager Queue N Control Register 1A (N = 0 to 63) E001h + 16 × N CTRL2A Queue Manager Queue N Control Register 2A (N = 0 to 63) E004h + 16 × N CTRL1B Queue Manager Queue N Control Register 1B (N = 0 to 63) E005h + 16 × N CTRL2B Queue Manager Queue N Control Register 2B (N = 0 to 63) E008h + 16 × N CTRL1C Queue Manager Queue N Control Register 1C (N = 0 to 63) E009h + 16 × N CTRL2C Queue Manager Queue N Control Register 2C (N = 0 to 63) E00Ch + 16 × N CTRL1D Queue Manager Queue N Control Register 1D (N = 0 to 63) E00Dh + 16 × N CTRL2D Queue Manager Queue N Control Register 2D (N = 0 to 63) E800h + 16 × N QSTAT1A Queue Manager Queue N Status Register 1A (N = 0 to 63) E801h + 16 × N QSTAT2A Queue Manager Queue N Status Register 2A (N = 0 to 63) E804h + 16 × N QSTAT1B Queue Manager Queue N Status Register 1B (N = 0 to 63) E805h + 16 × N QSTAT2B Queue Manager Queue N Status Register 2B (N = 0 to 63) E808h + 16 × N QSTAT1C Queue Manager Queue N Status Register 1C (N = 0 to 63) Copyright © 2009–2010, Texas Instruments Incorporated Queue Manager Linking RAM Region 0 Size Register Reserved Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 121 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com Table 6-43. Universal Serial Bus (USB) Registers CPU WORD ADDRESS ACRONYM E809h + 16 × N QSTAT1C 122 (1) (continued) REGISTER DESCRIPTION Queue Manager Queue N Status Register 2C (N = 0 to 63) Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.17.2 USB2.0 Electrical Data/Timing Table 6-44. Switching Characteristics Over Recommended Operating Conditions for USB2.0 (see Figure 6-38) CVDD = 1.05 V CVDD = 1.3 V NO. 1 (1) (2) (3) (4) PARAMETER tr(D) FULL SPEED 12 Mbps Rise time, USB_DP and USB_DM signals (2) (2) HIGH SPEED 480 Mbps (1) MIN MAX MIN 4 20 0.5 UNIT MAX ns 2 tf(D) Fall time, USB_DP and USB_DM signals 4 20 0.5 3 trfM Rise/Fall time, matching (3) 90 111 – – % 4 VCRS Output signal cross-over voltage (2) 1.3 2 – – V 160 175 – – ns (4) 7 tw(EOPT) Pulse duration, EOP transmitter 8 tw(EOPR) Pulse duration, EOP receiver (4) 9 t(DRATE) Data Rate 10 ZDRV Driver Output Resistance 40.5 11 ZINP Receiver Input Impedance 100k 82 ns – 12 49.5 ns 480 Mb/s 40.5 49.5 Ω - - Ω For more detailed informaton, see the Universal Serial Bus Specification, Revision 2.0, Chapter 7. Full Speed and High Speed CL = 50 pF tRFM = (tr/tf) x 100. [Excluding the first transaction from the Idle state.] Must accept as valid EOP USB_DM VCRS USB_DP tper - tjr 90% VOH 10% VOL tr tf Figure 6-38. USB2.0 Integrated Transceiver Interface Timing Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 123 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.18 General-Purpose Timers The VC5505 has three 32-bit software programmable Timers. Each timer can be used as a general- purpose (GP) timer. Timer2 can be configured as either a GP or a Watchdog (WD) or both. General-purpose timers are typically used to provide interrupts to the CPU to schedule periodic tasks or a delayed task. A watchdog timer is used to reset the CPU in case it gets into an infinite loop. The GP timers are 32-bit timers with a 13-bit prescaler that can divide the CPU clock and uses this scaled value as a reference clock. These timers can be used to generate periodic interrupts. The Watchdog Timer is a 16-bit counter with a 16-bit prescaler used to provide a recovery mechanism for the device in the event of a fault condition, such as a non-exiting code loop. The VC5505 Timers support the following: • 32-bit Programmable Countdown Timer • 13-bit Prescaler Divider • Timer Modes: – 32-bit General-Purpose Timer – 32-bit Watchdog Timer (Timer2 only) • Auto Reload Option • Generates Single Interrupt to CPU (The interrupt is individually latched to determine which timer triggered the interrupt.) • Generates Active Low Pulse to the Hardware Reset (Watchdog only) • Interrupt can be Used for DMA Event 6.18.1 Timers Peripheral Register Description(s) Table 6-45 through Table 6-48 show the Timer and Watchdog registers. Table 6-45. Watchdog Timer Registers (Timer2 only) CPU WORD ADDRESS ACRONYM 1880h WDKCKLK REGISTER DESCRIPTION Watchdog Kick Lock Register 1882h WDKICK Watchdog Kick Register 1884h WDSVLR Watchdog Start Value Lock Register 1886h WDSVR Watchdog Start Value Register Watchdog Enable Lock Register 1888h WDENLOK 188Ah WDEN 188Ch WDPSLR 188Eh WDPS Watchdog Enable Register Watchdog Prescale Lock Register Watchdog Prescale Register Table 6-46. General-Purpose Timer 0 Registers CPU WORD ADDRESS ACRONYM REGISTER DESCRIPTION 1810h TCR Timer 0 Control Register 1812h TIMPRD1 Timer 0 Period Register 1 1813h TIMPRD2 Timer 0 Period Register 2 1814h TIMCNT1 Timer 0 Counter Register 1 1815h TIMCNT2 Timer 0 Counter Register 2 Table 6-47. General-Purpose Timer 1 Registers 124 CPU WORD ADDRESS ACRONYM 1850h TCR REGISTER DESCRIPTION Timer 1 Control Register Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-47. General-Purpose Timer 1 Registers (continued) CPU WORD ADDRESS ACRONYM 1852h TIMPRD1 Timer 1 Period Register 1 1853h TIMPRD2 Timer 1 Period Register 2 1854h TIMCNT1 Timer 1 Counter Register 1 1855h TIMCNT2 Timer 1 Counter Register 2 REGISTER DESCRIPTION Table 6-48. General-Purpose Timer 2 Registers CPU WPRD ADDRESS ACRONYM 1890h TCR Timer 2 Control Register 1892h TIMPRD1 Timer 2 Period Register 1 1893h TIMPRD2 Timer 2 Period Register 2 1894h TIMCNT1 Timer 2 Counter Register 1 1895h TIMCNT2 Timer 2 Counter Register 2 Copyright © 2009–2010, Texas Instruments Incorporated REGISTER DESCRIPTION Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 125 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.19 General-Purpose Input/Output The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs. When configured as an output, you can write to an internal register to control the state driven on the output pin. When configured as an input, you can detect the state of the input by reading the state of the internal register. The GPIO can also be used to send interrupts to the CPU. The VC5505 GPIO peripheral supports the following: • Up to 26 GPIOs plus 1 general-purpose output (XF) and 4 Special-Purpose Outputs for Use With SAR • All GPIO pins have internal pulldowns (IPDs) which can be individually disabled • Output Set/Clear functionality through writing a single output data register • All GPIOs can be configured to generate edge detected interrupts to the CPU on either the rising or falling edge VC5505 GPIO pin functions are multiplexed with various other signals. For more detailed information on what signals are multiplexed with the GPIO and how to configure them, see Section 3.5, Terminal Functions and Section 4, Device Configuration of this document. 126 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.19.1 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 General-Purpose Input/Output Peripheral Register Description(s) The external parallel port interface includes a 16-bit general purpose I/O that can be individually programmed as input or output with interrupt capability. Control of the general purpose I/O is maintained through a set of I/O memory-mapped registers shown in Table 6-49. Table 6-49. GPIO Registers HEX ADDRESS RANGE ACRONYM 1C06h IODIR1 GPIO Direction Register 1 1C07h IODIR2 GPIO Direction Register 2 1C08h IOINDATA1 GPIO Data In Register 1 GPIO Data In Register 2 REGISTER NAME 1C09h IOINDATA2 1C0Ah IODATAOUT1 GPIO Data Out Register 1 1C0Bh IODATAOUT2 GPIO Data Out Register 2 1C0Ch IOINTEDG1 GPIO Interrupt Edge Trigger Enable Register 1 1C0Dh IOINTEDG2 GPIO Interrupt Edge Trigger Enable Register 2 1C0Eh IOINTEN1 GPIO Interrupt Enable Register 1 1C0Fh IOINTEN2 GPIO Interrupt Enable Register 2 1C10h IOINTFLG1 GPIO Interrupt Flag Register 1 1C11h IOINTFLG2 GPIO Interrupt Flag Register 2 Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 127 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 6.19.2 www.ti.com GPIO Peripheral Input/Output Electrical Data/Timing Table 6-50. Timing Requirements for GPIO Inputs (1) (see Figure 6-39) CVDD = 1.05 V CVDD = 1.3 V NO. MIN 1 tw(ACTIVE) 2 (1) tw(INACTIVE) 2C (1) Pulse duration, GPIO input/external interrupt pulse active Pulse duration, GPIO input/external interrupt pulse inactive C UNIT MAX (2) ns (1) (2) ns The pulse width given is sufficient to get latched into the GPIO_IFR register and to generate an interrupt. However, if a user wants to have the device recognize the GPIO changes through software polling of the GPIO Data In (GPIO_DIN) register, the GPIO duration must be extended to allow the device enough time to access the GPIO register through the internal bus. C = SYSCLK period in ns. For example, when running parts at 100 MHz, use C = 10 ns. (2) Table 6-51. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see Figure 6-39) NO. CVDD = 1.05 V CVDD = 1.3 V PARAMETER MIN (1) (2) UNIT MAX 3 tw(GPOH) Pulse duration, GP[x] output high 3C (1) (2) ns 4 tw(GPOL) Pulse duration, GP[x] output low 3C (1) (2) ns This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the GPIO is dependent upon internal bus activity. C = SYSCLK period in ns. For example, when running parts at 100 MHz, use C = 10 ns. 2 GP[x] Input (With IOINTEDGy = 0) 1 2 GP[x] Input (With IOINTEDGy = 1) 1 4 3 GP[x] Output Figure 6-39. GPIO Port Timing 128 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com 6.19.3 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 GPIO Peripheral Input Latency Electrical Data/Timing Table 6-52. Timing Requirements for GPIO Input Latency (1) CVDD = 1.05 V CVDD = 1.3 V NO. MIN 1 (1) tL(GPI) Latency, GP[x] input UNIT MAX Polling GPIO_DIN register 5 cyc Polling GPIO_IFR register 7 cyc Interrupt Detection 8 cyc The pulse width given is sufficient to generate a CPU interrupt. However, if a user wants to have VC5505 recognize the GP[x] input changes through software polling of the GPIO register, the GP[x] input duration must be extended to allow device enough time to access the GPIO register through the internal bus. Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 129 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 6.20 IEEE 1149.1 JTAG The JTAG interface is used for Boundary-Scan testing and emulation of the VC5505 device. TRST should only to be deasserted when it is necessary to use a JTAG controller to debug the device or exercise the device's boundary scan functionality. The VC5505 includes an internal pulldown (IPD) on the TRST pin to ensure that TRST will always be asserted upon power up and the device's internal emulation logic will always be properly initialized. It is also recommended that an external pulldown be added to ensure proper device operation when an emulation or boundary scan JTAG controller is not connected to the JTAG pins. JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of a pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally drive TRST high before attempting any emulation or boundary scan operations. The VC5505 device will not operate properly if TRST is not asserted low during powerup. 6.20.1 JTAG ID (JTAGID) Register Description(s) Table 6-53. JTAG ID Register HEX ADDRESS RANGE ACRONYM N/A JTAGID REGISTER NAME JTAG Identification Register COMMENTS Read-only. Provides 32-bit JTAG ID of the device. The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. The register hex value for VC5505 is: 0x0009 702F. For the actual register bit names and their associated bit field descriptions, see Figure 6-40 and Table 6-54. 31-28 27-12 11-1 0 VARIANT (4-Bit) PART NUMBER (16-Bit) MANUFACTURER (11-Bit) LSB R-0000 R-0000 0000 1001 0111 R-0000 0010 111 R-1 LEGEND: R = Read, W = Write, n = value at reset Figure 6-40. JTAG ID Register Description - VC5505 Register Value - 0x0009 702F 130 Peripheral Information and Electrical Specifications Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 TMS320VC5505 www.ti.com SPRS503B – JUNE 2009 – REVISED JANUARY 2010 Table 6-54. JTAG ID Register Selection Bit Descriptions BIT NAME 31:28 VARIANT DESCRIPTION 27:12 PART NUMBER 11:1 MANUFACTURER 0 LSB Variant (4-Bit) value. VC5505 value: 0000. Part Number (16-Bit) value. VC5505 value: 0000 0000 1001 0111. Manufacturer (11-Bit) value. VC5505 value: 0000 0010 111. LSB. This bit is read as a "1" for VC5505 . 6.20.2 JTAG Test_port Electrical Data/Timing Table 6-55. Timing Requirements for JTAG Test Port (see Figure 6-41) CVDD = 1.05 V CVDD = 1.3 V NO. MIN UNIT MAX 2 tc(TCK) Cycle time, TCK 60 ns 3 tw(TCKH) Pulse duration, TCK high 24 ns 4 tw(TCKL) Pulse duration, TCK low 24 ns 5 tsu(TDIV-TCKH) Setup time, TDI valid before TCK high 10 ns 6 tsu(TMSV-TCKH) Setup time, TMS valid before TCK high 6 ns 7 th(TCKH-TDIV) Hold time, TDI valid after TCK high 4 ns 8 th(TCKH-TDIV) Hold time, TMS valid after TCK high 4 ns Table 6-56. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see Figure 6-41) NO. CVDD = 1.05 V CVDD = 1.3 V PARAMETER MIN 1 td(TCKL-TDOV) Delay time, TCK low to TDO valid UNIT MAX 28 ns 2 3 4 TCK 1 1 TDO 7 5 TDI 8 6 TMS Figure 6-41. JTAG Test-Port Timing Copyright © 2009–2010, Texas Instruments Incorporated Peripheral Information and Electrical Specifications Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 131 TMS320VC5505 SPRS503B – JUNE 2009 – REVISED JANUARY 2010 www.ti.com 7 Mechanical Packaging and Orderable Information The following table(s) show the thermal resistance characteristics for the PBGA–ZCH mechanical package. 7.1 Thermal Data for ZCH Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCH] °C/W (1) AIR FLOW (m/s) (2) 1S0P 6.74 N/A 1S0P 14.5 N/A 2S2P 13.8 1S0P 57.0 2S2P 33.4 NO. 1 2 3 RΘJC Junction-to-case RΘJB Junction-to-board RΘJA Junction-to-free air 4 0.00 0.50 5 RΘJMA 6 1.00 Junction-to-moving air 2.00 7 3.00 8 0.09 9 0.00 0.50 10 PsiJT Junction-to-package top 1.00 11 2.00 12 3.00 13 13.7 14 15 0.00 0.50 PsiJB Junction-to-board 1.00 16 2.00 17 3.00 (1) (2) 7.2 These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages. m/s = meters per second Packaging Information The following packaging information and addendum reflect the most current data available for the designated device(s). This data is subject to change without notice and without revision of this document. 132 Mechanical Packaging and Orderable Information Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TMS320VC5505 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TMS320VC5505ZCH ACTIVE NFBGA ZCH 196 184 RoHS & Green SNAGCU Level-3-260C-168 HR TMS320 VC5505 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of