TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
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TMS320DM647/TMS320DM648 Digital Media Processor
Check for Samples: TMS320DM647, TMS320DM648
1 Features
1
• High-Performance Digital Media Processor
– 720-MHz, 800-MHz, 900-MHz, 1.1-GHz
C64x+™ Clock Rates
– 1.39 ns (-720), 1.25 ns (-800), 1.11 ns (-900),
0.91 ns (-1100) Instruction Cycle Time
– 5760, 6400, 7200, 8800 MIPS
– Eight 32-Bit C64x+ Instructions/Cycle
– Fully Software-Compatible With C64x/Debug
– Commercial Temperature Ranges (-720, -900,
and -1100 only)
– Extended Temperature Ranges (-800 only)
– Industrial Temperature Ranges (-720, -900,
and -1100 only)
• VelociTI.2™ Extensions to VelociTI™
Advanced Very-Long-Instruction-Word (VLIW)
TMS320C64x+™ DSP Core
– Eight Highly Independent Functional Units
With VelociTI.2 Extensions:
• Six ALUs (32-/40-Bit), Each Supports
Single 32-bit, Dual 16-bit, or Quad 8-bit
Arithmetic per Clock Cycle
• Two Multipliers Support Four 16 x 16-bit
Multiplies (32-bit Results) per Clock Cycle
or Eight 8 x 8-bit Multiplies (16-Bit
Results) per Clock Cycle
– Load-Store Architecture With Non-Aligned
Support
– 64 32-bit General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Additional C64x+™ Enhancements
• Protected Mode Operation
• Exceptions Support for Error Detection
and Program Redirection
• Hardware Support for Modulo Loop
Auto-Focus Module Operation
• C64x+ Instruction Set Features
– Byte-Addressable (8-/16-/32-/64-bit Data)
– 8-bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– VelociTI.2 Increased Orthogonality
– C64x+ Extensions
• Compact 16-bit Instructions
• Additional Instructions to Support
Complex Multiplies
• C64x+ L1/L2 Memory Architecture
– 256K-bit (32K-byte) L1P Program RAM/Cache
[Direct Mapped]
– 256K-bit (32K-byte) L1D Data RAM/Cache
[2-Way Set-Associative]
– 2M-bit/256K-byte (DM647) or
4M-Bit/512K-byte) (DM648) L2 Unified
Mapped RAM/Cache [Flexible Allocation]
• Supports Little Endian Mode Only
• Five Configurable Video Ports
– Providing a Glueless I/F to Common Video
Decoder and Encoder Devices
– Supports Multiple Resolutions/Video
Standards
• VCXO Interpolated Control Port (VIC)
– Supports Audio/Video Synchronization
• External Memory Interfaces (EMIFs)
– 32-Bit DDR2 SDRAM Memory Controller With
512M-Byte (1) Address Space (1.8-V I/O)
– Asynchronous 16-Bit Wide EMIF (EMIFA)
• Up to 128M-Byte Total Address Reach
• 64M-Byte Address Reach per CE Space
– Glueless Interface to Asynchronous
Memories (SRAM, Flash, and EEPROM)
– Synchronous Memories (SBSRAM and ZBT
SRAM)
– Supports Interface to Standard Sync Devices
and Custom Logic (FPGA, CPLD, ASICs,
etc.)
• Enhanced Direct-Memory-Access (EDMA)
Controller (64 Independent Channels)
• 3-Port Gigabit Ethernet Switch Subsystem
• Four 64-Bit General-Purpose Timers (Each
Configurable as Two 32-Bit Timers)
• One UART (With RTS and CTS Flow Control)
• One 4-wire Serial Port Interface (SPI) With Two
Chip-Selects
• Master/Slave Inter-Integrated Circuit (I2C
Bus™)
• Multichannel Audio Serial Port (McASP)
– Ten Serializers and SPDIF (DIT) Mode
• 16/32-Bit Host-Port Interface (HPI)
(1)
From Silicon revision 1.1 and onward. In silicon revision 1.0,
the address space is 256M-Bytes.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2007–2011, Texas Instruments Incorporated
English Data Sheet: SPRS372
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
• Advanced Event Triggering (AET) Compatible
• 32-Bit 33-/66-MHz, 3.3-V Peripheral Component
Interconnect (PCI) Master/Slave Interface
Conforms to PCI Specification 2.3
• VLYNQ™ Interface (FPGA Interface)
• On-Chip ROM Bootloader
• Individual Power-Saving Modes
• Flexible PLL Clock Generators
• IEEE-1149.1 (JTAG™)
Boundary-Scan-Compatible
1.1
• 32 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions)
• Package:
– 529-pin nFBGA (ZUT suffix)
– 19x19 mm 0.8 mm pitch BGA
– 0.09-μm/6-Level Cu Metal Process (CMOS)
• 3.3-V and 1.8-V I/O, 1.2-V Internal (-720, -800,
-900, -1100)
• Applications:
– Digital Video Recording
Trademarks
TMS320C64x+, C64x, C64x+, VelociTI, VelociTI.2, VLYNQ, TMS320C6000, C6000, TI, and TMS320 are
trademarks of Texas Instruments.
I2C Bus is a registered trademark of Koninklijke Philips Electronics N.V.
Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.
All trademarks are the property of their respective owners.
1.2
Description
The TMS320C64x+™ DSPs (including the TMS320DM647/TMS320DM648 devices) are the
highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The DM647,
DM648 devices are based on the third-generation high-performance, advanced VelociTI™
very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs
an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from
previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added
functionality and have an expanded instruction set from previous devices.
Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and
C64x+ CPU, respectively.
With performance of up to 8800 million instructions per second (MIPS) at a clock rate of 1.1 GHz, the
C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses
the operational flexibility of high-speed controllers and the numerical capability of array processors. The
C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly
independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The
eight functional units include instructions to accelerate the performance in video and imaging applications.
The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for up to 4400 million MACs
per second (MMACS), or eight 8-bit MACs per cycle for up tp 8800 MMACS. For more details on the
C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature
number SPRU732).
The devices also have application-specific hardware logic, on-chip memory, and additional on-chip
peripherals similar to the other C6000 DSP platform devices. The core uses a two-level cache-based
architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data
cache (L1D) is a 256K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a
4M-bit (DM648) or 2M-bit (DM647) memory space that is shared between program and data space. L2
memory can be configured as mapped memory, cache, or combinations of the two.
The peripheral set includes five configurable 16-bit video port peripherals (VP0, VP1, VP2, VP3, and
VP4). These video port peripherals provide a glueless interface to common video decoder and encoder
devices. The video port peripherals support multiple resolutions and video standards (e.g., CCIR601,
ITU-BT.656, BT.1120, SMPTE 125M, 260M, 274M, and 296M), a VCXO interpolated control port (VIC); a
1000 Mbps Ethernet Switch Subsystem with a management data input/output (MDIO) module and two
SGMII ports (DM648) or one SGMII port (only DM647); a 4-bit transmit, 4-bit receive VLYNQ interface; an
2
Features
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inter-integrated circuit (I2C) bus interface; a multichannel audio serial port (McASP) with ten serializers;
four 64-bit general-purpose timers each configurable as two independent 32-bit timers; a user-configurable
16-bit or 32-bit host-port interface (HPI); 32 pins for general-purpose input/output (GPIO) with
programmable interrupt/event generation modes, multiplexed with other peripherals; one UART; and two
glueless external memory interfaces: a synchronous and asynchronous external memory interface
(EMIFA) for slower memories/peripherals, and a higher DDR2 SDRAM interface.
The video port peripherals provide a glueless interface to common video decoder and encoder devices.
The video port peripherals support multiple resolutions and video standards (e.g., CCIR601, ITU-BT.656,
BT.1120, SMPTE 125M, 260M, 274M, and 296M).
The video port peripherals are configurable and can support either video capture and/or video display
modes. Each video port consists of two channels (A and B) with a 5120-byte capture/display buffer that is
splittable between the two channels.
For more details on the video port peripherals, see the TMS320DM647/DM648 Video Port User's Guide
(literature number SPRUEM1).
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses to
enumerate all PHY devices in the system.
The I2C and VLYNQ ports allow the device to easily control peripheral modules and/or communicate with
host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections later in this document
and the associated peripheral reference guides.
The devices have a complete set of development tools. These include C compilers, a DSP assembly
optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into
source code execution.
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Features
3
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
1.3
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Functional Block Diagram
Figure 1-1 shows the functional block diagram of the device.
Timers
(4 64-bit
or 8 32-bit)
PCI66
or
UHPI
3-port Ethernet
Switch
Subsystem
TC
EDMA 3.0
PLL
CC
JTAG
TC
TC
GPIO x32
TC
SGMII
(x2, DM648)
(x1, DM647)
VLYNQ
VIC
Switched Central Resource
DDR2
EMIFA 16-bit
Video Ports (5)
L2 RAM
L1D 32KB
256KB
(DM647)
C64x+
Mega
512KB
(DM648)
McASP
UART
SPI
L1P 32KB
I2C
L2 ROM
64KB
Imaging Coprocessor
Figure 1-1. Functional Block Diagram
4
Features
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................................................... 1
1.1
Trademarks .......................................... 2
1.2
Description ........................................... 2
1.3
Functional Block Diagram ............................ 4
Revision History .............................................. 6
2 Device Overview ........................................ 7
2.1
Device Characteristics ............................... 7
2.2
CPU (DSP Core) Description ........................ 8
2.3
C64x+ CPU ......................................... 11
2.4
Memory Map Summary ............................. 12
2.5
Pin Assignments .................................... 16
2.6
Terminal Functions ................................. 20
2.7
Device Support ..................................... 34
3 Device Configuration ................................. 38
3.1
System Module Registers .......................... 38
3.2
Bootmode Registers ................................ 39
3.3
Pullup/Pulldown Resistors .......................... 49
4 System Interconnect .................................. 50
4.1
Internal Buses, Bridges, and Switch Fabrics ....... 50
4.2
Data Switch Fabric Connections ................... 50
4.3
Configuration Switch Fabric ........................ 52
5 Device Operating Conditions ....................... 54
5.1
Absolute Maximum Ratings ........................ 54
5.2
Recommended Operating Conditions .............. 55
5.3
Electrical Characteristics ........................... 56
1
6
Features
Peripheral Information and Electrical
Specifications .......................................... 57
6.1
Parameter Information
..............................
6.2
Recommended Clock and Control Signal Transition
Behavior ............................................ 59
6.3
Power Supplies
6.4
PLL1 Controller
6.5
6.6
PLL2 Controller
69
Enhanced Direct Memory Access (EDMA3)
Controller ........................................... 71
6.7
Reset Controller
6.8
Interrupts ............................................ 96
6.9
6.10
6.11
6.12
6.13
7
.....................................
.....................................
.....................................
59
....................................
84
.........................
............
Video Port .........................................
VCXO Interpolated Control (VIC) .................
65
DDR2 Memory Controller
100
External Memory Interface A (EMIFA)
111
118
126
Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 128
.............
......................
6.16 Host-Port Interface (HPI) Peripheral ..............
6.17 Peripheral Component Interconnect (PCI) ........
6.18 Multichannel Audio Serial Port (McASP) ..........
6.19 3-Port Ethernet Switch Subsystem (3PSW) .......
6.20 Management Data Input/Output (MDIO) ..........
6.21 Timers .............................................
6.22 VLYNQ Peripheral .................................
6.23 General-Purpose Input/Output (GPIO) ............
6.24 Emulation Features and Capability ...............
6.25 IEEE 1149.1 JTAG ................................
Mechanical Data ......................................
7.1
Thermal Data for ZUT .............................
7.2
Packaging Information ............................
6.14
Serial Peripheral Interface Port (SPI)
130
6.15
Inter-Integrated Circuit (I2C)
134
138
149
154
162
172
173
175
178
180
181
183
183
184
57
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Contents
5
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
The following table lists the technical changes made for this revision.
DM647/DM648 Revision History
SEE
ADDITIONS, DELETIONS, MODIFICATIONS
Table 2-3
Added row for 0x00A4 0000 to 0x00A7 FFFF
Table 2-4
Added legend explaining values for TYPE column
Removed IPD/IPU resistors to all pins listed for HOST-PORT INTERFACE (HPI) or PERIPHERAL
COMPONENT INTERCONNECT (PCI) or GPIO[0:7]
Updated description for PCBE0/GP04
Table 2-5
Added legend explaining values for TYPE column
Figure 6-5
Corrected C2 value to 0.1µF in circuit block in upper left corner
Corrected PLLM to show range
Corrected CLKDIR to VLYNQ to show 1 is VLYNQ, external
Section 6.7.8
Added Pin Behaviors at Reset section.
Table 6-26
Changed interrupt 15 name to DSPINT
Figure 6-11
Added overbar on second LDQS for middle DDR2
Figure 6-12
Corrected footnotes
Figure 6-21
Updated to show times 2, 3, and 4 are referred to posedge AAOE/ASOE.
Figure 6-22
Updated to show time 11 for ACEx, ABE, AEA, and ABA is referred to negedge AAWE/ASWE
Figure 6-24
Inserted correct graphic; previous was repeat of Figure 6-21
Section 6.11.1
6
Corrected hyperlink to connect to SPRUEM1
Table 6-49
Changed 5.4ns to 4.2ns for tw(VKIH) and tw(VKIL).
Figure 6-35
Corrected interconnection of SPI data pins
Table 6-92
Moved Cycle time, VLCK Max value to Min column
Contents
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2 Device Overview
2.1
Device Characteristics
Table 2-1, provides an overview of the DSP. The tables show significant features of the devices, including
the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.
Table 2-1. Characteristics of the Processor
HARDWARE FEATURES
Peripherals
Not all peripheral
pins are available
at the same time
(For more detail,
see Section 3.)
DM647
DM648
DDR2 memory controller (32-bit
bus width) [1.8 V I/O]
1
1
16-bit bus width
synchronous/asynchronous
EMIF [EMIFA]
1
1
EDMA3 (64 independent
channels, 8 QDMA channels)
1
1
Timers
4 64-bit General Purpose
(each configurable as 1 64-bit or 2
32-bit)
4 64-bit General Purpose
(each configurable as 1 64-bit or 2 32-bit)
UART
(with RTS and CTS flow control)
(with RTS and CTS flow control)
I2C
1 (Master/Slave)
1 (Master/Slave)
SPI
1 (4-wire, 2 chip select)
1 (4-wire, 2 chip select)
1 (10 serializers)
1 (10 serializers)
1 SGMII port available
2 SGMII ports available
1
1
Up to 32 pins
Up to 32 pins
1
1
1 (PCI33 or PCI66)
1 (PCI33 or PCI66)
VIC
1
1
Configurable video ports
5
5
Size (bytes)
320KB RAM, 64KB ROM
576KB RAM, 64KB ROM
Organization
32KB L1 program (L1P)/cache (up to
32KB)
32KB L1 data (L1D)/cache (up to
32KB)
256KB unified mapped RAM/Cache
(L2)
64KB Boot ROM
32KB L1 program (L1P)/cache (up to 32KB)
32KB L1 data (L1D)/cache (up to 32KB)
512 KB unified mapped RAM/Cache (L2)
64KB Boot ROM
McASP
3-port Ethernet Switch
Subsystem supporting
10/100/1000 Base-T
Management data input/output
(MDIO)
VLYNQ
General-purpose input/output
port (GPIO)
HPI (16/32-bit)
PCI (32 bit) (33 MHz or 66
MHz)
On-Chip Memory
MegaModule
Rev ID
Revision ID Register
(MM_REVID[15:0])
(address location 0x0181 2000)
0x0003
0x0003
CPU ID + CPU
Rev ID
Control Status Register
(CSR.[31:16])
0x1000
0x1000
JTAG BSDL_ID
JTAGID register
(address location: 0x0204 9018)
0x1B77 A02F
0x1B77 A02F
CPU Frequency
MHz
720, 900, 1100
720, 800, 900, 1100
Cycle Time
ns
1.39 ns (-720)
1.11 ns (-900)
0.91 ns (-1100)
1.39 ns (-720)
1.25 ns (-800)
1.11 ns (-900)
0.91 ns (-1100)
1.2 V (-720, -900, -1100)
1.2 V (-720, -800, -900, -1100)
1.8 V, 3.3 V
1.8 V, 3.3 V
Voltage
Core (V)
I/O (V)
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TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
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Table 2-1. Characteristics of the Processor (continued)
HARDWARE FEATURES
PLL Options
CLKIN1 frequency multiplier
BGA Package
Process
Technology
Product Status
(1)
(2)
2.2
DM647
DM648
x1 (Bypass),
PLLM = 15, 16, …, 31
(x16, x17, …, x32) (1)
x1 (Bypass),
PLLM = 15, 16, …, 31
(x16, x17, …, x32) (1)
529-Pin Flip Chip Plastic BGA (ZUT)
529-Pin Flip Chip Plastic BGA (ZUT)
0.09 μm
0.09 μm
PD
PD
0.09-μm/6-Level Cu Metal
Process (CMOS)
(2)
Production Data (PD)
The maximum CPU frequency must not be violated.
See Section 2.7 for a description of each stage of development.
CPU (DSP Core) Description
The C64x+ central processing unit (CPU) consists of eight functional units, two register files, and two data
paths as shown in Figure 2-1. The two general-purpose register files (A and B) each contain 32 32-bit
registers for a total of 64 registers. The general-purpose registers can be used for data or can be data
address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data,
40-bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored
in register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in
the next upper register (which is always an odd-numbered register).
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
The C64x+ CPU extends the performance of the C64x core through enhancements and new features.
Each C64x+ .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, one 16 x
32 bit multiply, two 16 x 16 bit multiplies, two 16 x 32 bit multiplies, two 16 x 16 bit multiplies with
add/subtract capabilities, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add operations, and four
16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There is also support for
Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms such as FFTs and
modems require complex multiplication. The complex multiply (CMPY) instruction takes for 16-bit inputs
and produces a 32-bit real and a 32-bit imaginary output. There are also complex multiplies with rounding
capability that produces one 32-bit packed output that contain 16-bit real and 16-bit imaginary values. The
32 x 32 bit multiply instructions provide the extended precision necessary for audio and other
high-precision algorithms on a variety of signed and unsigned 32-bit data types.
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.
The C64x+ core enhances the .S unit in several ways. In the C64x core, dual 16-bit MIN2 and MAX2
comparisons were available only on the .L units. On the C64x+ core they are also available on the .S unit,
which increases the performance of algorithms that do searching and sorting. Finally, to increase data
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack
instructions return parallel results to output precision including saturation support.
Other new features include:
• SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.
8
Device Overview
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•
•
•
•
•
Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C64x+
compiler can restrict the code to use certain registers in the register file. This compression is
performed by the code generation tools.
Instruction Set Enhancement - As noted above, there are new instructions such as 32-bit
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field
multiplication.
Exceptions Handling - Intended to aid the programmer in isolating bugs. The C64x+ CPU is able to
detect and respond to exceptions, both from internally detected sources (such as illegal opcodes).
Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with
read, write, and execute permissions.
Time-Stamp Counter - Primarily targeted for real-time operating system (RTOS) robustness, a
free-running time-stamp counter that is not sensitive to system stalls is implemented in the CPU.
For more details on the C64x+ CPU and its enhancements over the C64x architecture, see the following
documents:
• TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732)
• TMS320C64x+ DSP Megamodule Reference Guide (literature number SPRU871)
• TMS320C64x to TMS320C64x+ CPU Migration Guide Application Report (literature number SPRAA84)
• TMS320C64x+ DSP Cache User's Guide (literature number SPRU862)
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TMS320DM647
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src1
Odd
register
file A
(A1, A3,
A5...A31)
src2
.L1
odd dst
Even
register
file A
(A0, A2,
A4...A30)
(D)
even dst
long src
ST1b
ST1a
8
32 MSB
32 LSB
long src
8
even dst
odd dst
.S1
src1
Data path A
(D)
src2
.M1
dst2
dst1
src1
32
32
(A)
(B)
src2
LD1b
LD1a
(C)
32 MSB
32 LSB
dst
DA1
.D1
src1
src2
2x
1x
DA2
.D2
LD2a
LD2b
Odd
register
file B
(B1, B3,
B5...B31)
src2
src1
dst
32 LSB
32 MSB
src2
.M2
Even
register
file B
(B0, B2,
B4...B30)
(C)
src1
dst2
32
(B)
dst1
32
(A)
src2
src1
.S2 odd dst
even dst
long src
Data path B
ST2a
ST2b
(D)
8
32 MSB
32 LSB
long src
even dst
.L2
8
(D)
odd dst
src2
src1
Control Register
A.
B.
C.
D.
On .M unit, dst2 is 32 MSB.
On .M unit, dst1 is 32 LSB.
On C64x CPU .M unit,src2 is 32 bits; on C64x+ CPU .M unit,src2 is 64 bits.
On .L and .S units, odd dst connects to odd register files andeven dst connects to even register files.
Figure 2-1. TMS320C64x+™ CPU (DSP Core) Data Paths
10
Device Overview
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2.3
C64x+ CPU
The C64x+ core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P)
consists of 32KB memory space that can be configured as mapped memory or direct mapped cache. The
Level 1 data memory/cache (L1D) consists of 32KB that can be configured as mapped memory or 2-way
associated cache. The Level 2 memory/cache (L2) consists of a 256KB (DM647)/512 KB (DM648)
memory space that is shared between program and data space. L2 memory can be configured as mapped
memory, cache, or a combination of both.
Table 2-2 shows a memory map of the C64x+ CPU cache registers for the device.
Table 2-2. C64x+ Cache Registers
HEX ADDRESS RANGE
REGISTER ACRONYM
0x0184 0000
L2CFG
0x0184 0020
L1PCFG
0x0184 0024
L1PCC
0x0184 0040
L1DCFG
DESCRIPTION
L2 cache configuration register
L1P size cache configuration register
L1P freeze mode cache configuration register
L1D size cache configuration register
0x0184 0044
L1DCC
0x0184 0048 - 0x0184 0FFC
-
L1D freeze mode cache configuration register
Reserved
0x0184 1000
-
Reserved
0x0184 1004 - 0x0184 1FFC
-
Reserved
0x0184 2000
L2ALLOC0
L2 allocation register 0
0x0184 2004
L2ALLOC1
L2 allocation register 1
0x0184 2008
L2ALLOC2
L2 allocation register 2
0x0184 200C
L2ALLOC3
L2 allocation register 3
0x0184 2010 - 0x0184 3FFF
-
0x0184 4000
L2WBAR
L2 writeback base address register
0x0184 4004
L2WWC
L2 writeback word count register
0x0184 4010
L2WIBAR
L2 writeback invalidate base address register
0x0184 4014
L2WIWC
L2 writeback invalidate word count register
Reserved
0x0184 4018
L2IBAR
L2 invalidate base address register
0x0184 401C
L2IWC
L2 invalidate word count register
0x0184 4020
L1PIBAR
L1P invalidate base address register
0x0184 4024
L1PIWC
L1P invalidate word count register
0x0184 4030
L1DWIBAR
L1D writeback invalidate base address register
0x0184 4034
L1DWIWC
L1D writeback invalidate word count register
0x0184 4038
-
0x0184 4040
L1DWBAR
L1D block writeback
0x0184 4044
L1DWWC
L1D block writeback
0x0184 4048
L1DIBAR
L1D invalidate base address register
L1D invalidate word count register
0x0184 404C
L1DIWC
0x0184 4050 - 0x0184 4FFF
-
0x0184 5000
L2WB
0x0184 5004
L2WBINV
0x0184 5008
L2INV
0x0184 500C - 0x0184 5027
-
0x0184 5028
L1PINV
0x0184 502C - 0x0184 5039
-
0x0184 5040
L1DWB
0x0184 5044
L1DWBINV
0x0184 5048
L1DINV
Reserved
Reserved
L2 writeback all register
L2 writeback invalidate all register
L2 global invalidate without writeback
Reserved
L1P global invalidate
Reserved
L1D global writeback
L1D global writeback with invalidate
L1D global invalidate without writeback
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Table 2-2. C64x+ Cache Registers (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
0x0184 8000 - 0x0184 80FC
MAR0 - MAR63
Reserved 0x0000 0000 - 0x3FFF FFFF
DESCRIPTION
0x0184 80C0 - 0x0184 80FC
MAR48 - MAR63
Reserved 0x3000 0000 - 0x3FFF FFFF
0x0184 8100 - 0x0184 813C
MAR64 - MAR79
Memory attribute registers for PCI Data 0x4000 0000 - 0x4FFF FFFF
0x0184 8140 - 0x0184 827C
MAR80 - MAR159
Reserved 0x5000 0000 - 0x9FFF FFFF
0x0184 8280 - 0x0184 82BC
MAR160 - MAR175
Memory attribute registers for EMIFA CE2 0xA000 0000 - 0xA3FF FFFF
0x0184 82C0 - 0x0184 82FC
MAR176 - MAR191
Memory attribute registers for EMIFA CE3 0xB000 0000 - 0xB3FF FFFF
0x0184 8130 - 0x0184 813C
MAR76 - MAR79
Memory Attribute Registers for VLYNQ 0x4C00 0000 - 0x4FFF FFFF
0x0184 8300 - 0x0184 837C
MAR192 - MAR223
Reserved 0xC000 0000 - 0xDFFF FFFF
0x0184 8380 - 0x0184 83BC
MAR224 - MAR239
Memory attribute registers for DDR2 0xE000 0000 - 0xEFFF FFFF
0x0184 83C0 - 0x0184 83FC
MAR240 - MAR255
Memory attribute registers for DDR2 0xF000 0000 - 0xFFFF FFFF
2.4
Memory Map Summary
Table 2-3 shows the memory map address ranges of the device. The device has multiple on-chip
memories associated with its processor and various subsystems. To help simplify software development,
a unified memory map is used where possible to maintain a consistent view of device resources across all
bus masters.
Table 2-3. Memory Map Summary
12
START
ADDRESS
END
ADDRESS
0x0000 0000
0x000F FFFF
1M
0x0010 0000
0x0011 FFFF
128K
0x0020 0000
0x007F FFFF
6M
0x0080 0000
0x008B FFFF
768K
0x008C 0000
0x009F FFFF
2M - 768K
0x00A0 0000
0x00A3 FFFF
256K
L2 SRAM (for both DM647 and DM648)
0x00A4 0000
0x00A7 FFFF
256K
L2 SRAM (for DM648 only)
0x00A8 0000
0x00DF FFFF
4M - 512K
0x00E0 0000
0x00E0 7FFF
32K
0x00E0 8000
0x00EF FFFF
1M – 32K
0x00F0 0000
0x00F0 7FFF
32K
0x00F0 8000
0x00FF FFFF
1M – 32K
Reserved
0x0100 0000
0x017F FFFF
8M
Reserved
0x0180 0000
0x0180 FFFF
64K
C64x+ Interrupt Controller
0x0181 0000
0x0181 0FFF
4K
C64x+ Power-down Control
0x0181 1000
0x0181 1FFF
4K
C64x+ Security ID
0x0181 2000
0x0181 2FFF
4K
C64x+ Revision ID
0x0181 3000
0x0181 FFFF
52K
Reserved
0x0182 0000
0x0182 040F
1040B
0x0182 0410
0x0182 FFFF
64K – 16
Reserved
0x0183 0000
0x0183 FFFF
64K
Reserved
0x0184 0000
0x0184 FFFF
64K
C64x+ Memory control
0x0185 0000
0x01BB FFFF
3, 520K
Reserved
0x01BC 0000
0x01BC FFFF
64K
Emulation
0x01BD 0000
0x01BD FFFF
64K
Reserved
0x01BE 0000
0x01BF FFFF
128K
Reserved
0x01BE 0000
0x01FF FFFF
4.125M
Reserved
0x0200 0000
0x0200 007F
128B
0x0200 0080
0x0203 FFFF
256K – 128
0x0204 0000
0x0204 3FFF
16K
Device Overview
SIZE
(Bytes)
C64x+
MEMORY MAP
Reserved
VICP
Reserved
Internal ROM
Reserved
Reserved
L1P SRAM
Reserved
L1D SRAM
C64x+ EMC
HPI Control
Reserved
McASP Control
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Table 2-3. Memory Map Summary (continued)
START
ADDRESS
END
ADDRESS
SIZE
(Bytes)
C64x+
MEMORY MAP
0x0204 4000
0x0204 43FF
1K
McASP Data
0x0204 4400
0x0204 47FF
1K
Timer0
0x0204 4800
0x0204 4BFF
1K
Timer1
0x0204 4C00
0x0204 4FFF
1K
Timer2
0x0204 5000
0x0204 53FF
1K
Timer3
0x0204 5400
0x0204 5FFF
3K
Reserved
0x0204 6000
0x0204 6FFF
4K
PSC
0x0204 7000
0x0204 73FF
1K
UART
0x0204 7400
0x0204 77FF
1K
VIC Control
0x0204 7800
0x0204 7BFF
1K
SPI
0x0204 7C00
0x0204 7FFF
1K
I2C Data and Control
0x0204 8000
0x0204 83FF
1K
GPIO
0x0204 8400
0x0204 87FF
1K
PCI Control
0x0204 8800
0x0204 8FFF
2K
Reserved
0x0204 9000
0x0204 9FFF
4K
Chip-Level Registers
0x0204 A000
0x0207 FFFF
216K
Reserved
0x0208 0000
0x0209 FFFF
128K
VICP Configuration
0x020A 0000
0x020D FFFF
256K
Reserved
0x020E 0000
0x020E 01FF
512
0x020E 0200
0x0211 FFFF
256K – 512
0x0212 0000
0x0212 01FF
512
0x0212 0200
0x0215 FFFF
256K – 512
Reserved
0x0216 0000
0x029C FFFF
9M - 576K
Reserved
0x02A0 0000
0x02A0 7FFF
32K
EDMA3CC
0x02A0 8000
0x02A1 FFFF
96K
Reserved
0x02A2 0000
0x02A2 7FFF
32K
EDMA3TC0
0x02A2 8000
0x02A2 FFFF
32K
EDMA3TC1
0x02A3 0000
0x02A3 7FFF
32K
EDMA3TC2
0x02A3 8000
0x02A3 FFFF
32K
EDMA3TC3
0x02A4 0000
0x02A7 FFFF
256K
Reserved
0x02A8 0000
0x02A8 04FF
1.25K
Reserved
PLL Controller 1
Reserved
PLL Controller 2
0x02A8 0500
0x02AB FFFF
256K – 1.25K
Reserved
0x02AC 0000
0x02AD FFFF
128K
Reserved
0x02AE 0000
0x02AF FFFF
128K
Reserved
0x02B0 0000
0x02B0 00FF
256
Reserved
0x02B0 0100
0x02B0 3FFF
16K – 256
Reserved
0x02B0 4000
0x02B0 407F
128
Reserved
0x02B0 4080
0x02B3 FFFF
256K – 128
Reserved
0x02B4 0000
0x02B4 01FF
512
Reserved
0x02B4 0200
0x02B7 FFFF
256K – 512
Reserved
0x02B8 0000
0x02B9 FFFF
128K
Reserved
0x02BA 0000
0x02BB FFFF
128K
Reserved
0x02BC 0000
0x02BF FFFF
256K
Reserved
0x02C0 0000
0x02C0 3FFF
16K
VP0 Control
0x02C0 4000
0x02C0 7FFF
16K
VP1 Control
0x02C0 8000
0x02C0 BFFF
16K
VP2 Control
0x02C0 C000
0x02C0 FFFF
16K
VP3 Control
0x02C1 0000
0x02C1 3FFF
16K
VP4 Control
0x02C1 4000
0x02C3 FFFF
176K
Reserved
0x02C4 0000
0x02C7 FFFF
256K
Reserved
0x02C8 0000
0x02CB FFFF
256K
Reserved
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Table 2-3. Memory Map Summary (continued)
(1)
(2)
14
START
ADDRESS
END
ADDRESS
SIZE
(Bytes)
C64x+
MEMORY MAP
0x02CC 0000
0x02CF FFFF
256K
0x02D0 0000
0x02D0 1FFF
8K
Ethernet Subsystem CPPI RAM (1)
0x02D0 2000
0x02D0 2FFF
4K
Ethernet Subsystem Control
0x02D0 3000
0x02D0 3FFF
4K
Ethernet Subsystem 3PSW
0x02D0 4000
0x02D0 47FF
2K
Ethernet Subsystem MDIO
0x02D0 4800
0x02D0 4BFF
1K
Ethernet Subsystem SGMII0
0x02D0 4C00
0x02D0 4FFF
1K
Ethernet Subsystem SGMII1 (DM648 only)
0x02D0 5000
0x02D0 57FF
2K
Reserved
0x02D0 5800
0x02DB FFFF
746K
Reserved
0x02DC 0000
0x02DF FFFF
256K
Reserved
0x02E0 0000
0x02E0 3FFF
16K
Reserved
0x02E0 4000
0x02FF FFFF
2M – 16K
Reserved
0x0300 0000
0x03FF FFFF
16M
Reserved
0x0400 0000
0x0FFF FFFF
192M
Reserved
0x1000 0000
0x1FFF FFFF
256M
Reserved
0x2000 0000
0x2FFF FFFF
256M
Reserved
0x3000 0000
0x3000 00FF
256
Reserved
0x3000 0100
0x33FF FFFF
64M – 256
Reserved
0x3400 0000
0x3400 00FF
256
Reserved
0x3400 0100
0x37FF FFFF
64M – 256
Reserved
0x3800 0000
0x3BFF FFFF
64M
VLYNQ
0x3C00 0000
0x3CFF FFFF
16M
Reserved
0x3D00 0000
0x3DFF FFFF
16M
Reserved
0x3E00 0000
0x3FFF FFFF
32M
Reserved
0x4000 0000
0x4FFF FFFF
256M
PCI Data
0x5000 0000
0x51FF FFFF
32M
VP0 ChannelA Data
0x5200 0000
0x53FF FFFF
32M
VP0 ChannelB Data
0x5400 0000
0x55FF FFFF
32M
VP1 ChannelA Data
0x5600 0000
0x57FF FFFF
32M
VP1 ChannelB Data
0x5800 0000
0x59FF FFFF
32M
VP2 ChannelA Data
0x5A00 0000
0x5BFF FFFF
32M
VP2 ChannelB Data
0x5C00 0000
0x5DFF FFFF
32M
Reserved
0x5E00 0000
0x5FFF FFFF
32M
Reserved
0x6000 0000
0x61FF FFFF
32M
VP3 ChannelA Data
0x6200 0000
0x63FF FFFF
32M
VP3 ChannelB Data
0x6400 0000
0x65FF FFFF
32M
VP4 ChannelA Data
0x6600 0000
0x67FF FFFF
32M
VP4 ChannelB Data
0x6800 0000
0x6FFF FFFF
128M
Reserved
0x7000 0000
0x77FF FFFF
128M
EMIFA Configuration
0x7800 0000
0x7FFF FFFF
128M
DDR2 EMIF Configuration
0x8000 0000
0x8FFF FFFF
256M
Reserved
0x9000 0000
0x9FFF FFFF
256M
Reserved
0xA000 0000
0xA3FF FFFF
64M
EMIFA CE2 (2)
0xA400 0000
0xAFFF FFFF
256 - 64M
0xB000 0000
0xB3FF FFFF
64M
0xB400 0000
0xBFFF FFFF
256 - 64M
Reserved
0xC000 0000
0xCFFF FFFF
256M
Reserved
Reserved
Reserved
EMIFA CE3 (2)
The 8K CPPI Descriptor memory is mapped to an address range 0x02C8 2000 - 0x02C8 3FFF, from the perspective of the Ethernet
subsystem 3PSW. The buffer descriptors, when accessed from the C64x+, are addressed from 0x02D0 0000. However, within these
buffer descriptors, when the pointer to the next buffer descriptor is programmed, the Ethernet subsystem 3PSW is interpreting this value.
Thus, this programmed value should be in the address range starting from 0x02C8 2000.
The EMIFA CS0 and CS1 are not functionally supported; therefore, they are not pinned out.
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Table 2-3. Memory Map Summary (continued)
START
ADDRESS
END
ADDRESS
SIZE
(Bytes)
C64x+
MEMORY MAP
0xD000 0000
0xDFFF FFFF
256M
Reserved
0xE000 0000
0xEFFF FFFF
256M
DDR2 SDRAM
0xF000 0000
0xFFFF FFFF
256M
DDR2 SDRAM
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TMS320DM647
TMS320DM648
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2.5
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Pin Assignments
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings. For more information on pin
muxing, see Section 3.2.6, PINMUX Register.
2.5.1
Pin Map (Bottom View)
Figure 2-2 through Figure 2-5 show the bottom view of the ZUT package pin assignments in four
quadrants (A, B, C, and D).
1
2
3
4
AC
VSS
DVDD33
AHCLKX
AHCLKR
AB
VP2CLK0
VP2CTL1
AMUTEIN
AA
VP2CTL0
VP2D03
Y
VP2CTL2/
VSCRUN
W
VP2CLK1/
VCLK
V
VSS
5
6
7
8
9
10
11
12
DVDD33
ACLKR
ACLKX
VSS
SGMII1RXN
VSS
REFCLKN
VSS
AXR3
VSS
AXR0
DVDD33
AVDDT
SGMII1RXP
AVDDR
REFCLKP
DVDD33
VSS
AXR6
VDAC/
AXR9
AXR2
AFSX
VSS
VSS
PREQ/
GP03
VP2D06
VP2D04
DVDD33
AXR4
AXR1
STCLK/
AXR8
DVDD33
VSS
SGMII0TXP
RSV21
VP2D12/
VRXD0
VP2D07
VP2D09
VP2D02
AFSR
VSS
AVDDA
SGMII0TXN
RSV22
DVDD33
VP2D13
/VRXD1
VP2D14/
VRXD2
VP2D08
AXR7
AXR5
RSV17
AVDDA
PINTA/
GP02
DVDDD
AVDDT
PRST/
GP01
SGMII0RXP SGMII0RXN
VSS
SGMII1TXP SGMII1TXN
CVDD
VSS
U
VP2D15/
VRXD3
VP2D17/
VTXD1
VP2D16/
VTXD0
VP2D19/
VTXD3
VP2D18/
VTXD2
VP2D05
AMUTE
MDIO
T
VP3CLK0/
AECLKIN
VP3CTL0/
AAWE/ASWE
VP3D05/
AED03
VP3D04/
AED02
VP3D03/
AED01
VP3D02/
AED00
VSS
DVDD33
VSS
DVDDD
VSS
DVDD33
R
VP3CTL1/
AR/W
VP3D12/
AED08
VP3D09/
AED07
VP3D08/
AED06
VP3D07/
AED05
VP3D06/
AED04
DVDD33
CVDD
CVDDESS
VSS
CVDDESS
VSS
P
VP3CLK1/
VP3CTL2/
AECLKOUT AAOE/ASOE
VP3D16/
AED12
VP3D15/
AED11
VP3D14/
AED10
VP3D13/
AED09
VSS
DVDD33
VSS
CVDD
VSS
CVDD
MDCLK
N
VSS
DVDD33
PLLV1
VP3D17/
AED13
VP3D19/
AED15
VP3D18/
AED14
DVDD33
VSS
CVDD
VSS
CVDD
VSS
M
CLKIN1
RSV9
SYSCLK5
VP4D03/
ABE01
VP4D04/
AEA10
VP4D05
VSS
DVDD33
VSS
CVDD
VSS
CVDD
Figure 2-2. ZUT Pin Map [Top Left Quadrant]
16
Device Overview
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13
14
AD26/
HD26
AD22/
HD22
AD27/
HD27
15
16
17
PCLK/
HHWIL
VSS
PCBE1/
HDS2
AD23/
HD23
AD17/
HD17
DVDD33
AD28/
HD28
PIDSEL/
GP06
AD18/
HD18
PFRAME/
HINT
AD29/
HD29
PCBE3/
GP07
AD19/
HD19
AD16/
HD16
AD30/
HD30
AD24/
HD24
AD20/
HD20
PCBE2/
HR/W
PPERR/
HCS
AD31/
HD31
Ad25/
HD25
AD21/
HD21
DVDD33
PGNT/
GP00
VSS
DVDD33
VSS
DVDD33
CVDD
18
19
20
21
22
23
AD14/
HD14
DVDD33
PCBE0/
GP04
AD02/
HD02
AD04/
HD04
DVDD33
AC
PIRDY/
HRDY
AD12/
HD12
VSS
AD08/
HD08
AD05/
HD05
AD01/
HD01
VSS
AB
PTRDY/
GP05
AD15/
HD15
AD13/
HD13
AD09/
HD09
AD06/
HD06
AD00/
HD00
AD03/
HD03
AA
PDEVSEL/ PSTOP/
HCNTL1 HCNTL0
AD11/
HD11
AD10/
HD10
AD07/
HD07
VP0CTL0
VP0CLK0
Y
PSERR/
HDS1
PPAR/
HAS
VP0D02
VP0D06
VSS
DVDD33
W
VSS
VP0D03
VP0D05
VP0D09
VP0D12/
GP12
VP0CTL1
VP0CLK1
V
VSS
DVDD33
VP0D04
VP0D08
VP0D16
VP0D18
VP0D17
VP0CTL2
U
VSS
CVDD
VSS
VP0D07
VP0D13/
GP13
VP0D14/
GP14
VP0D15/
GP15
VSS
DVDD33
T
VSS
CVDD
VSS
DVDD33
VP0D19
VP1D02/
GP16
VP1D07/
GP21
VP1D06/
GP20
VP1D05/
GP19
VP1CTL0
R
VSS
CVDD
VSS
DVDD33
VSS
VP1D04/
GP18
VP1D03/
GP17
VP1D14/
GP26
VP1D13/
GP25
VP1CTL1
VP1CLK0
P
CVDD
VSS
CVDD
VSS
DVDD33
VP1D17/
GP29
VP1D12/
GP24
VP1D09/
GP23
VP1D08/
GP22
VP1CTL2
VP1CLK1
N
VSS
CVDD
VSS
DVDD33
VSS
VP1D16/
GP28
VP1D19/
GP31
VP1D15/
GP27
VP1D18/
GP30
VSS
DVDD33
M
Figure 2-3. ZUT Pin Map [Top Right Quadrant]
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TMS320DM647
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L
VP4CLK0/
AARDY
VP4D02/
ABE00
VP4D06/
ACE2
VP4D07/
ACE3
VP4D08/
AEA00
VP4D13/
AEA03
DVDD33
VSS
CVDD
VSS
CVDD
VSS
K
VP4CLK1
VP4CTL2/
ASADS/ASRE
VP4D09/
AEA01
VP4D12/
AEA02
VP4D14/
AEA04
VP4D19/
AEA09
VSS
DVDD33
VSS
CVDD
VSS
CVDD
J
VP4CTL1/
ABA1
VP4CTL0/
ABA0
VP4D15/
AEA05
VP4D16/
AEA06
VP4D17/
AEA07
VP4D18/
AEA08
DVDD33
VSS
VSS
CVDD
VSS
H
VSS
UHPIEN
HPIWIDTH/
AEA16
AEA23
AEA19
RSV_BOOT/
AEA15
RSV7
RSV8
CVDD1
DVDD18
VSS
DVDD18
G
DVDD33
FASTBOOT
/AEA21
EMIFA
WIDTH/
AEA22
AECLKIN
SEL/
AEA17
PCI66/
AEA18
BOOT
MODE3/
AEA14
PLLV2
VSS
DVDD18
VSS
DVDD18
F
CLKIN2
DEVICE
ENABLE0/
AEA20
BOOT
MODE0/
AEA11
BOOT
MODE1/
AEA12
BOOT
MODE2/
AEA13
RSV18
VSS
DVDD18
DDR_CS
DDR_A13
DDR_A06
DDR_A08
E
RSV12
RSV11
RSV14
RSV13
DVDD18
VSS
DDR_D07
DDR_D04
DDR_D00
DDR_RAS
DDR_BA[2]
DDR_A12
D
RSV4
RSV3
RSV6
RSV5
DDR_
DQM[1]
DDR_D10
DDR_
DQGATE0
DDR_D05
VSS
DDR_CAS
DDR_WE
C
RSV20
RSV19
DVDD18
VSS
DDR_D15
DDR_D08
DDR_D06
DDR_D03
DDR_D01
DVDD18
DDR_
VREF
DDR_BA[0]
B
DVDD18
VDD18MON
DDR_D12
DDR_D14
DVDD18
DDR_
DQGATE1
DDR_D09
DDR_
DQM[0]
DDR_D02
AVDLL1
DDR_CKE
DDR_BA[1]
A
VSS
RSV10
DDR_D11
DDR_D13
DDR_
DQS[1]
DDR_
DQS[1]
DDR_
DQS[0]
DDR_
DQS[0]
RSV15
DDR_CLK
DDR_CLK
1
2
3
4
6
7
8
9
10
11
12
VSS
5
CVDD
VSS
VSS
Figure 2-4. ZUT Pin Map [Bottom Left Quadrant]
18
Device Overview
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VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD1
VSS
CVDD
VSS
DVDD33
VSS
DVDD18
VSS
DVDD33
VSS
DVDD18
VSS
DVDD18
VSS
DDR_A02
DVDD18
VSS
DDR_ODT0
DDR_A03
DDR_
DQM[2]
DDR_D19
DDR_D23
DDR_
DQGATE2
DDR_D31
DDR_A09
DDR_A04
DDR_A00
DDR_D18
DDR_D22
DDR_D25
DVDD18
DDR_A05
DDR_A01
DDR_D17
DDR_D21
DDR_A11
DDR_A07
DVDD18
DDR_D16
DDR_A10
DDR_ODT1
VSS
13
14
DVDD33
EMU4
VCCMON
RSV1
RSV2
TMS
TRST
L
VSS
EMU11
EMU6
EMU3
EMU2
EMU1
EMU0
K
EMU10
EMU8
EMU5
TDI
TDO
J
POR
RESETSTAT
EMU9
EMU7
DVDD33
TCLK
H
DVDD18
VSS
DVDD33
VDD33MON
VSS
SPIDI/
UARTRTS
G
VSS
DVDD18
VSS
NMI
RESET
SPIDO/
UARTCTS
SPICLK
SPICS2/
UARTRX
F
T0INP12/
GP08
T1INP12/
GP10
DVDD33
VSS
E
DDR_D29
VSS
T0OUT12/
GP09
SCL
DDR_D24
DDR_D27
DDR_D30
DVDD18
T1OUT12/
GP11
SDA
DDR_D20
DVDD18
DDR_D26
DDR_D28
DDR_
DQM[3]
AVDLL2
DVDD18
DDR_
DQS[2]
DDR_
DQS[2]
VSS
DDR_
DQS[3]
DDR_
DQS[3]
DDR_
DQGATE3
RSV16
VSS
16
17
19
20
21
22
23
DVDD18
15
DVDD33
18
DVDD33
SPICS1/
UARTTX
D
C
B
A
Figure 2-5. ZUT Pin Map [Bottom Right Quadrant]
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TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
2.6
www.ti.com
Terminal Functions
The terminal functions tables (Table 2-4 through Table 2-5) identify the external signal names, the
associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin
has any internal pullup or pulldown resistors, and a functional pin description. For more detailed
information on device configuration, peripheral selection, multiplexed/shared pin, and debugging
considerations, see Section 3.
All device boot and configuration pins are multiplexed with functional pins. These pins function as device
boot and configuration pins only during device reset. When both the reset pin (RESET) and the power-on
reset pin (POR) are deasserted, the input states of these multiplexed device boot and configuration pins
are sampled and latched into the BOOTCFG register. For proper device operation, these pins must be
pulled up/down to the desired value via an external resistor.
Table 2-4. Terminal Functions
TERMINAL NAME
NO
TYPE
1)
(
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
Clock/PLL Configuration
CLKIN1
M1
I
IPD
3.3 V
Clock Input for PLL1
CLKIN2
F1
I
IPD
3.3 V
Clock Input for PLL2
REFCLKN (2)
AC11
I
(2)
REFCLKP
Differential Reference Clock input (negative) for SGMII
AB11
I
PLLV1
N3
A
1.8 V
Differential Reference Clock input (positive) for SGMII
1.8-V I/O Supply Voltage for PLL1
PLLV2
G7
A
1.8 V
1.8-V I/O Supply Voltage for PLL2
SYSCLK5
M3
I/O/Z
3.3 V
Clock out of device speed/4
IPD
JTAG
TCLK
H23
I
IPU
3.3 V
JTAG Test Port Clock
TDI
J22
I
IPU
3.3 V
JTAG Test Port Data In
TDO
J23
OZ
IPU
3.3 V
JTAG Test Port Data Out
TMS
L22
I
IPU
3.3 V
JTAG Test Port Mode Select
TRST
L23
I
IPD
3.3 V
JTAG Test Port Reset
EMU0
K23
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 0
EMU1
K22
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 1
EMU2
K21
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 2
EMU3
K20
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 3
EMU4
L18
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 4
EMU5
J21
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 5
EMU6
K19
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 6
EMU7
H21
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 7
EMU8
J20
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 8
EMU9
H20
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 9
EMU10
J19
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 10
EMU11
K18
I/O/Z
IPU
3.3 V
JTAG Test Port Emulation 11
RESET/INTERRUPTS
NMI
J18
I
3.3 V
Nonmaskable Interrupt
RESETSTAT
H19
O
3.3 V
Reset Status Pin
RESET
G20
I
3.3 V
Device Reset
POR
H18
I
3.3 V
Power On Reset
(1)
(2)
20
IPD
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
The clock input buffers on the REFCLKP/N pins are compatible with LVDS and LVPECL clock sources. These input buffers include a
100-Ω termination (P to N) and a common-mode biasing. Because the common-mode biasing is included, the clock source must be AC
coupled.
Device Overview
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Table 2-4. Terminal Functions (continued)
TERMINAL NAME
NO
TYPE
1)
(
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
HOST-PORT INTERFACE (HPI) or PERIPHERAL COMPONENT INTERCONNECT (PCI) or GPIO[0:7]
AD00/HD00
AA22
I/O/Z
3.3 V
Host Port data [15:00] pin or PCI data-address bus [15:00]
[default]
AD01/HD01
AB22
I/O/Z
3.3 V
AD02/HD02
AC21
I/O/Z
3.3 V
AD03/HD03
AA23
I/O/Z
3.3 V
AD04/HD04
AC22
I/O/Z
3.3 V
AD05/HD05
AB21
I/O/Z
3.3 V
AD06/HD06
AA21
I/O/Z
3.3 V
AD07/HD07
Y21
I/O/Z
3.3 V
AD08/HD08
AB20
I/O/Z
3.3 V
AD09/HD09
AA20
I/O/Z
3.3 V
AD10/HD10
Y20
I/O/Z
3.3 V
AD11/HD11
Y19
I/O/Z
3.3 V
AD12/HD12
AB18
I/O/Z
3.3 V
AD13/HD13
AA19
I/O/Z
3.3 V
AD14/HD14
AC18
I/O/Z
3.3 V
AD15/HD15
AA18
I/O/Z
3.3 V
AD16/HD16
Y16
I/O/Z
3.3 V
AD17/HD17
AB15
I/O/Z
3.3 V
AD18/HD18
AA15
I/O/Z
3.3 V
AD19/HD19
Y15
I/O/Z
3.3 V
AD20/HD20
W15
I/O/Z
3.3 V
AD21/HD21
V15
I/O/Z
3.3 V
AD22/HD22
AC14
I/O/Z
3.3 V
AD23/HD23
AB14
I/O/Z
3.3 V
AD24/HD24
W14
I/O/Z
3.3 V
AD25/HD25
V14
I/O/Z
3.3 V
AD26/HD26
AC13
I/O/Z
3.3 V
AD27/HD27
AB13
I/O/Z
3.3 V
AD28/HD28
AA13
I/O/Z
3.3 V
AD29/HD29
Y13
I/O/Z
3.3 V
AD30/HD30
W13
I/O/Z
3.3 V
AD31/HD31
V13
I/O/Z
3.3 V
PPAR/HAS
W19
I/O/Z
3.3 V
Host Address Strobe (I) or PCI parity [default]
PSTOP/HCNTL0
Y18
I/O/Z
3.3 V
Host Control selects between control, address, or data registers (I)
or PCI Stop [default]
PDEVSEL/HCNTL1
Y17
I/O/Z
3.3 V
Host Control selects between control, address, or data registers (I)
or PCI Device Select [default]
PPERR/HCS
W17
I/O/Z
3.3 V
Host Chip Select (I) or PCI Parity Error [default]
PSERR/ HDS1
W18
I/O/Z
3.3 V
Host Data Strobe 1 (I) or PCI System Error [default]
PCBE0/GP04
AC20
I/O/Z
3.3 V
PCI Command/Byte Enable 0 or GP[4] [default
PCBE1/HDS2
AC17
I
3.3 V
PCI Command/Byte Enable 1 or host data strobe 2
PCBE2/HR/W
W16
I/O/Z
3.3 V
PCI Command/Byte Enable 2 or host read or write select (I)
PCBE3/GP07
Y14
I/O/Z
3.3 V
PCI Command/Byte Enable 3 or GPIO[7]
PCLK/HHWIL
AC15
I/O/Z
3.3 V
PCI Clock (I) [default] or host Half-word Select - first or second
half-word (not necessarily high or low order) [For HPI16 bus width
selection only] (I)
Host Port data [31:16] pin or PCI data-address bus [31:16]
[default]
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TMS320DM647
TMS320DM648
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Table 2-4. Terminal Functions (continued)
TERMINAL NAME
NO
TYPE
PFRAME/HINT
AA16
PIRDY/HRDY
AB17
PGNT/GP00
PRST/GP01
(
OPER
VOLT
DESCRIPTION
I/O/Z
3.3 V
PCI Frame or host interrupt from DSP to host (O/Z)
I/O/Z
3.3 V
PCI Initiator Ready [default] or Host Ready from DSP to host (O/Z)
U13
I/O/Z
3.3 V
PCI Bus Grant (I) or GPIO[0]
U12
I/O/Z
3.3 V
PCI Reset (I) or GPIO[1]
PINTA/GP02
V12
I/O/Z
3.3 V
PCI Interrupt A (O/Z) or GPIO[2]
PREQ/GP03
AA12
I/O/Z
3.3 V
PCI Bus Request (O/Z) or GPIO[3]
PTRDY/GP05
AA17
I/O/Z
3.3 V
PCI Target Ready or GPIO[5]
PIDSEL/GP06
AA14
I/O/Z
3.3 V
PCI Initialization Device Select (I) or GPIO[6]
1)
INTERNAL
PULLUP/
PULLDOWN
DDR2 MEMORY CONTROLLER
DDR_BA[0]
C12
I/O/Z
1.8 V
DDR_BA[1]
B12
I/O/Z
1.8 V
DDR_BA[2]
E11
I/O/Z
1.8 V
DDR_CS
F9
I/O/Z
1.8 V
DDR2 Memory Controller Memory Space Enable
DDR_A00
D15
I/O/Z
1.8 V
DDR2 Memory Controller External Address
DDR_A01
C15
I/O/Z
1.8 V
DDR_A02
F13
I/O/Z
1.8 V
DDR_A03
E14
I/O/Z
1.8 V
DDR_A04
D14
I/O/Z
1.8 V
DDR_A05
C14
I/O/Z
1.8 V
DDR_A06
F11
I/O/Z
1.8 V
DDR_A07
B14
I/O/Z
1.8 V
DDR_A08
F12
I/O/Z
1.8 V
DDR_A09
D13
I/O/Z
1.8 V
DDR_A10
A13
I/O/Z
1.8 V
DDR_A11
B13
I/O/Z
1.8 V
DDR_A12
E12
I/O/Z
1.8 V
DDR_A13
F10
I/O/Z
1.8 V
DDR_CLK
A12
I/O/Z
1.8 V
Negative DDR2 Memory Controller Output Clock (CLKIN2
frequency x 10)
DDR_CLK
A11
I/O/Z
1.8 V
DDR2 Memory Controller Output Clock (CLKIN2 frequency x 10)
DDR_D00
E9
I/O/Z
1.8 V
DDR2 Memory Controller External Data
DDR_D01
C9
I/O/Z
1.8 V
DDR_D02
B9
I/O/Z
1.8 V
DDR_D03
C8
I/O/Z
1.8 V
DDR_D04
E8
I/O/Z
1.8 V
DDR_D05
D8
I/O/Z
1.8 V
DDR_D06
C7
I/O/Z
1.8 V
DDR_D07
E7
I/O/Z
1.8 V
DDR_D08
C6
I/O/Z
1.8 V
DDR_D09
B7
I/O/Z
1.8 V
DDR_D10
D6
I/O/Z
1.8 V
DDR_D11
A3
I/O/Z
1.8 V
DDR_D12
B3
I/O/Z
1.8 V
DDR_D13
A4
I/O/Z
1.8 V
DDR_D14
B4
I/O/Z
1.8 V
DDR_D15
C5
I/O/Z
1.8 V
22
Device Overview
DDR2 Memory Controller Bank Address Control
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Table 2-4. Terminal Functions (continued)
TERMINAL NAME
NO
TYPE
DDR_D16
B16
DDR_D17
C16
DDR_D18
DDR_D19
(
OPER
VOLT
DESCRIPTION
I/O/Z
1.8 V
DDR2 Memory Controller External Data (continued)
I/O/Z
1.8 V
D16
I/O/Z
1.8 V
E16
I/O/Z
1.8 V
DDR_D20
B17
I/O/Z
1.8 V
DDR_D21
C17
I/O/Z
1.8 V
DDR_D22
D17
I/O/Z
1.8 V
DDR_D23
E17
I/O/Z
1.8 V
DDR_D24
C18
I/O/Z
1.8 V
DDR_D25
D18
I/O/Z
1.8 V
DDR_D26
B19
I/O/Z
1.8 V
DDR_D27
C19
I/O/Z
1.8 V
DDR_D28
B20
I/O/Z
1.8 V
DDR_D29
D19
I/O/Z
1.8 V
DDR_D30
C20
I/O/Z
1.8 V
DDR_D31
E19
I/O/Z
1.8 V
DDR_ODT0
E13
I/O/Z
1.8 V
DDR_ODT1
A14
I/O/Z
1.8 V
DDR_CAS
D10
I/O/Z
1.8 V
DDR2 Memory Controller SDRAM column address strobe
DDR_CKE
B11
I/O/Z
1.8 V
DDR2 Memory Controller SDRAM clock-enable
DDR_DQGATE0
D7
I/O/Z
1.8 V
DDR2 Memory Controller Data Strobe Gate
DDR_DQGATE1
B6
I/O/Z
1.8 V
DDR_DQGATE2
E18
I/O/Z
1.8 V
DDR_DQGATE3
A21
I/O/Z
1.8 V
DDR_DQM[0]
B8
I/O/Z
1.8 V
DDR_DQM[1]
D5
I/O/Z
1.8 V
DDR_DQM[2]
E15
I/O/Z
1.8 V
DDR_DQM[3]
B21
I/O/Z
1.8 V
DDR2 Memory Controller Byte-enable Controls. Decoded from the
low-order address bits. The number of address bits or byte
enables used depends on the width of external memory. Byte-write
enables for most types of memory. Can be directly connected to
SDRAM read and write mask signal (SDQM).
DDR_DQS[0]
A9
I/O/Z
1.8 V
DDR2 Memory Controller Data Strobe [3:0]
DDR_DQS[1]
A7
I/O/Z
1.8 V
DDR_DQS[2]
A17
I/O/Z
1.8 V
DDR_DQS[3]
A20
I/O/Z
1.8 V
DDR_DQS[0]
A8
I/O/Z
1.8 V
DDR_DQS[1]
A6
I/O/Z
1.8 V
DDR_DQS[2]
A16
I/O/Z
1.8 V
DDR_DQS[3]
A19
I/O/Z
1.8 V
DDR_RAS
E10
I/O/Z
1.8 V
DDR2 Memory Controller SDRAM Row Address Strobe
DDR_WE
D11
I/O/Z
1.8 V
DDR2 Memory Controller SDRAM Write Enable
1)
INTERNAL
PULLUP/
PULLDOWN
On-die termination signals to external DDR2 SDRAM. These pins
are reserved for future use and should not be connected to the
DDR2 SDRAM.
Note: There are no on-die termination resistors implemented on
the DM647/DM648 DSP die.
DDR2 Memory Controller Data Strobe [3:0] Negative
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TMS320DM647
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www.ti.com
Table 2-4. Terminal Functions (continued)
(
TERMINAL NAME
NO
TYPE
1)
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
DEVICEENABLE0/
AEA20
F2
I/O/Z
IPD
3.3 V
EMIFA External Address 20 (word address). (O/Z) For proper
device operation, this pin must be externally pulled up with a 1-kΩ
resistor at device reset
EMIFAWIDTH/
AEA22
G3
I/O/Z
IPD
3.3 V
EMIFA External Address 22 (word address). (O/Z) EMIFA data
bus width selection pin state captured at the rising edge of
RESET.
0 - sets EMIFA CS2 to 8-bit data bus width
1 - sets EMIFA CS2 to 16 bit data bus width. For details, see
Section 3.
FASTBOOT/
AEA21
G2
I/O/Z
IPD
3.3 V
EMIFA External Address 22 (word address). (O/Z) Enables FAST
BOOT of the device. For details, see Section 3.
UHPIEN
H2
I
IPD
3.3 V
UHPI Enable Pin. This pin controls the selection (enable/disable)
of the HPI and GPIO[0:7] muxed with PCI. For details, see
Section 3.
HPIWIDTH/
AEA16
H3
I/O/Z
IPD
3.3 V
EMIFA External Address 16 (word address) (O/Z) HPI peripheral
bus width (HPI_WIDTH) select (Applies only when HPI is enabled;
UHPIEN pin = 1)
RSV_BOOT/
AEA15
H6
I/O/Z
IPU
3.3 V
EMIFA External Address 15 (word address) (O/Z) For proper
device operation, this pin must be externally pulled up with a 1-kΩ
resistor at device reset.
PCI66/AEA18
G5
I/O/Z
IPD
3.3 V
PCI Frequency Selection (PCI66). The PCI peripheral must be
enabled (UHPIEN = 0) to use this function. PCI66_AEA18 selects
the PCI operating frequency of 66 MHz or 33 MHz. PCI operating
frequency is selected at reset via the pullup/pulldown resistor on
the PCI66 pin AEA18:
0 - PCI operates at 33 MHz (default)
1 - PCI operates at 66 MHz.
BOOTMODE0/AEA11
BOOTMODE1/AEA12
BOOTMODE2/AEA13
BOOTMODE3/AEA14
F3
F4
F5
G6
I/O/Z
IPD
3.3 V
The BOOTMODE[3:0] defines what boot code is executed on
device reset. See Section 3.2.1 for more details.
CONFIGURATION AND EMIFA
INTER-INTEGRATED CIRCUIT (I2C)
SCL
D22
I/O/Z
3.3 V
I2C clock. When the I2C module is used, use an external pullup
resistor.
SDA
C23
I/O/Z
3.3 V
I2C data. When I2C is used, make certain there is an external
pullup resistor.
SGMII0/1 and MDIO (1) (2)
SGMII0RXN
AA10
I
1.2 V
Differential SGMII Port 0 RX input (negative)
SGMII0RXP
AA9
I
1.2 V
Differential SGMII Port 0 RX input (positive)
SGMII0TXN
W11
O
1.2 V
Differential SGMII Port 0 TX output (negative)
SGMII0TXP
Y11
O
1.2 V
Differential SGMII Port 0 TX output (positive)
SGMII1RXN
AC9
I
1.2 V
Differential SGMII Port 1 RX input (negative)
SGMII1RXP
AB9
I
1.2 V
Differential SGMII Port 1 RX input (positive)
SGMII1TXN
W9
O
1.2 V
Differential SGMII Port 1 TX output (negative)
SGMII1TXP
W8
O
1.2 V
Differential SGMII Port 1 TX output (positive)
MDCLK
U9
OZ
3.3 V
MDIO Serial Clock (MDCLK)
(1)
(2)
24
IPD
For DM647: Leave the SGMII1RXP/N and SGMII1TXP/N pins disconnected. Disable ENTX/ENRX bits in CFGTX1/CFGRX1 for SGMII1
and still configure the CFGPLL because the SerDes TXBCLK0 is used as the internal VBUS clock. For DM648: if one of the SGMII pair
is not used, the same approach must be used.
If the Ethernet Subsystem is not used at all, these connections must be followed:
• Disconnect AA10, AA9, W11,Y11, AC9, AB9, W9, W8, and U9
• Connect AC11 to CVDD
• Connect AB11 to VSS
• Directly connect V11 (VDDA), W10 (VDDA), T10 (VDDD), U10 (VDDD)
, AB8 (VDDT), U11 (VDDT), R9 (ESS core power), R11 (ESS
core power) to CVDD
• Directly connect AB10, (VDDR) to DVDD18
Device Overview
Copyright © 2007–2011, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com: TMS320DM647 TMS320DM648
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Table 2-4. Terminal Functions (continued)
(
TERMINAL NAME
NO
TYPE
1)
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
MDIO
U8
I/O/Z
IPU
3.3 V
MDIO Serial Data (MDIO)
SPI or UART
SPICLK
F22
I/O/Z
IPU
3.3 V
SPI Clock Output
SPICS1/UARTTX
D23
I/O/Z
IPU
3.3 V
SPI Chip Select 1 or UART Transmit (O/Z)
SPICS2/UARTRX
F23
I/O/Z
IPU
3.3 V
SPI Chip Select 2 or UART Receive
SPIDI/UARTRTS
G23
I/O/Z
IPU
3.3 V
SPI Data input or UART Ready to send (O/Z)
SPIDO/UARTCTS
F21
I/O/Z
IPU
3.3 V
SPI Data Output or UART Clear to send
TIMER 0/1 or GPIO[8:11]
T0INP12/GP08
E20
I/O/Z
IPD
3.3 V
Timer 0 input pin for lower 32-bit counter (I) or GPIO 8
T0OUT12/GP09
D21
I/O/Z
IPD
3.3 V
Timer 0 output pin for lower 32-bit counter (O/Z) or GPIO 9
T1INPL/GP10
E21
I/O/Z
IPD
3.3 V
Timer 1 input pin for lower 32-bit counter (I) or GPIO 10
T1OUT12/GP11
C22
I/O/Z
IPD
3.3 V
Timer 1 output pin for lower 32-bit counter(O/Z) or GPIO 11
AHCLKR
AC4
I/O/Z
IPD
3.3 V
McASP Receive high-frequency master clock
AHCLKX
AC3
I/O/Z
IPD
3.3 V
McASP Transmit high-frequency master clock
ACLKR
AC6
I/O/Z
IPD
3.3 V
McASP Receive master clock
ACLKX
AC7
I/O/Z
IPD
3.3 V
McASP Transmit master clock
AFSR
W6
I/O/Z
IPD
3.3 V
McASP Receive Frame sync or left/right clock (LRCLK)
AFSX
AA7
I/O/Z
IPD
3.3 V
McASP Transmit Frame sync or left/right clock (LRCLK)
AXR0
AB6
I/O/Z
IPD
3.3 V
McASP Data Pin [0:7]
AXR1
Y6
IPD
3.3 V
AXR2
AA6
IPD
3.3 V
AXR3
AB4
IPD
3.3 V
AXR4
Y5
IPD
3.3 V
AXR5
V7
IPD
3.3 V
AXR6
AA4
IPD
3.3 V
AXR7
V6
IPD
3.3 V
STCLK/AXR8
Y7
I/O/Z
IPD
3.3 V
The STCLK signal drives the hardware counter for use by the
video ports (I) or McASP data pin 8.
VDAC/AXR9
AA5
I/O/Z
IPD
3.3 V
VCXO Interpolated Control Port (VIC) single-bit digital-to-analog
converter (VDAC) output (O) or McASP data pin 9
AMUTEIN
McASP OR VIDEO PORT OR VIC
AB3
I/O/Z
IPD
3.3 V
McASP Mute Input
AMUTE
U7
I/O/Z
IPD
3.3 V
McASP Mute Output
VP0CLK0
Y23
I
IPU
3.3 V
Video Port 0 Clock 0 (I)
VP0CLK1
V23
I/O/Z
IPU
3.3 V
Video Port 0 Clock 1
VP0CTL0
Y22
I/O/Z
IPU
3.3 V
Video Port 0 Control 0
VP0CTL1
V22
I/O/Z
IPU
3.3 V
Video Port 0 Control 1
VP0CTL2
U23
I/O/Z
IPU
3.3 V
Video Port 0 Control 2
VP0D02
W20
I/O/Z
IPD
3.3 V
Video Port 0 Data 2
VP0D03
V18
I/O/Z
IPD
3.3 V
Video Port 0 Data 3
VP0D04
U18
I/O/Z
IPD
3.3 V
Video Port 0 Data 4
VP0D05
V19
I/O/Z
IPD
3.3 V
Video Port 0 Data 5
VP0D06
W21
I/O/Z
IPD
3.3 V
Video Port 0 Data 6
VP0D07
T18
I/O/Z
IPD
3.3 V
Video Port 0 Data 7
VP0D08
U19
I/O/Z
IPD
3.3 V
Video Port 0 Data 8
VIDEO PORT 0 OR GPIO[12:15]
Copyright © 2007–2011, Texas Instruments Incorporated
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Device Overview
25
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Table 2-4. Terminal Functions (continued)
(
TERMINAL NAME
NO
TYPE
1)
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
VP0D09
V20
I/O/Z
IPD
3.3 V
Video Port 0 Data 9
VP0D12/GP12
V21
I/O/Z
IPD
3.3 V
Video Port 0 Data 12 or GPIO 12
VP0D13/GP13
T19
I/O/Z
IPD
3.3 V
Video Port 0 Data 13 or GPIO 13
VP0D14/GP14
T20
I/O/Z
IPD
3.3 V
Video Port 0 Data 14 or GPIO 14
VP0D15/GP15
T21
I/O/Z
IPD
3.3 V
Video Port 0 Data 15 or GPIO 15
VP0D16
U20
I/O/Z
IPD
3.3 V
Video Port 0 Data 16
VP0D17
U22
I/O/Z
IPD
3.3 V
Video Port 0 Data 17
VP0D18
U21
I/O/Z
IPD
3.3 V
Video Port 0 Data 18
VP0D19
R18
I/O/Z
IPD
3.3 V
Video Port 0 Data 19
VP1CLK0
P23
I
IPU
3.3 V
Video Port 1 Clock 0
VP1CLK1
N23
I/O/Z
IPU
3.3 V
Video Port 1 Clock 1
VP1CTL0
R23
I/O/Z
IPU
3.3 V
Video Port 1 Control 0
VP1CTL1
P22
I/O/Z
IPU
3.3 V
Video Port 1 Control 1
VP1CTL2
N22
I/O/Z
IPU
3.3 V
Video Port 1 Control 2
VP1D02/GP16
R19
I/O/Z
IPD
3.3 V
Video Port 1 Data 2 or GPIO 16
VP1D03/GP17
P19
I/O/Z
IPD
3.3 V
Video Port 1 Data 3 or GPIO 17
VP1D04/GP18
P18
I/O/Z
IPD
3.3 V
Video Port 1 Data 4 or GPIO 18
VP1D05/GP19
R22
I/O/Z
IPD
3.3 V
Video Port 1 Data 5 or GPIO 19
VP1D06/GP20
R21
I/O/Z
IPD
3.3 V
Video Port 1 Data 6 or GPIO 20
VP1D07/GP21
R20
I/O/Z
IPD
3.3 V
Video Port 1 Data 7 or GPIO 21
VP1D08/GP22
N21
I/O/Z
IPD
3.3 V
Video Port 1 Data 8 or GPIO 22
VP1D09/GP23
N20
I/O/Z
IPD
3.3 V
Video Port 1 Data 9 or GPIO 23
VP1D12/GP24
N19
I/O/Z
IPD
3.3 V
Video Port 1 Data 12 or GPIO 24
VP1D13/GP25
P21
I/O/Z
IPD
3.3 V
Video Port 1 Data 13 or GPIO 25
VP1D14/GP26
P20
I/O/Z
IPD
3.3 V
Video Port 1 Data 14 or GPIO 26
VP1D15/GP27
M20
I/O/Z
IPD
3.3 V
Video Port 1 Data 15 or GPIO 27
VP1D16/GP28
M18
I/O/Z
IPD
3.3 V
Video Port 1 Data 16 or GPIO 28
VP1D17/GP29
N18
I/O/Z
IPD
3.3 V
Video Port 1 Data 17 or GPIO 29
VP1D18/GP30
M21
I/O/Z
IPD
3.3 V
Video Port 1 Data 18 or GPIO 30
VP1D19/GP31
M19
I/O/Z
IPD
3.3 V
Video Port 1 Data 19 or GPIO 31
VIDEO PORT 1 OR GPIO[16:31]
VIDEO PORT 2 OR VLYNQ
VP2CLK0
AB1
I
IPU
3.3 V
Video Port 2 Clock 0 (I)
VP2CLK1/VCLK
W1
I/O/Z
IPU
3.3 V
Video Port 2 Clock 1 or VLYNQ Clock (I/O)
VP2CTL0
AA1
I/O/Z
IPU
3.3 V
Video Port 2 Control 0
VP2CTL1
AB2
I/O/Z
IPU
3.3 V
Video Port 2 Control 1
VP2CTL2/VSCRUN
Y1
I/O/Z
IPU
3.3 V
Video Port 2 Control 2 or VLYNQ serial clock run request (I/O)
VP2D02
W5
I/O/Z
IPD
3.3 V
Video Port 2 Data 2
VP2D03
AA2
I/O/Z
IPD
3.3 V
Video Port 2 Data 3
VP2D04
Y3
I/O/Z
IPD
3.3 V
Video Port 2 Data 4
VP2D05
U6
I/O/Z
IPD
3.3 V
Video Port 2 Data 5
VP2D06
Y2
I/O/Z
IPD
3.3 V
Video Port 2 Data 6
VP2D07
W3
I/O/Z
IPD
3.3 V
Video Port 2 Data 7
VP2D08
V5
I/O/Z
IPD
3.3 V
Video Port 2 Data 8
VP2D09
W4
I/O/Z
IPD
3.3 V
Video Port 2 Data 9
VP2D12/VRXD0
W2
I/O/Z
IPD
3.3 V
Video Port 2 Data 12 or VLYNQ receive data pin [0] (I)
26
Device Overview
Copyright © 2007–2011, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com: TMS320DM647 TMS320DM648
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Table 2-4. Terminal Functions (continued)
(
TERMINAL NAME
NO
TYPE
1)
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
VP2D13/VRXD1
V3
I/O/Z
IPD
3.3 V
Video Port 2 Data 13 or VLYNQ receive data pin [1] (I)
VP2D14/VRXD2
V4
I/O/Z
IPD
3.3 V
Video Port 2 Data 14 or VLYNQ receive data pin [2] (I)
VP2D15/VRXD3
U1
I/O/Z
IPD
3.3 V
Video Port 2 Data 15 or VLYNQ receive data pin [3] (I)
VP2D16/VTXD0
U3
I/O/Z
IPD
3.3 V
Video Port 2 Data 16 or VLYNQ transmit data pin [0] (O)
VP2D17/VTXD1
U2
I/O/Z
IPD
3.3 V
Video Port 2 Data 17 or VLYNQ transmit data pin [1] (O)
VP2D18/VTXD2
U5
I/O/Z
IPD
3.3 V
Video Port 2 Data 18 or VLYNQ transmit data pin [2] (O)
VP2D19/VTXD3
U4
I/O/Z
IPD
3.3 V
Video Port 2 Data 19 or VLYNQ transmit data pin [3] (O)
VIDEO PORT 3 OR EMIFA
VP3CLK0/ AECLKIN
T1
I
IPD
3.3 V
Video Port 3 Clock 0 (I) or EMIFA external input clock (I)
VP3CLK1/
AECLKOUT
P1
I/O/Z
IPD
3.3 V
Video Port 3 Clock 1 or EMIFA output clock (O/Z)
VP3CTL0/
AAWE/ASWE
T2
I/O/Z
IPU
3.3 V
Video Port 3 Control 0 or Asynchronous memory write
enable/Programmable synchronous interface write-enable
VP3CTL1/ AR/W
R1
I/O/Z
IPU
3.3 V
Video Port 3 Control 1 or Asynchronous memory read/write (O/Z)
VP3CTL2/
AAOE/ASOE
P2
I/O/Z
IPU
3.3 V
Video Port 3 Control 2 or Asynchronous/Programmable
synchronous memory output-enable (O/Z)
VP3D02/AED00
T6
I/O/Z
IPU
3.3 V
Video Port 3 Data 2 or EMIFA External Data 0
VP3D03/AED01
T5
I/O/Z
IPU
3.3 V
Video Port 3 Data 3 or EMIFA External Data 1
VP3D04/AED02
T4
I/O/Z
IPU
3.3 V
Video Port 3 Data 4 or EMIFA External Data 2
VP3D05/AED03
T3
I/O/Z
IPU
3.3 V
Video Port 3 Data 5 or EMIFA External Data 3
VP3D06/AED04
R6
I/O/Z
IPU
3.3 V
Video Port 3 Data 6 or EMIFA External Data 4
VP3D07/AED05
R5
I/O/Z
IPU
3.3 V
Video Port 3 Data 7 or EMIFA External Data 5
VP3D08/AED06
R4
I/O/Z
IPU
3.3 V
Video Port 3 Data 8 or EMIFA External Data 6
VP3D09/AED07
R3
I/O/Z
IPU
3.3 V
Video Port 3 Data 9 or EMIFA External Data 7
VP3D12/AED08
R2
I/O/Z
IPU
3.3 V
Video Port 3 Data 12 or EMIFA External Data 8
VP3D13/AED09
P6
I/O/Z
IPU
3.3 V
Video Port 3 Data 13 or EMIFA External Data 9
VP3D14/AED10
P5
I/O/Z
IPU
3.3 V
Video Port 3 Data 14 or EMIFA External Data 10
VP3D15/AED11
P4
I/O/Z
IPU
3.3 V
Video Port 3 Data 15 or EMIFA External Data 11
VP3D16/AED12
P3
I/O/Z
IPU
3.3 V
Video Port 3 Data 16 or EMIFA External Data 12
VP3D17/AED13
N4
I/O/Z
IPU
3.3 V
Video Port 3 Data 17 or EMIFA External Data 13
VP3D18/AED14
N6
I/O/Z
IPU
3.3 V
Video Port 3 Data 18 or EMIFA External Data 14
VP3D19/AED15
N5
I/O/Z
IPU
3.3 V
Video Port 3 Data 19 or EMIFA External Data 15
VIDEO PORT 4 OR EMIFA
VP4CLK0/AARDY
L1
I
IPU
3.3 V
Video Port 4 Clock 0 (I) or Asynchronous memory ready input (I)
VP4CLK1
K1
I/O/Z
IPD
3.3 V
Video Port 4 Clock 1
VP4CTL0/ABA0
J2
I/O/Z
IPD
3.3 V
Video Port 4 Control 0 or EMIFA bank address control (ABA[1:0])
(O/Z). Active-low bank selects for the 16-bit EMIFA. When
interfacing to 16-bit asynchronous devices, ABA1 carries bit 1 of
the byte address. For an 8-bit asynchronous interface, ABA[1:0]
are used to carry bits 1 and 0 of the byte address.
VP4CTL1/ABA1
J1
I/O/Z
IPD
3.3 V
Video Port 4 Control 1 or EMIFA bank address control (ABA[1:0])
(O/Z). Active-low bank selects for the 16-bit EMIFA. WHEN
interfacing to 16-bit asynchronous devices, ABA1 carries bit 1 of
the byte address. For an 8-bit asynchronous interface, ABA[1:0]
are used to carry bits 1 and 0 of the byte address.
Copyright © 2007–2011, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com: TMS320DM647 TMS320DM648
Device Overview
27
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Table 2-4. Terminal Functions (continued)
(
TERMINAL NAME
NO
TYPE
1)
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
VP4CTL2/ ASADS/
ASRE
K2
I/O/Z
IPD
3.3 V
Video Port 4 Control 2 or Programmable synchronous address
strobe or read-enable. For programmable synchronous interface,
the r_enable field in the ChipSelect x Configuration Register
selects between ASADS and ASRE:
– If r_enable = 0, then the ASADS/ASRE signal functions as the
ASADS signal.
– If r_enable = 1, then the ASADS/ASRE signal functions as the
ASRE signal.
VP4D02/ ABE00
L2
I/O/Z
IPU
3.3 V
Video Port 4 Data 2 or EMIFA byte-enable control 0. Decoded
from the low-order address bits. The number of address bits or
byte enables used depends on the width of external memory.
Byte-write enables for most types of memory.
VP4D03/ABE01
M4
I/O/Z
IPU
3.3 V
Video Port 4 Data 3 or EMIFA byte-enable control 1. Number of
address bits or byte enables used depends on the width of
external memory. Byte-write enables for most types of memory.
VP4D04/AEA10
M5
I/O/Z
IPU
3.3 V
Video Port 4 Data 4 or EMIFA External Address 10 (word address)
(O/Z)
VP4D05
M6
I/O/Z
IPU
3.3 V
Video Port 4 Data 5
VP4D06/ACE2
L3
I/O/Z
IPU
3.3 V
Video Port 4 Data 6 or EMIFA memory space enable 2
VP4D07/ACE3
L4
I/O/Z
IPU
3.3 V
Video Port 4 Data 7 or EMIFA memory space enable 3
VP4D08/AEA00
L5
I/O/Z
IPD
3.3 V
Video Port 4 Data 8 or EMIFA External Address 0 (word address)
(O/Z)
VP4D09/AEA01
K3
I/O/Z
IPD
3.3 V
Video Port 4 Data 9 or EMIFA External Address 1 (word address)
(O/Z)
VP4D12/AEA02
K4
I/O/Z
IPD
3.3 V
Video Port 4 Data 12 or EMIFA External Address 2 (word address)
(O/Z)
VP4D13/AEA03
L6
I/O/Z
IPD
3.3 V
Video Port 4 Data 13 or EMIFA External Address 3 (word address)
(O/Z)
VP4D14/AEA04
K5
I/O/Z
IPD
3.3 V
Video Port 4 Data 14 or EMIFA External Address 4 (word address)
(O/Z)
VP4D15/AEA05
J3
I/O/Z
IPD
3.3 V
Video Port 4 Data 15 or EMIFA External Address 5 (word address)
(O/Z)
VP4D16/AEA06
J4
I/O/Z
IPD
3.3 V
Video Port 4 Data 16 or EMIFA External Address 6 (word address)
(O/Z)
VP4D17/AEA07
J5
I/O/Z
IPD
3.3 V
Video Port 4 Data 17 or EMIFA External Address 7 (word address)
(O/Z)
VP4D18/AEA08
J6
I/O/Z
IPD
3.3 V
Video Port 4 Data 18 or EMIFA External Address 8 (word address)
(O/Z)
VP4D19/AEA09
K6
I/O/Z
IPD
3.3 V
Video Port 4 Data 19 or EMIFA External Address 9 (word address)
(O/Z)
AEA23
H4
OZ
IPD
3.3 V
EMIFA External Address 23 (word address) (O/Z)
AEA19
H5
O/Z
IPU
3.3 V
EMIFA External Address 19 (word address) (O/Z)
AECLKINSEL/AEA17
G4
I/O/Z
IPD
3.3 V
Select EMIFA external clock (I) (The EMIFA input clock AECLKIN
or SYSCLK4 is selected at reset via the pullup/pulldown resistor
on this pin. Note: AECLKIN is the default for the EMIFA input
clock.)
or EMIFA external address 17 (word address) (O/Z)
EMIFA
28
Device Overview
Copyright © 2007–2011, Texas Instruments Incorporated
Submit Documentation Feedback
www.ti.com: TMS320DM647 TMS320DM648
TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
www.ti.com
Table 2-5. Terminal Functions (Ground and Power Supply)
(1)
TYPE (1)
TERMINAL
NAME
NO
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
VSS
A1
Ground
VSS
A5
Ground
VSS
A15
Ground
VSS
A18
Ground
VSS
A23
Ground
VSS
C4
Ground
VSS
D9
Ground
VSS
D12
Ground
VSS
D20
Ground
VSS
E6
Ground
VSS
E23
Ground
VSS
F7
Ground
VSS
F15
Ground
VSS
F17
Ground
VSS
F19
Ground
VSS
G8
Ground
VSS
G10
Ground
VSS
G12
Ground
VSS
G14
Ground
VSS
G16
Ground
VSS
G18
Ground
VSS
G22
Ground
VSS
H1
Ground
VSS
H11
Ground
VSS
H13
Ground
VSS
H15
Ground
VSS
H17
Ground
VSS
J8
Ground
VSS
J10
Ground
VSS
J12
Ground
VSS
J14
Ground
VSS
J16
Ground
VSS
K7
Ground
VSS
K9
Ground
VSS
K11
Ground
VSS
K13
Ground
VSS
K15
Ground
VSS
K17
Ground
VSS
L8
Ground
VSS
L10
Ground
VSS
L12
Ground
VSS
L14
Ground
VSS
L16
Ground
VSS
M7
Ground
VSS
M9
Ground
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
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Table 2-5. Terminal Functions (Ground and Power Supply) (continued)
30
TYPE (1)
TERMINAL
NAME
NO
VSS
M11
Ground
VSS
M13
Ground
VSS
M15
Ground
VSS
M17
Ground
VSS
M22
Ground
VSS
N1
Ground
VSS
N8
Ground
VSS
N10
Ground
VSS
N12
Ground
VSS
N14
Ground
VSS
N16
Ground
VSS
P7
Ground
VSS
P9
Ground
VSS
P11
Ground
VSS
P13
Ground
VSS
P15
Ground
VSS
P17
Ground
VSS
R10
Ground
VSS
R12
Ground
VSS
R14
Ground
VSS
R16
Ground
VSS
T7
Ground
VSS
T9
Ground
VSS
T11
Ground
VSS
T13
Ground
VSS
T15
Ground
VSS
T17
Ground
VSS
T22
Ground
VSS
U14
Ground
VSS
U16
Ground
VSS
V1
Ground
VSS
V9
Ground
VSS
V17
Ground
VSS
W7
Ground
VSS
W22
Ground
VSS
Y9
Ground
VSS
Y10
Ground
VSS
AA3
Ground
VSS
AA8
Ground
VSS
AA11
Ground
VSS
AB5
Ground
VSS
AB19
Ground
VSS
AB23
Ground
VSS
AC1
Ground
VSS
AC8
Ground
VSS
AC10
Ground
Device Overview
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
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Table 2-5. Terminal Functions (Ground and Power Supply) (continued)
TYPE (1)
TERMINAL
NAME
NO
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
VSS
AC12
Ground
VSS
AC16
Ground
CVDD
J9
1.2-V Core Power Supply
CVDD
J11
1.2-V Core Power Supply
CVDD
J15
1.2-V Core Power Supply
CVDD
K10
1.2-V Core Power Supply
CVDD
K12
1.2-V Core Power Supply
CVDD
K14
1.2-V Core Power Supply
CVDD
L9
1.2-V Core Power Supply
CVDD
L11
1.2-V Core Power Supply
CVDD
L13
1.2-V Core Power Supply
CVDD
L15
1.2-V Core Power Supply
CVDD
M10
1.2-V Core Power Supply
CVDD
M12
1.2-V Core Power Supply
CVDD
M14
1.2-V Core Power Supply
CVDD
N11
1.2-V Core Power Supply
CVDD
N13
1.2-V Core Power Supply
CVDD
N15
1.2-V Core Power Supply
CVDD
P10
1.2-V Core Power Supply
CVDD
P12
1.2-V Core Power Supply
CVDD
P14
1.2-V Core Power Supply
CVDD
R13
1.2-V Core Power Supply
CVDD
N9
1.2-V Core Power Supply
CVDD
T16
1.2-V Core Power Supply
CVDD
R8
1.2-V Core Power Supply
CVDD
R15
1.2-V Core Power Supply
CVDD
V8
1.2-V Core Power Supply
CVDDESS
R11
1.2-V Core Power Supply for Ethernet Subsystem
CVDDESS
R9
1.2-V Core Power Supply for Ethernet Subsystem
AVDLL1
B10
1.8-V I/O supply
AVDLL2
B22
1.8-V I/O supply
CVDD1
H9
1.2-V Power supply for DDR, DDR I/Os, EMIF-DDR
Subsystem
CVDD1
J13
1.2-V Power supply for DDR, DDR I/Os, EMIF-DDR
Subsystem
AVDDA
V11
1.2-V SerDes Analog supply
AVDDA
W10
1.2-V SerDes Analog supply
DVDDD
T10
1.2-V SerDes Digital Supply
DVDDD
U10
1.2-V SerDes Digital Supply
AVDDR
AB10
1.8-V SerDes Analog Supply (Regulator)
AVDDT
AB8
1.2-V SerDes Analog Supply
AVDDT
U11
1.2-V SerDes Analog Supply
DVDD33
E22
3.3-V I/O supply voltage
DVDD33
F20
3.3-V I/O supply voltage
DVDD33
G1
3.3-V I/O supply voltage
POWER PINS
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Table 2-5. Terminal Functions (Ground and Power Supply) (continued)
32
TYPE (1)
TERMINAL
NAME
NO
DVDD33
G19
3.3-V I/O supply voltage
DVDD33
J7
3.3-V I/O supply voltage
DVDD33
H16
3.3-V I/O supply voltage
DVDD33
H22
3.3-V I/O supply voltage
DVDD33
J17
3.3-V I/O supply voltage
DVDD33
K8
3.3-V I/O supply voltage
DVDD33
K16
3.3-V I/O supply voltage
DVDD33
L7
3.3-V I/O supply voltage
DVDD33
L17
3.3-V I/O supply voltage
DVDD33
M8
3.3-V I/O supply voltage
DVDD33
M16
3.3-V I/O supply voltage
DVDD33
M23
3.3-V I/O supply voltage
DVDD33
N2
3.3-V I/O supply voltage
DVDD33
N7
3.3-V I/O supply voltage
DVDD33
N17
3.3-V I/O supply voltage
DVDD33
P8
3.3-V I/O supply voltage
DVDD33
P16
3.3-V I/O supply voltage
DVDD33
R7
3.3-V I/O supply voltage
DVDD33
R17
3.3-V I/O supply voltage
DVDD33
T8
3.3-V I/O supply voltage
DVDD33
T12
3.3-V I/O supply voltage
DVDD33
T14
3.3-V I/O supply voltage
DVDD33
T23
3.3-V I/O supply voltage
DVDD33
AB7
3.3-V I/O supply voltage
DVDD33
U15
3.3-V I/O supply voltage
DVDD33
U17
3.3-V I/O supply voltage
DVDD33
V2
3.3-V I/O supply voltage
DVDD33
V16
3.3-V I/O supply voltage
DVDD33
W23
3.3-V I/O supply voltage
DVDD33
Y4
3.3-V I/O supply voltage
DVDD33
Y8
3.3-V I/O supply voltage
DVDD33
AB16
3.3-V I/O supply voltage
DVDD33
AC2
3.3-V I/O supply voltage
DVDD33
AC5
3.3-V I/O supply voltage
DVDD33
AB12
3.3-V I/O supply voltage
DVDD33
AC19
3.3-V I/O supply voltage
DVDD33
AC23
3.3-V I/O supply voltage
DVDD18
B1
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
B5
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
B15
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
B18
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
B23
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
C3
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
C10
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
C13
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
C21
1.8-V I/O supply voltage (DDR2 Memory Controller)
Device Overview
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
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Table 2-5. Terminal Functions (Ground and Power Supply) (continued)
TYPE (1)
TERMINAL
NAME
NO
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
DVDD18
E5
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
F8
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
F14
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
F16
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
F18
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
G9
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
G11
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
G13
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
G15
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
G17
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
H10
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
H12
1.8-V I/O supply voltage (DDR2 Memory Controller)
DVDD18
H14
1.8-V I/O supply voltage (DDR2 Memory Controller)
DDR_VREF
C11
(DVDD18/2)-V reference for SSTL buffer (DDR2 Memory
Controller0. This input voltage cn be generated directly from
DVDD18 using two 1-KΩ resistors to form a resister divider
circuit.
VCCMON
L19
Die-side 1.2-V core supply voltage monitor pin. The monitor
pins indicate the voltage on the die, and, therefore, provide the
best probe point for voltage monitoring purposes. If the VCCMON
pin is not used, it should be connected directly to the 1.2-V
core supply.
VDD18MON
B2
Die-side 1.8-V I/O supply voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best
probe point for voltage monitoring purposes. If the VDD18MON
pin is not used, it should be connected directly to the 1.8-V I/O
supply (DVDD18).
VDD33MON
G21
Die-side 3.3-V I/O supply voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best
probe point for voltage monitoring purposes. If the VDD33MON
pin is not used, it should be connected directly to the 3.3-V I/O
supply (DVDD33).
RSV 1
L20
A
Reserved. Unconnected
RSV 2
L21
A
Reserved. Unconnected
RSV 3
D2
O
Reserved. Unconnected
RSV 4
D1
O
Reserved. Unconnected
RSV 5
D4
O
Reserved. Unconnected
RSV 6
D3
O
Reserved. Unconnected
RSV 7
H7
A
Reserved. These pins must be connected directly to VSS for
proper device operation.
RSV 8
H8
A
Reserved. These pins must be connected directly to VSS for
proper device operation.
Reserved
RSV 9
M2
A
Reserved. Unconnected
RSV 10
A2
A
Reserved. Unconnected
RSV 11
E2
Reserved This pin must be connected directly to VSS for proper
device operation.
RSV 12
E1
Reserved. This pin must be connected directly to 1.8-V I/O
supply
RSV 13
E4
Reserved This pin must be connected directly to VSS for proper
device operation.
RSV 14
E3
Reserved. This pin must be connected directly to 1.8-V I/O
supply
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Table 2-5. Terminal Functions (Ground and Power Supply) (continued)
TERMINAL
NAME
NO
TYPE (1)
RSV 15
A10
A
Reserved. Unconnected
RSV 16
A22
A
Reserved. Unconnected
RSV 17
V10
A
Reserved. Unconnected
RSV 18
F6
I
Reserved. These pins must be connected directly to 1.8-V I/O
supply(DVDD18) for proper device operation.
RSV 19
C2
Reserved. This pin must be connected to the 1.8-V I/O supply
(DVDD18) via a 200-Ω resistor for proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the
DDR_VREF, RSV19, and RSV20 pins can be directly
connected to ground (VSS) to save power. However,
connecting these pins directly to ground will prevent boundary
scan from functioning on the DDR2 Memory Controller pins. To
preserve boundary-scan functionality on the DDR2 Memory
Controller pins, see Section 6.3.6.
RSV 20
C1
Reserved. This pin must be connected to ground (VSS) via a
200-Ω resistor for proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the RSV 19
and RSV 20 pins can be directly connected to ground (VSS) to
save power. However, connecting these pins directly to ground
will prevent boundary scan from functioning on the DDR2
Memory Controller pins. To preserve boundary-scan
functionality on the DDR2 Memory Controller pins, see
Section 6.3.6.
RSV 21
Y12
Reserved. This pin must be connected via a 20-Ω resistor
directly to 3.3-V I/O Supply (DVDD33) for proper device
operation. The resistor used should have a minimal rating of
250 mW.
RSV 22
W12
Reserved. This pin must be connected via a 40-Ω resistor
directly to ground (VSS) for proper device operation. The
resistor used should have a minimal rating of 100 mW.
2.7
2.7.1
INTERNAL
PULLUP/
PULLDOWN
OPER
VOLT
DESCRIPTION
Device Support
Development Support
TI offers an extensive line of development tools for the TMS320DM64x DMP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules. The tools support documentation is electronically
available within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of TMS320DM64xx DMP-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any SoC application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator (supports TMS320DM64x multiprocessor system
debug) EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320DM64x platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI
field sales office or authorized distributor.
34
Device Overview
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2.7.2
Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320DM648ZUTA7). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device's electrical
specifications.
TMP
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
TMS
Fully-qualified production device.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZUT), the temperature range (for example, "Blank" is the commercial
temperature range), and the device speed range in megahertz (for example, "Blank" is the default
[720-MHz]).
Figure 2-6 provides a legend for reading the complete device name for the devices.
TMS
320 DM648
ZUT
()
(7)
DEVICE SPEED RANGE
7 = 720 MHz
8 = 800 MHZ
9 = 900 MHZ
1 = 1.1 GHz
PREFIX
TMX = Experimental device
TMS = Qualified device
DEVICE FAMILY
TEMPERATURE RANGE
Blank = 0° C to 90° C, Commercial Temperature (720, 900, 1100)
A = -40° C to 105° C, Extended Temperature (800)
D = -40° C to 90° C, Industrial Temperature (720, 900, 1100)
320 = TMS320 DSP family
DEVICE
C64x+ DSP
DM647
DM648
PACKAGE TYPE
ZUT = 520-pin plastic ball grid array (BGA)
Figure 2-6. Device Nomenclature
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TMS320DM647
TMS320DM648
SPRS372G – MAY 2007 – REVISED NOVEMBER 2011
2.7.3
www.ti.com
Related Documentation From Texas Instruments
The following documents describe the devices. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
The current documentation that describes the DM64x DMP, related peripherals, and other technical
collateral, is available in the C6000 DSP product folder at: www.ti.com/c6000.
36
SPRU732
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRUEK5
TMS320DM647/DM648 DSP DDR2 Memory Controller User's Guide describes the DDR2
memory controller in the TMS320DM647/DM648 Digital Signal Processor (DSP). The
DDR2/mDDR memory controller is used to interface with JESD79D-2A standard compliant
DDR2 SDRAM devices and standard Mobile DDR SDRAM devices.
SPRUEK6
TMS320DM647/DM648 DSP External Memory Interface (EMIF) User's Guide describes
the operation of the asynchronous external memory interface (EMIF) in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The EMIF supports a glueless
interface to a variety of external devices.
SPRUEK7
TMS320DM647/DM648 DSP General-Purpose Input/Output (GPIO) User's Guide
describes the general-purpose input/output (GPIO) peripheral in the TMS320DM647/DM648
Digital Signal Processor (DSP). The GPIO peripheral provides dedicated general-purpose
pins that can be configured as either inputs or outputs. When configured as an input, you
can detect the state of the input by reading the state of an internal register. When configured
as an output, you can write to an internal register to control the state driven on the output
pin.
SPRUEK8
TMS320DM647/DM648 DSP Inter-Integrated Circuit (I2C) Module User's Guide describes
the inter-integrated circuit (I2C) peripheral in the TMS320DM647/DM648 Digital Signal
Processor (DSP). The I2C peripheral provides an interface between the DSP and other
devices compliant with the I2C-bus specification and connected by way of an I2C-bus.
External components attached to this 2-wire serial bus can transmit and receive up to 8-bit
wide data to and from the DSP through the I2C peripheral. This document assumes the
reader is familiar with the I2C-bus specification.
SPRUEL0
TMS320DM647/DM648 DSP 64-Bit Timer User's Guide describes the operation of the
64-bit timer in the TMS320DM647/DM648 Digital Signal Processor (DSP). The timer can be
configured as a general-purpose 64-bit timer or dual general-purpose 32-bit timers.
SPRUEL1
TMS320DM647/DM648 DSP Multichannel Audio Serial Port (McASP) User's Guide
describes the multichannel audio serial port (McASP) in the TMS320DM647/DM648 Digital
Signal Processor (DSP). The McASP functions as a general-purpose audio serial port
optimized for the needs of multichannel audio applications. The McASP is useful for
time-division multiplexed (TDM) stream, Inter-Integrated Sound (I2S) protocols, and
intercomponent digital audio interface transmission (DIT).
SPRUEL2
TMS320DM647/DM648 DSP Enhanced DMA (EDMA) Controller User's Guide describes
the operation of the enhanced direct memory access (EDMA3) controller in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The EDMA3 controller’s primary
purpose is to service user-programmed data transfers between two memory-mapped slave
endpoints on the DSP.
SPRUEL4
TMS320DM647/DM648 DSP Peripheral Component Interconnect (PCI) User's Guide
describes the peripheral component interconnect (PCI) port in the TMS320DM647/DM648
Digital Signal Processor (DSP). The PCI port supports connection of the C642x DSP to a
Device Overview
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PCI host via the integrated PCI master/slave bus interface. The PCI port interfaces to the
DSP via the enhanced DMA (EDMA) controller. This architecture allows for both PCI master
and slave transactions, while keeping the EDMA channel resources available for other
applications.
SPRUEL5
TMS320DM647/DM648 DSP Host Port Interface (UHPI) User's Guide describes the host
port interface (HPI) in the TMS320DM647/DM648 Digital Signal Processor (DSP). The HPI is
a parallel port through which a host processor can directly access the CPU memory space.
The host device functions as a master to the interface, which increases ease of access. The
host and CPU can exchange information via internal or external memory. The host also has
direct access to memory-mapped peripherals. Connectivity to the CPU memory space is
provided through the enhanced direct memory access (EDMA) controller.
SPRUEL8
TMS320DM647/DM648 DSP Universal Asynchronous Receiver/Transmitter (UART)
User's Guide describes the universal asynchronous receiver/transmitter (UART) peripheral
in the TMS320DM647/DM648 Digital Signal Processor (DSP). The UART peripheral
performs serial-to-parallel conversion on data received from a peripheral device, and
parallel-to-serial conversion on data received from the CPU.
SPRUEL9
TMS320DM647/DM648 DSP VLYNQ Port User's Guide describes the VLYNQ port in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The VLYNQ port is a high-speed
point-to-point serial interface for connecting to host processors and other VLYNQ compatible
devices. It is a full-duplex serial bus where transmit and receive operations occur separately
and simultaneously without interference.
SPRUEM1
TMS320DM647/DM648 DSP Video Port/VCXO Interpolated Control (VIC) Port User's
Guide discusses the video port and VCXO interpolated control (VIC) port in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The video port can operate as a
video capture port, video display port, or transport channel interface (TCI) capture port. The
VIC port provides single-bit interpolated VCXO control with resolution from 9 bits to up to 16
bits. When the video port is used in TCI mode, the VIC port is used to control the system
clock, VCXO, for MPEG transport channel.
SPRUEM2
TMS320DM647/DM648 DSP Serial Port Interface (SPI) User's Guide discusses the Serial
Port Interface (SPI) in the TMS320DM647/DM648 Digital Signal Processor (DSP). This
reference guide provides the specifications for a 16-bit configurable, synchronous serial
peripheral interface. The SPI is a programmable-length shift register, used for high speed
communication between external peripherals or other DSPs.
SPRUEU6
TMS320DM647/DM648 DSP Subsystem User's Guide describes the subsystem in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The subsystem is responsible for
performing digital signal processing for digital media applications. The subsystem acts as the
overall system controller, responsible for handling many system functions such as
system-level initialization, configuration, user interface, user command execution,
connectivity functions, and overall system control.
SPRUF57
TMS320DM647/DM648 DSP 3 Port Switch (3PSW) Ethernet Subsystem User's Guide
describes the operation of the 3 port switch (3PSW) ethernet subsystem in the
TMS320DM647/DM648 Digital Signal Processor (DSP). The 3 port switch gigabit ethernet
subsystem provides ethernet packet communication and can be configured as an ethernet
switch (DM648 only). It provides the serial gigabit media independent interface (SGMII), the
management data input output (MDIO) for physical layer device (PHY) management.
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3 Device Configuration
3.1
System Module Registers
The system module includes status and control registers required for configuration of the device. Brief
descriptions of the various registers are shown in Table 3-1. System Module registers required for device
configuration are described in the following sections.
Table 3-1. System Module Register Memory Map
HEX ADDRESS RANGE
REGISTER NAME
DESCRIPTION
0x0204 9000
PINMUX
Pin multiplexing control 0
0x0204 9004
Reserved
Reserved
0x0204 9008
DSPBOOTADDR
Boot Address of DSP, decoded by bootloader software for host boots
0x0204 900C
BOOTCMPLT
Boot Complete
0x0204 9010
Reserved
0x0204 9014
BOOTCFG
Device boot configuration
0x0204 9018
JTAGID
Device ID number. See Section 6.25 for details.
0x0204 901C
PRI_ALLOC
Bus master priority control. See Section 4 for details
0x0204 9020 -0x0204 9053
Reserved
Reserved
0x0204 9054
KEY_REG
Key Register to protect against accidental writes.
0x0204 9060 - 0x0204 90A7
Reserved
Reserved
0x0204 90A8
CFGPLL
CFGPLL inputs for SerDes
0x0204 90AC
Reserved
Reserved
0x0204 90B0
CFGRX0
Configure SGMII0 RX
0x0204 90B4
CFGRX1
Configure SGMII1 RX
(1)
(1)
0x0204 90B8
CFGTX0
Configure SGMII0 TX.
(1)
0x0204 90BC
CFGTX1
Configure SGMII1 TX
(1)
0x0204 90C0
Reserved
Reserved
0x0204 90C4
MAC_ADDR_R0
MAC Address Read Only Register 0
0x0204 90C8
MAC_ADDR_R1
MAC Address Read Only Register 1
0x0204 90CC
MAC_ADDR_RW0
MAC Address Read/Write Register 0
0x0204 90D0
MAC_ADDR_RW0
MAC Address Read/Write Register 1
0x0204 90D4
ESS_LOCK
Ethernet Sub System Lock Register
(1)
38
See the TMS320DM647/DM648 DSP Ethernet Subsystem User's Guide Reference Guide (literature number SPRUF57) for details.
Device Configuration
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3.2
Bootmode Registers
The BOOTCFG and DSPBOOTADDR registers are described in the following sections. At reset, the status
levels of various pins required for proper boot are stored within these registers.
3.2.1
Boot Configuration (BOOTCFG) Register
Configuration pins latched at reset are presented in the BOOTCFG register accessible through the system
module. This is a read-only register. The bits show the true latched value of the corresponding input at
RESET or POR deassertion. This is desirable since the most important use of this MMR is for the user to
debug/view the actual value driven on the pins during device reset.
Figure 3-1. BOOTCFG Register
31
24
Reserved
R-0
23
22
21
20
19
18
17
16
AECLKINSEL
PC166
HPIWIDTH
Reserved
FASTBOOT
Reserved
DUHPIEN
EMIFAWIDTH
R-L
R-L
R-L
R-L
15
8
Reserved
R-0
7
4
3
0
Reserved
BOOTMODE
R-0
R-L
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-2. BOOTCFG Register Field Descriptions
Bit
31:24
23
22
21
Field
Reserved
Controls the clock input for EMIFA. Latched from AECLKINSEL at RESET or POR deassertion
1
EMIFA clocked from internal SYSCLK
0
EMIFA clocked from outside from AECLKIN
PCI66
Controls PCI speed. PCI. Latched from PCI66 at RESET or POR deassertion
0
33 MHz PCI
1
66 MHz
HPIWIDTH
Reserved
19
FASTBOOT
18
Reserved
17
DUHPIEN
15:4
Description
AECLKINSEL
20
16
Value
Reserved
Controls HPI bus width. Latched from HPIWIDTH at RESET or POR deassertion
0
16 bit
1
32 bit
1
Reserved
Fast Boot. Latched from FASTBOOT at RESET or POR deassertion
0
No Fast Boot
1
Fast Boot
Reserved
PCI Enable Default. Latched from UHPIEN at RESET or POR deassertion
0
UHPI disabled
1
UHPI enabled
EMIFAWIDTH
Reserved
EMIFA CS2 Bus Width Default. Latched from EMIFAWIDTH at RESET or POR deassertion
0
8-bit
1
16-bit
Reserved
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Table 3-2. BOOTCFG Register Field Descriptions (continued)
Bit
Field
3:0
BOOTMODE
Value
Description
Boot Mode. Latched from Bootmode at RESET or POR deassertion
Table 3-3. Boot Modes
DEVICE BOOT AND
CONFIGURATION PINS
BOOT DESCRIPTION (1)
BOOTMODE[3:0]
UHPIEN
FASTBOOT
0000
0 or 1
0 or 1
0
1
1
0 or 1
0
1
1
0 or 1
0011
0 or 1
0100
0 or 1
0101
0 or 1
0110
DM647, DM648
(MASTER/SLAVE)
DSPBOOTADDR
(DEFAULT)
-
0x0080 0000
PCI boot no auto-initialization
Slave
0x0080 0000
HPI boot
Slave
0x0080 0000
PCI boot with auto-initialization
Slave
0x0080 0000
HPI boot
Slave
0x0080 0000
0
UART boot with no hardware flow control
Slave
0x0080 0000
0
EMIFA ROM direct boot (PLL bypass mode)
Master
0xA000 0000
1
EMIFA ROM AIS boot
Master
0x0080 0000
0 or 1
I2C Boot (standard mode)
Master
0x0080 0000
0 or 1
0 or 1
SPI boot
Master
0x0080 0000
0111
0 or 1
0 or 1
Reserved
-
0x0080 0000
1000
0 or 1
0 or 1
SGMII0 - Boot port, no packet forwarding
Slave
0x0080 0000
Slave
0x0080 0000
Slave
0x0080 0000
0001
0010
(1)
(2)
No boot (emulation boot)
1001
0 or 1
0 or 1
SGMII0 - Boot port, SGMII1 packet
forwarding (reserved in DM647)
1010
0 or 1
0 or 1
SGMII1 - Boot port, SGMII0 packet
forwarding (reserved in DM647)
1011
0 or 1
0 or 1
Reserved
-
0x0080 0000
1100
0 or 1
0 or 1
Reserved
-
0x0080 0000
1101
0 or 1
0 or 1
Reserved
-
0x0080 0000
Slave
0x0080 0000
-
0x0080 0000
1110
0 or 1
0
1111
0 or 1
0 or 1
UART Boot with hardware flow control
[UART0]
Reserved
In all bootmodes other than EMIFA ROM Direct Boot (BOOTMODE[3:0] = 0100b, UHPIEN = 0b or 1b, FASTBOOT = 0b) all C64x+
cache is disabled (L1P,L1D,L2).
For details of the boot process, see Using the TMS320DM647 Bootloader Application Report (literature number SPRAAJ1).
(2)
3.2.2
DSPBOOTADDR Register Description
The DSPBOOTADDR register contains the upper 22 bits of the C64x+ DSP reset vector. The register
format is shown in Figure 3-2 and bit field descriptions are shown in Table 3-4. DSPBOOTADDR is
readable and writable by software after reset. DSPBOOTADDR Decode: This decode logic determines the
default of the DSPBOOTADDR Register. It can default to the base address of L2 ROM (0x00800000) or
the base address of EMIFA CS2 (0xA0000000).
Figure 3-2. DSPBOOTADDR Register
31
10
9
0
BOOTADDR
Reserved
R/W-0100 0010 0010 0000 0000 00
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-4. DSPBOOTADDR Register Field Descriptions
Bit
31:10
9:0
40
Field
Value
Description
BOOTADDR
Upper 22 bits of the C64x+ DSP bootmode address
Reserved
Reserved
Device Configuration
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3.2.3
Boot Complete (BOOTCMPLT) register
The BOOTCMPLT register contains a BC (boot complete) field in bit 0, and a ERR (boot error) field in bits
19:16.
The BC field is written by the external host to indicates that it has completed boot. In the bootloader code,
the CPU can poll for this bit. Once this bit = 1, the CPU can begin executing from DSPBOOTADDR.
The ERR field is written by the bootloader software if the software detects a boot error. Coming out of a
boot, application software can read this field to determine if boot was accomplished. Actual error code is
determined by software.
Figure 3-3. BOOTCMPLT Register 3
31
20
19
16
Reserved
ERR
R-0
R-0
15
1
0
Reserved
BC
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-5. BOOTCMPLT Register Field Descriptions
Bit
Field
Value
Description
31:20
Reserved
Reserved
19:16
ERR
Boot error
0000
0001 – 1111
15:1
0
Reserved
No error
Bootloader software detected boot error. For details on boot errors, see the Using the
TMS320DM647/DM648 Bootloader Application Report (literature number SPRAAJ1).
Reserved
BC
Boot Complete Flag from host. This is applicable only to host boots.
0
Host has not completed booting this device.
1
Host has completed booting this device and the DSP can begin executing from
DSPBOOTADDR.
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3.2.4
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Priority Allocation (PRI_ALLOC)
Each of the masters (excluding the C64x+ Megamodule) is assigned a priority via the Priority Allocation
Register (PRI_ALLOC), see Figure 3-4. The priority is enforced when several masters in the system are
vying for the same endpoint. A value of 000b has the highest priority, while 111b has the lowest priority.
Note that the configuration SCR port on the data SCR is considered a single endpoint meaning priority will
be enforced when multiple masters try to access the configuration SCR. Priority is also enforced on the
configuration SCR side when a master (through the data SCR) tries to access the same endpoint as the
C64x+ Megamodule.
The Ethernet Subsystem and VLYNQ fields specify the priority of the Ethernet Subsystem and VLYNQ
peripherals, respectively. Similarly, the HOST field applies to the priority of the HPI and PCI peripherals.
Other master peripherals are not present in the PRI_ALLOC register as they have their own registers to
program their priorities. For more information on the default priority values in these peripheral registers,
see the device-compatible peripheral reference guides.
TI recommends that these priority registers be reprogrammed during device initialization.
Table 3-6. Default Master Priorities
MASTER
DEFAULT PRIORITY
EDMA3TC0
0 (EDMA CC QUEPRI Register)
EDMA3TC1
0 (EDMA CC QUEPRI Register)
EDMA3TC2
0 (EDMA CC QUEPRI Register)
EDMA3TC3
0 (EDMA CC QUEPRI Register)
64x+_DMAP
7 (C64x+ MDMAARBE.PRI Register bit field)
64x+_CFGP
1 (C64x+ MDMAARBE.PRI Register bit field)
Ethernet Subsystem
3 (PRI_ALLOC register)
VLYNQ
4 (PRI_ALLOC register)
UHPI
4 (PRI_ALLOC register)
PCI
4 (PRI_ALLOC register)
VICP
5 (PRI_ALLOC register)
Figure 3-4. Priority Allocation Register (PRI_ALLOC)
31
16
Reserved
R-0000000000001000
15
12
11
9
8
6
5
3
2
0
Reserved
VICP
VLYNQ
HOST
Ethernet Subsystem
R-0000
R/W-101
R/W-100
R/W-100
R/W-011
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
42
Device Configuration
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3.2.5
KEY_REG (write protection)
KEY_REG protects against accidental writes to certain system configuration registers. The complete set of
registers protected by the KEY_REG is:
• PINMUX
• BOOTCFG
• PRI_ALLOC
• CFGPLL
• CFGRX0
• CFGTX0
• CFGRX1
• CFGTX1
• MAC_ADDR_RW0
• MAC_ADDR_RW1
Writes to these registers are locked/blocked by default. To enable writes to these registers, write
0xADDDECAF to the KEY_REG. After enabling writes to protected registers by doing the above, the
register writes should occur within 10000 CPU/6 cycles, after which the key will be reset.
Figure 3-5. KEY_REG
31
0
KEY_REG
W-0x00000000
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
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3.2.6
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PINMUX Register
All pin multiplexing options are controlled by software via PINMUX register (except the ones mentioned in
Table 3-8, whose default is selected by configuration pins). This PINMUX register reside within the system
module portion of the CFG bus memory map. The format of the registers and a description of the pins
they control are in the following sections.
The PINMUX Register controls all the software-controlled pin muxing. The register format is shown in
Figure 3-6. A brief description of each field is shown in Table 3-7.
Figure 3-6. PINMUX Register
31
15
22
14
13
21
20
19
18
17
16
Reserved
GPIO_EN
Reserved
VPI_EN
R-0000 0000 00
R/W-00
R-00
R/W-00
12
11
10
9
8
7
6
5
4
3
1
0
VP34_EN
SPI_UART_EN
Reserved
MCASP_EN
Reserved
VLYNQ_EN
Reserved
TIMER
_EN
R/W-00
R/W-00
R-00
R/W-00
R-00
R/W-00
R-000
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-7. PINMUX Register Field Descriptions
Bit
Field
Value
Description
31:22
Reserved
Reserved
21:20
GPIO_EN
Controls the pin muxing between Video Port 0 and the GPIO[12:15]
UNMUXED (1)
UNMUXED
(2)
SECONDARY MUXED (3)
.VP0D16-19
VP0D02-09/CLK/CTL
00
3-state
3-state
VP0D12-15
3-state
01
3-state
3-state
3-state
10
Enable
Enable
VP0D12-15
11
3-state
Enable
GP12-15
19:18
Reserved
Reserved
17:16
VP1_EN
Controls the pin muxing between Video Port 1 and GPIO[16:31]
UNMUXED (4)
MUXED
VP1CLK01/VP1CTL0-2
(1)
(2)
(3)
(4)
(5)
44
The complete
The complete
The complete
The complete
The complete
list
list
list
list
list
of pins:
of pins:
of pins:
of pins:
of pins:
Device Configuration
GP12-15
(5)
VP1 Data
(V1D02-09/12-19)
GP[16-31]
00
3-state
01
3-state
3-state
3-state
10
3-state
GP16-31
11
Enable
VP1D02-09 and VP1D12-19
U20, U21, U22, R18.
Y23, V23, Y22, V22, U23, W20, V18, U18, V19, W21, T18, U19, V20.
V21, T19, T20, T21.
P23, N23, R23, P22, N22
R19, P19, P18, R22, R21, R20, N21, N20, N19, P21, P20, M20, M18, N18, M21, M19
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Table 3-7. PINMUX Register Field Descriptions (continued)
Bit
15:14
Field
Value
VP34_EN
Description
Controls the pin muxing between Video Port 3-4 and EMIFA
UNMUXED
VP4D05/VP4CLK1
00
13:12
(6)
(7)
MUXED (8)
VP3/VP4
EMIFA
3-state
3-state
01
3-state
3-state
10
Disable
EMIFA
11
Enable
VP3/VP4
SPI_UART_EN
Controls the pin muxing between SPI and UART
UNMUXED
00
(9)
MUXED
(10)
SPICLK
SPI or UART
3-state
3-state
01
Enable
SPI
10
Disable
UART
11
Enable
SPIDI
SPIDO
UART_TX
UART_RX
11:10
Reserved
Reserved
(6)
The value of VP34_EN depends on the BOOTMODE[3:0] pin value at reset. If the BOOTMODE[3:0] is 0100, the VP3/4 and the EMIFA
mux defaults to EMIFA enable (the value is 10b).
(7) The complete list of pins: K1, M6.
(8) The complete list of pins: T1, P1, T2, R1, P2, T6, T5, T4, T3, R6, R5, R4, R3, R2, P6, P5, P4, P3, N4, N6, N5, L1, J2, J1, K2, L2, M4,
M5, L3, L4, L5, K3, K4, L6, K5, J3, J4, J5, J6, K6.
(9) The complete list of pin:F22
(10) The complete list of pins: D23, F23, G23, F21
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Table 3-7. PINMUX Register Field Descriptions (continued)
Bit
Field
9:8
MCASP_EN
Value
Description
Controls the pin muxing between McASP and VIC
UNMUXED
MUXED
(11)
STCLK, VCTL, or McASP
00
3-state
01
McASP (all McASP Pins)
10
(McASP without AXR8, AXR9)
ACLKR
AFSR
AXR0
AXR1
AC:LKX
AFSX
AXR2
AXR3
AHCLKR
AMUTEIN
AXR4
AXR5
AHCLKX
AMUTE
AXR6
AXR7
STCLK
VCTL
11
Reserved
7:6
Reserved
Reserved
5:4
VLYNQ_EN
Controls the pin muxing between Video Port 2 and VLYNQ
3:1
0
UNMUXED (12)
MUXED (13)
VP2#1
VP2#2 VLYNQ
00
3-state
3-state
01
3-state
3-state
10
Enable
VP2D12-19, VP2CLK1, VP2CTL2
11
Enable
VRXD0-3 and VTXD0-3, VCLK, VSCRUN
Reserved
Reserved
TIMER_EN
Controls the pin muxing between TIMER and GPIO[8:11]
MUXED (14)
0
GPIO[8:11]
1
Timer 0/1
(11) The complete list of pins: AC4, AC3, AC6, AC7, W6, AA7, AB6, Y6, AA6, AB4, Y5, V7, AA4, V6, Y7, AA5, AB3, U7
(12) For the first half of the Video Port 2, the complete list of pins with function: AB1(VP2CLK0), AA1 (VP2CTL0), AB2 (VP2CTL1) and W5,
AA2, Y3, U6, Y2, W3, V5, W4 (VP2D02, VP2D03, VP2D04, VP2D05, VP2D06, VP2D07, VP2D08, VP2D09)
(13) For the second half of the Video Port 2, the complete list of pins with function: W1 (VP2CLK1/VCLK), Y1(VP2CTL2/VSCRUN), W2, V3,
V4, U1, U3, U2, U5, U4 (VP2D12/VRXD0, VP2D13/VRXD1, VP2D14/VRXD2, VP2D15/VRXD3, VP2D16/VTXD0, VP2D17/VTXD1,
VP2D18/VTXD2, VP2D19/VTXD3)
(14) The complete list of pins:E20, D21, E21, C22
46
Device Configuration
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Table 3-8. PCI/UHPI/GPIO Block: PCI MUXed With UHPI and GPIO[0:7]
MUXED (1)
PCI
UHPI/GPIO[0:7]
UHPIEN (pin)
(1)
1
UHPI/GPIO[0:7]
0
PCI
The complete list of pin:AA22, AB22, AC21, AA23, AC22, AB21, AA21, Y21, AB20, AA20, Y20, Y19, AB18, AA19, AC18, AA18, Y16,
AB15, AA15, Y15, W15, V15, AC14, AB14, W14, V14, AC13, AB13, AA13, Y13 , W13, V13, W19, Y18, Y17, W17, W18, AC20, AC17,
W16, Y14, AC15, AA16, AB17, U13, U12, V12, AA12, AA17, AA14.
For information on the Ethernet Subsystem registers, see the TMS320DM647/DM648 DSP Subsystem
Reference Guide (literature number SPRUEU6).
3.2.7
MAC Address Registers
•
•
•
•
MAC_ADDR_R0
MAC_ADDR_R1
MAC_ADDR_RW0
MAC_ADDR_RW1
Two sets of registers provide default MAC addresses for the device. One set - MAC_ADDR_R0 and
MAC_ADDR_R1 - is read only and the other set - MAC_ADDR_RW0 and MAC_ADDR_RW1 - includes
read and write registers.
Figure 3-7. MAC_ADDR_R0 Register
31
0
MAC_ID
R-MAC ADDRESS[31:0]
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-9. MAC_ADDR_R0 Register Field Descriptions
Bit
31:0
Field
MAC_ID
Value
Description
Mac
Bit 0 of MAC_ID is bit 0 of MAC Address
Address[31:0] of
the device
Figure 3-8. MAC_ADDR_R1 Register
31
24
23
16
CRC
Reserved
R-CRC for the MAC_ID
R-00000000
15
0
MAC_ID
R-MAC ADDRESS[47:32]
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-10. MAC_ADDR_R1 Register Field Descriptions
Bit
Field
Value
31:24
CRC
CRC of the MAC
ID
23:16
Reserved
15:0
MAC_ID
Description
This field will hold the CRC of the MAC address of that particular device.
0x00
Reserved
Mac
Bit 0 of MAC_ID is Bit 32 of MAC Address
Address[47:32] of
the device
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Figure 3-9. MAC_ADDR_RW0 Register
31
0
MAC_ADDR_R0
R/W - MAC ID[31:0]
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-11. MAC_ADDR_RW0 Register Field Descriptions
Bit
31:0
Field
Value
MAC_ID
Description
Mac
Bit 0 of MAC_ID is bit 0 of MAC Address
Address[31:0] of
the device
Figure 3-10. MAC_ADDR_RW1 Register
31
24
23
16
CRC
Reserved
R/W-CRC for the MAC_ID
R/W-00000000
15
0
MAC_ID
R-MAC ADDRESS[47:32]
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 3-12. MAC_ADDR_RW1 Register Field Descriptions
Bit
Field
Value
31:24
CRC
CRC of the
MAC ID
23:16
Reserved
15:0
MAC_ID
48
Device Configuration
0x00
Description
This field will hold the CRC of the MAC address of that particular device.
Reserved
Mac
Bit 0 of MAC_ID is Bit 32 of MAC Address
Address[47:32]
of the device
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3.3
Pullup/Pulldown Resistors
Proper board design should specify that input pins to the device always be at a valid logic level and not
floating. This may be achieved via pullup/pulldown resistors. The device features internal pullup (IPU) and
internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for external
pullup/pulldown resistors.
An external pullup/pulldown resistor must be used in the following situations:
• Boot and Configuration Pins: If the pin is both routed out and in high-impedance mode, an external
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
If the boot and configuration pins are both routed out and in high-impedance mode, it is recommended
that an external pullup/pulldown resistor be used. Although internal pullup/pulldown resistors exist on
these pins and they may match the desired configuration value, providing external connectivity can help
specify that valid logic levels are latched on these important boot configuration pins. In addition, applying
external pullup/pulldown resistors on the boot and configuration pins adds convenience to the user in
debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Select a resistor with the largest possible resistance
• Calculate the worst-case leakage current that flows through this external resistor. Worst-case leakage
current can be calculated by adding up all the leakage current at the pin—e.g., the input current (II)
from the device, and leakage current from the other device(s) to which this pin is connected.
• Specify that the voltage at the pin stays well within the low-/high-level input voltages (VIL or VIH) when
worst-case leakage current is flowing through this external resistor.
– To oppose an IPU and pull the signal to a logic low, the voltage at the pin must stay well below VIL.
– To oppose an IPD and pull the signal to a logic high, the voltage at the pin must stay well above
VIH.
For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to complement the IPU/IPD on the boot and configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) , see
Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Temperature.
For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions table.
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4 System Interconnect
The C64x+ Megamodule, the EDMA3 transfer controllers, and the system peripherals are interconnected
through two switch fabrics. The switch fabrics allow for low-latency, concurrent data transfers between
master peripherals and slave peripherals. Through a switch fabric, the CPU can send data to the video
ports without affecting a data transfer between the PCI and the DDR2 memory controller. The switch
fabrics also allow for seamless arbitration between the system masters when accessing system slaves.
4.1
Internal Buses, Bridges, and Switch Fabrics
Two types of buses exist in the device: data buses and configuration buses. Some device peripherals
have both a data bus and a configuration bus interface, while others only have one type of interface.
Furthermore, the bus interface width and speed varies from peripheral to peripheral. Configuration buses
are mainly used to access the register space of a peripheral and the data buses are used mainly for data
transfers. However, in some cases, the configuration bus is also used to transfer data. For example, data
is transferred to the UART or I2C via their configuration bus. Similarly, the data bus can also be used to
access the register space of a peripheral. For example, the EMIFA and DDR2 memory controller registers
are accessed through their data bus interface.
The C64x+ Megamodule, the EDMA3 traffic controllers, and the various system peripherals can be divided
into two categories: masters and slaves. Masters are capable of initiating read and write transfers in the
system and do not rely on the EDMA3 for their data transfers. Slaves, on the other hand, rely on the
EDMA3 to perform transfers to and from them. Masters include the EDMA3 traffic controllers and PCI.
Slaves include the McASP, video ports, and I2C.
The device contains two switch fabrics through which masters and slaves communicate. The data switch
fabric, known as the data switched central resource (SCR), is a high-throughput interconnect mainly used
to move data across the system (for more information, see Section 4.2). The data SCR connects masters
to slaves via 128-bit data buses running at a SYSCLK1 frequency (SYSCLK1 is generated from PLL1
controller). Peripherals that have a 128-bit data bus interface running at this speed can connect directly to
the data SCR; other peripherals require a bridge.
The configuration switch fabric, also known as the configuration switch central resource (SCR) is mainly
used by the C64x+ Megamodule to access peripheral registers (for more information, see Section 4.3).
The configuration SCR connects the C64x+ Megamodule to slaves via 32-bit configuration buses running
at a SYSCLK1 frequency (SYSCLK1 is generated from the PLL1 controller). As with the data SCR, some
peripherals require the use of a bridge to interface to the configuration SCR. Note that the data SCR also
connects to the configuration SCR. Bridges perform a variety of functions:
• Conversion between configuration bus and data bus.
• Width conversion between peripheral bus width and SCR bus width
• Frequency conversion between peripheral bus frequency and SCR bus frequency
For example, the EMIFA memory controller require a bridge to convert their 64-bit data bus interface into a
128-bit interface so that they can connect to the data SCR.
Some peripherals can be accessed through the data SCR and also through the configuration SCR.
4.2
Data Switch Fabric Connections
Figure 4-1 shows the connection between slaves and masters through the data switched central resource
(SCR). Masters are shown on the right and slaves on the left. The data SCR connects masters to slaves
via 128-bit data buses running at a SYSCLK1 frequency. SYSCLK1 is supplied by the PLL1 controller and
is fixed at a frequency equal to the CPU frequency divided by 3. Some peripherals, like PCI and the
C64x+ Megamodule, have both slave and master ports. Each EDMA3 transfer controller has an
independent connection to the data SCR.
Masters can access the configuration SCR through the data SCR. The configuration SCR is described in
Section 4.3.
50
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Not all masters on the device may connect to all slaves. Allowed connections are summarized in
Table 4-1.
128 SYSCLK1
128 SYSCLK1
M0
EDMA3 M1
Transfer
Controller M2
M3
Megamodule
M
128 SYSCLK1
128 SYSCLK1
128 SYSCLK1
128 SYSCLK1
S
0
S
1
S
2
S
3
M
128 SYSCLK1
M
M
128
SYSCLK1
32 SYSCLK3
HPI
M
PCI
M
Bridge
64
SYSCLK1
64
SYSCLK1
128 SYSCLK1
64
SYSCLK1
64
SYSCLK1
M
32 SYSCLK3 128 SYSCLK1
S
EMIFA
S
Video Port 0
S
Video Port 1
S
Video Port 2
S
Video Port 3
S
Video Port 4
S
PCI
S
VLYNQ
64
SYSCLK1
Bridge
128 SYSCLK1
32 TXBCLK
M
Bridge
S
M
3-port Gigabit
Ethernet Switch
DDR2
Memory
Controller
64
SYSCLK1
32 SYSCLK3
VLYNQ
S
Bridge
32 SYSCLK3
M
Megamodule
64
SYSCLK1
64
SYSCLK1
S
S
S
Bridge
128 SYSCLK1
32
SYSCLK3
32
SYSCLK3
M
32
SYSCLK3
Bridge
128 SYSCLK1
M
128
SYSCLK1
Bridge
32
SYSCLK1
S
Config SCR
Figure 4-1. Data SCR
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Table 4-1. Connectivity Matrix for Data SCR
MEGAMODULE
DDR2 EMIF
EMIFA
VIDEO
PORT 0-2
VIDEO
PORT 3-4
PCI
VLYNQ
Configuration
SCR
TC0
Y
Y
Y
Y
Y
Y
Y
Y
TC1
Y
Y
Y
Y
Y
Y
Y
Y
TC2
Y
Y
Y
Y
Y
Y
Y
Y
TC3
Y
Y
Y
Y
Y
N
N
N
Megamodule
N
Y
Y
N
N
Y
Y
N
HPI
Y
Y
Y
N
N
Y
Y
Y
PCI
Y
Y
Y
N
N
Y
Y
Y
VLYNQ
Y
Y
Y
N
N
Y
Y
Y
Ethernet Subsystem
Y
Y
Y
N
N
N
N
N
4.3
Configuration Switch Fabric
Figure 4-2 shows the connection between the C64x+ megamodule and the configuration SCR, which is
mainly used by the C64x+ Megamodule to access peripheral registers. The data SCR also has a
connection to the configuration SCR that allows masters to access most peripheral registers. The only
registers not accessible by the data SCR through the configuration SCR are the device configuration
registers and the PLL1 and PLL2 controller registers; these can be accessed only by the C64x+
Megamodule. The configuration SCR uses 32-bit configuration buses running at SYSCLK1 frequency.
SYSCLK1 is supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency
divided by 3.
52
System Interconnect
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32-bit
TXBCLK
32-bit
SYSCLK1
Config SCR
M
Bridge
S
Ethernet
SubSystem
S
Video Port 0
S
Video Port 1
S
Video Port 2
S
Video Port 3
S
Video Port 4
S
UART
S
I2C
S
Timer 0
S
Timer 1
S
Timer 2
S
Timer 3
S
PSC
S
PLL Controllers
S
PCI
S
McASP
S
SPI
S
VIC
S
GPIO
S
VICP CFG
S
HPI
32-bit
SYSCLK1
32-bit
SYSCLK1
M
32-bit
SYSCLK1
32-bit
SYSCLK1
Bridge
32-bit
SYSCLK1
128-bit
SYSCLK1
32-bit
SYSCLK1
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
Megamodule
32-bit SYSCLK1
M
S
32-bit
SYSCLK3
Data SCR
32-bit SYSCLK1
M
32-bit
SYSCLK3
VICP
M
Bridge
32-bit
SYSCLK1
32-bit
SYSCLK3
32-bit
SYSCLK3
S
M
Bridge
32-bit
SYSCLK3
S
32-bit
SYSCLK3
32-bit
SYSCLK1
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK3
32-bit
SYSCLK1
32-bit
SYSCLK1
32-bit
SYSCLK1
S
EDMA3 CC
S
EDMA3 TC0
S
EDMA3 TC1
S
EDMA3 TC2
32-bit
SYSCLK1
M
Bridge
32-bit
SYSCLK1
32-bit
SYSCLK1
32-bit
SYSCLK1
S
EDMA3 TC3
Figure 4-2. Configuration SCR
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5 Device Operating Conditions
5.1
Absolute Maximum Ratings
Over Operating Temperature Range (Unless Otherwise Noted) (1)
Supply voltage ranges:
Core (CVDD, CVDDESS, CVDD1, AVDDA,
DVDDD, AVDDT) (2)
1.20-V operation
I/O, 3.3V (DVDD33) (2)
-0.5 V to 4.2 V
I/O, 1.8V (DVDD18, AVDLL1, AVDLL2, AVDDR) (2)
Input voltage ranges:
Output voltage ranges:
Operating case temperature, Tcase
Storage temperature range, Tstg
(1)
(2)
54
-0.5 V to 1.5 V
-0.5 to 2.5 V
VI I/O, 3.3-V pins
-0.5 V to 4.2 V
VI I/O, 1.8 V
-0.5 V to 2.5 V
VO I/O, 3.3-V pins
-0.5 V to 4.2 V
VO I/O, 1.8 V
-0.5 V to 2.5 V
Commercial
0°C to 90°C
Extended
-40°C to 105°C
Industrial
-40°C to 90°C
(default)
-65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
Device Operating Conditions
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5.2
Recommended Operating Conditions
MIN
NOM
MAX
UNIT
1.14
1.2
1.26
V
3.14
3.3
3.46
V
1.71
1.8
1.89
V
(1)
CVDD
Supply voltage, Core
CVDDESS
Supply voltage, Ethernet Subsystem Core
(1)
CVDD1
Supply voltage, DDR Core
AVDDA
Supply voltage, SerDes Analog
(1)
(-720, -800, -900,
-1100 devices)
(1)
(1)
DVDDD
Supply voltage, SerDes Digital
AVDDT
Supply voltage, SerDes Analog
DVDD33
Supply voltage, I/O, 3.3 V
DVDD18
Supply voltage, DDR I/O, 1.8 V
AVDLL1
Supply voltage, I/O, 1.8 V
AVDLL2
Supply voltage, I/O, 1.8 V
AVDDR
Supply voltage, 1.8-V SerDes Analog Supply (Regulator)
VSS
Supply ground (VSS)
DDR_VREF
DDR2 reference voltage (2)
(1)
0
0
0
V
0.49DVDD18
0.5DVDD18
0.51DVDD18
V
High-level input voltage, 3.3 V (except PCI-capable and I2C pins)
VIH
2
0.7DVDD33
PCI-capable pins
0.5DVDD33
DVDD33 + 0.5
V
DDR_VREF +
0.125
DVDD18 + 0.3
V
0.8
V
0
0.3DVDD33
V
PCI-capable pins
-0.5
0.3DVDD33
V
DDR2 memory controller pins (DC)
-0.3
DDR_VREF - 0.125
V
0
90
Extended (4)
-40
105
Industrial
-40
90
(-1100 devices) (3)
33.3
1100
MHz
(-900 devices)
33.3
900
MHz
(-720 devices)
33.3
720
MHz
(-800 devices)
33.3
800
MHz
DDR2 memory controller pins (DC)
Low-level input voltage, 3.3 V(except PCI-capable and I2C pins)
Low-level input voltage, I2C
VIL
Commercial
Tcase
Operating case temperature
FSYSCLK1
(1)
(2)
(3)
(4)
V
High-level input voltage, I2C
DSP Operating Frequency (SYSCLK1)
(3)
V
Future variants of TI SOC devices may operate at voltages ranging from 0.9 V to 1.4 V to provide a range of system power/performance
options. TI highly recommends that users design-in a supply that can handle multiple voltages within this range (i.e., 1.0 V, 1.05 V,
1.1 V, 1.14 V, 1.2, 1.26 V with ± 3% tolerances) by implementing simple board changes such as reference resistor values or input pin
configuration modifications. Not incorporating a flexible supply may limit the system ability to easily adapt to future versions of TI SOC
devices.
DDR_VREF is expected to equal 0.5DVDDR2 of the transmitting device and to track variations in the DVDD18.
To avoid significant device degradation for 1.1GHz devices, the device power-on hours (POH) must be limited to less than 87.6K.
To avoid significant device degradation for extended temperature devices (- 40°C ≤ Tcase ≤ 105°C), the device power-on hours (POH)
must be limited to less than 50K.
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5.3
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Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted)
PARAMETER
VOH High-level
output voltage
TEST CONDITIONS
(1)
MIN
3.3-V pins (except PCI-capable
and I2C pins)
DVDD33 = MIN, IOH = MAX
0.8DVDD33
PCI-capable pins(2)
DVDD33 = 3.3V, IOH = -0.5 mA
0.9DVDD33
DDR2 memory controller pins
VOL Low-level
output voltage
TYP
DVDD33 = MIN, IOL = MAX
PCI-capable pins(2)
DVDD33 = 3.3V, IOL = 1.5 mA
I2C pins
Pulled up to 3.3 V, 3 mA sink current
V
0.22DVDD33
0.1DVDD33
0.4
DDR2 memory controller pins
VI = VSS to DVDD33 without internal pullup oe
pulldown resistor
II Input current [dc]
-1
VI = VSS to DVDD33 with internal pullup resistor
(2)
VI = VSS to DVDD33 with opposing internal
pulldown resistor (2)
Input current [dc] (I2C)
0.1DVDD33 ≤ VI ≤ 0.9DVDD33
PCI-capable pins(4)
IOH High-level
output current [dc]
1
μA
400
μA
-400
-100
-50
μA
-10
10
μA
-600
600
μA
-8
mA
All peripherals other than DDR2
and PCI
-4
mA
-0.5
mA
All peripherals other than
DDR2 , PCI and I2C
8
mA
I2C pins
3
mA
DDR2 memory controller pins
4
mA
1.5
mA
20
μA
PCI-capable pins(2)
IOZ I/O Off-state
3.3-V pins
output current [DC]
IDDD
V
100
PCI-capable pins(2)
ICDD
0.4
50
DDR2 memory controller pins
IOL Low-level
output current [dc]
UNIT
1.4
3.3-V pins (except PCI-capable
and I2C pins)
3.3-V pins (except PCI-capable
and I2C pins)
MAX
Core (CVDD, VDDA_1P1V) supply
current (3)
-20
CVDD = 1.2-V, DSP clock = 720 MHz
2497
mA
CVDD = 1.2-V, DSP clock = 800 MHz
2605
mA
CVDD = 1.2-V, DSP clock = 900 MHz
2741
mA
CVDD = 1.2-V, DSP clock = 1100 MHz
3013
mA
3.3-V I/O (DVDD33) supply
current (3)
DVDD = 3.3-V, DSP clock = 720 MHz, 800 MHz,
900 MHz, 1100 MHz
227
mA
1.8-V I/O (DVDDR2,
DDR_VDDDLL, PLLVPRW18,
VDDA_1P8V, MXVDD) supply
current (3)
DVDD = 1.8-V, DSP clock = 720 MHz, 800 MHz,
900 MHz, 1100 MHz
311
mA
CI
Input capacitance
10
pF
Co
Output capacitance
10
pF
(1)
(2)
(3)
56
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
Assumes the following conditions: 50% DSP CPU utilization; (peripheral configurations, other housekeeping activities) DDR2 at 50%
utilization (266 MHz ), 50% writes, 32 bits, 100% bit switching, 110-MHz Video Ports at 100% utilization, MCASP operating at 25 MHz
with 100% utilization with 10 serializers, Timer0,1 at 100% utilization, VICP with 100% utilization, PCI operating at 66 MHz with 50%
writes at room temp (25°C) using ZUT package. (as in the power appnote) for the three items.
Device Operating Conditions
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6 Peripheral Information and Electrical Specifications
6.1
Parameter Information
Tester Pin Electronics
42 Ω
3.5 nH
Transmission Line
Z0 = 50 Ω
(see Note)
4.0 pF
1.85 pF
Data Sheet Timing Reference Point
Output
Under
Test
Device Pin
(see Note)
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must
be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission
line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 6-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of ac timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1.1
3.3-V Signal Transition Levels
All input and output timing parameters are referenced to Vref for both 0 and 1 logic levels. For 3.3-V I/O,
Vref = 1.5 V. For 1.8-V I/O, Vref = 0.9 V.
Vref
Figure 6-2. Input and Output Voltage Reference Levels for ac Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOLMAX and VOH MIN for output clocks.
Vref = VIH MIN (or V OH MIN)
Vref = VIL MAX (or V OL MAX)
Figure 6-3. Rise and Fall Transition Time Voltage Reference Levels
6.1.2
3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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6.1.3
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Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data manual do not include delays caused by board routings.
As a good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis Application Report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate for any timing differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input
setup time margin, but also tends to improve the input hold time margins (see Table 6-1 and Figure 6-4).
Figure 6-4 represents a general transfer between the DSP and an external device. The figure also
represents board route delays and how they are perceived by the DSP and the external device.
Table 6-1. Board-Level Timing Example
(see Figure 6-4)
NO.
DESCRIPTION
1
Clock route delay
2
Minimum DSP hold time
3
Minimum DSP setup time
4
External device hold time requirement
5
External device setup time requirement
6
Control signal route delay
7
External device hold time
8
External device access time
9
DSP hold time requirement
10
DSP setup time requirement
11
Data route delay
(Output from DSP)
1
(Input to External Device)
2
(A)
Control Signals
(Output from DSP)
3
4
5
Control Signals
(Input to External Device)
6
7
(B)
8
Data Signals
(Output from External Device)
10
(B)
Data Signals
(Input to DSP)
A.
B.
9
11
Control signals include data for writes.
Data signals are generated during reads from an external device.
Figure 6-4. Board-Level Input/Output Timings
58
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6.2
Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
6.3
Power Supplies
For more information regarding TI's power management products and suggested devices to power TI
DSPs, visit www.ti.com/dsppower.
6.3.1
Power-Supply Sequencing
The device includes 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA, DVDDD, AVDDT), and two I/O
supplies—3.3-V (DVDD33) and 1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR). To ensure proper device operation,
a specific power-up sequence must be followed. Some TI power-supply devices include features that
facilitate power sequencing — for example, Auto-Track and Slow-Start/Enable features. For more
information on TI power supplies and their features, visit www.ti.com/dsppower.
Following is a summary of the power sequencing requirements:
• The power ramp order must be 3.3-V (DVDD33) before 1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR), and
1.8-V (DVDD18, AVDLL1, AVDLL2, AVDDR) before 1.2-V core supply (CVDD, CVDDESS, CVDD1, AVDDA,
DVDDD, AVDDT) —meaning during power up, the voltage at the 1.8-V rail should never exceed the
voltage at the 3.3-V rail. Similarly, the voltage at the 1.2-V rail should never exceed the voltage at the
DVDDR2 rail.
• From the time that power ramp begins, all power supplies (3.3 V, 1.8 V, 1.2 V) must be stable within
200 ms. The term "stable" means reaching the recommended operating condition (see Section 5.2).
6.3.2
Power-Supply Design Considerations
Core and I/O supply voltage regulators should be located close to the DSP to minimize inductance and
resistance in the power delivery path. Additionally, when designing for high-performance applications
utilizing the device, the PC board should include separate power planes for core, I/O, and ground; all
bypassed with high-quality low-ESL/ESR capacitors.
6.3.3
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a
yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling
capacitors; therefore physically smaller capacitors should be used while maintaining the largest available
capacitance value. Larger caps for each supply can be placed further away for bulk decoupling. Large
bulk caps (on the order of 100 μF) should be furthest away, but still as close as possible. Large caps for
each supply should be placed outside of the BGA footprint.
6.3.4
Power and Sleep Controller (PSC)
The power and sleep controller (PSC) controls power by turning off unused power domains or by gating
off clocks to individual peripherals/modules. The device uses the clock-gating feature of the PSC only for
power savings. The PSC consists of a global PSC (GPSC) and a set of local PSCs (LPSCs).
The GPSC contains memory mapped registers, PSC interrupt control, and a state machine for each
peripheral/module. An LPSC is associated with each peripheral/module and provides clock and reset
control. The LPSCs are shown in Table 6-2. The PSC register memory map is given in Table 6-3. For
more details on the PSC, see the TMS320DM647/TMS320DM648 DSP Subsystem Reference Guide
(literature number SPRUEU6).
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Table 6-2. LPSC Assignments
LPSC NUMBER
PERIPHERAL/ MODULE
0
EDMA3CC
1
Reserved
2
Reserved
3
Reserved
4
Reserved
5
Reserved
6
Reserved
7
DDR2 Memory Controller
8
UHPI
9
VLYNQ
10
GPIO
11
TIMER0
12
TIMER1
13
Reserved
14
Reserved
15
Reserved
16
Reserved
17
SPI
18
I2C
19
PCI
20
VP0
21
VP1
22
VP2
23
VP3
24
VP4
25
EMIFA
26
TIMER2
27
TIMER3
28
VIC
29
McASP
30
UART
31
VICP
32
Reserved
33
C64x+ CPU
34
Ethernet Subsystem
Table 6-3. PSC Register Memory Map
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x0204 6000
PID
Peripheral Revision and Class Information Register
0x0204 6004- 0x0204 600F
–
Reserved
0x0204 6010
–
Reserved
0x0204 6014
Reserved
0x0204 6018
INTEVAL
Interrupt Evaluation Register
0x0204 601C- 0x0204 603F
–
Reserved
0x0204 6040
–
Reserved
0x0204 6044
MERRPR1
Module Error Pending 1 (mod 32- 63) Register
0x0204 6048- 0x0204 604F
–
Reserved
60
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Table 6-3. PSC Register Memory Map (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x0204 6050
–
Reserved
0x0204 6054
MERRCR1
Module Error Clear 1 (mod 32 - 63) Register
0x0204 6058- 0x0204 605F
–
Reserved
0x0204 6060
–
Reserved
0x0204 6064- 0x0204 6067
–
Reserved
0x0204 6068
–
Reserved
0x0204 606C- 0x0204 611F
–
Reserved
0x0204 6120
PTCMD
Power Domain Transition Command Register
0x0204 6124- 0x0204 6127
–
Reserved
0x0204 6128
PTSTAT
Power Domain Transition Status Register
0x0204 612C- 0x0204 61FF
–
Reserved
0x0204 6200
PDSTAT0
Power Domain Status 0 Register (Always On)
0x0204 6204- 0x0204 62FF
–
Reserved
0x0204 6300
PDCTL0
Power Domain Control 0 Register (Always On)
0x0204 6304- 0x1C4 150F
–
Reserved
0x0204 6510
–
Reserved
0x0204 6514
–
Reserved
0x0204 6518- 0x0204 65FF
–
Reserved
0x0204 6600- 0x0204 67FF
–
Reserved
0x0204 6800
MDSTAT0
Module Status 0 Register (EDMACC)
0x0204 6804
–
Reserved
0x0204 6808
–
Reserved
0x0204 680C
–
Reserved
0x0204 6810
–
Reserved
0x0204 6814
–
Reserved
0x0204 6818
–
Reserved
0x0204 681C
MDSTAT7
Module Status 7 Register (DDR2)
0x0204 6820
MDSTAT8
Module Status 8 Register (HPI)
0x0204 6824
MDSTAT9
Module Status 9 Register (VLYNQ)
0x0204 6828
MDSTAT10
Module Status 10 Register (GPIO)
0x0204 682C
MDSTAT11
Module Status 11 Register (TIMER 0)
0x0204 6830
MDSTAT12
Module Status 12 Register (TIMER 1)
0x0204 6834
–
Reserved
0x0204 6838
–
Reserved
0x0204 683C
–
Reserved
0x0204 6840
–
Reserved
0x0204 6844
MDSTAT17
Module Status 17 Register (SPI)
0x0204 6848
MDSTAT18
Module Status 18 Register (I2C)
0x0204 684C
MDSTAT19
Module Status 19 Register (PCI)
0x0204 6850
MDSTAT20
Module Status 20 Register (Video Port 0)
0x0204 6854
MDSTAT21
Module Status 21 Register (Video Port 1)
0x0204 6858
MDSTAT22
Module Status 22 Register (Video Port 2)
0x0204 685C
MDSTAT23
Module Status 23 Register (Video Port 3)
0x0204 6860
MDSTAT24
Module Status 24 Register (Video Port 4)
0x0204 6864
MDSTAT25
Module Status 25 Register (EMIFA)
0x0204 6868
MDSTAT26
Module Status 26 Register (TIMER 2)
0x0204 686C
MDSTAT27
Module Status 27 Register (TIMER 3)
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Table 6-3. PSC Register Memory Map (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x0204 6870
MDSTAT28
Module Status 28 Register (VIC)
0x0204 6874
MDSTAT29
Module Status 29 Register (McASP)
0x0204 6878
MDSTAT30
Module Status 30 Register (UART)
0x0204 687C
MDSTAT31
Module Status 31 Register (VICP)
0x0204 6880
–
Reserved
0x0204 6884
MDSTAT33
Module Status 33 Register (C64x+ CPU)
0x0204 6888
MDSTAT34
Module Status 34 Register (Ethernet Subsystem)
0x0204 688C-0x0204 69FF
–
Reserved
0x0204 6A00
MDCTL0
Module Control 0 Register (EDMACC)
0x0204 6A04
–
Reserved
0x0204 6A08
–
Reserved
0x0204 6A0C
–
Reserved
0x0204 6A10
–
Reserved
0x0204 6A14
–
Reserved
0x0204 6A18
–
Reserved
0x0204 6A1C
MDCTL7
Module Control 7 Register (DDR2)
0x0204 6A20
MDCTL8
Module Control 8 Register (HPI)
0x0204 6A24
MDCTL9
Module Control 9 Register (VLYNQ)
0x0204 6A28
MDCTL10
Module Control 10 Register (GPIO)
0x0204 6A2C
MDCTL11
Module Control 11 Register (TIMER 0)
0x0204 6A30
MDCTL12
Module Control 12 Register (TIMER 1)
0x0204 6A34
–
Reserved
0x0204 6A38
–
Reserved
0x0204 6A3C
–
Reserved
0x0204 6A40
–
Reserved
0x0204 6A44
MDCTL17
Module Control 17 Register (SPI)
0x0204 6A48
MDCTL18
Module Control 18 Register (I2C)
0x0204 6A4C
MDCTL19
Module Control 19 Register (PCI)
0x0204 6A50
MDCTL20
Module Control 20 Register (Video Port 0)
0x0204 6A54
MDCTL21
Module Control 21 Register (Video Port 1)
0x0204 6A58
MDCTL22
Module Control 22 Register (Video Port 2)
0x0204 6A5C
MDCTL23
Module Control 23 Register (Video Port 3)
0x0204 6A60
MDCTL24
Module Control 24 Register (Video Port 4)
0x0204 6A64
MDCTL25
Module Control 25 Register (EMIFA)
0x0204 6A68
MDCTL26
Module Control 26 Register (TIMER 2)
0x0204 6A6C
MDCTL27
Module Control 27 Register (TIMER 3)
0x0204 6A70
MDCTL28
Module Control 28 Register (VIC)
0x0204 6A74
MDCTL29
Module Control 29 Register (McASP)
0x0204 6A78
MDCTL30
Module Control 30 Register (UART)
0x0204 6A7C
MDCTL31
Module Control 31 Register (VICP)
0x0204 6A80
–
Reserved
0x0204 6A84
MDCTL33
Module Control 33 Register (C64x+ CPU)
0x0204 6A88
MDCTL34
Module Control 34 Register (Ethernet Subsystem)
0x0204 6A90- 0x0204 6FFF
–
Reserved
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6.3.5
Power and Clock Domains
The device includes two power domains: the System Domain and the Ethernet Subsystem Domain. Both
of these power domains are always on when the chip is on. Both of these domains are powered by the
CVDD pins of the device.
The primary PLL controller generates the input clock to the C64x+ megamodule as well as most of the
system peripherals such as the multichannel audio serial ports (McASPs) and the external memory
interface (EMIFA). The secondary PLL controller generates interface clocks for the DDR2 memory
controller. The Ethernet Subsystem is clocked through the SerDes module, which takes input from
REFCLKP/N. The primary PLL controller (PLL1 controller) uses the device input clock CLKIN1 and the
secondary PLL controller (PLL2 controller) uses the device input clock CLKIN2.
Table 6-4 provides a listing of the clock domains.
Table 6-4. Power and Clock Domains
POWER DOMAIN
CLOCK DOMAIN
PERIPHERAL/MODULE/USAGE
System Domain
CLKDIV1
C64x+ CPU
System Domain
CLKDIV3
EDMA/SCR
System Domain
CLKDIV3
DDR Subsystem
System Domain
CLKDIV3
Video Port 0
System Domain
CLKDIV3
Video Port 1
System Domain
CLKDIV3
Video Port 2
System Domain
CLKDIV3
Video Port 3
System Domain
CLKDIV3
Video Port 4
System Domain
CLKDIV3
EMIFA
System Domain
CLKDIV6
HPI
System Domain
CLKDIV6
PCI
System Domain
CLKDIV6
VLYNQ
System Domain
CLKDIV6
UART
System Domain
CLKDIV6
I2C
System Domain
CLKDIV6
TIMER 0
System Domain
CLKDIV6
TIMER 1
System Domain
CLKDIV6
TIMER 2
System Domain
CLKDIV6
TIMER 3
System Domain
CLKDIV6
SPI
System Domain
CLKDIV6
McASP
System Domain
CLKDIV6
VIC
System Domain
CLKDIV6
GPIO
System Domain
CLKDIV6
PLL Controller 1
System Domain
CLKDIV6
PLL Controller 2
System Domain
CLKDIV6
Config SCR
System Domain
CLKDIV4 0
Internal EMIFA Clock
System Domain
CLKDIV4 1
Emulation and Trace
System Domain
CLKDIV4 2
VICP cop_clk/2
System Domain
CLKDIV2
VICP cop_clk
Ethernet Subsystem Domain
SerDes TXBCLK
Ethernet Subsystem
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The device architecture is divided into the power and clock domains shown in Table 6-5, which further
shows the clock domains and their ratios.
Table 6-5. Clock Domain Assignment
SUBSYSTEM
CLOCK DOMAIN
DOMAIN CLOCK SOURCE
DSP Subsystem
CLKDIV1
PLLC1.REFSYSCLK
-
Peripherals (CLKDIV3 Domain)
CLKDIV3
PLLC1.SYSCLK1
1:3
CLKDIV4 1
PLLC1.SYSCLK2
1:4
CLKDIV6
PLLC1.SYSCLK3
1:6
Internal EMIFA Clock
CLKDIV4 0
PLLC1.SYSCLK4
1:4 (1)
VICP cop_clk/2
CLKDIV4 2
PLLC1.SYSCLK5
1:4
CLKDIV2
PLLC1.SYSCLK6
1:2
Emulation/Trace
Peripherals (CLKDIV6 Domain)
VICP cop_clk
(1)
FIXED RATIO vs SYSREFCLK
FREQUENCY
There is a /2 divider in the path of PLLC1.SYSCLK4 so the effective EMIFA clock is PLLC1.SYSCLK4/2. By default the internal EMIFA
Clock is 1:8.
6.3.6
Preserving Boundary-Scan Functionality on DDR2 Memory Pins
Similarly, when the DDR2 Memory Controller is not used, the DDR_VREF, RSV19, and RSV20 pins can
be connected directly to ground (VSS) to save power. However, this will prevent boundary-scan from
functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2
Memory Controller pins, DDR_VREF, RSV19, and RSV20 should be connected as follows:
• DDR_VREF - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from
the DVDD18 supply using two 1-kΩ resistors to form a resistor divider circuit.
• RSV19 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ω resistor
• RSV20 - connect this pin to ground (VSS) via a 200-Ω resistor.
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6.4
PLL1 Controller
The primary PLL controller generates the input clock to the C64x+ megamodule (including the CPU) as
well as most of the system peripherals such as the multichannel audio serial ports (McASPs) and the
external memory interface (EMIFA). Figure 6-5 shows a functional block diagram of the PLL Input Clock.
+1.8 V
PLLV1
C1
C2
EMI Filter
560 pF 0.1 mF
PLLREF
PLL1 Controller
PLL1
PLLM
x1,
x16 to x32
/1, /2, /3
PLLEN (PLLCTL.[0])
PLLOUT
DIVIDER PREDIV
CLKIN1
SYSREFCLK
(C64x+ MegaModule)
DIVIDER D1
1
ENA
0
PREDEN (PREDIV.[15])
SYSCLK1
/3
DIVIDER D2
D2EN (PLLDIV2.[15])
/1, /2,
..., /8
ENA
SYSCLK2
(Emulation and Trace)
DIVIDER D3
/6
SYSCLK3
DIVIDER D4
/4 ... /8
D4EN (PLLDIV4.[15])
SYSCLK4
ENA
/2
(Internal
EMIF Clock
Input)
DIVIDER D5
/4
SYSCLK5
VICP cop_clk/2
DIVIDER D6
/2
SYSCLK6
VICP cop_clk
AECLKIN (External EMIF Clock Input)
VCLK
/1, /2,
..., /8
0 1
CLKDIV
(CTRL.[18:16])
CLKDIR
(CTRL.[15])
0 1
AECLKINSEL
(AEA[17] pin)
EMIFA
VLYNQ
(EMIF Input Clock)
AECLKOUT
SYSCLK5
Figure 6-5. PLL Input Clock
As shown in Figure 6-5, the PLL1 controller features a software-programmable PLL multiplier controller
(PLLM) and seven dividers (PREDIV, D1, D2, D3, D4, D5). The PLL1 controller uses the device input
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clock CLKIN1 to generate a system reference clock (SYSREFCLK) and system clocks (SYSCLK1,
SYSCLK2, SYSCLK3, SYSCLK4, SYSCLK5). PLL1 power is supplied externally via the PLL1
power-supply pin (PLLV1). An external EMI filter circuit must be added to PLLV1. The 1.8-V supply of the
EMI filter must be from the same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI
requires EMI filter manufacturer Murata, part number NFM18CC222R1C3.
All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the C64x+ DSP
device as possible. For the best performance, TI recommends that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C1, C2, and the EMI Filter). The minimum CLKIN1 rise and fall times should also be observed. For the
input clock timing requirements, see Section 6.4.4.
6.4.1
PLL1 Controller Device-Specific Information
As shown in Figure 6-5, the PLL1 controller generates several internal clocks including the system
reference clock (SYSREFCLK), and the system clocks (SYSCLK1/2/3/4/5/6). The high-frequency clock
signal SYSREFCLK is directly used to clock the C64x+ megamodule (including the CPU) and also serves
as a reference clock for the rest of the DSP system. Dividers D1, D2, D3, D4, D5, and D6 divide the
high-frequency clock SYSREFCLK to generate SYSCLK1, SYSCLK2, SYSCLK3, SYSCLK4, SYSCLK5,
and SYSCLK6, respectively.
The system clocks are used to clock different portions of the DSP as follows:
• SYSCLK1 is used for the following modules: 3PDMA, the SCR and the bridges, DDR Subsystem
internal logic, Video Port 0, Video Port 1, Video Port 2, Video Port 3, Video Port 4, EMIFA internal
logic.
• SYSCLK2 is used for Emulation and Trace
• SYSCLK3 is used for most of the peripherals. These modules are clocked from SYSCLK3: HPI, PCI,
VLYNQ, UART, I2C, TIMER 0, TIMER 1, TIMER 2, TIMER 3, SPI, McASP, VIC, GPIO, PLL Controller
1, PLL Controller 2, Config SCR
• SYSCLK4 is used as the EMIFA AECLKOUT
• SYSCLK5 is used as the VICP internal clock
• SYSCLK6 is used as the VICP internal clock
The PLL multiplier controller (PLLM) must be programmed after reset. There is no hardware CLKMODE
selection on the device. Since the divider ratio bits for dividers D1, D3, D5, and D6 are fixed, the
frequency of SYSCLK1, SYCLK3, SYSCLK5, and SYSCLK6 is tied to the frequency of SYSREFCLK.
However, the frequency of SYSCLK2 and SYSCLK4 depends on the configuration of dividers D2 and D4.
For example, with PLLM in the PLL1 multiply control register set to 10011b (x20 mode) and a 35-MHz
CLKIN1 input, the PLL output PLLOUT is set to 700 MHz and SYSCLK1 and SYSCLK3 run at 233 MHz
and 117 MHz, respectively. Divider D4 can be programmed through the PLLDIV4 register to divide
SYSREFCLK by 8 (2 * (PLLDIV4.RATIO+1)) such that SYSCLK4 runs at 87.5 MHz.
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, and SYSCLK4.
The PLL1 Controller must not be configured to exceed any of these constraints (certain combinations of
external clock input, internal dividers, and PLL multiply ratios might not be supported). For the PLL clocks
input and output frequency ranges, see Table 6-6.
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Table 6-6. PLL1 Clock Frequency Ranges
CLOCK SIGNAL
MIN
MAX
UNIT
CLKIN1
25
66.6
MHz
PLLREF (PLLEN = 1) (1)
25
66.6
MHz
400
720 (-720 devices)
PLLOUT
(1)
400
SYSCLK4
(1)
(2)
(3)
(4)
800 (-800 devices)
400
900 (-900 devices)
400
1100 (-1100 devices)
1/16P
(3)
MHz
(2)
PLLOUT/ (2*(PLLDIV4.RATIO+1))
MHz
MHz
MHz
(4)
MHz
Only applies when the PLL1 Controller is set to PLL mode (PLLEN = 1 in the PLLCTL register). Based on CLKIN1 and PLLOUT, PLL1
multiplier factor ranges from x16 to x32.
Only for Extended Temperature Range device (-800 MHz)
P = 1/CPU clock frequency in ns
PLLDIV4.RATIO =3
6.4.2
PLL1 Controller Operating Modes
The PLL1 controller has two modes of operation: bypass mode and PLL mode. The mode of operation is
determined by the PLLEN bit of the PLL control register (PLLCTL). In PLL mode, SYSREFCLK is
generated from the device input clock CLKIN1 using the divider PREDIV and the PLL multiplier PLLM. In
bypass mode, CLKIN1 is fed directly to SYSREFCLK.
All hosts (i.e., HPI) must hold off accesses to the DSP while the frequency of its internal clocks is
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration
has completed.
6.4.3
PLL1 Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to
become stable after device power-up. The PLL should not be operated until this stabilization time has
finished.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1) for the
PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the PLL1 reset time
value, see Table 6-7.
Table 6-7. PLL1 Stabilization, Lock, and Reset Times
MIN
PLL stabilization time
TYP
128 × C
PLL reset time
UNIT
μs
2000 × C (1)
PLL lock time
(1)
MAX
150
(1)
μs
μs
C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
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PLL1 Controller Input and Output Clock Electrical Data/Timing
Table 6-8. Timing Requirements for CLKIN1 (1) (2) (see Figure 6-6)
720, 800, 900, 1100
PLL MODES (3)
NO.
(1)
(2)
(3)
UNIT
MIN
MAX
15
40
1
tc(CLKIN1)
Cycle time, CLKIN1
ns
2
tw(CLKIN1H)
Pulse duration, CLKIN1 high
0.4C
3
tw(CLKIN1L)
Pulse duration, CLKIN1 low
0.4C
4
tt(CLKIN1)
Transition time, CLKIN1
1.2
ns
5
tJ(CLKIN1)
Period jitter, (peak-to-peak), CLKIN1
100
ps
ns
ns
The reference points for the rise and fall transitions are measured at 3.3-V VIL MAX and VIH MIN.
C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
The PLL1 multiplier factors (x1 [BYPASS], x16 to x32) further limit the MIN and MAX values for tc(CLKIN1). See Section 6.3.5 for
supported PLL1 multiplier factors.
1
5
4
2
CLKIN
3
4
Figure 6-6. CLKIN1 Timing
6.4.5
PLL1 Controller Register Description(s)
A summary of the PLL1 controller registers is shown in Table 6-9.
Table 6-9. PLL1 and Reset Controller Registers Memory Map
HEX ADDRESS RANGE
68
REGISTER NAME
DESCRIPTION
0x020E 0000
PID
0x020E 00E4
RSTYPE
Peripheral Identification and Revision Information Register
Reset Type Register
0x020E 0100
PLLCTL
PLL Controller 1 Operations Control Register
0x020E 0110
PLLM
0x020E 0114
PREDIV
PLL Controller 1 Multiplier Control Register
PLL Pre-Divider Control Register
0x020E 011C
PLLDIV2
PLL Controller 1 Control-Divider 2 Register (SYSCLK2)
0x020E 0138
PLLCMD
PLL Controller 1 Command Register
0x020E 013C
PLLSTAT
PLL Controller 1 Status Register (Shows PLLC1 Status)
0x020E 0140
ALNCTL
PLL Controller Clock Align Control Register
0x020E 0144
DCHANGE
0x020E 0150
SYSTAT
PLL Controller 1 System Clock Status 1 Register (Indicates SYSCLK on/off
Status)
0x020E 0160
PLLDIV4
PLL Controller 1 Control-Divider 4 Register (SYSCLK4)
PLLDIV Ratio Change Status Register
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6.5
PLL2 Controller
The secondary PLL controller generates interface clocks for the DDR2 memory controller.
As shown in Figure 6-7, the PLL2 controller features a PLL multiplier controller. The PLL multiplier is fixed
to a x20 multiplier rate. PLL2 power is supplied externally via the PLL2 power supply (PLLV2). An external
PLL filter circuit must be added to PLLV2 as shown in Figure 6-7. The 1.8-V supply for the EMI filter must
be from the same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter
manufacturer Murata, part number NFM18CC222R1C3.
+1.8 V
PLLV2
EMI Filter
C161
C162
560 pF
0.1 mF
SYSCLK1 (From PLL Controller 1)
CLKIN2
PLLREF
PLL2
PLLOUT
DDR2 Memory Controller
PLLM
x20
Figure 6-7. PLL Controller
All PLL external components (C161, C162, and the EMI Filter) should be placed as close to the C64x+
DSP device as possible. For the best performance, TI requires that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C161, C162, and the EMI Filter). The minimum CLKIN2 rise and fall times should also be observed. For
the input clock timing requirements, see Section 6.5.3, PLL2 Controller Input Clock Electrical Data/Timing.
6.5.1
PLL2 Controller Device-Specific Information
As shown in Figure 6-7, the output of PLL2, PLLOUT, is directly fed to the DDR2 memory controller. This
clock is used by the DDR2 memory controller to generate DDR2CLKOUT and DDR2CLKOUTz. Note that,
internally, the data bus interface of the DDR2 memory controller is clocked by SYSCLK1 of the PLL1
controller.
Note that there is a minimum and maximum operating frequency for PLLREF and PLLOUT. The clock
generator must not be configured to exceed any of these constraints. For the PLL clocks input and output
frequency ranges, see Table 6-10.
Table 6-10. PLL2 Clock Frequency Ranges
(1)
CLOCK SIGNAL
REQUIRED FREQUENCY
UNIT
PLLREF (CLKIN2 )
20 - 26.6
MHz
PLLOUT (DDR2 clock)
400 - 533 (1)
MHz
This clock is the 2x of the DDR clock. The DDR PHY divides the clock down /2.
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PLL2 Controller Operating Modes
Unlike the PLL1 controller that can operate in bypass and a PLL mode, the PLL2 controller only operates
in PLL mode. PLL2 is unlocked only during the power-up sequence (see Section 6.7) and is locked by the
time the RESETSTAT pin goes high. It does not lose lock during any of the other resets.
6.5.3
PLL2 Controller Input Clock Electrical Data/Timing
Table 6-11. Timing Requirements for CLKIN2 (1)
(2)
(see Figure 6-8)
720, 800, 900, 1100
NO.
(1)
(2)
PLL MODE x20
UNIT
MIN
MAX
50
1
tc(CLKIN2)
Cycle time, CLKIN2
37.5
2
tw(CLKIN2H)
Pulse duration, CLKIN2 high
0.4C
ns
ns
3
tw(CLKIN2L)
Pulse duration, CLKIN2 low
0.4C
ns
4
tt(CLKIN2)
Transition time, CLKIN2
1.2
ns
5
tJ(CLKIN2)
Period jitter, (peak-to-peak) CLKIN2
100
ps
The reference points for the rise and fall transitions are measured at 3.3-V VIL MAX and VIH MIN.
C = CLKIN2 cycle time in ns. For example, when CLKIN2 frequency is 25 MHz, use C = 40 ns.
1
5
4
2
CLKIN
3
4
Figure 6-8. CLKIN2 Timing
6.5.4
PLL2 Controller Register Description(s)
A summary of the PLL2 controller registers is shown in Table 6-12.
Table 6-12. PLL2 and Reset Controller Registers Memory Map
70
HEX ADDRESS RANGE
REGISTER NAME
0x0212 0000
PID
0x0212 0100
PLLCTL
0x0212 0110
PLLM
DESCRIPTION
Peripheral Identification and Revision Information Register
PLL Controller 2 Operations Control Register
PLL Controller 2 Multiplier Control Register
0x0212 0138
PLLCMD
PLL Controller 2 Command Register
0x0212 013C
PLLSTAT
PLL Controller 2 Status Register (Shows PLLC1 Status)
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6.6
Enhanced Direct Memory Access (EDMA3) Controller
The EDMA controller handles all data transfers between memories and the device slave peripherals on
the device. These data transfers include cache servicing, non-cacheable memory accesses,
user-programmed data transfers, and host accesses. These are summarized as follows:
• Transfer to/from on-chip memories
– DSP L1D memory
– DSP L2 memory
• Transfer to/from external storage
– DDR2 SDRAM
– Synchronous/Asynchronous EMIF (EMIFA)
• Transfer to/from peripherals/hosts
– VLYNQ
– HPI
– McASP
– UART
– Video Port 0/1/2/3/4
– Timer 0/1/2/3
– SPI
– I2C
6.6.1
EDMA3 Channel Synchronization Events
The EDMA supports up to 64 EDMA channels that service peripheral devices and external memory.
Table 6-13 lists the source of EDMA synchronization events associated with each of the programmable
EDMA channels. The association of an event to a channel is fixed; each of the EDMA channels has one
specific event associated with it. These specific events are captured in the EDMA event registers (ER,
ERH) even if the events are disabled by the EDMA event enable registers (EER, EERH). For more
detailed information on the EDMA module and how EDMA events are enabled, captured, processed,
linked, chained, and cleared, etc., see the TMS320DM647/DM648 DSP Enhanced DMA (EDMA)
Controller User's Guide (literature number SPRUEL2).
Table 6-13. EDMA Channel Synchronization Events
TPCC
DEFAULT BINARY
CHANNEL EVENT#
DEFAULT EVENT
TPCC
DEFAULT BINARY
CHANNEL EVENT #
DEFAULT EVENT
0
0
000 0000
HPI/PCI : DSPINT
32
32
010 0000
VP2EVTYA
1
1
000 0001
TIMER0 : TINT0L
33
33
010 0001
VP2EVTCbA
2
2
000 0010
TIMER0 : TINT0H
34
34
010 0010
VP2EVTCrA
3
3
000 0011
TIMER2 : TINT2L
35
35
010 0011
VP2EVTYB
4
4
000 0100
TIMER2 : TINT2H
36
36
010 0100
VP2EVTCbB
5
5
000 0101
TIMER3 : TINT3L
37
37
010 0101
VP2EVTCrB
6
6
000 0110
TIMER3 : TINT3H
38
38
010 0110
VP3EVTYA
7
7
000 0111
VICP: IMXINT
39
39
010 0111
VP3EVTCbA
8
8
000 1000
VICP: VLCDINT
40
40
010 1000
VP3EVTCrA
9
9
000 1001
VICP: DSQINT
41
41
010 1001
VP3EVTYB
10
10
000 1010
McASP: AXEVTE
42
42
010 1010
VP3EVTCbB
11
11
000 1011
McASP: AXEVTO
43
43
010 1011
VP3EVTCrB
12
12
000 1100
McASP: AXEVT
44
44
010 1100
ICREVT
13
13
000 1101
McASP: AREVTE
45
45
010 1101
ICXEVT
14
14
000 1110
McASP: AREVTO
46
46
010 1110
SPI: SPIXEVT
15
15
000 1111
McASP: AREVT
47
47
010 1111
SPI: SPIREVT
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Table 6-13. EDMA Channel Synchronization Events (continued)
TPCC
DEFAULT BINARY
CHANNEL EVENT#
DEFAULT EVENT
TPCC
DEFAULT BINARY
CHANNEL EVENT #
DEFAULT EVENT
16
16
001 0000
TIMER1 : TINT1L
48
48
011 0000
VP4EVTYA
17
17
001 0001
TIMER1 : TINT1H
49
49
011 0001
VP4EVTCbA
18
18
001 0010
UART: URXEVT
50
50
011 0010
VP4EVTCrA
19
19
001 0011
UART: UTXEVT
51
51
011 0011
VP4EVTYB
20
20
001 0100
VP0EVTYA
52
52
011 0100
VP4EVTCbB
21
21
001 0101
VP0EVTCbA
53
53
011 0101
VP4EVTCrB
22
22
001 0110
VP0EVTCrA
54
54
011 0110
GPIO : GPINT6
23
23
001 0111
VP0EVTYB
55
55
011 0111
GPIO : GPINT7
24
24
001 1000
VP0EVTCbB
56
56
011 1000
GPIO : GPINT8
25
25
001 1001
VP0EVTCrB
57
57
011 1001
GPIO : GPINT9
26
26
001 1010
VP1EVTYA
58
58
011 1010
GPIO : GPINT10
27
27
001 1011
VP1EVTCbA
59
59
011 1011
GPIO : GPINT11
28
28
001 1100
VP1EVTCrA
60
60
011 1100
GPIO : GPINT12
29
29
001 1101
VP1EVTYB
61
61
011 1101
GPIO : GPINT13
30
30
001 1110
VP1EVTCbB
62
62
011 1110
GPIO : GPINT14
31
31
001 1111
VP1EVTCrB
63
63
011 1111
GPIO : GPINT15
6.6.2
EDMA Peripheral Register Description(s)
Table 6-14 lists the EDMA registers, their corresponding acronyms, and device memory locations.
Table 6-14. EDMA Channel Controller Registers
HEX ADDRESS
ACRONYM
0x02A0 0000
PID
0x02A0 0004
CCCFG
0x02A0 0008 - 0x02A0 00FC
72
REGISTER NAME
Peripheral ID Register
EDMA3CC Configuration Register
Reserved
0x02A0 0100
DCHMAP0
DMA Channel 0 Mapping Register
0x02A0 0104
DCHMAP1
DMA Channel 1 Mapping Register
0x02A0 0108
DCHMAP2
DMA Channel 2 Mapping Register
0x02A0 010C
DCHMAP3
DMA Channel 3 Mapping Register
0x02A0 0110
DCHMAP4
DMA Channel 4 Mapping Register
0x02A0 0114
DCHMAP5
DMA Channel 5 Mapping Register
0x02A0 0118
DCHMAP6
DMA Channel 6 Mapping Register
0x02A0 011C
DCHMAP7
DMA Channel 7 Mapping Register
0x02A0 0120
DCHMAP8
DMA Channel 8 Mapping Register
0x02A0 0124
DCHMAP9
DMA Channel 9 Mapping Register
0x02A0 0128
DCHMAP10
DMA Channel 10 Mapping Register
0x02A0 012C
DCHMAP11
DMA Channel 11 Mapping Register
0x02A0 0130
DCHMAP12
DMA Channel 12 Mapping Register
0x02A0 0134
DCHMAP13
DMA Channel 13 Mapping Register
0x02A0 0138
DCHMAP14
DMA Channel 14 Mapping Register
0x02A0 013C
DCHMAP15
DMA Channel 15 Mapping Register
0x02A0 0140
DCHMAP16
DMA Channel 16 Mapping Register
0x02A0 0144
DCHMAP17
DMA Channel 17 Mapping Register
0x02A0 0148
DCHMAP18
DMA Channel 18 Mapping Register
0x02A0 014C
DCHMAP19
DMA Channel 19 Mapping Register
0x02A0 0150
DCHMAP20
DMA Channel 20 Mapping Register
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Table 6-14. EDMA Channel Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x02A0 0154
DCHMAP21
DMA Channel 21 Mapping Register
REGISTER NAME
0x02A0 0158
DCHMAP22
DMA Channel 22 Mapping Register
0x02A0 015C
DCHMAP23
DMA Channel 23 Mapping Register
0x02A0 0160
DCHMAP24
DMA Channel 24 Mapping Register
0x02A0 0164
DCHMAP25
DMA Channel 25 Mapping Register
0x02A0 0168
DCHMAP26
DMA Channel 26 Mapping Register
0x02A0 016C
DCHMAP27
DMA Channel 27 Mapping Register
0x02A0 0170
DCHMAP28
DMA Channel 28 Mapping Register
0x02A0 0174
DCHMAP29
DMA Channel 29 Mapping Register
0x02A0 0178
DCHMAP30
DMA Channel 30 Mapping Register
0x02A0 017C
DCHMAP31
DMA Channel 31 Mapping Register
0x02A0 0180
DCHMAP32
DMA Channel 32 Mapping Register
0x02A0 0184
DCHMAP33
DMA Channel 33 Mapping Register
0x02A0 0188
DCHMAP34
DMA Channel 34 Mapping Register
0x02A0 018C
DCHMAP35
DMA Channel 35 Mapping Register
0x02A0 0190
DCHMAP36
DMA Channel 36 Mapping Register
0x02A0 0194
DCHMAP37
DMA Channel 37 Mapping Register
0x02A0 0198
DCHMAP38
DMA Channel 38 Mapping Register
0x02A0 019C
DCHMAP39
DMA Channel 39 Mapping Register
0x02A0 01A0
DCHMAP40
DMA Channel 40 Mapping Register
0x02A0 01A4
DCHMAP41
DMA Channel 41 Mapping Register
0x02A0 01A8
DCHMAP42
DMA Channel 42 Mapping Register
0x02A0 01AC
DCHMAP43
DMA Channel 43 Mapping Register
0x02A0 01B0
DCHMAP44
DMA Channel 44 Mapping Register
0x02A0 01B4
DCHMAP45
DMA Channel 45 Mapping Register
0x02A0 01B8
DCHMAP46
DMA Channel 46 Mapping Register
0x02A0 01BC
DCHMAP47
DMA Channel 47 Mapping Register
0x02A0 01C0
DCHMAP48
DMA Channel 48 Mapping Register
0x02A0 01C4
DCHMAP49
DMA Channel 49 Mapping Register
0x02A0 01C8
DCHMAP50
DMA Channel 50 Mapping Register
0x02A0 01CC
DCHMAP51
DMA Channel 51 Mapping Register
0x02A0 01D0
DCHMAP52
DMA Channel 52 Mapping Register
0x02A0 01D4
DCHMAP53
DMA Channel 53 Mapping Register
0x02A0 01D8
DCHMAP54
DMA Channel 54 Mapping Register
0x02A0 01DC
DCHMAP55
DMA Channel 55 Mapping Register
0x02A0 01E0
DCHMAP56
DMA Channel 56 Mapping Register
0x02A0 01E4
DCHMAP57
DMA Channel 57 Mapping Register
0x02A0 01E8
DCHMAP58
DMA Channel 58 Mapping Register
0x02A0 01EC
DCHMAP59
DMA Channel 59 Mapping Register
0x02A0 01F0
DCHMAP60
DMA Channel 60 Mapping Register
0x02A0 01F4
DCHMAP61
DMA Channel 61 Mapping Register
0x02A0 01F8
DCHMAP62
DMA Channel 62 Mapping Register
0x02A0 01FC
DCHMAP63
DMA Channel 63 Mapping Register
0x02A0 0200
QCHMAP0
QDMA Channel 0 Mapping to PaRAM Register
0x02A0 0204
QCHMAP1
QDMA Channel 1 Mapping to PaRAM Register
0x02A0 0208
QCHMAP2
QDMA Channel 2 Mapping to PaRAM Register
0x02A0 020C
QCHMAP3
QDMA Channel 3 Mapping to PaRAM Register
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Table 6-14. EDMA Channel Controller Registers (continued)
74
HEX ADDRESS
ACRONYM
REGISTER NAME
0x02A0 0210
QCHMAP4
QDMA Channel 4 Mapping to PaRAM Register
0x02A0 0214
QCHMAP5
QDMA Channel 5 Mapping to PaRAM Register
0x02A0 0218
QCHMAP6
QDMA Channel 6 Mapping to PaRAM Register
0x02A0 021C
QCHMAP7
QDMA Channel 7 Mapping to PaRAM Register
0x02A0 0220 - 0x02A0 021C
-
Reserved
0x02A0 0220 - 0x02A0 023C
-
Reserved
0x02A0 0240
DMAQNUM0
DMA Queue Number Register 0 (Channels 00 to 07)
0x02A0 0244
DMAQNUM1
DMA Queue Number Register 1 (Channels 08 to 15)
0x02A0 0248
DMAQNUM2
DMA Queue Number Register 2 (Channels 16 to 23)
0x02A0 024C
DMAQNUM3
DMA Queue Number Register 3 (Channels 24 to 31)
0x02A0 0250
DMAQNUM4
DMA Queue Number Register 4 (Channels 32 to 39)
0x02A0 0254
DMAQNUM5
DMA Queue Number Register 5 (Channels 40 to 47)
0x02A0 0258
DMAQNUM6
DMA Queue Number Register 6 (Channels 48 to 55)
0x02A0 025C
DMAQNUM7
DMA Queue Number Register 7 (Channels 56 to 63)
CC QDMA Queue Number
0x02A0 0260
QDMAQNUM
0x02A0 0264 - 0x02A0 0280
-
0x02A0 0284
QUEPRI
Reserved
Queue Priority Register
0x02A0 0288 - 0x02A0 02FC
-
0x02A0 0300
EMR
0x02A0 0304
EMRH
Event Missed Register High
0x02A0 0308
EMCR
Event Missed Clear Register
0x02A0 030C
EMCRH
0x02A0 0310
QEMR
0x02A0 0314
QEMCR
QDMA Event Missed Clear Register
EDMA3CC Error Register
0x02A0 0318
CCERR
0x02A0 031C
CCERRCLR
0x02A0 0320
EEVAL
0x02A0 0324 - 0x02A0 033C
-
0x02A0 0340
DRAE0
0x02A0 0344
DRAEH0
0x02A0 0348
DRAE1
0x02A0 034C
DRAEH1
0x02A0 0350
DRAE2
0x02A0 0354
DRAEH2
Reserved
Event Missed Register
Event Missed Clear Register High
QDMA Event Missed Register
EDMA3CC Error Clear Register
Error Evaluate Register
Reserved
DMA Region Access Enable Register for Region 0
DMA Region Access Enable Register High for Region 0
DMA Region Access Enable Register for Region 1
DMA Region Access Enable Register High for Region 1
DMA Region Access Enable Register for Region 2
DMA Region Access Enable Register High for Region 2
0x02A0 0358
DRAE3
0x02A0 035C
DRAEH3
DMA Region Access Enable Register for Region 3
0x02A0 0360
DRAE4
0x02A0 0364
DRAEH4
0x02A0 0368
DRAE5
0x02A0 036C
DRAEH5
0x02A0 0370
DRAE6
0x02A0 0374
DRAEH6
0x02A0 0378
DRAE7
0x02A0 037C
DRAEH7
0x02A0 0380
QRAE0
QDMA Region Access Enable Register for Region 0
0x02A0 0384
QRAE1
QDMA Region Access Enable Register for Region 1
0x02A0 0388
QRAE2
QDMA Region Access Enable Register for Region 2
DMA Region Access Enable Register High for Region 3
DMA Region Access Enable Register for Region 4
DMA Region Access Enable Register High for Region 4
DMA Region Access Enable Register for Region 5
DMA Region Access Enable Register High for Region 5
DMA Region Access Enable Register for Region 6
DMA Region Access Enable Register High for Region 6
DMA Region Access Enable Register for Region 7
DMA Region Access Enable Register High for Region 7
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Table 6-14. EDMA Channel Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x02A0 038C
QRAE3
QDMA Region Access Enable Register for Region 3
REGISTER NAME
0x02A0 0390
QRAE4
QDMA Region Access Enable Register for Region 4
0x02A0 0394
QRAE5
QDMA Region Access Enable Register for Region 5
0x02A0 0398
QRAE6
QDMA Region Access Enable Register for Region 6
0x02A0 039C
QRAE7
QDMA Region Access Enable Register for Region 7
0x02A0 0400
Q0E0
Event Queue 0 Entry Register 0
0x02A0 0404
Q0E1
Event Queue 0 Entry Register 1
0x02A0 0408
Q0E2
Event Queue 0 Entry Register 2
0x02A0 040C
Q0E3
Event Queue 0 Entry Register 3
0x02A0 0410
Q0E4
Event Queue 0 Entry Register 4
0x02A0 0414
Q0E5
Event Queue 0 Entry Register 5
0x02A0 0418
Q0E6
Event Queue 0 Entry Register 6
0x02A0 041C
Q0E7
Event Queue 0 Entry Register 7
0x02A0 0420
Q0E8
Event Queue 0 Entry Register 8
0x02A0 0424
Q0E9
Event Queue 0 Entry Register 9
0x02A0 0428
Q0E10
Event Queue 0 Entry Register 10
0x02A0 042C
Q0E11
Event Queue 0 Entry Register 11
0x02A0 0430
Q0E12
Event Queue 0 Entry Register 12
0x02A0 0434
Q0E13
Event Queue 0 Entry Register 13
0x02A0 0438
Q0E14
Event Queue 0 Entry Register 14
0x02A0 043C
Q0E15
Event Queue 0 Entry Register 15
0x02A0 0440
Q1E0
Event Queue 1 Entry Register 0
0x02A0 0444
Q1E1
Event Queue 1 Entry Register 1
0x02A0 0448
Q1E2
Event Queue 1 Entry Register 2
0x02A0 044C
Q1E3
Event Queue 1 Entry Register 3
0x02A0 0450
Q1E4
Event Queue 1 Entry Register 4
0x02A0 0454
Q1E5
Event Queue 1 Entry Register 5
0x02A0 0458
Q1E6
Event Queue 1 Entry Register 6
0x02A0 045C
Q1E7
Event Queue 1 Entry Register 7
0x02A0 0460
Q1E8
Event Queue 1 Entry Register 8
0x02A0 0464
Q1E9
Event Queue 1 Entry Register 9
0x02A0 0468
Q1E10
Event Queue 1 Entry Register 10
0x02A0 046C
Q1E11
Event Queue 1 Entry Register 11
0x02A0 0470
Q1E12
Event Queue 1 Entry Register 12
0x02A0 0474
Q1E13
Event Queue 1 Entry Register 13
0x02A0 0478
Q1E14
Event Queue 1 Entry Register 14
0x02A0 047C
Q1E15
Event Queue 1 Entry Register 15
0x02A0 0480
Q2E0
Event Queue 2 Entry Register 0
0x02A0 0484
Q2E1
Event Queue 2 Entry Register 1
0x02A0 0488
Q2E2
Event Queue 2 Entry Register 2
0x02A0 048C
Q2E3
Event Queue 2 Entry Register 3
0x02A0 0490
Q2E4
Event Queue 2 Entry Register 4
0x02A0 0494
Q2E5
Event Queue 2 Entry Register 5
0x02A0 0498
Q2E6
Event Queue 2 Entry Register 6
0x02A0 049C
Q2E7
Event Queue 2 Entry Register 7
0x02A0 04A0
Q2E8
Event Queue 2 Entry Register 8
0x02A0 04A4
Q2E9
Event Queue 2 Entry Register 9
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Table 6-14. EDMA Channel Controller Registers (continued)
76
HEX ADDRESS
ACRONYM
0x02A0 04A8
Q2E10
Event Queue 2 Entry Register 10
REGISTER NAME
0x02A0 04AC
Q2E11
Event Queue 2 Entry Register 11
0x02A0 04B0
Q2E12
Event Queue 2 Entry Register 12
0x02A0 04B4
Q2E13
Event Queue 2 Entry Register 13
0x02A0 04B8
Q2E14
Event Queue 2 Entry Register 14
0x02A0 04BC
Q2E15
Event Queue 2 Entry Register 15
0x02A0 04C0
Q3E0
Event Queue 3 Entry Register 0
0x02A0 04C4
Q3E1
Event Queue 3 Entry Register 1
0x02A0 04C8
Q3E2
Event Queue 3 Entry Register 2
0x02A0 04CC
Q3E3
Event Queue 3 Entry Register 3
0x02A0 04D0
Q3E4
Event Queue 3 Entry Register 4
0x02A0 04D4
Q3E5
Event Queue 3 Entry Register 5
0x02A0 04D8
Q3E6
Event Queue 3 Entry Register 6
0x02A0 04DC
Q3E7
Event Queue 3 Entry Register 7
0x02A0 04E0
Q3E8
Event Queue 3 Entry Register 8
0x02A0 04E4
Q3E9
Event Queue 3 Entry Register 9
0x02A0 04E8
Q3E10
Event Queue 3 Entry Register 10
0x02A0 04EC
Q3E11
Event Queue 3 Entry Register 11
0x02A0 04F0
Q3E12
Event Queue 3 Entry Register 12
0x02A0 04F4
Q3E13
Event Queue 3 Entry Register 13
0x02A0 04F8
Q3E14
Event Queue 3 Entry Register 14
Event Queue 3 Entry Register 15
0x02A0 04FC
Q3E15
0x02A0 0500 - 0x02A0 051C
-
Reserved
0x02A0 0520 - 0x02A0 05FC
-
Reserved
0x02A0 0600
QSTAT0
Queue 0 Status Register
0x02A0 0604
QSTAT1
Queue 1 Status Register
0x02A0 0608
QSTAT2
Queue Status Register 2
Queue Status Register 3
0x02A0 060C
QSTAT3
0x02A0 0610 - 0x02A0 061C
-
0x02A0 0620
QWMTHRA
0x02A0 0624
-
Reserved
Queue Watermark Threshold A Register for Q[3:0]
Reserved
0x02A0 0640
CCSTAT
0x02A0 0644 - 0x02A0 06FC
-
Reserved
0x02A0 0700 - 0x02A0 07FC
-
Reserved
0x02A0 0800
MPFAR
Memory Protection Fault Address Register
0x02A0 0804
MPFSR
Memory Protection Fault Status Register
0x02A0 0808
MPFCR
Memory Protection Fault Command Register
0x02A0 080C
MPPA0
Memory Protection Page Attribute Register 0
0x02A0 0810
MPPA1
Memory Protection Page Attribute Register 1
0x02A0 0814
MPPA2
Memory Protection Page Attribute Register 2
0x02A0 0818
MPPA3
Memory Protection Page Attribute Register 3
0x02A0 081C
MPPA4
Memory Protection Page Attribute Register 4
0x02A0 0820
MPPA5
Memory Protection Page Attribute Register 5
0x02A0 0824
MPPA6
Memory Protection Page Attribute Register 6
Memory Protection Page Attribute Register 7
0x02A0 0828
MPPA7
0x02A0 082C - 0x02A0 0FFC
-
0x02A0 1000
ER
EDMA3CC Status Register
Reserved
Event Register
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Table 6-14. EDMA Channel Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x02A0 1004
ERH
Event Register High
REGISTER NAME
Event Clear Register
0x02A0 1008
ECR
0x02A0 100C
ECRH
0x02A0 1010
ESR
0x02A0 1014
ESRH
Event Set Register High
0x02A0 1018
CER
Chained Event Register
0x02A0 101C
CERH
Event Clear Register High
Event Set Register
Chained Event Register High
0x02A0 1020
EER
0x02A0 1024
EERH
Event Enable Register
Event Enable Register High
0x02A0 1028
EECR
Event Enable Clear Register
0x02A0 102C
EECRH
Event Enable Clear Register High
0x02A0 1030
EESR
0x02A0 1034
EESRH
0x02A0 1038
SER
0x02A0 103C
SERH
Secondary Event Register High
0x02A0 1040
SECR
Secondary Event Clear Register
0x02A0 1044
SECRH
0x02A0 1048 - 0x02A0 104C
Event Enable Set Register
Event Enable Set Register High
Secondary Event Register
Secondary Event Clear Register High
Reserved
0x02A0 1050
IER
0x02A0 1054
IERH
Interrupt Enable Register High
0x02A0 1058
IECR
Interrupt Enable Clear Register
0x02A0 105C
IECRH
0x02A0 1060
IESR
0x02A0 1064
IESRH
0x02A0 1068
IPR
0x02A0 106C
IPRH
0x02A0 1070
ICR
Interrupt Enable Register
Interrupt Enable Clear Register High
Interrupt Enable Set Register
Interrupt Enable Set Register High
Interrupt Pending Register
Interrupt Pending Register High
Interrupt Clear Register
0x02A0 1074
ICRH
Interrupt Clear Register High
0x02A0 1078
IEVAL
Interrupt Evaluate Register
0x02A0 107C
-
0x02A0 1080
QER
Reserved
QDMA Event Register
0x02A0 1084
QEER
0x02A0 1088
QEECR
QDMA Event Enable Register
QDMA Event Enable Clear Register
0x02A0 108C
QEESR
QDMA Event Enable Set Register
0x02A0 1090
QSER
QDMA Secondary Event Register
0x02A0 1094
QSECR
0x02A0 1098 - 0x02A0 1FFF
-
Reserved
QDMA Secondary Event Clear Register
0x02A0 2000- 0x02A0 2097
-
Shadow Region 0 Channel Registers
0x02A0 2098 - 0x02A0 21FF
-
Reserved
0x02A0 2200 - 0x02A0 2297
-
Shadow Region 1 Channel Registers
0x02A0 2298 - 0x02A0 23FF
-
Reserved
0x02A0 2400 - 0x02A0 2497
-
Shadow Region 2 Channel Registers
0x02A0 2498 - 0x02A0 25FF
-
Reserved
0x02A0 2600 - 0x02A0 2697
-
Shadow Region 3 Channel Registers
0x02A0 2698 - 0x02A0 27FF
-
Reserved
0x02A0 2800 - 0x02A0 2897
-
Shadow Region 4 Channel Registers
0x02A0 2898 - 0x02A0 29FF
-
Reserved
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Table 6-14. EDMA Channel Controller Registers (continued)
HEX ADDRESS
ACRONYM
0x02A0 2A00 - 0x02A0 2A97
-
Shadow Region 5 Channel Registers
REGISTER NAME
0x02A0 2A98 - 0x02A0 2BFF
-
Reserved
0x02A0 2C00 - 0x02A0 2C97
-
Shadow Region 6 Channel Registers
0x02A0 2C98 - 0x02A0 2DFF
-
Reserved
0x02A0 2E00 - 0x02A0 2E97
-
Shadow Region 7 Channel Registers
0x02A0 2E98 - 0x02A0 2FFF
-
Reserved
Table 6-15 shows an abbreviation of the set of registers that make up the parameter set for each of 128
EDMA events. Each of the parameter register sets consist of eight 32-bit word entries. Table 6-16 shows
the parameter set entry registers with relative memory address locations within each of the parameter
sets.
Table 6-15. EDMA Parameter Set RAM
HEX ADDRESS RANGE
DESCRIPTION
0x02A0 4000 - 0x02A0 401F
Parameters Set 0 (8 32-bit words)
0x02A0 4020 - 0x02A0 403F
Parameters Set 1 (8 32-bit words)
0x02A0 4040 - 0x02A0 405F
Parameters Set 2 (8 32-bit words)
0x02A0 4060 - 0x02A0 407F
Parameters Set 3 (8 32-bit words)
0x02A0 4080 - 0x02A0 409F
Parameters Set 4 (8 32-bit words)
0x02A0 40A0 - 0x02A0 40BF
Parameters Set 5 (8 32-bit words)
...
...
0x02A0 4FC0 - 0x02A0 4FDF
Parameters Set 126 (8 32-bit words)
0x02A0 4FE0 - 0x02A0 4FFF
Parameters Set 127 (8 32-bit words)
...
...
0x02A0 5FC0 - 0x02A0 5FDF
Parameters Set 254 (8 32-bit words)
0x02A0 5FE0 - 0x02A0 5FFF
Parameters Set 255 (8 32-bit words)
...
...
0x02A0 7FC0 - 0x02A0 7FDF
Parameters Set 510 (8 32-bit words)
0x02A0 7FE0 - 0x02A0 7FFF
Parameters Set 511 (8 32-bit words)
Table 6-16. Parameter Set Entries
HEX OFFSET ADDRESS
WITHIN THE PARAMETER SET
ACRONYM
PARAMETER ENTRY
0x0000
OPT
Option
0x0004
SRC
Source Address
0x0008
A_B_CNT
A Count, B Count
0x000C
DST
0x0010
SRC_DST_BIDX
Destination Address
Source B Index, Destination B Index
0x0014
LINK_BCNTRLD
Link Address, B Count Reload
0x0018
SRC_DST_CIDX
Source C Index, Destination C Index
0x001C
CCNT
C Count
Table 6-17. EDMA3 Transfer Controller 0 Registers
78
HEX ADDRESS RANGE
ACRONYM
02A2 0000
PID
REGISTER NAME
Peripheral Identification Register
02A2 0004
TCCFG
EDMA3TC Configuration Register
02A2 0008 - 02A2 00FC
-
Reserved
Peripheral Information and Electrical Specifications
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Table 6-17. EDMA3 Transfer Controller 0 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A2 0100
TCSTAT
02A2 0104 - 02A2 011C
-
02A2 0120
ERRSTAT
02A2 0124
ERREN
REGISTER NAME
EDMA3TC Channel Status Register
Reserved
Error Register
Error Enable Register
02A2 0128
ERRCLR
Error Clear Register
02A2 012C
ERRDET
Error Details Register
02A2 0130
ERRCMD
Error Interrupt Command Register
02A2 0134 - 02A2 013C
-
02A2 0140
RDRATE
Reserved
02A2 0144 - 02A2 023C
-
02A2 0240
SAOPT
Source Active Options Register
02A2 0244
SASRC
Source Active Source Address Register
02A2 0248
SACNT
Source Active Count Register
02A2 024C
SADST
Source Active Destination Address Register
02A2 0250
SABIDX
Source Active Source B-Index Register
02A2 0254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A2 0258
SACNTRLD
Source Active Count Reload Register
02A2 025C
SASRCBREF
Source Active Source Address B-Reference Register
02A2 0260
SADSTBREF
Source Active Destination Address B-Reference Register
02A2 0264 - 02A2 027C
-
02A2 0280
DFCNTRLD
02A2 0284
DFSRCBREF
Destination FIFO Set Destination Address B Reference Register
02A2 0288
DFDSTBREF
Destination FIFO Set Destination Address B Reference Register
02A2 028C - 02A2 02FC
-
Read Rate Register
Reserved
Reserved
Destination FIFO Set Count Reload
Reserved
02A2 0300
DFOPT0
Destination FIFO Options Register 0
02A2 0304
DFSRC0
Destination FIFO Source Address Register 0
02A2 0308
DFCNT0
Destination FIFO Count Register 0
02A2 030C
DFDST0
Destination FIFO Destination Address Register 0
02A2 0310
DFBIDX0
Destination FIFO BIDX Register 0
02A2 0314
DFMPPRXY0
02A2 0318 - 02A2 033C
-
Destination FIFO Memory Protection Proxy Register 0
Reserved
02A2 0340
DFOPT1
Destination FIFO Options Register 1
02A2 0344
DFSRC1
Destination FIFO Source Address Register 1
02A2 0348
DFCNT1
Destination FIFO Count Register 1
02A2 034C
DFDST1
Destination FIFO Destination Address Register 1
02A2 0350
DFBIDX1
Destination FIFO BIDX Register 1
02A2 0354
DFMPPRXY1
Destination FIFO Memory Protection Proxy Register 1
02A2 0358 - 02A2 037C
-
02A2 0380
DFOPT2
Reserved
Destination FIFO Options Register 2
02A2 0384
DFSRC2
Destination FIFO Source Address Register 2
02A2 0388
DFCNT2
Destination FIFO Count Register 2
02A2 038C
DFDST2
Destination FIFO Destination Address Register 2
02A2 0390
DFBIDX2
Destination FIFO BIDX Register 2
02A2 0394
DFMPPRXY2
Destination FIFO Memory Protection Proxy Register 2
02A2 0398 - 02A2 03BC
-
02A2 03C0
DFOPT3
Reserved
Destination FIFO Options Register 3
02A2 03C4
DFSRC3
Destination FIFO Source Address Register 3
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Table 6-17. EDMA3 Transfer Controller 0 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A2 03C8
DFCNT3
REGISTER NAME
Destination FIFO Count Register 3
02A2 03CC
DFDST3
Destination FIFO Destination Address Register 3
02A2 03D0
DFBIDX3
Destination FIFO BIDX Register 3
02A2 03D4
DFMPPRXY3
02A2 03D8 - 02A2 7FFF
-
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 6-18. EDMA3 Transfer Controller 1 Registers
80
HEX ADDRESS RANGE
ACRONYM
02A2 8000
PID
Peripheral Identification Register
02A2 8004
TCCFG
EDMA3TC Configuration Register
02A2 8008 - 02A2 80FC
-
02A2 8100
TCSTAT
02A2 8104 - 02A2 811C
-
02A2 8120
ERRSTAT
REGISTER NAME
Reserved
EDMA3TC Channel Status Register
Reserved
Error Register
02A2 8124
ERREN
02A2 8128
ERRCLR
Error Clear Register
02A2 812C
ERRDET
Error Details Register
Error Interrupt Command Register
02A2 8130
ERRCMD
02A2 8134 - 02A2 813C
-
02A2 8140
RDRATE
02A2 8144 - 02A2 823C
-
Error Enable Register
Reserved
Read Rate Register
Reserved
02A2 8240
SAOPT
Source Active Options Register
02A2 8244
SASRC
Source Active Source Address Register
02A2 8248
SACNT
Source Active Count Register
02A2 824C
SADST
Source Active Destination Address Register
02A2 8250
SABIDX
Source Active Source B-Index Register
02A2 8254
SAMPPRXY
Source Active Memory Protection Proxy Register
Source Active Count Reload Register
02A2 8258
SACNTRLD
02A2 825C
SASRCBREF
Source Active Source Address B-Reference Register
02A2 8260
SADSTBREF
Source Active Destination Address B-Reference Register
02A2 8264 - 02A2 827C
-
Reserved
02A2 8280
DFCNTRLD
02A2 8284
DFSRCBREF
Destination FIFO Set Count Reload
Destination FIFO Set Destination Address B Reference Register
02A2 8288
DFDSTBREF
Destination FIFO Set Destination Address B Reference Register
02A2 828C - 02A2 82FC
-
02A2 8300
DFOPT0
Reserved
Destination FIFO Options Register 0
02A2 8304
DFSRC0
Destination FIFO Source Address Register 0
02A2 8308
DFCNT0
Destination FIFO Count Register 0
02A2 830C
DFDST0
Destination FIFO Destination Address Register 0
02A2 8310
DFBIDX0
Destination FIFO BIDX Register 0
02A2 8314
DFMPPRXY0
Destination FIFO Memory Protection Proxy Register 0
02A2 8318 - 02A2 833C
-
02A2 8340
DFOPT1
Reserved
Destination FIFO Options Register 1
02A2 8344
DFSRC1
Destination FIFO Source Address Register 1
02A2 8348
DFCNT1
Destination FIFO Count Register 1
02A2 834C
DFDST1
Destination FIFO Destination Address Register 1
02A2 8350
DFBIDX1
Destination FIFO BIDX Register 1
Peripheral Information and Electrical Specifications
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Table 6-18. EDMA3 Transfer Controller 1 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A2 8354
DFMPPRXY1
REGISTER NAME
Destination FIFO Memory Protection Proxy Register 1
02A2 8358 - 02A2 837C
-
02A2 8380
DFOPT2
Reserved
Destination FIFO Options Register 2
02A2 8384
DFSRC2
Destination FIFO Source Address Register 2
02A2 8388
DFCNT2
Destination FIFO Count Register 2
02A2 838C
DFDST2
Destination FIFO Destination Address Register 2
02A2 8390
DFBIDX2
Destination FIFO BIDX Register 2
02A2 8394
DFMPPRXY2
02A2 8398 - 02A2 83BC
-
Destination FIFO Memory Protection Proxy Register 2
02A2 83C0
DFOPT3
Destination FIFO Options Register 3
02A2 83C4
DFSRC3
Destination FIFO Source Address Register 3
Reserved
02A2 83C8
DFCNT3
Destination FIFO Count Register 3
02A2 83CC
DFDST3
Destination FIFO Destination Address Register 3
02A2 83D0
DFBIDX3
Destination FIFO BIDX Register 3
02A2 83D4
DFMPPRXY3
02A2 83D8 - 02A2 FFFF
-
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 6-19. EDMA3 Transfer Controller 2 Registers
HEX ADDRESS RANGE
ACRONYM
02A3 0000
PID
REGISTER NAME
Peripheral Identification Register
02A3 0004
TCCFG
EDMA3TC Configuration Register
02A3 0008 - 02A3 00FC
-
02A3 0100
TCSTAT
Reserved
02A3 0104 - 02A3 011C
-
02A3 0120
ERRSTAT
02A3 0124
ERREN
02A3 0128
ERRCLR
Error Clear Register
02A3 012C
ERRDET
Error Details Register
02A3 0130
ERRCMD
Error Interrupt Command Register
02A3 0134 - 02A3 013C
-
02A3 0140
RDRATE
EDMA3TC Channel Status Register
Reserved
Error Register
Error Enable Register
Reserved
Read Rate Register
02A3 0144 - 02A3 023C
-
02A3 0240
SAOPT
Reserved
Source Active Options Register
02A3 0244
SASRC
Source Active Source Address Register
02A3 0248
SACNT
Source Active Count Register
02A3 024C
SADST
Source Active Destination Address Register
02A3 0250
SABIDX
Source Active Source B-Index Register
02A3 0254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A3 0258
SACNTRLD
Source Active Count Reload Register
02A3 025C
SASRCBREF
Source Active Source Address B-Reference Register
02A3 0260
SADSTBREF
Source Active Destination Address B-Reference Register
02A3 0264 - 02A3 027C
-
02A3 0280
DFCNTRLD
02A3 0284
DFSRCBREF
Destination FIFO Set Destination Address B Reference Register
Destination FIFO Set Destination Address B Reference Register
02A3 0288
DFDSTBREF
02A3 028C - 02A3 02FC
-
02A3 0300
DFOPT0
Reserved
Destination FIFO Set Count Reload
Reserved
Destination FIFO Options Register 0
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Table 6-19. EDMA3 Transfer Controller 2 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A3 0304
DFSRC0
REGISTER NAME
Destination FIFO Source Address Register 0
02A3 0308
DFCNT0
Destination FIFO Count Register 0
02A3 030C
DFDST0
Destination FIFO Destination Address Register 0
02A3 0310
DFBIDX0
Destination FIFO BIDX Register 0
02A3 0314
DFMPPRXY0
02A3 0318 - 02A3 033C
-
Destination FIFO Memory Protection Proxy Register 0
02A3 0340
DFOPT1
Destination FIFO Options Register 1
02A3 0344
DFSRC1
Destination FIFO Source Address Register 1
02A3 0348
DFCNT1
Destination FIFO Count Register 1
02A3 034C
DFDST1
Destination FIFO Destination Address Register 1
02A3 0350
DFBIDX1
Destination FIFO BIDX Register 1
Reserved
02A3 0354
DFMPPRXY1
02A3 0358 - 02A3 037C
-
Destination FIFO Memory Protection Proxy Register 1
02A3 0380
DFOPT2
Destination FIFO Options Register 2
02A3 0384
DFSRC2
Destination FIFO Source Address Register 2
02A3 0388
DFCNT2
Destination FIFO Count Register 2
02A3 038C
DFDST2
Destination FIFO Destination Address Register 2
02A3 0390
DFBIDX2
Destination FIFO BIDX Register 2
02A3 0394
DFMPPRXY2
02A3 0398 - 02A3 03BC
-
02A3 03C0
DFOPT3
Destination FIFO Options Register 3
02A3 03C4
DFSRC3
Destination FIFO Source Address Register 3
02A3 03C8
DFCNT3
Destination FIFO Count Register 3
02A3 03CC
DFDST3
Destination FIFO Destination Address Register 3
02A3 03D0
DFBIDX3
Destination FIFO BIDX Register 3
02A3 03D4
DFMPPRXY3
02A3 03D8 - 02A3 7FFF
-
Reserved
Destination FIFO Memory Protection Proxy Register 2
Reserved
Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 6-20. EDMA3 Transfer Controller 3 Registers
82
HEX ADDRESS RANGE
ACRONYM
02A3 8000
PID
Peripheral Identification Register
EDMA3TC Configuration Register
02A3 8004
TCCFG
02A3 8008 - 02A3 80FC
-
02A3 8100
TCSTAT
02A3 8104 - 02A3 811C
-
02A3 8120
ERRSTAT
02A3 8124
ERREN
REGISTER NAME
Reserved
EDMA3TC Channel Status Register
Reserved
Error Register
Error Enable Register
02A3 8128
ERRCLR
Error Clear Register
02A3 812C
ERRDET
Error Details Register
02A3 8130
ERRCMD
Error Interrupt Command Register
02A3 8134 - 02A3 813C
-
Reserved
02A3 8140
RDRATE
02A3 8144 - 02A3 823C
-
Read Rate Register
02A3 8240
SAOPT
Source Active Options Register
02A3 8244
SASRC
Source Active Source Address Register
02A3 8248
SACNT
Source Active Count Register
02A3 824C
SADST
Source Active Destination Address Register
Reserved
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Table 6-20. EDMA3 Transfer Controller 3 Registers (continued)
HEX ADDRESS RANGE
ACRONYM
02A3 8250
SABIDX
REGISTER NAME
02A3 8254
SAMPPRXY
Source Active Memory Protection Proxy Register
02A3 8258
SACNTRLD
Source Active Count Reload Register
02A3 825C
SASRCBREF
Source Active Source Address B-Reference Register
Source Active Destination Address B-Reference Register
Source Active Source B-Index Register
02A3 8260
SADSTBREF
02A3 8264 - 02A3 827C
-
02A3 8280
DFCNTRLD
02A3 8284
DFSRCBREF
Destination FIFO Set Destination Address B Reference Register
02A3 8288
DFDSTBREF
Destination FIFO Set Destination Address B Reference Register
02A3 828C - 02A3 82FC
-
02A3 8300
DFOPT0
Destination FIFO Options Register 0
02A3 8304
DFSRC0
Destination FIFO Source Address Register 0
02A3 8308
DFCNT0
Destination FIFO Count Register 0
02A3 830C
DFDST0
Destination FIFO Destination Address Register 0
02A3 8310
DFBIDX0
Destination FIFO BIDX Register 0
02A3 8314
DFMPPRXY0
02A3 8318 - 02A3 833C
-
Reserved
Destination FIFO Set Count Reload
Reserved
Destination FIFO Memory Protection Proxy Register 0
Reserved
02A3 8340
DFOPT1
Destination FIFO Options Register 1
02A3 8344
DFSRC1
Destination FIFO Source Address Register 1
02A3 8348
DFCNT1
Destination FIFO Count Register 1
02A3 834C
DFDST1
Destination FIFO Destination Address Register 1
02A3 8350
DFBIDX1
Destination FIFO BIDX Register 1
02A3 8354
DFMPPRXY1
02A3 8358 - 02A3 837C
-
Destination FIFO Memory Protection Proxy Register 1
Reserved
02A3 8380
DFOPT2
Destination FIFO Options Register 2
02A3 8384
DFSRC2
Destination FIFO Source Address Register 2
02A3 8388
DFCNT2
Destination FIFO Count Register 2
02A3 838C
DFDST2
Destination FIFO Destination Address Register 2
02A3 8390
DFBIDX2
Destination FIFO BIDX Register 2
02A3 8394
DFMPPRXY2
02A3 8398 - 02A3 83BC
-
Destination FIFO Memory Protection Proxy Register 2
Reserved
02A3 83C0
DFOPT3
Destination FIFO Options Register 3
02A3 83C4
DFSRC3
Destination FIFO Source Address Register 3
02A3 83C8
DFCNT3
Destination FIFO Count Register 3
02A3 83CC
DFDST3
Destination FIFO Destination Address Register 3
02A3 83D0
DFBIDX3
Destination FIFO BIDX Register 3
02A3 83D4
DFMPPRXY3
02A3 83D8 - 02A3 FFFF
-
Destination FIFO Memory Protection Proxy Register 3
Reserved
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6.7
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Reset Controller
The reset controller detects the different types of resets supported on the device and manages the
distribution of those resets throughout the device.
The device has several types of resets: power-on reset, warm reset, max reset and system reset.
Table 6-21 explains further the types of reset, the reset initiator, and the effects of each reset on the chip.
See Section 6.7.9 for more information on the effects of each reset on the PLL controllers and their clocks.
Table 6-21. Device-Level Reset Types
TYPE
INITIATOR
EFFECT(s)
Power-on Reset
POR pin
Resets the entire chip including the test and emulation logic
Warm Reset
RESET pin
Resets everything except for the test and emulation logic and the
Ethernet Subsystem
Max Reset
Emulator
Same as a warm reset
System Reset
PCI via the PRST pin
A system reset maintains memory contents and does not reset the
test and emulation circuit and the Ethernet Subsystem. The device
configuration pins are also not re-latched and system reset does not
affect the state of the peripherals (enable/disable).
In addition to device-level global resets, the PSC provides the capability to cause local resets to
peripherals and/or the CPU.
6.7.1
Power-on Reset (POR Pin)
Power-on reset (POR) is initiated by the POR pin and is used to reset the entire chip, including the test
and emulation logic. Power-on reset is also referred to as a cold reset since the device usually goes
through a power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power
supplies have reached their normal operating conditions. Note that a device power-up cycle is not required
to initiate a power-on reset.
The following sequence must be followed during a power-on reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted
(driven low). While POR is asserted, all pins will be in high-impedance mode. After the POR pin is
deasserted (driven high), all Z-group pins, low-group pins, and high-group pins are set to their reset
state and will remain at their reset state until configured by their respective peripheral. The clock and
reset of each peripheral is determined by the default settings of the power and sleep controller (PSC).
2. Once all the power supplies are within valid operating conditions, the POR pin must remain asserted
(low) for a minimum number of 256 CLKIN2 cycles. The PLL1 controller input clock, CLKIN1, and the
PCI input clock, PCLK, must be valid during this time. PCLK is needed only if the PCI module is being
used. If the DDR2 memory controller and the Ethernet Subsystem are not needed, CLKIN2 can be tied
low and REFCLKP/REFCLKN can be connected to VSS and CVDD respectively. In this case, the POR
pin must remain asserted (low) for a minimum of 256 CLKIN1 cycles after all power supplies have
reached valid operating conditions. Within the low period of the POR pin, the following occurs:
(a) The reset signals flow to the entire chip (including the test and emulation logic), resetting modules
that use reset asynchronously.
(b) The PLL1 controller clocks are started at the frequency of the system reference clock. The clocks
are propagated throughout the chip to reset modules that use reset synchronously. By default,
PLL1 is in reset and unlocked.
(c) The PLL2 controller clocks are started at the frequency of the system reference clock. PLL2 is held
in reset. Since the PLL2 controller always operates in PLL mode, the system reference clock and
all the system clocks are invalid at this point.
(d) The RESETSTAT pin stays asserted (low), indicating the device is in reset.
3. The POR pin may now be deasserted (driven high). When the POR pin is deasserted, the
configuration pin values are latched, and the PLL controllers change their system clocks to their default
divide-down values. PLL2 is taken out of reset and automatically starts its locking sequence. Other
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device initialization is also started.
4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time,
PLL2 has already completed its locking sequence and is outputting a valid clock. The system clocks of
both PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their
respective system reference clocks. After the pause, the system clocks are restarted at their default
divide-by settings.
The device is now out of reset; device execution begins as dictated by the selected boot mode.
6.7.2
Warm Reset (RESET Pin)
A warm reset has the same effect as a power-on reset, except that in this case, the test and emulation
logic are not reset.
The following sequence must be followed during a warm reset:
1. Hold the RESET pin low for a minimum of 24 CLKIN1 cycles. Within the low period of the RESET pin,
the following occurs:
(a) The Z-group pins, low-group pins, and the high-group pins are set to their reset state
(b) The reset signals flow to the entire chip (excluding the test and emulation logic), resetting modules
that use reset asynchronously
(c) The PLL Controllers are reset. PLL1 switches back to PLL bypass mode, resetting all their
registers to default values. Both PLL1 and PLL2 are placed in reset and lose lock. The PLL1
controller clocks start running at the frequency of the system reference clock. The clocks are
propagated throughout the chip to reset modules that use reset synchronously.
(d) The RESETSTAT pin becomes active (low), indicating the device is in reset.
2. The RESET pin may now be released (driven inactive high). When the RESET pin is released, the
configuration pin values are latched and the PLL controllers immediately change their system clocks to
their default divide-down values. Other device initialization is also started.
After device initialization is complete, the RESETSTAT pin goes inactive (high). All system clocks are
allowed to finish their current cycles and then paused for 10 cycles of their respective system reference
clocks. After the pause the system clocks are restarted at their default divide-by settings.
The clock and reset of each peripheral is determined by the default settings of the PSC.
The device is now out of reset, device execution begins as dictated by the selected boot mode.
6.7.3
Maximum Reset
A maximum (max) reset is initiated by the emulator. The effects are the same as a warm reset, except the
device boot and configuration pins are not re-latched. The emulator initiates a maximum reset via the
ICEPICK module. This ICEPICK initiated reset is nonmaskable.
The max reset sequence is as follows:
1. Max reset is initiated by the emulator. During this time, the following happens:
(a) The reset signals flow to the entire chip, resetting all the modules on chip except the test and
emulation logic.
(b) The PLL controllers are reset, PLL1 switches back to PLL bypass mode, resetting all their registers
to default values. Both PLL1 and PLL2 are placed in reset and lose lock.
(c) The RESETSTAT pin becomes asserted (low), indicating the device is in reset.
2. After device initialization is complete, the PLL Controllers pause the system clocks for 10 cycles. At the
end of these 10 cycles, the RESETSTAT pin is deasserted (driven high). At this point, the following
occurs:
(a) The I/O pins are controlled by the default peripherals (default peripherals are determined by
PINMUX register).
(b) The clock and reset of each peripheral is determined by the default settings of the power and sleep
controller (PSC).
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(c) The C64x+ begins executing from DSPBOOTADDR (determined by bootmode selection).
After the reset sequence, the boot sequence begins. Since the boot and configuration pins are not
latched with a max reset, the previous values (as shown in the BOOTCFG register) are used to
select the bootmode. For more details on the boot sequence, see the Using the
TMS320DM647/DM648 Bootloader Application Report (literature number SPRAAJ1). After the boot
sequence, follow the software initialization sequence.
6.7.4
System Reset
A system reset maintains memory contents and does not reset the clock logic or the test and emulation
circuitry. The device configuration pins are also not re-latched and the state of the peripherals
(enabled/disabled) is also not affected. A system reset is initiated by the PRST pin of PCI peripheral.
During a system reset, the following happens:
1. The RESETSTAT pin goes low to indicate an internal reset is being generated. The reset is allowed to
propagate through the system. Internal system clocks are not affected.
2. After the internal reset signal has propagated, the PLL controllers pause and restart their system
clocks for about 10 cycles of their system reference clocks, but retain their configuration. The PLLs
also remain locked.
3. The boot sequence is started after the system clocks are restarted. Since the configuration pins
(including the BOOTMODE[3:0] pins) are not latched with a system reset, the previous values, as
shown in the BOOTCFG register, are used to select the boot mode.
6.7.5
Peripheral Local Reset
The user can configure the local reset and clock state of a peripheral through programming the PSC.
Table 6-2 identifies the LPSC numbers and the peripherals capable of being locally reset by the PSC. For
more detailed information on the programming of these peripherals by the PSC, see the
TMS320DM647/TMS320DM648 DSP Subsystem Reference Guide (literature number SPRUEU6).
6.7.6
Reset Priority
If any of the above reset sources occur simultaneously, the PLLCTRL processes only the highest priority
reset request. The reset request priorities are as follows (high to low):
• Power-on Reset
• Maximum Reset
• Warm Reset
• System Reset
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6.7.7
Reset Controller Register
The reset type status (RSTYPE) register is the only register for the reset controller.
The RSTYPE register latches the cause of the last reset. If multiple reset sources occur simultaneously,
this register latches the highest priority reset source. The reset type status register is shown in Figure 6-9
and described in Table 6-22.
Figure 6-9. Reset Type Status Register (RSTYPE)
31
16
Reserved
R-0
15
3
2
1
0
Reserved
4
SRST
MRST
WRST
POR
R-0
R-0
R-0
R-0
R-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 6-22. Reset Type Status Register (RSTYPE) Field Descriptions
Bit
31:4
3
2
1
0
6.7.8
Field
Value
Reserved
Description
Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
SRST
System reset
0
System Reset was not the last reset to occur.
1
System Reset was the last reset to occur.
MRST
Max reset
0
Max Reset was not the last reset to occur.
1
Max Reset was the last reset to occur.
WRST
Warm reset
0
Warm Reset was not the last reset to occur.
1
Warm Reset was the last reset to occur.
POR
Power-on reset
0
Power-on Reset was not the last reset to occur.
1
Power-on Reset was the last reset to occur.
Pin Behaviors at Reset
During normal operation, devices pins are controlled by the selected peripheral. During device level global
reset, the pin behaviors are classified into the following Reset Groups:
• Z Group: These pins are 3-stated when a device-level global reset source (e.g., POR, RESET, or Max
Reset) is asserted. When the reset source is de-asserted, these pins remain 3-stated until configured
otherwise by their respective peripheral (after the peripheral is enabled by the PSC).
• Z/High Group: These pins are 3-stated when a device-level global reset source (e.g., POR, RESET,
or Max Reset) is asserted. When the reset source is de-asserted, these pins drive a logic High.
• Z/Low Group: These pins are 3-stated when a device-level global reset source (e.g. POR, RESET, or
Max Reset) is asserted. When the reset source is de-asserted, these pins drive a logic Low.
• DDR2 Z/High Group: These pins are 3-stated when a device-level global reset source (e.g. POR,
RESET, or Max Reset) is asserted. When the reset source is de-asserted, these pins are Driven High.
• DDR2 Low/High Group: These pins are driven Low when a device-level global reset source (e.g.
POR, RESET, or Max Reset) is asserted. When the reset source is de-asserted, these pins are Driven
High.
• DDR2 High/Low Group: These pins are driven High when a device-level global reset source (e.g.
POR, RESET, or Max Reset) is asserted. When the reset source is de-asserted, these pins are Driven
Low.
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Clock Group: These clock pins are toggling by default. They pause momentarily before RESETSTAT
is de-asserted (high).
Table 6-23 lists the Reset Group for each pin.
Table 6-23. Pin Behaviors at Reset
88
Pin Name
Reset Group
CLKIN1
Z Group
CLKIN2
Z Group
REFCLKN
Z Group
REFCLKP
Z Group
SYSCLK5
Z Group
TCLK
Z Group
TDI
Z Group
TDO
Z Group
TMS
Z Group
TRST
Z Group
EMU0
Z Group
EMU1
Z Group
EMU2
Z Group
EMU3
Z Group
EMU4
Z Group
EMU5
Z Group
EMU6
Z Group
EMU7
Z Group
EMU8
Z Group
EMU9
Z Group
EMU10
Z Group
EMU11
Z Group
NMI
Z Group
RESET
Z Group
POR
Z Group
AD00/HD00
Z Group
AD01/HD01
Z Group
AD02/HD02
Z Group
AD03/HD03
Z Group
AD04/HD04
Z Group
AD05/HD05
Z Group
AD06/HD06
Z Group
AD07/HD07
Z Group
AD08/HD08
Z Group
AD09/HD09
Z Group
AD10/HA10
Z Group
AD11/HD11
Z Group
AD12/HD12
Z Group
AD13/HD13
Z Group
AD14/HD14
Z Group
AD15/HD15
Z Group
AD16/HD16
Z Group
AD17/HD17
Z Group
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Table 6-23. Pin Behaviors at Reset (continued)
Pin Name
Reset Group
AD18/HS18
Z Group
AD19/HD19
Z Group
AD20/HD20
Z Group
AD21/HD21
Z Group
AD22/HD22
Z Group
AD23/HD23
Z Group
AD24/HD24
Z Group
AD25/HS25
Z Group
AD26/HD26
Z Group
AD27/AD27
Z Group
AD28/HD28
Z Group
AD29/HD29
Z Group
AD30/HD30
Z Group
AD31/HD31
Z Group
PPAR/HAS
Z Group
PSTOP/HCNTL0
Z Group
PDEVSEL/HCNTL1
Z Group
PPERR/HCS
Z Group
PSERR/HDS1
Z Group
PCBE0/GP04
Z Group
PCBE2/HR/W
Z Group
PCBE3/GP07
Z Group
PCLK/HHWIL
Z Group
PGNT/GPO0
Z Group
PRST/GPO1
Z Group
PINTA/GPO2
Z Group
PREQ/GPO3
Z Group
PTRDY/GPO5
Z Group
PIDSEL/GPO6
Z Group
DEVICEENABLE0/AEA20
Z Group
EMIBWIDTH/AEA22
Z Group
FASTBOOT/AEA21
Z Group
UHPIEN
Z Group
HPIWIDTH/AEA16
Z Group
RSV_BOOT/AEA15
Z Group
PCI66/AEA18
Z Group
BOOTMODE0/AEA11
Z Group
BOOTMODE1/AEA12
Z Group
BOOTMODE2/AEA13
Z Group
BOOTMODE3/AEA14
Z Group
SCL
Z Group
SDA
Z Group
SGMII0RXN
Z Group
SGMII0RXP
Z Group
SGMII1RXN
Z Group
SGMII1RXP
Z Group
SGMII0TXN
Z Group
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Table 6-23. Pin Behaviors at Reset (continued)
90
Pin Name
Reset Group
SGMII0TXP
Z Group
SGMII1TXN
Z Group
SGMII1TXP
Z Group
MDIO
Z Group
SPICLK
Z Group
SPICS1/UARTTX
Z Group
SPICS2/UARTRX
Z Group
SPIDI/UARTRTS
Z Group
SPIDO/UARTCTS
Z Group
T0INP12/GP08
Z Group
T0OUT12/GP09
Z Group
T1INPL/GP10
Z Group
T1OUT12/GP11
Z Group
AHCLKR
Z Group
ALHCLKX
Z Group
ACLKR
Z Group
ACLKX
Z Group
AFSR
Z Group
AFSX
Z Group
AXR0
Z Group
AXR1
Z Group
AXR2
Z Group
AXR3
Z Group
AXR4
Z Group
AXR5
Z Group
AXR6
Z Group
AXR7
Z Group
STCLK/AXR8
Z Group
VDAC/AXR9
Z Group
AMUTEIN
Z Group
AMUTE
Z Group
VP0CLK0
Z Group
VP0CLK1
Z Group
VP0CTL0
Z Group
VP0CTL1
Z Group
VP0CTL2
Z Group
VP0D02
Z Group
VP0D03
Z Group
VP0D04
Z Group
VP0D05
Z Group
VP0D06
Z Group
VP0D07
Z Group
VP0D08
Z Group
VP0D09
Z Group
VP0D12/GP12
Z Group
VP0D13/GP13
Z Group
VP0D14/GP14
Z Group
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Table 6-23. Pin Behaviors at Reset (continued)
Pin Name
Reset Group
VP0D15/GP15
Z Group
VP0D16
Z Group
VP0D17
Z Group
VP0D18
Z Group
VP0D19
Z Group
VP1CLK0
Z Group
VP1CLK1
Z Group
VP1CTL0
Z Group
VP1CTL1
Z Group
VP1CTL2
Z Group
VP1D02/GP16
Z Group
VP1D03/GP17
Z Group
VP1D04/GP18
Z Group
VP1D05/GP19
Z Group
VP1D06/GP20
Z Group
VP1D07/GP21
Z Group
VP1D08/GP22
Z Group
VP1D09/GP23
Z Group
VP1D12/GP24
Z Group
VP1D13/GP25
Z Group
VP1D14/GP26
Z Group
VP1D15/GP27
Z Group
VP1D16/GP28
Z Group
VP1D17/GP29
Z Group
VP1D18/GP30
Z Group
VP1D19/GP31
Z Group
VP2CLK0
Z Group
VP2CLK1/VCLK
Z Group
VP2CTL0
Z Group
VP2CTL1
Z Group
VP2CTL2/SCRUN
Z Group
VP2D02
Z Group
VP2D03
Z Group
VP2D04
Z Group
VP2D05
Z Group
VP2D06
Z Group
VP2D07
Z Group
VP2D08
Z Group
VP2D09
Z Group
VP2D12/VRXD0
Z Group
VP2D13/VRXD1
Z Group
VP2D14/VRXD2
Z Group
VP2D15/VRXD3
Z Group
VP3CLK1/AECLKOUT
Z Group
VP3CTL0/AAWE/ASWE
Z Group
VP3CTL1/AR/W
Z Group
VP3CTL2/AAOE/ASOE
Z Group
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Table 6-23. Pin Behaviors at Reset (continued)
92
Pin Name
Reset Group
VP3D02/AED00
Z Group
VP3D03/AED01
Z Group
VP3D04/AED02
Z Group
VP3D05/AED03
Z Group
VP3D06/AED04
Z Group
VP3D07/AED05
Z Group
VP3D08/AED06
Z Group
VP3D09/AED07
Z Group
VP3D12/AED08
Z Group
VP3D13/AED09
Z Group
VP3D14/AED10
Z Group
VP3D15/AED11
Z Group
VP3D16/AED12
Z Group
VP3D17/AED13
Z Group
VP3D18/AED14
Z Group
VP3D19/AED15
Z Group
VP4CLK1
Z Group
VP4CTL0/ABA0
Z Group
VP4CTL1/ABA1
Z Group
VP4CTL2/ASADS/ASRE
Z Group
VP4D02/ABE00
Z Group
VP4D03/ABE01
Z Group
VP4D04/AEA10
Z Group
VP4D05
Z Group
VP4D06/ACE2
Z Group
VP4D07/ACE3
Z Group
VP4D08/AEA00
Z Group
VP4D09/AEA01
Z Group
VP4D12/AEA02
Z Group
VP4D13/AEA03
Z Group
VP4D14/AEA04
Z Group
VP4D15/AEA05
Z Group
VP4D16/AEA06
Z Group
VP4D17/AEA07
Z Group
VP4D18/AEA08
Z Group
VP4D19/AEA09
Z Group
AEA23
Z Group
AEA19
Z Group
AEA17
Z Group
MDCLK
Z/High Group
VP4CLK0/AARDY
Z/High Group
PFRAME/HINT
Z/High Group
PIRDY/HRDY
Z/Low Group
VP2D16/VTXD0
Z/Low Group
VP2D17/VTXD1
Z/Low Group
VP2D18/VTXD2
Z/Low Group
VP2D19/VTXD3
Z/Low Group
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Table 6-23. Pin Behaviors at Reset (continued)
Pin Name
Reset Group
DDR_D00
DDR2 Z Group
DDR_D01
DDR2 Z Group
DDR_D02
DDR2 Z Group
DDR_D03
DDR2 Z Group
DDR_D04
DDR2 Z Group
DDR_D05
DDR2 Z Group
DDR_D06
DDR2 Z Group
DDR_D07
DDR2 Z Group
DDR_D08
DDR2 Z Group
DDR_D09
DDR2 Z Group
DDR_D10
DDR2 Z Group
DDR_D11
DDR2 Z Group
DDR_D12
DDR2 Z Group
DDR_D13
DDR2 Z Group
DDR_D14
DDR2 Z Group
DDR_D15
DDR2 Z Group
DDR_D16
DDR2 Z Group
DDR_D17
DDR2 Z Group
DDR_D18
DDR2 Z Group
DDR_D19
DDR2 Z Group
DDR_D20
DDR2 Z Group
DDR_D21
DDR2 Z Group
DDR_D22
DDR2 Z Group
DDR_D23
DDR2 Z Group
DDR_D24
DDR2 Z Group
DDR_D25
DDR2 Z Group
DDR_D26
DDR2 Z Group
DDR_D27
DDR2 Z Group
DDR_D28
DDR2 Z Group
DDR_D29
DDR2 Z Group
DDR_D30
DDR2 Z Group
DDR_D31
DDR2 Z Group
DDR_DQGATE1
DDR2 Z Group
DDR_DQGATE3
DDR2 Z Group
DDR_DQS[0]P
DDR2 Z Group
DDR_DQS[1]P
DDR2 Z Group
DDR_DQS[2]P
DDR2 Z Group
DDR_DQS[3]P
DDR2 Z Group
DDR_DQS[0]N
DDR2 Z Group
DDR_DQS[1]N
DDR2 Z Group
DDR_DQS[2]N
DDR2 Z Group
DDR_DQS[3]N
DDR2 Z Group
DDR_DQM[0]
DDR2 Z/High Group
DDR_DQM[1]
DDR2 Z/High Group
DDR_DQM[2]
DDR2 Z/High Group
DDR_DQM[3]
DDR2 Z/High Group
DDR_CAS
DDR2 High Group
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Table 6-23. Pin Behaviors at Reset (continued)
6.7.9
Pin Name
Reset Group
DDR_RAS
DDR2 High Group
DDR_WE
DDR2 High Group
DDR_A00
DDR2 Low Group
DDR_A01
DDR2 Low Group
DDR_A02
DDR2 Low Group
DDR_A03
DDR2 Low Group
DDR_A04
DDR2 Low Group
DDR_A05
DDR2 Low Group
DDR_A06
DDR2 Low Group
DDR_A07
DDR2 Low Group
DDR_A08
DDR2 Low Group
DDR_A09
DDR2 Low Group
DDR_A10
DDR2 Low Group
DDR_A11
DDR2 Low Group
DDR_A12
DDR2 Low Group
DDR_A13
DDR2 Low Group
DDR_ODT0
DDR2 Low Group
DDR_ODT1
DDR2 Low Group
DDR_CKE
DDR2 Low Group
DDR_DQGATE0
DDR2 Low Group
DDR_DQGATE2
DDR2 Low Group
DDR_BA[0]
DDR2 Low/High Group
DDR_BA[1]
DDR2 Low/High Group
DDR_BA[2]
DDR2 Low/High Group
DDR_CS
DDR2 High/Low Group
DDR_CLKP
Clock
DDR_CLKN
Clock
VP3CLK0/AECLKIN
Clock
RESETSTAT
Reflects POR or RESET value
Reset Electrical Data/Timing
NOTE
If a configuration pin must be routed out from the device, the internal pullup/pulldown
(IPU/IPD) resistor should not be relied upon; TI recommends the use of an external
pullup/pulldown resistor.
Table 6-24. Timing Requirements for Reset (1)
(2)
(see Figure 6-10)
720, 800, 900, 1100
NO.
(1)
(2)
(3)
(4)
94
MIN
MAX
UNIT
5
tw(POR)
Pulse duration, POR low (3)
256D
ns
6
tw(RESET)
Pulse duration, RESET low
24C
ns
7
tsu(boot)
Setup time, boot mode and configuration pins valid before POR high or
RESET high (4)
6P
ns
C = 1/CLKIN1 clock frequency in ns
D = 1/CLKIN2 clock frequency in ns
If CLKIN2 is not used, tw(POR) must be measured in terms of CLKIN1 cycles; otherwise, use the slower of the CLKIN1,CLKIN2 cycles.
P = 1/CPU clock frequency in nanoseconds
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Table 6-24. Timing Requirements for Reset(1) (2) (see Figure 6-10) (continued)
720, 800, 900, 1100
NO.
MIN
8
th(boot)
Hold time, boot mode and configuration pins valid after POR high or RESET
high (4)
MAX
UNIT
6P
ns
Table 6-25. Switching Characteristics Over Recommended Operating Conditions During Reset (1)
(see Figure 6-10)
NO.
PARAMETER
9
(1)
td(PORH-RSTATH)
Delay time, POR high AND RESET high to RESETSTAT high
720, 800, 900, 1100
MIN
MAX
1500C
UNIT
ns
C = 1/CLKIN1 clock frequency in ns.
•
•
•
•
•
A.
B.
C.
Z group consists of: all I/O/Z and O/Z pins, except for Low and High group pins. Pins become high
impedance as soon as their respective power supply has reached normal operating conditions. Pins
remain in high impedance until configured otherwise by their respective peripherals.
Low group consists of pins that become low as soon as their respective power supply has reached
normal operating conditions. Pins remain low until configured otherwise by their respective peripheral.
High group consists of pins that become high as soon as their respective power supply has reached
normal operating conditions. Pins remain high until configured otherwise by their respective peripheral.
All peripherals must be enabled through software following a power-on reset; for more details, see
Section 6.7.1, Power-on Reset.
For power-supply sequence requirements, see Section 6.3.1.
RESET should be used only after the device has been powered up. For more details on the use of the RESET pin,
see Section 6.7, Reset Controller.
A reset signal is generated internally during a Warm Reset. This internal reset signal has the same effect as the
RESET pin during a Warm Reset.
Boot and Device Configuration Inputs (during reset) include AEA[22:11], and UHPIEN.
Figure 6-10. Warm Reset and Max Reset Timing
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Interrupts
The C64x+ DSP interrupt controller combines device events into 12 prioritized interrupts. The source for
each of the 12 CPU interrupts is user programmable. Also, the interrupt controller controls the generation
of the CPU exception, NMI, and emulation interrupts and the generation of AEG events. Table 6-27
summarizes the C64x+ interrupt controller registers and memory locations. For more details on DSP
interrupt control, see TMS320DM647/TMS320DM648 DSP Subsystem Reference Guide (literature
number SPRUEU6).
Table 6-26. DSP Interrupt Events
DSP
INTERRUPT
EVENT NUMBER
EVENT
INTERRUPT SOURCE
0
EVT0
Output of event combiner 0, for events 1 – 31
1
EVT1
Output of event combiner 1, for events 32 – 63
2
EVT2
Output of event combiner 2, for events 64 – 95
3
EVT33
Output of event combiner 3, for events 96 – 127
4-8
Reserved
9
EMU_DTDMA
ECM interrupt for:
•
Host scan access event
•
DTDMA transfer complete event
•
AET interrupt event
10
Reserved
Reserved
11
EMU_RTDXRX
RTDX receive complete event
12
EMU_RTDXTX
RTDX transmit complete event
13
IDMA0 EMC
C64x+ EMC 0 event
14
IDMA1 EMC
C64x+ EMC 1 event
15
DSPINT
Host (PCI/HPI) to DSP interrupt event
16
I2CINT
I2C interrupt event
17
Reserved
Reserved
18
AEASYNCERR event
EMIFA Error Interrupt event
19
TINT2L
Timer interrupt low event
20
TINT2H
Timer interrupt high event
21
TINT3L
Timer interrupt low event
22
TINT3H
Timer interrupt high event
23
PSCINT
PSC-ALLINT event
24
TPCC_GINT
EDMA3 channel global completion interrupt event
25
SPIINT0
SPI Interrupt
26
SPIINT1
SPI Interrupt
27
DSQINT
VICP – Sqr (DSP int)
28
IMXINT
VICP – IMX
29
VLCDINT
VICP - VLCD
30 -31
Reserved
Reserved
32
RX_PULSE
Ethernet Subsystem RX pulse interrupt event
33
RX_THRESH_PULSE
Ethernet Subsystem RX threshold interrupt event
34
TX_PULSE
Ethernet Subsystem TX pulse interrupt event
35
MISC_PULSE
Ethernet Subsystem MISC pulse interrupt event
36
UART_INT
UART Interrupt
37
VP0_INT
VP0 Interrupt
38
VP1_INT
VP1 Interrupt
39
VP2_INT
VP2 Interrupt
40
VP3_INT
VP3 Interrupt
96
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Table 6-26. DSP Interrupt Events (continued)
DSP
INTERRUPT
EVENT NUMBER
EVENT
INTERRUPT SOURCE
41
VP4_INT
VP4 Interrupt
42
GPIO_BNK1_INT
(GPIO16:31) GPIO Bank 1 Interrupt event
43
AXINT
TX Interrupt McASP
44
ARINT
RX Interrupt McASP
45-49
Reserved
50
VINT
VLYNQ Pulse Interrupt event
51
GPINT0
GPIO Interrupt event
52
GPINT1
GPIO Interrupt event
53
GPINT2
GPIO Interrupt event
54
GPINT3
GPIO Interrupt event
55
GPINT4
GPIO Interrupt event
56
GPINT5
GPIO Interrupt event
57
GPINT6
GPIO Interrupt event
58
GPINT7
GPIO Interrupt event
59
GPINT8
GPIO Interrupt event
60
GPINT9
GPIO Interrupt event
61
GPINT10
GPIO Interrupt event
62
GPINT11
GPIO Interrupt event
63
GPINT12
GPIO Interrupt
64
GPINT13
GPIO Interrupt
65
GPINT14
GPIO Interrupt event
66
GPINT15
GPIO Interrupt event
67
TINT0L
Timer interrupt low event
68
TINT0H
Timer interrupt high event
69
TINT1L
Timer interrupt low event
70
TINT1H
Timer interrupt high event
71
EDMA3CC_INT0
EDMA3CC Completion Interrupt - Mask0 event
72
EDMA3CC_INT1
EDMA3CC Completion Interrupt – Mask1 event
73
EDMA3CC_INT2
EDMA3CC Completion Interrupt – Mask2 event
74
EDMA3CC_INT3
EDMA3CC Completion Interrupt – Mask3 event
75
EDMA3CC_INT4
EDMA3CC Completion Interrupt – Mask4 event
76
EDMA3CC_INT5
EDMA3CC Completion Interrupt – Mask5 event
77
EDMA3CC_INT6
EDMA3CC Completion Interrupt – Mask6 event
78
EDMA3CC_INT7
EDMA3CC Completion Interrupt – Mask7 event
79
EDMA3CC_ERRINT
EDMA3CC Error Interrupt event
80
EDMA3CC_MPINT
EDMA3CC Memory Protection Interrupt event
81
EDMA3TC0_ERRINT
EDMA3TC0 Error Interrupt event
82
EDMA3TC1_ERRINT
EDMA3TC1 Error Interrupt event
83
EDMA3TC2_ERRINT
EDMA3TC2 Error Interrupt event
84
EDMA3TC3_ERRINT
EDMA3TC3 Error Interrupt event
85
Reserved
Reserved
86
Reserved
Reserved
87
Reserved
Reserved
88
Reserved
Reserved
89
Reserved
Reserved
90
Reserved
Reserved
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Table 6-26. DSP Interrupt Events (continued)
DSP
INTERRUPT
EVENT NUMBER
EVENT
INTERRUPT SOURCE
91
Reserved
Reserved
92
Reserved
Reserved
93
Reserved
Reserved
94
Reserved
Reserved
95
Reserved
Reserved
96
INTERR
C64x+ Interrupt Controller Dropped CPU Interrupt Event
97
EMC_IDMAERR
C64x+ EMC Invalid IDMA Parameters event
98
Reserved
Reserved
99
Reserved
Reserved
100
EFIINTA
EFI Interrupt from side A event
101
EFIINTB
EFI Interrupt from side B event
102 - 112
Reserved
Reserved
113
L1P_ED
L1P Single bit error detected during DMA read event
114-115
Reserved
Reserved
116
L2_ED1
L2 single bit error detected event
117
L2_ED2
L2 two bit error detected event
118
PDC_INT
Power Down sleep interrupt event
119
Reserved
Reserved
120
L1P_CMPA
L1P CPU memory protection fault event
121
L1P_DMPA
L1P DMA memory protection fault event
122
L1D_CMPA
L1D CPU memory protection fault event
123
L1D_DMPA
L1D DMA memory protection fault event
124
L2_CMPA
L2 CPU memory protection fault event
125
L2_DMPA
L2 DMA memory protection fault event
126
IDMA_CMPA
IDMA CPU memory protection fault event
127
IDMA_BUSERR
IDMA bus error interrupt event
98
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Table 6-27. C64x+ Interrupt Controller Registers
HEX ADDRESS
ACRONYM
0x0180 0000
EVTFLAG0
Event flag register 0
REGISTER DESCRIPTION
0x0180 0004
EVTFLAG1
Event flag register 1
0x0180 0008
EVTFLAG2
Event flag register 2
0x0180 000C
EVTFLAG3
Event flag register 3
0x0180 0020
EVTSET0
Event set register 0
0x0180 0024
EVTSET1
Event set register 1
0x0180 0028
EVTSET2
Event set register 2
0x0180 002C
EVTSET3
Event set register 3
0x0180 0040
EVTCLR0
Event clear register 0
0x0180 0044
EVTCLR1
Event clear register 1
0x0180 0048
EVTCLR2
Event clear register 2
0x0180 004C
EVTCLR3
Event clear register 3
0x0180 0080
EVTMASK0
Event mask register 0
0x0180 0084
EVTMASK1
Event mask register 1
0x0180 0088
EVTMASK2
Event mask register 2
0x0180 008C
EVTMASK3
Event mask register 3
0x0180 00A0
MEVTFLAG0
Masked event flag register 0
0x0180 00A4
MEVTFLAG1
Masked event flag register 1
0x0180 00A8
MEVTFLAG2
Masked event flag register 2
0x0180 00AC
MEVTFLAG3
Masked event flag register 3
0x0180 00C0
EXPMASK0
Exception mask register 0
0x0180 00C4
EXPMASK1
Exception mask register 1
0x0180 00C8
EXPMASK2
Exception mask register 2
0x0180 00CC
EXPMASK3
Exception mask register 3
0x0180 00E0
MEXPFLAG0
Masked exception flag register 0
0x0180 00E4
MEXPFLAG1
Masked exception flag register 1
0x0180 00E8
MEXPFLAG2
Masked exception flag register 2
0x0180 00EC
MEXPFLAG3
Masked exception flag register 3
0x0180 0104
INTMUX1
Interrupt mux register 1
0x0180 0108
INTMUX2
Interrupt mux register 2
0x0180 010C
INTMUX3
Interrupt mux register 3
0x0180 0140
AEGMUX0
Advanced event generator mux register 0
0x0180 0144
AEGMUX1
Advanced event generator mux register 1
0x0180 0180
INTXSTAT
Interrupt exception status
0x0180 0184
INTXCLR
Interrupt exception clear
0x0180 0188
INTDMASK
Dropped interrupt mask register
0x0180 01C0
EVTASRT
Event assert register
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DDR2 Memory Controller
The 32-bit DDR2 memory controller bus of the device is used to interface to JESD79D-2A
standard-compliant DDR2 SDRAM devices. The DDR2 external bus interfaces only to DDR2 SDRAM
devices; it does not share the bus with any other types of peripherals. The decoupling of DDR2 memories
from other devices simplifies board design and provides I/O concurrency from a second external memory
interface, EMIFA.
The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum
throughput of the DDR2 bus. The data rate of the DDR2 bus is equal to the CLKIN2 frequency multiplied
by 20. The internal data bus clock frequency of the DDR2 memory controller is fixed at a divide-by-three
ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller of the two bus
frequencies. For example, if the internal data bus frequency is 300 MHz (CPU frequency is 900 MHz) and
the DDR2 data rate is 533 MHz (266 MHz clock rate as CLKIN2 frequency is 26.6 MHz), the maximum
data rate achievable by the DDR2 memory controller is 2.13 Gbytes/sec.
6.9.1
DDR2 Memory Controller Device-Specific Information
The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces
such as EMIF and HPI. For these other interfaces, the device timing was specified in terms of data
manual specifications and I/O buffer information specification (IBIS) models.
For the DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the printed
circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has performed the
simulation and system characterization to be sure all DDR2 interface timings in this solution are met.
The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2
memory device(s) must be connected to ground.
The DDR2 memory controller on the device supports the following memory topologies:
• A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.
• A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.
A race condition may exist when certain masters write data to the DDR2 memory controller. For example,
if master A passes a software message via a buffer in external memory and does not wait for indication
that the write completes, when master B attempts to read the software message, then the master B read
may bypass the master A write and, thus, master B may read stale data and, therefore, receive an
incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware specification of write-read ordering, it may be necessary to specify data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the DDR2 memory controller module ID and revision register.
3. Perform a dummy read to the DDR2 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
The master peripherals that need to implement this workaround are HPI, PCI, and VLYNQ.
100
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6.9.2
DDR2 Memory Controller Peripheral Registers
Table 6-28. DDR2 Memory Controller Registers (1)
HEX ADDRESS RANGE
(1)
ACRONYM
REGISTER NAME
0x7800 0000
MIDR
0x7800 0004
DMCSTAT
DDR2 Memory Controller Module and Revision Register
0x7800 0008
SDCFG
DDR2 Memory Controller SDRAM Configuration Register
0x7800 000C
SDRFC
DDR2 Memory Controller SDRAM Refresh Control Register
0x7800 0010
SDTIM1
DDR2 Memory Controller SDRAM Timing 1 Register
0x7800 0014
SDTIM2
DDR2 Memory Controller SDRAM Timing 2 Register
0x7800 0018
-
DDR2 Memory Controller Status Register
Reserved
0x7800 0020
BPRIO
0x7800 0024 - 0x7800 004C
-
DDR2 Memory Controller Burst Priority Register
Reserved
0x7800 0050 - 0x7800 0078
-
Reserved
0x7800 007C - 0x7800 00BC
-
Reserved
0x7800 00C0 - 0x7800 00E0
-
Reserved
0x7800 00E4
DMCCTL
0x7800 00E8 - 0x7800 00FC
-
Reserved
0x7800 0100 - 0x7FFF FFFF
-
Reserved
DDR2 Memory Controller Control Register
For details about the DDR2 registers and their modes, see the TMS320DM647/DM648 DSP DDR2 Memory Controller (DDR2) User's
Guide (literature number SPRUEK5).
6.9.3
DDR2 Interface
This section provides the timing information for the DDR2 interface as a PCB design and manufacturing
specification. The design rules constrain PCB trace length, PCB trace skew, signal integrity, cross-talk,
and signal timing. These rules, when followed, result in a reliable DDR2 memory system without the need
for a complex timing closure process. For more information regarding guidelines for using this DDR2
specification, Understanding TI's PCB Routing Rule-Based DDR2 Timing Specification (SPRAAV0).
6.9.3.1
DDR2 Interface Schematic
Figure 6-11 shows the DDR2 interface schematic for a x32 DDR2 memory system. The x16 DDR2 system
schematic shown in Figure 6-12 is identical except that the high word DDR2 device is deleted.
6.9.3.2
Compatible JEDEC DDR2 Devices
Table 6-29 shows the parameters of the JEDEC DDR2 devices that are compatible with this interface.
Generally, the DDR2 interface is compatible with x16 DDR2-533 speed grade DDR2 devices.
Table 6-29. Compatible JEDEC DDR2 Devices
NO.
(1)
(2)
(3)
PARAMETER
MIN
MAX
UNIT
1
JEDEC DDR2 Device Speed Grade (1)
2
JEDEC DDR2 Device Bit Width
x16
3
JEDEC DDR2 Device Count (2)
1
2
Devices
4
JEDEC DDR2 Device Ball Count (3)
84
92
Balls
DDR2-533
x16
Bits
Higher DDR2 speed grades are supported due to inherent JEDEC DDR2 backwards compatibility.
One DDR2 device is used for 16-bit DDR2 memory system. Two DDR2 devices are used for 32-bit DDR2 memory system.
92 ball devices retained for legacy support. New designs will migrate to 84 ball DDR2 devices. Electrically, the 92 and 84 ball DDR2
devices are the same.
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DM647/DM648
DDR_ODT0
DDR2
ODT
NC
DDR_D00
T
BED0
DDR_D7
DDR_DQM0
DDR_DQS0
T
T
T
BED7
LDM
LDQS
DDR_DQS0
DDR_D08
T
T
LDQS
BED8
DDR_D15
DDR_DQM1
DDR_DQS1
T
T
T
BED15
UDM
UDQS
T
UDQS
DDR_DQS1
DDR_DQGATE0
DDR_DQGATE1
DDR_DQGATE2
DDR_DQGATE3
DDR_ODT1
DDR_D16
T
T
DDR2
NC
ODT
T
BED0
DDR_DQS2
DDR_D24
T
T
T
T
T
BED0
LDM
LDQS
LDQS
BED7
DDR_D31
DDR_DQM3
DDR_DQS3
DDR_DQS3
T
T
T
T
BED15
UDM
UDQS
UDQS
DDR_D23
DDR_DQM2
DDR_DQS2
DDR_BA0
T
BA0
BA0
DDR_BA2
DDR_A00
T
T
BA2
A0
BA2
A0
DDR_A13
DDR_CS0
DDR_CAS
DDR_RAS
T
T
T
T
A13
CS
CAS
RAS
A13
CS
CAS
BSDWE
DDR_CKE
DDR_CLK
T
T
T
T
WE
CKE
CK
CK
WE
CKE
CK
CK
DDR_CLK
DDR_VREF
VREF
0.1 µF
T
A.
B.
C.
(B)
0.1 µF
(B)
(A)
RAS
VREF
VREF
(B)
0.1 µF
Vio 1.8
0.1 µF
VREF
1 kΩ 1%
VREF
0.1 µF
1 kΩ 1%
Terminator, if desired. See terminator comments.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Vio 1.8 is the power supply for the DDR2 memory interface.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a device VREF pin.
Figure 6-11. 32-Bit DDR2 High-Level Schematic
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DM647/DM648
DDR_ODT0
DDR2
ODT
NC
DDR_D00
T
BED0
DDR_D7
DDR_DQM0
DDR_DQS0
T
T
T
BED7
LDM
LDQS
DDR_DQS0
DDR_D08
T
T
LDQS
BED8
DDR_D15
DDR_DQM1
DDR_DQS1
T
T
T
BED15
UDM
UDQS
T
UDQS
DDR_DQS1
DDR_DQGATE0
DDR_DQGATE1
DDR_DQGATE2
DDR_DQGATE3
DDR_ODT1
DDR_D16
T
NC
1 kΩ
NC
NC
(A)
Vio 1.8
DDR_D23
DDR_DQM2
DDR_DQS2
DDR_DQS2
NC
NC
1 kΩ
DDR_D24
NC
1 kΩ
(A)
Vio 1.8
DDR_D31
DDR_DQM3
DDR_DQS3
DDR_DQS3
NC
NC
1 kΩ
1 kΩ
DDR_BA0
T
BA0
DDR_BA2
DDR_A00
T
T
BA2
A0
DDR_A13
DDR_CS0
DDR_CAS
DDR_RAS
T
T
T
T
A13
CS
CAS
BSDWE
DDR_CKE
DDR_CLK
T
T
T
T
WE
CKE
CK
CK
DDR_CLK
DDR_VREF
VREF
(B)
0.1 µF
T
A.
B.
C.
(A)
RAS
0.1 µF
Vio 1.8
0.1 µF
VREF
(B)
1 kΩ 1%
VREF
0.1 µF
1 kΩ 1%
Terminator, if desired. See terminator comments.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
One of these capacitors can be eliminated if the divider and its capacitors are placed near a device VREF pin.
Vio 1.8 is the power supply for the DDR2 memory interface.
Figure 6-12. 16-Bit DDR2 High-Level Schematic
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6.9.3.3
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PCB Stackup
The minimum stackup required for routing the device is a six-layer stack as shown in Table 6-30.
Additional layers may be added to the PCB stack up to accommodate other circuity or to reduce the size
of the PCB footprint.
Table 6-30. Minimum PCB Stack Up
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly horizontal
2
Plane
Ground
3
Plane
Power
4
Signal
Internal routing
5
Plane
Ground
6
Signal
Bottom routing mostly vertical
Complete stack up specifications are provided in Table 6-31.
Table 6-31. PCB Stack Up Specifications
NO.
PARAMETER
TYP
MAX
UNIT
PCB Routing/Plane Layers
6
2
Signal Routing Layers
3
3
Full ground layers under DDR2 routing Region
2
4
Number of ground plane cuts allowed within DDR routing region
5
Number of ground reference planes required for each DDR2 routing layer
6
Number of layers between DDR2 routing layer and reference ground plane
7
PCB Routing Feature Size
4
Mils
8
PCB Trace Width w
4
Mils
8
PCB BGA escape via pad size
18
Mils
8
Mils
9
PCB BGA escape via hole size
10
DSP Device BGA pad size (1)
11
DDR2 Device BGA pad size (2)
12
Single Ended Impedance, Zo
13
Impedance Control (3)
(1)
(2)
(3)
MIN
1
0
1
0
50
Z-5
Z
75
Ω
Z+5
Ω
See the Flip Chip Ball Grid Array Package Reference Guide (SPRU811) for DSP device BGA pad size.
See the DDR2 device manufacturer documenation for the DDR2 device BGA pad size.
Z is the nominal singled ended impedance selected for the PCB specified by item 12.
6.9.3.4
Placement
Figure 6-13 shows the required placement for the device as well as the DDR2 devices. The dimensions
for Figure 6-13 are defined in Table 6-32. The placement does not restrict the side of the PCB where the
devices are mounted. The purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For 16-bit DDR memory systems, the high word DDR2 device is omitted from the
placement.
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X
A1
DDR2
Controller
Y
OFFSET
DDR2
Device
Y
Y
OFFSET
DM648
A1
A.
Recommended DDR2 Device
Orientation
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-13. DDR2 Device Placement
Table 6-32. Placement Specifications
NO.
(1)
(2)
(3)
(4)
(5)
MAX
UNIT
1
PARAMETER
X (1)
(2)
MIN
1660
Mils
2
Y (1)
(2)
1280
Mils
650
Mils
(1) (2) (3)
3
Y Offset
4
DDR2 Keepout Region (4)
5
Clearance from non-DDR2 signal to DDR2 Keepout Region (5)
4
w
See Figure 6-11 for dimension defintions.
Measurements from center of DSP device to center of DDR2 device.
For 16-bit memory systems, it is recommended that Y Offset be as small as possible.
DDR2 Keepout region to encompass entire DDR2 routing area
Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.
6.9.3.5
DDR2 Keep Out Region
The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keep
out region is defined for this purpose and is shown in Figure 6-14. The size of this region varies with the
placement and DDR routing. Additional clearances required for the keep out region are shown in
Table 6-32.
DDR2 Device
DDR2 Controller
A1
A1
Figure 6-14. DDR2 Keepout Region
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NOTE
The region (see Figure 6-14) should encompass all DDR2 circuitry and varies depending on
placement. Non-DDR2 signals should not be routed on the DDR signal layers within the
DDR2 keep out region. Non-DDR2 signals may be routed in the region provided they are
routed on layers separated from DDR2 signal layers by a ground layer. No breaks should be
allowed in the reference ground layers in this region. In addition, the 1.8-V power plane
should cover the entire keep out region.
6.9.3.6
Bulk Bypass Capacitors
Bulk bypass capacitors are required for moderate speed bypassing of the DDR2 and other circuitry.
Table 6-33 contains the minimum numbers and capacitance required for the bulk bypass capacitors. This
table covers only the bypass needs of the DSP and DDR2 interfaces. Additional bulk bypass capacitance
may be needed for other circuitry.
Table 6-33. Bulk Bypass Capacitors
NO.
PARAMETER
MIN
MAX
UNIT
1
DVDD18 Bulk Bypass Capacitor Count
(1)
3
2
DVDD18 Bulk Bypass Total Capacitance
30
μF
3
DDR#1 Bulk Bypass Capacitor Count (2)
1
Devices
4
DDR#1 Bulk Bypass Total Capacitance
10
μF
1
Devices
10
μF
(2) (3)
5
DDR#2 Bulk Bypass Capacitor Count
6
DDR#2 Bulk Bypass Total Capacitance (3)
(1)
Devices
These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass caps.
These devices should be placed near the device they are bypassing, but preference should be given to the placement of the high-speed
(HS) bypass caps.
Only used on 32-bit wide DDR2 memory systems
(2)
(3)
6.9.3.7
High-Speed Bypass Capacitors
High-Speed (HS) bypass capacitors are critical for proper DDR2 interface operation. It is particularly
important to minimize the parasitic series inductance of the HS bypass cap, DSP/DDR power, and
DSP/DDR ground connections. Table 6-34 contains the specification for the HS bypass capacitors as well
as for the power connections on the PCB.
6.9.3.8
Net Classes
Table 6-35 lists the clock net classes for the DDR2 interface. Table 6-36 lists the signal net classes, and
associated clock net classes, for the signals in the DDR2 interface. These net classes are used for the
termination and routing rules that follow.
Table 6-34. High-Speed Bypass Capacitors
NO.
PARAMETER
MIN
1
HS Bypass Capacitor Package Size (1)
2
Distance from HS bypass capacitor to device being bypassed
(2)
MAX
UNIT
0402
10 Mils
250
Mils
3
Number of connection vias for each HS bypass capacitor
4
Trace length from bypass capacitor contact to connection via
1
5
Number of connection vias for each DDR2 device power or ground balls
1
6
Trace length from DDR2 device power ball to connection via
7
DVDD18 HS Bypass Capacitor Count (3)
20
Devices
8
DVDD18 HS Bypass Capacitor Total Capacitance
1.2
μF
(1)
(2)
(3)
106
2
Vias
30
Mils
Vias
35
Mils
L × W, 10 mil units ( i.e., a 0402 is a 40 × 20 mil surface mount capacitor)
An additional HS bypass capacitor can share the connection vias only if it is mounted on the opposite side of the board.
These devices should be placed as close as possible to the device being bypassed.
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Table 6-34. High-Speed Bypass Capacitors (continued)
NO.
PARAMETER
MIN
9
DDR#1 HS Bypass Capacitor Count (3)
10
DDR#1 HS Bypass Capacitor Total Capacitance
11
DDR#2 HS Bypass Capacitor Count (3)
12
DDR#2 HS Bypass Capacitor Total Capacitance (4)
(4)
MAX
UNIT
8
Devices
μF
0.4
(4)
8
Devices
μF
0.4
Only used on 32-bit wide DDR2 memory systems
Table 6-35. Clock Net Class Definitions
CLOCK NET CLASS
CK
DDR_CLK/DDR_CLK
DQS0
DDR_DQS0/DDR_DQS0
DQS1
DDR_DQS1/DDR_DQS1
DQS2 (1)
DDR_DQS2/DDR_DQS2
(1)
DDR_DQS3/DDR_DQS3
DQS3
(1)
DSP PIN NAMES
Only used on 32-bit wide DDR2 memory systems.
Table 6-36. Signal Net Class Definitions
CLOCK NET CLASS
ASSOCIATED CLOCK NET CLASS
DSP PIN NAMES
CK
DDR_BA[2:0], DDR_A[13:0], DDR_CS, DDR_CAS, DDR_RAS,
DDR_WE, DDR_CKE
DQ0
DQS0
DDR_D[7:0], DDR_DQM0
DQ1
DQS1
DDR_D[15:8], DDR_DQM1
(1)
DQS2
DDR_D[23:16], DDR_DQM2
DQ3 (1)
DQS3
DDR_D[31:24], DDR_DQM3
CK, DQS0, DQS1
DDR_DQGATE0, DDR_DQGATE1
CK, DQS2, DQS3
DDR_DQGATE2, DDR_DQGATE3
ADDR_CTRL
DQ2
DQGATEL
DQGATEH
(1)
(1)
Only used on 32-bit wide DDR2 memory systems.
6.9.3.9
DDR2 Signal Termination
No terminations of any kind are required in order to meet signal integrity and overshoot requirements.
Serial terminators are permitted, if desired, to reduce EMI risk; however, serial terminations are the only
type permitted. Table 6-37 shows the specifications for the series terminators.
Table 6-37. DDR2 Signal Terminations
NO.
1
(1)
(2)
(3)
(4)
PARAMETER
MIN
CK Net Class (1)
TYP
0
(1) (2) (3)
2
ADDR_CTRL Net Class
3
Data Byte Net Classes (DQS0-DQS3, DQ0-DQ3) (1)
4
DQGATE Net Classes (DQGATEL, DQGATEH) (1)
(2) (3) (4)
(2) (3)
MAX
UNIT
10
Ω
0
22
Zo
Ω
0
22
Zo
Ω
0
10
Zo
Ω
Only series termination is permitted, parallel or SST specifically disallowed.
Terminator values larger than typical only recommended to address EMI issues.
Termination value should be uniform across net class.
When no termination is used on data lines (0 Ωs), the DDR2 devices must be programmed to operate in 60% strength mode.
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6.9.3.10 VREF Routing
VREF is used as a reference by the input buffers of the DDR2 memories as well as the device’s. VREF is
intended to be 1/2 the DDR2 power supply voltage and should be created using a resistive divider as
shown in Figure 6-11. Other methods of creating VREF are not recommended. Figure 6-15 shows the
layout guidelines for VREF.
VREF Bypass Capacitor
DDR2 Device
A1
VREF Nominal Minimum
Trace Width is 20 Mils
DM648
Device
A1
Neck down to minimum in BGA escape regions
is acceptable. Narrowing to accommodate via
congestion for short distances is also acceptable.
Best performance is obtained if the width of
VREF is maximized.
A.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-15. VREF Routing and Topology
6.9.3.11 DDR2 CK and ADDR_CTRL Routing
Figure 6-16 shows the topology of the routing for the CK and ADDR_CTRL net classes. The route is a
balanced T as it is intended that the length of segments B and C be equal. In addition, the length of A
should be maximized.
T
C
A
DDR2
Controller
B
A1
DM648
A1
A.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-16. CK and ADDR_CTRL Routing and Topology
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Table 6-38. CK and ADDR_CTRL Routing Specification (1)
NO
(1)
(2)
(3)
PARAMETER
MIN
TYP
MAX
UNIT
1
Center to center CK-CK spacing
2w
2
CK A to B/A to C Skew Length Mismatch (1)
25
Mils
3
CK B to C Skew Length Mismatch
25
Mils
4
Center to center CK to other DDR2 trace spacing (2)
5
CK/ADDR_CTRL nominal trace length (3)
CACLM+50
Mils
6
ADDR_CTRL to CK Skew Length Mismatch
100
Mils
7
ADDR_CTRL to ADDR_CTRL Skew Length Mismatch
100
Mils
8
Center to center ADDR_CTRL to other DDR2 trace spacing (2)
4w
9
Center to center ADDR_CTRL to other ADDR_CTRL trace spacing (2)
3w
10
ADDR_CTRL A to B/A to C Skew Length Mismatch (1)
100
Mils
11
ADDR_CTRL B to C Skew Length Mismatch
100
Mils
4w
CACLM-50
CACLM
Series terminator, if used, should be located closest to DSP.
Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
CACLM is the longest Manhattan distance of the CK and ADDR_CTRL net classes.
Figure 6-17 shows the topology and routing for the DQS and DQ net classes; the routes are point to point.
Skew matching across bytes is not needed nor recommended.
T
A1
E0
T
DDR2
Controller
E1
DM648
T
A1
E2
T
E3
A.
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-17. DQS and DQ Routing and Toplogy
Table 6-39. DQS and DQ Routing Specification
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MIN
1
Center to center DQS-DQS spacing
2
DQS E Skew Length Mismatch
3
Center to center DQS to other DDR2 trace spacing (2)
4
DQS/DQ nominal trace length (1)
(3) (4) (5)
DQ to DQS Skew Length Mismatch
6
DQ to DQ Skew Length Mismatch (3)
TYP
MAX
UNIT
2w
(3) (4) (5)
5
(1)
(4) (5)
25
Mils
DQLM+50
Mils
100
Mils
100
Mils
4w
DQLM-50
DQLM
Series terminator, if used, should be located closest to DDR.
Center to center spacing is allowed to fall to minimum (w) for up to 500 mils of routed length to accommodate BGA escape and routing
congestion.
A 16-bit DDR memory system has two sets of data net classes, one for data byte 0, and one for data byte 1, each with an associated
DQS (2 DQSs).
A 32-bit DDR memory system will have four sets of data net classes, one each for data bytes 0 through 3, and each associated with a
DQS (4 DQSs).
There is no need and it is not recommended to skew match across data bytes, i.e., from DQS0 and data byte 0 to DQS1 and data byte
1.
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Table 6-39. DQS and DQ Routing Specification
NO.
PARAMETER
(6)
(7)
(continued)
MIN
7
Center to center DQ to other DDR2 trace spacing (2)
8
Center to Center DQ to other DQ trace spacing (7)
9
(1)
DQ/DQS E Skew Length Mismatch
(6)
TYP
MAX
UNIT
100
Mils
4w
(2)
3w
(3) (4) (5)
DQs from other DQS domains are considered other DDR2 trace.
DQLM is the longest Manhattan distance of each of the DQS and DQ net classes.
A1
FH
Figure 6-18 shows the routing for the DQGATE net classes. Table 6-40 contains the routing specification.
DDR2
Controller
T
A1
A.
DM648
FL
T
DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:
DM647/DM648.
Figure 6-18. DQGATE Routing
Table 6-40. DQGATE Routing Specification
NO.
(1)
(2)
(3)
(4)
(5)
110
PARAMETER
MIN
1
DQGATEL Length F (1)
2
DQGATEH Length F (2)
3
Center to center DQGATE to any other trace spacing
4
DQS/DQ nominal trace length
5
DQGATEL Skew (4)
6
DQGATEH Skew (5)
TYP
MAX
UNIT
DQLM +
50
Mils
100
Mils
100
Mils
CKB0B1
(3)
CKB2B3
4w
DQLM - 50
(3)
DQLM
CKB0B1 is the sum of the length of the CK net plus the average length of the DQS0 and DQS1 nets.
CKB2B3 is the sum of the length of the CK net plus the average length of the DQS2 and DQS3 nets.
Only used on 32-bit-wide DDR2 memory systems.
Skew from CKB0B1
Skew from CKB2B3
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6.10 External Memory Interface A (EMIFA)
The EMIFA can interface to a variety of external devices or ASICs, including:
• Pipelined and flow-through synchronous-burst SRAM (SBSRAM)
• ZBT (zero bus turnaround) SRAM and late write SRAM
• Synchronous FIFOs
• Asynchronous memory, including SRAM, ROM, and Flash
6.10.1 EMIFA Device-Specific Information
Timing analysis must be done to verify all ac timing requirements are met. TI recommends utilizing I/O
buffer information specification (IBIS) to analyze all ac timing.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS
Models for Timing Analysis Application Report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIFA output signal
lines.
A race condition may exist when certain masters write data to the EMIFA. For example, if master A
passes a software message via a buffer in external memory and does not wait for indication that the write
completes, when master B attempts to read the software message, then the master B read may bypass
the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware specification of write-read ordering, it may be necessary to specify data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the EMIFA module ID and revision register.
3. Perform a dummy read to the EMIFA module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
6.10.2 EMIFA Peripheral Register Description(s)
For more information on the EMIF registers shown in Table 6-41, see TMS320DM647/DM648 DSP
External Memory Interface (EMIF) User's Guide (literature number SPRUEK6).
Table 6-41. EMIFA Registers
HEX ADDRESS RANGE
ACRONYM
0x7000 0000
MIDR
Module ID and Revision Register
REGISTER NAME
0x7000 0004
STAT
Status Register
0x7000 0008
-
Reserved
0x7000 000C - 0x7000 001C
-
Reserved
0x7000 0020
BPRIO
0x7000 0024 - 0x7000 004C
-
Burst Priority Register
Reserved
0x7000 0050 - 0x7000 007C
-
Reserved
0x7000 0080
CE2CFG
EMIFA CE2 Configuration Register
0x7000 0084
CE3CFG
EMIFA CE3 Configuration Register
0x7000 0088
-
Reserved
0x7000 008C
-
Reserved
0x7000 0090 - 0x7000 009C
-
Reserved
0x7000 00A0
AWCC
EMIFA Async Wait Cycle Configuration Register
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Table 6-41. EMIFA Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0x7000 00A4 - 0x7000 00BC
-
REGISTER NAME
0x7000 00C0
INTRAW
EMIFA Interrupt RAW Register
0x7000 00C4
INTMSK
EMIFA Interrupt Masked Register
0x7000 00C8
INTMSKSET
EMIFA Interrupt Mask Set Register
EMIFA Interrupt Mask Clear Register
Reserved
0x7000 00CC
INTMSKCLR
0x7000 00D0 - 0x7000 00DC
-
Reserved
0x7000 00E0 - 0x77FF FFFF
-
Reserved
6.10.3 EMIFA Electrical Data/Timing
Table 6-42. Timing Requirements for AECLKIN for EMIFA (1)
(see Figure 6-19)
720, 800, 900, 1100
NO.
(1)
(2)
(3)
(2)
MIN
MAX
16P (4)
UNIT
1
tc(EKI)
Cycle time, AECLKIN
6 (3)
2
tw(EKIH)
Pulse duration, AECLKIN high
2.7
ns
3
tw(EKIL)
Pulse duration, AECLKIN low
2.7
ns
4
tt(EKI)
Transition time, AECLKIN
5
tJ(EKI)
Period Jitter, AECLKIN
ns
2
ns
0.02E (5)
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
E = the EMIF input clock (AECLKIN or SYSCLK4/2) period in ns for EMIFA.
Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times
are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements.
P is P = 1/CPU clock frequency in ns.
This timing applies only when AECLKIN is used for EMIFA.
(4)
(5)
1
5
4
2
AECLKIN
3
4
Figure 6-19. AECLKIN Timing for EMIFA
Table 6-43. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT for the
EMIFA Module (1) (2) (3) (see Figure 6-20)
NO.
(1)
(2)
(3)
112
PARAMETER
720, 800, 900, 1100
MIN
MAX
UNIT
1
tc(EKO)
Cycle time, AECLKOUT
E - 0.7
E + 0.7
ns
2
tw(EKOH)
Pulse duration, AECLKOUT high
EH - 0.7
EH + 0.7
ns
3
tw(EKOL)
Pulse duration, AECLKOUT low
EL - 0.7
EL + 0.7
ns
4
tt(EKO)
Transition time, AECLKOUT
1
ns
5
td(EKIH-EKOH)
Delay time, AECLKIN high to AECLKOUT high
1
8
ns
6
td(EKIL-EKOL)
Delay time, AECLKIN low to AECLKOUT low
1
8
ns
E = the EMIF input clock (AECLKIN or SYSCLK4/2) period in ns for EMIFA.
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
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AECLKIN
5
4
1
2
3
3
AECLKOUT
A.
B.
C.
E = the EMIF input clock (AECLKIN or SYSCLK4/2) period in ns for EMIFA.
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns
for EMIFA.
Figure 6-20. AECLKOUT Timing for the EMIFA Module
6.10.3.1 Asynchronous Memory Timing
Table 6-44. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module (1)
(see Figure 6-21 and Figure 6-22)
720, 800, 900, 1100
NO.
(1)
(2)
(3)
(2) (3)
MIN
MAX
UNIT
3
tsu(EDV-A OEH)
Setup time, AEDx valid before AAOE/ASOE high
6.5
ns
4
th(AOEH-EDV)
Hold time, AEDx valid after AAOE/ASOE high
3
ns
5
tsu(ARDY-EKOH)
Setup time, AARDY valid before AECLKOUT low
1
ns
6
th(EKOH-ARDY)
Hold time, AARDY valid after AECLKOUT low
2
ns
7
tw(ARDY )
Pulse width, AARDY assertion and deassertion
2E + 5
ns
8
td(ARDY-HOLD)
Delay time, from AARDY sampled deasserted on AECLKOUT falling
to beginning of programmed hold period
9
tsu(ARDY-HOLD)
Setup time, before end of programmed strobe period by which
AARDY should be asserted in order to insert extended strobe wait
states.
4E
ns
2E
ns
E = AECLKOUT period in ns for EMIFA
To specify data setup time, simply program the strobe width wide enough.
AARDY is internally synchronized. To use AARDY as an asynchronous input, the pulse width of the AARDY signal should be at least 2E
to specify setup and hold time is met.
Table 6-45. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module (1) (2) (3) (see Figure 6-21 and Figure 6-22)
NO.
(1)
(2)
(3)
PARAMETER
720, 800, 900, 1100
MIN
1
tosu(SELV-AOEL)
Output setup time, select signals valid to AAOE/ASOE low
RS × E - 1.5
2
toh(AOEH-SELIV)
Output hold time, AAOE/ASOE high to select signals invalid
RS × E - 1.9
10
td(EKOH-AOEV)
Delay time, AECLKOUT high to AAOE/ASOE valid
11
tosu(SELV-AWEL)
Output setup time, select signals valid to AAWE/ASWE low
WS × E - 1.7
12
toh(AWEH-SELIV)
Output hold time, AAWE/ASWE high to select signals invalid
WH × E - 1.8
13
td(EKOH-AWEV)
Delay time, AECLKOUT high to AAWE/ASWE valid
1
1.3
MAX
UNIT
ns
ns
7.28
ns
ns
ns
7.1
ns
E = AECLKOUT period in ns for EMIFA
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIFA CE Configuration registers (CEnCFG).
Select signals for EMIFA include: ACEx, ABE[1:0], AEA[23:0], ABA[1:0]; and for EMIFA writes, also include AR/W, AED[15:0].
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Strobe = 4
Setup = 1
Hold = 1
AECLKOUT
2
1
ACEx
1
2
Byte Enables
ABE[1:0]
AEA[23:0]/
ABA[1:0]
2
1
Address
3
4
Read Data
AED[15:0]
10
10
AAOE/ASOE
AAWE/ASWE
AR/W
AARDY
A.
B.
DEASSERTED
AAOE/ASOE and AAWE/ASWE operate as AAOE/ASOE (identified under select signals) and AAWE/ASWE,
respectively, during asynchronous memory accesses.
Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration
register (AWCC).
Figure 6-21. Asynchronous Memory Read Timing for EMIFA
Strobe = 4
Hold = 1
Setup = 1
AECLKOUT
12
11
ACEx
ABE[1:0]
AEA[23:0]/
ABA[1:0]
11
12
Byte Enables
11
12
Address
11
12
Write Data
AED[15:0]
AAOE/ASOE (A)
AAWE/ASWE
13
13
(A)
11
12
AR/W
AARDY (B)
A.
B.
DEASSERTED
AAOE/ASOE and AAWE/ASWE operate as AAOE/ASOE and AAWE/ASWE (identified under select signals) during
asynchronous memory accesses.
Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration
register (AWCC).
Figure 6-22. Asynchronous Memory Write Timing for EMIFA
114
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Strobe
Strobe
Setup = 2
Extended Strobe
Hold = 2
8
9
AECLKOUT
6
5
7
7
ASSERTED
DEASSERTED
AARDY(A)
A. Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration
register (AWCC).
Figure 6-23. AARDY Timing
6.10.3.2 Programmable Synchronous Interface Timing
Table 6-46. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module
(see Figure 6-24)
720, 800, 900, 1100
NO.
MIN
6
tsu(EDV-EKOH)
Setup time, read AEDx valid before AECLKOUT high
7
th(EKOH-EDV)
Hold time, read AEDx valid after AECLKOUT high
MAX
UNIT
2
ns
1.5
ns
Table 6-47. Switching Characteristics Over Recommended Operating Conditions for Programmable
Synchronous Interface Cycles for EMIFA Module (1) (see Figure 6-24-Figure 6-26)
NO.
(1)
PARAMETER
720, 800, 900, 1100
UNIT
MIN
MAX
1.3
4.9
ns
4.9
ns
1
td(EKOH-CEV)
Delay time, AECLKOUT high to ACEx valid
2
td(EKOH-BEV)
Delay time, AECLKOUT high to ABEx valid
3
td(EKOH-BEIV)
Delay time, AECLKOUT high to ABEx invalid
4
td(EKOH-EAV)
Delay time, AECLKOUT high to AEAx valid
5
td(EKOH-EAIV)
Delay time, AECLKOUT high to AEAx invalid
1.3
8
td(EKOH-ADSV)
Delay time, AECLKOUT high to ASADS/ASRE valid
1.3
4.9
ns
9
td(EKOH-OEV)
Delay time, AECLKOUT high to AAOE/ASOE valid
1.3
4.9
ns
10
td(EKOH-EDV)
Delay time, AECLKOUT high to AEDx valid
4.9
ns
11
td(EKOH-EDIV)
Delay time, AECLKOUT high to AEDx invalid
1.3
12
td(EKOH-WEV)
Delay time, AECLKOUT high to AAWE/ASWE valid
1.3
1.3
ns
4.9
ns
ns
ns
4.9
ns
The following parameters are programmable via the EMIFA CE Configuration registers (CEnCFG):
• Read latency (R_LTNCY): 0-, 1-, 2-, or 3-cycle read latency
• Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
• ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CE_EXT = 0). For synchronous FIFO interface with glue, ACEx is active when AAOE/ASOE is active (CE_EXT = 1).
• Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE has deselect cycles
(R_ENABLE = 0). For FIFO interface, ASADS/ASRE has NO deselect cycles (R_ENABLE = 1).
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READ latency = 2
AECLKOUT
1
1
ACEx
2
BE1
ABE[7:0]
3
BE2
BE3
BE4
4
AEA[19:0]/ABA[1:0]
EA1
5
EA3
EA2
EA4
6
AED[63:0]
7
Q1
Q2
Q3
Q4
8
8
ASADS/ASRE (B)
9
9
AAOE /ASOE (B)
AAWE/ASWE(B)
Figure 6-24. Programmable Synchronous Interface Read Timing for EMIFA (With Read Latency = 2)
NOTE
This information applies to Figure 6-25 and Figure 6-26.
The following parameters are programmable via the EMIF Chip Select n Configuration
Register (CESECn):
• Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
• Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
• ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx
goes inactive after the final command has been issued (CE_EXT = 0). For synchronous
FIFO interface, ACEx is active when AAOE/ASOE is active (CE_EXT = 1).
• Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface,
ASADS/ASRE has deselect cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE
has NO deselect cycles (R_ENABLE = 1).
AECLKOUT
1
1
ACEx
ABE[1:0]
2
BE1
AEA[23:0]/ABA[1:0]
4
EA1
EA2
EA3
EA4
10
Q1
Q2
Q3
Q4
10
AED[15:0]
3
BE2
BE3
BE4
5
11
8
8
ASADS/ASRE
AAOE/ASOE
12
12
AAWE/ASWE
A.
In this figure, W_LTNCY = 0, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
Figure 6-25. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 0)
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Write
Latency = 1
AECLKOUT
1
1
ACEx
ABE[1:0]
2
BE1
AEA[23:0]/ABA[1:0]
4
EA1
10
AED[15:0]
3
BE2
BE3
BE4
5
EA2
10
EA3
EA4
Q1
Q2
Q3
11
Q4
8
8
ASADS/ASRE
AAOE/ASOE
12
12
AAWE/ASWE
Figure 6-26. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 1)
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6.11 Video Port
Each video port is capable of sending and receiving digital video data. The video ports are also capable of
capturing/displaying RAW data. The video port peripherals follow video standards such as BT.656 and
SMPTE296.
6.11.1 Video Port Device-Specific Information
The devices have five video port peripherals.
The video port peripheral can operate as a video capture port, video display port, or as a transport
channel interface (TCI) capture port.
The port consists of two channels: A and B. A 5120-byte capture/display buffer is splittable between the
two channels. The entire port (both channels) is always configured for either video capture or display only.
Separate data pipelines control the parsing and formatting of video capture or display data for each of the
BT.656, Y/C, raw video, and TCI modes.
For video capture operation, the video port may operate as two 8-bit channels of BT.656 or raw video
capture; or as a single channel of 8-bit BT.656, 8-bit raw video, 8-bit Y/C video, 16-bit raw video, or 8-bit
TCI.
For video display operation, the video port may operate as a single channel of 8-bit BT.656; or as a single
channel of 8-bit BT.656, 8-bit raw video, 8-bit Y/C video, or 16-bit raw video. It may also operate in a two
channel 8-bit raw mode in which the two channels are locked to the same timing. Channel B is not used
during single channel operation.
For more detailed information on the video port peripherals, see the TMS320DM647/DM648 Video Port
User's Guide (literature number SPRUEM1).
6.11.2 Video Port Peripheral Register Description(s)
Table 6-48. Video Port 0, 1, 2, 3, and 4 (VP0, VP1, VP2, VP3, and VP4) Control Registers
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP0
VP1
VP2
VP3
VP4
0x02C0 0000
0x02C0 4000
0x02C0 8000
0x02C0 C000
0x02C1 0000
VPPID
0x02C0 0004
0x02C0 4004
0x02C0 8004
0x02C0 C004
0x02C1 0004
PCR
0x02C0 0008
0x02C0 4008
0x02C0 8008
0x02C0 C008
0x02C1 0008
-
Reserved
0x02C0 000C
0x02C0 400C
0x02C0 800C
0x02C0 C00C
0x02C1 000C
-
Reserved
0x02C0 0020
0x02C0 4020
0x02C0 8020
0x02C0 C020
0x02C1 0020
PFUNC
Video Port Pin Function Register
0x02C0 0024
0x02C0 4024
0x02C0 8024
0x02C0 C024
0x02C1 0024
PDIR
Video Port Pin Direction Register
0x02C0 0028
0x02C0 4028
0x02C0 8028
0x02C0 C028
0x02C1 0028
PDIN
Video Port Pin Data Input Register
0x02C0 002C
0x02C0 402C
0x02C0 802C
0x02C0 C02C
0x02C1 002C
PDOUT
Video Port Pin Data Output Register
0x02C0 0030
0x02C0 4030
0x02C0 8030
0x02C0 C030
0x02C1 0030
PDSET
Video Port Pin Data Set Register
0x02C0 0034
0x02C0 4034
0x02C0 8034
0x02C0 C034
0x02C1 0034
PDCLR
Video Port Pin Data Clear Register
0x02C0 0038
0x02C0 4038
0x02C0 8038
0x02C0 C038
0x02C1 0038
PIEN
Video Port Pin Interrupt Enable Register
0x02C0 003C
0x02C0 403C
0x02C0 803C
0x02C0 C03C
0x02C1 003C
PIPOL
Video Port Pin Interrupt Polarity Register
0x02C0 0040
0x02C0 4040
0x02C0 8040
0x02C0 C040
0x02C1 0040
PISTAT
Video Port Pin Interrupt Status Register
0x02C0 0044
0x02C0 4044
0x02C0 8044
0x02C0 C044
0x02C1 0044
PICLR
Video Port Pin Interrupt Clear Register
0x02C0 00C0
0x02C0 40C0
0x02C0 80C0
0x02C0 C0C0
0x02C1 00C0
VPCTL
Video Port Control Register
0x02C0 00C4
0x02C0 40C4
0x02C0 80C4
0x02C0 C0C4
0x02C1 00C4
VPSTAT
Video Port Status Register
0x02C0 00C8
0x02C0 40C8
0x02C0 80C8
0x02C0 C0C8
0x02C1 00C8
VPIE
Video Port Interrupt Enable Register
0x02C0 00CC
0x02C0 40CC
0x02C0 80CC
0x02C0 C0CC
0x02C1 00CC
VPIS
Video Port interrupt Status Register
0x02C0 0100
0x02C0 4100
0x02C0 8100
0x02C0 C100
0x02C1 0100
VCASTAT
0x02C0 0104
0x02C0 4104
0x02C0 8104
0x02C0 C104
0x02C1 0104
VCACTL
118
Video Port Peripheral Identification
Register
Video Port Peripheral Control Register
Video Capture Channel A Status Register
Video Capture Channel A Control
Register
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Table 6-48. Video Port 0, 1, 2, 3, and 4 (VP0, VP1, VP2, VP3, and VP4) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP0
VP1
VP2
VP3
VP4
0x02C0 0108
0x02C0 4108
0x02C0 8108
0x02C0 C108
0x02C1 0108
VCASTRT1
Video Capture Channel A Field 1 Start
Register
0x02C0 010C
0x02C0 410C
0x02C0 810C
0x02C0 C10C
0x02C1 010C
VCASTOP1
Video Capture Channel A Field 1 Stop
Register
0x02C0 0110
0x02C0 4110
0x02C0 8110
0x02C0 C110
0x02C1 0110
VCASTRT2
Video Capture Channel A Field 2 Start
Register
0x02C0 0114
0x02C0 4114
0x02C0 8114
0x02C0 C114
0x02C1 0114
VCASTOP2
Video Capture Channel A Field 2 Stop
Register
0x02C0 0118
0x02C0 4118
0x02C0 8118
0x02C0 C118
0x02C1 0118
VCAVINT
0x02C0 011C
0x02C0 411C
0x02C0 811C
0x02C0 C11C
0x02C1 011C
VCATHRLD
Video Capture Channel A Threshold
Register
0x02C0 0120
0x02C0 4120
0x02C0 8120
0x02C0 C120
0x02C1 0120
VCAEVTCT
Video Capture Channel A Event Count
Register
0x02C0 0140
0x02C0 4140
0x02C0 8140
0x02C0 C140
0x02C1 0140
VCBSTAT
0x02C0 0144
0x02C0 4144
0x02C0 8144
0x02C0 C144
0x02C1 0144
VCBCTL
0x02C0 0148
0x02C0 4148
0x02C0 8148
0x02C0 C148
0x02C1 0148
VCBSTRT1
Video Capture Channel B Field 1 Start
Register
0x02C0 014C
0x02C0 414C
0x02C0 814C
0x02C0 C14C
0x02C1 014C
VCBSTOP1
Video Capture Channel B Field 1 Stop
Register
0x02C0 0150
0x02C0 4150
0x02C0 8150
0x02C0 C150
0x02C1 0150
VCBSTRT2
Video Capture Channel B Field 2 Start
Register
0x02C0 0154
0x02C0 4154
0x02C0 8154
0x02C0 C154
0x02C1 0154
VCBSTOP2
Video Capture Channel B Field 2 Stop
Register
0x02C0 0158
0x02C0 4158
0x02C0 8158
0x02C0 C158
0x02C1 0158
VCBVINT
0x02C0 015C
0x02C0 415C
0x02C0 815C
0x02C0 C15C
0x02C1 015C
VCBTHRLD
Video Capture Channel B Threshold
Register
0x02C0 0160
0x02C0 4160
0x02C0 8160
0x02C0 C160
0x02C1 0160
VCBEVTCT
Video Capture Channel B Event Count
Register
0x02C0 0180
0x02C0 4180
0x02C0 8180
0x02C0 C180
0x02C1 0180
TCICTL
0x02C0 0184
0x02C0 4184
0x02C0 8184
0x02C0 C184
0x02C1 0184
TCICLKINITL
TCI Clock Initialization LSB Register
0x02C0 0188
0x02C0 4188
0x02C0 8188
0x02C0 C188
0x02C1 0188
TCICLKINITM
TCI Clock Initialization MSB Register
0x02C0 018C
0x02C0 418C
0x02C0 818C
0x02C0 C18C
0x02C1 018C
TCISTCLKL
TCI System Time Clock LSB Register
0x02C0 0190
0x02C0 4190
0x02C0 8190
0x02C0 C190
0x02C1 0190
TCISTCLKM
TCI System Time Clock MSB Register
0x02C0 0194
0x02C0 4194
0x02C0 8194
0x02C0 C194
0x02C1 0194
TCISTCMPL
TCI System Time Clock Compare LSB
Register
0x02C0 0198
0x02C0 4198
0x02C0 8198
0x02C0 C198
0x02C1 0198
TCISTCMPM
TCI System Time Clock Compare MSB
Register
0x02C0 019C
0x02C0 419C
0x02C0 819C
0x02C0 C19C
0x02C1 019C
TCISTMSKL
TCI System Time Clock Compare Mask
LSB Register
0x02C0 01A0
0x02C0 41A0
0x02C0 81A0
0x02C0 C1A0
0x02C1 01A0
TCISTMSKM
TCI System Time Clock Compare Mask
MSB Register
0x02C0 01A4
0x02C0 41A4
0x02C0 81A4
0x02C0 C1A4
0x02C1 01A4
TCITICKS
TCI System Time Clock Ticks Interrupt
Register
0x02C0 0200
0x02C0 4200
0x02C0 8200
0x02C0 C200
0x02C1 0200
VDSTAT
Video Display Status Register
0x02C0 0204
0x02C0 4204
0x02C0 8204
0x02C0 C204
0x02C1 0204
VDCTL
Video Display Control Register
0x02C0 0208
0x02C0 4208
0x02C0 8208
0x02C0 C208
0x02C1 0208
VDFRMSZ
Video Display Frame Size Register
0x02C0 020C
0x02C0 420C
0x02C0 820C
0x02C0 C20C
0x02C1 020C
VDHBLNK
Video Display Horizontal Blanking
Register
0x02C0 0210
0x02C0 4210
0x02C0 8210
0x02C0 C210
0x02C1 0210
VDVBLKS1
Video Display Field 1 Vertical Blanking
Start Register
0x02C0 0214
0x02C0 4214
0x02C0 8214
0x02C0 C214
0x02C1 0214
VDVBLKE1
Video Display Field 1 Vertical Blanking
End Register
0x02C0 0218
0x02C0 4218
0x02C0 8218
0x02C0 C218
0x02C1 0218
VDVBLKS2
Video Display Field 2 Vertical Blanking
Start Register
0x02C0 021C
0x02C0 421C
0x02C0 821C
0x02C0 C21C
0x02C1 021C
VDVBLKE2
Video Display Field 2 Vertical Blanking
End Register
Video Capture Channel A Vertical
Interrupt Register
Video Capture Channel B Status Register
Video Capture Channel B Control
Register
Video Capture Channel B Vertical
Interrupt Register
TCI Capture Control Register
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Table 6-48. Video Port 0, 1, 2, 3, and 4 (VP0, VP1, VP2, VP3, and VP4) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
VP0
VP1
VP2
VP3
VP4
0x02C0 0220
0x02C0 4220
0x02C0 8220
0x02C0 C220
0x02C1 0220
VDIMGOFF1
0x02C0 0224
0x02C0 4224
0x02C0 8224
0x02C0 C224
0x02C1 0224
VDIMGSZ1
0x02C0 0228
0x02C0 4228
0x02C0 8228
0x02C0 C228
0x02C1 0228
VDIMGOFF2
0x02C0 022C
0x02C0 422C
0x02C0 822C
0x02C0 C22C
0x02C1 022C
VDIMGSZ2
0x02C0 0230
0x02C0 4230
0x02C0 8230
0x02C0 C230
0x02C1 0230
VDFLDT1
Video Display Field 1 Timing Register
0x02C0 0234
0x02C0 4234
0x02C0 8234
0x02C0 C234
0x02C1 0234
VDFLDT2
Video Display Field 2 Timing Register
0x02C0 0238
0x02C0 4238
0x02C0 8238
0x02C0 C238
0x02C1 0238
VDTHRLD
Video Display Threshold Register
0x02C0 023C
0x02C0 423C
0x02C0 823C
0x02C0 C23C
0x02C1 023C
VDHSYNC
Video Display Horizontal Synchronization
Register
0x02C0 0240
0x02C0 4240
0x02C0 8240
0x02C0 C240
0x02C1 0240
VDVSYNS1
Video Display Field 1 Vertical
Synchronization Start Register
0x02C0 0244
0x02C0 4244
0x02C0 8244
0x02C0 C244
0x02C1 0244
VDVSYNE1
Video Display Field 1 Vertical
Synchronization End Register
0x02C0 0248
0x02C0 4248
0x02C0 8248
0x02C0 C248
0x02C1 0248
VDVSYNS2
Video Display Field 2 Vertical
Synchronization Start Register
0x02C0 024C
0x02C0 424C
0x02C0 824C
0x02C0 C24C
0x02C1 024C
VDVSYNE2
Video Display Field 2 Vertical
Synchronization End Register
0x02C0 0250
0x02C0 4250
0x02C0 8250
0x02C0 C250
0x02C1 0250
VDRELOAD
Video Display Counter Reload Register
0x02C0 0254
0x02C0 4254
0x02C0 8254
0x02C0 C254
0x02C1 0254
VDDISPEVT
Video Display Event Register
0x02C0 0258
0x02C0 4258
0x02C0 8258
0x02C0 C258
0x02C1 0258
VDCLIP
0x02C0 025C
0x02C0 425C
0x02C0 825C
0x02C0 C25C
0x02C1 025C
VDDEFVAL
0x02C0 0260
0x02C0 4260
0x02C0 8260
0x02C0 C260
0x02C1 0260
VDVINT
Video Display Vertical Interrupt Register
0x02C0 0264
0x02C0 4264
0x02C0 8264
0x02C0 C264
0x02C1 0264
VDFBIT
Video Display Field Bit Register
0x02C0 0268
0x02C0 4268
0x02C0 8268
0x02C0 C268
0x02C1 0268
VDVBIT1
Video Display Field 1Vertical Blanking Bit
Register
0x02C0 026C
0x02C0 426C
0x02C0 826C
0x02C0 C26C
0x02C1 026C
VDVBIT2
Video Display Field 2Vertical Blanking Bit
Register
0x5000 0000
0x5400 0000
0x5800 0000
0x6000 0000
0x6400 0000
YSRCA
0x5000 0020
0x5400 0020
0x5800 0020
0x6000 0020
0x6400 0020
CBSRCA
CB FIFO Source Register A
0x5000 0040
0x5400 0040
0x5800 0040
0x6000 0040
0x6400 0040
CRSRCA
CR FIFO Source Register A
0x5000 0080
0x5400 0080
0x5800 0080
0x6000 0080
0x6400 0080
YDSTA
Y FIFO Destination Register A
0x5000 00A0
0x5400 00A0
0x5800 00A0
0x6000 00A0
0x6400 00A0
CBDST
CB FIFO Destination Register
0x5000 00C0
0x5400 00C0
0x5800 00C0
0x6000 00C0
0x6400 00C0
CRDST
CR FIFO Destination Register
0x5200 0000
0x5600 0000
0x5A00 0000
0x6200 0000
0x6600 0000
YSRCB
Y FIFO Source Register B
0x5200 0020
0x5600 0020
0x5A00 0020
0x6200 0020
0x6600 0020
CBSRCB
CB FIFO Source Register B
0x5200 0040
0x5600 0040
0x5A00 0040
0x6200 0040
0x6600 0040
CRSRCB
CR FIFO Source Register B
0x5200 0080
0x5600 0080
0x5A00 0080
0x6200 0080
0x6600 0080
YDSTB
120
Video Display Field 1 Image Offset
Register
Video Display Field 1 Image Size
Register
Video Display Field 2 Image Offset
Register
Video Display Field 2 Image Size
Register
Video Display Clipping Register
Video Display Default Display Value
Register
Y FIFO Source Register A
Y FIFO Destination Register B
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6.11.3 Video Port (VP0, VP1, VP2, VP3, VP4) Electrical Data/Timing
6.11.3.1 VCLKIN Timing (Video Capture Mode)
Table 6-49. Timing Requirements for Video Capture Mode for VPxCLKINx (1)
(see Figure 6-27)
-720
-800
-900
-1100
NO.
MIN
(1)
1
tc(VKI)
Cycle time, VPxCLKINx
2
tw(VKIH)
3
4
UNIT
MAX
9.259
ns
Pulse duration, VPxCLKINx high
5.4
ns
tw(VKIL)
Pulse duration, VPxCLKINx low
5.4
tt(VKI)
Transition time, VPxCLKINx
ns
3
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
VPxCLKINx
4
Figure 6-27. Video Port Capture VPxCLKINx TIming
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6.11.3.2 Video Data and Control Timing (Video Capture Mode)
Table 6-50. Timing Requirements in Video Capture Mode for Video Data and Control Inputs
(see Figure 6-28)
-720
-800
-900
-1100
NO.
MIN
UNIT
MAX
1
tsu(VDATV-VKIH)
Setup time, VPxDx valid before VPxCLKINx high
2.4
ns
2
th(VDATV-VKIH)
Hold time, VPxDx valid after VPxCLKINx high
0.5
ns
3
tsu(VCTLV-VKIH)
Setup time, VPxCTLx valid before VPxCLKINx high
2.4
ns
4
th(VCTLV-VKIH)
Hold time, VPxCTLx valid after VPxCLKINx high
0.5
ns
VPxCLKINx
1
2
VPxD[19:0] (Input)
3
4
VPxCTLx (Input)
Figure 6-28. Video Port Capture Data and Control Input Timing
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6.11.3.3 VCLKIN Timing (Video Display Mode)
Table 6-51. Timing Requirements for Video Display Mode for VPxCLKINx (1) (see Figure 6-29)
-720
-800
-900
-1100
NO.
MIN
UNIT
MAX
1
tc(VKI)
Cycle time, VPxCLKINx
9
ns
2
tw(VKIH)
Pulse duration, VPxCLKINx high
4.1
ns
3
tw(VKIL)
Pulse duration, VPxCLKINx low
4.1
ns
tt(VKI)
Transition time, VPxCLKINx
4
(1)
3
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
VPxCLKINx
4
Figure 6-29. Video Port Display VPxCLKINx Timing
6.11.3.4 Video Control Input/Output and Video Display Data Output Timing With Respect to VPxCLKINx
and VPxCLKOUTx (Video Display Mode)
Table 6-52. Timing Requirements in Video Display Mode for Video Control Input Shown With Respect to
VPxCLKINx and VPxCLKOUTx (see Figure 6-30)
-720
-800
-900
-1100
NO.
MIN
UNIT
MAX
13
tsu(VCTLV-VKIH)
Setup time, VPxCTLx valid before VPxCLKINx high
2.4
ns
14
th(VCTLV-VKIH)
Hold time, VPxCTLx valid after VPxCLKINx high
0.5
ns
15
tsu(VCTLV-VKOH)
Setup time, VPxCTLx valid before VPxCLKOUTx high (1)
7.4
ns
16
th(VCTLV-VKOH)
Hold time, VPxCTLx valid after VPxCLKOUTx high (1)
-0.9
ns
(1)
Assuming non-inverted VPxCLKOUTx signal.
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Table 6-53. Switching Characteristics Over Recommended Operating Conditions in Video Display Mode
for Video Data and Control Output Shown With Respect to VPxCLKINx and VPxCLKOUTx (1) (2)
(see Figure 6-30)
NO.
-720
-800
-900
-1100
PARAMETER
UNIT
MIN
MAX
V - 0.7
V + 0.7
ns
Pulse duration, VPxCLKOUTx high
VH - 0.7
VH + 0.7
ns
Pulse duration, VPxCLKOUTx low
VL - 0.7
VL + 0.7
ns
1.8
ns
5
ns
1
tc(VKO)
Cycle time, VPxCLKOUTx
2
tw(VKOH)
3
tw(VKOL)
4
tt(VKO)
Transition time, VPxCLKOUTx
5
td(VKIH-VKOH)
Delay time, VPxCLKINx high to VPxCLKOUTx high (3)
(3)
6
td(VKIL-VKOL)
Delay time, VPxCLKINx low to VPxCLKOUTx low
5
ns
7
td(VKIH-VKOL)
Delay time, VPxCLKINx high to VPxCLKOUTx low
5
ns
8
td(VKIL-VKOH)
Delay time, VPxCLKINx low to VPxCLKOUTx high
5
ns
7
ns
(4)
9
td(VKIH-VPOUTV)
Delay time, VPxCLKINx high to VPxOUT valid
10
td(VKIH-VPOUTIV)
Delay time, VPxCLKINx high to VPxOUT invalid (4)
11
td(VKOH-VPOUTV)
Delay time, VPxCLKOUTx high to VPxOUT valid (1)
12
(1)
(2)
(3)
(4)
td(VKOH-VPOUTIV)
Delay time, VPxCLKOUTx high to VPxOUT invalid
1.7
(4)
ns
4.7
(1) (4)
0.7
ns
ns
V = the video input clock (VPxCLKINx) period in ns.
VH is the high period of V (video input clock period) in ns and VL is the low period of V (video input clock period) in ns.
Assuming non-inverted VPxCLKOUTx signal.
VPxOUT consists of VPxCTLx and VPxD[19:0]
VPxCLKINx
5
2
1
4
4
7
8
VPxCLKOUTx
(Inverted)
[VCLK2P = 1]
12
11
VPxCTLx,V
PxD[19:0]
(Outputs)
6
3
VPxCLKOUTx
[VCLK2P = 0]
10
9
15
16
14
13
VPxCTLx
(Input)
Figure 6-30. Video Port Display Data Output Timing and Control Input/Output Timing With Respect to
VPxCLKINx and VPxCLKOUTx
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6.11.3.5
Video Dual-Display Sync Mode Timing (With Respect to VPxCLKINx)
Table 6-54. Timing Requirements for Dual-Display Sync Mode for VPxCLKINx (see Figure 6-31)
-720-800-900
-1100
NO.
MIN
1
tskr(VKI)
Skew rate, VPxCLKINx before VPyCLKINy
UNIT
MAX
±500
ps
VPxCLKINx
1
VPyCLKINy
Figure 6-31. Video Port Dual-Display Sync Timing
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6.12 VCXO Interpolated Control (VIC)
The VIC can be used in conjunction with the video ports (VPs) to maintain synchronization of a video
stream. The VIC can also be used to control a VCXO to adjust the pixel clock rate to a video port.
6.12.1 VIC Device-Specific Information
The VCXO interpolated control (VIC) port provides digital-to-analog conversation with resolution from
9-bits to up to 16-bits. The output of the VIC is a single bit interpolated D/A output (VDAC pin).
Typical D/A converters provide a discrete output level for every value of the digital word that is being
converted. This is a problem for digital words that are long. This is avoided in a Sigma Delta type D/A
converter by choosing a few widely spaced output levels and interpolating values between them. The
interpolating mechanism causes the output to oscillate rapidly between the levels in such a manner that
the average output represents the value of input code.
In the VIC, two output levels are chosen (0 and 1), and Sigma Delta interpolation scheme is implemented
to interpolate between these levels with a rapidly changing signal. The frequency of interpolation is
dependent on the resolution needed.
When the video port is used in transport channel interface (TCI) mode, the VIC port is used to control the
system clock, VCXO, for MPEG transport stream.
The VIC supports the following features:
• Single interpolation for D/A conversion
• Programmable precision from 9-to-16 bits
• Interface for register accesses
For more detailed information on the VCXO interpolated control (VIC) peripheral, see the
TMS320DM647/DM648 Video Port User's Guide (literature number SPRUEM1).
6.12.2 VIC Peripheral Register Description(s)
Table 6-55. VCXO Interpolated Control (VIC) Port Registers
126
HEX ADDRESS RANGE
ACRONYM
0x0204 7400
VICCTL
REGISTER NAME
VIC control register
0x0204 7404
VICIN
VIC input register
0x0204 7408
VPDIV
VIC clock divider register
0x0204 740C - 0x0204 77FF
-
Reserved
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6.12.3 VIC Electrical Data/Timing
6.12.3.1 STCLK Timing
Table 6-56. Timing Requirements for STCLK (1) (see Figure 6-32)
-720
-800
-900
-1100
NO.
UNIT
MIN MAX
1
tc(STCLK)
Cycle time, STCLK
2
tw(STCLKH)
3
tw(STCLKL)
4
tt(STCLK)
Transition time, STCLK
(1)
33.3
ns
Pulse duration, STCLK high
16
ns
Pulse duration, STCLK low
16
ns
3
ns
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
4
1
2
3
STCLK
4
Figure 6-32. STCLK Timing
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6.13 Universal Asynchronous Receiver/Transmitter (UART)
The device has a UART peripheral. The UART has the following features:
• 16-byte storage space for both the transmitter and receiver FIFOs
• 1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA
• DMA signaling capability for both received and transmitted data
• Programmable auto-rts and auto-cts for autoflow control
• Frequency pre-scale values from 1 to 65, 535 to generate appropriate baud rates
• Prioritized interrupts
• Programmable serial data formats
– 5, 6, 7, or 8-bit characters
– Even, odd, or no parity bit generation and detection
– 1, 1.5, or 2 stop bit generation
• False start bit detection
• Line break generation and detection
• Internal diagnostic capabilities
– Loopback controls for communications link fault isolation
– Break, parity, overrun, and framing error simulation
• Modem control functions (CTS, RTS).
The UART registers are listed in Table 6-57 .
6.13.1 UART Peripheral Register Description(s)
Table 6-57. UART Register Descriptions
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0x0204 7000
RBR
UART Receiver Buffer Register (Read Only)
0x0204 7000
THR
UART Transmitter Holding Register (Write Only)
0x0204 7004
IER
UART Interrupt Enable Register
0x0204 7008
IIR
UART Interrupt Identification Register (Read Only)
0x0204 7008
FCR
UART FIFO Control Register (Write Only)
0x0204 700C
LCR
UART Line Control Register
0x0204 7010
MCR
UART Modem Control Register
0x0204 7014
LSR
UART Line Status Register
0x0204 7018
-
Reserved
0x0204 701C
-
Reserved
0x0204 7020
DLL
UART Divisor Latch (LSB)
0x0204 7024
DLH
UART Divisor Latch (MSB)
0x0204 7028
PID
Peripheral Identification Register
0x0204 702C
Reserved
0x0204 7030
PWREMU_MGMT
UART Power and Emulation Management Register
0x0204 7034
MDR
Mode Definition Register
0x0204 7038 - 0x0204 73FF
-
Reserved
128
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6.13.2 UART Electrical Data/Timing
Table 6-58. Timing Requirements for UARTx Receive (1) (see Figure 6-33)
720, 800, 900, 1100
NO.
(1)
MIN
MAX
UNIT
4
tw(URXDB)
Pulse duration, receive data bit (RXDn) [15/30/100 pF]
0.96U
1.05U
ns
5
tw(URXSB)
Pulse duration, receive start bit [15/30/100 pF]
0.96U
1.05U
ns
U = UART baud time = 1/programmed baud rate.
Table 6-59. Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (1)
(see Figure 6-33)
NO.
(1)
720, 800, 900, 1100
PARAMETER
MIN
UNIT
MAX
1
f(baud)
Maximum programmable baud rate
2
tw(UTXDB)
Pulse duration, transmit data bit (TXDn) [15/30/100 pF]
U-2
U+2
5
MHz
ns
3
tw(UTXSB)
Pulse duration, transmit start bit [15/30/100 pF]
U-2
U+2
ns
U = UART baud time = 1/programmed baud rate.
3
2
Start
Bit
UART_TXDn
Data Bits
5
4
Start
Bit
UART_RXDn
Data Bits
Figure 6-33. UART Transmit/Receive Timing
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6.14 Serial Peripheral Interface Port (SPI)
6.14.1 SPI Device-Specific Information
Figure 6-34 is a block diagram of the SPI module, which is a simple shift register and buffer plus control
logic. Data is written to the shift register before transmission occurs and is read from the buffer at the end
of transmission. The SPI can operate only as a master, in which case, it initiates a transfer and drives the
SPICLK pin. Four clock phase and polarity options are supported as well as many data formatting options.
SPIDO
SPIDI
Peripheral
Configuration Bus
Interrupt and
DMA Requests
16-Bit Shift Register
16-Bit Buffer
16-Bit Emulation Buffer
State
GPIO
Machine
Control
Clock
(all pins)
Control
SPICSx
SPICLK
Figure 6-34. Block Diagram of SPI Module
The SPI supports 3- and 4-pin operation with three basic pins (SPICLK, SPIDO, and SPIDI) and two
optional pins (SPICSx).
The optional SPICSx (Slave Chip Select) pin is most useful to enable in master mode when there are
more than one slave devices on the same SPI port. The device only shifts data and drives the SPIDI pin
when SPICSx is held low.
Optional − Slave Chip Select
SPICSx
SPICSx
SPICLK
SPICLK
SPIDI
SPIDO
SPIDO
SPIDI
MASTER SPI
SLAVE SPI
Figure 6-35. Illustration of SPI Master-to-SPI Slave Connection
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6.14.2 SPI Peripheral Register Descriptions
Table 6-60 is a list of the SPI registers.
Table 6-60. SPI Configuration Registers
SPI0
BYTE ADDRESS
REGISTER NAME
DESCRIPTION
0x0204 7800
SPIGCR0
Global Control Register 0
0x0204 7804
SPIGCR1
Global Control Register 1
0x0204 7808
SPIINT0
Interrupt Register
0x0204 780C
SPILVL
Interrupt Level Register
0x0204 7810
SPIFLG
Flag Register
0x0204 7814
SPIPC0
Pin Control Register 0 (Pin Function)
0x0204 7818
SPIPC1
Pin Control Register 1 (Pin Direction)
0x0204 781C
SPIPC2
Pin Control Register 2 (Pin Data In)
0x0204 783C
SPIDAT1
Shift Register 1 (with format select)
0x0204 7840
SPIBUF
Buffer Register
0x0204 7844
SPIEMU
Emulation Register
0x0204 7848
SPIDELAY
Delay Register
0x0204 784C
SPIDEF
Default Chip Select Register
0x0204 7850
SPIFMT0
Format Register 0
0x0204 7854
SPIFMT1
Format Register 1
0x0204 7858
SPIFMT2
Format Register 2
0x0204 785C
SPIFMT3
Format Register 3
0x0204 7860
TGINTVECT0
Interrupt Vector for SPI INT0
0x0204 7864
TGINTVECT1
Interrupt Vector for SPI INT1
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6.14.3 SPI Electrical Data/Timing
6.14.3.1 Serial Peripheral Interface (SPI) Timing
Table 6-61 assumes testing over recommended operating conditions (see Figure 6-36).
Table 6-61. General Timing Requirements for SPIx Master Modes (1)
NO.
MIN
greater of 8P or
100 ns
MAX UNIT
1
tc(SPC)M
Cycle Time, SPICLK, All Master Modes
2
tw(SPCH)M
Pulse Width High, SPICLK, All Master Modes
greater of 4P or 45 ns
ns
3
tw(SPCL)M
Pulse Width Low, SPICLK, All Master Modes
greater of 4P or 45 ns
ns
4
5
6
7
8
(1)
(2)
(3)
132
td(SIMO_SPC)M
td(SPC_SIMO)M
toh(SPC_SIMO)M
tsu(SOMI_SPC)M
tih(SPC_SOMI)M
Delay, initial data bit valid
on SPIDO to initial edge on
SPICLK (2)
Delay, subsequent bits
valid on SPIDO after
transmit edge of SPICLK
Output hold time, SPIDO
valid after
receive edge of SPICLK,
except for final bit (3)
Input Setup Time, SPIDI
valid before
receive edge of SPICLK
Input Hold Time, SPIDI
valid after
receive edge of SPICLK
Polarity = 0, Phase = 0,
to SPICLK rising
4P
Polarity = 0, Phase = 1,
to SPICLK rising
0.5tc(SPC)M + 4P
Polarity = 1, Phase = 0,
to SPICLK falling
4P
Polarity = 1, Phase = 1,
to SPICLK falling
0.5tc(SPC)M + 4P
256P
ns
ns
Polarity = 0, Phase = 0,
from SPICLK rising
15
Polarity = 0, Phase = 1,
from SPICLK falling
15
Polarity = 1, Phase = 0,
from SPICLK falling
15
Polarity = 1, Phase = 1,
from SPICLK rising
15
ns
Polarity = 0, Phase = 0,
from SPICLK falling
0.5tc(SPC)M - 10
Polarity = 0, Phase = 1,
from SPICLK rising
0.5tc(SPC)M - 10
Polarity = 1, Phase = 0,
from SPICLK rising
0.5tc(SPC)M - 10
Polarity = 1, Phase = 1,
from SPICLK falling
0.5tc(SPC)M - 10
Polarity = 0, Phase = 0,
to SPICLK falling
0.5P + 15
Polarity = 0, Phase = 1,
to SPICLK rising
0.5P + 15
Polarity = 1, Phase = 0,
to SPICLK rising
0.5P + 15
Polarity = 1, Phase = 1,
to SPICLK falling
0.5P + 15
Polarity = 0, Phase = 0,
from SPICLK falling
0.5P + 5
Polarity = 0, Phase = 1,
from SPICLK rising
0.5P + 5
Polarity = 1, Phase = 0,
from SPICLK rising
0.5P + 5
Polarity = 1, Phase = 1,
from SPICLK falling
0.5P + 5
ns
ns
ns
P = SYSCLK3 period
First bit may be MSB or LSB depending upon SPI configuration. MO(0) refers to first bit and MO(n) refers to last bit output on SPIDO.
MI(0) refers to the first bit input and MI(n) refers to the last bit input on SPIDI.
The final data bit will be held on the SPIDO pin until the SPIDAT1 register is written with new data.
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1
2
Master Mode
Polarity = 0 Phase = 0
3
SPICLK
5
4
SPIDO
MO(0)
7
SPIDI
6
MO(1)
MO(n−1)
MO(n)
MI(n−1)
MI(n)
8
MI(0)
MI(1)
Master Mode
Polarity = 0 Phase = 1
4
SPICLK
6
5
SPIDO
MO(0)
7
SPIDI
MO(1)
MO(n−1)
MI(1)
MI(n−1)
MO(n)
8
MI(0)
4
MI(n)
Master Mode
Polarity = 1 Phase = 0
SPICLK
5
SPIDO
6
MO(0)
7
SPIDI
MO(1)
MO(n−1)
MO(n)
8
MI(0)
MI(1)
MI(n−1)
MI(n)
Master Mode
Polarity = 1 Phase = 1
SPICLK
5
4
SPIDO
MO(0)
7
SPIDI
MI(0)
6
MO(1)
MO(n−1)
MI(1)
MI(n−1)
MO(n)
8
MI(n)
Figure 6-36. SPI Timings—Master Mode
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6.15 Inter-Integrated Circuit (I2C)
The inter-integrated circuit (I2C) module provides an interface between the DM647/DM648 device and
other devices compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1.
External components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the
DSP through the I2C module. The I2C port does not support CBUS-compatible devices.
The I2C port supports:
• Compatible with Philips I2C Specification Revision 2.1 (January 2000)
• Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise Filter to Remove Noise 50 ns or less
• Seven- and Ten-Bit Device Addressing Modes
• Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
• Events: DMA, Interrupt, or Polling
• Slew-Rate Limited Open-Drain Output Buffers
I2C Module
Clock
Prescale
Peripheral Clock
(DSP/6)
I2CPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
I2C Clock
I2COAR
Own
Address
I2CSAR
Slave
Address
I2CMDR
Mode
I2CCNT
Data
Count
I2CCLKH
I2CCLKL
Transmit
I2CXSR
Transmit
Shift
I2CDXR
Transmit
Buffer
I2CEMDR
Extended
Mode
SDA
I2C Data
Interrupt/DMA
Noise
Filter
Receive
I2CDRR
Receive
Buffer
I2CRSR
Receive
Shift
I2CIMR
Interrupt
Mask/Status
I2CSTR
Interrupt
Status
I2CIVR
Interrupt
Vector
Shading denotes control/status registers.
Figure 6-37. I2C Module Block Diagram
For more detailed information on the I2C peripheral, see the TMS320DM647/DM648 DSP Inter-Integrated
Circuit (I2C) Module User's Guide (literature number SPRUEK8).
134
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6.15.1 I2C Peripheral Register Description(s)
Table 6-62. I2C Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0x0204 7C00
ICOAR
I2C Own Address Register
0x0204 7C04
ICIMR
I2C Interrupt Mask Register
0x0204 7C08
ICSTR
I2C Interrupt Status Register
0x0204 7C0C
ICCLKL
I2C Clock Divider Low Register
0x0204 7C10
ICCLKH
I2C Clock Divider High Register
0x0204 7C14
ICCNT
I2C Data Count Register
0x0204 7C18
ICDRR
I2C Data Receive Register
0x0204 7C1C
ICSAR
I2C Slave Address Register
0x0204 7C20
ICDXR
I2C Data Transmit Register
0x0204 7C24
ICMDR
I2C Mode Register
0x0204 7C28
ICIVR
I2C Interrupt Vector Register
0x0204 7C2C
ICEMDR
I2C Extended Mode Register
0x0204 7C30
ICPSC
0x0204 7C34
ICDMAC
I2C Prescaler Register
I2C DMA Control Register
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6.15.2 I2C Electrical Data/Timing
6.15.2.1 Inter-Integrated Circuits (I2C) Timing
Table 6-63. Timing Requirements for I2C Timings (1) (see Figure 6-38)
720, 800, 900, 1100
STANDARD
MODE
NO.
FAST MODE
MIN MAX
UNIT
MIN MAX
1
tc(SCL)
Cycle time, SCL
10
2.5
µs
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated START
condition)
4.7
0.6
µs
3
th(SCLL-SDAL)
Hold time, SCL low after SDA low (for a START and a repeated
START condition)
4
0.6
µs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
250
100 (2)
(3)
(3)
0
ns
µs
7
th(SDA-SCLL)
Hold time, SDA valid after SCL low
0
8
tw(SDAH)
Pulse duration, SDA high between STOP and START conditions
4.7
9
tr(SDA)
Rise time, SDA
1000 20 + 0.1Cb
(5)
300
ns
10
tr(SCL)
Rise time, SCL
1000 20 + 0.1Cb
(5)
300
ns
300
ns
300
11
tf(SDA)
Fall time, SDA
300 20 + 0.1Cb
12
tf(SCL)
Fall time, SCL
300 20 + 0.1Cb
(5)
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for STOP condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
15
Cb
(1)
(2)
(3)
(4)
(5)
4
400
ns
µs
0.6
0
Capacitive load for each bus line
µs
1.3
(5)
(5)
0.9
(4)
50
ns
400
pF
The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
A Fast-mode I2C-bus™ device can be used in a standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be
met. This will be the case automatically if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH)= 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
The maximum th(SDA-SCLL) has to be met only if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
11
9
SDA
6
8
14
4
13
5
10
SCL
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 6-38. I2C Receive Timings
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Table 6-64. Switching Characteristics for I2C Timings (1) (see Figure 6-39)
720, 800, 900, 1100
NO.
STANDARD
MODE
PARAMETER
MIN
MAX
UNIT
MIN MAX
tc(SCL)
Cycle time, SCL
10
2.5
µs
17
td(SCLH-SDAL)
Delay time, SCL high to SDA low (for a repeated START
condition)
4.7
0.6
µs
18
td(SDAL-SCLL)
Delay time, SDA low to SCL low (for a START and a
repeated START condition)
4
0.6
µs
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
20
tw(SCLH)
Pulse duration, SCL high
µs
21
td(SDAV-SCLH)
Delay time, SDA valid to SCL high
22
tv(SCLL-SDAV)
Valid time, SDA valid after SCL low
23
tw(SDAH)
Pulse duration, SDA high between STOP and START
conditions
24
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb
300
ns
25
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb
300
ns
26
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb
300
ns
27
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb
300
ns
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for STOP condition)
29
Cp
Capacitance for each I2C pin
16
(1)
(2)
FAST MODE
4
0.6
250
100
0
0
4.7
1.3
(2)
(2)
(2)
(2)
4
ns
0.9
µs
µs
0.6
10
µs
10
pF
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
26
24
SDA
21
23
19
28
20
25
SCL
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 6-39. I2C Transmit Timings
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6.16 Host-Port Interface (HPI) Peripheral
6.16.1 HPI Device-Specific Information
The device includes a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32). The AEA14 pin
controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.
Software handshaking via the HRDY bit of the Host Port Control Register (HPIC) is not supported.
An HPI boot is terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the
EDMA Event Register (ER). This event must be cleared by software before triggering transfers on DMA
channel 0.
6.16.2 HPI Peripheral Register Description(s)
Table 6-65. HPI Control Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0x0200 0000
PID
0x0200 0004
PWREMU_MGMT
0x0200 0008 - 0x0200 0024
-
Reserved
Peripheral Identification Register
HPI power and emulation management
register
0x0200 0028
-
Reserved
0x0200 002C
-
Reserved
0x0200 0030
HPIC
HPI control register
0x0200 0034
HPIA
(HPIAW) (2)
HPI address register
(Write)
0x0200 0038
HPIA
(HPIAR) (2)
HPI address register
(Read)
0x0200 003C - 0x0200 007F
-
(1)
(2)
138
COMMENTS
PWREMU_MGMT has both host/CPU
read/write access.
The host and the CPU have read/write
access to the HPIC register. (1)
The host has read/write access to the
HPIA registers. The CPU has read
access only to the HPIA registers.
Reserved
The CPU can write 1 to the HINT bit to generate an interrupt to the host and it can write 1 to the DSPINT bit to clear/acknowledge an
interrupt from the host.
There are two 32-bit HPIA registers: HPIAR for read operations and HPIAW for write operations. The HPI can be configured such that
HPIAR and HPIAW act as a single 32-bit HPIA (single-HPIA mode) or as two separate 32-bit HPIAs (dual-HPIA mode) from the
perspective of the host. The CPU can access HPIAW and HPIAR independently. For details about the HPIA registers and their modes,
see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide (literature number SPRUEL5).
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6.16.3 HPI Electrical Data/Timing
Table 6-66. Timing Requirements for Host-Port Interface Cycles (1)
Figure 6-47)
(2)
720, 800, 900, 1100
NO.
MIN
MAX
UNIT
9
tsu(HASL-HSTBL)
Setup time, HAS low before HSTROBE low
5
ns
10
th(HSTBL-HASL)
Hold time, HAS low after HSTROBE low
2
ns
11
tsu(SELV-HASL)
Setup time, select signals (3) valid before HAS low
5
ns
(3)
12
th(HASL-SELV)
Hold time, select signals
5
ns
13
tw(HSTBL)
Pulse duration, HSTROBE low
2M
ns
14
tw(HSTBH)
Pulse duration, HSTROBE high between consecutive accesses
2M
ns
15
tsu(SELV-HSTBL)
Setup time, select signals (3) valid before HSTROBE low
5
ns
(3)
valid after HAS low
16
th(HSTBL-SELV)
Hold time, select signals
5
ns
17
tsu(HDV-HSTBH)
Setup time, host data valid before HSTROBE high
5
ns
18
th(HSTBH-HDV)
Hold time, host data valid after HSTROBE high
1
ns
37
tsu(HCSL-HSTBL)
Setup time, HCS low before HSTROBE low
0
ns
th(HRDYL-HSTBL)
Hold time, HSTROBE low after HRDY low. HSTROBE should not be
inactivated until HRDY is active (low); otherwise, HPI writes will not
complete properly.
1.1
ns
38
(1)
(2)
(3)
(see Figure 6-40 through
valid after HSTROBE low
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT (HDS1 XOR HDS2)] OR HCS.
M = SYSCLK3 period = 6/CPU clock frequency in ns.
Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.
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Table 6-67. Switching Characteristics for Host-Port Interface Cycles (1)
(see Figure 6-40 through Figure 6-47)
NO.
PARAMETER
Case 1. HPIC or HPIA read
1
td(HSTBL-HDV)
Delay time, HSTROBE low to
DSP data valid
(2)
720, 800, 900, 1100
MIN
5
15
Case 2. HPID read with no
auto-increment (3)
9 × M + 20
Case 3. HPID read with auto-increment
and read FIFO initially empty (3)
9 × M + 20
Case 4. HPID read with auto-increment
and data previously prefetched into the
read FIFO
5
15
tdis(HSTBH-HDV)
Disable time, HD high-impedance from HSTROBE high
1
4
ns
3
ten(HSTBL-HD)
Enable time, HD driven from HSTROBE low
3
15
ns
4
td(HSTBL-HRDYH)
Delay time, HSTROBE low to HRDY high
12
ns
5
td(HSTBH-HRDYH)
Delay time, HSTROBE high to HRDY high
12
ns
7
td(HSTBL-HRDYL)
td(HDV-HRDYL)
Delay time, HSTROBE low to
HRDY low
Case 1. HPID read with no
auto-increment (3)
10 × M + 20
Case 2. HPID read with auto-increment
and read FIFO initially empty (3)
10 × M + 20
Delay time, HD valid to HRDY low
ns
0
ns
Case 1. HPIA write (3)
34
td(DSH-HRDYL)
Delay time, HSTROBE high to
Case 2. HPID write with no
HRDY low
auto-increment (3)
35
td(HSTBL-HRDYL)
Delay time, HSTROBE low to HRDY low for HPIA write and FIFO not
empty (3)
36
td(HASL-HRDYH)
Delay time, HAS low to HRDY high
140
ns
2
6
(1)
(2)
(3)
UNIT
MAX
5 × M + 20
5 × M + 20
ns
40 × M + 20
ns
12
ns
M = SYSCLK3 period = 6/CPU clock frequency in ns.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Assumes the HPI is accessing L2/L1 memory and no other master is accessing the same memory location.
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
13
16
16
15
15
37
37
14
13
HSTROBE
3
3
1
2
1
2
HD[15:0]
38
4
7
6
HRDY
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5).
Figure 6-40. HPI16 Read Timing (HAS Not Used, Tied High)
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HCS
HAS
12
11
12
11
HCNTL[1:0]
12
11
12
11
12
11
12
11
HR/W
HHWIL
10
9
10
9
37
13
37
13
14
HSTROBE(A)
1
3
2
1
3
2
HD[15:0]
7
36
38
6
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5).
Figure 6-41. HPI16 Read Timing (HAS Used)
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
16
16
13
15
37
15
37
13
14
HSTROBE(A)
18
18
17
17
HD[15:0]
4
35
38
34
5
34
5
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5).
Figure 6-42. HPI16 Write Timing (HAS Not Used, Tied High)
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HCS
HAS
12
11
12
11
HCNTL[1:0]
12
11
12
11
12
11
12
11
HR/W
HHWIL
10
9
10
9
37
13
37
13
14
HSTROBE(A)
1
3
2
1
3
2
HD[15:0]
7
36
38
6
HRDY(B)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5).
Figure 6-43. HPI16 Write Timing (HAS Used)
144
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HAS (input)
16
15
HCNTL[1:0] (input)
HR/W (input)
13
HSTROBE(A)
(input)
37
HCS (input)
1
2
3
HD[31:0] (output)
38
7
6
4
HRDY(B) (output)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT (HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5)
Figure 6-44. HPI32 Read Timing (HAS Not Used, Tied High)
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10
HAS (input)
12
11
HCNTL[1:0] (input)
HR/W (input)
9
13
HSTROBE (A) (input)
37
HCS (input)
1
2
3
HD[31:0] (output)
7
38
6
36
HRDY (B) (output)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT (HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5)
Figure 6-45. HPI32 Read Timing (HAS Used)
146
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HAS (input)
16
15
HCNTL[1:0]
(input)
HR/W (input)
13
HSTROBE(A)
(input)
37
HCS (input)
18
17
HD[31:0] (input)
38
34
35
5
4
HRDY(B) (output)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT (HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5)
Figure 6-46. HPI32 Write Timing (HAS Not Used, Tied High)
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10
HAS (input)
12
11
HCNTL[1:0]
(input)
HR/W (input)
9
13
HSTROBE(A)
(input)
37
HCS (input)
17
18
HD[31:0] (input)
35
36
34
38
5
HRDY(B) (output)
A.
B.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with
auto-incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed
information on the HPI peripheral, see the TMS320DM647/DM648 DSP Host Port Interface (HPI) User's Guide
(literature number SPRUEL5)
Figure 6-47. HPI32 Write Timing (HAS Used)
148
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6.17 Peripheral Component Interconnect (PCI)
The device supports connections to a PCI backplane via the integrated PCI master/slave bus interface.
The PCI port interfaces to DSP internal resources via the data switched central resource. .
For more detailed information on the PCI port peripheral module, see the TMS320DM647/DM648
Peripheral Component Interconnect (PCI) User's Guide (literature number SPRUEL4).
6.17.1 PCI Device-Specific Information
The PCI peripheral conforms to the PCI Local Bus Specification (version 2.3). The PCI peripheral can act
both as a PCI bus master and as a target. It supports PCI bus operation of speeds up to 66 MHz and uses
a 32-bit data/address bus.
The pins of the PCI peripheral are multiplexed with the pins of the HPI, and GPIO peripherals. PCI
functionality for these pins is controlled (enabled/disabled) by the UHPIEN pin (H2). The maximum speed
of the PCI, 33 MHz or 66 MHz, is controlled through the PCI66 pin (G5). For more detailed information on
the peripheral control, see Section 3.
The device provides an initialization mechanism through which the default values for some of the PCI
configuration registers can be read from an I2C EEPROM. Table 6-68 shows the registers which can be
initialized through the PCI auto-initialization. Also shown is the default value of these registers when PCI
auto-initialization is not used. PCI auto-initialization is enabled by selecting PCI boot with
auto-initialization. For more information on this feature, see the TMS320DM647/DM648 Peripheral
Component Interconnect (PCI) User's Guide (literature number SPRUEL4) and the Using the
TMS320DM647/DM648 Bootloader Application Report (literature number SPRAAJ1).
Table 6-68. Default Values for PCI Configuration
Registers
REGISTER
DEFAULT
VALUE
Vendor ID/Device ID Register (PCIVENDEV)
104C B003h
Class Code/Revision ID Register (PCICLREV)
0000 0001h
Subsystem Vendor ID/Subsystem ID Register
(PCISUBID)
0000 0000h
Max Latency/Min Grant/Interrupt Pin/Interrupt Line
Register (PCILGINT)
0000 0100h
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6.17.2 PCI Peripheral Register Description(s)
Table 6-69. PCI Configuration Registers
PCI HOST ACCESS
HEX ADDRESS OFFSET
ACRONYM
0x00
PCIVENDEV
0x04
PCICSR
0x08
PCICLREV
Class Code/Revision ID
0x0C
PCICLINE
BIST/Header Type/Latency Timer/Cacheline Size
0x10
PCIBAR0
Base Address 0
0x14
PCIBAR1
Base Address 1
PCI HOST ACCESS REGISTER NAME
Vendor ID/Device ID
Command/Status
0x18
PCIBAR2
Base Address 2
0x1C
PCIBAR3
Base Address 3
0x20
PCIBAR4
Base Address 4
Base Address 5
0x24
PCIBAR5
0x28 - 0x2B
-
0x2C
PCISUBID
0x30
-
0x34
PCICPBPTR
0x38 - 0x3B
-
0x3C
PCILGINT
0x40 - 0x7F
-
Reserved
Subsystem Vendor ID/Subsystem ID
Reserved
Capabilities Pointer
Reserved
Max Latency/Min Grant/Interrupt Pin/Interrupt Line
Reserved
Table 6-70. PCI Back End Configuration Registers
DSP ACCESS
HEX ADDRESS RANGE
DSP ACCESS REGISTER NAME
0x0204 8400 - 0x0204 840F
-
0x0204 8410
PCISTATSET
PCI Status Set Register
Reserved
PCI Status Clear Register
0x0204 8414
PCISTATCLR
0x0204 8418 - 0x0204 841F
-
0x0204 8420
PCIHINTSET
PCI Host Interrupt Enable Set Register
PCI Host Interrupt Enable Clear Register
Reserved
0x0204 8424
PCIHINTCLR
0x0204 8428 - 0x0204 842F
-
0x0204 8430
PCIBINTSET
PCI Back End Application Interrupt Enable Set Register
0x0204 8434
PCIBINTCLR
PCI Back End Application Interrupt Enable Clear Register
0x0204 8438
PCIBCLKMGT
PCI Back End Application Clock Management Register
0x0204 843C - 0x0204 84FF
-
0x0204 8500
150
ACRONYM
Reserved
Reserved
PCIVENDEVMIR PCI Vendor ID/Device ID Mirror Register
0x0204 8504
PCICSRMIR
0x0204 8508
PCICLREVMIR
PCI Command/Status Mirror Register
PCI Class Code/Revision ID Mirror Register
0x0204 850C
PCICLINEMIR
PCI BIST/Header Type/Latency Timer/Cacheline Size Mirror Register
0x0204 8510
PCIBAR0MSK
PCI Base Address Mask Register 0
0x0204 8514
PCIBAR1MSK
PCI Base Address Mask Register 1
0x0204 8518
PCIBAR2MSK
PCI Base Address Mask Register 2
0x0204 851C
PCIBAR3MSK
PCI Base Address Mask Register 3
0x0204 8520
PCIBAR4MSK
PCI Base Address Mask Register 4
0x0204 8524
PCIBAR5MSK
PCI Base Address Mask Register 5
0x0204 8528 - 0x0204 852B
-
0x0204 852C
PCISUBIDMIR
0x0204 8530
-
Reserved
PCI Subsystem Vendor ID/Subsystem ID Mirror Register
Reserved
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Table 6-70. PCI Back End Configuration Registers (continued)
DSP ACCESS
HEX ADDRESS RANGE
ACRONYM
DSP ACCESS REGISTER NAME
0x0204 8534
PCICPBPTRMIR
0x0204 8538 - 0x0204 853B
-
0x0204 853C
PCILGINTMIR
PCI Capabilities Pointer Mirror Register
Reserved
PCI Max Latency/Min Grant/Interrupt Pin/Interrupt Line Mirror Register
0x0204 8540 - 0x0204 857F
-
0x0204 8580
PCISLVCNTL
Reserved
0x0204 8584 - 0x0204 85BF
-
0x0204 85C0
PCIBAR0TRL
PCI Slave Base Address 0 Translation Register
0x0204 85C4
PCIBAR1TRL
PCI Slave Base Address 1 Translation Register
0x0204 85C8
PCIBAR2TRL
PCI Slave Base Address 2 Translation Register
0x0204 85CC
PCIBAR3TRL
PCI Slave Base Address 3 Translation Register
0x0204 85D0
PCIBAR4TRL
PCI Slave Base Address 4 Translation Register
0x0204 85D4
PCIBAR5TRL
PCI Slave Base Address 5 Translation Register
0x0204 85D8 - 0x0204 85DF
-
0x0204 85E0
PCIBAR0MIR
PCI Base Address Register 0 Mirror Register
0x0204 85E4
PCIBAR1MIR
PCI Base Address Register 1 Mirror Register
0x0204 85E8
PCIBAR2MIR
PCI Base Address Register 2 Mirror Register
0x0204 85EC
PCIBAR3MIR
PCI Base Address Register 3 Mirror Register
0x0204 85F0
PCIBAR4MIR
PCI Base Address Register 4 Mirror Register
0x0204 85F4
PCIBAR5MIR
PCI Base Address Register 5 Mirror Register
0x0204 85F8 - 0x0204 86FF
-
PCI Slave Control Register
Reserved
Reserved
Reserved
0x0204 8700
PCIMCFGDAT
PCI Master Configuration/IO Access Data Register
0x0204 8704
PCIMCFGADR
PCI Master Configuration/IO Access Address Register
0x0204 8708
PCIMCFGCMD
PCI Master Configuration/IO Access Command Register
0x0204 870C - 0x0204 870F
-
0x0204 8710
PCIMSTCFG
Reserved
PCI Master Configuration Register
Table 6-71. PCI Hook Configuration Registers
DSP ACCESS
HEX ADDRESS RANGE
ACRONYM
0x0204 8794
PCIVENDEVPRG
0x0204 8798
DSP ACCESS REGISTER NAME
PCI Vendor ID and Device ID Program Register
PCICMDSTATPRG PCI Command and Status Program Register
0x0204 879C
PCICLREVPRG
PCI Class Code and Revision ID Program Register
0x0204 87A0
PCISUBIDPRG
PCI Subsystem Vendor ID and Subsystem ID Program Register
0x0204 87A4
PCIMAXLGPRG
PCI Max Latency and Min Grant Program Register
0x0204 87A8
PCILRSTREG
PCI LRESET Register
0x0204 87AC
PCICFGDONE
PCI Configuration Done Register
0x0204 87B0
PCIBAR0MPRG
PCI Base Address Mask Register 0 Program Register
0x0204 87B4
PCIBAR1MPRG
PCI Base Address Mask Register 1 Program Register
0x0204 87B8
PCIBAR2MPRG
PCI Base Address Mask Register 2 Program Register
0x0204 87BC
PCIBAR3MPRG
PCI Base Address Mask Register 3 Program Register
0x0204 87C0
PCIBAR4MPRG
PCI Base Address Mask Register 4 Program Register
0x0204 87C4
PCIBAR5MPRG
PCI Base Address Mask Register 5 Program Register
0x0204 87C8
PCIBAR0PRG
PCI Base Address Register 0 Program Register
0x0204 87CC
PCIBAR1PRG
PCI Base Address Register 1 Program Register
0x0204 87D0
PCIBAR2PRG
PCI Base Address Register 2 Program Register
0x0204 87D4
PCIBAR3PRG
PCI Base Address Register 3 Program Register
0x0204 87D8
PCIBAR4PRG
PCI Base Address Register 4 Program Register
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Table 6-71. PCI Hook Configuration Registers (continued)
DSP ACCESS
HEX ADDRESS RANGE
0x0204 87DC
ACRONYM
PCIBAR5PRG
DSP ACCESS REGISTER NAME
PCI Base Address Register 5 Program Register
0x0204 87E0
PCIBAR0TRLPRG PCI Base Address Translation Register 0 Program Register
0x0204 87E4
PCIBAR1TRLPRG PCI Base Address Translation Register 1 Program Register
0x0204 87E8
PCIBAR2TRLPRG PCI Base Address Translation Register 2 Program Register
0x0204 87EC
PCIBAR3TRLPRG PCI Base Address Translation Register 3 Program Register
0x0204 87F0
PCIBAR4TRLPRG PCI Base Address Translation Register 4 Program Register
0x0204 87F4
PCIBAR5TRLPRG PCI Base Address Translation Register 5 Program Register
0x0204 87F8
PCIBASENPRG
0x0204 87FC - 0x0204 87FF
-
PCI Base En Prog Register
Reserved
Table 6-72. PCI External Memory Space
152
HEX ADDRESS OFFSET
ACRONYM
0x4000 0000 - 0x407F FFFF
-
PCI Master Window 0
REGISTER NAME
0x4080 0000 - 0x40FF FFFF
-
PCI Master Window 1
0x4100 0000 - 0x417F FFFF
-
PCI Master Window 2
0x4180 0000 - 0x41FF FFFF
-
PCI Master Window 3
0x4200 0000 - 0x427F FFFF
-
PCI Master Window 4
0x4280 0000 - 0x42FF FFFF
-
PCI Master Window 5
0x4300 0000 - 0x437F FFFF
-
PCI Master Window 6
0x4380 0000 - 0x43FF FFFF
-
PCI Master Window 7
0x4400 0000 - 0x447F FFFF
-
PCI Master Window 8
0x4480 0000 - 0x44FF FFFF
-
PCI Master Window 9
0x4500 0000 - 0x457F FFFF
-
PCI Master Window 10
0x4580 0000 - 0x45FF FFFF
-
PCI Master Window 11
0x4600 0000 - 0x467F FFFF
-
PCI Master Window 12
0x4680 0000 - 0x46FF FFFF
-
PCI Master Window 13
0x4700 0000 - 0x477F FFFF
-
PCI Master Window 14
0x4780 0000 - 0x47FF FFFF
-
PCI Master Window 15
0x4800 0000 - 0x487F FFFF
-
PCI Master Window 16
0x4880 0000 - 0x48FF FFFF
-
PCI Master Window 17
0x4900 0000 - 0x497F FFFF
-
PCI Master Window 18
0x4980 0000 - 0x49FF FFFF
-
PCI Master Window 19
0x4A00 0000 - 0x4A7F FFFF
-
PCI Master Window 20
0x4A80 0000 - 0x4AFF FFFF
-
PCI Master Window 21
0x4B00 0000 - 0x4B7F FFFF
-
PCI Master Window 22
0x4B80 0000 - 0x4BFF FFFF
-
PCI Master Window 23
0x4C00 0000 - 0x4C7F FFFF
-
PCI Master Window 24
0x4C80 0000 - 0x4CFF FFFF
-
PCI Master Window 25
0x4D00 0000 - 0x4D7F FFFF
-
PCI Master Window 26
0x4D80 0000 - 0x4DFF FFFF
-
PCI Master Window 27
0x4E00 0000 - 0x4E7F FFFF
-
PCI Master Window 28
0x4E80 0000 - 0x4EFF FFFF
-
PCI Master Window 29
0x4F00 0000 - 0x4F7F FFFF
-
PCI Master Window 30
0x4F80 0000 - 0x4FFF FFFF
-
PCI Master Window 31
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6.17.3 PCI Electrical Data/Timing
Texas Instruments (TI) has performed the simulation and system characterization to be sure that the PCI
peripheral meets all ac timing specifications as required by the PCI Local Bus Specification (version 2.3).
The ac timing specifications are not reproduced here. For more information on the ac timing specifications,
see Section 4.2.3, Timing Specification (33 MHz timing), and Section 7.6.4, Timing Specification (66 MHz
timing), of the PCI Local Bus Specification (version 2.3). Note that the PCI peripheral only supports 3.3-V
signaling.
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6.18 Multichannel Audio Serial Port (McASP)
The McASP functions as a general-purpose audio serial port optimized for the needs of multichannel
audio applications. The McASP is useful for time-division multiplexed (TDM) stream, Inter-Integrated
Sound (I2S) protocols, and intercomponent digital audio interface transmission (DIT).
6.18.1 McASP Device-Specific Information
The device includes one multichannel audio serial port (McASP) interface peripheral. The McASP is a
serial port optimized for the needs of multichannel audio applications.
The McASP consists of a transmit and receive section. These sections can operate completely
independently with different data formats, separate master clocks, bit clocks, and frame syncs or
alternatively, the transmit and receive sections may be synchronized. The McASP module also includes a
pool of 16 shift registers that may be configured to operate as either transmit data or receive data.
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM)
synchronous serial format or in a digital audio interface (DIT) format where the bit stream is encoded for
S/PDIF, AES-3, IEC-60958, CP-430 transmission. The receive section of the McASP supports the TDM
synchronous serial format.
The McASP can support one transmit data format (either a TDM format or DIT format) and one receive
format at a time. All transmit shift registers use the same format and all receive shift registers use the
same format. However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode which is useful for
non-audio data (for example, passing control information between two DSPs).
The McASP peripheral has additional capability for flexible clock generation, and error detection/handling,
as well as error management.
For more detailed information on and the functionality of the McASP peripheral, see the
TMS320DM647/DM648 Multichannel Audio Serial Port (McASP) User's Guide (literature number
SPRUEL1).
6.18.1.1 McASP Block Diagram
Figure 6-48 illustrates the major blocks along with external signals of the McASP peripheral; and shows
the 10 serial data [AXR] pins.
154
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McASP
DIT
RAM
Transmit
Frame Sync
Generator
AFSX
Transmit
Clock Check
(HighFrequency)
Transmit
Clock
Generator
AHCLKX
ACLKX
AMUTE
AMUTEIN
Receive
Clock Check
(HighFrequency)
Receive
Clock
Generator
Transmit
Data
Formatter
Receive
Frame Sync
Generator
INDIVIDUALLY PROGRAMMABLE TX/RX/GPIO
DMA Receive
DMS Transmit
Error
Detect
Receive
Data
Formatter
AHCLKR
ACLKR
AFSR
Serializer 0
AXR0[0]
Serializer 1
AXR0[1]
Serializer 2
AXR0[2]
Serializer 3
AXR0[3]
Serializer 9
AXR0[9]
GPIO
Control
Figure 6-48. McASP Configuration
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6.18.1.2 McASP Peripheral Register Description(s)
Table 6-73. McASP Control Registers
HEX ADDRESS RANGE
ACRONYM
0x0204 0000
PID
REGISTER NAME
0x0204 0004
PWRDEMU
0x0204 0008
-
Reserved
0x0204 000C
-
Reserved
0x0204 0010
PFUNC
Pin function register
0x0204 0014
PDIR
Pin direction register
0x0204 0018
PDOUT
Pin data out register
0x0204 001C
PDIN/PDSET
0x0204 0020
PDCLR
Peripheral Identification register [Register value: 0x0010 0101]
Power down and emulation management register
Pin data in/data set register
Read returns: PDIN
Writes affect: PDSET
Pin data clear register
0x0204 0024 - 0x0204 0040
-
0x0204 0044
GBLCTL
Global control register
0x0204 0048
AMUTE
Mute control register
0x0204 004C
DLBCTL
Digital Loop-back control register
DIT mode control register
0x0204 0050
DITCTL
0x0204 0054 - 0x0204
005C
-
0x0204 0060
RGBLCTL
0x0204 0064
RMASK
0x0204 0068
RFMT
0x0204 006C
AFSRCTL
0x0204 0070
ACLKRCTL
0x0204 0074
AHCLKRCTL
Reserved
Reserved
Alias of GBLCTL containing only Receiver Reset bits, allows transmit to be reset
independently from receive.
Receiver format UNIT bit mask register
Receive bit stream format register
Receive frame sync control register
Receive clock control register
High-frequency receive clock control register
0x0204 0078
RTDM
0x0204 007C
RINTCTL
0x0204 0080
RSTAT
Status register - Receiver
0x0204 0084
RSLOT
Current receive TDM slot register
0x0204 0088
RCLKCHK
0x0204 008C - 0x0204
009C
-
0x0204 00A0
XGBLCTL
0x0204 00A4
XMASK
156
0x0204 00A8
XFMT
0x0204 00AC
AFSXCTL
0x0204 00B0
ACLKXCTL
0x0204 00B4
AHCLKXCTL
Receive TDM slot 0-31 register
Receiver interrupt control register
Receiver clock check control register
Reserved
Alias of GBLCTL containing only Transmitter Reset bits, allows transmit to be reset
independently from receive.
Transmit format UNIT bit mask register
Transmit bit stream format register
Transmit frame sync control register
Transmit clock control register
High-frequency Transmit clock control register
0x0204 00B8
XTDM
0x0204 00BC
XINTCTL
Transmit TDM slot 0-31 register
0x0204 00C0
XSTAT
Status register - Transmitter
0x0204 00C4
XSLOT
Current transmit TDM slot
0x0204 00C8
XCLKCHK
Transmit interrupt control register
Transmit clock check control register
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Table 6-73. McASP Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0x0204 00CC - 0x0204
00FC
REGISTER NAME
-
0x0204 0100
DITCSRA0
Left (even TDM slot) channel status register file
0x0204 0104
DITCSRA1
Left (even TDM slot) channel status register file
Reserved
0x0204 0108
DITCSRA2
Left (even TDM slot) channel status register file
0x0204 010C
DITCSRA3
Left (even TDM slot) channel status register file
0x0204 0110
DITCSRA4
Left (even TDM slot) channel status register file
0x0204 0114
DITCSRA5
Left (even TDM slot) channel status register file
0x0204 0118
DITCSRB0
Right (odd TDM slot) channel status register file
0x0204 011C
DITCSRB1
Right (odd TDM slot) channel status register file
0x0204 0120
DITCSRB2
Right (odd TDM slot) channel status register file
0x0204 0124
DITCSRB3
Right (odd TDM slot) channel status register file
0x0204 0128
DITCSRB4
Right (odd TDM slot) channel status register file
0x0204 012C
DITCSRB5
Right (odd TDM slot) channel status register file
0x0204 0130
DITUDRA0
Left (even TDM slot) user data register file
0x0204 0134
DITUDRA1
Left (even TDM slot) user data register file
0x0204 0138
DITUDRA2
Left (even TDM slot) user data register file
0x0204 013C
DITUDRA3
Left (even TDM slot) user data register file
0x0204 0140
DITUDRA4
Left (even TDM slot) user data register file
0x0204 0144
DITUDRA5
Left (even TDM slot) user data register file
0x0204 0148
DITUDRB0
Right (odd TDM slot) user data register file
0x0204 014C
DITUDRB1
Right (odd TDM slot) user data register file
0x0204 0150
DITUDRB2
Right (odd TDM slot) user data register file
0x0204 0154
DITUDRB3
Right (odd TDM slot) user data register file
0x0204 0158
DITUDRB4
Right (odd TDM slot) user data register file
0x0204 015C
DITUDRB5
Right (odd TDM slot) user data register file
0x0204 0160 - 0x0204
017C
-
0x0204 0180
SRCTL0
Serializer 0 control register
0x0204 0184
SRCTL1
Serializer 1 control register
0x0204 0188
SRCTL2
Serializer 2 control register
0x0204 018C
SRCTL3
Serializer 3 control register
0x0204 0190
SRCTL4
Serializer 4 control register
0x0204 0194
SRCTL5
Serializer 5 control register
Reserved
0x0204 0198
SRCTL6
Serializer 6 control register
0x0204 019C
SRCTL7
Serializer 7 control register
0x0204 01A0
SRCTL8
Serializer 8 control register
0x0204 01A4
SRCTL9
Serializer 9 control register
0x0204 01A8 - 0x0204
01FC
-
0x0204 0200
XBUF0
Transmit Buffer for Serializer 0
0x0204 0204
XBUF1
Transmit Buffer for Serializer 1
0x0204 0208
XBUF2
Transmit Buffer for Serializer 2
0x0204 020C
XBUF3
Transmit Buffer for Serializer 3
0x0204 0210
XBUF4
Transmit Buffer for Serializer 4
0x0204 0214
XBUF5
Transmit Buffer for Serializer 5
0x0204 0218
XBUF6
Transmit Buffer for Serializer 6
0x0204 021C
XBUF7
Transmit Buffer for Serializer 7
Reserved
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Table 6-73. McASP Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0x0204 021A
XBUF8
Transmit Buffer for Serializer 8
REGISTER NAME
Transmit Buffer for Serializer 9
0x0204 0220
XBUF9
0x0204 0224-0x0204 027C
-
0x0204 0280
RBUF0
Receive Buffer for Serializer 0
0x0204 0284
RBUF1
Receive Buffer for Serializer 1
0x0204 0288
RBUF2
Receive Buffer for Serializer 2
0x0204 028C
RBUF3
Receive Buffer for Serializer 3
0x0204 0290
RBUF4
Receive Buffer for Serializer 4
0x0204 0294
RBUF5
Receive Buffer for Serializer 5
0x0204 0298
RBUF6
Receive Buffer for Serializer 6
0x0204 029C
RBUF7
Receive Buffer for Serializer 7
0x0204 02A0
RBUF8
Receive Buffer for Serializer 8
0x0204 02A4
RBUF9
Receive Buffer for Serializer 9
0x0204 02A8-0x0204 3FFF
-
Reserved
Reserved
Table 6-74. McASP Data Registers
HEX ADDRESS RANGE
ACRONYM
0204 4000 - 0204 43FF
RBUF/XBUF
REGISTER NAME
McASP receive buffers or McASP transmit
buffers via the Peripheral Data Bus.
COMMENTS
(Used when RSEL or XSEL bits = 0
[these bits are located in the RFMT or
XFMT registers, respectively].)
6.18.1.3 McASP Electrical Data/Timing
6.18.1.3.1 Multichannel Audio Serial Port (McASP) Timing
Table 6-75. Timing Requirements for McASP (see Figure 6-49 and Figure 6-50) (1)
720, 800, 900,
1100
NO.
MIN
UNIT
MAX
1
tc(AHCKRX)
Cycle time, AHCLKR/X
20
ns
2
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
10
ns
3
tc(CKRX)
Cycle time, ACLKR/X
ACLKR/X ext
33
ns
4
tw(CKRX)
Pulse duration, ACLKR/X high or low
ACLKR/X ext
16.5
ns
ACLKR/X int
5
ns
ACLKR/X ext
5
ns
ACLKR/X int
5
ns
ACLKR/X ext
12.08
ns
ACLKR/X int
5
ns
ACLKR/X ext
5
ns
ACLKR/X int
5
ns
ACLKR/X ext
7.35
ns
5
tsu(FRX-CKRX)
Setup time, AFSR/X input valid before ACLKR/X latches data
6
th(CKRX-FRX)
Hold time, AFSR/X input valid after ACLKR/X latches data
7
tsu(AXR-CKRX)
Setup time, AXR input valid before ACLKR/X latches data
8
(1)
158
th(CKRX-AXR)
Hold time, AXR input valid after ACLKR/X latches data
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
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Table 6-76. Switching Characteristics Over Recommended Operating Conditions for McASP
(see Figure 6-49 and Figure 6-50) (1)
NO.
720, 800, 900,
1100
PARAMETER
MIN
9
tc(AHCKRX)
Cycle time, AHCLKR/X
10
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
11
tc(CKRX)
Cycle time, ACLKR/X
ACLKR/X int
12
tw(CKRX)
Pulse duration, ACLKR/X high or low
ACLKR/X int
16.5
13
(1)
td(CKRX-FRX)
Delay time, ACLKR/X transmit edge to AFSX/R output valid
14
td(CKX-AXRV)
Delay time, ACLKX transmit edge to AXR output valid
15
tdis(CKRX-AXRHZ)
Disable time, AXR high impedance following last data bit from
ACLKR/X transmit edge
UNIT
MAX
20
ns
10
ns
33
ns
ns
ACLKR/X int
5
ns
ACLKR/X ext
14.28
ns
ACLKX int
10
ns
ACLKX ext
12.5
ns
ACLKR/X int
10
ns
ACLKR/X ext
12.5
ns
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
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2
1
2
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
4
3
4
ACLKR/X (CLKRP = CLKXP = 0) (A)
ACLKR/X (CLKRP = CLKXP = 1) (B)
6
5
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
8
7
AXR[n] (Data In/Receive)
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
C31
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
Figure 6-49. McASP Input Timing
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10
10
9
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
12
11
12
ACLKR/X (CLKRP = CLKXP = 1) (A)
ACLKR/X (CLKRP = CLKXP = 0) (B)
13
13
13
13
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
13
13
13
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
14
15
AXR[n] (Data Out/T ransmit)
A.
B.
For CLKRP = CLKXP =
receiver is configured for
For CLKRP = CLKXP =
receiver is configured for
A0 A1
A30 A31 B0 B1
B30 B31 C0 C1 C2 C3
1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
rising edge (to shift data in).
0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
falling edge (to shift data in).
C31
Figure 6-50. McASP Output Timing
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6.19 3-Port Ethernet Switch Subsystem (3PSW)
The Ethernet module controls the flow of packet data between the device and two external Ethernet PHYs
(DM648 only) or one external Ethernet PHY (DM647 only), with hardware flow control and
quality-of-service (QOS) support. See Figure 6-51 for a block diagram of the Ethernet module. The
Ethernet Subsystem contains a 3-port gigabit switch, where one port is internally connected to the C64x+
DSP (via the switched central resource) and the other two ports are brought out externally. Each of the
external Ethernet ports support the modes shown in Table 6-77.
The Ethernet module controls the flow of packet data between the device and two external Ethernet
PHYs , with hardware flow control and quality-of-service (QOS) support. See Figure 6-51 for a block
diagram of the Ethernet module. The Ethernet Subsystem contains a 3-port gigabit switch, where one port
is internally connected to the C64x+ DSP (via the switched central resource) and the other two ports are
brought out externally. Each of the external Ethernet ports support the modes shown in Table 6-77.
Table 6-77. Ethernet Operating Modes
DESCRIPTION
DATA RATE
OPERATING MODE
10Base-T
10 Mbits/second (Mbps)
half- or full-duplex
100Base-T
100 Mbits/second (Mbps)
half- or full-duplex
1000Base-T
1000 Mbits/second (Mbps)
full-duplex
The Ethernet Subsystem provides these functions:
• Ethernet communication/routing by way of two dedicated 10/100/1000 ports with SGMII interfaces
– Wire-rate switching (802.1d), non-blocking switch fabric
– Four priority levels of QoS TX support (802.1p) in hardware
– Programmable interrupt pacing on RX/TX plus interrupt threshold on RX
– Supports forwarding frame sizes of 64-2020 bytes
• Address Lookup
– 1024 total address lookup engine (ALE) entries of VLANs and/or MAC addresses
– L2 address lock and L2 filtering support
– Multicast/broadcast filtering and forwarding state control
– Receive-based or destination-based multicast and broadcast rate limits
– MAC address blocking
– Source port locking
– OUI (Vendor ID) host accept/deny feature
– Host controlled time-based aging
– MAC authentication (802.1x)
– Remapping of priority level of VLAN or ports
– Multiple spanning tree support (spanning tree per VLAN)
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•
VLAN support
– 802.1Q compliant
• Auto add port VLAN for untagged frames on ingress
• Auto VLAN removal on egress and auto pad to minimum frame size
– Flow control (IEEE 802.3x)
– Programmable priority escalation to specify delivery of lower priority level packets in the event of
over-subscribed TX high priority traffic
– Host pass CRC mode (enables CRC protection through host)
– Write-protect option for Ethernet module registers (3PGSW, CPPI RAM, MDIO, SGMII0, SGMII1,
control)
– Ethernet statistics:
• EtherStats and 802.3 Stats RMON statistics gathering (shared)
• Programmable statistics interrupt mask when a statistic is above one half its 32-bit value
– MDIO module for PHY management
– SGMII gigabit current mode logic (CML) differential SERializer/DESerializer (SerDes) I/O
receiver/transmitters
• Adaptive active equalization for superior data dependent jitter tolerance in the presence of a
lossy channel
• Loss of signal detector with programmable threshold levels in receive channels
• Integrated receiver and transmitter termination
• IEEE 802.3 gigabit Ethernet conformant
6.19.1 Ethernet Subsystem Functions
Configuration
Bus
Peripheral
Bus
2
Configuration
Registers
Gigabit
MAC 0
3-port
Gigabit
Switch
Host DMA
Controller
GMII port 0
SGMII 0
2
Addr Lookup
Engine
SGMII
Port 0
2
REFCLK
2
Buffer
Descriptor
Memory
Gigabit
MAC 1
GMII port 1
(A)
SGMII 1
2
SGMII
Port 1
DSP
Interrupt
Controller
Configuration
Bus
A.
MDIO
MII
Serial
Mgmt
SGMII port 1 is not available on DM647.
Figure 6-51. Ethernet Subsystem Block Diagram
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The Ethernet Subsystem conforms to the IEEE 802.3-2002 standard. Deviating from this standard, the
GMAC module does not use the transmit coding error signal MTXER. Instead of driving the error pin when
an underflow condition occurs on a transmitted frame, the GMAC generates an incorrect checksum by
inverting the frame CRC, so that the transmitted frame will be detected as an error by the network.
In networking systems, packet transmission and reception are critical tasks. The communications port
programming interface (CPPI) protocol maximizes the efficiency of interaction between the host software
and communications modules. The CPPI block contains 2048 words of 32-bit buffer descriptor memory
that holds up to 512 buffer descriptors.
After reset, initialization, configuration, and auto-negotiation, the host C64x+ DSP may initiate Ethernet
transmit and receive operations.
• Transmit operations are initiated by C64x+ DSP writes to the appropriate transmit channel head
descriptor pointer contained in the CPDMA block. The CPDMA TX controller then fetches the first
packet in the packet chain from memory in accordance with the CPPI protocol for the GMAC to
process before sending to the SGMII.
• Receive operations are initiated by C64x+ DSP writes to the appropriate receive channel head
descriptor pointer. The CPDMA RX controller then writes packets to memory in accordance with the
CPPI protocol.
DSP writes may be write-protected to the Ethernet Subsystem configuration registers from addresses
0x02D0 0000 - 0x02D0 4FFF (3PGSW, MDIO, SGMII0, SGMII1, control), and the CPPI RAM. The
Ethernet Subsystem setting in the PSC is also write-protected. A specific 32-bit lock code (0x4C6F436B)
and a 32-bit unlock code (0x6F50654E) written to ESS_LOCK register will activate or clear this option,
respectively. See Section 3.2.5 and Section 3.2.7
The 3-port gigabit switch block contains the following functions:
• 3-port gigabit switch: performs packet forwarding and routing functions, one port is internally connected
to the C64x+ DSP and two ports are brought out externally
• CPDMA: performs high-speed DMA transfers with RX and TX CPPI buffers in local memory, including
channel setup and channel teardown
• GMAC (Gigabit Ethernet MAC):
– Uses Rx packet FIFO, and a TX packet FIFO to improve data transfer efficiency
– Handles processing of Ethernet packet data, frames, and headers
– Includes flow control
– Provides statistics collection and reporting
• The address lookup engine (ALE) processes all received packets to determine where (that is, which
packet location) to forward the packet. The ALE uses the incoming packet received port number,
destination address, source address, length/type, and VLAN information to determine how the packet
should be forwarded. The ALE outputs the port mask to the switch fabric that indicates to which port(s)
the packet should be forwarded.
6.19.2 Interrupt Controller and Pacing Interrupts
The interrupt control block selects the interrupts from the 3-port gigabit switch and MDIO modules for
output to the C64x+ DSP. The miscellaneous interrupt is an immediate (non-paced) interrupt selected
from the miscellaneous interrupts (host error level, statistics level, MDIO User [2], MDIO link [2]).
The eight RX interrupts and eight TX interrupts can be paced. The 8 RX threshold interrupts and the
miscellaneous interrupts are not paced. The interrupt pacing feature limits the number of interrupts that
occur during a given period of time. For heavily loaded systems in which interrupts can occur at a very
high rate, the performance benefit is significant due to minimizing the overhead associated with servicing
each interrupt. Interrupt pacing increases the C64x+ DSP cache hit ratio by minimizing the number of
times that large interrupt service routines are moved to and from the DSP instruction cache.
MDIO
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The MDIO module manages the PHY configuration and monitors status. For a list of supported registers
and register fields, see Table 6-79. In 10/100 mode, the GMII_MTXD(7:0) data bus uses only the lower
nibble.
SGMII
The SGMII/SerDes module contains:
• Gigabit differential current mode logic (CML) receiver/transmitters
• An integrated RX/TX PLL to provide the required high-quality/high-speed internal clocks
• Phase-interpolator-based clock/data recovery
• A bandgap reference for transmitter swing settings
• Parallel-to-serial converter
• Serial-to-parallel converter
• Integrated receiver and transmitter termination
• Configuration logic
• 802.3 auto-negotiation functionality (as defined in Clause 37 of the IEEE Specification 802.3)
The SGMII receive interface converts the encoded receive signals from the differential receive input
terminals (SGMII0RXN: SGMII0RXP, SGMII1RXN: SGMII1RXP) into the required GMAC GMII signals.
The SGMII transmit interface converts the GMAC GMII data into the required encoded differential transmit
output terminals (SGMII0TXN: SGMII0TXP, SGMII1TXN: SGMII1TXP). The GMAC does not source the
transmit error signal. Any transmit frame from the GMAC with an error (ie., underrun) will be indicated as
an error by an error CRC.
NOTE
SGMII1 is pinned out only in the DM648 device. The DM647 device has only one SGMII port
(SGMII0).
6.19.3 Peripheral Register Description(s)
Table 6-78 through Table 6-81 list the registers.
Table 6-78. Ethernet Switch Registers
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 3000
CPSW_ID_VER
0x02D0 3004
CPSW_CONTROL
DESCRIPTION
CPSW Identification and Version Register
CPSW Switch Control Register
0x02D0 3008
CPSW_SOFT_RESET
0x02D0 300C
CPSW_STAT_PORT_EN
CPSW Soft Reset Register
CPSW Statistics Port Enable Register
0x02D0 3010
CPSW_PTYPE
CPSW Transmit Priority Type Register
0x02D0 3014
P0_MAX_BLKS
CPSW Port 0 Maximum FIFO blocks Register
0x02D0 3018
P0_BLK_CNT
0x02D0 301C
P0_FLOW_THRESH
CPSW Port 0 FIFO Block Usage Count Register (read only)
0x02D0 3020
P0_PORT_VLAN
CPSW Port 0 VLAN Register
0x02D0 3024
P0_TX_PRI_MAP
CPSW Port 0 Tx Header Pri to Switch Pri Mapping Register
0x02D0 3028
GMAC0_GAP_THRESH
CPSW GMAC0 Short Gap Threshold Register
0x02D0 302C
GMAC0_SA_LO
CPSW GMAC0 Source Address Low Register
0x02D0 3030
GMAC0_SA_HI
CPSW GMAC0 Source Address High Register
0x02D0 3034
P1_MAX_BLKS
CPSW Port 1 Maximum FIFO blocks Register
0x02D0 3038
P1_BLK_CNT
0x02D0 303C
P1_FLOW_THRESH
0x02D0 3040
P1_PORT_VLAN
CPSW Port 0 Flow Control Threshold Register
CPSW Port 1 FIFO Block Usage Count Register (read only)
CPSW Port 1 Flow Control Threshold Register
CPSW Port 1 VLAN Register
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Table 6-78. Ethernet Switch Registers (continued)
166
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 3044
P1_TX_PRI_MAP
DESCRIPTION
0x02D0 3048
GMAC1_GAP_THRESH
CPSW GMAC1 Short Gap Threshold Register
0x02D0 304C
GMAC1_SA_LO
CPSW GMAC1 Source Address Low Register
0x02D0 3050
GMAC1_SA_HI
CPSW GMAC1 Source Address High Register
0x02D0 3054
P2_MAX_BLKS
CPSW Port 2 Maximum FIFO blocks Register
0x02D0 3058
P2_BLK_CNT
0x02D0 305C
P2_FLOW_THRESH
0x02D0 3060
P2_PORT_VLAN
CPSW Port 2 VLAN Register
0x02D0 3064
P2_TX_PRI_MAP
CPSW Port 2 Tx (CPDMA Rx) Header Priority to Switch Pri
Mapping Register
0x02D0 3068
CPDMA_TX_PRI_MAP
CPSW CPDMA Tx (Port 2 Rx) Pkt Priority to Header Priority
Mapping Register
0x02D0 306C
CPDMA_RX_CH_MAP
CPSW CPDMA Rx (Port 2 Tx) Switch Priority to DMA
channel Mapping Register
CPSW Port 1 Tx Header Priority to Switch Pri Mapping
Register
CPSW Port 2 FIFO Block Usage Count Register (read only)
CPSW Port 2 Flow Control Threshold Register
0x02D0 3070 - 0x02D0 307C
reserved
0x02D0 3080
GMAC0_IDVER
0x02D0 3084
GMAC0_MACCONTROL
GMAC0 Mac Control Register
GMAC0 Identification and Version Register
0x02D0 3088
GMAC0_MACSTATUS
GMAC0 Mac Status Register
0x02D0 308C
GMAC0_SOFT_RESET
GMAC0 Soft Reset Register
0x02D0 3090
GMAC0_RX_MAXLEN
GMAC0 RX Maximum Length Register
0x02D0 3094
GMAC0_BOFFTEST
0x02D0 3098
reserved
GMAC0 Backoff Test Register
0x02D0 309C
reserved
0x02D0 30A0
GMAC0_EMCONTROL
GMAC0 Emulation Control Register
GMAC0 Rx Pkt Priority to Header Priority Mapping Register
0x02D0 30A4
GMAC0_RX_PRI_MAP
0x02D0 30A8 - 0x02D0 30BC
reserved
0x02D0 30C0
GMAC1_IDVER
0x02D0 30C4
GMAC1_MACCONTROL
GMAC1 Mac Control Register
0x02D0 30C8
GMAC1_MACSTATUS
GMAC1 Mac Status Register
0x02D0 30CC
GMAC1_SOFT_RESET
GMAC1 Soft Reset Register
0x02D0 30D0
GMAC1_RX_MAXLEN
GMAC1 RX Maximum Length Register
0x02D0 30D4
GMAC1_BOFFTEST
0x02D0 30D8
reserved
0x02D0 30DC
reserved
0x02D0 30E0
GMAC1_EMCONTROL
GMAC1 Emulation Control Register
0x02D0 30E4
GMAC1_RX_PRI_MAP
GMAC1 Rx Pkt Priority to Header Priority Mapping Register
0x02D0 30E8 - 0x02D0 30FC
reserved
0x02D0 3100
TX_IDVER
0x02D0 3104
TX_CONTROL
0x02D0 3108
TX_TEARDOWN
0x02D0 310C
reserved
0x02D0 3110
RX_IDVER
0x02D0 3114
RX_CONTROL
0x02D0 3118
RX_TEARDOWN
GMAC1 Identification and Version Register
GMAC1 Backoff Test Register
CPDMA Tx Identification and Version Register
CPDMA Tx Control Register
CPDMA Tx Teardown Register
CPDMA Rx Identification and Version Register
CPDMA Rx Control Register
CPDMA Rx Teardown Register
0x02D0 311C
SOFT_RESET
CPDMA Soft Reset Register
0x02D0 3120
DMACONTROL
CPDMA Control Register
0x02D0 3124
DMASTATUS
CPDMA Status Register
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Table 6-78. Ethernet Switch Registers (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x02D0 3128
RX_BUFFER_OFFSET
CPDMA Rx Buffer Offset Register
0x02D0 312C
EMCONTROL
0x02D0 3130 - 0x02D0 317C
reserved
CPDMA Emulation Control Register
0x02D0 3180
TX_INTSTAT_RAW
0x02D0 3184
TX_INTSTAT_MASKED
0x02D0 3188
TX_INTMASK_SET
0x02D0 318C
TX_INTMASK_CLEAR
CPDMA Tx Interrupt Mask Clear Register
0x02D0 3190
CPDMA_IN_VECTOR
CPDMA Input Vector Register (read only)
0x02D0 3194
CPDMA_EOI_VECTOR
CPDMA End Of Interrupt Vector Register
0x02D0 3198 - 0x02D0 319C
reserved
0x02D0 31A0
RX_INTSTAT_RAW
0x02D0 31A4
RX_INTSTAT_MASKED
0x02D0 31A8
RX_INTMASK_SET
0x02D0 31AC
RX_INTMASK_CLEAR
CPDMA Rx Interrupt Mask Clear Register
0x02D0 31B0
DMA_INTSTAT_RAW
CPDMA DMA Interrupt Status Register (raw value)
0x02D0 31B4
DMA_INTSTAT_MASKED
0x02D0 31B8
DMA_INTMASK_SET
0x02D0 31BC
DMA_INTMASK_CLEAR
0x02D0 31C0
RX0_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 0
0x02D0 31C4
RX1_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 1
0x02D0 31C8
RX2_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 2
0x02D0 31CC
RX3_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 3
0x02D0 31D0
RX4_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 4
0x02D0 31D4
RX5_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 5
CPDMA Tx interrupt Status Register (raw value)
CPDMA Tx Interrupt Status Register (masked value)
CPDMA Tx Interrupt Mask Set Register
CPDMA Rx Interrupt Status Register (raw value)
CPDMA Rx Interrupt Status Register (masked value)
CPDMA Rx Interrupt Mask Set Register
CPDMA DMA Interrupt Status Register (masked value)
CPDMA DMA Interrupt Mask Set Register
CPDMA DMA Interrupt Mask Clear Register
0x02D0 31D8
RX6_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 6
0x02D0 31DC
RX7_PENDTHRESH
CPDMA Rx Threshold Pending Register Channel 7
0x02D0 31E0
RX0_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 0
0x02D0 31E4
RX1_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 1
0x02D0 31E8
RX2_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 2
0x02D0 31EC
RX3_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 3
0x02D0 31F0
RX4_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 4
0x02D0 31F4
RX5_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 5
0x02D0 31F8
RX6_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 6
0x02D0 31FC
RX7_FREEBUFFER
CPDMA Rx Free Buffer Register Channel 7
0x02D0 3200
TX0_HDP
CPDMA Tx Channel 0 Head Desc Pointer
0x02D0 3204
TX1_HDP
CPDMA Tx Channel 1 Head Desc Pointer
0x02D0 3208
TX2_HDP
CPDMA Tx Channel 2 Head Desc Pointer
0x02D0 320C
TX3_HDP
CPDMA Tx Channel 3 Head Desc Pointer
0x02D0 3210
TX4_HDP
CPDMA Tx Channel 4 Head Desc Pointer
0x02D0 3214
TX5_HDP
CPDMA Tx Channel 5 Head Desc Pointer
0x02D0 3218
TX6_HDP
CPDMA Tx Channel 6 Head Desc Pointer
0x02D0 321C
TX7_HDP
CPDMA Tx Channel 7 Head Desc Pointer
0x02D0 3220
RX0_HDP
CPDMA Rx 0 Channel 0 Head Desc Pointer
0x02D0 3224
RX1_HDP
CPDMA Rx 1 Channel 1 Head Desc Pointer
0x02D0 3228
RX2_HDP
CPDMA Rx 2 Channel 2 Head Desc Pointer
0x02D0 322C
RX3_HDP
CPDMA Rx 3 Channel 3 Head Desc Pointer
0x02D0 3230
RX4_HDP
CPDMA Rx 4 Channel 4 Head Desc Pointer
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Table 6-78. Ethernet Switch Registers (continued)
168
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 3234
RX5_HDP
DESCRIPTION
CPDMA Rx 5 Channel 5 Head Desc Pointer
0x02D0 3238
RX6_HDP
CPDMA Rx 6 Channel 6 Head Desc Pointer
0x02D0 323C
RX7_HDP
CPDMA Rx 7 Channel 7 Head Desc Pointer
0x02D0 3240
TX0_CP
CPDMA Tx Channel 0 Completion Pointer Register
0x02D0 3244
TX1_CP
CPDMA Tx Channel 1 Completion Pointer Register
0x02D0 3248
TX2_CP
CPDMA Tx Channel 2 Completion Pointer Register
0x02D0 324C
TX3_CP
CPDMA Tx Channel 3 Completion Pointer Register
0x02D0 3250
TX4_CP
CPDMA Tx Channel 4 Completion Pointer Register
0x02D0 3254
TX5_CP
CPDMA Tx Channel 5 Completion Pointer Register
0x02D0 3258
TX6_CP
CPDMA Tx Channel 6 Completion Pointer Register
0x02D0 325C
TX7_CP
CPDMA Tx Channel 7 Completion Pointer Register
0x02D0 3260
RX0_CP
CPDMA Rx Channel 0 Completion Pointer Register
0x02D0 3264
RX1_CP
CPDMA Rx Channel 1 Completion Pointer Register
0x02D0 3268
RX2_CP
CPDMA Rx Channel 2 Completion Pointer Register
0x02D0 326C
RX3_CP
CPDMA Rx Channel 3 Completion Pointer Register
0x02D0 3270
RX4_CP
CPDMA Rx Channel 4 Completion Pointer Register
0x02D0 3274
RX5_CP
CPDMA Rx Channel 5 Completion Pointer Register
0x02D0 3278
RX6_CP
CPDMA Rx Channel 6 Completion Pointer Register
0x02D0 327C
RX7_CP
CPDMA Rx Channel 7 Completion Pointer Register
0x02D0 3280 - 0x02D0 32BF
reserved
0x02D0 32C0 - 0x02D0 32FC
reserved
0x02D0 3300 - 0x02D0 337C
reserved
0x02D0 3380 - 0x02D0 33FC
reserved
0x02D0 3400
RXGOODFRAMES
0x02D0 3404
RXBROADCASTFRAMES
CPSW_STATS Total number of good broadcast frames
received
0x02D0 3408
RXMULTICASTFRAMES
CPSW_STATS Total number of good multicast frames
received
0x02D0 340C
RXPAUSEFRAMES
0x02D0 3410
RXCRCERRORS
0x02D0 3414
RXALIGNCODEERRORS
CPSW_STATS Total number of alignment/code errors
received
CPSW_STATS Total number of oversized frames received
0x02D0 3418
RXOVERSIZEDFRAMES
0x02D0 341C
RXJABBERFRAMES
0x02D0 3420
RXUNDERSIZEDFRAMES
0x02D0 3424
RXFRAGMENTS
0x02D0 3428
reserved
0x02D0 342C
reserved
0x02D0 3430
RXOCTETS
0x02D0 3434
TXGOODFRAMES
CPSW_STATS Total number of good frames received
CPSW_STATS PauseRxFrames
CPSW_STATS Total number of CRC errors frames received
CPSW_STATS Total number of jabber frames received
CPSW_STATS Total number of undersized frames received
CPSW_STATS RxFragments received
CPSW_STATS Total number of received bytes in good
frames
CPSW_STATS GoodTxFrames
0x02D0 3438
TXBROADCASTFRAMES
CPSW_STATS BroadcastTxFrames
0x02D0 343C
TXMULTICASTFRAMES
CPSW_STATS MulticastTxFrames
0x02D0 3440
TXPAUSEFRAMES
CPSW_STATS PauseTxFrames
0x02D0 3444
TXDEFERREDFRAMES
CPSW_STATS Deferred Frames
CPSW_STATS Collisions
0x02D0 3448
TXCOLLISIONFRAMES
0x02D0 344C
TXSINGLECOLLFRAMES
0x02D0 3450
TXMULTCOLLFRAMES
CPSW_STATS SingleCollisionTxFrames
CPSW_STATS MultipleCollisionTxFrames
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Table 6-78. Ethernet Switch Registers (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 3454
TXEXCESSIVECOLLISIONS
0x02D0 3458
TXLATECOLLISIONS
0x02D0 345C
TXUNDERRUN
0x02D0 3460
TXCARRIERSENSEERRORS
DESCRIPTION
CPSW_STATS ExcessiveCollisions
CPSW_STATS LateCollisions
CPSW_STATS Transmit Underrun Error
CPSW_STATS CarrierSenseErrors
0x02D0 3464
TXOCTETS
0x02D0 3468
OCTETFRAMES64
CPSW_STATS TxOctets
0x02D0 346C
OCTETFRAMES65T127
CPSW_STATS 65-127octetFrames
0x02D0 3470
OCTETFRAMES128T255
CPSW_STATS 128-255octetFrames
0x02D0 3474
OCTETFRAMES256T511
CPSW_STATS 256-511octetFrames
0x02D0 3478
OCTETFRAMES512T1023
CPSW_STATS 512-1023octetFrames
0x02D0 347C
OCTETFRAMES1024TUP
CPSW_STATS 1023-1518octetFrames
CPSW_STATS 64octetFrames
0x02D0 3480
NETOCTETS
0x02D0 3484
RXSOFOVERRUNS
CPSW_STATS Receive FIFO or DMA Start of Frame
Overruns
0x02D0 3488
RXMOFOVERRUNS
CPSW_STATS Receive FIFO or DMA Mid of Frame
Overruns
0x02D0 348C
RXDMAOVERRUNS
CPSW_STATS Receive DMA Start of Frame and Middle of
Frame Overruns
0x02D0 3490 - 0x02D0 34FC
reserved
0x02D0 3500
ALE_IDVER
0x02D0 3504
reserved
0x02D0 3508
ALE_CONTROL
0x02D0 350C
reserved
0x02D0 3510
ALE_PRESCALE
0x02D0 3514
reserved
0x02D0 3518
ALE_UNKNOWN_VLAN
0x02D0 351C
reserved
0x02D0 3520
ALE_TBLCTL
CPSW_STATS NetOctets
ALE Identification and Version Register
ALE Control Register
ALE Prescale Register
ALE Unknown VLAN Register
ALE Table Control Register
0x02D0 3524 - 0x02D0 3530
reserved
0x02D0 3534
ALE_TBLW2
ALE Table Word 2 Register
0x02D0 3538
ALE_TBLW1
ALE Table Word 1 Register
0x02D0 353C
ALE_TBLW0
ALE Table Word 0 Register
0x02D0 3540
ALE_PORTCTL0
ALE Port 0 Control Register
0x02D0 3544
ALE_PORTCTL1
ALE Port 1 Control Register
0x02D0 3548
ALE_PORTCTL2
ALE Port 2 Control Register
0x02D0 354C - 0x02D0 37FF
reserved
Table 6-79. Ethernet Subsystem Registers
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 2000
IDVER
DESCRIPTION
0x02D0 2004
SOFT_RESET
Soft Reset Register
Identification and Version Register
0x02D0 2008
EM_CONTROL
Emulation Control Register
0x02D0 200C
INT_CONTROL
Interrupt Control Register
0x02D0 2010
RX_THRESH_EN
0x02D0 2014
RX_EN
Receive Interrupt Enable Register
0x02D0 2018
TX_EN
Transmit Interrupt Enable Register
0x02D0 201C
MISC_EN
0x02D0 2020
RX_THRESH_STAT
Receive Threshold Interrupt Enable Register
Misc Interrupt Enable Register
Receive Threshold Masked Interrupt Status Register
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Table 6-79. Ethernet Subsystem Registers (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 2024
RX_STAT
DESCRIPTION
Receive Interrupt Masked Interrupt Status Register
Transmit Interrupt Masked Interrupt Status Register
0x02D0 2028
TX_STAT
0x02D0 202C
MISC_STAT
0x02D0 2030
RX_IMAX
Receive Interrupts Per Millisecond
0x02D0 2034
TX_IMAX
Transmit Interrupts Per Millisecond
Misc Interrupt Masked Interrupt Status Register
Table 6-80. SGMII0 Registers
HEX ADDRESS RANGE
REGISTER NAME
0x02D0 4800
IDVER
DESCRIPTION
0x02D0 4804
SOFT_RESET
0x02D0 4808 - 0x02D0 480C
Reserved
0x02D0 4810
CONTROL
0x02D0 4814
STATUS
Status Register (read only)
0x02D0 4818
MR_ADV_ABILITY
Advertised Ability Register
Identification and Version Register
Soft Reset Register
Reserved
Control Register
0x02D0 481C
MR_NP_TX
0x02D0 4820
MR_LP_ADV_ABILITY
Transmit Next Page Register
0x02D0 4824
MR_NP_RX
0x02D0 4828 - 0x02D0 482C
Reserved
Reserved
0x02D0 4830
Reserved
Reserved
0x02D0 4834
Reserved
Reserved
0x02D0 4838
Reserved
Reserved
0x02D0 483C
Reserved
Reserved
0x02D0 4840
DIAG_CLEAR
0x02D0 4844
DIAG_CONTROL
0x02D0 4848
DIAG_STATUS
0x02D0 484C - 0x02D0 487F
Reserved
Link Partner Advertised Ability (read only)
Link Partner Receive Next Page Register (read only)
Diagnostics Clear Register
Diagnostics Control Register
Diagnostics Status Register (read only)
Reserved
Table 6-81. SGMII1 Registers
170
HEX ADDRESS RANGE
REGISTER NAME
0x02D0 4C00
IDVER
0x02D0 4C04
SOFT_RESET
DESCRIPTION
Identification and Version Register
Soft Reset Register
0x02D0 4C08 - 0x02D0 4C0C
Reserved
0x02D0 4C10
CONTROL
0x02D0 4C14
STATUS
Status Register (read only)
Advertised Ability Register
0x02D0 4C18
MR_ADV_ABILITY
0x02D0 4C1C
MR_NP_TX
0x02D0 4C20
MR_LP_ADV_ABILITY
Reserved
Control Register
Transmit Next Page Register
Link Partner Advertised Ability (read only)
0x02D0 4C24
MR_NP_RX
0x02D0 4C28 - 0x02D0 4C2C
Reserved
Link Partner Receive Next Page Register (read only)
Reserved
0x02D0 4C30
Reserved
Reserved
0x02D0 4C34
Reserved
Reserved
0x02D0 4C38
Reserved
Reserved
0x02D0 4C3C
Reserved
Reserved
0x02D0 4C40
DIAG_CLEAR
0x02D0 4C44
DIAG_CONTROL
0x02D0 4C48
DIAG_STATUS
0x02D0 4C4C - 0x02D0 4C7F
Reserved
Diagnostics Clear Register
Diagnostics Control Register
Diagnostics Status Register (read only)
Reserved
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6.19.4 Ethernet Subsystem Timing
Table 6-82. Ethernet Subsystem Timing Requirements
PARAMETER
t01
(1)
(1)
MIN
NOM
MAX
UNITS
REFCLKP/N period, mode
t02
REFCLKP/N duty cycle
t03
REFCLKP/N rise/fall
t04
PLL Clock Period, x n Mode
t05
PLL power up
x 10 mode
8
ns
x 20 mode
16
ns
x 25 mode
20
ns
40
60
%
700
ps
t01 / n
ns
1 + 200 * C
μs
C = REFCLKP/N period in μs.
REFCLKP/N Jitter and PLL Loop Bandwidth
Jitter on the reference clock will degrade both the transmit eye and receiver jitter tolerance thereby
impairing system performance. A good quality, low jitter reference clock is necessary to achieve
compliance with most if not all physical layer standards (see Table 6-83).
Table 6-83. REFCLKP/N Jitter Requirements for Standards Compliance
Standard
Line Rate (Gbps)
Total REFCLKP/N Jitter (within PLL bandwidth)
Gigabit Ethernet
1.25
50 ps pk-pk
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6.20 Management Data Input/Output (MDIO)
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses to
enumerate all PHY devices in the system. It contains two user access registers to control and monitor up
to two PHYs simultaneously.
The MDIO module implements the 802.3 serial management interface to interrogate and control two
Ethernet PHYs simultaneously using a shared two-wire bus.
6.20.1 MII Management Interface
Host software uses the MDIO module to configure the auto-negotiation parameters of each PHY attached
to the Ethernet Switch Subsystem, retrieve the negotiation results, and configure required parameters in
the Ethernet Switch Subsystem module for correct operation. The module is designed to allow almost
transparent operation of the MDIO interface, with very little maintenance from the core processor. Only a
maximum of two PHYs may be connected at any given time.
For more detailed information on the Ethernet Switch Subsystem, see the TMS320DM647/DM648 DSP
Ethernet Subsystem User's Guide Reference Guide (literature number SPRUF57). For a list of supported
registers and register fields, see Table 6-84.
6.20.2 MDIO Register Descriptions
Table 6-84. MDIO Registers
172
HEX ADDRESS RANGE
REGISTER ACRONYM
0x02D0 4000
MDIOVER
DESCRIPTION
Module version register
0x02D0 4004
MDIOCONTROL
Module control register
0x02D0 4008
MDIOALIVE
0x02D0 400C
MDIOLINK
PHY acknowledge status register
0x02D0 4010
MDIOLINKINTRAW
0x02D0 4014
MDIOLINKINTMASKED
0x02D0 4018 - 0x02D0 401C
reserved
0x02D0 4020
MDIOUSERINTRAW
User command complete interrupt register
(raw value)
0x02D0 4024
MDIOUSERINTMASKED
User command complete interrupt register
(masked value)
PHY link status register
Link status change interrupt register (raw
value)
Link status change interrupt register (masked
value)
0x02D0 4028
MDIOUSERINTMASKSET
User interrupt mask set register
0x02D0 402C
MDIOUSERINTMASKCLR
User interrupt mask clear register
0x02D0 4030 - 0x02D0 407C
reserved
0x02D0 4080
MDIOUSERACCESS0
User access register0
0x02D0 4084
MDIOUSERPHYSEL0
User PHY select register0
0x02D0 4088
MDIOUSERACCESS1
User access register1
0x02D0 408C
MDIOUSERPHYSEL1
User PHY select register1
0x02D0 4090 - 0x02D0 40FF
reserved
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6.21 Timers
The device has four 64-bit general-purpose timers of which only Timer 0 and Timer 1 have external
input/output. The timers can be used to: time events, count events, generate pulses, interrupt the CPU,
and send synchronization events to the EDMA3 channel controller.
6.21.1 General-Purpose Timers
Each timer can be programmed as a 64-bit timer or as two separate 32-bit timers. Each timer is made up
of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx and TOUTLx are
connected to the low counter. The high counter does not have any external device pins.
For more detailed information, see the TMS320DM647DM648 DSP 64-Bit Timer User's Guide (literature
number SPRUEL0).
6.21.2 Timer Peripheral Register Descriptions
Table 6-85. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
0x0204 4400
PID12
0x0204 4404
EMUMGT_CLKSPD
Peripheral Identification Register
0x0204 4410
TIM12
Timer 0 Counter Register 12
0x0204 4414
TIM34
Timer 0 Counter Register 34
Timer 0 Emulation Management/Clock Speed Register
0x0204 4418
PRD12
Timer 0 Period Register 12
0x0204 441C
PRD34
Timer 0 Period Register 34
0x0204 4420
TCR
0x0204 4424
TGCR
0x0x0204 4428 - 0x0204 44FF
-
Timer 0 Control Register
Timer 0 Global Control Register
Reserved
Table 6-86. Timer 1 Registers
HEX ADDRESS RANGE
ACRONYM
0x0204 4800
PID12
DESCRIPTION
0x0204 4804
EMUMGT_CLKSPD
0x0204 4810
TIM12
Timer 1 Counter Register 12
0x0204 4814
TIM34
Timer 1 Counter Register 34
0x0204 4818
PRD12
Timer 1 Period Register 12
0x0204 481C
PRD34
Timer 1 Period Register 34
0x0204 4820
TCR
0x0204 4824
TGCR
0x0204 4828 - 0x0204 48FF
-
Peripheral Identification Register
Timer 1 Emulation Management/Clock Speed Register
Timer 1 Control Register
Timer 1 Global Control Register
Reserved
Table 6-87. Timer 2 Registers
HEX ADDRESS RANGE
ACRONYM
DESCRIPTION
0x0204 4C00
PID12
0x0204 4C04
EMUMGT_CLKSPD
0x0204 4C10
TIM12
Timer 2 Counter Register 12
0x0204 4C14
TIM34
Timer 2 Counter Register 34
0x0204 4C18
PRD12
Timer 2 Period Register 12
0x0204 4C1C
PRD34
Timer 2 Period Register 34
0x0204 4C20
TCR
0x0204 4C24
TGCR
0x0204 4C28 - 0x0204 4CFF
-
Peripheral Identification Register
Timer 2 Emulation Management/Clock Speed Register
Timer 2 Control Register
Timer 2 Global Control Register
Reserved
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Table 6-88. Timer 3 Registers
HEX ADDRESS RANGE
ACRONYM
0x0204 5000
PID12
0x0204 5004
EMUMGT_CLKSPD
0x0204 5010
TIM12
Timer 3 Counter Register 12
0x0204 5014
TIM34
Timer 3 Counter Register 34
0x0204 5018
PRD12
Timer 3 Period Register 12
0x0204 501C
PRD34
Timer 3 Period Register 34
0x0204 5020
TCR
0x0204 5024
TGCR
0x0204 5028 - 0x0204 50FF
-
DESCRIPTION
Peripheral Identification Register
Timer 3 Emulation Management/Clock Speed Register
Timer 3 Control Register
Timer 3 Global Control Register
Reserved
6.21.3 Timer Electrical Data/Timing
Table 6-89. Timing Requirements for Timer Input (1) (see Figure 6-52)
720, 800, 900,
1100
NO.
MIN
1
tw(TIMIxH)
Pulse duration, TIMIxH high
2
tw(TIMIxL)
Pulse duration, TIMIxL low
(1)
UNIT
MAX
12P (1)
ns
12P
ns
P = 1/CPU clock frequency in ns.
Table 6-90. Switching Characteristics for Timer Output
over operating free-air temperature range (unless otherwise noted)
NO.
3
tw(TIMOxH)
Pulse duration, TIMOxH high
4
tw(TIMOxL)
Pulse duration, TIMOxL low
(1)
720, 800, 900, 1100
PARAMETER
MIN
TYP
MAX
UNIT
12P (1)
12P
P = 1/CPU clock frequency in ns.
1
2
TINPLx
3
4
TOUTLx
Figure 6-52. Timer Timing
174
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6.22 VLYNQ Peripheral
6.22.1 VLYNQ Device-Specific Information
The VLYNQ peripheral conforms to the VLYNQ Module Specification (revision 2.x). By default, the VLYNQ
peripheral is initialized with a device ID of 0x22.
6.22.2 VLYNQ Peripheral Register Descriptions
Table 6-91. VLYNQ Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0x3800 0000
-
0x3800 0004
CTRL
Reserved
VLYNQ Local Control Register
0x3800 0008
STAT
VLYNQ Local Status Register
0x3800 000C
INTPRI
VLYNQ Local Interrupt Priority Vector Status/Clear Register
0x3800 0010
INTSTATCLR
VLYNQ Local Interrupt Status/Clear Register
0x3800 0014
INTPENDSET
VLYNQ Local Interrupt Pending/Set Register
0x3800 0018
INTPTR
VLYNQ Local Interrupt Pointer Register
0x3800 001C
XAM
0x3800 0020
RAMS1
VLYNQ Local Transmit Address Map
VLYNQ Local Receive Address Map Size 1
0x3800 0024
RAMO1
VLYNQ Local Receive Address Map Offset 1
0x3800 0028
RAMS2
VLYNQ Local Receive Address Map Size 2
0x3800 002C
RAMO2
VLYNQ Local Receive Address Map Offset 2
0x3800 0030
RAMS3
VLYNQ Local Receive Address Map Size 3
0x3800 0034
RAMO3
VLYNQ Local Receive Address Map Offset 3
0x3800 0038
RAMS4
VLYNQ Local Receive Address Map Size 4
0x3800 003C
RAMO4
VLYNQ Local Receive Address Map Offset 4
0x3800 0040
CHIPVER
VLYNQ Local Chip Version Register
0x3800 0044
AUTNGO
VLYNQ Local Auto Negotiation Register
0x3800 0048
MANNGO
VLYNQ Local Manual Negotiation Register
0x3800 004C
NGOSTAT
VLYNQ Local Negotiation Status Register
0x3800 0050 - 0x3800 005C
-
0x3800 0060
INTVEC0
Reserved
VLYNQ Local Interrupt Vector 3 - 0
0x3800 0064
INTVEC1
VLYNQ Local Interrupt Vector 7 - 4
0x3800 0068 - 0x3800 007C
-
0x3800 0080
RREVID
VLYNQ Remote Revision Register
0x3800 0084
RCTRL
VLYNQ Remote Control Register
0x3800 0088
RSTAT
VLYNQ Remote Status Register
Reserved for future use [Local Interrupt Vectors 8 - 31]
0x3800 008C
RINTPRI
0x3800 0090
RINTSTATCLR
VLYNQ Remote Interrupt Priority Vector Status/Clear Register
VLYNQ Remote Interrupt Status/Clear Register
0x3800 0094
RINTPENDSET
VLYNQ Remote Interrupt Pending/Set Register
0x3800 0098
RINTPTR
0x3800 009C
RXAM
VLYNQ Remote Interrupt Pointer Register
0x3800 00A0
RRAMS1
VLYNQ Remote Receive Address Map Size 1
0x3800 00A4
RRAMO1
VLYNQ Remote Receive Address Map Offset 1
VLYNQ Remote Transmit Address Map
0x3800 00A8
RRAMS2
VLYNQ Remote Receive Address Map Size 2
0x3800 00AC
RRAMO2
VLYNQ Remote Receive Address Map Offset 2
0x3800 00B0
RRAMS3
VLYNQ Remote Receive Address Map Size 3
0x3800 00B4
RRAMO3
VLYNQ Remote Receive Address Map Offset 3
0x3800 00B8
RRAMS4
VLYNQ Remote Receive Address Map Size 4
0x3800 00BC
RRAMO4
VLYNQ Remote Receive Address Map Offset 4
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Table 6-91. VLYNQ Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0x3800 00C0
RCHIPVER
VLYNQ Remote Chip Version Register
REGISTER NAME
0x3800 00C4
RAUTNGO
VLYNQ Remote Auto Negotiation Register
0x3800 00C8
RMANNGO
VLYNQ Remote Manual Negotiation Register
0x3800 00CC
RNGOSTAT
VLYNQ Remote Negotiation Status Register
0x3800 00D0 - 0x3800 00DC
-
0x3800 00E0
RINTVEC0
Reserved
VLYNQ Remote Interrupt Vector 3 - 0
0x3800 00E4
RINTVEC1
VYLNQ Remote Interrupt Vector 7 - 4
0x3800 00E8 - 0x3800 00FC
-
Reserved for future use [Remote Interrupt Vectors 8 - 31]
6.22.3 VLYNQ Electrical Data/Timing
Table 6-92. Timing Requirements for VCLK for VLYNQ (see Figure 6-53)
720, 800, 900, 1100
NO.
1
2
MIN
tc(VCLK)
tw(VCLKH)
3
tw(VCLKL)
4
tt(VCLK)
MAX
UNIT
Cycle time, VCLK
8
ns
Pulse duration, VCLK high, VCLK Input
2
ns
Pulse duration, VCLK high, VCLK Output
3
ns
Pulse duration, VCLK low, VCLK Input
2
ns
Pulse duration, VCLK low, VCLK Output
3
ns
Transition time, VCLK
ns
1
4
2
VCLK
3
4
Figure 6-53. VCLK Timing for VLYNQ
176
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Table 6-93. Switching Characteristics
Over Recommended Operating Conditions for Transmit Data for the VLYNQ Module (see Figure 6-54)
NO.
720, 800, 900, 1100
PARAMETER
MIN
1
td(VCLKH-TXDI)
Delay time, VCLK high to VTXD[3:0] invalid [SLOW Mode]
2.25
1
td(VCLKH-TXDI)
Delay time, VCLK high to VTXD[3:0] invalid [FAST Mode]
0.86
2
td(VCLKH-TXDV)
Delay time, VCLK to VTXD[3:0] valid
MAX
UNIT
ns
ns
6.85
ns
Table 6-94. Timing Requirements for Receive Data for the VLYNQ Module (see Figure 6-54)
720, 800, 900, 1100
NO.
MIN
RTM disabled
3
tsu(RXDV-VCLKH)
Setup time, VRXD[3:0] valid before VCLK
high
th(VCLKH-RXDV)
Hold time, VRXD[3:0] valid after VCLK high
UNIT
0.2
ns
RTM enabled, RXD Flop = 0
1.25
ns
RTM enabled, RXD Flop = 1
0.91
ns
RTM enabled, RXD Flop = 2
0.64
ns
RTM enabled, RXD Flop = 3
0.36
ns
RTM enabled, RXD Flop = 4
0.09
ns
RTM enabled, RXD Flop = 5
-0.18
ns
RTM enabled, RXD Flop = 6
-0.44
ns
RTM enabled, RXD Flop = 7
-0.69
ns
RTM disabled
4
MAX
2
ns
RTM enabled, RXD Flop = 0
0.95
ns
RTM enabled, RXD Flop = 1
1.33
ns
RTM enabled, RXD Flop = 2
1.72
ns
RTM enabled, RXD Flop = 3
2.15
ns
RTM enabled, RXD Flop = 4
2.58
ns
RTM enabled, RXD Flop = 5
3.03
ns
RTM enabled, RXD Flop = 6
3.46
ns
RTM enabled, RXD Flop = 7
3.89
ns
1
VCLK
2
VTXD[3:0]
Data
4
3
VRXD[3:0]
Data
Figure 6-54. VLYNQ Transmit/Receive Timing
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6.23 General-Purpose Input/Output (GPIO)
The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs.
When configured as an output, a write to an internal register can control the state driven on the output pin.
When configured as an input, the state of the input is detectable by reading the state of an internal
register. In addition, the GPIO peripheral can produce CPU interrupts and EDMA events in different
interrupt/event generation modes. The GPIO peripheral provides generic connections to external devices.
The GPIO pins are grouped into banks of 16 pins per bank (i.e., bank 0 consists of GPIO [0:15]).
The GPIO peripheral supports the following:
• Up to 3.3-V GPIO pins
• Interrupts:
– Up to 16 unique GPIO[0:15] interrupts from Bank 0
– One GPIO bank (aggregated) interrupt signal from the GPIOs in Bank 1
– Interrupts can be triggered by rising and/or falling edge, specified for each interrupt capable GPIO
signal
• DMA events:
– Up to 10 unique GPIO DMA events from Bank 0
• Set/clear functionality: Firmware writes 1 to corresponding bit position(s) to set or to clear GPIO
signal(s). This allows multiple firmware processes to toggle GPIO output signals without critical section
protection (disable interrupts, program GPIO, re-enable interrupts, to prevent context switching to
anther process during GPIO programming).
• Separate Input/Output registers
• Output register in addition to set/clear so that, if preferred by firmware, some GPIO output signals can
be toggled by direct write to the output register(s).
• Output register, when read, reflects output drive status. This, in addition to the input register reflecting
pin status and open-drain I/O cell, allows wired logic be implemented.
The memory map for the GPIO registers is shown in Table 6-95.
For more detailed information on GPIOs, see the TMS320DM647/DM648 DSP General-Purpose
Input/Output (GPIO) User's Guide (literature number SPRUEK7).
6.23.1 GPIO Peripheral Register Descriptions
Table 6-95. GPIO Registers
HEX ADDRESS RANGE
ACRONYM
0x0204 8000
PID
0x0204 8004
-
0x0204 8008
BINTEN
REGISTER NAME
Peripheral Identification Register
Reserved
GPIO interrupt per-bank enable
GPIO Banks 0 and 1
178
0x0204 800C
-
0x0204 8010
DIR
Reserved
0x0204 8014
OUT_DATA
GPIO Banks 0 and 1 Output Data Register (GPIO[0:31])
0x0204 8018
SET_DATA
GPIO Banks 0 and 1 Set Data Register (GPIO[0:31])
0x0204 801C
CLR_DATA
GPIO Banks 0 and 1 Clear data for banks 0 and 1 (GPIO[0:31])
0x0204 8020
IN_DATA
0x0204 8024
SET_RIS_TRIG
GPIO Banks 0 and 1 Set Rising Edge Interrupt Register (GPIO[0:31])
GPIO Banks 0 and 1 Direction Register (GPIO[0:31])
GPIO Banks 0 and 1 Input Data Register (GPIO[0:31])
0x0204 8028
CLR_RIS_TRIG
GPIO Banks 0 and 1 Clear Rising Edge Interrupt Register (GPIO[0:31])
0x0204 802C
SET_FAL_TRIG
GPIO Banks 0 and 1 Set Falling Edge Interrupt Register (GPIO[0:31])
0x0204 8030
CLR_FAL_TRIG
GPIO Banks 0 and 1 Clear Falling Edge Interrupt Register (GPIO[0:31])
0x0204 8034
INSTAT
GPIO Banks 0 and 1 Interrupt Status Register (GPIO[0:31])
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6.23.2 GPIO Peripheral Input/Output Electrical Data/Timing
Table 6-96. Timing Requirements for GPIO Inputs (1) (see Figure 6-55)
720, 800, 900,
1100
NO.
MIN
1
2
(1)
UNIT
MAX
tw(GPIH)
Pulse duration, GPIx high
12P
ns
tw(GPIL)
Pulse duration, GPIx low
12P
ns
The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the device
recognize the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to allow the device
enough time to access the GPIO register through the internal bus. P = 1/CPU clock frequency in ns.
Table 6-97. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs
(see Figure 6-55)
NO.
3
4
(1)
720, 800, 900, 1100
PARAMETER
tw(GPOH)
tw(GPOL)
MIN
Pulse duration, GPOx high
Pulse duration, GPOx low
MAX
UNIT
6P (1)
ns
(1)
ns
6P
This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity. P = 1/CPU clock frequency in ns.
2
1
GPIx
4
3
GPOx
Figure 6-55. GPIO Port Timing
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6.24 Emulation Features and Capability
6.24.1 Advanced Event Triggering (AET)
The device supports Advanced Event Triggering (AET). This capability can be used to debug complex
problems as well as understand performance characteristics of user applications. AET provides the
following capabilities:
• Hardware Program Breakpoints: specify addresses or address ranges that can generate events such
as halting the processor or triggering the trace capture.
• Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate
events such as halting the processor or triggering the trace capture.
• Counters: count the occurrence of an event or cycles for performance monitoring.
• State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to
precisely generate events for complex sequences.
For more information on AET, see the following documents:
• Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs Application Report
(literature number SPRA753)
• Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems Application Report (literature number SPRA387)
6.24.2 Trace
The device supports Trace. Trace is a debug technology that provides a detailed, historical account of
application code execution, timing, and data accesses. Trace collects, compresses, and exports debug
information for analysis. Trace works in real-time and does not impact the execution of the system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and
Trace Headers Technical Reference Manual (literature number SPRU655).
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6.25 IEEE 1149.1 JTAG
The JTAG
(2)
interface is used for BSDL testing and emulation of the device.
TRST needs to be released only when it is necessary to use a JTAG controller to debug the device or
exercise the device's boundary scan functionality. Note: TRST is synchronous and must be clocked by
TCK; otherwise, the boundary scan logic may not respond as expected after TRST is asserted.
For maximum reliability, the device includes an internal pulldown (IPD) on the TRST pin to make certain
that TRST will always be asserted upon power up and the device's internal emulation logic will always be
properly initialized.
JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG
controllers may not drive TRST high but expect the use of a pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally
drive TRST high before attempting any emulation or boundary scan operations.
6.25.1 JTAG Peripheral Register Description(s) - JTAG ID Register
Table 6-98. JTAG ID Register
HEX ADDRESS RANGE
ACRONYM
0x0204 9018
(2)
REGISTER NAME
JTAGID
COMMENTS
Read-only. Provides 32-bit
JTAG ID of the device.
JTAG Identification Register
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. The JTAG
ID register resides at address location 0x0204 9018. The register hex value is: 0x0B77 A02F . For the
actual register bit names and their associated bit field descriptions, see Figure 6-56 and Table 6-99.
Figure 6-56. JTAGID Register (0x0204 9018)
31-28
27-12
11-1
0
VERSION
PART NUMBER (16-Bit)
MANUFACTURER (11-Bit)
LSB
R-0001
R-1011 0111 0111 1010
R-0000 0010 111
R-1
LEGEND: R = Read, W = Write, n = value at reset
Table 6-99. JTAGID Register Selection Bit Descriptions
BIT
NAME
31:28
VERSION
DESCRIPTION
27:12
PART NUMBER
11-1
MANUFACTURER
0
LSB
Silicon version value: 0001.
Part Number (16-Bit) value: 1011 0111 0111 1010.
Manufacturer (11-Bit) value: 0000 0010 111.
LSB. This bit is read as a 1.
6.25.2 JTAG Electrical Data/Timing
Table 6-100. Timing Requirements for JTAG Test Port (see Figure 6-57)
720, 800, 900, 1100
NO.
MIN
MAX
UNIT
1
tc(TCK)
Cycle time, TCK
35
ns
3
tsu(TDIV-TCKH)
Setup time, TDI/TMS/TRST valid before TCK high
2
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
0
ns
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Table 6-101. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 6-57)
NO.
2
720, 800, 900, 1100
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
MIN
MAX
0
0.25 × tc(TCK)
UNIT
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 6-57. JTAG Test-Port Timing
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7 Mechanical Data
The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.
7.1
Thermal Data for ZUT
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]
°C/W (1)
AIR FLOW (m/s) (2)
1.7
N/A
RΘJC
RΘJC Junction-to-case
RΘJB
RΘJB Junction-to-board
8.6
N/A
RΘJA
RΘJA Junction-to-free air
17.2
0.0
13.7
1.0
12.4
2.0
11.5
3.0
0.6
0.0
0.6
1.0
0.6
2.0
0.7
3.0
8.4
0.0
7.4
1.0
7.0
2.0
6.7
3.0
ψJT
ψiJB
(1)
(2)
ψJT Junction-to-package top
ψJB Junction-to-board
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
• EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
m/s = meters per second
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7.2
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Packaging Information
The following packaging information reflects the most current data available for the designated device(s).
This data is subject to change without notice and without revision of this document.
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins
Package
Qty
Eco
Plan (2)
Lead/Ball
Finish
MSL Peak Temp (3)
TMS320DM647ZUT1
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
TMS320DM647ZUT7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
SNAGCU
Level-4-245C-72HR
TMS320DM647ZUT9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
SNAGCU
Level-4-245C-72HR
TMS320DM647ZUTA8
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
TMS320DM647ZUTD7
ACTIVE
FCBGA
ZUT
529
TBD
Call TI
Call TI
TMS320DM647ZUTD9
ACTIVE
FCBGA
ZUT
529
TBD
Call TI
Call TI
TMS320DM648ZUT1
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
TMS320DM648ZUT7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
SNAGCU
Level-4-245C-72HR
TMS320DM648ZUT9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
SNAGCU
Level-4-245C-72HR
TMS320DM648ZUTA8
ACTIVE
FCBGA
ZUT
529
1
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
TMS320DM648ZUTD7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
TMS320DM648ZUTD9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free
(RoHS)
Call TI
Level-4-245C-72HR
(1)
(2)
(3)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this
part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please
check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where
designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die
and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based
flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge
and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are
underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing
or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information
to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI
part(s) at issue in this document sold by TI to Customer on an annual basis.
184
Mechanical Data
Copyright © 2007–2011, Texas Instruments Incorporated
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www.ti.com: TMS320DM647 TMS320DM648
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM647ZUT7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM647ZUT9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
SNAGCU
Level-4-245C-72HR
TMS320DM647ZUTA8
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM647ZUTD1
OBSOLETE
FCBGA
ZUT
529
TBD
Call TI
Call TI
TMS320DM647ZUTD7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM647ZUTD9
OBSOLETE
FCBGA
ZUT
529
TBD
Call TI
Call TI
TMS320DM648ZUT1
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM648ZUT7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM648ZUT9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM648ZUTA8
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM648ZUTD7
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMS320DM648ZUTD9
ACTIVE
FCBGA
ZUT
529
84
Pb-Free (RoHS
Exempt)
Call TI
Level-4-245C-72HR
TMX320DM648ACUT7
OBSOLETE
FCBGA
CUT
529
TBD
Call TI
Call TI
TMX320DM648ACUT9
OBSOLETE
FCBGA
CUT
529
TBD
Call TI
Call TI
TMX320DM648CUT7
OBSOLETE
FCBGA
CUT
529
TBD
Call TI
Call TI
TMX320DM648GUT9
OBSOLETE
FCBGA
GUT
529
TBD
Call TI
Call TI
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
Samples
(Requires Login)
TMS320DM647ZUT1
(1)
(3)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2011
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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