TMS320C6421
Fixed-Point Digital Signal Processor
www.ti.com
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
1 TMS320C6421 Fixed-Point Digital Signal Processor
1.1 Features
•
•
•
High-Performance Digital Signal Processor
(C6421)
– 2.5-, 2.-, 1.67-,1.43- ns Instruction Cycle
Time
– 400-, 500-, 600-, 700-MHz C64x+™ Clock
Rate
– Eight 32-Bit C64x+ Instructions/Cycle
– 3200, 4000, 4800, 5600 MIPS
– Fully Software-Compatible With C64x
– Commercial and Automotive (Q or S suffix)
Grades
– Low-Power Device (L suffix)
VelociTI.2™ Extensions to VelociTI™
Advanced Very-Long-Instruction-Word (VLIW)
TMS320C64x+™ DSP Core
– Eight Highly Independent Functional Units
With VelociTI.2 Extensions:
• Six ALUs (32-/40-Bit), Each Supports
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit
Arithmetic per Clock Cycle
• Two Multipliers Support Four 16 x 16-Bit
Multiplies (32-Bit Results) per Clock
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit
Results) per Clock Cycle
– Load-Store Architecture With Non-Aligned
Support
– 64 32-Bit General-Purpose Registers
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Additional C64x+™ Enhancements
• Protected Mode Operation
• Exceptions Support for Error Detection
and Program Redirection
• Hardware Support for Modulo Loop
Auto-Focus Module Operation
C64x+ Instruction Set Features
– Byte-Addressable (8-/16-/32-/64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– VelociTI.2 Increased Orthogonality
– C64x+ Extensions
• Compact 16-bit Instructions
• Additional Instructions to Support
Complex Multiplies
•
•
•
•
•
•
•
•
•
•
•
•
C64x+ L1/L2 Memory Architecture
– 128K-Bit (16K-Byte) L1P Program
RAM/Cache [Flexible Allocation]
– 384K-Bit (48K-Byte) L1D Data RAM/Cache
[Flexible Allocation]
– 512K-Bit (64K-Byte) L2 Unified Mapped
RAM/Cache [Flexible Allocation]
Endianess: Supports Both Little Endian and
Big Endian
External Memory Interfaces (EMIFs)
– 16-Bit DDR2 SDRAM Memory Controller
With 128M-Byte Address Space (1.8-V I/O)
• Supports up to 266-MHz (data rate) bus
and interfaces to DDR2-400 SDRAM
– Asynchronous 8-Bit-Wide EMIF (EMIFA)
With up to 64M-Byte Address Reach
• Flash Memory Interfaces
– NOR (8-Bit-Wide Data)
– NAND (8-Bit-Wide Data)
Enhanced Direct-Memory-Access (EDMA)
Controller (64 Independent Channels)
Two 64-Bit General-Purpose Timers (Each
Configurable as Two 32-Bit Timers)
One 64-Bit Watch Dog Timer
One UART With RTS and CTS Flow Control
Master/Slave Inter-Integrated Circuit
(I2C Bus™)
Multichannel Buffered Serial Port (McBSP0)
– I2S and TDM
– AC97 Audio Codec Interface
– SPI
– Standard Voice Codec Interface (AIC12)
– Telecom Interfaces – ST-Bus, H-100
– 128 Channel Mode
Multichannel Audio Serial Port (McASP0)
– Four Serializers and SPDIF (DIT) Mode
16-Bit Host-Port Interface (HPI)
10/100 Mb/s Ethernet MAC (EMAC)
– IEEE 802.3 Compliant
– Supports Multiple Media Independent
Interfaces (MII, RMII)
– Management Data I/O (MDIO) Module
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this document.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
•
•
•
•
•
•
•
•
VLYNQ™ Interface (FPGA Interface)
Three Pulse Width Modulator (PWM) Outputs
On-Chip ROM Bootloader
Individual Power-Savings Modes
Flexible PLL Clock Generators
IEEE-1149.1 (JTAG™)
Boundary-Scan-Compatible
Up to 111 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions)
•
•
•
•
Packages:
– 361-Pin Pb-Free PBGA Package
(ZWT Suffix), 0.8-mm Ball Pitch
– 376-Pin Plastic BGA Package
(ZDU Suffix), 1.0-mm Ball Pitch
0.09-µm/6-Level Cu Metal Process (CMOS)
3.3-V and 1.8-V I/O, 1.2-V Internal
(-7/-6/-5/-4/-Q6/-Q5/-Q4)
3.3-V and 1.8-V I/O, 1.05-V Internal
(-7/-6/-5/-4/-L/-Q5)
Applications:
– Telecom
– Audio
– Industrial Applications
1.2 Description
The TMS320C64x+™ DSPs (including the TMS320C6421 device) are the highest-performance fixed-point
DSP generation in the TMS320C6000™ DSP platform. The C6421 device is based on the third-generation
high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by
Texas Instruments (TI), making these DSPs an excellent choice for digital signal processor applications.
The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™
DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from
previous devices.
Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and
C64x+ CPU, respectively.
With performance of up to 5600 million instructions per second (MIPS) at a clock rate of 700 MHz, the
C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses
the operational flexibility of high-speed controllers and the numerical capability of array processors. The
C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly
independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The
eight functional units include instructions to accelerate the performance in telecom, audio, and industrial
applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of
2800 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 5600 MMACS. For
more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference
Guide (literature number SPRU732).
The C6421 also has application-specific hardware logic, on-chip memory, and additional on-chip
peripherals similar to the other C6000 DSP platform devices. The C6421 core uses a two-level
cache-based architecture. The Level 1 program memory/cache (L1P) consists of a 128K-bit memory
space that can be configured as mapped memory or direct mapped cache, and the Level 1 data (L1D)
consists of a 384K-bit memory space that can be configured as mapped memory or 2-way set-associative
cache. The Level 2 memory/cache (L2) consists of a 512K-bit memory space that is shared between
program and data space. L2 memory can be configured as mapped memory, cache, or combinations of
the two.
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The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a management data input/output
(MDIO) module; a 4-bit transmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus
interface; a multichannel buffered serial port (McBSP0); a multichannel audio serial port (McASP0) with 4
serializers; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit
watchdog timer; a user-configurable 16-bit host-port interface (HPI); up to 111-pins of general-purpose
input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other
peripherals; 1 UART with hardware handshaking support; 3 pulse width modulator (PWM) peripherals; and
2 glueless external memory interfaces: an asynchronous external memory interface (EMIFA) for slower
memories/peripherals, and a higher speed synchronous memory interface for DDR2.
The Ethernet Media Access Controller (EMAC) provides an efficient interface between the C6421 and the
network. The C6421 EMAC supports 10Base-T and 100Base-TX or 10 Mbits/second (Mbps) and 100
Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system.
The I2C and VLYNQ ports allow C6421 to easily control peripheral devices and/or communicate with host
processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with
external processors. For details on each of the peripherals, see the related sections later in this document
and the associated peripheral reference guides.
The C6421 has a complete set of development tools. These include C compilers, a DSP assembly
optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into
source code execution.
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Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
1.3
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Functional Block Diagram
Figure 1-1 shows the functional block diagram of the C6421 device.
JTAG Interface
System Control
Input
Clock(s)
DSP
OSC
C64x+™ DSP CPU
PLLs/Clock Generator
Power/Sleep
Controller
Pin Multiplexing
64 KB L2 RAM
16 KB
L1 Pgm
16 KB
L1 Data
Boot ROM
Switched Central Resource (SCR)
Peripherals
Serial Interfaces
McASP
McBSP
I2C
System
GeneralPurpose
Timer
UART
Watchdog
Timer
GPIO
PWM
EDMA
Program/Data Storage
Connectivity
VLYNQ
EMAC
With
MDIO
HPI
DDR2
Mem Ctlr
(16b)
Async EMIF/
NAND/
(8b)
Figure 1-1. TMS320C6421 Functional Block Diagram
4
TMS320C6421 Fixed-Point Digital Signal Processor
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Fixed-Point Digital Signal Processor
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Contents
1
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) ........... 111
TMS320C6421 Fixed-Point Digital Signal
Processor.................................................. 1
1.1
Features .............................................. 1
1.2
Description ............................................ 2
1.3
Functional Block Diagram ............................ 4
6
Revision History ............................................... 6
2 Device Overview ......................................... 7
6.3
6.4
Power Supplies .................................... 114
Enhanced Direct Memory Access (EDMA3)
Controller ........................................... 122
2.2
C64x+ Megamodule .................................. 8
2.3
Memory Map Summary
14
6.5
Reset ............................................... 135
2.4
Pin Assignments
16
6.6
External Clock Input From MXI/CLKIN Pin
24
6.7
Clock PLLs ......................................... 146
56
Device and Development-Support Tool
Nomenclature ....................................... 56
6.8
Interrupts ........................................... 152
6.9
6.10
External Memory Interface (EMIF) ................. 155
Universal Asynchronous Receiver/Transmitter
(UART) ............................................. 163
6.11
Inter-Integrated Circuit (I2C) ....................... 166
6.12
Host-Port Interface (HPI) Peripheral ............... 170
6.13
6.14
Multichannel Buffered Serial Port (McBSP)........ 175
Multichannel Audio Serial Port (McASP0)
Peripheral .......................................... 183
2.8
.............................
....................................
Terminal Functions ..................................
Device Support ......................................
Documentation Support ............................. 58
Device Configurations................................. 59
........
144
3.1
System Module Registers ........................... 59
3.2
Power Considerations ............................... 60
3.3
Clock Considerations ................................ 62
3.4
Boot Sequence ...................................... 64
3.5
Configurations At Reset ............................. 73
6.15
Ethernet Media Access Controller (EMAC) ........ 191
3.6
Configurations After Reset .......................... 75
6.16
Management Data Input/Output (MDIO)
3.7
Multiplexed Pin Configurations ...................... 79
6.17
Timers .............................................. 202
3.8
Device Initialization Sequence After Reset ........ 103
6.18
Pulse Width Modulator (PWM)..................... 204
3.9
Debugging Considerations ......................... 105
6.19
VLYNQ ............................................. 206
System Interconnect ................................. 107
6.20
General-Purpose Input/Output (GPIO)............. 210
System Interconnect Block Diagram ............... 107
6.21
IEEE 1149.1 JTAG ................................. 214
4.1
5
Parameter Information ............................. 113
Recommended Clock and Control Signal Transition
Behavior............................................ 114
Device Characteristics ................................ 7
2.6
2.7
4
6.1
6.2
2.1
2.5
3
Peripheral Information and Electrical
Specifications ......................................... 113
Device Operating Conditions....................... 109
5.1
5.2
5.3
7
..........
200
Mechanical Data....................................... 216
Thermal Data for ZWT ............................. 216
Absolute Maximum Ratings Over Operating
Temperature Range (Unless Otherwise Noted) ... 109
7.1
Recommended Operating Conditions ............. 110
Electrical Characteristics Over Recommended
7.1.2 Packaging Information............................. 217
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7.1.1 Thermal Data for ZDU ............................. 217
Contents
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This data manual revision history highlights the technical changes made to the SPRS346C device-specific
data manual to make it an SPRS346D revision.
Scope: Applicable updates to the TMS320C642x, specifically relating to the TMS320C6421 device, have
been incorporated.
• Added 700-MHz C64x+™ device speed.
• Added designators for low-power (-L) devices.
SEE
Section 1.1
Added "5600 MIPS" to "High-Performance Digital Signal Processor (C6421)" bullet
Section 1.2
•
Section 2.7
Updated/Changed Figure 2-12, Device Nomenclature, to reflect new device speeds and low-power
designator (-L suffix).
Section 2.5
Table 2-20, Multichannel Audio Serial Port (McASP0) Terminal Functions:
• Updated/Changed AFSR0/DR0/GP[100] pin description from "... frame synchronization AFSX0..." to
"...frame synchronization AFSR0..."
• Updated/Changed AFSX0/DX1/GP[107] pin description from "...frame synchronization AFSR0..." to
"...frame synchronization AFSX0..."
Section 2.5
Table 2-25, Standalone GPIO 3.3 V Terminal Functions:
• Added "Note: GP[xx] is only available when AEM = 0 or 5" to GP[36] through GP[43].
Section 3.7.3.1
6
ADDITIONS/MODIFICATIONS/DELETIONS
In first paragraph, updated/changed the following:
– First sentence from "With performance up to 4800 million instructions per second (MIPS) at a
clock rate of 600 MHz..." to "With performance up to 5600 million instructions per second (MIPS)
with a clock rate of 700 MHz..."
– Fifth sentence from "The DSP core can produce...for a total of 2400 million MACs per second...or
a total of 4800 MMACS."to "The DSP core can produce...for a total of 2800 million MACs per
second...or a total of 5600 MMACS."
Table 3-19, Multiplexed Pins on C6421:
• Added "Note: GP[43:36] are only available when AEM = 0 or 5" to GP[36] through GP[43].
Section 5.3
Updated/Changed ICDD and IDDD test conditions and footnote in Section 5.3, Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Temperature (Unless Otherwise Noted).
Section 5.2
Deleted "Future variants..." footnote from table
Section 6.7.1
Table 6-15, PLLC1 Clock Frequency Ranges:
• Updated/Changed PLLOUT 1.2V-CVDD max value from "700 MHz" to "600 MHz" for
-6/-5/-4/-Q6/-Q5/-Q4 devices.
• Updated/Changed SYSCLK1 1.05V-CVDD max value from "560 MHz" to "520 MHz" for -7 devices.
Section 6.7.1
Updated/Changed sentence from "TI requires EMI filter manufacturer Murata..." to "TI recommends EMI
filter manufacturer Murata..."
Section 6.7.4
Deleted "(-4, -4Q, -4S, -5, -5Q, -5S, -6)" from Table 6-19 title, Timing Requirements for MXI/CLKIN.
Revision History
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2 Device Overview
2.1 Device Characteristics
Table 2-1, provides an overview of the TMS320C6421 DSP. The tables show significant features of the
C6421 device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the
package type with pin count.
Table 2-1. Characteristics of the C6421 Processor
HARDWARE FEATURES
C6421
DDR2 Memory Controller
(16-bit bus width) [1.8 V I/O]
Asynchronous EMIF [EMIFA]
EDMA3
1 (64 independent channels, 8 QDMA channels)
Timers
2 64-bit General Purpose
(configurable as 2 64-bit or 4 32-bit)
1 64-bit Watch Dog
UART
1 with RTS and CTS flow control
Peripherals
Not all peripherals pins
are available at the same
time (For more detail, see
the Device Configuration
section).
I2C
1
McASP
1 (4 serailizers)
VLYNQ
General-Purpose Input/Output Port (GPIO)
PWM
1
Organization
Control Status Register (CSR.[31:16])
JTAG BSDL_ID
JTAGID register
(address location: 0x01C4 0028)
(1)
16K-Byte (16KB) L1 Program (L1P) RAM/Cache
48KB L1 Data (L1D) RAM/Cache
64KB Unified Mapped RAM/Cache (L2)
64KB Boot ROM
See theTMS320C6424/21 Digital Signal Processor
(DSP) [Silicon Revisions 1.1 and 1.0] Silicon Errata
(literature number SPRZ252).
See Section 6.21.1, JTAG Peripheral Register
Description(s) – JTAG ID Register
MHz
700 (-7, CVDD = 1.2V)
600 (-6/-Q6, CVDD = 1.2V)
500 (-5/-Q5, CVDD = 1.2V)
400 (-4/-Q4, CVDD = 1.2V)
400 (-L, CVDD = 1.05V)
ns
1.43 (-7, CVDD = 1.2V)
1.67 (-6/-Q6, CVDD = 1.2V)
2 (-5/-Q5, CVDD = 1.2V)
2.5 (-4/-Q4, CVDD = 1.2V)
2.5 (-L, CVDD = 1.05V)
Core (V)
I/O (V)
PLL Options
3 outputs
96KB RAM, 64KB ROM
CPU ID + CPU Rev ID
Voltage (1)
1
Up to 111 pins
Size (Bytes)
Revision ID Register (MM_REVID.[15:0])
(address location: 0x0181 2000)
Cycle Time (1)
1
HPI (16-bit)
Megamodule Rev ID
CPU Frequency (1)
1 (Master/Slave)
McBSP
10/100 Ethernet MAC (EMAC) with
Management Data Input/Output (MDIO)
On-Chip Memory
Asynchronous (8-bit bus width),
RAM, Flash, (8-bit NOR or 8-bit NAND)
MXI/CLKIN frequency multiplier
(15–30 MHz reference)
1.2 V
(-7/ -6/-5/ -4/-Q6/-Q5/-Q4)
1.05 V
(-7/-6/-5/-4/-L/-Q5)
1.8 V, 3.3 V
x1 (Bypass), x14 to x 32
Applies to "tape and reel" part number counterparts as well. For more information, see Section 2.7, Device and Development-Support
Tool Nomenclature.
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Device Overview
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Fixed-Point Digital Signal Processor
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Table 2-1. Characteristics of the C6421 Processor (continued)
BGA Package(s)
Process Technology
Product Status
(2)
(2)
HARDWARE FEATURES
C6421
16 x 16 mm, 0.8 mm pitch
361-Pin BGA (ZWT)
23 x 23 mm, 1.0 mm pitch
376-Pin BGA (ZDU)
µm
0.09 µm
Product Preview (PP), Advance Information (AI),
or Production Data (PD)
PD
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
2.2 C64x+ Megamodule
2.2.1
C64x+ Memory Architecture
The C64x+ Megamodule implements a two-level internal cache-based memory architecture with external
memory support. The Level 1 Program memory/cache (L1P) consists of 16 KB memory space that can be
configured as mapped memory or direct mapped cache. The Level 1 Data memory/cache (L1D) consists
of 48 KB memory space which can be configured as mapped memory or 2-way set associated cache. The
Level 2 memory/cache (L2) consists of a 64 KB memory space that is shared between program and data
space. L2 memory can be configured as mapped memory, cache, or a combination of both.
Table 2-2 shows a memory map of the C64x+ CPU cache register for the device.
Figure 2-1, shows a diagram of the C64x+ Cache Memory Architecture.
Table 2-2. C64x+ Cache Registers
8
HEX ADDRESS RANGE
REGISTER ACRONYM
0x0184 0000
L2CFG
0x0184 0020
L1PCFG
0x0184 0024
L1PCC
0x0184 0040
L1DCFG
0x0184 0044
L1DCC
0x0184 0048 - 0x0184 0FFC
-
0x0184 1000
EDMAWEIGHT
DESCRIPTION
L2 Cache configuration register
L1P Size Cache configuration register (see Section 2.2.1.1, L1P
Configuration Register (L1PCFG) Description)
L1P Freeze Mode Cache configuration register
L1D Size Cache configuration register (see Section 2.2.1.2, L1D
Configuration Register (L1DCFG) Description)
L1D Freeze Mode Cache configuration register
Reserved
L2 EDMA access control register
0x0184 1004 - 0x0184 1FFC
-
0x0184 2000
L2ALLOC0
Reserved
L2 allocation register 0
0x0184 2004
L2ALLOC1
L2 allocation register 1
0x0184 2008
L2ALLOC2
L2 allocation register 2
0x0184 200C
L2ALLOC3
L2 allocation register 3
0x0184 2010 - 0x0184 3FFF
-
0x0184 4000
L2WBAR
L2 writeback base address register
0x0184 4004
L2WWC
L2 writeback word count register
0x0184 4010
L2WIBAR
L2 writeback invalidate base address register
0x0184 4014
L2WIWC
L2 writeback invalidate word count register
Reserved
0x0184 4018
L2IBAR
L2 invalidate base address register
0x0184 401C
L2IWC
L2 invalidate word count register
0x0184 4020
L1PIBAR
L1P invalidate base address register
0x0184 4024
L1PIWC
L1P invalidate word count register
0x0184 4030
L1DWIBAR
L1D writeback invalidate base address register
0x0184 4034
L1DWIWC
L1D writeback invalidate word count register
0x0184 4038
-
Device Overview
Reserved
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Table 2-2. C64x+ Cache Registers (continued)
HEX ADDRESS RANGE
REGISTER ACRONYM
0x0184 4040
L1DWBAR
L1D Block Writeback
DESCRIPTION
0x0184 4044
L1DWWC
L1D Block Writeback
0x0184 4048
L1DIBAR
L1D invalidate base address register
0x0184 404C
L1DIWC
L1D invalidate word count register
0x0184 4050 - 0x0184 4FFF
-
0x0184 5000
L2WB
0x0184 5004
L2WBINV
0x0184 5008
L2INV
0x0184 500C - 0x0184 5027
-
Reserved
L2 writeback all register
L2 writeback invalidate all register
L2 Global Invalidate without writeback
Reserved
0x0184 5028
L1PINV
0x0184 502C - 0x0184 5039
-
0x0184 5040
L1DWB
0x0184 5044
L1DWBINV
0x0184 5048
L1DINV
0x0184 8000 - 0x0184 80BC
MAR0 - MAR47
Reserved (corresponds to byte address 0x0000 0000 - 0x2FFF FFFF)
0x0184 8100 - 0x0184 8104
MAR64 - MAR65
Reserved (corresponds to byte address 0x4000 0000 - 0x41FF FFFF)
0x0184 8108 - 0x0184 8124
MAR66 - MAR73
Memory Attribute Registers for EMIFA (corresponds to byte address 0x4200
0000 - 0x49FF FFFF)
0x0184 8128 - 0x0184 812C
MAR74 - MAR75
Reserved (corresponds to byte address 0x4A00 0000 - 0x4BFF FFFF)
0x0184 8130 - 0x0184 813C
MAR76 - MAR79
Memory Attribute Registers for VLYNQ 0x4C00 0000 - 0x4FFF FFFF
0x0184 8140- 0x0184 81FC
MAR80 - MAR127
Reserved (corresponds to byte address 0x5000 0000 - 0x7FFF FFFF)
0x0184 8200 - 0x0184 823C
MAR128 - MAR143
Memory Attribute Registers for DDR2 (corresponds to byte address 0x8000
0000 - 0x8FFF FFFF)
0x0184 8240 - 0x0184 83FC
MAR144 - MAR255
Reserved (corresponds to byte address 0x9000 0000 - 0xFFFF FFFF)
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L1P Global Invalidate
Reserved
L1D Global Writeback
L1D Global Writeback with Invalidate
L1D Global Invalidate without writeback
Device Overview
9
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
C64x+ CPU
Data Path
256 Bit
Fetch Path
L1D
SRAM
L1D
Cache
L1 Data
256 Bit
256 Bit
L1 Program
L2 SRAM
Write
Buffer
128 Bit
L1P
Cache
256 Bit
L1P
SRAM
2 x 64 Bit
L2 Cache
64 Bit
L2 Unified Data/Program Memory
External Memory
Legend:
Addressable Memory
Cache Memory
Data Paths Managed By
Cache Controller
Figure 2-1. C64x+ Cache Memory Architecture
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The L1P is divided into two regions—denoted as L1P Region 0 and L1P Region 1. This is the L1P
architecture on the C6421:
• L1P Region 0: 0-KByte Memory
• L1P Region 1: 16-KByte Memory
– L1P Region 1 can be configured as mapped memory or cache and has a 0 wait state latency. This
region is shown as "L1P RAM/Cache" in Table 2-5, Memory Map Summary.
The C6421 does not support memory protection on L1P.
The L1D is divided into two regions—denoted as L1D Region 0 and L1D Region 1. This is the L1D
architecture on the C6421:
• L1D Region 0: 16-KByte Memory
– This region is shown as "L1D RAM" in Table 2-5, Memory Map Summary.
• L1D Region 1: 32-KByte Memory
– L1D Region 1 can be configured as mapped memory or cache. This region is shown as "L1D
RAM/Cache" in Table 2-5, Memory Map Summary.
The C6421 does not support memory protection on L1D.
L2 memory implements two separate memory ports. This is the L2 architecture on the C6421:
• Port 0
– This port is shown as "L2 RAM/Cache" in Table 2-5, Memory Map Summary.
– Banking Scheme: 2 x 128-bit banks
– Latency: 1 cycle (0 wait state)
• Port 1
– This port is shown as "Boot ROM" in Table 2-5, Memory Map Summary.
– Banking Scheme: 1 x 256-bit bank
– Latency: 1 cycle (0 wait state)
The C6421 does not support memory protection on L2.
For more detailed information about the C64x+ Cache Memory Architecture, see the TMS320C64x+ DSP
Cache User's Guide (literature number SPRU862) and the TMS320C64x+ DSP Megamodule Reference
Guide (literature number SPRU871).
2.2.1.1 L1P Configuration Register (L1PCFG) Description
The L1P Configuration Register (L1PCFG) controls/defines the size of the L1P cache. On the C6421, the
L1PCFG register is device-specific and varies from what is shown in the TMS320C64x+ DSP
Megamodule Reference Guide (literature number SPRU871). The format and bit field descriptions of the
L1PCFG register for the C6421 are shown in Figure 2-2 and Table 2-3, respectively.
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31
16
RESERVED
R-0000 0000 0000 0000
15
3
2
0
RESERVED
L1PMODE
R- 0000 0000 0000 0
R/W-111 (7h)
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset.
Figure 2-2. L1PCFG Register
Table 2-3. L1PCFG Register Bit Descriptions
Bit
Field Name
31:3
RESERVED
Description
Reserved. Read-only, writes have no effect.
L1PMODE select.
2:0
(1)
L1PMODE
000
001
010
011
100
[0h]
[1h]
[2h]
[3h]
[4h]
= L1P Cache Disabled
= 4 KB
= 8 KB
= 16KB
– 111 [7h] = Reserved. Do Not Use. (1)
For proper C6421 device operation, only settings 000 [0h] through 011 [3h] are valid. To intialize L1P RAM/Cache to a valid cache
setting, the user must follow the sequence outlined in Section 3.8, Device Initialization Sequence After Reset. For more details, see the
TMS320C6424/21 Digital Signal Processor (DSP) Silicon Errata [Silicon Revisions 1.1 and 1.0] (literature number SPRZ252).
2.2.1.2 L1D Configuration Register (L1DCFG) Description
The L1D Configuration Register (L1DCFG) controls/defines the size of the L1D cache. The format and bit
field descriptions of the L1DCFG register for the C6421 are shown in Figure 2-3 and Table 2-4,
respectively.
31
16
RESERVED
R-0000 0000 0000 0000
15
3
2
0
RESERVED
L1DMODE
R- 0000 0000 0000 0
R/W-111 (7h)
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset.
Figure 2-3. L1DCFG Register
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Table 2-4. L1DCFG Register Bit Descriptions
Bit
Field Name
31:3
RESERVED
Description
Reserved. Read-only, writes have no effect.
L1DMODE select.
2:0
L1DMODE
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000
001
010
011
100
101
110
111
[0h]
[1h]
[2h]
[3h]
[4h]
[5h]
[6h]
[7h]
= L1D Cache Disabled
= 4 KB
= 8 KB
= 16KB
= 32KB
= 32KB
= 32KB
= 32KB [default]
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TMS320C6421
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2.3 Memory Map Summary
Table 2-5 shows the memory map address ranges of the device. Table 2-6 depicts the expanded map of
the Configuration Space (0x0180 0000 through 0x0FFF FFFF). The device has multiple on-chip memories
associated with its two processors and various subsystems. To help simplify software development a
unified memory map is used where possible to maintain a consistent view of device resources across all
bus masters.
Table 2-5. Memory Map Summary
START
ADDRESS
END
ADDRESS
SIZE
(Bytes)
C64x+
MEMORY MAP
EDMA PERIPHERAL
MEMORY MAP
0x0000 0000
0x000F FFFF
1M
Reserved
0x0010 0000
0x0010 FFFF
64K
Boot ROM
0x0011 0000
0x007F FFFF
7M-64K
Reserved
0x0080 0000
0x0080 FFFF
64K
Reserved
0x0081 0000
0x0081 FFFF
64K
L2 RAM/Cache (1)
0x0082 0000
0x00E0 7FFF
6048K
Reserved
0x00E0 8000
0x00E0 BFFF
16K
Reserved
0x00E0 C000
0x00E0 FFFF
16K
L1P RAM/Cache (2)
0x00E1 0000
0x00F0 3FFF
976K
Reserved
0x00F0 4000
0x00F0 BFFF
32K
Reserved
0x00F0 C000
0x00F0 FFFF
16K
L1D RAM
0x00F1 0000
0x00F1 7FFF
32K
L1D RAM/Cache (2)
0x00F1 8000
0x017F FFFF
9120K
Reserved
0x0180 0000
0x01BF FFFF
4M
CFG Space
0x01C0 0000
0x01FF FFFF
4M
CFG Bus Peripherals
0x0200 0000
0x100F FFFF
225M
Reserved
0x1010 0000
0x1010 FFFF
64K
Boot ROM
0x1011 0000
0x107F FFFF
7M-48K
Reserved
0x1080 0000
0x1080 FFFF
64K
Reserved
Reserved
0x1081 0000
0x1081 FFFF
64K
L2 RAM/Cache (1)
L2 RAM/Cache (1)
0x1082 0000
0x10E0 7FFF
6048K
Reserved
Reserved
0x10E0 8000
0x10E0 BFFF
16K
Reserved
Reserved
0x10E0 C000
0x10E0 FFFF
16K
L1P RAM/Cache (2)
L1P RAM/Cache (2)
0x10E1 0000
0x10F0 BFFF
1M-16K
Reserved
Reserved
0x10F0 C000
0x10F0 FFFF
16K
L1D RAM
L1D RAM
0x10F1 0000
0x10F1 7FFF
32K
L1D RAM/Cache (2)
L1D RAM/Cache (2)
0x10F1 8000
0x1FFF FFFF
241M-96K
Reserved
Reserved
0x2000 0000
0x2000 7FFF
32K
DDR2 Control Regs
DDR2 Control Regs
0x2000 8000
0x41FF FFFF
544M-32K
Reserved
Reserved
0x4200 0000
0x42FF FFFF
16M
EMIFA Data (CS2) (3)
EMIFA Data (CS2) (3)
0x4300 0000
0x43FF FFFF
16M
Reserved
Reserved
0x4400 0000
0x44FF FFFF
16M
EMIFA Data (CS3) (3)
EMIFA Data (CS3) (3)
0x4500 0000
0x45FF FFFF
16M
Reserved
Reserved
0x4600 0000
0x46FF FFFF
16M
EMIFA Data (CS4) (3)
EMIFA Data (CS4) (3)
0x4700 0000
0x47FF FFFF
16M
Reserved
Reserved
0x4800 0000
0x48FF FFFF
16M
EMIFA Data (CS5) (3)
EMIFA Data (CS5) (3)
0x4900 0000
0x4BFF FFFF
48M
Reserved
Reserved
0x4C00 0000
0x4FFF FFFF
64M
VLYNQ (Remote Data)
VLYNQ (Remote Data)
0x5000 0000
0x7FFF FFFF
768M
Reserved
Reserved
0x8000 0000
0x8FFF FFFF
256M
DDR2 Memory Controller
DDR2 Memory Controller
0x9000 0000
0xFFFF FFFF
1792M
Reserved
Reserved
(1)
(2)
(3)
14
Reserved
CFG Bus Peripherals
Reserved
On the C6421, L2 RAM/Cache defaults to all RAM (L2CFG.L2MODE = 0h)
To intialize L1P and L1D RAM/Cache to a valid cache setting, the user must follow the sequence outlined in Section 3.8, Device
Initialization Sequence After Reset.
The EMIFA CS0 and CS1 are not functionally supported on the C6421 device, and therefore, are not pinned out.
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Table 2-6. Configuration Memory Map Summary
START
ADDRESS
END
ADDRESS
SIZE
(Bytes)
C64x+
0x0180 0000
0x0180 FFFF
64K
C64x+ Interrupt Controller
0x0181 0000
0x0181 0FFF
4K
C64x+ Powerdown Controller
0x0181 1000
0x0181 1FFF
4K
C64x+ Security ID
0x0181 2000
0x0181 2FFF
4K
C64x+ Revision ID
0x0182 0000
0x0182 FFFF
64K
C64x+ EMC
0x0183 0000
0x0183 FFFF
64K
Reserved
0x0184 0000
0x0184 FFFF
64K
C64x+ Memory System
0x0185 0000
0x0187 FFFF
192K
Reserved
0x0188 0000
0x01BB FFFF
3328K
Reserved
0x01BC 0000
0x01BC 00FF
256
Reserved
0x01BC 0100
0x01BC 01FF
256
Pin Manager and Trace
0x01BC 0400
0x01BF FFFF
255K
Reserved
0x01C0 0000
0x01C0 FFFF
64K
EDMA CC
0x01C1 0000
0x01C1 03FF
1K
EDMA TC0
0x01C1 0400
0x01C1 07FF
1K
EDMA TC1
0x01C1 0800
0x01C1 0BFF
1K
EDMA TC2
0x01C1 0C00
0x01C1 FFFF
29K
Reserved
0x01C2 0000
0x01C2 03FF
1K
UART0
0x01C2 0400
0x01C2 0FFF
3K
Reserved
0x01C2 1000
0x01C2 13FF
1K
I2C
0x01C2 1400
0x01C2 17FF
1K
Timer0
0x01C2 1800
0x01C2 1BFF
1K
Timer1
0x01C2 1C00
0x01C2 1FFF
1K
Timer2 (Watchdog)
0x01C2 2000
0x01C2 23FF
1K
PWM0
0x01C2 2400
0x01C2 27FF
1K
PWM1
0x01C2 2800
0x01C2 2BFF
1K
PWM2
0x01C2 2C00
0x01C3 FFFF
117K
Reserved
0x01C4 0000
0x01C4 07FF
2K
System Module
0x01C4 0800
0x01C4 0BFF
1K
PLL Controller 1
0x01C4 0C00
0x01C4 0FFF
1K
PLL Controller 2
0x01C4 1000
0x01C4 1FFF
4K
Power and Sleep Controller
0x01C4 2000
0x01C6 6FFF
148K
Reserved
0x01C6 7000
0x01C6 77FF
2K
GPIO
0x01C6 7800
0x01C6 7FFF
2K
HPI
0x01C6 8000
0x01C7 FFFF
96K
Reserved
0x01C8 0000
0x01C8 0FFF
4K
EMAC Control Registers
0x01C8 1000
0x01C8 1FFF
4K
EMAC Control Module Registers
0x01C8 2000
0x01C8 3FFF
8K
EMAC Control Module RAM
0x01C8 4000
0x01C8 47FF
2K
MDIO Control Registers
0x01C8 4800
0x01CF FFFF
494K
Reserved
0x01D0 0000
0x01D0 07FF
2K
McBSP0
0x01D0 0800
0x01D0 0FFF
2K
Reserved
0x01D0 1000
0x01D0 13FF
1K
McASP0 Control
0x01D0 1400
0x01D0 17FF
1K
McASP0 Data
0x01D0 1800
0x01DF FFFF
1018K
Reserved
0x01E0 0000
0x01E0 0FFF
4K
EMIFA Control
0x01E0 1000
0x01E0 1FFF
4K
VLYNQ Control Registers
0x01E0 2000
0x0FFF FFFF
226M-8K
Reserved
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2.4 Pin Assignments
Extensive use of pin multiplexing is used to accommodate the largest number of peripheral functions in
the smallest possible package. Pin multiplexing is controlled using a combination of hardware
configuration at device reset and software programmable register settings. For more information on pin
muxing, see Section 3.7, Multiplexed Pin Configurations.
2.4.1
Pin Map (Bottom View)
Figure 2-4 through Figure 2-7 show the bottom view of the ZWT package pin assignments in four
quadrants (A, B, C, and D). Figure 2-8 through Figure 2-11 show the bottom view of the ZDU package pin
assignments in four quadrants (A, B, C, and D).
1
2
3
4
5
6
7
8
9
10
W
VSS
VSS
DDR_D[7]
DDR_D[9]
DDR_D[12]
DDR_D[14]
DDR_CLK
DDR_CLK
DDR_A[12]
DDR_A[11]
W
V
DVDDR2
DDR_D[4]
DDR_D[6]
DDR_D[8]
DDR_D[11]
DDR_D[13]
DDR_D[15]
DDR_CKE
DDR_BA[1]
DDR_A[8]
V
U
DDR_D[2]
DDR_D[3]
DDR_D[5]
DDR_DQS[0]
DDR_D[10]
DDR_DQS[1]
DDR_RAS
DDR_BA[0]
DDR_BA[2]
DDR_A[10]
U
T
DDR_D[0]
DDR_D[1]
RSV16
DDR_DQM[0]
DVDDR2
DDR_DQM[1]
DDR_CAS
DDR_WE
DDR_CS
DDR_ZN
T
R
VSS
TRST
TMS
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
R
P
DVDD33
EMU0
TDO
TDI
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
VSS
P
N
TCK
EMU1
RESETOUT
POR
VSS
DVDD33
VSS
CVDD
VSS
CVDD
N
M
CLKOUT0/
PWM2/
GP[84]
SCL
SDA
RESET
DVDD33
VSS
CVDD
VSS
CVDD
VSS
M
L
UCTS0/
GP[87]
URXD0/
GP[85]
URTS0/
PWM0/
GP[88]
TINP1L/
GP[56]
RSV3
DVDD33
VSS
CVDD
VSS
CVDD
L
K
VSS
TINP0L/
GP[98]
UTXD0/
GP[86]
TOUT1L/
GP[55]
RSV2
VSS
CVDD
VSS
CVDD
VSS
K
1
2
3
4
5
6
7
8
9
10
Figure 2-4. ZWT Pin Map [Quadrant A]
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11
12
13
14
15
16
17
18
19
W
DDR_A[6]
DDR_A[5]
DDR_A[0]
RSV24
RSV26
RSV29
RSV35
DVDDR2
DVDDR2
W
V
DDR_A[7]
DDR_A[4]
DDR_A[2]
RSV25
RSV27
RSV30
RSV32
RSV37
VSS
V
U
DDR_A[9]
DDR_A[3]
DDR_A[1]
RSV22
RSV28
RSV23
RSV33
RSV36
RSV38
U
T
DDR_ZP
RSV20
DDR_VREF
RSV21
RSV31
RSV34
RSV39
T
R
VSS
DVDDR2
RSV5
DVDDR2
VSS
DVDDR2
VSS
VSS
VSS
R
P
DVDDR2
VSS
DVDDR2
VSS
RSV14
RSV11
RSV12
RSV8
RSV7
P
N
VSS
CVDD
VSS
VSS
RSV13
RSV15
RSV10
RSV9
RSV6
N
M
CVDD
VSS
CVDD
VSS
DVDD33
VSS
VSS
VSS
VSS
M
L
VSS
CVDD
VSS
DVDDR2
RSV4
PLLPWR18
VSS
MXV DD
VSS
L
K
CVDD
VSS
CVDD
VSS
DVDD33
VSS
DVDD33
MXV SS
MXI/
CLKIN
K
11
12
13
14
15
16
17
18
19
DDR_VDDDLL DDR_VSSDLL
Figure 2-5. ZWT Pin Map [Quadrant B]
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11
12
13
14
15
16
17
18
19
J
VSS
CVDD
VSS
DVDD33
VSS
DVDD33
VSS
VSS
MXO
J
H
CVDD
VSS
CVDD
VSS
RMTXEN/
GP[29]
RMTXD0/
GP[28]
RMTXD1/
GP[27]/
(LENDIAN)
DVDD33
VSS
H
G
VSS
DVDD33
VSS
DVDD33
VSS
RMCRSDV/
GP[30]
G
F
DVDD33
VSS
DVDD33
VSS
GP[23]/
(BOOTMODE1)
EM_D[6]/
GP[20]
EM_D[7]/
GP[21]
GP[22]/
(BOOTMODE0)
RMRXD1/
EM_CS5/
GP[33]
F
E
RSV18
RSV19
VSS
EM_WE
EM_WAIT/
(RDY/BSY)
EM_D[3]/
GP[17]
EM_D[5]/
GP[19]
EM_D[4]/
GP[18]
RMRXD0/
EM_CS4/
GP[32]
E
D
EM_A[18]/
GP[46]
EM_A[21]/
GP[34]
EM_R/W/
GP[35]
GP[40]
EM_OE
EM_D[0]/
GP[14]
EM_D[2]/
GP[16]
EM_D[1]/
GP[15]
RMREFCLK/
GP[31]
D
C
EM_A[16]/
GP[48]
EM_A[20]/
GP[44]
GP[41]
GP[38]
GP[36]
EM_BA[1]/
GP[5]/
(AEM0)
EM_BA[0]/
GP[6]/
(AEM1)
EM_CS3/
GP[13]
EM_CS2/
GP[12]
C
B
EM_A[15]/
GP[49]
EM_A[19]/
GP[45]
GP[42]
GP[39]
GP[37]
EM_A[2]/
(CLE)/GP[8]/
(PLLMS0)
EM_A[0]/
GP[7]/
(AEM2)
EM_A[3]/
GP[11]
VSS
B
A
EM_A[17]/
GP[47]
GP[43]
GP[53]
GP[54]
RMRXER/
GP[52]
EM_A[1]/
(ALE)/GP[9]/
(PLLMS1)
EM_A[4]/
GP[10]/
(PLLMS2)
DVDD33
VSS
A
11
12
13
14
15
16
17
18
19
GP[24]/
GP[25]/
GP[26]/
(BOOTMODE2) (BOOTMODE3) (FASTBOOT)
Figure 2-6. ZWT Pin Map [Quadrant C]
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1
2
3
4
J
DVDD33
AHCLKR0/
CLKR0/
GP[101]
AXR0[1]/
DX0/
GP[104]
CLKS0/
TOUT0L/
GP[97]
H
ACLKR0/
CLKX0/
GP[99]
AXR0[0]/
GP[105]
AXR0[2]/
FSX0/
GP[103]
AFSR0/
DR0/
GP[100]
G
AHCLKX0/
GP[108]
AFSX0/
GP[107]
AMUTE0/
GP[110]
AXR0[3]/
FSR0/
GP[102]
F
ACLKX0/
GP[106]
AMUTEIN0/
GP[109]
GP[4]/
PWM1
VSS
E
GP[0]
GP[1]
GP[2]
D
HAS/
MDIO/
GP[83]
HRDY/
MRXD2/
GP[80]
C
HCS/
MDCLK/
GP[81]
B
A
5
6
7
8
9
10
DVDD33
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
CVDD
VSS
H
DVDD33
VSS
DVDD33
VSS
DVDD33
G
DVDD33
VSS
DVDD33
VSS
DVDD33
VSS
F
GP[3]
RSV1
DVDD33
VSS
DVDD33
VSS
RSV17
E
HCNTL1/
MTXEN/
GP[75]
HD14/
MTXD0/
GP[72]
HD12/
MTXD2/
GP[70]
EM_A[6]/
GP[95]
EM_A[9]/
GP[92]
EM_A[12]/
GP[89]
D
HINT/
MRXD3/
GP[82]
HDS2/
MRXD0/
GP[78]
HHWIL/
MRXDV/
GP[74]
HD11/
MTXD3/
GP[69]
HD4/
VLYNQ_RXD3/
GP[62]
HD0/
VLYNQ_
SCRUN/
GP[58]
EM_A[7]/
GP[94]
EM_A[11]/
GP[90]
C
VSS
HDS1/
MRXD1/
GP[79]
HCNTL0/
MRXER/
GP[76]
HD13/
MTXD1/
GP[71]
HD10/
MCRS/
GP[68]
HD7/
HD3/
VLYNQ_TXD2/ VLYNQ_RXD2/
GP[65]
GP[61]
EM_A[5]/
GP[96]
EM_A[8]/
GP[93]
EM_A[13]/
GP[51]
B
DVDD33
DVDD33
HR/W/
MRXCLK/
GP[77]
HD15/
MTXCLK/
GP[73]
VLYNQ_
CLOCK/
GP[57]
HD2/
VLYNQ_RXD1/
GP[60]
EM_A[10]/
GP[91]
EM_A[14]/
GP[50]
A
1
2
3
4
7
8
9
10
VSS
DVDD33
VSS
HD6/
HD1/
VLYNQ_TXD1/ VLYNQ_RXD0/
GP[64]
GP[59]
HD9/
MCOL/
GP[67]
HD8/
HD5/
VLYNQ_TXD3/ VLYNQ_TXD0/
GP[66]
GP[63]
5
6
J
Figure 2-7. ZWT Pin Map [Quadrant D]
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
AB
AA
Y
W
3
1
2
VSS
VSS
DDR_D[6]
DDR_D[8]
DDR_D[12]
DDR_D[15]
DDR_CLK0
DDR_CLK0
DDR_BS[1]
DDR_BS[2]
DDR_A[10]
DVDDR2
DDR_D[3]
DDR_D[4]
DDR_DQS[0]
DDR_D[10]
DDR_D[13]
DDR_DQS[1]
DDR_CKE
DDR_BS[0]
DDR_A[12]
DDR_A[11]
DDR_D[0]
DDR_D[1]
DDR_D[5]
DDR_DQM[0]
DDR_D[11]
DDR_D[14]
DDR_DQM[1]
DDR_RAS
DDR_CAS
DDR_WE
DDR_CS
VSS
DDR_D[2]
RSV16
DDR_D[7]
DDR_D[9]
VSS
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
5
6
DVDDR2
TRST
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
VSS
TCK
TDO
EMU0
DVDDR2
VSS
TDI
VSS
DVDDR2
EMU1
RESETOUT
DVDD33
VSS
CLKOUT0/
PWM2/
GP[84]
POR
RESET
VSS
DVDD33
R
UCTS0/
GP[87]
SDA
TINP1L/
GP[56]
DVDD33
VSS
P
N
UTXD0/
GP[86]
SCL
TOUT1L/
GP[55]
VSS
DVDD33
M
VSS
URXD0/
GP[85]
URTS0/
PWM0/
GP[88]
RSV3
VSS
1
2
3
4
V
U
TMS
4
www.ti.com
T
R
P
7
8
9
10
11
AB
AA
Y
W
V
9
10
VSS
CVDD
CVDD
N
CVDD
VSS
VSS
N
M
CVDD
CVDD
VSS
M
10
11
U
6
7
8
11
T
5
9
P
Figure 2-8. ZDU Pin Map [Quadrant A]
20
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12
AB
AA
13
14
15
16
17
18
19
20
21
22
DDR_A[7]
DDR_A[4]
DDR_A[1]
DDR_A[0]
RSV26
RSV29
RSV30
RSV33
RSV36
DVDDR2
DVDDR2
AB
DDR_A[9]
DDR_A[6]
DDR_A[3]
RSV22
RSV24
RSV27
RSV23
RSV31
RSV34
RSV38
VSS
AA
DDR_A[2]
RSV20
RSV25
RSV28
RSV21
RSV32
RSV35
RSV37
RSV39
Y
Y
DDR_A[8]
DDR_A[5]
W
DDR_ZN
DDR_ZP
DDR_VDDDLL
DDR_VSSDLL
RSV5
DVDDR2
DDR_VREF
DVDDR2
VSS
VSS
VSS
W
V
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
VSS
DVDDR2
VSS
RSV12
RSV7
RSV6
V
U
VSS
VSS
RSV11
RSV15
RSV8
U
T
VSS
RSV14
RSV13
RSV9
RSV10
T
VSS
VSS
VSS
VSS
VSS
R
12
13
14
15
16
17
R
P
CVDD
CVDD
VSS
P
DVDD33
RSV4
DVDD33
VSS
DVDD33
P
N
VSS
VSS
CVDD
N
VSS
DVDD33
PLLPWR18
MXV DD
MXI/
CLKIN
N
M
VSS
VSS
CVDD
M
DVDD33
VSS
DVDD33
MXV SS
MXO
M
12
13
14
18
19
20
21
22
Figure 2-9. ZDU Pin Map [Quadrant B]
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
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18
19
L
VSS
RMTXD1/
GP[27]/
(LENDIAN)
CVDD
K
DVDD33
VSS
J
VSS
DVDD33
H
DVDD33
G
F
12
13
14
L
VSS
CVDD
CVDD
K
VSS
VSS
J
CVDD
CVDD
20
21
22
DVDD33
VSS
RMTXEN/
GP[29]
RMCRSDV/
GP[30]
(BOOTMODE0)
RMTXD0/
GP[28]
RMRXD1/
EM_CS5/
GP[33]
VSS
EM_D[7]/
GP[21]
(BOOTMODE3)
VSS
DVDD33
EM_D[1]/
GP[15]
EM_D[4]/
GP[18]
RMREFCLK/
GP[31]
G
DVDD33
VSS
EM_D[3]/
GP[17]
EM_D[6]/
GP[20]
EM_D[5]/
GP[19]
F
GP[24]/
(BOOTMODE2)
GP[26]/
GP[23]/
(FASTBOOT) (BOOTMODE1)
GP[22]/
GP[25]/
RMRXD0/
EM_CS4/
GP[32]
L
K
J
H
12
13
14
15
16
17
VSS
DVDD33
VSS
DVDD33
VSS
DVDD33
VSS
DVDD33
EM_BA[0]/
GP[6]/
(AEM1)
EM_D[0]/
GP[14]
EM_D[2]/
GP[16]
E
D
RSV17
RSV18
RSV19
VSS
DVDD33
VSS
DVDD33
EM_OE
EM_WAIT/
(RDY/BSY)
EM_A[3]/
GP[11]
EM_CS3/
GP[13]
D
C
EM_A[11]/
GP[90]
EM_A[15]/
GP[49]
EM_A[19]/
GP[45]
EM_A[20]/
GP[44]
EM_A[21]/
GP[34]
EM_R/W/
GP[35]
GP[40]
EM_WE
EM_BA[1]/
GP[5]/
(AEM0)
EM_A[0]/
GP[7]/
(AEM2)
EM_CS2/
GP[12]
C
B
EM_A[12]/
GP[89]
EM_A[16]/
GP[48]
EM_A[17]/
GP[47]
GP[42]
GP[41]
GP[38]
GP[37]
GP[36]
EM_A[1]/
(ALE)/GP[9]/
(PLLMS1)
EM_A[4]/
GP[10]/
(PLLMS2)
VSS
B
A
EM_A[13]/
GP[51]
EM_A[14]/
GP[50]
EM_A[18]/
GP[46]
GP[43]
GP[39]
GP[53]
GP[54]
RMRXER/
GP[52]
EM_A[2]/
(CLE)/GP[8]/
(PLLMS0)
DVDD33
VSS
A
12
13
14
15
16
17
18
19
20
21
22
E
Figure 2-10. ZDU Pin Map [Quadrant C]
22
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1
2
3
4
5
9
10
11
L
DVDD33
TINP0L/
GP[98]
CLKS0/
TOUT0L/
GP[97]
RSV2
DVDD33
L
CVDD
VSS
VSS
L
K
AHCLKR0/
CLKR0/
GP[101]
AXR0[1]/
DX0/
GP[104]
AFSR0/
DR0/
GP[100]
DVDD33
VSS
K
CVDD
VSS
VSS
K
J
ACLKR0/
CLKX0/
GP[99]
AXR0[2]/
FSX0/
GP[103]
AXR0[3]/
FSR0/
GP[102]
VSS
DVDD33
J
VSS
CVDD
CVDD
J
H
AHCLKX0/
GP[108]
AXR0[0]/
GP[105]
AMUTE0/
GP[110]
DVDD33
VSS
H
G
ACLKX0/
GP[106]
AFSX0/
GP[107]
AMUTEIN0/
GP[109]
VSS
DVDD33
G
F
GP[2]
GP[3]
GP[4]/
PWM1
DVDD33
VSS
F
6
7
8
9
10
11
DVDD33
VSS
DVDD33
VSS
DVDD33
DVDD33
VSS
DVDD33
VSS
D
EM_A[7]/
GP[94]
EM_A[9]/
GP[92]
C
EM_A[6]/
GP[95]
EM_A[10]/
GP[91]
B
EM_A[5]/
GP[96]
EM_A[8]/
GP[93]
A
10
11
E
GP[0]
GP[1]
DVDD33
VSS
DVDD33
VSS
D
HCS/
MDCLK/
GP[81]
HINT/
MRXD3/
GP[82]
HHWIL/
MRXDV/
GP[74]
RSV1
VSS
DVDD33
VSS
HAS/
MDIO/
GP[83]
HDS2/
MRXD0/
GP[78]
HRDY/
MRXD2/
GP[80]
HCNTL1/
MTXEN/
GP[75]
HD12/
MTXD2/
GP[70]
HD9/
MCOL/
GP[67]
HD6/
HD4/
HD1/
C
VLYNQ_TXD1/
VLYNQ_RXD3 /
VLYNQ_RXD0 /
GP[64]
GP[62]
GP[59]
HCNTL0/
MRXER/
GP[76]
HDS1/
MRXD1/
GP[79]
HD13/
MTXD1/
GP[71]
HD14/
MTXD0/
GP[72]
HD10/
MCRS/
GP[68]
HD7/
HD3/
DVDD33
VLYNQ_TXD2/
VLYNQ_RXD2/
GP[65]
GP[61]
HR/W/
MRXCLK/
GP[77]
HD15/
MTXCLK/
GP[73]
HD11/
MTXD3/
GP[69]
HD8/
HD5/
DVDD33
VLYNQ_TXD3/
VLYNQ_TXD0 /
VLYNQ_RXD1/
GP[66]
GP[63]
VLYNQ_
CLOCK/
GP[57]
3
4
5
6
7
8
9
B
A
VSS
1
2
HD0/
VLYNQ_
SCRUN/
GP[58]
HD2/
GP[60]
E
Figure 2-11. ZDU Pin Map [Quadrant D]
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
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2.5 Terminal Functions
The terminal functions tables (Table 2-7 through Table 2-28) identify the external signal names, the
associated pin (ball) numbers along with the mechanical package designator, the pin type, whether the pin
has any internal pullup or pulldown resistors, and a functional pin description. For more detailed
information on device configuration, peripheral selection, multiplexed/shared pin, and debugging
considerations, see the Device Configurations section of this data manual.
All device boot and configuration pins are multiplexed configuration pins— meaning they are multiplexed
with functional pins. These pins function as device boot and configuration pins only during device reset.
The input states of these pins are sampled and latched into the BOOTCFG register when device reset is
deasserted (see Note below). After device reset is deasserted, the values on these multiplexed pins no
longer have to hold the configuration.
For proper device operation, external pullup/pulldown resistors may be required on these device boot and
configuration pins. Section 3.9.1, Pullup/Pulldown Resistors discusses situations where external
pullup/pulldown resistors are required.
Note: Internal to the chip, the two device reset pins RESET and POR are logically AND’d together for the
purpose of latching device boot and configuration pins. The values on all device boot and configuration
pins are latched into the BOOTCFG register when the logical AND of RESET and POR transitions from
low-to-high.
Table 2-7. BOOT Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
BOOT
GP[25]/
(BOOTMODE3)
G16
H21
G15
L20
F15
K20
F18
J20
GP[26]/
(FASTBOOT)
G17
EM_A[4]/
GP[10]/
(PLLMS2)
A17
EM_A[1]/(ALE)/
GP[9]/
(PLLMS1)
A16
EM_A[2]/(CLE)/
GP[8]/
(PLLMS0)
B16
GP[24]/
(BOOTMODE2)
GP[23]/
(BOOTMODE1)
I/O/Z
IPD
DVDD33
Bootmode configuration bits. These bootmode functions along with
the FASTBOOT function determine what device bootmode
configuration is selected.
The C6421 device supports several types of bootmodes along with a
FASTBOOT option; for more details on the types/options, see
Section 3.4.1, Boot Modes.
K19
I/O/Z
IPD
DVDD33
Fast Boot
0 = Not Fast Boot
1 = Fast Boot
B21
I/O/Z
IPD
DVDD33
GP[22]/
(BOOTMODE0)
(1)
(2)
(3)
24
B20
A20
I/O/Z
I/O/Z
IPD
DVDD33
IPD
DVDD33
Fast Boot PLL Multiplier Select (PLLMS)
These pins select the PLL multiplier for Fast Boot.
For more details, see Section 3.5.1.2, Fast Boot PLL Multiplier
Select (PLLMS).
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-7. BOOT Terminal Functions (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
EM_A[0]/
GP[7]/(AEM2)
B17
C21
I/O/Z
IPD
DVDD33
EM_BA[0]/
GP[6]/(AEM1)
C17
E20
I/O/Z
IPD
DVDD33
EM_BA[1]/
GP[5]/(AEM0)
C16
C20
I/O/Z
IPD
DVDD33
For proper C6421 device operation, if this pin is both routed and
3-stated (not driven) during device reset, it must be pulled down via
an external resistor. For more detailed information on
pullup/pulldown resistors, see Section 3.9.1, Pullup/Pulldown
Resistors.
Endian selection
0 = Big Endian
1 = Little Endian
RMTXD0/GP[28]
H16
J21
I/O/Z
IPD
DVDD33
RMTXD1/GP[27]/
(LENDIAN)
H17
L19
I/O/Z
IPU
DVDD33
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DESCRIPTION
Selects EMIFA Pinout Mode
The C6421 supports the following EMIFA Pinout Modes:
AEM[2:0] = 000, No EMIFA
AEM[2:0] = 010, EMIFA (Async) Pinout Mode 2
AEM[2:0] = 101, EMIFA (NAND) Pinout Mode 5
This signal doesn't actually affect the EMIFA module. It only affects
how the EMIFA is pinned out.
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
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Table 2-8. Oscillator/PLL Terminal Functions
SIGNAL
ZWT
NO.
NAME
ZDU
NO.
TYPE (1)
OTHER (2)
DESCRIPTION
OSCILLATOR, PLL
(1)
(2)
(3)
(4)
MXI/
CLKIN
K19
N22
I
MXVDD
Crystal input MXI for MX oscillator (system oscillator, typically 27 MHz).
If the internal oscillator is bypassed, this is the external oscillator clock
input. (3)
MXO
J19
M22
O
MXVDD
Crystal output for MX oscillator
MXVDD
L18
N21
S
(4)
1.8 V power supply for MX oscillator. On the board, this pin can be
connected to the same 1.8 V power supply as DVDDR2.
MXVSS
K18
M21
GND
(4)
Ground for MX oscillator
PLLPWR18
L16
N20
S
(4)
1.8 V power supply for PLLs
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
Specifies the operating I/O supply voltage for each signal
For more information on external board connections, see , External Clock Input From MXI/CLKIN Pin.
For more information, see the Recommended Operating Conditions table.
Table 2-9. Clock Generator Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
CLOCK GENERATOR
CLKOUT0/
PWM2/GP[84]
(1)
(2)
(3)
26
M1
R1
I/O/Z
IPD
DVDD33
This pin is multiplexed between the System Clock generator (PLL1), PWM2,
and GPIO.
For the System Clock generator (PLL1), it is clock output CLKOUT0. This is
configurable for toggling at the device input clock frequency (MXI/CLKIN
frequency) or other divided-down (/1 to /32) clock outputs.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-10. RESET and JTAG Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
Device reset
DESCRIPTION
RESET
RESET
M4
R3
I
IPU
DVDD33
RESETOUT
N3
T3
O/Z
–
DVDD33
Reset output status pin. The RESETOUT pin indicates when the
device is in reset.
POR
N4
R2
I
IPU
DVDD33
Power-on reset.
JTAG test-port mode select input
For proper device operation, do not oppose the IPU on this pin.
JTAG
(1)
(2)
(3)
TMS
R3
V3
I
IPU
DVDD33
TDO
P3
U2
O/Z
–
DVDD33
JTAG test-port data output
TDI
P4
U3
I
IPU
DVDD33
JTAG test-port data input
TCK
N1
U1
I
IPU
DVDD33
JTAG test-port clock input
TRST
R2
V2
I
IPD
DVDD33
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see
the IEEE 1149.1 JTAG compatibility statement portion of this data
sheet
EMU1
N2
T2
I/O/Z
IPU
DVDD33
Emulation pin 1
EMU0
P2
T1
I/O/Z
IPU
DVDD33
Emulation pin 0
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-11. EMIFA Terminal Functions (Boot Configuration)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
EMIFA: BOOT CONFIGURATION
(1)
(2)
(3)
28
EM_BA[1]/
GP[5]/(AEM0)
C16
C20
I/O/Z
IPD
DVDD33
EM_BA[0]/
GP[6]/(AEM1)
C17
E20
I/O/Z
IPD
DVDD33
EM_A[0]/
GP[7]/(AEM2)
B17
C21
I/O/Z
IPD
DVDD33
These pins are multiplexed between the EMIFA, and GPIO. When
RESET or POR is asserted, these pins function as EMIFA
configuration pins. At reset, the input states of AEM[2:0] are sampled
to set the EMIFA Pinout Mode. For more details, see Section 3.5.1,
Configurations at Reset. After reset, these pins function as EMIFA or
GPIO pin functions based on pin mux selection.
For more details on the AEM functions, see Section 3.5.1.1, EMIFA
Pinout Mode (AEM[2:0]).
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal.
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Table 2-12. EMIFA Terminal Functions (EMIFA Pinout Mode 2, AEM[2:0] = 010)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
EMIFA FUNCTIONAL PINS: 8-Bit ASYNC/NOR (EMIFA Pinout Mode 2, AEM[2:0] = 010)
Actual pin functions are determined by the PINMUX0 and PINMUX1 register bit settings (e.g., AEM[2:0], etc.). For more details, see
Section 3.7, Multiplexed Pin Configurations.
This pin is multiplexed between EMIFA, and GPIO.
EM_CS2/
GP[12]
C19
C22
I/O/Z
IPD
DVDD33
For EMIFA, this pin is Chip Select 2 output EM_CS2 for use with
asynchronous memories (i.e., NOR flash).
This is the chip select for the default boot and ROM boot modes.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMIFA, and GPIO.
EM_CS3/
GP[13]
C18
D22
I/O/Z
IPD
DVDD33
For EMIFA, this pin is Chip Select 3 output EM_CS3 for use with
asynchronous memories (i.e., NOR flash).
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA, and GPIO.
RMRXD0/
EM_CS4/
GP[32]
E19
H22
I/O/Z
IPD
DVDD33
For EMIFA, it is Chip Select 4 output EM_CS4 for use with
asynchronous memories (i.e., NOR flash).
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA, and GPIO.
For EMIFA, it is Chip Select 5 output EM_CS5 for use with
asynchronous memories (i.e., NOR flash).
RMRXD1/
EM_CS5/
GP[33]
F19
J22
I/O/Z
IPD
DVDD33
EM_R/W/
GP[35]
C17
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
D13
For EMIFA (ASYNC/NOR), this pin is wait state extension input
EM_WAIT.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
For EMIFA, it is read/write output EM_R/W.
EM_WAIT/
(RDY/BSY)
E15
D20
I/O/Z
IPU
DVDD33
EM_OE
D15
D19
I/O/Z
IPU
DVDD33
For EMIFA, it is output enable output EM_OE.
EM_WE
E14
C19
I/O/Z
IPU
DVDD33
For EMIFA, it is write enable output EM_WE.
I/O/Z
IPD
DVDD33
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
EM_BA[0]/
GP[6]/(AEM1)
C17
E20
For EMIFA, this is the Bank Address 0 output (EM_BA[0]).
When connected to an 8-bit asynchronous memory, this pin is the
lowest order bit of the byte address.
This pin is multiplexed between EMIFA and GPIO.
EM_BA[1]/
GP[5]/(AEM0)
(1)
(2)
(3)
C16
C20
For EMIFA, this is the Bank Address 1 output EM_BA[1].
When connected to an 8-bit asynchronous memory, this pin is the 2nd
bit of the address.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Device Overview
29
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-12. EMIFA Terminal Functions (EMIFA Pinout Mode 2, AEM[2:0] = 010) (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
EM_A[21]/GP[34]
D12
C16
I/O/Z
IPD
DVDD33
EM_A[20]/GP[44]
C12
C15
I/O/Z
IPD
DVDD33
EM_A[19]/GP[45]
B12
C14
I/O/Z
IPD
DVDD33
EM_A[18]/GP[46]
D11
A14
I/O/Z
IPD
DVDD33
EM_A[17]/GP[47]
A11
B14
I/O/Z
IPD
DVDD33
EM_A[16]/GP[48]
C11
B13
I/O/Z
IPD
DVDD33
EM_A[15]/GP[49]
B11
C13
I/O/Z
IPD
DVDD33
EM_A[14]/GP[50]
A10
A13
I/O/Z
IPD
DVDD33
EM_A[13]/GP[51]
B10
A12
I/O/Z
IPD
DVDD33
EM_A[12]/GP[89]
D10
B12
I/O/Z
IPD
DVDD33
EM_A[11]/GP[90]
C10
C12
I/O/Z
IPD
DVDD33
EM_A[10]/GP[91]
A9
B11
I/O/Z
IPD
DVDD33
D9
C11
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
EM_A[9]/GP[92]
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
DESCRIPTION
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 21 output
EM_A[21].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 20 output
EM_A[20].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 19 output
EM_A[19].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 18 output
EM_A[18].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 17 output
EM_A[17].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 16 output
EM_A[16].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 15 output
EM_A[15].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 14 output
EM_A[14].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 13 output
EM_A[13].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 12 output
EM_A[12].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is address bit 11 output
EM_A[11].
This pin is multiplexed between EMIFA and GPIO.
EM_A[8]/GP[93]
EM_A[7]/GP[94]
EM_A[6]/GP[95]
EM_A[5]/GP[96]
30
B9
C9
D8
B8
Device Overview
A11
C10
B10
A10
I/O/Z
I/O/Z
I/O/Z
I/O/Z
For EMIFA (AEM[2:0] = 010), this pin is address bit 10 output
EM_A[10].
For EMIFA (AEM[2:0] = 010), this pin is address bit 9 output EM_A[9].
For EMIFA (AEM[2:0] = 010), this pin is address bit 8 output EM_A[8].
For EMIFA (AEM[2:0] = 010), this pin is address bit 7 output EM_A[7].
For EMIFA (AEM[2:0] = 010), this pin is address bit 6 output EM_A[6].
For EMIFA (AEM[2:0] = 010), this pin is address bit 5 output EM_A[5].
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Fixed-Point Digital Signal Processor
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SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Table 2-12. EMIFA Terminal Functions (EMIFA Pinout Mode 2, AEM[2:0] = 010) (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
EM_A[4]/
GP[10]/(PLLMS2)
B21
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
A17
EM_A[3]/
GP[11]
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
B18
EM_A[2]/(CLE)/
GP[8]/(PLLMS0)
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
B16
EM_A[1]/(ALE)/
GP[9]/(PLLMS1)
IPD
DVDD33
This pin is multiplexed between EMIFA and GPIO.
A16
D21
A20
B20
I/O/Z
I/O/Z
I/O/Z
DESCRIPTION
For EMIFA (AEM[2:0] = 010), this pin is address bit 4 output EM_A[4].
For EMIFA (AEM[2:0] = 010), this pin is address bit 3 output EM_A[3].
For EMIFA (AEM[2:0] = 010), this pin is address bit 2 output EM_A[2].
For EMIFA (AEM[2:0] = 010), this pin is address output EM_A[1].
This pin is multiplexed between EMIFA and GPIO.
For EMIFA (AEM[2:0] = 010), this pin is Address output EM_A[0],
which is the least significant bit on a 32-bit word address.
For an 8-bit asynchronous memory, this pin is the 3rd bit of the
address.
EM_A[0]/
GP[7]/(AEM2)
B17
C21
I/O/Z
IPD
DVDD33
EM_D0/
GP[14]
D16
E21
I/O/Z
IPD
DVDD33
EM_D1/
GP[15]
D18
G20
I/O/Z
IPD
DVDD33
EM_D2/
GP[16]
D17
E22
I/O/Z
IPD
DVDD33
EM_D3/
GP[17]
E16
F20
I/O/Z
IPD
DVDD33
These pins are multiplexed between EMIFA and GPIO.
EM_D4/
GP[18]
E18
G21
I/O/Z
IPD
DVDD33
For EMIFA (AEM[2:0] = 010), these pins are the 8-bit bi-directional
data bus (EM_D[7:0]).
EM_D5/
GP[19]
E17
F22
I/O/Z
IPD
DVDD33
EM_D6/
GP[20]
F16
F21
I/O/Z
IPD
DVDD33
EM_D7/
GP[21]
F17
H20
I/O/Z
IPD
DVDD33
EMIFA FUNCTIONAL PINS: 8-Bit NAND (EMIFA Pinout Mode 2, AEM[2:0] = 010)
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_A[1]/(ALE)/
GP[9]/(PLLMS1)
A16
B20
I/O/Z
IPD
DVDD33
EM_A[2]/(CLE)/
GP[8]/(PLLMS0)
B16
A20
I/O/Z
IPD
DVDD33
EM_WAIT/
(RDY/BSY)
E15
D20
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), it is ready/busy input (RDY/BSY).
EM_OE
D15
D19
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), this pin is read enable output (RE).
EM_WE
E14
C19
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), this pin is write enable output (WE).
When used for EMIFA (NAND) , this pin is the Address Latch Enable
output (ALE).
This pin is multiplexed between EMIFA (NAND) and GPIO.
When used for EMIFA (NAND) , this pin is the Command Latch
Enable output (CLE).
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_CS2/
GP[12]
C19
C22
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I/O/Z
IPD
DVDD33
For EMIFA (NAND), this pin is Chip Select 2 output EM_CS2 for use
with NAND flash.
This is the chip select for the default boot and ROM boot modes.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
Device Overview
31
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-12. EMIFA Terminal Functions (EMIFA Pinout Mode 2, AEM[2:0] = 010) (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_CS3/
GP[13]
C18
D22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), this pin is Chip Select 3 output EM_CS3 for use
with NAND flash.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA (NAND), and
GPIO.
RMRXD0/
EM_CS4/
GP[32]
E19
H22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), it is Chip Select 4 output EM_CS4 for use with
NAND flash.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA (NAND), and
GPIO.
32
For EMIFA (NAND), it is Chip Select 5 output EM_CS5 for use with
NAND flash.
RMRXD1/
EM_CS5/
GP[33]
F19
EM_D0/
GP[14]
D16
E21
I/O/Z
IPD
DVDD33
EM_D1/
GP[15]
D18
G20
I/O/Z
IPD
DVDD33
EM_D2/
GP[16]
D17
E22
I/O/Z
IPD
DVDD33
EM_D3/
GP[17]
E16
F20
I/O/Z
IPD
DVDD33
These pins are multiplexed between EMIFA (NAND) and GPIO.
EM_D4/
GP[18]
E18
G21
I/O/Z
IPD
DVDD33
For EMIFA (NAND) (AEM[2:0] = 010), these pins are the 8-bit
bi-directional data bus (EM_D[7:0]).
EM_D5/
GP[19]
E17
F22
I/O/Z
IPD
DVDD33
EM_D6/
GP[20]
F16
F21
I/O/Z
IPD
DVDD33
EM_D7/
GP[21]
F17
H20
I/O/Z
IPD
DVDD33
Device Overview
J22
I/O/Z
IPD
DVDD33
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
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Fixed-Point Digital Signal Processor
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SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Table 2-13. EMIFA Terminal Functions (EMIFA Pinout Mode 5, AEM[2:0] = 101)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
EMIFA FUNCTIONAL PINS: 8-Bit NAND (EMIFA Pinout Mode 5, AEM[2:0] = 101)
Actual pin functions are determined by the PINMUX0 and PINMUX1 register bit settings (e.g., AEM[2:0], etc.). For more details, see
Section 3.7, Multiplexed Pin Configurations.
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_A[1]/(ALE)/
GP[9]/(PLLMS1)
A16
B20
I/O/Z
IPD
DVDD33
EM_A[2]/(CLE)/
GP[8]/(PLLMS0)
B16
A20
I/O/Z
IPD
DVDD33
EM_WAIT/
(RDY/BSY)
E15
D20
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), it is ready/busy input (RDY/BSY).
EM_OE
D15
D19
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), this pin is read enable output (RE).
EM_WE
E14
C19
I/O/Z
IPU
DVDD33
When used for EMIFA (NAND), this pin is write enable output (WE).
When used for EMIFA (NAND) , this pin is the Address Latch Enable
output (ALE).
This pin is multiplexed between EMIFA (NAND) and GPIO.
When used for EMIFA (NAND) , this pin is the Command Latch
Enable output (CLE).
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_CS2/
GP[12]
C19
C22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), this pin is Chip Select 2 output EM_CS2 for use
with NAND flash.
This is the chip select for the default boot and ROM boot modes.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMIFA (NAND) and GPIO.
EM_CS3/
GP[13]
C18
D22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), this pin is Chip Select 3 output EM_CS3 for use
with NAND flash.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA (NAND), and
GPIO.
RMRXD0/
EM_CS4/
GP[32]
E19
H22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), it is Chip Select 4 output EM_CS4 for use with
NAND flash.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
This pin is multiplexed between EMAC (RMII), EMIFA (NAND), and
GPIO.
RMRXD1/
EM_CS5/
GP[33]
(1)
(2)
(3)
F19
J22
I/O/Z
IPD
DVDD33
For EMIFA (NAND), it is Chip Select 5 output EM_CS5 for use with
NAND flash.
Note: This pin features an internal pulldown (IPD). If this pin is
connected and used as an EMIFA chip select signal, for proper device
operation, an external pullup resistor must be used to ensure the
EM_CSx function defaults to an inactive (high) state.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Device Overview
33
TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-13. EMIFA Terminal Functions (EMIFA Pinout Mode 5, AEM[2:0] = 101) (continued)
SIGNAL
34
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
EM_D0/
GP[14]
D16
E21
I/O/Z
IPD
DVDD33
EM_D1/
GP[15]
D18
G20
I/O/Z
IPD
DVDD33
EM_D2/
GP[16]
D17
E22
I/O/Z
IPD
DVDD33
EM_D3/
GP[17]
E16
F20
I/O/Z
IPD
DVDD33
These pins are multiplexed between EMIFA (NAND) and GPIO.
EM_D4/
GP[18]
E18
G21
I/O/Z
IPD
DVDD33
For EMIFA (NAND) AEM[2:0] = 101, these pins are the 8-bit
bi-directional data bus (EM_D[7:0]).
EM_D5/
GP[19]
E17
F22
I/O/Z
IPD
DVDD33
EM_D6/
GP[20]
F16
F21
I/O/Z
IPD
DVDD33
EM_D7/
GP[21]
F17
H20
I/O/Z
IPD
DVDD33
Device Overview
DESCRIPTION
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Fixed-Point Digital Signal Processor
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SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Table 2-14. DDR2 Memory Controller Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DDR_CLK
W7
AB7
I/O/Z
DVDDR2
DDR2 Clock Output
DDR_CLK
W8
AB8
I/O/Z
DVDDR2
DDR2 Differential Clock Output
DDR_CKE
V8
AA8
I/O/Z
DVDDR2
DDR2 Clock Enable Output
DDR_CS
T9
Y11
I/O/Z
DVDDR2
DDR2 Active Low Chip Select Output
DDR_WE
T8
Y10
I/O/Z
DVDDR2
DDR2 Active Low Write Enable Output
DDR_DQM[1]
T6
Y7
I/O/Z
DVDDR2
DDR_DQM[0]
T4
Y4
I/O/Z
DVDDR2
DDR2 Data Mask Outputs
DQM1: For DDR_D[15:8]
DQM0: For lower byte DDR_D[7:0]
DDR_RAS
U7
Y8
I/O/Z
DVDDR2
DDR2 Row Access Signal Output
DESCRIPTION
DDR2 Memory Controller
(1)
(2)
(3)
DDR_CAS
T7
Y9
I/O/Z
DVDDR2
DDR2 Column Access Signal Output
DDR_DQS[0]
U4
AA4
I/O/Z
DVDDR2
DDR_DQS[1]
U6
AA7
I/O/Z
DVDDR2
Data Strobe Input/Outputs for each byte of the 16-bit data bus. They
are outputs to the DDR2 memory when writing and inputs when
reading. They are used to synchronize the data transfers.
DQS1: For DDR_D[15:8]
DQS0: For bottom byte DDR_D[7:0]
DDR_BA[0]
U8
AA9
DDR_BA[1]
V9
AB9
I/O/Z
DVDDR2
Bank Select Outputs (BS[2:0]). Two are required to support 1Gb DDR2
memories.
DDR_BA[2]
U9
AB10
DDR_A[12]
W9
AA10
DDR_A[11]
W10
AA11
DDR_A[10]
U10
AB11
DDR_A[9]
U11
AA12
DDR_A[8]
V10
Y12
DDR_A[7]
V11
AB12
DDR_A[6]
W11
AA13
I/O/Z
DVDDR2
DDR2 Address Bus Output
DDR_A[5]
W12
Y13
DDR_A[4]
V12
AB13
DDR_A[3]
U12
AA14
DDR_A[2]
V13
Y14
DDR_A[1]
U13
AB14
DDR_A[0]
W13
AB15
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Fore more information, see the Recommended Operating Conditions table
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-14. DDR2 Memory Controller Terminal Functions (continued)
SIGNAL
ZWT
NO.
ZDU
NO.
DDR_D[15]
V7
AB6
DDR_D[14]
W6
Y6
DDR_D[13]
V6
AA6
DDR_D[12]
W5
AB5
DDR_D[11]
V5
Y5
DDR_D[10]
U5
AA5
DDR_D[9]
W4
W5
DDR_D[8]
V4
AB4
DDR_D[7]
W3
W4
DDR_D[6]
V3
AB3
DDR_D[5]
U3
Y3
DDR_D[4]
V2
AA3
DDR_D[3]
U2
AA2
DDR_D[2]
U1
W2
DDR_D[1]
T2
Y2
DDR_D[0]
T1
Y1
DDR_VREF
T15
W18
NAME
TYPE (1)
OTHER (2) (3)
I/O/Z
DVDDR2
I
(3)
Reference voltage input for the SSTL_18 I/O buffers
Ground for the DDR2 DLL
DESCRIPTION
DDR2 bi-directional data bus is configured as 16-bits wide.
DDR_VSSDLL
T13
W15
GND
(3)
DDR_VDDDLL
T12
W14
S
(3)
Power (1.8 Volts) for the DDR2 Digital Locked Loop
DDR_ZN
T10
W12
(3)
Impedance control for DDR2 outputs. This must be connected via a
200-Ω resistor to DVDDR2.
DDR_ZP
T11
W13
(3)
Impedance control for DDR2 outputs. This must be connected via a
200-Ω resistor to VSS.
36
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Table 2-15. EMAC (MII/RMII) and MDIO Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Enable output MTXEN.
DESCRIPTION
EMAC (MII)
HCNTL1/MTXEN/
GP[75]
D3
C4
I/O/Z
IPD
DVDD33
HD15/MTXCLK/
GP[73]
A4
A4
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Clock input MTXCLK.
HD9/MCOL/
GP[67]
C6
C6
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Collision Detect input MCOL.
HD11/MTXD3/
GP[69]
C5
A5
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Data 3 output MTXD3.
HD12/MTXD2/
GP[70]
D5
C5
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Data 2 output MTXD2.
HD13/MTXD1/
GP[71]
B4
B4
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Data 1 output MTXD1.
HD14/MTXD0/
GP[72]
D4
B5
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Transmit Data 0 output MTXD0.
HR/W/MRXCLK/
GP[77]
A3
A3
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Clock input MRXCLK.
HHWIL/MRXDV/
GP[74]
C4
D3
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Data Valid input
MRXDV.
HCNTL0/MRXER/
GP[76]
B3
B2
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Error input MRXER.
HD10/MCRS/
GP[68]
B5
B6
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Carrier Sense input MCRS.
HINT/MRXD3/
GP[82]
C2
D2
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Data 3 input MRXD3.
HRDY/MRXD2/
GP[80]
D2
C3
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Data 2 input MRXD2.
HDS1/MRXD1/
GP[79]
B2
B3
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive data 1 input MRXD1.
HDS2/MRXD0/
GP[78]
C3
C2
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In Ethernet MAC (MII) mode, it is Receive Data 0 input MRXD0.
EMAC (RMII)
RMCRSDV/GP[30]
G19
K22
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC carrier sense/receive
data valid (RMCRSDV) [I].
RMRXER/GP[52]
A15
A19
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC receive error (RMRXER)
[I].
RMTXD1/GP[27]/
(LENDIAN)
H17
L19
I/O/Z
IPU
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC transmit data pin 1
(RMTXD1) [O/Z].
RMTXD0/GP[28]
H16
J21
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC transmit data pin 0
(RMTXD0) [O/Z].
RMREFCLK/GP[31]
D19
G22
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC RMII reference clock
(RMREFCLK) [I].
RMTXEN/GP[29]
H15
K21
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII) and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC transmit enable
(RMTXEN) [O/Z].
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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TMS320C6421
Fixed-Point Digital Signal Processor
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Table 2-15. EMAC (MII/RMII) and MDIO Terminal Functions (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
RMRXD1/EM_CS5/
GP[33]
F19
J22
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII), EMIFA, and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC receive data pin 1
(RMRXD1) [I].
RMRXD0/EM_CS4/
GP[32]
E19
H22
I/O/Z
IPD
DVDD33
This pin is multiplexed between EMAC (RMII), EMIFA, and GPIO.
In Ethernet MAC(RMII) mode, it is EMAC receive data pin 0
(RMRXD0) [I].
DESCRIPTION
MDIO
38
HCS/MDCLK/
GP[81]
C1
D1
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, MDIO, and GPIO.
In Ethernet MAC mode, it is Management Data Clock output
MDCLK.
HAS/MDIO/
GP[83]
D1
C1
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, MDIO, and GPIO.
In Ethernet MAC mode, it is Management Data I/O MDIO (I/O/Z).
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Table 2-16. VLYNQ Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
This pin is multiplexed between VLYNQ and GPIO.
For VLYNQ, it is the clock VLYNQ_CLOCK (I/O/Z).
DESCRIPTION
VLYNQ
VLYNQ_CLOCK/
GP[57]
A7
A8
I/O/Z
IPU
DVDD33
HD0/VLYNQ_SCRUN/
GP[58]
C8
B9
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is the Serial Clock run request VLYNQ_SCRUN
(I/O/Z).
HD8/VLYNQ_TXD3/
GP[66]
A5
A6
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is transmit bus bit 3 output VLYNQ_TXD3.
HD7/VLYNQ_TXD2/
GP[65]
B6
B7
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is transmit bus bit 2 output VLYNQ_TXD2.
HD6/VLYNQ_TXD1/
GP[64]
D6
C7
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is transmit bus bit 1 output VLYNQ_TXD1.
HD5/VLYNQ_TXD0/
GP[63]
A6
A7
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is transmit bus bit 0 output VLYNQ_TXD0.
HD4/VLYNQ_RXD3/
GP[62]
C7
C8
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is receive bus bit 3 input VLYNQ_RXD3.
HD3/VLYNQ_RXD2/
GP[61]
B7
B8
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is receive bus bit 2 input VLYNQ_RXD2.
HD2/VLYNQ_RXD1/
GP[60]
A8
A9
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is receive bus bit 1 input VLYNQ_RXD1.
HD1/VLYNQ_RXD0/
GP[59]
D7
C9
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ, and GPIO.
For VLYNQ, it is receive bus bit 0 input VLYNQ_RXD0.
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-17. Host-Port Interface Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
Host-Port Interface (HPI)
HD0/VLYNQ_SCRUN/
GP[58]
C8
B9
HD1/VLYNQ_RXD0/
GP[59]
D7
C9
HD2/VLYNQ_RXD1/
GP[60]
A8
A9
HD3/VLYNQ_RXD2/
GP[61]
B7
B8
HD4/VLYNQ_RXD3/
GP[62]
C7
C8
HD5/VLYNQ_TXD0/
GP[63]
A6
A7
HD6/VLYNQ_TXD1/
GP[64]
D6
C7
HD7/VLYNQ_TXD2/
GP[65]
B6
B7
HD8/VLYNQ_TXD3/
GP[66]
A5
A6
HD9/MCOL/
GP[67]
C6
C6
HD10/MCRS/
GP[68]
B5
B6
HD11/MTXD3/
GP[69]
C5
A5
HD12/MTXD2/
GP[70]
D5
C5
HD13/MTXD1/
GP[71]
B4
B4
HD14/MTXD0/
GP[72]
D4
B5
HD15/MTXCLK/
GP[73]
A4
A4
HHWIL/MRXDV/
GP[74]
C4
D3
HCNTL1/MTXEN/
GP[75]
(1)
(2)
(3)
40
IPU
DVDD33
IPD
DVDD33
This pin is multiplexed between HPI, VLYNQ or EMAC (MII),
and GPIO.
In HPI mode, these pins are host-port data pins HD[15:0]
(I/O/Z) and are multiplexed internally with the HPI address
lines.
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is half-word identification input HHWIL
(I).
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is control input 1 HCNTL1 (I). The state
of HCNTL1 and HCNTL0 determines if address, data, or
control information is being transmitted between an external
host and the C6421.
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is control input 0 HCNTL0 (I). The state
of HCNTL1 and HCNTL0 determines if address, data, or
control information is being transmitted between an external
host and the C6421.
I/O/Z
D3
C4
HCNTL0/MRXER/
GP[76]
B3
B2
I/O/Z
IPD
DVDD33
HR/W/MRXCLK/
GP[77]
A3
A3
I/O/Z
IPD
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is host read or write select input
HR/W(I).
HDS2/MRXD0/
GP[78]
C3
C2
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is host data strobe input 2 HDS2 (I).
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-17. Host-Port Interface Terminal Functions (continued)
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
HDS1/MRXD1/
GP[79]
B2
B3
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is host data strobe input 1 HDS1 (I).
HRDY/MRXD2/
GP[80]
D2
C3
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is host ready output from DSP to host
(O/Z).
HCS/MDCLK/
GP[81]
C1
D1
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, MDIO, and GPIO.
In HPI mode, this pin is HPI active low chip select input HCS
(I).
HINT/RXD3/
GP[82]
C2
D2
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, EMAC (MII), and GPIO.
In HPI mode, this pin is host interrupt output HINT (O/Z).
I/O/Z
IPU
DVDD33
This pin is multiplexed between HPI, MDIO, and GPIO.
In HPI mode, this pin is host address strobe HAS (I).
For proper HPI operation, if this pin is routed out, it must be
pulled up via an external resistor.
HAS/MDIO/
GP[83]
D1
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DESCRIPTION
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TMS320C6421
Fixed-Point Digital Signal Processor
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www.ti.com
Table 2-18. I2C Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
I2C
(1)
(2)
(3)
42
SCL
M2
N2
I/O/Z
DVDD33
For I2C, this pin is I2C clock. In I2C master mode, this pin is an
output. In I2C slave mode, this pin is an input.
When the I2C module is used, for proper device operation, this pin
must be pulled up via an external resistor.
SDA
M3
P2
I/O/Z
DVDD33
For I2C, this pin is the I2C bi-directional data signal.
When the I2C module is used, for proper device operation, this pin
must be pulled up via an external resistor.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-19. Multichannel Buffered Serial Port 0 (McBSP0) Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
Multichannel Buffered Serial Port 0 (McBSP0)
Pin Muxing Control: TBD
CLKS0/TOUT0L/
GP[97]
J4
L3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McBSP0, Timer0, and GPIO.
For McBSP0, it is McBSP0 external clock source (I).
ACLKR0/CLKX0/
GP[99]
H1
J1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 transmit clock CLKX0 (I/O/Z).
AHCLKR0/CLKR0/
GP[101]
J2
K1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 receive clock CLKR0 (I/O/Z).
AXR0[2]/FSX0/
GP[103]
H3
J2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 transmit frame synchronization FSX0
(I/O/Z).
AXR0[3]/FSR0/
GP[102]
G4
J3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 receive frame synchronization FSR0
(I/O/Z).
AXR0[1]/DX0/
GP[104]
J3
K2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 data transmit output DX0 (O/Z).
AFSR0/DR0/
GP[100]
H4
K3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McBSP0, it is McBSP0 data receive input DR0 (I).
(1)
(2)
(3)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-20. Multichannel Audio Serial Port (McASP0) Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 mute input AMUTEIN0 (I).
DESCRIPTION
McASP0
AMUTEIN0/
GP[109]
F2
G3
I/O/Z
IPD
DVDD33
AMUTE0/
GP[110]
G3
H3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 mute output AMUTE0 (O/Z).
ACLKR0/CLKX0/
GP[99]
H1
J1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 receive bit clock ACLKR0 (I/O/Z).
AHCLKR0/CLKR0/
GP[101]
J2
K1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 receive high-frequency master clock
AHCLKR0 (I/O/Z).
ACLKX0/
GP[106]
F1
G1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 transmit bit clock ACLKX0 (I/O/Z).
AHCLKX0/
GP[108]
G1
H1
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 transmit high-frequency master clock
AHCLKX0 (I/O/Z).
AFSR0/DR0/
GP[100]
H4
K3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 receive frame synchronization AFSR0
(I/O/Z).
AFSX0/
GP[107]
G2
G2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 transmit frame synchronization AFSX0
(I/O/Z).
AXR0[3]/FSR0/
GP[102]
G4
J3
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 transmit/receive (TX/RX) data pin 3
AXR0[3] (I/O/Z).
AXR0[2]/FSX0/
GP[103]
H3
J2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 transmit/receive (TX/RX) data pin 2
AXR0[2] (I/O/Z).
AXR0[1]/DX0/
GP[104]
J3
K2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0, McBSP0, and GPIO.
For McASP0, it is McASP0 transmit/receive (TX/RX) data pin 1
AXR0[1] (I/O/Z).
AXR0[0]/
GP[105]
H2
H2
I/O/Z
IPD
DVDD33
This pin is multiplexed between McASP0 and GPIO.
For McASP0, it is McASP0 transmit/receive (TX/RX) data pin 0
AXR0[0] (I/O/Z).
(1)
(2)
(3)
44
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-21. UART0 Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
This pin is multiplexed between UART0 (Data) and GPIO.
When used by UART0 this pin is the receive data input URXD0.
DESCRIPTION
UART0
(1)
(2)
(3)
URXD0/
GP[85]
L2
M2
I/O/Z
IPU
DVDD33
UTXD0/
GP[86]
K3
N1
I/O/Z
IPU
DVDD33
This pin is multiplexed between UART0 (Data) and GPIO.
In UART0 mode, this pin is the transmit data output UTXD0.
UCTS0/
GP[87]
L1
P1
I/O/Z
IPU
DVDD33
This pin is multiplexed between the UART0 (Flow Control) and GPIO.
In UART0 mode, this pin is the clear to send input UCTS0.
URTS0/
PWM0/
GP[88]
L3
M3
I/O/Z
IPU
DVDD33
This pin is multiplexed between the UART0 (Flow Control), PWM0,
and GPIO.
In UART0 mode, this pin is the ready to send output URTS0.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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TMS320C6421
Fixed-Point Digital Signal Processor
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Table 2-22. PWM0, PWM1, and PWM2 Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
PWM2
CLKOUT0/PWM2/
GP[84]
M1
R1
I/O/Z
IPD
DVDD33
I/O/Z
IPD
DVDD33
This pin is multiplexed between the System Clock generator (PLL1),
PWM2, and GPIO.
For PWM2, this pin is output PWM2.
PWM1
GP[4]/PWM1
F3
F3
This pin is multiplexed between GPIO and PWM1.
For PWM1, this pin is output PWM1.
PWM0
URTS0/PWM0/
GP[88]
(1)
(2)
(3)
46
L3
M3
I/O/Z
IPU
DVDD33
This pin is multiplexed between the UART0 (Flow Control), PWM0,
and GPIO.
For PWM0, this pin is output PWM0.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-23. Timer 0, Timer 1, and Timer 2 Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
Timer 2
No external pins. The Timer 2 (watchdog) peripheral pins are not pinned out as external pins.
Timer 1
TINP1L/
GP[56]
L4
P3
I/O/Z
IPU
DVDD33
This pin is multiplexed between the Timer 1 and GPIO.
For Timer 1, this pin is the timer 1 input pin for the lower 32-bit
counter
TOUT1L/
GP[55]
K4
N3
I/O/Z
IPU
DVDD33
This pin is multiplexed between the Timer 1 and GPIO.
For Timer 1, this pin is the timer 1 output pin for the lower 32-bit
counter
Timer 0
(1)
(2)
(3)
TINP0L/
GP[98]
K2
L2
I/O/Z
IPD
DVDD33
This pin is multiplexed between the Timer 0 and GPIO.
For Timer 0, this pin is the timer 0 input pin for the lower 32-bit
counter
CLKS0/
TOUT0L/
GP[97]
J4
L3
I/O/Z
IPD
DVDD33
This pin is multiplexed between the McBSP0, Timer 0, and GPIO.
For Timer 0, this pin is the timer 0 output pin for the lower 32-bit
counter
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
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Table 2-24. GPIO Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
DESCRIPTION
GPIO
92 out of 111 GPIO pins on the C6421 device are multiplexed with other peripherals pin functions (e.g., EMAC/MDIO, McASP0, McBSP0,
Timer 0, Timer 1, UART0, PWM0, PWM1, PWM2, EMIFA, and the CLKOUT0 pin), see the peripheral-specific Terminal Functions tables for
the GPIO multiplexing.
(1)
(2)
(3)
48
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-25. Standalone GPIO 3.3 V Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
TYPE (1)
OTHER (2) (3)
This pin functions as standalone GPIO pin 0.
DESCRIPTION
Standalone GPIO 3.3 V
GP[0]
E1
E1
I/O/Z
IPD
DVDD33
GP[1]
E2
E2
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 1.
GP[2]
E3
F1
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 2.
GP[3]
E4
F2
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 3.
GP[22]/
(BOOTMODE0)
F18
J20
I/O/Z
IPD
DVDD33
GP[23]/
(BOOTMODE1)
F15
K20
I/O/Z
IPD
DVDD33
GP[24]/
(BOOTMODE2)
G15
L20
I/O/Z
IPD
DVDD33
GP[25]/
(BOOTMODE3)
G16
H21
I/O/Z
IPD
DVDD33
GP[26]/
(FASTBOOT)
G17
K19
I/O/Z
IPD
DVDD33
GP[36]
C15
B19
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 36.
Note: GP[36] is only available when AEM = 0 or 5.
GP[37]
B15
B18
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 37.
Note: GP[37] is only available when AEM = 0 or 5.
GP[38]
C14
B17
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 38.
Note: GP[38] is only available when AEM = 0 or 5.
GP[39]
B14
A16
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 39.
Note: GP[39] is only available when AEM = 0 or 5.
GP[40]
D14
C18
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 40.
Note: GP[40] is only available when AEM = 0 or 5.
GP[41]
C13
B16
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 41.
Note: GP[41] is only available when AEM = 0 or 5.
GP[42]
B13
B15
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 42.
Note: GP[42] is only available when AEM = 0 or 5.
GP[43]
A12
A15
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 43.
Note: GP[43] is only available when AEM = 0 or 5.
GP[53]
A13
A17
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 53.
GP[54]
A14
A18
I/O/Z
IPD
DVDD33
This pin functions as standalone GPIO pin 54.
(1)
(2)
(3)
These pins function as boot configuration pins during device reset.
After device reset, these pins function as standalone GPIO.
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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TMS320C6421
Fixed-Point Digital Signal Processor
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
www.ti.com
Table 2-26. Reserved Terminal Functions
SIGNAL
TYPE (1)
OTHER (2) (3)
DESCRIPTION
NAME
ZWT
NO.
ZDU
NO.
RSV1
E5
D4
Reserved. (Leave unconnected, do not connect to power or ground)
RSV2
K5
L4
Reserved. (Leave unconnected, do not connect to power or ground)
RESERVED
(1)
(2)
(3)
50
RSV3
L5
M4
RSV4
L15
P19
AO
Reserved. (Leave unconnected, do not connect to power or ground)
Reserved. (Leave unconnected, do not connect to power or ground)
RSV5
R13
W16
AO
Reserved. (Leave unconnected, do not connect to power or ground)
RSV6
N19
V22
AI
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV7
P19
V21
AO
Reserved. (Leave unconnected, do not connect to power or ground)
RSV8
P18
U22
AO
Reserved. (Leave unconnected, do not connect to power or ground)
RSV9
N18
T21
AO
Reserved. (Leave unconnected, do not connect to power or ground)
RSV10
N17
T22
AO
Reserved. (Leave unconnected, do not connect to power or ground)
RSV11
P16
U20
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV12
P17
V20
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV13
N15
T20
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV14
P15
T19
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV15
N16
U21
Reserved. This pin must be tied directly to VSS for normal device
operation.
RSV16
T3
W3
I
IPD
DVDD33
Reserved. For proper C6421 device operation, this pin must be pulled
down via an external resistor and tied to VSS.
RSV17
E10
D12
I/O/Z
IPD
DVDD33
Reserved. (Leave unconnected, do not connect to power or ground)
RSV18
E11
D13
I/O/Z
IPD
DVDD33
Reserved. (Leave unconnected, do not connect to power or ground)
RSV19
E12
D14
I/O/Z
IPD
DVDD33
Reserved. (Leave unconnected, do not connect to power or ground)
RSV20
T14
Y15
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV21
T16
Y18
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV22
U14
AA15
I/O/Z
Reserved. For proper C6421 device operation, this pin must be pulled
down via an external 1-kΩ resistor.
RSV23
U16
AA18
I/O/Z
Reserved. For proper C6421 device operation, this pin must be pulled
down via an external 1-kΩ resistor.
RSV24
W14
AA16
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV25
V14
Y16
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV26
W15
AB16
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV27
V15
AA17
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV28
U15
Y17
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV29
W16
AB17
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV30
V16
AB18
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV31
T17
AA19
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV32
V17
Y19
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV33
U17
AB19
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
IPD = Internal pulldown, IPU = Internal pullup. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.9.1, Pullup/Pulldown Resistors.
Specifies the operating I/O supply voltage for each signal
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Table 2-26. Reserved Terminal Functions (continued)
SIGNAL
ZWT
NO.
ZDU
NO.
TYPE (1)
RSV34
T18
AA20
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV35
W17
Y20
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV36
U18
AB20
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
NAME
OTHER (2) (3)
DESCRIPTION
RSV37
V18
Y21
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV38
U19
AA21
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
RSV39
T19
Y22
I/O/Z
Reserved. (Leave unconnected, do not connect to power or ground)
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TMS320C6421
Fixed-Point Digital Signal Processor
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Table 2-27. Supply Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
A1
A2
A2
A21
TYPE (1)
OTHER
DESCRIPTION
SUPPLY VOLTAGE PINS
DVDD33
A18
B1
E6
D6
E8
D8
F5
D10
F7
D16
F9
D18
F11
E3
F13
E5
G6
E7
G8
E9
G10
E11
G12
E13
G14
E15
H5
E17
H18
E19
J1
F4
J6
F18
J14
G5
J16
G19
K15
H4
K17
H18
L6
J5
M5
J19
M15
K4
N6
K18
P1
L1
S
3.3 V I/O supply voltage
(see Section 6.3.3, Power-Supply Decoupling.)
L5
L21
M18
M20
N5
N19
P4
P18
P20
P22
R5
T4
(1)
52
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
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Table 2-27. Supply Terminal Functions (continued)
SIGNAL
NAME
DVDDR2
ZWT
NO.
ZDU
NO.
L14
U5
P5
V1
P7
V4
P9
V6
P11
V8
P13
V10
R4
V12
R6
V14
R8
V16
R10
V18
R12
W7
R14
W9
R16
W11
T5
W17
V1
W19
W18
AA1
W19
AB21
TYPE (1)
OTHER
DESCRIPTION
S
1.8 V DDR2 I/O supply voltage
(see the Power-Supply Decoupling section of this data manual)
S
1.20 V supply voltage ( -7/-6/-5/-4/-Q6/-Q5/-Q4 devices)
1.05 V core supply voltage (-7/-6/-5/-4/-L/-Q5 devices)
(see the Power-Supply Decoupling section of this data manual)
AB22
CVDD
H7
J10
H9
J11
H11
J12
H13
J13
J8
K9
J10
K14
J12
L9
K7
L13
K9
L14
K11
M9
K13
M10
L8
M14
L10
N9
L12
N14
M7
P10
M9
P11
M11
P12
M13
P13
N8
N10
N12
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TMS320C6421
Fixed-Point Digital Signal Processor
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Table 2-28. Ground Terminal Functions
SIGNAL
NAME
ZWT
NO.
ZDU
NO.
A19
A1
B1
A22
B19
B22
E7
D5
E9
D7
TYPE (1)
OTHER
DESCRIPTION
GROUND PINS
VSS
(1)
54
E13
D9
F4
D11
F6
D15
F8
D17
F10
E4
F12
E6
F14
E8
G5
E10
G7
E12
G9
E14
G11
E16
G13
E18
G18
F5
H6
F19
H8
G4
H10
G18
H12
H5
H14
H19
H19
J4
J5
J9
J7
J14
J9
J18
J11
K5
J13
K10
J15
K11
J17
K12
J18
K13
K1
L10
K6
L11
K8
L12
K10
L18
K12
L22
K14
M1
K16
M5
GND
Ground pins
I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
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Table 2-28. Ground Terminal Functions (continued)
SIGNAL
NAME
VSS
ZWT
NO.
ZDU
NO.
L7
M11
L9
M12
L11
M13
L13
M19
L17
N4
L19
N10
M6
N11
M8
N12
M10
N13
M12
N18
M14
P5
M16
P9
M17
P14
M18
P21
M19
R4
N5
R18
N7
R19
N9
R20
N11
R21
N13
R22
N14
T5
P6
T18
P8
U4
P10
U18
P12
U19
P14
V5
R1
V7
R5
V9
R7
V11
R9
V13
R11
V15
R15
V17
R17
V19
R18
W1
R19
W6
V19
W8
W1
W10
W2
W20
TYPE (1)
GND
OTHER
DESCRIPTION
Ground pins
W21
W22
AA22
AB1
AB2
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TMS320C6421
Fixed-Point Digital Signal Processor
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2.6 Device Support
2.6.1
Development Support
TI offers an extensive line of development tools for the TMS320C642x platform, including tools to evaluate
the performance of the processors, generate code, develop algorithm implementations, and fully integrate
and debug software and hardware modules. The tool's support documentation is electronically available
within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of TMS320C642x-based applications:
Software Development Tools:
Code Composer Studio™ Integrated Development Environment (IDE): including Editor
C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any SoC application.
Hardware Development Tools:
Extended Development System (XDS™) Emulator (supports TMS320C642x multiprocessor system
debug) EVM (Evaluation Module)
For a complete listing of development-support tools for the TMS320C642x platform, visit the Texas
Instruments web site on the Worldwide Web at http://www.ti.com uniform resource locator (URL). For
information on pricing and availability, contact the nearest TI field sales office or authorized distributor.
2.7 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320C6421ZWTQ6). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX
Experimental device that is not necessarily representative of the final device's electrical
specifications.
TMP
Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
TMS
Fully-qualified production device.
Support tool development evolutionary flow:
TMDX
Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS
Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
56
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Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, ZWT), the temperature range (for example, "Blank" is the commercial
temperature range), and the device speed range in megahertz (for example, "Blank" is the default
[600-MHz]).
Figure 2-12 provides a legend for reading the complete device name for any TMS320C642x DSP platform
member.
TMS
320
PREFIX
TMX = Experimental device
TMS = Qualified device
DEVICE FAMILY
320 = TMS320™ DSP Family
DEVICE
C64x+™ DSP:
C6424
C6421
C6421
( ) ZWT
( )
( )
DEVICE SPEED RANGE
4 = 400 MHz
5 = 500 MHz
6 = 600 MHz
7 = 700 MHz
L = Low Power Device
TEMPERATURE RANGE (JUNCTION)
Blank
= 0° C to 90° C, Commercial Grade
Q
= -40°C to 125°C, Automotive Grade
R
= 0° C to 90° C, Commercial Grade (Tape and Reel)
S
= -40°C to 125°C, Automotive Grade (Tape and Reel)
PACKAGE TYPE(A)
ZWT = 361-pin plastic BGA, with Pb-Free soldered balls
ZDU = 376-pin plastic BGA, with Pb-Free soldered balls [Green]
SILICON REVISION:
Blank = Revision 1.3
A.
B.
C.
D.
BGA = Ball Grid Array
For “TMX” initial devices, the device number is C6424.
Not all combinations are available. For more information, see the Orderable Devices table in the Packing Information section.
The device speed range symbolization indicates the maximum CPU frequency at the highest CVDD voltage supported. To determine
the maximum CPU frequency at other supported CVDD voltages, refer to the PLL1 and PLL2 section.
Figure 2-12. Device Nomenclature
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2.8 Documentation Support
2.8.1
Related Documentation From Texas Instruments
The following documents describe the TMS320C642x Fixed-Point Digital Signal Processor (DSP). Copies
of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the
search box provided at www.ti.com.
The current documentation that describes the C642x DSP, related peripherals, and other technical
collateral, is available in the C6000 DSP product folder at: www.ti.com/c6000.
58
SPRUEM3
TMS320C642x DSP Peripherals Overview Reference Guide. Provides an overview and
briefly describes the peripherals available on the TMS320C642x Digital Signal Processor
(DSP).
SPRAA84
TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The
objective of this document is to indicate differences between the two cores. Functionality in
the devices that is identical is not included.
SPRU732
TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRU871
TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
Device Overview
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3 Device Configurations
3.1 System Module Registers
The system module includes status and control registers required for configuration of the device. Brief
descriptions of the various registers are shown in Table 3-1. System Module registers required for device
configurations are discussed in the following sections.
Table 3-1. System Module Register Memory Map
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x01C4 0000
PINMUX0
Pin Multiplexing Control 0 (see Section 3.7.2.1, PINMUX0 Register
Description).
0x01C4 0004
PINMUX1
Pin Multiplexing Control 1 (see Section 3.7.2.2, PINMUX1 Register
Description).
0x01C4 0008
DSPBOOTADDR
DSP Boot Address (see Section 3.4.2.3, DSPBOOTADDR Register).
0x01C4 000C
BOOTCOMPLT
Boot Complete (see Section 3.4.2.2, BOOTCMPLT Register).
0x01C4 0010
–
Reserved
0x01C4 0014
BOOTCFG
Device Boot Configuration (see Section 3.4.2.1, BOOTCFG Register).
0x01C4 0018 - 0x01C4 0027
–
Reserved
0x01C4 0028
JTAGID
JTAG ID (see Section 6.21.1, JTAG ID (JTAGID) Register
Description(s)).
0x01C4 002C
–
Reserved
0x01C4 0030
HPICTL
HPI Control (see Section 3.6.2.1, HPI Control Register).
0x01C4 0034
–
Reserved
0x01C4 0038
–
Reserved
0x01C4 003C
MSTPRI0
Bus Master Priority Control 0 (see Section 3.6.1, Switch Central
Resource (SCR) Bus Priorities).
0x01C4 0040
MSTPRI1
Bus Master Priority Control 1 (see Section 3.6.1, Switch Central
Resource (SCR) Bus Priorities).
0x01C4 0044
–
Reserved
0x01C4 0048
VDD3P3V_PWDN
VDD 3.3-V I/O Powerdown Control (see Section 3.2, Power
Considerations).
0x01C4 004C
DDRVTPER
DDR2 VTP Enable Register (see Section 6.9.4, DDR2 Memory
Controller).
0x01C4 0050 - 0x01C4 0080
–
Reserved
0x01C4 0084
TIMERCTL
Timer Control (see Section 3.6.2.2, Timer Control Register).
0x01C4 0088
EDMATCCFG
EDMA Transfer Controller Default Burst Size Configuration (see
Section 3.6.2.3, EDMA TC Configuration Register).
0x01C4 008C
–
Reserved
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3.2 Power Considerations
The C6421 provides several means of managing power consumption.
As described in the Section 6.3.4, C6421 Power and Clock Domains, the C6421 has one single power
domain—the “Always On” power domain. Within this power domain, the C6421 utilizes local clock gating
via the Power and Sleep Controller (PSC) to achieve power savings. For more details on the PSC, see
Section 6.3.5, Power and Sleep Controller (PSC) and the TMS320C642x Power and Sleep Controller
(PSC) User's Guide (literature number SPRUEN8).
Some of the C6421 peripherals support additional power saving features. For more details on power
saving features supported, see the TMS320C642x Peripherals Overview Reference Guide (literature
number SPRUEM3).
Most C6421 3.3-V I/Os can be powered-down to reduce power consumption. The VDD3P3V_PWDN
register in the System Module (see Figure 3-1) is used to selectively power down unused 3.3-V I/O pins.
For independent control, the 3.3-V I/Os are separated into functional groups—most of which are named
according to the pin multiplexing groups (see Table 3-2). For these I/O groups, only the I/O buffers needed
for Host/EMIFA Boot or Power-Up Operations are powered up by default (CLKOUT Block, EMIFA Block,
Host Block, and GPIO Block).
Note: To save power, all other I/O buffers are powered down by default. Before using these pins, the user
must program the VDD3P3V_PWDN register to power up the corresponding I/O buffers.
For a list of multiplexed pins on the device and the pin mux group each pin belongs to, see
Section 3.7.3.1, Multiplexed Pins on C6421.
Note: The VDD3P3V_PWDN register only controls the power to the I/O buffers. The Power and Sleep
Controller (PSC) determines the clock/power state of the peripheral.
31
16
RESERVED
R-0000 0000 0000 0000
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
RESERVED
RSV
EMBK3
UR0FC
UR0DAT
TIMER1
TIMER0
SP
PWM1
GPIO
HOST
EMBK2
EMBK1
EMBK0
CLKOUT
R-00
R/W-0
R/W-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Figure 3-1. VDD3P3V_PWDN Register— 0x01C4 0048
Table 3-2. VDD3P3V_PWDN Register Descriptions
BIT
NAME
31:14
RESERVED
13
RSV
DESCRIPTION
Reserved. Read-only, writes have no effect.
Reserved. For proper device operation, this bit should be programmed to "1" during device
initialization (see Section 3.8, Device Initialization Sequence After Reset).
EMIFA Sub-Block 3 I/O Power Down Control.
Controls the power of the 8 I/O pins in the EMIFA Sub-Block 3.
12
EMBK3
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
UART0 Flow Control Block I/O Power Down Control.
Controls the power of the 2 I/O pins in the UART0 Flow Control Block.
11
UR0FC
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
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Table 3-2. VDD3P3V_PWDN Register Descriptions (continued)
BIT
NAME
DESCRIPTION
UART0 Data Block I/O Power Down Control.
Controls the power of the 2 I/O pins in the UART0 Data Block.
10
UR0DAT
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
Timer1 Block I/O Power Down Control.
Controls the power of the 2 I/O pins in the Timer1 Block.
9
TIMER1
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
Timer0 Block I/O Power Down Control.
Controls the power of the 2 I/O pins in the Timer0 Block.
8
TIMER0
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
7
SP
Serial Port Block I/O Power Down Control.
Controls the power of the 12 I/O pins in the Serial Port Block (Serial Port Sub-Block 0 and
Serial Port Sub-Block 1).
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
PWM1 Block I/O Power Down Control.
Controls the power of the 1 I/O pin in the PWM1 Block.
6
PWM1
0 = I/O pins powered up.
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z) [default].
GPIO Block I/O Power Down Control.
Controls the power of the 4 I/O pins in the GPIO Block: GP[3:0].
5
GPIO
Note: GPIO Block contains standalone GPIO pins and is not a pin mux group.
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
Host Block I/O Power Down Control.
Controls the power of the 27 I/O pins in the Host Block.
4
HOST
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
EMIFA Sub-Block 2 I/O Power Down Control.
Controls the power of the 3 I/O pins in the EMIFA Sub-Block 2.
3
EMBK2
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
EMIFA Sub-Block 1 I/O Power Down Control.
Controls the power of the 29 I/O pins in the EMIFA Sub-Block 1.
2
EMBK1
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
EMIFA Sub-Block 0 I/O Power Down Control.
Controls the power of the 21 I/O pins in the EMIFA Sub-Block 0.
1
EMBK0
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
CLKOUT Block I/O Power Down Control.
Controls the power of the 1 I/O pin in the CLKOUT Block.
0
CLKOUT
0 = I/O pins powered up [default].
1 = I/O pins powered down and not operational. Outputs are 3-stated (Hi-Z).
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3.3 Clock Considerations
Global device and local peripheral clocks are controlled by the PLL Controllers (PLLC1 and PLLC2) and
the Power and Sleep Controller (PSC).
3.3.1
Clock Configurations after Device Reset
After device reset, the user is responsible for programming the PLL Controllers (PLLC1 and PLLC2) and
the Power and Sleep Controller (PSC) to bring the device up to the desired clock frequency and the
desired peripheral clock state (clock gating or not).
For additional power savings, some of the C6421 peripherals support clock gating within the peripheral
boundary. For more details on clock gating and power saving features supported by a specific peripheral,
see the TMS320C642x Peripherals Overview Reference Guide (literature number SPRUEM3).
3.3.1.1 Device Clock Frequency
The C6421 defaults to PLL bypass mode. To bring the device up to the desired clock frequency, the user
should program PLLC1 and PLLC2 after device reset.
C6421 supports a FASTBOOT option, where upon exit from device reset the internal bootloader code
automatically programs the PLLC1 into PLL mode with a specific PLL multiplier and divider to speed up
device boot. While the FASTBOOT option is beneficial for faster boot, the PLL multiplier and divider
selected for boot may not be the exact frequency desired for the run-time application. It is the user's
responsibility to reconfigure PLLC1 after fastboot to bring the device into the desired clock frequency.
Section 3.4.1, Boot Modes, discusses the different fast boot modes in more detail.
The user must adhere to the various clock requirements when programming the PLLC1 and PLLC2:
• Fixed frequency ratio requirements between CLKDIV1, CLKDIV3, and CLKDIV6 clock domains. For
more details on the frequency ratio requirements, see Section 6.3.4, C6421 Power and Clock
Domains.
• PLL multiplier and frequency ranges. For more details on PLL multiplier and frequency ranges, see
Section 6.7.1, PLL1 and PLL2.
3.3.1.2 Module Clock State
The clock and reset state for each of the modules is controlled by the Power and Sleep Controller (PSC).
Table 3-3 shows the default state of each module after a device-level global reset. The C6421 device has
four different module states—Enable, Disable, SyncReset, or SwRstDisable. For more information on the
definitions of the module states, the PSC, and PSC programming, see Section 6.3.5, Power and Sleep
Controller (PSC) and the TMS320C642x Power and Sleep Controller (PSC) User's Guide (literature
number SPRUEN8).
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Table 3-3. C6421 Default Module States
LPSC #
DEFAULT MODULE STATE
[PSC Register MDSTATn.STATE]
MODULE NAME
2
EDMACC
SwRstDisable
3
EDMATC0
SwRstDisable
4
EDMATC1
SwRstDisable
5
EDMATC2
SwRstDisable
6
EMAC Memory Controller
SwRstDisable
7
MDIO
SwRstDisable
8
EMAC
SwRstDisable
9
McASP0
SwRstDisable
11
VLYNQ
SwRstDisable
12
HPI
SwRstDisable
13
DDR2 Memory Contoller
SwRstDisable
14
EMIFA
16
McBSP0
SwRstDisable
18
I2C
SwRstDisable
19
UART0
SwRstDisable
23
PWM0
SwRstDisable
24
PWM1
SwRstDisable
25
PWM2
SwRstDisable
26
GPIO
SwRstDisable
27
TIMER0
SwRstDisable
28
TIMER1
SwRstDisable
39
C64x+ CPU
Enable
SwRstDisable, if configuration pins AEM[2:0] = 000b
Enable, if configuration pins AEM[2:0] = Others [010b and 101b]
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3.4 Boot Sequence
The boot sequence is a process by which the device's memory is loaded with program and data sections,
and by which some of the device's internal registers are programmed with predetermined values. The boot
sequence is started automatically after each device-level global reset. For more details on device-level
global resets, see Section 6.5, Reset.
There are several methods by which the memory and register initialization can take place. Each of these
methods is referred to as a boot mode. The boot mode to be used is selected at reset. For more
information on the bootmode selections, see Section 3.4.1, Boot Modes.
The device is booted through multiple means—primary bootloaders within internal ROM or EMIFA, and
secondary user bootloaders from peripherals or external memories. Boot modes, pin configurations, and
register configurations required for booting the device, are described in the following subsections.
3.4.1
Boot Modes
The C6421 boot modes are determined by these device boot and configuration pins. For information on
how these pins are sampled at device reset, see Section 6.5.1.2, Latching Boot and Configuration Pins.
• BOOTMODE[3:0]
• FASTBOOT
• PLLMS[2:0]
BOOTMODE[3:0] determines the type of boot (e.g., I2C Boot, EMIFA Boot, or HPI Boot, etc.). FASTBOOT
determines if the PLL is enabled during boot to speed up the boot process.
PLLMS[2:0] is used by bootloader code to determine the PLL multiplier used during fastboot modes
(FASTBOOT = 1).
The C6421 boot modes are grouped into two categories—Non-Fastboot Modes and User-Select Multiplier
Fastboot Modes.
•
•
Non-Fastboot Modes (FASTBOOT = 0): The device operates in default PLL bypass mode during
boot. The Non-Fastboot bootmodes available on the C6421 are shown in Table 3-4.
User-Select Multiplier Fastboot Modes (FASTBOOT = 1): The bootloader code speeds up the
device during boot. The PLL multiplier is selected by the user via the PLLMS[2:0] pins. The
User-Select Multiplier Fastboot bootmodes available on the C6421 are shown in Table 3-5.
All other modes not shown in these tables are reserved and invalid settings.
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Table 3-4. Non-Fastboot Modes (FASTBOOT = 0)
DEVICE BOOT AND
CONFIGURATION
PINS
PLLC1 CLOCK SETTING AT BOOT
BOOT DESCRIPTION (1)
C6421 DSP
(Master/Slave)
BOOTMODE[3:0]
(1)
(2)
(3)
PLL
MODE (2)
CLKDIV1 DOMAIN
(SYSCLK1 DIVIDER)
DEVICE
FREQUENCY
(SYSCLK1)
DSPBOOTADDR
(DEFAULT) (1)
0000
No Boot (Emulation Boot)
Master
Bypass
/1
CLKIN
0001
Reserved
–
–
–
–
0x0010 0000
–
0010
HPI Boot
Slave
Bypass
/1
CLKIN
0x0010 0000
0011
Reserved
–
–
–
–
–
0100
EMIFA ROM Direct Boot
[PLL Bypass Mode]
Master
Bypass
/1
CLKIN
0x4200 000
0101
I2C Boot
[STANDARD MODE] (3)
Master
Bypass
/1
CLKIN
0x0010 0000
0110
16-bit SPI Boot [McBSP0]
Master
Bypass
/1
CLKIN
0x0010 0000
0111
NAND Flash Boot
Master
Bypass
/1
CLKIN
0x0010 0000
1000
UART Boot without
Hardware Flow Control
[UART0]
Master
Bypass
/1
CLKIN
0x0010 0000
1001
Reserved
1010
VLYNQ Boot
1011
1100
–
–
–
–
–
Slave
Bypass
/1
CLKIN
0x0010 0000
Reserved
–
–
–
–
–
Reserved
–
–
–
–
–
1101
Reserved
–
–
–
–
–
1110
UART Boot with Hardware
Flow Control [UART0]
Master
Bypass
/1
CLKIN
0x0010 0000
1111
24-bit SPI Boot
(McBSP0 + GP[97])
Master
Bypass
/1
CLKIN
0x0010 0000
For all boot modes that default to DSPBOOTADDR = 0x0010 0000 (i.e., all boot modes except the EMIFA ROM Direct Boot,
BOOTMODE[3:0] = 0100, FASTBOOT = 0), the bootloader code disables all C64x+ cache (L2, L1P, and L1D) so that upon exit from the
bootloader code, all C64x+ memories are configured as all RAM. If cache use is required, the application code must explicitly enable the
cache. For more information on the bootloader, see the Using the TMS320C642x Bootloader Application Report (literature number
SPRAAK5).
The PLL MODE for Non-Fastboot Modes is fixed as shown in this table; therefore, the PLLMS[2:0] configuration pins have no effect on
the PLL MODE.
I2C Boot (BOOTMODE[3:0] = 0101b) is only available if the MXI/CLKIN frequency is between 21 MHz and 30 MHz. I2C Boot is not
available for MXI/CLKIN frequencies less than 21 MHz.
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Table 3-5. User-Select Multiplier Fastboot Modes (FASTBOOT = 1)
DEVICE BOOT AND
CONFIGURATION
PINS
PLLC1 CLOCK SETTING AT BOOT
C6421 DSP
(Master/Slave)
BOOT DESCRIPTION (1)
BOOTMODE[3:0]
(1)
(2)
(3)
PLL
MODE (2)
CLKDIV1 DOMAIN
(SYSCLK1 DIVIDER)
DEVICE
FREQUENCY
(SYSCLK1)
DSPBOOTADDR
(DEFAULT) (1)
0000
No Boot (Emulation Boot)
Master
Bypass
/1
CLKIN
0001
Reserved
–
–
–
–
0x0010 0000
–
0010
HPI Boot
Slave
Table 3-6
/2
Table 3-6
0x0010 0000
0011
Reserved
–
–
–
–
–
0100
EMIFA ROM FASTBOOT
with AIS
Master
Table 3-6
/2
Table 3-6
0x0010 0000
0101
I2C Boot
[FAST MODE] (3)
Master
Table 3-6
/2
Table 3-6
0x0010 0000
0110
16-bit SPI Boot [McBSP0]
Master
Table 3-6
/2
Table 3-6
0x0010 0000
0111
NAND Flash Boot
Master
Table 3-6
/2
Table 3-6
0x0010 0000
1000
UART Boot without
Hardware Flow Control
[UART0]
Master
Table 3-6
/2
Table 3-6
0x0010 0000
1001
EMIFA ROM FASTBOOT
without AIS
Master
Table 3-6
/2
Table 3-6
–
1010
VLYNQ Boot
Slave
x20
/2
CLKIN x20 / 2
0x0010 0000
1011
Reserved
–
–
–
–
–
1100
Reserved
–
–
–
–
–
1101
Reserved
–
–
–
–
–
1110
UART Boot with Hardware
Flow Control [UART0]
Master
Table 3-6
/2
Table 3-6
0x0010 0000
1111
24-bit SPI Boot (McBSP0 +
GP[97])
Master
x20
/2
CLKIN x20 / 2
0x0010 0000
For all boot modes that default to DSPBOOTADDR = 0x0010 0000, the bootloader code disables all C64x+ cache (L2, L1P, and L1D)
so that upon exit from the bootloader code, all C64x+ memories are configured as all RAM. If cache use is required, the application
code must explicitly enable the cache.For more information on the bootloader, see the Using the TMS320C642x Bootloader Application
Report (literature number SPRAAK5).
Any supported PLL MODE is available. [See Table 3-6 for supported C6421 PLL MODE options].
I2C Boot (BOOTMODE[3:0] = 0101b) is only available if the MXI/CLKIN frequency is between 21 MHz to 30 MHz. I2C Boot is not
available for MXI/CLKIN frequencies less than 21 MHz.
Table 3-6. PLL Multiplier Selection (PLLMS[2:0]) in User-Select Multiplier Fastboot Modes
(FASTBOOT = 1)
DEVICE BOOT AND
CONFIGURATION PINS
66
PLLC1 CLOCK SETTING AT BOOT
PLLMS[2:0]
PLL MODE
CLKDIV1 DOMAIN
(SYSCLK1 DIVIDER)
DEVICE FREQUENCY (SYSCLK1)
000
x20
/2
CLKIN x20 / 2
001
x15
/2
CLKIN x15 / 2
010
x16
/2
CLKIN x16 / 2
011
x18
/2
CLKIN x18 / 2
100
x22
/2
CLKIN x22 / 2
101
x25
/2
CLKIN x25 / 2
110
x27
/2
CLKIN x27 / 2
111
x30
/2
CLKIN x30 / 2
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As shown in Table 3-4 and Table 3-5, at device reset the Boot Controller defaults the DSPBOOTADDR to
one of two values based on the boot mode selected. In all boot modes, the C64x+ is immediately released
from reset and begins executing from address location indicated in DSPBOOTADDR.
• Internal Bootloader ROM (0x0010 0000): For most boot modes, the DSPBOOTADDR defaults to the
internal Bootloader ROM so that the DSP can immediately execute the bootloader code in the internal
ROM. The bootloader code decodes the captured BOOTMODE, FASTBOOT, and PLLMS information
(in the BOOTCFG register) to determine the proper boot operation.
Note: For all boot modes that default to DSPBOOTADDR = 0x0010 0000, the bootloader code
disables all C64x+ cache (L2, L1P, and L1D) so that upon exit from the bootloader code, all C64x+
memories are configured as all RAM. If cache use is required, the application code must explicitly
enable the cache. For more information on boot modes, see Section 3.4.1, Boot Modes. For more
information on the bootloader, see the Using the TMS320C642x Bootloader Application Report
(literature number SPRAAK5).
•
EMIFA Chip Select Space 2 (0x4200 0000): The EMIFA ROM Direct Boot in PLL Bypass Mode
(BOOTCFG settings BOOTMODE[3:0] = 0100b, FASTBOOT = 0) is the only exception where the
DSPBOOTADDR defaults to the EMIFA Chip Select Space 2. The DSP begins execution directly from
the external ROM at this EMIFA space.
For more information how the bootloader code handles each boot mode, see the Using the TMS320C642x
Bootloader Application Report (literature number SPRAAK5).
3.4.1.1 FASTBOOT
When C6421 exits pin reset (RESET or POR released), the PLL Controllers (PLLC1 and PLLC2) default
to PLL Bypass Mode. This means the PLLs are disabled, and the MXI/CLKIN clock input is driving the
chip. All the clock domain divider ratios discussed in Section 6.3.4, C6421 Power and Clock Domains, still
apply. For example, assume an MXI/CLKIN frequency of 25 MHz—meaning the internal clock source for
EMIFA is at CLKDIV3 domain = 25 MHz/3 = 8.3 MHz, a very slow clock. In addition, the EMIFA registers
are reset to the slowest configuration which translates to very slow peripheral operation/boot.
To optimize boot time, the user should reprogram clock settings via the PLLC as early as possible during
the boot process. The FASTBOOT pin facilitates this operation by allowing the device to boot at a faster
clock rate.
Except for the EMIFA ROM Direct Boot in PLL Bypass Mode (BOOTCFG settings BOOTMODE[3:0] =
0100b, FASTBOOT = 0), all other boot modes default to executing from the Internal Bootloader ROM. The
first action that the bootloader code takes is to decode the boot mode. If the FASTBOOT option is
selected (BOOTCFG.FASTBOOT = 1), the bootloader software begins by programming the PLLC1
(System PLLC) to PLL Mode to give the device a slightly faster operation before fetching code from
external devices. The exact PLL multiplier that the bootloader uses is determined by the PLLMS[2:0]
settings, as shown in Table 3-5 and Table 3-6.
Some boot modes must be accompanied with FASTBOOT = 1 so that the corresponding peripheral can
run at a reasonable rate to communicate to the external device(s).
Note: PLLC2 still stays in PLL Bypass Mode, the bootloader does not reconfigure it.
3.4.1.2 Selecting FASTBOOT PLL Multiplier
Table 3-5 and Table 3-6 show the PLL multipliers used by the bootloader code during fastboot
(FASTBOOT = 1) and the resulting device frequency. The user is responsible for selecting the bootmode
with the appropriate PLL multiplier for their MXI/CLKIN clock source so that the device speed and PLL
frequency range requirements are met. For the PLLC1 Clock Frequency Ranges, see Table 6-15, PLLC1
Clock Frequency Ranges in Section 6.7.1, PLL1 and PLL2.
The following are guidelines for PLL output frequency and device speed (frequency):
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PLL Output Frequency: (PLLOUT = CLKIN frequency * boot PLL Multiplier) must stay within the
PLLOUT frequency range in Table 6-15, PLLC1 Clock Frequency Ranges.
Device Frequency: (SYSCLK1) calculated from Table 3-5 must not exceed the SYSCLK1 maximum
frequency in Table 6-15, PLLC1 Clock Frequency Ranges.
For example, for a 600-MHz device with a CLKIN = 25 MHz, in order to stay within the PLLOUT
frequency range and SYSCLK1 maximum frequency from Table 6-15, PLLC1 Clock Frequency
Ranges, the user must select a boot mode with a PLL1 multiplier between x16 and x24.
3.4.1.3 EMIFA Boot Modes
As shown in Table 3-4 and Table 3-5, there are different types of EMIFA Boot Modes. This subsection
summarizes these types of EMIFA boot modes. For further detailed information, see the Using the
TMS320C642x Bootloader Application Report (literature number SPRAAK5).
• EMIFA ROM Direct Boot in PLL Bypass Mode (FASTBOOT = 0, BOOTMODE[3:0] = 0100b)
– The C64x+ fetches the code directly from EMIFA Chip Select 2 Space [EM_CS2] (address
0x4200 0000)
– The PLL is in Bypass Mode
– EMIFA is configured as Asynchronous EMIF. The user is responsible for ensuring the desirable
Asynchronous EMIF pins are available through configuration pins AEM[2:0]. AEM[2:0] must be
configured to 010b [EMIFA (Async) Pinout Mode 2].
• EMIFA ROM Fastboot with AIS (FASTBOOT = 1, BOOTMODE[3:0] = 0100b)
– The C64x+ begins execution from the internal bootloader ROM at address 0x0010 0000.
– The bootloader code programs PLLC1 to PLL Mode to speed up the boot process. The PLL
multiplier value is determined by the PLLMS[2:0] configuration as shown in Table 3-5.
– The bootloader code reads code from the EMIFA EM_CS2 space using the application image script
(AIS) format.
– EMIFA is configured as Asynchronous EMIF. The user is responsible for ensuring the desirable
Asynchronous EMIF pins are available through configuration pins AEM[2:0]. AEM[2:0] must be
configured to 010b [EMIFA (Async) Pinout Mode 2].
• EMIFA ROM Fastboot without AIS: (FASTBOOT = 1, BOOTMODE[3:0] = 1001b)
– The C64x+ begins execution from the internal bootloader ROM at address 0x0010 0000.
– The bootloader code programs PLLC1 to PLL Mode to speed up the boot process. The PLL
multiplier value is determined by the PLLMS[2:0] configuration as shown in Table 3-5.
– The bootloader code then jumps to the EMIFA EM_CS2 space, at which point the C64x+ fetches
the code directly from address 0x4200 0000.
– EMIFA is configured as Asynchronous EMIF. The user is responsible for ensuring the desirable
Asynchronous EMIF pins are available through configuration pins AEM[2:0]. AEM[2:0] must be
configured to 010b [EMIFA (Async) Pinout Mode 2].
• NAND Flash Boot: (FASTBOOT = 0 or 1, BOOTMODE[3:0] = 0111b)
– The C64x+ begins execution from the internal bootloader ROM at address 0x0010 0000.
– Depending on the FASTBOOT and PLLMS[2:0] settings, the bootloader code may program the
PLLC1 to PLL Mode to speed up the boot process. See Table 3-4 and Table 3-5.
– The bootloader code reads the code from EMIFA (NAND) EM_CS2 (address 0x4200 0000) using
AIS format.
– EMIFA is configured in NAND mode. The user is responsible for ensuring the desirable
Asynchronous EMIF pins are available through configuration pins AEM[2:0]. AEM[2:0] can be
configured to 010b [EMIFA (Async) Pinout Mode 2] or 101b [EMIFA (NAND) Pinout Mode 5].
3.4.1.4 Serial Boot Modes (I2C, UART[UART0], SPI[McBSP0])
This subsection discusses how the bootloader configures the clock dividers for the serial boot modes—I2C
boot, UART boot, and SPI boot.
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3.4.1.4.1 I2C Boot
If FASTBOOT = 0, then I2C Boot (BOOTMODE = 0101) is performed in Standard-Mode (up-to 100 kbps).
If FASTBOOT = 1, then I2C Boot is performed in Fast-Mode (up-to 400 kbps). The actual I2C data
transfer rate is dependent on the MXI/CLKIN frequency.
This is how the bootloader programs the I2C:
• I2C Boot in Fast-Mode (BOOTMODE[3:0] = 0101b, FASTBOOT = 1)
– I2C register settings: ICPSC.IPSC = 210, ICCLKL.ICCL = 810, ICCKH.ICCH = 810
– Resulting in the following I2C prescaled module clock frequency (internal I2C clock):
• (CLKIN frequency in MHz) / 3
– Resulting in the following I2C serial clock (SCL):
• SCL frequency (in kHz) = (CLKIN frequency in MHz) / 78 * 1000
• SCL low pulse duration (in µs) = 39 / (CLKIN frequency in MHz)
• SCL high pulse duration (in µs) = 39 / (CLKIN frequency in MHz)
• I2C Boot in Standard-Mode (BOOTMODE[3:0] = 0101b, FASTBOOT = 0)
– I2C register settings: ICPSC.IPSC = 210, ICCLKL.ICCL = 4510, ICCKH.ICCH = 4510
– Resulting in the following I2C prescaled module clock frequency (internal I2C clock):
• (CLKIN frequency in MHz) / 3
– Resulting in the following I2C serial clock (SCL):
• SCL frequency (in kHz) = (CLKIN frequency in MHz) / 300 * 1000
• SCL low pulse duration (in µs) = 150 / (CLKIN frequency in MHz)
• SCL high pulse duration (in µs) = 150 / (CLKIN frequency in MHz)
Note: the I2C peripheral requires that the prescaled module clock frequency must be between 7 to 12
MHz. Therefore, the I2C boot is only available for MXI/CLKIN frequency between 21 MHz and 30 MHz.
For more details on the I2C peripheral configurations and clock requirements, see the TMS320C642x
Inter-Integrated Circuit (I2C) Peripheral User’s Guide (literature number SPRUEN0).
3.4.1.4.2 UART Boot
For UART Boot (BOOTMODE[3:0] = 1000b or 1110b), the bootloader programs the UART0 peripheral as
follows:
• UART0 divisor is set to 1510
• Resulting in this UART0 baud rate in kilobit per second (kbps):
– (CLKIN frequency in MHz) * 1000 / (15 * 16)
The user is responsible for ensuring the resulting baud rate is appropriate for the system. The UART0
divisor (/15) is optimized for CLKIN frequency between 27 to 29 MHz to stay within 5% of the 115200-bps
baud rate.
For more details on the UART peripheral configurations and clock generation, see the TMS320C642x
Universal Asynchronous Receiver/Transmitter (UART) User's Guide (literature number SPRUEN6).
3.4.1.4.3 SPI Boot
Both 16-bit address SPI Boot (BOOTMODE = 0110) and 24-bit address SPI boot are performed through
the McBSP0 peripheral. The bootloader programs the McBSP0 peripheral as follows:
• McBSP0 register settings: SRGR.CLKGDV = 210
• Resulting in this SPI serial clock frequency:
– (SYSCLK3 frequency in MHz) / 3
SYSCLK3 frequency = SYSCLK1 frequency / 6. SYSCLK1 frequency during boot can be found in
Table 3-4, Table 3-5, and/or Table 3-6 based on the boot mode selection.
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For example, if BOOTMODE[3:0] = 0110b, FASTBOOT = 1, the MXI/CLKIN frequency = 30 MHz,
PLLMS[2:0] = 100b, the combination of Table 3-5 and Table 3-6 indicates that the device frequency
(SYSCLK1) is CLKIN x 22 / 2 = 330 MHz. This means SYSCLK3 frequency is 330 / 6 = 55 MHz, resulting
in SPI serial clock frequency of 55 / 3 = 18.3 MHz.
3.4.1.5 Host Boot Modes
The C6421 supports HPI Boot.
The HPI Boot is available in fastboot and non-fastboot, as shown in Table 3-4 and Table 3-5.
Note: The HPI HSTROBE inactive pulse duration timing requirement [tw(HSTBH)] is dependent on the HPI
internal clock source (SYSCLK3) frequency (see Section 6.12.3, HPI Electrical Data/Timing). The external
host must be aware of the SYSCLK3 frequency during boot to ensure the HSTROBE pulse duration
timing requirement is met.
3.4.2
Bootmode Registers
3.4.2.1 BOOTCFG Register
The Device Bootmode (see Section 3.4.1, Boot Modes) and Configuration pins (see Section 3.5.1, Device
and Peripheral Configurations at Device Reset) latched at reset are captured in the Device Boot
Configuration (BOOTCFG) register which is accessible through the System Module. This is a read-only
register. The bits show the values latched from the corresponding configuration pins sampled at device
reset. For more information on how these pins are sampled at device reset, see Section 6.5.1.2, Latching
Boot and Configuration Pins. For the corresponding device boot and configuration pins, see Table 2-7,
BOOT Terminal Functions.
31
21
RESERVED
20
14
13
12
11
18
LENDIAN FASTBOOT
R-0000 0000 0001
15
19
10
R-L
9
8
7
6
5
4
16
RESERVED
R-L
3
17
R-000
2
1
RSV
PLLMS
RSV
DAEM
RESERVED
BOOTMODE
R-0
R-LLL
R-0
R-LLL
R-0000
R-LLLL
0
LEGEND: R = Read only; L = pin state latched at reset rising edge; -n = value after reset
Figure 3-2. BOOTCFG Register—0x01C4 0014
Table 3-7. BOOTCFG Register Description
Bit
Field Name
Description
31:21
RESERVED
Reserved. Writes have no effect.
Little Endian Selection (see Section 3.5.1.3, Endianess Selection (LENDIAN))
This field determines the device endian mode.
20
LENDIAN
0 = Device is Big Endian
1 = Device is Little Endian
The default value is latched from LENDIAN configuration pin.
Fastboot (see Section 3.4.1.1, FASTBOOT)
This field is used by the device bootloader code to determine if it needs to speed up the device to PLL mode
before booting.
19
FASTBOOT
0 = No Fastboot
1 = Fastboot
The default value is latched from FASTBOOT configuration pin.
18:15
70
RESERVED
Reserved. Writes have no effect.
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Table 3-7. BOOTCFG Register Description (continued)
Bit
Field Name
Description
Fastboot PLL Multiplier Select [PLLMS] (see Section 3.5.1.2, Fast Boot PLL Multiplier Select [PLLMS])
14:12
PLLMS
11
RSV
If FASTBOOT = 1, this field selects the FASTBOOT PLL Multiplier according to Table 3-6.
The default value is latched from the PLLMS[2:0] configuration pins.
Reserved. Writes have no effect.
PINMUX0.AEM default [DAEM] (see Section 3.5.1.1, EMIFA Pinout Mode (AEM[2:0]))
For more details on the AEM settings, see Section 3.7.2.1, PINMUX0 Register Description.
10:8
DAEM
7:4
RESERVED
This field affects pin mux control by setting the default of PINMUX0.AEM. This field does not affect EMIFA
Register settings.
The default value is latched from the AEM[2:0] configuration pins.
Reserved. Writes have no effect.
Boot Mode (see Section 3.4.1, Boot Modes)
3:0
BOOTMODE
This field is used in conjunction with FASTBOOT and PLLMS to determine the device boot mode.
The default value is latched from the BOOTMODE[3:0] configuration pins.
3.4.2.2 BOOTCMPLT Register
If the bootloader code detects an error during boot, it records the error status in the Boot Complete
(BOOTCMPLT) register.
In addition, the BOOTCMPLT register is used for communication between the external host and the
bootloader code during a Host Boot (HPI Boot). Once the external host has completed boot, it must
perform the following communication with the bootloader code:
• Write the desired 32-bit CPU starting address in the DSPBOOTADDR register (see Section 3.4.2.3,
DSPBOOTADDR Register).
• Write a ‘1’ to the Boot Complete (BC) bit field in the BOOTCMPLT register to indicate that the host has
completed booting this device.
Once the bootloader code detects BC = 1, it directs the CPU to begin executing from the
DSPBOOTADDR register.
The BOOTCMPLT register is reset by any device-level global reset. For the list of device-level global
resets, see Section 6.5, Reset.
31
20
19
16
RESERVED
ERR
R/W-0000 0000 0000
R/W-0000
15
1
0
RESERVED
BC
R/W- 0000 0000 0000 000
R/W-0
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-3. BOOTCMPLT Register— 0x01C4 000C
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Table 3-8. BOOTCMPLT Register Description
Bit
Field Name Description
31:20
RESERVED Reserved. For proper device operation, the user should only write "0" to these bits.
19:16
ERR
15:1
RESERVED Reserved. For proper device operation, the user should only write "0" to these bits.
0
BC
Boot Error
0000 = No Error (default).
0001 - 1111 = bootloader software detected a boot error and aborted the boot. For the error codes, see the
Using the TMS320C642x Bootloader Application Report (literature number SPRAAK5).
Boot Complete Flag from Host
This field is only applicable to Host Boots.
0 = Host has not completed booting this device (default).
1 = Host has completed booting this device. DSP can begin executing from the DSPBOOTADDR register
value.
3.4.2.3 DSPBOOTADDR Register
The DSP Boot Address (DSPBOOTADDR) register contains the starting address for the C64x+ CPU.
Whenever the C64x+ is released from reset, it begins executing from the location pointed to by
DSPBOOTADDR register. For Host boots (HPI Boot), the DSPBOOTADDR register is also used for
communication between the Host and the bootloader code during boot.
The DSPBOOTADDR register is reset by any device-level global reset. For the list of device-level global
resets, see Section 6.5, Reset.
31
0
DSPBOOTADDR
R/W-0x0010 0000 or 0x4200 00000
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-4. DSPBOOTADDR Register— 0x01C4 0008
Table 3-9. DSPBOOTADDR Register Description
Bit
Field Name
Description
DSP Boot Address
31:0
DSPBOOTADDR
After boot, the C64x+ CPU begins execution from this 32-bit address location
0x0010 0000 (for Internal Bootloader ROM).
or
0x4200 0000 (for EMIFA CS2 Space).
The lower 10 bits (bits 9:0) should always be programmed to "0" as they are ignored by the
C64x+.
Default depends on boot mode selected.
See Table 3-4, Non-Fastboot Modes and Table 3-5, User-Select Multiplier Fastboot Modes.
At device reset, the Boot Controller defaults DSPBOOTADDR to one of two values (either Internal
Bootloader ROM at address 0x0010 0000 or EMIFA CS2 Space 0x4200 0000) based on the boot mode
selected (for the boot mode selections, see Table 3-4 and Table 3-5).
For Non-Host Boot Modes, software can leave the DSPBOOTADDR register at default.
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For Host Boots (HPI Boot), the DSPBOOTADDR register is also used for communication between the
Host and the bootloader code during boot. For Host Boots, the DSPBOOTADDR register defaults to
Internal Bootloader ROM, and the C64x+ CPU is immediately released from reset so that it can begin
executing the bootloader code in this internal ROM. The bootloader code waits for the Host to boot the
device. Once the Host is done booting the device, it must write a new starting address into the
DSPBOOTADDR register, and follow with writing BOOTCMPLT.BC = 1 to indicate the boot is complete.
As soon as the bootloader code detects BOOTCMPLT.BC = 1, it instructs the CPU to jump to this new
DSPBOOTADDR address. At this point, the CPU continues the rest of the code execution starting from
the new DSPBOOTADDR location and the boot is completed.
3.5 Configurations At Reset
Some device configurations are determined at reset. The following subsections give more details.
3.5.1
Device and Peripheral Configurations at Device Reset
Table 2-7, BOOT Terminal Functions, lists the device boot and configuration pins that are latched at
device reset for configuring basic device settings for proper device operation. Table 3-10 summarizes the
device boot and configuration pins, and the device functions that they affect.
Table 3-10. Default Functions Affected by Device Boot and Configuration Pins
DEVICE BOOT AND
CONFIGURATION PINS
BOOT SELECTED
PIN MUX CONTROL
GLOBAL SETTING
PERIPHERAL SETTING
BOOTMODE[3:0]
Boot Mode
PINMUX0/PINMUX1
Registers:
Based on
BOOTMODE[3:0], the
bootloader code programs
PINMUX0 and PINMUX1
registers to select the
appropriate pin functions
required for boot.
I/O Pin Power:
Based on
BOOTMODE[3:0], the
bootloader code programs
VDD3P3V_PWDN register
to power up the I/O pins
required for boot.
PSC/Peripherals:
Based on
BOOTMODE[3:0], the
bootloader code programs
the PSC to put
boot-related peripheral(s)
in the Enable State, and
programs the peripheral(s)
for boot operation.
FASTBOOT
Fastboot
–
Sets Device Frequency:
Based on BOOTMODE,
FASTBOOT, and PLLMS;
the bootloader code
programs PLLC1.
–
PLLMS[2:0]
If FASTBOOT = 1, the
PLLMS[2:0] selects the
FASTBOOT PLL
Multiplier.
–
Sets Device Frequency:
Based on BOOTMODE,
FASTBOOT, and PLLMS;
the bootloader code
programs PLLC1.
–
AEM[2:0]
–
PINMUX0.AEM:
Sets the default of this
field to control the EMIFA
Pinout Mode.
–
PSC/EMIFA:
The EMIFA module state
defaults to SwRstDisable
if AEM = 0; otherwise, the
EMIFA module state
defaults to Enable.
Device endianess
–
Affects the pin muxing in
EMIFA Sub-Block 0, 1,
and 3.
LENDIAN
–
–
For proper device operation, external pullup/pulldown resistors may be required on these device boot and
configuration pins. For discussion situations where external pullup/pulldown resistors are required, see
Section 3.9.1, Pullup/Pulldown Resistors.
Note: The C6421 configuration inputs (BOOTMODE[3:0], FASTBOOT, PLLMS[2:0], AEM[2:0], and
LENDIAN) are multiplexed with other functional pins. These pins function as device boot and configuration
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pins only during device reset. The user must take care of any potential data contention in the system. To
help avoid system data contention, the C6421 puts these configuration pins into a high-impedance state
(Hi-Z) when device reset (RESET or POR) is asserted, and continues to hold them in a high-impedance
state until the internal global reset is removed; at which point, the default peripheral (either GPIO or
EMIFA based on default of AEM[2:0]) will now control these pins.
All of the device boot and configuration pin settings are captured in the corresponding bit fields in the
BOOTCFG register (see Section 3.4.2.1, BOOTCFG Register).
The following subsections provide more details on the device configurations determined at device reset:
AEM, PLLMS, and LENDIAN.
3.5.1.1 EMIFA Pinout Mode (AEM[2:0])
To support different usage scenarios, the C6421 provides intricate pin multiplexing between the EMIFA
and other peripherals. The PINMUX0.AEM register bit field in the System Module determines the EMIFA
Pinout Mode. The AEM[2:0] pins only select the default EMIFA Pinout Mode. It is latched at device reset
de-assertion (high) into the BOOTCFG.DAEM bit field. The AEM[2:0] value also sets the default of the
PINMUX0.AEM bit field. While the BOOTCFG.DAEM bit field shows the actual latched value and cannot
be modified, the PINMUX0.AEM value can be changed by software to modify the EMIFA Pinout Mode.
Note: The AEM[2:0] value does not affect the operation of the EMIFA module itself. It only affects which
EMIFA pins are brought out to the device pins. For more details on the AEM settings, see Section 3.7,
Multiplexed Pin Configurations.
3.5.1.2 FASTBOOT PLL Multiplier Select (PLLMS)
If FASTBOOT = 1, the PLLMS[2:0] pins select PLL multiplier for Fastboot modes. If FASTBOOT = 0, the
PLLMS[2:0] pins are ignored.
The PLLMS[2:0] pin values are latched at device reset de-assertion into the BOOTCFG.PLLMS field and
cannot be modified by software. This value is only applicable during fast boot.
For more information on boot modes and the FASTBOOT PLL multiplier selection, see Section 3.4.1, Boot
Modes.
3.5.1.3 Endianess Selection (LENDIAN)
The LENDIAN configuration pin latched at reset determines the endianess setting of the device. If
LENDIAN = 1, little endian is selected. If LENDIAN = 0, big endian is selected.
The setting is latched and stored in the BOOTCFG.LENDIAN field and cannot be modified by software.
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3.6 Configurations After Reset
The following sections provide details on configuring the device after reset.
Multiplexed pins are configured both at and after reset. Section 3.5.1, Device and Peripheral
Configurations at Device Reset, discusses multiplexed pin control at reset. For more details on multiplexed
pins control after reset, see Section 3.7 , Multiplexed Pin Configurations.
3.6.1
Switch Central Resource (SCR) Bus Priorities
Prioritization within the Switched Central Resource (SCR) is programmable for each master. The register
bit fields and default priority levels for C6421 bus masters are shown in Table 3-11, C6421 Default Bus
Master Priorities. The priority levels should be tuned to obtain the best system performance for a particular
application. Lower values indicate higher priority. For most masters, their priority values are programmed
at the system level by configuring the MSTPRI0 and MSTPRI1 registers. Details on the MSTPRI0/1
registers are shown in Figure 3-5 and Figure 3-6. The C64x+ and EDMA masters contain registers that
control their own priority values.
Table 3-11. C6421 Default Bus Master Priorities
Priority Bit Field
Bus Master
Default Priority Level
EDMATC0P
EDMATC0
0 (EDMACC QUEPRI Register)
EDMATC1P
EDMATC1
0 (EDMACC QUEPRI Register)
EDMATC2P
EDMATC2
0 (EDMACC QUEPRI Register)
C64X+_DMAP
C64X+ (DMA)
7 (C64x + MDMAARBE.PRI field)
C64X+_CFGP
C64X+ (CFG)
1 (MSTPRI0 Register)
EMACP
EMAC
4 (MSTPRI1 Register)
VLYNQP
VLYNQ
4 (MSTPRI1 Register)
HPIP
HPI
4 (MSTPRI1 Register)
31
16
RESERVED
R-0000 0000 0000 0000
15
11
10
9
8
7
0
RESERVED
C64X+_CFGP
RESERVED
R-0000 0
R/W-001
R-0000 0000
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-5. MSTPRI0 Register— 0x01C4 003C
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Table 3-12. MSTPRI0 Register Description
Bit
Field Name
Description
31:11
RESERVED
Reserved. Read-only, writes have no effect.
C64X+_CFG master port priority in System Infrastructure.
10:8
7:0
C64X+_CFGP
RESERVED
31
27
000 = Priority 0 (Highest)
100 = Priority 4
001 = Priority 1
101 = Priority 5
010 = Priority 2
110 = Priority 6
011 = Priority 3
111 = Priority 7 (Lowest)
Reserved. Read-only, writes have no effect.
26
25
24
23
22
21
20
19
18
17
RESERVED
RSV
RSV
HPIP
RSV
VLYNQP
R-0000 0
R/W-100
R-0
R/W-100
R-0
R/W-100
15
3
2
1
RESERVED
EMACP
R- 0000 0000 0000 0
R/W-100
16
0
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-6. MSTPRI1 Register— 0x01C4 0040
Table 3-13. MSTPRI1 Register Description
Bit
Field Name
Description
31:27
RESERVED
Reserved. Read-only, writes have no effect.
26:24
RSV
Reserved. For proper device operation, the user must only write "100" to
these bits.
23
RSV
Reserved. Read-only, writes have no effect.
HPI master port priority in System Infrastructure.
22:20
19
HPIP
RSV
000 = Priority 0 (Highest)
100 = Priority 4
001 = Priority 1
101 = Priority 5
010 = Priority 2
110 = Priority 6
011 = Priority 3
111 = Priority 7 (Lowest)
Reserved. Read-only, writes have no effect.
VLYNQ master port priority in System Infrastructure.
18:16
15:3
VLYNQP
RESERVED
000 = Priority 0 (Highest)
100 = Priority 4
001 = Priority 1
101 = Priority 5
010 = Priority 2
110 = Priority 6
011 = Priority 3
111 = Priority 7 (Lowest)
Reserved. Read-only, writes have no effect.
EMAC master port priority in System Infrastructure.
2:0
76
Device Configurations
EMACP
000 = Priority 0 (Highest)
100 = Priority 4
001 = Priority 1
101 = Priority 5
010 = Priority 2
110 = Priority 6
011 = Priority 3
111 = Priority 7 (Lowest)
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3.6.2
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Peripheral Selection After Device Reset
After device reset, most peripheral configurations are done within the peripheral’s registers. This section
discusses some additional peripheral controls in the System Module. For information on multiplexed pin
controls that determine what peripheral pins are brought out to the pins, see Section 3.7, Multiplexed Pin
Configurations.
3.6.2.1 HPI Control Register (HPICTL)
The HPI Control (HPICTL) register determines the Host Burst Write Time-Out value. The user should
only modify this register once during device initialization. When modifying this register, the user
must ensure the HPI FIFOs are empty and there are no on-going HPI transactions.
31
16
RESERVED
R-0000 0000 0000 0000
15
10
9
8
7
0
RESERVED
RESERVED
TIMOUT
R- 0000 00
R/W-00
R/W-1000 0000
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-7. HPICTL Register— 0x01C4 0030
Table 3-14. HPICTL Register Description
Bit
Field Name Description
31:10
RESERVED Reserved. Read-only, writes have no effect.
9:8
RESERVED Reserved. For proper device operation, the user should only write "0" to these bits (default).
7:0
TIMOUT
Host Burst Write Timeout Value
When the HPI time-out counter reaches the value programmed here, the HPI write FIFO content is flushed. For
more details on the time-out counter and its use in write bursting, see the TMS320C642x Host Port Interface
(HPI) User's Guide (literature number SPRUEM9).
3.6.2.2 Timer Control Register (TIMERCTL)
The Timer Control Register (TIMERCTL) provides additional control for Timer0 and Timer2. The user
should only modify this register once during device initialization, when the corresponding Timer is
not in use.
• Timer 2 Control: The TIMERCTL.WDRST bit determines if the WatchDog timer event (Timer 2) can
cause a device max reset. For more details on the description of a maximum reset, see Section 6.5.3,
Maximum Reset.
• Timer 0 Control: The TINP0SEL bit selects the clock source connected to Timer0's TIN0 input.
31
16
RESERVED
R-0000 0000 0000 0000
15
2
1
0
RESERVED
TINP0
SEL
WD
RST
R- 0000 0000 0000 00
R/W-0
R/W-1
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-8. TIMERCTL Register— 0x01C4 0084
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Table 3-15. TIMERCTL Register Description
Bit
Field Name Description
31:2
RESERVED Reserved. Read-Only, writes have no effect.
1
TINP0SEL
Timer0 External Input (TIN0) Select
0 = Timer0 external input comes directly from the TINP0L pin (default).
1 = Timer0 external input is TINP0L pin divided by 6. For example, if TINP0L = 25MHz, Timer0 input TIN0 is
25MHz / 6 = 4.2 MHz.
0
WDRST
WatchDog Reset Enable
0 = WatchDog Timer Event (WDINT from Timer2) does not cause device reset.
1 = WatchDog Timer Event (WDINT from Timer2) causes a device max reset (default).
3.6.2.3 EDMA TC Configuration Register (EDMATCCFG)
The EDMA Transfer Controller Configuration (EDMATCCFG) register configures the default burst size
(DBS) for EDMA TC0, EDMA TC1, and EDMA TC2. For more information on the correct usage of DBS,
see the TMS320C642x Enhanced Direct Memory Access (EDMA) Controller User's Guide (literature
number SPRUEM5). The user should only modify this register once during device initialization and
when the corresponding EDMA TC is not in use.
31
16
RESERVED
R-0000 0000 0000 0000
15
6
5
4
3
2
1
0
RESERVED
TC2DBS
TC1DBS
TC0DBS
R-0000 0000 00
R/W-10
R/W-01
R/W-00
LEGEND: R = Read; W = Write; -n = value after reset
Figure 3-9. EDMATCCFG Register— 0x01C4 0088
Table 3-16. EDMATCCFG Register Description
Bit
Field
31:6
RESERVED Reserved. Read-Only, writes have no effect.
5:4
TC2DBS
Description
EDMA TC2 Default Burst Size
00 = 16 byte
01 = 32 byte
10 = 64 byte (default)
11= reserved
EDMA TC2 is intended for miscellaneous transfers.
TC2 FIFO size is 128 bytes, regardless of Default Burst Size setting.
3:2
TC1DBS
EDMA TC1 Default Burst Size
00 = 16 byte
01 = 32 byte (default)
10 = 64 byte
11 = reserved
EDMA TC1 is intended for high throughput bulk transfers.
TC1 FIFO size is 256 bytes, regardless of Default Burst Size setting.
1:0
TC0DBS
EDMA TC0 Default Burst Size
00 = 16 byte (default)
01 = 32 byte
10 = 64 byte
11 = reserved
EDMA TC0 is intended for short burst transfers with stringent deadlines (e.g., McBSP, McASP).
TC0 FIFO size is 128 bytes, regardless of Default Burst Size setting.
78
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3.7 Multiplexed Pin Configurations
C6421 makes extensive use of pin multiplexing to accommodate a large number of peripheral functions in
the smallest possible package, providing ultimate flexibility for end applications.
The Pin Multiplex Registers PINMUX0 and PINMUX1 in the System Module are responsible for controlling
all pin multiplexing functions on the C6421. The default setting of some of the PINMUX0 and PINMUX1 bit
fields are configured by configuration pins latched at reset (see Section 3.5.1, Device and Peripheral
Configurations at Device Reset). After reset, software may program the PINMUX0 and PINMUX1 registers
to switch pin functionalities.
The following peripherals have multiplexed pins: EMIFA, HPI, VLYNQ, EMAC, McASP0, McBSP0, PWM0,
PWM1, PWM2, Timer0, Timer1, UART0, and GPIO.
The device is divided into the following Pin Multiplexed Blocks (Pin Mux Blocks):
• EMIFA Block: EMIFA and GPIO. This block is further subdivided into these sub-blocks:
– Sub-Block 0: part of EMIFA (address and control), part of EMAC(RMII), and GPIO
– Sub-Block 1: part of EMIFA (data, address, control), part of EMAC(RMII), and GPIO
– Sub-Block 2: part of EMIFA (control signals EM_WAIT/(RDY/BSY), EM_OE, and EM_WE)
– Sub-Block 3: part of EMIFA (address EM_A[12:5]) and GPIO
• Host Block: HPI, VLYNQ, EMAC(MII), and GPIO
• Serial Port Block: McBSP0, McASP0, and GPIO. This block is further sub-divided into sub-blocks.
– Serial Port Sub-Block 0: McBSP0, part of McASP0, and GPIO
– Serial Port Sub-Block 1: part of McASP0 and GPIO
• UART0 Flow Control Block: UART0 flow control, PWM0, and GPIO
• UART0 Data Block: UART0 data and GPIO
• Timer0 Block: Timer0 and McBSP0 CLKS pins
• Timer1 Block: Timer1 and GPIO
• PWM1 Block: PWM1 and GPIO
• CLKOUT Block: CLKOUT0, PWM2, and GPIO
As shown in the list above, the McBSP0, UART0, and EMAC peripherals span multiple Pin Mux Blocks.
To use these peripherals, they must be selected in all relevant Pin Mux Blocks. For more details, see
Section 3.7.3, Pin Multiplexing Details, and Section 3.7.3.2, Peripherals Spanning Multiple Pin Mux
Blocks.
Note: There is no actual pin multiplexing in EMIFA Sub-Block 2. However it is still considered a "pin mux
block" because it contains part of the pins necessary for EMIFA.
A high level view of the Pin Mux Blocks is shown in Figure 3-10. In each Pin Mux Block, the
PINMUX0/PINMUX1 default settings are underlined.
Note: Some default pin functions are determined by configuration pins (AEM[2:0]); therefore, more than
one configuration setting can serve as default based on the configuration pin settings latched at device
reset.
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(A)
Host Block (27 pins)
GPIO (27)
HPI (26)
GPIO (1)
HOSTBK=000
HOSTBK=001
VLYNQ
(10)
VLYNQ
(10)
GPIO (17)
EMAC (MII)
(15)
HOSTBK=010
EMAC (MII)
(15)
MDIO
(2)
MDIO
(2)
GPIO (10)
HOSTBK=011
HOSTBK=100
PWM 1 Block (1 pin)
GPIO
(1)
PWM1BK=0
UART
Data (2)
UR0DBK=0
UR0DBK=1
GPIO (2)
UR0FCBK=00
PWM1BK=1
CKOBK=00
CLKOUT
(1)
CKOBK=01
PWM2
(1)
CKOBK=10
PWM0 (1)
GPIO (1)
UART0
FlowCtrl (2)
UR0FCBK=01
UR0FCBK=10
(C)
Timer0 Block (2 pins)
Timer1 Block (2 pins)
GPIO (2)
GPIO
(1)
UART0 Flow Control Block (2 pins)
UART0 Data Block (2 pins)
GPIO (2)
CLKOUT Block (1 pin)
PWM1
(1)
Timer1
(2)
GPIO (2)
McBSP0
CLKS0 (1)
Timer0
(2)
Timer0
TINPOL (1)
TIM1BK=00
TIM1BK=01
TIM0BK=00
(C)
Serial Port Sub-Block 0 (6 pins)
GPIO (6)
SPBK0=00
McBSP0
(6)
SPBK0=01
TIM0BK=01
TIM0BK=11
Serial Port Sub-Block 1 (6 pins)
McASP0 Receive
and 3 Serializers (6)
SPBK0=10
GPIO (6)
SPBK1=00
McASP0
Transmit and
1 Serializer (6)
SPBK1=10
(A)(B)
EMIFA Block (61 pins)
GPIO
GPIO
EMAC (RMII)
Major Config
Option A
Major Config
Option B
AEM=000,
RMII=0
AEM=000,
RMII=1
EMIFA
(Async)
Pinout
Mode 2
32MB per
CS
EMIFA
(Async)
Pinout
Mode 2
32MB per
CS
GPIO
Major Config
Option C
AEM=010,
RMII=0
8b EMIFA
(NAND)
Pinout
Mode 5
8b EMIFA
(NAND)
Pinout
Mode 5
GPIO
EMAC (RMII)
GPIO
GPIO
EMAC (RMII)
Major Config
Option D
Major Config
Option E
Major Config
Option F
AEM=010,
RMII=1
AEM=101,
RMII=0
AEM=101,
RMII=1
A.
Default settings for PINMUX0 and PINMUX1 registers are underlined.
B.
EMIFA Block: This figure only shows the Major Config Options in the EMIFA Block based on the AEM and RMII
settings. Actual pin functions in the EMIFA Block are further determined by other PINMUX fields.
C.
McBSP0 pins span multiple blocks (Serial Port Sub-Block0 and Timer0 Block). Serial Port Sub-Block0 contains most
of the pins needed for McBSP0 operation. Timer0 Block contains the optional external clock source input CLKS0.
Figure 3-10. Pin Mux Block Selection
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3.7.1
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Pin Muxing Selection At Reset
This section summarizes pin mux selection at reset.
The configuration pins AEM[2:0] latched at device reset determine default pin muxing for the following Pin
Mux Blocks:
•
EMIFA Block: default pin mux determined by AEM[2:0] and RMII. After reset, software may modify
settings in the PINMUX0 register to fine tune pin muxing in this block.
– AEM[2:0] = 000b, RMII = 0: Major Config Option A is selected. This block defaults to 58 GPIO pins.
– AEM[2:0] = 000b, RMII = 1: Major Config Option B is selected. This block defaults to EMAC(RMII),
plus 50 GPIO pins.
– AEM[2:0] = 010b, RMII = 0: Major Config Option C is selected. This block defaults to 8-bit EMIFA
(Async) Pinout Mode 2, plus 13-to-16 GPIO pins.
– AEM[2:0] = 010b, RMII = 1: Major Config Option D is selected. This block defaults to 8-bit EMIFA
(Async) Pinout Mode 2, EMAC(RMII), plus 7-to-8 GPIO pins.
– AEM[2:0] = 101b, RMII = 0: Major Config Option E is selected. This block defaults to 8-bit EMIFA
(NAND) Pinout Mode 5, plus 44-to-47 GPIO pins.
– AEM[2:0] = 101b, RMII = 1: Major Config Option F is selected. This block defaults to 8-bit EMIFA
(NAND) Pinout Mode 5, EMAC(RMII), and 38-to-39 GPIO pins.
For a description of the PINMUX0 and PINMUX1 registers and more details on pin muxing, see
Section 3.7.2.
3.7.2
Pin Muxing Selection After Reset
The PINMUX0 and PINMUX1 registers in the System Module allow software to select the pin functions in
the Pin Mux Blocks. The pin control of some of the Pin Mux Blocks requires a combination of
PINMUX0/PINMUX1 bit fields. For more details on the combination of the PINMUX bit fields that control
each muxed pin, see Section 3.7.3.1, Multiplexed Pins on C6421.
This section only provides an overview of the PINMUX0 and PINMUX1 registers. For more detailed
discussion on how to program each Pin Mux Block, see Section 3.7.3, Pin Multiplexing Details.
3.7.2.1 PINMUX0 Register Description
The Pin Multiplexing 0 Register (PINMUX0) controls the pin function in the EMIFA Block. The PINMUX0
register format is shown in Figure 3-11 and the bit field descriptions are given in Table 3-17. Some muxed
pins are controlled by more than one PINMUX bit field. For the combination of the PINMUX bit fields that
control each muxed pin, see Section 3.7.3.1, Multiplexed Pins on C6421. For more information on EMIFA
Block pin muxing, see Section 3.7.3.11, EMIFA Block Muxing. For the pin-by-pin muxing control of the
EMIFA Block, see Section 3.7.3.11.2, EMIFA Block Pin-By-Pin Multiplexing Summary.
31
18
17
16
2
1
0
RESERVED
R/W-0000 0000 0000 0XXX
15
14
13
12
11
10
9
8
7
6
5
4
3
RESERVED
CS3SEL
RSV
CS4SEL
RSV
CS5SEL
RESERVED
RMII
AEM
R/W-0000 0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-00
R/W-0
R/W-LLL
LEGEND: R/W = Read/Write; R = Read only; L = pin state latched at reset rising edge; -n = value after reset
(1)
For proper C6421 device operation, always write a value of "0" to all RESERVED/RSV bits.
(2)
PINMUX0 bits 18:16 are reserved/ don't care. These bits may default to non-zero values.
Figure 3-11. PINMUX0 Register—0x01C4 0000 (1) (2)
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Table 3-17. PINMUX0 Register Bit Descriptions
Bit
31:11
Field Name
RESERVED
Description
Chip Select 3 Select.
10
CS3SEL
0 = GPIO pin GP[13] (default)
1 = EMIFA Chip Select 3 (EM_CS3)
9
8
RSV
CS4SEL
6
RSV
CS5SEL
RESERVED
EM_CS3/GP[13]
The PINMUX0 field CS3SEL alone controls the
muxing of this pin.
Chip Select 4 Select.
Sub-Block 1
0 = GPIO pin GP[32] (default) or RMII RMRXD0. Pin function determined by
PINMUX0.RMII.
RMRXD0/EM_CS4/GP[32]
The combination of PINMUX0 fields CS4SEL
and RMII controls the muxing of this pin.
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
Chip Select 5 Select.
Sub-Block 1
0 = GPIO pin GP[33] (default) or RMII RMRXD1. Pin function determined by
PINMUX0.RMII.
RMRXD1/EM_CS5/GP[33]
1 = EMIFA Chip Select 5 (EM_CS5). PINMUX0.RMII must be set to 0.
5:4
Sub-Block 1
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
1 = EMIFA Chip Select 4 (EM_CS4). PINMUX0.RMII must be set to 0.
7
Pins Controlled
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
The combination of PINMUX0 fields CS5SEL
and RMII controls the muxing of this pin.
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
RMII Select.
0 = No RMII in EMIFA Block
Field CS5SEL determines function of pin EM_CS5.
Field CS4SEL determines function of pin EM_CS4.
The remaining 6 pins function as GP[52] and GP[31:27].
3
RMII
1 = RMII in EMIFA Block
These 8 pins function as RMII pins: RMRXER, RMRXD1, RMRXD0, REFCLK,
RMCRSDV, RMTXEN, RMTXD0, and RMTXD1.
When EMAC (RMII) is selected, EMAC(MII) must not be selected.
PINMUX1.HOSTBK must not be set to 011b or 100b.
CS4SEL and CS5SEL must be programmed to 0.
If EMAC operation is desired, EMAC must be placed in reset before
programming PINMUX0.RMII or PINMUX1.HOSTBK to select EMAC pins.
82
Device Configurations
RMRXER/GP[52]
RMRXD1/EM_CS5/GP[33]
RMRXD0/EM_CS4/GP[32]
REFCLK/GP[31]
RMCRSDV/GP[30]
RMTXEN/GP[29]
RMTXD0/GP[28]
RMTXD1/GP[27]
The pin mux for these pins are controlled by a
combination of PINMUX0 fields RMII, CS4SEL,
and CS5SEL.
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Table 3-17. PINMUX0 Register Bit Descriptions (continued)
Bit
Field Name
Description
Pins Controlled
EMIFA Pinout Modes
This field does not affect the actual EMIFA operation. It only determines what
multiplexed pins in the EMIFA Block serves as EMIFA pins.
000b = No EMIFA Mode
None of the multiplexed pins in the EMIFA Block serves as EMIFA pins. They
serve as GPIO pins.
001b = Reserved.
010b = 8-bit EMIFA (Async) Pinout Mode 2
Pinout allows up to a maximum of these functions from EMIFA Block: 8-bit EMIFA
(Async or NAND) + GPIO + EMAC(RMII). All of the pins listed under the "Pins
Controlled" column serve as EMIFA pins. PINMUX0.RMII can be set to 0 or 1.
AEM (1)
2:0
011b = Reserved.
100b = Reserved.
101b = 8-bit EMIFA (NAND) Pinout Mode 5
Pinout allows up to a maximum of these functions from EMIFA Block: 8-bit EMIFA
(NAND) + GPIO + EMAC(RMII). PINMUX0.RMII can be set to 0 or 1.
110b through 111b = Reserved.
EM_D[7]/GP[21]
EM_D[6]/GP[20]
EM_D[5]/GP[19]
EM_D[4]/GP[18]
EM_D[3]/GP[17]
EM_D[2]/GP[16]
EM_D[1]/GP[15]
EM_D[0]/GP[14]
EM_R/WGP[35]
EM_A[21]/GP[34]
EM_A[20]/GP[44]
EM_A[19]/GP[45]
EM_A[18]/GP[46]
EM_A[17]/GP[47]
EM_A[16]/GP[48]
EM_A[15]/GP[49]
EM_A[14]/GP[50]
EM_A[13]/GP[51]
EM_A[12]/GP[89]
EM_A[11]/GP[90]
EM_A[10]/GP[91]
EM_A[9]/GP[92]
EM_A[8]/GP[93]
EM_A[7]/GP[94]
EM_A[6]/GP[95]
EM_A[5]/GP[96]
EM_A[4]/GP[10]/(PLLMS2)
EM_A[3]/GP[11]
EM_A[2]/(CLE)/GP[8]/(PLLMS0)
EM_A[1]/(ALE)/GP[9]/(PLLMS1)
EM_A[0]/GP[7]/(AEM2)
EM_CS2/GP[12]
EM_BA[0]/GP[6]/(AEM1)
EM_BA[1]/GP[5]/(AEM0)
The pin mux for these pins are controlled by a
combination of AEM and other fields. For the
full set of valid configurations of these pins, see
Section 3.7.3.11.2, EMIFA Block Pin-by-Pin
Multiplexing Summary.
(1)
The AEM default value is latched at reset from AEM[2:0] configuration inputs. The latched values are also shown at BOOTCFG.DAEM
(read-only).
3.7.2.2 PINMUX1 Register Description
The Pin Multiplexing 1 Register (PINMUX1) controls the pin multiplexing of all Pin Mux Blocks. The
PINMUX1 register format is shown in Figure 3-12 and the bit field descriptions are given in Table 3-18.
Some muxed pins are controlled by more than one PINMUX bit field. For the combination of PINMUX bit
fields that control each muxed pin, see Section 3.7.3.1, Multiplexed Pins on C6421.
31
26
15
14
25
24
23
22
21
20
19
18
17
16
RESERVED
SPBK1
SPBK0
TIM1BK
RSV
TIM0BK
R/W-0000 00
R/W-00
R/W-00
R/W-00
R/W-00
R/W-00
13
12
CKOBK
RSV
PWM1B
K
R/W-01
R/W-0
R/W-0
11
10
9
8
7
6
5
4
3
2
1
0
UR0FCBK
RSV
UR0DBK
RSV
HOSTBK
RESERVED
RSV
R/W-00
R/W-0
R/W-0
R/W-0
R/W-000
R/W-000
R-0
LEGEND: R/W = Read/Write; R = Read only; P = specified pin state; -n = value after reset
(1)
For proper C6421 device operation, always write a value of "0" to all RESERVED/RSV bits.
Figure 3-12. PINMUX1 Register—0x01C4 0004 (1)
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Table 3-18. PINMUX1 Register Description
Bit
31:26
Field Name
RESERVED
Description
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
Pins Controlled
–
Serial Port Sub-Block 1 Pin Select.
Selects the function of the multiplexed pins in the Serial Port Sub-Block 1.
00 = GPIO Mode (default).
Pins function as GPIO (GP[110:105]).
25:24
SPBK1
01 = Reserved.
10 = McASP0 Transmit and 1 serializer.
Pins function as McASP0: AXR0[0], ACLKX0, AFSX0, AHCLKX0, AMUTEIN0,
and AMUTE0.
Serial Port Sub-Block 1:
AXR0[0]/GP[105]
ACLKX0/GP[106]
AFSX0/GP[107]
AHCLKX0/GP[108]
AMUTEIN0/GP[109]
AMUTE0/GP[110]
11 = Reserved.
Serial Port Sub-Block 0 Pin Select.
Selects the function of the multiplexed pins in the Serial Port Sub-Block 0.
00 = GPIO Mode (default).
Pins function as GPIO (GP[104:99]).
23:22
SPBK0
01 = McBSP0 Mode.
Pins function as McBSP0 CLKX0, FSX0, DX0, CLKR0, FSR0, and DR0.
10 = McASP0 Receive and 3 serializers.
Pins function as McASP0 ACLKR0, AFSR0, AHCLKR0, AXR0[3], AXR0[2], and
AXR0[1].
Serial Port Sub-Block 0:
ACLKR0/CLKX0/GP[99]
AFSR0/DR0/GP[100]
AHCLKR0/CLKR0/GP[101]
AXR0[3]/FSR0/GP[102]
AXR0[2]/FSX0/GP[103]
AXR0[1]/DX0/GP[104]
11 = Reserved
Timer1 Block Pin Select.
Selects the function of the multiplexed pins in theTimer1 Block.
00 = GPIO Mode (default).
Pins function as GPIO (GP[56:55]).
21:20
TIM1BK
01 = Timer1 Mode.
Pins function as Timer1 TINP1L and TOUT1L.
Timer1 Block:
TINP1L/GP[56]
TOUT1L/GP[55]
10 = Reserved.
11 = Reserved.
19:18
RSV
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
–
Timer0 Block Pin Select.
Selects the function of the multiplexed pins in the Timer0 Block.
00 = GPIO Mode (default).
Pins function as GPIO (GP[98:97]).
17:16
TIM0BK
01 = Timer0 Mode.
Pins function as Timer0 TINP0L and TOUT0L.
Timer0 Block:
TINP0L/GP[98]
CLKS0/TOUT0L/GP[97]
10 = Reserved
11 = McBSP0 External Clock Source + Timer0 Input Mode.
Pins function as McBSP0 external clock source CLKS0, and Timer0 input
TINP0L.
CLKOUT Block Pin Select.
Selects the function of the multiplexed pins in the CLKOUT Block.
00 = GPIO Mode.
Pin functions as GPIO (GP[84]).
15:14
CKOBK
01 = CLKOUT Mode (default).
Pin functions as device clock output CLKOUT0, sourced from PLLC1 OBSCLK.
CLKOUT Block:
CLKOUT0/PWM2/GP[84]
10 = PWM2 Mode.
Pin functions as PWM2.
11 = Reserved
13
84
RSV
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
Device Configurations
–
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Table 3-18. PINMUX1 Register Description (continued)
Bit
Field Name
Description
Pins Controlled
PWM1 Block Pin Select.
Selects the function of the multiplexed pins in the PWM1 Block.
12
PWM1BK
0 = GPIO Mode (default).
Pin functions as GPIO (GP[4]).
PWM1 Block:
GP[4]/PWM1
1 = PWM1 Mode.
Pin functions as PWM1.
UART0 Flow Control Block Pin Select.
Selects the function of the multiplexed pins in the UART0 Flow Control Block.
00 = GPIO Mode (default).
Pins function as GPIO (GP[88:87]).
11:10
UR0FCBK
01 = UART0 Flow Control Mode.
Pins function as UART0 Flow Control UCTS0 and URTS0.
UART0 Flow Control Block:
UCTS0/GP[87]
URTS0/PWM0/GP[88]
10 = PWM0 + GPIO Mode.
Pins function as PWM0 and GPIO (GP[87]).
11 = Reserved
9
RSV
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
–
UART0 Data Block Pin Select.
Selects the function of the multiplexed pins in the UART0 Data Block.
8
UR0DBK
0 = GPIO Mode (default).
Pins function as GPIO (GP[86:85]).
UART0 Data Block:
URXD0/GP[85]
UTXD0/GP[86]
1 = UART0 Data Mode.
Pins function as UART0 data URXD0 and UTXD0.
7
RSV
6:4
HOSTBK
3:1
RESERVED
0
RSV
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
–
Host Block:
VLYNQ_CLOCK/GP[57]
HD0/VLYNQ_SCRUN/GP[58]
Host Block Pin Select.
HD1/VLYNQ_RXD0/GP[59]
If EMAC opertaion is desired, EMAC must be placed in reset before
programminng PINMUX1. HOSTBK or PINMUX0.RMII to select EMAC pins. HD2/VLYNQ_RXD1/GP[60]
HD3/VLYNQ_RXD2/GP[61]
HOSTBK = 000: GPIO Mode
HD4/VLYNQ_RXD3/GP[62]
Pins function as GPIO (GP[83:57]).
HD5/VLYNQ_TXD0/GP[63]
HD6/VLYNQ_TXD1/GP[64]
HOSTBK = 001: HPI + 1 GPIO Mode.
HD7/VLYNQ_TXD2/GP[65]
Pins function as HPI and GPIO (GP[57]).
HD8/VLYNQ_TXD3/GP[66]
HD9/MCOL/GP[67]
HOSTBK = 010: VLYNQ + 17 GPIO Mode.
Pins function as VLYNQ (VLYNQ_CLOCK, VLYNQ_SCRUN, VLYNQ_RXD[3:0], HD10/MCRS/GP[68]
HD11/MTXD3/GP[69]
VLYNQ_TXD[3:0]), and GP[83:67].
HD12/MTXD2/GP[70]
HD13/MTXD1/GP[71]
HOSTBK = 011: VLYNQ + MII + MDIO Mode.
Pins function as VLYNQ (VLYNQ_CLOCK, VLYNQ_SCRUN, VLYNQ_RXD[3:0], HD14/MTXD0/GP[72]
HD15/MTXCLK/GP[73]
VLYNQ_TXD[3:0]), MII (TXCLK, CRS, COL, TXD[3:0], RXVD, TXEN, RXER,
HHWIL/MRXDV/GP[74]
RXCLK, RXD[3:0]), and MDIO (MDIO, MDC).
HCNTL1/MTXEN/GP[75]
When EMAC(MII) is selected, EMAC(RMII) must not be selected.
HCNTL0/MRXER/GP[76]
PINMUX0.RMII must be set to 0.
HR/W/MRXCLK/GP[77]
HOSTBK = 100: MII + MDIO +10 GPIO Mode.
HDS2/MRXD0/GP[78]
Pins function as MII (TXCLK, CRS, COL, TXD[3:0], RXVD, TXEN, RXER,
HDS1/MRXD1/GP[79]
RXCLK, RXD[3:0]), MDIO (MDIO, MDC), and GP[66:57].
HRDY/MRXD2/GP[80]
When EMAC(MII) is selected, EMAC(RMII) must not be selected.
HCS/MDCLK/GP[81]
PINMUX0.RMII must be set to 0.
HINT/MRXD3/GP[82]
HAS/MDIO/GP[83]
All other HOSTBK combinations reserved.
The HOSTBK field selects the function of these
27 pins.
Reserved. For proper device operation, the user should only write "0" to this bit
(default).
–
Reserved. Writes have no effect.
–
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3.7.3
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Pin Multiplexing Details
This section discusses how to program each Pin Mux Block to select the desired peripheral functions.
The following steps can be used to determine pin muxing suitable for the application:
1. Understand the major configuration choices available for the specific application.
a. Device Major Configuration Choices: Figure 3-10 shown in Section 3.7, Multiplexed Pin
Configurations, provides a high-level view of the device pin muxing and can be used to determine
the possible mix of peripheral options for a specific application.
b. EMIFA Block Major Configuration Choices: The EMIFA block features extensive pin multiplexing to
accommodate a variety of applications. In addition to Figure 3-10, Section 3.7.3.11, EMIFA Block
Muxing, provides more details on the Major Configuration choices for this block.
2. See Section 3.7.3.1, Multiplexed Pins on C6421, for a summary of all the multiplexed pins on this
device and the pin mux group they belong to.
3. Refer to the individual pin mux sections (Section 3.7.3.3, Host Block Muxing to Section 3.7.3.11,
EMIFA Block Muxing) for pin muxing details for a specific pin mux block.
a. For peripherals that span multiple pin mux blocks, the user must select the appropriate pins for that
peripheral in all relevant pin mux blocks. For more details, see Section 3.7.3.2, Peripherals
Spanning Multiple Pin Mux Blocks .
For details on PINMUX0 and PINMUX1 registers, see Section 3.7.2.
3.7.3.1 Multiplexed Pins on C6421
Table 3-19 summarizes all of the multiplexed pins on C6421, the pin mux group for each pin, and the
PINMUX register fields that control the pin. For pin mux details, see the specific pin mux group section
(Section 3.7.3.3, Host Block Muxing to Section 3.7.3.11, EMIFA Block Muxing). For a description of the
PINMUX register fields, see Section 3.7.2.
Table 3-19. Multiplexed Pins on C6421
SIGNAL
PINMUX DESCRIPTION
ZWT
NO.
ZDU
NO.
PINMUX GROUP
GP[54]
A14
A18
EMIFA Sub-Block 0
-
GP[53]
A13
A17
EMIFA Sub-Block 0
-
RMRXER/GP[52]
A15
A19
EMIFA Sub-Block 0
RMII
EM_A[13]/GP[51]
B10
A12
EMIFA Sub-Block 0
AEM
EM_A[14]/GP[50]
A10
A13
EMIFA Sub-Block 0
AEM
EM_A[15]/GP[49]
B11
C13
EMIFASub-Block 0
AEM
EM_A[16]/GP[48]
C11
B13
EMIFA Sub-Block 0
AEM
EM_A[17]/GP[47]
A11
B14
EMIFASub-Block 0
AEM
EM_A[18]/GP[46]
D11
A14
EMIFA Sub-Block 0
AEM
EM_A[19]/GP[45]
B12
C14
EMIFASub-Block 0
AEM
EM_A[20]/GP[44]
C12
C15
EMIFA Sub-Block 0
AEM
GP[43]
A12
A15
EMIFA Sub-Block 0
GP[42]
B13
B15
EMIFA Sub-Block 0
GP[41]
C13
B16
EMIFA Sub-Block 0
GP[40]
D14
C18
EMIFA Sub-Block 0
GP[39]
B14
A16
EMIFA Sub-Block 0
GP[38]
C14
B17
EMIFA Sub-Block 0
GP[37]
B15
B18
EMIFA Sub-Block 0
GP[36]
C15
B19
EMIFA Sub-Block 0
EM_R/W/GP[35]
D13
C17
EMIFA Sub-Block 0
AEM
EM_A[21]/GP[34]
D12
C16
EMIFA Sub-Block 0
AEM
RMRXD1/EM_CS5/GP[33]
F19
J22
EMIFA Sub-Block 1
RMII, CS5SEL
NAME
86
Device Configurations
CONTROLLED BY PINMUX BIT FIELDS
GP[43:36] are standalone pins and are not
muxed with any other functions. They are
included in this table because they are grouped
in the EMIFA Sub-Block 0.
Note: GP[43:36] are only available when AEM
= 0 or 5.
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Table 3-19. Multiplexed Pins on C6421 (continued)
SIGNAL
NAME
PINMUX DESCRIPTION
ZWT
NO.
ZDU
NO.
PINMUX GROUP
CONTROLLED BY PINMUX BIT FIELDS
RMRXD0/EM_CS4/GP[32]
E19
H22
EMIFA Sub-Block 1
RMII, CS4SEL
REFCLK/GP[31]
D19
G22
EMIFA Sub-Block 1
RMII
RMCRSDV/GP[30]
G19
K22
EMIFA Sub-Block 1
RMII
RMTXEN/GP[29]
H15
K21
EMIFA Sub-Block 1
RMII
RMTXD0/GP[28]
H16
J21
EMIFA Sub-Block 1
RMII
RMTXD1/GP[27]
H17
L19
EMIFA Sub-Block 1
RMII
GP[26]/(FASTBOOT)
G17
K19
EMIFA Sub-Block 1
-
GP[25]/(BOOTMODE3)
G16
H21
EMIFA Sub-Block 1
-
GP[24]/(BOOTMODE2)
G15
L20
EMIFA Sub-Block 1
-
GP[23]/(BOOTMODE1)
F15
K20
EMIFA Sub-Block 1
-
GP[22]/(BOOTMODE0)
F18
J20
EMIFA Sub-Block 1
-
EM_D[7]/GP[21]
F17
H20
EMIFA Sub-Block 1
AEM
EM_D[6]/GP[20]
F16
F21
EMIFA Sub-Block 1
AEM
EM_D[5]/GP[19]
E17
F22
EMIFA Sub-Block 1
AEM
EM_D[4]/GP[18]
E18
G21
EMIFA Sub-Block 1
AEM
EM_D[3]/GP[17]
E16
F20
EMIFA Sub-Block 1
AEM
EM_D[2]/GP[16]
D17
E22
EMIFA Sub-Block 1
AEM
EM_D[1]/GP[15]
D18
G20
EMIFA Sub-Block 1
AEM
EM_D[0]/GP[14]
D16
E21
EMIFA Sub-Block 1
AEM
EM_CS3/GP[13]
C18
D22
EMIFA Sub-Block 1
CS3SEL
EM_CS2/GP[12]
C19
C22
EMIFA Sub-Block 1
AEM
EM_A[3]/GP[11]
B18
D21
EMIFA Sub-Block 1
AEM
EM_A[4]/GP[10]/(PLLMS2)
A17
B21
EMIFA Sub-Block 1
AEM
EM_A[1]/(ALE)/GP[9]/(PLLMS1)
A16
B20
EMIFA Sub-Block 1
AEM
EM_A[2]/(CLE)/GP[8]/(PLLMS0)
B16
A20
EMIFA Sub-Block 1
AEM
EM_A[0]/GP[7]/(AEM2)
B17
C21
EMIFA Sub-Block 1
AEM
EM_BA[0]/GP[6]/(AEM1)
C17
E20
EMIFA Sub-Block 1
AEM
EM_BA[1]/GP[5]/(AEM0)
C16
C20
EMIFA Sub-Block 1
AEM
EM_A[12]/GP[89]
D10
B12
EMIFA Sub-Block 3
AEM
EM_A[11]/GP[90]
C10
C12
EMIFA Sub-Block 3
AEM
EM_A[10]/GP[91]
A9
B11
EMIFA Sub-Block 3
AEM
EM_A[9]/GP[92]
D9
C11
EMIFA Sub-Block 3
AEM
EM_A[8]/GP[93]
B9
A11
EMIFA Sub-Block 3
AEM
EM_A[7]/GP[94]
C9
C10
EMIFA Sub-Block 3
AEM
EM_A[6]/GP[95]
D8
B10
EMIFA Sub-Block 3
AEM
EM_A[5]/GP[96]
B8
A10
EMIFA Sub-Block 3
AEM
VLYNQ_CLOCK/GP[57]
A7
A8
Host Block
HOSTBK
HD0/VLYNQ_SCRUN/GP[58]
C8
B9
Host Block
HOSTBK
HD1/VLYNQ_RXD0/GP[59]
D7
C9
Host Block
HOSTBK
HD2/VLYNQ_RXD1/GP[60]
A8
A9
Host Block
HOSTBK
HD3/VLYNQ_RXD2/GP[61]
B7
B8
Host Block
HOSTBK
HD4/VLYNQ_RXD3/GP[62]
C7
C8
Host Block
HOSTBK
HD5/VLYNQ_TXD0/GP[63]
A6
A7
Host Block
HOSTBK
HD6/VLYNQ_TXD1/GP[64]
D6
C7
Host Block
HOSTBK
HD7/VLYNQ_TXD2/GP[65]
B6
B7
Host Block
HOSTBK
HD8/VLYNQ_TXD3/GP[66]
A5
A6
Host Block
HOSTBK
HD9/MCOL/GP[67]
C6
C6
Host Block
HOSTBK
HD10/MCRS/GP[68]
B5
B6
Host Block
HOSTBK
HD11/MTXD3/GP[69]
C5
A5
Host Block
HOSTBK
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Table 3-19. Multiplexed Pins on C6421 (continued)
SIGNAL
PINMUX DESCRIPTION
ZWT
NO.
ZDU
NO.
PINMUX GROUP
HD12/MTXD2/GP[70]
D5
C5
Host Block
HOSTBK
HD13/MTXD1/GP[71]
B4
B4
Host Block
HOSTBK
HD14/MTXD0/GP[72]
D4
B5
Host Block
HOSTBK
HD15/MTXCLK/GP[73]
A4
A4
Host Block
HOSTBK
HHWIL/MRXDV/GP[74]
C4
D3
Host Block
HOSTBK
HCNTL1/MTXEN/GP[75]
D3
C4
Host Block
HOSTBK
HCNTL0/MRXER/GP[76]
B3
B2
Host Block
HOSTBK
HR/W/MRXCLK/GP[77]
A3
A3
Host Block
HOSTBK
HDS2/MRXD0/GP[78]
C3
C2
Host Block
HOSTBK
HDS1/MRXD1/GP[79]
B2
B3
Host Block
HOSTBK
HRDY/MRXD2/GP[80]
D2
C3
Host Block
HOSTBK
HCS/MDCLK/GP[81]
C1
D1
Host Block
HOSTBK
HINT/MRXD3/GP[82]
C2
D2
Host Block
HOSTBK
HAS/MDIO/GP[83]
D1
C1
Host Block
HOSTBK
GP[4]/PWM1
F3
F3
PWM1Block
PWM1BK
ACLKR0/CLKX0/GP[99]
H1
J1
Serial Port Sub-Block 0
SPBK0
AFSR0/DR0/GP[100]
H4
K3
Serial Port Sub-Block 0
SPBK0
AHCLKR0/CLKR0/GP[101]
J2
K1
Serial Port Sub-Block 0
SPBK0
AXR0[3]/FSR0/GP[102]
G4
J3
Serial Port Sub-Block 0
SPBK0
AXR0[2]/FSX0/GP[103]
H3
J2
Serial Port Sub-Block 0
SPBK0
AXR0[1]/DX0/GP[104]
J3
K2
Serial Port Sub-Block 0
SPBK0
AXR0[0]/GP[105]
H2
H2
Serial Port Sub-Block 1
SPBK1
ACLKX0/GP[106]
F1
G1
Serial Port Sub-Block 1
SPBK1
AFSX0/GP[107]
G2
G2
Serial Port Sub-Block 1
SPBK1
AHCLKX0/GP[108]
G1
H1
Serial Port Sub-Block 1
SPBK1
AMUTEIN0/GP[109]
F2
G3
Serial Port Sub-Block 1
SPBK1
AMUTE0/GP[110]
G3
H3
Serial Port Sub-Block 1
SPBK1
TINP1L/GP[56]
L4
P3
Timer 1 Block
TIM1BK
TOUT1L/GP[55]
K4
N3
Timer 1 Block
TIM1BK
TINP0L/GP[98]
K2
L2
Timer 0 Block
TIM0BK
CLKS0/TOUT0L/GP[97]
J4
L3
Timer 0 Block
TIM0BK
URXD0/GP[85]
L2
M2
UART0 Data Block
UR0DBK
UTXD0/GP[86]
K3
N1
UART0 Data Block
UR0DBK
UCTS0/GP[87]
L1
P1
UART0 Flow Control Block
UR0FCBK
URTS0/PWM0/GP[88]
L3
M3
UART0 Flow Control Block
UR0FCBK
CLKOUT0/PWM2/GP[84]
M1
R1
CLKOUT Block
NAME
CONTROLLED BY PINMUX BIT FIELDS
CKOBK
Note: PINMUX group EMIFA Sub-Block 2 is not shown in the above table because there is no actual pin
multiplexing in that block. However this block is still considered a "pin mux block" because it contains
some of the pins necessary for EMIFA. The pins in this block are as follows:
• EMIFA Sub-Block 2
– EM_WAIT/(RDY/BSY)
– EM_OE
– EM_WE
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Device Configurations
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3.7.3.2 Peripherals Spanning Multiple Pin Mux Blocks
Some peripherals span multiple Pin Mux Blocks. To use these peripherals, they must be selected in all of
the relevant Pin Mux Blocks. The following is the list of peripherals that span multiple Pin Mux Blocks:
• McBSP0: Six McBSP0 pins are located in the Serial Port Sub-Block 0, but the CLKS0 pin is muxed in
the Timer0 Block. To select McBSP0 pins, program PINMUX registers as follows:
– Serial Port Sub-Block 0: SPBK0 = 01
– Timer0 Block: If CLKS0 pin is desired, program TIM0BK = 10 or 11.
• UART0: The two UART0 data pins are located in the UART0 Data Block, but the two UART0 flow
control pins are located in the UART0 Flow Control Block. To select UART0, program PINMUX
registers as follows:
– UART0 Data Block: UR0BK = 1
– UART0 Flow Control Block: If flow control pins are desired, program UR0FCBK = 01.
3.7.3.3 Host Block Muxing
This block of 27 pins consists of HPI, VLYNQ, EMAC(MII), MDIO, and GPIO muxed pins. The following
register field selects the pin functions in the Host Block:
• PINMUX1.HOSTBK
Table 3-20 summarizes the 27 pins in the Host Block, the multiplexed function on each pin, and the
PINMUX configurations to select the corresponding function.
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Table 3-20. Host Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL NAME
HPI
FUNCTION
VLYNQ_CLOCK/GP[57]
–
EMAC(MII)/MDIO
SELECT
FUNCTION
–
VLYNQ
SELECT
FUNCTION
GPIO
SELECT
FUNCTION
SELECT
HOSTBK = 000
or
HOSTBK = 001
or
HOSTBK = 100
–
–
VLYNQ_CLOCK
GP[57]
GP[58]
HD0/VLYNQ_SCRUN/GP[58]
HD0
–
–
VLYNQ_SCRUN
HD1/VLYNQ_RXD0/GP[59]
HD1
–
–
VLYNQ_RXD0
HD2/VLYNQ_RXD1/GP[60]
HD2
–
–
VLYNQ_RXD1
HD3/VLYNQ_RXD2/GP[61]
HD3
–
–
VLYNQ_RXD2
HD4/VLYNQ_RXD3/GP[62]
HD4
–
–
VLYNQ_RXD3
GP[62]
HD5/VLYNQ_TXD0/GP[63]
HD5
–
–
VLYNQ_TXD0
GP[63]
HD6/VLYNQ_TXD1/GP[64]
HD6
–
–
VLYNQ_TXD1
GP[64]
HD7/VLYNQ_TXD2/GP[65]
HD7
–
–
VLYNQ_TXD2
GP[65]
HD8/VLYNQ_TXD3/GP[66]
HD8
–
–
VLYNQ_TXD3
HD9/MCOL/GP[67]
HD9
MCOL
–
–
GP[67]
HD10/MCRS/GP[68]
HD10
MCRS
–
–
GP[68]
HD11/MTXD3/GP[69]
HD11
MTXD3
–
–
GP[69]
HD12/MTXD2/GP[70]
HD12
MTXD2
–
–
GP[70]
HD13/MTXD1/GP[71]
HD13
MTXD1
–
–
GP[71]
HD14/MTXD0/GP[72]
HD14
MTXD0
–
–
GP[72]
HD15/MTXCLK/GP[73]
HD15
MTXCLK
–
–
GP[73]
HHWIL/MRXDV/GP[74]
HHWIL
MRXDV
–
–
GP[74]
HCNTL1/MTXEN/GP[75]
HCNTL1
MTXEN
–
–
GP[75]
HCNTL0/MRXER/GP[76]
GP[59]
HOSTBK = 010
or
HOSTBK = 011
GP[60]
GP[61]
HOSTBK = 000
or
HOSTBK = 100
GP[66]
HOSTBK = 001
HOSTBK = 011
or
HOSTBK = 100
HCNTL0
MRXER
–
–
GP[76]
HR/W/MRXCLK/GP[77]
HR/W
MRXCLK
–
–
GP[77]
HDS2/MRXD0/GP[78]
HDS2
MRXD0
–
–
GP[78]
HDS1/MRXD1/GP[79]
HDS1
MRXD1
–
–
GP[79]
HRDY/MRXD2/GP[80]
HRDY
MRXD2
–
–
GP[80]
HCS/MDCLK/GP[81]
HCS
MDCLK
–
–
GP[81]
HINT/MRXD3/GP[82]
HINT
MRXD3
–
–
GP[82]
HAS/MDIO/GP[83]
HAS
MDIO
–
–
GP[83]
HOSTBK = 000
or
HOSTBK = 010
There is only one EMAC peripheral on the C6421 device, even though the pins for MII mode and the pins
for RMII modes are brought out to different locations. The EMAC MII mode pins are in the Host Block,
while EMAC RMII mode pins are only in the EMIFA Block. The user is only allowed to select either the MII
pins or the RMII pins. The operation is undefined if the user attempts to select both MII pins and RMII
pins.
Table 3-21 provides a different view of the Host Block pin muxing, showing the Host Block function based
on PINMUX1 settings. The selection options are also shown pictorially in Figure 3-10.
If EMAC operation is desired, EMAC must be placed in reset before programming PINMUX1.HOSTBK to
select EMAC pins.
Table 3-21. Host Block Function Selection
PINMUX1
SETTING
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
HOSTBK
000
GPIO (27)
(Default)
001
HPI + GPIO (1)
GPIO: GP[83:57]
HPI: HHWIL, HCNTL[1:0], HR/W, HDS2, HDS1, HRDY, HCS, HINT, HAS, HD[15:0]
GPIO: GP[57]
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Table 3-21. Host Block Function Selection (continued)
PINMUX1
SETTING
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
HOSTBK
VLYNQ: VLYNQ_CLOCK, VLYNQ_SCRUN, VLYNQ_RXD[3:0], VLYNQ_TXD[3:0]
010
VLYNQ + GPIO (17)
GPIO: GP[83:67]
VLYNQ: VLYNQ_CLOCK, VLYNQ_SCRUN, VLYNQ_RXD[3:0], VLYNQ_TXD[3:0]
011
EMAC (MII): TXCLK, CRS, COL, TXD[3:0], RXDV, TXEN, RXER, RXCLK,
RXD[3:0]
VLYNQ + EMAC (MII) + MDIO
MDIO: MDC, MDIO
If EMAC operation is desired, EMAC must be placed in reset before
programming PINMUX1.HOSTBK or PINMUX0.RMII to select EMAC pins.
EMAC (MII): TXCLK, CRS, COL, TXD[3:0], RXDV, TXEN, RXER, RXCLK,
RXD[3:0]
100
EMAC (MII) + MDIO + GPIO (10)
MDIO: MDC, MDIO
GPIO: GP[66:57]
If EMAC operation is desired, EMAC must be placed in reset before
programming PINMUX1.HOSTBK or PINMUX0.RMII to select EMAC pins.
101 to 111
Reserved
Reserved
The VDD3P3V_PWDN.HOST field determines the power state of the Host Block pins. The Host Block
pins default to powered up. For more details on the VDD3P3V_PWDN.HOST field, see Section 3.2, Power
Considerations.
3.7.3.4 UART0 Data Block Muxing
This block of 2 pins consists of UART0 Data, and GPIO muxed pins. The PINMUX1.UR0DBK register field
select the pin functions in the UART0 Data Block.
Table 3-22 summarizes the 2 pins in the UART0 Data Block, the multiplexed function on each pin, and the
PINMUX configurations to select the corresponding function.
Table 3-22. UART0 Data Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL
UART0
NAME
FUNCTION
URXD0/GP[85]
URXD0
UTXD0/GP[86]
UTXD0
GPIO
SELECT
UR0DBK = 1
FUNCTION
SELECT
GP[85]
UR0DBK = 0
GP[86]
As discussed in Section 3.7.3.2, Peripherals Spanning Multiple Pin Mux Blocks, the UART0 pins span
across two Pin Mux Blocks: UART0 Data Block, and UART0 Flow Control Block. For proper UART0
operation, the two pins in the UART0 Data Block must be configured for UART0 data functions. The two
pins in the UART0 Flow Control Block are optional.
Table 3-23 provides a different view of the UART0 Data Block pin muxing, showing the UART0 Data Block
function based on PINMUX1.UR0DBK setting. The selection options are also shown pictorially in
Figure 3-10.
Table 3-23. UART0 Data Block Function Selection
PINMUX1.UR0DBK
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
0
GPIO (2) (Default)
GPIO: GP[86:85]
1
UART0 Data
UART0: URXD0, UTXD0
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In addition, the VDD3P3V_PWDN.UR0DAT field determines the power state of the UART0 Data Block
pins. The UART0 Data Block pins default to powered down and not operational. To use these pins, user
must first program VDD3P3V_PWDN.UR0DAT = 0 to power up the pins. For more details on the
VDD3P3V_PWDN.UR0DAT field, see Section 3.2, Power Considerations.
The UART0 Data Block features internal pullup resistors, which matches the UART inactive polarity.
3.7.3.5 UART0 Flow Control Block
This block of 2 pins consists of UART0 Flow Control, PWM0, and GPIO muxed pins. The
PINMUX1.UR0FCBK register field selects the pin functions in the UART0 Flow Control Block.
Table 3-24 summarizes the 2 pins in the UART0 Flow Control Block, the multiplexed function on each pin,
and the PINMUX configurations to select the corresponding function.
Table 3-24. UART0 Flow Control Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL
UART0
NAME
FUNCTION
UCTS0/
GP[87]
UCTS0
PWM0
SELECT
GPIO
FUNCTION
SELECT
FUNCTION
SELECT
–
–
GP[87]
UR0FCBK = 00/10
PWM0
UR0FCBK = 10
GP[88]
UR0FCBK = 00
UR0FCBK = 01
URTS0/
PWM0/
GP[88]
URTS0
As discussed in Section 3.7.3.2, Peripherals Spanning Multiple Pin Mux Blocks, the UART0 pins span
across two Pin Mux Blocks: UART0 Data Block, and UART0 Flow Control Block. For proper UART0
operation, the two pins in the UART0 Data Block must be configured for UART0 data functions. The two
pins in the UART0 Flow Control Block are optional.
Table 3-25 provides a different view of the UART0 Flow Control Block pin muxing, showing the UART0
Flow Control Block function based on PINMUX1.UR0FCBK setting. The selection options are also shown
pictorially in Figure 3-10.
Table 3-25. UART0 Flow Control Block Function Selection
PINMUX1.UR0FCBK
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
00
GPIO (2) (default)
GPIO: GP[88:87]
01
UART0 Flow Control
UART0: UCTS0, URTS0
10
PWM0 + GPIO (1)
PWM0: PWM0
GPIO: GP[87]
11
Reserved
Reserved
In addition, the VDD3P3V_PWDN.UR0FC field determines the power state of the UART0 Flow Control
Block pins. The UART0 Flow Control Block pins default to powered down and not operational. To use
these pins, user must first program VDD3P3V_PWDN.UR0FC = 0 to power up the pins. For more details
on the VDD3P3V_PWDN.UR0FC field, see Section 3.2, Power Considerations.
The UART0 Flow Control Block features internal pullup resistors, which matches the UART inactive
polarity.
3.7.3.6 Timer0 Block
This block of 2 pins consists of Timer0 and McBSP0 muxed pins. The PINMUX1.TIM0BK register field
selects the pin functions in the Timer0 Block.
Table 3-26 summarizes the 2 pins in the Timer0 Block, the multiplexed function on each pin, and the
PINMUX configurations to select the corresponding function.
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Table 3-26. Timer0 Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL
McBSP
Timer0
GPIO
NAME
FUNCTION
SELECT
FUNCTION
SELECT
FUNCTION
TINP0L/
GP[98]
–
TIM0BK = 10
TINP0L
TIM0BK = 01/11
GP[98]
CLKS0/
TOUT0L/
GP[97]
CLKS0
TIM0BK = 11
TOUT0L
TIM0BK = 01
GP[97]
SELECT
TIM0BK = 00
As discussed in Section 3.7.3.2, Peripherals Spanning Multiple Pin Mux Blocks, the McBSP0 pins span
across two Pin Mux Blocks: Serial Port Sub-Block0, and Timer0 Block. For proper McBSP0 operation, the
Serial Port Sub-Block0 must be programmed to select McBSP0 function. The McBSP0 CLKS0 pin in the
Timer0 Block is optional for McBSP0 operation. CLKS0 is only needed if you desire using CLKS0 as an
external clock source to the McBSP0 internal sample rate generator.
Table 3-27 provides a different view of the Timer0 Block pin muxing, showing the Timer0 Block function
based on PINMUX1.TIM0BK setting. The selection options are also shown pictorially in Figure 3-10.
Table 3-27. Timer0 Block Function Selection
PINMUX1.TIM0BK
BLOCK FUNCTION
00
GPIO (2) (default)
RESULTING PIN FUNCTIONS
GPIO: GP[98:97]
01
Timer0
Timer0: TINP0L, TOUT0L
10
Reserved
–
11
McBSP0 External Clock Source,
Timer0 Input
McBSP0: CLKS0
Timer0: TINP0L
In addition, the VDD3P3V_PWDN.TIMER0 field determines the power state of the Timer0 Block pins. The
Timer0 Block pins default to powered down and not operational. To use these pins, user must first
program VDD3P3V_PWDN.TIMER0 = 0 to power up the pins. For more details on the
VDD3P3V_PWDN.TIMER0 field, see Section 3.2, Power Considerations.
3.7.3.7 Timer1 Block
This block of 2 pins consists of Timer1 and GPIO muxed pins. The PINMUX1.TIM1BK register field
selects the pin functions in the Timer1 Block.
Table 3-28 summarizes the 2 pins in the Timer1 Block, the multiplexed function on each pin, and the
PINMUX configurations to select the corresponding function.
Table 3-28. Timer1 Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL
NAME
TIMER1
FUNCTION
TINP1L/
GP[56]
TINP1L
TOUT1L/
GP[55]
TOUT1L
GPIO
SELECT
FUNCTION
SELECT
GP[56]
TIM1BK = 01
TIM1BK = 00
GP[55]
Table 3-29 provides a different view of the Timer1 Block pin muxing, showing the Timer1 Block function
based on PINMUX1.TIM1BK setting. The selection options are also shown pictorially in Figure 3-10.
Table 3-29. Timer1 Block Function Selection
PINMUX1.TIM1BK
BLOCK FUNCTION
00
GPIO (2) (default)
GPIO: GP[56:55]
01
Timer1
Timer1: TINP1L, TOUT1L
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Table 3-29. Timer1 Block Function Selection (continued)
PINMUX1.TIM1BK
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
10
Reserved
–
11
Reserved
–
In addition, the VDD3P3V_PWDN.TIMER1 field determines the power state of the Timer1 Block pins. The
Timer1 Block pins default to powered down and not operational. To use these pins, user must first
program VDD3P3V_PWDN.TIMER1 = 0 to power up the pins. For more details on the
VDD3P3V_PWDN.TIMER1 field, see Section 3.2, Power Considerations.
The Timer1 Block features internal pull up resistors, which matches the UART inactive polarity.
3.7.3.8
Serial Port Block
This block of 12 pins consists of McASP0, McBSP0, and GPIO muxed pins. The following register fields
select the pin functions in the Serial Port Block:
• PINMUX1.SPBK0
• PINMUX1.SPBK1
The Serial Port Block is further subdivided into these sub-blocks:
• Serial Port Sub-Block 0: McBSP0, part of McASP0, and GPIO.
• Serial Port Sub-Block 1: part of McASP0 and GPIO.
Table 3-30 summarizes the 12 pins in the Serial Port Block, the multiplexed function on each pin, and the
PINMUX configurations to select the corresponding function.
Table 3-30. Serial Port Block Muxed Pins Selection
MULTIPLEXED FUNCTIONS
SIGNAL NAME
McASP0
FUNCTION
McBSP0
SELECT
FUNCTION
GPIO
SELECT
FUNCTION
SELECT
Serial Port Sub-block 0
ACLKR0/CLKX0/GP[99]
AFSR0/DR0/GP[100]
AHCLKR0/CLKR0/GP[101]
ACLKR0
CLKX0
GP[99]
AFSR0
DR0
GP[100]
AHCLKR0
SPBK0 = 10
CLKR0
FSR0
SPBK0 = 01
GP[101]
AXR0[3]/FSR0/GP[102]
AXR0[3]
GP[102]
AXR0[2]/FSX0/GP[103]
AXR0[2]
FSX0
GP[103]
AXR0[1]/DX0/GP[104]
AXR0[1]
DX0
GP[104]
AXR0[0]/GP[105]
AXR0[0]
–
–
GP[105]
ACLKX0/GP[106]
ACLKX0
–
–
GP[106]
AFSX0
–
–
GP[107]
–
–
GP[108]
SPBK0 = 00
Serial Port Sub-block 1
AFSX0/GP[107]
SPBK1 = 10
AHCLKX0/GP[108]
AHCLKX0
AMUTEIN0/GP[109]
AMUTEIN0
–
–
GP[109]
AMUTE0
–
–
GP[110]
AMUTE0/GP[110]
SPBK1 = 00
As discussed in Section 3.7.3.2, Peripherals Spanning Multiple Pin Mux Blocks, the McBSP0 pins span
across two Pin Mux Blocks: Serial Port Sub-Block0, and Timer0 Block. For proper McBSP0 operation, the
Serial Port Sub-Block0 must be programmed to select McBSP0 function. The McBSP0 CLKS0 pin in the
Timer0 Block is optional for McBSP0 operation. CLKS0 is only needed if you desire using CLKS0 as an
external clock source to the McBSP0 internal sample rate generator.
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Table 3-31 and Table 3-32 provide a different view of the Serial Port Block. Table 3-31 shows the Serial
Port Sub-Block 0 function based on PINMUX1.SPBK0 setting. Table 3-32 shows the Serial Port Sub-Block
1 function based on PINMUX1.SPBK1 setting. These selection options are also shown pictorially in
Figure 3-10.
Table 3-31. Serial Port Sub-Block 0 Function Selection
PINMUX1.SPBK0
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
00
GPIO (6) (default)
GPIO: GP[104:99]
01
McBSP0
McBSP0: CLKX0, FSX0, DX0, CLKR0, FSR0, DR0
10
McASP0 Receive, 3 Serializers
McASP0: ACLKR0, AFSR0, AHCLKR0, AXR0[3],
AXR0[2], AXR0[1]
11
Reserved
Reserved
Table 3-32. Serial Port Sub-Block 1 Function Selection
(1)
PINMUX1.SPBK1
BLOCK FUNCTION
RESULTING PIN FUNCTIONS
00
GPIO (6) (default)
GPIO: GP[110:105]
01
Reserved
–
10
McASP0 Transmit with 1 Serializer and
Mute Control
McASP0: AXR0[0], ACLKX0, AFSX0, AHCLKX0,
AMUTEIN0 (1), AMUTE0
11
Reserved
–
The input from the AMUTEIN0/GP[109] pin is connected to both the McASP0 and GPIO.
In addition, the VDD3P3V_PWDN.SP field determines the power state of the Serial Port Block pins. The
Serial Port Block pins default to powered down and not operational. To use these pins, user must first
program VDD3P3V_PWDN.SP = 0 to power up the pins. For more details on the VDD3P3V_PWDN.SP
field, see Section 3.2, Power Considerations.
To facilitate McASP0 operation, the input from the AMUTEIN0/GP[109] pin is connected to both the
McASP0 and the GPIO module. Therefore when an external mute event occurs, in addition to notifying the
McASP0, it can also cause an interrupt through the GPIO module.
3.7.3.9 PWM1 Block
This block of 1 pin consists of PWM1 and GPIO muxed pins (GP[4]/PWM1). The PINMUX1.PWM1BK
register field selects the pin function in the PWM1 Block.
Table 3-33 summarizes the 1 pin in the PWM1 Block, its multiplexed function, and the PINMUX
configurations to select the corresponding function.
Table 3-33. PWM1 Block Muxed Pin Selection
MULTIPLEXED FUNCTIONS
SIGNAL
PWM1
GPIO
NAME
FUNCTION
SELECT
FUNCTION
SELECT
GP[4]/PWM1
PWM1
PWM1BK = 1
GP[4]
PWM1BK = 0
Table 3-34 provides a different view of the PWM1 Block pin muxing, showing the PWM1 Block function
based on PINMUX1.PWM1BK setting. The selection options are also shown pictorially in Figure 3-10.
Table 3-34. PWM1 Block Function Selection
PINMUX1.PWM1BK
BLOCK FUNCTION
0
GPIO (1) (default)
1
PWM1
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GPIO: GP[4]
PWM1: PWM1
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In addition, the VDD3P3V_PWDN.PWM1 field determines the power state of the PWM1 Block pin. The
PWM1 Block pin defaults to powered down and not operational. To use this pin, user must first program
VDD3P3V_PWDN.PWM1 = 0 to power up the pin. For more details on the VDD3P3V_PWDN.PWM1 field,
see Section 3.2, Power Considerations.
3.7.3.10 CLKOUT Block
This block of 1 pin consists of CLKOUT, PWM2, and GPIO muxed pin (CLKOUT0/PWM2/GP[84]). The
PINMUX1.CKOBK register field selects the pin function in the CLKOUT Block.
Table 3-35 summarizes the 1 pin in the CLKOUT Block, its multiplexed function, and the PINMUX
configurations to select the corresponding function.
Table 3-35. CLKOUT Block Multiplexed Pin Selection
MULTIPLEXED FUNCTIONS
SIGNAL
CLKOUT0
PWM2
GPIO
NAME
FUNCTION
SELECT
FUNCTION
SELECT
FUNCTION
SELECT
CLKOUT0/
PWM2/
GP[84]
CLKOUT0
CKOBK = 01
PWM2
CKOBK = 10
GP[84]
CKOBK = 00
Table 3-36 provides a different view of the CLKOUT Block pin muxing, showing the CLKOUT Block
function based on PINMUX1.CKOBK setting. The selection options are also shown pictorially in
Figure 3-10.
Table 3-36. CLKOUT Block Function Selection
PINMUX1.CKOBK
BLOCK FUNCTION
00
GPIO (1)
RESULTING PIN FUNCTIONS
GPIO: GP[84]
01
CLKOUT (default)
Device Clock-Out: CLKOUT0
10
PWM2
PWM2: PWM2
11
Reserved
Reserved
This block defaults to CLKOUT0 pin function.
In addition, the VDD3P3V_PWDN.CLKOUT field determines the power state of the CLKOUT Block pin.
The CLKOUT Block pin defaults to powered up. For more details on the VDD3P3V_PWDN.CLKOUT field,
see Section 3.2, Power Considerations.
3.7.3.11 EMIFA Block Muxing
This block of 61 pins consists of EMIFA, EMAC(RMII), and GPIO muxed pins. The following register fields
affect the pin functions in the EMIFA Block:
• All PINMUX0 register fields: AEM, CS5SEL, CS4SEL, CS3SEL, and RMII.
There is only one EMAC peripheral on the C6421 device, even though the pins for MII mode and the pins
for RMII modes are brought out to different locations. The EMAC MII mode pins are in the Host Block,
while EMAC RMII mode pins are only in the EMIFA Block. The user is only allowed to select either the MII
pins or the RMII pins. The operation is undefined if the user attempts to select both MII pins and RMII
pins.
The EMIFA Block is divided into multiple sub-blocks for ultimate flexibility in pin multiplexing to
accommodate a wide variety of applications, and for the purpose of I/O pins power control:
• Sub-Block 0: multiplexed between EMIFA address/control pins, part of EMAC(RMII), and GPIO.
• Sub-Block 1: multiplexed between EMIFA data/address/control pins, part of EMAC(RMII), and GPIO.
• Sub-Block 2: no multiplexing. EMIFA control pins EM_WAIT/(RDY/BSY), EM_OE, EM_WE.
• Sub-Block 3: multiplexed between EMIFA address pins EM_A[12:6] and GPIO.
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The EMBK0, EMBK1, EMBK2, EMBK3 fields in the VDD3P3V_PWDN register determine the power state
of the EMIFA Block pins. The EMIFA Block pins default to powered up. For more details on the EMBK0,
EMBK1, EMBK2, EMBK3 fields in the VDD3P3V_PWDN register, see Section 3.2, Power Considerations.
To understand pin multiplexing in the EMIFA Block, see Section 3.7.3.11.1, EMIFA Block Major
Configuration Choices to determine the major configuration choices (A,B,C,D,E, or F). Section 3.7.3.11.2,
EMIFA Block Pin-By-Pin Multiplexing Summary, provides a pin-by-pin muxing summary for the EMIFA
Block. For more information on the PINMUX0 and PINMUX1 registers, see Section 3.7.2, Pin Muxing
Selection After Reset.
3.7.3.11.1 EMIFA Block Major Configuration Choices
Table 3-37 shows the major configuration choices in the EMIFA Block. Use this table to determine all of
the PINMUX settings for the EMIFA Block: AEM, RMII, CS5SEL, CS4SEL, and CS3SEL.
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Table 3-37. EMIFA Block Major Configuration Choices
MAJOR
CONFIG.
OPTION
A
B
C
PINMUX SELECTION FIELDS
AEM
000
000
010
RMII
CS3SEL
0
1
0
0
0
0 or 1
CS4SEL
0
0
0 or 1
RESULTING PERIPHERALS/PINS
CS5SEL
0
0
0 or 1
EMIFA (1)
RMII
-
-
RMII:
RMRXER, RMRXD[1:0],
RMTXD[1:0], REFCLK,
RMCRSDV, RMTXEN
8-bit EMIFA (Async) Pinout
Mode 2:
EM_A[21:0], EM_D[7:0],
EM_R/W, EM_CS2,
EM_BA[1:0],
EM_WAIT/(RDY/BSY),
EM_WE, EM_OE
D
010
1
0 or 1
0
0
50 GP Pins:
GP[96:89], GP[54:53],
GP[51:34], GP[26:5],
13 GP pins:
GP[54:52], GP[31:22]
-
Optional Selection:
EM_CS5 (CS5SEL = 1),
EM_CS4 (CS4SEL = 1),
EM_CS3 (CS3SEL = 1)
8-bit EMIFA (Async) Pinout
Mode 2:
EM_A[21:0], EM_D[7:0],
EM_R/W, EM_CS2,
EM_BA[1:0],
EM_WAIT/(RDY/BSY),
EM_WE, EM_OE
GPIO
58 GP Pins:
GP[96:89], GP[54:5]
RMII:
RMRXER, RMRXD[1:0],
RMTXD[1:0], REFCLK,
RMCRSDV, RMTXEN
Optional Selection:
GP[33] (CS5SEL = 0),
GP[32] (CS4SEL = 0),
GP[13] (CS3SEL = 0)
7 GP pins:
GP[54:53], GP[26:22]
Optional Selection:
GP[13] (CS3SEL = 0)
Optional Selection:
EM_CS3 (CS3SEL = 1)
E
101
0
0 or 1
0 or 1
0 or 1
8-bit EMIFA (NAND) Pinout
Mode 5:
EM_D[7:0], EM_A[2:1],
EM_CS2,
EM_WAIT/(RDY/BSY),
EM_WE, EM_OE
44 GP pins:
GP[96:89], GP[54:34],
GP[31:22], GP[11:10],
GP[7:5]
Optional Selection:
GP[33] (CS5SEL = 0),
GP[32] (CS4SEL = 0),
GP[13] (CS3SEL = 0)
Optional Selection:
EM_CS5 (CS5SEL = 1),
EM_CS4 (CS4SEL = 1),
EM_CS3 (CS3SEL = 1)
F
101
1
0 or 1
0
0
8-bit EMIFA (NAND) Pinout
Mode 5:
EM_D[7:0], EM_A[2:1],
EM_CS2,
EM_WAIT/(RDY/BSY),
EM_WE, EM_OE
RMII:
RMRXER, RMRXD[1:0],
RMTXD[1:0], REFCLK,
RMCRSDV, RMTXEN
Optional Selection:
EM_CS3 (CS3SEL = 1)
(1)
38 GP pins:
GP[96:89], GP[54:34],
GP[26:22], GP[11:10],
GP[7:5]
Optional Selection:
GP[13] (CS3SEL = 0)
The EMIFA pins EM_WAIT/(RDY/BSY), EM_OE, and EM_WE are non-multiplexed pins. They are available in all the configuration
options. However, they are only useful if additional EMIFA pins are functional. Therefore in this table, these pins are only listed in
configuration options C,D,E, and F.
The following is an example on how to read Table 3-37. For example, the "PINMUX Selection Fields"
columns indicate that Major Configuration Choice C is selected through setting PINMUX0.AEM = 010b
and PINMUX0.RMII = 0. Other PINMUX0 fields CS3SEL, CS4SEL, and CS5SEL can be set to either 0 or
1 based on the system's EMIFA Chip Select space need. The "Resulting Peripherals/Pins" columns
indicate that Major Configuration Option C can support the following combination of pin functions:
• Pins for 8-bit EMIFA (Async or NAND) function with EMIFA Chip Select space 2 (EM_CS2). If
additional Chip Select spaces are needed, set the corresponding PINMUX bit (CS5SEL, CS4SEL,
and/or CS3SEL) to 1.
• At least 13 GPIO pins. If the additional Chip Select spaces from EM_CS3, EM_CS4, or EM_CS5 are
not needed, the corresponding PINMUX bit (CS3SEL, CS4SEL, and/or CS5SEL) can be set to 0 to get
additional GPIO pins.
3.7.3.11.2 EMIFA Block Pin-By-Pin Multiplexing Summary
This section summarizes the EMIFA Block muxing on a pin-by-pin basis. It provides an alternative view to
pin muxing in the EMIFA Block. It summarizes the EMIFA Block pin muxing by dividing up the EMIFA
Block based on the PINMUX field that controls the pins. To determine the actual EMIFA Major
Configuration Option for the application need, see Section 3.7.3.11.1, EMIFA Block Major Configuration
Choices.
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Table 3-38 shows the pin multiplexing control for each pin in the EMIFA Sub-Block 0. These PINMUX0
and PINMUX1 register fields control the multiplexing in this sub-block:
• PINMUX0: AEM, RMII
Table 3-39 shows the pin multiplexing control for each pin in the EMIFA Sub-Block 1. These PINMUX0
register fields control the multiplexing in this sub-block:
• PINMUX0: AEM, CS5SEL, CS4SEL, CS3SEL, RMII
EMIFA Sub-Block 2 is dedicated to EMIFA pins EM_WAIT/(RDY/BSY), EM_OE, and EM_WE. There is no
pin multiplexing in this block. These pins always function as EMIFA control pins.
Table 3-40 shows the pin multiplexing control for each pin in the EMIFA Sub-Block 3. These PINMUX0
and PINMUX1 register fields control the multiplexing in this sub-block:
• PINMUX0: AEM
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Table 3-38. EMIFA Sub-Block 0 Pin-By-Pin Mux Control
MULTIPLEXED FUNCTIONS
SIGNAL NAME
EMIFA
EMAC(RMII)
GPIO
FUNCTION
SELECT
FUNCTION
SELECT
FUNCTION
SELECT
GP[54]
–
–
–
–
GP[54]
–
GP[53]
–
–
–
–
GP[53]
–
RMRXER/GP[52]
–
–
RMXER
RMII = 1
GP[52]
RMII = 0
EM_A[13]/GP[51]
EM_A[13]
–
–
GP[51]
EM_A[14]/GP[50]
EM_A[14]
–
–
GP[50]
EM_A[15]/GP[49]
EM_A[15]
–
–
GP[49]
EM_A[16]/GP[48]
EM_A[16]
–
–
GP[48]
EM_A[17]/GP[47]
EM_A[17]
–
–
GP[47]
EM_A[18]/GP[46]
EM_A[18]
–
–
GP[46]
EM_A[19]//GP[45]
EM_A[19]
–
–
GP[45]
EM_A[20]/GP[44]
EM_A[20]
–
–
GP[44]
GP[43]
–
–
–
GP[43]
GP[42]
–
–
–
GP[42]
GP[41]
–
–
–
GP[41]
GP[40]
–
–
–
GP[40]
GP[39]
–
–
–
GP[39]
GP[38]
–
–
–
GP[38]
GP[37]
–
–
–
GP[37]
GP[36]
–
–
–
GP[36]
EM_R/W/GP[35]
EM_R/W
–
–
GP[35]
EM_A[21]/GP[34]
EM_A[21]
–
–
GP[34]
AEM = 2
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Table 3-39. EMIFA Sub-Block 1 Pin-By-Pin Mux Control
MULTIPLEXED FUNCTIONS
SIGNAL
NAME
EMIFA
EMAC(RMII)
GPIO
FUNCTION
SELECT
FUNCTION
SELECT
FUNCTION
SELECT
EM_CS5
RMII = 0
CS5SEL = 1
RMRXD1
RMII = 1
CS5SEL = 0
GP[33]
RMII = 0
CS5SEL = 0
EM_CS4
RMII = 0
CS4SEL = 1
RMRXD0
RMII = 1
CS4SEL = 0
GP[32]
RMII = 0
CS4SEL = 0
REFCLK/GP[31]
–
–
REFCLK
RMCRSDVGP[30]
–
–
RMCRSDV
RMTXEN/GP[29]
–
–
RMTXEN
RMTXD0/GP[28]
–
–
RMTXD0
RMTXD1/GP[27]
–
–
RMTXD1
GP[26]/(FASTBOOT)
–
–
–
–
GP[26]
–
GP[25]/(BOOTMODE3)
–
–
–
–
GP[25]
–
GP[24]/(BOOTMODE2)
–
–
–
–
GP[24]
–
GP[23]/(BOOTMODE1)
–
–
–
–
GP[23]
–
GP[22]/(BOOTMODE0)
–
–
–
–
GP[22]
–
RMRXD1EM_CS5/GP[33]
RMRXD0/EM_CS4/GP[32]
GP[31]
GP[30]
RMII = 1
GP[29]
RMII = 0
GP[28]
GP[27]
EM_D[7]/GP[21]
EM_D[7]
–
–
GP[21]
EM_D[6]/GP[20]
EM_D[6]
–
–
GP[20]
EM_D[5]/GP[19]
EM_D[5]
–
–
GP[19]
EM_D[4]/GP[18]
EM_D[4]
–
–
GP[18]
EM_D[3]/GP[17]
EM_D[3]
–
–
GP[17]
EM_D[2]/GP[16]
EM_D[2]
–
–
GP[16]
EM_D[1]/GP[15]
EM_D[1]
–
–
GP[15]
EM_D[0]/GP[14]
EM_D[0]
–
–
GP[14]
EM_CS3/GP[13]
EM_CS3
CS3SEL = 1
–
–
GP[13]
CS3SEL = 0
EM_CS2/GP[12]
EM_CS2
AEM = 2/5
–
–
GP[12]
AEM = 0
EM_A[3]/GP[11]
EM_A[3]
–
–
GP[11]
EM_A[4]/GP[10]/(PLLMS2)
EM_A[4]
–
–
GP[10]
–
–
GP[9]
–
–
GP[8]
–
–
GP[7]
–
–
GP[6]
–
–
GP[5]
AEM = 2/5
AEM = 0
AEM = 2
EM_A[1]/(ALE)/GP[9]/(PLLMS1)
EM_A[1]/(ALE)
EM_A[2]/(CLE)/GP[8]/(PLLMS0)
EM_A[2]/(CLE)
AEM = 0/5
AEM = 0
AEM = 2/5
EM_A[0]/GP[7]/(AEM2)
EM_A[0]
EM_BA[0]/GP[6]/(AEM1)
EM_BA[0]
EM_BA[1]/GP[5]/(AEM0)
EM_BA[1]
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AEM = 0/5
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Table 3-40. EMIFA Sub-Block 3 Pin-By-Pin Mux Control
MULTIPLEXED FUNCTIONS
SIGNAL
NAME
EMIFA
FUNCTION
GPIO
SELECT
FUNCTION
EM_A[12]/GP[89]
EM_A[12]
GP[89]
EM_A[11]/GP[90]
EM_A[11]
GP[90]
EM_A[10]/GP[91]
EM_A[10]
GP[91]
EM_A[9]/GP[92]
EM_A[9]
EM_A[8]/GP[93]
EM_A[8]
EM_A[7]/GP[94]
EM_A[7]
GP[94]
EM_A[6]/GP[95]
EM_A[6]
GP[95]
EM_A[5]/GP[96]
EM_A[5]
GP[96]
102
Device Configurations
AEM = 2
GP[92]
GP[93]
SELECT
AEM = 0/5
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3.8 Device Initialization Sequence After Reset
Software should follow this initialization sequence after coming out of device reset.
1. Complete the boot sequence as needed. For more details on the boot sequence, see the Using the
TMS320C642x Bootloader Application Report (literature number SPRAAK5).
2. If the device is not already at the desired operating frequency, program the PLL Controllers (PLLC1
and PLLC2) to configure the device frequency. For details on how to program the PLLC, see the
C642x DSP Phase-Locked Loop Controller (PLLC) User's Guide (literature number SPRUES0).
3. Program PINMUX0 and PINMUX1 registers to select device pin functions. For more details on
programming the PINMUX0 and PINMUX1 registers to select device pin functions, see Section 3.7,
Multiplexed Pin Configurations.
Note: If EMAC operation is desired, the EMAC must be placed in reset before programming
PINMUX1.HOSTBK and PINMUX1.RMII to select EMAC pins.
4. Program the VDD3P3V_PWDN register to power up the necessary I/O pins. For more details on
programming the VDD3P3V_PWDN register, see Section 3.2, Power Considerations.
5. As needed by the application, program the following System Module registers when there are no active
transactions on the respective peripherals:
a. HPICTL (Section 3.6.2.1, HPI Control Register): applicable for HPI only if a different host burst
write timeout value from default is desired.
b. TIMERCTL (Section 3.6.2.2, Timer Control Register): applicable for Timer0 and Watchdog Timer2
only.
c. EDMATCCFG (Section 3.6.2.3, EDMA TC Configuration Register): applicable for EDMA only. The
recommendation is to leave the EDMATCCFG register at its default.
6. Program the Power and Sleep Controller (PSC) to enable the desired peripherals. For details on how
to program the PSC, see the TMS320C642x Power and Sleep Controller (PSC) User's Guide
(literature number SPRUEN8).
7. Program the Switched Central Resource (SCR) bus priorities for the master peripherals
(Section 3.6.1). This must be configured when there are no active transactions on the respective
peripherals:
a. Program the MSTPRI0 and MSTPRI1 registers in the System Module. These registers can be
programmed before or after the respective peripheral is enabled by the PSC in step 6.
b. Program the EDMACC QUEPRI register, the C64x+ MDMAARBE.PRI field. These registers can
only be programmed after the respective peripheral is enabled by the PSC in step 6.
8. Configure the C64x+ Megamodule and the peripherals.
a. For details on C64x+ Megamodule configuration, see the TMS320C64x+ DSP Megamodule
Reference Guide (literature number SPRU871).
i. Special considerations 1: C64x+ L1P cache– on the C6421 device, the L1P Configuration
Register (L1PCFG) is device-specific and varies from what is shown in the TMS320C64x+
DSP Megamodule Reference Guide (SPRU871). For more details on theC6421 L1PCFG
register, see Section 2.2.1,C64x+ Memory Architecture. In this step, the user must modify the
L1PMODE setting to a valid setting (0, 1h, 2h, or 3h) by following these steps:
i. Write the desired L1P cache mode to the L1PMODE field in the L1PCFG register. Valid
L1PMODE settings are as follows: 0h (Cache disabled), 1h (4KB L1P cache), 2h (8KB L1P
cache), or 3h (16KB L1P cache).
ii. Read back L1PCFG. This stalls the CPU until the mode change completes.
iii. Write the desired L1P cache mode to the L1PMODE field in the L1PCFG register. Valid
L1PMODE settings are as follows: 0h (Cache disabled), 1h (4KB L1P cache), 2h (8KB L1P
cache), or 3h (16KB L1P cache).
iv. Read back L1PCFG. This stalls the CPU until the mode change completes.
ii.
Special considerations 2: Bootloader disables C64x+ cache—For all boot modes that default
to DSPBOOTADDR = 0x0010 0000 (i.e., all boot modes except the EMIFA ROM Direct Boot,
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BOOTMODE[3:0] = 0100, FASTBOOT = 0), the bootloader code disables all C64x+ cache (L2,
L1P, and L1D) so that upon exit from the bootloader code, all C64x+ memories are configured
as all RAM (L2CFG.L2MODE = 0h, L1PCFG.L1PMODE = 0h, and L1DCFG.L1DMODE = 0h).
If cache use is required, the application code must explicitly enable the cache. For more
information on boot modes, see Section 3.4.1, Boot Modes. For more information on the
bootloader, see the Using the TMS320C642x Bootloader Application Report (literature number
SPRAAK5).
b. Peripherals configuration: see the respective peripheral user’s guide.
Special considerations: DDR2 memory controller—the Peripheral Bus Burst Priority Register
(PBBPR) should be programmed to ensure good DDR2 throughput and to prevent command starvation
(prevention of certain commands from being processed by the DDR2 memory controller). For more
details, see the TMS320C642x DSP DDR2 Memory Controller User's Guide (literature number
SPRUEM4). A hex value of 0x20 is recommended for the PBBPR PR_OLD_COUNT field to provide a
good DSP performance and still allow good utilization by other modules.
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3.9 Debugging Considerations
3.9.1
Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the C642x device always be at a valid logic level and
not floating. This may be achieved via pullup/pulldown resistors. The C642x features internal pullup (IPU)
and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise noted, for
external pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
• Boot and Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor is strongly recommended, even if the IPU/IPD matches the desired
value/state.
• Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
• EMIFA Chip Select Outputs: On C6421, the EMIFA chip select pins (EM_CS2, EM_CS3, EM_CS4,
and EM_CS5) feature an internal pulldown (IPD) resistor. If these pins are connected and used as an
EMIFA chip select signal, for proper device operation, an external pullup resistor must be used to
ensure the EM_CSx function defaults to an inactive (high) state.
For the boot and configuration pins (listed in Table 2-7, Boot Terminal Functions), if they are both routed
out and 3-stated (not driven), it is strongly recommended that an external pullup/pulldown resistor be
implemented. Although, internal pullup/pulldown resistors exist on these pins and they may match the
desired configuration value, providing external connectivity can help ensure that valid logic levels are
latched on these device boot and configuration pins. In addition, applying external pullup/pulldown
resistors on the boot and configuration pins adds convenience to the user in debugging and flexibility in
switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
• For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
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For most systems, a 1-kΩ resistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩ resistor can be used to compliment the IPU/IPD on the boot and configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for
the C642x, see Section 5.3, Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Temperature.
For the internal pullup/pulldown resistors for all device pins, see the peripheral/system-specific terminal
functions table.
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4 System Interconnect
On the C6421 device, the C64x+ Megamodule, the EDMA3 transfer controllers, and the system
peripherals are interconnected through a switch fabric architecture (see Figure 4-1). The switch fabric is
composed of multiple switched central resources (SCRs) and multiple bridges. The SCRs establish
low-latency connectivity between master peripherals and slave peripherals. Additionally, the SCRs provide
priority-based arbitration and facilitate concurrent data movement between master and slave peripherals.
Through an SCR, the DSP can send data to the DDR2 Memory Controller without affecting a data transfer
between the EMAC and L2 memory. Bridges are mainly used to perform bus-width conversion as well as
bus operating frequency conversion. For example, in Figure 4-1, Bridge 6 performs a frequency
conversion between a bus operating at DSP/3 clock rate and a bus operating at DSP/6 clock rate.
Furthermore, Bridge 5 performs a bus-width conversion between a 64-bit bus and a 32-bit bus.
The C64x+ Megamodule, the EDMA3 transfer controllers (EDMA3TC[2:0]), and the various system
peripherals can be classified into two categories: master peripherals and slave peripherals. Master
peripherals are typically capable of initiating read and write transfers in the system and do not rely on the
EDMA3 or on the CPU to perform transfers to and from them. The system master peripherals include the
C64x+ Megamodule, the EDMA3 transfer controllers, VLYNQ, EMAC, and HPI. Not all master peripherals
may connect to all slave peripherals. The supported connections are designated by an Y in Table 4-1.
Table 4-1. System Connection Matrix
SLAVE PERIPHERALS/MODULES
MASTER
PERIPHERALS/MODULES
C64x+ SDMA
DDR2
MEMORY
CONTROLLER
C64x+ MDMA
–
VLYNQ
Y
EMAC
SCR4 (1)
SCR2, SCR6,
SCR7, SCR8 (1)
Y
–
Y
Y
Y
Y
Y
Y
Y
Y
HPI
Y
Y
Y
Y
EDMA3TC's (EDMA3TC2/TC1/TC0)
Y
Y
Y
Y
C64x+ CFG
–
–
Y
Y
(1)
All the peripherals/modules that support a connection to SCR2, SCR4, SCR6, SCR7, and SCR8 have access to all peripherals/modules
connected to those respective SCRs.
4.1 System Interconnect Block Diagram
Figure 4-1 displays the C6421 system interconnect block diagram. The following is a list that helps in the
interpretation of this diagram:
• The direction of the arrows indicates either a bus master or bus slave.
• The arrow originates at a bus master and terminates at a bus slave.
• The direction of the arrows does not indicate the direction of data flow. Data flow is typically
bi-directional for each of the documented bus paths.
• The pattern of each arrow's line indicates the clock rate at which it is operating— i.e., either DSP/3,
DSP/6, or MXI/CLKIN clock rate.
• A peripheral may have multiple instances shown in Figure 4-1 for the following reason:
– The peripheral/module has master port(s) for data transfers, as well as slave port(s) for register
access, data access, and/or memory access. Examples of these peripherals are C64x+
Megamodule, EDMA3, VLYNQ, HPI, and EMAC.
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32
32
EMAC
SCR 5
32
Bridge 8
EMAC Control
Module Reg
SCR 6
EDMA3TC0
EDMA3TC1
EDMA3TC2
Write
64
Read
64
Write
Read
64
64
Write
64
SCR 1
32
32
64
Bridge 4
32
PWM2
MDIO
32
GPIO
32
Timer0
Timer1
Timer2
System Reg
PSC
32
Bridge 3
32
32
32
64
PWM1
SCR 2
32
32
32
Bridge 5
32
EMAC Control
Module RAM
32
64
PWM0
EMAC Reg
32
64
32
HPI
32
64x+
L2/L1
32
Read
UART0
I2C
32
64
32
32
Bridge 2 64
32
HPI
32
DDR2 Memory
Controller
(Memory/Register)
64
SDMA
VLYNQ
MXI/CLKIN Clock Rate
32
DSP/6 Clock Rate
DSP/6 Clock Rate
Bridge 6
PLLC1
32
32
SCR 3
32
PLLC2
32
L2 Cache
MDMA
64
CFG
EDMA3CC
32
32
EMIFA
SCR 7
32
VLYNQ
SCR 4
32
EDMA3TC0
64x+
32
EDMA3TC1
32
EDMA3TC2
SCR 8
32
McBSP0
McASP0
DSP/3 Clock Rate
DSP/3 Clock Rate
DSP/6 Clock Rate
MXI/CLKIN Clock Rate
Figure 4-1. System Interconnect Block Diagram
108
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5 Device Operating Conditions
5.1 Absolute Maximum Ratings Over Operating Temperature Range (Unless Otherwise
Noted) (1)
Supply voltage ranges:
Core (CVDD) (2)
I/O, 3.3V (DVDD33)
Input voltage ranges:
Output voltage ranges:
–0.5 V to 1.5 V
(2)
–0.5 V to 4.2 V
I/O, 1.8V (DVDDR2, DDR_VDDDLL, PLLPWR18, MXVDD) (2)
–0.5 V to 2.5 V
VI I/O, 3.3-V pins
–0.5 V to 4.2 V
VI I/O, 1.8 V
–0.5 V to 2.5 V
VO I/O, 3.3-V pins
–0.5 V to 4.2 V
VO I/O, 1.8 V
–0.5 V to 2.5 V
Operating Junction temperature
ranges, TJ:
Commercial
Automotive (Q or S suffix)
–40C to 125C
Storage temperature range, Tstg
(default)
–65C to 150C
(1)
(2)
0C to 90C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to VSS.
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5.2 Recommended Operating Conditions (1)
CVDD
MIN
NOM
MAX
UNIT
1.14
1.2
1.26
V
1.0
1.05
1.1
V
Supply voltage, I/O, 3.3V (DVDD33)
2.97
3.3
3.63
V
Supply voltage, I/O, 1.8V (DVDDR2, DDR_VDDDLL, PLLPWR18, MXVDD (3))
1.71
1.8
1.89
V
0
0
0
V
0.49DVDDR2
0.5DVDDR2
0.51DVDDR2
V
Supply voltage, Core (CVDD)
DVDD
(2)
(-7/-6/-5/-4/-Q6/-Q5/-Q4 devices)
(-7/-6/-5/-4/-L/-Q5 devices)
VSS
Supply ground (VSS, DDR_VSSDLL, MXVSS (4))
DDR_VREF
DDR2 reference voltage (5)
DDR_ZP
DDR2 impedance control, connected via 200 Ω resistor to VSS
DDR_ZN
DDR2 impedance control, connected via 200 Ω resistor to DVDDR2
High-level input voltage, 3.3V (except I2C pins)
VIH
High-level input voltage, I2C
Low-level input voltage, I2C
Operating Junction temperature (6) (7)
Operating Ambient Temperature (7)
TA
DSP Operating Frequency
(SYSCLK1),
CVDD = 1.2 V
FSYSCLK1
(2)
DSP Operating Frequency
(SYSCLK1),
CVDD = 1.05 V
(1)
(2)
(3)
(4)
(5)
(6)
(7)
110
V
V
0.7DVDD33
Low-level input voltage, MXI/ CLKIN
TJ
V
DVDDR2
2
Low-level input voltage, 3.3V (except I2C pins)
VIL
VSS
0.8
V
0.35MXV
V
0
0.3DVDD33
V
0
90
C
–40
125
C
0
70
C
-40
85
C
-7 devices
700
MHz
-6/-Q6 devices
600
MHz
-5/-Q5 devices
500
MHz
-4/-Q4 devices
400
MHz
-7 devices
560
MHz
-6 devices
450
MHz
-5/-Q5/-L devices
400
MHz
-4 devices
350
MHz
Commercial
Automotive (Q or S suffix)
Commercial
Automotive (Q or S suffix)
The actual voltage must be determined at device power-up, and not be changed dynamically during run-time.
Applies to "tape and reel" part number counterparts as well. For more information, see Section 2.7, Device and Development-Support
Tool Nomenclature.
Oscillator 1.8 V power supply (MXVDD) can be connected to the same 1.8 V power supply as DVDDR2.
Oscillator ground (MXVSS) must be kept separate from other grounds and connected directly to the crystal load capacitor ground.
DDR_VREF is expected to equal 0.5DVDDR2 of the transmitting device and to track variations in the DVDDR2.
In the absence of a heat sink or direct thermal attachment on the top of the device, use the following formula to determine the device
junction temperature: TJ = TC + (Power x PsiJT). Power and TC can be measured by the user. Section 7.1, Thermal Data for ZWT and
Section 7.1.1, Thermal Data for ZDU provide the junction-to-package top (PSIJT) value based on airflow in the system. In the presence
of a heat sink or direct thermal attachment on the top of the device, additional calculations and considerations must be taken into
account. For more detailed information on thermal considerations, measurements, and calculations, see the Thermal Considerations for
the DM64xx, DM64x, and C6000 Devices Application Report (literature number SPRAAL9).
Applications must meet both the Operating Junction Temperature and Operating Ambient Temperature requirements. For more detailed
information on thermal considerations, measurements, and calculations, see the Thermal Considerations for the DM64xx, DM64x, and
C6000 Devices Application Report (literature number SPRAAL9).
Device Operating Conditions
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5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted)
PARAMETER
VOH
VOL
DVDD33 = MIN, IOH = MAX
Low-level output voltage (3.3V I/O except
I2C pins)
DVDD33 = MIN, IOL = MAX
Low-level output voltage (3.3V I/O I2C
pins)
IO = 3 mA
Input current [DC] (except I2C capable
pins)
II (2)
TEST CONDITIONS
High-level output voltage (3.3V I/O except
I2C pins)
Input current [DC] (I2C)
(1)
VI = VSS to DVDD33 with internal pullup resistor
MIN
TYP
2.4
0
(3)
VI = VSS to DVDD33 with opposing internal pulldown
resistor (3)
High-level output current [DC]
ICDD
IDDD
(1)
(2)
(3)
(4)
(5)
I/O Off-state output current
Core (CVDD, VDDA_1P1V) supply current (5)
3.3V I/O (DVDD33) supply current (5)
0.4
V
250
µA
–250
–100
–50
µA
±10
µA
-8
mA
–13.4
mA
-4
mA
8
mA
13.4
mA
4
mA
50
µA
VI = VSS to DVDD33
DDR2
DDR2
All other peripherals
IOZ (4)
V
100
CLK_OUT0/PWM2/GPIO[84] and
VLYNQ_CLOCK/GP[57]
Low-level output current [DC]
0.4
50
All other peripherals
IOL
UNIT
V
CLK_OUT0/PWM2/GPIO[84] and
VLYNQ_CLOCK/GP[57]
IOH
MAX
VO = DVDD33 or VSS; internal pull disabled
±100
µA
CVDD = 1.2 V, DSP clock = 700 MHz
597
mA
CVDD = 1.2 V, DSP clock = 600 MHz
524
mA
CVDD = 1.2 V, DSP clock = 500 MHz
460
mA
CVDD = 1.2 V, DSP clock = 400 MHz
392
mA
CVDD = 1.05 V, DSP clock = 560 MHz
442
mA
CVDD = 1.05 V, DSP clock = 450 MHz
372
mA
CVDD = 1.05 V, DSP clock = 400 MHz
341
mA
DVDD = 3.3 V, CVDD = 1.2 V, DSP clock = 700 MHz
13
mA
DVDD = 3.3 V, CVDD = 1.2 V, DSP clock = 600 MHz
13
mA
DVDD = 3.3 V, CVDD = 1.2 V, DSP clock = 500 MHz
13
mA
DVDD = 3.3 V, CVDD = 1.2 V, DSP clock = 400 MHz
13
mA
DVDD = 3.3 V, CVDD = 1.05 V, DSP clock = 560
MHz
13
mA
DVDD = 3.3 V, CVDD = 1.05 V, DSP clock = 450
MHz
13
mA
DVDD = 3.3 V, CVDD = 1.05 V, DSP clock = 400
MHz
13
mA
VO = DVDD33 or VSS; internal pull enabled
For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
II applies to input-only pins and bi-directional pins. For input-only pins, II indicates the input leakage current. For bi-directional pins, II
indicates the input leakage current and off-state (Hi-Z) output leakage current.
Applies only to pins with an internal pullup (IPU) or pulldown (IPD) resistor.
IOZ applies to output-only pins, indicating off-state (Hi-Z) output leakage current.
Measured under the following conditions: 60% DSP CPU utilization doing typical activity (peripheral configurations, other housekeeping
activities); DDR2 Memory Controller at 50% utilization (135 MHz), 50% writes, 32 bits, 50% bit switching; 2 MHz McBSP0 at 100%
utilization and 50% switching; Timer0 at 100% utilization. At room temperature (25 C) for typical process ZWT devices. The actual
current draw varies across manufacturing processes and is highly application-dependent. C642x devices are offered in two basic
options: lower-power option and high-performance option. Low-power devices offer lower power consumption across temperature and
voltage when compared with high-performance devices. However, high-performance devices offer higher operating speeds. For more
details on core and I/O activity, as well as information relevant to board power supply design, see the TMS320C642x Power
Consumption Summary Application Report (literature number SPRAAO9).
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Temperature
(Unless Otherwise Noted) (continued)
PARAMETER
IDDD
1.8V I/O (DVDDR2, DDR_VDDDLL,
PLLVPRW18, VDDA_1P8V, MXVDD) supply
current (5)
TEST CONDITIONS
(1)
MIN
TYP
MAX
UNIT
DVDD = 1.8 V, CVDD = 1.2 V, DSP clock = 700 MHz
94
mA
DVDD = 1.8 V, CVDD = 1.2 V, DSP clock = 600 MHz
93
mA
DVDD = 1.8 V, CVDD = 1.2 V, DSP clock = 500 MHz
92
mA
DVDD = 1.8 V, CVDD = 1.2 V, DSP clock = 400 MHz
91
mA
DVDD = 1.8 V, CVDD = 1.05 V, DSP clock = 560
MHz
74
mA
DVDD = 1.8 V, CVDD = 1.05 V, DSP clock = 450
MHz
73
mA
DVDD = 1.8 V, CVDD = 1.05 V, DSP clock = 400
MHz
72
mA
CI
Input capacitance
5
pF
Co
Output capacitance
5
pF
112
Device Operating Conditions
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6 Peripheral Information and Electrical Specifications
6.1 Parameter Information
Tester Pin Electronics
42 Ω
Data Sheet Timing Reference Point
Output
Under
Test
3.5 nH
Transmission Line
Z0 = 50 Ω
(see Note)
4.0 pF
Device Pin
(see Note)
1.85 pF
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must
be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line effect. The transmission
line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 6-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
6.1.1
3.3-V Signal Transition Levels
All input and output timing parameters are referenced to Vref for both "0" and "1" logic levels. For 3.3 V I/O,
Vref = 1.5 V. For 1.8 V I/O, Vref = 0.9 V.
Vref
Figure 6-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOLMAX and VOH MIN for output clocks.
Vref = VIH MIN (or VOH MIN)
Vref = VIL MAX (or VOL MAX)
Figure 6-3. Rise and Fall Transition Time Voltage Reference Levels
6.1.2
3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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6.1.3
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Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For the DDR2 memory controller interface, it is not necessary to use the IBIS models to analyze timing
characteristics. TI provides a PCB routing rules solution that describes the routing rules to ensure the
DDR2 memory controller interface timings are met. See the Implementing DDR2 PCB Layout on the
TMS320C6421/4 DMSoC Application Report (literature number SPRAAL7).
6.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
6.3 Power Supplies
For more information regarding TI's power management products and suggested devices to power TI
DSPs, visit www.ti.com/dsppower.
6.3.1
Power-Supply Sequencing
The C6421 includes one core supply (CVDD), and two I/O supplies—DVDD33 and DVDDR2. To ensure
proper device operation, a specific power-up sequence must be followed. Some TI power-supply devices
include features that facilitate power sequencing—for example, Auto-Track and Slow-Start/Enable
features. For more information on TI power supplies and their features, visit www.ti.com/dsppower.
Here is a summary of the power sequencing requirements:
• The power ramp order must be DVDD33 before DVDDR2, and DVDDR2 before CVDD—meaning during
power up, the voltage at the DVDDR2 rail should never exceed the voltage at the DVDD33 rail. Similarly,
the voltage at the CVDD rail should never exceed the voltage at the DVDDR2 rail.
• From the time that power ramp begins, all power supplies (DVDD33, DVDDR2, CVDD) must be stable
within 200 ms. The term "stable" means reaching the recommended operating condition (see
Section 5.2, Recommended Operating Conditions table).
6.3.2
Power-Supply Design Considerations
Core and I/O supply voltage regulators should be located close to the DSP to minimize inductance and
resistance in the power delivery path. Additionally, when designing for high-performance applications
utilizing the C6421 device, the PC board should include separate power planes for core, I/O, and ground;
all bypassed with high-quality low-ESL/ESR capacitors.
6.3.3
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a
yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling
capacitors, therefore physically smaller capacitors should be used while maintaining the largest available
capacitance value.
Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order
of 100 µF) should be furthest away, but still as close as possible. Large caps for each supply should be
placed outside of the BGA footprint.
114
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As with the selection of any component, verification of capacitor availability over the product's production
lifetime should be considered.
For more details on capacitor usage and placement, see the Implementing DDR2 PCB Layout on the
TMS320C642x Application Report (literature number SPRAAK5).
6.3.4
C6421 Power and Clock Domains
The C6421 includes one single power domain — the "Always On" power domain. The "Always On" power
domain is always on when the chip is on. The "Always On" domain is powered by the CVDD pins of the
C6421. All C6421 modules lie within the "Always On" power domain. Table 6-1 provides a listing of the
C6421 clock domains.
One primary reference clock is required for the C6421 device. It can be either a crystal input or driven by
external oscillators. A 15–30-MHz crystal is recommended for the PLLs, which generate the internal clocks
for the digital signal processor (DSP), peripherals, and the EDMA3. For further description of the C6421
clock domains, see Table 6-2 and Figure 6-4.
The C6421 architecture is divided into the power and clock domains shown in Table 6-1. Table 6-2 and
Table 6-3further discuss the clock domains and their ratios. Figure 6-4 shows the clock domain block
diagram.
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Table 6-1. C6421 Power and Clock Domains
Power Domain
Clock Domain
Peripheral/Module
Always On
CLKIN
UART0
Always On
CLKIN
I2C
Always On
CLKIN
Timer0
Always On
CLKIN
Timer1
Always On
CLKIN
Timer2
Always On
CLKIN
PWM0
Always On
CLKIN
PWM1
Always On
CLKIN
PWM2
Always On
CLKDIV3
DDR2
Always On
CLKDIV3
EDMA
Always On
CLKDIV3
SCR
Always On
CLKDIV6
GPSC
Always On
CLKDIV6
LPSCs
Always On
CLKDIV6
PLLC1
Always On
CLKDIV6
PLLC2
Always On
CLKDIV6
Ice Pick
Always On
CLKDIV6
EMIFA
Always On
CLKDIV6
HPI
Always On
CLKDIV6
VLYNQ
Always On
CLKDIV6
EMAC
Always On
CLKDIV6
McASP0
Always On
CLKDIV6
McBSP0
Always On
CLKDIV6
GPIO
Always On
CLKDIV1
C64x+ CPU
Table 6-2. C6421 Clock Domains
CLOCK DOMAIN
DOMAIN CLOCK
SOURCE
CLKIN
PLLC1 AUXCLK (1)
–
25 MHz
DSP
CLKDIV1
PLLC1 SYSCLK1
1:1
600 MHz
EDMA3
CLKDIV3
PLLC1 SYSCLK2
1:3
200 MHz
Peripherals (CLKDIV3 Domain)
CLKDIV3
PLLC1 SYSCLK2
1:3
200 MHz
Peripherals (CLKDIV6 Domain)
CLKDIV6
PLLC1 SYSCLK3
1:6
100 MHz
SUBSYSTEM
Peripherals (CLKIN Domain)
(1)
116
FIXED RATIO vs.
SYSCLK1 FREQUENCY
EXAMPLE
FREQUENCY (MHz)
PLLC1 AUXCLK runs at exactly the same frequency as the device clock source from the MXI/CLKIN pin.
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The CLKDIV1:CLKDIV3:CLKDIV6 ratio must be strictly followed by programming the PLL Controller 1
(PLLC1) PLLDIV1, PLLDIV2, and PLLDIV3 registers appropriately (see Table 6-3).
Table 6-3. PLLC1 Programming for CLKDIV1, CLKDIV3, CLKDIV6 Domains
CLKDIV1 DOMAIN
(SYSCLK1)
CLKDIV3 DOMAIN
(SYSCLK2)
CLKDIV6 DOMAIN
(SYSCLK3)
PLL1
Divide-Down
PLLDIV1.RATIO
PLL1
Divide-Down
PLLDIV2.RATIO
PLL1
Divide-Down
DIV1
/1
0
/3
2
/6
5
DIV2
/2
1
/6
5
/12
11
DIV3
/3
2
/9
8
/18
17
PLLDIV3.RATIO
UART0
AUXCLK
MXI/CLKIN
(15−30 MHz)
I2C
PWMs (x3)
OBSCLK
(CLKOUT0 Pin)
OSCDIV1 (/1)
PLLDIV1 (/1)
PLLDIV3 (/6)
SYSCLK1
Timers (x3)
DSP Subsystem
SYSCLK3
HPI
SYSCLK2
PLLDIV2 (/3)
PLL Controller 1
SCR
VLYNQ
EDMA
EMAC
EMIFA
McASP0
PLLDIV1 (/2)
DDR2 PHY
BPDIV
DDR2 VTP
McBSP0
PLL Controller 2
DDR2 Mem Ctlr
GPIO
Figure 6-4. PLL1 and PLL2 Clock Domain Block Diagram
For further detail on PLL1 and PLL2, see the structure block diagrams Figure 6-5 and Figure 6-6,
respectively.
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CLKMODE
PLLEN
PLLOUT
CLKIN
1
PLL
OSCIN
1
PLLDIV1 (/1)
SYSCLK1
(CLKDIV1 Domain)
0
PLLDIV2 (/3)
SYSCLK2
(CLKDIV3 Domain)
PLLDIV3 (/6)
SYSCLK3
(CLKDIV6 Domain)
0
PLLM
AUXCLK
(CLKIN Domain)
OBSCLK
(CLKOUT0 Pin)
OSCDIV1
Figure 6-5. PLL1 Structure Block Diagram
CLKMODE
PLLEN
CLKIN
PLLOUT
1
PLL
OSCIN
1
0
PLLDIV1 (/2)
0
PLL2_SYSCLK1
(DDR2 PHY)
PLLM
BPDIV
PLL2_SYSCLKBP
(DDR2 VTP)
Figure 6-6. PLL2 Structure Block Diagram
6.3.5
Power and Sleep Controller (PSC)
The Power and Sleep Controller (PSC) controls power by turning off unused power domains or by gating
off clocks to individual peripherals/modules. The C6421 device only utilizes the clock gating feature of the
PSC for power savings. The PSC consists of a Global PSC (GPSC) and a set of Local PSCs (LPSCs).
The GPSC contains memory mapped registers, PSC interrupt control, and a state machine for each
peripheral/module. An LPSC is associated with each peripheral/module and provides clock and reset
control. The LPSCs for C6421 are shown in Table 6-4. The PSC Register memory map is given in
Table 6-5. For more details on the PSC, see the TMS320C642x Power and Sleep Controller (PSC)
Reference Guide (literature number SPRUEN8).
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Table 6-4. C6421 LPSC Assignments
LPSC
Number
Peripheral/Module
LPSC
Number
Peripheral/Module
LPSC
Number
Peripheral/Module
0
Reserved
14
EMIFA
28
TIMER1
1
Reserved
15
Reserved
29
Reserved
2
EDMACC
16
McBSP0
30
Reserved
3
EDMATC0
17
Reserved
31
Reserved
4
EDMATC1
18
I2C
32
Reserved
5
EDMATC2
19
UART0
33
Reserved
6
EMAC Memory Controller
20
Reserved
34
Reserved
7
MDIO
21
Reserved
35
Reserved
8
EMAC
22
Reserved
36
Reserved
9
McASP0
23
PWM0
37
Reserved
10
Reserved
24
PWM1
38
Reserved
11
VLYNQ
25
PWM2
39
C64x+ CPU
12
HPI
26
GPIO
40
Reserved
13
DDR2 Memory Controller
27
TIMER0
Table 6-5. PSC Register Memory Map
HEX ADDRESS RANGE
0x01C4 1000
REGISTER
ACRONYM
PID
DESCRIPTION
Peripheral Revision and Class Information Register
0x01C4 1004 - 0x01C4 100F
-
Reserved
0x01C4 1010
-
Reserved
0x01C4 1014
-
Reserved
0x01C4 1018
INTEVAL
0x01C4 101C - 0x01C4 103F
Interrupt Evaluation Register
-
Reserved
0x01C4 1040
-
Reserved
0x01C4 1044
MERRPR1
0x01C4 1048 - 0x01C4 104F
Module Error Pending 1 (mod 32- 63) Register
-
Reserved
0x01C4 1050
-
Reserved
0x01C4 1054
MERRCR1
Module Error Clear 1 (mod 32 - 63) Register
0x01C4 1058 - 0x01C4 105F
-
Reserved
0x01C4 1060
-
Reserved
0x01C4 1064 - 0x01C4 1067
-
Reserved
0x01C4 1068
-
Reserved
0x01C4 106C - 0x01C4 111F
-
Reserved
0x01C4 1120
0x01C4 1124 - 0x01C4 1127
0x01C4 1128
0x01C4 112C - 0x01C4 11FF
0x01C4 1200
0x01C4 1204 - 0x01C4 12FF
0x01C4 1300
PTCMD
PTSTAT
PDSTAT0
PDCTL0
Power Domain Transition Command Register
Reserved
Power Domain Transition Status Register
Reserved
Power Domain Status 0 Register (Always On)
Reserved
Power Domain Control 0 Register (Always On)
0x01C4 1304 - 0x1C4 150F
-
Reserved
0x01C4 1510
-
Reserved
0x01C4 1514
-
Reserved
0x01C4 1518 - 0x01C4 15FF
-
Reserved
0x01C4 1600 - 0x01C4 17FF
-
Reserved
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Table 6-5. PSC Register Memory Map (continued)
HEX ADDRESS RANGE
0x01C4 1800
REGISTER
ACRONYM
DESCRIPTION
-
Reserved
0x01C4 1804
-
Reserved
0x01C4 1808
MDSTAT2
Module Status 2 Register (EDMACC)
0x01C4 180C
MDSTAT3
Module Status 3 Register (EDMATC0)
0x01C4 1810
MDSTAT4
Module Status 4 Register (EDMATC1)
0x01C4 1814
MDSTAT5
Module Status 5 Register (EDMATC2)
0x01C4 1818
MDSTAT6
Module Status 6 Register (EMAC Memory Controller)
0x01C4 181C
MDSTAT7
Module Status 7 Register (MDIO)
0x01C4 1820
MDSTAT8
Module Status 8 Register (EMAC)
0x01C4 1824
MDSTAT9
Module Status 9 Register (McASP0)
0x01C4 1828
-
0x01C4 182C
MDSTAT11
Module Status 11 Register (VLYNQ)
0x01C4 1830
MDSTAT12
Module Status 12 Register (HPI)
0x01C4 1834
MDSTAT13
Module Status 13 Register (DDR2)
0x01C4 1838
MDSTAT14
Module Status 14 Register (EMIFA)
0x01C4 183C
-
0x01C4 1840
MDSTAT16
0x01C4 1844
-
0x01C4 1848
MDSTAT18
Module Status 18 Register (I2C)
0x01C4 184C
MDSTAT19
Module Status 19 Register (UART0)
0x01C4 1850
-
Reserved
0x01C4 1854
-
Reserved
0x01C4 1858
-
Reserved
0x01C4 185C
MDSTAT23
Module Status 23 Register (PWM0)
0x01C4 1860
MDSTAT24
Module Status 24 Register (PWM1)
0x01C4 1864
MDSTAT25
Module Status 25 Register (PWM2)
0x01C4 1868
MDSTAT26
Module Status 26 Register (GPIO)
0x01C4 186C
MDSTAT27
Module Status 27 Register (TIMER0)
0x01C4 1870
MDSTAT28
Module Status 28 Register (TIMER1)
0x01C4 1874 - 0x01C4 189B
-
Reserved
Reserved
Module Status 16 Register (McBSP0)
Reserved
Reserved
0x01C4 189C
MDSTAT39
0x01C4 18A0
-
Reserved
0x01C4 18A4 - 0x01C4 19FF
-
Reserved
0x01C4 1A00
-
Reserved
0x01C4 1A04
-
Reserved
0x01C4 1A08
MDCTL2
Module Control 2 Register (EDMACC)
0x01C4 1A0C
MDCTL3
Module Control 3 Register (EDMATC0)
0x01C4 1A10
MDCTL4
Module Control 4 Register (EDMATC1)
0x01C4 1A14
MDCTL5
Module Control 5 Register (EDMATC2)
0x01C4 1A18
MDCTL6
Module Control 6 Register (EMAC Memory Controller)
0x01C4 1A1C
MDCTL7
Module Control 7 Register (MDIO)
0x01C4 1A20
MDCTL8
Module Control 8 Register (EMAC)
0x01C4 1A24
MDCTL9
Module Control 9 Register (McASP0)
0x01C4 1A28
-
0x01C4 1A2C
MDCTL11
Module Control 11 Register (VLYNQ)
0x01C4 1A30
MDCTL12
Module Control 12 Register (HPI)
120
Module Status 39 Register (C64x+ CPU)
Reserved
Peripheral Information and Electrical Specifications
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Table 6-5. PSC Register Memory Map (continued)
HEX ADDRESS RANGE
REGISTER
ACRONYM
DESCRIPTION
0x01C4 1A34
MDCTL13
Module Control 13 Register (DDR2)
0x01C4 1A38
MDCTL14
Module Control 14 Register (EMIFA)
0x01C4 1A3C
-
0x01C4 1A40
MDCTL16
Reserved
Module Control 16 Register (McBSP0)
0x01C4 1A44
-
0x01C4 1A48
MDCTL18
Module Control 18 Register (I2C)
0x01C4 1A4C
MDCTL19
Module Control 19 Register (UART0)
0x01C4 1A50
-
Reserved
0x01C4 1A54
-
Reserved
0x01C4 1A58
-
Reserved
0x01C4 1A5C
MDCTL23
Module Control 23 Register (PWM0)
0x01C4 1A60
MDCTL24
Module Control 24 Register (PWM1)
0x01C4 1A64
MDCTL25
Module Control 25 Register (PWM2)
0x01C4 1A68
MDCTL26
Module Control 26 Register (GPIO)
0x01C4 1A6C
MDCTL27
Module Control 27 Register (TIMER0)
0x01C4 1A70
MDCTL28
Module Control 28 Register (TIMER1)
0x01C4 1A74 - 0x01C4 1A9B
-
Reserved
Reserved
0x01C4 1A9C
MDCTL39
0x01C4 1AA0
-
Reserved
0x01C4 1AA4 - 0x01C4 1FFF
-
Reserved
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Module Control 39 Register (C64x+ CPU)
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6.4 Enhanced Direct Memory Access (EDMA3) Controller
The EDMA controller handles all data transfers between memories and the device slave peripherals on
the C6421 device. These data transfers include cache servicing, non-cacheable memory accesses,
user-programmed data transfers, and host accesses. These are summarized as follows:
• Transfer to/from on-chip memories
– DSP L1D memory
– DSP L2 memory
• Transfer to/from external storage
– DDR2 SDRAM
– NAND flash
– Asynchronous EMIF (EMIFA)
• Transfer to/from peripherals/hosts
– VLYNQ
– HPI
– McBSP0
– McASP0
– PWM
– UART0
The EDMA supports two addressing modes: constant addressing and increment addressing. On the
C6421, constant addressing mode is not supported by any peripheral or internal memory. For more
information on these two addressing modes, see the TMS320C642x DSP Enhanced DMA (EDMA)
Controller User's Guide (literature number SPRUEM5).
6.4.1
EDMA3 Channel Synchronization Events
The EDMA supports up to 64 EDMA channels which service peripheral devices and external memory.
Table 6-6 lists the source of EDMA synchronization events associated with each of the programmable
EDMA channels. For the C6421 device, the association of an event to a channel is fixed; each of the
EDMA channels has one specific event associated with it. These specific events are captured in the
EDMA event registers (ER, ERH) even if the events are disabled by the EDMA event enable registers
(EER, EERH). For more detailed information on the EDMA module and how EDMA events are enabled,
captured, processed, linked, chained, and cleared, etc., see the TMS320C642x DSP Enhanced DMA
(EDMA) Controller User's Guide (literature number SPRUEM5).
Table 6-6. C6421 EDMA Channel Synchronization Events (1)
EDMA
CHANNEL
(1)
122
EVENT NAME
EVENT DESCRIPTION
0-1
–
Reserved
2
XEVT0
McBSP0 Transmit Event
3
REVT0
McBSP0 Receive Event
4
–
Reserved
5
–
Reserved
6
–
Reserved
7
–
Reserved
8
–
Reserved
9
–
Reserved
10
AXEVTE0
McASP0 Transmit Event Even
11
AXEVTO0
McASP0 Transmit Event Odd
In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320C642x DSP Enhanced
DMA (EDMA) Controller User's Guide (literature number SPRUEM5).
Peripheral Information and Electrical Specifications
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Table 6-6. C6421 EDMA Channel Synchronization Events (continued)
EDMA
CHANNEL
EVENT NAME
EVENT DESCRIPTION
12
AXEVT0
McASP0 Transmit Event
13
AREVTE0
McASP0 Receive Event Even
14
AREVTO0
McASP0 Receive Event Odd
15
AREVT0
McASP0 Receive Event
16-21
–
Reserved
22
URXEVT0
UART 0 Receive Event
23
UTXEVT0
UART 0 Transmit Event
24
–
Reserved
25
–
Reserved
26
–
Reserved
27
–
Reserved
28
ICREVT
I2C Receive Event
29
ICXEVT
I2C Transmit Event
30-31
–
Reserved
32
GPINT0
GPIO 0 Interrupt
33
GPINT1
GPIO 1 Interrupt
34
GPINT2
GPIO 2 Interrupt
35
GPINT3
GPIO 3 Interrupt
36
GPINT4
GPIO 4 Interrupt
37
GPINT5
GPIO 5 Interrupt
38
GPINT6
GPIO 6 Interrupt
39
GPINT7
GPIO 7 Interrupt
40
GPBNKINT0
GPIO Bank 0 Interrupt
41
GPBNKINT1
GPIO Bank 1 Interrupt
42
GPBNKINT2
GPIO Bank 2 Interrupt
43
GPBNKINT3
GPIO Bank 3 Interrupt
44
GPBNKINT4
GPIO Bank 4 Interrupt
45
GPBNKINT5
GPIO Bank 5 Interrupt
46
GPBNKINT6
GPIO Bank 6 Interrupt
47
–
Reserved
48
TEVTL0
Timer 0 Event Low Interrupt
49
TEVTH0
Timer 0 Event High Interrupt
50
TEVTL1
Timer 1 Event Low Interrupt
51
TEVTH1
Timer 1 Event High Interrupt
52
PWM0
PWM 0 Event
53
PWM1
PWM 1 Event
54
PWM2
PWM 2 Event
55-63
–
Reserved
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6.4.2
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EDMA Peripheral Register Description(s)
Table 6-7 lists the EDMA registers, their corresponding acronyms, and C6421 device memory locations.
Table 6-7. C6421 EDMA Registers
HEX ADDRESS
ACRONYM
REGISTER NAME
Channel Controller Registers
0x01C0 0000 - 0x01C0 0003
0x01C0 0004
Reserved
CCCFG
0x01C0 0008 - 0x01C0 01FF
EDMA3CC Configuration Register
Reserved
Global Registers
124
0x01C0 0200
QCHMAP0
QDMA Channel 0 Mapping to PaRAM Register
0x01C0 0204
QCHMAP1
QDMA Channel 1 Mapping to PaRAM Register
0x01C0 0208
QCHMAP2
QDMA Channel 2 Mapping to PaRAM Register
0x01C0 020C
QCHMAP3
QDMA Channel 3 Mapping to PaRAM Register
0x01C0 0210
QCHMAP4
QDMA Channel 4 Mapping to PaRAM Register
0x01C0 0214
QCHMAP5
QDMA Channel 5 Mapping to PaRAM Register
0x01C0 0218
QCHMAP6
QDMA Channel 6 Mapping to PaRAM Register
0x01C0 021C
QCHMAP7
QDMA Channel 7 Mapping to PaRAM Register
0x01C0 0240
DMAQNUM0
DMA Queue Number Register 0 (Channels 00 to 07)
0x01C0 0244
DMAQNUM1
DMA Queue Number Register 1 (Channels 08 to 15)
0x01C0 0248
DMAQNUM2
DMA Queue Number Register 2 (Channels 16 to 23)
0x01C0 024C
DMAQNUM3
DMA Queue Number Register 3 (Channels 24 to 31)
0x01C0 0250
DMAQNUM4
DMA Queue Number Register 4 (Channels 32 to 39)
0x01C0 0254
DMAQNUM5
DMA Queue Number Register 5 (Channels 40 to 47)
0x01C0 0258
DMAQNUM6
DMA Queue Number Register 6 (Channels 48 to 55)
0x01C0 025C
DMAQNUM7
DMA Queue Number Register 7 (Channels 56 to 63)
0x01C0 0260
QDMAQNUM
CC QDMA Queue Number
0x01C0 0264 - 0x01C0 0283
–
0x01C0 0284
QUEPRI
Reserved
Queue Priority Register
0x01C0 0288 - 0x01C0 02FF
–
0x01C0 0300
EMR
Reserved
0x01C0 0304
EMRH
Event Missed Register High
Event Missed Clear Register
Event Missed Register
0x01C0 0308
EMCR
0x01C0 030C
EMCRH
0x01C0 0310
QEMR
0x01C0 0314
QEMCR
QDMA Event Missed Clear Register
0x01C0 0318
CCERR
EDMA3CC Error Register
0x01C0 031C
CCERRCLR
0x01C0 0320
EEVAL
Error Evaluate Register
0x01C0 0340
DRAE0
DMA Region Access Enable Register for Region 0
0x01C0 0344
DRAEH0
0x01C0 0348
DRAE1
0x01C0 034C
DRAEH1
0x01C0 0350
–
Reserved
0x01C0 0354
–
Reserved
Event Missed Clear Register High
QDMA Event Missed Register
EDMA3CC Error Clear Register
DMA Region Access Enable Register High for Region 0
DMA Region Access Enable Register for Region 1
DMA Region Access Enable Register High for Region 1
0x01C0 0358
–
Reserved
0x01C0 035C
–
Reserved
0x01C0 0360 - 0x01C0 037C
–
Reserved
0x01C0 0380
QRAE0
Peripheral Information and Electrical Specifications
QDMA Region Access Enable Register for Region 0
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C0 0384
QRAE1
REGISTER NAME
0x01C0 0388
–
Reserved
QDMA Region Access Enable Register for Region 1
0x01C0 038C
–
Reserved
0x01C0 0390 - 0x01C0 039C
–
Reserved
0x01C0 0400
Q0E0
Event Q0 Entry 0 Register
0x01C0 0404
Q0E1
Event Q0 Entry 1 Register
0x01C0 0408
Q0E2
Event Q0 Entry 2 Register
0x01C0 040C
Q0E3
Event Q0 Entry 3 Register
0x01C0 0410
Q0E4
Event Q0 Entry 4 Register
0x01C0 0414
Q0E5
Event Q0 Entry 5 Register
0x01C0 0418
Q0E6
Event Q0 Entry 6 Register
0x01C0 041C
Q0E7
Event Q0 Entry 7 Register
0x01C0 0420
Q0E8
Event Q0 Entry 8 Register
0x01C0 0424
Q0E9
Event Q0 Entry 9 Register
0x01C0 0428
Q0E10
Event Q0 Entry 10 Register
0x01C0 042C
Q0E11
Event Q0 Entry 11 Register
0x01C0 0430
Q0E12
Event Q0 Entry 12 Register
0x01C0 0434
Q0E13
Event Q0 Entry 13 Register
0x01C0 0438
Q0E14
Event Q0 Entry 14 Register
0x01C0 043C
Q0E15
Event Q0 Entry 15 Register
0x01C0 0440
Q1E0
Event Q1 Entry 0 Register
0x01C0 0444
Q1E1
Event Q1 Entry 1 Register
0x01C0 0448
Q1E2
Event Q1 Entry 2 Register
0x01C0 044C
Q1E3
Event Q1 Entry 3 Register
0x01C0 0450
Q1E4
Event Q1 Entry 4 Register
0x01C0 0454
Q1E5
Event Q1 Entry 5 Register
0x01C0 0458
Q1E6
Event Q1 Entry 6 Register
0x01C0 045C
Q1E7
Event Q1 Entry 7 Register
0x01C0 0460
Q1E8
Event Q1 Entry 8 Register
0x01C0 0464
Q1E9
Event Q1 Entry 9 Register
0x01C0 0468
Q1E10
Event Q1 Entry 10 Register
0x01C0 046C
Q1E11
Event Q1 Entry 11 Register
0x01C0 0470
Q1E12
Event Q1 Entry 12 Register
0x01C0 0474
Q1E13
Event Q1 Entry 13 Register
0x01C0 0478
Q1E14
Event Q1 Entry 14 Register
0x01C0 047C
Q1E15
Event Q1 Entry 15 Register
0x01C0 0480
Q2E0
Event Q2 Entry 0 Register
0x01C0 0484
Q2E1
Event Q2 Entry 1 Register
0x01C0 0488
Q2E2
Event Q2 Entry 2 Register
0x01C0 048C
Q2E3
Event Q2 Entry 3 Register
0x01C0 0490
Q2E4
Event Q2 Entry 4 Register
0x01C0 0494
Q2E5
Event Q2 Entry 5 Register
0x01C0 0498
Q2E6
Event Q2 Entry 6 Register
0x01C0 049C
Q2E7
Event Q2 Entry 7 Register
0x01C0 04A0
Q2E8
Event Q2 Entry 8 Register
0x01C0 04A4
Q2E9
Event Q2 Entry 9 Register
0x01C0 04A8
Q2E10
Event Q2 Entry 10 Register
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C0 04AC
Q2E11
Event Q2 Entry 11 Register
0x01C0 04B0
Q2E12
Event Q2 Entry 12 Register
0x01C0 04B4
Q2E13
Event Q2 Entry 13 Register
0x01C0 04B8
Q2E14
Event Q2 Entry 14 Register
0x01C0 04BC
Q2E15
Event Q2 Entry 15 Register
0x01C0 04C0 - 0x01C0 05FF
Reserved
0x01C0 0600
QSTAT0
Queue 0 Status Register
0x01C0 0604
QSTAT1
Queue 1 Status Register
0x01C0 0608
QSTAT2
Queue 2 Status Register
0x01C0 060C - 0x01C0 061F
Reserved
0x01C0 0620
QWMTHRA
0x01C0 0624
–
0x01C0 0640
CCSTAT
0x01C0 0644 - 0x01C0 0FFF
126
REGISTER NAME
Peripheral Information and Electrical Specifications
Queue Watermark Threshold A Register for Q[2:0]
Reserved
EDMA3CC Status Register
Reserved
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
REGISTER NAME
Global Channel Registers
0x01C0 1000
ER
Event Register
0x01C0 1004
ERH
Event Register High
0x01C0 1008
ECR
Event Clear Register
0x01C0 100C
ECRH
Event Clear Register High
0x01C0 1010
ESR
0x01C0 1014
ESRH
Event Set Register
Event Set Register High
0x01C0 1018
CER
Chained Event Register
0x01C0 101C
CERH
Chained Event Register High
0x01C0 1020
EER
0x01C0 1024
EERH
Event Enable Register
Event Enable Register High
0x01C0 1028
EECR
Event Enable Clear Register
0x01C0 102C
EECRH
0x01C0 1030
EESR
0x01C0 1034
EESRH
Event Enable Clear Register High
Event Enable Set Register
Event Enable Set Register High
0x01C0 1038
SER
0x01C0 103C
SERH
Secondary Event Register High
0x01C0 1040
SECR
Secondary Event Clear Register
0x01C0 1044
SECRH
0x01C0 1048 - 0x01C0 104F
Secondary Event Register
Secondary Event Clear Register High
Reserved
0x01C0 1050
IER
0x01C0 1054
IERH
Interrupt Enable Register High
Interrupt Enable Clear Register
0x01C0 1058
IECR
0x01C0 105C
IECRH
0x01C0 1060
IESR
0x01C0 1064
IESRH
0x01C0 1068
IPR
0x01C0 106C
IPRH
0x01C0 1070
ICR
Interrupt Enable Register
Interrupt Enable Clear Register High
Interrupt Enable Set Register
Interrupt Enable Set Register High
Interrupt Pending Register
Interrupt Pending Register High
Interrupt Clear Register
0x01C0 1074
ICRH
Interrupt Clear Register High
0x01C0 1078
IEVAL
Interrupt Evaluate Register
0x01C0 1080
QER
QDMA Event Register
0x01C0 1084
QEER
0x01C0 1088
QEECR
QDMA Event Enable Clear Register
0x01C0 108C
QEESR
QDMA Event Enable Set Register
0x01C0 1090
QSER
QDMA Secondary Event Register
0x01C0 1094
QSECR
0x01C0 1098 - 0x01C0 1FFF
QDMA Event Enable Register
QDMA Secondary Event Clear Register
Reserved
Shadow Region 0 Channel Registers
0x01C0 2000
ER
0x01C0 2004
ERH
Event Register High
0x01C0 2008
ECR
Event Clear Register
0x01C0 200C
ECRH
0x01C0 2010
ESR
0x01C0 2014
ESRH
Event Set Register High
0x01C0 2018
CER
Chained Event Register
0x01C0 201C
CERH
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Event Register
Event Clear Register High
Event Set Register
Chained Event Register High
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C0 2020
EER
REGISTER NAME
0x01C0 2024
EERH
Event Enable Register High
Event Enable Clear Register
Event Enable Register
0x01C0 2028
EECR
0x01C0 202C
EECRH
0x01C0 2030
EESR
0x01C0 2034
EESRH
0x01C0 2038
SER
0x01C0 203C
SERH
Secondary Event Register High
0x01C0 2040
SECR
Secondary Event Clear Register
Event Enable Clear Register High
Event Enable Set Register
Event Enable Set Register High
Secondary Event Register
0x01C0 2044
SECRH
0x01C0 2048 - 0x01C0 204C
-
0x01C0 2050
IER
0x01C0 2054
IERH
Interrupt Enable Register High
0x01C0 2058
IECR
Interrupt Enable Clear Register
0x01C0 205C
IECRH
0x01C0 2060
IESR
0x01C0 2064
IESRH
0x01C0 2068
IPR
0x01C0 206C
IPRH
Secondary Event Clear Register High
Reserved
Interrupt Enable Register
Interrupt Enable Clear Register High
Interrupt Enable Set Register
Interrupt Enable Set Register High
Interrupt Pending Register
Interrupt Pending Register High
0x01C0 2070
ICR
0x01C0 2074
ICRH
Interrupt Clear Register High
0x01C0 2078
IEVAL
Interrupt Evaluate Register
0x01C0 207C
-
0x01C0 2080
QER
0x01C0 2084
QEER
Interrupt Clear Register
Reserved
QDMA Event Register
QDMA Event Enable Register
0x01C0 2088
QEECR
QDMA Event Enable Clear Register
0x01C0 208C
QEESR
QDMA Event Enable Set Register
0x01C0 2090
QSER
QDMA Secondary Event Register
0x01C0 2094
QSECR
0x01C0 2098 - 0x01C0 21FC
-
QDMA Secondary Event Clear Register
Reserved
Shadow Region 1 Channel Registers
128
0x01C0 2200
ER
Event Register
0x01C0 2204
ERH
Event Register High
0x01C0 2208
ECR
Event Clear Register
0x01C0 220C
ECRH
Event Clear Register High
0x01C0 2210
ESR
0x01C0 2214
ESRH
Event Set Register
Event Set Register High
0x01C0 2218
CER
Chained Event Register
0x01C0 221C
CERH
Chained Event Register High
0x01C0 2220
EER
0x01C0 2224
EERH
Event Enable Register High
0x01C0 2228
EECR
Event Enable Clear Register
0x01C0 222C
EECRH
0x01C0 2230
EESR
0x01C0 2234
EESRH
0x01C0 2238
SER
0x01C0 223C
SERH
Peripheral Information and Electrical Specifications
Event Enable Register
Event Enable Clear Register High
Event Enable Set Register
Event Enable Set Register High
Secondary Event Register
Secondary Event Register High
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C0 2240
SECR
0x01C0 2244
SECRH
REGISTER NAME
Secondary Event Clear Register
Secondary Event Clear Register High
0x01C0 2248 - 0x01C0 224C
-
0x01C0 2250
IER
Reserved
0x01C0 2254
IERH
Interrupt Enable Register High
Interrupt Enable Clear Register
0x01C0 2258
IECR
0x01C0 225C
IECRH
0x01C0 2260
IESR
0x01C0 2264
IESRH
0x01C0 2268
IPR
0x01C0 226C
IPRH
0x01C0 2270
ICR
Interrupt Enable Register
Interrupt Enable Clear Register High
Interrupt Enable Set Register
Interrupt Enable Set Register High
Interrupt Pending Register
Interrupt Pending Register High
Interrupt Clear Register
0x01C0 2274
ICRH
Interrupt Clear Register High
0x01C0 2278
IEVAL
Interrupt Evaluate Register
0x01C0 227C
-
Reserved
0x01C0 2280
QER
0x01C0 2284
QEER
QDMA Event Register
0x01C0 2288
QEECR
QDMA Event Enable Clear Register
0x01C0 228C
QEESR
QDMA Event Enable Set Register
0x01C0 2290
QSER
QDMA Secondary Event Register
0x01C0 2294
QSECR
0x01C0 2298 - 0x01C0 23FC
-
Reserved
0x01C0 2400 - 0x01C0 25FC
-
Reserved
0x01C0 2600 - 0x01C0 27FC
-
Reserved
0x01C0 2800 - 0x01C0 29FC
-
Reserved
QDMA Event Enable Register
QDMA Secondary Event Clear Register
0x01C0 2A00 - 0x01C0 2BFC
-
Reserved
0x01C0 2C00 - 0x01C0 2DFC
-
Reserved
0x01C0 2E00 - 0x01C0 2FFC
-
Reserved
0x01C0 2FFD - 0x01C0 3FFF
-
Reserved
0x01C0 4000 - 0x01C0 4FFF
-
Parameter Set RAM (see Table 6-8)
0x01C0 5000 - 0x01C0 7FFF
-
Reserved
0x01C0 8000 - 0x01C0 FFFF
-
Reserved
0x01C1 0000
-
0x01C1 0004
TCCFG
Transfer Controller 0 Registers
Reserved
EDMA3 TC0 Configuration Register
0x01C1 0008 - 0x01C1 00FF
-
0x01C1 0100
TCSTAT
0x01C1 0104 - 0x01C1 0110
-
Reserved
0x01C1 0114 - 0x01C1 011F
-
Reserved
0x01C1 0120
ERRSTAT
EDMA3 TC0 Error Status Register
0x01C1 0124
ERREN
EDMA3 TC0 Error Enable Register
0x01C1 0128
ERRCLR
EDMA3 TC0 Error Clear Register
0x01C1 012C
ERRDET
EDMA3 TC0 Error Details Register
0x01C1 0130
ERRCMD
EDMA3 TC0 Error Interrupt Command Register
0x01C1 0134 - 0x01C1 013F
-
0x01C1 0140
RDRATE
0x01C1 0144 - 0x01C1 01FF
-
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Reserved
EDMA3 TC0 Channel Status Register
Reserved
EDMA3 TC0 Read Command Rate Register
Reserved
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C1 0200 - 0x01C1 023F
-
REGISTER NAME
0x01C1 0240
SAOPT
EDMA3 TC0 Source Active Options Register
0x01C1 0244
SASRC
EDMA3 TC0 Source Active Source Address Register
0x01C1 0248
SACNT
EDMA3 TC0 Source Active Count Register
0x01C1 024C
SADST
EDMA3 TC0 Source Active Destination Address Register
0x01C1 0250
SABIDX
EDMA3 TC0 Active B-Index Register
0x01C1 0254
SAMPPRXY
EDMA3 TC0 Source Active Memory Protection Proxy Register
0x01C1 0258
SACNTRLD
EDMA3 TC0 Source Active Count Reload Register
0x01C1 025C
SASRCBREF
EDMA3 TC0 Source Active Source Address B-Reference Register
EDMA3 TC0 Source Active Destination Address B-Reference Register
Reserved
0x01C1 0260
SADSTBREF
0x01C1 0264 - 0x01C1 027F
-
0x01C1 0280
DFCNTRLD
0x01C1 0284
DFSRCBREF
EDMA3 TC0 Destination FIFO Set Source Address B-Reference Register
0x01C1 0288
DFDSTBREF
EDMA3 TC0 Destination FIFO Set Destination Address B-Reference
Register
Reserved
EDMA3 TC0 Destination FIFO Set Count Reload Register
0x01C1 028C - 0x01C1 02FF
-
0x01C1 0300
DFOPT0
Reserved
EDMA3 TC0 Destination FIFO Options Register 0
0x01C1 0304
DFSRC0
EDMA3 TC0 Destination FIFO Source Address Register 0
0x01C1 0308
DFCNT0
EDMA3 TC0 Destination FIFO Count Register 0
0x01C1 030C
DFDST0
EDMA3 TC0 Destination FIFO Destination Address Register 0
0x01C1 0310
DFBIDX0
EDMA3 TC0 Destination FIFO B-Index Register 0
0x01C1 0314
DFMPPRXY0
EDMA3 TC0 Destination FIFO Memory Protection Proxy Register 0
0x01C1 0318 - 0x01C1 033F
-
0x01C1 0340
DFOPT1
Reserved
EDMA3 TC0 Destination FIFO Options Register 1
0x01C1 0344
DFSRC1
EDMA3 TC0 Destination FIFO Source Address Register 1
0x01C1 0348
DFCNT1
EDMA3 TC0 Destination FIFO Count Register 1
0x01C1 034C
DFDST1
EDMA3 TC0 Destination FIFO Destination Address Register 1
0x01C1 0350
DFBIDX1
EDMA3 TC0 Destination FIFO B-Index Register 1
0x01C1 0354
DFMPPRXY1
EDMA3 TC0 Destination FIFO Memory Protection Proxy Register 1
0x01C1 0358 - 0x01C1 037F
-
0x01C1 0380
DFOPT2
Reserved
EDMA3 TC0 Destination FIFO Options Register 2
0x01C1 0384
DFSRC2
EDMA3 TC0 Destination FIFO Source Address Register 2
0x01C1 0388
DFCNT2
EDMA3 TC0 Destination FIFO Count Register 2
0x01C1 038C
DFDST2
EDMA3 TC0 Destination FIFO Destination Address Register 2
0x01C1 0390
DFBIDX2
EDMA3 TC0 Destination FIFO B-Index Register 2
0x01C1 0394
DFMPPRXY2
0x01C1 0398 - 0x01C1 03BF
-
EDMA3 TC0 Destination FIFO Memory Protection Proxy Register 2
0x01C1 03C0
DFOPT3
EDMA3 TC0 Destination FIFO Options Register 3
0x01C1 03C4
DFSRC3
EDMA3 TC0 Destination FIFO Source Address Register 3
Reserved
0x01C1 03C8
DFCNT3
EDMA3 TC0 Destination FIFO Count Register 3
0x01C1 03CC
DFDST3
EDMA3 TC0 Destination FIFO Destination Address Register 3
0x01C1 03D0
DFBIDX3
EDMA3 TC0 Destination FIFO B-Index Register 3
0x01C1 03D4
DFMPPRXY3
0x01C1 03D8 - 0x01C1 03FF
-
EDMA3 TC0 Destination FIFO Memory Protection Proxy Register 3
Reserved
Transfer Controller 1 Registers
130
0x01C1 0400
-
0x01C1 0404
TCCFG
Peripheral Information and Electrical Specifications
Reserved
EDMA3 TC1 Configuration Register
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C1 0408 - 0x01C1 04FF
-
0x01C1 0500
TCSTAT
REGISTER NAME
Reserved
EDMA3 TC1 Channel Status Register
0x01C1 0504 - 0x01C1 0510
-
Reserved
0x01C1 0514 - 0x01C1 051F
-
Reserved
0x01C1 0520
ERRSTAT
EDMA3 TC1 Error Status Register
0x01C1 0524
ERREN
EDMA3 TC1 Error Enable Register
0x01C1 0528
ERRCLR
EDMA3 TC1 Error Clear Register
0x01C1 052C
ERRDET
EDMA3 TC1 Error Details Register
0x01C1 0530
ERRCMD
EDMA3 TC1 Error Interrupt Command Register
0x01C1 0534 - 0x01C1 053F
-
0x01C1 0540
RDRATE
Reserved
0x01C1 0544 - 0x01C1 05FF
-
Reserved
0x01C1 0600 - 0x01C1 063F
-
Reserved
0x01C1 0640
SAOPT
EDMA3 TC1 Source Active Options Register
0x01C1 0644
SASRC
EDMA3 TC1 Source Active Source Address Register
EDMA3 TC1 Read Command Rate Register
0x01C1 0648
SACNT
EDMA3 TC1 Source Active Count Register
0x01C1 064C
SADST
EDMA3 TC1 Source Active Destination Address Register
0x01C1 0650
SABIDX
EDMA3 TC1 Active B-Index Register
0x01C1 0654
SAMPPRXY
EDMA3 TC1 Source Active Memory Protection Proxy Register
EDMA3 TC1 Source Active Count Reload Register
0x01C1 0658
SACNTRLD
0x01C1 065C
SASRCBREF
EDMA3 TC1 Source Active Source Address B-Reference Register
0x01C1 0660
SADSTBREF
EDMA3 TC1 Source Active Destination Address B-Reference Register
0x01C1 0664 - 0x01C1 067F
-
0x01C1 0680
DFCNTRLD
Reserved
0x01C1 0684
DFSRCBREF
EDMA3 TC1 Destination FIFO Set Source Address B-Reference Register
0x01C1 0688
DFDSTBREF
EDMA3 TC1 Destination FIFO Set Destination Address B-Reference
Register
EDMA3 TC1 Destination FIFO Set Count Reload Register
0x01C1 068C - 0x01C1 06FF
-
0x01C1 0700
DFOPT0
Reserved
EDMA3 TC1 Destination FIFO Options Register 0
0x01C1 0704
DFSRC0
EDMA3 TC1 Destination FIFO Source Address Register 0
0x01C1 0708
DFCNT0
EDMA3 TC1 Destination FIFO Count Register 0
0x01C1 070C
DFDST0
EDMA3 TC1 Destination FIFO Destination Address Register 0
0x01C1 0710
DFBIDX0
EDMA3 TC1 Destination FIFO B-Index Register 0
0x01C1 0714
DFMPPRXY0
0x01C1 0718 - 0x01C1 073F
-
EDMA3 TC1 Destination FIFO Memory Protection Proxy Register 0
Reserved
0x01C1 0740
DFOPT1
EDMA3 TC1 Destination FIFO Options Register 1
0x01C1 0744
DFSRC1
EDMA3 TC1 Destination FIFO Source Address Register 1
0x01C1 0748
DFCNT1
EDMA3 TC1 Destination FIFO Count Register 1
0x01C1 074C
DFDST1
EDMA3 TC1 Destination FIFO Destination Address Register 1
0x01C1 0750
DFBIDX1
EDMA3 TC1 Destination FIFO B-Index Register 1
0x01C1 0754
DFMPPRXY1
0x01C1 0758 - 0x01C1 077F
-
EDMA3 TC1 Destination FIFO Memory Protection Proxy Register 1
Reserved
0x01C1 0780
DFOPT2
EDMA3 TC1 Destination FIFO Options Register 2
0x01C1 0784
DFSRC2
EDMA3 TC1 Destination FIFO Source Address Register 2
0x01C1 0788
DFCNT2
EDMA3 TC1 Destination FIFO Count Register 2
0x01C1 078C
DFDST2
EDMA3 TC1 Destination FIFO Destination Address Register 2
0x01C1 0790
DFBIDX2
EDMA3 TC1 Destination FIFO B-Index Register 2
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C1 0794
DFMPPRXY2
0x01C1 0798 - 0x01C1 07BF
-
REGISTER NAME
EDMA3 TC1 Destination FIFO Memory Protection Proxy Register 2
Reserved
0x01C1 07C0
DFOPT3
EDMA3 TC1 Destination FIFO Options Register 3
0x01C1 07C4
DFSRC3
EDMA3 TC1 Destination FIFO Source Address Register 3
0x01C1 07C8
DFCNT3
EDMA3 TC1 Destination FIFO Count Register 3
0x01C1 07CC
DFDST3
EDMA3 TC1 Destination FIFO Destination Address Register 3
0x01C1 07D0
DFBIDX3
EDMA3 TC1 Destination FIFO B-Index Register 3
0x01C1 07D4
DFMPPRXY3
0x01C1 07D8 - 0x01C1 07FF
-
0x01C1 0800
-
0x01C1 0804
TCCFG
EDMA3 TC1 Destination FIFO Memory Protection Proxy Register 3
Reserved
Transfer Controller 2 Registers
132
Reserved
EDMA3 TC2 Configuration Register
0x01C1 0808 - 0x01C1 08FF
-
0x01C1 0900
TCSTAT
Reserved
0x01C1 0904 - 0x01C1 0910
-
Reserved
0x01C1 0914 - 0x01C1 091F
-
Reserved
0x01C1 0920
ERRSTAT
EDMA3 TC2 Error Status Register
0x01C1 0924
ERREN
EDMA3 TC2 Error Enable Register
0x01C1 0928
ERRCLR
EDMA3 TC2 Error Clear Register
0x01C1 092C
ERRDET
EDMA3 TC2 Error Details Register
0x01C1 0930
ERRCMD
EDMA3 TC2 Error Interrupt Command Register
0x01C1 0934 - 0x01C1 093F
-
EDMA3 TC2 Channel Status Register
Reserved
0x01C1 0940
RDRATE
0x01C1 0944 - 0x01C1 09FF
-
EDMA3 TC2 Read Command Rate Register
Reserved
0x01C1 0A00 - 0x01C1 0A3F
-
Reserved
0x01C1 0A40
SAOPT
EDMA3 TC2 Source Active Options Register
0x01C1 0A44
SASRC
EDMA3 TC2 Source Active Source Address Register
0x01C1 0A48
SACNT
EDMA3 TC2 Source Active Count Register
0x01C1 0A4C
SADST
EDMA3 TC2 Source Active Destination Address Register
0x01C1 0A50
SABIDX
EDMA3 TC2 Active B-Index Register
0x01C1 0A54
SAMPPRXY
EDMA3 TC2 Source Active Memory Protection Proxy Register
0x01C1 0A58
SACNTRLD
EDMA3 TC2 Source Active Count Reload Register
0x01C1 0A5C
SASRCBREF
EDMA3 TC2 Source Active Source Address B-Reference Register
0x01C1 0A60
SADSTBREF
EDMA3 TC2 Source Active Destination Address B-Reference Register
0x01C1 0A64 - 0x01C1 0A7F
-
Reserved
0x01C1 0A80
DFCNTRLD
0x01C1 0A84
DFSRCBREF
EDMA3 TC2 Destination FIFO Set Count Reload Register
EDMA3 TC2 Destination FIFO Set Source Address B-Reference Register
0x01C1 0A88
DFDSTBREF
EDMA3 TC2 Destination FIFO Set Destination Address B-Reference
Register
0x01C1 0A8C - 0x01C1 0AFF
-
0x01C1 0B00
DFOPT0
Reserved
EDMA3 TC2 Destination FIFO Options Register 0
0x01C1 0B04
DFSRC0
EDMA3 TC2 Destination FIFO Source Address Register 0
0x01C1 0B08
DFCNT0
EDMA3 TC2 Destination FIFO Count Register 0
0x01C1 0B0C
DFDST0
EDMA3 TC2 Destination FIFO Destination Address Register 0
0x01C1 0B10
DFBIDX0
EDMA3 TC2 Destination FIFO B-Index Register 0
0x01C1 0B14
DFMPPRXY0
0x01C1 0B18 - 0x01C1 0B3F
-
Peripheral Information and Electrical Specifications
EDMA3 TC2 Destination FIFO Memory Protection Proxy Register 0
Reserved
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Table 6-7. C6421 EDMA Registers (continued)
HEX ADDRESS
ACRONYM
0x01C1 0B40
DFOPT1
EDMA3 TC2 Destination FIFO Options Register 1
REGISTER NAME
0x01C1 0B44
DFSRC1
EDMA3 TC2 Destination FIFO Source Address Register 1
0x01C1 0B48
DFCNT1
EDMA3 TC2 Destination FIFO Count Register 1
0x01C1 0B4C
DFDST1
EDMA3 TC2 Destination FIFO Destination Address Register 1
0x01C1 0B50
DFBIDX1
EDMA3 TC2 Destination FIFO B-Index Register 1
0x01C1 0B54
DFMPPRXY1
0x01C1 0B58 - 0x01C1 0B7F
-
EDMA3 TC2 Destination FIFO Memory Protection Proxy Register 1
0x01C1 0B80
DFOPT2
EDMA3 TC2 Destination FIFO Options Register 2
0x01C1 0B84
DFSRC2
EDMA3 TC2 Destination FIFO Source Address Register 2
Reserved
0x01C1 0B88
DFCNT2
EDMA3 TC2 Destination FIFO Count Register 2
0x01C1 0B8C
DFDST2
EDMA3 TC2 Destination FIFO Destination Address Register 2
0x01C1 0B90
DFBIDX2
EDMA3 TC2 Destination FIFO B-Index Register 2
0x01C1 0B94
DFMPPRXY2
0x01C1 0B98 - 0x01C1 0BBF
-
EDMA3 TC2 Destination FIFO Memory Protection Proxy Register 2
0x01C1 0BC0
DFOPT3
EDMA3 TC2 Destination FIFO Options Register 3
0x01C1 0BC4
DFSRC3
EDMA3 TC2 Destination FIFO Source Address Register 3
0x01C1 0BC8
DFCNT3
EDMA3 TC2 Destination FIFO Count Register 3
0x01C1 0BCC
DFDST3
EDMA3 TC2 Destination FIFO Destination Address Register 3
0x01C1 0BD0
DFBIDX3
EDMA3 TC2 Destination FIFO B-Index Register 3
0x01C1 0BD4
DFMPPRXY3
0x01C1 0BD8 - 0x01C1 0BFF
-
Reserved
EDMA3 TC2 Destination FIFO Memory Protection Proxy Register 3
Reserved
Table 6-8 shows an abbreviation of the set of registers which make up the parameter set for each of 128
EDMA events. Each of the parameter register sets consist of 8 32-bit word entries. Table 6-9 shows the
parameter set entry registers with relative memory address locations within each of the parameter sets.
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Table 6-8. EDMA Parameter Set RAM
HEX ADDRESS RANGE
DESCRIPTION
0x01C0 4000 - 0x01C0 401F
Parameters Set 0 (8 32-bit words)
0x01C0 4020 - 0x01C0 403F
Parameters Set 1 (8 32-bit words)
0x01C0 4040 - 0x01C0 405F
Parameters Set 2 (8 32-bit words)
0x01C0 4060 - 0x01C0 407F
Parameters Set 3 (8 32-bit words)
0x01C0 4080 - 0x01C0 409F
Parameters Set 4 (8 32-bit words)
0x01C0 40A0 - 0x01C0 40BF
Parameters Set 5 (8 32-bit words)
...
...
0x01C0 4FC0 - 0x01C0 4FDF
Parameters Set 126 (8 32-bit words)
0x01C0 4FE0 - 0x01C0 4FFF
Parameters Set 127 (8 32-bit words)
Table 6-9. Parameter Set Entries
HEX OFFSET ADDRESS
WITHIN THE PARAMETER SET
134
ACRONYM
PARAMETER ENTRY
0x0000
OPT
Option
0x0004
SRC
Source Address
0x0008
A_B_CNT
0x000C
DST
0x0010
SRC_DST_BIDX
Source B Index, Destination B Index
0x0014
LINK_BCNTRLD
Link Address, B Count Reload
0x0018
SRC_DST_CIDX
Source C Index, Destination C Index
0x001C
CCNT
Peripheral Information and Electrical Specifications
A Count, B Count
Destination Address
C Count
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6.5 Reset
The reset controller detects the different type of resets supported on the C6421 device and manages the
distribution of those resets throughout the device.
The C6421 device has several types of device-level resets - power-on reset, warm reset, max reset, and
CPU reset. Table 6-10 explains further the types of reset, the reset initiator, and the effects of each reset
on the chip. See Section 6.5.9, Reset Electrical Data/Timing, for more information on the effects of each
reset on the PLL controllers and their clocks.
Table 6-10. Device-Level Global Reset Types
TYPE
INITIATOR
EFFECT(s)
Power-on Reset
(POR)
POR pin
Global chip reset (Cold reset). Activates the POR signal on chip,
which resets the entire chip including the emulation logic.
The power-on reset (POR) pin must be driven low during power
ramp of the device.
Device boot and configuration pins are latched.
Warm Reset
RESET pin
Resets everything except for the emulation logic. Emulator stays
alive during Warm Reset.
Device boot and configuration pins are latched.
Max Reset
Emulator, WD Timer (Timer 2)
Same as a Warm Reset, except the C6421 device boot and
configuration pins are not re-latched.
In addition to device-level global resets, the PSC provides the capability to cause local resets to
peripherals and/or the CPU.
6.5.1
Power-on Reset (POR Pin)
Power-on Reset (POR) is initiated by the POR pin and is used to reset the entire chip, including the
emulation logic. Power-on Reset is also referred to as a cold reset since the device usually goes through a
power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power supplies
have reached their normal operating conditions. If an external 15–30-MHz oscillator is used on the
MXI/CLKIN pin, the external clock should also be running at the correct frequency prior to de-asserting the
POR pin. Note: a device power-up cycle is not required to initiate a Power-on Reset.
The following sequence must be followed during a Power-on Reset.
1. Wait for the power supplies to reach normal operating conditions while keeping the POR pin asserted
(driven low).
2. Wait for the input clock source to be stable while keeping the POR pin asserted (low).
3. Once the power supplies and the input clock source are stable, the POR pin must remain asserted
(low) for a minimum of 12 MXI cycles.
Within the low period of the POR pin, the following happens:
– The reset signals flow to the entire chip (including the emulation logic), resetting the modules on
chip.
– The PLL Controller clocks start at the frequency of the MXI clock. The clocks are propagated
throughout the chip to reset the chip synchronously. By default, both PLL1 and PLL2 are in reset
and unlocked. The PLL Controllers default to PLL Bypass Mode.
– The RESETOUT pin stays asserted (low), indicating the device is in reset.
4. The POR pin may now be deasserted (driven high).
When the POR pin is deasserted (high), the configuration pin values are latched and the PLL
Controllers changed their system clocks to their default divide-down values. Both PLL Controllers are
still in PLL Bypass Mode. Other device initialization also begins.
5. After device initialization is complete, the PLL Controllers pause the system clocks for 10 cycles. At the
end of these 10 cycles, the RESETOUT pin is deasserted (driven high).
At this point:
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– The I/O pins are controlled by the default peripherals (default peripherals are determined by
PINMUX0 and PINMUX1 registers).
– The clock and reset of each peripheral is determined by the default settings of the Power and Sleep
Controller (PSC).
– The PLL Controllers are operating in PLL Bypass Mode.
– The C64x+ begins executing from DSPBOOTADDR (determined by bootmode selection).
After the reset sequence, the boot sequence begins. For more details on the boot sequence, see the
Using the TMS320C642x Bootloader Application Report (literature number SPRAAK5).
After the boot sequence, follow the software initialization sequence described in Section 3.8, Device
Initialization Sequence After Reset.
6.5.1.1 Usage of POR versus RESET Pins
POR and RESET are independent resets.
If the device needs to go through a power-up cycle, POR (not RESET) must be used to fully reset the
device.
In functional end-system, emulation/debugger logic is typically not needed; therefore, the recommendation
for functional end-system is to use the POR pin for full device reset. If RESET pin is not needed, it can be
pulled inactive (high) via an external pullup resistor.
In a debug system, it is typically desirable to allow the reset of the device without crashing an emulation
session. In this case, the user can use the POR pin to achieve full device reset and use the RESET pin to
achieve a debug reset—which resets the entire device except emulation logic.
6.5.1.2 Latching Boot and Configuration Pins
Internal to the chip, the two device reset pins RESET and POR are logically AND’d together only for the
purpose of latching device boot and configuration pins. The values on all device and boot configuration
pins are latched into the BOOTCFG register when the logical AND of RESET and POR transitions from
low-to-high.
6.5.2
Warm Reset (RESET Pin)
A Warm Reset is activated by driving the RESET pin active low. This resets everything in the device
except the emulation logic. An emulator session will stay alive during warm reset.
For more information on POR vs. RESET usage, see Section 6.5.1.1, Usage of POR versus RESET Pins
and Section 6.5.1.2, Latching Boot and Configuration Pins.
The following sequence must be followed during a Warm Reset:
1. Power supplies and input clock source should already be stable.
2. The RESET pin must be asserted (low) for a minimum of 12 MXI cycles.
Within the low period of the RESET pin, the following happens:
– The reset signals flow to the entire chip resetting all the modules on chip, except the emulation
logic.
– The PLL Controllers are reset thereby, switching back to PLL Bypass Mode and resetting all their
registers to default values. Both PLL1 and PLL2 are placed in reset and lose lock.
– The RESETOUT pin becomes asserted (low), indicating the device is in reset.
3. The RESET pin may now be deasserted (driven high).
When the RESET pin is deasserted (high), the configuration pin values are latched and the PLL
Controllers changed their system clocks to their default divide-down values. Both PLL Controllers are
still in PLL Bypass Mode. Other device initialization also begins.
4. After device initialization is complete, the PLL Controllers pause the system clocks for 10 cycles. At the
end of these 10 cycles, the RESETOUT pin is deasserted (driven high).
136
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At this point:
– The I/O pins are controlled by the default peripherals (default peripherals are determined by
PINMUX0 and PINMUX1 registers).
– The clock and reset of each peripheral is determined by the default settings of the Power and Sleep
Controller (PSC).
– The PLL Controllers are operating in PLL Bypass Mode.
– The C64x+ begins executing from DSPBOOTADDR (determined by bootmode selection).
After the reset sequence, the boot sequence begins. For more details on the boot sequence, see the
Using the TMS320C642x Bootloader Application Report (literature number SPRAAK5).
After the boot sequence, follow the software initialization sequence described in Section 3.8, Device
Initialization Sequence After Reset.
6.5.3
Maximum Reset
A Maximum (Max) Reset is initiated by the emulator or the watchdog timer (Timer 2). The effects are the
same as a warm reset, except the device boot and configuration pins are not re-latched. The emulator
initiates a maximum reset via the ICEPICK module. This ICEPICK initiated reset is non-maskable. When
the watchdog timer counter reaches zero, this will also initiate a maximum reset to recover from a runaway
condition. The watchdog timeout reset condition is masked if the TIMERCTL.WDRST bit is cleared to "0".
To invoke the maximum reset via the ICEPICK module, the user can perform the following from the Code
Composer Studio™ IDE menu: Debug → Advanced Resets → System Reset
This is the Max Reset sequence:
1. Max Reset is initiated by the emulator or the watchdog timer.
During this time, the following happens:
– The reset signals flow to the entire chip resetting all the modules on chip except the emulation
logic.
– The PLL Controllers are reset thereby, switching back to PLL Bypass Mode and resetting all their
registers to default values. Both PLL1 and PLL2 are placed in reset and lose lock.
– The RESETOUT pin becomes asserted (low), indicating the device is in reset.
2. After device initialization is complete, the PLL Controllers pause the system clocks for 10 cycles. At the
end of these 10 cycles, the RESETOUT pin is deasserted (driven high).
At this point:
– The I/O pins are controlled by the default peripherals (default peripherals are determined by
PINMUX0 and PINMUX1 registers).
– The clock and reset of each peripheral is determined by the default settings of the Power and Sleep
Controller (PSC).
– The PLL Controllers are operating in PLL Bypass Mode.
– The C64x+ begins executing from DSPBOOTADDR (determined by bootmode selection).
After the reset sequence, the boot sequence begins. Since the boot and configuration pins are not latched
with a Max Reset, the previous values (as shown in the BOOTCFG register) are used to select the boot
mode. For more details, see the Using the TMS320C642x Bootloader Application Report (literature
number SPRAAK5).
After the boot sequence, follow the software initialization sequence described in Section 3.8, Device
Initialization Sequence After Reset.
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CPU Local Reset
The C64x+ DSP CPU has an internal reset input that allows a host (HPI) to control it. This reset is
configured through a register bit (MDCTL[39].LRST) in the Power Sleep Controller (PSC) module. When in
C64x+ local reset, the slave DMA port on C64x+ will remain active and the internal memory will be
accessible. For procedures on asserting and de-asserting CPU local reset by the host, see the
TMS320C642x Power and Sleep Controller (PSC) Reference Guide (literature number SPRUEN8).
For information on peripheral selection at the rising edge of POR or RESET, see Section 3, Device
Configurations of this data manual.
6.5.5
Peripheral Local Reset
The user can configure the local reset and clock state of a peripheral through programming the PSC.
Table 6-4, C6421 LPSC Assignments identifies the LPSC numbers and the peripherals capable of being
locally reset by the PSC. For more detailed information on the programming of these peripherals by the
PSC, see the TMS320C642x Power and Sleep Controller (PSC) Reference Guide (literature number
SPRUEN8).
6.5.6
Reset Priority
If any of the above reset sources occur simultaneously, the PLLC only processes the highest priority reset
request. The reset request priorities are as follows (high to low):
• Power-on Reset
• Maximum Reset
• Warm Reset
• CPU Reset
6.5.7
Reset Controller Register
The reset type status (RSTYPE) register (01C4 00E4) is the only register for the reset controller. This
register falls in the same memory range as the PLL1 controller registers (see Section 6.7.2, for the PLL1
Controller Registers (including Reset Controller)). For more details on the RSTYPE register, see
theTMS320C642x DSP Phase-Locked Loop Controller (PLLC) User's Guide (literature number
SPRUES0).
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Pin Behaviors at Reset
During normal operations, pins are controlled by the respective peripheral selected in the PINMUX0 or
PINMUX1 register. During device level global reset, the pin behaves as follows:
Multiplexed Boot and Configuration Pins
These pins are forced 3-stated when RESETOUT is asserted (low). This is to ensure the proper boot and
configuration values can be latched on these multiplexed pins. This is particularly useful in the case where
the boot and configuration values are driven by an external control device. After RESETOUT is
deasserted (high), these pins are controlled by their respective default peripheral.
• Boot and Configuration Pins Group: RMTXD0/GP[28], RMTXD1/GP[27](LENDIAN),
GP[26]/(FASTBOOT), GP[25]/(BOOTMODE3), GP[24]/(BOOTMODE2), GP[23]/(BOOTMODE1),
GP[22]/(BOOTMODE0), EM_A[4]/GP[10]/(PLLMS2), EM_A[1]/(ALE)/GP[9]/(PLLMS1),
EM_A[2]/(CLE)/GP[8]/(PLLMS0), EM_A[0]/GP[7]/(AEM2), EM_BA[0]/GP[6]/(AEM1), and
EM_BA[1]/GP[5]/(AEM0).
For information on whether external pullup/pulldown resistors should be used on the boot and
configuration pins, see Section 3.9.1, Pullup/Pulldown Resistors.
Default Power Down Pins
As discussed in Section 3.2, Power Considerations, the VDD3P3V_PWDN register controls power to the
3.3-V pins. The VDD3P3V_PWDN register defaults to powering down some 3.3-V pins to save power. For
more details on the VDD3P3V_PWDN register and which 3.3-V pins default to powerup or powerdown,
Section 3.2, Power Considerations. The pins that default to powerdown, are both reset to powerdown and
high-impedance. They remain in that state until configured otherwise by VDD3P3_PWDN and
PINMUX0/PINMUX1 programming.
• Default Power Down Pin Group: GP[4]/PWM1, ACLKR0/CLKX0/GP[99], AFSR0/DR0/GP[100],
AHCLKR0/CLKR0/GP[101], AXR0[3]/FSR0/GP[102], AXR0[2]/FSX0/GP[103], AXR0[1]/DX0/GP[104],
AXR0/ GP[105], ACLKX0/GP[106], AFSX0/GP[107], AHCLKX0/GP[108], AMUTEIN0/GP[109],
AMUTE0/GP[110], TOUT1L/GP[55], TINP1L/GP[56], CLKS0/TOUT0L/GP[97], TINP0L/GP[98],
URXD0/GP[85], UTXD0/GP[86], UCTS0/GP[87], and URTS0/PWM0/GP[88].
All Other Pins
During RESETOUT assertion (low), all other pins are controlled by the default peripheral. The default
peripheral is determined by the default settings of the PINMUX0 or PINMUX1 registers.
Some of the PINMUX0/PINMUX1 settings are determined by configuration pins latched at reset. To
determine the reset behavior of these pins, see Section 3.7, Multiplexed Pin Configurations and read the
rest of the this subsection to understand how that default peripheral controls the pin.
The reset behaviors for all these other pins are categorized as follows (also see Figure 6-7 and Figure 6-8
in Section 6.5.9, Reset Electrical Data/Timing):
• Z+/Low Group (Z Longer-to-Low Group): These pins are 3-stated when device-level global reset
source (e.g., POR, RESET or Max Reset) is asserted. These pins remain 3-stated throughout
RESETOUT assertion. When RESETOUT is deasserted, these pins drive a logic low.
• Z+/High Group (Z Longer-to-High Group): These pins are 3-stated when device-level global reset
source (e.g., POR, RESET or Max Reset) is asserted. These pins remain 3-stated throughout
RESETOUT assertion. When RESETOUT is deasserted, these pins drive a logic high.
• Z+/Invalid Group (Z Longer-to-Invalid Group): These pins are 3-stated when device-level global
reset source (e.g., POR, RESET or Max Reset) is asserted. These pins remain 3-stated throughout
RESETOUT assertion. When RESETOUT is deasserted, these pins drive an invalid value until
configured otherwise by their respective peripheral (after the peripheral is enabled by the PSC).
• Z Group: These pins are 3-stated by default, and these pins remain 3-stated throughout RESETOUT
assertion. When RESETOUT is deasserted, these pins remain 3-stated until configured otherwise by
their respective peripheral (after the peripheral is enabled by the PSC).
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•
•
•
•
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Low Group: These pins are low by default, and remain low until configured otherwise by their
respective peripheral (after the peripheral is enabled by the PSC).
High Group: These pins are high by default, and remain high until configured otherwise by their
respective peripheral (after the peripheral is enabled by the PSC).
Z/Low Group (Z-to-Low Group): These pins are 3-stated when device-level global reset source (e.g.,
POR, RESET or Max Reset) is asserted. When the reset source is deasserted, these pins drive a logic
low.
Z/High Group (Z-to-High Group): These pins are 3-stated when device-level global reset source
(e.g., POR, RESET or Max Reset) is asserted. When reset source is deasserted, these pins drive a
logic high.
Clock Group: These clock pins are toggling by default. They paused momentarily before RESETOUT
is deasserted (high). The only pin in the Clock Group is CLKOUT0.
This is a list of possible default peripherals and how they control the pins during reset:
• GPIO: All GPIO pins behave according to Z Group.
Note: The following EMIFA list only includes pins that can default to function as EMIFA signals.
• EMIFA: These EMIFA signals are multiplexed with boot and configuration pins: EM_A[4], EM_A[2:0],
EM_BA[0], EM_BA[1]; therefore, they are forced 3-stated throughout RESETOUT.
– Z+/Low Group: EM_A[4], EM_A[2:0]
– Z+/High Group: EM_BA[0], EM_BA[1], EM_OE, EM_WE
– Z+/Invalid Group: EM_D[7:0]
– Z/Low Group: EM_A[21:5], EM_A[3], EM_R/W
– Z/High Group: EM_CS2
– Z Group: EM_WAIT
• DDR2 Memory Controller:
– Clock Group: DDR_CLK, DDR_CLK
– DDR2 Z Group: DDR_DQM[1:0], DDR_DQS[1:0], DDR_D[15:0]
– DDR2 Low Group: DDR_CKE, DDR_BS[2:0], DDR_A[12:0]
– DDR2 High Group: DDR_CS, DDR_WE, DDR_RAS, DDR_CAS
• I2C: All I2C pins behave according to Z Group.
• JTAG: TDO, EMU0, and EMU1 pins behave according to Z Group. TCK, TDI, TMS, and TRST are
input-only pins.
• Clock: CLKOUT0
For more information on the pin behaviors during device-level global reset, see Figure 6-7 and Figure 6-8
in Section 6.5.9, Reset Electrical Data/Timing.
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Reset Electrical Data/Timing
Note: If a configuration pin must be routed out from the device, the internal pullup/pulldown (IPU/IPD)
resistor should not be relied upon; TI recommends the use of an external pullup/pulldown resistor.
Table 6-11. Timing Requirements for Reset (see Figure 6-7 and Figure 6-8)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
tw(RESET)
Pulse duration, POR low or RESET low
12C (1)
ns
4
tsu(CONFIG)
Setup time, boot and configuration pins valid before POR high or RESET
high (2)
12C (1)
ns
5
th(CONFIG)
Hold time, boot and configuration pins valid after POR high or RESET
high (2)
0
ns
1
(1)
(2)
UNIT
MAX
C = 1/MXI clock frequency in ns. The device clock source must be stable and at a valid frequency prior to meeting the tw(RESET)
requirement.
For the list of boot and configuration pins, see Table 2-7, Boot Terminal Functions.
Table 6-12. Switching Characteristics Over Recommended Operating Conditions During Reset (1)
(see Figure 6-8)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
(1)
2
td(RSTH-RSTOUTH)
Delay time, POR high or RESET high to RESETOUT high
3
tw(PAUSE)
Pulse duration, SYSCLKs paused (low) before RESETOUT high
6
td(RSTL-IV)
7
td(RSTH-V)
8
td(RSTOUTH-V)
Delay time, RESETOUT high to pins valid
9
td(RSTOUTH-IV)
Delay time, RESETOUT high to pins invalid
UNIT
MAX
1900C
ns
10C
ns
Delay time, POR low or RESET low to pins invalid
20
ns
Delay time, POR high or RESET high to pins valid
20
ns
0
ns
12C
ns
10C
C = 1/CLKIN1 clock frequency in ns.
Figure 6-7 shows the Power-Up Timing. Figure 6-8 shows the Warm Reset (RESET) Timing and Max
Reset Timing are identical to Warm Reset Timing, except the boot and configuration pins are not
relatched and the BOOTCFG register retains its previous value latched before the Max Reset were
initiated.
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Power
Supplies
Ramping
Power Supplies Stable
Clock Source Stable
MXI
(A)
CLKOUT0
1
POR
RESET
2
RESETOUT
3
SYSCLKREFCLK
(PLLC1)
SYSCLK1
SYSCLK2
SYSCLK3
5
4
Boot and
Configuration Pins
Z+/Low Group
Config
8
Driven or Hi-Z
Hi-Z
8
Hi-Z
8
Hi-Z
9
(Z longer-to-low)
Z+/High Group
(Z longer-to-low)
Z+/Invalid Group
Invalid
(Z longer-to-Invalid)
Hi-Z
Z Group
Z/Low Group
(Z-to-low)
7
7
Z/High Group
(Z-to-high)
DDR2 Z Group
DDR2 Low Group
7
7
7
DDR2 High Group
A.
Power supplies and MXI must be stable before the start of tW(RESET)..
B.
Pin reset behavior depends on which peripheral defaults to controlling the multiplexed pin. For more details on what
pin group (e.g., Z Group, Z/Low Group, Z/High Group, etc.) each pin belongs to, see Section 6.5.8, Pin Behaviors at
Reset.
Figure 6-7. Power-Up Timing(B)
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Power Supplies Stable
MXI
CLKOUT0
POR
1
RESET
2
RESETOUT
3
SYSCLKREFCLK
(PLLC1)
PLL1 Clock
SYSCLK1
Div1 Clock
SYSCLK2
Div3 Clock
SYSCLK3
Div6 Clock
6
Boot and
Configuration Pins
5
4
8
Driven or Hi-Z
Config
Driven or Hi-Z
8
Z+/Low Group
(Z longer-to-low)
8
Z+/High Group
(Z longer-to-high)
9
Z+/Invalid Group
Invalid
(Z longer-to-invalid)
Z Group
Driven or Hi-Z
6
Z/Low Group
(Z-to-low)
6
Z/High Group
(Z-to-high)
7
Driven or Hi-Z
7
Driven or Hi-Z
6
DDR2 Z Group
6
DDR2 Low Group
6
DDR2 High Group
A.
Pin reset behavior depends on which peripheral defaults to controlling the multiplexed pin. For more details on what
pin group (e.g., Z Group, Z/Low Group, Z/High Group, etc.) each pin belongs to, see Section 6.5.8, Pin Behaviors at
Reset.
Figure 6-8. Warm Reset (RESET) Timing(A)
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6.6 External Clock Input From MXI/CLKIN Pin
The C6421 device includes two options to provide an external clock input:
• Use an on-chip oscillator with external crystal.
• Use an external 1.8-V LVCMOS-compatible clock input.
The optimal external clock input frequency is 15–30 MHz. Section 6.6.1 provides more details on Option 1,
using an on-chip oscillator with external crystal. Section 6.6.2 provides details on Option 2, using an
external 1.8-V LVCMOS-compatible clock input.
6.6.1
Clock Input Option 1- Crystal
In this option, a crystal is used as the external clock input to the C6421.
The 15–30-MHz oscillator provides the reference clock for all C6421 subsystems and peripherals. The
on-chip oscillator requires an external 15–30-MHz crystal connected across the MXI and MXO pins, along
with two load capacitors, as shown in Figure 6-9. The external crystal load capacitors must be connected
only to the 15–30-MHz oscillator ground pin (MXVSS). Do not connect to board ground (VSS). The MXVDD
pin can be connected to the same 1.8 V power supply as DVDDR2.
MXI/CLKIN
MXO
MXVSS
MXVDD
Crystal
15−30 MHz
C1
C2
1.8 V
Figure 6-9. 15–30-MHz System Oscillator
The load capacitors, C1 and C2, should be chosen such that the equation is satisfied (typical values are
C1 = C2 = 10 pF). CL in the equation is the load specified by the crystal manufacturer. All discrete
components used to implement the oscillator circuit should be placed as close as possible to the
associated oscillator pins (MXI and MXO) and to the MXVSS pin.
CL +
C 1C 2
(C1 ) C2)
Table 6-13. Input Requirements for Crystal
PARAMETER
(1)
MIN
Start-up time (from power up until oscillating at stable frequency of 30
MHz)
Oscillation frequency
15
ESR
(1)
TYP
MAX
UNIT
4
ms
30
MHz
60
Ω
For audio applications, stability of the input clock is very important. The user should select crystals with low enough ppm to ensure good
audio quality for the specific application.
6.6.2
Clock Input Option 2—1.8-V LVCMOS-Compatible Clock Input
In this option, a 1.8-V LVCMOS-Compatible Clock Input is used as the external clock input to the C6421.
The external connections are shown in Figure 6-10. The MXI/CLKIN pin is connected to the 1.8-V
LVCMOS-Compatible clock source. The MXO pin is left unconnected. The MXVSS pin is connected to
board ground (VSS). The MXVDD pin can be connected to the same 1.8-V power supply as DVDDR2.
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MXI/CLKIN
MXO
MXVSS
MXVDD
NC
1.8 V
Figure 6-10. 1.8-V LVCMOS-Compatible Clock Input
The clock source must meet the MXI/CLKIN timing requirements in Section 6.7.4, Clock PLL Electrical
Data/Timing (Input and Output Clocks).
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6.7 Clock PLLs
There are two independently controlled PLLs on C6421. PLL1 generates the frequencies required for the
DSP, DMA, and other peripherals. PLL2 generates the frequencies required for the DDR2 interface. The
recommended reference clock for both PLLs is the 15–30-MHz crystal input.
6.7.1
PLL1 and PLL2
Both PLL1 and PLL2 power is supplied externally via the 1.8 V PLL power-supply pin (PLLPWR18). An
external EMI filter circuit must be added to PLLPWR18, as shown in Figure 6-11. The 1.8-V supply of the
EMI filter must be from the same 1.8-V power plane supplying the device’s 1.8-V I/O power-supply pins
(DVDDDR2). TI recommends EMI filter manufacturer Murata, part number NFM18CC222R1C3.
All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the device as
possible. For the best performance, TI recommends that all the PLL external components be on a single
side of the board without jumpers, switches, or components other than the ones shown in Figure 6-11. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C1, C2, and the EMI Filter).
C642x
PLL1
+1.8 V
PLLPWR18
EMI Filter
C1
C2
0.1 µF
0.01 µF
PLL2
Figure 6-11. PLL1 and PLL2 External Connection
The minimum CLKIN rise and fall times should also be observed. For the input clock timing requirements,
see Section 6.7.4, Clock PLL Electrical Data/Timing (Input and Output Clocks).
There is an allowable range for PLL multiplier (PLLM). There is a minimum and maximum operating
frequency for MXI/CLKIN, PLLOUT, and the device clocks (SYSCLKs). The PLL Controllers must be
configured not to exceed any of these constraints documented in this section (certain combinations of
external clock inputs, internal dividers, and PLL multiply ratios might not be supported). For these
constraints (ranges), see Table 6-14 through Table 6-16.
Table 6-14. PLL1 and PLL2 Multiplier Ranges
146
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MIN
MAX
PLL1 Multiplier
x14
x32
PLL2 Multiplier
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Table 6-15. PLLC1 Clock Frequency Ranges
CLOCK SIGNAL NAME
MXI/CLKIN (1)
MIN
MAX
UNIT
15
30
MHz
PLLOUT
CVDD = 1.2 V
-7 devices
300
700
MHz
-6/-5/-4/-Q6/-Q5/-Q4 devices
300
600
MHz
PLLOUT
CVDD = 1.05 V
-7 devices
300
520
MHz
-6/-5/-4/-L/-Q5 devices
300
(2)
SYSCLK1 (CLKDIV1 Domain),
CVDD = 1.2 V
(2)
SYSCLK1 (CLKDIV1 Domain),
CVDD = 1.05 V
(1)
(2)
520
MHz
-7 devices
700
MHz
-6/-Q6 devices
600
MHz
-5/-Q5 devices
500
MHz
-4/-Q4 devices
400
MHz
-7 devices
520
MHz
-6 devices
450
MHz
-5/-Q5/-L devices
400
MHz
-4 devices
350
MHz
MXI/CLKIN input clock is used for both PLL Controllers (PLLC1 and PLLC2).
Applies to "tape and reel" part number counterparts as well. For more information, see Section 2.7,
Device and Development-Support Tool Nomenclature.
Table 6-16. PLLC2 Clock Frequency Ranges
CLOCK SIGNAL NAME
MIN
MAX
UNIT
15
30
MHz
At 1.2-V CVDD
300
900
MHz
At 1.05-V CVDD
300
666
MHz
266
MHz
MXI/CLKIN (1)
PLLOUT
PLL2_SYSCLK1 (to DDR2 PHY)
(1)
MXI/CLKIN input clock is used for both PLL Controllers (PLLC1 and PLLC2).
Both PLL1 and PLL2 have stabilization, lock, and reset timing requirements that must be followed.
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to
become stable after the PLL is powered up (after PLLCTL.PLLPWRDN bit goes through a 1-to-0
transition). The PLL should not be operated until this stabilization time has expired. This stabilization step
must be applied after these resets—a Power-on Reset, a Warm Reset, or a Max Reset, as the
PLLCTL.PLLPWRDN bit resets to a "1". For the PLL stabilization time value, see Table 6-17.
The PLL reset time is the amount of wait time needed for the PLL to properly reset (writing PLLRST = 0)
before bringing the PLL out of reset (writing PLLRST = 1). For the PLL reset time value, see Table 6-17.
The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1
with PLLEN = 0) to when to when the PLL controller can be switched to PLL mode (PLLEN = 1). For the
PLL lock time value, see Table 6-17.
Table 6-17. PLL1 and PLL2 Stabilization, Lock, and Reset Times
PLL STABILIZATION/LOCK/RESET
TIME
PLL Stabilization Time
MIN
(1)
MAX
2000C
128C (1)
UNIT
µs
150
PLL Lock Time
PLL Reset Time
TYP
(1)
ns
ns
C = CLKIN cycle time in ns. For example, when MXI/CLKIN frequency is 25 MHz, use C = 40 ns.
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For details on the PLL initialization software sequence, see the TMS320C642x DSP Phase-Locked Loop
Controller (PLLC) User's Guide (literature number SPRUES0).
For more information on the clock domains and their clock ratio restrictions, see Section 6.3.4, C6421
Power and Clock Domains.
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PLL Controller Register Description(s)
A summary of the PLL controller registers is shown in Table 6-18. For more details, see the
TMS320C642x DSP Phase-Locked Loop Controller (PLLC) User's Guide (literature number SPRUES0).
Table 6-18. PLL and Reset Controller Registers Memory Map
HEX ADDRESS RANGE
REGISTER ACRONYM
DESCRIPTION
0x01C4 0800
PID
0x01C4 08E4
RSTYPE
Reset Type Register
0x01C4 0900
PLLCTL
PLL Controller 1 PLL Control Register
PLL1 Controller Registers
Peripheral ID Register
0x01C4 0910
PLLM
PLL Controller 1 PLL Multiplier Control Register
0x01C4 0918
PLLDIV1
PLL Controller 1 Divider 1 Register (SYSCLK1)
0x01C4 091C
PLLDIV2
PLL Controller 1 Divider 2 Register (SYSCLK2)
0x01C4 0920
PLLDIV3
PLL Controller 1 Divider 3 Register (SYSCLK3)
0x01C4 0924
OSCDIV1
PLL Controller 1 Oscillator Divider 1 Register (OBSCLK) [CLKOUT0 pin]
0x01C4 0928
–
Reserved
0x01C4 092C
–
Reserved
0x01C4 0938
PLLCMD
PLL Controller 1 Command Register
0x01C4 093C
PLLSTAT
PLL Controller 1 Status Register (Shows PLLC1 Status)
0x01C4 0940
ALNCTL
PLL Controller 1 Clock Align Control Register
(Indicates Which SYSCLKs Need to be Aligned for Proper Device Operation)
0x01C4 0944
DCHANGE
PLL Controller 1 PLLDIV Divider Ratio Change Status Register
(Indicates if SYSCLK Divide Ratio has Been Modified)
0x01C4 0948
CKEN
0x01C4 094C
CKSTAT
PLL Controller 1 Clock Enable Control Register
PLL Controller 1 Clock Status Register (For All Clocks Except SYSCLKx)
0x01C4 0950
SYSTAT
PLL Controller 1 SYSCLK Status Register (Indicates SYSCLK on/off Status)
0x01C4 0960
–
0x01C4 0964
–
Reserved
Reserved
PLL2 Controller Registers
0x01C4 0C00
PID
Peripheral ID Register
0x01C4 0D00
PLLCTL
0x01C4 0D10
PLLM
PLL Controller 2 PLL Multiplier Control Register
0x01C4 0D18
PLLDIV1
PLL Controller 2 Divider 1 Register (SYSCLK1)
PLL Controller 2 PLL Control Register
0x01C4 0D1C
–
Reserved
0x01C4 0D20 - 0x01C4 0D2C
–
Reserved
0x01C4 0D2C
BPDIV
0x01C4 0D38
PLLCMD
PLL Controller 2 Command Register
0x01C4 0D3C
PLLSTAT
PLL Controller 2 Status Register (Shows PLLC2 Status)
0x01C4 0D40
ALNCTL
PLL Controller 2 Clock Align Control Register
(Indicates Which SYSCLKs Need to be Aligned for Proper Device Operation)
0x01C4 0D44
DCHANGE
PLL Controller 2 Bypass Divider Register (SYSCLKBP)
PLL Controller 2 PLLDIV Divider Ratio Change Status Register
(Indicates if SYSCLK Divide Ratio has Been Modified)
0x01C4 0D48
–
0x01C4 0D4C
CKSTAT
PLL Controller 2 Clock Status Register (For All Clocks Except SYSCLKx)
0x01C4 0D50
SYSTAT
PLL Controller 2 SYSCLK Status Register (Indicates SYSCLK on/off Status)
0x01C4 0D54 - 0x01C4 0FFF
–
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Reserved
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6.7.3
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Clock PLL Considerations with External Clock Sources
If the internal oscillator is bypassed, to minimize the clock jitter a single clean power supply should power
both the C6421 device and the external clock oscillator circuit. The minimum CLKIN rise and fall times
should also be observed. For the input clock timing requirements, see Section 6.7.4, Clock PLL Electrical
Data/Timing (Input and Output Clocks).
Rise/fall times, duty cycles (high/low pulse durations), and the load capacitance of the external clock
source must meet the device requirements in this data manual (see Section 5.3, Electrical Characteristics
Over Recommended Ranges of Supply Voltage and Operating Case Temperature and Section 6.7.4,
Clock PLL Electrical Data/Timing (Input and Output Clocks).
6.7.4
Clock PLL Electrical Data/Timing (Input and Output Clocks)
Table 6-19. Timing Requirements for MXI/CLKIN (1) (2) (3) (4) (see Figure 6-12)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
(1)
(2)
(3)
(4)
UNIT
MAX
1
tc(MXI)
Cycle time, MXI/CLKIN
33.3
66.7
ns
2
tw(MXIH)
Pulse duration, MXI/CLKIN high
0.45C
0.55C
ns
3
tw(MXIL)
Pulse duration, MXI/CLKIN low
0.45C
0.55C
ns
4
tt(MXI)
Transition time, MXI/CLKIN
0.05C
ns
5
tJ(MXI)
Period jitter, MXI/CLKIN
0.02C
ns
The MXI/CLKIN frequency and PLL multiply factor should be chosen such that the resulting clock frequency is within the specific range
for CPU operating frequency. For example, for a -600 speed device with a 25 MHz CLKIN frequency, the PLL multiply factor should be
≤ 24.
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
For more details on the PLL multiplier factors, see TMS320C642x DSP Phase-Locked Loop Controller (PLLC) User's Guide (literature
number SPRUES0).
C = CLKIN cycle time in ns. For example, when MXI/CLKIN frequency is 30 MHz, use C = 33.3 ns.
1
5
4
2
MXI/CLKIN
3
4
Figure 6-12. MXI/CLKIN Timing
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Table 6-20. Switching Characteristics Over Recommended Operating Conditions for CLKOUT0 (1) (2)
(see Figure 6-13)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
1
tC
Cycle time, CLKOUT0
33.3
66.7
ns
2
tw(CLKOUT0H)
Pulse duration, CLKOUT0 high
0.45P
0.55P
ns
3
tw(CLKOUT0L)
Pulse duration, CLKOUT0 low
0.45P
0.55P
ns
tt(CLKOUT0)
Transition time, CLKOUT0
0.05P
ns
4
(1)
(2)
UNIT
MAX
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
P = 1/CLKOUT0 clock frequency in nanoseconds (ns). For example, when CLKOUT0 frequency is 30 MHz, use P = 33.3 ns.
2
1
4
CLK_OUT0
(Divide-by-1)
3
4
Figure 6-13. CLKOUT0 Timing
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6.8 Interrupts
The C64x+ DSP interrupt controller combines device events into 12 prioritized interrupts. The source for
each of the 12 CPU interrupts is user programmable and is listed in Table 6-21. Also, the interrupt
controller controls the generation of the CPU exception and emulation interrupts. The NMI input to the
C64x+ DSP interrupt controller is not connected internally, therefore the NMI interrupt is not available.
Table 6-22 summarizes the C64x+ interrupt controller registers and memory locations. For more details on
DSP interrupt control, see the TMS320C64x+ DSP Megamodule Reference Guide (literature number
SPRU871).
Table 6-21. C6421 DSP System Event Mapping
DSP
SYSTEM
EVENT
NUMBER
ACRONYM
DSP
SYSTEM
EVENT
NUMBER
ACRONYM
SOURCE
0
EVT0
C64x+ Int Ctl 0
64
GPIO0
GPIO
1
EVT1
C64x+ Int Ctl 1
65
GPIO1
GPIO
2
EVT2
C64x+ Int Ctl 2
66
GPIO2
GPIO
3
EVT3
C64x+ Int Ctl 3
67
GPIO3
GPIO
4
TINTL0
Timer 0 – TINT12
68
GPIO4
GPIO
5
TINTH0
Timer 0 – TINT34
69
GPIO5
GPIO
6
TINTL1
Timer 1 – TINT12
70
GPIO6
GPIO
7
TINTH1
Timer 1 – TINT34
71
GPIO7
GPIO
8
WDINT
Timer 2 – TINT12
72
GPIOBNK0
GPIO
9
EMU_DTDMA
C64x+ EMC
73
GPIOBNK1
GPIO
Reserved
74
GPIOBNK2
GPIO
10
11
EMU_RTDXRX
C64x+ RTDX
75
GPIOBNK3
GPIO
12
EMU_RTDXTX
C64x+ RTDX
76
GPIOBNK4
GPIO
13
IDMAINT0
C64x+ EMC 0
77
GPIOBNK5
GPIO
14
IDMAINT1
C64x+ EMC 1
78
GPIOBNK6
GPIO
15
Reserved
79
16
Reserved
80
PWM0
PWM0
17
Reserved
81
PWM1
PWM1
18
Reserved
82
PWM2
PWM2
19
Reserved
83
IICINT0
I2C
20
Reserved
84
UARTINT0
UART0
21
Reserved
85
Reserved
22
Reserved
86
Reserved
23
Reserved
87
Reserved
24
Reserved
88
Reserved
25
Reserved
89
Reserved
26
Reserved
90
Reserved
27
Reserved
91
Reserved
28
Reserved
92
Reserved
29
Reserved
93
Reserved
30
Reserved
94
Reserved
31
Reserved
95
Reserved
32
33
96
Reserved
Reserved
INTERR
C64x+ Interrupt Controller Dropped CPU
Interrupt Event
EMC_IDMAERR
C64x+ EMC Invalid IDMA Parameters
Reserved
97
34
EDMA3CC_GINT
EDMACC Global Interrupt
98
Reserved
35
EDMA3CC_INT0
EDMACC Interrupt Region 0
99
Reserved
36
EDMA3CC_INT1
EDMACC Interrupt Region 1
100
Reserved
37
EDMA3CC_ERRINT
EDMA CC Error
101
Reserved
38
EDMA3TC_ERRINT0
EDMA TC0 Error
102
Reserved
39
EDMA3TC_ERRINT1
EDMA TC1 Error
103
Reserved
40
EDMA3TC_ERRINT2
EDMA TC2 Error
104
Reserved
41
PSCINT
PSC ALLINT
105
Reserved
Reserved
106
Reserved
42
152
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Table 6-21. C6421 DSP System Event Mapping (continued)
DSP
SYSTEM
EVENT
NUMBER
43
ACRONYM
EMACINT
SOURCE
DSP
SYSTEM
EVENT
NUMBER
ACRONYM
SOURCE
EMAC Memory Controller
107
Reserved
44
Reserved
108
Reserved
45
Reserved
109
Reserved
46
Reserved
110
Reserved
Reserved
47
HPIINT
HPI
111
48
MBXINT0
McBSP0 Transmit
112
49
MBRINT0
McBSP0 Receive
113
50
Reserved
114
51
Reserved
115
52
Reserved
116
UMCED1
C64x+ UMC 1
Reserved
PMC_ED
C64x+ PMC
Reserved
Reserved
53
DDRINT
DDR2 Memory Controller
117
UMCED2
C64x+ UMC 2
54
EMIFAINT
EMIFA
118
PDCINT
C64x+ PDC
55
VLQINT
VLYNQ
119
SYSCMPA
C64x+ SYS
56
Reserved
120
PMCCMPA
C64x+ PMC
57
Reserved
121
PMCDMPA
C64x+ PMC
58
Reserved
122
DMCCMPA
C64x+ DMC
59
AXINT0
McASP0 Transmit
123
DMCDMPA
C64x+ DMC
60
ARINT0
McASP0 Receive
124
UMCCMPA
C64x+ UMC
61
Reserved
125
UMCDMPA
C64x+ UMC
62
Reserved
126
EMCCMPA
C64x+ EMC
63
Reserved
127
EMCBUSERR
C64x+ EMC
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Table 6-22. C64x+ Interrupt Controller Registers
154
HEX ADDRESS
ACRONYM
0x0180 0000
EVTFLAG0
Event flag register 0
REGISTER DESCRIPTION
0x0180 0004
EVTFLAG1
Event flag register 1
0x0180 0008
EVTFLAG2
Event flag register 2
0x0180 000C
EVTFLAG3
Event flag register 3
0x0180 0020
EVTSET0
Event set register 0
0x0180 0024
EVTSET1
Event set register 1
0x0180 0028
EVTSET2
Event set register 2
0x0180 002C
EVTSET3
Event set register 3
0x0180 0040
EVTCLR0
Event clear register 0
0x0180 0044
EVTCLR1
Event clear register 1
0x0180 0048
EVTCLR2
Event clear register 2
0x0180 004C
EVTCLR3
Event clear register 3
0x0180 0080
EVTMASK0
Event mask register 0
0x0180 0084
EVTMASK1
Event mask register 1
0x0180 0088
EVTMASK2
Event mask register 2
0x0180 008C
EVTMASK3
Event mask register 3
0x0180 00A0
MEVTFLAG0
Masked event flag register 0
0x0180 00A4
MEVTFLAG1
Masked event flag register 1
0x0180 00A8
MEVTFLAG2
Masked event flag register 2
0x0180 00AC
MEVTFLAG3
Masked event flag register 3
0x0180 00C0
EXPMASK0
Exception mask register 0
0x0180 00C4
EXPMASK1
Exception mask register 1
0x0180 00C8
EXPMASK2
Exception mask register 2
0x0180 00CC
EXPMASK3
Exception mask register 3
0x0180 00E0
MEXPFLAG0
Masked exception flag register 0
0x0180 00E4
MEXPFLAG1
Masked exception flag register 1
0x0180 00E8
MEXPFLAG2
Masked exception flag register 2
0x0180 00EC
MEXPFLAG3
Masked exception flag register 3
0x0180 0104
INTMUX1
Interrupt mux register 1
0x0180 0108
INTMUX2
Interrupt mux register 2
0x0180 010C
INTMUX3
Interrupt mux register 3
0x0180 0180
INTXSTAT
Interrupt exception status
0x0180 0184
INTXCLR
Interrupt exception clear
0x0180 0188
INTDMASK
Peripheral Information and Electrical Specifications
Dropped interrupt mask register
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6.9 External Memory Interface (EMIF)
C6421 supports several memory and external device interfaces, including:
• Asynchronous EMIF (EMIFA) for interfacing to NOR Flash, SRAM, etc.
• NAND Flash
6.9.1
Asynchronous EMIF (EMIFA)
The C6421 Asynchronous EMIF (EMIFA) provides an 8-bit data bus, an address bus width up to 24-bits,
and 4 chip selects, along with memory control signals. These signals are multiplexed between these
peripherals:
• EMIFA and NAND interfaces
• EMAC (RMII)
• GPIO
6.9.2
NAND (NAND, SmartMedia, xD)
The EMIFA interface provides both the asynchronous EMIF and NAND interfaces. Four chip selects are
provided and each are individually configurable to provide either EMIFA or NAND support. The NAND
features supported are as follows.
• NAND flash on up to 4 asynchronous chip selects.
• 8-bit data bus width
• Programmable cycle timings.
• Performs ECC calculation.
• NAND Mode also supports SmartMedia and xD memory cards
• Boot ROM supports booting of the C6421 from NAND flash located at CS2
The memory map for EMIFA and NAND registers is shown in Table 6-23. For more details on the EMIFA
and NAND interfaces, the TMS320C642x DSP Peripherals Overview Reference Guide (literature number
SPRUEM3) and the TMS320C642x Asynchronous External Memory Interface (EMIF) User's Guide
(literature number SPRUEM7).
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Table 6-23. EMIFA/NAND Registers
HEX ADDRESS RANGE
ACRONYM
0x01E0 0000
RCSR
0x01E0 0004
AWCCR
0x01E0 0008 - 0x01E0 000F
REGISTER NAME
Revision Code and Status Register
Asynchronous Wait Cycle Configuration Register
Reserved
0x01E0 0010
A1CR
Asynchronous 1 Configuration Register (CS2 Space)
0x01E0 0014
A2CR
Asynchronous 2 Configuration Register (CS3 Space)
0x01E0 0018
A3CR
Asynchronous 3 Configuration Register (CS4 Space)
0x01E0 001C
A4CR
Asynchronous 4 Configuration Register (CS5 Space)
0x01E0 0020 - 0x01E0 003F
-
Reserved
0x01E0 0040
EIRR
EMIF Interrupt Raw Register
0x01E0 0044
EIMR
EMIF Interrupt Mask Register
0x01E0 0048
EIMSR
EMIF Interrupt Mask Set Register
0x01E0 004C
EIMCR
EMIF Interrupt Mask Clear Register
0x01E0 0050 - 0x01E0 005F
0x01E0 0060
-
Reserved
NANDFCR
NAND Flash Control Register
0x01E0 0064
NANDFSR
NAND Flash Status Register
0x01E0 0070
NANDF1ECC
NAND Flash 1 ECC Register (CS2 Space)
0x01E0 0074
NANDF2ECC
NAND Flash 2 ECC Register (CS3 Space)
0x01E0 0078
NANDF3ECC
NAND Flash 3 ECC Register (CS4 Space)
0x01E0 007C
NANDF4ECC
NAND Flash 4 ECC Register (CS5 Space)
0x01E0 0080 - 0x01E0 0FFF
156
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-
Reserved
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6.9.3
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
EMIFA Electrical Data/Timing
Table 6-24. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module (1)
(see Figure 6-14 and Figure 6-15)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
NOM
UNIT
MAX
READS and WRITES
2
tw(EM_WAIT)
Pulse duration, EM_WAIT assertion and deassertion
2E
ns
READS
12
tsu(EMDV-EMOEH)
Setup time, EM_D[7:0] valid before EM_OE high
13
th(EMOEH-EMDIV)
Hold time, EM_D[7:0] valid after EM_OE high
14
tsu(EMWAIT-
5
ns
0
ns
(2)
4E + 5
ns
Setup time, EM_WAIT asserted before EM_WE high (2)
4E + 5
ns
Setup time, EM_WAIT asserted before EM_OE high
EMOEH)
WRITES
28
tsu(EMWAITEMWEH)
(1)
(2)
E = SYSCLK3 period in ns for EMIFA. For example, when running the DSP CPU at 600 MHz, use E = 10 ns.
Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAIT must be asserted to add extended
wait states. Figure 6-16 and Figure 6-17 describe EMIF transactions that include extended wait states inserted during the STROBE
phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where
the HOLD phase would begin if there were no extended wait cycles.
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Table 6-25. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module (1) (2) (see Figure 6-14 and Figure 6-15)
NO
.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
UNIT
NOM
MAX
READS and WRITES
1
td(TURNAROUND)
Turn around time
(TA + 1) * E
ns
(RS + RST + RH +
TA + 4) * E (3)
ns
READS
3
4
5
tc(EMRCYCLE)
tsu(EMCSL-EMOEL)
th(EMOEH-EMCSH)
EMIF read cycle time
Output setup time, EM_CS[5:2] low to
EM_OE low (SS = 0)
(RS + 1) * E - 4
(RS + 1) * E + 4
ns
Output setup time, EM_CS[5:2] low to
EM_OE low (SS = 1)
-4
4
ns
Output hold time, EM_OE high to
EM_CS[5:2] high (SS = 0)
(RH + 1) * E - 4
(RH + 1) * E + 4
ns
Output hold time, EM_OE high to
EM_CS[5:2] high (SS = 1)
-4
4
ns
6
tsu(EMBAV-EMOEL)
Output setup time, EM_BA[1:0] valid to
EM_OE low
(RS + 1) * E - 4
(RS + 1) * E + 4
ns
7
th(EMOEH-EMBAIV)
Output hold time, EM_OE high to
EM_BA[1:0] invalid
(RH + 1) * E - 4
(RH + 1) * E + 4
ns
8
tsu(EMBAV-EMOEL)
Output setup time, EM_A[21:0] valid to
EM_OE low
(RS + 1) * E - 4
(RS + 1) * E + 4
ns
9
th(EMOEH-EMBAIV)
Output hold time, EM_OE high to
EM_A[21:0] invalid
(RH + 1) * E - 4
(RH + 1) * E + 4
ns
10
tw(EMOEL)
EM_OE active low width
td(EMWAITH-EMOEH)
Delay time from EM_WAIT deasserted
to EM_OE high
11
(RST + 1) * E (3)
ns
4E + 4
ns
WRITES
15
16
17
tc(EMWCYCLE)
tsu(EMCSL-EMWEL)
th(EMWEH-EMCSH)
(WS + WST + WH +
TA + 4) * E (3)
EMIF write cycle time
ns
Output setup time, EM_CS[5:2] low to
EM_WE low (SS = 0)
(WS + 1) * E - 4
(WS + 1) * E + 4
ns
Output setup time, EM_CS[5:2] low to
EM_WE low (SS = 1)
-4
4
ns
Output hold time, EM_WE high to
EM_CS[5:2] high (SS = 0)
(WH + 1) * E - 4
(WH + 1) * E + 4
ns
Output hold time, EM_WE high to
EM_CS[5:2] high (SS = 1)
-4
4
ns
18
tsu(EMRNW-EMWEL)
Output setup time, EM_R/W valid to
EM_WE low
(WS + 1) * E - 4
(WS + 1) * E + 4
ns
19
th(EMWEH-EMRNW)
Output hold time, EM_WE high to
EM_R/W invalid
(WH + 1) * E - 4
(WH + 1) * E + 4
ns
20
tsu(EMBAV-EMWEL)
Output setup time, EM_BA[1:0] valid to
EM_WE low
(WS + 1) * E - 4
(WS + 1) * E + 4
ns
21
th(EMWEH-EMBAIV)
Output hold time, EM_WE high to
EM_BA[1:0] invalid
(WH + 1) * E - 4
(WH + 1) * E + 4
ns
22
tsu(EMAV-EMWEL)
Output setup time, EM_A[21:0] valid to
EM_WE low
(WS + 1) * E - 4
(WS + 1) * E + 4
ns
23
th(EMWEH-EMAIV)
Output hold time, EM_WE high to
EM_A[21:0] invalid
(WH + 1) * E - 4
(WH + 1) * E + 4
ns
(1)
(2)
(3)
158
RS = Read setup, RST = Read STrobe, RH = Read Hold, WS = Write Setup, WST = Write STrobe, WH = Write Hold, TA = Turn
Around, EW = Extend Wait mode, SS = Select Strobe mode. These parameters are programmed via the Asynchronous n Configuration
and Asynchronous Wait Cycle Configuration Registers.
E = SYSCLK3 period in ns for EMIFA. For example, when running the DSP CPU at 600 MHz, use E = 10 ns.
When EW = 1, the EMIF will extend the strobe period up to 4,096 additional cycles when the EM_WAIT pin is asserted by the external
device.
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Table 6-25. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module (see Figure 6-14 and Figure 6-15) (continued)
NO
.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
24
tw(EMWEL)
EM_WE active low width
25
td(EMWAITH-EMWEH)
Delay time from EM_WAIT deasserted
to EM_WE high
26
tsu(EMDV-EMWEL)
Output setup time, EM_D[7:0] valid to
EM_WE low
27
th(EMWEH-EMDIV)
Output hold time, EM_WE high to
EM_D[7:0] invalid
UNIT
NOM
MAX
(WST + 1) * E (3)
ns
4E + 4
ns
(WS + 1) * E - 4
(WS + 1) * E + 4
ns
(WH + 1) * E - 4
(WH + 1) * E + 4
ns
3
1
EM_CS[5:2]
EM_R/W
EM_BA[1:0]
EM_A[21:0]
4
8
5
9
6
7
10
EM_OE
13
12
EM_D[7:0]
EM_WE
Figure 6-14. Asynchronous Memory Read Timing for EMIF
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15
1
EM_CS[5:2]
EM_R/W
EM_BA[1:0]
EM_A[21:0]
16
17
18
19
20
21
24
22
23
EM_WE
27
26
EM_D[7:0]
EM_OE
Figure 6-15. Asynchronous Memory Write Timing for EMIF
EM_CS[5:2]
SETUP
STROBE
Extended Due to EM_WAIT
STROBE
HOLD
EM_BA[1:0]
EM_A[21:0]
EM_D[7:0]
14
11
EM_OE
2
EM_WAIT
Asserted
2
Deasserted
Figure 6-16. EM_WAIT Read Timing Requirements
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EM_CS[5:2]
SETUP
STROBE
Extended Due to EM_WAIT
STROBE
HOLD
EM_BA[1:0]
EM_A[21:0]
EM_D[7:0]
28
25
EM_WE
2
EM_WAIT
Asserted
2
Deasserted
Figure 6-17. EM_WAIT Write Timing Requirements
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DDR2 Memory Controller
The DDR2 Memory Controller is a dedicated interface to DDR2 SDRAM. It supports JESD79D-2A
standard compliant DDR2 SDRAM Devices and can interface to either 16-bit or 32-bit DDR2 SDRAM
devices. For details on the DDR2 Memory Controller, see the TMS320C642x DSP Peripherals Overview
Reference Guide (literature number SPRUEM3) and the TMS320C642x DSP DDR2 Memory Controller
User's Guide (literature number SPRUEM4).
A memory map of the DDR2 Memory Controller registers is shown in Table 6-26.
Table 6-26. DDR2 Memory Controller Registers
HEX ADDRESS RANGE
ACRONYM
0x01C4 004C
DDRVTPER
0x01C4 2038
DDRVTPR
0x2000 0000 - 0x2000 0003
-
REGISTER NAME
DDR2 VTP Enable Register
DDR2 VTP Register
Reserved
0x2000 0004
SDRSTAT
0x2000 0008
SDBCR
SDRAM Bank Configuration Register
0x2000 000C
SDRCR
SDRAM Refresh Control Register
0x2000 0010
SDTIMR
SDRAM Timing Register
0x2000 0014
SDTIMR2
SDRAM Timing Register 2
0x2000 0020
PBBPR
0x2000 0024 - 0x2000 00BF
-
SDRAM Status Register
Peripheral Bus Burst Priority Register
Reserved
0x2000 00C0
IRR
Interrupt Raw Register
0x2000 00C4
IMR
Interrupt Masked Register
0x2000 00C8
IMSR
Interrupt Mask Set Register
0x2000 00CC
IMCR
Interrupt Mask Clear Register
0x2000 00D0 - 0x2000 00E3
0x2000 00E4
0x2000 00E8 - 0x2000 00EF
0x2000 00F0
0x2000 00E8 - 0x2000 7FFF
162
DDRPHYCR
VTPIOCR
-
Peripheral Information and Electrical Specifications
Reserved
DDR PHY Control Register
Reserved
DDR VTP IO Control Register
Reserved
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6.9.4.1 DDR2 Memory Controller Electrical Data/Timing
The Implementing DDR2 PCB Layout on the TMS320C6421/4 DMSoC Application Report (literature
number SPRAAL7) specifies a complete DDR2 interface solution for the C6421 as well as a list of
compatible DDR2 devices. TI has performed the simulation and system characterization to ensure all
DDR2 interface timings in this solution are met.
TI only supports board designs that follow the guidelines outlined in the Implementing DDR2 PCB Layout
on the TMS320C6421/4 DMSoC Application Report (literature number SPRAAL7).
Table 6-27. Switching Characteristics Over Recommended Operating Conditions for DDR2 Memory
Controller (1) (2)(see Figure 6-18)
NO.
1
(1)
(2)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
tc(DDR_CLK)
MIN
MAX
6
8
Cycle time, DDR_CLK
UNIT
ns
DDR_CLK cycle time = 2 x PLL2 _SYSCLK1 cycle time.
The PLL2 Controller must be programmed such that the resulting DDR_CLK clock frequency is within the specified range.
1
DDR_CLK
Figure 6-18. DDR2 Memory Controller Clock Timing
6.10 Universal Asynchronous Receiver/Transmitter (UART)
C6421 has 1 UART peripheral (UART0). UART0 has the following features:
• 16-byte storage space for both the transmitter and receiver FIFOs
• 1, 4, 8, or 14 byte selectable receiver FIFO trigger level for autoflow control and DMA
• DMA signaling capability for both received and transmitted data
• Programmable auto-rts and auto-cts for autoflow control
• Frequency pre-scale values from 1 to 65,535 to generate appropriate baud rates
• Prioritized interrupts
• Programmable serial data formats
– 5, 6, 7, or 8-bit characters
– Even, odd, or no parity bit generation and detection
– 1, 1.5, or 2 stop bit generation
• False start bit detection
• Line break generation and detection
• Internal diagnostic capabilities
– Loopback controls for communications link fault isolation
– Break, parity, overrun, and framing error simulation
• Modem control functions (CTS, RTS) on
The UART0 register is listed in Table 6-28.
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6.10.1 UART Peripheral Register Description(s)
Table 6-28. UART0 Register Descriptions
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
0x01C2 0000
RBR
UART0 Receiver Buffer Register (Read Only)
0x01C2 0000
THR
UART0 Transmitter Holding Register (Write Only)
0x01C2 0004
IER
UART0 Interrupt Enable Register
0x01C2 0008
IIR
UART0 Interrupt Identification Register (Read Only)
0x01C2 0008
FCR
UART0 FIFO Control Register (Write Only)
0x01C2 000C
LCR
UART0 Line Control Register
0x01C2 0010
MCR
UART0 Modem Control Register
0x01C2 0014
LSR
UART0 Line Status Register
0x01C2 0018
-
Reserved
0x01C2 001C
-
Reserved
0x01C2 0020
DLL
UART0 Divisor Latch (LSB)
0x01C2 0024
DLH
UART0 Divisor Latch (MSB)
0x01C2 0028
PID1
Peripheral Identification Register 1
0x01C2 002C
PID2
Peripheral Identification Register 2
0x01C2 0030
PWREMU_MGMT
UART0 Power and Emulation Management Register
0x01C2 0034 - 0x01C2 03FF
-
Reserved
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6.10.2 UART Electrical Data/Timing
Table 6-29. Timing Requirements for UARTx Receive (1) (see Figure 6-19)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
UNIT
MIN
MAX
4
tw(URXDB)
Pulse duration, UART receive data bit (URXDx) [15/30/100 pF]
0.96U
1.05U
ns
5
tw(URXSB)
Pulse duration, UART receive start bit [15/30/100 pF]
0.96U
1.05U
ns
U = UART baud time = 1/programmed baud rate.
Table 6-30. Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (1)
(see Figure 6-19)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
(1)
UNIT
MAX
1
f(baud)
Maximum programmable baud rate
2
tw(UTXDB)
Pulse duration, UART transmit data bit (UTXDx) [15/30/100 pF]
U-2
U+2
128
kHz
ns
3
tw(UTXSB)
Pulse duration, UART transmit start bit [15/30/100 pF]
U-2
U+2
ns
U = UART baud time = 1/programmed baud rate.
3
2
UART_TXDn
Start
Bit
Data Bits
5
4
UART_RXDn
Start
Bit
Data Bits
Figure 6-19. UARTx Transmit/Receive Timing
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6.11 Inter-Integrated Circuit (I2C)
The inter-integrated circuit (I2C) module provides an interface between C6421 and other devices
compliant with Philips Semiconductors Inter-IC bus (I2C-bus™) specification version 2.1. External
components attached to this 2-wire serial bus can transmit/receive up to 8-bit data to/from the DSP
through the I2C module. The I2C port does not support CBUS compatible devices.
The I2C port supports:
• Compatible with Philips I2C Specification Revision 2.1 (January 2000)
• Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise Filter to Remove Noise 50 ns or less
• Seven- and Ten-Bit Device Addressing Modes
• Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
• Events: DMA, Interrupt, or Polling
• Slew-Rate Limited Open-Drain Output Buffers
I2C Module
Clock
Prescale
Peripheral Clock
(DSP/18)
ICPSC
Control
Bit Clock
Generator
SCL
Noise
Filter
I2C Clock
ICCLKH
ICOAR
Own
Address
ICSAR
Slave
Address
ICMDR
Mode
ICCNT
Data
Count
ICCLKL
Transmit
ICXSR
Transmit
Shift
ICDXR
Transmit
Buffer
ICEMDR
Extended
Mode
SDA
I2C Data
Interrupt/DMA
Noise
Filter
Receive
ICDRR
Receive
Buffer
ICRSR
Receive
Shift
ICIMR
Interrupt
Mask/Status
ICSTR
Interrupt
Status
ICIVR
Interrupt
Vector
Shading denotes control/status registers.
Figure 6-20. I2C Module Block Diagram
For more detailed information on the I2C peripheral, see the TMS320C642x DSP Peripherals Overview
Reference Guide (literature number SPRUEM3).
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I2C Peripheral Register Description(s)
Table 6-31. I2C Registers
HEX ADDRESS RANGE
ACRONYM
0x1C2 1000
ICOAR
I2C Own Address Register
REGISTER NAME
0x1C2 1004
ICIMR
I2C Interrupt Mask Register
0x1C2 1008
ICSTR
I2C Interrupt Status Register
0x1C2 100C
ICCLKL
I2C Clock Divider Low Register
0x1C2 1010
ICCLKH
I2C Clock Divider High Register
0x1C2 1014
ICCNT
I2C Data Count Register
0x1C2 1018
ICDRR
I2C Data Receive Register
0x1C2 101C
ICSAR
I2C Slave Address Register
0x1C2 1020
ICDXR
I2C Data Transmit Register
0x1C2 1024
ICMDR
I2C Mode Register
0x1C2 1028
ICIVR
I2C Interrupt Vector Register
0x1C2 102C
ICEMDR
I2C Extended Mode Register
0x1C2 1030
ICPSC
I2C Prescaler Register
0x1C2 1034
ICPID1
I2C Peripheral Identification Register 1
0x1C2 1038
ICPID2
I2C Peripheral Identification Register 2
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I2C Electrical Data/Timing
6.11.2.1
Inter-Integrated Circuits (I2C) Timing
Table 6-32. Timing Requirements for I2C Timings (1) (see Figure 6-21)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
STANDARD
MODE
MIN
1
UNIT
FAST MODE
MAX
MIN
MAX
tc(SCL)
Cycle time, SCL
10
2.5
µs
2
tsu(SCLH-SDAL)
Setup time, SCL high before SDA low (for a repeated START
condition)
4.7
0.6
µs
3
th(SCLL-SDAL)
Hold time, SCL low after SDA low (for a START and a repeated
START condition)
4
0.6
µs
4
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
5
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
6
tsu(SDAV-SCLH)
Setup time, SDA valid before SCL high
250
100 (2)
7
th(SDA-SCLL)
Hold time, SDA valid after SCL low
0 (3)
0 (3)
8
tw(SDAH)
Pulse duration, SDA high between STOP and START
conditions
4.7
1.3
(5)
ns
0.9 (4)
µs
µs
9
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb
300
ns
10
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb (5)
300
ns
(5)
300
ns
300
11
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb
12
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb (5)
13
tsu(SCLH-SDAH)
Setup time, SCL high before SDA high (for STOP condition)
14
tw(SP)
Pulse duration, spike (must be suppressed)
15
Cb (5)
Capacitive load for each bus line
(1)
(2)
(3)
(4)
(5)
4
0.6
ns
µs
0
400
50
ns
400
pF
The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH)≥ 250 ns must then be
met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH)= 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
11
9
SDA
6
8
14
4
13
5
10
SCL
1
12
3
2
7
3
Stop
Start
Repeated
Start
Stop
Figure 6-21. I2C Receive Timings
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Table 6-33. Switching Characteristics for I2C Timings (1) (see Figure 6-22)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
PARAMETER
STANDARD
MODE
MIN
(1)
MAX
UNIT
FAST MODE
MIN
MAX
16
tc(SCL)
Cycle time, SCL
10
2.5
µs
17
td(SCLH-SDAL)
Delay time, SCL high to SDA low (for a repeated START
condition)
4.7
0.6
µs
18
td(SDAL-SCLL)
Delay time, SDA low to SCL low (for a START and a repeated
START condition)
4
0.6
µs
19
tw(SCLL)
Pulse duration, SCL low
4.7
1.3
µs
20
tw(SCLH)
Pulse duration, SCL high
4
0.6
µs
21
td(SDAV-SCLH)
Delay time, SDA valid to SCL high
250
100
ns
22
tv(SCLL-SDAV)
Valid time, SDA valid after SCL low
0
0
23
tw(SDAH)
Pulse duration, SDA high between STOP and START
conditions
4.7
1.3
24
tr(SDA)
Rise time, SDA
1000
20 + 0.1Cb (1)
300
ns
25
tr(SCL)
Rise time, SCL
1000
20 + 0.1Cb (1)
300
ns
26
tf(SDA)
Fall time, SDA
300
20 + 0.1Cb (1)
300
ns
27
tf(SCL)
Fall time, SCL
300
20 + 0.1Cb (1)
300
ns
28
td(SCLH-SDAH)
Delay time, SCL high to SDA high (for STOP condition)
29
Cp
Capacitance for each I2C pin
10
pF
4
0.9
µs
0.6
10
µs
µs
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
26
24
SDA
21
23
19
28
20
25
SCL
16
27
18
17
22
18
Stop
Start
Repeated
Start
Stop
Figure 6-22. I2C Transmit Timings
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6.12 Host-Port Interface (HPI) Peripheral
6.12.1 HPI Device-Specific Information
The C6421 device includes a user-configurable 16-bit Host-port interface (HPI16).
Software handshaking via the HRDY bit of the Host Port Control Register (HPIC) is not supported on the
C6421.
6.12.2 HPI Peripheral Register Description(s)
Table 6-34. HPI Control Registers
HEX ADDRESS RANGE
ACRONYM
01C6 7800
PID
01C6 7804
PWREMU_MGMT
01C6 7808 - 01C6 7824
-
Reserved
01C6 7828
-
Reserved
01C6 782C
-
Reserved
01C6 7830
HPIC
HPI control register
01C6 7834
HPIA
(HPIAW) (1)
HPI address register
(Write)
01C6 7838
HPIA
(HPIAR) (1)
HPI address register
(Read)
01C6 783C - 01C6 7FFF
-
(1)
170
REGISTER NAME
COMMENTS
Peripheral Identification Register
HPI power and emulation management register
The CPU has read/write
access to the
PWREMU_MGMT register.
The Host and the CPU both
have read/write access to the
HPIC register.
The Host has read/write
access to the HPIA registers.
The CPU has only read
access to the HPIA registers.
Reserved
There are two 32-bit HPIA registers: HPIAR for read operations and HPIAW for write operations. The HPI can be configured such that
HPIAR and HPIAW act as a single 32-bit HPIA (single-HPIA mode) or as two separate 32-bit HPIAs (dual-HPIA mode) from the
perspective of the Host. The CPU can access HPIAW and HPIAR independently. For more details about the HPIA registers and their
modes, see the TMS320C642x DSP Host Port Interface (HPI) User's Guide (literature number SPRUEM9).
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6.12.3 HPI Electrical Data/Timing
Table 6-35. Timing Requirements for Host-Port Interface Cycles (1) (2) (see Figure 6-23 through Figure 6-24)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
1
tsu(SELV-HSTBL)
Setup time, select signals (3) valid before HSTROBE low
5
ns
2
th(HSTBL-SELV)
Hold time, select signals (3) valid after HSTROBE low
2
ns
3
tw(HSTBL)
Pulse duration, HSTROBE active low
15
ns
4
tw(HSTBH)
Pulse duration, HSTROBE inactive high between consecutive accesses
2M
ns
11
tsu(HDV-HSTBH)
Setup time, host data valid before HSTROBE high
5
ns
12
th(HSTBH-HDV)
Hold time, host data valid after HSTROBE high
0
ns
th(HRDYL-HSTBL)
Hold time, HSTROBE high after HRDY low. HSTROBE should not be
inactivated until HRDY is active (low); otherwise, HPI writes will not
complete properly.
0
ns
13
(1)
(2)
(3)
UNIT
MAX
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
M = SYSCLK3 period = (CPU clock frequency)/6 in ns. For example, when running parts at 600 MHz, use M = 10 ns.
Select signals include: HCNTL[1:0], HR/W and HHWIL.
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Table 6-36. Switching Characteristics for Host-Port Interface Cycles (1) (2) (3)
(see Figure 6-23 through Figure 6-24)
NO.
PARAMETER
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
MIN
UNIT
MAX
For HPI Write, HRDY can go high (not
ready) for these HPI Write conditions;
otherwise, HRDY stays low (ready):
Case 1: Back-to-back HPIA writes (can
be either first or second half-word)
Case 2: HPIA write following a
PREFETCH command (can be either
first or second half-word)
Case 3: HPID write when FIFO is full
or flushing (can be either first or
second half-word)
Case 4: HPIA write and Write FIFO not
empty
For HPI Read, HRDY can go high (not
ready) for these HPI Read conditions:
Case 1: HPID read (with
auto-increment) and data not in Read
FIFO (can only happen to first
half-word of HPID access)
Case 2: First half-word access of HPID
Read without auto-increment
For HPI Read, HRDY stays low (ready)
for these HPI Read conditions:
Case 1: HPID read with auto-increment
and data is already in Read FIFO
(applies to either half-word of HPID
access)
Case 2: HPID read without
auto-increment and data is already in
Read FIFO (always applies to second
half-word of HPID access)
Case 3: HPIC or HPIA read (applies to
either half-word access)
5
td(HSTBL-HRDYV)
Delay time, HSTROBE low to
HRDY valid
6
ten(HSTBL-HD)
Enable time, HD driven from HSTROBE low
7
td(HRDYL-HDV)
Delay time, HRDY low to HD valid
8
toh(HSTBH-HDV)
Output hold time, HD valid after HSTROBE high
14
tdis(HSTBH-HDV)
Disable time, HD high-impedance from HSTROBE high
15
18
(1)
(2)
(3)
172
td(HSTBL-HDV)
td(HSTBH-HRDYV)
12
2
ns
ns
0
1.5
ns
ns
12
ns
Delay time, HSTROBE low to
HD valid
For HPI Read. Applies to conditions
where data is already residing in
HPID/FIFO:
Case 1: HPIC or HPIA read
Case 2: First half-word of HPID read
with auto-increment and data is
already in Read FIFO
Case 3: Second half-word of HPID
read with or without auto-increment
15
ns
Delay time, HSTROBE high to
HRDY valid
For HPI Write, HRDY can go high (not
ready) for these HPI Write conditions;
otherwise, HRDY stays low (ready):
Case 1: HPID write when Write FIFO is
full (can happen to either half-word)
Case 2: HPIA write (can happen to
either half-word)
Case 3: HPID write without
auto-increment (only happens to
second half-word)
12
ns
M = SYSCLK3 period = (CPU clock frequency)/6 in ns. For example, when running parts at 600 MHz, use M = 10 ns.
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
By design, whenever HCS is driven inactive (high), HPI will drive HRDY active low.
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HCS
HAS
2
2
1
1
HCNTL[1:0]
2
1
2
1
HR/W
2
1
2
1
HHWIL
4
HSTROBE
3
3
(A)(C)
15
15
14
14
6
8
HD[15:0]
(output)
5
HRDY
A.
B.
C.
13
7
6
1st Half-Word
8
2nd Half-Word
(B)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with autoincrementing) and the state of the FIFO, transitions on HRDY may or may not occur.
For more detailed information on the HPI peripheral, see the TMS320C642x Host Port Interface (HPI) User’s Guide
(literature number SPRUEM9).
HCS reflects typical HCS behavior when HSTROBE assertion is caused by HDS1 or HDS2. HCS timing requirements are
reflected by parameters for HSTROBE.
Figure 6-23. HPI16 Read Timing (HAS Not Used, Tied High)
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HCS
HAS
1
1
2
2
HCNTL[1:0]
1
1
2
2
HR/W
1
1
2
2
HHWIL
3
HSTROBE
(A)(C)
11
C.
12
1st Half-Word
5
HRDY
11
12
HD[15:0]
(input)
A.
B.
3
4
13
2nd Half-Word
18
13
18
5
(B)
HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-incrementing) and the
state of the FIFO, transitions on HRDY may or may not occur.
For more detailed information on the HPI peripheral, see the TMS320C642x Host Port Interface (HPI) User’s Guide (literature number
SPRUEM9).
HCS reflects typical HCS behavior when HSTROBE assertion is caused by HDS1 or HDS2. HCS timing requirements are reflected by
parameters for HSTROBE.
Figure 6-24. HPI16 Write Timing (HAS Not Used, Tied High)
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6.13 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
• Full-duplex communication
• Double-buffered data registers, which allow a continuous data stream
• Independent framing and clocking for receive and transmit
• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
• External shift clock or an internal, programmable frequency shift clock for data transfer
6.13.1 McBSP Peripheral Register Description(s)
Table 6-37. McBSP 0 Registers
HEX ADDRESS RANGE
01D0 0000
ACRONYM
REGISTER NAME
DRR0
McBSP0 Data Receive Register
01D0 0004
DXR0
McBSP0 Data Transmit Register
01D0 0008
SPCR0
01D0 000C
RCR0
McBSP0 Receive Control Register
01D0 0010
XCR0
McBSP0 Transmit Control Register
01D0 0014
SRGR0
01D0 0018
MCR0
01D0 001C
RCERE00
McBSP0 Enhanced Receive Channel Enable Register
0 Partition A/B
01D0 0020
XCERE00
McBSP0 Enhanced Transmit Channel Enable Register
0 Partition A/B
01D0 0024
PCR0
01D0 0028
RCERE10
McBSP0 Enhanced Receive Channel Enable Register
1 Partition C/D
01D0 002C
XCERE10
McBSP0 Enhanced Transmit Channel Enable Register
1 Partition C/D
01D0 0030
RCERE20
McBSP0 Enhanced Receive Channel Enable Register
2 Partition E/F
01D0 0034
XCERE20
McBSP0 Enhanced Transmit Channel Enable Register
2 Partition E/F
01D0 0038
RCERE30
McBSP0 Enhanced Receive Channel Enable Register
3 Partition G/H
01D0003C
XCERE30
McBSP0 Enhanced Transmit Channel Enable Register
3 Partition G/H
01D0 0040 - 01D0 07FF
-
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COMMENTS
The CPU and EDMA3
controller can only read
this register; they cannot
write to it.
McBSP0 Serial Port Control Register
McBSP0 Sample Rate Generator register
McBSP0 Multichannel Control Register
McBSP0 Pin Control Register
Reserved
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6.13.1.1 McBSP Electrical Data/Timing
6.13.1.1.1
Multichannel Buffered Serial Port (McBSP) Timing
Table 6-38. Timing Requirements for McBSP (1) (see Figure 6-25)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
2
tc(CKRX)
Cycle time, CLKR/X
CLKR/X ext
2P (2) (3)
ns
3
tw(CKRX)
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X ext
P - 1 (4)
ns
5
tsu(FRH-CKRL)
Setup time, external FSR high before CLKR low
6
th(CKRL-FRH)
Hold time, external FSR high after CLKR low
7
tsu(DRV-CKRL)
Setup time, DR valid before CLKR low
8
th(CKRL-DRV)
Hold time, DR valid after CLKR low
10
tsu(FXH-CKXL)
Setup time, external FSX high before CLKX low
11
th(CKXL-FXH)
Hold time, external FSX high after CLKX low
(1)
(2)
(3)
(4)
176
UNIT
MAX
CLKR int
14
CLKR ext
4
CLKR int
6
CLKR ext
4
CLKR int
14
CLKR ext
4
CLKR int
3.5
CLKR ext
3
CLKX int
14
CLKX ext
4
CLKX int
6
CLKX ext
3
ns
ns
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA
limitations and AC timing requirements.
This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 6-39. Switching Characteristics Over Recommended Operating Conditions for McBSP (1) (2)
(see Figure 6-25)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
1
td(CKSH-CKRXH)
Delay time, CLKS high to CLKR/X high for internal CLKR/X
generated from CLKS input
2
tc(CKRX)
Cycle time, CLKR/X
(2)
(3)
(4)
(5)
(6)
(7)
(8)
3
CLKR/X int
2P (3) (4) (5)
(6)
ns
ns
Pulse duration, CLKR/X high or CLKR/X low
CLKR/X int
td(CKRH-FRV)
Delay time, CLKR high to internal FSR valid
CLKR int
-4
5.5
CLKX int
-4
5.5
CLKX ext
2.5
14.5
CLKX int
-5.5
7.5
CLKX ext
-2.1
16
CLKX int
-4 + D1 (7)
5.5 + D2 (7)
(7)
14.5 + D2 (7)
Delay time, CLKX high to internal FSX valid
12
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
13
td(CKXH-DXV)
Delay time, CLKX high to DX valid
td(FXH-DXV)
CLKX ext
2.5 + D1
C+2
ns
tw(CKRX)
td(CKXH-FXV)
ns
(6)
4
9
C-2
10
3
14
(1)
UNIT
MAX
Delay time, FSX high to DX valid
FSX int
-4 (8)
5 (8)
ONLY applies when in data
delay 0 (XDATDLY = 00b) mode
FSX ext
1 (8)
14.5 (8)
ns
ns
ns
ns
CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
Minimum delay times also represent minimum output hold times.
Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements.
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
Use whichever value is greater.
C = H or L
S = sample rate generator input clock = P if CLKSM = 1 (P = SYSCLK3 period)
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see (4) above).
Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
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CLKS
1
2
3
3
CLKR
4
4
FSR (int)
5
6
FSR (ext)
7
DR
8
Bit(n-1)
(n-2)
(n-3)
2
3
3
CLKX
9
FSX (int)
11
10
FSX (ext)
FSX (XDATDLY=00b)
14
13 (A)
Bit(n-1)
12
DX
A.
Bit 0
13 (A)
(n-2)
(n-3)
Parameter No. 13 applies to the first data bit only when XDATDLY ≠ 0.
Figure 6-25. McBSP Timing(B)
Table 6-40. Timing Requirements for FSR When GSYNC = 1 (see Figure 6-26)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
UNIT
MAX
1
tsu(FRH-CKSH)
Setup time, FSR high before CLKS high
4
ns
2
th(CKSH-FRH)
Hold time, FSR high after CLKS high
4
ns
CLKS
1
2
FSR external
CLKR/X (no need to resync)
CLKR/X (needs resync)
Figure 6-26. FSR Timing When GSYNC = 1
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Table 6-41. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 (1) (2)
(see Figure 6-27)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXL)
Setup time, DR valid before CLKX low
5
th(CKXL-DRV)
Hold time, DR valid after CLKX low
UNIT
SLAVE
MAX
MIN
MAX
14
2 - 3P
ns
4
5 + 6P
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
Table 6-42. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 0 (1) (2) (see Figure 6-27)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MASTER (3)
(4)
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high (5)
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
6
tdis(CKXL-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX low
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following
last data bit from FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
UNIT
SLAVE
MIN
MAX
T-4
T + 5.5
L-4
L+4
-4
5.5
L-6
L + 7.5
MIN
MAX
ns
ns
3P + 2.8
5P + 17
ns
ns
P+3
3P + 17
ns
2P + 1.8
4P + 17
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = SYSCLK3 period)
S = Sample rate generator input clock = 2P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 6-27. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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Table 6-43. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 (1) (2)
(see Figure 6-28)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
14
2 - 3P
ns
4
5 + 6P
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
Table 6-44. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 0 (1) (2) (see Figure 6-28)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MASTER (3)
(4)
1
th(CKXL-FXL)
Hold time, FSX low after CLKX low
2
td(FXL-CKXH)
Delay time, FSX low to CLKX high (5)
3
td(CKXL-DXV)
6
7
UNIT
SLAVE
MIN
MAX
MIN
MAX
L-4
L + 5.5
T-4
T+4
ns
Delay time, CLKX low to DX valid
-4
5.5
3P + 2.8
5P + 17
ns
tdis(CKXL-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX low
-6
7.5
3P + 2
5P + 17
ns
td(FXL-DXV)
Delay time, FSX low to DX valid
H-4
H + 5.5
2P + 2
4P + 17
ns
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = SYSCLK3 period)
S = Sample rate generator input clock = 2P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
6
Bit 0
7
FSX
DX
3
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 6-28. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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Table 6-45. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 (1) (2)
(see Figure 6-29)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
14
2 - 3P
ns
4
5 + 6P
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
Table 6-46. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 1 (1) (2) (see Figure 6-29)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MASTER (3)
(4)
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low (5)
3
td(CKXL-DXV)
Delay time, CLKX low to DX valid
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
7
tdis(FXH-DXHZ)
Disable time, DX high impedance following
last data bit from FSX high
8
td(FXL-DXV)
Delay time, FSX low to DX valid
UNIT
SLAVE
MIN
MAX
T-4
T + 5.5
H-4
H+4
-4
5.5
H-6
H + 7.5
MIN
MAX
ns
ns
3P + 2.8
5P + 17
ns
ns
P+3
3P + 17
ns
2P + 2
4P + 17
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = SYSCLK3 period)
S = Sample rate generator input clock = 2P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
7
6
DX
8
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 6-29. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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Table 6-47. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 (1) (2)
(see Figure 6-30)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MASTER
MIN
(1)
(2)
4
tsu(DRV-CKXH)
Setup time, DR valid before CLKX high
5
th(CKXH-DRV)
Hold time, DR valid after CLKX high
UNIT
SLAVE
MAX
MIN
MAX
14
2 - 3P
ns
4
5+ 6P
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
Table 6-48. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 1 (1) (2) (see Figure 6-30)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
(2)
(3)
(4)
(5)
PARAMETER
MASTER (3)
(4)
UNIT
SLAVE
MIN
MAX
H-4
H + 5.5
T-4
T+4
MIN
MAX
1
th(CKXH-FXL)
Hold time, FSX low after CLKX high
2
td(FXL-CKXL)
Delay time, FSX low to CLKX low (5)
ns
3
td(CKXH-DXV)
Delay time, CLKX high to DX valid
-4
5.5
3P + 2.8
5P + 17
ns
6
tdis(CKXH-DXHZ)
Disable time, DX high impedance following
last data bit from CLKX high
-6
7.5
3P + 2
5P + 17
ns
7
td(FXL-DXV)
Delay time, FSX low to DX valid
L-4
L+ 5.5
2P + 2
4P + 17
ns
ns
P = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use P = 10ns.
For all SPI Slave modes, the rate of the internal clock CLKG must be at least 8 times faster than that of the SPI data rate. User should
program sample rate generator to achieve maximum CLKG by setting CLKSM = CLKGDV = 1.
S = Sample rate generator input clock = 2P if CLKSM = 1 (P = SYSCLK3 period)
S = Sample rate generator input clock = 2P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
CLKX
1
2
FSX
6
DX
7
3
Bit 0
Bit(n-1)
4
DR
Bit 0
(n-2)
(n-3)
(n-4)
5
Bit(n-1)
(n-2)
(n-3)
(n-4)
Figure 6-30. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
182
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6.14
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
Multichannel Audio Serial Port (McASP0) Peripheral
The McASP functions as a general-purpose audio serial port optimized for the needs of multichannel
audio applications. The McASP is useful for time-division multiplexed (TDM) stream, Inter-Integrated
Sound (I2S) protocols, and intercomponent digital audio interface transmission (DIT).
6.14.1
McASP0 Device-Specific Information
The C6421 device includes one multichannel audio serial port (McASP) interface peripheral (McASP0).
The McASP0 is a serial port optimized for the needs of multichannel audio applications.
The McASP0 consists of a transmit and receive section. These sections can operate completely
independently with different data formats, separate master clocks, bit clocks, and frame syncs or
alternatively, the transmit and receive sections may be synchronized. The McASP module also includes a
pool of 16 shift registers that may be configured to operate as either transmit data or receive data.
The transmit section of the McASP can transmit data in either a time-division-multiplexed (TDM)
synchronous serial format or in a digital audio interface (DIT) format where the bit stream is encoded for
S/PDIF, AES-3, IEC-60958, CP-430 transmission. The receive section of the McASP supports the TDM
synchronous serial format.
The McASP can support one transmit data format (either a TDM format or DIT format) and one receive
format at a time. All transmit shift registers use the same format and all receive shift registers use the
same format. However, the transmit and receive formats need not be the same.
Both the transmit and receive sections of the McASP also support burst mode which is useful for
non-audio data (for example, passing control information between two DSPs).
The McASP peripheral has additional capability for flexible clock generation, and error detection/handling,
as well as error management.
For more detailed information on and the functionality of the McASP0 peripheral, see the TMS320C642x
DSP Multichannel Audio Serial Port (McASP) User's Guide (literature number SPRUEN1).
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McASP Block Diagram
Figure 6-31 illustrates the major blocks along with external signals of the C6421 McASP0 peripheral; and
shows the 4 serial data [AXR] pins.
McASP0
DIT
RAM
Transmit
Frame Sync
Generator
AFSX0
Transmit
Clock Check
(HighFrequency)
Transmit
Clock
Generator
AHCLKX0
ACLKX0
AMUTE0
AMUTEIN0
Receive
Clock Check
(HighFrequency)
Receive
Clock
Generator
Transmit
Data
Formatter
Receive
Frame Sync
Generator
INDIVIDUALLY PROGRAMMABLE TX/RX/GPIO
DMA Receive
DMS Transmit
Error
Detect
Receive
Data
Formatter
AHCLKR0
ACLKR0
AFSR0
Serializer 0
AXR0[0]
Serializer 1
AXR0[1]
Serializer 2
AXR0[2]
Serializer 3
AXR0[3]
GPIO
Control
Figure 6-31. McASP0 Configuration
184
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McASP0 Peripheral Register Description(s)
Table 6-49. McASP0 Control Registers
HEX ADDRESS RANGE
ACRONYM
REGISTER NAME
01D0 1000
PID
01D0 1004
–
Reserved
01D0 1008
–
Reserved
01D0 100C
–
Reserved
01D0 1010
PFUNC
Pin function register
01D0 1014
PDIR
Pin direction register
Peripheral Identification register [Register value: 0x0010 0101]
01D0 1018
–
Reserved
01D0 101C
–
Reserved
01D0 1020
–
Reserved
01D0 1024 – 01D0 1040
–
Reserved
01D0 1044
GBLCTL
Global control register
01D0 1048
AMUTE
Mute control register
01D0 104C
DLBCTL
Digital Loop-back control register
DIT mode control register
01D0 1050
DITCTL
01D0 1054 – 01D0 105C
–
01D0 1060
RGBLCTL
01D0 1064
RMASK
01D0 1068
RFMT
01D0 106C
AFSRCTL
Reserved
Alias of GBLCTL containing only Receiver Reset bits, allows transmit to be reset
independently from receive.
Receiver format UNIT bit mask register
Receive bit stream format register
Receive frame sync control register
01D0 1070
ACLKRCTL
01D0 1074
AHCLKRCTL
Receive clock control register
01D0 1078
RTDM
01D0 107C
RINTCTL
01D0 1080
RSTAT
Status register – Receiver
01D0 1084
RSLOT
Current receive TDM slot register
01D0 1088
RCLKCHK
01D0 108C – 01D0 109C
–
01D0 10A0
XGBLCTL
01D0 10A4
XMASK
01D0 10A8
XFMT
01D0 10AC
AFSXCTL
High-frequency receive clock control register
Receive TDM slot 0–31 register
Receiver interrupt control register
Receiver clock check control register
Reserved
Alias of GBLCTL containing only Transmitter Reset bits, allows transmit to be reset
independently from receive.
Transmit format UNIT bit mask register
Transmit bit stream format register
Transmit frame sync control register
01D0 10B0
ACLKXCTL
01D0 10B4
AHCLKXCTL
Transmit clock control register
01D0 10B8
XTDM
Transmit TDM slot 0–31 register
01D0 10BC
XINTCTL
Transmit interrupt control register
High-frequency Transmit clock control register
01D0 10C0
XSTAT
Status register – Transmitter
01D0 10C4
XSLOT
Current transmit TDM slot
01D0 10C8
XCLKCHK
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Transmit clock check control register
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Table 6-49. McASP0 Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
01D0 10CC – 01D0 10FC
–
REGISTER NAME
01D0 1100
DITCSRA0
Left (even TDM slot) channel status register file
01D0 1104
DITCSRA1
Left (even TDM slot) channel status register file
01D0 1108
DITCSRA2
Left (even TDM slot) channel status register file
01D0 110C
DITCSRA3
Left (even TDM slot) channel status register file
01D0 1110
DITCSRA4
Left (even TDM slot) channel status register file
01D0 1114
DITCSRA5
Left (even TDM slot) channel status register file
01D0 1118
DITCSRB0
Right (odd TDM slot) channel status register file
01D0 111C
DITCSRB1
Right (odd TDM slot) channel status register file
01D0 1120
DITCSRB2
Right (odd TDM slot) channel status register file
01D0 1124
DITCSRB3
Right (odd TDM slot) channel status register file
01D0 1128
DITCSRB4
Right (odd TDM slot) channel status register file
01D0 112C
DITCSRB5
Right (odd TDM slot) channel status register file
01D0 1130
DITUDRA0
Left (even TDM slot) user data register file
01D0 1134
DITUDRA1
Left (even TDM slot) user data register file
Reserved
01D0 1138
DITUDRA2
Left (even TDM slot) user data register file
01D0 113C
DITUDRA3
Left (even TDM slot) user data register file
01D0 1140
DITUDRA4
Left (even TDM slot) user data register file
01D0 1144
DITUDRA5
Left (even TDM slot) user data register file
01D0 1148
DITUDRB0
Right (odd TDM slot) user data register file
01D0 114C
DITUDRB1
Right (odd TDM slot) user data register file
01D0 1150
DITUDRB2
Right (odd TDM slot) user data register file
01D0 1154
DITUDRB3
Right (odd TDM slot) user data register file
01D0 1158
DITUDRB4
Right (odd TDM slot) user data register file
01D0 115C
DITUDRB5
Right (odd TDM slot) user data register file
01D0 1160 – 01D0 117C
–
01D0 1180
SRCTL0
Reserved
Serializer 0 control register
01D0 1184
SRCTL1
Serializer 1 control register
01D0 1188
SRCTL2
Serializer 2 control register
Serializer 3 control register
01D0 118C
SRCTL3
01D0 1190 – 01D0 11FC
–
01D0 1200
XBUF0
Transmit Buffer for Serializer 0
01D0 1204
XBUF1
Transmit Buffer for Serializer 1
01D0 1208
XBUF2
Transmit Buffer for Serializer 2
01D0 120C
XBUF3
Transmit Buffer for Serializer 3
Reserved
01D0 1210 – 01D0 127C
–
01D0 1280
RBUF0
Reserved
Receive Buffer for Serializer 0
01D0 1284
RBUF1
Receive Buffer for Serializer 1
01D0 1288
RBUF2
Receive Buffer for Serializer 2
01D0 128C
RBUF3
Receive Buffer for Serializer 3
01D0 1290 – 01D0 13FF
–
Reserved
Table 6-50. McASP0 Data Registers
HEX ADDRESS RANGE
01D0 1400 – 01D0 17FF
186
ACRONYM
RBUF/XBUF
REGISTER NAME
McASP0 receive buffers or McASP0 transmit buffers via
the Peripheral Data Bus.
Peripheral Information and Electrical Specifications
COMMENTS
(Used when RBUSEL or
XBUSEL bits = 0 [these bits are
located in the RFMT or XFMT
registers, respectively].)
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SPRS346D – JANUARY 2007 – REVISED JUNE 2008
McASP0 Electrical Data/Timing
6.14.1.3.1
Multichannel Audio Serial Port (McASP) Timing
Table 6-51. Timing Requirements for McASP (see Figure 6-32 and Figure 6-33) (1)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
1
tc(AHCKRX)
Cycle time, AHCLKR/X
25
ns
2
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
10
ns
3
tc(CKRX)
Cycle time, ACLKR/X (2)
ACLKR/X ext
25
ns
4
tw(CKRX)
Pulse duration, ACLKR/X high or low
ACLKR/X ext
10
ns
ACLKR/X int
11
ns
ACLKR/X ext
3
ns
ACLKR/X int
0
ns
ACLKR/X ext
input
4
ns
ACLKR/X ext
output
6
ns
ACLKR/X int
11
ns
ACLKR/X ext
3
ns
ACLKR/X int
3
ns
ACLKR/X ext
input
4
ns
ACLKR/X ext
output
6
ns
5
6
7
8
(1)
(2)
UNIT
MAX
tsu(FRX-CKRX)
th(CKRX-FRX)
tsu(AXR-CKRX)
th(CKRX-AXR)
Setup time, AFSR/X input valid before ACLKR/X latches data
Hold time, AFSR/X input valid after ACLKR/X latches data
Setup time, AXR input valid before ACLKR/X latches data
Hold time, AXR input valid after ACLKR/X latches data
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
There is a clock ratio requirement between the system infrastructure clock, SYSCLK3, and the McASP0 bit clocks, ACLKR/ACLKX. For
proper device operation, the ACLKR/ACLKX frequency must be no faster than of SYSCLK3 frequency.
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Table 6-52. Switching Characteristics Over Recommended Operating Conditions for McASP (1) (2)
(see Figure 6-32 and Figure 6-33) (3)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
9
tc(AHCKRX)
Cycle time, AHCLKR/X
UNIT
MAX
25
ns
AH 2.5
ns
ns
10
tw(AHCKRX)
Pulse duration, AHCLKR/X high or low
11
tc(CKRX)
Cycle time, ACLKR/X (4)
ACLKR/X int
25
12
tw(CKRX)
Pulse duration, ACLKR/X high or low
ACLKR/X int
A - 2.5
ACLKR/X int
-2.25
5.5
ns
ACLKR/X
ext input
0
12.5
ns
ACLKR/X
ext output
0
14
ns
ACLKX int
13
14
15
(1)
(2)
(3)
(4)
188
td(CKRX-FRX)
td(CKX-AXRV)
tdis(CKRX-AXRHZ)
Delay time, ACLKR/X transmit edge to AFSX/R output valid
Delay time, ACLKX transmit edge to AXR output valid
Disable time, AXR high impedance following last data bit from
ACLKR/X transmit edge
ns
-2.25
5.5
ns
ACLKX
ext input
0
12.5
ns
ACLKX
ext output
0
14
ns
ACLKR/X int
-4.5
8
ns
ACLKR/X ext
-4.5
12.5
ns
A = (ACLKR/X period)/2 in ns. For example, when ACLKR/X period is 25 ns, use A = 12.5 ns.
AH = (AHCLKR/X period)/2 in ns. For example, when AHCLKR/X period is 25 ns, use AH = 12.5 ns.
ACLKX internal: ACLKXCTL.CLKXM=1, PDIR.ACLKX = 1
ACLKX external input: ACLKXCTL.CLKXM=0, PDIR.ACLKX=0
ACLKX external output: ACLKXCTL.CLKXM=0, PDIR.ACLKX=1
ACLKR internal: ACLKRCTL.CLKRM=1, PDIR.ACLKR = 1
ACLKR external input: ACLKRCTL.CLKRM=0, PDIR.ACLKR=0
ACLKR external output: ACLKRCTL.CLKRM=0, PDIR.ACLKR=1
There is a clock ratio requirement between the system infrastructure clock, SYSCLK3, and the McASP0 bit clocks, ACLKR/ACLKX. For
proper device operation, the ACLKR/ACLKX frequency must be no faster than of SYSCLK3 frequency.
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2
1
2
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
4
3
4
ACLKR/X (CLKRP = CLKXP = 0)(A)
ACLKR/X (CLKRP = CLKXP = 1)(B)
6
5
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
8
7
AXR[n] (Data In/Receive)
A0
A1
A30 A31 B0 B1
B30 B31 C0 C1
C2 C3
C31
A. For CLKRP = CLKXP = 0, the McASP transmiter is configured for rising edge (to shift data out)and the McASP receiver is configured for falling
edge (to shift data in).
B. For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP receiver is configured for
rising edge (to shift data in).
Figure 6-32. McASP Input Timings
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10
10
9
AHCLKR/X (Falling Edge Polarity)
AHCLKR/X (Rising Edge Polarity)
12
11
12
ACLKR/X (CLKRP = CLKXP = 1)(A)
ACLKR/X (CLKRP = CLKXP = 0)(B)
13
13
13
13
AFSR/X (Bit Width, 0 Bit Delay)
AFSR/X (Bit Width, 1 Bit Delay)
AFSR/X (Bit Width, 2 Bit Delay)
13
13
13
AFSR/X (Slot Width, 0 Bit Delay)
AFSR/X (Slot Width, 1 Bit Delay)
AFSR/X (Slot Width, 2 Bit Delay)
14
15
AXR[n] (Data Out/Transmit)
A0
A1
A30 A31 B0 B1
B30 B31 C0
C1 C2 C3
A.
For CLKRP = CLKXP = 1, the McASP transmitter is configured for falling edge (to shift data out) and the McASP
receiver is configured for rising edge (to shift data in).
B.
For CLKRP = CLKXP = 0, the McASP transmitter is configured for rising edge (to shift data out) and the McASP
receiver is configured for falling edge (to shift data in).
C31
Figure 6-33. McASP Output Timings
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6.15 Ethernet Media Access Controller (EMAC)
The Ethernet Media Access Controller (EMAC) provides an efficient interface between C6421 and the
network. The C6421 EMAC supports two interface modes – Media Independent Interface (MII) and
Reduced Media Independent Interface (RMII). The MII mode supports both 10Base-T (10 Mbits/second
[Mbps]) and 100Base-TX (100 Mbps) in either half- or full-duplex mode. The RMII mode supports both
10Base-T (10 Mbits/second [Mbps]) and 100Base-TX (100 Mbps) in full-duplex mode only. The EMAC
module also supports hardware flow control and quality of service (QOS).
The EMAC controls the flow of packet data from the C6421 device to the PHY. The MDIO module controls
PHY configuration and status monitoring.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the “Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer” specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviation from this standard, the EMAC module does not use the Transmit Coding Error signal MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame
will be detected as an error by the network.
Both the EMAC and the MDIO modules interface to the C6421 device through a custom interface that
allows efficient data transmission and reception. This custom interface is referred to as the EMAC control
module, and is considered integral to the EMAC/MDIO peripheral. The control module is also used to
multiplex and control interrupts.
For more details on the C6421 EMAC peripheral, see the TMS320C6421 Ethernet Media Access
Controller (EMAC)/Management Data Input/Output (MDIO) Module User's Guide (literature number
SPRUEM6). For a list of supported registers and register fields, see Table 6-53 [Ethernet MAC (EMAC)
Control Registers] and Table 6-54 [EMAC Statistics Registers] in this data manual.
6.15.1 EMAC Device-Specific Information
Interface Modes
The EMAC module on the TMS320C6421 supports two interface modes: Media Independent Interface
(MII) and Reduced Media Independent Interface (RMII). The MII interface mode is defined in the IEEE
802.3-2002 standard.
The RMII mode of the EMAC conforms to the RMII Specification (revision 1.2), as written by the RMII
Consortium. As the name implies, the Reduced Media Independent Interface (RMII) mode is a reduced
pin count version of the MII mode and only supports full-duplex mode.
Interface Mode Select
Although, the EMAC uses different pins for the MII and RMII modes, only one mode can be used at a time
because both modes share the same EMAC peripheral module. It is the user's responsibility to select only
one mode via the PINMUX1 register settings (specifically, the HOSTBK and RMII bit fields). For a detailed
description of pin functions, see Section 2.5, Terminal Functions.
Note: In addition, the EMAC must be placed in reset (via the Power and Sleep Controller [PSC]) before
programming the PINMUX0 and PINMUX1 registers to select the EMAC pins.
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Using the RMII Mode of the EMAC
The EMAC contains logic that allows it to communicate using the Reduced Media Independent Interface
(RMII) protocol. This logic must be taken out of reset before being used. To use the RMII mode of the
EMAC follow these guidelines:
• Supply a 50 MHz reference clock to the RMREFCLK input pin.
• The PINMUX1 register RMII bit field must be programmed to "1" to select the RMII pins and the RMII
mode of operation.
• MACCONTROL.RMIISPEED must be programmed to the desired operating speed for the RMII
interface.
• MACCONTROL.FULLDUPLEX must be programmed to "1", selecting full duplex mode for RMII.
6.15.2
EMAC Peripheral Register Description(s)
Table 6-53. Ethernet MAC (EMAC) Control Registers
192
HEX ADDRESS RANGE
ACRONYM
01C8 0000
TXIDVER
01C8 0004
TXCONTROL
01C8 0008
TXTEARDOWN
01C8 0010
RXIDVER
01C8 0014
RXCONTROL
REGISTER NAME
Transmit Identification and Version Register
Transmit Control Register
Transmit Teardown Register
Receive Identification and Version Register
Receive Control Register
01C8 0018
RXTEARDOWN
Receive Teardown Register
01C8 0080
TXINTSTATRAW
Transmit Interrupt Status (Unmasked) Register
01C8 0084
TXINTSTATMASKED
Transmit Interrupt Status (Masked) Register
01C8 0088
TXINTMASKSET
01C8 008C
TXINTMASKCLEAR
Transmit Interrupt Mask Set Register
01C8 0090
MACINVECTOR
MAC Input Vector Register
01C8 00A0
RXINTSTATRAW
Receive Interrupt Status (Unmasked) Register
01C8 00A4
RXINTSTATMASKED
01C8 00A8
RXINTMASKSET
01C8 00AC
RXINTMASKCLEAR
Receive Interrupt Mask Clear Register
01C8 00B0
MACINTSTATRAW
MAC Interrupt Status (Unmasked) Register
01C8 00B4
MACINTSTATMASKED
01C8 00B8
MACINTMASKSET
01C8 00BC
MACINTMASKCLEAR
01C8 0100
RXMBPENABLE
Receive Multicast/Broadcast/Promiscuous Channel Enable Register
01C8 0104
RXUNICASTSET
Receive Unicast Enable Set Register
01C8 0108
RXUNICASTCLEAR
Transmit Interrupt Mask Clear Register
Receive Interrupt Status (Masked) Register
Receive Interrupt Mask Set Register
MAC Interrupt Status (Masked) Register
MAC Interrupt Mask Set Register
MAC Interrupt Mask Clear Register
Receive Unicast Clear Register
01C8 010C
RXMAXLEN
01C8 0110
RXBUFFEROFFSET
01C8 0114
RXFILTERLOWTHRESH
Receive Filter Low Priority Frame Threshold Register
01C8 0120
RX0FLOWTHRESH
Receive Channel 0 Flow Control Threshold Register
01C8 0124
RX1FLOWTHRESH
Receive Channel 1 Flow Control Threshold Register
01C8 0128
RX2FLOWTHRESH
Receive Channel 2 Flow Control Threshold Register
01C8 012C
RX3FLOWTHRESH
Receive Channel 3 Flow Control Threshold Register
01C8 0130
RX4FLOWTHRESH
Receive Channel 4 Flow Control Threshold Register
01C8 0134
RX5FLOWTHRESH
Receive Channel 5 Flow Control Threshold Register
01C8 0138
RX6FLOWTHRESH
Receive Channel 6 Flow Control Threshold Register
01C8 013C
RX7FLOWTHRESH
Receive Channel 7 Flow Control Threshold Register
01C8 0140
RX0FREEBUFFER
Receive Channel 0 Free Buffer Count Register
Peripheral Information and Electrical Specifications
Receive Maximum Length Register
Receive Buffer Offset Register
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Table 6-53. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE
ACRONYM
01C8 0144
RX1FREEBUFFER
REGISTER NAME
Receive Channel 1 Free Buffer Count Register
01C8 0148
RX2FREEBUFFER
Receive Channel 2 Free Buffer Count Register
01C8 014C
RX3FREEBUFFER
Receive Channel 3 Free Buffer Count Register
01C8 0150
RX4FREEBUFFER
Receive Channel 4 Free Buffer Count Register
01C8 0154
RX5FREEBUFFER
Receive Channel 5 Free Buffer Count Register
01C8 0158
RX6FREEBUFFER
Receive Channel 6 Free Buffer Count Register
01C8 015C
RX7FREEBUFFER
Receive Channel 7 Free Buffer Count Register
01C8 0160
MACCONTROL
MAC Control Register
01C8 0164
MACSTATUS
MAC Status Register
Emulation Control Register
01C8 0168
EMCONTROL
01C8 016C
FIFOCONTROL
01C8 0170
MACCONFIG
MAC Configuration Register
Soft Reset Register
FIFO Control Register (Transmit and Receive)
01C8 0174
SOFTRESET
01C8 01D0
MACSRCADDRLO
MAC Source Address Low Bytes Register (Lower 32-bits)
01C8 01D4
MACSRCADDRHI
MAC Source Address High Bytes Register (Upper 16-bits)
01C8 01D8
MACHASH1
MAC Hash Address Register 1
01C8 01DC
MACHASH2
MAC Hash Address Register 2
01C8 01E0
BOFFTEST
Back Off Test Register
01C8 01E4
TPACETEST
Transmit Pacing Algorithm Test Register
01C8 01E8
RXPAUSE
Receive Pause Timer Register
01C8 01EC
TXPAUSE
Transmit Pause Timer Register
01C8 0200 - 01C8 02FC
(see Table 6-54)
01C8 0500
MACADDRLO
MAC Address Low Bytes Register
01C8 0504
MACADDRHI
MAC Address High Bytes Register
01C8 0508
MACINDEX
01C8 0600
TX0HDP
Transmit Channel 0 DMA Head Descriptor Pointer Register
01C8 0604
TX1HDP
Transmit Channel 1 DMA Head Descriptor Pointer Register
01C8 0608
TX2HDP
Transmit Channel 2 DMA Head Descriptor Pointer Register
01C8 060C
TX3HDP
Transmit Channel 3 DMA Head Descriptor Pointer Register
01C8 0610
TX4HDP
Transmit Channel 4 DMA Head Descriptor Pointer Register
01C8 0614
TX5HDP
Transmit Channel 5 DMA Head Descriptor Pointer Register
01C8 0618
TX6HDP
Transmit Channel 6 DMA Head Descriptor Pointer Register
01C8 061C
TX7HDP
Transmit Channel 7 DMA Head Descriptor Pointer Register
01C8 0620
RX0HDP
Receive Channel 0 DMA Head Descriptor Pointer Register
01C8 0624
RX1HDP
Receive Channel 1 DMA Head Descriptor Pointer Register
EMAC Statistics Registers
MAC Index Register
01C8 0628
RX2HDP
Receive Channel 2 DMA Head Descriptor Pointer Register
01C8 062C
RX3HDP
Receive Channel 3 DMA Head Descriptor Pointer Register
01C8 0630
RX4HDP
Receive Channel 4 DMA Head Descriptor Pointer Register
01C8 0634
RX5HDP
Receive Channel 5 DMA Head Descriptor Pointer Register
01C8 0638
RX6HDP
Receive Channel 6 DMA Head Descriptor Pointer Register
01C8 063C
RX7HDP
Receive Channel 7 DMA Head Descriptor Pointer Register
01C8 0640
TX0CP
Transmit Channel 0 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0644
TX1CP
Transmit Channel 1 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0648
TX2CP
Transmit Channel 2 Completion Pointer (Interrupt Acknowledge)
Register
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Table 6-53. Ethernet MAC (EMAC) Control Registers (continued)
194
HEX ADDRESS RANGE
ACRONYM
01C8 064C
TX3CP
Transmit Channel 3 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0650
TX4CP
Transmit Channel 4 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0654
TX5CP
Transmit Channel 5 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0658
TX6CP
Transmit Channel 6 Completion Pointer (Interrupt Acknowledge)
Register
01C8 065C
TX7CP
Transmit Channel 7 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0660
RX0CP
Receive Channel 0 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0664
RX1CP
Receive Channel 1 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0668
RX2CP
Receive Channel 2 Completion Pointer (Interrupt Acknowledge)
Register
01C8 066C
RX3CP
Receive Channel 3 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0670
RX4CP
Receive Channel 4 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0674
RX5CP
Receive Channel 5 Completion Pointer (Interrupt Acknowledge)
Register
01C8 0678
RX6CP
Receive Channel 6 Completion Pointer (Interrupt Acknowledge)
Register
01C8 067C
RX7CP
Receive Channel 7 Completion Pointer (Interrupt Acknowledge)
Register
Peripheral Information and Electrical Specifications
REGISTER NAME
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Table 6-54. EMAC Statistics Registers
HEX ADDRESS RANGE
ACRONYM
01C8 0200
RXGOODFRAMES
REGISTER NAME
Good Receive Frames Register
01C8 0204
RXBCASTFRAMES
Broadcast Receive Frames Register
(Total number of good broadcast frames received)
01C8 0208
RXMCASTFRAMES
Multicast Receive Frames Register
(Total number of good multicast frames received)
01C8 020C
RXPAUSEFRAMES
Pause Receive Frames Register
01C8 0210
RXCRCERRORS
01C8 0214
RXALIGNCODEERRORS
01C8 0218
RXOVERSIZED
01C8 021C
RXJABBER
01C8 0220
RXUNDERSIZED
Receive Undersized Frames Register
(Total number of undersized frames received)
01C8 0224
RXFRAGMENTS
Receive Frame Fragments Register
01C8 0228
RXFILTERED
01C8 022C
RXQOSFILTERED
01C8 0230
RXOCTETS
01C8 0234
TXGOODFRAMES
Good Transmit Frames Register
(Total number of good frames transmitted)
Receive CRC Errors Register (Total number of frames received with
CRC errors)
Receive Alignment/Code Errors Register
(Total number of frames received with alignment/code errors)
Receive Oversized Frames Register
(Total number of oversized frames received)
Receive Jabber Frames Register
(Total number of jabber frames received)
Filtered Receive Frames Register
Received QOS Filtered Frames Register
Receive Octet Frames Register
(Total number of received bytes in good frames)
01C8 0238
TXBCASTFRAMES
Broadcast Transmit Frames Register
01C8 023C
TXMCASTFRAMES
Multicast Transmit Frames Register
01C8 0240
TXPAUSEFRAMES
Pause Transmit Frames Register
01C8 0244
TXDEFERRED
Deferred Transmit Frames Register
01C8 0248
TXCOLLISION
Transmit Collision Frames Register
01C8 024C
TXSINGLECOLL
01C8 0250
TXMULTICOLL
01C8 0254
TXEXCESSIVECOLL
01C8 0258
TXLATECOLL
01C8 025C
TXUNDERRUN
01C8 0260
TXCARRIERSENSE
01C8 0264
TXOCTETS
01C8 0268
FRAME64
Transmit Single Collision Frames Register
Transmit Multiple Collision Frames Register
Transmit Excessive Collision Frames Register
Transmit Late Collision Frames Register
Transmit Underrun Error Register
Transmit Carrier Sense Errors Register
Transmit Octet Frames Register
Transmit and Receive 64 Octet Frames Register
01C8 026C
FRAME65T127
Transmit and Receive 65 to 127 Octet Frames Register
01C8 0270
FRAME128T255
Transmit and Receive 128 to 255 Octet Frames Register
01C8 0274
FRAME256T511
Transmit and Receive 256 to 511 Octet Frames Register
01C8 0278
FRAME512T1023
Transmit and Receive 512 to 1023 Octet Frames Register
01C8 027C
FRAME1024TUP
Transmit and Receive 1024 to 1518 Octet Frames Register
01C8 0280
NETOCTETS
01C8 0284
RXSOFOVERRUNS
Receive FIFO or DMA Start of Frame Overruns Register
01C8 0288
RXMOFOVERRUNS
Receive FIFO or DMA Middle of Frame Overruns Register
01C8 028C
RXDMAOVERRUNS
Receive DMA Start of Frame and Middle of Frame Overruns
Register
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Table 6-55. EMAC Control Module Registers
HEX ADDRESS RANGE
ACRONYM
0x01C8 1004
EWCTL
0x01C8 1008
EWINTTCNT
REGISTER NAME
Interrupt control register
Interrupt timer count
Table 6-56. EMAC Control Module RAM
HEX ADDRESS RANGE
ACRONYM
0x01C8 2000 - 0x01C8 3FFF
196
Peripheral Information and Electrical Specifications
REGISTER NAME
EMAC Control Module Descriptor Memory
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6.15.3
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EMAC Electrical Data/Timing (MII and RMII)
6.15.3.1 EMAC MII Electrical Data/Timing
Table 6-57. Timing Requirements for MRCLK - MII Operation (see Figure 6-34)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
(1)
10 Mbps
100 Mbps
MIN MAX
MIN MAX
UNIT
1
tc(MRCLK)
Cycle time, MRCLK
400
40
ns
2
tw(MRCLKH)
Pulse duration, MRCLK high
140
14
ns
3
tw(MRCLKL)
Pulse duration, MRCLK low
140
14
ns
(1)
There is a clock ratio requirement between the system infrastructure clock, SYSCLK3, and the EMAC receive/transmit input clocks,
MRCLK and MTCLK. For proper device operation, the SYSCLK3 frequency must be faster than 12.5 MHz.
1
2
3
MRCLK
Figure 6-34. MRCLK Timing (EMAC - Receive) [MII Operation]
Table 6-58. Timing Requirements for MTCLK - MII Operation (see Figure 6-34)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
10 Mbps
100 Mbps
MIN MAX
MIN MAX
UNIT
1
tc(MTCLK)
Cycle time, MTCLK (1)
400
40
ns
2
tw(MTCLKH)
Pulse duration, MTCLK high
140
14
ns
3
tw(MTCLKL)
Pulse duration, MTCLK low
140
14
ns
(1)
There is a clock ratio requirement between the system infrastructure clock, SYSCLK3, and the EMAC receive/transmit input clocks,
MRCLK and MTCLK. For proper device operation, the SYSCLK3 frequency must be faster than 12.5 MHz.
1
2
3
MTCLK
Figure 6-35. MTCLK Timing (EMAC - Transmit) [MII Operation]
Table 6-59. Timing Requirements for EMAC MII Receive 10/100 Mbit/s (1) (see Figure 6-36)
-7/-6/-5/-4
-L/-Q6/-Q5/Q4
NO.
MIN
(1)
UNIT
MAX
1
tsu(MRXD-MRCLKH)
Setup time, receive selected signals valid before MRCLK high
8
ns
2
th(MRCLKH-MRXD)
Hold time, receive selected signals valid after MRCLK high
8
ns
Receive selected signals include: MRXD3-MRXD0, MRXDV, and MRXER.
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1
2
MRCLK (Input)
MRXD3−MRXD0,
MRXDV, MRXER (Inputs)
Figure 6-36. EMAC Receive Interface Timing [MII Operation]
Table 6-60. Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit
10/100 Mbit/s (1) (see Figure 6-37)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
1
(1)
td(MTCLKH-MTXD)
MIN
MAX
2
25
Delay time, MTCLK high to transmit selected signals valid
UNIT
ns
Transmit selected signals include: MTXD3-MTXD0, and MTXEN.
1
MTCLK (Input)
MTXD3−MTXD0,
MTXEN (Outputs)
Figure 6-37. EMAC Transmit Interface Timing [MII Operation]
6.15.3.2 EMAC RMII Electrical Data/Timing
The RMREFCLK pin is used to source a clock to the EMAC when it is configured for RMII operation. The
RMREFCLK frequency should be 50 MHz ±50 PPM with a duty cycle between 35% and 65%, inclusive.
Table 6-61. Timing Requirements for RMREFCLK - RMII Operation (see Figure 6-38)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
(1)
UNIT
MAX
1
tc(RMREFCLK)
Cycle time, RMREFCLK (1)
2
tw(RMREFCLKH)
Pulse duration, RMREFCLK high
7
13
ns
3
tw(RMREFCLKL)
Pulse duration, RMREFCLK low
7
13
ns
4
tt(RMREFCLK)
Transition time, RMREFCLK
2
ns
20
ns
There is a clock ratio requirement between the system infrastructure clock, SYSCLK3, and the EMAC RMII reference clock,
RMREFCLK. For proper device operation, the SYSCLK3 frequency must be faster than 12.5 MHz.
1
2
4
RMREFCLK
(Input)
3
4
Figure 6-38. RMREFCLK Timing [RMII Operation]
198
Peripheral Information and Electrical Specifications
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Table 6-62. Timing Requirements for EMAC RMII Receive 10/100 Mbit/s (1) (see Figure 6-39)
-7/-6/-5/-4
-L/-Q6/-Q5/Q4
NO.
MIN
UNIT
MAX
1
tsu(RMRXD-REFCLKH)
Setup time, receive selected signals valid before RMREFCLK high
4
ns
2
th(REFCLKH-RMRXD)
Hold time, receive selected signals valid after RMREFCLK high
2
ns
(1)
Receive selected signals include: RMRXD1-RMRXD0, RMCRSDV, and RMRXER.
1
2
RMREFCLK
RMRXD1−RMRXD0,
RMCRSDV, RMRXER (Inputs)
Figure 6-39. EMAC Receive Interface Timing [RMII Operation]
Table 6-63. Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit
10/100 Mbit/s (1) (see Figure 6-40)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
1
(1)
td(REFCLKH-MTXD)
Delay time, RMREFCLK high to transmit selected signals valid
MIN
MAX
2.2
15.5
UNIT
ns
Transmit selected signals include: RMTXD1-RMTXD0, and RMTXEN.
1
RMREFCLK
RMTXD1−RMTXD0,
RMTXEN (Outputs)
Figure 6-40. EMAC Transmit Interface Timing [RMII Operation]
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6.16
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Management Data Input/Output (MDIO)
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system.
The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to
interrogate and control Ethernet PHY(s) using a shared two-wire bus. Host software uses the MDIO
module to configure the auto-negotiation parameters of each PHY attached to the EMAC, retrieve the
negotiation results, and configure required parameters in the EMAC module for correct operation. The
module is designed to allow almost transparent operation of the MDIO interface, with very little
maintenance from the core processor. Only one PHY may be connected at any given time.
For more detailed information on the MDIO peripheral, see the TMS320C642x Ethernet Media Access
Controller (EMAC)/Management Data Input/Output (MDIO) Module User's Guide (literature number
SPRUEM6). For a list of supported registers and register fields, see Table 6-64 [MDIO Registers] in this
data manual.
6.16.1
Peripheral Register Description(s)
Table 6-64. MDIO Registers
HEX ADDRESS RANGE
ACRONYM
0x01C8 4000
–
0x01C8 4004
CONTROL
REGISTER NAME
Reserved
MDIO Control Register
0x01C8 4008
ALIVE
MDIO PHY Alive Status Register
0x01C8 400C
LINK
MDIO PHY Link Status Register
0x01C8 4010
LINKINTRAW
0x01C8 4014
LINKINTMASKED
MDIO Link Status Change Interrupt (Unmasked) Register
MDIO Link Status Change Interrupt (Masked) Register
0x01C8 4018
–
0x01C8 4020
USERINTRAW
Reserved
0x01C8 4024
USERINTMASKED
MDIO User Command Complete Interrupt (Masked) Register
MDIO User Command Complete Interrupt Mask Set Register
MDIO User Command Complete Interrupt (Unmasked) Register
0x01C8 4028
USERINTMASKSET
0x01C8 402C
USERINTMASKCLEAR
0x01C8 4030 - 0x01C8 407C
–
0x01C8 4080
USERACCESS0
MDIO User Access Register 0
0x01C8 4084
USERPHYSEL0
MDIO User PHY Select Register 0
0x01C8 4088
USERACCESS1
MDIO User Access Register 1
0x01C8 408C
USERPHYSEL1
MDIO User PHY Select Register 1
0x01C8 4090 - 0x01C8 47FF
–
200
Peripheral Information and Electrical Specifications
MDIO User Command Complete Interrupt Mask Clear Register
Reserved
Reserved
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Management Data Input/Output (MDIO) Electrical Data/Timing
Table 6-65. Timing Requirements for MDIO Input (see Figure 6-41 and Figure 6-42)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
UNIT
MAX
1
tc(MDCLK)
Cycle time, MDCLK
400
2
tw(MDCLK)
Pulse duration, MDCLK high/low
180
ns
3
tt(MDCLK)
Transition time, MDCLK
4
tsu(MDIO-MDCLKH)
Setup time, MDIO data input valid before MDCLK high
10
ns
5
th(MDCLKH-MDIO)
Hold time, MDIO data input valid after MDCLK high
10
ns
ns
5
ns
1
3
3
MDCLK
4
5
MDIO
(input)
Figure 6-41. MDIO Input Timing
Table 6-66. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 6-42)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
7
td(MDCLKL-MDIO)
Delay time, MDCLK low to MDIO data output valid
UNIT
MAX
100
ns
1
MDCLK
7
MDIO
(output)
Figure 6-42. MDIO Output Timing
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6.17 Timers
The C6421 device has 3 64-bit general-purpose timers which have the following features:
• 64-bit count-up counter
• Timer modes:
– 64-bit general-purpose timer mode (Timer 0 and 1)
– Dual 32-bit general-purpose timer mode (Timer 0 and 1)
– Watchdog timer mode (Timer 2)
• 2 possible clock sources:
– Internal clock
– External clock input via timer input pin TINPL (Timer 0 and 1 only)
• 2 operation modes:
– One-time operation (timer runs for one period then stops)
– Continuous operation (timer automatically resets after each period)
• Generates interrupts to the DSP
• Generates sync event to EDMA
• Causes device global reset upon watchdog timer timeout (Timer 2 only)
For more detailed information, see the TMS320C642x DSP 64-Bit Timer User's Guide (literature number
SPRUEN5).
6.17.1
Timer Peripheral Register Description(s)
Table 6-67. Timer 0 Registers
HEX ADDRESS RANGE
ACRONYM
0x01C2 1400
-
DESCRIPTION
0x01C2 1404
EMUMGT_CLKSPD
0x01C2 1410
TIM12
Timer 0 Counter Register 12
0x01C2 1414
TIM34
Timer 0 Counter Register 34
Reserved
Timer 0 Emulation Management/Clock Speed Register
0x01C2 1418
PRD12
Timer 0 Period Register 12
0x01C2 141C
PRD34
Timer 0 Period Register 34
0x01C2 1420
TCR
0x01C2 1424
TGCR
0x01C2 1428 - 0x01C2 17FF
-
Timer 0 Control Register
Timer 0 Global Control Register
Reserved
Table 6-68. Timer 1 Registers
202
HEX ADDRESS RANGE
ACRONYM
0x01C2 1800
-
0x01C2 1804
EMUMGT_CLKSPD
0x01C2 1810
TIM12
Timer 1 Counter Register 12
0x01C2 1814
TIM34
Timer 1 Counter Register 34
0x01C2 1818
PRD12
Timer 1 Period Register 12
0x01C2 181C
PRD34
Timer 1 Period Register 34
0x01C2 1820
TCR
0x01C2 1824
TGCR
0x01C2 1828 - 0x01C2 1BFF
-
Peripheral Information and Electrical Specifications
DESCRIPTION
Reserved
Timer 1 Emulation Management/Clock Speed Register
Timer 1 Control Register
Timer 1 Global Control Register
Reserved
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Table 6-69. Timer 2 (Watchdog) Registers
HEX ADDRESS RANGE
ACRONYM
0x01C2 1C00
-
DESCRIPTION
0x01C2 1C04
EMUMGT_CLKSPD
0x01C2 1C10
TIM12
Timer 2 Counter Register 12
0x01C2 1C14
TIM34
Timer 2 Counter Register 34
Reserved
Timer 2 Emulation Management/Clock Speed Register
0x01C2 1C18
PRD12
Timer 2 Period Register 12
0x01C2 1C1C
PRD34
Timer 2 Period Register 34
0x01C2 1C20
TCR
0x01C2 1C24
TGCR
0x01C2 1C28
WDTCR
0x01C2 1C2C - 0x01C2 1FFF
-
6.17.2
Timer 2 Control Register
Timer 2 Global Control Register
Timer 2 Watchdog Timer Control Register
Reserved
Timer Electrical Data/Timing
Table 6-70. Timing Requirements for Timer Input (1) (2) (3) (see Figure 6-43)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
1
tw(TINPH)
2
tw(TINPL)
Pulse duration, TINPxL high
Pulse duration, TINPxL low
TINP0L, if TIMERCTL.TINP0SEL = 0
[default]
2P
ns
TINP0L, if TIMERCTL.TINP0SEL = 1
0.33P
ns
TINP1L
2P
ns
TINP0L, if TIMERCTL.TINP0SEL = 0
[default]
2P
ns
TINP0L, if TIMERCTL.TINP0SEL = 1
0.33P
ns
2P
ns
TINP1L
(1)
(2)
UNIT
MAX
P = MXI/CLKIN cycle time in ns. For example, when MXI/CLKIN frequency is 25 MHz, use P = 40 ns.
The TIMERCTL.TINP0SEL field in the System Module determines if the TINP0L input directly goes to Timer 0
(TIMERCTL.TINP0SEL=0), or if the TINP0L input is first divided down by 6 before going to Timer 0 (TIMERCTL.TINP0SEL=1).
TINP1L input goes directly to Timer 1.
(3)
Table 6-71. Switching Characteristics Over Recommended Operating Conditions for Timer Output (1) (see
Figure 6-43)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
(1)
UNIT
MAX
3
tw(TOUTH)
Pulse duration, TOUTxL high
P
ns
4
tw(TOUTL)
Pulse duration, TOUTxL low
P
ns
P = MXI/CLKIN cycle time in ns. For example, when MXI/CLKIN frequency is 25 MHz, use P = 40 ns.
1
2
TINPxL
3
4
TOUTxL
Figure 6-43. Timer Timing
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6.18 Pulse Width Modulator (PWM)
The 3 C6421 Pulse Width Modulator (PWM) peripherals support the following features:
• Period counter
• First-phase duration counter
• Repeat count for one-shot operation
• Configurable to operate in either one-shot or continuous mode
• Buffered period and first-phase duration registers
• One-shot operation triggerable by hardware events with programmable edge transitions. (low-to-high or
high-to-low).
• One-shot operation generates N+1 periods of waveform, N being the repeat count register value
• Emulation support
The register memory maps for PWM0/1/2 are shown in Table 6-72, Table 6-73, and Table 6-74.
Table 6-72. PWM0 Register Memory Map
HEX ADDRESS RANGE
ACRONYM
0x01C2 2000
REGISTER NAME
Reserved
0x01C2 2004
PCR
PWM0 Peripheral Control Register
0x01C2 2008
CFG
PWM0 Configuration Register
0x01C2 200C
START
PWM0 Start Register
0x01C2 2010
RPT
PWM0 Repeat Count Register
0x01C2 2014
PER
PWM0 Period Register
0x01C2 2018
PH1D
PWM0 First-Phase Duration Register
0x01C2 201C - 0x01C2 23FF
-
Reserved
Table 6-73. PWM1 Register Memory Map
HEX ADDRESS RANGE
ACRONYM
0x01C2 2400
REGISTER NAME
Reserved
0x01C2 2404
PCR
PWM1 Peripheral Control Register
0x01C2 2408
CFG
PWM1 Configuration Register
0x01C2 240C
START
PWM1 Start Register
0x01C2 2410
RPT
PWM1 Repeat Count Register
0x01C2 2414
PER
PWM1 Period Register
0x01C2 2418
PH1D
PWM1 First-Phase Duration Register
0x01C2 241C -0x01C2 27FF
-
Reserved
Table 6-74. PWM2 Register Memory Map
HEX ADDRESS RANGE
ACRONYM
0x01C2 2800
REGISTER NAME
Reserved
0x01C2 2804
PCR
PWM2 Peripheral Control Register
0x01C2 2808
CFG
PWM2 Configuration Register
0x01C2 280C
START
PWM2 Start Register
0x01C2 2810
RPT
PWM2 Repeat Count Register
0x01C2 2814
PER
PWM2 Period Register
0x01C2 2818
PH1D
PWM2 First-Phase Duration Register
0x01C2 281C - 0x01C2 2BFF
-
Reserved
204
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6.18.1 PWM0/1/2 Electrical Data/Timing
Table 6-75. Switching Characteristics Over Recommended Operating Conditions for PWM0/1/2 Outputs
(see Figure 6-44)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
UNIT
MAX
1
tw(PWMH)
Pulse duration, PWMx high
37
ns
2
tw(PWML)
Pulse duration, PWMx low
37
ns
3
tt(PWM)
Transition time, PWMx
5
ns
1
2
PWM0/1/2
3
3
Figure 6-44. PWM Output Timing
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6.19 VLYNQ
The C6421 VLYNQ peripheral provides a high speed serial communications interface with the following
features.
• Low Pin Count
• Scalable Performance / Support
• Simple Packet Based Transfer Protocol for Memory Mapped Access
– Write Request / Data Packet
– Read Request Packet
– Read Response Data Packet
– Interrupt Request Packet
• Supports both Symmetric and Asymmetric Operation
– Tx pins on first device connect to Rx pins on second device and vice versa
– Data pin widths are automatically detected after reset
– Request packets, response packets, and flow control information are all multiplexed and sent
across the same physical pins
– Supports both Host/Peripheral and Peer to Peer communication
• Simple Block Code Packet Formatting (8b/10b)
• In Band Flow Control
– No extra pins needed
– Allows receiver to momentarily throttle back transmitter when overflow is about to occur
– Uses built in special code capability of block code to seamlessly interleave flow control information
with user data
– Allows system designer to balance cost of data buffering versus performance
• Multiple outstanding transactions
• Automatic packet formatting optimizations
• Internal loop-back mode
6.19.1 VLYNQ Peripheral Register Description(s)
Table 6-76. VLYNQ Registers
206
HEX ADDRESS RANGE
ACRONYM
0x01E0 1000
-
REGISTER NAME
0x01E0 1004
CTRL
VLYNQ Local Control Register
0x01E0 1008
STAT
VLYNQ Local Status Register
Reserved
0x01E0 100C
INTPRI
0x01E0 1010
INTSTATCLR
VLYNQ Local Interrupt Priority Vector Status/Clear Register
VLYNQ Local Unmasked Interrupt Status/Clear Register
0x01E0 1014
INTPENDSET
VLYNQ Local Interrupt Pending/Set Register
0x01E0 1018
INTPTR
0x01E0 101C
XAM
0x01E0 1020
RAMS1
VLYNQ Local Receive Address Map Size 1 Register
0x01E0 1024
RAMO1
VLYNQ Local Receive Address Map Offset 1 Register
0x01E0 1028
RAMS2
VLYNQ Local Receive Address Map Size 2 Register
0x01E0 102C
RAMO2
VLYNQ Local Receive Address Map Offset 2 Register
0x01E0 1030
RAMS3
VLYNQ Local Receive Address Map Size 3 Register
0x01E0 1034
RAMO3
VLYNQ Local Receive Address Map Offset 3 Register
0x01E0 1038
RAMS4
VLYNQ Local Receive Address Map Size 4 Register
0x01E0 103C
RAMO4
VLYNQ Local Receive Address Map Offset 4 Register
Peripheral Information and Electrical Specifications
VLYNQ Local Interrupt Pointer Register
VLYNQ Local Transmit Address Map Register
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Table 6-76. VLYNQ Registers (continued)
HEX ADDRESS RANGE
ACRONYM
0x01E0 1040
CHIPVER
VLYNQ Local Chip Version Register
REGISTER NAME
0x01E0 1044
AUTNGO
VLYNQ Local Auto Negotiation Register
0x01E0 1048
-
Reserved
0x01E0 104C
-
Reserved
0x01E0 1050 - 0x01E0 105C
-
Reserved
0x01E0 1060
-
Reserved
01E0 10C00 0064
-
Reserved
0x01E0 1068 - 0x01E0 107C
-
Reserved for future use
0x01E0 1080
RREVID
VLYNQ Remote Revision Register
0x01E0 1084
RCTRL
VLYNQ Remote Control Register
0x01E0 1088
RSTAT
VLYNQ Remote Status Register
0x01E0 108C
RINTPRI
VLYNQ Remote Interrupt Priority Vector Status/Clear Register
0x01E0 1090
RINTSTATCLR
VLYNQ Remote Unmasked Interrupt Status/Clear Register
0x01E0 1094
RINTPENDSET
VLYNQ Remote Interrupt Pending/Set Register
0x01E0 1098
RINTPTR
VLYNQ Remote Interrupt Pointer Register
0x01E0 109C
RXAM
0x01E0 10A0
RRAMS1
VLYNQ Remote Transmit Address Map Register
VLYNQ Remote Receive Address Map Size 1 Register
0x01E0 10A4
RRAMO1
VLYNQ Remote Receive Address Map Offset 1 Register
0x01E0 10A8
RRAMS2
VLYNQ Remote Receive Address Map Size 2 Register
0x01E0 10AC
RRAMO2
VLYNQ Remote Receive Address Map Offset 2 Register
0x01E0 10B0
RRAMS3
VLYNQ Remote Receive Address Map Size 3 Register
0x01E0 10B4
RRAMO3
VLYNQ Remote Receive Address Map Offset 3 Register
0x01E0 10B8
RRAMS4
VLYNQ Remote Receive Address Map Size 4 Register
0x01E0 10BC
RRAMO4
VLYNQ Remote Receive Address Map Offset 4 Register
0x01E0 10C0
RCHIPVER
VLYNQ Remote Chip Version Register (values on the device_id and
device_rev pins of remote VLYNQ)
0x01E0 10C4
RAUTNGO
VLYNQ Remote Auto Negotiation Register
0x01E0 10C8
RMANNGO
VLYNQ Remote Manual Negotiation Register
0x01E0 10CC
RNGOSTAT
VLYNQ Remote Negotiation Status Register
0x01E0 10D0 - 0x01E0 10DC
-
0x01E0 10E0
RINTVEC0
VLYNQ Remote Interrupt Vectors 3 - 0 (sourced from vlynq_int_i[3:0] port of
remote VLYNQ)
0x01E0 10E4
RINTVEC1
VLYNQ Remote Interrupt Vectors 7 - 4 (sourced from vlynq_int_i[7:4] port of
remote VLYNQ)
0x01E0 10E8 - 0x01E0 10FC
-
Reserved for future use
0x01E0 1100 - 0x01E0 1FFF
-
Reserved
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6.19.2 VLYNQ Electrical Data/Timing
Table 6-77. Timing Requirements for VLYNQ_CLK Input (see Figure 6-45)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
UNIT
MAX
1
tc(VCLK)
Cycle time, VLYNQ_CLK
10
ns
2
tw(VCLKH)
Pulse duration, VLYNQ_CLK high
3
ns
3
tw(VCLKL)
Pulse duration, VLYNQ_CLK low
3
ns
Table 6-78. Switching Characteristics Over Recommended Operating Conditions for VLYNQ_CLK Output
(see Figure 6-45)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
UNIT
MAX
1
tc(VCLK)
Cycle time, VLYNQ_CLK
10
ns
2
tw(VCLKH)
Pulse duration, VLYNQ_CLK high
4
ns
3
tw(VCLKL)
Pulse duration, VLYNQ_CLK low
4
ns
1
2
VLYNQ_CLK
3
Figure 6-45. VLYNQ_CLK Timing for VLYNQ
Table 6-79. Switching Characteristics Over Recommended Operating Conditions for Transmit Data for the
VLYNQ Module (see Figure 6-46)
NO.
PARAMETER
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
MIN
1
td(VCLKH-
Delay time, VLYNQ_CLK high to VLYNQ_TXD[3:0] invalid
UNIT
MAX
2.25
ns
TXDI)
2
td(VCLKH-
Delay time, VLYNQ_CLK high to VLYNQ_TXD[3:0] valid
12
ns
TXDV)
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Table 6-80. Timing Requirements for Receive Data for the VLYNQ Module (1) (see Figure 6-46)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
3
4
(1)
tsu(RXDV-VCLKH)
th(VCLKH-RXDV)
UNIT
MAX
Setup time, VLYNQ_RXD[3:0] valid before RTM disabled, RTM sample = 3
VLYNQ_CLK high
RTM enabled
1.75
ns
(1)
ns
RTM disabled, RTM sample = 3
3
ns
(1)
ns
Hold time, VLYNQ_RXD[3:0] valid after
VLYNQ_CLK high
RTM enabled
The VLYNQ receive timing manager (RTM) is a serial receive logic designed to eliminate setup and hold violations that could occur in
traditional input signals. RTM logic automatically selects the setup and hold timing from one of eight data flops (see Table 6-81). When
RTM logic is disabled, the setup and hold timing from the default data flop (3) is used.
Table 6-81. RTM RX Data Flop Hold/Setup Timing
Constraints (Typical Values)
RX Data Flop
HOLD (Y)
SETUP (X)
0
1.3
0.9
1
1.4
0.7
2
1.5
-0.4
3
1.6
-0.6
4
1.8
-0.8
5
2.0
-1.0
6
2.2
-1.1
7
2.4
-1.2
1
VLYNQ_CLK
2
Data
VLYNQ_TXD[3:0]
4
3
VLYNQ_RXD[3:0]
Data
Figure 6-46. VLYNQ Transmit/Receive Timing
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6.20 General-Purpose Input/Output (GPIO)
The GPIO peripheral provides general-purpose pins that can be configured as either inputs or outputs.
When configured as an output, a write to an internal register can control the state driven on the output pin.
When configured as an input, the state of the input is detectable by reading the state of an internal
register. In addition, the GPIO peripheral can produce CPU interrupts and EDMA events in different
interrupt/event generation modes. The GPIO peripheral provides generic connections to external devices.
The GPIO pins are grouped into banks of 16 pins per bank (i.e., bank 0 consists of GP[0:15]).
The C6421 GPIO peripheral supports the following:
• Up to 111 3.3-V GPIO pins, GP[0:110]
• Interrupts:
– Up to 8 unique GP[0:7] interrupts from Bank 0
– 7 GPIO bank (aggregated) interrupt signals from each of the 7 banks of GPIOs
– Interrupts can be triggered by rising and/or falling edge, specified for each interrupt capable GPIO
signal
• DMA events:
– Up to 8 unique GPIO DMA events from Bank 0
– 7 GPIO bank (aggregated) DMA event signals from each of the 7 banks of GPIOs
• Set/clear functionality: Firmware writes 1 to corresponding bit position(s) to set or to clear GPIO
signal(s). This allows multiple firmware processes to toggle GPIO output signals without critical section
protection (disable interrupts, program GPIO, re-enable interrupts, to prevent context switching to
anther process during GPIO programming).
• Separate Input/Output registers
• Output register in addition to set/clear so that, if preferred by firmware, some GPIO output signals can
be toggled by direct write to the output register(s).
• Output register, when read, reflects output drive status. This, in addition to the input register reflecting
pin status and open-drain I/O cell, allows wired logic be implemented.
The memory map for the GPIO registers is shown in Table 6-82. For more detailed information on GPIOs,
see the TMS320C642x DSP General-Purpose Input/Output (GPIO) User's Guide (literature number
SPRUEM8).
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GPIO Peripheral Register Description(s)
Table 6-82. GPIO Registers
HEX ADDRESS RANGE
ACRONYM
0x01C6 7000
PID
0x01C6 7004
-
0x01C6 7008
BINTEN
REGISTER NAME
Peripheral Identification Register
Reserved
GPIO interrupt per-bank enable
GPIO Banks 0 and 1
0x01C6 700C
-
0x01C6 7010
DIR01
Reserved
0x01C6 7014
OUT_DATA01
GPIO Banks 0 and 1 Output Data Register (GP[0:31])
0x01C6 7018
SET_DATA01
GPIO Banks 0 and 1 Set Data Register (GP[0:31])
0x01C6 701C
CLR_DATA01
GPIO Banks 0 and 1 Clear data for banks 0 and 1 (GP[0:31])
GPIO Banks 0 and 1 Direction Register (GP[0:31])
0x01C6 7020
IN_DATA01
0x01C6 7024
SET_RIS_TRIG01
GPIO Banks 0 and 1 Input Data Register (GP[0:31])
GPIO Banks 0 and 1 Set Rising Edge Interrupt Register (GP[0:31])
0x01C6 7028
CLR_RIS_TRIG01
GPIO Banks 0 and 1 Clear Rising Edge Interrupt Register (GP[0:31])
0x01C6 702C
SET_FAL_TRIG01
GPIO Banks 0 and 1 Set Falling Edge Interrupt Register (GP[0:31])
0x01C6 7030
CLR_FAL_TRIG01
GPIO Banks 0 and 1 Clear Falling Edge Interrupt Register (GP[0:31])
0x01C6 7034
INSTAT01
GPIO Banks 0 and 1 Interrupt Status Register (GP[0:31])
GPIO Banks 2 and 3
0x01C6 7038
DIR23
0x01C6 703C
OUT_DATA23
GPIO Banks 2 and 3 Direction Register (GP[32:63])
GPIO Banks 2 and 3 Output Data Register (GP[32:63])
0x01C6 7040
SET_DATA23
GPIO Banks 2 and 3 Set Data Register (GP[32:63])
0x01C6 7044
CLR_DATA23
GPIO Banks 2 and 3 Clear Data Register (GP[32:63])
0x01C6 7048
IN_DATA23
GPIO Banks 2 and 3 Input Data Register (GP[32:63])
0x01C6 704C
SET_RIS_TRIG23
GPIO Banks 2 and 3 Set Rising Edge Interrupt Register (GP[32:63])
0x01C6 7050
CLR_RIS_TRIG23
GPIO Banks 2 and 3 Clear Rising Edge Interrupt Register (GP[32:63])
0x01C6 7054
SET_FAL_TRIG23
GPIO Banks 2 and 3 Set Falling Edge Interrupt Register (GP[32:63])
0x01C6 7058
CLR_FAL_TRIG23
GPIO Banks 2 and 3 Clear Falling Edge Interrupt Register (GP[32:63])
0x01C6 705C
INSTAT23
0x01C6 7060
DIR45
0x01C6 7064
OUT_DATA45
GPIO Bank 4 and 5 Output Data Register (GP[64:95])
GPIO Banks 2 and 3 Interrupt Status Register (GP[32:63])
GPIO Bank 4 and 5
GPIO Bank 4 and 5 Direction Register (GP[64:95])
0x01C6 7068
SET_DATA45
GPIO Bank 4 and 5 Set Data Register (GP[64:95])
0x01C6 706C
CLR_DATA45
GPIO Bank 4 and 5 Clear Data Register (GP[64:95])
0x01C6 7070
IN_DATA45
GPIO Bank 4 and 5 Input Data Register (GP[64:95])
0x01C6 7074
SET_RIS_TRIG45
GPIO Bank 4 and 5 Set Rising Edge Interrupt Register (GP[64:95])
0x01C6 7078
CLR_RIS_TRIG45
GPIO Bank 4 and 5 Clear Rising Edge Interrupt Register (GP[64:95])
0x01C6 707C
SET_FAL_TRIG45
GPIO Bank 4 and 5 Set Falling Edge Interrupt Register (GP[64:95])
0x01C6 7080
CLR_FAL_TRIG45
GPIO Bank 4 and 5 Clear Falling Edge Interrupt Register (GP[64:95])
0x01C6 7084
INSTAT45
0x01C6 7088
DIR6
0x01C6 708C
OUT_DATA6
GPIO Bank 6 Output Data Register (GP[96:110])
0x01C6 7090
SET_DATA6
GPIO Bank 6 Set Data Register (GP[96:110])
0x01C6 7094
CLR_DATA6
GPIO Bank 6 Clear Data Register (GP[96:110])
GPIO Bank 6 Input Data Register (GP[96:110])
GPIO Bank 4 and 5 Interrupt Status Register (GP[64:95])
GPIO Bank 6
GPIO Bank 6 Direction Register (GP[96:110])
0x01C6 7098
IN_DATA6
0x01C6 709C
SET_RIS_TRIG6
GPIO Bank 6 Set Rising Edge Interrupt Register (GP[96:110])
0x01C6 70A0
CLR_RIS_TRIG6
GPIO Bank 6 Clear Rising Edge Interrupt Register (GP[96:110])
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Table 6-82. GPIO Registers (continued)
212
HEX ADDRESS RANGE
ACRONYM
0x01C6 70A4
SET_FAL_TRIG6
GPIO Bank 6 Set Falling Edge Interrupt Register (GP[96:110])
0x01C6 70A8
CLR_FAL_TRIG6
GPIO Bank 6 Clear Falling Edge Interrupt Register (GP[96:110])
0x01C6 70AC
INSTAT6
0x01C6 70B0 - 0x01C6 7FFF
-
Peripheral Information and Electrical Specifications
REGISTER NAME
GPIO Bank 6 Interrupt Status Register (GP[96:110])
Reserved
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GPIO Peripheral Input/Output Electrical Data/Timing
Table 6-83. Timing Requirements for GPIO Inputs (1) (see Figure 6-47)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
(1)
(2)
UNIT
MAX
1
tw(GPIH)
Pulse duration, GP[x] input high
2C (2)
ns
2
tw(GPIL)
Pulse duration, GP[x] input low
2C (2)
ns
The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have C6421 recognize
the GP[x] input changes through software polling of the GPIO register, the GP[x] input duration must be extended to allow C6421
enough time to access the GPIO register through the internal bus.
C = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use C = 10ns.
Table 6-84. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs
(see Figure 6-47)
NO.
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
MIN
(1)
(2)
UNIT
MAX
3
tw(GPOH)
Pulse duration, GP[x] output high
2C (1) (2)
ns
4
tw(GPOL)
Pulse duration, GP[x] output low
2C (1) (2)
ns
This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity.
C = SYSCLK3 period in ns. For example, when running parts at 600 MHz, use C = 10ns.
2
GP[x]
Input
1
4
GP[x]
Output
3
Figure 6-47. GPIO Port Timing
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6.21 IEEE 1149.1 JTAG
The JTAG (3) interface is used for BSDL testing and emulation of the C6421 device.
TRST only needs to be released when it is necessary to use a JTAG controller to debug the device or
exercise the device's boundary scan functionality. Note: TRST is synchronous and must be clocked by
TCK; otherwise, the boundary scan logic may not respond as expected after TRST is asserted.
For maximum reliability, C6421 includes an internal pulldown (IPD) on the TRST pin to ensure that TRST
will always be asserted upon power up and the device's internal emulation logic will always be properly
initialized.
JTAG controllers from Texas Instruments actively drive TRST high. However, some third-party JTAG
controllers may not drive TRST high but expect the use of a pullup resistor on TRST.
When using this type of JTAG controller, assert TRST to initialize the device after powerup and externally
drive TRST high before attempting any emulation or boundary scan operations.
6.21.1
(3)
JTAG ID (JTAGID) Register Description(s)
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
Table 6-85. JTAG ID Register
HEX ADDRESS RANGE
0x01C4 0028
ACRONYM
JTAGID
REGISTER NAME
COMMENTS
JTAG Identification Register
Read-only. Provides 32-bit
JTAG ID of the device.
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
C6421 device, the JTAG ID register resides at address location 0x01C4 0028. For the actual register bit
names and their associated bit field descriptions, see Figure 6-48 and Table 6-86.
31-28
27-12
11-1
0
VARIANT (4-Bit)
PART NUMBER (16-Bit)
MANUFACTURER (11-Bit)
LSB
R-n
R-1011 0111 0010 0001
R-0000 0010 111
R-1
LEGEND: R = Read, W = Write, n = value at reset
Figure 6-48. JTAG ID (JTAGID) Register—0x01C4 0028
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Table 6-86. JTAG ID Register Selection Bit Descriptions
BIT
NAME
31:28
VARIANT
Variant (4-Bit) value. A read from this field always returns 0b0000.
DESCRIPTION
27:12
PART NUMBER
Part Number (16-Bit) value. C6421 value: 1011 0111 0010 0001.
11-1
MANUFACTURER
0
LSB
Manufacturer (11-Bit) value. C6421 value: 0000 0010 111.
LSB. This bit is read as a "1" for C6421.
6.21.2 JTAG Electrical Data/Timing
Table 6-87. Timing Requirements for JTAG Test Port (see Figure 6-49)
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
NO.
MIN
UNIT
MAX
1
tc(TCK)
Cycle time, TCK
33
ns
3
tsu(TDIV-TCKH)
Setup time, TDI/TMS/TRST valid before TCK high
2.5
ns
4
th(TCKH-TDIV)
Hold time, TDI/TMS/TRST valid after TCK high
16.5
ns
Table 6-88. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 6-49)
NO.
2
-7/-6/-5/-4
-L/-Q6/-Q5/-Q4
PARAMETER
td(TCKL-TDOV)
Delay time, TCK low to TDO valid
UNIT
MIN
MAX
0
14
ns
1
TCK
2
2
TDO
4
3
TDI/TMS/TRST
Figure 6-49. JTAG Test-Port Timing
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7 Mechanical Data
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT and ZDU
mechanical package(s). For more details, see the Thermal Considerations for TMS320DM64xx,
TMS320DM64x, and TMS320C6000 Devices Application Report (literature number SPRAAL9).
7.1 Thermal Data for ZWT
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
Junction-to-case
5.4
RΘJB
Junction-to-board
16.0
N/A
26.6
0.00
21.9
1.0
5
20.4
2.00
7
0.0
0.00
8
RΘJA
PsiJT
Junction-to-free air
Junction-to-package top
9
11
12
PsiJB
Junction-to-board
13
216
N/A
RΘJC
2
4
(2)
AIR FLOW (m/s) (2)
1
3
(1)
°C/W (1)
0.1
1.0
0.2
2.00
15.9
0.00
15.8
1.0
15.3
2.00
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
• EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
.
m/s = meters per second
Mechanical Data
Submit Documentation Feedback
TMS320C6421
Fixed-Point Digital Signal Processor
www.ti.com
SPRS346D – JANUARY 2007 – REVISED JUNE 2008
7.1.1 Thermal Data for ZDU
Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]
NO.
RΘJC
Junction-to-case
7.7
N/A
2
RΘJB
Junction-to-board
10.5
N/A
19.7
0.00
RΘJA
Junction-to-free air
4
15.5
1.0
5
14.3
2.00
7
4.9
0.00
8
5.1
1.0
9
5.2
2.00
11
10.4
0.00
12
PsiJT
PsiJB
Junction-to-package top
Junction-to-board
13
(2)
AIR FLOW (m/s) (2)
1
3
(1)
°C/W (1)
9.8
1.0
9.6
2.00
The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC
defined 1S2P system and will change based on environment as well as application.
For more information, see these three EIA/JEDEC standards:
• EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
• EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
m/s = meters per second
7.1.2 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
Submit Documentation Feedback
Mechanical Data
217
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2023
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
Samples
(4/5)
(6)
TMS320C6421ZDU4
ACTIVE
BGA
ZDU
376
60
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
L2
C6421ZDU
TMS320
4
TMS320C6421ZDU7
ACTIVE
BGA
ZDU
376
60
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
L2
C6421ZDU
TMS320
7
TMS320C6421ZDUL
ACTIVE
BGA
ZDU
376
60
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
C6421ZDUL
TMS320C6421ZDUQ5
ACTIVE
BGA
ZDU
376
60
RoHS & Green
SNAGCU
Level-3-260C-168 HR
TMS320C6421ZWT4
ACTIVE
NFBGA
ZWT
361
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
L2
C6421ZWT
TMS320
4
TMS320C6421ZWT5
ACTIVE
NFBGA
ZWT
361
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
L2
C6421ZWT
TMS320
5
TMS320C6421ZWT6
ACTIVE
NFBGA
ZWT
361
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
0 to 90
L2
C6421ZWT
TMS320
TMS320C6421ZWTQ5
ACTIVE
NFBGA
ZWT
361
90
RoHS & Green
SNAGCU
Level-3-260C-168 HR
TNETV6421INZDU4
ACTIVE
BGA
ZDU
376
60
RoHS & Green
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
L1
C6421ZDUQ
TMS320
L1
C6421ZWTQ
TMS320
5
0 to 90
L2
C6421ZDU
TMS320
4
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2023
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
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