TPA2032D1
TPA2033D1
TPA2034D1
www.ti.com
SLOS476 – JUNE 2006
2.75-W FIXED GAIN MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
• Wafer Chip Scale Packaging (WCSP)
– NanoFree™ Lead-Free (Pb-Free: YZF)
FEATURES
•
•
•
•
•
Maximize Battery Life and Minimize Heat
– 0.5-µA Shutdown Current
– 3.0-mA Quiescent Current
– High Efficiency Class-D
• 88% at 400mW at 8Ω
• 80% at 100mW at 8Ω
Three Fixed Gain Versions
– TPA2032D1 has a gain of 2 V/V (6dB)
– TPA2033D1 has a gain of 3 V/V (9.5dB)
– TPA2034D1 has a gain of 4 V/V (12dB)
Only One External Component Required
– Internal Matched Input Gain and Feedback
Resistors for Excellent PSRR and CMRR
– Optimized PWM Output Stage Eliminates
LC Output Filter
– PSRR (–75 dB) and Wide Supply Voltage
(2.5 V to 5.5 V) Eliminates Need for a
Dedicated Voltage Regulator
– Fully Differential Design Reduces RF
Rectification and Eliminates Bypass
Capacitor
– CMRR (–69 dB)Eliminates Two Input
Coupling Capacitors
Thermal and Short-Circuit Protection
Pinout Very Similar to TPA2010D1
APPLICATIONS
•
Ideal for Wireless Handsets, PDAs, and other
mobile devices
DESCRIPTION
The TPA2032D1 (2V/V gain), TPA2033D1 (3V/V
gain), and TPA2034D1 (4V/V gain) are 2.75-W high
efficiency filter-free class-D audio power amplifiers,
each in an approximately 1.5-mm × 1.5-mm wafer
chip scale package (WCSP) that requires only one
external component. The pinout is the same as the
TPA2010D1 except that the external gain setting
input resistors required by the TPA2010D1 are
integrated into the fixed gain TPA203xD1 family.
Features like –75dB PSRR and improved
RF-rectification immunity with a very small PCB
footprint (WCSP amplifier plus single decoupling
cap) make the TPA203xD1 family ideal for wireless
handsets. A fast start-up time of 3.2 ms with minimal
pop makes the TPA203xD1 family ideal for PDA
applications.
In wireless handsets, the earpiece, speaker phone,
and melody ringer can each be driven by a
TPA203xD1. The TPA203xD1 family has a low
27-µV noise floor, A-weighted.
APPLICATION CIRCUIT
VDD
IN−
_
Differential
Input
PWM
203xD1
CS
~ 2,5 mm
VO−
H−
Bridge
9-BALL WAFER CHIP SCALE, YZF PACKAGE,
(TOP VIEW OF PCB)
VO+
+
IN+
GND
SHUTDOWN
~1,7 mm
TPA
To Battery
Internal
Oscillator
0402
CS
Bias
Circuitry
TPA2032D1
1,4 mm
1,55 mm
IN+
GND
A1
A2
VDD
PV DD
B1
B2
VO−
A3
PGND
B3
IN− SHUTDWN VO+
C1
C2
C3
1,4 mm
1,55 mm
Note: Pin A1 is marked with a “0” .
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TPA2032D1
TPA2033D1
TPA2034D1
www.ti.com
SLOS476 – JUNE 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TA
PACKAGE
–40°C to 85°C
Wafer chip scale packaging – Lead free (YZF)
TPA2032D1YZF
(1)
BPX
–40°C to 85°C
Wafer chip scale packaging – Lead free (YZF)
TPA2033D1YZF
(1)
BPY
TPA2034D1YZF
(1)
BPZ
–40°C to 85°C
(1)
PART NUMBER
Wafer chip scale packaging – Lead free (YZF)
SYMBOL
The YZF package is only available taped and reeled. To order add the suffix R to the end of the part number for a reel of 3000, or add
the suffix T to the end of the part number for a reel of 250 (e.g. TPA2032D1YZFR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted (1)
TPA2032D1, TPA2033D1,
TPA2034D1
VDD
Supply voltage
VI
Input voltage
In active mode
–0.3 V to 6 V
In SHUTDOWN mode
–0.3 V to 7 V
–0.3 V to VDD + 0.3 V
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature
–40°C to 85°C
TJ
Operating junction temperature
–40°C to 125°C
Tstg
Storage temperature
ESD
(1)
–65°C to 150°C
Electro-Static Discharge Tolerance - Human Body Model (HBM) for all
pins (2)
2KV
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The output pins Vo– and Vo+ are tolerant to 1.5KV HBM ESD
(2)
RECOMMENDED OPERATING CONDITIONS
MIN
VDD
Supply voltage
2.5
VIH
High-level input voltage
SHUTDOWN
VIL
Low-level input voltage
SHUTDOWN
VIC
TA
NOM
MAX
UNIT
5.5
V
1.3
VDD
V
0
0.35
V
Common mode input voltage range VDD = 2.5 V, 5.5 V
0.5
VDD–0.8
V
Operating free-air temperature
–40
85
°C
PACKAGE DISSIPATION RATINGS
(1)
(2)
2
PACKAGE
DERATING FACTOR
(1 / θJA)
TA ≤ 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
YZF
4.8 mW/°C (1)
480 mW
264 mW
192 mW
YZF
7.5 mW/°C (2)
750 mW
412 mW
300 mW
Derating factor measured with JEDEC Low-K board; 1S0P - One signal layer and zero plane layers.
Derating factor measured with JEDEC High K board; 1S2P - One signal layer and two plane layers.
Please see JEDEC Standard 51-3 for Low-K board, JEDEC Standard 51-7 for High-K board, and JEDEC Standard 51-12 for using
package thermal information.
Please see JEDEC document page for downloadable copies: http://www.jedec.org/download/default.cfm.
Submit Documentation Feedback
TPA2032D1
TPA2033D1
TPA2034D1
www.ti.com
SLOS476 – JUNE 2006
ELECTRICAL CHARACTERISTICS
TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
|VOS|
Output offset voltage
(measured differentially)
Inputs AC grounded, VDD = 2.5 V to 5.5 V
PSRR
Power supply rejection ratio
VDD = 2.5 V to 5.5 V
MIN
TYP MAX
TPA2032D1
5
25
TPA2033D1
5
25
TPA2034D1
CMRR
Common mode rejection ratio
VIC = 0.5 V to (VDD –0.8 V)
|IIH|
High-level input current
VDD = 5.5 V, VI = 5.8 V
|IIL|
Low-level input current
VDD = 5.5 V, VI = –0.3 V
5
25
–75
-61
VDD = 2.5 V
–69
-52
VDD = 3.6 V
– 69
-52
VDD = 5.5 V
–69
-52
VDD = 5.5 V, no load
I(Q)
I(SD)
rDS(on)
f(sw)
Quiescent current
Shutdown current
Static drain-source on-state
resistance
RPD
5
µA
3
3.7
V(SHUTDOWN)= 0.35 V, VDD = 2.5 V to 5.5 V
0.5
0.8
VDD = 2.5 V
550
VDD = 3.6 V
420
VDD = 5.0 V
350
VDD = 2.5 V to 5.5 V
mA
VDD = 2.5 V to 5.5 V
300
kΩ
400
TPA2032D1
5.5
6
6.5
TPA2033D1
9.0
9.5
10.0
TPA2034D1
11.5
12
12.5
Resistance of internal pulldown
resistor from shutdown pin to
GND
µA
mΩ
2
240
dB
5.7
2.2
Switching frequency
dB
µA
VDD = 2.5 V, no load
V(SHUTDOWN)
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